PIC18F4221-I/P [MICROCHIP]

Enhanced Flash Microcontrollers with 10-Bit A/D and nanoWatt Technology; 增强型闪存微控制器与10位A / D和纳瓦技术
PIC18F4221-I/P
型号: PIC18F4221-I/P
厂家: MICROCHIP    MICROCHIP
描述:

Enhanced Flash Microcontrollers with 10-Bit A/D and nanoWatt Technology
增强型闪存微控制器与10位A / D和纳瓦技术

闪存 微控制器和处理器 外围集成电路 光电二极管 PC 时钟
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中文:  中文翻译
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PIC18F2221/2321/4221/4321  
Family Data Sheet  
Enhanced Flash Microcontrollers with  
10-Bit A/D and nanoWatt Technology  
© 2009 Microchip Technology Inc.  
DS39689F  
Note the following details of the code protection feature on Microchip devices:  
Microchip products meet the specification contained in their particular Microchip Data Sheet.  
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the  
intended manner and under normal conditions.  
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our  
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data  
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.  
Microchip is willing to work with the customer who is concerned about the integrity of their code.  
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not  
mean that we are guaranteeing the product as “unbreakable.”  
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our  
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts  
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.  
Information contained in this publication regarding device  
applications and the like is provided only for your convenience  
and may be superseded by updates. It is your responsibility to  
ensure that your application meets with your specifications.  
MICROCHIP MAKES NO REPRESENTATIONS OR  
WARRANTIES OF ANY KIND WHETHER EXPRESS OR  
IMPLIED, WRITTEN OR ORAL, STATUTORY OR  
OTHERWISE, RELATED TO THE INFORMATION,  
INCLUDING BUT NOT LIMITED TO ITS CONDITION,  
QUALITY, PERFORMANCE, MERCHANTABILITY OR  
FITNESS FOR PURPOSE. Microchip disclaims all liability  
arising from this information and its use. Use of Microchip  
devices in life support and/or safety applications is entirely at  
the buyer’s risk, and the buyer agrees to defend, indemnify and  
hold harmless Microchip from any and all damages, claims,  
suits, or expenses resulting from such use. No licenses are  
conveyed, implicitly or otherwise, under any Microchip  
intellectual property rights.  
Trademarks  
The Microchip name and logo, the Microchip logo, dsPIC,  
KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART,  
rfPIC and UNI/O are registered trademarks of Microchip  
Technology Incorporated in the U.S.A. and other countries.  
FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,  
MXDEV, MXLAB, SEEVAL and The Embedded Control  
Solutions Company are registered trademarks of Microchip  
Technology Incorporated in the U.S.A.  
Analog-for-the-Digital Age, Application Maestro, CodeGuard,  
dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,  
ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial  
Programming, ICSP, Mindi, MiWi, MPASM, MPLAB Certified  
logo, MPLIB, MPLINK, mTouch, Octopus, Omniscient Code  
Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit,  
32  
PICtail, PIC logo, REAL ICE, rfLAB, Select Mode, Total  
Endurance, TSHARC, UniWinDriver, WiperLock and ZENA  
are trademarks of Microchip Technology Incorporated in the  
U.S.A. and other countries.  
SQTP is a service mark of Microchip Technology Incorporated  
in the U.S.A.  
All other trademarks mentioned herein are property of their  
respective companies.  
© 2009, Microchip Technology Incorporated, Printed in the  
U.S.A., All Rights Reserved.  
Printed on recycled paper.  
Microchip received ISO/TS-16949:2002 certification for its worldwide  
headquarters, design and wafer fabrication facilities in Chandler and  
Tempe, Arizona; Gresham, Oregon and design centers in California  
and India. The Company’s quality system processes and procedures  
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping  
devices, Serial EEPROMs, microperipherals, nonvolatile memory and  
analog products. In addition, Microchip’s quality system for the design  
and manufacture of development systems is ISO 9001:2000 certified.  
DS39689F-page 2  
© 2009 Microchip Technology Inc.  
PIC18F2221/2321/4221/4321 FAMILY  
28/40/44-Pin Enhanced Flash Microcontrollers with  
10-Bit A/D and nanoWatt Technology  
Power-Managed Modes:  
Peripheral Highlights (Continued):  
• Run: CPU On, Peripherals On  
• Idle: CPU Off, Peripherals On  
• Master Synchronous Serial Port (MSSP) module  
Supporting 3-Wire SPI (all 4 modes) and I C™  
2
• Sleep: CPU Off, Peripherals Off  
Master and Slave modes  
• Idle mode Currents Down to 2.5 μA Typical  
• Sleep mode Currents Down to 500 nA Typical  
• Timer1 Oscillator: 1.8 μA, 32 kHz, 2V Typical  
• Watchdog Timer: 1.6 μA, 2V Typical  
• Two-Speed Oscillator Start-up  
• Enhanced Addressable USART module:  
- Supports RS-485, RS-232 and LIN/J2602  
- Auto-wake-up on Start bit  
- Auto-Baud Detect  
• 10-Bit, up to 13-Channel Analog-to-Digital  
Converter module (A/D):  
Flexible Oscillator Structure:  
- Auto-acquisition capability  
- Conversion available during Sleep  
• Dual Analog Comparators with Input Multiplexing  
• Programmable 16-Level High/Low-Voltage  
Detection (HLVD) module:  
• Four Crystal modes, up to 40 MHz  
• 4x Phase Lock Loop (PLL) – Available for Crystal  
and Internal Oscillators  
• Two External RC modes, up to 4 MHz  
• Two External Clock modes, up to 40 MHz  
• Internal Oscillator Block:  
- Supports interrupt on High/Low-Voltage Detection  
Special Microcontroller Features:  
- 8 user-selectable frequencies, from 31 kHz to  
8 MHz  
• C Compiler Optimized Architecture:  
- Optional extended instruction set designed to  
optimize re-entrant code  
• 100,000 Erase/Write Cycle Enhanced Flash  
Program Memory Typical  
- Provides a complete range of clock speeds  
from 31 kHz to 32 MHz when used with PLL  
- User-tunable to compensate for frequency drift  
• Secondary Oscillator using Timer1 @ 32 kHz  
• Fail-Safe Clock Monitor  
• 1,000,000 Erase/Write Cycle Data EEPROM  
Memory Typical  
- Allows for safe shutdown if peripheral clock stops  
• Flash/Data EEPROM Retention: 100 Years Typical  
• Self-Programmable under Software Control  
• Priority Levels for Interrupts  
Peripheral Highlights:  
• High-Current Sink/Source 25 mA/25 mA  
• Three Programmable External Interrupts  
• Four Input Change Interrupts  
• Up to 2 Capture/Compare/PWM (CCP) modules,  
one with Auto-Shutdown (28-pin devices)  
• Enhanced Capture/Compare/PWM (ECCP)  
module (40/44-pin devices only):  
- One, two or four PWM outputs  
- Selectable polarity  
• 8 x 8 Single-Cycle Hardware Multiplier  
• Extended Watchdog Timer (WDT):  
- Programmable period from 4 ms to 131s  
• Single-Supply 5V In-Circuit Serial  
Programming™ (ICSP™) via Two Pins  
• In-Circuit Debug (ICD) via Two Pins  
• Wide Operating Voltage Range: 2.0V to 5.5V  
• Programmable Brown-out Reset (BOR) with  
Software Enable Option)  
- Programmable dead time  
- Auto-shutdown and auto-restart  
-
Program Memory  
Data Memory  
MSSP  
CCP/  
ECCP  
(PWM)  
10-Bit  
A/D (ch)  
Timers  
8/16-Bit  
Device  
I/O  
Comp.  
Flash # Single-Word SRAM EEPROM  
(bytes) Instructions (bytes) (bytes)  
Master  
SPI  
2
I C™  
PIC18F2221  
PIC18F2321  
PIC18F4221  
PIC18F4321  
4K  
8K  
4K  
8K  
2048  
4096  
2048  
4096  
512  
512  
512  
512  
256  
256  
256  
256  
25  
25  
36  
36  
10  
10  
13  
13  
2/0  
2/0  
1/1  
1/1  
Y
Y
Y
Y
Y
Y
Y
Y
1
1
1
1
2
2
2
2
1/3  
1/3  
1/3  
1/3  
© 2009 Microchip Technology Inc.  
DS39689F-page 3  
PIC18F2221/2321/4221/4321 FAMILY  
Pin Diagrams  
28-Pin SPDIP, SOIC, SSOP  
1
2
3
4
5
28  
27  
26  
25  
24  
23  
22  
21  
20  
19  
18  
17  
16  
15  
RB7/KBI3/PGD  
RB6//KBI2/PGC  
RB5/KBI1/PGM  
RB4/KBI0/AN11  
RB3/AN9/CCP2  
RB2/INT2/AN8  
RB1/INT1/AN10  
RB0/INT0/FLT0/AN12  
VDD  
MCLR/VPP/RE3  
RA0/AN0  
RA1/AN1  
RA2/AN2/VREF-/CVREF  
RA3/AN3/VREF+  
RA4/T0CKI/C1OUT  
RA5/AN4/SS/HLVDIN/C2OUT  
VSS  
6
7
8
9
OSC1/CLKI/RA7  
OSC2/CLKO/RA6  
RC0/T1OSO/T13CKI  
RC1/T1OSI/CCP2  
RC2/CCP1  
VSS  
RC7/RX/DT  
10  
11  
RC6/TX/CK  
RC5/SDO  
RC4/SDI/SDA  
12  
13  
14  
RC3/SCK/SCL  
28-Pin QFN  
28272625242322  
RB3/AN9/CCP2(1)  
RB2/INT2/AN8  
RB1/INT1/AN10  
RB0/INT0/FLT0/AN12  
VDD  
RA2/AN2/VREF-/CVREF  
RA3/AN3/VREF+  
RA4/T0CKI/C1OUT  
RA5/AN4/SS/HLVDIN/C2OUT  
VSS  
1
21  
20  
19  
18  
17  
16  
15  
2
3
4
5
6
7
PIC18F2221  
PIC18F2321  
OSC1/CLKI/RA7  
OSC2/CLKO/RA6  
VSS  
RC7/RX/DT  
8
9 1011 12 1314  
Note 1: RB3 is the alternate pin for CCP2 multiplexing.  
DS39689F-page 4  
© 2009 Microchip Technology Inc.  
PIC18F2221/2321/4221/4321 FAMILY  
Pin Diagrams (Continued)  
40-Pin PDIP  
MCLR/VPP/RE3  
RA0/AN0  
1
2
3
4
5
6
7
8
RB7/KBI3/PGD  
RB6/KBI2/PGC  
RB5/KBI1/PGM  
RB4/KBI0/AN11  
RB3/AN9/CCP2  
RB2/INT2/AN8  
40  
39  
38  
37  
36  
35  
34  
33  
32  
31  
30  
29  
28  
27  
26  
25  
24  
23  
22  
21  
RA1/AN1  
RA2/AN2/VREF-/CVREF  
RA3/AN3/VREF+  
RA4/T0CKI/C1OUT  
RA5/AN4/SS/HLVDIN/C2OUT  
RE0/RD/AN5  
RB1/INT1/AN10  
RB0/INT0/FLT0/AN12  
VDD  
VSS  
RE1/WR/AN6  
RE2/CS/AN7  
9
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
VDD  
VSS  
RD7/PSP7/P1D  
RD6/PSP6/P1C  
RD5/PSP5/P1B  
RD4/PSP4  
RC7/RX/DT  
RC6/TX/CK  
RC5/SDO  
OSC1/CLKI/RA7  
OSC2/CLKO/RA6  
RC0/T1OSO/T13CKI  
RC1/T1OSI/CCP2  
RC2/CCP1/P1A  
RC3/SCK/SCL  
RD0/PSP0  
RC4/SDI/SDA  
RD3/PSP3  
RD1/PSP1  
RD2/PSP2  
44-Pin QFN(2)  
RC7/RX/DT  
RD4/PSP4  
RD5/PSP5/P1B  
RD6/PSP6/P1C  
RD7/PSP7/P1D  
VSS  
OSC2/CLKO/RA6  
OSC1/CLKI/RA7  
VSS  
VSS  
VDD  
VDD  
RE2/CS/AN7  
RE1/WR/AN6  
RE0/RD/AN5  
RA5/AN4/SS/HLVDIN/C2OUT  
RA4/T0CKI/C1OUT  
33  
1
2
3
4
5
6
7
8
9
32  
31  
30  
29  
28  
27  
26  
PIC18F4221  
PIC18F4321  
VDD  
VDD  
RB0/INT0/FLT0/AN12  
RB1/INT1/AN10  
RB2/INT2/AN8  
25  
24  
23  
10  
11  
Note 1: RB3 is the alternate pin for CCP2 multiplexing.  
2: For the QFN package, it is recommended that the bottom pad be connected to VSS.  
© 2009 Microchip Technology Inc.  
DS39689F-page 5  
PIC18F2221/2321/4221/4321 FAMILY  
Pin Diagrams (Continued)  
44-Pin TQFP  
NC  
33  
32  
31  
30  
29  
28  
27  
26  
1
2
3
4
5
6
7
8
RC7/RX/DT  
RD4/PSP4  
RD5/PSP5/P1B  
RD6/PSP6/P1C  
RD7/PSP7/P1D  
VSS  
RC0/T1OSO/T13CKI  
OSC2/CLKO/RA6  
OSC1/CLKI/RA7  
VSS  
PIC18F4221  
PIC18F4321  
VDD  
RE2/CS/AN7  
RE1/WR/AN6  
RE0/RD/AN5  
RA5/AN4/SS/HLVDIN/C2OUT  
RA4/T0CKI/C1OUT  
VDD  
RB0/INT0/FLT0/AN12  
RB1/INT1/AN10  
RB2/INT2/AN8  
RB3/AN9/CCP2(1)  
9
10  
11  
25  
24  
23  
Note 1: RB3 is the alternate pin for CCP2 multiplexing.  
DS39689F-page 6  
© 2009 Microchip Technology Inc.  
PIC18F2221/2321/4221/4321 FAMILY  
Table of Contents  
1.0 Device Overview .......................................................................................................................................................................... 9  
2.0 Guidelines for Getting Started with PIC18F Microcontrollers..................................................................................................... 25  
3.0 Oscillator Configurations ............................................................................................................................................................ 29  
4.0 Power-Managed Modes ............................................................................................................................................................. 39  
5.0 Reset.......................................................................................................................................................................................... 47  
6.0 Memory Organization................................................................................................................................................................. 59  
7.0 Flash Program Memory.............................................................................................................................................................. 79  
8.0 Data EEPROM Memory ............................................................................................................................................................. 89  
9.0 8 x 8 Hardware Multiplier............................................................................................................................................................ 95  
10.0 Interrupts .................................................................................................................................................................................... 97  
11.0 I/O Ports ................................................................................................................................................................................... 111  
12.0 Timer0 Module ......................................................................................................................................................................... 129  
13.0 Timer1 Module ......................................................................................................................................................................... 133  
14.0 Timer2 Module ......................................................................................................................................................................... 139  
15.0 Timer3 Module ......................................................................................................................................................................... 141  
16.0 Capture/Compare/PWM (CCP) Modules ................................................................................................................................. 145  
17.0 Enhanced Capture/Compare/PWM (ECCP) Module................................................................................................................ 153  
18.0 Master Synchronous Serial Port (MSSP) Module .................................................................................................................... 167  
19.0 Enhanced Universal Synchronous Asynchronous Receiver Transmitter (EUSART)............................................................... 211  
20.0 10-Bit Analog-to-Digital Converter (A/D) Module ..................................................................................................................... 233  
21.0 Comparator Module.................................................................................................................................................................. 243  
22.0 Comparator Voltage Reference Module................................................................................................................................... 249  
23.0 High/Low-Voltage Detect (HLVD)............................................................................................................................................. 253  
24.0 Special Features of the CPU.................................................................................................................................................... 259  
25.0 Instruction Set Summary.......................................................................................................................................................... 279  
26.0 Development Support............................................................................................................................................................... 329  
27.0 Electrical Characteristics.......................................................................................................................................................... 333  
28.0 Packaging Information.............................................................................................................................................................. 373  
Appendix A: Revision History............................................................................................................................................................. 385  
Appendix B: Device Differences ........................................................................................................................................................ 386  
Appendix C: Conversion Considerations ........................................................................................................................................... 387  
Appendix D: Migration from Baseline to Enhanced Devices.............................................................................................................. 387  
Appendix E: Migration From Mid-Range to Enhanced Devices......................................................................................................... 388  
Appendix F: Migration From High-End to Enhanced Devices............................................................................................................ 388  
Index ................................................................................................................................................................................................. 389  
The Microchip Web Site..................................................................................................................................................................... 399  
Customer Change Notification Service .............................................................................................................................................. 399  
Customer Support.............................................................................................................................................................................. 399  
Reader Response.............................................................................................................................................................................. 400  
PIC18F2221/2321/4221/4321 Product Identification System ............................................................................................................ 401  
© 2009 Microchip Technology Inc.  
DS39689F-page 7  
PIC18F2221/2321/4221/4321 FAMILY  
TO OUR VALUED CUSTOMERS  
It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip  
products. To this end, we will continue to improve our publications to better suit your needs. Our publications will be refined and  
enhanced as new volumes and updates are introduced.  
If you have any questions or comments regarding this publication, please contact the Marketing Communications Department via  
E-mail at docerrors@microchip.com or fax the Reader Response Form in the back of this data sheet to (480) 792-4150. We  
welcome your feedback.  
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The last character of the literature number is the version number, (e.g., DS30000A is version A of document DS30000).  
Errata  
An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current  
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To determine if an errata sheet exists for a particular device, please check with one of the following:  
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DS39689F-page 8  
© 2009 Microchip Technology Inc.  
PIC18F2221/2321/4221/4321 FAMILY  
1.1.2  
MULTIPLE OSCILLATOR OPTIONS  
AND FEATURES  
1.0  
DEVICE OVERVIEW  
This document contains device specific information for  
the following devices:  
All of the devices in the PIC18F2221/2321/4221/4321  
family offer ten different oscillator options, allowing  
users a wide range of choices in developing application  
hardware. These include:  
• PIC18F2221  
• PIC18F2321  
• PIC18F4221  
• PIC18F4321  
• PIC18LF2221  
• PIC18LF2321  
• PIC18LF4221  
• PIC18LF4321  
• Four Crystal modes, using crystals or ceramic  
resonators.  
• Two External Clock modes, offering the option of  
using two pins (oscillator input and a divide-by-4  
clock output) or one pin (oscillator input, with the  
second pin reassigned as general I/O).  
This family offers the advantages of all PIC18 micro-  
controllers – namely, high computational performance at  
an economical price – with the addition of high-  
endurance, Enhanced Flash program memory. On top of  
these features, the PIC18F2221/2321/4221/4321 family  
introduces design enhancements that make these micro-  
controllers a logical choice for many high-performance,  
power sensitive applications.  
• Two External RC Oscillator modes with the same  
pin options as the External Clock modes.  
• Two Internal Oscillator modes which provide  
an 8 MHz clock and an INTRC source  
(approximately 31 kHz), as well as a range of  
6 user-selectable clock frequencies, between  
125 kHz to 4 MHz, for a total of 8 clock frequencies.  
One or both of the oscillator pins can be used for  
general purpose I/O.  
1.1  
New Core Features  
1.1.1  
nanoWatt TECHNOLOGY  
All of the devices in the PIC18F2221/2321/4221/4321  
family incorporate a range of features that can signifi-  
cantly reduce power consumption during operation.  
Key items include:  
• A Phase Lock Loop (PLL) frequency multiplier,  
available to both the high-speed crystal and  
internal oscillator modes, which allows clock  
speeds of up to 40 MHz. Used with the internal  
oscillator, the PLL gives users a complete selection  
of clock speeds, from 31 kHz to 32 MHz – all  
without using an external crystal or clock circuit.  
Alternate Run Modes: By clocking the controller  
from the Timer1 source or the internal oscillator  
block, power consumption during code execution  
can be reduced by as much as 90%.  
Besides its availability as a clock source, the internal  
oscillator block provides a stable reference source that  
gives the family additional features for robust  
operation:  
Multiple Idle Modes: The controller can also run  
with its CPU core disabled but the peripherals still  
active. In these states, power consumption can be  
reduced even further, to as little as 4% of normal  
operation requirements.  
Fail-Safe Clock Monitor: This option constantly  
monitors the main clock source against a reference  
signal provided by the internal oscillator. If a clock  
failure occurs, the controller is switched to the  
internal oscillator block, allowing for continued  
low-speed operation or a safe application  
shutdown.  
On-the-Fly Mode Switching: The  
power-managed modes are invoked by user code  
during operation, allowing the user to incorporate  
power-saving ideas into their application’s  
software design.  
Low Consumption in Key Modules: The  
power requirements for both Timer1 and the  
Watchdog Timer are minimized. See  
Section 27.0 “Electrical Characteristics” for  
values.  
Two-Speed Start-up: This option allows the  
internal oscillator to serve as the clock source  
from Power-on Reset, or wake-up from Sleep  
mode, until the primary clock source is available.  
© 2009 Microchip Technology Inc.  
DS39689F-page 9  
PIC18F2221/2321/4221/4321 FAMILY  
1.2  
Other Special Features  
1.3  
Details on Individual Family  
Members  
Memory Endurance: The Enhanced Flash cells  
for both program memory and data EEPROM are  
rated to last for many thousands of erase/write  
cycles – up to 100,000 for program memory and  
1,000,000 for EEPROM. Data retention without  
refresh is conservatively estimated to be greater  
than 40 years.  
Devices in the PIC18F2221/2321/4221/4321 family are  
available in 28-pin and 40/44-pin packages. Block  
diagrams for the two groups are shown in Figure 1-1 and  
Figure 1-2.  
The devices are differentiated from each other in five  
ways:  
Self-Programmability: These devices can write to  
their own program memory spaces under internal  
software control. By using a bootloader routine,  
located in the protected Boot Block at the top of  
program memory, it becomes possible to create an  
application that can update itself in the field.  
1. Flash program memory (4 Kbytes for  
PIC18F2221/4221 devices,  
PIC18F2321/4321).  
8
Kbytes for  
2. A/D channels (10 for 28-pin devices, 13 for  
40/44-pin devices).  
3. I/O ports (3 bidirectional ports on 28-pin devices,  
5 bidirectional ports on 40/44-pin devices).  
Extended Instruction Set: The PIC18F2221/  
2321/4221/4321 family introduces an optional  
extension to the PIC18 instruction set, which adds  
8 new instructions and an Indexed Addressing  
mode. This extension, enabled as a device con-  
figuration option, has been specifically designed  
to optimize re-entrant application code originally  
developed in high-level languages, such as C.  
4. CCP and Enhanced CCP implementation  
(28-pin devices have  
2
standard CCP  
modules, 40/44-pin devices have one standard  
CCP module and one ECCP module).  
5. Parallel Slave Port (present only on 40/44-pin  
devices).  
Enhanced CCP Module: In PWM mode, this  
module provides 1, 2 or 4 modulated outputs for  
controlling half-bridge and full-bridge drivers.  
Other features include auto-shutdown, for  
disabling PWM outputs on interrupt or other select  
conditions and auto-restart, to reactivate outputs  
once the condition has cleared.  
All other features for devices in this family are identical.  
These are summarized in Table 1-1.  
The pinouts for all devices are listed in Table 1-2 and  
Table 1-3.  
Like all Microchip PIC18 devices, members of the  
PIC18F2221/2321/4221/4321 family are available as  
both standard and low-voltage devices. Standard  
devices with Enhanced Flash memory, designated with  
an “F” in the part number (such as PIC18F2321),  
accommodate an operating VDD range of 4.2V to 5.5V.  
Low-voltage parts, designated by “LF” (such as  
PIC18LF2321), function over an extended VDD range  
of 2.0V to 5.5V.  
Enhanced Addressable USART: This serial  
communication module is capable of standard  
RS-232 operation and provides support for the  
LIN/J2602 bus protocol. Other enhancements  
include automatic baud rate detection and a 16-bit  
Baud Rate Generator for improved resolution.  
When the microcontroller is using the internal  
oscillator block, the EUSART provides stable  
operation for applications that talk to the outside  
world without using an external crystal (or its  
accompanying power requirement).  
10-Bit A/D Converter: This module incorporates  
programmable acquisition time, allowing for a  
channel to be selected and a conversion to be  
initiated without waiting for a sampling period and  
thus, reducing code overhead.  
Extended Watchdog Timer (WDT): This  
Enhanced version incorporates a 16-bit prescaler,  
allowing an extended time-out range that is stable  
across operating voltage and temperature. See  
Section 27.0 “Electrical Characteristics” for  
time-out periods.  
DS39689F-page 10  
© 2009 Microchip Technology Inc.  
PIC18F2221/2321/4221/4321 FAMILY  
TABLE 1-1:  
DEVICE FEATURES  
Features  
PIC18F2221  
PIC18F2321  
PIC18F4221  
PIC18F4321  
Operating Frequency  
Program Memory (Bytes)  
Program Memory (Instructions)  
Data Memory (Bytes)  
Data EEPROM Memory (Bytes)  
Interrupt Sources  
DC – 40 MHz  
DC – 40 MHz  
DC – 40 MHz  
DC – 40 MHz  
4096  
2048  
512  
256  
19  
8192  
4096  
512  
256  
19  
4096  
2048  
512  
256  
20  
8192  
4096  
512  
256  
20  
I/O Ports  
Ports A, B, C, (E) Ports A, B, C, (E) Ports A, B, C, D, E Ports A, B, C, D, E  
Timers  
4
2
0
4
2
0
4
1
1
4
1
1
Capture/Compare/PWM Modules  
Enhanced Capture/Compare/  
PWM Modules  
Serial Communications  
MSSP,  
MSSP,  
MSSP,  
MSSP,  
Enhanced USART Enhanced USART Enhanced USART Enhanced USART  
No No Yes Yes  
10 Input Channels 10 Input Channels 13 Input Channels 13 Input Channels  
POR, BOR, POR, BOR, POR, BOR, POR, BOR,  
RESETInstruction, RESETInstruction, RESETInstruction, RESETInstruction,  
Parallel Communications (PSP)  
10-bit Analog-to-Digital Module  
Resets (and Delays)  
Stack Full,  
Stack Underflow  
(PWRT, OST),  
MCLR (optional),  
WDT  
Stack Full,  
Stack Underflow  
(PWRT, OST),  
MCLR (optional),  
WDT  
Stack Full,  
Stack Underflow  
(PWRT, OST),  
MCLR (optional),  
WDT  
Stack Full,  
Stack Underflow  
(PWRT, OST),  
MCLR (optional),  
WDT  
Programmable Low-Voltage  
Detect  
Yes  
Yes  
Yes  
Yes  
Programmable Brown-out Reset  
Instruction Set  
Yes  
Yes  
Yes  
Yes  
75 Instructions;  
83 with Extended 83 with Extended 83 with Extended  
Instruction Set  
enabled  
75 Instructions;  
75 Instructions;  
75 Instructions;  
83 with Extended  
Instruction Set  
enabled  
Instruction Set  
enabled  
Instruction Set  
enabled  
Packages  
28-pin SPDIP  
28-pin SOIC  
28-pin SSOP  
28-pin QFN  
28-pin SPDIP  
28-pin SOIC  
28-pin SSOP  
28-pin QFN  
40-pin PDIP  
44-pin QFN  
44-pin TQFP  
40-pin PDIP  
44-pin QFN  
44-pin TQFP  
© 2009 Microchip Technology Inc.  
DS39689F-page 11  
PIC18F2221/2321/4221/4321 FAMILY  
FIGURE 1-1:  
PIC18F2221/2321 (28-PIN) BLOCK DIAGRAM  
Data Bus<8>  
Table Pointer<21>  
PORTA  
Data Latch  
8
8
inc/dec logic  
21  
RA0/AN0  
RA1/AN1  
Data Memory  
(3.9 Kbytes)  
RA2/AN2/VREF-/CVREF  
RA3/AN3/VREF+  
RA4/T0CKI/C1OUT  
RA5/AN4/SS/HLVDIN/C2OUT  
OSC2/CLKO(3)/RA6  
OSC1/CLKI(3)/RA7  
PCLATU PCLATH  
Address Latch  
20  
PCU PCH PCL  
Program Counter  
12  
Data Address<12>  
31 Level Stack  
STKPTR  
4
BSR  
12  
FSR0  
FSR1  
FSR2  
4
Address Latch  
Access  
Bank  
Program Memory  
(4 Kbytes)  
12  
Data Latch  
PORTB  
RB0/INT0/FLT0/AN12  
RB1/INT1/AN10  
RB2/INT2/AN8  
inc/dec  
logic  
8
Table Latch  
RB3/AN9/CCP2(1)  
RB4/KBI0/AN11  
RB5/KBI1/PGM  
RB6/KBI2/PGC  
RB7/KBI3/PGD  
Address  
Decode  
ROM Latch  
IR  
Instruction Bus <16>  
8
State Machine  
Control Signals  
Instruction  
Decode &  
Control  
PRODH PRODL  
8 x 8 Multiply  
PORTC  
RC0/T1OSO/T13CKI  
RC1/T1OSI/CCP2(1)  
RC2/CCP1  
3
8
W
BITOP  
8
RC3/SCK/SCL  
RC4/SDI/SDA  
8
8
RC5/SDO  
RC6/TX/CK  
RC7/RX/DT  
OSC1(3)  
OSC2(3)  
T1OSI  
Internal  
Oscillator  
Block  
Power-up  
Timer  
8
8
Oscillator  
Start-up Timer  
ALU<8>  
8
INTRC  
Oscillator  
Power-on  
Reset  
8 MHz  
Oscillator  
Watchdog  
Timer  
T1OSO  
Precision  
Band Gap  
Reference  
Brown-out  
Reset  
Fail-Safe  
MCLR(2)  
VDD, VSS  
Single-Supply  
Programming  
PORTE  
In-Circuit  
Debugger  
Clock Monitor  
MCLR/VPP/RE3(2)  
Data  
EEPROM  
BOR  
LVD  
Timer0  
Timer1  
MSSP  
Timer2  
Timer3  
ADC  
10-Bit  
Comparator  
CCP1  
CCP2  
EUSART  
Note 1: CCP2 is multiplexed with RC1 when Configuration bit, CCP2MX, is set, or RB3 when CCP2MX is not set.  
2: RE3 is only available when MCLR functionality is disabled.  
3: OSC1/CLKI and OSC2/CLKO are only available in select oscillator modes and when these pins are not being used as digital I/O.  
Refer to Section 3.0 “Oscillator Configurations” for additional information.  
DS39689F-page 12  
© 2009 Microchip Technology Inc.  
PIC18F2221/2321/4221/4321 FAMILY  
FIGURE 1-2:  
PIC18F4221/4321 (40/44-PIN) BLOCK DIAGRAM  
Data Bus<8>  
PORTA  
Table Pointer<21>  
RA0/AN0  
RA1/AN1  
Data Latch  
8
8
inc/dec logic  
21  
RA2/AN2/VREF-/CVREF  
RA3/AN3/VREF+  
RA4/T0CKI/C1OUT  
RA5/AN4/SS/HLVDIN/C2OUT  
OSC2/CLKO(3)/RA6  
OSC1/CLKI(3)/RA7  
Data Memory  
(3.9 Kbytes)  
PCLATU PCLATH  
Address Latch  
20  
PCU PCH PCL  
Program Counter  
12  
Data Address<12>  
PORTB  
31 Level Stack  
STKPTR  
RB0/INT0/FLT0/AN12  
RB1/INT1/AN10  
RB2/INT2/AN8  
4
BSR  
12  
FSR0  
FSR1  
FSR2  
4
Address Latch  
Access  
Bank  
Program Memory  
(8 Kbytes)  
RB3/AN9/CCP2(1)  
RB4/KBI0/AN11  
RB5/KBI1/PGM  
RB6/KBI2/PGC  
RB7/KBI3/PGD  
12  
Data Latch  
inc/dec  
logic  
8
Table Latch  
Address  
Decode  
PORTC  
ROM Latch  
IR  
RC0/T1OSO/T13CKI  
RC1/T1OSI/CCP2(1)  
RC2/CCP1/P1A  
Instruction Bus <16>  
RC3/SCK/SCL  
RC4/SDI/SDA  
RC5/SDO  
RC6/TX/CK  
RC7/RX/DT  
8
State Machine  
Control Signals  
Instruction  
Decode &  
Control  
PRODH PRODL  
8 x 8 Multiply  
PORTD  
3
8
RD0/PSP0:RD4/PSP4  
RD5/PSP5/P1B  
RD6/PSP6/P1C  
W
BITOP  
8
8
8
RD7/PSP7/P1D  
OSC1(3)  
OSC2(3)  
T1OSI  
Internal  
Oscillator  
Block  
Power-up  
Timer  
8
8
Oscillator  
Start-up Timer  
ALU<8>  
8
INTRC  
Oscillator  
Power-on  
Reset  
8 MHz  
Oscillator  
Watchdog  
Timer  
T1OSO  
PORTE  
RE0/RD/AN5  
RE1/WR/AN6  
RE2/CS/AN7  
Precision  
Band Gap  
Reference  
Brown-out  
Reset  
Fail-Safe  
MCLR(2)  
VDD, VSS  
Single-Supply  
Programming  
In-Circuit  
Debugger  
MCLR/VPP/RE3(2)  
Clock Monitor  
Data  
EEPROM  
BOR  
LVD  
Timer0  
Timer1  
MSSP  
Timer2  
Timer3  
ADC  
10-Bit  
Comparator  
ECCP1  
CCP2  
EUSART  
Note 1: CCP2 is multiplexed with RC1 when Configuration bit, CCP2MX, is set, or RB3 when CCP2MX is not set.  
2: RE3 is only available when MCLR functionality is disabled.  
3: OSC1/CLKI and OSC2/CLKO are only available in select oscillator modes and when these pins are not being used as digital I/O.  
Refer to Section 3.0 “Oscillator Configurations” for additional information.  
© 2009 Microchip Technology Inc.  
DS39689F-page 13  
PIC18F2221/2321/4221/4321 FAMILY  
TABLE 1-2:  
PIC18F2221/2321 PINOUT I/O DESCRIPTIONS  
Pin Number  
Pin Buffer  
SPDIP,  
SOIC, QFN  
Pin Name  
Description  
Type Type  
SSOP  
MCLR/VPP/RE3  
MCLR  
1
9
26  
6
Master Clear (input) or programming voltage (input).  
Master Clear (Reset) input. This pin is an active-low  
Reset to the device.  
I
ST  
ST  
VPP  
RE3  
P
I
Programming voltage input.  
Digital input.  
OSC1/CLKI/RA7  
OSC1  
Oscillator crystal or external clock input.  
Oscillator crystal input or external clock source input.  
ST buffer when configured in RC mode; CMOS otherwise.  
External clock source input. Always associated with  
pin function OSC1. (See related OSC1/CLKI,  
OSC2/CLKO pins.)  
I
I
Analog  
CMOS  
CLKI  
RA7  
I/O  
TTL  
General purpose I/O pin.  
OSC2/CLKO/RA6  
OSC2  
10  
7
Oscillator crystal or clock output.  
O
O
Oscillator crystal output. Connects to crystal or resonator  
in Crystal Oscillator mode.  
In RC, EC and INTIO modes, OSC2 pin outputs CLKO  
which has one-fourth the frequency of OSC1 and denotes  
the instruction cycle rate.  
CLKO  
RA6  
I/O  
TTL  
General purpose I/O pin.  
Legend: TTL = TTL compatible input  
CMOS = CMOS compatible input or output  
ST = Schmitt Trigger input with CMOS levels  
I
O
= Input  
= Output  
P = Power  
I2C = ST with I2C™ or SMB levels  
Note 1: Default assignment for CCP2 when Configuration bit, CCP2MX, is set.  
2: Alternate assignment for CCP2 when Configuration bit, CCP2MX, is cleared.  
DS39689F-page 14  
© 2009 Microchip Technology Inc.  
PIC18F2221/2321/4221/4321 FAMILY  
TABLE 1-2:  
PIC18F2221/2321 PINOUT I/O DESCRIPTIONS (CONTINUED)  
Pin Number  
Pin Buffer  
Type Type  
SPDIP,  
SOIC, QFN  
SSOP  
Pin Name  
Description  
PORTA is a bidirectional I/O port.  
RA0/AN0  
RA0  
2
3
4
27  
28  
1
I/O  
I
TTL  
Analog  
Digital I/O.  
Analog Input 0.  
AN0  
RA1/AN1  
RA1  
I/O  
I
TTL  
Analog  
Digital I/O.  
Analog Input 1.  
AN1  
RA2/AN2/VREF-/CVREF  
RA2  
I/O  
TTL  
Digital I/O.  
AN2  
VREF-  
CVREF  
I
I
O
Analog  
Analog  
Analog  
Analog Input 2.  
A/D reference voltage (low) input.  
Comparator reference voltage output.  
RA3/AN3/VREF+  
RA3  
5
6
7
2
3
4
I/O  
I
I
TTL  
Analog  
Analog  
Digital I/O.  
Analog Input 3.  
A/D reference voltage (high) input.  
AN3  
VREF+  
RA4/T0CKI/C1OUT  
RA4  
I/O  
I
O
ST  
ST  
Digital I/O. Open-collector output.  
Timer0 external clock input.  
Comparator 1 output.  
T0CKI  
C1OUT  
RA5/AN4/SS/HLVDIN/  
C2OUT  
RA5  
I/O  
I
I
I
O
TTL  
Analog  
TTL  
Analog  
Digital I/O.  
Analog Input 4.  
SPI slave select input.  
High/Low-Voltage Detect input.  
Comparator 2 output.  
AN4  
SS  
HLVDIN  
C2OUT  
RA6  
RA7  
See the OSC2/CLKO/RA6 pin.  
See the OSC1/CLKI/RA7 pin.  
Legend: TTL = TTL compatible input  
CMOS = CMOS compatible input or output  
ST = Schmitt Trigger input with CMOS levels  
I
O
= Input  
= Output  
P = Power  
I2C = ST with I2C™ or SMB levels  
Note 1: Default assignment for CCP2 when Configuration bit, CCP2MX, is set.  
2: Alternate assignment for CCP2 when Configuration bit, CCP2MX, is cleared.  
© 2009 Microchip Technology Inc.  
DS39689F-page 15  
PIC18F2221/2321/4221/4321 FAMILY  
TABLE 1-2:  
PIC18F2221/2321 PINOUT I/O DESCRIPTIONS (CONTINUED)  
Pin Number  
Pin Buffer  
Type Type  
SPDIP,  
SOIC, QFN  
SSOP  
Pin Name  
Description  
PORTB is a bidirectional I/O port. PORTB can be software  
programmed for internal weak pull-ups on all inputs.  
RB0/INT0/FLT0/AN12  
21  
18  
RB0  
I/O  
TTL  
ST  
ST  
Digital I/O.  
INT0  
FLT0  
AN12  
I
I
I
External Interrupt 0.  
PWM Fault input for CCP1.  
Analog Input 12.  
Analog  
RB1/INT1/AN10  
RB1  
22  
23  
24  
25  
26  
27  
28  
19  
20  
21  
22  
23  
24  
25  
I/O  
I
I
TTL  
ST  
Analog  
Digital I/O.  
External Interrupt 1.  
Analog Input 10.  
INT1  
AN10  
RB2/INT2/AN8  
RB2  
I/O  
I
I
TTL  
ST  
Analog  
Digital I/O.  
External Interrupt 2.  
Analog Input 8.  
INT2  
AN8  
RB3/AN9/CCP2  
RB3  
I/O  
I
I/O  
TTL  
Analog  
ST  
Digital I/O.  
Analog Input 9.  
Capture 2 input/Compare 2 output/PWM2 output.  
AN9  
CCP2(2)  
RB4/KBI0/AN11  
RB4  
I/O  
I
I
TTL  
TTL  
Analog  
Digital I/O.  
Interrupt-on-change pin.  
Analog Input 11.  
KBI0  
AN11  
RB5/KBI1/PGM  
RB5  
I/O  
I
I/O  
TTL  
TTL  
ST  
Digital I/O.  
Interrupt-on-change pin.  
Low-Voltage ICSP™ programming enable pin.  
KBI1  
PGM  
RB6/KBI2/PGC  
RB6  
I/O  
I
I/O  
TTL  
TTL  
ST  
Digital I/O.  
Interrupt-on-change pin.  
In-circuit debugger and ICSP programming clock pin.  
KBI2  
PGC  
RB7/KBI3/PGD  
RB7  
I/O  
I
I/O  
TTL  
TTL  
ST  
Digital I/O.  
Interrupt-on-change pin.  
In-circuit debugger and ICSP programming data pin.  
KBI3  
PGD  
Legend: TTL = TTL compatible input  
CMOS = CMOS compatible input or output  
ST = Schmitt Trigger input with CMOS levels  
I
O
= Input  
= Output  
P = Power  
I2C = ST with I2C™ or SMB levels  
Note 1: Default assignment for CCP2 when Configuration bit, CCP2MX, is set.  
2: Alternate assignment for CCP2 when Configuration bit, CCP2MX, is cleared.  
DS39689F-page 16  
© 2009 Microchip Technology Inc.  
PIC18F2221/2321/4221/4321 FAMILY  
TABLE 1-2:  
PIC18F2221/2321 PINOUT I/O DESCRIPTIONS (CONTINUED)  
Pin Number  
Pin Buffer  
Type Type  
SPDIP,  
SOIC, QFN  
SSOP  
Pin Name  
Description  
PORTC is a bidirectional I/O port.  
RC0/T1OSO/T13CKI  
RC0  
11  
12  
8
9
I/O  
O
I
ST  
ST  
Digital I/O.  
Timer1 oscillator analog output.  
Timer1/Timer3 external clock input.  
T1OSO  
T13CKI  
RC1/T1OSI/CCP2  
RC1  
I/O  
I
I/O  
ST  
Analog  
ST  
Digital I/O.  
T1OSI  
Timer1 oscillator analog input.  
Capture 2 input/Compare 2 output/PWM2 output.  
CCP2(1)  
RC2/CCP1  
RC2  
13  
14  
10  
11  
I/O  
I/O  
ST  
ST  
Digital I/O.  
CCP1  
Capture 1 input/Compare 1 output/PWM1 output.  
RC3/SCK/SCL  
RC3  
I/O  
I/O  
I/O  
ST  
ST  
I2C  
Digital I/O.  
SCK  
SCL  
Synchronous serial clock input/output for SPI mode.  
Synchronous serial clock input/output for I2C™ mode.  
RC4/SDI/SDA  
RC4  
15  
12  
I/O  
I
I/O  
ST  
ST  
I2C  
Digital I/O.  
SDI  
SDA  
SPI data in.  
I2C data I/O.  
RC5/SDO  
RC5  
16  
17  
13  
14  
I/O  
O
ST  
Digital I/O.  
SPI data out.  
SDO  
RC6/TX/CK  
RC6  
I/O  
O
I/O  
ST  
ST  
Digital I/O.  
TX  
CK  
EUSART asynchronous transmit.  
EUSART synchronous clock (see related RX/DT).  
RC7/RX/DT  
RC7  
18  
15  
I/O  
I
I/O  
ST  
ST  
ST  
Digital I/O.  
RX  
DT  
EUSART asynchronous receive.  
EUSART synchronous data (see related TX/CK).  
RE3  
VSS  
VDD  
P
See MCLR/VPP/RE3 pin.  
8, 19 5, 16  
20 17  
Ground reference for logic and I/O pins.  
Positive supply for logic and I/O pins.  
CMOS = CMOS compatible input or output  
P
Legend: TTL = TTL compatible input  
ST = Schmitt Trigger input with CMOS levels  
I
O
= Input  
= Output  
P = Power  
I2C = ST with I2C™ or SMB levels  
Note 1: Default assignment for CCP2 when Configuration bit, CCP2MX, is set.  
2: Alternate assignment for CCP2 when Configuration bit, CCP2MX, is cleared.  
© 2009 Microchip Technology Inc.  
DS39689F-page 17  
PIC18F2221/2321/4221/4321 FAMILY  
TABLE 1-3:  
Pin Name  
PIC18F4221/4321 PINOUT I/O DESCRIPTIONS  
Pin Number  
Pin Buffer  
Description  
Type Type  
PDIP QFN TQFP  
MCLR/VPP/RE3  
MCLR  
1
18  
32  
18  
30  
Master Clear (input) or programming voltage (input).  
Master Clear (Reset) input. This pin is an active-low  
Reset to the device.  
I
ST  
VPP  
RE3  
P
I
Programming voltage input.  
Digital input.  
ST  
OSC1/CLKI/RA7  
OSC1  
13  
Oscillator crystal or external clock input.  
Oscillator crystal input or external clock source input.  
ST buffer when configured in RC mode;  
analog otherwise.  
I
I
Analog  
CLKI  
Analog  
TTL  
External clock source input. Always associated with  
pin function OSC1. (See related OSC1/CLKI,  
OSC2/CLKO pins.)  
RA7  
I/O  
General purpose I/O pin.  
OSC2/CLKO/RA6  
OSC2  
14  
33  
31  
Oscillator crystal or clock output.  
O
O
Oscillator crystal output. Connects to crystal  
or resonator in Crystal Oscillator mode.  
In RC, EC and INTIO modes, OSC2 pin outputs  
CLKO which has one-fourth the frequency of OSC1  
and denotes the instruction cycle rate.  
General purpose I/O pin.  
CLKO  
RA6  
I/O  
TTL  
Legend: TTL = TTL compatible input  
CMOS = CMOS compatible input or output  
ST = Schmitt Trigger input with CMOS levels  
I
O
= Input  
= Output  
P = Power  
I2C = ST with I2C™ or SMB levels  
Note 1: Default assignment for CCP2 when Configuration bit, CCP2MX, is set.  
2: Alternate assignment for CCP2 when Configuration bit, CCP2MX, is cleared.  
DS39689F-page 18  
© 2009 Microchip Technology Inc.  
PIC18F2221/2321/4221/4321 FAMILY  
TABLE 1-3:  
Pin Name  
PIC18F4221/4321 PINOUT I/O DESCRIPTIONS (CONTINUED)  
Pin Number  
Pin Buffer  
Description  
Type Type  
PDIP QFN TQFP  
PORTA is a bidirectional I/O port.  
RA0/AN0  
RA0  
2
3
4
19  
20  
21  
19  
20  
21  
I/O  
I
TTL  
Analog  
Digital I/O.  
Analog Input 0.  
AN0  
RA1/AN1  
RA1  
I/O  
I
TTL  
Analog  
Digital I/O.  
Analog Input 1.  
AN1  
RA2/AN2/VREF-/CVREF  
RA2  
I/O  
TTL  
Digital I/O.  
AN2  
VREF-  
CVREF  
I
I
O
Analog  
Analog  
Analog  
Analog Input 2.  
A/D reference voltage (low) input.  
Comparator reference voltage output.  
RA3/AN3/VREF+  
RA3  
5
6
7
22  
23  
24  
22  
23  
24  
I/O  
I
I
TTL  
Analog  
Analog  
Digital I/O.  
Analog Input 3.  
A/D reference voltage (high) input.  
AN3  
VREF+  
RA4/T0CKI/C1OUT  
RA4  
I/O  
I
O
ST  
ST  
Digital I/O.  
Timer0 external clock input.  
Comparator 1 output.  
T0CKI  
C1OUT  
RA5/AN4/SS/HLVDIN/  
C2OUT  
RA5  
I/O  
I
I
I
O
TTL  
Analog  
TTL  
Analog  
Digital I/O.  
Analog Input 4.  
SPI slave select input.  
High/Low-Voltage Detect input.  
Comparator 2 output.  
AN4  
SS  
HLVDIN  
C2OUT  
RA6  
RA7  
See the OSC2/CLKO/RA6 pin.  
See the OSC1/CLKI/RA7 pin.  
Legend: TTL = TTL compatible input  
CMOS = CMOS compatible input or output  
ST = Schmitt Trigger input with CMOS levels  
I
O
= Input  
= Output  
P = Power  
I2C = ST with I2C™ or SMB levels  
Note 1: Default assignment for CCP2 when Configuration bit, CCP2MX, is set.  
2: Alternate assignment for CCP2 when Configuration bit, CCP2MX, is cleared.  
© 2009 Microchip Technology Inc.  
DS39689F-page 19  
PIC18F2221/2321/4221/4321 FAMILY  
TABLE 1-3:  
Pin Name  
PIC18F4221/4321 PINOUT I/O DESCRIPTIONS (CONTINUED)  
Pin Number  
Pin Buffer  
Description  
Type Type  
PDIP QFN TQFP  
PORTB is a bidirectional I/O port. PORTB can be  
software programmed for internal weak pull-ups on all  
inputs.  
RB0/INT0/FLT0/AN12  
33  
9
8
RB0  
I/O  
TTL  
ST  
ST  
Digital I/O.  
INT0  
FLT0  
AN12  
I
I
I
External Interrupt 0.  
PWM Fault input for Enhanced CCP1.  
Analog input 12.  
Analog  
RB1/INT1/AN10  
RB1  
34  
35  
36  
37  
38  
39  
10  
11  
12  
14  
15  
16  
9
I/O  
I
I
TTL  
ST  
Analog  
Digital I/O.  
External Interrupt 1.  
Analog Input 10.  
INT1  
AN10  
RB2/INT2/AN8  
RB2  
10  
11  
14  
15  
16  
I/O  
I
I
TTL  
ST  
Analog  
Digital I/O.  
External Interrupt 2.  
Analog Input 8.  
INT2  
AN8  
RB3/AN9/CCP2  
RB3  
I/O  
I
I/O  
TTL  
Analog  
ST  
Digital I/O.  
Analog Input 9.  
Capture 2 input/Compare 2 output/PWM2 output.  
AN9  
CCP2(2)  
RB4/KBI0/AN11  
RB4  
I/O  
I
I
TTL  
TTL  
Analog  
Digital I/O.  
Interrupt-on-change pin.  
Analog input 11.  
KBI0  
AN11  
RB5/KBI1/PGM  
RB5  
I/O  
I
I/O  
TTL  
TTL  
ST  
Digital I/O.  
Interrupt-on-change pin.  
Low-Voltage ICSP™ Programming enable pin.  
KBI1  
PGM  
RB6/KBI2/PGC  
RB6  
I/O  
I
I/O  
TTL  
TTL  
ST  
Digital I/O.  
KBI2  
PGC  
Interrupt-on-change pin.  
In-circuit debugger and ICSP programming  
clock pin.  
RB7/KBI3/PGD  
RB7  
40  
17  
17  
I/O  
I
I/O  
TTL  
TTL  
ST  
Digital I/O.  
KBI3  
PGD  
Interrupt-on-change pin.  
In-circuit debugger and ICSP programming  
data pin.  
Legend: TTL = TTL compatible input  
CMOS = CMOS compatible input or output  
ST = Schmitt Trigger input with CMOS levels  
I
O
= Input  
= Output  
P = Power  
I2C = ST with I2C™ or SMB levels  
Note 1: Default assignment for CCP2 when Configuration bit, CCP2MX, is set.  
2: Alternate assignment for CCP2 when Configuration bit, CCP2MX, is cleared.  
DS39689F-page 20  
© 2009 Microchip Technology Inc.  
PIC18F2221/2321/4221/4321 FAMILY  
TABLE 1-3:  
Pin Name  
PIC18F4221/4321 PINOUT I/O DESCRIPTIONS (CONTINUED)  
Pin Number  
Pin Buffer  
Description  
Type Type  
PDIP QFN TQFP  
PORTC is a bidirectional I/O port.  
RC0/T1OSO/T13CKI  
RC0  
15  
16  
17  
18  
34  
35  
36  
37  
32  
35  
36  
37  
I/O  
O
I
ST  
ST  
Digital I/O.  
Timer1 oscillator analog output.  
Timer1/Timer3 external clock input.  
T1OSO  
T13CKI  
RC1/T1OSI/CCP2  
RC1  
I/O  
I
I/O  
ST  
CMOS  
ST  
Digital I/O.  
T1OSI  
Timer1 oscillator analog input.  
Capture 2 input/Compare 2 output/PWM2 output.  
CCP2(1)  
RC2/CCP1/P1A  
RC2  
I/O  
I/O  
O
ST  
ST  
Digital I/O.  
CCP1  
P1A  
Capture 1 input/Compare 1 output/PWM1 output.  
Enhanced CCP1 output.  
RC3/SCK/SCL  
RC3  
I/O  
I/O  
ST  
ST  
Digital I/O.  
Synchronous serial clock input/output for  
SCK  
SPI mode.  
SCL  
I/O  
I2C  
Synchronous serial clock input/output for I2C™  
mode.  
RC4/SDI/SDA  
RC4  
23  
42  
42  
I/O  
I
I/O  
ST  
ST  
I2C  
Digital I/O.  
SPI data in.  
I2C data I/O.  
SDI  
SDA  
RC5/SDO  
RC5  
24  
25  
43  
44  
43  
44  
I/O  
O
ST  
Digital I/O.  
SPI data out.  
SDO  
RC6/TX/CK  
RC6  
I/O  
O
I/O  
ST  
ST  
Digital I/O.  
TX  
CK  
EUSART asynchronous transmit.  
EUSART synchronous clock (see related RX/DT).  
RC7/RX/DT  
RC7  
26  
1
1
I/O  
I
I/O  
ST  
ST  
ST  
Digital I/O.  
RX  
DT  
EUSART asynchronous receive.  
EUSART synchronous data (see related TX/CK).  
Legend: TTL = TTL compatible input  
CMOS = CMOS compatible input or output  
ST = Schmitt Trigger input with CMOS levels  
I
O
= Input  
= Output  
P = Power  
I2C = ST with I2C™ or SMB levels  
Note 1: Default assignment for CCP2 when Configuration bit, CCP2MX, is set.  
2: Alternate assignment for CCP2 when Configuration bit, CCP2MX, is cleared.  
© 2009 Microchip Technology Inc.  
DS39689F-page 21  
PIC18F2221/2321/4221/4321 FAMILY  
TABLE 1-3:  
Pin Name  
PIC18F4221/4321 PINOUT I/O DESCRIPTIONS (CONTINUED)  
Pin Number  
Pin Buffer  
Description  
Type Type  
PDIP QFN TQFP  
PORTD is a bidirectional I/O port or a Parallel Slave  
Port (PSP) for interfacing to a microprocessor port.  
These pins have TTL input buffers when the PSP  
module is enabled.  
RD0/PSP0  
RD0  
19  
20  
21  
22  
27  
28  
38  
39  
40  
41  
2
38  
39  
40  
41  
2
I/O  
I/O  
ST  
TTL  
Digital I/O.  
Parallel Slave Port data.  
PSP0  
RD1/PSP1  
RD1  
I/O  
I/O  
ST  
TTL  
Digital I/O.  
Parallel Slave Port data.  
PSP1  
RD2/PSP2  
RD2  
I/O  
I/O  
ST  
TTL  
Digital I/O.  
Parallel Slave Port data.  
PSP2  
RD3/PSP3  
RD3  
I/O  
I/O  
ST  
TTL  
Digital I/O.  
Parallel Slave Port data.  
PSP3  
RD4/PSP4  
RD4  
I/O  
I/O  
ST  
TTL  
Digital I/O.  
Parallel Slave Port data.  
PSP4  
RD5/PSP5/P1B  
RD5  
3
3
I/O  
I/O  
O
ST  
TTL  
Digital I/O.  
Parallel Slave Port data.  
Enhanced CCP1 output.  
PSP5  
P1B  
RD6/PSP6/P1C  
RD6  
29  
30  
4
5
4
5
I/O  
I/O  
O
ST  
TTL  
Digital I/O.  
Parallel Slave Port data.  
Enhanced CCP1 output.  
PSP6  
P1C  
RD7/PSP7/P1D  
RD7  
I/O  
I/O  
O
ST  
TTL  
Digital I/O.  
Parallel Slave Port data.  
Enhanced CCP1 output.  
PSP7  
P1D  
Legend: TTL = TTL compatible input  
CMOS = CMOS compatible input or output  
ST = Schmitt Trigger input with CMOS levels  
I
O
= Input  
= Output  
P = Power  
I2C = ST with I2C™ or SMB levels  
Note 1: Default assignment for CCP2 when Configuration bit, CCP2MX, is set.  
2: Alternate assignment for CCP2 when Configuration bit, CCP2MX, is cleared.  
DS39689F-page 22  
© 2009 Microchip Technology Inc.  
PIC18F2221/2321/4221/4321 FAMILY  
TABLE 1-3:  
Pin Name  
PIC18F4221/4321 PINOUT I/O DESCRIPTIONS (CONTINUED)  
Pin Number  
Pin Buffer  
Description  
Type Type  
PDIP QFN TQFP  
PORTE is a bidirectional I/O port.  
RE0/RD/AN5  
RE0  
8
9
25  
26  
27  
25  
26  
27  
I/O  
I
ST  
TTL  
Digital I/O.  
RD  
Read control for Parallel Slave Port  
(see also WR and CS pins).  
Analog Input 5.  
AN5  
I
Analog  
RE1/WR/AN6  
RE1  
I/O  
I
ST  
TTL  
Digital I/O.  
WR  
Write control for Parallel Slave Port  
(see CS and RD pins).  
Analog Input 6.  
AN6  
I
Analog  
RE2/CS/AN7  
RE2  
10  
I/O  
I
ST  
TTL  
Digital I/O.  
CS  
Chip Select control for Parallel Slave Port  
(see related RD and WR).  
Analog Input 7.  
AN7  
RE3  
I
Analog  
P
See MCLR/VPP/RE3 pin.  
VSS  
12, 31 6, 30, 6, 29  
31  
Ground reference for logic and I/O pins.  
VDD  
NC  
11, 32 7, 8, 7, 28  
28, 29  
P
Positive supply for logic and I/O pins.  
No Connect.  
13 12,13,  
33, 34  
Legend: TTL = TTL compatible input  
CMOS = CMOS compatible input or output  
ST = Schmitt Trigger input with CMOS levels  
I
O
= Input  
= Output  
P = Power  
I2C = ST with I2C™ or SMB levels  
Note 1: Default assignment for CCP2 when Configuration bit, CCP2MX, is set.  
2: Alternate assignment for CCP2 when Configuration bit, CCP2MX, is cleared.  
© 2009 Microchip Technology Inc.  
DS39689F-page 23  
PIC18F2221/2321/4221/4321 FAMILY  
NOTES:  
DS39689F-page 24  
© 2009 Microchip Technology Inc.  
PIC18F2221/2321/4221/4321 FAMILY  
FIGURE 2-1:  
RECOMMENDED  
MINIMUM CONNECTIONS  
2.0  
2.1  
GUIDELINES FOR GETTING  
STARTED WITH PIC18F  
MICROCONTROLLERS  
(1)  
C2  
VDD  
Basic Connection Requirements  
Getting started with the PIC18F2221/2321/4221/4321  
family family of 8-bit microcontrollers requires attention  
to a minimal set of device pin connections before  
proceeding with development.  
R1  
R2  
MCLR  
VDD  
C1  
(1)  
The following pins must always be connected:  
PIC18FXXXX  
C3  
VSS  
• All VDD and VSS pins  
VSS  
VDD  
(see Section 2.2 “Power Supply Pins”)  
(1)  
C6  
• All AVDD and AVSS pins, regardless of whether or  
not the analog device features are used  
(see Section 2.2 “Power Supply Pins”)  
• MCLR pin  
(see Section 2.3 “Master Clear (MCLR) Pin”)  
(1)  
(1)  
C4  
C5  
These pins must also be connected if they are being  
used in the end application:  
Key (all values are recommendations):  
C1 through C6: 0.1 μF, 20V ceramic  
C7: 10 μF, 16V tantalum or ceramic  
R1: 10 k  
• PGC/PGD pins used for In-Circuit Serial  
Programming™ (ICSP™) and debugging purposes  
(see Section 2.4 “ICSP Pins”)  
• OSCI and OSCO pins when an external oscillator  
source is used  
(see Section 2.5 “External Oscillator Pins”)  
R2: 100to 470Ω  
Note 1: The example shown is for a PIC18F device  
with five VDD/VSS and AVDD/AVSS pairs.  
Other devices may have more or less pairs;  
adjust the number of decoupling capacitors  
appropriately.  
Additionally, the following pins may be required:  
• VREF+/VREF- pins used when external voltage  
reference for analog modules is implemented  
Note:  
The AVDD and AVSS pins must always be  
connected, regardless of whether any of  
the analog modules are being used.  
The minimum mandatory connections are shown in  
Figure 2-1.  
© 2009 Microchip Technology Inc.  
DS39689F-page 25  
PIC18F2221/2321/4221/4321 FAMILY  
2.2  
Power Supply Pins  
2.3  
Master Clear (MCLR) Pin  
The MCLR pin provides two specific device  
functions: device Reset, and device programming  
and debugging. If programming and debugging are  
2.2.1  
DECOUPLING CAPACITORS  
The use of decoupling capacitors on every pair of  
power supply pins, such as VDD, VSS, AVDD and  
AVSS, is required.  
not required in the end application,  
a
direct  
connection to VDD may be all that is required. The  
addition of other components, to help increase the  
application’s resistance to spurious Resets from  
Consider the following criteria when using decoupling  
capacitors:  
voltage sags, may be beneficial.  
A
typical  
Value and type of capacitor: A 0.1 μF (100 nF),  
10-20V capacitor is recommended. The capacitor  
should be a low-ESR device with a resonance  
frequency in the range of 200 MHz and higher.  
Ceramic capacitors are recommended.  
configuration is shown in Figure 2-1. Other circuit  
designs may be implemented depending on the  
application’s requirements.  
During programming and debugging, the resistance  
and capacitance that can be added to the pin must  
be considered. Device programmers and debuggers  
drive the MCLR pin. Consequently, specific voltage  
levels (VIH and VIL) and fast signal transitions must  
not be adversely affected. Therefore, specific values  
of R1 and C1 will need to be adjusted based on the  
application and PCB requirements. For example, it is  
recommended that the capacitor, C1, be isolated  
from the MCLR pin during programming and  
debugging operations by using a jumper (Figure 2-2).  
The jumper is replaced for normal run-time  
operations.  
Placement on the printed circuit board: The  
decoupling capacitors should be placed as close  
to the pins as possible. It is recommended to  
place the capacitors on the same side of the  
board as the device. If space is constricted, the  
capacitor can be placed on another layer on the  
PCB using a via; however, ensure that the trace  
length from the pin to the capacitor is no greater  
than 0.25 inch (6 mm).  
Handling high-frequency noise: If the board is  
experiencing high-frequency noise (upward of  
tens of MHz), add a second ceramic type capaci-  
tor in parallel to the above described decoupling  
capacitor. The value of the second capacitor can  
be in the range of 0.01 μF to 0.001 μF. Place this  
second capacitor next to each primary decoupling  
capacitor. In high-speed circuit designs, consider  
implementing a decade pair of capacitances as  
close to the power and ground pins as possible  
(e.g., 0.1 μF in parallel with 0.001 μF).  
Any components associated with the MCLR pin  
should be placed within 0.25 inch (6 mm) of the pin.  
FIGURE 2-2:  
EXAMPLE OF MCLR PIN  
CONNECTIONS  
VDD  
Maximizing performance: On the board layout  
from the power supply circuit, run the power and  
return traces to the decoupling capacitors first,  
and then to the device pins. This ensures that the  
decoupling capacitors are first in the power chain.  
Equally important is to keep the trace length  
between the capacitor and the power pins to  
a minimum, thereby reducing PCB trace  
inductance.  
R1  
R2  
MCLR  
PIC18FXXXX  
JP  
C1  
Note 1: R1 10 kΩ is recommended. A suggested  
starting value is 10 kΩ. Ensure that the  
MCLR pin VIH and VIL specifications are met.  
2.2.2  
TANK CAPACITORS  
On boards with power traces running longer than six  
inches in length, it is suggested to use a tank capacitor  
for integrated circuits including microcontrollers to  
supply a local power source. The value of the tank  
capacitor should be determined based on the trace  
resistance that connects the power supply source to  
the device and the maximum current drawn by the  
device in the application. In other words, select the tank  
capacitor so that it meets the acceptable voltage sag at  
the device. Typical values range from 4.7 μF to 47 μF.  
2: R2 470Ω will limit any current flowing into  
MCLR from the external capacitor, C, in the  
event of MCLR pin breakdown, due to  
Electrostatic Discharge (ESD) or Electrical  
Overstress (EOS). Ensure that the MCLR pin  
VIH and VIL specifications are met.  
DS39689F-page 26  
© 2009 Microchip Technology Inc.  
PIC18F2221/2321/4221/4321 FAMILY  
Use a grounded copper pour around the oscillator  
circuit to isolate it from surrounding circuits. The  
2.4  
ICSP Pins  
The PGC and PGD pins are used for In-Circuit Serial  
Programming (ICSP) and debugging purposes. It is  
recommended to keep the trace length between the  
ICSP connector and the ICSP pins on the device as  
short as possible. If the ICSP connector is expected to  
experience an ESD event, a series resistor is recom-  
mended, with the value in the range of a few tens of  
ohms, not to exceed 100.  
grounded copper pour should be routed directly to the  
MCU ground. Do not run any signal traces or power  
traces inside the ground pour. Also, if using a  
two-sided board, avoid any traces on the other side of  
the board where the crystal is placed. A suggested  
layout is shown in Figure 2-3.  
For additional information and design guidance on  
oscillator circuits, please refer to these Microchip  
Application Notes, available at the corporate web site  
(www.microchip.com):  
Pull-up resistors, series diodes and capacitors on the  
PGC and PGD pins are not recommended as they will  
interfere with the programmer/debugger com-  
munications to the device. If such discrete components  
are an application requirement, they should be removed  
from the circuit during programming and debugging.  
Alternatively, refer to the AC/DC characteristics and  
timing requirements information in the respective device  
Flash programming specification for information on  
capacitive loading limits and pin input voltage high (VIH)  
and input low (VIL) requirements.  
AN826, Crystal Oscillator Basics and Crystal  
Selection for rfPIC™ and PICmicro® Devices”  
• AN849, “Basic PICmicro® Oscillator Design”  
• AN943, “Practical PICmicro® Oscillator Analysis  
and Design”  
• AN949, “Making Your Oscillator Work”  
FIGURE 2-3:  
SUGGESTED PLACEMENT  
OF THE OSCILLATOR  
CIRCUIT  
For device emulation, ensure that the “Communication  
Channel Select” (i.e., PGC/PGD pins) programmed  
into the device matches the physical connections for  
the ICSP to the MPLAB® ICD 2, MPLAB ICD 3 or REAL  
ICE™ emulator.  
Main Oscillator  
Guard Ring  
13  
14  
15  
16  
17  
18  
For more information on the ICD 2, ICD 3 and REAL  
ICE emulator connection requirements, refer to the  
following documents that are available on the  
Microchip web site.  
“MPLAB® ICD 2 In-Circuit Debugger User’s  
Guide” (DS51331)  
“Using MPLAB® ICD 2” (poster) (DS51265)  
“MPLAB® ICD 2 Design Advisory” (DS51566)  
“Using MPLAB® ICD 3” (poster) (DS51765)  
“MPLAB® ICD 3 Design Advisory” (DS51764)  
Guard Trace  
Secondary  
Oscillator  
19  
20  
“MPLAB® REAL ICE™ In-Circuit Emulator User’s  
Guide” (DS51616)  
2.6  
Unused I/Os  
“Using MPLAB® REAL ICE™ In-Circuit Emulator”  
(poster) (DS51749)  
Unused I/O pins should be configured as outputs and  
driven to a logic low state. Alternatively, connect a 1 kΩ  
to 10 kresistor to VSS on unused pins and drive the  
output to logic low.  
2.5  
External Oscillator Pins  
Many microcontrollers have options for at least two  
oscillators: a high-frequency primary oscillator and a  
low-frequency  
secondary  
oscillator  
(refer to  
Section 3.0 “Oscillator Configurations” for details).  
The oscillator circuit should be placed on the same  
side of the board as the device. Place the oscillator  
circuit close to the respective oscillator pins with no  
more than 0.5 inch (12 mm) between the circuit  
components and the pins. The load capacitors should  
be placed next to the oscillator itself, on the same side  
of the board.  
© 2009 Microchip Technology Inc.  
DS39689F-page 27  
PIC18F2221/2321/4221/4321 FAMILY  
NOTES:  
DS39689F-page 28  
© 2009 Microchip Technology Inc.  
PIC18F2221/2321/4221/4321 FAMILY  
FIGURE 3-1:  
CRYSTAL/CERAMIC  
RESONATOROPERATION  
(XT, LP, HS OR HSPLL  
CONFIGURATION)  
3.0  
3.1  
OSCILLATOR  
CONFIGURATIONS  
Oscillator Types  
(1)  
C1  
The PIC18F2221/2321/4221/4321 family of devices  
can be operated in ten different oscillator modes. The  
user can program the Configuration bits, FOSC<3:0>,  
in Configuration Register 1H to select one of these ten  
modes:  
OSC1  
To  
Internal  
Logic  
(3)  
RF  
XTAL  
Sleep  
(2)  
1. LP  
2. XT  
3. HS  
Low-Power Crystal  
RS  
(1)  
PIC18FXXXX  
C2  
Crystal/Resonator  
OSC2  
High-Speed Crystal/Resonator  
Note 1: See Table 3-1 and Table 3-2 for initial values of  
4. HSPLL High-Speed Crystal/Resonator  
with PLL enabled  
C1 and C2.  
2: A series resistor (RS) may be required for AT  
5. RC  
External Resistor/Capacitor with  
FOSC/4 output on RA6  
strip cut crystals.  
3: RF varies with the oscillator mode chosen.  
6. RCIO  
External Resistor/Capacitor with I/O  
on RA6  
7. INTIO1 Internal Oscillator with FOSC/4 output  
on RA6 and I/O on RA7  
TABLE 3-1:  
CAPACITOR SELECTION FOR  
CERAMIC RESONATORS  
8. INTIO2 Internal Oscillator with I/O on RA6  
and RA7  
Typical Capacitor Values Used:  
9. EC  
External Clock with FOSC/4 output  
External Clock with I/O on RA6  
Mode  
Freq  
OSC1  
OSC2  
10. ECIO  
XT  
3.58 MHz  
22 pF  
22 pF  
Capacitor values are for design guidance only.  
3.2  
Crystal Oscillator/Ceramic  
Resonators  
Different capacitor values may be required to produce  
acceptable oscillator operation. The user should test  
the performance of the oscillator over the expected  
VDD and temperature range for the application. Refer  
to the following application notes for oscillator specific  
information:  
In XT, LP, HS or HSPLL Oscillator modes, a crystal or  
ceramic resonator is connected to the OSC1 and  
OSC2 pins to establish oscillation. Figure 3-1 shows  
the pin connections.  
The oscillator design requires the use of a parallel cut  
crystal.  
AN588, “PIC® Microcontroller Oscillator Design  
Guide”  
Note:  
Use of a series cut crystal may give a  
frequency out of the crystal manufacturer’s  
specifications.  
AN826, “Crystal Oscillator Basics and Crystal  
Selection for rfPIC® and PIC® Devices”  
AN849, “Basic PIC® Oscillator Design”  
AN943, “Practical PIC® Oscillator Analysis and  
Design”  
• AN949, “Making Your Oscillator Work”  
See the notes following Table 3-2 for additional  
information.  
Note:  
When using resonators with frequencies  
above 3.5 MHz, the use of HS mode,  
rather than XT mode, is recommended.  
HS mode may be used at any VDD for  
which the controller is rated. If HS is  
selected, it is possible that the gain of the  
oscillator will overdrive the resonator.  
Therefore, a series resistor may be placed  
between the OSC2 pin and the resonator.  
As  
a
good starting point, the  
recommended value of RS is 330Ω.  
© 2009 Microchip Technology Inc.  
DS39689F-page 29  
PIC18F2221/2321/4221/4321 FAMILY  
An external clock source may also be connected to the  
OSC1 pin in the HS mode, as shown in Figure 3-2.  
When operated in this mode, parameters D033 and  
D043 apply.  
TABLE 3-2:  
CAPACITOR SELECTION FOR  
QUARTZ CRYSTALS  
Typical Capacitor Values  
Crystal  
Freq  
Tested:  
Osc Type  
FIGURE 3-2:  
EXTERNAL CLOCK INPUT  
OPERATION (HS OSC  
CONFIGURATION)  
C1  
C2  
LP  
XT  
32 kHz  
22 pF  
22 pF  
1 MHz  
4 MHz  
22 pF  
22 pF  
22 pF  
22 pF  
OSC1  
Clock from  
Ext. System  
HS  
4 MHz  
10 MHz  
20 MHz  
25 MHz  
22 pF  
22 pF  
22 pF  
22 pF  
22 pF  
22 pF  
22 pF  
22 pF  
PIC18FXXXX  
(HS Mode)  
OSC2  
Open  
Capacitor values are for design guidance only.  
Different capacitor values may be required to produce  
acceptable oscillator operation. The user should test  
the performance of the oscillator over the expected  
VDD and temperature range for the application. Refer  
to the following application notes for oscillator specific  
information:  
3.3  
External Clock Input  
The EC and ECIO Oscillator modes require an external  
clock source to be connected to the OSC1 pin. There is  
no oscillator start-up time required after a Power-on  
Reset or after an exit from Sleep mode.  
AN588, “PIC® Microcontroller Oscillator Design  
Guide”  
In the EC Oscillator mode, the oscillator frequency  
divided by 4 is available on the OSC2 pin. This signal  
may be used for test purposes or to synchronize other  
logic. Figure 3-3 shows the pin connections for the EC  
Oscillator mode.  
AN826, “Crystal Oscillator Basics and Crystal  
Selection for rfPIC® and PIC® Devices”  
AN849, “Basic PIC® Oscillator Design”  
AN943, “Practical PIC® Oscillator Analysis and  
Design”  
FIGURE 3-3:  
EXTERNAL CLOCK  
INPUT OPERATION  
(EC CONFIGURATION)  
• AN949, “Making Your Oscillator Work”  
See the notes following this table for additional  
information.  
OSC1/CLKI  
Clock from  
Ext. System  
PIC18FXXXX  
OSC2/CLKO  
FOSC/4  
Note 1: Higher capacitance increases the stability  
of the oscillator but also increases the  
start-up time.  
The ECIO Oscillator mode functions like the EC mode,  
except that the OSC2 pin becomes an additional  
general purpose I/O pin. The I/O pin becomes bit 6 of  
PORTA (RA6). Figure 3-4 shows the pin connections  
for the ECIO Oscillator mode. When operated in this  
mode, parameters D033A and D043A apply.  
2: When operating below 3V VDD, or when  
using certain ceramic resonators at any  
voltage, it may be necessary to use the  
HS mode or switch to a crystal oscillator.  
3: Since each resonator/crystal has its own  
characteristics, the user should consult  
the resonator/crystal manufacturer for  
FIGURE 3-4:  
EXTERNAL CLOCK  
INPUT OPERATION  
(ECIO CONFIGURATION)  
appropriate  
values  
of  
external  
components.  
4: Rs may be required to avoid overdriving  
crystals with low drive level specification.  
OSC1/CLKI  
PIC18FXXXX  
I/O (OSC2)  
Clock from  
Ext. System  
5: Always verify oscillator performance over  
the VDD and temperature range that is  
expected for the application.  
RA6  
DS39689F-page 30  
© 2009 Microchip Technology Inc.  
PIC18F2221/2321/4221/4321 FAMILY  
3.4  
RC Oscillator  
3.5  
PLL Frequency Multiplier  
For timing insensitive applications, the RC and RCIO  
Oscillator modes offer additional cost savings. The  
actual oscillator frequency is a function of several  
factors:  
A Phase Locked Loop (PLL) circuit is provided as an  
option for users who wish to use a lower frequency  
oscillator circuit or to clock the device up to its highest  
rated frequency from a crystal oscillator. This may be  
useful for customers who are concerned with EMI due  
to high-frequency crystals or users who require higher  
clock speeds from an internal oscillator.  
• supply voltage  
• values of the external resistor (REXT) and  
capacitor (CEXT)  
• operating temperature  
3.5.1  
HSPLL OSCILLATOR MODE  
Given the same device, operating voltage, temperature  
and component values, there will also be unit-to-unit  
frequency variations. These are due to factors such as:  
The HSPLL mode makes use of the HS mode oscillator  
for frequencies up to 10 MHz. A PLL then multiplies the  
oscillator output frequency by 4 to produce an internal  
clock frequency up to 40 MHz. The PLLEN bit is not  
available when this mode is configured as the primary  
clock source.  
• normal manufacturing variation  
• difference in lead frame capacitance between  
package types (especially for low CEXT values)  
The PLL is only available to the crystal oscillator when  
the FOSC<3:0> Configuration bits are programmed for  
HSPLL mode (= 0110).  
• variations within the tolerance of limits of REXT  
and CEXT  
In the RC Oscillator mode, the oscillator frequency  
divided by 4 is available on the OSC2 pin. This signal  
may be used for test purposes or to synchronize other  
logic. Figure 3-5 shows how the R/C combination is  
connected.  
FIGURE 3-7:  
HSPLLBLOCKDIAGRAM  
HS Oscillator Enable  
PLL Enable  
(from Configuration Register 1H)  
FIGURE 3-5:  
RC OSCILLATOR MODE  
VDD  
OSC2  
Phase  
Comparator  
HS Mode  
Crystal  
Osc  
FIN  
REXT  
OSC1  
FOUT  
Internal  
OSC1  
Clock  
Loop  
Filter  
CEXT  
VSS  
PIC18FXXXX  
OSC2/CLKO  
FOSC/4  
÷4  
VCO  
SYSCLK  
Recommended values: 3 kΩ ≤ REXT 100 kΩ  
20 pF CEXT 300 pF  
The RCIO Oscillator mode (Figure 3-6) functions like  
the RC mode, except that the OSC2 pin becomes an  
additional general purpose I/O pin. The I/O pin  
becomes bit 6 of PORTA (RA6).  
3.5.2  
PLL AND INTOSC  
The PLL is also available to the internal oscillator block  
when the internal oscillator block is configured as the  
primary clock source. In this configuration, the PLL is  
enabled in software and generates a clock output of up  
to 32 MHz. The operation of INTOSC with the PLL is  
described in Section 3.6.4 “PLL in INTOSC Modes”.  
FIGURE 3-6:  
RCIO OSCILLATOR MODE  
VDD  
REXT  
Internal  
OSC1  
Clock  
CEXT  
PIC18FXXXX  
VSS  
I/O (OSC2)  
RA6  
Recommended values: 3 kΩ ≤ REXT 100 kΩ  
20 pF CEXT 300 pF  
© 2009 Microchip Technology Inc.  
DS39689F-page 31  
PIC18F2221/2321/4221/4321 FAMILY  
3.6.2  
INTOSC OUTPUT FREQUENCY  
3.6  
Internal Oscillator Block  
The internal oscillator block is calibrated at the factory  
to produce an INTOSC output frequency of 8 MHz.  
The PIC18F2221/2321/4221/4321 family of devices  
includes an internal oscillator block which generates  
two different clock signals; either can be used as the  
microcontroller’s clock source. This may eliminate the  
need for external oscillator circuits on the OSC1 and/or  
OSC2 pins.  
The INTRC oscillator operates independently of the  
INTOSC source. Any changes in INTOSC across  
voltage and temperature are not necessarily reflected  
by changes in INTRC or vice versa.  
The main output (INTOSC) is an 8 MHz clock source,  
which can be used to directly drive the device clock. It  
also drives a postscaler, which can provide a range of  
clock frequencies from 31 kHz to 4 MHz. The INTOSC  
output is enabled when a clock frequency from 125 kHz  
to 8 MHz is selected. The INTOSC output can also be  
enabled when 31 kHz is selected, depending on the  
INTSRC bit (OSCTUNE<7>).  
3.6.3  
OSCTUNE REGISTER  
The INTOSC output has been calibrated at the  
factory but can be adjusted in the user’s application.  
This  
(OSCTUNE<4:0>) in the OSCTUNE register  
(Register 3-1).  
is  
done  
by  
writing  
to  
TUN<4:0>  
When the OSCTUNE register is modified, the INTOSC  
frequency will begin shifting to the new frequency.  
Code execution continues during this shift. There is no  
indication that the shift has occurred. The INTRC is not  
affected by OSCTUNE.  
The other clock source is the internal RC oscillator  
(INTRC), which provides a nominal 31 kHz output.  
INTRC is enabled if it is selected as the device clock  
source; it is also enabled automatically when any of the  
following are enabled:  
The OSCTUNE register also implements the INTSRC  
(OSCTUNE<7>) and PLLEN (OSCTUNE<6>) bits,  
which control certain features of the internal oscillator  
block. The INTSRC bit allows users to select which  
internal oscillator provides the clock source when the  
31 kHz frequency option is selected. This is covered in  
greater detail in Section 3.7.1 “Oscillator Control  
Register”.  
• Power-up Timer  
• Fail-Safe Clock Monitor  
• Watchdog Timer  
• Two-Speed Start-up  
These features are discussed in greater detail in  
Section 24.0 “Special Features of the CPU”.  
The clock source frequency (INTOSC direct, INTRC  
direct or INTOSC postscaler) is selected by configuring  
the IRCF bits of the OSCCON register (page 37).  
The PLLEN bit controls the operation of the Phase  
Locked Loop (PLL) in Internal Oscillator modes (see  
Figure 3-10).  
3.6.1  
INTIO MODES  
FIGURE 3-10:  
INTOSC AND PLL BLOCK  
DIAGRAM  
Using the internal oscillator as the clock source elimi-  
nates the need for up to two external oscillator pins,  
which can then be used for digital I/O. Two distinct  
configurations are available:  
8 or 4 MHz  
PLLEN  
(OSCTUNE<6>)  
• In INTIO1 mode, the OSC2 pin outputs FOSC/4,  
while OSC1 functions as RA7 (see Figure 3-8) for  
digital input and output.  
Phase  
Comparator  
FIN  
• In INTIO2 mode, OSC1 functions as RA7 and  
OSC2 functions as RA6 (see Figure 3-9), both for  
digital input and output.  
INTOSC  
FOUT  
Loop  
Filter  
FIGURE 3-8: INTIO1 OSCILLATOR MODE  
I/O (OSC1)  
OSC2  
RA7  
PIC18FXXXX  
÷4  
VCO  
FOSC/4  
SYSCLK  
CLKO  
OSC2  
FIGURE 3-9: INTIO2 OSCILLATOR MODE  
RA6  
I/O (OSC1)  
I/O (OSC2)  
RA7  
RA6  
PIC18FXXXX  
DS39689F-page 32  
© 2009 Microchip Technology Inc.  
PIC18F2221/2321/4221/4321 FAMILY  
3.6.4  
PLL IN INTOSC MODES  
3.6.5  
INTOSC FREQUENCY DRIFT  
The 4x Phase Locked Loop (PLL) can be used with the  
internal oscillator block to produce faster device clock  
speeds than are normally possible with the internal  
oscillator sources. When enabled, the PLL produces a  
clock speed of 16 MHz or 32 MHz.  
The factory calibrates the internal oscillator block  
output (INTOSC) for 8 MHz. However, this frequency  
may drift as VDD or temperature changes and can  
affect the controller operation in a variety of ways. It is  
possible to adjust the INTOSC frequency by modifying  
the value in the OSCTUNE register. This has no effect  
on the INTRC clock source frequency.  
Unlike HSPLL mode, the PLL is controlled through  
software. The control bit, PLLEN (OSCTUNE<6>), is  
used to enable or disable its operation. If PLL is  
enabled and a Two-Speed Start-up from wake is  
performed, execution is delayed until the PLL starts.  
Tuning the INTOSC source requires knowing when to  
make the adjustment, in which direction it should be  
made and in some cases, how large a change is  
needed. Three compensation techniques are discussed  
in Section 3.6.5.1 “Compensating with the  
EUSART”, Section 3.6.5.2 “Compensating with the  
Timers” and Section 3.6.5.3 “Compensating with the  
CCP Module in Capture Mode” but other techniques  
may be used.  
The PLL is available when the device is configured to  
use the internal oscillator block as its primary clock  
source (FOSC<3:0> = 1001or 1000). Additionally, the  
PLL will only function when the selected output fre-  
quency is either 4 MHz or 8 MHz (OSCCON<6:4> = 111  
or 110). If both of these conditions are not met, the PLL  
is disabled and the PLLEN bit remains clear (writes are  
ignored).  
REGISTER 3-1:  
OSCTUNE: OSCILLATOR TUNING REGISTER  
R/W-0  
INTSRC PLLEN(1)  
R/W-0  
U-0  
R/W-0  
TUN4  
R/W-0  
TUN3  
R/W-0  
TUN2  
R/W-0  
TUN1  
R/W-0  
TUN0  
bit 7  
bit 0  
bit 7  
bit 6  
INTSRC: Internal Oscillator Low-Frequency Source Select bit  
1= 31.25 kHz device clock derived from 8 MHz INTOSC source (divide-by-256 enabled)  
0= 31 kHz device clock derived directly from INTRC internal oscillator  
PLLEN: Frequency Multiplier PLL for INTOSC Enable bit(1)  
1= PLL enabled for INTOSC (4 MHz and 8 MHz only)  
0= PLL disabled  
Note 1: Available only in certain oscillator configurations; otherwise, this bit is unavailable  
and reads as ‘0’. See Section 3.6.4 “PLL in INTOSC Modes” for details.  
bit 5  
Unimplemented: Read as ‘0’  
TUN<4:0>: Frequency Tuning bits  
01111= Maximum frequency  
bit 4-0  
00001  
00000= Center frequency. Oscillator module is running at the calibrated frequency.  
11111  
10000= Minimum frequency  
Legend:  
R = Readable bit  
-n = Value at POR  
W = Writable bit  
‘1’ = Bit is set  
U = Unimplemented bit, read as ‘0’  
‘0’ = Bit is cleared x = Bit is unknown  
© 2009 Microchip Technology Inc.  
DS39689F-page 33  
PIC18F2221/2321/4221/4321 FAMILY  
3.6.5.1  
Compensating with the EUSART  
3.6.5.3  
Compensating with the CCP Module  
in Capture Mode  
An adjustment may be required when the EUSART  
begins to generate framing errors or receives data with  
errors while in Asynchronous mode. Framing errors  
indicate that the device clock frequency is too high. To  
adjust for this, decrement the value in OSCTUNE to  
reduce the clock frequency. On the other hand, errors  
in data may suggest that the clock speed is too low. To  
compensate, increment OSCTUNE to increase the  
clock frequency.  
A CCP module can use free running Timer1 (or  
Timer3), clocked by the internal oscillator block and an  
external event with a known period (i.e., AC power  
frequency). The time of the first event is captured in the  
CCPRxH:CCPRxL registers and is recorded for use  
later. When the second event causes a capture, the  
time of the first event is subtracted from the time of the  
second event. Since the period of the external event is  
known, the time difference between events can be  
calculated.  
3.6.5.2  
Compensating with the Timers  
This technique compares device clock speed to some  
reference clock. Two timers may be used; one timer is  
clocked by the peripheral clock, while the other is  
clocked by a fixed reference source, such as the  
Timer1 oscillator.  
If the measured time is much greater than the  
calculated time, the internal oscillator block is running  
too fast. To compensate, decrement the OSCTUNE  
register. If the measured time is much less than the  
calculated time, the internal oscillator block is running  
too slow. To compensate, increment the OSCTUNE  
register.  
Both timers are cleared, but the timer clocked by the  
reference generates interrupts. When an interrupt  
occurs, the internally clocked timer is read and both  
timers are cleared. If the internally clocked timer value  
is much greater than expected, then the internal  
oscillator block is running too fast. To adjust for this,  
decrement the OSCTUNE register.  
DS39689F-page 34  
© 2009 Microchip Technology Inc.  
PIC18F2221/2321/4221/4321 FAMILY  
The secondary oscillators are those external sources  
3.7  
Clock Sources and Oscillator  
Switching  
not connected to the OSC1 or OSC2 pins. These  
sources may continue to operate even after the  
controller is placed in a power-managed mode.  
The PIC18F2221/2321/4221/4321 family of devices  
includes a feature that allows the device clock source  
to be switched from the main oscillator to an alternate  
clock source. These devices also offer two alternate  
clock sources. When an alternate clock source is  
enabled, the various power-managed operating modes  
are available.  
The PIC18F2221/2321/4221/4321 family of devices  
offers the Timer1 oscillator as a secondary oscillator.  
This oscillator, in all power-managed modes, is often  
the time base for functions such as a Real-Time Clock.  
Most often, a 32.768 kHz watch crystal is connected  
between the RC0/T1OSO/T13CKI and RC1/T1OSI  
pins. Like the LP mode oscillator circuit, loading  
capacitors are also connected from each pin to ground.  
Essentially, there are three clock sources for these  
devices:  
• Primary oscillators  
The Timer1 oscillator is discussed in greater detail in  
Section 13.3 “Timer1 Oscillator”.  
• Secondary oscillators  
• Internal oscillator block  
In addition to being a primary clock source, the internal  
oscillator block is available as a power-managed  
mode clock source. The INTRC source is also used as  
the clock source for several special features, such as  
the WDT and Fail-Safe Clock Monitor.  
The primary oscillators include the External Crystal  
and Resonator modes, the External RC modes, the  
External Clock modes and the internal oscillator block.  
The particular mode is defined by the FOSC<3:0> Con-  
figuration bits. The details of these modes are covered  
earlier in this chapter.  
The clock sources for the PIC18F2221/2321/4221/4321  
family of devices are shown in Figure 3-11. See  
Section 24.0 “Special Features of the CPU” for  
Configuration register details.  
FIGURE 3-11:  
PIC18F2221/2321/4221/4321 FAMILY CLOCK DIAGRAM  
Primary Oscillator  
LP, XT, HS, RC, EC  
OSC2  
Sleep  
HSPLL, INTOSC/PLL  
4 x PLL  
OSC1  
OSCTUNE<6>  
Peripherals  
T1OSC  
Secondary Oscillator  
T1OSO  
T1OSCEN  
Enable  
Oscillator  
T1OSI  
OSCCON<6:4>  
Internal Oscillator  
CPU  
8 MHz  
OSCCON<6:4>  
111  
110  
101  
4 MHz  
2 MHz  
Internal  
Oscillator  
Block  
IDLEN  
Clock  
1 MHz  
Control  
100  
011  
010  
001  
000  
8 MHz  
Source  
500 kHz  
250 kHz  
125 kHz  
31 kHz  
8 MHz  
(INTOSC)  
INTRC  
Source  
FOSC<3:0>  
OSCCON<1:0>  
Clock Source Option  
for Other Modules  
1
0
31 kHz (INTRC)  
OSCTUNE<7>  
WDT, PWRT, FSCM  
and Two-Speed Start-up  
© 2009 Microchip Technology Inc.  
DS39689F-page 35  
PIC18F2221/2321/4221/4321 FAMILY  
the primary clock is providing the device clock in  
primary clock modes. The IOFS bit indicates when the  
internal oscillator block has stabilized and is providing  
the device clock in RC Clock modes. The T1RUN bit  
(T1CON<6>) indicates when the Timer1 oscillator is  
providing the device clock in secondary clock modes.  
In power-managed modes, only one of these three bits  
will be set at any time. If none of these bits are set, the  
INTRC is providing the clock or the internal oscillator  
block has just started and is not yet stable.  
3.7.1  
OSCILLATOR CONTROL REGISTER  
The OSCCON register (Register 3-2) controls several  
aspects of the device clock’s operation, both in full  
power operation and in power-managed modes.  
The System Clock Select bits, SCS<1:0>, select the  
clock source. The available clock sources are the  
primary clock (defined by the FOSC<3:0> Configura-  
tion bits), the secondary clock (Timer1 oscillator) and  
the internal oscillator block. The clock source changes  
immediately after either of the SCS<1:0> bits are  
changed, following a brief clock transition interval. The  
SCS bits are reset on all forms of Reset.  
The IDLEN bit controls whether the device goes into  
Sleep mode or one of the Idle modes when the SLEEP  
instruction is executed.  
The Internal Oscillator Frequency Select bits  
(IRCF<2:0>) select the frequency output of the internal  
oscillator block to drive the device clock. The choices  
are the INTRC source (31 kHz), the INTOSC source  
(8 MHz) or one of the frequencies derived from the  
INTOSC postscaler (31.25 kHz to 4 MHz). If the  
internal oscillator block is supplying the device clock,  
changing the states of these bits will have an immedi-  
ate change on the internal oscillator’s output. On  
device Resets, the default output frequency of the  
internal oscillator block is set at 1 MHz.  
The use of the flag and control bits in the OSCCON  
register is discussed in more detail in Section 4.0  
“Power-Managed Modes”.  
Note 1: The Timer1 oscillator must be enabled to  
select the secondary clock source. The  
Timer1 oscillator is enabled by setting the  
T1OSCEN bit in the Timer1 Control regis-  
ter (T1CON<3>). If the Timer1 oscillator  
is not enabled, then any attempt to select  
a secondary clock source will be ignored.  
When a nominal output frequency of 31 kHz is selected  
(IRCF<2:0> = 000), users may choose which internal  
oscillator acts as the source. This is done with the  
INTSRC bit in the OSCTUNE register (OSCTUNE<7>).  
Setting this bit selects INTOSC as a 31.25 kHz clock  
source derived from the INTOSC postscaler. Clearing  
INTSRC selects INTRC (nominally 31 kHz) as the  
clock source and disables the INTOSC to reduce  
current consumption.  
2: It is recommended that the Timer1  
oscillator be operating and stable before  
selecting the secondary clock source or a  
very long delay may occur while the  
Timer1 oscillator starts.  
3.7.2  
OSCILLATOR TRANSITIONS  
The PIC18F2221/2321/4221/4321 family of devices con-  
tains circuitry to prevent clock “glitches” when switching  
between clock sources. A short pause in the device clock  
occurs during the clock switch. The length of this pause  
is the sum of two cycles of the old clock source and three  
to four cycles of the new clock source. This formula  
assumes that the new clock source is stable.  
This option allows users to select the tunable and more  
precise INTOSC as a clock source, while maintaining  
power savings with a very low clock speed. Addition-  
ally, the INTOSC source will already be stable should a  
switch to a higher frequency be needed quickly.  
Regardless of the setting of INTSRC, INTRC always  
remains the clock source for features such as the  
Watchdog Timer and the Fail-Safe Clock Monitor.  
Clock transitions are discussed in greater detail in  
Section 4.1.2 “Entering Power-Managed Modes”.  
The OSTS, IOFS and T1RUN bits indicate which clock  
source is currently providing the device clock. The  
OSTS bit indicates that the Oscillator Start-up Timer  
and PLL Start-up Timer (if enabled) have timed out and  
DS39689F-page 36  
© 2009 Microchip Technology Inc.  
