PIC16C52-20/P [MICROCHIP]
ROM-Based 8-Bit CMOS Microcontroller Series; 基于ROM的8位CMOS微控制器系列型号: | PIC16C52-20/P |
厂家: | MICROCHIP |
描述: | ROM-Based 8-Bit CMOS Microcontroller Series |
文件: | 总84页 (文件大小:641K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
PIC16CR54C
M
ROM-Based 8-Bit CMOS Microcontroller Series
Pin Diagrams
Devices Included in this Data Sheet:
• PIC16CR54C
PDIP and SOIC
18
17
16
15
14
RA1
RA0
OSC1/CLKIN
OSC2/CLKOUT
VDD
•1
RA2
RA3
T0CKI
MCLRVPP
VSS
High-Performance RISC CPU:
• Only 33 single word instructions to learn
2
3
4
5
6
7
8
9
• All instructions are single cycle (200 ns) except for
program branches which are two-cycle
RB7
RB6
RB5
RB4
13
12
RB0
RB1
RB2
RB3
• Operating speed: DC - 20 MHz clock input
DC - 200 ns instruction cycle
11
10
Device
Pins I/O
18 12
ROM
RAM
PIC16CR54C
512
25
• 12-bit wide instructions
• 8-bit wide data path
• Seven or eight special function hardware registers
• Two-level deep hardware stack
• Direct, indirect and relative addressing modes for
data and instructions
SSOP
Peripheral Features:
• 8-bit real time clock/counter (TMR0) with 8-bit
programmable prescaler
RA2
RA3
T0CKI
MCLRVPP
VSS
•1
2
3
4
20
19
18
17
16
15
14
13
12
11
RA1
RA0
OSC1/CLKIN
OSC2/CLKOUT
• Power-On Reset (POR)
5
6
7
8
VDD
VDD
RB7
RB6
RB5
RB4
VSS
RB0
RB1
• Device Reset Timer (DRT)
• Watchdog Timer (WDT) with its own on-chip
RC oscillator for reliable operation
RB2
RB3
9
10
• Programmable code-protection
• Power saving SLEEP mode
• Selectable oscillator options:
- RC:
- XT:
- HS:
- LP:
Low-cost RC oscillator
Standard crystal/resonator
High-speed crystal/resonator
Power saving, low-frequency crystal
CMOS Technology:
• Low-power, high-speed CMOS ROM technology
• Fully static design
• Wide-operating voltage and temperature range:
- ROM Commercial/Industrial 3.0V to 5.5V
• Low-power consumption
- < 2 mA typical @ 5V, 4 MHz
- 15 µA typical @ 3V, 32 kHz
- < 0.6 µA typical standby current
(with WDT disabled) @ 3V, 0°C to 70°C
1998 Microchip Technology Inc.
Preliminary
DS40191A-page 1
PIC16CR54C
Device Differences
Oscillator
Selection
(Program)
Process
Technology
(Microns)
Voltage
ROM
Equivalent
MCLR
Filter
Device
Range
Oscillator
PIC16C52
PIC16C54
PIC16C54A
PIC16C54B
3.0-6.25
2.5-6.25
2.0-6.25
3.0-5.5
User
Factory
User
See Note 1
See Note 1
See Note 1
See Note 1
0.9
1.2
0.9
0.7
—
PIC16CR54A
—
No
No
No
Yes
User
PIC16CR54B
or
PIC16CR54C
PIC16C55
2.5-6.25
3.0-5.5
2.5-6.25
3.0-5.5
2.5-6.25
3.0-5.5
2.5-5.5
2.0-6.25
Factory
User
See Note 1
See Note 1
See Note 1
See Note 1
See Note 1
See Note 1
See Note 1
See Note 1
1.7
0.7
1.7
0.7
1.2
0.7
0.7
0.9
—
No
Yes
No
PIC16C55A
PIC16C56
—
—
Factory
User
PIC16C56A
PIC16C57
PIC16CR56A
—
Yes
No
Factory
User
PIC16C57C
PIC16CR57C
PIC16C58A
PIC16CR57C
NA
Yes
Yes
Factory
User
(2)
PIC16CR58A
No
PIC16C58B
3.0-5.5
2.5-6.25
2.5-5.5
3.0-5.5
2.5-5.5
2.5-6.25
2.5-6.25
2.5-5.5
User
See Note 1
See Note 1
See Note 1
See Note 1
See Note 1
See Note 1
See Note 1
See Note 1
0.7
1.2
0.7
0.7
0.7
0.9
0.9
0.7
PIC16CR58B
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
PIC16CR54A
PIC16CR54B
PIC16CR54C
PIC16CR56A
PIC16CR57B
PIC16CR58A
PIC16CR58B
Factory
Factory
Factory
Factory
Factory
Factory
Factory
NA
NA
NA
NA
NA
NA
NA
Note 1: If you change from this device to another device, please verify oscillator characteristics in your application.
Note 2: In PIC16LV58A, MCLR Filter = Yes
DS40191A-page 2
Preliminary
1998 Microchip Technology Inc.
PIC16CR54C
Table of Contents
1.0
2.0
3.0
4.0
5.0
6.0
7.0
8.0
9.0
General Description............................................................................................................................................. 5
PIC16C5X Device Varieties................................................................................................................................. 7
Architectural Overview......................................................................................................................................... 9
Memory Organization ........................................................................................................................................ 13
I/O Ports ............................................................................................................................................................ 19
Timer0 Module and TMR0 Register ..................................................................................................................21
Special Features of the CPU.............................................................................................................................25
Instruction Set Summary ................................................................................................................................... 37
Development Support........................................................................................................................................ 49
10.0 Electrical Characteristics - PIC16CR54C ..........................................................................................................53
11.0 DC and AC Characteristics - PIC16CR54C.......................................................................................................63
12.0 Packaging Information....................................................................................................................................... 73
Appendix A: Compatibility ............................................................................................................................................. 77
Index ............................................................................................................................................................................ 79
On-Line Support............................................................................................................................................................ 81
Reader Response ......................................................................................................................................................... 82
PIC16CR54C Product Identification System.................................................................................................................83
1998 Microchip Technology Inc.
Preliminary
DS40191A-page 3
PIC16CR54C
NOTES:
DS40191A-page 4
Preliminary
1998 Microchip Technology Inc.
PIC16CR54C
1.1
Applications
1.0
GENERAL DESCRIPTION
The PIC16C5X from Microchip Technology is a family
of low-cost, high performance, 8-bit, fully static,
EPROM/ ROM-based CMOS microcontrollers. It
employs a RISC architecture with only 33 single
word/single cycle instructions. All instructions are sin-
gle cycle (200 ns) except for program branches which
take two cycles. The PIC16C5X delivers performance
an order of magnitude higher than its competitors in the
same price category. The 12-bit wide instructions are
highly symmetrical resulting in 2:1 code compression
over other 8-bit microcontrollers in its class. The easy
to use and easy to remember instruction set reduces
development time significantly.
The PIC16C5X series fits perfectly in applications rang-
ing from high-speed automotive and appliance motor
control to low-power remote transmitters/receivers,
pointing devices and telecom processors.The EPROM
technology makes customizing application programs
(transmitter codes, motor speeds, receiver frequen-
cies, etc.) extremely fast and convenient. The small
footprint packages, for through hole or surface mount-
ing, make this microcontroller series perfect for applica-
tions with space limitations. Low-cost, low-power, high
performance, ease of use and I/O flexibility make the
PIC16C5X series very versatile even in areas where no
microcontroller use has been considered before (e.g.,
timer functions, replacement of “glue” logic in larger
systems, coprocessor applications).
The PIC16C5X products are equipped with special fea-
tures that reduce system cost and power requirements.
The Power-On Reset (POR) and Device Reset Timer
(DRT) eliminate the need for external reset circuitry.
There are four oscillator configurations to choose from,
including the power-saving LP (Low Power) oscillator
and cost saving RC oscillator. Power saving SLEEP
mode, Watchdog Timer and code protection features
improve system cost, power and reliability.
The UV erasable CERDIP packaged versions are ideal
for code development, while the cost-effective One
Time Programmable (OTP) versions are suitable for
production in any volume. The customer can take full
advantage of Microchip’s price leadership in OTP
microcontrollers while benefiting from the OTP’s
flexibility.
The PIC16C5X products are supported by
a
full-featured macro assembler, a software simulator, an
in-circuit emulator, a ‘C’ compiler, fuzzy logic support
tools, a low-cost development programmer, and a full
featured programmer. All the tools are supported on
IBM PC and compatible machines.
1998 Microchip Technology Inc.
Preliminary
DS40191A-page 5
PIC16CR54C
TABLE 1-1:
PIC16C5X FAMILY OF DEVICES
PIC16C52
PIC16C54s
20
PIC16CR54s
20
PIC16C55s
20
PIC16C56s
20
Maximum Frequency
of Operation (MHz)
4
Clock
EPROM Program Memory
(x12 words)
384
—
512
—
—
512
—
1K
—
Memory
ROM Program Memory
(x12 words)
512
RAM Data Memory (bytes)
Timer Module(s)
I/O Pins
25
25
25
24
25
Peripherals
Features
TMR0
12
TMR0
12
TMR0
12
TMR0
20
TMR0
12
Number of Instructions
Packages
33
33
33
33
33
18-pin DIP,
SOIC
18-pin DIP,
SOIC;
18-pin DIP,
SOIC;
28-pin DIP,
SOIC;
18-pin DIP,
SOIC;
20-pin SSOP
20-pin SSOP
28-pin SSOP
20-pin SSOP
All PICmicro™ Family devices have Power-on Reset, selectable Watchdog Timer (except PIC16C52), selectable code
protect and high I/O current capability.
PIC16CR56s
20
PIC16C57s
20
PIC16CR57s
20
PIC16C58s
20
PIC16CR58s
20
Maximum Frequency
of Operation (MHz)
Clock
EPROM Program Memory
(x12 words)
—
2K
—
—
2K
—
—
Memory
ROM Program Memory
(x12 words)
1K
2K
2K
RAM Data Memory (bytes)
25
72
72
73
73
Peripherals Timer Module(s)
TMR0
12
TMR0
20
TMR0
20
TMR0
12
TMR0
12
I/O Pins
Number of Instructions
Packages
33
33
33
33
33
Features
18-pin DIP,
SOIC;
28-pin DIP,
SOIC;
28-pin DIP,
SOIC;
18-pin DIP,
SOIC;
18-pin DIP,
SOIC;
20-pin SSOP
28-pin SSOP 28-pin SSOP
20-pin SSOP 20-pin SSOP
All PICmicro™ Family devices have Power-on Reset, selectable Watchdog Timer (except PIC16C52), selectable code
protect and high I/O current capability.
DS40191A-page 6
Preliminary
1998 Microchip Technology Inc.
PIC16CR54C
2.3
Quick-Turnaround-Production (QTP)
Devices
2.0
PIC16C5X DEVICE VARIETIES
A variety of frequency ranges and packaging options
are available. Depending on application and
production requirements, the proper device option can
be selected using the information in this section. When
placing orders, please use the PIC16CR54C Product
Identification System at the back of this data sheet to
specify the correct part number.
Microchip offers a QTP Programming Service for
factory production orders. This service is made
available for users who choose not to program a
medium to high quantity of units and whose code
patterns have stabilized. The devices are identical to
the OTP devices but with all EPROM locations and
configuration bit options already programmed by the
factory. Certain code and prototype verification
procedures apply before production shipments are
available. Please contact your Microchip Technology
sales office for more details.
For the PIC16C5X family of devices, there are four
device types, as indicated in the device number:
1. C, as in PIC16C54. These devices have
EPROM program memory and operate over the
standard voltage range.
2. LC, as in PIC16LC54A. These devices have
EPROM program memory and operate over an
extended voltage range.
2.4
Serialized
Quick-Turnaround-Production
(SQTPSM) Devices
3. LV, as in PIC16LV54A. These devices have
EPROM program memory and operate over a
2.0V to 3.8V range.
Microchip offers the unique programming service
where a few user-defined locations in each device are
programmed with different serial numbers. The serial
numbers may be random, pseudo-random or
sequential. The devices are identical to the OTP
devices but with all EPROM locations and
configuration bit options already programmed by the
factory.
4. CR, as in PIC16CR54A. These devices have
ROM program memory and operate over the
standard voltage range.
5. LCR, as in PIC16LCR54B. These devices have
ROM program memory and operate over an
extended voltage range.
Serial programming allows each device to have a
unique number which can serve as an entry code,
password or ID number.
2.1
UV Erasable Devices (EPROM)
The UV erasable versions, offered in CERDIP
packages, are optimal for prototype development and
pilot programs
2.5
Read Only Memory (ROM) Devices
Microchip offers masked ROM versions of several of
the highest volume parts, giving the customer a low
cost option for high volume, mature products.
UV erasable devices can be programmed for any of
the four oscillator configurations. Microchip's
PICSTART and PRO MATE programmers both
support programming of the PIC16CR54C. Third party
programmers also are available; refer to the Third
Party Guide for a list of sources.
2.2
One-Time-Programmable (OTP)
Devices
The availability of OTP devices is especially useful for
customers expecting frequent code changes and
updates.
The OTP devices, packaged in plastic packages,
permit the user to program them once. In addition to
the program memory, the configuration bits must be
programmed.
1998 Microchip Technology Inc.
Preliminary
DS40191A-page 7
PIC16CR54C
NOTES:
DS40191A-page 8
Preliminary
1998 Microchip Technology Inc.
PIC16CR54C
The PIC16CR54C device contains an 8-bit ALU and
3.0
ARCHITECTURAL OVERVIEW
working register. The ALU is
a general purpose
The high performance of the PIC16CR54C can be
attributed to number of architectural features
arithmetic unit. It performs arithmetic and Boolean
functions between data in the working register and any
register file.
a
commonly found in RISC microprocessors. To begin
with, the PIC16CR54C uses a Harvard architecture in
which program and data are accessed on separate
buses. This improves bandwidth over traditional von
Neumann architecture where program and data are
fetched on the same bus. Separating program and data
memory further allows instructions to be sized
differently than the 8-bit wide data word. Instruction
opcodes are 12-bits wide making it possible to have all
The ALU is 8-bits wide and capable of addition,
subtraction, shift and logical operations. Unless
otherwise mentioned, arithmetic operations are two's
complement in nature. In two-operand instructions,
typically one operand is the W (working) register. The
other operand is either a file register or an immediate
constant. In single operand instructions, the operand
is either the W register or a file register.
single word instructions.
A 12-bit wide program
memory access bus fetches a 12-bit instruction in a
single cycle. A two-stage pipeline overlaps fetch and
execution of instructions. Consequently, all instructions
(33) execute in a single cycle (200ns @ 20MHz) except
for program branches.
The W register is an 8-bit working register used for
ALU operations. It is not an addressable register.
Depending on the instruction executed, the ALU may
affect the values of the Carry (C), Digit Carry (DC),
and Zero (Z) bits in the STATUS register. The C and
DC bits operate as a borrow and digit borrow out bit,
respectively, in subtraction. See the SUBWFand ADDWF
instructions for examples.
The PIC16CR54C address 512 x 12 of program
memory. All program memory is internal.
The PIC16CR54C can directly or indirectly address its
register files and data memory. All special function
registers including the program counter are mapped in
the data memory. The PIC16CR54C has a highly
orthogonal (symmetrical) instruction set that makes it
possible to carry out any operation on any register
using any addressing mode. This symmetrical nature
and lack of ‘special optimal situations’ make
programming with the PIC16CR54C simple yet
efficient. In addition, the learning curve is reduced
significantly.
A simplified block diagram is shown in Figure 3-1, with
the corresponding device pins described in Table 3-1.
1998 Microchip Technology Inc.
Preliminary
DS40191A-page 9
PIC16CR54C
FIGURE 3-1: PIC16CR54C SERIES BLOCK DIAGRAM
9-11
T0CKI
PIN
OSC1 OSC2 MCLR
CONFIGURATION WORD
9-11
STACK 1
STACK2
ROM
512 X 12
“DISABLE” “OSC
PC
SELECT”
WATCHDOG
TIMER
12
2
“CODE
OSCILLATOR/
TIMING &
CONTROL
PROTECT”
INSTRUCTION
REGISTER
WDT TIME
OUT
CLKOUT
WDT/TMR0
PRESCALER
9
12
8
“SLEEP”
INSTRUCTION
DECODER
6
“OPTION”
OPTION REG.
FROM W
DIRECT ADDRESS
DIRECT RAM
ADDRESS
GENERAL
PURPOSE
REGISTER
FILE
5
8
(SRAM)
25 Bytes
STATUS
TMR0
FSR
8
DATA BUS
8
W
ALU
FROM W
8
FROM W
4
8
4
“TRIS 5”
“TRIS 6”
TRISB PORTB
TRISA PORTA
4
8
RA3:RA0
RB7:RB0
DS40191A-page 10
Preliminary
1998 Microchip Technology Inc.
PIC16CR54C
TABLE 3-1:
Name
PINOUT DESCRIPTION - PIC16CR54C
DIP, SOIC SSOP I/O/P Input
Description
No.
No. Type Levels
RA0
RA1
RA2
RA3
17
18
1
19
20
1
I/O
I/O
I/O
I/O
TTL
TTL
TTL
TTL
Bi-directional I/O port
2
2
RB0
RB1
RB2
RB3
RB4
RB5
RB6
RB7
6
7
8
7
8
9
10
11
12
13
14
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
TTL
TTL
TTL
TTL
TTL
TTL
TTL
TTL
Bi-directional I/O port
9
10
11
12
13
T0CKI
3
3
I
ST
Clock input to Timer0. Must be tied to VSS or VDD, if not in
use, to reduce current consumption.
MCLR/VPP
4
4
I
ST
Master clear (reset) input/verify voltage input. This pin is an
active low reset to the device.
(1)
OSC1/CLKIN
16
15
18
17
I
ST
Oscillator crystal input/external clock source input.
OSC2/CLKOUT
O
—
Oscillator crystal output. Connects to crystal or resonator in
crystal oscillator mode. In RC mode, OSC2 pin outputs
CLKOUT which has 1/4 the frequency of OSC1, and denotes
the instruction cycle rate.
VDD
VSS
14
5
15,16
5,6
P
P
—
—
Positive supply for logic and I/O pins.
Ground reference for logic and I/O pins.
Legend: I = input, O = output, I/O = input/output,
P = power, — = Not Used, TTL = TTL input,
ST = Schmitt Trigger input
Note 1: Schmitt Trigger input only when in RC mode.
1998 Microchip Technology Inc.
Preliminary
DS40191A-page 11
PIC16CR54C
3.1
Clocking Scheme/Instruction Cycle
3.2
Instruction Flow/Pipelining
The clock input (OSC1/CLKIN pin) is internally divided
by four to generate four non-overlapping quadrature
clocks namely Q1, Q2, Q3 and Q4. Internally, the
program counter is incremented every Q1, and the
instruction is fetched from program memory and
latched into instruction register in Q4. It is decoded
and executed during the following Q1 through Q4. The
clocks and instruction execution flow is shown in
Figure 3-2 and Example 3-1.
An Instruction Cycle consists of four Q cycles (Q1, Q2,
Q3 and Q4). The instruction fetch and execute are
pipelined such that fetch takes one instruction cycle
while decode and execute takes another instruction
cycle. However, due to the pipelining, each instruction
effectively executes in one cycle. If an instruction
causes the program counter to change (e.g., GOTO)
then two cycles are required to complete the
instruction (Example 3-1).
A fetch cycle begins with the program counter (PC)
incrementing in Q1.
In the execution cycle, the fetched instruction is
latched into the Instruction Register (IR) in cycle Q1.
This instruction is then decoded and executed during
the Q2, Q3, and Q4 cycles. Data memory is read
during Q2 (operand read) and written during Q4
(destination write).
