MCP6L92T-E/SNVAO [MICROCHIP]
Operational Amplifier, 2 Func, 4000uV Offset-Max, CMOS, PDSO8;
| 型号： | MCP6L92T-E/SNVAO |
| 厂家： | 
MICROCHIP |
| 描述： | Operational Amplifier, 2 Func, 4000uV Offset-Max, CMOS, PDSO8 放大器 光电二极管 |
| 文件： | 总36页 (文件大小：1000K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MCP6L91/1R/2/4
10 MHz, 850 µA Op Amps
Features:
Description:
• Available in SOT-23-5 Package
The Microchip Technology Inc. MCP6L91/1R/2/4 family
of operational amplifiers (op amps) provides wide
bandwidth for the current. The input bias currents and
voltage ranges make it easier to fit into many
applications.
• Gain Bandwidth Product: 10 MHz (typical)
• Rail-to-Rail Input/Output
• Supply Voltage: 2.4V to 6.0V
• Supply Current: IQ = 0.85 mA/Amplifier (typical)
• Extended Temperature Range: -40°C to +125°C
• Available in Single, Dual and Quad Packages
This family has a 10 MHz Gain Bandwidth Product
(GBWP) and a low 850 µA per amplifier quiescent
current. These op amps operate on supply voltages
between 2.4V and 6.0V, with rail-to-rail input and output
swing. They are available in the extended temperature
range.
Typical Applications:
• Portable Equipment
• Photodiode Amplifier
• Analog Filters
Package Types
MCP6L91
MCP6L92
• Notebooks and PDAs
• Battery-Powered Systems
SOT-23-5
SOIC, MSOP
V
1
5
1
2
3
4
8
7
6
5
V
V
V
V
DD
OUTA
OUT
DD
Design Aids:
V
V
V
2
3
V
–
V
OUTB
INA
SS
–
V
+
4
V
+
–
IN
INB
INA
• SPICE Macro Model
IN
+
V
• FilterLab® Software
INB
SS
MCP6L91
SOIC, MSOP
• Microchip Advanced Part Selector (MAPS)
• Analog Demonstration and Evaluation Boards
• Application Notes
MCP6L94
SOIC, TSSOP
NC
V
1
2
3
4
8
7
6
5
NC
V
V
1
2
3
14
13
12
11
10
9
OUTD
OUTA
V
–
+
DD
IN
V
V
V
–
V
–
+
Typical Application
V
INA
IND
V
OUT
IN
V
+
NC
INA
V
IND
SS
MCP6L91
V
DD 4
+
SS
R1
R2
R3
9.31 k
MCP6L91R
V
V
V
V
+
5
6
7
INB
3.01 k 6.81 k
INC
–
–
INB
INC
SOT-23-5
VOUT
VIN
V
V
8
OUTB
OUTC
C1
120 nF
C2
12 nF
C3
27 nF
1
2
3
5
V
V
V
OUT
SS
V
DD
4
V
+
–
IN
IN
Low-pass Filter
2009-2011 Microchip Technology Inc.
DS22141B-page 1
MCP6L91/1R/2/4
NOTES:
DS22141B-page 2
2009-2011 Microchip Technology Inc.
MCP6L91/1R/2/4
† Notice: Stresses above those listed under “Absolute
Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of
the device at those or any other conditions above those
indicated in the operational listings of this specification is not
implied. Exposure to maximum rating conditions for extended
periods may affect device reliability.
1.0
1.1
ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings †
V
– V
.......................................................................7.0V
SS
DD
Current at Input Pins ....................................................±2 mA
Analog Inputs (V +, V –) †† ....... V – 1.0V to V + 1.0V
†† See Section 4.1.2 “Input Voltage and Current Limits”.
IN
IN
SS
DD
All Inputs and Outputs ................... V – 0.3V to V + 0.3V
SS
DD
Difference Input Voltage ...................................... |V – V
|
SS
DD
Output Short Circuit Current ................................Continuous
Current at Output and Supply Pins ............................±30 mA
Storage Temperature ...................................-65°C to +150°C
Max. Junction Temperature ........................................+150°C
ESD protection on all pins (HBM, MM) 4 kV, 400V
1.2
Specifications
DC ELECTRICAL SPECIFICATIONS
TABLE 1-1:
Electrical Characteristics: Unless otherwise indicated, T = +25°C, V = 5.0V, V = GND, V
= V , V
V /2,
OUT DD
A
DD
SS
CM
SS
V = V /2 and R = 10 k to V (refer to Figure 1-1).
L
DD
L
L
Min
(Note 1)
Max
(Note 1)
Parameters
Sym
Typ
Units
Conditions
Input Offset
Input Offset Voltage
V
-4
—
—
±1
±1.3
89
+4
—
—
mV
OS
Input Offset Voltage Drift
Power Supply Rejection Ratio
Input Current and Impedance
Input Bias Current
V /T
µV/°C T = -40°C to+125°C
OS
A
A
PSRR
dB
I
I
I
—
—
—
—
—
—
1
50
—
—
—
—
—
—
pA
B
B
B
Across Temperature
Across Temperature
Input Offset Current
pA
pA
T = +85°C
A
2000
±1
T = +125°C
A
I
pA
OS
13
Common Mode Input Impedance
Differential Input Impedance
Common Mode
Z
10 ||6
||pF
||pF
CM
13
Z
10 ||3
DIFF
Common Mode Input Voltage Range
Common Mode Rejection Ratio
Open Loop Gain
V
-0.3
—
—
5.3
—
V
CMR
CMRR
91
dB
V
= -0.3V to 5.3V
CM
DC Open Loop Gain (large signal)
Output
A
V
—
105
—
dB
V
= 0.2V to 4.8V
OUT
OL
Maximum Output Voltage Swing
—
4.980
—
—
—
0.020
—
V
V
G = +2, 0.5V Input Overdrive
G = +2, 0.5V Input Overdrive
OL
OH
SC
V
Output Short Circuit Current
Power Supply
I
±25
—
mA
Supply Voltage
V
2.4
—
6.0
V
DD
Quiescent Current per Amplifier
I
0.35
0.85
1.35
mA
I = 0
O
Q
Note 1: For design guidance only; not tested.
2009-2011 Microchip Technology Inc.
DS22141B-page 3
MCP6L91/1R/2/4
TABLE 1-2:
AC ELECTRICAL SPECIFICATIONS
Electrical Characteristics: Unless otherwise indicated, T = +25°C, V = +5.0V, V = GND, V
= V , V
V /2,
OUT DD
A
DD
SS
CM
SS
V = V /2, R = 10 k to V and C = 60 pF (refer to Figure 1-1).
