MCP4641-503E/MF [MICROCHIP]
7/8-Bit Single/Dual I2C Digital POT with Non-Volatile Memory; 7/8位单/双I2C数字电位器具有非易失性存储器型号: | MCP4641-503E/MF |
厂家: | MICROCHIP |
描述: | 7/8-Bit Single/Dual I2C Digital POT with Non-Volatile Memory |
文件: | 总92页 (文件大小:2071K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
MCP454X/456X/464X/466X
7/8-Bit Single/Dual I2C Digital POT with
Non-Volatile Memory
Features
Description
• Single or Dual Resistor Network options
• Potentiometer or Rheostat configuration options
• Resistor Network Resolution
- 7-bit: 128 Resistors (129 Steps)
- 8-bit: 256 Resistors (257 Steps)
• RAB Resistances options of:
- 5 kΩ
The MCP45XX and MCP46XX devices offer a wide
range of product offerings using an I2C interface. This
family of devices support 7-bit and 8-bit resistor
networks, Non-Volatile memory configurations, and
Potentiometer and Rheostat pinouts.
WiperLock Technology allows application-specific
calibration settings to be secured in the EEPROM.
- 10 kΩ
- 50 kΩ
- 100 kΩ
Package Types (top view)
MCP45X1
Single Potentiometer
MCP45X2
Single Rheostat
• Zero-Scale to Full-Scale Wiper operation
• Low Wiper Resistance: 75Ω (typ.)
• Low Tempco:
- Absolute (Rheostat): 50 ppm typical
(0°C to 70°C)
- Ratiometric (Potentiometer): 15 ppm typical
• Non-volatile Memory
- Automatic Recall of Saved Wiper Setting
- WiperLock™ Technology
- 10 General Purpose Memory Locations
• I2C Serial interface
- 100 kHz, 400 kHz and 3.4 MHz support
• Serial protocol allows:
- High-Speed Read/Write to wiper
- Read/Write to EEPROM
- Write Protect to be enabled/disabled
- WiperLock to be enabled/disabled
HVC / A0
HVC / A0
VDD
P0B
P0W
P0A
VDD
1
2
3
4
1
2
3
4
8
7
6
5
8
7
6
5
A1
SCL
SDA
VSS
SCL
SDA
VSS
P0B
P0W
MSOP
MSOP
HVC / A0
VDD HVC / A0
VDD
1
8
1
8
SCL
SDA
VSS
A1
SCL
SDA
VSS
A1
2
3
4
7
6
5
2
3
4
7
6
5
EP
9
EP
9
P0B
P0W
P0B
P0W
DFN 3x3 (MF) *
MCP46X1 Dual Potentiometers
DFN 3x3 (MF) *
VDD
A1
12 A2
HVC/A0
SCL
14
13
1
2
3
4
5
6
7
• Resistor Network Terminal Disconnect Feature
via the Terminal Control (TCON) Register
SDA
VSS
P1B
P1W
P1A
11
10
9
WP
16 15 14 13
P0B
P0W
P0A
SCL
SDA
VSS
VSS
WP
NC
P0B
P0W
1
2
3
4
12
11
10
9
• Write Protect Feature:
- Hardware Write Protect (WP) Control pin
- Software Write Protect (WP) Configuration bit
• Brown-out reset protection (1.5V typical)
• Serial Interface Inactive current (2.5 uA typ.)
• High-Voltage Tolerant Digital Inputs: Up to 12.5V
• Wide Operating Voltage:
- 2.7V to 5.5V - Device Characteristics Specified
- 1.8V to 5.5V - Device Operation
• Wide Bandwidth (-3dB) Operation:
- 2 MHz (typ.) for 5.0 kΩ device
EP
17
8
TSSOP
5 6 7
8
QFN-16 4x4 (ML) *
MCP46X2 Dual Rheostat
HVC / A0
V
DD
1
10
VDD
A1
P0B
P0W
P1W
HVC/A0
SCL
10
9
8
7
6
1
2
3
4
5
• Extended temperature range (-40°C to +125°C)
SCL
SDA
VSS
A1
2
3
4
5
9
8
7
6
SDA
EP
11
P0B
P0W
P1W
VSS
P1B
P1B
MSOP
DFN 3x3 (MF) *
* Includes Exposed Thermal Pad (EP); see Table 3-1.
© 2008 Microchip Technology Inc.
DS22107A-page 1
MCP454X/456X/464X/466X
Device Block Diagram
VDD
VSS
Power-up/
Brown-out
Control
P0A
Resistor
Network 0
(Pot 0)
P0W
I2C Serial
Interface
Module &
Control
Logic
(WiperLock™
Technology)
Wiper 0
& TCON
Register
A2
A1
P0B
P1A
HVC/A0
SCL
SDA
I2C Interface
Resistor
Network 1
(Pot 1)
WP
P1W
P1B
Wiper 1
& TCON
Register
Memory (16x9)
Wiper0 (V & NV)
Wiper1 (V & NV)
TCON
STATUS
For Dual Resistor Network
Devices Only
Data EEPROM
(10 x 9-bits)
Device Features
Resistance (typical)
VDD
Wiper
Configuration
Wiper
Device
Operating
Range (2)
R
AB Options (kΩ)
- RW
(Ω)
MCP4531 (3)
MCP4532 (3)
MCP4541
1
1
1
1
1
1
1
1
2
2
2
2
2
2
2
2
Potentiometer(1) I2C RAM No Mid-Scale 5.0, 10.0, 50.0, 100.0
Rheostat
I2C RAM No Mid-Scale 5.0, 10.0, 50.0, 100.0
Potentiometer(1) I2C
Rheostat
I2C
75
75
75
75
75
75
75
75
75
75
75
75
75
75
75
75
129 1.8V to 5.5V
129 1.8V to 5.5V
129 2.7V to 5.5V
129 2.7V to 5.5V
257 1.8V to 5.5V
257 1.8V to 5.5V
257 2.7V to 5.5V
257 2.7V to 5.5V
129 1.8V to 5.5V
129 1.8V to 5.5V
129 2.7V to 5.5V
129 2.7V to 5.5V
257 1.8V to 5.5V
257 1.8V to 5.5V
257 2.7V to 5.5V
257 2.7V to 5.5V
EE
EE
Yes NV Wiper 5.0, 10.0, 50.0, 100.0
Yes NV Wiper 5.0, 10.0, 50.0, 100.0
MCP4542
MCP4551 (3)
MCP4552 (3)
MCP4561
Potentiometer(1) I2C RAM No Mid-Scale 5.0, 10.0, 50.0, 100.0
Rheostat
I2C RAM No Mid-Scale 5.0, 10.0, 50.0, 100.0
Potentiometer(1) I2C
Rheostat
I2C
EE
EE
Yes NV Wiper 5.0, 10.0, 50.0, 100.0
Yes NV Wiper 5.0, 10.0, 50.0, 100.0
MCP4562
MCP4631 (3)
MCP4632 (3)
MCP4641
Potentiometer(1) I2C RAM No Mid-Scale 5.0, 10.0, 50.0, 100.0
Rheostat
I2C RAM No Mid-Scale 5.0, 10.0, 50.0, 100.0
Potentiometer(1) I2C
Rheostat
I2C
EE
EE
Yes NV Wiper 5.0, 10.0, 50.0, 100.0
Yes NV Wiper 5.0, 10.0, 50.0, 100.0
MCP4642
MCP4651 (3)
MCP4652 (3)
MCP4661
Potentiometer(1) I2C RAM No Mid-Scale 5.0, 10.0, 50.0, 100.0
Rheostat
I2C RAM No Mid-Scale 5.0, 10.0, 50.0, 100.0
Potentiometer(1) I2C
Rheostat
I2C
EE
EE
Yes NV Wiper 5.0, 10.0, 50.0, 100.0
Yes NV Wiper 5.0, 10.0, 50.0, 100.0
MCP4662
Note 1: Floating either terminal (A or B) allows the device to be used as a Rheostat (variable resistor).
2: Analog characteristics only tested from 2.7V to 5.5V unless otherwise noted.
3: Please check Microchip web site for device release and availability
DS22107A-page 2
© 2008 Microchip Technology Inc.
MCP454X/456X/464X/466X
† Notice: Stresses above those listed under “Maximum
Ratings” may cause permanent damage to the device. This is
a stress rating only and functional operation of the device at
those or any other conditions above those indicated in the
operational listings of this specification is not implied.
Exposure to maximum rating conditions for extended periods
1.0
ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings †
Voltage on VDD with respect to VSS ............... -0.6V to +7.0V
Voltage on HVC/A0, A1, A2, SCL, SDA, and WP with
respect to VSS ............................................................. -0.6V to 12.5V
Voltage on all other pins (PxA, PxW, and PxB)
may affect device reliability.
with respect to VSS ......................................... -0.3V to VDD + 0.3V
Input clamp current, IIK
(VI < 0, VI > VDD, VI > VPP ON HV pins)......................±20 mA
Output clamp current, IOK
(VO < 0 or VO > VDD) ..................................................±20 mA
Maximum output current sunk by any Output pin
......................................................................................25 mA
Maximum output current sourced by any Output pin
......................................................................................25 mA
Maximum current out of VSS pin .................................100 mA
Maximum current into VDD pin ....................................100 mA
Maximum current into PXA, PXW & PXB pins ............±2.5 mA
Storage temperature ....................................-65°C to +150°C
Ambient temperature with power applied
-40°C to +125°C
Total power dissipation (Note 1) ................................400 mW
Soldering temperature of leads (10 seconds).............+300°C
ESD protection on all pins .................................. ≥ 4 kV (HBM),
.......................................................................... ≥ 300V (MM)
Maximum Junction Temperature (TJ) .........................+150°C
Note 1: Power dissipation is calculated as follows:
PDIS = VDD x {IDD - ∑ IOH} + ∑ {(VDD-VOH) x IOH} + ∑(VOL x IOL
)
© 2008 Microchip Technology Inc.
DS22107A-page 3
MCP454X/456X/464X/466X
AC/DC CHARACTERISTICS
Standard Operating Conditions (unless otherwise specified)
Operating Temperature –40°C ≤ TA ≤ +125°C (extended)
DC Characteristics
All parameters apply across the specified operating ranges unless noted.
VDD = +2.7V to 5.5V, 5 kΩ, 10 kΩ, 50 kΩ, 100 kΩ devices.
Typical specifications represent values for VDD = 5.5V, TA = +25°C.
Parameters
Sym
Min
Typ
Max
Units
Conditions
Supply Voltage
VDD
2.7
1.8
—
—
—
5.5
2.7
V
V
V
Serial Interface only.
HVC pin Voltage
Range
VHV
VSS
12.5V
VDD ≥ The HVC pin will be at one
4.5V of three input levels
(VIL, VIH or VIHH). (Note 6)
VSS
—
—
—
VDD
8.0V
+
V
V
VDD <
4.5V
VDD Start Voltage
to ensure Wiper
Reset
VBOR
VDDRR
TBORD
IDD
1.65
RAM retention voltage (VRAM) < VBOR
VDD Rise Rate to
ensure Power-on
Reset
(Note 9)
10
V/ms
µs
Delay after device
exits the reset state
—
—
20
(VDD > VBOR
)
Supply Current
—
600
µA
Serial Interface Active,
(Note 10)
HVC/A0 = VIH (or VIL) (Note 11)
Write all 0’s to Volatile Wiper 0
VDD = 5.5V, FSCL = 3.4 MHz
—
—
—
—
250
575
µA
µA
Serial Interface Active,
HVC/A0 = VIH (or VIL) (Note 11)
Write all 0’s to Volatile Wiper 0
VDD = 5.5V, FSCL = 100 kHz
EE Write Current (Write Cycle)
(Non-Volatile device only),
VDD = 5.5V, FSCL = 400 kHz,
Write all 0’s to NonVolatile Wiper 0
SCL = VIL or VIH
—
2.5
5
µA
Serial Interface Inactive,
(Stop condition, SCL = SDA = VIH),
Wiper = 0
VDD = 5.5V, HVC/A0 = VIH
Note 1: Resistance is defined as the resistance between terminal A to terminal B.
2: INL and DNL are measured at VW with VA = VDD and VB = VSS
.
3: MCP4XX1 only.
4: MCP4XX2 only, includes VWZSE and VWFSE
.
5: Resistor terminals A, W and B’s polarity with respect to each other is not restricted.
6: This specification by design.
7: Non-linearity is affected by wiper resistance (RW), which changes significantly overvoltage and
temperature.
8: The MCP4XX1 is externally connected to match the configurations of the MCP45X2 and MCP46X2, and
then tested.
9: POR/BOR is not rate dependent.
10: Supply current is independent of current through the resistor network
11: When HVC/A0 = VIHH, the IDD current is less due to current into the HVC/A0 pin. See IPU specification
DS22107A-page 4
© 2008 Microchip Technology Inc.
MCP454X/456X/464X/466X
AC/DC CHARACTERISTICS (CONTINUED)
Standard Operating Conditions (unless otherwise specified)
Operating Temperature –40°C ≤ TA ≤ +125°C (extended)
DC Characteristics
All parameters apply across the specified operating ranges unless noted.
VDD = +2.7V to 5.5V, 5 kΩ, 10 kΩ, 50 kΩ, 100 kΩ devices.
Typical specifications represent values for VDD = 5.5V, TA = +25°C.
Parameters
Sym
Min
Typ
Max
Units
Conditions
-502 devices (Note 1)
Resistance
(± 20%)
RAB
4.0
8.0
5
10
6.0
12.0
60.0
120.0
kΩ
kΩ
kΩ
kΩ
-103 devices (Note 1)
-503 devices (Note 1)
-104 devices (Note 1)
40.0
80.0
50
100
257
129
RAB
Resolution
N
Taps 8-bit
Taps 7-bit
No Missing Codes
No Missing Codes
Note 6
Step Resistance
RS
—
—
—
—
/
—
—
Ω
8-bit
(256)
RAB
(128)
/
Ω
7-bit
Note 6
Nominal
Resistance Match
|RAB0 - RAB1| /
RAB
0.2
1.25
1.5
%
%
MCP46X1 devices only
|RBW0 - RBW1
|
0.25
MCP46X2 devices only,
/ RBW
Code = Full-Scale
Wiper Resistance
(Note 3, Note 4)
RW
—
—
—
—
—
—
75
75
160
300
—
Ω
Ω
VDD = 5.5 V, IW = 2.0 mA, code = 00h
VDD = 2.7 V, IW = 2.0 mA, code = 00h
Nominal
Resistance
Tempco
ΔRAB/ΔT
50
ppm/°C TA = -20°C to +70°C
ppm/°C TA = -40°C to +85°C
ppm/°C TA = -40°C to +125°C
ppm/°C Code = Midscale (80h or 40h)
100
150
15
—
—
Ratiometeric
Tempco
ΔVWB/ΔT
—
Resistor Terminal
Input Voltage
VA,VW,VB
Vss
—
VDD
V
Note 5, Note 6
Range (Terminals
A, B and W)
Note 1: Resistance is defined as the resistance between terminal A to terminal B.
2: INL and DNL are measured at VW with VA = VDD and VB = VSS
.
3: MCP4XX1 only.
4: MCP4XX2 only, includes VWZSE and VWFSE
.
5: Resistor terminals A, W and B’s polarity with respect to each other is not restricted.
6: This specification by design.
7: Non-linearity is affected by wiper resistance (RW), which changes significantly overvoltage and
temperature.
8: The MCP4XX1 is externally connected to match the configurations of the MCP45X2 and MCP46X2, and
then tested.
9: POR/BOR is not rate dependent.
10: Supply current is independent of current through the resistor network
11: When HVC/A0 = VIHH, the IDD current is less due to current into the HVC/A0 pin. See IPU specification
© 2008 Microchip Technology Inc.
DS22107A-page 5
MCP454X/456X/464X/466X
AC/DC CHARACTERISTICS (CONTINUED)
Standard Operating Conditions (unless otherwise specified)
Operating Temperature –40°C ≤ TA ≤ +125°C (extended)
DC Characteristics
All parameters apply across the specified operating ranges unless noted.
VDD = +2.7V to 5.5V, 5 kΩ, 10 kΩ, 50 kΩ, 100 kΩ devices.
Typical specifications represent values for VDD = 5.5V, TA = +25°C.
Parameters
Sym
Min
Typ
Max
Units
Conditions
IAW
W = Full-Scale (FS)
IBW
W = Zero Scale (ZS)
IAW or IBW
,
Maximum current
through Terminal
(A, W or B)
IT
—
—
2.5
mA
Terminal A
Terminal B
Terminal W
,
—
—
—
—
—
—
2.5
2.5
mA
mA
mA
Note 6
,
W = FS or ZS
IAB, VB = 0V,
VA = 5.5V,
1.38
RAB(MIN) = 4000
IAB, VB = 0V,
VA = 5.5V,
—
—
—
—
—
—
0.688
0.138
0.069
mA
mA
mA
Terminal A
and
Terminal B
RAB(MIN) = 8000
IAB, VB = 0V,
VA = 5.5V,
RAB(MIN) = 40000
IAB, VB = 0V,
VA = 5.5V,
RAB(MIN) = 80000
Leakage current
into A, W or B
IWL
—
—
—
100
100
100
—
—
—
nA
nA
nA
MCP4XX1 PxA = PxW = PxB = VSS
MCP4XX2 PxB = PxW = VSS
Terminals Disconnected
(R1HW = R0HW = 0)
Note 1: Resistance is defined as the resistance between terminal A to terminal B.
2: INL and DNL are measured at VW with VA = VDD and VB = VSS
.
3: MCP4XX1 only.
4: MCP4XX2 only, includes VWZSE and VWFSE
.
5: Resistor terminals A, W and B’s polarity with respect to each other is not restricted.
6: This specification by design.
7: Non-linearity is affected by wiper resistance (RW), which changes significantly overvoltage and
temperature.
8: The MCP4XX1 is externally connected to match the configurations of the MCP45X2 and MCP46X2, and
then tested.
9: POR/BOR is not rate dependent.
10: Supply current is independent of current through the resistor network
11: When HVC/A0 = VIHH, the IDD current is less due to current into the HVC/A0 pin. See IPU specification
DS22107A-page 6
© 2008 Microchip Technology Inc.
MCP454X/456X/464X/466X
AC/DC CHARACTERISTICS (CONTINUED)
Standard Operating Conditions (unless otherwise specified)
Operating Temperature –40°C ≤ TA ≤ +125°C (extended)
DC Characteristics
All parameters apply across the specified operating ranges unless noted.
VDD = +2.7V to 5.5V, 5 kΩ, 10 kΩ, 50 kΩ, 100 kΩ devices.
Typical specifications represent values for VDD = 5.5V, TA = +25°C.
Parameters
Sym
Min
Typ
Max
Units
Conditions
3.0V ≤ VDD ≤ 5.5V
Full-Scale Error
(MCP4XX1 only)
(8-bit code = 100h,
7-bit code = 80h)
VWFSE
-6.0
-4.0
-3.5
-2.0
-0.8
-0.5
-0.5
-0.5
—
-0.1
-0.1
—
—
LSb 5 kΩ
8-bit
7-bit
LSb
3.0V ≤ VDD ≤ 5.5V
3.0V ≤ VDD ≤ 5.5V
3.0V ≤ VDD ≤ 5.5V
3.0V ≤ VDD ≤ 5.5V
3.0V ≤ VDD ≤ 5.5V
3.0V ≤ VDD ≤ 5.5V
3.0V ≤ VDD ≤ 5.5V
3.0V ≤ VDD ≤ 5.5V
3.0V ≤ VDD ≤ 5.5V
3.0V ≤ VDD ≤ 5.5V
3.0V ≤ VDD ≤ 5.5V
3.0V ≤ VDD ≤ 5.5V
3.0V ≤ VDD ≤ 5.5V
3.0V ≤ VDD ≤ 5.5V
3.0V ≤ VDD ≤ 5.5V
-0.1
—
LSb 10 kΩ 8-bit
LSb 7-bit
LSb 50 kΩ 8-bit
LSb 7-bit
LSb 100 kΩ 8-bit
-0.1
—
-0.1
—
-0.1
—
-0.1
—
-0.1
—
LSb
7-bit
8-bit
7-bit
Zero-Scale Error
(MCP4XX1 only)
(8-bit code = 00h,
7-bit code = 00h)
VWZSE
+0.1
+0.1
+0.1
+0.1
+0.1
+0.1
+0.1
+0.1
±0.5
±0.25
+6.0
+3.0
+3.5
+2.0
+0.8
+0.5
+0.5
+0.5
+1
LSb 5 kΩ
LSb
—
—
LSb 10 kΩ 8-bit
LSb 7-bit
LSb 50 kΩ 8-bit
LSb 7-bit
LSb 100 kΩ 8-bit
—
—
—
—
—
LSb
7-bit
Potentiometer
Integral
Non-linearity
INL
-1
LSb 8-bit
LSb 7-bit
3.0V ≤ VDD ≤ 5.5V
MCP4XX1 devices only
(Note 2)
-0.5
+0.5
Potentiometer
Differential
Non-linearity
DNL
-0.5
±0.25
+0.5
LSb 8-bit
LSb 7-bit
3.0V ≤ VDD ≤ 5.5V
MCP4XX1 devices only
(Note 2)
-0.25
±0.125
+0.25
Note 1: Resistance is defined as the resistance between terminal A to terminal B.
2: INL and DNL are measured at VW with VA = VDD and VB = VSS
.
3: MCP4XX1 only.
4: MCP4XX2 only, includes VWZSE and VWFSE
.
5: Resistor terminals A, W and B’s polarity with respect to each other is not restricted.
6: This specification by design.
7: Non-linearity is affected by wiper resistance (RW), which changes significantly overvoltage and
temperature.
8: The MCP4XX1 is externally connected to match the configurations of the MCP45X2 and MCP46X2, and
then tested.
9: POR/BOR is not rate dependent.
10: Supply current is independent of current through the resistor network
11: When HVC/A0 = VIHH, the IDD current is less due to current into the HVC/A0 pin. See IPU specification
© 2008 Microchip Technology Inc.
DS22107A-page 7
MCP454X/456X/464X/466X
AC/DC CHARACTERISTICS (CONTINUED)
Standard Operating Conditions (unless otherwise specified)
Operating Temperature –40°C ≤ TA ≤ +125°C (extended)
DC Characteristics
All parameters apply across the specified operating ranges unless noted.
VDD = +2.7V to 5.5V, 5 kΩ, 10 kΩ, 50 kΩ, 100 kΩ devices.
Typical specifications represent values for VDD = 5.5V, TA = +25°C.
Parameters
Sym
Min
Typ
Max
Units
Conditions
Code = 80h
Bandwidth -3 dB
(See Figure 2-58,
load = 30 pF)
BW
—
—
—
—
—
—
—
—
2
2
—
—
—
—
—
—
—
—
MHz 5 kΩ
8-bit
7-bit
MHz
Code = 40h
Code = 80h
Code = 40h
Code = 80h
Code = 40h
Code = 80h
Code = 40h
1
MHz 10 kΩ 8-bit
MHz 7-bit
kHz 50 kΩ 8-bit
kHz 7-bit
kHz 100 kΩ 8-bit
kHz 7-bit
1
200
200
100
100
Note 1: Resistance is defined as the resistance between terminal A to terminal B.
2: INL and DNL are measured at VW with VA = VDD and VB = VSS
.
3: MCP4XX1 only.
4: MCP4XX2 only, includes VWZSE and VWFSE
.
5: Resistor terminals A, W and B’s polarity with respect to each other is not restricted.
6: This specification by design.
7: Non-linearity is affected by wiper resistance (RW), which changes significantly overvoltage and
temperature.
8: The MCP4XX1 is externally connected to match the configurations of the MCP45X2 and MCP46X2, and
then tested.
9: POR/BOR is not rate dependent.
10: Supply current is independent of current through the resistor network
11: When HVC/A0 = VIHH, the IDD current is less due to current into the HVC/A0 pin. See IPU specification
DS22107A-page 8
© 2008 Microchip Technology Inc.
MCP454X/456X/464X/466X
AC/DC CHARACTERISTICS (CONTINUED)
Standard Operating Conditions (unless otherwise specified)
Operating Temperature –40°C ≤ TA ≤ +125°C (extended)
DC Characteristics
Parameters
All parameters apply across the specified operating ranges unless noted.
VDD = +2.7V to 5.5V, 5 kΩ, 10 kΩ, 50 kΩ, 100 kΩ devices.
Typical specifications represent values for VDD = 5.5V, TA = +25°C.
Sym
Min
Typ
Max
Units
Conditions
5.5V, IW = 900 µA
Rheostat Integral
Non-linearity
MCP45X1
(Note 4, Note 8)
MCP4XX2 devices
only (Note 4)
R-INL
-1.5
±0.5
+4.5
+1.5
LSb 5 kΩ
8-bit
7-bit
-8.25
+8.25
LSb
3.0V, IW = 480 µA
(Note 7)
-1.125
-6.0
±0.5
+4.5
+1.125
+6.0
LSb
LSb
5.5V, IW = 900 µA
3.0V, IW = 480 µA
(Note 7)
-1.5
-5.5
±0.5
+2.5
+1.5
+5.5
LSb 10 kΩ 8-bit
5.5V, IW = 450 µA
LSb
3.0V, IW = 240 µA
(Note 7)
-1.125
-4.0
±0.5
+2.5
+1.125
+4.0
LSb
LSb
7-bit
5.5V, IW = 450 µA
3.0V, IW = 240 µA
(Note 7)
-1.5
-2.0
±0.5
+1
+1.5
+2.0
LSb 50 kΩ 8-bit
5.5V, IW = 90 µA
LSb
3.0V, IW = 48 µA
(Note 7)
-1.125
-1.5
±0.5
+1
+1.125
+1.5
LSb
LSb
7-bit
5.5V, IW = 90 µA
3.0V, IW = 48 µA
(Note 7)
-1.0
-1.5
±0.5
+1.0
+1.5
LSb 100 kΩ 8-bit
5.5V, IW = 45 µA
+0.25
LSb
3.0V, IW = 24 µA
(Note 7)
-0.8
±0.5
+0.8
LSb
LSb
7-bit
5.5V, IW = 45 µA
-1.125
+0.25
+1.125
3.0V, IW = 24 µA
(Note 7)
Note 1: Resistance is defined as the resistance between terminal A to terminal B.
