MIC4420BMMT&R [MICROCHIP]
Buffer/Inverter Based MOSFET Driver, 6A, BCDMOS, PDSO8, MSOP-8;
| 型号： | MIC4420BMMT&R |
| 厂家： | 
MICROCHIP |
| 描述： | Buffer/Inverter Based MOSFET Driver, 6A, BCDMOS, PDSO8, MSOP-8 CD 光电二极管 |
| 文件： | 总12页 (文件大小：225K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MIC4420/4429
6A-Peak Low-Side MOSFET Driver
Bipolar/CMOS/DMOS Process
General Description
Features
• CMOS Construction
• Latch-Up Protected: Will Withstand >500mA
Reverse Output Current
MIC4420, MIC4429 and MIC429 MOSFET drivers are
tough, efficient, and easy to use. The MIC4429 and MIC429
are inverting drivers, while the MIC4420 is a non-inverting
driver.
• Logic Input Withstands Negative Swing of Up to 5V
• Matched Rise and Fall Times ................................25ns
• High Peak Output Current ............................... 6A Peak
• Wide Operating Range...............................4.5V to 18V
• High Capacitive Load Drive............................10,000pF
• Low Delay Time.............................................. 55ns Typ
• Logic High Input for Any Voltage From 2.4V to VS
• Low Equivalent Input Capacitance (typ)..................6pF
• Low Supply Current...............450µA With Logic 1 Input
• Low Output Impedance ......................................... 2.5Ω
• Output Voltage Swing Within 25mV of Ground or VS
They are capable of 6A(peak) output and can drive the larg-
est MOSFETs with an improved safe operating margin. The
MIC4420/4429/429 accepts any logic input from 2.4V to VS
without external speed-up capacitors or resistor networks.
Proprietary circuits allow the input to swing negative by as
much as 5V without damaging the part. Additional circuits
protect against damage from electrostatic discharge.
MIC4420/4429/429 drivers can replace three or more
discrete components, reducing PCB area requirements,
simplifying product design, and reducing assembly cost.
Applications
Modern BiCMOS/DMOS construction guarantees freedom
from latch-up. The rail-to-rail swing capability insures ad-
equate gate voltage to the MOSFET during power up/down
sequencing.
• Switch Mode Power Supplies
• Motor Controls
• Pulse Transformer Driver
• Class-D Switching Amplifiers
Note: See MIC4120/4129 for high power and narrow
pulse applications.
Functional Diagram
VS
MIC4429
INVERTING
0.4mA
0.1mA
OUT
IN
2kΩ
MIC4420
NONINVERTING
GND
Micrel, Inc. • 2180 Fortune Drive • San Jose, CA 95131 • USA • tel + 1 (408) 944-0800 • fax + 1 (408) 474-1000 • http://www.micrel.com
M9999-072205
July 2005
1
MIC4420/4429
Micrel, Inc.
Ordering Information
Part No.
Temperature
Range
Standard
Pb-Free
MIC4420ZN
MIC4420YN
MIC4420ZM
MIC4420YM
MIC4420YMM
MIC4420ZT
MIC4429ZN
MIC4429YN
MIC4429ZM
MIC4429YM
MIC4429YMM
MIC4429ZT
Package
8-Pin PDIP
8-Pin PDIP
8-Pin SOIC
8-Pin SOIC
Configuration
Non-Inverting
Non-Inverting
Non-Inverting
Non-Inverting
Non-Inverting
Non-Inverting
Inverting
MIC4420CN
MIC4420BN
MIC4420CM
MIC4420BM
MIC4420BMM
MIC4420CT
MIC4429CN
MIC4429BN
MIC4429CM
MIC4429BM
MIC4429BMM
MIC4429CT
0°C to +70°C
–40°C to +85°C
0°C to +70°C
–40°C to +85°C
–40°C to +85°C 8-Pin MSOP
0°C to +70°C
0°C to +70°C
–40°C to +85°C
0°C to +70°C
–40°C to +85°C
5-Pin TO-220
8-Pin PDIP
8-Pin PDIP
8-Pin SOIC
8-Pin SOIC
Inverting
Inverting
Inverting
–40°C to +85°C 8-Pin MSOP
0°C to +70°C 5-Pin TO-220
Inverting
Inverting
Pin Configurations
VS
IN
VS
1
2
3
4
8
7
6
5
OUT
OUT
GND
NC
GND
Plastic DIP (N)
SOIC (M)
MSOP (MM)
5
4
3
2
1
OUT
GND
VS
GND
IN
TO-220-5 (T)
Pin Description
Pin Number
Pin Number
Pin Name
Pin Function
TO-220-5
DIP, SOIC, MSOP
1
2, 4
3, TAB
5
2
IN
GND
VS
Control Input
4, 5
1, 8
6, 7
3
Ground: Duplicate pins must be externally connected together.