L
DD
L
L
L
Parameters
Sym
Min
Typ
Max
Units
Conditions
AC Response
Gain Bandwidth Product
Phase Margin
GBWP
PM
—
—
—
10
65
7
—
—
—
MHz
°
G = +1
Slew Rate
SR
V/µs
Noise
Input Noise Voltage
Input Noise Voltage Density
Input Noise Current Density
E
e
—
—
—
2.5
9.4
3
—
—
—
µV
f = 0.1 Hz to 10 Hz
ni
P-P
nV/Hz f = 10 kHz
fA/Hz f = 1 kHz
ni
i
ni
TABLE 1-3:
TEMPERATURE SPECIFICATIONS
Electrical Characteristics: Unless otherwise indicated, all limits are specified for: V = +2.4V to +6.0V, V = GND.
DD
SS
Parameters
Sym
Min
Typ
Max Units
Conditions
Temperature Ranges
Specified Temperature Range
Operating Temperature Range
Storage Temperature Range
T
-40
-40
-65
—
—
—
+125
+125
+150
°C
°C
°C
A
T
(Note 1)
A
T
A
Thermal Package Resistances
Thermal Resistance, 5L-SOT-23
Thermal Resistance, 8L-SOIC (150 mil)
Thermal Resistance, 8L-MSOP
Thermal Resistance, 14L-SOIC
Thermal Resistance, 14L-TSSOP
—
—
—
—
—
256
163
206
120
100
—
—
—
—
—
°C/W
°C/W
°C/W
°C/W
°C/W
JA
JA
JA
JA
JA
Note 1: Operation must not cause T to exceed Maximum Junction Temperature specification (150°C).
J
CF
6.8 pF
1.3
Test Circuit
The circuit used for most DC and AC tests is shown in
Figure 1-1. This circuit can independently set VCM and
RG
100 k
RF
100 k
VOUT; see Equation 1-1. Note that VCM is not the
circuit’s common mode voltage ((VP + VM)/2), and that
VOST includes VOS plus the effects (on the input offset
VDD/2
VP
VDD
error, VOST) of temperature, CMRR, PSRR and AOL
.
VIN+
CB1
100 nF
CB2
1 µF
EQUATION 1-1:
MCP6L9X
GDM = RF RG
VIN–
VCM = VP + VDD 2 2
VOST = VIN– – VIN+
VOUT
VM
RL
10 k
CL
60 pF
RG
100 k
VOUT = VDD 2 + VP – VM + VOST1 + GDM
Where:
RF
100 k
GDM = Differential Mode Gain
(V/V)
(V)
CF
6.8 pF
VCM = Op Amp’s Common Mode
VL
Input Voltage
FIGURE 1-1:
AC and DC Test Circuit for
VOST = Op Amp’s Total Input Offset
(mV)
Voltage
Most Specifications.
DS22141B-page 4
2009-2011 Microchip Technology Inc.
MCP6L91/1R/2/4
2.0
TYPICAL PERFORMANCE CURVES
Note:
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Note: Unless otherwise indicated, TA = +25°C, VDD = 5.0V, VSS = GND, VCM = VSS, VOUT = VDD/2, VL = VDD/2,
RL = 10 kto VL and CL = 60 pF.
1.0
0.8
0.5
0.4
VDD = 2.4V
Representative Part
0.6
0.3
VCMRH – VDD
0.4
0.2
0.2
0.1
0.0
One Wafer Lot
0.0
-40°C
-0.2
-0.4
-0.6
-0.8
-1.0
-0.1
-0.2
-0.3
-0.4
-0.5
+25°C
+85°C
+125°C
VCMRL – VSS
-50
-25
0
25
50
75
100
125
Common Mode Input Voltage (V)
Ambient Temperature (°C)
FIGURE 2-1:
Input Offset Voltage vs.
FIGURE 2-4:
Input Common Mode Range
Common Mode Input Voltage at VDD = 2.4V.
Voltage vs. Ambient Temperature.
1.0
100
95
VDD = 5.5V
Representative Part
+125°C
+85°C
+25°C
-40°C
0.8
0.6
CMRR (VCM = VCMRL to VCMRH
)
0.4
90
85
80
75
70
0.2
PSRR (VCM = VSS
)
0.0
-0.2
-0.4
-0.6
-0.8
-1.0
-50
-25
0
25
50
75
100
125
Common Mode Input Voltage (V)
Ambient Temperature (°C)
FIGURE 2-2:
Input Offset Voltage vs.
FIGURE 2-5:
CMRR, PSRR vs. Ambient
Common Mode Input Voltage at VDD = 5.5V.
Temperature.
0.5
100
90
80
70
60
50
40
30
20
Representative Part
0.4
VDD = 1.8V
0.3
0.2
CMRR
VDD = 5.5V
0.1
PSRR–
PSRR+
0.0
-0.1
-0.2
-0.3
-0.4
-0.5
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
Output Voltage (V)
10
100
1.2
1k
10k
1.4
100k
15
1.E1
1.03
Frequency (Hz)
FIGURE 2-3:
Input Offset Voltage vs.
FIGURE 2-6:
CMRR, PSRR vs.
Output Voltage.
Frequency.
2009-2011 Microchip Technology Inc.
DS22141B-page 5
MCP6L91/1R/2/4
Note: Unless otherwise indicated, TA = +25°C, VDD = +5.0V, VSS = GND, VCM = VSS, VOUT = VDD/2, VL = VDD/2,
RL = 10 kto VL and CL = 60 pF.
6
5
1.E1-00m2
1.E-10m3
100µ
1.E- 4
VIN
G = +2 V/V
VOUT
10µ
1.E-05
4
1µ
1.E-06
100n
1.E-07
3
10n
1.E-08
1n
1.E-09
100p
1.E-10
10p
1.E-11
2
+125°C
+85°C
+25°C
-40°C
1
0
1p
1.E-12
-1.0 -0.9 -0.8 -0.7 -0.6 -0.5 -0.4 -0.3 -0.2 -0.1 0.0
Input Voltage (V)
0.E+00
1.E-03
2.E-03
3.E-03
4.E-03
5.E-03
6.E-03
7.E-03
8.E-03
9.E-03
1.E-02
-1
Time (1 ms/div)
FIGURE 2-7:
Measured Input Current vs.
FIGURE 2-10:
The MCP6L91/1R/2/4 Show
Input Voltage (below VSS).
No Phase Reversal.
1.2
1.1
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
120
100
80
60
40
20
0
0
-30
-60
Phase
-90
+125°C
+85°C
+25°C
-40°C
-120
-150
-180
-210
Gain
-20
1
10 100 1k 10k 100k 1M 10M 100M
1.E+ 1.E+ 1.E+ 1.E+ 1.E+ 1.E+ 1.E+ 1.E+ 1.E+
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
Power Supply Voltage (V)
Frequency (Hz)
00 01 02 03 04 05 06 07 08
FIGURE 2-8:
Open-Loop Gain, Phase vs.
FIGURE 2-11:
Quiescent Current vs.
Frequency.
Power Supply Voltage.
40
30
1,000
20
100
10
1
10
-40°C
+25°C
+85°C
+125°C
0
-10
-20
-30
-40
0.1
1
10
100
1k
10k
100k
1.E-01 1.E+0 1.E+0 1.E+0 1.E+0 1.E+0 1.E+0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
Power Supply Voltage (V)
0
1Freque2ncy (Hz3)
4
5
FIGURE 2-9:
Input Noise Voltage Density
FIGURE 2-12:
Output Short Circuit Current
vs. Frequency.
vs. Power Supply Voltage.
