MIC231560YML-T5_技术文档

MIC23156

1.5A, 3 MHz Synchronous Buck Regulator with HyperLight Load^®

and I²C Control for Dynamic Voltage Scaling

Features

General Description

• Input Voltage: 2.7V to 5.5V

• Up to 1.5A Output Current

• 1 MHz I²C Controlled Adjustable Output:

The MIC23156 is a high-efficiency, 1.5A synchronous

buck regulator with HyperLight Load^®mode and

dynamic voltage scaling control through I²C. HyperLight

Load provides very high efficiency at light loads and

ultra-fast transient response. The ability to dynamically

change the output voltage and maintain high output volt-

age accuracy make the MIC23156 perfectly suited for

supplying processor core voltages. An additional benefit

of this proprietary architecture is very low output ripple

voltage, throughout the entire load range, with the use of

small output capacitors. Fast mode plus I²C provides

output voltage and chip enable/disable control from a

standard I²C bus with I²C clock rates of 100 kHz,

400 kHz, and 1 MHz.

-

V_OUT= 0.7 to 2.4V in 10 mV Steps

• High Output Voltage Accuracy

(±1.5% over Temperature)

• Fast Pin-Selectable Output Voltage

• Programmable Soft-Start Using External Capaci-

tor

• Ultra-Low Quiescent Current of 30 µA when

Not Switching

• Thermal Shutdown and Current-Limit Protection

• Safe Start-Up into Pre-Biased Output

• Stable with 1 µH Output Inductor and

2.2 µF Ceramic Capacitor

The MIC23156 is designed for use with 1 µH, and an

output capacitor as small as 2.2 µF, that enables a total

solution size less than 1 mm in height.

• Up to 93% Peak Efficiency

• –40°C to +125°C Junction Temperature Range

Package Types

• Available in 16-ball, 0.4 mm pitch, 1.81 mm x

1.71 mm Wafer Level Chip-Scale (WLCSP) and

17-pin, 2.8 mm x 2.5 mm QFN Packages

16-Ball 1.81 mm x 1.71 mm WLCSP (CS)

(Top View)

1

2

3

4

Applications

SCL

SDA

SNS

SS

A

B

C

D

• Mobile Handsets

• Solid-State Drives (SSD)

• WiFi/WiMx/WiBro Modules

• Portable Applications

VI2C

SW

VSEL

SW

PGOOD

PVIN

AVIN

AGND

EN

PGND

PVIN

17-Pin 2.5 mm x 2.8 mm QFN (ML)

(Top View)

16

17

1

15

V_I2C

SCL

SDA

SNS

SS

PGND

PV_IN

V_SEL

2

3

4

5

6

14

13

12

11

10

NC

EN

9

8

7

 2017 Microchip Technology Inc.

DS20005919A-page 1

MIC23156

Typical Application Schematic

U1

APPLICATIONS

PROCESSOR

MIC23156

CORE

PV_IN

SW

V_IN

SUPPLY

SNS

AV_IN

PGOOD

V_SEL

POR

EN

V_SEL

V_I2C

EN

SS

V_I2C

SCL

PGND

I²C HIGH-SPEED

MODE BUS

SDA

AGND

Efficiency (V_OUT= 2.4V) vs. Output Current

100

90

80

70

V_IN= 3.6V

V_IN= 4.2V

V_IN= 5V

60

50

40

30

20

10

0

C_OUT= 2.2 µF

L = 1 µH

10

100

1000

10000

OUTPUT CURRENT (mA)

DS20005919A-page 2

 2017 Microchip Technology Inc.

MIC23156

1.0

ELECTRICAL CHARACTERISTICS

Absolute Maximum Ratings†

Input Supply Voltage (AV_IN, PV_IN, V_I2C)....................................................................................................... –0.3V to +6V

Switch Voltage (SW) ....................................................................................................................................–0.3V to AV_IN

Logic Voltage (EN, PGOOD)........................................................................................................................–0.3V to AV_IN

Logic Voltage (V_SEL, SCL, SDA)..................................................................................................................–0.3V to V_I2C

Analog Input Voltage (SNS, SS) ..................................................................................................................–0.3V to AV_IN

Power Dissipation (T_A= +70°C).............................................................................................................Internally Limited

ESD Rating⁽¹⁾.............................................................................................................................................................2 kV

†

Notice: Stresses above those listed under “Maximum Ratings” may cause permanent damage to the device. This

is a stress rating only and functional operation of the device at those or any other conditions above those indi-

cated in the operational sections of this specification is not intended. Exposure to maximum rating conditions for

extended periods may affect device reliability.

Note 1: Devices are ESD-sensitive. Handling precautions are recommended. Human body model, 1.5 k in series

with 100 pF.

Operating Ratings⁽¹⁾

Input Supply Voltage (AV_IN, PV_IN, V_I2C).................................................................................................... +2.7V to +5.5V

Switch Voltage (SW) .........................................................................................................................................0V to AV_IN

Logic Voltage (EN, PGOOD).............................................................................................................................0V to AV_IN

Logic Voltage (V_SEL, SCL, SDA).......................................................................................................................0V to V_I2C

Analog Input Voltage (SNS, SS) .......................................................................................................................0V to AV_IN

Note 1: The device is not ensured to function outside the operating range.

 2017 Microchip Technology Inc.

DS20005919A-page 3

MIC23156

(1)

TABLE 1-1:

ELECTRICAL CHARACTERISTICS

Electrical Specifications: unless otherwise specified, T = +25°C; AV = PV = V = V

= 3.6V; L = 1.0 µH; C

= 2.2

A

IN

EN

VI2C

OUT

µF. Boldface values indicate –40°C

 T_J +125°C.

Symbol Parameter

Min.

Typ.

Max.

Units

Test Conditions

V_IN

Supply Input Voltage Range

Enable Logic Pin Low Threshold

Enable Logic Pin High Threshold

V_SELLogic Pin Low Threshold

V_SELLogic Pin High Threshold

Logic Pin Input Current

2.7

—

0.1

5.5

V

—

EN_LOW

EN_HIGH

I_{VSEL_LO}

I_{VSEL_HI}

I_EN

0.5

Logic low

1.2

—

V

Logic high

—

0.3 x V_I2C

V

Logic low

0.7 x V_I2C

—

V

Logic high

2

µA

Pins: EN and V_SEL

Undervoltage Lockout

Threshold

UVLO

2.45

—

2.55

75

2.65

—

V

Rising

Undervoltage Lockout

Hysteresis

UVLO_HYS

T_SHD

mV Falling

Shutdown Temperature

(Threshold)

—

160

—

°C

—

Shutdown Temperature

Hysteresis

T_{SHD_HYST}

I_SHDN

—

20

—

5

°C

—

Shutdown Supply Current

0.1

µA

V_EN= 0V

DC-to-DC Converter

V_OUT

Output Voltage Accuracy

–1.5

—

30

+1.5

50

%

µA

V

V_OUT= 1V, I_OUT= 10 mA

I_OUT= 0 mA,

V_FB> 1.2 * V_OUT

I_Q

Quiescent Supply Current

Output Voltage Range

V_OUT

0.7

—

2.4

—

3.0V < V_AVIN< 4.5V,

I_LOAD= 10 mA

V_OUT/V_OUT

Output Voltage Line Regulation

Output Voltage Load Regulation

0.02

0.04

0.17

%/V

%

—

20 mA < I_OUT< 1A

I_SW= +100 mA, high-side

switch PMOS (QFN)

—

I_SW= +100 mA, high-side

switch PMOS (WLCSP)

—

0.15

0.13

—

R_SWON

Switch-On Resistance

Ω

I_SW= –100 mA, low-side

switch NMOS (QFN)

I_SW= –100 mA, low-side

switch NMOS (WLCSP)

I_LIM

f_SW

D_MAX

—

Current Limit (DC Value)

Oscillator Switching Frequency

Maximum Duty Cycle

DVS Step-Size

1.7

—

2.9

3

5.1

—

A

MHz

%

V_OUT= 1V

—

80

—

19

Frequency = 3 MHz

—

mV

V_OUT= 90%,

C_SS= 120 pF

t_SS

Soft Start Time

—

250

—

µs

Note 1: Specifications are for packaged product only.

