MRF89XA_技术文档

MRF89XAM8A

Data Sheet

868 MHz Ultra-Low Power

Sub-GHz Transceiver Module

Preliminary

DS70651A

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Trademarks

The Microchip name and logo, the Microchip logo, dsPIC,

KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART,

PIC³²logo, rfPIC and UNI/O are registered trademarks of

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Analog-for-the-Digital Age, Application Maestro, CodeGuard,

dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,

ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial

Programming, ICSP, Mindi, MiWi, MPASM, MPLAB Certified

logo, MPLIB, MPLINK, mTouch, Octopus, Omniscient Code

Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit,

PICtail, REAL ICE, rfLAB, Select Mode, Total Endurance,

TSHARC, UniWinDriver, WiperLock and ZENA are

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SQTP is a service mark of Microchip Technology Incorporated

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All other trademarks mentioned herein are property of their

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Printed on recycled paper.

ISBN: 978-1-60932-637-1

Microchip received ISO/TS-16949:2002 certification for its worldwide

headquarters, design and wafer fabrication facilities in Chandler and

Tempe, Arizona; Gresham, Oregon and design centers in California

and India. The Company’s quality system processes and procedures

are for its PIC^®MCUs and dsPIC^®DSCs, KEELOQ^®code hopping

devices, Serial EEPROMs, microperipherals, nonvolatile memory and

analog products. In addition, Microchip’s quality system for the design

and manufacture of development systems is ISO 9001:2000 certified.

DS70651A-page ii

Preliminary

MRF89XAM8A

868 MHz Ultra-Low Power Sub-GHz Transceiver Module

Features

RF/Analog Features

• Module designed from the MRF89XA integrated

• 863–870 MHz operation

• Modulation: FSK and OOK

• Data rate (to conform to ETSI standards):

- FSK: 40 kbps

ultra low-power, sub-GHz transceiver IC.

• Supports proprietary sub-GHz wireless protocols

• Simple, SPI Interface with Interrupts

• Small size: 0.7" x 1.1" (17.8 mm x 27.9 mm),

surface mountable

- OOK: 16 kbps

• Reception sensitivity

• Integrated crystal, internal voltage regulator,

matching circuitry and Printed Circuit Board

(PCB) antenna

- FSK: -107 dBm (typical) at 25 kbps

- OOK: -113 dBm (typical) at 2 kbps

• +10 dBm typical output power with 21 dB Tx

power control range

• Easy integration into final product: minimize prod-

uct development, quicker time to market

• Compatible with Microchip’s Microcontroller

families (PIC16, PIC18, PIC24, dsPIC33 and

PIC32)

Media Access Controller

(MAC)/Baseband Features

• Conforms to the following ETSI standards:

- EN 300 220-2 V2.3.1 (2001–02)

- EN 301 489-3 V1.4.1 (2002–08)

• Packet handling features with data whitening and

automatic CRC generation

• Incoming sync word (pattern) recognition

• Built-in bit synchronizer for incoming data, and clock

synchronization and recovery

Operational

• 64-byte transmit/receive FIFO with preload in stand-by

mode

• Operating voltage: 2.1–3.6V (3.3V typical)

• Temperature range: -40°C to +85°C Industrial

• Low-current consumption:

• Supports Manchester encoding/decoding

techniques

- Rx mode: 3 mA (typical)

- Tx mode: 25 mA at +10 dBm (typical)

- Sleep: 0.1 µA (typical)

Pin diagram

GND

RESET

CSCON

IRQ0

1

2

3

4

5

6

12 GND

11 GND

10 VIN

9

8

7

IRQ1

CSDATA

SDO

SDI

SCK

Preliminary

DS70651A-page 1

MRF89XAM8A

Table of Contents

.0

Device Overview .......................................................................................................................................................................... 3

2.0 Circuit Description ........................................................................................................................................................................ 9

3.0 Regulatory Approval................................................................................................................................................................... 19

4.0 Electrical Characteristics............................................................................................................................................................ 21

Appendix A: Revision History............................................................................................................................................................... 27

The Microchip Web Site....................................................................................................................................................................... 29

Customer Change Notification Service ................................................................................................................................................ 29

Customer Support................................................................................................................................................................................ 29

Reader Response ................................................................................................................................................................................ 30

Product Identification System............................................................................................................................................................... 31

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Most Current Data Sheet

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You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page.