DS22141B-page 6
2009-2011 Microchip Technology Inc.
MCP6L91/1R/2/4
Note: Unless otherwise indicated, TA = +25°C, VDD = +5.0V, VSS = GND, VCM = VSS, VOUT = VDD/2, VL = VDD/2,
RL = 10 kto VL and CL = 60 pF.
12
30
VDD = 5.5V
VDD – VOH
IOUT
11
10
9
8
7
6
5
4
3
25
20
15
10
5
Falling Edge
VOL – VSS
-IOUT
VDD = 2.4V
Rising Edge
2
1
0
0
100µ
1m
1.E-03
10m
1.E-02
-50
-25
0
25
50
75
100
125
1.E-04
Output Current Magnitude (A)
Ambient Temperature (°C)
FIGURE 2-13:
Ratio of Output Voltage
FIGURE 2-16:
Slew Rate vs. Ambient
Headroom to Output Current vs. Output Current.
Temperature.
0.04
10
1
G = +1 V/V
VDD = 5.5V
0.03
0.02
0.01
VDD = 2.4V
0.00
-0.01
-0.02
-0.03
-0.04
0.1
10k
100k
1M
1.6
10M
1.07
0.E+00
2.E-07
4.E-07
6.E-07
8.E-07
1.E-06
1.E-06
1.E-06
2.E-06
2.E-06
2.E-06
1.E+4
1E5
Time (200 ns/div)
Frequency (Hz)
FIGURE 2-14:
Small Signal, Noninverting
FIGURE 2-17:
Output Voltage Swing vs.
Pulse Response.
Frequency.
5.0
G = +1 V/V
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.E+00
1.E-06
2.E-06
3.E-06
4.E-06
5.E-06
6.E-06
7.E-06
8.E-06
9.E-06
1.E-05
0.0
Time (1 µs/div)
FIGURE 2-15:
Pulse Response.
Large Signal, Noninverting
2009-2011 Microchip Technology Inc.
DS22141B-page 7
MCP6L91/1R/2/4
NOTES:
DS22141B-page 8
2009-2011 Microchip Technology Inc.
MCP6L91/1R/2/4
3.0
PIN DESCRIPTIONS
Descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
MCP6L91
PIN FUNCTION TABLE
MCP6L91R MCP6L92 MCP6L94
Symbol
Description
MSOP-8,
SOIC-8,
MSOP-8,
SOIC-8,
SOIC-14,
TSSOP-14
SOT-23-5
SOT-23-5
1
6
2
1
1
2
1
2
VOUT, VOUTA
Output (op amp A)
4
4
VIN–, VINA
VIN+, VINA
VDD
–
Inverting Input (op amp A)
Noninverting Input (op amp A)
Positive Power Supply
3
3
3
3
3
+
5
7
2
8
4
—
—
—
—
—
—
2
—
—
—
—
—
—
4
—
—
—
—
—
—
5
5
5
VINB
VINB
+
–
Noninverting Input (op amp B)
Inverting Input (op amp B)
Output (op amp B)
6
6
7
7
VOUTB
VOUTC
—
—
—
4
8
Output (op amp C)
9
VINC
VINC
VSS
–
+
Inverting Input (op amp C)
Noninverting Input (op amp C)
Negative Power Supply
Noninverting Input (op amp D)
Inverting Input (op amp D)
Output (op amp D)
10
11
12
13
14
—
—
—
—
—
—
—
—
1, 5, 8
—
—
—
—
—
—
—
—
VIND
VIND
+
–
VOUTD
NC
No Internal Connection
3.1
Analog Outputs
3.3
Power Supply Pins
The analog output pins (VOUT) are low-impedance
voltage sources.
The positive power supply (VDD) is 2.4V to 6.0V higher
than the negative power supply (VSS). For normal
operation, the other pins are between VSS and VDD
.
3.2
Analog Inputs
Typically, these parts are used in a single (positive)
supply configuration. In this case, VSS is connected to
ground and VDD is connected to the supply. VDD will
need bypass capacitors.
The noninverting and inverting inputs (VIN+, VIN–, …)
are high-impedance CMOS inputs with low bias
currents.
2009-2011 Microchip Technology Inc.
DS22141B-page 9
MCP6L91/1R/2/4
NOTES:
DS22141B-page 10
2009-2011 Microchip Technology Inc.
MCP6L91/1R/2/4
4.1.3
NORMAL OPERATION
4.0
APPLICATION INFORMATION
The input stage of the MCP6L91/1R/2/4 op amps use
two differential CMOS input stages in parallel. One
operates at low common mode input voltage (VCM),
while the other operates at high VCM. With this
topology, and at room temperature, the device
operates with VCM up to 0.3V above VDD and 0.3V
below VSS (typical at 25°C).
The MCP6L91/1R/2/4 family of op amps is manufac-
tured using Microchip’s state of the art CMOS process.
It is designed for low cost, low power and general pur-
pose applications. The low supply voltage, low
quiescent current and wide bandwidth makes the
MCP6L91/1R/2/4 ideal for battery-powered applica-
tions.
The transition between the two input stages occurs
when VCM = VDD – 1.1V. For the best distortion and
gain linearity, with noninverting gains, avoid this region
of operation.
4.1
Rail-to-Rail Inputs
4.1.1
PHASE REVERSAL
The MCP6L91/1R/2/4 op amps are designed to
prevent phase inversion when the input pins exceed
the supply voltages. Figure 2-10 shows an input
voltage exceeding both supplies without any phase
reversal.
4.2
Rail-to-Rail Output
The output voltage range of the MCP6L91/1R/2/4 op
amps is VDD – 20 mV (minimum) and VSS + 20 mV
(maximum) when RL = 10 k is connected to VDD/2
and VDD = 5.0V. Refer to Figure 2-13 for more informa-
tion.
4.1.2
INPUT VOLTAGE AND CURRENT
LIMITS
In order to prevent damage and/or improper operation
of these amplifiers, the circuit they are in must limit the
currents (and voltages) at the input pins (see
Section 1.1 “Absolute Maximum Ratings †”).
Figure 4-1 shows the recommended approach to
protecting these inputs. The internal ESD diodes
prevent the input pins (VIN+ and VIN–) from going too
far below ground, and the resistors R1 and R2 limit the
possible current drawn out of the input pins. Diodes D1
and D2 prevent the input pins (VIN+ and VIN–) from
going too far above VDD, and dump any currents onto
4.3
Capacitive Loads
Driving large capacitive loads can cause stability
problems for voltage feedback op amps. As the load
capacitance increases, the feedback loop’s phase
margin decreases and the closed-loop bandwidth is
reduced. This produces gain peaking in the frequency
response, with overshoot and ringing in the step
response.
