MTCH102-I/SS [MICROCHIP]
2, 5 and 8-Channel Proximity/Touch Controller Data Sheet;
| 型号： | MTCH102-I/SS |
| 厂家： | 
MICROCHIP |
| 描述： | 2, 5 and 8-Channel Proximity/Touch Controller Data Sheet |
| 文件： | 总37页 (文件大小：1002K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MTCH102/5/8
2, 5 and 8-Channel Proximity/Touch Controller Data Sheet
Description
The Microchip mTouch® MTCH102/5/8 Proximity/Touch Controller with simple digital output provides an easy way to
add proximity or touch detection to any application. This device family implements capacitive sensors with active
guarding capability. The sensitivity and power mode can be configured through the MTSA and MTPM pins. The
MTCH102/5/8 devices also use an advanced optimization algorithm to actively suppress noise from the signal to
achieve reliable proximity/touch detection.
• Flexible Low-Power mode
• Brown-Out Protection
• Capacitive Proximity and Touch Detection
• Operating Voltage Range:
Features
System:
- 2.05V to 3.6V
- High Signal to Noise Ratio (SNR)
• Operating Temperature:
- Adjustable sensitivity with compensation for
- 40°C to +85°C
different sensor sizes
- Multi-stage active noise suppression filters
- Automatic environmental compensation
Typical Application
- Support wide range of sensor shapes and
sizes
• Light Switch
• Portable Device Enabler
• Simple I/O Interface with Existing System
• Smart Scan Scheduling
• Threshold Hysteresis
• White Goods and Appliance
• Office Equipment and Toys
• Display and Keypad Back-lighting Activation
TABLE 1:
Device
MTCH10X FAMILY TYPES
Data Sheet Index
Sensor Input
Active Guard
Digital Output
MTCH101
MTCH102
MTCH105
MTCH108
(A)
(B)
(B)
(B)
1
N
1
2
5
8
2(1)
5(1)
8(1)
Y(1)
Y(1)
Y(1)
Note 1: One of the sensor inputs can be configured as active guard output.
Data Sheet Index: (Unshaded devices are described in this document.)
A: DS-40001664
B: DS-40001793
MTCH101 Single-Channel Proximity Detector
MTCH102/105/108 Dual-Channel Proximity/Touch Controller
Note:
For other small form-factor package availability and marking information, please visit
http://www.microchip.com/packaging or contact your local sales office.
TABLE 2:
PACKAGES
Packages
MSOP
TSSOP
SSOP
UDFN
QFN
UQFN
MTCH102
MTCH105
MTCH108
X
—
X
—
—
X
X
—
X
—
—
X
—
—
—
—
—
—
2015-2016 Microchip Technology Inc.
Preliminary
DS40001793C-page 1
MTCH102/5/8
FIGURE 4:
20-LEAD SSOP
PIN DIAGRAMS
FIGURE 1:
8-LEAD MSOP, UDFN
VSS
VDD
MTI0
MTI1
20
19
18
17
1
2
3
4
5
MTO0
MTO1
MTSA
MTPM
VDD
1
2
3
4
VSS
8
7
6
MTO2/GC
MTO3
MTI2/Guard
16
15
14
13
MTI0
MTO0
MTO1/GC
MTI3
MTI4
MTI5
MTI6
MTI7
6
MTI1/Guard
MTPM
MTO4
7
5
MTSA
MTO5
8
12 MTO6
11
9
MTO7
10
Note: See Table 3 for the pin allocation table.
Note: See Table 5 for the pin allocation table.
FIGURE 5:
20-LEAD UQFN
FIGURE 2:
14-LEAD TSSOP
1
2
3
14 VSS
VDD
MTI0
MTI1
MTO0
13
12
MTO1
MTSA
1
MTPM
15 MTO1
MTSA
MTI2/Guard 2
14
13 MTO2/GC
MTPM
3
4
11
MTI3
MTI4
4
MTCH108
MTO3
MTO4
12
11
MTO2/GC
MTO3
MTI5 5
MTI2/ Guard
MTI3
10
9
5
6
7
8
MTO4
MTI4
Note: See Table 5 for the pin allocation table.
Note: See Table 4 for the pin allocation table.
FIGURE 3:
16-LEAD QFN
MTO0
1
2
3
4
12
MTI0
MTI1
MTPM
MTO1
11
10
9
MTCH105
MTSA
MTO2/GC
MTI2/Guard
Note: See Table 4 for the pin allocation table.
DS40001793C-page 2
Preliminary
2015-2016 Microchip Technology Inc.
MTCH102/5/8
PIN ALLOCATION TABLES
TABLE 3:
Name
8-PIN DESCRIPTION (MTCH102)
8-Lead
MSOP and
UDFN
Description
VDD
1
2
3
4
5
6
7
8
Power Supply Input
MTI0
Proximity/Touch Sensor 0 Input
MTI1/Guard
MTPM
MTSA
MTO1/GC
MTO0
VSS
Proximity/Touch Sensor 1 Input/Active Guard
Low-Power Mode Select
Sensitivity Adjust Input
MTI1 Detect Output (Active-Low)/Guard Control
MTI0 Detect Output (Active-Low)
Ground
TABLE 4:
Name
14-/16-PIN DESCRIPTION (MTCH105)
14-Lead
TSSOP
16-Lead
QFN
Description
VDD
1
2
16
1
Power Supply Input
MTI0
Proximity/Touch Sensor 0 Input
Proximity/Touch Sensor 1 Input
Low-Power Mode Select
MTI1
3
2
MTPM
MTI2/Guard
MTI3
4
3
5
4
Proximity/Touch Sensor 2 Input/Active Guard
Proximity/Touch Sensor 3 Input
Proximity/Touch Sensor 4 Input
MTI4 Detect Output (Active-Low)
MTI3 Detect Output (Active-Low)
MTI2 Detect Output (Active-Low) /Guard Control
Sensitivity Adjust Input
6
5
MTI4
7
6
MTO4
MTO3
MTO2/GC
MTSA
MTO1
MTO0
VSS
8
7
9
8
10
11
12
13
14
9
10
11
12
13
MTI1 Detect Output (Active-Low)
MTI0 Detect Output (Active-Low)
Ground
2015-2016 Microchip Technology Inc.
