MCP73855T-I/ML [MICROCHIP]
POWER SUPPLY SUPPORT CKT;
| 型号： | MCP73855T-I/ML |
| 厂家： | 
MICROCHIP |
| 描述： | POWER SUPPLY SUPPORT CKT 光电二极管 |
| 文件： | 总32页 (文件大小：876K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MCP73853/55
USB Compatible Li-Ion/Li-Polymer
Charge Management Controllers
Features
Description
• Linear Charge Management Controllers
- Integrated Pass Transistor
The MCP7385X devices are highly-advanced, linear
charge management controllers, for use in space-
limited, cost-sensitive applications. The MCP73853
combines high-accuracy constant-voltage, constant-
current regulation, cell preconditioning, cell temperature
monitoring, advanced safety timers, automatic charge
termination, internal current sensing, reverse blocking
protection and charge status and fault indication in a
space-saving 16-lead, 4x4 QFN package.
- Integrated Current Sense
- Reverse Blocking Protection
• High-Accuracy Preset Voltage Regulation: + 0.5%
• Two Selectable Voltage Regulation Options:
- 4.1V, 4.2V
• Programmable Charge Current
The MCP73855 employs all the features of the
MCP73853, with the exception of the cell temperature
monitor and one status output. The MCP73855 is
offered in a space-saving 10-lead, 3x3 DFN package.
• USB Compatible Charge Current Settings
• Programmable Safety Charge Timers
• Preconditioning of Deeply Depleted Cells
• Automatic End-of-Charge Control
• Optional Continuous Cell Temperature Monitoring
The MCP73853 and MCP73855 are designed
specifically for USB applications, adhering to all the
specifications governing the USB power bus.
MCP73853
The MCP7385X devices provide two selectable
voltage regulation options (4.1V or 4.2V) for use with
either coke or graphite anodes.
• Charge Status Output for Direct LED Drive
• Fault Output for Direct LED Drive
These devices have complete and fully-functional,
charge management solutions, operating with an input
voltage range of 4.5V to 5.5V. These are fully specified
over the ambient temperature range of -40°C to +85°C.
MCP73853
• Automatic Power-Down
• Thermal Regulation
• Temperature Range: -40°C to +85°C
Package Types
• Packaging:
MCP73853
4x4 QFN*
- 16-Lead, 4x4 mm QFN (MCP73853)
- 10-Lead, 3x3 mm DFN (MCP73855)
16 15 14 13
V
V
V
V
V
V
1
12
11
10
9
SET
BAT3
Applications
2
3
4
DD1
DD2
BAT2
BAT1
SS3
EP
17
• Lithium-Ion/Lithium-Polymer Battery Chargers
• Personal Data Assistants (PDAs)
• Cellular Telephones
V
V
SS1
5
6
7
8
• Hand-Held Instruments
• Cradle Chargers
MCP73855
3x3 DFN*
• Digital Cameras
STAT1
EN
V
1
2
10
9
• MP3 Players
V
• Bluetooth Headsets
SET
BAT2
EP
11
V
V
V
3
4
5
8
7
6
• USB Chargers
DD1
BAT1
SS2
V
SS1
TIMER
PROG
*Exposed Pad (EP) is at VSS potential.
2004-2013 Microchip Technology Inc.
DS21915C-page 1
MCP73853/55
Typical Application
400 mA Lithium-Ion Battery Charger
3
2
8
9
VDD1
VSET
EN
VBAT1
VBAT2
5V
4.7 µF
4.7 µF
10
1
STAT1
+
–
Single
Lithium-Ion
Cell
6
TIMER
VSS
0.1 µF
4, 7
5
PROG
MCP73855
Functional Block Diagram
Direction
Control
VDD1
VBAT1
VBAT2
VDD2
VDD
G = 0.001
4 k
VREF
Charge Current
Control Amplifier
90
3 k
k
PROG
Voltage Control
+
Amplifier
+
–
11 k
–
Charge
VREF
10 k
VREF
VBAT3
Termination
Comparator
110 k
Precondition
Comp.
+
Charge_OK
Precon.
600 k
149 k
IREG/12
Precondition
Control
+
–
–
10 k
UVLO
COMPARATOR
+
–
Constant-voltage/
Recharge Comp.
VUVLO
+
–
1.58 k
300 k
EN
Power-On
Delay
VREF
VUVLO
VREF(1.2V)
Bias and
Reference
Generator
VSET
10.3 k
VSS1
VSS2
VSS3
THREF
THERM
Temperature
Comparators
100 k
STAT1
+
-
Drv Stat 1
Drv Stat 2
Charge Control,
Charge Timers,
and
50 k
50 k
STAT2
IREG/12
Oscillator
+
-
Status Logic
MCP73853 ONLY
MCP73853 ONLY
Charge_OK
TIMER
DS21915C-page 2
2004-2013 Microchip Technology Inc.
MCP73853/55
*Notice: Stresses above those listed under “Maximum
Ratings” may cause permanent damage to the device. This is
a stress rating only and functional operation of the device at
those or any other conditions above those indicated in the
operational listings of this specification is not implied.
Exposure to maximum rating conditions for extended periods
may affect device reliability.