The last character of the literature number is the version number, (e.g., DS30000A is version A of document DS30000).

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DS70651A-page 2

Preliminary

MRF89XAM8A

1.1

Interface description

1.0

DEVICE OVERVIEW

The simplified block diagram of the MRF89XAM8A

module is illustrated in Figure 1-1. The module is based

on the Microchip Technology MRF89XA ultra-low

power sub-GHz transceiver Integrated Circuit (IC). The

module interfaces to many popular Microchip PIC^®

microcontrollers through a 3-wire serial SPI interface,

two chip selects (configuration and data), two interrupts

Interrupt Request 0 (IRQ0) and Interrupt Request 1

(IRQ1), Reset, power and ground as illustrated in

Figure 1-2. Table 1-1 provides the related pin

descriptions.

The MRF89XAM8A is an ultra-low power sub-GHz

surface mount transceiver module with integrated

crystal, internal voltage regulator, matching circuitry

and PCB antenna. The MRF89XAM8A module

operates in the European 863–870 MHz frequency

band and is ETSI compliant. The integrated module

design frees the integrator from the extensive RF and

antenna design, and regulatory compliance testing,

allowing quicker time to market.

The MRF89XAM8A module is compatible with

Microchip’s MiWi™ Development Environment

software stacks. The software stacks are available as a

free download, including source code, from the

Microchip’s web site

Serial communication and module configuration are

documented in the “MRF89XA Ultra-Low Power,

Integrated Sub-GHz Transceiver” (DS70622) Data

Sheet. Refer to the “MRF89XA Data Sheet” for specific

serial interface protocol and general register

definitions. Also, see Section 1.3, Operation for

specific register settings that are unique to the

MRF89XAM8A module operation to maintain

regulatory compliance.

http://www.microchip.com/wireless.

The MRF89XAM8A module has been tested and

conforms to EN 300 220-2 V2.3.1 (2001–02) and EN

301 489-3 V1.4.1 (2002–08) European Standards. The

module tests can be applied toward final product

certification and Declaration of Conformity (DoC). To

maintain conformance, refer to module settings in

Section 1.3, Operation. Additional testing may be

required depending on the end application.

FIGURE 1-1:

MRF89XAM8A BLOCK DIAGRAM

MRF89XAM8A Module

MRF89XA

CSCON

CSDATA

Control

Interface

Matching

Circuitry

and

SAW Filter

SPI

Digital I/O

PCB

Antenna

RF

Baseband

IRQ0

Power

IRQ1

Management

RESET

Power

VCO

Tank

Loop

Filter

12.8 MHz Crystal

Preliminary

DS70651A-page 3

MRF89XAM8A

TABLE 1-1:

PIN DESCRIPTION

Symbol

Type

Description

1

2

GND

RESET

CSCON

IRQ0

SDI

Power

DI

Ground

Reset Pin

3

DI

Serial Interface Configure Chip Select

Interrupt Request Output

Serial Interface Data Input

Serial Interface Clock

Serial Interface Data Output

Serial Interface Data Chip Select

Interrupt Request Output

Power Supply

4

DO

5

DI

6

SCK

DI

7

SDO

DO

8

CSDATA

IRQ1

Vin

DI

9

DO

10

11

12

Power

GND

Ground

GND

Ground

FIGURE 1-2:

MICROCONTROLLER TO MRF89XAM8A INTERFACE

MRF89XAM8A

PIC^®Microcontroller

CSCON

I/O

CSDATA

SDI

I/O

SDO

SDI

SCK

INTx

I/O

Vin

SDO

GND

SCK

IRQ0

IRQ1

RESET

DS70651A-page 4

Preliminary

MRF89XAM8A

1.2

Mounting Details

The MRF89XAM8A is a surface mountable module, the

module dimensions are illustrated in Figure 1-3. The

module PCB is 0.032" thick with castellated mounting

holes on the edge. Figure 1-4 is the recommended host

PCB footprint for the MRF89XAM8A.

The MRF89XAM8A has an integrated PCB antenna.

