MXT577FNS740M000TA [MICROCHIP]
LVDS Output Clock Oscillator;
| 型号： | MXT577FNS740M000TA |
| 厂家： | 
MICROCHIP |
| 描述： | LVDS Output Clock Oscillator |
| 文件： | 总24页 (文件大小：742K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MXT57
Low Jitter, Temperature Compensated Crystal Oscillator
Features
General Description
• Output Frequency 2.5 MHz to 850 MHz
The MXT57 product line is a family of ultra-low jitter,
industry standard TCXO that are designed to maximize
performance in networking, storage, server, and
telecommunications equipment.
• Phase Noise as Low as 190 fs (F0 = 156.25 MHz,
Integration Bandwidth 1.875 MHz to 20 MHz)
• Ultra-Low Spurs (–100 dBc or Greater Typical)
• ±2.5 ppm over Voltage and Temperature
The MXT57 is available in a 5 mm x 7 mm LLGA
package. These devices are capable of ±2.5 ppm total
stability across the –40°C to +85°C operating
temperature range, using proven assembly methods
that improve long term reliability and minimize aging
drift compared to traditional TCXO assembly
processes.
• Supports CMOS, LVPECL, LVDS, and HCSL
Outputs
• 2.375V to 3.63V Supply Voltage
• Output Enable Option: Can be Ordered on Pin 1
or Pin 2
• Industry-Standard and Space-Saving 5.0 mm x
7.0 mm 6-Lead Package
As a custom ASIC with programmable output format
and OE options, these TCXOs can be configured to be
footprint-compatible with any standard 6-pin TCXO
available today. Standard options and frequencies are
available.
• –40°C to +85°C Operating Temperature Range
• Pb-Free and RoHS Compliant
• Analog TCXO, No Phase Bumps during
Temperature Transitions
Please visit http://clockworks.microchip.com/timing to
select a combination of options to customize your
product, print a specific data sheet, and order samples.
• Short Production Lead Time
Applications
• 10/40/100G Ethernet
Functional Block Diagram
• SONET-Optical Communications
• PCIe Gen 3/4/5
VDD
6
• Fibre Channel/SAS
• CPRI/OBSAI, XAUI and Backplane SERDES
VDD Power Rail Regulation
5 - /Q
4 - Q
Analog
TCXO
÷
PLL
OTP MEMORY
Pin 1
or 2
3
VSS
OE
2018 Microchip Technology Inc.
DS20006037A-page 1
MXT57
Package Types
MXT57 Pinout
Enable Pin 1 Option
MXT57 Pinout
Enable Pin 2 Option
OE
NC
1
2
3
6
5
4
VDD
/Q
NC
OE
1
2
3
6
5
4
VDD
/Q
GND
Q
GND
Q
DS20006037A-page 2
2018 Microchip Technology Inc.
MXT57
1.0
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings †
Supply Voltage......................................................................................................................................... –0.3V to + 4.0V
Input Voltage......................................................................................................................................–0.3V to VDD +0.3V
ESD Protection (HBM)...............................................................................................................................................4 kV
ESD Protection (MM) ................................................................................................................................................400V
ESD Protection (CDM)............................................................................................................................................1.5 kV
† Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device.
This is a stress rating only and functional operation of the device at those or any other conditions above those indicated
in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended
periods may affect device reliability.
TABLE 1-1:
ELECTRICAL CHARACTERISTICS
Electrical Characteristics: VDD = 2.375V to 3.63V, TA = –40°C to +85°C with output terminated per output logic
type.
Parameters
Sym.
Min.
Typ.
Max.
Units
Conditions
Supply Voltage
(Note 1)
VDD
2.375
—
3.63
V
—
—
—
—
—
—
—
—
—
120
95
130
Output enabled LVCMOS (no load).
LVPECL
Supply Current
IDD
90
100
mA
LVDS
95
105
HCSL
60
—
Output disabled (Tri-state)
A = ±5
B = ±2.5
A = ±8
B = ±5
Frequency
Stability
Inclusive of initial accuracy, temperature
drift, aging, shock and vibration.
