PIC12LF1572 [MICROCHIP]

HIGH-VOLTAGE ICSP PROGRAMMING;
PIC12LF1572
型号: PIC12LF1572
厂家: MICROCHIP    MICROCHIP
描述:

HIGH-VOLTAGE ICSP PROGRAMMING

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PIC12(L)F1571/2  
PIC12(L)F1571/2 Memory Programming Specification  
1.1.2  
LOW-VOLTAGE ICSP  
PROGRAMMING  
This document includes the  
programming specifications for the  
following devices:  
In Low-Voltage ICSP mode, these devices can be  
programmed using a single VDD source in the  
operating range. The MCLR/VPP pin does not have to  
be brought to a different voltage, but can instead be left  
at the normal operating voltage.  
• PIC12F1571 • PIC12LF1571  
• PIC12F1572 • PIC12LF1572  
1.0  
OVERVIEW  
1.1.2.1  
Single-Supply ICSP Programming  
The device can be programmed using either the high-  
voltage In-Circuit Serial Programming™ (ICSP™)  
method or the low-voltage ICSP method.  
The LVP bit in Configuration Word 2 enables single-  
supply (low-voltage) ICSP programming. The LVP bit  
defaults to a ‘1’ (enabled) from the factory. The LVP bit  
may only be programmed to ‘0’ by entering the High-  
Voltage ICSP mode, where the MCLR/VPP pin is raised  
to VIHH. Once the LVP bit is programmed to a ‘0’, only  
the High-Voltage ICSP mode is available and only the  
High-Voltage ICSP mode can be used to program the  
device.  
1.1  
Hardware Requirements  
1.1.1  
HIGH-VOLTAGE ICSP  
PROGRAMMING  
In High-Voltage ICSP mode, the device requires two  
programmable power supplies: one for VDD and one for  
the MCLR/VPP pin.  
Note 1: The High-Voltage ICSP mode is always  
available, regardless of the state of the  
LVP bit, by applying VIHH to the MCLR/  
VPP pin.  
2: While in Low-Voltage ICSP mode, MCLR  
is always enabled, regardless of the  
MCLRE bit, and the port pin can no  
longer be used as a general purpose  
input.  
1.2  
Pin Utilization  
Five pins are needed for ICSP programming. The pins  
are listed in Table 1-1.  
TABLE 1-1:  
Pin Name  
PIN DESCRIPTIONS DURING PROGRAMMING FOR PIC12(L)F1571/2  
During Programming  
Function  
Pin Type  
Pin Description  
ICSPCLK  
ICSPDAT  
ICSPCLK  
ICSPDAT  
I
Clock Input – Schmitt Trigger Input  
I/O  
Data Input/Output – Schmitt Trigger Input  
MCLR/VPP  
VDD  
Program/Verify mode  
P(1)  
P
Program Mode Select/Programming Power Supply  
VDD  
VSS  
Power Supply  
Ground  
VSS  
P
Legend: I = Input, O = Output, P = Power  
Note 1: The programming high voltage is internally generated. To activate the Program/Verify mode, high voltage  
needs to be applied to MCLR input. Since the MCLR is used for a level source, MCLR does not draw any  
significant current.  
2013 Microchip Technology Inc.  
DS40001713A-page 1  
PIC12(L)F1571/2  
2.0  
DEVICE PINOUTS  
The pin diagram for the PIC12(L)F1571/2 family is  
shown in Figure 2-1. The pins that are required for  
programming are listed in Table 1-1 and shown in bold  
lettering in the pin diagram.  
FIGURE 2-1:  
8-PIN DIAGRAM FOR PIC12(L)F1571/2  
PDIP, SOIC, DFN, MSOP  
VDD  
1
VSS  
8
7
6
5
RA5  
RA4  
RA0/ICSPDAT  
2
3
4
RA1/ICSPCLK  
RA3/MCLR/VPP  
RA2  
DS40001713A-page 2  
2013 Microchip Technology Inc.  
PIC12(L)F1571/2  
3.0  
MEMORY MAP  
The memory is broken into two sections: program  
memory and configuration memory.  
FIGURE 3-1:  
PIC12(L)F1571 PROGRAM MEMORY MAPPING  
1 KW  
0000h  
03FF  
Implemented  
h
Maps to  
0-03FFh  
Program Memory  
User ID Location  
User ID Location  
User ID Location  
User ID Location  
Reserved  
8000h  
8001h  
8002h  
8003h  
7FFF  
h
8000h  
Implemented  
8200  
h
8004h  
8005h  
8006h  
8007h  
Revision ID  
Device ID  
Maps to  
8000-81FF  
Configuration Memory  
Configuration Word 1  
Configuration Word 2  
Calibration Word 1  
Calibration Word 2  
Calibration Word 3  
Reserved  
8008h  
8009h  
800Ah  
FFFF  
h
800Bh  
800Ch  
800Dh  
Reserved  
Reserved  
800Eh  
800Fh  
Reserved  
Reserved  
8010h  
Reserved  
8011h-81FFh  
2013 Microchip Technology Inc.  
DS40001713A-page 3  
PIC12(L)F1571/2  
FIGURE 3-2:  
PIC12(L)F1572 PROGRAM MEMORY MAPPING  
2 KW  
0000h  
07FF  
Implemented  
h
Maps to  
0-07FFh  
Program Memory  
User ID Location  
User ID Location  
User ID Location  
User ID Location  
Reserved  
8000h  
8001h  
8002h  
8003h  
7FFF  
h
8000h  
Implemented  
8200  
h
8004h  
8005h  
8006h  
8007h  
Revision ID  
Device ID  
Maps to  
8000-81FF  
Configuration Memory  
Configuration Word 1  
Configuration Word 2  
Calibration Word 1  
Calibration Word 2  
Calibration Word 3  
Reserved  
8008h  
8009h  
800Ah  
FFFF  
h
800Bh  
800Ch  
800Dh  
Reserved  
Reserved  
800Eh  
800Fh  
Reserved  
Reserved  
8010h  
Reserved  
8011h-81FFh  
DS40001713A-page 4  
2013 Microchip Technology Inc.  
PIC12(L)F1571/2  
3.1  
User ID Location  
A user may store identification information (user ID) in  
four designated locations. The user ID locations are  
mapped to 8000h-8003h. Each location is 14 bits in  
length. Code protection has no effect on these memory  
locations. Each location may be read with code  
protection enabled or disabled.  