DS20005919A-page 4

 2017 Microchip Technology Inc.

MIC23156

(1)

TABLE 1-1:

ELECTRICAL CHARACTERISTICS (CONTINUED)

Electrical Specifications: unless otherwise specified, T = +25°C; AV = PV = V = V

= 3.6V; L = 1.0 µH; C

= 2.2

A

IN

EN

VI2C

OUT

µF. Boldface values indicate –40°C

 T_J +125°C.

Symbol Parameter

Min.

Typ.

Max.

Units

Test Conditions

I²C Interface (Assuming 550 pF Total Bus Capacitance

10110111, 0xB7

10110110, 0xB6

Read (Binary, Hex)

Write (Binary, Hex)

SCL, SDA

I²C Address

—

V_IL

V_IH

Low-Level Input Voltage

High-Level Input Voltage

—

0.3 x V_I2C

V

0.7 x V_I2C

—

SCL, SDA

Open-drain pull-down on

SDA during read back,

I_SDA= 500 µA

R_{SDA_PD}

SDA Pull-Down Resistance

—

20

—

W

Power Good (PG)

V_OUT< 80% V_NOM

I_PGOOD= -500 µA

,

V_{PG_LOW}

I_{PG_LEAK}

V_{PG_TH}

PGOOD Output Low

—

86

—

100

—

5

—

5

mV

µA

%

PGOOD Output Leakage

PGOOD Threshold

V_OUT= V_NOM

96

—

V_OUTramping up

(% of V_OUT< V_NOM

)

V_{PG_HYS}

PGOOD Hysteresis

%

—

Note 1: Specifications are for packaged product only.

 2017 Microchip Technology Inc.

DS20005919A-page 5

MIC23156

TEMPERATURE SPECIFICATIONS (Note 1)

Parameters

Temperature Ranges

Symbol Min.

Typ.

Max.

Units

Conditions

Storage Temperature

T_S

—

T_J

–65

—

+150

+260

+125

°C

—

Lead Temperature

Soldering, 10 sec.

—

Junction Temperature Range

Package Thermal Resistances

Thermal Resistance WLCSP 16-Ball

Thermal Resistance QFN-17

–40

_JA

—

150

89

—

°C/W

—

Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable

junction temperature and the thermal resistance from junction to air (i.e., T_A, T_J, _JA). Exceeding the max-

imum allowable power dissipation will cause the device operating junction temperature to exceed the max-

imum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability.

DS20005919A-page 6

 2017 Microchip Technology Inc.

MIC23156

2.0

TYPICAL PERFORMANCE CURVES

Note: The graphs and tables provided following this note are a statistical summary based on a limited number of

samples and are provided for informational purposes only. The performance characteristics listed herein

are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified

operating range (e.g., outside specified power supply range) and therefore outside the warranted range.

100

90

80

70

60

50

40

30

20

10

0

10000000

1000000

100000

10000

1000

V_IN= 3.6V

V_IN= 4.2V

V_IN= 5V

100

C_OUT= 2.2 µF

L = 1 µH

V_OUT= 1.0V

C_OUT= 2.2 µF

10

100

1000

10000

100000 1000000

10

100

1000

10000

C_SS(pF)

OUTPUT CURRENT (mA)

FIGURE 2-1:

Efficiency (V

= 2.4V) vs.

FIGURE 2-4:

V

Rise Time vs. C

.

OUT

SS

Output Current.

100

90

3.2

3.1

3.0

2.9

2.8

2.7

2.6

80

V_IN= 5V

70

60

50

40

30

20

10

0

V_IN= 4.2V

V_IN= 3.6V

V_IN= 2.7V

C_OUT= 2.2 µF

L = 1 µH

T_A= 25\C

V_OUT= 1.0V

2.5

10

100

1000

10000

3

3.5

4

4.5

5

5.5

OUTPUT CURRENT (mA)

INPUT VOLTAGE (V)

FIGURE 2-2:

Efficiency (V

= 1.8V) vs.

FIGURE 2-5:

Current Limit vs. Input

OUT

Output Current.

Voltage.

3.2

3.1

3.0

2.9

2.8

2.7

2.6

2.5

100

90

80

70

60

50

40

30

20

10

0

V_IN= 5V

V_IN= 3.6V

V_IN= 2.7V

V_IN= 3.6V

C_OUT= 2.2 µF

L = 1 µH

V_OUT= 1.0V

-40 -20

0

20

40

60

80 100 120

10

100

1000

10000

TEMPERATURE (°C)

OUTPUT CURRENT (mA)

FIGURE 2-6:

Temperature.

Current Limit vs.

FIGURE 2-3:

Output Current.

Efficiency (V

= 1.0V) vs.

OUT

 2017 Microchip Technology Inc.

DS20005919A-page 7

MIC23156

1.9

1.875

1.85

1.825

1.8

45

40

35

30

25

20

15

10

125°C

125\C

25\C

25°C

I_OUT= 1 mA

I_OUT= 20 mA

1.775

1.75

1.725

1.7

--4400\°CC

I_OUT= 120 mA

NO SWITCHING

V_OUT> V_OUTNOM* 1.2

C_OUT= 2.2 µF

V_OUTNOM= 1.8V

C_OUT= 2.2 µF

2.5

3.0

3.5

4.0

4.5

5.0

5.5

2.5

3

3.5

4

4.5

5

5.5

INPUT VOLTAGE (V)

FIGURE 2-7:

Quiescent Current vs. Input

FIGURE 2-10:

Line Regulation (HLL).

Voltage.

1.9

1.875

1.85

30

25

20

15

10

5

1.825

1.8

1.775

1.75

V_IN= 3.6V

V_OUTNOM= 1.8V

1.725

V_OUT= 0V

C_OUT= 2.2 µF

1.7

0

250

500

750

1000 1250 1500

2.5

3

3.5

4

4.5

5 5.5

OUTPUT CURRENT (mA)

INPUT VOLTAGE (V)

FIGURE 2-11:

Load Regulation.

FIGURE 2-8:

Shutdown Current vs. Input

Voltage.

1.020

1.015

1.010

1.005

1.000

0.995

0.990

0.985

0.980

1.9

1.875

1.85

I_OUT= 1.5A

1.825

1.8

I_OUT= 1A

1.775

1.75

I_OUT= 300 mA

V_IN= 3.6V

_OUT= 1.0V

V_OUTNOM= 1.8V

C_OUT= 2.2 µF

V

1.725

I_OUT= 10 mA

1.7

2.5

-40 -20

0

20

40

60

80 100 120

3

3.5

4

4.5

5

5.5

TEMPERATURE (°C)

INPUT VOLTAGE (V)

FIGURE 2-12:

Temperature.