When driving large capacitive loads with these op
amps (e.g., > 100 pF when G = +1), a small series
resistor at the output (RISO in Figure 4-2) improves the
feedback loop’s stability by making the output load
resistive at higher frequencies; the bandwidth will
usually be decreased.
VDD
.
VDD
D1
R1
D2
RG
RF
RISO
CL
VOUT
V1
V2
MCP6L9X
MCP6L9X
RN
R2
FIGURE 4-2:
stabilizes large capacitive loads.
Output Resistor, RISO
R3
VSS – (minimum expected V1)
Bench measurements are helpful in choosing RISO
Adjust RISO so that a small signal step response (see
Figure 2-14) has reasonable overshoot (e.g., 4%).
.
R1 >
2 mA
VSS – (minimum expected V2)
2 mA
R2 >
FIGURE 4-1:
Protecting the Analog
Inputs.
A significant amount of current can flow out of the
inputs (through the ESD diodes) when the common
mode voltage (VCM) is below ground (VSS); see
Figure 2-7. Applications that are high-impedance may
need to limit the usable voltage range.
2009-2011 Microchip Technology Inc.
DS22141B-page 11
MCP6L91/1R/2/4
4.4
Supply Bypass
Guard Ring
VIN– VIN+
With this family of operational amplifiers, the power
supply pin (VDD for single supply) should have a local
bypass capacitor (i.e., 0.01 µF to 0.1 µF) within 2 mm
for good high-frequency performance. It also needs a
bulk capacitor (i.e., 1 µF or larger) within 100 mm to
provide large, slow currents. This bulk capacitor can be
shared with other nearby analog parts.
FIGURE 4-4:
Layout.
Example Guard Ring
4.5
Unused Op Amps
1. Inverting Amplifiers (Figure 4-4) and Trans-
impedance Gain Amplifiers (convert current to
voltage, such as photo detectors).
An unused op amp in a quad package (e.g., MCP6L94)
should be configured as shown in Figure 4-3. These
circuits prevent the output from toggling and causing
crosstalk. Circuit A sets the op amp at its minimum
noise gain. The resistor divider produces any desired
reference voltage within the output voltage range of the
op amp; the op amp buffers that reference voltage.
Circuit B uses the minimum number of components
and operates as a comparator, but it may draw more
current.
a) Connect the guard ring to the noninverting
input pin (VIN+); this biases the guard ring
to the same reference voltage as the op
amp’s input (e.g., VDD/2 or ground).
b) Connect the inverting pin (VIN–) to the input
with a wire that does not touch the PCB sur-
face.
2. Noninverting Gain and Unity-Gain Buffer.
a) Connect the guard ring to the inverting input
pin (VIN–); this biases the guard ring to the
common mode input voltage.
¼ MCP6L94 (A)
VDD
¼ MCP6L94 (B)
VDD
b) Connect the noninverting pin (VIN+) to the
input with a wire that does not touch the
PCB surface.
VDD
R1
R2
VREF
4.7
Application Circuit
4.7.1
ACTIVE LOW-PASS FILTER
The MCP6L91/1R/2/4 op amp’s low input noise and
good output current drive make it possible to design
low noise filters. Reducing the resistors’ values also
reduces the noise and increases the frequency at
which parasitic capacitances affect the response.
These trade-offs need to be considered when selecting
circuit elements.
R2
VREF = VDD ------------------
R1 + R2
FIGURE 4-3:
Unused Op Amps.
4.6 PCB Surface Leakage
In applications where low input bias current is critical,
printed circuit board (PCB) surface leakage effects
need to be considered. Surface leakage is caused by
humidity, dust or other contamination on the board.
Under low humidity conditions, a typical resistance
between nearby traces is 1012. A 5V difference would
cause 5 pA of current to flow; this is greater than this
family’s bias current at 25°C (1 pA, typical).
Figure 4-5 shows a third-order Chebyshev filter with a
1 kHz bandwidth, 0.2 dB ripple and a gain of +1 V/V.
The component values were selected using Micro-
chip’s FilterLab® software. Resistor R3 was reduced in
value by increasing C3 in FilterLab.
MCP6L91
R1
R2
R3
The easiest way to reduce surface leakage is to use a
guard ring around sensitive pins (or traces). The guard
ring is biased at the same voltage as the sensitive pin.
Figure 4-4 is an example of this type of layout.
3.01 k 6.81 k
9.31 k
VOUT
VIN
C1
C2
C3
27 nF
120 nF
12 nF
FIGURE 4-5:
Chebyshev Filter.
DS22141B-page 12
2009-2011 Microchip Technology Inc.
MCP6L91/1R/2/4
5.4
Analog Demonstration and
Evaluation Boards
5.0
DESIGN AIDS
Microchip provides the basic design aids needed for
the MCP6L91/1R/2/4 family of op amps.
Microchip offers a broad spectrum of Analog Demon-
stration and Evaluation Boards that are designed to
help customers achieve faster time to market. For a
complete listing of these boards and their correspond-
ing user’s guides and technical information, visit the
Microchip web site at www.microchip.com/analog
tools.
5.1
SPICE Macro Model
The latest SPICE macro model for the MCP6L91/1R/2/4
op amp is available on the Microchip web site at
www.microchip.com. The model was written and tested
in official Orcad (Cadence) owned PSPICE. For other
simulators, translation may be required.
Some boards that are especially useful are:
• MCP6XXX Amplifier Evaluation Board 1
• MCP6XXX Amplifier Evaluation Board 2
• MCP6XXX Amplifier Evaluation Board 3
• MCP6XXX Amplifier Evaluation Board 4
• Active Filter Demo Board Kit
The model covers a wide aspect of the op amp's
electrical specifications. Not only does the model cover
voltage, current, and resistance of the op amp, but it
also covers the temperature and noise effects on the
behavior of the op amp. The model has not been
verified outside of the specification range listed in the
op amp data sheet. The model behaviors under these
conditions cannot be ensured to match the actual op
amp performance.
• 5/6-Pin SOT-23 Evaluation Board, P/N VSUPEV2
• 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board,
P/N SOIC8EV
• 14-Pin SOIC/TSSOP/DIP Evaluation Board,
P/N SOIC14EV
Moreover, the model is intended to be an initial design
tool. Bench testing is a very important part of any
design and cannot be replaced with simulations. Also,
simulation results using this macro model need to be
validated by comparing them to the data sheet specifi-
cations and characteristic curves.
5.5
Application Notes
The following Microchip Application Notes are
available on the Microchip web site at www.microchip.
com/appnotes and are recommended as supplemental
reference resources.
®
5.2
FilterLab Software
Microchip’s FilterLab® software is an innovative
software tool that simplifies analog active filter (using
op amps) design. Available at no cost from the Micro-
chip web site at www.microchip.com/filterlab, the Filter-
Lab design tool provides full schematic diagrams of the
filter circuit with component values. It also outputs the
filter circuit in SPICE format, which can be used with
the macro model to simulate actual filter performance.
