MTD6501D [MICROCHIP]

3-Phase Brushless DC Sinusoidal Sensorless Fan Motor Driver; 3相无刷直流正弦无传感器风扇电机驱动器
MTD6501D
型号: MTD6501D
厂家: MICROCHIP    MICROCHIP
描述:

3-Phase Brushless DC Sinusoidal Sensorless Fan Motor Driver
3相无刷直流正弦无传感器风扇电机驱动器

驱动器 运动控制电子器件 风扇 传感器 信号电路 光电二极管 电动机控制 电机
文件: 总24页 (文件大小:920K)
中文:  中文翻译
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MTD6501C/D/G  
3-Phase Brushless DC Sinusoidal Sensorless Fan Motor Driver  
Features  
Description  
• Position Sensorless BLDC Drivers (No Hall  
Sensor Required)  
The MTD6501C/D/G devices are 3-phase, full-wave  
drivers for brushless sensorless DC motors. They  
feature 180° sinusoidal drive, high torque output, and  
silent drive. Due to their adaptive features and wide  
power-supply range capabilities (2V to 14V), they are  
intended to cover a wide range of motor characteristics,  
while requiring no external tuning from the user. Speed  
control can be achieved through either power supply  
modulation or pulse-width modulation (using the PWM  
digital input pin).  
• 180° Sinusoidal Drive, for High Efficiency and Low  
Acoustic Noise  
• Support 2V to 14V Power Supplies  
• Speed Control Through PAM and/or PWM  
• Built-in Frequency Generator (FG Output Signal)  
• Built-in Lock-up Protection and Automatic  
Recovery Circuit (External Capacitor not  
Necessary)  
Due to the compact packaging and minimum bill of  
materials (power transistors incorporated, no Hall  
sensor, no external tuning), they are best suited for low-  
cost fan applications requiring high efficiency and low  
acoustic noise, such as CPU cooling fans. Frequency  
generator output enables precision speed control in  
closed-loop applications. The MTD6501C/D/G drivers  
include a Lock-up Protection mode, which turns off the  
output current when the motor is under lock condition,  
and an automatic recovery that enables the fan to run  
when the lock condition is removed. Motor overcurrent  
limitation, short-circuit protection and thermal-  
shutdown protection are also included.  
• Built-in Over Current Limitation and Short Circuit  
Protection  
• Built-in Thermal Shutdown Protection  
• Thermally Enhanced SOP-8 Package for  
MTD6501C and MTD6501G (Maximum Output  
Current – 800 mA);  
• MSOP-10L Package for MTD6501D (Maximum  
Output Current – 500 mA)  
• 20 kHz PWM Output Frequency for MTD6501C/D  
and 23 kHz for MTD6501G  
• Boost Mode (Optional Back Electromotive Force  
(BEMF) Pre-amplification in MTD6501D)  
The MTD6501C and the MTD6501G are available in a  
compact thermally-enhanced SOP-8 package, while  
the MTD6501D is available in the MSOP-10L package.  
• No External Tuning Required  
The MTD6501C/D/G devices are formerly products of  
Advanced Silicon.  
Package Types  
MTD6501C, MTD6501G  
SOP-8  
PWM  
1
2
3
4
8
7
6
5
FG  
VCC  
VDD  
OUT1  
OUT2  
OUT3  
GND  
MTD6501D  
MSOP  
PWM  
FG  
1
2
10  
9
GND  
BOOST  
VCC  
VDD 3  
8
OUT1  
OUT3  
4
5
7
OUT2  
GND  
6
2010-2012 Microchip Technology Inc.  
DS22263B-page 1  
MTD6501C/D/G  
Functional Block Diagram  
BOOST *MTD6501D Only  
VCC  
VREF  
Motor Phase  
Detection Circuit  
Regulator  
VDD  
FG  
Overcurrent  
protection  
VCC  
Timing  
Controller  
OUT3  
OUT2  
OUT1  
VDD  
PWM  
Input  
PWM  
GND  
Thermal  
protection  
Short-circuit  
protection  
DS22263B-page 2  
2010-2012 Microchip Technology Inc.  