FIGURE 3-2: CLOCK/INSTRUCTION CYCLE
Q2
Q3
Q4
Q2
Q3
Q4
Q2
Q3
Q4
Q1
Q1
Q1
OSC1
Q1
Q2
Q3
Q4
PC
Internal
phase
clock
PC
PC+1
PC+2
OSC2/CLKOUT
(RC mode)
Fetch INST (PC)
Execute INST (PC-1)
Fetch INST (PC+1)
Execute INST (PC)
Fetch INST (PC+2)
Execute INST (PC+1)
EXAMPLE 3-1: INSTRUCTION PIPELINE FLOW
1. MOVLW 55H
Fetch 1
Execute 1
Fetch 2
2. MOVWF PORTB
3. CALL SUB_1
Execute 2
Fetch 3
Execute 3
Fetch 4
4. BSF
PORTA, BIT3
Flush
Fetch SUB_1 Execute SUB_1
All instructions are single cycle, except for any program branches. These take two cycles since the fetch
instruction is “flushed” from the pipeline while the new instruction is being fetched and then executed.
DS40191A-page 12
Preliminary
1998 Microchip Technology Inc.
PIC16CR54C
4.2.1
GENERAL PURPOSE REGISTER FILE
4.0
MEMORY ORGANIZATION
PIC16CR54C memory is organized into program
memory and data memory. For devices with more than
512 bytes of program memory, a paging scheme is
used. Program memory pages are accessed using
one or two STATUS register bits. For devices with a
data memory register file of more than 32 registers, a
banking scheme is used. Data memory banks are
accessed using the File Selection Register (FSR).
The register file is accessed either directly or indirectly
through the file select register FSR (Section 4.7).
FIGURE 4-2:
PIC16CR54C REGISTER FILE
MAP
File Address
INDF(1)
TMR0
PCL
00h
01h
02h
03h
04h
05h
06h
07h
4.1
Program Memory Organization
The PIC16CR54C has a 9-bit Program Counter (PC)
capable of addressing a 512 x 12 program memory
space (Figure 4-1). Accessing a location above the
STATUS
FSR
physically implemented address will cause
wraparound.
a
PORTA
PORTB
The reset vector for the PIC16CR54C is at 1FFh. A
NOP at the reset vector location will cause a restart at
location 000h.
FIGURE 4-1: PIC16CR54C PROGRAM
MEMORY MAP AND STACK
General
Purpose
Registers
0Fh
10h
PC<8:0>
9
CALL, RETLW
Stack Level 1
Stack Level 2
1Fh
Note 1: Not a physical register. See Section 4.7
000h
On-chip
Program
Memory
0FFh
100h
4.2.2
SPECIAL FUNCTION REGISTERS
The Special Function Registers are registers used by
the CPU and peripheral functions to control the
operation of the device (Table 4-1).
Reset Vector
1FFh
The special registers can be classified into two sets.
The special function registers associated with the
“core” functions are described in this section. Those
related to the operation of the peripheral features are
described in the section for each peripheral feature.
4.2
Data Memory Organization
Data memory is composed of registers, or bytes of
RAM. Therefore, data memory for a device is specified
by its register file. The register file is divided into two
functional groups: special function registers and
general purpose registers.
The special function registers include the TMR0
register, the Program Counter (PC), the Status
Register, the I/O registers (ports), and the File Select
Register (FSR). In addition, special purpose registers
are used to control the I/O port configuration and
prescaler options.
The general purpose registers are used for data and
control information under command of the instructions.
For the PIC16CR54C, the register file is composed of
7 special function registers and 25 general purpose
registers (Figure 4-2).
1998 Microchip Technology Inc.
Preliminary
DS40191A-page 13
PIC16CR54C
TABLE 4-1:
SPECIAL FUNCTION REGISTER SUMMARY
Value on
Power-On
Reset
Value on
MCLR and
WDT Reset
Address
Name
TRIS
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
N/A
N/A
00h
01h
I/O control registers (TRISA, TRISB)
1111 1111 1111 1111
--11 1111 --11 1111
xxxx xxxx uuuu uuuu
xxxx xxxx uuuu uuuu
OPTION
INDF
Contains control bits to configure Timer0 and Timer0/WDT prescaler
Uses contents of FSR to address data memory (not a physical register)
8-bit real-time clock/counter
TMR0
(1)
02h
PCL
Low order 8 bits of PC
1111 1111 1111 1111
0001 1xxx 000q quuu
1xxx xxxx 1uuu uuuu
---- xxxx ---- uuuu
xxxx xxxx uuuu uuuu
03h
04h
05h
06h
STATUS
FSR
PA2
PA1
PA0
TO
PD
Z
DC
C
Indirect data memory address pointer
PORTA
PORTB
—
—
—
—
RA3
RB3
RA2
RB2
RA1
RB1
RA0
RB0
RB7
RB6
RB5
RB4
Legend: Shaded boxes = unimplemented or unused, –= unimplemented, read as '0' (if applicable)
x= unknown, u= unchanged, q= see the tables in Section 7.7 for possible values.
Note 1: The upper byte of the Program Counter is not directly accessible. See Section 4.5
for an explanation of how to access these bits.
DS40191A-page 14
Preliminary
1998 Microchip Technology Inc.
PIC16CR54C
For example, CLRF STATUSwill clear the upper three
bits and set the Z bit. This leaves the STATUS register
as 000u u1uu(where u= unchanged).
4.3
STATUS Register
This register contains the arithmetic status of the ALU,
the RESET status, and the page preselect bits for
program memories larger than 512 words.
It is recommended, therefore, that only BCF, BSF and
MOVWF instructions be used to alter the STATUS
register because these instructions do not affect the Z,
DC or C bits from the STATUS register. For other
instructions, which do affect STATUS bits, see
Section 8.0, Instruction Set Summary.
The STATUS register can be the destination for any
instruction, as with any other register. If the STATUS
register is the destination for an instruction that affects
the Z, DC or C bits, then the write to these three bits is
disabled. These bits are set or cleared according to
the device logic. Furthermore, the TO and PD bits are
not writable. Therefore, the result of an instruction with
the STATUS register as destination may be different
than intended.
FIGURE 4-3: STATUS REGISTER (ADDRESS:03h)
R/W-0
PA2
R/W-0
PA1
R/W-0
PA0
R-1
TO
R-1
PD
R/W-x
Z
R/W-x
DC
R/W-x
C
R = Readable bit
W = Writable bit
- n = Value at POR reset
bit7
6
5
4
3
2
1
bit0
bit 7:
PA2: This bit unused at this time.
Use of the PA2 bit as a general purpose read/write bit is not recommended, since this may affect upward
compatibility with future products.
bit 6-5: Not Applicable
bit 4:
bit 3:
bit 2:
bit 1:
TO: Time-out bit
1 = After power-up, CLRWDTinstruction, or SLEEPinstruction
0 = A WDT time-out occurred
PD: Power-down bit
1 = After power-up or by the CLRWDTinstruction
0 = By execution of the SLEEPinstruction
Z: Zero bit
1 = The result of an arithmetic or logic operation is zero
0 = The result of an arithmetic or logic operation is not zero
DC: Digit carry/borrow bit (for ADDWFand SUBWFinstructions)
ADDWF
1 = A carry from the 4th low order bit of the result occurred
0 = A carry from the 4th low order bit of the result did not occur
SUBWF
1 = A borrow from the 4th low order bit of the result did not occur
0 = A borrow from the 4th low order bit of the result occurred
bit 0:
C: Carry/borrow bit (for ADDWF, SUBWFand RRF, RLFinstructions)
ADDWF
SUBWF
RRF or RLF
1 = A carry occurred
0 = A carry did not occur
1 = A borrow did not occur
0 = A borrow occurred
Load bit with LSb or MSb, respectively
1998 Microchip Technology Inc.
Preliminary
DS40191A-page 15
PIC16CR54C
By executing the OPTION instruction, the contents of
the W register will be transferred to the OPTION
register. A RESET sets the OPTION<5:0> bits.
4.4
OPTION Register
The OPTION register is
register which contains various control bits to
configure the Timer0/WDT prescaler and Timer0.
a
6-bit wide, write-only
FIGURE 4-4: OPTION REGISTER
U-0
—
U-0
—
6
W-1
T0CS
5
W-1
T0SE
4
W-1
PSA
3
W-1
PS2
2
W-1
PS1
1
W-1
PS0
W
U
= Writable bit
= Unimplemented bit
bit7
bit0
- n = Value at POR reset
bit 7-6: Unimplemented.
bit 5:
bit 4:
bit 3:
T0CS: Timer0 clock source select bit
1 = Transition on T0CKI pin
0 = Internal instruction cycle clock (CLKOUT)
T0SE: Timer0 source edge select bit
1 = Increment on high-to-low transition on T0CKI pin
0 = Increment on low-to-high transition on T0CKI pin
PSA: Prescaler assignment bit
1 = Prescaler assigned to the WDT (not implemented on PIC16C52)
0 = Prescaler assigned to Timer0
bit 2-0: PS2:PS0: Prescaler rate select bits
Bit Value
Timer0 Rate WDT Rate (not implemented on PIC16C52)
000
001
010
011
100
101
110
111
1 : 2
1 : 4
1 : 8
1 : 16
1 : 32
1 : 64
1 : 128
1 : 256
1 : 1
1 : 2
1 : 4
1 : 8
1 : 16
1 : 32
1 : 64
1 : 128
DS40191A-page 16
Preliminary
1998 Microchip Technology Inc.
PIC16CR54C
4.5
Program Counter
FIGURE 4-5: LOADING OF PC
BRANCH INSTRUCTIONS -
PIC16CR54C
As a program instruction is executed, the Program
Counter (PC) will contain the address of the next
program instruction to be executed. The PC value is
increased by one every instruction cycle, unless an
instruction changes the PC.
GOTO Instruction
8
7
0
PCL
PC
For a GOTOinstruction, bits 8:0 of the PC are provided
by the GOTO instruction word. The PC Latch (PCL) is
mapped to PC<7:0> (Figure 4-5 and Figure 4-6).
Instruction Word
For a CALL instruction, or any instruction where the
PCL is the destination, bits 7:0 of the PC again are
provided by the instruction word. However, PC<8>
does not come from the instruction word, but is always
cleared (Figure 4-10 and Figure 4-11)/
CALL or Modify PCL Instruction
8
7
0
PCL
PC
Instructions where the PCL is the destination, or
Modify PCL instructions, include MOVWF PC, ADDWF
PC, and BSF PC, 5.
Reset to '0'
Instruction Word
4.5.1
EFFECTS OF RESET
.
Note: Because PC<8> is cleared in the CALL
instruction, or any Modify PCL instruction,
all subroutine calls or computed jumps are
limited to the first 256 locations of any pro-
gram memory page (512 words long).
The Program Counter is set upon a RESET, which
means that the PC addresses the last location in the
last page i.e., the reset vector.
The STATUS register page preselect bits are cleared
upon
a RESET, which means that page 0 is
pre-selected.
Therefore, upon a RESET, a GOTO instruction at the
reset vector location will automatically cause the
program to jump to page 0.
4.6
Stack
PIC16CR54C device has a 9-bit, two-level hardware
push/pop stack (Figure 4-1).
A CALLinstruction will push the current value of stack
1 into stack 2 and then push the current program
counter value, incremented by one, into stack level 1. If
more than two sequential CALL’s are executed, only
the most recent two return addresses are stored.
A RETLWinstruction will pop the contents of stack level
1 into the program counter and then copy stack level 2
contents into level 1. If more than two sequential
RETLW’s are executed, the stack will be filled with the
address previously stored in level 2. Note that the
W register will be loaded with the literal value specified
in the instruction. This is particularly useful for the
implementation of data look-up tables within the
program memory.
1998 Microchip Technology Inc.
Preliminary
DS40191A-page 17
PIC16CR54C
4.7
Indirect Data Addressing; INDF and
FSR Registers
EXAMPLE 4-2: HOW TO CLEAR RAM
USING INDIRECT
ADDRESSING
The INDF register is not
a physical register.
movlw 0x10
;initialize pointer
Addressing INDF actually addresses the register
whose address is contained in the FSR register (FSR
is a pointer). This is indirect addressing.
movwf FSR
; to RAM
;clear INDF register
NEXT
clrf
incf
INDF
FSR,F ;inc pointer
btfsc FSR,4 ;all done?
goto
NEXT
;NO, clear next
EXAMPLE 4-1: INDIRECT ADDRESSING
• Register file 05 contains the value 10h
• Register file 06 contains the value 0Ah
• Load the value 05 into the FSR register
• A read of the INDF register will return the value
of 10h
CONTINUE
:
;YES, continue
The FSR is a 5-bit ( PIC16CR54C) wide register. It is
used in conjunction with the INDF register to indirectly
address the data memory area.
• Increment the value of the FSR register by one
(FSR = 06)
• A read of the INDR register now will return the
value of 0Ah.
The FSR<4:0> bits are used to select data memory
addresses 00h to 1Fh.
PIC16CR54C: Do not use banking. FSR<6:5> are
unimplemented and read as '1's.
Reading INDF itself indirectly (FSR = 0) will produce
00h. Writing to the INDF register indirectly results in a
no-operation (although STATUS bits may be affected).
A simple program to clear RAM locations 10h-1Fh
using indirect addressing is shown in Example 4-2.
FIGURE 4-6: DIRECT/INDIRECT ADDRESSING
Direct Addressing
Indirect Addressing
(FSR)
5
(FSR)
0
6
4
4
(opcode)
0
5
6
location select
location select
bank select
bank
00
00h
Data
Memory
0Fh
10h
(1)
1Fh
Bank 0
Note 1: For register map detail see Section 4.2.
DS40191A-page 18
Preliminary
1998 Microchip Technology Inc.
PIC16CR54C
outputs are latched and remain unchanged until the
output latch is rewritten. To use a port pin as output,
the corresponding direction control bit (in TRISA,
TRISB) must be cleared (= 0). For use as an input, the
corresponding TRIS bit must be set. Any I/O pin can
be programmed individually as input or output.
5.0
I/O PORTS
As with any other register, the I/O registers can be
written and read under program control. However, read
instructions (e.g., MOVF PORTB,W) always read the I/O
pins independent of the pin’s input/output modes. On
RESET, all I/O ports are defined as input (inputs are at
hi-impedance) since the I/O control registers (TRISA,
TRISB, TRISC) are all set.
FIGURE 5-1: EQUIVALENT CIRCUIT
FOR A SINGLE I/O PIN
Data
Bus
5.1
PORTA
D
Q
Q
PORTA is a 4-bit I/O register. Only the low order 4 bits
are used (RA3:RA0). Bits 7-4 are unimplemented and
read as '0's.
Data
Latch
VDD
P
WR
Port
CK
5.2
PORTB
N
I/O
pin(1)
PORTB is an 8-bit I/O register (PORTB<7:0>).
W
Reg
D
Q
Q
5.3
TRIS Registers
TRIS
Latch
VSS
The output driver control registers are loaded with the
contents of the W register by executing the TRIS f
instruction. A '1' from a TRIS register bit puts the
corresponding output driver in a hi-impedance mode.
A '0' puts the contents of the output data latch on the
selected pins, enabling the output buffer.
TRIS ‘f’
CK
Reset
Note:
A read of the ports reads the pins, not the
output data latches. That is, if an output
driver on a pin is enabled and driven high,
but the external system is holding it low, a
read of the port will indicate that the pin is
low.
RD Port
Note 1: I/O pins have protection diodes to VDD and VSS.
The TRIS registers are “write-only” and are set (output
drivers disabled) upon RESET.
5.4
I/O Interfacing
The equivalent circuit for an I/O port pin is shown in
Figure 5-1. All ports may be used for both input and
output operation. For input operations these ports are
non-latching. Any input must be present until read by
an input instruction (e.g., MOVF PORTB, W). The
TABLE 5-1:
SUMMARY OF PORT REGISTERS
Value on
Power-On
Reset
Value on
MCLR and
WDT Reset
Address
Name
TRIS
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
N/A
05h
06h
I/O control registers (TRISA, TRISB)
1111 1111 1111 1111
---- xxxx ---- uuuu
xxxx xxxx uuuu uuuu
PORTA
PORTB
—
—
—
—
RA3
RB3
RA2
RB2
RA1
RB1
RA0
RB0
RB7
RB6
RB5
RB4
Legend: Shaded boxes = unimplemented, read as ‘0’,
–= unimplemented, read as '0', x= unknown, u= unchanged
1998 Microchip Technology Inc.
Preliminary
DS40191A-page 19
PIC16CR54C
5.5
I/O Programming Considerations
BI-DIRECTIONAL I/O PORTS
EXAMPLE 5-1: READ-MODIFY-WRITE
INSTRUCTIONS ON AN
I/O PORT
;Initial PORT Settings
; PORTB<7:4> Inputs
5.5.1
Some instructions operate internally as read followed
by write operations. The BCFand BSFinstructions, for
example, read the entire port into the CPU, execute
the bit operation and re-write the result. Caution must
be used when these instructions are applied to a port
where one or more pins are used as input/outputs. For
example, a BSFoperation on bit5 of PORTB will cause
all eight bits of PORTB to be read into the CPU, bit5 to
be set and the PORTB value to be written to the output
; PORTB<3:0> Outputs
;PORTB<7:6> have external pull-ups and are
;not connected to other circuitry
;
;
;
PORT latch PORT pins
---------- ----------
BCF
BCF
MOVLW 03Fh
TRIS PORTB
PORTB, 7
PORTB, 6
;01pp pppp
;10pp pppp
;
11pp pppp
11pp pppp
latches. If another bit of PORTB is used as
a
;10pp pppp
10pp pppp
bi-directional I/O pin (say bit0) and it is defined as an
input at this time, the input signal present on the pin
itself would be read into the CPU and rewritten to the
data latch of this particular pin, overwriting the
previous content. As long as the pin stays in the input
mode, no problem occurs. However, if bit0 is switched
into output mode later on, the content of the data latch
may now be unknown.
;
;Note that the user may have expected the pin
;values to be 00pp pppp. The 2nd BCF caused
;RB7 to be latched as the pin value (High).
5.5.2
SUCCESSIVE OPERATIONS ON I/O
PORTS
The actual write to an I/O port happens at the end of
an instruction cycle, whereas for reading, the data
must be valid at the beginning of the instruction cycle
(Figure 5-2). Therefore, care must be exercised if a
write followed by a read operation is carried out on the
same I/O port. The sequence of instructions should
allow the pin voltage to stabilize (load dependent)
before the next instruction, which causes that file to be
read into the CPU, is executed. Otherwise, the
previous state of that pin may be read into the CPU
rather than the new state. When in doubt, it is better to
separate these instructions with a NOP or another
instruction not accessing this I/O port.
Example 5-1 shows the effect of two sequential
read-modify-write instructions (e.g., BCF, BSF, etc.) on
an I/O port.
A pin actively outputting a high or a low should not be
driven from external devices at the same time in order
to change the level on this pin (“wired-or”, “wired-and”).
The resulting high output currents may damage the
chip.
FIGURE 5-2: SUCCESSIVE I/O OPERATION
Q4
Q4
Q4
Q1 Q2
Q4
Q3
Q3
Q3
Q3
Q1 Q2
PC
Q1 Q2
Q1 Q2
PC + 3
NOP
PC + 1
PC + 2
NOP
Instruction
fetched
MOVWF PORTB MOVF PORTB,W
This example shows a write
to PORTB followed by a read
from PORTB.
RB7:RB0
Port pin
written here
Port pin
sampled here
Instruction
executed
MOVWF PORTB MOVF PORTB,W
NOP
(Write to
PORTB)
(Read
PORTB)
DS40191A-page 20
Preliminary
1998 Microchip Technology Inc.
PIC16CR54C
Counter mode is selected by setting the T0CS bit
(OPTION<5>). In this mode, Timer0 will increment
either on every rising or falling edge of pin T0CKI. The
incrementing edge is determined by the source edge
select bit T0SE (OPTION<4>). Clearing the T0SE bit
selects the rising edge. Restrictions on the external
clock input are discussed in detail in Section 6.1.