Note:  
MPLAB® IDE only displays the seven  
Least Significant bits (LSb) of each user  
ID location; the upper bits are not read. It  
is recommended that only the seven LSbs  
be used if MPLAB IDE is the primary tool  
used to read these addresses.  
3.2  
Revision ID  
The revision ID word is located at 8005h. This location  
is read-only and cannot be erased or modified.  
3.3  
Device ID  
The device ID word is located at 8006h. This location is  
read-only and cannot be erased or modified.  
3.4  
Configuration Words  
The device has two Configuration Words,  
Configuration Word 1 (8007h) and Configuration Word  
2
(8008h). The individual bits within these  
Configuration Words are used to enable or disable  
device functions such as the Brown-out Reset, code  
protection and Power-up Timer.  
3.5  
Calibration Words  
The internal calibration values are factory-calibrated  
and stored in the Calibration Word locations. See  
Figure 3-1 for address information.  
The Calibration Words do not participate in erase  
operations. The device can be erased without affecting  
the Calibration Words.  
2013 Microchip Technology Inc.  
DS40001713A-page 5  
PIC12(L)F1571/2  
REGISTER 3-1:  
DEVICEID: DEVICE ID REGISTER(1)  
R
R
R
R
R
R
R
R
R
R
DEV<13:8>  
bit 13  
bit 8  
bit 0  
R
R
R
R
DEV<7:0>  
bit 7  
Legend:  
R = Readable bit  
‘0’ = Bit is cleared  
x = Bit is unknown  
‘1’ = Bit is set  
bit 13-0  
DEV<13:0>: Device ID bits  
Refer to Table 3-1 to determine what these bits will read on which device. A value of 3FFFh is invalid.  
Note 1: This location cannot be written.  
REGISTER 3-2:  
REVISIONID: REVISION ID REGISTER(1)  
R
R
R
R
R
R
R
R
R
REV<13:8>  
bit 13  
bit 8  
bit 0  
R
R
R
R
R
REV<7:0>  
bit 7  
Legend:  
R = Readable bit  
‘0’ = Bit is cleared  
x = Bit is unknown  
‘1’ = Bit is set  
bit 13-0  
REV<13:0>: Revision ID bits  
These bits are used to identify the device revision.  
Note 1: This location cannot be written.  
TABLE 3-1:  
DEVICE ID VALUES  
DEVICE  
Device ID  
Revision ID  
PIC12F1571  
PIC12LF1571  
PIC12F1572  
PIC12LF1572  
3051h  
3053h  
3050h  
3052h  
2xxxh  
2xxxh  
2xxxh  
2xxxh  
DS40001713A-page 6  
2013 Microchip Technology Inc.  
PIC12(L)F1571/2  
REGISTER 3-3:  
CONFIGURATION WORD 1  
U-1  
U-1  
R/P-1  
R/P-1  
R/P-1  
(1)  
U-1  
CLKOUTEN  
BOREN<1:0>  
bit 13  
bit 8  
bit 0  
R/P-1  
R/P-1  
R/P-1  
R/P-1  
R/P-1  
U-1  
R/P-1  
R/P-1  
(2)  
(1)  
CP  
MCLRE  
PWRTE  
WDTE<1:0>  
FOSC<1:0>  
bit 7  
Legend:  
R = Readable bit  
‘0’ = Bit is cleared  
P = Programmable bit  
‘1’ = Bit is set  
U = Unimplemented bit, read as ‘1’  
n = Value when blank or after Bulk Erase  
bit 13-12  
bit 11  
Unimplemented: Read as ‘1’  
CLKOUTEN: Clock Out Enable bit  
1
0
= OFF - CLKOUT function is disabled. I/O or oscillator function on CLKOUT pin  
= ON  
- CLKOUT function is enabled on CLKOUT pin  
(1)  
bit 10-9  
BOREN<1:0>: Brown-out Reset Enable bits  
11 = ON  
- Brown-out Reset enabled. The SBOREN bit is ignored.  
10 = SLEEP - Brown-out Reset enabled while running and disabled in Sleep. The SBOREN bit is ignored.  
01 = SBODEN- Brown-out Reset controlled by the SBOREN bit in the PCON register  
00 = OFF  
- Brown-out Reset disabled. The SBOREN bit is ignored.  
bit 8  
bit 7  
Unimplemented: Read as ‘1’  
(2)  
CP: Flash Program Memory Code Protection bit  
1 = OFF - Code protection off. Program Memory can be read and written.  
0 = ON - Code protection on. Program Memory cannot be read or written externally.  
bit 6  
MCLRE: MCLR/VPP Pin Function Select bit  
If LVP bit = 1 (ON):  
This bit is ignored. MCLR/VPP pin function is MCLR; Weak pull-up enabled.  
If LVP bit = 0 (OFF):  
1 = ON - MCLR/VPP pin function is MCLR; Weak pull-up enabled.  
0 = OFF - MCLR/VPP pin function is digital input; MCLR internally disabled; Weak pull-up under control of pin’s WPU  
control bit.  
(1)  
bit 5  
PWRTE: Power-up Timer Enable bit  
1 = OFF- PWRT disabled  
0 = ON - PWRT enabled  
bit 4-3  
WDTE<1:0>: Watchdog Timer Enable bit  
11 = ON  
- WDT enabled. SWDTEN is ignored.  
10 = SLEEP - WDT enabled while running and disabled in Sleep. SWDTEN is ignored.  
01 = SWDTEN- WDT controlled by the SWDTEN bit in the WDTCON register  
00 = OFF  
- WDT disabled. SWDTEN is ignored.  
bit 2  
Unimplemented: Read as ‘1’  
bit 1-0  
FOSC<1:0>: Oscillator Selection bits  
11 = ECH  
10 = ECM  
01 = ECL  
- External Clock, High-Power mode: CLKI on OSC1/CLKI  
- External Clock, Medium-Power mode: CLKI on OSC1/CLKI  
- External Clock, Low-Power mode: CLKI on OSC1/CLKI  
00 = INTOSC- I/O function on OSC1/CLKI  
Note 1: Enabling Brown-out Reset does not automatically enable Power-up Timer.  
2: Once enabled, code-protect can only be disabled by bulk erasing the device.  