Output Voltage vs.

FIGURE 2-9:

Line Regulation (CCM).

DS20005919A-page 8

 2017 Microchip Technology Inc.

MIC23156

1.2

1.1

1

11

10.5

10

ENABLE RISING

ENABLE FALLING

0.9

0.8

0.7

0.6

0.5

9.5

9

I_OUT= 250 mA

C_OUT= 2.2 µF

2.5

3

3.5

4

4.5

5

5.5

0

25

50

75

100

125

150

175

INPUT VOLTAGE (V)

DAC VOLTAGE CODE

FIGURE 2-13:

Enable Threshold vs. Input

FIGURE 2-16:

 Output Voltage vs. DAC

Voltage.

DNL.

100%

95%

90%

85%

80%

75%

5

4

3

2

1

0

PGOOD RISING

PGOOD FALLING

V_IN= 3.6V

V_OUTNOM= 1.0V

C_OUT= 2.2 µF

70%

2.5

3

3.5

4

4.5

5

5.5

-40

-20

0

20

40

60

80

100 120

INPUT VOLTAGE (V)

TEMPERATURE (°C)

FIGURE 2-14:

PGOOD Threshold vs. Input

FIGURE 2-17:

Switching Frequency vs.

Voltage.

Temperature.

4.0

3.5

3.0

2.5

2.0

1.5

1.0

0.5

2.6

2.2

1.8

1.4

1

1.0 µH

2.2 µH

I_OUT= 250 mA

C_OUT= 2.2 µF

V_OUT= 1.8V

C_OUT= 2.2 µF

0.0

10

0.6

0

100

1000

10000

25

50

75

100

125

150

175

DAC VOLTAGE CODE

OUTPUT CURRENT (mA)

FIGURE 2-15:

Output Voltage vs. DAC

FIGURE 2-18:

Switching Frequency vs.

Linearity.

Output Current.

 2017 Microchip Technology Inc.

DS20005919A-page 9

MIC23156

V_IN= 3.6V, V_OUT= 1.8V

C_OUT= 2.2 μF, L = 1 μH

V_OUT

(AC-COUPLED)

(50 mV/div)

V_OUT

(AC-COUPLED)

(10 mV/div)

SW

(2V/div)

SW

(2V/div)

I_L

V_IN= 3.6V, V_OUT= 1.8V

_OUT= 2.2 μF, L = 1 μH

(500 mA/div)

(1A/div)

C

Time (100 ns/div)

Time (40 μs/div)

FIGURE 2-19:

Switching Waveform

FIGURE 2-22:

Switching Waveform

Discontinuous Mode (1 mA).

Continuous Mode (1.5A).

V_IN= 3.6V, V_OUT= 1.8V

C_OUT= 2.2 μF, L = 1 μH

V_OUT

(AC-COUPLED)

(50 mV/div)

V_OUT

(AC-COUPLED)

(50 mV/div)

SW

(2V/div)

V

= 3.6V

V^IN= 1.8V

C

^OUT= 2.2 μF

I_L

I_OUT

(200 mA/div)

L^O=^UT1 μH

(500 mA/div)

Time (1 μs/div)

Time (40 μs/div)

FIGURE 2-20:

Switching Waveform

FIGURE 2-23:

Load Transient (50 mA

Discontinuous Mode (50 mA).

to 750 mA).

V_OUT

(AC-COUPLED)

(10 mV/div)

V_OUT

(AC-COUPLED)

(50 mV/div)

V

= 3.6V

V^IN= 1.8V

C

^OUT= 2.2 μF

L^O=^UT1 μH

SW

(2V/div)

I_L

I_OUT

(500 mA/div)

V_IN= 3.6V, V_OUT= 1.8V

(500 mA/div)

C

_OUT= 2.2 μF, L = 1 μH

Time (100 ns/div)

Time (40 μs/div)

FIGURE 2-21:

Switching Waveform

FIGURE 2-24:

Load Transient (50 mA to 1A).

Continuous Mode (500 mA).

DS20005919A-page 10

 2017 Microchip Technology Inc.

MIC23156

V_OUT

(AC-COUPLED)

(50 mV/div)

V

= 3.6V TO 5.5V

V^I_O^N_UT= 1.8V

V_IN

(2V/div)

C

= 2.2 μF

L^O=^UT1 μH

V_IN= 3.6V

V

= 1.8V

V_OUT

(AC-COUPLED)

(50 mV/div)

C^OUT= 2.2 μF

L^O=^UT1 μH

I_OUT

(200 mA/div)

Time (40 μs/div)

Time (100 μs/div)

FIGURE 2-25:

Load Transient (200 mA

FIGURE 2-28:

Line Transient (3.6V to

to 600 mA).

5.5V @ 1.5A).

V_OUT

(AC-COUPLED)

(100 mV/div)

V_OUT

(AC-COUPLED)

(50 mV/div)

V

= 3.6V

V^IN= 1.8V

^OUT= 2.2 μF

PGOOD

V

= 3.6V

C

V^IN= 1.8V

L^O=^UT1 μH

(500 mV/div)

C

^OUT= 2.2 μF

I_OUT

(500 mA/div)

I_OUT

(500 mA/div)

L^O=^UT1 μH

Time (40 μs/div)

Time (100 μs/div)

FIGURE 2-26:

Load Transient (200 mA

FIGURE 2-29:

Power Good During Load

to 1.5A).

Transient (200 mA to 1.5A).

V_OUT

(AC-COUPLED)

(50 mV/div)

V

= 3.6V TO 5.5V

V^IN= 1.8V

C^OUT= 2.2 μF

L^O=^UT1 μH

V_IN

(2V/div)

V_OUT

(AC-COUPLED)

(50 mV/div)

V

= 3.6V

V^IN= 1.8V

C

^OUT= 2.2 μF

L^O=^UT1 μH

PGOOD

(2V/div)

I_OUT

(500 mA/div)

Time (40 μs/div)

Time (100 μs/div)

FIGURE 2-27:

Load Transient (200 mA

FIGURE 2-30:

Power Good During Line

to 1.5A).

Transient (3.6V to 5.5V @ 1.5A).

 2017 Microchip Technology Inc.

DS20005919A-page 11

MIC23156

V_SEL

(5V/div)

V_EN

(2V/div)

V_OUT

(400 mV/div)

PGOOD

(500 mV/div)

V_IN= 3.6V , V = 1.0V

C_S^O_S^UT= 120 pF

C

= 2.2 μF^O, ^UI_O^T_UT= 20 mA

(400 mV/div)

V_IN= V = 3.6V

I_IN

C

= ^I2^2C.2 μF, I_OUT= 250 mA

PGOOD

(500 mV/div)

(50 mA/div)

C_S^O_S^UT= 120 pF

Time (200 μs/div)

Time (1 ms/div)

FIGURE 2-31:

Power Good During Start-up.

FIGURE 2-33:

V

During V

Transition.

OUT

SEL

V_IN= 3.6V , V = 1.0V

C

= 2.2 μF^O, ^UI_O^T_UT= 20 mA

C_S^O_S^UT= 120 pF

V_EN

(2V/div)

V_OUT

(500 mV/div)

PGOOD

(500 mV/div)

Time (20 μs/div)

FIGURE 2-32:

Power Good During

Shutdown.