2: INL and DNL are measured at VW with VA = VDD and VB = VSS
.
3: MCP4XX1 only.
4: MCP4XX2 only, includes VWZSE and VWFSE
.
5: Resistor terminals A, W and B’s polarity with respect to each other is not restricted.
6: This specification by design.
7: Non-linearity is affected by wiper resistance (RW), which changes significantly overvoltage and
temperature.
8: The MCP4XX1 is externally connected to match the configurations of the MCP45X2 and MCP46X2, and
then tested.
9: POR/BOR is not rate dependent.
10: Supply current is independent of current through the resistor network
11: When HVC/A0 = VIHH, the IDD current is less due to current into the HVC/A0 pin. See IPU specification
© 2008 Microchip Technology Inc.
DS22107A-page 9
MCP454X/456X/464X/466X
AC/DC CHARACTERISTICS (CONTINUED)
Standard Operating Conditions (unless otherwise specified)
Operating Temperature –40°C ≤ TA ≤ +125°C (extended)
DC Characteristics
All parameters apply across the specified operating ranges unless noted.
VDD = +2.7V to 5.5V, 5 kΩ, 10 kΩ, 50 kΩ, 100 kΩ devices.
Typical specifications represent values for VDD = 5.5V, TA = +25°C.
Parameters
Sym
Min
Typ
Max
Units
Conditions
5.5V, IW = 900 µA
Rheostat
R-DNL
-0.5
-1.0
±0.25
+0.5
+0.5
+1.0
LSb 5 kΩ
8-bit
7-bit
Differential
Non-linearity
MCP45X1
(Note 4, Note 8)
MCP4XX2 devices
only
LSb
3.0V, IW = 480 µA
(Note 7)
-0.375
-0.75
±0.25
+0.5
+0.375
+0.75
LSb
LSb
5.5V, IW = 900 µA
3.0V, IW = 480 µA
(Note 7)
(Note 4)
-0.5
-1.0
±0.25
+0.25
+0.5
+1.0
LSb 10 kΩ 8-bit
5.5V, IW = 450 µA
LSb
3.0V, IW = 240 µA
(Note 7)
-0.375
-0.75
±0.25
+0.5
+0.375
+0.75
LSb
LSb
7-bit
5.5V, IW = 450 µA
3.0V, IW = 240 µA
(Note 7)
-0.5
-0.5
±0.25
±0.25
+0.5
+0.5
LSb 50 kΩ 8-bit
5.5V, IW = 90 µA
LSb
3.0V, IW = 48 µA
(Note 7)
-0.375
-0.375
±0.25
±0.25
+0.375
+0.375
LSb
LSb
7-bit
5.5V, IW = 90 µA
3.0V, IW = 48 µA
(Note 7)
-0.5
-0.5
±0.25
±0.25
+0.5
+0.5
LSb 100 kΩ 8-bit
5.5V, IW = 45 µA
LSb
3.0V, IW = 24 µA
(Note 7)
-0.375
-0.375
±0.25
±0.25
+0.375
+0.375
LSb
LSb
7-bit
5.5V, IW = 45 µA
3.0V, IW = 24 µA
(Note 7)
Capacitance (PA)
Capacitance (Pw)
Capacitance (PB)
CAW
CW
—
—
—
75
120
75
—
—
—
pF
pF
pF
f =1 MHz, Code = Full-Scale
f =1 MHz, Code = Full-Scale
f =1 MHz, Code = Full-Scale
CBW
Note 1: Resistance is defined as the resistance between terminal A to terminal B.
2: INL and DNL are measured at VW with VA = VDD and VB = VSS
.
3: MCP4XX1 only.
4: MCP4XX2 only, includes VWZSE and VWFSE
.
5: Resistor terminals A, W and B’s polarity with respect to each other is not restricted.
6: This specification by design.
7: Non-linearity is affected by wiper resistance (RW), which changes significantly overvoltage and
temperature.
8: The MCP4XX1 is externally connected to match the configurations of the MCP45X2 and MCP46X2, and
then tested.
9: POR/BOR is not rate dependent.
10: Supply current is independent of current through the resistor network
11: When HVC/A0 = VIHH, the IDD current is less due to current into the HVC/A0 pin. See IPU specification
DS22107A-page 10
© 2008 Microchip Technology Inc.
MCP454X/456X/464X/466X
AC/DC CHARACTERISTICS (CONTINUED)
Standard Operating Conditions (unless otherwise specified)
Operating Temperature –40°C ≤ TA ≤ +125°C (extended)
DC Characteristics
All parameters apply across the specified operating ranges unless noted.
VDD = +2.7V to 5.5V, 5 kΩ, 10 kΩ, 50 kΩ, 100 kΩ devices.
Typical specifications represent values for VDD = 5.5V, TA = +25°C.
Parameters
Sym
Min
Typ
Max
Units
Conditions
Digital Inputs/Outputs (SDA, SCK, HVC/A0, A1, A2, WP)
Schmitt Trigger
High Input
VIH
0.45 VDD
—
—
V
All
2.7V ≤ VDD ≤ 5.5V
Inputs (Allows 2.7V Digital VDD with
Threshold
except 5V Analog VDD
SDA
and
)
0.5 VDD
—
—
V
1.8V ≤ VDD ≤ 2.7V
SCL
0.7 VDD
0.7 VDD
0.7 VDD
0.7 VDD
—
—
—
VMAX
VMAX
VMAX
VMAX
0.2VDD
0.3VDD
0.3VDD
0.3VDD
0.3VDD
—
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
100 kHz
400 kHz
1.7 MHz
3.4 Mhz
SDA
and
SCL
—
—
Schmitt Trigger
Low Input
Threshold
VIL
—
All inputs except SDA and SCL
100 kHz
-0.5
—
SDA
and
SCL
-0.5
—
400 kHz
-0.5
—
1.7 MHz
-0.5
—
3.4 Mhz
Hysteresis of
Schmitt Trigger
Inputs (Note 6)
VHYS
—
0.1VDD
—
All inputs except SDA and SCL
N.A.
—
VDD < 2.0V
100 kHz
N.A.
—
—
VDD ≥ 2.0V
SDA
0.1 VDD
0.05 VDD
0.1 VDD
0.1 VDD
8.5
—
—
VDD < 2.0V
and 400 kHz
—
—
VDD ≥ 2.0V
SCL
—
—
1.7 MHz
—
—
12.5 (6)
3.4 Mhz
High Voltage Input
Entry Voltage
VIHHEN
VIHHEX
VMAX
—
Threshold for WiperLock™ Technology
High Voltage Input
Exit Voltage
—
—
—
—
VDD
+
V
V
0.8V (6)
12.5 (6)
High Voltage Limit
Pin can tolerate VMAX or less.
Note 1: Resistance is defined as the resistance between terminal A to terminal B.
2: INL and DNL are measured at VW with VA = VDD and VB = VSS
.
3: MCP4XX1 only.
4: MCP4XX2 only, includes VWZSE and VWFSE
.
5: Resistor terminals A, W and B’s polarity with respect to each other is not restricted.
6: This specification by design.
7: Non-linearity is affected by wiper resistance (RW), which changes significantly overvoltage and
temperature.
8: The MCP4XX1 is externally connected to match the configurations of the MCP45X2 and MCP46X2, and
then tested.
9: POR/BOR is not rate dependent.
10: Supply current is independent of current through the resistor network
11: When HVC/A0 = VIHH, the IDD current is less due to current into the HVC/A0 pin. See IPU specification
© 2008 Microchip Technology Inc.
DS22107A-page 11
MCP454X/456X/464X/466X
AC/DC CHARACTERISTICS (CONTINUED)
Standard Operating Conditions (unless otherwise specified)
Operating Temperature –40°C ≤ TA ≤ +125°C (extended)
DC Characteristics
All parameters apply across the specified operating ranges unless noted.
VDD = +2.7V to 5.5V, 5 kΩ, 10 kΩ, 50 kΩ, 100 kΩ devices.
Typical specifications represent values for VDD = 5.5V, TA = +25°C.
Parameters
Sym
Min
Typ
Max
Units
Conditions
Output Low
Voltage (SDA)
VOL
VSS
VSS
—
—
—
—
0.2VDD
0.4
V
V
VDD < 2.0V, IOL = 1 mA
VDD ≥ 2.0V, IOL = 3 mA
Weak Pull-up /
Pull-down Current
IPU
1.75
mA
Internal VDD pull-up, VIHH pull-down
VDD = 5.5V, VIHH = 12.5V
—
—
170
16
—
—
µA
HVC pin, VDD = 5.5V, VHVC = 3V
VDD = 5.5V, VHVC = 3V
HVC Pull-up /
Pull-down
RHVC
kΩ
Resistance
Input Leakage Cur-
rent
IIL
-1
—
1
µA
pF
VIN = VDD and VIN = VSS
fC = 3.4 MHz
Pin Capacitance
RAM (Wiper) Value
Value Range
CIN, COUT
—
10
—
N
0h
0h
—
—
1FFh
1FFh
hex
hex
hex
8-bit device
7-bit device
TCON POR/BOR
Value
NTCON
1FFh
All Terminals connected
EEPROM
Endurance
Endurance
—
1M
—
—
Cycles
hex
EEPROM Range
N
N
0h
1FFh
Initial Factory
Setting
80h
40h
5
hex
8-bit
7-bit
WiperLock Technology = Off
WiperLock Technology = Off
hex
EEPROM
tWC
—
10
ms
Programming Write
Cycle Time
Power Requirements
Power Supply
Sensitivity
(MCP45X2 and
MCP46X2 only)
PSS
—
—
0.0015 0.0035
0.0015 0.0035
%/% 8-bit
%/% 7-bit
VDD = 2.7V to 5.5V,
VA = 2.7V, Code = 80h
VDD = 2.7V to 5.5V,
VA = 2.7V, Code = 40h
Note 1: Resistance is defined as the resistance between terminal A to terminal B.
2: INL and DNL are measured at VW with VA = VDD and VB = VSS
.
3: MCP4XX1 only.
4: MCP4XX2 only, includes VWZSE and VWFSE
.
5: Resistor terminals A, W and B’s polarity with respect to each other is not restricted.
6: This specification by design.
7: Non-linearity is affected by wiper resistance (RW), which changes significantly overvoltage and
temperature.
8: The MCP4XX1 is externally connected to match the configurations of the MCP45X2 and MCP46X2, and
then tested.
9: POR/BOR is not rate dependent.
10: Supply current is independent of current through the resistor network
11: When HVC/A0 = VIHH, the IDD current is less due to current into the HVC/A0 pin. See IPU specification
DS22107A-page 12
© 2008 Microchip Technology Inc.
MCP454X/456X/464X/466X
SCL
SDA
93
91
90
92
STOP
Condition
START
Condition
2
FIGURE 1-1:
I C Bus Start/Stop Bits Timing Waveforms.
2
TABLE 1-1:
I C BUS START/STOP BITS REQUIREMENTS
I2C AC Characteristics
Standard Operating Conditions (unless otherwise specified)
Operating Temperature –40°C ≤ TA ≤ +125°C (Extended)
Operating Voltage VDD range is described in AC/DC characteristics
Param.
Symbol
No.
Characteristic
Standard Mode
Min
Max
Units
Conditions
FSCL
0
0
100
400
1.7
3.4
400
400
400
100
—
kHz Cb = 400 pF, 1.8V - 5.5V
Fast Mode
kHz Cb = 400 pF, 2.7V - 5.5V
High-Speed 1.7
High-Speed 3.4
100 kHz mode
400 kHz mode
1.7 MHz mode
3.4 MHz mode
100 kHz mode
400 kHz mode
1.7 MHz mode
3.4 MHz mode
100 kHz mode
400 kHz mode
1.7 MHz mode
3.4 MHz mode
100 kHz mode
400 kHz mode
1.7 MHz mode
3.4 MHz mode
100 kHz mode
400 kHz mode
1.7 MHz mode
3.4 MHz mode
0
MHz Cb = 400 pF, 4.5V - 5.5V
0
MHz Cb = 100 pF, 4.5V - 5.5V
D102
90
Cb
Bus capacitive
loading
—
pF
pF
pF
pF
—
—
—
TSU:STA START condition
Setup time
4700
600
160
160
4000
600
160
160
4000
600
160
160
4000
600
160
160
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
Only relevant for repeated
START condition
—
—
—
91
THD:STA START condition
Hold time
—
After this period the first
clock pulse is generated
—
—
—
92
TSU:STO STOP condition
Setup time
—
—
—
—
93
THD:STO STOP condition
Hold time
—
—
—
—
© 2008 Microchip Technology Inc.
DS22107A-page 13
MCP454X/456X/464X/466X
103
102
100
101
SCL
90
106
91
92
107
SDA
In
110
109
109
SDA
Out
2
FIGURE 1-2:
I C Bus Data Timing.
2
TABLE 1-2:
I C BUS DATA REQUIREMENTS (SLAVE MODE)
I2C AC Characteristics
Standard Operating Conditions (unless otherwise specified)
Operating Temperature –40°C ≤ TA ≤ +125°C (Extended)
Operating Voltage VDD range is described in AC/DC characteristics
Param.
No.
Sym
Characteristic
Min
Max Units
Conditions
Clockhightime 100 kHz mode
400 kHz mode
4000
600
120
60
—
—
ns
ns
ns
ns
ns
ns
ns
ns
1.8V-5.5V
100
THIGH
2.7V-5.5V
4.5V-5.5V
4.5V-5.5V
1.8V-5.5V
2.7V-5.5V
4.5V-5.5V
4.5V-5.5V
1.7 MHz mode
3.4 MHz mode
—
—
—
101
TLOW
Clock low time 100 kHz mode
400 kHz mode
4700
1300
320
160
1.7 MHz mode
3.4 MHz mode
—
Note 1: As a transmitter, the device must provide this internal minimum delay time to bridge the undefined region
(minimum 300 ns) of the falling edge of SCL to avoid unintended generation of START or STOP conditions.
2: A fast-mode (400 kHz) I2C-bus device can be used in a standard-mode (100 kHz) I2C-bus system, but the
requirement tSU;DAT ≥ 250 ns must then be met. This will automatically be the case if the device does not
stretch the LOW period of the SCL signal. If such a device does stretch the LOW period of the SCL signal,
it must output the next data bit to the SDA line
TR max.+tSU;DAT = 1000 + 250 = 1250 ns (according to the standard-mode I2C bus specification) before
the SCL line is released.
3: The MCP46X1/MCP46X2 device must provide a data hold time to bridge the undefined part between VIH
and VIL of the falling edge of the SCL signal. This specification is not a part of the I2C specification, but
must be tested in order to ensure that the output data will meet the setup and hold specifications for the
receiving device.
4: Use Cb in pF for the calculations.
5: Not Tested
6: A Master Transmitter must provide a delay to ensure that difference between SDA and SCL fall times do
not unintentionally create a Start or Stop condition.
7: Ensured by the TAA 3.4 MHz specification test.
DS22107A-page 14
© 2008 Microchip Technology Inc.
MCP454X/456X/464X/466X
2
TABLE 1-2:
I C BUS DATA REQUIREMENTS (SLAVE MODE) (CONTINUED)
I2C AC Characteristics
Standard Operating Conditions (unless otherwise specified)
Operating Temperature
–40°C ≤ TA ≤ +125°C (Extended)
Operating Voltage VDD range is described in AC/DC characteristics
Param.
No.
Sym
Characteristic
Min
Max Units
Conditions
102A (5)
TRSCL
SCL rise time
100 kHz mode
400 kHz mode
1.7 MHz mode
1.7 MHz mode
—
20 + 0.1Cb
20
1000
300
80
ns
ns
ns
ns
Cb is specified to be from
10 to 400 pF (100 pF maxi-
mum for 3.4 MHz mode)
20
160
After a Repeated Start con-
dition or an Acknowledge
bit
3.4 MHz mode
3.4 MHz mode
10
10
40
80
ns
ns
After a Repeated Start
condition or an Acknowl-
edge bit
102B (5)
TRSDA
TFSCL
TFSDA
SDA rise time
SCL fall time
SDA fall time
100 kHz mode
400 kHz mode
1.7 MHz mode
3.4 MHz mode
100 kHz mode
400 kHz mode
1.7 MHz mode
3.4 MHz mode
100 kHz mode
—
1000
300
160
80
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
Cb is specified to be from
10 to 400 pF (100 pF max
for 3.4 MHz mode)
20 + 0.1Cb
20
10
103A (5)
—
300
300
80
Cb is specified to be from
10 to 400 pF (100 pF max
for 3.4 MHz mode)
20 + 0.1Cb
20
10
—
40
103B (5)
300
Cb is specified to be from
10 to 400 pF (100 pF max
for 3.4 MHz mode)
400 kHz mode 20 + 0.1Cb (4) 300
1.7 MHz mode
3.4 MHz mode
20
10
0
160
80
—
106
THD:DAT Data input hold 100 kHz mode
1.8V-5.5V, Note 6
2.7V-5.5V, Note 6
4.5V-5.5V, Note 6
4.5V-5.5V, Note 6
time
400 kHz mode
0
—
1.7 MHz mode
3.4 MHz mode
0
—
0
—
Note 1: As a transmitter, the device must provide this internal minimum delay time to bridge the undefined region
(minimum 300 ns) of the falling edge of SCL to avoid unintended generation of START or STOP conditions.
2: A fast-mode (400 kHz) I2C-bus device can be used in a standard-mode (100 kHz) I2C-bus system, but the
requirement tSU;DAT ≥ 250 ns must then be met. This will automatically be the case if the device does not
stretch the LOW period of the SCL signal. If such a device does stretch the LOW period of the SCL signal,
it must output the next data bit to the SDA line
TR max.+tSU;DAT = 1000 + 250 = 1250 ns (according to the standard-mode I2C bus specification) before
the SCL line is released.
3: The MCP46X1/MCP46X2 device must provide a data hold time to bridge the undefined part between VIH
and VIL of the falling edge of the SCL signal. This specification is not a part of the I2C specification, but
must be tested in order to ensure that the output data will meet the setup and hold specifications for the
receiving device.
4: Use Cb in pF for the calculations.
5: Not Tested
6: A Master Transmitter must provide a delay to ensure that difference between SDA and SCL fall times do
not unintentionally create a Start or Stop condition.
7: Ensured by the TAA 3.4 MHz specification test.
© 2008 Microchip Technology Inc.
DS22107A-page 15
MCP454X/456X/464X/466X
2
TABLE 1-2:
I C BUS DATA REQUIREMENTS (SLAVE MODE) (CONTINUED)
I2C AC Characteristics
Standard Operating Conditions (unless otherwise specified)
Operating Temperature –40°C ≤ TA ≤ +125°C (Extended)
Operating Voltage VDD range is described in AC/DC characteristics
Param.
No.
Sym
Characteristic
Min
Max Units
Conditions
107
TSU:DAT Data input setup 100 kHz mode
250
100
10
10
—
—
—
ns
ns
ns
ns
ns
ns
ns
Note 2
Note 1
time
400 kHz mode
1.7 MHz mode
3.4 MHz mode
—
—
109
TAA
Output valid
from clock
100 kHz mode
400 kHz mode
1.7 MHz mode
3450
900
150
—
—
Cb = 100 pF,
Note 1, Note 7
—
310
ns
Cb = 400 pF,
Note 1, Note 5
3.4 MHz mode
100 kHz mode
400 kHz mode
1.7 MHz mode
3.4 MHz mode
—
4700
1300
N.A.
N.A.
—
150
—
ns
ns
ns
ns
ns
ns
ns
ns
ns
Cb = 100 pF, Note 1
110
TBUF
Bus free time
Time the bus must be free
before a new transmission
can start
—
—
—
TSP
Input filter spike 100 kHz mode
50
50
10
10
Philips Spec states N.A.
suppression
(SDA and SCL)
400 kHz mode
—
1.7 MHz mode
—
Spike suppression
Spike suppression
3.4 MHz mode
—
Note 1: As a transmitter, the device must provide this internal minimum delay time to bridge the undefined region
(minimum 300 ns) of the falling edge of SCL to avoid unintended generation of START or STOP conditions.
2: A fast-mode (400 kHz) I2C-bus device can be used in a standard-mode (100 kHz) I2C-bus system, but the
requirement tSU;DAT ≥ 250 ns must then be met. This will automatically be the case if the device does not
stretch the LOW period of the SCL signal. If such a device does stretch the LOW period of the SCL signal,
it must output the next data bit to the SDA line
TR max.+tSU;DAT = 1000 + 250 = 1250 ns (according to the standard-mode I2C bus specification) before
the SCL line is released.
3: The MCP46X1/MCP46X2 device must provide a data hold time to bridge the undefined part between VIH
and VIL of the falling edge of the SCL signal. This specification is not a part of the I2C specification, but
must be tested in order to ensure that the output data will meet the setup and hold specifications for the
receiving device.
4: Use Cb in pF for the calculations.
5: Not Tested
6: A Master Transmitter must provide a delay to ensure that difference between SDA and SCL fall times do
not unintentionally create a Start or Stop condition.
7: Ensured by the TAA 3.4 MHz specification test.
DS22107A-page 16
© 2008 Microchip Technology Inc.
MCP454X/456X/464X/466X
TEMPERATURE CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, VDD = +2.7V to +5.5V, VSS = GND.
Parameters
Sym
Min
Typ
Max
Units
Conditions
Temperature Ranges
Specified Temperature Range
Operating Temperature Range
Storage Temperature Range
Thermal Package Resistances
Thermal Resistance, 8L-DFN (3x3)
Thermal Resistance, 8L-MSOP
Thermal Resistance, 8L-SOIC
Thermal Resistance, 10L-DFN (3x3)
Thermal Resistance, 10L-MSOP
Thermal Resistance, 14L-MSOP
Thermal Resistance, 14L-SOIC
Thermal Resistance, 16L-QFN
TA
TA
TA
-40
-40
-65
—
—
—
+125
+125
+150
°C
°C
°C
θJA
θJA
θJA
θJA
θJA
θJA
θJA
θJA
—
—
—
—
—
—
—
—
60
211
145.5
57
—
—
—
—
—
—
—
—
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
202
N/A
95.3
47
© 2008 Microchip Technology Inc.
DS22107A-page 17
MCP454X/456X/464X/466X
NOTES:
DS22107A-page 18
© 2008 Microchip Technology Inc.
MCP454X/456X/464X/466X
2.0
TYPICAL PERFORMANCE CURVES
Note:
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Note: Unless otherwise indicated, TA = +25°C, VDD = 5V, VSS = 0V.
250
200
150
100
50
1000
800
600
400
200
0
450
3.4MHz, 5.5V
400
350
300
250
200
150
100
50
3.4MHz, 2.7V
1.7MHz, 5.5V
IHVC
1.7MHz, 2.7V
400kHz, 5.5V
-200
-400
-600
-800
-1000
100kHz, 5.5V
400kHz, 2.7V
100kHz, 2.7V
RHVC
0
0
-40
0
40
Temperature (°C)
80
120
2
3
4
5
6
7
8
9
10
V
HVC (V)
2
FIGURE 2-1:
Frequency (f
Device Current (I ) vs. I C
) and Ambient Temperature
FIGURE 2-4:
Resistance (R
HVC Pull-up/Pull-down
DD
) and Current (I ) vs. HVC
SCL
HVC
HVC
(V = 2.7V and 5.5V).
Input Voltage (V
) (V = 5.5V).
DD
HVC
DD
12
10
3
2.5
5.5V Entry
5.5V Exit
2.7V Entry
8
6
4
2
0
5.5V
2
1.5
1
2.7V Exit
2.7V
0.5
-40
0
40
Temperature (°C)
80
120
-40 -20
0
20
40
60
80 100 120
Ambient Temperature (°C)
FIGURE 2-2:
Device Current (I
) and
FIGURE 2-5:
HVC High Input Entry/Exit
SHDN
V
. (HVC = V ) vs. Ambient Temperature.
Threshold vs. Ambient Temperature and V
.
DD
DD
DD
420
400
380
360
5.5V
340
320
300
-40
0
40
80
120
Temperature (°C)
FIGURE 2-3:
Write Current (I
) vs.
WRITE
Ambient Temperature.
© 2008 Microchip Technology Inc.
DS22107A-page 19
MCP454X/456X/464X/466X
Note: Unless otherwise indicated, TA = +25°C, VDD = 5V, VSS = 0V.
120
100
80
0.3
0.2
0.1
0
120
100
80
1.25
0.75
0.25
-0.25
-0.75
-1.25
-40C Rw
-40C INL
-40C DNL
25C Rw
25C INL
25C DNL
85C Rw
85C INL
85C DNL
125C Rw
125C INL
125C DNL
-40C Rw
-40C INL
-40C DNL
25C Rw
25C INL
25C DNL
85C Rw
85C INL
85C DNL
125C Rw
125C INL
125C DNL
INL
INL
DNL
60
60
-0.1
-0.2
-0.3
DNL
40
40
-40°C
-40°C 25°C
RW
25°C
85°C
85°C
RW
125°C
125°C
20
20
0
32 64 96 128 160 192 224 256
Wiper Setting (decimal)
0
32 64 96 128 160 192 224 256
Wiper Setting (decimal)
FIGURE 2-6:
5 kΩ Pot Mode – R (Ω),
FIGURE 2-8:
5 kΩ Rheo Mode – R (Ω),
W
W
INL (LSb), DNL (LSb) vs. Wiper Setting and
INL (LSb), DNL (LSb) vs. Wiper Setting and
Ambient Temperature (V = 5.5V).
Ambient Temperature (V = 5.5V).