PIC18F2221/2321/4221/4321 FAMILY  
REGISTER 3-2:  
OSCCON: OSCILLATOR CONTROL REGISTER  
R/W-0  
IDLEN  
R/W-1  
IRCF2  
R/W-0  
IRCF1  
R/W-0  
IRCF0  
R(1)  
R-0  
R/W-0  
SCS1  
R/W-0  
SCS0  
OSTS  
IOFS  
bit 7  
bit 0  
bit 7  
IDLEN: Idle Enable bit  
1= Device enters an Idle mode when a SLEEPinstruction is executed  
0= Device enters Sleep mode when a SLEEPinstruction is executed  
bit 6-4 IRCF<2:0>: Internal Oscillator Frequency Select bits  
111= 8 MHz (INTOSC drives clock directly)  
110= 4 MHz  
101= 2 MHz  
100= 1 MHz(3)  
011= 500 kHz  
010= 250 kHz  
001= 125 kHz  
000= 31 kHz (from either INTOSC/256 or INTRC directly)(2)  
bit 3  
bit 2  
OSTS: Oscillator Start-up Time-out Status bit(1)  
1= Oscillator Start-up Timer (OST) time-out has expired; primary oscillator is running  
0= Oscillator Start-up Timer (OST) time-out is running; primary oscillator is not ready  
IOFS: INTOSC Frequency Stable bit  
1= INTOSC frequency is stable  
0= INTOSC frequency is not stable  
bit 1-0 SCS<1:0>: System Clock Select bits  
1x= Internal oscillator block  
01= Secondary (Timer1) oscillator  
00= Primary oscillator  
Note 1: Reset state depends on state of the IESO Configuration bit.  
2: Source selected by the INTSRC bit (OSCTUNE<7>), see text.  
3: Default output frequency of INTOSC on Reset.  
Legend:  
R = Readable bit  
-n = Value at POR  
W = Writable bit  
‘1’ = Bit is set  
U = Unimplemented bit, read as ‘0’  
‘0’ = Bit is cleared x = Bit is unknown  
© 2009 Microchip Technology Inc.  
DS39689F-page 37  
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3.8  
Effects of Power-Managed Modes  
on the Various Clock Sources  
3.9  
Power-up Delays  
Power-up delays are controlled by two or three timers,  
so that no external Reset circuitry is required for most  
applications. The delays ensure that the device is kept  
in Reset until the device power supply is stable under  
normal circumstances and the primary clock is operat-  
ing and stable. For additional information on power-up  
delays, see Section 5.5 “Device Reset Timers”.  
When PRI_IDLE mode is selected, the designated pri-  
mary oscillator continues to run without interruption.  
For all other power-managed modes, the oscillator  
using the OSC1 pin is disabled. The OSC1 pin (and  
OSC2 pin in Crystal Oscillator modes) will stop  
oscillating.  
The first timer is the Power-up Timer (PWRT) which  
provides a fixed delay on power-up (parameter 33,  
Table 27-10). It is enabled by clearing (= 0) the  
PWRTEN Configuration bit (CONFIG2L<0>).  
In secondary clock modes (SEC_RUN and  
SEC_IDLE), the Timer1 oscillator is operating and  
providing the device clock. The Timer1 oscillator may  
also run in all power-managed modes if required to  
clock Timer1 or Timer3.  
3.9.1  
DELAYS FOR POWER-UP AND  
RETURN TO PRIMARY CLOCK  
In internal oscillator modes (RC_RUN and RC_IDLE),  
the internal oscillator block provides the device clock  
source. The 31 kHz INTRC output can be used directly  
to provide the clock and may be enabled to support  
various special features, regardless of the power-  
managed mode (see Section 24.2 “Watchdog Timer  
(WDT)”, Section 24.3 “Two-Speed Start-up” and  
Section 24.4 “Fail-Safe Clock Monitor” for more  
information). The INTOSC output at 8 MHz may be  
used directly to clock the device or may be divided  
down by the postscaler. The INTOSC output is disabled  
if the clock is provided directly from the INTRC output.  
The INTOSC output is also enabled for Two-Speed  
Start-up at 1 MHz after a Reset.  
The second timer is the Oscillator Start-up Timer  
(OST), intended to delay execution until the crystal  
oscillator is stable (LP, XT and HS modes). The OST  
does this by counting 1024 oscillator cycles before  
allowing the oscillator to clock the device.  
When the HSPLL Oscillator mode is selected, a third  
timer delays execution for an additional 2 ms following  
the HS mode OST delay, so the PLL can lock to the  
incoming clock frequency. At the end of these delays,  
the OSTS bit (OSCCON<3>) is set.  
There is a delay of interval TCSD (parameter 38,  
Table 27-10), once execution is allowed to start, when  
the controller becomes ready to execute instructions.  
This delay runs concurrently with any other delays.  
This may be the only delay that occurs when any of the  
EC, RC or INTIO modes are used as the primary clock  
source.  
If the Sleep mode is selected, all clock sources are  
stopped. Since all the transistor switching currents  
have been stopped, Sleep mode achieves the lowest  
current consumption of the device (only leakage  
currents).  
Enabling any on-chip feature that will operate during  
Sleep will increase the current consumed during Sleep.  
The INTRC is required to support WDT operation. The  
Timer1 oscillator may be operating to support a Real-  
Time Clock. Other features may be operating that do  
not require a device clock source (i.e., MSSP slave,  
PSP, INTx pins and others). Peripherals that may add  
significant current consumption are listed in  
Section 27.2 “DC Characteristics”.  
TABLE 3-3:  
OSC1 AND OSC2 PIN STATES IN SLEEP MODE  
OSC Mode  
OSC1 Pin  
OSC2 Pin  
RC, INTIO1  
RCIO  
Floating, external resistor pulls high  
Floating, external resistor pulls high  
Configured as PORTA, bit 7  
At logic low (clock/4 output)  
Configured as PORTA, bit 6  
Configured as PORTA, bit 6  
Configured as PORTA, bit 6  
At logic low (clock/4 output)  
INTIO2  
ECIO  
Floating, driven by external clock  
Floating, driven by external clock  
EC  
LP, XT and HS  
Feedback inverter disabled at quiescent  
voltage level  
Feedback inverter disabled at quiescent  
voltage level  
Note:  
See Table 5-2 in Section 5.0 “Reset” for time-outs due to Sleep and MCLR Reset.  
DS39689F-page 38  
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4.1.1  
CLOCK SOURCES  
4.0  
POWER-MANAGED MODES  
The SCS<1:0 bits allow the selection of one of three  
clock sources for power-managed modes. They are:  
PIC18F2221/2321/4221/4321 family devices offer a  
total of seven operating modes for more efficient  
power-management. These modes provide a variety of  
options for selective power conservation in applications  
where resources may be limited (i.e., battery-powered  
devices).  
• the primary clock, as defined by the FOSC<3:0>  
Configuration bits  
• the secondary clock (the Timer1 oscillator)  
• the internal oscillator block (for RC modes)  
There are three categories of power-managed modes:  
4.1.2  
ENTERING POWER-MANAGED  
MODES  
• Run modes  
• Idle modes  
• Sleep mode  
Switching from one power-managed mode to another  
begins by loading the OSCCON register. The  
SCS1:SCS0 bits select the clock source and determine  
which Run or Idle mode is to be used. Changing these  
bits causes an immediate switch to the new clock  
source, assuming that it is running. The switch may  
also be subject to clock transition delays. These are  
discussed in Section 4.1.3 “Clock Transitions and  
Status Indicators” and subsequent sections.  
These categories define which portions of the device  
are clocked and sometimes, what speed. The Run and  
Idle modes may use any of the three available clock  
sources (primary, secondary or internal oscillator  
block); the Sleep mode does not use a clock source.  
The power-managed modes include several power-  
saving features offered on previous PIC® devices. One  
is the clock switching feature, offered in other PIC18  
devices, allowing the controller to use the Timer1 oscil-  
lator in place of the primary oscillator. Also included is  
the Sleep mode, offered by all PIC devices, where all  
device clocks are stopped.  
Entry to the power-managed Idle or Sleep modes is  
triggered by the execution of a SLEEPinstruction. The  
actual mode that results depends on the status of the  
IDLEN bit.  
Depending on the current mode and the mode being  
switched to, a change to a power-managed mode does  
not always require setting all of these bits. Many  
transitions may be done by changing the oscillator select  
bits, or changing the IDLEN bit, prior to issuing a SLEEP  
instruction. If the IDLEN bit is already configured  
correctly, it may only be necessary to perform a SLEEP  
instruction to switch to the desired mode.  
4.1  
Selecting Power-Managed Modes  
Selecting  
a power-managed mode requires two  
decisions: if the CPU is to be clocked or not and the  
selection of clock source. The IDLEN bit  
(OSCCON<7>) controls CPU clocking, while the  
SCS<1:0 bits (OSCCON<1:0>) select the clock source.  
The individual modes, bit settings, clock sources and  
affected modules are summarized in Table 4-1.  
a
TABLE 4-1:  
Mode  
POWER-MANAGED MODES  
OSCCON Bits  
Module Clocking  
Available Clock and Oscillator Source  
IDLEN<7>(1) SCS<1:0>  
CPU  
Peripherals  
Sleep  
0
N/A  
Off  
Off  
None – All clocks are disabled  
PRI_RUN  
N/A  
00  
Clocked  
Clocked  
Primary – LP, XT, HS, HSPLL, RC, EC and  
Internal Oscillator Block.(2)  
This is the normal full power execution mode.  
SEC_RUN  
RC_RUN  
PRI_IDLE  
SEC_IDLE  
RC_IDLE  
N/A  
N/A  
1
01  
1x  
00  
01  
1x  
Clocked  
Clocked  
Off  
Clocked  
Clocked  
Clocked  
Clocked  
Clocked  
Secondary – Timer1 Oscillator  
Internal Oscillator Block(2)  
Primary – LP, XT, HS, HSPLL, RC, EC  
Secondary – Timer1 Oscillator  
Internal Oscillator Block(2)  
1
Off  
1
Off  
Note 1: IDLEN reflects its value when the SLEEPinstruction is executed.  
2: Includes INTOSC and INTOSC postscaler, as well as the INTRC source.  
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4.1.3  
CLOCK TRANSITIONS AND STATUS  
INDICATORS  
4.2  
Run Modes  
In the Run modes, clocks to both the core and  
peripherals are active. The difference between these  
modes is the clock source.  
The length of the transition between clock sources is  
the sum of two cycles of the old clock source and three  
to four cycles of the new clock source. This formula  
assumes that the new clock source is stable.  
4.2.1  
PRI_RUN MODE  
Three bits indicate the current clock source and its  
status. They are:  
The PRI_RUN mode is the normal, full power execution  
mode of the microcontroller. This is also the default  
mode upon a device Reset unless Two-Speed Start-up  
is enabled (see Section 24.3 “Two-Speed Start-up”  
or Section 24.4 “Fail-Safe Clock Monitor” for  
details). In this mode, the OSTS bit is set. The IOFS bit  
may be set if the internal oscillator block is the primary  
clock source (see Section 3.7.1 “Oscillator Control  
Register”).  
• OSTS (OSCCON<3>)  
• IOFS (OSCCON<2>)  
• T1RUN (T1CON<6>)  
In general, only one of these bits will be set while in a  
given power-managed mode. When the OSTS bit is  
set, the primary clock is providing the device clock.  
When the IOFS bit is set, the INTOSC output is  
providing a stable 8 MHz clock source to a divider that  
actually drives the device clock. When the T1RUN bit is  
set, the Timer1 oscillator is providing the clock. If none  
of these bits are set, then either the INTRC clock  
source is clocking the device, or the INTOSC source is  
not yet stable.  
4.2.2  
SEC_RUN MODE  
The SEC_RUN mode is the compatible mode to the  
“clock switching” feature offered in other PIC18  
devices. In this mode, the CPU and peripherals are  
clocked from the Timer1 oscillator. This gives users the  
option of lower power consumption while still using a  
high-accuracy clock source.  
If the internal oscillator block is configured as the primary  
clock source by the FOSC<3:0> Configuration bits, then  
both the OSTS and IOFS bits may be set when in  
PRI_RUN or PRI_IDLE modes. This indicates that the  
primary clock (INTOSC) is generating a stable 8 MHz  
output. Switching the clock source to the Timer1  
oscillator would clear the OSTS bit.  
SEC_RUN mode is entered by setting the SCS<1:0>  
bits to ‘01’. The device clock source is switched to the  
Timer1 oscillator (see Figure 4-1), the primary oscillator  
is shut down, the T1RUN bit (T1CON<6>) is set and the  
OSTS bit is cleared.  
Note:  
The Timer1 oscillator should already be  
running prior to entering SEC_RUN mode.  
If the T1OSCEN bit is not set when the  
SCS<1:0> bits are set to ‘01’, entry to  
SEC_RUN mode will not occur. If the  
Timer1 oscillator is enabled, but not yet  
running, device clocks will be delayed until  
the oscillator has started. In such situa-  
tions, initial oscillator operation is far from  
stable and unpredictable operation may  
result.  
Note 1: Caution should be used when modifying a  
single IRCF bit. If VDD is less than 3V, it is  
possible to select a higher clock speed  
than is supported by the low VDD.  
Improper device operation may result if  
the VDD/FOSC specifications are violated.  
2: Executing a SLEEP instruction does not  
necessarily place the device into Sleep  
mode. It acts as the trigger to place the  
controller into either the Sleep mode or  
one of the Idle modes, depending on the  
setting of the IDLEN bit.  
On transitions from SEC_RUN mode to PRI_RUN, the  
peripherals and CPU continue to be clocked from the  
Timer1 oscillator while the primary clock is started.  
When the primary clock becomes ready, a clock switch  
back to the primary clock occurs (see Figure 4-2).  
When the clock switch is complete, the T1RUN bit is  
cleared, the OSTS bit is set and the primary clock is  
providing the clock. The IDLEN and SCS bits are not  
affected by the wake-up; the Timer1 oscillator  
continues to run.  
4.1.4  
MULTIPLE SLEEP COMMANDS  
The power-managed mode that is invoked with the  
SLEEP instruction is determined by the setting of the  
IDLEN bit at the time the instruction is executed. If  
another SLEEPinstruction is executed, the device will  
enter the power-managed mode specified by IDLEN at  
that time. If IDLEN has changed, the device will enter  
the new power-managed mode specified by the new  
setting.  
DS39689F-page 40  
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FIGURE 4-1:  
TRANSITION TIMING FOR ENTRY TO SEC_RUN MODE  
Q1 Q2 Q3 Q4 Q1  
Q2  
Q3  
Q4  
Q1  
Q2  
Q3  
1
2
3
n-1  
n
T1OSI  
Clock Transition(1)  
OSC1  
CPU  
Clock  
Peripheral  
Clock  
Program  
Counter  
PC  
PC + 2  
PC + 4  
Note 1: Clock transition typically occurs within 2-4 TOSC.  
FIGURE 4-2:  
TRANSITION TIMING FROM SEC_RUN MODE TO PRI_RUN MODE (HSPLL)  
Q1  
Q2  
Q3  
Q4  
Q1  
Q2 Q3 Q4 Q1 Q2 Q3  
T1OSI  
OSC1  
(1)  
TOST  
(1)  
TPLL  
1
2
n-1  
n
PLL Clock  
Output  
Clock  
Transition(2)  
CPU Clock  
Peripheral  
Clock  
Program  
Counter  
PC  
PC + 2  
PC + 4  
SCS<1:0> bits Changed  
OSTS bit Set  
Note 1: TOST = 1024 TOSC; TPLL = 2 ms (approx). These intervals are not shown to scale.  
2: Clock transition typically occurs within 2-4 TOSC.  
This mode is entered by setting the SCS1 bit to ‘1’.  
4.2.3  
RC_RUN MODE  
Although it is ignored, it is recommended that the SCS0  
bit also be cleared; this is to maintain software compat-  
ibility with future devices. When the clock source is  
switched to the INTOSC multiplexer (see Figure 4-3),  
the primary oscillator is shut down and the OSTS bit is  
cleared. The IRCF bits may be modified at any time to  
immediately change the clock speed.  
In RC_RUN mode, the CPU and peripherals are  
clocked from the internal oscillator block using the  
INTOSC multiplexer. In this mode, the primary clock is  
shut down. When using the INTRC source, this mode  
provides the best power conservation of all the Run  
modes, while still executing code. It works well for user  
applications which are not highly timing sensitive or do  
not require high-speed clocks at all times.  
Note:  
Caution should be used when modifying a  
single IRCF bit. If VDD is less than 3V, it is  
possible to select a higher clock speed  
than is supported by the low VDD.  
Improper device operation may result if  
the VDD/FOSC specifications are violated.  
If the primary clock source is the internal oscillator block  
(either INTRC or INTOSC), there are no distinguishable  
differences between PRI_RUN and RC_RUN modes  
during execution. However, a clock switch delay will  
occur during entry to and exit from RC_RUN mode.  
Therefore, if the primary clock source is the internal  
oscillator block, the use of RC_RUN mode is not  
recommended.  
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If the IRCF bits and the INTSRC bit are all clear, the  
INTOSC output is not enabled and the IOFS bit will  
remain clear; there will be no indication of the current  
clock source. The INTRC source is providing the  
device clocks.  
On transitions from RC_RUN mode to PRI_RUN mode,  
the device continues to be clocked from the INTOSC  
multiplexer while the primary clock is started. When the  
primary clock becomes ready, a clock switch to the  
primary clock occurs (see Figure 4-4). When the clock  
switch is complete, the IOFS bit is cleared, the OSTS  
bit is set and the primary clock is providing the device  
clock. The IDLEN and SCS bits are not affected by the  
switch. The INTRC source will continue to run if either  
the WDT or the Fail-Safe Clock Monitor is enabled.  
If the IRCF bits are changed from all clear (thus,  
enabling the INTOSC output) or if INTSRC is set, the  
IOFS bit becomes set after the INTOSC output  
becomes stable. Clocks to the device continue while  
the INTOSC source stabilizes after an interval of  
TIOBST (parameter 39, Table 27-10).  
If the IRCF bits were previously at a non-zero value, or  
if INTSRC was set before setting SCS1 and the  
INTOSC source was already stable, the IOFS bit will  
remain set.  
FIGURE 4-3:  
TRANSITION TIMING TO RC_RUN MODE  
Q1 Q2 Q3 Q4 Q1  
Q2  
Q3  
Q4  
Q1  
Q2  
Q3  
1
2
3
n-1  
n
INTRC  
OSC1  
Clock Transition(1)  
CPU  
Clock  
Peripheral  
Clock  
Program  
Counter  
PC  
PC + 2  
PC + 4  
Note 1: Clock transition typically occurs within 2-4 TOSC.  
FIGURE 4-4:  
TRANSITION TIMING FROM RC_RUN MODE TO PRI_RUN MODE  
Q3  
Q4  
Q1  
Q2 Q3 Q4 Q1 Q2 Q3  
Q1  
Q2  
INTOSC  
Multiplexer  
OSC1  
(1)  
(1)  
TPLL  
TOST  
1
2
n-1  
n
PLL Clock  
Output  
Clock  
Transition(2)  
CPU Clock  
Peripheral  
Clock  
Program  
Counter  
PC  
PC + 2  
PC + 4  
SCS<1:0> bits Changed  
OSTS bit Set  
Note 1: TOST = 1024 TOSC; TPLL = 2 ms (approx). These intervals are not shown to scale.  
2: Clock transition typically occurs within 2-4 TOSC.  
DS39689F-page 42  
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4.3  
Sleep Mode  
4.4  
Idle Modes  
The power-managed Sleep mode in the PIC18F2221/  
2321/4221/4321 family devices is identical to the leg-  
acy Sleep mode offered in all other PIC devices. It is  
entered by clearing the IDLEN bit (the default state on  
device Reset) and executing the SLEEP instruction.  
This shuts down the selected oscillator (Figure 4-5). All  
clock source status bits are cleared.  
The Idle modes allow the controller’s CPU to be  
selectively shut down while the peripherals continue to  
operate. Selecting a particular Idle mode allows users  
to further manage power consumption.  
If the IDLEN bit is set to a ‘1’ when a SLEEPinstruction is  
executed, the peripherals will be clocked from the clock  
source selected using the SCS<1:0> bits; however, the  
CPU will not be clocked. The clock source status bits are  
not affected. Setting IDLEN and executing a SLEEP  
instruction provides a quick method of switching from a  
given Run mode to its corresponding Idle mode.  
Entering the Sleep mode from any other mode does not  
require a clock switch. This is because no clocks are  
needed once the controller has entered Sleep. If the  
WDT is selected, the INTRC source will continue to  
operate. If the Timer1 oscillator is enabled, it will also  
continue to run.  
If the WDT is selected, the INTRC source will continue  
to operate. If the Timer1 oscillator is enabled, it will also  
continue to run.  
When a wake event occurs in Sleep mode (by interrupt,  
Reset or WDT time-out), the device will not be clocked  
until the clock source selected by the SCS<1:0> bits  
becomes ready (see Figure 4-6), or it will be clocked  
from the internal oscillator block if either the Two-Speed  
Start-up or the Fail-Safe Clock Monitor are enabled  
(see Section 24.0 “Special Features of the CPU”). In  
either case, the OSTS bit is set when the primary clock  
is providing the device clocks. The IDLEN and SCS bits  
are not affected by the wake-up.  
Since the CPU is not executing instructions, the only  
exits from any of the Idle modes are by interrupt, WDT  
time-out or a Reset. When a wake event occurs, CPU  
execution is delayed by an interval of TCSD  
(parameter 38, Table 27-10) while it becomes ready to  
execute code. When the CPU begins executing code,  
it resumes with the same clock source for the current  
Idle mode. For example, when waking from RC_IDLE  
mode, the internal oscillator block will clock the CPU  
and peripherals (in other words, RC_RUN mode). The  
IDLEN and SCS bits are not affected by the wake-up.  
While in any Idle mode or the Sleep mode, a WDT  
time-out will result in a WDT wake-up to the Run mode  
currently specified by the SCS<1:0> bits.  
FIGURE 4-5:  
TRANSITION TIMING FOR ENTRY TO SLEEP MODE  
Q1 Q2 Q3 Q4 Q1  
OSC1  
CPU  
Clock  
Peripheral  
Clock  
Sleep  
Program  
Counter  
PC  
PC + 2  
FIGURE 4-6:  
TRANSITION TIMING FOR WAKE FROM SLEEP (HSPLL)  
Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4  
Q2 Q3 Q4 Q1 Q2  
Q1  
OSC1  
(1)  
(1)  
TOST  
TPLL  
PLL Clock  
Output  
CPU Clock  
Peripheral  
Clock  
Program  
Counter  
PC  
PC + 2  
PC + 4  
PC + 6  
Wake Event  
Note1: TOST = 1024 TOSC; TPLL = 2 ms (approx). These intervals are not shown to scale.  
OSTS bit Set  
© 2009 Microchip Technology Inc.  
DS39689F-page 43  
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4.4.1  
PRI_IDLE MODE  
4.4.2  
SEC_IDLE MODE  
This mode is unique among the three low-power Idle  
modes, in that it does not disable the primary device  
clock. For timing sensitive applications, this allows for  
the fastest resumption of device operation with its more  
accurate primary clock source, since the clock source  
does not have to “warm-up” or transition from another  
oscillator.  
In SEC_IDLE mode, the CPU is disabled but the  
peripherals continue to be clocked from the Timer1  
oscillator. This mode is entered from SEC_RUN by  
setting the IDLEN bit and executing  
a SLEEP  
instruction. If the device is in another Run mode, set the  
IDLEN bit first, then set the SCS<1:0> bits to ‘01’ and  
execute SLEEP. When the clock source is switched to  
the Timer1 oscillator, the primary oscillator is shut down,  
the OSTS bit is cleared and the T1RUN bit is set.  
PRI_IDLE mode is entered from PRI_RUN mode by  
setting the IDLEN bit and executing a SLEEP instruc-  
tion. If the device is in another Run mode, set IDLEN  
first, then clear the SCS bits and execute SLEEP.  
Although the CPU is disabled, the peripherals continue  
to be clocked from the primary clock source specified  
by the FOSC<3:0> Configuration bits. The OSTS bit  
remains set (see Figure 4-7).  
When a wake event occurs, the peripherals continue to  
be clocked from the Timer1 oscillator. After an interval  
of TCSD following the wake event, the CPU begins exe-  
cuting code being clocked by the Timer1 oscillator. The  
IDLEN and SCS bits are not affected by the wake-up;  
the Timer1 oscillator continues to run (see Figure 4-8).  
When a wake event occurs, the CPU is clocked from the  
primary clock source. A delay of interval TCSD (parame-  
ter 38, Table 27-10) is required between the wake event  
and when code execution starts. This is required to  
allow the CPU to become ready to execute instructions.  
After the wake-up, the OSTS bit remains set. The  
IDLEN and SCS bits are not affected by the wake-up  
(see Figure 4-8).  
Note:  
The Timer1 oscillator should already be  
running prior to entering SEC_IDLE mode.  
If the T1OSCEN bit is not set when writing  
the SCS<1:0> bits, entry to SEC_IDLE  
mode will not occur. If the Timer1 oscillator  
is enabled but not yet running, peripheral  
clocks will be delayed until the oscillator  
has started. In such situations, initial oscil-  
lator operation is far from stable and  
unpredictable operation may result.  
FIGURE 4-7:  
TRANSITION TIMING FOR ENTRY TO IDLE MODE  
Q3  
Q4  
Q1  
Q1  
Q2  
OSC1  
CPU Clock  
Peripheral  
Clock  
Program  
Counter  
PC  
PC + 2  
FIGURE 4-8:  
TRANSITION TIMING FOR WAKE FROM IDLE TO RUN MODE  
Q1  
Q3  
Q4  
Q2  
OSC1  
TCSD  
CPU Clock  
Peripheral  
Clock  
Program  
Counter  
PC  
Wake Event  
DS39689F-page 44  
© 2009 Microchip Technology Inc.  
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On all exits from Idle or Sleep modes by interrupt, code  
execution branches to the interrupt vector if the GIE/  
GIEH bit (INTCON<7>) is set. Otherwise, code execution  
continues or resumes without branching (see  
Section 10.0 “Interrupts”).  
4.4.3  
RC_IDLE MODE  
In RC_IDLE mode, the CPU is disabled but the periph-  
erals continue to be clocked from the internal oscillator  
block using the INTOSC multiplexer. This mode allows  
for controllable power conservation during Idle periods.  
A fixed delay of interval TCSD following the wake event  
is required when leaving Sleep and Idle modes. This  
delay is required for the CPU to prepare for execution.  
Instruction execution resumes on the first clock cycle  
following this delay.  
From RC_RUN, this mode is entered by setting the  
IDLEN bit and executing a SLEEP instruction. If the  
device is in another Run mode, first set IDLEN, then set  
the SCS1 bit and execute SLEEP. Although its value is  
ignored, it is recommended that SCS0 also be cleared;  
this is to maintain software compatibility with future  
devices. The INTOSC multiplexer may be used to  
select a higher clock frequency by modifying the IRCF  
bits before executing the SLEEPinstruction. When the  
clock source is switched to the INTOSC multiplexer, the  
primary oscillator is shut down and the OSTS bit is  
cleared.  
4.5.2  
EXIT BY WDT TIME-OUT  
A WDT time-out will cause different actions depending  
on which power-managed mode the device is in when  
the time-out occurs.  
If the device is not executing code (all Idle modes and  
Sleep mode), the time-out will result in an exit from the  
power-managed mode (see Section 4.2 “Run  
Modes” and Section 4.3 “Sleep Mode”). If the device  
is executing code (all Run modes), the time-out will  
result in a WDT Reset (see Section 24.2 “Watchdog  
Timer (WDT)”).  
If the IRCF bits are set to any non-zero value, or the  
INTSRC bit is set, the INTOSC output is enabled. The  
IOFS bit becomes set, after the INTOSC output  
becomes stable, after an interval of TIOBST  
(parameter 39, Table 27-10). Clocks to the peripherals  
continue while the INTOSC source stabilizes. If the  
IRCF bits were previously at a non-zero value, or  
INTSRC was set before the SLEEP instruction was  
executed and the INTOSC source was already stable,  
the IOFS bit will remain set. If the IRCF bits and  
INTSRC are all clear, the INTOSC output will not be  
enabled, the IOFS bit will remain clear and there will be  
no indication of the current clock source.  
The WDT timer and postscaler are cleared by  
executing a SLEEPor CLRWDTinstruction, the loss of a  
currently selected clock source (if the Fail-Safe Clock  
Monitor is enabled) and modifying the IRCF bits in the  
OSCCON register if the internal oscillator block is the  
device clock source.  
4.5.3  
EXIT BY RESET  
When a wake event occurs, the peripherals continue to  
be clocked from the INTOSC multiplexer. After a delay of  
TCSD following the wake event, the CPU begins execut-  
ing code being clocked by the INTOSC multiplexer. The  
IDLEN and SCS bits are not affected by the wake-up.  
The INTRC source will continue to run if either the WDT  
or the Fail-Safe Clock Monitor is enabled.  
Normally, the device is held in Reset by the Oscillator  
Start-up Timer (OST) until the primary clock becomes  
ready. At that time, the OSTS bit is set and the device  
begins executing code. If the internal oscillator block is  
the new clock source, the IOFS bit is set instead.  
The exit delay time from Reset to the start of code  
execution depends on both the clock sources before  
and after the wake-up and the type of oscillator if the  
new clock source is the primary clock. Exit delays are  
summarized in Table 4-2.  
4.5  
Exiting Idle and Sleep Modes  
An exit from Sleep mode or any of the Idle modes is  
triggered by an interrupt, a Reset or a WDT time-out.  
This section discusses the triggers that cause exits  
from power-managed modes. The clocking subsystem  
actions are discussed in each of the power-managed  
modes (see Section 4.2 “Run Modes”, Section 4.3  
“Sleep Mode” and Section 4.4 “Idle Modes”).  
Code execution can begin before the primary clock  
becomes ready. If either the Two-Speed Start-up (see  
Section 24.3 “Two-Speed Start-up”) or Fail-Safe  
Clock Monitor (see Section 24.4 “Fail-Safe Clock  
Monitor”) is enabled, the device may begin execution  
as soon as the Reset source has cleared. Execution is  
clocked by the INTOSC multiplexer driven by the  
internal oscillator block. Execution is clocked by the  
internal oscillator block until either the primary clock  
becomes ready or a power-managed mode is entered  
before the primary clock becomes ready; the primary  
clock is then shut down.  
4.5.1  
EXIT BY INTERRUPT  
Any of the available interrupt sources can cause the  
device to exit from an Idle mode, or the Sleep mode to  
a Run mode. To enable this functionality, an interrupt  
source must be enabled by setting its enable bit in one  
of the INTCON or PIE registers. The exit sequence is  
initiated when the corresponding interrupt flag bit is set.  
© 2009 Microchip Technology Inc.  
DS39689F-page 45  
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In these instances, the primary clock source either  
does not require an oscillator start-up delay since it is  
already running (PRI_IDLE), or normally does not  
require an oscillator start-up delay (RC, EC and INTIO  
Oscillator modes). However, a fixed delay of interval  
TCSD following the wake event is still required when  
leaving Sleep and Idle modes to allow the CPU to  
prepare for execution. Instruction execution resumes  
on the first clock cycle following this delay.  
4.5.4  
EXIT WITHOUT AN OSCILLATOR  
START-UP DELAY  
Certain exits from power-managed modes do not  
invoke the OST at all. There are two cases:  
• PRI_IDLE mode, where the primary clock source  
is not stopped; and  
• the primary clock source is not any of the LP, XT,  
HS or HSPLL modes.  
TABLE 4-2:  
EXIT DELAY ON WAKE-UP BY RESET FROM SLEEP MODE OR ANY IDLE MODE  
(BY CLOCK SOURCES)  
Clock Source  
before Wake-up  
Clock Source  
after Wake-up  
Clock Ready Status  
Bit (OSCCON)  
Exit Delay  
LP, XT, HS  
HSPLL  
OSTS  
IOFS  
OSTS  
IOFS  
OSTS  
IOFS  
OSTS  
IOFS  
Primary Device Clock  
(PRI_IDLE mode)  
(1)  
TCSD  
EC, RC  
INTOSC(2)  
LP, XT, HS  
HSPLL  
(3)  
TOST  
(3)  
TOST + trc  
T1OSC  
(1)  
EC, RC  
TCSD  
INTOSC(2)  
LP, XT, HS  
HSPLL  
TIOBST  
(4)  
(3)  
TOST  
(3)  
TOST + trc  
INTOSC(3)  
(1)  
EC, RC  
TCSD  
INTOSC(2)  
LP, XT, HS  
HSPLL  
None  
(3)  
TOST  
(3)  
TOST + trc  
None  
(Sleep mode)  
(1)  
EC, RC  
INTOSC(2)  
TCSD  
(4)  
TIOBST  
Note 1: TCSD (parameter 38) is a required delay when waking from Sleep and all Idle modes and runs concurrently  
with any other required delays (see Section 4.4 “Idle Modes”). On Reset, INTOSC defaults to 1 MHz.  
2: Includes both the INTOSC 8 MHz source and postscaler derived frequencies.  
3: TOST is the Oscillator Start-up Timer (parameter 32). trc is the PLL Lock-out Timer (parameter F12); it is  
also designated as TPLL.  
4: Execution continues during TIOBST (parameter 39), the INTOSC stabilization period.  
DS39689F-page 46  
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A simplified block diagram of the On-Chip Reset Circuit  
is shown in Figure 5-1.  
5.0  
RESET  
The PIC18F2221/2321/4221/4321 family devices  
differentiate between various kinds of Reset:  
5.1  
RCON Register  
a) Power-on Reset (POR)  
Device Reset events are tracked through the RCON  
register (Register 5-1). The lower five bits of the regis-  
ter indicate that a specific Reset event has occurred. In  
most cases, these bits can only be cleared by the event  
and must be set by the application after the event. The  
state of these flag bits, taken together, can be read to  
indicate the type of Reset that just occurred. This is  
described in more detail in Section 5.6 “Reset State  
of Registers”.  
b) MCLR Reset during normal operation  
c) MCLR Reset during power-managed modes  
d) Watchdog Timer (WDT) Reset (during  
execution)  
e) Programmable Brown-out Reset (BOR)  
f) RESETInstruction  
g) Stack Full Reset  
h) Stack Underflow Reset  
The RCON register also has control bits for setting  
interrupt priority (IPEN) and software control of the  
BOR (SBOREN). Interrupt priority is discussed in  
Section 10.0 “Interrupts”. BOR is covered in  
Section 5.4 “Brown-out Reset (BOR)”.  
This section discusses Resets generated by MCLR,  
POR and BOR and covers the operation of the various  
start-up timers. Stack Reset events are covered in  
Section 6.1.2.4 “Stack Full and Underflow Resets”.  
WDT Resets are covered in Section 24.2 “Watchdog  
Timer (WDT)”.  
FIGURE 5-1:  
SIMPLIFIED BLOCK DIAGRAM OF ON-CHIP RESET CIRCUIT  
RESET  
Instruction  
Stack Full/Underflow Reset  
Stack  
Pointer  
External Reset  
MCLRE  
MCLR  
( )_IDLE  
Sleep  
WDT  
Time-out  
VDD Rise  
Detect  
POR Pulse  
BOREN  
VDD  
Brown-out  
Reset  
S
OST/PWRT  
OST  
10-bit Ripple Counter  
1024 Cycles  
Chip_Reset  
Q
R
OSC1  
32 μs  
65.5 ms  
PWRT  
11-Bit Ripple Counter  
INTRC(1)  
Enable PWRT  
(2)  
Enable OST  
Note 1: This is the INTRC source from the internal oscillator block and is separate from the RC oscillator of the CLKI pin.  
2: See Table 5-2 for time-out situations.  
© 2009 Microchip Technology Inc.  
DS39689F-page 47  
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REGISTER 5-1:  
RCON: RESET CONTROL REGISTER  
R/W-0  
IPEN  
R/W-1(1)  
U-0  
R/W-1  
RI  
R-1  
TO  
R-1  
PD  
R/W-0(2)  
POR  
R/W-0  
BOR  
SBOREN  
bit 7  
bit 0  
bit 7  
bit 6  
IPEN: Interrupt Priority Enable bit  
1= Enable priority levels on interrupts  
0= Disable priority levels on interrupts (PIC16CXXX Compatibility mode)  
SBOREN: BOR Software Enable bit(1)  
If BOREN<1:0> = 01:  
1= BOR is enabled  
0= BOR is disabled  
If BOREN<1:0> = 00, 10or 11:  
Bit is disabled and read as ‘0’.  
bit 5  
bit 4  
Unimplemented: Read as ‘0’  
RI: RESETInstruction Flag bit  
1= The RESETinstruction was not executed (set by firmware only)  
0= The RESETinstruction was executed causing a device Reset (must be set in software after  
a Brown-out Reset occurs)  
bit 3  
bit 2  
bit 1  
bit 0  
TO: Watchdog Time-out Flag bit  
1= Set by power-up, CLRWDTinstruction or SLEEPinstruction  
0= A WDT time-out occurred  
PD: Power-Down Detection Flag bit  
1= Set by power-up or by the CLRWDTinstruction  
0= Set by execution of the SLEEPinstruction  
POR: Power-on Reset Status bit(2)  
1= A Power-on Reset has not occurred (set by firmware only)  
0= A Power-on Reset occurred (must be set in software after a Power-on Reset occurs)  
BOR: Brown-out Reset Status bit  
1= A Brown-out Reset has not occurred (set by firmware only)  
0= A Brown-out Reset occurred (must be set in software after a Brown-out Reset occurs)  
Note 1: If SBOREN is enabled, its Reset state is ‘1’; otherwise, it is ‘0’.  
2: The actual Reset value of POR is determined by the type of device Reset. See the  
notes following this register and Section 5.6 “Reset State of Registers” for  
additional information.  
Legend:  
R = Readable bit  
-n = Value at POR  
W = Writable bit  
‘1’ = Bit is set  
U = Unimplemented bit, read as ‘0’  
‘0’ = Bit is cleared x = Bit is unknown  
Note 1: It is recommended that the POR bit be set after a Power-on Reset has been  
detected so that subsequent Power-on Resets may be detected.  
2: Brown-out Reset is said to have occurred when BOR is ‘0’ and POR is ‘1’ (assuming  
that POR was set to ‘1’ by software immediately after Power-on Reset).  
DS39689F-page 48  
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FIGURE 5-2:  
EXTERNAL POWER-ON  
RESET CIRCUIT (FOR  
SLOW VDD POWER-UP)  
5.2  
Master Clear (MCLR)  
The MCLR pin provides a method for triggering an  
external Reset of the device. A Reset is generated by  
holding the pin low. These devices have a noise filter in  
the MCLR Reset path which detects and ignores small  
pulses.  
VDD  
VDD  
D
The MCLR pin is not driven low by any internal Resets,  
including the WDT.  
R
R1  
MCLR  
In PIC18F2221/2321/4221/4321 family devices, the  
MCLR input can be disabled with the MCLRE Configu-  
ration bit. When MCLR is disabled, the pin becomes a  
digital input. See Section 11.5 “PORTE, TRISE and  
LATE Registers” for more information.  
PIC18FXXXX  
C
Note 1: External Power-on Reset circuit is required  
only if the VDD power-up slope is too slow.  
The diode D helps discharge the capacitor  
quickly when VDD powers down.  
5.3  
Power-on Reset (POR)  
A
Power-on Reset pulse is generated on-chip  
2: R < 40 kΩ is recommended to make sure that  
the voltage drop across R does not violate  
the device’s electrical specification.  
whenever VDD rises above a certain threshold. This  
allows the device to start in the initialized state when  
VDD is adequate for operation.  
3: R1 1 kΩ will limit any current flowing into  
MCLR from external capacitor C, in the event  
of MCLR/VPP pin breakdown, due to  
Electrostatic Discharge (ESD) or Electrical  
Overstress (EOS).  
To take advantage of the POR circuitry, tie the MCLR  
pin through a resistor (1 kΩ to 10 kΩ) to VDD. This will  
eliminate external RC components usually needed to  
create a Power-on Reset delay. A minimum rise rate for  
VDD is specified (parameter D004). For a slow rise  
time, see Figure 5-2.  
When the device starts normal operation (i.e., exits the  
Reset condition), device operating parameters  
(voltage, frequency, temperature, etc.) must be met to  
ensure operation. If these conditions are not met, the  
device must be held in Reset until the operating  
conditions are met.  
Power-on Reset events are captured by the POR bit  
(RCON<1>). The state of the bit is set to ‘0’ whenever  
a POR occurs; it does not change for any other Reset  
event. POR is not reset to ‘1’ by any hardware event.  
To capture multiple events, the user manually resets  
the bit to ‘1’ in software following any POR.  
© 2009 Microchip Technology Inc.  
DS39689F-page 49  
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change BOR configuration. It also allows the user to  
tailor device power consumption in software by elimi-  
nating the incremental current that the BOR consumes.  
While the BOR current is typically very small, it may  
have some impact in low-power applications.  
5.4  
Brown-out Reset (BOR)  
PIC18F2221/2321/4221/4321 family devices implement  
a BOR circuit that provides the user with a number of  
configuration and power-saving options. The BOR is  
controlled by the BORV<1:0> and BOREN<1:0>  
Configuration bits. There are a total of four BOR  
configurations which are summarized in Table 5-1.  
Note:  
Even when BOR is under software control,  
the Brown-out Reset voltage level is still  
set by the BORV<1:0> Configuration bits.  
It cannot be changed in software.  
The BOR threshold is set by the BORV<1:0> bits. If BOR  
is enabled (any values of BOREN<1:0>, except ‘00’),  
any drop of VDD below VBOR (parameter D005) for  
greater than TBOR (parameter 35) will reset the device.  
A Reset may or may not occur if VDD falls below VBOR  
for less than TBOR. The chip will remain in Brown-out  
Reset until VDD rises above VBOR.  
5.4.2  
DETECTING BOR  
When Brown-out Reset is enabled, the BOR bit always  
resets to ‘0’ on any Brown-out Reset or Power-on  
Reset event. This makes it difficult to determine if a  
Brown-out Reset event has occurred just by reading  
the state of BOR alone. A more reliable method is to  
simultaneously check the state of both POR and BOR.  
This assumes that the POR bit is reset to ‘1’ in software  
immediately after any Power-on Reset event. If BOR is  
0’ while POR is ‘1’, it can be reliably assumed that a  
Brown-out Reset event has occurred.  
If the Power-up Timer is enabled, it will be invoked after  
VDD rises above VBOR; it then will keep the chip in  
Reset for an additional time delay, TPWRT  
(parameter 33). If VDD drops below VBOR while the  
Power-up Timer is running, the chip will go back into a  
Brown-out Reset and the Power-up Timer will be  
initialized. Once VDD rises above VBOR, the Power-up  
Timer will execute the additional time delay.  
5.4.3  
DISABLING BOR IN SLEEP MODE  
BOR and the Power-on Timer (PWRT) are  
independently configured. Enabling BOR Reset does  
not automatically enable the PWRT.  
When BOREN<1:0> = 10, the BOR remains under  
hardware control and operates as previously  
described. Whenever the device enters Sleep mode,  
however, the BOR is automatically disabled. When the  
device returns to any other operating mode, BOR is  
automatically re-enabled.  
5.4.1  
SOFTWARE ENABLED BOR  
When BOREN<1:0> = 01, the BOR can be enabled or  
disabled by the user in software. This is done with the  
control bit, SBOREN (RCON<6>). Setting SBOREN  
enables the BOR to function as previously described.  
Clearing SBOREN disables the BOR entirely. The  
SBOREN bit operates only in this mode; otherwise it is  
read as ‘0’.  
This mode allows for applications to recover from  
brown-out situations, while actively executing code,  
when the device requires BOR protection the most. At  
the same time, it saves additional power in Sleep mode  
by eliminating the small incremental BOR current.  
Placing the BOR under software control gives the user  
the additional flexibility of tailoring the application to its  
environment without having to reprogram the device to  
TABLE 5-1:  
BOREN1  
BOR CONFIGURATIONS  
BOR Configuration  
Status of  
SBOREN  
BOR Operation  
BOREN0  
(RCON<6>)  
0
0
1
0
1
0
Unavailable BOR disabled; must be enabled by reprogramming the Configuration bits.  
Available BOR enabled in software; operation controlled by SBOREN.  
Unavailable BOR enabled in hardware in Run and Idle modes, disabled during  
Sleep mode.  
1
1
Unavailable BOR enabled in hardware; must be disabled by reprogramming the  
Configuration bits.  
DS39689F-page 50  
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5.5.3  
PLL LOCK TIME-OUT  
5.5  
Device Reset Timers  
With the PLL enabled in HSPLL mode, the time-out  
sequence following a Power-on Reset is slightly differ-  
ent from other oscillator modes. A separate timer is  
used to provide a fixed time-out that is sufficient for the  
PLL to lock to the main oscillator frequency. This PLL  
lock time-out (TPLL) is typically 2 ms and follows the  
oscillator start-up time-out.  
PIC18F2221/2321/4221/4321 family devices incorpo-  
rate three separate on-chip timers that help regulate the  
Power-on Reset process. Their main function is to  
ensure that the device clock is stable before code is  
executed. These timers are:  
• Power-up Timer (PWRT)  
• Oscillator Start-up Timer (OST)  
• PLL Lock Time-out  
5.5.4  
TIME-OUT SEQUENCE  
On power-up, the time-out sequence is as follows:  
5.5.1  
POWER-UP TIMER (PWRT)  
1. After the POR pulse has cleared, PWRT time-out  
is invoked (if enabled).  
The Power-up Timer (PWRT) of the PIC18F2221/  
2321/4221/4321 family devices is an 11-bit counter  
which uses the INTRC source as the clock input.  
This yields an approximate time interval of  
2048 x 32 μs = 65.6 ms. While the PWRT is counting,  
the device is held in Reset.  
2. Then, the OST is activated.  
The total time-out will vary based on oscillator configu-  
ration and the status of the PWRT. Figure 5-3,  
Figure 5-4, Figure 5-5, Figure 5-6 and Figure 5-7 all  
depict time-out sequences on power-up, with the  
Power-up Timer enabled and the device operating in  
HS Oscillator mode. Figures 5-3 through 5-6 also  
apply to devices operating in XT or LP modes. For  
devices in RC mode and with the PWRT disabled, there  
will be no time-out at all.  
The power-up time delay depends on the INTRC clock  
and will vary from chip to chip due to temperature and  
process variation. See DC parameter 33 for details.  
The PWRT is enabled by clearing the PWRTEN  
Configuration bit.  
Since the time-outs occur from the POR pulse, if MCLR  
is kept low long enough, all time-outs will expire. Bring-  
ing MCLR high will begin execution immediately  
(Figure 5-5). This is useful for testing purposes or to  
synchronize more than one PIC18FXXXX device  
operating in parallel.  
5.5.2  
OSCILLATOR START-UP TIMER  
(OST)  
The Oscillator Start-up Timer (OST) provides a 1024  
oscillator cycle (from OSC1 input) delay after the  
PWRT delay is over (parameter 33). This ensures that  
the crystal oscillator or resonator has started and  
stabilized.  
The OST time-out is invoked only for XT, LP, HS and  
HSPLL modes and only on Power-on Reset, or on exit  
from most power-managed modes.  
TABLE 5-2:  
Oscillator  
TIME-OUT IN VARIOUS SITUATIONS  
Power-up(2) and Brown-out Reset  
Exit from  
Configuration  
Power-Managed Mode  
PWRTEN = 0  
PWRTEN = 1  
HSPLL  
66 ms(1) + 1024 TOSC + 2 ms(2)  
66 ms(1) + 1024 TOSC  
66 ms(1)  
1024 TOSC + 2 ms(2)  
1024 TOSC + 2 ms(2)  
HS, XT, LP  
EC, ECIO  
1024 TOSC  
1024 TOSC  
RC, RCIO  
66 ms(1)  
66 ms(1)  
INTIO1, INTIO2  
Note 1: 66 ms (65.5 ms) is the nominal Power-up Timer (PWRT) delay.  
2: 2 ms is the nominal time required for the PLL to lock.  
© 2009 Microchip Technology Inc.  
DS39689F-page 51  
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FIGURE 5-3:  
TIME-OUT SEQUENCE ON POWER-UP (MCLR TIED TO VDD, VDD RISE < TPWRT)  
VDD  
MCLR  
INTERNAL POR  
TPWRT  
PWRT TIME-OUT  
OST TIME-OUT  
TOST  
INTERNAL RESET  
FIGURE 5-4:  
TIME-OUT SEQUENCE ON POWER-UP (MCLR NOT TIED TO VDD): CASE 1  
VDD  
MCLR  
INTERNAL POR  
TPWRT  
PWRT TIME-OUT  
OST TIME-OUT  
TOST  
INTERNAL RESET  
FIGURE 5-5:  
TIME-OUT SEQUENCE ON POWER-UP (MCLR NOT TIED TO VDD): CASE 2  
VDD  
MCLR  
INTERNAL POR  
TPWRT  
PWRT TIME-OUT  
OST TIME-OUT  
TOST  
INTERNAL RESET  
DS39689F-page 52  
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FIGURE 5-6:  
SLOW RISE TIME (MCLR TIED TO VDD, VDD RISE > TPWRT)  
5V  
0V  
VDD  
MCLR  
INTERNAL POR  
TPWRT  
PWRT TIME-OUT  
TOST  
OST TIME-OUT  
INTERNAL RESET  
FIGURE 5-7:  
TIME-OUT SEQUENCE ON POR w/PLL ENABLED (MCLR TIED TO VDD)  
VDD  
MCLR  
INTERNAL POR  
TPWRT  
PWRT TIME-OUT  
OST TIME-OUT  
TOST  
TPLL  
PLL TIME-OUT  
INTERNAL RESET  
Note:  
TOST = 1024 clock cycles.  
TPLL 2 ms max. First three stages of the PWRT timer.  
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Table 5-4 describes the Reset states for all of the  
Special Function Registers. These are categorized by  
Power-on and Brown-out Resets, Master Clear and  
WDT Resets and WDT wake-ups.  
5.6  
Reset State of Registers  
Most registers are unaffected by a Reset. Their status  
is unknown on POR and unchanged by all other  
Resets. The other registers are forced to a “Reset  
state” depending on the type of Reset that occurred.  
Most registers are not affected by a WDT wake-up,  
since this is viewed as the resumption of normal oper-  
ation. Status bits from the RCON register, RI, TO, PD,  
POR and BOR, are set or cleared differently in different  
Reset situations, as indicated in Table 5-3. These bits  
are used in software to determine the nature of the  
Reset.  
TABLE 5-3:  
STATUS BITS, THEIR SIGNIFICANCE AND THE INITIALIZATION CONDITION  
FOR RCON REGISTER  
RCON Register  
STKPTR Register  
Program  
Counter  
Condition  
RI  
TO  
PD POR BOR STKFUL STKUNF  
Power-on Reset  
RESETInstruction  
Brown-out  
0000h  
0000h  
0000h  
0000h  
0000h  
1
0
1
u
u
1
u
1
1
1
1
u
1
u
0
0
u
u
u
u
0
u
0
u
u
0
u
u
u
u
0
u
u
u
u
MCLR during power-managed Run modes  
MCLR during power-managed Idle modes  
and Sleep mode  
WDT Time-out during full power or  
power-managed Run mode  
0000h  
u
0
u
u
u
u
u
MCLR during full power execution  
Stack Full Reset (STVREN = 1)  
Stack Underflow Reset (STVREN = 1)  
0000h  
0000h  
0000h  
0000h  
u
u
u
u
u
u
u
u
u
u
u
u
u
u
u
u
u
u
u
u
u
1
u
u
u
u
1
1
Stack Underflow Error (not an actual Reset,  
STVREN = 0)  
WDT time-out during power-managed Idle or  
Sleep modes  
PC + 2  
u
u
0
u
0
0
u
u
u
u
u
u
u
u
Interrupt exit from power-managed modes  
PC + 2(1)  
Legend: u= unchanged  
Note 1: When the wake-up is due to an interrupt and the GIEH or GIEL bits are set, the PC is loaded with the  
interrupt vector (008h or 0018h).  
2: Reset state is ‘1’ for POR and unchanged for all other Resets when software BOR is enabled  
(BOREN<1:0> Configuration bits = 01and SBOREN = 1); otherwise, the Reset state is ‘0’.  
DS39689F-page 54  
© 2009 Microchip Technology Inc.  
PIC18F2221/2321/4221/4321 FAMILY  
TABLE 5-4:  
INITIALIZATION CONDITIONS FOR ALL REGISTERS  
MCLR Resets,  
Power-on Reset,  
Brown-out Reset  
WDT Reset,  
RESET Instruction,  
Stack Resets  
Wake-up via WDT  
or Interrupt  
Register  
Applicable Devices  
TOSU  
2221 2321 4221 4321  
2221 2321 4221 4321  
2221 2321 4221 4321  
2221 2321 4221 4321  
2221 2321 4221 4321  
2221 2321 4221 4321  
2221 2321 4221 4321  
2221 2321 4221 4321  
2221 2321 4221 4321  
2221 2321 4221 4321  
2221 2321 4221 4321  
2221 2321 4221 4321  
2221 2321 4221 4321  
2221 2321 4221 4321  
2221 2321 4221 4321  
2221 2321 4221 4321  
2221 2321 4221 4321  
2221 2321 4221 4321  
2221 2321 4221 4321  
2221 2321 4221 4321  
2221 2321 4221 4321  
2221 2321 4221 4321  
2221 2321 4221 4321  
2221 2321 4221 4321  
2221 2321 4221 4321  
2221 2321 4221 4321  
2221 2321 4221 4321  
2221 2321 4221 4321  
2221 2321 4221 4321  
---0 0000  
0000 0000  
0000 0000  
00-0 0000  
--00 0000  
0000 0000  
0000 0000  
--00 0000  
0000 0000  
0000 0000  
0000 0000  
xxxx xxxx  
xxxx xxxx  
0000 000x  
1111 -1-1  
11-0 0-00  
N/A  
---0 0000  
0000 0000  
0000 0000  
uu-0 0000  
--00 0000  
0000 0000  
0000 0000  
--00 0000  
0000 0000  
0000 0000  
0000 0000  
uuuu uuuu  
uuuu uuuu  
0000 000u  
1111 -1-1  
11-0 0-00  
N/A  
---0 uuuu(3)  
uuuu uuuu(3)  
uuuu uuuu(3)  
uu-u uuuu(3)  
--uu uuuu  
uuuu uuuu  
PC + 2(2)  
--uu uuuu  
uuuu uuuu  
uuuu uuuu  
uuuu uuuu  
uuuu uuuu  
uuuu uuuu  
uuuu uuuu(1)  
uuuu -u-u(1)  
uu-u u-uu(1)  
N/A  
TOSH  
TOSL  
STKPTR  
PCLATU  
PCLATH  
PCL  
TBLPTRU  
TBLPTRH  
TBLPTRL  
TABLAT  
PRODH  
PRODL  
INTCON  
INTCON2  
INTCON3  
INDF0  
POSTINC0  
POSTDEC0  
PREINC0  
PLUSW0  
FSR0H  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
---- 0000  
xxxx xxxx  
xxxx xxxx  
N/A  
---- 0000  
uuuu uuuu  
uuuu uuuu  
N/A  
---- uuuu  
uuuu uuuu  
uuuu uuuu  
N/A  
FSR0L  
WREG  
INDF1  
POSTINC1  
POSTDEC1  
PREINC1  
PLUSW1  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
Legend: u= unchanged, x= unknown, -= unimplemented bit, read as ‘0’, q= value depends on condition.  
Shaded cells indicate conditions do not apply for the designated device.  
Note 1: One or more bits in the INTCONx or PIRx registers will be affected (to cause wake-up).  
2: When the wake-up is due to an interrupt and the GIEL or GIEH bit is set, the PC is loaded with the interrupt  
vector (0008h or 0018h).  
3: When the wake-up is due to an interrupt and the GIEL or GIEH bit is set, the TOSU, TOSH and TOSL are  
updated with the current value of the PC. The STKPTR is modified to point to the next location in the  
hardware stack.  
4: See Table 5-3 for Reset value for specific condition.  
5: Bits 6 and 7 of PORTA, LATA and TRISA are enabled, depending on the oscillator mode selected. When  
not enabled as PORTA pins, they are disabled and read ‘0’.  
© 2009 Microchip Technology Inc.  
DS39689F-page 55  
PIC18F2221/2321/4221/4321 FAMILY  
TABLE 5-4:  
INITIALIZATION CONDITIONS FOR ALL REGISTERS (CONTINUED)  
MCLR Resets,  
Power-on Reset,  
Brown-out Reset  
WDT Reset,  
RESET Instruction,  
Stack Resets  
Wake-up via WDT  
or Interrupt  
Register  
Applicable Devices  
FSR1H  
2221 2321 4221 4321  
2221 2321 4221 4321  
2221 2321 4221 4321  
2221 2321 4221 4321  
2221 2321 4221 4321  
2221 2321 4221 4321  
2221 2321 4221 4321  
2221 2321 4221 4321  
2221 2321 4221 4321  
2221 2321 4221 4321  
2221 2321 4221 4321  
2221 2321 4221 4321  
2221 2321 4221 4321  
2221 2321 4221 4321  
2221 2321 4221 4321  
2221 2321 4221 4321  
2221 2321 4221 4321  
2221 2321 4221 4321  
2221 2321 4221 4321  
2221 2321 4221 4321  
2221 2321 4221 4321  
2221 2321 4221 4321  
2221 2321 4221 4321  
2221 2321 4221 4321  
2221 2321 4221 4321  
2221 2321 4221 4321  
2221 2321 4221 4321  
2221 2321 4221 4321  
2221 2321 4221 4321  
---- 0000  
xxxx xxxx  
---- 0000  
N/A  
---- 0000  
uuuu uuuu  
---- 0000  
N/A  
---- uuuu  
uuuu uuuu  
---- uuuu  
N/A  
FSR1L  
BSR  
INDF2  
POSTINC2  
POSTDEC2  
PREINC2  
PLUSW2  
FSR2H  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
---- 0000  
xxxx xxxx  
---x xxxx  
0000 0000  
xxxx xxxx  
1111 1111  
0100 q000  
0-00 0101  
---- ---0  
0q-1 11q0  
xxxx xxxx  
xxxx xxxx  
0000 0000  
0000 0000  
1111 1111  
-000 0000  
xxxx xxxx  
0000 0000  
0000 0000  
0000 0000  
0000 0000  
---- 0000  
uuuu uuuu  
---u uuuu  
0000 0000  
uuuu uuuu  
1111 1111  
0100 q000  
0-00 0101  
---- ---0  
0q-q qquu  
uuuu uuuu  
uuuu uuuu  
u0uu uuuu  
0000 0000  
1111 1111  
-000 0000  
uuuu uuuu  
0000 0000  
0000 0000  
0000 0000  
0000 0000  
---- uuuu  
uuuu uuuu  
---u uuuu  
uuuu uuuu  
uuuu uuuu  
uuuu uuuu  
uuuu uuqu  
u-uu uuuu  
---- ---u  
uq-u qquu  
uuuu uuuu  
uuuu uuuu  
uuuu uuuu  
uuuu uuuu  
1111 1111  
-uuu uuuu  
uuuu uuuu  
uuuu uuuu  
uuuu uuuu  
uuuu uuuu  
uuuu uuuu  
FSR2L  
STATUS  
TMR0H  
TMR0L  
T0CON  
OSCCON  
HLVDCON  
WDTCON  
RCON(4)  
TMR1H  
TMR1L  
T1CON  
TMR2  
PR2  
T2CON  
SSPBUF  
SSPADD  
SSPSTAT  
SSPCON1  
SSPCON2  
Legend: u= unchanged, x= unknown, -= unimplemented bit, read as ‘0’, q= value depends on condition.  
Shaded cells indicate conditions do not apply for the designated device.  
Note 1: One or more bits in the INTCONx or PIRx registers will be affected (to cause wake-up).  
2: When the wake-up is due to an interrupt and the GIEL or GIEH bit is set, the PC is loaded with the interrupt  
vector (0008h or 0018h).  
3: When the wake-up is due to an interrupt and the GIEL or GIEH bit is set, the TOSU, TOSH and TOSL are  
updated with the current value of the PC. The STKPTR is modified to point to the next location in the  
hardware stack.  
4: See Table 5-3 for Reset value for specific condition.  
5: Bits 6 and 7 of PORTA, LATA and TRISA are enabled, depending on the oscillator mode selected. When  
not enabled as PORTA pins, they are disabled and read ‘0’.  
DS39689F-page 56  
© 2009 Microchip Technology Inc.  
PIC18F2221/2321/4221/4321 FAMILY  
TABLE 5-4:  
INITIALIZATION CONDITIONS FOR ALL REGISTERS (CONTINUED)  
MCLR Resets,  
Power-on Reset,  
Brown-out Reset  
WDT Reset,  
RESET Instruction,  
Stack Resets  
Wake-up via WDT  
or Interrupt  
Register  
Applicable Devices  
ADRESH  
ADRESL  
ADCON0  
ADCON1  
ADCON2  
CCPR1H  
CCPR1L  
CCP1CON  
2221 2321 4221 4321  
2221 2321 4221 4321  
2221 2321 4221 4321  
2221 2321 4221 4321  
2221 2321 4221 4321  
2221 2321 4221 4321  
2221 2321 4221 4321  
2221 2321 4221 4321  
2221 2321 4221 4321  
2221 2321 4221 4321  
2221 2321 4221 4321  
2221 2321 4221 4321  
2221 2321 4221 4321  
2221 2321 4221 4321  
2221 2321 4221 4321  
2221 2321 4221 4321  
2221 2321 4221 4321  
2221 2321 4221 4321  
2221 2321 4221 4321  
2221 2321 4221 4321  
2221 2321 4221 4321  
2221 2321 4221 4321  
2221 2321 4221 4321  
2221 2321 4221 4321  
2221 2321 4221 4321  
2221 2321 4221 4321  
2221 2321 4221 4321  
2221 2321 4221 4321  
2221 2321 4221 4321  
2221 2321 4221 4321  
2221 2321 4221 4321  
xxxx xxxx  
xxxx xxxx  
--00 0000  
--00 0qqq  
0-00 0000  
xxxx xxxx  
xxxx xxxx  
0000 0000  
--00 0000  
xxxx xxxx  
xxxx xxxx  
--00 0000  
0100 0-00  
0000 0000  
0000 0000  
0000 00--  
0000 0000  
0000 0111  
xxxx xxxx  
xxxx xxxx  
0000 0000  
0000 0000  
0000 0000  
0000 0000  
0000 0000  
0000 0010  
0000 000x  
0000 0000  
0000 0000  
0000 0000  
xx-0 x000  
uuuu uuuu  
uuuu uuuu  
--00 0000  
--00 0qqq  
0-00 0000  
uuuu uuuu  
uuuu uuuu  
0000 0000  
--00 0000  
uuuu uuuu  
uuuu uuuu  
--00 0000  
0100 0-00  
0000 0000  
0000 0000  
0000 00--  
0000 0000  
0000 0111  
uuuu uuuu  
uuuu uuuu  
uuuu uuuu  
0000 0000  
0000 0000  
0000 0000  
0000 0000  
0000 0010  
0000 000x  
0000 0000  
0000 0000  
0000 0000  
uu-0 u000  
uuuu uuuu  
uuuu uuuu  
--uu uuuu  
--uu uuuu  
u-uu uuuu  
uuuu uuuu  
uuuu uuuu  
uuuu uuuu  
--uu uuuu  
uuuu uuuu  
uuuu uuuu  
--uu uuuu  
--uu uuuu  
uuuu uuuu  
uuuu uuuu  
uuuu uu--  
uuuu uuuu  
uuuu uuuu  
uuuu uuuu  
uuuu uuuu  
uuuu uuuu  
uuuu uuuu  
uuuu uuuu  
uuuu uuuu  
uuuu uuuu  
uuuu uuuu  
uuuu uuuu  
uuuu uuuu  
uuuu uuuu  
0000 0000  
uu-0 u000  
CCPR2H  
CCPR2L  
CCP2CON  
BAUDCON  
ECCP1DEL  
ECCP1AS  
CVRCON  
CMCON  
TMR3H  
TMR3L  
T3CON  
SPBRGH  
SPBRG  
RCREG  
TXREG  
TXSTA  
RCSTA  
EEADR  
EEDATA  
EECON2  
EECON1  
Legend: u= unchanged, x= unknown, -= unimplemented bit, read as ‘0’, q= value depends on condition.  
Shaded cells indicate conditions do not apply for the designated device.  
Note 1: One or more bits in the INTCONx or PIRx registers will be affected (to cause wake-up).  
2: When the wake-up is due to an interrupt and the GIEL or GIEH bit is set, the PC is loaded with the interrupt  
vector (0008h or 0018h).  
3: When the wake-up is due to an interrupt and the GIEL or GIEH bit is set, the TOSU, TOSH and TOSL are  
updated with the current value of the PC. The STKPTR is modified to point to the next location in the  
hardware stack.  
4: See Table 5-3 for Reset value for specific condition.  
5: Bits 6 and 7 of PORTA, LATA and TRISA are enabled, depending on the oscillator mode selected. When  
not enabled as PORTA pins, they are disabled and read ‘0’.  
© 2009 Microchip Technology Inc.  
DS39689F-page 57  
PIC18F2221/2321/4221/4321 FAMILY  
TABLE 5-4:  
INITIALIZATION CONDITIONS FOR ALL REGISTERS (CONTINUED)  
MCLR Resets,  
Power-on Reset,  
Brown-out Reset  
WDT Reset,  
RESET Instruction,  
Stack Resets  
Wake-up via WDT  
or Interrupt  
Register  
Applicable Devices  
IPR2  
PIR2  
PIE2  
IPR1  
2221 2321 4221 4321  
2221 2321 4221 4321  
2221 2321 4221 4321  
2221 2321 4221 4321  
2221 2321 4221 4321  
2221 2321 4221 4321  
2221 2321 4221 4321  
2221 2321 4221 4321  
2221 2321 4221 4321  
2221 2321 4221 4321  
2221 2321 4221 4321  
2221 2321 4221 4321  
2221 2321 4221 4321  
2221 2321 4221 4321  
2221 2321 4221 4321  
2221 2321 4221 4321  
2221 2321 4221 4321  
2221 2321 4221 4321  
2221 2321 4221 4321  
2221 2321 4221 4321  
2221 2321 4221 4321  
2221 2321 4221 4321  
2221 2321 4221 4321  
2221 2321 4221 4321  
2221 2321 4221 4321  
2221 2321 4221 4321  
11-1 1111  
00-0 0000  
00-0 0000  
1111 1111  
-111 1111  
0000 0000  
-000 0000  
0000 0000  
-000 0000  
00-0 0000  
0000 -111  
1111 1111  
1111 1111  
1111 1111  
1111 1111(5)  
---- -xxx  
xxxx xxxx  
xxxx xxxx  
xxxx xxxx  
xxxx xxxx(5)  
---- xxxx  
---- x---  
xxxx xxxx  
xxxx xxxx  
xxxx xxxx  
xx0x 0000(5)  
11-1 1111  
00-0 0000  
00-0 0000  
1111 1111  
-111 1111  
0000 0000  
-000 0000  
0000 0000  
-000 0000  
00-0 0000  
0000 -111  
1111 1111  
1111 1111  
1111 1111  
1111 1111(5)  
---- -uuu  
uuuu uuuu  
uuuu uuuu  
uuuu uuuu  
uuuu uuuu(5)  
---- uuuu  
---- u---  
uuuu uuuu  
uuuu uuuu  
uuuu uuuu  
uu0u 0000(5)  
uu-u uuuu  
uu-u uuuu(1)  
uu-u uuuu  
uuuu uuuu  
-uuu uuuu  
uuuu uuuu(1)  
-uuu uuuu(1)  
uuuu uuuu  
-uuu uuuu  
uu-u uuuu  
uuuu -uuu  
uuuu uuuu  
uuuu uuuu  
uuuu uuuu  
uuuu uuuu(5)  
---- -uuu  
uuuu uuuu  
uuuu uuuu  
uuuu uuuu  
uuuu uuuu(5)  
---- uuuu  
---- u---  
uuuu uuuu  
uuuu uuuu  
uuuu uuuu  
uuuu uuuu(5)  
PIR1  
PIE1  
OSCTUNE  
TRISE  
TRISD  
TRISC  
TRISB  
TRISA(5)  
LATE  
LATD  
LATC  
LATB  
LATA(5)  
PORTE  
PORTD  
PORTC  
PORTB  
PORTA(5)  
Legend: u= unchanged, x= unknown, -= unimplemented bit, read as ‘0’, q= value depends on condition.  
Shaded cells indicate conditions do not apply for the designated device.  
Note 1: One or more bits in the INTCONx or PIRx registers will be affected (to cause wake-up).  
2: When the wake-up is due to an interrupt and the GIEL or GIEH bit is set, the PC is loaded with the interrupt  
vector (0008h or 0018h).  
3: When the wake-up is due to an interrupt and the GIEL or GIEH bit is set, the TOSU, TOSH and TOSL are  
updated with the current value of the PC. The STKPTR is modified to point to the next location in the  
hardware stack.  
4: See Table 5-3 for Reset value for specific condition.  
5: Bits 6 and 7 of PORTA, LATA and TRISA are enabled, depending on the oscillator mode selected. When  
not enabled as PORTA pins, they are disabled and read ‘0’.  
DS39689F-page 58  
© 2009 Microchip Technology Inc.  
PIC18F2221/2321/4221/4321 FAMILY  
6.1  
Program Memory Organization  
6.0  
MEMORY ORGANIZATION  
PIC18 microcontrollers implement a 21-bit program  
counter, which is capable of addressing a 2-Mbyte  
program memory space. Accessing a location between  
the upper boundary of the physically implemented  
memory and the 2-Mbyte address will return all ‘0’s (a  
NOPinstruction).  
There are three types of memory in PIC18 Enhanced  
microcontroller devices:  
• Program Memory  
• Data RAM  
• Data EEPROM  
As Harvard architecture devices, the data and program  
memories use separate busses; this allows for con-  
current access of the two memory spaces. The data  
EEPROM, for practical purposes, can be regarded as  
a peripheral device, since it is addressed and accessed  
through a set of control registers.  
The PIC18F2221 and PIC18F4221 each have 4 Kbytes  
of Flash memory and can store up to 2048 single-word  
instructions. The PIC18F2321 and PIC18F4321 each  
have 8 Kbytes of Flash memory and can store up to  
4096 single-word instructions.  
PIC18 devices have two interrupt vectors. The Reset  
vector address is at 0000h and the interrupt vector  
addresses are at 0008h and 0018h.  
Additional detailed information on the operation of the  
Flash program memory is provided in Section 7.0  
“Flash Program Memory”. Data EEPROM is  
discussed separately in Section 8.0 “Data EEPROM  
Memory”.  
The program memory maps for PIC18F2221/4221 and  
PIC18F2321/4321 devices are shown in Figure 6-1.  
FIGURE 6-1:  
PROGRAM MEMORY MAP AND STACK FOR PIC18F2221/2321/4221/4321 FAMILY  
DEVICES  
PIC18FX221  
PIC18FX321  
PC<20:0>  
PC<20:0>  
21  
21  
CALL,RCALL,RETURN  
RETFIE,RETLW  
CALL,RCALL,RETURN  
RETFIE,RETLW  
Stack Level 1  
Stack Level 1  
Stack Level 31  
Reset Vector  
Stack Level 31  
Reset Vector  
0000h  
0000h  
High-Priority Interrupt Vector  
Low-Priority Interrupt Vector  
0008h  
0018h  
High-Priority Interrupt Vector  
Low-Priority Interrupt Vector  
0008h  
0018h  
On-Chip  
Program Memory  
On-Chip  
Program Memory  
0FFFh  
1000h  
1FFFh  
2000h  
Read ‘0’  
Read ‘0’  
1FFFFFh  
200000h  
1FFFFFh  
200000h  
© 2009 Microchip Technology Inc.  
DS39689F-page 59  
PIC18F2221/2321/4221/4321 FAMILY  
The stack operates as a 31-word by 21-bit RAM and a  
5-bit Stack Pointer, STKPTR. The stack space is not  
part of either program or data space. The Stack Pointer  
is readable and writable and the address on the top of  
the stack is readable and writable through the Top-of-  
Stack Special Function Registers. Data can also be  
pushed to, or popped from the stack, using these  
registers.  
6.1.1  
PROGRAM COUNTER  
The Program Counter (PC) specifies the address of the  
instruction to fetch for execution. The PC is 21 bits wide  
and is contained in three separate 8-bit registers. The  
low byte, known as the PCL register, is both readable  
and writable. The high byte, or PCH register, contains  
the PC<15:8> bits; it is not directly readable or writable.  
Updates to the PCH register are performed through the  
PCLATH register. The upper byte is called PCU. This  
register contains the PC<20:16> bits; it is also not  
directly readable or writable. Updates to the PCU  
register are performed through the PCLATU register.  
A CALLtype instruction causes a push onto the stack;  
the Stack Pointer is first incremented and the location  
pointed to by the Stack Pointer is written with the  
contents of the PC (already pointing to the instruction  
following the CALL). A RETURNtype instruction causes  
a pop from the stack; the contents of the location  
pointed to by the STKPTR are transferred to the PC  
and then the Stack Pointer is decremented.  
The contents of PCLATH and PCLATU are transferred  
to the program counter by any operation that writes  
PCL. Similarly, the upper two bytes of the program  
counter are transferred to PCLATH and PCLATU by an  
operation that reads PCL. This is useful for computed  
offsets to the PC (see Section 6.1.4.1 “Computed  
GOTO”).  
The Stack Pointer is initialized to ‘00000’ after all  
Resets. There is no RAM associated with the location  
corresponding to a Stack Pointer value of ‘00000’; this  
is only a Reset value. Status bits indicate if the stack is  
full or has overflowed or has underflowed.  
The PC addresses bytes in the program memory. To  
prevent the PC from becoming misaligned with word  
instructions, the Least Significant bit of PCL is fixed to  
a value of ‘0’. The PC increments by 2 to address  
sequential instructions in the program memory.  
6.1.2.1  
Only the top of the return address stack (TOS) is  
readable and writable. set of three registers,  
Top-of-Stack Access  
A
The CALL, RCALL, GOTO and program branch  
instructions write to the program counter directly. For  
these instructions, the contents of PCLATH and  
PCLATU are not transferred to the program counter.  
TOSU:TOSH:TOSL, hold the contents of the stack  
location pointed to by the STKPTR register (Figure 6-2).  
This allows users to implement a software stack if  
necessary. After a CALL, RCALL or interrupt, the  
software can read the pushed value by reading the  
TOSU:TOSH:TOSL registers. These values can be  
placed on a user-defined software stack. At return time,  
the software can return these values to  
TOSU:TOSH:TOSL and do a return.  
6.1.2  
RETURN ADDRESS STACK  
The return address stack allows any combination of up  
to 31 program calls and interrupts to occur. The PC is  
pushed onto the stack when a CALLor RCALLinstruc-  
tion is executed or an interrupt is Acknowledged. The  
PC value is pulled off the stack on a RETURN, RETLW  
or a RETFIEinstruction. PCLATU and PCLATH are not  
affected by any of the RETURNor CALLinstructions.  
The user must disable the global interrupt enable bits  
while accessing the stack to prevent inadvertent stack  
corruption.  
FIGURE 6-2:  
RETURN ADDRESS STACK AND ASSOCIATED REGISTERS  
Return Address Stack <20:0>  
11111  
11110  
11101  
Top-of-Stack Registers  
Stack Pointer  
STKPTR<4:0>  
TOSU  
00h  
TOSH  
1Ah  
TOSL  
34h  
00010  
00011  
00010  
00001  
00000  
001A34h  
000D58h  
Top-of-Stack  
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When the stack has been popped enough times to  
unload the stack, the next pop will return a value of zero  
to the PC and sets the STKUNF bit, while the Stack  
Pointer remains at zero. The STKUNF bit will remain  
set until cleared by software or until a POR occurs.  
6.1.2.2  
Return Stack Pointer (STKPTR)  
The STKPTR register (Register 6-1) contains the Stack  
Pointer value, the STKFUL (Stack Full) status bit and  
the STKUNF (Stack Underflow) status bits. The value  
of the Stack Pointer can be 0 through 31. The Stack  
Pointer increments before values are pushed onto the  
stack and decrements after values are popped off the  
stack. On Reset, the Stack Pointer value will be zero.  
The user may read and write the Stack Pointer value.  
This feature can be used by a Real-Time Operating  
System (RTOS) for return stack maintenance.  
Note:  
Returning a value of zero to the PC on an  
underflow has the effect of vectoring the  
program to the Reset vector, where the  
stack conditions can be verified and  
appropriate actions can be taken. This is  
not the same as a Reset, as the contents  
of the SFRs are not affected.  
After the PC is pushed onto the stack 31 times (without  
popping any values off the stack), the STKFUL bit is  
set. The STKFUL bit is cleared by software or by a  
POR.  
6.1.2.3  
PUSHand POPInstructions  
Since the Top-of-Stack is readable and writable, the  
ability to push values onto the stack and pull values off  
the stack without disturbing normal program execution  
is a desirable feature. The PIC18 instruction set  
includes two instructions, PUSH and POP, that permit  
the TOS to be manipulated under software control.  
TOSU, TOSH and TOSL can be modified to place data  
or a return address on the stack.  
The action that takes place when the stack becomes  
full depends on the state of the STVREN (Stack  
Overflow Reset Enable) Configuration bit. (Refer to  
Section 24.1 “Configuration Bits” for a description of  
the device Configuration bits.) If STVREN is set  
(default), the 31st push will push the (PC + 2) value  
onto the stack, set the STKFUL bit and reset the  
device. The STKFUL bit will remain set and the Stack  
Pointer will be set to zero.  
The PUSHinstruction places the current PC value onto  
the stack. This increments the Stack Pointer and loads  
the current PC value onto the stack.  
If STVREN is cleared, the STKFUL bit will be set on the  
31st push and the Stack Pointer will increment to 31.  
Any additional pushes will not overwrite the 31st push  
and STKPTR will remain at 31.  
The POPinstruction discards the current TOS by decre-  
menting the Stack Pointer. The previous value pushed  
onto the stack then becomes the TOS value.  
REGISTER 6-1:  
STKPTR: STACK POINTER REGISTER  
R/C-0  
R/C-0  
U-0  
R/W-0  
SP4  
R/W-0  
SP3  
R/W-0  
SP2  
R/W-0  
SP1  
R/W-0  
SP0  
STKFUL(1) STKUNF(1)  
bit 7  
bit 0  
bit 7  
bit 6  
STKFUL: Stack Full Flag bit(1)  
1= Stack became full or overflowed  
0= Stack has not become full or overflowed  
STKUNF: Stack Underflow Flag bit(1)  
1= Stack underflow occurred  
0= Stack underflow did not occur  
bit 5  
Unimplemented: Read as ‘0’  
bit 4-0  
SP<4:0>: Stack Pointer Location bits  
Note 1: Bit 7 and bit 6 are cleared by user software or by a POR.  
Legend:  
R = Readable bit  
-n = Value at POR  
W = Writable bit  
‘1’ = Bit is set  
U = Unimplemented  
‘0’ = Bit is cleared  
C = Clearable only bit  
x = Bit is unknown  
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6.1.2.4  
Stack Full and Underflow Resets  
6.1.4  
LOOK-UP TABLES IN PROGRAM  
MEMORY  
Device Resets on stack overflow and stack underflow  
conditions are enabled by setting the STVREN bit in  
Configuration Register 4L. When STVREN is set, a full  
or underflow will set the appropriate STKFUL or  
STKUNF bit and then cause a device Reset. When  
STVREN is cleared, a full or underflow condition will set  
the appropriate STKFUL or STKUNF bit but not cause  
a device Reset. The STKFUL or STKUNF bits are  
cleared by the user software or a Power-on Reset.  
There may be programming situations that require the  
creation of data structures, or look-up tables, in  
program memory. For PIC18 devices, look-up tables  
can be implemented in two ways:  
• Computed GOTO  
Table Reads  
6.1.4.1  
Computed GOTO  
6.1.3  
FAST REGISTER STACK  
A computed GOTOis accomplished by adding an offset  
to the program counter. An example is shown in  
Example 6-2.  
A Fast Register Stack is provided for the STATUS,  
WREG and BSR registers, to provide a “fast return”  
option for interrupts. The stack for each register is only  
one level deep and is neither readable nor writable. It is  
loaded with the current value of the corresponding  
register when the processor vectors for an interrupt. All  
interrupt sources will push values into the stack regis-  
ters. The values in the registers are then loaded back  
into their associated registers if the RETFIE, FAST  
instruction is used to return from the interrupt.  
A look-up table can be formed with an ADDWF PCL  
instruction and a group of RETLW nninstructions. The  
W register is loaded with an offset into the table before  
executing a call to that table. The first instruction of the  
called routine is the ADDWF PCLinstruction. The next  
instruction executed will be one of the RETLW nn  
instructions that returns the value ‘nn’ to the calling  
function.  
If both low and high-priority interrupts are enabled, the  
stack registers cannot be used reliably to return from  
low-priority interrupts. If a high-priority interrupt occurs  
while servicing a low-priority interrupt, the Stack regis-  
ter values stored by the low-priority interrupt will be  
overwritten. In these cases, users must save the key  
registers in software during a low-priority interrupt.  
The offset value (in WREG) specifies the number of  
bytes that the program counter should advance and  
should be multiples of 2 (LSb = 0).  
In this method, only one data byte may be stored in  
each instruction location and room on the return  
address stack is required.  
If interrupt priority is not used, all interrupts may use the  
Fast Register Stack for returns from interrupt. If no  
interrupts are used, the Fast Register Stack can be  
used to restore the STATUS, WREG and BSR registers  
at the end of a subroutine call. To use the Fast Register  
Stack for a subroutine call, a CALL label, FAST  
instruction must be executed to save the STATUS,  
WREG and BSR registers to the Fast Register Stack. A  
RETURN, FASTinstruction is then executed to restore  
these registers from the Fast Register Stack.  
EXAMPLE 6-2:  
COMPUTED GOTO USING  
AN OFFSET VALUE  
OFFSET, W  
TABLE  
MOVF  
CALL  
ORG  
TABLE  
nn00h  
ADDWF  
RETLW  
RETLW  
RETLW  
.
PCL  
nnh  
nnh  
nnh  
.
.
Example 6-1 shows a source code example that uses  
the Fast Register Stack during a subroutine call and  
return.  
6.1.4.2  
Table Reads and Table Writes  
A better method of storing data in program memory  
allows two bytes of data to be stored in each instruction  
location.  
EXAMPLE 6-1:  
FAST REGISTER STACK  
CODE EXAMPLE  
CALL SUB1, FAST  
;STATUS, WREG, BSR  
;SAVED IN FAST REGISTER  
;STACK  
Look-up table data may be stored two bytes per  
program word by using table reads and writes. The  
Table Pointer (TBLPTR) register specifies the byte  
address and the Table Latch (TABLAT) register  
contains the data that is read from or written to program  
memory. Data is transferred to or from program  
memory one byte at a time.  
SUB1  
RETURN, FAST ;RESTORE VALUES SAVED  
;IN FAST REGISTER STACK  
Table read and table write operations are discussed  
further in Section 7.1 “Table Reads and Table  
Writes”.  
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6.2.2  
INSTRUCTION FLOW/PIPELINING  
6.2  
PIC18 Instruction Cycle  
An “Instruction Cycle” consists of four Q cycles: Q1  
through Q4. The instruction fetch and execute are  
pipelined in such a manner that a fetch takes one  
instruction cycle, while the decode and execute take  
another instruction cycle. However, due to the pipe-  
lining, each instruction effectively executes in one  
cycle. If an instruction causes the program counter to  
change (e.g., GOTO), then two cycles are required to  
complete the instruction (Example 6-3).  
6.2.1  
CLOCKING SCHEME  
The microcontroller clock input, whether from an  
internal or external source, is internally divided by four  
to generate four non-overlapping quadrature clocks  
(Q1, Q2, Q3 and Q4). Internally, the program counter is  
incremented on every Q1; the instruction is fetched  
from the program memory and latched into the  
Instruction Register (IR) during Q4. The instruction is  
decoded and executed during the following Q1 through  
Q4. The clocks and instruction execution flow are  
shown in Figure 6-3.  
A fetch cycle begins with the Program Counter (PC)  
incrementing in Q1.  
In the execution cycle, the fetched instruction is latched  
into the Instruction Register (IR) in cycle Q1. This  
instruction is then decoded and executed during the  
Q2, Q3 and Q4 cycles. Data memory is read during Q2  
(operand read) and written during Q4 (destination  
write).  
FIGURE 6-3:  
CLOCK/INSTRUCTION CYCLE  
Q2  
Q3  
Q4  
Q2  
Q3  
Q4  
Q2  
Q3  
Q4  
Q1  
Q1  
Q1  
OSC1  
Q1  
Q2  
Q3  
Q4  
Internal  
Phase  
Clock  
PC  
PC  
PC + 2  
PC + 4  
OSC2/CLKO  
(RC mode)  
Execute INST (PC – 2)  
Fetch INST (PC)  
Execute INST (PC)  
Fetch INST (PC + 2)  
Execute INST (PC + 2)  
Fetch INST (PC + 4)  
EXAMPLE 6-3:  
INSTRUCTION PIPELINE FLOW  
TCY0  
TCY1  
TCY2  
TCY3  
TCY4  
TCY5  
1. MOVLW 55h  
2. MOVWF PORTB  
3. BRA SUB_1  
Fetch 1  
Execute 1  
Fetch 2  
Execute 2  
Fetch 3  
Execute 3  
Fetch 4  
4. BSF  
PORTA, BIT3 (Forced NOP)  
Flush (NOP)  
5. Instruction @ address SUB_1  
Fetch SUB_1 Execute SUB_1  
All instructions are single cycle, except for any program branches. These take two cycles since the fetch instruction  
is “flushed” from the pipeline while the new instruction is being fetched and then executed.  
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The CALL and GOTO instructions have the absolute  
program memory address embedded into the instruc-  
tion. Since instructions are always stored on word  
boundaries, the data contained in the instruction is a  
word address. The word address is written to PC<20:1>,  
which accesses the desired byte address in program  
memory. Instruction #2 in Figure 6-4 shows how the  
instruction GOTO 0006h is encoded in the program  
memory. Program branch instructions, which encode a  
relative address offset, operate in the same manner. The  
offset value stored in a branch instruction represents the  
number of single-word instructions that the PC will be  
offset by. Section 24.0 “Instruction Set Summary”  
provides further details of the instruction set.  
6.2.3  
INSTRUCTIONS IN PROGRAM  
MEMORY  
The program memory is addressed in bytes. Instruc-  
tions are stored as two bytes or four bytes in program  
memory. The Least Significant Byte of an instruction  
word is always stored in a program memory location  
with an even address (LSb = 0). To maintain alignment  
with instruction boundaries, the PC increments in steps  
of 2 and the LSb will always read ‘0’ (see Section 6.1.1  
“Program Counter”).  
Figure 6-4 shows an example of how instruction words  
are stored in the program memory.  
FIGURE 6-4:  
INSTRUCTIONS IN PROGRAM MEMORY  
Word Address  
LSB = 1  
LSB = 0  
Program Memory  
Byte Locations →  
000000h  
000002h  
000004h  
000006h  
000008h  
00000Ah  
00000Ch  
00000Eh  
000010h  
000012h  
000014h  
Instruction 1:  
Instruction 2:  
MOVLW  
GOTO  
055h  
0006h  
0Fh  
EFh  
F0h  
C1h  
F4h  
55h  
03h  
00h  
23h  
56h  
Instruction 3:  
MOVFF  
123h, 456h  
the instruction sequence. If the first word is skipped for  
some reason and the second word is executed by itself,  
a NOPis executed instead. This is necessary for cases  
when the two-word instruction is preceded by a condi-  
tional instruction that changes the PC. Example 6-4  
shows how this works.  
6.2.4  
TWO-WORD INSTRUCTIONS  
The standard PIC18 instruction set has four two-word  
instructions: CALL, MOVFF, GOTO and LSFR. In all  
cases, the second word of the instructions always has  
1111’ as its four Most Significant bits; the other 12 bits  
are literal data, usually a data memory address.  
Note:  
See Section 6.6 “PIC18 Instruction  
Execution and the Extended Instruc-  
tion Set” for information on two-word  
instructions in the extended instruction set.  
The use of ‘1111’ in the 4 MSbs of an instruction spec-  
ifies a special form of NOP. If the instruction is executed  
in proper sequence – immediately after the first word –  
the data in the second word is accessed and used by  
EXAMPLE 6-4:  
CASE 1:  
TWO-WORD INSTRUCTIONS  
Source Code  
Object Code  
0110 0110 0000 0000 TSTFSZ  
REG1  
REG1, REG2 ; No, skip this word  
; Execute this word as a NOP  
; continue code  
; is RAM location 0?  
1100 0001 0010 0011  
1111 0100 0101 0110  
0010 0100 0000 0000  
CASE 2:  
MOVFF  
ADDWF  
REG3  
Object Code  
Source Code  
0110 0110 0000 0000  
1100 0001 0010 0011  
1111 0100 0101 0110  
0010 0100 0000 0000  
TSTFSZ  
MOVFF  
REG1  
; is RAM location 0?  
REG1, REG2 ; Yes, execute this word  
; 2nd word of instruction  
ADDWF  
REG3  
; continue code  
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6.3.1  
BANK SELECT REGISTER (BSR)  
6.3  
Data Memory Organization  
Large areas of data memory require an efficient  
addressing scheme to make rapid access to any  
address possible. Ideally, this means that an entire  
address does not need to be provided for each read or  
write operation. For PIC18 devices, this is accomplished  
with a RAM banking scheme. This divides the memory  
space into 16 contiguous banks of 256 bytes. Depend-  
ing on the instruction, each location can be addressed  
directly by its full 12-bit address, or an 8-bit low-order  
address and a 4-bit Bank Pointer.  
Note:  
The operation of some aspects of data  
memory are changed when the PIC18  
extended instruction set is enabled. See  
Section 6.5 “Data Memory and the  
Extended Instruction Set” for more  
information.  
The data memory in PIC18 devices is implemented as  
static RAM. Each register in the data memory has a  
12-bit address, allowing up to 4096 bytes of data  
memory. The memory space is divided into as many as  
16 banks that contain 256 bytes each; PIC18F2221/  
2321/4221/4321 family devices implement 2 banks.  
Figure 6-5 shows the data memory organization for the  
PIC18F2221/2321/4221/4321 family devices.  
Most instructions in the PIC18 instruction set make use  
of the Bank Pointer, known as the Bank Select Register  
(BSR). This SFR holds the four Most Significant bits of  
a location’s address; the instruction itself includes the  
8 Least Significant bits. Only the four lower bits of the  
BSR are implemented (BSR3:BSR0). The upper four  
bits are unused; they will always read ‘0’ and cannot be  
written to. The BSR can be loaded directly by using the  
MOVLBinstruction.  
The data memory contains Special Function Registers  
(SFRs) and General Purpose Registers (GPRs). The  
SFRs are used for control and status of the controller  
and peripheral functions, while GPRs are used for data  
storage and scratchpad operations in the user’s  
application. Any read of an unimplemented location will  
read as ‘0’s.  
The value of the BSR indicates the bank in data  
memory; the 8 bits in the instruction show the location  
in the bank and can be thought of as an offset from the  
bank’s lower boundary. The relationship between the  
BSR’s value and the bank division in data memory is  
shown in Figure 6-6.  
The instruction set and architecture allow operations  
across all banks. The entire data memory may be  
accessed by Direct, Indirect or Indexed Addressing  
modes. Addressing modes are discussed later in this  
subsection.  
Since up to 16 registers may share the same low-order  
address, the user must always be careful to ensure that  
the proper bank is selected before performing a data  
read or write. For example, writing what should be  
program data to an 8-bit address of F9h, while the BSR  
is 0Fh, will end up resetting the program counter.  
To ensure that commonly used registers (SFRs and  
select GPRs) can be accessed in a single cycle, PIC18  
devices implement an Access Bank. This is a 256-byte  
memory space that provides fast access to SFRs and  
the lower portion of GPR Bank 0 without using the  
While any bank can be selected, only those banks that  
are actually implemented can be read or written to.  
Writes to unimplemented banks are ignored, while  
reads from unimplemented banks will return ‘0’s. Even  
so, the STATUS register will still be affected as if the  
operation was successful. The data memory map in  
Figure 6-5 indicates which banks are implemented.  
BSR. Section 6.3.2 “Access Bank” provides  
detailed description of the Access RAM.  
a
In the core PIC18 instruction set, only the MOVFF  
instruction fully specifies the 12-bit address of the  
source and target registers. This instruction ignores the  
BSR completely when it executes. All other instructions  
include only the low-order address as an operand and  
must use either the BSR or the Access Bank to locate  
their target registers.  
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FIGURE 6-5:  
DATA MEMORY MAP FOR PIC18F2221/2321/4221/4321 FAMILY DEVICES  
When a = 0,  
The BSR is ignored and the  
Access Bank is used.  
The first 128 bytes are  
General Purpose RAM  
(from Bank 0).  
BSR<3:0>  
Data Memory Map  
The second 128 bytes are  
Special Function Registers  
(from Bank 15).  
000h  
00h  
FFh  
Access RAM  
GPR  
= 0000  
= 0001  
07Fh  
080h  
0FFh  
Bank 0  
Bank 1  
When a = 1,  
100h  
GPR  
The BSR specifies the Bank  
used by the instruction.  
1FFh  
Access Bank  
00h  
Access RAM Low  
7Fh  
80h  
= 0010  
= 1110  
Bank 2  
to  
Bank 14  
Access RAM High  
(SFRs)  
Unused  
Read ‘00h’  
FFh  
EFFh  
F00h  
F7Fh  
F80h  
FFFh  
00h  
FFh  
Unused  
SFR  
= 1111  
Bank 15  
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FIGURE 6-6:  
USE OF THE BANK SELECT REGISTER (DIRECT ADDRESSING)  
(2)  
(1)  
From Opcode  
BSR  
7
0
7
0
Memory  
Data  
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
1
000h  
100h  
200h  
00h  
Bank 0  
(2)  
FFh  
00h  
Bank Select  
Bank 1  
FFh  
00h  
Bank 2  
through  
Bank 14  
F00h  
FFFh  
00h  
FFh  
Bank 15  
Note 1: The Access RAM bit of the instruction can be used to force an override of the selected bank (BSR<3:0>) to  
the registers of the Access Bank.  
2: The MOVFF instruction embeds the entire 12-bit address in the instruction.  
however, the instruction is forced to use the Access  
Bank address map; the current value of the BSR is  
ignored entirely.  
6.3.2  
ACCESS BANK  
While the use of the BSR with an embedded 8-bit  
address allows users to address the entire range of  
data memory, it also means that the user must always  
ensure that the correct bank is selected. Otherwise,  
data may be read from or written to the wrong location.  
This can be disastrous if a GPR is the intended target  
of an operation, but an SFR is written to instead.  
Verifying and/or changing the BSR for each read or  
write to data memory can become very inefficient.  
Using this “forced” addressing allows the instruction to  
operate on a data address in a single cycle, without  
updating the BSR first. For 8-bit addresses of 80h and  
above, this means that users can evaluate and operate  
on SFRs more efficiently. The Access RAM below 80h  
is a good place for data values that the user might need  
to access rapidly, such as immediate computational  
results or common program variables. Access RAM  
also allows for faster and more code efficient context  
saving and switching of variables.  
To streamline access for the most commonly used data  
memory locations, the data memory is configured with  
an Access Bank, which allows users to access a  
mapped block of memory without specifying a BSR.  
The Access Bank consists of the first 128 bytes of  
memory (00h-7Fh) in Bank 0 and the last 128 bytes of  
memory (80h-FFh) in Block 15. The lower half is known  
as the “Access RAM” and is composed of GPRs. This  
upper half is also where the device’s SFRs are  
mapped. These two areas are mapped contiguously in  
the Access Bank and can be addressed in a linear  
fashion by an 8-bit address (Figure 6-5).  