6.0
TIMER0 MODULE AND
TMR0 REGISTER
The Timer0 module has the following features:
• 8-bit timer/counter register, TMR0
- Readable and writable
• 8-bit software programmable prescaler
• Internal or external clock select
- Edge select for external clock
The prescaler may be used by either the Timer0
module or the Watchdog Timer, but not both. The
prescaler assignment is controlled in software by the
control bit PSA (OPTION<3>). Clearing the PSA bit
will assign the prescaler to Timer0. The prescaler is
not readable or writable. When the prescaler is
assigned to the Timer0 module, prescale values of 1:2,
1:4,..., 1:256 are selectable. Section 6.2 details the
operation of the prescaler.
Figure 6-1 is a simplified block diagram of the Timer0
module, while Figure 6-2 shows the electrical structure
of the Timer0 input.
Timer mode is selected by clearing the T0CS bit
(OPTION<5>). In timer mode, the Timer0 module will
increment every instruction cycle (without prescaler). If
TMR0 register is written, the increment is inhibited for
the following two cycles (Figure 6-3 and Figure 6-4).
The user can work around this by writing an adjusted
value to the TMR0 register.
A summary of registers associated with the Timer0
module is found in Table 6-1.
FIGURE 6-1: TIMER0 BLOCK DIAGRAM
Data bus
FOSC/4
0
1
PSout
8
1
0
Sync with
Internal
Clocks
TMR0 reg
T0CKI
pin
Programmable
PSout
Sync
(2)
Prescaler
(1)
(2 cycle delay)
T0SE
3
(1)
(1)
PS2, PS1, PS0
PSA
(1)
T0CS
Note 1: Bits T0CS, T0SE, PSA, PS2, PS1 and PS0 are located in the OPTION register.
2: The prescaler is shared with the Watchdog Timer (Figure 6-6).
FIGURE 6-2: ELECTRICAL STRUCTURE OF T0CKI PIN
RIN
T0CKI
pin
(1)
Schmitt Trigger
Input Buffer
N
(1)
VSS
VSS
Note 1: ESD protection circuits
1998 Microchip Technology Inc.
Preliminary
DS40191A-page 21
PIC16CR54C
FIGURE 6-3: TIMER0 TIMING: INTERNAL CLOCK/NO PRESCALE
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
PC
(Program
Counter)
PC-1
PC
PC+1
PC+2
PC+3
PC+4
PC+5
PC+6
Instruction
Fetch
MOVF TMR0,W MOVF TMR0,W MOVF TMR0,W MOVF TMR0,W MOVF TMR0,W
MOVWF TMR0
T0
T0+1
T0+2
NT0
NT0
NT0
NT0+1
NT0+2
Timer0
Instruction
Executed
Read TMR0
reads NT0 + 1
Read TMR0
reads NT0
Read TMR0
reads NT0
Read TMR0
reads NT0
Read TMR0
reads NT0 + 2
Write TMR0
executed
FIGURE 6-4: TIMER0 TIMING: INTERNAL CLOCK/PRESCALE 1:2
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
PC
(Program
Counter)
PC-1
PC
PC+1
PC+2
PC+3
PC+4
PC+5
PC+6
MOVF TMR0,W MOVF TMR0,W MOVF TMR0,W MOVF TMR0,W MOVF TMR0,W
MOVWF TMR0
Instruction
Fetch
T0
T0+1
NT0+1
NT0
Timer0
Instruction
Execute
Read TMR0
reads NT0
Read TMR0
reads NT0
Read TMR0
reads NT0
Read TMR0
reads NT0
Read TMR0
reads NT0 + 1
Write TMR0
executed
TABLE 6-1:
Address
REGISTERS ASSOCIATED WITH TIMER0
Value on
Power-On
Reset
Value on
MCLR and
WDT Reset
Name
Bit 7
Timer0 - 8-bit real-time clock/counter
T0CS T0SE PSA
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
01h
N/A
TMR0
xxxx xxxx uuuu uuuu
OPTION
—
—
PS2
PS1
PS0 --11 1111 --11 1111
Legend: Shaded cells: Unimplemented bits,
-= unimplemented, x = unknown, u= unchanged,
DS40191A-page 22
Preliminary
1998 Microchip Technology Inc.
PIC16CR54C
When a prescaler is used, the external clock input is
divided by the asynchronous ripple counter-type
prescaler so that the prescaler output is symmetrical.
For the external clock to meet the sampling
requirement, the ripple counter must be taken into
account. Therefore, it is necessary for T0CKI to have a
period of at least 4TOSC (and a small RC delay of
40 ns) divided by the prescaler value. The only
requirement on T0CKI high and low time is that they
do not violate the minimum pulse width requirement of
10 ns. Refer to parameters 40, 41 and 42 in the
electrical specification of the desired device.
6.1
Using Timer0 with an External Clock
When an external clock input is used for Timer0, it
must meet certain requirements. The external clock
requirement is due to internal phase clock (TOSC)
synchronization. Also, there is a delay in the actual
incrementing of Timer0 after synchronization.
6.1.1
EXTERNAL CLOCK SYNCHRONIZATION
When no prescaler is used, the external clock input is
the same as the prescaler output. The synchronization
of T0CKI with the internal phase clocks is
accomplished by sampling the prescaler output on the
Q2 and Q4 cycles of the internal phase clocks
(Figure 6-5). Therefore, it is necessary for T0CKI to be
high for at least 2TOSC (and a small RC delay of 20 ns)
and low for at least 2TOSC (and a small RC delay of
20 ns). Refer to the electrical specification of the
desired device.
6.1.2
TIMER0 INCREMENT DELAY
Since the prescaler output is synchronized with the
internal clocks, there is a small delay from the time the
external clock edge occurs to the time the Timer0
module is actually incremented. Figure 6-5 shows the
delay from the external clock edge to the timer
incrementing.
FIGURE 6-5: TIMER0 TIMING WITH EXTERNAL CLOCK
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
Small pulse
External Clock Input or
misses sampling
Prescaler Output (2)
(1)
External Clock/Prescaler
Output After Sampling
(3)
Increment Timer0 (Q4)
Timer0
T0
T0 + 1
T0 + 2
Note 1: Delay from clock input change to Timer0 increment is 3Tosc to 7Tosc. (Duration of Q = Tosc).
Therefore, the error in measuring the interval between two edges on Timer0 input = ± 4Tosc max.
2: External clock if no prescaler selected, Prescaler output otherwise.
3: The arrows indicate the points in time where sampling occurs.
1998 Microchip Technology Inc.
Preliminary
DS40191A-page 23
PIC16CR54C
following instruction sequence (Example 6-1) must be
executed when changing the prescaler assignment from
Timer0 to the WDT.
6.2
Prescaler
An 8-bit counter is available as a prescaler for the
Timer0 module, or as a postscaler for the Watchdog
Timer (WDT) (WDT postscaler not implemented on
PIC16C52), respectively (Section 6.1.2). For simplicity,
this counter is being referred to as “prescaler”
throughout this data sheet. Note that the prescaler
may be used by either the Timer0 module or the WDT,
but not both. Thus, a prescaler assignment for the
Timer0 module means that there is no prescaler for
the WDT, and vice-versa.
EXAMPLE 6-1: CHANGING PRESCALER
(TIMER0→WDT)
1.CLRWDT
2.CLRF
;Clear WDT
TMR0
;Clear TMR0 & Prescaler
3.MOVLW '00xx1111’b ;These 3 lines (5, 6, 7)
4.OPTION
; are required only if
; desired
5.CLRWDT
;PS<2:0> are 000 or 001
6.MOVLW '00xx1xxx’b ;Set Postscaler to
7.OPTION ; desired WDT rate
The PSA and PS2:PS0 bits (OPTION<3:0>) determine
prescaler assignment and prescale ratio.
To change prescaler from the WDT to the Timer0
module, use the sequence shown in Example 6-2. This
sequence must be used even if the WDT is disabled. A
CLRWDTinstruction should be executed before switching
the prescaler.
When assigned to the Timer0 module, all instructions
writing to the TMR0 register (e.g., CLRF 1, MOVWF 1,
BSF 1,x,etc.) will clear the prescaler. When assigned
to WDT, a CLRWDT instruction will clear the prescaler
along with the WDT. The prescaler is neither readable
nor writable. On a RESET, the prescaler contains all
'0's.
EXAMPLE 6-2: CHANGING PRESCALER
(WDT→TIMER0)
CLRWDT
;Clear WDT and
6.2.1
SWITCHING PRESCALER ASSIGNMENT
;prescaler
MOVLW 'xxxx0xxx'
;Select TMR0, new
;prescale value and
;clock source
The prescaler assignment is fully under software control
(i.e., it can be changed “on the fly” during program
execution). To avoid an unintended device RESET, the
OPTION
FIGURE 6-6: BLOCK DIAGRAM OF THE TIMER0/WDT PRESCALER
TCY ( = Fosc/4)
Data Bus
8
0
M
U
X
1
M
U
X
T0CKI
pin
1
Sync
2
Cycles
TMR0 reg
0
T0SE
T0CS
PSA
0
1
8-bit Prescaler
M
U
X
8
Watchdog
Timer
8 - to - 1MUX
PS2:PS0
PSA
1
0
WDT Enable bit
MUX
PSA
WDT
Time-Out
Note: T0CS, T0SE, PSA, PS2:PS0 are bits in the OPTION register.
DS40191A-page 24
Preliminary
1998 Microchip Technology Inc.
PIC16CR54C
The SLEEP mode is designed to offer a very low
current power-down mode. The user can wake up from
SLEEP through external reset or through a Watchdog
Timer time-out. Several oscillator options are also
made available to allow the part to fit the application.
The RC oscillator option saves system cost while the
LP crystal option saves power. A set of configuration
bits are used to select various options.
7.0
SPECIAL FEATURES OF THE
CPU
What sets
a
microcontroller apart from other
processors are special circuits that deal with the
needs of real-time applications. The PIC16C5X family
of microcontrollers has
intended to maximize system reliability, minimize cost
through elimination of external components, provide
power saving operating modes and offer code
protection. These features are:
a host of such features
7.1
Configuration Bits
Configuration bits can be programmed to select
various device configurations. Two bits are for the
selection of the oscillator type and one bit is the
Watchdog Timer enable bit. Nine bits are code
protection bits (Figure 7-1 and Figure 7-2) for the
PIC16CR54C devices.
• Oscillator selection
• Reset
• Power-On Reset (POR)
• Device Reset Timer (DRT)
• Watchdog Timer (WDT)
• SLEEP
ROM devices have the oscillator configuration
programmed at the factory and these parts are tested
accordingly (see "Product Identification System"
diagrams in the back of this data sheet).
• Code protection
The PIC16CR54C Family has a Watchdog Timer
which can be shut off only through configuration bit
WDTE. It runs off of its own RC oscillator for added
reliability. There is an 18 ms delay provided by the
Device Reset Timer (DRT), intended to keep the chip
in reset until the crystal oscillator is stable. With this
timer on-chip, most applications need no external
reset circuitry.
FIGURE 7-1: CONFIGURATION WORD FOR PIC16CR54C
CP
CP
10
CP
9
CP
8
CP
7
CP
6
CP
5
CP
4
CP
3
WDTE FOSC1 FOSC0
bit0
Register: CONFIG
(1)
Address
:
0FFFh
bit11
2
1
bit 11-3: CP: Code protection bits
1 = Code protection off
0 = Code protection on
bit 2:
WDTE: Watchdog timer enable bit
1 = WDT enabled
0 = WDT disabled
bit 1-0: FOSC1:FOSC0: Oscillator selection bits
11 = RC oscillator
10 = HS oscillator
01 = XT oscillator
00 = LP oscillator
Note 1: Refer to the PIC16C5X Programming Specification (Literature number DS30190) to determine how to
access the configuration word.
1998 Microchip Technology Inc.
Preliminary
DS40191A-page 25
PIC16CR54C
7.2
Oscillator Configurations
OSCILLATOR TYPES
FIGURE 7-3: EXTERNAL CLOCK INPUT
OPERATION (HS, XT OR LP
7.2.1
OSC CONFIGURATION)
PIC16CR54Cs can be operated in four different
oscillator modes. The user can program two
configuration bits (FOSC1:FOSC0) to select one of
these four modes:
OSC1
OSC2
Clock from
ext. system
PIC16CR54C
Open
• LP:
• XT:
• HS:
• RC:
Low Power Crystal
Crystal/Resonator
High Speed Crystal/Resonator
Resistor/Capacitor
TABLE 7-1:
CAPACITOR SELECTION
FOR CERAMIC RESONATORS
- PIC16CR54C
7.2.2
CRYSTAL OSCILLATOR / CERAMIC
RESONATORS
Osc
Resonator Cap. Range Cap. Range
Type
Freq
C1
C2
In XT, LP or HS modes, a crystal or ceramic resonator
is connected to the OSC1/CLKIN and OSC2/CLKOUT
pins to establish oscillation (Figure 7-2). The
PIC16CR54C oscillator design requires the use of a
parallel cut crystal. Use of a series cut crystal may
give a frequency out of the crystal manufacturers
specifications. When in XT, LP or HS modes, the
device can have an external clock source drive the
OSC1/CLKIN pin (Figure 7-3).
XT
455 kHz
2.0 MHz
4.0 MHz
68-100 pF
15-33 pF
10-22 pF
68-100 pF
15-33 pF
10-22 pF
HS
8.0 MHz
16.0 MHz
10-22 pF
10 pF
10-22 pF
10 pF
These values are for design guidance only. Since
each resonator has its own characteristics, the user
should consult the resonator manufacturer for
appropriate values of external components.
FIGURE 7-2: CRYSTAL OPERATION
(OR CERAMIC RESONATOR)
(HS, XT OR LP OSC
TABLE 7-2:
CAPACITOR SELECTION
FOR CRYSTAL OSCILLATOR
- PIC16CR54C
CONFIGURATION)
Osc
Type
Resonator Cap.Range Cap. Range
(1)
C1
OSC1
Freq
C1
C2
PIC16CR54C
(1)
LP
XT
32 kHz
15 pF
15 pF
SLEEP
100 kHz
200 kHz
455 kHz
1 MHz
15-30 pF
15-30 pF
15-30 pF
15-30 pF
15 pF
200-300 pF
100-200 pF
15-100 pF
15-30 pF
15 pF
XTAL
(3)
RF
To internal
logic
OSC2
(2)
RS
(1)
C2
2 MHz
4 MHz
15 pF
15 pF
Note 1: See Capacitor Selection tables for
recommended values of C1 and C2.
2: A series resistor (RS) may be required for
AT strip cut crystals.
HS
4 MHz
8 MHz
20 MHz
15 pF
15 pF
15 pF
15 pF
15 pF
15 pF
3: RF varies with the crystal chosen (approx.
value = 10 MΩ).
Note 1: For VDD > 4.5V, C1 = C2 ≈ 30 pF is
recommended.
These values are for design guidance only. Rs may
be required in HS mode as well as XT mode to avoid
overdriving crystals with low drive level specification.
Since each crystal has its own characteristics, the
user should consult the crystal manufacturer for
appropriate values of external components.
Note:
If you change from this device to
another device, please verify oscillator
characteristics in your application.
DS40191A-page 26
Preliminary
1998 Microchip Technology Inc.
PIC16CR54C
7.2.3
EXTERNAL CRYSTAL OSCILLATOR
CIRCUIT
FIGURE 7-5: EXTERNAL SERIES
RESONANT CRYSTAL
OSCILLATOR CIRCUIT
(USING XT, HS OR LP
OSCILLATOR MODE)
Either a prepackaged oscillator or a simple oscillator
circuit with TTL gates can be used as an external
crystal oscillator circuit. Prepackaged oscillators
provide a wide operating range and better stability. A
well-designed crystal oscillator will provide good
performance with TTL gates. Two types of crystal
oscillator circuits can be used: one with parallel
resonance, or one with series resonance.
To Other
Devices
330
330
PIC16CR54C
74AS04
74AS04
74AS04
CLKIN
0.1 µF
Figure 7-4 shows implementation of
a
parallel
OSC2
XTAL
resonant oscillator circuit. The circuit is designed to
use the fundamental frequency of the crystal. The
74AS04 inverter performs the 180-degree phase shift
that a parallel oscillator requires. The 4.7 kΩ resistor
provides the negative feedback for stability. The 10 kΩ
potentiometers bias the 74AS04 in the linear region.
This circuit could be used for external oscillator
designs.
100k
Note:
If you change from this device to
another device, please verify oscillator
characteristics in your application.
FIGURE 7-4: EXTERNAL PARALLEL
RESONANT CRYSTAL
7.2.4
RC OSCILLATOR
For timing insensitive applications, the RC device option
offers additional cost savings. The RC oscillator
frequency is a function of the supply voltage, the
resistor (Rext) and capacitor (Cext) values, and the
operating temperature. In addition to this, the oscillator
frequency will vary from unit to unit due to normal
process parameter variation. Furthermore, the
difference in lead frame capacitance between package
types will also affect the oscillation frequency, especially
for low Cext values. The user also needs to take into
account variation due to tolerance of external R and C
components used.
OSCILLATOR CIRCUIT
(USING XT, HS OR LP
OSCILLATOR MODE)
+5V
To Other
Devices
10k
74AS04
PIC16CR54C
4.7k
CLKIN
74AS04
OSC2
10k
100k
XTAL
Figure 7-6 shows how the R/C combination is
connected to the PIC16CR54C. For Rext values below
2.2 kΩ, the oscillator operation may become unstable,
or stop completely. For very high Rext values
(e.g., 1 MΩ) the oscillator becomes sensitive to noise,
humidity and leakage. Thus, we recommend keeping
Rext between 3 kΩ and 100 kΩ.
10k
20 pF
20 pF
Although the oscillator will operate with no external
capacitor (Cext = 0 pF), we recommend using values
above 20 pF for noise and stability reasons. With no or
small external capacitance, the oscillation frequency
can vary dramatically due to changes in external
capacitances, such as PCB trace capacitance or
package lead frame capacitance.
Note:
If you change from this device to
another device, please verify oscillator
characteristics in your application.
Figure 7-5 shows a series resonant oscillator circuit.
This circuit is also designed to use the fundamental
frequency of the crystal. The inverter performs a
180-degree phase shift in a series resonant oscillator
circuit. The 330 Ω resistors provide the negative
feedback to bias the inverters in their linear region.
1998 Microchip Technology Inc.
Preliminary
DS40191A-page 27
PIC16CR54C
The Electrical Specifications sections show RC
frequency variation from part to part due to normal
process variation. The variation is larger for larger R
(since leakage current variation will affect RC
frequency more for large R) and for smaller C (since
variation of input capacitance will affect RC frequency
more).
7.3
Reset
PIC16CR54C devices may be reset in one of the
following ways:
• Power-On Reset (POR)
• MCLR reset (normal operation)
• MCLR wake-up reset (from SLEEP)
• WDT reset (normal operation)
• WDT wake-up reset (from SLEEP)
Also, see the Electrical Specifications sections for
variation of oscillator frequency due to VDD for given
Rext/Cext values as well as frequency variation due to
operating temperature for given R, C, and VDD values.
Table 7-3 shows these reset conditions for the PCL
and STATUS registers.
The oscillator frequency, divided by 4, is available on
the OSC2/CLKOUT pin, and can be used for test
purposes or to synchronize other logic.
Some registers are not affected in any reset condition.
Their status is unknown on POR and unchanged in
any other reset. Most other registers are reset to a
“reset state” on Power-On Reset (POR), MCLR or
WDT reset. A MCLR or WDT wake-up from SLEEP
also results in a device reset, and not a continuation of
operation before SLEEP.
FIGURE 7-6: RC OSCILLATOR MODE
VDD
Rext
Internal
clock
OSC1
N
The TO and PD bits (STATUS <4:3>) are set or
cleared depending on the different reset conditions
(Section 7.7). These bits may be used to determine
the nature of the reset.