DD
DD
300
-40C Rw
-40C INL
-40C DNL
25C Rw
25C INL
25C DNL
85C Rw
85C INL
85C DNL
125C Rw
125C INL
125C DNL
300
0.3
0.2
0.1
0
-40C Rw
-40C INL
-40C DNL
25C Rw
25C INL
25C DNL
85C Rw
85C INL
85C DNL
125C Rw
125C INL
125C DNL
6
260
220
180
140
100
60
260
220
180
140
100
60
INL
INL
4
DNL
2
RW
RW
125°C
-0.1
-0.2
-0.3
0
-40°C
85°C
25°C
25°C
DNL
-40°C
125°C 85°C
20
20
-2
0
32 64 96 128 160 192 224 256
Wiper Setting (decimal)
0
32 64 96 128 160 192 224 256
Wiper Setting (decimal)
FIGURE 2-7:
INL (LSb), DNL (LSb) vs. Wiper Setting and
Ambient Temperature (V = 3.0V).
5 kΩ Pot Mode – R (Ω),
FIGURE 2-9:
INL (LSb), DNL (LSb) vs. Wiper Setting and
Ambient Temperature (V = 3.0V).
5 kΩ Rheo Mode – R (Ω),
W
W
DD
DD
DS22107A-page 20
© 2008 Microchip Technology Inc.
MCP454X/456X/464X/466X
Note: Unless otherwise indicated, TA = +25°C, VDD = 5V, VSS = 0V.
6000
5000
4000
3000
2000
1000
0
5300
5250
5200
5150
5100
5050
2.7V
5.5V
-40°C
25°C
85°C
125°C
-40
0
40
80
120
0
32
64
96
128 160 192 224 256
Ambient Temperature (°C)
Wiper Setting (decimal)
FIGURE 2-10:
5 kΩ – Nominal Resistance
FIGURE 2-11:
5 kΩ – R
(Ω) vs. Wiper
WB
(Ω) vs. Ambient Temperature and V
.
Setting and Ambient Temperature.
DD
© 2008 Microchip Technology Inc.
DS22107A-page 21
MCP454X/456X/464X/466X
Note: Unless otherwise indicated, TA = +25°C, VDD = 5V, VSS = 0V.
FIGURE 2-12:
5 kΩ – Low-Voltage
FIGURE 2-15:
5 kΩ – Low-Voltage
Decrement Wiper Settling Time (V = 5.5V)
Increment Wiper Settling Time (V = 5.5V)
DD
DD
(1 µs/Div).
(1 µs/Div).
FIGURE 2-13:
5 kΩ – Low-Voltage
FIGURE 2-16:
5 kΩ – Low-Voltage
Decrement Wiper Settling Time (V = 2.7V)
Increment Wiper Settling Time (V = 2.7V)
DD
DD
(1 µs/Div).
(1 µs/Div).
FIGURE 2-14:
5 kΩ – Power-Up Wiper
Response Time (20 ms/Div).
DS22107A-page 22
© 2008 Microchip Technology Inc.
MCP454X/456X/464X/466X
Note: Unless otherwise indicated, TA = +25°C, VDD = 5V, VSS = 0V.
120
100
80
0.3
0.2
0.1
0
120
100
80
1
-40C Rw
-40C INL
-40C DNL
25C Rw
25C INL
25C DNL
85C Rw
85C INL
85C DNL
125C Rw
125C INL
125C DNL
-40C Rw
-40C INL
-40C DNL
25C Rw
25C INL
25C DNL
85C Rw
85C INL
85C DNL
125C Rw
125C INL
125C DNL
0.5
0
INL
INL
DNL
60
60
-0.1
-0.2
-0.3
-0.5
-1
DNL
40
40
-40°C
RW
-40°C
25°C
85°C
85°C 25°C
RW
125°C
125°C
20
20
0
25 50 75 100 125 150 175 200 225 250
Wiper Setting (decimal)
0
32 64 96 128 160 192 224 256
Wiper Setting (decimal)
FIGURE 2-17:
10 kΩ Pot Mode – R (Ω),
FIGURE 2-19:
10 kΩ Rheo Mode – R (Ω),
W
W
INL (LSb), DNL (LSb) vs. Wiper Setting and
INL (LSb), DNL (LSb) vs. Wiper Setting and
Ambient Temperature (V = 5.5V).
Ambient Temperature (V = 5.5V).
DD
DD
300
4
-40C Rw
-40C INL
-40C DNL
25C Rw
25C INL
25C DNL
85C Rw
85C INL
85C DNL
125C Rw
125C INL
125C DNL
300
0.3
0.2
0.1
0
-40C Rw
-40C INL
-40C DNL
25C Rw
25C INL
25C DNL
85C Rw
85C INL
85C DNL
125C Rw
125C INL
125C DNL
260
220
180
140
100
60
3
260
220
180
140
100
60
INL
INL
DNL
2
1
0
-0.1
-0.2
-0.3
RW
DNL
RW
-1
-2
-40°C
-40°C
25°C
85°C 25°C
85°C
125°C
125°C
20
20
0
32 64 96 128 160 192 224 256
Wiper Setting (decimal)
0
25 50 75 100 125 150 175 200 225 250
Wiper Setting (decimal)
FIGURE 2-18:
INL (LSb), DNL (LSb) vs. Wiper Setting and
Ambient Temperature (V = 3.0V).
10 kΩ Pot Mode – R (Ω),
FIGURE 2-20:
INL (LSb), DNL (LSb) vs. Wiper Setting and
Ambient Temperature (V = 3.0V).
10 kΩ Rheo Mode – R (Ω),
W
W
DD
DD
© 2008 Microchip Technology Inc.
DS22107A-page 23
MCP454X/456X/464X/466X
Note: Unless otherwise indicated, TA = +25°C, VDD = 5V, VSS = 0V.
12000
10000
8000
6000
4000
2000
0
10300
10250
10200
10150
10100
2.7V
10050
10000
-40°C
25°C
85°C
5.5V
9950
1.8V
9900
9850
125°C
-40
0
40
80
120
0
32
64
96 128 160 192 224 256
Ambient Temperature (°C)
Wiper Setting (decimal)
FIGURE 2-21:
10 kΩ – Nominal Resistance
FIGURE 2-22:
10 kΩ – R
(Ω) vs. Wiper
WB
(Ω) vs. Ambient Temperature and V
.
Setting and Ambient Temperature.
DD
DS22107A-page 24
© 2008 Microchip Technology Inc.
MCP454X/456X/464X/466X
Note: Unless otherwise indicated, TA = +25°C, VDD = 5V, VSS = 0V.
FIGURE 2-23:
10 kΩ – Low-Voltage
FIGURE 2-26:
10 kΩ – Low-Voltage
Decrement Wiper Settling Time (V = 5.5V)
Increment Wiper Settling Time (V = 5.5V)
DD
DD
(1 µs/Div).
(1 µs/Div).
FIGURE 2-24:
10 kΩ – Low-Voltage
FIGURE 2-27:
10 kΩ – Low-Voltage
Decrement Wiper Settling Time (V = 2.7V)
Increment Wiper Settling Time (V = 2.7V)
DD
DD
(1 µs/Div).
(1 µs/Div).
FIGURE 2-25:
10 kΩ – Power-Up Wiper
Response Time (1 µs/Div).
© 2008 Microchip Technology Inc.
DS22107A-page 25
MCP454X/456X/464X/466X
Note: Unless otherwise indicated, TA = +25°C, VDD = 5V, VSS = 0V.
120
100
80
0.3
0.2
0.1
0
120
100
80
0.3
0.2
0.1
0
-40C Rw
-40C INL
-40C DNL
25C Rw
25C INL
25C DNL
85C Rw
85C INL
85C DNL
125C Rw
125C INL
125C DNL
-40C Rw
-40C INL
-40C DNL
25C Rw
25C INL
25C DNL
85C Rw
85C INL
85C DNL
125C Rw
125C INL
125C DNL
INL
INL
DNL
DNL
60
60
-0.1
-0.2
-0.3
-0.1
-0.2
-0.3
-40°C
40
40
-40°C
RW
25°C
85°C
25°C
85°C
RW
125°C
125°C
20
20
0
32 64 96 128 160 192 224 256
Wiper Setting (decimal)
0
32 64 96 128 160 192 224 256
Wiper Setting (decimal)
FIGURE 2-28:
50 kΩ Pot Mode – R (Ω),
FIGURE 2-30:
50 kΩ Rheo Mode – R (Ω),
W
W
INL (LSb), DNL (LSb) vs. Wiper Setting and
INL (LSb), DNL (LSb) vs. Wiper Setting and
Ambient Temperature (V = 5.5V).
Ambient Temperature (V = 5.5V).
DD
DD
300
1
-40C Rw
-40C INL
-40C DNL
25C Rw
25C INL
25C DNL
85C Rw
85C INL
85C DNL
125C Rw
125C INL
125C DNL
300
0.3
0.2
0.1
0
-40C Rw
-40C INL
-40C DNL
25C Rw
25C INL
25C DNL
85C Rw
85C INL
85C DNL
125C Rw
125C INL
125C DNL
0.75
0.5
0.25
0
260
220
180
140
100
60
260
220
180
140
100
60
INL
INL
DNL
DNL
-0.25
-0.5
-0.75
-1
RW
-0.1
-0.2
-0.3
RW
-40°C
-40°C
25°C
85°C
25°C
85°C
125°C
125°C
20
20
0
32 64 96 128 160 192 224 256
Wiper Setting (decimal)
0
32 64 96 128 160 192 224 256
Wiper Setting (decimal)
FIGURE 2-29:
INL (LSb), DNL (LSb) vs. Wiper Setting and
Ambient Temperature (V = 3.0V).
50 kΩ Pot Mode – R (Ω),
FIGURE 2-31:
INL (LSb), DNL (LSb) vs. Wiper Setting and
Ambient Temperature (V = 3.0V).
50 kΩ Rheo Mode – R (Ω),
W
W
DD
DD
DS22107A-page 26
© 2008 Microchip Technology Inc.
MCP454X/456X/464X/466X
Note: Unless otherwise indicated, TA = +25°C, VDD = 5V, VSS = 0V.
52500
52000
51500
51000
50500
50000
49500
49000
60000
50000
40000
30000
20000
10000
0
1.8V
-40°C
25°C
85°C
125°C
2.7V
5.5V
-40
0
40
80
120
0
32
64
96 128 160 192 224 256
Ambient Temperature (°C)
Wiper Setting (decimal)
FIGURE 2-32:
50 kΩ – Nominal Resistance
FIGURE 2-33:
50 kΩ – R
(Ω) vs. Wiper
WB
(Ω) vs. Ambient Temperature and V
.
Setting and Ambient Temperature.
DD
© 2008 Microchip Technology Inc.
DS22107A-page 27
MCP454X/456X/464X/466X
Note: Unless otherwise indicated, TA = +25°C, VDD = 5V, VSS = 0V.
FIGURE 2-34:
50 kΩ – Low-Voltage
FIGURE 2-37:
50 kΩ – Low-Voltage
Decrement Wiper Settling Time (V = 5.5V)
Increment Wiper Settling Time (V = 5.5V)
DD
DD
(1 µs/Div).
(1 µs/Div).
FIGURE 2-35:
50 kΩ – Low-Voltage
FIGURE 2-38:
50 kΩ – Low-Voltage
Decrement Wiper Settling Time (V = 2.7V)
Increment Wiper Settling Time (V = 2.7V)
DD
DD
(1 µs/Div).
(1 µs/Div).
FIGURE 2-36:
50 kΩ – Power-Up Wiper
Response Time (1 µs/Div).
DS22107A-page 28
© 2008 Microchip Technology Inc.
MCP454X/456X/464X/466X
Note: Unless otherwise indicated, TA = +25°C, VDD = 5V, VSS = 0V.
120
100
80
0.2
0.1
0
120
100
80
0.3
0.2
0.1
0
-40C Rw
-40C INL
-40C DNL
25C Rw
25C INL
25C DNL
85C Rw
85C INL
85C DNL
125C Rw
125C INL
125C DNL
-40C Rw
-40C INL
-40C DNL
25C Rw
25C INL
25C DNL
85C Rw
85C INL
85C DNL
125C Rw
125C INL
125C DNL
INL
INL
DNL
DNL
60
60
-0.1
-0.2
-0.3
-0.1
-0.2
40
40
-40°C
-40°C
RW
25°C
85°C
RW
85°C 25°C
125°C
125°C
20
20
0
32 64 96 128 160 192 224 256
Wiper Setting (decimal)
0
32 64 96 128 160 192 224 256
Wiper Setting (decimal)
FIGURE 2-39:
100 kΩ Pot Mode – R (Ω),
FIGURE 2-41:
100 kΩ Rheo Mode – R
W
W
INL (LSb), DNL (LSb) vs. Wiper Setting and
(Ω), INL (LSb), DNL (LSb) vs. Wiper Setting and
Ambient Temperature (V = 5.5V).
Ambient Temperature (V = 5.5V).
DD
DD
300
0.6
0.4
0.2
0
-40C Rw
-40C INL
-40C DNL
25C Rw
25C INL
25C DNL
85C Rw
85C INL
85C DNL
125C Rw
125C INL
125C DNL
300
0.2
-40C Rw
-40C INL
-40C DNL
25C Rw
25C INL
25C DNL
85C Rw
85C INL
85C DNL
125C Rw
125C INL
125C DNL
260
220
180
140
100
60
0.15
0.1
260
220
180
140
100
60
INL
INL
DNL
DNL
0.05
0
-0.05
-0.1
-0.15
-0.2
-0.2
-0.4
-0.6
RW
RW
-40°C
-40°C
85°C 25°C
125°C
85°C
25°C
125°C
20
20
0
32 64 96 128 160 192 224 256
Wiper Setting (decimal)
0
32 64 96 128 160 192 224 256
Wiper Setting (decimal)
FIGURE 2-40:
INL (LSb), DNL (LSb) vs. Wiper Setting and
Ambient Temperature (V = 3.0V).
100 kΩ Pot Mode – R (Ω),
FIGURE 2-42:
(Ω), INL (LSb), DNL (LSb) vs. Wiper Setting and
Ambient Temperature (V = 3.0V).
100 kΩ Rheo Mode – R
W
W
DD
DD
© 2008 Microchip Technology Inc.
DS22107A-page 29
MCP454X/456X/464X/466X
Note: Unless otherwise indicated, TA = +25°C, VDD = 5V, VSS = 0V.
120000
100000
80000
60000
40000
20000
0
103500
103000
102500
102000
101500
1.8V
101000
100500
-40°C
25°C
85°C
100000
2.7V
99500
99000
98500
5.5V
125°C
0
32
64
96 128 160 192 224 256
-40
0
40
80
120
Ambient Temperature (°C)
Wiper Setting (decimal)
FIGURE 2-43:
100 kΩ – Nominal
FIGURE 2-44:
100 kΩ – R
(Ω) vs. Wiper
WB
Resistance (Ω) vs. Ambient Temperature and
Setting and Ambient Temperature.
V
.
DD
DS22107A-page 30
© 2008 Microchip Technology Inc.
MCP454X/456X/464X/466X
Note: Unless otherwise indicated, TA = +25°C, VDD = 5V, VSS = 0V.
FIGURE 2-45:
100 kΩ – Low-Voltage
FIGURE 2-47:
100 kΩ – Low-Voltage
Decrement Wiper Settling Time (V = 5.5V)
Increment Wiper Settling Time (V =5.5V)
DD
DD
(1 µs/Div).
(1 µs/Div).
FIGURE 2-46:
100 kΩ – Low-Voltage
FIGURE 2-48:
100 kΩ – Low-Voltage
Decrement Wiper Settling Time (V = 2.7V)
Increment Wiper Settling Time (V = 2.7V)
DD
DD
(1 µs/Div).
(1 µs/Div)
© 2008 Microchip Technology Inc.
DS22107A-page 31
MCP454X/456X/464X/466X
Note: Unless otherwise indicated, TA = +25°C, VDD = 5V, VSS = 0V.
0.12
0.1
0.1
0.09
0.08
0.07
0.06
0.05
0.04
0.03
0.02
0.01
0
0.08
0.06
0.04
0.02
0
5.5V
5.5V
3.0V
0
3.0V
-40
40
80
120
-40
0
40
Temperature (°C)
80
120
Temperature (°C)
FIGURE 2-49:
Resistor Network 0 to
FIGURE 2-51:
Resistor Network 0 to
Resistor Network 1 R (5 kΩ) Mismatch vs. V
and Temperature.
Resistor Network 1 R (50 kΩ) Mismatch vs.
AB
DD
AB
V
and Temperature.
DD
0.04
0.03
0.02
0.05
0.04
0.03
0.02
0.01
5.5V
5.5V
0.01
0
-0.01
3.0V
0
3.0V
-0.02
-0.01
-0.02
-0.03
-0.03
-0.04
-40
0
40
80
120
-40
10
60
110
Temperature (°C)
Temperature (°C)
FIGURE 2-50:
Resistor Network 0 to
FIGURE 2-52:
Resistor Network 0 to
Resistor Network 1 R (10 kΩ) Mismatch vs.
Resistor Network 1 R (100 kΩ) Mismatch vs.
AB
AB
V
and Temperature.
V
and Temperature.
DD
DD
DS22107A-page 32
© 2008 Microchip Technology Inc.
MCP454X/456X/464X/466X
Note: Unless otherwise indicated, TA = +25°C, VDD = 5V, VSS = 0V.
4
3.5
3
230
210
190
170
150
130
110
90
2.7V
5.5V
5.5V
2.7V
2.5
2
1.5
1
70
50
-40
0
40
Temperature (°C)
80
120
-40
0
40
Temperature (°C)
80
120
FIGURE 2-53:
V
(SDA, SCL) vs. V and
FIGURE 2-55:
V
(SDA) vs. V and
OL DD
IH
DD
Temperature.
Temperature (I = 3 mA).
OL
2
5.5V
1.5
2.7V
1
-40
0
40
Temperature (°C)
80
120
FIGURE 2-54:
V (SDA, SCL) vs. V and
IL DD
Temperature.
© 2008 Microchip Technology Inc.
DS22107A-page 33
MCP454X/456X/464X/466X
Note: Unless otherwise indicated, TA = +25°C,
VDD = 5V, VSS = 0V.
2.1
Test Circuits
4.2
4.0
+5V
A
B
V
IN
3.8
3.6
3.4
3.2
3.0
W
V
+
-
OUT
Offset
GND
2.5V DC
-40
0
40
80
120
Temperature (°C)
FIGURE 2-58:
Test.
-3 db Gain vs. Frequency
FIGURE 2-56:
Cycle Time vs. V and Temperature.
Nominal EEPROM Write
DD
1.2
1
5.5V
0.8
0.6
0.4
0.2
0
2.7V
-40
0
40
80
120
Temperature (°C)
FIGURE 2-57:
POR/BOR Trip point vs. V
DD
and Temperature.
DS22107A-page 34
© 2008 Microchip Technology Inc.
MCP454X/456X/464X/466X
3.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
Additional descriptions of the device pins follows.
TABLE 3-1:
PINOUT DESCRIPTION FOR THE MCP454X/456X/464X/466X
Pin
Weak
Single
Dual
Pot
Pull-up/
Standard Function
Buffer
Type
Rheo Pot (1) Rheo
Symbol
I/O
down (1)
8L
8L
10L
14L
16L
1
1
1
1
16
HVC/A0
I
I
HV w/ST “smart” High Voltage Command /
Address 0.
2
3
2
3
2
3
2
3
1
2
SCL
SDA
HV w/ST
No
No
I2C clock input.
I/O HV w/ST
I2C serial data I/O. Open Drain
output
4
4
—
—
—
5
4
5
4
5
3, 4
5
VSS
P1B
P1W
P1A
P0A
P0W
P0B
WP
—
A
A
A
A
A
A
I
P
—
No
No
No
No
No
No
Ground
—
—
—
—
5
Analog
Analog
Analog
Analog
Analog
Analog
Potentiometer 1 Terminal B
Potentiometer 1 Wiper Terminal
Potentiometer 1 Terminal A
Potentiometer 0 Terminal A
Potentiometer 0 Wiper Terminal
Potentiometer 0 Terminal B
6
6
6
—
—
7
7
7
8
8
6
9
9
6
7
8
10
11
10
12
—
—
—
HV w/ST “smart” Hardware EEPROM Write
Protect
—
—
—
8
—
9
12
13
14
—
—
13
14
15
11
17
A2
A1
I
HV w/ST “smart” Address 2
HV w/ST “smart” Address 1
7
I
8
10
—
11
VDD
NC
EP
—
—
—
P
—
—
—
Positive Power Supply Input
No Connection
—
—
9
—
—
9
Exposed Pad (Note 2)
Legend:
HV w/ST = High Voltage tolerant input (with Schmidtt trigger input)
A = Analog pins (Potentiometer terminals)
O = digital output
I = digital input (high Z)
I/O = Input / Output
P = Power
Note 1: The pin’s “smart” pull-up shuts off while the pin is forced low. This is done to reduce the standby and shut-
down current.
2: The DFN and QFN packages have a contact on the bottom of the package. This contact is conductively
connected to the die substrate, and therefore should be unconnected or connected to the same ground as
the device’s VSS pin.
© 2008 Microchip Technology Inc.
DS22107A-page 35
MCP454X/456X/464X/466X
3.1
High Voltage Command / Address 0
(HVC/A0)
3.7
Potentiometer Terminal A
The terminal A pin is available on the MCP4XX1
devices, and is connected to the internal potentiome-
ter’s terminal A.
The HVC/A0 pin is the Address 0 input for the I2C
interface as well as the High Voltage Command pin. At
the device’s POR/BOR the value of the A0 address bit
is latched. This input along with the A2 and A1 pins
completes the device address. This allows up to 8
MCP45xx/46xx devices can be on a single I2C bus.
The potentiometer’s terminal A is the fixed connection
to the Full-Scale wiper value of the digital potentiome-
ter. This corresponds to a wiper value of 0x100 for 8-bit
devices or 0x80 for 7-bit devices.
During normal operation the the voltage on this pin
determines if the I2C command is a normal command
or a High Voltage command (when HVC/A0 = VIHH).
The terminal A pin does not have a polarity relative to
the terminal W or B pins. The terminal A pin can
support both positive and negative current. The voltage
on terminal A must be between VSS and VDD
.
3.2
Serial Clock (SCL)
The terminal A pin is not available on the MCP4XX2
devices, and the internally terminal A signal is floating.
The SCL pin is the serial interfaces Serial Clock pin.
This pin is connected to the Host Controllers SCL pin.
The MCP45XX/46XX is a slave device, so it’s SCL pin
accepts only external clock signals.
MCP46X1 devices have two terminal A pins, one for
each resistor network.
3.8
Write Protect (WP)
3.3
Serial Data (SDA)
The WP pin is used to force the non-volatile memory to
be write protected.
The SDA pin is the serial interfaces Serial Data pin.
This pin is connected to the Host Controllers SDA pin.
The SDA pin is an open-drain N-channel driver.
3.9
Address 2 (A2)
The A2 pin is the I2C interface’s Address 2 pin. Along
with the A1 and A0 pins, up to 8 MCP45XX/46XX
devices can be on a single I2C bus.
3.4
Ground (VSS)
The VSS pin is the device ground reference.
3.5
Potentiometer Terminal B
3.10 Address 1 (A1)
The A2 pin is the I2C interface’s Address 1 pin. Along
with the A2 and A0 pins, up to 8 MCP45XX/46XX
devices can be on a single I2C bus.
The terminal B pin is connected to the internal
potentiometer’s terminal B.
The potentiometer’s terminal B is the fixed connection
to the Zero Scale wiper value of the digital potentiome-
ter. This corresponds to a wiper value of 0x00 for both
7-bit and 8-bit devices.
3.11 Positive Power Supply Input (VDD
)
The VDD pin is the device’s positive power supply input.
The input power supply is relative to VSS
The terminal B pin does not have a polarity relative to
the terminal W or A pins. The terminal B pin can
support both positive and negative current. The voltage
.
While the device VDD < Vmin (2.7V), the electrical
performance of the device may not meet the data sheet
specifications.
on terminal B must be between VSS and VDD
.
MCP46XX devices have two terminal B pins, one for
each resistor network.
3.12 No Connect (NC)
These pins should be either connected to VDD or VSS
.
3.6
Potentiometer Wiper (W) Terminal
The terminal W pin is connected to the internal potenti-
ometer’s terminal W (the wiper). The wiper terminal is
the adjustable terminal of the digital potentiometer. The
terminal W pin does not have a polarity relative to
terminals A or B pins. The terminal W pin can support
both positive and negative current. The voltage on
3.13 Exposed Pad (EP)
This pad is conductively connected to the device’s sub-
strate. This pad should be tied to the same potential as
the VSS pin (or left unconnected). This pad could be
used to assist as a heat sink for the device when con-
nected to a PCB heat sink.
terminal W must be between VSS and VDD
.
MCP46XX devices have two terminal W pins, one for
each resistor network.
DS22107A-page 36
© 2008 Microchip Technology Inc.
MCP454X/456X/464X/466X
4.1.2
BROWN-OUT RESET
4.0
FUNCTIONAL OVERVIEW
When the device powers down, the device VDD will
cross the VPOR/VBOR voltage.
This Data Sheet covers a family of thirty-two Digital
Potentiometer and Rheostat devices that will be
referred to as MCP4XXX. The MCP4XX1 devices are
the Potentiometer configuration, while the MCP4XX2
devices are the Rheostat configuration.
Once the VDD voltage decreases below the VPOR/VBOR
voltage the following happens:
• Serial Interface is disabled
As the Device Block Diagram shows, there are four
main functional blocks. These are:
• EEPROM Writes are disabled
If the VDD voltage decreases below the VRAM voltage
the following happens:
• POR/BOR Operation
• Memory Map
• Volatile wiper registers may become corrupted
• TCON register may become corrupted
• Resistor Network
• Serial Interface (I2C)
As the voltage recovers above the VPOR/VBOR voltage
The POR/BOR operation and the Memory Map are
discussed in this section and the Resistor Network and
I2C operation are described in their own sections. The
Device Commands commands are discussed in
Section 7.0 “Device Commands”.
see Section 4.1.1 “Power-on Reset”.