MTD6501C/D/G  
Typical Application – Fan Motor Driver Using the MTD6501C or MTD6501G  
PWM input  
(0.02-100 kHz)  
Vlogic  
(controller side)  
R1  
FG  
PWM 8  
VCC  
1
VCC  
2 VDD  
7
C1  
C2  
3 OUT1  
4 OUT2  
OUT3 6  
GND 5  
Recommended External Components for Typical Application  
Element  
Type/Value  
Comment  
C1  
C2  
R1  
>1 µF  
>1 µF  
Connect as close as possible to IC input pins  
Connect as close as possible to IC input pins  
Connect to Vlogic on controller side  
>10 k  
2010-2012 Microchip Technology Inc.  
DS22263B-page 3  
MTD6501C/D/G  
Typical Application – Fan Motor Driver Using the MTD6501D  
PWM input  
(0.02-100 kHz)  
Vlogic  
(controller side)  
R1  
Tie to GND  
for BOOST  
mode  
10  
FG  
PWM  
1
2
3
GND  
VDD  
BOOST 9  
VCC  
OUT3  
GND  
8
7
6
C1  
OUT1  
OUT2  
C2  
4
5
Recommended External Components for Typical Application  
Element  
Type/Value  
Comment  
C1  
C2  
R1  
>1 µF  
>1 µF  
Connect as close as possible to IC input pins  
Connect as close as possible to IC input pins  
Connect to Vlogic on controller side  
>10 kΩ  
DS22263B-page 4  
2010-2012 Microchip Technology Inc.  
MTD6501C/D/G  
† Notice: Stresses above those listed under “Maximum  
Ratings” may cause permanent damage to the device.  
This is a stress rating only and functional operation of  
the device at those or any other conditions above those  
indicated in the operational listings of this specification  
is not implied. Exposure to maximum rating conditions  
for extended periods may affect device reliability.  
1.0  
ELECTRICAL  
CHARACTERISTICS  
Absolute Maximum Ratings†  
Power Supply Voltage (V  
Maximum OUT1, 2, 3 Output Voltage (V  
) .................... -0.7 to +15.3V  
CC_MAX  
) .................  
OUT_MAX  
................................................................-0.7 to +15.3V+0.7V  
Note 1: Reference PCB, according to JEDEC  
FG Maximum Output Voltage (V  
) ......... -0.7 to +15.3V  
)....................800 mA  
)....................500 mA  
) ......... -0.7 to +15.3V  
).....................5.0 mA  
FG_MAX  
OUT_MAX  
OUT_MAX  
standard EIA/JESD 51-9.  
(3,4)  
Maximum Output Current  
Maximum Output Current  
(I  
(I  
(3,5)  
2: Derating applies for ambient temperatures  
outside the specified operating range (refer  
to Figure 1-1).  
FG Maximum Output Voltage (V  
FG Maximum Output Current (I  
FG_MAX  
FG_MAX  
V
Maximum Voltage (V  
) ..................... -0.7 to +4.0V  
DD  
DD_MAX  
3: OUT1, OUT2, OUT3 (Continuous,  
PWM Maximum Voltage (V  
) ................ -0.7 to +4.0V  
PWM_MAX  
100% duty cycle).  
(1,2,4)  
Allowable Power Dissipation  
Allowable Power Dissipation  
(P  
(P  
).....................1.0W  
).....................0.5W  
D_MAX  
(1,2,5)  
4: MTD6501C and MTD6501G  
5: MTD6501D  
D_MAX  
Max Junction Temperature (T )....................................+150°C  
J
ELECTRICAL CHARACTERISTICS  
Electrical Specifications: Unless otherwise specified, all limits are established for VCC = 5.0V, TA = +25°C  
Parameters  
Sym.  
Min.  
Typ.  
Max.  