For the best performance, follow the mounting details

as illustrated in Figure 1-5. It is recommended that the

module be mounted on the edge of the host PCB and

an area around the antenna, approximately 3.4" (8.6

cm), be kept clear of metal objects for best

performance. A host PCB ground plane around the

MRF89XAM8A acts as a counterpoise to the PCB

antenna. Extend the host PCB top copper ground plane

under and to the left and right side of the module at

least 0.4 inches (1 cm) for best antenna performance.

FIGURE 1-3:

MODULE DETAILS

Preliminary

DS70651A-page 5

MRF89XAM8A

FIGURE 1-4:

RECOMMENDED PCB FOOTPRINT

DS70651A-page 6

Preliminary

MRF89XAM8A

FIGURE 1-5:

MOUNTING DETAILS

Keep area around antenna

(approximately 3.4 inches (8.6

cm)) clear of metallic structures

for best performance.

3.4”

Edge of PCB

3.4”

0.470”

0.4”

Host PCB Top Copper Ground

Plane (Antenna Counterpoise):

Extend the host PCB top copper

ground plane under and to the left

and right side of the module at

least 0.4 inches (1 cm) for best

antenna performance.

Preliminary

DS70651A-page 7

MRF89XAM8A

1.3.4

FREQUENCY SHIFT KEYING

MODULATION (FSK)

1.3

Operation

The MRF89XAM8A module is based on the Microchip

Technology MRF89XA ultra-low power, integrated ISM

band sub-GHz transceiver IC. Serial communication

and module configuration are documented in the

“MRF89XA Ultra-Low Power, Integrated ISM Band

Sub-GHz Transceiver Data Sheet” (DS70622).

The following settings must be followed for FSK

modulation mode to conform to the European

standards summarized in Section 3.0, Regulatory

Approval.

• Bit Rate Maximum Setting: 40 kbps

This section emphasizes operational settings that are

unique to the MRF89XAM8A module design that must

be followed in order for the module to conform to the

tested European standards summarized in Section 3.0,

Regulatory Approval.

• Frequency Deviation Maximum Setting: 40 kHz

• Transmit Bandwidth Maximum Setting: 125 kHz

• Lower Frequency Setting: 863.5 MHz

• Upper Frequency Setting: 869.5 MHz

1.3.5

ON-OFF KEYING MODULATION

(OOK)

Note:

To maintain conformance to tested ETSI

standards, the module shall not be

modified and settings in Section 1.3,

Operation must be observed.

The following settings must be followed for OOK

modulation mode to conform to the European

standards summarized in Section 3.0, Regulatory

Approval.

1.3.1

RESET

Pin 2 of the module, RESET, enables an external reset

of the MRF89XA IC. RESET is connected to the TEST8

pin of the MRF89XA IC. During normal operations of

the MRF89XAM8A, the RESET pin should be held in a

high impedance state. For more information on

assertion of the RESET pin, refer to “Section 3.1.2

Manual Reset” of “MRF89XA Data Sheet” (DS70622).

• Bit Rate Maximum Setting: 16 kbps

• Frequency Deviation Maximum Setting: 80 kHz

• Transmit Bandwidth Maximum Setting: 125 kHz

• Lower Frequency Setting: 863.5 MHz

• Upper Frequency Setting: 869.5 MHz

1.3.2

CRYSTAL FREQUENCY

When calculating frequency deviation, bit rate, receiver

bandwidth, and PLL R, P and S values, use crystal

frequency f_xtal= 12.8 MHz.

1.3.3

CLOCK OUTPUT (CLKOUT)

The CLKOUT pin 19 of the MRF89XA IC is not used on

the module. Ensure that the CLKOUT signal is disabled

to minimize current consumption.

DS70651A-page 8

Preliminary

MRF89XAM8A

Figure 2-2 illustrates the MRF89XAM8A schematics.

Table 2-1 details the Bill of Materials (BOM).

2.0

CIRCUIT DESCRIPTION

The MRF89XAM8A module interfaces to Microchip’s

PIC16, PIC18, PIC24, dsPIC33 and PIC32

microcontrollers with

a

minimum of external

components through digital only connections. An

example application schematic is illustrated in

Figure 2-1.