Serial commands not completed due to a brown-out
condition may cause the memory location (volatile and
non-volatile) to become corrupted.
4.2
Memory Map
4.1
POR/BOR Operation
The device memory is 16 locations that are 9-bits wide
(16x9 bits). This memory space contains both volatile
and non-volatile locations (see Table 4-1).
The Power-on Reset is the case where the device is
having power applied to it starting from the VSS level.
The Brown-out Reset occurs when a device had power
applied to it, and that power (voltage) drops below the
specified range.
TABLE 4-1:
Address
MEMORY MAP
Function
Memory Type
The devices RAM retention voltage (VRAM) is lower
than the POR/BOR voltage trip point (VPOR/VBOR). The
maximum VPOR/VBOR voltage is less than 1.8V.
00h
01h
02h
03h
04h
05h
06h
07h
08h
09h
0Ah
0Bh
0Ch
0Dh
0Eh
0Fh
Volatile Wiper 0
Volatile Wiper 1
RAM
RAM
When VPOR/VBOR < VDD < 2.7V, the electrical
performance may not meet the data sheet
specifications. In this region, the device is capable of
reading and writing to its EEPROM and incrementing,
decrementing, reading and writing to its volatile
memory if the proper serial command is executed.
Non-Volatile Wiper 0
Non-Volatile Wiper 1
Volatile TCON Register
Status Register
Data EEPROM
Data EEPROM
Data EEPROM
Data EEPROM
Data EEPROM
Data EEPROM
Data EEPROM
Data EEPROM
Data EEPROM
Data EEPROM
EEPROM
EEPROM
RAM
RAM
EEPROM
EEPROM
EEPROM
EEPROM
EEPROM
EEPROM
EEPROM
EEPROM
EEPROM
EEPROM
4.1.1
POWER-ON RESET
When the device powers up, the device VDD will cross
the VPOR/VBOR voltage. Once the VDD voltage crosses
the VPOR/VBOR voltage the following happens:
• Volatile wiper register is loaded with value in the
corresponding non-volatile wiper register
• The TCON register is loaded it’s default value
• The device is capable of digital operation
© 2008 Microchip Technology Inc.
DS22107A-page 37
MCP454X/456X/464X/466X
4.2.1
NON-VOLATILE MEMORY
(EEPROM)
4.2.1.4
Special Features
There are 3 non-volatile bits that are not directly
mapped into the address space. These bits control the
following functions:
This memory can be grouped into two uses of non-vol-
atile memory. These are:
• EEPROM Write Protect
• General Purpose Registers
• Non-Volatile Wiper Registers
• WiperLock Technology for Non-Volatile Wiper 0
• WiperLock Technology for Non-Volatile Wiper 1
The non-volatile wipers starts functioning below the
devices VPOR/VBOR trip point.
The operation of WiperLock Technology is discussed in
Section 5.3. The state of the WL0, WL1, and WP bits
is reflected in the STATUS register (see Register 4-1).
4.2.1.1
General Purpose Registers
These locations allow the user to store up to 10 (9-bit)
locations worth of information.
EEPROM Write Protect
All internal EEPROM memory can be Write Protected.
When EEPROM memory is Write Protected, Write
commands to the internal EEPROM are prevented.
4.2.1.2
Non-Volatile Wiper Registers
These locations contain the wiper values that are
loaded into the corresponding volatile wiper register
whenever the device has a POR/BOR event. There are
up to two registers, one for each resistor network.
Write Protect (WP) can be enabled/disabled by two
methods. These are:
• External WP Hardware pin (MCP46X1 devices
only)
The non-volatile wiper register enables stand-alone
operation of the device (without Microcontroller control)
after being programmed to the desired value.
• Non-Volatile configuration bit
High Voltage commands are required to enable and
disable the nonvolatile WP bit. These commands are
shown in Section 7.8 “Modify Write Protect or Wip-
erLock Technology (High Voltage)”.
4.2.1.3
Factory Initialization of Non-Volatile
Memory (EEPROM)
The Non-Volatile Wiper values will be initialized to
mid-scale value. This is shown in Table 4-2.
To write to EEPROM, both the external WP pin and the
internal WP EEPROM bit must be disabled. Write
Protect does not block commands to the volatile
registers.
The General purpose EEPROM memory will be
programmed to a default value of 0xFF.
It is good practice in the manufacturing flow to
configure the device to your desired settings.
4.2.2
VOLATILE MEMORY (RAM)
There are four Volatile Memory locations. These are:
• Volatile Wiper 0
TABLE 4-2:
DEFAULT FACTORY
SETTINGS SELECTION
• Volatile Wiper 1
(Dual Resistor Network devices only)
Wiper
Code
• Status Register
• Terminal Control (TCON) Register
The volatile memory starts functioning at the RAM
retention voltage (VRAM).
8-bit 7-bit
-502
5.0 kΩ Mid-scale 80h 40h Disabled
-103 10.0 kΩ Mid-scale 80h 40h Disabled
-503 50.0 kΩ Mid-scale 80h 40h Disabled
-104 100.0 kΩ Mid-scale 80h 40h Disabled
DS22107A-page 38
© 2008 Microchip Technology Inc.
MCP454X/456X/464X/466X
4.2.2.1
Status (STATUS) Register
This register contains 4 status bits. These bits show the
state of the WiperLock bits, the Write Protect bit, and if
an EEPROM write cycle is active. The STATUS register
can be accessed via the READ commands.
Register 4-1 describes each STATUS register bit.
The STATUS register is placed at Address 05h.
REGISTER 4-1:
STATUS REGISTER (ADDRESS = 0x05)
R-1
R-1
R-1
R-1
R-1
R-0
R-x
R-x
R-x
(1)
(1)
D8:D4
EEWA
WL1
WL0
WP (1)
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
‘1’ = Bit is set
U = Unimplemented bit, read as ‘0’
‘0’ = Bit is cleared x = Bit is unknown
-n = Value at POR
bit 8-4
bit 3
D8:D4: Reserved. Forced to “1”
EEWA: EEPROM Write Active Status bit
This bit indicates if the EEPROM Write Cycle is occurring.
1= An EEPROM Write cycle is currently occurring. Only serial commands to the Volatile memory
locations are allowed (addresses 00h, 01h, 04h, and 05h)
0= An EEPROM Write cycle is NOT currently occurring
bit 2
WL1: WiperLock Status bit for Resistor Network 1 (Refer to Section 5.3 “WiperLock™ Technology”
for further information)
WiperLock (WL) prevents the Volatile and Non-Volatile Wiper 1 addresses and the TCON register bits
R1HW, R1A, R1W, and R1B from being written to. High Voltage commands are required to enable and
disable WiperLock Technology.
1= Wiper and TCON register bits R1HW, R1A, R1W, and R1B of Resistor Network 1 (Pot 1) are
“Locked” (Write Protected)
0= Wiper and TCON of Resistor Network 1 (Pot 1) can be modified
Note:
The WL1 bit always reflects the result of the last programming cycle to the non-volatile WL1
bit. After a POR or BOR event, the WL1 bit is loaded with the non-volatile WL1 bit value.
bit 1
WL0: WiperLock Status bit for Resistor Network 0 (Refer to Section 5.3 “WiperLock™ Technology”
for further information)
The WiperLock Technology bits (WLx) prevents the Volatile and Non-Volatile Wiper 0 addresses and
the TCON register bits R0HW, R0A, R0W, and R0B from being written to. High Voltage commands are
required to enable and disable WiperLock Technology.
1= Wiper and TCON register bits R0HW, R0A, R0W, and R0B of Resistor Network 0 (Pot 0) are
“Locked” (Write Protected)
0= Wiper and TCON of Resistor Network 0 (Pot 0) can be modified
Note:
The WL0 bit always reflects the result of the last programming cycle to the non-volatile WL0
bit. After a POR or BOR event, the WL0 bit is loaded with the non-volatile WL0 bit value.
Note 1: Requires a High Voltage command to modify the state of this bit (for Non-Volatile devices only). This bit is
Not directly written, but reflects the system state (for this feature).
© 2008 Microchip Technology Inc.
DS22107A-page 39
MCP454X/456X/464X/466X
REGISTER 4-1:
STATUS REGISTER (ADDRESS = 0x05) (CONTINUED)
bit 0 WP: EEPROM Write Protect Status bit (Refer to Section “EEPROM Write Protect” for further infor-
mation)
This bit indicates the status of the write protection on the EEPROM memory. When Write Protect is
enabled, writes to all non-volatile memory are prevented. This includes the General Purpose EEPROM
memory, and the non-volatile Wiper registers. Write Protect does not block modification of the volatile
wiper register values or the volatile TCON register value (via Increment, Decrement, or Write
commands).
This status bit is an OR of the devices Write Protect pin (WP) and the internal non-volatile WP bit. High
Voltage commands are required to enable and disable the internal WP EEPROM bit.
1= EEPROM memory is Write Protected
0= EEPROM memory can be written
Note 1: Requires a High Voltage command to modify the state of this bit (for Non-Volatile devices only). This bit is
Not directly written, but reflects the system state (for this feature).
DS22107A-page 40
© 2008 Microchip Technology Inc.
MCP454X/456X/464X/466X
4.2.2.2
Terminal Control (TCON) Register
This register contains 8 control bits. Four bits are for
Wiper 0, and four bits are for Wiper 1. Register 4-2
describes each bit of the TCON register.
The state of each resistor network terminal connection
is individually controlled. That is, each terminal
connection (A, B and W) can be individually connected/
disconnected from the resistor network. This allows the
system to minimize the currents through the digital
potentiometer.
The value that is written to this register will appear on
the resistor network terminals when the serial
command has completed.
When the WL1 bit is enabled, writes to the TCON
register bits R1HW, R1A, R1W, and R1B are inhibited.
When the WL0 bit is enabled, writes to the TCON
register bits R0HW, R0A, R0W, and R0B are inhibited.
On a POR/BOR this register is loaded with 1FFh
(9-bits), for all terminals connected. The Host
Controller needs to detect the POR/BOR event and
then update the Volatile TCON register value.
Additionally, there is a bit which enables the operation
of General Call commands.
© 2008 Microchip Technology Inc.
DS22107A-page 41
MCP454X/456X/464X/466X
(1)
REGISTER 4-2:
TCON BITS (ADDRESS = 0x04)
R/W-1
GCEN
R/W-1
R1HW
R/W-1
R1A
R/W-1
R1W
R/W-1
R1B
R/W-1
R0HW
R/W-1
R0A
R/W-1
R0W
R/W-1
R0B
bit 8
bit 0
Legend:
R = Readable bit
-n = Value at POR
W = Writable bit
‘1’ = Bit is set
U = Unimplemented bit, read as ‘0’
‘0’ = Bit is cleared x = Bit is unknown
bit 8
GCEN: General Call Enable bit
This bit specifies if I2C General Call commands are accepted
1= Enable Device to “Accept” the General Call Address (0000h)
0= The General Call Address is disabled
bit 7
R1HW: Resistor 1 Hardware Configuration Control bit
This bit forces Resistor 1 into the “shutdown” configuration of the Hardware pin
1= Resistor 1 is NOT forced to the hardware pin “shutdown” configuration
0= Resistor 1 is forced to the hardware pin “shutdown” configuration
bit 6
bit 5
bit 4
bit 3
bit 2
bit 1
bit 0
R1A: Resistor 1 Terminal A (P1A pin) Connect Control bit
This bit connects/disconnects the Resistor 1 Terminal A to the Resistor 1 Network
1= P1A pin is connected to the Resistor 1 Network
0= P1A pin is disconnected from the Resistor 1 Network
R1W: Resistor 1 Wiper (P1W pin) Connect Control bit
This bit connects/disconnects the Resistor 1 Wiper to the Resistor 1 Network
1= P1W pin is connected to the Resistor 1 Network
0= P1W pin is disconnected from the Resistor 1 Network
R1B: Resistor 1 Terminal B (P1B pin) Connect Control bit
This bit connects/disconnects the Resistor 1 Terminal B to the Resistor 1 Network
1= P1B pin is connected to the Resistor 1 Network
0= P1B pin is disconnected from the Resistor 1 Network
R0HW: Resistor 0 Hardware Configuration Control bit
This bit forces Resistor 0 into the “shutdown” configuration of the Hardware pin
1= Resistor 0 is NOT forced to the hardware pin “shutdown” configuration
0= Resistor 0 is forced to the hardware pin “shutdown” configuration
R0A: Resistor 0 Terminal A (P0A pin) Connect Control bit
This bit connects/disconnects the Resistor 0 Terminal A to the Resistor 0 Network
1= P0A pin is connected to the Resistor 0 Network
0= P0A pin is disconnected from the Resistor 0 Network
R0W: Resistor 0 Wiper (P0W pin) Connect Control bit
This bit connects/disconnects the Resistor 0 Wiper to the Resistor 0 Network
1= P0W pin is connected to the Resistor 0 Network
0= P0W pin is disconnected from the Resistor 0 Network
R0B: Resistor 0 Terminal B (P0B pin) Connect Control bit
This bit connects/disconnects the Resistor 0 Terminal B to the Resistor 0 Network
1= P0B pin is connected to the Resistor 0 Network
0= P0B pin is disconnected from the Resistor 0 Network
Note 1: These bits do not affect the wiper register values.
DS22107A-page 42
© 2008 Microchip Technology Inc.
MCP454X/456X/464X/466X
5.1
Resistor Ladder Module
5.0
RESISTOR NETWORK
The resistor ladder is a series of equal value resistors
(RS) with a connection point (tap) between the two
resistors. The total number of resistors in the series
(ladder) determines the RAB resistance (see
Figure 5-1). The end points of the resistor ladder are
connected to analog switches which are connected to
the device Terminal A and Terminal B pins. The RAB
(and RS) resistance has small variations over voltage
and temperature.
The Resistor Network has either 7-bit or 8-bit resolu-
tion. Each Resistor Network allows zero scale to
full-scale connections. Figure 5-1 shows a block dia-
gram for the resistive network of a device.
The Resistor Network is made up of several parts.
These include:
• Resistor Ladder
• Wiper
• Shutdown (Terminal Connections)
For an 8-bit device, there are 256 resistors in a string
between terminal A and terminal B. The wiper can be
set to tap onto any of these 256 resistors thus providing
257 possible settings (including terminal A and terminal
B).
Devices have either one or two resistor networks,
These are referred to as Pot 0 and Pot 1.
A
For a 7-bit device, there are 128 resistors in a string
between terminal A and terminal B. The wiper can be
set to tap onto any of these 128 resistors thus providing
129 possible settings (including terminal A and terminal
B).
8-Bit
N =
257
7-Bit
N =
128
(100h)
(80h)
(1)
RW
RS
RS
RS
Equation 5-1 shows the calculation for the step
resistance.
256
(FFh)
127
(7Fh)
(1)
(1)
RW
RW
EQUATION 5-1:
R CALCULATION
255
(FEh)
126
(7Eh)
S
RAB
RAB
RS = -------------
8-bit Device
(256)
W
RAB
RS = -------------
(128)
7-bit Device
1
1
(01h)
(01h)
(1)
(1)
RW
RW
RS
0
0
(00h)
(00h)
Analog Mux
B
Note 1: The wiper resistance is dependent on
several factors including, wiper code,
device VDD, Terminal voltages (on A, B,
and W), and temperature.
Also for the same conditions, each tap
selection resistance has a small variation.
This RW variation has greater effects on
some specifications (such as INL) for the
smaller resistance devices (5.0 kΩ)
compared to larger resistance devices
(100.0 kΩ).
FIGURE 5-1:
Resistor Block Diagram.
© 2008 Microchip Technology Inc.
DS22107A-page 43
MCP454X/456X/464X/466X
5.2
Wiper
5.3
WiperLock™ Technology
Each tap point (between the RS resistors) is a
connection point for an analog switch. The opposite
side of the analog switch is connected to a common
signal which is connected to the Terminal W (Wiper)
pin.
The MCP4XXX device’s WiperLock technology allows
application-specific calibration settings to be secured in
the EEPROM without requiring the use of an additional
write-protect pin. There are two WiperLock Technology
configuration bits (WL0 and WL1). These bits prevent
the Non-Volatile and Volatile addresses and bits for the
specified resistor network from being written.
A value in the volatile wiper register selects which
analog switch to close, connecting the W terminal to
the selected node of the resistor ladder.
The WiperLock technology prevents the serial
commands from doing the following:
The wiper can connect directly to Terminal B or to
Terminal A. A zero-scale connections, connects the
Terminal W (wiper) to Terminal B (wiper setting of
000h). A full-scale connections, connects the Terminal
W (wiper) to Terminal A (wiper setting of 100h or 80h).
In these configurations the only resistance between the
Terminal W and the other Terminal (A or B) is that of
the analog switches.
• Changing a volatile wiper value
• Writing to a non-volatile wiper memory location
• Changing the volatile TCON register value
For either Resistor Network 0 or Resistor Network 1
(Potx), the WLx bit controls the following:
• Non-Volatile Wiper Register
• Volatile Wiper Register
• Volatile TCON register bits RxHW, RxA, RxW,
and RxB
A wiper setting value greater than full-scale (wiper
setting of 100h for 8-bit device or 80h for 7-bit devices)
will also be a Full-Scale setting (Terminal W (wiper)
connected to Terminal A). Table 5-1 illustrates the full
wiper setting map.
High Voltage commands are required to enable and
disable WiperLock. Please refer to the Modify Write
Protect or WiperLock Technology (High Voltage)
command for operation.
Equation 5-2 illustrates the calculation used to deter-
mine the resistance between the wiper and terminal B.
5.3.1
POR/BOR OPERATION WHEN
WIPERLOCK TECHNOLOGY
ENABLED
EQUATION 5-2:
R
CALCULATION
WB
RAB
N
RWB = ------------- + RW
8-bit Device
The WiperLock Technology state is not affected by a
POR/BOR event. A POR/BOR event will load the
Volatile Wiper register value with the Non-Volatile
Wiper register value, refer to Section 4.1.
(256)
N = 0 to 256 (decimal)
RAB
N
7-bit Device
RWB = ------------- + RW
(128)
N = 0 to 128 (decimal)
TABLE 5-1:
VOLATILE WIPER VALUE VS.
WIPER POSITION MAP
Wiper Setting
7-bit Pot 8-bit Pot
Properties
3FFh
081h
3FFh
101h
Reserved (Full-Scale (W = A)),
Increment and Decrement
commands ignored
080h
100h
Full-Scale (W = A),
Increment commands ignored
07Fh
041h
0FFh
081
W = N
040h
080h
W = N (Mid-Scale)
W = N
03Fh
001h
07Fh
001
000h
000h
Zero Scale (W = B)
Decrement command ignored
DS22107A-page 44
© 2008 Microchip Technology Inc.
MCP454X/456X/464X/466X
5.4.2
INTERACTION OF RxHW BIT AND
RxA, RxW, AND RxB BITS (TCON
REGISTER)
5.4
Shutdown
Shutdown is used to minimize the device’s current
consumption. The MCP4XXX achieves this through the
Terminal Control Register (TCON).
Using the TCON bits allows each resistor network (Pot
0 and Pot 1) to be individually “shutdown”.
5.4.1
TERMINAL CONTROL REGISTER
(TCON)
The state of the RxHW bit does NOT corrupt the other
bit values in the TCON register nor the value of the
Volatile Wiper Registers. When the Shutdown mode is
exited (RxHW changes state from “0” to “1”):
The Terminal Control (TCON) register is a volatile
register used to configure the connection of each
resistor network terminal pin (A, B, and W) to the
Resistor Network. This bits are described in
Register 4-2.
• The device returns to the Wiper setting specified
by the Volatile Wiper value
• The RxA, RxB, and RxW bits return to controlling
the terminal connection state of that resistor net-
work
When the RxHW bit is a “0”, the selected resistor net-
work is forced into the following state:
• The PxA terminal is disconnected
• The PxW terminal is simultaneously connected to
the PxB terminal (see Figure 5-2)
• The Serial Interface is NOT disabled, and all
Serial Interface activity is executed
• Any EEPROM write cycles are completed
Alternate low power configurations may be achieved
with the RxA, RxW, and RxB bits.
Note 1: The RxHW bits are identical to the RxHW
bits of the MCP41XX/42XX devices. The
MCP42XX devices also have a SHDN
pin which forces the resistor network into
the same state as that resistor networks
RxHW bit.
2: When RxHW = “0”, the state of the TCON
register RxA, RxW, and RxB bits is over-
ridden (ignored). When the state of the
RxHW bit returns to “1”, the TCON
register RxA, RxW, and RxB bits return to
controlling the terminal connection state.
In other words, the RxHW bit does not
corrupt the state of the RxA, RxW, and
RxB bits.
A
W
B
FIGURE 5-2:
Resistor Network Shutdown
Configuration.
© 2008 Microchip Technology Inc.
DS22107A-page 45
MCP454X/456X/464X/466X
NOTES:
DS22107A-page 46
© 2008 Microchip Technology Inc.
MCP454X/456X/464X/466X
2
6.1
Signal Descriptions
6.0
SERIAL INTERFACE (I C)
The I2C interface uses up to five pins (signals). These
are:
The MCP45XX/46XX devices support the I2C serial
protocol. The MCP45XX/46XX I2C’s module operates
in Slave mode (does not generate the serial clock).
Figure 6-1 shows a typical I2C Interface connection. All
I2C interface signals are high-voltage tolerant.
• SDA (Serial Data)
• SCL (Serial Clock)
• A0 (Address 0 bit)
• A1 (Address 1 bit)
• A2 (Address 2 bit)
The MCP45XX/46XX devices use the two-wire I2C
serial interface. This interface can operate in standard,
fast or High-Speed mode. A device that sends data
onto the bus is defined as transmitter, and a device
receiving data as receiver. The bus has to be controlled
by a master device which generates the serial clock
(SCL), controls the bus access and generates the
START and STOP conditions. The MCP45XX/46XX
device works as slave. Both master and slave can
operate as transmitter or receiver, but the master
device determines which mode is activated. Communi-
cation is initiated by the master (microcontroller) which
sends the START bit, followed by the slave address
byte. The first byte transmitted is always the slave
address byte, which contains the device code, the
address bits, and the R/W bit.
6.1.1
SERIAL DATA (SDA)
The Serial Data (SDA) signal is the data signal of the
device. The value on this pin is latched on the rising
edge of the SCL signal when the signal is an input.
With the exception of the START and STOP conditions,
the high or low state of the SDA pin can only change
when the clock signal on the SCL pin is low. During the
high period of the clock the SDA pin’s value (high or
low) must be stable. Changes in the SDA pin’s value
while the SCL pin is HIGH will be interpreted as a
START or a STOP condition.
6.1.2
SERIAL CLOCK (SCL)
Refer to the Phillips I2C document for more details of
the I2C specifications.
The Serial Clock (SCL) signal is the clock signal of the
device. The rising edge of the SCL signal latches the
value on the SDA pin. The MCP45XX/46XX supports
three I2C interface clock modes:
Typical I2C Interface Connections
• Standard Mode: clock rates up to 100 kHz
• Fast Mode: clock rates up to 400 kHz
• High-Speed Mode (HS mode): clock rates up to
3.4 MHz
MCP4XXX
SCL
Host
Controller
SCL
SDA
SDA
The MCP4XXX will not strech the clock signal (SCL)
since memory read acceses occur fast enough.
I/O (1)
HVC/A0 (2)
A1 (2, 3)
A2 (2, 3)
Depending on the clock rate mode, the interface will
display different characteristics.
6.1.3
THE ADDRESS BITS (A2:A1:A0)
There are up to three hardware pins used to specify the
device address. The number of adress pins is
determined by the part number.
Note 1: If High voltage commands are desired,
some type of external circuitry needs to
be implemented.
Address 0 is multiplexed with the High Voltage
Command (HVC) function. So the state of A0 is latched
on the MCP4XXX’s POR/BOR event.
2: These pins have internal pull-ups. If
faster rise times are required, then
external pull-ups should be added.
The state of the A2 and A1 pins should be static, that is
they should be tied high or tied low.
3: This pin could be tied high, low, or
connected to an I/O pin of the Host
Controller.
6.1.3.1
The High Voltage Command (HVC)
Signal
2
FIGURE 6-1:
Typical I C Interface Block
Diagram.
The High Voltage Command (HVC) signal is multi-
plexed with Address 0 (A0) and is used to indicate that
the command, or sequence of commands, are in the
High Voltage mode. High Voltage commands allow the
device’s WiperLock Technology and write protect
features to be enabled and disabled.
The HVC pin has an internal resistor connection to the
MCP45XX/46XXs internal VDD signal.
© 2008 Microchip Technology Inc.
DS22107A-page 47
MCP454X/456X/464X/466X
I2C Operation
6.2.1.3
Acknowledge (A) Bit
6.2
The MCP45XX/46XX’s I2C module is compatible with
the Philips I2C specification. The following lists some of
the modules features:
The A bit (see Figure 6-4) is typically a response from
the receiving device to the transmitting device.
Depending on the context of the transfer sequence, the
A bit may indicate different things. Typically the Slave
device will supply an A response after the Start bit and
8 “data” bits have been received. an A bit has the SDA
signal low.
• 7-bit slave addressing
• Supports three clock rate modes:
- Standard mode, clock rates up to 100 kHz
- Fast mode, clock rates up to 400 kHz
- High-speed mode (HS mode), clock rates up
to 3.4 MHz
• Support Multi-Master Applications
• General call addressing
• Internal weak pull-ups on interface signals
SDA
SCL
D0
A
8
9
The I2C 10-bit addressing mode is not supported.
FIGURE 6-4:
Acknowledge Waveform.
The Philips I2C specification only defines the field
types, field lengths, timings, etc. of a frame. The frame
content defines the behavior of the device. The frame
content for the MCP4XXX is defined in Section 7.0.