1.0
ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings*
V
.............................................................................6.5V
DD1,2
All Inputs and Outputs w.r.t. VSS ..............-0.3 to (VDD + 0.3)V
Maximum Junction Temperature, TJ ............Internally Limited
Storage temperature .....................................-65°C to +150°C
ESD protection on all pins:
Human Body Model (1.5k in Series with 100pF)4 kV
Machine Model (200pF, No Series Resistance) ..........400V
DC CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, all limits apply for VDD = [VREG(Typ) + 0.3V] to 5.5V,
TA = -40°C to 85°C. Typical values are at +25°C, VDD = [VREG (Typ) + 1.0V]
Parameters
Supply Input
Sym
Min
Typ
Max Units
Conditions
Supply Voltage
Supply Current
VDD
ISS
4.5
—
—
5.5
4
V
0.28
0.83
4.45
4.40
µA Disabled
mA Operating
—
4
UVLO Start Threshold
UVLO Stop Threshold
VSTART
VSTOP
4.25
4.20
4.65
4.55
V
V
VDD Low-to-High
VDD High-to-Low
Voltage Regulation (Constant-Voltage Mode)
Regulated Output Voltage
VREG
4.079
4.179
4.1
4.2
4.121
4.221
V
V
VSET = VSS
VSET = VDD
VDD = [VREG(Typ) + 1V],
I
OUT = 10 mA, TA = -5°C to +55°C
Line Regulation
VBAT
VBAT)| /VDD
/
—
—
0.020
0.022
0.25
0.25
%/V VDD = [VREG(Typ) + 1V] to 5.5V
IOUT = 10 mA
Load Regulation
VBAT/VBAT
|
%
IOUT = 10 mA to 150 mA
VDD = [VREG(Typ) + 1V]
Supply Ripple Attenuation
PSRR
—
—
—
—
50
26
—
—
—
1
dB IOUT = 10 mA, 10 Hz to 1 kHz
dB
dB
µA
I
I
OUT = 10 mA, 10 Hz to 10 kHz
OUT = 10 mA, 10 Hz to 1 MHz
24
0.24
Output Reverse-Leakage
Current
IDISCHARGE
VDD < VBAT = VREG(Typ)
Current Regulation (Fast Charge Constant-Current Mode)
Fast Charge Current
Regulation
IREG
70
85
100
475
mA PROG = OPEN
mA PROG = VSS
TA = -5°C to +55°C
325
400
Preconditioning Current Regulation (Trickle Charge Constant-Current Mode)
Precondition Current
Regulation
IPREG
5
9
15
75
mA PROG = OPEN
mA PROG = VSS
TA = -5°C to +55°C
25
40
Precondition Threshold
Voltage
VPTH
2.70
2.75
2.80
2.85
2.90
2.95
V
V
VSET = VSS
VSET = VDD
VBAT Low-to-High
2004-2013 Microchip Technology Inc.
DS21915C-page 3
MCP73853/55
DC CHARACTERISTICS (Continued)
Electrical Specifications: Unless otherwise indicated, all limits apply for VDD = [VREG(Typ) + 0.3V] to 5.5V,
TA = -40°C to 85°C. Typical values are at +25°C, VDD = [VREG (Typ) + 1.0V]
Parameters
Sym
Min
Typ
Max Units
Conditions
Charge Termination
Charge Termination Current
ITERM
3.7
18
6.5
32
9.3
46
mA PROG = OPEN
mA PROG = VSS
TA = -5°C to +55°C
Automatic Recharge
Recharge Threshold Voltage
VRTH
VREG – VREG – VREG
–
V
VBAT High-to-Low
300mV 200mV 100mV
Thermistor Reference - MCP73853
Thermistor Reference
Output Voltage
VTHREF
2.475
200
—
2.55
—
2.625
—
V
TA = 25°C, VDD = VREG(Typ) + 1V,
ITHREF = 0 mA
Thermistor Reference
Source Current
ITHREF
µA
Thermistor Reference Line
Regulation
V
/
0.05
0.02
0.25
0.10
%/V VDD = [VREG (Typ) + 1V] to 5.5V
THREF
V
)|/V
THREF
DD
/
VTHREF
VTHREF|
%
Thermistor Reference Load
Regulation
ITHREF = 0 mA to 0.20 mA
Thermistor Comparator - MCP73853
Upper Trip Threshold
Upper Trip Point Hysteresis
Lower Trip Threshold
Lower Trip Point Hysteresis
Input Bias Current
VT1
VT1HYS
VT2
1.18
—
1.25
-50
0.62
80
1.32
—
V
mV
V
0.59
—
0.66
—
VT2HYS
IBIAS
mV
A
—
—
2
Status Indicator – STAT1, STAT2
Sink Current
ISINK
VOL
ILK
4
8
12
400
1
mA
Low Output Voltage
Input Leakage Current
Enable Input
—
—
200
0.01
mV ISINK = 1 mA
A ISINK = 0 mA, VSTAT1,2 = 5.5V
Input High Voltage Level
Input Low Voltage Level
Input Leakage Current
Thermal Shutdown
Die Temperature
VIH
VIL
ILK
1.4
—
—
—
—
0.8
1
V
V
—
0.01
A VENABLE = 5.5V
TSD
—
—
155
10
—
—
°C
°C
Die Temperature Hysteresis
TSDHYS
DS21915C-page 4
2004-2013 Microchip Technology Inc.
MCP73853/55
AC CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, all limits apply for VDD = [VREG (Typ) + 0.3V] to 5.5V,
TA = -40°C to 85°C. Typical values are at +25°C, VDD = [VREG (Typ) + 1.0V]
Parameters
Sym
Min
Typ
Max
Units
Conditions
VDD Low-to-High
UVLO Start Delay
tSTART
—
—
5
ms
Current Regulation
Transition Time Out of
Preconditioning
tDELAY
tRISE
—
—
—
—
1
1
ms
ms
VBAT < VPTH to VBAT > VPTH
IOUT Rising to 90% of IREG
Current Rise Time Out of
Preconditioning
Fast Charge Safety Timer
Period
tFAST
1.1
1.5
1.9
Hours CTIMER = 0.1 µF
Minutes CTIMER = 0.1 µF
Hours CTIMER = 0.1 µF
Preconditioning Current Regulation
Preconditioning Charge
Safety Timer Period
tPRECON
45
60
3
75
Charge Termination
Elapsed Time Termination
Period
tTERM
2.2
3.8
Status Indicators
Status Output Turn-off
Status Output Turn-on
tOFF
tON
—
—
—
—
200
200
µs
µs
ISINK = 1 mA to 0 mA
ISINK = 0 mA to 1 mA
TEMPERATURE SPECIFICATIONS
Electrical Specifications: Unless otherwise indicated, all limits apply for VDD = [VREG (Typ) + 0.3V] to 5.5.