Preliminary
DS40001793C-page 3
MTCH102/5/8
TABLE 5:
Name
20-PIN DESCRIPTION (MTCH108)
20-Lead
SSOP
20-Lead
UQFN
Description
VDD
1
2
18
19
20
1
Power Supply Input
MTI0
Proximity/Touch Sensor 0 Input
Proximity/Touch Sensor 1 Input
Low-Power Mode Select
MTI1
3
MTPM
MTI2/Guard
MTI3
4
5
2
Proximity/Touch Sensor 2 Input/Active Guard
Proximity/Touch Sensor 3 Input
Proximity/Touch Sensor 4 Input
Proximity/Touch Sensor 5 Input
Proximity/Touch Sensor 6 Input
Proximity/Touch Sensor 7 Input
MTI7 Detect Output (Active-Low)
MTI6 Detect Output (Active-Low)
MTI5 Detect Output (Active-Low)
MTI4 Detect Output (Active-Low)
MTI3 Detect Output (Active-Low)
MTI2 Detect Output (Active-Low)/Guard Control
Sensitivity Adjust Input
6
3
MTI4
7
4
MTI5
8
5
MTI6
9
6
MTI7
10
11
12
13
14
15
16
17
18
19
20
7
MTO7
MTO6
MTO5
MTO4
MTO3
MTO2/GC
MTSA
MTO1
MTO0
VSS
8
9
10
11
12
13
14
15
16
17
MTI1 Detect Output (Active-Low)
MTI0 Detect Output (Active-Low)
Ground
DS40001793C-page 4
Preliminary
2015-2016 Microchip Technology Inc.
MTCH102/5/8
Table of Contents
1.0 Device Overview .......................................................................................................................................................................... 6
2.0 Typical Circuit............................................................................................................................................................................... 8
3.0 Sensitivity Adjustment .................................................................................................................................................................. 9
4.0 Power Mode and Timeout Reset................................................................................................................................................ 10
5.0 Electrical Specifications.............................................................................................................................................................. 11
6.0 Packaging Information................................................................................................................................................................ 15
Appendix.............................................................................................................................................................................................. 33
The Microchip Website......................................................................................................................................................................... 34
Product Identification System .............................................................................................................................................................. 35
Customer Change Notification Service ................................................................................................................................................ 34
Customer Support................................................................................................................................................................................ 34
TO OUR VALUED CUSTOMERS
It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip
products. To this end, we will continue to improve our publications to better suit your needs. Our publications will be refined and
enhanced as new volumes and updates are introduced.
If you have any questions or comments regarding this publication, please contact the Marketing Communications Department via
E-mail at docerrors@microchip.com. We welcome your feedback.
Most Current Data Sheet
To obtain the most up-to-date version of this data sheet, please register at our Worldwide Website at:
http://www.microchip.com
You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page.
The last character of the literature number is the version number, (e.g., DS30000000A is version A of document DS30000000).
Errata
An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current
devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revision
of silicon and revision of document to which it applies.
To determine if an errata sheet exists for a particular device, please check with one of the following:
•
•
Microchip’s Worldwide Website; http://www.microchip.com
Your local Microchip sales office (see last page)
When contacting a sales office, please specify which device, revision of silicon and data sheet (include literature number) you are
using.
Customer Notification System
Register on our website at www.microchip.com to receive the most current information on all of our products.
2015-2016 Microchip Technology Inc.
Preliminary
DS40001793C-page 5
MTCH102/5/8
at run-time. An active-low output will communicate the
state of the sensors to a host/master MCU or drive an
indication LED.
1.0
DEVICE OVERVIEW
The MTCH102/5/8 provides an easy way to add
proximity or touch detection to any application with
human machine interface. These devices can integrate
up to two, five and eight capacitive touch/proximity
detection sensors which can work through plastic,
wood or even metal front panels with Microchip’s
proprietary Metal over Capacitive technology. It also
supports a wide range of conductive materials as
sensors, like copper pad on PCB, silver ink, PEDOT or
carbon printing on plastic film, Indium Tin Oxide (ITO)
pad, wire/cable, etc.
The MTCH102/5/8 uses
a
sophisticated scan
optimization algorithm to actively attenuate noise from
the signal. The sensitivity adjustment and flexible
power mode allow users to easily configure the device
FIGURE 1-1:
MTCH102/5/8 BLOCK DIAGRAM
1.1
Pin Description
Guard
The Guard function is multiplexed with one of the MTIx
pins. If the GC pin is floating, the Guard pin will function
as a standard MTIx sensor. If the GC pin is grounded,
the Guard pin will output a signal in-phase with the
other sensors being scanned. This has several
advantages, such as providing a mutual capacitance
coupling to the sensors to increase sensitivity, and
providing a low-impedance trace near the sensor to
absorb noise. The active guard layout should encircle
the sensor and its traces so that it will shield the sensor.
For more information about guarding and layout
guidelines, see application notes “mTouch® Sensing
Solution Acquisition Methods Capacitive Voltage
Divider” (AN1478) and “Techniques for Robust Touch
Sensing Design” (AN1334).
MTIx
Connect the sensor to this input. An additional resistor
of at least 4.7 kΩ is recommended for best noise
immunity. Sensors work best when the base
capacitance is minimized. This will maximize the
percentage change in capacitance when a finger is
added to the circuit. The recommended sensor
capacitance is 5pF to 50pF.
MTOx
The MTOx pin is an open-drain output which reports
the touch/proximity state of the corresponding MTIx
input. A pull-up resistor is required on each output. The
MTOx will pull the line low when a touch/proximity
event happens and release the line when the touch/
proximity is released.
DS40001793C-page 6
Preliminary
2015-2016 Microchip Technology Inc.
MTCH102/5/8
GC
The GC (Guard Control) is multiplexed with one of the
MTOx pins. By grounding the GC pin, the active guard
signal will be enabled on the Guard pin.
MTSA
The MTSA pin is an input that determines the
sensitivity of touch/proximity sensors. Applying VDD will
give the lowest sensitivity while applying VSS will give
the highest.
MTPM
The MTPM pin is an input that determines the power
mode of MTCH10X devices. By connecting VSS to the
MTPM pin, the device will operate in Low-Power mode.
See Figure 5-1 for current consumption and response
time specifications. When applying VDD on the
MTCH10X MTPM pin, the device will scan the sensors
at the fastest possible sampling rate. Host-controlled
sampling rates are available using the Smart Scan
Scheduling feature described in Section 4.0, Power
Mode and Timeout Reset.
2015-2016 Microchip Technology Inc.
Preliminary
DS40001793C-page 7
MTCH102/5/8
2.0
TYPICAL CIRCUIT
The MTCH102 is used as an example to show two
typical circuits for MTCH10X devices in the following
figures. For more information about capacitive sensor
layout guidance, refer to “Techniques for Robust Touch
Sensing Design” (AN1334).