2013 Microchip Technology Inc.  
DS40001713A-page 7  
PIC12(L)F1571/2  
REGISTER 3-4:  
CONFIGURATION WORD 2  
R/P-1  
LVP(1)  
R/P-1  
DEBUG(2)  
R/P-1  
R/P-1  
BORV(3)  
R/P-1  
R/P-1  
LPBOREN  
STVREN  
PLLEN  
bit 13  
bit 8  
U-1  
U-1  
U-1  
U-1  
U-1  
U-1  
R/P-1  
R/P-1  
WRT<1:0>  
bit 7  
bit 0  
Legend:  
R = Readable bit  
‘0’ = Bit is cleared  
P = Programmable bit  
‘1’ = Bit is set  
U = Unimplemented bit, read as ‘1’  
n = Value when blank or after Bulk Erase  
bit 13  
LVP: Low-Voltage Programming Enable bit(1)  
1 = ON  
- Low-voltage programming enabled. MCLR/VPP pin function is MCLR. MCLRE  
Configuration bit is ignored.  
0 = OFF  
- High Voltage on MCLR/VPP must be used for programming  
bit 12  
bit 11  
bit 10  
bit 9  
DEBUG: Debugger Mode bit(2)  
1 = OFF - In-Circuit Debugger disabled; ICSPCLK and ICSPDAT are general purpose I/O pins.  
0 = ON  
- In-Circuit Debugger enabled; ICSPCLK and ICSPDAT are dedicated to the debugger.  
LPBOREN: Low-Power Brown-out Reset Enable bit  
1 = OFF - Low-power Brown-out Reset is disabled  
0 = ON  
- Low-power Brown-out Reset is enabled  
BORV: Brown-out Reset Voltage Selection bit(3)  
1 = LOW - Brown-out Reset voltage (Vbor), low trip point selected  
0 = HIGH - Brown-out Reset voltage (Vbor), high trip point selected  
STVREN: Stack Overflow/Underflow Reset Enable bit  
1 = ON  
- Stack Overflow or Underflow will cause a Reset  
0 = OFF - Stack Overflow or Underflow will not cause a Reset  
bit 8  
PLLEN: PLL Enable bit  
1 = ON  
- 4xPLL enabled  
0 = OFF - 4xPLL disabled  
bit 7-2  
bit 1-0  
Unimplemented: Read as ‘1’  
WRT<1:0>: Flash Memory Self-Write Protection bits  
2 kW Flash memory: (PIC12F1572):  
11 = OFF - Write protection off  
10 = BOOT - 000h to 1FFh write-protected, 200h to 7FFh may be modified by PMCON control  
01 = HALF - 000h to 3FFh write-protected, 400h to 7FFh may be modified by PMCON control  
00 = ALL - 000h to 7FFh write-protected, no addresses may be modified by PMCON control  
1 kW Flash memory: (PIC12F1571)  
11 = OFF - Write protection off  
10 = BOOT - 000h to 0FFh write-protected, 100h to 3FFh may be modified by PMCON control  
01 = HALF - 000h to 1FFh write-protected, 200h to 3FFh may be modified by PMCON control  
00 = ALL - 000h to 3FFh write-protected, no addresses may be modified by PMCON control  
Note 1: This bit cannot be programmed to ‘0’ when programming mode is entered via LVP.  
2: The DEBUG bit in Configuration Words is managed automatically by device development tools including  
debuggers and programmers. For normal device operation, this bit should be maintained as a ‘1’.  
3: See Vbor parameter for specific trip point voltages.  
DS40001713A-page 8  
2013 Microchip Technology Inc.  
PIC12(L)F1571/2  
4.1.3  
PROGRAM/VERIFY MODE EXIT  
4.0  
PROGRAM/VERIFY MODE  
To exit Program/Verify mode take MCLR to VDD or  
lower (VIL). See Figures 8-3 and 8-4.  
In Program/Verify mode, the program memory and the  
configuration memory can be accessed and  
programmed in serial fashion. ICSPDAT and  
ICSPCLK are used for the data and the clock,  
respectively. All commands and data words are  
transmitted LSb first. Data changes on the rising edge  
of the ICSPCLK and is latched on the falling edge. In  
Program/Verify mode, both the ICSPDAT and  
ICSPCLK are Schmitt Trigger inputs. The sequence  
that enters the device into Program/Verify mode  
places all other logic into the Reset state. Upon  
entering Program/Verify mode, all I/Os are  
automatically configured as high-impedance inputs  
and the address is cleared.  
4.2  
Low-Voltage Programming (LVP)  
Mode  
The Low-Voltage Programming mode allows the  
devices to be programmed using VDD only, without high  
voltage. When the LVP bit of the Configuration Word 2  
register is set to ‘1’, the low-voltage ICSP programming  
entry is enabled. To disable the Low-Voltage ICSP  
mode, the LVP bit must be programmed to ‘0’. This can  
only be done while in the High-Voltage Entry mode.  
Entry into the Low-Voltage ICSP Program/Verify mode  
requires the following steps:  
4.1  
High-Voltage Program/Verify Mode  
Entry and Exit  
1. MCLR is brought to VIL.  
2.  
A
32-bit key sequence is presented on  
ICSPDAT, while clocking ICSPCLK.  
There are two different methods of entering Program/  
Verify mode via high voltage:  
The key sequence is a specific 32-bit pattern, '0100  
1101 0100 0011 0100 1000 0101 0000'(more  
easily remembered as MCHP in ASCII). The device will  
enter Program/Verify mode only if the sequence is  
valid. The Least Significant bit of the Least Significant  
nibble must be shifted in first.  
• VPP – First entry mode  
• VDD – First entry mode  
4.1.1  
VPP – FIRST ENTRY MODE  
To enter Program/Verify mode via the VPP-first method,  
the following sequence must be followed:  
Once the key sequence is complete, MCLR must be  
held at VIL for as long as Program/Verify mode is to be  
maintained.  
1. Hold ICSPCLK and ICSPDAT low. All other pins  
should be unpowered.  
For low-voltage programming timing, see Figures 8-8  
and 8-9.  
2. Raise the voltage on MCLR from 0V to VIHH.  
3. Raise the voltage on VDD from 0V to the desired  
operating voltage.  
Exiting Program/Verify mode is done by no longer  
driving MCLR to VIL. See Figures 8-8 and 8-9.  
The VPP-first entry prevents the device from executing  
code prior to entering Program/Verify mode. For  
example, when the Configuration Word has MCLR  
disabled (MCLRE = 0), the power-up time is disabled  
(PWRTE = 0), the internal oscillator is selected  
(FOSC = 100), and RA0 and RA1 are driven by the user  
application, the device will execute code. Since this  
may prevent entry, VPP-first entry mode is strongly  
recommended. See the timing diagram in Figure 8-2.  
Note:  
To enter LVP mode, the LSb of the Least  
Significant nibble must be shifted in first.  