DS20005919A-page 12

 2017 Microchip Technology Inc.

MIC23156

3.0

PIN DESCRIPTIONS

The descriptions of the pins are listed in Table 3-1.

TABLE 3-1:

Ball

PIN FUNCTION TABLE

Number Number

Pin Function

Name

WLCSP

QFN

A1

A2

A3

A4

2

3

4

5

SCL

SDA

SNS

SS

Fast Mode Plus 1 MHz I²C Clock Input Pin.

Fast Mode Plus 1 MHz I²C Data Input/Output Pin.

Sense: Connect to V_OUT, close to output capacitor to sense V_OUT

.

Programmable Soft Start: Connect capacitor to AGND.

Power Connection for I²C Bus Voltage: Connect this pin to the voltage domain of

the I²C bus supply. Do not leave floating.

Pin Selectable: Output voltage of either of two I²C Voltage registers. Do not leave

B1

B2

1

V_I2C

11

V_SEL

floating.

B3

7

PGOOD Power Good Indicator: Use an external pull-up resistor to supply.

B4

8

AV_IN

SW

Input Voltage to Power Analog Functions: Connect decoupling capacitor to ground.

Switch Connection: Internal power MOSFET output switches.

C1, C2

C3, D3

16, 17

12, 13

PV_IN

Input Voltage to Power Switches: Connect decoupling capacitor to ground.

Analog Ground: Connect to central ground point where all high-current paths meet

(C_IN, C_OUT, and PGND) for best operation.

C4

D1, D2

D4

9

14, 15

10

AGND

PGND Power Ground Connection.

Enable: Logic high enables operation of voltage regulator. Logic low shuts down

the device. Do not leave floating.

EN

NC

—

6

No Connect.

 2017 Microchip Technology Inc.

DS20005919A-page 13

MIC23156

4.0

FUNCTIONAL DESCRIPTION

PV_IN

SW

PGND

SNS

DRIVER/

CURRENT LIMIT

ERROR

AMPLIFIER

t_ON/t_OFF

TIMER

EN

AV_IN

V_REF

V_I2C

SDA

SCL

V_SEL

CONTROL LOGIC:

I²C AND DAC

SS

PGOOD

AGND

FIGURE 4-1:

Functional Block Diagram.

4.1

PV_IN

4.4

SW

The Power Input Supply (PV_IN) pin provides power to

the internal MOSFETs for the Switch mode regulator

section. The PV_INoperating range is 2.7V to 5.5V, so an

input capacitor with a minimum voltage rating of 6.3V is

recommended. Due to the high switching speed, a mini-

mum 2.2 µF bypass capacitor, placed close to PV_INand

the Power Ground (PGND) pin, is required.

The Switch (SW) pin connects directly to one end of the

inductor and provides the current path during switching

cycles. The other end of the inductor is connected to the

SNS pin, output capacitor and the load. Due to the

high-speed switching on this pin, the Switch node should

be routed away from sensitive nodes whenever possible.

4.5

SNS

4.2

AV_IN

The Sense (SNS) pin is connected to the output of the

device to provide feedback to the control circuitry. The

SNS connection should be placed close to the output

capacitor.

Analog V_IN(AV_IN) pin provides power to the internal

control and analog supply circuitry. AV_INmust be tied to

PV_INthrough a 10 RC filter. Careful layout should be

considered to ensure that any high-frequency switch-

ing noise caused by PV_INis reduced before reaching

AV_IN. A 2.2 µF capacitor, as close to AV_INas possible,

is recommended.

4.6

AGND

The Analog Ground (AGND) pin is the ground path for

the biasing and control circuitry. The current loop for

the signal ground should be separate from the Power

Ground (PGND) loop.

4.3

EN

A logic high signal on the Enable pin activates the out-

put voltage of the device. A logic low signal on the

Enable pin deactivates the output and reduces supply

current to 0.1 µA. Do not leave the EN pin floating.

MIC23156 features external soft start circuitry via the

Soft Start (SS) pin that reduces inrush current and

prevents the output voltage from overshooting when

EN is driven logic high. Do not leave the EN pin floating.

4.7

PGND

The Power Ground (PGND) pin is the ground path for

the high current in PWM mode. The current loop for

the power ground should be as small as possible and

separate from the Analog Ground (AGND) loop, as

applicable.

DS20005919A-page 14

 2017 Microchip Technology Inc.

MIC23156

4.8

PGOOD

4.11 V_SEL

The Power Good (PGOOD) pin is an open-drain out-

put, which indicates logic high when the output voltage

is typically above 90% of its steady state voltage. A

pull-up resistor of more than 5 k should be connected

Selectable Output Voltage pin of either of two I²C

Voltage registers. A logic low selects Buck Register 1

and logic high selects Buck Register 2. If no I²C pro-

gramming is used, the output voltages will be as per the

default Voltage register values. Do not leave floating.

from PGOOD to V_OUT

.

4.9

SS

4.12 SCL

The Soft Start (SS) pin is used to control the output

voltage ramp-up time. The approximate equation for

The I²C Clock Input pin provides a reference clock for

clocking in the data signal. This is a Fast mode plus

1 MHz input pin and requires a 4.7 kΩ pull-up resistor.

the ramp time in seconds is: 820 x 103 x ln(10) x C_SS

.

For example, for C_SS= 120 pF, t_RISE 230 µs. Refer to

the Figure 2-4 graph in Section 2.0 “Typical Perfor-

mance Curves”. The minimum recommended value

for C_SSis 120 pF.

4.13 SDA

The I²C Data Input/Output pin allows for data to be

written to and read from the MIC23156. This is a Fast

mode plus 1 MHz I²C pin and requires a 4.7 kΩ pull-up

resistor.

4.10 V_I2C

Power Connection pin for the I²C bus voltage. Connect

this pin to the voltage domain of the I²C bus supply.

 2017 Microchip Technology Inc.

DS20005919A-page 15

MIC23156

Ensure the inductor selected can handle the maximum

operating current. When saturation current is specified,

make sure that there is enough margin so that the peak

current does not cause the inductor to saturate. Peak

current can be calculated as noted in Equation 5-1:

5.0

APPLICATION INFORMATION

The MIC23156 is a high-performance, DC-to-DC

step-down regulator offering a small solution size and

supporting up to 1.5A. The device is available in a

2.8 mm x 2.5 mm QFN and a 1.81 mm x 1.71 mm

WLCSP package. Using the HyperLight Load^®switch-

ing scheme, the MIC23156 is able to maintain high

efficiency and exceptional voltage accuracy throughout

the entire load range, while providing ultra-fast load tran-

sient response. Another beneficial feature is the ability to

dynamically change the output voltage in steps of

10 mV. The following subsections provide additional

device application information.

EQUATION 5-1:

CALCULATING PEAK

CURRENT

1 – V_OUT/V_IN







I_PEAK= I_OUT+ V

^OUT

[

]

2  f  L

As shown by Equation 5-1, the peak inductor current is

inversely proportional to the switching frequency and

the inductance. The lower the switching frequency or

the inductance, the higher the peak current. As input

voltage increases, the peak current also increases.

5.1

Input Capacitor

A 2.2 µF (or larger) ceramic capacitor should be placed

as close as possible to the PV_INand AV_INpins with a

short trace for good noise performance. X5R or X7R

type ceramic capacitors are recommended for better

tolerance over temperature. The Y5V and Z5U type

temperature rating ceramic capacitors are not recom-

mended due to their large reduction in capacitance

over temperature, and increased resistance at high

frequencies. These issues reduce their ability to filter

out high-frequency noise. The rated voltage of the input

capacitor should be at least 20% higher than the

maximum operating input voltage over the operating

temperature range.