FIGURE 2-1:
TWO SENSORS AND NO ACTIVE GUARD CIRCUIT
V
D D
V D D
C 1
R 6
1 0 K
R 7
U 1
0 . 1 u F
1 ꢀ
2
8
7
6
5
V
D D
V S S ꢀ
1
0
K
G
N
D
R
1
M
T
I
0
M T O 0
M T O 1 / G C
M T S A
M T O 0
M T O 1
3
4 . 7 K
R 2
M
T
I
1
/
G
u
a
r
d
S e n s o r
S e n s o r
R
3
4
V D D
M
T
P
M
07&+ꢀꢁꢂ
1 0 K
R
4
4
.
7
K
M
T
P
M
R 5
G N D
FIGURE 2-2:
ONE SENSOR WITH ACTIVE GUARD CIRCUIT
V
D
D
V
D
D
C
1
R 6
1 0 K
U
1
0
.
1
u
F
1 ꢀ
2
8
7
6
5
V
D
D
V
S
S
ꢀ
G
N
D
R
1
M
T
I
0
M T O 0
M T O 1 / G C
M T S A
M
T
O
0
4
.
7
K
3
M
T
I
1
/
G
u
a
r
d
S
R
3
4
V
D
D
M
T
P
M
R 2
0
A
c
t
i
v
e
G
u
a
r
d
G
N
D
1
0
K
07&+ꢀꢁꢂ
R
4
M
T
P
M
R
5
G
N
D
DS40001793C-page 8
Preliminary
2015-2016 Microchip Technology Inc.
MTCH102/5/8
FIGURE 3-3:
SENSITIVITY
CONTROLLED BY HOST
USING DAC
3.0
SENSITIVITY ADJUSTMENT
The sensitivity of the sensor inputs determines how far
it can respond to proximity or how much capacitance is
required to activate a touch. The voltage on the
MTCH102/5/8 MTSA pin will determine the sensitivity.
VDD voltage will give the lowest sensitivity, while VSS
voltage will give the highest. The device will sample the
voltage on the MTSA pin after every 32nd scan, so it
does not only support setting a fixed sensitivity by a
resistor ladder, but it also allows adjusting the
sensitivity dynamically while the device is running. A
Digital-to-Analog Converter (DAC) controlled by the
host or a hardware potentiometer can be used to adjust
the sensitivity. Refer to the typical circuit in Figure 3-1
to Figure 3-4.
Host
R2
MTSA
10k
DAC
FIGURE 3-4:
SENSITIVITY
CONTROLLED BY HOST
USING PWM
FIGURE 3-1:
FIXED SENSITIVITY
USING RESISTOR
LADDER
VDD
R1
R2
R3
Host
MTSA
R
10k
PWM
MTSA
C
Note:
Both R1 and R2 are recommended
to be greater than 100K for lower
power consumption.
Note:
Refer to Application Note “Using PWM to
Generate Analog Output” (AN538) for
details about how to choose appropriate
R and C values.
FIGURE 3-2:
HARDWARE SENSITIVITY
ADJUST USING
POTENTIOMETER
VDD
R2
R1
MTSA
10k
2015-2016 Microchip Technology Inc.
Preliminary
DS40001793C-page 9
MTCH102/5/8
FIGURE 4-2:
SMART-SCHEDULING
MODE
4.0
POWER MODE AND TIMEOUT
RESET
The MTCH102/5/8 has three power mode options to
meet the needs of various applications: Normal mode,
Low-Power mode and Smart-Scheduling mode. The
state of the MTPM pin determines the power mode.
Burst Scan
Sleep
MTIx
4.1
Normal Mode
The device will run in Normal mode if the MTPM pin is
connected to VDD. In this mode, the MTCH102/5/8 will
scan continuously; so it will achieve the shortest
response time among the three power modes, but also
the power consumption is the highest.
Scan Interval
MTPM
4.2
Low-Power Mode
The device will run in Low-Power mode if the MTPM pin
is connected to VSS. The device will go to Sleep for
256 ms after each round of sensor scans; so it will
achieve the lowest power consumption, but it will have
the longest response time among the three power
modes, as shown in Figure 4-1.
4.4
Timeout Reset
The device keeps track of the activated state duration
for each MTIx input channel. The sensor state will be
reset once the activated state duration exceeds the
timeout duration, and the associated MTOx pin will
release the line.
For the Normal and Low-Power modes, the timeout
duration is 10 seconds. For the Smart-Scheduling
mode, the timeout duration is 400 multiplied by the
scan interval.
FIGURE 4-1:
LOW-POWER MODE
Burst Scan
Sleep:256ꢀms
MTIx
4.3
Smart-Scheduling Mode
The MTCH102/5/8 also implements a Smart-Scheduling
mode that allows a host to set the exact sampling rate by
pulsing the MTPM pin, as shown in Figure 4-2. The
minimum recognizable pulse width is 25 ns. If the MTPM
pin is toggled during a scan cycle, the device will skip the
next Sleep and immediately start a new set of scans.
DS40001793C-page 10
Preliminary
2015-2016 Microchip Technology Inc.
MTCH102/5/8
5.0
ELECTRICAL SPECIFICATIONS
(†)
Absolute Maximum Ratings
Ambient temperature under bias....................................................................................................... -40°C to +125°C
Storage temperature ........................................................................................................................ -65°C to +150°C
Voltage on pins with respect to VSS
on VDD pin ................................................................................................................................ -0.3V to +4.0V
on all other pins ............................................................................................................. -0.3V to (VDD + 0.3V)
Total power dissipation(1) ...............................................................................................................................800 mW
Maximum current
out of VSS pin
-40°C TA +85°C for industrial.......................................................................................................... 85 mA
into VDD pin
-40°C TA +85°C for industrial .......................................................................................................... 80 mA
Clamp current, IK (VPIN < 0 or VPIN > VDD)20 mA
Maximum output current
sunk by any I/O pin................................................................................................................................25 mA
sourced by any I/O pin...........................................................................................................................25 mA
Note 1: Power dissipation is calculated as follows: PDIS = VDD x {IDD – IOH} + {(VDD – VOH) x IOH} + (VOl x IOL).
† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for
extended periods may affect device reliability.
5.1
DC Characteristics: MTCH102/5/8
Standard Operating Conditions (unless otherwise
stated)
MTCH102/5/8
Operating temperature -40°C ≤ TA ≥ +85°C for industrial
Param. Sym.
No.