The mapping of the Access Bank is slightly different  
when the extended instruction set is enabled (XINST  
Configuration bit = 1). This is discussed in more detail  
in Section 6.5.3 “Mapping the Access Bank in  
Indexed Literal Offset Addressing Mode”.  
6.3.3  
GENERAL PURPOSE  
REGISTER FILE  
PIC18 devices may have banked memory in the GPR  
area. This is data RAM which is available for use by all  
instructions. GPRs start at the bottom of Bank 0  
(address 000h) and grow upwards towards the bottom of  
the SFR area. GPRs are not initialized by a Power-on  
Reset and are unchanged on all other Resets.  
The Access Bank is used by core PIC18 instructions  
that include the Access RAM bit (the ‘a’ parameter in  
the instruction). When ‘a’ is equal to ‘1’, the instruction  
uses the BSR and the 8-bit address included in the  
opcode for the data memory address. When ‘a’ is ‘0’,  
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The SFRs can be classified into two sets: those associ-  
ated with the “core” device functionality (ALU, Resets  
and interrupts) and those related to the peripheral  
functions. The reset and interrupt registers are  
described in their respective chapters, while the ALU’s  
STATUS register is described later in this section.  
Registers related to the operation of a peripheral feature  
are described in the chapter for that peripheral.  
6.3.4  
SPECIAL FUNCTION REGISTERS  
The Special Function Registers (SFRs) are registers  
used by the CPU and peripheral modules for controlling  
the desired operation of the device. These registers are  
implemented as static RAM. SFRs start at the top of  
data memory (FFFh) and extend downward to occupy  
the top half of Bank 15 (F80h to FFFh). A list of these  
registers is given in Table 6-1 and Table 6-2.  
The SFRs are typically distributed among the  
peripherals whose functions they control. Unused SFR  
locations are unimplemented and read as ‘0’s.  
TABLE 6-1:  
Address  
SPECIAL FUNCTION REGISTER MAP FOR PIC18F2221/2321/4221/4321 FAMILY  
DEVICES  
Name  
Address  
Name  
INDF2(1)  
Address  
FBFh  
FBEh  
Name  
Address  
F9Fh  
Name  
FFFh  
FFEh  
FFDh  
FFCh  
FFBh  
FFAh  
FF9h  
FF8h  
FF7h  
FF6h  
FF5h  
FF4h  
FF3h  
FF2h  
FF1h  
FF0h  
FEFh  
TOSU  
TOSH  
FDFh  
CCPR1H  
CCPR1L  
IPR1  
PIR1  
PIE1  
FDEh POSTINC2(1)  
FDDh POSTDEC2(1)  
FDCh PREINC2(1)  
FDBh PLUSW2(1)  
F9Eh  
F9Dh  
F9Ch  
TOSL  
FBDh CCP1CON  
(2)  
STKPTR  
PCLATU  
PCLATH  
PCL  
FBCh  
FBBh  
CCPR2H  
CCPR2L  
F9Bh OSCTUNE  
(2)  
FDAh  
FD9h  
FD8h  
FD7h  
FD6h  
FD5h  
FD4h  
FD3h  
FSR2H  
FSR2L  
FBAh CCP2CON  
F9Ah  
F99h  
F98h  
F97h  
F96h  
F95h  
F94h  
F93h  
F92h  
F91h  
F90h  
F8Fh  
F8Eh  
F8Dh  
F8Ch  
F8Bh  
F8Ah  
F89h  
F88h  
F87h  
F86h  
F85h  
F84h  
F83h  
F82h  
F81h  
F80h  
(2)  
(2)  
(2)  
(2)  
FB9h  
TBLPTRU  
TBLPTRH  
TBLPTRL  
TABLAT  
PRODH  
PRODL  
INTCON  
INTCON2  
INTCON3  
INDF0(1)  
STATUS  
TMR0H  
TMR0L  
T0CON  
FB8h BAUDCON  
FB7h ECCP1DEL(3)  
FB6h ECCP1AS(3)  
TRISE(3)  
TRISD(3)  
TRISC  
FB5h  
FB4h  
FB3h  
FB2h  
FB1h  
FB0h  
FAFh  
FAEh  
FADh  
FACh  
FABh  
FAAh  
FA9h  
FA8h  
CVRCON  
CMCON  
TMR3H  
TMR3L  
T3CON  
SPBRGH  
SPBRG  
RCREG  
TXREG  
TXSTA  
(2)  
OSCCON  
TRISB  
FD2h HLVDCON  
TRISA  
(2)  
FD1h  
FD0h  
FCFh  
FCEh  
FCDh  
FCCh  
FCBh  
FCAh  
FC9h  
FC8h  
FC7h  
FC6h  
FC5h  
FC4h  
FC3h  
FC2h  
FC1h  
FC0h  
WDTCON  
RCON  
(2)  
(2)  
TMR1H  
FEEh POSTINC0(1)  
FEDh POSTDEC0(1)  
FECh PREINC0(1)  
FEBh PLUSW0(1)  
TMR1L  
(2)  
T1CON  
LATE(3)  
LATD(3)  
LATC  
TMR2  
PR2  
RCSTA  
(2)  
FEAh  
FE9h  
FE8h  
FE7h  
FE6h POSTINC1(1)  
FE5h POSTDEC1(1)  
FE4h PREINC1(1)  
FE3h PLUSW1(1)  
FSR0H  
FSR0L  
WREG  
INDF1(1)  
T2CON  
LATB  
SSPBUF  
SSPADD  
SSPSTAT  
SSPCON1  
SSPCON2  
ADRESH  
ADRESL  
ADCON0  
ADCON1  
ADCON2  
EEADR  
LATA  
(2)  
EEDATA  
FA7h EECON2(1)  
(2)  
(2)  
FA6h  
FA5h  
FA4h  
FA3h  
FA2h  
FA1h  
FA0h  
EECON1  
(2)  
(2)  
(2)  
PORTE  
PORTD(3)  
PORTC  
PORTB  
PORTA  
(2)  
FE2h  
FE1h  
FE0h  
FSR1H  
FSR1L  
BSR  
IPR2  
PIR2  
PIE2  
Note 1: This is not a physical register.  
2: Unimplemented registers are read as ‘0’.  
3: This register is not available on 28-pin devices.  
DS39689F-page 68  
© 2009 Microchip Technology Inc.  
PIC18F2221/2321/4221/4321 FAMILY  
TABLE 6-2:  
File Name  
TOSU  
REGISTER FILE SUMMARY (PIC18F2221/2321/4221/4321)  
Value on Details on  
Bit 7  
Bit 6  
Bit 5  
Bit 4  
Bit 3  
Bit 2  
Bit 1  
Bit 0  
POR, BOR  
page:  
Top-of-Stack Upper Byte (TOS<20:16>)  
---0 0000  
0000 0000  
0000 0000  
00-0 0000  
--00 0000  
0000 0000  
0000 0000  
--00 0000  
0000 0000  
0000 0000  
0000 0000  
xxxx xxxx  
xxxx xxxx  
0000 000x  
55, 60  
55, 60  
55, 60  
55, 61  
55, 60  
55, 60  
55, 60  
55, 82  
55, 82  
55, 82  
55, 82  
55, 95  
55, 95  
55, 99  
TOSH  
Top-of-Stack High Byte (TOS<15:8>)  
TOSL  
Top-of-Stack Low Byte (TOS<7:0>)  
STKPTR  
PCLATU  
PCLATH  
PCL  
STKFUL(6) STKUNF(6)  
SP4  
SP3  
SP2  
SP1  
SP0  
Holding Register for PC<21:16>  
Holding Register for PC<15:8>  
PC Low Byte (PC<7:0>)  
TBLPTRU  
bit 21  
Program Memory Table Pointer Upper Byte (TBLPTR<20:16>)  
TBLPTRH Program Memory Table Pointer High Byte (TBLPTR<15:8>)  
TBLPTRL  
TABLAT  
PRODH  
PRODL  
Program Memory Table Pointer Low Byte (TBLPTR<7:0>)  
Program Memory Table Latch  
Product Register High Byte  
Product Register Low Byte  
INTCON  
INTCON2  
INTCON3  
INDF0  
GIE/GIEH  
RBPU  
PEIE/GIEL  
INTEDG0  
INT1IP  
TMR0IE  
INTEDG1  
INT0IE  
INTEDG2  
INT2IE  
RBIE  
TMR0IF  
TMR0IP  
INT0IF  
RBIF  
RBIP  
1111 -1-1 55, 100  
11-0 0-00 55, 101  
INT2IP  
INT1IE  
INT2IF  
INT1IF  
Uses contents of FSR0 to address data memory – value of FSR0 not changed (not a physical register)  
N/A  
N/A  
N/A  
N/A  
N/A  
55, 74  
55, 74  
55, 74  
55, 74  
55, 74  
POSTINC0 Uses contents of FSR0 to address data memory – value of FSR0 post-incremented (not a physical register)  
POSTDEC0 Uses contents of FSR0 to address data memory – value of FSR0 post-decremented (not a physical register)  
PREINC0  
PLUSW0  
Uses contents of FSR0 to address data memory – value of FSR0 pre-incremented (not a physical register)  
Uses contents of FSR0 to address data memory – value of FSR0 pre-incremented (not a physical register) –  
value of FSR0 offset by W  
FSR0H  
FSR0L  
WREG  
INDF1  
Indirect Data Memory Address Pointer 0 High Byte  
---- 0000  
xxxx xxxx  
xxxx xxxx  
N/A  
55, 74  
55, 74  
55  
Indirect Data Memory Address Pointer 0 Low Byte  
Working Register  
Uses contents of FSR1 to address data memory – value of FSR1 not changed (not a physical register)  
55, 74  
55, 74  
55, 74  
55, 74  
55, 74  
POSTINC1 Uses contents of FSR1 to address data memory – value of FSR1 post-incremented (not a physical register)  
POSTDEC1 Uses contents of FSR1 to address data memory – value of FSR1 post-decremented (not a physical register)  
N/A  
N/A  
PREINC1  
PLUSW1  
Uses contents of FSR1 to address data memory – value of FSR1 pre-incremented (not a physical register)  
N/A  
Uses contents of FSR1 to address data memory – value of FSR1 pre-incremented (not a physical register) –  
value of FSR1 offset by W  
N/A  
FSR1H  
FSR1L  
BSR  
Indirect Data Memory Address Pointer 1 High Byte  
---- 0000  
xxxx xxxx  
---- 0000  
N/A  
56, 74  
56, 74  
56, 65  
56, 74  
56, 74  
56, 74  
56, 74  
56, 74  
Indirect Data Memory Address Pointer 1 Low Byte  
Bank Select Register  
INDF2  
Uses contents of FSR2 to address data memory – value of FSR2 not changed (not a physical register)  
POSTINC2 Uses contents of FSR2 to address data memory – value of FSR2 post-incremented (not a physical register)  
POSTDEC2 Uses contents of FSR2 to address data memory – value of FSR2 post-decremented (not a physical register)  
N/A  
N/A  
PREINC2  
PLUSW2  
Uses contents of FSR2 to address data memory – value of FSR2 pre-incremented (not a physical register)  
N/A  
Uses contents of FSR2 to address data memory – value of FSR2 pre-incremented (not a physical register) –  
value of FSR2 offset by W  
N/A  
FSR2H  
FSR2L  
STATUS  
Indirect Data Memory Address Pointer 2 High Byte  
---- 0000  
xxxx xxxx  
---x xxxx  
56, 74  
56, 74  
56, 72  
Indirect Data Memory Address Pointer 2 Low Byte  
N
OV  
Z
DC  
C
Legend:  
x= unknown, u= unchanged, = unimplemented, q= value depends on condition  
Note 1:  
The SBOREN bit is only available when the BOREN<1:0> Configuration bits = 01; otherwise, it is disabled and reads as ‘0’. See  
Section 5.4 “Brown-out Reset (BOR)”.  
2:  
3:  
4:  
5:  
6:  
These registers and/or bits are not implemented on 28-pin devices and are read as ‘0’. Reset values are shown for 40/44-pin devices;  
individual unimplemented bits should be interpreted as ‘-’.  
The PLLEN bit is only available in specific oscillator configurations; otherwise, it is disabled and reads as ‘0’. See Section 3.6.4 “PLL in  
INTOSC Modes”.  
The RE3 bit is only available when Master Clear Reset is disabled (MCLRE Configuration bit = 0); otherwise, RE3 reads as ‘0’. This bit is  
read-only.  
RA6/RA7 and their associated latch and direction bits are individually configured as port pins based on various primary oscillator modes.  
When disabled, these bits read as ‘0’.  
Bit 7 and bit 6 are cleared by user software or by a POR.  
© 2009 Microchip Technology Inc.  
DS39689F-page 69  
PIC18F2221/2321/4221/4321 FAMILY  
TABLE 6-2:  
REGISTER FILE SUMMARY (PIC18F2221/2321/4221/4321) (CONTINUED)  
Value on Details on  
POR, BOR page:  
File Name  
Bit 7  
Bit 6  
Bit 5  
Bit 4  
Bit 3  
Bit 2  
Bit 1  
Bit 0  
TMR0H  
Timer0 Register High Byte  
Timer0 Register Low Byte  
0000 0000 56, 131  
xxxx xxxx 56, 131  
1111 1111 56, 129  
TMR0L  
T0CON  
TMR0ON  
IDLEN  
T08BIT  
IRCF2  
T0CS  
IRCF1  
IRVST  
T0SE  
IRCF0  
HLVDEN  
PSA  
OSTS  
HLVDL3  
T0PS2  
IOFS  
T0PS1  
SCS1  
HLVDL1  
T0PS0  
SCS0  
OSCCON  
HLVDCON  
WDTCON  
0100 q000  
0-00 0101 56, 253  
--- ---0 56, 270  
37, 56  
VDIRMAG  
HLVDL2  
HLVDL0  
SWDTEN  
RCON  
TMR1H  
TMR1L  
T1CON  
TMR2  
IPEN  
SBOREN(1)  
RI  
TO  
PD  
POR  
BOR  
0q-1 11q0 48, 54, 108  
xxxx xxxx 56, 137  
xxxx xxxx 56, 137  
Timer1 Register High Byte  
Timer1 Register Low Byte  
RD16  
T1RUN  
T1CKPS1  
T1CKPS0  
T1OSCEN  
T1SYNC  
TMR2ON  
TMR1CS  
T2CKPS1  
TMR1ON 0000 0000 56, 133  
0000 0000 56, 140  
Timer2 Register  
PR2  
Timer2 Period Register  
T2OUTPS3 T2OUTPS2 T2OUTPS1 T2OUTPS0  
MSSP Receive Buffer/Transmit Register  
1111 1111 56, 140  
T2CON  
SSPBUF  
T2CKPS0 -000 0000 56, 139  
xxxx xxxx 56, 175,  
176  
SSPADD  
SSPSTAT  
MSSP Address Register in I2C™ Slave mode. MSSP Baud Rate Reload Register in I2C Master mode.  
0000 0000 56, 176  
SMP  
WCOL  
GCEN  
CKE  
D/A  
P
S
R/W  
UA  
BF  
0000 0000 56, 168,  
177  
SSPCON1  
SSPCON2  
SSPOV  
ACKSTAT  
SSPEN  
CKP  
SSPM3  
SSPM2  
SSPM1  
SSPM0  
SEN  
0000 0000 56, 169,  
178  
ACKDT/  
ACKEN/  
RCEN/  
PEN/  
RSEN/  
0000 0000 56, 179  
ADMSK5  
ADMSK4  
ADMSK3  
ADMSK2  
ADMSK1  
ADRESH  
ADRESL  
A/D Result Register High Byte  
A/D Result Register Low Byte  
xxxx xxxx 57, 242  
xxxx xxxx 57, 242  
ADCON0  
ADCON1  
ADCON2  
CCPR1H  
CCPR1L  
CCP1CON  
CHS3  
VCFG1  
ACQT2  
CHS2  
VCFG0  
ACQT1  
CHS1  
PCFG3  
ACQT0  
CHS0  
PCFG2  
ADCS2  
GO/DONE  
PCFG1  
ADON  
PCFG0  
ADCS0  
--00 0000 57, 233  
--00 0qqq 57, 234  
0-00 0000 57, 235  
xxxx xxxx 57, 146  
xxxx xxxx 57, 146  
ADFM  
ADCS1  
Capture/Compare/PWM Register 1 High Byte  
Capture/Compare/PWM Register 1 Low Byte  
P1M1(2)  
P1M0(2)  
DC1B1  
DC1B0  
CCP1M3  
CCP1M2  
CCP1M1  
CCP1M0 0000 0000 57, 145,  
153  
CCPR2H  
CCPR2L  
CCP2CON  
BAUDCON  
ECCP1DEL  
ECCP1AS  
CVRCON  
CMCON  
Capture/Compare/PWM Register 2 High Byte  
Capture/Compare/PWM Register 2 Low Byte  
xxxx xxxx 57, 146  
xxxx xxxx 57, 146  
DC2B1  
RXDTP  
PDC5(2)  
ECCPAS1  
CVRR  
DC2B0  
TXCKP  
PDC4(2)  
ECCPAS0  
CVRSS  
C1INV  
CCP2M3  
BRG16  
PDC3(2)  
PSSAC1  
CVR3  
CCP2M2  
PDC2(2)  
PSSAC0  
CVR2  
CM2  
CCP2M1  
WUE  
PDC1(2)  
PSSBD1(2)  
CVR1  
CCP2M0 --00 0000 57, 145  
ABDOVF  
PRSEN  
ECCPASE  
CVREN  
C2OUT  
RCIDL  
ABDEN  
PDC0(2)  
0100 0-00 57, 214  
0000 0000 57, 162  
PSSBD0(2) 0000 0000 57, 163  
PDC6(2)  
ECCPAS2  
CVROE  
C1OUT  
CVR0  
CM0  
0000 0000 57, 249  
0000 0111 57, 243  
xxxx xxxx 57, 143  
xxxx xxxx 57, 143  
C2INV  
CIS  
CM1  
TMR3H  
Timer3 Register High Byte  
Timer3 Register Low Byte  
TMR3L  
T3CON  
RD16  
T3CCP2  
T3CKPS1  
T3CKPS0  
T3CCP1  
T3SYNC  
TMR3CS  
TMR3ON 0000 0000 57, 141  
Legend:  
x= unknown, u= unchanged, = unimplemented, q= value depends on condition  
Note 1:  
The SBOREN bit is only available when the BOREN<1:0> Configuration bits = 01; otherwise, it is disabled and reads as ‘0’. See  
Section 5.4 “Brown-out Reset (BOR)”.  
2:  
3:  
4:  
5:  
6:  
These registers and/or bits are not implemented on 28-pin devices and are read as ‘0’. Reset values are shown for 40/44-pin devices;  
individual unimplemented bits should be interpreted as ‘-’.  
The PLLEN bit is only available in specific oscillator configurations; otherwise, it is disabled and reads as ‘0’. See Section 3.6.4 “PLL in  
INTOSC Modes”.  
The RE3 bit is only available when Master Clear Reset is disabled (MCLRE Configuration bit = 0); otherwise, RE3 reads as ‘0’. This bit is  
read-only.  
RA6/RA7 and their associated latch and direction bits are individually configured as port pins based on various primary oscillator modes.  
When disabled, these bits read as ‘0’.  
Bit 7 and bit 6 are cleared by user software or by a POR.  
DS39689F-page 70  
© 2009 Microchip Technology Inc.  
PIC18F2221/2321/4221/4321 FAMILY  
TABLE 6-2:  
REGISTER FILE SUMMARY (PIC18F2221/2321/4221/4321) (CONTINUED)  
Value on Details on  
File Name  
Bit 7  
Bit 6  
Bit 5  
Bit 4  
Bit 3  
Bit 2  
Bit 1  
Bit 0  
POR, BOR  
page:  
SPBRGH  
SPBRG  
RCREG  
TXREG  
TXSTA  
RCSTA  
EEADR  
EEDATA  
EECON2  
EECON1  
IPR2  
EUSART Baud Rate Generator Register High Byte  
EUSART Baud Rate Generator Register Low Byte  
EUSART Receive Register  
0000 0000 57, 216  
0000 0000 57, 216  
0000 0000 57, 224  
0000 0000 57, 221  
0000 0010 57, 212  
0000 000x 57, 213  
0000 0000 57, 80, 89  
0000 0000 57, 80, 89  
0000 0000 57, 80, 89  
xx-0 x000 57, 81, 90  
11-1 1111 58, 107  
00-0 0000 58, 103  
00-0 0000 58, 105  
1111 1111 58, 106  
0000 0000 58, 102  
0000 0000 58, 104  
EUSART Transmit Register  
CSRC  
SPEN  
TX9  
RX9  
TXEN  
SREN  
SYNC  
CREN  
SENDB  
ADDEN  
BRGH  
FERR  
TRMT  
OERR  
TX9D  
RX9D  
EEPROM Address Register  
EEPROM Data Register  
EEPROM Control Register 2 (not a physical register)  
EEPGD  
OSCFIP  
OSCFIF  
OSCFIE  
PSPIP(2)  
PSPIF(2)  
PSPIE(2)  
INTSRC  
IBF  
CFGS  
CMIP  
CMIF  
CMIE  
ADIP  
FREE  
EEIP  
WRERR  
BCLIP  
BCLIF  
BCLIE  
SSPIP  
SSPIF  
SSPIE  
TUN3  
WREN  
HLVDIP  
HLVDIF  
HLVDIE  
CCP1IP  
CCP1IF  
CCP1IE  
TUN2  
WR  
RD  
TMR3IP  
TMR3IF  
TMR3IE  
TMR2IP  
TMR2IF  
TMR2IE  
TUN1  
CCP2IP  
CCP2IF  
CCP2IE  
TMR1IP  
TMR1IF  
TMR1IE  
TUN0  
PIR2  
EEIF  
PIE2  
EEIE  
IPR1  
RCIP  
RCIF  
RCIE  
TXIP  
PIR1  
ADIF  
TXIF  
PIE1  
ADIE  
PLLEN(3)  
TXIE  
OSCTUNE  
TRISE(2)  
TRISD(2)  
TRISC  
TRISB  
TUN4  
PSPMODE  
00-0 0000  
33, 58  
OBF  
IBOV  
TRISE2  
TRISE1  
TRISE0  
0000 -111 58, 124  
1111 1111 58, 120  
PORTD Data Direction Control Register  
PORTC Data Direction Control Register  
PORTB Data Direction Control Register  
1111 1111  
1111 1111  
1111 1111  
58, 117  
58, 114  
58, 111  
TRISA  
TRISA7(5)  
TRISA6(5) PORTA Data Direction Control Register  
LATE(2)  
PORTE Data Latch Register  
---- -xxx 58, 123  
(Read and Write to Data Latch)  
LATD(2)  
LATC  
PORTD Data Latch Register (Read and Write to Data Latch)  
PORTC Data Latch Register (Read and Write to Data Latch)  
PORTB Data Latch Register (Read and Write to Data Latch)  
xxxx xxxx 58, 120  
xxxx xxxx  
xxxx xxxx  
xxxx xxxx  
58, 117  
58, 114  
58, 111  
LATB  
LATA  
LATA7(5)  
LATA6(5) PORTA Data Latch Register (Read and Write to Data Latch)  
PORTE  
PORTD(2)  
PORTC  
PORTB  
PORTA  
RE3(4)  
RD3  
RC3  
RB3  
RE2(2)  
RD2  
RC2  
RB2  
RE1(2)  
RD1  
RC1  
RB1  
RE0(2)  
RD0  
RC0  
RB0  
---- xxxx 58, 123  
xxxx xxxx 58, 120  
RD7  
RD6  
RC6  
RB6  
RD5  
RC5  
RB5  
RA5  
RD4  
RC4  
RB4  
RA4  
RC7  
xxxx xxxx  
xxxx xxxx  
xx0x 0000  
58, 117  
58, 114  
58, 111  
RB7  
RA7(5)  
RA6(5)  
RA3  
RA2  
RA1  
RA0  
Legend:  
x= unknown, u= unchanged, = unimplemented, q= value depends on condition  
Note 1:  
The SBOREN bit is only available when the BOREN<1:0> Configuration bits = 01; otherwise, it is disabled and reads as ‘0’. See  
Section 5.4 “Brown-out Reset (BOR)”.  
2:  
3:  
4:  
5:  
6:  
These registers and/or bits are not implemented on 28-pin devices and are read as ‘0’. Reset values are shown for 40/44-pin devices;  
individual unimplemented bits should be interpreted as ‘-’.  
The PLLEN bit is only available in specific oscillator configurations; otherwise, it is disabled and reads as ‘0’. See Section 3.6.4 “PLL in  
INTOSC Modes”.  
The RE3 bit is only available when Master Clear Reset is disabled (MCLRE Configuration bit = 0); otherwise, RE3 reads as ‘0’. This bit is  
read-only.  
RA6/RA7 and their associated latch and direction bits are individually configured as port pins based on various primary oscillator modes.  
When disabled, these bits read as ‘0’.  
Bit 7 and bit 6 are cleared by user software or by a POR.  
© 2009 Microchip Technology Inc.  
DS39689F-page 71  
PIC18F2221/2321/4221/4321 FAMILY  
It is recommended that only BCF, BSF, SWAPF, MOVFF  
and MOVWFinstructions are used to alter the STATUS  
register, because these instructions do not affect the Z,  
C, DC, OV or N bits in the STATUS register.  
6.3.5  
STATUS REGISTER  
The STATUS register, shown in Register 6-2, contains  
the arithmetic status of the ALU. As with any other SFR,  
it can be the operand for any instruction.  
For other instructions that do not affect Status bits, see  
the instruction set summaries in Table 24-2 and  
Table 24-3.  
If the STATUS register is the destination for an instruc-  
tion that affects the Z, DC, C, OV or N bits, the results  
of the instruction are not written; instead, the STATUS  
register is updated according to the instruction  
performed. Therefore, the result of an instruction with  
the STATUS register as its destination may be different  
than intended. As an example, CLRF STATUSwill set  
Note:  
The C and DC bits operate as the borrow  
and digit borrow bits, respectively, in  
subtraction.  
the  
Z bit and leave the remaining Status bits  
unchanged (‘000u u1uu’).  
REGISTER 6-2:  
STATUS REGISTER  
U-0  
U-0  
U-0  
R/W-x  
R/W-x  
OV  
R/W-x  
Z
R/W-x  
DC  
R/W-x  
C
N
bit 7  
bit 0  
bit 7-5  
bit 4  
Unimplemented: Read as ‘0’  
N: Negative bit  
This bit is used for signed arithmetic (2’s complement). It indicates whether the result was  
negative (ALU MSB = 1).  
1= Result was negative  
0= Result was positive  
bit 3  
OV: Overflow bit  
This bit is used for signed arithmetic (2’s complement). It indicates an overflow of the 7-bit  
magnitude which causes the sign bit (bit 7 of the result) to change state.  
1= Overflow occurred for signed arithmetic (in this arithmetic operation)  
0= No overflow occurred  
bit 2  
bit 1  
Z: Zero bit  
1= The result of an arithmetic or logic operation is zero  
0= The result of an arithmetic or logic operation is not zero  
DC: Digit Carry/borrow bit  
For ADDWF, ADDLW, SUBLWand SUBWFinstructions:  
1= A carry-out from the 4th low-order bit of the result occurred  
0= No carry-out from the 4th low-order bit of the result  
Note:  
For borrow, the polarity is reversed. A subtraction is executed by adding the 2’s  
complement of the second operand. For rotate (RRF, RLF) instructions, this bit is  
loaded with either bit 4 or bit 3 of the source register.  
bit 0  
C: Carry/borrow bit  
For ADDWF, ADDLW, SUBLWand SUBWFinstructions:  
1= A carry-out from the Most Significant bit of the result occurred  
0= No carry-out from the Most Significant bit of the result occurred  
Note:  
For borrow, the polarity is reversed. A subtraction is executed by adding the 2’s  
complement of the second operand. For rotate (RRF, RLF) instructions, this bit is  
loaded with either the high or low-order bit of the source register.  
Legend:  
R = Readable bit  
-n = Value at POR  
W = Writable bit  
‘1’ = Bit is set  
U = Unimplemented bit, read as ‘0’  
‘0’ = Bit is cleared x = Bit is unknown  
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The Access RAM bit ‘a’ determines how the address is  
6.4  
Data Addressing Modes  
interpreted. When ‘a’ is ‘1’, the contents of the BSR  
(Section 6.3.1 “Bank Select Register (BSR)”) are  
used with the address to determine the complete 12-bit  
address of the register. When ‘a’ is ‘0’, the address is  
interpreted as being a register in the Access Bank.  
Addressing that uses the Access RAM is sometimes  
also known as Direct Forced Addressing mode.  
Note:  
The execution of some instructions in the  
core PIC18 instruction set are changed  
when the PIC18 extended instruction set is  
enabled. See Section 6.5 “Data Memory  
and the Extended Instruction Set” for  
more information.  
A few instructions, such as MOVFF, include the entire  
12-bit address (either source or destination) in their  
opcodes. In these cases, the BSR is ignored entirely.  
The data memory space can be addressed in several  
ways. For most instructions, the addressing mode is  
fixed. Other instructions may use up to three modes,  
depending on which operands are used and whether or  
not the extended instruction set is enabled.  
The destination of the operation’s results is determined  
by the destination bit ‘d’. When ‘d’ is ‘1’, the results are  
stored back in the source register, overwriting its origi-  
nal contents. When ‘d’ is ‘0’, the results are stored in  
the W register. Instructions without the ‘d’ argument  
have a destination that is implicit in the instruction; their  
destination is either the target register being operated  
on or the W register.  
The addressing modes are:  
• Inherent  
• Literal  
• Direct  
• Indirect  
An additional addressing mode, Indexed Literal Offset,  
is available when the extended instruction set is  
enabled (XINST Configuration bit = 1). Its operation is  
discussed in greater detail in Section 6.5.1 “Indexed  
Addressing with Literal Offset”.  
6.4.3  
INDIRECT ADDRESSING  
Indirect addressing allows the user to access a location  
in data memory without giving a fixed address in the  
instruction. This is done by using File Select Registers  
(FSRs) as pointers to the locations to be read or written  
to. Since the FSRs are themselves located in RAM as  
Special Function Registers, they can also be directly  
manipulated under program control. This makes FSRs  
very useful in implementing data structures, such as  
tables and arrays in data memory.  
6.4.1  
INHERENT AND LITERAL  
ADDRESSING  
Many PIC18 control instructions do not need any  
argument at all; they either perform an operation that  
globally affects the device or they operate implicitly on  
one register. This addressing mode is known as Inherent  
Addressing. Examples include SLEEP, RESETand DAW.  
The registers for indirect addressing are also  
implemented with Indirect File Operands (INDFs) that  
permit automatic manipulation of the pointer value with  
auto-incrementing, auto-decrementing or offsetting  
with another value. This allows for efficient code, using  
loops, such as the example of clearing an entire RAM  
bank in Example 6-5.  
Other instructions work in a similar way but require an  
additional explicit argument in the opcode. This is  
known as Literal Addressing mode because they  
require some literal value as an argument. Examples  
include ADDLWand MOVLW, which respectively, add or  
move a literal value to the W register. Other examples  
include CALL and GOTO, which include a 20-bit  
program memory address.  
EXAMPLE 6-5:  
HOW TO CLEAR RAM  
(BANK 1) USING  
INDIRECT ADDRESSING  
6.4.2  
DIRECT ADDRESSING  
LFSR  
FSR0, 100h ;  
NEXT  
CLRF  
POSTINC0  
; Clear INDF  
Direct addressing specifies all or part of the source  
and/or destination address of the operation within the  
opcode itself. The options are specified by the  
arguments accompanying the instruction.  
; register then  
; inc pointer  
; All done with  
; Bank1?  
; NO, clear next  
; YES, continue  
BTFSS FSR0H, 1  
BRA NEXT  
In the core PIC18 instruction set, bit-oriented and byte-  
oriented instructions use some version of direct  
addressing by default. All of these instructions include  
some 8-bit literal address as their Least Significant  
Byte. This address specifies either a register address in  
one of the banks of data RAM (Section 6.3.3 “General  
Purpose Register File”) or a location in the Access  
Bank (Section 6.3.2 “Access Bank”) as the data  
source for the instruction.  
CONTINUE  
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6.4.3.1  
FSR Registers and the  
INDF Operand  
6.4.3.2  
FSR Registers and POSTINC,  
POSTDEC, PREINC and PLUSW  
At the core of indirect addressing are three sets of  
registers: FSR0, FSR1 and FSR2. Each represents a  
pair of 8-bit registers, FSRnH and FSRnL. The four  
upper bits of the FSRnH register are not used so each  
FSR pair holds a 12-bit value. This represents a value  
that can address the entire range of the data memory  
in a linear fashion. The FSR register pairs, then, serve  
as pointers to data memory locations.  
In addition to the INDF operand, each FSR register pair  
also has four additional indirect operands. Like INDF,  
these are “virtual” registers that cannot be indirectly  
read or written to. Accessing these registers actually  
accesses the associated FSR register pair, but also  
performs a specific action on its stored value. They are:  
• POSTDEC: accesses the FSR value, then  
automatically decrements it by 1 afterwards  
Indirect addressing is accomplished with a set of  
Indirect File Operands, INDF0 through INDF2. These  
can be thought of as “virtual” registers: they are  
mapped in the SFR space but are not physically imple-  
mented. Reading or writing to a particular INDF register  
actually accesses its corresponding FSR register pair.  
A read from INDF1, for example, reads the data at the  
address indicated by FSR1H:FSR1L. Instructions that  
use the INDF registers as operands actually use the  
contents of their corresponding FSR as a pointer to the  
instruction’s target. The INDF operand is just a  
convenient way of using the pointer.  
• POSTINC: accesses the FSR value, then  
automatically increments it by 1 afterwards  
• PREINC: increments the FSR value by 1, then  
uses it in the operation  
• PLUSW: adds the signed value of the W register  
(range of -127 to 128) to that of the FSR and uses  
the new value in the operation.  
In this context, accessing an INDF register uses the  
value in the FSR registers without changing them. Sim-  
ilarly, accessing a PLUSW register gives the FSR value  
offset by that in the W register; neither value is actually  
changed in the operation. Accessing the other virtual  
registers changes the value of the FSR registers.  
Because indirect addressing uses a full 12-bit address,  
data RAM banking is not necessary. Thus, the current  
contents of the BSR and the Access RAM bit have no  
effect on determining the target address.  
Operations on the FSRs with POSTDEC, POSTINC  
and PREINC affect the entire register pair; that is, roll-  
overs of the FSRnL register from FFh to 00h carry over  
to the FSRnH register. On the other hand, results of  
these operations do not change the value of any flags  
in the STATUS register (e.g., Z, N, OV, etc.).  
FIGURE 6-7:  
INDIRECT ADDRESSING  
000h  
Using an instruction with one of the  
indirect addressing registers as the  
operand....  
Bank 0  
Bank 1  
ADDWF, INDF1, 1  
100h  
200h  
300h  
Bank 2  
FSR1H:FSR1L  
...uses the 12-bit address stored in  
the FSR pair associated with that  
register....  
7
0
7
0
Bank 3  
through  
Bank 13  
x x x x 1 1 1 0  
1 1 0 0 1 1 0 0  
...to determine the data memory  
location to be used in that operation.  
E00h  
In this case, the FSR1 pair contains  
ECCh. This means the contents of  
location ECCh will be added to that  
of the W register and stored back in  
ECCh.  
Bank 14  
Bank 15  
F00h  
FFFh  
Data Memory  
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The PLUSW register can be used to implement a form  
of indexed addressing in the data memory space. By  
manipulating the value in the W register, users can  
reach addresses that are fixed offsets from pointer  
addresses. In some applications, this can be used to  
implement some powerful program control structure,  
such as software stacks, inside of data memory.  
6.5.1  
INDEXED ADDRESSING WITH  
LITERAL OFFSET  
Enabling the PIC18 extended instruction set changes  
the behavior of indirect addressing using the FSR2  
register pair within Access RAM. Under the proper  
conditions, instructions that use the Access Bank – that  
is, most bit-oriented and byte-oriented instructions – can  
invoke a form of indexed addressing using an offset  
specified in the instruction. This special addressing  
mode is known as Indexed Addressing with Literal  
Offset, or Indexed Literal Offset mode.  
6.4.3.3  
Operations by FSRs on FSRs  
Indirect addressing operations that target other FSRs or  
virtual registers represent special cases. For example,  
using an FSR to point to one of the virtual registers will  
not result in successful operations. As a specific case,  
assume that FSR0H:FSR0L contains FE7h, the address  
of INDF1. Attempts to read the value of the INDF1 using  
INDF0 as an operand will return 00h. Attempts to write  
to INDF1 using INDF0 as the operand will result in a NOP.  
When using the extended instruction set, this  
addressing mode requires the following:  
• The use of the Access Bank is forced (‘a’ = 0);  
and  
• The file address argument is less than or equal to  
5Fh.  
On the other hand, using the virtual registers to write to  
an FSR pair may not occur as planned. In these cases,  
the value will be written to the FSR pair but without any  
incrementing or decrementing. Thus, writing to INDF2  
or POSTDEC2 will write the same value to the  
FSR2H:FSR2L.  
Under these conditions, the file address of the instruc-  
tion is not interpreted as the lower byte of an address  
(used with the BSR in direct addressing), or as an 8-bit  
address in the Access Bank. Instead, the value is  
interpreted as an offset value to an Address Pointer,  
specified by FSR2. The offset and the contents of  
FSR2 are added to obtain the target address of the  
operation.  
Since the FSRs are physical registers mapped in the  
SFR space, they can be manipulated through all direct  
operations. Users should proceed cautiously when  
working on these registers, particularly if their code  
uses indirect addressing.  
6.5.2  
INSTRUCTIONS AFFECTED BY  
INDEXED LITERAL OFFSET MODE  
Similarly, operations by indirect addressing are generally  
permitted on all other SFRs. Users should exercise the  
appropriate caution that they do not inadvertently  
change settings that might affect the operation of the  
device.  
Any of the core PIC18 instructions that can use direct  
addressing are potentially affected by the Indexed  
Literal Offset Addressing mode. This includes all  
byte-oriented and bit-oriented instructions, or almost  
one-half of the standard PIC18 instruction set.  
Instructions that only use Inherent or Literal Addressing  
modes are unaffected.  
6.5  
Data Memory and the Extended  
Instruction Set  
Additionally, byte-oriented and bit-oriented instructions  
are not affected if they do not use the Access Bank  
(Access RAM bit is ‘1’), or include a file address of 60h  
or above. Instructions meeting these criteria will  
continue to execute as before. A comparison of the dif-  
ferent possible addressing modes when the extended  
instruction set is enabled is shown in Figure 6-8.  
Enabling the PIC18 extended instruction set (XINST  
Configuration bit = 1) significantly changes certain  
aspects of data memory and its addressing. Specifically,  
the use of the Access Bank for many of the core PIC18  
instructions is different. This is due to the introduction of  
a new addressing mode for the data memory space.  
What does not change is just as important. The size of  
the data memory space is unchanged, as well as its  
linear addressing. The SFR map remains the same.  
Core PIC18 instructions can still operate in both Direct  
and Indirect Addressing mode; inherent and literal  
instructions do not change at all. Indirect addressing  
with FSR0 and FSR1 also remain unchanged.  
Those who desire to use bit-oriented or byte-oriented  
instructions in the Indexed Literal Offset mode should  
note the changes to assembler syntax for this mode.  
This is described in more detail in Section 24.2.1  
“Extended Instruction Syntax”.  
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FIGURE 6-8:  
COMPARING ADDRESSING OPTIONS FOR BIT-ORIENTED AND  
BYTE-ORIENTED INSTRUCTIONS (EXTENDED INSTRUCTION SET ENABLED)  
EXAMPLE INSTRUCTION: ADDWF, f, d, a (Opcode: 0010 01da ffff ffff)  
000h  
When ‘a’ = 0 and ‘f’ 60h:  
060h  
080h  
The instruction executes in  
Direct Forced mode. ‘f’ is inter-  
preted as a location in the  
Access RAM between 060h  
and 0FFh. This is the same as  
locations 060h to 07Fh  
(Bank 0) and F80h to FFFh  
(Bank 15) of data memory.  
Bank 0  
100h  
00h  
Bank 1  
through  
Bank 14  
60h  
80h  
Valid range  
for ‘f’  
FFh  
F00h  
Access RAM  
Locations below 60h are not  
available in this addressing  
mode.  
Bank 15  
SFRs  
F80h  
FFFh  
Data Memory  
When ‘a’ = 0 and ‘f’ 5Fh:  
000h  
080h  
100h  
Bank 0  
The instruction executes in  
Indexed Literal Offset mode. ‘f’  
is interpreted as an offset to the  
address value in FSR2. The  
two are added together to  
obtain the address of the target  
register for the instruction. The  
address can be anywhere in  
the data memory space.  
001001da ffffffff  
Bank 1  
through  
Bank 14  
FSR2H  
FSR2L  
F00h  
F80h  
Note that in this mode, the  
correct syntax is now:  
Bank 15  
SFRs  
ADDWF [k], d  
where ‘k’ is the same as ‘f’.  
FFFh  
Data Memory  
BSR  
000h  
080h  
100h  
00000000  
When ‘a’ = 1 (all values of ‘f’):  
Bank 0  
The instruction executes in  
Direct mode (also known as  
Direct Long mode). ‘f’ is inter-  
preted as a location in one of  
the 16 banks of the data  
memory space. The bank is  
designated by the Bank Select  
Register (BSR). The address  
can be in any implemented  
bank in the data memory  
space.  
001001da ffffffff  
Bank 1  
through  
Bank 14  
F00h  
F80h  
Bank 15  
SFRs  
FFFh  
Data Memory  
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Remapping of the Access Bank applies only to opera-  
tions using the Indexed Literal Offset Addressing  
mode. Operations that use the BSR (Access RAM bit is  
1’) will continue to use direct addressing as before.  
6.5.3  
MAPPING THE ACCESS BANK IN  
INDEXED LITERAL OFFSET  
ADDRESSING MODE  
The use of Indexed Literal Offset Addressing mode  
effectively changes how the first 96 locations of Access  
RAM (00h to 5Fh) are mapped. Rather than containing  
just the contents of the bottom half of Bank 0, this mode  
maps the contents from Bank 0 and a user-defined  
“window” that can be located anywhere in the data  
memory space. The value of FSR2 establishes the  
lower boundary of the addresses mapped into the  
window, while the upper boundary is defined by FSR2  
plus 95 (5Fh). Addresses in the Access RAM above  
5Fh are mapped as previously described (see  
Section 6.3.2 “Access Bank”). An example of Access  
Bank remapping in this addressing mode is shown in  
Figure 6-9.  
6.6  
PIC18 Instruction Execution and  
the Extended Instruction Set  
Enabling the extended instruction set adds eight  
additional commands to the existing PIC18 instruction  
set. These instructions are executed as described in  
Section 24.2 “Extended Instruction Set”.  
FIGURE 6-9:  
REMAPPING THE ACCESS BANK WITH INDEXED LITERAL OFFSET  
ADDRESSING MODE  
Example Situation:  
ADDWF f, d, a  
000h  
Bank 0  
05Fh  
07Fh  
FSR2H:FSR2L = 120h  
Locations in the region  
from the FSR2 Pointer  
(120h) to the pointer plus  
05Fh (17Fh) are mapped  
to the bottom of the  
Access RAM (000h-05Fh).  
Bank 0  
Bank 1  
Window  
100h  
120h  
17Fh  
00h  
Bank 1  
Bank 1 “Window”  
200h  
5Fh  
Locations in Bank 0, from  
060h to 07Fh, are mapped  
as usual to the middle of  
the Access Bank.  
Bank 0  
7Fh  
80h  
Bank 2  
through  
Bank 14  
SFRs  
Special Function Regis-  
ters at F80h through FFFh  
are mapped to 80h  
through FFh, as usual.  
FFh  
Access Bank  
F00h  
Bank 0 addresses below  
5Fh can still be addressed  
by using the BSR.  
Bank 15  
SFRs  
F80h  
FFFh  
Data Memory  
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NOTES:  
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7.1  
Table Reads and Table Writes  
7.0  
FLASH PROGRAM MEMORY  
In order to read and write program memory, there are  
two operations that allow the processor to move bytes  
between the program memory space and the data RAM:  
The Flash program memory is readable, writable and  
erasable during normal operation over the entire VDD  
range.  
Table Read (TBLRD)  
Table Write (TBLWT)  
A read from program memory is executed on one byte  
at a time. A write to program memory is executed on  
blocks of 8 bytes at a time. Program memory is erased  
in blocks of 64 bytes at a time. A bulk erase operation  
may not be issued from user code.  
The program memory space is 16 bits wide, while the  
data RAM space is 8 bits wide. Table reads and table  
writes move data between these two memory spaces  
through an 8-bit register (TABLAT).  
Writing or erasing program memory will cease  
instruction fetches until the operation is complete. The  
program memory cannot be accessed during the write  
or erase, therefore, code cannot execute. An internal  
programming timer terminates program memory writes  
and erases.  
Table read operations retrieve data from program  
memory and place it into the data RAM space.  
Figure 7-1 shows the operation of a table read with  
program memory and data RAM.  
Table write operations store data from the data memory  
space into holding registers in program memory. The  
procedure to write the contents of the holding registers  
into program memory is detailed in Section 7.5 “Writing  
to Flash Program Memory”. Figure 7-2 shows the  
operation of a table write with program memory and data  
RAM.  
A value written to program memory does not need to be  
a valid instruction. Executing a program memory  
location that forms an invalid instruction results in a  
NOP.  
Table operations work with byte entities. A table block  
containing data, rather than program instructions, is not  
required to be word-aligned. Therefore, a table block can  
start and end at any byte address. If a table write is being  
used to write executable code into program memory,  
program instructions will need to be word-aligned.  
FIGURE 7-1:  
TABLE READ OPERATION  
Instruction: TBLRD*  
Program Memory  
(1)  
Table Pointer  
Table Latch (8-bit)  
TABLAT  
TBLPTRU TBLPTRH TBLPTRL  
Program Memory  
(TBLPTR)  
Note 1: Table Pointer register points to a byte in program memory.  
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FIGURE 7-2:  
TABLE WRITE OPERATION  
Instruction: TBLWT*  
Program Memory  
Holding Registers  
(1)  
Table Pointer  
Table Latch (8-bit)  
TABLAT  
TBLPTRU TBLPTRH TBLPTRL  
Program Memory  
(TBLPTR)  
Note 1: Table Pointer actually points to one of 64 holding registers, the address of which is determined by  
TBLPTRL<5:0>. The process for physically writing data to the program memory array is discussed in  
Section 7.5 “Writing to Flash Program Memory”.  
The FREE bit, when set, will allow a program memory  
erase operation. When FREE is set, the erase  
operation is initiated on the next WR command. When  
FREE is clear, only writes are enabled.  
7.2  
Control Registers  
Several control registers are used in conjunction with  
the TBLRDand TBLWTinstructions. These include the:  
• EECON1 register  
• EECON2 register  
• TABLAT register  
• TBLPTR registers  
The WREN bit, when set, will allow a write operation.  
On power-up, the WREN bit is clear. The WRERR bit is  
set in hardware when the WR bit is set and cleared  
when the internal programming timer expires and the  
write operation is complete.  
7.2.1  
EECON1 AND EECON2 REGISTERS  
Note:  
During normal operation, the WRERR bit  
may read as ‘1’. This can indicate that a  
write operation was prematurely termi-  
nated by a Reset, or a write operation was  
attempted improperly.  
The EECON1 register (Register 7-1) is the control  
register for memory accesses. The EECON2 register is  
not a physical register; it is used exclusively in the  
memory write and erase sequences. Reading  
EECON2 will read all ‘0’s.  
The WR control bit initiates write operations. The bit  
cannot be cleared, only set, in software; it is cleared in  
hardware at the completion of the write operation.  
The EEPGD control bit determines if the access will be  
a program or data EEPROM memory access. When  
clear, any subsequent operations will operate on the  
data EEPROM memory. When set, any subsequent  
operations will operate on the program memory.  
Note:  
The EEIF interrupt flag bit (PIR2<4>) is set  
when the write is complete. It must be  
cleared in software.  
The CFGS control bit determines if the access will be  
to the Configuration/Calibration registers or to program  
memory/data EEPROM memory. When set,  
subsequent operations will operate on Configuration  
registers regardless of EEPGD (see Section 24.0  
“Special Features of the CPU”). When clear, memory  
selection access is determined by EEPGD.  
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REGISTER 7-1:  
EECON1: DATA EEPROM CONTROL REGISTER 1  
R/W-x  
R/W-x  
CFGS  
U-0  
R/W-0  
FREE  
R/W-x  
R/W-0  
WREN  
R/S-0  
WR  
R/S-0  
RD  
EEPGD  
WRERR  
bit 7  
bit 0  
bit 7  
bit 6  
EEPGD: Flash Program or Data EEPROM Memory Select bit  
1= Access Flash program memory  
0= Access data EEPROM memory  
CFGS: Flash Program/Data EEPROM or Configuration Select bit  
1= Access Configuration registers  
0= Access Flash program or data EEPROM memory  
bit 5  
bit 4  
Unimplemented: Read as ‘0’  
FREE: Flash Row Erase Enable bit  
1= Erase the program memory row addressed by TBLPTR on the next WR command  
(cleared by completion of erase operation)  
0= Perform write-only  
bit 3  
WRERR: Flash Program/Data EEPROM Error Flag bit  
1= A write operation is prematurely terminated (any Reset during self-timed programming in  
normal operation, or an improper write attempt)  
0= The write operation completed  
Note:  
When a WRERR occurs, the EEPGD and CFGS bits are not cleared.  
This allows tracing of the error condition.  
bit 2  
bit 1  
WREN: Flash Program/Data EEPROM Write Enable bit  
1= Allows write cycles to Flash program/data EEPROM  
0= Inhibits write cycles to Flash program/data EEPROM  
WR: Write Control bit  
1= Initiates a data EEPROM erase/write cycle or a program memory erase/write cycle.  
(The operation is self-timed and the bit is cleared by hardware once write is complete.  
The WR bit can only be set (not cleared) in software.)  
0= Write cycle to the EEPROM is complete  
bit 0  
RD: Read Control bit  
1= Initiates an EEPROM read (Read takes one cycle. RD is cleared in hardware. The RD bit can  
only be set (not cleared) in software. RD bit cannot be set when EEPGD = 1or CFGS = 1.)  
0= Does not initiate an EEPROM read  
Legend:  
R = Readable bit  
S = Bit can be set by software, but not cleared U = Unimplemented bit, read as ‘0’  
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown  
W = Writable bit  
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7.2.2  
TABLAT – TABLE LATCH REGISTER  
7.2.4  
TABLE POINTER BOUNDARIES  
The Table Latch (TABLAT) is an 8-bit register mapped  
into the SFR space. The Table Latch register is used to  
hold 8-bit data during data transfers between program  
memory and data RAM.  
TBLPTR is used in reads, writes and erases of the  
Flash program memory.  
When a TBLRDis executed, all 22 bits of the TBLPTR  
determine which byte is read from program memory  
into TABLAT.  
7.2.3  
TBLPTR – TABLE POINTER  
REGISTER  
When the timed write to program memory begins (via  
the WR bit), the 19 MSbs of the TBLPTR  
(TBLPTR<21:3>) determine which program memory  
block of 8 bytes is written to. The Table Pointer regis-  
ter’s three LSBs (TBLPTR<2:0>) are ignored. For more  
detail, see Section 7.5 “Writing to Flash Program  
Memory”.  
The Table Pointer (TBLPTR) register addresses a byte  
within the program memory. The TBLPTR is comprised  
of three SFR registers: Table Pointer Upper Byte, Table  
Pointer High Byte and Table Pointer Low Byte  
(TBLPTRU:TBLPTRH:TBLPTRL). These three regis-  
ters join to form a 22-bit wide pointer. The low-order  
21 bits allow the device to address up to 2 Mbytes of  
program memory space. The 22nd bit allows access to  
the device ID, the user ID and the Configuration bits.  
When an erase of program memory is executed, the  
16 MSbs of the Table Pointer register (TBLPTR<21:6>)  
point to the 64-byte block that will be erased. The Least  
Significant bits (TBLPTR<5:0>) are ignored.  
The Table Pointer register, TBLPTR, is used by the  
TBLRDand TBLWTinstructions. These instructions can  
update the TBLPTR in one of four ways based on the  
table operation. These operations are shown in  
Table 7-1. These operations on the TBLPTR only affect  
the low-order 21 bits.  
Figure 7-3 describes the relevant boundaries of  
TBLPTR based on Flash program memory operations.  
TABLE 7-1:  
Example  
TABLE POINTER OPERATIONS WITH TBLRD AND TBLWT INSTRUCTIONS  
Operation on Table Pointer  
TBLRD*  
TBLWT*  
TBLPTR is not modified  
TBLRD*+  
TBLWT*+  
TBLPTR is incremented after the read/write  
TBLPTR is decremented after the read/write  
TBLPTR is incremented before the read/write  
TBLRD*-  
TBLWT*-  
TBLRD+*  
TBLWT+*  
FIGURE 7-3:  
TABLE POINTER BOUNDARIES BASED ON OPERATION  
21  
16 15  
TBLPTRH  
8
7
TBLPTRL  
0
TBLPTRU  
TABLE ERASE  
TBLPTR<21:6>  
TABLE WRITE  
TBLPTR<21:3>  
TABLE READ – TBLPTR<21:0>  
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TBLPTR points to a byte address in program space.  
7.3  
Reading the Flash Program  
Memory  
Executing TBLRD places the byte pointed to into  
TABLAT. In addition, TBLPTR can be modified  
automatically for the next table read operation.  
The TBLRD instruction is used to retrieve data from  
program memory and place it into data RAM. Table  
reads from program memory are performed one byte at  
a time.  
The internal program memory is typically organized by  
words. The Least Significant bit of the address selects  
between the high and low bytes of the word. Figure 7-4  
shows the interface between the internal program  
memory and the TABLAT.  
FIGURE 7-4:  
READS FROM FLASH PROGRAM MEMORY  
Program Memory  
(Even Byte Address)  
(Odd Byte Address)  
TBLPTR = xxxxx1  
TBLPTR = xxxxx0  
Instruction Register  
(IR)  
TABLAT  
Read Register  
FETCH  
TBLRD  
EXAMPLE 7-1:  
READING A FLASH PROGRAM MEMORY WORD  
MOVLW  
MOVWF  
MOVLW  
MOVWF  
MOVLW  
MOVWF  
CODE_ADDR_UPPER  
TBLPTRU  
CODE_ADDR_HIGH  
TBLPTRH  
CODE_ADDR_LOW  
TBLPTRL  
; Load TBLPTR with the base  
; address of the word  
READ_WORD  
TBLRD*+  
MOVF  
MOVWF  
TBLRD*+  
MOVF  
; read into TABLAT and increment  
; get data  
TABLAT, W  
WORD_EVEN  
; read into TABLAT and increment  
; get data  
TABLAT, W  
WORD_ODD  
MOVWF  
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7.4.1  
FLASH PROGRAM MEMORY  
ERASE SEQUENCE  
7.4  
Erasing Flash Program Memory  
The minimum erase block is 32 words or 64 bytes. Only  
through the use of an external programmer, or through  
ICSP control, can larger blocks of program memory be  
bulk erased. Word erase in the Flash array is not  
supported.  
The sequence of events for erasing a block of internal  
program memory location is:  
1. Load Table Pointer register with address of row  
being erased.  
When initiating an erase sequence from the micro-  
controller itself, a block of 64 bytes of program memory  
is erased. The Most Significant 16 bits of the  
TBLPTR<21:6> point to the block being erased.  
TBLPTR<5:0> are ignored.  
2. Set the EECON1 register for the erase operation:  
• set EEPGD bit to point to program memory;  
• clear the CFGS bit to access program memory;  
• set WREN bit to enable writes;  
• set FREE bit to enable the erase.  
3. Disable interrupts.  
The EECON1 register commands the erase operation.  
The EEPGD bit must be set to point to the Flash  
program memory. The WREN bit must be set to enable  
write operations. The FREE bit is set to select an erase  
operation.  
4. Write 55h to EECON2.  
5. Write 0AAh to EECON2.  
6. Set the WR bit. This will begin the row erase  
cycle.  
For protection, the write initiate sequence for EECON2  
must be used.  
7. The CPU will stall for duration of the erase  
(about 2 ms using internal timer).  
A long write is necessary for erasing the internal Flash.  
Instruction execution is halted while in a long write  
cycle. The long write will be terminated by the internal  
programming timer.  
8. Re-enable interrupts.  
EXAMPLE 7-2:  
ERASING A FLASH PROGRAM MEMORY ROW  
MOVLW  
MOVWF  
MOVLW  
MOVWF  
MOVLW  
MOVWF  
CODE_ADDR_UPPER  
TBLPTRU  
CODE_ADDR_HIGH  
TBLPTRH  
CODE_ADDR_LOW  
TBLPTRL  
; load TBLPTR with the base  
; address of the memory block  
ERASE_ROW  
BSF  
BCF  
BSF  
BSF  
EECON1, EEPGD  
EECON1, CFGS  
EECON1, WREN  
EECON1, FREE  
INTCON, GIE  
55h  
EECON2  
0AAh  
EECON2  
EECON1, WR  
INTCON, GIE  
; point to Flash program memory  
; access Flash program memory  
; enable write to memory  
; enable Row Erase operation  
; disable interrupts  
BCF  
Required  
Sequence  
MOVLW  
MOVWF  
MOVLW  
MOVWF  
BSF  
; write 55h  
; write 0AAh  
; start erase (CPU stall)  
; re-enable interrupts  
BSF  
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The long write is necessary for programming the  
7.5  
Writing to Flash Program Memory  
internal Flash. Instruction execution is halted while in a  
long write cycle. The long write will be terminated by  
the internal programming timer.  
The minimum programming block is 4 words or 8 bytes.  
Word or byte programming is not supported.  
Table writes are used internally to load the holding  
registers needed to program the Flash memory. There  
are 8 holding registers used by the table writes for  
programming.  
The EEPROM on-chip timer controls the write time.  
The write/erase voltages are generated by an on-chip  
charge pump, rated to operate over the voltage range  
of the device.  
Since the Table Latch (TABLAT) is only a single byte,  
the TBLWTinstruction may need to be executed 8 times  
for each programming operation. All of the table write  
operations will essentially be short writes because only  
the holding registers are written. At the end of updating  
the 8 holding registers, the EECON1 register must be  
written to in order to start the programming operation with  
a long write.  
Note:  
The default value of the holding registers on  
device Resets and after write operations is  
FFh. A write of FFh to a holding register  
does not modify that byte. This means that  
individual bytes of program memory may be  
modified, provided that the modification  
does not attempt to change any bit from a  
0’ to a ‘1’. When modifying individual bytes,  
it is not necessary to load all 8 holding  
registers before executing a write operation.  
FIGURE 7-5:  
TABLE WRITES TO FLASH PROGRAM MEMORY  
TABLAT  
Write Register  
8
8
8
8
TBLPTR = xxxxx0  
TBLPTR = xxxxx1  
TBLPTR = xxxxx2  
TBLPTR = xxxxx7  
Holding Register  
Holding Register  
Holding Register  
Holding Register  
Program Memory  
9. Write 55h to EECON2.  
10. Write 0AAh to EECON2.  
7.5.1  
FLASH PROGRAM MEMORY  
WRITE SEQUENCE  
11. Set the WR bit. This will begin the write cycle.  
The sequence of events for programming an internal  
program memory location should be:  
12. The CPU will stall for duration of the write (about  
2 ms using internal timer).  
1. Read 64 bytes into RAM.  
13. Repeat from step 5 seven more times.  
14. Re-enable interrupts.  
2. Update data values in RAM as necessary.  
3. Load Table Pointer register with address being  
erased.  
15. Verify the memory (table read).  
This procedure will require about 18 ms to update one  
row of 64 bytes of memory. An example of the required  
code is given in Example 7-3.  
4. Execute the row erase procedure.  
5. Load Table Pointer register with address of first  
byte being written.  
6. Write the 8 bytes into the holding registers.  
7. Set the EECON1 register for the write operation:  
• set EEPGD bit to point to program memory;  
• clear the CFGS bit to access program memory;  
• set WREN to enable byte writes.  
Note:  
Before setting the WR bit, the Table  
Pointer address needs to be within the  
intended address range of the 8 bytes in  
the holding register.  
8. Disable interrupts.  
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EXAMPLE 7-3:  
WRITING TO FLASH PROGRAM MEMORY  
MOVLW  
D'64'  
; number of bytes in erase block  
MOVWF  
MOVLW  
MOVWF  
MOVLW  
MOVWF  
MOVLW  
MOVWF  
MOVLW  
MOVWF  
MOVLW  
MOVWF  
COUNTER  
BUFFER_ADDR_HIGH  
FSR0H  
BUFFER_ADDR_LOW  
FSR0L  
CODE_ADDR_UPPER  
TBLPTRU  
CODE_ADDR_HIGH  
TBLPTRH  
CODE_ADDR_LOW  
TBLPTRL  
; point to buffer  
; Load TBLPTR with the base  
; address of the memory block  
; 6 LSB = 0  
READ_BLOCK  
TBLRD*+  
MOVF  
MOVWF  
; read into TABLAT, and inc  
; get data  
; store data and increment FSR0  
; done?  
TABLAT, W  
POSTINC0  
DECFSZ COUNTER  
BRA  
READ_BLOCK  
; repeat  
MODIFY_WORD  
MOVLW  
MOVWF  
MOVLW  
MOVWF  
MOVLW  
MOVWF  
MOVLW  
MOVWF  
DATA_ADDR_HIGH  
FSR0H  
DATA_ADDR_LOW  
FSR0L  
NEW_DATA_LOW  
POSTINC0  
NEW_DATA_HIGH  
INDF0  
; point to buffer  
; update buffer word and increment FSR0  
; update buffer word  
ERASE_BLOCK  
MOVLW  
MOVWF  
MOVLW  
MOVWF  
MOVLW  
MOVWF  
BCF  
BSF  
BSF  
BSF  
BCF  
MOVLW  
MOVWF  
MOVLW  
MOVWF  
BSF  
CODE_ADDR_UPPER  
TBLPTRU  
CODE_ADDR_HIGH  
TBLPTRH  
CODE_ADDR_LOW  
TBLPTRL  
EECON1, CFGS  
EECON1, EEPGD  
EECON1, WREN  
EECON1, FREE  
INTCON, GIE  
55h  
; load TBLPTR with the base  
; address of the memory block  
; 6 LSB = 0  
; point to PROG/EEPROM memory  
; point to Flash program memory  
; enable write to memory  
; enable Row Erase operation  
; disable interrupts  
; Required sequence  
; write 55h  
EECON2  
0AAh  
EECON2  
EECON1, WR  
; write AAh  
; start erase (CPU stall)  
NOP  
BSF  
INTCON, GIE  
; re-enable interrupts  
WRITE_BUFFER_BACK  
MOVLW  
8
; number of write buffer groups of 8 bytes  
; point to buffer  
MOVWF  
MOVLW  
MOVWF  
MOVLW  
MOVWF  
COUNTER_HI  
BUFFER_ADDR_HIGH  
FSR0H  
BUFFER_ADDR_LOW  
FSR0L  
PROGRAM_LOOP  
MOVLW  
MOVWF  
8
; number of bytes in holding register  
COUNTER  
WRITE_WORD_TO_HREGS  
MOVF  
MOVWF  
TBLWT+*  
POSTINC0, W  
TABLAT  
; get low byte of buffer data and increment FSR0  
; present data to table latch  
; short write  
; to internal TBLWT holding register, increment  
; TBLPTR  
DECFSZ COUNTER  
GOTO WRITE_WORD_TO_HREGS  
; loop until buffers are full  
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EXAMPLE 7-3:  
WRITING TO FLASH PROGRAM MEMORY (CONTINUED)  
PROGRAM_MEMORY  
BCF  
INTCON, GIE  
55h  
EECON2  
0AAh  
EECON2  
; disable interrupts  
; required sequence  
; write 55h  
MOVLW  
MOVWF  
MOVLW  
MOVWF  
BSF  
; write AAh  
; start program (CPU stall)  
EECON1, WR  
NOP  
BSF  
INTCON, GIE  
; re-enable interrupts  
; loop until done  
DECFSZ COUNTER_HI  
GOTO  
BCF  
PROGRAM_LOOP  
EECON1, WREN  
; disable write to memory  
7.5.2  
WRITE VERIFY  
7.5.4  
PROTECTION AGAINST  
SPURIOUS WRITES  
Depending on the application, good programming  
practice may dictate that the value written to the  
memory should be verified against the original value.  
This should be used in applications where excessive  
writes can stress bits near the specification limit.  
To protect against spurious writes to Flash program  
memory, the write initiate sequence must also be  
followed. See Section 24.0 “Special Features of the  
CPU” for more detail.  
7.5.3  
UNEXPECTED TERMINATION OF  
WRITE OPERATION  
7.6  
Flash Program Operation During  
Code Protection  
If a write is terminated by an unplanned event, such as  
loss of power or an unexpected Reset, the memory  
location just programmed should be verified and repro-  
grammed if needed. If the write operation is interrupted  
by a MCLR Reset or a WDT Time-out Reset during  
normal operation, the user can check the WRERR bit  
and rewrite the location(s) as needed.  
See Section 24.5 “Program Verification and Code  
Protection” for details on code protection of Flash  
program memory.  
TABLE 7-2:  
Name  
REGISTERS ASSOCIATED WITH PROGRAM FLASH MEMORY  
Reset  
Valueson  
page  
Bit 7  
Bit 6  
Bit 5  
Bit 4  
Bit 3  
Bit 2  
Bit 1  
Bit 0  
TBLPTRU  
bit 21 Program Memory Table Pointer Upper Byte (TBLPTR<20:16>)  
55  
55  
55  
55  
55  
57  
57  
58  
58  
58  
TBPLTRH Program Memory Table Pointer High Byte (TBLPTR<15:8>)  
TBLPTRL Program Memory Table Pointer Low Byte (TBLPTR<7:0>)  
TABLAT  
INTCON  
Program Memory Table Latch  
GIE/GIEH PEIE/GIEL TMR0IE INT0IE  
RBIE  
TMR0IF  
INT0IF  
RBIF  
EECON2 EEPROM Control Register 2 (not a physical register)  
EECON1  
IPR2  
EEPGD  
OSCFIP  
OSCFIF  
OSCFIE  
CFGS  
CMIP  
CMIF  
CMIE  
FREE  
EEIP  
EEIF  
EEIE  
WRERR  
BCLIP  
BCLIF  
BCLIE  
WREN  
HLVDIP  
HLVDIF  
HLVDIE  
WR  
RD  
TMR3IP  
TMR3IF  
TMR3IE  
CCP2IP  
CCP2IF  
CCP2IE  
PIR2  
PIE2  
Legend: — = unimplemented, read as ‘0’. Shaded cells are not used during Flash/EEPROM access.  
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The EECON1 register (Register 8-1) is the control  
8.0  
DATA EEPROM MEMORY  
register for data and program memory access. Control  
bit EEPGD determines if the access will be to program  
or data EEPROM memory. When clear, operations will  
access the data EEPROM memory. When set, program  
memory is accessed.  
The data EEPROM is a nonvolatile memory array,  
separate from the data RAM and program memory, that  
is used for long-term storage of program data. It is not  
directly mapped in either the register file or program  
memory space but is indirectly addressed through the  
Special Function Registers (SFRs). The EEPROM is  
readable and writable during normal operation over the  
entire VDD range.  
Control bit CFGS determines if the access will be to the  
Configuration registers or to program memory/data  
EEPROM memory. When set, subsequent operations  
access Configuration registers. When CFGS is clear,  
the EEPGD bit selects either program Flash or data  
EEPROM memory.  
Four SFRs are used to read and write to the data  
EEPROM as well as the program memory. They are:  
• EECON1  
• EECON2  
• EEDATA  
• EEADR  
The WREN bit, when set, will allow a write operation.  
On power-up, the WREN bit is clear. The WRERR bit is  
set in hardware when the WREN bit is set and cleared  
when the internal programming timer expires and the  
write operation is complete.  
The data EEPROM allows byte read and write. When  
interfacing to the data memory block, EEDATA holds  
the 8-bit data for read/write and the EEADR register  
holds the address of the EEPROM location being  
accessed.  
Note:  
During normal operation, the WRERR bit  
is read as ‘1’. This can indicate that a write  
operation was prematurely terminated by  
a
Reset, or  
a write operation was  
attempted improperly.  
The EEPROM data memory is rated for high erase/write  
cycle endurance. A byte write automatically erases the  
location and writes the new data (erase-before-write).  
The write time is controlled by an on-chip timer. It will  
vary with voltage and temperature as well as from chip  
to chip. Please refer to parameter D122 (Table 27-1 in  
Section 27.0 “Electrical Characteristics”) for exact  
limits.  
The WR control bit initiates write operations. The bit  
cannot be cleared, only set, in software; it is cleared in  
hardware at the completion of the write operation.  
Note:  
The EEIF interrupt flag bit (PIR2<4>) is set  
when the write is complete. It must be  
cleared in software.  
Control bits, RD and WR, start read and erase/write  
operations, respectively. These bits are set by firmware  
and cleared by hardware at the completion of the  
operation.  
8.1  
EECON1 and EECON2 Registers  
Access to the data EEPROM is controlled by two  
registers: EECON1 and EECON2. These are the same  
registers which control access to the program memory  
and are used in a similar manner for the data  
EEPROM.  
The RD bit cannot be set when accessing program  
memory (EEPGD = 1). Program memory is read using  
table read instructions. See Section 7.1 “Table Reads  
and Table Writes” regarding table reads.  
The EECON2 register is not a physical register. It is  
used exclusively in the memory write and erase  
sequences. Reading EECON2 will read all ‘0’s.  
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REGISTER 8-1:  
EECON1: DATA EEPROM CONTROL REGISTER 1  
R/W-x  
R/W-x  
CFGS  
U-0  
R/W-0  
FREE  
R/W-x  
R/W-0  
WREN  
R/S-0  
WR  
R/S-0  
RD  
EEPGD  
WRERR  
bit 7  
bit 0  
bit 7  
bit 6  
EEPGD: Flash Program or Data EEPROM Memory Select bit  
1= Access Flash program memory  
0= Access data EEPROM memory  
CFGS: Flash Program/Data EEPROM or Configuration Select bit  
1= Access Configuration registers  
0= Access Flash program or data EEPROM memory  
bit 5  
bit 4  
Unimplemented: Read as ‘0’  
FREE: Flash Row Erase Enable bit  
1= Erase the program memory row addressed by TBLPTR on the next WR command (cleared  
by completion of erase operation)  
0= Perform write only  
bit 3  
WRERR: Flash Program/Data EEPROM Error Flag bit  
1= A write operation is prematurely terminated (any Reset during self-timed programming in  
normal operation, or an improper write attempt)  
0= The write operation completed  
Note:  
When a WRERR occurs, the EEPGD and CFGS bits are not cleared.  
This allows tracing of the error condition.  
bit 2  
bit 1  
WREN: Flash Program/Data EEPROM Write Enable bit  
1= Allows write cycles to Flash program/data EEPROM  
0= Inhibits write cycles to Flash program/data EEPROM  
WR: Write Control bit  
1= Initiates a data EEPROM erase/write cycle or a program memory erase cycle or write cycle  
(The operation is self-timed and the bit is cleared by hardware once write is complete.  
The WR bit can only be set (not cleared) in software.)  
0= Write cycle to the EEPROM is complete  
bit 0  
RD: Read Control bit  
1= Initiates an EEPROM read  
(Read takes one cycle. RD is cleared in hardware. The RD bit can only be set (not cleared)  
in software. RD bit cannot be set when EEPGD = 1or CFGS = 1.)  
0= Does not initiate an EEPROM read  
Legend:  
R = Readable bit  
-n = Value at POR  
W = Writable bit  
‘1’ = Bit is set  
U = Unimplemented bit, read as ‘0’  
‘0’ = Bit is cleared x = Bit is unknown  
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Additionally, the WREN bit in EECON1 must be set to  
8.2  
Reading the Data EEPROM  
Memory  
enable writes. This mechanism prevents accidental  
writes to data EEPROM due to unexpected code  
execution (i.e., runaway programs). The WREN bit  
should be kept clear at all times, except when updating  
the EEPROM. The WREN bit is not cleared by  
hardware.  
To read a data memory location, the user must write the  
address to the EEADR register, clear the EEPGD  
control bit (EECON1<7>) and then set control bit, RD  
(EECON1<0>). The data is available on the very next  
instruction cycle; therefore, the EEDATA register can  
be read by the next instruction. EEDATA will hold this  
value until another read operation, or until it is written to  
by the user (during a write operation).  
After a write sequence has been initiated, EECON1,  
EEADR and EEDATA cannot be modified. The WR bit  
will be inhibited from being set unless the WREN bit is  
set. The WREN bit must be set on a previous instruc-  
tion. Both WR and WREN cannot be set with the same  
instruction.  
The basic process is shown in Example 8-1.  
8.3  
Writing to the Data EEPROM  
Memory  
At the completion of the write cycle, the WR bit is  
cleared in hardware and the EEPROM Interrupt Flag  
bit, EEIF, is set. The user may either enable this  
interrupt, or poll this bit. EEIF must be cleared by  
software.  
To write an EEPROM data location, the address must  
first be written to the EEADR register and the data  
written to the EEDATA register. The sequence in  
Example 8-2 must be followed to initiate the write cycle.  
8.4  
Write Verify  
The write will not begin if this sequence is not exactly  
followed (write 55h to EECON2, write 0AAh to  
EECON2, then set WR bit) for each byte. It is strongly  
recommended that interrupts be disabled during this  
code segment.  
Depending on the application, good programming  
practice may dictate that the value written to the mem-  
ory should be verified against the original value. This  
should be used in applications where excessive writes  
can stress bits near the specification limit.  
EXAMPLE 8-1:  
DATA EEPROM READ  
MOVLW  
MOVWF  
BCF  
BCF  
BSF  
DATA_EE_ADDR  
EEADR  
EECON1, EEPGD  
EECON1, CFGS  
EECON1, RD  
EEDATA, W  
;
; Data Memory Address to read  
; Point to DATA memory  
; Access EEPROM  
; EEPROM Read  
; W = EEDATA  
MOVF  
EXAMPLE 8-2:  
DATA EEPROM WRITE  
MOVLW  
DATA_EE_ADDR  
EEADR  
DATA_EE_DATA  
EEDATA  
EECON1, EEPGD  
EECON1, CFGS  
EECON1, WREN  
;
MOVWF  
MOVLW  
MOVWF  
BCF  
BCF  
BSF  
; Data Memory Address to write  
;
; Data Memory Value to write  
; Point to DATA memory  
; Access EEPROM  
; Enable writes  
BCF  
INTCON, GIE  
55h  
EECON2  
0AAh  
EECON2  
EECON1, WR  
EECON1, WR  
$-2  
; Disable Interrupts  
;
; Write 55h  
;
; Write 0AAh  
; Set WR bit to begin write  
; Wait for write to complete  
MOVLW  
MOVWF  
MOVLW  
MOVWF  
BSF  
BTFSC  
GOTO  
BSF  
Required  
Sequence  
INTCON, GIE  
; Enable Interrupts  
; User code execution  
BCF  
EECON1, WREN  
; Disable writes on write complete (EEIF set)  
© 2009 Microchip Technology Inc.  
DS39689F-page 91  
PIC18F2221/2321/4221/4321 FAMILY  
8.5  
Operation During Code-Protect  
8.7  
Using the Data EEPROM  
Data EEPROM memory has its own code-protect bits in  
Configuration Words. External read and write  
operations are disabled if code protection is enabled.  
The data EEPROM is a high-endurance, byte  
addressable array that has been optimized for the  
storage of frequently changing data. Such data is  
typically updated at least one time within the number of  
writes defined by specification, D124. If any location  
storing data is not written at least this often, the data  
EEPROM array must be refreshed. For this reason,  
values that change infrequently, or not at all, should be  
stored in Flash program memory.  
The microcontroller itself can both read and write to the  
internal data EEPROM, regardless of the state of the  
code-protect Configuration bit. Refer to Section 24.0  
“Special Features of the CPU” for additional  
information.  
A simple data EEPROM refresh routine is shown in  
Example 8-3.  
8.6  
Protection Against Spurious Write  
To protect against spurious EEPROM writes, various  
mechanisms have been implemented. On power-up,  
the WREN bit is cleared. In addition, writes to the  
EEPROM are blocked during the Power-up Timer  
period (TPWRT, parameter 33).  
Note:  
If data EEPROM is only used to store con-  
stants and/or data that changes often, an  
array refresh is likely not required. See  
specification, D124.  
The write initiate sequence and the WREN bit together  
help prevent an accidental write during Brown-out  
Reset, power glitch or software malfunction.  
EXAMPLE 8-3:  
DATA EEPROM REFRESH ROUTINE  
CLRF  
BCF  
BCF  
BCF  
BSF  
EEADR  
; Start at address 0  
; Set for memory  
EECON1, CFGS  
EECON1, EEPGD  
INTCON, GIE  
EECON1, WREN  
; Set for Data EEPROM  
; Disable interrupts  
; Enable writes  
; Loop to refresh array  
; Read current address  
;
; Write 55h  
;
; Write 0AAh  
; Set WR bit to begin write  
; Wait for write to complete  
LOOP  
BSF  
EECON1, RD  
55h  
EECON2  
0AAh  
EECON2  
EECON1, WR  
EECON1, WR  
$-2  
MOVLW  
MOVWF  
MOVLW  
MOVWF  
BSF  
BTFSC  
BRA  
INCFSZ EEADR, F  
; Increment address  
BRA  
LOOP  
; Not zero, do it again  
BCF  
BSF  
EECON1, WREN  
INTCON, GIE  
; Disable writes  
; Enable interrupts  
DS39689F-page 92  
© 2009 Microchip Technology Inc.  
PIC18F2221/2321/4221/4321 FAMILY  
TABLE 8-1:  
Name  
REGISTERS ASSOCIATED WITH DATA EEPROM MEMORY  
Reset  
Bit 7  
Bit 6  
Bit 5  
Bit 4  
Bit 3  
Bit 2  
Bit 1  
Bit 0  
Values  
on page  
INTCON  
GIE/GIEH PEIE/GIEL TMR0IE INT0IE  
EEPROM Address Register  
EEDATA EEPROM Data Register  
EECON2 EEPROM Control Register 2 (not a physical register)  
RBIE  
TMR0IF  
INT0IF  
RBIF  
55  
57  
57  
57  
57  
58  
58  
58  
EEADR  
EECON1  
IPR2  
EEPGD  
OSCFIP  
OSCFIF  
OSCFIE  
CFGS  
CMIP  
CMIF  
CMIE  
FREE  
EEIP  
EEIF  
EEIE  
WRERR WREN  
WR  
RD  
BCLIP  
BCLIF  
BCLIE  
HLVDIP  
HLVDIF  
HLVDIE  
TMR3IP  
TMR3IF  
TMR3IE  
CCP2IP  
CCP2IF  
CCP2IE  
PIR2  
PIE2  
Legend: — = unimplemented, read as ‘0’. Shaded cells are not used during Flash/EEPROM access.  
© 2009 Microchip Technology Inc.  
DS39689F-page 93  
PIC18F2221/2321/4221/4321 FAMILY  
NOTES:  
DS39689F-page 94  
© 2009 Microchip Technology Inc.  
PIC18F2221/2321/4221/4321 FAMILY  
EXAMPLE 9-1:  
8 x 8 UNSIGNED  
MULTIPLY ROUTINE  
9.0  
9.1  
8 x 8 HARDWARE MULTIPLIER  
Introduction  
MOVF  
MULWF  
ARG1, W  
ARG2  
;
; ARG1 * ARG2 ->  
; PRODH:PRODL  
All PIC18 devices include an 8 x 8 hardware multiplier  
as part of the ALU. The multiplier performs an unsigned  
operation and yields a 16-bit result that is stored in the  
product register pair, PRODH:PRODL. The multiplier’s  
operation does not affect any flags in the STATUS  
register.  
EXAMPLE 9-2:  
8 x 8 SIGNED MULTIPLY  
ROUTINE  
Making multiplication a hardware operation allows it to  
be completed in a single instruction cycle. This has the  
advantages of higher computational throughput and  
reduced code size for multiplication algorithms and  
allows the PIC18 devices to be used in many applica-  
tions previously reserved for digital signal processors.  
A comparison of various hardware and software  
multiply operations, along with the savings in memory  
and execution time, is shown in Table 9-1.  
MOVF  
MULWF  
ARG1, W  
ARG2  
; ARG1 * ARG2 ->  
; PRODH:PRODL  
; Test Sign Bit  
; PRODH = PRODH  
BTFSC  
SUBWF  
ARG2, SB  
PRODH, F  
;
- ARG1  
MOVF  
BTFSC  
SUBWF  
ARG2, W  
ARG1, SB  
PRODH, F  
; Test Sign Bit  
; PRODH = PRODH  
;
- ARG2  
9.2  
Operation  
Example 9-1 shows the instruction sequence for an 8 x 8  
unsigned multiplication. Only one instruction is required  
when one of the arguments is already loaded in the  
WREG register.  
Example 9-2 shows the sequence to do an 8 x 8 signed  
multiplication. To account for the sign bits of the  
arguments, each argument’s Most Significant bit (MSb)  
is tested and the appropriate subtractions are done.  
TABLE 9-1:  
Routine  
PERFORMANCE COMPARISON FOR VARIOUS MULTIPLY OPERATIONS  
Program  
Memory  
(Words)  
Time  
Cycles  
(Max)  
Multiply Method  
@ 40 MHz @ 10 MHz @ 4 MHz  
Without hardware multiply  
Hardware multiply  
13  
1
69  
1
6.9 μs  
100 ns  
9.1 μs  
600 ns  
24.2 μs  
2.8 μs  
25.4 μs  
4.0 μs  
27.6 μs  
400 ns  
36.4 μs  
2.4 μs  
69 μs  
1 μs  
8 x 8 unsigned  
8 x 8 signed  
Without hardware multiply  
Hardware multiply  
33  
6
91  
6
91 μs  
6 μs  
Without hardware multiply  
Hardware multiply  
21  
28  
52  
35  
242  
28  
254  
40  
96.8 μs  
11.2 μs  
102.6 μs  
16.0 μs  
242 μs  
28 μs  
254 μs  
40 μs  
16 x 16 unsigned  
16 x 16 signed  
Without hardware multiply  
Hardware multiply  
© 2009 Microchip Technology Inc.  
DS39689F-page 95  
PIC18F2221/2321/4221/4321 FAMILY  
Example 9-3 shows the sequence to do a 16 x 16  
unsigned multiplication. Equation 9-1 shows the  
algorithm that is used. The 32-bit result is stored in four  
registers (RES3:RES0).  
EQUATION 9-2:  
16 x 16 SIGNED  
MULTIPLICATION  
ALGORITHM  
RES3:RES0 = ARG1H:ARG1L ARG2H:ARG2L  
16  
= (ARG1H ARG2H 2 ) +  
(ARG1H ARG2L 2 ) +  
(ARG1L ARG2H 2 ) +  
(ARG1L ARG2L) +  
(-1 ARG2H<7> ARG1H:ARG1L 2 ) +  
(-1 ARG1H<7> ARG2H:ARG2L 2  
8
EQUATION 9-1:  
16 x 16 UNSIGNED  
MULTIPLICATION  
ALGORITHM  
8
16  
16  
RES3:RES0  
=
=
ARG1H:ARG1L ARG2H:ARG2L  
)
16  
(ARG1H ARG2H 2 ) +  
8
(ARG1H ARG2L 2 ) +  
8
(ARG1L ARG2H 2 ) +  
EXAMPLE 9-4:  
16 x 16 SIGNED  
MULTIPLY ROUTINE  
(ARG1L ARG2L)  
MOVF  
MULWF  
ARG1L, W  
ARG2L  
; ARG1L * ARG2L ->  
; PRODH:PRODL  
EXAMPLE 9-3:  
16 x 16 UNSIGNED  
MULTIPLY ROUTINE  
MOVFF  
MOVFF  
PRODH, RES1  
PRODL, RES0  
;
;
MOVF  
MULWF  
ARG1L, W  
ARG2L  
;
;
; ARG1L * ARG2L->  
MOVF  
MULWF  
ARG1H, W  
ARG2H  
; PRODH:PRODL  
; ARG1H * ARG2H ->  
; PRODH:PRODL  
;
;
MOVFF  
MOVFF  
PRODH, RES1  
PRODL, RES0  
;
;
MOVFF  
MOVFF  
PRODH, RES3  
PRODL, RES2  
;
;
MOVF  
MULWF  
ARG1H, W  
ARG2H  
; ARG1H * ARG2H->  
MOVF  
MULWF  
ARG1L, W  
ARG2H  
; PRODH:PRODL  
; ARG1L * ARG2H ->  
; PRODH:PRODL  
;
; Add cross  
; products  
MOVFF  
MOVFF  
PRODH, RES3  
PRODL, RES2  
;
;
MOVF  
ADDWF  
MOVF  
PRODL, W  
RES1, F  
PRODH, W  
MOVF  
ARG1L, W  
ARG2H  
MULWF  
; ARG1L * ARG2H->  
ADDWFC RES2, F  
CLRF WREG  
ADDWFC RES3, F  
;
;
;
; PRODH:PRODL  
;
; Add cross  
; products  
;
;
;
MOVF  
ADDWF  
MOVF  
ADDWFC RES2, F  
CLRF WREG  
ADDWFC RES3, F  
PRODL, W  
RES1, F  
PRODH, W  
;
MOVF  
MULWF  
ARG1H, W  
ARG2L  
;
; ARG1H * ARG2L ->  
; PRODH:PRODL  
;
; Add cross  
; products  
MOVF  
ADDWF  
MOVF  
PRODL, W  
RES1, F  
PRODH, W  
;
MOVF  
MULWF  
ARG1H, W  
ARG2L  
;
; ARG1H * ARG2L->  
ADDWFC RES2, F  
CLRF WREG  
ADDWFC RES3, F  
;
;
;
; PRODH:PRODL  
;
; Add cross  
; products  
;
;
;
MOVF  
ADDWF  
MOVF  
ADDWFC RES2, F  
CLRF WREG  
ADDWFC RES3, F  
PRODL, W  
RES1, F  
PRODH, W  
;
;
BTFSS  
BRA  
MOVF  
SUBWF  
MOVF  
ARG2H, 7  
SIGN_ARG1  
ARG1L, W  
RES2  
; ARG2H:ARG2L neg?  
; no, check ARG1  
;
;
;
ARG1H, W  
Example 9-4 shows the sequence to do a 16 x 16  
signed multiply. Equation 9-2 shows the algorithm  
used. The 32-bit result is stored in four registers  
(RES3:RES0). To account for the sign bits of the  
arguments, the MSb for each argument pair is tested  
and the appropriate subtractions are done.  
SUBWFB RES3  
SIGN_ARG1  
BTFSS  
BRA  
ARG1H, 7  
CONT_CODE  
ARG2L, W  
RES2  
; ARG1H:ARG1L neg?  
; no, done  
;
;
;
MOVF  
SUBWF  
MOVF  
ARG2H, W  
SUBWFB RES3  
;
CONT_CODE  
:
DS39689F-page 96  
© 2009 Microchip Technology Inc.  
PIC18F2221/2321/4221/4321 FAMILY  
When the IPEN bit is cleared (default state), the  
10.0 INTERRUPTS  
interrupt priority feature is disabled and interrupts are  
compatible with PIC® mid-range devices. In  
Compatibility mode, the interrupt priority bits for each  
source have no effect. INTCON<6> is the PEIE bit,  
which enables/disables all peripheral interrupt sources.  
INTCON<7> is the GIE bit, which enables/disables all  
interrupt sources. All interrupts branch to address  
0008h in Compatibility mode.  
The PIC18F2221/2321/4221/4321 family devices have  
multiple interrupt sources and an interrupt priority  
feature that allows most interrupt sources to be  
assigned a high-priority level or a low-priority level. The  
high-priority interrupt vector is at 0008h and the low-  
priority interrupt vector is at 0018h. High-priority  
interrupt events will interrupt any low-priority interrupts  
that may be in progress.  
When an interrupt is responded to, the global interrupt  
enable bit is cleared to disable further interrupts. If the  
IPEN bit is cleared, this is the GIE bit. If interrupt priority  
levels are used, this will be either the GIEH or GIEL bit.  
High-priority interrupt sources can interrupt a low-  
priority interrupt. Low-priority interrupts are not  
processed while high-priority interrupts are in progress.  
There are ten registers which are used to control  
interrupt operation. These registers are:  
• RCON  
• INTCON  
• INTCON2  
• INTCON3  
• PIR1, PIR2  
• PIE1, PIE2  
• IPR1, IPR2  
The return address is pushed onto the stack and the  
PC is loaded with the interrupt vector address (0008h  
or 0018h). Once in the Interrupt Service Routine, the  
source(s) of the interrupt can be determined by polling  
the interrupt flag bits. The interrupt flag bits must be  
cleared in software before re-enabling interrupts to  
avoid recursive interrupts.  
It is recommended that the Microchip header files  
supplied with MPLAB® IDE be used for the symbolic bit  
names in these registers. This allows the assembler/  
compiler to automatically take care of the placement of  
these bits within the specified register.  
The “return from interrupt” instruction, RETFIE, exits  
the interrupt routine and sets the GIE bit (GIEH or GIEL  
if priority levels are used), which re-enables interrupts.  
In general, interrupt sources have three bits to control  
their operation. They are:  
For external interrupt events, such as the INTx pins or  
the PORTB input change interrupt, the interrupt latency  
will be three to four instruction cycles. The exact  
latency is the same for one or two-cycle instructions.  
Individual interrupt flag bits are set, regardless of the  
status of their corresponding enable bit or the GIE bit.  
Flag bit to indicate that an interrupt event  
occurred  
Enable bit that allows program execution to  
branch to the interrupt vector address when the  
flag bit is set  
Note:  
Do not use the MOVFFinstruction to modify  
any of the interrupt control registers while  
any interrupt is enabled. Doing so may  
cause erratic microcontroller behavior.  
Priority bit to select high priority or low priority  
The interrupt priority feature is enabled by setting the  
IPEN bit (RCON<7>). When interrupt priority is  
enabled, there are two bits which enable interrupts  
globally. Setting the GIEH bit (INTCON<7>) enables all  
interrupts that have the priority bit set (high priority).  
Setting the GIEL bit (INTCON<6>) enables all  
interrupts that have the priority bit cleared (low priority).  
When the interrupt flag, enable bit and appropriate  
global interrupt enable bit are set, the interrupt will vec-  
tor immediately to address 0008h or 0018h, depending  
on the priority bit setting. Individual interrupts can be  
disabled through their corresponding enable bits.  
© 2009 Microchip Technology Inc.  
DS39689F-page 97  
PIC18F2221/2321/4221/4321 FAMILY  
FIGURE 10-1:  
PIC18 INTERRUPT LOGIC  
Wake-up if in  
Idle or Sleep modes  
TMR0IF  
TMR0IE  
TMR0IP  
RBIF  
RBIE  
RBIP  
INT0IF  
INT0IE  
Interrupt to CPU  
Vector to Location  
0008h  
INT1IF  
INT1IE  
INT1IP  
INT2IF  
INT2IE  
INT2IP  
SSPIF  
SSPIE  
SSPIP  
GIE/GIEH  
ADIF  
ADIE  
ADIP  
IPEN  
IPEN  
RCIF  
RCIE  
RCIP  
PEIE/GIEL  
IPEN  
Additional Peripheral Interrupts  
High-Priority Interrupt Generation  
Low-Priority Interrupt Generation  
SSPIF  
SSPIE  
SSPIP  
Interrupt to CPU  
Vector to Location  
0018h  
TMR0IF  
TMR0IE  
TMR0IP  
ADIF  
ADIE  
ADIP  
RBIF  
RBIE  
RBIP  
RCIF  
RCIE  
RCIP  
GIE/GIEH  
PEIE/GIEL  
INT1IF  
INT1IE  
INT1IP  
Additional Peripheral Interrupts  
INT2IF  
INT2IE  
INT2IP  
DS39689F-page 98  
© 2009 Microchip Technology Inc.  
PIC18F2221/2321/4221/4321 FAMILY  
10.1 INTCON Registers  
Note:  
Interrupt flag bits are set when an interrupt  
condition occurs, regardless of the state of  
its corresponding enable bit or the global  
interrupt enable bit. User software should  
ensure the appropriate interrupt flag bits  
are clear prior to enabling an interrupt.  
This feature allows for software polling.  
The INTCON registers are readable and writable  
registers, which contain various enable, priority and  
flag bits.  
REGISTER 10-1: INTCON: INTERRUPT CONTROL REGISTER  
R/W-0  
R/W-0  
R/W-0  
R/W-0  
R/W-0  
RBIE  
R/W-0  
R/W-0  
INT0IF  
R/W-x  
RBIF  
GIE/GIEH PEIE/GIEL TMR0IE  
bit 7  
INT0IE  
TMR0IF  
bit 0  
bit 7  
GIE/GIEH: Global Interrupt Enable bit  
When IPEN = 0:  
1= Enables all unmasked interrupts  
0= Disables all interrupts  
When IPEN = 1:  
1= Enables all high-priority interrupts  
0= Disables all interrupts  
bit 6  
PEIE/GIEL: Peripheral Interrupt Enable bit  
When IPEN = 0:  
1= Enables all unmasked peripheral interrupts  
0= Disables all peripheral interrupts  
When IPEN = 1:  
1= Enables all low-priority peripheral interrupts  
0= Disables all low-priority peripheral interrupts  
bit 5  
bit 4  
bit 3  
bit 2  
bit 1  
bit 0  
TMR0IE: TMR0 Overflow Interrupt Enable bit  
1= Enables the TMR0 overflow interrupt  
0= Disables the TMR0 overflow interrupt  
INT0IE: INT0 External Interrupt Enable bit  
1= Enables the INT0 external interrupt  
0= Disables the INT0 external interrupt  
RBIE: RB Port Change Interrupt Enable bit  
1= Enables the RB port change interrupt  
0= Disables the RB port change interrupt  
TMR0IF: TMR0 Overflow Interrupt Flag bit  
1= TMR0 register has overflowed (must be cleared in software)  
0= TMR0 register did not overflow  
INT0IF: INT0 External Interrupt Flag bit  
1= The INT0 external interrupt occurred (must be cleared in software)  
0= The INT0 external interrupt did not occur  
RBIF: RB Port Change Interrupt Flag bit  
1= At least one of the RB<7:4> pins changed state (must be cleared in software)  
0= None of the RB<7:4> pins have changed state  
Legend:  
R = Readable bit  
-n = Value at POR  
W = Writable bit  
‘1’ = Bit is set  
U = Unimplemented bit, read as ‘0’  
‘0’ = Bit is cleared x = Bit is unknown  
© 2009 Microchip Technology Inc.  
