MCP16415-I/UN_技术文档

MCP1641X

Low I Boost Converter with Programmable Low Battery, UVLO and

Q

Automatic Input-to-Output Bypass Operation

Features

Description

• Input Voltage Range: 0.8V (after Start-up) 

to 5.25V

The MCP1641X Step-up DC-DC Converters family

provides an automatic input-to-output voltage bypass

operation, which helps optimize battery utilization and

achieve high efficiency, while the nominal voltage of

fresh batteries remains in the same range with the con-

verter’s output value. The MCP1641X can be powered

by either single-cell, two-cell alkaline/NiMH batteries or

single-cell Li-Ion/Li-Polymer batteries.

• Low Device Quiescent Current: 5 µA (typical),

PFM Mode (not switching)

• Up to 96% Efficiency

• 1A Typical Inductor Peak Current Limit:

- I_OUT> 170 mA at 2V V_OUT, 1.2V V_IN

- I_OUT> 200 mA at 3.3V V_OUT, 1.5V V_IN

- I_OUT> 600 mA at 5.0V V_OUT, 3.6V V_IN

• Adjustable Output Voltage Range

• Automatic Input-to-Output Bypass Operation

• Selectable Switching Mode:

A

low-voltage designed architecture allows the

regulator to start up without high inrush current or

output voltage overshoot from a low input voltage. The

start-up voltage is easily programmed by a resistive

divider connected to the UVLO pin. If the resistive

divider is not used, the default start-up voltage is 0.85V.

The 0.8V built-in UVLO_STOPhelps prevent deep dis-

charge of the alkaline battery, which can cause battery

leakage. An open-drain Low Battery Output (LBO) pin

warns the user to replace the battery if the input voltage

ramps down to the programmed UVLO_STARTvalue.

- PWM operation: 500 kHz (MCP16412/4/6/8)

- Automatic PFM/PWM operation

(MCP16411/3/5/7)

• Programmable Undervoltage Lockout (UVLO)

• Programmable Low Battery Output (LBO)

• Selectable Status Indicator:

The MCP1641X family introduces an additional safety

- Power Good and Die Overtemperature 

feature to a low-voltage boost converter: Over-

output (MCP16411/2/3/4)

temperature Output. Devices, such as personal care

products, Bluetooth headsets or toys, will benefit from

the combined Power Good and Die Overtemperature

(PGT) output, which flags a warning signal when the out-

- Power Good output (MCP16415/6/7/8)

• Internal Synchronous Rectifier

• Internal Compensation

put voltage level drops within 10% or the die temperature

(1)

• Inrush Current Limiting and Internal Soft Start

• Low Noise, Anti-Ringing Control

• Thermal Shutdown

exceeds the +75°C (typical).

Both functions are

implemented in the MCP16411/2/3/4 devices (on the

same pin, PGT), while the MCP16415/6/7/8 devices

have only the Power Good option.

• Selectable Shutdown States:

- Output discharge option (MCP16411/2/5/6)

Note 1: Factory programmable from +55C to

+85C, at +10C increments, by customer

request.

- Input-to-output bypass option

(MCP16413/4/7/8)

• Shutdown Current: 2.3 µA (typical)

• Available Packages:

Package Types

MCP1641X

10-Lead MSOP

MCP1641X

3x3 TDFN*

- 10-Lead MSOP

- 10-Lead 3 mm x 3 mm TDFN

EN

1

2

3

4

5

10

9

UVLO

LBO

1

2

3

4

5

10

9

EN

V_IN

LBO

PGT**

V_FB

Applications

S_GND

EP

11

S_GND

P_GND

8

PGT**

V_FB

8

P_GND

SW

• Personal and Health Care Products

• Single-Cell or Two-Cell Powered IoT Devices

• Bluetooth^®Headsets

7

V_OUT

6

V_OUT

6

SW

*Includes Exposed Thermal Pad (EP), see Table 4-1.

**See Table 3-1 for device options – PGT or PG pin.

• Remote Controllers, Portable Instruments

• Wireless Sensors, Data Loggers

 2020-2021 Microchip Technology Inc.

DS20006394C-page 1

MCP1641X

Typical Applications

L₁

UVLO_START= 0.85V

UVLO_STOP= 0.8V

4.7 µH

MCP16415/6/7/8

V_OUT

3.3V

V_IN

0.8V to 1.6V

SW

V_OUT

V_IN

866 k

360 k

C_OUT

C_IN

+

–

10 µF

V_FB

UVLO

EN

PG

Power Good

Low Battery Output

GND

LBO

L₁

UVLO_START= 2.4V

UVLO_STOP= 0.8V

4.7 µH

MCP16411/2/3/4

V_OUT

3V

V_IN

SW

1.6V to 3.2V

V_OUT

V_IN

768 k

C_OUT

10 µF

C_IN

1.69 M

430 k

+

V_FB

10 µF

485 mV V_REF

UVLO

EN

360 k

1 M

ENABLE

ON

–

+

PGT

LBO

GND

OFF

LBO Low if V_IN< 2.4V

2 x &ƌĞƐŚꢀ

ꢁůŬĂůŝŶĞꢀꢂĂƚƚĞƌŝĞƐ

V_/E

3.2V

Batteries

ǁŝƚŚꢀLow Voltage

–

3.0V

2.7V

Prograŵmed

UVLO_START

2.4V

0.8V

UVLO_STOP

LBO

0V

V_OUT

3.2V

2.7V

3.0V

Auto IN-OUT

BYPASS area

REGULATION area

Time

DS20006394C-page 2

 2020-2021 Microchip Technology Inc.

MCP1641X

1.0

ELECTRICAL CHARACTERISTICS

†

Absolute Maximum Ratings

EN, V_FB, V_IN,V_SW, V_OUT– GND .............................................................................................................................+5.5V

EN, V_FB.............................................................................................. < Maximum between V_OUTor V_IN> (GND – 0.3V)

Output Short-Circuit Current ..........................................................................................................................Continuous

Output Current Bypass Mode ...............................................................................................................................600 mA

Power Dissipation ..................................................................................................................................Internally Limited

Storage Temperature ............................................................................................................................. -65°C to +150°C

Ambient Temperature with Power Applied ................................................................................................-40°C to +85°C

Operating Junction Temperature, T_J.......................................................................................................-40°C to +125°C

ESD Protection on All Pins:

Human Body Model ............................................................................................................................................... ≥ 4 kV

Charged Device Model ...........................................................................................................................................≥ 2 kV

† Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the

device. This is a stress rating only and functional operation of the device at those or any other conditions above

those indicated in the operational listings of this specification is not intended. Exposure to maximum rating

conditions for extended periods may affect device reliability.

AC/DC CHARACTERISTICS

Electrical Specifications: Unless otherwise noted, V_IN= 1.2V, C_OUT= C_IN= 10 µF, L = 4.7 µH, V_OUT= 3.3V,

I_OUT= 10 mA, T_A= +25°C. Boldface specifications apply over the T_Arange of -40°C to +85°C.

Parameters

Sym.

Min.

0.82

Typ.

Max.

5.25

Units

Conditions

Input Voltage Range

V_IN

—

V

Values apply for the entire V_OUT

range

Minimum Input Voltage

for Start-up

V_IN

—

0.88

V

Undervoltage Lockout

(UVLO)

UVLO_START

UVLO_STOP

UVLO_HYS

V_OUT

0.83

0.74

—

0.85

0.8

50

0.87

0.81

—

V

Resistive load; UVLO pin

connected to V_INpin

mV

V

Output Voltage Adjust

Range

1.8

—

5.25

Note 1

Maximum Output Current

I_OUT

170

200

600

0.95

—

mA

V

1.2V V_IN, 2.0V V_OUT(Note 4)

1.5V V_IN, 3.3V V_OUT(Note 4)

3.6V V_IN, 5.0V V_OUT(Note 4)

Note 3

—

Feedback Voltage

V_FB

I_VFB

0.97

1

0.985

—

Feedback Input 

nA

Note 4

Bias Current

Quiescent Current at

V_OUT

I_QOUT

—

5.0

6.0

µA

EN = V_IN, does not include FB

divider current, PFM mode

(MCP16411/3/5/7) (Note 2)

Note 1: For V_IN> V_OUT, the device enters Automatic Input-to-Output Bypass mode, 

V_OUT= V_IN– R_DS(ON)P* I_OUT, maximum V_INis 5.25V.

2:

V_OUTpin is forced biased with a voltage higher than the nominal V_OUT(device is not switching) at

I_OUT= 0 mA. I_QINand I_QOUTare the device’s current consumption at V_INand V_OUTpins during Sleep

periods. The device selects its bias from V_INand/or V_OUT

.

3: 330 resistive load, 3.3V V_OUT(10 mA).

4: Determined by characterization, not production tested.

5: This is ensured by design.

 2020-2021 Microchip Technology Inc.

DS20006394C-page 3

MCP1641X

AC/DC CHARACTERISTICS (CONTINUED)

Electrical Specifications: Unless otherwise noted, V_IN= 1.2V, C_OUT= C_IN= 10 µF, L = 4.7 µH, V_OUT= 3.3V,

I_OUT= 10 mA, T_A= +25°C. Boldface specifications apply over the T_Arange of -40°C to +85°C.

Parameters

Sym.

Min.

Typ.

Max.

