PIC10F220I/OT [MICROCHIP]

High-Performance Microcontrollers with 8-bit A/D; 高性能微控制器与8位A / D
PIC10F220I/OT
型号: PIC10F220I/OT
厂家: MICROCHIP    MICROCHIP
描述:

High-Performance Microcontrollers with 8-bit A/D
高性能微控制器与8位A / D

微控制器和处理器 外围集成电路 光电二极管 时钟
文件: 总86页 (文件大小:819K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
PIC10F220/222  
Data Sheet  
High-Performance Microcontrollers  
with 8-bit A/D  
© 2007 Microchip Technology Inc.  
DS41270E  
Note the following details of the code protection feature on Microchip devices:  
Microchip products meet the specification contained in their particular Microchip Data Sheet.  
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the  
intended manner and under normal conditions.  
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our  
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data  
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.  
Microchip is willing to work with the customer who is concerned about the integrity of their code.  
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not  
mean that we are guaranteeing the product as “unbreakable.”  
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our  
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts  
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.  
Information contained in this publication regarding device  
applications and the like is provided only for your convenience  
and may be superseded by updates. It is your responsibility to  
ensure that your application meets with your specifications.  
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Trademarks  
The Microchip name and logo, the Microchip logo, Accuron,  
dsPIC, KEELOQ, KEELOQ logo, microID, MPLAB, PIC,  
PICmicro, PICSTART, PRO MATE, rfPIC and SmartShunt are  
registered trademarks of Microchip Technology Incorporated  
in the U.S.A. and other countries.  
AmpLab, FilterLab, Linear Active Thermistor, Migratable  
Memory, MXDEV, MXLAB, SEEVAL, SmartSensor and The  
Embedded Control Solutions Company are registered  
trademarks of Microchip Technology Incorporated in the  
U.S.A.  
Analog-for-the-Digital Age, Application Maestro, CodeGuard,  
dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,  
ECONOMONITOR, FanSense, FlexROM, fuzzyLAB,  
In-Circuit Serial Programming, ICSP, ICEPIC, Mindi, MiWi,  
MPASM, MPLAB Certified logo, MPLIB, MPLINK, PICkit,  
PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal,  
PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB, Select  
Mode, Smart Serial, SmartTel, Total Endurance, UNI/O,  
WiperLock and ZENA are trademarks of Microchip  
Technology Incorporated in the U.S.A. and other countries.  
SQTP is a service mark of Microchip Technology Incorporated  
in the U.S.A.  
All other trademarks mentioned herein are property of their  
respective companies.  
© 2007, Microchip Technology Incorporated, Printed in the  
U.S.A., All Rights Reserved.  
Printed on recycled paper.  
Microchip received ISO/TS-16949:2002 certification for its worldwide  
headquarters, design and wafer fabrication facilities in Chandler and  
Tempe, Arizona; Gresham, Oregon and design centers in California  
and India. The Company’s quality system processes and procedures  
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping  
devices, Serial EEPROMs, microperipherals, nonvolatile memory and  
analog products. In addition, Microchip’s quality system for the design  
and manufacture of development systems is ISO 9001:2000 certified.  
DS41270E-page ii  
© 2007 Microchip Technology Inc.  
PIC10F220/222  
6-Pin, 8-Bit Flash Microcontrollers  
Device Included In This Data Sheet:  
Low-Power Features/CMOS Technology:  
• PIC10F220  
• PIC10F222  
• Operating Current:  
- < 175 μA @ 2V, 4 MHz  
• Standby Current:  
High-Performance RISC CPU:  
- 100 nA @ 2V, typical  
• Low-Power, High-Speed Flash Technology:  
- 100,000 Flash endurance  
- > 40-year retention  
• Only 33 Single-Word Instructions to Learn  
• All Single-Cycle Instructions Except for Program  
Branches which are Two-Cycle  
• Fully Static Design  
• 12-bit Wide Instructions  
• Wide Operating Voltage Range: 2.0V to 5.5V  
• Wide Temperature Range:  
- Industrial: -40°C to +85°C  
- Extended: -40°C to +125°C  
• 2-Level Deep Hardware Stack  
• Direct, Indirect and Relative Addressing modes  
for Data and Instructions  
• 8-bit Wide Data Path  
• 8 Special Function Hardware Registers  
• Operating Speed:  
Peripheral Features:  
- 500 ns instruction cycle with 8 MHz internal  
clock  
• 4 I/O Pins:  
- 3 I/O pins with individual direction control  
- 1 input only pin  
- 1 μs instruction cycle with 4 MHz internal  
clock  
- High current sink/source for direct LED drive  
- Wake-on-change  
Special Microcontroller Features:  
- Weak pull-ups  
• 4 or 8 MHz Precision Internal Oscillator:  
- Factory calibrated to ±1%  
• 8-bit Real-Time Clock/Counter (TMR0) with 8-bit  
Programmable Prescaler  
• In-Circuit Serial Programming™ (ICSP™)  
• In-Circuit Debugging (ICD) Support  
• Power-On Reset (POR)  
• Analog-to-Digital (A/D) Converter:  
- 8-bit resolution  
- 2 external input channels  
- 1 internal input channel dedicated  
• Short Device Reset Timer, DRT (1.125 ms typical)  
• Watchdog Timer (WDT) with Dedicated On-Chip  
RC Oscillator for Reliable Operation  
• Programmable Code Protection  
• Multiplexed MCLR Input Pin  
• Internal Weak Pull-Ups on I/O Pins  
• Power-Saving Sleep mode  
• Wake-up from Sleep on Pin Change  
Program Memory  
Flash (words)  
Data Memory  
Timers  
8-bit  
Device  
I/O  
8-Bit A/D (ch)  
SRAM (bytes)  
PIC10F220  
PIC10F222  
256  
512  
16  
23  
4
4
1
1
2
2
© 2007 Microchip Technology Inc.  
DS41270E-page 1  
PIC10F220/222  
6-Lead SOT-23 Pin Diagram  
1
2
6
5
GP0/AN0/ICSPDAT  
GP3/MCLR/VPP  
VDD  
VSS  
3
4
GP1/AN1/ICSPCLK  
GP2/T0CKI/FOSC4  
8-Lead DIP Pin Diagram  
GP3/MCLR/VPP  
VSS  
1
N/C  
VDD  
8
7
6
5
2
3
4
N/C  
GP2/T0CKI/FOSC4  
GP1/AN1/ICSPCLK  
GP0/AN0/ICSPDAT  
8-Lead DFN Pin Diagram  
N/C  
VDD  
8
1
GP3/MCLR/VPP  
VSS  
7
6
5
2
3
4
GP2/T0CKI/FOSC4  
GP1/AN1/ICSPCLK  
N/C  
GP0/AN0/ICSPDAT  
DS41270E-page 2  
© 2007 Microchip Technology Inc.  
PIC10F220/222  
Table of Contents  
1.0 General Description...................................................................................................................................................................... 5  
2.0 Device Varieties .......................................................................................................................................................................... 7  
3.0 Architectural Overview ................................................................................................................................................................. 9  
4.0 Memory Organization................................................................................................................................................................. 13  
5.0 I/O Port....................................................................................................................................................................................... 21  
6.0 TMR0 Module and TMR0 Register............................................................................................................................................. 25  
7.0 Analog-to-Digital (A/D) converter ............................................................................................................................................... 29  
8.0 Special Features Of The CPU.................................................................................................................................................... 33  
9.0 Instruction Set Summary............................................................................................................................................................ 43  
10.0 Electrical Characteristics............................................................................................................................................................ 51  
11.0 Development Support................................................................................................................................................................. 61  
12.0 DC and AC Characteristics Graphs and Charts......................................................................................................................... 69  
13.0 Packaging Information................................................................................................................................................................ 73  
Index .................................................................................................................................................................................................... 79  
The Microchip Web Site....................................................................................................................................................................... 81  
Customer Change Notification Service ................................................................................................................................................ 81  
Customer Support................................................................................................................................................................................ 81  
Reader Response................................................................................................................................................................................ 82  
Product Identification System .............................................................................................................................................................. 83  
TO OUR VALUED CUSTOMERS  
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An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current  
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© 2007 Microchip Technology Inc.  
DS41270E-page 3  
PIC10F220/222  
NOTES:  
DS41270E-page 4  
© 2007 Microchip Technology Inc.  
PIC10F220/222  
1.1  
Applications  
1.0  
GENERAL DESCRIPTION  
The PIC10F220/222 devices fit in applications ranging  
from personal care appliances and security systems to  
low-power remote transmitters/receivers. The Flash  
technology makes customizing application programs  
(transmitter codes, appliance settings, receiver fre-  
quencies, etc.) extremely fast and convenient. The  
small footprint packages, for through hole or surface  
mounting, make these microcontrollers well suited for  
applications with space limitations. Low-cost, low-  
power, high-performance, ease-of-use and I/O flexibil-  
ity make the PIC10F220/222 devices very versatile,  
even in areas where no microcontroller use has been  
considered before (e.g., timer functions, logic and  
PLDs in larger systems and coprocessor applications).  
The PIC10F220/222 devices from Microchip  
Technology are low-cost, high-performance, 8-bit, fully-  
static Flash-based CMOS microcontrollers. They  
employ a RISC architecture with only 33 single-word/  
single-cycle instructions. All instructions are single-  
cycle (1 μs) except for program branches, which take  
two cycles. The PIC10F220/222 devices deliver perfor-  
mance in an order of magnitude higher than their com-  
petitors in the same price category. The 12-bit wide  
instructions are highly symmetrical, resulting in a  
typical 2:1 code compression over other 8-bit  
microcontrollers in its class. The easy-to-use and easy  
to remember instruction set reduces development time  
significantly.  
The PIC10F220/222 products are equipped with spe-  
cial features that reduce system cost and power  
requirements. The Power-on Reset (POR) and Device  
Reset Timer (DRT) eliminates the need for the external  
Reset circuitry. INTOSC Internal Oscillator mode is pro-  
vided, thereby, preserving the limited number of I/O  
available. Power-Saving Sleep mode, Watchdog Timer  
and code protection features improve system cost,  
power and reliability.  
The PIC10F220/222 devices are available in cost-  
effective Flash, which is suitable for production in any  
volume. The customer can take full advantage of  
Microchip’s price leadership in Flash programmable  
microcontrollers while benefiting from the Flash  
programmable flexibility.  
The PIC10F220/222 products are supported by a full-  
featured macro assembler, a software simulator, an in-  
circuit debugger,  
a
‘C’ compiler,  
a
low-cost  
development programmer and a full featured program-  
mer. All the tools are supported on IBM® PC and  
compatible machines.  
TABLE 1-1:  
PIC10F220/222 DEVICES(1), (2)  
PIC10F220  
PIC10F222  
Clock  
Maximum Frequency of Operation (MHz)  
Flash Program Memory  
Data Memory (bytes)  
Timer Module(s)  
8
256  
16  
8
512  
23  
Memory  
Peripherals  
Features  
TMR0  
Yes  
2
TMR0  
Yes  
2
Wake-up from Sleep on pin change  
Analog inputs  
I/O Pins  
3
3
Input Only Pins  
1
1
Internal Pull-ups  
Yes  
Yes  
33  
Yes  
Yes  
33  
In-Circuit Serial Programming™  
Number of instructions  
Packages  
6-pin SOT-23,  
8-pin DIP, DFN  
6-pin SOT-23,  
8-pin DIP, DFN  
Note 1: The PIC10F220/222 devices have Power-on Reset, selectable Watchdog Timer, selectable code-protect, high I/O  
current capability and precision internal oscillator.  
2: The PIC10F220/222 devices use serial programming with data pin GP0 and clock pin GP1.  
© 2007 Microchip Technology Inc.  
DS41270E-page 5  
PIC10F220/222  
NOTES:  
DS41270E-page 6  
© 2007 Microchip Technology Inc.  
PIC10F220/222  
2.0  
DEVICE VARIETIES  
A variety of packaging options are available. Depend-  
ing on application and production requirements, the  
proper device option can be selected using the  
information in this section. When placing orders, please  
use the PIC10F220/222 Product Identification System  
at the back of this data sheet to specify the correct part  
number.  
2.1  
Quick Turn Programming (QTP)  
Devices  
Microchip offers a QTP programming service for  
factory production orders. This service is made  
available for users who choose not to program  
medium-to-high quantity units and whose code  
patterns have stabilized. The devices are identical to  
the Flash devices but with all Flash locations and fuse  
options already programmed by the factory. Certain  
code and prototype verification procedures do apply  
before production shipments are available. Please  
contact your local Microchip Technology sales office for  
more details.  
2.2  
Serialized Quick Turn  
ProgrammingSM (SQTPSM) Devices  
Microchip offers a unique programming service, where  
a few user-defined locations in each device are  
programmed with different serial numbers. The serial  
numbers may be random, pseudo-random or  
sequential.  
Serial programming allows each device to have a  
unique number, which can serve as an entry-code,  
password or ID number.  
© 2007 Microchip Technology Inc.  
DS41270E-page 7  
PIC10F220/222  
NOTES:  
DS41270E-page 8  
© 2007 Microchip Technology Inc.  
PIC10F220/222  
The PIC10F220/222 devices contain an 8-bit ALU and  
working register. The ALU is a general purpose arith-  
metic unit. It performs arithmetic and Boolean functions  
between data in the working register and any register  
file.  
3.0  
ARCHITECTURAL OVERVIEW  
The high performance of the PIC10F220/222 devices  
can be attributed to a number of architectural features  
commonly found in RISC microprocessors. To begin  
with, the PIC10F220/222 devices use a Harvard archi-  
tecture in which program and data are accessed on  
separate buses. This improves bandwidth over tradi-  
tional von Neumann architectures where program and  
data are fetched on the same bus. Separating program  
and data memory further allows instructions to be sized  
differently than the 8-bit wide data word. Instruction  
opcodes are 12 bits wide, making it possible to have all  
single-word instructions. A 12-bit wide program mem-  
ory access bus fetches a 12-bit instruction in a single  
cycle. A two-stage pipeline overlaps fetch and execu-  
tion of instructions. Consequently, all instructions (33)  
execute in a single cycle (1 μs @ 4 MHz or 500 ns @  
8 MHz) except for program branches.  
The ALU is 8-bits wide and capable of addition, sub-  
traction, shift and logical operations. Unless otherwise  
mentioned, arithmetic operations are two’s comple-  
ment in nature. In two-operand instructions, one oper-  
and is typically the W (working) register. The other  
operand is either a file register or an immediate  
constant. In single operand instructions, the operand is  
either the W register or a file register.  
The W register is an 8-bit working register used for ALU  
operations. It is not an addressable register.  
Depending on the instruction executed, the ALU may  
affect the values of the Carry (C), Digit Carry (DC) and  
Zero (Z) bits in the STATUS register. The C and DC bits  
operate as a borrow and digit borrow out bit, respec-  
tively, in subtraction. See the SUBWF and ADDWF  
instructions for examples.  
The table below lists program memory (Flash) and data  
memory (RAM) for the PIC10F220/222 devices.  
Memory  
Device  
A simplified block diagram is shown in Figure 3-1 with  
the corresponding device pins described in Table 3-1.  
Program  
Data  
PIC10F220  
PIC10F222  
256 x 12  
512 x 12  
16 x 8  
23 x 8  
The PIC10F220/222 devices can directly or indirectly  
address its register files and data memory. All Special  
Function Registers (SFR), including the PC, are  
mapped in the data memory. The PIC10F220/222  
devices have a highly orthogonal (symmetrical) instruc-  
tion set that makes it possible to carry out any opera-  
tion, on any register, using any addressing mode. This  
symmetrical nature and lack of “special optimal situa-  
tions” make programming with the PIC10F220/222  
devices simple, yet efficient. In addition, the learning  
curve is reduced significantly.  
© 2007 Microchip Technology Inc.  
DS41270E-page 9  
PIC10F220/222  
FIGURE 3-1:  
BLOCK DIAGRAM  
9-10  
8
GPIO  
Data Bus  
Program Counter  
Flash  
512 x 12 or  
256 x 12  
Program  
Memory  
GP0/AN0/ICSPDAT  
GP1/AN1/ICSPCLK  
GP2/T0CKI/FOSC4  
GP3/MCLR/VPP  
RAM  
23 or 16  
bytes  
STACK1  
STACK2  
File  
Registers  
Program  
Bus  
12  
RAM Addr  
9
Addr MUX  
Instruction Reg  
Indirect  
Addr  
5
Direct Addr  
5-7  
FSR Reg  
STATUS Reg  
8
3
MUX  
Device Reset  
Timer  
Instruction  
Decode &  
Control  
Power-on  
Reset  
ALU  
AN0  
AN1  
8
Watchdog  
Timer  
ADC  
Timing  
Generation  
W Reg  
Internal RC  
Clock  
Timer0  
Absolute  
Voltage  
MCLR  
VDD, VSS  
Reference  
TABLE 3-1:  
PINOUT DESCRIPTION  
Input  
Function  
Output  
Type  
Name  
Description  
Type  
GP0/AN0/ICSPDAT  
GP0  
TTL  
CMOS Bidirectional I/O pin. Can be software programmed for internal weak  
pull-up and wake-up from Sleep on pin change.  
AN0  
ICSPDAT  
GP1  
AN  
ST  
Analog Input  
CMOS In-Circuit programming data  
GP1/AN1/ICSPCLK  
TTL  
CMOS Bidirectional I/O pin. Can be software programmed for internal weak  
pull-up and wake-up from Sleep on pin change.  
AN1  
ICSPCLK  
GP2  
AN  
ST  
Analog Input  
In-Circuit programming clock  
GP2/T0CKI/FOSC4  
GP3/MCLR/VPP  
TTL  
ST  
CMOS Bidirectional I/O pin  
Clock input to TMR0  
CMOS Oscillator/4 output  
T0CKI  
FOSC4  
GP3  
TTL  
Input pin. Can be software programmed for internal weak pull-up and  
wake-up from Sleep on pin change.  
MCLR  
ST  
Master Clear (Reset). When configured as MCLR, this pin is an  
active-low Reset to the device. Voltage on MCLR/VPP must not  
exceed VDD during normal device operation or the device will enter  
Programming mode.  
VPP  
VDD  
VSS  
HV  
P
Programming voltage input  
VDD  
VSS  
Positive supply for logic and I/O pins  
Ground reference for logic and I/O pins  
P
Legend:  
I = Input, O = Output, I/O = Input/Output, P = Power, — = Not used, TTL = TTL input,  
ST = Schmitt Trigger input, AN = Analog Input  
DS41270E-page 10  
© 2007 Microchip Technology Inc.  
PIC10F220/222  
3.1  
Clocking Scheme/Instruction  
Cycle  
3.2  
Instruction Flow/Pipelining  
An instruction cycle consists of four Q cycles (Q1, Q2,  
Q3 and Q4). The instruction fetch and execute are  
pipelined such that fetch takes one instruction cycle,  
while decode and execute takes another instruction  
cycle. However, due to the pipelining, each instruction  
effectively executes in one cycle. If an instruction  
causes the PC to change (e.g., GOTO) then two cycles  
are required to complete the instruction (Example 3-1).  
The clock is internally divided by four to generate four  
non-overlapping quadrature clocks, namely Q1, Q2,  
Q3 and Q4. Internally, the PC is incremented every Q1,  
and the instruction is fetched from program memory  
and latched into the Instruction Register (IR) in Q4. It is  
decoded and executed during Q1 through Q4. The  
clocks and instruction execution flow is shown in  
Figure 3-2 and Example 3-1.  
A fetch cycle begins with the PC incrementing in Q1.  
In the execution cycle, the fetched instruction is latched  
into the Instruction Register in cycle Q1. This instruc-  
tion is then decoded and executed during the Q2, Q3  
and Q4 cycles. Data memory is read during Q2  
(operand read) and written during Q4 (destination  
write).  
FIGURE 3-2:  
CLOCK/INSTRUCTION CYCLE  
Q2  
Q3  
Q4  
Q2  
Q3  
Q4  
Q2  
Q3  
Q4  
Q1  
Q1  
Q1  
OSC1  
Q1  
Q2  
Q3  
Q4  
PC  
Internal  
phase  
clock  
PC  
PC + 1  
PC + 2  
Fetch INST (PC)  
Execute INST (PC - 1)  
Fetch INST (PC + 1)  
Execute INST (PC)  
Fetch INST (PC + 2)  
Execute INST (PC + 1)  
EXAMPLE 3-1:  
INSTRUCTION PIPELINE FLOW  
1. MOVLW 03H  
2. MOVWF GPIO  
3. CALL SUB_1  
Fetch 1  
Execute 1  
Fetch 2  
Execute 2  
Fetch 3  
Execute 3  
Fetch 4  
4. BSF  
GPIO, BIT1  
Flush  
Fetch SUB_1 Execute SUB_1  
All instructions are single cycle, except for any program branches. These take two cycles, since the fetch instruction  
is “flushed” from the pipeline, while the new instruction is being fetched and then executed.  
© 2007 Microchip Technology Inc.  
DS41270E-page 11  
PIC10F220/222  
NOTES:  
DS41270E-page 12  
© 2007 Microchip Technology Inc.  
PIC10F220/222  
4.2  
Program Memory Organization for  
the PIC10F222  
4.0  
MEMORY ORGANIZATION  
The PIC10F220/222 memories are organized into pro-  
gram memory and data memory. Data memory banks  
are accessed using the File Select Register (FSR).  