Characteristic
Supply Voltage
Min. Typ.† Max. Units
Conditions
D001
VDD
2.05
—
3.6
V
D002* VDR
VPOR*
RAM Data Retention Voltage (1)
1.5
—
—
—
—
V
V
Device in Sleep mode
Device in Sleep mode
Power-on Reset Release Volt-
age
1.6
VPORR* Power-on Reset Rearm Voltage
—
0.8
—
—
—
V
D004* SVDD
VDD Rise Rate to ensure internal
0.05
V/ms
Power-on Reset signal
*
These parameters are characterized but not tested.
†
Data in “Typ.” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance
only and are not tested.
Note 1: This is the limit to which VDD can be lowered in Sleep mode without losing RAM data.
2015-2016 Microchip Technology Inc.
Preliminary
DS40001793C-page 11
MTCH102/5/8
FIGURE 5-1:
MTCH10X FAMILY – POWER VS RESPONSE TIME
ꢂꢅꢀꢀꢁ
ꢂꢄꢀꢀꢁ
ꢂꢃꢀꢀꢁ
ꢂꢂꢀꢀꢁ
ꢂꢀꢀꢀꢁ
ꢊꢀꢀꢁ
ꢉꢀꢀꢁ
ꢋꢌꢍꢎꢂꢀꢃꢁ
ꢋꢌꢍꢎꢂꢀꢆꢁ
ꢋꢌꢍꢎꢂꢀꢉꢁ
ꢈꢀꢀꢁ
ꢇꢀꢀꢁ
ꢆꢀꢀꢁ
ꢅꢀꢀꢁ
ꢄꢀꢀꢁ
ꢃꢀꢀꢁ
ꢂꢀꢀꢁ
ꢀꢁ
ꢀꢁ
ꢄꢃꢁ
ꢇꢅꢁ
ꢊꢇꢁ
ꢂꢃꢉꢁ
ꢂꢇꢀꢁ
ꢂꢊꢃꢁ
ꢃꢃꢅꢁ
ꢃꢆꢇꢁ
ꢓꢔꢕꢓꢆꢔꢋꢅꢅꢖꢂꢆꢕꢂꢃꢗꢋꢘꢆꢐꢋꢃꢒꢆꢙꢂꢌꢎꢋꢉꢌꢂꢆꢔꢗꢍꢂꢆꢐꢍꢌꢒꢆ
FIGURE 5-2:
NPOR AND POR REARM WITH SLOW RISING VDD
VDD
VPOR
VPORR
VSS
NPOR(1)
POR REARM
VSS
(3)
TPOR
(2)
TVLOW
Note 1: When NPOR is low, the device is held in Reset.
2: TPOR 1 s typical.
3: TVLOW 2.7 s typical.
DS40001793C-page 12
Preliminary
2015-2016 Microchip Technology Inc.
MTCH102/5/8
5.2
DC Characteristics: MTCH102/5/8-I/E
Standard Operating Conditions (unless otherwise stated)
Operating temperature: -40°C TA +85°C for industrial
DC CHARACTERISTICS
Param.
No.
Sym.
Characteristic
Min.
Typ.†
Max.
Units
Conditions
VIL
Input Low Voltage
I/O PORT:
D030A
with TTL buffer
Input High Voltage
I/O ports:
—
—
0.15 VDD
V
V
1.8V VDD 4.5V
1.8V VDD 4.5V
VIH
—
—
—
—
D040A
D060
with TTL buffer
0.25 VDD +
0.8
IIL
Input Leakage Current(1)
I/O ports
—
—
± 5
± 5
± 125
nA VSS VPIN VDD,
Pin at high-impedance at 85°C
nA to 125°C
± 1000
VOL
Output Low Voltage(2)
D080
I/O ports
IOL = 6 mA, VDD = 3.3V
IOL = 1.8 mA, VDD = 1.8V
—
—
—
0.6
V
VOH Output High Voltage(2)
D090
I/O ports
IOH = 3 mA, VDD = 3.3V
IOH = 1 mA, VDD = 1.8V
VDD - 0.7
—
V
Capacitive Loading Specs on Output Pins
All I/O pins
D101A* CIO
—
—
50
pF
*
These parameters are characterized but not tested.
†
Data in “Typ.” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance
only and are not tested.
Note 1: Negative current is defined as current sourced by the pin.
2: Including OSC2 in CLKOUT mode.
2015-2016 Microchip Technology Inc.
Preliminary
DS40001793C-page 13
MTCH102/5/8
FIGURE 5-3:
BROWN-OUT RESET TIMING AND CHARACTERISTICS
VDD
VBOR and VHYST
VBOR
(Device in Brown-out Reset)
(Device not in Brown-out Reset)
37
Reset
33
(due to BOR)
TABLE 5-1:
OSCILLATOR START-UP TIMER, POWER-UP TIMER AND BROWN-OUT RESET
PARAMETERS
Standard Operating Conditions (unless otherwise stated)
Operating Temperature -40°C TA +125°C
Param.
No.
Sym.
Characteristic
Min. Typ.† Max. Units
Conditions
33*
TPWRT Power-up Timer Period
40
—
65
—
140
2.0
ms
34*
TIOZ
I/O High-impedance from RESET
s
Low or Watchdog Timer Reset
35
VBOR
Brown-out Reset Voltage
1.80
0
1.9
25
1
2.05
50
V
BORV = 1.9V
37*
38*
VHYST
Brown-out Reset Hysteresis
mV -40°C to +85°C
TBORDC Brown-out Reset DC Response
Time
0
40
s VDD VBOR
*
These parameters are characterized but not tested.
†
Data in “Typ.” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance
only and are not tested.
DS40001793C-page 14
Preliminary
2015-2016 Microchip Technology Inc.
MTCH102/5/8
6.0
6.1
PACKAGING INFORMATION
Package Marking Information
8-Lead UDFN (2x3x0.5 mm)
Example
102
517
17
8-Lead MSOP (3x3 mm)
Example
H102
517017
14-Lead TSSOP (4.4 mm)
Example
MTCH105
1517
XXXXXXXX
YYWW
NNN
017
Legend: XX...X Customer-specific information
Y
YY
WW
NNN
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC® designator for Matte Tin (Sn)
e
3
*
This package is Pb-free. The Pb-free JEDEC® designator (
can be found on the outer packaging for this package.
)
e3
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
2015-2016 Microchip Technology Inc.
Preliminary
DS40001793C-page 15
MTCH102/5/8
Package Marking Information (Continued)
16-Lead QFN (4x4x0.9 mm)
Example
MTCH
105
PIN 1
PIN 1
e
3
ML
517017
20-Lead SSOP (5.30 mm)
Example
MTCH108
e
3
\SS
1517017
20-Lead UQFN (4x4x0.9 mm)
Example
MTCH
108
PIN 1
PIN 1
e
3
\GZ
514017
Legend: XX...X Customer-specific information
Y
Year code (last digit of calendar year)
YY
WW
NNN
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC® designator for Matte Tin (Sn)
e
3
*
This package is Pb-free. The Pb-free JEDEC® designator (
can be found on the outer packaging for this package.