Units

Conditions

Quiescent Current at V_IN

I_QIN

—

4.5

5

µA

EN = V_IN,

PFM mode (MCP16411/3/5/7)

(Notes 2, 4)

Quiescent Current – 

I_QSHDN

—

2.3

3.1

µA

V_OUT= EN = GND, 

Shutdown Mode

includes N-Channel and 

P-Channel switch leakage

NMOS Switch Leakage

PMOS Switch Leakage

I_NLK

I_PLK

—

85

1

—

nA



Note 5

NMOS Switch 

R_DS(ON)N

0.4

I_SW= 100 mA (Note 4)

On-Resistance

PMOS Switch 

On-Resistance

R_DS(ON)P

I_N(MAX)

V_OUT

—

0.8

—

0.5

1

—

+1



A

I_SW= 100 mA (Note 4)

NMOS Peak Switch 

Current Limit

Note 4

V_OUTAccuracy

%

—

%

Includes line and load

regulation, V_IN= 1.5V, PWM

Only options

Line Regulation

Load Regulation

(V_OUT/V_OUT

/V_DD

)

—

0.1

0.5

0.2

%/V V_IN= 1.5V to 2.7V, I_OUT= 25 mA,

PWM Only options



V_OUT/V_OUT



%

I_OUT= 10 mA to 100 mA,

V_IN= 1.5V, PWM Only options

Maximum Duty Cycle

Switching Frequency

EN Input Logic High

EN Input Logic Low

DC_MAX

f_SW

—

425

82

—

90

500

—

575

—

%

Note 4

kHz I_OUT= 100 mA

% of V_INI_OUT= 10 mA

V_IH

V_IL

—

25

EN Input Leakage

Current

I_ENLK

—

1

—

nA

Note 4

Power Good Threshold

PG_TH

—

90

—

%

% of V_OUT(part of PGT signal)

for MCP16411/2/3/4

Power Good Hysteresis

Power Good Delay

PG_HYS

—

5

—

%

µs

V

% of V_OUT

Note 4

PG_DELAY

250

0.4

Power Good Response

PG_RESPONSE

PGT_LOW

Note 4

PGT Pin Low-Level

Output

I_SINK= 2 mA (Note 4)

Low Battery Output Delay

LBO_DELAY

—

150

—

µs

Note 4

Low Battery Output

Response

LBI_RESPONSE

Low Battery Input

Hysteresis

LBI_HYS

—

20

40

mV

UVLO pin

Note 1: For V_IN> V_OUT, the device enters Automatic Input-to-Output Bypass mode, 

V_OUT= V_IN– R_DS(ON)P* I_OUT, maximum V_INis 5.25V.

2:

V

_OUTpin is forced biased with a voltage higher than the nominal V_OUT(device is not switching) at

I_OUT= 0 mA. I_QINand I_QOUTare the device’s current consumption at V_INand V_OUTpins during Sleep

periods. The device selects its bias from V_INand/or V_OUT

.

3: 330 resistive load, 3.3V V_OUT(10 mA).

4: Determined by characterization, not production tested.

5: This is ensured by design.

DS20006394C-page 4

 2020-2021 Microchip Technology Inc.

MCP1641X

AC/DC CHARACTERISTICS (CONTINUED)

Electrical Specifications: Unless otherwise noted, V_IN= 1.2V, C_OUT= C_IN= 10 µF, L = 4.7 µH, V_OUT= 3.3V,

_OUT= 10 mA, T_A= +25°C. Boldface specifications apply over the T_Arange of -40°C to +85°C.

I

Parameters

Sym.

Min.

Typ.

Max.

Units

Conditions

Low Battery Output Low

Level

LBI_LOW

—

0.4

—

V

I_SINK= 2 mA (Note 4)

Start-up Time

t_S

—

1

—

ms

C

EN low-to-high, 90% of V_OUT

(Notes 3, 4)

Thermal Shutdown 

Die Temperature

T_SHDN

140

10

Thermal Shutdown

Temperature Hysteresis

T_SHDNHYS

PGT_OT

Internal Overtemperature

Output

75

PGT signal switch from

high-to-low level,

MCP16411/2/3/4 only

Note 1: For V_IN> V_OUT, the device enters Automatic Input-to-Output Bypass mode, 

V_OUT= V_IN– R_DS(ON)P* I_OUT, maximum V_INis 5.25V.

2:

V_OUTpin is forced biased with a voltage higher than the nominal V_OUT(device is not switching) at

I_OUT= 0 mA. I_QINand I_QOUTare the device’s current consumption at V_INand V_OUTpins during Sleep

periods. The device selects its bias from V_INand/or V_OUT

.

3: 330 resistive load, 3.3V V_OUT(10 mA).

4: Determined by characterization, not production tested.

5: This is ensured by design.

TEMPERATURE SPECIFICATIONS

Parameters

Sym.

Min.

Typ.

Max.

Units

Conditions

Temperature Ranges

Operating Temperature Range

Storage Temperature Range

T_J

T_A

T_J

-40

-65

—

+125

+150

°C

Steady state

Transient

Maximum Junction Temperature

Package Thermal Resistances

Thermal Resistance, 10-Lead MSOP

_JA

—

71

54

—

°C/W

Thermal Resistance, 10-Lead 

3 mm x 3 mm TDFN

 2020-2021 Microchip Technology Inc.

DS20006394C-page 5

MCP1641X

NOTES:

DS20006394C-page 6

 2020-2021 Microchip Technology Inc.

MCP1641X

2.0

TYPICAL PERFORMANCE CURVES

Note:

The graphs and tables provided following this note are a statistical summary based on a limited number of

samples and are provided for informational purposes only. The performance characteristics listed herein

are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified

operating range (e.g., outside specified power supply range) and therefore outside the warranted range.

Note: Unless otherwise indicated, V_IN= EN = 1.2V, C_OUT= C_IN= 10 µF, L = 4.7 µH, V_OUT= 3.3V, I_LOAD= 10 mA,

T_A= +25°C, 10-Lead MSOP Package, PFM/PWM Options = MCP16411/3/5/7, PWM Only Options = MCP16412/4/6/8.

20

18

16

14

12

10

8

6

4

2

500

450

400

350

300

250

200

150

100

50

0

-40 -25 -10

5

20

35

50

65

80

-40 -25 -10

5

20

35

50

65

80

Ambient Temperature (°C)

FIGURE 2-1:

I_QOUTvs. Ambient

FIGURE 2-4:

I_QOUTvs. Ambient

Temperature, PFM/PWM Options.

Temperature, PWM Only Options.

500

450

400

350

300

250

200

150

100

50

10

9

8

7

6

5

4

3

2

1

0

0.8

1

1.2 1.4 1.6 1.8

2 2.2 2.4 2.6 2.8 3

0.8

1

1.2 1.4 1.6 1.8

2 2.2 2.4 2.6 2.8 3

Input Voltage (V)

FIGURE 2-2:

I_QOUTvs. V_IN, PFM/PWM

FIGURE 2-5:

I_QOUTvs. V_IN, PWM Only

Options.

10

9

8

7

6

5

4

3

2

1

0

1300

1200

1100

1000

900

V_OUT= 3.3V

800

700

600

V_OUT= 2.0V

500

400

300

200

100

0

V_OUT= 5.0V

0.8 1.2 1.6

2

2.4 2.8 3.2 3.6

4

4.4 4.8

0.8

1.2

1.6

2

2.4

2.8

3.2

3.6

Input Voltage ꢀV)

Input Voltage (V)

FIGURE 2-3:

Shutdown Current vs. V_IN.

FIGURE 2-6:

Maximum I_OUTvs. V_IN,after

Start-up, V_OUTMaximum 5% below Regulation

Point.

 2020-2021 Microchip Technology Inc.

DS20006394C-page 7

MCP1641X

Note: Unless otherwise indicated, V_IN= EN = 1.2V, C_OUT= C_IN= 10 µF, L = 4.7 µH, V_OUT= 3.3V, I_LOAD= 10 mA,

T_A= +25°C, 10-Lead MSOP Package, PFM/PWM Options = MCP16411/3/5/7, PWM Only Options = MCP16412/4/6/8.

100

90

80

70

60

50

40

30

20

10

0

5

4.5

4

3.5

3

2.5

2

1.5

1

V_IN= 1.2V

V_IN= 1.6V

V_IN= 1.2V

V_IN= 3V

V_IN= 1.6V

V_IN= 3V

0.5

0

-40 -30 -20 -10

0

10 20 30 40 50 60 70 80

-40 -30 -20 -10

0

10 20 30 40 50 60 70 80

Ambient Temperature (°C)

FIGURE 2-7:

No Load Input Current vs.

FIGURE 2-10:

No Load Input Current vs.

Ambient Temperature, PFM/PWM Options.

Ambient Temperature, PWM Only Options.

1000

100

10

1000

100

10

1

V_OUT= 3.3V

V_OUT= 5V

V_OUT= 2V

0.1

1

0.1

V_OUT= 2V

V_OUT= 3.3V

V_OUT= 5V

0.01

0.001

0.0001

0.01

0

0.5

1

1.5

2

2.5

3

3.5

4

4.5

5

0

0.5

1

1.5

2

2.5

3

3.5

4

4.5

5

Input Voltage (V)

FIGURE 2-8:

No Load Input Current vs.

FIGURE 2-11:

No Load Input Current vs.

V_IN, PFM/PWM Options.

V_IN, PWM Only Options.

200

180

160

140

120

100

80

60

40

20

0

40

35

V_OUT= 5.0V

V_OUT= 3.3V

V_OUT= 2V

30

25

20

15

10

5

0

0.8 1.2 1.6

2

2.4 2.8 3.2 3.6

4

4.4 4.8

-40 -30 -20 -10

0 10 20 30 40 50 60 70 80

Ambient Temperature (°C)

Input Voltage (V)

FIGURE 2-9:

Automatic Bypass Mode –

FIGURE 2-12:

Average of PFM/PWM

No Load Input Current vs. Ambient Temperature.

Threshold Current vs.V_IN.

DS20006394C-page 8

 2020-2021 Microchip Technology Inc.

MCP1641X

Note: Unless otherwise indicated, V_IN= EN = 1.2V, C_OUT= C_IN= 10 µF, L = 4.7 µH, V_OUT= 3.3V, I_LOAD= 10 mA,

T_A= +25°C, 10-Lead MSOP Package, PFM/PWM Options = MCP16411/3/5/7, PWM Only Options = MCP16412/4/6/8.

100

90

80

70

60

50

100

90

80

70

60

50

40

30

20

10

0

V_IN= 1V

V_IN= 1.2V

V_IN= 1.6V

V_IN= 1V

V_IN= 1.2V

V_IN= 1.6V

0.01

0.1

1

10

100

1000

0.1

1

10

I_OUT(mA)

100

1000

I_OUT(mA)

FIGURE 2-13:

2.0V V_OUT, Efficiency vs.

FIGURE 2-16:

2.0V V_OUT, Efficiency vs.

I_OUT, PFM/PWM Options.

I_OUT, PWM Only Options.

100

90

80

70

60

50

40

30

20

10

0

100

90

80

70

60

50

40

30

20

10

0

V_IN= 1.2V

V_IN= 1.6V

V_IN= 3V

V_IN= 1.2V

V_IN= 1.6V

V_IN= 3V

0.1

1

10

I_OUT(mA)

100

1000

0.01

0.1

1

10

100

1000

I_OUT(mA)

FIGURE 2-14:

3.3V V_OUT, Efficiency vs.

FIGURE 2-17:

3.3V V_OUT, Efficiency vs.

I_OUT, PFM/PWM Options.