Typical values are at +25°C, VDD = [VREG (Typ) + 1.0V]
Parameters
Temperature Ranges
Sym
Min
Typ
Max
Units
Conditions
Specified Temperature Range
Operating Temperature Range
Storage Temperature Range
Thermal Package Resistances
TA
TJ
TA
-40
-40
-65
—
—
—
+85
+125
+150
°C
°C
°C
4-Layer JC51-7
Thermal Resistance, 16-L, 4mm x 4mm QFN
Thermal Resistance, 10-L, 3mm x 3mm DFN
JA
—
—
37
51
—
—
°C/W Standard Board,
Natural Convection
4-Layer JC51-7
°C/W Standard Board,
Natural Convection
JA
2004-2013 Microchip Technology Inc.
DS21915C-page 5
MCP73853/55
NOTES:
DS21915C-page 6
2004-2013 Microchip Technology Inc.
MCP73853/55
2.0
TYPICAL PERFORMANCE CURVES
Note:
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
NOTE: Unless otherwise indicated, VDD = [VREG(Typ) + 1V], IOUT = 10 mA and TA= +25°C.
4.250
4.230
4.210
4.190
4.170
4.150
1.00
0.90
0.80
0.70
0.60
0.50
0.40
0.30
0.20
VSET = VDD
VDD = 5.2 V
VSET = VDD
VDD = 5.2 V
0
50 100 150 200 250 300 350 400
0
50 100 150 200 250 300 350 400
IOUT (mA)
I
OUT (mA)
FIGURE 2-1:
Battery Regulation Voltage
FIGURE 2-4:
Supply Current (I ) vs.
SS
(V
) vs. Charge Current (I
).
Charge Current (I
).
BAT
OUT
OUT
4.250
4.230
4.210
4.190
4.170
4.150
1.00
0.90
0.80
0.70
0.60
0.50
0.40
0.30
0.20
VSET = VDD
IOUT = 375 mA
VSET = VDD
IOUT = 375 mA
4.5
4.7
4.9
5.1
DD (V)
5.3
5.5
4.5
4.7
4.9
5.1
5.3
5.5
V
VDD (V)
FIGURE 2-2:
Battery Regulation Voltage
FIGURE 2-5:
Supply Current (I ) vs.
SS
(V
) vs. Supply Voltage (V ).
Supply Voltage (V ).
BAT
DD
DD
4.250
4.230
4.210
4.190
4.170
4.150
1.00
0.90
0.80
0.70
0.60
0.50
0.40
0.30
0.20
VSET = VDD
IOUT = 10 mA
VSET = VDD
IOUT = 10 mA
4.5
4.7
4.9
5.1
DD (V)
5.3
5.5
4.5
4.7
4.9
5.1
5.3
5.5
V
VDD (V)
FIGURE 2-3:
Battery Regulation Voltage
FIGURE 2-6:
Supply Current (I ) vs.
SS
(V ) vs. Supply Voltage (V ).
Supply Voltage (V ).
BAT
DD
DD
NOTE: Unless otherwise indicated, VDD = [VREG(Typ) + 1V], IOUT = 10 mA and TA= +25°C.
2004-2013 Microchip Technology Inc.
DS21915C-page 7
MCP73853/55
0.45
0.40
0.35
0.30
0.25
0.20
0.15
0.10
0.05
0.00
1.00
0.90
0.80
0.70
0.60
0.50
0.40
0.30
0.20
VSET = VDD
VDD = VSS
VSET = VDD
IOUT = 10 mA
+85°C
+25°C
-40°C
2.0
2.4
2.8
3.2
3.6
4.0
4.4
VBAT (V)
TA (°C)
FIGURE 2-7:
Output Leakage Current
).
FIGURE 2-10:
Ambient Temperature (T ).
Supply Current (I ) vs.
SS
(I
) vs. Battery Voltage (V
DISCHARGE
BAT
A
2.575
2.565
2.555
2.545
2.535
4.250
4.230
4.210
4.190
4.170
4.150
MCP73853
VSET = VDD
ITHREF = 100 µA
VSET = VDD
IOUT = 10 mA
2.525
4.5
4.7
4.9
5.1
DD (V)
5.3
5.5
V
TA (°C)
FIGURE 2-8:
Thermistor Reference
) vs. Supply Voltage (V ).
FIGURE 2-11:
(V
Battery Regulation Voltage
Voltage (V
) vs. Ambient Temperature (T ).
THREF
DD
BAT
A
2.575
2.565
2.555
2.545
2.535
2.525
2.575
2.565
2.555
2.545
2.535
2.525
MCP73853
VSET = VDD
ITHREF = 100 µA
MCP73853
SET = VDD
V
0
25
50
75 100 125 150 175 200
THREF (µA)
I
TA (°C)
FIGURE 2-9:
Thermistor Reference
) vs. Thermistor Bias Current
FIGURE 2-12:
Voltage (V
Thermistor Reference
) vs. Ambient Temperature (T ).
Voltage (V
THREF
THREF
A
(I
).
THREF
NOTE: Unless otherwise indicated, VDD = [VREG(Typ) + 1V], IOUT = 10 mA and TA= +25°C.
DS21915C-page 8
2004-2013 Microchip Technology Inc.
MCP73853/55
FIGURE 2-13:
Line Transient Response.
FIGURE 2-16:
Line Transient Response.
FIGURE 2-14:
Load Transient Response.
FIGURE 2-17:
Load Transient Response.