DS39689F-page 99  
PIC18F2221/2321/4221/4321 FAMILY  
REGISTER 10-2: INTCON2: INTERRUPT CONTROL REGISTER 2  
R/W-1  
RBPU  
R/W-1  
R/W-1  
R/W-1  
U-0  
R/W-1  
U-0  
R/W-1  
RBIP  
INTEDG0 INTEDG1 INTEDG2  
TMR0IP  
bit 7  
bit 0  
bit 7  
bit 6  
bit 5  
bit 4  
RBPU: PORTB Pull-up Enable bit  
1= All PORTB pull-ups are disabled  
0= PORTB pull-ups are enabled by individual port latch values  
INTEDG0: External Interrupt 0 Edge Select bit  
1= Interrupt on rising edge  
0= Interrupt on falling edge  
INTEDG1: External Interrupt 1 Edge Select bit  
1= Interrupt on rising edge  
0= Interrupt on falling edge  
INTEDG2: External Interrupt 2 Edge Select bit  
1= Interrupt on rising edge  
0= Interrupt on falling edge  
bit 3  
bit 2  
Unimplemented: Read as ‘0’  
TMR0IP: TMR0 Overflow Interrupt Priority bit  
1= High priority  
0= Low priority  
bit 1  
bit 0  
Unimplemented: Read as ‘0’  
RBIP: RB Port Change Interrupt Priority bit  
1= High priority  
0= Low priority  
Legend:  
R = Readable bit  
-n = Value at POR  
W = Writable bit  
‘1’ = Bit is set  
U = Unimplemented bit, read as ‘0’  
‘0’ = Bit is cleared x = Bit is unknown  
Note:  
Interrupt flag bits are set when an interrupt condition occurs, regardless of the state  
of its corresponding enable bit or the global interrupt enable bit. User software  
should ensure the appropriate interrupt flag bits are clear prior to enabling an  
interrupt. This feature allows for software polling.  
DS39689F-page 100  
© 2009 Microchip Technology Inc.  
PIC18F2221/2321/4221/4321 FAMILY  
REGISTER 10-3: INTCON3: INTERRUPT CONTROL REGISTER 3  
R/W-1 R/W-1 U-0 R/W-0 R/W-0  
INT2IP INT1IP INT2IE INT1IE  
bit 7  
U-0  
R/W-0  
INT2IF  
R/W-0  
INT1IF  
bit 0  
bit 7  
bit 6  
INT2IP: INT2 External Interrupt Priority bit  
1= High priority  
0= Low priority  
INT1IP: INT1 External Interrupt Priority bit  
1= High priority  
0= Low priority  
bit 5  
bit 4  
Unimplemented: Read as ‘0’  
INT2IE: INT2 External Interrupt Enable bit  
1= Enables the INT2 external interrupt  
0= Disables the INT2 external interrupt  
bit 3  
INT1IE: INT1 External Interrupt Enable bit  
1= Enables the INT1 external interrupt  
0= Disables the INT1 external interrupt  
bit 2  
bit 1  
Unimplemented: Read as ‘0’  
INT2IF: INT2 External Interrupt Flag bit  
1= The INT2 external interrupt occurred (must be cleared in software)  
0= The INT2 external interrupt did not occur  
bit 0  
INT1IF: INT1 External Interrupt Flag bit  
1= The INT1 external interrupt occurred (must be cleared in software)  
0= The INT1 external interrupt did not occur  
Legend:  
R = Readable bit  
-n = Value at POR  
W = Writable bit  
‘1’ = Bit is set  
U = Unimplemented bit, read as ‘0’  
‘0’ = Bit is cleared x = Bit is unknown  
Note:  
Interrupt flag bits are set when an interrupt condition occurs, regardless of the state  
of its corresponding enable bit or the global interrupt enable bit. User software  
should ensure the appropriate interrupt flag bits are clear prior to enabling an  
interrupt. This feature allows for software polling.  
© 2009 Microchip Technology Inc.  
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10.2 PIR Registers  
Note 1: Interrupt flag bits are set when an interrupt  
condition occurs, regardless of the state of  
its corresponding enable bit or the Global  
Interrupt Enable bit, GIE (INTCON<7>).  
The PIR registers contain the individual flag bits for the  
peripheral interrupts. Due to the number of peripheral  
interrupt sources, there are two Peripheral Interrupt  
Request (Flag) registers (PIR1 and PIR2).  
2: User software should ensure the appropri-  
ate interrupt flag bits are cleared prior to  
enabling an interrupt and after servicing  
that interrupt.  
REGISTER 10-4: PIR1: PERIPHERAL INTERRUPT REQUEST (FLAG) REGISTER 1  
R/W-0  
PSPIF(1)  
bit 7  
R/W-0  
ADIF  
R-0  
R-0  
R/W-0  
SSPIF  
R/W-0  
R/W-0  
R/W-0  
RCIF  
TXIF  
CCP1IF  
TMR2IF  
TMR1IF  
bit 0  
bit 7  
PSPIF: Parallel Slave Port Read/Write Interrupt Flag bit(1)  
1= A read or a write operation has taken place (must be cleared in software)  
0= No read or write has occurred  
Note 1: This bit is unimplemented on 28-pin devices and will read as ‘0’.  
ADIF: A/D Converter Interrupt Flag bit  
bit 6  
bit 5  
bit 4  
bit 3  
bit 2  
1= An A/D conversion completed (must be cleared in software)  
0= The A/D conversion is not complete  
RCIF: EUSART Receive Interrupt Flag bit  
1= The EUSART receive buffer, RCREG, is full (cleared when RCREG is read)  
0= The EUSART receive buffer is empty  
TXIF: EUSART Transmit Interrupt Flag bit  
1= The EUSART transmit buffer, TXREG, is empty (cleared when TXREG is written)  
0= The EUSART transmit buffer is full  
SSPIF: Master Synchronous Serial Port Interrupt Flag bit  
1= The transmission/reception is complete (must be cleared in software)  
0= Waiting to transmit/receive  
CCP1IF: CCP1 Interrupt Flag bit  
Capture mode:  
1= A TMR1 register capture occurred (must be cleared in software)  
0= No TMR1 register capture occurred  
Compare mode:  
1= A TMR1 register compare match occurred (must be cleared in software)  
0= No TMR1 register compare match occurred  
PWM mode:  
Unused in this mode.  
bit 1  
bit 0  
TMR2IF: TMR2 to PR2 Match Interrupt Flag bit  
1= TMR2 to PR2 match occurred (must be cleared in software)  
0= No TMR2 to PR2 match occurred  
TMR1IF: TMR1 Overflow Interrupt Flag bit  
1= TMR1 register overflowed (must be cleared in software)  
0= TMR1 register did not overflow  
Legend:  
R = Readable bit  
-n = Value at POR  
W = Writable bit  
‘1’ = Bit is set  
U = Unimplemented bit, read as ‘0’  
‘0’ = Bit is cleared x = Bit is unknown  
DS39689F-page 102  
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REGISTER 10-5: PIR2: PERIPHERAL INTERRUPT REQUEST (FLAG) REGISTER 2  
R/W-0  
OSCFIF  
bit 7  
R/W-0  
CMIF  
U-0  
R/W-0  
EEIF  
R/W-0  
BCLIF  
R/W-0  
R/W-0  
R/W-0  
HLVDIF  
TMR3IF  
CCP2IF  
bit 0  
bit 7  
bit 6  
OSCFIF: Oscillator Fail Interrupt Flag bit  
1= Device oscillator failed, clock input has changed to INTOSC (must be cleared in software)  
0= Device clock operating  
CMIF: Comparator Interrupt Flag bit  
1= Comparator input has changed (must be cleared in software)  
0= Comparator input has not changed  
bit 5  
bit 4  
Unimplemented: Read as ‘0’  
EEIF: Data EEPROM/Flash Write Operation Interrupt Flag bit  
1= The write operation is complete (must be cleared in software)  
0= The write operation is not complete or has not been started  
bit 3  
bit 2  
BCLIF: Bus Collision Interrupt Flag bit  
1= A bus collision occurred (must be cleared in software)  
0= No bus collision occurred  
HLVDIF: High/Low-Voltage Detect Interrupt Flag bit  
1= A high/low-voltage condition occurred; direction determined by VDIRMAG bit  
(HLVDCON<7>)  
0= A high/low-voltage condition has not occurred  
bit 1  
bit 0  
TMR3IF: TMR3 Overflow Interrupt Flag bit  
1= TMR3 register overflowed (must be cleared in software)  
0= TMR3 register did not overflow  
CCP2IF: CCP2 Interrupt Flag bit  
Capture mode:  
1= A TMR1 register capture occurred (must be cleared in software)  
0= No TMR1 register capture occurred  
Compare mode:  
1= A TMR1 register compare match occurred (must be cleared in software)  
0= No TMR1 register compare match occurred  
PWM mode:  
Unused in this mode.  
Legend:  
R = Readable bit  
-n = Value at POR  
W = Writable bit  
‘1’ = Bit is set  
U = Unimplemented bit, read as ‘0’  
‘0’ = Bit is cleared x = Bit is unknown  
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10.3 PIE Registers  
The PIE registers contain the individual enable bits for  
the peripheral interrupts. Due to the number of periph-  
eral interrupt sources, there are two Peripheral Interrupt  
Enable registers (PIE1 and PIE2). When IPEN = 0, the  
PEIE bit must be set to enable any of these peripheral  
interrupts.  
REGISTER 10-6: PIE1: PERIPHERAL INTERRUPT ENABLE REGISTER 1  
R/W-0  
PSPIE(1)  
bit 7  
R/W-0  
ADIE  
R/W-0  
RCIE  
R/W-0  
TXIE  
R/W-0  
SSPIE  
R/W-0  
R/W-0  
R/W-0  
TMR1IE  
bit 0  
CCP1IE  
TMR2IE  
bit 7  
PSPIE: Parallel Slave Port Read/Write Interrupt Enable bit(1)  
1= Enables the PSP read/write interrupt  
0= Disables the PSP read/write interrupt  
Note 1: This bit is unimplemented on 28-pin devices and will read as ‘0’.  
ADIE: A/D Converter Interrupt Enable bit  
bit 6  
bit 5  
bit 4  
bit 3  
bit 2  
bit 1  
bit 0  
1= Enables the A/D interrupt  
0= Disables the A/D interrupt  
RCIE: EUSART Receive Interrupt Enable bit  
1= Enables the EUSART receive interrupt  
0= Disables the EUSART receive interrupt  
TXIE: EUSART Transmit Interrupt Enable bit  
1= Enables the EUSART transmit interrupt  
0= Disables the EUSART transmit interrupt  
SSPIE: Master Synchronous Serial Port Interrupt Enable bit  
1= Enables the MSSP interrupt  
0= Disables the MSSP interrupt  
CCP1IE: CCP1 Interrupt Enable bit  
1= Enables the CCP1 interrupt  
0= Disables the CCP1 interrupt  
TMR2IE: TMR2 to PR2 Match Interrupt Enable bit  
1= Enables the TMR2 to PR2 match interrupt  
0= Disables the TMR2 to PR2 match interrupt  
TMR1IE: TMR1 Overflow Interrupt Enable bit  
1= Enables the TMR1 overflow interrupt  
0= Disables the TMR1 overflow interrupt  
Legend:  
R = Readable bit  
-n = Value at POR  
W = Writable bit  
‘1’ = Bit is set  
U = Unimplemented bit, read as ‘0’  
‘0’ = Bit is cleared x = Bit is unknown  
DS39689F-page 104  
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REGISTER 10-7: PIE2: PERIPHERAL INTERRUPT ENABLE REGISTER 2  
R/W-0 R/W-0 U-0 R/W-0 R/W-0 R/W-0  
OSCFIE CMIE EEIE BCLIE HLVDIE  
bit 7  
R/W-0  
R/W-0  
TMR3IE  
CCP2IE  
bit 0  
bit 7  
bit 6  
OSCFIE: Oscillator Fail Interrupt Enable bit  
1= Enabled  
0= Disabled  
CMIE: Comparator Interrupt Enable bit  
1= Enabled  
0= Disabled  
bit 5  
bit 4  
Unimplemented: Read as ‘0’  
EEIE: Data EEPROM/Flash Write Operation Interrupt Enable bit  
1= Enabled  
0= Disabled  
bit 3  
bit 2  
bit 1  
bit 0  
BCLIE: Bus Collision Interrupt Enable bit  
1= Enabled  
0= Disabled  
HLVDIE: High/Low-Voltage Detect Interrupt Enable bit  
1= Enabled  
0= Disabled  
TMR3IE: TMR3 Overflow Interrupt Enable bit  
1= Enabled  
0= Disabled  
CCP2IE: CCP2 Interrupt Enable bit  
1= Enabled  
0= Disabled  
Legend:  
R = Readable bit  
-n = Value at POR  
W = Writable bit  
‘1’ = Bit is set  
U = Unimplemented bit, read as ‘0’  
‘0’ = Bit is cleared x = Bit is unknown  
© 2009 Microchip Technology Inc.  
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10.4 IPR Registers  
The IPR registers contain the individual priority bits for  
the peripheral interrupts. Due to the number of periph-  
eral interrupt sources, there are two Peripheral Interrupt  
Priority registers (IPR1 and IPR2). Using the priority bits  
requires that the Interrupt Priority Enable (IPEN) bit be  
set.  
REGISTER 10-8: IPR1: PERIPHERAL INTERRUPT PRIORITY REGISTER 1  
R/W-1  
PSPIP(1)  
bit 7  
R/W-1  
ADIP  
R/W-1  
RCIP  
R/W-1  
TXIP  
R/W-1  
SSPIP  
R/W-1  
R/W-1  
R/W-1  
TMR1IP  
bit 0  
CCP1IP  
TMR2IP  
bit 7  
PSPIP: Parallel Slave Port Read/Write Interrupt Priority bit(1)  
1= High priority  
0= Low priority  
Note 1: This bit is unimplemented on 28-pin devices and will read as ‘0’.  
ADIP: A/D Converter Interrupt Priority bit  
bit 6  
bit 5  
bit 4  
1= High priority  
0= Low priority  
RCIP: EUSART Receive Interrupt Priority bit  
1= High priority  
0= Low priority  
TXIP: EUSART Transmit Interrupt Priority bit  
1= High priority  
0= Low priority  
bit 3  
bit 2  
bit 1  
bit 0  
SSPIP: Master Synchronous Serial Port Interrupt Priority bit  
1= High priority  
0= Low priority  
CCP1IP: CCP1 Interrupt Priority bit  
1= High priority  
0= Low priority  
TMR2IP: TMR2 to PR2 Match Interrupt Priority bit  
1= High priority  
0= Low priority  
TMR1IP: TMR1 Overflow Interrupt Priority bit  
1= High priority  
0= Low priority  
Legend:  
R = Readable bit  
-n = Value at POR  
W = Writable bit  
‘1’ = Bit is set  
U = Unimplemented bit, read as ‘0’  
‘0’ = Bit is cleared x = Bit is unknown  
DS39689F-page 106  
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REGISTER 10-9: IPR2: PERIPHERAL INTERRUPT PRIORITY REGISTER 2  
R/W-1 R/W-1 U-0 R/W-1 R/W-1 R/W-1  
OSCFIP CMIP EEIP BCLIP HLVDIP  
bit 7  
R/W-1  
R/W-1  
TMR3IP  
CCP2IP  
bit 0  
bit 7  
bit 6  
OSCFIP: Oscillator Fail Interrupt Priority bit  
1= High priority  
0= Low priority  
CMIP: Comparator Interrupt Priority bit  
1= High priority  
0= Low priority  
bit 5  
bit 4  
Unimplemented: Read as ‘0’  
EEIP: Data EEPROM/Flash Write Operation Interrupt Priority bit  
1= High priority  
0= Low priority  
bit 3  
bit 2  
bit 1  
bit 0  
BCLIP: Bus Collision Interrupt Priority bit  
1= High priority  
0= Low priority  
HLVDIP: High/Low-Voltage Detect Interrupt Priority bit  
1= High priority  
0= Low priority  
TMR3IP: TMR3 Overflow Interrupt Priority bit  
1= High priority  
0= Low priority  
CCP2IP: CCP2 Interrupt Priority bit  
1= High priority  
0= Low priority  
Legend:  
R = Readable bit  
-n = Value at POR  
W = Writable bit  
‘1’ = Bit is set  
U = Unimplemented bit, read as ‘0’  
‘0’ = Bit is cleared x = Bit is unknown  
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The operation of the SBOREN bit and the Reset flag  
bits is discussed in more detail in Section 5.1 “RCON  
Register”.  
10.5 RCON Register  
The RCON register contains flag bits which are used to  
determine the cause of the last Reset or wake-up from  
Idle or Sleep modes. RCON also contains the IPEN bit  
which enables interrupt priorities.  
REGISTER 10-10: RCON: RESET CONTROL REGISTER  
R/W-0  
IPEN  
R/W-1(1)  
U-0  
R/W-1  
RI  
R-1  
TO  
R-1  
PD  
R/W-0(2)  
POR  
R/W-0  
BOR  
SBOREN  
bit 7  
bit 0  
bit 7  
bit 6  
IPEN: Interrupt Priority Enable bit  
1= Enable priority levels on interrupts  
0= Disable priority levels on interrupts (PIC16XXX Compatibility mode)  
SBOREN: Software BOR Enable bit(1)  
For details of bit operation, see Register 5-1.  
bit 5  
bit 4  
Unimplemented: Read as ‘0’  
RI: RESETInstruction Flag bit  
For details of bit operation, see Register 5-1.  
TO: Watchdog Time-out Flag bit  
bit 3  
bit 2  
bit 1  
bit 0  
For details of bit operation, see Register 5-1.  
PD: Power-down Detection Flag bit  
For details of bit operation, see Register 5-1.  
POR: Power-on Reset Status bit(2)  
For details of bit operation, see Register 5-1.  
BOR: Brown-out Reset Status bit  
For details of bit operation, see Register 5-1.  
Note 1: If SBOREN is enabled, its Reset state is ‘1’; otherwise, it is ‘0’.  
2: Actual Reset values are determined by device configuration and the nature of the  
device Reset. See Register 5-1 for additional information.  
Legend:  
R = Readable bit  
-n = Value at POR  
W = Writable bit  
‘1’ = Bit is set  
U = Unimplemented bit, read as ‘0’  
‘0’ = Bit is cleared x = Bit is unknown  
DS39689F-page 108  
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10.6 INTx Pin Interrupts  
10.7 TMR0 Interrupt  
External interrupts on the RB0/INT0, RB1/INT1 and  
RB2/INT2 pins are edge-triggered. If the corresponding  
INTEDGx bit in the INTCON2 register is set (= 1), the  
interrupt is triggered by a rising edge; if the bit is clear,  
the trigger is on the falling edge. When a valid edge  
appears on the RBx/INTx pin, the corresponding flag  
bit, INTxF, is set. This interrupt can be disabled by  
clearing the corresponding enable bit, INTxE. Flag bit,  
INTxF, must be cleared in software in the Interrupt  
Service Routine before re-enabling the interrupt.  
In 8-bit mode (which is the default), an overflow in the  
TMR0 register (FFh 00h) will set flag bit, TMR0IF. In  
16-bit mode, an overflow in the TMR0H:TMR0L  
register pair (FFFFh 0000h) will set TMR0IF. The  
interrupt can be enabled/disabled by setting/clearing  
enable bit, TMR0IE (INTCON<5>). Interrupt priority for  
Timer0 is determined by the value contained in the  
interrupt priority bit, TMR0IP (INTCON2<2>). See  
Section 12.0 “Timer0 Module” for further details on  
the Timer0 module.  
All external interrupts (INT0, INT1 and INT2) can wake-  
up the processor from Idle or Sleep modes if bit INTxE  
was set prior to going into those modes. If the Global  
Interrupt Enable bit, GIE, is set, the processor will  
branch to the interrupt vector following wake-up.  
10.8 PORTB Interrupt-on-Change  
An input change on PORTB<7:4> sets flag bit, RBIF  
(INTCON<0>). The interrupt can be enabled/disabled  
by setting/clearing enable bit, RBIE (INTCON<3>).  
Interrupt priority for PORTB interrupt-on-change is  
determined by the value contained in the interrupt  
priority bit, RBIP (INTCON2<0>).  
Interrupt priority for INT1 and INT2 is determined by  
the value contained in the interrupt priority bits,  
INT1IP (INTCON3<6>) and INT2IP (INTCON3<7>).  
There is no priority bit associated with INT0. It is  
always a high-priority interrupt source.  
10.9 Context Saving During Interrupts  
During interrupts, the return PC address is saved on  
the stack. Additionally, the WREG, STATUS and BSR  
registers are saved on the fast return stack. If a fast  
return from interrupt is not used (see Section 6.3  
“Data Memory Organization”), the user may need to  
save the WREG, STATUS and BSR registers on entry  
to the Interrupt Service Routine. Depending on the  
user’s application, other registers may also need to be  
saved. Example 10-1 saves and restores the WREG,  
STATUS and BSR registers during an Interrupt Service  
Routine.  
EXAMPLE 10-1:  
SAVING STATUS, WREG AND BSR REGISTERS IN RAM  
MOVWF  
MOVFF  
MOVFF  
;
W_TEMP  
STATUS, STATUS_TEMP  
BSR, BSR_TEMP  
; W_TEMP is in virtual bank  
; STATUS_TEMP located anywhere  
; BSR_TMEP located anywhere  
; USER ISR CODE  
;
MOVFF  
MOVF  
MOVFF  
BSR_TEMP, BSR  
W_TEMP, W  
STATUS_TEMP, STATUS  
; Restore BSR  
; Restore WREG  
; Restore STATUS  
© 2009 Microchip Technology Inc.  
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NOTES:  
DS39689F-page 110  
© 2009 Microchip Technology Inc.  
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Reading the PORTA register reads the status of the  
pins, whereas writing to it, will write to the port latch.  
11.0 I/O PORTS  
Depending on the device selected and features  
enabled, there are up to five ports available. Some pins  
of the I/O ports are multiplexed with an alternate  
function from the peripheral features on the device. In  
general, when a peripheral is enabled, that pin may not  
be used as a general purpose I/O pin.  
The Data Latch (LATA) register is also memory mapped.  
Read-modify-write operations on the LATA register read  
and write the latched output value for PORTA.  
The RA4 pin is multiplexed with the Timer0 module  
clock input and one of the comparator outputs to  
become the RA4/T0CKI/C1OUT pin. Pins RA6 and  
RA7 are multiplexed with the main oscillator pins. They  
are enabled as oscillator or I/O pins by the selection of  
the main oscillator in the Configuration register (see  
Section 24.1 “Configuration Bits” for details). When  
they are not used as port pins, RA6 and RA7 and their  
associated TRIS and LAT bits are read as ‘0’.  
Each port has three registers for its operation. These  
registers are:  
• TRIS register (Data Direction register)  
• PORT register (reads the levels on the pins of the  
device)  
• LAT register (Data Latch register)  
The other PORTA pins are multiplexed with analog  
inputs, the analog VREF+ and VREF- inputs and the  
comparator voltage reference output. The operation of  
pins RA<3:0> and RA5 as A/D converter inputs is  
selected by clearing or setting the control bits in the  
ADCON1 register (A/D Control Register 1).  
The Data Latch (LAT register) is useful for read-modify-  
write operations on the value that the I/O pins are  
driving.  
A simplified model of a generic I/O port, without the  
interfaces to other peripherals, is shown in Figure 11-1.  
Pins RA0 through RA5 may also be used as comparator  
inputs or outputs by setting the appropriate bits in the  
CMCON register. To use RA<3:0> as digital inputs, it is  
also necessary to turn off the comparators.  
FIGURE 11-1:  
GENERIC I/O PORT  
OPERATION  
RD LAT  
Note:  
On a Power-on Reset, RA5 and RA<3:0>  
are configured as analog inputs and read  
as ‘0’. RA4 is configured as a digital input.  
Data  
Bus  
D
Q
WR LAT  
I/O pin(1)  
or  
The RA4/T0CKI/C1OUT pin is a Schmitt Trigger input.  
All other PORTA pins have TTL input levels and full  
CMOS output drivers.  
PORT  
CK  
Data Latch  
D
Q
The TRISA register controls the direction of the PORTA  
pins, even when they are being used as analog inputs.  
The user must ensure the bits in the TRISA register are  
maintained set when using them as analog inputs.  
WR TRIS  
RD TRIS  
CK  
TRIS Latch  
Input  
Buffer  
EXAMPLE 11-1:  
INITIALIZING PORTA  
CLRF  
PORTA  
LATA  
0Fh  
; Initialize PORTA by  
; clearing output  
; data latches  
; Alternate method  
; to clear output  
; data latches  
Q
D
CLRF  
EN  
RD PORT  
MOVLW  
MOVWF  
MOVWF  
MOVWF  
MOVLW  
; Configure all A/D  
ADCON1 ; for digital inputs  
07h  
CMCON  
0CFh  
Note 1: I/O pins have diode protection to VDD and VSS.  
; Configure comparators  
; for digital input  
; Value used to  
11.1 PORTA, TRISA and LATA Registers  
; initialize data  
; direction  
PORTA is an 8-bit wide, bidirectional port. The corre-  
sponding Data Direction register is TRISA. Setting a  
TRISA bit (= 1) will make the corresponding PORTA pin  
an input (i.e., put the corresponding output driver in a  
High-Impedance mode). Clearing a TRISA bit (= 0) will  
make the corresponding PORTA pin an output (i.e., put  
the contents of the output latch on the selected pin).  
MOVWF  
TRISA  
; Set RA<7:6,3:0> as inputs  
; RA<5:4> as outputs  
© 2009 Microchip Technology Inc.  
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TABLE 11-1: PORTA I/O SUMMARY  
TRIS  
Setting  
I/O  
Type  
Pin  
RA0/AN0  
Function  
I/O  
Description  
RA0  
0
1
1
O
I
DIG LATA<0> data output; not affected by analog input.  
TTL PORTA<0> data input; disabled when analog input enabled.  
AN0  
RA1  
I
ANA A/D Input Channel 0 and Comparator C1- input. Default input  
configuration on POR; does not affect digital output.  
RA1/AN1  
0
1
1
O
I
DIG LATA<1> data output; not affected by analog input.  
TTL PORTA<1> data input; disabled when analog input enabled.  
AN1  
RA2  
I
ANA A/D Input Channel 1 and Comparator C2- input. Default input  
configuration on POR; does not affect digital output.  
RA2/AN2/  
VREF-/CVREF  
0
1
1
O
I
DIG LATA<2> data output; not affected by analog input. Disabled when  
CVREF output enabled.  
TTL PORTA<2> data input. Disabled when analog functions enabled;  
disabled when CVREF output enabled.  
AN2  
I
ANA A/D Input Channel 2 and Comparator C2+ input. Default input  
configuration on POR; not affected by analog output.  
VREF-  
1
x
I
ANA A/D and comparator voltage reference low input.  
CVREF  
O
ANA Comparator voltage reference output. Enabling this feature disables  
digital I/O.  
RA3/AN3/VREF+  
RA3  
AN3  
0
1
1
O
I
DIG LATA<3> data output; not affected by analog input.  
TTL PORTA<3> data input; disabled when analog input enabled.  
I
ANA A/D Input Channel 3 and Comparator C1+ input. Default input  
configuration on POR.  
VREF+  
RA4  
1
0
1
1
0
0
1
1
1
1
0
0
1
x
x
I
O
I
ANA A/D and comparator voltage reference high input.  
DIG LATA<4> data output.  
RA4/T0CKI/C1OUT  
ST  
ST  
PORTA<4> data input; default configuration on POR.  
Timer0 clock input.  
T0CKI  
C1OUT  
RA5  
I
O
O
I
DIG Comparator 1 output; takes priority over port data.  
RA5/AN4/SS/  
HLVDIN/C2OUT  
DIG LATA<5> data output; not affected by analog input.  
TTL PORTA<5> data input; disabled when analog input enabled.  
ANA A/D Input Channel 4. Default configuration on POR.  
TTL Slave Select input for MSSP (MSSP module).  
AN4  
SS  
I
I
HLVDIN  
C2OUT  
RA6  
I
ANA High/Low-Voltage Detect external trip point input.  
O
O
I
DIG Comparator 2 output; takes priority over port data.  
OSC2/CLKO/RA6  
OSC1/CLKI/RA7  
DIG LATA<6> data output. Enabled in RCIO, INTIO2 and ECIO modes only.  
TTL PORTA<6> data input. Enabled in RCIO, INTIO2 and ECIO modes only.  
ANA Main oscillator feedback output connection (XT, HS and LP modes).  
OSC2  
CLKO  
O
O
DIG System cycle clock output (FOSC/4) in RC, INTIO1 and EC Oscillator  
modes.  
RA7  
0
1
x
x
O
I
DIG LATA<7> data output. Disabled in external oscillator modes.  
TTL PORTA<7> data input. Disabled in external oscillator modes.  
ANA Main oscillator input connection.  
OSC1  
CLKI  
I
I
ANA Main clock input connection.  
Legend:  
DIG = Digital level output; TTL = TTL input buffer; ST = Schmitt Trigger input buffer; ANA = Analog level input/output;  
x= Don’t care (TRIS bit does not affect port direction or is overridden for this option).  
DS39689F-page 112  
© 2009 Microchip Technology Inc.  
PIC18F2221/2321/4221/4321 FAMILY  
TABLE 11-2: SUMMARY OF REGISTERS ASSOCIATED WITH PORTA  
Reset  
Values  
on page  
Name  
Bit 7  
Bit 6  
Bit 5  
Bit 4  
Bit 3  
Bit 2  
Bit 1  
Bit 0  
PORTA  
RA7(1)  
RA6(1)  
RA5  
RA4  
RA3  
RA2  
RA1  
RA0  
58  
58  
58  
57  
57  
57  
LATA  
LATA7(1) LATA6(1) PORTA Data Latch Register (Read and Write to Data Latch)  
TRISA7(1) TRISA6(1) PORTA Data Direction Register  
TRISA  
ADCON1  
CMCON  
CVRCON  
VCFG1  
C2INV  
CVRR  
VCFG0  
C1INV  
PCFG3  
CIS  
PCFG2  
CM2  
PCFG1  
CM1  
PCFG0  
CM0  
C2OUT  
CVREN  
C1OUT  
CVROE  
CVRSS  
CVR3  
CVR2  
CVR1  
CVR0  
Legend: — = unimplemented, read as ‘0’. Shaded cells are not used by PORTA.  
Note 1: RA<7:6> and their associated latch and data direction bits are enabled as I/O pins based on oscillator  
configuration; otherwise, they are read as ‘0’.  
© 2009 Microchip Technology Inc.  
DS39689F-page 113  
PIC18F2221/2321/4221/4321 FAMILY  
Four of the PORTB pins (RB<7:4>) have an interrupt-  
11.2 PORTB, TRISB and LATB  
Registers  
on-change feature. Only pins configured as inputs can  
cause this interrupt to occur (i.e., any RB<7:4> pin  
configured as an output is excluded from the interrupt-  
on-change comparison). The input pins (of RB<7:4>)  
are compared with the old value latched on the last  
read of PORTB. The “mismatch” outputs of RB<7:4>  
are ORed together to generate the RB Port Change  
Interrupt with Flag bit, RBIF (INTCON<0>).  
PORTB is an 8-bit wide, bidirectional port. The  
corresponding Data Direction register is TRISB. Setting  
a TRISB bit (= 1) will make the corresponding PORTB  
pin an input (i.e., put the corresponding output driver in  
a High-Impedance mode). Clearing a TRISB bit (= 0)  
will make the corresponding PORTB pin an output (i.e.,  
put the contents of the output latch on the selected pin).  
This interrupt can wake the device from Sleep mode or  
any of the Idle modes. The user, in the Interrupt Service  
Routine, can clear the interrupt in the following manner:  
The Data Latch register (LATB) is also memory  
mapped. Read-modify-write operations on the LATB  
register read and write the latched output value for  
PORTB.  
a) Any read or write of PORTB (except with the  
MOVFF (ANY), PORTBinstruction).  
b) 1 TCY.  
EXAMPLE 11-2:  
INITIALIZING PORTB  
c) Clear flag bit, RBIF.  
CLRF  
PORTB  
LATB  
0Fh  
; Initialize PORTB by  
; clearing output  
; data latches  
; Alternate method  
; to clear output  
; data latches  
A mismatch condition will continue to set flag bit, RBIF.  
Reading PORTB and waiting 1 TCY will end the  
mismatch condition and allow flag bit, RBIF, to be  
cleared. Also, if the port pin returns to its original state,  
the mismatch condition will be cleared.  
CLRF  
MOVLW  
MOVWF  
; Set RB<4:0> as  
The interrupt-on-change feature is recommended for  
wake-up on key depression operation and operations  
where PORTB is only used for the interrupt-on-change  
feature. Polling of PORTB is not recommended while  
using the interrupt-on-change feature.  
ADCON1 ; digital I/O pins  
; (required if config bit  
; PBADEN is set)  
; Value used to  
; initialize data  
; direction  
; Set RB<3:0> as inputs  
; RB<5:4> as outputs  
; RB<7:6> as inputs  
MOVLW  
MOVWF  
0CFh  
RB3 can be configured by the Configuration bit,  
CCP2MX, as the alternate peripheral pin for the CCP2  
module (CCP2MX = 0).  
TRISB  
Each of the PORTB pins has a weak internal pull-up. A  
single control bit can turn on all the pull-ups. This is  
performed by clearing bit, RBPU (INTCON2<7>). The  
weak pull-up is automatically turned off when the port  
pin is configured as an output. The pull-ups are  
disabled on a Power-on Reset.  
Note:  
On a Power-on Reset, RB<4:0> are  
configured as analog inputs by default and  
read as ‘0’; RB<7:5> are configured as  
digital inputs.  
By clearing the Configuration bit,  
PBADEN, RB<4:0> will alternatively be  
configured as digital inputs on POR.  
DS39689F-page 114  
© 2009 Microchip Technology Inc.  
PIC18F2221/2321/4221/4321 FAMILY  
TABLE 11-3: PORTB I/O SUMMARY  
TRIS  
Setting  
I/O  
Type  
Pin  
Function  
I/O  
Description  
RB0/INT0/FLT0/  
AN12  
RB0  
0
1
O
I
DIG  
TTL  
LATB<0> data output; not affected by analog input.  
PORTB<0> data input; weak pull-up when RBPU bit is cleared.  
(1)  
Disabled when analog input enabled.  
INT0  
FLT0  
AN12  
RB1  
1
1
1
0
1
I
I
ST  
ST  
External Interrupt 0 input.  
Enhanced PWM Fault input (ECCP1 module); enabled in software.  
(1)  
I
ANA  
DIG  
TTL  
A/D Input Channel 12.  
RB1/INT1/AN10  
RB2/INT2/AN8  
RB3/AN9/CCP2  
O
I
LATB<1> data output; not affected by analog input.  
PORTB<1> data input; weak pull-up when RBPU bit is cleared.  
Disabled when analog input enabled.  
(1)  
INT1  
AN10  
RB2  
1
1
0
1
I
I
ST  
ANA  
DIG  
TTL  
External Interrupt 1 input.  
(1)  
A/D Input Channel 10.  
O
I
LATB<2> data output; not affected by analog input.  
PORTB<2> data input; weak pull-up when RBPU bit is cleared.  
Disabled when analog input enabled.  
(1)  
INT2  
AN8  
RB3  
1
1
0
1
I
I
ST  
ANA  
DIG  
TTL  
External Interrupt 2 input.  
(1)  
A/D Input Channel 8.  
O
I
LATB<3> data output; not affected by analog input.  
PORTB<3> data input; weak pull-up when RBPU bit is cleared.  
Disabled when analog input enabled.  
(1)  
(1)  
AN9  
1
0
1
0
1
I
O
I
ANA  
DIG  
ST  
A/D Input Channel 9.  
(2)  
CCP2  
CCP2 compare and PWM output.  
CCP2 capture input.  
RB4/KBI0/AN11  
RB5/KBI1/PGM  
RB4  
O
I
DIG  
TTL  
LATB<4> data output; not affected by analog input.  
PORTB<4> data input; weak pull-up when RBPU bit is cleared.  
Disabled when analog input enabled.  
(1)  
KBI0  
AN11  
RB5  
1
1
0
1
1
x
I
I
TTL  
ANA  
DIG  
TTL  
TTL  
ST  
Interrupt-on-change pin.  
(1)  
A/D Input Channel 11.  
O
I
LATB<5> data output.  
PORTB<5> data input; weak pull-up when RBPU bit is cleared.  
Interrupt-on-change pin.  
KBI1  
PGM  
I
I
Single-Supply Programming mode entry (ICSP™). Enabled by LVP  
Configuration bit; all other pin functions disabled.  
RB6/KBI2/PGC  
RB7/KBI3/PGD  
RB6  
0
1
1
x
0
1
1
x
x
O
I
DIG  
TTL  
TTL  
ST  
LATB<6> data output.  
PORTB<6> data input; weak pull-up when RBPU bit is cleared.  
Interrupt-on-change pin.  
KBI2  
PGC  
RB7  
I
(3)  
I
Serial execution (ICSP™) clock input for ICSP and ICD operation.  
LATB<7> data output.  
O
I
DIG  
TTL  
TTL  
DIG  
ST  
PORTB<7> data input; weak pull-up when RBPU bit is cleared.  
Interrupt-on-change pin.  
KBI3  
PGD  
I
(3)  
O
I
Serial execution data output for ICSP and ICD operation.  
(3)  
Serial execution data input for ICSP and ICD operation.  
Legend:  
DIG = Digital level output; TTL = TTL input buffer; ST = Schmitt Trigger input buffer; ANA = Analog level input/output;  
x= Don’t care (TRIS bit does not affect port direction or is overridden for this option).  
Note 1: Configuration on POR is determined by the PBADEN Configuration bit. Pins are configured as analog inputs by default  
when PBADEN is set and digital inputs when PBADEN is cleared.  
2: Alternate assignment for CCP2 when the CCP2MX Configuration bit is ‘0’. Default assignment is RC1.  
3: All other pin functions are disabled when ICSP or ICD are enabled.  
© 2009 Microchip Technology Inc.  
DS39689F-page 115  
PIC18F2221/2321/4221/4321 FAMILY  
TABLE 11-4: SUMMARY OF REGISTERS ASSOCIATED WITH PORTB  
Reset  
Values  
on page  
Name  
Bit 7  
Bit 6  
Bit 5  
Bit 4  
Bit 3  
Bit 2  
Bit 1  
Bit 0  
PORTB  
RB7  
RB6  
RB5  
RB4  
RB3  
RB2  
RB1  
RB0  
58  
58  
58  
55  
55  
55  
57  
LATB  
PORTB Data Latch Register (Read and Write to Data Latch)  
PORTB Data Direction Register  
TRISB  
INTCON  
INTCON2  
INTCON3  
ADCON1  
GIE/GIEH PEIE/GIEL TMR0IE  
INT0IE  
RBIE  
TMR0IF  
TMR0IP  
INT0IF  
RBIF  
RBIP  
RBPU  
INT2IP  
INTEDG0 INTEDG1 INTEDG2  
INT1IP  
INT2IE  
VCFG0  
INT1IE  
PCFG3  
INT2IF  
PCFG1  
INT1IF  
PCFG0  
VCFG1  
PCFG2  
Legend: — = unimplemented, read as ‘0’. Shaded cells are not used by PORTB.  
DS39689F-page 116  
© 2009 Microchip Technology Inc.  
PIC18F2221/2321/4221/4321 FAMILY  
11.3 PORTC, TRISC and LATC  
Registers  
Note:  
On a Power-on Reset, these pins are  
configured as digital inputs.  
PORTC is an 8-bit wide, bidirectional port. The  
corresponding Data Direction register is TRISC. Set-  
ting a TRISC bit (= 1) will make the corresponding  
PORTC pin an input (i.e., put the corresponding output  
driver in a High-Impedance mode). Clearing a TRISC  
bit (= 0) will make the corresponding PORTC pin an  
output (i.e., put the contents of the output latch on the  
selected pin).  
The contents of the TRISC register are affected by  
peripheral overrides. Reading TRISC always returns  
the current contents, even though a peripheral device  
may be overriding one or more of the pins.  
EXAMPLE 11-3:  
INITIALIZING PORTC  
CLRF  
PORTC  
; Initialize PORTC by  
; clearing output  
; data latches  
The Data Latch register (LATC) is also memory  
mapped. Read-modify-write operations on the LATC  
register read and write the latched output value for  
PORTC.  
CLRF  
LATC  
; Alternate method  
; to clear output  
; data latches  
MOVLW  
MOVWF  
0CFh  
; Value used to  
; initialize data  
; direction  
; Set RC<3:0> as inputs  
; RC<5:4> as outputs  
; RC<7:6> as inputs  
PORTC is multiplexed with several peripheral functions  
(Table 11-5). The pins have Schmitt Trigger input  
buffers. RC1 is normally configured by Configuration  
bit, CCP2MX, as the default peripheral pin of the CCP2  
module (default/erased state, CCP2MX = 1).  
TRISC  
When enabling peripheral functions, care should be  
taken in defining TRIS bits for each PORTC pin. Some  
peripherals override the TRIS bit to make a pin an output,  
while other peripherals override the TRIS bit to make a  
pin an input. The user should refer to the corresponding  
peripheral section for additional information.  
© 2009 Microchip Technology Inc.  
DS39689F-page 117  
PIC18F2221/2321/4221/4321 FAMILY  
TABLE 11-5: PORTC I/O SUMMARY  
TRIS  
Setting  
I/O  
Type  
Pin  
Function  
I/O  
Description  
RC0/T1OSO/  
T13CKI  
RC0  
0
1
x
O
I
DIG  
ST  
LATC<0> data output.  
PORTC<0> data input.  
T1OSO  
O
ANA  
Timer1 oscillator output; enabled when Timer1 oscillator enabled.  
Disables digital I/O.  
T13CKI  
RC1  
1
0
1
x
I
O
I
ST  
DIG  
ST  
Timer1/Timer3 counter input.  
LATC<1> data output.  
RC1/T1OSI/CCP2  
PORTC<1> data input.  
T1OSI  
I
ANA  
Timer1 oscillator input; enabled when Timer1 oscillator enabled.  
Disables digital I/O.  
(1)  
CCP2  
0
1
0
1
0
1
0
O
I
DIG  
ST  
CCP2 compare and PWM output; takes priority over port data.  
CCP2 capture input.  
RC2/CCP1/P1A  
RC2  
O
I
DIG  
ST  
LATC<2> data output.  
PORTC<2> data input.  
CCP1  
O
I
DIG  
ST  
CCP1 compare or PWM output; takes priority over port data.  
CCP1 capture input.  
(2)  
P1A  
O
DIG  
ECCP1 Enhanced PWM output, Channel A. May be configured for  
tri-state during Enhanced PWM shutdown events. Takes priority over  
port data.  
RC3/SCK/SCL  
RC3  
SCK  
SCL  
RC4  
0
1
0
1
0
1
0
1
1
1
1
0
1
0
0
1
1
O
I
DIG  
ST  
LATC<3> data output.  
PORTC<3> data input.  
O
I
DIG  
ST  
SPI clock output (MSSP module); takes priority over port data.  
SPI clock input (MSSP module).  
2
O
I
DIG  
I C™ clock output (MSSP module); takes priority over port data.  
2
2
I C/SMB I C clock input (MSSP module); input type depends on module setting.  
RC4/SDI/SDA  
O
I
DIG  
ST  
LATC<4> data output.  
PORTC<4> data input.  
SDI  
I
ST  
SPI data input (MSSP module).  
2
SDA  
O
I
DIG  
I C data output (MSSP module); takes priority over port data.  
2
2
I C/SMB I C data input (MSSP module); input type depends on module setting.  
RC5/SDO  
RC5  
O
I
DIG  
ST  
LATC<5> data output.  
PORTC<5> data input.  
SDO  
RC6  
O
O
I
DIG  
DIG  
ST  
SPI data output (MSSP module); takes priority over port data.  
LATC<6> data output.  
RC6/TX/CK  
PORTC<6> data input.  
TX  
CK  
O
DIG  
Asynchronous serial transmit data output (EUSART module);  
takes priority over port data. User must configure as output.  
1
O
DIG  
Synchronous serial clock output (EUSART module); takes priority  
over port data.  
1
0
1
1
1
I
O
I
ST  
DIG  
ST  
Synchronous serial clock input (EUSART module).  
LATC<7> data output.  
RC7/RX/DT  
RC7  
PORTC<7> data input.  
RX  
DT  
I
ST  
Asynchronous serial receive data input (EUSART module).  
O
DIG  
Synchronous serial data output (EUSART module); takes priority over  
port data.  
1
I
ST  
Synchronous serial data input (EUSART module). User must  
configure as an input.  
Legend:  
DIG = Digital level output; TTL = TTL input buffer; ST = Schmitt Trigger input buffer; ANA = Analog level input/output;  
I C/SMB = I C/SMBus input buffer; x= Don’t care (TRIS bit does not affect port direction or is overridden for this option).  
2
2
Note 1: Default assignment for CCP2 when the CCP2MX Configuration bit is set. Alternate assignment is RB3.  
2: Enhanced PWM output is available only on PIC18F4221/4321 devices.  
DS39689F-page 118  
© 2009 Microchip Technology Inc.  
PIC18F2221/2321/4221/4321 FAMILY  
TABLE 11-6: SUMMARY OF REGISTERS ASSOCIATED WITH PORTC  
Reset  
Values  
on page  
Name  
Bit 7  
Bit 6  
Bit 5  
Bit 4  
Bit 3  
Bit 2  
Bit 1  
Bit 0  
PORTC  
RC7  
RC6  
RC5  
RC4  
RC3  
RC2  
RC1  
RC0  
58  
58  
58  
LATC  
PORTC Data Latch Register (Read and Write to Data Latch)  
PORTC Data Direction Register  
TRISC  
© 2009 Microchip Technology Inc.  
DS39689F-page 119  
PIC18F2221/2321/4221/4321 FAMILY  
PORTD can also be configured as an 8-bit wide micro-  
11.4 PORTD, TRISD and LATD  
Registers  
processor port (Parallel Slave Port) by setting control  
bit, PSPMODE (TRISE<4>). In this mode, the input  
buffers are TTL. See Section 11.6 “Parallel Slave  
Port” for additional information on the Parallel Slave  
Port (PSP).  
Note:  
PORTD is only available on 40/44-pin  
devices.  
PORTD is an 8-bit wide, bidirectional port. The  
corresponding Data Direction register is TRISD. Set-  
ting a TRISD bit (= 1) will make the corresponding  
PORTD pin an input (i.e., put the corresponding output  
driver in a High-Impedance mode). Clearing a TRISD  
bit (= 0) will make the corresponding PORTD pin an  
output (i.e., put the contents of the output latch on the  
selected pin).  
Note:  
When the Enhanced PWM mode is used  
with either dual or quad outputs, the PSP  
functions of PORTD are automatically  
disabled.  
EXAMPLE 11-4:  
INITIALIZING PORTD  
CLRF  
PORTD  
; Initialize PORTD by  
; clearing output  
; data latches  
The Data Latch register (LATD) is also memory  
mapped. Read-modify-write operations on the LATD  
register read and write the latched output value for  
PORTD.  
CLRF  
LATD  
; Alternate method  
; to clear output  
; data latches  
All pins on PORTD are implemented with Schmitt Trigger  
input buffers. Each pin is individually configurable as an  
input or output.  
MOVLW  
MOVWF  
0CFh  
; Value used to  
; initialize data  
; direction  
; Set RD<3:0> as inputs  
; RD<5:4> as outputs  
; RD<7:6> as inputs  
TRISD  
Three of the PORTD pins are multiplexed with outputs  
P1B, P1C and P1D of the Enhanced CCP module. The  
operation of these additional PWM output pins is  
covered in greater detail in Section 17.0 “Enhanced  
Capture/Compare/PWM (ECCP) Module”.  
Note:  
On a Power-on Reset, these pins are  
configured as digital inputs.  
DS39689F-page 120  
© 2009 Microchip Technology Inc.  
PIC18F2221/2321/4221/4321 FAMILY  
TABLE 11-7: PORTD I/O SUMMARY  
TRIS  
Setting  
I/O  
Type  
Pin  
Function  
I/O  
Description  
RD0/PSP0  
RD0  
0
1
x
x
0
1
x
x
0
1
x
x
0
1
x
x
0
1
x
x
0
1
x
x
0
O
I
DIG  
ST  
LATD<0> data output.  
PORTD<0> data input.  
PSP0  
RD1  
O
I
DIG  
TTL  
DIG  
ST  
PSP read data output (LATD<0>); takes priority over port data.  
PSP write data input.  
RD1/PSP1  
RD2/PSP2  
RD3/PSP3  
RD4/PSP4  
RD5/PSP5/P1B  
O
I
LATD<1> data output.  
PORTD<1> data input.  
PSP1  
RD2  
O
I
DIG  
TTL  
DIG  
ST  
PSP read data output (LATD<1>); takes priority over port data.  
PSP write data input.  
O
I
LATD<2> data output.  
PORTD<2> data input.  
PSP2  
RD3  
O
I
DIG  
TTL  
DIG  
ST  
PSP read data output (LATD<2>); takes priority over port data.  
PSP write data input.  
O
I
LATD<3> data output.  
PORTD<3> data input.  
PSP3  
RD4  
O
I
DIG  
TTL  
DIG  
ST  
PSP read data output (LATD<3>); takes priority over port data.  
PSP write data input.  
O
I
LATD<4> data output.  
PORTD<4> data input.  
PSP4  
RD5  
O
I
DIG  
TTL  
DIG  
ST  
PSP read data output (LATD<4>); takes priority over port data.  
PSP write data input.  
O
I
LATD<5> data output.  
PORTD<5> data input.  
PSP5  
P1B  
O
I
DIG  
TTL  
DIG  
PSP read data output (LATD<5>); takes priority over port data.  
PSP write data input.  
O
ECCP1 Enhanced PWM output, Channel B; takes priority over port and  
PSP data. May be configured for tri-state during Enhanced PWM  
shutdown events.  
RD6/PSP6/P1C  
RD6  
PSP6  
P1C  
0
1
x
x
0
O
I
DIG  
ST  
LATD<6> data output.  
PORTD<6> data input.  
O
I
DIG  
TTL  
DIG  
PSP read data output (LATD<6>); takes priority over port data.  
PSP write data input.  
O
ECCP1 Enhanced PWM output, channel C; takes priority over port and  
PSP data. May be configured for tri-state during Enhanced PWM  
shutdown events.  
RD7/PSP7/P1D  
RD7  
PSP7  
P1D  
0
1
x
x
0
O
I
DIG  
ST  
LATD<7> data output.  
PORTD<7> data input.  
O
I
DIG  
TTL  
DIG  
PSP read data output (LATD<7>); takes priority over port data.  
PSP write data input.  
O
ECCP1 Enhanced PWM output, Channel D; takes priority over port  
and PSP data. May be configured for tri-state during Enhanced PWM  
shutdown events.  
Legend:  
DIG = Digital level output; TTL = TTL input buffer; ST = Schmitt Trigger input buffer; x= Don’t care  
(TRIS bit does not affect port direction or is overridden for this option).  
© 2009 Microchip Technology Inc.  
DS39689F-page 121  
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TABLE 11-8: SUMMARY OF REGISTERS ASSOCIATED WITH PORTD  
Reset  
Values  
on page  
Name  
Bit 7  
Bit 6  
Bit 5  
Bit 4  
Bit 3  
Bit 2  
Bit 1  
Bit 0  
PORTD  
LATD  
RD7  
RD6  
RD5  
RD4  
RD3  
RD2  
RD1  
RD0  
58  
58  
58  
58  
57  
PORTD Data Latch Register (Read and Write to Data Latch)  
PORTD Data Direction Register  
TRISD  
TRISE  
IBF  
OBF  
IBOV  
PSPMODE  
TRISE2  
TRISE1  
TRISE0  
CCP1CON  
P1M1  
P1M0  
DC1B1  
DC1B0 CCP1M3 CCP1M2 CCP1M1 CCP1M0  
Legend: — = unimplemented, read as ‘0’. Shaded cells are not used by PORTD.  
DS39689F-page 122  
© 2009 Microchip Technology Inc.  
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The fourth pin of PORTE (MCLR/VPP/RE3) is an input  
11.5 PORTE, TRISE and LATE  
only pin. Its operation is controlled by the MCLRE Con-  
figuration bit. When selected as a port pin (MCLRE = 0),  
it functions as a digital input only pin; as such, it does not  
have TRIS or LAT bits associated with its operation.  
Otherwise, it functions as the device’s Master Clear  
input. In either configuration, RE3 also functions as the  
programming voltage input during programming.  
Registers  
Depending on the particular PIC18F2221/2321/4221/  
4321 family device selected, PORTE is implemented in  
two different ways.  
For 40/44-pin devices, PORTE is a 4-bit wide port.  
Three pins (RE0/RD/AN5, RE1/WR/AN6 and RE2/CS/  
AN7) are individually configurable as inputs or outputs.  
These pins have Schmitt Trigger input buffers. When  
selected as analog inputs, these pins will read as ‘0’.  
Note:  
On a Power-on Reset, RE3 is enabled as  
digital input only if Master Clear  
functionality is disabled.  
a
The corresponding Data Direction register is TRISE.  
Setting a TRISE bit (= 1) will make the corresponding  
PORTE pin an input (i.e., put the corresponding output  
driver in a High-Impedance mode). Clearing a TRISE  
bit (= 0) will make the corresponding PORTE pin an  
output (i.e., put the contents of the output latch on the  
selected pin).  
EXAMPLE 11-5:  
INITIALIZING PORTE  
CLRF  
PORTE  
LATE  
0Fh  
; Initialize PORTE by  
; clearing output  
; data latches  
; Alternate method  
; to clear output  
; data latches  
CLRF  
TRISE controls the direction of the RE pins, even when  
they are being used as analog inputs. The user must  
make sure to keep the pins configured as inputs when  
using them as analog inputs.  
MOVLW  
MOVWF  
MOVLW  
; Configure A/D  
ADCON1 ; for digital inputs  
03h  
; Value used to  
; initialize data  
; direction  
; Set RE<0> as inputs  
; RE<1> as outputs  
; RE<2> as inputs  
Note:  
On a Power-on Reset, RE<2:0> are  
configured as analog inputs.  
MOVWF  
TRISE  
The upper four bits of the TRISE register also control  
the operation of the Parallel Slave Port. Their operation  
is explained in Register 11-1.  
11.5.1  
PORTE IN 28-PIN DEVICES  
For 28-pin devices, PORTE is only available when  
Master Clear functionality is disabled (MCLRE = 0). In  
these cases, PORTE is a single bit, input only port  
comprised of RE3 only. The pin operates as previously  
described.  
The Data Latch register (LATE) is also memory  
mapped. Read-modify-write operations on the LATE  
register, read and write the latched output value for  
PORTE.  
© 2009 Microchip Technology Inc.  
DS39689F-page 123  
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REGISTER 11-1: TRISE REGISTER (40/44-PIN DEVICES ONLY)  
R-0  
IBF  
R-0  
R/W-0  
IBOV  
R/W-0  
U-0  
R/W-1  
R/W-1  
R/W-1  
OBF  
PSPMODE  
TRISE2  
TRISE1  
TRISE0  
bit 7  
bit 0  
bit 7  
bit 6  
bit 5  
bit 4  
IBF: Input Buffer Full Status bit  
1= A word has been received and waiting to be read by the CPU  
0= No word has been received  
OBF: Output Buffer Full Status bit  
1= The output buffer still holds a previously written word  
0= The output buffer has been read  
IBOV: Input Buffer Overflow Detect bit (in Microprocessor mode)  
1= A write occurred when a previously input word has not been read (must be cleared in software)  
0= No overflow occurred  
PSPMODE: Parallel Slave Port Mode Select bit  
1= Parallel Slave Port mode  
0= General Purpose I/O mode  
bit 3  
bit 2  
Unimplemented: Read as ‘0’  
TRISE2: RE2 Direction Control bit  
1= Input  
0= Output  
bit 1  
bit 0  
TRISE1: RE1 Direction Control bit  
1= Input  
0= Output  
TRISE0: RE0 Direction Control bit  
1= Input  
0= Output  
Legend:  
R = Readable bit  
-n = Value at POR  
W = Writable bit  
‘1’ = Bit is set  
U = Unimplemented bit, read as ‘0’  
‘0’ = Bit is cleared x = Bit is unknown  
DS39689F-page 124  
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TABLE 11-9: PORTE I/O SUMMARY  
TRIS  
Setting  
I/O  
Type  
Pin  
Function  
I/O  
Description  
RE0/RD/AN5  
RE0  
0
1
1
1
0
1
1
1
0
1
1
1
O
I
DIG  
ST  
LATE<0> data output; not affected by analog input.  
PORTE<0> data input; disabled when analog input enabled.  
PSP read enable input (PSP enabled).  
RD  
I
TTL  
ANA  
DIG  
ST  
AN5  
RE1  
I
A/D Input Channel 5; default input configuration on POR.  
LATE<1> data output; not affected by analog input.  
PORTE<1> data input; disabled when analog input enabled.  
PSP write enable input (PSP enabled).  
RE1/WR/AN6  
RE2/CS/AN7  
MCLR/VPP/RE3  
O
I
WR  
AN6  
RE2  
I
TTL  
ANA  
DIG  
ST  
I
A/D Input Channel 6; default input configuration on POR.  
LATE<2> data output; not affected by analog input.  
PORTE<2> data input; disabled when analog input enabled.  
PSP write enable input (PSP enabled).  
O
I
CS  
AN7  
I
TTL  
ANA  
ST  
I
A/D Input Channel 7; default input configuration on POR.  
(1)  
MCLR  
I
External Master Clear input; enabled when MCLRE Configuration bit  
is set.  
VPP  
I
I
ANA  
ST  
High-voltage detection; used for ICSP™ mode entry detection. Always  
available, regardless of pin mode.  
(2)  
RE3  
PORTE<3> data input; enabled when MCLRE Configuration bit is  
clear.  
Legend:  
DIG = Digital level output; TTL = TTL input buffer; ST = Schmitt Trigger input buffer; ANA = Analog level input/output;  
x= Don’t care (TRIS bit does not affect port direction or is overridden for this option).  
Note 1: RE3 is available on both 28-pin and 40/44-pin devices. All other PORTE pins are only implemented on 40/44-pin devices.  
2: RE3 does not have a corresponding TRIS bit to control data direction.  
TABLE 11-10: SUMMARY OF REGISTERS ASSOCIATED WITH PORTE  
Reset  
Name  
Bit 7  
Bit 6  
Bit 5  
Bit 4  
Bit 3  
Bit 2  
Bit 1  
Bit 0  
Values  
on page  
PORTE  
LATE(2)  
RE3(1,2)  
RE2  
RE1  
RE0  
58  
58  
PORTE Data Latch Register  
(Read and Write to Data Latch)  
TRISE  
IBF  
OBF  
IBOV  
PSPMODE  
VCFG0  
TRISE2  
PCFG2  
TRISE1  
PCFG1  
TRISE0  
PCFG0  
58  
57  
ADCON1  
VCFG1  
PCFG3  
Legend: — = unimplemented, read as ‘0’. Shaded cells are not used by PORTE.  
Note 1: Implemented only when Master Clear functionality is disabled (MCLRE Configuration bit = 0).  
2: RE3 is the only PORTE bit implemented on both 28-pin and 40/44-pin devices. All other bits are  
implemented only when PORTE is implemented (i.e., 40/44-pin devices).  
© 2009 Microchip Technology Inc.  
DS39689F-page 125  
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The timing for the control signals in Write and Read  
modes is shown in Figure 11-3 and Figure 11-4,  
respectively.  
11.6 Parallel Slave Port  
Note:  
The Parallel Slave Port is only available on  
40/44-pin devices.  
FIGURE 11-2:  
PORTD AND PORTE  
BLOCK DIAGRAM  
(PARALLEL SLAVE PORT)  
In addition to its function as a general I/O port, PORTD  
can also operate as an 8-bit wide Parallel Slave Port  
(PSP) or microprocessor port. PSP operation is  
controlled by the 4 upper bits of the TRISE register  
(Register 11-1). Setting control bit, PSPMODE  
(TRISE<4>), enables PSP operation as long as the  
Enhanced CCP module is not operating in Dual Output  
or Quad Output PWM mode. In Slave mode, the port is  
asynchronously readable and writable by the external  
world.  
One bit of PORTD  
Data Bus  
D
Q
RDx pin  
WR LATD  
or  
WR PORTD  
CK  
Data Latch  
TTL  
The PSP can directly interface to an 8-bit micro-  
processor data bus. The external microprocessor can  
read or write the PORTD latch as an 8-bit latch. Setting  
the control bit, PSPMODE, enables the PORTE I/O  
pins to become control inputs for the microprocessor  
port. When set, port pin RE0 is the RD input, RE1 is the  
WR input and RE2 is the CS (Chip Select) input. For  
this functionality, the corresponding data direction bits  
of the TRISE register (TRISE<2:0>) must be config-  
ured as inputs (set). The A/D port configuration bits,  
PFCG<3:0> (ADCON1<3:0>), must also be set to a  
value in the range of ‘1010’ through ‘1111’.  
Q
D
RD PORTD  
RD LATD  
EN  
Set Interrupt Flag  
PSPIF (PIR1<7>)  
A write to the PSP occurs when both the CS and WR  
lines are first detected low and ends when either are  
detected high. The PSPIF and IBF flag bits are both set  
when the write ends.  
PORTE Pins  
Read  
RD  
CS  
WR  
TTL  
Chip Select  
TTL  
A read from the PSP occurs when both the CS and RD  
lines are first detected low. The data in PORTD is read  
out and the OBF bit is clear. If the user writes new data  
to PORTD to set OBF, the data is immediately read out;  
however, the OBF bit is not set.  
Write  
TTL  
Note:  
I/O pins have diode protection to VDD and VSS.  
When either the CS or RD lines are detected high, the  
PORTD pins return to the input state and the PSPIF bit  
is set. User applications should wait for PSPIF to be set  
before servicing the PSP. When this happens, the IBF  
and OBF bits can be polled and the appropriate action  
taken.  
DS39689F-page 126  
© 2009 Microchip Technology Inc.  
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FIGURE 11-3:  
PARALLEL SLAVE PORT WRITE WAVEFORMS  
Q1  
Q2  
Q3  
Q4  
Q1  
Q2  
Q3  
Q4  
Q1  
Q2  
Q3  
Q4  
CS  
WR  
RD  
PORTD<7:0>  
IBF  
OBF  
PSPIF  
FIGURE 11-4:  
PARALLEL SLAVE PORT READ WAVEFORMS  
Q1  
Q2  
Q3  
Q4  
Q1  
Q2  
Q3  
Q4  
Q1  
Q2  
Q3  
Q4  
CS  
WR  
RD  
PORTD<7:0>  
IBF  
OBF  
PSPIF  
TABLE 11-11: REGISTERS ASSOCIATED WITH PARALLEL SLAVE PORT  
Reset  
Valueson  
page  
Name  
Bit 7  
Bit 6  
Bit 5  
Bit 4  
Bit 3  
Bit 2  
Bit 1  
Bit 0  
PORTD  
LATD  
RD7  
RD6  
RD5  
RD4  
RD3  
RD2  
RD1  
RD0  
58  
58  
58  
58  
58  
PORTD Data Latch Register (Read and Write to Data Latch)  
PORTD Data Direction Register  
TRISD  
PORTE  
LATE  
RE3  
RE2  
RE1  
RE0  
PORTE Data Latch Register  
(Read and Write to Data Latch)  
TRISE  
INTCON  
PIR1  
IBF  
OBF  
IBOV  
PSPMODE  
INT0IE  
TXIF  
TRISE2  
TMR0IF  
CCP1IF  
CCP1IE  
CCP1IP  
PCFG2  
TRISE1  
INT0IF  
TRISE0  
RBIF  
58  
55  
58  
58  
58  
57  
GIE/GIEH PEIE/GIEL TMR0IF  
RBIE  
(1)  
PSPIF  
PSPIE  
PSPIP  
ADIF  
ADIE  
ADIP  
RCIF  
RCIE  
SSPIF  
SSPIE  
SSPIP  
PCFG3  
TMR2IF  
TMR2IE  
TMR2IP  
PCFG1  
TMR1IF  
TMR1IE  
TMR1IP  
PCFG0  
(1)  
(1)  
PIE1  
TXIE  
IPR1  
RCIP  
TXIP  
ADCON1  
VCFG1  
VCFG0  
Legend: — = unimplemented, read as ‘0’. Shaded cells are not used by the Parallel Slave Port.  
Note 1: These bits are unimplemented on 28-pin devices and read as ‘0’.  
© 2009 Microchip Technology Inc.  
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NOTES:  
DS39689F-page 128  
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The T0CON register (Register 12-1) controls all  
aspects of the module’s operation, including the  
prescale selection. It is both readable and writable.  
12.0 TIMER0 MODULE  
The Timer0 module incorporates the following features:  
• Software selectable operation as a timer or coun-  
ter in both 8-bit or 16-bit modes  
A simplified block diagram of the Timer0 module in 8-bit  
mode is shown in Figure 12-1. Figure 12-2 shows a  
simplified block diagram of the Timer0 module in 16-bit  
mode.  
• Readable and writable registers  
• Dedicated 8-bit, software programmable  
prescaler  
• Selectable clock source (internal or external)  
• Edge select for external clock  
• Interrupt-on-overflow  
REGISTER 12-1: T0CON: TIMER0 CONTROL REGISTER  
R/W-1  
TMR0ON  
bit 7  
R/W-1  
R/W-1  
T0CS  
R/W-1  
T0SE  
R/W-1  
PSA  
R/W-1  
T0PS2  
R/W-1  
T0PS1  
R/W-1  
T0PS0  
T08BIT  
bit 0  
bit 7  
bit 6  
bit 5  
bit 4  
bit 3  
TMR0ON: Timer0 On/Off Control bit  
1= Enables Timer0  
0= Stops Timer0  
T08BIT: Timer0 8-Bit/16-Bit Control bit  
1= Timer0 is configured as an 8-bit timer/counter  
0= Timer0 is configured as a 16-bit timer/counter  
T0CS: Timer0 Clock Source Select bit  
1= Transition on T0CKI pin  
0= Internal instruction cycle clock (CLKO)  
T0SE: Timer0 Source Edge Select bit  
1= Increment on high-to-low transition on T0CKI pin  
0= Increment on low-to-high transition on T0CKI pin  
PSA: Timer0 Prescaler Assignment bit  
1= TImer0 prescaler is NOT assigned. Timer0 clock input bypasses prescaler.  
0= Timer0 prescaler is assigned. Timer0 clock input comes from prescaler output.  
bit 2-0 T0PS<2:0>: Timer0 Prescaler Select bits  
111= 1:256 Prescale value  
110= 1:128 Prescale value  
101= 1:64 Prescale value  
100= 1:32 Prescale value  
011= 1:16 Prescale value  
010= 1:8 Prescale value  
001= 1:4 Prescale value  
000= 1:2 Prescale value  
Legend:  
R = Readable bit  
-n = Value at POR  
W = Writable bit  
‘1’ = Bit is set  
U = Unimplemented bit, read as ‘0’  
‘0’ = Bit is cleared x = Bit is unknown  
© 2009 Microchip Technology Inc.  
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internal phase clock (TOSC). There is a delay between  
synchronization and the onset of incrementing the  
timer/counter.  
12.1 Timer0 Operation  
Timer0 can operate as either a timer or a counter; the  
mode is selected with the T0CS bit (T0CON<5>). In  
Timer mode (T0CS = 0), the module increments on  
every clock by default unless a different prescaler value  
is selected (see Section 12.3 “Prescaler”). If the  
TMR0 register is written to, the increment is inhibited  
for the following two instruction cycles. The user can  
work around this by writing an adjusted value to the  
TMR0 register.  
12.2 Timer0 Reads and Writes in  
16-Bit Mode  
TMR0H is not the actual high byte of Timer0 in 16-bit  
mode; it is actually a buffered version of the real high  
byte of Timer0 which is not directly readable nor  
writable (refer to Figure 12-2). TMR0H is updated with  
the contents of the high byte of Timer0 during a read of  
TMR0L. This provides the ability to read all 16 bits of  
Timer0 without having to verify that the read of the high  
and low byte were valid, due to a rollover between  
successive reads of the high and low byte.  
The Counter mode is selected by setting the T0CS bit  
(= 1). In this mode, Timer0 increments either on every  
rising or falling edge of pin RA4/T0CKI. The increment-  
ing edge is determined by the Timer0 Source Edge  
Select bit, T0SE (T0CON<4>); clearing this bit selects  
the rising edge. Restrictions on the external clock input  
are discussed below.  
Similarly, a write to the high byte of Timer0 must also  
take place through the TMR0H Buffer register. The high  
byte is updated with the contents of TMR0H when a  
write occurs to TMR0L. This allows all 16 bits of Timer0  
to be updated at once.  
An external clock source can be used to drive Timer0;  
however, it must meet certain requirements to ensure  
that the external clock can be synchronized with the  
FIGURE 12-1:  
TIMER0 BLOCK DIAGRAM (8-BIT MODE)  
FOSC/4  
0
1
1
0
Sync with  
Internal  
Clocks  
Set  
TMR0L  
8
TMR0IF  
on Overflow  
Programmable  
Prescaler  
T0CKI pin  
(2 TOSC Delay)  
T0SE  
T0CS  
3
T0PS<2:0>  
PSA  
8
Internal Data Bus  
Note: Upon Reset, Timer0 is enabled in 8-bit mode with clock input from T0CKI max. prescale.  
FIGURE 12-2:  
TIMER0 BLOCK DIAGRAM (16-BIT MODE)  
FOSC/4  
0
1
Sync with  
Internal  
Clocks  
Set  
TMR0  
High Byte  
1
TMR0L  
TMR0IF  
Programmable  
Prescaler  
on Overflow  
T0CKI pin  
0
8
(2 TOSC Delay)  
T0SE  
T0CS  
3
Read TMR0L  
Write TMR0L  
T0PS<2:0>  
PSA  
8
8
TMR0H  
8
8
Internal Data Bus  
Note: Upon Reset, Timer0 is enabled in 8-bit mode with clock input from T0CKI max. prescale.  
DS39689F-page 130  
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12.3.1  
SWITCHING PRESCALER  
ASSIGNMENT  
12.3 Prescaler  
An 8-bit counter is available as a prescaler for the Timer0  
module. The prescaler is not directly readable or writable;  
its value is set by the PSA and T0PS<2:0> bits  
(T0CON<3:0>) which determine the prescaler  
assignment and prescale ratio.  
The prescaler assignment is fully under software  
control and can be changed “on-the-fly” during program  
execution.  
12.4 Timer0 Interrupt  
Clearing the PSA bit assigns the prescaler to the  
Timer0 module. When it is assigned, prescale values  
from 1:2 through 1:256 in power-of-2 increments are  
selectable.  
The TMR0 interrupt is generated when the TMR0  
register overflows from FFh to 00h in 8-bit mode, or  
from FFFFh to 0000h in 16-bit mode. This overflow sets  
the TMR0IF flag bit. The interrupt can be masked by  
clearing the TMR0IE bit (INTCON<5>). Before re-  
enabling the interrupt, the TMR0IF bit must be cleared  
in software by the Interrupt Service Routine.  
When assigned to the Timer0 module, all instructions  
writing to the TMR0 register (e.g., CLRF TMR0, MOVWF  
TMR0, BSF TMR0, etc.) clear the prescaler count.  
Note:  
Writing to TMR0 when the prescaler is  
assigned to Timer0 will clear the prescaler  
count but will not change the prescaler  
assignment.  
Since Timer0 is shut down in Sleep mode, the TMR0  
interrupt cannot awaken the processor from Sleep.  
TABLE 12-1: REGISTERS ASSOCIATED WITH TIMER0  
Reset  
Values  
on page  
Name  
Bit 7  
Bit 6  
Bit 5  
Bit 4  
Bit 3  
Bit 2  
Bit 1  
Bit 0  
TMR0L  
Timer0 Register Low Byte  
Timer0 Register High Byte  
56  
56  
55  
56  
58  
TMR0H  
INTCON  
T0CON  
TRISA  
GIE/GIEH PEIE/GIEL TMR0IE  
INT0IE  
T0SE  
RA4  
RBIE  
PSA  
RA3  
TMR0IF  
T0PS2  
RA2  
INT0IF  
T0PS1  
RA1  
RBIF  
T0PS0  
RA0  
TMR0ON  
RA7(1)  
T08BIT  
RA6(1)  
T0CS  
RA5  
Legend: Shaded cells are not used by Timer0.  
Note 1: PORTA<7:6> and their direction bits are individually configured as port pins based on various primary  
oscillator modes. When disabled, these bits read as ‘0’.  
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NOTES:  
DS39689F-page 132  
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A simplified block diagram of the Timer1 module is  
shown in Figure 13-1. A block diagram of the module’s  
operation in Read/Write mode is shown in Figure 13-2.  
13.0 TIMER1 MODULE  
The Timer1 timer/counter module incorporates these  
features:  
The module incorporates its own low-power oscillator  
to provide an additional clocking option. The Timer1  
oscillator can also be used as a low-power clock source  
for the microcontroller in power-managed operation.  
• Software selectable operation as a 16-bit timer or  
counter  
• Readable and writable 8-bit registers (TMR1H  
and TMR1L)  
Timer1 can also be used to provide Real-Time Clock  
(RTC) functionality to applications with only a minimal  
addition of external components and code overhead.  
• Selectable clock source (internal or external) with  
device clock or Timer1 oscillator internal options  
• Interrupt-on-overflow  
Timer1 is controlled through the T1CON Control  
register (Register 13-1). It also contains the Timer1  
Oscillator Enable bit (T1OSCEN). Timer1 can be  
enabled or disabled by setting or clearing control bit,  
TMR1ON (T1CON<0>).  
• Reset on CCP Special Event Trigger  
• Device clock status flag (T1RUN)  
REGISTER 13-1: T1CON: TIMER1 CONTROL REGISTER  
R/W-0  
RD16  
R-0  
R/W-0  
R/W-0  
R/W-0  
R/W-0  
R/W-0  
R/W-0  
T1RUN T1CKPS1 T1CKPS0 T1OSCEN T1SYNC TMR1CS TMR1ON  
bit 0  
bit 7  
bit 7  
bit 6  
RD16: 16-Bit Read/Write Mode Enable bit  
1= Enables register read/write of TImer1 in one 16-bit operation  
0= Enables register read/write of Timer1 in two 8-bit operations  
T1RUN: Timer1 System Clock Status bit  
1= Device clock is derived from Timer1 oscillator  
0= Device clock is derived from another source  
bit 5-4 T1CKPS<1:0>: Timer1 Input Clock Prescale Select bits  
11= 1:8 Prescale value  
10= 1:4 Prescale value  
01= 1:2 Prescale value  
00= 1:1 Prescale value  
bit 3  
bit 2  
T1OSCEN: Timer1 Oscillator Enable bit  
1= Timer1 oscillator is enabled  
0= Timer1 oscillator is shut off  
The oscillator inverter and feedback resistor are turned off to eliminate power drain.  
T1SYNC: Timer1 External Clock Input Synchronization Select bit  
When TMR1CS = 1:  
1= Do not synchronize external clock input  
0= Synchronize external clock input  
When TMR1CS = 0:  
This bit is ignored. Timer1 uses the internal clock when TMR1CS = 0.  
bit 1  
bit 0  
TMR1CS: Timer1 Clock Source Select bit  
1= External clock from pin RC0/T1OSO/T13CKI (on the rising edge)  
0= Internal clock (FOSC/4)  
TMR1ON: Timer1 On bit  
1= Enables Timer1  
0= Stops Timer1  
Legend:  
R = Readable bit  
-n = Value at POR  
W = Writable bit  
‘1’ = Bit is set  
U = Unimplemented bit, read as ‘0’  
‘0’ = Bit is cleared x = Bit is unknown  
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cycle (Fosc/4). When the bit is set, Timer1 increments  
on every rising edge of the Timer1 external clock input  
or the Timer1 oscillator, if enabled.  
13.1 Timer1 Operation  
Timer1 can operate in one of these modes:  
• Timer  
When Timer1 is enabled, the RC1/T1OSI and RC0/  
T1OSO/T13CKI pins become inputs. This means the  
values of TRISC<1:0> are ignored and the pins are  
read as ‘0’.  
• Synchronous Counter  
• Asynchronous Counter  
The operating mode is determined by the clock select  
bit, TMR1CS (T1CON<1>). When TMR1CS is cleared  
(= 0), Timer1 increments on every internal instruction  
FIGURE 13-1:  
TIMER1 BLOCK DIAGRAM  
Timer1 Oscillator  
Timer1 Clock Input  
1
0
On/Off  
1
T1OSO/T13CKI  
T1OSI  
Synchronize  
Detect  
Prescaler  
1, 2, 4, 8  
FOSC/4  
Internal  
Clock  
0
2
Peripheral Clock  
T1OSCEN(1)  
T1CKPS<1:0>  
T1SYNC  
Timer1  
On/Off  
TMR1CS  
TMR1ON  
Set  
TMR1  
High Byte  
Clear TMR1  
(CCP Special Event Trigger)  
TMR1L  
TMR1IF  
on Overflow  
Note 1: When enable bit, T1OSCEN, is cleared, the inverter and feedback resistor are turned off to eliminate power drain.  
FIGURE 13-2:  
TIMER1 BLOCK DIAGRAM (16-BIT READ/WRITE MODE)  
Timer1 Oscillator  
Timer1 Clock Input  
1
0
1
0
T1OSO/T13CKI  
T1OSI  
Synchronize  
Detect  
Prescaler  
1, 2, 4, 8  
FOSC/4  
Internal  
Clock  
2
Peripheral Clock  
T1OSCEN(1)  
T1CKPS<1:0>  
T1SYNC  
Timer1  
On/Off  
TMR1CS  
TMR1ON  
Set  
TMR1IF  
on Overflow  
TMR1  
High Byte  
Clear TMR1  
(CCP Special Event Trigger)  
TMR1L  
8
Read TMR1L  
Write TMR1L  
8
8
TMR1H  
8
8
Internal Data Bus  
Note 1: When enable bit, T1OSCEN, is cleared, the inverter and feedback resistor are turned off to eliminate power drain.  
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TABLE 13-1: CAPACITOR SELECTION FOR  
THE TIMER OSCILLATOR  
13.2 Timer1 16-Bit Read/Write Mode  
Timer1 can be configured for 16-bit reads and writes  
(see Figure 13-2). When the RD16 control bit  
(T1CON<7>) is set, the address for TMR1H is mapped  
to a buffer register for the high byte of Timer1. A read  
from TMR1L will load the contents of the high byte of  
Timer1 into the Timer1 high byte buffer. This provides  
the user with the ability to accurately read all 16 bits of  
Timer1 without having to determine whether a read of  
the high byte, followed by a read of the low byte, has  
become invalid due to a rollover between reads.  
Osc Type  
Freq  
C1  
C2  
LP  
32 kHz  
27 pF(1)  
27 pF(1)  
Note 1: Microchip suggests these values as a  
starting point in validating the oscillator  
circuit.  
2: Higher capacitance increases the stability  
of the oscillator but also increases the  
start-up time.  
A write to the high byte of Timer1 must also take place  
through the TMR1H Buffer register. The Timer1 high  
byte is updated with the contents of TMR1H when a  
write occurs to TMR1L. This allows a user to write all  
16 bits to both the high and low bytes of Timer1 at once.  
3: Since each resonator/crystal has its own  
characteristics, the user should consult  
the resonator/crystal manufacturer for  
appropriate  
values  
of  
external  
components.  
The high byte of Timer1 is not directly readable or  
writable in this mode. All reads and writes must take  
place through the Timer1 High Byte Buffer register.  
Writes to TMR1H do not clear the Timer1 prescaler.  
The prescaler is only cleared on writes to TMR1L.  
4: Capacitor values are for design guidance  
only.  
13.3.1  
USING TIMER1 AS A  
CLOCK SOURCE  
The Timer1 oscillator is also available as a clock source  
in power-managed modes. By setting the clock select  
bits, SCS<1:0> (OSCCON<1:0>), to ‘01’, the device  
switches to SEC_RUN mode; both the CPU and  
peripherals are clocked from the Timer1 oscillator. If the  
IDLEN bit (OSCCON<7>) is cleared and a SLEEP  
instruction is executed, the device enters SEC_IDLE  
mode. Additional details are available in Section 4.0  
“Power-Managed Modes”.  
13.3 Timer1 Oscillator  
An on-chip crystal oscillator circuit is incorporated  
between pins T1OSI (input) and T1OSO (amplifier  
output). It is enabled by setting the Timer1 Oscillator  
Enable bit, T1OSCEN (T1CON<3>). The oscillator is a  
low-power circuit rated for 32 kHz crystals. It will  
continue to run during all power-managed modes. The  
circuit for a typical LP oscillator is shown in Figure 13-3.  
Table 13-1 shows the capacitor selection for the Timer1  
oscillator.  
Whenever the Timer1 oscillator is providing the clock  
source, the Timer1 system clock status flag, T1RUN  
(T1CON<6>), is set. This can be used to determine the  
controller’s current clocking mode. It can also indicate  
the clock source being currently used by the Fail-Safe  
Clock Monitor. If the Clock Monitor is enabled and the  
Timer1 oscillator fails while providing the clock, polling  
the T1RUN bit will indicate whether the clock is being  
provided by the Timer1 oscillator or another source.  
The user must provide a software time delay to ensure  
proper start-up of the Timer1 oscillator.  
FIGURE 13-3:  
EXTERNALCOMPONENTS  
FOR THE TIMER1  
LP OSCILLATOR  
C1  
27 pF  
PIC18FXXXX  
13.3.2  
LOW-POWER TIMER1 OPTION  
T1OSI  
The Timer1 oscillator can operate at two distinct levels  
of power consumption based on device configuration.  
When the LPT1OSC Configuration bit is set, the Timer1  
oscillator operates in a low-power mode. When  
LPT1OSC is not set, Timer1 operates at a higher power  
level. Power consumption for a particular mode is  
relatively constant, regardless of the device’s operating  
mode. The default Timer1 configuration is the higher  
power mode.  
XTAL  
32.768 kHz  
T1OSO  
C2  
27 pF  
Note:  
See the Notes with Table 13-1 for additional  
information about capacitor selection.  
As the low-power Timer1 mode tends to be more  
sensitive to interference, high noise environments may  
cause some oscillator instability. The low-power option is,  
therefore, best suited for low noise applications where  
power conservation is an important design consideration.  
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13.3.3  
TIMER1 OSCILLATOR LAYOUT  
CONSIDERATIONS  
13.5 Resetting Timer1 Using the CCP  
Special Event Trigger  
The Timer1 oscillator circuit draws very little power  
during operation. Due to the low-power nature of the  
oscillator, it may also be sensitive to rapidly changing  
signals in close proximity.  
If either of the CCP modules is configured to use  
Timer1 and generate a Special Event Trigger in Com-  
pare mode (CCP1M<3:0> or CCP2M<3:0> = 1011),  
this signal will reset Timer1. The trigger from CCP2 will  
also start an A/D conversion if the A/D module is  
enabled (see Section 16.3.4 “Special Event Trigger”  
for more information).  
The oscillator circuit, shown in Figure 13-3, should be  
located as close as possible to the microcontroller.  
There should be no circuits passing within the oscillator  
circuit boundaries other than VSS or VDD.  
The module must be configured as either a timer or a  
synchronous counter to take advantage of this feature.  
When used this way, the CCPRH:CCPRL register pair  
effectively becomes a period register for Timer1.  
If a high-speed circuit must be located near the  
oscillator (such as the CCP1 pin in Output Compare or  
PWM mode, or the primary oscillator using the OSC2  
pin), a grounded guard ring around the oscillator circuit,  
as shown in Figure 13-4, may be helpful when used on  
a single-sided PCB or in addition to a ground plane.  
If Timer1 is running in Asynchronous Counter mode,  
this Reset operation may not work.  
In the event that a write to Timer1 coincides with a  
Special Event Trigger, the write operation will take  
precedence.  
FIGURE 13-4:  
OSCILLATOR CIRCUIT  
WITH GROUNDED  
GUARD RING  
Note:  
The Special Event Triggers from the  
CCP2 module will not set the TMR1IF  
interrupt flag bit (PIR1<0>).  
VDD  
VSS  
13.6 Using Timer1 as a Real-Time Clock  
OSC1  
OSC2  
Adding an external LP oscillator to Timer1 (such as the  
one described in Section 13.3 “Timer1 Oscillator”)  
gives users the option to include RTC functionality to  
their applications. This is accomplished with an  
inexpensive watch crystal to provide an accurate time  
base and several lines of application code to calculate  
the time. When operating in Sleep mode and using a  
battery or supercapacitor as a power source, it can  
completely eliminate the need for a separate RTC  
device and battery backup.  
RC0  
RC1  
RC2  
The application code routine, RTCisr, shown in  
Example 13-1, demonstrates a simple method to  
increment a counter at one-second intervals using an  
Interrupt Service Routine. Incrementing the TMR1  
register pair to overflow, triggers the interrupt and calls  
the routine, which increments the seconds counter by  
one. Additional counters for minutes and hours are  
incremented as the previous counter overflow.  
Note: Not drawn to scale.  
13.4 Timer1 Interrupt  
The TMR1 register pair (TMR1H:TMR1L) increments  
from 0000h to FFFFh and rolls over to 0000h. The  
Timer1 interrupt, if enabled, is generated on overflow  
which is latched in interrupt flag bit, TMR1IF  
(PIR1<0>). This interrupt can be enabled or disabled  
by setting or clearing the Timer1 Interrupt Enable bit,  
TMR1IE (PIE1<0>).  
Since the register pair is 16 bits wide, counting up to  
overflow the register directly from a 32.768 kHz clock  
would take 2 seconds. To force the overflow at the  
required one-second intervals, it is necessary to  
preload it. The simplest method is to set the MSb of  
TMR1H with a BSF instruction. Note that the TMR1L  
register is never preloaded or altered. Doing so may  
introduce cumulative errors over many cycles.  
For this method to be accurate, Timer1 must operate in  
Asynchronous mode and the Timer1 overflow interrupt  
must be enabled (PIE1<0> = 1), as shown in the  
routine, RTCinit. The Timer1 oscillator must also be  
enabled and running at all times.  
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EXAMPLE 13-1:  
IMPLEMENTING A REAL-TIME CLOCK USING A TIMER1 INTERRUPT SERVICE  
RTCinit  
MOVLW  
MOVWF  
CLRF  
80h  
TMR1H  
TMR1L  
; Preload TMR1 register pair  
; for 1 second overflow  
MOVLW  
MOVWF  
CLRF  
b'00001111'  
T1CON  
secs  
; Configure for external clock,  
; Asynchronous operation, external oscillator  
; Initialize timekeeping registers  
;
CLRF  
mins  
MOVLW  
MOVWF  
BSF  
.12  
hours  
PIE1, TMR1IE  
; Enable Timer1 interrupt  
RETURN  
RTCisr  
BSF  
BCF  
INCF  
MOVLW  
CPFSGT  
RETURN  
CLRF  
TMR1H, 7  
PIR1, TMR1IF  
secs, F  
.59  
; Preload for 1 sec overflow  
; Clear interrupt flag  
; Increment seconds  
; 60 seconds elapsed?  
secs  
; No, done  
secs  
mins, F  
.59  
; Clear seconds  
; Increment minutes  
; 60 minutes elapsed?  
INCF  
MOVLW  
CPFSGT  
RETURN  
CLRF  
mins  
; No, done  
mins  
hours, F  
.23  
; clear minutes  
; Increment hours  
; 24 hours elapsed?  
INCF  
MOVLW  
CPFSGT  
RETURN  
CLRF  
hours  
; No, done  
; Reset hours  
; Done  
hours  
RETURN  
TABLE 13-2: REGISTERS ASSOCIATED WITH TIMER1 AS A TIMER/COUNTER  
Reset  
Values  
on page  
Name  
Bit 7  
Bit 6  
Bit 5  
Bit 4  
Bit 3  
Bit 2  
Bit 1  
Bit 0  
INTCON  
PIR1  
GIE/GIEH PEIE/GIEL TMR0IE  
INT0IE  
TXIF  
RBIE  
SSPIF  
SSPIE  
SSPIP  
TMR0IF  
CCP1IF  
CCP1IE  
CCP1IP  
INT0IF  
TMR2IF  
TMR2IE  
TMR2IP  
RBIF  
55  
58  
58  
58  
56  
56  
56  
PSPIF(1)  
PSPIE(1)  
PSPIP(1)  
ADIF  
ADIE  
ADIP  
RCIF  
RCIE  
RCIP  
TMR1IF  
TMR1IE  
TMR1IP  
PIE1  
TXIE  
TXIP  
IPR1  
TMR1L  
TMR1H  
T1CON  
Timer1 Register Low Byte  
Timer1 Register High Byte  
RD16  
T1RUN T1CKPS1 T1CKPS0 T1OSCEN T1SYNC TMR1CS TMR1ON  
Legend: Shaded cells are not used by the Timer1 module.  
Note 1: These bits are unimplemented on 28-pin devices and read as ‘0’.  
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NOTES:  
DS39689F-page 138  
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14.1 Timer2 Operation  
14.0 TIMER2 MODULE  
In normal operation, TMR2 is incremented from 00h on  
each clock (FOSC/4). A 4-bit counter/prescaler on the  
clock input gives direct input, divide-by-4 and divide-by-  
16 prescale options. These are selected by the prescaler  
control bits, T2CKPS<1:0> (T2CON<1:0>). The value of  
TMR2 is compared to that of the Period register, PR2, on  
each clock cycle. When the two values match, the com-  
parator generates a match signal as the timer output.  
This signal also resets the value of TMR2 to 00h on the  
next cycle and drives the output counter/postscaler (see  
Section 14.2 “Timer2 Interrupt”).  
The Timer2 timer module incorporates the following  
features:  
• 8-bit timer and period registers (TMR2 and PR2,  
respectively)  
• Readable and writable (both registers)  
• Software programmable prescaler (1:1, 1:4 and  
1:16)  
• Software programmable postscaler (1:1 through  
1:16)  
• Interrupt on TMR2 to PR2 match  
• Optional use as the shift clock for the MSSP  
module  
The TMR2 and PR2 registers are both directly readable  
and writable. The TMR2 register is cleared on any  
device Reset, while the PR2 register initializes at FFh.  
Both the prescaler and postscaler counters are cleared  
on the following events:  
The module is controlled through the T2CON register  
(Register 14-1), which enables or disables the timer  
and configures the prescaler and postscaler. Timer2  
can be shut off by clearing control bit, TMR2ON  
(T2CON<2>), to minimize power consumption.  
• a write to the TMR2 register  
• a write to the T2CON register  
A simplified block diagram of the module is shown in  
Figure 14-1.  
• any device Reset (Power-on Reset, MCLR Reset,  
Watchdog Timer Reset or Brown-out Reset)  
TMR2 is not cleared when T2CON is written.  
REGISTER 14-1: T2CON: TIMER2 CONTROL REGISTER  
U-0  
R/W-0  
R/W-0  
R/W-0  
R/W-0  
R/W-0  
R/W-0  
R/W-0  
T2OUTPS3 T2OUTPS2 T2OUTPS1 T2OUTPS0 TMR2ON T2CKPS1 T2CKPS0  
bit 0  
bit 7  
bit 7  
Unimplemented: Read as ‘0’  
bit 6-3 T2OUTPS<3:0>: Timer2 Output Postscale Select bits  
0000= 1:1 Postscale  
0001= 1:2 Postscale  
1111= 1:16 Postscale  
bit 2  
TMR2ON: Timer2 On bit  
1= Timer2 is on  
0= Timer2 is off  
bit 1-0 T2CKPS<1:0>: Timer2 Clock Prescale Select bits  
00= Prescaler is 1  
01= Prescaler is 4  
1x= Prescaler is 16  
Legend:  
R = Readable bit  
-n = Value at POR  
W = Writable bit  
‘1’ = Bit is set  
U = Unimplemented bit, read as ‘0’  
‘0’ = Bit is cleared x = Bit is unknown  
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14.2 Timer2 Interrupt  
14.3 Timer2 Output  
Timer2 can also generate an optional device interrupt.  
The Timer2 output signal (TMR2 to PR2 match)  
provides the input for the 4-bit output counter/post-  
scaler. This counter generates the TMR2 match inter-  
rupt flag which is latched in TMR2IF (PIR1<1>). The  
interrupt is enabled by setting the TMR2 Match Inter-  
rupt Enable bit, TMR2IE (PIE1<1>).  
The unscaled output of TMR2 is available primarily to  
the CCP modules, where it is used as a time base for  
operations in PWM mode.  
Timer2 can be optionally used as the shift clock source  
for the MSSP module operating in SPI mode.  
Additional information is provided in Section 18.0  
“Master Synchronous Serial Port (MSSP) Module”.  
A range of 16 postscale options (from 1:1 through 1:16  
inclusive) can be selected with the postscaler control  
bits, T2OUTPS<3:0> (T2CON<6:3>).  
FIGURE 14-1:  
TIMER2 BLOCK DIAGRAM  
4
1:1 to 1:16  
Set TMR2IF  
Postscaler  
T2OUTPS<3:0>  
T2CKPS<1:0>  
2
TMR2 Output  
(to PWM or MSSP)  
TMR2/PR2  
Match  
Reset  
1:1, 1:4, 1:16  
Prescaler  
PR2  
FOSC/4  
TMR2  
Comparator  
8
8
8
Internal Data Bus  
TABLE 14-1: REGISTERS ASSOCIATED WITH TIMER2 AS A TIMER/COUNTER  
Reset  
Values  
on page  
Name  
Bit 7  
Bit 6  
Bit 5  
Bit 4  
Bit 3  
Bit 2  
Bit 1  
Bit 0  
INTCON GIE/GIEH PEIE/GIEL TMR0IE  
INT0IE  
TXIF  
RBIE  
SSPIF  
SSPIE  
SSPIP  
TMR0IF  
CCP1IF  
CCP1IE  
CCP1IP  
INT0IF  
TMR2IF  
TMR2IE  
TMR2IP  
RBIF  
55  
58  
58  
58  
56  
56  
56  
PIR1  
PSPIF(1)  
PSPIE(1)  
PSPIP(1)  
ADIF  
ADIE  
ADIP  
RCIF  
RCIE  
RCIP  
TMR1IF  
TMR1IE  
TMR1IP  
PIE1  
TXIE  
TXIP  
IPR1  
TMR2  
T2CON  
PR2  
Timer2 Register  
T2OUTPS3 T2OUTPS2 T2OUTPS1 T2OUTPS0 TMR2ON T2CKPS1 T2CKPS0  
Timer2 Period Register  
Legend: — = unimplemented, read as ‘0’. Shaded cells are not used by the Timer2 module.  
Note 1: These bits are unimplemented on 28-pin devices and read as ‘0’.  
DS39689F-page 140  
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A simplified block diagram of the Timer3 module is  
shown in Figure 15-1. A block diagram of the module’s  
operation in Read/Write mode is shown in Figure 15-2.  
15.0 TIMER3 MODULE  
The Timer3 timer/counter module incorporates these  
features:  
The Timer3 module is controlled through the T3CON  
register (Register 15-1). It also selects the clock source  
options for the CCP modules (see Section 16.1.1  
“CCP Modules and Timer Resources” for more  
information).  