• ADN003: “Select the Right Operational Amplifier
for your Filtering Circuits”, DS21821
• AN722: “Operational Amplifier Topologies and DC
Specifications”, DS00722
• AN723: “Operational Amplifier AC Specifications
and Applications”, DS00723
• AN884: “Driving Capacitive Loads With Op
Amps”, DS00884
• AN990: “Analog Sensor Conditioning Circuits –
An Overview”, DS00990
5.3
Microchip Advanced Part Selector
(MAPS)
MAPS is a software tool that helps efficiently identify
Microchip devices that fit a particular design require-
ment. Available at no cost from the Microchip web site
at www.microchip.com/maps, the MAPS is an overall
selection tool for Microchip’s product portfolio that
includes Analog, Memory, MCUs and DSCs. Using this
tool, a customer can define a filter to sort features for a
parametric search of devices and export side-by-side
technical comparison reports. Helpful links are also
provided for data sheets, purchase and sampling of
Microchip parts.
2009-2011 Microchip Technology Inc.
DS22141B-page 13
MCP6L91/1R/2/4
NOTES:
DS22141B-page 14
2009-2011 Microchip Technology Inc.
MCP6L91/1R/2/4
6.0
6.1
PACKAGING INFORMATION
Package Marking Information
Example:
5-Lead SOT-23 (MCP6L91/1R)
5
4
5
4
3
Device
MCP6L91
MCP6L91R
Code
UUNN
UVNN
UU25
XXNN
Note: Applies to 5-Lead SOT-23.
1
2
3
1
2
Example:
8-Lead MSOP (MCP6L92)
XXXXXX
6L92E
134256
YWWNNN
8-Lead SOIC (150 mil) (MCP6L92)
Example:
XXXXXXXX
XXXXYYWW
MCP6L92E
e
3
SN^1134
NNN
256
Legend: XX...X Customer-specific information
Y
YY
WW
NNN
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
e
3
Pb-free JEDEC designator for Matte Tin (Sn)
*
This package is Pb-free. The Pb-free JEDEC designator (
can be found on the outer packaging for this package.
)
e3
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
2009-2011 Microchip Technology Inc.
DS22141B-page 15