This differs from entering the key  
sequence on other parts.  
4.1.2  
VDD – FIRST ENTRY MODE  
To enter Program/Verify mode via the VDD-first method,  
the following sequence must be followed:  
1. Hold ICSPCLK and ICSPDAT low.  
2. Raise the voltage on VDD from 0V to the desired  
operating voltage.  
3. Raise the voltage on MCLR from VDD or below  
to VIHH.  
The VDD-first method is useful when programming the  
device when VDD is already applied, for it is not  
necessary to disconnect VDD to enter Program/Verify  
mode. See the timing diagram in Figure 8-1.  
2013 Microchip Technology Inc.  
DS40001713A-page 9  
PIC12(L)F1571/2  
4.3  
Program/Verify Commands  
These devices implement 13 programming commands,  
each six bits in length. The commands are summarized  
in Table 4-1.  
Commands that have data associated with them are  
specified to have a minimum delay of TDLY between the  
command and the data. After this delay, 16 clocks are  
required to either clock in or clock out the 14-bit data  
word. The first clock is for the Start bit and the last clock  
is for the Stop bit.  
TABLE 4-1:  
COMMAND MAPPING  
Command  
Mapping  
Data/Note  
Binary (MSb … LSb)  
Hex  
Load Configuration  
x
x
x
x
x
0
0
0
0
1
0
1
0
0
1
0
0
0
0
0
1
1
1
1
0
0
0
1
1
1
0
0
0
0
0
0
1
0
1
1
0
0
1
0
0
0
0
0
0
0
0
0
0
1
1
00h 0, data (14), 0  
02h 0, data (14), 0  
04h 0, data (14), 0  
Load Data For Program Memory  
Read Data From Program Memory  
Increment Address  
06h  
16h  
08h  
18h  
0Ah  
09h  
11h  
Reset Address  
Begin Internally Timed Programming x  
Begin Externally Timed Programming x  
End Externally Timed Programming  
Bulk Erase Program Memory  
Row Erase Program Memory  
x
x
x
Internally Timed  
Internally Timed  
DS40001713A-page 10  
2013 Microchip Technology Inc.  
PIC12(L)F1571/2  
4.3.1  
LOAD CONFIGURATION  
The Load Configuration command is used to access  
the configuration memory (User ID Locations,  
Configuration Words, Calibration Words). The Load  
Configuration command sets the address to 8000h and  
loads the data latches with one word of data (see  
Figure 4-1).  
Note:  
Externally timed writes are not supported  
for Configuration and Calibration bits. Any  
externally timed write to the Configuration  
or Calibration Word will have no effect on  
the targeted word.  
The only way to get back to the program memory  
(address 0) is to exit Program/Verify mode or issue the  
Reset Address command after the configuration memory  
has been accessed by the Load Configuration command.  
After issuing the Load Configuration command, use the  
Increment Address command until the proper address  
to be programmed is reached. The address is then  
programmed by issuing either the Begin Internally  
Timed Programming or Begin Externally Timed  
Programming command.  
FIGURE 4-1:  
LOAD CONFIGURATION  
1
2
3
4
5
16  
6
1
2
15  
TDLY  
ICSPCLK  
ICSPDAT  
0
0
0
LSb  
MSb 0  
0
0
X
0
4.3.2  
LOAD DATA FOR PROGRAM  
MEMORY  
The Load Data for Program Memory command is used to  
load one 14-bit word into the data latches. The word  
programs into program memory after the Begin Internally  
Timed Programming or Begin Externally Timed  
Programming command is issued (see Figure 4-2).  
FIGURE 4-2:  
LOAD DATA FOR PROGRAM MEMORY  
1
2
3
4
5
16  
6
1
2
15  
TDLY  
ICSPCLK  
0
1
0
LSb  
MSb 0  
0
0
X
0
ICSPDAT  
2013 Microchip Technology Inc.  
DS40001713A-page 11  
PIC12(L)F1571/2  
4.3.3  
READ DATA FROM PROGRAM  
MEMORY  
The Read Data from Program Memory command will  
transmit data bits out of the program memory map  
currently accessed, starting with the second rising edge  
of the clock input. The ICSPDAT pin will go into Output  
mode on the first falling clock edge, and it will revert to  
Input mode (high-impedance) after the 16th falling edge  
of the clock. If the program memory is code-protected  
(CP), the data will be read as zeros (see Figure 4-3).  
FIGURE 4-3:  
READ DATA FROM PROGRAM MEMORY  
1
2
3
4
5
6
1
2
15  
16  
TDLY  
ICSPCLK  
ICSPDAT  
0
0
1
0
0
X
(from Programmer)  
ICSPDAT  
LSb  
MSb  
x
(from device)  
Input  
Output  
Input  
4.3.4  
INCREMENT ADDRESS  
The address is incremented when this command is  
received. It is not possible to decrement the address.  
To reset this counter, the user must use the Reset  
Address command or exit Program/Verify mode and  
re-enter it.  
If the address is incremented from address 7FFFh, it  
will wrap-around to location 0000h. If the address is  
incremented from FFFFh, it will wrap-around to location  
8000h (see Figure 4-4).  
FIGURE 4-4:  
INCREMENT ADDRESS  
Next Command  
1
2
3
4
5
2
6
1
3
TDLY  
ICSPCLK  
0
1
1
0
X
0
X
X
X
ICSPDAT  
Address  
Address + 1  
DS40001713A-page 12  
2013 Microchip Technology Inc.  
PIC12(L)F1571/2  
4.3.5  
RESET ADDRESS  
The Reset Address command will reset the address to  
0000h, regardless of the current value. The address is  
used in program memory or the configuration memory  
(see Figure 4-5).  
FIGURE 4-5:  
RESET ADDRESS  
Next Command  
1
2
3
4
5
6
1
2
3
TDLY  
ICSPCLK  
0
1
1
0
1
X
X
X
X
ICSPDAT  
Address  
0000h  
N
4.3.6  
BEGIN INTERNALLY TIMED  
PROGRAMMING  
A Load Configuration or Load Data for Program  
Memory command must be given before every Begin  
Programming command. Programming of the  
addressed memory will begin after this command is  
received. An internal timing mechanism executes the  
write. The user must allow for the program cycle time,  
TPINT, in order for the programming to complete.  
The End Externally Timed Programming command is  
not needed when the Begin Internally Timed  
Programming is used to start the programming.  
The program memory address that is being  
programmed is not erased prior to being programmed  
(see Figure 4-6).  