Cext
VSS
PIC16CR54C
Table 7-4 lists a full description of reset states of all
registers. Figure 7-7 shows a simplified block diagram
of the on-chip reset circuit.
Fosc/4
OSC2/CLKOUT
Note:
If you change from this device to
another device, please verify oscillator
characteristics in your application.
DS40191A-page 28
Preliminary
1998 Microchip Technology Inc.
PIC16CR54C
TABLE 7-3:
RESET CONDITIONS FOR SPECIAL REGISTERS
PCL
Addr: 02h
STATUS
Addr: 03h
Condition
Power-On Reset
1111 1111
1111 1111
1111 1111
1111 1111
1111 1111
0001 1xxx
(1)
MCLR reset (normal operation)
MCLR wake-up (from SLEEP)
WDT reset (normal operation)
WDT wake-up (from SLEEP)
000u uuuu
0001 0uuu
(2)
0000 1uuu
0000 0uuu
Legend: u= unchanged, x= unknown, -= unimplemented read as '0'.
Note 1: TO and PD bits retain their last value until one of the other reset conditions occur.
2: The CLRWDTinstruction will set the TO and PD bits.
TABLE 7-4:
Register
RESET CONDITIONS FOR ALL REGISTERS
Address
Power-On Reset
MCLR or WDT Reset
W
N/A
N/A
xxxx xxxx
1111 1111
--11 1111
xxxx xxxx
xxxx xxxx
1111 1111
0001 1xxx
111x xxxx
---- xxxx
xxxx xxxx
xxxx xxxx
uuuu uuuu
1111 1111
--11 1111
uuuu uuuu
uuuu uuuu
1111 1111
000q quuu
111u uuuu
---- uuuu
uuuu uuuu
uuuu uuuu
TRIS
OPTION
INDF
TMR0
N/A
00h
01h
(1)
PCL
02h
(1)
STATUS
03h
FSR
04h
PORTA
05h
PORTB
06h
General Purpose Register Files
07-1Fh
Legend: u= unchanged, x= unknown, -= unimplemented, read as '0',
q= see tables in Section 7.7 for possible values.
Note 1: See Table 7-3 for reset value for specific conditions.
FIGURE 7-7: SIMPLIFIED BLOCK DIAGRAM OF ON-CHIP RESET CIRCUIT
Power-Up
Detect
POR (Power-On Reset)
VDD
MCLR/VPP pin
WDT Time-out
RESET
8-bit Asynch
S
R
Q
WDT
On-Chip
RC OSC
Ripple Counter
Q
(Start-Up Timer)
CHIP RESET
DS40191A-page 29
Preliminary
1998 Microchip Technology Inc.
PIC16CR54C
7.4
Power-On Reset (POR)
FIGURE 7-8: EXTERNAL POWER-ON
RESET CIRCUIT (FOR SLOW
VDD POWER-UP)
The PIC16CR54C incorporates on-chip Power-On
Reset (POR) circuitry which provides an internal chip
reset for most power-up situations. To use this feature,
the user merely ties the MCLR/VPP pin to VDD. A
simplified block diagram of the on-chip Power-On
Reset circuit is shown in Figure 7-7.
VDD
VDD
D
R
R1
MCLR
The Power-On Reset circuit and the Device Reset
Timer (Section 7.5) circuit are closely related. On
power-up, the reset latch is set and the DRT is reset.
The DRT timer begins counting once it detects MCLR
to be high. After the time-out period, which is typically
18 ms, it will reset the reset latch and thus end the
on-chip reset signal.
PIC16CR54C
C
• External Power-On Reset circuit is required
only if VDD power-up is too slow. The diode D
helps discharge the capacitor quickly when
VDD powers down.
A power-up example where MCLR is not tied to VDD is
shown in Figure 7-9. VDD is allowed to rise and
stabilize before bringing MCLR high. The chip will
actually come out of reset TDRT msec after MCLR
goes high.
• R < 40 kΩ is recommended to make sure that
voltage drop across R does not violate the
device electrical specification.
• R1 = 100Ω to 1 kΩ will limit any current
flowing into MCLR from external capacitor C
in the event of MCLR pin breakdown due to
Electrostatic Discharge (ESD) or Electrical
Overstress (EOS).
In Figure 7-10, the on-chip Power-On Reset feature is
being used (MCLR and VDD are tied together). The
VDD is stable before the start-up timer times out and
there is no problem in getting a proper reset. However,
Figure 7-11 depicts a problem situation where VDD
rises too slowly. The time between when the DRT
senses a high on the MCLR/VPP pin, and when the
MCLR/VPP pin (and VDD) actually reach their full value,
is too long. In this situation, when the start-up timer
times out, VDD has not reached the VDD (min) value
and the chip is, therefore, not guaranteed to function
correctly. For such situations, we recommend that
external RC circuits be used to achieve longer POR
delay times (Figure 7-8).
Note: When the device starts normal operation
(exits the reset condition), device operat-
ing parameters (voltage, frequency, tem-
perature, etc.) must be meet to ensure
operation. If these conditions are not met,
the device must be held in reset until the
operating conditions are met.
For more information on PIC16CR54C POR, see
Power-Up Considerations - AN522 in the Embedded
Control Handbook.
The POR circuit does not produce an internal reset
when VDD declines.
DS40191A-page 30
Preliminary
1998 Microchip Technology Inc.
PIC16CR54C
FIGURE 7-9: TIME-OUT SEQUENCE ON POWER-UP (MCLR NOT TIED TO VDD)
VDD
MCLR
INTERNAL POR
TDRT
DRT TIME-OUT
INTERNAL RESET
FIGURE 7-10: TIME-OUT SEQUENCE ON POWER-UP (MCLR TIED TO VDD): FAST VDD RISE TIME
VDD
MCLR
INTERNAL POR
TDRT
DRT TIME-OUT
INTERNAL RESET
FIGURE 7-11: TIME-OUT SEQUENCE ON POWER-UP (MCLRTIED TO VDD): SLOW VDD RISETIME
V1
VDD
MCLR
INTERNAL POR
TDRT
DRT TIME-OUT
INTERNAL RESET
When VDD rises slowly, the TDRT time-out expires long before VDD has reached its final value. In
this example, the chip will reset properly if, and only if, V1 ≥ VDD min
DS40191A-page 31
Preliminary
1998 Microchip Technology Inc.
PIC16CR54C
7.5
Device Reset Timer (DRT)
7.6
Watchdog Timer (WDT)
The Device Reset Timer (DRT) provides a fixed 18 ms
nominal time-out on reset. The DRT operates on an
internal RC oscillator. The processor is kept in RESET
as long as the DRT is active. The DRT delay allows
VDD to rise above VDD min., and for the oscillator to
stabilize.
The Watchdog Timer (WDT) is a free running on-chip
RC oscillator which does not require any external
components. This RC oscillator is separate from the RC
oscillator of the OSC1/CLKIN pin. That means that the
WDT will run even if the clock on the OSC1/CLKIN and
OSC2/CLKOUT pins have been stopped, for example,
by execution of a SLEEP instruction. During normal
operation or SLEEP, a WDT reset or wake-up reset
generates a device RESET.
Oscillator circuits based on crystals or ceramic
resonators require a certain time after power-up to
establish a stable oscillation. The on-chip DRT keeps
the device in a RESET condition for approximately 18
ms after the voltage on the MCLR/VPP pin has
reached a logic high (VIH) level. Thus, external RC
networks connected to the MCLR input are not
required in most cases, allowing for savings in
cost-sensitive and/or space restricted applications.
The TO bit (STATUS<4>) will be cleared upon
Watchdog Timer reset.
a
The WDT can be permanently disabled by programming
the configuration bit WDTE as a '0' (Section 7.1). Refer
to the PIC16C5X Programming Specifications
(Literature Number DS30190) to determine how to
access the configuration word.
The Device Reset time delay will vary from chip to chip
due to VDD, temperature, and process variation. See
AC parameters for details.
7.6.1
WDT PERIOD
The DRT will also be triggered upon a Watchdog Timer
time-out. This is particularly important for applications
using the WDT to wake the PIC16CR54C from SLEEP
mode automatically.
The WDT has a nominal time-out period of 18 ms, (with
no prescaler). If a longer time-out period is desired, a
prescaler with a division ratio of up to 1:128 can be
assigned to the WDT (under software control) by writing
to the OPTION register. Thus, time-out a period of a
nominal 2.3 seconds can be realized. These periods
vary with temperature, VDD and part-to-part process
variations (see DC specs).
Under worst case conditions (VDD = Min., Temperature
= Max., max. WDT prescaler), it may take several
seconds before a WDT time-out occurs.
7.6.2
WDT PROGRAMMING CONSIDERATIONS
The CLRWDT instruction clears the WDT and the
postscaler, if assigned to the WDT, and prevents it from
timing out and generating a device RESET.
The SLEEP instruction resets the WDT and the
postscaler, if assigned to the WDT. This gives the
maximum SLEEP time before a WDT wake-up reset.
DS40191A-page 32
Preliminary
1998 Microchip Technology Inc.
PIC16CR54C
FIGURE 7-12: WATCHDOG TIMER BLOCK DIAGRAM
From TMR0 Clock Source
0
M
Postscaler
1
Watchdog
Timer
U
X
8 - to - 1 MUX
PS2:PS0
PSA
WDT Enable
EPROM Bit
To TMR0
1
0
PSA
MUX
Note: T0CS, T0SE, PSA, PS2:PS0
are bits in the OPTION register.
WDT
Time-out
TABLE 7-5:
SUMMARY OF REGISTERS ASSOCIATED WITH THE WATCHDOG TIMER
Value on
Power-On
Reset
Value on
MCLR and
WDT Reset
Address
Name
OPTION
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
N/A
—
—
T0CS
T0SE
PSA
PS2
PS1
PS0
--11 1111 --11 1111
Legend: Shaded boxes = Not used by Watchdog Timer,
–= unimplemented, read as '0', u= unchanged
DS40191A-page 33
Preliminary
1998 Microchip Technology Inc.
PIC16CR54C
7.7
Time-Out Sequence and Power Down
Status Bits (TO/PD)
7.8
Reset on Brown-Out
A brown-out is a condition where device power (VDD)
dips below its minimum value, but not to zero, and then
recovers. The device should be reset in the event of a
brown-out.
The TO and PD bits in the STATUS register can be
tested to determine if a RESET condition has been
caused by a power-up condition, a MCLR or Watchdog
Timer (WDT) reset, or a MCLR or WDT wake-up reset.
To reset PIC16CR54C devices when a brown-out
occurs, external brown-out protection circuits may be
built, as shown in Figure 7-13 and Figure 7-14.
TABLE 7-6:
TO/PD STATUS AFTER
RESET
FIGURE 7-13: BROWN-OUT PROTECTION
CIRCUIT 1
TO
PD
RESET was caused by
Power-up (POR)
1
u
1
u
(1)
VDD
MCLR reset (normal operation)
1
0
0
0
1
0
MCLR wake-up reset (from SLEEP)
WDT reset (normal operation)
VDD
33k
WDT wake-up reset (from SLEEP)
Q1
Legend: u= unchanged
10k
MCLR
Note 1: The TO and PD bits maintain their status (u) until
a reset occurs. A low-pulse on the MCLR input
does not change the TO and PD status bits.
40k
PIC16CR54C
These STATUS bits are only affected by events listed
in Table 7-7.
This circuit will activate reset when VDD goes below Vz +
0.7V (where Vz = Zener voltage).
TABLE 7-7:
EVENTS AFFECTING TO/PD
STATUS BITS
Event
TO PD
Remarks
1
0
1
1
1
u
0
1
Power-up
FIGURE 7-14: BROWN-OUT PROTECTION
CIRCUIT 2
WDT Time-out
No effect on PD
SLEEPinstruction
CLRWDTinstruction
Legend: u= unchanged
VDD
VDD
A WDT time-out will occur regardless of the status of the TO
bit. A SLEEPinstruction will be executed, regardless of the
status of the PD bit. Table 7-6 reflects the status of TO and
PD after the corresponding event.
R1
Q1
MCLR
R2
Table 7-3 lists the reset conditions for the special
function registers, while Table 7-4 lists the reset
conditions for all the registers.
40k
PIC16CR54C
This brown-out circuit is less expensive, although
less accurate. Transistor Q1 turns off when VDD
is below a certain level such that:
R1
= 0.7V
VDD •
R1 + R2
DS40191A-page 34
Preliminary
1998 Microchip Technology Inc.
PIC16CR54C
7.9
Power-Down Mode (SLEEP)
7.10
Program Verification/Code Protection
A device may be powered down (SLEEP) and later
powered up (Wake-up from SLEEP).
If the code protection bit(s) have not been
programmed, the on-chip program memory can be
read out for verification purposes.
7.9.1
SLEEP
Note: Microchip does not recommend code pro-
The Power-Down mode is entered by executing a
tecting windowed devices.
SLEEPinstruction.
If enabled, the Watchdog Timer will be cleared but
keeps running, the TO bit (STATUS<4>) is set, the PD
bit (STATUS<3>) is cleared and the oscillator driver is
turned off. The I/O ports maintain the status they had
before the SLEEP instruction was executed (driving
high, driving low, or hi-impedance).
It should be noted that a RESET generated by a WDT
time-out does not drive the MCLR/VPP pin low.
For lowest current consumption while powered down,
the T0CKI input should be at VDD or VSS and the
MCLR/VPP pin must be at a logic high level
(VIH MCLR).
7.9.2
WAKE-UP FROM SLEEP
The device can wake up from SLEEP through one of
the following events:
1. An external reset input on MCLR/VPP pin.
2. A Watchdog Timer time-out reset (if WDT was
enabled).
Both of these events cause a device reset.The TO and
PD bits can be used to determine the cause of device
reset.
The TO bit is cleared if a WDT time-out
occurred (and caused wake-up). The PD bit, which is
set on power-up, is cleared when SLEEPis invoked.
The WDT is cleared when the device wakes from
sleep, regardless of the wake-up source.
1998 Microchip Technology Inc.
Preliminary
DS40191A-page 35
PIC16CR54C
NOTES:
DS40191A-page 36
Preliminary
1998 Microchip Technology Inc.
PIC16CR54C
All instructions are executed within one single
instruction cycle, unless a conditional test is true or the
8.0
INSTRUCTION SET SUMMARY
Each PIC16CR54C instruction is a 12-bit word divided into
an OPCODE, which specifies the instruction type, and one
or more operands which further specify the operation of
the instruction.The PIC16CR54C instruction set summary
in Table 8-2 groups the instructions into byte-oriented,
bit-oriented, and literal and control operations. Table 8-1
shows the opcode field descriptions.
program counter is changed as
a result of an
instruction. In this case, the execution takes two
instruction cycles. One instruction cycle consists of
four oscillator periods. Thus, for an oscillator frequency
of 4 MHz, the normal instruction execution time is 1 µs.
If a conditional test is true or the program counter is
changed as a result of an instruction, the instruction
execution time is 2 µs.
For byte-oriented instructions, 'f' represents a file register
designator and 'd' represents a destination designator.The
file register designator is used to specify which one of the
32 file registers is to be used by the instruction.
Figure 8-1 shows the three general formats that the
instructions can have. All examples in the figure use the
following format to represent a hexadecimal number:
The destination designator specifies where the result
of the operation is to be placed. If 'd' is '0', the result is
placed in the W register. If 'd' is '1', the result is placed
in the file register specified in the instruction.
0xhhh
where 'h' signifies a hexadecimal digit.
FIGURE 8-1: GENERAL FORMAT FOR
INSTRUCTIONS
For bit-oriented instructions, 'b' represents a bit field
designator which selects the number of the bit affected
by the operation, while 'f' represents the number of the
file in which the bit is located.
Byte-oriented file register operations
11
6
5
4
0
OPCODE
d
f (FILE #)
For literal and control operations, 'k' represents an
8 or 9-bit constant or literal value.
d = 0 for destination W
d = 1 for destination f
f = 5-bit file register address
Bit-oriented file register operations
11 8 7
b (BIT #)
TABLE 8-1:
OPCODE FIELD
DESCRIPTIONS
5
4
0
Field
Description
OPCODE
f (FILE #)
f
W
b
k
Register file address (0x00 to 0x7F)
Working register (accumulator)
b = 3-bit bit address
f = 5-bit file register address
Bit address within an 8-bit file register
Literal field, constant data or label
Literal and control operations (except GOTO)
11
Don't care location (= 0 or 1)
8
7
0
The assembler will generate code with x = 0. It is
the recommended form of use for compatibility
with all Microchip software tools.
x
d
OPCODE
k (literal)
k = 8-bit immediate value
Literal and control operations - GOTOinstruction
11 0
Destination select;
d = 0 (store result in W)
d = 1 (store result in file register 'f')
Default is d = 1
9
8
OPCODE
k (literal)
label Label name
TOS
PC
Top of Stack
k = 9-bit immediate value
Program Counter
Watchdog Timer Counter
Time-Out bit
WDT
TO
PD
Power-Down bit
Destination, either the W register or the specified
register file location
dest
[ ]
( )
→
Options
Contents
Assigned to
< >
Register bit field
In the set of
italics
User defined term (font is courier)
1998 Microchip Technology Inc.
Preliminary
DS40191A-page 37
PIC16CR54C
TABLE 8-2:
INSTRUCTION SET SUMMARY
12-Bit Opcode
Mnemonic,
Operands
Status
Description
Cycles MSb
LSb Affected Notes
1
1
1
1
1
1
0001 11df ffff
C,DC,Z 1,2,4
Add W and f
AND W with f
Clear f
Clear W
Complement f
Decrement f
Decrement f, Skip if 0
Increment f
Increment f, Skip if 0
Inclusive OR W with f
Move f
Move W to f
No Operation
Rotate left f through Carry
Rotate right f through Carry
Subtract W from f
Swap f
ADDWF
ANDWF
CLRF
CLRW
COMF
DECF
DECFSZ
INCF
INCFSZ
IORWF
MOVF
MOVWF
NOP
f,d
f,d
f
0001 01df ffff
0000 011f ffff
0000 0100 0000
0010 01df ffff
0000 11df ffff
Z
Z
Z
2,4
4
–
Z
f, d
f, d
f, d
f, d
f, d
f, d
f, d
f
Z
None
Z
None
Z
Z
None
None
C
2,4
2,4
2,4
2,4
2,4
2,4
1,4
1(2) 0010 11df ffff
0010 10df ffff
1(2) 0011 11df ffff
1
1
1
1
1
1
1
1
1
1
0001 00df ffff
0010 00df ffff
0000 001f ffff
0000 0000 0000
0011 01df ffff
0011 00df ffff
0000 10df ffff
0011 10df ffff
0001 10df ffff
–
2,4
2,4
RLF
RRF
SUBWF
SWAPF
XORWF
f, d
f, d
f, d
f, d
f, d
C
C,DC,Z 1,2,4
None
Z
2,4
2,4
Exclusive OR W with f
BIT-ORIENTED FILE REGISTER OPERATIONS
1
1
0100 bbbf ffff
0101 bbbf ffff
None
None
None
None
2,4
2,4
Bit Clear f
Bit Set f
Bit Test f, Skip if Clear
Bit Test f, Skip if Set
BCF
BSF
BTFSC
BTFSS
f, b
f, b
f, b
f, b
1 (2) 0110 bbbf ffff
1 (2) 0111 bbbf ffff
LITERAL AND CONTROL OPERATIONS
1
2
1
2
1
1
1
2
1
1
1
1110 kkkk kkkk
1001 kkkk kkkk
0000 0000 0100
101k kkkk kkkk
1101 kkkk kkkk
1100 kkkk kkkk
0000 0000 0010
1000 kkkk kkkk
0000 0000 0011
0000 0000 0fff
1111 kkkk kkkk
Z
None
AND literal with W
Call subroutine
ANDLW
CALL
CLRWDT
GOTO
IORLW
MOVLW
OPTION
RETLW
SLEEP
TRIS
k
k
k
k
k
k
k
k
–
f
1
3
T
Clear Watchdog Timer
Unconditional branch
Inclusive OR Literal with W
Move Literal to W
Load OPTION register
Return, place Literal in W
Go into standby mode
Load TRIS register
O, PD
None
Z
None
None
None
TO, PD
None
Z
Exclusive OR Literal to W
XORLW
k
Note 1: The 9th bit of the program counter will be forced to a '0' by any instruction that writes to the PC except for GOTO.