2.1

Module Schematic

The MRF89XAM8A module is based on the Microchip

Technology MRF89XA Ultra-Low Power, Integrated

ISM Band sub-GHz Transceiver IC. The serial I/O

(CSCON, CSDATA, SCK, SDO and SDI), RESET,

IRQ0 and IRQ1 pins are brought to the module pins.

Crystal X1 is a 12.8 MHz crystal with a frequency

tolerance of ±10 ppm at 25°C. The RFIO output is

matched to the SAW filter FL1 and further matched to

the PCB trace antenna.

FIGURE 2-1:

MRF89XAM8A APPLICATION SCHEMATIC

+ 3.3V

Note 1

+

C2

1 0

C1

0.1

μ

F

μ

F

U1

MRF89XAMxA-I/RM

1

12

11

10

9

GND

RESET

CSCON

IRQ0

GND

2

3

VIN

To Host

4

5

6

Microcontroller

IRQ1

To Host

Microcontroller

8

SDI

CSDATA

SDO

7

SCK

Note:

For battery powered applications, place a 10 μF capacitor in parallel with the 0.1 μF bypass

capacitor to provide a low impedance during startup sequences.

Preliminary

DS70651A-page 9

MRF89XAM8A

TABLE 2-1:

Designator

C1

MRF89XAM8A BILL OF MATERIALS

Value

Description

Manufacturer

Part Number

0.047 µF Capacitor, Ceramic, 10V, ±10%, X7R, SMT

0402

Murata

GRM155R71A473KA

01D

C2

C3

C4

C5

0.22 µF Capacitor, Ceramic, 16V, ±10%, X7R, SMT

0402

GRM155R71C224KA

12D

1 µF

22 pF

1.8 pF

Capacitor, Ceramic, 6.3V, ±10%, X5R, SMT

0603

GRM188R60J105KA

01D

Capacitor, Ceramic, 50V, ±5%, UHI-Q NP0, Johanson Technology

SMT 0402

500R07S220JV4

500R07S1R8BV4

—

Capacitor, Ceramic, 50V, ±0.1 pF, UHI-Q Johanson Technology

NP0, SMT 0402

C6

C7

—

Designator not used

—

33 pF

Capacitor, Ceramic, 50V, ±5%, C0G, SMT

0402

Murata

GRM1555C1H330JZ

01D

C8

C9

0.1 µF

680 pF

Capacitor, Ceramic, 16V, ±10%, X7R, SMT

0402

Murata

GRM155R71C104KA

88D

Capacitor, Ceramic, 50V, ±5%, C0G, SMT

0402

GRM1555C1H681JA

01D

C10

C11

C12

0.01 µF Capacitor, Ceramic, 16V, ±10%, X7R, SMT

0402

GRM155R71C103KA

01D

4.3 pF

Capacitor, Ceramic, 50V, ±0.1 pF, UHI-Q Johanson Technology

NP0, SMT 0402

500R07S4R3BV4

1.5 pF

Capacitor, Ceramic, 50V, ±0.1 pF, UHI-Q Johanson Technology

NP0, SMT 0402

500R07S1R5BV4

FL1

L1

L2

L3

L4

L5

L6

R1

TA0801A

8.2 nH

100 nH

6.8 nH

Filter, SAW, 863–870 MHz

Inductor, Ceramic, ±5%, SMT 0402

Inductor, Wirewound, ±5%, SMT 0402

Designator not used

Tai-saw Technology

Johanson Technology

TA0801A

L-07C8N2JV6T

L-07CR10JV6T

L-07W6N8JV4T

10 nH

Inductor, Ceramic, ±5%, SMT 0402

Resistor, 1%, ±100 ppm/⁰C, SMT 0402

Johanson Technology

Vishay/Dale

L-07C10NJV6T

1 Ω

CRCW04021R00FKE

D

R2

R3

U1

100K Ω

6.8K Ω

Resistor, 5%, ±100 ppm/⁰C, SMT 0402

Resistor, 1%, ±100 ppm/⁰C, SMT 0402

Yageo

RC0402JR-07100KL

RC0402FR-076K8L

MRF89XA-I/MQ

MRF89XA Transceiver, Ultra-Low Power, Integrated Microchip Technology

sub-GHz

X1

12.8 MHz

Crystal, ±10 ppm, 15 pF, ESR 100 ohms,

SMT 5 x 3.2mm

Abracon

ABM3B-155-12.800M

Hz-T

Preliminary

DS70651A-page 11

MRF89XAM8A

FIGURE 2-5:

LAYER 2 — GROUND

PLANE

2.2

Printed Circuit Board

The MRF89XAM8A module PCB is constructed with

high temperature FR4 material, 4 layers and 0.032

inches thick. These layers are shown in Figure 2-3

through Figure 2-8. The stack up of the PCB is shown

in Figure 2-9

FIGURE 2-3:

TOP SILK SCREEN

FIGURE 2-6:

LAYER 3 — POWER

PLANE

FIGURE 2-4:

TOP COPPER

DS70651A-page 12

Preliminary

MRF89XAM8A

FIGURE 2-7:

BOTTOM COPPER

FIGURE 2-8:

BOTTOM SILK SCREEN

Preliminary

DS70651A-page 13

MRF89XAM8A

FIGURE 2-9:

PCB LAYER STACK UP

1/2 oz. Copper

8 mil FR4

Top Copper

1/2 oz. Copper

12 mil FR4

Ground Plane

Power Plane

Bottom Copper

0.032”

± 0.005”

1/2 oz. Copper

8 mil FR4

1/2 oz. Copper

FIGURE 2-10:

PCB ANTENNA

DIMENSIONS

2.3

PCB Antenna

The PCB antenna is fabricated on the top copper trace.

Figure 2-10 illustrates the trace dimensions. The layers

below the antenna have no copper traces. The ground

and power planes under the components serve as a

counterpoise to the PCB antenna. Additional ground

plane on the host PCB will substantially enhance the

performance of the module. For best performance,

place the module on the host PCB by following the

recommendations given in the Section 1.2, Mounting

Details.

16.8mm

1.0mm

2.5mm

1.1mm

0.5mm

The PCB antenna was designed and simulated using

Ansoft Designer^®and HFSS™ 3D full-wave solver

software by ANSYS Inc. (www.ansoft.com). The goal of

the design was to create a compact, low-cost antenna

with the best radiation pattern. Figure 2-11 illustrates

the simulation drawing and Figure 2-12 and

Figure 2-13 illustrates the 2D and 3D radiation

patterns. As shown by the radiation patterns, the

performance of the antenna is dependant upon the

orientation of the module. Figure 2-14 illustrates the

impedance simulation and Figure 2-15 illustrates the

simulated PCB antenna VSWR. The discrete matching

circuitry matches the impedance of the antenna with

the SAW filter and MRF89XA transceiver IC.

8.4mm

DS70651A-page 14

Preliminary

MRF89XAM8A

FIGURE 2-11:

PCB ANTENNA SIMULATION DRAWING

FIGURE 2-12:

SIMULATED 2D RADIATION PATTERN

Preliminary

DS70651A-page 15

MRF89XAM8A

FIGURE 2-13:

SIMULATED 3D RADIATION PATTERN

FIGURE 2-14:

SIMULATED PCB ANTENNA IMPEDANCE

DS70651A-page 16

Preliminary

MRF89XAM8A

FIGURE 2-15:

SIMULATED PCB ANTENNA VSWR

Preliminary

DS70651A-page 17

MRF89XAM8A

NOTES:

DS70651A-page 18

Preliminary

MRF89XAM8A

3.1.1

HELPFUL WEB SITES

3.0

3.1

REGULATORY APPROVAL

Europe

A helpful document that can be used as a starting

point in understanding the use of Short Range Devices

(SRD) in Europe is the European Radio

Communications Committee (ERC) Recommendation

70-03 E, can be downloaded from the following

websites:

The MRF89XAM8A module conforms to the emission

and immunity standards summarized in Table 3-1. The

module tests can be applied toward final product

certification and DoC.

• European Radio Communications Office (ERO):

http://www.ero.dk.

Note:

To maintain conformance tested ETSI

standards, the module shall not be modi-

fied and settings in Section 1.3, Operation

must be observed.

• Radio and Telecommunications Terminal

Equipment (R&TTE):

http://ec.europa.eu/enterprise/rtte/index_en.htm

The European Standards do not provide a modular

approval similar to the USA (FCC) and Canada (IC).