Supply Input: Duplicate pins must be externally connected together.
Output: Duplicate pins must be externally connected together.
Not connected.
OUT
NC
M9999-072205
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July 2005
MIC4420/4429
Micrel, Inc.
Absolute Maximum Ratings (Notes 1, 2 and 3)
Operating Ratings
Supply Voltage ...........................................................20V
Supply Voltage .............................................. 4.5V to 18V
Junction Temperature............................................. 150°C
Ambient Temperature
Input Voltage ...............................V + 0.3V to GND – 5V
S
Input Current (V > V ) ..........................................50mA
IN
S
Power Dissipation, T ≤ 25°C
C Version.................................................0°C to +70°C
B Version .............................................–40°C to +85°C
Package Thermal Resistance
A
PDIP ....................................................................960W
SOIC...............................................................1040mW
5-Pin TO-220 ...........................................................2W
5-pin TO-220 (θ )............................................10°C/W
JC
Power Dissipation, T ≤ 25°C
8-pin MSOP (θ ) ...........................................250°C/W
C
JA
5-Pin TO-220 ......................................................12.5W
Derating Factors (to Ambient)
PDIP .............................................................7.7mW/°C
SOIC.............................................................8.3mW/°C
5-Pin TO-220 .................................................17mW/°C
Storage Temperature.............................–65°C to +150°C
Lead Temperature (10 sec.) ................................... 300°C
Electrical Characteristics: (TA = 25°C with 4.5V ≤ VS ≤ 18V unless otherwise specified. Note 4.)
Symbol
INPUT
VIH
Parameter
Conditions
Min
Typ
Max
Units
Logic 1 Input Voltage
Logic 0 Input Voltage
Input Voltage Range
Input Current
2.4
1.4
1.1
V
V
VIL
0.8
VS + 0.3
10
VIN
–5
V
IIN
0 V ≤ VIN ≤ VS
–10
µA
OUTPUT
VOH
High Output Voltage
Low Output Voltage
See Figure 1
VS–0.025
V
V
Ω
VOL
See Figure 1
0.025
2.8
RO
Output Resistance,
Output Low
IOUT = 10 mA, VS = 18 V
1.7
1.5
6
RO
Output Resistance,
Output High
IOUT = 10 mA, VS = 18 V
VS = 18 V (See Figure 6)
2.5
Ω
IPK
IR
Peak Output Current
A
Latch-Up Protection
>500
mA
Withstand Reverse Current
SWITCHING TIME (Note 3)
tR
Rise Time
Fall Time
Test Figure 1, CL = 2500 pF
Test Figure 1, CL = 2500 pF
Test Figure 1
12
13
18
48
35
35
75
75
ns
ns
ns
ns
tF
tD1
tD2
Delay Time
Delay Time
Test Figure 1
POWER SUPPLY
IS
Power Supply Current
VIN = 3 V
0.45
90
1.5
150
mA
µA
V
IN = 0 V
VS
Operating Input Voltage
4.5
18
V
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M9999-072205
MIC4420/4429
Micrel, Inc.
Electrical Characteristics: (TA = –55°C to +125°C with 4.5V ≤ VS ≤ 18V unless otherwise specified.)
Symbol
INPUT
VIH
Parameter
Conditions
Min
Typ
Max
Units
Logic 1 Input Voltage
Logic 0 Input Voltage
Input Voltage Range
Input Current
2.4
V
V
VIL
0.8
VS + 0.3
10
VIN
–5
V
IIN
0V ≤ VIN ≤ VS
–10
µA
OUTPUT
VOH
High Output Voltage
Low Output Voltage
Figure 1
VS–0.025
V
V
Ω
VOL
Figure 1
0.025
5
RO
Output Resistance,
Output Low
IOUT = 10mA, VS = 18V
3
RO
Output Resistance,
Output High
IOUT = 10mA, VS = 18V
2.3
5
Ω
SWITCHING TIME (Note 3)
tR
Rise Time
Fall Time
Figure 1, CL = 2500pF
Figure 1, CL = 2500pF
Figure 1
32
34
50
65
60
60
ns
ns
ns
ns
tF
tD1
tD2
Delay Time
Delay Time
100
100
Figure 1
POWER SUPPLY
IS
Power Supply Current
VIN = 3V
0.45
0.06
3.0
0.4
mA
mA
V
IN = 0V
VS
Operating Input Voltage
4.5
18
V
Note 1:
Note 2:
Functional operation above the absolute maximum stress ratings is not implied.