)
e3
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
DS40001793C-page 16
Preliminary
2015-2016 Microchip Technology Inc.
MTCH102/5/8
6.2
Package Details
The following sections give the technical details of the packages.
ꢀꢁꢂꢃꢄꢅꢆꢇꢈꢄꢉꢊꢋꢌꢆꢍꢎꢄꢈꢆꢏꢈꢄꢊꢐꢆꢑꢒꢆꢂꢃꢄꢅꢆꢇꢄꢌꢓꢄꢔꢃꢆꢕꢖꢗꢘꢆꢙꢆꢚꢛꢜꢛꢝꢞꢟꢆꢠꢠꢆꢡꢒꢅꢢꢆꢣꢗꢍꢏꢑꢤ
ꢑꢒꢊꢃꢥ ꢀꢁꢂꢃꢄꢅꢆꢃꢇꢁꢈꢄꢃꢉꢊꢂꢂꢆꢋꢄꢃꢌꢍꢉꢎꢍꢏꢆꢃꢐꢂꢍꢑꢒꢋꢏꢈꢓꢃꢌꢔꢆꢍꢈꢆꢃꢈꢆꢆꢃꢄꢅꢆꢃꢕꢒꢉꢂꢁꢉꢅꢒꢌꢃꢖꢍꢉꢎꢍꢏꢒꢋꢏꢃꢗꢌꢆꢉꢒꢘꢒꢉꢍꢄꢒꢁꢋꢃꢔꢁꢉꢍꢄꢆꢐꢃꢍꢄꢃ
ꢅꢄꢄꢌꢙꢚꢚꢑꢑꢑꢛꢇꢒꢉꢂꢁꢉꢅꢒꢌꢛꢉꢁꢇꢚꢌꢍꢉꢎꢍꢏꢒꢋꢏ
2015-2016 Microchip Technology Inc.
Preliminary
DS40001793C-page 17
MTCH102/5/8
ꢀꢁꢂꢃꢄꢅꢆꢇꢈꢄꢉꢊꢋꢌꢆꢍꢎꢄꢈꢆꢏꢈꢄꢊꢐꢆꢑꢒꢆꢂꢃꢄꢅꢆꢇꢄꢌꢓꢄꢔꢃꢆꢕꢖꢗꢘꢆꢙꢆꢚꢛꢜꢛꢝꢞꢟꢆꢠꢠꢆꢡꢒꢅꢢꢆꢣꢗꢍꢏꢑꢤ
ꢑꢒꢊꢃꢥ ꢀꢁꢂꢃꢄꢅꢆꢃꢇꢁꢈꢄꢃꢉꢊꢂꢂꢆꢋꢄꢃꢌꢍꢉꢎꢍꢏꢆꢃꢐꢂꢍꢑꢒꢋꢏꢈꢓꢃꢌꢔꢆꢍꢈꢆꢃꢈꢆꢆꢃꢄꢅꢆꢃꢕꢒꢉꢂꢁꢉꢅꢒꢌꢃꢖꢍꢉꢎꢍꢏꢒꢋꢏꢃꢗꢌꢆꢉꢒꢘꢒꢉꢍꢄꢒꢁꢋꢃꢔꢁꢉꢍꢄꢆꢐꢃꢍꢄꢃ
ꢅꢄꢄꢌꢙꢚꢚꢑꢑꢑꢛꢇꢒꢉꢂꢁꢉꢅꢒꢌꢛꢉꢁꢇꢚꢌꢍꢉꢎꢍꢏꢒꢋꢏ
DS40001793C-page 18
Preliminary
2015-2016 Microchip Technology Inc.
MTCH102/5/8
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2015-2016 Microchip Technology Inc.
Preliminary
DS40001793C-page 19
MTCH102/5/8
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS40001793C-page 20
Preliminary
2015-2016 Microchip Technology Inc.
MTCH102/5/8
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2015-2016 Microchip Technology Inc.
Preliminary
DS40001793C-page 21
MTCH102/5/8
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS40001793C-page 22
Preliminary
2015-2016 Microchip Technology Inc.
MTCH102/5/8
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2015-2016 Microchip Technology Inc.
Preliminary
DS40001793C-page 23
MTCH102/5/8
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS40001793C-page 24
Preliminary
2015-2016 Microchip Technology Inc.
MTCH102/5/8
16-Lead Plastic Quad Flat, No Lead Package (ML) - 4x4x0.9mm Body [QFN]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
A
B
E
N
NOTE 1
1
2
(DATUM B)
(DATUM A)
2X
0.15 C
2X
TOP VIEW
0.15 C
0.10 C
A1
C
A
SEATING
PLANE
16X
(A3)
0.08 C
C A B
SIDE VIEW
0.10
D2
0.10
C A B
E2
2
1
e
2
NOTE 1
K
N
0.40
16X b
0.10
C A B
e
BOTTOM VIEW
Microchip Technology Drawing C04-127D Sheet 1 of 2
2015-2016 Microchip Technology Inc.
Preliminary
DS40001793C-page 25
MTCH102/5/8
16-Lead Plastic Quad Flat, No Lead Package (ML) - 4x4x0.9mm Body [QFN]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units
Dimension Limits
MILLIMETERS
NOM
MIN
MAX
Number of Pins
Pitch
Overall Height
Standoff
Contact Thickness
Overall Width
Exposed Pad Width
Overall Length
Exposed Pad Length
Contact Width
Contact Length
N
16
0.65 BSC
0.90
e
A
A1
A3
E
E2
D
D2
b
L
0.80
0.00
1.00
0.05
0.02
0.20 REF
4.00 BSC
2.65
4.00 BSC
2.65
2.50
2.80
2.50
0.25
0.30
0.20
2.80
0.35
0.50
-
0.30
0.40
-
Contact-to-Exposed Pad
K
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated
3. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-127D Sheet 2 of 2
DS40001793C-page 26
Preliminary
2015-2016 Microchip Technology Inc.
MTCH102/5/8
16-Lead Plastic Quad Flat, No Lead Package (ML) - 4x4x0.9mm Body [QFN]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2015-2016 Microchip Technology Inc.