Not A (A) Response
The A bit has the SDA signal high. Table 6-1 shows
some of the conditions where the Slave Device will
issue a Not A (A).
2
6.2.1
I C BIT STATES AND SEQUENCE
Figure 6-8 shows the I2C transfer sequence. The serial
clock is generated by the master. The following defini-
tions are used for the bit states:
If an error condition occurs (such as an A instead of A),
then an START bit must be issued to reset the
command state machine.
• Start bit (S)
• Data bit
TABLE 6-1:
MCP45XX/MCP46XX A / A
RESPONSES
• Acknowledge (A) bit (driven low) /
No Acknowledge (A) bit (not driven low)
• Repeated Start bit (Sr)
• Stop bit (P)
Acknowledge
Event
Bit
Comment
Response
6.2.1.1
Start Bit
General Call
A
A
A
A
Only if GCEN bit is
set
The Start bit (see Figure 6-2) indicates the beginning of
a data transfer sequence. The Start bit is defined as the
SDA signal falling when the SCL signal is “High”.
Slave Address
valid
Slave Address
not valid
2nd Bit
1st Bit
SDA
SCL
Device Mem-
ory Address
and specified
command
After device has
received address
and command
S
FIGURE 6-2:
Start Bit.
(AD3:AD0 and
C1:C0) are an
invalid combi-
nation
6.2.1.2 Data Bit
The SDA signal may change state while the SCL signal
is Low. While the SCL signal is High, the SDA signal
MUST be stable (see Figure 6-5).
Communica-
tion during
EEPROM write
cycle
A
After device has
received address
and command,
and valid condi-
tions for EEPROM
write
2nd Bit
1st Bit
SDA
SCL
Bus Collision
N.A.
I2C Module
Resets, or a “Don’t
Care” if the colli-
sion occurs on the
Masters “Start bit”.
Data Bit
FIGURE 6-3:
Data Bit.
DS22107A-page 48
© 2008 Microchip Technology Inc.
MCP454X/456X/464X/466X
6.2.1.4
Repeated Start Bit
6.2.1.5
Stop Bit
The Repeated Start bit (see Figure 6-5) indicates the
current Master Device wishes to continue communicat-
ing with the current Slave Device without releasing the
I2C bus. The Repeated Start condition is the same as
the Start condition, except that the Repeated Start bit
follows a Start bit (with the Data bits + A bit) and not a
Stop bit.
The Stop bit (see Figure 6-6) Indicates the end of the
I2C Data Transfer Sequence. The Stop bit is defined as
the SDA signal rising when the SCL signal is “High”.
A Stop bit resets the I2C interface of all MCP4XXX
devices.
A / A
The Start bit is the beginning of a data transfer
sequence and is defined as the SDA signal falling when
the SCL signal is “High”.
SDA
SCL
P
Note 1: A bus collision during the Repeated Start
condition occurs if:
FIGURE 6-6:
Stop Condition Receive or
Transmit Mode.
• SDA is sampled low when SCL goes
from low to high.
6.2.2
CLOCK STRETCHING
• SCL goes low before SDA is asserted
low. This may indicate that another
master is attempting to transmit a
data "1".
“Clock Stretching” is something that the receiving
Device can do, to allow additional time to “respond” to
the “data” that has been received.
The MCP4XXX will not strech the clock signal (SCL)
since memory read acceses occur fast enough.
1st Bit
6.2.3
ABORTING A TRANSMISSION
SDA
If any part of the I2C transmission does not meet the
command format, it is aborted. This can be intentionally
accomplished with a START or STOP condition. This is
done so that noisy transmissions (usually an extra
START or STOP condition) are aborted before they
corrupt the device.
SCL
Sr = Repeated Start
FIGURE 6-5:
Repeat Start Condition
Waveform.
SDA
SCL
S
1st Bit 2nd Bit 3rd Bit 4th Bit 5th Bit 6th Bit 7th Bit 8th Bit A / A
P
2
FIGURE 6-7:
Typical 8-Bit I C Waveform Format.
SDA
SCL
Data allowed
to change
Data or
A valid
STOP
Condition
START
Condition
2
FIGURE 6-8:
I C Data States and Bit Sequence.
© 2008 Microchip Technology Inc.
DS22107A-page 49
MCP454X/456X/464X/466X
6.2.4
ADDRESSING
Slave Address
The address byte is the first byte received following the
START condition from the master device. The address
contains four (or more) fixed bits and (up to) three user
defined hardware address bits (pins A2, A1, and A0).
These 7-bits address the desired I2C device. The
A7:A4 address bits are fixed to “0101” and the device
appends the value of following three address pins (A2,
A1, A0). Address pins that are not present on the
device are pulled up (a bit value of ‘1’).
S
A6 A5 A4 A3 A2 A1 A0 R/W
A/A
“0”“1” “0”“1”
See Table 6-2
Start
bit
R/W bit
R/W = 0= write
R/W = 1= read
A bit (controlled by slave device)
A = 0= Slave Device Acknowledges byte
A = 1= Slave Device does not Acknowledge byte
Since there are up to three adress bits controlled by
hardware pins, there may be up to eight MCP4XXX
devices on the same I2C bus.
FIGURE 6-9:
Slave Address Bits in the
2
I C Control Byte.
Figure 6-9 shows the slave address byte format, which
contains the seven address bits. There is also a read/
write bit. Table 6-2 shows the fixed address for device.
TABLE 6-2:
Device
DEVICESLAVEADDRESSES
Address Comment
MCP45X1 ‘0101 11’b + A0
Supports up to 2
devices. Note 1
Hardware Address Pins
The hardware address bits (A2, A1, and A0)
correspond to the logic level on the associated address
pins. This allows up to eight devices on the bus.
MCP45X2 ‘0101 1’b + A1:A0 Supports up to 4
devices. Note 1
MCP46X1 ‘0101’b + A2:A1:A0 Supports up to 8
devices. Note 1
These pins have a weak pull-up enabled when the VDD
< VBOR. The weak pull-up utilizes the “smart” pull-up
technology and exhibits the same characteristics as the
High-voltage tolerant I/O structure.
MCP46X2 ‘0101 1’b + A1:A0 Supports up to 4
devices. Note 1
Note 1: A0 is used for High-Voltage commands
and the value is latched at POR.
The state of the A0 address pin is latch on POR/BOR.
This is required since High Voltage commands force
this pin (HVC/A0) to the VIHH level.
6.2.5
SLOPE CONTROL
The MCP45XX/46XX implements slope control on the
SDA output.
As the device transitions from HS mode to FS mode,
the slope control parmameter will change from the HS
specification to the FS specification.
For Fast (FS) and High-Speed (HS) modes, the device
has a spike suppression and a Schmidt trigger at SDA
and SCL inputs.
DS22107A-page 50
© 2008 Microchip Technology Inc.
MCP454X/456X/464X/466X
After switching to the High-Speed mode, the next
transferred byte is the I2C control byte, which specifies
6.2.6
HS MODE
The I2C specification requires that a high-speed mode
device must be ‘activated’ to operate in high-speed
(3.4 Mbit/s) mode. This is done by the Master sending
a special address byte following the START bit. This
byte is referred to as the high-speed Master Mode
Code (HSMMC).
the device to communicate with, and any number of
data bytes plus acknowledgements. The Master
Device can then either issue a Repeated Start bit to
address a different device (at High-Speed) or a Stop bit
to return to Fast/Standard bus speed. After the Stop bit,
any other Master Device (in a Multi-Master system) can
arbitrate for the I2C bus.
The MCP45XX/46XX device does not acknowledge
this byte. However, upon receiving this command, the
device switches to HS mode. The device can now com-
municate at up to 3.4 Mbit/s on SDA and SCL lines.
The device will switch out of the HS mode on the next
STOP condition.
See Figure 6-10 for illustration of HS mode command
sequence.
For more information on the HS mode, or other I2C
modes, please refer to the Phillips I2C specification.
The master code is sent as follows:
1. START condition (S)
6.2.6.1
Slope Control
The slope control on the SDA output is different
between the Fast/Standard Speed and the High-Speed
clock modes of the interface.
2. High-Speed Master Mode Code (0000 1XXX),
The XXXbits are unique to the high-speed (HS)
mode Master.
6.2.6.2
Pulse Gobbler
3. No Acknowledge (A)
The pulse gobbler on the SCL pin is automatically
adjusted to suppress spikes < 10 ns during HS mode.
F/S-mode
HS-mode
P
F/S-mode
S ‘0 0 0 0 1 X X X’b
Sr ‘Slave Address’R/W
“Data”
A
A
A/A
HS-mode continues
Sr ‘Slave Address’
R/W A
HS Select Byte
S = Start bit
Control Byte
Command/Data Byte(s)
Control Byte
Sr = Repeated Start bit
A = Acknowledge bit
A = Not Acknowledge bit
R/W = Read/Write bit
P = Stop bit (Stop condition terminates HS Mode)
FIGURE 6-10: HS Mode Sequence.
© 2008 Microchip Technology Inc.
DS22107A-page 51
MCP454X/456X/464X/466X
6.2.7
GENERAL CALL
TABLE 6-3:
7-bit
GENERALCALLCOMMANDS
Comment
The General Call is a method that the “Master” device
can communicate with all other “Slave” devices. In a
Multi-Master application, the other Master devices are
operating in Slave mode. The General Call address
has two documented formats. These are shown in
Figure 6-11. We have added a MCP45XX/46XX format
in this figure as well.
This will allow customers to have multiple I2C Digital
Potentiometers on the bus and have them operate in a
synchronous fashion (analogous to the DAC Sync pin
functionality). If these MCP45XX/46XX 7-bit com-
mands conflict with other I2C devices on the bus, then
the customer will need two I2C busses and ensure that
the devices are on the correct bus for their desired
application functionality.
Command
(1, 2, 3)
‘100000d’b Write Next Byte (Third Byte) to Volatile
Wiper 0 Register
‘100100d’b Write Next Byte (Third Byte) to Volatile
Wiper 1 Register
‘110000d’b Write Next Byte (Third Byte) to TCON
Register
‘1000010’b Increment Wiper 0 Register
or
‘1000011’b
‘1001010’b Increment Wiper 1 Register
or
Dual Pot devices can not update both Pot0 and Pot1
from a single command. To address this, there are
General Call commands for the Wiper 0, Wiper 1, and
the TCON registers.
‘1001011’b
‘1000100’b Decrement Wiper 0 Register
or
‘1000101’b
Table 6-3 shows the General Call Commands. Three
commands are specified by the I2C specification and
are not applicable to the MCP45XX/46XX (so com-
mand is Not Acknowledged) The MCP45XX/46XX
General Call Commands are Acknowledge. Any other
command is Not Acknowledged.
‘1001100’b Decrement Wiper 1 Register
or
‘1001101’b
Note 1: Any other code is Not Acknowledged.
These codes may be used by other
devices on the I2C bus.
Note:
Only one General Call command per issue
of the General Call control byte. Any addi-
tional General Call commands are ignored
and Not Acknowledged.
2: The 7-bit command always appends a “0”
to form 8-bits. .
3: “d” is the D8 bit for the 9-bit write value.
DS22107A-page 52
© 2008 Microchip Technology Inc.
MCP454X/456X/464X/466X
Second Byte
S
0
0
0
0
0
0
0
0
A
X
X
X
X
X
X X 0 A P
General Call Address
“7-bit Command”
Reserved 7-bit Commands (By I2C Specification - Philips # 9398 393 40011, Ver. 2.1 January 2000)
‘0000 011’b - Reset and write programmable part of slave address by hardware.
‘0000 010’b - Write programmable part of slave address by hardware.
‘0000 000’b - NOT Allowed
MCP45XX/MCP46XX 7-bit Commands
‘1000 01x’b - Increment Wiper 0 Register.
‘1001 01x’b - Increment Wiper 1 Register.
‘1000 10x’b - Decrement Wiper 0 Register.
‘1001 10x’b - Decrement Wiper 1 Register.
The Following is a Microchip Extension to this General Call Format
Third Byte
Second Byte
S
0
0
0
0
0
0
0
0
A
X
X
X
X
X
X
d
0
A d
d
d
d
d
d
d
d
A
P
General Call Address
MCP45XX/MCP46XX 7-bit Commands
“7-bit Command”
“0” for General Call Command
‘1000 00d’b - Write Next Byte (Third Byte) to Volatile Wiper 0 Register.
‘1001 00d’b - Write Next Byte (Third Byte) to Volatile Wiper 1 Register.
‘1100 00d’b - Write Next Byte (Third Byte) to TCON Register.
The Following is a “Hardware General Call” Format
n occurrences of (Data + A)
A X X X X X X X X A P
Second Byte
S
0
0
0
0
0
0
0
0
A
X
X
X
X
X
X
X
1
General Call Address
“7-bit Command”
This indicates a “Hardware General Call”
MCP45XX/MCP46XX will ignore this byte and
all following bytes (and A), until
a Stop bit (P) is encountered.
FIGURE 6-11:
General Call Formats.
© 2008 Microchip Technology Inc.
DS22107A-page 53
MCP454X/456X/464X/466X
NOTES:
DS22107A-page 54
© 2008 Microchip Technology Inc.
MCP454X/456X/464X/466X
Normal serial commands are those where the HVC pin
is driven to VIH or VIL. With High-Voltage Serial Com-
mands, the HVC pin is driven to VIHH. In each mode,
there are four possible commands.
7.0
DEVICE COMMANDS
The MCP4XXX’s I2C command formats are specified in
this section. The I2C protocol does not specify how
commands are formatted.
Additionally, there are two commands used to enable
or disable the special features (Write Protect and Wiper
Lock Technology) of the device. The commands are
special cases of the Increment and Decrement
High-Voltage Serial Command.
The MCP4XXX supports four basic commands.
Depending on the location accessed determines the
commands that are supported.
For the Volatile Wiper Registers, these commands are:
Table 7-2 shows the supported commands for each
memory location.
• Write Data
• Read Data
• Increment Data
• Decrement Data
Table 7-3 shows an overview of all the device com-
mands and their interaction with other device features.
For the Non-Volatile wiper EEPROM, general purpose
data EEPROM, and the TCON Register these com-
mands are:
7.1
Command Byte
The MCP4XXX’s Command Byte has three fields: the
Address, the Command Operation, and 2 Data bits,
see Figure 7-1. Currently only one of the data bits is
defined (D8).
• Write Data
• Read Data
These commands have formats for both a single
command or continuous commands. These commands
are shown in Table 7-1.
The device memory is accessed when the Master
sends a proper Command Byte to select the desired
operation. The memory location getting accessed is
contained in the Command Byte’s AD3:AD0 bits. The
action desired is contained in the Command Byte’s
C1:C0 bits, see Table 7-1. C1:C0 determines if the
desired memory location will be read, written,
Incremented (wiper setting +1) or Decremented (wiper
setting -1). The Increment and Decrement commands
are only valid on the volatile wiper registers, and in
High Voltage commands to enable/disable WiperLock
Technology and Software Write Protect.
Each command has two operational states. The
operational state determines if the device commands
control the special features (Write Protect and Wiper-
Lock Technology). These operational states are
referred to as:
• Normal Serial Commands
• High-Voltage Serial Commands
2
TABLE 7-1:
I C COMMANDS
Command
Operateson
Volatile/
If the Address bits and Command bits are not a valid
combination, then the MCP4XXX will generate a Not
Acknowledge pulse to indicate the invalid combination.
The I2C Master device must then force a Start Condi-
tion to reset the MCP4XXX’s 2C module.
# of Bit
Clocks (1) Non-Volatile
memory
Operation
Mode
Write Data
Single
29
Both
Continuous 18n + 11 Volatile Only
D9 and D8 are the most significant bits for the digital
potentiometer’s wiper setting. The 8-bit devices utilize
D8 as their MSb while the 7-bit devices utilize D7 (from
the data byte) as it’s MSb.
Read Data
Single
29
48
Both
Both
Random
Continuous 18n + 11 Both (2)
Increment
Single
Continuous 9n + 11 Volatile Only
20 Volatile Only
20
Volatile Only
(3)
COMMAND BYTE
Decrement Single
A
A
D
3
A
D
2
A
D
1
A
D
0
C
1
C
0
D
9
D
8
A
(3)
Continuous 9n + 11 Volatile Only
Note 1: “n” indicates the number of times the
command operation is to be repeated.
MSbits (Data)
MCP4XXX
Memory Address
2: This command is useful to determine if a
non-volatile memory write cycle has
completed.
Command Operation bits
00= Write Data
01= Increment
10= Decrement
11= Read Data
3: High Voltage Increment and Decrement
commands on select non-volatile memory
locations enable/disable WiperLock
Technology and the software Write
Protect feature.
FIGURE 7-1:
Command Byte Format.
© 2008 Microchip Technology Inc.
DS22107A-page 55
MCP454X/456X/464X/466X
TABLE 7-2:
MEMORY MAP AND THE SUPPORTED COMMANDS
Address
Function
Data
Command Operation
Comment
(10-bits) (1)
Value
00h Volatile Wiper 0
Write Data
Read Data (3)
nn nnnn nnnn
nn nnnn nnnn
—
Increment Wiper
Decrement Wiper
Write Data
—
01h Volatile Wiper 1
nn nnnn nnnn
nn nnnn nnnn
—
Read Data (3)
Increment Wiper
Decrement Wiper
Write Data
—
02h Non Volatile Wiper 0
03h Non Volatile Wiper 1
nn nnnn nnnn
nn nnnn nnnn
—
Read Data (3)
High Voltage Increment
High Voltage Decrement
Write Data
Wiper Lock 0 Disable
Wiper Lock 0 Enable
—
nn nnnn nnnn
nn nnnn nnnn
—
Read Data (3)
High Voltage Increment
High Voltage Decrement
Wiper Lock 1 Disable
Wiper Lock 1 Enable
—
04h (2) Volatile TCON Register Write Data
Read Data (3)
nn nnnn nnnn
nn nnnn nnnn
nn nnnn nnnn
nn nnnn nnnn
nn nnnn nnnn
nn nnnn nnnn
nn nnnn nnnn
nn nnnn nnnn
nn nnnn nnnn
nn nnnn nnnn
nn nnnn nnnn
nn nnnn nnnn
nn nnnn nnnn
nn nnnn nnnn
nn nnnn nnnn
nn nnnn nnnn
nn nnnn nnnn
nn nnnn nnnn
nn nnnn nnnn
nn nnnn nnnn
nn nnnn nnnn
nn nnnn nnnn
nn nnnn nnnn
—
05h (2) Status Register
06h (2) Data EEPROM
Read Data (3)
Write Data
Read Data (3)
Write Data
Read Data (3)
07h (2) Data EEPROM
08h (2) Data EEPROM
09h (2) Data EEPROM
0Ah (2) Data EEPROM
0Bh (2) Data EEPROM
0Ch (2) Data EEPROM
0Dh (2) Data EEPROM
0Eh (2) Data EEPROM
0Fh Data EEPROM
Write Data
Read Data (3)
Write Data
Read Data (3)
Write Data
Read Data (3)
Write Data
Read Data (3)
Write Data
Read Data (3)
Write Data
Read Data (3)
Write Data
Read Data (3)
Write Data
Read Data (3)
High Voltage Increment
High Voltage Decrement
Write Protect Disable
Write Protect Enable
—
Note 1: The Data Memory is only 9-bits wide, so the MSb is ignored by the device.
2: Increment or Decrement commands are invalid for these addresses.
3: I2C read operation will read 2 bytes, of which the 10-bits of data are contained within.
DS22107A-page 56
© 2008 Microchip Technology Inc.
MCP454X/456X/464X/466X
7.2
Data Byte
7.3
Error Condition
Only the Read Command and the Write Command
have Data Byte(s).
If the four address bits received (AD3:AD0) and the two
command bits received (C1:C0) are a valid combina-
tion, the MCP4XXX will Acknowledge the I2C bus.
The Write command concatenates the 8-bits of the
Data Byte with the one data bit (D8) contained in the
Command Byte to form 9-bits of data (D8:D0). The
Command Byte format supports up to 9-bits of data so
that the 8-bit resistor network can be set to Full-Scale
(100h or greater). This allows wiper connections to
Terminal A and to Terminal B. The D9 bit is currently
unused.
If the address bits and command bits are an invalid
combination, then the MCP4XXX will Not Acknowledge
the I2C bus.
Once an error condition has occurred, any following
commands are ignored until the I2C bus is reset with a
Start Condition.
7.3.1
ABORTING A TRANSMISSION
A Restart or Stop condition in the expected data bit
position will abort the current command sequence and
data will not be written to the MCP4XXX.
TABLE 7-3:
COMMANDS
Operates on
Volatile/
Non-Volatile
memory
High
Voltage
(VIHH) on
HVC pin?
Works
when
Wiper is
“locked”?
Writes
Value in
EEPROM
Impact on
WiperLock or
Write Protect
Command Name
Write Data
Read Data
Yes (1)
—
Both
Both
—
—
unlocked (1)
unlocked (1)
unlocked (1)
unlocked (1)
unchanged
unchanged
unchanged
unchanged
No
No
No
No
No
Yes
No
No
Yes
Increment Wiper
—
Volatile Only
Volatile Only
Both
—
Decrement Wiper
—
—
High Voltage Write Data
High Voltage Read Data
High Voltage Increment Wiper
High Voltage Decrement Wiper
Yes
—
Yes
Yes
Yes
Yes
Yes
Both
—
Volatile Only
Volatile Only
—
(2)
Modify Write Protect or WiperLock
Technology (High Voltage) - Enable
—
Non-Volatile
Only (2)
locked/
protected (2)
(3)
Modify Write Protect or WiperLock
Technology (High Voltage) - Disable
—
Non-Volatile
Only (3)
Yes
unlocked/
unprotected
Yes
(3)
Note 1: This command will only complete, if wiper is “unlocked” (WiperLock Technology is Disabled).
2: If the command is executed using address 02h or 03h, that corresponding wiper is locked or
if with address 0Fh, then Write Protect is enabled.
3: If the command is executed using with address 02h or 03h, that corresponding wiper is unlocked or
if with address 0Fh, then Write Protect is disabled.
© 2008 Microchip Technology Inc.
DS22107A-page 57
MCP454X/456X/464X/466X
7.4.3
CONTINUOUS WRITES TO
VOLATILE MEMORY
7.4
Write Data
Normal and High Voltage
A continuous write mode of operation is possible when
writing to the volatile memory registers (address 00h,
01h, and 04h). This continuous write mode allows
writes without a Stop or Restart condition or repeated
transmissions of the I2C Control Byte. Figure 7-3
shows the sequence for three continuous writes. The
writes do not need to be to the same volatile memory
address. The sequence ends with the master sending
a STOP or RESTART condition.
The Write Command can be issued to both the Volatile
and Non-Volatile memory locations. The format of the
command, see Figure 7-2, includes the I2C Control
Byte, an A bit, the MCP4XXX Command Byte, an A bit,
the MCP4XXX Data Byte, an A bit, and a Stop (or
Restart) condition. The MCP4XXX generates the A / A
bits.
A Write command to a Volatile memory location
changes that location after a properly formatted Write
Command and the A / A clock have been received.
7.4.4
CONTINUOUS WRITES TO
NON-VOLATILE MEMORY
A Write command to a Non-Volatile memory location
will only start a write cycle after a properly formatted
Write Command have been received and the Stop
condition has occurred.
If a continuous write is attempted on Non-Volatile
memory, the missing Stop condition will cause the com-
mand to be an error condition (A). A Start bit is required
to reset the command state machine.
Note:
Writes to certain memory locations will be
dependant on the state of the WiperLock
Technology bits and the Write Protect bit.
7.4.5
THE HIGH VOLTAGE COMMAND
(HVC) SIGNAL
The High Voltage Command (HVC) signal is
multiplexed with Address 0 (A0) and is used to indicate
that the command, or sequence of commands, are in
the High Voltage operational state. High Voltage
commands allow the device’s WiperLock Technology
and write protect features to be enabled and disabled.
7.4.1
SINGLE WRITE TO VOLATILE
MEMORY
For volatile memory locations, data is written to the
MCP4XXX after every byte transfer (during the
Acknowledge). If a Stop or Restart condition is gener-
ated during a data transfer (before the A), the data will
not be written to the MCP4XXX. After the A bit, the
master can initiate the next sequence with a Stop or
Restart condition.
The HVC pin has an internal resistor connection to the
MCP45XX/46XXs internal VDD signal.
Refer to Figure 7-2 for the byte write sequence.
7.4.2
SINGLE WRITE TO NON-VOLATILE
MEMORY
The sequence to write to a single non-volatile memory
location is the same as a single write to volatile memory
with the exception that the EEPROM write cycle (twc) is
started after a properly formatted command, including
the Stop bit, is received. After the Stop condition occurs
the serial interface may immediately be re-enabled by
initiating a Start condition.
During an EEPROM write cycle, access to volatile
memory (addresses 00h, 01h, 04h, and 05h) is allowed
when using the appropriate command sequence.
Commands that address non-volatile memory are
ignored until the EEPROM write cycle (twc) completes.
This allows the Host Controller to operate on the
Volatile Wiper registers, the TCON register, and to
Read the Status Register. The EEWA bit in the Status
register indicates the status of an EEPROM Write
Cycle.
Once a write command to a Non-Volatile memory
location has been received, No other commands
should be received before the Stop condition occurs.
Figure 7-2 show the waveform for a single write.
DS22107A-page 58
© 2008 Microchip Technology Inc.
MCP454X/456X/464X/466X
Write bit
Device
Memory
Address
Variable
Address
Fixed
Address
Write “Data” bits
Command
AD AD AD AD
S
0
1
0
1
A2 A1 A0 0
A
0
0 x D8 A D7 D6 D5 D4 D3 D2 D1 D0 A P
3
2
1
0
WRITE Command
Write Data bits
Control Byte
2
FIGURE 7-2:
I C Write Sequence.