I_OUT, PWM Only Options.

100

90

80

70

60

50

40

30

20

10

0

100

90

80

70

60

50

40

30

20

10

0

V_OUT= 5.0V

V_IN= 1.2V

V_IN= 3V

V_IN= 4.2V

V_IN= 1.2V

V_IN= 3V

V_IN= 4.2V

0.1

1

10

100

1000

0.01

0.1

1

10

100

1000

I_OUT(mA)

FIGURE 2-15:

5.0V V_OUT, Efficiency vs.

FIGURE 2-18:

5.0V V_OUT, Efficiency vs.

I_OUT, PFM/PWM Options.

I_OUT, PWM Only Options.

 2020-2021 Microchip Technology Inc.

DS20006394C-page 9

MCP1641X

Note: Unless otherwise indicated, V_IN= EN = 1.2V, C_OUT= C_IN= 10 µF, L = 4.7 µH, V_OUT= 3.3V, I_LOAD= 10 mA,

T_A= +25°C, 10-Lead MSOP Package, PFM/PWM Options = MCP16411/3/5/7, PWM Only Options = MCP16412/4/6/8.

510

505

500

495

490

485

480

475

470

3.34

3.33

3.32

3.31

3.3

I_LOAD= 100 mA

3.29

3.28

3.27

3.26

I_LOAD= 10 mA

-40 -25 -10

5

20

35

50

65

80

-40 -25 -10

5

20

35

50

65

80

Ambient Temperature (°C)

FIGURE 2-19:

3.3V V_OUTvs. Ambient

FIGURE 2-22:

Normalized Switching

Temperature.

Frequency vs. Ambient Temperature.

3.34

3.33

3.32

3.31

3.3

2

1.8

1.6

V_IN= 3V

1.4

Start-Up

1.2

3.29

3.28

3.27

3.26

Shutdown

V_IN= 2.5V

V_IN= 1.2V

1

0.8

0.6

I_LOAD= 25 mA

-40 -25 -10

5

20

35

50

65

80

0

10 20 30 40 50 60 70 80 90 100

Load Current (mA)

Ambient Temperature (°C)

FIGURE 2-20:

3.3V V_OUTvs. Ambient

FIGURE 2-23:

3.3V V_OUT, Minimum

Temperature.

Start-up and Shutdown V_INvs. Resistive Load.

3.34

3.33

3.32

3.31

3.3

3

2.8

2.6

2.4

2.2

T_A= -40°C

2

Start-Up

1.8

1.6

3.29

3.28

1.4

Shutdown

1.2

T_A= +25°C

T_A= +85°C

1

0.8

0.6

3.27

3.26

I_LOAD= 50 mA

0.8 1.1 1.4 1.7

2

2.3 2.6 2.9 3.2

0

10 20 30 40 50 60 70 80 90 100

Load Current (mA)

Input Voltage (V)

FIGURE 2-21:

3.3V V_OUTvs. V_IN.

FIGURE 2-24:

5.0V V_OUT, Minimum

Start-up and Shutdown V_INvs. Resistive Load.

DS20006394C-page 10

 2020-2021 Microchip Technology Inc.

MCP1641X

Note: Unless otherwise indicated, V_IN= EN = 1.2V, C_OUT= C_IN= 10 µF, L = 4.7 µH, V_OUT= 3.3V, I_LOAD= 10 mA,

T_A= +25°C, 10-Lead MSOP Package, PFM/PWM Options = MCP16411/3/5/7, PWM Only Options = MCP16412/4/6/8.

2

2.4

1.8

1.6

1.4

1.2

1

2.2

2

1.8

1.6

1.4

1.2

1

0.8

0.6

0.4

L = 2.2 µH

L = 4.7 µH

T_Aꢁ= +25°C

T_Aꢁ= +85°C

T_Aꢁ= -40°C

T_A= +25°C

T_A= +85°C

T_A= -40°C

0.8

0.6

0.4

0.8 0.9

1

1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 1.9

Input Voltage (V)

0.8

1

1.2 1.4 1.6 1.8

2

2.2 2.4 2.6 2.8

3

Input Voltage (V)

FIGURE 2-25:

3.3V V_OUT, Inductor Peak

FIGURE 2-28:

2.0V V_OUT, Inductor Peak

Current Limit vs.V_IN.

Current Limit vs. V_IN.

2.4

2.2

0.89

0.87

0.85

0.83

0.81

0.79

0.77

L = 4.7 µH

2

UVLO_START

1.8

1.6

1.4

1.2

1

0.8

0.6

0.4

UVLO_STOP

T_A= +25°C

T_A= +85°C

T_A= -40°C

I_LOAD= 10 mA

0.75

0.8 1.2 1.6

2

2.4 2.8 3.2 3.6

4

4.4 4.8

-40 -25 -10

5

20

35

50

65

80

Input Voltage (V)

Ambient Temperature (°C)

FIGURE 2-26:

5.0V V_OUT, Inductor Peak

FIGURE 2-29:

UVLO_STARTand UVLO_STOP

Current Limit vs.V_IN.

vs. Ambient Temperature.

5

4

3.34

3.33

3.32

V_IN=2.5V

P - Channel

3

3.31

3.3

3.29

2

N - Channel

3.28

V_IN=1.5V

3.27

1

0

3.26

10 20 30 40 50 60 70 80 90 100

Load Current (mA)

0.8 1.2 1.6

2

2.4 2.8 3.2 3.6

> V_INor V_OUT

4

4.4 4.8 5.2

FIGURE 2-27:

Options.

Load Regulation, PWM Only

FIGURE 2-30:

R_DSONvs. > V_INor V_OUT

N-Channel and P-Channel,

.

 2020-2021 Microchip Technology Inc.

DS20006394C-page 11

MCP1641X

Note: Unless otherwise indicated, V_IN= EN = 1.2V, C_OUT= C_IN= 10 µF, L = 4.7 µH, V_OUT= 3.3V, I_LOAD= 10 mA,

T_A= +25°C, 10-Lead MSOP Package, PFM/PWM Options = MCP16411/3/5/7, PWM Only Options = MCP16412/4/6/8.

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FIGURE 2-31:

3.3V V_OUT, PFM Mode

FIGURE 2-34:

3.3V V_OUT, No Load, PFM

Waveforms.

Mode Output Ripple.

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FIGURE 2-32:

3.3V V_OUT, No Load, PWM

FIGURE 2-35:

3.3V V_OUT, PWM Mode

Waveforms.

Mode Waveforms.

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FIGURE 2-36:

Waveforms, PWM Only Options.

3.3V V_OUT, Load Transient

FIGURE 2-33:

Waveforms, PFM/PWM Options.

3.3V V_OUT, Load Transient

DS20006394C-page 12

 2020-2021 Microchip Technology Inc.

MCP1641X

Note: Unless otherwise indicated, V_IN= EN = 1.2V, C_OUT= C_IN= 10 µF, L = 4.7 µH, V_OUT= 3.3V, I_LOAD= 10 mA,

T_A= +25°C, 10-Lead MSOP Package, PFM/PWM Options = MCP16411/3/5/7, PWM Only Options = MCP16412/4/6/8.

I_LOAD= 1 mA

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FIGURE 2-37:

3.3V V_OUT, Start-up from

FIGURE 2-40:

3.3V V_OUT, Start-up from

V_IN, PFM/PWM Options.

V_IN, PWM Only Options.

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FIGURE 2-38:

3.3V V_OUT, Line Transient

FIGURE 2-41:

3.3V V_OUT, UVLO

Waveforms.

Connected to V_IN.

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FIGURE 2-39:

3.3V V_OUT, Start-up after

FIGURE 2-42:

3.3V V_OUT, UVLO Set for

Enable.

1.1V.

 2020-2021 Microchip Technology Inc.

DS20006394C-page 13

MCP1641X

Note: Unless otherwise indicated, V_IN= EN = 1.2V, C_OUT= C_IN= 10 µF, L = 4.7 µH, V_OUT= 3.3V, I_LOAD= 10 mA,

T_A= +25°C, 10-Lead MSOP Package, PFM/PWM Options = MCP16411/3/5/7, PWM Only Options = MCP16412/4/6/8.

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FIGURE 2-43:

3.3V V_OUT, LBO Delay and

FIGURE 2-45:

3.3V V_OUT, Boost to

Response Time.

Automatic Bypass Transitions, PWM Only

Options.

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FIGURE 2-44:

3.3V V_OUT, Boost to

Automatic Bypass Transitions, PFM/PWM

Options.

DS20006394C-page 14

 2020-2021 Microchip Technology Inc.

MCP1641X

3.0

PART NUMBER SELECTION

TABLE 3-1:

Part Number

DEVICE OPTIONS

EN Pin Shutdown

Option

Switching Mode

Option

PGT/PG Pin Option

MCP16411

MCP16412

MCP16413

MCP16414

MCP16415

MCP16416

MCP16417

MCP16418

Output Discharge

In-Out Bypass

PFM/PWM

PWM Only

PFM/PWM

PWM Only

PFM/PWM

PWM Only

PFM/PWM

PWM Only

Power Good and Die Overtemperature Output

Power Good Output

In-Out Bypass

Output Discharge

In-Out Bypass

Power Good Output

In-Out Bypass

Power Good Output

 2020-2021 Microchip Technology Inc.

DS20006394C-page 15

MCP1641X

NOTES:

DS20006394C-page 16

 2020-2021 Microchip Technology Inc.

MCP1641X

4.0

PIN DESCRIPTIONS

The descriptions of the pins are listed in Table 4-1.

TABLE 4-1:

MCP1641X

PIN FUNCTION TABLE

MCP1641X

Symbol

Description

10-Lead MSOP 10-Lead 3 mm x 3 mm TDFN

1

UVLO

Undervoltage Lockout (0.485V internal reference)

and Input Pin for Low Battery Output (LBO) Voltage

Comparator

2

3

2

3

LBO

Open-Drain Low Battery Comparator Output Pin

PGT, PG

Open-Drain Power Good and Die Overtemperature

Comparators Output Pin. Only MCP16411/2/3/4

devices have both functions implemented on the

same pin, PGT. See Table 3-1 for device options.

4

5

4

5

V_FB

V_OUT

SW

Feedback Voltage Pin, 0.97V Reference Voltage

Output Voltage Pin

6

Switch Node, Boost Inductor Pin

Power Ground Pin

7

P_GND

S_GND

V_IN

8

Signal Ground Pin

9

Input Voltage Pin

10

EN

Enable Control Input Pin. The device is in shutdown

if EN is pulled to GND.