∆f
ppm
ms
V
From 90% VDD to valid clock output,
Start-up Time
tSU
—
—
20
T = +25°C
VIH
VIL
2
—
—
VDD+0.3
0.8
Input logic-high
Input logic-low
Input Logic
Levels
–0.3
Enable Active
High Option
(Note 2)
—
—
—
—
50
50
—
—
kΩ
kΩ
Pull-up resistor on Pin 1 or 2
Enable Active
Low Option
(Note 3)
Pull-down resistor on Pin 1 or 2
LVCMOS
Frequency
f0
2.5
—
—
250
—
MHz
—
450
110
12 kHz to 20 MHz @ 156.25 MHz
1.875 MHz to 5 MHz @ 156.25 MHz
Integrated Phase
Noise (Random)
ϕj
fsRMS
—
—
Output High
Voltage
VOH
VOL
VDD – 0.8
—
—
—
—
V
RL = 50ꢀ
Output Low
Voltage
0.6
mV
Single-ended
Output Rise/Fall
Time
tr/tf
100
45
—
—
500
55
ps
%
—
—
Duty Cycle
LVPECL
SYM
Frequency
f0
2.5
—
—
850
—
MHz
—
480
100
12 kHz to 20 MHz @ 200 MHz
1.875 MHz to 20 MHz @ 200 MHz
Integrated Phase
Noise (Random)
ϕj
fsRMS
—
—
2018 Microchip Technology Inc.
DS20006037A-page 3
MXT57
TABLE 1-1:
ELECTRICAL CHARACTERISTICS (CONTINUED)
Electrical Characteristics: VDD = 2.375V to 3.63V, TA = –40°C to +85°C with output terminated per output logic
type.
Parameters
Sym.
Min.
Typ.
Max.
Units
Conditions
Output High
Voltage
VDD
1.01
–
VOH
VDD–1.35
VDD–0.8
V
RL = 50ꢀ
Output Low
Voltage
VDD
1.78
–
VOL
VDD–2.0
0.65
VDD–1.6
0.95
mV
mV
Single-ended
Output
Differential
Voltage
VOD
0.77
—
Output Rise/Fall
Time
tr/tf
85
45
—
—
350
55
ps
%
—
—
Duty Cycle
LVDS
SYM
Frequency
f0
2.5
—
—
850
—
MHz
—
430
100
12 kHz to 20 MHz @ 200 MHz
Integrated Phase
Noise (Random)
ϕj
fsRMS
—
—
1.875 MHz to 20 MHz @ 200 MHz
Output High
Voltage
VOH
VOL
1.248
0.898
1.375
1.025
1.602
1.252
V
—
—
Output Low
Voltage
mV
Output
Differential
Voltage
VOD
247
350
1.2
454
mV
mV
—
—
Common Mode
Output Voltage
VCM
1.125
1.375
Output Rise/Fall
Time
tr/tf
100
45
—
—
400
55
ps
%
—
—
Duty Cycle
HCSL
SYM
Frequency
f0
2.5
—
—
850
—
MHz
—
450
110
12 kHz to 20 MHz @ 100 MHz
1.875 MHz to 20 MHz @ 100 MHz
Integrated Phase
Noise (Random)
ϕj
fsRMS
—
—
Output High
Voltage
VOH
VOL
660
700
0
850
27
mV
—
—
Output Low
Voltage
–150
mV
mV
Output
Differential
Voltage
—
—
200
250
250
300
20% to 80%
VOD
RL = 50ꢀ
Common Mode
Output Voltage
VCM
48
—
52
mV
Differential
Output Rise/Fall
Time
tr/tf
150
48
300
—
450
52
ps
%
—
—
Duty Cycle
SYM
Note 1: VDD Pin should have basic VDD filtering as shown in Figure Something.
2: Output is enabled if pad floated (not connected) or pulled high; output tri-stated if pulled low.
3: Output is enabled if pad floated (not connected) or pulled low; output tri-stated if pulled high.
DS20006037A-page 4
2018 Microchip Technology Inc.
MXT57
TEMPERATURE SPECIFICATIONS (Note 1)
Parameters
Temperature Ranges
Sym.
Min.
Typ.
Max.
Units
Conditions
Operating Temperature Range
Maximum Junction Temperature
Storage Temperature Range
Soldering Temperature
TA
TJ
TS
—
–40
—
—
—
—
—
+85
°C
°C
°C
°C
—
—
—
+125
+125
+260
–65
—
10 sec. max.