Static-sensitive device. Store only in conductive containers. Handling personnel and equipment should be grounded to
prevent damage from static discharge.
Note 3:
Note 4:
Switching times guaranteed by design.
Specification for packaged product only.
Test Circuits
VS = 18V
VS = 18V
0.1µF
1.0µF
0.1µF
0.1µF
1.0µF
0.1µF
IN
OUT
2500pF
IN
OUT
2500pF
MIC4429
MIC4420
5V
90%
5V
90%
2.5V
tPW≥ 0.5µs
2.5V
tPW≥ 0.5µs
INPUT
INPUT
10%
0V
10%
0V
tPW
tPW
tD1
tF
tR
tD2
tD1
tF
tD2
tR
V S
90%
VS
90%
OUTPUT
OUTPUT
10%
0V
10%
0V
Figure 1. Inverting Driver Switching Time
Figure 2. Noninverting Driver Switching Time
July 2005
M9999-072205
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MIC4420/4429
Micrel, Inc.
Typical Characteristic Curves
Rise Time vs. Supply Voltage
Fall Time vs. Supply Voltage
Rise and Fall Times vs. Temperature
60
50
40
30
20
10
0
25
C
V
= 2200 pF
= 18V
L
S
50
20
15
10
5
C
= 10,000 pF
L
C
= 10,000 pF
L
40
30
20
10
0
t
FALL
t
RISE
C
C
= 4700 pF
L
C
C
= 4700 pF
L
= 2200 pF
L
= 2200 pF
L
0
–60
5
7
9
11
(V)
13
15
5
7
9
11
(V)
13
15
–20
20
60
100
140
V
TEMPERATURE (°C)
V
S
S
Delay Time vs. Supply Voltage
Rise Time vs. Capacitive Load
Fall Time vs. Capacitive Load
50
60
50
40
30
20
10
0
50
40
40
30
20
30
t
D2
V
= 5V
S
20
V
= 5V
S
V
= 12V
V
= 12V
S
S
V
= 18V
S
V
= 18V
S
10
5
10
5
t
D1
1000
3000
CAPACITIVE LOAD (pF)
10,000
1000
10,000
4
6
8
10
12 14 16 18
SUPPLY VOLTAGE (V)
3000
CAPACITIVE LOAD (pF)
Propagation Delay Time
vs. Temperature
Supply Current vs. Capacitive Load
Supply Current vs. Frequency
60
84
1000
100
V
= 15V
C = 2200 pF
L
S
18V
70
56
42
28
14
0
t
D2
50
40
30
20
10
10V
5V
500 kHz
200 kHz
20 kHz
1000
10,000
t
D1
10
0
C
V
= 2200 pF
= 18V
L
S
0
100
0
100
1000
10,000
–60
–20
20
60
100
140
CAPACITIVE LOAD (pF)
FREQUENCY (kHz)
TEMPERATURE (°C)
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MIC4420/4429
Micrel, Inc.
Typical Characteristic Curves (Cont.)
Quiescent Power Supply
Voltage vs. Supply Current
1000
Quiescent Power Supply
Current vs. Temperature
900
800
700
600
500
400
LOGIC “1” INPUT
V
= 18V
S
800
600
LOGIC “1” INPUT
400
200
LOGIC “0” INPUT
0
0
4
8
12
16
20
–60
–20
20
60
100
140
SUPPLY VOLTAGE (V)
TEMPERATURE (°C)
Low-State Output Resistance
High-State Output Resistance
2.5
2
5
4
3
2
100 mA
100 mA
50 mA
50 mA
10 mA
1.5
1
10 mA
5
7
9
11
(V)
13
15
5
7
9
11
(V)
13
15
V
V
S
S
Effect of Input Amplitude
on Propagation Delay
Crossover Area vs. Supply Voltage
200
160
120
80
2.0
LOAD = 2200 pF
PER TRANSITION
1.5
INPUT 2.4V
1.0
0.5
0
INPUT 3.0V
INPUT 5.0V
40
INPUT 8V AND 10V
0
5
6
7
8
9
10 11 12 13 14 15
(V)
5
6
7
8
9
10 11 12 13 14 15
V
SUPPLY VOLTAGE V (V)
S
S
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July 2005
MIC4420/4429
Micrel, Inc.
