MCP3201T-CI/ST [MICROCHIP]
2.7V 12-Bit A/D Converter with SPI Serial Interface; 2.7V 12位A / D转换器,带有SPI串行接口型号: | MCP3201T-CI/ST |
厂家: | MICROCHIP |
描述: | 2.7V 12-Bit A/D Converter with SPI Serial Interface |
文件: | 总36页 (文件大小:685K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
MCP3201
2.7V 12-Bit A/D Converter with SPI Serial Interface
Features
Description
• 12-bit resolution
The Microchip Technology Inc. MCP3201 device is a
successive approximation 12-bit Analog-to-Digital
(A/D) Converter with on-board sample and hold
circuitry. The device provides a single pseudo-differen-
tial input. Differential Nonlinearity (DNL) is specified at
±1 LSB, and Integral Nonlinearity (INL) is offered in
±1 LSB (MCP3201-B) and ±2 LSB (MCP3201-C)
versions. Communication with the device is done using
a simple serial interface compatible with the SPI
protocol. The device is capable of sample rates of up to
100 ksps at a clock rate of 1.6 MHz. The MCP3201
device operates over a broad voltage range (2.7V -
5.5V). Low-current design permits operation with
typical standby and active currents of only 500 nA and
300 µA, respectively. The device is offered in 8-pin
MSOP, PDIP, TSSOP and 150 mil SOIC packages.
• ±1 LSB max DNL
• ±1 LSB max INL (MCP3201-B)
• ±2 LSB max INL (MCP3201-C)
• On-chip sample and hold
• SPI serial interface (modes 0,0 and 1,1)
• Single supply operation: 2.7V - 5.5V
• 100 ksps maximum sampling rate at VDD = 5V
• 50 ksps maximum sampling rate at VDD = 2.7V
• Low power CMOS technology
• 500 nA typical standby current, 2 µA maximum
• 400 µA maximum active current at 5V
• Industrial temp range: -40°C to +85°C
• 8-pin MSOP, PDIP, SOIC and TSSOP packages
Package Types
Applications
• Sensor Interface
MSOP, PDIP, SOIC, TSSOP
• Process Control
• Data Acquisition
VREF
1
8
VDD
• Battery Operated Systems
IN+
IN–
VSS
2
3
4
7
6
5
CLK
Functional Block Diagram
DOUT
CS/SHDN
V
V
SS
DD
V
REF
DAC
Comparator
12-Bit SAR
IN+
IN-
Sample
and
Hold
Shift
Register
Control Logic
CS/SHDN CLK
D
OUT
© 2008 Microchip Technology Inc.
DS21290E-page 1
MCP3201
NOTES:
DS21290E-page 2
© 2008 Microchip Technology Inc.
MCP3201
†Notice: Stresses above those listed under “Maximum
ratings” may cause permanent damage to the device. This is
a stress rating only and functional operation of the device at
those or any other conditions above those indicated in the
operational listings of this specification is not implied.
Exposure to maximum rating conditions for extended periods
may affect device reliability.
1.0
1.1
ELECTRICAL
CHARACTERISTICS
Maximum Ratings†
VDD...................................................................................7.0V
All inputs and outputs w.r.t. VSS ................ -0.6V to VDD +0.6V
Storage temperature .....................................-65°C to +150°C
Ambient temp. with power applied................-65°C to +125°C
ESD protection on all pins (HBM) .................................> 4 kV
ELECTRICAL CHARACTERISTICS
Electrical Specifications: All parameters apply at VDD = 5V, VSS = 0V, VREF = 5V, TA = -40°C to +85°C, fSAMPLE = 100 ksps, and
fCLK = 16*fSAMPLE, unless otherwise noted.
Parameter
Conversion Rate:
Sym
Min
Typ
Max
Units
Conditions
Conversion Time
tCONV
—
—
1.5
—
12
clock
cycles
Analog Input Sample Time
Throughput Rate
tSAMPLE
fSAMPLE
clock
cycles
—
100
50
ksps
ksps
VDD = VREF = 5V
DD = VREF = 2.7V
V
DC Accuracy:
Resolution
12
bits
Integral Nonlinearity
INL
—
—
±0.75
±1
±1
±2
LSB
LSB
MCP3201-B
MCP3201-C
Differential Nonlinearity
DNL
—
±0.5
±1
LSB
No missing codes over
temperature
Offset Error
—
—
±1.25
±1.25
±3
±5
LSB
LSB
Gain Error
Dynamic Performance:
Total Harmonic Distortion
THD
—
—
-82
72
—
—
dB
dB
VIN = 0.1V to 4.9V@1 kHz
VIN = 0.1V to 4.9V@1 kHz
Signal to Noise and Distortion
(SINAD)
SINAD
Spurious Free Dynamic Range
Reference Input:
Voltage Range
SFDR
—
86
—
—
dB
VIN = 0.1V to 4.9V@1 kHz
0.25
VDD
V
Note 2
Current Drain
—
—
100
.001
150
3
µA
µA
CS = VDD = 5V
Analog Inputs:
Input Voltage Range (IN+)
Input Voltage Range (IN-)
Leakage Current
IN+
IN-
IN-
VSS-100
—
—
VREF+IN-
V
mV
µA
W
VSS+100
0.001
1K
±1
—
—
Switch Resistance
RSS
—
See Figure 4-1
See Figure 4-1
Sample Capacitor
CSAMPLE
—
20
pF
Digital Input/Output:
Data Coding Format
High Level Input Voltage
Low Level Input Voltage
Straight Binary
VIH
VIL
0.7 VDD
—
—
—
—
V
V
0.3 VDD
Note 1: This parameter is established by characterization and not 100% tested.
2: See graph that relates linearity performance to VREF level.
3: Because the sample cap will eventually lose charge, effective clock rates below 10 kHz can affect linearity performance,
especially at elevated temperatures. See Section 6.2 “Maintaining Minimum Clock Speed” for more information.
© 2008 Microchip Technology Inc.
DS21290E-page 3
MCP3201
ELECTRICAL CHARACTERISTICS (CONTINUED)
Electrical Specifications: All parameters apply at VDD = 5V, VSS = 0V, VREF = 5V, TA = -40°C to +85°C, fSAMPLE = 100 ksps, and
fCLK = 16*fSAMPLE, unless otherwise noted.
Parameter
Sym
Min
Typ
Max
Units
Conditions
High Level Output Voltage
Low Level Output Voltage
Input Leakage Current
Output Leakage Current
VOH
VOL
4.1
—
—
—
—
—
—
—
0.4
10
10
10
V
IOH = -1 mA, VDD = 4.5V
IOL = 1 mA, VDD = 4.5V
VIN = VSS or VDD
V
ILI
-10
-10
—
µA
µA
pF
ILO
VOUT = VSS or VDD
Pin Capacitance
CIN, COUT
VDD = 5.0V (Note 1)
(all inputs/outputs)
TA = +25°C, f = 1 MHz
Timing Parameters:
Clock Frequency
fCLK
—
—
—
—
1.6
0.8
MHz
MHz
VDD = 5V (Note 3)
V
DD = 2.7V (Note 3)
Clock High Time
tHI
tLO
tSUCS
tDO
312
312
100
—
—
—
—
—
—
—
—
—
ns
ns
ns
ns
ns
ns
Clock Low Time
CS Fall To First Rising CLK Edge
CLK Fall To Output Data Valid
CLK Fall To Output Enable
CS Rise To Output Disable
—
200
200
100
See Test Circuits, Figure 1-2
See Test Circuits, Figure 1-2
tEN
—
tDIS
—
See Test Circuits, Figure 1-2
(Note 1)
CS Disable Time
DOUT Rise Time
tCSH
tR
625
—
—
—
—
ns
ns
100
See Test Circuits, Figure 1-2
(Note 1)
DOUT Fall Time
tF
—
—
—
100
5.5
ns
V
See Test Circuits, Figure 1-2
(Note 1)
Power Requirements:
Operating Voltage
Operating Current
VDD
IDD
2.7
—
—
300
210
400
—
µA
µA
VDD = 5.0V, DOUT unloaded
V
DD = 2.7V, DOUT unloaded
Standby Current
IDDS
—
0.5
2
µA
CS = VDD = 5.0V
Note 1: This parameter is established by characterization and not 100% tested.
2: See graph that relates linearity performance to VREF level.
3: Because the sample cap will eventually lose charge, effective clock rates below 10 kHz can affect linearity performance,
especially at elevated temperatures. See Section 6.2 “Maintaining Minimum Clock Speed” for more information.
TEMPERATURE CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, VDD = +2.7V to +5.5V, VSS = GND.