Package Thermal Resistance
Thermal Resistance from Junction to
Ambient, LGA-6Ld
JA
—
53
°C/W
—
Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable
junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the
maximum allowable power dissipation will cause the device operating junction temperature to exceed the
maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability.
2018 Microchip Technology Inc.
DS20006037A-page 5
MXT57
2.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 2-1 and Table 2-2.
TABLE 2-1:
Pin Number
PIN FUNCTION TABLE (ENABLE PIN 1 OPTION)
Pin Name
Pin Type
Description
Output Enable.
1
OE
I
Active-High and Active-Low options.
Do not connect, leave floating.
Power supply ground.
Clock output +.
2
3
4
5
6
DNC
GND
Q
NC
Ground
O
/Q
O
Clock output –.
VDD
Power
Power supply.
TABLE 2-2:
PIN FUNCTION TABLE (ENABLE PIN 2 OPTION)
Pin Number
Pin Name
Pin Type
Description
Do not connect, leave floating.
1
DNC
NC
Output Enable.
Active-High and Active-Low options.
2
OE
I
3
4
5
6
GND
Q
Ground
O
Power supply ground.
Clock output +.
Clock output –.
Power supply.
/Q
O
VDD
Power
DS20006037A-page 6
2018 Microchip Technology Inc.
MXT57
3.0
PERFORMANCE CHARACTERISTICS
Note: The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
FIGURE 3-1:
LVCMOS Output 125 MHz 1.875 MHz to 20 MHz, 154 fs.
FIGURE 3-2:
LVCMOS Output 125 MHz 12 kHz to 20 MHz, 412 fs.
2018 Microchip Technology Inc.
DS20006037A-page 7
MXT57
FIGURE 3-3:
LVPECL Output 200 MHz 1.875 MHz to 20 MHz 169 fs.
FIGURE 3-4:
LVPECL Output 200 MHz 12 kHz to 20 MHz, 428 fs.
DS20006037A-page 8
2018 Microchip Technology Inc.
MXT57
FIGURE 3-5:
HCSL Output 156.25 MHz 1.875 MHz to 20 MHz, 191 fs.
FIGURE 3-6:
HCSL Output 156.25 MHz 12 kHz to 20 MHz, 449 fs.
2018 Microchip Technology Inc.
DS20006037A-page 9
MXT57
3XDBA125nd 5-X573A6LOLArqenconir urnBurnin
3-MXT573DBA-125M and 5-MXT573ABA-156.25M 6L MOLGA Frequency Monitor During Burn-In +85°C, 3.3V
2
1.5
1
20,000 hrs.
Readout
10,000 hrs.
Extrapolated
0.5
0
-0.5
-1
-1.5
-2
200
OPERATING HOURS
20,000
FIGURE 3-7:
Aging.
DS20006037A-page 10
2018 Microchip Technology Inc.
MXT57
4.0
OUTPUT WAVEFORM
Output Voltage Swing
Refer to Table 4-1
FIGURE 4-1:
Output Waveform: LVPECL, LVDS, HCSL, LVCMOS.
TABLE 4-1:
OUTPUT VOLTAGE SWING
Output Logic Protocol
Output Swing (Peak-to-Peak, Typical)
LVCMOS
LVPECL
LVDS
VOH – 3V, VOL + 3V
770 mV
350 mV
HCSL
700 mV
2018 Microchip Technology Inc.
DS20006037A-page 11
MXT57
5.0
SOLDER REFLOW PROFILE
FIGURE 5-1:
Solder Reflow Profile.
TABLE 5-1:
SOLDER REFLOW
Refer to JSTD-020C
Ramp-Up Rate (200°C to Peak Temp.)
Preheat Time 150°C to 200°C
Time Maintained above 217°C
Peak Temperature
3°C/sec. max.
60 to 180 sec.
60 to 150 sec.
255°C to 260°C
20 to 40 sec.
Time within 5°C of Actual Peak
Ramp-Down Rate
6°C/sec. max.
8 minutes max.