Units  
Conditions  
Power Supply Voltage  
Power Supply Current  
VCC  
IVCC  
2
10  
14  
V
mA  
Rotation Mode  
5
Lock-Protection Mode  
IOUT = 0.5A, VCC = 3.3V to 14V  
IOUT = -0.5A, VCC = 3.3V to 14V  
IOUT = 0.5A, VCC = 3.3V to 14V  
VCC = 3.3V to 14V  
VCC < 3.3V  
OUTx High Resistance  
OUTx Low Resistance  
RON(H)  
RON(L)  
0.75  
0.75  
1.5  
3
1
1
OUTx Total Resistance RON(H+L)  
2
VDD Output Voltage  
VDD  
V
VCC – 0.2  
V
PWM Input Frequency  
PWM Input H Level  
PWM Input L Level  
fPWM  
0.02  
100  
3.6  
kHz  
V
VPWM_H 0.8*VDD  
VPWM_L  
IPWM_L  
0
17  
8
0.2*VDD  
V
PWM Internal Pull-Up  
Current  
34  
µA  
µA  
kHz  
kHz  
V
PWM = GND, VCC = 3.3V to 14V  
PWM = GND, VCC < 3.3V  
MTD6501C and MTD6501D  
MTD6501G  
17  
PWM Output  
Frequency  
fPWM_O  
20  
23  
FG Output Pin Low  
Level Voltage  
VOL_FG  
ILH_FG  
TRUN  
0.25  
10  
IFG = -1 mA  
FG Output Pin Leakage  
Current  
0.5  
5
µA  
s
VFG = 14V  
Lock Protection  
Operating Time  
Lock Protection Waiting  
Time  
TWAIT  
4.5  
5.5  
s
Thermal Shutdown  
TSD  
170  
25  
°C  
°C  
Thermal Shutdown  
Hysteresis  
TSD_HYS  
2010-2012 Microchip Technology Inc.  
DS22263B-page 5  
MTD6501C/D/G  
TEMPERATURE SPECIFICATIONS  
Electrical Specifications: Unless otherwise specified, all limits are established for VCC = 5.0V, TA = +25°C  
Parameters  
Sym.  
Min.  
Typ.  
Max.  
Units  
Conditions  
Temperature Ranges  
Operating Temperature  
Storage Temperature Range  
TOPR  
TSTG  
-30  
-55  
+95  
°C  
°C  
+150  
1.2  
SOP-8  
1
0.8  
0.6  
0.4  
0.2  
0
MSOP-10  
TA (°C)  
FIGURE 1-1:  
Allowable Power Dissipation (PD_MAX) as a Function of Ambient Temperature (TA).  
DS22263B-page 6  
2010-2012 Microchip Technology Inc.  
MTD6501C/D/G  
2.0  
PIN DESCRIPTIONS  
The descriptions of the pins are listed in Table 2-1.  
TABLE 2-1:  
MTD6501C/D/G PIN FUNCTION TABLE  
MTD6501C,  
MTD6501G  
MTD6501D  
Type  
Symbol  
Description  
SOP-8  
MSOP  
1
2
1
3
O
P
O
O
P
O
P
I
FG  
VDD  
Motor speed indication output  
Internal regulator output (for decoupling only)  
Single-phase coil output pin  
3
4
OUT1  
OUT2  
GND  
4
5
Single-phase coil output pin  
5
2, 6  
7
Negative voltage supply (ground)  
Single-phase coil output pin  
6
OUT3  
VCC  
7
8
Positive voltage supply for motor driver  
PWM input signal for speed control  
Boost mode selection:  
8
10  
9
PWM  
BOOST  
N/A  
I
• Pin floating for Normal mode  
• Pin tied to GND for Boost mode  
Legend: I = Input; O = Output; P = Power  
2010-2012 Microchip Technology Inc.  
DS22263B-page 7  
MTD6501C/D/G  
NOTES:  
DS22263B-page 8  
2010-2012 Microchip Technology Inc.  
MTD6501C/D/G  
3.4  
Overcurrent Protection and Short  
Circuit Detection  
3.0  
FUNCTIONAL DESCRIPTION  
The MTD6501C/D/G devices generate a full-wave sig-  
nal to drive a 3-phase sensorless BLDC motor. High  
efficiency and low-power consumption are achieved  
due to DMOS transistors and synchronous rectification  
drive type. The current carrying order of the output is as  
follows: OUT1 OUT2 OUT3.  
The motor peak current is limited by the driver to a fixed  
value (defined internally), thus limiting the maximum  
power dissipation in the coils. The detection of a short-  
circuit situation immediately sets the driver outputs to  
high-impedance, in order to avoid permanent damage  
to the IC.  