The PIC10F222 devices have a 10-bit Program  
Counter (PC) capable of addressing a 1024 x 12  
program memory space.  
4.1  
Program Memory Organization for  
the PIC10F220  
Only the first 512 x 12 (0000h-01FFh) for the Mem-  
High are physically implemented (see Figure 4-2).  
Accessing a location above these boundaries will  
cause a wrap-around within the first 512 x 12 space  
(PIC10F222). The effective Reset vector is at 0000h,  
(see Figure 4-2). Location 01FFh (PIC10F222) con-  
tains the internal clock oscillator calibration value.  
This value should never be overwritten.  
The PIC10F220 devices have a 9-bit Program Counter  
(PC) capable of addressing a 512 x 12 program  
memory space.  
Only the first 256 x 12 (0000h-00FFh) for the  
PIC10F220 are physically implemented (see  
Figure 4-1). Accessing  
a location above these  
boundaries will cause a wrap-around within the first  
256 x 12 space (PIC10F220). The effective Reset  
vector is at 0000h, (see Figure 4-1). Location 00FFh  
(PIC10F220) contains the internal clock oscillator  
calibration value. This value should never be  
overwritten.  
FIGURE 4-2:  
PROGRAM MEMORY MAP  
AND STACK FOR THE  
PIC10F222  
<9:0>  
PC<8:0>  
10  
CALL, RETLW  
Stack Level 1  
Stack Level 2  
FIGURE 4-1:  
PROGRAM MEMORY MAP  
AND STACK FOR THE  
PIC10F220  
(1)  
Reset Vector  
0000h  
<8:0>  
PC<7:0>  
9
CALL, RETLW  
On-chip Program  
Memory  
Stack Level 1  
Stack Level 2  
(1)  
Reset Vector  
0000h  
On-chip Program  
Memory  
512 Words  
01FFh  
0200h  
02FFh  
256 Word  
00FFh  
0100h  
Note 1: Address 0000h becomes the effective  
Reset vector. Location 01FFh contains the  
MOVLW XXinternal oscillator calibration  
value.  
01FFh  
Note 1: Address 0000h becomes the  
effective Reset vector. Location 00FFh  
contains the MOVLW XXinternal oscillator  
calibration value.  
© 2007 Microchip Technology Inc.  
DS41270E-page 13  
PIC10F220/222  
FIGURE 4-4:  
PIC10F222 REGISTER  
FILE MAP  
4.3  
Data Memory Organization  
Data memory is composed of registers or bytes of  
RAM. Therefore, data memory for a device is specified  
by its register file. The register file is divided into two  
functional groups: Special Function Registers (SFR)  
and General Purpose Registers (GPR).  
File Address  
(1)  
INDF  
00h  
01h  
02h  
03h  
04h  
05h  
06h  
07h  
TMR0  
PCL  
The Special Function Registers include the TMR0 reg-  
ister, the Program Counter (PCL), the STATUS register,  
the I/O register (GPIO) and the File Select Register  
(FSR). In addition, Special Function Registers are used  
to control the I/O port configuration and prescaler  
options.  
STATUS  
FSR  
OSCCAL  
GPIO  
ADCON0  
ADRES  
The General Purpose Registers are used for data and  
control information under command of the instructions.  
08h  
09h  
For the PIC10F220, the register file is composed of 9  
Special Function Registers and 16 General Purpose  
Registers (Figure 4-3, Figure 4-4).  
General  
Purpose  
Registers  
For the PIC10F222, the register file is composed of 9  
Special Function Registers and 23 General Purpose  
Registers (Figure 4-4).  
1Fh  
4.3.1  
GENERAL PURPOSE REGISTER  
FILE  
Note 1: Not a physical register. See Section 4.9  
“Indirect Data Addressing; INDF and  
FSR Registers”.  
The General Purpose Register file is accessed, either  
directly or indirectly, through the File Select Register  
(FSR). See Section 4.9 “Indirect Data Addressing;  
INDF and FSR Registers”.  
4.3.2  
SPECIAL FUNCTION REGISTERS  
The Special Function Registers (SFRs) are registers  
used by the CPU and peripheral functions to control the  
operation of the device (Table 4-1).  
FIGURE 4-3:  
PIC10F220 REGISTER  
FILE MAP  
File Address  
The Special Function Registers can be classified into  
two sets. The Special Function Registers associated  
with the “core” functions are described in this section.  
Those related to the operation of the peripheral  
features are described in the section for each  
peripheral feature.  
(1)  
INDF  
00h  
01h  
02h  
03h  
04h  
05h  
06h  
07h  
TMR0  
PCL  
STATUS  
FSR  
OSCCAL  
GPIO  
ADCON0  
ADRES  
08h  
09h  
(2)  
Unimplemented  
0Fh  
10h  
General  
Purpose  
Registers  
1Fh  
Note 1: Not a physical register. See Section 4.9  
“Indirect Data Addressing; INDF and  
FSR Registers”.  
2: Unimplemented, read as 00h.  
DS41270E-page 14  
© 2007 Microchip Technology Inc.  
PIC10F220/222  
TABLE 4-1:  
SPECIAL FUNCTION REGISTER (SFR) SUMMARY  
Value on  
Address  
Name  
Bit 7  
Bit 6  
Bit 5  
Bit 4  
Bit 3  
Bit 2  
Bit 1  
Bit 0  
Power-On  
Reset  
Page #  
(2)  
00h  
01h  
02h  
INDF  
Uses contents of FSR to address data memory (not a physical register)  
8-Bit Real-Time Clock/Counter  
xxxx xxxx  
xxxx xxxx  
1111 1111  
20  
25  
19  
TMR0  
(1)  
PCL  
Low Order 8 Bits of PC  
(3)  
03h  
04h  
05h  
06h  
STATUS  
FSR  
GPWUF  
TO  
PD  
Z
DC  
C
0--1 1xxx  
111x xxxx  
1111 1110  
---- xxxx  
15  
20  
18  
21  
Indirect Data Memory Address Pointer  
OSCCAL  
GPIO  
CAL6  
CAL5  
CAL4  
CAL3  
CAL2  
GP3  
CAL1  
GP2  
CAL0  
GP1  
FOSC4  
GP0  
07h  
08h  
N/A  
ADCON0  
ADRES  
ANS1  
ANS0  
CHS1  
CHS0 GO/DONE ADON  
11-- 1100  
xxxx xxxx  
---- 1111  
30  
31  
23  
Result of Analog-to-Digital Conversion  
TRISGPIO  
OPTION  
I/O Control Register  
PSA PS2  
N/A  
GPWU GPPU  
T0CS  
T0SE  
PS1  
PS0  
1111 1111  
17  
Legend:  
– = unimplemented, read as ‘0’, x= unknown, u= unchanged, q= value depends on condition.  
Note 1: The upper byte of the Program Counter is not directly accessible. See Section 4.7 “Program Counter” for an  
explanation of how to access these bits.  
2: Other (non Power-up) Resets include external Reset through MCLR, Watchdog Timer and wake-up on pin change  
Reset.  
3: See Table 8-1 for other Reset specific values.  
4.4  
STATUS Register  
This register contains the arithmetic status of the ALU,  
the Reset status and the page preselect bit.  
The STATUS register can be the destination for any  
instruction, as with any other register. If the STATUS  
register is the destination for an instruction that affects  
the Z, DC or C bits, then the write to these three bits is  
disabled. These bits are set or cleared according to the  
device logic. Furthermore, the TO and PD bits are not  
writable. Therefore, the result of an instruction with the  
STATUS register as destination may be different than  
intended.  
For example, CLRF STATUSwill clear the upper three  
bits and set the Z bit. This leaves the STATUS register  
as 000u u1uu(where u= unchanged).  
Therefore, it is recommended that only BCF, BSF and  
MOVWFinstructions be used to alter the STATUS regis-  
ter. These instructions do not affect the Z, DC or C bits  
from the STATUS register. For other instructions, which  
do affect Status bits, see Instruction Set Summary.  
© 2007 Microchip Technology Inc.  
DS41270E-page 15  
PIC10F220/222  
REGISTER 4-1:  
STATUS REGISTER (ADDRESS: 03h)  
R/W-0  
GPWUF  
bit 7  
R/W-0  
R/W-0  
R-1  
TO  
R-1  
PD  
R/W-x  
Z
R/W-x  
DC  
R/W-x  
C
bit 0  
Legend:  
R = Readable bit  
-n = Value at POR  
W = Writable bit  
‘1’ = Bit is set  
U = Unimplemented bit, read as ‘0’  
‘0’ = Bit is cleared x = Bit is unknown  
bit 7  
GPWUF: GPIO Reset bit  
1= Reset due to wake-up from Sleep on pin change  
0= After power-up or other Reset  
bit 6  
bit 5  
bit 4  
Reserved: Do not use. Use of this bit may affect upward compatibility with future products.  
Reserved: Do not use. Use of this bit may affect upward compatibility with future products.  
TO: Time-out bit  
1= After power-up, CLRWDTinstruction or SLEEPinstruction  
0= A WDT time-out occurred  
bit 3  
bit 2  
bit 1  
PD: Power-down bit  
1= After power-up or by the CLRWDTinstruction  
0= By execution of the SLEEPinstruction  
Z: Zero bit  
1= The result of an arithmetic or logic operation is zero  
0= The result of an arithmetic or logic operation is not zero  
DC: Digit carry/borrow bit (for ADDWFand SUBWFinstructions)  
ADDWF:  
1= A carry to the 4th low-order bit of the result occurred  
0= A carry to the 4th low-order bit of the result did not occur  
SUBWF:  
1= A borrow from the 4th low-order bit of the result did not occur  
0= A borrow from the 4th low-order bit of the result occurred  
bit 0  
C: Carry/borrow bit (for ADDWF, SUBWFand RRF, RLFinstructions)  
ADDWF:  
SUBWF:  
RRFor RLF:  
1= A carry occurred  
1= A borrow did not occur Load bit with LSb or MSb, respectively  
0= A carry did not occur 0= A borrow occurred  
DS41270E-page 16  
© 2007 Microchip Technology Inc.  
PIC10F220/222  
4.5  
OPTION Register  
Note:  
Note:  
If TRIS bit is set to ‘0’, the wake-up on  
change and pull-up functions are disabled  
for that pin (i.e., note that TRIS overrides  
Option control of GPPU and GPWU).  
The OPTION register is a 8-bit wide, write-only register,  
which contains various control bits to configure the  
Timer0/WDT prescaler and Timer0.  
The OPTION register is not memory mapped and is  
therefore only addressable by executing the OPTION  
instruction, the contents of the W register will be trans-  
ferred to the OPTION register. A Reset sets the  
OPTION<7:0> bits.  
If the T0CS bit is set to ‘1’, it will override  
the TRIS function on the T0CKI pin.  
REGISTER 4-2:  
OPTION REGISTER  
W-1  
GPWU  
bit 7  
W-1  
GPPU  
W-1  
W-1  
W-1  
PSA  
W-1  
PS2  
W-1  
PS1  
W-1  
PS0  
T0CS  
T0SE  
bit 0  
Legend:  
R = Readable bit  
-n = Value at POR  
W = Writable bit  
‘1’ = Bit is set  
U = Unimplemented bit, read as ‘0’  
‘0’ = Bit is cleared x = Bit is unknown  
bit 7  
bit 6  
bit 5  
bit 4  
bit 3  
bit 2-0  
GPWU: Enable Wake-up On Pin Change bit (GP0, GP1, GP3)  
1= Disabled  
0= Enabled  
GPPU: Enable Weak Pull-ups bit (GP0, GP1, GP3)  
1= Disabled  
0= Enabled  
T0CS: Timer0 Clock Source Select bit  
1= Transition on T0CKI pin (overrides TRIS on the T0CKI pin)  
0= Transition on internal instruction cycle clock, FOSC/4  
T0SE: Timer0 Source Edge Select bit  
1= Increment on high-to-low transition on the T0CKI pin  
0= Increment on low-to-high transition on the T0CKI pin  
PSA: Prescaler Assignment bit  
1= Prescaler assigned to the WDT  
0= Prescaler assigned to Timer0  
PS<2:0>: Prescaler Rate Select bits  
Bit Value Timer0 Rate WDT Rate  
000  
001  
010  
011  
100  
101  
110  
111  
1 : 2  
1 : 4  
1 : 8  
1 : 16  
1 : 32  
1 : 64  
1 : 128  
1 : 256  
1 : 1  
1 : 2  
1 : 4  
1 : 8  
1 : 16  
1 : 32  
1 : 64  
1 : 128  
© 2007 Microchip Technology Inc.  
DS41270E-page 17  
PIC10F220/222  
4.6  
OSCCAL Register  
The Oscillator Calibration (OSCCAL) register is used to  
calibrate the internal precision 4/8 MHz oscillator. It  
contains seven bits for calibration.  
Note:  
Erasing the device will also erase the pre-  
programmed internal calibration value for  
the internal oscillator. The calibration  
value must be read prior to erasing the  
part so it can be reprogrammed correctly  
later.  
After you move in the calibration constant, do not  
change the value. See Section 8.2.2 “Internal 4/8 MHz  
Oscillator”.  
REGISTER 4-3:  
OSCCAL – OSCILLATOR CALIBRATION REGISTER (ADDRESS: 05h)  
R/W-1  
CAL6  
R/W-1  
CAL5  
R/W-1  
CAL4  
R/W-1  
CAL3  
R/W-1  
CAL2  
R/W-1  
CAL1  
R/W-1  
CAL0  
R/W-0  
FOSC4  
bit 7  
bit 0  
Legend:  
R = Readable bit  
-n = Value at POR  
W = Writable bit  
‘1’ = Bit is set  
U = Unimplemented bit, read as ‘0’  
‘0’ = Bit is cleared x = Bit is unknown  
bit 7-1  
CAL<6:0>: Oscillator Calibration bits  
0111111= Maximum frequency  
0000001  
0000000= Center frequency  
1111111  
1000000= Minimum frequency  
bit 0  
FOSC4: INTOSC/4 Output Enable bit(1)  
1= INTOSC/4 output onto GP2  
0= GP2/T0CKI applied to GP2  
Note 1: Overrides GP2/T0CKI control registers when enabled.  
DS41270E-page 18  
© 2007 Microchip Technology Inc.  
PIC10F220/222  
4.7.1  
EFFECTS OF RESET  
4.7  
Program Counter  
The PC is set upon a Reset, which means that the PC  
addresses the last location in program memory (i.e.,  
the oscillator calibration instruction). After executing  
MOVLW XX, the PC will roll over to location 0000h and  
begin executing user code.  
As a program instruction is executed, the Program  
Counter (PC) will contain the address of the next  
program instruction to be executed. The PC value is  
increased by one every instruction cycle, unless an  
instruction changes the PC.  
For a GOTOinstruction, bits 8:0 of the PC are provided  
by the GOTO instruction word. The PC Latch (PCL) is  
mapped to PC<7:0>.  
4.8  
Stack  
The PIC10F220 device has a 2-deep, 8-bit wide  
hardware PUSH/POP stack.  
For a CALLinstruction or any instruction where the PCL  
is the destination, bits 7:0 of the PC again are provided  
by the instruction word. However, PC<8> does not  
come from the instruction word, but is always cleared  
(Figure 4-5).  
The PIC10F222 device has a 2-deep, 9-bit wide  
hardware PUSH/POP stack.  
A CALLinstruction will PUSH the current value of stack  
1 into stack 2 and then PUSH the current PC value,  
incremented by one, into stack level 1. If more than two  
sequential CALL’s are executed, only the most recent  
two return addresses are stored.  
Instructions where the PCL is the destination or Modify  
PCL instructions, include MOVWF PC, ADDWF PCand  
BSF PC, 5.  
Note:  
Because PC<8> is cleared in the CALL  
instruction or any Modify PCL instruction,  
all subroutine calls or computed jumps are  
limited to the first 256 locations of any  
program memory page (512 words long).  
A RETLWinstruction will POP the contents of stack level  
1 into the PC and then copy stack level 2 contents into  
level 1. If more than two sequential RETLW’s are exe-  
cuted, the stack will be filled with the address  
previously stored in level 2.  
Note 1: The W register will be loaded with the lit-  
eral value specified in the instruction. This  
is particularly useful for the implementa-  
tion of data look-up tables within the  
program memory.  
FIGURE 4-5:  
LOADING OF PC  
BRANCH INSTRUCTIONS  
GOTOInstruction  
8 7  
0
2: There are no Status bits to indicate stack  
PC  
PCL  
overflows or stack underflow conditions.  
3: There are no instructions mnemonics  
called PUSH or POP. These are actions  
that occur from the execution of the CALL  
and RETLWinstructions.  
Instruction Word  
CALLor Modify PCLInstruction  
8 7  
0
PC  
PCL  
Instruction Word  
Reset to ‘0’  
© 2007 Microchip Technology Inc.  
DS41270E-page 19  
PIC10F220/222  
EXAMPLE 4-1:  
HOW TO CLEAR RAM  
USING INDIRECT  
ADDRESSING  
4.9  
Indirect Data Addressing; INDF  
and FSR Registers  
The INDF register is not a physical register. Addressing  
INDF actually addresses the register whose address is  
contained in the FSR register (FSR is a pointer). This is  
indirect addressing.  
MOVLW  
MOVWF  
0x10  
;initialize pointer  
;to RAM  
FSR  
NEXT  
CLRF  
INDF  
;clear INDF  
;register  
INCF  
BTFSC  
GOTO  
FSR,F  
FSR,4  
NEXT  
;inc pointer  
;all done?  
;NO, clear next  
4.9.1  
INDIRECT ADDRESSING  
• Register file 09 contains the value 10h  
• Register file 0A contains the value 0Ah  
• Load the value 09 into the FSR register  
CONTINUE  
:
:
;YES, continue  
• A read of the INDF register will return the value  
of 10h  
The FSR is a 5-bit wide register. It is used in conjunc-  
tion with the INDF register to indirectly address the data  
memory area.  
• Increment the value of the FSR register by one  
(FSR = 0A)  
• A read of the INDR register now will return the  
value of 0Ah.  
The FSR<4:0> bits are used to select data memory  
addresses 00h to 1Fh.  
Reading INDF itself indirectly (FSR = 0) will produce  
00h. Writing to the INDF register indirectly results in a  
no-operation (although Status bits may be affected).  
Note:  
Do not use banking. FSR <7:5> are  
unimplemented and read as ‘1’s.  
A simple program to clear RAM locations 10h-1Fh  
using Indirect addressing is shown in Example 4-1.  
FIGURE 4-6:  
DIRECT/INDIRECT ADDRESSING  
Direct Addressing  
Indirect Addressing  
4
(opcode)  
0
(FSR)  
0
4
Location Select  
Location Select  
00h  
Data  
Memory  
0Fh  
10h  
(1)  
1Fh  
Bank 0  
Note 1: For register map detail, see Section 4.3 “Data Memory Organization”.  
DS41270E-page 20  
© 2007 Microchip Technology Inc.  
PIC10F220/222  
The TRIS registers are “write-only” and are set (output  
drivers disabled) upon Reset.  
5.0  
I/O PORT  
As with any other register, the I/O register(s) can be  
written and read under program control. However, read  
instructions (e.g., MOVF GPIO, W) always read the I/O  
pins independent of the pin’s Input/Output modes. On  
Reset, all I/O ports are defined as input (inputs are at  
high-impedance) since the I/O control registers are all  
set.  
5.3  
I/O Interfacing  
The equivalent circuit for an I/O port pin is shown in  
Figure 5-1. All port pins, except GP3, which is input  
only, may be used for both input and output operations.  
For input operations, these ports are non-latching. Any  
input must be present until read by an input instruction  
(e.g., MOVF GPIO, W). The outputs are latched and  
remain unchanged until the output latch is rewritten. To  
use a port pin as output, the corresponding direction  
control bit in TRIS must be cleared (= 0). For use as an  
input, the corresponding TRIS bit must be set. Any I/O  
pin (except GP3) can be programmed individually as  
input or output.  
5.1  
GPIO  
GPIO is an 8-bit I/O register. Only the low-order 4 bits  
are used (GP<3:0>). Bits 7 through 4 are unimple-  
mented and read as ‘0’s. Please note that GP3 is an  
input only pin. Pins GP0, GP1 and GP3 can be config-  
ured with weak pull-ups and also for wake-up on  
change. The wake-up on change and weak pull-up  
functions are not individually pin selectable. If GP3/  
MCLR is configured as MCLR, a weak pull-up can be  
enabled via the Configuration Word. Configuring GP3  
as MCLR disables the wake-up on change function for  
this pin.  
FIGURE 5-1:  
EQUIVALENT CIRCUIT  
FOR A SINGLE I/O PIN  
Data  
Bus  
D
Q
Q
Data  
VDD  
P
VDD  
(1)  
WR  
Port  
Latch  
5.2  
TRIS Registers  
CK  
The Output Driver Control register is loaded with the  
contents of the W register by executing the TRIS f  
instruction. A ‘1’ from a TRIS register bit puts the corre-  
sponding output driver in a High-Impedance mode. A  
0’ puts the contents of the output data latch on the  
selected pins, enabling the output buffer. The excep-  
tions are GP3, which is input only, and the GP2/T0CKI/  
FOSC4 pin, which may be controlled by various  
registers. See Table 5-1.  