—

11

EP

Exposed Thermal Pad (3 x 3 TDFN only); must be

connected to P_GNDand S_GND

.

4.1

Undervoltage Lockout Input Pin

(UVLO), Input for Low-Voltage

Output Comparator

4.3

Power Good and Die

Overtemperature Pin (PGT)

The Power Good and Die Overtemperature (PGT) pin is

an open-drain output, which can be connected to V_OUT

through a pull-up resistor. The pin switches to a low level

when V_OUTdrops below 10% of its nominal value or

when the internal die’s temperature sensor detects a

value higher than +75C (typical).

The UVLO and low battery comparator input use an

internal 485 mV reference. Connect the UVLO pin to

the V_INpin for a default start-up threshold of 0.85V. The

device stops switching at 0.8V typical input voltage.

Connect an external resistive divider to this pin to

increase the UVLO_STARTthreshold. When the battery

voltage or V_INis ramping down to the programmed

threshold, the LBO output pin will be asserted low.

The MCP16415/6/7/8 devices have only the Power

Good function implemented – PG pin (see Table 3-1 for

the device options).

4.2

Low Battery Output Pin (LBO)

4.4

Feedback Voltage Pin (V

)

FB

The open-drain output shows a low-level warning

signal if the UVLO pin detects a battery level below the

485 mV threshold. If no external divider on the UVLO

pin is used (UVLO = V_IN), low battery detection is

ineffective.

The V_FBpin is used to provide output voltage regulation

by using a resistive divider network. The feedback

voltage is typically 0.97V.

 2020-2021 Microchip Technology Inc.

DS20006394C-page 17

MCP1641X

4.5

Output Voltage Pin (V

)

4.9

Power Supply Input Voltage Pin

(V )

OUT

IN

The Output Voltage pin connects the synchronous

integrated P-Channel MOSFET to the output capacitor.

The resistive divider network from FB is also connected

to the V_OUTpin for voltage regulation.

Connect the input voltage source to V_IN. A local bypass

capacitor is required. The input source should be

decoupled to GND with a 10 µF minimum capacitor.

4.6

Switch Node Pin (SW)

4.10 Enable Pin (EN)

Connect the inductor from the input voltage to the SW

pin. The SW pin carries inductor current which can be

as high as 1A (typical). The integrated N-Channel

switch drain and integrated P-Channel switch source

are internally connected at the SW node.

The EN pin is an input of a Schmitt Trigger circuit used

to enable or disable the device’s switching. While the

EN pin is low (EN = GND), the device is in Shutdown

mode – output discharge or input-to-output bypass

(see Table 3-1) and consumes low quiescent current,

2.3 µA (typical). A logic high (> 82% of V_IN) enables the

boost converter output. A logic low (< 25% of V_IN)

ensures that the boost converter is disabled. Do not

allow this pin to float.

4.7

Power Ground Pin (P

)

GND

The Power Ground pin is used as a return for the

high-current N-Channel switch. The P_GNDand S_GND

pins are connected externally.

4.11 Exposed Thermal Pad (EP)

4.8

Signal Ground Pin (S

)

GND

There is no internal electrical connection between the

Exposed Thermal Pad (EP) and the S_GNDand P_GND

pins. They must be connected to the same electric

potential on the Printed Circuit Board (PCB).

The Signal Ground pin is used as a return for the

integrated V_REFand error amplifier. The S_GNDand

power ground (P_GND) pins are connected externally.

DS20006394C-page 18

 2020-2021 Microchip Technology Inc.

MCP1641X

5.2.2

PWM ONLY OPERATION

5.0

5.1

DEVICE OVERVIEW

Introduction

During periods of light load operation, the MCP1641X

devices continue to operate at a fixed 500 kHz

switching frequency, allowing pulse-skipping.

The MCP1641X is a low-voltage, step-up converter with

battery monitoring features. The MCP1641X delivers

high efficiency over a wide range of inputs: single-cell,

two-cell, alkaline/NiMH batteries or single-cell

Li-Ion/Li-Polymer batteries can be used.

The MCP16412/4/6/8 devices disable PFM mode

switching and operate only in PWM mode over the

entire load range.

5.2.3

OUTPUT DISCHARGE SHUTDOWN

OPTION

A high level of integration lowers total system cost,

eases implementation and reduces the Bill of Materials

(BOM) and board area.

The MCP16411/2/5/6 devices incorporate an output

auto-discharge feature. While in Shutdown mode, the

MCP16411/2/5/6 devices automatically discharge the

output capacitor by using an internal N-Channel

MOSFET switch.

This family of devices features low quiescent current, a

programmable start-up voltage (UVLO_START), low battery

indication, adjustable output voltage, dual modes of

operation (PFM/PWM and PWM Only), integrated syn-

chronous switch, internal compensation, low noise

anti-ringing control, inrush current limit and soft start.

The capacitors connected to the output are discharged

by an integrated switch of 150-200Ω. The discharge

time depends on the total output capacitance.

Anew battery-friendly feature for the Microchip’s step-up

converters family is the Automatic Input-to-Output

Voltage Bypass. This function helps optimize the capacity

usage of the battery, and keeps the efficiency high and

the noise low for a narrow step-up conversion ratio (e.g.,

two fresh alkaline cells powering a boost converter for a

3.0V or 3.3V output voltage). With automatic transition

from Input-to-Output Bypass to Boost mode operation

and low noise anti-ringing control circuitry, in addition to

the PWM Only switching, the MCP1641X devices offer a

good low noise DC-DC solution for compact

battery-powered systems.

During the Output Discharge Shutdown mode, the out-

put of the MCP16411/2/5/6 is completely disconnected

from the input by turning off the integrated P-Channel

switch and removing the switch bulk diode connection.

This removes the DC path, which is typically present in

boost converters and which allows the output to be

disconnected from the input. While in this mode, a low

quiescent current (2.3 µA, typical) is consumed from

the input (battery).

5.2.4

INPUT-TO-OUTPUT BYPASS

SHUTDOWN OPTION

The monitoring of its internal temperature, while power-

ing the converter from batteries, is an additional safety

feature of the MCP1641X family. An output pin (PGT)

provides an error signal if the temperature of the die

exceeds +75C.

The MCP16413/4/7/8 devices incorporate the

Input-to-Output Bypass Shutdown option. With the EN

input pulled low, the output is connected to the input

using the internal P-Channel MOSFET.

In this mode, the current drawn from the input (battery)

is 2.3 μA, typically, with no load. The Input-to-Output

Bypass mode is used when the input voltage range is

high enough for the load to operate in Standby or Low

I_Qmode (e.g., a microcontroller). When a higher,

regulated output voltage is necessary to operate the

application, the EN input is pulled high, boosting the

output to the regulated value.

There are two shutdown options for the MCP1641X

family: Output Discharge and Input-to-Output Bypass.

5.2

MCP1641X Options

A summary of the device options is presented in

Table 3-1.

5.2.1

PFM/PWM OPERATION

The MCP16411/3/5/7 devices use an automatic

switchover from PWM to PFM mode, for light load

conditions, to maximize efficiency over a wide range of

output current.

The PFM mode operation has a higher output voltage

ripple and variable frequency as compared to the PWM

mode.

 2020-2021 Microchip Technology Inc.

DS20006394C-page 19

MCP1641X

5.2.5

POWER GOOD AND DIE

5.3

Functional Description

OVERTEMPERATURE (PGT PIN

OPTION)

The MCP1641X is a compact, high-efficiency, fixed

frequency, synchronous step-up DC-DC converter with

programmable UVLO start-up, low battery detection and

output discharge that provides an easy-to-use power

supply solution for applications powered from batteries.

Figure 5-1 depicts the functional block diagram of the

MCP1641X. It incorporates a Current-mode control

scheme, in which the PWM ramp signal is derived from

the NMOS Power Switch Current (I_SENSE).

The MCP16411/2/3/4 devices offer a combined output

Power Good and Die Overtemperature signal to the

PGT pin.

Pin switches to low level when either:

• The output voltage drops below 10% of its

nominal value, with 5% hysteresis;

• The IC works at a temperature which is higher

than +75C.

This ramp signal adds to the slope compensation signal

and is compared to the output of the Error Amplifier

(V_ERR) to control the on-time of the power switch. In

addition, several voltage comparators (PG, UVLO inter-

nal overtemperature and LBO) protect the converter

from heretical operation and overheating, as well as the

battery from overdischarging and risk of leakage.

5.2.6

POWER GOOD (PG PIN OPTION)

The MCP16415/6/7/8 devices offer only a Power Good

output signal to the PG pin, which switches low when the

output voltage drops below 10% of the V_OUTnominal

value and resumes at 95% of the V_OUTnominal value.

DS20006394C-page 20

 2020-2021 Microchip Technology Inc.

MCP1641X

INTERNAL

SUPPLY

V_Max

V

OUT

IN

I_ZERO

+

–

V_IN

V_OUT

DIRECTION

CONTROL

V_MAX

EN

SW

EN

V

Overcurrent Comp.

OUT

Thermal

SHDN

Auto-Discharge*

OC_Ref

I_LIMIT

GATE DRIVE

AND

SHUTDOWN

CONTROL

LOGIC

–

EN

+

START

I_SENSE

+

–

SLOPE

COMP.

OSCILLATOR

GND



PWM Modulator

PWM

+

PWM/PFM

LOGIC

V_PWM

–

V_ERR

Error Amp.

+

V_REF= 0.97V

EA

V

–

FB

+

–

0.9 x V

REF

Thermal SHDN

V

Logic Block

for Temp. and

Voltage Warnings

FB

Temp. Sensor

PG Comp.

Temp. Error,

> 75°C

SHDN

PGT

LBO

EN

PGT

Error

PGT Error

LBI

Error

485 mV

UVLO and LBI

Comparators

START

UVLO

LBI

Error

Note: The auto-discharge transistor is applicable only to MCP16411/2/5/6.

FIGURE 5-1:

MCP1641X Functional Block Diagram.

 2020-2021 Microchip Technology Inc.