• Software selectable operation as a 16-bit timer or  
counter  
• Readable and writable 8-bit registers (TMR3H  
and TMR3L)  
• Selectable clock source (internal or external) with  
device clock or Timer1 oscillator internal options  
• Interrupt-on-overflow  
• Module Reset on CCP Special Event Trigger  
REGISTER 15-1: T3CON: TIMER3 CONTROL REGISTER  
R/W-0  
RD16  
R/W-0  
R/W-0  
R/W-0  
R/W-0  
R/W-0  
R/W-0  
R/W-0  
T3CCP2 T3CKPS1 T3CKPS0 T3CCP1 T3SYNC TMR3CS TMR3ON  
bit 0  
bit 7  
bit 7  
RD16: 16-Bit Read/Write Mode Enable bit  
1= Enables register read/write of Timer3 in one 16-bit operation  
0= Enables register read/write of Timer3 in two 8-bit operations  
bit 6,3 T3CCP<2:1>: Timer3 and Timer1 to CCPx Enable bits  
1x= Timer3 is the capture/compare clock source for the CCP modules  
01= Timer3 is the capture/compare clock source for CCP2; Timer1 is the capture/compare  
clock source for CCP1  
00= Timer1 is the capture/compare clock source for the CCP modules  
bit 5-4 T3CKPS<1:0>: Timer3 Input Clock Prescale Select bits  
11= 1:8 Prescale value  
10= 1:4 Prescale value  
01= 1:2 Prescale value  
00= 1:1 Prescale value  
bit 2  
T3SYNC: Timer3 External Clock Input Synchronization Control bit  
(Not usable if the device clock comes from Timer1/Timer3.)  
When TMR3CS = 1:  
1= Do not synchronize external clock input  
0= Synchronize external clock input  
When TMR3CS = 0:  
This bit is ignored. Timer3 uses the internal clock when TMR3CS = 0.  
bit 1  
bit 0  
TMR3CS: Timer3 Clock Source Select bit  
1= External clock input from Timer1 oscillator or T13CKI (on the rising edge after the first  
falling edge)  
0= Internal clock (FOSC/4)  
TMR3ON: Timer3 On bit  
1= Enables Timer3  
0= Stops Timer3  
Legend:  
R = Readable bit  
-n = Value at POR  
W = Writable bit  
‘1’ = Bit is set  
U = Unimplemented bit, read as ‘0’  
‘0’ = Bit is cleared x = Bit is unknown  
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The operating mode is determined by the clock select  
15.1 Timer3 Operation  
bit, TMR3CS (T3CON<1>). When TMR3CS is cleared  
(= 0), Timer3 increments on every internal instruction  
cycle (FOSC/4). When the bit is set, Timer3 increments  
on every rising edge of the Timer1 external clock input  
or the Timer1 oscillator, if enabled.  
Timer3 can operate in one of three modes:  
• Timer  
• Synchronous Counter  
• Asynchronous Counter  
As with Timer1, the RC1/T1OSI and RC0/T1OSO/  
T13CKI pins become inputs when the Timer1 oscillator  
is enabled. This means the values of TRISC<1:0> are  
ignored and the pins are read as ‘0’.  
FIGURE 15-1:  
TIMER3 BLOCK DIAGRAM (8-BIT READ/WRITE MODE)  
Timer1 Oscillator  
Timer1 Clock Input  
1
0
1
0
T1OSO/T13CKI  
T1OSI  
Synchronize  
Detect  
Prescaler  
1, 2, 4, 8  
FOSC/4  
Internal  
Clock  
2
Sleep Input  
T1OSCEN(1)  
T3CKPS<1:0>  
T3SYNC  
Timer3  
On/Off  
TMR3CS  
TMR3ON  
CCP1/CCP2 Special Event Trigger  
CCP1/CCP2 Select from T3CON<6,3>  
Clear TMR3  
Set  
TMR3  
High Byte  
TMR3L  
TMR3IF  
on Overflow  
Note 1: When enable bit, T1OSCEN, is cleared, the inverter and feedback resistor are turned off to eliminate power drain.  
FIGURE 15-2:  
TIMER3 BLOCK DIAGRAM (16-BIT READ/WRITE MODE)  
Timer1 Oscillator  
Timer1 Clock Input  
1
0
1
0
T13CKI/T1OSO  
T1OSI  
Synchronize  
Detect  
Prescaler  
1, 2, 4, 8  
FOSC/4  
Internal  
Clock  
2
Sleep Input  
T1OSCEN(1)  
T3CKPS<1:0>  
T3SYNC  
Timer3  
On/Off  
TMR3CS  
TMR3ON  
CCP1/CCP2 Special Event Trigger  
CCP1/CCP2 Select from T3CON<6,3>  
Clear TMR3  
Set  
TMR3IF  
on Overflow  
TMR3  
High Byte  
TMR3L  
8
Read TMR1L  
Write TMR1L  
8
8
TMR3H  
8
8
Internal Data Bus  
Note 1: When enable bit, T1OSCEN, is cleared, the inverter and feedback resistor are turned off to eliminate power drain.  
DS39689F-page 142  
© 2009 Microchip Technology Inc.  
PIC18F2221/2321/4221/4321 FAMILY  
15.2 Timer3 16-Bit Read/Write Mode  
15.4 Timer3 Interrupt  
Timer3 can be configured for 16-bit reads and writes  
(see Figure 15-2). When the RD16 control bit  
(T3CON<7>) is set, the address for TMR3H is mapped  
to a buffer register for the high byte of Timer3. A read  
from TMR3L will load the contents of the high byte of  
Timer3 into the Timer3 High Byte Buffer register. This  
provides the user with the ability to accurately read all  
16 bits of Timer1 without having to determine whether  
a read of the high byte, followed by a read of the low  
byte, has become invalid due to a rollover between  
reads.  
The TMR3 register pair (TMR3H:TMR3L) increments  
from 0000h to FFFFh and overflows to 0000h. The  
Timer3 interrupt, if enabled, is generated on overflow  
and is latched in interrupt flag bit, TMR3IF (PIR2<1>).  
This interrupt can be enabled or disabled by setting or  
clearing the Timer3 Interrupt Enable bit, TMR3IE  
(PIE2<1>).  
15.5 Resetting Timer3 Using the CCP  
Special Event Trigger  
If either of the CCP modules is configured to use Timer3  
and to generate a Special Event Trigger in Compare  
mode (CCP1M<3:0> or CCP2M<3:0> = 1011), this  
signal will reset Timer3. It will also start an A/D conver-  
sion if the A/D module is enabled (see Section 16.3.4  
“Special Event Trigger” for more information).  
A write to the high byte of Timer3 must also take place  
through the TMR3H Buffer register. The Timer3 high  
byte is updated with the contents of TMR3H when a  
write occurs to TMR3L. This allows a user to write all  
16 bits to both the high and low bytes of Timer3 at once.  
The high byte of Timer3 is not directly readable or  
writable in this mode. All reads and writes must take  
place through the Timer3 High Byte Buffer register.  
The module must be configured as either a timer or  
synchronous counter to take advantage of this feature.  
When used this way, the CCPR2H:CCPR2L register  
pair effectively becomes a period register for Timer3.  
Writes to TMR3H do not clear the Timer3 prescaler.  
The prescaler is only cleared on writes to TMR3L.  
If Timer3 is running in Asynchronous Counter mode,  
the Reset operation may not work.  
15.3 Using the Timer1 Oscillator as the  
Timer3 Clock Source  
In the event that a write to Timer3 coincides with a  
Special Event Trigger from a CCP module, the write will  
take precedence.  
The Timer1 internal oscillator may be used as the clock  
source for Timer3. The Timer1 oscillator is enabled by  
setting the T1OSCEN (T1CON<3>) bit. To use it as the  
Timer3 clock source, the TMR3CS bit must also be set.  
As previously noted, this also configures Timer3 to  
increment on every rising edge of the oscillator source.  
Note:  
The Special Event Triggers from the  
CCP2 module will not set the TMR3IF  
interrupt flag bit (PIR2<1>).  
The Timer1 oscillator is described in Section 13.0  
“Timer1 Module”.  
TABLE 15-1: REGISTERS ASSOCIATED WITH TIMER3 AS A TIMER/COUNTER  
Reset  
Values  
on page  
Name  
Bit 7  
Bit 6  
Bit 5  
Bit 4  
Bit 3  
Bit 2  
Bit 1  
Bit 0  
INTCON  
PIR2  
GIE/GIEH PEIE/GIEL TMR0IE  
INT0IE  
EEIF  
RBIE  
BCLIF  
BCLIE  
BCLIP  
TMR0IF  
HLVDIF  
HLVDIE  
HLVDIP  
INT0IF  
TMR3IF  
TMR3IE  
TMR3IP  
RBIF  
55  
58  
58  
58  
57  
57  
56  
57  
OSCFIF  
OSCFIE  
OSCFIP  
CMIF  
CMIE  
CMIP  
CCP2IF  
CCP2IE  
CCP2IP  
PIE2  
EEIE  
EEIP  
IPR2  
TMR3L  
TMR3H  
T1CON  
T3CON  
Timer3 Register Low Byte  
Timer3 Register High Byte  
RD16  
RD16  
T1RUN T1CKPS1 T1CKPS0 T1OSCEN T1SYNC TMR1CS TMR1ON  
T3CCP2 T3CKPS1 T3CKPS0 T3CCP1 T3SYNC TMR3CS TMR3ON  
Legend: — = unimplemented, read as ‘0’. Shaded cells are not used by the Timer3 module.  
© 2009 Microchip Technology Inc.  
DS39689F-page 143  
PIC18F2221/2321/4221/4321 FAMILY  
NOTES:  
DS39689F-page 144  
© 2009 Microchip Technology Inc.  
PIC18F2221/2321/4221/4321 FAMILY  
The Capture and Compare operations described in this  
chapter apply to all standard and Enhanced CCP  
modules.  
16.0 CAPTURE/COMPARE/PWM  
(CCP) MODULES  
PIC18F2221/2321/4221/4321 family devices all have  
two CCP (Capture/Compare/PWM) modules. Each  
module contains a 16-bit register which can operate as  
a 16-bit Capture register, a 16-bit Compare register or  
a PWM Master/Slave Duty Cycle register.  
Note: Throughout this section and Section 17.0  
“Enhanced Capture/Compare/PWM (ECCP)  
Module”, references to the register and bit  
names for CCP modules are referred to  
generically by the use of ‘x’ or ‘y’ in place  
of the specific module number. Thus,  
“CCPxCON” might refer to the control regis-  
ter for CCP1, CCP2 or ECCP1. “CCPxCON”  
is used throughout these sections to refer to  
the module control register, regardless of  
whether the CCP module is a standard or  
Enhanced implementation.  
In 28-pin devices, the two standard CCP modules  
(CCP1 and CCP2) operate as described in this  
chapter. In 40/44-pin devices, CCP1 is implemented  
as an Enhanced CCP module with standard Capture  
and Compare modes and Enhanced PWM modes.  
The ECCP implementation is discussed in  
Section 17.0 “Enhanced Capture/Compare/PWM  
(ECCP) Module”.  
REGISTER 16-1: CCPxCON REGISTER (CCP2 MODULE, CCP1 MODULE IN 28-PIN DEVICES)  
U-0  
U-0  
R/W-0  
R/W-0  
R/W-0  
R/W-0  
R/W-0  
R/W-0  
DCxB1  
DCxB0  
CCPxM3 CCPxM2 CCPxM1 CCPxM0  
bit 0  
bit 7  
bit 7-6 Unimplemented: Read as ‘0’  
bit 5-4 DCxB<1:0>: PWM Duty Cycle bit 1 and bit 0 for CCP Module x  
Capture mode:  
Unused.  
Compare mode:  
Unused.  
PWM mode:  
These bits are the two LSbs (bit 1 and bit 0) of the 10-bit PWM duty cycle. The eight MSbs  
(DCxB<9:2>) of the duty cycle are found in CCPRxL.  
bit 3-0 CCPxM<3:0>: CCPx Module Mode Select bits  
0000= Capture/Compare/PWM disabled (resets CCP module)  
0001= Reserved  
0010= Compare mode, toggle output on match (CCPxIF bit is set)  
0011= Reserved  
0100= Capture mode, every falling edge  
0101= Capture mode, every rising edge  
0110= Capture mode, every 4th rising edge  
0111= Capture mode, every 16th rising edge  
1000= Compare mode: initialize CCP pin low; on compare match, force CCP pin high  
(CCPxIF bit is set)  
1001= Compare mode: initialize CCP pin high; on compare match, force CCP pin low  
(CCPxIF bit is set)  
1010= Compare mode: generate software interrupt on compare match (CCPxIF bit is set,  
CCP pin reflects I/O state)  
1011= Compare mode: trigger special event, reset timer, start A/D conversion on  
CCPx match (CCPxIF bit is set)  
11xx= PWM mode  
Legend:  
R = Readable bit  
-n = Value at POR  
W = Writable bit  
‘1’ = Bit is set  
U = Unimplemented bit, read as ‘0’  
‘0’ = Bit is cleared x = Bit is unknown  
© 2009 Microchip Technology Inc.  
DS39689F-page 145  
PIC18F2221/2321/4221/4321 FAMILY  
The assignment of a particular timer to a module is  
16.1 CCP Module Configuration  
determined by the Timer to CCP enable bits in the  
T3CON register (Register 15-1). Both modules may be  
active at any given time and may share the same timer  
resource if they are configured to operate in the same  
mode (Capture/Compare or PWM) at the same time. The  
interactions between the two modules are summarized in  
Figure 16-1 and Figure 16-2. In Timer1 in Asynchronous  
Counter mode, the capture operation will not work.  
Each Capture/Compare/PWM module is associated  
with a control register (generically, CCPxCON) and a  
data register (CCPRx). The data register, in turn, is  
comprised of two 8-bit registers: CCPRxL (low byte)  
and CCPRxH (high byte). All registers are both  
readable and writable.  
16.1.1  
CCP MODULES AND TIMER  
RESOURCES  
16.1.2  
CCP2 PIN ASSIGNMENT  
The CCP modules utilize Timers 1, 2 or 3, depending  
on the mode selected. Timer1 and Timer3 are available  
to modules in Capture or Compare modes, while  
Timer2 is available for modules in PWM mode.  
The pin assignment for CCP2 (Capture input, Compare  
and PWM output) can change, based on device config-  
uration. The CCP2MX Configuration bit determines  
which pin CCP2 is multiplexed to. By default, it is  
assigned to RC1 (CCP2MX = 1). If the Configuration bit  
is cleared, CCP2 is multiplexed with RB3.  
TABLE 16-1: CCP MODE – TIMER  
RESOURCES  
Changing the pin assignment of CCP2 does not  
automatically change any requirements for configuring  
the port pin. Users must always verify that the appropri-  
ate TRIS register is configured correctly for CCP2  
operation, regardless of where it is located.  
CCP/ECCP Mode  
Timer Resource  
Capture  
Compare  
PWM  
Timer1 or Timer3  
Timer1 or Timer3  
Timer2  
TABLE 16-2: INTERACTIONS BETWEEN CCP1 AND CCP2 FOR TIMER RESOURCES  
CCP1 Mode CCP2 Mode  
Interaction  
Capture  
Capture  
Each module can use TMR1 or TMR3 as the time base. The time base can be different  
for each CCP.  
Capture  
Compare CCP2 can be configured for the Special Event Trigger to reset TMR1 or TMR3  
(depending upon which time base is used). Automatic A/D conversions on trigger event  
can also be done. Operation of CCP1 could be affected if it is using the same timer as a  
time base.  
Compare  
Compare  
Capture  
CCP1 can be configured for the Special Event Trigger to reset TMR1 or TMR3  
(depending upon which time base is used). Operation of CCP2 could be affected if it is  
using the same timer as a time base.  
Compare Either module can be configured for the Special Event Trigger to reset the time base.  
Automatic A/D conversions on CCP2 trigger event can be done. Conflicts may occur if  
both modules are using the same time base.  
Capture  
Compare  
PWM(1)  
PWM(1)  
PWM(1)  
PWM(1)  
PWM(1)  
Capture  
None  
None  
None  
Compare None  
PWM Both PWMs will have the same frequency and update rate (TMR2 interrupt).  
Note 1: Includes standard and Enhanced PWM operation.  
DS39689F-page 146  
© 2009 Microchip Technology Inc.  
PIC18F2221/2321/4221/4321 FAMILY  
16.2.3  
SOFTWARE INTERRUPT  
16.2 Capture Mode  
When the Capture mode is changed, a false capture  
interrupt may be generated. The user should keep the  
CCPxIE interrupt enable bit clear to avoid false  
interrupts. The interrupt flag bit, CCPxIF, should also be  
cleared following any such change in operating mode.  
In Capture mode, the CCPRxH:CCPRxL register pair  
captures the 16-bit value of the TMR1 or TMR3  
registers when an event occurs on the corresponding  
CCPx pin. An event is defined as one of the following:  
• every falling edge  
• every rising edge  
16.2.4  
CCP PRESCALER  
• every 4th rising edge  
• every 16th rising edge  
There are four prescaler settings in Capture mode.  
They are specified as part of the operating mode  
selected by the mode select bits (CCPxM<3:0>).  
Whenever the CCP module is turned off or Capture  
mode is disabled, the prescaler counter is cleared. This  
means that any Reset will clear the prescaler counter.  
The event is selected by the mode select bits,  
CCPxM<3:0> (CCPxCON<3:0>). When a capture is  
made, the interrupt request flag bit, CCPxIF, is set; it  
must be cleared in software. If another capture occurs  
before the value in register CCPRx is read, the old  
captured value is overwritten by the new captured value.  
Switching from one capture prescaler to another may  
generate an interrupt. Also, the prescaler counter will  
not be cleared; therefore, the first capture may be from  
16.2.1  
CCP PIN CONFIGURATION  
a
non-zero prescaler. Example 16-1 shows the  
recommended method for switching between capture  
prescalers. This example also clears the prescaler  
counter and will not generate the “false” interrupt.  
In Capture mode, the appropriate CCPx pin should be  
configured as an input by setting the corresponding  
TRIS direction bit.  
Note:  
If RB3/CCP2 or RC1/CCP2 is configured  
as an output, a write to the port can cause  
a capture condition.  
EXAMPLE 16-1:  
CHANGING BETWEEN  
CAPTURE PRESCALERS  
(CCP2 SHOWN)  
CLRF  
CCP2CON  
; Turn CCP module off  
16.2.2  
TIMER1/TIMER3 MODE SELECTION  
MOVLW NEW_CAPT_PS ; Load WREG with the  
; new prescaler mode  
The timers that are to be used with the capture feature  
(Timer1 and/or Timer3) must be running in Timer mode or  
Synchronized Counter mode. In Asynchronous Counter  
mode, the capture operation will not work. The timer to be  
used with each CCP module is selected in the T3CON  
register (see Section 16.1.1 “CCP Modules and Timer  
Resources”).  
; value and CCP ON  
; Load CCP2CON with  
; this value  
MOVWF CCP2CON  
FIGURE 16-1:  
CAPTURE MODE OPERATION BLOCK DIAGRAM  
TMR3H  
TMR3L  
Set CCP1IF  
T3CCP2  
TMR3  
Enable  
CCP1 pin  
Prescaler  
÷ 1, 4, 16  
and  
Edge Detect  
CCPR1H  
CCPR1L  
TMR1  
Enable  
T3CCP2  
TMR1H  
TMR3H  
TMR1L  
TMR3L  
4
4
CCP1CON<3:0>  
Q1:Q4  
Set CCP2IF  
4
CCP2CON<3:0>  
T3CCP1  
T3CCP2  
TMR3  
Enable  
CCP2 pin  
Prescaler  
÷ 1, 4, 16  
and  
Edge Detect  
CCPR2H  
CCPR2L  
TMR1L  
TMR1  
Enable  
T3CCP2  
T3CCP1  
TMR1H  
© 2009 Microchip Technology Inc.  
DS39689F-page 147  
PIC18F2221/2321/4221/4321 FAMILY  
16.3.2  
TIMER1/TIMER3 MODE SELECTION  
16.3 Compare Mode  
Timer1 and/or Timer3 must be running in Timer mode  
or Synchronized Counter mode if the CCP module is  
using the compare feature. In Asynchronous Counter  
mode, the compare operation may not work.  
In Compare mode, the 16-bit CCPRx register value is  
constantly compared against either the TMR1 or TMR3  
register pair value. When a match occurs, the CCPx pin  
can be:  
• driven high  
16.3.3  
SOFTWARE INTERRUPT MODE  
• driven low  
When the Generate Software Interrupt mode is chosen  
(CCPxM<3:0> = 1010), the corresponding CCPx pin is  
not affected. Only a CCP interrupt is generated, if  
enabled and the CCPxIE bit is set.  
• toggled (high-to-low or low-to-high)  
• remain unchanged (that is, reflects the state of the  
I/O latch)  
The action on the pin is based on the value of the mode  
select bits (CCPxM<3:0>). At the same time, the  
interrupt flag bit, CCPxIF, is set.  
16.3.4  
SPECIAL EVENT TRIGGER  
Both CCP modules are equipped with a Special Event  
Trigger. This is an internal hardware signal generated  
in Compare mode to trigger actions by other modules.  
The Special Event Trigger is enabled by selecting  
the Compare Special Event Trigger mode  
(CCPxM<3:0> = 1011).  
16.3.1  
CCP PIN CONFIGURATION  
The user must configure the CCPx pin as an output by  
clearing the appropriate TRIS bit.  
Note:  
Clearing the CCP2CON register will force  
the RB3 or RC1 compare output latch  
(depending on device configuration) to the  
default low level. This is not the PORTB or  
PORTC I/O data latch.  
For either CCP module, the Special Event Trigger resets  
the Timer register pair for whichever timer resource is  
currently assigned as the module’s time base. This  
allows the CCPRx registers to serve as a programmable  
period register for either timer.  
The Special Event Trigger for CCP2 can also start an  
A/D conversion. In order to do this, the A/D converter  
must already be enabled.  
FIGURE 16-2:  
COMPARE MODE OPERATION BLOCK DIAGRAM  
Special Event Trigger  
(Timer1/Timer3 Reset)  
Set CCP1IF  
CCPR1H  
CCPR1L  
CCP1 pin  
S
R
Q
Output  
Logic  
Compare  
Match  
Comparator  
TRIS  
Output Enable  
4
CCP1CON<3:0>  
TMR1H  
TMR3H  
TMR1L  
TMR3L  
0
0
1
1
Special Event Trigger  
(Timer1/Timer3 Reset, A/D Trigger)  
T3CCP1  
T3CCP2  
Set CCP2IF  
CCP2 pin  
S
R
Q
Compare  
Match  
Output  
Logic  
Comparator  
TRIS  
Output Enable  
4
CCPR2H  
CCPR2L  
CCP2CON<3:0>  
DS39689F-page 148  
© 2009 Microchip Technology Inc.  
PIC18F2221/2321/4221/4321 FAMILY  
TABLE 16-3: REGISTERS ASSOCIATED WITH CAPTURE, COMPARE, TIMER1 AND TIMER3  
Reset  
Name  
Bit 7  
Bit 6  
Bit 5  
Bit 4  
Bit 3  
Bit 2  
Bit 1  
Bit 0  
Values  
on page  
INTCON  
RCON  
PIR1  
GIE/GIEH PEIE/GIEL TMR0IE  
INT0IE  
RI  
RBIE  
TO  
TMR0IF  
PD  
INT0IF  
POR  
RBIF  
55  
54  
58  
58  
58  
58  
58  
58  
58  
58  
56  
56  
56  
57  
57  
57  
57  
57  
57  
57  
57  
57  
(1)  
IPEN  
SBOREN  
ADIF  
RCIF  
RCIE  
RCIP  
BOR  
PSPIF(2)  
PSPIE(2)  
PSPIP(2)  
OSCFIF  
OSCFIE  
OSCFIP  
TXIF  
TXIE  
TXIP  
EEIF  
EEIE  
EEIP  
SSPIF  
SSPIE  
SSPIP  
BCLIF  
BCLIE  
BCLIP  
CCP1IF  
CCP1IE  
CCP1IP  
HLVDIF  
HLVDIE  
HLVDIP  
TMR2IF  
TMR2IE  
TMR2IP  
TMR3IF  
TMR3IE  
TMR3IP  
TMR1IF  
TMR1IE  
TMR1IP  
CCP2IF  
CCP2IE  
CCP2IP  
PIE1  
ADIE  
IPR1  
ADIP  
PIR2  
CMIF  
CMIE  
CMIP  
PIE2  
IPR2  
TRISB  
TRISC  
TMR1L  
TMR1H  
T1CON  
TMR3H  
TMR3L  
T3CON  
PORTB Data Direction Register  
PORTC Data Direction Register  
Timer1 Register Low Byte  
Timer1 Register High Byte  
RD16  
T1RUN T1CKPS1 T1CKPS0 T1OSCEN T1SYNC TMR1CS TMR1ON  
Timer3 Register High Byte  
Timer3 Register Low Byte  
RD16  
T3CCP2 T3CKPS1 T3CKPS0 T3CCP1 T3SYNC TMR3CS TMR3ON  
CCPR1L Capture/Compare/PWM Register 1 Low Byte  
CCPR1H Capture/Compare/PWM Register 1 High Byte  
CCP1CON P1M1(2)  
P1M0(2)  
DC1B1  
DC1B0  
CCP1M3 CCP1M2 CCP1M1 CCP1M0  
CCPR2L Capture/Compare/PWM Register 2 Low Byte  
CCPR2H Capture/Compare/PWM Register 2 High Byte  
CCP2CON  
DC2B1  
DC2B0  
CCP2M3 CCP2M2 CCP2M1 CCP2M0  
Legend: — = unimplemented, read as ‘0’. Shaded cells are not used by Capture/Compare, Timer1 or Timer3.  
Note 1: The SBOREN bit is only available when the BOREN<1:0> Configuration bits = 01; otherwise, it is disabled  
and reads as ‘0’. See Section 5.4 “Brown-out Reset (BOR)”.  
2: These bits are unimplemented on 28-pin devices and read as ‘0’.  
© 2009 Microchip Technology Inc.  
DS39689F-page 149  
PIC18F2221/2321/4221/4321 FAMILY  
16.4.1  
PWM PERIOD  
16.4 PWM Mode  
The PWM period is specified by writing to the PR2  
register. The PWM period can be calculated using the  
following formula:  
In Pulse-Width Modulation (PWM) mode, the CCPx pin  
produces up to a 10-bit resolution PWM output. Since  
the CCP2 pin is multiplexed with a PORTB or PORTC  
data latch, the appropriate TRIS bit must be cleared to  
make the CCP2 pin an output.  
EQUATION 16-1:  
PWM Period = [(PR2) + 1] • 4 • TOSC •  
(TMR2 Prescale Value)  
Note:  
Clearing the CCP2CON register will force  
the RB3 or RC1 output latch (depending on  
device configuration) to the default low  
level. This is not the PORTB or PORTC I/O  
data latch.  
PWM frequency is defined as 1/[PWM period].  
When TMR2 is equal to PR2, the following three events  
occur on the next increment cycle:  
Figure 16-3 shows a simplified block diagram of the  
CCP module in PWM mode.  
• TMR2 is cleared  
For a step-by-step procedure on how to set up the CCP  
module for PWM operation, see Section 16.4.4  
“Setup for PWM Operation”.  
• The CCPx pin is set (exception: if PWM duty  
cycle = 0%, the CCPx pin will not be set)  
• The PWM duty cycle is latched from CCPRxL into  
CCPRxH  
FIGURE 16-3:  
SIMPLIFIED PWM BLOCK  
DIAGRAM  
Note:  
The Timer2 postscalers (see Section 14.0  
“Timer2 Module”) are not used in the  
determination of the PWM frequency. The  
postscaler could be used to have a servo  
update rate at a different frequency than  
the PWM output.  
CCPxCON<5:4>  
Duty Cycle Registers  
CCPRxL  
16.4.2  
PWM DUTY CYCLE  
CCPRxH (Slave)  
Comparator  
CCPx Output  
The PWM duty cycle is specified by writing to the  
CCPRxL register and to the CCPxCON<5:4> bits. Up  
to 10-bit resolution is available. The CCPRxL contains  
the eight MSbs and the CCPxCON<5:4> contains the  
two LSbs. This 10-bit value is represented by  
CCPRxL:CCPxCON<5:4>. The following equation is  
used to calculate the PWM duty cycle in time:  
Q
R
S
(Note 1)  
TMR2  
Corresponding  
TRIS bit  
Comparator  
PR2  
Clear Timer,  
CCPx pin and  
latch D.C.  
EQUATION 16-2:  
PWM Duty Cycle = (CCPRXL:CCPXCON<5:4>) •  
TOSC • (TMR2 Prescale Value)  
Note 1: The 8-bit TMR2 value is concatenated with the 2-bit  
internal Q clock, or 2 bits of the prescaler, to create the  
10-bit time base.  
CCPRxL and CCPxCON<5:4> can be written to at any  
time, but the duty cycle value is not latched into  
CCPRxH until after a match between PR2 and TMR2  
occurs (i.e., the period is complete). In PWM mode,  
CCPRxH is a read-only register.  
A PWM output (Figure 16-4) has a time base (period)  
and a time that the output stays high (duty cycle).  
The frequency of the PWM is the inverse of the  
period (1/period).  
FIGURE 16-4:  
PWM OUTPUT  
Period  
Duty Cycle  
TMR2 = PR2  
TMR2 = Duty Cycle  
TMR2 = PR2  
DS39689F-page 150  
© 2009 Microchip Technology Inc.  
PIC18F2221/2321/4221/4321 FAMILY  
The CCPRxH register and a 2-bit internal latch are  
EQUATION 16-3:  
used to double-buffer the PWM duty cycle. This  
double-buffering is essential for glitchless PWM  
operation.  
FOSC  
log ---------------  
FPWM  
PWM Resolution (max)  
= ----------------------------- b i t s  
log(2)  
When the CCPRxH and 2-bit latch match TMR2,  
concatenated with an internal 2-bit Q clock or 2 bits of  
the TMR2 prescaler, the CCPx pin is cleared.  
Note:  
If the PWM duty cycle value is longer than  
the PWM period, the CCPx pin will not be  
cleared.  
The maximum PWM resolution (bits) for a given PWM  
frequency is given by the equation:  
TABLE 16-4: EXAMPLE PWM FREQUENCIES AND RESOLUTIONS AT 40 MHz  
PWM Frequency  
2.44 kHz  
9.77 kHz  
39.06 kHz 156.25 kHz 312.50 kHz 416.67 kHz  
Timer Prescaler (1, 4, 16)  
PR2 Value  
16  
FFh  
10  
4
1
1
3Fh  
8
1
1Fh  
7
1
FFh  
10  
FFh  
10  
17h  
6.58  
Maximum Resolution (bits)  
16.4.3  
PWM AUTO-SHUTDOWN  
(CCP1 ONLY)  
16.4.4  
SETUP FOR PWM OPERATION  
The following steps should be taken when configuring  
the CCP module for PWM operation:  
The PWM auto-shutdown features of the Enhanced CCP  
module are also available to CCP1 in 28-pin devices. The  
operation of this feature is discussed in detail in  
Section 17.4.7 “Enhanced PWM Auto-Shutdown”.  
1. Set the PWM period by writing to the PR2  
register.  
2. Set the PWM duty cycle by writing to the  
CCPRxL register and CCPxCON<5:4> bits.  
Auto-shutdown features are not available for CCP2.  
3. Make the CCPx pin an output by clearing the  
appropriate TRIS bit.  
4. Set the TMR2 prescale value, then enable  
Timer2 by writing to T2CON.  
5. Configure the CCPx module for PWM operation.  
© 2009 Microchip Technology Inc.  
DS39689F-page 151  
PIC18F2221/2321/4221/4321 FAMILY  
TABLE 16-5: REGISTERS ASSOCIATED WITH PWM AND TIMER2  
Reset  
Values  
on page  
Name  
Bit 7  
Bit 6  
Bit 5  
Bit 4  
Bit 3  
Bit 2  
Bit 1  
Bit 0  
INTCON  
RCON  
PIR1  
GIE/GIEH PEIE/GIEL TMR0IE  
INT0IE  
RI  
RBIE  
TO  
TMR0IF  
PD  
INT0IF  
POR  
RBIF  
BOR  
55  
54  
58  
58  
58  
58  
58  
56  
56  
56  
57  
57  
57  
57  
57  
57  
57  
57  
IPEN  
SBOREN(1)  
PSPIF(2)  
PSPIE(2)  
PSPIP(2)  
ADIF  
RCIF  
RCIE  
RCIP  
TXIF  
TXIE  
TXIP  
SSPIF  
SSPIE  
SSPIP  
CCP1IF  
TMR2IF  
TMR1IF  
TMR1IE  
TMR1IP  
PIE1  
ADIE  
CCP1IE TMR2IE  
CCP1IP TMR2IP  
IPR1  
ADIP  
TRISB  
TRISC  
TMR2  
PR2  
PORTB Data Direction Register  
PORTC Data Direction Register  
Timer2 Register  
Timer2 Period Register  
T2CON  
CCPR1L  
T2OUTPS3 T2OUTPS2 T2OUTPS1 T2OUTPS0 TMR2ON T2CKPS1 T2CKPS0  
Capture/Compare/PWM Register 1 Low Byte  
CCPR1H Capture/Compare/PWM Register 1 High Byte  
CCP1CON P1M1(2) P1M0(2)  
DC1B1 DC1B0  
CCPR2L Capture/Compare/PWM Register 2 Low Byte  
CCPR2H Capture/Compare/PWM Register 2 High Byte  
CCP2CON DC2B1 DC2B0  
ECCP1AS ECCPASE ECCPAS2 ECCPAS1 ECCPAS0 PSSAC1 PSSAC0 PSSBD1(2) PSSBD0(2)  
ECCP1DEL PRSEN  
PDC6(2) PDC5(2) PDC4(2) PDC3(2) PDC2(2) PDC1(2) PDC0(2)  
Legend: — = unimplemented, read as ‘0’. Shaded cells are not used by PWM or Timer2.  
CCP1M3 CCP1M2 CCP1M1 CCP1M0  
CCP2M3 CCP2M2 CCP2M1 CCP2M0  
Note 1: The SBOREN bit is only available when the BOREN<1:0> Configuration bits = 01; otherwise, it is disabled  
and reads as ‘0’. See Section 5.4 “Brown-out Reset (BOR)”.  
2: These bits are unimplemented on 28-pin devices and read as ‘0’.  
DS39689F-page 152  
© 2009 Microchip Technology Inc.  
PIC18F2221/2321/4221/4321 FAMILY  
Enhanced features are discussed in detail in  
17.0 ENHANCED CAPTURE/  
Section 17.4 “Enhanced PWM Mode”. Capture,  
Compare and single-output PWM functions of the  
ECCP module are the same as described for the  
standard CCP module.  
COMPARE/PWM (ECCP)  
MODULE  
Note:  
The ECCP module is implemented only in  
40/44-pin devices.  
The control register for the Enhanced CCP module is  
shown in Register 17-1. It differs from the CCPxCON  
registers in PIC18F2221/2321 devices in that the two  
Most Significant bits are implemented to control PWM  
functionality.  
In PIC18F4221/4321 devices, CCP1 is implemented  
as a standard CCP module with Enhanced PWM  
capabilities. These include the provision for 2 or  
4 output channels, user-selectable polarity, dead-band  
control and automatic shutdown and restart. The  
REGISTER 17-1: CCP1CON REGISTER (ECCP1 MODULE, 40/44-PIN DEVICES)  
R/W-0  
P1M1  
R/W-0  
P1M0  
R/W-0  
R/W-0  
R/W-0  
R/W-0  
R/W-0  
R/W-0  
DC1B1  
DC1B0  
CCP1M3 CCP1M2 CCP1M1 CCP1M0  
bit 0  
bit 7  
bit 7-6  
P1M<1:0>: Enhanced PWM Output Configuration bits  
If CCP1M<3:2> = 00, 01, 10:  
xx= P1A assigned as Capture/Compare input/output; P1B, P1C, P1D assigned as port pins  
If CCP1M<3:2> = 11:  
00= Single output: P1A modulated; P1B, P1C, P1D assigned as port pins  
01= Full-bridge output forward: P1D modulated; P1A active; P1B, P1C inactive  
10= Half-bridge output: P1A, P1B modulated with dead-band control; P1C, P1D assigned  
as port pins  
11= Full-bridge output reverse: P1B modulated; P1C active; P1A, P1D inactive  
bit 5-4  
DC1B<1:0>: PWM Duty Cycle bit 1 and bit 0  
Capture mode:  
Unused.  
Compare mode:  
Unused.  
PWM mode:  
These bits are the two LSbs of the 10-bit PWM duty cycle. The eight MSbs of the duty cycle are  
found in CCPR1L.  
bit 3-0  
CCP1M<3:0>: Enhanced CCP Mode Select bits  
0000= Capture/Compare/PWM off (resets ECCP module)  
0001= Reserved  
0010= Compare mode, toggle output on match  
0011= Capture mode  
0100= Capture mode, every falling edge  
0101= Capture mode, every rising edge  
0110= Capture mode, every 4th rising edge  
0111= Capture mode, every 16th rising edge  
1000= Compare mode, initialize CCP1 pin low, set output on compare match (set CCP1IF)  
1001= Compare mode, initialize CCP1 pin high, clear output on compare match (set CCP1IF)  
1010= Compare mode, generate software interrupt only, CCP1 pin reverts to I/O state  
1011= Compare mode, trigger special event (ECCP resets TMR1 or TMR3, sets CC1IF bit)  
1100= PWM mode; P1A, P1C active-high; P1B, P1D active-high  
1101= PWM mode; P1A, P1C active-high; P1B, P1D active-low  
1110= PWM mode; P1A, P1C active-low; P1B, P1D active-high  
1111= PWM mode; P1A, P1C active-low; P1B, P1D active-low  
Legend:  
R = Readable bit  
-n = Value at POR  
W = Writable bit  
‘1’ = Bit is set  
U = Unimplemented bit, read as ‘0’  
‘0’ = Bit is cleared x = Bit is unknown  
© 2009 Microchip Technology Inc.  
DS39689F-page 153  
PIC18F2221/2321/4221/4321 FAMILY  
In addition to the expanded range of modes available  
17.2 Capture and Compare Modes  
through the CCP1CON and ECCP1AS registers, the  
ECCP module has an additional register associated  
with Enhanced PWM operation and auto-shutdown  
features; it is:  
Except for the operation of the Special Event Trigger  
discussed below, the Capture and Compare modes of  
the ECCP module are identical in operation to that of  
CCP2. These are discussed in detail in Section 16.2  
“Capture Mode” and Section 16.3 “Compare  
Mode”. No changes are required when moving  
between 28-pin and 40/44-pin devices.  
• ECCP1DEL (PWM Dead-Band Delay)  
17.1 ECCP Outputs and Configuration  
The Enhanced CCP module may have up to four PWM  
outputs, depending on the selected operating mode.  
These outputs, designated P1A through P1D, are  
multiplexed with I/O pins on PORTC and PORTD. The  
outputs that are active depend on the CCP operating  
mode selected. The pin assignments are summarized  
in Table 17-1.  
17.2.1  
SPECIAL EVENT TRIGGER  
The Special Event Trigger output of ECCP1 resets the  
TMR1 or TMR3 register pair, depending on which timer  
resource is currently selected. This allows the CCPR1  
register to effectively be a 16-bit programmable period  
register for Timer1 or Timer3.  
To configure the I/O pins as PWM outputs, the proper  
PWM mode must be selected by setting the P1M<1:0>  
and CCP1M<3:0> bits. The appropriate TRISC and  
TRISD direction bits for the port pins must also be set  
as outputs.  
17.3 Standard PWM Mode  
When configured in Single Output mode, the ECCP  
module functions identically to the standard CCP  
module in PWM mode, as described in Section 16.4  
“PWM Mode”. This is also sometimes referred to as  
“Compatible CCP” mode, as in Table 17-1.  
17.1.1  
ECCP MODULES AND TIMER  
RESOURCES  
Note:  
When setting up single output PWM  
operations, users are free to use either  
Like the standard CCP modules, the ECCP module can  
utilize Timers 1, 2 or 3, depending on the mode  
selected. Timer1 and Timer3 are available for modules  
in Capture or Compare modes, while Timer2 is avail-  
able for modules in PWM mode. Interactions between  
the standard and Enhanced CCP modules are identical  
to those described for standard CCP modules.  
Additional details on timer resources are provided in  
of  
the  
processes  
described  
in  
Section 16.4.4 “Setup for PWM  
Operation” or Section 17.4.9 “Setup  
for PWM Operation”. The latter is more  
generic and will work for either single or  
multi-output PWM.  
Section 16.1.1  
“CCP  
Modules  
and  
Timer  
Resources”.  
TABLE 17-1: PIN ASSIGNMENTS FOR VARIOUS ECCP1 MODES  
CCP1CON  
ECCP Mode  
RC2  
RD5  
RD6  
RD7  
Configuration  
All 40/44-pin devices:  
Compatible CCP  
Dual PWM  
00xx 11xx  
10xx 11xx  
x1xx 11xx  
CCP1  
P1A  
RD5/PSP5  
P1B  
RD6/PSP6  
RD6/PSP6  
P1C  
RD7/PSP7  
RD7/PSP7  
P1D  
Quad PWM  
P1A  
P1B  
Legend: x= Don’t care. Shaded cells indicate pin assignments not used by ECCP1 in a given mode.  
DS39689F-page 154  
© 2009 Microchip Technology Inc.  
PIC18F2221/2321/4221/4321 FAMILY  
17.4.1  
PWM PERIOD  
17.4 Enhanced PWM Mode  
The PWM period is specified by writing to the PR2  
register. The PWM period can be calculated using the  
following equation.  
The Enhanced PWM mode provides additional PWM  
output options for a broader range of control applica-  
tions. The module is a backward compatible version of  
the standard CCP module and offers up to four outputs,  
designated P1A through P1D. Users are also able to  
select the polarity of the signal (either active-high or  
active-low). The module’s output mode and polarity are  
configured by setting the P1M<1:0> and CCP1M<3:0>  
bits of the CCP1CON register.  
EQUATION 17-1:  
PWM Period = [(PR2) + 1] • 4 • TOSC •  
(TMR2 Prescale Value)  
PWM frequency is defined as 1/[PWM period]. When  
TMR2 is equal to PR2, the following three events occur  
on the next increment cycle:  
Figure 17-1 shows a simplified block diagram of PWM  
operation. All control registers are double-buffered and  
are loaded at the beginning of a new PWM cycle (the  
period boundary when Timer2 resets) in order to  
prevent glitches on any of the outputs. The exception is  
the PWM Dead-Band Delay register, ECCP1DEL,  
which is loaded at either the duty cycle boundary or the  
period boundary (whichever comes first). Because of  
the buffering, the module waits until the assigned timer  
resets, instead of starting immediately. This means that  
Enhanced PWM waveforms do not exactly match the  
standard PWM waveforms, but are instead offset by  
one full instruction cycle (4 TOSC).  
• TMR2 is cleared  
• The CCP1 pin is set (if PWM duty cycle = 0%, the  
CCP1 pin will not be set)  
• The PWM duty cycle is copied from CCPR1L into  
CCPR1H  
Note:  
The Timer2 postscaler (see Section 14.0  
“Timer2 Module”) is not used in the  
determination of the PWM frequency. The  
postscaler could be used to have a servo  
update rate at a different frequency than  
the PWM output.  
As before, the user must manually configure the  
appropriate TRIS bits for output.  
FIGURE 17-1:  
SIMPLIFIED BLOCK DIAGRAM OF THE ENHANCED PWM MODULE  
CCP1CON<5:4>  
P1M1<1:0>  
CCP1M<3:0>  
4
Duty Cycle Registers  
2
CCPR1L  
CCP1/P1A  
CCP1/P1A  
P1B  
TRISx<x>  
TRISx<x>  
TRISx<x>  
TRISx<x>  
CCPR1H (Slave)  
Comparator  
P1B  
Output  
Controller  
R
S
Q
P1C  
P1C  
P1D  
(Note 1)  
TMR2  
P1D  
Comparator  
PR2  
Clear Timer,  
set CCP1 pin and  
latch D.C.  
ECCP1DEL  
Note: The 8-bit TMR2 register is concatenated with the 2-bit internal Q clock, or 2 bits of the prescaler, to create the 10-bit  
time base.  
© 2009 Microchip Technology Inc.  
DS39689F-page 155  
PIC18F2221/2321/4221/4321 FAMILY  
17.4.2  
PWM DUTY CYCLE  
EQUATION 17-3:  
The PWM duty cycle is specified by writing to the  
CCPR1L register and to the CCP1CON<5:4> bits. Up  
to 10-bit resolution is available. The CCPR1L contains  
the eight MSbs and the CCP1CON<5:4> contains the  
two LSbs. This 10-bit value is represented by  
CCPR1L:CCP1CON<5:4>. The PWM duty cycle is  
calculated by the following equation.  
FOSC  
FPWM  
log  
(
)
bits  
PWM Resolution (max) =  
log(2)  
Note:  
If the PWM duty cycle value is longer than  
the PWM period, the CCP1 pin will not be  
cleared.  
EQUATION 17-2:  
PWM Duty Cycle = (CCPR1L:CCP1CON<5:4>) •  
TOSC • (TMR2 Prescale Value)  
17.4.3  
PWM OUTPUT CONFIGURATIONS  
The P1M<1:0> bits in the CCP1CON register allow one  
of four configurations:  
CCPR1L and CCP1CON<5:4> can be written to at any  
time, but the duty cycle value is not copied into  
CCPR1H until a match between PR2 and TMR2 occurs  
(i.e., the period is complete). In PWM mode, CCPR1H  
is a read-only register.  
• Single Output  
• Half-Bridge Output  
• Full-Bridge Output, Forward mode  
• Full-Bridge Output, Reverse mode  
The CCPR1H register and a 2-bit internal latch are  
used to double-buffer the PWM duty cycle. This  
double-buffering is essential for glitchless PWM  
operation. When the CCPR1H and 2-bit latch match  
TMR2, concatenated with an internal 2-bit Q clock or  
two bits of the TMR2 prescaler, the CCP1 pin is  
cleared. The maximum PWM resolution (bits) for a  
given PWM frequency is given by the following  
equation.  
The Single Output mode is the standard PWM mode  
discussed in Section 17.4 “Enhanced PWM Mode”.  
The Half-Bridge and Full-Bridge Output modes are  
covered in detail in the sections that follow.  
The general relationship of the outputs in all  
configurations is summarized in Figure 17-2.  
TABLE 17-2: EXAMPLE PWM FREQUENCIES AND RESOLUTIONS AT 40 MHz  
PWM Frequency  
2.44 kHz  
9.77 kHz  
39.06 kHz 156.25 kHz 312.50 kHz 416.67 kHz  
Timer Prescaler (1, 4, 16)  
PR2 Value  
16  
FFh  
10  
4
1
1
3Fh  
8
1
1Fh  
7
1
FFh  
10  
FFh  
10  
17h  
6.58  
Maximum Resolution (bits)  
DS39689F-page 156  
© 2009 Microchip Technology Inc.  
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FIGURE 17-2:  
PWM OUTPUT RELATIONSHIPS (ACTIVE-HIGH STATE)  
0
PR2 + 1  
Duty  
Cycle  
SIGNAL  
CCP1CON  
<7:6>  
Period  
P1A Modulated  
P1A Modulated  
P1B Modulated  
P1A Active  
(Single Output)  
00  
10  
(1)  
(1)  
Delay  
Delay  
(Half-Bridge)  
P1B Inactive  
P1C Inactive  
P1D Modulated  
P1A Inactive  
P1B Modulated  
P1C Active  
(Full-Bridge,  
Forward)  
01  
(Full-Bridge,  
Reverse)  
11  
P1D Inactive  
FIGURE 17-3:  
PWM OUTPUT RELATIONSHIPS (ACTIVE-LOW STATE)  
0
PR2 + 1  
SIGNAL  
CCP1CON  
Duty  
Cycle  
<7:6>  
Period  
P1A Modulated  
P1A Modulated  
P1B Modulated  
P1A Active  
(Single Output)  
00  
10  
(1)  
(1)  
Delay  
Delay  
(Half-Bridge)  
P1B Inactive  
P1C Inactive  
P1D Modulated  
P1A Inactive  
P1B Modulated  
P1C Active  
(Full-Bridge,  
Forward)  
01  
11  
(Full-Bridge,  
Reverse)  
P1D Inactive  
Relationships:  
Period = 4 * TOSC * (PR2 + 1) * (TMR2 Prescale Value)  
Duty Cycle = TOSC * (CCPR1L<7:0>:CCP1CON<5:4>) * (TMR2 Prescale Value)  
Delay = 4 * TOSC * (ECCP1DEL<6:0>)  
Note 1: Dead-band delay is programmed using the ECCP1DEL register (see Section 17.4.6 “Programmable  
Dead-Band Delay”).  
© 2009 Microchip Technology Inc.  
DS39689F-page 157  
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17.4.4  
HALF-BRIDGE MODE  
FIGURE 17-4:  
HALF-BRIDGE PWM  
OUTPUT  
In the Half-Bridge Output mode, two pins are used as  
outputs to drive push-pull loads. The PWM output signal  
is output on the P1A pin, while the complementary PWM  
output signal is output on the P1B pin (Figure 17-4). This  
mode can be used for half-bridge applications, as shown  
in Figure 17-5, or for full-bridge applications where four  
power switches are being modulated with two PWM  
signals.  
Period  
Period  
Duty Cycle  
(2)  
(2)  
P1A  
td  
td  
P1B  
In Half-Bridge Output mode, the programmable dead-  
band delay can be used to prevent shoot-through  
current in half-bridge power devices. The value of bits,  
PDC<6:0>, sets the number of instruction cycles before  
the output is driven active. If the value is greater than  
the duty cycle, the corresponding output remains  
inactive during the entire cycle. See Section 17.4.6  
“Programmable Dead-Band Delay” for more details  
of the dead-band delay operations.  
(1)  
(1)  
(1)  
td = Dead-Band Delay  
Note 1: At this time, the TMR2 register is equal to the  
PR2 register.  
2: Output signals are shown as active-high.  
Since the P1A and P1B outputs are multiplexed with  
the PORTC<2> and PORTD<5> data latches, the  
TRISC<2> and TRISD<5> bits must be cleared to  
configure P1A and P1B as outputs.  
FIGURE 17-5:  
EXAMPLES OF HALF-BRIDGE OUTPUT MODE APPLICATIONS  
V+  
Standard Half-Bridge Circuit (“Push-Pull”)  
PIC18F4X21  
P1A  
FET  
Driver  
+
V
-
Load  
FET  
Driver  
+
V
-
P1B  
V-  
Half-Bridge Output Driving a Full-Bridge Circuit  
V+  
PIC18F4X21  
FET  
FET  
Driver  
Driver  
P1A  
Load  
FET  
FET  
Driver  
Driver  
P1B  
V-  
DS39689F-page 158  
© 2009 Microchip Technology Inc.  
PIC18F2221/2321/4221/4321 FAMILY  
P1A, P1B, P1C and P1D outputs are multiplexed with  
the PORTC<2> and PORTD<7:5> data latches. The  
TRISC<2> and TRISD<7:5> bits must be cleared to  
make the P1A, P1B, P1C and P1D pins outputs.  
17.4.5  
FULL-BRIDGE MODE  
In Full-Bridge Output mode, four pins are used as  
outputs; however, only two outputs are active at a time.  
In the Forward mode, pin P1A is continuously active  
and pin P1D is modulated. In the Reverse mode, pin  
P1C is continuously active and pin P1B is modulated.  
These are illustrated in Figure 17-6.  
FIGURE 17-6:  
FULL-BRIDGE PWM OUTPUT  
Forward Mode  
Period  
(2)  
P1A  
Duty Cycle  
(2)  
(2)  
P1B  
P1C  
(2)  
P1D  
(1)  
(1)  
Reverse Mode  
Period  
Duty Cycle  
(2)  
P1A  
(2)  
P1B  
(2)  
P1C  
(2)  
P1D  
(1)  
(1)  
Note 1: At this time, the TMR2 register is equal to the PR2 register.  
Note 2: Output signal is shown as active-high.  
© 2009 Microchip Technology Inc.  
DS39689F-page 159  
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FIGURE 17-7:  
EXAMPLE OF FULL-BRIDGE APPLICATION  
V+  
PIC18F4X21  
QC  
QA  
FET  
Driver  
FET  
Driver  
P1A  
Load  
P1B  
FET  
Driver  
FET  
Driver  
P1C  
P1D  
QD  
QB  
V-  
Figure 17-9 shows an example where the PWM  
direction changes from forward to reverse at a near  
100% duty cycle. At time t1, the outputs P1A and P1D  
become inactive, while output P1C becomes active. In  
this example, since the turn-off time of the power  
devices is longer than the turn-on time, a shoot-through  
current may flow through power devices, QC and QD  
(see Figure 17-7), for the duration of ‘t’. The same  
phenomenon will occur to power devices, QA and QB,  
for PWM direction change from reverse to forward.  
17.4.5.1  
Direction Change in Full-Bridge Mode  
In the Full-Bridge Output mode, the P1M1 bit in the  
CCP1CON register allows user to control the forward/  
reverse direction. When the application firmware  
changes this direction control bit, the module will  
assume the new direction on the next PWM cycle.  
Just before the end of the current PWM period, the  
modulated outputs (P1B and P1D) are placed in their  
inactive state, while the unmodulated outputs (P1A and  
P1C) are switched to drive in the opposite direction.  
This occurs in a time interval of 4 TOSC * (Timer2  
Prescale Value) before the next PWM period begins.  
The Timer2 prescaler will be either 1, 4 or 16, depend-  
ing on the value of the T2CKPS<1:0> bits  
(T2CON<1:0>). During the interval from the switch of  
the unmodulated outputs to the beginning of the next  
period, the modulated outputs (P1B and P1D) remain  
inactive. This relationship is shown in Figure 17-8.  
If changing PWM direction at high duty cycle is required  
for an application, one of the following requirements  
must be met:  
1. Reduce PWM for  
changing directions.  
a PWM period before  
2. Use switch drivers that can drive the switches off  
faster than they can drive them on.  
Other options to prevent shoot-through current may  
exist.  
Note that in the Full-Bridge Output mode, the ECCP1  
module does not provide any dead-band delay. In  
general, since only one output is modulated at all times,  
dead-band delay is not required. However, there is a  
situation where a dead-band delay might be required.  
This situation occurs when both of the following  
conditions are true:  
1. The direction of the PWM output changes when  
the duty cycle of the output is at or near 100%.  
2. The turn-off time of the power switch, including  
the power device and driver circuit, is greater  
than the turn-on time.  
DS39689F-page 160  
© 2009 Microchip Technology Inc.  
PIC18F2221/2321/4221/4321 FAMILY  
FIGURE 17-8:  
PWM DIRECTION CHANGE  
(1)  
Period  
Period  
SIGNAL  
P1A (Active-High)  
P1B (Active-High)  
DC  
P1C (Active-High)  
P1D (Active-High)  
(Note 2)  
DC  
Note 1: The direction bit in the CCP1 Control register (CCP1CON<7>) is written any time during the PWM cycle.  
2: When changing directions, the P1A and P1C signals switch before the end of the current PWM cycle at intervals  
of 4 TOSC, 16 TOSC or 64 TOSC, depending on the Timer2 prescaler value. The modulated P1B and P1D signals  
are inactive at this time.  
FIGURE 17-9:  
PWM DIRECTION CHANGE AT NEAR 100% DUTY CYCLE  
Forward Period  
Reverse Period  
t1  
(1)  
(1)  
P1A  
P1B  
DC  
(1)  
(1)  
P1C  
P1D  
DC  
(2)  
t
ON  
(1)  
(1)  
External Switch C  
External Switch D  
(3)  
t
OFF  
(2,3)  
Potential  
t = t  
– t  
ON  
OFF  
Shoot-Through  
(1)  
Current  
Note 1: All signals are shown as active-high.  
2:  
3:  
t
t
is the turn-on delay of power switch QC and its driver.  
ON  
is the turn-off delay of power switch QD and its driver.  
OFF  
© 2009 Microchip Technology Inc.  
DS39689F-page 161  
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A shutdown event can be caused by either of the  
comparator modules, a low level on the Fault input pin  
(FLT0) or any combination of these three sources. The  
comparators may be used to monitor a voltage input  
proportional to a current being monitored in the bridge  
17.4.6  
PROGRAMMABLE DEAD-BAND  
DELAY  
Note:  
Programmable dead-band delay is not  
implemented in 28-pin devices with  
standard CCP modules.  
circuit. If the voltage exceeds  
a threshold, the  
comparator switches state and triggers a shutdown.  
Alternatively, a low digital signal on FLT0 can also trigger  
a shutdown. The auto-shutdown feature can be disabled  
by not selecting any auto-shutdown sources. The auto-  
shutdown sources to be used are selected using the  
ECCPAS<2:0> bits (ECCP1AS<6:4>).  
In half-bridge applications, where all power switches  
are modulated at the PWM frequency at all times, the  
power switches normally require more time to turn off  
than to turn on. If both the upper and lower power  
switches are switched at the same time (one turned on  
and the other turned off), both switches may be on for  
a short period of time until one switch completely turns  
off. During this brief interval, a very high current (shoot-  
through current) may flow through both power  
switches, shorting the bridge supply. To avoid this  
potentially destructive shoot-through current from  
flowing during switching, turning on either of the power  
switches is normally delayed to allow the other switch  
to completely turn off.  
When a shutdown occurs, the output pins are asyn-  
chronously placed in their shutdown states, specified  
by the PSSAC<1:0> and PSSBD<1:0> bits  
(ECCP1AS<3:0>). Each pin pair (P1A/P1C and P1B/  
P1D) may be set to drive high, drive low or be tri-stated  
(not driving). The ECCPASE bit (ECCP1AS<7>) is also  
set to hold the Enhanced PWM outputs in their  
shutdown states.  
In the Half-Bridge Output mode, a digitally programmable  
dead-band delay is available to avoid shoot-through  
current from destroying the bridge power switches. The  
delay occurs at the signal transition from the nonactive  
state to the active state (see Figure 17-4 for illustra-  
tion). Bits PDC<6:0> of the ECCP1DEL register  
(Register 17-2) set the delay period in terms of micro-  
controller instruction cycles (TCY or 4 TOSC). These bits  
are not available on 28-pin devices as the standard  
CCP module does not support half-bridge operation.  
The ECCPASE bit is set by hardware when a shutdown  
event occurs. If automatic restarts are not enabled, the  
ECCPASE bit is cleared by firmware when the cause of  
the shutdown clears. If automatic restarts are enabled,  
the ECCPASE bit is automatically cleared when the  
cause of the auto-shutdown has cleared.  
If the ECCPASE bit is set when a PWM period begins,  
the PWM outputs remain in their shutdown state for that  
entire PWM period. When the ECCPASE bit is cleared,  
the PWM outputs will return to normal operation at the  
beginning of the next PWM period.  
17.4.7  
ENHANCED PWM AUTO-SHUTDOWN  
Note:  
Writing to the ECCPASE bit is disabled  
while a shutdown condition is active.  
When the ECCP1 is programmed for any of the  
Enhanced PWM modes, the active output pins may be  
configured for auto-shutdown. Auto-shutdown immedi-  
ately places the Enhanced PWM output pins into a  
defined shutdown state when a shutdown event occurs.  
REGISTER 17-2: ECCP1DEL: PWM DEAD-BAND DELAY REGISTER  
R/W-0  
R/W-0  
R/W-0  
R/W-0  
R/W-0  
R/W-0  
R/W-0  
R/W-0  
PRSEN  
PDC6(1)  
PDC5(1)  
PDC4(1)  
PDC3(1)  
PDC2(1)  
PDC1(1)  
PDC0(1)  
bit 7  
bit 0  
bit 7  
PRSEN: PWM Restart Enable bit  
1= Upon auto-shutdown, the ECCPASE bit clears automatically once the shutdown event  
goes away; the PWM restarts automatically  
0= Upon auto-shutdown, ECCPASE must be cleared in software to restart the PWM  
bit 6-0  
PDC<6:0>: PWM Delay Count bits(1)  
Delay time, in number of FOSC/4 (4 * TOSC) cycles, between the scheduled and actual time for  
a PWM signal to transition to active.  
Note 1: Unimplemented on 28-pin devices; bits read ‘0’.  
Legend:  
R = Readable bit  
-n = Value at POR  
W = Writable bit  
‘1’ = Bit is set  
U = Unimplemented bit, read as ‘0’  
‘0’ = Bit is cleared x = Bit is unknown  
DS39689F-page 162  
© 2009 Microchip Technology Inc.  
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REGISTER 17-3: ECCP1AS: ENHANCED CAPTURE/COMPARE/PWM AUTO-SHUTDOWN  
CONTROL REGISTER  
R/W-0  
R/W-0  
R/W-0  
R/W-0  
R/W-0  
R/W-0  
R/W-0  
R/W-0  
ECCPASE ECCPAS2 ECCPAS1 ECCPAS0 PSSAC1 PSSAC0 PSSBD1(1) PSSBD0(1)  
bit 7  
bit 0  
bit 7  
ECCPASE: ECCP Auto-Shutdown Event Status bit  
1= A shutdown event has occurred; ECCP outputs are in shutdown state  
0= ECCP outputs are operating  
bit 6-4  
ECCPAS<2:0>: ECCP Auto-Shutdown Source Select bits  
111= FLT0 or Comparator 1 or Comparator 2  
110= FLT0 or Comparator 2  
101= FLT0 or Comparator 1  
100= FLT0  
011= Either Comparator 1 or 2  
010= Comparator 2 output  
001= Comparator 1 output  
000= Auto-shutdown is disabled  
bit 3-2  
bit 1-0  
PSSAC<1:0>: Pins A and C Shutdown State Control bits  
1x= Pins A and C are tri-state (40/44-pin devices);  
PWM output is tri-state (28-pin devices)  
01= Drive Pins A and C to ‘1’  
00= Drive Pins A and C to ‘0’  
PSSBD<1:0>: Pins B and D Shutdown State Control bits(1)  
1x= Pins B and D tri-state  
01= Drive Pins B and D to ‘1’  
00= Drive Pins B and D to ‘0’  
Note 1: Unimplemented on 28-pin devices; bits read as ‘0’.  
Legend:  
R = Readable bit  
-n = Value at POR  
W = Writable bit  
‘1’ = Bit is set  
U = Unimplemented bit, read as ‘0’  
‘0’ = Bit is cleared x = Bit is unknown  
© 2009 Microchip Technology Inc.  
DS39689F-page 163  
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17.4.7.1  
Auto-Shutdown and  
Automatic Restart  
17.4.8  
START-UP CONSIDERATIONS  
When the ECCP module is used in the PWM mode, the  
application hardware must use the proper external pull-  
up and/or pull-down resistors on the PWM output pins.  
When the microcontroller is released from Reset, all of  
the I/O pins are in the high-impedance state. The  
external circuits must keep the power switch devices in  
the OFF state until the microcontroller drives the I/O  
pins with the proper signal levels, or activates the PWM  
output(s).  
The auto-shutdown feature can be configured to allow  
automatic restarts of the module following a shutdown  
event. This is enabled by setting the PRSEN bit of the  
ECCP1DEL register (ECCP1DEL<7>).  
In Shutdown mode with PRSEN = 1(Figure 17-10), the  
ECCPASE bit will remain set for as long as the cause  
of the shutdown continues. When the shutdown condi-  
tion clears, the ECCP1ASE bit is cleared. If PRSEN = 0  
(Figure 17-11), once a shutdown condition occurs, the  
ECCPASE bit will remain set until it is cleared by  
firmware. Once ECCPASE is cleared, the Enhanced  
PWM will resume at the beginning of the next PWM  
period.  
The CCP1M<1:0> bits (CCP1CON<1:0>) allow the  
user to choose whether the PWM output signals are  
active-high or active-low for each pair of PWM output  
pins (P1A/P1C and P1B/P1D). The PWM output  
polarities must be selected before the PWM pins are  
configured as outputs. Changing the polarity configura-  
tion while the PWM pins are configured as outputs is  
not recommended, since it may result in damage to the  
application circuits.  
Note:  
Writing to the ECCPASE bit is disabled  
while a shutdown condition is active.  
Independent of the PRSEN bit setting, if the auto-  
shutdown source is one of the comparators, the  
shutdown condition is a level. The ECCPASE bit  
cannot be cleared as long as the cause of the shutdown  
persists.  
The P1A, P1B, P1C and P1D output latches may not be  
in the proper states when the PWM module is initialized.  
Enabling the PWM pins for output at the same time as  
the ECCP module may cause damage to the applica-  
tion circuit. The ECCP module must be enabled in the  
proper output mode and complete a full PWM cycle  
before configuring the PWM pins as outputs. The com-  
pletion of a full PWM cycle is indicated by the TMR2IF  
bit being set as the second PWM period begins.  
The Auto-Shutdown mode can be forced by writing a ‘1’  
to the ECCPASE bit.  
FIGURE 17-10:  
PWM AUTO-SHUTDOWN (PRSEN = 1, AUTO-RESTART ENABLED)  
PWM Period  
PWM Period  
PWM Period  
PWM Activity  
Dead Time  
Duty Cycle  
Dead Time  
Duty Cycle  
Dead Time  
Duty Cycle  
Shutdown Event  
ECCPASE bit  
FIGURE 17-11:  
PWM AUTO-SHUTDOWN (PRSEN = 0, AUTO-RESTART DISABLED)  
PWM Period  
PWM Period  
PWM Period  
PWM Activity  
Dead Time  
Duty Cycle  
Dead Time  
Duty Cycle  
Dead Time  
Duty Cycle  
Shutdown Event  
ECCPASE bit  
ECCPASE  
Cleared by Firmware  
DS39689F-page 164  
© 2009 Microchip Technology Inc.  
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17.4.9  
SETUP FOR PWM OPERATION  
17.4.10 OPERATION IN POWER-MANAGED  
MODES  
The following steps should be taken when configuring  
the ECCP module for PWM operation:  
In Sleep mode, all clock sources are disabled. Timer2  
will not increment and the state of the module will not  
change. If the ECCP pin is driving a value, it will continue  
to drive that value. When the device wakes up, it will  
continue from this state. If Two-Speed Start-ups are  
enabled, the initial start-up frequency from INTOSC and  
the postscaler may not be stable immediately.  
1. Configure the PWM pins, P1A and P1B (and  
P1C and P1D, if used), as inputs by setting the  
corresponding TRIS bits.  
2. Set the PWM period by loading the PR2 register.  
3. If auto-shutdown is required, do the following:  
• Disable auto-shutdown (ECCPASE = 0)  
In PRI_IDLE mode, the primary clock will continue to  
clock the ECCP module without change. In all other  
power-managed modes, the selected power-managed  
mode clock will clock Timer2. Other power-managed  
mode clocks will most likely be different than the  
primary clock frequency.  
• Configure source (FLT0, Comparator 1 or  
Comparator 2)  
• Wait for non-shutdown condition  
4. Configure the ECCP module for the desired  
PWM mode and configuration by loading the  
CCP1CON register with the appropriate values:  
17.4.10.1 Operation with Fail-Safe  
Clock Monitor  
• Select one of the available output  
configurations and direction with the P1M<1:0  
bits.  
If the Fail-Safe Clock Monitor is enabled, a clock failure  
will force the device into the power-managed RC_RUN  
mode and the OSCFIF bit (PIR2<7>) will be set. The  
ECCP will then be clocked from the internal oscillator  
clock source, which may have a different clock  
frequency than the primary clock.  
• Select the polarities of the PWM output  
signals with the CCP1M<3:0> bits.  
5. Set the PWM duty cycle by loading the CCPR1L  
register and CCP1CON<5:4> bits.  
6. For Half-Bridge Output mode, set the dead-  
band delay by loading ECCP1DEL<6:0> with  
the appropriate value.  
See the previous section for additional details.  
17.4.11 EFFECTS OF A RESET  
7. If auto-shutdown operation is required, load the  
ECCP1AS register:  
Both Power-on Reset and subsequent Resets will force  
all ports to Input mode and the CCP registers to their  
Reset states.  
• Select the auto-shutdown sources using the  
ECCPAS<2:0> bits.  
• Select the shutdown states of the PWM  
output pins using the PSSAC<1:0> and  
PSSBD<1:0> bits.  
This forces the Enhanced CCP module to reset to a  
state compatible with the standard CCP module.  
• Set the ECCPASE bit (ECCP1AS<7>).  
• Configure the comparators using the CMCON  
register.  
• Configure the comparator inputs as analog  
inputs.  
8. If auto-restart operation is required, set the  
PRSEN bit (ECCP1DEL<7>).  
9. Configure and start TMR2:  
• Clear the TMR2 interrupt flag bit by clearing  
the TMR2IF bit (PIR1<1>).  
• Set the TMR2 prescale value by loading the  
T2CKPS bits (T2CON<1:0>).  
• Enable Timer2 by setting the TMR2ON bit  
(T2CON<2>).  
10. Enable PWM outputs after a new PWM cycle  
has started:  
• Wait until TMRx overflows (TMRxIF bit is set).  
• Enable the CCP1/P1A, P1B, P1C and/or P1D  
pin outputs by clearing the respective TRIS  
bits.  
• Clear the ECCPASE bit (ECCP1AS<7>).  
© 2009 Microchip Technology Inc.  
DS39689F-page 165  
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TABLE 17-3: REGISTERS ASSOCIATED WITH ECCP1 MODULE AND TIMER1 TO TIMER3  
Reset  
Values  
on page  
Name  
Bit 7  
Bit 6  
Bit 5  
Bit 4  
Bit 3  
Bit 2  
Bit 1  
Bit 0  
INTCON  
RCON  
PIR1  
GIE/GIEH PEIE/GIEL  
TMR0IE  
INT0IE  
RI  
RBIE  
TO  
TMR0IF  
PD  
INT0IF  
POR  
RBIF  
55  
54  
58  
58  
58  
58  
58  
58  
58  
58  
58  
56  
56  
56  
56  
56  
56  
57  
57  
57  
57  
57  
57  
57  
57  
(1)  
IPEN  
SBOREN  
ADIF  
BOR  
(2)  
PSPIF  
PSPIE  
PSPIP  
RCIF  
RCIE  
RCIP  
TXIF  
TXIE  
TXIP  
EEIF  
EEIE  
EEIP  
SSPIF  
SSPIE  
SSPIP  
BCLIF  
BCLIE  
BCLIP  
CCP1IF  
CCP1IE  
CCP1IP  
HLVDIF  
HLVDIE  
HLVDIP  
TMR2IF  
TMR2IE  
TMR2IP  
TMR3IF  
TMR3IE  
TMR3IP  
TMR1IF  
TMR1IE  
TMR1IP  
CCP2IF  
CCP2IE  
CCP2IP  
(2)  
(2)  
PIE1  
ADIE  
IPR1  
ADIP  
PIR2  
OSCFIF  
OSCFIE  
OSCFIP  
CMIF  
CMIE  
CMIP  
PIE2  
IPR2  
TRISB  
TRISC  
PORTB Data Direction Register  
PORTC Data Direction Register  
PORTD Data Direction Register  
Timer1 Register Low Byte  
(2)  
TRISD  
TMR1L  
TMR1H  
T1CON  
TMR2  
Timer1 Register High Byte  
RD16  
Timer2 Register  
T2OUTPS3 T2OUTPS2 T2OUTPS1 T2OUTPS0 TMR2ON T2CKPS1 T2CKPS0  
T1RUN  
T1CKPS1 T1CKPS0 T1OSCEN T1SYNC TMR1CS TMR1ON  
T2CON  
PR2  
Timer2 Period Register  
Timer3 Register Low Byte  
Timer3 Register High Byte  
TMR3L  
TMR3H  
T3CON  
CCPR1L  
CCPR1H  
CCP1CON  
RD16  
T3CCP2  
T3CKPS1 T3CKPS0  
T3CCP1  
T3SYNC TMR3CS TMR3ON  
CCP1M2 CCP1M1 CCP1M0  
Capture/Compare/PWM Register 1 Low Byte  
Capture/Compare/PWM Register 1 High Byte  
(2)  
(2)  
P1M1  
P1M0  
DC1B1  
DC1B0  
CCP1M3  
PSSAC1  
(2)  
(2)  
ECCP1AS ECCPASE ECCPAS2 ECCPAS1 ECCPAS0  
PSSAC0 PSSBD1  
PSSBD0  
(2)  
(2)  
(2)  
(2)  
(2)  
(2)  
(2)  
ECCP1DEL  
PRSEN  
PDC6  
PDC5  
PDC4  
PDC3  
PDC2  
PDC1  
PDC0  
Legend: — = unimplemented, read as ‘0’. Shaded cells are not used during ECCP operation.  
Note 1: The SBOREN bit is only available when the BOREN<1:0> Configuration bits = 01; otherwise, it is disabled and  
reads as ‘0’. See Section 5.4 “Brown-out Reset (BOR)”.  
2: These registers and/or bits are unimplemented on 28-pin devices; always maintain these bits clear.  
DS39689F-page 166  
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18.3 SPI Mode  
18.0 MASTER SYNCHRONOUS  
SERIAL PORT (MSSP)  
MODULE  
The SPI mode allows 8 bits of data to be synchronously  
transmitted and received simultaneously. All four SPI  
modes are supported. To accomplish communication,  
typically three pins are used:  
18.1 Master SSP (MSSP) Module  
Overview  
• Serial Data Out (SDO) – SDO  
• Serial Data In (SDI) – SDI/SDA  
• Serial Clock (SCK) – SCK/SCL  
The Master Synchronous Serial Port (MSSP) module is  
a serial interface, useful for communicating with other  
peripheral or microcontroller devices. These peripheral  
devices may be serial EEPROMs, shift registers,  
display drivers, A/D converters, etc. The MSSP module  
can operate in one of two modes:  
Additionally, a fourth pin may be used when in a Slave  
mode of operation:  
• Slave Select (SS)  
Figure 18-1 shows the block diagram of the MSSP  
module when operating in SPI mode.  
• Serial Peripheral Interface (SPI)  
• Inter-Integrated Circuit (I2C™)  
- Full Master mode  
FIGURE 18-1:  
MSSP BLOCK DIAGRAM  
(SPI MODE)  
- Slave mode (with address masking for both  
10-bit and 7-bit addressing)  
The I2C interface supports the following modes in  
hardware:  
Internal  
Data Bus  
Read  
Write  
• Master mode  
• Multi-Master mode  
• Slave mode  
SSPBUF reg  
SSPSR reg  
SDI/SDA  
SDO  
18.2 Control Registers  
Shift  
Clock  
The MSSP module has three associated registers.  
These include a status register (SSPSTAT) and two  
control registers (SSPCON1 and SSPCON2). The use  
of these registers and their individual Configuration bits  
differ significantly depending on whether the MSSP  
module is operated in SPI or I2C mode.  
bit 0  
SS  
Control  
Enable  
SS  
Additional details are provided under the individual  
sections.  
Edge  
Select  
2
Clock Select  
SSPM<3:0>  
SMP:CKE  
2
4
TMR2 Output  
(
)
SCK/SCL  
2
Edge  
Select  
TOSC  
Prescaler  
4, 16, 64  
Data to TX/RX in SSPSR  
TRIS bit  
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DS39689F-page 167  
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SSPSR is the shift register used for shifting data in or  
out. SSPBUF is the buffer register to which data bytes  
are written to or read from.  
18.3.1  
REGISTERS  
The MSSP module has four registers for SPI mode  
operation. These are:  
In receive operations, SSPSR and SSPBUF together  
create a double-buffered receiver. When SSPSR  
receives a complete byte, it is transferred to SSPBUF  
and the SSPIF interrupt is set.  
• MSSP Control Register 1 (SSPCON1)  
• MSSP Status Register (SSPSTAT)  
• Serial Receive/Transmit Buffer Register  
(SSPBUF)  
During transmission, the SSPBUF is not double-  
buffered. A write to SSPBUF will write to both SSPBUF  
and SSPSR.  
• MSSP Shift Register (SSPSR) – Not directly  
accessible  
SSPCON1 and SSPSTAT are the control and status  
registers in SPI mode operation. The SSPCON1 register  
is readable and writable. The lower 6 bits of the  
SSPSTAT are read-only. The upper two bits of the  
SSPSTAT are read/write.  
REGISTER 18-1: SSPSTAT: MSSP STATUS REGISTER (SPI MODE)  
R/W-0  
SMP  
R/W-0  
CKE  
R-0  
D/A  
R-0  
P
R-0  
S
R-0  
R-0  
UA  
R-0  
BF  
R/W  
bit 7  
bit 0  
bit 7  
bit 6  
SMP: Sample bit  
SPI Master mode:  
1= Input data sampled at end of data output time  
0= Input data sampled at middle of data output time  
SPI Slave mode:  
SMP must be cleared when SPI is used in Slave mode.  
CKE: SPI Clock Select bit  
1= Transmit occurs on transition from active to Idle clock state  
0= Transmit occurs on transition from Idle to active clock state  
Note:  
Polarity of clock state is set by the CKP bit (SSPCON1<4>).  
bit 5  
bit 4  
D/A: Data/Address bit  
Used in I2C™ mode only.  
P: Stop bit  
Used in I2C mode only. This bit is cleared when the MSSP module is disabled, SSPEN is  
cleared.  
bit 3  
bit 2  
bit 1  
bit 0  
S: Start bit  
Used in I2C mode only.  
R/W: Read/Write Information bit  
Used in I2C mode only.  
UA: Update Address bit  
Used in I2C mode only.  
BF: Buffer Full Status bit (Receive mode only)  
1= Receive complete, SSPBUF is full  
0= Receive not complete, SSPBUF is empty  
Legend:  
R = Readable bit  
-n = Value at POR  
W = Writable bit  
‘1’ = Bit is set  
U = Unimplemented bit, read as ‘0’  
‘0’ = Bit is cleared x = Bit is unknown  
DS39689F-page 168  
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REGISTER 18-2: SSPCON1: MSSP CONTROL REGISTER 1 (SPI MODE)  
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0  
WCOL SSPOV SSPEN CKP SSPM3 SSPM2  
bit 7  
R/W-0  
R/W-0  
SSPM1  
SSPM0  
bit 0  
bit 7  
WCOL: Write Collision Detect bit (Transmit mode only)  
1= The SSPBUF register is written while it is still transmitting the previous word  
(must be cleared in software)  
0= No collision  
bit 6  
SSPOV: Receive Overflow Indicator bit  
SPI Slave mode:  
1= A new byte is received while the SSPBUF register is still holding the previous data. In case  
of overflow, the data in SSPSR is lost. Overflow can only occur in Slave mode. The user  
must read the SSPBUF, even if only transmitting data, to avoid setting overflow (must be  
cleared in software).  
0= No overflow  
Note:  
In Master mode, the overflow bit is not set since each new reception (and  
transmission) is initiated by writing to the SSPBUF register.  
bit 5  
bit 4  
SSPEN: Synchronous Serial Port Enable bit  
1= Enables serial port and configures SCK, SDO, SDI and SS as serial port pins  
0= Disables serial port and configures these pins as I/O port pins  
Note:  
When enabled, these pins must be properly configured as input or output.  
CKP: Clock Polarity Select bit  
1= Idle state for clock is a high level  
0= Idle state for clock is a low level  
bit 3-0 SSPM<3:0>: Synchronous Serial Port Mode Select bits  
0101= SPI Slave mode, clock = SCK pin, SS pin control disabled, SS can be used as I/O pin  
0100= SPI Slave mode, clock = SCK pin, SS pin control enabled  
0011= SPI Master mode, clock = TMR2 output/2  
0010= SPI Master mode, clock = FOSC/64  
0001= SPI Master mode, clock = FOSC/16  
0000= SPI Master mode, clock = FOSC/4  
Note:  
Bit combinations not specifically listed here are either reserved or implemented in  
I2C™ mode only.  
Legend:  
R = Readable bit  
-n = Value at POR  
W = Writable bit  
‘1’ = Bit is set  
U = Unimplemented bit, read as ‘0’  
‘0’ = Bit is cleared x = Bit is unknown  
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(SSPCON1<7>), will be set. User software must clear  
the WCOL bit so that it can be determined if the following  
write(s) to the SSPBUF register completed successfully.  
18.3.2  
OPERATION  
When initializing the SPI, several options need to be  
specified. This is done by programming the appropriate  
control bits (SSPCON1<5:0> and SSPSTAT<7:6>).  
These control bits allow the following to be specified:  
When the application software is expecting to receive  
valid data, the SSPBUF should be read before the next  
byte of data to transfer is written to the SSPBUF. The  
Buffer Full bit, BF (SSPSTAT<0>), indicates when  
SSPBUF has been loaded with the received data  
(transmission is complete). When the SSPBUF is read,  
the BF bit is cleared. This data may be irrelevant if the  
SPI is only a transmitter. Generally, the MSSP interrupt  
is used to determine when the transmission/reception  
has completed. The SSPBUF must be read and/or  
written. If the interrupt method is not going to be used,  
then software polling can be done to ensure that a write  
collision does not occur. Example 18-1 shows the  
loading of the SSPBUF (SSPSR) for data transmission.  
• Master mode (SCK is the clock output)  
• Slave mode (SCK is the clock input)  
• Clock Polarity (Idle state of SCK)  
• Data Input Sample Phase (middle or end of data  
output time)  
• Clock Edge (output data on rising/falling edge  
of SCK)  
• Clock Rate (Master mode only)  
• Slave Select mode (Slave mode only)  
The MSSP consists of a transmit/receive shift register  
(SSPSR) and a buffer register (SSPBUF). The SSPSR  
shifts the data in and out of the device, MSb first. The  
SSPBUF holds the data that was written to the SSPSR  
until the received data is ready. Once the 8 bits of data  
have been received, that byte is moved to the SSPBUF  
register. Then, the Buffer Full detect bit, BF  
(SSPSTAT<0>), and the interrupt flag bit, SSPIF, are  
set. This double-buffering of the received data  
(SSPBUF) allows the next byte to start reception before  
reading the data that was just received. Any write to the  
SSPBUF register during transmission/reception of data  
will be ignored and the write collision detect bit, WCOL  
The SSPSR is not directly readable or writable and can  
only be accessed by addressing the SSPBUF register.  
Additionally, the MSSP Status register (SSPSTAT)  
indicates the various status conditions.  
Note:  
To avoid lost data in Master mode, a read of  
the SSPBUF must be performed to clear the  
Buffer Full (BF) detect bit (SSPSTAT<0>)  
between each transmission.  
Note:  
The SSPBUF register cannot be used with  
read-modify-write instructions, such as  
BCF, BTFSCand COMF, etc.  
EXAMPLE 18-1:  
LOADING THE SSPBUF (SSPSR) REGISTER  
LOOP  
BTFSS  
BRA  
SSPSTAT, BF  
LOOP  
;Has data been received (transmit complete)?  
;No  
MOVF  
SSPBUF, W  
;WREG reg = contents of SSPBUF  
MOVWF  
RXDATA  
;Save in user RAM, if data is meaningful  
MOVF  
MOVWF  
TXDATA, W  
SSPBUF  
;W reg = contents of TXDATA  
;New data to xmit  
DS39689F-page 170  
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Any serial port function that is not desired may be  
overridden by programming the corresponding data  
direction (TRIS) register to the opposite value.  
18.3.3  
ENABLING SPI I/O  
To enable the serial port, MSSP Enable bit, SSPEN  
(SSPCON1<5>), must be set. To reset or reconfigure  
SPI mode, clear the SSPEN bit, reinitialize the  
SSPCON registers and then set the SSPEN bit. This  
configures the SDI, SDO, SCK and SS pins as serial  
port pins. For the pins to behave as the serial port  
function, some must have their data direction bits (in  
the TRIS register) appropriately programmed as  
follows:  
18.3.4  
TYPICAL CONNECTION  
Figure 18-2 shows a typical connection between two  
microcontrollers. The master controller (Processor 1)  
initiates the data transfer by sending the SCK signal.  
Data is shifted out of both shift registers on their pro-  
grammed clock edge and latched on the opposite edge  
of the clock. Both processors should be programmed to  
the same Clock Polarity (CKP), then both controllers  
would send and receive data at the same time.  
Whether the data is meaningful (or dummy data)  
depends on the application software. This leads to  
three scenarios for data transmission:  
• SDI is automatically controlled by the SPI module  
• SDO must have TRISC<5> bit cleared  
• SCK (Master mode) must have TRISC<3> bit  
cleared  
• SCK (Slave mode) must have TRISC<3> bit set  
• SS must have TRISA<5> bit set  
• Master sends data – Slave sends dummy data  
• Master sends data – Slave sends data  
• Master sends dummy data – Slave sends data  
FIGURE 18-2:  
SPI MASTER/SLAVE CONNECTION  
SPI Master SSPM<3:0> = 00xxb  
SPI Slave SSPM<3:0> = 010xb  
SDO  
SDI  
Serial Input Buffer  
(SSPBUF)  
Serial Input Buffer  
(SSPBUF)  
SDI  
SDO  
Shift Register  
(SSPSR)  
Shift Register  
(SSPSR)  
LSb  
MSb  
MSb  
LSb  
Serial Clock  
SCK  
SCK  
PROCESSOR 1  
PROCESSOR 2  
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The clock polarity is selected by appropriately  
programming the CKP bit (SSPCON1<4>). This then,  
would give waveforms for SPI communication as  
shown in Figure 18-3, Figure 18-5 and Figure 18-6,  
where the MSB is transmitted first. In Master mode, the  
SPI clock rate (bit rate) is user-programmable to be one  
of the following:  
18.3.5  
MASTER MODE  
The master can initiate the data transfer at any time  
because it controls the SCK. The master determines  
when the slave (Processor 2, Figure 18-2) is to  
broadcast data by the software protocol.  
In Master mode, the data is transmitted/received as  
soon as the SSPBUF register is written to. If the SPI  
operation is only going to receive, the SDO output  
could be disabled (programmed as an input). The  
SSPSR register will continue to shift in the signal pres-  
ent on the SDI pin at the programmed clock rate. As  
each byte is received, it will be loaded into the SSPBUF  
register as if a normal received byte (interrupts and sta-  
tus bits appropriately set). This could be useful in  
receiver applications as a “Line Activity Monitor” mode.  
• FOSC/4 (or TCY)  
• FOSC/16 (or 4 • TCY)  
• FOSC/64 (or 16 • TCY)  
• Timer2 output/2  
This allows a maximum data rate (at 40 MHz) of  
10.00 Mbps.  
Figure 18-3 shows the waveforms for Master mode.  
When the CKE bit is set, the SDO data is valid before  
there is a clock edge on SCK. The change of the input  
sample is shown based on the state of the SMP bit. The  
time when the SSPBUF is loaded with the received  
data is shown.  
FIGURE 18-3:  
SPI MODE WAVEFORM (MASTER MODE)  
Write to  
SSPBUF  
SCK  
(CKP = 0  
CKE = 0)  
SCK  
(CKP = 1  
CKE = 0)  
4 Clock  
Modes  
SCK  
(CKP = 0  
CKE = 1)  
SCK  
(CKP = 1  
CKE = 1)  
bit 6  
bit 6  
bit 2  
bit 2  
bit 5  
bit 5  
bit 4  
bit 4  
bit 1  
bit 1  
bit 0  
bit 0  
SDO  
(CKE = 0)  
bit 7  
bit 7  
bit 3  
bit 3  
SDO  
(CKE = 1)  
SDI  
(SMP = 0)  
bit 0  
bit 7  
Input  
Sample  
(SMP = 0)  
SDI  
(SMP = 1)  
bit 0  
bit 7  
Input  
Sample  
(SMP = 1)  
SSPIF  
Next Q4 Cycle  
after Q2↓  
SSPSR to  
SSPBUF  
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SDO pin is driven. When the SS pin goes high, the SDO  
pin is no longer driven, even if in the middle of a  
transmitted byte and becomes a floating output. External  
pull-up/pull-down resistors may be desirable depending  
on the application.  
18.3.6  
SLAVE MODE  
In Slave mode, the data is transmitted and received as  
the external clock pulses appear on SCK. When the  
last bit is latched, the SSPIF interrupt flag bit is set.  
Before enabling the module in SPI Slave mode, the  
clock line must match the proper Idle state. The clock  
line can be observed by reading the SCK pin. The Idle  
state is determined by the CKP bit (SSPCON1<4>).  
Note 1: When the SPI interface is in Slave mode  
with  
SS  
pin  
control  
enabled  
(SSPCON1<3:0> = 0100), the SPI module  
will reset if the SS pin is set to VDD.  
While in Slave mode, the external clock is supplied by  
the external clock source on the SCK pin. This external  
clock must meet the minimum high and low times as  
specified in the electrical specifications.  
2: If the SPI interface is used in Slave mode  
with CKE set, then the SS pin control  
must be enabled.  
When the SPI module resets, the bit counter is forced  
to ‘0’. This can be done by either forcing the SS pin to  
a high level or clearing the SSPEN bit.  
While in Sleep mode, the slave can transmit/receive  
data. When a byte is received, the device will wake-up  
from Sleep.  
To emulate two-wire communication, the SDO pin can  
be connected to the SDI pin. When the SPI needs to  
operate as a receiver, the SDO pin can be configured  
as an input. This disables transmissions from the SDO.  
The SDI can always be left as an input (SDI function)  
since it cannot create a bus conflict.  
18.3.7  
SLAVE SELECT  
SYNCHRONIZATION  
The SS pin allows a Synchronous Slave mode. The SPI  
operation must be in Slave mode with the SS pin control  
enabled (SSPCON1<3:0> = 04h). When the SS pin is  
low, transmission and reception are enabled and the  
FIGURE 18-4:  
SLAVE SYNCHRONIZATION WAVEFORM  
SS  
SCK  
(CKP = 0  
CKE = 0)  
SCK  
(CKP = 1  
CKE = 0)  
Write to  
SSPBUF  
bit 6  
bit 7  
bit 7  
bit 0  
SDO  
bit 7  
SDI  
(SMP = 0)  
bit 0  
bit 7  
Input  
Sample  
(SMP = 0)  
SSPIF  
Interrupt  
Flag  
Next Q4 Cycle  
after Q2↓  
SSPSR to  
SSPBUF  
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FIGURE 18-5:  
SPI MODE WAVEFORM (SLAVE MODE WITH CKE = 0)  
SS  
Optional  
SCK  
(CKP = 0  
CKE = 0)  
SCK  
(CKP = 1  
CKE = 0)  
Write to  
SSPBUF  
bit 6  
bit 2  
bit 5  
bit 4  
bit 3  
bit 1  
bit 0  
SDO  
bit 7  
SDI  
(SMP = 0)  
bit 0  
bit 7  
Input  
Sample  
(SMP = 0)  
SSPIF  
Interrupt  
Flag  
Next Q4 Cycle  
after Q2↓  
SSPSR to  
SSPBUF  
FIGURE 18-6:  
SPI MODE WAVEFORM (SLAVE MODE WITH CKE = 1)  
SS  
Not Optional  
SCK  
(CKP = 0  
CKE = 1)  
SCK  
(CKP = 1  
CKE = 1)  
Write to  
SSPBUF  
bit 6  
bit 3  
bit 2  
bit 5  
bit 4  
bit 1  
bit 0  
SDO  
bit 7  
SDI  
(SMP = 0)  
bit 0  
bit 7  
Input  
Sample  
(SMP = 0)  
SSPIF  
Interrupt  
Flag  
Next Q4 Cycle  
after Q2↓  
SSPSR to  
SSPBUF  
DS39689F-page 174  
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18.3.8  
OPERATION IN POWER-MANAGED  
MODES  
18.3.9  
EFFECTS OF A RESET  
A Reset disables the MSSP module and terminates the  
current transfer.  
In SPI Master mode, module clocks may be operating  
at a different speed than when in full power mode. In  
the case of Sleep mode, all clocks are halted.  
18.3.10 BUS MODE COMPATIBILITY  
Table 18-1 shows the compatibility between the  
standard SPI modes and the states of the CKP and  
CKE control bits.  
In Idle modes, a clock is provided to the peripherals.  
That clock should be from the primary clock source, the  
secondary clock (Timer1 oscillator at 32.768 kHz) or  
the INTOSC source. See Section 3.7 “Clock Sources  
and Oscillator Switching” for additional information.  
TABLE 18-1: SPI BUS MODES  
Control Bits State  
Standard SPI Mode  
In most cases, the speed that the master clocks SPI  
data is not important; however, this should be  
evaluated for each system.  
Terminology  
CKP  
CKE  
0, 0  
0, 1  
1, 0  
1, 1  
0
0
1
1
1
0
1
0
If MSSP interrupts are enabled, they can wake the  
controller from Sleep mode, or one of the Idle modes,  
when the master completes sending data. If an exit  
from Sleep or Idle mode is not desired, MSSP  
interrupts should be disabled.  
There is also an SMP bit which controls when the data  
is sampled.  
If the Sleep mode is selected, all module clocks are  
halted and the transmission/reception will remain in  
that state until the devices wakes. After the device  
returns to Run mode, the module will resume  
transmitting and receiving data.  
In SPI Slave mode, the SPI Transmit/Receive Shift  
register operates asynchronously to the device. This  
allows the device to be placed in any power-managed  
mode and data to be shifted into the SPI Transmit/  
Receive Shift register. When all 8 bits have been  
received, the MSSP interrupt flag bit will be set and if  
enabled, will wake the device.  
TABLE 18-2: REGISTERS ASSOCIATED WITH SPI OPERATION  
Reset  
Values  
on page  
Name  
Bit 7  
Bit 6  
Bit 5  
Bit 4  
Bit 3  
Bit 2  
Bit 1  
Bit 0  
INTCON  
PIR1  
GIE/GIEH PEIE/GIEL TMR0IE  
INT0IE  
TXIF  
RBIE  
SSPIF  
SSPIE  
SSPIP  
TMR0IF  
CCP1IF  
CCP1IE  
CCP1IP  
INT0IF  
RBIF  
55  
58  
58  
58  
58  
58  
56  
56  
56  
PSPIF(1)  
PSPIE(1)  
PSPIP(1)  
ADIF  
ADIE  
ADIP  
RCIF  
RCIE  
RCIP  
TMR2IF  
TMR1IF  
PIE1  
TXIE  
TMR2IE TMR1IE  
TMR2IP TMR1IP  
IPR1  
TXIP  
TRISA  
TRISA7(2) TRISA6(2) PORTA Data Direction Control Register  
TRISC  
SSPBUF  
SSPCON1  
SSPSTAT  
PORTC Data Direction Control Register  
MSSP Receive Buffer/Transmit Register  
WCOL  
SMP  
SSPOV  
CKE  
SSPEN  
D/A  
CKP  
P
SSPM3  
S
SSPM2  
R/W  
SSPM1  
UA  
SSPM0  
BF  
Legend: Shaded cells are not used by the MSSP in SPI mode.  
Note 1: These bits are unimplemented on 28-pin devices and read as ‘0’.  
2: PORTA<7:6> and their direction bits are individually configured as port pins based on various primary  
oscillator modes. When disabled, these bits read as ‘0’.  
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2
18.4.1  
REGISTERS  
18.4 I C Mode  
The MSSP module has six registers for I2C operation.  
These are:  
The MSSP module in I2C mode fully implements all  
master and slave functions (including general call  
support) and provides interrupts on Start and Stop bits  
in hardware to determine a free bus (multi-master  
function). The MSSP module implements the standard  
mode specifications, as well as 7-bit and 10-bit  
addressing.  
• MSSP Control Register 1 (SSPCON1)  
• MSSP Control Register 2 (SSPCON2)  
• MSSP Status Register (SSPSTAT)  
• Serial Receive/Transmit Buffer Register  
(SSPBUF)  
Two pins are used for data transfer:  
• MSSP Shift Register (SSPSR) – Not directly  
accessible  
• Serial clock (SCL) – RC3/SCK/SCL  
• Serial data (SDA) – RC4/SDI/SDA  
• MSSP Address Register (SSPADD)  
The user must configure these pins as inputs or outputs  
through the TRISC<4:3> bits.  