Parameters
Sym
Min
Typ
Max
Units
Conditions
Temperature Ranges
Specified Temperature Range
Operating Temperature Range
Storage Temperature Range
Thermal Package Resistances
Thermal Resistance, 8L-MSOP
Thermal Resistance, 8L-PDIP
Thermal Resistance, 8L-SOIC
Thermal Resistance, 8L-TSSOP
TA
TA
TA
-40
-40
-65
—
—
—
+85
+85
°C
°C
°C
+150
θJA
θJA
θJA
θJA
—
—
—
—
211
89.5
149.5
139
—
—
—
—
°C/W
°C/W
°C/W
°C/W
DS21290E-page 4
© 2008 Microchip Technology Inc.
MCP3201
tCSH
CS
tSUCS
tHI
tLO
CLK
tEN
tDO
tDIS
tR
tF
HI-Z
HI-Z
LSB
DOUT
MSB OUT
NULL BIT
FIGURE 1-1:
Serial Timing.
Load circuit for tDIS and tEN
Load circuit for tR, tF, tDO
1.4V
Test Point
VDD
tDIS Waveform 2
3 kΩ
Test Point
VDD/2
3 kΩ
DOUT
tEN Waveform
DOUT
30 pF
t
DIS Waveform 1
CL = 30 pF
VSS
Voltage Waveforms for tR, tF
Voltage Waveforms for tEN
VOH
VOL
DOUT
CS
tF
tR
1
2
3
4
CLK
B9
DOUT
tEN
Voltage Waveforms for tDO
Voltage Waveforms for tDIS
VIH
CS
DOUT
CLK
90%
tDO
Waveform 1*
tDIS
DOUT
10%
DOUT
Waveform 2†
* Waveform 1 is for an output with internal condi-
tions such that the output is high, unless disabled
by the output control.
† Waveform 2 is for an output with internal condi-
tions such that the output is low, unless disabled
by the output control.
FIGURE 1-2:
Test Circuits.
© 2008 Microchip Technology Inc.
DS21290E-page 5
MCP3201
NOTES:
DS21290E-page 6
© 2008 Microchip Technology Inc.
MCP3201
2.0
TYPICAL PERFORMANCE CHARACTERISTICS
Note: The graphs provided following this note are a statistical summary based on a limited number of samples
and are provided for informational purposes only. The performance characteristics listed herein are not
tested or guaranteed. In some graphs, the data presented may be outside the specified operating range
(e.g., outside specified power supply range) and therefore outside the warranted range.
Note: Unless otherwise indicated, VDD = VREF = 5V, VSS = 0V, fSAMPLE = 100 ksps, fCLK = 16*fSAMPLE, TA = +25°C.
1.0
0.8
0.6
0.4
0.2
2.0
1.5
VDD = VREF = 2.7V
Positive INL
Negative INL
1.0
Positive INL
0.5
0.0
0.0
-0.2
-0.4
-0.6
-0.8
-1.0
-0.5
-1.0
-1.5
-2.0
Negative INL
0
25
50
75
100
125
150
0
20
40
60
80
100
Sample Rate (ksps)
Sample Rate (ksps)
FIGURE 2-1:
Integral Nonlinearity (INL)
FIGURE 2-4:
Integral Nonlinearity (INL)
vs. Sample Rate.
vs. Sample Rate (V = 2.7V).
DD
2.0
1.5
2.0
1.5
VDD = 2.7V
FSAMPLE = 50 ksps
1.0
0.5
Positive INL
1.0
Positive INL
0.5
0.0
0.0
-0.5
-1.0
-1.5
-2.0
-0.5
-1.0
-1.5
-2.0
Negative INL
Negative INL
0
1
2
3
4
5
0.0
0.5
1.0
1.5
2.0
2.5
3.0
VREF (V)
VREF (V)
FIGURE 2-2:
Integral Nonlinearity (INL)
FIGURE 2-5:
Integral Nonlinearity (INL)
vs. V
vs. V
(V = 2.7V).
REF.
REF
DD
1.0
0.8
1.0
0.8
0.6
0.4
0.2
VDD = VREF = 2.7V
FSAMPLE = 50 ksps
0.6
0.4
0.2
0.0
0.0
-0.2
-0.4
-0.6
-0.8
-1.0
-0.2
-0.4
-0.6
-0.8
-1.0
0
512 1024 1536 2048 2560 3072 3584 4096
0
512 1024 1536 2048 2560 3072 3584 4096
Digital Code
Digital Code
FIGURE 2-3:
Integral Nonlinearity (INL)
FIGURE 2-6:
Integral Nonlinearity (INL)
vs. Code (Representative Part).
vs. Code (Representative Part, V = 2.7V).
DD
© 2008 Microchip Technology Inc.
DS21290E-page 7
MCP3201
Note: Unless otherwise indicated, VDD = VREF = 5V, VSS = 0V, fSAMPLE = 100 ksps, fCLK = 16*fSAMPLE, TA = +25°C.
1.0
0.8
1.0
0.8
VDD = VREF = 2.7V
FSAMPLE = 50 ksps
Positive INL
Positive INL
0.6
0.6
0.4
0.4
0.2
0.2
0.0
0.0
Negative INL
-0.2
-0.4
-0.6
-0.8
-1.0
-0.2
-0.4
-0.6
-0.8
-1.0
Negative INL
25
-50
-25
0
50
75
100
-50
-25
0
25
50
75
100
Temperature (°C)
Temperature (°C)
FIGURE 2-7:
Integral Nonlinearity (INL)
FIGURE 2-10:
Integral Nonlinearity (INL)
vs. Temperature.
vs. Temperature (V = 2.7V).
DD
1.0
0.8
0.6
2.0
VDD = VREF = 2.7V
1.5
1.0
0.4
0.2
Positive DNL
Positive DNL
0.5
0.0
0.0
-0.2
-0.4
-0.6
-0.8
-1.0
-0.5
-1.0
-1.5
-2.0
Negative DNL
Negative DNL
0
25
50
75
100
125
150
0
20
40
60
80
100
Sample Rate (ksps)
Sample Rate (ksps)
FIGURE 2-8:
Differential Nonlinearity
FIGURE 2-11:
Differential Nonlinearity
(DNL) vs. Sample Rate.
(DNL) vs. Sample Rate (V = 2.7V).
DD
3.0
2.0
3.0
VDD = 2.7V
FSAMPLE = 50 ksps
2.0
1.0
Positive DNL
1.0
0.0
Positive DNL
Negative DNL
0.0
-1.0
-2.0
-3.0
Negative DNL
-1.0
-2.0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
0
1
2
3
4
5
VREF(V)
VREF (V)
FIGURE 2-9:
(DNL) vs. V
Differential Nonlinearity
FIGURE 2-12:
(DNL) vs. V
Differential Nonlinearity
(V = 2.7V).
.
REF
REF
DD
DS21290E-page 8
© 2008 Microchip Technology Inc.
MCP3201
Note: Unless otherwise indicated, VDD = VREF = 5V, VSS = 0V, fSAMPLE = 100 ksps, fCLK = 16*fSAMPLE, TA = +25°C.
1.0
1.0
0.8
0.6
VDD = VREF = 2.7V
0.8
0.6
FSAMPLE = 50 ksps
0.4
0.4
0.2
0.2
0.0
0.0
-0.2
-0.4
-0.6
-0.8
-1.0
-0.2
-0.4
-0.6
-0.8
-1.0
0
512 1024 1536 2048 2560 3072 3584 4096
Digital Code
0
512 1024 1536 2048 2560 3072 3584 4096
Digital Code
FIGURE 2-13:
Differential Nonlinearity
FIGURE 2-16:
Differential Nonlinearity
(DNL) vs. Code (Representative Part).
(DNL) vs. Code (Representative Part,
V
= 2.7V).
DD
1.0
1.0
0.8
0.6
VDD = 2.7V
SAMPLE = 50ksps
0.8
0.6
F
Positive DNL
Negative DNL
0.4
0.4
0.2
Positive DNL
Negative DNL
0.2
0.0
0.0
-0.2
-0.4
-0.6
-0.8
-1.0
-0.2
-0.4
-0.6
-0.8
-1.0
-50
-25
0
25
50
75
100
-50
-25
0
25
50
75
100
Temperature (°C)
Temperature (°C)
FIGURE 2-14:
Differential Nonlinearity
FIGURE 2-17:
Differential Nonlinearity
(DNL) vs. Temperature.
(DNL) vs. Temperature (V = 2.7V).
DD
20
18
5
4
16
14
12
10
8
VDD = 5V
SAMPLE = 100 ksps
VDD = 2.7V
3
F
FSAMPLE = 50 ksps
2
1
VDD = 2.7V
FSAMPLE = 50ksps
6
0
VDD = 5V
SAMPLE = 100 ksps
4
-1
-2
F
2
0
0
1
2
3
4
5
0
1
2
3
4
5
VREF(V)
VREF (V)
FIGURE 2-15:
Gain Error vs. V
.
FIGURE 2-18:
Offset Error vs. V
.