N
I/O  
pin  
W
Reg  
D
Q
Q
TRIS  
Latch  
VSS VSS  
TRIS ‘f’  
CK  
Reset  
(2)  
Note:  
A read of the ports reads the pins, not the  
output data latches. That is, if an output  
driver on a pin is enabled and driven high,  
but the external system is holding it low, a  
read of the port will indicate that the pin is  
low.  
RD Port  
Note 1: I/O pins have protection diodes to VDD and  
VSS.  
2: See Table 3-1 for buffer type.  
TABLE 5-1:  
ORDER OF PRECEDENCE FOR PIN FUNCTIONS  
Priority  
GP0  
GP1  
GP2  
GP3  
1
2
3
AN0  
TRIS GPIO  
AN1  
TRIS GPIO  
FOSC4  
T0CKI  
MCLR  
TRIS GPIO  
TABLE 5-2:  
REQUIREMENTS TO MAKE PINS AVAILABLE IN DIGITAL MODE  
Bit  
GP0  
GP1  
GP2  
GP3  
FOSC4  
T0CS  
0
0
0
0
0
ANS1  
ANS0  
MCLRE  
Legend:  
— = Condition of bit will have no effect on the setting of the pin to Digital mode.  
© 2007 Microchip Technology Inc.  
DS41270E-page 21  
PIC10F220/222  
FIGURE 5-2:  
BLOCK DIAGRAM OF GP0  
FIGURE 5-3:  
BLOCK DIAGRAM OF GP2  
AND GP1  
(1)  
Data  
Bus  
D
I/O Pin  
Q
Q
GPPU  
Data  
Latch  
WR  
Port  
FOSC4  
CK  
OSCCAL<0>  
Data  
W
Reg  
Bus  
D
Q
Q
D
Q
Q
Data  
Latch  
TRIS  
Latch  
(1)  
I/O Pin  
WR  
Port  
TRIS ‘f’  
CK  
CK  
W
Reg  
Reset  
T0CS  
D
Q
Q
TRIS  
Latch  
TRIS ‘f’  
CK  
RD Port  
Reset  
T0CKI  
Analog Enable  
Note 1: I/O pins have protection diodes to VDD and  
VSS.  
RD Port  
FIGURE 5-4:  
BLOCK DIAGRAM OF GP3  
Q
D
GPPU  
CK  
MCLRE  
Reset  
Mis-Match  
(1)  
ADC  
I/O Pin  
Note 1: I/O pins have protection diodes to VDD and  
VSS.  
Data Bus  
RD Port  
Q
D
CK  
Mis-match  
Note 1: GP3/MCLR pin has a protection diode to VSS  
only.  
DS41270E-page 22  
© 2007 Microchip Technology Inc.  
PIC10F220/222  
TABLE 5-3:  
SUMMARY OF PORT REGISTERS  
Value on  
Value on  
Address  
Name  
Bit 7  
Bit 6  
Bit 5  
Bit 4  
Bit 3 Bit 2 Bit 1 Bit 0  
Power-On  
Reset  
All Other Resets  
N/A  
TRISGPIO  
I/O Control Registers  
---- 1111  
---- 1111  
1111 1111  
N/A  
OPTION  
STATUS  
GPIO  
GPWU  
GPWUF  
GPPU T0CS T0SE PSA  
PS2  
Z
PS1 PS0 1111 1111  
(1)  
03h  
TO  
PD  
DC  
C
0001 1xxx  
q00q quuu  
06h  
GP3  
GP2 GP1 GP0 ---- xxxx  
---- uuuu  
Legend:  
Shaded cells not used by PORT registers, read as ‘0’, – = unimplemented, read as ‘0’, x= unknown, u= unchanged,  
q= depends on condition.  
Note 1: If Reset was due to wake-up on pin change, then bit 7 = 1. All other Resets will cause bit 7 = 0.  
EXAMPLE 5-1:  
I/O PORT READ-MODIFY-  
WRITE INSTRUCTIONS  
5.4  
I/O Programming Considerations  
5.4.1  
BIDIRECTIONAL I/O PORTS  
;Initial GPIO Settings  
;GPIO<3:2> Inputs  
;GPIO<1:0> Outputs  
;
Some instructions operate internally as read followed  
by write operations. The BCFand BSFinstructions, for  
example, read the entire port into the CPU, execute the  
bit operation and re-write the result. Caution must be  
used when these instructions are applied to a port  
where one or more pins are used as input/outputs. For  
example, a BSFoperation on bit 2 of GPIO will cause  
all eight bits of GPIO to be read into the CPU, bit 2 to  
be set and the GPIO value to be written to the output  
latches. If another bit of GPIO is used as a bidirectional  
I/O pin (say bit 0) and it is defined as an input at this  
time, the input signal present on the pin itself would be  
read into the CPU and rewritten to the data latch of this  
particular pin, overwriting the previous content. As long  
as the pin stays in the Input mode, no problem occurs.  
However, if bit 0 is switched into Output mode later on,  
the content of the data latch may now be unknown.  
;
;
GPIO latch  
GPIO pins  
----------  
---- pp11  
---- pp11  
----------  
GPIO, 1 ;---- pp01  
GPIO, 0 ;---- pp10  
BCF  
BCF  
MOVLW 007h;  
TRIS  
GPIO  
;---- pp10  
---- pp11  
;
Note:  
The user may have expected the pin values to  
be ---- pp00. The second BCFcaused GP1  
to be latched as the pin value (High).  
5.4.2  
SUCCESSIVE OPERATIONS ON I/O  
PORTS  
The actual write to an I/O port happens at the end of an  
instruction cycle, whereas for reading, the data must be  
valid at the beginning of the instruction cycle (Figure 5-5).  
Therefore, care must be exercised if a write followed by  
a read operation is carried out on the same I/O port. The  
sequence of instructions should allow the pin voltage to  
stabilize (load dependent) before the next instruction  
causes that file to be read into the CPU. Otherwise, the  
previous state of that pin may be read into the CPU rather  
than the new state. When in doubt, it is better to separate  
these instructions with a NOP or another instruction not  
accessing this I/O port.  
Example 5-1 shows the effect of two sequential  
Read-Modify-Write instructions (e.g., BCF, BSF, etc.)  
on an I/O port.  
A pin actively outputting a high or a low should not be  
driven from external devices at the same time in order  
to change the level on this pin (“wired-or”, “wired-and”).  
The resulting high output currents may damage the  
chip.  
FIGURE 5-5:  
SUCCESSIVE I/O OPERATION  
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4  
PC + 3  
PC  
PC + 1  
PC + 2  
This example shows a write to GPIO followed  
by a read from GPIO.  
Instruction  
Fetched  
MOVWFGPIO  
MOVFGPIO, W  
NOP  
NOP  
Data setup time = (0.25 TCY – TPD)  
where: TCY = instruction cycle  
TPD = propagation delay  
GP<2:0>  
Port pin  
written here  
Port pin  
sampled here  
Therefore, at higher clock frequencies, a  
write followed by a read may be problematic.  
Instruction  
Executed  
MOVWF GPIO  
(Write to GPIO)  
MOVF GPIO,W  
(Read GPIO)  
NOP  
© 2007 Microchip Technology Inc.  
DS41270E-page 23  
PIC10F220/222  
NOTES:  
DS41270E-page 24  
© 2007 Microchip Technology Inc.  
PIC10F220/222  
Counter mode is selected by setting the T0CS bit  
(OPTION<5>). In this mode, Timer0 will increment  
either on every rising or falling edge of pin T0CKI. The  
T0SE bit (OPTION<4>) determines the source edge.  
Clearing the T0SE bit selects the rising edge. Restric-  
tions on the external clock input are discussed in detail  
in Section 6.1 “Using Timer0 With An External  
Clock”.  
6.0  
TMR0 MODULE AND TMR0  
REGISTER  
The Timer0 module has the following features:  
• 8-bit timer/counter register, TMR0  
• Readable and writable  
• 8-bit software programmable prescaler  
• Internal or external clock select:  
- Edge select for external clock  
The prescaler may be used by either the Timer0  
module or the Watchdog Timer, but not both. The  
prescaler assignment is controlled in software by the  
control bit PSA (OPTION<3>). Clearing the PSA bit will  
assign the prescaler to Timer0. The prescaler is not  
readable or writable. When the prescaler is assigned to  
the Timer0 module, prescale values of 1:2, 1:4, 1:256  
are selectable. Section 6.2 “Prescaler” details the  
operation of the prescaler.  
Figure 6-1 is a simplified block diagram of the Timer0  
module.  
Timer mode is selected by clearing the T0CS bit  
(OPTION<5>). In Timer mode, the Timer0 module will  
increment every instruction cycle (without prescaler). If  
TMR0 register is written, the increment is inhibited for  
the following two cycles (Figure 6-2 and Figure 6-3).  
The user can work around this by writing an adjusted  
value to the TMR0 register.  
A summary of registers associated with the Timer0  
module is found in Table 6-1.  
FIGURE 6-1:  
TIMER0 BLOCK DIAGRAM  
Data Bus  
GP2/T0CKI  
Pin  
FOSC/4  
0
1
PSOUT  
8
1
0
Sync with  
Internal  
Clocks  
TMR0 Reg  
Programmable  
PSOUT  
Sync  
(2)  
Prescaler  
(2 TCY delay)  
T0SE  
3
(1)  
(1)  
PS2, PS1, PS0  
PSA  
(1)  
T0CS  
Note 1: Bits T0CS, T0SE, PSA, PS2, PS1 and PS0 are located in the OPTION register.  
2: The prescaler is shared with the Watchdog Timer (Figure 6-5).  
FIGURE 6-2:  
TIMER0 TIMING: INTERNAL CLOCK/NO PRESCALE  
PC  
(Program  
Counter)  
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4  
PC-1 PC PC + 1 PC + 2 PC + 3 PC + 4 PC + 5 PC + 6  
Instruction  
Fetch  
MOVWF TMR0 MOVF TMR0,W MOVF TMR0,W MOVF TMR0,W MOVF TMR0,W MOVF TMR0,W  
NT0 + 1  
T0  
T0 + 1  
T0 + 2  
NT0  
NT0 + 2  
Timer0  
Instruction  
Executed  
Read TMR0  
reads NT0 + 1  
Read TMR0  
reads NT0  
Read TMR0  
reads NT0  
Read TMR0  
reads NT0  
Read TMR0  
reads NT0 + 2  
Write TMR0  
executed  
© 2007 Microchip Technology Inc.  
DS41270E-page 25  
PIC10F220/222  
FIGURE 6-3:  
TIMER0 TIMING: INTERNAL CLOCK/PRESCALE 1:2  
PC  
(Program  
Counter)  
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4  
PC-1 PC PC + 1 PC + 2 PC + 3 PC + 4 PC + 5 PC + 6  
MOVWF TMR0 MOVF TMR0,W MOVF TMR0,W MOVF TMR0,W MOVF TMR0,W MOVF TMR0,W  
Instruction  
Fetch  
T0  
T0 + 1  
NT0  
NT0 + 1  
Timer0  
Instruction  
Executed  
Read TMR0  
reads NT0 + 1  
Read TMR0  
reads NT0  
Read TMR0  
reads NT0  
Read TMR0  
reads NT0  
Read TMR0  
reads NT0 + 2  
Write TMR0  
executed  
TABLE 6-1:  
REGISTERS ASSOCIATED WITH TIMER0  
Value on  
Power-On  
Reset  
Value on  
All Other  
Resets  
Address  
Name  
Bit 7  
Bit 6  
Bit 5  
Bit 4  
Bit 3  
Bit 2  
Bit 1  
Bit 0  
01h  
TMR0  
Timer0 – 8-Bit Real-Time Clock/Counter  
GPWU GPPU T0CS T0SE PSA  
xxxx xxxx  
1111 1111  
---- 1111  
uuuu uuuu  
1111 1111  
---- 1111  
N/A  
OPTION  
TRISGPIO  
PS2  
PS1  
PS0  
(1)  
N/A  
I/O Control Register  
Legend:  
Shaded cells not used by Timer0, – = unimplemented, x = unknown, u= unchanged.  
Note 1: The TRIS of the T0CKI pin is overridden when T0CS = 1  
6.1.1  
EXTERNAL CLOCK  
SYNCHRONIZATION  
6.1  
Using Timer0 With An External  
Clock  
When no prescaler is used, the external clock input is  
the same as the prescaler output. The synchronization  
of T0CKI with the internal phase clocks is accom-  
plished by sampling the prescaler output on the Q2 and  
Q4 cycles of the internal phase clocks (Figure 6-4).  
Therefore, it is necessary for T0CKI to be high for at  
least 2TOSC (and a small RC delay of 2Tt0H) and low  
for at least 2TOSC (and a small RC delay of 2Tt0H).  
Refer to the electrical specification of the desired  
device.  
When an external clock input is used for Timer0, it must  
meet certain requirements. The external clock require-  
ment is due to internal phase clock (TOSC) synchroniza-  
tion. Also, there is a delay in the actual incrementing of  
Timer0 after synchronization.  
When a prescaler is used, the external clock input is  
divided by the asynchronous ripple counter-type  
prescaler, so that the prescaler output is symmetrical.  
For the external clock to meet the sampling require-  
ment, the ripple counter must be taken into account.  
Therefore, it is necessary for T0CKI to have a period of  
at least 4TOSC (and a small RC delay of 4Tt0H) divided  
by the prescaler value. The only requirement on T0CKI  
high and low time is that they do not violate the  
minimum pulse width requirement of Tt0H. Refer to  
parameters 40, 41 and 42 in the electrical specification  
of the desired device.  
DS41270E-page 26  
© 2007 Microchip Technology Inc.  
PIC10F220/222  
6.1.2  
TIMER0 INCREMENT DELAY  
Since the prescaler output is synchronized with the  
internal clocks, there is a small delay from the time the  
external clock edge occurs to the time the Timer0 mod-  
ule is actually incremented. Figure 6-4 shows the delay  
from the external clock edge to the timer incrementing.  
FIGURE 6-4:  
TIMER0 TIMING WITH EXTERNAL CLOCK  
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4  
Small pulse  
misses sampling  
External Clock Input or  
Prescaler Output(2)  
(1)  
External Clock/Prescaler  
Output After Sampling  
(3)  
Increment Timer0 (Q4)  
Timer0  
T0  
T0 + 1  
T0 + 2  
Note 1: Delay from clock input change to Timer0 increment is 3TOSC to 7TOSC. (Duration of Q = TOSC).  
Therefore, the error in measuring the interval between two edges on Timer0 input = ±4TOSC max.  
2: External clock if no prescaler selected; prescaler output otherwise.  
3: The arrows indicate the points in time where sampling occurs.  
6.2  
Prescaler  
An 8-bit counter is available as a prescaler for the  
Timer0 module or as a postscaler for the Watchdog  
Timer (WDT), respectively (see Section 8.6 “Watch-  
dog Timer (WDT)”). For simplicity, this counter is  
being referred to as “prescaler” throughout this data  
sheet.  
Note:  
The prescaler may be used by either the  
Timer0 module or the WDT, but not both.  
Thus, a prescaler assignment for the  
Timer0 module means that there is no  
prescaler for the WDT and vice-versa.  
The PSA and PS<2:0> bits (OPTION<3:0>) determine  
prescaler assignment and prescale ratio.  
When assigned to the Timer0 module, all instructions  
writing to the TMR0 register (e.g., CLRF 1,  
MOVWF 1, BSF 1,x, etc.) will clear the prescaler.  
When assigned to WDT, a CLRWDTinstruction will clear  
the prescaler along with the WDT. The prescaler is  
neither readable nor writable. On a Reset, the  
prescaler contains all ‘0’s.  
© 2007 Microchip Technology Inc.  
DS41270E-page 27  
PIC10F220/222  
To change prescaler from the WDT to the Timer0  
module, use the sequence shown in Example 6-2. This  
sequence must be used even if the WDT is disabled. A  
CLRWDT instruction should be executed before  
switching the prescaler.  
6.2.1  
SWITCHING PRESCALER  
ASSIGNMENT  
The prescaler assignment is fully under software  
control (i.e., it can be changed “on-the-fly” during pro-  
gram execution). To avoid an unintended device Reset,  
the following instruction sequence (Example 6-1) must  
be executed when changing the prescaler assignment  
from Timer0 to the WDT.  
EXAMPLE 6-2:  
CHANGING PRESCALER  
(WDTTIMER0)  
CLRWDT  
;Clear WDT and  
;prescaler  
EXAMPLE 6-1:  
CHANGING PRESCALER  
(TIMER0 WDT)  
;Clear WDT  
;Clear TMR0 & Prescaler  
MOVLW ‘xxxx0xxx’ ;Select TMR0, new  
;prescale value and  
;clock source  
CLRWDT  
CLRF  
TMR0  
OPTION  
MOVLW ‘00xx1111’b;These 3 lines (5, 6, 7)  
OPTION  
;are required only if  
;desired  
CLRWDT  
;PS<2:0> are 000 or 001  
MOVLW ‘00xx1xxx’b;Set Postscaler to  
OPTION  
;desired WDT rate  
FIGURE 6-5:  
BLOCK DIAGRAM OF THE TIMER0/WDT PRESCALER  
TCY (= FOSC/4)  
Data Bus  
8
0
1
GP2/T0CKI(2)  
Pin  
M
U
X
1
0
M
U
X
Sync  
2
Cycles  
TMR0 Reg  
T0SE(1)  
T0CS(1)  
PSA(1)  
0
1
8-bit Prescaler  
M
U
X
8
Watchdog  
Timer  
PS<2:0>(1)  
8-to-1 MUX  
PSA(1)  
1
0
WDT Enable bit  
MUX  
PSA(1)  
WDT  
Time-Out  
Note 1: T0CS, T0SE, PSA, PS<2:0> are bits in the OPTION register.  
2: T0CKI is shared with pin GP2 on the PIC10F220/222.  
DS41270E-page 28  
© 2007 Microchip Technology Inc.  
PIC10F220/222  
7.0  
ANALOG-TO-DIGITAL (A/D)  
CONVERTER  
Note:  
The A/D Converter module consumes  
power when the ADON bit is set even  
when no channels are selected as analog  
inputs. For low-power applications, it is  
recommended that the ADON bit be  
cleared when the A/D Converter is not in  
use.  
The A/D converter allows conversion of an analog  
signal into an 8-bit digital signal.  
7.1  
Clock Divisors  
The A/D Converter has a single clock source setting,  
INTOSC/4. The A/D Converter requires 13 TAD periods  
to complete a conversion. The divisor values do not  
affect the number of TAD periods required to perform a  
conversion. The divisor values determine the length of  
the TAD period.  
7.5  
The GO/DONE bit  
The GO/DONE bit is used to determine the status of a  
conversion, to start a conversion and to manually halt a  
conversion in process. Setting the GO/DONE bit starts  
a conversion. When the conversion is complete, the A/  
D Converter module clears the GO/DONE bit. A con-  
version can be terminated by manually clearing the  
GO/DONE bit while a conversion is in process. Manual  
termination of a conversion may result in a partially  
converted result in ADRES.  
Note:  
Due to the fixed clock divisor, a conversion  
will complete in 13 CPU instruction cycles.  
7.2  
Voltage Reference  
Due to the nature of the design, there is no external  
voltage reference allowed for the A/D Converter.  
The A/D Converter reference voltage will always be  
VDD.  
The GO/DONE bit is cleared when the device enters  
Sleep, stopping the current conversion. The A/D Con-  
verter does not have a dedicated oscillator, it runs off of  
the system clock.  
7.3  
Analog Mode Selection  
The GO/DONE bit cannot be set when ADON is clear.  
The ANS<1:0> bits are used to configure pins for ana-  
log input. Upon any Reset ANS<1:0> defaults to 11.  
This configures pins AN0 and AN1 as analog inputs.  
Pins configured as analog inputs are not available for  
digital output. Users should not change the ANS bits  
while a conversion is in process. ANS bits are active  
regardless of the condition of ADON.  
7.6  
Sleep  
This A/D Converter does not have a dedicated A/D  
Converter clock and therefore no conversion in Sleep  
is possible. If a conversion is underway and a Sleep  
command is executed, the GO/DONE and ADON bit  
will be cleared. This will stop any conversion in process  
and power-down the A/D Converter module to con-  
serve power. Due to the nature of the conversion pro-  
cess, the ADRES may contain a partial conversion. At  
least 1 bit must have been converted prior to Sleep to  
have partial conversion data in ADRES. The CHS bits  
are reset to their default condition and CHS<1:0> = 11.  
7.4  
A/D Converter Channel Selection  
The CHS bits are used to select the analog channel to  
be sampled by the A/D Converter. The CHS bits  
should not be changed during a conversion. To  
acquire an analog signal, the CHS selection must  
match one of the pin(s) selected by the ANS bits. The  
Internal Absolute Voltage Reference can be selected  
regardless of the condition of the ANS bits. All channel  
selection information will be lost when the device  
enters Sleep.  
For accurate conversions, TAD must meet the following:  
• 500 ns < TAD < 50 μs  
TAD = 1/(FOSC/divisor)  
TABLE 7-1:  
EFFECTS OF SLEEP AND WAKE ON ADCON0  
ANS1  
ANS0  
CHS1  
CHS0  
GO/DONE  
ADON  
Prior to Sleep  
Prior to Sleep  
Entering Sleep  
Wake  
x
x
x
x
1
1
x
x
1
1
0
1
0
0
0
1
0
0
x
Unchanged  
1
x
Unchanged  
1
© 2007 Microchip Technology Inc.  