Applications Information
Supply Bypassing
Grounding
The high current capability of the MIC4420/4429 demands
careful PC board layout for best performance Since the
MIC4429 is an inverting driver, any ground lead impedance
willappearasnegativefeedbackwhichcandegradeswitch-
ing speed. Feedback is especially noticeable with slow-rise
time inputs. The MIC4429 input structure includes 300mV
of hysteresis to ensure clean transitions and freedom from
oscillation, but attention to layout is still recommended.
Charging and discharging large capacitive loads quickly
requires large currents. For example, charging a 2500pF
load to 18V in 25ns requires a 1.8Acurrent from the device
power supply.
The MIC4420/4429 has double bonding on the supply pins,
the ground pins and output pins This reduces parasitic lead
inductance. Low inductance enables large currents to be
switched rapidly. It also reduces internal ringing that can
cause voltage breakdown when the driver is operated at
or near the maximum rated voltage.
Figure3showsthefeedbackeffectindetail.AstheMIC4429
input begins to go positive, the output goes negative and
several amperes of current flow in the ground lead. As little
as 0.05Ω of PC trace resistance can produce hundreds of
millivolts at the MIC4429 ground pins. If the driving logic is
referenced to power ground, the effective logic input level
is reduced and oscillation may result.
Internal ringing can also cause output oscillation due to
feedback. This feedback is added to the input signal since
it is referenced to the same ground.
To insure optimum performance, separate ground traces
should be provided for the logic and power connections.
Connecting the logic ground directly to the MIC4429 GND
pins will ensure full logic drive to the input and ensure fast
output switching. Both of the MIC4429 GND pins should,
however, still be connected to power ground.
To guarantee low supply impedance over a wide frequency
range,aparallelcapacitorcombinationisrecommendedfor
supply bypassing. Low inductance ceramic disk capacitors
with short lead lengths (< 0.5 inch) should be used. A 1µF
low ESR film capacitor in parallel with two 0.1 µF low ESR
®
ceramiccapacitors,(suchasAVXRAMGUARD ),provides
adequate bypassing. Connect one ceramic capacitor di-
rectly between pins 1 and 4. Connect the second ceramic
capacitor directly between pins 8 and 5.
+15
(x2) 1N4448
5.6kΩ
560 Ω
0.1µF
50V
+
1µF
50V
BYV 10 (x 2)
1
MKS2
8
+
6, 7
2
MIC4429
0.1µF
WIMA
MKS2
220 µF 50V
+
5
35 µF 50V
4
UNITED CHEMCON SXE
Figure 3. Self-Contained Voltage Doubler
July 2005
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MIC4420/4429
Micrel, Inc.
attention should be given to power dissipation when driving
low impedance loads and/or operating at high frequency.
Input Stage
The input voltage level of the 4429 changes the quiescent
supply current. The N channel MOSFET input stage tran-
sistor drives a 450µA current source load. With a logic “1”
input, the maximum quiescent supply current is 450µA.
Logic “0” input level signals reduce quiescent current to
55µA maximum.
The supply current vs frequency and supply current vs
capacitive load characteristic curves aid in determining
power dissipation calculations. Table 1 lists the maximum
safe operating frequency for several power supply volt-
ages when driving a 2500pF load. More accurate power
dissipation figures can be obtained by summing the three
dissipation sources.
The MIC4420/4429 input is designed to provide 300mV of
hysteresis. This provides clean transitions, reduces noise
sensitivity,andminimizesoutputstagecurrentspikingwhen
changing states. Input voltage threshold level is approxi-
mately 1.5V, making the device TTL compatible over the
4 .5V to 18V operating supply voltage range. Input current
is less than 10µA over this range.
Given the power dissipation in the device, and the thermal
resistance of the package, junction operating temperature
for any ambient is easy to calculate. For example, the
thermal resistance of the 8-pin MSOP package, from the
data sheet, is 250°C/W. In a 25°C ambient, then, using a
maximum junction temperature of 150°C, this package will
dissipate 500mW.
The MIC4429 can be directly driven by the TL494,
SG1526/1527, SG1524, TSC170, MIC38HC42 and similar
switchmodepowersupplyintegratedcircuits. Byoffloading
the power-driving duties to the MIC4420/4429, the power
supply controller can operate at lower dissipation. This can
improve performance and reliability.