REF
REF
© 2008 Microchip Technology Inc.
DS21290E-page 9
MCP3201
Note: Unless otherwise indicated, VDD = VREF = 5V, VSS = 0V, fSAMPLE = 100 ksps, fCLK = 16*fSAMPLE, TA = +25°C.
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
1.0
0.8
0.6
0.4
0.2
VDD = VREF = 5V
FSAMPLE = 100 ksps
VDD = VREF = 2.7V
SAMPLE = 50 ksps
F
0.0
-0.2
-0.4
-0.6
-0.8
-1.0
VDD = VREF = 2.7V
FSAMPLE = 50 ksps
VDD = VREF = 5V
SAMPLE = 100 ksps
F
-50
-25
0
25
50
75
100
-50
-25
0
25
50
75
100
Temperature (°C)
Temperature (°C)
FIGURE 2-19:
Gain Error vs. Temperature.
FIGURE 2-22:
Offset Error vs.
Temperature.
100
90
80
70
60
50
40
30
20
10
0
100
90
80
70
60
50
40
30
20
10
0
VDD = VREF = 5V
SAMPLE = 100 ksps
VDD = VREF = 5V
F
FSAMPLE = 100 ksps
VDD = VREF = 2.7V
VDD = VREF = 2.7V
SAMPLE = 50 ksps
FSAMPLE = 50 ksps
F
1
10
Input Frequency (kHz)
100
1
10
100
Input Frequency (kHz)
FIGURE 2-20:
Signal-to-Noise Ratio (SNR)
FIGURE 2-23:
Signal-to-Noise and
vs. Input Frequency.
Distortion (SINAD) vs. Input Frequency.
0
-10
-20
-30
80
VDD = VREF = 5V
SAMPLE = 100 ksps
70
F
60
50
40
30
20
10
0
VDD = VREF = 2.7V
FSAMPLE = 50 ksps
-40
-50
VDD = VREF = 2.7V
SAMPLE = 50 ksps
F
-60
-70
-80
VDD = VREF = 5V, FSAMPLE = 100 ksps
-90
-100
-40
-35
-30
-25
-20
-15
-10
-5
0
1
10
100
Input Signal Level (dB)
Input Frequency (kHz)
FIGURE 2-21:
Total Harmonic Distortion
FIGURE 2-24:
Signal-to-Noise and
(THD) vs. Input Frequency.
Distortion (SINAD) vs. Input Signal Level.
DS21290E-page 10
© 2008 Microchip Technology Inc.
MCP3201
Note: Unless otherwise indicated, VDD = VREF = 5V, VSS = 0V, fSAMPLE = 100 ksps, fCLK = 16*fSAMPLE, TA = +25°C.
12.0
12.00
11.75
11.50
11.25
11.00
10.75
10.50
10.25
10.00
9.75
VDD = 5V
11.5
11.0
10.5
10.0
9.5
FSAMPLE = 100 ksps
VDD = VREF = 5V
FSAMPLE =100 ksps
VDD = VREF = 2.7V
FSAMPLE = 50 ksps
9.0
VDD = 2.7V
9.50
9.25
8.5
FSAMPLE = 50 ksps
9.00
8.0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
1
10
100
VREF (V)
Input Frequency (kHz)
FIGURE 2-25:
Effective Number of Bits
FIGURE 2-28:
Effective Number of Bits
(ENOB) vs. V
.
(ENOB) vs. Input Frequency.
REF
0
-10
-20
-30
-40
-50
-60
-70
-80
100
90
80
70
60
50
40
30
20
10
0
VDD = VREF = 5V, FSAMPLE = 100 ksps
VDD = VREF = 2.7V
SAMPLE = 50 ksps
F
1
10
100
1000
10000
1
10
Input Frequency (kHz)
100
Ripple Frequency (kHz)
FIGURE 2-26:
Spurious Free Dynamic
FIGURE 2-29:
Power Supply Rejection
Range (SFDR) vs. Input Frequency.
(PSR) vs. Ripple Frequency.
0
-10
-20
-30
-40
0
-10
-20
-30
-40
VDD = VREF = 2.7V
FSAMPLE = 50 ksps
FINPUT = 998.76 Hz
4096 points
VDD = VREF = 5V
FSAMPLE = 100 ksps
FINPUT = 9.985kHz
4096 points
-50
-50
-60
-60
-70
-70
-80
-80
-90
-90
-100
-110
-120
-130
-100
-110
-120
-130
0
10000
20000
30000
40000
50000
0
5000
10000
15000
20000
25000
Frequency (Hz)
Frequency (Hz)
FIGURE 2-27:
Frequency Spectrum of
FIGURE 2-30:
Frequency Spectrum of
10 kHz input (Representative Part).
1 kHz input (Representative Part, V = 2.7V).
DD
© 2008 Microchip Technology Inc.
DS21290E-page 11
MCP3201
Note: Unless otherwise indicated, VDD = VREF = 5V, VSS = 0V, fSAMPLE = 100 ksps, fCLK = 16*fSAMPLE, TA = +25°C.
500
450
400
350
300
250
200
150
100
50
100
90
80
70
60
50
40
30
20
10
0
VREF = VDD
All points at FCLK = 1.6 MHz, except
at VREF = VDD = 2.5V, FCLK = 800 kHz
VREF = VDD
All points at FCLK = 1.6 MHz, except
at VREF = VDD = 2.5V, FCLK = 800 kHz
0
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
VDD (V)
2.0
2.5
3.0
3.5
4.0
VDD (V)
4.5
5.0
5.5
6.0
FIGURE 2-31:
I
vs. V
.
FIGURE 2-34:
I
vs. V
.
DD
DD
DD
REF
100
90
80
70
60
50
40
30
20
400
350
300
250
200
150
100
50
VDD = VREF = 5V
VDD = VREF = 5V
VDD = VREF = 2.7V
VDD = VREF = 2.7V
10
0
0
10
100
1000
10000
10
100
1000
10000
Clock Frequency (kHz)
Clock Frequency (kHz)
FIGURE 2-32:
I
vs. Clock Frequency.
FIGURE 2-35:
I
vs. Clock Frequency.
DD
REF
400
100
90
80
70
60
50
40
30
20
10
0
VDD = VREF = 5V
VDD = VREF = 5V
CLK = 1.6 MHz
350
300
250
200
150
100
50
FCLK = 1.6 MHz
F
VDD = VREF = 2.7V
CLK = 800 kHz
F
VDD = VREF = 2.7V
CLK = 800 kHz
F
0
-50
-25
0
25
50
75
100
-50
-25
0
25
50
75
100
Temperature (°C)
Temperature (°C)
FIGURE 2-33:
I
vs. Temperature.
FIGURE 2-36:
I
vs. Temperature.
DD
REF
DS21290E-page 12
© 2008 Microchip Technology Inc.
MCP3201
Note: Unless otherwise indicated, VDD = VREF = 5V, VSS = 0V, fSAMPLE = 100 ksps, fCLK = 16*fSAMPLE, TA = +25°C.
80
70
60
50
40
30
20
10
0
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
VREF = CS = VDD
VDD = VREF = 5V
FCLK = 1.6 MHz
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
-50
-25
0
25
50
75
100
VDD (V)
Temperature (°C)
FIGURE 2-37:
I
vs. V
.
FIGURE 2-39:
Analog Input Leakage
DDS
DD
Current vs. Temperature.
100.00
VDD = VREF = CS = 5V
10.00
1.00
0.10
0.01
-50
-25
0
25
50
75
100
Temperature (°C)
FIGURE 2-38:
I
vs. Temperature.
DDS
© 2008 Microchip Technology Inc.
DS21290E-page 13
MCP3201
NOTES:
DS21290E-page 14
© 2008 Microchip Technology Inc.
MCP3201
3.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
Additional descriptions of the device pins follows.
TABLE 3-1:
PIN FUNCTION TABLE
MCP3201
Symbol
Description
MSOP, PDIP, SOIC,
TSSOP
1
2
3
4
5
6
7
8
VREF
IN+
Reference Voltage Input
Positive Analog Input
Negative Analog Input
Ground
IN-
VSS
CS/SHDN
DOUT
CLK
Chip Select/Shutdown Input
Serial Data Out
Serial Clock
VDD
+2.7V to 5.5V Power Supply
3.1
Positive Analog Input (IN+)
3.4
Serial Clock (CLK)
Positive analog input. This input can vary from IN- to
VREF + IN-.
The SPI clock pin is used to initiate a conversion and to
clock out each bit of the conversion as it takes place.
See Section 6.2 “Maintaining Minimum Clock
Speed” for constraints on clock speed.
3.2
Negative Analog Input (IN-)
Negative analog input. This input can vary ±100 mV
3.5
Serial Data Output (DOUT)
from VSS
.