3.1  
Speed Control  
3.5  
Thermal Shutdown  
The rotational speed of the motor can be controlled  
either through the PWM digital input signal or by acting  
directly on the power supply (VCC). When the PWM  
signal is “High” (or left open) the motor rotates at full  
speed. When the PWM signal is “Low”, the motor is  
stopped (and the IC outputs are set to high-  
impedance). By changing the PWM duty cycle, the  
speed can be adjusted. Notice that the PWM frequency  
has no special meaning for the motor speed and is  
asynchronous with the activation of the output  
transistors. Thus, the user has maximum freedom to  
choose the PWM system frequency within a wide range  
(from 20 Hz to 100 kHz), while the output transistor  
activation always occurs at a fixed rate, which is  
outside of the range of audible frequencies. The  
MTD6501C and MTD6501D typical output frequency is  
20 kHz. The MTD6501G output frequency is 23 kHz.  
The MTD6501C/D/G have  
a thermal protection  
function which detects when the die temperature  
exceeds TSD = +170°C. When this temperature is  
reached, the circuit enters Thermal Shutdown mode  
and the outputs OUT1, OUT2 and OUT3 are disabled  
(high-impedance), avoiding IC destruction and allowing  
the circuit to cool down. Once the junction temperature  
(TSD) has dropped below +145°C, the normal operation  
resumes (thermal detection circuit has +25°C  
hysteresis function).  
Thermal Shutdown  
3.2  
Frequency Generator Function  
Normal operation  
The Frequency Generator output is a “Hall-sensor  
equivalent” digital output, giving information to an  
external controller about the speed and phase of the  
motor. The FG pin is an open drain output, connecting  
to a logical voltage level through an external pull-up  
resistor. When a lock (or out-of-sync) situation is  
detected by the driver, this output is set to high-imped-  
ance until the motor is restarted. Leave the pin open  
when not used. The FG signal can be used to compute  
the motor speed in rotations per minute (RPM). Typi-  
cally, for a four pole BLDC fan, the speed in RPMs is 30  
FG frequency (Hz).  
T
SD  
+145°C  
+170°C  
FIGURE 3-1:  
Hysteresis.  
Thermal Protection  
3.6  
Internal Voltage Regulator  
VDD voltage is generated internally and is used to  
supply internal logical blocks. The VDD pin is used to  
connect an external decoupling capacitor (1 µF or  
higher). Notice that this pin is for IC internal use and is  
not designed to supply DC current to external blocks.  
3.3  
Lockup Protection and Automatic  
Restart  
If the motor is stopped (blocked) or if it loses  
synchronization with the driver, a lock-up protection  
circuit detects this situation and disables the driver (by  
setting its outputs to high-impedance) in order to  
prevent the motor coil from burnout. After a “waiting  
time” (TWAIT), the lock-up protection is released and  
normal operation resumes for a given time (TRUN). In  
case the motor is still blocked, a new period of waiting  
time is started. TWAIT and TRUN timings are fixed  
internally, so that no external capacitor is needed.  
2010-2012 Microchip Technology Inc.  
DS22263B-page 9  
MTD6501C/D/G  
3.7  
Boost Mode (MTD6501D)  
The Boost mode is an optional BEMF pre-amplification  
by a factor of three. The intention of Boost mode is to  
compensate for motors with a low coupling coefficient  
(= BEMF coefficient), thus allowing it to cover an even  
wider range of motor characteristics. Notice that Boost  
mode impacts the mechanical performance of the  
motor altogether. In Boost mode, the speed of the  
motor will adjust faster to variations of the control (VCC  
or PWM) and/or of the load, including at start-up.  
However, when the BEMF is amplified too much, the  
mechanical performance (in terms of vibration and  
acoustic noise) may start degrading. Thus, Boost mode  
may be inappropriate for motors that already have a  
good coupling coefficient. The optimum choice  
between normal mode and Boost mode depends both  
on the application requirements and on the motor  
characteristics.  
Refer to Table 3-1 for usage of Boost pin 9; leaving this  
pin floating results in the normal mode of operation,  
while tying this pin to GND activates Boost mode  
(active low feature, internal pull-up).  
TABLE 3-1:  
POSSIBLE MODES OF  
OPERATION BASED ON THE  
BOOST PIN CONNECTION  
BOOST Pin  
Floating  
Mode of Operation  
Normal  
Boost  
Tied to GND  
DS22263B-page 10  
2010-2012 Microchip Technology Inc.  