MCP6L91/1R/2/4
Package Marking Information (Continued)
14-Lead SOIC (150 mil) (MCP6L94)
Example:
MCP6L94
XXXXXXXXXX
XXXXXXXXXX
e
3
E/SL
1134256
YYWWNNN
Example:
14-Lead TSSOP (MCP6L94)
XXXXXX
YYWW
6L94EST
1134
NNN
256
DS22141B-page 16
2009-2011 Microchip Technology Inc.
MCP6L91/1R/2/4
ꢀꢁꢂꢃꢄꢅꢆꢇꢈꢄꢉꢊꢋꢌꢆꢍꢎꢄꢈꢈꢆꢏꢐꢊꢈꢋꢑꢃꢆꢒꢓꢄꢑꢉꢋꢉꢊꢔꢓꢆꢕꢏꢒꢖꢆꢗꢍꢏꢒꢁꢘꢙꢚ
ꢛꢔꢊꢃꢜ ꢧꢈꢓꢉꢍꢒꢅꢉꢄꢈꢇꢍꢉꢎꢐꢓꢓꢅꢆꢍꢉꢔꢊꢎꢨꢊꢚꢅꢉꢋꢓꢊꢦꢃꢆꢚꢇꢩꢉꢔꢏꢅꢊꢇꢅꢉꢇꢅꢅꢉꢍꢒꢅꢉꢕꢃꢎꢓꢈꢎꢒꢃꢔꢉꢪꢊꢎꢨꢊꢚꢃꢆꢚꢉꢜꢔꢅꢎꢃꢑꢃꢎꢊꢍꢃꢈꢆꢉꢏꢈꢎꢊꢍꢅꢋꢉꢊꢍꢉ
ꢒꢍꢍꢔꢢꢫꢫꢦꢦꢦꢁꢄꢃꢎꢓꢈꢎꢒꢃꢔꢁꢎꢈꢄꢫꢔꢊꢎꢨꢊꢚꢃꢆꢚ
b
N
E
E1
3
2
1
e
e1
D
A2
c
A
φ
A1
L
L1
ꢬꢆꢃꢍꢇꢕꢭꢮꢮꢭꢕꢌꢣꢌꢯꢜ
ꢂꢃꢄꢅꢆꢇꢃꢈꢆꢉꢮꢃꢄꢃꢍꢇ
ꢕꢭꢰ
ꢰꢱꢕ
ꢕꢛꢲ
ꢰꢐꢄꢳꢅꢓꢉꢈꢑꢉꢪꢃꢆꢇꢰ
ꢮꢅꢊꢋꢉꢪꢃꢍꢎꢒ
ꢟ
ꢅ
ꢗꢁꢴꢟꢉꢠꢜꢡ
ꢱꢐꢍꢇꢃꢋꢅꢉꢮꢅꢊꢋꢉꢪꢃꢍꢎꢒ
ꢱꢥꢅꢓꢊꢏꢏꢉꢵꢅꢃꢚꢒꢍ
ꢕꢈꢏꢋꢅꢋꢉꢪꢊꢎꢨꢊꢚꢅꢉꢣꢒꢃꢎꢨꢆꢅꢇꢇ
ꢜꢍꢊꢆꢋꢈꢑꢑ
ꢱꢥꢅꢓꢊꢏꢏꢉꢹꢃꢋꢍꢒ
ꢕꢈꢏꢋꢅꢋꢉꢪꢊꢎꢨꢊꢚꢅꢉꢹꢃꢋꢍꢒ
ꢱꢥꢅꢓꢊꢏꢏꢉꢮꢅꢆꢚꢍꢒ
ꢧꢈꢈꢍꢉꢮꢅꢆꢚꢍꢒ
ꢧꢈꢈꢍꢔꢓꢃꢆꢍ
ꢧꢈꢈꢍꢉꢛꢆꢚꢏꢅ
ꢮꢅꢊꢋꢉꢣꢒꢃꢎꢨꢆꢅꢇꢇ
ꢮꢅꢊꢋꢉꢹꢃꢋꢍꢒ
ꢅꢀ
ꢛ
ꢛꢘ
ꢛꢀ
ꢌ
ꢌꢀ
ꢂ
ꢮ
ꢀꢁꢴꢗꢉꢠꢜꢡ
ꢗꢁꢴꢗ
ꢗꢁꢷꢴ
ꢗꢁꢗꢗ
ꢘꢁꢘꢗ
ꢀꢁꢸꢗ
ꢘꢁꢙꢗ
ꢗꢁꢀꢗ
ꢗꢁꢸꢟ
ꢗꢻ
ꢶ
ꢶ
ꢶ
ꢶ
ꢶ
ꢶ
ꢶ
ꢶ
ꢶ
ꢶ
ꢶ
ꢀꢁꢞꢟ
ꢀꢁꢸꢗ
ꢗꢁꢀꢟ
ꢸꢁꢘꢗ
ꢀꢁꢷꢗ
ꢸꢁꢀꢗ
ꢗꢁꢺꢗ
ꢗꢁꢷꢗ
ꢸꢗꢻ
ꢮꢀ
ꢀ
ꢎ
ꢳ
ꢗꢁꢗꢷ
ꢗꢁꢘꢗ
ꢗꢁꢘꢺ
ꢗꢁꢟꢀ
ꢛꢔꢊꢃꢉꢜ
ꢀꢁ ꢂꢃꢄꢅꢆꢇꢃꢈꢆꢇꢉꢂꢉꢊꢆꢋꢉꢌꢀꢉꢋꢈꢉꢆꢈꢍꢉꢃꢆꢎꢏꢐꢋꢅꢉꢄꢈꢏꢋꢉꢑꢏꢊꢇꢒꢉꢈꢓꢉꢔꢓꢈꢍꢓꢐꢇꢃꢈꢆꢇꢁꢉꢕꢈꢏꢋꢉꢑꢏꢊꢇꢒꢉꢈꢓꢉꢔꢓꢈꢍꢓꢐꢇꢃꢈꢆꢇꢉꢇꢒꢊꢏꢏꢉꢆꢈꢍꢉꢅꢖꢎꢅꢅꢋꢉꢗꢁꢀꢘꢙꢉꢄꢄꢉꢔꢅꢓꢉꢇꢃꢋꢅꢁ
ꢘꢁ ꢂꢃꢄꢅꢆꢇꢃꢈꢆꢃꢆꢚꢉꢊꢆꢋꢉꢍꢈꢏꢅꢓꢊꢆꢎꢃꢆꢚꢉꢔꢅꢓꢉꢛꢜꢕꢌꢉꢝꢀꢞꢁꢟꢕꢁ
ꢠꢜꢡꢢ ꢠꢊꢇꢃꢎꢉꢂꢃꢄꢅꢆꢇꢃꢈꢆꢁꢉꢣꢒꢅꢈꢓꢅꢍꢃꢎꢊꢏꢏꢤꢉꢅꢖꢊꢎꢍꢉꢥꢊꢏꢐꢅꢉꢇꢒꢈꢦꢆꢉꢦꢃꢍꢒꢈꢐꢍꢉꢍꢈꢏꢅꢓꢊꢆꢎꢅꢇꢁ
ꢕꢃꢎꢓꢈꢎꢒꢃꢔ ꢣꢅꢎꢒꢆꢈꢏꢈꢚꢤ ꢂꢓꢊꢦꢃꢆꢚ ꢡꢗꢞꢼꢗꢴꢀꢠ
2009-2011 Microchip Technology Inc.
DS22141B-page 17
MCP6L91/1R/2/4
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS22141B-page 18
2009-2011 Microchip Technology Inc.
MCP6L91/1R/2/4
ꢝꢁꢂꢃꢄꢅꢆꢇꢈꢄꢉꢊꢋꢌꢆꢞꢋꢌꢓꢔꢆꢍꢎꢄꢈꢈꢆꢏꢐꢊꢈꢋꢑꢃꢆꢇꢄꢌꢟꢄꢠꢃꢆꢕꢞꢍꢖꢆꢗꢞꢍꢏꢇꢚ
ꢛꢔꢊꢃꢜ ꢧꢈꢓꢉꢍꢒꢅꢉꢄꢈꢇꢍꢉꢎꢐꢓꢓꢅꢆꢍꢉꢔꢊꢎꢨꢊꢚꢅꢉꢋꢓꢊꢦꢃꢆꢚꢇꢩꢉꢔꢏꢅꢊꢇꢅꢉꢇꢅꢅꢉꢍꢒꢅꢉꢕꢃꢎꢓꢈꢎꢒꢃꢔꢉꢪꢊꢎꢨꢊꢚꢃꢆꢚꢉꢜꢔꢅꢎꢃꢑꢃꢎꢊꢍꢃꢈꢆꢉꢏꢈꢎꢊꢍꢅꢋꢉꢊꢍꢉ
ꢒꢍꢍꢔꢢꢫꢫꢦꢦꢦꢁꢄꢃꢎꢓꢈꢎꢒꢃꢔꢁꢎꢈꢄꢫꢔꢊꢎꢨꢊꢚꢃꢆꢚ
D
N
E
E1
NOTE 1
2
b
1
e
c
φ
A2
A
L
L1
A1
ꢬꢆꢃꢍꢇꢕꢭꢮꢮꢭꢕꢌꢣꢌꢯꢜ
ꢂꢃꢄꢅꢆꢇꢃꢈꢆꢉꢮꢃꢄꢃꢍꢇ
ꢕꢭꢰ
ꢰꢱꢕ
ꢕꢛꢲ
ꢰꢐꢄꢳꢅꢓꢉꢈꢑꢉꢪꢃꢆꢇꢰ
ꢪꢃꢍꢎꢒ
ꢷ
ꢅ
ꢗꢁꢺꢟꢉꢠꢜꢡ
ꢱꢥꢅꢓꢊꢏꢏꢉꢵꢅꢃꢚꢒꢍ
ꢕꢈꢏꢋꢅꢋꢉꢪꢊꢎꢨꢊꢚꢅꢉꢣꢒꢃꢎꢨꢆꢅꢇꢇ
ꢜꢍꢊꢆꢋꢈꢑꢑꢉ
ꢱꢥꢅꢓꢊꢏꢏꢉꢹꢃꢋꢍꢒ