DS20006394C-page 21

MCP1641X

5.3.1

INTERNAL BIAS

5.3.4

PFM/PWM OPERATION

The MCP1641X devices get their start-up bias from

V_IN. The V_INbias is used to power the device and

drive circuits over the entire operating range. During

normal operation, the internal V_MAXcomparator

The MCP16411/3/5/7 devices use an automatic

switchover from PWM to PFM mode, for light load

conditions, to maximize efficiency over a wide range of

output current. During PFM mode, a controlled peak

current limit is used to pump the output up to the thresh-

old. While operating in PFM or PWM mode, the

P-Channel switch is used as a synchronous rectifier,

turning off when the inductor current reaches 0 mA, in

order to maximize efficiency.

selects the highest voltage rail between V_INand V_OUT

,

in order to optimize operation and reduce power con-

sumption. Once the output exceeds the input, bias

comes from the output. The internal voltage reference

of 485 mV is powered from the input voltage at all

times. A voltage amplifier buffers and multiplies the

reference to 0.97V for the FB input of the error ampli-

fier. Once the UVLO comparator triggers the start-up,

the internal control loop keeps the output in regulation,

while V_INramps down to 0.8V (UVLO_STOP).

In PFM mode, a voltage comparator is used to terminate

switching when the output voltage reaches an upper

threshold limit. Once switching has terminated, the out-

put voltage decays or coasts down. During this Sleep

period, a very low current is consumed from the input

source, which keeps power efficiency high at light load.

5.3.2

LOW-VOLTAGE START-UP

The PFM mode frequency is a function of input voltage,

output voltage and load. While in PFM mode, the boost

converter periodically pumps the output with a fixed

switching frequency of 500 kHz. The value of the out-

put capacitor changes the low-frequency component

ripple. The device itself is powered from the output and

consumes 5 µA (typical).

The MCP1641X is capable of starting from a low input

voltage. Start-up voltage is well-controlled by the UVLO

circuitry, which uses the 485 mV voltage reference.

The default start-up value is 0.85V (typical). The

UVLO_STARTthreshold can be programmed by using an

external resistive divider connected to the UVLO pin.

This input also serves as a low battery input.

PFM operation is initiated if the output load current falls

below an internally programmed threshold. The output

voltage is continuously monitored; when the output

voltage drops below its nominal value, PFM operation

pulses one or several times to bring the output back

into regulation. If the output load current rises above

the upper threshold, the MCP16411/3/5/7 enters

smoothly into the PWM mode.

When the device is enabled (EN set high) and the input

voltage is higher than 0.85V (typical), the internal

start-up logic turns on the rectifying P-Channel switch

until the output capacitor is charged to a value close to

the input voltage. This is commonly called the output

precharging phase and the rectifying switch limits the

current during this time. Precharge current varies and

increases with V_IN. Precharge current starts from

25 mA for low input voltage and increases up to

250 mA or more near the maximum limit of V_IN.

Figure 2-12 represents the input voltage versus load

current for the PFM to PWM threshold.

After the output capacitor is charged to the input volt-

age, the device starts switching and runs in open loop,

with limited inductor peak current, at approximately

30-40% of its nominal value. Once the output voltage

ramps up to 60-70% of the nominal value, the normal

closed-loop operation is initiated.

5.3.5

PWM ONLY OPERATION

In normal PWM Operation mode, the MCP16412/4/6/8

devices operate as a fixed frequency, synchronous

boost converter. The switching frequency is internally

maintained with a precision oscillator, which is typically

set to 500 kHz.

5.3.3

UNDERVOLTAGE LOCKOUT (UVLO)

At light loads, the MCP16412/4/6/8 devices begin to

skip pulses. By operating in PWM Only mode, the

output ripple remains low and the frequency is

constant. Operating in Fixed PWM mode results in low

efficiency during light load operation, but with the

advantage of low output ripple and noise for the

supplied load. Lossless current sensing converts the

peak current signal to voltage in order to sum it with the

internal slope compensation. This summed signal is

compared with the voltage error amplifier output to

provide a peak current control command for the PWM

signal. The converter provides the proper amount of

slope compensation to ensure stability. The peak

current limit is typically set to 1A.

The internal UVLO comparator input uses the 485 mV

voltage reference to compare it with the battery input

voltage. If the UVLO input is tied to V_IN, the comparator

enables the converter at 0.85V typical input voltage. If

a different UVLO_STARTvoltage is desired, a resistive

divider must be connected to the UVLO pin.

The UVLO_STOPthreshold is set internally to 0.8V.

DS20006394C-page 22

 2020-2021 Microchip Technology Inc.

MCP1641X

5.3.6

LOW NOISE OPERATION

The MCP1641X integrates a low noise anti-ringing

switch that damps the oscillations observed at the

switch node of the boost converter. This method

reduces the noise spread when operating at light loads

in Discontinuous Inductor Current (DCM) mode.

UVLO START

0.85V

0.8V

V_IN

0V

485 mV

LBI HYST.

5.3.7

INTERNAL COMPENSATION

UVLO

The error amplifier (a transconductance type), with its

associated compensation network, completes the

closed-loop system; it compares the output voltage

(V_FBpin) to a reference at the input of the error ampli-

fier, and feeds the amplified and inverted signal to the

control input of the inner current loop. The

compensation network provides phase leads and lags

at appropriate frequencies to cancel the excessive

phase lags and leads of the power circuit. All necessary

compensation components and slope compensation

are integrated.

EN

LBO

V_OUT

PGT

FIGURE 5-3:

UVLO and LBO Behavior

(UVLO pin connected to a resistive divider to

program the UVLO_STARTvalue).

5.3.8

LOW BATTERY DETECTION

The LBO pin is connected to the output of the Low

Battery Input (LBI) comparator to warn if the input volt-

age is low or the UVLO pin level is below the 485 mV

trip point. The LBI comparator is active only when the

device is active (EN is high), after the start-up

sequence ends. The LBI comparator acts only during

the V_INdown slope (e.g., battery is discharging). There

is a hysteresis of 20 mV (typical) between the

UVLO_STARTand LBI thresholds. After the LBO output

pin is asserted low for low battery, the boost converter

continues to operate down to 0.8V (UVLO_STOP). In

order to get a valid LBO signal, the input voltage must

be lower for more than 150 µs (see Figure 5-2). This

blanking time eliminates false triggering of the LBI

comparator due to voltage transients.

5.3.9

POWER GOOD AND DIE

OVERTEMPERATURE SYSTEM

RESPONSE

The PGT is an open-drain output pin, a mixed Power

Good and Die Overtemperature function, which works

as a general error pin if one of the following events

occurs:

• V_OUTis below 90% of regulated value; there is a

5% hysteresis. It resumes when V_OUTgets back

to 95% of its nominal value. A 250 µs delay is

needed for a valid signal (see Figure 5-4).

• The device’s temperature is higher than +75C

(only for MCP16411/2/3/4 devices; see Table 3-1).

This feature can be preprogrammed by customer

request (in the +55C to +85C range with +10C

increments).

UVLO = V

IN

0.85V

0.8V

Note:

Contact the regional sales office for more

details.

V

IN

0V

The open-drain transistor allows interfacing the PGT

pin with an MCU I/O port. It can sink up to 2 mA from

the power line with the pull-up resistor connected. The

PGT signal is generated (comparator active) only if the

device is active (EN is high).

EN

LBO

V

OUT

The device’s overtemperature protection feature helps

in any case of overload, or other Fault conditions that

generate the heating of the device or its proximity (e.g.,

PCB area), preventing the end equipment from

overheating or melting.

PGT

FIGURE 5-2:

UVLO and LBO Behavior

(UVLO pin connected to V_INpin).

 2020-2021 Microchip Technology Inc.

DS20006394C-page 23

MCP1641X

5.3.11

ENABLE

250 µs <150 µs

250 µs

The MCP1641X devices are enabled when the EN pin

is set high and are disabled when the EN pin is set low

(Shutdown mode). The enable threshold voltage varies

with the input voltage. To enable the boost converter,

the EN voltage level must be greater than 82% of the

V_INvoltage. To disable the boost converter, the EN

voltage must be less than 25% of the V_INvoltage.

V_OUT

PGT

RESPONSE

PGT

DELAY

PGT

In Shutdown mode, a low quiescent current, 2.3 µA

(typical), is consumed from the input (battery).

5.3.12

SHORT-CIRCUIT PROTECTION

FIGURE 5-4:

5.3.10

PGT Output Response.

Unlike most boost converters, the MCP1641X allows its

output to be shorted during normal operation. The 1A

(typical) internal current limit and thermal shutdown

reduce excessive stress and protect the device during

periods of short-circuit, overcurrent and overtemperature.

AUTOMATIC INPUT-TO-OUTPUT

BYPASS MODE

The MCP1641X features Automatic Input-to-Output

Bypass mode if V_INis close to the selected V_OUTor

higher. In this situation, V_OUTtracks V_IN, which is

“bypassed” to the output through the synchronous

P-Channel MOSFET. The device resumes Boost mode

if V_OUTdecreases down to approximately 90% of the

target regulation voltage.

5.3.13

INPUT OVERCURRENT LIMIT

1A (typical)

The MCP1641X devices use

a

cycle-by-cycle inductor peak current limit to protect the

N-Channel switch. The overcurrent comparator resets

the driving latch when the peak of the inductor current

reaches the limit. In current limitation, the output volt-

age starts dropping. To assure highest load current

operation, by design, the current limit is higher than

typical for an input voltage close to the output voltage

value.

This function has the advantage of offering a highly

efficient Conversion mode while the battery is fresh,

which translates into better battery utilization. This mode

of operation also removes the high output ripple and

noise, which is usually present in boost converters

during operation when the value of the input is very close

to the desired output voltage (where the switching duty

cycle is minimum and limited). This mode is recom-

mended for noise-sensitive power rail applications (e.g.,

audio, LCD displays). The disadvantage is that the

output is not regulated in this range, but equal with

battery voltage minus a drop on the synchronous

P-MOS (I_OUT* R_DSON) rectifier.

5.3.14

THERMAL SHUTDOWN

Thermal shutdown circuitry is integrated in the

MCP1641X devices. This circuitry monitors the

device’s junction temperature and shuts off the output

if the junction temperature exceeds the typical +140°C

value. If this threshold is exceeded, the device auto-

matically restarts once the junction temperature drops

by 10°C (typical).

V_OUT

V_IN

V

V_OUT= (V_IN–I_OUT* R_DSON

)

V_OUT(BOOST)

V_OUT= V_IN

90% V_OUT

0.85V

Time

FIGURE 5-5:

Automatic Boost-Bypass

Transition.

DS20006394C-page 24

 2020-2021 Microchip Technology Inc.