0
0
-10
-20
-30
-40
-50
-60
-70
MCP73853
VDD = 5.2 V
AC = 100 mVp-p
OUT = 10 mA
COUT = 10 F, Ceramic
-10
-20
-30
-40
-50
-60
-70
V
I
MCP73853
VDD = 5.2 V
VAC = 100 mVp-p
I
OUT = 100 mA
COUT = 10 F, X7R, Ceramic
-80
0.01
0.1
1
10
100
1000
0.01
0.1
1
10
100
1000
Frequency (kHz)
Frequency (kHz)
FIGURE 2-15:
Power Supply Ripple
FIGURE 2-18:
Power Supply Ripple
Rejection.
Rejection.
NOTE: Unless otherwise indicated, VDD = [VREG(Typ) + 1V], IOUT = 10 mA, and TA= +25°C.
2004-2013 Microchip Technology Inc.
DS21915C-page 9
MCP73853/55
500
400
300
200
100
0
300
295
290
285
280
275
270
265
260
255
250
VSET = VDD
VSET = VDD
RPROG = 1.6 k
OPEN
4.8K
1.6K
536
0
TA (°C)
RPROG ()
FIGURE 2-19:
Charge Current (I
) vs.
FIGURE 2-20:
Charge Current (I
) vs.
OUT
OUT
Programming Resistor (R
).
Ambient Temperature (T ).
PROG
A
DS21915C-page 10
2004-2013 Microchip Technology Inc.
MCP73853/55
3.0
PIN DESCRIPTION
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
MCP73853
PIN FUNCTION TABLE
MCP73855
Sym
Description
1
2
2
3
VSET
VDD1
Voltage Regulation Selection
Battery Management Input Supply
Battery Management Input Supply
Battery Management 0V Reference
Current Regulation Set
3
—
4
VDD2
4
VSS1
5
5
PROG
THREF
THERM
TIMER
VSS3
6
—
—
6
Cell Temperature Sensor Bias
Cell Temperature Sensor Input
Timer Set
7
8
9
—
8
Battery Management 0V Reference
Battery Charge Control Output
Battery Charge Control Output
Battery Voltage Sense
10
11
12
13
14
15
16
17
VBAT1
VBAT2
VBAT3
VSS2
9
—
7
Battery Management 0V Reference
Logic Enable
10
—
1
EN
STAT2
STAT1
EP
Fault Status Output
Charge Status Output
11
Exposed Pad, VSS Potential
3.1
Voltage Regulation Selection
(VSET
3.7
Timer Set (TIMER)
)
All safety timers are scaled by CTIMER/0.1 µF.
Connect to VSS for 4.1V regulation voltage. Connect to
VDD for 4.2V regulation voltage.
3.8
Battery Charge Control Output
(VBAT1, VBAT2
)
3.2
Battery Management Input Supply
(VDD1, VDD2
Connect to positive terminal of battery. Drain terminal
of internal P-channel MOSFET pass transistor. Bypass
to VSS with a minimum of 4.7 µF to ensure loop stability
when the battery is disconnected.
)
A supply voltage of [VREG(Typ) + 0.3V] to 5.5V is
recommended. Bypass to VSS with a minimum of
4.7 µF.
3.9
Battery Voltage Sense (VBAT3)
3.3
Battery Management 0V Reference
(VSS1, VSS2, VSS3
Voltage sense input. Connect to positive terminal of
battery. A precision internal resistor divider regulates
)
the final voltage on this pin to VREG
.
Connect to negative terminal of battery.
3.4
Current Regulation Set (PROG)
3.10 Logic Enable (EN)
Preconditioning, fast and termination currents are
scaled by placing a resistor from PROG to VSS
Input to force charge termination, initiate charge, clear
faults or disable automatic recharge.
.
3.5
Cell Temperature Sensor Bias
(THREF)
3.11 Fault Status Output (STAT2)
Current-limited, open-drain drive for direct connection
to an LED for charge status indication. Alternatively, a
pull-up resistor can be applied for interfacing to a host
microcontroller.
THREF is a voltage reference to bias external
thermistor for continuous cell temperature monitoring
and pre-qualification.
3.6
Cell Temperature Sensor Input
(THERM)
3.12 Charge Status Output (STAT1)
Current-limited, open-drain drive for direct connection
to a LED for charge status indication. Alternatively, a
pull-up resistor can be applied for interfacing to a host
microcontroller.
Input for an external thermistor for continuous cell-
temperature monitoring and prequalification. Connect
to THREF/3 to disable temperature sensing.
2004-2013 Microchip Technology Inc.
DS21915C-page 11
MCP73853/55
NOTES:
DS21915C-page 12
2004-2013 Microchip Technology Inc.
MCP73853/55
With VSET tied to VSS, the MCP7385X devices regulate
to 4.1V or with VSET tied to VDD, the MCP7385X
devices regulate to 4.2V.
4.0
DEVICE OVERVIEW
The MCP7385X devices are highly-advanced, linear
charge management controllers. For more information,
refer to the “Functional Block Diagram” on page 2.
Figure 4-2 depicts the operational flow algorithm from
charge initiation to completion and automatic recharge.
4.4
Charge Cycle Completion and
Automatic Recharge
The MCP7385X devices monitor the charging current
during the Constant-voltage Regulation mode. The
charge cycle is considered complete when either the
charge current has diminished below approximately
7% of the regulation current (IREG) or the elapsed timer
has expired.
4.1
Charge Qualification and
Preconditioning
Upon insertion of a battery or application of an external
supply, the MCP7385X devices automatically perform a
series of safety checks to qualify the charge. The input
source voltage must be above the Undervoltage Lock-
out (UVLO) threshold, the enable pin must be above the
logic high level, and the cell temperature monitor must
be within the upper and lower thresholds (MCP73853
only). The qualification parameters are continuously
monitored, with any deviation beyond the limits automat-
ically suspending or terminating the charge cycle. The
input voltage must deviate below the UVLO stop
threshold for at least one clock period to be considered
valid.
Assuming all the qualification parameters are met, the
MCP7385X devices automatically begin a new charge
cycle when the battery voltage falls below the recharge
threshold (VRTH).