Accurate power dissipation numbers can be obtained by
summing the three sources of power dissipation in the
device:
• Load Power Dissipation (P )
L
+
The input can be greater than the VS supply, however,
current will flow into the input lead. The propagation delay
• Quiescent power dissipation (P )
Q
• Transition power dissipation (P )
T
for T will increase to as much as 400ns at room tem-
D2
Calculation of load power dissipation differs depending on
whether the load is capacitive, resistive or inductive.
perature. The input currents can be as high as 30mA p-p
(6.4mA
) with the input, 6 V greater than the supply
RMS
voltage. No damage will occur to MIC4420/4429 however,
and it will not latch.
Resistive Load Power Dissipation
Dissipation caused by a resistive load can be calculated
as:
The input appears as a 7pF capacitance, and does not
change even if the input is driven from an AC source. Care
should be taken so that the input does not go more than 5
volts below the negative rail.
2
P = I R D
L
O
where:
Power Dissipation
I = the current drawn by the load
CMOS circuits usually permit the user to ignore power dis-
sipation. Logic families such as 4000 and 74C have outputs
which can only supply a few milliamperes of current, and
even shorting outputs to ground will not force enough cur-
rent to destroy the device. The MIC4420/4429 on the other
hand, can source or sink several amperes and drive large
capacitive loads at high frequency. The package power
dissipation limit can easily be exceeded. Therefore, some
R = the output resistance of the driver when the output
O
is high, at the power supply voltage used. (See data
sheet)
D = fraction of time the load is conducting (duty cycle)
+18 V
Table 1: MIC4429 Maximum
Operating Frequency
WIMA
MKS-2
1 µF
V
Max Frequency
500kHz
S
5.0V
18 V
1
18V
15V
10V
TEK CURRENT
PROBE 6302
8
6, 7
700kHz
MIC4429
0 V
5
0 V
1.6MHz
1. DIP Package (θJA = 130°C/W)
0.1µF
0.1µF
4
2,500 pF
POLYCARBONATE
Conditions:
2. TA = 25°C
3. CL = 2500pF
LOGIC
GROUND
6 AMPS
300 mV
PC TRACE RESISTANCE = 0.05Ω
POWER
GROUND
Figure 4. Switching Time Degradation Due to
Negative Feedback
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MIC4420/4429
Micrel, Inc.
Capacitive Load Power Dissipation
where:
Dissipation caused by a capacitive load is simply the en-
ergy placed in, or removed from, the load capacitance by
the driver. The energy stored in a capacitor is described
by the equation:
I = quiescent current with input high
H
I = quiescent current with input low
L
D = fraction of time input is high (duty cycle)
V = power supply voltage
S
2
E = 1/2 C V
Transition Power Dissipation
As this energy is lost in the driver each time the load is
charged or discharged, for power dissipation calculations
the 1/2 is removed. This equation also shows that it is
good practice not to place more voltage on the capacitor
than is necessary, as dissipation increases as the square
of the voltage applied to the capacitor. For a driver with a
capacitive load:
Transition power is dissipated in the driver each time its
output changes state, because during the transition, for a
very brief interval, both the N- and P-channel MOSFETs in
the output totem-pole are ON simultaneously, and a cur-
+
rent is conducted through them from V to ground. The
S
transition power dissipation is approximately:
P = 2 f V (A•s)
T
S
2
P = f C (V )
L
S
where (A•s) is a time-current factor derived from the typical
characteristic curves.
where:
f = Operating Frequency
C = Load Capacitance
Total power (P ) then, as previously described is:
D
P = P + P +P
D
L
Q
T
V =Driver Supply Voltage
S
Definitions
Inductive Load Power Dissipation
C = Load Capacitance in Farads.
L
For inductive loads the situation is more complicated. For
the part of the cycle in which the driver is actively forcing
current into the inductor, the situation is the same as it is
in the resistive case:
D = Duty Cycle expressed as the fraction of time the
input to the driver is high.
f = Operating Frequency of the driver in Hertz
2
P
= I R D
L1
O
I = Powersupplycurrentdrawnbyadriverwhenboth
H
However, in this instance the R required may be either
O
inputs are high and neither output is loaded.
the on resistance of the driver when its output is in the high
state, or its on resistance when the driver is in the low state,
depending on how the inductor is connected, and this is
still only half the story. For the part of the cycle when the
inductor is forcing current through the driver, dissipation is
best described as
I = Powersupplycurrentdrawnbyadriverwhenboth
L
inputs are low and neither output is loaded.
I = Output current from a driver in Amps.
D
P = Total power dissipated in a driver in Watts.