However, the completed compliance testing can be

used as part of the customer's application for product

certification. The module test report data can be

included in the customer's product test plan and can

significantly lower customer's certification burden.

• European Conference of Postal and

Telecommunications Administrations (CEPT):

http://www.cept.org/

• European Telecommunications Standards

Institute (ETSI): http://www.etsi.org/

Depending on the end application, additional testing

may be required. The integrator is responsible for

testing the end product for any additional compliance

requirements that become necessary with this module

installed (for example, digital device emission, PC

peripheral requirements and so on) in the specific

country where end device is marketed.

TABLE 3-1:

EMISSIONS AND IMMUNITY STANDARDS TESTED

Specification

Test Method

Emission Standards

EN 300 220-2 V2.3.1 (2001–02)

7.1.2

7.3.2

7.5.2

7.7.2

Frequency error and drift

Effective Radiated Power

Transient power

5.1.3.1

5.1.3.3

5.1.3.4

5.1.3.6

5.1.3.7

5.1.4.6

Modulation bandwidth

—

Unwanted emissions on the spurious domain

Receiver spurious radiation

8.6.4

Immunity Standards

EN 301 489-3 V1.4.1 (2002–08)

—

Conducted emissions

Radiated emissions

Radiated immunity

EN 55022:2007

EN 61000-4-3

Preliminary

DS70651A-page 19

MRF89XAM8A

NOTES:

DS70651A-page 20

Preliminary

MRF89XAM8A

4.0

ELECTRICAL CHARACTERISTICS

Absolute Maximum Ratings

Ambient temperature under bias.............................................................................................................. -40°C to +85°C

Storage temperature .............................................................................................................................. -55°C to +125°C

Voltage on VIN with respect to VSS ................................................................................................................ -0.3V to 6V

Voltage on any combined digital and analog pin with respect to VSS (except VIN) ...........................-0.3V to (VIN + 0.3V)

Input current into pin (except VIN and VSS)........................................................................................... -25 mA to 25 mA

Electrostatic discharge with human body model.................................................................................................... 1000V

NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the

device. This is a stress rating only and functional operation of the device at those or any other conditions above

those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for

extended periods may affect device reliability.

Preliminary

DS70651A-page 21

MRF89XAM8A

TABLE 4-1:

RECOMMENDED OPERATING CONDITIONS

Parameter

Min

Typ

Max

Unit

Condition

Ambient Operating Temperature

Supply Voltage for RF, Analog and Digital Circuits

Supply Voltage for Digital I/O

Input High Voltage (VIH)

-40

2.1

—

+85

3.6

°C

V

—

2.1

3.6

V

0.5 * VIN

VIN + 0.3

0.2 * VIN

VIN + 1.5

V

Input Low Voltage (VIL)

AC Peak Voltage on Open Collector Outputs (IO)⁽¹⁾VIN – 1.5

-0.3V

V

Note 1: At minimum, VIN – 1.5V should not be lower than 1.8V.

TABLE 4-2:

Symbol

CURRENT CONSUMPTION

Chip Mode

Min

Typ

Max

Unit

Condition

IDDSL

Sleep

—

0.1

2

µA

Sleep clock disabled, all blocks

disabled

IDDST

Idle

—

65

80

µA

Oscillator and baseband enabled

Frequency synthesizer running

IDDFS

IDDTX

Frequency Synthesizer

Tx

1.3

1.7

mA

—

25

16

30

21

mA

Output power = +10 dBm

Output power = +1 dBm⁽¹⁾

IDDRX

Rx

—

3.0

3.5

mA

—

Note 1: Guaranteed by design and characterization.

TABLE 4-3:

Symbol

DIGITAL I/O PIN INPUT SPECIFICATIONS⁽¹⁾

Characteristic

Min

Typ

Max

Unit

Condition

VIL

VIH

IIL

Input Low Voltage

Input High Voltage

Input Low Leakage Current⁽²⁾

Input High Leakage Current

Digital Low Output Voltage

Digital Low Output

—

0.8 * VIN

-0.5

—

0.2 * VIN

—

V

—

0.5

µA

—

V

VIL = 0V

IIH

-0.5

0.5

VIH = VIN, VIN = 3.7

IOL = 1 mA

IOH = -1 mA

VOL

VOH

—

0.1 * VIN

—

0.9 * VIN

Note 1: Measurement Conditions: TA = 25°C, VIN = 3.3V, Crystal Frequency = 12.8 MHz, unless otherwise

specified.