4.5
Thermal Regulation
The MCP7385X devices limit the charge current based
on the die temperature. Thermal regulation optimizes
the charge cycle time while maintaining device reliabil-
ity. If thermal regulation is entered, the timer is automat-
ically slowed down to ensure that a charge cycle does
not terminate prematurely. Figure 4-1 depicts the
thermal regulation.
Once the qualification parameters have been met, the
MCP7385X devices initiate a charge cycle. The charge
status output is pulled low throughout the charge cycle
(see Table 5-1 and Table 5-2 for charge status out-
puts). If the battery voltage is below the preconditioning
threshold (VPTH), the MCP7385X devices precondition
the battery with a trickle charge. The preconditioning
current is set to approximately 10% of the fast charge
regulation current. The preconditioning trickle charge
safely replenishes deeply depleted cells and minimizes
heat dissipation during the initial charge cycle. If the
battery voltage has not exceeded the preconditioning
threshold before the preconditioning timer has expired,
a fault is indicated and the charge cycle is terminated.
4.2
Constant Current Regulation –
Fast Charge
FIGURE 4-1:
Current vs. Junction Temperature.
Typical Maximum Charge
Preconditioning ends and fast charging begins when
the battery voltage exceeds the preconditioning thresh-
old. Fast charge regulates to a constant current (IREG),
which is set via an external resistor connected to the
PROG pin. Fast charge continues until either the
4.6
Thermal Shutdown
The MCP7385X devices suspend charge if the die
temperature exceeds 155°C. Charging resumes when
the die temperature has cooled by approximately 10°C.
The thermal shutdown is a secondary safety feature in
the event that there is a failure within the thermal
regulation circuitry.
battery voltage reaches the regulation voltage (VREG
or the fast charge timer expires; in which case, a fault
is indicated and the charge cycle is terminated.
)
4.3
Constant Voltage Regulation
When the battery voltage reaches the regulation volt-
age (VREG), constant voltage regulation begins. The
MCP7385X devices monitor the battery voltage at the
VBAT pin. This input is tied directly to the positive termi-
nal of the battery. The MCP7385X devices select the
voltage regulation value based on the state of VSET
.
2004-2013 Microchip Technology Inc.
DS21915C-page 13
MCP73853/55
FIGURE 4-2:
Operational Flow Algorithm.
DS21915C-page 14
2004-2013 Microchip Technology Inc.
MCP73853/55
Figure 6-1 depicts a typical application circuit with
connection of the THERM input. The resistor values of
RT1 and RT2 are calculated with the following
equations:
5.0
DETAILED DESCRIPTION
5.1
Analog Circuitry
5.1.1
BATTERY MANAGEMENT INPUT
For NTC thermistors:
SUPPLY (V
, V
)
DD1
DD2
2 RCOLD RHOT
----------------------------------------------
RT1
=
=
The VDD pin is the input supply pin for the MCP7385X
devices. The MCP7385X devices automatically enter a
power-down mode if the voltage on the VDD input falls
below the UVLO voltage (VSTOP). This feature prevents
draining the battery pack when the VDD supply is not
present.
RCOLD – RHOT
2 RCOLD RHOT
----------------------------------------------
RT2
R
COLD – 3 RHOT
For PTC thermistors:
2 RCOLD RHOT
5.1.2
PROG INPUT
----------------------------------------------
RT1
=
R
HOT – RCOLD
Fast charge current regulation can be scaled by placing
a programming resistor (RPROG) from the PROG input
to VSS. Connecting the PROG input to VSS allows a
maximum fast charge current of 400 mA, typically. The
minimum fast charge current is 85 mA (Typ) and is set
by letting the PROG input float. Equation 5-1 calculates
2 RCOLD RHOT
----------------------------------------------
HOT – 3 RCOLD
RT2
=
R
Where:
the value for RPROG
.
RCOLD and RHOT are the thermistor
resistance values at the temperature window
of interest.
EQUATION 5-1:
13.32 – 33.3 IREG
-----------------------------------------------
14.1 IREG – 1.2
Applying a voltage equal to VTHREF/3 to the THERM
input disables temperature monitoring.
RPROG
=
Where:
5.1.5
TIMER SET INPUT (TIMER)
I
REG is the desired fast charge current in
The TIMER input programs the period of the safety tim-
ers by placing a timing capacitor (CTIMER) between the
TIMER input pin and VSS. Three safety timers are
programmed via the timing capacitor:
amps
RPROG is in kilohms.
The preconditioning safety timer period:
The preconditioning trickle charge current and the
charge termination current are scaled to approximately
10% and 7% of IREG, respectively.
CTIMER
------------------
1.0Hours
tPRECON
=
0.1F
5.1.3
CELL TEMPERATURE SENSOR
BIAS (THREF)
The fast charge safety timer period:
A 2.55V voltage reference is provided to bias an
external thermistor for continuous cell temperature
monitoring and prequalification. A ratiometric window
comparison is performed at threshold levels of
VTHREF/2 and VTHREF/4.
CTIMER
------------------
1.5Hours
tFAST
=
0.1F
And, the elapsed time termination period:
CTIMER
5.1.4
CELL TEMPERATURE SENSOR
INPUT (THERM)
------------------
3.0Hours
tTERM
=
0.1F
The MCP73853 continuously monitors temperature by
comparing the voltage between the THERM input and
VSS with the upper and lower temperature thresholds.
A negative or positive temperature coefficient, NTC or
PTC thermistor, and an external voltage divider
typically develop this voltage. The temperature-
sensing circuit has its own reference, to which it
performs a ratiometric comparison. Therefore, it is
immune to fluctuations in the supply input (VDD). The
temperature-sensing circuit is removed from the
system when VDD is not applied, eliminating additional
discharge of the battery pack.
The preconditioning timer starts after qualification and
resets when the charge cycle transitions to the
constant-current, fast charge phase. The fast charge
timer and the elapsed timer start after the MCP7385X
devices transition from preconditioning. The fast
charge timer resets when the charge cycle transitions
to the Constant-voltage mode. The elapsed timer
expires and terminates the charge if the sensed current
does not diminish below the termination threshold.