(See individual device data sheets, Memory Section/Indirect Data Addressing, INDF and FSR Registers)
2: When an I/O register is modified as a function of itself (e.g. MOVF PORTB, 1), the value used will be that value
present on the pins themselves. For example, if the data latch is '1' for a pin configured as input and is driven
low by an external device, the data will be written back with a '0'.
3: The instruction TRIS f, where f = 5 or 6 causes the contents of the W register to be written to the tristate
latches of PORTA or B respectively. A '1' forces the pin to a hi-impedance state and disables the output buff-
ers.
4: If this instruction is executed on the TMR0 register (and, where applicable, d = 1), the prescaler will be cleared
(if assigned to TMR0).
DS40191A-page 38
Preliminary
1998 Microchip Technology Inc.
PIC16CR54C
ADDWF
Syntax:
Add W and f
[ label ] ADDWF f,d
0 ≤ f ≤ 31
ANDWF
Syntax:
AND W with f
[ label ] ANDWF f,d
0 ≤ f ≤ 31
Operands:
Operands:
d
[0,1]
d
[0,1]
Operation:
(W) + (f) → (dest)
Operation:
(W) .AND. (f) → (dest)
Status Affected: C, DC, Z
Status Affected:
Encoding:
Z
0001
11df
ffff
0001
01df
ffff
Encoding:
Add the contents of the W register and
register 'f'. If 'd' is 0 the result is stored
in the W register. If 'd' is '1' the result is
stored back in register 'f'.
The contents of the W register are
AND’ed with register 'f'. If 'd' is 0 the
result is stored in the W register. If 'd' is
'1' the result is stored back in register 'f'.
Description:
Description:
Words:
1
Words:
1
1
Cycles:
Example:
1
Cycles:
Example:
ADDWF FSR, 0
ANDWF FSR,
1
Before Instruction
Before Instruction
0x17
W
=
0x17
W
=
FSR = 0xC2
FSR = 0xC2
After Instruction
After Instruction
W
=
0xD9
W
=
0x17
FSR = 0xC2
FSR = 0x02
ANDLW
And literal with W
BCF
Bit Clear f
Syntax:
[ label ] ANDLW
k
Syntax:
Operands:
[ label ] BCF f,b
Operands:
Operation:
Status Affected:
Encoding:
Description:
0 ≤ k ≤ 255
0 ≤ f ≤ 31
0 ≤ b ≤ 7
(W).AND. (k) → (W)
Operation:
0 → (f<b>)
Z
Status Affected: None
1110
kkkk
kkkk
0100
bbbf
ffff
Encoding:
Description:
Words:
The contents of the W register are
AND’ed with the eight-bit literal 'k'. The
result is placed in the W register.
Bit 'b' in register 'f' is cleared.
1
1
Words:
1
Cycles:
Cycles:
Example:
1
BCF
FLAG_REG,
7
Example:
ANDLW 0x5F
Before Instruction
FLAG_REG = 0xC7
Before Instruction
0xA3
W
=
After Instruction
FLAG_REG = 0x47
After Instruction
0x03
W
=
1998 Microchip Technology Inc.
Preliminary
DS40191A-page 39
PIC16CR54C
BSF
Bit Set f
BTFSS
Bit Test f, Skip if Set
Syntax:
Operands:
[ label ] BSF f,b
Syntax:
[ label ] BTFSS f,b
0 ≤ f ≤ 31
0 ≤ b ≤ 7
Operands:
0 ≤ f ≤ 31
0 ≤ b < 7
Operation:
1 → (f<b>)
Operation:
skip if (f<b>) = 1
Status Affected: None
Status Affected: None
0101
bbbf
ffff
0111
bbbf
ffff
Encoding:
Description:
Words:
Encoding:
Bit 'b' in register 'f' is set.
If bit 'b' in register 'f' is '1' then the next
instruction is skipped.
Description:
1
1
If bit 'b' is '1', then the next instruction
fetched during the current instruction
execution, is discarded and an NOP is
executed instead, making this a 2 cycle
instruction.
Cycles:
BSF
FLAG_REG,
7
Example:
Before Instruction
FLAG_REG = 0x0A
Words:
1
After Instruction
FLAG_REG = 0x8A
Cycles:
Example:
1(2)
HERE
FALSE GOTO
TRUE
BTFSS FLAG,1
PROCESS_CODE
•
BTFSC
Bit Test f, Skip if Clear
•
•
Syntax:
[ label ] BTFSC f,b
Operands:
0 ≤ f ≤ 31
0 ≤ b ≤ 7
Before Instruction
PC
=
address (HERE)
After Instruction
If FLAG<1>
PC
Operation:
skip if (f<b>) = 0
=
=
=
=
0,
Status Affected: None
address (FALSE);
1,
address (TRUE)
bbbf
ffff
if FLAG<1>
PC
Encoding:
0110
If bit 'b' in register 'f' is 0 then the next
instruction is skipped.
Description:
If bit 'b' is 0 then the next instruction
fetched during the current instruction
execution is discarded, and an NOP is
executed instead, making this a 2 cycle
instruction.
Words:
1
Cycles:
Example:
1(2)
HERE
FALSE GOTO
TRUE
BTFSC
FLAG,1
PROCESS_CODE
•
•
•
Before Instruction
PC
=
address (HERE)
After Instruction
if FLAG<1>
PC
=
=
=
=
0,
address (TRUE);
1,
address(FALSE)
if FLAG<1>
PC
DS40191A-page 40
Preliminary
1998 Microchip Technology Inc.
PIC16CR54C
CALL
Subroutine Call
[ label ] CALL
0 ≤ k ≤ 255
CLRW
Clear W
Syntax:
k
Syntax:
[ label ] CLRW
None
Operands:
Operation:
Operands:
Operation:
(PC) + 1→ Top of Stack;
k → PC<7:0>;
00h → (W);
1 → Z
(STATUS<6:5>) → PC<10:9>;
0 → PC<8>
Status Affected:
Encoding:
Z
0000
0100
0000
Status Affected: None
The W register is cleared. Zero bit (Z)
is set.
Description:
1001
kkkk
kkkk
Encoding:
Subroutine call. First, return address
(PC+1) is pushed onto the stack. The
eight bit immediate address is loaded
into PC bits <7:0>. The upper bits
PC<10:9> are loaded from STA-
TUS<6:5>, PC<8> is cleared. CALLis
a two cycle instruction.
Description:
Words:
1
Cycles:
Example:
1
CLRW
Before Instruction
0x5A
W
=
After Instruction
Words:
1
2
W
=
0x00
Cycles:
Example:
Z
=
1
HERE
CALL
THERE
Before Instruction
PC address (HERE)
CLRWDT
Clear Watchdog Timer
[ label ] CLRWDT
None
=
Syntax:
After Instruction
PC address (THERE)
TOS =
=
Operands:
Operation:
address (HERE + 1)
00h → WDT;
0 → WDT prescaler (if assigned);
1 → TO;
1 → PD
CLRF
Clear f
Syntax:
[ label ] CLRF
f
Status Affected: TO, PD
Operands:
Operation:
0 ≤ f ≤ 31
0000
0000
0100
Encoding:
00h → (f);
1 → Z
The CLRWDTinstruction resets the
WDT. It also resets the prescaler, if the
prescaler is assigned to the WDT and
not Timer0. Status bits TO and PD are
set.
Description:
Status Affected:
Encoding:
Z
0000
011f
ffff
The contents of register 'f' are cleared
and the Z bit is set.
Description:
Words:
1
Cycles:
Example:
1
Words:
1
1
CLRWDT
Cycles:
Example:
Before Instruction
CLRF
FLAG_REG
WDT counter
=
=
?
Before Instruction
FLAG_REG
After Instruction
WDT counter
=
0x5A
0x00
After Instruction
WDT prescale =
0
1
1
FLAG_REG
Z
=
=
0x00
1
TO
PD
=
=
1998 Microchip Technology Inc.
Preliminary
DS40191A-page 41
PIC16CR54C
COMF
Complement f
[ label ] COMF f,d
0 ≤ f ≤ 31
DECFSZ
Syntax:
Decrement f, Skip if 0
[ label ] DECFSZ f,d
0 ≤ f ≤ 31
Syntax:
Operands:
Operands:
d
[0,1]
d
[0,1]
Operation:
(f) → (dest)
Operation:
(f) – 1 → d; skip if result = 0
Status Affected:
Encoding:
Z
Status Affected: None
0010
01df
ffff
0010
11df
ffff
Encoding:
The contents of register 'f' are comple-
mented. If 'd' is 0 the result is stored in
the W register. If 'd' is 1 the result is
stored back in register 'f'.
The contents of register 'f' are decre-
mented. If 'd' is 0 the result is placed in
the W register. If 'd' is 1 the result is
placed back in register 'f'.
Description:
Description:
If the result is 0, the next instruction,
which is already fetched, is discarded
and an NOP is executed instead mak-
ing it a two cycle instruction.
Words:
1
1
Cycles:
Example:
COMF
REG1,0
Words:
1
Before Instruction
REG1
=
0x13
0x13
Cycles:
Example:
1(2)
After Instruction
HERE
DECFSZ
GOTO
CONTINUE •
CNT, 1
LOOP
REG1
=
W
=
0xEC
•
•
DECF
Decrement f
[ label ] DECF f,d
0 ≤ f ≤ 31
Before Instruction
PC
=
address (HERE)
Syntax:
After Instruction
Operands:
CNT
if CNT
PC
if CNT
PC
=
=
=
≠
=
CNT - 1;
0,
address (CONTINUE);
0,
d
[0,1]
Operation:
(f) – 1 → (dest)
Status Affected:
Encoding:
Z
address (HERE+1)
0000
11df
ffff
Decrement register 'f'. If 'd' is 0 the
result is stored in the W register. If 'd' is
1 the result is stored back in register 'f'.
Description:
GOTO
Unconditional Branch
Syntax:
[ label ] GOTO
0 ≤ k ≤ 511
k
Words:
1
1
Operands:
Cycles:
Example:
Operation:
k → PC<8:0>;
STATUS<6:5> → PC<10:9>
DECF
CNT,
1
Before Instruction
Status Affected: None
CNT
=
0x01
0
101k
kkkk
kkkk
Encoding:
Z
=
GOTOis an unconditional branch. The
9-bit immediate value is loaded into PC
bits <8:0>. The upper bits of PC are
loaded from STATUS<6:5>. GOTOis a
two cycle instruction.
Description:
After Instruction
CNT
=
0x00
1
Z
=
Words:
1
Cycles:
Example:
2
GOTO THERE
After Instruction
PC
=
address (THERE)
DS40191A-page 42
Preliminary
1998 Microchip Technology Inc.
PIC16CR54C
INCF
Increment f
IORLW
Inclusive OR literal with W
Syntax:
Operands:
[ label ] INCF f,d
Syntax:
[ label ] IORLW k
0 ≤ f ≤ 31
Operands:
Operation:
Status Affected:
Encoding:
Description:
0 ≤ k ≤ 255
d
[0,1]
(W) .OR. (k) → (W)
Operation:
(f) + 1 → (dest)
Z
Status Affected:
Encoding:
Z
1101
kkkk
kkkk
0010
10df
ffff
The contents of the W register are
OR’ed with the eight bit literal 'k'. The
result is placed in the W register.
The contents of register 'f' are incre-
mented. If 'd' is 0 the result is placed in
the W register. If 'd' is 1 the result is
placed back in register 'f'.
Description:
Words:
1
Cycles:
Example:
1
Words:
1
1
IORLW 0x35
Cycles:
Example:
Before Instruction
0x9A
INCF
CNT,
1
W
=
Before Instruction
After Instruction
CNT
=
0xFF
0
W
=
0xBF
Z
=
Z
=
0
After Instruction
CNT
Z
=
=
0x00
1
IORWF
Inclusive OR W with f
[ label ] IORWF f,d
0 ≤ f ≤ 31
Syntax:
Operands:
INCFSZ
Increment f, Skip if 0
[ label ] INCFSZ f,d
0 ≤ f ≤ 31
d
[0,1]
Syntax:
Operation:
(W).OR. (f) → (dest)
Operands:
Status Affected:
Encoding:
Z
d
[0,1]
0001
00df
ffff
Operation:
(f) + 1 → (dest), skip if result = 0
Inclusive OR the W register with regis-
ter 'f'. If 'd' is 0 the result is placed in
the W register. If 'd' is 1 the result is
placed back in register 'f'.
Description:
Status Affected: None
0011
11df
ffff
Encoding:
The contents of register 'f' are incre-
mented. If 'd' is 0 the result is placed in
the W register. If 'd' is 1 the result is
placed back in register 'f'.
Description:
Words:
1
1
Cycles:
Example:
If the result is 0, then the next instruc-
tion, which is already fetched, is dis-
carded and an NOP is executed
instead making it a two cycle instruc-
tion.
IORWF
RESULT, 0
Before Instruction
RESULT
W
=
0x13
=
0x91
After Instruction
Words:
1
RESULT
=
=
=
0x13
0x93
0
Cycles:
Example:
1(2)
W
Z
HERE
INCFSZ
GOTO
CNT,
LOOP
1
CONTINUE •
•
•
Before Instruction
PC
=
address (HERE)
After Instruction
CNT
if CNT
PC
if CNT
PC
=
=
=
≠
=
CNT + 1;
0,
address (CONTINUE);
0,
address (HERE +1)
1998 Microchip Technology Inc.
Preliminary
DS40191A-page 43
PIC16CR54C
MOVF
Move f
MOVWF
Syntax:
Move W to f
[ label ] MOVWF
0 ≤ f ≤ 31
Syntax:
Operands:
[ label ] MOVF f,d
f
0 ≤ f ≤ 31
Operands:
Operation:
d
[0,1]
(W) → (f)
Operation:
(f) → (dest)
Status Affected: None
Status Affected:
Encoding:
Z
0000
001f
ffff
Encoding:
0010
00df
ffff
Move data from the W register to regis-
ter 'f'.
Description:
The contents of register 'f' is moved to
destination 'd'. If 'd' is 0, destination is
the W register. If 'd' is 1, the destination
is file register 'f'. 'd' is 1 is useful to test
a file register since status flag Z is
affected.
Description:
Words:
1
Cycles:
Example:
1
MOVWF TEMP_REG
Before Instruction
Words:
1
1
TEMP_REG
W
=
=
0xFF
0x4F
Cycles:
Example:
MOVF
FSR,
0
After Instruction
TEMP_REG
W
=
=
0x4F
0x4F
After Instruction
W
=
value in FSR register
NOP
No Operation
[ label ] NOP
None
MOVLW
Move Literal to W
[ label ] MOVLW
0 ≤ k ≤ 255
Syntax:
Syntax:
k
Operands:
Operation:
Operands:
Operation:
No operation
k → (W)
Status Affected: None
0000
0000
0000
Status Affected: None
Encoding:
Description:
Words:
1100
kkkk
kkkk
Encoding:
No operation.
The eight bit literal 'k' is loaded into the
W register. The don’t cares will assem-
ble as 0s.
Description:
1
Cycles:
1
NOP
Example:
Words:
1
Cycles:
Example:
1
MOVLW 0x5A
After Instruction
W
=
0x5A
DS40191A-page 44
Preliminary
1998 Microchip Technology Inc.
PIC16CR54C
OPTION
Syntax:
Load OPTION Register
[ label ] OPTION
None
RLF
Rotate Left f through Carry
[ label ] RLF f,d
0 ≤ f ≤ 31
Syntax:
Operands:
Operands:
Operation:
d
[0,1]
(W) → OPTION
Status Affected: None
Operation:
See description below
C
0000
0000
0010
Encoding:
Status Affected:
Encoding:
The content of the W register is loaded
into the OPTION register.
Description:
0011
01df
ffff
The contents of register 'f' are rotated
one bit to the left through the Carry
Flag. If 'd' is 0 the result is placed in the
W register. If 'd' is 1 the result is stored
back in register 'f'.
Description:
Words:
Cycles:
Example
1
1
OPTION
Before Instruction
register 'f'
C
W
=
0x07
0x07
After Instruction
OPTION
Words:
1
=
Cycles:
Example:
1
RLF
REG1,0
RETLW
Return with Literal in W
Before Instruction
Syntax:
[ label ] RETLW
k
REG1
C
=
=
1110 0110
0
Operands:
Operation:
0 ≤ k ≤ 255
After Instruction
k → (W);
TOS → PC
REG1
W
C
=
=
=
1110 0110
1100 1100
1
Status Affected: None
1000
kkkk
kkkk
Encoding:
The W register is loaded with the eight
bit literal 'k'. The program counter is
loaded from the top of the stack (the
return address). This is a two cycle
instruction.
Description:
RRF
Rotate Right f through Carry
[ label ] RRF f,d
0 ≤ f ≤ 31
Syntax:
Operands:
d
[0,1]
Words:
1
2
Operation:
See description below
C
Cycles:
Example:
Status Affected:
Encoding:
CALL TABLE ;W contains
;table offset
;value.
0011
00df
ffff
The contents of register 'f' are rotated
one bit to the right through the Carry
Flag. If 'd' is 0 the result is placed in the
W register. If 'd' is 1 the result is placed
back in register 'f'.
Description:
•
•
;W now has table
;value.
•
TABLE
ADDWF PC
RETLW k1
RETLW k2
;W = offset
;Begin table
;
register 'f'
C
•
•
Words:
1
•
Cycles:
Example:
1
RETLW kn
; End of table
RRF
REG1,0
Before Instruction
W
=
0x07
Before Instruction
REG1
C
=
=
1110 0110
0
After Instruction
value of k8
W
=
After Instruction
REG1
W
C
=
=
=
1110 0110
0111 0011
0
1998 Microchip Technology Inc.
Preliminary
DS40191A-page 45
PIC16CR54C
SLEEP
Enter SLEEP Mode
SUBWF
Subtract W from f
Syntax:
Syntax:
[label]
[label] SUBWF f,d
SLEEP
Operands:
0 ≤ f ≤ 31
Operands:
Operation:
None
d
[0,1]
00h → WDT;
0 → WDT prescaler;
1 → TO;
Operation:
(f) – (W) → (dest)
Status Affected: C, DC, Z
0 → PD
0000
10df
ffff
Encoding:
Status Affected: TO, PD
Subtract (2’s complement method) the
W register from register 'f'. If 'd' is 0 the
result is stored in the W register. If 'd' is
1 the result is stored back in register 'f'.
Description:
0000
0000
0011
Encoding:
Time-out status bit (TO) is set. The
power down status bit (PD) is cleared.
The WDT and its prescaler are
cleared.
Description:
Words:
1
1
Cycles:
The processor is put into SLEEP mode
with the oscillator stopped. See sec-
tion on SLEEP for more details.
SUBWF
REG1, 1
Example 1:
Before Instruction
Words:
1
REG1
W
C
=
=
=
3
2
?
Cycles:
Example:
1
SLEEP
After Instruction
REG1
W
C
=
=
=
1
2
1
; result is positive
Example 2:
Before Instruction
REG1
W
C
=
=
=
2
2
?
After Instruction
REG1
W
C
=
=
=
0
2
1
; result is zero
Example 3:
Before Instruction
REG1
W
C
=
=
=
1
2
?