The SPI serial data output pin is used to shift out the
results of the A/D conversion. Data will always change
on the falling edge of each clock as the conversion
takes place.
3.3
Chip Select/Shutdown (CS/SHDN)
The CS/SHDN pin is used to initiate communication
with the device when pulled low and will end a
conversion and put the device in low power standby
when pulled high. The CS/SHDN pin must be pulled
high between conversions.
© 2008 Microchip Technology Inc.
DS21290E-page 15
MCP3201
NOTES:
DS21290E-page 16
© 2008 Microchip Technology Inc.
MCP3201
4.2
Reference Input
4.0
DEVICE OPERATION
The reference input (VREF) determines the analog input
voltage range and the LSB size, as shown below.
The MCP3201 A/D Converter employs a conventional
SAR architecture. With this architecture, a sample is
acquired on an internal sample/hold capacitor for
1.5 clock cycles starting on the first rising edge of the
serial clock after CS has been pulled low. Following this
sample time, the input switch of the converter opens
and the device uses the collected charge on the
internal sample and hold capacitor to produce a serial
12-bit digital output code. Conversion rates of 100 ksps
are possible on the MCP3201 device. See Section 6.2
“Maintaining Minimum Clock Speed” for information
on minimum clock rates. Communication with the
device is done using a 3-wire SPI-compatible interface.
EQUATION 4-1:
VREF
LSB Size = ------------
4096
As the reference input is reduced, the LSB size is
reduced accordingly. The theoretical digital output code
produced by the A/D Converter is a function of the
analog input signal and the reference input as shown
below.
EQUATION 4-2:
4.1
Analog Inputs
4096*VIN
Digital Output Code = ------------------------
VREF
The MCP3201 device provides a single pseudo-differ-
ential input. The IN+ input can range from IN- to VREF
(VREF + IN-). The IN- input is limited to ±100 mV from
the VSS rail. The IN- input can be used to cancel small
signal common-mode noise which is present on both
the IN+ and IN- inputs.
Where:
VIN
=
=
Analog Input Voltage = V(IN+) - V(IN-)
Reference Voltage
VREF
For the A/D Converter to meet specification, the charge
holding capacitor (CSAMPLE) must be given enough
time to acquire a 12-bit accurate voltage level during
the 1.5 clock cycle sampling period. The analog input
model is shown in Figure 4-1.
When using an external voltage reference device, the
system designer should always refer to the
manufacturer’s recommendations for circuit layout.
Any instability in the operation of the reference device
will have a direct effect on the operation of the
A/D Converter.
In this diagram, it is shown that the source impedance
(RS) adds to the internal sampling switch (RSS
)
impedance, directly affecting the time that is required to
charge the capacitor (CSAMPLE). Consequently, a
larger source impedance increases the offset, gain,
and integral linearity errors of the conversion.
Ideally, the impedance of the signal source should be
near zero. This is achievable with an operational
amplifier such as the MCP601, which has a closed loop
output impedance of tens of ohms. The adverse affects
of higher source impedances are shown in Figure 4-2.
If the voltage level of IN+ is equal to or less than IN-, the
resultant code will be 000h. If the voltage at IN+ is equal
to or greater than {[VREF + (IN-)] - 1 LSB}, then the
output code will be FFFh. If the voltage level at IN- is
more than 1 LSB below VSS, then the voltage level at
the IN+ input will have to go below VSS to see the 000h
output code. Conversely, if IN- is more than 1 LSB
above VSS, then the FFFh code will not be seen unless
the IN+ input level goes above VREF level.
© 2008 Microchip Technology Inc.
DS21290E-page 17
MCP3201
VDD
Sampling
Switch
VT = 0.6V
VT = 0.6V
RS = 1 kΩ
CHx
RSS
SS
CSAMPLE
= DAC capacitance
= 20 pF
CPIN
7 pF
ILEAKAGE
±1 nA
VA
VSS
LEGEND
VA
RSS
CHx
=
=
=
=
=
=
Signal Source
Source Impedance
Input Channel Pad
CPIN
VT
ILEAKAGE
Input Pin Capacitance
Threshold Voltage
Leakage Current At The Pin
Due To Various Junctions
Sampling Switch
SS
RS
CSAMPLE
=
=
=
Sampling Switch Resistor
Sample/hold Capacitance
FIGURE 4-1:
Analog Input Model.
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
VDD = VREF = 5V
VDD = VREF = 2.7V
0.0
100
1000
10000
Input Resistance (Ohms)
FIGURE 4-2:
Maximum Clock Frequency
vs. Input Resistance (R ) to maintain less than a
S
0.1 LSB deviation in INL from nominal
conditions.
DS21290E-page 18
© 2008 Microchip Technology Inc.
MCP3201
5.0
SERIAL COMMUNICATIONS
Communication with the device is done using a
standard SPI-compatible serial interface. Initiating
communication with the MCP3201 device begins with
the CS going low. If the device was powered up with the
CS pin low, it must be brought high and back low to
initiate communication. The device will begin to sample
the analog input on the first rising edge after CS goes
low. The sample period will end in the falling edge of the
second clock, at which time the device will output a low
null bit. The next 12 clocks will output the result of the
conversion with MSB first, as shown in Figure 5-1. Data
is always output from the device on the falling edge of
the clock. If all 12 data bits have been transmitted and
the device continues to receive clocks while the CS is
held low, the device will output the conversion result
LSB first, as shown in Figure 5-2. If more clocks are
provided to the device while CS is still low (after the
LSB first data has been transmitted), the device will
clock out zeros indefinitely.
tCYC
T
CSH
CS
POWER
DOWN
T
SUCS
CLK
T
tDATA**
HI-Z
SAMPLE
tCONV
HI-Z
NULL
NULL
DOUT
B11 B10 B9 B8 B7 B6 B5 B4 B3 B2 B1 B0*
B11 B10 B9 B8
BIT
BIT
* After completing the data transfer, if further clocks are applied with CS low, the A/D Converter will output LSB first data, followed
by zeros indefinitely. See Figure 5-2 below.
** t
: during this time, the bias current and the comparator power down and the reference input becomes a high-impedance
DATA
node, leaving the CLK running to clock out the LSB-first data or zeros.
FIGURE 5-1:
Communication with MCP3201 device using MSB first Format.
tCYC
tCSH
CS
tSUCS
POWER DOWN
CLK
tSAMPLE
tDATA**
B11B10B9 B8 B7 B6 B5 B4 B3 B2 B1 B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 B10B11*
tCONV
HI-Z
HI-Z
NULL
BIT
DOUT
* After completing the data transfer, if further clocks are applied with CS low, the A/D Converter will output zeros indefinitely.
** t : during this time, the bias current and the comparator power down and the reference input becomes a high-impedance
DATA
node, leaving the CLK running to clock out the LSB-first data or zeros.
FIGURE 5-2:
Communication with MCP3201 device using LSB first Format.
© 2008 Microchip Technology Inc.
DS21290E-page 19
MCP3201
NOTES:
DS21290E-page 20
© 2008 Microchip Technology Inc.
MCP3201
been sent to the device, the microcontroller’s receive
buffer will contain two unknown bits (the output is at
high-impedance for the first two clocks), the null bit and
the highest order five bits of the conversion. After the
second eight clocks have been sent to the device, the
MCU receive register will contain the lowest-order
seven bits and the B1 bit repeated as the A/D
Converter has begun to shift out LSB first data with the
extra clock. Typical procedure would then call for the
lower-order byte of data to be shifted right by one bit to
remove the extra B1 bit. The B7 bit is then transferred
from the high-order byte to the lower-order byte, and
then the higher-order byte is shifted one bit to the right
as well. Easier manipulation of the converted data can
be obtained by using this method.
6.0
6.1
APPLICATIONS INFORMATION
Using the MCP3201 Device with
Microcontroller SPI Ports
With most microcontroller SPI ports, it is required to
clock out eight bits at a time. If this is the case, it will be
necessary to provide more clocks than are required for
the MCP3201. As an example, Figure 6-1 and
Figure 6-2 show how the MCP3201 device can be
interfaced to a microcontroller with a standard SPI port.
Since the MCP3201 always clocks data out on the
falling edge of clock, the MCU SPI port must be
configured to match this operation. SPI Mode 0,0
(clock idles low) and SPI Mode 1,1 (clock idles high)
are both compatible with the MCP3201. Figure 6-1
depicts the operation shown in SPI Mode 0,0, which
requires that the CLK from the microcontroller idles in
the ‘low’ state. As shown in the diagram, the MSB is
clocked out of the A/D Converter on the falling edge of
the third clock pulse. After the first eight clocks have
Figure 6-2 shows the same thing in SPI Mode 1,1
which requires that the clock idles in the high state. As
with mode 0,0, the A/D Converter outputs data on the
falling edge of the clock and the MCU latches data from
the A/D Converter in on the rising edge of the clock.