During thermal regulation, the timer is slowed down
proportional to the charge current.
2004-2013 Microchip Technology Inc.
DS21915C-page 15
MCP73853/55
5.1.6
BATTERY VOLTAGE SENSE (V
)
BAT3
TABLE 5-2:
STATUS OUTPUT – MCP73855
The MCP73853 monitors the battery voltage at the
VBAT3 pin. This input is tied directly to the positive
terminal of the battery pack.
CHARGE CYCLE STATE
STAT1
Qualification
OFF
ON
Preconditioning
Constant Current Fast Charge
Constant Voltage
Charge Complete
Fault
5.1.7
BATTERY CHARGE CONTROL
OUTPUT (V , V
ON
)
BAT2
BAT1
ON
The battery charge control output is the drain terminal of
an internal P-channel MOSFET. The MCP7385X
devices provide constant-current and constant-voltage
regulation to the battery pack by controlling this
MOSFET in the linear region. The battery charge
control output should be connected to the positive
terminal of the battery pack.
OFF
Flashing (1Hz,
50% duty cycle)
THERM Invalid
Flashing (1Hz,
50% duty cycle)
Disabled - Sleep mode
OFF
OFF
Input Voltage Disconnected
5.2
Digital Circuitry
Note:
OFF state: open-drain is high impedance;
ON state: open-drain can sink current, typ-
ically 7 mA; FLASHING: toggles between
OFF state and ON state.
5.2.1
CHARGE STATUS OUTPUTS
(STAT1, STAT2)
Two status outputs provide information on the state of
charge for the MCP73853. One status output provides
information on the state of charge for the MCP73855.
The current-limited, open-drain outputs can be used to
illuminate external LEDs. Optionally, a pull-up resistor
can be used on the output for communication with a
host microcontroller. Table 5-1 and Table 5-2 summa-
rize the state of the status outputs during a charge
cycle for the MCP73853 and MCP73855, respectively.
The flashing rate (1 Hz) is based on a timer capacitor
(CTIMER) of 0.1 µF. The rate varies based on the value
of the timer capacitor.
5.2.1.1
MCP73853 Only
STAT1 is on whenever the input voltage is above the
under voltage lockout, the device is enabled, and all
conditions are normal.
During a fault condition, the STAT1 status output is off
and the STAT2 status output flashes. To recover from a
fault condition, the input voltage must be removed and
then reapplied, or the enable input, EN, must be deas-
serted to a logic low, then asserted to a logic high.
TABLE 5-1: STATUS OUTPUTS – MCP73853
CHARGE
STAT1
STAT2
CYCLE STATE
Qualification
OFF
ON
OFF
OFF
OFF
When the voltage on the THERM input is outside the
preset window, the charge cycle will either not start or
be suspended. However, the charge cycle is not termi-
nated, with recovery being automatic. The charge cycle
resumes (or starts) once the THERM input is valid and
all other qualification parameters are met.
Preconditioning
Constant-
current Fast
Charge
ON
Constant-
voltage
ON
OFF
OFF
ON
5.2.2
V
INPUT
SET
Charge
Complete
Flashing (1 Hz,
50% duty cycle)
The VSET input selects the regulated output voltage of
the MCP7385X devices. With VSET tied to VSS, the
MCP7385X devices regulate to 4.1V. With VSET tied to
Fault
OFF
OFF
THERM Invalid
Flashing (1 Hz,
50% duty cycle)
VDD, the MCP7385X devices regulate to 4.2V.
Disabled -
Sleep mode
OFF
OFF
OFF
5.2.3 LOGIC ENABLE (EN)
The logic enable input pin (EN) can be used to termi-
nate a charge anytime during the charge cycle, initiate
a charge cycle or initiate a recharge cycle.
Input Voltage
Disconnected
OFF
Note:
OFF state: open-drain is high-impedance;
ON state: open-drain can sink current,
typically 7 mA; FLASHING: toggles
between OFF and ON states.
Applying a logic high input signal to the EN pin, or tying
it to the input source, enables the device. Applying a
logic low input signal disables the device and termi-
nates a charge cycle. When disabled, the device’s
supply current is reduced to 0.28 µA, typically.
DS21915C-page 16
2004-2013 Microchip Technology Inc.
MCP73853/55
cells. The algorithm uses a constant current followed
by a constant voltage charging method. Figure 6-1
depicts a typical stand-alone application circuit, while
Figure 6-2 and Figure 6-3 depict the accompanying
charge profile.
6.0
APPLICATIONS
The MCP7385X devices are designed to operate in
conjunction with a host microcontroller or in stand-
alone applications. The MCP7385X devices provide
the preferred charge algorithm for Li-Ion/Li-Polymer
Regulated Wall Cube
STAT1
EN
V
SS2
or
16 15 14 13
USB Power Bus
V
V
V
V
V
V
V
V
SET
DD1
DD2
SS1
BAT3
BAT2
BAT1
SS3
1
2
3
4
12
11
10
9
+
-
Single
Lithium-Ion
Cell
MCP73853
5
6
7
8
PROG
TIMER
C
R
TIMER
PROG
R
T1
R
T2
FIGURE 6-1:
Typical Application Circuit.
Preconditioning
Mode
Constant-current
Mode
Constant-voltage
Mode
Regulation
Voltage
(VREG
)
Regulation
Current
(IREG
)
Charge
Voltage
Transition
Threshold
(VPTH
)
Precondition
Current
Charge
Current
(IPREG
)
Termination
Current
(ITERM
)
Precondition
Safety Timer
Fast Charge
Safety Timer
Elapsed Time
Termination Timer
FIGURE 6-2:
Typical Charge Profile.
2004-2013 Microchip Technology Inc.