SSPCON1, SSPCON2 and SSPSTAT are the control  
and status registers in I2C mode operation. The  
SSPCON1 and SSPCON2 registers are readable and  
writable. The lower 6 bits of the SSPSTAT are read-only.  
The upper two bits of the SSPSTAT are read/write.  
FIGURE 18-7:  
MSSP BLOCK DIAGRAM  
(I2C™ MODE)  
SSPSR is the shift register used for shifting data in or  
out. SSPBUF is the buffer register to which data bytes  
are written to or read from.  
Internal  
Data Bus  
Read  
Write  
SSPADD register holds the slave device address when  
the MSSP is configured in I2C Slave mode. When the  
MSSP is configured in Master mode, the lower seven  
bits of SSPADD act as the Baud Rate Generator reload  
value.  
SSPBUF reg  
RC3/SCK/SCL  
Shift  
Clock  
In receive operations, SSPSR and SSPBUF together  
create a double-buffered receiver. When SSPSR  
receives a complete byte, it is transferred to SSPBUF  
and the SSPIF interrupt is set.  
SSPSR reg  
RC4/SDI/  
SDA  
MSb  
LSb  
Match Detect  
Addr Match  
During transmission, the SSPBUF is not double-  
buffered. A write to SSPBUF will write to both SSPBUF  
and SSPSR.  
SSPADD reg  
Start and  
Set, Reset  
S, P bits  
(SSPSTAT reg)  
Stop bit Detect  
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REGISTER 18-3: SSPSTAT: MSSP STATUS REGISTER (I2C™ MODE)  
R/W-0 R/W-0 R-0 R-0 R-0  
SMP CKE D/A  
bit 7  
R-0  
R-0  
UA  
R-0  
BF  
P
S
R/W  
bit 0  
bit 7  
SMP: Slew Rate Control bit  
In Master or Slave mode:  
1= Slew rate control disabled for Standard Speed mode (100 kHz and 1 MHz)  
0= Slew rate control enabled for High-Speed mode (400 kHz)  
bit 6  
bit 5  
CKE: SMBus Select bit  
In Master or Slave mode:  
1= Enable SMBus specific inputs  
0= Disable SMBus specific inputs  
D/A: Data/Address bit  
In Master mode:  
Reserved.  
In Slave mode:  
1= Indicates that the last byte received or transmitted was data  
0= Indicates that the last byte received or transmitted was address  
bit 4  
bit 3  
bit 2  
P: Stop bit  
1= Indicates that a Stop bit has been detected last  
0= Stop bit was not detected last  
Note:  
This bit is cleared on Reset and when SSPEN is cleared.  
S: Start bit  
1= Indicates that a Start bit has been detected last  
0= Start bit was not detected last  
Note:  
This bit is cleared on Reset and when SSPEN is cleared.  
R/W: Read/Write Information bit (I2C™ mode only)  
In Slave mode:  
1= Read  
0= Write  
Note:  
This bit holds the R/W bit information following the last address match. This bit is  
only valid from the address match to the next Start bit, Stop bit or not ACK bit.  
In Master mode:  
1= Transmit is in progress  
0= Transmit is not in progress  
Note:  
ORing this bit with SEN, RSEN, PEN, RCEN or ACKEN will indicate if the MSSP is  
in Active mode.  
bit 1  
bit 0  
UA: Update Address bit (10-bit Slave mode only)  
1= Indicates that the user needs to update the address in the SSPADD register  
0= Address does not need to be updated  
BF: Buffer Full Status bit  
In Transmit mode:  
1= SSPBUF is full  
0= SSPBUF is empty  
In Receive mode:  
1= SSPBUF is full (does not include the ACK and Stop bits)  
0= SSPBUF is empty (does not include the ACK and Stop bits)  
Legend:  
R = Readable bit  
-n = Value at POR  
W = Writable bit  
‘1’ = Bit is set  
U = Unimplemented bit, read as ‘0’  
‘0’ = Bit is cleared x = Bit is unknown  
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REGISTER 18-4: SSPCON1: MSSP CONTROL REGISTER 1 (I2C™ MODE)  
R/W-0  
WCOL  
R/W-0  
R/W-0  
R/W-0  
CKP  
R/W-0  
R/W-0  
R/W-0  
R/W-0  
SSPOV  
SSPEN  
SSPM3  
SSPM2  
SSPM1  
SSPM0  
bit 7  
bit 0  
bit 7  
WCOL: Write Collision Detect bit  
In Master Transmit mode:  
1= A write to the SSPBUF register was attempted while the I2C™ conditions were not valid for  
a transmission to be started (must be cleared in software)  
0= No collision  
In Slave Transmit mode:  
1= The SSPBUF register is written while it is still transmitting the previous word (must be  
cleared in software)  
0= No collision  
In Receive mode (Master or Slave modes):  
This is a “don’t care” bit.  
bit 6  
SSPOV: Receive Overflow Indicator bit  
In Receive mode:  
1= A byte is received while the SSPBUF register is still holding the previous byte (must be  
cleared in software)  
0= No overflow  
In Transmit mode:  
This is a “don’t care” bit in Transmit mode.  
bit 5  
bit 4  
SSPEN: Master Synchronous Serial Port Enable bit  
1= Enables the serial port and configures the SDA and SCL pins as the serial port pins  
0= Disables serial port and configures these pins as I/O port pins  
Note:  
When enabled, the SDA and SCL pins must be properly configured as inputs.  
CKP: SCK Release Control bit  
In Slave mode:  
1= Release clock  
0= Holds clock low (clock stretch), used to ensure data setup time  
In Master mode:  
Unused in this mode.  
bit 3-0 SSPM<3:0>: Master Synchronous Serial Port Mode Select bits  
1111= I2C Slave mode, 10-bit address with Start and Stop bit interrupts enabled  
1110= I2C Slave mode, 7-bit address with Start and Stop bit interrupts enabled  
1011= I2C Firmware Controlled Master mode (slave Idle)  
1000= I2C Master mode, clock = FOSC/(4 * (SSPADD + 1))  
0111= I2C Slave mode, 10-bit address  
0110= I2C Slave mode, 7-bit address  
Bit combinations not specifically listed here are either reserved or implemented in SPI mode only.  
Legend:  
R = Readable bit  
-n = Value at POR  
W = Writable bit  
‘1’ = Bit is set  
U = Unimplemented bit, read as ‘0’  
‘0’ = Bit is cleared x = Bit is unknown  
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REGISTER 18-5: SSPCON2: MSSP CONTROL REGISTER 2 (I2C™ MODE)  
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0  
GCEN ACKSTAT  
ACKDT/ ACKEN(1) RCEN(1) PEN(1)  
R/W-0  
RSEN(1)  
/
R/W-0  
SEN(1)  
/
/
/
ADMSK5 ADMSK4 ADMSK3 ADMSK2 ADMSK1  
bit 7  
bit 0  
bit 7  
bit 6  
bit 5  
GCEN: General Call Enable bit (Slave mode only)  
1= Enable interrupt when a general call address (0000h) is received in the SSPSR  
0= General call address disabled  
ACKSTAT: Acknowledge Status bit (Master Transmit mode only)  
1= Acknowledge was not received from slave  
0= Acknowledge was received from slave  
ACKDT/ADMSK5: Acknowledge Data bit  
In Master Receive mode:  
1= Not Acknowledge  
0= Acknowledge  
Note:  
Value that will be transmitted when the user initiates an Acknowledge sequence at  
the end of a receive.  
In Slave mode:  
1= Address masking of ADD5 enabled  
0= Address masking of ADD5 disabled  
bit 4  
ACKEN/ADMSK4: Acknowledge Sequence Enable bit  
In Master Receive mode:(1)  
1= Initiate Acknowledge sequence on SDA and SCL pins and transmit ACKDT data bit.  
Automatically cleared by hardware.  
0= Acknowledge sequence Idle  
In Slave mode:  
1= Address masking of ADD4 enabled  
0= Address masking of ADD4 disabled  
bit 3  
RCEN/ADMSK3: Receive Enable bit  
In Master Receive mode:(1)  
1= Enables Receive mode for I2C  
0= Receive Idle  
In Slave mode:  
1= Address masking of ADD3 enabled  
0= Address masking of ADD3 disabled  
bit 2  
PEN/ADMSK2: Stop Condition Enable bit  
In Master mode:(1)  
1= Initiate Stop condition on SDA and SCL pins. Automatically cleared by hardware.  
0= Stop condition Idle  
In Slave mode:  
1= Address masking of ADD2 enabled  
0= Address masking of ADD2 disabled  
bit 1  
RSEN/ADMSK1: Repeated Start Condition Enable bit  
In Master mode:(1)  
1= Initiate Repeated Start condition on SDA and SCL pins. Automatically cleared by hardware.  
0= Repeated Start condition Idle  
In Slave mode (7-Bit Addressing mode):  
1= Address masking of ADD1 enabled  
0= Address masking of ADD1 disabled  
In Slave mode (10-Bit Addressing mode):  
1= Address masking of ADD1 and ADD0 enabled  
0= Address masking of ADD1 and ADD0 disabled  
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REGISTER 18-5: SSPCON2: MSSP CONTROL REGISTER 2 (I2C™ MODE) – CONTINUED  
R/W-0  
GCEN  
R/W-0  
R/W-0  
ACKDT/ ACKEN(1)  
R/W-0  
R/W-0  
RCEN(1)  
R/W-0  
PEN(1)  
R/W-0  
RSEN(1)  
/
R/W-0  
SEN(1)  
ACKSTAT  
/
/
/
ADMSK5 ADMSK4 ADMSK3 ADMSK2 ADMSK1  
bit 7  
bit 0  
bit 0  
SEN: Start Condition Enable/Stretch Enable bit(1)  
In Master mode:  
1= Initiate Start condition on SDA and SCL pins. Automatically cleared by hardware.  
0= Start condition Idle  
In Slave mode:  
1= Clock stretching is enabled for both slave transmit and slave receive (stretch enabled)  
0= Clock stretching is disabled  
Note 1: For bits ACKEN, RCEN, PEN, RSEN, SEN: If the I2C module is active, these bits  
may not be set (no spooling) and the SSPBUF may not be written (or writes to the  
SSPBUF are disabled).  
Legend:  
R = Readable bit  
-n = Value at POR  
W = Writable bit  
‘1’ = Bit is set  
U = Unimplemented bit, read as ‘0’  
‘0’ = Bit is cleared x = Bit is unknown  
REGISTER 18-6: SSPADD: MSSP ADDRESS REGISTER(1)  
R/W-0  
ADD7  
R/W-0  
ADD6  
R/W-0  
ADD5  
R/W-0  
ADD4  
R/W-0  
ADD3  
R/W-0  
ADD2  
R/W-0  
ADD1  
R/W-0  
ADD0  
bit 7  
bit 0  
bit 7-0 ADD<7:0>: MSSP Address bits  
Note 1: MSSP Address register in I2C Slave mode. MSSP Baud Rate register in I2C Master  
mode.  
Legend:  
R = Readable bit  
-n = Value at POR  
W = Writable bit  
‘1’ = Bit is set  
U = Unimplemented bit, read as ‘0’  
‘0’ = Bit is cleared x = Bit is unknown  
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18.4.2  
OPERATION  
18.4.3.1  
Addressing  
The MSSP module functions are enabled by setting  
MSSP Enable bit, SSPEN (SSPCON1<5>).  
The SSPCON1 register allows control of the I2C  
operation. Four mode selection bits (SSPCON1<3:0>)  
allow one of the following I2C modes to be selected:  
• I2C Master mode clock  
• I2C Slave mode (7-bit address)  
• I2C Slave mode (10-bit address)  
Once the MSSP module has been enabled, it waits for  
a Start condition to occur. Following the Start condition,  
the 8 bits are shifted into the SSPSR register. All incom-  
ing bits are sampled with the rising edge of the clock  
(SCL) line. The value of register SSPSR<7:1> is  
compared to the value of the SSPADD register. The  
address is compared on the falling edge of the eighth  
clock (SCL) pulse. If the addresses match and the BF  
and SSPOV bits are clear, the following events occur:  
• I2C Slave mode (7-bit address) with Start and  
Stop bit interrupts enabled  
• I2C Slave mode (10-bit address) with Start and  
Stop bit interrupts enabled  
1. The SSPSR register value is loaded into the  
SSPBUF register.  
2. The Buffer Full bit, BF, is set.  
3. An ACK pulse is generated.  
• I2C Firmware Controlled Master mode, slave is Idle  
4. MSSP Interrupt Flag bit, SSPIF (PIR1<3>), is  
set (interrupt is generated, if enabled) on the  
falling edge of the ninth SCL pulse.  
Selection of any I2C mode with the SSPEN bit set,  
forces the SCL and SDA pins to be open-drain,  
provided these pins are programmed to inputs by  
setting the appropriate TRISC bits. To ensure proper  
operation of the module, pull-up resistors must be  
provided externally to the SCL and SDA pins.  
In 10-Bit Addressing mode, two address bytes need to  
be received by the slave. The five Most Significant bits  
(MSbs) of the first address byte specify if this is a 10-bit  
address. Bit R/W (SSPSTAT<2>) must specify a write so  
the slave device will receive the second address byte.  
For a 10-bit address, the first byte would equal ‘11110  
A9 A8 0’, where ‘A9’ and ‘A8’ are the two MSbs of the  
address. The sequence of events for 10-bit address is as  
follows, with steps 7 through 9 for the slave-transmitter:  
18.4.3  
SLAVE MODE  
In Slave mode, the SCL and SDA pins must be config-  
ured as inputs (TRISC<4:3> set). The MSSP module  
will override the input state with the output data when  
required (slave-transmitter).  
The I2C Slave mode hardware will always generate an  
interrupt on an address match. Address masking will  
allow the hardware to generate an interrupt for more  
than one address (up to 31 in 7-Bit Addressing mode  
and up to 63 in 10-Bit Addressing mode). Through the  
mode select bits, the user can also choose to interrupt  
on Start and Stop bits  
1. Receive first (high) byte of address (bits SSPIF,  
BF and UA (SSPSTAT<1>) are set).  
2. Update the SSPADD register with second (low)  
byte of address (clears bit UA and releases the  
SCL line).  
3. Read the SSPBUF register (clears bit BF) and  
clear flag bit, SSPIF.  
4. Receive second (low) byte of address (bits  
SSPIF, BF and UA are set).  
When an address is matched, or the data transfer after  
an address match is received, the hardware auto-  
matically will generate the Acknowledge (ACK) pulse  
and load the SSPBUF register with the received value  
currently in the SSPSR register.  
5. Update the SSPADD register with the first (high)  
byte of address. If match releases SCL line, this  
will clear bit UA.  
6. Read the SSPBUF register (clears bit BF) and  
clear flag bit, SSPIF.  
Any combination of the following conditions will cause  
the MSSP module not to give this ACK pulse:  
7. Receive Repeated Start condition.  
• The Buffer Full bit, BF (SSPSTAT<0>), was set  
before the transfer was received.  
8. Receive first (high) byte of address (bits SSPIF  
and BF are set).  
• The overflow bit, SSPOV (SSPCON1<6>), was  
set before the transfer was received.  
9. Read the SSPBUF register (clears bit BF) and  
clear flag bit, SSPIF.  
In this case, the SSPSR register value is not loaded  
into the SSPBUF, but bit SSPIF (PIR1<3>) is set. The  
BF bit is cleared by reading the SSPBUF register, while  
bit SSPOV is cleared through software.  
The SCL clock input must have a minimum high and  
low for proper operation. The high and low times of the  
I2C specification, as well as the requirement of the  
MSSP module, are shown in timing parameter 100 and  
parameter 101.  
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• 10-Bit Addressing mode  
18.4.3.2  
Address Masking  
Address mask bits, ADMSK<5:2>, mask the  
corresponding address bits in the SSPADD register. In  
addition, ADMSK<1> simultaneously masks the two  
LSBs of the address, ADD<1:0>. For any ADMSK bits  
that are active (ADMSK<n> = 1), the corresponding  
address bit is ignored (ADD<n> = x). Also note that  
although in 10-Bit Addressing mode, the upper address  
bits reuse part of the SSPADD register bits, the address  
mask bits do not interact with those bits. They only  
affect the lower address bits.  
Masking an address bit causes that bit to become a  
“don’t care”. When one address bit is masked, two  
addresses will be Acknowledged and cause an inter-  
rupt. It is possible to mask more than one address bit at  
a time, which makes it possible to Acknowledge up to  
31 addresses in 7-Bit Addressing mode and up to  
63 addresses in 10-Bit Addressing mode (see  
Example 18-2).  
The I2C slave behaves the same way whether address  
masking is used or not. However, when address mask-  
ing is used, the I2C slave can Acknowledge multiple  
addresses and cause interrupts. When this occurs, it is  
necessary to determine which address caused the  
interrupt by checking the SSPBUF register.  
Note 1: ADMSK<1> masks the two Least  
Significant bits of the address.  
2: The two Most Significant bits of the  
address are not affected by address  
masking.  
• 7-Bit Addressing mode  
Address mask bits, ADMSK<5:1>, mask the corre-  
sponding address bits in the SSPADD register. For any  
ADMSK bits that are active (ADMSK<n> = 1), the  
corresponding address bit is ignored (ADD<n> = x). For  
the module to issue an address Acknowledge, it is  
sufficient to match only on addresses that do not have an  
active address mask.  
EXAMPLE 18-2:  
ADDRESS MASKING  
7-Bit Addressing mode:  
SSPADD<7:1> = 1010 0000  
ADMSK<5:1> = 00 111  
Addresses Acknowledged = 0xA0, 0xA2, 0xA4, 0xA6, 0xA8, 0xAA, 0xAC, 0xAE  
10-Bit Addressing mode:  
SSPADD<7:0> = 1010 0000(The two MSbs are ignored in this example since they are not affected)  
ADMSK<5:1> = 00 111  
Addresses Acknowledged = 0xA0, 0xA1, 0xA2, 0xA3, 0xA4, 0xA5, 0xA6, 0xA7, 0xA8, 0xA9, 0xAA, 0xAB,  
0xAC, 0xAD, 0xAE, 0xAF  
The upper two bits are not affected by the address masking.  
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18.4.3.3  
Reception  
18.4.3.4  
Transmission  
When the R/W bit of the address byte is clear and an  
address match occurs, the R/W bit of the SSPSTAT  
register is cleared. The received address is loaded into  
the SSPBUF register and the SDA line is held low  
(ACK).  
When the R/W bit of the incoming address byte is set  
and an address match occurs, the R/W bit of the  
SSPSTAT register is set. The received address is  
loaded into the SSPBUF register. The ACK pulse will  
be sent on the ninth bit and pin RC3/SCK/SCL is held  
low regardless of SEN (see Section 18.4.4 “Clock  
Stretching” for more detail). By stretching the clock,  
the master will be unable to assert another clock pulse  
until the slave is done preparing the transmit data. The  
transmit data must be loaded into the SSPBUF register  
which also loads the SSPSR register. Then pin RC3/  
SCK/SCL should be enabled by setting bit, CKP  
(SSPCON1<4>). The eight data bits are shifted out on  
the falling edge of the SCL input. This ensures that the  
SDA signal is valid during the SCL high time  
(Figure 18-10).  
When the address byte overflow condition exists, then  
the no Acknowledge (ACK) pulse is given. An overflow  
condition is defined as either bit BF (SSPSTAT<0>) is  
set, or bit SSPOV (SSPCON1<6>) is set.  
An MSSP interrupt is generated for each data transfer  
byte. Flag bit, SSPIF (PIR1<3>), must be cleared in  
software. The SSPSTAT register is used to determine  
the status of the byte.  
If SEN is enabled (SSPCON2<0> = 1), RC3/SCK/SCL  
will be held low (clock stretch) following each data  
transfer. The clock must be released by setting bit,  
CKP (SSPCON1<4>). See Section 18.4.4 “Clock  
Stretching” for more detail.  
The ACK pulse from the master-receiver is latched on  
the rising edge of the ninth SCL input pulse. If the SDA  
line is high (not ACK), then the data transfer is  
complete. In this case, when the ACK is latched by the  
slave, the slave logic is reset and the slave monitors for  
another occurrence of the Start bit. If the SDA line was  
low (ACK), the next transmit data must be loaded into  
the SSPBUF register. Again, pin RC3/SCK/SCL must  
be enabled by setting bit CKP.  
An MSSP interrupt is generated for each data transfer  
byte. The SSPIF bit must be cleared in software and  
the SSPSTAT register is used to determine the status  
of the byte. The SSPIF bit is set on the falling edge of  
the ninth clock pulse.  
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2
FIGURE 18-8:  
I C™ SLAVE MODE TIMING WITH SEN = 0 (RECEPTION, 7-BIT ADDRESSING)  
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2
FIGURE 18-9:  
I C™ SLAVE MODE TIMING WITH SEN = 0 AND ADMSK<5:1> = 01011  
(RECEPTION, 7-BIT ADDRESSING)  
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2
FIGURE 18-10:  
I C™ SLAVE MODE TIMING (TRANSMISSION, 7-BIT ADDRESSING)  
DS39689F-page 186  
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FIGURE 18-11:  
I2C™ SLAVE MODE TIMING WITH SEN = 0 AND ADMSK = 01001  
(RECEPTION, 10-BIT ADDRESSING)  
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FIGURE 18-12:  
I2C™ SLAVE MODE TIMING WITH SEN = 0 (RECEPTION, 10-BIT ADDRESSING)  
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2
FIGURE 18-13:  
I C™ SLAVE MODE TIMING (TRANSMISSION, 10-BIT ADDRESSING)  
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18.4.4  
CLOCK STRETCHING  
18.4.4.3  
Clock Stretching for 7-Bit Slave  
Transmit Mode  
Both 7-Bit and 10-Bit Slave modes implement  
automatic clock stretching during a transmit sequence.  
7-Bit Slave Transmit mode implements clock stretch-  
ing by clearing the CKP bit after the falling edge of the  
ninth clock if the BF bit is clear. This occurs regardless  
of the state of the SEN bit.  
The SEN bit (SSPCON2<0>) allows clock stretching to  
be enabled during receives. Setting SEN will cause  
the SCL pin to be held low at the end of each data  
receive sequence.  
The user’s ISR must set the CKP bit before transmis-  
sion is allowed to continue. By holding the SCL line  
low, the user has time to service the ISR and load the  
contents of the SSPBUF before the master device can  
initiate another transmit sequence (see Figure 18-10).  
18.4.4.1  
Clock Stretching for 7-Bit Slave  
Receive Mode (SEN = 1)  
In 7-Bit Slave Receive mode, on the falling edge of the  
ninth clock at the end of the ACK sequence if the BF  
bit is set, the CKP bit in the SSPCON1 register is  
automatically cleared, forcing the SCL output to be  
held low. The CKP bit being cleared to ‘0’ will assert  
the SCL line low. The CKP bit must be set in the user’s  
ISR before reception is allowed to continue. By holding  
the SCL line low, the user has time to service the ISR  
and read the contents of the SSPBUF before the  
master device can initiate another receive sequence.  
This will prevent buffer overruns from occurring (see  
Figure 18-15).  
Note 1: If the user loads the contents of SSPBUF,  
setting the BF bit before the falling edge of  
the ninth clock, the CKP bit will not be  
cleared and clock stretching will not occur.  
2: The CKP bit can be set in software  
regardless of the state of the BF bit.  
18.4.4.4  
Clock Stretching for 10-Bit Slave  
Transmit Mode  
In 10-Bit Slave Transmit mode, clock stretching is  
controlled during the first two address sequences by  
the state of the UA bit, just as it is in 10-Bit Slave  
Receive mode. The first two addresses are followed  
by a third address sequence which contains the high-  
order bits of the 10-bit address and the R/W bit set to  
1’. After the third address sequence is performed, the  
UA bit is not set, the module is now configured in  
Transmit mode and clock stretching is controlled by  
the BF flag as in 7-Bit Slave Transmit mode (see  
Figure 18-13).  
Note 1: If the user reads the contents of the  
SSPBUF before the falling edge of the  
ninth clock, thus clearing the BF bit, the  
CKP bit will not be cleared and clock  
stretching will not occur.  
2: The CKP bit can be set in software  
regardless of the state of the BF bit. The  
user should be careful to clear the BF bit  
in the ISR before the next receive  
sequence in order to prevent an overflow  
condition.  
18.4.4.2  
Clock Stretching for 10-Bit Slave  
Receive Mode (SEN = 1)  
In 10-Bit Slave Receive mode during the address  
sequence, clock stretching automatically takes place  
but CKP is not cleared. During this time, if the UA bit is  
set after the ninth clock, clock stretching is initiated.  
The UA bit is set after receiving the upper byte of the  
10-bit address and following the receive of the second  
byte of the 10-bit address with the R/W bit cleared to  
0’. The release of the clock line occurs upon updating  
SSPADD. Clock stretching will occur on each data  
receive sequence as described in 7-bit mode.  
Note:  
If the user polls the UA bit and clears it by  
updating the SSPADD register before the  
falling edge of the ninth clock occurs and if  
the user hasn’t cleared the BF bit by read-  
ing the SSPBUF register before that time,  
then the CKP bit will still NOT be asserted  
low. Clock stretching on the basis of the  
state of the BF bit only occurs during a  
data sequence, not an address sequence.  
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already asserted the SCL line. The SCL output will  
remain low until the CKP bit is set and all other  
devices on the I2C bus have deasserted SCL. This  
ensures that a write to the CKP bit will not violate the  
minimum high time requirement for SCL (see  
Figure 18-14).  
18.4.4.5  
Clock Synchronization and  
the CKP bit  
When the CKP bit is cleared, the SCL output is forced  
to ‘0’. However, clearing the CKP bit will not assert the  
SCL output low until the SCL output is already  
sampled low. Therefore, the CKP bit will not assert the  
SCL line until an external I2C master device has  
FIGURE 18-14:  
CLOCK SYNCHRONIZATION TIMING  
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4  
SDA  
SCL  
DX  
DX – 1  
Master device  
asserts clock  
CKP  
Master device  
deasserts clock  
WR  
SSPCON  
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2
FIGURE 18-15:  
I C™ SLAVE MODE TIMING WITH SEN = 1 (RECEPTION, 7-BIT ADDRESSING)  
DS39689F-page 192  
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FIGURE 18-16:  
I2C™ SLAVE MODE TIMING WITH SEN = 1 (RECEPTION, 10-BIT ADDRESSING)  
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If the general call address matches, the SSPSR is  
transferred to the SSPBUF, the BF flag bit is set (eighth  
bit) and on the falling edge of the ninth bit (ACK bit), the  
SSPIF interrupt flag bit is set.  
18.4.5  
GENERAL CALL ADDRESS  
SUPPORT  
The addressing procedure for the I2C bus is such that  
the first byte after the Start condition usually  
determines which device will be the slave addressed by  
the master. The exception is the general call address  
which can address all devices. When this address is  
used, all devices should, in theory, respond with an  
Acknowledge.  
When the interrupt is serviced, the source for the  
interrupt can be checked by reading the contents of the  
SSPBUF. The value can be used to determine if the  
address was device specific or a general call address.  
In 10-bit mode, the SSPADD is required to be updated  
for the second half of the address to match and the UA  
bit (SSPSTAT<1>) is set. If the general call address is  
sampled when the GCEN bit is set, while the slave is  
configured in 10-Bit Addressing mode, then the second  
half of the address is not necessary, the UA bit will not  
be set and the slave will begin receiving data after the  
Acknowledge (Figure 18-17).  
The general call address is one of eight addresses  
reserved for specific purposes by the I2C protocol. It  
consists of all ‘0’s with R/W = 0.  
The general call address is recognized when the  
General Call Enable bit, GCEN, is enabled  
(SSPCON2<7> is set). Following a Start bit detect,  
8 bits are shifted into the SSPSR and the address is  
compared against the SSPADD. It is also compared to  
the general call address and fixed in hardware.  
FIGURE 18-17:  
SLAVE MODE GENERAL CALL ADDRESS SEQUENCE  
(7 OR 10-BIT ADDRESSING MODE)  
Address is compared to General Call Address  
after ACK, set interrupt  
Receiving Data  
D5 D4 D3 D2 D1  
ACK  
R/W = 0  
General Call Address  
ACK  
SDA  
SCL  
D7 D6  
D0  
8
1
2
3
4
5
6
7
8
9
1
2
3
4
5
6
7
9
S
SSPIF  
BF (SSPSTAT<0>)  
Cleared in software  
SSPBUF is read  
SSPOV (SSPCON1<6>)  
GCEN (SSPCON2<7>)  
0’  
1’  
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18.4.6  
MASTER MODE  
Note:  
The MSSP module, when configured in  
I2C Master mode, does not allow queueing  
of events. For instance, the user is not  
allowed to initiate a Start condition and  
immediately write the SSPBUF register to  
initiate transmission before the Start  
condition is complete. In this case, the  
SSPBUF will not be written to and the  
WCOL bit will be set, indicating that a write  
to the SSPBUF did not occur.  
Master mode is enabled by setting and clearing the  
appropriate SSPM bits in SSPCON1 and by setting the  
SSPEN bit. In Master mode, the SCL and SDA lines  
are manipulated by the MSSP hardware.  
Master mode of operation is supported by interrupt  
generation on the detection of the Start and Stop  
conditions. The Stop (P) and Start (S) bits are cleared  
from a Reset or when the MSSP module is disabled.  
Control of the I2C bus may be taken when the P bit is  
set, or the bus is Idle, with both the S and P bits clear.  
The following events will cause the MSSP Interrupt  
Flag bit, SSPIF, to be set (MSSP interrupt, if enabled):  
In Firmware Controlled Master mode, user code  
conducts all I2C bus operations based on Start and  
Stop bit conditions.  
• Start condition  
• Stop condition  
Once Master mode is enabled, the user has six  
options.  
• Data transfer byte transmitted/received  
• Acknowledge transmit  
• Repeated Start  
1. Assert a Start condition on SDA and SCL.  
2. Assert a Repeated Start condition on SDA and  
SCL.  
3. Write to the SSPBUF register initiating  
transmission of data/address.  
4. Configure the I2C port to receive data.  
5. Generate an Acknowledge condition at the end  
of a received byte of data.  
6. Generate a Stop condition on SDA and SCL.  
2
FIGURE 18-18:  
MSSP BLOCK DIAGRAM (I C™ MASTER MODE)  
Internal  
Data Bus  
SSPM<3:0>  
SSPADD<6:0>  
Read  
Write  
SSPBUF  
SSPSR  
Baud  
Rate  
Generator  
SDA  
Shift  
Clock  
SDA In  
MSb  
LSb  
Start bit, Stop bit,  
Acknowledge  
Generate  
SCL  
Start bit Detect  
Stop bit Detect  
Write Collision Detect  
Clock Arbitration  
State Counter for  
end of XMIT/RCV  
SCL In  
Bus Collision  
Set/Reset, S, P, WCOL (SSPSTAT);  
Set SSPIF, BCLIF;  
Reset ACKSTAT, PEN (SSPCON2)  
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I2C Master Mode Operation  
A typical transmit sequence would go as follows:  
18.4.6.1  
1. The user generates a Start condition by setting  
the Start Enable bit, SEN (SSPCON2<0>).  
The master device generates all of the serial clock  
pulses and the Start and Stop conditions. A transfer is  
ended with a Stop condition or with a Repeated Start  
condition. Since the Repeated Start condition is also  
the beginning of the next serial transfer, the I2C bus will  
not be released.  
2. SSPIF is set. The MSSP module will wait the  
required start time before any other operation  
takes place.  
3. The user loads the SSPBUF with the slave  
address to transmit.  
In Master Transmitter mode, serial data is output  
through SDA, while SCL outputs the serial clock. The  
first byte transmitted contains the slave address of the  
receiving device (7 bits) and the Read/Write (R/W) bit.  
In this case, the R/W bit will be logic ‘0’. Serial data is  
transmitted 8 bits at a time. After each byte is transmit-  
ted, an Acknowledge bit is received. Start and Stop  
conditions are output to indicate the beginning and the  
end of a serial transfer.  
4. Address is shifted out the SDA pin until all 8 bits  
are transmitted.  
5. The MSSP module shifts in the ACK bit from the  
slave device and writes its value into the  
SSPCON2 register.  
6. The MSSP module generates an interrupt at the  
end of the ninth clock cycle by setting the SSPIF  
bit.  
In Master Receive mode, the first byte transmitted  
contains the slave address of the transmitting device  
(7 bits) and the R/W bit. In this case, the R/W bit will be  
logic ‘1’. Thus, the first byte transmitted is a 7-bit slave  
address followed by a ‘1’ to indicate the receive bit.  
Serial data is received via SDA, while SCL outputs the  
serial clock. Serial data is received 8 bits at a time. After  
each byte is received, an Acknowledge bit is transmit-  
ted. Start and Stop conditions indicate the beginning  
and end of transmission.  
7. The user loads the SSPBUF with eight bits of  
data.  
8. Data is shifted out the SDA pin until all 8 bits are  
transmitted.  
9. The MSSP module shifts in the ACK bit from the  
slave device and writes its value into the  
SSPCON2 register.  
10. The MSSP module generates an interrupt at the  
end of the ninth clock cycle by setting the SSPIF  
bit.  
The Baud Rate Generator used for the SPI mode  
operation is used to set the SCL clock frequency for  
either 100 kHz, 400 kHz or 1 MHz I2C operation. See  
Section 18.4.7 “Baud Rate” for more detail.  
11. The user generates a Stop condition by setting  
the Stop Enable bit, PEN (SSPCON2<2>).  
12. Interrupt is generated once the Stop condition is  
complete.  
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Once the given operation is complete (i.e., transmis-  
sion of the last data bit is followed by ACK), the internal  
clock will automatically stop counting and the SCL pin  
will remain in its last state.  
18.4.7  
BAUD RATE  
In I2C Master mode, the Baud Rate Generator (BRG)  
reload value is placed in the lower 7 bits of the  
SSPADD register (Figure 18-19). When a write occurs  
to SSPBUF, the Baud Rate Generator will automatically  
begin counting. The BRG counts down to 0 and stops  
until another reload has taken place. The BRG count is  
decremented twice per instruction cycle (TCY) on the  
Q2 and Q4 clocks. In I2C Master mode, the BRG is  
reloaded automatically.  
Table 18-3 demonstrates clock rates based on  
instruction cycles and the BRG value loaded into  
SSPADD.  
FIGURE 18-19:  
BAUD RATE GENERATOR BLOCK DIAGRAM  
SSPM<3:0>  
SSPADD<6:0>  
SSPM<3:0>  
SCL  
Reload  
Control  
Reload  
CLKO  
BRG Down Counter  
FOSC/4  
TABLE 18-3: I2C™ CLOCK RATE W/BRG  
FSCL  
Fosc  
FCY  
FCY * 2  
BRG Value  
(2 Rollovers of BRG)  
40 MHz  
40 MHz  
40 MHz  
16 MHz  
16 MHz  
16 MHz  
4 MHz  
10 MHz  
10 MHz  
10 MHz  
4 MHz  
4 MHz  
4 MHz  
1 MHz  
1 MHz  
1 MHz  
20 MHz  
20 MHz  
20 MHz  
8 MHz  
8 MHz  
8 MHz  
2 MHz  
2 MHz  
2 MHz  
18h  
1Fh  
63h  
09h  
0Ch  
27h  
02h  
09h  
00h  
400 kHz  
312.5 kHz  
100 kHz  
400 kHz  
308 kHz  
100 kHz  
333 kHz  
100 kHz  
1 MHz  
4 MHz  
4 MHz  
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SCL pin is sampled high, the Baud Rate Generator is  
reloaded with the contents of SSPADD<6:0> and  
begins counting. This ensures that the SCL high time  
will always be at least one BRG rollover count in the  
event that the clock is held low by an external device  
(Figure 18-20).  
18.4.7.1  
Clock Arbitration  
Clock arbitration occurs when the master, during any  
receive, transmit or Repeated Start/Stop condition,  
deasserts the SCL pin (SCL allowed to float high).  
When the SCL pin is allowed to float high, the Baud  
Rate Generator (BRG) is suspended from counting  
until the SCL pin is actually sampled high. When the  
FIGURE 18-20:  
BAUD RATE GENERATOR TIMING WITH CLOCK ARBITRATION  
SDA  
DX  
DX – 1  
SCL allowed to transition high  
SCL deasserted but slave holds  
SCL low (clock arbitration)  
SCL  
BRG decrements on  
Q2 and Q4 cycles  
BRG  
Value  
03h  
02h  
01h  
00h (hold off)  
03h  
02h  
SCL is sampled high, reload takes  
place and BRG starts its count  
BRG  
Reload  
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18.4.8  
I2C MASTER MODE START  
CONDITION TIMING  
Note:  
If at the beginning of the Start condition,  
the SDA and SCL pins are already sam-  
pled low, or if during the Start condition, the  
SCL line is sampled low before the SDA  
line is driven low, a bus collision occurs,  
the Bus Collision Interrupt Flag, BCLIF, is  
set, the Start condition is aborted and the  
I2C module is reset into its Idle state.  
To initiate a Start condition, the user sets the Start  
Enable bit, SEN (SSPCON2<0>). If the SDA and SCL  
pins are sampled high, the Baud Rate Generator is  
reloaded with the contents of SSPADD<6:0> and starts  
its count. If SCL and SDA are both sampled high when  
the Baud Rate Generator times out (TBRG), the SDA  
pin is driven low. The action of the SDA being driven  
low while SCL is high is the Start condition and causes  
the S bit (SSPSTAT<3>) to be set. Following this, the  
Baud Rate Generator is reloaded with the contents of  
SSPADD<6:0> and resumes its count. When the Baud  
Rate Generator times out (TBRG), the SEN bit  
(SSPCON2<0>) will be automatically cleared by  
hardware; the Baud Rate Generator is suspended,  
leaving the SDA line held low and the Start condition is  
complete.  
18.4.8.1  
WCOL Status Flag  
If the user writes the SSPBUF when a Start sequence  
is in progress, the WCOL is set and the contents of the  
buffer are unchanged (the write doesn’t occur).  
Note:  
Because queueing of events is not  
allowed, writing to the lower 5 bits of  
SSPCON2 is disabled until the Start  
condition is complete.  
FIGURE 18-21:  
FIRST START BIT TIMING  
Set S bit (SSPSTAT<3>)  
At completion of Start bit,  
Write to SEN bit occurs here  
SDA = 1,  
SCL = 1  
hardware clears SEN bit  
and sets SSPIF bit  
TBRG  
TBRG  
Write to SSPBUF occurs here  
2nd bit  
1st bit  
SDA  
TBRG  
SCL  
TBRG  
S
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18.4.9  
I2C MASTER MODE REPEATED  
START CONDITION TIMING  
Note 1: If RSEN is programmed while any other  
event is in progress, it will not take effect.  
A Repeated Start condition occurs when the RSEN bit  
(SSPCON2<1>) is programmed high and the I2C logic  
module is in the Idle state. When the RSEN bit is set,  
the SCL pin is asserted low. When the SCL pin is  
sampled low, the Baud Rate Generator is loaded with  
the contents of SSPADD<5:0> and begins counting.  
The SDA pin is released (brought high) for one Baud  
Rate Generator count (TBRG). When the Baud Rate  
Generator times out, if SDA is sampled high, the SCL  
pin will be deasserted (brought high). When SCL is  
sampled high, the Baud Rate Generator is reloaded  
with the contents of SSPADD<6:0> and begins count-  
ing. SDA and SCL must be sampled high for one TBRG.  
This action is then followed by assertion of the SDA pin  
(SDA = 0) for one TBRG while SCL is high. Following  
this, the RSEN bit (SSPCON2<1>) will be automatically  
cleared and the Baud Rate Generator will not be  
reloaded, leaving the SDA pin held low. As soon as a  
Start condition is detected on the SDA and SCL pins,  
the S bit (SSPSTAT<3>) will be set. The SSPIF bit will  
not be set until the Baud Rate Generator has timed out.  
2: A bus collision during the Repeated Start  
condition occurs if:  
• SDA is sampled low when SCL goes  
from low-to-high.  
• SCL goes low before SDA is  
asserted low. This may indicate that  
another master is attempting to  
transmit a data ‘1’.  
Immediately following the SSPIF bit getting set, the user  
may write the SSPBUF with the 7-bit address in 7-bit  
mode, or the default first address in 10-bit mode. After  
the first eight bits are transmitted and an ACK is  
received, the user may then transmit an additional eight  
bits of address (10-bit mode) or eight bits of data (7-bit  
mode).  
18.4.9.1  
WCOL Status Flag  
If the user writes the SSPBUF when a Repeated Start  
sequence is in progress, the WCOL is set and the  
contents of the buffer are unchanged (the write doesn’t  
occur).  
Note:  
Because queueing of events is not  
allowed, writing of the lower 5 bits of  
SSPCON2 is disabled until the Repeated  
Start condition is complete.  
FIGURE 18-22:  
REPEATED START CONDITION WAVEFORM  
S bit set by hardware  
Write to SSPCON2  
occurs here.  
SDA = 1,  
SCL (no change).  
SDA = 1,  
SCL = 1  
At completion of Start bit,  
hardware clears RSEN bit  
and sets SSPIF  
TBRG  
TBRG  
TBRG  
1st bit  
SDA  
RSEN bit set by hardware  
on falling edge of ninth clock,  
end of Xmit  
Write to SSPBUF occurs here  
TBRG  
SCL  
TBRG  
Sr = Repeated Start  
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18.4.10 I2C MASTER MODE TRANSMISSION  
18.4.10.3 ACKSTAT Status Flag  
Transmission of a data byte, a 7-bit address or the  
other half of a 10-bit address is accomplished by simply  
writing a value to the SSPBUF register. This action will  
set the Buffer Full flag bit, BF and allow the Baud Rate  
Generator to begin counting and start the next  
transmission. Each bit of address/data will be shifted  
out onto the SDA pin after the falling edge of SCL is  
asserted (see data hold time specification  
parameter 106). SCL is held low for one Baud Rate  
Generator rollover count (TBRG). Data should be valid  
before SCL is released high (see data setup time  
specification parameter 107). When the SCL pin is  
released high, it is held that way for TBRG. The data on  
the SDA pin must remain stable for that duration and  
some hold time after the next falling edge of SCL. After  
the eighth bit is shifted out (the falling edge of the eighth  
clock), the BF flag is cleared and the master releases  
SDA. This allows the slave device being addressed to  
respond with an ACK bit during the ninth bit time if an  
address match occurred, or if data was received  
properly. The status of ACK is written into the ACKDT  
bit on the falling edge of the ninth clock. If the master  
receives an Acknowledge, the Acknowledge Status bit,  
ACKSTAT, is cleared. If not, the bit is set. After the ninth  
clock, the SSPIF bit is set and the master clock (Baud  
Rate Generator) is suspended until the next data byte  
is loaded into the SSPBUF, leaving SCL low and SDA  
unchanged (Figure 18-23).  
In Transmit mode, the ACKSTAT bit (SSPCON2<6>) is  
cleared when the slave has sent an Acknowledge  
(ACK = 0) and is set when the slave does not Acknowl-  
edge (ACK = 1). A slave sends an Acknowledge when  
it has recognized its address (including a general call),  
or when the slave has properly received its data.  
18.4.11 I2C MASTER MODE RECEPTION  
Master mode reception is enabled by programming the  
Receive Enable bit, RCEN (SSPCON2<3>).  
Note:  
The MSSP module must be in an Idle state  
before the RCEN bit is set or the RCEN bit  
will be disregarded.  
The Baud Rate Generator begins counting and on each  
rollover, the state of the SCL pin changes (high-to-low/  
low-to-high) and data is shifted into the SSPSR. After  
the falling edge of the eighth clock, the receive enable  
flag is automatically cleared, the contents of the  
SSPSR are loaded into the SSPBUF, the BF flag bit is  
set, the SSPIF flag bit is set and the Baud Rate Gener-  
ator is suspended from counting, holding SCL low. The  
MSSP is now in Idle state awaiting the next command.  
When the buffer is read by the CPU, the BF flag bit is  
automatically cleared. The user can then send an  
Acknowledge bit at the end of reception by setting the  
Acknowledge Sequence Enable bit, ACKEN  
(SSPCON2<4>).  
After the write to the SSPBUF, each bit of the address  
will be shifted out on the falling edge of SCL until all  
seven address bits and the R/W bit are completed. On  
the falling edge of the eighth clock, the master will  
deassert the SDA pin, allowing the slave to respond  
with an Acknowledge. On the falling edge of the ninth  
clock, the master will sample the SDA pin to see if the  
address was recognized by a slave. The status of the  
ACK bit is loaded into the ACKSTAT status bit  
(SSPCON2<6>). Following the falling edge of the ninth  
clock transmission of the address, the SSPIF is set, the  
BF flag is cleared and the Baud Rate Generator is  
turned off until another write to the SSPBUF takes  
place, holding SCL low and allowing SDA to float.  
18.4.11.1 BF Status Flag  
In receive operation, the BF bit is set when an address  
or data byte is loaded into SSPBUF from SSPSR. It is  
cleared when the SSPBUF register is read.  
18.4.11.2 SSPOV Status Flag  
In receive operation, the SSPOV bit is set when 8 bits  
are received into the SSPSR and the BF flag bit is  
already set from a previous reception.  
18.4.11.3 WCOL Status Flag  
If the user writes the SSPBUF when a receive is  
already in progress (i.e., SSPSR is still shifting in a data  
byte), the WCOL bit is set and the contents of the buffer  
are unchanged (the write doesn’t occur).  
18.4.10.1 BF Status Flag  
In Transmit mode, the BF bit (SSPSTAT<0>) is set  
when the CPU writes to SSPBUF and is cleared when  
all 8 bits are shifted out.  
18.4.10.2 WCOL Status Flag  
If the user writes the SSPBUF when a transmit is  
already in progress (i.e., SSPSR is still shifting out a  
data byte), the WCOL flag is set and the contents of the  
buffer are unchanged (the write doesn’t occur) after  
2 TCY after the SSPBUF write. If SSPBUF is rewritten  
within 2 TCY, the WCOL bit is set and SSPBUF is  
updated. This may result in a corrupted transfer. The  
user should verify that the WCOL flag is clear after  
each write to SSPBUF to ensure the transfer is correct.  
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FIGURE 18-23:  
I2CMASTERMODEWAVEFORM(TRANSMISSION,7OR10-BITADDRESSING)  
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FIGURE 18-24:  
I2C™ MASTER MODE WAVEFORM (RECEPTION, 7-BIT ADDRESSING)  
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18.4.12 ACKNOWLEDGE SEQUENCE  
TIMING  
18.4.13 STOP CONDITION TIMING  
A Stop bit is asserted on the SDA pin at the end of a  
receive/transmit by setting the Stop Sequence Enable  
bit, PEN (SSPCON2<2>). At the end of a receive/  
transmit, the SCL line is held low after the falling edge  
of the ninth clock. When the PEN bit is set, the master  
will assert the SDA line low. When the SDA line is  
sampled low, the Baud Rate Generator is reloaded and  
counts down to 0. When the Baud Rate Generator  
times out, the SCL pin will be brought high and one  
TBRG (Baud Rate Generator rollover count) later, the  
SDA pin will be deasserted. When the SDA pin is  
An Acknowledge sequence is enabled by setting the  
Acknowledge Sequence Enable bit, ACKEN  
(SSPCON2<4>). When this bit is set, the SCL pin is  
pulled low and the contents of the Acknowledge data bit  
are presented on the SDA pin. If the user wishes to gen-  
erate an Acknowledge, then the ACKDT bit should be  
cleared. If not, the user should set the ACKDT bit before  
starting an Acknowledge sequence. The Baud Rate  
Generator then counts for one rollover period (TBRG)  
and the SCL pin is deasserted (pulled high). When the  
SCL pin is sampled high (clock arbitration), the Baud  
Rate Generator counts for TBRG. The SCL pin is then  
pulled low. Following this, the ACKEN bit is automatically  
cleared, the Baud Rate Generator is turned off and the  
MSSP module then goes into Idle mode (Figure 18-25).  
sampled high while SCL is high, the  
(SSPSTAT<4>) is set. A TBRG later, the PEN bit is  
cleared and the SSPIF bit is set (Figure 18-26).  
P
bit  
18.4.13.1 WCOL Status Flag  
If the user writes the SSPBUF when a Stop sequence  
is in progress, then the WCOL bit is set and the  
contents of the buffer are unchanged (the write doesn’t  
occur).  
18.4.12.1 WCOL Status Flag  
If the user writes the SSPBUF when an Acknowledge  
sequence is in progress, then WCOL is set and the  
contents of the buffer are unchanged (the write doesn’t  
occur).  
FIGURE 18-25:  
ACKNOWLEDGE SEQUENCE WAVEFORM  
Acknowledge sequence starts here,  
write to SSPCON2  
ACKEN automatically cleared  
ACKEN = 1, ACKDT = 0  
TBRG  
TBRG  
SDA  
SCL  
D0  
ACK  
8
9
SSPIF  
Cleared in  
software  
SSPIF set at the end  
of Acknowledge sequence  
SSPIF set at  
the end of receive  
Cleared in  
software  
Note: TBRG = one Baud Rate Generator period.  
FIGURE 18-26:  
STOP CONDITION RECEIVE OR TRANSMIT MODE  
SCL = 1for TBRG, followed by SDA = 1for TBRG  
after SDA sampled high. P bit (SSPSTAT<4>) is set.  
Write to SSPCON2,  
set PEN  
PEN bit (SSPCON2<2>) is cleared by  
hardware and the SSPIF bit is set  
Falling edge of  
9th clock  
TBRG  
SCL  
ACK  
SDA  
P
TBRG  
TBRG  
TBRG  
SCL brought high after TBRG  
SDA asserted low before rising edge of clock  
to setup Stop condition  
Note: TBRG = one Baud Rate Generator period.  
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18.4.14 SLEEP OPERATION  
18.4.17 MULTI -MASTER COMMUNICATION,  
BUS COLLISION AND BUS  
While in Sleep mode, the I2C module can receive  
addresses or data and when an address match or  
complete byte transfer occurs, wake the processor  
from Sleep (if the MSSP interrupt is enabled).  
ARBITRATION  
Multi-Master mode support is achieved by bus arbitra-  
tion. When the master outputs address/data bits onto  
the SDA pin, arbitration takes place when the master  
outputs a ‘1’ on SDA, by letting SDA float high and  
another master asserts a ‘0’. When the SCL pin floats  
high, data should be stable. If the expected data on  
SDA is a ‘1’ and the data sampled on the SDA pin = 0,  
then a bus collision has taken place. The master will set  
the Bus Collision Interrupt Flag, BCLIF and reset the  
I2C port to its Idle state (Figure 18-27).  
18.4.15 EFFECTS OF A RESET  
A Reset disables the MSSP module and terminates the  
current transfer.  
18.4.16 MULTI-MASTER MODE  
In Multi-Master mode, the interrupt generation on the  
detection of the Start and Stop conditions allows the  
determination of when the bus is free. The Stop (P) and  
Start (S) bits are cleared from a Reset or when the  
MSSP module is disabled. Control of the I2C bus may  
be taken when the P bit (SSPSTAT<4>) is set, or the  
bus is Idle, with both the S and P bits clear. When the  
bus is busy, enabling the MSSP interrupt will generate  
the interrupt when the Stop condition occurs.  
If a transmit was in progress when the bus collision  
occurred, the transmission is halted, the BF flag is  
cleared, the SDA and SCL lines are deasserted and the  
SSPBUF can be written to. When the user services the  
bus collision Interrupt Service Routine and if the I2C  
bus is free, the user can resume communication by  
asserting a Start condition.  
In multi-master operation, the SDA line must be  
monitored for arbitration to see if the signal level is the  
expected output level. This check is performed in  
hardware with the result placed in the BCLIF bit.  
If a Start, Repeated Start, Stop or Acknowledge  
condition was in progress when the bus collision  
occurred, the condition is aborted, the SDA and SCL  
lines are deasserted and the respective control bits in  
the SSPCON2 register are cleared. When the user ser-  
vices the bus collision Interrupt Service Routine and if  
the I2C bus is free, the user can resume communication  
by asserting a Start condition.  
The states where arbitration can be lost are:  
• Address Transfer  
• Data Transfer  
• A Start Condition  
The master will continue to monitor the SDA and SCL  
pins. If a Stop condition occurs, the SSPIF bit will be set.  
• A Repeated Start Condition  
• An Acknowledge Condition  
A write to the SSPBUF will start the transmission of  
data at the first data bit, regardless of where the  
transmitter left off when the bus collision occurred.  
In Multi-Master mode, the interrupt generation on the  
detection of Start and Stop conditions allows the  
determination of when the bus is free. Control of the I2C  
bus can be taken when the P bit is set in the SSPSTAT  
register, or the bus is Idle and the S and P bits are  
cleared.  
FIGURE 18-27:  
BUS COLLISION TIMING FOR TRANSMIT AND ACKNOWLEDGE  
Sample SDA. While SCL is high,  
data doesn’t match what is driven  
by the master.  
Data changes  
while SCL = 0  
SDA line pulled low  
by another source  
Bus collision has occurred.  
SDA released  
by master  
SDA  
SCL  
Set bus collision  
interrupt (BCLIF)  
BCLIF  
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If the SDA pin is sampled low during this count, the  
18.4.17.1 Bus Collision During a  
Start Condition  
BRG is reset and the SDA line is asserted early  
(Figure 18-30). If, however, a ‘1’ is sampled on the SDA  
pin, the SDA pin is asserted low at the end of the BRG  
count. The Baud Rate Generator is then reloaded and  
counts down to 0; if the SCL pin is sampled as ‘0’  
during this time, a bus collision does not occur. At the  
end of the BRG count, the SCL pin is asserted low.  
During a Start condition, a bus collision occurs if:  
a) SDA or SCL are sampled low at the beginning of  
the Start condition (Figure 18-28).  
b) SCL is sampled low before SDA is asserted low  
(Figure 18-29).  
During a Start condition, both the SDA and the SCL  
pins are monitored.  
Note:  
The reason that bus collision is not a factor  
during a Start condition is that no two bus  
masters can assert a Start condition at the  
exact same time. Therefore, one master  
will always assert SDA before the other.  
This condition does not cause a bus  
collision because the two masters must be  
allowed to arbitrate the first address  
following the Start condition. If the address  
is the same, arbitration must be allowed to  
continue into the data portion, Repeated  
Start or Stop conditions.  
If the SDA pin is already low, or the SCL pin is already  
low, then all of the following occur:  
• the Start condition is aborted,  
• the BCLIF flag is set and  
the MSSP module is reset to its Idle state  
(Figure 18-28).  
The Start condition begins with the SDA and SCL pins  
deasserted. When the SDA pin is sampled high, the  
Baud Rate Generator is loaded from SSPADD<6:0>  
and counts down to 0. If the SCL pin is sampled low  
while SDA is high, a bus collision occurs because it is  
assumed that another master is attempting to drive a  
data ‘1’ during the Start condition.  
FIGURE 18-28:  
BUS COLLISION DURING START CONDITION (SDA ONLY)  
SDA goes low before the SEN bit is set.  
Set BCLIF,  
S bit and SSPIF set because  
SDA = 0, SCL = 1.  
SDA  
SCL  
SEN  
Set SEN, enable Start  
condition if SDA = 1, SCL = 1  
SEN cleared automatically because of bus collision.  
MSSP module reset into Idle state.  
SDA sampled low before  
Start condition. Set BCLIF.  
S bit and SSPIF set because  
SDA = 0, SCL = 1.  
BCLIF  
SSPIF and BCLIF are  
cleared in software  
S
SSPIF  
SSPIF and BCLIF are  
cleared in software  
DS39689F-page 206  
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FIGURE 18-29:  
BUS COLLISION DURING START CONDITION (SCL = 0)  
SDA = 0, SCL = 1  
TBRG  
TBRG  
SDA  
Set SEN, enable Start  
sequence if SDA = 1, SCL = 1  
SCL  
SEN  
SCL = 0before SDA = 0,  
bus collision occurs. Set BCLIF.  
SCL = 0before BRG time-out,  
bus collision occurs. Set BCLIF.  
BCLIF  
Interrupt cleared  
in software  
S
0’  
0’  
0’  
0’  
SSPIF  
FIGURE 18-30:  
BRG RESET DUE TO SDA ARBITRATION DURING START CONDITION  
SDA = 0, SCL = 1  
Set S  
Set SSPIF  
Less than TBRG  
TBRG  
SDA pulled low by other master.  
Reset BRG and assert SDA.  
SDA  
SCL  
S
SCL pulled low after BRG  
time-out  
SEN  
Set SEN, enable Start  
sequence if SDA = 1, SCL = 1  
BCLIF  
0’  
S
SSPIF  
Interrupts cleared  
in software  
SDA = 0, SCL = 1,  
set SSPIF  
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If SDA is low, a bus collision has occurred (i.e., another  
18.4.17.2 Bus Collision During a Repeated  
Start Condition  
master is attempting to transmit a data ‘0’, Figure 18-31).  
If SDA is sampled high, the BRG is reloaded and begins  
counting. If SDA goes from high-to-low before the BRG  
times out, no bus collision occurs because no two  
masters can assert SDA at exactly the same time.  
During a Repeated Start condition, a bus collision  
occurs if:  
a) A low level is sampled on SDA when SCL goes  
from low level to high level.  
If SCL goes from high-to-low before the BRG times out  
and SDA has not already been asserted, a bus collision  
occurs. In this case, another master is attempting to  
transmit a data ‘1’ during the Repeated Start condition,  
see Figure 18-32.  
b) SCL goes low before SDA is asserted low,  
indicating that another master is attempting to  
transmit a data ‘1’.  
When the user deasserts SDA and the pin is allowed to  
float high, the BRG is loaded with SSPADD<6:0> and  
counts down to 0. The SCL pin is then deasserted and  
when sampled high, the SDA pin is sampled.  
If, at the end of the BRG time-out, both SCL and SDA  
are still high, the SDA pin is driven low and the BRG is  
reloaded and begins counting. At the end of the count,  
regardless of the status of the SCL pin, the SCL pin is  
driven low and the Repeated Start condition is  
complete.  
FIGURE 18-31:  
BUS COLLISION DURING A REPEATED START CONDITION (CASE 1)  
SDA  
SCL  
Sample SDA when SCL goes high.  
If SDA = 0, set BCLIF and release SDA and SCL.  
RSEN  
BCLIF  
Cleared in software  
0’  
S
0’  
SSPIF  
FIGURE 18-32:  
BUS COLLISION DURING REPEATED START CONDITION (CASE 2)  
TBRG  
TBRG  
SDA  
SCL  
SCL goes low before SDA,  
set BCLIF. Release SDA and SCL.  
BCLIF  
RSEN  
Interrupt cleared  
in software  
0’  
S
SSPIF  
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The Stop condition begins with SDA asserted low.  
When SDA is sampled low, the SCL pin is allowed to  
float. When the pin is sampled high (clock arbitration),  
the Baud Rate Generator is loaded with SSPADD<6:0>  
and counts down to 0. After the BRG times out, SDA is  
sampled. If SDA is sampled low, a bus collision has  
occurred. This is due to another master attempting to  
drive a data ‘0’ (Figure 18-33). If the SCL pin is  
sampled low before SDA is allowed to float high, a bus  
collision occurs. This is another case of another master  
attempting to drive a data ‘0’ (Figure 18-34).  
18.4.17.3 Bus Collision During a Stop  
Condition  
Bus collision occurs during a Stop condition if:  
a) After the SDA pin has been deasserted and  
allowed to float high, SDA is sampled low after  
the BRG has timed out.  
b) After the SCL pin is deasserted, SCL is sampled  
low before SDA goes high.  
FIGURE 18-33:  
BUS COLLISION DURING A STOP CONDITION (CASE 1)  
SDA sampled  
low after TBRG,  
set BCLIF  
TBRG  
TBRG  
TBRG  
SDA  
SDA asserted low  
SCL  
PEN  
BCLIF  
P
0’  
0’  
SSPIF  
FIGURE 18-34:  
BUS COLLISION DURING A STOP CONDITION (CASE 2)  
TBRG  
TBRG  
TBRG  
SDA  
SCL goes low before SDA goes high,  
set BCLIF  
Assert SDA  
SCL  
PEN  
BCLIF  
P
0’  
0’  
SSPIF  
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TABLE 18-4: REGISTERS ASSOCIATED WITH I2C™ OPERATION  
Reset  
Values  
on page  
Name  
Bit 7  
Bit 6  
Bit 5  
Bit 4  
Bit 3  
Bit 2  
Bit 1  
Bit 0  
INTCON  
PIR1  
GIE/GIEH PEIE/GIEL TMR0IE  
INT0IE  
TXIF  
RBIE  
SSPIF  
SSPIE  
SSPIP  
BCLIF  
BCLIE  
BCLIP  
TRISC3  
TRISD3  
TMR0IF  
CCP1IF  
CCP1IE  
CCP1IP  
HLVDIF  
HLVDIE  
HLVDIP  
TRISC2  
TRISD2  
INT0IF  
RBIF  
55  
58  
58  
58  
58  
58  
58  
58  
58  
56  
56  
56  
56  
56  
56  
PSPIF  
PSPIE  
ADIF  
ADIE  
RCIF  
RCIE  
RCIP  
TMR2IF  
TMR1IF  
PIE1  
TXIE  
TMR2IE TMR1IE  
TMR2IP TMR1IP  
IPR1  
PSPIP  
ADIP  
TXIP  
PIR2  
OSCFIF  
OSCFIE  
OSCFIP  
TRISC7  
TRISD7  
CMIF  
EEIF  
TMR3IF  
TMR3IE  
TMR3IP  
TRISC1  
TRISD1  
CCP2IF  
CCP2IE  
CCP2IP  
TRISC0  
TRISD0  
PIE2  
CMIE  
EEIE  
IPR2  
CMIP  
EEIP  
TRISC  
TRISD  
SSPBUF  
SSPADD  
TMR2  
TRISC6  
TRISD6  
TRISC5  
TRISD5  
TRISC4  
TRISD4  
MSSP Receive Buffer/Transmit Register  
ADD7  
ADD6  
ADD5  
ADD4  
ADD3  
ADD2  
ADD1  
ADD0  
Timer2 Register  
PR2  
Timer2 Period Register  
SSPCON1  
SSPCON2  
WCOL  
GCEN  
SSPOV  
SSPEN  
CKP  
SSPM3  
RCEN/  
SSPM2  
PEN/  
SSPM1  
RSEN/  
SSPM0  
SEN  
ACKSTAT ACKDT/ ACKEN/  
ADMSK5 ADMSK5 ADMSK5 ADMSK5 ADMSK5  
SSPSTAT  
SMP  
CKE  
D/A R/W UA  
P
S
BF  
56  
Legend: — = unimplemented, read as ‘0’. Shaded cells are not used by the MSSP module in I2C mode.  
DS39689F-page 210  
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The pins of the Enhanced USART are multiplexed  
with PORTC. In order to configure RC6/TX/CK and  
RC7/RX/DT as an EUSART:  
19.0 ENHANCED UNIVERSAL  
SYNCHRONOUS  
ASYNCHRONOUS RECEIVER  
TRANSMITTER (EUSART)  
• bit SPEN (RCSTA<7>) must be set (= 1)  
• bit TRISC<7> must be set (= 1)  
• bit TRISC<6> must be set (= 1)  
The Enhanced Universal Synchronous Asynchronous  
Receiver Transmitter (EUSART) module is one of the  
two serial I/O modules. (Generically, the USART is also  
known as a Serial Communications Interface or SCI.)  
The EUSART can be configured as a full-duplex  
asynchronous system that can communicate with  
peripheral devices, such as CRT terminals and  
personal computers. It can also be configured as a half-  
duplex synchronous system that can communicate  
with peripheral devices, such as A/D or D/A integrated  
circuits, serial EEPROMs, etc.  
Note:  
The EUSART control will automatically  
reconfigure the pin from input to output as  
needed.  
The operation of the Enhanced USART module is  
controlled through three registers:  
• Transmit Status and Control (TXSTA)  
• Receive Status and Control (RCSTA)  
• Baud Rate Control (BAUDCON)  
These are detailed on the following pages in  
Register 19-1, Register 19-2 and Register 19-3,  
respectively.  
The Enhanced USART module implements additional  
features, including automatic baud rate detection and  
calibration, automatic wake-up on Sync Break recep-  
tion and 12-bit Break character transmit. These make it  
ideally suited for use in Local Interconnect Network bus  
(LIN/J2602 bus) systems.  
The EUSART can be configured in the following  
modes:  
• Asynchronous (full duplex) with:  
- Auto-wake-up on Break signal  
- Auto-baud calibration  
- 12-bit Break character transmission  
• Synchronous – Master (half duplex) with  
selectable clock polarity  
• Synchronous – Slave (half duplex) with selectable  
clock polarity  
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REGISTER 19-1: TXSTA: TRANSMIT STATUS AND CONTROL REGISTER  
R/W-0  
CSRC  
R/W-0  
TX9  
R/W-0  
TXEN  
R/W-0  
SYNC  
R/W-0  
R/W-0  
BRGH  
R-1  
R/W-0  
TX9D  
SENDB  
TRMT  
bit 7  
bit 0  
bit 7  
CSRC: Clock Source Select bit  
Asynchronous mode:  
Don’t care.  
Synchronous mode:  
1= Master mode (clock generated internally from BRG)  
0= Slave mode (clock from external source)  
bit 6  
bit 5  
TX9: 9-bit Transmit Enable bit  
1= Selects 9-bit transmission  
0= Selects 8-bit transmission  
TXEN: Transmit Enable bit  
1= Transmit enabled  
0= Transmit disabled  
Note:  
SREN/CREN overrides TXEN in Sync mode.  
bit 4  
bit 3  
SYNC: EUSART Mode Select bit  
1= Synchronous mode  
0= Asynchronous mode  
SENDB: Send Break Character bit  
Asynchronous mode:  
1= Send Sync Break on next transmission (cleared by hardware upon completion)  
0= Sync Break transmission completed  
Synchronous mode:  
Don’t care.  
bit 2  
BRGH: High Baud Rate Select bit  
Asynchronous mode:  
1= High speed  
0= Low speed  
Synchronous mode:  
Unused in this mode.  
bit 1  
bit 0  
TRMT: Transmit Shift Register Status bit  
1= TSR empty  
0= TSR full  
TX9D: 9th bit of Transmit Data  
Can be address/data bit or a parity bit.  
Legend:  
R = Readable bit  
-n = Value at POR  
W = Writable bit  
‘1’ = Bit is set  
U = Unimplemented bit, read as ‘0’  
‘0’ = Bit is cleared x = Bit is unknown  
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REGISTER 19-2: RCSTA: RECEIVE STATUS AND CONTROL REGISTER  
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R-0  
SPEN RX9 SREN CREN ADDEN FERR  
bit 7  
R-0  
R-x  
OERR  
RX9D  
bit 0  
bit 7  
bit 6  
bit 5  
SPEN: Serial Port Enable bit  
1= Serial port enabled (configures RX/DT and TX/CK pins as serial port pins)  
0= Serial port disabled (held in Reset)  
RX9: 9-bit Receive Enable bit  
1= Selects 9-bit reception  
0= Selects 8-bit reception  
SREN: Single Receive Enable bit  
Asynchronous mode:  
Don’t care.  
Synchronous mode – Master:  
1= Enables single receive  
0= Disables single receive  
This bit is cleared after reception is complete.  
Synchronous mode – Slave:  
Don’t care.  
bit 4  
CREN: Continuous Receive Enable bit  
Asynchronous mode:  
1= Enables receiver  
0= Disables receiver  
Synchronous mode:  
1= Enables continuous receive until enable bit CREN is cleared (CREN overrides SREN)  
0= Disables continuous receive  
bit 3  
ADDEN: Address Detect Enable bit  
Asynchronous mode 9-bit (RX9 = 1):  
1= Enables address detection, enables interrupt and loads the receive buffer when RSR<8>  
is set  
0= Disables address detection, all bytes are received and ninth bit can be used as parity bit  
Asynchronous mode 9-bit (RX9 = 0):  
Don’t care.  
bit 2  
bit 1  
bit 0  
FERR: Framing Error bit  
1= Framing error (can be updated by reading RCREG register and receiving next valid byte)  
0= No framing error  
OERR: Overrun Error bit  
1= Overrun error (can be cleared by clearing bit CREN)  
0= No overrun error  
RX9D: 9th bit of Received Data  
This can be address/data bit or a parity bit and must be calculated by user firmware.  
Legend:  
R = Readable bit  
-n = Value at POR  
W = Writable bit  
‘1’ = Bit is set  
U = Unimplemented bit, read as ‘0’  
‘0’ = Bit is cleared x = Bit is unknown  
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REGISTER 19-3: BAUDCON: BAUD RATE CONTROL REGISTER  
R/W-0  
ABDOVF  
bit 7  
R-1  
R/W-0  
R/W-0  
R/W-0  
U-0  
R/W-0  
WUE  
R/W-0  
RCIDL  
RXDTP  
TXCKP  
BRG16  
ABDEN  
bit 0  
bit 7  
ABDOVF: Auto-Baud Acquisition Rollover Status bit  
1= A BRG rollover has occurred during Auto-Baud Rate Detect mode  
(must be cleared in software)  
0= No BRG rollover has occurred  
bit 6  
bit 5  
RCIDL: Receive Operation Idle Status bit  
1= Receive operation is Idle  
0= Receive operation is active  
RXDTP: Received Data Polarity Select bit  
Asynchronous mode:  
1= Receive data (RX) is inverted (active-low)  
0= Receive data (RX) is not inverted (active-high)  
Synchronous mode:  
No affect.  
bit 4  
TXCKP: Clock and Data Polarity Select bit  
Asynchronous mode:  
1= Idle state for transmit (TX) is a low level  
0= Idle state for transmit (TX) is a high level  
Synchronous mode:  
1= Idle state for clock (CK) is a high level  
0= Idle state for clock (CK) is a low level  
bit 3  
BRG16: 16-bit Baud Rate Register Enable bit  
1= 16-bit Baud Rate Generator – SPBRGH and SPBRG  
0= 8-bit Baud Rate Generator – SPBRG only (Compatible mode), SPBRGH value ignored  
bit 2  
bit 1  
Unimplemented: Read as ‘0’  
WUE: Wake-up Enable bit  
Asynchronous mode:  
1= EUSART will continue to sample the RX pin – interrupt generated on falling edge; bit  
cleared in hardware on following rising edge  
0= RX pin not monitored or rising edge detected  
Synchronous mode:  
Unused in this mode.  
bit 0  
ABDEN: Auto-Baud Detect Enable bit  
Asynchronous mode:  
1= Enable baud rate measurement on the next character. Requires reception of a Sync field  
(55h); cleared in hardware upon completion  
0= Baud rate measurement disabled or completed  
Synchronous mode:  
Unused in this mode.  
Legend:  
R = Readable bit  
-n = Value at POR  
W = Writable bit  
‘1’ = Bit is set  
U = Unimplemented bit, read as ‘0’  
‘0’ = Bit is cleared x = Bit is unknown  
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Writing a new value to the SPBRGH:SPBRG registers  
19.1 Baud Rate Generator (BRG)  
causes the BRG timer to be reset (or cleared). This  
ensures the BRG does not wait for a timer overflow  
before outputting the new baud rate.  
The BRG is a dedicated 8-bit or 16-bit generator that  
supports both the Asynchronous and Synchronous  
modes of the EUSART. By default, the BRG operates  
in 8-bit mode; setting the BRG16 bit (BAUDCON<3>)  
selects 16-bit mode.  
Note:  
A BRG value of 0 is not supported.  
19.1.1  
OPERATION IN POWER-MANAGED  
MODES  
The SPBRGH:SPBRG register pair controls the period  
of a free running timer. In Asynchronous mode, bits  
BRGH (TXSTA<2>) and BRG16 (BAUDCON<3>) also  
control the baud rate. In Synchronous mode, BRGH is  
ignored. Table 19-1 shows the formula for computation  
of the baud rate for different EUSART modes which  
only apply in Master mode (internally generated clock).  
The device clock is used to generate the desired baud  
rate. When one of the power-managed modes is  
entered, the new clock source may be operating at a  
different frequency. This may require an adjustment to  
the value in the SPBRG register pair.  
Given the desired baud rate and FOSC, the nearest  
integer value for the SPBRGH:SPBRG registers can be  
calculated using the formulas in Table 19-1. From this,  
the error in baud rate can be determined. An example  
calculation is shown in Example 19-1. Typical baud  
rates and error values for the various Asynchronous  
modes are shown in Table 19-2. It may be advantageous  
to use the high baud rate (BRGH = 1) or the 16-bit BRG  
to reduce the baud rate error, or achieve a slow baud  
rate for a fast oscillator frequency.  
19.1.2  
SAMPLING  
The data on the RX pin is sampled three times by a  
majority detect circuit to determine if a high or a low  
level is present at the RX pin when SYNC is clear or  
when BRG16 and BRGH are both not set. The data on  
the RX pin is sampled once when SYNC is set or when  
BRGH16 and BRGH are both set.  
TABLE 19-1: BAUD RATE FORMULAS  
Configuration Bits  
BRG/EUSART Mode  
Baud Rate Formula  
SYNC  
BRG16  
BRGH  
0
0
0
0
1
1
0
0
1
1
0
1
0
1
0
1
x
x
8-bit/Asynchronous  
8-bit/Asynchronous  
16-bit/Asynchronous  
16-bit/Asynchronous  
8-bit/Synchronous  
16-bit/Synchronous  
FOSC/[64 (n + 1)]  
FOSC/[16 (n + 1)]  
FOSC/[4 (n + 1)]  
Legend: x= Don’t care, n = value of SPBRGH:SPBRG register pair  
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EXAMPLE 19-1:  
CALCULATING BAUD RATE ERROR  
For a device with FOSC of 16 MHz, desired baud rate of 9600, Asynchronous mode, 8-bit BRG:  
Desired Baud Rate FOSC/(64 ([SPBRGH:SPBRG] + 1))  
Solving for SPBRGH:SPBRG:  
=
X
=
=
=
=
=
=
=
((FOSC/Desired Baud Rate)/64) – 1  
((16000000/9600)/64) – 1  
[25.042] = 25  
16000000/(64 (25 + 1))  
9615  
Calculated Baud Rate  
Error  
(Calculated Baud Rate – Desired Baud Rate)/Desired Baud Rate  
(9615 – 9600)/9600 = 0.16%  
TABLE 19-2: REGISTERS ASSOCIATED WITH BAUD RATE GENERATOR  
Reset Values  
on page  
Name  
Bit 7  
Bit 6  
Bit 5  
Bit 4  
Bit 3  
Bit 2  
Bit 1  
Bit 0  
TXSTA  
RCSTA  
CSRC  
SPEN  
TX9  
RX9  
TXEN  
SREN  
SYNC  
CREN  
TXCKP  
SENDB  
ADDEN  
BRG16  
BRGH  
FERR  
TRMT  
OERR  
WUE  
TX9D  
RX9D  
57  
57  
57  
57  
57  
BAUDCON ABDOVF RCIDL  
RXDTP  
ABDEN  
SPBRGH EUSART Baud Rate Generator Register High Byte  
SPBRG EUSART Baud Rate Generator Register Low Byte  
Legend: — = unimplemented, read as ‘0’. Shaded cells are not used by the BRG.  
DS39689F-page 216  
© 2009 Microchip Technology Inc.  
PIC18F2221/2321/4221/4321 FAMILY  
TABLE 19-3: BAUD RATES FOR ASYNCHRONOUS MODES  
SYNC = 0, BRGH = 0, BRG16 = 0  
BAUD  
RATE  
(K)  
FOSC = 40.000 MHz  
FOSC = 20.000 MHz FOSC = 10.000 MHz  
FOSC = 8.000 MHz  
Actual  
Rate  
(K)  
SPBRG Actual  
value  
SPBRG Actual  
SPBRG Actual  
value  
(decimal)  
SPBRG  
value  
(decimal)  
%
%
Error  
%
Error  
%
Error  
Rate  
(K)  
value  
Rate  
(K)  
Rate  
(K)  
Error  
(decimal)  
(decimal)  
0.3  
1.2  
255  
129  
31  
15  
4
129  
64  
15  
7
1.201  
2.403  
9.615  
-0.16  
-0.16  
-0.16  
103  
51  
12  
1.221  
1.73  
0.16  
1.73  
1.73  
8.51  
-9.58  
1.202  
2.404  
9.766  
19.531  
52.083  
78.125  
0.16  
0.16  
1.73  
1.73  
-9.58  
-32.18  
2.4  
2.441  
9.615  
19.531  
56.818  
125.000  
1.73  
0.16  
1.73  
-1.36  
8.51  
255  
64  
31  
10  
4
2.404  
9.6  
9.766  
19.2  
57.6  
115.2  
19.531  
62.500  
104.167  
2
2
1
SYNC = 0, BRGH = 0, BRG16 = 0  
BAUD  
RATE  
(K)  
FOSC = 4.000 MHz  
FOSC = 2.000 MHz  
FOSC = 1.000 MHz  
Actual  
Rate  
(K)  
SPBRG Actual  
value  
SPBRG Actual  
value  
(decimal)  
SPBRG  
value  
(decimal)  
%
%
Error  
%
Error  
Rate  
(K)  
Rate  
(K)  
Error  
(decimal)  
0.3  
1.2  
0.300  
1.202  
0.16  
0.16  
207  
51  
25  
6
0.300  
1.201  
2.403  
-0.16  
-0.16  
-0.16  
103  
25  
12  
0.300  
1.201  
-0.16  
-0.16  
51  
12  
2.4  
2.404  
0.16  
9.6  
8.929  
-6.99  
8.51  
19.2  
57.6  
115.2  
20.833  
62.500  
62.500  
2
8.51  
0
-45.75  
0
SYNC = 0, BRGH = 1, BRG16 = 0  
BAUD  
RATE  
(K)  
FOSC = 40.000 MHz  
FOSC = 20.000 MHz  
FOSC = 10.000 MHz  
FOSC = 8.000 MHz  
Actual  
Rate  
(K)  
SPBRG Actual  
value  
(decimal)  
SPBRG Actual  
value  
(decimal)  
SPBRG Actual  
value  
(decimal)  
SPBRG  
value  
%
Error  
%
Error  
%
Error  
%
Error  
Rate  
(K)  
Rate  
(K)  
Rate  
(K)  
(decimal)  
0.3  
1.2  
2.4  
2.441  
9.615  
19.531  
56.818  
125.000  
1.73  
0.16  
1.73  
-1.36  
8.51  
255  
64  
31  
10  
4
2.403  
9.615  
19.230  
55.555  
-0.16  
-0.16  
-0.16  
3.55  
207  
51  
25  
8
9.6  
9.766  
19.231  
58.140  
113.636  
1.73  
0.16  
0.94  
-1.36  
255  
129  
42  
9.615  
19.231  
56.818  
113.636  
0.16  
0.16  
-1.36  
-1.36  
129  
64  
21  
10  
19.2  
57.6  
115.2  
21  
SYNC = 0, BRGH = 1, BRG16 = 0  
BAUD  
RATE  
(K)  
FOSC = 4.000 MHz  
FOSC = 2.000 MHz  
FOSC = 1.000 MHz  
Actual  
Rate  
(K)  
SPBRG Actual  
value  
SPBRG Actual  
value  
(decimal)  
SPBRG  
value  
(decimal)  
%
%
Error  
%
Error  
Rate  
(K)  
Rate  
(K)  
Error  
(decimal)  
0.3  
1.2  
207  
103  
25  
12  
3
1.201  
2.403  
9.615  
-0.16  
-0.16  
-0.16  
103  
51  
12  
0.300  
1.201  
2.403  
-0.16  
-0.16  
-0.16  
207  
51  
25  
1.202  
0.16  
0.16  
0.16  
0.16  
8.51  
8.51  
2.4  
2.404  
9.6  
9.615  
19.2  
57.6  
115.2  
19.231  
62.500  
125.000  
1
© 2009 Microchip Technology Inc.  
DS39689F-page 217  
PIC18F2221/2321/4221/4321 FAMILY  
TABLE 19-3: BAUD RATES FOR ASYNCHRONOUS MODES (CONTINUED)  
SYNC = 0, BRGH = 0, BRG16 = 1  
BAUD  
RATE  
(K)  
FOSC = 40.000 MHz  
FOSC = 20.000 MHz  
FOSC = 10.000 MHz  
FOSC = 8.000 MHz  
Actual  
Rate  
(K)  
SPBRG Actual  
value  
SPBRG Actual  
value  
(decimal)  
SPBRG Actual  
value  
(decimal)  
SPBRG  
value  
(decimal)  
%
%
Error  
%
Error  
%
Error  
Rate  
(K)  
Rate  
(K)  
Rate  
(K)  
Error  
(decimal)  
0.3  
1.2  
0.300  
1.200  
0.00  
0.02  
0.06  
0.16  
0.16  
0.94  
-1.36  
8332  
2082  
1040  
259  
129  
42  
0.300  
1.200  
0.02  
-0.03  
-0.03  
0.16  
4165  
1041  
520  
129  
64  
0.300  
1.200  
0.02  
-0.03  
0.16  
0.16  
1.73  
-1.36  
8.51  
2082  
520  
259  
64  
0.300  
1.201  
2.403  
9.615  
19.230  
55.555  
-0.04  
-0.16  
-0.16  
-0.16  
-0.16  
3.55  
1665  
415  
207  
51  
2.4  
2.402  
2.399  
2.404  
9.6  
9.615  
9.615  
9.615  
19.2  
57.6  
115.2  
19.231  
58.140  
113.636  
19.231  
56.818  
113.636  
0.16  
19.531  
56.818  
125.000  
31  
25  
-1.36  
-1.36  
21  
10  
8
21  
10  
4
SYNC = 0, BRGH = 0, BRG16 = 1  
BAUD  
RATE  
(K)  
FOSC = 4.000 MHz  
FOSC = 2.000 MHz  
FOSC = 1.000 MHz  
Actual  
Rate  
(K)  
SPBRG Actual  
value  
SPBRG Actual  
value  
(decimal)  
SPBRG  
value  
(decimal)  
%
%
Error  
%
Error  
Rate  
(K)  
Rate  
(K)  
Error  
(decimal)  
0.3  
1.2  
0.300  
1.202  
0.04  
0.16  
0.16  
0.16  
0.16  
8.51  
8.51  
832  
207  
103  
25  
12  
3
0.300  
1.201  
2.403  
9.615  
-0.16  
-0.16  
-0.16  
-0.16  
415  
103  
51  
12  
0.300  
1.201  
2.403  
-0.16  
-0.16  
-0.16  
207  
51  
25  
2.4  
2.404  
9.6  
9.615  
19.2  
57.6  
115.2  
19.231  
62.500  
125.000  
1
SYNC = 0, BRGH = 1, BRG16 = 1 or SYNC = 1, BRG16 = 1  
FOSC = 20.000 MHz FOSC = 10.000 MHz  
BAUD  
RATE  
(K)  
FOSC = 40.000 MHz  
FOSC = 8.000 MHz  
Actual  
Rate  
(K)  
SPBRG Actual  
SPBRG Actual  
SPBRG Actual  
value  
SPBRG  
value  
(decimal)  
%
Error  
%
%
%
Error  
value  
(decimal)  
Rate  
(K)  
value  
Rate  
(K)  
Rate  
(K)  
Error  
Error  
(decimal)  
(decimal)  
0.3  
1.2  
0.300  
1.200  
0.00  
0.00  
0.02  
0.06  
-0.03  
0.35  
-0.22  
33332  
8332  
4165  
1040  
520  
0.300  
1.200  
0.00  
0.02  
0.02  
-0.03  
0.16  
-0.22  
0.94  
16665  
4165  
2082  
520  
259  
86  
0.300  
1.200  
0.00  
0.02  
0.06  
0.16  
0.16  
0.94  
-1.36  
8332  
2082  
1040  
259  
129  
42  
0.300  
1.200  
-0.01  
-0.04  
-0.04  
-0.16  
-0.16  
0.79  
6665  
1665  
832  
207  
103  
34  
2.4  
2.400  
2.400  
2.402  
2.400  
9.6  
9.606  
9.596  
9.615  
9.615  
19.2  
57.6  
115.2  
19.193  
57.803  
114.943  
19.231  
57.471  
116.279  
19.231  
58.140  
113.636  
19.230  
57.142  
117.647  
172  
86  
42  
21  
-2.12  
16  
SYNC = 0, BRGH = 1, BRG16 = 1 or SYNC = 1, BRG16 = 1  
FOSC = 4.000 MHz FOSC = 2.000 MHz FOSC = 1.000 MHz  
BAUD  
RATE  
(K)  
Actual  
Rate  
(K)  
SPBRG Actual  
SPBRG Actual  
SPBRG  
value  
(decimal)  
%
Error  
%
Error  
%
Error  
value  
Rate  
(K)  
value  
Rate  
(K)  
(decimal)  
(decimal)  
0.3  
1.2  
0.300  
1.200  
0.01  
0.04  
0.16  
0.16  
0.16  
2.12  
-3.55  
3332  
832  
415  
103  
51  
0.300  
1.201  
2.403  
9.615  
19.230  
55.555  
-0.04  
-0.16  
-0.16  
-0.16  
-0.16  
3.55  
1665  
415  
207  
51  
0.300  
1.201  
2.403  
9.615  
19.230  
-0.04  
-0.16  
-0.16  
-0.16  
-0.16  
832  
207  
103  
25  
2.4  
2.404  
9.6  
9.615  
19.2  
57.6  
115.2  
19.231  
58.824  
111.111  
25  
12  
16  
8
8
DS39689F-page 218  
© 2009 Microchip Technology Inc.  
PIC18F2221/2321/4221/4321 FAMILY  
19.1.3  
AUTO-BAUD RATE DETECT  
Note 1: If the WUE bit is set with the ABDEN bit,  
Auto-Baud Rate Detection will occur on  
the byte following the Break character.  
The Enhanced USART module supports the automatic  
detection and calibration of baud rate. This feature is  
active only in Asynchronous mode and while the WUE  
bit is clear.  
2: It is up to the user to determine that the  
incoming character baud rate is within the  
range of the selected BRG clock source.  
Some combinations of oscillator frequency  
and EUSART baud rates are not possible  
due to bit error rates. Overall system  
timing and communication baud rates  
must be taken into consideration when  
using the Auto-Baud Rate Detection  
feature.  
The automatic baud rate measurement sequence  
(Figure 19-1) begins whenever a Start bit is received  
and the ABDEN bit is set. The calculation is  
self-averaging.  
In the Auto-Baud Rate Detect (ABD) mode, the clock to  
the BRG is reversed. Rather than the BRG clocking the  
incoming RX signal, the RX signal is timing the BRG. In  
ABD mode, the internal Baud Rate Generator is used  
as a counter to time the bit period of the incoming serial  
byte stream.  
3: To maximize the baud rate range, it is  
recommended to set the BRG16 bit if the  
auto-baud feature is used.  
Once the ABDEN bit is set, the state machine will clear  
the BRG and look for a Start bit. The Auto-Baud Rate  
Detect must receive a byte with the value 55h (ASCII  
“U”, which is also the LIN/J2602 bus Sync character) in  
order to calculate the proper bit rate. The measurement  
is taken over both a low and a high bit time in order to  
minimize any effects caused by asymmetry of the incom-  
ing signal. After a Start bit, the SPBRG begins counting  
up, using the preselected clock source on the first rising  
edge of RX. After eight bits on the RX pin, or the fifth ris-  
ing edge, an accumulated value totalling the proper BRG  
period is left in the SPBRGH:SPBRG register pair. Once  
the 5th edge is seen (this should correspond to the Stop  
bit), the ABDEN bit is automatically cleared.  
TABLE 19-4: BRG COUNTER  
CLOCK RATES  
BRG16 BRGH  
BRG Counter Clock  
0
0
1
1
0
1
0
1
FOSC/512  
FOSC/128  
FOSC/128  
FOSC/32  
19.1.3.1  
ABD and EUSART Transmission  
Since the BRG clock is reversed during ABD acquisi-  
tion, the EUSART transmitter cannot be used during  
ABD. This means that whenever the ABDEN bit is set,  
TXREG cannot be written to. Users should also ensure  
that ABDEN does not become set during a transmit  
sequence. Failing to do this may result in unpredictable  
EUSART operation.  
If a rollover of the BRG occurs (an overflow from FFFFh  
to 0000h), the event is trapped by the ABDOVF status  
bit (BAUDCON<7>). It is set in hardware by BRG  
rollovers and can be set or cleared by the user in  
software. ABD mode remains active after rollover  
events and the ABDEN bit remains set (Figure 19-2).  
While calibrating the baud rate period, the BRG  
registers are clocked at 1/8th the preconfigured clock  
rate. Note that the BRG clock can be configured by the  
BRG16 and BRGH bits. The BRG16 bit must be set to  
use both SPBRG1 and SPBRGH1 as a 16-bit counter  
This allows the user to verify that no carry occurred for  
8-bit modes by checking for 00h in the SPBRGH  
register. Refer to Table 19-4 for counter clock rates to  
the BRG.  
While the ABD sequence takes place, the EUSART  
state machine is held in Idle. The RCIF interrupt is set  
once the fifth rising edge on RX is detected. The value  
in the RCREG needs to be read to clear the RCIF  
interrupt. ThecontentsofRCREG shouldbediscarded.  
© 2009 Microchip Technology Inc.  
DS39689F-page 219  
PIC18F2221/2321/4221/4321 FAMILY  
FIGURE 19-1:  
AUTOMATIC BAUD RATE CALCULATION  
BRG Value  
RX pin  
XXXXh  
0000h  
001Ch  
Edge #5  
Stop Bit  
Edge #2  
Bit 3  
Edge #3  
Bit 5  
Edge #4  
Bit 7  
Bit 6  
Edge #1  
Bit 1  
Start  
Bit 0  
Bit 2  
Bit 4  
BRG Clock  
Auto-Cleared  
Set by User  
ABDEN bit  
RCIF bit  
(Interrupt)  
Read  
RCREG  
XXXXh  
XXXXh  
1Ch  
00h  
SPBRG  
SPBRGH  
Note: The ABD sequence requires the EUSART module to be configured in Asynchronous mode and WUE = 0.  
FIGURE 19-2:  
BRG OVERFLOW SEQUENCE  
BRG Clock  
ABDEN bit  
RX pin  
Start  
Bit 0  
ABDOVF bit  
BRG Value  
FFFFh  
XXXXh  
0000h  
0000h  
DS39689F-page 220  
© 2009 Microchip Technology Inc.  
PIC18F2221/2321/4221/4321 FAMILY  
Once the TXREG register transfers the data to the TSR  
19.2 EUSART Asynchronous Mode  
register (occurs in one TCY), the TXREG register is empty  
and the TXIF flag bit (PIR1<4>) is set. This interrupt can  
be enabled or disabled by setting or clearing the interrupt  
enable bit, TXIE (PIE1<4>). TXIF will be set regardless of  
the state of TXIE; it cannot be cleared in software. TXIF  
is also not cleared immediately upon loading TXREG, but  
becomes valid in the second instruction cycle following  
the load instruction. Polling TXIF immediately following a  
load of TXREG will return invalid results.  
The Asynchronous mode of operation is selected by  
clearing the SYNC bit (TXSTA<4>). In this mode, the  
EUSART uses standard Non-Return-to-Zero (NRZ)  
format (one Start bit, eight or nine data bits and one  
Stop bit). The most common data format is 8 bits. An  
on-chip dedicated 8-bit/16-bit Baud Rate Generator  
can be used to derive standard baud rate frequencies  
from the oscillator.  
The EUSART transmits and receives the LSb first. The  
EUSART’s transmitter and receiver are functionally  
independent but use the same data format and baud  
rate. The Baud Rate Generator produces a clock, either  
x16 or x64 of the bit shift rate depending on the BRGH  
and BRG16 bits (TXSTA<2> and BAUDCON<3>). Parity  
is not supported by the hardware but can be  
implemented in software and stored as the 9th data bit.  
While TXIF indicates the status of the TXREG register,  
another bit, TRMT (TXSTA<1>), shows the status of  
the TSR register. TRMT is a read-only bit which is set  
when the TSR register is empty. No interrupt logic is  
tied to this bit so the user has to poll this bit in order to  
determine if the TSR register is empty.  
The TXCKP bit (BAUDCON<4>) allows the TX signal to  
be inverted (polarity reversed). Devices that buffer  
signals from TTL to RS-232 levels also invert the signal  
(when TTL = 1, RS-232 = negative). Inverting the  
polarity of the TX pin data by setting the TXCKP bit  
allows for use of circuits that provide buffering without  
inverting the signal.  
The  
TXCKP  
(BAUDCON<4>)  
and  
RXDTP  
(BAUDCON<5>) bits allow the TX and RX signals to be  
inverted (polarity reversed). Devices that buffer signals  
between TTL and RS-232 levels also invert the signal.  
Setting the TXCKP and RXDTP bits allows for the use of  
circuits that provide buffering without inverting the signal.  
Note 1: The TSR register is not mapped in data  
In Asynchronous mode, clock polarity is selected with  
the TXCKP bit (BAUDCON<4>). Setting TXCKP sets  
the Idle state on CK as high, while clearing the bit sets  
the Idle state as low. Data polarity is selected with the  
RXDTP bit (BAUDCON<5>). Setting RXDTP inverts  
data on RX, while clearing the bit has no affect on  
received data.  
memory so it is not available to the user.  
2: Flag bit TXIF is set when enable bit TXEN  
is set.  
To set up an Asynchronous Transmission:  
1. Initialize the SPBRGH:SPBRG registers for the  
appropriate baud rate. Set or clear the BRGH  
and BRG16 bits, as required, to achieve the  
desired baud rate.  
When operating in Asynchronous mode, the EUSART  
module consists of the following important elements:  
• Baud Rate Generator  
2. Enable the asynchronous serial port by clearing  
bit, SYNC, and setting bit, SPEN.  
• Sampling Circuit  
• Asynchronous Transmitter  
• Asynchronous Receiver  
• Auto-Wake-up on Break signal  
• 12-bit Break Character Transmit  
• Auto-Baud Rate Detection  
• Pin State Polarity  
3. If the signal from the TX pin is to be inverted, set  
the TXCKP bit.  
4. If interrupts are desired, set enable bit, TXIE.  
5. If 9-bit transmission is desired, set transmit bit,  
TX9; can be used as address/data bit.  
6. Enable the transmission by setting bit, TXEN,  
which will also set bit, TXIF.  
19.2.1  
EUSART ASYNCHRONOUS  
TRANSMITTER  
7. If 9-bit transmission is selected, the ninth bit  
should be loaded in bit, TX9D.  
8. Load data to the TXREG register (starts  
transmission).  
The EUSART transmitter block diagram is shown in  
Figure 19-3. The heart of the transmitter is the Transmit  
(Serial) Shift Register (TSR). The Shift register obtains  
its data from the Read/Write Transmit Buffer register,  
TXREG. The TXREG register is loaded with data in  
software. The TSR register is not loaded until the Stop  
bit has been transmitted from the previous load. As  
soon as the Stop bit is transmitted, the TSR is loaded  
with new data from the TXREG register (if available).  
9. If using interrupts, ensure that the GIE and PEIE  
bits in the INTCON register (INTCON<7:6>) are  
set.  
© 2009 Microchip Technology Inc.  