CS
MCU latches data from A/D
Converter on rising edges of SCLK
CLK
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
Data is clocked out of A/D
Converter on falling edges
HI-Z
HI-Z
B2
B1
NULL
BIT
B11 B10 B9
B7
B6
B5 B4 B3 B2 B1 B0
B8
D
OUT
LSB first data begins
to come out
?
?
0
B11 B10 B9 B8 B7
B6 B5 B4 B3 B2 B1 B0 B1
Data stored into MCU receive register
after transmission of first 8 bits
Data stored into MCU receive register
after transmission of second 8 bits
FIGURE 6-1:
SPI Communication using 8-bit segments (Mode 0,0: SCLK idles low).
CS
MCU latches data from A/D
Converter on rising edges of SCLK
CLK
1
2
3
4
5
6
7
8
9
10 11 12 13 14 15 16
Data is clocked out of A/D
Converter on falling edges
HI-Z
HI-Z
NULL
BIT
B11 B10 B9 B8
B7
B6 B5 B4 B3 B2 B1 B0
B1
D
OUT
LSB first data begins
to come out
?
?
0
B11 B10 B9 B8 B7
B6 B5 B4 B3 B2 B1 B0 B1
Data stored into MCU receive register
after transmission of first 8 bits
Data stored into MCU receive register
after transmission of second 8 bits
FIGURE 6-2:
SPI Communication using 8-bit segments (Mode 1,1: SCLK idles high).
© 2008 Microchip Technology Inc.
DS21290E-page 21
MCP3201
6.2
Maintaining Minimum Clock Speed
V
DD
When the MCP3201 initiates the sample period, charge
is stored on the sample capacitor. When the sample
period is complete, the device converts one bit for each
clock that is received. It is important for the user to note
that a slow clock rate will allow charge to bleed off the
sample cap while the conversion is taking place. At
85°C (worst case condition), the part will maintain
proper charge on the sample capacitor for at least
1.2 ms after the sample period has ended. This means
that the time between the end of the sample period and
the time that all 12 data bits have been clocked out
must not exceed 1.2 ms (effective clock frequency of
10 kHz). Failure to meet this criteria may induce
linearity errors into the conversion outside the rated
specifications. It should be noted that during the entire
conversion cycle, the A/D Converter does not require a
constant clock speed or duty cycle, as long as all timing
specifications are met.
10 µF
4.096V
Reference
10 µF
0.1 µF
MCP1541
C
L
1 µF
V
REF
IN+
MCP3201
C
1
IN-
MCP601
R
1
V
+
-
IN
R
2
C
2
R
4
R
3
FIGURE 6-3:
The MCP601 Operational
Amplifier is used to implement a 2nd order anti-
aliasing filter for the signal being converted by
the MCP3201 device.
6.3
Buffering/Filtering the Analog
Inputs
If the signal source for the A/D Converter is not a low
impedance source, it will have to be buffered
or inaccurate conversion results may occur.
See Figure 4-2. It is also recommended that a filter be
used to eliminate any signals that may be aliased back
into the conversion results. This is illustrated in
Figure 6-3 where an op amp is used to drive the analog
input of the MCP3201 device. This amplifier provides a
low impedance source for the converter input and a
low-pass filter, which eliminates unwanted high-
frequency noise.
Low-pass (anti-aliasing) filters can be designed using
Microchip’s interactive FilterLab® software. FilterLab
will calculate capacitor and resistor values, as well as
determine the number of poles that are required for the
application. For more information on filtering signals,
see the application note AN699 “Anti-Aliasing Analog
Filters for Data Acquisition Systems.”
DS21290E-page 22
© 2008 Microchip Technology Inc.
MCP3201
6.4
Layout Considerations
When laying out a printed circuit board for use with
analog components, care should be taken to reduce
noise wherever possible. A bypass capacitor should
always be used with this device and should be placed
as close as possible to the device pin. A bypass
capacitor value of 1 µF is recommended.
Digital and analog traces should be separated as much
as possible on the board and no traces should run
underneath the device or the bypass capacitor. Extra
precautions should be taken to keep traces with high-
frequency signals (such as clock lines) as far as
possible from analog traces.
Use of an analog ground plane is recommended in
order to keep the ground potential the same for all
devices on the board. Providing VDD connections to
devices in a “star” configuration can also reduce noise
by eliminating current return paths and associated
errors. See Figure 6-4. For more information on layout
tips when using A/D Converter, refer to AN688 “Layout
Tips for 12-Bit A/D Converter Applications”.
V
DD
Connection
Device 4
Device 1
Device 3
Device 2
FIGURE 6-4:
V
traces arranged in a
DD
‘Star’ configuration in order to reduce errors
caused by current return paths.
© 2008 Microchip Technology Inc.
DS21290E-page 23
MCP3201
NOTES:
DS21290E-page 24
© 2008 Microchip Technology Inc.
MCP3201
7.0
7.1
PACKAGING INFORMATION
Package Marking Information
Example:
8-Lead MSOP
XXXXXX
3201CI
820256
YWWNNN
8-Lead PDIP (300 mil)
Example:
3201-B
XXXXXXXX
XXXXXNNN
e
3
I/P 256
YYWW
0820
8-Lead SOIC (150 mil)
Example:
XXXXXXXX
3201-BI
XXXXYYWW
SN 0820
e
3
NNN
256
Example:
8-Lead TSSOP
201C
I820
256
XXXX
YYWW
NNN
Legend: XX...X Customer-specific information
Y
YY
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
WW
NNN
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
e
3
Pb-free JEDEC designator for Matte Tin (Sn)
*
This package is Pb-free. The Pb-free JEDEC designator (
can be found on the outer packaging for this package.
)
e
3
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
© 2008 Microchip Technology Inc.
DS21290E-page 25
MCP3201
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ꢛꢏꢊꢃꢉꢜ
ꢀꢁ ꢂꢃꢄꢅꢀꢅꢆꢃ !ꢇꢈꢅꢃꢄ"ꢉ#ꢅ$ꢉꢇ%!ꢊꢉꢅ&ꢇꢋꢅꢆꢇꢊꢋ'ꢅ(!%ꢅ&! %ꢅ(ꢉꢅꢈꢌꢍꢇ%ꢉ"ꢅ)ꢃ%ꢎꢃꢄꢅ%ꢎꢉꢅꢎꢇ%ꢍꢎꢉ"ꢅꢇꢊꢉꢇꢁ
ꢏꢁ ꢐꢃ&ꢉꢄ ꢃꢌꢄ ꢅꢐꢅꢇꢄ"ꢅ*ꢀꢅ"ꢌꢅꢄꢌ%ꢅꢃꢄꢍꢈ!"ꢉꢅ&ꢌꢈ"ꢅ$ꢈꢇ ꢎꢅꢌꢊꢅꢑꢊꢌ%ꢊ! ꢃꢌꢄ ꢁꢅꢒꢌꢈ"ꢅ$ꢈꢇ ꢎꢅꢌꢊꢅꢑꢊꢌ%ꢊ! ꢃꢌꢄ ꢅ ꢎꢇꢈꢈꢅꢄꢌ%ꢅꢉ#ꢍꢉꢉ"ꢅꢓꢁꢀ+ꢅ&&ꢅꢑꢉꢊꢅ ꢃ"ꢉꢁ
,ꢁ ꢐꢃ&ꢉꢄ ꢃꢌꢄꢃꢄꢔꢅꢇꢄ"ꢅ%ꢌꢈꢉꢊꢇꢄꢍꢃꢄꢔꢅꢑꢉꢊꢅꢕꢖꢒ*ꢅ-ꢀꢗꢁ+ꢒꢁ
.ꢖ/0 .ꢇ ꢃꢍꢅꢐꢃ&ꢉꢄ ꢃꢌꢄꢁꢅꢘꢎꢉꢌꢊꢉ%ꢃꢍꢇꢈꢈꢋꢅꢉ#ꢇꢍ%ꢅꢆꢇꢈ!ꢉꢅ ꢎꢌ)ꢄꢅ)ꢃ%ꢎꢌ!%ꢅ%ꢌꢈꢉꢊꢇꢄꢍꢉ ꢁ
ꢙ*10 ꢙꢉ$ꢉꢊꢉꢄꢍꢉꢅꢐꢃ&ꢉꢄ ꢃꢌꢄ'ꢅ! !ꢇꢈꢈꢋꢅ)ꢃ%ꢎꢌ!%ꢅ%ꢌꢈꢉꢊꢇꢄꢍꢉ'ꢅ$ꢌꢊꢅꢃꢄ$ꢌꢊ&ꢇ%ꢃꢌꢄꢅꢑ!ꢊꢑꢌ ꢉ ꢅꢌꢄꢈꢋꢁ
ꢒꢃꢍꢊꢌꢍꢎꢃꢑ ꢘꢉꢍꢎꢄꢌꢈꢌꢔꢋ ꢐꢊꢇ)ꢃꢄꢔ /ꢓꢗꢞꢀꢀꢀ.