FIGURE 4-6:  
BEGIN INTERNALLY TIMED PROGRAMMING  
Next Command  
1
2
3
4
5
2
6
1
3
TPINT  
ICSPCLK  
0
0
0
X
1
0
X
X
X
ICSPDAT  
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DS40001713A-page 13  
PIC12(L)F1571/2  
4.3.7  
BEGIN EXTERNALLY TIMED  
PROGRAMMING  
A Load Configuration or Load Data for Program  
Memory command must be given before every Begin  
Programming command. Programming of the  
addressed memory will begin after this command is  
received. To complete the programming, the End  
Externally Timed Programming command must be sent  
in the specified time window defined by TPEXT (see  
Figure 4-7).  
Externally timed writes are not supported for  
Configuration and Calibration bits. Any externally timed  
write to the Configuration or Calibration Word will have  
no effect on the targeted word.  
FIGURE 4-7:  
BEGIN EXTERNALLY TIMED PROGRAMMING  
End Externally Timed Programming  
Command  
1
2
3
4
5
6
1
2
3
TPEXT  
ICSPCLK  
0
0
0
1
X
0
1
1
0
ICSPDAT  
4.3.8  
END EXTERNALLY TIMED  
PROGRAMMING  
This command is required after a Begin Externally  
Timed Programming command is given. This  
command must be sent within the time window  
specified by TPEXT after the Begin Externally Timed  
Programming command is sent.  
After sending the End Externally Timed Programming  
command, an additional delay (TDIS) is required before  
sending the next command. This delay is longer than  
the delay ordinarily required between other commands  
(see Figure 4-8).  
FIGURE 4-8:  
END EXTERNALLY TIMED PROGRAMMING  
Next Command  
1
2
3
4
5
6
1
2
3
TDIS  
ICSPCLK  
1
0
0
1
1
X
X
X
X
ICSPDAT  
DS40001713A-page 14  
2013 Microchip Technology Inc.  
PIC12(L)F1571/2  
After receiving the Bulk Erase Program Memory  
command, the erase will not complete until the time  
interval, TERAB, has expired.  
4.3.9  
BULK ERASE PROGRAM MEMORY  
The Bulk Erase Program Memory command performs  
two different functions dependent on the current state  
of the address.  
Note:  
The code protection Configuration bit  
(CP) has no effect on the Bulk Erase  
Program Memory command.  
Address 0000h-7FFFh:  
Program Memory is erased  
Configuration Words are erased  
Address 8000h-8008h:  
Program Memory is erased  
Configuration Words are erased  
User ID Locations are erased  
A Bulk Erase Program Memory command should not  
be issued when the address is greater than 8008h.  
FIGURE 4-9:  
BULK ERASE PROGRAM MEMORY  
Next Command  
1
2
3
4
5
6
1
2
3
TERAB  
ICSPCLK  
ICSPDAT  
0
1
0
1
0
X
X
X
X
4.3.10  
ROW ERASE PROGRAM MEMORY  
The Row Erase Program Memory command will erase  
an individual row. Refer to Table 4-2 for row sizes of  
specific devices and the PC bits used to address them.  
If the program memory is code-protected, the Row  
Erase Program Memory command will be ignored.  
When the address is 8000h-8008h, the Row Erase  
Program Memory command will only erase the user ID  
locations, regardless of the setting of the CP  
Configuration bit.  
After receiving the Row Erase Program Memory  
command, the erase will not complete until the time  
interval, TERAR, has expired (see Figure 4-10).  
FIGURE 4-10:  
ROW ERASE PROGRAM MEMORY  
Next Command  
1
2
3
4
5
2
6
1
3
TERAR  
ICSPCLK  
ICSPDAT  
0
1
0
X
0
1
X
X
X
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DS40001713A-page 15  
PIC12(L)F1571/2  
TABLE 4-2:  
PROGRAMMING ROW AND LATCH SIZES  
Erase Row Size  
(Number of 14-bit Words)  
Write Row Size  
(Number of 14-bit Latches)  
Devices  
PC  
PIC12F1571  
PIC12LF1571  
PIC12F1572  
PIC12LF1572  
<15:4>  
16  
16  
DS40001713A-page 16  
2013 Microchip Technology Inc.  
PIC12(L)F1571/2  
5.0  
PROGRAMMING ALGORITHMS  
The devices use internal latches to temporarily store  
the 14-bit words used for programming. Refer to  
Table 4-2 for specific latch information. The data  
latches allow the user to write the program words with  
a single Begin Externally Timed Programming or Begin  
Internally Timed Programming command. The Load  
Program Data or the Load Configuration command is  
used to load a single data latch. The data latch will hold  
the data until the Begin Externally Timed Programming  
or Begin Internally Timed Programming command is  
given.  
The lower bits of the address define the data latch  
addresses and are aligned with the LSbs of the  
address. The upper bits of the address define the Flash  
program memory row. The upper bits that define the  
row address are indicated in Table 4-2.  
When the Begin Externally Timed Programming or  
Begin Internally Timed Programming commands are  
given, the data contained in the data latches will be  
programmed into the corresponding addresses of the  
row specified by the upper bits of the PC. Writes cannot  
cross a physical row boundary. For example, in a  
16-word latch device, attempting to write from address  
0002h-0011h will result in data being written to 0010h-  
001Fh.  
If more than the maximum number of latches are  
written without a Begin Externally Timed Programming  
or Begin Internally Timed Programming command, the  
data in the data latches will be overwritten. The  
following figures show the recommended flowcharts for  
programming.  
2013 Microchip Technology Inc.  
DS40001713A-page 17  
PIC12(L)F1571/2  
FIGURE 5-1:  
DEVICE PROGRAM/VERIFY FLOWCHART  
Start  
Enter  
Programming Mode  
Bulk Erase  
Device  
Write Program  
(1)  
Memory  
Write User IDs  
Verify Program  
Memory  
Verify User IDs  
Write Configuration  
(2)  
Words  
Verify Configuration  
Words  
Exit Programming  
Mode  
Done  
Note 1: See Figure 5-2.  
2: See Figure 5-5.  
DS40001713A-page 18  
2013 Microchip Technology Inc.  
PIC12(L)F1571/2  
FIGURE 5-2:  
PROGRAM MEMORY FLOWCHART  
Start  
Bulk Erase  
Program  
(1, 2)  
Memory  
(3)  
Program Cycle  
Read Data  
from  
Program Memory  
Report  
No  
Programming  
Data Correct?  
Failure  
Yes  
Increment  
No  
All Locations  
Done?  