2: Negative current is defined as the current sourced by the pin.

DS70651A-page 22

Preliminary

MRF89XAM8A

TABLE 4-4:

Symbol

PLL PARAMETERS AC CHARACTERISTICS⁽¹⁾

Parameter

Min

Typ

Max

Unit

Condition

FRO

Frequency Ranges

Bit Rate (FSK)

863

1.56

33

—

870

40

MHz

kbps

kHz

BRFSK

BROOK

FDFSK

FXTAL

FSSTP

NRZ

—

Bit Rate (OOK)

—

16

Frequency Deviation (FSK)

Crystal Oscillator Frequency

Frequency Synthesizer Step

50

12.8

2

200

—

9

MHz

kHz

—

Variable, depending on the

frequency

TSOSC

TSFS

Oscillator Wake-up Time

—

1.5

5

ms

µs

From Sleep mode⁽¹⁾

Frequency Synthesizer

Wake-up Time; at most,

10 kHz away from the target

500

800

From Stand-by mode

TSHOP

Frequency Synthesizer Hop

Time; at most, 10 kHz away

from the target

—

180

200

250

260

290

320

340

—

µs

200 kHz step

1 MHz step

5 MHz step

7 MHz step

12 MHz step

20 MHz step

27 MHz step

Note 1: Guaranteed by design and characterization.

Preliminary

DS70651A-page 23

MRF89XAM8A

(1)

TABLE 4-5:

Symbol

RSF

RECEIVER AC CHARACTERISTICS

Parameter

Min

Typ

Max

Unit

Condition

Sensitivity (FSK)

—

-107

—

dBm

869 MHz, BR = 25 kbps,

f_dev= 50 kHz, f_c= 100 kHz

—

-103

-113

-106

—

dBm

869 MHz, BR = 66.7 kbps,

f_dev= 100 kHz, f_c= 200 kHz

RSO

Sensitivity (OOK)

869 MHz, 2 kbps NRZ

f_c– f_o= 50 kHz, f_o= 50 kHz

869 MHz, 16.7 kbps NRZ

f_c– f_o= 100 kHz, f_o= 100 kHz

CCR

ACR

Co-Channel Rejection

—

-12

27

—

dBc

dB

Modulation as wanted signal

Adjacent Channel Rejection

Offset = 300 kHz, unwanted tone is

not modulated

—

52

57

—

dB

Offset = 600 kHz, unwanted tone is

not modulated

Offset = 1.2 MHz, unwanted tone is

not modulated

BI

Blocking Immunity

—

-48

-37

—

dBm

Offset = 1 MHz, unmodulated

Offset = 2 MHz, unmodulated, no

SAW

—

50

—

-33

—

250

400

—

dBm

kHz

dBm

Offset = 10 MHz, unmodulated, no

SAW

RXBWF

RXBWU

ITP3

Receiver Bandwidth in FSK

Mode⁽²⁾

Single side BW, Polyphase Off

Receiver Bandwidth in OOK

Mode⁽²⁾

—

Single side BW, Polyphase On

Input Third Order Intercept

Point

-28

Interferers at 1 MHz and 1.950 MHz

offset

TSRWF

TSRWS

TSRHOP

Receiver Wake-up Time

—

280

600

400

460

480

520

550

600

—

500

900

—

µs

s

From FS to Rx ready

From Stand-by to Rx ready

200 kHz step

Receiver Hop Time from Rx

Ready to Rx Ready with a

Frequency Hop

—

1 MHz step

—

5 MHz step

—

7 MHz step

—

12 MHz step

—

20 MHz step

—

27 MHz step

RSSIST

RSSI Sampling Time

RSSI Dynamic Range

1/f_dev

—

From Rx ready

Ranging from sensitivity

RSSTDR

70

dB

Note 1: Guaranteed by design and characterization.