After Instruction
REG1
W
C
=
=
=
FF
2
0
; result is negative
DS40191A-page 46
Preliminary
1998 Microchip Technology Inc.
PIC16CR54C
SWAPF
Syntax:
Swap Nibbles in f
[ label ] SWAPF f,d
0 ≤ f ≤ 31
XORLW
Exclusive OR literal with W
Syntax:
[label] XORLW
0 ≤ k ≤ 255
k
Operands:
Operands:
d
[0,1]
Operation:
(W) .XOR. k → (W)
Z
Operation:
(f<3:0>) → (dest<7:4>);
(f<7:4>) → (dest<3:0>)
Status Affected:
Encoding:
1111
kkkk
kkkk
Status Affected: None
The contents of the W register are
XOR’ed with the eight bit literal 'k'. The
result is placed in the W register.
Description:
0011
10df
ffff
Encoding:
The upper and lower nibbles of register
'f' are exchanged. If 'd' is 0 the result is
placed in W register. If 'd' is 1 the result
is placed in register 'f'.
Description:
Words:
1
Cycles:
Example:
1
Words:
Cycles:
Example
1
1
XORLW 0xAF
Before Instruction
0xB5
W
=
SWAPF
REG1,
0
After Instruction
Before Instruction
REG1
W
=
0x1A
=
0xA5
After Instruction
REG1
W
=
=
0xA5
0X5A
XORWF
Exclusive OR W with f
[ label ] XORWF f,d
0 ≤ f ≤ 31
Syntax:
Operands:
TRIS
Load TRIS Register
d
[0,1]
Syntax:
[ label ] TRIS
f = 5, 6 or 7
f
Operation:
(W) .XOR. (f) → (dest)
Operands:
Operation:
Status Affected:
Encoding:
Z
(W) → TRIS register f
0001
10df
ffff
Status Affected: None
Exclusive OR the contents of the W
register with register 'f'. If 'd' is 0 the
result is stored in the W register. If 'd' is
1 the result is stored back in register 'f'.
Description:
0000
0000
0fff
Encoding:
TRIS register 'f' (f = 5, 6, or 7) is loaded
with the contents of the W register
Description:
Words:
Cycles:
Example
1
1
Words:
Cycles:
Example
1
1
TRIS
PORTA
REG,1
XORWF
Before Instruction
Before Instruction
W
=
0XA5
0XA5
REG
=
0xAF
0xB5
W
=
After Instruction
TRISA
=
After Instruction
REG
W
=
=
0x1A
0xB5
1998 Microchip Technology Inc.
Preliminary
DS40191A-page 47
PIC16CR54C
NOTES:
DS40191A-page 48
Preliminary
1998 Microchip Technology Inc.
PIC16CR54C
9.3
ICEPIC: Low-Cost PICmicro™
In-Circuit Emulator
9.0
DEVELOPMENT SUPPORT
9.1
Development Tools
ICEPIC is a low-cost in-circuit emulator solution for the
Microchip PIC12CXXX, PIC16C5X and PIC16CXXX
families of 8-bit OTP microcontrollers.
The PICmicrο microcontrollers are supported with a
full range of hardware and software development
tools:
ICEPIC is designed to operate on PC-compatible
machines ranging from 286-AT through Pentium
based machines under Windows 3.x environment.
ICEPIC features real time, non-intrusive emulation.
• PICMASTER /PICMASTER CE Real-Time
In-Circuit Emulator
• ICEPIC Low-Cost PIC16C5X and PIC16CXXX
In-Circuit Emulator
9.4
PRO MATE II: Universal Programmer
• PRO MATE II Universal Programmer
• PICSTART Plus Entry-Level Prototype
Programmer
The PRO MATE II Universal Programmer is
a
full-featured programmer capable of operating in
stand-alone mode as well as PC-hosted mode. PRO
MATE II is CE compliant.
• PICDEM-1 Low-Cost Demonstration Board
• PICDEM-2 Low-Cost Demonstration Board
• PICDEM-3 Low-Cost Demonstration Board
• MPASM Assembler
The PRO MATE II has programmable VDD and VPP
supplies which allows it to verify programmed memory
at VDD min and VDD max for maximum reliability. It has
an LCD display for displaying error messages, keys to
enter commands and a modular detachable socket
assembly to support various package types. In stand-
alone mode the PRO MATE II can read, verify or
program PIC12CXXX, PIC14C000, PIC16C5X,
PIC16CXXX and PIC17CXX devices. It can also set
configuration and code-protect bits in this mode.
• MPLAB SIM Software Simulator
• MPLAB-C17 (C Compiler)
• Fuzzy Logic Development System
(fuzzyTECH −MP)
9.2
PICMASTER: High Performance
Universal In-Circuit Emulator with
MPLAB IDE
9.5
PICSTART Plus Entry Level
Development System
The PICMASTER Universal In-Circuit Emulator is
intended to provide the product development engineer
with a complete microcontroller design tool set for all
microcontrollers in the PIC14C000, PIC12CXXX,
PIC16C5X, PIC16CXXX and PIC17CXX families.
PICMASTER is supplied with the MPLAB Integrated
Development Environment (IDE), which allows editing,
“make” and download, and source debugging from a
single environment.
The PICSTART programmer is an easy-to-use,
low-cost prototype programmer. It connects to the PC
via one of the COM (RS-232) ports. MPLAB Integrated
Development Environment software makes using the
programmer simple and efficient. PICSTART Plus is
not recommended for production programming.
PICSTART
Plus
supports
all
PIC12CXXX,
Interchangeable target probes allow the system to be
easily reconfigured for emulation of different
processors. The universal architecture of the
PICMASTER allows expansion to support all new
Microchip microcontrollers.
PIC14C000, PIC16C5X, PIC16CXXX and PIC17CXX
devices with up to 40 pins. Larger pin count devices
such as the PIC16C923, PIC16C924 and PIC17C756
may be supported with an adapter socket. PICSTART
Plus is CE compliant.
The PICMASTER Emulator System has been
9.6
PICDEM-1 Low-Cost PICmicro
Demonstration Board
designed as
a real-time emulation system with
advanced features that are generally found on more
expensive development tools. The PC compatible 386
(and higher) machine platform and Microsoft Windows
3.x environment were chosen to best make these
features available to you, the end user.
The PICDEM-1 is a simple board which demonstrates
the capabilities of several of Microchip’s
microcontrollers. The microcontrollers supported are:
PIC16C5X (PIC16C54 to PIC16C58A), PIC16C61,
PIC16C62X, PIC16C71, PIC16C8X, PIC17C42,
PIC17C43 and PIC17C44. All necessary hardware
and software is included to run basic demo programs.
The users can program the sample microcontrollers
A CE compliant version of PICMASTER is available for
European Union (EU) countries.
provided with the PICDEM-1 board, on
a
PRO MATE II or PICSTART-Plus programmer, and
easily test firmware. The user can also connect the
PICDEM-1 board to the PICMASTER emulator and
download the firmware to the emulator for testing.
1998 Microchip Technology Inc.
Preliminary
DS40191A-page 49
PIC16CR54C
Additional prototype area is available for the user to
build some additional hardware and connect it to the
microcontroller socket(s). Some of the features include
an RS-232 interface, a potentiometer for simulated
analog input, push-button switches and eight LEDs
connected to PORTB.
9.9
MPLAB™ Integrated Development
Environment Software
The MPLAB IDE Software brings an ease of software
development previously unseen in the 8-bit
microcontroller market. MPLAB is a windows based
application which contains:
9.7
PICDEM-2 Low-Cost PIC16CXX
Demonstration Board
• A full featured editor
• Three operating modes
- editor
The PICDEM-2 is a simple demonstration board that
supports the PIC16C62, PIC16C64, PIC16C65,
PIC16C73 and PIC16C74 microcontrollers. All the
necessary hardware and software is included to
run the basic demonstration programs. The user
can program the sample microcontrollers provided
with the PICDEM-2 board, on a PRO MATE II
programmer or PICSTART-Plus, and easily test
firmware. The PICMASTER emulator may also be
used with the PICDEM-2 board to test firmware.
Additional prototype area has been provided to the
user for adding additional hardware and connecting it
to the microcontroller socket(s). Some of the features
include a RS-232 interface, push-button switches, a
potentiometer for simulated analog input, a Serial
- emulator
- simulator
• A project manager
• Customizable tool bar and key mapping
• A status bar with project information
• Extensive on-line help
MPLAB allows you to:
• Edit your source files (either assembly or ‘C’)
• One touch assemble (or compile) and download
to PICmicro tools (automatically updates all
project information)
• Debug using:
- source files
- absolute listing file
• Transfer data dynamically via DDE (soon to be
replaced by OLE)
2
EEPROM to demonstrate usage of the I C bus and
separate headers for connection to an LCD module
and a keypad.
• Run up to four emulators on the same PC
The ability to use MPLAB with Microchip’s simulator
allows a consistent platform and the ability to easily
switch from the low cost simulator to the full featured
emulator with minimal retraining due to development
tools.
9.8
PICDEM-3 Low-Cost PIC16CXXX
Demonstration Board
The PICDEM-3 is a simple demonstration board that
supports the PIC16C923 and PIC16C924 in the PLCC
package. It will also support future 44-pin PLCC
9.10
Assembler (MPASM)
microcontrollers with
a LCD Module. All the
necessary hardware and software is included to
run the basic demonstration programs. The user
can program the sample microcontrollers provided
with the PICDEM-3 board, on a PRO MATE II
programmer or PICSTART Plus with an adapter
socket, and easily test firmware. The PICMASTER
emulator may also be used with the PICDEM-3 board
to test firmware. Additional prototype area has been
provided to the user for adding hardware and
connecting it to the microcontroller socket(s). Some
of the features include an RS-232 interface,
push-button switches, a potentiometer for simulated
analog input, a thermistor and separate headers for
connection to an external LCD module and a keypad.
Also provided on the PICDEM-3 board is an LCD
panel, with 4 commons and 12 segments, that is
capable of displaying time, temperature and day of the
week. The PICDEM-3 provides an additional RS-232
interface and Windows 3.1 software for showing the
demultiplexed LCD signals on a PC. A simple serial
interface allows the user to construct a hardware
demultiplexer for the LCD signals.
The MPASM Universal Macro Assembler is
a
PC-hosted symbolic assembler. It supports all
microcontroller series including the PIC12C5XX,
PIC14000, PIC16C5X, PIC16CXXX, and PIC17CXX
families.
MPASM offers full featured Macro capabilities,
conditional assembly, and several source and listing
formats. It generates various object code formats to
support Microchip's development tools as well as third
party programmers.
MPASM allows full symbolic debugging from
PICMASTER, Microchip’s Universal Emulator System.
MPASM has the following features to assist in
developing software for specific use applications.
• Provides translation of Assembler source code to
object code for all Microchip microcontrollers.
• Macro assembly capability.
• Produces all the files (Object, Listing, Symbol,
and special) required for symbolic debug with
Microchip’s emulator systems.
• Supports Hex (default), Decimal and Octal source
and listing formats.
DS40191A-page 50
Preliminary
1998 Microchip Technology Inc.
PIC16CR54C
MPASM provides a rich directive language to support
programming of the PICmicro. Directives are helpful in
making the development of your assemble source
code shorter and more maintainable.
own code. MP-DriveWay is intelligent enough to
maintain your code through subsequent code
generation.
9.15
SEEVAL Evaluation and
Programming System
9.11
Software Simulator (MPLAB-SIM)
The MPLAB-SIM Software Simulator allows code
development in a PC host environment. It allows the
user to simulate the PICmicro series microcontrollers
on an instruction level. On any given instruction, the
user may examine or modify any of the data areas or
provide external stimulus to any of the pins. The
input/output radix can be set by the user and the
execution can be performed in; single step, execute
until break, or in a trace mode.
The SEEVAL SEEPROM Designer’s Kit supports all
Microchip 2-wire and 3-wire Serial EEPROMs. The kit
includes everything necessary to read, write, erase or
program special features of any Microchip SEEPROM
product including Smart Serials and secure serials.
The Total Endurance
Disk is included to aid in
trade-off analysis and reliability calculations. The total
kit can significantly reduce time-to-market and result in
an optimized system.
MPLAB-SIM fully supports symbolic debugging using
MPLAB-C and MPASM. The Software Simulator offers
the low cost flexibility to develop and debug code
outside of the laboratory environment making it an
excellent multi-project software development tool.
9.16
KEELOQ Evaluation and
Programming Tools
KEELOQ evaluation and programming tools support
Microchips HCS Secure Data Products. The HCS
evaluation kit includes an LCD display to show
changing codes, a decoder to decode transmissions,
9.12
C Compiler (MPLAB-C17)
and
transmitters.
a programming interface to program test
The MPLAB-C Code Development System is
a
complete ‘C’ compiler and integrated development
environment for Microchip’s PIC17CXXX family of
microcontrollers. The compiler provides powerful
integration capabilities and ease of use not found with
other compilers.
For easier source level debugging, the compiler
provides symbol information that is compatible with the
MPLAB IDE memory display.
9.13
Fuzzy Logic Development System
(fuzzyTECH-MP)
fuzzyTECH-MP fuzzy logic development tool is
available in two versions - a low cost introductory
version, MP Explorer, for designers to gain
comprehensive working knowledge of fuzzy logic
system design; and full-featured version,
a
a
fuzzyTECH-MP, Edition for implementing more
complex systems.
Both versions include Microchip’s fuzzyLAB
demonstration board for hands-on experience with
fuzzy logic systems implementation.
9.14
MP-DriveWay – Application Code
Generator
MP-DriveWay is an easy-to-use Windows-based
Application Code Generator. With MP-DriveWay you
can visually configure all the peripherals in a PICmicro
device and, with a click of the mouse, generate all the
initialization and many functional code modules in C
language. The output is fully compatible with
Microchip’s MPLAB-C C compiler. The code produced
is highly modular and allows easy integration of your
1998 Microchip Technology Inc.
Preliminary
DS40191A-page 51
24CXX HCS200
PIC12C5XX PIC14000 PIC16C5X PIC16CXXX PIC16C6X PIC16C7XX PIC16C8X PIC16C9XX PIC17C4X PIC17C75X 25CXX HCS300
93CXX HCS301
EMULATOR PRODUCTS
PICMASTER
/
PICMASTER-CE
In-Circuit Emulator
ü
ü
ü
ü
ü
ü
ü
ü
ü
ü
ü
ü
ü
ü
ü
ü
ü
ICEPIC Low-Cost
In-Circuit Emulator
SOFTWARE PRODUCTS
MPLAB
Integrated
Development
Environment
ü
ü
ü
ü
ü
ü
ü
ü
ü
ü
ü
ü
ü
ü
MPLAB C17
Compiler
fuzzyTECH -MP
Explorer/Edition
Fuzzy Logic Dev. Tool
ü
ü
ü
ü
ü
ü
ü
ü
ü
ü
ü
ü
ü
ü
MP-DriveWay
Applications
Code Generator
Total Endurance
Software Model
ü
PROGRAMMERS
PICSTART Plus
Low-Cost
Universal Dev. Kit
ü
ü
ü
ü
ü
ü
ü
ü
ü
ü
ü
ü
ü
ü
ü
ü
ü
ü
ü
ü
PRO MATE II
Universal Programmer
ü
ü
ü
ü
KEELOQ Programmer
DEMO BOARDS
SEEVAL Designers Kit
PICDEM-1
ü
ü
ü
ü
PICDEM-2
ü
ü
PICDEM-3
ü
KEELOQ Evaluation Kit
ü
PIC16CR54C
10.0 ELECTRICAL CHARACTERISTICS - PIC16CR54C
†
Absolute Maximum Ratings
Ambient temperature under bias............................................................................................................–55°C to +125°C
Storage temperature ............................................................................................................................. –65°C to +150°C
Voltage on VDD with respect to VSS ..................................................................................................................0 to +7.5V
Voltage on MCLR with respect to VSS................................................................................................................0 to +14V
Voltage on all other pins with respect to VSS ................................................................................. –0.6V to (VDD + 0.6V)
(1)
Total power dissipation .....................................................................................................................................800 mW
Max. current out of VSS pin....................................................................................................................................150 mA
Max. current into VDD pin ......................................................................................................................................100 mA
Max. current into an input pin (T0CKI only)......................................................................................................................±500 µA
Input clamp current, IIK (VI < 0 or VI > VDD)....................................................................................................................±20 mA
Output clamp current, IOK (VO < 0 or VO > VDD) ..............................................................................................................±20 mA
Max. output current sunk by any I/O pin..................................................................................................................15 mA
Max. output current sourced by any I/O pin ............................................................................................................15 mA
Max. output current sourced by a single I/O port A ................................................................................................45 mA
Max. output current sourced by a single I/O port B ................................................................................................45 mA
Max. output current sunk by a single I/O port A......................................................................................................45 mA
Max. output current sunk by a single I/O port B .....................................................................................................45 mA
Note 1: Power dissipation is calculated as follows: Pdis = VDD x {IDD - ∑ IOH} + ∑ {(VDD-VOH) x IOH} + ∑(VOL x IOL)
†
NOTICE: Stresses above those listed under "Maximum Ratings" may cause permanent damage to the device.
This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for
extended periods may affect device reliability.
1998 Microchip Technology Inc.
Preliminary
DS40191A-page 53
PIC16CR54C
10.1
DC Characteristics:PIC16CR54C-04, 20 (Commercial)
PIC16CR54C-04I, 20I (Industrial)
Standard Operating Conditions (unless otherwise specified)
DC Characteristics
Power Supply Pins
Operating Temperature
0°C ≤ TA ≤ +70°C (commercial)
–40°C ≤ TA ≤ +85°C (industrial)
(1)
Characteristic
Sym Min Typ
Max Units
Conditions
Supply Voltage
XT, RC and LP options
HS option
VDD
3.0
4.5
5.5
5.5
V
V
(2)
RAM Data Retention Voltage
VDR
1.5*
VSS
V
V
Device in SLEEP mode
VDD start voltage to ensure
Power-On Reset
VPOR
See Section 7.4 for details on
Power-on Reset
VDD rise rate to ensure
Power-On Reset
SVDD
IDD
0.05*
V/ms See Section 7.4 for details on
Power-on Reset
(3)
Supply Current
(4)
XT and RC options
1.8
4.5
14
2.4 mA FOSC = 4.0 MHz, VDD = 5.5V
HS option
LP option, Commercial
LP option, Industrial
16
32
40
mA FOSC = 20 MHz, VDD = 5.5V
µA FOSC = 32 kHz, VDD = 3.0V, WDT disabled
µA FOSC = 32 kHz, VDD = 3.0V, WDT disabled
17
(5)
Power Down Current
IPD
Commercial
4.0
12
µA VDD = 3.0V, WDT enabled
µA VDD = 3.0V, WDT disabled
µA VDD = 3.0V, WDT enabled
µA VDD = 3.0V, WDT disabled
0.25 4.0
4.0 14
0.25 5.0
Industrial
* These parameters are characterized but not tested.
Note 1: Data in the Typical (“Typ”) column is based on characterization results at 25°C.This data is for design guidance
only and is not tested.
2: This is the limit to which VDD can be lowered in SLEEP mode without losing RAM data.
3: The supply current is mainly a function of the operating voltage and frequency. Other factors such as bus
loading, oscillator type, bus rate, internal code execution pattern, and temperature also have an impact on
the current consumption.
a) The test conditions for all IDD measurements in active operation mode are:
OSC1 = external square wave, from rail-to-rail; all I/O pins tristated, pulled to
Vss, T0CKI = VDD, MCLR = VDD; WDT enabled/disabled as specified.
b) For standby current measurements, the conditions are the same, except that
the device is in SLEEP mode.
4: Does not include current through Rext. The current through the resistor can be estimated by the
formula: IR = VDD/2Rext (mA) with Rext in kΩ.
5: The power down current in SLEEP mode does not depend on the oscillator type. Power down current is
measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD and VSS.