Write bit
Variable
Address
Device
Memory
Address
Fixed
Address
Write “Data” bits
Command
AD AD AD AD
S
0
1
0
1
A2 A1 A0 0
A
0
0 x D8 A D7 D6 D5 D4 D3 D2 D1 D0 A
3
2
1
0
WRITE Command Write Data bits
Control Byte
AD AD AD AD
0
0 x D8 A D7 D6 D5 D4 D3 D2 D1 D0 A
3
2
1
0
WRITE Command
Write Data bits
STOP bit
AD AD AD AD
0
0
x D8 A D7 D6 D5 D4 D3 D2 D1 D0 A
P
3
2
1
0
WRITE Command Write Data bits
Note:
Only functions when writing the volatile wiper registers (AD3:AD0 = 00h, 01h, and 04h)
or the TCON register
2
FIGURE 7-3:
I C Continuous Volatile Wiper Write.
© 2008 Microchip Technology Inc.
DS22107A-page 59
MCP454X/456X/464X/466X
7.5.2
CONTINUOUS READS
7.5
Read Data
Normal and High Voltage
Continuous reads allows the devices memory to be
read quickly. Continuous reads are possible to all mem-
ory locations. If a non-volatile memory write cycle is
occurring, then Read commands may only access the
volatile memory locations.
The Read Command can be issued to both the Volatile
and Non-Volatile memory locations. The format of the
command, see Figure 7-4, includes the Start condition,
I2C Control Byte (with R/W bit set to “0”), A bit,
MCP4XXX Command Byte, A bit, followed by a
Repeated Start bit, I2C Control Byte (with R/W bit set to
“1”), and the MCP4XXX transmitting the requested
Data High Byte, and A bit, the Data Low Byte, the Mas-
ter generating the A, and Stop condition.
The I2C Control Byte requires the R/W bit equal to a
logic one (R/W = 1) to generate a read sequence. The
memory location read will be the last address
contained in a valid write MCP4XXX Command Byte or
address 00h if no write operations have occurred since
the device was reset (Power-on Reset or Brown-out
Reset).
Figure 7-6 shows the sequence for three continuous
reads.
For continuous reads, instead of transmitting a Stop
or Restart condition after the data transfer, the master
reads the next data byte. The sequence ends with the
master Not Acknowledging and then sending a Stop or
Restart.
7.5.3
THE HIGH VOLTAGE COMMAND
(HVC) SIGNAL
The High Voltage Command (HVC) signal is
multiplexed with Address 0 (A0) and is used to indicate
that the command, or sequence of commands, are in
the High Voltage mode. High Voltage commands allow
the device’s WiperLock Technology and write protect
features to be enabled and disabled.
During a write cycle (Write or High Voltage Write to a
Non-Volatile memory location) the Read command can
only read the Volatile memory locations. By reading the
Status Register (04h), the Host Controller can
determine when the write cycle has completed (via the
state of the EEWA bit).
The HVC pin has an internal resistor connection to the
MCP4XXXs internal VDD signal.
Read operations initially include the same address byte
sequence as the write sequence (shown in Figure 6-9).
This sequence is followed by another control byte
(including the Start condition and Ackowledge) with the
R/W bit equal to a logic one (R/W = 1) to indicate a
read. The MCP4XXX will then transmit the data con-
tained in the addressed register. This is followed by the
master generating an A bit in preparation for more data,
or an A bit followed by a Stop. The sequence is ended
with the master generating a Stop or Restart condition.
7.5.4
IGNORING AN I2C TRANSMISSION AND
“FALLING OFF” THE BUS
The MCP4XXX expects to receive entire, valid I2C
commands and will assume any command not defined
as a valid command is due to a bus corruption and will
enter a passive high condition on the SDA signal. All
signals will be ignored until the next valid Start
condition and Control Byte are received.
The internal address pointer is maintained. If this
address pointer is for a non-volatile memory address
and the read control byte addresses the device during
a Non-Volatile Write Cycle (tWC) the device will respond
with an A bit.
7.5.1
SINGLE READ
Figure 7-4 show the waveforms for a single read.
For single reads the master sends a STOP or
RESTART condition after the data byte is sent from the
slave.
7.5.1.1
Random Read
Figure 7-5 shows the sequence for a Random Reads.
Refer to Figure 7-5 for the random byte read
sequence.
DS22107A-page 60
© 2008 Microchip Technology Inc.
MCP454X/456X/464X/466X
Read bit
STOP bit
Variable
Address
Fixed
Address
Read Data bits
S
0
1
0
1
A2 A1 A0 1 A 0
0
0
0 0
0
0 D8 A1 D7 D6 D5 D4 D3 D2 D1 D0 A2
Read bits
P
Control Byte
Note 1: Master Device is responsible for A / A signal. If a A signal occurs, the MCP45XX/46XX will
abort this transfer and release the bus.
2: The Master Device will Not Acknowledge, and the MCP45XX/46XX will release the bus so the
Master Device can generate a Stop or Repeated Start condition.
3: The MCP45xx/46xx retains the last “Device Memory Address” that it has received. This is the
MCP45XX/46XX does not “corrupt” the “Device Memory Address” after Repeated Start or
Stop conditions.
4: The Device Memory Address pointer defaults to 00h on POR and BOR conditions.
2
FIGURE 7-4:
I C Read (Last Memory Address Accessed).
Write bit
Device
Repeated Start bit
Variable
Address
Fixed
Address
Memory
Address
Command
AD AD AD AD
S
0
1
0
1
A2 A1 A0 0
A
1
1
x X A Sr
3
2
1
0
READ Command
Control Byte
STOP bit
Read bit
Read Data bits
0
1
0
1
A2 A1 A0 1 A 0
0
0
0 0
0
0 D8 A1 D7 D6 D5 D4 D3 D2 D1 D0 A2
Read bits
P
Control Byte
Note 1: Master Device is responsible for A / A signal. If a A signal occurs, the MCP45XX/46XX will
abort this transfer and release the bus.
2: The Master Device will Not Acknowledge, and the MCP45XX/46XX will release the bus so the
Master Device can generate a Stop or Repeated Start condition.
3: The MCP45XX/46XX retains the last “Device Memory Address” that it has received. This is
the MCP45XX/46XX does not “corrupt” the “Device Memory Address” after Repeated Start or
Stop conditions.
2
FIGURE 7-5:
I C Random Read.
© 2008 Microchip Technology Inc.
DS22107A-page 61
MCP454X/456X/464X/466X
Read bit
Variable
Address
Fixed
Address
Read Data bits
S
0
1
0
1
A2 A1 A0 1
A
0
0
0
0
0
0
0 D8 A1 D7 D6 D5 D4 D3 D2 D1 D0 A1
Read bits
Control Byte
Read Data bits
0
0
0
0 0
0
0 D8 A1 D7 D6 D5 D4 D3 D2 D1 D0 A1
STOP bit
Read Data bits
0 D8 A1 D7 D6 D5 D4 D3 D2 D1 D0 A2
0
0
0
0 0
0
P
Note 1: Master Device is responsible for A / A signal. If a A signal occurs, the MCP45XX/46XX will
abort this transfer and release the bus.
2: The Master Device will Not Acknowledge, and the MCP45XX/46XX will release the bus so the
Master Device can generate a Stop or Repeated Start condition.
2
FIGURE 7-6:
I C Continuos Reads.
DS22107A-page 62
© 2008 Microchip Technology Inc.
MCP454X/456X/464X/466X
The advantage of using an Increment Command
instead of a read-modify-write series of commands is
speed and simplicity. The wiper will transition after each
Command Acknowledge when accessing the volatile
wiper registers.
7.6
Increment Wiper
Normal and High Voltage
The Increment Command provide a quick and easy
method to modify the potentiometer’s wiper by +1 with
minimal overhead. The Increment Command will only
function on the volatile wiper setting memory locations
00h and 01h. The Increment Command to Non-Volatile
addresses will be ignored and will generate a A.
TABLE 7-4:
INCREMENT OPERATION VS.
VOLATILE WIPER VALUE
Current Wiper
Setting
Increment
Wiper (W)
Note:
Table 7-2 shows the valid addresses for
the Increment Wiper command. Other
addresses are invalid.
Command
Properties
7-bit
Pot
8-bit
Pot
Operates?
When executing an Increment Command, the volatile
wiper setting will be altered from n to n+1 for each
Increment Command received. The value will incre-
ment up to 100h max on 8-bit devices and 80h on 7-bit
devices. If multiple Increment Commands are received
after the value has reached 100h (or 80h), the value will
not be incremented further. Table 7-4 shows the
Increment Command versus the current volatile wiper
value.
3FFh
081h
3FFh Reserved
101h (Full-Scale (W = A))
No
080h
100h Full-Scale (W = A) No
07Fh
041h
0FFh W = N
081
040h
080h W = N (Mid-Scale) Yes
03Fh
001h
07Fh W = N
001
The Increment Command will most commonly be
performed on the Volatile Wiper locations until a
desired condition is met. The value in the Volatile Wiper
register would need to be read using a Read operation
in order to write the new setting to the corresponding
Non-Volatile wiper memory using a Write operation.
The MCP4XXX is responsible for generating the A bits.
000h
000h Zero Scale (W = B) Yes
7.6.1
THE HIGH VOLTAGE COMMAND
(HVC) SIGNAL
The High Voltage Command (HVC) signal is multi-
plexed with Address 0 (A0) and is used to indicate that
the command, or sequence of commands, are in the
High Voltage mode. Signals > VIHH (~8.5V) on the
HVC/A0 pin puts MCP45XX/46XX devices into High
Voltage mode. High Voltage commands allow the
device’s WiperLock Technology and write protect
features to be enabled and disabled.
Refer to Figure 7-7 for the Increment Command
sequence. The sequence is terminated by the Stop
condition. So when executing a continuous command
string, The Increment command can be followed by any
other valid command. this means that writes do not
need to be to the same volatile memory address.
Note:
The command sequence can go from an
increment to any other valid command for
the specified address. Issuing an incre-
ment or decrement to a non-volatile loca-
tion will cause an error condition (A will be
generated).
Note:
There is a required delay after the HVC pin
is driven to the VIHH level to the 1st edge
of the SCL pin.
The HVC pin has an internal resistor connection to the
MCP45XX/46XXs internal VDD signal.
Write bit
Device
Memory
Address
Variable
Address
Fixed
Address
Command
AD AD AD AD
AD AD AD AD
(2)
S
0
1
0
1
A2 A1 A0 0
A
0
1 x
X
A
0
1 x
X A P
3
2
1
0
4
3
2
1
INCR Command (n+1)
INCR Command (n+2)
Control Byte
Note 1: Increment Command (INCR) only functions when accessing the volatile wiper reg-
isters (AD3:AD0 = 0h and 1h).
2: This command sequence does not need to terminate (using the Stop bit) and can
change to any other desired command sequence (Increment, Read, or Write).
2
FIGURE 7-7:
I C Increment Command Sequence.
© 2008 Microchip Technology Inc.
DS22107A-page 63
MCP454X/456X/464X/466X
The advantage of using an Decrement Command
instead of a read-modify-write series of commands is
speed and simplicity. The wiper will transition after each
Command Acknowledge when accessing the volatile
wiper registers.
7.7
Decrement Wiper
Normal and High Voltage
The Decrement Command provide a quick and easy
method to modify the potentiometer’s wiper by -1 with
minimal overhead. The Decrement Command will only
function on the volatile wiper setting memory locations
00h and 01h. Decrement Commands to Non-Volatile
addresses will be ignored and will generate an A bit.
TABLE 7-5:
DECREMENT OPERATION VS.
VOLATILE WIPER VALUE
Current Wiper
Setting
Decrement
Wiper (W)
Note:
Table 7-2 shows the valid addresses for
the Decrement Wiper command. Other
addresses are invalid.
Command
Properties
7-bit
Pot
8-bit
Pot
Operates?
When executing a Decrement Command, the volatile
wiper setting will be altered from n to n-1 for each
Decrement Command received. The value will
decrement down to 000h min. If multiple Decrement
Commands are received after the value has reached
000h, the value will not be decremented further.
Table 7-5 shows the Increment Command versus the
current volatile wiper value.
3FFh
081h
3FFh Reserved
101h (Full-Scale (W = A))
No
080h
100h Full-Scale (W = A) Yes
07Fh
041h
0FFh W = N
081
040h
080h W = N (Mid-Scale) Yes
03Fh
001h
07Fh W = N
001
The Decrement Command will most commonly be
performed on the Volatile Wiper locations until a
desired condition is met. The value in the Volatile Wiper
register would need to be read using a Read operation
in order to write the new setting to the corresponding
Non-Volatile wiper memory using a Write operation.
The MCP4XXX is responsible for generating the A bits.
000h
000h Zero Scale (W = B) No
7.7.1
THE HIGH VOLTAGE COMMAND
(HVC) SIGNAL
Refer to Figure 7-8 for the Decrement Command
sequence. The sequence is terminated by the Stop
condition. So when executing a continuous command
string, The Increment command can be followed by any
other valid command. this means that writes do not
need to be to the same volatile memory address.
The High Voltage Command (HVC) signal is
multiplexed with Address 0 (A0) and is used to indicate
that the command, or sequence of commands, are in
the High Voltage mode. Signals > VIHH (~8.5V) on the
HVC/A0 pin puts MCP45XX/46XX devices into High
Voltage mode. High Voltage commands allow the
device’s WiperLock Technology and write protect
features to be enabled and disabled.
Note:
The command sequence can go from an
increment to any other valid command for
the specified address. Issuing an
increment or decrement to a non-volatile
location will cause an error condition (A
will be generated).
Note:
There is a required delay after the HVC pin
is driven to the VIHH level to the 1st edge
of the SCL pin.
The HVC pin has an internal resistor connection to the
MCP45XX/46XXs internal VDD signal.
Write bit
Variable
Address
Device
Memory
Address
Fixed
Address
Command
AD AD AD AD
AD AD AD AD
S
0
1
0
1
A2 A1 A0 0
A
1
0 X
X
A
1
0 X
X A
P (2)
3
2
1
0
4
3
2
1
DECR Command (n-1)
DECR Command (n-2)
Control Byte
Note 1: Decrement Command (DECR) only functions when accessing the volatile wiper
registers (AD3:AD0 = 0h and 1h).
2: This command sequence does not need to terminate (using the Stop bit) and can
change to any other desired command sequence (INCR, Read, or Write).
2
FIGURE 7-8:
I C Decrement Command Sequence.
DS22107A-page 64
© 2008 Microchip Technology Inc.
MCP454X/456X/464X/466X
7.8.1
SINGLE MODIFY (ENABLE OR
DISABLE) WRITE PROTECT OR
WIPERLOCK TECHNOLOGY (HIGH
VOLTAGE)
7.8
Modify Write Protect or WiperLock
Technology (High Voltage)
Enable and Disable
These commands are special cases of the High Volt-
age Decrement Wiper and the High Voltage Incre-
ment Wiper commands to the non-volatile memory
locations 02h, 03h, and 0Fh. This command is used to
enable or disable either the software Write Protect,
wiper 0 WiperLock Technology, or wiper 1 WiperLock
Technology. Table 7-6 shows the memory addresses,
the High Voltage command and the result of those
commands on the non-volatile WP, WL0, 0r WL1 bits.
Figure 7-9 (Disable) and Figure 7-10 (Enable) show
the formats for a single Modify Write Protect or Wiper-
Lock Technology command.
A Modify Write Protect or WiperLock Technology
Command will only start an EEPROM write cycle (twc
)
after a properly formatted Command has been
received and the Stop condition occurs.
During an EEPROM write cycle, only serial commands
to Volatile memory (addresses 00h, 01h, 04h, and 05h)
are accepted. All other serial commands are ignored
until the EEPROM write cycle (twc) completes. This
allows the Host Controller to operate on the Volatile
Wiper registers and the TCON register, and to Read
the Status Register. The EEWA bit in the Status register
indicates the status of an EEPROM Write Cycle.
TABLE 7-6:
ADDRESS MAP TO MODIFY WRITE PROTECT AND WIPERLOCK TECHNOLOGY
Command’s and Result
Memory
Address
High Voltage Decrement Wiper
High Voltage Increment Wiper
00h
01h
Wiper 0 register is incremented
Wiper 1 register is decremented
WL0 is enabled
Wiper 0 register is incremented
Wiper 1 register is incremented
WL0 is disabled
02h
03h
WL1 is enabled
WL1 is disabled
04h (1)
05h - 0Eh (1)
0Fh
TCON register not changed
Reserved
TCON register not changed
Reserved
WP is enabled
WP is disabled
Note 1: Reserved addresses: Increment or Decrement commands are invalid for these addresses.
Write bit
Device
Memory
Address
Variable
Address
Fixed
Address
Command (Increment)
AD AD AD AD
P
X A
S
0
1
0
1
A2 A1 A0 0
A
0
1 X
3
2
1
0
Disable Command
Control Byte
2
FIGURE 7-9:
I C Disable Command Sequence.
Write bit
Device
Memory
Address
Variable
Address
Fixed
Address
Command (Decrement)
AD AD AD AD
P
X A
S
0
1
0
1
A2 A1 A0 0
A
1
0
X
3
2
1
0
Enable Command
Control Byte
2
FIGURE 7-10:
I C Enable Command Sequence.
© 2008 Microchip Technology Inc.
DS22107A-page 65
MCP454X/456X/464X/466X
NOTES:
DS22107A-page 66
© 2008 Microchip Technology Inc.
MCP454X/456X/464X/466X
The circuit in Figure 8-2 shows the method used on the
MCP402X Non-volatile Digital Potentiometer Evalua-
8.0
APPLICATIONS EXAMPLES
Non-volatile digital potentiometers have a multitude of
practical uses in modern electronic circuits. The most
popular uses include precision calibration of set point
thresholds, sensor trimming, LCD bias trimming, audio
attenuation, adjustable power supplies, motor control
overcurrent trip setting, adjustable gain amplifiers and
offset trimming. The MCP454X/456X/464X/466X
devices can be used to replace the common mechani-
cal trim pot in applications where the operating and
terminal voltages are within CMOS process limitations
(VDD = 2.7V to 5.5V).
tion Board (Part Number: MCP402XEV). This method
requires that the system voltage be approximately 5V.
This ensures that when the PIC10F206 enters a
brown-out condition, there is an insufficient voltage
level on the HVC pin to change the stored value of the
wiper. The MCP402X Non-volatile Digital Potentiome-
ter Evaluation Board User’s Guide (DS51546) contains
a complete schematic.
GP0 is a general purpose I/O pin, while GP2 can either
be a general purpose I/O pin or it can output the internal
clock.
For the serial commands, configure the GP2 pin as an
input (high impedance). The output state of the GP0 pin
will determine the voltage on the HVC pin (VIL or VIH).
8.1
Techniques to force the HVC pin
to VIHH
The circuit in Figure 8-1 shows a method using the
TC1240A doubling charge pump. When the SHDN pin
is high, the TC1240A is off, and the level on the HVC
pin is controlled by the PIC® microcontrollers (MCUs)
IO2 pin.
For high-voltage serial commands, force the GP0
output pin to output a high level (VOH) and configure the
GP2 pin to output the internal clock. This will form a
charge pump and increase the voltage on the HVC pin
(when the system voltage is approximately 5V).
When the SHDN pin is low, the TC1240A is on and the
VOUT voltage is 2 * VDD. The resistor R1 allows the
HVC pin to go higher than the voltage such that the PIC
MCU’s IO2 pin “clamps” at approximately VDD.
PIC10F206
R1
GP0
MCP4XXX
TC1240A
C+
GP2
PIC MCU
VIN
HVC
C2
C1
C-
SHDN
C1
VOUT
IO1
FIGURE 8-2:
Digital Potentiometer Evaluation Board
(MCP402XEV) implementation to generate the
MCP4XXX Non-Volatile
MCP45XX
MCP46XX
R1
HVC
IO2
C2
V
voltage.
IHH
FIGURE 8-1:
generate the V
Using the TC1240A to
voltage.
IHH
© 2008 Microchip Technology Inc.
DS22107A-page 67
MCP454X/456X/464X/466X
8.2
Using Shutdown
S
‘1’ ‘1’ ‘1’ ‘1’ ‘1’ ‘1’ ‘1’ ‘1’
S
P
Figure 8-3 shows a possible application circuit where
the independent terminals could be used. Disconnect-
ing the wiper allows the transistor input to be taken to
the Bias voltage level (disconnecting A and or B may
be desired to reduce system current). Disconnecting
Terminal A modifies the transistor input by the RBW
rheostat value to the Common B. Disconnecting
Terminal B modifies the transistor input by the RAW
rheostat value to the Common A. The Common A and
Common B connections could be connected to VDD
Nine bits of ‘1’
Start bit
Start
bit
Stop bit
FIGURE 8-4:
Format.
Software Reset Sequence
The 1st Start bit will cause the device to reset from a
state in which it is expecting to receive data from the
Master Device. In this mode, the device is monitoring
the data bus in Receive mode and can detect the Start
bit forces an internal Reset.
and VSS
.
Common A
The nine bits of ‘1’ are used to force a Reset of those
devices that could not be reset by the previous Start bit.
This occurs only if the MCP45XX/46XX is driving an A
bit on the I2C bus, or is in output mode (from a Read
command) and is driving a data bit of ‘0’ onto the I2C
bus. In both of these cases, the previous Start bit could
not be generated due to the MCP45XX/46XX holding
the bus low. By sending out nine ‘1’ bits, it is ensured
that the device will see a A bit (the Master Device does
not drive the I2C bus low to acknowledge the data sent
by the MCP45XX/46XX), which also forces the
MCP45XX/46XX to reset.
Input
A
To base
of Transistor
(or Amplifier)
W
The 2nd Start bit is sent to address the rare possibility
of an erroneous write. This could occur if the Master
Device was reset while sending a Write command to
the MCP45XX/46XX, AND then as the Master Device
returns to normal operation and issues a Start condition
while the MCP45XX/46XX is issuing an Acknowledge.
In this case, if the 2nd Start bit is not sent (and the Stop
bit was sent) the MCP45XX/46XX could initiate a write
cycle.
B
Input
Common B
Balance
Bias
Example Application Circuit
Note:
The potential for this erroneous write
ONLY occurs if the Master Device is reset
while sending a Write command to the
MCP45XX/46XX.
FIGURE 8-3:
using Terminal Disconnects.
The Stop bit terminates the current I2C bus activity. The
MCP45XX/46XX wait to detect the next Start condition.
8.3
Software Reset Sequence
This sequence does not effect any other I2C devices
which may be on the bus, as they should disregard this
as an invalid command.
Note:
This technique is documented in AN1028.
At times it may become necessary to perform a Soft-
ware Reset Sequence to ensure the MCP45XX/46XX
device is in a correct and known I2C Interface state.
This technique only resets the I2C state machine.
This is useful if the MCP45XX/46XX device powers up
in an incorrect state (due to excessive bus noise, ...), or
if the Master Device is reset during communication.
Figure 8-4 shows the communication sequence to soft-
ware reset the device.
DS22107A-page 68
© 2008 Microchip Technology Inc.
MCP454X/456X/464X/466X
Figure 8-5 shows two I2C bus configurations. In many
8.4
Using the General Call Command
cases, the single I2C bus configuration will be
adequate. For applications that do not want all the
MCP45XX/46XX devices to do General Call support or
have a conflict with General Call commands, the
multiple I2C bus configuration would be used.
The use of the General Call Address Increment, Decre-
ment, or Write commands is analogous to the “Load”
feature (LDAC pin) on some DACs (such as the
MCP4921). This allows all the devices to “Update” the
output level “at the same time”.
For some applications, the ability to update the wiper
values “at the same time may be a requirement, since
they delay from writing to one wiper value and then the
next may cause application issues. A possible example
would be a “tuned” circuit that uses several MCP45XX/
46XX in rheostat configuration. As the system condition
changes (temperature, load, ...) these devices need to
be changed (incremented/decremented) to adjust for
the system change. These changes will either be in the
same direction or in opposite directions. With the
Potentiometer device the customer can either select
the PxB terminals (same direction) or the PxA
terminal(s) (opposite direction).
Single I2C Bus Configuration
Device 1
Device n
Device 3
Host
Controller
Device 4
Device 2
Multiple I2C Bus Configuration
Device 1a
Device na
Device nb
Device 3a
Host
Bus a
Figure 8-6 shows that the update of six devices takes
6*TI2CDLY time in “normal” operation, but only
1*TI2CDLY time in “General Call” operation.
Controller
Device 4a
Device 3b
Device 2a
Note:
The application system may need to
partition the I2C bus into multiple busses to
ensure that the MCP45XX/46XX General
Call commands do not conflict with the
General Call commands that the other I2C
devices may have defined. Also if only a
portion of the MCP45XX/46XX devices are
to require this synchronous operation,
then the devices that should not receive
these commands should be on the second
I2C bus.
Device 1b
Bus b
Device 4b
Device 3n
Device 2b
Device 1n
Device nn
Bus n
Device 4n
Device 2n
2
FIGURE 8-5:
Typical Application I C Bus
Configurations.
Normal Operation
INC
INC
POT02
INC
POT03
INC
POT04
INC
POT05
INC
POT06
POT01
TI2CDLY
TI2CDLY
TI2CDLY
TI2CDLY
TI2CDLY
TI2CDLY
General Call Operation
INC
INC
INC
INC
INC
INC
POTs 01-06 POTs 01-06 POTs 01-06 POTs 01-06 POTs 01-06 POTs 01-06
TI2CDLY
TI2CDLY
TI2CDLY
TI2CDLY
TI2CDLY
TI2CDLY
TI2CDLY = Time from one I2C command completed to completing the next I2C command.
FIGURE 8-6: Example Comparison of “Normal Operation” vs. “General Call Operation” wiper
Updates.
© 2008 Microchip Technology Inc.
DS22107A-page 69
MCP454X/456X/464X/466X
8.5.2
LAYOUT CONSIDERATIONS
8.5
Design Considerations
Inductively-coupled AC transients and digital switching
noise can degrade the input and output signal integrity,
potentially masking the MCP4XXX’s performance.