Time 25°C to Peak Temperature
DS20006037A-page 12
2018 Microchip Technology Inc.
MXT57
6.0
ENVIRONMENTAL SPECIFICATIONS
TABLE 6-1:
ENVIRONMENTAL SPECIFICATIONS
Parameter
Specification
Thermal Shock
MIL-STD-883, Method 1011, Condition A
MIL-STD-883, Method 1004
Moisture Resistance
Mechanical Shock
Mechanical Vibration
Resistance to Soldering Heat
Hazardous Substance
Solderability
MIL-STD-883, Method 2022, Condition C
MIL-STD-883, Method 2007, Condition B
J-STD-020C, Table 5-2 Pb-free Devices (Except 2 Cycles Max)
Pb-Free/RoHS/Green Compliant
JESD22-B102-D Method 2 (Preconditioning E)
MIL-STD-883, Method 2004, Test Condition D
MIL-STD-883, Method 1014, Condition C
Terminal Strength
Gross Leak
Fine Leak
MIL-STD-883, Method 1014, Condition A2, R1 = 2x10–8 ATM CC/S
Solvent Resistance
MIL-STD-202, Method 215
2018 Microchip Technology Inc.
DS20006037A-page 13
MXT57
7.0
7.1
PACKAGING INFORMATION
Package Marking Information
Example
6-Lead LGA*
XXXXXXX
WNNN<cr>
XXXXXXXX
MXT573A
6035<cr>
BA200M00
Legend: XX...X Product code, customer-specific information, or frequency in MHz
without printed decimal point
Y
YY
WW
NNN
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
e
3
Pb-free JEDEC® designator for Matte Tin (Sn)
*
This package is Pb-free. The Pb-free JEDEC designator ( )
e3
can be found on the outer packaging for this package.
●, ▲, ▼ Pin one index is identified by a dot, delta up, or delta down (triangle
mark).
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information. Package may or may not include
the corporate logo.
Underbar (_) and/or Overbar (⎯) symbol may not be to scale.
DS20006037A-page 14
2018 Microchip Technology Inc.
MXT57
6-Lead 7.0 mm x 5.0 mm LLGA Package Outline and Recommended Land Pattern
6-Lead Low Profile Land Grid Array [APA] - 7x5 mm Body (LLGA)
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
A
B
E
N
(DATUM A)
(DATUM B)
NOTE 1
2X
0.10 C
2X
1
2
TOP VIEW
0.10 C
A1
C
A2
A
SEATING
PLANE
SIDE VIEW
0.07 C
1
2
E1
L
N
L1
6X b
0.10
0.05
C A B
C
e
BOTTOM VIEW
Microchip Technology Drawing C04-1071A Sheet 1 of 2
2018 Microchip Technology Inc.
DS20006037A-page 15
MXT57
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DS20006037A-page 16
2018 Microchip Technology Inc.
MXT57
6-Lead Low Profile Land Grid Array [APA] - 7x5 mm Body (LLGA)
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
X
6
G1
Y
C
G2
1
2
E
SILK SCREEN
RECOMMENDED LAND PATTERN
Units
MILLIMETERS
Dimension Limits
MIN
NOM
2.54 BSC
3.93
MAX
Contact Pitch
E
C
Contact Pad Spacing
Contact Pad Width (X6)
Contact Pad Length (X6)
Contact to Contact (X4)
Contact to Contact (X3)
X
Y
G1
G2
1.60
1.53
0.94
2.40
Notes:
1. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing C04-3071A
2018 Microchip Technology Inc.
DS20006037A-page 17
MXT57
NOTES:
DS20006037A-page 18
2018 Microchip Technology Inc.
MXT57
APPENDIX A: REVISION HISTORY
Revision A (May 2018)
• Initial creation of MXT57 Microchip data sheet
DS20006037A.
2018 Microchip Technology Inc.
DS20006037A-page 19
MXT57
NOTES:
DS20006037A-page 20
2018 Microchip Technology Inc.
MXT57
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office.
Examples:
X
XX
X
PART NO.
Device
XXXMXXX
XX
a) MXT573ABF MXT57, 3A Crystal Frequency code, OE
100M000TA
Crystal
Frequency
Enable Pin
Option
Output Logic
Type
Output
Frequency
Shipping
Pin 1, PECL (Active-Low), 100 MHz,
43/Tube.
b) MXT574DBC MXT57, 4D Crystal Frequency code, OE
33M5000RA
Pin 1, CMOS (Active-High), 33.5 MHz,
1,000/Reel.