DS21290E-page 26
© 2008 Microchip Technology Inc.
MCP3201
ꢀꢁꢂꢃꢄꢅꢆꢇꢈꢄꢉꢊꢋꢌꢆꢝꢓꢄꢈꢆ ꢔꢁꢂꢋꢔꢃꢆꢗꢇꢘꢆMꢆ"##ꢆꢑꢋꢈꢆ$ꢏꢅ%ꢆꢙꢇꢝ ꢇꢚ
ꢛꢏꢊꢃꢜ 1ꢌꢊꢅ%ꢎꢉꢅ&ꢌ %ꢅꢍ!ꢊꢊꢉꢄ%ꢅꢑꢇꢍ2ꢇꢔꢉꢅ"ꢊꢇ)ꢃꢄꢔ 'ꢅꢑꢈꢉꢇ ꢉꢅ ꢉꢉꢅ%ꢎꢉꢅꢒꢃꢍꢊꢌꢍꢎꢃꢑꢅꢂꢇꢍ2ꢇꢔꢃꢄꢔꢅꢖꢑꢉꢍꢃ$ꢃꢍꢇ%ꢃꢌꢄꢅꢈꢌꢍꢇ%ꢉ"ꢅꢇ%ꢅ
ꢎ%%ꢑ033)))ꢁ&ꢃꢍꢊꢌꢍꢎꢃꢑꢁꢍꢌ&3ꢑꢇꢍ2ꢇꢔꢃꢄꢔ
N
NOTE 1
E1
3
1
2
D
E
A2
A
L
A1
c
e
eB
b1
b
4ꢄꢃ%
ꢚ6/;*ꢖ
ꢐꢃ&ꢉꢄ ꢃꢌꢄꢅ5ꢃ&ꢃ%
ꢒꢚ6
67ꢒ
9
ꢁꢀꢓꢓꢅ.ꢖ/
M
ꢁꢀ,ꢓ
M
ꢁ,ꢀꢓ
ꢁꢏ+ꢓ
ꢁ,:+
ꢁꢀ,ꢓ
ꢁꢓꢀꢓ
ꢁꢓ:ꢓ
ꢁꢓꢀ9
M
ꢒꢕ8
6!&(ꢉꢊꢅꢌ$ꢅꢂꢃꢄ
ꢂꢃ%ꢍꢎ
ꢘꢌꢑꢅ%ꢌꢅꢖꢉꢇ%ꢃꢄꢔꢅꢂꢈꢇꢄꢉ
ꢒꢌꢈ"ꢉ"ꢅꢂꢇꢍ2ꢇꢔꢉꢅꢘꢎꢃꢍ2ꢄꢉ
.ꢇ ꢉꢅ%ꢌꢅꢖꢉꢇ%ꢃꢄꢔꢅꢂꢈꢇꢄꢉ
ꢖꢎꢌ!ꢈ"ꢉꢊꢅ%ꢌꢅꢖꢎꢌ!ꢈ"ꢉꢊꢅ=ꢃ"%ꢎ
ꢒꢌꢈ"ꢉ"ꢅꢂꢇꢍ2ꢇꢔꢉꢅ=ꢃ"%ꢎ
7ꢆꢉꢊꢇꢈꢈꢅ5ꢉꢄꢔ%ꢎ
6
ꢉ
ꢕ
ꢕꢏ
ꢕꢀ
*
*ꢀ
ꢐ
5
ꢍ
(ꢀ
(
ꢉ.
M
ꢁꢏꢀꢓ
ꢁꢀꢜ+
M
ꢁꢀꢀ+
ꢁꢓꢀ+
ꢁꢏꢜꢓ
ꢁꢏꢗꢓ
ꢁ,ꢗ9
ꢁꢀꢀ+
ꢁꢓꢓ9
ꢁꢓꢗꢓ
ꢁꢓꢀꢗ
M
ꢁ,ꢏ+
ꢁꢏ9ꢓ
ꢁꢗꢓꢓ
ꢁꢀ+ꢓ
ꢁꢓꢀ+
ꢁꢓꢛꢓ
ꢁꢓꢏꢏ
ꢁꢗ,ꢓ
ꢘꢃꢑꢅ%ꢌꢅꢖꢉꢇ%ꢃꢄꢔꢅꢂꢈꢇꢄꢉ
5ꢉꢇ"ꢅꢘꢎꢃꢍ2ꢄꢉ
4ꢑꢑꢉꢊꢅ5ꢉꢇ"ꢅ=ꢃ"%ꢎ
5ꢌ)ꢉꢊꢅ5ꢉꢇ"ꢅ=ꢃ"%ꢎ
7ꢆꢉꢊꢇꢈꢈꢅꢙꢌ)ꢅꢖꢑꢇꢍꢃꢄꢔꢅꢅꢟ
ꢛꢏꢊꢃꢉꢜ
ꢀꢁ ꢂꢃꢄꢅꢀꢅꢆꢃ !ꢇꢈꢅꢃꢄ"ꢉ#ꢅ$ꢉꢇ%!ꢊꢉꢅ&ꢇꢋꢅꢆꢇꢊꢋ'ꢅ(!%ꢅ&! %ꢅ(ꢉꢅꢈꢌꢍꢇ%ꢉ"ꢅ)ꢃ%ꢎꢅ%ꢎꢉꢅꢎꢇ%ꢍꢎꢉ"ꢅꢇꢊꢉꢇꢁ
ꢏꢁ ꢟꢅꢖꢃꢔꢄꢃ$ꢃꢍꢇꢄ%ꢅ/ꢎꢇꢊꢇꢍ%ꢉꢊꢃ %ꢃꢍꢁ
,ꢁ ꢐꢃ&ꢉꢄ ꢃꢌꢄ ꢅꢐꢅꢇꢄ"ꢅ*ꢀꢅ"ꢌꢅꢄꢌ%ꢅꢃꢄꢍꢈ!"ꢉꢅ&ꢌꢈ"ꢅ$ꢈꢇ ꢎꢅꢌꢊꢅꢑꢊꢌ%ꢊ! ꢃꢌꢄ ꢁꢅꢒꢌꢈ"ꢅ$ꢈꢇ ꢎꢅꢌꢊꢅꢑꢊꢌ%ꢊ! ꢃꢌꢄ ꢅ ꢎꢇꢈꢈꢅꢄꢌ%ꢅꢉ#ꢍꢉꢉ"ꢅꢁꢓꢀꢓ@ꢅꢑꢉꢊꢅ ꢃ"ꢉꢁ
ꢗꢁ ꢐꢃ&ꢉꢄ ꢃꢌꢄꢃꢄꢔꢅꢇꢄ"ꢅ%ꢌꢈꢉꢊꢇꢄꢍꢃꢄꢔꢅꢑꢉꢊꢅꢕꢖꢒ*ꢅ-ꢀꢗꢁ+ꢒꢁ
.ꢖ/0ꢅ.ꢇ ꢃꢍꢅꢐꢃ&ꢉꢄ ꢃꢌꢄꢁꢅꢘꢎꢉꢌꢊꢉ%ꢃꢍꢇꢈꢈꢋꢅꢉ#ꢇꢍ%ꢅꢆꢇꢈ!ꢉꢅ ꢎꢌ)ꢄꢅ)ꢃ%ꢎꢌ!%ꢅ%ꢌꢈꢉꢊꢇꢄꢍꢉ ꢁ
ꢒꢃꢍꢊꢌꢍꢎꢃꢑ ꢘꢉꢍꢎꢄꢌꢈꢌꢔꢋ ꢐꢊꢇ)ꢃꢄꢔ /ꢓꢗꢞꢓꢀ9.
© 2008 Microchip Technology Inc.