MTD6501C/D/G  
4.0  
4.1  
PACKAGING INFORMATION  
Package Marking Information  
8-Lead SOP (3.90 mm) (MTD6501C, MTD6501G)  
Example  
MTD6501C  
HC 1135  
e
3
256  
NNN  
10-Lead MSOP (MTD6501D)  
Example  
6501D  
135256  
Legend: XX...X Customer-specific information  
Y
YY  
WW  
NNN  
Year code (last digit of calendar year)  
Year code (last 2 digits of calendar year)  
Week code (week of January 1 is week ‘01’)  
Alphanumeric traceability code  
e
3
Pb-free JEDEC designator for Matte Tin (Sn)  
This package is Pb-free. The Pb-free JEDEC designator (  
can be found on the outer packaging for this package.  
e
3
*
)
Note: In the event the full Microchip part number cannot be marked on one line, it will  
be carried over to the next line, thus limiting the number of available  
characters for customer-specific information.  
2010-2012 Microchip Technology Inc.  
DS22263B-page 11  
MTD6501C/D/G  
DS22263B-page 12  
2010-2012 Microchip Technology Inc.  
MTD6501C/D/G  
2010-2012 Microchip Technology Inc.  
DS22263B-page 13  
MTD6501C/D/G  
DS22263B-page 14  
2010-2012 Microchip Technology Inc.  
MTD6501C/D/G  
Note: For the most current package drawings, please see the Microchip Packaging Specification located at  
http://www.microchip.com/packaging  
2010-2012 Microchip Technology Inc.  
DS22263B-page 15  
MTD6501C/D/G  
Note: For the most current package drawings, please see the Microchip Packaging Specification located at  
http://www.microchip.com/packaging  
DS22263B-page 16  
2010-2012 Microchip Technology Inc.  
MTD6501C/D/G  
Note: For the most current package drawings, please see the Microchip Packaging Specification located at  
http://www.microchip.com/packaging  
2010-2012 Microchip Technology Inc.  
DS22263B-page 17  
MTD6501C/D/G  
NOTES:  
DS22263B-page 18  
2010-2012 Microchip Technology Inc.  
MTD6501C/D/G  
APPENDIX A: REVISION HISTORY  
Revision B (May 2012)  
The following is the list of modifications:  
1. Added the MTD6501G device to the family and  
related information throughout the document.  
2. Updated the Temperature Specifications  
table.  
3. Sorted the information in Table 2-1.  
4. Corrected Frequency Generator output to open  
drain in Section 3.2 “Frequency Generator  
Function”.  
5. Renamed  
Section 4.0  
“Packaging  
Information”. Added Section 4.1 “Package  
Marking Information”.  
6. Added Product Identification System section.  
7. Other minor typographical corrections.  
Revision A (September 2010)  
• Original data sheet for the MTD6501C/D/G family  
of devices.  
2010-2012 Microchip Technology Inc.  
DS22263B-page 19  
MTD6501C/D/G  
NOTES:  
DS22263B-page 20  
2010-2012 Microchip Technology Inc.  
MTD6501C/D/G  
PRODUCT IDENTIFICATION SYSTEM  
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.  
PART NO.  
Device  
-X  
XX  
Examples:  
a)  
b)  
c)  
d)  
e)  
f)  
MTD6501C-HC1  
Tube,  
8LD SOP Package  
Tape and Reel,  
8LD SOP Package  
Tube,  
10LD MSOP Package  
Tape and Reel,  
10LD MSOP Package  
Tube,  
Tube/Tape and Reel Package  
MTD6501C-LC1  
MTD6501D-HC1  
MTD6501D-LC1  
MTD6501G-HC1  
MTD6501G-LC1  
Device  
MTD6501C-H:  
MTD6501C-L:  
3-Phase BLDC Sinusoidal Sensorless Fan Motor  
Driver (IOUT maximum 800 mA, PWM 20 kHz) (Tube)  
3-Phase BLDC Sinusoidal Sensorless Fan Motor  
Driver (IOUT maximum 800 mA, PWM 20 kHz)  
(Tape and Reel)  
8LD SOP Package  
Tape and Reel,  
8LD SOP Package  
MTD6501D-H:  
MTD6501D-L:  
3-Phase BLDC Sinusoidal Sensorless Fan Motor  
Driver (IOUT maximum 500 mA, PWM 20 kHz, Boost  
option) (Tube)  
3-Phase BLDC Sinusoidal Sensorless Fan Motor  
Driver (IOUT maximum 500 mA, PWM 20 kHz, Boost  
option) (Tape and Reel)  
MTD6501G-H:  
MTD6501G-L:  
3-Phase BLDC Sinusoidal Sensorless Fan Motor  
Driver (IOUT maximum 800 mA, PWM 23 kHz) (Tube)  
3-Phase BLDC Sinusoidal Sensorless Fan Motor  
Driver (IOUT maximum 800 mA, PWM 23 kHz)  
(Tape and Reel)  
Package C1*  
=
=
8-Lead Plastic Small Outline – Thermally Enhanced Package  
(SOP)  
10-Lead Plastic Micro Small Outline Package (MSOP)  
* These devices are formerly products of Advanced Silicon  
2010-2012 Microchip Technology Inc.  