2: This reflects the whole receiver bandwidth, as described by conditions for active and passive filters.

DS70651A-page 24

Preliminary

MRF89XAM8A

(1)

TABLE 4-6:

Symbol

TRANSMITTER AC CHARACTERISTICS

Description

Min

—

Typ

+12.5

-8.5

Max

—

Unit

Condition

RFOP

RF Output Power, Programmable

with 8 Steps of typ. 3 dB

dBm

Maximum power setting

Minimum power setting

—

PN

Phase Noise

—

-112

—

dBc/Hz

dBc

Measured with a 600 kHz

offset at the transmitter output

TXSP

Transmitted Spurious

-47

At any offset between 200 kHz

and 600 kHz, unmodulated

carrier, f_dev= 50 kHz

Tx2

Second Harmonic

Third Harmonic

No modulation, see Note⁽²⁾

Tx3

—

-40

dBm

Tx4

Fourth Harmonic

Txn

Harmonics above Tx4

FSK Deviation

FSKDEV

TSTWF

±33

—

±55

120

±200

500

kHz

µs

Programmable

Transmitter Wake-up Time

From FS to Tx ready

TSTWS

Transmitter Wake-up Time

—

600

900

µs

From Stand-by to Tx ready

Note 1: Guaranteed by design and characterization.

2: Transmitter in-circuit performance with SAW filter and crystal.

Preliminary

DS70651A-page 25

MRF89XAM8A

4.1

Timing Specification and Diagram

(1,2)

TABLE 4-7:

SPI TIMING SPECIFICATION

Parameter

Min

Typ

Max

Unit

Condition

SPI Configure Clock Frequency

SPI Data Clock Frequency

—

6

MHz

µs

—

1

Data Hold and Setup Time

2

—

SDI Setup Time for SPI Configure

SDI Setup Time for SPI Data

250

312

500

ns

CSCON Low to SCK Rising Edge;

SCK Falling Edge to CSCON High

ns

CSDATA Low to SCK Rising Edge;

SCK Falling Edge to CSDATA High

625

—

ns

—

CSCON Rising to Falling Edge

CSDATA Rising to Falling Edge

500

625

—

ns

—

Note 1: Typical Values: TA = 25°C, VIN = 3.3V, Crystal Frequency = 12.8 MHz, unless otherwise specified.

2: Negative current is defined as the current sourced by the pin.

DS70651A-page 26

Preliminary

MRF89XAM8A

APPENDIX A: REVISION HISTORY

Revision A (November 2010)

This is the Initial release of the document.

Preliminary

DS70651A-page 27

MRF89XAM8A

NOTES:

DS70651A-page 28

Preliminary

MRF89XAM8A

THE MICROCHIP WEB SITE

CUSTOMER SUPPORT

Microchip provides online support via our WWW site at

www.microchip.com. This web site is used as a means

to make files and information easily available to

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To register, access the Microchip web site at

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Notification and follow the registration instructions.

Preliminary

DS70651A-page 29

MRF89XAM8A

READER RESPONSE

It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip

product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our

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MRF89XAM8A

DS70651A

Literature Number:

Device:

Questions:

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7. How would you improve this document?

DS70651A-page 30

Preliminary

MRF89XAM8A

PRODUCT IDENTIFICATION SYSTEM

To order or obtain information, for example, on pricing or delivery, refer to the factory or the listed sales office.

Example:

M

X

-X

T

PART NO

Device

a)

MRF89XAM8A-I/RM: Industrial temperature

tray.

b)

MRF89XAM8AT-I/RM: Industrial temperature

tape and reel,

Module

Tape and

Reel

Temperature

Range

Module

Type

Device

MRF89XAM8A-I/RM: Ultra Low-Power, Integrated ISM Band Sub-GHz

Transceiver module

Temperature

Range

I

= -40ºC to +85ºC (Industrial)

Preliminary

DS70651A-page 31

Worldwide Sales and Service

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08/04/10

DS70651A-page 32

Preliminary


型号：	MRF89XA
厂家：	MICROCHIP
描述：	The MRF89XA is a single chip, multi-channelFSK/OOK transceiver capable of operating in the 863-870
文件：	总34页 (文件大小：682K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

MRF89XA [MICROCHIP]

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