ꢕꢈꢏꢋꢅꢋꢉꢪꢊꢎꢨꢊꢚꢅꢉꢹꢃꢋꢍꢒ
ꢱꢥꢅꢓꢊꢏꢏꢉꢮꢅꢆꢚꢍꢒ
ꢧꢈꢈꢍꢉꢮꢅꢆꢚꢍꢒ
ꢛ
ꢶ
ꢗꢁꢙꢟ
ꢗꢁꢗꢗ
ꢶ
ꢗꢁꢷꢟ
ꢀꢁꢀꢗ
ꢗꢁꢴꢟ
ꢗꢁꢀꢟ
ꢛꢘ
ꢛꢀ
ꢌ
ꢌꢀ
ꢂ
ꢮ
ꢶ
ꢞꢁꢴꢗꢉꢠꢜꢡ
ꢸꢁꢗꢗꢉꢠꢜꢡ
ꢸꢁꢗꢗꢉꢠꢜꢡ
ꢗꢁꢺꢗ
ꢗꢁꢞꢗ
ꢗꢁꢷꢗ
ꢧꢈꢈꢍꢔꢓꢃꢆꢍ
ꢧꢈꢈꢍꢉꢛꢆꢚꢏꢅ
ꢮꢀ
ꢀ
ꢗꢁꢴꢟꢉꢯꢌꢧ
ꢶ
ꢗꢻ
ꢷꢻ
ꢮꢅꢊꢋꢉꢣꢒꢃꢎꢨꢆꢅꢇꢇ
ꢮꢅꢊꢋꢉꢹꢃꢋꢍꢒ
ꢎ
ꢳ
ꢗꢁꢗꢷ
ꢗꢁꢘꢘ
ꢶ
ꢶ
ꢗꢁꢘꢸ
ꢗꢁꢞꢗ
ꢛꢔꢊꢃꢉꢜ
ꢀꢁ ꢪꢃꢆꢉꢀꢉꢥꢃꢇꢐꢊꢏꢉꢃꢆꢋꢅꢖꢉꢑꢅꢊꢍꢐꢓꢅꢉꢄꢊꢤꢉꢥꢊꢓꢤꢩꢉꢳꢐꢍꢉꢄꢐꢇꢍꢉꢳꢅꢉꢏꢈꢎꢊꢍꢅꢋꢉꢦꢃꢍꢒꢃꢆꢉꢍꢒꢅꢉꢒꢊꢍꢎꢒꢅꢋꢉꢊꢓꢅꢊꢁ
ꢘꢁ ꢂꢃꢄꢅꢆꢇꢃꢈꢆꢇꢉꢂꢉꢊꢆꢋꢉꢌꢀꢉꢋꢈꢉꢆꢈꢍꢉꢃꢆꢎꢏꢐꢋꢅꢉꢄꢈꢏꢋꢉꢑꢏꢊꢇꢒꢉꢈꢓꢉꢔꢓꢈꢍꢓꢐꢇꢃꢈꢆꢇꢁꢉꢕꢈꢏꢋꢉꢑꢏꢊꢇꢒꢉꢈꢓꢉꢔꢓꢈꢍꢓꢐꢇꢃꢈꢆꢇꢉꢇꢒꢊꢏꢏꢉꢆꢈꢍꢉꢅꢖꢎꢅꢅꢋꢉꢗꢁꢀꢟꢉꢄꢄꢉꢔꢅꢓꢉꢇꢃꢋꢅꢁ
ꢸꢁ ꢂꢃꢄꢅꢆꢇꢃꢈꢆꢃꢆꢚꢉꢊꢆꢋꢉꢍꢈꢏꢅꢓꢊꢆꢎꢃꢆꢚꢉꢔꢅꢓꢉꢛꢜꢕꢌꢉꢝꢀꢞꢁꢟꢕꢁ
ꢠꢜꢡꢢ ꢠꢊꢇꢃꢎꢉꢂꢃꢄꢅꢆꢇꢃꢈꢆꢁꢉꢣꢒꢅꢈꢓꢅꢍꢃꢎꢊꢏꢏꢤꢉꢅꢖꢊꢎꢍꢉꢥꢊꢏꢐꢅꢉꢇꢒꢈꢦꢆꢉꢦꢃꢍꢒꢈꢐꢍꢉꢍꢈꢏꢅꢓꢊꢆꢎꢅꢇꢁ
ꢯꢌꢧꢢ ꢯꢅꢑꢅꢓꢅꢆꢎꢅꢉꢂꢃꢄꢅꢆꢇꢃꢈꢆꢩꢉꢐꢇꢐꢊꢏꢏꢤꢉꢦꢃꢍꢒꢈꢐꢍꢉꢍꢈꢏꢅꢓꢊꢆꢎꢅꢩꢉꢑꢈꢓꢉꢃꢆꢑꢈꢓꢄꢊꢍꢃꢈꢆꢉꢔꢐꢓꢔꢈꢇꢅꢇꢉꢈꢆꢏꢤꢁ
ꢕꢃꢎꢓꢈꢎꢒꢃꢔ ꢣꢅꢎꢒꢆꢈꢏꢈꢚꢤ ꢂꢓꢊꢦꢃꢆꢚ ꢡꢗꢞꢼꢀꢀꢀꢠ
2009-2011 Microchip Technology Inc.
DS22141B-page 19
MCP6L91/1R/2/4
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS22141B-page 20
2009-2011 Microchip Technology Inc.
MCP6L91/1R/2/4
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2009-2011 Microchip Technology Inc.
DS22141B-page 21
MCP6L91/1R/2/4
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS22141B-page 22
2009-2011 Microchip Technology Inc.
MCP6L91/1R/2/4
ꢝꢁꢂꢃꢄꢅꢆꢇꢈꢄꢉꢊꢋꢌꢆꢍꢎꢄꢈꢈꢆꢏꢐꢊꢈꢋꢑꢃꢆꢕꢍꢛꢖꢆꢡꢆꢛꢄꢓꢓꢔꢢꢣꢆꢙꢤꢥꢦꢆꢎꢎꢆꢧꢔꢅꢨꢆꢗꢍꢏꢩꢪꢚ
ꢛꢔꢊꢃꢜ ꢧꢈꢓꢉꢍꢒꢅꢉꢄꢈꢇꢍꢉꢎꢐꢓꢓꢅꢆꢍꢉꢔꢊꢎꢨꢊꢚꢅꢉꢋꢓꢊꢦꢃꢆꢚꢇꢩꢉꢔꢏꢅꢊꢇꢅꢉꢇꢅꢅꢉꢍꢒꢅꢉꢕꢃꢎꢓꢈꢎꢒꢃꢔꢉꢪꢊꢎꢨꢊꢚꢃꢆꢚꢉꢜꢔꢅꢎꢃꢑꢃꢎꢊꢍꢃꢈꢆꢉꢏꢈꢎꢊꢍꢅꢋꢉꢊꢍꢉ
ꢒꢍꢍꢔꢢꢫꢫꢦꢦꢦꢁꢄꢃꢎꢓꢈꢎꢒꢃꢔꢁꢎꢈꢄꢫꢔꢊꢎꢨꢊꢚꢃꢆꢚ
2009-2011 Microchip Technology Inc.
DS22141B-page 23
MCP6L91/1R/2/4
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS22141B-page 24
2009-2011 Microchip Technology Inc.
MCP6L91/1R/2/4
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2009-2011 Microchip Technology Inc.
DS22141B-page 25
MCP6L91/1R/2/4
ꢛꢔꢊꢃꢜ ꢧꢈꢓꢉꢍꢒꢅꢉꢄꢈꢇꢍꢉꢎꢐꢓꢓꢅꢆꢍꢉꢔꢊꢎꢨꢊꢚꢅꢉꢋꢓꢊꢦꢃꢆꢚꢇꢩꢉꢔꢏꢅꢊꢇꢅꢉꢇꢅꢅꢉꢍꢒꢅꢉꢕꢃꢎꢓꢈꢎꢒꢃꢔꢉꢪꢊꢎꢨꢊꢚꢃꢆꢚꢉꢜꢔꢅꢎꢃꢑꢃꢎꢊꢍꢃꢈꢆꢉꢏꢈꢎꢊꢍꢅꢋꢉꢊꢍꢉ
ꢒꢍꢍꢔꢢꢫꢫꢦꢦꢦꢁꢄꢃꢎꢓꢈꢎꢒꢃꢔꢁꢎꢈꢄꢫꢔꢊꢎꢨꢊꢚꢃꢆꢚ
DS22141B-page 26
2009-2011 Microchip Technology Inc.