DS22263B-page 21  
MTD6501C/D/G  
NOTES:  
DS22263B-page 22  
2010-2012 Microchip Technology Inc.  
Note the following details of the code protection feature on Microchip devices:  
Microchip products meet the specification contained in their particular Microchip Data Sheet.  
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the  
intended manner and under normal conditions.  
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our  
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data  
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.  
Microchip is willing to work with the customer who is concerned about the integrity of their code.  
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not  
mean that we are guaranteeing the product as “unbreakable.”  
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our  
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts  
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.  
Information contained in this publication regarding device  
applications and the like is provided only for your convenience  
and may be superseded by updates. It is your responsibility to  
ensure that your application meets with your specifications.  
MICROCHIP MAKES NO REPRESENTATIONS OR  
WARRANTIES OF ANY KIND WHETHER EXPRESS OR  
IMPLIED, WRITTEN OR ORAL, STATUTORY OR  
OTHERWISE, RELATED TO THE INFORMATION,  
INCLUDING BUT NOT LIMITED TO ITS CONDITION,  
QUALITY, PERFORMANCE, MERCHANTABILITY OR  
FITNESS FOR PURPOSE. Microchip disclaims all liability  
arising from this information and its use. Use of Microchip  
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the buyer’s risk, and the buyer agrees to defend, indemnify and  
hold harmless Microchip from any and all damages, claims,  
suits, or expenses resulting from such use. No licenses are  
conveyed, implicitly or otherwise, under any Microchip  
intellectual property rights.  
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32  
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UniWinDriver, WiperLock and ZENA are trademarks of  
Microchip Technology Incorporated in the U.S.A. and other  
countries.  
SQTP is a service mark of Microchip Technology Incorporated  
in the U.S.A.  
All other trademarks mentioned herein are property of their  
respective companies.  
© 2010-2012, Microchip Technology Incorporated, Printed in  
the U.S.A., All Rights Reserved.  
Printed on recycled paper.  
ISBN: 978-1-62076-278-3  
QUALITY MANAGEMENT SYSTEM  
CERTIFIED BY DNV  
Microchip received ISO/TS-16949:2009 certification for its worldwide  
headquarters, design and wafer fabrication facilities in Chandler and  
Tempe, Arizona; Gresham, Oregon and design centers in California  
and India. The Company’s quality system processes and procedures  
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping  
devices, Serial EEPROMs, microperipherals, nonvolatile memory and  
analog products. In addition, Microchip’s quality system for the design  
and manufacture of development systems is ISO 9001:2000 certified.  
== ISO/TS 16949 ==  
2010-2012 Microchip Technology Inc.  