DS41270E-page 29  
PIC10F220/222  
7.7  
Analog Conversion Result  
Register  
7.8  
Internal Absolute Voltage  
Reference  
The ADRES register contains the results of the last  
conversion. These results are present during the sam-  
pling period of the next analog conversion process.  
After the sampling period is over, ADRES is cleared (=  
0). A ‘leading one’ is then right shifted into the ADRES  
to serve as an internal conversion complete bit. As  
each bit weight, starting with the MSb, is converted, the  
leading one is shifted right and the converted bit is  
stuffed into ADRES. After a total of 9 right shifts of the  
‘leading one’ have taken place, the conversion is com-  
plete; the ‘leading one’ has been shifted out and the  
GO/DONE bit is cleared.  
The function of the Internal Absolute Voltage Refer-  
ence is to provide a constant voltage for conversion  
across the devices VDD supply range. The A/D Con-  
verter is ratiometric with the conversion reference  
voltage being VDD. Converting a constant voltage of  
0.6V (typical) will result in a result based on the voltage  
applied to VDD of the device. The result of conversion  
of this reference across the VDD range can be  
approximated by: Conversion Result = 0.6V/(VDD/256)  
Note:  
The actual value of the Absolute Voltage  
Reference varies with temperature and  
part-to-part variation. The conversion is  
also susceptible to analog noise on the  
VDD pin and noise generated by the sink-  
ing or sourcing of current on the I/O pins.  
If the GO/DONE bit is cleared in software during a con-  
version, the conversion stops. The data in ADRES is  
the partial conversion result. This data is valid for the bit  
weights that have been converted. The position of the  
‘leading one’ determines the number of bits that have  
been converted. The bits that were not converted  
before the GO/DONE was cleared are unrecoverable.  
REGISTER 7-1:  
ADCON0: A/D CONVERTER 0 REGISTER  
R/W-1  
ANS1  
R/W-1  
ANS0  
U-0  
U-0  
R/W-1  
CHS1  
R/W-1  
CHS0  
R/W-0  
R/W-0  
ADON  
GO/DONE  
bit 7  
bit 0  
Legend:  
R = Readable bit  
-n = Value at POR  
W = Writable bit  
‘1’ = Bit is set  
U = Unimplemented bit, read as ‘0’  
‘0’ = Bit is cleared x = Bit is unknown  
bit 7  
bit 6  
ANS1: ADC Analog Input Pin Select bit  
1= GP1/AN1 configured for analog input  
0= GP1/AN1 configured as digital I/O  
(1), (2)  
ANS0: ADC Analog Input Pin Select bit  
1= GP0/AN0 configured as an analog input  
0= GP0/AN0 configured as digital I/O  
bit 5-4  
bit 3-2  
Unimplemented: Read as ‘0’  
(3)  
CHS<1:0>: ADC Channel Select bits  
00= Channel 00 (GP0/AN0)  
01= Channel 01 (GP1/AN1)  
1X= 0.6V absolute Voltage reference  
(4)  
bit 1  
bit 0  
GO/DONE: ADC Conversion Status bit  
1= ADC conversion in progress. Setting this bit starts an ADC conversion cycle. This bit is automatically cleared  
by hardware when the ADC is done converting.  
0= ADC conversion completed/not in progress. Manually clearing this bit while a conversion is in process  
terminates the current conversion.  
ADON: ADC Enable bit  
1= ADC module is operating  
0= ADC module is shut-off and consumes no power  
Note 1: When the ANS bits are set, the channel(s) selected are automatically forced into analog mode regardless of the pin  
function previously defined.  
2:  
The ANS<1:0> bits are active regardless of the condition of ADON  
3: CHS<1:0> bits default to 11after any Reset.  
4: If the ADON bit is clear, the GO/DONE bit cannot be set.  
DS41270E-page 30  
© 2007 Microchip Technology Inc.  
PIC10F220/222  
REGISTER 7-2:  
ADRES: ANALOG CONVERSION RESULT REGISTER  
R-X  
ADRES7  
bit 7  
R-X  
R-X  
R-X  
R-X  
R-X  
R-X  
R-X  
ADRES6  
ADRES5  
ADRES4  
ADRES3  
ADRES2  
ADRES1  
ADRES0  
bit 0  
Legend:  
R = Readable bit  
-n = Value at POR  
W = Writable bit  
‘1’ = Bit is set  
U = Unimplemented bit, read as ‘0’  
‘0’ = Bit is cleared x = Bit is unknown  
bit 7-0  
ADRES<7:0>  
© 2007 Microchip Technology Inc.  
DS41270E-page 31  
PIC10F220/222  
After the analog input channel is selected (or changed),  
an A/D acquisition must be done before the conversion  
can be started. To calculate the minimum acquisition  
time, Equation 7-1 may be used. This equation  
assumes that 1/2 LSb error is used (256 steps for the  
ADC). The 1/2 LSb error is the maximum error allowed  
for the ADC to meet its specified resolution.  
7.9  
A/D Acquisition Requirements  
For the ADC to meet its specified accuracy, the charge  
holding capacitor (CHOLD) must be allowed to fully  
charge to the input channel voltage level. The Analog  
Input model is shown in Figure 7-1. The source  
impedance (RS) and the internal sampling switch (RSS)  
impedance directly affect the time required to charge the  
capacitor CHOLD. The sampling switch (RSS) impedance  
varies over the device voltage (VDD), see Figure 7-1.  
The maximum recommended impedance for analog  
sources is 10 kΩ. As the source impedance is  
decreased, the acquisition time may be decreased.  
EQUATION 7-1:  
ACQUISITION TIME EXAMPLE  
Assumptions:  
Temperature = 50°C and external impedance of 10 kΩ 5.0V VDD  
Tacq  
=
=
=
Amplifier Settling Time + Hold Capacitor Charging Time + Temperature Coefficient  
TAMP + TC + TCOFF  
2 μs + TC + [(Temperature - 25°C)(0.05 μs/°C)]  
Solving for Tc:  
Therefore:  
Tc  
=
=
=
CHOLD (RIC + RSS + RS) In(1/512)  
-25pF (l kΩ + 7 kΩ + 10 kΩ ) In(0.00196)  
2.81 μs  
Tacq  
=
=
2 μs + 2.81 μs + [(50°C-25°C)(0.0 5μs/°C)]  
6.06 μs  
Note 1: The charge holding capacitor (CHOLD) is not discharged after each conversion.  
2: The maximum recommended impedance for analog sources is 10 kΩ. This is required to meet the pin  
leakage specification.  
FIGURE 7-1:  
ANALOG INPUT MODULE  
VDD  
Sampling  
Switch  
VT = 0.6V  
ANx  
SS  
RIC 1k  
Rss  
Rs  
CPIN  
5 pF  
VA  
I LEAKAGE  
± 500 nA  
CHOLD = 25 pF  
VSS/VREF-  
VT = 0.6V  
6V  
5V  
RSS  
Legend:  
CPIN  
VT  
ILEAKAGE  
= Input Capacitance  
= Threshold Voltage  
= Leakage current at the pin due  
to various junctions  
VDD 4V  
3V  
2V  
RIC  
SS  
CHOLD  
= Interconnect Resistance  
= Sampling Switch  
= Sample/Hold Capacitance  
5 6 7 8 9 1011  
Sampling Switch  
(kΩ)  
DS41270E-page 32  
© 2007 Microchip Technology Inc.  
PIC10F220/222  
The PIC10F220/222 devices have a Watchdog Timer,  
which can be shut off only through Configuration bit  
WDTE. It runs off of its own RC oscillator for added reli-  
ability. When using DRT, there is an 1.125 ms (typical)  
delay only on VDD power-up. With this timer on-chip,  
most applications need no external Reset circuitry.  
8.0  
SPECIAL FEATURES OF THE  
CPU  
What sets a microcontroller apart from other proces-  
sors are special circuits that deal with the needs of real-  
time applications. The PIC10F220/222 microcontrol-  
lers have a host of such features intended to maximize  
system reliability, minimize cost through elimination of  
external components, provide power-saving operating  
modes and offer code protection. These features are:  
The Sleep mode is designed to offer a very low current  
Power-Down mode. The user can wake-up from Sleep  
through a change on input pins or through a Watchdog  
Timer time-out.  
• Reset:  
8.1  
Configuration Bits  
- Power-on Reset (POR)  
- Device Reset Timer (DRT)  
- Watchdog Timer (WDT)  
- Wake-up from Sleep on pin change  
• Sleep  
The PIC10F220/222 Configuration Words consist of 12  
bits. Configuration bits can be programmed to select  
various device configurations. One bit is the Watchdog  
Timer enable bit, one bit is the MCLR enable bit and  
one bit is for code protection (see Register 8-1).  
• Code Protection  
• ID Locations  
• In-Circuit Serial Programming™  
• Clock Out  
REGISTER 8-1:  
CONFIG: CONFIGURATION WORD(1)  
MCLRE  
CP  
WDTE MCPU IOSCFS  
bit 0  
bit 11  
Legend:  
R = Readable bit  
-n = Value at POR  
W = Writable bit  
‘1’ = Bit is set  
U = Unimplemented bit, read as ‘0’  
‘0’ = Bit is cleared x = Bit is unknown  
bit 11-5 Unimplemented: Read as ‘0’  
bit 4  
bit 3  
bit 2  
bit 1  
MCLRE: GP3/MCLR Pin Function Select bit  
1= GP3/MCLR pin function is MCLR  
0= GP3/MCLR pin function is digital I/O, MCLR internally tied to VDD  
CP: Code Protection bit  
1= Code protection off  
0= Code protection on  
WDTE: Watchdog Timer Enable bit  
1= WDT enabled  
0= WDT disabled  
MCPU: Master Clear Pull-up Enable bit(2)  
1= Pull-up disabled  
0= Pull-up enabled  
bit 0  
IOSCFS: Internal Oscillator Frequency Select bit  
1= 8 MHz  
0= 4 MHz  
Note 1: Refer to the “PIC10F220/222 Memory Programming Specification” (DS41266), to determine how to  
access the Configuration Word. The Configuration Word is not user addressable during device operation.  
2: MCLRE must be a ‘1’ to enable this selection.  
© 2007 Microchip Technology Inc.  
DS41270E-page 33  
PIC10F220/222  
8.2  
Oscillator Configurations  
8.3  
Reset  
The device differentiates between various kinds of  
Reset:  
8.2.1  
OSCILLATOR TYPES  
The PIC10F220/222 devices are offered with internal  
oscillator mode only.  
• Power-on Reset (POR)  
• MCLR Reset during normal operation  
• MCLR Reset during Sleep  
• INTOSC: Internal 4/8 MHz Oscillator  
• WDT Time-out Reset during normal operation  
• WDT Time-out Reset during Sleep  
• Wake-up from Sleep on pin change  
8.2.2  
INTERNAL 4/8 MHz OSCILLATOR  
The internal oscillator provides a 4/8 MHz (nominal)  
system clock (see Section 10.0 “Electrical Charac-  
teristics” for information on variation over voltage and  
temperature).  
Some registers are not reset in any way, they are  
unknown on POR and unchanged in any other Reset.  
Most other registers are reset to “Reset state” on  
Power-on Reset (POR), MCLR, WDT or Wake-up on  
pin change Reset during normal operation. They are  
not affected by a WDT Reset during Sleep or MCLR  
Reset during Sleep, since these Resets are viewed as  
resumption of normal operation. The exceptions to this  
are TO, PD and GPWUF bits. They are set or cleared  
differently in different Reset situations. These bits are  
used in software to determine the nature of Reset. See  
Table 8-1 for a full description of Reset states of all  
registers.  
In addition, a calibration instruction is programmed into  
the last address of memory, which contains the calibra-  
tion value for the internal oscillator. This location is  
always uncode protected, regardless of the code-pro-  
tect settings. This value is programmed as a MOVLW XX  
instruction where XX is the calibration value and is  
placed at the Reset vector. This will load the W register  
with the calibration value upon Reset and the PC will  
then roll over to the users program at address 0x000.  
The user then has the option of writing the value to the  
OSCCAL Register (05h) or ignoring it.  
OSCCAL, when written to with the calibration value, will  
“trim” the internal oscillator to remove process variation  
from the oscillator frequency.  
Note:  
Erasing the device will also erase the pre-  
programmed internal calibration value for  
the internal oscillator. The calibration  
value must be read prior to erasing the  
part so it can be reprogrammed correctly  
later.  
TABLE 8-1:  
RESET CONDITIONS FOR REGISTERS – PIC10F220/222  
Register  
Address  
Power-on Reset  
MCLR Reset, WDT Time-out, Wake-up On Pin Change,  
(1)  
(1)  
W
qqqq qqqu  
qqqq qqqu  
INDF  
TMR0  
PC  
00h  
01h  
02h  
xxxx xxxx  
xxxx xxxx  
1111 1111  
uuuu uuuu  
uuuu uuuu  
1111 1111  
STATUS  
FSR  
03h  
04h  
05h  
06h  
07h  
08h  
0--1 1xxx  
111x xxxx  
1111 1110  
---- xxxx  
11-- 1100  
xxxx xxxx  
1111 1111  
---- 1111  
q00q quuu  
111u uuuu  
uuuu uuuu  
---- uuuu  
11-- 1100  
uuuu uuuu  
1111 1111  
---- 1111  
OSCCAL  
GPIO  
ADCON0  
ADRES  
OPTION  
TRIS  
Legend:  
u= unchanged, x= unknown, – = unimplemented bit, read as ‘0’, q= value depends on condition.  
Note 1: Bits <7:2> of W register contain oscillator calibration values due to MOVLW XXinstruction at top of memory.  
DS41270E-page 34  
© 2007 Microchip Technology Inc.  
PIC10F220/222  
TABLE 8-2:  
RESET CONDITION FOR SPECIAL REGISTERS  
STATUS Addr: 03h  
PCL Addr: 02h  
1111 1111  
1111 1111  
Power-on Reset  
0--1 1xxx  
MCLR Reset during normal operation  
0--u uuuu  
MCLR Reset during Sleep  
0--1 0uuu  
0--0 0uuu  
0--0 uuuu  
1--1 0uuu  
1111 1111  
1111 1111  
1111 1111  
1111 1111  
WDT Reset during Sleep  
WDT Reset normal operation  
Wake-up from Sleep on pin change  
Legend: u= unchanged, x= unknown, – = unimplemented bit, read as ‘0’.  
The Power-on Reset circuit and the Device Reset  
Timer (see Section 8.5 “Device Reset Timer (DRT)”)  
circuit are closely related. On power-up, the Reset latch  
is set and the DRT is reset. The DRT timer begins  
counting once it detects MCLR to be high. After the  
time-out period, which is typically 1.125 ms, it will reset  
the Reset latch and thus end the on-chip Reset signal.  
8.3.1  
MCLR ENABLE  
This Configuration bit, when unprogrammed (left in the  
1’ state), enables the external MCLR function. When  
programmed, the MCLR function is tied to the internal  
VDD and the pin is assigned to be a I/O. See Figure 8-1.  
FIGURE 8-1:  
MCLR SELECT  
A power-up example where MCLR is held low is shown  
in Figure 8-3. VDD is allowed to rise and stabilize before  
bringing MCLR high. The chip will actually come out of  
Reset TDRT msec after MCLR goes high.  
GPWU  
Weak Pull-up  
In Figure 8-4, the on-chip Power-on Reset feature is  
being used (MCLR and VDD are tied together or the pin  
is programmed to be GP3). The VDD is stable before  
the Start-up timer times out and there is no problem in  
getting a proper Reset. However, Figure 8-5 depicts a  
problem situation where VDD rises too slowly. The time  
between when the DRT senses that MCLR is high and  
when MCLR and VDD actually reach their full value, is  
too long. In this situation, when the start-up timer times  
out, VDD has not reached the VDD (min) value and the  
chip may not function correctly. For such situations, we  
recommend that external RC circuits be used to  
achieve longer POR delay times (Figure 8-4).  
GP3/MCLR/VPP  
Internal MCLR  
MCLRE  
8.4  
Power-on Reset (POR)  
The PIC10F220/222 devices incorporate an on-chip  
Power-on Reset (POR) circuitry, which provides an  
internal chip Reset for most power-up situations.  
The on-chip POR circuit holds the chip in Reset until  
VDD has reached a high enough level for proper oper-  
ation. To take advantage of the internal POR, program  
the GP3/MCLR/VPP pin as MCLR and tie through a  
resistor to VDD, or program the pin as GP3. An internal  
weak pull-up resistor is implemented using a transistor  
(refer to Table 10-1 for the pull-up resistor ranges). This  
will eliminate external RC components usually needed  
to create a Power-on Reset.  
Note:  
When the devices start normal operation  
(exit the Reset condition), device operat-  
ing parameters (voltage, frequency, tem-  
perature, etc.) must be met to ensure  
proper operation. If these conditions are  
not met, the device must be held in Reset  
until the operating conditions are met.  
When the devices start normal operation (exit the  
Reset condition), device operating parameters (volt-  
age, frequency, temperature,...) must be met to ensure  
operation. If these conditions are not met, the devices  
must be held in Reset until the operating parameters  
are met.  
For additional information on design considerations  
related to the use of PIC10F220/222 devices with their  
short device Reset timer, refer to Application Notes  
AN522, “Power-Up Considerations” (DS00522) and  
AN607, “Power-up Trouble Shooting” (DS00607).  
A simplified block diagram of the on-chip Power-on  
Reset circuit is shown in Figure 8-2.  
© 2007 Microchip Technology Inc.  
DS41270E-page 35  
PIC10F220/222  
FIGURE 8-2:  
SIMPLIFIED BLOCK DIAGRAM OF ON-CHIP RESET CIRCUIT  
VDD  
Power-up  
Detect  
POR (Power-on  
Reset)  
GP3/MCLR/VPP  
MCLR Reset  
S
R
Q
Q
MCLRE  
WDT Reset  
WDT Time-out  
Start-up Timer  
1.125 ms  
CHIP Reset  
Pin Change  
Sleep  
Wake-up on pin Change Reset  
FIGURE 8-3:  
TIME-OUT SEQUENCE ON POWER-UP (MCLR PULLED LOW)  
VDD  
MCLR  
Internal POR  
TDRT  
DRT Time-out  
Internal Reset  
FIGURE 8-4:  
TIME-OUT SEQUENCE ON POWER-UP (MCLR TIED TO VDD): FAST VDD RISE  
TIME  
VDD  
MCLR  
Internal POR  
TDRT  
DRT Time-out  
Internal Reset  
DS41270E-page 36  
© 2007 Microchip Technology Inc.  
PIC10F220/222  
FIGURE 8-5:  
TIME-OUT SEQUENCE ON POWER-UP (MCLR TIED TO VDD): SLOW VDD RISE  
TIME  
V1  
VDD  
MCLR  
Internal POR  
TDRT  
DRT Time-out  
Internal Reset  
Note:  
When VDD rises slowly, the TDRT time-out expires long before VDD has reached its final  
value. In this example, the chip will reset properly if, and only if, V1 VDD min.  
© 2007 Microchip Technology Inc.  
DS41270E-page 37  
PIC10F220/222  
8.6.1  
WDT PERIOD  
8.5  
Device Reset Timer (DRT)  
The WDT has a nominal time-out period of 18 ms, (with  
no prescaler). If a longer time-out period is desired, a  
prescaler with a division ratio of up to 1:128 can be  
assigned to the WDT (under software control) by writ-  
ing to the OPTION register. Thus, a time-out period of  
a nominal 2.3 seconds can be realized. These periods  
vary with temperature, VDD and part-to-part process  
variations (see DC specs).  
On the PIC10F220/222 devices, the DRT runs any time  
the device is powered up.  
The DRT operates on an internal oscillator. The pro-  
cessor is kept in Reset as long as the DRT is active.  
The DRT delay allows VDD to rise above VDD min. and  
for the oscillator to stabilize.  
The on-chip DRT keeps the devices in a Reset condi-  
tion for approximately 1.125 ms after MCLR has  
reached a logic high (VIH MCLR) level. Programming  
GP3/MCLR/VPP as MCLR and using an external RC  
network connected to the MCLR input is not required in  
most cases. This allows savings in cost-sensitive and/  
or space restricted applications, as well as allowing the  
use of the GP3/MCLR/VPP pin as a general purpose  
input.  
Under worst-case conditions (VDD = Min., Temperature  
= Max., max. WDT prescaler), it may take several  
seconds before a WDT time-out occurs.  
8.6.2  
WDT PROGRAMMING  
CONSIDERATIONS  
The CLRWDT instruction clears the WDT and the  
postscaler, if assigned to the WDT, and prevents it from  
timing out and generating a device Reset.  
The Device Reset Time delays will vary from chip-to-  
chip due to VDD, temperature and process variation.  
See AC parameters for details.  
The SLEEP instruction resets the WDT and the  
postscaler, if assigned to the WDT. This gives the  
maximum Sleep time before a WDT wake-up Reset.  
Reset sources are POR, MCLR, WDT time-out and  
wake-up on pin change. See Section 8.9.2 “Wake-up  
from Sleep”, Notes 1, 2 and 3.  
TABLE 8-3:  
DRT (DEVICE RESET TIMER  
PERIOD)  
POR Reset  
Subsequent Resets  
1.125 ms (typical)  
10 μs (typical)  
8.6  
Watchdog Timer (WDT)  
The Watchdog Timer (WDT) is a free running on-chip  
RC oscillator, which does not require any external  
components. This RC oscillator is separate from the  
internal 4/8 MHz oscillator. This means that the WDT  
will run even if the main processor clock has been  
stopped, for example, by execution of a SLEEPinstruc-  
tion. During normal operation or Sleep, a WDT Reset or  
wake-up Reset, generates a device Reset.  