DS39689F-page 221  
PIC18F2221/2321/4221/4321 FAMILY  
FIGURE 19-3:  
EUSART TRANSMIT BLOCK DIAGRAM  
Data Bus  
TXIF  
TXREG Register  
8
TXCKP  
TXIE  
MSb  
(8)  
LSb  
0
Pin Buffer  
and Control  
• •  
TSR Register  
TX pin  
Interrupt  
Baud Rate CLK  
SPBRG  
TXEN  
TRMT  
SPEN  
BRG16  
SPBRGH  
TX9  
Baud Rate Generator  
TX9D  
FIGURE 19-4:  
ASYNCHRONOUS TRANSMISSION, TXCKP = 0 (TX NOT INVERTED)  
Write to TXREG  
Word 1  
BRG Output  
(Shift Clock)  
TX (pin)  
Start bit  
bit 0  
bit 1  
Word 1  
bit 7/8  
Stop bit  
TXIF bit  
(Transmit Buffer  
Reg. Empty Flag)  
1 TCY  
Word 1  
Transmit Shift Reg  
TRMT bit  
(Transmit Shift  
Reg. Empty Flag)  
FIGURE 19-5:  
ASYNCHRONOUS TRANSMISSION (BACK TO BACK),  
TXCKP = 0 (TX NOT INVERTED)  
Write to TXREG  
Word 2  
Start bit  
Word 1  
BRG Output  
(Shift Clock)  
TX (pin)  
Start bit  
Word 2  
bit 0  
bit 1  
Word 1  
bit 7/8  
bit 0  
Stop bit  
1 TCY  
TXIF bit  
(Interrupt Reg. Flag)  
1 TCY  
Word 1  
Transmit Shift Reg.  
Word 2  
Transmit Shift Reg.  
TRMT bit  
(Transmit Shift  
Reg. Empty Flag)  
Note: This timing diagram shows two consecutive transmissions.  
DS39689F-page 222  
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TABLE 19-5: REGISTERS ASSOCIATED WITH ASYNCHRONOUS TRANSMISSION  
Reset  
Name  
Bit 7  
Bit 6  
Bit 5  
Bit 4  
Bit 3  
Bit 2  
Bit 1  
Bit 0  
Values  
on page  
INTCON  
PIR1  
GIE/GIEH PEIE/GIEL TMR0IE  
INT0IE  
TXIF  
RBIE  
SSPIF  
SSPIE  
SSPIP  
ADDEN  
TMR0IF  
INT0IF  
RBIF  
55  
58  
58  
58  
57  
57  
57  
57  
57  
57  
PSPIF(1)  
PSPIE(1)  
PSPIP(1)  
SPEN  
ADIF  
ADIE  
ADIP  
RX9  
RCIF  
RCIE  
RCIP  
SREN  
CCP1IF TMR2IF TMR1IF  
CCP1IE TMR2IE TMR1IE  
CCP1IP TMR2IP TMR1IP  
PIE1  
TXIE  
IPR1  
TXIP  
RCSTA  
TXREG  
TXSTA  
BAUDCON  
SPBRGH  
SPBRG  
CREN  
FERR  
OERR  
RX9D  
EUSART Transmit Register  
CSRC  
TX9  
TXEN  
SYNC  
SENDB  
BRG16  
BRGH  
TRMT  
WUE  
TX9D  
ABDOVF  
RCIDL  
RXDTP  
TXCKP  
ABDEN  
EUSART Baud Rate Generator Register High Byte  
EUSART Baud Rate Generator Register Low Byte  
Legend: — = unimplemented locations read as ‘0’. Shaded cells are not used for asynchronous transmission.  
Note 1: These bits are unimplemented on 28-pin devices and read as ‘0’.  
© 2009 Microchip Technology Inc.  
DS39689F-page 223  
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19.2.2  
EUSART ASYNCHRONOUS  
RECEIVER  
19.2.3  
SETTING UP 9-BIT MODE WITH  
ADDRESS DETECT  
The receiver block diagram is shown in Figure 19-6.  
The data is received on the RX pin and drives the data  
recovery block. The data recovery block is actually a  
high-speed shifter operating at x16 times the baud rate,  
whereas the main receive serial shifter operates at the  
bit rate or at FOSC. This mode would typically be used  
in RS-232 systems.  
This mode would typically be used in RS-485 systems.  
To set up an Asynchronous Reception with Address  
Detect Enable:  
1. Initialize the SPBRGH:SPBRG registers for the  
appropriate baud rate. Set or clear the BRGH  
and BRG16 bits, as required, to achieve the  
desired baud rate.  
The RXDTP bit (BAUDCON<5>) allows the RX signal to  
be inverted (polarity reversed). Devices that buffer  
signals from RS-232 to TTL levels also perform an inver-  
sion of the signal (when RS-232 = positive, TTL = 0).  
Inverting the polarity of the RX pin data by setting the  
RXDTP bit allows for the use of circuits that provide  
buffering without inverting the signal.  
2. Enable the asynchronous serial port by clearing  
the SYNC bit and setting the SPEN bit.  
3. If the signal at the RX pin is to be inverted, set  
the RXDTP bit. If the signal from the TX pin is to  
be inverted, set the TXCKP bit.  
4. If interrupts are required, set the RCEN bit and  
select the desired priority level with the RCIP bit.  
To set up an Asynchronous Reception:  
5. Set the RX9 bit to enable 9-bit reception.  
6. Set the ADDEN bit to enable address detect.  
7. Enable reception by setting the CREN bit.  
1. Initialize the SPBRGH:SPBRG registers for the  
appropriate baud rate. Set or clear the BRGH  
and BRG16 bits, as required, to achieve the  
desired baud rate.  
8. The RCIF bit will be set when reception is  
complete. The interrupt will be Acknowledged if  
the RCIE and GIE bits are set.  
2. Enable the asynchronous serial port by clearing  
bit, SYNC, and setting bit, SPEN.  
9. Read the RCSTA register to determine if any  
error occurred during reception, as well as read  
bit 9 of data (if applicable).  
3. If the signal at the RX pin is to be inverted, set  
the RXDTP bit.  
4. If interrupts are desired, set enable bit, RCIE.  
5. If 9-bit reception is desired, set bit, RX9.  
6. Enable the reception by setting bit, CREN.  
10. Read RCREG to determine if the device is being  
addressed.  
11. If any error occurred, clear the CREN bit.  
7. Flag bit, RCIF, will be set when reception is  
complete and an interrupt will be generated if  
enable bit, RCIE, was set.  
12. If the device has been addressed, clear the  
ADDEN bit to allow all received data into the  
receive buffer and interrupt the CPU.  
8. Read the RCSTA register to get the 9th bit (if  
enabled) and determine if any error occurred  
during reception.  
9. Read the 8-bit received data by reading the  
RCREG register.  
10. If any error occurred, clear the error by clearing  
enable bit, CREN.  
11. If using interrupts, ensure that the GIE and PEIE  
bits in the INTCON register (INTCON<7:6>) are  
set.  
DS39689F-page 224  
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FIGURE 19-6:  
EUSART RECEIVE BLOCK DIAGRAM  
CREN  
OERR  
FERR  
x64 Baud Rate CLK  
SPBRGH SPBRG  
÷ 64  
or  
RSR Register  
• • •  
MSb  
Stop  
LSb  
Start  
BRG16  
÷ 16  
(8)  
7
1
0
or  
÷ 4  
Baud Rate Generator  
RX9  
Pin Buffer  
and Control  
Data  
Recovery  
RX  
RX9D  
RCREG Register  
FIFO  
RXDTP  
SPEN  
8
Data Bus  
Interrupt  
RCIF  
RCIE  
FIGURE 19-7:  
ASYNCHRONOUS RECEPTION, TXCKP = 0 (TX NOT INVERTED)  
Start  
bit  
Start  
bit  
Start  
bit  
RX (pin)  
Stop  
bit  
Stop  
bit  
Stop  
bit  
bit 0 bit 1  
bit 7/8  
bit 7/8  
bit 0  
bit 7/8  
Rcv Shift Reg  
Rcv Buffer Reg  
Word 2  
RCREG  
Word 1  
RCREG  
Read Rcv  
Buffer Reg  
RCREG  
RCIF  
(Interrupt Flag)  
OERR bit  
CREN  
Note: This timing diagram shows three words appearing on the RX input. The RCREG (receive buffer) is read after the third word causing  
the OERR (overrun) bit to be set.  
TABLE 19-6: REGISTERS ASSOCIATED WITH ASYNCHRONOUS RECEPTION  
Reset  
Name  
Bit 7  
Bit 6  
Bit 5  
Bit 4  
Bit 3  
Bit 2  
Bit 1  
Bit 0  
Values  
on page  
INTCON  
PIR1  
GIE/GIEH PEIE/GIEL TMR0IE  
INT0IE  
TXIF  
RBIE  
SSPIF  
SSPIE  
SSPIP  
ADDEN  
TMR0IF  
INT0IF  
RBIF  
55  
58  
58  
58  
57  
57  
57  
57  
57  
57  
PSPIF(1)  
PSPIE(1)  
PSPIP(1)  
SPEN  
ADIF  
ADIE  
ADIP  
RX9  
RCIF  
RCIE  
RCIP  
SREN  
CCP1IF TMR2IF TMR1IF  
CCP1IE TMR2IE TMR1IE  
CCP1IP TMR2IP TMR1IP  
PIE1  
TXIE  
IPR1  
TXIP  
RCSTA  
RCREG  
TXSTA  
CREN  
FERR  
OERR  
RX9D  
EUSART Receive Register  
CSRC  
TX9  
TXEN  
SYNC  
SENDB  
BRG16  
BRGH  
TRMT  
WUE  
TX9D  
BAUDCON ABDOVF  
RCIDL  
RXDTP  
TXCKP  
ABDEN  
SPBRGH  
SPBRG  
EUSART Baud Rate Generator Register High Byte  
EUSART Baud Rate Generator Register Low Byte  
Legend: — = unimplemented locations read as ‘0’. Shaded cells are not used for asynchronous reception.  
Note 1: These bits are unimplemented on 28-pin devices and read as ‘0’.  
© 2009 Microchip Technology Inc.  
DS39689F-page 225  
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and cause data or framing errors. To work properly,  
therefore, the initial character in the transmission must  
be all ‘0’s. This can be 00h (8 bytes) for standard RS-232  
devices or 000h (12 bits) for the LIN/J2602 bus.  
19.2.4  
AUTO-WAKE-UP ON SYNC  
BREAK CHARACTER  
During Sleep mode, all clocks to the EUSART are  
suspended. Because of this, the Baud Rate Generator  
is inactive and a proper byte reception cannot be per-  
formed. The auto-wake-up feature allows the controller  
to wake-up due to activity on the RX/DT line while the  
EUSART is operating in Asynchronous mode.  
Oscillator start-up time must also be considered,  
especially in applications using oscillators with longer  
start-up intervals (i.e., XT or HS mode). The Sync  
Break (or Wake-up Signal) character must be of  
sufficient length and be followed by a sufficient interval  
to allow enough time for the selected oscillator to start  
and provide proper initialization of the EUSART.  
The auto-wake-up feature is enabled by setting the  
WUE bit (BAUDCON<1>). Once set, the typical receive  
sequence on RX/DT is disabled and the EUSART  
remains in an Idle state, monitoring for a wake-up event  
independent of the CPU mode. A wake-up event  
consists of a high-to-low transition on the RX/DT line.  
(This coincides with the start of a Sync Break or a  
Wake-up Signal character for the LIN/J2602 protocol.)  
19.2.4.2  
Special Considerations Using  
the WUE Bit  
The timing of WUE and RCIF events may cause some  
confusion when it comes to determining the validity of  
received data. As noted, setting the WUE bit places the  
EUSART in an Idle mode. The wake-up event causes a  
receive interrupt by setting the RCIF bit. The WUE bit is  
cleared after this when a rising edge is seen on RX/DT.  
The interrupt condition is then cleared by reading the  
RCREG register. Ordinarily, the data in RCREG will be  
dummy data and should be discarded.  
Following a wake-up event, the module generates an  
RCIF interrupt. The interrupt is generated synchro-  
nously to the Q clocks in normal operating modes  
(Figure 19-8) and asynchronously, if the device is in  
Sleep mode (Figure 19-9). The interrupt condition is  
cleared by reading the RCREG register.  
The WUE bit is automatically cleared once a low-to-  
high transition is observed on the RX line following the  
wake-up event. At this point, the EUSART module is in  
Idle mode and returns to normal operation. This signals  
to the user that the Sync Break event is over.  
The fact that the WUE bit has been cleared (or is still  
set) and the RCIF flag is set should not be used as an  
indicator of the integrity of the data in RCREG. Users  
should consider implementing a parallel method in  
firmware to verify received data integrity.  
To assure that no actual data is lost, check the RCIDL  
bit to verify that a receive operation is not in process. If  
a receive operation is not occurring, the WUE bit may  
then be set just prior to entering the Sleep mode.  
19.2.4.1  
Special Considerations Using  
Auto-Wake-up  
Since auto-wake-up functions by sensing rising edge  
transitions on RX/DT, information with any state changes  
before the Stop bit may signal a false end-of-character  
FIGURE 19-8:  
AUTO-WAKE-UP BIT (WUE) TIMINGS DURING NORMAL OPERATION  
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4  
OSC1  
WUE bit(1)  
RX/DT Line  
RCIF  
Bit set by user  
Auto-Cleared  
Cleared due to user read of RCREG  
Note 1: The EUSART remains in Idle while the WUE bit is set.  
FIGURE 19-9:  
AUTO-WAKE-UP BIT (WUE) TIMINGS DURING SLEEP  
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4  
Q1  
Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4  
OSC1  
WUE bit(2)  
RX/DT Line  
RCIF  
Bit set by user  
Auto-Cleared  
Note 1  
Cleared due to user read of RCREG  
Sleep Ends  
Sleep Command Executed  
Note 1: If the wake-up event requires long oscillator warm-up time, the auto-clear of the WUE bit can occur before the oscillator is ready. This  
sequence should not depend on the presence of Q clocks.  
2: The EUSART remains in Idle while the WUE bit is set.  
DS39689F-page 226  
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1. Configure the EUSART for the desired mode.  
19.2.5  
BREAK CHARACTER SEQUENCE  
2. Set the TXEN and SENDB bits to set up the  
Break character.  
The EUSART module has the capability of sending the  
special Break character sequences that are required by  
the LIN/J2602 bus standard. The Break character  
transmit consists of a Start bit, followed by twelve ‘0’  
bits and a Stop bit. The Frame Break character is sent  
whenever the SENDB and TXEN bits (TXSTA<3> and  
TXSTA<5>) are set while the Transmit Shift register is  
loaded with data. Note that the value of data written to  
TXREG will be ignored and all ‘0’s will be transmitted.  
3. Load the TXREG with a dummy character to  
initiate transmission (the value is ignored).  
4. Write ‘55h’ to TXREG to load the Sync character  
into the transmit FIFO buffer.  
5. After the Break has been sent, the SENDB bit is  
reset by hardware. The Sync character now  
transmits in the preconfigured mode.  
The SENDB bit is automatically reset by hardware after  
the corresponding Stop bit is sent. This allows the user  
to preload the transmit FIFO with the next transmit byte  
following the Break character (typically, the Sync  
character in the LIN/J2602 specification).  
When the TXREG becomes empty, as indicated by the  
TXIF, the next data byte can be written to TXREG.  
19.2.6  
RECEIVING A BREAK CHARACTER  
The Enhanced USART module can receive a Break  
character in two ways.  
Note that the data value written to the TXREG for the  
Break character is ignored. The write simply serves the  
purpose of initiating the proper sequence.  
The first method forces configuration of the baud rate  
at a frequency of 9/13 the typical speed. This allows for  
the Stop bit transition to be at the correct sampling loca-  
tion (13 bits for Break versus Start bit and 8 data bits for  
typical data).  
The TRMT bit indicates when the transmit operation is  
active or Idle, just as it does during normal transmis-  
sion. See Figure 19-10 for the timing of the Break  
character sequence.  
The second method uses the auto-wake-up feature  
described in Section 19.2.4 “Auto-Wake-up on Sync  
Break Character”. By enabling this feature, the  
EUSART will sample the next two transitions on RX/DT,  
cause an RCIF interrupt and receive the next data byte  
followed by another interrupt.  
19.2.5.1  
Break and Sync Transmit Sequence  
The following sequence will send a message frame  
header made up of a Break, followed by an Auto-Baud  
Sync byte. This sequence is typical of a LIN/J2602 bus  
master.  
Note that following a Break character, the user will  
typically want to enable the Auto-Baud Rate Detect  
feature. For both methods, the user can set the ABD bit  
once the TXIF interrupt is observed.  
FIGURE 19-10:  
SEND BREAK CHARACTER SEQUENCE  
Write to TXREG  
Dummy Write  
BRG Output  
(Shift Clock)  
TX (pin)  
Start Bit  
Bit 0  
Bit 1  
Break  
Bit 11  
Stop Bit  
TXIF bit  
(Transmit Buffer  
Reg. Empty Flag)  
TRMT bit  
(Transmit Shift  
Reg. Empty Flag)  
SENDB sampled here  
Auto-Cleared  
SENDB  
(Transmit Shift  
Reg. Empty Flag)  
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Once the TXREG register transfers the data to the TSR  
19.3 EUSART Synchronous  
Master Mode  
register (occurs in one TCY), the TXREG is empty and  
the TXIF flag bit (PIR1<4>) is set. The interrupt can be  
enabled or disabled by setting or clearing the interrupt  
enable bit, TXIE (PIE1<4>). TXIF is set regardless of  
the state of enable bit TXIE; it cannot be cleared in  
software. It will reset only when new data is loaded into  
the TXREG register.  
The Master mode indicates that the processor trans-  
mits the master clock on the CK line. The Synchronous  
Master mode is entered by setting the CSRC bit  
(TXSTA<7>). In this mode, the data is transmitted in a  
half-duplex manner (i.e., transmission and reception do  
not occur at the same time). When transmitting data,  
the reception is inhibited and vice versa. Synchronous  
mode is entered by setting bit SYNC (TXSTA<4>). In  
addition, enable bit SPEN (RCSTA<7>) is set in order  
to configure the TX and RX pins to CK (clock) and DT  
(data) lines, respectively.  
While flag bit TXIF indicates the status of the TXREG  
register, another bit, TRMT (TXSTA<1>), shows the  
status of the TSR register. TRMT is a read-only bit which  
is set when the TSR is empty. No interrupt logic is tied to  
this bit so the user has to poll this bit in order to deter-  
mine if the TSR register is empty. The TSR is not  
mapped in data memory so it is not available to the user.  
The Master mode indicates that the processor  
transmits the master clock on the CK line.  
To set up a Synchronous Master Transmission:  
Clock polarity (CK) is selected with the TXCKP bit  
(BAUDCON<4>). Setting TXCKP sets the Idle state on  
CK as high, while clearing the bit sets the Idle state as  
low.  
1. Initialize the SPBRGH:SPBRG registers for the  
appropriate baud rate. Set or clear the BRG16  
bit, as required, to achieve the desired baud rate.  
2. Enable the synchronous master serial port by  
setting bits, SYNC, SPEN and CSRC.  
19.3.1  
EUSART SYNCHRONOUS MASTER  
TRANSMISSION  
3. If the signal from the CK pin is to be inverted, set  
the TXCKP bit.  
The EUSART transmitter block diagram is shown in  
Figure 19-3. The heart of the transmitter is the Transmit  
(Serial) Shift Register (TSR). The Shift register obtains  
its data from the Read/Write Transmit Buffer register,  
TXREG. The TXREG register is loaded with data in  
software. The TSR register is not loaded until the last  
bit has been transmitted from the previous load. As  
soon as the last bit is transmitted, the TSR is loaded  
with new data from the TXREG (if available).  
4. If interrupts are desired, set enable bit, TXIE.  
5. If 9-bit transmission is desired, set bit, TX9.  
6. Enable the transmission by setting bit, TXEN.  
7. If 9-bit transmission is selected, the ninth bit  
should be loaded in bit, TX9D.  
8. Start transmission by loading data to the TXREG  
register.  
9. If using interrupts, ensure that the GIE and PEIE  
bits in the INTCON register (INTCON<7:6>) are  
set.  
FIGURE 19-11:  
SYNCHRONOUS TRANSMISSION  
Q1 Q2 Q3Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1Q2 Q3 Q4 Q1Q2 Q3 Q4  
Q3 Q4 Q1 Q2 Q3Q4 Q1Q2 Q3Q4 Q1 Q2Q3 Q4 Q1 Q2Q3 Q4 Q1Q2 Q3 Q4 Q1 Q2 Q3 Q4  
RC7/RX/DT  
bit 0  
bit 1  
bit 2  
bit 7  
bit 0  
bit 1  
bit 7  
Word 2  
Word 1  
RC6/TX/CK pin  
(TXCKP = 0)  
RC6/TX/CK pin  
(TXCKP = 1)  
Write to  
TXREG Reg  
Write Word 1  
Write Word 2  
TXIF bit  
(Interrupt Flag)  
TRMT bit  
TXEN bit  
1’  
1’  
Note: Sync Master mode, SPBRG = 0, continuous transmission of two 8-bit words.  
DS39689F-page 228  
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FIGURE 19-12:  
SYNCHRONOUS TRANSMISSION (THROUGH TXEN)  
RC7/RX/DT pin  
bit 0  
bit 2  
bit 1  
bit 6  
bit 7  
RC6/TX/CK pin  
Write to  
TXREG reg  
TXIF bit  
TRMT bit  
TXEN bit  
TABLE 19-7: REGISTERS ASSOCIATED WITH SYNCHRONOUS MASTER TRANSMISSION  
Reset  
Values  
on page  
Name  
Bit 7  
Bit 6  
Bit 5  
Bit 4  
Bit 3  
Bit 2  
Bit 1  
Bit 0  
INTCON  
PIR1  
GIE/GIEH PEIE/GIEL TMR0IE  
INT0IE  
TXIF  
RBIE  
SSPIF  
SSPIE  
SSPIP  
ADDEN  
TMR0IF  
INT0IF  
RBIF  
55  
58  
58  
58  
57  
57  
57  
57  
57  
57  
PSPIF(1)  
PSPIE(1)  
PSPIP(1)  
SPEN  
ADIF  
ADIE  
ADIP  
RX9  
RCIF  
RCIE  
RCIP  
SREN  
CCP1IF TMR2IF TMR1IF  
CCP1IE TMR2IE TMR1IE  
CCP1IP TMR2IP TMR1IP  
PIE1  
TXIE  
IPR1  
TXIP  
RCSTA  
TXREG  
TXSTA  
CREN  
FERR  
OERR  
RX9D  
EUSART Transmit Register  
CSRC  
TX9  
TXEN  
SYNC  
SENDB  
BRG16  
BRGH  
TRMT  
WUE  
TX9D  
BAUDCON ABDOVF  
RCIDL  
RXDTP  
TXCKP  
ABDEN  
SPBRGH  
SPBRG  
EUSART Baud Rate Generator Register High Byte  
EUSART Baud Rate Generator Register Low Byte  
Legend: — = unimplemented, read as ‘0’. Shaded cells are not used for synchronous master transmission.  
Note 1: These bits are unimplemented on 28-pin devices and read as ‘0’.  
© 2009 Microchip Technology Inc.  
DS39689F-page 229  
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4. If the signal from the CK pin is to be inverted, set  
the TXCKP bit.  
19.3.2  
EUSART SYNCHRONOUS  
MASTER RECEPTION  
5. If interrupts are desired, set enable bit, RCIE.  
6. If 9-bit reception is desired, set bit, RX9.  
Once Synchronous mode is selected, reception is  
enabled by setting either the Single Receive Enable bit,  
SREN (RCSTA<5>), or the Continuous Receive  
Enable bit, CREN (RCSTA<4>). Data is sampled on the  
RX pin on the falling edge of the clock.  
7. If a single reception is required, set bit, SREN.  
For continuous reception, set bit, CREN.  
8. Interrupt flag bit, RCIF, will be set when reception  
is complete and an interrupt will be generated if  
the enable bit, RCIE, was set.  
If enable bit SREN is set, only a single word is received.  
If enable bit CREN is set, the reception is continuous  
until CREN is cleared. If both bits are set, then CREN  
takes precedence.  
9. Read the RCSTA register to get the 9th bit (if  
enabled) and determine if any error occurred  
during reception.  
To set up a Synchronous Master Reception:  
10. Read the 8-bit received data by reading the  
RCREG register.  
1. Initialize the SPBRGH:SPBRG registers for the  
appropriate baud rate. Set or clear the BRG16  
bit, as required, to achieve the desired baud rate.  
11. If any error occurred, clear the error by clearing  
bit, CREN.  
2. Enable the synchronous master serial port by  
setting bits, SYNC, SPEN and CSRC.  
12. If using interrupts, ensure that the GIE and PEIE bits  
in the INTCON register (INTCON<7:6>) are set.  
3. Ensure bits, CREN and SREN, are clear.  
FIGURE 19-13:  
SYNCHRONOUS RECEPTION (MASTER MODE, SREN)  
Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4Q1 Q2 Q3 Q4 Q1Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4  
RC7/RX/DT  
pin  
bit 0  
bit 1  
bit 2  
bit 3  
bit 4  
bit 5  
bit 6  
bit 7  
RC6/TX/CK pin  
(TXCKP = 0)  
RC6/TX/CK pin  
(TXCKP = 1)  
Write to  
bit SREN  
SREN bit  
CREN bit  
0’  
0’  
RCIF bit  
(Interrupt)  
Read  
RXREG  
Note: Timing diagram demonstrates Sync Master mode with bit SREN = 1and bit BRGH = 0.  
TABLE 19-8: REGISTERS ASSOCIATED WITH SYNCHRONOUS MASTER RECEPTION  
Reset Values  
on page  
Name  
Bit 7  
Bit 6  
Bit 5  
Bit 4  
Bit 3  
Bit 2  
Bit 1  
Bit 0  
INTCON  
PIR1  
GIE/GIEH PEIE/GIEL TMR0IE INT0IE  
RBIE  
SSPIF  
SSPIE  
SSPIP  
ADDEN  
TMR0IF  
INT0IF  
RBIF  
55  
58  
58  
58  
57  
57  
57  
57  
57  
57  
PSPIF(1)  
PSPIE(1)  
PSPIP(1)  
SPEN  
ADIF  
ADIE  
ADIP  
RX9  
RCIF  
RCIE  
RCIP  
SREN  
TXIF  
TXIE  
CCP1IF TMR2IF TMR1IF  
CCP1IE TMR2IE TMR1IE  
CCP1IP TMR2IP TMR1IP  
PIE1  
IPR1  
TXIP  
RCSTA  
RCREG  
TXSTA  
CREN  
FERR  
OERR  
RX9D  
EUSART Receive Register  
CSRC  
TX9  
TXEN  
SYNC  
SENDB  
BRGH  
TRMT  
WUE  
TX9D  
BAUDCON ABDOVF  
RCIDL  
RXDTP TXCKP BRG16  
ABDEN  
SPBRGH EUSART Baud Rate Generator Register High Byte  
SPBRG EUSART Baud Rate Generator Register Low Byte  
Legend: — = unimplemented, read as ‘0’. Shaded cells are not used for synchronous master reception.  
Note 1: These bits are unimplemented on 28-pin devices and read as ‘0’.  
DS39689F-page 230  
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To set up a Synchronous Slave Transmission:  
19.4 EUSART Synchronous  
Slave Mode  
1. Enable the synchronous slave serial port by  
setting bits, SYNC and SPEN, and clearing bit,  
CSRC.  
Synchronous Slave mode is entered by clearing bit,  
CSRC (TXSTA<7>). This mode differs from the  
Synchronous Master mode in that the shift clock is sup-  
plied externally at the CK pin (instead of being supplied  
internally in Master mode). This allows the device to  
transfer or receive data while in any power-managed  
mode.  
2. Clear bits, CREN and SREN.  
3. If interrupts are desired, set enable bit, TXIE.  
4. If the signal from the CK pin is to be inverted, set  
the TXCKP bit.  
5. If 9-bit transmission is desired, set bit, TX9.  
6. Enable the transmission by setting enable bit,  
TXEN.  
19.4.1  
EUSART SYNCHRONOUS  
SLAVE TRANSMISSION  
7. If 9-bit transmission is selected, the ninth bit  
should be loaded in bit TX9D.  
The operation of the Synchronous Master and Slave  
modes are identical, except in the case of the Sleep  
mode.  
8. Start transmission by loading data to the  
TXREGx register.  
If two words are written to the TXREG and then the  
SLEEPinstruction is executed, the following will occur:  
9. If using interrupts, ensure that the GIE and PEIE  
bits in the INTCON register (INTCON<7:6>) are  
set.  
a) The first word will immediately transfer to the  
TSR register and transmit.  
b) The second word will remain in the TXREG  
register.  
c) Flag bit, TXIF, will not be set.  
d) When the first word has been shifted out of TSR,  
the TXREG register will transfer the second word  
to the TSR and flag bit, TXIF, will now be set.  
e) If enable bit, TXIE, is set, the interrupt will wake  
the chip from Sleep. If the global interrupt is  
enabled, the program will branch to the interrupt  
vector.  
TABLE 19-9: REGISTERS ASSOCIATED WITH SYNCHRONOUS SLAVE TRANSMISSION  
Reset  
Values  
on page  
Name  
Bit 7  
Bit 6  
Bit 5  
Bit 4  
Bit 3  
Bit 2  
Bit 1  
Bit 0  
INTCON  
PIR1  
GIE/GIEH PEIE/GIEL TMR0IE  
INT0IE  
TXIF  
RBIE  
SSPIF  
SSPIE  
SSPIP  
ADDEN  
TMR0IF  
CCP1IF  
INT0IF  
RBIF  
55  
58  
58  
58  
57  
57  
57  
57  
57  
57  
PSPIF(1)  
PSPIE(1)  
PSPIP(1)  
SPEN  
ADIF  
ADIE  
ADIP  
RX9  
RCIF  
RCIE  
RCIP  
SREN  
TMR2IF TMR1IF  
PIE1  
TXIE  
CCP1IE TMR2IE TMR1IE  
CCP1IP TMR2IP TMR1IP  
IPR1  
TXIP  
RCSTA  
TXREG  
TXSTA  
CREN  
FERR  
OERR  
RX9D  
EUSART Transmit Register  
CSRC  
TX9  
TXEN  
SYNC  
SENDB  
BRG16  
BRGH  
TRMT  
WUE  
TX9D  
BAUDCON ABDOVF  
RCIDL  
RXDTP  
TXCKP  
ABDEN  
SPBRGH  
SPBRG  
EUSART Baud Rate Generator Register High Byte  
EUSART Baud Rate Generator Register Low Byte  
Legend: — = unimplemented, read as ‘0’. Shaded cells are not used for synchronous slave transmission.  
Note 1: These bits are unimplemented on 28-pin devices and read as ‘0’.  
© 2009 Microchip Technology Inc.  
DS39689F-page 231  
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To set up a Synchronous Slave Reception:  
19.4.2  
EUSART SYNCHRONOUS SLAVE  
RECEPTION  
1. Enable the synchronous master serial port by  
setting bits, SYNC and SPEN, and clearing bit,  
CSRC.  
The operation of the Synchronous Master and Slave  
modes is identical, except in the case of Sleep, or any  
Idle mode and bit SREN, which is a “don’t care” in  
Slave mode.  
2. If interrupts are desired, set enable bit RCIE.  
3. If the signal from the CK pin is to be inverted, set  
the TXCKP bit.  
If receive is enabled by setting the CREN bit prior to  
entering Sleep or any Idle mode, then a word may be  
received while in this low-power mode. Once the word  
is received, the RSR register will transfer the data to the  
RCREG register; if the RCIE enable bit is set, the  
interrupt generated will wake the chip from the low-  
power mode. If the global interrupt is enabled, the  
program will branch to the interrupt vector.  
4. If 9-bit reception is desired, set bit, RX9.  
5. To enable reception, set enable bit, CREN.  
6. Flag bit, RCIF, will be set when reception is  
complete. An interrupt will be generated if  
enable bit, RCIE, was set.  
7. Read the RCSTA register to get the 9th bit (if  
enabled) and determine if any error occurred  
during reception.  
8. Read the 8-bit received data by reading the  
RCREG register.  
9. If any error occurred, clear the error by clearing  
bit, CREN.  
10. If using interrupts, ensure that the GIE and PEIE  
bits in the INTCON register (INTCON<7:6>) are  
set.  
TABLE 19-10: REGISTERS ASSOCIATED WITH SYNCHRONOUS SLAVE RECEPTION  
Reset  
Values  
on page  
Name  
Bit 7  
Bit 6  
Bit 5  
Bit 4  
Bit 3  
Bit 2  
Bit 1  
Bit 0  
INTCON  
PIR1  
GIE/GIEH PEIE/GIEL TMR0IE  
INT0IE  
TXIF  
RBIE  
SSPIF  
SSPIE  
SSPIP  
ADDEN  
TMR0IF  
CCP1IF  
INT0IF  
RBIF  
55  
58  
58  
58  
57  
57  
57  
57  
57  
57  
PSPIF(1)  
PSPIE(1)  
PSPIP(1)  
SPEN  
ADIF  
ADIE  
ADIP  
RX9  
RCIF  
RCIE  
RCIP  
SREN  
TMR2IF TMR1IF  
PIE1  
TXIE  
CCP1IE TMR2IE TMR1IE  
CCP1IP TMR2IP TMR1IP  
IPR1  
TXIP  
RCSTA  
RCREG  
TXSTA  
CREN  
FERR  
OERR  
RX9D  
EUSART Receive Register  
CSRC  
TX9  
TXEN  
SYNC  
SENDB  
BRG16  
BRGH  
TRMT  
WUE  
TX9D  
BAUDCON ABDOVF  
RCIDL  
RXDTP  
TXCKP  
ABDEN  
SPBRGH  
SPBRG  
EUSART Baud Rate Generator Register High Byte  
EUSART Baud Rate Generator Register Low Byte  
Legend: — = unimplemented, read as ‘0’. Shaded cells are not used for synchronous slave reception.  
Note 1: These bits are unimplemented on 28-pin devices and read as ‘0’.  
DS39689F-page 232  
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The ADCON0 register, shown in Register 20-1,  
20.0 10-BIT ANALOG-TO-DIGITAL  
controls the operation of the A/D module. The  
ADCON1 register, shown in Register 20-2, configures  
the functions of the port pins. The ADCON2 register,  
shown in Register 20-3, configures the A/D clock  
source, programmed acquisition time and justification.  
CONVERTER (A/D) MODULE  
The Analog-to-Digital (A/D) converter module has  
10 inputs for the 28-pin devices and 13 for the 40/44-pin  
devices. This module allows conversion of an analog  
input signal to a corresponding 10-bit digital number.  
The module has five registers:  
• A/D Result High Register (ADRESH)  
• A/D Result Low Register (ADRESL)  
• A/D Control Register 0 (ADCON0)  
• A/D Control Register 1 (ADCON1)  
• A/D Control Register 2 (ADCON2)  
REGISTER 20-1: ADCON0: A/D CONTROL REGISTER 0  
U-0  
U-0  
R/W-0  
CHS3  
R/W-0  
CHS2  
R/W-0  
CHS1  
R/W-0  
CHS0  
R/W-0  
R/W-0  
ADON  
GO/DONE  
bit 7  
bit 0  
bit 7-6  
bit 5-2  
Unimplemented: Read as ‘0’  
CHS<3:0>: Analog Channel Select bits  
0000= Channel 0 (AN0)  
0001= Channel 1 (AN1)  
0010= Channel 2 (AN2)  
0011= Channel 3 (AN3)  
0100= Channel 4 (AN4)  
0101= Channel 5 (AN5)(1,2)  
0110= Channel 6 (AN6)(1,2)  
0111= Channel 7 (AN7)(1,2)  
1000= Channel 8 (AN8)  
1001= Channel 9 (AN9)  
1010= Channel 10 (AN10)  
1011= Channel 11 (AN11)  
1100= Channel 12 (AN12  
1101= Unimplemented(2)  
1110= Unimplemented(2)  
1111= Unimplemented(2)  
Note 1: These channels are not implemented on 28-pin devices.  
2: Performing a conversion on unimplemented channels will return a floating input  
measurement.  
bit 1  
bit 0  
GO/DONE: A/D Conversion Status bit  
When ADON = 1:  
1= A/D conversion in progress  
0= A/D Idle  
ADON: A/D On bit  
1= A/D converter module is enabled  
0= A/D converter module is disabled  
Legend:  
R = Readable bit  
-n = Value at POR  
W = Writable bit  
‘1’ = Bit is set  
U = Unimplemented bit, read as ‘0’  
‘0’ = Bit is cleared x = Bit is unknown  
© 2009 Microchip Technology Inc.  
DS39689F-page 233  
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REGISTER 20-2: ADCON1: A/D CONTROL REGISTER 1  
U-0  
U-0  
R/W-0  
R/W-0  
R/W-0(1)  
PCFG3  
R/W(1)  
R/W(1)  
R/W(1)  
VCFG1  
VCFG0  
PCFG2  
PCFG1  
PCFG0  
bit 7  
bit 0  
bit 7-6  
bit 5  
Unimplemented: Read as ‘0’  
VCFG1: Voltage Reference Configuration bit (VREF- source)  
1= VREF- (AN2)  
0= VSS  
bit 4  
VCFG0: Voltage Reference Configuration bit (VREF+ source)  
1= VREF+ (AN3)  
0= VDD  
bit 3-0  
PCFG<3:0>: A/D Port Configuration Control bits  
PCFG<3:0>  
0000(1)  
0001  
0010  
0011  
0100  
0101  
0110  
0111(1)  
1000  
1001  
1010  
1011  
1100  
1101  
1110  
1111  
A
A
A
D
D
D
D
D
A
A
A
A
D
D
D
D
A
A
A
A
A
D
D
D
A
A
A
A
A
A
D
D
A
A
A
A
A
A
A
D
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
A
D
D
D
D
D
D
D
A
A
D
D
D
D
D
D
A
A
A
D
D
D
D
D
A
A
A
A
D
D
D
D
A
A
A
A
A
D
D
D
A
A
A
A
A
A
D
D
A
A
A
A
A
A
A
D
A = Analog input  
D = Digital I/O  
Note 1: The POR value of the PCFG bits depends on the value of the PBADEN Con-  
figuration bit. When PBADEN = 1, PCFG<3:0> = 0000; when PBADEN = 0,  
PCFG<3:0> = 0111.  
2: AN5 through AN7 are available only on 40/44-pin devices.  
Legend:  
R = Readable bit  
-n = Value at POR  
W = Writable bit  
‘1’ = Bit is set  
U = Unimplemented bit, read as ‘0’  
‘0’ = Bit is cleared x = Bit is unknown  
DS39689F-page 234  
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REGISTER 20-3: ADCON2: A/D CONTROL REGISTER 2  
R/W-0 U-0 R/W-0 R/W-0  
ADFM ACQT2 ACQT1  
bit 7  
R/W-0  
R/W-0  
R/W-0  
R/W-0  
ACQT0  
ADCS2  
ADCS1  
ADCS0  
bit 0  
bit 7  
ADFM: A/D Result Format Select bit  
1= Right justified  
0= Left justified  
bit 6  
Unimplemented: Read as ‘0’  
bit 5-3  
ACQT<2:0>: A/D Acquisition Time Select bits  
111= 20 TAD  
110= 16 TAD  
101= 12 TAD  
100= 8 TAD  
011= 6 TAD  
010= 4 TAD  
001= 2 TAD  
(1)  
000= 0 TAD  
bit 2-0  
ADCS<2:0>: A/D Conversion Clock Select bits  
111= FRC (clock derived from A/D RC oscillator)(1)  
110= FOSC/64  
101= FOSC/16  
100= FOSC/4  
011= FRC (clock derived from A/D RC oscillator)(1)  
010= FOSC/32  
001= FOSC/8  
000= FOSC/2  
Note 1: If the A/D FRC clock source is selected, a delay of one TCY (instruction cycle) is  
added before the A/D clock starts. This allows the SLEEPinstruction to be executed  
before starting a conversion.  
Legend:  
R = Readable bit  
-n = Value at POR  
W = Writable bit  
‘1’ = Bit is set  
U = Unimplemented bit, read as ‘0’  
‘0’ = Bit is cleared x = Bit is unknown  
© 2009 Microchip Technology Inc.  
DS39689F-page 235  
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The analog reference voltage is software selectable to  
either the device’s positive and negative supply voltage  
(VDD and VSS), or the voltage level on the RA3/AN3/  
VREF+ and RA2/AN2/VREF-/CVREF pins.  
A device Reset forces all registers to their Reset state.  
This forces the A/D module to be turned off and any  
conversion in progress is aborted.  
Each port pin associated with the A/D converter can be  
configured as an analog input, or as a digital I/O. The  
ADRESH and ADRESL registers contain the result of  
the A/D conversion. When the A/D conversion is  
The A/D converter has a unique feature of being able  
to operate while the device is in Sleep mode. To  
operate in Sleep, the A/D conversion clock must be  
derived from the A/D’s internal RC oscillator.  
complete,  
the  
result  
is  
loaded  
into  
the  
ADRESH:ADRESL register pair, the GO/DONE bit  
(ADCON0 register) is cleared and A/D Interrupt Flag bit,  
ADIF, is set. The block diagram of the A/D module is  
shown in Figure 20-1.  
The output of the sample and hold is the input into the  
converter, which generates the result via successive  
approximation.  
FIGURE 20-1:  
A/D BLOCK DIAGRAM  
CHS<3:0>  
1100  
AN12  
1011  
AN11  
1010  
AN10  
1001  
AN9  
1000  
AN8  
0111  
AN7(1)  
0110  
AN6(1)  
0101  
AN5(1)  
0100  
AN4  
VAIN  
0011  
(Input Voltage)  
10-Bit  
A/D  
Converter  
AN3  
0010  
AN2  
0001  
VCFG<1:0>  
AN1  
0000  
VDD  
X0  
AN0  
VREF+  
VREF-  
X1  
1X  
0X  
Reference  
Voltage  
VSS  
Note 1: Channels AN5 through AN7 are not available on 28-pin devices.  
2: I/O pins have diode protection to VDD and VSS.  
DS39689F-page 236  
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The value in the ADRESH:ADRESL registers is not  
5. Wait for A/D conversion to complete, by either:  
• Polling for the GO/DONE bit to be cleared  
modified for a Power-on Reset. The ADRESH:ADRESL  
registers will contain unknown data after a Power-on  
Reset.  
OR  
• Waiting for the A/D interrupt  
After the A/D module has been configured as desired,  
the selected channel must be acquired before the  
conversion is started. The analog input channels must  
have their corresponding TRIS bits selected as an  
input. To determine acquisition time, see Section 20.1  
“A/D Acquisition Requirements”. After this acquisi-  
tion time has elapsed, the A/D conversion can be  
started. An acquisition time can be programmed to  
occur between setting the GO/DONE bit and the actual  
start of the conversion.  
6. Read A/D Result registers (ADRESH:ADRESL);  
clear bit ADIF, if required.  
7. For next conversion, go to step 1 or step 2, as  
required. The A/D conversion time per bit is  
defined as TAD. A minimum wait of 2 TAD is  
required before the next acquisition starts.  
FIGURE 20-2:  
A/D TRANSFER FUNCTION  
The following steps should be followed to perform an A/D  
conversion:  
3FFh  
3FEh  
1. Configure the A/D module:  
• Configure analog pins, voltage reference and  
digital I/O (ADCON1)  
• Select A/D input channel (ADCON0)  
• Select A/D acquisition time (ADCON2)  
• Select A/D conversion clock (ADCON2)  
• Turn on A/D module (ADCON0)  
2. Configure A/D interrupt (if desired):  
• Clear ADIF bit  
003h  
002h  
001h  
000h  
• Set ADIE bit  
• Set GIE bit  
3. Wait the required acquisition time (if required).  
4. Start conversion:  
Analog Input Voltage  
• Set GO/DONE bit (ADCON0 register)  
FIGURE 20-3:  
ANALOG INPUT MODEL  
VDD  
Sampling  
Switch  
VT = 0.6V  
ANx  
SS  
RIC 1k  
RSS  
Rs  
CPIN  
VAIN  
ILEAKAGE  
±100 nA  
CHOLD = 25 pF  
VT = 0.6V  
5 pF  
VSS  
Legend: CPIN  
= Input Capacitance  
= Threshold Voltage  
VT  
6V  
5V  
4V  
3V  
2V  
ILEAKAGE = Leakage Current at the pin due to  
various junctions  
VDD  
RIC  
= Interconnect Resistance  
SS  
= Sampling Switch  
CHOLD  
RSS  
= Sample/Hold Capacitance (from DAC)  
= Sampling Switch Resistance  
1
2
3
4
(kΩ)  
Sampling Switch  
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To calculate the minimum acquisition time,  
20.1 A/D Acquisition Requirements  
Equation 20-1 may be used. This equation assumes  
that 1/2 LSb error is used (1024 steps for the A/D). The  
1/2 LSb error is the maximum error allowed for the A/D  
to meet its specified resolution.  
For the A/D converter to meet its specified accuracy,  
the charge holding capacitor (CHOLD) must be allowed  
to fully charge to the input channel voltage level. The  
analog input model is shown in Figure 20-3. The  
source impedance (RS) and the internal sampling  
switch (RSS) impedance directly affect the time  
required to charge the capacitor CHOLD. The sampling  
switch (RSS) impedance varies over the device voltage  
(VDD). The source impedance affects the offset voltage  
at the analog input (due to pin leakage current). The  
maximum recommended impedance for analog  
sources is 2.5 kΩ. After the analog input channel is  
selected (changed), the channel must be sampled for  
at least the minimum acquisition time before starting a  
conversion.  
Example 20-3 shows the calculation of the minimum  
required acquisition time TACQ. This calculation is  
based on the following application system  
assumptions:  
CHOLD  
Rs  
Conversion Error  
VDD  
Temperature  
=
=
=
=
25 pF  
2.5 kΩ  
1/2 LSb  
5V Rss = 2 kΩ  
85°C (system max.)  
Note:  
When the conversion is started, the  
holding capacitor is disconnected from the  
input pin.  
EQUATION 20-1: ACQUISITION TIME  
TACQ  
=
=
Amplifier Settling Time + Holding Capacitor Charging Time + Temperature Coefficient  
TAMP + TC + TCOFF  
EQUATION 20-2: A/D MINIMUM CHARGING TIME  
VHOLD  
or  
TC  
=
=
(VREF – (VREF/2048)) • (1 – e(-TC/CHOLD(RIC + RSS + RS))  
)
-(CHOLD)(RIC + RSS + RS) ln(1/2048)  
EQUATION 20-3: CALCULATING THE MINIMUM REQUIRED ACQUISITION TIME  
TACQ  
TAMP  
TCOFF  
=
=
=
TAMP + TC + TCOFF  
0.2 μs  
(Temp – 25°C)(0.02 μs/°C)  
(85°C – 25°C)(0.02 μs/°C)  
1.2 μs  
Temperature coefficient is only required for temperatures > 25°C. Below 25°C, TCOFF = 0 ms.  
TC  
=
-(CHOLD)(RIC + RSS + RS) ln(1/2047)  
-(25 pF) (1 kΩ + 2 kΩ + 2.5 kΩ) ln(0.0004883)  
1.05 μs  
TACQ  
=
0.2 μs + 1 μs + 1.2 μs  
2.4 μs  
DS39689F-page 238  
© 2009 Microchip Technology Inc.  
PIC18F2221/2321/4221/4321 FAMILY  
20.2 Selecting and Configuring  
20.3 Selecting the A/D Conversion  
Clock  
Acquisition Time  
The ADCON2 register allows the user to select an  
acquisition time that occurs each time the GO/DONE  
bit is set. It also gives users the option to use an  
automatically determined acquisition time.  
The A/D conversion time per bit is defined as TAD. The  
A/D conversion requires 11 TAD per 10-bit conversion.  
The source of the A/D conversion clock is software  
selectable. There are seven possible options for TAD:  
Acquisition time may be set with the ACQT<2:0> bits  
(ADCON2<5:3>), which provides a range of 2 to  
20 TAD. When the GO/DONE bit is set, the A/D module  
continues to sample the input for the selected acquisi-  
tion time, then automatically begins a conversion.  
Since the acquisition time is programmed, there may  
be no need to wait for an acquisition time between  
selecting a channel and setting the GO/DONE bit.  
• 2 TOSC  
• 4 TOSC  
• 8 TOSC  
• 16 TOSC  
• 32 TOSC  
• 64 TOSC  
• Internal RC Oscillator  
Manual  
acquisition  
is  
selected  
when  
For correct A/D conversions, the A/D conversion clock  
(TAD) must be as short as possible, but greater than the  
minimum TAD (see parameter 130 for more  
information).  
ACQT<2:0> = 000. When the GO/DONE bit is set,  
sampling is stopped and a conversion begins. The user  
is responsible for ensuring the required acquisition time  
has passed between selecting the desired input  
channel and setting the GO/DONE bit. This option is  
also the default Reset state of the ACQT<2:0> bits and  
is compatible with devices that do not offer  
programmable acquisition times.  
Table 20-1 shows the resultant TAD times derived from  
the device operating frequencies and the A/D clock  
source selected.  
In either case, when the conversion is completed, the  
GO/DONE bit is cleared, the ADIF flag is set and the  
A/D begins sampling the currently selected channel  
again. If an acquisition time is programmed, there is  
nothing to indicate if the acquisition time has ended or  
if the conversion has begun.  
TABLE 20-1: TAD vs. DEVICE OPERATING FREQUENCIES  
AD Clock Source (TAD)  
Maximum Device Frequency  
Operation  
ADCS<2:0>  
PIC18F2X21/4X21  
PIC18LF2X21/4X21(4)  
2 TOSC  
4 TOSC  
8 TOSC  
16 TOSC  
32 TOSC  
64 TOSC  
RC(3)  
000  
100  
001  
101  
010  
110  
x11  
2.86 MHz  
5.71 MHz  
11.43 MHz  
22.86 MHz  
40.0 MHz  
40.0 MHz  
1.00 MHz(1)  
1.43 kHz  
2.86 MHz  
5.72 MHz  
11.43 MHz  
22.86 MHz  
22.86 MHz  
1.00 MHz(2)  
Note 1: The RC source has a typical TAD time of 1.2 μs.  
2: The RC source has a typical TAD time of 2.5 μs.  
3: For device frequencies above 1 MHz, the device must be in Sleep for the entire conversion or the A/D  
accuracy may be out of specification.  
4: Low-power (PIC18LFXXXX) devices only.  
© 2009 Microchip Technology Inc.  
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20.4 Operation in Power-Managed  
Modes  
20.5 Configuring Analog Port Pins  
The ADCON1, TRISA, TRISB and TRISE registers all  
configure the A/D port pins. The port pins needed as  
analog inputs must have their corresponding TRIS bits  
set (input). If the TRIS bit is cleared (output), the digital  
output level (VOH or VOL) will be converted.  
The selection of the automatic acquisition time and A/D  
conversion clock is determined in part by the clock  
source and frequency while in a power-managed mode.  
If the A/D is expected to operate while the device is in  
The A/D operation is independent of the state of the  
CHS<3:0> bits and the TRIS bits.  
a
power-managed mode, the ACQT<2:0> and  
ADCS<2:0> bits in ADCON2 should be updated in  
accordance with the clock source to be used in that  
mode. After entering the mode, an A/D acquisition or  
conversion may be started. Once started, the device  
should continue to be clocked by the same clock  
source until the conversion has been completed.  
Note 1: When reading the Port register, all pins  
configured as analog input channels will  
read as cleared (a low level). Pins  
configured as digital inputs will convert as  
analog inputs. Analog levels on a digitally  
configured input will be accurately  
converted.  
If desired, the device may be placed into the  
corresponding Idle mode during the conversion. If the  
device clock frequency is less than 1 MHz, the A/D RC  
clock source should be selected.  
2: Analog levels on any pin defined as a  
digital input may cause the digital input  
buffer to consume current out of the  
device’s specification limits.  
Operation in Sleep mode requires the A/D FRC clock to  
be selected. If bits ACQT<2:0> are set to ‘000’ and a  
conversion is started, the conversion will be delayed  
one instruction cycle to allow execution of the SLEEP  
instruction and entry to Sleep mode. The IDLEN bit  
(OSCCON<7>) must have already been cleared prior  
to starting the conversion.  
3: The PBADEN bit in Configuration  
Register 3H configures PORTB pins to  
reset as analog or digital pins by control-  
ling how the PCFG<3:0> bits in ADCON1  
are reset.  
DS39689F-page 240  
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After the A/D conversion is completed or aborted, a  
20.6 A/D Conversions  
2 TAD wait is required before the next acquisition can be  
started. After this wait, acquisition on the selected  
channel is automatically started.  
Figure 20-4 shows the operation of the A/D converter  
after the GO/DONE bit has been set and the  
ACQT<2:0> bits are cleared. A conversion is started  
after the following instruction to allow entry into Sleep  
mode before the conversion begins.  
Note:  
The GO/DONE bit should NOT be set in  
the same instruction that turns on the A/D.  
Figure 20-5 shows the operation of the A/D converter  
after the GO/DONE bit has been set and the  
ACQT<2:0> bits are set to ‘010’ and selecting a 4 TAD  
acquisition time before the conversion starts.  
20.7 Discharge  
The discharge phase is used to initialize the value of  
the capacitor array. The array is discharged before  
every sample. This feature helps to optimize the unity-  
gain amplifier, as the circuit always needs to charge the  
capacitor array, rather than charge/discharge based on  
previous measure values.  
Clearing the GO/DONE bit during a conversion will abort  
the current conversion. The A/D Result register pair will  
NOT be updated with the partially completed A/D  
conversion sample. This means the ADRESH:ADRESL  
registers will continue to contain the value of the last  
completed conversion (or the last value written to the  
ADRESH:ADRESL registers).  
FIGURE 20-4:  
A/D CONVERSION TAD CYCLES (ACQT<2:0> = 000, TACQ = 0)  
TCY - TAD  
TAD6 TAD7 TAD8 TAD9 TAD10 TAD11 TAD1  
TAD1 TAD2 TAD3 TAD4 TAD5  
b7  
b6  
b4  
b1  
b0  
b9  
b8  
b5  
b3  
b2  
Conversion starts  
Discharge  
Holding capacitor is disconnected from analog input (typically 100 ns)  
Set GO/DONE bit  
On the following cycle:  
ADRESH:ADRESL is loaded, GO/DONE bit is cleared,  
ADIF bit is set, holding capacitor is connected to analog input.  
FIGURE 20-5:  
A/D CONVERSION TAD CYCLES (ACQT<2:0> = 010, TACQ = 4 TAD)  
TAD Cycles  
TACQT Cycles  
7
8
9
10  
b1  
11 TAD1  
b0  
1
2
3
4
1
2
3
4
5
6
b7  
b6  
b3  
b2  
b8  
b5  
b4  
b9  
Automatic  
Acquisition  
Time  
Discharge  
Conversion starts  
(Holding capacitor is disconnected)  
Set GO/DONE bit  
(Holding capacitor continues  
acquiring input)  
On the following cycle:  
ADRESH:ADRESL is loaded, GO/DONE bit is cleared,  
ADIF bit is set, holding capacitor is connected to analog input.  
© 2009 Microchip Technology Inc.  
DS39689F-page 241  
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(moving ADRESH:ADRESL to the desired location).  
20.8 Use of the CCP2 Trigger  
The appropriate analog input channel must be selected  
and the minimum acquisition period is either timed by  
the user, or an appropriate TACQ time selected before  
the Special Event Trigger sets the GO/DONE bit (starts  
a conversion).  
An A/D conversion can be started by the Special Event  
Trigger of the CCP2 module. This requires that the  
CCP2M<3:0> bits (CCP2CON<3:0>) be programmed  
as ‘1011’ and that the A/D module is enabled (ADON  
bit is set). When the trigger occurs, the GO/DONE bit  
will be set, starting the A/D acquisition and conversion  
and the Timer1 (or Timer3) counter will be reset to zero.  
Timer1 (or Timer3) is reset to automatically repeat the  
A/D acquisition period with minimal software overhead  
If the A/D module is not enabled (ADON is cleared), the  
Special Event Trigger will be ignored by the A/D module  
but will still reset the Timer1 (or Timer3) counter.  
TABLE 20-2: REGISTERS ASSOCIATED WITH A/D OPERATION  
Reset  
Values  
on page  
Name  
Bit 7  
Bit 6  
Bit 5  
Bit 4  
Bit 3  
Bit 2  
Bit 1  
Bit 0  
INTCON  
PIR1  
PIE1  
GIE/GIEH PEIE/GIEL TMR0IE  
INT0IE  
TXIF  
TXIE  
TXIP  
EEIF  
EEIE  
EEIP  
RBIE  
SSPIF  
SSPIE  
SSPIP  
BCLIF  
BCLIE  
BCLIP  
TMR0IF  
CCP1IF  
CCP1IE  
CCP1IP  
HLVDIF  
HLVDIE  
HLVDIP  
INT0IF  
TMR2IF  
TMR2IE  
TMR2IP  
TMR3IF  
TMR3IE  
TMR3IP  
RBIF  
55  
58  
58  
58  
58  
58  
58  
57  
57  
57  
57  
57  
58  
58  
58  
58  
58  
58  
58  
58  
PSPIF(1)  
PSPIE(1)  
PSPIP(1)  
OSCFIF  
OSCFIE  
OSCFIP  
ADIF  
ADIE  
ADIP  
CMIF  
CMIE  
CMIP  
RCIF  
RCIE  
RCIP  
TMR1IF  
TMR1IE  
TMR1IP  
CCP2IF  
CCP2IE  
CCP2IP  
IPR1  
PIR2  
PIE2  
IPR2  
ADRESH A/D Result Register High Byte  
ADRESL A/D Result Register Low Byte  
ADCON0  
ADCON1  
ADCON2  
PORTA  
TRISA  
CHS3  
VCFG1  
ACQT2  
RA5  
CHS2  
VCFG0  
ACQT1  
RA4  
CHS1  
PCFG3  
ACQT0  
RA3  
CHS0 GO/DONE ADON  
PCFG2  
ADCS2  
RA2  
PCFG1  
ADCS1  
RA1  
PCFG0  
ADCS0  
RA0  
ADFM  
RA7(2)  
RA6(2)  
TRISA7(2) TRISA6(2) PORTA Data Direction Control Register  
PORTB  
TRISB  
RB7  
PORTB Data Direction Control Register  
PORTB Data Latch Register (Read and Write to Data Latch)  
RB6  
RB5  
RB4  
RB3  
RB2  
RB1  
RB0  
LATB  
PORTE  
TRISE(1)  
LATE(1)  
IBF  
OBF  
IBOV  
PSPMODE  
RE3(3)  
RE2(1)  
RE1(1)  
RE0(1)  
TRISE2  
TRISE1  
TRISE0  
PORTE Data Latch Register  
Legend: — = unimplemented, read as ‘0’. Shaded cells are not used for A/D conversion.  
Note 1: These registers and/or bits are unimplemented on 28-pin devices and are read as ‘0’.  
2: PORTA<7:6> and their direction bits are individually configured as port pins based on various primary  
oscillator modes. When disabled, these bits read as ‘0’.  
3: RE3 port bit is available only as an input pin when the MCLRE Configuration bit is ‘0’.  
DS39689F-page 242  
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The CMCON register (Register 21-1) selects the  
21.0 COMPARATOR MODULE  
comparator input and output configuration. Block  
diagrams of the various comparator configurations are  
shown in Figure 21-1.  
The analog comparator module contains two  
comparators that can be configured in a variety of  
ways. The inputs can be selected from the analog  
inputs multiplexed with pins RA0 through RA5, as well  
as the on-chip voltage reference (see Section 22.0  
“Comparator Voltage Reference Module”). The digi-  
tal outputs (normal or inverted) are available at the pin  
level and can also be read through the control register.  
REGISTER 21-1: CMCON: COMPARATOR CONTROL REGISTER  
R-0  
R-0  
R/W-0  
C2INV  
R/W-0  
C1INV  
R/W-0  
CIS  
R/W-1  
CM2  
R/W-1  
CM1  
R/W-1  
CM0  
C2OUT  
C1OUT  
bit 7  
bit 0  
bit 7  
C2OUT: Comparator 2 Output bit  
When C2INV = 0:  
1= C2 VIN+ > C2 VIN-  
0= C2 VIN+ < C2 VIN-  
When C2INV = 1:  
1= C2 VIN+ < C2 VIN-  
0= C2 VIN+ > C2 VIN-  
bit 6  
C1OUT: Comparator 1 Output bit  
When C1INV = 0:  
1= C1 VIN+ > C1 VIN-  
0= C1 VIN+ < C1 VIN-  
When C1INV = 1:  
1= C1 VIN+ < C1 VIN-  
0= C1 VIN+ > C1 VIN-  
bit 5  
bit 4  
bit 3  
C2INV: Comparator 2 Output Inversion bit  
1= C2 output inverted  
0= C2 output not inverted  
C1INV: Comparator 1 Output Inversion bit  
1= C1 output inverted  
0= C1 output not inverted  
CIS: Comparator Input Switch bit  
When CM<2:0> = 110:  
1= C1 VIN- connects to RA3/AN3/VREF+  
C2 VIN- connects to RA2/AN2/VREF-/CVREF  
0= C1 VIN- connects to RA0/AN0  
C2 VIN- connects to RA1/AN1  
bit 2-0  
CM<2:0>: Comparator Mode bits  
Figure 21-1 shows the Comparator modes and the CM<2:0> bit settings.  
Legend:  
R = Readable bit  
-n = Value at POR  
W = Writable bit  
‘1’ = Bit is set  
U = Unimplemented bit, read as ‘0’  
‘0’ = Bit is cleared x = Bit is unknown  
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comparator output level may not be valid for the  
specified mode change delay shown in Section 27.0  
“Electrical Characteristics”.  
21.1 Comparator Configuration  
There are eight modes of operation for the comparators,  
shown in Figure 21-1. Bits CM<2:0> of the CMCON  
register are used to select these modes. The TRISA reg-  
ister controls the data direction of the comparator pins  
for each mode. If the Comparator mode is changed, the  
Note:  
Comparator interrupts should be disabled  
during Comparator mode change;  
otherwise, a false interrupt may occur.  
a
FIGURE 21-1:  
COMPARATOR I/O OPERATING MODES  
Comparators Reset  
Comparators Off (POR Default Value)  
CM<2:0> = 000  
CM<2:0> = 111  
A
D
VIN-  
VIN-  
RA0/AN0  
RA0/AN0  
Off (Read as ‘0’)  
Off (Read as ‘0’)  
Off (Read as ‘0’)  
Off (Read as ‘0’)  
C1  
C2  
C1  
C2  
VIN+  
VIN+  
A
D
RA3/AN3/  
VREF+  
RA3/AN3/  
VREF+  
A
D
D
VIN-  
VIN-  
RA1/AN1  
RA1/AN1  
VIN+  
VIN+  
A
RA2/AN2/  
VREF-/CVREF  
RA2/AN2/  
VREF-/CVREF  
Two Independent Comparators  
Two Independent Comparators with Outputs  
CM<2:0> = 010  
CM<2:0> = 011  
A
A
VIN-  
VIN-  
RA0/AN0  
RA0/AN0  
C1OUT  
C2OUT  
C1OUT  
C2OUT  
C1  
C2  
C1  
C2  
VIN+  
RA3/AN3/  
VREF+  
VIN+  
A
A
RA3/AN3/  
VREF+  
RA4/T0CKI/C1OUT*  
A
A
VIN-  
RA1/AN1  
RA2/AN2/  
A
A
VIN-  
RA1/AN1  
VIN+  
RA2/AN2/  
VREF-/CVREF  
VIN+  
VREF-/CVREF  
RA5/AN4/SS/HLVDIN/C2OUT*  
Two Common Reference Comparators  
Two Common Reference Comparators with Outputs  
CM<2:0> = 100  
CM<2:0> = 101  
A
A
VIN-  
VIN-  
RA0/AN0  
RA0/AN0  
C1OUT  
C2OUT  
C1OUT  
C1  
C2  
C1  
VIN+  
VIN+  
A
A
RA3/AN3/  
VREF+  
RA3/AN3/  
VREF+  
RA4/T0CKI/C1OUT*  
A
D
VIN-  
RA1/AN1  
RA2/AN2/  
A
VIN-  
RA1/AN1  
VIN+  
C2OUT  
RA2/AN2/  
D
C2  
VIN+  
VREF-/CVREF  
VREF-/CVREF  
RA5/AN4/SS/HLVDIN/C2OUT*  
Four Inputs Multiplexed to Two Comparators  
One Independent Comparator with Output  
CM<2:0> = 110  
CM<2:0> = 001  
A
A
A
VIN-  
RA0/AN0  
RA0/AN0  
CIS = 0  
CIS = 1  
VIN-  
A
C1OUT  
C1  
RA3/AN3/  
VREF+  
VIN+  
RA3/AN3/  
VREF+  
C1OUT  
C2OUT  
C1  
C2  
VIN+  
A
A
RA4/T0CKI/C1OUT*  
RA1/AN1  
VIN-  
CIS = 0  
CIS = 1  
RA2/AN2/  
VREF-/CVREF  
VIN+  
D
D
VIN-  
RA1/AN1  
RA2/AN2/  
Off (Read as ‘0’)  
C2  
VIN+  
CVREF  
From VREF Module  
VREF-/CVREF  
A = Analog Input, port reads zeros always  
D = Digital Input  
CIS (CMCON<3>) is the Comparator Input Switch  
* Setting the TRISA<5:4> bits will disable the comparator outputs by configuring the pins as inputs.  
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21.3.2  
INTERNAL REFERENCE SIGNAL  
21.2 Comparator Operation  
The comparator module also allows the selection of an  
internally generated voltage reference from the  
comparator voltage reference module. This module is  
described in more detail in Section 22.0 “Comparator  
Voltage Reference Module”.  
A single comparator is shown in Figure 21-2, along with  
the relationship between the analog input levels and  
the digital output. When the analog input at VIN+ is less  
than the analog input VIN-, the output of the comparator  
is a digital low level. When the analog input at VIN+ is  
greater than the analog input VIN-, the output of the  
comparator is a digital high level. The shaded areas of  
the output of the comparator in Figure 21-2 represent  
the uncertainty, due to input offsets and response time.  
The internal reference is only available in the mode  
where four inputs are multiplexed to two comparators  
(CM<2:0> = 110). In this mode, the internal voltage ref-  
erence is applied to the VIN+ pin of both comparators.  
21.3 Comparator Reference  
21.4 Comparator Response Time  
Depending on the comparator operating mode, either  
an external or internal voltage reference may be used.  
The analog signal present at VIN- is compared to the  
signal at VIN+ and the digital output of the comparator  
is adjusted accordingly (Figure 21-2).  
Response time is the minimum time, after selecting a  
new reference voltage or input source, before the  
comparator output has a valid level. If the internal ref-  
erence is changed, the maximum delay of the internal  
voltage reference must be considered when using the  
comparator outputs. Otherwise, the maximum delay of  
the comparators should be used (see Section 27.0  
“Electrical Characteristics”).  
FIGURE 21-2:  
SINGLE COMPARATOR  
21.5 Comparator Outputs  
VIN+  
VIN-  
+
Output  
The comparator outputs are read through the CMCON  
register. These bits are read-only. The comparator  
outputs may also be directly output to the RA4 and RA5  
I/O pins. When enabled, multiplexors in the output path  
of the RA4 and RA5 pins will switch and the output of  
each pin will be the unsynchronized output of the  
comparator. The uncertainty of each of the  
comparators is related to the input offset voltage and  
the response time given in the specifications.  
Figure 21-3 shows the comparator output block  
diagram.  
VIN-  
VIN+  
The TRISA bits will still function as an output enable/  
disable for the RA4 and RA5 pins while in this mode.  
Output  
The polarity of the comparator outputs can be changed  
using the C2INV and C1INV bits (CMCON<5:4>).  
21.3.1  
EXTERNAL REFERENCE SIGNAL  
Note 1: When reading the Port register, all pins  
configured as analog inputs will read as a  
0’. Pins configured as digital inputs will  
convert an analog input according to the  
Schmitt Trigger input specification.  
When external voltage references are used, the  
comparator module can be configured to have the  
comparators operate from the same or different  
reference sources. However, threshold detector  
applications may require the same reference. The  
reference signal must be between VSS and VDD and  
can be applied to either pin of the comparator(s).  
2: Analog levels on any pin defined as a  
digital input may cause the input buffer to  
consume more current than is specified.  
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FIGURE 21-3:  
COMPARATOR OUTPUT BLOCK DIAGRAM  
Port Pins  
To RA4 or  
RA5 pin  
D
Q
Bus  
Data  
CxINV  
EN  
Read CMCON  
D
Q
Set  
CMIF  
bit  
EN  
CL  
From  
Other  
Comparator  
Reset  
21.6 Comparator Interrupts  
21.7 Comparator Operation  
During Sleep  
The comparator interrupt flag is set whenever there is  
a change in the output value of either comparator.  
Software will need to maintain information about the  
status of the output bits, as read from CMCON<7:6>, to  
determine the actual change that occurred. The CMIF  
bit (PIR2<6>) is the Comparator Interrupt Flag. The  
CMIF bit must be reset by clearing it. Since it is also  
possible to write a ‘1’ to this register, a simulated  
interrupt may be initiated.  
When a comparator is active and the device is placed  
in Sleep mode, the comparator remains active and the  
interrupt is functional if enabled. This interrupt will  
wake-up the device from Sleep mode, when enabled.  
Each operational comparator will consume additional  
current, as shown in the comparator specifications. To  
minimize power consumption while in Sleep mode, turn  
off the comparators (CM<2:0> = 111) before entering  
Sleep. If the device wakes up from Sleep, the contents  
of the CMCON register are not affected.  
Both the CMIE bit (PIE2<6>) and the PEIE bit  
(INTCON<6>) must be set to enable the interrupt. In  
addition, the GIE bit (INTCON<7>) must also be set. If  
any of these bits are clear, the interrupt is not enabled,  
though the CMIF bit will still be set if an interrupt  
condition occurs.  
21.8 Effects of a Reset  
A device Reset forces the CMCON register to its Reset  
state, causing the comparator modules to be turned off  
(CM<2:0> = 111). However, the input pins (RA0  
through RA3) are configured as analog inputs by  
default on device Reset. The I/O configuration for these  
pins is determined by the setting of the PCFG<3:0> bits  
(ADCON1<3:0>). Therefore, device current is  
minimized when analog inputs are present at Reset  
time.  
Note:  
If a change in the CMCON register  
(C1OUT or C2OUT) should occur when a  
read operation is being executed (start of  
the Q2 cycle), then the CMIF (PIR2  
register) interrupt flag may not get set.  
The user, in the Interrupt Service Routine, can clear the  
interrupt in the following manner:  
a) Any read or write of CMCON will end the  
mismatch condition.  
b) Clear flag bit CMIF.  
A mismatch condition will continue to set flag bit CMIF.  
Reading CMCON will end the mismatch condition and  
allow flag bit CMIF to be cleared.  
DS39689F-page 246  
© 2009 Microchip Technology Inc.  
PIC18F2221/2321/4221/4321 FAMILY  
range by more than 0.6V in either direction, one of the  
21.9 Analog Input Connection  
diodes is forward biased and a latch-up condition may  
occur. A maximum source impedance of 10 kΩ is  
recommended for the analog sources. Any external  
component connected to an analog input pin, such as  
a capacitor or a Zener diode, should have very little  
leakage current.  
Considerations  
A simplified circuit for an analog input is shown in  
Figure 21-4. Since the analog pins are connected to a  
digital output, they have reverse biased diodes to VDD  
and VSS. The analog input, therefore, must be between  
VSS and VDD. If the input voltage deviates from this  
FIGURE 21-4:  
COMPARATOR ANALOG INPUT MODEL  
VDD  
VT = 0.6V  
RIC  
RS < 10k  
AIN  
Comparator  
Input  
ILEAKAGE  
±100 nA  
CPIN  
5 pF  
VA  
VT = 0.6V  
VSS  
Legend: CPIN  
=
=
Input Capacitance  
Threshold Voltage  
VT  
ILEAKAGE = Leakage Current at the pin due to various junctions  
RIC  
RS  
VA  
=
=
=
Interconnect Resistance  
Source Impedance  
Analog Voltage  
TABLE 21-1: REGISTERS ASSOCIATED WITH COMPARATOR MODULE  
Reset  
Name  
Bit 7  
Bit 6  
Bit 5  
Bit 4  
Bit 3  
Bit 2  
Bit 1  
Bit 0  
Values  
on page  
CMCON  
CVRCON  
INTCON  
PIR2  
C2OUT  
CVREN  
C1OUT  
CVROE  
C2INV  
CVRR  
C1INV  
CVRSS  
INT0IE  
EEIF  
CIS  
CM2  
CM1  
CVR1  
INT0IF  
CM0  
CVR0  
RBIF  
57  
57  
58  
58  
58  
58  
58  
58  
58  
CVR3  
RBIE  
BCLIF  
BCLIE  
BCLIP  
RA3  
CVR2  
GIE/GIEH PEIE/GIEL TMR0IE  
TMR0IF  
HLVDIF  
OSCFIF  
OSCFIE  
OSCFIP  
RA7(1)  
CMIF  
CMIE  
CMIP  
RA6(1)  
TMR3IF CCP2IF  
PIE2  
EEIE  
HLVDIE TMR3IE CCP2IE  
HLVDIP TMR3IP CCP2IP  
IPR2  
EEIP  
PORTA  
LATA  
RA5  
RA4  
RA2  
RA1  
RA0  
LATA7(1)  
LATA6(1) PORTA Data Latch Register (Read and Write to Data Latch)  
TRISA  
TRISA7(1) TRISA6(1) PORTA Data Direction Control Register  
Legend: — = unimplemented, read as ‘0’. Shaded cells are unused by the comparator module.  
Note 1: PORTA<7:6> and their direction and latch bits are individually configured as port pins based on various  
primary oscillator modes. When disabled, these bits read as ‘0’.  
© 2009 Microchip Technology Inc.  
DS39689F-page 247  
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NOTES:  
DS39689F-page 248  
© 2009 Microchip Technology Inc.  
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used is selected by the CVRR bit (CVRCON<5>). The  
22.0 COMPARATOR VOLTAGE  
primary difference between the ranges is the size of the  
steps selected by the CVREF selection bits  
(CVR<3:0>), with one range offering finer resolution.  
The equations used to calculate the output of the  
comparator voltage reference are as follows:  
REFERENCE MODULE  
The comparator voltage reference is a 16-tap resistor  
ladder network that provides a selectable reference  
voltage. Although its primary purpose is to provide a  
reference for the analog comparators, it may also be  
used independently of them.  
If CVRR = 1:  
CVREF = ((CVR<3:0>)/24) x CVRSRC  
A block diagram of the module is shown in Figure 22-1.  
The resistor ladder is segmented to provide two ranges  
of CVREF values and has a power-down function to  
conserve power when the reference is not being used.  
The module’s supply reference can be provided from  
either device VDD/VSS or an external voltage reference.  
If CVRR = 0:  
CVREF = (CVRSRC x 1/4) + (((CVR<3:0>)/32) x  
CVRSRC)  
The comparator reference supply voltage can come  
from either VDD and VSS, or the external VREF+ and  
VREF- that are multiplexed with RA2 and RA3. The  
voltage source is selected by the CVRSS bit  
(CVRCON<4>).  
22.1 Configuring the Comparator  
Voltage Reference  
The settling time of the comparator voltage reference  
must be considered when changing the CVREF  
output (see Table 27-3 in Section 27.0 “Electrical  
Characteristics”).  
The voltage reference module is controlled through the  
CVRCON register (Register 22-1). The comparator  
voltage reference provides two ranges of output  
voltage, each with 16 distinct levels. The range to be  
REGISTER 22-1: CVRCON: COMPARATOR VOLTAGE REFERENCE CONTROL REGISTER  
R/W-0  
CVREN CVROE(1)  
bit 7  
R/W-0  
R/W-0  
CVRR  
R/W-0  
R/W-0  
CVR3  
R/W-0  
CVR2  
R/W-0  
CVR1  
R/W-0  
CVR0  
CVRSS  
bit 0  
bit 7  
bit 6  
CVREN: Comparator Voltage Reference Enable bit  
1= CVREF circuit powered on  
0= CVREF circuit powered down  
CVROE: Comparator VREF Output Enable bit(1)  
1= CVREF voltage level is also output on the RA2/AN2/VREF-/CVREF pin  
0= CVREF voltage is disconnected from the RA2/AN2/VREF-/CVREF pin  
Note 1: CVROE overrides the TRISA<2> bit setting.  
CVRR: Comparator VREF Range Selection bit  
bit 5  
1= 0.00 CVRSRC to 0.667 CVRSRC, with CVRSRC/24 step size (low range)  
0= 0.25 CVRSRC to 0.75 CVRSRC, with CVRSRC/32 step size (high range)  
bit 4  
CVRSS: Comparator VREF Source Selection bit  
1= Comparator reference source, CVRSRC = (VREF+) – (VREF-)  
0= Comparator reference source, CVRSRC = VDD – VSS  
bit 3-0  
CVR<3:0>: Comparator VREF Value Selection bits (0 (CVR<3:0>) 15)  
When CVRR = 1:  
CVREF = ((CVR<3:0>)/24) (CVRSRC)  
When CVRR = 0:  
CVREF = (CVRSRC/4) + ((CVR<3:0>)/32) (CVRSRC)  
Legend:  
R = Readable bit  
-n = Value at POR  
W = Writable bit  
‘1’ = Bit is set  
U = Unimplemented bit, read as ‘0’  
‘0’ = Bit is cleared x = Bit is unknown  
© 2009 Microchip Technology Inc.  
DS39689F-page 249  
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FIGURE 22-1:  
COMPARATOR VOLTAGE REFERENCE BLOCK DIAGRAM  
CVRSS = 1  
VREF+  
VDD  
8R  
CVRSS = 0  
CVR<3:0>  
R
CVREN  
R
R
R
16 Steps  
CVREF  
R
R
R
CVRR  
VREF-  
8R  
CVRSS = 1  
CVRSS = 0  
22.2 Voltage Reference Accuracy/Error  
22.4 Effects of a Reset  
The full range of voltage reference cannot be realized  
due to the construction of the module. The transistors  
on the top and bottom of the resistor ladder network  
(Figure 22-1) keep CVREF from approaching the  
reference source rails. The voltage reference is derived  
from the reference source; therefore, the CVREF output  
changes with fluctuations in that source. The tested  
absolute accuracy of the voltage reference can be  
found in Section 27.0 “Electrical Characteristics”.  
A device Reset disables the voltage reference by  
clearing bit, CVREN (CVRCON<7>). This Reset also  
disconnects the reference from the RA2 pin by clearing  
bit, CVROE (CVRCON<6>) and selects the high-voltage  
range by clearing bit, CVRR (CVRCON<5>). The CVR  
value select bits are also cleared.  
22.5 Connection Considerations  
The voltage reference module operates independently  
of the comparator module. The output of the reference  
generator may be connected to the RA2 pin if the  
CVROE bit is set. Enabling the voltage reference  
output onto RA2 when it is configured as a digital input  
will increase current consumption. Connecting RA2 as  
a digital output with CVRSS enabled will also increase  
current consumption.  
22.3 Operation During Sleep  
When the device wakes up from Sleep through an  
interrupt or a Watchdog Timer time-out, the contents of  
the CVRCON register are not affected. To minimize  
current consumption in Sleep mode, the voltage  
reference should be disabled.  
The RA2 pin can be used as a simple D/A output with  
limited drive capability. Due to the limited current drive  
capability, a buffer must be used on the voltage  
reference output for external connections to VREF.  
Figure 22-2 shows an example buffering technique.  
DS39689F-page 250  
© 2009 Microchip Technology Inc.  
PIC18F2221/2321/4221/4321 FAMILY  
FIGURE 22-2:  
COMPARATOR VOLTAGE REFERENCE OUTPUT BUFFER EXAMPLE  
PIC18FXXXX  
CVREF  
Module  
(1)  
R
+
CVREF Output  
RA2  
Voltage  
Reference  
Output  
Impedance  
Note 1: R is dependent upon the voltage reference configuration bits, CVRCON<3:0> and CVRCON<5>.  
TABLE 22-1: REGISTERS ASSOCIATED WITH COMPARATOR VOLTAGE REFERENCE  
Reset  
Values  
on page  
Name  
Bit 7  
Bit 6  
Bit 5  
Bit 4  
Bit 3  
Bit 2  
Bit 1  
Bit 0  
CVRCON  
CMCON  
TRISA  
CVREN  
C2OUT  
CVROE  
C1OUT  
CVRR  
C2INV  
CVRSS  
C1INV  
CVR3  
CIS  
CVR2  
CM2  
CVR1  
CM1  
CVR0  
CM0  
57  
57  
58  
TRISA7(1) TRISA6(1) PORTA Data Direction Control Register  
Legend: Shaded cells are not used with the comparator voltage reference.  
Note 1: PORTA pins are enabled based on oscillator configuration.  
© 2009 Microchip Technology Inc.  
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NOTES:  
DS39689F-page 252  
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The High/Low-Voltage Detect Control register  
23.0 HIGH/LOW-VOLTAGE DETECT  
(Register 23-1) completely controls the operation of the  
HLVD module. This allows the circuitry to be “turned  
off” by the user under software control, which  
minimizes the current consumption for the device.  
(HLVD)  
PIC18F2221/2321/4221/4321 family devices have a  
High/Low-Voltage Detect module (HLVD). This is a  
programmable circuit that allows the user to specify both  
a device voltage trip point and the direction of change  
from that point. If the device experiences an excursion  
past the trip point in that direction, an interrupt flag is set.  
If the interrupt is enabled, the program execution will  
branch to the interrupt vector address and the software  
can then respond to the interrupt.  
The block diagram for the HLVD module is shown in  
Figure 23-1.  
REGISTER 23-1: HLVDCON: HIGH/LOW-VOLTAGE DETECT CONTROL REGISTER  
R/W-0  
VDIRMAG  
bit 7  
U-0  
R-0  
R/W-0  
R/W-0  
R/W-1  
R/W-0  
R/W-1  
IRVST  
HLVDEN HLVDL3  
HLVDL2  
HLVDL1  
HLVDL0  
bit 0  
bit 7  
VDIRMAG: Voltage Direction Magnitude Select bit  
1= Event occurs when voltage equals or exceeds trip point (HLVDL<3:0>)  
0= Event occurs when voltage equals or falls below trip point (HLVDL<3:0>)  
bit 6  
bit 5  
Unimplemented: Read as ‘0’  
IRVST: Internal Reference Voltage Stable Flag bit  
1= Indicates that the voltage detect logic will generate the interrupt flag at the specified voltage  
range  
0= Indicates that the voltage detect logic will not generate the interrupt flag at the specified  
voltage range and the HLVD interrupt should not be enabled  
bit 4  
HLVDEN: High/Low-Voltage Detect Power Enable bit  
1= HLVD enabled  
0= HLVD disabled  
bit 3-0  
HLVDL<3:0>: Voltage Detection Limit bits  
1111= External analog input is used (input comes from the HLVDIN pin)  
1110= Maximum setting  
.
.
.
0000= Minimum setting  
Note:  
See Table 27-4 in Section 27.0 “Electrical Characteristics” for the specifications.  
Legend:  
R = Readable bit  
-n = Value at POR  
W = Writable bit  
‘1’ = Bit is set  
U = Unimplemented bit, read as ‘0’  
‘0’ = Bit is cleared  
x = Bit is unknown  
The module is enabled by setting the HLVDEN bit.  
Each time that the HLVD module is enabled, the  
circuitry requires some time to stabilize. The IRVST bit  
is a read-only bit and is used to indicate when the circuit  
is stable. The module can only generate an interrupt  
after the circuit is stable and IRVST is set.  
The VDIRMAG bit determines the overall operation of  
the module. When VDIRMAG is cleared, the module  
monitors for drops in VDD below a predetermined set  
point. When the bit is set, the module monitors for rises  
in VDD above the set point.  
© 2009 Microchip Technology Inc.  
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The trip point voltage is software programmable to  
any one of 16 values. The trip point is selected by  
programming the HLVDL<3:0> bits (HLVDCON<3:0>).  
23.1 Operation  
When the HLVD module is enabled, a comparator uses  
an internally generated reference voltage as the set  
point. The set point is compared with the trip point,  
where each node in the resistor divider represents a  
trip point voltage. The “trip point” voltage is the voltage  
level at which the device detects a high or low-voltage  
event, depending on the configuration of the module.  
When the supply voltage is equal to the trip point, the  
voltage tapped off of the resistor array is equal to the  
internal reference voltage generated by the voltage  
reference module. The comparator then generates an  
interrupt signal by setting the HLVDIF bit.  
The HLVD module has an additional feature that allows  
the user to supply the trip voltage to the module from an  
external source. This mode is enabled when bits  
HLVDL<3:0> are set to ‘1111’. In this state, the  
comparator input is multiplexed from the external input  
pin, HLVDIN. This gives users flexibility because it  
allows them to configure the High/Low-Voltage Detect  
interrupt to occur at any voltage in the valid operating  
range.  
FIGURE 23-1:  
HLVD MODULE BLOCK DIAGRAM (WITH EXTERNAL INPUT)  
Externally Generated  
Trip Point  
VDD  
VDD  
HLVDL<3:0>  
HLVDCON  
Register  
HLVDIN  
VDIRMAG  
HLVDEN  
HLVDIN  
Set  
HLVDIF  
HLVDEN  
BOREN  
Internal Voltage  
Reference  
DS39689F-page 254  
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Depending on the application, the HLVD module does  
23.2 HLVD Setup  
not need to be operating constantly. To decrease the  
current requirements, the HLVD circuitry may only  
need to be enabled for short periods where the voltage  
is checked. After doing the check, the HLVD module  
may be disabled.  
The following steps are needed to set up the HLVD  
module:  
1. Disable the module by clearing the HLVDEN bit  
(HLVDCON<4>).  
2. Write the value to the HLVDL<3:0> bits that  
selects the desired HLVD trip point.  
23.4 HLVD Start-up Time  
3. Set the VDIRMAG bit to detect high voltage  
The internal reference voltage of the HLVD module,  
specified in electrical specification parameter D420,  
may be used by other internal circuitry, such as the  
Programmable Brown-out Reset. If the HLVD or other  
circuits using the voltage reference are disabled to  
lower the device’s current consumption, the reference  
voltage circuit will require time to become stable before  
a low or high-voltage condition can be reliably  
detected. This start-up time, TIRVST, is an interval that  
is independent of device clock speed. It is specified in  
electrical specification parameter 36.  
(VDIRMAG = 1) or low voltage (VDIRMAG = 0).  
4. Enable the HLVD module by setting the  
HLVDEN bit.  
5. Clear the HLVD interrupt flag (PIR2<2>), which  
may have been set from a previous interrupt.  
6. Enable the HLVD interrupt if interrupts are  
desired by setting the HLVDIE and GIE bits  
(PIE<2> and INTCON<7>). An interrupt will not  
be generated until the IRVST bit is set.  
The HLVD interrupt flag is not enabled until TIRVST has  
expired and a stable reference voltage is reached. For  
this reason, brief excursions beyond the set point may  
not be detected during this interval. Refer to  
Figure 23-2 or Figure 23-3.  
23.3 Current Consumption  
When the module is enabled, the HLVD comparator  
and voltage divider are enabled and will consume static  
current. The total current consumption, when enabled,  
is specified in electrical specification parameter D022B.  
FIGURE 23-2:  
LOW-VOLTAGE DETECT OPERATION (VDIRMAG = 0)  
CASE 1:  
HLVDIF may not be set  
VDD  
VLVD  
HLVDIF  
Enable HLVD  
IRVST  
TIRVST  
HLVDIF cleared in software  
Internal Reference is stable  
CASE 2:  
VDD  
VLVD  
HLVDIF  
Enable HLVD  
TIRVST  
IRVST  
Internal Reference is stable  
HLVDIF cleared in software  
HLVDIF cleared in software,  
HLVDIF remains set since HLVD condition still exists  
© 2009 Microchip Technology Inc.  
DS39689F-page 255  
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FIGURE 23-3:  
HIGH-VOLTAGE DETECT OPERATION (VDIRMAG = 1)  
CASE 1:  
HLVDIF may not be set  
VLVD  
VDD  
HLVDIF  
Enable HLVD  
IRVST  
TIRVST  
HLVDIF cleared in software  
Internal Reference is stable  
CASE 2:  
VLVD  
VDD  
HLVDIF  
Enable HLVD  
TIRVST  
IRVST  
Internal Reference is stable  
HLVDIF cleared in software  
HLVDIF cleared in software,  
HLVDIF remains set since HLVD condition still exists  
FIGURE 23-4:  
TYPICAL LOW-VOLTAGE  
DETECT APPLICATION  
23.5 Applications  
In many applications, the ability to detect a drop below  
or rise above a particular threshold is desirable. For  
example, the HLVD module could be periodically  
enabled to detect a Universal Serial Bus (USB) attach  
or detach. This assumes the device is powered by a  
lower voltage source than the USB when detached. An  
attach would indicate a high-voltage detect from, for  
example, 3.3V to 5V (the voltage on USB) and vice  
versa for a detach. This feature could save a design a  
few extra components and an attach signal (input pin).  
VA  
VB  
For general battery applications, Figure 23-4 shows a  
possible voltage curve. Over time, the device voltage  
decreases. When the device voltage reaches voltage  
VA, the HLVD logic generates an interrupt at time TA.  
The interrupt could cause the execution of an ISR,  
which would allow the application to perform “house-  
keeping tasks” and perform a controlled shutdown  
before the device voltage exits the valid operating  
range at TB. The HLVD, thus, would give the applica-  
tion a time window, represented by the difference  
between TA and TB, to safely exit.  
TB  
VA = HLVD trip point  
VB = Minimum valid device  
operating voltage  
TA  
Time  
Legend:  
DS39689F-page 256  
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23.6 Operation During Sleep  
23.7 Effects of a Reset  
When enabled, the HLVD circuitry continues to operate  
during Sleep. If the device voltage crosses the trip  
point, the HLVDIF bit will be set and the device will  
wake-up from Sleep. Device execution will continue  
from the interrupt vector address if interrupts have  
been globally enabled.  
A device Reset forces all registers to their Reset state.  
This forces the HLVD module to be turned off.  
TABLE 23-1: REGISTERS ASSOCIATED WITH HIGH/LOW-VOLTAGE DETECT MODULE  
Reset  
Values  
on Page  
Name  
Bit 7  
Bit 6  
Bit 5  
Bit 4  
Bit 3  
Bit 2  
Bit 1  
Bit 0  
HLVDCON VDIRMAG  
IRVST  
HLVDEN HLVDL3 HLVDL2 HLVDL1 HLVDL0  
56  
55  
58  
58  
58  
INTCON  
PIR2  
GIE/GIEH PEIE/GIEL TMR0IE  
INT0IE  
EEIF  
RBIE  
BCLIF  
BCLIE  
BCLIP  
TMR0IF  
HLVDIF  
INT0IF  
RBIF  
OSCFIF  
OSCFIE  
OSCFIP  
CMIF  
CMIE  
CMIP  
TMR3IF CCP2IF  
PIE2  
EEIE  
EEIP  
HLVDIE TMR3IE CCP2IE  
HLVDIP TMR3IP CCP2IP  
IPR2  
Legend: — = unimplemented, read as ‘0’. Shaded cells are unused by the HLVD module.  
© 2009 Microchip Technology Inc.  
DS39689F-page 257  
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NOTES:  
DS39689F-page 258  
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The inclusion of an internal RC oscillator also provides  
24.0 SPECIAL FEATURES OF THE  
the additional benefits of a Fail-Safe Clock Monitor  
(FSCM) and Two-Speed Start-up. FSCM provides for  
background monitoring of the peripheral clock and  
automatic switchover in the event of its failure. Two-  
Speed Start-up enables code to be executed almost  
immediately on start-up, while the primary clock source  
completes its start-up delays.  
CPU  
PIC18F2221/2321/4221/4321 family devices include  
several features intended to maximize reliability and  
minimize cost through elimination of external  
components. These are:  
• Oscillator Selection  
• Resets:  
All of these features are enabled and configured by  
setting the appropriate Configuration register bits.  
- Power-on Reset (POR)  
- Power-up Timer (PWRT)  
- Oscillator Start-up Timer (OST)  
- Brown-out Reset (BOR)  
• Interrupts  
24.1 Configuration Bits  
The Configuration bits can be programmed (read as  
0’) or left unprogrammed (read as ‘1’) to select various  
device configurations. These bits are mapped starting  
at program memory location 300000h.  
• Watchdog Timer (WDT)  
• Fail-Safe Clock Monitor  
• Two-Speed Start-up  
• Code Protection  
The user will note that address 300000h is beyond the  
user program memory space. In fact, it belongs to the  
configuration memory space (300000h-3FFFFFh), which  
can only be accessed using table reads and table writes.  
• ID Locations  
• In-Circuit Serial Programming  
Programming the Configuration registers is done in a  
manner similar to programming the Flash memory. The  
WR bit in the EECON1 register starts a self-timed write  
to the Configuration register. In normal operation mode,  
a TBLWT instruction with the TBLPTR pointing to the  
Configuration register sets up the address and the data  
for the Configuration register write. Setting the WR bit  
starts a long write to the Configuration register. The  
Configuration registers are written a byte at a time. To  
write or erase a configuration cell, a TBLWTinstruction  
can write a ‘1’ or a ‘0’ into the cell. For additional details  
on Flash programming, refer to Section 7.5 “Writing  
to Flash Program Memory”.  
The oscillator can be configured for the application  
depending on frequency, power, accuracy and cost. All  
of the options are discussed in detail in Section 3.0  
“Oscillator Configurations”.  
A complete discussion of device Resets and interrupts  
is available in previous sections of this data sheet.  
In addition to their Power-up and Oscillator Start-up  
Timers provided for Resets, PIC18F2221/2321/4221/  
4321 family devices have a Watchdog Timer, which is  
either permanently enabled via the Configuration bits  
or software controlled (if configured as disabled).  
TABLE 24-1: CONFIGURATION BITS AND DEVICE IDs  
Default/  
Unprogrammed  
Value  
File Name  
Bit 7  
Bit 6  
Bit 5  
Bit 4  
Bit 3  
Bit 2  
Bit 1  
Bit 0  
300001h CONFIG1H  
300002h CONFIG2L  
300003h CONFIG2H  
IESO  
FCMEN  
FOSC3  
FOSC2  
FOSC1  
FOSC0  
00-- 0111  
---1 1111  
---1 1111  
1--- -011  
1000 01-1  
---- --11  
11-- ----  
---- --11  
111- ----  
---- --11  
-1-- ----  
BORV1  
BORV0 BOREN1 BOREN0 PWRTEN  
WDTPS3 WDTPS2 WDTPS1 WDTPS0 WDTEN  
300005h CONFIG3H MCLRE  
r
LPT1OSC PBADEN CCP2MX  
300006h CONFIG4L DEBUG XINST BBSIZ1 BBSIZ0  
LVP  
CP1  
STVREN  
CP0  
300008h CONFIG5L  
300009h CONFIG5H  
30000Ah CONFIG6L  
CPD  
CPB  
WRT1  
WRT0  
30000Bh CONFIG6H WRTD  
WRTB  
WRTC  
30000Ch CONFIG7L  
30000Dh CONFIG7H  
EBTR1  
EBTR0  
EBTRB  
DEV1  
DEV9  
(1)  
(2)  
3FFFFEh DEVID1  
DEV2  
DEV10  
DEV0  
DEV8  
REV4  
DEV7  
REV3  
DEV6  
REV2  
DEV5  
REV1  
DEV4  
REV0  
DEV3  
xxxx xxxx  
(1)  
3FFFFFh DEVID2  
0000 1100  
Legend:  
x= unknown, u= unchanged, -= unimplemented, q= value depends on condition, r= reserved, maintain as ‘0’.  