Careful board layout minimizes these effects and
increases the Signal-to-Noise Ratio (SNR). Multi-layer
In the design of a system with the MCP4XXX devices,
the following considerations should be taken into
account:
• Power Supply Considerations
• Layout Considerations
boards utilizing
a low-inductance ground plane,
isolated inputs, isolated outputs and proper decoupling
are critical to achieving the performance that the silicon
is capable of providing. Particularly harsh environ-
ments may require shielding of critical signals.
8.5.1
POWER SUPPLY
CONSIDERATIONS
The typical application will require a bypass capacitor
in order to filter high-frequency noise, which can be
induced onto the power supply's traces. The bypass
capacitor helps to minimize the effect of these noise
sources on signal integrity. Figure 8-7 illustrates an
appropriate bypass strategy.
If low noise is desired, breadboards and wire-wrapped
boards are not recommended.
8.5.3
RESISTOR TEMPCO
Characterization curves of the resistor temperature
coefficient (Tempco) are shown in Figure 2-10,
Figure 2-21, Figure 2-32, and Figure 2-43.
In this example, the recommended bypass capacitor
value is 0.1 µF. This capacitor should be placed as
close (within 4 mm) to the device power pin (VDD) as
possible.
These curves show that the resistor network is
designed to correct for the change in resistance as
temperature increases. This technique reduces the
end to end change is RAB resistance.
The power source supplying these devices should be
as clean as possible. If the application circuit has
separate digital and analog power supplies, VDD and
VSS should reside on the analog plane.
8.5.4
HIGH VOLTAGE TOLERANT PINS
High Voltage support (VIHH) on the Serial Interface pins
supports user configuration of the Non-Volatile
EEPROM, Write Protect, and WiperLock feature.
VDD
0.1 µF
Note:
In many applications, the High Voltage will
only be present at the manufacturing
stage so as to “lock” the Non-Volatile
wiper value (after calibration) and the con-
tents of the EEPROM. This ensures that
the since High Voltage is not present
under normal operating conditions, that
these values can not be modified.
VDD
0.1 µF
A
W
SCL
SDA
B
VSS
VSS
FIGURE 8-7:
Typical Microcontroller
Connections.
DS22107A-page 70
© 2008 Microchip Technology Inc.
MCP454X/456X/464X/466X
9.0
DEVICE OPTIONS
Additional, custom devices are available. These
devices have weak pull-up resistors on the SDA and
SCL pins. This is useful for applications where the
wiper value is programmed durning manufacture and
not modified by the system during normal operation.
Please contact your local sales office for current infor-
mation and minimum volumn requirements.
9.1
Custom Options
The custom device will have a “P” (for Pull-up) after the
resistance version in the Product Identification System.
These device will not be available through Microchip’s
online Microchip Direct nor Microchip’s Sample sys-
tems.
Example part number:
MCP4641-103PE/ST
© 2008 Microchip Technology Inc.
DS22107A-page 71
MCP454X/456X/464X/466X
NOTES:
DS22107A-page 72
© 2008 Microchip Technology Inc.
MCP454X/456X/464X/466X
10.2 Technical Documentation
10.0 DEVELOPMENT SUPPORT
10.1 Development Tools
Several additional technical documents are available to
assist you in your design and development. These
technical documents include Application Notes,
Technical Briefs, and Design Guides. Table 10-2
shows some of these documents.
Several development tools are available to assist in
your design and evaluation of the MCP45XX/46XX
devices. The currently available tools are shown in
Table 10-1.
These boards may be purchased directly from the
Microchip web site at www.microchip.com.
TABLE 10-1: DEVELOPMENT TOOLS
Board Name
Part #
Supported Devices
MCP42XX PICTail Plus Daughter Board (2)
MCP42XXDM-PTPLS MCP42XX
MCP4XXX Digital Potentiometer Daughter Board (1) MCP4XXXDM-DB
MCP42XXX, MCP42XX, MCP46XX,
MCP4021, and MCP4011
8-pin SOIC/MSOP/TSSOP/DIP Evaluation Board
14-pin SOIC/MSOP/DIP Evaluation Board
SOIC8EV
Any 8-pin device in DIP, SOIC,
MSOP, or TSSOP package
SOIC14EV
Any 14-pin device in DIP, SOIC, or
MSOP package
Note 1: Requires the use of a PICDEM Demo Board (see User’s Guide for details)
2: Requires the use of the PIC24 Explorer 16 Demo Board (see User’s Guide for details)
3: The desired MCP46XX device (in MSOP package) must be soldered onto the extra board.
TABLE 10-2: TECHNICAL DOCUMENTATION
Application
Title
Literature #
Note Number
AN1080
AN737
AN692
AN691
AN219
—
Understanding Digital Potentiometers Resistor Variations
Using Digital Potentiometers to Design Low Pass Adjustable Filters
Using a Digital Potentiometer to Optimize a Precision Single Supply Photo Detect
Optimizing the Digital Potentiometer in Precision Circuits
Comparing Digital Potentiometers to Mechanical Potentiometers
Digital Potentiometer Design Guide
DS01080
DS00737
DS00692
DS00691
DS00219
DS22017
DS21825
—
Signal Chain Design Guide
© 2008 Microchip Technology Inc.
DS22107A-page 73
MCP454X/456X/464X/466X
NOTES:
DS22107A-page 74
© 2008 Microchip Technology Inc.
MCP454X/456X/464X/466X
11.0 PACKAGING INFORMATION
11.1 Package Marking Information
8-Lead DFN (3x3)
Example:
Part Number
Code
Part Number
Code
MCP4541-502E/MF
DACJ
DACK
DACM
DACL
DADB
DADC
DADE
DADD
MCP4542-502E/MF
MCP4542-103E/MF
MCP4542-104E/MF
MCP4542-503E/MF
MCP4562-502E/MF
MCP4562-103E/MF
MCP4562-104E/MF
MCP4562-503E/MF
DACP
DACQ
DACS
DACR
DADF
DADG
DADJ
DADH
XXXX
XYWW
NNN
DACJ
E841
256
MCP4541-103E/MF
MCP4541-104E/MF
MCP4541-503E/MF
MCP4561-502E/MF
MCP4561-103E/MF
MCP4561-104E/MF
MCP4561-503E/MF
8-Lead MSOP
Example
Part Number
Code
Part Number
Code
MCP4541-103E/MS 454113 MCP4542-103E/MS 454213
MCP4541-104E/MS 454114 MCP4542-104E/MS 454214
MCP4541-502E/MS 454152 MCP4542-502E/MS 454252
MCP4541-503E/MS 454153 MCP4542-503E/MS 454253
MCP4561-103E/MS 456113 MCP4562-103E/MS 456213
MCP4561-104E/MS 456114 MCP4562-104E/MS 456214
MCP4561-502E/MS 456152 MCP4562-502E/MS 456252
MCP4561-503E/MS 456153 MCP4562-503E/MS 456253
XXXXXX
YWWNNN
454113
841256
Legend: XX...X Customer-specific information
Y
Year code (last digit of calendar year)
YY
WW
NNN
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
e
3
Pb-free JEDEC designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator (
can be found on the outer packaging for this package.
*
)
3
e
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
© 2008 Microchip Technology Inc.
DS22107A-page 75
MCP454X/456X/464X/466X
Package Marking Information (Continued)
10-Lead DFN (3x3)
Example:
AAFA
Part Number
Code
Part Number
Code
XXXX
YYWW
NNN
MCP4642-502E/MF
MCP4642-103E/MF
MCP4642-104E/MF
MCP4642-503E/MF
AAFA
AAGA
AAJA
AAHA
MCP4662-502E/MF
MCP4662-103E/MF
MCP4662-104E/MF
MCP4662-503E/MF
AAQA
AARA
AATA
AASA
0841
256
10-Lead MSOP
Example
Part Number
Code
Part Number
Code
XXXXXX
YWWNNN
463252
841256
MCP4642-502E/UN 464252 MCP4662-502E/UN 466252
MCP4642-103E/UN 464213 MCP4662-103E/UN 466213
MCP4642-104E/UN 464214 MCP4662-104E/UN 466214
MCP4642-503E/UN 464253 MCP4662-503E/UN 466253
14-Lead TSSOP (MCP4641, MCP4661)
Example
4641502E
XXXXXXXX
YYWW
0841
256
NNN
16-Lead QFN (MCP4641, MCP4661)
Example
XXXXX
XXXXXX
XXXXXX
YWWNNN
4641
502
E/ML^
841256
e3
DS22107A-page 76
© 2008 Microchip Technology Inc.
MCP454X/456X/464X/466X
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6ꢁꢝ'
6ꢁ''
M
=
ꢑꢒꢊꢃꢉ%
ꢀꢁ ꢂꢃꢄꢅꢀꢅꢆꢃꢇꢈꢉꢊꢅꢃꢄꢋꢌꢍꢅꢎꢌꢉꢏꢈꢐꢌꢅꢑꢉꢒꢅꢆꢉꢐꢒꢓꢅꢔꢈꢏꢅꢑꢈꢇꢏꢅꢔꢌꢅꢊꢕꢖꢉꢏꢌꢋꢅꢗꢃꢏꢘꢃꢄꢅꢏꢘꢌꢅꢘꢉꢏꢖꢘꢌꢋꢅꢉꢐꢌꢉꢁ
ꢙꢁ ꢂꢉꢖꢚꢉꢛꢌꢅꢑꢉꢒꢅꢘꢉꢆꢌꢅꢕꢄꢌꢅꢕꢐꢅꢑꢕꢐꢌꢅꢌꢍꢜꢕꢇꢌꢋꢅꢏꢃꢌꢅꢔꢉꢐꢇꢅꢉꢏꢅꢌꢄꢋꢇꢁ
ꢝꢁ ꢂꢉꢖꢚꢉꢛꢌꢅꢃꢇꢅꢇꢉꢗꢅꢇꢃꢄꢛꢈꢊꢉꢏꢌꢋꢁ
ꢁ !ꢃꢑꢌꢄꢇꢃꢕꢄꢃꢄꢛꢅꢉꢄꢋꢅꢏꢕꢊꢌꢐꢉꢄꢖꢃꢄꢛꢅꢜꢌꢐꢅ"#$%ꢅ&ꢀ ꢁ'$ꢁ
(#)* (ꢉꢇꢃꢖꢅ!ꢃꢑꢌꢄꢇꢃꢕꢄꢁꢅ+ꢘꢌꢕꢐꢌꢏꢃꢖꢉꢊꢊꢒꢅꢌꢍꢉꢖꢏꢅꢆꢉꢊꢈꢌꢅꢇꢘꢕꢗꢄꢅꢗꢃꢏꢘꢕꢈꢏꢅꢏꢕꢊꢌꢐꢉꢄꢖꢌꢇꢁ
,%-* ,ꢌꢎꢌꢐꢌꢄꢖꢌꢅ!ꢃꢑꢌꢄꢇꢃꢕꢄꢓꢅꢈꢇꢈꢉꢊꢊꢒꢅꢗꢃꢏꢘꢕꢈꢏꢅꢏꢕꢊꢌꢐꢉꢄꢖꢌꢓꢅꢎꢕꢐꢅꢃꢄꢎꢕꢐꢑꢉꢏꢃꢕꢄꢅꢜꢈꢐꢜꢕꢇꢌꢇꢅꢕꢄꢊꢒꢁ
$ꢃꢖꢐꢕꢖꢘꢃꢜ +ꢌꢖꢘꢄꢕꢊꢕꢛꢒ !ꢐꢉꢗꢃꢄꢛ )6 <67ꢙ(
© 2008 Microchip Technology Inc.
DS22107A-page 77
MCP454X/456X/464X/466X
ꢀꢁꢂꢃꢄꢅꢆꢇꢈꢄꢉꢊꢋꢌꢆꢍꢎꢄꢈꢆꢏꢈꢄꢊꢐꢆꢑꢒꢆꢂꢃꢄꢅꢆꢇꢄꢌꢓꢄꢔꢃꢆꢕꢖꢏꢗꢆMꢆꢘꢙꢘꢙꢚꢛꢜꢆ ꢆ!ꢒꢅ"ꢆ#ꢍꢏꢑ$
ꢑꢒꢊꢃ% -ꢕꢐꢅꢏꢘꢌꢅꢑꢕꢇꢏꢅꢖꢈꢐꢐꢌꢄꢏꢅꢜꢉꢖꢚꢉꢛꢌꢅꢋꢐꢉꢗꢃꢄꢛꢇꢓꢅꢜꢊꢌꢉꢇꢌꢅꢇꢌꢌꢅꢏꢘꢌꢅ$ꢃꢖꢐꢕꢖꢘꢃꢜꢅꢂꢉꢖꢚꢉꢛꢃꢄꢛꢅ#ꢜꢌꢖꢃꢎꢃꢖꢉꢏꢃꢕꢄꢅꢊꢕꢖꢉꢏꢌꢋꢅꢉꢏꢅ
ꢘꢏꢏꢜ*..ꢗꢗꢗꢁꢑꢃꢖꢐꢕꢖꢘꢃꢜꢁꢖꢕꢑ.ꢜꢉꢖꢚꢉꢛꢃꢄꢛ
DS22107A-page 78
© 2008 Microchip Technology Inc.
MCP454X/456X/464X/466X
ꢀꢁꢂꢃꢄꢅꢆꢇꢈꢄꢉꢊꢋꢌꢆꢖꢋꢌ&ꢒꢆ' ꢄꢈꢈꢆ(ꢎꢊꢈꢋ)ꢃꢆꢇꢄꢌꢓꢄꢔꢃꢆꢕꢖ'ꢗꢆ#ꢖ'(ꢇ$
ꢑꢒꢊꢃ% -ꢕꢐꢅꢏꢘꢌꢅꢑꢕꢇꢏꢅꢖꢈꢐꢐꢌꢄꢏꢅꢜꢉꢖꢚꢉꢛꢌꢅꢋꢐꢉꢗꢃꢄꢛꢇꢓꢅꢜꢊꢌꢉꢇꢌꢅꢇꢌꢌꢅꢏꢘꢌꢅ$ꢃꢖꢐꢕꢖꢘꢃꢜꢅꢂꢉꢖꢚꢉꢛꢃꢄꢛꢅ#ꢜꢌꢖꢃꢎꢃꢖꢉꢏꢃꢕꢄꢅꢊꢕꢖꢉꢏꢌꢋꢅꢉꢏꢅ
ꢘꢏꢏꢜ*..ꢗꢗꢗꢁꢑꢃꢖꢐꢕꢖꢘꢃꢜꢁꢖꢕꢑ.ꢜꢉꢖꢚꢉꢛꢃꢄꢛ
D
N
E
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NOTE 1
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1
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/ꢄꢃꢏꢇ
$0110$%+%,#
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ꢂꢃꢏꢖꢘ
2
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#ꢏꢉꢄꢋꢕꢎꢎꢅ
3ꢆꢌꢐꢉꢊꢊꢅ:ꢃꢋꢏꢘ
$ꢕꢊꢋꢌꢋꢅꢂꢉꢖꢚꢉꢛꢌꢅ:ꢃꢋꢏꢘ
3ꢆꢌꢐꢉꢊꢊꢅ1ꢌꢄꢛꢏꢘ
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6ꢁ76
1
6ꢁ 6
6ꢁ56
-ꢕꢕꢏꢜꢐꢃꢄꢏ
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1ꢀ
ꢀ
6ꢁ9'ꢅ,%-
M
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1ꢌꢉꢋꢅ+ꢘꢃꢖꢚꢄꢌꢇꢇ
1ꢌꢉꢋꢅ:ꢃꢋꢏꢘ
ꢖ
ꢔ
6ꢁ65
6ꢁꢙꢙ
M
M
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6ꢁ 6
ꢑꢒꢊꢃꢉ%
ꢀꢁ ꢂꢃꢄꢅꢀꢅꢆꢃꢇꢈꢉꢊꢅꢃꢄꢋꢌꢍꢅꢎꢌꢉꢏꢈꢐꢌꢅꢑꢉꢒꢅꢆꢉꢐꢒꢓꢅꢔꢈꢏꢅꢑꢈꢇꢏꢅꢔꢌꢅꢊꢕꢖꢉꢏꢌꢋꢅꢗꢃꢏꢘꢃꢄꢅꢏꢘꢌꢅꢘꢉꢏꢖꢘꢌꢋꢅꢉꢐꢌꢉꢁ
ꢙꢁ !ꢃꢑꢌꢄꢇꢃꢕꢄꢇꢅ!ꢅꢉꢄꢋꢅ%ꢀꢅꢋꢕꢅꢄꢕꢏꢅꢃꢄꢖꢊꢈꢋꢌꢅꢑꢕꢊꢋꢅꢎꢊꢉꢇꢘꢅꢕꢐꢅꢜꢐꢕꢏꢐꢈꢇꢃꢕꢄꢇꢁꢅ$ꢕꢊꢋꢅꢎꢊꢉꢇꢘꢅꢕꢐꢅꢜꢐꢕꢏꢐꢈꢇꢃꢕꢄꢇꢅꢇꢘꢉꢊꢊꢅꢄꢕꢏꢅꢌꢍꢖꢌꢌꢋꢅ6ꢁꢀ'ꢅꢑꢑꢅꢜꢌꢐꢅꢇꢃꢋꢌꢁ
ꢝꢁ !ꢃꢑꢌꢄꢇꢃꢕꢄꢃꢄꢛꢅꢉꢄꢋꢅꢏꢕꢊꢌꢐꢉꢄꢖꢃꢄꢛꢅꢜꢌꢐꢅ"#$%ꢅ&ꢀ ꢁ'$ꢁ
(#)* (ꢉꢇꢃꢖꢅ!ꢃꢑꢌꢄꢇꢃꢕꢄꢁꢅ+ꢘꢌꢕꢐꢌꢏꢃꢖꢉꢊꢊꢒꢅꢌꢍꢉꢖꢏꢅꢆꢉꢊꢈꢌꢅꢇꢘꢕꢗꢄꢅꢗꢃꢏꢘꢕꢈꢏꢅꢏꢕꢊꢌꢐꢉꢄꢖꢌꢇꢁ
,%-* ,ꢌꢎꢌꢐꢌꢄꢖꢌꢅ!ꢃꢑꢌꢄꢇꢃꢕꢄꢓꢅꢈꢇꢈꢉꢊꢊꢒꢅꢗꢃꢏꢘꢕꢈꢏꢅꢏꢕꢊꢌꢐꢉꢄꢖꢌꢓꢅꢎꢕꢐꢅꢃꢄꢎꢕꢐꢑꢉꢏꢃꢕꢄꢅꢜꢈꢐꢜꢕꢇꢌꢇꢅꢕꢄꢊꢒꢁ
$ꢃꢖꢐꢕꢖꢘꢃꢜ +ꢌꢖꢘꢄꢕꢊꢕꢛꢒ !ꢐꢉꢗꢃꢄꢛ )6 <ꢀꢀꢀ(
© 2008 Microchip Technology Inc.
DS22107A-page 79
MCP454X/456X/464X/466X
*ꢚꢁꢂꢃꢄꢅꢆꢇꢈꢄꢉꢊꢋꢌꢆꢍꢎꢄꢈꢆꢏꢈꢄꢊꢐꢆꢑꢒꢆꢂꢃꢄꢅꢆꢇꢄꢌꢓꢄꢔꢃꢆꢕꢖꢏꢗꢆMꢆꢘꢙꢘꢙꢚꢛꢜꢆ ꢆ!ꢒꢅ"ꢆ#ꢍꢏꢑ$
ꢑꢒꢊꢃ% -ꢕꢐꢅꢏꢘꢌꢅꢑꢕꢇꢏꢅꢖꢈꢐꢐꢌꢄꢏꢅꢜꢉꢖꢚꢉꢛꢌꢅꢋꢐꢉꢗꢃꢄꢛꢇꢓꢅꢜꢊꢌꢉꢇꢌꢅꢇꢌꢌꢅꢏꢘꢌꢅ$ꢃꢖꢐꢕꢖꢘꢃꢜꢅꢂꢉꢖꢚꢉꢛꢃꢄꢛꢅ#ꢜꢌꢖꢃꢎꢃꢖꢉꢏꢃꢕꢄꢅꢊꢕꢖꢉꢏꢌꢋꢅꢉꢏꢅ
ꢘꢏꢏꢜ*..ꢗꢗꢗꢁꢑꢃꢖꢐꢕꢖꢘꢃꢜꢁꢖꢕꢑ.ꢜꢉꢖꢚꢉꢛꢃꢄꢛ
D
e
b
N
N
L
K
E
E2
EXPOSED
PAD
NOTE 1
NOTE 1
2
1
1
2
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TOP VIEW
A
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/ꢄꢃꢏꢇ
$0110$%+%,#
!ꢃꢑꢌꢄꢇꢃꢕꢄꢅ1ꢃꢑꢃꢏꢇ
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23$
ꢀ6
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6ꢁ96
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2ꢈꢑꢔꢌꢐꢅꢕꢎꢅꢂꢃꢄꢇ
ꢂꢃꢏꢖꢘ
3ꢆꢌꢐꢉꢊꢊꢅ8ꢌꢃꢛꢘꢏ
#ꢏꢉꢄꢋꢕꢎꢎꢅ
)ꢕꢄꢏꢉꢖꢏꢅ+ꢘꢃꢖꢚꢄꢌꢇꢇ
3ꢆꢌꢐꢉꢊꢊꢅ1ꢌꢄꢛꢏꢘ
%ꢍꢜꢕꢇꢌꢋꢅꢂꢉꢋꢅ1ꢌꢄꢛꢏꢘ
3ꢆꢌꢐꢉꢊꢊꢅ:ꢃꢋꢏꢘ
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)ꢕꢄꢏꢉꢖꢏꢅ:ꢃꢋꢏꢘ
)ꢕꢄꢏꢉꢖꢏꢅ1ꢌꢄꢛꢏꢘ
)ꢕꢄꢏꢉꢖꢏ<ꢏꢕ<%ꢍꢜꢕꢇꢌꢋꢅꢂꢉꢋ
%ꢙ
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M
=
ꢑꢒꢊꢃꢉ%
ꢀꢁ ꢂꢃꢄꢅꢀꢅꢆꢃꢇꢈꢉꢊꢅꢃꢄꢋꢌꢍꢅꢎꢌꢉꢏꢈꢐꢌꢅꢑꢉꢒꢅꢆꢉꢐꢒꢓꢅꢔꢈꢏꢅꢑꢈꢇꢏꢅꢔꢌꢅꢊꢕꢖꢉꢏꢌꢋꢅꢗꢃꢏꢘꢃꢄꢅꢏꢘꢌꢅꢘꢉꢏꢖꢘꢌꢋꢅꢉꢐꢌꢉꢁ
ꢙꢁ ꢂꢉꢖꢚꢉꢛꢌꢅꢑꢉꢒꢅꢘꢉꢆꢌꢅꢕꢄꢌꢅꢕꢐꢅꢑꢕꢐꢌꢅꢌꢍꢜꢕꢇꢌꢋꢅꢏꢃꢌꢅꢔꢉꢐꢇꢅꢉꢏꢅꢌꢄꢋꢇꢁ
ꢝꢁ ꢂꢉꢖꢚꢉꢛꢌꢅꢃꢇꢅꢇꢉꢗꢅꢇꢃꢄꢛꢈꢊꢉꢏꢌꢋꢁ
ꢁ !ꢃꢑꢌꢄꢇꢃꢕꢄꢃꢄꢛꢅꢉꢄꢋꢅꢏꢕꢊꢌꢐꢉꢄꢖꢃꢄꢛꢅꢜꢌꢐꢅ"#$%ꢅ&ꢀ ꢁ'$ꢁ
(#)* (ꢉꢇꢃꢖꢅ!ꢃꢑꢌꢄꢇꢃꢕꢄꢁꢅ+ꢘꢌꢕꢐꢌꢏꢃꢖꢉꢊꢊꢒꢅꢌꢍꢉꢖꢏꢅꢆꢉꢊꢈꢌꢅꢇꢘꢕꢗꢄꢅꢗꢃꢏꢘꢕꢈꢏꢅꢏꢕꢊꢌꢐꢉꢄꢖꢌꢇꢁ
,%-* ,ꢌꢎꢌꢐꢌꢄꢖꢌꢅ!ꢃꢑꢌꢄꢇꢃꢕꢄꢓꢅꢈꢇꢈꢉꢊꢊꢒꢅꢗꢃꢏꢘꢕꢈꢏꢅꢏꢕꢊꢌꢐꢉꢄꢖꢌꢓꢅꢎꢕꢐꢅꢃꢄꢎꢕꢐꢑꢉꢏꢃꢕꢄꢅꢜꢈꢐꢜꢕꢇꢌꢇꢅꢕꢄꢊꢒꢁ
$ꢃꢖꢐꢕꢖꢘꢃꢜ +ꢌꢖꢘꢄꢕꢊꢕꢛꢒ !ꢐꢉꢗꢃꢄꢛ )6 <67ꢝ(
DS22107A-page 80
© 2008 Microchip Technology Inc.
MCP454X/456X/464X/466X
*ꢚꢁꢂꢃꢄꢅꢆꢇꢈꢄꢉꢊꢋꢌꢆꢍꢎꢄꢈꢆꢏꢈꢄꢊꢐꢆꢑꢒꢆꢂꢃꢄꢅꢆꢇꢄꢌꢓꢄꢔꢃꢆꢕꢖꢏꢗꢆMꢆꢘꢙꢘꢙꢚꢛꢜꢆ ꢆ!ꢒꢅ"ꢆ#ꢍꢏꢑ$
ꢑꢒꢊꢃ% -ꢕꢐꢅꢏꢘꢌꢅꢑꢕꢇꢏꢅꢖꢈꢐꢐꢌꢄꢏꢅꢜꢉꢖꢚꢉꢛꢌꢅꢋꢐꢉꢗꢃꢄꢛꢇꢓꢅꢜꢊꢌꢉꢇꢌꢅꢇꢌꢌꢅꢏꢘꢌꢅ$ꢃꢖꢐꢕꢖꢘꢃꢜꢅꢂꢉꢖꢚꢉꢛꢃꢄꢛꢅ#ꢜꢌꢖꢃꢎꢃꢖꢉꢏꢃꢕꢄꢅꢊꢕꢖꢉꢏꢌꢋꢅꢉꢏꢅ
ꢘꢏꢏꢜ*..ꢗꢗꢗꢁꢑꢃꢖꢐꢕꢖꢘꢃꢜꢁꢖꢕꢑ.ꢜꢉꢖꢚꢉꢛꢃꢄꢛ
© 2008 Microchip Technology Inc.