The TO bit (STATUS<4>) will be cleared upon a  
Watchdog Timer Reset.  
The WDT can be permanently disabled by program-  
ming the configuration WDTE as a ‘0’ (see Section 8.1  
“Configuration Bits”). Refer to the PIC10F220/222  
Programming Specification to determine how to access  
the Configuration Word.  
DS41270E-page 38  
© 2007 Microchip Technology Inc.  
PIC10F220/222  
FIGURE 8-6:  
WATCHDOG TIMER BLOCK DIAGRAM  
From Timer0 Clock Source  
(Figure 6-5)  
0
M
U
X
Postscaler  
8-to-1 MUX  
1
Watchdog  
Timer  
3
PS<2:0>  
PSA  
WDT Enable  
Configuration  
(Figure 6-4)  
To Timer0  
PSA  
Bit  
0
1
MUX  
WDT Time-out  
Note 1: T0CS, T0SE, PSA, PS<2:0> are bits in the OPTION register.  
TABLE 8-4:  
Address  
SUMMARY OF REGISTERS ASSOCIATED WITH THE WATCHDOG TIMER  
Value on  
Value on  
All Other  
Resets  
Name  
Bit 7  
Bit 6  
Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Power-On  
Reset  
N/A  
OPTION  
GPWU GPPU T0CS T0SE PSA PS2 PS1 PS0 1111 1111 1111 1111  
Legend: Shaded boxes = Not used by Watchdog Timer, – = unimplemented, read as ‘0’, u= unchanged.  
8.7  
Time-out Sequence, Power-down  
and Wake-up from Sleep Status  
Bits (TO/PD/GPWUF/CWUF)  
The TO, PD and GPWUF bits in the STATUS register  
can be tested to determine if a Reset condition has  
been caused by a Power-up condition, a MCLR,  
Watchdog Timer (WDT) Reset or wake-up on pin  
change.  
TABLE 8-5:  
GPWUF  
TO/PD/GPWUF STATUS AFTER RESET  
TO  
PD  
Reset Caused By  
WDT wake-up from Sleep  
0
0
0
0
0
u
WDT time-out (not from Sleep)  
0
0
1
1
0
1
MCLR wake-up from Sleep  
Power-up  
0
1
u
1
u
0
MCLR not during Sleep  
Wake-up from Sleep on pin change  
Legend: u= unchanged, x= unknown, – = unimplemented bit, read as ‘0’, q= value depends on condition.  
Note 1: The TO, PD and GPWUF bits maintain their status (u) until a Reset occurs. A low-pulse on the MCLR  
input does not change the TO, PD or GPWUF Status bits.  
© 2007 Microchip Technology Inc.  
DS41270E-page 39  
PIC10F220/222  
FIGURE 8-9:  
BROWN-OUT  
8.8  
Reset on Brown-out  
PROTECTION CIRCUIT 3  
A Brown-out is a condition where device power (VDD)  
dips below its minimum value, but not to zero, and then  
recovers. The device should be reset in the event of a  
Brown-out.  
VDD  
MCP809  
VDD  
Bypass  
Capacitor  
VSS  
VDD  
To reset PIC10F220/222 devices when a Brown-out  
occurs, external Brown-out protection circuits may be  
built, as shown in Figure 8-7 and Figure 8-8.  
RST  
(2)  
MCLR  
PIC10F22X  
FIGURE 8-7:  
BROWN-OUT  
PROTECTION CIRCUIT 1  
Note 1: This Brown-out Protection circuit employs  
Microchip Technology’s MCP809 micro-  
controller supervisor. There are 7 different  
trip point selections to accommodate 5V to  
3V systems.  
VDD  
VDD  
33k  
2: Pin must be configured as MCLR.  
PIC10F22X  
Q1  
(2)  
MCLR  
10k  
(1)  
8.9  
Power-down Mode (Sleep)  
40k  
A device may be powered down (Sleep) and later  
powered up (wake-up from Sleep).  
Note 1: This circuit will activate Reset when VDD goes  
below Vz + 0.7V (where Vz = Zener voltage).  
2: Pin must be configured as MCLR.  
8.9.1  
SLEEP  
The Power-Down mode is entered by executing a  
SLEEPinstruction.  
If enabled, the Watchdog Timer will be cleared but  
keeps running, the TO bit (STATUS<4>) is set, the PD  
bit (STATUS<3>) is cleared and the oscillator driver is  
turned off. The I/O ports maintain the status they had  
before the SLEEP instruction was executed (driving  
high, driving low or high-impedance).  
FIGURE 8-8:  
BROWN-OUT  
PROTECTION CIRCUIT 2  
VDD  
VDD  
R1  
R2  
Note:  
A Reset generated by a WDT time-out  
does not drive the MCLR pin low.  
PIC10F22X  
Q1  
(2)  
MCLR  
For lowest current consumption while powered down,  
the T0CKI input should be at VDD or VSS and the GP3/  
MCLR/VPP pin must be at a logic high level if MCLR is  
enabled.  
(1)  
40k  
Note 1: This brown-out circuit is less expensive,  
although less accurate. Transistor Q1 turns  
off when VDD is below a certain level such  
that:  
R1  
= 0.7V  
VDD •  
R1 + R2  
2: Pin must be configured as MCLR.  
DS41270E-page 40  
© 2007 Microchip Technology Inc.  
PIC10F220/222  
8.9.2  
WAKE-UP FROM SLEEP  
8.12 In-Circuit Serial Programming™  
The device can wake-up from Sleep through one of the  
following events:  
The PIC10F220/222 microcontrollers can be serially  
programmed while in the end application circuit. This is  
simply done with two lines for clock and data, and three  
other lines for power, ground and the programming  
voltage. This allows customers to manufacture boards  
with unprogrammed devices and then program the  
microcontroller just before shipping the product. This  
also allows the most recent firmware, or a custom  
firmware, to be programmed.  
1. An external Reset input on GP3/MCLR/VPP pin,  
when configured as MCLR.  
2. A Watchdog Timer Time-out Reset (if WDT was  
enabled).  
3. A change on input pin GP0, GP1 or GP3 when  
wake-up on change is enabled.  
These events cause a device Reset. The TO, PD  
GPWUF bits can be used to determine the cause of a  
device Reset. The TO bit is cleared if a WDT time-out  
occurred (and caused wake-up). The PD bit, which is  
set on power-up, is cleared when SLEEP is invoked.  
The GPWUF bit indicates a change in state while in  
Sleep at pins GP0, GP1 or GP3 (since the last file or bit  
operation on GP port).  
The devices are placed into a Program/Verify mode by  
holding the GP1 and GP0 pins low while raising the  
MCLR (VPP) pin from VIL to VIHH (see programming  
specification). GP1 becomes the programming clock  
and GP0 becomes the programming data. Both GP1  
and GP0 are Schmitt Trigger inputs in this mode.  
After Reset, a 6-bit command is then supplied to the  
device. Depending on the command, 16 bits of program  
data are then supplied to or from the device, depending  
if the command was a Load or a Read. For complete  
details of serial programming, please refer to the  
PIC10F220/222 Programming Specifications.  
Caution: Right before entering Sleep, read the  
input pins. When in Sleep, wake up  
occurs when the values at the pins  
change from the state they were in at the  
last reading. If a wake-up on change  
occurs and the pins are not read before  
re-entering Sleep, a wake-up will occur  
immediately even if no pins change  
while in Sleep mode.  
A typical In-Circuit Serial Programming connection is  
shown in Figure 8-10.  
FIGURE 8-10:  
TYPICAL IN-CIRCUIT  
SERIAL  
PROGRAMMING™  
CONNECTION  
Note:  
The WDT is cleared when the device  
wakes from Sleep, regardless of the wake-  
up source.  
To Normal  
Connections  
External  
Connector  
Signals  
PIC10F22X  
8.10 Program Verification/Code  
Protection  
+5V  
0V  
VDD  
If the Code Protection bit has not been programmed,  
the on-chip program memory can be read out for  
verification purposes.  
VSS  
VPP  
MCLR/VPP  
GP1  
GP0  
CLK  
The first 64 locations and the last location (Reset  
Vector) can be read, regardless of the code protection  
bit setting.  
Data I/O  
VDD  
8.11 ID Locations  
Four memory locations are designated as ID locations  
where the user can store checksum or other code  
identification numbers. These locations are not  
accessible during normal execution, but are readable  
and writable during program/verify.  
To Normal  
Connections  
Use only the lower 4 bits of the ID locations and always  
program the upper 8 bits as ‘1’s.  
© 2007 Microchip Technology Inc.  
DS41270E-page 41  
PIC10F220/222  
NOTES:  
DS41270E-page 42  
© 2007 Microchip Technology Inc.  
PIC10F220/222  
All instructions are executed within a single instruction  
cycle, unless a conditional test is true or the program  
counter is changed as a result of an instruction. In this  
case, the execution takes two instruction cycles. One  
instruction cycle consists of four oscillator periods.  
Thus, for an oscillator frequency of 4 MHz, the normal  
instruction execution time is 1 μs. If a conditional test is  
true or the program counter is changed as a result of an  
instruction, the instruction execution time is 2 μs.  
9.0  
INSTRUCTION SET SUMMARY  
The PIC16 instruction set is highly orthogonal and is  
comprised of three basic categories.  
Byte-oriented operations  
Bit-oriented operations  
Literal and control operations  
Each PIC16 instruction is a 12-bit word divided into an  
opcode, which specifies the instruction type, and one  
or more operands which further specify the operation  
of the instruction. The formats for each of the catego-  
ries is presented in Figure 9-1, while the various  
opcode fields are summarized in Table 9-1.  
Figure 9-1 shows the three general formats that the  
instructions can have. All examples in the figure use  
the following format to represent a hexadecimal  
number:  
‘0xhhh’  
For byte-oriented instructions, ‘f’ represents a file reg-  
ister designator and ‘d’ represents a destination desig-  
nator. The file register designator specifies which file  
register is to be used by the instruction.  
where ‘h’ signifies a hexadecimal digit.  
FIGURE 9-1:  
GENERAL FORMAT FOR  
INSTRUCTIONS  
The destination designator specifies where the result of  
the operation is to be placed. If ‘d’ is ‘0’, the result is  
placed in the W register. If ‘d’ is ‘1’, the result is placed  
in the file register specified in the instruction.  
Byte-oriented file register operations  
11  
6
5
d
4
0
OPCODE  
f (FILE #)  
For bit-oriented instructions, ‘b’ represents a bit field  
designator which selects the number of the bit affected  
by the operation, while ‘f’ represents the number of the  
file in which the bit is located.  
d = 0for destination W  
d = 1for destination f  
f = 5-bit file register address  
Bit-oriented file register operations  
11 8 7  
b (BIT #)  
For literal and control operations, ‘k’ represents an  
8 or 9-bit constant or literal value.  
5
4
0
OPCODE  
f (FILE #)  
b = 3-bit address  
f = 5-bit file register address  
TABLE 9-1:  
OPCODE FIELD  
DESCRIPTIONS  
Literal and control operations (except GOTO)  
11  
Field  
Description  
f
W
b
Register file address (0x00 to 0x7F)  
Working register (accumulator)  
8
7
0
OPCODE  
k (literal)  
Bit address within an 8-bit file register  
Literal field, constant data or label  
k = 8-bit immediate value  
k
x
Don’t care location (= 0or 1)  
Literal and control operations GOTOinstruction  
11  
The assembler will generate code with x = 0. It is the  
recommended form of use for compatibility with all  
Microchip software tools.  
9
8
0
OPCODE  
k (literal)  
d
Destination select;  
d= 0(store result in W)  
d= 1(store result in file register ‘f’)  
Default is d= 1  
k = 9-bit immediate value  
label  
TOS  
PC  
Label name  
Top-of-Stack  
Program Counter  
Watchdog Timer counter  
Time-out bit  
WDT  
TO  
PD  
Power-down bit  
dest  
Destination, either the W register or the specified  
register file location  
[
(
]
)
Options  
Contents  
Assigned to  
< >  
Register bit field  
In the set of  
italics  
User defined term (font is courier)  
© 2007 Microchip Technology Inc.  
DS41270E-page 43  
PIC10F220/222  
TABLE 9-2:  
INSTRUCTION SET SUMMARY  
Description  
12-Bit Opcode  
MSb LSb  
Mnemonic,  
Operands  
Status  
Affected  
Cycles  
Notes  
ADDWF  
ANDWF  
CLRF  
CLRW  
COMF  
DECF  
DECFSZ  
INCF  
INCFSZ  
IORWF  
MOVF  
MOVWF  
NOP  
f, d  
f, d  
f
Add W and f  
AND W with f  
Clear f  
Clear W  
Complement f  
Decrement f  
Decrement f, Skip if 0  
Increment f  
Increment f, Skip if 0  
Inclusive OR W with f  
Move f  
Move W to f  
No Operation  
Rotate left f through Carry  
Rotate right f through Carry  
Subtract W from f  
Swap f  
1
1
1
1
1
0001 11df ffff C,DC,Z  
1,2,4  
2,4  
4
0001 01df ffff  
0000 011f ffff  
0000 0100 0000  
0010 01df ffff  
0000 11df ffff  
0010 11df ffff  
0010 10df ffff  
0011 11df ffff  
0001 00df ffff  
0010 00df ffff  
0000 001f ffff  
0000 0000 0000  
0011 01df ffff  
0011 00df ffff  
Z
Z
Z
Z
Z
None  
Z
None  
Z
f, d  
f, d  
f, d  
f, d  
f, d  
f, d  
f, d  
f
1
2,4  
2,4  
2,4  
2,4  
2,4  
2,4  
1,4  
1(2)  
1
1(2)  
1
1
1
1
1
1
1
1
1
Z
None  
None  
C
RLF  
RRF  
SUBWF  
SWAPF  
XORWF  
f, d  
f, d  
f, d  
f, d  
f, d  
2,4  
2,4  
1,2,4  
2,4  
C
0000 10df ffff C,DC,Z  
0011 10df ffff  
0001 10df ffff  
None  
Z
Exclusive OR W with f  
2,4  
BIT-ORIENTED FILE REGISTER OPERATIONS  
BCF  
BSF  
BTFSC  
BTFSS  
f, b  
f, b  
f, b  
f, b  
Bit Clear f  
Bit Set f  
Bit Test f, Skip if Clear  
Bit Test f, Skip if Set  
1
1
0100 bbbf ffff  
None  
None  
None  
None  
2,4  
2,4  
0101 bbbf ffff  
0110 bbbf ffff  
0111 bbbf ffff  
1(2)  
1(2)  
LITERAL AND CONTROL OPERATIONS  
ANDLW  
CALL  
CLRWDT  
GOTO  
IORLW  
MOVLW  
OPTION  
RETLW  
SLEEP  
TRIS  
k
k
k
k
k
k
k
f
AND literal with W  
Call subroutine  
1
2
1
2
1
1
1
2
1
1
1
1110 kkkk kkkk  
1001 kkkk kkkk  
0000 0000 0100 TO, PD  
101k kkkk kkkk  
1101 kkkk kkkk  
1100 kkkk kkkk  
0000 0000 0010  
1000 kkkk kkkk  
Z
None  
1
Clear Watchdog Timer  
Unconditional branch  
Inclusive OR Literal with W  
Move Literal to W  
Load OPTION register  
Return, place Literal in W  
Go into standby mode  
Load TRIS register  
None  
Z
None  
None  
None  
0000 0000 0011 TO, PD  
0000 0000 0fff  
1111 kkkk kkkk  
None  
Z
3
XORLW  
k
Exclusive OR Literal to W  
Note 1: The 9th bit of the program counter will be forced to a ‘0’ by any instruction that writes to the PC except for  
GOTO. See Section 4.7 “Program Counter”.  
2: When an I/O register is modified as a function of itself (e.g., MOVF PORTB, 1), the value used will be that  
value present on the pins themselves. For example, if the data latch is ‘1’ for a pin configured as input and  
is driven low by an external device, the data will be written back with a ‘0’.  
3: The instruction TRIS f, where f = 6 causes the contents of the W register to be written to the tri-state  
latches of PORTB. A ‘1’ forces the pin to a high-impedance state and disables the output buffers.  
4: If this instruction is executed on the TMR0 register (and, where applicable, d = 1), the prescaler will be  
cleared (if assigned to TMR0).  
DS41270E-page 44  
© 2007 Microchip Technology Inc.  
PIC10F220/222  
9.1  
Instruction Description  
ADDWF  
Add W and f  
BCF  
Bit Clear f  
Syntax:  
[ label ] ADDWF f,d  
Syntax:  
[ label ] BCF f,b  
Operands:  
0 f 31  
d ∈ [0,1]  
Operands:  
0 f 31  
0 b 7  
Operation:  
(W) + (f) (destination)  
Operation:  
0 (f<b>)  
Status Affected: C, DC, Z  
Status Affected: None  
Description:  
Add the contents of the W register  
Description:  
Bit ‘b’ in register ‘f’ is cleared.  
and register ‘f’. If ‘d’ is ‘0’, the result  
is stored in the W register. If ‘d’ is  
1’, the result is stored back in  
register ‘f’.  
ANDLW  
AND literal with W  
BSF  
Bit Set f  
Syntax:  
Operands:  
[ label ] ANDLW  
0 k 255  
k
Syntax:  
[ label ] BSF f,b  
Operands:  
0 f 31  
0 b 7  
Operation:  
(W).AND. (k) (W)  
Operation:  
1 (f<b>)  
Status Affected:  
Description:  
Z
Status Affected: None  
The contents of the W register are  
AND’ed with the eight-bit literal ‘k’.  
The result is placed in the W  
register.  
Description: Bit ‘b’ in register ‘f’ is set.  
BTFSC  
Bit Test f, Skip if Clear  
ANDWF  
AND W with f  
Syntax:  
[ label ] BTFSC f,b  
Syntax:  
[ label ] ANDWF f,d  
Operands:  
0 f 31  
0 b 7  
Operands:  
0 f 31  
d [0,1]  
Operation:  
skip if (f<b>) = 0  
Operation:  
(W) AND (f) (destination)  
Status Affected: None  
Status Affected: Z  
Description: If bit ‘b’ in register ‘f’ is ‘0’, then the  
Description: The contents of the W register are  
next instruction is skipped.  
AND’ed with register ‘f’. If ‘d’ is ‘0’,  
the result is stored in the W register.  
If ‘d’ is ‘1’, the result is stored back  
in register ‘f’.  
If bit ‘b’ is ‘0’, then the next instruc-  
tion fetched during the current  
instruction execution is discarded,  
and a NOPis executed instead,  
making this a two-cycle instruction.  
© 2007 Microchip Technology Inc.  
DS41270E-page 45  
PIC10F220/222  
CLRW  
Clear W  
BTFSS  
Bit Test f, Skip if Set  
Syntax:  
[ label ] CLRW  
None  
Syntax:  
[ label ] BTFSS f,b  
Operands:  
Operation:  
Operands:  
0 f 31  
0 b < 7  
00h (W);  
1 Z  
Operation:  
skip if (f<b>) = 1  
Status Affected:  
Description:  
Z
Status Affected: None  
The W register is cleared. Zero bit  
(Z) is set.  
Description:  
If bit ‘b’ in register ‘f’ is ‘1’, then the  
next instruction is skipped.  
If bit ‘b’ is ‘1’, then the next instruc-  
tion fetched during the current  
instruction execution, is discarded  
and a NOPis executed instead,  
making this a two-cycle instruction.  
CLRWDT  
Syntax:  
Clear Watchdog Timer  
[ label ] CLRWDT k  
None  
CALL  
Subroutine Call  
Syntax:  
[ label ] CALL  
0 k 255  
k
Operands:  
Operation:  
Operands:  
Operation:  
00h WDT;  
0 WDT prescaler (if assigned);  
(PC) + 1Top of Stack;  
k PC<7:0>;  
1 TO;  
1 PD  
(Status<6:5>) PC<10:9>;  
0 PC<8>  
Status Affected: TO, PD  
Status Affected: None  
Description:  
The CLRWDTinstruction resets the  
Description:  
Subroutine call. First, return  
WDT. It also resets the prescaler, if  
the prescaler is assigned to the  
WDT and not Timer0. Status bits  
TO and PD are set.  
address (PC + 1) is pushed onto  
the stack. The eight-bit immediate  
address is loaded into PC bits  
<7:0>. The upper bits PC<10:9>  
are loaded from STATUS<6:5>,  
PC<8> is cleared. CALLis a two-  
cycle instruction.  
CLRF  
Clear f  
COMF  
Complement f  
Syntax:  
[ label ] CLRF  
0 f 31  
f
Syntax:  
Operands:  
[ label ] COMF f,d  
Operands:  
Operation:  
0 f 31  
d [0,1]  
00h (f);  
1 Z  
Operation:  
(f) (dest)  
Status Affected:  
Description:  
Z
Status Affected:  
Description:  
Z
The contents of register ‘f’ are  
cleared and the Z bit is set.  
The contents of register ‘f’ are  
complemented. If ‘d’ is ‘0’, the  
result is stored in the W register. If  
‘d’ is ‘1’, the result is stored back in  
register ‘f’.  
DS41270E-page 46  
© 2007 Microchip Technology Inc.  