DS22263B-page 23  
Worldwide Sales and Service  
AMERICAS  
ASIA/PACIFIC  
ASIA/PACIFIC  
EUROPE  
Corporate Office  
2355 West Chandler Blvd.  
Chandler, AZ 85224-6199  
Tel: 480-792-7200  
Fax: 480-792-7277  
Technical Support:  
http://www.microchip.com/  
support  
Asia Pacific Office  
Suites 3707-14, 37th Floor  
Tower 6, The Gateway  
Harbour City, Kowloon  
Hong Kong  
Tel: 852-2401-1200  
Fax: 852-2401-3431  
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Tel: 91-80-3090-4444  
Fax: 91-80-3090-4123  
Austria - Wels  
Tel: 43-7242-2244-39  
Fax: 43-7242-2244-393  
Denmark - Copenhagen  
Tel: 45-4450-2828  
Fax: 45-4485-2829  
India - New Delhi  
Tel: 91-11-4160-8631  
Fax: 91-11-4160-8632  
France - Paris  
Tel: 33-1-69-53-63-20  
Fax: 33-1-69-30-90-79  
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Tel: 91-20-2566-1512  
Fax: 91-20-2566-1513  
Australia - Sydney  
Tel: 61-2-9868-6733  
Fax: 61-2-9868-6755  
Web Address:  
www.microchip.com  
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Tel: 49-89-627-144-0  
Fax: 49-89-627-144-44  
Japan - Osaka  
Tel: 81-66-152-7160  
Fax: 81-66-152-9310  
Atlanta  
Duluth, GA  
Tel: 678-957-9614  
Fax: 678-957-1455  
China - Beijing  
Tel: 86-10-8569-7000  
Fax: 86-10-8528-2104  
Italy - Milan  
Tel: 39-0331-742611  
Fax: 39-0331-466781  
Japan - Yokohama  
Tel: 81-45-471- 6166  
Fax: 81-45-471-6122  
China - Chengdu  
Tel: 86-28-8665-5511  
Fax: 86-28-8665-7889  
Boston  
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Tel: 774-760-0087  
Fax: 774-760-0088  
Netherlands - Drunen  
Tel: 31-416-690399  
Fax: 31-416-690340  
Korea - Daegu  
Tel: 82-53-744-4301  
Fax: 82-53-744-4302  
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Tel: 86-23-8980-9588  
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Tel: 630-285-0071  
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Tel: 82-2-554-7200  
Fax: 82-2-558-5932 or  
82-2-558-5934  
UK - Wokingham  
Tel: 44-118-921-5869  
Fax: 44-118-921-5820  
Cleveland  
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Tel: 216-447-0464  
Fax: 216-447-0643  
China - Hong Kong SAR  
Tel: 852-2401-1200  
Fax: 852-2401-3431  
Malaysia - Kuala Lumpur  
Tel: 60-3-6201-9857  
Fax: 60-3-6201-9859  
Dallas  
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Tel: 972-818-7423  
Fax: 972-818-2924  
China - Nanjing  
Tel: 86-25-8473-2460  
Fax: 86-25-8473-2470  
Malaysia - Penang  
Tel: 60-4-227-8870  
Fax: 60-4-227-4068  
China - Qingdao  
Tel: 86-532-8502-7355  
Fax: 86-532-8502-7205  
Philippines - Manila  
Tel: 63-2-634-9065  
Fax: 63-2-634-9069  
Detroit  
Farmington Hills, MI  
Tel: 248-538-2250  
Fax: 248-538-2260  
China - Shanghai  
Tel: 86-21-5407-5533  
Fax: 86-21-5407-5066  
Singapore  
Tel: 65-6334-8870  
Fax: 65-6334-8850  
Indianapolis  
Noblesville, IN  
Tel: 317-773-8323  
Fax: 317-773-5453  
China - Shenyang  
Tel: 86-24-2334-2829  
Fax: 86-24-2334-2393  
Taiwan - Hsin Chu  
Tel: 886-3-5778-366  
Fax: 886-3-5770-955  
Los Angeles  
China - Shenzhen  
Tel: 86-755-8203-2660  
Fax: 86-755-8203-1760  
Taiwan - Kaohsiung  
Tel: 886-7-536-4818  
Fax: 886-7-330-9305  
Mission Viejo, CA  
Tel: 949-462-9523  
Fax: 949-462-9608  
China - Wuhan  
Tel: 86-27-5980-5300  
Fax: 86-27-5980-5118  
Taiwan - Taipei  
Tel: 886-2-2500-6610  
Fax: 886-2-2508-0102  
Santa Clara  
Santa Clara, CA  
Tel: 408-961-6444  
Fax: 408-961-6445  
China - Xian  
Tel: 86-29-8833-7252  
Fax: 86-29-8833-7256  
Thailand - Bangkok  
Tel: 66-2-694-1351  
Fax: 66-2-694-1350  
Toronto  
Mississauga, Ontario,  
Canada  
China - Xiamen  
Tel: 905-673-0699  
Fax: 905-673-6509  
Tel: 86-592-2388138  
Fax: 86-592-2388130  
China - Zhuhai  
Tel: 86-756-3210040  
Fax: 86-756-3210049  
11/29/11  
DS22263B-page 24  
2010-2012 Microchip Technology Inc.  

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