Address  
Command  
Yes  
Done  
Note 1: This step is optional if the device has already been erased or has not been previously programmed.  
2: If the device is code-protected or must be completely erased, then Bulk Erase the device per Figure 5-6.  
3: See Figure 5-3 or Figure 5-4.  
2013 Microchip Technology Inc.  
DS40001713A-page 19  
PIC12(L)F1571/2  
FIGURE 5-3:  
ONE-WORD PROGRAM CYCLE  
Program Cycle  
Load Data  
for  
Program Memory  
Begin  
Begin  
Programming  
Command  
(Internally timed)  
Programming  
Command  
(Externally timed)(1)  
Wait TPEXT  
Wait TPINT  
End  
Programming  
Command  
Wait TDIS  
Note 1: Externally timed writes are not supported for Configuration and Calibration bits.  
DS40001713A-page 20  
2013 Microchip Technology Inc.  
PIC12(L)F1571/2  
FIGURE 5-4:  
MULTIPLE-WORD PROGRAM CYCLE  
Program Cycle  
Load Data  
for  
Latch 1  
Program Memory  
Increment  
Address  
Command  
Load Data  
for  
Latch 2  
Program Memory  
Increment  
Address  
Command  
Load Data  
for  
Latch 32  
Program Memory  
Begin  
Begin  
Programming  
Programming  
Command  
Command  
(Internally timed)  
(Externally timed)  
Wait TPEXT  
Wait TPINT  
End  
Programming  
Command  
Wait TDIS  
2013 Microchip Technology Inc.  
DS40001713A-page 21  
PIC12(L)F1571/2  
FIGURE 5-5:  
CONFIGURATION MEMORY PROGRAM FLOWCHART  
Start  
Load  
Configuration  
Bulk Erase  
Program  
Memory(1)  
One-word  
Program Cycle(2)  
(User ID)  
Read Data  
From Program  
Memory Command  
Report  
Programming  
Failure  
No  
Data Correct?  
Yes  
Increment  
Address  
Command  
Increment  
Address  
Command  
No  
Yes  
Address =  
8004h?  
Increment  
Address  
Command  
Increment  
Address  
Command  
One-word  
Program Cycle(2)  
(Config. Word 1)  
Read Data  
From Program  
Memory Command  
Report  
Programming  
Failure  
No  
Data Correct?  
Yes  
Increment  
Address  
Command  
One-word  
Program Cycle(2)  
(Config. Word 2)  
Report  
Programming  
Failure  
Read Data  
From Program  
Memory Command  
No  
Data Correct?  
Yes  
Done  
Note 1: This step is optional if the device is erased or not previously programmed.  
2: See Figure 5-3.  
DS40001713A-page 22  
2013 Microchip Technology Inc.  
PIC12(L)F1571/2  
FIGURE 5-6:  
ERASE FLOWCHART  
Start  
Load Configuration  
Bulk Erase  
Program Memory  
Done  
Note:  
This sequence does not erase the Calibration Words.  
2013 Microchip Technology Inc.  
DS40001713A-page 23  
PIC12(L)F1571/2  
6.0  
CODE PROTECTION  
7.0  
HEX FILE USAGE  
Code protection is controlled using the CP bit in  
Configuration Word 1. When code protection is  
enabled, all program memory locations (0000h-7FFFh)  
read as ‘0’. Further programming is disabled for the  
program memory (0000h-7FFFh). Program memory  
can still be programmed and read during program  
execution.  
In the hex file there are two bytes per program word  
stored in the Intel® INHX32 hex format. Data is stored  
LSB first, MSB second. Because there are two bytes  
per word, the addresses in the hex file are 2x the  
address in program memory. (Example: The  
Configuration Word 1 is stored at 8007h. In the hex file  
this will be referenced as 1000Eh-1000Fh).  
The user ID locations and Configuration Words can be  
programmed and read out regardless of the code  
protection settings.  
7.1  
Configuration Word  
To allow portability of code, it is strongly recommended  
that the programmer is able to read the Configuration  
Words and user ID locations from the hex file. If the  
Configuration Words information was not present in the  
hex file, a simple warning message may be issued.  
Similarly, while saving a hex file, Configuration Words  
and user ID information should be included.  
6.1  
Program Memory  
Code protection is enabled by programming the CP bit  
in Configuration Word 1 register to ‘0’.  
The only way to disable code protection is to use the  
Bulk Erase Program Memory command.  
7.2  
Device ID  
If a device ID is present in the hex file at 1000Ch-  
1000Dh (8006h on the part), the programmer should  
verify the device ID against the value read from the  
part. On a mismatch condition, the programmer should  
generate a warning message.  
7.3  
Checksum Computation  
The checksum is calculated by two different methods  
dependent on the setting of the CP Configuration bit.  
TABLE 7-1:  
Device  
CONFIGURATION WORD  
MASK VALUES  
Config. Word 1 Config. Word 2  
Mask  
Mask  
PIC12F1571  
PIC12LF1571  
PIC12F1572  
PIC12LF1572  
0EFBh  
0EFBh  
0EFBh  
0EFBh  
3F03h  
3F03h  
3F03h  
3F03h  
7.3.1  
PROGRAM CODE PROTECTION  
DISABLED  
With the program code protection disabled, the  
checksum is computed by reading the contents of the  
program memory locations and adding up the program  
memory data starting at address 0000h, up to the  
maximum user addressable location. Any Carry bits  
exceeding 16 bits are ignored. Additionally, the relevant  
bits of the Configuration Words are added to the  
checksum. All unimplemented Configuration bits are  
masked to ‘0’.  
DS40001713A-page 24  
2013 Microchip Technology Inc.  
PIC12(L)F1571/2  
7.3.2  
PROGRAM CODE PROTECTION  
ENABLED  
When the MPLAB IDE check box for Configure->ID  
Memory...-> Use Unprotected Checksum is checked,  
then the 16-bit checksum of the equivalent  
unprotected device is computed and stored in the user  
ID. Each nibble of the unprotected checksum is stored  
in the Least Significant nibble of each of the four user  
ID locations. The Most Significant checksum nibble is  
stored in the user ID at location 8000h, the second  
Most Significant nibble is stored at location 8001h, and  
so forth for the remaining nibbles and ID locations.  
The protected checksums in Table 7-2 assume that  
the Use Unprotected Checksum box is checked.  