DS21290E-page 27
MCP3201
ꢀꢁꢂꢃꢄꢅꢆꢇꢈꢄꢉꢊꢋꢌꢆꢐꢑꢄꢈꢈꢆꢒꢓꢊꢈꢋꢔꢃꢆꢗꢐꢛꢘꢆMꢆꢛꢄꢎꢎꢏ&'ꢆ"()#ꢆꢑꢑꢆ$ꢏꢅ%ꢆꢙꢐꢒ *ꢚ
ꢛꢏꢊꢃꢜ 1ꢌꢊꢅ%ꢎꢉꢅ&ꢌ %ꢅꢍ!ꢊꢊꢉꢄ%ꢅꢑꢇꢍ2ꢇꢔꢉꢅ"ꢊꢇ)ꢃꢄꢔ 'ꢅꢑꢈꢉꢇ ꢉꢅ ꢉꢉꢅ%ꢎꢉꢅꢒꢃꢍꢊꢌꢍꢎꢃꢑꢅꢂꢇꢍ2ꢇꢔꢃꢄꢔꢅꢖꢑꢉꢍꢃ$ꢃꢍꢇ%ꢃꢌꢄꢅꢈꢌꢍꢇ%ꢉ"ꢅꢇ%ꢅ
ꢎ%%ꢑ033)))ꢁ&ꢃꢍꢊꢌꢍꢎꢃꢑꢁꢍꢌ&3ꢑꢇꢍ2ꢇꢔꢃꢄꢔ
D
e
N
E
E1
NOTE 1
1
2
3
α
h
b
h
c
φ
A2
A
L
A1
L1
β
4ꢄꢃ%
ꢒꢚ55ꢚꢒ*ꢘ*ꢙꢖ
ꢐꢃ&ꢉꢄ ꢃꢌꢄꢅ5ꢃ&ꢃ%
ꢒꢚ6
67ꢒ
ꢒꢕ8
6!&(ꢉꢊꢅꢌ$ꢅꢂꢃꢄ
ꢂꢃ%ꢍꢎ
6
ꢉ
9
ꢀꢁꢏꢛꢅ.ꢖ/
7ꢆꢉꢊꢇꢈꢈꢅ;ꢉꢃꢔꢎ%
ꢕ
M
ꢀꢁꢏ+
ꢓꢁꢀꢓ
M
M
M
ꢀꢁꢛ+
M
ꢓꢁꢏ+
ꢒꢌꢈ"ꢉ"ꢅꢂꢇꢍ2ꢇꢔꢉꢅꢘꢎꢃꢍ2ꢄꢉ
ꢖ%ꢇꢄ"ꢌ$$ꢅꢅ
ꢕꢏ
ꢕꢀ
*
ꢟ
7ꢆꢉꢊꢇꢈꢈꢅ=ꢃ"%ꢎ
:ꢁꢓꢓꢅ.ꢖ/
ꢒꢌꢈ"ꢉ"ꢅꢂꢇꢍ2ꢇꢔꢉꢅ=ꢃ"%ꢎ
7ꢆꢉꢊꢇꢈꢈꢅ5ꢉꢄꢔ%ꢎ
/ꢎꢇ&$ꢉꢊꢅAꢌꢑ%ꢃꢌꢄꢇꢈB
1ꢌꢌ%ꢅ5ꢉꢄꢔ%ꢎ
*ꢀ
ꢐ
ꢎ
,ꢁꢜꢓꢅ.ꢖ/
ꢗꢁꢜꢓꢅ.ꢖ/
ꢓꢁꢏ+
ꢓꢁꢗꢓ
M
M
ꢓꢁ+ꢓ
ꢀꢁꢏꢛ
5
1ꢌꢌ%ꢑꢊꢃꢄ%
1ꢌꢌ%ꢅꢕꢄꢔꢈꢉ
5ꢉꢇ"ꢅꢘꢎꢃꢍ2ꢄꢉ
5ꢉꢇ"ꢅ=ꢃ"%ꢎ
ꢒꢌꢈ"ꢅꢐꢊꢇ$%ꢅꢕꢄꢔꢈꢉꢅꢘꢌꢑ
ꢒꢌꢈ"ꢅꢐꢊꢇ$%ꢅꢕꢄꢔꢈꢉꢅ.ꢌ%%ꢌ&
5ꢀ
ꢀ
ꢀꢁꢓꢗꢅꢙ*1
ꢓꢝ
ꢓꢁꢀꢛ
ꢓꢁ,ꢀ
+ꢝ
M
M
M
M
M
9ꢝ
ꢍ
(
ꢁ
ꢓꢁꢏ+
ꢓꢁ+ꢀ
ꢀ+ꢝ
ꢂ
+ꢝ
ꢀ+ꢝ
ꢛꢏꢊꢃꢉꢜ
ꢀꢁ ꢂꢃꢄꢅꢀꢅꢆꢃ !ꢇꢈꢅꢃꢄ"ꢉ#ꢅ$ꢉꢇ%!ꢊꢉꢅ&ꢇꢋꢅꢆꢇꢊꢋ'ꢅ(!%ꢅ&! %ꢅ(ꢉꢅꢈꢌꢍꢇ%ꢉ"ꢅ)ꢃ%ꢎꢃꢄꢅ%ꢎꢉꢅꢎꢇ%ꢍꢎꢉ"ꢅꢇꢊꢉꢇꢁ
ꢏꢁ ꢟꢅꢖꢃꢔꢄꢃ$ꢃꢍꢇꢄ%ꢅ/ꢎꢇꢊꢇꢍ%ꢉꢊꢃ %ꢃꢍꢁ
,ꢁ ꢐꢃ&ꢉꢄ ꢃꢌꢄ ꢅꢐꢅꢇꢄ"ꢅ*ꢀꢅ"ꢌꢅꢄꢌ%ꢅꢃꢄꢍꢈ!"ꢉꢅ&ꢌꢈ"ꢅ$ꢈꢇ ꢎꢅꢌꢊꢅꢑꢊꢌ%ꢊ! ꢃꢌꢄ ꢁꢅꢒꢌꢈ"ꢅ$ꢈꢇ ꢎꢅꢌꢊꢅꢑꢊꢌ%ꢊ! ꢃꢌꢄ ꢅ ꢎꢇꢈꢈꢅꢄꢌ%ꢅꢉ#ꢍꢉꢉ"ꢅꢓꢁꢀ+ꢅ&&ꢅꢑꢉꢊꢅ ꢃ"ꢉꢁ
ꢗꢁ ꢐꢃ&ꢉꢄ ꢃꢌꢄꢃꢄꢔꢅꢇꢄ"ꢅ%ꢌꢈꢉꢊꢇꢄꢍꢃꢄꢔꢅꢑꢉꢊꢅꢕꢖꢒ*ꢅ-ꢀꢗꢁ+ꢒꢁ
.ꢖ/0 .ꢇ ꢃꢍꢅꢐꢃ&ꢉꢄ ꢃꢌꢄꢁꢅꢘꢎꢉꢌꢊꢉ%ꢃꢍꢇꢈꢈꢋꢅꢉ#ꢇꢍ%ꢅꢆꢇꢈ!ꢉꢅ ꢎꢌ)ꢄꢅ)ꢃ%ꢎꢌ!%ꢅ%ꢌꢈꢉꢊꢇꢄꢍꢉ ꢁ
ꢙ*10 ꢙꢉ$ꢉꢊꢉꢄꢍꢉꢅꢐꢃ&ꢉꢄ ꢃꢌꢄ'ꢅ! !ꢇꢈꢈꢋꢅ)ꢃ%ꢎꢌ!%ꢅ%ꢌꢈꢉꢊꢇꢄꢍꢉ'ꢅ$ꢌꢊꢅꢃꢄ$ꢌꢊ&ꢇ%ꢃꢌꢄꢅꢑ!ꢊꢑꢌ ꢉ ꢅꢌꢄꢈꢋꢁ
ꢒꢃꢍꢊꢌꢍꢎꢃꢑ ꢘꢉꢍꢎꢄꢌꢈꢌꢔꢋ ꢐꢊꢇ)ꢃꢄꢔ /ꢓꢗꢞꢓ+ꢛ.
DS21290E-page 28
© 2008 Microchip Technology Inc.
MCP3201
ꢀꢁꢂꢃꢄꢅꢆꢇꢈꢄꢉꢊꢋꢌꢆꢐꢑꢄꢈꢈꢆꢒꢓꢊꢈꢋꢔꢃꢆꢗꢐꢛꢘꢆMꢆꢛꢄꢎꢎꢏ&'ꢆ"()#ꢆꢑꢑꢆ$ꢏꢅ%ꢆꢙꢐꢒ *ꢚ
ꢛꢏꢊꢃꢜ 1ꢌꢊꢅ%ꢎꢉꢅ&ꢌ %ꢅꢍ!ꢊꢊꢉꢄ%ꢅꢑꢇꢍ2ꢇꢔꢉꢅ"ꢊꢇ)ꢃꢄꢔ 'ꢅꢑꢈꢉꢇ ꢉꢅ ꢉꢉꢅ%ꢎꢉꢅꢒꢃꢍꢊꢌꢍꢎꢃꢑꢅꢂꢇꢍ2ꢇꢔꢃꢄꢔꢅꢖꢑꢉꢍꢃ$ꢃꢍꢇ%ꢃꢌꢄꢅꢈꢌꢍꢇ%ꢉ"ꢅꢇ%ꢅ
ꢎ%%ꢑ033)))ꢁ&ꢃꢍꢊꢌꢍꢎꢃꢑꢁꢍꢌ&3ꢑꢇꢍ2ꢇꢔꢃꢄꢔ
© 2008 Microchip Technology Inc.