Preliminary
DS40001793C-page 27
MTCH102/5/8
ꢚꢝꢁꢂꢃꢄꢅꢆꢇꢈꢄꢉꢊꢋꢌꢆꢦꢧꢨꢋꢩꢓꢆꢦꢠꢄꢈꢈꢆꢪꢎꢊꢈꢋꢩꢃꢆꢕꢦꢦꢘꢆꢙꢆꢟꢞꢜꢝꢆꢠꢠꢆꢡꢒꢅꢢꢆꢣꢦꢦꢪꢇꢤꢆ
ꢑꢒꢊꢃꢥ ꢀꢁꢂꢃꢄꢅꢆꢃꢇꢁꢈꢄꢃꢉꢊꢂꢂꢆꢋꢄꢃꢌꢍꢉꢎꢍꢏꢆꢃꢐꢂꢍꢑꢒꢋꢏꢈꢓꢃꢌꢔꢆꢍꢈꢆꢃꢈꢆꢆꢃꢄꢅꢆꢃꢕꢒꢉꢂꢁꢉꢅꢒꢌꢃꢖꢍꢉꢎꢍꢏꢒꢋꢏꢃꢗꢌꢆꢉꢒꢘꢒꢉꢍꢄꢒꢁꢋꢃꢔꢁꢉꢍꢄꢆꢐꢃꢍꢄꢃ
ꢅꢄꢄꢌꢙꢚꢚꢑꢑꢑꢛꢇꢒꢉꢂꢁꢉꢅꢒꢌꢛꢉꢁꢇꢚꢌꢍꢉꢎꢍꢏꢒꢋꢏ
D
N
E
E1
NOTE 1
1
2
e
b
c
A2
A
φ
A1
L1
AꢋꢒꢄꢈꢕꢤGGꢤꢕ;ꢢ;ꢣꢗ
L
ꢞꢒꢇꢆꢋꢈꢒꢁꢋꢃGꢒꢇꢒꢄꢈ
ꢕꢤH
HJꢕ
ꢕꢠK
Hꢊꢇ8ꢆꢂꢃꢁꢘꢃꢖꢒꢋꢈH
ꢖꢒꢄꢉꢅ
ꢝꢟ
ꢆ
ꢟꢛL>ꢃ?ꢗ@
J6ꢆꢂꢍꢔꢔꢃNꢆꢒꢏꢅꢄ
ꢕꢁꢔꢐꢆꢐꢃꢖꢍꢉꢎꢍꢏꢆꢃꢢꢅꢒꢉꢎꢋꢆꢈꢈ
ꢗꢄꢍꢋꢐꢁꢘꢘꢃ
J6ꢆꢂꢍꢔꢔꢃQꢒꢐꢄꢅ
ꢕꢁꢔꢐꢆꢐꢃꢖꢍꢉꢎꢍꢏꢆꢃQꢒꢐꢄꢅ
J6ꢆꢂꢍꢔꢔꢃGꢆꢋꢏꢄꢅ
ꢀꢁꢁꢄꢃGꢆꢋꢏꢄꢅ
ꢀꢁꢁꢄꢌꢂꢒꢋꢄ
Gꢆꢍꢐꢃꢢꢅꢒꢉꢎꢋꢆꢈꢈ
ꢀꢁꢁꢄꢃꢠꢋꢏꢔꢆ
ꢠ
ꢥ
ꢥ
5ꢛꢦ>
ꢥ
ꢦꢛꢧꢟ
>ꢛ<ꢟ
ꢦꢛꢝꢟ
ꢟꢛꢦ>
5ꢛꢝ>ꢃꢣ;ꢀ
ꢥ
ꢝꢛꢟꢟ
5ꢛꢧ>
ꢥ
ꢧꢛꢝꢟ
>ꢛLꢟ
ꢦꢛ>ꢟ
ꢟꢛꢨ>
ꢠꢝ
ꢠ5
;
;5
ꢞ
G
G5
ꢉ
5ꢛL>
ꢟꢛꢟ>
ꢦꢛꢡꢟ
>ꢛꢟꢟ
Lꢛꢨꢟ
ꢟꢛ>>
ꢟꢛꢟꢨ
ꢟꢩ
ꢟꢛꢝ>
ꢧꢩ
ꢀ
ꢡꢩ
GꢆꢍꢐꢃQꢒꢐꢄꢅ
8
ꢟꢛꢝꢝ
ꢥ
ꢟꢛ<ꢧ
ꢑꢒꢊꢃꢉꢥ
5ꢛ ꢖꢒꢋꢃ5ꢃ6ꢒꢈꢊꢍꢔꢃꢒꢋꢐꢆ7ꢃꢘꢆꢍꢄꢊꢂꢆꢃꢇꢍꢜꢃ6ꢍꢂꢜꢓꢃ8ꢊꢄꢃꢇꢊꢈꢄꢃ8ꢆꢃꢔꢁꢉꢍꢄꢆꢐꢃꢑꢒꢄꢅꢒꢋꢃꢄꢅꢆꢃꢅꢍꢄꢉꢅꢆꢐꢃꢍꢂꢆꢍꢛ
ꢝꢛ ꢞꢒꢇꢆꢋꢈꢒꢁꢋꢈꢃꢞꢃꢍꢋꢐꢃ;5ꢃꢐꢁꢃꢋꢁꢄꢃꢒꢋꢉꢔꢊꢐꢆꢃꢇꢁꢔꢐꢃꢘꢔꢍꢈꢅꢃꢁꢂꢃꢌꢂꢁꢄꢂꢊꢈꢒꢁꢋꢈꢛꢃꢕꢁꢔꢐꢃꢘꢔꢍꢈꢅꢃꢁꢂꢃꢌꢂꢁꢄꢂꢊꢈꢒꢁꢋꢈꢃꢈꢅꢍꢔꢔꢃꢋꢁꢄꢃꢆ7ꢉꢆꢆꢐꢃꢟꢛꢝꢟꢃꢇꢇꢃꢌꢆꢂꢃꢈꢒꢐꢆꢛ
<ꢛ ꢞꢒꢇꢆꢋꢈꢒꢁꢋꢒꢋꢏꢃꢍꢋꢐꢃꢄꢁꢔꢆꢂꢍꢋꢉꢒꢋꢏꢃꢌꢆꢂꢃꢠꢗꢕ;ꢃ=5ꢡꢛ>ꢕꢛ
?ꢗ@ꢙ ?ꢍꢈꢒꢉꢃꢞꢒꢇꢆꢋꢈꢒꢁꢋꢛꢃꢢꢅꢆꢁꢂꢆꢄꢒꢉꢍꢔꢔꢜꢃꢆ7ꢍꢉꢄꢃ6ꢍꢔꢊꢆꢃꢈꢅꢁꢑꢋꢃꢑꢒꢄꢅꢁꢊꢄꢃꢄꢁꢔꢆꢂꢍꢋꢉꢆꢈꢛ
ꢣ;ꢀꢙ ꢣꢆꢘꢆꢂꢆꢋꢉꢆꢃꢞꢒꢇꢆꢋꢈꢒꢁꢋꢓꢃꢊꢈꢊꢍꢔꢔꢜꢃꢑꢒꢄꢅꢁꢊꢄꢃꢄꢁꢔꢆꢂꢍꢋꢉꢆꢓꢃꢘꢁꢂꢃꢒꢋꢘꢁꢂꢇꢍꢄꢒꢁꢋꢃꢌꢊꢂꢌꢁꢈꢆꢈꢃꢁꢋꢔꢜꢛ
ꢕꢒꢉꢂꢁꢉꢅꢒꢌ ꢢꢆꢉꢅꢋꢁꢔꢁꢏꢜ ꢞꢂꢍꢑꢒꢋꢏ @ꢟꢡꢪꢟꢦꢝ?