PIC10F220/222  
DECF  
Decrement f  
INCF  
Increment f  
Syntax:  
Operands:  
[ label ] DECF f,d  
Syntax:  
Operands:  
[ label ] INCF f,d  
0 f 31  
d [0,1]  
0 f 31  
d [0,1]  
Operation:  
(f) – 1 (dest)  
Operation:  
(f) + 1 (dest)  
Status Affected:  
Description:  
Z
Status Affected:  
Description:  
Z
Decrement register ‘f’. If ‘d’ is ‘0’,  
the result is stored in the W  
register. If ‘d’ is ‘1’, the result is  
stored back in register ‘f’.  
The contents of register ‘f’ are  
incremented. If ‘d’ is ‘0’, the result  
is placed in the W register. If ‘d’ is  
1’, the result is placed back in  
register ‘f’.  
INCFSZ  
Syntax:  
Increment f, Skip if 0  
DECFSZ  
Syntax:  
Decrement f, Skip if 0  
[ label ] INCFSZ f,d  
[ label ] DECFSZ f,d  
Operands:  
0 f 31  
d [0,1]  
Operands:  
0 f 31  
d [0,1]  
Operation:  
(f) + 1 (dest), skip if result = 0  
Operation:  
(f) – 1 d; skip if result = 0  
Status Affected: None  
Status Affected: None  
Description:  
The contents of register ‘f’ are  
Description:  
The contents of register ‘f’ are dec-  
incremented. If ‘d’ is ‘0’, the result  
is placed in the W register. If ‘d’ is  
1’, the result is placed back in  
register ‘f’.  
remented. If ‘d’ is ‘0’, the result is  
placed in the W register. If ‘d’ is ‘1’,  
the result is placed back in register  
‘f’.  
If the result is ‘0’, then the next  
instruction, which is already  
fetched, is discarded and a NOPis  
executed instead making it a two-  
cycle instruction.  
If the result is ‘0’, the next instruc-  
tion, which is already fetched, is  
discarded and a NOPis executed  
instead making it a two-cycle  
instruction.  
IORLW  
Inclusive OR literal with W  
[ label ] IORLW k  
0 k 255  
GOTO  
Unconditional Branch  
[ label ] GOTO k  
0 k 511  
Syntax:  
Syntax:  
Operands:  
Operation:  
Status Affected:  
Description:  
Operands:  
Operation:  
(W) .OR. (k) (W)  
Z
k PC<8:0>;  
STATUS<6:5> PC<10:9>  
Status Affected: None  
The contents of the W register are  
OR’ed with the eight-bit literal ‘k’.  
The result is placed in the W  
register.  
Description: GOTOis an unconditional branch.  
The 9-bit immediate value is  
loaded into PC bits <8:0>. The  
upper bits of PC are loaded from  
STATUS<6:5>. GOTOis a two-  
cycle instruction.  
© 2007 Microchip Technology Inc.  
DS41270E-page 47  
PIC10F220/222  
IORWF  
Inclusive OR W with f  
MOVWF  
Syntax:  
Move W to f  
[ label ] MOVWF  
0 f 31  
Syntax:  
[ label ] IORWF f,d  
f
Operands:  
0 f 31  
d [0,1]  
Operands:  
Operation:  
(W) (f)  
Operation:  
(W).OR. (f) (dest)  
Status Affected: None  
Status Affected:  
Description:  
Z
Description:  
Move data from the W register to  
register ‘f’.  
Inclusive OR the W register with  
register ‘f’. If ‘d’ is ‘0’, the result is  
placed in the W register. If ‘d’ is ‘1’,  
the result is placed back in register  
‘f’.  
MOVF  
Move f  
NOP  
No Operation  
[ label ] NOP  
None  
Syntax:  
Operands:  
[ label ] MOVF f,d  
Syntax:  
0 f 31  
d [0,1]  
Operands:  
Operation:  
No operation  
Operation:  
(f) (dest)  
Status Affected: None  
Status Affected:  
Description:  
Z
Description:  
No operation.  
The contents of register ‘f’ are  
moved to destination ‘d’. If ‘d’ is ‘0’,  
destination is the W register. If ‘d’  
is ‘1’, the destination is file register  
‘f’. ‘d’ = 1is useful as a test of a file  
register, since status flag Z is  
affected.  
MOVLW  
Syntax:  
Move Literal to W  
[ label ] MOVLW k  
0 k 255  
OPTION  
Syntax:  
Load OPTION Register  
[ label ] OPTION  
None  
Operands:  
Operation:  
Operands:  
Operation:  
(W) OPTION  
k (W)  
Status Affected: None  
Status Affected: None  
Description: The content of the W register is  
Description:  
The eight-bit literal ‘k’ is loaded  
into the W register. The “don’t  
loaded into the OPTION register.  
cares” will assembled as ‘0’s.  
DS41270E-page 48  
© 2007 Microchip Technology Inc.  
PIC10F220/222  
RETLW  
Return with Literal in W  
SLEEP  
Enter SLEEP Mode  
Syntax:  
[ label ] RETLW  
0 k 255  
k
Syntax:  
[label]  
SLEEP  
Operands:  
Operation:  
Operands:  
Operation:  
None  
k (W);  
TOS PC  
00h WDT;  
0WDT prescaler;  
1TO;  
Status Affected: None  
0PD  
Description:  
The W register is loaded with the  
eight-bit literal ‘k’. The program  
counter is loaded from the top of  
the stack (the return address). This  
is a two-cycle instruction.  
Status Affected: TO, PD, RBWUF  
Description:  
Time-out Status bit (TO) is set. The  
Power-down Status bit (PD) is  
cleared.  
RBWUF is unaffected.  
The WDT and its prescaler are  
cleared.  
The processor is put into Sleep  
mode with the oscillator stopped.  
See section on Sleep for more  
details.  
RLF  
Rotate Left f through Carry  
SUBWF  
Subtract W from f  
Syntax:  
Operands:  
[ label ]  
RLF f,d  
Syntax:  
[label] SUBWF f,d  
0 f 31  
d [0,1]  
Operands:  
0 f 31  
d [0,1]  
Operation:  
See description below  
C
Operation:  
(f) – (W) → (dest)  
Status Affected:  
Description:  
Status Affected: C, DC, Z  
The contents of register ‘f’ are  
rotated one bit to the left through  
the Carry Flag. If ‘d’ is ‘0’, the  
result is placed in the W register. If  
‘d’ is ‘1’, the result is stored back in  
register ‘f’.  
Description:  
Subtract (2’s complement method)  
the W register from register ‘f’. If ‘d’  
is ‘0’, the result is stored in the W  
register. If ‘d’ is ‘1’, the result is  
stored back in register ‘f’.  
register ‘f’  
C
RRF  
Rotate Right f through Carry  
SWAPF  
Syntax:  
Swap Nibbles in f  
Syntax:  
Operands:  
[ label ] RRF f,d  
[label] SWAPF f,d  
0 f 31  
d [0,1]  
Operands:  
0 f 31  
d [0,1]  
Operation:  
See description below  
C
Operation:  
(f<3:0>) (dest<7:4>);  
(f<7:4>) (dest<3:0>)  
Status Affected:  
Description:  
Status Affected: None  
The contents of register ‘f’ are  
rotated one bit to the right through  
the Carry Flag. If ‘d’ is ‘0’, the  
result is placed in the W register. If  
‘d’ is ‘1’, the result is placed back  
in register ‘f’.  
Description: The upper and lower nibbles of  
register ‘f’ are exchanged. If ‘d’ is  
0’, the result is placed in W  
register. If ‘d’ is ‘1’, the result is  
placed in register ‘f’.  
register ‘f’  
C
© 2007 Microchip Technology Inc.  
DS41270E-page 49  
PIC10F220/222  
TRIS  
Load TRIS Register  
Syntax:  
[ label ] TRIS  
f
Operands:  
Operation:  
f = 6  
(W) TRIS register f  
Status Affected: None  
Description:  
TRIS register ‘f’ (f = 6 or 7) is  
loaded with the contents of the W  
register  
XORLW  
Exclusive OR literal with W  
Syntax:  
[label] XORLW k  
0 k 255  
Operands:  
Operation:  
(W) .XOR. k → (W)  
Z
Status Affected:  
Description:  
The contents of the W register are  
XOR’ed with the eight-bit literal ‘k’.  
The result is placed in the W  
register.  
XORWF  
Syntax:  
Exclusive OR W with f  
[ label ] XORWF f,d  
Operands:  
0 f 31  
d [0,1]  
Operation:  
(W) .XOR. (f) → (dest)  
Status Affected:  
Description:  
Z
Exclusive OR the contents of the  
W register with register ‘f’. If ‘d’ is  
0’, the result is stored in the W  
register. If ‘d’ is ‘1’, the result is  
stored back in register ‘f’.  
DS41270E-page 50  
© 2007 Microchip Technology Inc.  
PIC10F220/222  
10.0 ELECTRICAL CHARACTERISTICS  
(†)  
Absolute Maximum Ratings  
Ambient temperature under bias.............................................................................................................-40°C to +125°C  
Storage temperature ...............................................................................................................................-65°C to +150°C  
Voltage on VDD with respect to VSS ..................................................................................................................0 to +6.5V  
Voltage on MCLR with respect to VSS.............................................................................................................0 to +13.5V  
Voltage on all other pins with respect to VSS .................................................................................. -0.3V to (VDD + 0.3V)  
Total power dissipation(1) .....................................................................................................................................800 mW  
Max. current out of VSS pin .....................................................................................................................................80 mA  
Max. current into VDD pin........................................................................................................................................80 mA  
Input clamp current, IIK (VI < 0 or VI > VDD)......................................................................................................................±20 mA  
Output clamp current, IOK (VO < 0 or VO > VDD) ..............................................................................................................±20 mA  
Max. output current sunk by any I/O pin .................................................................................................................25 mA  
Max. output current sourced by any I/O pin............................................................................................................25 mA  
Max. output current sourced by I/O port .................................................................................................................75 mA  
Max. output current sunk by I/O port ......................................................................................................................75 mA  
Note 1: Power dissipation is calculated as follows: PDIS = VDD x {IDD IOH} + {(VDD – VOH) x IOH} .. + (VOL x  
IOL)  
NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the  
device. This is a stress rating only and functional operation of the device at those or any other conditions above  
those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions  
for extended periods may affect device reliability.  
© 2007 Microchip Technology Inc.  
DS41270E-page 51  
PIC10F220/222  
FIGURE 10-1:  
6.0  
VOLTAGE-FREQUENCY GRAPH, -40°C TA +125°C  
5.5  
5.0  
4.5  
4.0  
3.5  
VDD  
(Volts)  
3.0  
2.5  
2.0  
8
0
4
10  
20  
25  
Frequency (MHz)  
DS41270E-page 52  
© 2007 Microchip Technology Inc.  
PIC10F220/222  
10.1 DC Characteristics: PIC10F220/222 (Industrial)  
Standard Operating Conditions (unless otherwise specified)  
Operating Temperature -40×C TA +85°C (industrial)  
DC CHARACTERISTICS  
Param  
Sym  
No.  
(1)  
Characteristic  
Min Typ  
Max Units  
Conditions  
D001  
D002  
D003  
VDD Supply Voltage  
2.0  
5.5  
V
V
V
See Figure 10-1  
(2)  
VDR RAM Data Retention Voltage  
1.5*  
Device in Sleep mode  
VPOR VDD Start Voltage  
Vss  
to ensure Power-on Reset  
D004  
D010  
SVDD VDD Rise Rate  
to ensure Power-on Reset  
(3)  
0.05*  
V/ms  
IDD  
IPD  
Supply Current  
175  
0.625  
250  
275  
1.1  
400  
1.5  
μA  
mA  
μA  
VDD = 2.0V, Fosc = 4 MHz  
VDD = 5.0V, Fosc = 4 MHz  
VDD = 2.0V, Fosc = 8 MHz  
VDD = 5.0V, Fosc = 8 MHz  
0.800  
mA  
(4)  
Power-down Current  
D020  
D022  
0.1  
1
1.2  
2.4  
μA  
μA  
VDD = 2.0V  
VDD = 5.0V  
(4)  
IWDT WDT Current  
1.0  
7
3
16  
μA  
μA  
VDD = 2.0V  
VDD = 5.0V  
*
These parameters are characterized but not tested.  
Note 1: Data in the Typical (“Typ”) column is based on characterization results at 25°C. This data is for design guidance only  
and is not tested.  
2: This is the limit to which VDD can be lowered in Sleep mode without losing RAM data.  
3: The supply current is mainly a function of the operating voltage and frequency. Other factors such as bus loading, bus  
rate, internal code execution pattern and temperature also have an impact on the current consumption.  
a) The test conditions for all IDD measurements in active operation mode are:  
All I/O pins tri-stated, pulled to VSS, T0CKI = VDD, MCLR = VDD; WDT enabled/disabled as specified.  
b) For standby current measurements, the conditions are the same, except that the device is in Sleep mode.  
4: Power-down current is measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD  
or VSS. The peripheral current is the sum of the base IPD and the additional current consumed when the peripheral is  
enabled.  
© 2007 Microchip Technology Inc.  
DS41270E-page 53  
PIC10F220/222  
10.2 DC Characteristics: PIC10F220/222 (Extended)  
Standard Operating Conditions (unless otherwise specified)  
Operating Temperature -40×C £ TA £ +125×C (extended)  
DC CHARACTERISTICS  
Param  
Sym  
No.  
(1)  
Characteristic  
Supply Voltage  
Min  
Typ  
Max  
Units  
Conditions  
D001  
D002  
D003  
VDD  
VDR  
2.0  
1.5*  
5.5  
V
V
V
See Figure 10-1  
(2)  
RAM Data Retention Voltage  
Device in Sleep mode  
VPOR  
VDD Start Voltage  
Vss  
to ensure Power-on Reset  
(3)  
IDD  
Supply Current  
D010  
175  
0.625  
250  
275  
1.1  
400  
1.5  
μA  
mA  
μA  
VDD = 2.0V, Fosc = 4 MHz  
VDD = 5.0V, Fosc = 4 MHz  
VDD = 2.0V, Fosc = 8 MHz  
VDD = 5.0V, Fosc = 8 MHz  
0.800  
mA  
(4)  
IPD  
Power-down Current  
D020  
D022  
0.1  
1
9
15  
μA  
μA  
VDD = 2.0V  
VDD = 5.0V  
(4)  
IWDT  
WDT Current  
1.0  
7
18  
22  
μA  
μA  
VDD = 2.0V  
VDD = 5.0V  
*
These parameters are characterized but not tested.  
Note 1: Data in the Typical (“Typ”) column is based on characterization results at 25°C. This data is for design guidance only  
and is not tested.  
2: This is the limit to which VDD can be lowered in Sleep mode without losing RAM data.  
3: The supply current is mainly a function of the operating voltage and frequency. Other factors such as bus loading, bus  
rate, internal code execution pattern and temperature also have an impact on the current consumption.  
a) The test conditions for all IDD measurements in active operation mode are:  
All I/O pins tri-stated, pulled to VSS, T0CKI = VDD, MCLR = VDD; WDT enabled/disabled as specified.  
b) For standby current measurements, the conditions are the same, except that the device is in Sleep mode.  
4: Power-down current is measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD  
or VSS. The peripheral current is the sum of the base IPD and the additional current consumed when the peripheral is  
enabled.  
DS41270E-page 54  
© 2007 Microchip Technology Inc.  
PIC10F220/222  
10.3 DC Characteristics: PIC10F220/222 (Industrial, Extended)  
Standard Operating Conditions (unless otherwise specified)  
Operating temperature  
-40°C TA +85°C (industrial)  
-40°C TA +125°C (extended)  
DC CHARACTERISTICS  
Operating voltage VDD range as described in DC specification  
Param  
No.  
Sym  
Characteristic  
Min  
Typ†  
Max  
Units  
Conditions  
VIL Input Low Voltage  
I/O ports:  
D030  
D030A  
D031  
with TTL buffer  
Vss  
Vss  
Vss  
0.8  
V
V
V
For all 4.5 VDD 5.5V  
0.15 VDD  
0.2 VDD  
Otherwise  
with Schmitt Trigger  
buffer  
D032  
MCLR, T0CKI  
Vss  
0.2 VDD  
V
VIH Input High Voltage  
I/O ports:  
D040  
D040A  
D041  
with TTL buffer  
2.0  
VDD  
VDD  
VDD  
V
V
V
4.5 VDD 5.5V  
Otherwise  
0.25 VDD + 0.8  
0.8VDD  
with Schmitt Trigger  
For entire VDD range  
buffer  
D042  
D070  
MCLR, T0CKI  
0.8VDD  
50  
VDD  
400  
V
IPUR GPIO weak pull-up current  
250  
μA VDD = 5V, VPIN = VSS  
(1)  
IIL  
Input Leakage Current  
D060  
D061  
I/O ports  
±0.1  
±0.7  
± 1  
± 5  
μA Vss VPIN VDD, Pin at high-imped-  
ance  
(2)  
GP3/MCLR  
μA Vss VPIN VDD  
Output Low Voltage  
D080  
I/O ports  
0.6  
0.6  
V
V
IOL = 8.5 mA, VDD = 4.5V, -40°C to  
+85°C  
D080A  
IOL = 7.0 mA, VDD = 4.5V, -40°C to  
+125°C  
Output High Voltage  
(2)  
D090  
I/O ports  
VDD – 0.7  
VDD – 0.7  
V
V
IOH = -3.0 mA, VDD = 4.5V, -40°C to  
+85°C  
D090A  
IOH = -2.5 mA, VDD = 4.5V, -40°C to  
+125°C  
Capacitive Loading Specs on Output Pins  
All I/O pins  
D101  
50*  
pF  
*
Data in “Typ” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not  
tested.  
These parameters are for design guidance only and are not tested.  
Note 1: Negative current is defined as coming out of the pin.  
2: This specification applies when GP3/MCLR is configured as an input with pull-up disabled. The leakage current of the  
MCLR circuit is higher than the standard I/O logic.  
© 2007 Microchip Technology Inc.  
DS41270E-page 55  
PIC10F220/222  
TABLE 10-1: PULL-UP RESISTOR RANGES  
VDD (Volts)  
GP0/GP1  
Temperature (°C)  
Min  
Typ  
Max  
Units  
2.0  
5.5  
-40  
25  
73K  
73K  
82K  
86K  
15K  
15K  
19K  
23K  
105K  
113K  
123K  
132k  
21K  
186K  
187K  
190K  
190K  
33K  
Ω
Ω
Ω
Ω
Ω
Ω
Ω
Ω
85  
125  
-40  
25  
22K  
34K  
85  
26k  
35K  
125  
29K  
35K  
GP3  
2.0  
-40  
25  
63K  
77K  
82K  
86K  
16K  
16K  
24K  
26K  
81K  
93K  
96k  
96K  
116K  
116K  
119K  
22K  
Ω
Ω
Ω
Ω
Ω
Ω
Ω
Ω
85  
125  
-40  
25  
100K  
20k  
5.5  
21K  
25k  
23K  
85  
28K  
125  
27K  
29K  
DS41270E-page 56  
© 2007 Microchip Technology Inc.  
PIC10F220/222  
10.4 Timing Parameter Symbology and Load Conditions  
The timing parameter symbols have been created following one of the following formats:  
1. TppS2ppS  
2. TppS  
T
F
Frequency  
T
Time  
Lowercase subscripts (pp) and their meanings:  
pp  
2
to  
mc  
osc  
os  
MCLR  
ck  
cy  
drt  
io  
CLKOUT  
Cycle time  
Device Reset Timer  
I/O port  
Oscillator  
OSC1  
t0  
T0CKI  
wdt  
Watchdog Timer  
Uppercase letters and their meanings:  
S
F
H
I
Fall  
P
R
V
Z
Period  
High  
Rise  
Invalid (high-impedance)  
Low  
Valid  
L
High-impedance  
FIGURE 10-2:  
LOAD CONDITIONS  
Legend:  
CL = 50 pF for all pins  
CL  
pin  
VSS  
TABLE 10-2: CALIBRATED INTERNAL RC FREQUENCIES – PIC10F220/222  
Standard Operating Conditions (unless otherwise specified)  
Operating Temperature  
-40°C TA +85°C (industrial),  
-40°C TA +125°C (extended)  
AC CHARACTERISTICS  
Operating Voltage VDD range is described in  
Section 10.1 “DC Characteristics: PIC10F220/222 (Industrial)”.  
Param  
Freq.  
Tolerance  
Sym  
Characteristic  
Min Typ†  
Max Units  
Conditions  
No.  
F10  
FOSC  
Internal Calibrated  
INTOSC  
± 1%  
± 2%  
3.96 4.00  
3.92 4.00  
4.04 MHz VDD=3.5V @ 25°C  
4.08 MHz 2.5V VDD 5.5V  
0°C TA +85°C (industrial)  
4.20 MHz 2.0V VDD 5.5V  
-40°C TA +85°C (industrial)  
-40°C TA +125°C (extended)  
Frequency(1, 2, 3)  
± 5%  
3.80 4.00  
Data in the Typical (“Typ”) column is at 5V, 25°C unless otherwise stated. These parameters are for design  
guidance only and are not tested.  
Note 1: To ensure these oscillator frequency tolerances, VDD and VSS must be capacitively decoupled as close to  
the device as possible. 0.1 μF and 0.01 μF values in parallel are recommended.  
2: Under stable VDD conditions.  
3: Frequency values in this table are doubled when the 8 MHz INTOSC option is selected.  