D
P
= I V (1-D)
D
P = Power dissipated in the driver due to the driver’s
L2
L
load in Watts.
where V is the forward drop of the clamp diode in the
D
driver (generally around 0.7V). The two parts of the load
P = Power dissipated in a quiescent driver in
Q
dissipation must be summed in to produce P
Watts.
L
P = P + P
L2
P = Power dissipated in a driver when the output
L
L1
T
changesstates(“shoot-throughcurrent”)inWatts.
NOTE: The “shoot-through” current from a dual
transition (once up, once down) for both drivers
is shown by the "Typical Characteristic Curve :
CrossoverArea vs. Supply Voltage and is in am-
pere-seconds. This figure must be multiplied by
thenumberofrepetitionspersecond(frequency)
to find Watts.
Quiescent Power Dissipation
Quiescent power dissipation (P , as described in the input
Q
section) depends on whether the input is high or low. A low
input will result in a maximum current drain (per driver) of
≤0.2mA; a logic high will result in a current drain of ≤2.0mA.
Quiescent power can therefore be found from:
P = V [D I + (1-D) I ]
Q
S
H
L
R = Output resistance of a driver in Ohms.
O
V = Power supply voltage to the IC in Volts.
S
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MIC4420/4429
Micrel, Inc.
+18 V
WIMA
MK22
1 µF
5.0V
18 V
1
TEK CURRENT
PROBE 6302
8
2
6, 7
MIC4429
0 V
5
0 V
0.1µF
0.1µF
4
10,000 pF
POLYCARBONATE
Figure 5. Peak Output Current Test Circuit
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July 2005
MIC4420/4429
Micrel, Inc.
Package Information
PIN 1
DIMENSIONS:
INCH (MM)
0.380 (9.65)
0.370 (9.40)
0.255 (6.48)
0.245 (6.22)
0.135 (3.43)
0.125 (3.18)
0.300 (7.62)
0.013 (0.330)
0.010 (0.254)
0.380 (9.65)
0.320 (8.13)
0.018 (0.57)
0.100 (2.54)
0.130 (3.30)
0.0375 (0.952)
8-Pin Plastic DIP (N)
8-Pin SOIC (M)
11
July 2005
M9999-072205
MIC4420/4429
Micrel, Inc.
0.112 (2.84)
0.032 (0.81)
0.187 (4.74)
0.116 (2.95)
INCH (MM)
0.038 (0.97)
0.007 (0.18)
0.005 (0.13)
0.012 (0.30) R
5°
0° MIN
0.012 (0.03)
0.012 (0.03) R
0.004 (0.10)
0.0256 (0.65) TYP
0.035 (0.89)
0.021 (0.53)
8-Pin MSOP (MM)
0.150 D ±0.005
(3.81 D ±0.13)
0.177 ±0.008
(4.50 ±0.20)
0.400 ±0.015
(10.16 ±0.38)
0.050 ±0.005
(1.27 ±0.13)
0.108 ±0.005
(2.74 ±0.13)
0.241 ±0.017
(6.12 ±0.43)
0.578 ±0.018
(14.68 ±0.46)
SEATING
PLANE
7°
Typ.
0.550 ±0.010
(13.97 ±0.25)
0.067 ±0.005
(1.70 ±0.127)
0.032 ±0.005
(0.81 ±0.13)
0.018 ±0.008
(0.46 ±0.20)
0.103 ±0.013
(2.62 ±0.33)
0.268 REF
(6.81 REF)
inch
(mm)
Dimensions:
5-Lead TO-220 (T)
MICREL INC. 2180 FORTUNE DRIVE SAN JOSE, CA 95131 USA
TEL + 1 (408) 944-0800 FAX + 1 (408) 474-1000 WEB http://www.micrel.com
This information furnished by Micrel in this data sheet is believed to be accurate and reliable. However no responsibility is assumed by Micrel for its
use. Micrel reserves the right to change circuitry and specifications at any time without notification to the customer.
Micrel Products are not designed or authorized for use as components in life support appliances, devices or systems where malfunction of a product
can reasonably be expected to result in personal injury. Life support devices or systems are devices or systems that (a) are intended for surgical
implant into the body or (b) support or sustain life, and whose failure to perform can be reasonably expected to result in a significant injury to the
user. A Purchaser’s use or sale of Micrel Products for use in life support appliances, devices or systems is a Purchaser’s own risk and Purchaser
agrees to fully indemnify Micrel for any damages resulting from such use or sale.
© 2001 Micrel, Inc.
M9999-072205
12
July 2005
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