DS40001793C-page 28
Preliminary
2015-2016 Microchip Technology Inc.
MTCH102/5/8
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2015-2016 Microchip Technology Inc.
Preliminary
DS40001793C-page 29
MTCH102/5/8
20-Lead Ultra Thin Plastic Quad Flat, No Lead Package (GZ) - 4x4x0.5 mm Body [UQFN]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
A
B
E
N
NOTE 1
1
2
(DATUM B)
(DATUM A)
2X
0.20 C
2X
TOP VIEW
0.20 C
0.10 C
A1
C
A
SEATING
PLANE
20X
(A3)
0.08 C
C A B
SIDE VIEW
0.10
D2
L
0.10
C A B
E2
2
1
K
N
NOTE 1
20X b
0.10
C A B
e
BOTTOM VIEW
Microchip Technology Drawing C04-255A Sheet 1 of 2
DS40001793C-page 30
Preliminary
2015-2016 Microchip Technology Inc.
MTCH102/5/8
20-Lead Ultra Thin Plastic Quad Flat, No Lead Package (GZ) - 4x4x0.5 mm Body [UQFN]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units
Dimension Limits
MILLIMETERS
NOM
MIN
MAX
Number of Terminals
Pitch
Overall Height
Standoff
Terminal Thickness
Overall Width
Exposed Pad Width
Overall Length
Exposed Pad Length
Terminal Width
Terminal Length
N
20
0.50 BSC
0.50
e
A
A1
A3
E
E2
D
D2
b
L
0.45
0.00
0.55
0.05
0.02
0.127 REF
4.00 BSC
2.70
4.00 BSC
2.70
2.60
2.80
2.60
0.20
0.30
0.20
2.80
0.30
0.50
-
0.25
0.40
-
Terminal-to-Exposed-Pad
K
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated
3. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-255A Sheet 2 of 2
2015-2016 Microchip Technology Inc.
Preliminary
DS40001793C-page 31
MTCH102/5/8
20-Lead Ultra Thin Plastic Quad Flat, No Lead Package (GZ) - 4x4x0.5 mm Body [UQFN]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
C1
X2
20
1
2
C2 Y2
G1
Y1
X1
E
SILK SCREEN
RECOMMENDED LAND PATTERN
Units
Dimension Limits
E
MILLIMETERS
NOM
0.50 BSC
MIN
MAX
Contact Pitch
Optional Center Pad Width
Optional Center Pad Length
Contact Pad Spacing
X2
Y2
C1
C2
X1
Y1
G1
2.80
2.80
4.00
4.00
Contact Pad Spacing
Contact Pad Width (X20)
Contact Pad Length (X20)
Contact Pad to Center Pad (X20)
0.30
0.80
0.20
Notes:
1. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing C04-2255A
DS40001793C-page 32
Preliminary
2015-2016 Microchip Technology Inc.
MTCH102/5/8
APPENDIX A: DATA SHEET
REVISION HISTORY
Revision A (05/2015)
Initial release of this document.
Revision B (01/2016)
Updated Packaging Information and Product
Identification
corrections.
System
sections.
Other
minor
Revision C (04/2016)
Updated Packaging Information section. Other minor
corrections.
2015-2016 Microchip Technology Inc.
Preliminary
DS40001793C-page 33
MTCH102/5/8
THE MICROCHIP WEBSITE
CUSTOMER SUPPORT
Microchip provides online support via our website at
www.microchip.com. This website is used as a means
to make files and information easily available to
customers. Accessible by using your favorite Internet
browser, the website contains the following information:
Users of Microchip products can receive assistance
through several channels:
• Distributor or Representative
• Local Sales Office
• Field Application Engineer (FAE)
• Technical Support
• Product Support – Data sheets and errata,
application notes and sample programs, design
resources, user’s guides and hardware support
documents, latest software releases and archived
software
Customers
should
contact
their
distributor,
representative or Field Application Engineer (FAE) for
support. Local sales offices are also available to help
customers. A listing of sales offices and locations is
included in the back of this document.
• General Technical Support – Frequently Asked
Questions (FAQ), technical support requests,
online discussion groups, Microchip consultant
program member listing
Technical support is available through the website
at: http://www.microchip.com/support
• Business of Microchip – Product selector and
ordering guides, latest Microchip press releases,
listing of seminars and events, listings of
Microchip sales offices, distributors and factory
representatives
CUSTOMER CHANGE NOTIFICATION
SERVICE
Microchip’s customer notification service helps keep
customers current on Microchip products. Subscribers
will receive e-mail notification whenever there are
changes, updates, revisions or errata related to a
specified product family or development tool of interest.
To register, access the Microchip website at
www.microchip.com. Under “Support”, click on
“Customer Change Notification” and follow the
registration instructions.
DS40001793C-page 34
Preliminary
2015-2016 Microchip Technology Inc.
MTCH102/5/8
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
(1)
X
/XX
XXX
PART NO.
Device
[X]
Examples:
Temperature Package Pattern
Range
Tape and Reel
Option
a)
b)
MTCH102 - I/MS = Industrial temperature,
MSOP package.
MTCH105 - I/ML = Industrial temperature, QFN
package.
c)
MTCH108 - I/GZ = Industrial temperature,
UQFN package.
Device:
MTCH102; MTCH105; MTCH108.
Tape and Reel
Option:
Blank
T
=
=
Standard packaging (tube or tray)
Tape and Reel(1)
Temperature
Range:
I
E
=
=
-40C to +85C (Industrial)
-40C to +125C (Extended)
Note 1:
Tape and Reel identifier only appears in the
catalog part number description. This
identifier is used for ordering purposes and
is not printed on the device package. Check
with your Microchip Sales Office for package
availability with the Tape and Reel option.