MCP1641X

The internal error amplifier of the Peak Current mode

control loop is a transconductance error amplifier; its

gain is not related to the resistor’s value. There are

some potential issues with higher value resistors. For

small surface-mount resistors, environment contami-

nation can create leakage paths that significantly

change the resistive divider ratio and the output voltage

tolerance. Smaller feedback resistor values increase

the quiescent current drained from the battery by a

few µA, but result in good regulation over the entire

temperature range.

6.0

APPLICATION INFORMATION

The MCP1641X synchronous boost converter operates

over a wide input and output voltage range. The power

efficiency is high for several decades of load range. The

output current capability increases with the input voltage

and decreases with the output voltage. The maximum

output current is based on the N-Channel peak current

limit. Section 2.0 “Typical Performance Curves”

displays the typical output current capability.

6.1

Adjustable Output Voltage

Calculations

When R_TOPand R_BOTare higher, the efficiency of the

DC-DC conversion is optimized at very light loads.

For boost converters, the removal of the feedback

resistors during operation must be avoided. If feedback

resistors are removed during operation, the output

voltage increases above the absolute maximum output

limits of the MCP1641X and damages the device (for

additional information, see Application Note AN1337,

“Optimizing Battery Life in DC Boost Converters Using

MCP1640”, DS00001337).

To calculate the resistive divider values for the

MCP1641X, use Equation 6-1, where R_TOPis connected

to V_OUT, R_BOTis connected to GND, and both R_TOPand

R_BOTare connected to the V_FBinput pin.

EQUATION 6-1:

V_OUT





R_TOP= R_BOT ------------ – 1





V_FB

6.2

Programmable UVLO and LBO

Calculations

EXAMPLE 1:

This feature is used to increase the UVLO_START

threshold. To calculate the resistive divider values for a

new UVLO threshold, use Equation 6-2, where R_His

connected to V_IN, R_Lis connected to GND, and both R_H

and R_Lare connected to the UVLO input pin.

V_OUT= 1.8V

V_FB= 0.97V

R_BOT= 360 k

R_TOP= 309 k

The programmable UVLO resistors’ calculations result

in changing the low battery input detection level on the

down slope of the input voltage, as detailed in

Section 5.3.8 “Low Battery Detection”.

EXAMPLE 2:

V_OUT

V_FB

=

2.0V

0.97V

360 k

383 k

EQUATION 6-2:

R_BOT

R_TOP

UVLO_START





R_H= R_L ------------------------------ – 1





Vref_UVLO

EXAMPLE 3:

V_OUT

V_FB

=

3.3V

EXAMPLE 5:

0.97V

360 k

866 k

UVLO_START= 1.1V

R_BOT

R_TOP

Vref_UVLO= 485 mV

R_L= 430 k

R_H= 549 k

EXAMPLE 4:

V_OUT

V_FB

=

5.0V

EXAMPLE 6:

0.97V

360 k

1.5 M

UVLO_START= 1.8V

Vref_UVLO= 485 mV

R_L= 430 k

R_BOT

R_TOP

R_H= 1.165 Mwith a standard value

of 1.15 M, UVLO_STARTis

1.782V)

 2020-2021 Microchip Technology Inc.

DS20006394C-page 25

MCP1641X

6.3

Input Capacitor Selection

6.5

Inductor Selection

The boost input current is smoothed by the boost

inductor, reducing the amount of filtering necessary at

the input. Some capacitance is recommended to

provide decoupling from the source. Low-ESR X5R or

X7R ceramic capacitors are well-suited, due to their

low-temperature coefficient and small size. For most

applications, 10 µF of capacitance is sufficient at the

input. For high-power applications that have high

source impedance or long leads, connecting additional

input capacitance to the battery provides a stable input

voltage. Table 6-1 shows the recommended input

capacitor value range.

The MCP1641X is designed to be used with small

surface-mount inductors; the inductance value can

range from 2.2 µH to 4.7 µH. An inductance value of

4.7 µH is recommended to achieve a good balance

between inductor size, converter load transient

response and minimized noise. For an output below

2.0V, the inductor value must be reduced to 2.2 µH.

Several parameters should be considered when

selecting the correct inductor: maximum rated current,

saturation current and copper resistance (DCR). For

boost converters, the inductor current can be much

higher than the output current. The lower the inductor’s

DCR, the higher the efficiency of the converter; a

common trade-off in size versus efficiency. See

Table 6-2 for the recommended inductors.

6.4

Output Capacitor Selection

The output capacitor helps to provide a stable output

voltage during sudden load transients and reduces the

output voltage ripple. As with the input capacitor, X5R

and X7R ceramic capacitors are well-suited for this

application. While C_OUTprovides load current, a volt-

age drop also appears across its internal ESR that

results in ripple voltage. Using other capacitor types

(e.g., aluminum) with large ESR has a detrimental

impact on the converter’s efficiency and maximum

TABLE 6-2:

MCP1641X RECOMMENDED

INDUCTORS

Size

WxLxH

(mm)

Part

Number

Value

(µH)

DCR

 (typ.) (A)

I_SAT

Würth Elektronik

WE-MAIA

2.2

4.7

0.147

0.252

0.356

0.300

2.5

2.2

2.4

2.1

2.5x2x1

2.5x2x0.8

3x3x1

output power. For

a proper value, the output

capacitance can be estimated by Equation 6-3.

2.5x2x1.2

The MCP1641X is internally compensated, therefore,

the output capacitance range is limited to 20 µF.

WE-MAPI

2.2

4.7

0.123

0.150

0.300

0.267

2.9

3.9

2.1

3.8

2.5x2x1.2

3x3x1

2.5x2x1.2

3x3x1.2

An output capacitance higher than 10 µF adds a better

load step response and high-frequency noise

attenuation, especially while stepping from light loads

(PFM mode) to heavy loads (PWM mode).

WE-SPC

WE-LQS

4.7

0.086

2.9

4.8x4.8x2.8

2.2

4.7

0.08

0.091

1.95

1.9

2.5x2x1.2

4x4x1.2

For output voltages below 2V, 20 µF capacitance is

recommended.

Coilcraft

XAL4020

XAL4030

XEL4030

See Table 6-1 for the recommended output capacitor

range.

2.2

4.7

0.035

0.040

5.6

4.5

4x4x2.1

4x4x3.1

2.2

4.7

0.020

0.040

6.1

4.6

4x4x3.1

EQUATION 6-3:

dV

dt

XFL4020

XGL4020

2.2

4.7

0.0235

0.057

3.7

2.7

4x4x2.1







I_OUT= C_OUT ------



2.2

4.7

0.019

0.043

6.2

4.1

4x4x2.1

Where:

dV = Ripple voltage

LPS4018

LPS4012

4.7

2.2

0.125

0.1

1.9

2.5

3.9x3.9x1.7

3.9x3.9x1.1

dt = On-time of the N-Channel switch

TDK Corporation

(D x 1/f_SW, D is duty cycle)

VLS3012HBX 2.2

4.7

0.088

0.175

3.76

2.79

3x3x1.2

TABLE 6-1:

CAPACITOR VALUE RANGE

Eaton Electronics Division (Coiltronics)

SD3118

2.2

0.074

2.00

3.1x3.1x1.8

C_IN

C_OUT

MPI25-V2

2.2

4.7

0.087

0.235

3.5

1.9

2.5x2x1.25

Minimum

Maximum

10 µF

None

10 µF

20 µF

DS20006394C-page 26

 2020-2021 Microchip Technology Inc.

MCP1641X

The MCP1641X limits the inductor peak current to 1A;

for proper operation, an inductor with a saturation

current higher than this limit should be chosen. The

saturation current typically specifies a point at which

the inductance has rolled off a percentage of the rated

value. This can range from a 20% to 40% reduction in

inductance. As the inductance rolls off, the inductor cur-

rent ripple increases, so does the peak switch current.

It is important to keep the inductance from rolling off too

much as it can cause switch current to reach the peak

limit.

The difference between the first term, input power and

the second term, power delivered, is the internal

MCP1641X device’s power dissipation. This is an esti-

mate, assuming that most of the power lost is internal to

the MCP1641X and not by the C_IN, C_OUTor the inductor.

However, there is some percentage of power lost in the

boost inductor with very little loss in the input and output

capacitors. For a more accurate estimation of the

2

internal power dissipation, subtract the I_LRMSx L_DCR

power dissipation.

6.7

PCB Layout Information

6.6

Thermal Calculations

Good Printed Circuit Board layout techniques are

important to any switching circuitry and switching

power supplies is no different. When wiring the switch-

ing high-current paths, short and wide traces should be

used. Therefore, it is important that the input and output

capacitors should be placed as close as possible to the

MCP1641X to minimize the loop area.

The MCP1641X devices are available in two different

packages, 10-lead MSOP and 3 mm x 3 mm 10-lead

TDFN. The junction temperature is estimated by calcu-

lating the power dissipation and applying the package

thermal resistance (_JA). The maximum operating

junction temperature rating for the MCP1641X family of

devices is +125°C.

The feedback resistors and feedback signal should be

routed away from the switching node and the switching

current loop. When possible, ground planes and traces

should be used to help shield the feedback signal and

minimize noise and magnetic interference.

To quickly estimate the internal power dissipation for

the switching boost regulator, an empirical calculation

using measured efficiency can be applied, as

presented in Equation 6-4.

EQUATION 6-4:

V

 I

OUT OUT







------------------------------------- – V

 I

OUT OUT

 = P



Dis

Efficiency

+V

Enable

IN

L

C_IN

L

GND

MCP1641Xx

.

C_OUT

1

R_TOP

R_BOT

+V

OUT

UVLO LBO PGT

Via to GND Plane

MCP1641X Recommended Layout, Applicable to Both Packages.

FIGURE 6-1:

 2020-2021 Microchip Technology Inc.

DS20006394C-page 27

MCP1641X

NOTES:

DS20006394C-page 28

 2020-2021 Microchip Technology Inc.

MCP1641X

7.0

APPLICATION CIRCUIT EXAMPLES

V_OUT

5V

L₁

USB

4.7 µH

SW

V_OUT

V_BATT

1.5 M

V_OUTor V_IN

V_IN

C_OUT

10 µF

C_IN

R_H

+

–

V_OUTor V_IN

10 µF

V_FB

0.485V V_REF

UVLO

EN

360 k

1 M

430 k

ENABLE

1 M

PGT

LBO

ON

OFF

GND

V_DD

RA2

RA1

RA3

V_SS

EN

PIC10F320

Note:

The PIC^®microcontroller detects when the battery is depleted (using the LBO signal) and keeps the

switching regulator in Shutdown mode to avoid overdischarging. This kind of application uses

MCP16413/4/7/8 options (Input-to-Output Bypass in Shutdown mode).