The size of the inductor depends upon the requirements

of the application. Refer to the “Typical Application

Schematic” section for details.

DC Resistance (DCR) is also important. While DCR is

inversely proportional to size, it can represent a signifi-

cant efficiency loss. Refer to Section 5.6 “Efficiency

Considerations”.

The transition between Continuous Conduction Mode

(CCM) to HyperLight Load mode is determined by the

inductor ripple current and the load current.

Figure 5-1 shows the signals for the High-Side Drive

(HSD) switch for t_ONcontrol, the inductor current and

the Low-Side Drive (LSD) switch for t_OFFcontrol.

5.2

Output Capacitor

Output capacitor selection is also a trade-off between

performance, size and cost. Increasing the output

capacitor will lead to an improved transient response,

however, the size and cost also increase. The

MIC23156 is designed for use with a 2.2 µF or greater

ceramic output capacitor. A low-Equivalent Series

Resistance (low-ESR) ceramic output capacitor is

recommended, based upon performance, size and

cost. Both the X7R and X5R temperature rating capac-

itors are recommended. Refer to Table 5-1 for

additional information.

HSD

IN HLL MODE

T

_ONFIXED,

T_OFFVARIABLE

I_OUT

I_INDUCTOR

-50 mA

LOAD

INCREASING

LSD

T_DL

HSD

IN CCM MODE

T_ONVARIABLE,

T_OFFFIXED

I_OUT

I_INDUCTOR

5.3

Inductor Selection

Inductor selection is a balance between efficiency,

stability, cost, size and rated current. Since the

MIC23156 is compensated internally, the recommended

inductance of L is limited from 0.47 µH to 2.2 µH to

ensure system stability.

LSD

FIGURE 5-1:

HSD Signals for t Control,

ON

Inductor Current and LSD for t

Control.

OFF

For faster transient response, a 0.47 µH inductor will

yield the best result. For lower output ripple, a 2.2 µH

inductor is recommended.

Maximum current ratings of the inductor are generally

given in two methods; permissible DC current and sat-

uration current. Permissible DC current can be rated

either for a +40°C temperature rise or a 10% to 30%

loss in inductance.

DS20005919A-page 16

 2017 Microchip Technology Inc.

MIC23156

In HLL mode, the inductor is charged with a fixed t_ON

pulse on the High-Side Drive (HSD) switch. After this,

the LSD is switched on and current falls at a rate of

V_OUT/L. The controller remains in HLL mode while the

inductor falling current is detected to cross at approxi-

mately 200 mA. When the LSD (or t_OFF) time reaches

its minimum, and the inductor falling current is no

longer able to reach this 200 mA threshold, the part is

in CCM mode and switching at a virtually constant

frequency.

Efficiency (V_OUT= 1.8V) vs.

Output Current

100

90

80

70

60

50

40

30

20

10

0

V_IN= 5V

V_IN= 4.2V

V_IN= 3.6V

V_IN= 2.7V

Table 5-1 optimizes the inductor to output capacitor

combination for maintaining a minimum phase margin

of 45°.

C_OUT= 2.2 µF

L = 1 µH

TABLE 5-1:

MAXIMUM C

vs. INDUCTOR

OUT

10

100

1000

10000

Minimum Recommended Maximum

Inductor

OUTPUT CURRENT (mA)

C_OUT

FIGURE 5-2:

Efficiency Under Load.

0.47 µH

1.0 µH

2.2 µH

2.2 µF

4.7 µF

2.2 µF

25 µF

15 µF

6.8 µF

Figure 5-2 shows an efficiency curve. From a 10 mA

load to 1.5A, efficiency losses are dominated by quies-

cent current losses, gate drive and transition losses. By

using the HyperLight Load mode, the MIC23156 is able

to maintain high efficiency at low-output currents.

5.4

Duty Cycle

The typical maximum duty cycle of the MIC23156 is

80%.

Over 200 mA efficiency loss is dominated by MOSFET

R_DSONand inductor losses. Higher input supply

voltages will increase the gate-to-source threshold on

the internal MOSFETs, thereby reducing the internal

R_DSON. This improves efficiency by reducing DC

losses in the device. All but the inductor losses are

inherent to the device. In which case, inductor selection

becomes increasingly critical in efficiency calculations.

As the inductors are reduced in size, the DC Resis-

tance (DCR) can become quite significant. The DCR

losses can be calculated as shown in Equation 5-3:

5.5

Thermal Shutdown

When the internal die temperature of MIC23156

reaches 160°C, the internal driver is disabled until the

die temperature falls below 140°C.

5.6

Efficiency Considerations

Efficiency is defined as the amount of useful output

power, divided by the amount of power supplied, as

shown in Equation 5-2:

EQUATION 5-3:

CALCULATING DCR

LOSSES

EQUATION 5-2:

EFFICIENCY

CALCULATION

P_DCR= I_OUT² DCR

V_OUTI_OUT

V_IN I_IN









From that, the loss in efficiency due to inductor

resistance can be calculated as in Equation 5-4:

Efficiency % =

 100

EQUATION 5-4:

LOSS IN EFFICIENCY DUE

TO INDUCTOR

RESISTANCE

There are two types of losses in switching converters:

DC losses and switching losses. DC losses are simply

the power dissipation of I²R. Power is dissipated in the

high-side switch during the on cycle. Power loss is equal

to the high-side MOSFET R_DSON, multiplied by the

switch current squared. During the off cycle, the low-side

N-channel MOSFET conducts, also dissipating power.

Device operating current also reduces efficiency. The

product of the quiescent (operating) current and the

supply voltage represents another DC loss. The current

required in driving the gates on and off at a constant

3 MHz frequency, and the switching transitions, make up

the switching losses.

V_OUTI_OUT

_OUT I_OUT P_DCR







Efficiency Loss = 1 –

[

 100

]

V



Efficiency loss due to DCR is minimal at light loads and

gains significance as the load is increased. Inductor

selection becomes a trade-off between efficiency and

size in this case.

 2017 Microchip Technology Inc.

DS20005919A-page 17

MIC23156

5.7

HyperLight Load Mode

Switching Frequency vs.

Output Current

The MIC23156 uses a minimum on and off-time propri-

etary control loop. When the output voltage falls below

the regulation threshold, the error comparator begins a

switching cycle that turns the PMOS on and keeps it on

for the duration of the minimum on-time; this increases

the output voltage. If the output voltage is over the

regulation threshold, then the error comparator turns

the PMOS off for a minimum off-time until the output

drops below the threshold. The NMOS acts as an ideal

rectifier that conducts when the PMOS is off. Using a

NMOS switch instead of a diode allows for a lower

voltage drop across the switching device when it is on.

The synchronous switching combination between the

PMOS and the NMOS allows the control loop to work

in Discontinuous mode for light load operations. In Dis-

continuous mode, the MIC23156 works in HyperLight

Load to regulate the output. As the output current

increases, the off-time decreases, thus providing more

energy to the output. This switching scheme improves

the efficiency of MIC23156 during light load currents by

only switching when it is needed. As the load current

increases, the MIC23156 goes into Continuous

Conduction Mode (CCM) and switches at a frequency

centered at 3 MHz. The equation to calculate the load

when the MIC23156 goes into Continuous Conduction

Mode may be approximated by Equation 5-5:

4.0

3.5

3.0

2.5

2.0

1.5

1.0

0.5

0.0

1.0 µH

2.2 µH

V_OUT= 1.8V

C_OUT= 2.2 µF

10

100

1000

10000

OUTPUT CURRENT (mA)

FIGURE 5-3:

Current.