© 2007 Microchip Technology Inc.  
DS41270E-page 57  
PIC10F220/222  
FIGURE 10-3:  
RESET, WATCHDOG TIMER AND DEVICE RESET TIMER TIMING  
VDD  
MCLR  
30  
Internal  
POR  
32  
32  
32  
DRT  
(2)  
Timeout  
Internal  
Reset  
Watchdog  
Timer  
Reset  
31  
34  
34  
(1)  
I/O pin  
Note 1: I/O pins must be taken out of High-impedance mode by enabling the output drivers in software.  
2: Runs on POR Reset only.  
TABLE 10-3: RESET, WATCHDOG TIMER AND DEVICE RESET TIMER – PIC10F220/222  
Standard Operating Conditions (unless otherwise specified)  
Operating Temperature -40°C TA +85°C (industrial)  
AC CHARACTERISTICS  
-40°C TA +125°C (extended)  
Operating Voltage VDD range is described in Section 10.1 “DC  
Characteristics: PIC10F220/222 (Industrial)”  
Param  
Sym  
No.  
Characteristic  
MCLR Pulse Width (low)  
Min Typ(1) Max Units  
Conditions  
30  
31  
32  
TMC  
2*  
5*  
μs  
μs  
VDD = 5V, -40°C to +85°C  
VDD = 5.0V  
L
TWDT Watchdog Timer Time-out Period  
(no prescaler)  
10  
10  
18  
18  
29  
31  
ms VDD = 5.0V (Industrial)  
ms VDD = 5.0V (Extended)  
TDRT* Device Reset Timer Period  
(standard)  
0.600 1.125 1.85  
0.600 1.125 1.95  
ms VDD = 5.0V (Industrial)  
ms VDD = 5.0V (Extended)  
34  
TIOZ  
I/O High-impedance from MCLR  
low  
2*  
μs  
*
These parameters are characterized but not tested.  
Note 1: Data in the Typical (“Typ”) column is at 5V, 25°C unless otherwise stated. These parameters are for design  
guidance only and are not tested.  
DS41270E-page 58  
© 2007 Microchip Technology Inc.  
PIC10F220/222  
FIGURE 10-4:  
TIMER0 CLOCK TIMINGS  
T0CKI  
40  
41  
42  
TABLE 10-4: TIMER0 CLOCK REQUIREMENTS  
Standard Operating Conditions (unless otherwise specified)  
Operating Temperature -40°C TA +85°C (industrial)  
-40°C TA +125°C (extended)  
AC CHARACTERISTICS  
Param  
Sym  
No.  
Characteristic  
No Prescaler  
Min  
Typ(1) Max Units  
Conditions  
40  
41  
42  
Tt0H T0CKI High Pulse  
0.5 TCY + 20*  
10*  
ns  
ns  
ns  
ns  
Width  
With Prescaler  
No Prescaler  
With Prescaler  
Tt0L T0CKI Low Pulse  
Width  
0.5 TCY + 20*  
10*  
Tt0P T0CKI Period  
20 or TCY + 40* N  
ns Whichever is greater.  
N = Prescale Value  
(1, 2, 4,..., 256)  
*
These parameters are characterized but not tested.  
Note 1: Data in the Typical (“Typ”) column is at 5V, 25°C unless otherwise stated. These parameters are for design  
guidance only and are not tested.  
© 2007 Microchip Technology Inc.  
DS41270E-page 59  
PIC10F220/222  
TABLE 10-5: A/D CONVERTER CHARACTERISTICS  
Standard Operating Conditions (unless otherwise stated)  
Operating temperature  
-40°C TA +125°C  
Param  
No.  
Sym  
Characteristic Min  
Typ†  
Max  
Units  
Conditions  
A01  
NR  
Resolution  
8 bits  
±1.5  
bit  
A03  
A04  
A05  
A06  
A07  
A10  
A25  
A30  
EIL  
Integral Error  
Differential Error  
Full-scale Range  
LSb  
EDL  
EFS  
-1 < EDL + 1.5 LSb  
2.0*  
5.5*  
±1.5  
±1.5  
V
LSb  
LSb  
EOFF Offset Error  
EGN  
Gain Error  
Monotonicity  
guaranteed(1)  
VSS VAIN VDD  
VAIN  
ZAIN  
Analog Input Voltage  
VSS  
VDD  
10  
V
Recommended  
kΩ  
Impedence of Analog  
Voltage Source  
A31*  
ΔIAD A/D Conversion Current(2)  
120  
200  
150  
250  
μA  
μA  
2.0V  
5.0V  
*
These parameters are characterized but not tested.  
Data in the “Typ” column is at 5.0V, 25°C unless otherwise stated. These parameters are for design  
guidance only are not tested.  
Note 1: The A/D conversion result never decreases with an increase in the input voltage and has no missing  
codes.  
2: This is the additional current consumed by the A/D module when it is enabled; this current adds to base  
IDD.  
TABLE 10-6: A/D CONVERSION REQUIREMENTS  
Standard Operating Conditions (unless otherwise stated)  
Operating temperature  
-40°C TA +125°C  
Param  
No.  
Sym  
Characteristic  
Min  
Typ†  
Max Units  
Conditions  
AD131 TCNV Conversion Time  
(not including  
13  
TCY Set GO/DONE bit to new data in A/D  
Result register  
Acquisition Time)  
AD132* TACQ Acquisition Time(1)  
3.5  
5
μs VDD = 5V  
μs VDD = 2.5V  
*
These parameters are characterized but not tested.  
Data in ‘Typ’ column is at 5.0V, 25°C unless otherwise stated. These parameters are for design guidance  
only and are not tested.  
Note 1: The Section 7.9 “A/D Acquisition Requirements” for information on how to compute minimum  
acquisition times based on operating conditions.  
DS41270E-page 60  
© 2007 Microchip Technology Inc.  
PIC10F220/222  
11.0 DC AND AC CHARACTERISTICS GRAPHS AND TABLES.  
Note: The graphs and tables provided following this note are a statistical summary based on a limited number of  
samples and are provided for informational purposes only. The performance characteristics listed herein are  
not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified  
operating range (e.g., outside specified power supply range) and therefore, outside the warranted range.  
“Typical” represents the mean of the distribution at 25°C. “Maximum” or “minimum” represents (mean + 3σ) or (mean -  
3σ) respectively, where s is a standard deviation, over each temperature range.  
FIGURE 11-1:  
IDD vs. VDD OVER FOSC (4 MHZ)  
XT Mode  
1,400  
1,200  
1,000  
800  
Typical: Statistical Mean @25°C  
Maximum: Mean (Worst Case Temp) + 3σ  
(-40°C to 125°C)  
Maximum  
4 MHz  
4 MHz  
Typical  
600  
400  
200  
0
2.0  
2.5  
3.0  
3.5  
4.0  
4.5  
5.0  
5.5  
VDD (V)  
© 2007 Microchip Technology Inc.  
DS41270E-page 61  
PIC10F220/222  
FIGURE 11-2:  
IDD vs. VDD OVER FOSC (8 MHZ)  
1,800  
Typical: Statistical Mean @25°C  
Maximum: Mean (Worst Case Temp) + 3σ  
(-40°C to 125°C)  
Maximum  
1,600  
1,400  
1,200  
1,000  
800  
8 MHz  
8 MHz  
Typical  
600  
400  
200  
0.0  
2.0  
2.5  
3.0  
3.5  
4.0  
4.5  
5.0  
5.5  
VDD (V)  
FIGURE 11-3:  
TYPICAL IPD vs. VDD (SLETEyPpicMaOl DE, ALL PERIPHERALS DISABLED)  
1.10  
Typical: Statistical Mean @25°C  
1.00  
0.90  
0.80  
0.70  
0.60  
0.50  
0.40  
0.30  
0.20  
0.10  
0.0  
2.0  
2.5  
3.0  
3.5  
4.0  
4.5  
5.0  
5.5  
VDD (V)  
DS41270E-page 62  
© 2007 Microchip Technology Inc.  
PIC10F220/222  
FIGURE 11-4:  
MAXIMUM IPD vs. VDD (SLEEP MODE, ALL PERIPHERALS DISABLED)  
18.0  
Typical: Statistical Mean @25°C  
Maximum: Mean (Worst Case Temp) + 3σ  
(-40°C to 125°C)  
16.0  
14.0  
12.0  
10.0  
8.0  
Max. 125°C  
6.0  
4.0  
Max. 85°C  
3.5  
2.0  
0.0  
2.0  
2.5  
3.0  
4.0  
4.5  
5.0  
5.5  
VDD (V)  
FIGURE 11-5:  
TYPICAL WDT IPD vs. VDD  
9
Typical: Statistical Mean @25°C  
8
7
6
5
4
3
2
1
0
2.0  
2.5  
3.0  
3.5  
4.0  
4.5  
5.0  
5.5  
VDD (V)  
© 2007 Microchip Technology Inc.  
DS41270E-page 63  
PIC10F220/222  
FIGURE 11-6:  
MAXIMUM WDT IPD vs. VDD OVER TEMPERATURE  
Maximum  
25.0  
Maximum: Mean (Worst Case Temp) + 3σ  
(-40°C to 125°C)  
20.0  
15.0  
10.0  
5.0  
Max. 125°C  
Max. 85°C  
0.0  
2.0  
2.5  
3.0  
3.5  
4.0  
4.5  
5.0  
5.5  
VDD (V)  
FIGURE 11-7:  
WDT TIME-OUT vs. VDD OVER TEMPERATURE (NO PRESCALER)  
50  
45  
40  
Typical: Statistical Mean @25°C  
Maximum: Mean (Worst Case Temp) + 3σ  
(-40°C to 125°C)  
Max. 125°C  
Max. 85°C  
35  
30  
25  
20  
15  
10  
5
Typical. 25°C  
Min. -40°C  
0
2.0  
2.5  
3.0  
3.5  
4.0  
4.5  
5.0  
5.5  
VDD (V)  
DS41270E-page 64  
© 2007 Microchip Technology Inc.  
PIC10F220/222  
FIGURE 11-8:  
VOL vs. IOL OVER TEMPERATURE (VDD = 3.0V)  
(VDD = 3V, -40×C TO 125×C)  
0.8  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0.0  
Typical: Statistical Mean @25°C  
Maximum: Mean (Worst Case Temp) + 3σ  
(-40°C to 125°C)  
Max. 125°C  
Max. 85°C  
Typical 25°C  
Min. -40°C  
5.0  
5.5  
6.0  
6.5  
7.0  
7.5  
8.0  
8.5  
9.0  
9.5  
10.0  
IOL (mA)  
FIGURE 11-9:  
VOL vs. IOL OVER TEMPERATURE (VDD = 5.0V)  
0.45  
Typical: Statistical Mean @25°C  
0.40  
0.35  
0.30  
0.25  
0.20  
0.15  
0.10  
0.05  
0.00  
Maximum: Mean (Worst Case Temp) + 3σ  
(-40°C to 125°C)  
Max. 125°C  
Max. 85°C  
Typ. 25°C  
Min. -40°C  
5.0  
5.5  
6.0  
6.5  
7.0  
7.5  
8.0  
8.5  
9.0  
9.5  
10.0  
IOL (mA)  
© 2007 Microchip Technology Inc.  
DS41270E-page 65  
PIC10F220/222  
FIGURE 11-10:  
VOH vs. IOH OVER TEMPERATURE (VDD = 3.0V)  
3.5  
3.0  
2.5  
2.0  
1.5  
Max. -40°C  
Typ. 25°C  
Min. 125°C  
Typical: Statistical Mean @25°C  
Maximum: Mean (Worst Case Temp) + 3σ  
(-40°C to 125°C)  
1.0  
0.5  
0.0  
0.0  
-0.5  
-1.0  
-1.5  
-2.0  
-2.5  
-3.0  
-3.5  
-4.0  
IOH (mA)  
FIGURE 11-11:  
VOH vs. IOH OVER TEMPERATURE (VDD = 5.0V)  
5.5  
5.0  
4.5  
4.0  
Max. -40°C  
Typ. 25°C  
Min. 125°C  
Typical: Statistical Mean @25°C  
Maximum: Mean (Worst Case Temp) + 3σ  
(-40°C to 125°C)  
3.5  
3.0  
0.0  
-0.5  
-1.0  
-1.5  
-2.0  
-2.5  
-3.0  
-3.5  
-4.0  
-4.5  
-5.0  
IOH (mA)  
DS41270E-page 66  
© 2007 Microchip Technology Inc.  
PIC10F220/222  
FIGURE 11-12:  
TTL INPUT THRESHOLD VIN vs. VDD  
1.7  
Typical: Statistical Mean @25°C  
Maximum: Mean (Worst Case Temp) + 3σ  
(-40°C to 125°C)  
1.5  
1.3  
1.1  
0.9  
0.7  
0.5  
Max. -40°C  
Typ. 25°C  
Min. 125°C  
2.0  
2.5  
3.0  
3.5  
4.0  
4.5  
5.0  
5.5  
VDD (V)  
FIGURE 11-13:  
SCHMITT TRIGGER INPUT THRESHOLD VIN vs. VDD  
(ST Input, -40×C TO 125×C)  
4.0  
3.5  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
VIH Max. 125°C  
VIH Min. -40°C  
Typical: Statistical Mean @25°C  
Maximum: Mean (Worst Case Temp) + 3σ  
(-40°C to 125°C)  
VIL Max. -40°C  
VIL Min. 125°C  
2.0  
2.5  
3.0  
3.5  
4.0  
4.5  
5.0  
5.5  
VDD (V)  
© 2007 Microchip Technology Inc.  
DS41270E-page 67  
PIC10F220/222  
NOTES:  
DS41270E-page 68  
© 2007 Microchip Technology Inc.  
PIC10F220/222  
12.1 MPLAB Integrated Development  
Environment Software  
12.0 DEVELOPMENT SUPPORT  
The PIC® microcontrollers are supported with a full  
range of hardware and software development tools:  
The MPLAB IDE software brings an ease of software  
development previously unseen in the 8/16-bit micro-  
controller market. The MPLAB IDE is a Windows®  
operating system-based application that contains:  
• Integrated Development Environment  
- MPLAB® IDE Software  
• Assemblers/Compilers/Linkers  
- MPASMTM Assembler  
• A single graphical interface to all debugging tools  
- Simulator  
- MPLAB C18 and MPLAB C30 C Compilers  
- MPLINKTM Object Linker/  
MPLIBTM Object Librarian  
- Programmer (sold separately)  
- Emulator (sold separately)  
- In-Circuit Debugger (sold separately)  
• A full-featured editor with color-coded context  
• A multiple project manager  
- MPLAB ASM30 Assembler/Linker/Library  
• Simulators  
- MPLAB SIM Software Simulator  
• Emulators  
• Customizable data windows with direct edit of  
contents  
- MPLAB ICE 2000 In-Circuit Emulator  
- MPLAB REAL ICE™ In-Circuit Emulator  
• In-Circuit Debugger  
• High-level source code debugging  
• Visual device initializer for easy register  
initialization  
- MPLAB ICD 2  
• Mouse over variable inspection  
• Device Programmers  
• Drag and drop variables from source to watch  
windows  
- PICSTART® Plus Development Programmer  
- MPLAB PM3 Device Programmer  
- PICkit™ 2 Development Programmer  
• Extensive on-line help  
• Integration of select third party tools, such as  
HI-TECH Software C Compilers and IAR  
C Compilers  
• Low-Cost Demonstration and Development  
Boards and Evaluation Kits  
The MPLAB IDE allows you to:  
• Edit your source files (either assembly or C)  
• One touch assemble (or compile) and download  
to PIC MCU emulator and simulator tools  
(automatically updates all project information)  
• Debug using:  
- Source files (assembly or C)  
- Mixed assembly and C  
- Machine code  
MPLAB IDE supports multiple debugging tools in a  
single development paradigm, from the cost-effective  
simulators, through low-cost in-circuit debuggers, to  
full-featured emulators. This eliminates the learning  
curve when upgrading to tools with increased flexibility  
and power.  
© 2007 Microchip Technology Inc.  
DS41270E-page 69  
PIC10F220/222  
12.2 MPASM Assembler  
12.5 MPLAB ASM30 Assembler, Linker  
and Librarian  
The MPASM Assembler is a full-featured, universal  
macro assembler for all PIC MCUs.  
MPLAB ASM30 Assembler produces relocatable  
machine code from symbolic assembly language for  
dsPIC30F devices. MPLAB C30 C Compiler uses the  
assembler to produce its object file. The assembler  
generates relocatable object files that can then be  
archived or linked with other relocatable object files and  
archives to create an executable file. Notable features  
of the assembler include:  
The MPASM Assembler generates relocatable object  
files for the MPLINK Object Linker, Intel® standard HEX  
files, MAP files to detail memory usage and symbol  
reference, absolute LST files that contain source lines  
and generated machine code and COFF files for  
debugging.  
The MPASM Assembler features include:  
• Integration into MPLAB IDE projects  
• Support for the entire dsPIC30F instruction set  
• Support for fixed-point and floating-point data  
• Command line interface  
• User-defined macros to streamline  
assembly code  
• Rich directive set  
• Conditional assembly for multi-purpose  
source files  
• Flexible macro language  
• MPLAB IDE compatibility  
• Directives that allow complete control over the  
assembly process  
12.6 MPLAB SIM Software Simulator  
12.3 MPLAB C18 and MPLAB C30  
C Compilers  
The MPLAB SIM Software Simulator allows code  
development in a PC-hosted environment by simulat-  
ing the PIC MCUs and dsPIC® DSCs on an instruction  
level. On any given instruction, the data areas can be  
examined or modified and stimuli can be applied from  
a comprehensive stimulus controller. Registers can be  
logged to files for further run-time analysis. The trace  
buffer and logic analyzer display extend the power of  
the simulator to record and track program execution,  
actions on I/O, most peripherals and internal registers.  
The MPLAB C18 and MPLAB C30 Code Development  
Systems are complete ANSI  
C
compilers for  
Microchip’s PIC18 and PIC24 families of microcontrol-  
lers and the dsPIC30 and dsPIC33 family of digital sig-  
nal controllers. These compilers provide powerful  
integration capabilities, superior code optimization and  
ease of use not found with other compilers.  
For easy source level debugging, the compilers provide  
symbol information that is optimized to the MPLAB IDE  
debugger.  
The MPLAB SIM Software Simulator fully supports  
symbolic debugging using the MPLAB C18 and  
MPLAB C30 C Compilers, and the MPASM and  
MPLAB ASM30 Assemblers. The software simulator  
offers the flexibility to develop and debug code outside  
of the hardware laboratory environment, making it an  
excellent, economical software development tool.  
12.4 MPLINK Object Linker/  
MPLIB Object Librarian  
The MPLINK Object Linker combines relocatable  
objects created by the MPASM Assembler and the  
MPLAB C18 C Compiler. It can link relocatable objects  
from precompiled libraries, using directives from a  
linker script.  
The MPLIB Object Librarian manages the creation and  
modification of library files of precompiled code. When  
a routine from a library is called from a source file, only  
the modules that contain that routine will be linked in  
with the application. This allows large libraries to be  
used efficiently in many different applications.  
The object linker/library features include:  
• Efficient linking of single libraries instead of many  
smaller files  
• Enhanced code maintainability by grouping  
related modules together  
• Flexible creation of libraries with easy module  
listing, replacement, deletion and extraction  
DS41270E-page 70  
© 2007 Microchip Technology Inc.  
PIC10F220/222  
12.7 MPLAB ICE 2000  
High-Performance  
12.9 MPLAB ICD 2 In-Circuit Debugger  
Microchip’s In-Circuit Debugger, MPLAB ICD 2, is a  
powerful, low-cost, run-time development tool,  
connecting to the host PC via an RS-232 or high-speed  
USB interface. This tool is based on the Flash PIC  
MCUs and can be used to develop for these and other  
PIC MCUs and dsPIC DSCs. The MPLAB ICD 2 utilizes  
the in-circuit debugging capability built into the Flash  
devices. This feature, along with Microchip’s In-Circuit  
Serial ProgrammingTM (ICSPTM) protocol, offers cost-  
effective, in-circuit Flash debugging from the graphical  
user interface of the MPLAB Integrated Development  
Environment. This enables a designer to develop and  
debug source code by setting breakpoints, single step-  
ping and watching variables, and CPU status and  
peripheral registers. Running at full speed enables  
testing hardware and applications in real time. MPLAB  
ICD 2 also serves as a development programmer for  
selected PIC devices.  
In-Circuit Emulator  
The MPLAB ICE 2000 In-Circuit Emulator is intended  
to provide the product development engineer with a  
complete microcontroller design tool set for PIC  
microcontrollers. Software control of the MPLAB ICE  
2000 In-Circuit Emulator is advanced by the MPLAB  
Integrated Development Environment, which allows  
editing, building, downloading and source debugging  
from a single environment.  
The MPLAB ICE 2000 is a full-featured emulator  
system with enhanced trace, trigger and data monitor-  
ing features. Interchangeable processor modules allow  
the system to be easily reconfigured for emulation of  
different processors. The architecture of the MPLAB  
ICE 2000 In-Circuit Emulator allows expansion to  
support new PIC microcontrollers.  
The MPLAB ICE 2000 In-Circuit Emulator system has  
been designed as a real-time emulation system with  
advanced features that are typically found on more  
expensive development tools. The PC platform and  
Microsoft® Windows® 32-bit operating system were  
chosen to best make these features available in a  
simple, unified application.  