FIGURE 7-1:

Single Cell for USB Application Using Bypass Mode.

L₁

V_IN

4.7 µH

0.8V to 4.5V

V_OUT

SW

3.3V or V_IN

V_OUT

+

V_IN

C_OUT

R_H

866 k

360 k

10 µF

V_OUT

C_IN

10 µF

V_OUT

V_FB

V_REF

0.485V

–

+

UVLO

EN

1-3 Cells

1 M

430 k

1 M

ENABLE

ON

OFF

PGT

LBO

To PIC^®MCU

GND

–

Note:

For V_IN< V_OUT, the device operates in Boost mode; otherwise, for V_IN> V_OUT, V_INis bypassed to V_OUT.

FIGURE 7-2:

Multiple Cell Operation with Automatic Input-to-Output Bypass Mode.

 2020-2021 Microchip Technology Inc.

DS20006394C-page 29

MCP1641X

L₁

UVLO _START= 3.3V

LBO = 2.8V

4.7 µH

V_OUT

5V

SW

R_H1

1.5 M

V_OUT

C_IN

10 µF

V_IN

R_H

226 k

1.5 M

360 k

C_OUT

+

–

PGT

10 µF

V_FB

NMOS

UVLO

1 M

R_L

39.2 k

EN

PGT

LBO

GND

ENABLE

LOW BATTERY (2.8V)

Note:

R_Hand R_Lset the UVLO_STARTto 3.3V. For battery voltage higher than 3.3V, the switching is enabled and

the device regulates to 5V. After start-up, the PGT signal turns on the NMOS switch and puts in parallel

R_Hand R_H1, and UVLO_STARTchanges to 2.8V. As a result, when the battery gets discharged to 2.8V, the

LBO switches to a low level to indicate the low battery warning.

V_INꢀIURPꢀꢁ9ꢀWRꢀꢂꢃꢄ9

I_/2$'ꢀ= 10 mA

V_IN

1V/div

LBO Signal

2V/div

V_OUTꢀ

2V/div

1s/div

FIGURE 7-3:

Dynamic LBO Threshold to Help Optimize Li-Ion Battery Life.

DS20006394C-page 30

 2020-2021 Microchip Technology Inc.

MCP1641X

L₁

4.7 µH

UVLO _START= 3.3V

UVLO_STOP= 3.3V – LBI_HYS

V_OUT

5V

SW

V_OUT

C_IN

10 µF

R_H

560 k

V_IN

1.5 M

C_OUT

10 µF

+

V_FB

R_EN

10 k

UVLO

1 M

360 k

R_L

100 k

–

EN

PGT

LBO

GND

ENABLE

PGT

Q₁

LBO

9_,1ꢀIURPꢀꢁ9ꢀWRꢀꢂꢃꢄ9

9_,1

,_/2$'ꢀ ꢀꢅꢁꢀP$

ꢅ9ꢆGLY

/%2ꢀ6LJQDO

ꢄ9ꢆGLY

9₂₈₇

ꢄ9ꢆGLY

FIGURE 7-4:

Simple Method for Increased UVLO_STOPfor Li-Ion Battery Applications to the

UVLO_STARTValue (minus internal LBI comparator’s hysteresis of 20 mV, typically).

 2020-2021 Microchip Technology Inc.

DS20006394C-page 31

MCP1641X

L₁

4.7 µH

UVLO _START= 3.3V

UVLO _STOP= 2.8V

V_OUT

5V

SW

R_H1

1.5 M

V_OUT

C_IN

10 µF

V_IN

R_H

1.5 M

360 k

226 k

C_OUT

+

–

PGT

10 µF

V_FB

R_EN

10 k

NMOS

UVLO

1 M

R_L

39.2 k

EN

PGT

LBO

GND

ENABLE

PGT

Q₁

LOW BATTERY (2.8V)

Note:

R_Hand R_Lset the UVLO_STARTto 3.3V. For battery voltage higher than 3.3V, the switching is enabled

and the device regulates to 5V. After start-up, the PGT signal turns on the N-MOS switch and puts in

parallel R_Hand R_H1and UVLO_STARTchanges dynamically from 3.3V to 2.8V. As a result, when the

battery gets discharged to 2.8V, the LBO switches to low level, turns on the NPN transistor (Q₁) and

asserts to low the enable input, turning off the output of the converter.

V_INꢀIURPꢀꢁ9ꢀWRꢀꢂꢃꢄ9

V_IN

1V/div

I_/2$'ꢀ= 10 mA

LBO Signal

2V/div

V_OUTꢀ

2V/div

1s/div

FIGURE 7-5:

Dynamic Changing Method for UVLOs’ Thresholds with Output Shutdown at 2.8V to

Protect Li-Ion Batteries from Overdischarging.

DS20006394C-page 32

 2020-2021 Microchip Technology Inc.

MCP1641X

8.0

8.1

PACKAGING INFORMATION

Package Marking Information

Example

10-Lead MSOP (3x3 mm)

16411

XXXXXX

01256

YWWNNN

10-Lead TDFN (3x3 mm)

Example

XXXX

YYWW

NNN

PIN 1

6411

2015

256

PIN 1

Legend: XX...X Customer-specific information

Y

YY

WW

NNN

Year code (last digit of calendar year)

Year code (last 2 digits of calendar year)

Week code (week of January 1 is week ‘01’)

Alphanumeric traceability code

Pb-free JEDEC^®designator for Matte Tin (Sn)

e

3

*

This package is Pb-free. The Pb-free JEDEC designator ( )

e

3

can be found on the outer packaging for this package.

Note: In the event the full Microchip part number cannot be marked on one line, it will

be carried over to the next line, thus limiting the number of available

characters for customer-specific information.

 2020-2021 Microchip Technology Inc.

DS20006394C-page 33

MCP1641X

UN

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

DS20006394C-page 34

 2020-2021 Microchip Technology Inc.

MCP1641X

UN

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

 2020-2021 Microchip Technology Inc.

DS20006394C-page 35

MCP1641X

10-Lead Plastic Micro Small Outline Package (UN) [MSOP]

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

DS20006394C-page 36

 2020-2021 Microchip Technology Inc.

MCP1641X

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

 2020-2021 Microchip Technology Inc.

DS20006394C-page 37

MCP1641X

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

DS20006394C-page 38

 2020-2021 Microchip Technology Inc.

MCP1641X

APPENDIX A: REVISION HISTORY

Revision C (April 2021)

• Updated the AC/DC Characteristics table.

• Updated Table 6-2, Figure 7-3, Figure 7-4 and

Figure 7-5.

• Editorial changes and updates.

Revision B (September 2020)

• Updated the AC/DC Characteristics table.

Revision A (September 2020)

• Initial release of this document.

 2020-2021 Microchip Technology Inc.

DS20006394C-page 39

MCP1641X

NOTES:

DS20006394C-page 40

 2020-2021 Microchip Technology Inc.

MCP1641X

PRODUCT IDENTIFICATION SYSTEM

To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.

Examples:

(1)

X

-X

/XX

PART NO.

Device

a) MCP16411-I/MN:

Industrial Temperature, 

10-LD TDFN package

Package

Type

Tape and

Reel

Temperature

Range

b) MCP16411T-I/MN: Tape and Reel, Industrial Temperature,

10-LD TDFN package



c) MCP16412-I/MN:

Industrial Temperature,



10-LD TDFN package

d) MCP16412T-I/MN: Tape and Reel, Industrial Temperature,

10-LD TDFN package

Device:

MCP1641X:

Low I_QBoost Converter with

Programmable Low Battery, UVLO and

Automatic Input-to-Output Bypass

Operation

e) MCP16413-I/MN:

Industrial Temperature,

10-LD TDFN package

MCP16413T-I/MN: Tape and Reel, Industrial Temperature,

10-LD TDFN package



f)



X = Device Option Number

g) MCP16414-I/MN:

Industrial Temperature,



10-LD TDFN package

Options:

MCP16411:

MCP16412:

MCP16413:

MCP16414:

MCP16415:

MCP16416:

MCP16417:

MCP16418:

PFM/PWM, Output Discharge and PGT

h) MCP16414T-I/MN: Tape and Reel, Industrial Temperature,

10-LD TDFN package



PFM Only, Output Discharge and PGT

PFM/PWM, In-Out Bypass and PGT

PWM Only, In-Out Bypass and PGT

PFM/PWM, Output Discharge and PG

PWM Only, Output Discharge and PG

PFM/PWM, In-Out Bypass and PG

PWM Only, In-Out Bypass and PG

i)

MCP16415-I/MN:

Industrial Temperature,



10-LD TDFN package

j)

MCP16415T-I/MN: Tape and Reel, Industrial Temperature,

10-LD TDFN package

k) MCP16416-I/MN:

Industrial Temperature,

10-LD TDFN package

MCP16416T-I/MN: Tape and Reel, Industrial Temperature,

10-LD TDFN package



l)

m) MCP16417-I/MN:

Industrial Temperature,



10-LD TDFN package

n) MCP16417T-I/MN: Tape and Reel, Industrial Temperature,

10-LD TDFN package

Tape and Reel Blank= Standard Packaging (tube)

Option

T

=

Tape and Reel

o) MCP16418-I/MN:

Industrial Temperature,



10-LD TDFN package

Temperature

Range

I

=

-40C to +85C (Industrial)

p) MCP16418T-I/MN: Tape and Reel, Industrial Temperature,

10-LD TDFN package

Package Type MN

=

10-Lead Thin Plastic Dual Flat, TDFN

10-Lead Plastic Micro Small Outline, MSOP

q) MCP16411-I/UN:

Industrial Temperature,



UN

10-LD MSOP package

r) MCP16411T-I/UN: Tape and Reel, Industrial Temperature,

10-LD MSOP package

s) MCP16412-I/UN:

Industrial Temperature,

10-LD MSOP package

MCP16412T-I/UN: Tape and Reel, Industrial Temperature,

10-LD MSOP package

Industrial Temperature,

10-LD MSOP package



t)

u) MCP16413-I/UN:



v) MCP16413T-I/UN: Tape and Reel, Industrial Temperature,

10-LD MSOP package

w) MCP16414-I/UN:

Industrial Temperature,



10-LD MSOP package

x) MCP16414T-I/UN: Tape and Reel, Industrial Temperature,

10-LD MSOP package

y) MCP16415-I/UN:

Industrial Temperature,

10-LD MSOP package

z) MCP16415T-I/UN: Tape and Reel, Industrial Temperature,

10-LD MSOP package

Industrial Temperature,

10-LD MSOP package



aa) MCP16416-I/UN:



ab) MCP16416T-I/UN: Tape and Reel, Industrial Temperature,

10-LD MSOP package



ac) MCP16417-I/UN:

Industrial Temperature,



10-LD MSOP package

ad) MCP16417T-I/UN: Tape and Reel, Industrial Temperature,

10-LD MSOP package

ae) MCP16418-I/UN:

Industrial Temperature,



10-LD MSOP package

af) MCP16418T-I/UN: Tape and Reel, Industrial Temperature,

10-LD MSOP package

Note 1:

Tape and Reel identifier only appears in the catalog

part number description. This identifier is used for

ordering purposes and is not printed on the device

package. Check with your Microchip Sales Office for

package availability with the Tape and Reel option.