Device:
MXT57:
Low Jitter, Temperature Compensated
Crystal Oscillator (6-Lead 7x5 LLGA)
c) MXT575CNU MXT57, 5C Crystal Frequency code, OE
740M250TA
Pin 2, HCSL (Active-High), 740.25 MHz,
43/Tube,
Crystal Frequency:
Enable Pin Option:
5A (Example Only) = Selected by ClockWorks Configura-
tor; Dependent on the ordered out-
put frequency.
d) MXT577FNN MXT57, 7F Crystal Frequency code, OE
3M300000RA Pin 2, CMOS (Active-Low), 3.3 MHz,
1,000/Reel.
B
N
=
=
Pin 1
Pin 2
Note 1:
Tape and Reel identifier only appears in the
catalog part number description. This
identifier is used for ordering purposes and
is not printed on the device package. Check
with your Microchip Sales Office for package
availability with the Tape and Reel option.
Output Logic Type:
(For Enable Pin 1)
A
B
C
D
F
G
H
J
=
=
=
=
=
=
=
=
PECL (Active-High)
LVDS (Active-High)
CMOS (Active-High)
HCSL (Active-High)
PECL (Active-Low)
LVDS (Active-Low)
CMOS (Active-Low)
HCSL (Active-Low)
Output Logic Type:
(For Enable Pin 2)
R
S
T
U
L
M
N
P
=
=
=
=
=
=
=
=
PECL (Active-High)
LVDS (Active-High)
CMOS (Active-High)
HCSL (Active-High)
PECL (Active-Low)
LVDS (Active-Low)
CMOS (Active-Low)
HCSL (Active-Low)
Output Frequency:
Shipping:
xxxMxxx
=
2.5 MHz to 850 MHz
TA =
43/Tube
RA = 1,000/Reel
Please visit http://clockworks.microchip.com/timing to select a combination of
options to customize your product, print a specific data sheet and order samples.
2018 Microchip Technology Inc.
DS20006037A-page 21
MXT57
NOTES:
DS20006037A-page 22
2018 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights unless otherwise stated.
Trademarks
The Microchip name and logo, the Microchip logo, AnyRate, AVR,
AVR logo, AVR Freaks, BeaconThings, BitCloud, CryptoMemory,
CryptoRF, dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KEELOQ,
KEELOQ logo, Kleer, LANCheck, LINK MD, maXStylus,
maXTouch, MediaLB, megaAVR, MOST, MOST logo, MPLAB,
OptoLyzer, PIC, picoPower, PICSTART, PIC32 logo, Prochip
Designer, QTouch, RightTouch, SAM-BA, SpyNIC, SST, SST
Logo, SuperFlash, tinyAVR, UNI/O, and XMEGA are registered
trademarks of Microchip Technology Incorporated in the U.S.A.
and other countries.
ClockWorks, The Embedded Control Solutions Company,
EtherSynch, Hyper Speed Control, HyperLight Load, IntelliMOS,
mTouch, Precision Edge, and Quiet-Wire are registered
trademarks of Microchip Technology Incorporated in the U.S.A.
Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any
Capacitor, AnyIn, AnyOut, BodyCom, chipKIT, chipKIT logo,
CodeGuard, CryptoAuthentication, CryptoCompanion,
CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average
Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial
Programming, ICSP, Inter-Chip Connectivity, JitterBlocker,
KleerNet, KleerNet logo, Mindi, MiWi, motorBench, MPASM, MPF,
MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach,
Omniscient Code Generation, PICDEM, PICDEM.net, PICkit,
PICtail, PureSilicon, QMatrix, RightTouch logo, REAL ICE, Ripple
Blocker, SAM-ICE, Serial Quad I/O, SMART-I.S., SQI,
SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC,
USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and
ZENAare trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated in
the U.S.A.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
Silicon Storage Technology is a registered trademark of Microchip
Technology Inc. in other countries.
GestIC is a registered trademark of Microchip Technology
Germany II GmbH & Co. KG, a subsidiary of Microchip Technology
Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
QUALITYꢀMANAGEMENTꢀꢀSYSTEMꢀ
CERTIFIEDꢀBYꢀDNVꢀ
© 2018, Microchip Technology Incorporated, All Rights Reserved.
ISBN: 978-1-5224-3134-3
== ISO/TSꢀ16949ꢀ==ꢀ
2018 Microchip Technology Inc.
DS20006037A-page 23
Worldwide Sales and Service
AMERICAS
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EUROPE
Corporate Office
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DS20006037A-page 24
2018 Microchip Technology Inc.
10/25/17
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