12.10 MPLAB PM3 Device Programmer  
The MPLAB PM3 Device Programmer is a universal,  
CE compliant device programmer with programmable  
voltage verification at VDDMIN and VDDMAX for  
maximum reliability. It features a large LCD display  
(128 x 64) for menus and error messages and a modu-  
lar, detachable socket assembly to support various  
package types. The ICSP™ cable assembly is included  
as a standard item. In Stand-Alone mode, the MPLAB  
PM3 Device Programmer can read, verify and program  
PIC devices without a PC connection. It can also set  
code protection in this mode. The MPLAB PM3  
connects to the host PC via an RS-232 or USB cable.  
The MPLAB PM3 has high-speed communications and  
optimized algorithms for quick programming of large  
memory devices and incorporates an SD/MMC card for  
file storage and secure data applications.  
12.8 MPLAB REAL ICE In-Circuit  
Emulator System  
MPLAB REAL ICE In-Circuit Emulator System is  
Microchip’s next generation high-speed emulator for  
Microchip Flash DSC and MCU devices. It debugs and  
programs PIC® Flash MCUs and dsPIC® Flash DSCs  
with the easy-to-use, powerful graphical user interface of  
the MPLAB Integrated Development Environment (IDE),  
included with each kit.  
The MPLAB REAL ICE probe is connected to the design  
engineer’s PC using a high-speed USB 2.0 interface and  
is connected to the target with either a connector  
compatible with the popular MPLAB ICD 2 system  
(RJ11) or with the new high-speed, noise tolerant, Low-  
Voltage Differential Signal (LVDS) interconnection  
(CAT5).  
MPLAB REAL ICE is field upgradeable through future  
firmware downloads in MPLAB IDE. In upcoming  
releases of MPLAB IDE, new devices will be supported,  
and new features will be added, such as software break-  
points and assembly code trace. MPLAB REAL ICE  
offers significant advantages over competitive emulators  
including low-cost, full-speed emulation, real-time  
variable watches, trace analysis, complex breakpoints, a  
ruggedized probe interface and long (up to three meters)  
interconnection cables.  
© 2007 Microchip Technology Inc.  
DS41270E-page 71  
PIC10F220/222  
12.11 PICSTART Plus Development  
Programmer  
12.13 Demonstration, Development and  
Evaluation Boards  
The PICSTART Plus Development Programmer is an  
easy-to-use, low-cost, prototype programmer. It  
connects to the PC via a COM (RS-232) port. MPLAB  
Integrated Development Environment software makes  
using the programmer simple and efficient. The  
PICSTART Plus Development Programmer supports  
most PIC devices in DIP packages up to 40 pins.  
Larger pin count devices, such as the PIC16C92X and  
PIC17C76X, may be supported with an adapter socket.  
The PICSTART Plus Development Programmer is CE  
compliant.  
A wide variety of demonstration, development and  
evaluation boards for various PIC MCUs and dsPIC  
DSCs allows quick application development on fully func-  
tional systems. Most boards include prototyping areas for  
adding custom circuitry and provide application firmware  
and source code for examination and modification.  
The boards support a variety of features, including LEDs,  
temperature sensors, switches, speakers, RS-232  
interfaces, LCD displays, potentiometers and additional  
EEPROM memory.  
The demonstration and development boards can be  
used in teaching environments, for prototyping custom  
circuits and for learning about various microcontroller  
applications.  
12.12 PICkit 2 Development Programmer  
The PICkit™ 2 Development Programmer is a low-cost  
programmer and selected Flash device debugger with  
an easy-to-use interface for programming many of  
Microchip’s baseline, mid-range and PIC18F families of  
Flash memory microcontrollers. The PICkit 2 Starter Kit  
includes a prototyping development board, twelve  
sequential lessons, software and HI-TECH’s PICC™  
Lite C compiler, and is designed to help get up to speed  
quickly using PIC® microcontrollers. The kit provides  
everything needed to program, evaluate and develop  
applications using Microchip’s powerful, mid-range  
Flash memory family of microcontrollers.  
In addition to the PICDEM™ and dsPICDEM™ demon-  
stration/development board series of circuits, Microchip  
has a line of evaluation kits and demonstration software  
®
for analog filter design, KEELOQ security ICs, CAN,  
IrDA®, PowerSmart battery management, SEEVAL®  
evaluation system, Sigma-Delta ADC, flow rate  
sensing, plus many more.  
Check the Microchip web page (www.microchip.com)  
for the complete list of demonstration, development  
and evaluation kits.  
DS41270E-page 72  
© 2007 Microchip Technology Inc.  
PIC10F220/222  
13.0 PACKAGING INFORMATION  
13.1 Package Marking Information  
6-Lead SOT-23*  
Example  
XXNN  
20JR  
8-Lead PDIP  
Example  
PIC10F220  
I/P 07Q  
0520  
XXXXXXXX  
XXXXXNNN  
YYWW  
e
3
8-Lead DFN*  
Example  
XXX  
YWW  
NN  
BJ0  
625  
3Q  
Legend: XX...X Customer-specific information  
Y
YY  
WW  
NNN  
Year code (last digit of calendar year)  
Year code (last 2 digits of calendar year)  
Week code (week of January 1 is week ‘01’)  
Alphanumeric traceability code  
e
3
Pb-free JEDEC designator for Matte Tin (Sn)  
*
This package is Pb-free. The Pb-free JEDEC designator (  
can be found on the outer packaging for this package.  
)
e3  
Note: In the event the full Microchip part number cannot be marked on one line, it will  
be carried over to the next line, thus limiting the number of available  
characters for customer-specific information.  
© 2007 Microchip Technology Inc.  
DS41270E-page 73  
PIC10F220/222  
TABLE 13-1: 8-LEAD 2x3 DFN (MC) TOP  
MARKING  
TABLE 13-2: 6-LEAD SOT-23 (OT)  
PACKAGE TOP MARKING  
Part Number  
Marking  
Part Number  
Marking  
PIC10F220-I/MC  
PIC10F220-E/MC  
PIC10F222-I/MC  
PIC10F222-E/MC  
BJ0  
BK0  
BL0  
BM0  
PIC10F220-I/OT  
PIC10F220-E/OT  
PIC10F222-I/OT  
PIC10F222-E/OT  
20NN  
A0NN  
22NN  
A2NN  
Note:  
NN  
represents  
the  
alphanumeric  
traceability code.  
DS41270E-page 74  
© 2007 Microchip Technology Inc.  
PIC10F220/222  
6-Lead Plastic Small Outline Transistor (OT) [SOT-23]  
Note: For the most current package drawings, please see the Microchip Packaging Specification located at  
http://www.microchip.com/packaging  
b
4
N
E
E1  
PIN 1 ID BY  
LASER MARK  
1
2
3
e
e1  
D
c
A
φ
A2  
L
A1  
L1  
Units  
MILLIMETERS  
Dimension Limits  
MIN  
NOM  
MAX  
Number of Pins  
Pitch  
N
e
6
0.95 BSC  
Outside Lead Pitch  
Overall Height  
Molded Package Thickness  
Standoff  
Overall Width  
Molded Package Width  
Overall Length  
Foot Length  
Footprint  
Foot Angle  
Lead Thickness  
Lead Width  
e1  
A
A2  
A1  
E
E1  
D
L
1.90 BSC  
0.90  
0.89  
0.00  
2.20  
1.30  
2.70  
0.10  
0.35  
0°  
1.45  
1.30  
0.15  
3.20  
1.80  
3.10  
0.60  
0.80  
30°  
L1  
φ
c
0.08  
0.20  
0.26  
0.51  
b
Notes:  
1. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.127 mm per side.  
2. Dimensioning and tolerancing per ASME Y14.5M.  
BSC: Basic Dimension. Theoretically exact value shown without tolerances.  
Microchip Technology Drawing C04-028B  
© 2007 Microchip Technology Inc.  
DS41270E-page 75  
PIC10F220/222  
8-Lead Plastic Dual In-Line (P) – 300 mil Body [PDIP]  
Note: For the most current package drawings, please see the Microchip Packaging Specification located at  
http://www.microchip.com/packaging  
N
NOTE 1  
E1  
3
1
2
D
E
A2  
A
L
A1  
c
e
eB  
b1  
b
Units  
INCHES  
Dimension Limits  
MIN  
NOM  
8
.100 BSC  
.130  
.310  
.250  
.365  
.130  
.010  
.060  
.018  
MAX  
Number of Pins  
Pitch  
Top to Seating Plane  
Molded Package Thickness  
Base to Seating Plane  
Shoulder to Shoulder Width  
Molded Package Width  
Overall Length  
N
e
A
A2  
A1  
E
E1  
D
L
c
b1  
b
eB  
.210  
.195  
.115  
.015  
.290  
.240  
.348  
.115  
.008  
.040  
.014  
.325  
.280  
.400  
.150  
.015  
.070  
.022  
.430  
Tip to Seating Plane  
Lead Thickness  
Upper Lead Width  
Lower Lead Width  
Overall Row Spacing §  
Notes:  
1. Pin 1 visual index feature may vary, but must be located with the hatched area.  
2. § Significant Characteristic.  
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.  
4. Dimensioning and tolerancing per ASME Y14.5M.  
BSC: Basic Dimension. Theoretically exact value shown without tolerances.  
Microchip Technology Drawing C04-018B  
DS41270E-page 76  
© 2007 Microchip Technology Inc.  
PIC10F220/222  
8-Lead Plastic Dual Flat, No Lead Package (MC) – 2x3x0.9 mm Body [DFN]  
Note: For the most current package drawings, please see the Microchip Packaging Specification located at  
http://www.microchip.com/packaging  
e
D
b
N
N
L
K
E2  
E
EXPOSED PAD  
NOTE 1  
NOTE 1  
2
1
1
2
D2  
BOTTOM VIEW  
TOP VIEW  
A
NOTE 2  
A3  
A1  
Units  
MILLIMETERS  
Dimension Limits  
MIN  
NOM  
8
0.50 BSC  
0.90  
MAX  
Number of Pins  
Pitch  
Overall Height  
Standoff  
Contact Thickness  
Overall Length  
Overall Width  
N
e
A
A1  
A3  
D
0.80  
0.00  
1.00  
0.05  
0.02  
0.20 REF  
2.00 BSC  
3.00 BSC  
0.25  
E
Exposed Pad Length  
Exposed Pad Width  
Contact Width  
Contact Length  
Contact-to-Exposed Pad  
D2  
E2  
b
L
K
1.30  
1.50  
0.18  
0.30  
0.20  
1.75  
1.90  
0.30  
0.50  
0.40  
Notes:  
1. Pin 1 visual index feature may vary, but must be located within the hatched area.  
2. Package may have one or more exposed tie bars at ends.  
3. Package is saw singulated.  
4. Dimensioning and tolerancing per ASME Y14.5M.  
BSC: Basic Dimension. Theoretically exact value shown without tolerances.  
REF: Reference Dimension, usually without tolerance, for information purposes only.  
Microchip Technology Drawing C04-123B  
© 2007 Microchip Technology Inc.  
DS41270E-page 77  
PIC10F220/222  
APPENDIX A: REVISION HISTORY  
Revision A  
Original release of document.  
Revision B (03/2006)  
Table 3-1, GP1; Section 4.7, Program Counter; Table 5-  
2; Figure 8-5; Section 9.1, ANDWF, SLEEP, SUBWF,  
SWAPF, XORLW.  
Revision C (08/2006)  
Added 8-Lead DFN pinout diagram, updated Table 1-1  
with DFN package, updated Table 10-3 in Section 10.0,  
added 8-Lead DFN package marking information to  
section 13.0, updated the Product Identification  
System section to include DFN package identification.  
Added note to package drawings.  
Revision D (02/2007)  
Replaced Dev. Tool Section; Replaced Package  
Drawings.  
Revision E (06/2007)  
Updated and added Characterization Data; Revised  
Operating Current; Revised Section 8.4 and Note;  
Revised Section 10.0, Total Power Dissipation, 10.1,  
10.2, 10.3 DC Characteristics; Revised Tables 10-2,  
10-3, 10-5, 10-6; Section 11.0; Revised Product ID  
System.  
DS41270E-page 78  
© 2007 Microchip Technology Inc.  
PIC10F220/222  
INDEX  
A
M
A/D  
Memory Organization ......................................................... 13  
Data Memory.............................................................. 14  
Program Memory (PIC10F220) .................................. 13  
Program Memory (PIC10F222) .................................. 13  
Microchip Internet Web Site................................................ 75  
MPLAB ASM30 Assembler, Linker, Librarian..................... 62  
MPLAB ICD 2 In-Circuit Debugger..................................... 63  
MPLAB ICE 2000 High-Performance Universal  
Specifications.............................................................. 60  
ADC  
Internal Sampling Switch (RSS) IMPEDANCE ................ 32  
Source Impedance...................................................... 32  
ALU ....................................................................................... 9  
Assembler  
MPASM Assembler..................................................... 62  
In-Circuit Emulator...................................................... 63  
MPLAB Integrated Development Environment Software.... 61  
MPLAB PM3 Device Programmer ...................................... 63  
MPLAB REAL ICE In-Circuit Emulator System .................. 63  
MPLINK Object Linker/MPLIB Object Librarian.................. 62  
B
Block Diagram  
On-Chip Reset Circuit................................................. 36  
Timer0......................................................................... 25  
TMR0/WDT Prescaler................................................. 28  
Watchdog Timer.......................................................... 39  
Block Diagrams  
O
OPTION Register................................................................ 17  
OSCCAL Register............................................................... 18  
Oscillator Configurations..................................................... 34  
Oscillator Types  
Analog Input Model..................................................... 32  
Brown-Out Protection Circuit .............................................. 40  
C
HS............................................................................... 34  
LP ............................................................................... 34  
C Compilers  
MPLAB C18 ................................................................ 62  
MPLAB C30 ................................................................ 62  
Carry ..................................................................................... 9  
Clocking Scheme ................................................................ 11  
Code Protection ............................................................ 33, 41  
Configuration Bits................................................................ 33  
Customer Change Notification Service ............................... 75  
Customer Notification Service............................................. 75  
Customer Support............................................................... 75  
P
PIC10F220/222 Device Varieties.......................................... 7  
PICSTART Plus Development Programmer....................... 64  
POR  
Device Reset Timer (DRT) ................................... 33, 38  
PD............................................................................... 39  
Power-on Reset (POR)............................................... 33  
TO............................................................................... 39  
Power-down Mode.............................................................. 40  
Prescaler ............................................................................ 27  
Program Counter................................................................ 19  
D
DC and AC Characteristics................................................. 65  
Development Support ......................................................... 61  
Digit Carry............................................................................. 9  
Q
Q cycles.............................................................................. 11  
E
R
Errata .................................................................................... 3  
Reader Response............................................................... 76  
Read-Modify-Write.............................................................. 23  
Register File Map  
F
Family of Devices  
PIC10F22X ................................................................... 5  
FSR..................................................................................... 20  
PIC10F220 ................................................................. 14  
PIC10F222 ................................................................. 14  
Registers  
Special Function......................................................... 14  
Reset .................................................................................. 33  
Reset on Brown-Out ........................................................... 40  
G
GPIO................................................................................... 21  
I
S
I/O Interfacing ..................................................................... 21  
I/O Ports.............................................................................. 21  
I/O Programming Considerations........................................ 23  
ID Locations.................................................................. 33, 41  
INDF.................................................................................... 20  
Indirect Data Addressing..................................................... 20  
Instruction Cycle ................................................................. 11  
Instruction Flow/Pipelining .................................................. 11  
Instruction Set Summary..................................................... 44  
Internal Sampling Switch (RSS) IMPEDANCE ........................ 32  
Internet Address.................................................................. 75  
Sleep ............................................................................ 33, 40  
Software Simulator (MPLAB SIM) ...................................... 62  
Special Features of the CPU .............................................. 33  
Special Function Registers................................................. 14  
Stack................................................................................... 19  
STATUS Register ..................................................... 9, 15, 29  
T
Timer0  
Timer0 ........................................................................ 25  
Timer0 (TMR0) Module .............................................. 25  
TMR0 with External Clock .......................................... 26  
Timing Parameter Symbology and Load Conditions .......... 57  
TRIS Registers ................................................................... 21  
L
Loading of PC ..................................................................... 19  
© 2007 Microchip Technology Inc.  
DS41270E-page 79  
PIC10F220/222  
W
Wake-up from Sleep ...........................................................41  
Watchdog Timer (WDT) ................................................ 33, 38  
Period..........................................................................38  
Programming Considerations .....................................38  
WWW Address....................................................................75  
WWW, On-Line Support........................................................3  
Z
Zero bit..................................................................................9  
DS41270E-page 80  
© 2007 Microchip Technology Inc.  
PIC10F220/222  
THE MICROCHIP WEB SITE  
CUSTOMER SUPPORT  
Microchip provides online support via our WWW site at  
www.microchip.com. This web site is used as a means  
to make files and information easily available to  
customers. Accessible by using your favorite Internet  
browser, the web site contains the following  
information:  
Users of Microchip products can receive assistance  
through several channels:  
• Distributor or Representative  
• Local Sales Office  
• Field Application Engineer (FAE)  
Technical Support  
Product Support – Data sheets and errata,  
application notes and sample programs, design  
resources, user’s guides and hardware support  
documents, latest software releases and archived  
software  
• Development Systems Information Line  
Customers  
should  
contact  
their  
distributor,  
representative or field application engineer (FAE) for  
support. Local sales offices are also available to help  
customers. A listing of sales offices and locations is  
included in the back of this document.  
General Technical Support – Frequently Asked  
Questions (FAQ), technical support requests,  
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program member listing  
Technical support is available through the web site  
at: http://support.microchip.com  
Business of Microchip – Product selector and  
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listing of seminars and events, listings of  
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Microchip’s customer notification service helps keep  
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specified product family or development tool of interest.  
To register, access the Microchip web site at  
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Notification and follow the registration instructions.  
© 2007 Microchip Technology Inc.  
DS41270E-page 81  
PIC10F220/222  
READER RESPONSE  
It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip prod-  
uct. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation  
can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150.  
Please list the following information, and use this outline to provide us with your comments about this document.  
To:  
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Telephone: (_______) _________ - _________  
FAX: (______) _________ - _________  
Application (optional):  
Would you like a reply?  
Y
N
PIC10F220/222  
DS41270E  
Literature Number:  
Device:  
Questions:  
1. What are the best features of this document?  
2. How does this document meet your hardware and software development needs?  
3. Do you find the organization of this document easy to follow? If not, why?  
4. What additions to the document do you think would enhance the structure and subject?  
5. What deletions from the document could be made without affecting the overall usefulness?  
6. Is there any incorrect or misleading information (what and where)?  
7. How would you improve this document?  
DS41270E-page 82  
© 2007 Microchip Technology Inc.  
PIC10F220/222  
PRODUCT IDENTIFICATION SYSTEM  
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.  
PART NO.  
Device  
X
/XX  
XXX  
Examples:  
Temperature  
Range  
Package  
Pattern  
a)  
b)  
PIC10F220-I/P = Industrial temp., PDIP  
package (Pb-free)  
PIC10F222T-E/OT = Extended temp., SOT-23  
package (Pb-free), Tape and Reel  
c)  
PIC10F222-E/MC = Extended temp., DFN  
package (Pb-free)  
Device:  
PIC10F220  
PIC10F222  
PIC10F220T (Tape & Reel)  
PIC10F222T (Tape & Reel)  
Temperature  
Range:  
I
E
=
=
-40°C to +85°C (Industrial)  
-40°C to +125°C (Extended)  
Package:  
Pattern:  
P
=
=
=
300 mil PDIP (Pb-free)  
SOT-23, 6-LD (Pb-free)  
DFN, 8-LD 2x3 (Pb-free)  
OT  
MC  
Special Requirements  
© 2007 Microchip Technology Inc.  
DS41270E-page 83  
WORLDWIDE SALES AND SERVICE  
AMERICAS  
ASIA/PACIFIC  
ASIA/PACIFIC  
EUROPE  
Corporate Office  
Asia Pacific Office  
Suites 3707-14, 37th Floor  
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Tel: 852-2401-1200  
Fax: 852-2401-3431  
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Tel: 91-80-4182-8400  
Fax: 91-80-4182-8422  
Austria - Wels  
Tel: 43-7242-2244-39  
Fax: 43-7242-2244-393  
2355 West Chandler Blvd.  
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Tel: 480-792-7200  
Fax: 480-792-7277  
Technical Support:  
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Tel: 45-4450-2828  
Fax: 45-4485-2829  
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China - Shenzhen  
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Fax: 886-7-536-4803  
Los Angeles  
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Tel: 949-462-9523  
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China - Shunde  
Tel: 86-757-2839-5507  
Fax: 86-757-2839-5571  
Taiwan - Taipei  
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Fax: 886-2-2508-0102  
Santa Clara  
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Fax: 408-961-6445  
China - Wuhan  
Tel: 86-27-5980-5300  
Fax: 86-27-5980-5118  
Thailand - Bangkok  
Tel: 66-2-694-1351  
Fax: 66-2-694-1350  
Toronto  
Mississauga, Ontario,  
Canada  
Tel: 905-673-0699  
Fax: 905-673-6509  
China - Xian  
Tel: 86-29-8833-7252  
Fax: 86-29-8833-7256  
06/25/07  
DS41270E-page 84  
© 2007 Microchip Technology Inc.  

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