DS22107A-page 81
MCP454X/456X/464X/466X
*ꢚꢁꢂꢃꢄꢅꢆꢇꢈꢄꢉꢊꢋꢌꢆꢖꢋꢌ&ꢒꢆ' ꢄꢈꢈꢆ(ꢎꢊꢈꢋ)ꢃꢆꢇꢄꢌꢓꢄꢔꢃꢆꢕ+ꢑꢗꢆ#ꢖ'(ꢇ$
ꢑꢒꢊꢃ% -ꢕꢐꢅꢏꢘꢌꢅꢑꢕꢇꢏꢅꢖꢈꢐꢐꢌꢄꢏꢅꢜꢉꢖꢚꢉꢛꢌꢅꢋꢐꢉꢗꢃꢄꢛꢇꢓꢅꢜꢊꢌꢉꢇꢌꢅꢇꢌꢌꢅꢏꢘꢌꢅ$ꢃꢖꢐꢕꢖꢘꢃꢜꢅꢂꢉꢖꢚꢉꢛꢃꢄꢛꢅ#ꢜꢌꢖꢃꢎꢃꢖꢉꢏꢃꢕꢄꢅꢊꢕꢖꢉꢏꢌꢋꢅꢉꢏꢅ
ꢘꢏꢏꢜ*..ꢗꢗꢗꢁꢑꢃꢖꢐꢕꢖꢘꢃꢜꢁꢖꢕꢑ.ꢜꢉꢖꢚꢉꢛꢃꢄꢛ
D
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NOTE 1
1
2
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A2
φ
L
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L1
/ꢄꢃꢏꢇ
$0110$%+%,#
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ꢂꢃꢏꢖꢘ
2
ꢌ
ꢀ6
6ꢁ'6ꢅ(#)
3ꢆꢌꢐꢉꢊꢊꢅ8ꢌꢃꢛꢘꢏ
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#ꢏꢉꢄꢋꢕꢎꢎꢅ
3ꢆꢌꢐꢉꢊꢊꢅ:ꢃꢋꢏꢘ
$ꢕꢊꢋꢌꢋꢅꢂꢉꢖꢚꢉꢛꢌꢅ:ꢃꢋꢏꢘ
3ꢆꢌꢐꢉꢊꢊꢅ1ꢌꢄꢛꢏꢘ
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ꢝꢁ66ꢅ(#)
ꢝꢁ66ꢅ(#)
6ꢁ76
1
6ꢁ 6
6ꢁ56
-ꢕꢕꢏꢜꢐꢃꢄꢏ
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1ꢀ
ꢀ
6ꢁ9'ꢅ,%-
M
6ꢞ
5ꢞ
1ꢌꢉꢋꢅ+ꢘꢃꢖꢚꢄꢌꢇꢇ
1ꢌꢉꢋꢅ:ꢃꢋꢏꢘ
ꢖ
ꢔ
6ꢁ65
6ꢁꢀ'
M
M
6ꢁꢙꢝ
6ꢁꢝꢝ
ꢑꢒꢊꢃꢉ%
ꢀꢁ ꢂꢃꢄꢅꢀꢅꢆꢃꢇꢈꢉꢊꢅꢃꢄꢋꢌꢍꢅꢎꢌꢉꢏꢈꢐꢌꢅꢑꢉꢒꢅꢆꢉꢐꢒꢓꢅꢔꢈꢏꢅꢑꢈꢇꢏꢅꢔꢌꢅꢊꢕꢖꢉꢏꢌꢋꢅꢗꢃꢏꢘꢃꢄꢅꢏꢘꢌꢅꢘꢉꢏꢖꢘꢌꢋꢅꢉꢐꢌꢉꢁ
ꢙꢁ !ꢃꢑꢌꢄꢇꢃꢕꢄꢇꢅ!ꢅꢉꢄꢋꢅ%ꢀꢅꢋꢕꢅꢄꢕꢏꢅꢃꢄꢖꢊꢈꢋꢌꢅꢑꢕꢊꢋꢅꢎꢊꢉꢇꢘꢅꢕꢐꢅꢜꢐꢕꢏꢐꢈꢇꢃꢕꢄꢇꢁꢅ$ꢕꢊꢋꢅꢎꢊꢉꢇꢘꢅꢕꢐꢅꢜꢐꢕꢏꢐꢈꢇꢃꢕꢄꢇꢅꢇꢘꢉꢊꢊꢅꢄꢕꢏꢅꢌꢍꢖꢌꢌꢋꢅ6ꢁꢀ'ꢅꢑꢑꢅꢜꢌꢐꢅꢇꢃꢋꢌꢁ
ꢝꢁ !ꢃꢑꢌꢄꢇꢃꢕꢄꢃꢄꢛꢅꢉꢄꢋꢅꢏꢕꢊꢌꢐꢉꢄꢖꢃꢄꢛꢅꢜꢌꢐꢅ"#$%ꢅ&ꢀ ꢁ'$ꢁ
(#)* (ꢉꢇꢃꢖꢅ!ꢃꢑꢌꢄꢇꢃꢕꢄꢁꢅ+ꢘꢌꢕꢐꢌꢏꢃꢖꢉꢊꢊꢒꢅꢌꢍꢉꢖꢏꢅꢆꢉꢊꢈꢌꢅꢇꢘꢕꢗꢄꢅꢗꢃꢏꢘꢕꢈꢏꢅꢏꢕꢊꢌꢐꢉꢄꢖꢌꢇꢁ
,%-* ,ꢌꢎꢌꢐꢌꢄꢖꢌꢅ!ꢃꢑꢌꢄꢇꢃꢕꢄꢓꢅꢈꢇꢈꢉꢊꢊꢒꢅꢗꢃꢏꢘꢕꢈꢏꢅꢏꢕꢊꢌꢐꢉꢄꢖꢌꢓꢅꢎꢕꢐꢅꢃꢄꢎꢕꢐꢑꢉꢏꢃꢕꢄꢅꢜꢈꢐꢜꢕꢇꢌꢇꢅꢕꢄꢊꢒꢁ
$ꢃꢖꢐꢕꢖꢘꢃꢜ +ꢌꢖꢘꢄꢕꢊꢕꢛꢒ !ꢐꢉꢗꢃꢄꢛ )6 <6ꢙꢀ(
DS22107A-page 82
© 2008 Microchip Technology Inc.
MCP454X/456X/464X/466X
*,ꢁꢂꢃꢄꢅꢆꢇꢈꢄꢉꢊꢋꢌꢆ-.ꢋ)ꢆ'.&ꢋ)ꢓꢆ' ꢄꢈꢈꢆ(ꢎꢊꢈꢋ)ꢃꢆꢕ'-ꢗꢆMꢆ,ꢛ,ꢆ ꢆ!ꢒꢅ"ꢆ#-''(ꢇ$
ꢑꢒꢊꢃ% -ꢕꢐꢅꢏꢘꢌꢅꢑꢕꢇꢏꢅꢖꢈꢐꢐꢌꢄꢏꢅꢜꢉꢖꢚꢉꢛꢌꢅꢋꢐꢉꢗꢃꢄꢛꢇꢓꢅꢜꢊꢌꢉꢇꢌꢅꢇꢌꢌꢅꢏꢘꢌꢅ$ꢃꢖꢐꢕꢖꢘꢃꢜꢅꢂꢉꢖꢚꢉꢛꢃꢄꢛꢅ#ꢜꢌꢖꢃꢎꢃꢖꢉꢏꢃꢕꢄꢅꢊꢕꢖꢉꢏꢌꢋꢅꢉꢏꢅ
ꢘꢏꢏꢜ*..ꢗꢗꢗꢁꢑꢃꢖꢐꢕꢖꢘꢃꢜꢁꢖꢕꢑ.ꢜꢉꢖꢚꢉꢛꢃꢄꢛ
D
N
E
E1
NOTE 1
1
2
e
b
c
φ
A2
A
A1
L
L1
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$0110$%+%,#
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23$
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2ꢈꢑꢔꢌꢐꢅꢕꢎꢅꢂꢃꢄꢇ
ꢂꢃꢏꢖꢘ
2
ꢌ
ꢀ
6ꢁ7'ꢅ(#)
3ꢆꢌꢐꢉꢊꢊꢅ8ꢌꢃꢛꢘꢏ
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#ꢏꢉꢄꢋꢕꢎꢎꢅ
3ꢆꢌꢐꢉꢊꢊꢅ:ꢃꢋꢏꢘ
$ꢕꢊꢋꢌꢋꢅꢂꢉꢖꢚꢉꢛꢌꢅ:ꢃꢋꢏꢘ
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1ꢌꢉꢋꢅ:ꢃꢋꢏꢘ
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6ꢁ69
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M
M
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6ꢁꢙ6
6ꢁꢝ6
ꢑꢒꢊꢃꢉ%
ꢀꢁ ꢂꢃꢄꢅꢀꢅꢆꢃꢇꢈꢉꢊꢅꢃꢄꢋꢌꢍꢅꢎꢌꢉꢏꢈꢐꢌꢅꢑꢉꢒꢅꢆꢉꢐꢒꢓꢅꢔꢈꢏꢅꢑꢈꢇꢏꢅꢔꢌꢅꢊꢕꢖꢉꢏꢌꢋꢅꢗꢃꢏꢘꢃꢄꢅꢏꢘꢌꢅꢘꢉꢏꢖꢘꢌꢋꢅꢉꢐꢌꢉꢁ
ꢙꢁ !ꢃꢑꢌꢄꢇꢃꢕꢄꢇꢅ!ꢅꢉꢄꢋꢅ%ꢀꢅꢋꢕꢅꢄꢕꢏꢅꢃꢄꢖꢊꢈꢋꢌꢅꢑꢕꢊꢋꢅꢎꢊꢉꢇꢘꢅꢕꢐꢅꢜꢐꢕꢏꢐꢈꢇꢃꢕꢄꢇꢁꢅ$ꢕꢊꢋꢅꢎꢊꢉꢇꢘꢅꢕꢐꢅꢜꢐꢕꢏꢐꢈꢇꢃꢕꢄꢇꢅꢇꢘꢉꢊꢊꢅꢄꢕꢏꢅꢌꢍꢖꢌꢌꢋꢅ6ꢁꢀ'ꢅꢑꢑꢅꢜꢌꢐꢅꢇꢃꢋꢌꢁ
ꢝꢁ !ꢃꢑꢌꢄꢇꢃꢕꢄꢃꢄꢛꢅꢉꢄꢋꢅꢏꢕꢊꢌꢐꢉꢄꢖꢃꢄꢛꢅꢜꢌꢐꢅ"#$%ꢅ&ꢀ ꢁ'$ꢁ
(#)* (ꢉꢇꢃꢖꢅ!ꢃꢑꢌꢄꢇꢃꢕꢄꢁꢅ+ꢘꢌꢕꢐꢌꢏꢃꢖꢉꢊꢊꢒꢅꢌꢍꢉꢖꢏꢅꢆꢉꢊꢈꢌꢅꢇꢘꢕꢗꢄꢅꢗꢃꢏꢘꢕꢈꢏꢅꢏꢕꢊꢌꢐꢉꢄꢖꢌꢇꢁ
,%-* ,ꢌꢎꢌꢐꢌꢄꢖꢌꢅ!ꢃꢑꢌꢄꢇꢃꢕꢄꢓꢅꢈꢇꢈꢉꢊꢊꢒꢅꢗꢃꢏꢘꢕꢈꢏꢅꢏꢕꢊꢌꢐꢉꢄꢖꢌꢓꢅꢎꢕꢐꢅꢃꢄꢎꢕꢐꢑꢉꢏꢃꢕꢄꢅꢜꢈꢐꢜꢕꢇꢌꢇꢅꢕꢄꢊꢒꢁ
$ꢃꢖꢐꢕꢖꢘꢃꢜ +ꢌꢖꢘꢄꢕꢊꢕꢛꢒ !ꢐꢉꢗꢃꢄꢛ )6 <65>(
© 2008 Microchip Technology Inc.
DS22107A-page 83
MCP454X/456X/464X/466X
*/ꢁꢂꢃꢄꢅꢆꢇꢈꢄꢉꢊꢋꢌꢆ0ꢎꢄꢅꢆꢏꢈꢄꢊꢐꢆꢑꢒꢆꢂꢃꢄꢅꢆꢇꢄꢌꢓꢄꢔꢃꢆꢕꢖꢂꢗꢆMꢆ,ꢙ,ꢙꢚꢛꢜꢆ ꢆ!ꢒꢅ"ꢆ#0ꢏꢑ$
ꢑꢒꢊꢃ% -ꢕꢐꢅꢏꢘꢌꢅꢑꢕꢇꢏꢅꢖꢈꢐꢐꢌꢄꢏꢅꢜꢉꢖꢚꢉꢛꢌꢅꢋꢐꢉꢗꢃꢄꢛꢇꢓꢅꢜꢊꢌꢉꢇꢌꢅꢇꢌꢌꢅꢏꢘꢌꢅ$ꢃꢖꢐꢕꢖꢘꢃꢜꢅꢂꢉꢖꢚꢉꢛꢃꢄꢛꢅ#ꢜꢌꢖꢃꢎꢃꢖꢉꢏꢃꢕꢄꢅꢊꢕꢖꢉꢏꢌꢋꢅꢉꢏꢅ
ꢘꢏꢏꢜ*..ꢗꢗꢗꢁꢑꢃꢖꢐꢕꢖꢘꢃꢜꢁꢖꢕꢑ.ꢜꢉꢖꢚꢉꢛꢃꢄꢛ
D
D2
EXPOSED
PAD
e
E
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2
1
2
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1
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BOTTOM VIEW
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2ꢈꢑꢔꢌꢐꢅꢕꢎꢅꢂꢃꢄꢇ
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=
ꢑꢒꢊꢃꢉ%
ꢀꢁ ꢂꢃꢄꢅꢀꢅꢆꢃꢇꢈꢉꢊꢅꢃꢄꢋꢌꢍꢅꢎꢌꢉꢏꢈꢐꢌꢅꢑꢉꢒꢅꢆꢉꢐꢒꢓꢅꢔꢈꢏꢅꢑꢈꢇꢏꢅꢔꢌꢅꢊꢕꢖꢉꢏꢌꢋꢅꢗꢃꢏꢘꢃꢄꢅꢏꢘꢌꢅꢘꢉꢏꢖꢘꢌꢋꢅꢉꢐꢌꢉꢁ
ꢙꢁ ꢂꢉꢖꢚꢉꢛꢌꢅꢃꢇꢅꢇꢉꢗꢅꢇꢃꢄꢛꢈꢊꢉꢏꢌꢋꢁ
ꢝꢁ !ꢃꢑꢌꢄꢇꢃꢕꢄꢃꢄꢛꢅꢉꢄꢋꢅꢏꢕꢊꢌꢐꢉꢄꢖꢃꢄꢛꢅꢜꢌꢐꢅ"#$%ꢅ&ꢀ ꢁ'$ꢁ
(#)* (ꢉꢇꢃꢖꢅ!ꢃꢑꢌꢄꢇꢃꢕꢄꢁꢅ+ꢘꢌꢕꢐꢌꢏꢃꢖꢉꢊꢊꢒꢅꢌꢍꢉꢖꢏꢅꢆꢉꢊꢈꢌꢅꢇꢘꢕꢗꢄꢅꢗꢃꢏꢘꢕꢈꢏꢅꢏꢕꢊꢌꢐꢉꢄꢖꢌꢇꢁ
,%-* ,ꢌꢎꢌꢐꢌꢄꢖꢌꢅ!ꢃꢑꢌꢄꢇꢃꢕꢄꢓꢅꢈꢇꢈꢉꢊꢊꢒꢅꢗꢃꢏꢘꢕꢈꢏꢅꢏꢕꢊꢌꢐꢉꢄꢖꢌꢓꢅꢎꢕꢐꢅꢃꢄꢎꢕꢐꢑꢉꢏꢃꢕꢄꢅꢜꢈꢐꢜꢕꢇꢌꢇꢅꢕꢄꢊꢒꢁ
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DS22107A-page 84
© 2008 Microchip Technology Inc.
MCP454X/456X/464X/466X
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© 2008 Microchip Technology Inc.
DS22107A-page 85
MCP454X/456X/464X/466X
NOTES:
DS22107A-page 86
© 2008 Microchip Technology Inc.
MCP454X/456X/464X/466X
APPENDIX A: REVISION HISTORY
Revision A (November 2008)
• Original Release of this Document.
© 2008 Microchip Technology Inc.
DS22107A-page 87
MCP454X/456X/464X/466X
NOTES:
DS22107A-page 88
© 2008 Microchip Technology Inc.
MCP454X/456X/464X/466X
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
Examples:
PART NO.
Device
XXX
X
/XX
a)
b)
c)
d)
e)
MCP4541-502E/XX: 5 kΩ, 8LD Device
Resistance Temperature Package
Version Range
MCP4541-103E/XX: 10 kΩ, 8-LD Device
MCP4541-503E/XX: 50 kΩ, 8LD Device
MCP4541-104E/XX: 100 kΩ, 8LD Device
MCP4541T-104E/XX: T/R, 100 kΩ, 8LD Device
Device:
MCP4541:
MCP4541T:
Single Non-Volatile 7-bit Potentiometer
Single Non-Volatile 7-bit Potentiometer
(Tape and Reel)
Single Non-Volatile 7-bit Rheostat
Single Non-Volatile 7-bit Rheostat
(Tape and Reel)
Single Non-Volatile 8-bit Potentiometer
Single Non-Volatile 8-bit Potentiometer
(Tape and Reel)
Single Non-Volatile8-bit Rheostat
Single Non-Volatile 8-bit Rheostat
(Tape and Reel)
Dual Non-Volatile 7-bit Potentiometer
Dual Non-Volatile 7-bit Potentiometer
(Tape and Reel)
Dual Non-Volatile 7-bit Rheostat
Dual Non-Volatile 7-bit Rheostat
(Tape and Reel)
Dual Non-Volatile 8-bit Potentiometer
Dual Non-Volatile 8-bit Potentiometer
(Tape and Reel)
Dual Non-Volatile8-bit Rheostat
Dual Non-Volatile 8-bit Rheostat
(Tape and Reel)
a)
b)
c)
d)
e)
MCP4542-502E/XX: 5 kΩ, 8LD Device
MCP4542-103E/XX: 10 kΩ, 8-LD Device
MCP4542-503E/XX: 50 kΩ, 8LD Device
MCP4542-104E/XX: 100 kΩ, 8LD Device
MCP4542T-104E/XX: T/R, 100 kΩ, 8LD Device
MCP4542:
MCP4542T:
a)
b)
c)
d)
e)
MCP4561-502E/XX: 5 kΩ, 8LD Device
MCP4561-103E/XX: 10 kΩ, 8-LD Device
MCP4561-503E/XX: 50 kΩ, 8LD Device
MCP4561-104E/XX: 100 kΩ, 8LD Device
MCP4561T-104E/XX: T/R, 100 kΩ, 8LD Device
MCP4561:
MCP4561T:
MCP4562:
MCP4562T:
a)
b)
c)
d)
e)
MCP4562-502E/XX: 5 kΩ, 8LD Device
MCP4562-103E/XX: 10 kΩ, 8-LD Device
MCP4562-503E/XX: 50 kΩ, 8LD Device
MCP4562-104E/XX: 100 kΩ, 8LD Device
MCP4562T-104E/XX: T/R, 100 kΩ, 8LD Device
MCP4641:
MCP4641T:
MCP4642:
MCP4642T:
a)
b)
c)
d)
e)
MCP4641-502E/XX: 5 kΩ, 8LD Device
MCP4641-103E/XX: 10 kΩ, 8-LD Device
MCP4641-503E/XX: 50 kΩ, 8LD Device
MCP4641-104E/XX: 100 kΩ, 8LD Device
MCP4641T-104E/XX: T/R, 100 kΩ, 8LD Device
MCP4661:
MCP4661T:
MCP4662:
MCP4662T:
a)
b)
c)
d)
e)
MCP4642-502E/XX: 5 kΩ, 8LD Device
MCP4642-103E/XX: 10 kΩ, 8-LD Device
MCP4642-503E/XX: 50 kΩ, 8LD Device
MCP4642-104E/XX: 100 kΩ, 8LD Device
MCP4642T-104E/XX: T/R, 100 kΩ, 8LD Device
Resistance Version:
502 = 5 kΩ
103 = 10 kΩ
503 = 50 kΩ
104 = 100 kΩ
a)
b)
c)
d)
e)
MCP4661-502E/XX: 5 kΩ, 8LD Device
MCP4661-103E/XX: 10 kΩ, 8-LD Device
MCP4661-503E/XX: 50 kΩ, 8LD Device
MCP4661-104E/XX: 100 kΩ, 8LD Device
MCP4661T-104E/XX: T/R, 100 kΩ, 8LD Device
Temperature Range:
Package:
E
=
-40°C to +125°C
a)
b)
c)
d)
e)
MCP4662-502E/XX: 5 kΩ, 8LD Device
MCP4662-103E/XX: 10 kΩ, 8-LD Device
MCP4662-503E/XX: 50 kΩ, 8LD Device
MCP4662-104E/XX: 100 kΩ, 8LD Device
MCP4662T-104E/XX: T/R, 100 kΩ, 8LD Device
MF
ML
MS
ST
=
=
=
=
=
Plastic Dual Flat No-lead (3x3 DFN), 8/10-lead
Plastic Quad Flat No-lead (QFN), 16-lead
Plastic Micro Small Outline (MSOP), 8-lead
Plastic Thin Shrink Small Outline (TSSOP), 14-lead
Plastic Micro Small Outline (MSOP), 10-lead
UN
XX
=
=
=
=
=
MF for 8/10-lead 3x3 DFN
ML for 16-lead QFN
MS for 8-lead MSOP
ST for 14-lead TSSOP
UN for 10-lead MSOP
© 2008 Microchip Technology Inc.
DS22107A-page 89
MCP454X/456X/464X/466X
NOTES:
DS22107A-page 90
© 2008 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, Accuron,
dsPIC, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro,
PICSTART, rfPIC, SmartShunt and UNI/O are registered
trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
FilterLab, Linear Active Thermistor, MXDEV, MXLAB,
SEEVAL, SmartSensor and The Embedded Control Solutions
Company are registered trademarks of Microchip Technology
Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, CodeGuard,
dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONITOR, FanSense, In-Circuit Serial
Programming, ICSP, ICEPIC, Mindi, MiWi, MPASM, MPLAB
Certified logo, MPLIB, MPLINK, mTouch, PICkit, PICDEM,
PICDEM.net, PICtail, PIC32 logo, PowerCal, PowerInfo,
PowerMate, PowerTool, REAL ICE, rfLAB, Select Mode, Total
Endurance, WiperLock and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2008, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received ISO/TS-16949:2002 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
© 2008 Microchip Technology Inc.
DS22107A-page 91
WORLDWIDE SALES AND SERVICE
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
Asia Pacific Office
Suites 3707-14, 37th Floor
Tower 6, The Gateway
Harbour City, Kowloon
Hong Kong
Tel: 852-2401-1200
Fax: 852-2401-3431
India - Bangalore
Tel: 91-80-4182-8400
Fax: 91-80-4182-8422
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://support.microchip.com
Web Address:
www.microchip.com
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
India - New Delhi
Tel: 91-11-4160-8631
Fax: 91-11-4160-8632
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
India - Pune
Tel: 91-20-2566-1512
Fax: 91-20-2566-1513
Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
Atlanta
Duluth, GA
Tel: 678-957-9614
Fax: 678-957-1455
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Japan - Yokohama
Tel: 81-45-471- 6166
Fax: 81-45-471-6122
China - Beijing
Tel: 86-10-8528-2100
Fax: 86-10-8528-2104
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Korea - Daegu
Tel: 82-53-744-4301
Fax: 82-53-744-4302
Boston
China - Chengdu
Tel: 86-28-8665-5511
Fax: 86-28-8665-7889
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Korea - Seoul
China - Hong Kong SAR
Tel: 852-2401-1200
Fax: 852-2401-3431
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
China - Nanjing
Tel: 86-25-8473-2460
Fax: 86-25-8473-2470
Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
Fax: 60-3-6201-9859
Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
UK - Wokingham
Tel: 44-118-921-5869
Fax: 44-118-921-5820
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
Malaysia - Penang
Tel: 60-4-227-8870
Fax: 60-4-227-4068
Detroit
Farmington Hills, MI
Tel: 248-538-2250
Fax: 248-538-2260
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
Kokomo
Kokomo, IN
Tel: 765-864-8360
Fax: 765-864-8387
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
China - Shenzhen
Tel: 86-755-8203-2660
Fax: 86-755-8203-1760
Taiwan - Hsin Chu
Tel: 886-3-572-9526
Fax: 886-3-572-6459
Los Angeles
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
Taiwan - Kaohsiung
Tel: 886-7-536-4818
Fax: 886-7-536-4803
Santa Clara
Santa Clara, CA
Tel: 408-961-6444
Fax: 408-961-6445
China - Xiamen
Tel: 86-592-2388138
Fax: 86-592-2388130
Taiwan - Taipei
Tel: 886-2-2500-6610
Fax: 886-2-2508-0102
Toronto
Mississauga, Ontario,
Canada
Tel: 905-673-0699
Fax: 905-673-6509
China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
01/02/08
DS22107A-page 92
© 2008 Microchip Technology Inc.
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