The checksum of a code-protected device is computed  
in the following manner: the Least Significant nibble of  
each user ID is used to create a 16-bit value. The Least  
Significant nibble of user ID location 8000h is the Most  
Significant nibble of the 16-bit value. The Least  
Significant nibble of user ID location 8001h is the  
second Most Significant nibble, and so forth for the  
remaining user IDs and 16-bit value nibbles. The  
resulting 16-bit value is summed with the Configuration  
Words. All unimplemented Configuration bits are  
masked to ‘0’.  
TABLE 7-2:  
Device  
CHECKSUMS  
Config1  
Config2  
Checksum  
Unprotected  
00AAh  
Code-protected  
00AAh  
Unprotected Protected Mask  
Word Mask  
Blank  
First and  
Last  
Blank  
First and  
Last  
PIC12F1571  
PIC12LF1571  
PIC12F1572  
PIC12LF1572  
3FFFh  
3FFFh  
3FFFh  
3FFFh  
3F7Fh  
3F7Fh  
3F7Fh  
3F7Fh  
0EFBh 3FFFh 3F03h 49FEh  
0EFBh 3FFFh 3F03h 49FEh  
0EFBh 3FFFh 3F03h 45FEh  
0EFBh 3FFFh 3F03h 45FEh  
CB54h  
CB54h  
C754h  
C754h  
977Ch  
977Ch  
937Ch  
937Ch  
18D2h  
18D2h  
14D2h  
14D2h  
2013 Microchip Technology Inc.  
DS40001713A-page 25  
PIC12(L)F1571/2  
8.0  
ELECTRICAL SPECIFICATIONS  
Refer to device specific data sheet for absolute  
maximum ratings.  
TABLE 8-1:  
AC/DC CHARACTERISTICS TIMING REQUIREMENTS FOR PROGRAM/VERIFY MODE  
Standard Operating Conditions  
Production tested at 25°C  
AC/DC CHARACTERISTICS  
Sym.  
Characteristics  
Min.  
Typ.  
Max.  
Units  
Conditions/Comments  
Programming Supply Voltages and Currents  
Supply Voltage  
(VDDMIN , VDDMAX)  
PIC12LF1571/2  
PIC12F1571/2  
1.80  
2.70  
3.60  
3.60  
V
V
V
V
V
V
FOSC 16 MHz  
FOSC 32 MHz  
FOSC 16 MHz  
FOSC 32 MHz  
(2)  
VDD  
2.30  
2.70  
5.50  
5.50  
VPEW  
VBE  
Read/Write and Row Erase operations  
Bulk Erase operations  
Current on VDD, Idle  
VDDMIN  
2.7  
VDDMAX  
VDDMAX  
IDDI  
1.0  
3.0  
mA  
mA  
IDDP  
Current on VDD, Programming  
VPP  
IPP  
Current on MCLR/VPP  
600  
9.0  
A  
High voltage on MCLR/VPP for  
Program/Verify mode entry  
VIHH  
8.0  
V
MCLR rise time (VIL to VIHH) for  
Program/Verify mode entry  
TVHHR  
1.0  
s  
I/O pins  
VIH  
VIL  
(ICSPCLK, ICSPDAT, MCLR/VPP) input high level  
0.8 VDD  
V
V
(ICSPCLK, ICSPDAT, MCLR/VPP) input low level  
ICSPDAT output high level  
0.2 VDD  
VDD-0.7  
VDD-0.7  
VDD-0.7  
IOH = 3.5 mA, VDD = 5V  
IOH = 3 mA, VDD = 3.3V  
IOH = 2 mA, VDD = 1.8V  
IOH = 8 mA, VDD = 5V  
IOH = 6 mA, VDD = 3.3V  
IOH = 3 mA, VDD = 1.8V  
VOH  
VOL  
V
V
V
ICSPDAT output low level  
VSS+0.6  
VSS+0.6  
VSS+0.6  
Brown-out Reset Voltage:  
BORV = 0(high trip)  
2.70  
PIC12(L)F1571/2  
VBOR  
BORV = 1(low trip)  
2.45  
1.90  
V
V
PIC12F1571/2  
PIC12LF1571/2  
Programming Mode Entry and Exit  
Programing mode entry setup time: ICSPCLK,  
ICSPDAT setup time before VDD or MCLR  
Programing mode entry hold time: ICSPCLK,  
ICSPDAT hold time after VDD or MCLR  
TENTS  
TENTH  
100  
250  
ns  
s  
Serial Program/Verify  
TCKL  
TCKH  
TDS  
Clock Low Pulse Width  
100  
100  
100  
100  
ns  
ns  
ns  
ns  
Clock High Pulse Width  
Data in setup time before clock  
Data in hold time after clock  
Clockto data out valid (during a  
Read Data command)  
TDH  
TCO  
0
0
0
80  
80  
80  
ns  
ns  
ns  
Clockto data low-impedance (during a  
Read Data command)  
TLZD  
THZD  
Clockto data high-impedance (during a  
Read Data command)  
Note 1: Externally timed writes are not supported for Configuration and Calibration bits.  
2: Bulk-erased devices default to brown-out enabled. VDDMIN is 2.85 volts when performing low-voltage programming on a  
bulk-erased device, to ensure that the device is not held in Brown-out Reset.  
DS40001713A-page 26  
2013 Microchip Technology Inc.  
PIC12(L)F1571/2  
TABLE 8-1:  
AC/DC CHARACTERISTICS TIMING REQUIREMENTS FOR PROGRAM/VERIFY MODE  
Standard Operating Conditions  
Production tested at 25°C  
AC/DC CHARACTERISTICS  
Sym.  
Characteristics  
Min.  
Typ.  
Max.  
Units  
Conditions/Comments  
Data input not driven to next clock input (delay  
required between command/data or command/  
command)  
TDLY  
1.0  
s  
TERAB Bulk Erase cycle time  
TERAR Row Erase cycle time  
5
ms  
ms  
2.5  
2.5  
5
Program memory  
Configuration Words  
TPINT  
Internally timed programming operation time  
ms  
ms  
TPEXT Externally timed programming pulse  
1.0  
2.1  
Note 1  
Time delay from program to compare  
(HV discharge time)  
TDIS  
300  
s  
s  
TEXIT  
Time delay when exiting Program/Verify mode  
1
Note 1: Externally timed writes are not supported for Configuration and Calibration bits.  
2: Bulk-erased devices default to brown-out enabled. VDDMIN is 2.85 volts when performing low-voltage programming on a  
bulk-erased device, to ensure that the device is not held in Brown-out Reset.  