Package:
MS
SS
MU
GZ
ST
ML
=
=
=
=
=
=
MSOP
SSOP
UDFN
UQFN
TSSOP
QFN
2015-2016 Microchip Technology Inc.
Preliminary
DS40001793C-page 35
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights unless otherwise stated.
Trademarks
The Microchip name and logo, the Microchip logo, AnyRate,
dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KeeLoq,
KeeLoq logo, Kleer, LANCheck, LINK MD, MediaLB, MOST,
MOST logo, MPLAB, OptoLyzer, PIC, PICSTART, PIC32 logo,
RightTouch, SpyNIC, SST, SST Logo, SuperFlash and UNI/O
are registered trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
ClockWorks, The Embedded Control Solutions Company,
ETHERSYNCH, Hyper Speed Control, HyperLight Load,
IntelliMOS, mTouch, Precision Edge, and QUIET-WIRE are
registered trademarks of Microchip Technology Incorporated
in the U.S.A.
Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut,
BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM,
dsPICDEM.net, Dynamic Average Matching, DAM, ECAN,
EtherGREEN, In-Circuit Serial Programming, ICSP, Inter-Chip
Connectivity, JitterBlocker, KleerNet, KleerNet logo, MiWi,
motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB,
MPLINK, MultiTRAK, NetDetach, Omniscient Code
Generation, PICDEM, PICDEM.net, PICkit, PICtail,
PureSilicon, RightTouch logo, REAL ICE, Ripple Blocker,
Serial Quad I/O, SQI, SuperSwitcher, SuperSwitcher II, Total
Endurance, TSHARC, USBCheck, VariSense, ViewSpan,
WiperLock, Wireless DNA, and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.
GestIC is a registered trademarks of Microchip Technology
Germany II GmbH & Co. KG, a subsidiary of Microchip
Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
QUALITY MANAGEMENT SYSTEM
CERTIFIED BY DNV
© 2015-2016, Microchip Technology Incorporated, Printed in
the U.S.A., All Rights Reserved.
ISBN: 978-1-5224-0486-6
== ISO/TS 16949 ==
DS40001793C-page 36
Preliminary
2015-2016 Microchip Technology Inc.
Worldwide Sales and Service
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://www.microchip.com/
support
Asia Pacific Office
China - Xiamen
Tel: 86-592-2388138
Fax: 86-592-2388130
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
Suites 3707-14, 37th Floor
Tower 6, The Gateway
Harbour City, Kowloon
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
Hong Kong
Tel: 852-2943-5100
Fax: 852-2401-3431
India - Bangalore
Tel: 91-80-3090-4444
Fax: 91-80-3090-4123
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
Web Address:
www.microchip.com
India - New Delhi
Tel: 91-11-4160-8631
Fax: 91-11-4160-8632
Germany - Dusseldorf
Tel: 49-2129-3766400
Atlanta
Duluth, GA
Tel: 678-957-9614
Fax: 678-957-1455
China - Beijing
Tel: 86-10-8569-7000
Fax: 86-10-8528-2104
Germany - Karlsruhe
Tel: 49-721-625370
India - Pune
Tel: 91-20-3019-1500
China - Chengdu
Tel: 86-28-8665-5511
Fax: 86-28-8665-7889
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Austin, TX
Tel: 512-257-3370
Japan - Osaka
Tel: 81-6-6152-7160
Fax: 81-6-6152-9310
Boston
China - Chongqing
Tel: 86-23-8980-9588
Fax: 86-23-8980-9500
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
Japan - Tokyo
Tel: 81-3-6880- 3770
Fax: 81-3-6880-3771
China - Dongguan
Tel: 86-769-8702-9880
Italy - Venice
Tel: 39-049-7625286
Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
Korea - Daegu
Tel: 82-53-744-4301
Fax: 82-53-744-4302
China - Hangzhou
Tel: 86-571-8792-8115
Fax: 86-571-8792-8116
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Korea - Seoul
Cleveland
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
China - Hong Kong SAR
Tel: 852-2943-5100
Fax: 852-2401-3431
Poland - Warsaw
Tel: 48-22-3325737
Independence, OH
Tel: 216-447-0464
Fax: 216-447-0643
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
China - Nanjing
Tel: 86-25-8473-2460
Fax: 86-25-8473-2470
Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
Fax: 60-3-6201-9859
Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
Sweden - Stockholm
Tel: 46-8-5090-4654
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
Malaysia - Penang
Tel: 60-4-227-8870
Fax: 60-4-227-4068
Detroit
Novi, MI
UK - Wokingham
Tel: 44-118-921-5800
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
Tel: 248-848-4000
Fax: 44-118-921-5820
Houston, TX
Tel: 281-894-5983
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
Indianapolis
Noblesville, IN
Tel: 317-773-8323
Fax: 317-773-5453
China - Shenzhen
Tel: 86-755-8864-2200
Fax: 86-755-8203-1760
Taiwan - Hsin Chu
Tel: 886-3-5778-366
Fax: 886-3-5770-955
Los Angeles
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
Taiwan - Kaohsiung
Tel: 886-7-213-7828
Taiwan - Taipei
Tel: 886-2-2508-8600
Fax: 886-2-2508-0102
New York, NY
Tel: 631-435-6000
China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
San Jose, CA
Tel: 408-735-9110
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
Canada - Toronto
Tel: 905-673-0699
Fax: 905-673-6509
07/14/15
2015-2016 Microchip Technology Inc.
Preliminary
DS40001793B-page 37
相关型号：
SI9130DB
5- and 3.3-V Step-Down Synchronous ConvertersWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9135LG-T1
SMBus Multi-Output Power-Supply ControllerWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9135LG-T1-E3
SMBus Multi-Output Power-Supply ControllerWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9135_11
SMBus Multi-Output Power-Supply ControllerWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9136_11
Multi-Output Power-Supply ControllerWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9130CG-T1-E3
Pin-Programmable Dual Controller - Portable PCsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9130LG-T1-E3
Pin-Programmable Dual Controller - Portable PCsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9130_11
Pin-Programmable Dual Controller - Portable PCsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9137
Multi-Output, Sequence Selectable Power-Supply Controller for Mobile ApplicationsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9137DB
Multi-Output, Sequence Selectable Power-Supply Controller for Mobile ApplicationsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9137LG
Multi-Output, Sequence Selectable Power-Supply Controller for Mobile ApplicationsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9122E
500-kHz Half-Bridge DC/DC Controller with Integrated Secondary Synchronous Rectification DriversWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
©2020 ICPDF网 联系我们和版权申明