DS40191A-page 54
Preliminary
1998 Microchip Technology Inc.
PIC16CR54C
10.2
DC Characteristics:PIC16CR54C-04, 20, PIC16CR54C-04I, 20I (Commercial, Industrial)
Standard Operating Conditions (unless otherwise specified)
DC Characteristics
Operating Temperature
0°C ≤ TA ≤ +70°C (commercial)
–40°C ≤ TA ≤ +85°C (industrial)
All Pins Except
Power Supply Pins
Operating Voltage VDD range is described in Section 10.1
(1)
Characteristic
Sym
Min
Typ
Max
Units
Conditions
Input Low Voltage
I/O Ports
I/O Ports
MCLR (Schmitt Trigger)
T0CKI (Schmitt Trigger)
OSC1 (Schmitt Trigger)
OSC1
VIL
VSS
VSS
VSS
VSS
VSS
0.8 VDD
0.15 VDD
0.15 VDD
0.15 VDD
0.15 VDD
0.3 VDD
V
V
V
V
V
Pin at hi-impedance 4.5V , VDD ≤ 5.5V
Pin at hi-impedance 2.5V , VDD ≤ 4.5V
(4)
RC option only
XT, HS and LP options
Input High Voltage
I/O ports
VIH
(5)
0.25 VDD+0.8V
2.0
0.85 VDD
0.85 VDD
0.85 VDD
0.7 VDD
VDD
VDD
VDD
VDD
VDD
VDD
V
V
V
V
V
V
For all VDD
(5)
4.5V < VDD ≤ 5.5V
MCLR (Schmitt Trigger)
T0CKI (Schmitt Trigger)
OSC1 (Schmitt Trigger)
OSC1
(4)
RC option only
XT, HS and LP options
Hysteresis of Schmitt
Trigger inputs
VHYS
IIL
0.15VDD*
V
(3)
Input Leakage Current
For VDD ≤ 5.5V
I/O ports
-1.0
-5.0
0.5
+1.0
µA VSS ≤ VPIN ≤ VDD,
Pin at hi-impedance
(2)
MCLR
+5.0
+3.0
+3.0
µA VPIN = VSS +0.25V
(2)
0.5
0.5
0.5
µA VPIN = VDD
T0CKI
OSC1
-3.0
-3.0
µA VSS ≤ VPIN ≤ VDD
µA VSS ≤ VPIN ≤ VDD,
XT, HS and LP options
Output Low Voltage
I/O ports
OSC2/CLKOUT
VOL
VOH
0.6
0.6
V
V
IOL = 5.0 mA, VDD = 4.5V
IOL = 1.6 mA, VDD = 4.5V,
RC option only
Output High Voltage
(3)
I/O ports
VDD-0.7
VDD-0.7
V
V
IOH = -3.0 mA, VDD = 4.5V
IOH = -1.0 mA, VDD = 4.5V,
RC option only
OSC2/CLKOUT
* These parameters are characterized but not tested.
Note 1: Data in the Typical (“Typ”) column is based on characterization results at 25°C. This data is for design guidance
only and is not tested.
2: The leakage current on the MCLR/VPP pin is strongly dependent on the applied voltage level. The specified lev-
els represent normal operating conditions. Higher leakage current may be measured at different input voltage.
3: Negative current is defined as coming out of the pin.
4: For the RC option, the OSC1/CLKIN pin is a Schmitt Trigger input. It is not recommended that the PIC16CR54C
be driven with external clock in RC mode.
5: The user may use the better of the two specifications.
1998 Microchip Technology Inc.
Preliminary
DS40191A-page 55
PIC16CR54C
10.3
Timing Parameter Symbology and Load Conditions
The timing parameter symbols have been created following one of the following formats:
1. TppS2ppS
2. TppS
T
F
Frequency
Lowercase subscripts (pp) and their meanings:
pp
T
Time
2
to
mc
osc
os
MCLR
ck
cy
drt
io
CLKOUT
cycle time
device reset timer
I/O port
oscillator
OSC1
t0
T0CKI
wdt
watchdog timer
Uppercase letters and their meanings:
S
F
H
I
Fall
P
R
V
Z
Period
High
Rise
Invalid (Hi-impedance)
Low
Valid
L
Hi-impedance
FIGURE 10-1: LOAD CONDITIONS - PIC16CR54C
Pin
CL = 50 pF for all pins except OSC2
CL
15 pF for OSC2 in XT, HS or LP
options when external clock
is used to drive OSC1
VSS
DS40191A-page 56
Preliminary
1998 Microchip Technology Inc.
PIC16CR54C
10.4
Timing Diagrams and Specifications
FIGURE 10-2: EXTERNAL CLOCK TIMING - PIC16CR54C
Q4
Q3
Q4
4
Q1
Q1
Q2
OSC1
1
3
3
4
2
CLKOUT
TABLE 10-1: EXTERNAL CLOCK TIMING REQUIREMENTS - PIC16CR54C
AC Characteristics
Standard Operating Conditions (unless otherwise specified)
Operating Temperature
0°C ≤ TA ≤ +70°C (commercial)
–40°C ≤ TA ≤ +85°C (industrial)
Operating Voltage VDD range is described in Section 10.1
Parameter
(1)
No.
Sym
Characteristic
Min Typ
Max Units
Conditions
(2)
FOSC
External CLKIN Frequency
DC
DC
DC
DC
DC
0.455
4
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
4.0
4.0
20
MHz XT osc mode
MHz HS osc mode (04)
MHz HS osc mode (20)
kHz LP osc mode
200
4.0
4.0
4.0
20
(2)
Oscillator Frequency
MHz RC osc mode
MHz XT osc mode
MHz HS osc mode (04)
MHz HS osc mode (20)
kHz LP osc mode
4
5
200
—
(2)
1
TOSC
External CLKIN Period
250
250
50
ns
ns
ns
µs
ns
ns
ns
ns
µs
XT osc mode
—
HS osc mode (04)
HS osc mode (20)
LP osc mode
—
5.0
250
250
250
50
—
(2)
Oscillator Period
—
RC osc mode
2,200
250
250
200
XT osc mode
HS osc mode (04)
HS osc mode (20)
LP osc mode
5.0
*
These parameters are characterized but not tested.
Note 1: Data in the Typical (“Typ”) column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only
and are not tested.
2: All specified values are based on characterization data for that particular oscillator type under standard operating condi-
tions with the device executing code. Exceeding these specified limits may result in an unstable oscillator operation and/or
higher than expected current consumption.
When an external clock input is used, the “max” cycle time limit is “DC” (no clock) for all devices.
3: Instruction cycle period (TCY) equals four times the input oscillator time base period.
1998 Microchip Technology Inc.
Preliminary
DS40191A-page 57
PIC16CR54C
TABLE 10-1: EXTERNAL CLOCK TIMING REQUIREMENTS - PIC16CR54C (CONTINUED)
AC Characteristics
Standard Operating Conditions (unless otherwise specified)
Operating Temperature
0°C ≤ TA ≤ +70°C (commercial)
–40°C ≤ TA ≤ +85°C (industrial)
Operating Voltage VDD range is described in Section 10.1
Parameter
(1)
No.
Sym
Characteristic
Min Typ
Max Units
Conditions
(3)
2
3
TCY
Instruction Cycle Time
—
50*
20*
2.0*
—
4/FOSC
—
—
—
ns
ns
µs
ns
ns
ns
TosL, TosH Clock in (OSC1) Low or High Time
—
—
—
—
—
—
XT oscillator
—
HS oscillator
LP oscillator
XT oscillator
HS oscillator
LP oscillator
—
4
TosR, TosF Clock in (OSC1) Rise or Fall Time
25*
25*
50*
—
—
*
These parameters are characterized but not tested.
Note 1: Data in the Typical (“Typ”) column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only
and are not tested.
2: All specified values are based on characterization data for that particular oscillator type under standard operating condi-
tions with the device executing code. Exceeding these specified limits may result in an unstable oscillator operation and/or
higher than expected current consumption.
When an external clock input is used, the “max” cycle time limit is “DC” (no clock) for all devices.
3: Instruction cycle period (TCY) equals four times the input oscillator time base period.
DS40191A-page 58
Preliminary
1998 Microchip Technology Inc.
PIC16CR54C
FIGURE 10-3: CLKOUT AND I/O TIMING - PIC16CR54C
Q1
Q2
Q3
Q4
OSC1
10
11
CLKOUT
13
12
16
18
14
19
I/O Pin
(input)
15
17
I/O Pin
(output)
New Value
Old Value
20, 21
Note: All tests must be done with specified capacitive loads (see data sheet) 50 pF on I/O pins and CLKOUT.
TABLE 10-2: CLKOUT AND I/O TIMING REQUIREMENTS - PIC16CR54C
AC Characteristics
Standard Operating Conditions (unless otherwise specified)
Operating Temperature
0°C ≤ TA ≤ +70°C (commercial)
–40°C ≤ TA ≤ +85°C (industrial)
Operating Voltage VDD range is described in Section 10.1
Parameter
(1)
Typ
No.
Sym
Characteristic
(2)
Min
Max
Units
10
11
12
13
14
15
16
17
18
TosH2ckL
TosH2ckH
TckR
OSC1↑ to CLKOUT↓
—
15
15
5.0
5.0
—
30**
30**
15**
15**
40**
—
ns
ns
ns
ns
ns
ns
ns
ns
ns
(2)
OSC1↑ to CLKOUT↑
—
(2)
CLKOUT rise time
—
(2)
TckF
CLKOUT fall time
—
(2)
CLKOUT↓ to Port out valid
TckL2ioV
TioV2ckH
TckH2ioI
TosH2ioV
TosH2ioI
—
(2)
Port in valid before CLKOUT↑
(2)
0.25 TCY+30*
—
Port in hold after CLKOUT↑
OSC1↑ (Q1 cycle) to Port out valid
0*
—
—
—
(3)
—
100*
—
OSC1↑ (Q2 cycle) to Port input invalid
TBD
—
(I/O in hold time)
19
TioV2osH
Port input valid to OSC1↑
TBD
—
—
ns
(I/O in setup time)
(3)
20
21
TioR
TioF
Port output rise time
—
—
10
10
25**
25**
ns
ns
(3)
Port output fall time
*
These parameters are characterized but not tested.
** These parameters are design targets and are not tested. No characterization data available at this time.
Note 1: Data in the Typical (“Typ”) column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only
and are not tested.
2: Measurements are taken in RC Mode where CLKOUT output is 4 x TOSC.
3: See Figure 10-1 for loading conditions.
1998 Microchip Technology Inc.
Preliminary
DS40191A-page 59
PIC16CR54C
FIGURE 10-4: RESET, WATCHDOG TIMER, AND
DEVICE RESET TIMER TIMING - PIC16CR54C
VDD
MCLR
30
Internal
POR
32
32
32
DRT
Time-out
Internal
RESET
Watchdog
Timer
RESET
31
34
34
I/O pin
(Note 1)
Note 1: I/O pins must be taken out of hi-impedance mode by enabling the output drivers in software.
TABLE 10-3: RESET, WATCHDOG TIMER, AND DEVICE RESET TIMER - PIC16CR54C
AC Characteristics Standard Operating Conditions (unless otherwise specified)
Operating Temperature
0°C ≤ TA ≤ +70°C (commercial)
–40°C ≤ TA ≤ +85°C (industrial)
Operating Voltage VDD range is described in Section 10.1
Parameter
No.
(1)
Sym Characteristic
Min Typ
Max Units
Conditions
30
31
TmcL MCLR Pulse Width (low)
1000*
9.0*
—
—
ns VDD = 5.0V
Twdt Watchdog Timer Time-out Period
(No Prescaler)
18*
30*
ms VDD = 5.0V (Commercial)
32
34
TDRT Device Reset Timer Period
9.0*
18*
30*
ms VDD = 5.0V (Commercial)
ns
TioZ I/O Hi-impedance from MCLR Low 100* 300* 1000*
*
These parameters are characterized but not tested.
Note 1: Data in the Typical (“Typ”) column is at 5V, 25°C unless otherwise stated. These parameters are for design
guidance only and are not tested.
DS40191A-page 60
Preliminary
1998 Microchip Technology Inc.
PIC16CR54C
FIGURE 10-5: TIMER0 CLOCK TIMINGS - PIC16CR54C
T0CKI
40
41
42
TABLE 10-4: TIMER0 CLOCK REQUIREMENTS - PIC16CR54C
AC Characteristics Standard Operating Conditions (unless otherwise specified)
Operating Temperature 0°C ≤ TA ≤ +70°C (commercial)
–40°C ≤ TA ≤ +85°C (industrial)
Operating Voltage VDD range is described in Section 10.1
Parameter
(1)
Sym Characteristic
Min
Typ
Max Units Conditions
No.
40
Tt0H T0CKI High Pulse Width - No Prescaler
- With Prescaler
0.5 TCY + 20*
10*
—
—
—
—
—
—
—
—
—
—
ns
ns
ns
ns
41
42
Tt0L T0CKI Low Pulse Width - No Prescaler
- With Prescaler
0.5 TCY + 20*
10*
Tt0P T0CKI Period
20 or TCY + 40*
N
ns Whichever is greater.
N = Prescale Value
(1, 2, 4,..., 256)
*
These parameters are characterized but not tested.
Note 1: Data in the Typical (“Typ”) column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only
and are not tested.
1998 Microchip Technology Inc.
Preliminary
DS40191A-page 61
PIC16CR54C
NOTES:
DS40191A-page 62
Preliminary
1998 Microchip Technology Inc.
PIC16CR54C
PIC16CR54C
11.0 DC AND AC CHARACTERISTICS - PIC16CR54C
The graphs and tables provided in this section are for design guidance and are not tested or guaranteed. In some
graphs or tables the data presented are outside specified operating range (e.g., outside specified VDD range). This is
for information only and devices will operate properly only within the specified range.
The data presented in this section is a statistical summary of data collected on units from different lots over a period of
time. “Typical” represents the mean of the distribution while “max” or “min” represents (mean + 3σ) and (mean – 3σ)
respectively, where σ is standard deviation.
FIGURE 11-1: TYPICAL RC OSCILLATOR FREQUENCY vs.TEMPERATURE
FOSC
Frequency normalized to +25°C
FOSC (25°C)
1.10
Rext ≥ 10 kΩ
Cext = 100 pF
1.08
1.06
1.04
1.02
1.00
0.98
0.96
0.94
VDD = 5.5 V
VDD = 3.5 V
0.92
0.90
0.88
0
10
20
25
30
40
50
60
70
T(°C)
TABLE 11-1: RC OSCILLATOR FREQUENCIES
Average
Fosc @ 5 V, 25°C
Cext
Rext
20 pF
3.3 k
5 k
4.973 MHz
3.82 MHz
2.22 MHz
262.15 kHz
1.63 MHz
1.19 MHz
684.64 kHz
71.56 kHz
660 kHz
± 27%
± 21%
± 21%
± 31%
± 13%
± 13%
± 18%
± 25%
± 10%
± 14%
± 15%
± 19%
10 k
100 k
3.3 k
5 k
100 pF
300 pF
10 k
100 k
3.3 k
5.0 k
10 k
160 k
484.1 kHz
267.63 kHz
29.44 kHz
The frequencies are measured on DIP packages.
The percentage variation indicated here is part-to-part variation due to normal process distribution. The variation
indicated is ±3 standard deviation from average value for VDD = 5 V.
1998 Microchip Technology Inc.
Preliminary
DS40191A-page 63
PIC16CR54C
PIC16CR54C
FIGURE 11-2: TYPICAL RC OSCILLATOR FREQUENCY vs. VDD, CEXT = 20 PF
6.00
R=3.3K
5.00
R=5.0K
4.00
3.00
R=10K
2.00
Cext=20pF, T=25C
1.00
R=100K
0.00
2.5
3
3.5
4
4.5
5
5.5
6
VDD(Volts)
FIGURE 11-3: TYPICAL RC OSCILLATOR FREQUENCY vs. VDD, CEXT = 100 PF
1.80
R=3.3K
1.60
1.40
R=5.0K
1.20
1.00
0.80
0.60
R=10K
Cext=100pF, T=25C
0.40
0.20
R=100K
0.00
2.5
3
3.5
4
4.5
5
5.5
6
VDD(Volts)
DS40191A-page 64
Preliminary
1998 Microchip Technology Inc.
PIC16CR54C
PIC16CR54C
FIGURE 11-4: TYPICAL RC OSCILLATOR FREQUENCY vs. VDD, CEXT = 300 PF
700.00
R=3.3K
600.00
500.00
R=5.0K
400.00
300.00
R=10K
200.00
Cext=300pF, T=25C
100.00
R=100K
0.00
2.5
3
3.5
4
4.5
5
5.5
6
VDD(Volts)
FIGURE 11-5: TYPICAL IPD vs. VDD, WATCHDOG DISABLED (25°C)
2.5
2
1.5
1
0.5
0
2.5
3
3.5
4
4.5
5
5.5
6
VDD(Volts)
1998 Microchip Technology Inc.
Preliminary
DS40191A-page 65
PIC16CR54C
PIC16CR54C
FIGURE 11-6: TYPICAL IPD vs. VDD, WATCHDOG ENABLED (25°C)
25
20
15
10
5
0
2.5
3
3.5
5
5.5
6
4
4.5
VDD (Volts)
FIGURE 11-7: TYPICAL IPD vs. VDD, WATCHDOG ENABLED (–40°C, 85°C)
35
30
25
20
15
10
5
0
2.5
3
3.5
5
5.5
6
4
4.5
VDD (Volts)
DS40191A-page 66
Preliminary
1998 Microchip Technology Inc.
PIC16CR54C
PIC16CR54C
FIGURE 11-8: VTH (INPUT THRESHOLD TRIP POINT VOLTAGE) OF I/O PINS vs. VDD
2.00
1.80
1.60
1.40
1.20
1.00
0.80
0.60
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
VDD (Volts)
FIGURE 11-9: VIH, VIL OF MCLR,T0CKI AND OSC1 (IN RC MODE) vs. VDD
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
2.5
3.0
3.5
4.0
4.5
VDD (Volts)
5.0
5.5
6.0
Note: These input pins have Schmitt Trigger input buffers.