FIGURE 8-3:  
PROGRAMMING MODE  
EXIT – VPP LAST  
8.1  
AC Timing Diagrams  
FIGURE 8-1:  
PROGRAMMING MODE  
ENTRY – VDD FIRST  
TEXIT  
VIHH  
TENTS  
TENTH  
VPP  
VIHH  
VIL  
VPP  
VIL  
VDD  
ICSPDAT  
ICSPCLK  
VDD  
ICSPDAT  
ICSPCLK  
FIGURE 8-4:  
PROGRAMMING MODE  
EXIT – VDD LAST  
TEXIT  
FIGURE 8-2:  
PROGRAMMING MODE  
ENTRY – VPP FIRST  
VIHH  
VPP  
TENTS  
TENTH  
VIL  
VDD  
ICSPDAT  
ICSPCLK  
VIHH  
VPP  
VIL  
VDD  
ICSPDAT  
ICSPCLK  
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DS40001713A-page 27  
PIC12(L)F1571/2  
FIGURE 8-5:  
CLOCK AND DATA  
TIMING  
TCKL  
TCKH  
ICSPCLK  
TDH  
TDS  
ICSPDAT  
as  
input  
TCO  
ICSPDAT  
as  
output  
TLZD  
ICSPDAT  
from input  
to output  
THZD  
ICSPDAT  
from output  
to input  
FIGURE 8-6:  
WRITE COMMAND – PAYLOAD TIMING  
TDLY  
1
2
3
4
5
2
16  
6
1
15  
ICSPCLK  
X
X
X
LSb  
X
0
MSb  
0
X
X
ICSPDAT  
Next  
Command  
Payload  
Command  
FIGURE 8-7:  
READ COMMAND – PAYLOAD TIMING  
TDLY  
1
2
3
4
5
16  
6
1
2
15  
ICSPCLK  
ICSPDAT  
X
X
X
X
X
X
(from Programmer)  
LSb  
MSb 0  
x
ICSPDAT  
(from Device)  
Next  
Command  
Payload  
Command  
DS40001713A-page 28  
2013 Microchip Technology Inc.  
PIC12(L)F1571/2  
FIGURE 8-8:  
LVP ENTRY (POWERING UP)  
VDD  
MCLR  
TENTS  
TENTH  
33 clocks  
TCKH  
TCKL  
ICSPCLK  
ICSPDAT  
TDH  
TDS  
LSb of Pattern  
0
MSb of Pattern  
1
2
31  
FIGURE 8-9:  
LVP ENTRY (POWERED)  
VDD  
MCLR  
TENTH  
33 Clocks  
TCKH  
TCKL  
ICSPCLK  
ICSPDAT  
TDH  
TDS  
LSb of Pattern  
0
MSb of Pattern  
31  
1
2
Note 1: Sequence matching can start with no edge on MCLR first.  
2013 Microchip Technology Inc.  
DS40001713A-page 29  
PIC12(L)F1571/2  
APPENDIX A: REVISION HISTORY  
Revision A (06/2013)  
Initial release of this document.  
DS40001713A-page 30  
2013 Microchip Technology Inc.  
Note the following details of the code protection feature on Microchip devices:  
Microchip products meet the specification contained in their particular Microchip Data Sheet.  
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the  
intended manner and under normal conditions.  
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our  
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data  
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.  
Microchip is willing to work with the customer who is concerned about the integrity of their code.  
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not  
mean that we are guaranteeing the product as “unbreakable.”  
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our  
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts  
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.  
Information contained in this publication regarding device  
applications and the like is provided only for your convenience  
and may be superseded by updates. It is your responsibility to  
ensure that your application meets with your specifications.  
MICROCHIP MAKES NO REPRESENTATIONS OR  
WARRANTIES OF ANY KIND WHETHER EXPRESS OR  
IMPLIED, WRITTEN OR ORAL, STATUTORY OR  
OTHERWISE, RELATED TO THE INFORMATION,  
INCLUDING BUT NOT LIMITED TO ITS CONDITION,  
QUALITY, PERFORMANCE, MERCHANTABILITY OR  
FITNESS FOR PURPOSE. Microchip disclaims all liability  
arising from this information and its use. Use of Microchip  
devices in life support and/or safety applications is entirely at  
the buyer’s risk, and the buyer agrees to defend, indemnify and  
hold harmless Microchip from any and all damages, claims,  
suits, or expenses resulting from such use. No licenses are  
conveyed, implicitly or otherwise, under any Microchip  
intellectual property rights.  
Trademarks  
The Microchip name and logo, the Microchip logo, dsPIC,  
FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro,  
PICSTART, PIC logo, rfPIC, SST, SST Logo, SuperFlash  
and UNI/O are registered trademarks of Microchip Technology  
Incorporated in the U.S.A. and other countries.  
32  
FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,  
MTP, SEEVAL and The Embedded Control Solutions  
Company are registered trademarks of Microchip Technology  
Incorporated in the U.S.A.  
Silicon Storage Technology is a registered trademark of  
Microchip Technology Inc. in other countries.  
Analog-for-the-Digital Age, Application Maestro, BodyCom,  
chipKIT, chipKIT logo, CodeGuard, dsPICDEM,  
dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,  
ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial  
Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB  
Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code  
Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit,  
PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O,  
Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA  
and Z-Scale are trademarks of Microchip Technology  
Incorporated in the U.S.A. and other countries.  
SQTP is a service mark of Microchip Technology Incorporated  
in the U.S.A.  
GestIC and ULPP are registered trademarks of Microchip  
Technology Germany II GmbH & Co. KG, a subsidiary of  
Microchip Technology Inc., in other countries.  
All other trademarks mentioned herein are property of their  
respective companies.  
© 2013, Microchip Technology Incorporated, Printed in the  
U.S.A., All Rights Reserved.  
Printed on recycled paper.  
ISBN: 9781620772652  
QUALITY MANAGEMENT SYSTEM  
CERTIFIED BY DNV  
Microchip received ISO/TS-16949:2009 certification for its worldwide  
headquarters, design and wafer fabrication facilities in Chandler and  
Tempe, Arizona; Gresham, Oregon and design centers in California  
and India. The Company’s quality system processes and procedures  
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping  
devices, Serial EEPROMs, microperipherals, nonvolatile memory and  
analog products. In addition, Microchip’s quality system for the design  
and manufacture of development systems is ISO 9001:2000 certified.  
== ISO/TS 16949 ==  
2013 Microchip Technology Inc.  
DS40001713A-page 31  
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11/29/12  
DS40001713A-page 32  
2013 Microchip Technology Inc.  

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