DS21915C-page 17
MCP73853/55
Preconditioning
Mode
Constant-current
Mode
Constant-voltage
Mode
Regulation
Voltage
(VREG
)
Regulation
Current
(IREG
)
Charge
Voltage
Transition
Threshold
(VPTH
)
Precondition
Current
Charge
Current
(IPREG
)
Termination
Current
(ITERM
)
Precondition
Safety Timer
Fast Charge
Safety Timer
Elapsed Time
Termination Timer
FIGURE 6-3:
Typical Charge Profile in Thermal Regulation.
DS21915C-page 18
2004-2013 Microchip Technology Inc.
MCP73853/55
6.1.1.3
EXTERNAL CAPACITORS
6.1
Application Circuit Design
Due to the low efficiency of linear charging, the most
important factors are thermal design and cost. These
are a direct function of the input voltage, output current
and thermal impedance between the battery charger
and the ambient cooling air. The worst-case situation
exists when the device has transitioned from the
Preconditioning mode to the Constant-current mode. In
this situation, the battery charger has to dissipate the
maximum power. A trade-off must be made between
the charge current, cost and thermal requirements of
the charger.
The MCP7385X devices are stable with or without a
battery load. To maintain good AC stability in the
Constant-voltage mode, a minimum capacitance of
4.7 µF is recommended to bypass the VBAT pin to VSS
.
This capacitance provides compensation when there is
no battery load. In addition, the battery and intercon-
nections appear inductive at high frequencies. These
elements are in the control feedback loop during
Constant-voltage mode. Therefore, the bypass
capacitance may be necessary to compensate for the
inductive nature of the battery pack.
Virtually any good quality output filter capacitor can be
used, independent of the capacitor’s minimum
Effective Series Resistance (ESR) value. The actual
value of the capacitor (and its associated ESR)
depends on the output load current. A 4.7 µF ceramic,
tantalum or aluminum electrolytic capacitor at the
output is usually sufficient to ensure stability for up to
the maximum output current.
6.1.1
COMPONENT SELECTION
Selection of the external components in Figure 6-1 is
crucial to the integrity and reliability of the charging
system. The following discussion is intended to be a
guide for the component selection process.
6.1.1.1
CURRENT PROGRAMMING RESISTOR
(RPROG
)
6.1.1.4
REVERSE BLOCKING PROTECTION
The preferred fast charge current for Lithium-Ion cells
is at the 1C rate, with an absolute maximum current at
the 2C rate. For example, a 500 mAh battery pack has
a preferred fast charge current of 500 mA. Charging at
this rate provides the shortest charge cycle times
without degradation to the battery pack performance or
life.
The MCP7385X devices provide protection from a
faulted or shorted input or from a reversed-polarity
input source. Without the protection, a faulted or
shorted input would discharge the battery pack through
the body diode of the internal pass transistor.
6.1.1.5
ENABLE INTERFACE
400 mA is the typical maximum charge current
obtainable from the MCP7385X devices. For this situa-
tion, the PROG input should be connected directly to
In the stand-alone configuration, the enable pin is gen-
erally tied to the input voltage. The MCP7385X devices
automatically enter a low power mode when voltage on
the VDD input falls below the UVLO voltage (VSTOP),
reducing the battery drain current to 0.28 µA, typically.
VSS
.
6.1.1.2
THERMAL CONSIDERATIONS
The worst-case power dissipation in the battery char-
ger occurs when the input voltage is at its maximum
and the device has transitioned from the
Preconditioning mode to the Constant-current mode. In
this case, the power dissipation is:
6.1.1.6
CHARGE STATUS INTERFACE
Two status outputs provide information on the state of
charge. The current-limited, open-drain outputs can be
used to illuminate external LEDs. Refer to Table 5-1
and Table 5-2 for a summary of the state of the status
output during a charge cycle.
PowerDissipation = V
– V
I
PTHMIN REGMAX
DDMAX
6.2
PCB Layout Issues
Where VDDMAX is the maximum input voltage, IREGMAX
is the maximum fast charge current, and VPTHMIN is the
minimum transition threshold voltage. Power
dissipation with a 5V, +/-10% input voltage source is:
For optimum voltage regulation, place the battery pack
as close as possible to the device’s VBAT and VSS pins.
It is recommended that the designer minimizes voltage
drops along the high-current-carrying PCB traces.
PowerDissipation = 5.5V – 2.7V 475mA = 1.33W
If the PCB layout is used as a heat sink, adding many
vias in the heat sink pad helps to conduct more heat to
the PCB backplane, thus reducing the maximum junc-
tion temperature.
With the battery charger mounted on a 1 in2 pad of
1 oz. copper, the junction temperature rise is approxi-
mately 50°C. This allows for a maximum operating
ambient temperature of 35°C before thermal regulation
is entered.
2004-2013 Microchip Technology Inc.
DS21915C-page 19
MCP73853/55
NOTES:
DS21915C-page 20
2004-2013 Microchip Technology Inc.
MCP73853/55
7.0
7.1
PACKAGING INFORMATION
Package Marking Information
10-Lead DFN (MCP73855) (3x3x0.9 mm)
Example
3855
I139
256
XXXX
YYWW
NNN
PIN 1
PIN 1
16-Lead QFN (MCP73853)
Example
PIN 1
PIN 1
73853
I/ML
1139
256
Legend: XX...X Customer specific information*
YY
Year code (last 2 digits of calendar year)
WW
NNN
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line thus limiting the number of available characters
for customer specific information.
*
Standard OTP marking consists of Microchip part number, year code, week code, and traceability code.
2004-2013 Microchip Technology Inc.
DS21915C-page 21
MCP73853/55
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS21915C-page 22
2004-2013 Microchip Technology Inc.
MCP73853/55
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2004-2013 Microchip Technology Inc.
DS21915C-page 23
MCP73853/55
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS21915C-page 24
2004-2013 Microchip Technology Inc.
MCP73853/55
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2004-2013 Microchip Technology Inc.