SW Frequency vs. Output

5.8

Output Voltage Setting

The MIC23156 features dynamic voltage scaling and

setting hardware that allow the output voltage of the

buck regulator to be changed on-the-fly, in increments

of 10 mV. The output voltage is set according to one of

two registers that behave identically: BUCK_OUT1

when V_SEL= 0and BUCK_OUT2 when V_SEL= 1. If the

BUCK_OUT value is changed while the V_SELis selected

and the regulator is enabled, then the output voltage will

immediately change to the new value using Dynamic

Voltage Scaling (DVS). Equation 5-6 describes the

relationship between the register value and the output

voltage:

EQUATION 5-5:

CALCULATING LOAD

WHEN IN CONTINUOUS

CONDUCTION MODE

(V_{IN –}V_OUT) D









I_LOAD

>

2L  f

As shown in Equation 5-5, the load at which the

MIC23156 transitions from HyperLight Load mode to

PWM mode is a function of the Input Voltage (V_IN), Out-

put Voltage (V_OUT), Duty Cycle (D), Inductance (L) and

frequency (f). As shown in Figure 5-3, as the output

current increases, the switching frequency also

increases until the MIC23156 goes from HyperLight

Load mode to PWM mode, at approximately 200 mA.

The MIC23156 will switch at a relatively constant

frequency, around 3 MHz, once the output current is

over 200 mA.

EQUATION 5-6:

REGISTER VALUE AND

OUTPUT VOLTAGE

RELATIONSHIP

V_OUT= 0.7 + (0.01  REG_{BUCK_OUT}

)

Note that the maximum output voltage is 2.4V, corre-

sponding to a register setting of 170 (0b10101010,

0xAA). An example of this calculation is demonstrated

in Section 5.13 “Calculating DAC Voltage Code”.

DS20005919A-page 18

 2017 Microchip Technology Inc.

MIC23156

5.9

I²C Interface

5.10 I²C Register Summary

Figure 5-4 shows the communications required for

write and read operations via the I²C interface. The

black lines show master communications and the red

lines show the slave communications. During a write

operation, the master must drive SDA and SCL for all

stages, except the Acknowledgment (A) stage shown

in red, which are provided by the slave (MIC23156).

There are three I²C Read/Write registers that are 8 bits

in length. All registers are reset to a zero state when-

ever EN  0.5V and set (reset) to their default values on

the transition of EN  1.5V. All registers are accessible

by I²C.

TABLE 5-2:

Reg.

REGISTER BIT FIELD MAP

The read operation begins first with a dataless write to

select the register address from which to read. A restart

sequence is issued, followed by a read command and

a data read.

D7

D6

D5

D4

1

2

—

TSD

UVLO

PGOOD

BUCK_OUT1

BUCK_OUT2

The MIC23156 responds to a slave address of Hex 0xB6

and 0xB7 for write and read operations, respectively,

or binary 1011011x (where ‘x’ is the read/write bit,

0= write, 1= read).

3

Reg.

1

D3

D2

D1

D0

—

SSL

BUCK_EN

2

BUCK_OUT1

BUCK_OUT2

The register address is eight bits wide and carries the

address of the MIC23156 register to be operated upon.

Only the lower three bits are used.

3

5.11 Enable/Status Register (001b/01h)

WRITE PROTOCOL

The Enable/Status register is written to enable the out-

put regulator (BUCK_EN) and Soft Start Extension

mode (SSL). It is read to interrogate the status of Ther-

mal Shutdown (TSD), Undervoltage Lockout (UVLO)

and Power Good (PGOOD) status of the regulator. See

Register 5-1 for additional information.

SLAVE

REGISTER

ADDRESS

DATA

ADDRESS

SDA

SCL

1011011 0

0

P

S

W A

A

5.12 Buck Register 1 (010b/02h) and

Buck Register 2 (011b/03h)

READ PROTOCOL

SLAVE

REGISTER

ADDRESS

SLAVE

ADDRESS

DATA

ADDRESS

These registers are written to set the output voltage to

any one of 170 levels in 10 mV steps. Values above

decimal 170 are equivalent to setting the register

to 170. The two registers correspond to one of two

states, which is selectable by the V_SELinput pin. This

allows the regulator to be quickly switched between

two voltage levels (e.g., enabled and standby). When

V_SEL= 0, the output voltage is controlled by BUCK_OUT1

(REG2). When V_SEL= 1, then the output voltage is

controlled by BUCK_OUT2 (REG3). See Register 5-2

and Register 5-3 for additional information.

SDA

1011011 0

SCL

0

1011011

1

0

S

W A

A

Sr

R

A

P

S = START

= WRITE

Sr= RESTART

R = READ

W

A = ACKNOWLEDGE P = STOP

FIGURE 5-4:

for Read/Write Operations via I C Interface.

Required Communications

2

 2017 Microchip Technology Inc.

DS20005919A-page 19

MIC23156

REGISTER 5-1:

REG1: ENABLE AND STATUS REGISTER

r-0

—

R-0

r-0

—

r-0

—

R/W-0

SSL

R/W-1

TSD

UVLO

PGOOD

BUCK_EN

bit 7

bit 0

Legend:

r = Reserved bit

W = Writable bit

‘1’ = Bit is set

R = Readable bit

-n = Value at POR

U = Unimplemented bit, read as ‘0’

‘0’ = Bit is cleared x = Bit is unknown

bit 7

bit 6

Reserved: Not used

TSD: Thermal Shutdown Status bit

This register bit will be set by internal hardware if a thermal shutdown event is triggered by the die

temperature which exceeds the shutdown temperature.

bit 5

bit 4

UVLO: Undervoltage Lockout Status bit

This register bit will be set by internal hardware when the undervoltage lockout circuit is active and

cleared when V_INexceeds the UVLO threshold.

PGOOD: Power Good Status bit

This register bit will be set when the buck regulator output voltage is > nominally 10% of the output

voltage set points, as specified by V_SEL, BUCK_OUT1 and BUCK_OUT2. This regulator has the same

function as the PGOOD output pin.

bit 3-2

bit 1

Reserved: Not used

SSL: Long Soft Start Enable bit

If this bit is set, then the internal soft start resistor is increased and the soft start time will be extended.

BUCK_EN: Buck Regulator Enable bit

bit 0

Setting this bit will enable and turn on the buck regulator output. Clearing this bit will disable the buck

regulator output.

DS20005919A-page 20

 2017 Microchip Technology Inc.

MIC23156

REGISTER 5-2:

REG2: BUCK_OUT1 REGISTER

R/W-0x1E

bit 0

BUCK_OUT1<7:0>

bit 7

Legend:

R = Readable bit

W = Writable bit

‘1’ = Bit is set

U = Unimplemented bit, read as ‘0’

‘0’ = Bit is cleared x = Bit is unknown

-n = Value at POR

bit 7-0

BUCK_OUT1<7:0>: Buck Output Voltage 1 bits (setting for V_SEL= 0)

Setting this register value will change the output regulation point for the buck regulator when V_SEL= 0.