1998 Microchip Technology Inc.
Preliminary
DS40191A-page 67
PIC16CR54C
PIC16CR54C
FIGURE 11-10: VTH (INPUT THRESHOLD TRIP POINT VOLTAGE) OF OSC1 INPUT
(IN XT, HS, AND LP MODES) vs. VDD
3.4
3.2
3.0
2.8
2.6
2.4
2.2
2.0
1.8
1.6
1.4
1.2
1.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
VDD (Volts)
FIGURE 11-11: TYPICAL IDD vs. FREQUENCY (WDT DIS, RC MODE @ 20 PF, 25°C)
10000
1000
5.5V
100
4.5V
3.5V
2.5V
10
100000
1000000
10000000
Freq(Hz)
DS40191A-page 68
Preliminary
1998 Microchip Technology Inc.
PIC16CR54C
PIC16CR54C
FIGURE 11-12: TYPICAL IDD vs. FREQUENCY (WDT DIS, RC MODE @ 100 PF, 25°C)
10000
1000
5.5V
100
4.5V
3.5V
2.5V
10
10000
100000
1000000
10000000
Freq(Hz)
FIGURE 11-13: TYPICAL IDD vs. FREQUENCY (WDT DIS, RC MODE @ 300 PF, 25°C)
10000
1000
100
5.5V
4.5V
3.5V
2.5V
10
10000
100000
1000000
Freq(Hz)
1998 Microchip Technology Inc.
Preliminary
DS40191A-page 69
PIC16CR54C
PIC16CR54C
FIGURE 11-14: WDT TIMER TIME-OUT
PERIOD vs. VDD
50
45
40
35
30
Typ +125°C
25
Typ +85°C
20
15
Typ +25°C
Typ –40°C
10
5
2
3
4
5
6
7
VDD (Volts)
DS40191A-page 70
Preliminary
1998 Microchip Technology Inc.
PIC16CR54C
PIC16CR54C
FIGURE 11-15: IOH vs. VOH, VDD = 3 V
FIGURE 11-17: IOL vs. VOL, VDD = 3 V
0
45
40
35
Max –40°C
–5
Min +85°C
30
25
–10
Typ +25°C
Typ +25°C
Min +85°C
–15
20
Max –40°C
15
10
–20
5
0
–25
0
0.5 1.0 1.5 2.0 2.5 3.0
VOH (Volts)
0.0
0.5 1.0 1.5 2.0 2.5 3.0
VOL (Volts)
FIGURE 11-16: IOH vs. VOH, VDD = 5 V
FIGURE 11-18: IOL vs. VOL, VDD = 5 V
90
0
Max –40°C
80
70
–10
60
50
Typ +125°C
Typ +25°C
–20
Typ +85°C
40
Typ +25°C
Min +85°C
Typ –40°C
30
20
–30
–40
10
0
1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
VOH (Volts)
0.0 0.5 1.0 1.5 2.0 2.5 3.0
VOL (Volts)
1998 Microchip Technology Inc.
Preliminary
DS40191A-page 71
PIC16CR54C
PIC16CR54C
NOTES:
DS40191A-page 72
Preliminary
1998 Microchip Technology Inc.
PIC16CR54C
12.0 PACKAGING INFORMATION
12.1
Package Marking Information
18-Lead PDIP
Example
Example
MMMMMMMMMMMMXXX
MMMMMMMMXXXXXXX
PIC16CR54C-
04/P123
9813 HBA
AABB CDE
18-Lead SOIC
MMMMMMMMM
XXXXXXXXX
PIC16CR54C-
04I/S0218
AABB CDE
9810 HDK
20-Lead SSOP
Example
MMMMMMMM
XXXXXXXX
AABB CDE
PIC16CR54C
04I/218
9810 HBP
Legend: MM...M Microchip part number information
XX...X Customer specific information*
AA
BB
C
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Facility code of the plant at which wafer is manufactured
O = Outside Vendor
C = 5” Line
S = 6” Line
H = 8” Line
D
E
Mask revision number
Assembly code of the plant or country of origin in which
part was assembled
Note: In the event the full Microchip part number cannot be marked on one line,
it will be carried over to the next line thus limiting the number of available
characters for customer specific information.
*
Standard ROM marking consists of Microchip part number, year code, week
code, facility code, mask rev#, and assembly code. For ROM marking
beyond this, certain price adders apply. Please check with your Microchip
Sales Office.
1998 Microchip Technology Inc.
Preliminary
DS40191A-page 73
PIC16CR54C
Package Type: K04-007 18-Lead Plastic Dual In-line (P) – 300 mil
E
D
2
α
n
1
E1
A1
L
A
R
c
A2
B1
β
p
B
eB
Units
INCHES*
NOM
0.300
18
MILLIMETERS
Dimension Limits
PCB Row Spacing
Number of Pins
Pitch
Lower Lead Width
Upper Lead Width
Shoulder Radius
Lead Thickness
Top to Seating Plane
Top of Lead to Seating Plane
Base to Seating Plane
Tip to Seating Plane
Package Length
Molded Package Width
Radius to Radius Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
MIN
MAX
MIN
NOM
7.62
18
MAX
n
p
B
B1
R
c
A
A1
A2
L
D
E
E1
eB
α
0.100
0.018
0.060
0.005
0.010
0.155
0.095
0.020
0.130
0.895
0.255
0.250
0.349
10
2.54
0.013
0.023
0.33
1.40
0.46
1.52
0.13
0.25
3.94
2.41
0.51
3.30
22.73
6.48
6.35
8.85
10
0.58
†
0.055
0.000
0.005
0.110
0.075
0.000
0.125
0.890
0.245
0.230
0.310
5
0.065
0.010
0.015
0.155
0.115
0.020
0.135
0.900
0.265
0.270
0.387
15
1.65
0.25
0.38
3.94
2.92
0.51
3.43
22.86
6.73
6.86
9.83
15
0.00
0.13
2.79
1.91
0.00
3.18
22.61
6.22
5.84
7.87
5
‡
‡
β
5
10
15
5
10
15
*
Controlling Parameter.
†
Dimension “B1” does not include dam-bar protrusions. Dam-bar protrusions shall not exceed 0.003”
(0.076 mm) per side or 0.006” (0.152 mm) more than dimension “B1.”
‡
Dimensions “D” and “E” do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed 0.010” (0.254 mm) per side or 0.020” (0.508 mm) more than dimensions “D” or “E.”
DS40191A-page 74
Preliminary
1998 Microchip Technology Inc.
PIC16CR54C
Package Type: K04-051 18-Lead Plastic Small Outline (SO) – Wide, 300 mil
E1
E
p
D
2
1
B
n
X
α
45°
L
R2
c
A
A1
R1
φ
β
L1
A2
Units
Dimension Limits
Pitch
INCHES*
NOM
0.050
18
MILLIMETERS
MIN
MAX
MIN
NOM
1.27
18
MAX
p
n
A
A1
A2
Number of Pins
Overall Pack. Height
Shoulder Height
Standoff
Molded Package Length
Molded Package Width
Outside Dimension
Chamfer Distance
Shoulder Radius
Gull Wing Radius
Foot Length
0.093
0.099
0.058
0.008
0.456
0.296
0.407
0.020
0.005
0.005
0.016
4
0.104
2.36
1.22
2.50
1.47
0.19
11.58
7.51
10.33
0.50
0.13
0.13
0.41
4
2.64
1.73
0.28
11.73
7.59
10.64
0.74
0.25
0.25
0.53
8
0.048
0.004
0.450
0.292
0.394
0.010
0.005
0.005
0.011
0
0.068
0.011
0.462
0.299
0.419
0.029
0.010
0.010
0.021
8
0.10
11.43
7.42
10.01
0.25
0.13
0.13
0.28
0
‡
D
E
‡
E1
X
R1
R2
L
Foot Angle
φ
Radius Centerline
Lead Thickness
Lower Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
*
L1
c
B
α
β
0.010
0.009
0.014
0
0.015
0.011
0.017
12
0.020
0.012
0.019
15
0.25
0.23
0.36
0
0.38
0.27
0.42
12
0.51
0.30
0.48
15
†
0
12
15
0
12
15
Controlling Parameter.
†
Dimension “B” does not include dam-bar protrusions. Dam-bar protrusions shall not exceed 0.003”
(0.076 mm) per side or 0.006” (0.152 mm) more than dimension “B.”
‡
Dimensions “D” and “E” do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed 0.010” (0.254 mm) per side or 0.020” (0.508 mm) more than dimensions “D” or “E.”
1998 Microchip Technology Inc.
Preliminary
DS40191A-page 75
PIC16CR54C
Package Type: K04-072 20-Lead Plastic Shrink Small Outine (SS) – 5.30 mm
E1
E
p
D
B
2
n
1
α
L
R2
c
A
A1
R1
φ
L1
A2
β
Units
Dimension Limits
Pitch
INCHES
NOM
0.026
MILLIMETERS*
MIN
MAX
MIN
NOM
0.65
20
MAX
p
n
A
A1
A2
D
E
E1
R1
R2
L
Number of Pins
Overall Pack. Height
Shoulder Height
Standoff
Molded Package Length
Molded Package Width
Outside Dimension
Shoulder Radius
Gull Wing Radius
Foot Length
20
0.073
0.036
0.005
0.283
0.208
0.306
0.005
0.005
0.020
4
0.068
0.078
1.73
0.66
1.86
0.91
0.13
7.20
5.29
7.78
0.13
0.13
0.51
4
1.99
0.026
0.002
0.278
0.205
0.301
0.005
0.005
0.015
0
0.046
0.008
0.289
0.212
0.311
0.010
0.010
0.025
8
1.17
0.21
7.33
5.38
7.90
0.25
0.25
0.64
8
0.05
7.07
5.20
7.65
0.13
0.13
0.38
0
‡
‡
Foot Angle
φ
Radius Centerline
Lead Thickness
Lower Lead Width
Mold Draft Angle Top
L1
c
B
α
β
0.000
0.005
0.010
0
0.005
0.007
0.012
5
0.010
0.009
0.015
10
0.00
0.13
0.25
0
0.13
0.18
0.32
5
0.25
0.22
0.38
10
†
Mold Draft Angle Bottom
*
0
5
10
0
5
10
Controlling Parameter.
†
Dimension “B” does not include dam-bar protrusions. Dam-bar protrusions shall not exceed 0.003”
(0.076 mm) per side or 0.006” (0.152 mm) more than dimension “B.”
‡
Dimensions “D” and “E” do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed 0.010” (0.254 mm) per side or 0.020” (0.508 mm) more than dimensions “D” or “E.”
DS40191A-page 76
Preliminary
1998 Microchip Technology Inc.
PIC16CR54C
APPENDIX A: COMPATIBILITY
To convert code written for PIC16CXX to PIC16C5X,
the user should take the following steps:
1. Check any CALL, GOTO or instructions that
modify the PC to determine if any program
memory page select operations (PA2, PA1, PA0
bits) need to be made.
2. Revisit any computed jump operations (write to
PC or add to PC, etc.) to make sure page bits
are set properly under the new scheme.
3. Eliminate any special function register page
switching. Redefine data variables to reallocate
them.
4. Verify all writes to STATUS, OPTION, and FSR
registers since these have changed.
5. Change reset vector to proper value for
processor used.
6. Remove any use of the ADDLW and SUBLW
instructions.
7. Rewrite any code segments that use interrupts.
1998 Microchip Technology Inc.
Preliminary
DS40191A-page 77
PIC16CR54C
NOTES:
DS40191A-page 78
Preliminary
1998 Microchip Technology Inc.
PIC16CR54C
INDEX
A
M
MCLR ................................................................................ 29
Memory Map ...................................................................... 13
PIC16C54s/CR54s/C55s ................................................... 13
Memory Organization ........................................................ 13
Data Memory ..................................................................... 13
Program Memory ............................................................... 13
MP-DriveWay™ - Application Code Generator ................. 51
MPLAB C ........................................................................... 51
MPLAB Integrated Development Environment Software ... 50
Absolute Maximum Ratings ............................................... 53
ALU ...................................................................................... 9
Applications .......................................................................... 5
Architectural Overview ......................................................... 9
Assembler
MPASM Assembler ............................................................ 50
B
Block Diagram
O
On-Chip Reset Circuit ........................................................ 29
PIC16CR54C Series Block Diagram .................................. 10
Timer0 ................................................................................ 21
TMR0/WDT Prescaler ........................................................ 24
Watchdog Timer ................................................................. 33
Brown-Out Protection Circuit ............................................. 34
One-Time-Programmable (OTP) Devices ............................7
OPTION Register .............................................................. 16
OSC selection .................................................................... 25
Oscillator Configurations ................................................... 26
Oscillator Types
HS ...................................................................................... 26
LP ...................................................................................... 26
RC ..................................................................................... 26
XT ...................................................................................... 26
C
Carry bit ............................................................................... 9
Clocking Scheme ............................................................... 12
Code Protection ........................................................... 25, 35
Configuration Bits ............................................................... 25
Configuration Word ............................................................ 25
PIC16CR54C ..................................................................... 25
P
Package Marking Information ............................................ 73
Packaging Information ....................................................... 73
PC ................................................................................ 17, 29
PIC16CR54C Product Identification System ..................... 83
PICDEM-1 Low-Cost PICmicro Demo Board .................... 49
PICDEM-2 Low-Cost PIC16CXX Demo Board .................. 50
PICDEM-3 Low-Cost PIC16CXXX Demo Board ............... 50
PICMASTER In-Circuit Emulator .................................... 49
PICSTART Plus Entry Level Development System ........ 49
Pin Configurations ................................................................1
Pinout Description - PIC16CR54C .................................... 11
POR
D
DC and AC Characteristics - PIC16CR54C ....................... 63
DC Characteristics ............................................................. 54
Development Support ........................................................ 49
Development Tools ............................................................ 49
Device Varieties ................................................................... 7
Digit Carry bit ....................................................................... 9
E
Device Reset Timer (DRT) .......................................... 25, 32
PD ................................................................................ 28, 34
Power-On Reset (POR) ......................................... 25, 29, 30
TO ................................................................................ 28, 34
PORTA ........................................................................ 19, 29
PORTB ........................................................................ 19, 29
Power-Down Mode ............................................................ 35
Prescaler ........................................................................... 24
PRO MATE II Universal Programmer ............................. 49
Program Counter ............................................................... 17
Electrical Characteristics
PIC16CR54C ..................................................................... 53
External Power-On Reset Circuit ....................................... 30
F
Family of Devices
PIC16C5X ............................................................................ 6
Features ............................................................................... 1
FSR .................................................................................... 29
FSR Register ..................................................................... 18
Fuzzy Logic Dev. System (fuzzyTECH -MP) ................... 51
Q
Q cycles ............................................................................. 12
Quick-Turnaround-Production (QTP) Devices ......................7
I
I/O Interfacing .................................................................... 19
I/O Ports ............................................................................. 19
I/O Programming Considerations ....................................... 20
ICEPIC Low-Cost PIC16CXXX In-Circuit Emulator ........... 49
INDF ................................................................................... 29
INDF Register .................................................................... 18
Indirect Data Addressing .................................................... 18
Instruction Cycle ................................................................ 12
Instruction Flow/Pipelining ................................................. 12
Instruction Set Summary .................................................... 37
R
RC Oscillator ..................................................................... 27
Read Only Memory (ROM) Devices .....................................7
Read-Modify-Write ............................................................. 20
Register File Map .............................................................. 13
Registers
Special Function ................................................................ 13
Reset ........................................................................... 25, 28
Reset on Brown-Out .......................................................... 34
K
S
KeeLoq Evaluation and Programming Tools ................... 51
SEEVAL Evaluation and Programming System ............. 51
Serialized Quick-Turnaround-Production (SQTP) Devices ..7
SLEEP ......................................................................... 25, 35
Software Simulator (MPLAB-SIM) ..................................... 51
Special Features of the CPU ............................................. 25
L
Loading of PC .................................................................... 17
1998 Microchip Technology Inc.
DS40191A-page 79
PIC16CR54C
Special Function Registers ................................................13
Stack ..................................................................................17
STATUS .............................................................................29
STATUS Register ...........................................................9, 15
T
Timer0
Switching Prescaler Assignment ........................................24
Timer0 (TMR0) Module ......................................................21
TMR0 with External Clock ..................................................23
Timing Diagrams and Specifications ..................................57
Timing Parameter Symbology and Load Conditions ..........56
TRIS Registers ...................................................................19
U
UV Erasable Devices ...........................................................7
W
W ........................................................................................29
Wake-up from SLEEP ........................................................35
Watchdog Timer (WDT) ...............................................25, 32
Period .................................................................................32
Programming Considerations .............................................32
Z
Zero bit .................................................................................9
DS40191A-page 80
1998 Microchip Technology Inc.
PIC16CR54C
Systems Information and Upgrade Hot Line
ON-LINE SUPPORT
The Systems Information and Upgrade Line provides
system users a listing of the latest versions of all of
Microchip's development systems software products.
Plus, this line provides information on how customers
can receive any currently available upgrade kits.The
Hot Line Numbers are:
Microchip provides on-line support on the Microchip
World Wide Web (WWW) site.
The web site is used by Microchip as a means to make
files and information easily available to customers. To
view the site, the user must have access to the Internet
and a web browser, such as Netscape or Microsoft
Explorer. Files are also available for FTP download
from our FTP site.
1-800-755-2345 for U.S. and most of Canada, and
1-602-786-7302 for the rest of the world.
980106
ConnectingtotheMicrochipInternetWebSite
The Microchip web site is available by using your
favorite Internet browser to attach to:
www.microchip.com
The file transfer site is available by using an FTP ser-
vice to connect to:
ftp://ftp.futureone.com/pub/microchip
The web site and file transfer site provide a variety of
services. Users may download files for the latest
Development Tools, Data Sheets, Application Notes,
User's Guides, Articles and Sample Programs. A vari-
ety of Microchip specific business information is also
available, including listings of Microchip sales offices,
distributors and factory representatives. Other data
available for consideration is:
Trademarks: The Microchip name, logo, PIC, PICSTART,
PICMASTER and PRO MATE are registered trademarks
of Microchip Technology Incorporated in the U.S.A. and
other countries. PICmicro, FlexROM, MPLAB and fuzzy-
LAB are trademarks and SQTP is a service mark of Micro-
chip in the U.S.A.
• Latest Microchip Press Releases
• Technical Support Section with Frequently Asked
Questions
• Design Tips
• Device Errata
fuzzyTECH is a registered trademark of Inform Software
Corporation. IBM, IBM PC-AT are registered trademarks
of International Business Machines Corp. Pentium is a
trademark of Intel Corporation. Windows is a trademark
and MS-DOS, Microsoft Windows are registered trade-
marks of Microsoft Corporation. CompuServe is a regis-
tered trademark of CompuServe Incorporated.
• Job Postings
• Microchip Consultant Program Member Listing
• Links to other useful web sites related to
Microchip Products
• Conferences for products, Development Systems,
technical information and more
All other trademarks mentioned herein are the property of
their respective companies.
• Listing of seminars and events
1998 Microchip Technology Inc.
DS40191A-page 81
PIC16CR54C
READER RESPONSE
It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip prod-
uct. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation
can better serve you, please FAX your comments to the Technical Publications Manager at (602) 786-7578.
Please list the following information, and use this outline to provide us with your comments about this Data Sheet.
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Application (optional):
Would you like a reply?
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Literature Number:
DS40191A
Device:
PIC16CR54C
Questions:
1. What are the best features of this document?
2. How does this document meet your hardware and software development needs?
3. Do you find the organization of this data sheet easy to follow? If not, why?
4. What additions to the data sheet do you think would enhance the structure and subject?
5. What deletions from the data sheet could be made without affecting the overall usefulness?
6. Is there any incorrect or misleading information (what and where)?
7. How would you improve this document?
8. How would you improve our software, systems, and silicon products?
DS40191A-page 82
1998 Microchip Technology Inc.
PIC16CR54C
PIC16CR54C PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
X
/XX
XXX
PART NO.
Device
-XX
Examples:
Frequency Temperature Package
Pattern
a) PIC16CR54C -04/P 301 = Commercial
temp., PDIP package, 4MHz, normalVDD
limitis, pattern #301.
Range
Range
(2)
(3)
Device
PIC16CR54C , PIC16CR54CT
b) PIC16CR54C - 20I/P355 = ROM pro-
gram memory, Industrial temp., PDIP
package, 20MHz, normal VDD limits.
Frequency
Range
04
20
C
= 4 MHz
= 20 MHz
(1)
Temperature
Range
b
I
=
0°C to +70°C (Commercial)
= -40°C to +85°C (Industrial)
Note 1: b = blank
2: CR = ROM Version, Standard VDD
range
3: T = in tape and reel - SOIC, SSOP
packages only.
Package
Pattern
P
SO
SS
= PDIP
= SOIC (Gull Wing, 300 mil body)
= SSOP (209 mil body)
3-digit Pattern Code for ROM (blank otherwise)
1998 Microchip Technology Inc.
Preliminary
DS40191A-page 83
M
WORLDWIDE SALES AND SERVICE
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC (continued)
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Microchip received ISO 9001 Quality
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Our field-programmable PICmicro™
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Organization (ISO).
All rights reserved. © 1998, Microchip Technology Incorporated, USA. 4/98
Printed on recycled paper.
Information contained in this publication regarding device applications and the like is intended for suggestion only and may be superseded by updates. No representation or warranty is given and no
liability is assumed by Microchip Technology Incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use
or otherwise. Use of Microchip’s products as critical components in life support systems is not authorized except with express written approval by Microchip. No licenses are conveyed, implicitly or
otherwise, under any intellectual property rights. The Microchip logo and name are registered trademarks of Microchip Technology Inc. in the U.S.A. and other countries. All rights reserved. All other
trademarks mentioned herein are the property of their respective companies.
DS40191A-page 84
1998 Microchip Technology Inc.
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