DS21915C-page 25
MCP73853/55
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS21915C-page 26
2004-2013 Microchip Technology Inc.
MCP73853/55
APPENDIX A: REVISION HISTORY
Revision C (April 2013)
Following is the list of modifications:
1. Updated Table 3-1 with the Exposed Pad
information.
2. Minor grammatical and spelling corrections.
Revision B (February 2012)
Following is the list of modifications:
3. Updated Section 7.1 “Package Marking
Information”.
Revision A (November 2004)
• Original Release of this Document.
2004-2013 Microchip Technology Inc.
DS21915C-page 27
MCP73853/55
NOTES:
DS21915C-page 28
2004-2013 Microchip Technology Inc.
MCP73853/55
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
Examples:
PART NO.
Device
X
XX
a)
MCP73853T-I/ML: Tape and Reel,
Temperature Package
Range
USB compatible charge
controller with tempera-
ture monitor
b)
MCP73853-I/ML: USB compatible charge
controller with tempera-
ture monitor
Device
MCP73853:
USB compatible charge controller with
temperature monitor
a)
b)
MCP73855T-I/MF: Tape and Reel,
USB compatible charge
controller
MCP73855-I/MF: USB compatible charge
controller
MCP73853T: USB compatible charge controller with
temperature monitor, Tape and Reel
MCP73855:
USB compatible charge controller
MCP73855T: USB compatible charge controller,
Tape and Reel
Temperature Range
Package
I
= -40C to +85C (Industrial)
ML
MF
=
Plastic Quad Flat No Lead, 4x4 mm Body (QFN),
16-Lead
=
Plastic Dual Flat No Lead, 3x3 mm Body (DFN),
10-Lead
2004-2013 Microchip Technology Inc.
DS21915C-page 29
MCP73853/55
NOTES:
DS21915C-page 30
2004-2013 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART,
PIC32 logo, rfPIC and UNI/O are registered trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,
MXDEV, MXLAB, SEEVAL and The Embedded Control
Solutions Company are registered trademarks of Microchip
Technology Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, BodyCom,
chipKIT, chipKIT logo, CodeGuard, dsPICDEM,
dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial
Programming, ICSP, Mindi, MiWi, MPASM, MPLAB Certified
logo, MPLIB, MPLINK, mTouch, Omniscient Code
Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit,
PICtail, REAL ICE, rfLAB, Select Mode, Total Endurance,
TSHARC, UniWinDriver, WiperLock and ZENA are
trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2004-2013, Microchip Technology Incorporated, Printed in
the U.S.A., All Rights Reserved.
Printed on recycled paper.
ISBN: 978-1-62077-162-4
QUALITYꢀMANAGEMENTꢀꢀSYSTEMꢀ
CERTIFIEDꢀBYꢀDNVꢀ
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
== ISO/TSꢀ16949ꢀ==ꢀ
2004-2013 Microchip Technology Inc.
DS21915C-page 31
Worldwide Sales and Service
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://www.microchip.com/
support
Asia Pacific Office
Suites 3707-14, 37th Floor
Tower 6, The Gateway
Harbour City, Kowloon
Hong Kong
Tel: 852-2401-1200
Fax: 852-2401-3431
India - Bangalore
Tel: 91-80-3090-4444
Fax: 91-80-3090-4123
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
India - New Delhi
Tel: 91-11-4160-8631
Fax: 91-11-4160-8632
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
India - Pune
Tel: 91-20-2566-1512
Fax: 91-20-2566-1513
Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
Web Address:
www.microchip.com
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Japan - Osaka
Tel: 81-66-152-7160
Fax: 81-66-152-9310
Atlanta
Duluth, GA
Tel: 678-957-9614
Fax: 678-957-1455
China - Beijing
Tel: 86-10-8569-7000
Fax: 86-10-8528-2104
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Japan - Yokohama
Tel: 81-45-471- 6166
Fax: 81-45-471-6122
China - Chengdu
Tel: 86-28-8665-5511
Fax: 86-28-8665-7889
Boston
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Korea - Daegu
Tel: 82-53-744-4301
Fax: 82-53-744-4302
China - Chongqing
Tel: 86-23-8980-9588
Fax: 86-23-8980-9500
Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
Korea - Seoul
China - Hangzhou
Tel: 86-571-2819-3187
Fax: 86-571-2819-3189
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
UK - Wokingham
Tel: 44-118-921-5869
Fax: 44-118-921-5820
Cleveland
Independence, OH
Tel: 216-447-0464
Fax: 216-447-0643
China - Hong Kong SAR
Tel: 852-2401-1200
Fax: 852-2401-3431
Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
Fax: 60-3-6201-9859
Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
China - Nanjing
Tel: 86-25-8473-2460
Fax: 86-25-8473-2470
Malaysia - Penang
Tel: 60-4-227-8870
Fax: 60-4-227-4068
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
Detroit
Farmington Hills, MI
Tel: 248-538-2250
Fax: 248-538-2260
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
Indianapolis
Noblesville, IN
Tel: 317-773-8323
Fax: 317-773-5453
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
Taiwan - Hsin Chu
Tel: 886-3-5778-366
Fax: 886-3-5770-955
Los Angeles
China - Shenzhen
Tel: 86-755-8203-2660
Fax: 86-755-8203-1760
Taiwan - Kaohsiung
Tel: 886-7-536-4818
Fax: 886-7-330-9305
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
Taiwan - Taipei
Tel: 886-2-2500-6610
Fax: 886-2-2508-0102
Santa Clara
Santa Clara, CA
Tel: 408-961-6444
Fax: 408-961-6445
China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
Toronto
Mississauga, Ontario,
Canada
China - Xiamen
Tel: 905-673-0699
Fax: 905-673-6509
Tel: 86-592-2388138
Fax: 86-592-2388130
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
11/29/11
DS21915C-page 32
2004-2013 Microchip Technology Inc.
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