 2020-2021 Microchip Technology Inc.

DS20006394C-page 41

MCP1641X

NOTES:

DS20006394C-page 42

 2020-2021 Microchip Technology Inc.

Note the following details of the code protection feature on Microchip devices:

•

Microchip products meet the specifications contained in their particular Microchip Data Sheet.

Microchip believes that its family of products is secure when used in the intended manner and under normal conditions.

There are dishonest and possibly illegal methods being used in attempts to breach the code protection features of the Microchip

devices. We believe that these methods require using the Microchip products in a manner outside the operating specifications

contained in Microchip's Data Sheets. Attempts to breach these code protection features, most likely, cannot be accomplished

without violating Microchip's intellectual property rights.

•

Microchip is willing to work with any customer who is concerned about the integrity of its code.

Neither Microchip nor any other semiconductor manufacturer can guarantee the security of its code. Code protection does not

mean that we are guaranteeing the product is "unbreakable." Code protection is constantly evolving. We at Microchip are

committed to continuously improving the code protection features of our products. Attempts to break Microchip's code protection

feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or

other copyrighted work, you may have a right to sue for relief under that Act.

Information contained in this publication is provided for the sole

purpose of designing with and using Microchip products. Infor-

mation regarding device applications and the like is provided

only for your convenience and may be superseded by updates.

It is your responsibility to ensure that your application meets

with your specifications.

Trademarks

The Microchip name and logo, the Microchip logo, Adaptec,

AnyRate, AVR, AVR logo, AVR Freaks, BesTime, BitCloud, chipKIT,

chipKIT logo, CryptoMemory, CryptoRF, dsPIC, FlashFlex,

flexPWR, HELDO, IGLOO, JukeBlox, KeeLoq, Kleer, LANCheck,

LinkMD, maXStylus, maXTouch, MediaLB, megaAVR, Microsemi,

Microsemi logo, MOST, MOST logo, MPLAB, OptoLyzer,

PackeTime, PIC, picoPower, PICSTART, PIC32 logo, PolarFire,

Prochip Designer, QTouch, SAM-BA, SenGenuity, SpyNIC, SST,

SST Logo, SuperFlash, Symmetricom, SyncServer, Tachyon,

TimeSource, tinyAVR, UNI/O, Vectron, and XMEGA are registered

trademarks of Microchip Technology Incorporated in the U.S.A. and

other countries.

THIS INFORMATION IS PROVIDED BY MICROCHIP "AS IS".

MICROCHIP MAKES NO REPRESENTATIONS OR WAR-

RANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED,

WRITTEN OR ORAL, STATUTORY OR OTHERWISE,

RELATED TO THE INFORMATION INCLUDING BUT NOT

LIMITED TO ANY IMPLIED WARRANTIES OF NON-

INFRINGEMENT, MERCHANTABILITY, AND FITNESS FOR A

PARTICULAR PURPOSE OR WARRANTIES RELATED TO

ITS CONDITION, QUALITY, OR PERFORMANCE.

AgileSwitch, APT, ClockWorks, The Embedded Control Solutions

Company, EtherSynch, FlashTec, Hyper Speed Control, HyperLight

Load, IntelliMOS, Libero, motorBench, mTouch, Powermite 3,

Precision Edge, ProASIC, ProASIC Plus, ProASIC Plus logo, Quiet-

Wire, SmartFusion, SyncWorld, Temux, TimeCesium, TimeHub,

TimePictra, TimeProvider, WinPath, and ZL are registered

trademarks of Microchip Technology Incorporated in the U.S.A.

IN NO EVENT WILL MICROCHIP BE LIABLE FOR ANY INDI-

RECT, SPECIAL, PUNITIVE, INCIDENTAL OR CONSEQUEN-

TIAL LOSS, DAMAGE, COST OR EXPENSE OF ANY KIND

WHATSOEVER RELATED TO THE INFORMATION OR ITS

USE, HOWEVER CAUSED, EVEN IF MICROCHIP HAS

BEEN ADVISED OF THE POSSIBILITY OR THE DAMAGES

ARE FORESEEABLE. TO THE FULLEST EXTENT

ALLOWED BY LAW, MICROCHIP'S TOTAL LIABILITY ON

ALL CLAIMS IN ANY WAY RELATED TO THE INFORMATION

OR ITS USE WILL NOT EXCEED THE AMOUNT OF FEES, IF

ANY, THAT YOU HAVE PAID DIRECTLY TO MICROCHIP

FOR THE INFORMATION. Use of Microchip devices in life sup-

port and/or safety applications is entirely at the buyer's risk, and

the buyer agrees to defend, indemnify and hold harmless

Microchip from any and all damages, claims, suits, or expenses

resulting from such use. No licenses are conveyed, implicitly or

otherwise, under any Microchip intellectual property rights

unless otherwise stated.

Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any

Capacitor, AnyIn, AnyOut, Augmented Switching, BlueSky,

BodyCom, CodeGuard, CryptoAuthentication, CryptoAutomotive,

CryptoCompanion, CryptoController, dsPICDEM, dsPICDEM.net,

Dynamic Average Matching, DAM, ECAN, Espresso T1S,

EtherGREEN, IdealBridge, In-Circuit Serial Programming, ICSP,

INICnet, Intelligent Paralleling, Inter-Chip Connectivity,

JitterBlocker, maxCrypto, maxView, memBrain, Mindi, MiWi,

MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK,

NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net,

PICkit, PICtail, PowerSmart, PureSilicon, QMatrix, REAL ICE,

Ripple Blocker, RTAX, RTG4, SAM-ICE, Serial Quad I/O,

simpleMAP, SimpliPHY, SmartBuffer, SMART-I.S., storClad, SQI,

SuperSwitcher, SuperSwitcher II, Switchtec, SynchroPHY, Total

Endurance, TSHARC, USBCheck, VariSense, VectorBlox, VeriPHY,

ViewSpan, WiperLock, XpressConnect, and ZENA are trademarks

of Microchip Technology Incorporated in the U.S.A. and other

countries.

SQTP is a service mark of Microchip Technology Incorporated in

the U.S.A.

The Adaptec logo, Frequency on Demand, Silicon Storage

Technology, and Symmcom are registered trademarks of Microchip

Technology Inc. in other countries.

GestIC is a registered trademark of Microchip Technology Germany

II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in

other countries.

All other trademarks mentioned herein are property of their

respective companies.

Reserved.

For information regarding Microchip’s Quality Management Systems,

please visit www.microchip.com/quality.

ISBN: 978-1-5224-8043-3

 2020-2021 Microchip Technology Inc.

DS20006394C-page 43

Worldwide Sales and Service

AMERICAS

ASIA/PACIFIC

EUROPE

Corporate Office

2355 West Chandler Blvd.

Chandler, AZ 85224-6199

Tel: 480-792-7200

Fax: 480-792-7277

Technical Support:

http://www.microchip.com/

support

Australia - Sydney

Tel: 61-2-9868-6733

India - Bangalore

Tel: 91-80-3090-4444

Austria - Wels

Tel: 43-7242-2244-39

Fax: 43-7242-2244-393

China - Beijing

Tel: 86-10-8569-7000

India - New Delhi

Tel: 91-11-4160-8631

Denmark - Copenhagen

Tel: 45-4485-5910

Fax: 45-4485-2829

China - Chengdu

Tel: 86-28-8665-5511

India - Pune

Tel: 91-20-4121-0141

Finland - Espoo

Tel: 358-9-4520-820

China - Chongqing

Tel: 86-23-8980-9588

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Tel: 81-6-6152-7160

Web Address:

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Tel: 678-957-9614

Fax: 678-957-1455

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Philippines - Manila

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Tel: 63-2-634-9065

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Fax: 630-285-0075

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Novi, MI

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Thailand - Bangkok

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Italy - Padova

Tel: 39-049-7625286

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Tel: 281-894-5983

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Tel: 86-29-8833-7252

Vietnam - Ho Chi Minh

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Netherlands - Drunen

Tel: 31-416-690399

Fax: 31-416-690340

Indianapolis

Noblesville, IN

Tel: 317-773-8323

Fax: 317-773-5453

Tel: 317-536-2380

China - Xiamen

Tel: 86-592-2388138

Norway - Trondheim

Tel: 47-7288-4388

China - Zhuhai

Tel: 86-756-3210040

Poland - Warsaw

Tel: 48-22-3325737

Los Angeles

Mission Viejo, CA

Tel: 949-462-9523

Fax: 949-462-9608

Tel: 951-273-7800

Romania - Bucharest

Tel: 40-21-407-87-50

Spain - Madrid

Tel: 34-91-708-08-90

Fax: 34-91-708-08-91

Raleigh, NC

Tel: 919-844-7510

Sweden - Gothenberg

Tel: 46-31-704-60-40

New York, NY

Tel: 631-435-6000

Sweden - Stockholm

Tel: 46-8-5090-4654

San Jose, CA

Tel: 408-735-9110

Tel: 408-436-4270

UK - Wokingham

Tel: 44-118-921-5800

Fax: 44-118-921-5820

Canada - Toronto

Tel: 905-695-1980

Fax: 905-695-2078

DS20006394C-page 44

 2020-2021 Microchip Technology Inc.

02/28/20


型号：	MCP16415-I/UN
厂家：	MICROCHIP
描述：	Low IQ Boost Converter with Programmable Low Battery, UVLO and Automatic Input-to-Output Bypass Operation 电池
文件：	总44页 (文件大小：1474K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

MCP16415-I/UN [MICROCHIP]

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