DS21290E-page 29
MCP3201
ꢀꢁꢂꢃꢄꢅꢆꢇꢈꢄꢉꢊꢋꢌꢆ+,ꢋꢔꢆꢐ,ꢎꢋꢔꢕꢆꢐꢑꢄꢈꢈꢆꢒꢓꢊꢈꢋꢔꢃꢆꢗꢐ+ꢘꢆMꢆ-(-ꢆꢑꢑꢆ$ꢏꢅ%ꢆꢙ+ꢐꢐꢒꢇꢚ
ꢛꢏꢊꢃꢜ 1ꢌꢊꢅ%ꢎꢉꢅ&ꢌ %ꢅꢍ!ꢊꢊꢉꢄ%ꢅꢑꢇꢍ2ꢇꢔꢉꢅ"ꢊꢇ)ꢃꢄꢔ 'ꢅꢑꢈꢉꢇ ꢉꢅ ꢉꢉꢅ%ꢎꢉꢅꢒꢃꢍꢊꢌꢍꢎꢃꢑꢅꢂꢇꢍ2ꢇꢔꢃꢄꢔꢅꢖꢑꢉꢍꢃ$ꢃꢍꢇ%ꢃꢌꢄꢅꢈꢌꢍꢇ%ꢉ"ꢅꢇ%ꢅ
ꢎ%%ꢑ033)))ꢁ&ꢃꢍꢊꢌꢍꢎꢃꢑꢁꢍꢌ&3ꢑꢇꢍ2ꢇꢔꢃꢄꢔ
D
N
E
E1
NOTE 1
1
2
b
e
c
φ
A
A2
A1
L
L1
4ꢄꢃ%
ꢒꢚ55ꢚꢒ*ꢘ*ꢙꢖ
ꢐꢃ&ꢉꢄ ꢃꢌꢄꢅ5ꢃ&ꢃ%
ꢒꢚ6
67ꢒ
ꢒꢕ8
6!&(ꢉꢊꢅꢌ$ꢅꢂꢃꢄ
ꢂꢃ%ꢍꢎ
6
ꢉ
9
ꢓꢁ:+ꢅ.ꢖ/
7ꢆꢉꢊꢇꢈꢈꢅ;ꢉꢃꢔꢎ%
ꢒꢌꢈ"ꢉ"ꢅꢂꢇꢍ2ꢇꢔꢉꢅꢘꢎꢃꢍ2ꢄꢉ
ꢖ%ꢇꢄ"ꢌ$$ꢅ
ꢕ
M
ꢓꢁ9ꢓ
ꢓꢁꢓ+
M
ꢀꢁꢓꢓ
M
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ꢀꢁꢓ+
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DS21290E-page 30
© 2008 Microchip Technology Inc.
MCP3201
APPENDIX A: REVISION HISTORY
Revision E (November 2008)
The following is the list of modifications:
1. Updated Section 7.0 “Packaging Informa-
tion”
2. Updated Section “Product Identification
System”.
Revision D (January 2007)
The following is the list of modifications:
1. This revision includes updates to the packaging
diagrams.
diagrams.Revision C (August 2001)
The following is the list of modifications:
1. This revision includes undocumented changes.
Revision B (August 1999)
The following is the list of modifications:
1. This revision includes undocumented changes.
Revision A (September 1998)
• Original Release of this Document.
© 2008 Microchip Technology Inc.
DS21290E-page 31
MCP3201
NOTES:
DS21290E-page 32
© 2008 Microchip Technology Inc.
MCP3201
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
Examples:
PART NO.
Device
X
X
/XX
a)
b)
c)
d)
e)
f)
MCP3201-BI/P:
B Grade,
Industrial Temperature,
8LD PDIP package.
Grade
Temperature
Range
Package
MCP3201-BI/SN: B Grade,
Industrial Temperature,
Device
Grade
MCP3201:
MCP3201T:
12-Bit A/D Converter w/SPI Interface
12-Bit A/D Converter w/SPI Interface
(Tape and Reel)
8LD SOIC package.
MCP3201-CI/P:
C Grade,
Industrial Temperature,
8LD PDIP package.
B:
C:
=
=
± LSB max INL (MSOP and TSSOP not available)
± LSB max INL
MCP3201-CI/MS: C Grade,
Industrial Temperature,
8LD MSOP package.
MCP3201-CI/SN: C Grade,
Temperature Range
Package
I
=
-40°C to+85°C(Industrial)
Industrial Temperature,
8LD SOIC package.
MS
P
SN
ST
=
=
=
=
Plastic Micro Small Outline (MSOP), 8-lead
Plastic DIP (300 mil Body), 8-lead
Plastic SOIC (150 mil Body), 8-lead
Plastic TSSOP (4.4 mm), 8-lead
MCP3201-CI/ST:
C Grade,
Industrial Temperature,
8LD TSSOP package.
g)
h)
i)
MCP3201T-BI/SN: Tape and Reel,B Grade,
Industrial Temperature,
8LD SOIC package.
MCP3201T-CI/MS: Tape and Reel, C Grade,
Industrial Temperature,
8LD MSOP package.
MCP3201T-CI/SN: Tape and Reel, C Grade,
Industrial Temperature,
8LD SOIC package.
j)
MCP3201T-CI/ST: Tape and Reel, C Grade,
Industrial Temperature,
8LD TSSOP package.
© 2008 Microchip Technology Inc.
DS21290E-page 33
MCP3201
NOTES:
DS21290E-page 34
© 2008 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, Accuron,
dsPIC, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro,
PICSTART, rfPIC, SmartShunt and UNI/O are registered
trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
FilterLab, Linear Active Thermistor, MXDEV, MXLAB,
SEEVAL, SmartSensor and The Embedded Control Solutions
Company are registered trademarks of Microchip Technology
Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, CodeGuard,
dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONITOR, FanSense, In-Circuit Serial
Programming, ICSP, ICEPIC, Mindi, MiWi, MPASM, MPLAB
Certified logo, MPLIB, MPLINK, mTouch, PICkit, PICDEM,
PICDEM.net, PICtail, PIC32 logo, PowerCal, PowerInfo,
PowerMate, PowerTool, REAL ICE, rfLAB, Select Mode, Total
Endurance, WiperLock and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2008, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received ISO/TS-16949:2002 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
© 2008 Microchip Technology Inc.
DS21290E-page 35
WORLDWIDE SALES AND SERVICE
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
Asia Pacific Office
Suites 3707-14, 37th Floor
Tower 6, The Gateway
Harbour City, Kowloon
Hong Kong
Tel: 852-2401-1200
Fax: 852-2401-3431
India - Bangalore
Tel: 91-80-4182-8400
Fax: 91-80-4182-8422
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://support.microchip.com
Web Address:
www.microchip.com
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
India - New Delhi
Tel: 91-11-4160-8631
Fax: 91-11-4160-8632
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
India - Pune
Tel: 91-20-2566-1512
Fax: 91-20-2566-1513
Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
Atlanta
Duluth, GA
Tel: 678-957-9614
Fax: 678-957-1455
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Japan - Yokohama
Tel: 81-45-471- 6166
Fax: 81-45-471-6122
China - Beijing
Tel: 86-10-8528-2100
Fax: 86-10-8528-2104
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Korea - Daegu
Tel: 82-53-744-4301
Fax: 82-53-744-4302
Boston
China - Chengdu
Tel: 86-28-8665-5511
Fax: 86-28-8665-7889
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Korea - Seoul
China - Hong Kong SAR
Tel: 852-2401-1200
Fax: 852-2401-3431
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
China - Nanjing
Tel: 86-25-8473-2460
Fax: 86-25-8473-2470
Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
Fax: 60-3-6201-9859
Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
UK - Wokingham
Tel: 44-118-921-5869
Fax: 44-118-921-5820
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
Malaysia - Penang
Tel: 60-4-227-8870
Fax: 60-4-227-4068
Detroit
Farmington Hills, MI
Tel: 248-538-2250
Fax: 248-538-2260
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
Kokomo
Kokomo, IN
Tel: 765-864-8360
Fax: 765-864-8387
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
China - Shenzhen
Tel: 86-755-8203-2660
Fax: 86-755-8203-1760
Taiwan - Hsin Chu
Tel: 886-3-572-9526
Fax: 886-3-572-6459
Los Angeles
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
Taiwan - Kaohsiung
Tel: 886-7-536-4818
Fax: 886-7-536-4803
Santa Clara
Santa Clara, CA
Tel: 408-961-6444
Fax: 408-961-6445
China - Xiamen
Tel: 86-592-2388138
Fax: 86-592-2388130
Taiwan - Taipei
Tel: 886-2-2500-6610
Fax: 886-2-2508-0102
Toronto
Mississauga, Ontario,
Canada
Tel: 905-673-0699
Fax: 905-673-6509
China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
01/02/08
DS21290E-page 36
© 2008 Microchip Technology Inc.
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