MCP6L91/1R/2/4
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2009-2011 Microchip Technology Inc.
DS22141B-page 27
MCP6L91/1R/2/4
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS22141B-page 28
2009-2011 Microchip Technology Inc.
MCP6L91/1R/2/4
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2009-2011 Microchip Technology Inc.
DS22141B-page 29
MCP6L91/1R/2/4
NOTES:
DS22141B-page 30
2009-2011 Microchip Technology Inc.
MCP6L91/1R/2/4
APPENDIX A: REVISION HISTORY
Revision B (September 2011)
The following is the list of modifications:
1. Updated the value for the Current at Output and
Supply Pins parameter in the Section 1.1
“Absolute Maximum Ratings †”section.
2. Added Section 5.1 “SPICE Macro Model”.
Revision A (March 2009)
• Original Release of this Document.
2009-2011 Microchip Technology Inc.
DS22141B-page 31
MCP6L91/1R/2/4
NOTES:
DS22141B-page 32
2009-2011 Microchip Technology Inc.
MCP6L91/1R/2/4
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
Examples:
PART NO.
Device
X
/XX
a) MCP6L91T-E/OT: Tape and Reel,
Extended Temperature,
5LD SOT-23 package
b) MCP6L91T-E/MS: Tape and Reel,
Temperature
Range
Package
Extended Temperature,
8LD MSOP package.
c) MCP6L91T-E/SN: Tape and Reel,
Device:
MCP6L91T:
Single Op Amp (Tape and Reel)
(SOT-23, SOIC, MSOP)
Single Op Amp (Tape and Reel) (SOT-23)
Dual Op Amp (Tape and Reel)
(SOIC, MSOP)
Quad Op Amp (Tape and Reel)
(SOIC, TSSOP)
Extended Temperature,
8LD SOIC package.
MCP6L91RT:
MCP6L92T:
a) MCP6L91RT-E/OT: Tape and Reel,
MCP6L94T:
Extended Temperature,
5LD SOT-23 package.
a) MCP6L92T-E/MS: Tape and Reel,
Extended Temperature,
8LD MSOP package.
b) MCP6L92T-E/SN: Tape and Reel,
Temperature Range:
Package:
E
=
-40°C to +125°C
OT
MS
SN
SL
=
=
=
=
=
Plastic Small Outline Transistor (SOT-23), 5-lead
Plastic MSOP, 8-lead
Plastic SOIC, (3.99 mm body), 8-lead
Plastic SOIC (3.99 mm body), 14-lead
Plastic TSSOP (4.4mm body), 14-lead
Extended Temperature,
8LD SOIC package.
a) MCP6L94T-E/SL: Tape and Reel,
Extended Temperature,
14LD SOIC package.
ST
b) MCP6L94T-E/ST: Tape and Reel,
Extended Temperature,
14LD TSSOP package.
2009-2011 Microchip Technology Inc.
DS22141B-page 33
MCP6L91/1R/2/4
NOTES:
DS22141B-page 34
2009-2011 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART,
32
PIC logo, rfPIC and UNI/O are registered trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,
MXDEV, MXLAB, SEEVAL and The Embedded Control
Solutions Company are registered trademarks of Microchip
Technology Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, chipKIT,
chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net,
dsPICworks, dsSPEAK, ECAN, ECONOMONITOR,
FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP,
Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB,
MPLINK, mTouch, Omniscient Code Generation, PICC,
PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE,
rfLAB, Select Mode, Total Endurance, TSHARC,
UniWinDriver, WiperLock and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2009-2011, Microchip Technology Incorporated, Printed in
the U.S.A., All Rights Reserved.
Printed on recycled paper.
ISBN: 978-1-61341-623-5
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
2009-2011 Microchip Technology Inc.
DS22141B-page 35
Worldwide Sales and Service
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://www.microchip.com/
support
Asia Pacific Office
Suites 3707-14, 37th Floor
Tower 6, The Gateway
Harbour City, Kowloon
Hong Kong
Tel: 852-2401-1200
Fax: 852-2401-3431
India - Bangalore
Tel: 91-80-3090-4444
Fax: 91-80-3090-4123
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
India - New Delhi
Tel: 91-11-4160-8631
Fax: 91-11-4160-8632
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
India - Pune
Tel: 91-20-2566-1512
Fax: 91-20-2566-1513
Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
Web Address:
www.microchip.com
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Japan - Yokohama
Tel: 81-45-471- 6166
Fax: 81-45-471-6122
Atlanta
Duluth, GA
Tel: 678-957-9614
Fax: 678-957-1455
China - Beijing
Tel: 86-10-8569-7000
Fax: 86-10-8528-2104
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Korea - Daegu
Tel: 82-53-744-4301
Fax: 82-53-744-4302
China - Chengdu
Tel: 86-28-8665-5511
Fax: 86-28-8665-7889
Boston
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Korea - Seoul
China - Chongqing
Tel: 86-23-8980-9588
Fax: 86-23-8980-9500
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
China - Hangzhou
Tel: 86-571-2819-3187
Fax: 86-571-2819-3189
Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
Fax: 60-3-6201-9859
UK - Wokingham
Tel: 44-118-921-5869
Fax: 44-118-921-5820
Cleveland
Independence, OH
Tel: 216-447-0464
Fax: 216-447-0643
China - Hong Kong SAR
Tel: 852-2401-1200
Fax: 852-2401-3431
Malaysia - Penang
Tel: 60-4-227-8870
Fax: 60-4-227-4068
Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
China - Nanjing
Tel: 86-25-8473-2460
Fax: 86-25-8473-2470
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
Detroit
Farmington Hills, MI
Tel: 248-538-2250
Fax: 248-538-2260
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
Taiwan - Hsin Chu
Tel: 886-3-5778-366
Fax: 886-3-5770-955
Indianapolis
Noblesville, IN
Tel: 317-773-8323
Fax: 317-773-5453
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
Taiwan - Kaohsiung
Tel: 886-7-536-4818
Fax: 886-7-330-9305
Los Angeles
China - Shenzhen
Tel: 86-755-8203-2660
Fax: 86-755-8203-1760
Taiwan - Taipei
Tel: 886-2-2500-6610
Fax: 886-2-2508-0102
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
Santa Clara
Santa Clara, CA
Tel: 408-961-6444
Fax: 408-961-6445
China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
Toronto
Mississauga, Ontario,
Canada
China - Xiamen
Tel: 905-673-0699
Fax: 905-673-6509
Tel: 86-592-2388138
Fax: 86-592-2388130
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
08/02/11
DS22141B-page 36
2009-2011 Microchip Technology Inc.
相关型号：
MCP6N11-001E/SN
INSTRUMENTATION AMPLIFIER, 3000 uV OFFSET-MAX, 35 MHz BAND WIDTH, PDSO8, 3.90 MM, PLASTIC, SOIC-8
MICROCHIP
©2020 ICPDF网 联系我们和版权申明