If the buck is enabled and V_SEL= 0, changing the value will immediately cause the output voltage to

transition to the new set point.

REGISTER 5-3:

REG3: BUCK_OUT2 REGISTER

R/W-0x0A

bit 0

BUCK_OUT2<7:0>

bit 7

Legend:

R = Readable bit

W = Writable bit

‘1’ = Bit is set

U = Unimplemented bit, read as ‘0’

‘0’ = Bit is cleared x = Bit is unknown

-n = Value at POR

bit 7-0

BUCK_OUT2<7:0>: Buck Output Voltage 2 bits (setting for V_SEL= 1)

Setting this register value will change the output regulation point for the buck regulator when V_SEL= 1.

If the buck is enabled and V_SEL= 1, changing the value will immediately cause the output voltage to

transition to the new set point.

 2017 Microchip Technology Inc.

DS20005919A-page 21

MIC23156

5.13 Calculating DAC Voltage Code

If the desired output voltage is 1.8V, then using Equation 5-7:

EQUATION 5-7:

CALCULATING DAC VOLTAGE

(1.8 – 0.7)

=

0.01

V_OUT= 0.7 + (0.01  REG_{BUCK_OUT})  REG_{BUCK_OUT}

Note: REG_{BUCK_OUT}= 110in decimal, 6E in Hex or ‘0110 1110’ in binary.

DS20005919A-page 22

 2017 Microchip Technology Inc.

MIC23156

6.0

6.1

PACKAGING INFORMATION

Package Marking Information

Example

17-Lead QFN*

JQA

371

XXX

NNN

Example

16-Ball WLCSP*

J5

1722

943

XX

YYWW

NNN

Legend: XX...X Product code or customer-specific information

Y

Year code (last digit of calendar year)

YY

WW

NNN

Year code (last 2 digits of calendar year)

Week code (week of January 1 is week ‘01’)

Alphanumeric traceability code

e

3

Pb-free JEDEC^®designator for Matte Tin (Sn)

This package is Pb-free. The Pb-free JEDEC designator (

can be found on the outer packaging for this package.

*

e

3

)

●, ▲, ▼ Pin one index is identified by a dot, delta up, or delta down (triangle

mark).

Note: In the event the full Microchip part number cannot be marked on one line, it will

be carried over to the next line, thus limiting the number of available

characters for customer-specific information. Package may or may not include

the corporate logo.

Underbar (_) and/or Overbar (⎯) symbol may not be to scale.

 2017 Microchip Technology Inc.

DS20005919A-page 23

MIC23156

6.2

Package Details

The following sections give the technical details of the packages.

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging.

DS20005919A-page 24

 2017 Microchip Technology Inc.

MIC23156

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging.

 2017 Microchip Technology Inc.

DS20005919A-page 25

MIC23156

NOTES:

DS20005919A-page 26

 2017 Microchip Technology Inc.

MIC23156

APPENDIX A: REVISION HISTORY

Revision A (December 2017)

• Converted Micrel document MIC23156 to

Microchip data sheet DS20005919A.

• Minor text changes throughout document.

 2017 Microchip Technology Inc.

DS20005919A-page 27

MIC23156

NOTES:

DS20005919A-page 28

 2017 Microchip Technology Inc.

MIC23156

PRODUCT IDENTIFICATION SYSTEM

To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office.

Examples:

–

PART NO.

Device

XX

X

XX

a) MIC23156-0YCS-TR: MIC23156, 1.0V/0.8V Default

Output Voltage, –40°C to +125°C

Junction Temp. Range,

Media

Type

Default

Junction Temp. Package

Range

Output Voltage

16-Ball WLCSP, 3,000/Reel

MIC23156:

1.5A, 3 MHz Synchronous Buck Regulator

with HyperLight Load and I C Control for

Dynamic Voltage Scaling

b) MIC23156-0YML-TR: MIC23156, 1.0V/0.8V Default

Output Voltage, –40°C to +125°C

Junction Temp. Range,

®

2

Device:

17-Lead CQFN, 5,000/Reel

Output Voltage:

0

=

1.0V (V

= Low), 0.8V (V

= High)

c) MIC23156-0YML-T5: MIC23156, 1.0V/0.8V Default

Output Voltage, –40°C to +125°C

Junction Temp. Range,

SEL

Junction

Temperature

Range:

17-Lead CQFN, 500/Reel

Y

=

–40°C to +125°C

Note 1:

Tape and Reel identifier only appears in the

catalog part number description. This identifier is

used for ordering purposes and is not printed on

the device package. Check with your Microchip

Sales Office for package availability with the

Tape and Reel option.

CS

ML

=

16-Ball 1.81 mm x 1.71 mm WLCSP

17-Lead 2.5 mm x 2.8 mm CQFN

Package:

T5

TR

=

500/Reel (ML Package only)

5,000/Reel (ML Package only)

3,000/Reel (CS Package only)

Media Type:

 2017 Microchip Technology Inc.

DS20005919A-page 29

MIC23156

NOTES:

DS20005919A-page 30

 2017 Microchip Technology Inc.

Note the following details of the code protection feature on Microchip devices:

•

Microchip products meet the specification contained in their particular Microchip Data Sheet.

•

Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the

intended manner and under normal conditions.

•

There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our

knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data

Sheets. Most likely, the person doing so is engaged in theft of intellectual property.

•

Microchip is willing to work with the customer who is concerned about the integrity of their code.

Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not

mean that we are guaranteeing the product as “unbreakable.”

Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our

products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts

allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Information contained in this publication regarding device

applications and the like is provided only for your convenience

and may be superseded by updates. It is your responsibility to

ensure that your application meets with your specifications.

MICROCHIP MAKES NO REPRESENTATIONS OR

WARRANTIES OF ANY KIND WHETHER EXPRESS OR

IMPLIED, WRITTEN OR ORAL, STATUTORY OR

OTHERWISE, RELATED TO THE INFORMATION,

INCLUDING BUT NOT LIMITED TO ITS CONDITION,

QUALITY, PERFORMANCE, MERCHANTABILITY OR

FITNESS FOR PURPOSE. Microchip disclaims all liability

arising from this information and its use. Use of Microchip

devices in life support and/or safety applications is entirely at

the buyer’s risk, and the buyer agrees to defend, indemnify and

hold harmless Microchip from any and all damages, claims,

suits, or expenses resulting from such use. No licenses are

conveyed, implicitly or otherwise, under any Microchip

intellectual property rights unless otherwise stated.

Trademarks

The Microchip name and logo, the Microchip logo, AnyRate, AVR,

AVR logo, AVR Freaks, BeaconThings, BitCloud, CryptoMemory,

CryptoRF, dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KEELOQ,

KEELOQ logo, Kleer, LANCheck, LINK MD, maXStylus,

maXTouch, MediaLB, megaAVR, MOST, MOST logo, MPLAB,

OptoLyzer, PIC, picoPower, PICSTART, PIC32 logo, Prochip

Designer, QTouch, RightTouch, SAM-BA, SpyNIC, SST, SST

Logo, SuperFlash, tinyAVR, UNI/O, and XMEGA are registered

trademarks of Microchip Technology Incorporated in the U.S.A.

and other countries.

ClockWorks, The Embedded Control Solutions Company,

EtherSynch, Hyper Speed Control, HyperLight Load, IntelliMOS,

mTouch, Precision Edge, and Quiet-Wire are registered

trademarks of Microchip Technology Incorporated in the U.S.A.

Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any

Capacitor, AnyIn, AnyOut, BodyCom, chipKIT, chipKIT logo,

CodeGuard, CryptoAuthentication, CryptoCompanion,

CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average

Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial

Programming, ICSP, Inter-Chip Connectivity, JitterBlocker,

KleerNet, KleerNet logo, Mindi, MiWi, motorBench, MPASM, MPF,

MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach,

Omniscient Code Generation, PICDEM, PICDEM.net, PICkit,

PICtail, PureSilicon, QMatrix, RightTouch logo, REAL ICE, Ripple

Blocker, SAM-ICE, Serial Quad I/O, SMART-I.S., SQI,

SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC,

USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and

ZENAare trademarks of Microchip Technology Incorporated in the

U.S.A. and other countries.

SQTP is a service mark of Microchip Technology Incorporated in

the U.S.A.

Microchip received ISO/TS-16949:2009 certification for its worldwide

headquarters, design and wafer fabrication facilities in Chandler and

Tempe, Arizona; Gresham, Oregon and design centers in California

and India. The Company’s quality system processes and procedures

are for its PIC^®MCUs and dsPIC^®DSCs, KEELOQ^®code hopping

devices, Serial EEPROMs, microperipherals, nonvolatile memory and

analog products. In addition, Microchip’s quality system for the design

and manufacture of development systems is ISO 9001:2000 certified.

Silicon Storage Technology is a registered trademark of Microchip

Technology Inc. in other countries.

GestIC is a registered trademark of Microchip Technology

Germany II GmbH & Co. KG, a subsidiary of Microchip Technology

Inc., in other countries.

All other trademarks mentioned herein are property of their

respective companies.

QUALITYꢀMANAGEMENTꢀꢀSYSTEMꢀ

CERTIFIEDꢀBYꢀDNVꢀ

ISBN: 978-1-5224-2478-9

== ISO/TSꢀ16949ꢀ==ꢀ

 2017 Microchip Technology Inc.

DS20005919A-page 31

Worldwide Sales and Service

AMERICAS

ASIA/PACIFIC

EUROPE

Corporate Office

2355 West Chandler Blvd.

Chandler, AZ 85224-6199

Tel: 480-792-7200

Fax: 480-792-7277

Technical Support:

http://www.microchip.com/

support

Australia - Sydney

Tel: 61-2-9868-6733

India - Bangalore

Tel: 91-80-3090-4444

Austria - Wels

Tel: 43-7242-2244-39

Fax: 43-7242-2244-393

China - Beijing

Tel: 86-10-8569-7000

India - New Delhi

Tel: 91-11-4160-8631

Denmark - Copenhagen

Tel: 45-4450-2828

Fax: 45-4485-2829

China - Chengdu

Tel: 86-28-8665-5511

India - Pune

Tel: 91-20-4121-0141

Finland - Espoo

Tel: 358-9-4520-820

China - Chongqing

Tel: 86-23-8980-9588

Japan - Osaka

Tel: 81-6-6152-7160

Web Address:

www.microchip.com

France - Paris

Tel: 33-1-69-53-63-20

Fax: 33-1-69-30-90-79

China - Dongguan

Tel: 86-769-8702-9880

Japan - Tokyo

Tel: 81-3-6880- 3770

Atlanta

Duluth, GA

Tel: 678-957-9614

Fax: 678-957-1455

China - Guangzhou

Tel: 86-20-8755-8029

Korea - Daegu

Tel: 82-53-744-4301

Germany - Garching

Tel: 49-8931-9700

China - Hangzhou

Tel: 86-571-8792-8115

Korea - Seoul

Tel: 82-2-554-7200

Germany - Haan

Tel: 49-2129-3766400

Austin, TX

Tel: 512-257-3370

China - Hong Kong SAR

Tel: 852-2943-5100

Malaysia - Kuala Lumpur

Tel: 60-3-7651-7906

Germany - Heilbronn

Tel: 49-7131-67-3636

Boston

Westborough, MA

Tel: 774-760-0087

Fax: 774-760-0088

China - Nanjing

Tel: 86-25-8473-2460

Malaysia - Penang

Tel: 60-4-227-8870

Germany - Karlsruhe

Tel: 49-721-625370

China - Qingdao

Philippines - Manila

Germany - Munich

Tel: 49-89-627-144-0

Fax: 49-89-627-144-44

Tel: 86-532-8502-7355

Tel: 63-2-634-9065

Chicago

Itasca, IL

Tel: 630-285-0071

Fax: 630-285-0075

China - Shanghai

Tel: 86-21-3326-8000

Singapore

Tel: 65-6334-8870

Germany - Rosenheim

Tel: 49-8031-354-560

China - Shenyang

Tel: 86-24-2334-2829

Taiwan - Hsin Chu

Tel: 886-3-577-8366

Dallas

Addison, TX

Tel: 972-818-7423

Fax: 972-818-2924

Israel - Ra’anana

Tel: 972-9-744-7705

China - Shenzhen

Tel: 86-755-8864-2200

Taiwan - Kaohsiung

Tel: 886-7-213-7830

Italy - Milan

Tel: 39-0331-742611

Fax: 39-0331-466781

China - Suzhou

Tel: 86-186-6233-1526

Taiwan - Taipei

Tel: 886-2-2508-8600

Detroit

Novi, MI

Tel: 248-848-4000

China - Wuhan

Tel: 86-27-5980-5300

Thailand - Bangkok

Tel: 66-2-694-1351

Italy - Padova

Tel: 39-049-7625286

Houston, TX

Tel: 281-894-5983

China - Xian

Tel: 86-29-8833-7252

Vietnam - Ho Chi Minh

Tel: 84-28-5448-2100

Netherlands - Drunen

Tel: 31-416-690399

Fax: 31-416-690340

Indianapolis

Noblesville, IN

Tel: 317-773-8323

Fax: 317-773-5453

Tel: 317-536-2380

China - Xiamen

Tel: 86-592-2388138

Norway - Trondheim

Tel: 47-7289-7561

China - Zhuhai

Tel: 86-756-3210040

Poland - Warsaw

Tel: 48-22-3325737

Los Angeles

Mission Viejo, CA

Tel: 949-462-9523

Fax: 949-462-9608

Tel: 951-273-7800

Romania - Bucharest

Tel: 40-21-407-87-50

Spain - Madrid

Tel: 34-91-708-08-90

Fax: 34-91-708-08-91

Raleigh, NC

Tel: 919-844-7510

Sweden - Gothenberg

Tel: 46-31-704-60-40

New York, NY

Tel: 631-435-6000

Sweden - Stockholm

Tel: 46-8-5090-4654

San Jose, CA

Tel: 408-735-9110

Tel: 408-436-4270

UK - Wokingham

Tel: 44-118-921-5800

Fax: 44-118-921-5820

Canada - Toronto

Tel: 905-695-1980

Fax: 905-695-2078

DS20005919A-page 32

 2017 Microchip Technology Inc.

10/25/17


型号：	MIC231560YML-T5
厂家：	MICROCHIP
描述：	1.5A, 3MHz Synchronous Buck Regulator with HyperLight LoadÂ® and I2C Control for Dynamic Voltage Scaling
文件：	总32页 (文件大小：651K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

MIC231560YML-T5 [MICROCHIP]

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