Shaded cells are unimplemented, read as ‘0’.  
Note 1: Unimplemented in PIC18F2221/4221 devices; maintain these bits set.  
2: See Register 24-14 for DEVID1 values. DEVID registers are read-only and cannot be programmed by the user.  
© 2009 Microchip Technology Inc.  
DS39689F-page 259  
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REGISTER 24-1: CONFIG1H:CONFIGURATIONREGISTER1HIGH(BYTE ADDRESS300001h)  
R/P-0  
IESO  
R/P-0  
U-0  
U-0  
R/P-0  
R/P-1  
R/P-1  
R/P-1  
FCMEN  
FOSC3  
FOSC2  
FOSC1  
FOSC0  
bit 7  
bit 0  
bit 7  
bit 6  
IESO: Internal/External Oscillator Switchover bit  
1= Oscillator Switchover mode enabled  
0= Oscillator Switchover mode disabled  
FCMEN: Fail-Safe Clock Monitor Enable bit  
1= Fail-Safe Clock Monitor enabled  
0= Fail-Safe Clock Monitor disabled  
bit 5-4 Unimplemented: Read as ‘0’  
bit 3-0 FOSC<3:0>: Oscillator Selection bits  
11xx= External RC oscillator, CLKO function on RA6  
101x= External RC oscillator, CLKO function on RA6  
1001= Internal oscillator block, CLKO function on RA6, port function on RA7  
1000= Internal oscillator block, port function on RA6 and RA7  
0111= External RC oscillator, port function on RA6  
0110= HS oscillator, PLL enabled (Clock Frequency = 4 x FOSC1)  
0101= EC oscillator, port function on RA6  
0100= EC oscillator, CLKO function on RA6  
0011= External RC oscillator, CLKO function on RA6  
0010= HS oscillator  
0001= XT oscillator  
0000= LP oscillator  
Legend:  
R = Readable bit  
P = Programmable bit U = Unimplemented bit, read as ‘0’  
u = Unchanged from programmed state  
-n = Value when device is unprogrammed  
DS39689F-page 260  
© 2009 Microchip Technology Inc.  
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REGISTER 24-2: CONFIG2L:CONFIGURATION REGISTER 2 LOW (BYTE ADDRESS300002h)  
U-0  
U-0  
U-0  
R/P-1  
R/P-1  
R/P-1  
R/P-1  
R/P-1  
BORV1(1) BORV0(1) BOREN1(2) BOREN0(2) PWRTEN(2)  
bit 7  
bit 0  
bit 7-5 Unimplemented: Read as ‘0’  
bit 4-3 BORV<1:0>: Brown-out Reset Voltage bits(1)  
11= Minimum setting  
.
.
.
00= Maximum setting  
bit 2-1 BOREN<1:0>: Brown-out Reset Enable bits(2)  
11= Brown-out Reset enabled in hardware only (SBOREN is disabled)  
10= Brown-out Reset enabled in hardware only and disabled in Sleep mode  
(SBOREN is disabled)  
01= Brown-out Reset enabled and controlled by software (SBOREN is enabled)  
00= Brown-out Reset disabled in hardware and software  
bit 0  
PWRTEN: Power-up Timer Enable bit(2)  
1= PWRT disabled  
0= PWRT enabled  
Note 1: See Section 27.1 “DC Characteristics” for the specifications.  
2: The Power-up Timer is decoupled from Brown-out Reset, allowing these features to  
be independently controlled.  
Legend:  
R = Readable bit  
P = Programmable bit U = Unimplemented bit, read as ‘0’  
u = Unchanged from programmed state  
-n = Value when device is unprogrammed  
© 2009 Microchip Technology Inc.  
DS39689F-page 261  
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REGISTER 24-3: CONFIG2H: CONFIGURATION REGISTER 2 HIGH (BYTE ADDRESS 300003h)  
U-0  
U-0  
U-0  
R/P-1  
R/P-1  
R/P-1  
R/P-1  
R/P-1  
WDTPS3 WDTPS2 WDTPS1 WDTPS0 WDTEN  
bit 0  
bit 7  
bit 7-5  
bit 4-1  
Unimplemented: Read as ‘0’  
WDTPS<3:0>: Watchdog Timer Postscale Select bits  
1111= 1:32,768  
1110= 1:16,384  
1101= 1:8,192  
1100= 1:4,096  
1011= 1:2,048  
1010= 1:1,024  
1001= 1:512  
1000= 1:256  
0111= 1:128  
0110= 1:64  
0101= 1:32  
0100= 1:16  
0011= 1:8  
0010= 1:4  
0001= 1:2  
0000= 1:1  
bit 0  
WDTEN: Watchdog Timer Enable bit  
1= WDT enabled  
0= WDT disabled (control is placed on the SWDTEN bit)  
Legend:  
R = Readable bit  
P = Programmable bit U = Unimplemented bit, read as ‘0’  
-n = Value when device is unprogrammed  
u = Unchanged from programmed state  
DS39689F-page 262  
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REGISTER 24-4: CONFIG3H: CONFIGURATION REGISTER 3 HIGH (BYTE ADDRESS 300005h)  
R/P-1  
U-0  
U-0  
U-0  
U-0  
R/P-0  
R/P-1  
R/P-1  
MCLRE  
LPT1OSC PBADEN CCP2MX  
bit 0  
bit 7  
bit 7  
MCLRE: MCLR Pin Enable bit  
1= MCLR pin enabled; RE3 input pin disabled  
0= RE3 input pin enabled; MCLR disabled  
bit 6-3 Unimplemented: Read as ‘0’  
bit 2  
LPT1OSC: Low-Power Timer1 Oscillator Enable bit  
1= Timer1 configured for low-power operation  
0= Timer1 configured for higher power operation  
bit 1  
PBADEN: PORTB A/D Enable bit  
(Affects ADCON1 Reset state. ADCON1 controls PORTB<4:0> pin configuration.)  
1= PORTB<4:0> pins are configured as analog input channels on Reset  
0= PORTB<4:0> pins are configured as digital I/O on Reset  
bit 0  
CCP2MX: CCP2 MUX bit  
1= CCP2 input/output is multiplexed with RC1  
0= CCP2 input/output is multiplexed with RB3  
Legend:  
R = Readable bit  
P = Programmable bit U = Unimplemented bit, read as ‘0’  
u = Unchanged from programmed state  
-n = Value when device is unprogrammed  
© 2009 Microchip Technology Inc.  
DS39689F-page 263  
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REGISTER 24-5: CONFIG4L:CONFIGURATION REGISTER 4 LOW (BYTE ADDRESS300006h)  
R/P-1  
R/P-0  
U-0  
U-0  
r-0  
R/P-1  
LVP  
U-0  
R/P-1  
STVREN  
bit 0  
DEBUG  
XINST  
BBSIZ1  
BBSIZ0  
bit 7  
bit 7  
bit 6  
DEBUG: Background Debugger Enable bit  
1= Background debugger disabled, RB6 and RB7 configured as general purpose I/O pins  
0= Background debugger enabled, RB6 and RB7 are dedicated to in-circuit debug  
XINST: Extended Instruction Set Enable bit  
1= Instruction set extension and Indexed Addressing mode enabled  
0= Instruction set extension and Indexed Addressing mode disabled (Legacy mode)  
bit 5-4 BBSIZ<1:0>: Boot Block Size Select bits  
PIC18F4221/4321 Devices:  
1x= 1024 Words  
01= 512 Words  
00= 256 Words  
PIC18F2221/2321 Devices:  
1x= 512 Words  
x1= 512 Words  
00= 256 Words  
bit 3  
bit 2  
Reserved: Maintain as ‘0’  
LVP: Single-Supply ICSP™ Enable bit  
1= Single-Supply ICSP enabled  
0= Single-Supply ICSP disabled  
bit 1  
bit 0  
Unimplemented: Read as ‘0’  
STVREN: Stack Full/Underflow Reset Enable bit  
1= Stack full/underflow will cause Reset  
0= Stack full/underflow will not cause Reset  
Legend:  
r = Reserved bit, program as ‘0’  
R = Readable bit  
C = Clearable bit  
U = Unimplemented bit, read as ‘0’  
-n = Value when device is unprogrammed  
u = Unchanged from programmed state  
DS39689F-page 264  
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REGISTER 24-6: CONFIG5L:CONFIGURATION REGISTER 5 LOW (BYTE ADDRESS300008h)  
U-0  
U-0  
U-0  
U-0  
U-0  
U-0  
R/C-1  
CP1  
R/C-1  
CP0  
bit 7  
bit 0  
bit 7-2 Unimplemented: Read as ‘0’  
bit 1  
CP1: Code Protection bit  
1= Block 1 not code-protected(1)  
0= Block 1 code-protected(1)  
bit 0  
CP0: Code Protection bit  
1= Block 0 not code-protected(1)  
0= Block 0 code-protected(1)  
Note 1: See Figure 24-5 for variable block boundaries.  
Legend:  
R = Readable bit  
-n = Value when device is unprogrammed  
C = Clearable bit  
U = Unimplemented bit, read as ‘0’  
u = Unchanged from programmed state  
REGISTER 24-7: CONFIG5H:CONFIGURATIONREGISTER5 HIGH(BYTEADDRESS300009h)  
R/C-1  
CPD  
R/C-1  
CPB  
U-0  
U-0  
U-0  
U-0  
U-0  
U-0  
bit 7  
bit 0  
bit 7  
bit 6  
CPD: Data EEPROM Code Protection bit  
1= Data EEPROM not code-protected  
0= Data EEPROM code-protected  
CPB: Boot Block Code Protection bit  
1= Boot block not code-protected(1)  
0= Boot block code-protected(1)  
bit 5-0 Unimplemented: Read as ‘0’  
Note 1: See Figure 24-5 for variable block boundaries.  
Legend:  
R = Readable bit  
C = Clearable bit  
U = Unimplemented bit, read as ‘0’  
u = Unchanged from programmed state  
-n = Value when device is unprogrammed  
© 2009 Microchip Technology Inc.  
DS39689F-page 265  
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REGISTER 24-8: CONFIG6L: CONFIGURATION REGISTER 6 LOW (BYTE ADDRESS 30000Ah)  
U-0  
U-0  
U-0  
U-0  
U-0  
U-0  
R/C-1  
WRT1  
R/C-1  
WRT0  
bit 7  
bit 0  
bit 7-2 Unimplemented: Read as ‘0’  
bit 1  
WRT1: Write Protection bit  
1= Block 1 not write-protected(1)  
0= Block 1 write-protected(1)  
bit 0  
WRT0: Write Protection bit  
1= Block 0 not write-protected(1)  
0= Block 0 write-protected(1)  
Note 1: See Figure 24-5 for variable block boundaries.  
Legend:  
R = Readable bit  
C = Clearable bit  
U = Unimplemented bit, read as ‘0’  
u = Unchanged from programmed state  
-n = Value when device is unprogrammed  
REGISTER 24-9: CONFIG6H:CONFIGURATION REGISTER6 HIGH(BYTE ADDRESS30000Bh)  
R/C-1  
R/C-1  
R-1  
WRTC(1)  
U-0  
U-0  
U-0  
U-0  
U-0  
WRTD  
WRTB  
bit 7  
bit 0  
bit 7  
bit 6  
bit 5  
WRTD: Data EEPROM Write Protection bit  
1= Data EEPROM not write-protected  
0= Data EEPROM write-protected  
WRTB: Boot Block Write Protection bit  
1= Boot block not write-protected(2)  
0= Boot block write-protected(2)  
WRTC: Configuration Register Write Protection bit(1)  
1= Configuration registers (300000-3000FFh) not write-protected  
0= Configuration registers (300000-3000FFh) write-protected  
bit 4-0 Unimplemented: Read as ‘0’  
Note 1: This bit is read-only in normal execution mode; it can be written only in Program mode.  
2: See Figure 24-5 for block boundaries.  
Legend:  
R = Readable bit  
-n = Value when device is unprogrammed  
C = Clearable bit  
U = Unimplemented bit, read as ‘0’  
u = Unchanged from programmed state  
DS39689F-page 266  
© 2009 Microchip Technology Inc.  
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REGISTER 24-10: CONFIG7L:CONFIGURATIONREGISTER7LOW(BYTEADDRESS30000Ch)  
U-0  
U-0  
U-0  
U-0  
U-0  
U-0  
R/C-1  
R/C-1  
EBTR1  
EBTR0  
bit 7  
bit 0  
bit 7-2 Unimplemented: Read as ‘0’  
bit 1  
EBTR1: Table Read Protection bit  
1= Block 1 not protected from table reads executed in other blocks(1)  
0= Block 1 protected from table reads executed in other blocks(1)  
bit 0  
EBTR0: Table Read Protection bit  
1= Block 0 not protected from table reads executed in other blocks(1)  
0= Block 0 protected from table reads executed in other blocks(1)  
Note 1: See Figure 24-5 for variable block boundaries.  
Legend:  
R = Readable bit  
C = Clearable bit  
U = Unimplemented bit, read as ‘0’  
u = Unchanged from programmed state  
-n = Value when device is unprogrammed  
REGISTER 24-11: CONFIG7H:CONFIGURATION REGISTER7 HIGH(BYTE ADDRESS30000Dh)  
U-0  
R/C-1  
U-0  
U-0  
U-0  
U-0  
U-0  
U-0  
EBTRB  
bit 7  
bit 0  
bit 7  
bit 6  
Unimplemented: Read as ‘0’  
EBTRB: Boot Block Table Read Protection bit  
1= Boot block not protected from table reads executed in other blocks(1)  
0= Boot block protected from table reads executed in other blocks(1)  
bit 5-0 Unimplemented: Read as ‘0’  
Note 1: See Figure 24-5 for variable block boundaries.  
Legend:  
R = Readable bit  
C = Clearable bit  
U = Unimplemented bit, read as ‘0’  
-n = Value when device is unprogrammed  
u = Unchanged from programmed state  
© 2009 Microchip Technology Inc.  
DS39689F-page 267  
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REGISTER 24-12: DEVID1:DEVICE ID REGISTER 1 FOR PIC18F2221/2321/4221/4321 DEVICES  
R
R
R
R
R
R
R
R
DEV2  
DEV1  
DEV0  
REV4  
REV3  
REV2  
REV1  
REV0  
bit 7  
bit 0  
bit 7-5 DEV<2:0>: Device ID bits  
000= PIC18F4321  
010= PIC18F4221  
001= PIC18F2321  
011= PIC18F2221  
bit 4-0 REV<4:0>: Revision ID bits  
These bits are used to indicate the device revision.  
Legend:  
R = Read-only bit  
P = Programmable bit U = Unimplemented bit, read as ‘0’  
u = Unchanged from programmed state  
-n = Value when device is unprogrammed  
REGISTER 24-13: DEVID2:DEVICE ID REGISTER 2 FOR PIC18F2221/2321/4221/4321 DEVICES  
R
R
R
R
R
R
R
R
DEV10  
DEV9  
DEV8  
DEV7  
DEV6  
DEV5  
DEV4  
DEV3  
bit 0  
bit 7  
bit 7-0 DEV<10:3>: Device ID bits  
These bits are used with the DEV<2:0> bits in the Device ID Register 1 to identify the  
part number.  
0010 0001= PIC18F2221/2321/4221/4321 devices  
Note:  
These values for DEV<10:3> may be shared with other devices. The specific  
device is always identified by using the entire DEV<10:0> bit sequence.  
Legend:  
R = Read-only bit  
P = Programmable bit U = Unimplemented bit, read as ‘0’  
-n = Value when device is unprogrammed  
u = Unchanged from programmed state  
DS39689F-page 268  
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24.2 Watchdog Timer (WDT)  
Note 1: The CLRWDT and SLEEP instructions  
clear the WDT and postscaler counts  
when executed.  
For PIC18F2221/2321/4221/4321 family devices, the  
WDT is driven by the INTRC source. When the WDT is  
enabled, the clock source is also enabled. The nominal  
WDT period is 4 ms and has the same stability as the  
INTRC oscillator.  
2: Changing the setting of the IRCF bits  
(OSCCON<6:4>) clears the WDT and  
postscaler counts.  
The 4 ms period of the WDT is multiplied by a 16-bit  
postscaler. Any output of the WDT postscaler is  
selected by a multiplexer, controlled by bits in Configu-  
ration Register 2H. Available periods range from 4 ms  
to 131.072 seconds (2.18 minutes). The WDT and  
postscaler are cleared when any of the following events  
occur: a SLEEPor CLRWDTinstruction is executed, the  
IRCF bits (OSCCON<6:4>) are changed or a clock  
failure has occurred.  
3: When a CLRWDT instruction is executed,  
the postscaler count will be cleared.  
24.2.1  
CONTROL REGISTER  
Register 24-14 shows the WDTCON register. This is a  
readable and writable register which contains a control  
bit that allows software to override the WDT enable  
Configuration bit, but only if the Configuration bit has  
disabled the WDT.  
FIGURE 24-1:  
WDT BLOCK DIAGRAM  
Enable WDT  
SWDTEN  
WDTEN  
WDT Counter  
Wake-up from  
Power-Managed  
Modes  
÷128  
INTRC Source  
Change on IRCF bits  
CLRWDT  
WDT  
Reset  
Reset  
Programmable Postscaler  
1:1 to 1:32,768  
All Device Resets  
4
WDTPS<3:0>  
Sleep  
© 2009 Microchip Technology Inc.  
DS39689F-page 269  
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REGISTER 24-14: WDTCON: WATCHDOG TIMER CONTROL REGISTER  
U-0  
U-0  
U-0  
U-0  
U-0  
U-0  
U-0  
R/W-0  
SWDTEN(1)  
bit 0  
bit 7  
bit 7-1 Unimplemented: Read as ‘0’  
bit 0  
SWDTEN: Software Controlled Watchdog Timer Enable bit(1)  
1= Watchdog Timer is on  
0= Watchdog Timer is off  
Note 1: This bit has no effect if the Configuration bit, WDTEN, is enabled.  
Legend:  
R = Readable bit  
W = Writable bit  
U = Unimplemented bit, read as ‘0’  
-n = Value at POR  
TABLE 24-2: SUMMARY OF WATCHDOG TIMER REGISTERS  
Reset  
Values  
on page  
Name  
Bit 7  
Bit 6  
Bit 5  
Bit 4  
Bit 3  
Bit 2  
Bit 1  
Bit 0  
RCON  
WDTCON  
IPEN  
SBOREN(1)  
RI  
TO  
PD  
POR  
BOR  
56  
56  
SWDTEN  
Legend: — = unimplemented, read as ‘0’. Shaded cells are not used by the Watchdog Timer.  
Note 1: The SBOREN bit is only available when the BOREN<1:0> Configuration bits = 01; otherwise, it is disabled  
and reads as ‘0’. See Section 5.4 “Brown-out Reset (BOR)”.  
DS39689F-page 270  
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In all other power-managed modes, Two-Speed Start-  
24.3 Two-Speed Start-up  
up is not used. The device will be clocked by the  
currently selected clock source until the primary clock  
source becomes available. The setting of the IESO bit  
is ignored.  
The Two-Speed Start-up feature helps to minimize the  
latency period from oscillator start-up to code execution  
by allowing the microcontroller to use the INTOSC  
oscillator as a clock source until the primary clock  
source is available. It is enabled by setting the IESO  
Configuration bit.  
24.3.1  
SPECIAL CONSIDERATIONS FOR  
USING TWO-SPEED START-UP  
Two-Speed Start-up should be enabled only if the  
primary oscillator mode is LP, XT, HS or HSPLL  
(crystal-based modes). Other sources do not require  
an OST start-up delay; for these, Two-Speed Start-up  
should be disabled.  
While using the INTOSC oscillator in Two-Speed Start-  
up, the device still obeys the normal command  
sequences for entering power-managed modes,  
including multiple SLEEP instructions (refer to  
Section 4.1.4 “Multiple Sleep Commands”). In  
practice, this means that user code can change the  
SCS<1:0> bit settings or issue SLEEP instructions  
before the OST times out. This would allow an applica-  
tion to briefly wake-up, perform routine “housekeeping”  
tasks and return to Sleep before the device starts to  
operate from the primary oscillator.  
When enabled, Resets and wake-ups from Sleep mode  
cause the device to configure itself to run from the  
internal oscillator block as the clock source, following  
the time-out of the Power-up Timer after a Power-on  
Reset is enabled. This allows almost immediate code  
execution while the primary oscillator starts and the  
OST is running. Once the OST times out, the device  
automatically switches to PRI_RUN mode.  
User code can also check if the primary clock source is  
currently providing the device clocking by checking the  
status of the OSTS bit (OSCCON<3>). If the bit is set,  
the primary oscillator is providing the clock. Otherwise,  
the internal oscillator block is providing the clock during  
wake-up from Reset or Sleep mode.  
To use a higher clock speed on wake-up, the INTOSC  
or postscaler clock sources can be selected to provide  
a higher clock speed by setting bits, IRCF<2:0>,  
immediately after Reset. For wake-ups from Sleep, the  
INTOSC or postscaler clock sources can be selected  
by setting the IRCF<2:0> bits prior to entering Sleep  
mode.  
FIGURE 24-2:  
TIMING TRANSITION FOR TWO-SPEED START-UP (INTOSC TO HSPLL)  
Q3  
Q4  
Q1  
Q2 Q3 Q4 Q1 Q2 Q3  
Q1  
Q2  
INTOSC  
Multiplexer  
OSC1  
(1)  
(1)  
TPLL  
TOST  
1
2
n-1  
n
PLL Clock  
Output  
Clock  
Transition(2)  
CPU Clock  
Peripheral  
Clock  
Program  
Counter  
PC + 4  
PC + 6  
PC  
PC + 2  
Wake from Interrupt Event  
OSTS bit Set  
Note 1: TOST = 1024 TOSC; TPLL = 2 ms (approx). These intervals are not shown to scale.  
2: Clock transition typically occurs within 2-4 TOSC.  
© 2009 Microchip Technology Inc.  
DS39689F-page 271  
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To use a higher clock speed on wake-up, the INTOSC  
24.4 Fail-Safe Clock Monitor  
or postscaler clock sources can be selected to provide  
a higher clock speed by setting bits, IRCF<2:0>,  
immediately after Reset. For wake-ups from Sleep, the  
INTOSC or postscaler clock sources can be selected  
by setting the IRCF<2:0> bits prior to entering Sleep  
mode.  
The Fail-Safe Clock Monitor (FSCM) allows the  
microcontroller to continue operation in the event of an  
external oscillator failure by automatically switching the  
device clock to the internal oscillator block. The FSCM  
function is enabled by setting the FCMEN Configuration  
bit.  
The FSCM will detect failures of the primary or second-  
ary clock sources only. If the internal oscillator block  
fails, no failure would be detected, nor would any action  
be possible.  
When FSCM is enabled, the INTRC oscillator runs at  
all times to monitor clocks to peripherals and provide a  
backup clock in the event of a clock failure. Clock  
monitoring (shown in Figure 24-3) is accomplished by  
creating a sample clock signal, which is the INTRC  
output divided by 64. This allows ample time between  
FSCM sample clocks for a peripheral clock edge to  
occur. The peripheral device clock and the sample  
clock are presented as inputs to the Clock Monitor latch  
(CM). The CM is set on the falling edge of the device  
clock source, but cleared on the rising edge of the  
sample clock.  
24.4.1  
FSCM AND THE WATCHDOG TIMER  
Both the FSCM and the WDT are clocked by the  
INTRC oscillator. Since the WDT operates with a  
separate divider and counter, disabling the WDT has  
no effect on the operation of the INTRC oscillator when  
the FSCM is enabled.  
As already noted, the clock source is switched to the  
INTOSC clock when a clock failure is detected.  
Depending on the frequency selected by the  
IRCF<2:0> bits, this may mean a substantial change in  
the speed of code execution. If the WDT is enabled  
with a small prescale value, a decrease in clock speed  
allows a WDT time-out to occur and a subsequent  
device Reset. For this reason, fail-safe clock events  
also reset the WDT and postscaler, allowing it to start  
timing from when execution speed was changed and  
decreasing the likelihood of an erroneous time-out.  
FIGURE 24-3:  
FSCM BLOCK DIAGRAM  
Clock Monitor  
Latch (CM)  
(edge-triggered)  
Peripheral  
Clock  
S
Q
Q
INTRC  
Source  
C
÷ 64  
24.4.2  
EXITING FAIL-SAFE OPERATION  
(32 μs)  
488 Hz  
(2.048 ms)  
The fail-safe condition is terminated by either a device  
Reset or by entering a power-managed mode. On  
Reset, the controller starts the primary clock source  
specified in Configuration Register 1H (with any  
required start-up delays that are required for the  
oscillator mode, such as OST or PLL timer). The  
INTOSC multiplexer provides the device clock until the  
primary clock source becomes ready (similar to a Two-  
Speed Start-up). The clock source is then switched to  
the primary clock (indicated by the OSTS bit in the  
OSCCON register becoming set). The Fail-Safe Clock  
Monitor then resumes monitoring the peripheral clock.  
Clock  
Failure  
Detected  
Clock failure is tested for on the falling edge of the  
sample clock. If a sample clock falling edge occurs  
while CM is still set, a clock failure has been detected  
(Figure 24-4). This causes the following:  
• the FSCM generates an oscillator fail interrupt by  
setting bit, OSCFIF (PIR2<7>);  
• the device clock source is switched to the internal  
oscillator block (OSCCON is not updated to show  
the current clock source – this is the fail-safe  
condition); and  
The primary clock source may never become ready  
during start-up. In this case, operation is clocked by the  
INTOSC multiplexer. The OSCCON register will remain  
in its Reset state until a power-managed mode is  
entered.  
• the WDT is reset.  
During switchover, the postscaler frequency from the  
internal oscillator block may not be sufficiently stable  
for timing sensitive applications. In these cases, it may  
be desirable to select another clock configuration and  
enter an alternate power-managed mode. This can be  
done to attempt a partial recovery or execute a  
controlled shutdown. See Section 4.1.4 “Multiple  
Sleep Commands” and Section 24.3.1 “Special  
Considerations for Using Two-Speed Start-up” for  
more details.  
DS39689F-page 272  
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FIGURE 24-4:  
FSCM TIMING DIAGRAM  
Sample Clock  
Oscillator  
Failure  
Device  
Clock  
Output  
CM Output  
(Q)  
Failure  
Detected  
OSCFIF  
CM Test  
CM Test  
CM Test  
Note:  
The device clock is normally at a much higher frequency than the sample clock. The relative frequencies in this  
example have been chosen for clarity.  
24.4.3  
FSCM INTERRUPTS IN  
24.4.4  
POR OR WAKE FROM SLEEP  
POWER-MANAGED MODES  
The FSCM is designed to detect oscillator failure at any  
point after the device has exited Power-on Reset  
(POR) or low-power Sleep mode. When the primary  
device clock is EC, RC or INTRC modes, monitoring  
can begin immediately following these events.  
By entering a power-managed mode, the clock  
multiplexer selects the clock source selected by the  
OSCCON register. Fail-Safe Monitoring of the power-  
managed clock source resumes in the power-managed  
mode.  
For oscillator modes involving a crystal or resonator  
(HS, HSPLL, LP or XT), the situation is somewhat  
different. Since the oscillator may require a start-up  
time considerably longer than the FCSM sample clock  
time, a false clock failure may be detected. To prevent  
this, the internal oscillator block is automatically config-  
ured as the device clock and functions until the primary  
clock is stable (the OST and PLL timers have timed  
out). This is identical to Two-Speed Start-up mode.  
Once the primary clock is stable, the INTRC returns to  
its role as the FSCM source.  
If an oscillator failure occurs during power-managed  
operation, the subsequent events depend on whether  
or not the oscillator failure interrupt is enabled. If  
enabled (OSCFIF = 1), code execution will be clocked  
by the INTOSC multiplexer. An automatic transition  
back to the failed clock source will not occur.  
If the interrupt is disabled, subsequent interrupts while  
in Idle mode will cause the CPU to begin executing  
instructions while being clocked by the INTOSC  
source.  
Note:  
The same logic that prevents false oscilla-  
tor failure interrupts on POR, or wake from  
Sleep, will also prevent the detection of  
the oscillator’s failure to start at all follow-  
ing these events. This can be avoided by  
monitoring the OSTS bit and using a  
timing routine to determine if the oscillator  
is taking too long to start. Even so, no  
oscillator failure interrupt will be flagged.  
As noted in Section 24.3.1 “Special Considerations  
for Using Two-Speed Start-up”, it is also possible to  
select another clock configuration and enter an  
alternate power-managed mode while waiting for the  
primary clock to become stable. When the new power-  
managed mode is selected, the primary clock is  
disabled.  
© 2009 Microchip Technology Inc.  
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Each of the three blocks has three code protection bits  
associated with them. They are:  
24.5 Program Verification and  
Code Protection  
• Code-Protect bit (CPn)  
The overall structure of the code protection on the  
PIC18 Flash devices differs significantly from other  
PIC® devices.  
• Write-Protect bit (WRTn)  
• External Block Table Read bit (EBTRn)  
Figure 24-5 shows the program memory organization  
for 4 and 8-Kbyte devices and the specific code  
protection bit associated with each block. The actual  
locations of the bits are summarized in Table 24-3.  
The user program memory is divided into three blocks.  
One of these is a boot block of variable size. The  
remainder of the memory is divided into two blocks on  
binary boundaries.  
FIGURE 24-5:  
CODE-PROTECTED PROGRAM MEMORY FOR PIC18F2221/2321/4221/4321  
FAMILY DEVICES  
Address  
Range  
Block Code Protection  
Controlled By:  
MEMORY SIZE/DEVICE  
8 Kbytes  
4 Kbytes  
(PIC18FX321)  
(PIC18FX221)  
BBSIZ<1:0>  
11/10  
01  
00  
11/10/01  
00  
000000h  
Boot Block  
256 words  
Boot Block  
256 words  
CPB, WRTB, EBTRB  
Boot Block  
512 words  
Boot Block  
512 words  
0001FFh  
000200h  
Boot Block  
1K word  
0003FFh  
000400h  
Block 0  
0.75K words  
Block 0  
0.5K words  
CP0, WRT0, EBTR0  
0007FFh  
000800h  
Block 0  
1.75K words  
Block 0  
1.5K words  
Block 0  
Block 1  
Block 1  
1K word  
1K word  
1K word  
000FFFh  
001000h  
CP1, WRT1, EBTR1  
Block 1  
Block 1  
Block 1  
2K words  
2K words  
2K words  
Unimplemented  
Reads all ‘0’s  
001FFFh  
002000h  
Unimplemented  
Reads all ‘0’s  
(Unimplemented Memory  
Space)  
1FFFFFh  
DS39689F-page 274  
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TABLE 24-3: SUMMARY OF CODE PROTECTION REGISTERS  
File Name  
Bit 7  
Bit 6  
Bit 5  
Bit 4  
Bit 3  
Bit 2  
Bit 1  
Bit 0  
300008h CONFIG5L  
300009h CONFIG5H  
30000Ah CONFIG6L  
CPD  
CPB  
CP1  
CP0  
WRT1  
WRT0  
30000Bh CONFIG6H WRTD  
WRTB  
WRTC  
30000Ch CONFIG7L  
30000Dh CONFIG7H  
EBTR1  
EBTR0  
EBTRB  
Legend: Shaded cells are unimplemented.  
A table read instruction that executes from a location  
outside of that block is not allowed to read and will result  
in reading ‘0’s. Figures 24-6 through 24-8 illustrate table  
write and table read protection.  
24.5.1  
PROGRAM MEMORY  
CODE PROTECTION  
The program memory may be read to or written from  
any location using the table read and table write  
instructions. The device ID may be read with table  
reads. The Configuration registers may be read and  
written with the table read and table write instructions.  
Note:  
Code protection bits may only be written to  
a ‘0’ from a ‘1’ state. It is not possible to  
write a ‘1’ to a bit in the ‘0’ state. Code  
protection bits are only set to ‘1’ by a full  
chip erase or block erase function. The full  
chip erase and block erase functions can  
only be initiated via ICSP operation or an  
external programmer.  
In normal execution mode, the CPn bits have no direct  
effect. CPn bits inhibit external reads and writes. A  
block of user memory may be protected from table  
writes if the WRTn Configuration bit is ‘0’. The EBTRn  
bits control table reads. For a block of user memory  
with the EBTRn bit set to ‘0’, a table read instruction  
that executes from within that block is allowed to read.  
FIGURE 24-6:  
TABLE WRITE (WRTn) DISALLOWED  
Program Memory(1)  
Register Values  
Configuration Bit Settings  
Boot Block  
WRTB, EBTRB = 11  
TBLPTR = 0008FFh  
PC = 003FFEh  
Block 0  
WRT0, EBTR0 = 01  
WRT1, EBTR1 = 11  
TBLWT*  
Block 1  
PC = 00BFFEh  
TBLWT*  
Results: All table writes disabled to Blockn whenever WRTn = 0.  
Note 1: See Figure 24-5 for block boundaries.  
© 2009 Microchip Technology Inc.  
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FIGURE 24-7:  
EXTERNAL BLOCK TABLE READ (EBTRn) DISALLOWED  
Register Values  
Program Memory(1)  
Configuration Bit Settings  
Boot Block  
WRTB, EBTRB = 11  
WRT0, EBTR0 = 10  
WRT1, EBTR1 = 11  
TBLPTR = 0008FFh  
Block 0  
Block 1  
PC = 007FFEh  
TBLRD*  
Results: All table reads from external blocks to Blockn are disabled whenever EBTRn = 0.  
TABLAT register returns a value of ‘0’.  
Note 1: See Figure 24-5 for block boundaries.  
FIGURE 24-8:  
EXTERNAL BLOCK TABLE READ (EBTRn) ALLOWED  
Register Values  
Program Memory(1)  
Configuration Bit Settings  
WRTB, EBTRB = 11  
WRT0, EBTR0 = 10  
Boot Block  
TBLPTR = 0008FFh  
PC = 003FFEh  
Block 0  
TBLRD*  
Block 1  
WRT1, EBTR1 = 11  
Results: Table reads permitted within Blockn, even when EBTRBn = 0.  
TABLAT register returns the value of the data at the location TBLPTR.  
Note 1: See Figure 24-5 for block boundaries.  
DS39689F-page 276  
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To use the In-Circuit Debugger function of the micro-  
controller, the design must implement In-Circuit Serial  
Programming connections to MCLR/VPP/RE3, VDD,  
VSS, RB7 and RB6. This will interface to the In-Circuit  
Debugger module available from Microchip or one of  
the third party development tool companies.  
24.5.2  
DATA EEPROM  
CODE PROTECTION  
The entire data EEPROM is protected from external  
reads and writes by two bits: CPD and WRTD. CPD  
inhibits external reads and writes of data EEPROM.  
WRTD inhibits internal and external writes to data  
EEPROM. The CPU can always read data EEPROM  
under normal operation, regardless of the protection bit  
settings.  
24.9 Single-Supply ICSP Programming  
The LVP Configuration bit enables Single-Supply ICSP  
Programming (formerly known as Low-Voltage ICSP  
Programming or LVP). When Single-Supply Program-  
ming is enabled, the microcontroller can be programmed  
without requiring high voltage being applied to the  
MCLR/VPP/RE3 pin, but the RB5/KBI1/PGM pin is then  
dedicated to controlling Program mode entry and is not  
available as a general purpose I/O pin.  
24.5.3  
CONFIGURATION REGISTER  
PROTECTION  
The Configuration registers can be write-protected.  
The WRTC bit controls protection of the Configuration  
registers. In normal execution mode, the WRTC bit is  
readable only. WRTC can only be written via ICSP  
operation or an external programmer.  
While programming, using Single-Supply Program-  
ming, VDD is applied to the MCLR/VPP/RE3 pin as in  
normal execution mode. To enter Programming mode,  
VDD is applied to the PGM pin.  
24.6 ID Locations  
Eight memory locations (200000h-200007h) are  
designated as ID locations, where the user can store  
checksum or other code identification numbers. These  
locations are both readable and writable during normal  
execution through the TBLRD and TBLWT instructions  
or during program/verify. The ID locations can be read  
when the device is code-protected.  
Note 1: High-voltage programming is always  
available, regardless of the state of the  
LVP bit or the PGM pin, by applying VIHH  
to the MCLR pin.  
2: By default, Single-Supply ICSP Program-  
ming is enabled in unprogrammed  
devices (as supplied from Microchip) and  
erased devices.  
24.7  
In-Circuit Serial Programming  
3: When Single-Supply ICSP Programming  
is enabled, the RB5 pin can no longer be  
used as a general purpose I/O pin.  
PIC18F2221/2321/4221/4321 family microcontrollers  
can be serially programmed while in the end applica-  
tion circuit. This is simply done with two lines for clock  
and data and three other lines for power, ground and  
the programming voltage. This allows customers to  
manufacture boards with unprogrammed devices and  
then program the microcontroller just before shipping  
the product. This also allows the most recent firmware  
or a custom firmware to be programmed.  
4: When LVP is enabled, externally pull the  
PGM pin to VSS to allow normal program  
execution.  
If Single-Supply ICSP Programming mode will not be  
used, the LVP bit can be cleared. RB5/KBI1/PGM then  
becomes available as the digital I/O pin, RB5. The LVP  
bit may be set or cleared only when using standard  
high-voltage programming (VIHH applied to the MCLR/  
VPP/RE3 pin). Once LVP has been disabled, only the  
standard high-voltage programming is available and  
must be used to program the device.  
24.8 In-Circuit Debugger  
When the DEBUG Configuration bit is programmed to  
a ‘0’, the In-Circuit Debugger functionality is enabled.  
This function allows simple debugging functions when  
used with MPLAB® IDE. When the microcontroller has  
this feature enabled, some resources are not available  
for general use. Table 24-4 shows which resources are  
required by the background debugger.  
Memory that is not code-protected can be erased using  
either a block erase, or erased row by row, then written  
at any specified VDD. If code-protected memory is to be  
erased, a block erase is required. If a block erase is to  
be performed when using Low-Voltage ICSP  
Programming, the device must be supplied with VDD of  
4.5V to 5.5V.  
TABLE 24-4: DEBUGGER RESOURCES  
I/O Pins:  
RB6, RB7  
2 levels  
Stack:  
Program Memory:  
Data Memory:  
512 bytes  
10 bytes  
© 2009 Microchip Technology Inc.  
DS39689F-page 277  
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NOTES:  
DS39689F-page 278  
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The literal instructions may use some of the following  
operands:  
25.0 INSTRUCTION SET SUMMARY  
PIC18F2221/2321/4221/4321 family devices incorpo-  
rate the standard set of 75 PIC18 core instructions, as  
well as an extended set of 8 new instructions for the  
optimization of code that is recursive or that utilizes a  
software stack. The extended set is discussed later in  
this section.  
• A literal value to be loaded into a file register  
(specified by ‘k’)  
• The desired FSR register to load the literal value  
into (specified by ‘f’)  
• No operand required  
(specified by ‘—’)  
25.1 Standard Instruction Set  
The control instructions may use some of the following  
operands:  
The standard PIC18 instruction set adds many  
enhancements to the previous PIC® MCU instruction  
sets, while maintaining an easy migration from these  
PIC MCU instruction sets. Most instructions are a  
single program memory word (16 bits), but there are  
four instructions that require two program memory  
locations.  
• A program memory address (specified by ‘n’)  
• The mode of the CALLor RETURNinstructions  
(specified by ‘s’)  
• The mode of the table read and table write  
instructions (specified by ‘m’)  
• No operand required  
(specified by ‘—’)  
Each single-word instruction is a 16-bit word divided  
into an opcode, which specifies the instruction type and  
one or more operands, which further specify the  
operation of the instruction.  
All instructions are a single word, except for four  
double-word instructions. These instructions were  
made double-word to contain the required information  
in 32 bits. In the second word, the 4 MSbs are ‘1’s. If  
this second word is executed as an instruction (by  
itself), it will execute as a NOP.  
The instruction set is highly orthogonal and is grouped  
into four basic categories:  
Byte-oriented operations  
Bit-oriented operations  
Literal operations  
All single-word instructions are executed in a single  
instruction cycle, unless a conditional test is true or the  
program counter is changed as a result of the  
instruction. In these cases, the execution takes two  
instruction cycles, with the additional instruction  
cycle(s) executed as a NOP.  
Control operations  
The PIC18 instruction set summary in Table 25-2 lists  
byte-oriented, bit-oriented, literal and control  
operations. Table 25-1 shows the opcode field  
descriptions.  
The double-word instructions execute in two instruction  
cycles.  
Most byte-oriented instructions have three operands:  
One instruction cycle consists of four oscillator periods.  
Thus, for an oscillator frequency of 4 MHz, the normal  
instruction execution time is 1 μs. If a conditional test is  
true, or the program counter is changed as a result of  
an instruction, the instruction execution time is 2 μs.  
Two-word branch instructions (if true) would take 3 μs.  
1. The file register (specified by ‘f’)  
2. The destination of the result (specified by ‘d’)  
3. The accessed memory (specified by ‘a’)  
The file register designator ‘f’ specifies which file  
register is to be used by the instruction. The destination  
designator ‘d’ specifies where the result of the  
operation is to be placed. If ‘d’ is zero, the result is  
placed in the WREG register. If ‘d’ is one, the result is  
placed in the file register specified in the instruction.  
Figure 25-1 shows the general formats that the  
instructions can have. All examples use the convention  
‘nnh’ to represent a hexadecimal number.  
The Instruction Set Summary, shown in Table 25-2,  
lists the standard instructions recognized by the  
Microchip MPASM™ Assembler.  
All bit-oriented instructions have three operands:  
1. The file register (specified by ‘f’)  
Section 25.1.1 “Standard Instruction Set” provides  
a description of each instruction.  
2. The bit in the file register (specified by ‘b’)  
3. The accessed memory (specified by ‘a’)  
The bit field designator ‘b’ selects the number of the bit  
affected by the operation, while the file register  
designator ‘f’ represents the number of the file in which  
the bit is located.  
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TABLE 25-1: OPCODE FIELD DESCRIPTIONS  
Field  
Description  
a
RAM access bit  
a = 0: RAM location in Access RAM (BSR register is ignored)  
a = 1: RAM bank is specified by BSR register  
bbb  
BSR  
Bit address within an 8-bit file register (0 to 7).  
Bank Select Register. Used to select the current RAM bank.  
ALU Status bits: Carry, Digit Carry, Zero, Overflow, Negative.  
C, DC, Z, OV, N  
d
Destination select bit  
d = 0: store result in WREG  
d = 1: store result in file register f  
dest  
f
Destination: either the WREG register or the specified register file location.  
8-bit Register file address (00h to FFh) or 2-bit FSR designator (0h to 3h).  
12-bit Register file address (000h to FFFh). This is the source address.  
12-bit Register file address (000h to FFFh). This is the destination address.  
Global Interrupt Enable bit.  
f
f
s
d
GIE  
k
Literal field, constant data or label (may be either an 8-bit, 12-bit or a 20-bit value).  
Label name.  
label  
mm  
The mode of the TBLPTR register for the table read and table write instructions.  
Only used with table read and table write instructions:  
*
No change to register (such as TBLPTR with table reads and writes)  
Post-Increment register (such as TBLPTR with table reads and writes)  
Post-Decrement register (such as TBLPTR with table reads and writes)  
Pre-Increment register (such as TBLPTR with table reads and writes)  
*+  
*-  
+*  
n
The relative address (2’s complement number) for relative branch instructions or the direct address for  
Call/Branch and Return instructions.  
PC  
Program Counter.  
PCL  
Program Counter Low Byte.  
Program Counter High Byte.  
Program Counter High Byte Latch.  
Program Counter Upper Byte Latch.  
Power-Down bit.  
PCH  
PCLATH  
PCLATU  
PD  
PRODH  
PRODL  
s
Product of Multiply High Byte.  
Product of Multiply Low Byte.  
Fast Call/Return mode select bit  
s = 0: do not update into/from shadow registers  
s = 1: certain registers loaded into/from shadow registers (Fast mode)  
TBLPTR  
TABLAT  
TO  
21-bit Table Pointer (points to a program memory location).  
8-bit Table Latch.  
Time-out bit.  
TOS  
u
Top-of-Stack.  
Unused or unchanged.  
Watchdog Timer.  
WDT  
WREG  
x
Working register (accumulator).  
Don’t care (‘0’ or ‘1’). The assembler will generate code with x = 0. It is the recommended form of use for  
compatibility with all Microchip software tools.  
z
z
{
7-bit offset value for indirect addressing of register files (source).  
7-bit offset value for indirect addressing of register files (destination).  
Optional argument.  
s
d
}
[text]  
(text)  
[expr]<n>  
Indicates an indexed address.  
The contents of text.  
Specifies bit nof the register indicated by the pointer expr.  
Assigned to.  
< >  
Register bit field.  
In the set of.  
italics  
User-defined term (font is Courier New).  
DS39689F-page 280  
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FIGURE 25-1:  
GENERAL FORMAT FOR INSTRUCTIONS  
Byte-oriented file register operations  
15 10  
OPCODE f (FILE #)  
Example Instruction  
9
8
7
0
ADDWF MYREG, W, B  
d
a
d = 0for result destination to be WREG register  
d = 1for result destination to be file register (f)  
a = 0to force Access Bank  
a = 1for BSR to select bank  
f = 8-bit file register address  
Byte to Byte move operations (2-word)  
15  
12 11  
0
0
MOVFF MYREG1, MYREG2  
OPCODE  
f (Source FILE #)  
15  
12 11  
1111  
f (Destination FILE #)  
f = 12-bit file register address  
Bit-oriented file register operations  
15 12 11 9 8  
OPCODE b (BIT #)  
7
0
BSF MYREG, bit, B  
a
f (FILE #)  
b = 3-bit position of bit in file register (f)  
a = 0to force Access Bank  
a = 1for BSR to select bank  
f = 8-bit file register address  
Literal operations  
15  
8
7
0
MOVLW 7Fh  
OPCODE  
k (literal)  
k = 8-bit immediate value  
Control operations  
CALL, GOTO and Branch operations  
15  
8 7  
0
GOTO Label  
OPCODE  
12 11  
n<7:0> (literal)  
15  
0
1111  
n<19:8> (literal)  
n = 20-bit immediate value  
15  
15  
8
7
0
CALL MYFUNC  
OPCODE  
12 11  
S
n<7:0> (literal)  
0
1111  
n<19:8> (literal)  
S = Fast bit  
15  
15  
11 10  
0
0
BRA MYFUNC  
BC MYFUNC  
OPCODE  
n<10:0> (literal)  
8 7  
OPCODE  
n<7:0> (literal)  
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TABLE 25-2: PIC18FXXXX INSTRUCTION SET  
16-Bit Instruction Word  
Mnemonic,  
Operands  
Status  
Affected  
Description  
Cycles  
Notes  
MSb  
LSb  
BYTE-ORIENTED OPERATIONS  
ADDWF f, d, a Add WREG and f  
ADDWFC f, d, a Add WREG and Carry bit to f  
1
0010 01da0 ffff  
ffff C, DC, Z, OV, N  
ffff C, DC, Z, OV, N  
ffff Z, N  
1, 2  
1, 2  
1,2  
2
1, 2  
4
4
1, 2  
1, 2, 3, 4  
1, 2, 3, 4  
1, 2  
1, 2, 3, 4  
4
1, 2  
1, 2  
1
1
1
1
1
0010 0da  
0001 01da  
0110 101a  
0001 11da  
ffff  
ffff  
ffff  
ffff  
ffff  
ffff  
ffff  
ffff  
ffff  
ffff  
ffff  
ffff  
ffff  
ffff  
ffff  
ffff  
ffff  
ffff  
ffff  
ffff  
ffff  
ffff  
ffff  
ffff  
ffff  
ffff  
ANDWF  
CLRF  
COMF  
f, d, a AND WREG with f  
f, a Clear f  
f, d, a Complement f  
ffff  
Z
ffff Z, N  
ffff None  
ffff None  
ffff None  
ffff C, DC, Z, OV, N  
ffff None  
ffff None  
ffff C, DC, Z, OV, N  
ffff None  
ffff None  
ffff Z, N  
ffff Z, N  
ffff None  
ffff  
ffff None  
ffff None  
CPFSEQ  
CPFSGT  
CPFSLT  
DECF  
f, a  
f, a  
f, a  
Compare f with WREG, Skip =  
Compare f with WREG, Skip >  
Compare f with WREG, Skip <  
1 (2 or 3) 0110 001a  
1 (2 or 3) 0110 010a  
1 (2 or 3) 0110 000a  
f, d, a Decrement f  
1
0000 01da  
DECFSZ  
DCFSNZ  
INCF  
f, d, a Decrement f, Skip if 0  
f, d, a Decrement f, Skip if Not 0  
f, d, a Increment f  
1 (2 or 3) 0010 11da  
1 (2 or 3) 0100 11da  
1
1 (2 or 3) 0011 11da  
1 (2 or 3) 0100 10da  
1
1
2
0010 10da  
INCFSZ  
INFSNZ  
IORWF  
MOVF  
f, d, a Increment f, Skip if 0  
f, d, a Increment f, Skip if Not 0  
f, d, a Inclusive OR WREG with f  
f, d, a Move f  
0001 00da  
0101 00da  
1100 ffff  
1111 ffff  
0110 111a  
0000 001a  
0110 110a  
0011 01da  
0100 01da  
0011 00da  
0100 00da  
0110 100a  
0101 01da  
MOVFF  
f , f  
Move f (source) to 1st Word  
s
d
s
f (destination) 2nd Word  
d
MOVWF  
MULWF  
NEGF  
f, a  
f, a  
f, a  
Move WREG to f  
Multiply WREG with f  
Negate f  
1
1
1
1
1
1
1
1
1
1, 2  
1, 2  
ffff C, DC, Z, OV, N  
ffff C, Z, N  
ffff Z, N  
ffff C, Z, N  
ffff Z, N  
RLCF  
RLNCF  
RRCF  
RRNCF  
SETF  
f, d, a Rotate Left f through Carry  
f, d, a Rotate Left f (No Carry)  
f, d, a Rotate Right f through Carry  
f, d, a Rotate Right f (No Carry)  
f, a  
Set f  
ffff None  
ffff C, DC, Z, OV, N  
1, 2  
1, 2  
SUBFWB f, d, a Subtract f from WREG with  
Borrow  
SUBWF  
f, d, a Subtract WREG from f  
1
1
0101 11da  
0101 10da  
ffff  
ffff  
ffff C, DC, Z, OV, N  
ffff C, DC, Z, OV, N  
SUBWFB f, d, a Subtract WREG from f with  
Borrow  
SWAPF  
TSTFSZ  
XORWF  
f, d, a Swap Nibbles in f  
f, a Test f, Skip if 0  
f, d, a Exclusive OR WREG with f  
1
0011 10da  
ffff  
ffff  
ffff  
ffff None  
ffff None  
ffff Z, N  
4
1, 2  
1 (2 or 3) 0110 011a  
0001 10da  
1
Note 1: When a PORT register is modified as a function of itself (e.g., MOVF PORTB, 1, 0), the value used will be that value  
present on the pins themselves. For example, if the data latch is ‘1’ for a pin configured as input and is driven low by an  
external device, the data will be written back with a ‘0’.  
2: If this instruction is executed on the TMR0 register (and where applicable, ‘d’ = 1), the prescaler will be cleared if  
assigned.  
3: If the Program Counter (PC) is modified or a conditional test is true, the instruction requires two cycles. The second  
cycle is executed as a NOP.  
4: Some instructions are two-word instructions. The second word of these instructions will be executed as a NOPunless the  
first word of the instruction retrieves the information embedded in these 16 bits. This ensures that all program memory  
locations have a valid instruction.  
DS39689F-page 282  
© 2009 Microchip Technology Inc.  
PIC18F2221/2321/4221/4321 FAMILY  
TABLE 25-2: PIC18FXXXX INSTRUCTION SET (CONTINUED)  
16-Bit Instruction Word  
Mnemonic,  
Operands  
Status  
Affected  
Description  
Cycles  
Notes  
MSb LSb  
BIT-ORIENTED OPERATIONS  
BCF  
BSF  
BTFSC  
BTFSS  
BTG  
f, b, a Bit Clear f  
f, b, a Bit Set f  
f, b, a Bit Test f, Skip if Clear  
f, b, a Bit Test f, Skip if Set  
f, d, a Bit Toggle f  
1
1
1001 bbba  
1000 bbba  
ffff  
ffff  
ffff  
ffff  
ffff  
ffff None  
ffff None  
ffff None  
ffff None  
ffff None  
1, 2  
1, 2  
3, 4  
3, 4  
1, 2  
1 (2 or 3) 1011 bbba  
1 (2 or 3) 1010 bbba  
1
0111 bbba  
CONTROL OPERATIONS  
BC  
BN  
n
n
n
n
n
n
n
n
Branch if Carry  
1 (2)  
1 (2)  
1 (2)  
1 (2)  
1 (2)  
1 (2)  
1 (2)  
2
1110 0010  
1110 0110  
1110 0011  
1110 0111  
1110 0101  
1110 0001  
1110 0100  
1101 0nnn  
1110 0000  
1110 110s  
1111 kkkk  
0000 0000  
0000 0000  
1110 1111  
1111 kkkk  
0000 0000  
1111 xxxx  
0000 0000  
0000 0000  
1101 1nnn  
0000 0000  
0000 0000  
nnnn  
nnnn  
nnnn  
nnnn  
nnnn  
nnnn  
nnnn  
nnnn  
nnnn  
kkkk  
kkkk  
0000  
0000  
kkkk  
kkkk  
0000  
xxxx  
0000  
0000  
nnnn  
1111  
0001  
nnnn None  
nnnn None  
nnnn None  
nnnn None  
nnnn None  
nnnn None  
nnnn None  
nnnn None  
nnnn None  
kkkk None  
kkkk  
Branch if Negative  
Branch if Not Carry  
Branch if Not Negative  
Branch if Not Overflow  
Branch if Not Zero  
Branch if Overflow  
Branch Unconditionally  
Branch if Zero  
Call Subroutine 1st Word  
2nd Word  
Clear Watchdog Timer  
Decimal Adjust WREG  
Go to Address 1st Word  
2nd Word  
BNC  
BNN  
BNOV  
BNZ  
BOV  
BRA  
BZ  
n
n, s  
1 (2)  
2
CALL  
CLRWDT  
DAW  
GOTO  
n
1
1
2
0100 TO, PD  
0111  
C
kkkk None  
kkkk  
NOP  
NOP  
POP  
PUSH  
RCALL  
RESET  
RETFIE  
n
No Operation  
No Operation  
1
1
1
1
2
1
2
0000 None  
xxxx None  
0110 None  
0101 None  
nnnn None  
1111 All  
4
Pop Top of Return Stack (TOS)  
Push Top of Return Stack (TOS)  
Relative Call  
Software Device Reset  
Return from Interrupt Enable  
s
000s GIE/GIEH,  
PEIE/GIEL  
RETLW  
RETURN  
SLEEP  
k
s
Return with Literal in WREG  
Return from Subroutine  
Go into Standby mode  
2
2
1
0000 1100  
0000 0000  
0000 0000  
kkkk  
0001  
0000  
kkkk None  
001s None  
0011 TO, PD  
Note 1: When a PORT register is modified as a function of itself (e.g., MOVF PORTB, 1, 0), the value used will be that value  
present on the pins themselves. For example, if the data latch is ‘1’ for a pin configured as input and is driven low by an  
external device, the data will be written back with a ‘0’.  
2: If this instruction is executed on the TMR0 register (and where applicable, ‘d’ = 1), the prescaler will be cleared if  
assigned.  
3: If the Program Counter (PC) is modified or a conditional test is true, the instruction requires two cycles. The second  
cycle is executed as a NOP.  
4: Some instructions are two-word instructions. The second word of these instructions will be executed as a NOPunless the  
first word of the instruction retrieves the information embedded in these 16 bits. This ensures that all program memory  
locations have a valid instruction.  
© 2009 Microchip Technology Inc.  
DS39689F-page 283  
PIC18F2221/2321/4221/4321 FAMILY  
TABLE 25-2: PIC18FXXXX INSTRUCTION SET (CONTINUED)  
16-Bit Instruction Word  
Mnemonic,  
Operands  
Status  
Affected  
Description  
Cycles  
Notes  
MSb  
LSb  
LITERAL OPERATIONS  
ADDLW  
ANDLW  
IORLW  
LFSR  
k
k
k
f, k  
Add Literal and WREG  
AND Literal with WREG  
Inclusive OR Literal with WREG  
Move Literal (12-bit) 2nd Word  
1
0000 1111 kkkk  
0000 1011 kkkk  
0000 1001 kkkk  
1110 1110 00ff  
1111 0000 kkkk  
0000 0001 0000  
0000 1110 kkkk  
0000 1101 kkkk  
0000 1100 kkkk  
0000 1000 kkkk  
0000 1010 kkkk  
kkkk C, DC, Z, OV, N  
kkkk Z, N  
kkkk Z, N  
kkkk None  
kkkk  
kkkk None  
kkkk None  
kkkk None  
kkkk None  
kkkk C, DC, Z, OV, N  
kkkk Z, N  
1
1
2
to FSR(f)  
1st Word  
MOVLB  
MOVLW  
MULLW  
RETLW  
SUBLW  
XORLW  
k
k
k
k
k
k
Move Literal to BSR<3:0>  
Move Literal to WREG  
Multiply Literal with WREG  
Return with Literal in WREG  
Subtract WREG from Literal  
Exclusive OR Literal with WREG  
1
1
1
2
1
1
DATA MEMORY PROGRAM MEMORY OPERATIONS  
TBLRD*  
Table Read  
2
0000 0000 0000  
0000 0000 0000  
0000 0000 0000  
0000 0000 0000  
0000 0000 0000  
0000 0000 0000  
0000 0000 0000  
0000 0000 0000  
1000 None  
1001 None  
1010 None  
1011 None  
1100 None  
1101 None  
1110 None  
1111 None  
TBLRD*+  
TBLRD*-  
TBLRD+*  
TBLWT*  
TBLWT*+  
TBLWT*-  
TBLWT+*  
Table Read with Post-Increment  
Table Read with Post-Decrement  
Table Read with Pre-Increment  
Table Write  
Table Write with Post-Increment  
Table Write with Post-Decrement  
Table Write with Pre-Increment  
2
Note 1: When a PORT register is modified as a function of itself (e.g., MOVF PORTB, 1, 0), the value used will be that value  
present on the pins themselves. For example, if the data latch is ‘1’ for a pin configured as input and is driven low by an  
external device, the data will be written back with a ‘0’.  
2: If this instruction is executed on the TMR0 register (and where applicable, ‘d’ = 1), the prescaler will be cleared if  
assigned.  
3: If the Program Counter (PC) is modified or a conditional test is true, the instruction requires two cycles. The second  
cycle is executed as a NOP.  
4: Some instructions are two-word instructions. The second word of these instructions will be executed as a NOPunless the  
first word of the instruction retrieves the information embedded in these 16 bits. This ensures that all program memory  
locations have a valid instruction.  
DS39689F-page 284  
© 2009 Microchip Technology Inc.  
PIC18F2221/2321/4221/4321 FAMILY  
25.1.1  
STANDARD INSTRUCTION SET  
ADD Literal to W  
ADDLW  
ADDWF  
ADD W to f  
Syntax:  
ADDLW  
k
Syntax:  
ADDWF  
f {,d {,a}}  
Operands:  
Operation:  
Status Affected:  
Encoding:  
Description:  
0 k 255  
Operands:  
0 f 255  
d [0,1]  
a [0,1]  
(W) + k W  
N, OV, C, DC, Z  
Operation:  
(W) + (f) dest  
0000  
1111  
kkkk  
kkkk  
Status Affected:  
Encoding:  
N, OV, C, DC, Z  
The contents of W are added to the  
8-bit literal ‘k’ and the result is placed in  
W.  
0010  
01da  
ffff  
ffff  
Description:  
Add W to register ‘f’. If ‘d’ is ‘0’, the  
result is stored in W. If ‘d’ is ‘1’, the  
result is stored back in register ‘f’  
(default).  
Words:  
Cycles:  
1
1
If ‘a’ is ‘0’, the Access Bank is selected.  
If ‘a’ is ‘1’, the BSR is used to select the  
GPR bank (default).  
If ‘a’ is ‘0’ and the extended instruction  
set is enabled, this instruction operates  
in Indexed Literal Offset Addressing  
mode whenever f 95 (5Fh). See  
Section 25.2.3 “Byte-Oriented and  
Bit-Oriented Instructions in Indexed  
Literal Offset Mode” for details.  
Q Cycle Activity:  
Q1  
Q2  
Q3  
Q4  
Decode  
Read  
literal ‘k’  
Process  
Data  
Write to W  
Example:  
ADDLW  
15h  
Before Instruction  
10h  
After Instruction  
25h  
W
=
Words:  
Cycles:  
1
1
W
=
Q Cycle Activity:  
Q1  
Q2  
Q3  
Q4  
Decode  
Read  
register ‘f’  
Process  
Data  
Write to  
destination  
Example:  
ADDWF  
REG, 0, 0  
Before Instruction  
W
=
17h  
REG  
=
0C2h  
After Instruction  
W
REG  
=
=
0D9h  
0C2h  
Note:  
All PIC18 instructions may take an optional label argument preceding the instruction mnemonic for use in  
symbolic addressing. If a label is used, the instruction format then becomes: {label} instruction argument(s).  
© 2009 Microchip Technology Inc.  
DS39689F-page 285  
PIC18F2221/2321/4221/4321 FAMILY  
ADDWFC  
ADD W and Carry bit to f  
ANDLW  
AND Literal with W  
Syntax:  
ADDWFC  
f {,d {,a}}  
Syntax:  
ANDLW  
k
Operands:  
0 f 255  
d [0,1]  
a [0,1]  
Operands:  
Operation:  
Status Affected:  
Encoding:  
Description:  
0 k 255  
(W) .AND. k W  
N, Z  
Operation:  
(W) + (f) + (C) dest  
0000  
1011  
kkkk  
kkkk  
Status Affected:  
Encoding:  
N,OV, C, DC, Z  
The contents of W are ANDed with the  
8-bit literal ‘k’. The result is placed in W.  
0010  
00da  
ffff  
ffff  
Description:  
Add W, the Carry flag and data memory  
location ‘f’. If ‘d’ is ‘0’, the result is  
placed in W. If ‘d’ is ‘1’, the result is  
placed in data memory location ‘f’.  
If ‘a’ is ‘0’, the Access Bank is selected.  
If ‘a’ is ‘1’, the BSR is used to select the  
GPR bank (default).  
If ‘a’ is ‘0’ and the extended instruction  
set is enabled, this instruction operates  
in Indexed Literal Offset Addressing  
mode whenever f 95 (5Fh). See  
Section 25.2.3 “Byte-Oriented and  
Bit-Oriented Instructions in Indexed  
Literal Offset Mode” for details.  
Words:  
1
1
Cycles:  
Q Cycle Activity:  
Q1  
Q2  
Q3  
Q4  
Decode  
Read literal  
‘k’  
Process  
Data  
Write to W  
Example:  
ANDLW  
05Fh  
Before Instruction  
W
=
A3h  
03h  
After Instruction  
W
=
Words:  
Cycles:  
1
1
Q Cycle Activity:  
Q1  
Q2  
Q3  
Q4  
Decode  
Read  
register ‘f’  
Process  
Data  
Write to  
destination  
Example:  
ADDWFC  
REG, 0, 1  
Before Instruction  
Carry bit  
REG  
W
=
=
=
1
02h  
4Dh  
After Instruction  
Carry bit  
REG  
W
=
=
=
0
02h  
50h  
DS39689F-page 286  
© 2009 Microchip Technology Inc.  
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ANDWF  
AND W with f  
BC  
Branch if Carry  
Syntax:  
ANDWF  
f {,d {,a}}  
Syntax:  
BC  
n
Operands:  
0 f 255  
d [0,1]  
a [0,1]  
Operands:  
Operation:  
-128 n 127  
If Carry bit is ‘1’,  
(PC) + 2 + 2n PC  
Operation:  
(W) .AND. (f) dest  
Status Affected:  
Encoding:  
None  
Status Affected:  
Encoding:  
N, Z  
1110  
0010  
nnnn  
nnnn  
0001  
01da  
ffff  
ffff  
Description:  
If the Carry bit is ‘1’, then the program  
will branch.  
Description:  
The contents of W are ANDed with  
register ‘f’. If ‘d’ is ‘0’, the result is stored  
in W. If ‘d’ is ‘1’, the result is stored back  
in register ‘f’ (default).  
If ‘a’ is ‘0’, the Access Bank is selected.  
If ‘a’ is ‘1’, the BSR is used to select the  
GPR bank (default).  
The 2’s complement number ‘2n’ is  
added to the PC. Since the PC will have  
incremented to fetch the next  
instruction, the new address will be  
PC + 2 + 2n. This instruction is then a  
two-cycle instruction.  
If ‘a’ is ‘0’ and the extended instruction  
set is enabled, this instruction operates  
in Indexed Literal Offset Addressing  
mode whenever f 95 (5Fh). See  
Section 25.2.3 “Byte-Oriented and  
Bit-Oriented Instructions in Indexed  
Literal Offset Mode” for details.  
Words:  
Cycles:  
1
1(2)  
Q Cycle Activity:  
If Jump:  
Q1  
Q2  
Q3  
Q4  
Decode  
Read literal  
‘n’  
Process  
Data  
Write to  
PC  
Words:  
1
1
Cycles:  
No  
No  
No  
No  
operation  
operation  
operation  
operation  
Q Cycle Activity:  
Q1  
If No Jump:  
Q1  
Q2  
Q3  
Q4  
Q2  
Q3  
Q4  
Decode  
Read  
register ‘f’  
Process  
Data  
Write to  
destination  
Decode  
Read literal  
‘n’  
Process  
Data  
No  
operation  
Example:  
ANDWF  
REG, 0, 0  
Example:  
HERE  
BC  
5
Before Instruction  
Before Instruction  
W
REG  
=
=
17h  
C2h  
PC  
=
address (HERE)  
After Instruction  
After Instruction  
If Carry  
PC  
If Carry  
PC  
=
=
=
=
1;  
address (HERE + 12)  
0;  
address (HERE + 2)  
W
REG  
=
=
02h  
C2h  
© 2009 Microchip Technology Inc.  
DS39689F-page 287  
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BCF  
Bit Clear f  
BN  
Branch if Negative  
Syntax:  
BCF f, b {,a}  
Syntax:  
BN  
n
Operands:  
0 f 255  
0 b 7  
a [0,1]  
Operands:  
Operation:  
-128 n 127  
If Negative bit is ‘1’,  
(PC) + 2 + 2n PC  
Operation:  
0f<b>  
Status Affected:  
Encoding:  
None  
Status Affected:  
Encoding:  
None  
1110  
0110  
nnnn  
nnnn  
1001  
bbba  
ffff  
ffff  
Description:  
If the Negative bit is ‘1’, then the  
Description:  
Bit ‘b’ in register ‘f’ is cleared.  
program will branch.  
If ‘a’ is ‘0’, the Access Bank is selected.  
If ‘a’ is ‘1’, the BSR is used to select the  
GPR bank (default).  
The 2’s complement number ‘2n’ is  
added to the PC. Since the PC will have  
incremented to fetch the next  
If ‘a’ is ‘0’ and the extended instruction  
set is enabled, this instruction operates  
in Indexed Literal Offset Addressing  
mode whenever f 95 (5Fh). See  
Section 25.2.3 “Byte-Oriented and  
Bit-Oriented Instructions in Indexed  
Literal Offset Mode” for details.  
instruction, the new address will be  
PC + 2 + 2n. This instruction is then a  
two-cycle instruction.  
Words:  
Cycles:  
1
1(2)  
Q Cycle Activity:  
If Jump:  
Words:  
Cycles:  
1
1
Q1  
Q2  
Q3  
Q4  
Decode  
Read literal  
‘n’  
Process  
Data  
Write to  
PC  
Q Cycle Activity:  
Q1  
Q2  
Q3  
Q4  
No  
No  
No  
No  
Decode  
Read  
register ‘f’  
Process  
Data  
Write  
register ‘f’  
operation  
operation  
operation  
operation  
If No Jump:  
Q1  
Q2  
Q3  
Q4  
Example:  
BCF  
FLAG_REG, 7, 0  
C7h  
47h  
Decode  
Read literal  
‘n’  
Process  
Data  
No  
operation  
Before Instruction  
FLAG_REG  
After Instruction  
FLAG_REG  
=
=
Example:  
HERE  
BN Jump  
Before Instruction  
PC  
=
address (HERE)  
After Instruction  
If Negative  
PC  
If Negative  
PC  
=
=
=
=
1;  
address (Jump)  
0;  
address (HERE + 2)  
DS39689F-page 288  
© 2009 Microchip Technology Inc.  
PIC18F2221/2321/4221/4321 FAMILY  
BNC  
Branch if Not Carry  
BNN  
Branch if Not Negative  
Syntax:  
BNC  
n
Syntax:  
BNN  
n
Operands:  
Operation:  
-128 n 127  
Operands:  
Operation:  
-128 n 127  
If Carry bit is ‘0’,  
(PC) + 2 + 2n PC  
If Negative bit is ‘0’,  
(PC) + 2 + 2n PC  
Status Affected:  
Encoding:  
None  
Status Affected:  
Encoding:  
None  
1110  
0011  
nnnn  
nnnn  
1110  
0111  
nnnn  
nnnn  
Description:  
If the Carry bit is ‘0’, then the program  
will branch.  
Description:  
If the Negative bit is ‘0’, then the  
program will branch.  
The 2’s complement number ‘2n’ is  
added to the PC. Since the PC will have  
incremented to fetch the next  
instruction, the new address will be  
PC + 2 + 2n. This instruction is then a  
two-cycle instruction.  
The 2’s complement number ‘2n’ is  
added to the PC. Since the PC will have  
incremented to fetch the next  
instruction, the new address will be  
PC + 2 + 2n. This instruction is then a  
two-cycle instruction.  
Words:  
Cycles:  
1
Words:  
Cycles:  
1
1(2)  
1(2)  
Q Cycle Activity:  
If Jump:  
Q Cycle Activity:  
If Jump:  
Q1  
Q2  
Q3  
Q4  
Q1  
Q2  
Q3  
Q4  
Decode  
Read literal  
‘n’  
Process  
Data  
Write to  
PC  
Decode  
Read literal  
‘n’  
Process  
Data  
Write to  
PC  
No  
No  
No  
No  
No  
No  
No  
No  
operation  
operation  
operation  
operation  
operation  
operation  
operation  
operation  
If No Jump:  
Q1  
If No Jump:  
Q1  
Q2  
Q3  
Q4  
Q2  
Q3  
Q4  
Decode  
Read literal  
‘n’  
Process  
Data  
No  
operation  
Decode  
Read literal  
‘n’  
Process  
Data  
No  
operation  
Example:  
HERE  
BNC Jump  
Example:  
HERE  
BNN Jump  
Before Instruction  
Before Instruction  
PC  
=
address (HERE)  
PC  
=
address (HERE)  
After Instruction  
After Instruction  
If Carry  
PC  
If Carry  
PC  
=
=
=
=
0;  
If Negative  
PC  
If Negative  
PC  
=
=
=
=
0;  
address (Jump)  
address (Jump)  
1;  
1;  
address (HERE + 2)  
address (HERE + 2)  
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BNOV  
Branch if Not Overflow  
BNZ  
Branch if Not Zero  
Syntax:  
BNOV  
n
Syntax:  
BNZ  
n
Operands:  
Operation:  
-128 n 127  
Operands:  
Operation:  
-128 n 127  
If Overflow bit is ‘0’,  
(PC) + 2 + 2n PC  
If Zero bit is ‘0’,  
(PC) + 2 + 2n PC  
Status Affected:  
Encoding:  
None  
Status Affected:  
Encoding:  
None  
1110  
0101  
nnnn  
nnnn  
1110  
0001  
nnnn  
nnnn  
Description:  
If the Overflow bit is ‘0’, then the  
program will branch.  
Description:  
If the Zero bit is ‘0’, then the program  
will branch.  
The 2’s complement number ‘2n’ is  
added to the PC. Since the PC will have  
incremented to fetch the next  
instruction, the new address will be  
PC + 2 + 2n. This instruction is then a  
two-cycle instruction.  
The 2’s complement number ‘2n’ is  
added to the PC. Since the PC will have  
incremented to fetch the next  
instruction, the new address will be  
PC + 2 + 2n. This instruction is then a  
two-cycle instruction.  
Words:  
Cycles:  
1
Words:  
Cycles:  
1
1(2)  
1(2)  
Q Cycle Activity:  
If Jump:  
Q Cycle Activity:  
If Jump:  
Q1  
Q2  
Q3  
Q4  
Q1  
Q2  
Q3  
Q4  
Decode  
Read literal  
‘n’  
Process  
Data  
Write to  
PC  
Decode  
Read literal  
‘n’  
Process  
Data  
Write to  
PC  
No  
No  
No  
No  
No  
No  
No  
No  
operation  
operation  
operation  
operation  
operation  
operation  
operation  
operation  
If No Jump:  
Q1  
If No Jump:  
Q1  
Q2  
Q3  
Q4  
Q2  
Q3  
Q4  
Decode  
Read literal  
‘n’  
Process  
Data  
No  
operation  
Decode  
Read literal  
‘n’  
Process  
Data  
No  
operation  
Example:  
HERE  
BNOV Jump  
Example:  
HERE  
BNZ Jump  
Before Instruction  
Before Instruction  
PC  
=
address (HERE)  
PC  
=
address (HERE)  
After Instruction  
After Instruction  
If Overflow  
PC  
If Overflow  
PC  
=
=
=
=
0;  
If Zero  
PC  
If Zero  
PC  
=
=
=
=
0;  
address (Jump)  
address (Jump)  
1;  
1;  
address (HERE + 2)  
address (HERE + 2)  
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BRA  
Unconditional Branch  
BSF  
Bit Set f  
Syntax:  
BRA  
n
Syntax:  
BSF f, b {,a}  
Operands:  
Operation:  
-1024 n 1023  
Operands:  
0 f 255  
0 b 7  
a [0,1]  
(PC) + 2 + 2n PC  
Status Affected: None  
Operation:  
1f<b>  
Encoding:  
1101  
0nnn  
nnnn  
nnnn  
Status Affected:  
Encoding:  
None  
Description:  
Add the 2’s complement number ‘2n’ to  
the PC. Since the PC will have  
1000  
bbba  
ffff  
ffff  
incremented to fetch the next instruction,  
the new address will be PC + 2 + 2n. This  
instruction is a two-cycle instruction.  
Description:  
Bit ‘b’ in register ‘f’ is set.  
If ‘a’ is ‘0’, the Access Bank is selected.  
If ‘a’ is ‘1’, the BSR is used to select the  
GPR bank (default).  
If ‘a’ is ‘0’ and the extended instruction  
set is enabled, this instruction operates  
in Indexed Literal Offset Addressing  
mode whenever f 95 (5Fh). See  
Section 25.2.3 “Byte-Oriented and  
Bit-Oriented Instructions in Indexed  
Literal Offset Mode” for details.  
Words:  
Cycles:  
1
2
Q Cycle Activity:  
Q1  
Q2  
Q3  
Q4  
Decode  
Read literal  
‘n’  
Process  
Data  
Write to  
PC  
No  
operation  
No  
operation  
No  
operation  
No  
operation  
Words:  
Cycles:  
1
1
Q Cycle Activity:  
Q1  
Example:  
HERE  
BRA Jump  
Q2  
Q3  
Q4  
Before Instruction  
Decode  
Read  
register ‘f’  
Process  
Data  
Write  
register ‘f’  
PC  
=
=
address (HERE)  
address (Jump)  
After Instruction  
PC  
Example:  
BSF  
FLAG_REG, 7, 1  
0Ah  
8Ah  
Before Instruction  
FLAG_REG  
After Instruction  
FLAG_REG  
=
=
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BTFSC  
Bit Test File, Skip if Clear  
BTFSS  
Bit Test File, Skip if Set  
Syntax:  
BTFSC f, b {,a}  
Syntax:  
BTFSS f, b {,a}  
Operands:  
0 f 255  
0 b 7  
a [0,1]  
Operands:  
0 f 255  
0 b < 7  
a [0,1]  
Operation:  
skip if (f<b>) = 0  
Operation:  
skip if (f<b>) = 1  
Status Affected:  
Encoding:  
None  
Status Affected:  
Encoding:  
None  
1011  
bbba  
ffff  
ffff  
1010  
bbba  
ffff  
ffff  
Description:  
If bit ‘b’ in register ‘f’ is ‘0’, then the next  
instruction is skipped. If bit ‘b’ is ‘0’, then  
the next instruction fetched during the  
current instruction execution is discarded  
and a NOPis executed instead, making  
this a two-cycle instruction.  
Description:  
If bit ‘b’ in register ‘f’ is ‘1’, then the next  
instruction is skipped. If bit ‘b’ is ‘1’, then  
the next instruction fetched during the  
current instruction execution is discarded  
and a NOPis executed instead, making  
this a two-cycle instruction.  
If ‘a’ is ‘0’, the Access Bank is selected. If  
‘a’ is ‘1’, the BSR is used to select the  
GPR bank (default).  
If ‘a’ is ‘0’, the Access Bank is selected. If  
‘a’ is ‘1’, the BSR is used to select the  
GPR bank (default).  
If ‘a’ is ‘0’ and the extended instruction  
set is enabled, this instruction operates in  
Indexed Literal Offset Addressing  
mode whenever f 95 (5Fh).  
If ‘a’ is ‘0’ and the extended instruction  
set is enabled, this instruction operates  
in Indexed Literal Offset Addressing  
mode whenever f 95 (5Fh).  
See Section 25.2.3 “Byte-Oriented and  
Bit-Oriented Instructions in Indexed  
Literal Offset Mode” for details.  
See Section 25.2.3 “Byte-Oriented and  
Bit-Oriented Instructions in Indexed  
Literal Offset Mode” for details.  
Words:  
Cycles:  
1
Words:  
Cycles:  
1
1(2)  
1(2)  
Note: 3 cycles if skip and followed  
by a 2-word instruction.  
Note: 3 cycles if skip and followed  
by a 2-word instruction.  
Q Cycle Activity:  
Q1  
Q Cycle Activity:  
Q1  
Q2  
Q3  
Q4  
Q2  
Q3  
Q4  
Decode  
Read  
register ‘f’  
Process  
Data  
No  
operation  
Decode  
Read  
register ‘f’  
Process  
Data  
No  
operation  
If skip:  
Q1  
If skip:  
Q1  
Q2  
Q3  
Q4  
Q2  
Q3  
Q4  
No  
No  
No  
No  
No  
No  
No  
No  
operation  
operation  
operation  
operation  
operation  
operation  
operation  
operation  
If skip and followed by 2-word instruction:  
If skip and followed by 2-word instruction:  
Q1  
Q2  
Q3  
Q4  
Q1  
Q2  
Q3  
Q4  
No  
No  
No  
No  
No  
No  
No  
No  
operation  
operation  
operation  
operation  
operation  
operation  
operation  
operation  
No  
No  
No  
No  
No  
No  
No  
No  
operation  
operation  
operation  
operation  
operation  
operation  
operation  
operation  
Example:  
HERE  
FALSE  
TRUE  
BTFSC  
:
:
FLAG, 1, 0  
Example:  
HERE  
FALSE  
TRUE  
BTFSS  
:
:
FLAG, 1, 0  
Before Instruction  
PC  
Before Instruction  
PC  
=
address (HERE)  
=
address (HERE)  
After Instruction  
After Instruction  
If FLAG<1>  
PC  
If FLAG<1>  
PC  
=
=
=
=
0;  
If FLAG<1>  
PC  
If FLAG<1>  
PC  
=
=
=
=
0;  
address (TRUE)  
1;  
address (FALSE)  
1;  
address (FALSE)  
address (TRUE)  
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BTG  
Bit Toggle f  
BOV  
Branch if Overflow  
Syntax:  
BTG f, b {,a}  
Syntax:  
BOV  
n
Operands:  
0 f 255  
0 b < 7  
a [0,1]  
Operands:  
Operation:  
-128 n 127  
If Overflow bit is ‘1’,  
(PC) + 2 + 2n PC  
Operation:  
(f<b>) f<b>  
Status Affected:  
Encoding:  
None  
Status Affected:  
Encoding:  
None  
1110  
0100  
nnnn  
nnnn  
0111  
bbba  
ffff  
ffff  
Description:  
If the Overflow bit is ‘1’, then the  
Description:  
Bit ‘b’ in data memory location ‘f’ is  
inverted.  
If ‘a’ is ‘0’, the Access Bank is selected.  
If ‘a’ is ‘1’, the BSR is used to select the  
GPR bank (default).  
If ‘a’ is ‘0’ and the extended instruction  
set is enabled, this instruction operates  
in Indexed Literal Offset Addressing  
mode whenever f 95 (5Fh). See  
Section 25.2.3 “Byte-Oriented and  
Bit-Oriented Instructions in Indexed  
Literal Offset Mode” for details.  
program will branch.  
The 2’s complement number ‘2n’ is  
added to the PC. Since the PC will have  
incremented to fetch the next  
instruction, the new address will be  
PC + 2 + 2n. This instruction is then a  
two-cycle instruction.  
Words:  
Cycles:  
1
1(2)  
Q Cycle Activity:  
If Jump:  
Words:  
Cycles:  
1
1
Q1  
Q2  
Q3  
Q4  
Decode  
Read literal  
‘n’  
Process  
Data  
Write to  
PC  
Q Cycle Activity:  
Q1  
No  
operation  
No  
operation  
No  
operation  
No  
operation  
Q2  
Q3  
Q4  
Decode  
Read  
register ‘f’  
Process  
Data  
Write  
register ‘f’  
If No Jump:  
Q1  
Q2  
Q3  
Q4  
Decode  
Read literal  
‘n’  
Process  
Data  
No  
operation  
Example:  
BTG  
PORTC, 4, 0  
Before Instruction:  
PORTC  
After Instruction:  
PORTC  
=
0111 0101 [75h]  
0110 0101 [65h]  
Example:  
HERE  
BOV Jump  
Before Instruction  
=
PC  
=
address (HERE)  
After Instruction  
If Overflow  
PC  
If Overflow  
PC  
=
=
=
=
1;  
address (Jump)  
0;  
address (HERE + 2)  
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BZ  
Branch if Zero  
CALL  
Subroutine Call  
Syntax:  
BZ  
n
Syntax:  
CALL k {,s}  
Operands:  
Operation:  
-128 n 127  
Operands:  
0k 1048575  
s [0,1]  
If Zero bit is ‘1’,  
(PC) + 2 + 2n PC  
Operation:  
(PC) + 4 TOS,  
k PC<20:1>;  
if s = 1,  
Status Affected:  
Encoding:  
None  
1110  
0000  
nnnn  
nnnn  
(W) WS,  
(STATUS) STATUSS,  
(BSR) BSRS  
Description:  
If the Zero bit is ‘1’, then the program  
will branch.  
The 2’s complement number ‘2n’ is  
added to the PC. Since the PC will  
have incremented to fetch the next  
instruction, the new address will be  
PC + 2 + 2n. This instruction is then a  
two-cycle instruction.  
Status Affected:  
None  
Encoding:  
1st word (k<7:0>)  
2nd word(k<19:8>)  
1110  
1111  
110s  
k kkk  
kkkk  
kkkk  
7
0
8
k
kkk kkkk  
19  
Description:  
Subroutine call of entire 2-Mbyte  
memory range. First, return address  
(PC + 4) is pushed onto the return  
stack. If ‘s’ = 1, the W, STATUS and  
Words:  
Cycles:  
1
1(2)  
BSR registers are also pushed into their  
respective shadow registers, WS,  
STATUSS and BSRS. If ‘s’ = 0, no  
update occurs (default). Then, the  
20-bit value ‘k’ is loaded into PC<20:1>.  
CALLis a two-cycle instruction.  
Q Cycle Activity:  
If Jump:  
Q1  
Q2  
Q3  
Q4  
Decode  
Read literal  
‘n’  
Process  
Data  
Write to  
PC  
No  
operation  
No  
operation  
No  
operation  
No  
operation  
Words:  
Cycles:  
2
2
If No Jump:  
Q1  
Q2  
Q3  
Q4  
Q Cycle Activity:  
Q1  
Decode  
Read literal  
‘n’  
Process  
Data  
No  
operation  
Q2  
Q3  
Q4  
Decode  
Read literal PUSH PC to Read literal  
‘k’<7:0>,  
stack  
‘k’<19:8>,  
Write to PC  
Example:  
HERE  
BZ Jump  
No  
operation  
No  
operation  
No  
operation  
No  
operation  
Before Instruction  
PC  
=
address (HERE)  
After Instruction  
If Zero  
PC  
If Zero  
PC  
=
=
=
=
1;  
Example:  
HERE  
CALL THERE, 1  
address (Jump)  
Before Instruction  
PC  
After Instruction  
0;  
address (HERE + 2)  
=
address (HERE)  
PC  
=
address (THERE)  
TOS  
WS  
=
=
=
address (HERE + 4)  
W
BSRS  
STATUSS =  
BSR  
STATUS  
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CLRF  
Clear f  
CLRWDT  
Clear Watchdog Timer  
Syntax:  
CLRF f {,a}  
Syntax:  
CLRWDT  
None  
Operands:  
0 f 255  
a [0,1]  
Operands:  
Operation:  
000h WDT,  
000h WDT postscaler,  
1TO,  
Operation:  
000h f,  
1Z  
1PD  
Status Affected:  
Encoding:  
Z
Status Affected:  
Encoding:  
TO, PD  
0110  
101a  
ffff  
ffff  
0000  
0000  
0000  
0100  
Description:  
Clears the contents of the specified  
register.  
Description:  
CLRWDTinstruction resets the  
If ‘a’ is ‘0’, the Access Bank is selected.  
If ‘a’ is ‘1’, the BSR is used to select the  
GPR bank (default).  
Watchdog Timer. It also resets the  
postscaler of the WDT. Status bits, TO  
and PD, are set.  
If ‘a’ is ‘0’ and the extended instruction  
set is enabled, this instruction operates  
in Indexed Literal Offset Addressing  
mode whenever f 95 (5Fh). See  
Section 25.2.3 “Byte-Oriented and  
Bit-Oriented Instructions in Indexed  
Literal Offset Mode” for details.  
Words:  
Cycles:  
1
1
Q Cycle Activity:  
Q1  
Q2  
Q3  
Q4  
Decode  
No  
Process  
Data  
No  
operation  
operation  
Words:  
Cycles:  
1
1
Example:  
CLRWDT  
Q Cycle Activity:  
Q1  
Before Instruction  
Q2  
Q3  
Q4  
WDT Counter  
After Instruction  
WDT Counter  
WDT Postscaler  
TO  
=
?
Decode  
Read  
register ‘f’  
Process  
Data  
Write  
register ‘f’  
=
=
=
=
00h  
0
1
Example:  
CLRF  
FLAG_REG, 1  
PD  
1
Before Instruction  
FLAG_REG  
After Instruction  
FLAG_REG  
=
=
5Ah  
00h  
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CPFSEQ  
Compare f with W, Skip if f = W  
COMF  
Complement f  
Syntax:  
CPFSEQ f {,a}  
Syntax:  
COMF f {,d {,a}}  
Operands:  
0 f 255  
a [0,1]  
Operands:  
0 f 255  
d [0,1]  
a [0,1]  
Operation:  
(f) – (W),  
skip if (f) = (W)  
(unsigned comparison)  
Operation:  
(f) dest  
Status Affected:  
Encoding:  
N, Z  
Status Affected:  
Encoding:  
None  
0001  
11da  
ffff  
ffff  
0110  
001a  
ffff  
ffff  
Description:  
The contents of register ‘f’ are  
Description:  
Compares the contents of data memory  
location ‘f’ to the contents of W by  
performing an unsigned subtraction.  
If ‘f’ = W, then the fetched instruction is  
discarded and a NOPis executed  
instead, making this a two-cycle  
instruction.  
complemented. If ‘d’ is ‘0’, the result is  
stored in W. If ‘d’ is ‘1’, the result is  
stored back in register ‘f’ (default).  
If ‘a’ is ‘0’, the Access Bank is selected.  
If ‘a’ is ‘1’, the BSR is used to select the  
GPR bank (default).  
If ‘a’ is ‘0’ and the extended instruction  
set is enabled, this instruction operates  
in Indexed Literal Offset Addressing  
mode whenever f 95 (5Fh). See  
Section 25.2.3 “Byte-Oriented and  
Bit-Oriented Instructions in Indexed  
Literal Offset Mode” for details.  
If ‘a’ is ‘0’, the Access Bank is selected.  
If ‘a’ is ‘1’, the BSR is used to select the  
GPR bank (default).  
If ‘a’ is ‘0’ and the extended instruction  
set is enabled, this instruction operates  
in Indexed Literal Offset Addressing  
mode whenever f 95 (5Fh). See  
Section 25.2.3 “Byte-Oriented and  
Bit-Oriented Instructions in Indexed  
Literal Offset Mode” for details.  
Words:  
Cycles:  
1
1
Q Cycle Activity:  
Q1  
Words:  
Cycles:  
1
Q2  
Q3  
Q4  
1(2)  
Decode  
Read  
register ‘f’  
Process  
Data  
Write to  
destination  
Note: 3 cycles if skip and followed  
by a 2-word instruction.  
Q Cycle Activity:  
Q1  
Example:  
COMF  
REG, 0, 0  
Q2  
Q3  
Q4  
Before Instruction  
Decode  
Read  
register ‘f’  
Process  
Data  
No  
operation  
REG  
=
13h  
After Instruction  
If skip:  
REG  
W
=
=
13h  
ECh  
Q1  
No  
Q2  
No  
Q3  
No  
Q4  
No  
operation  
operation  
operation  
operation  
If skip and followed by 2-word instruction:  
Q1  
No  
Q2  
No  
Q3  
No  
Q4  
No  
operation  
No  
operation  
No  
operation  
No  
operation  
No  
operation  
operation  
operation  
operation  
Example:  
HERE  
CPFSEQ REG, 0  
NEQUAL  
EQUAL  
:
:
Before Instruction  
PC Address  
=
HERE  
W
REG  
=
=
?
?
After Instruction  
If REG  
PC  
=
=
W;  
Address (EQUAL)  
If REG  
PC  
=
W;  
Address (NEQUAL)  
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CPFSGT  
Compare f with W, Skip if f > W  
CPFSLT  
Compare f with W, Skip if f < W  
Syntax:  
CPFSGT f {,a}  
Syntax:  
CPFSLT f {,a}  
Operands:  
0 f 255  
a [0,1]  
Operands:  
0 f 255  
a [0,1]  
Operation:  
(f) – (W),  
skip if (f) > (W)  
(unsigned comparison)  
Operation:  
(f) – (W),  
skip if (f) < (W)  
(unsigned comparison)  
Status Affected:  
Encoding:  
None  
Status Affected:  
Encoding:  
None  
0110  
010a  
ffff  
ffff  
0110  
000a  
ffff  
ffff  
Description:  
Compares the contents of data memory  
location ‘f’ to the contents of the W by  
performing an unsigned subtraction.  
If the contents of ‘f’ are greater than the  
contents of WREG, then the fetched  
instruction is discarded and a NOPis  
executed instead, making this a  
Description:  
Compares the contents of data memory  
location ‘f’ to the contents of W by  
performing an unsigned subtraction.  
If the contents of ‘f’ are less than the  
contents of W, then the fetched  
instruction is discarded and a NOPis  
executed instead, making this a  
two-cycle instruction.  
two-cycle instruction.  
If ‘a’ is ‘0’, the Access Bank is selected.  
If ‘a’ is ‘1’, the BSR is used to select the  
GPR bank (default).  
If ‘a’ is ‘0’ and the extended instruction  
set is enabled, this instruction operates  
in Indexed Literal Offset Addressing  
mode whenever f 95 (5Fh). See  
Section 25.2.3 “Byte-Oriented and  
Bit-Oriented Instructions in Indexed  
Literal Offset Mode” for details.  
If ‘a’ is ‘0’, the Access Bank is selected.  
If ‘a’ is ‘1’, the BSR is used to select the  
GPR bank (default).  
Words:  
Cycles:  
1
1(2)  
Note: 3 cycles if skip and followed  
by a 2-word instruction.  
Q Cycle Activity:  
Q1  
Q2  
Q3  
Q4  
Words:  
Cycles:  
1
Decode  
Read  
register ‘f’  
Process  
Data  
No  
operation  
1(2)  
Note: 3 cycles if skip and followed  
by a 2-word instruction.  
If skip:  
Q1  
Q2  
Q3  
Q4  
Q Cycle Activity:  
Q1  
No  
operation  
No  
operation  
No  
operation  
No  
operation  
Q2  
Q3  
Q4  
No  
operation  
Decode  
Read  
register ‘f’  
Process  
Data  
If skip and followed by 2-word instruction:  
If skip:  
Q1  
Q2  
Q3  
Q4  
Q1  
No  
Q2  
No  
Q3  
No  
Q4  
No  
No  
operation  
No  
operation  
No  
operation  
No  
operation  
operation  
operation  
operation  
operation  
No  
No  
No  
No  
If skip and followed by 2-word instruction:  
operation  
operation  
operation  
operation  
Q1  
No  
operation  
No  
Q2  
No  
operation  
No  
Q3  
No  
operation  
No  
Q4  
No  
operation  
No  
Example:  
HERE  
NLESS  
LESS  
CPFSLT REG, 1  
:
:
operation  
operation  
operation  
operation  
Before Instruction  
PC  
W
=
=
Address (HERE)  
Example:  
HERE  
NGREATER  
GREATER  
CPFSGT REG, 0  
:
:
?
After Instruction  
If REG  
PC  
If REG  
PC  
<
=
W;  
Before Instruction  
Address (LESS)  
W;  
Address (NLESS)  
PC  
W
=
=
Address (HERE)  
?
=
After Instruction  
If REG  
PC  
>
=
W;  
Address (GREATER)  
If REG  
PC  
=
W;  
Address (NGREATER)  
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DAW  
Decimal Adjust W Register  
DECF  
Decrement f  
Syntax:  
DAW  
None  
Syntax:  
DECF f {,d {,a}}  
Operands:  
Operation:  
Operands:  
0 f 255  
d [0,1]  
a [0,1]  
If [W<3:0> > 9] or [DC = 1] then,  
(W<3:0>) + 6 W<3:0>;  
else,  
Operation:  
(f) – 1 dest  
(W<3:0>) W<3:0>  
Status Affected:  
Encoding:  
C, DC, N, OV, Z  
0000  
01da  
ffff  
ffff  
If [W<7:4> + DC > 9] or [C = 1] then,  
(W<7:4>) + 6 + DC W<7:4>;  
else,  
Description:  
Decrement register ‘f’. If ‘d’ is ‘0’, the  
result is stored in W. If ‘d’ is ‘1’, the  
result is stored back in register ‘f’  
(default).  
(W<7:4>) + DC W<7:4>  
Status Affected:  
Encoding:  
C
If ‘a’ is ‘0’, the Access Bank is selected.  
If ‘a’ is ‘1’, the BSR is used to select the  
GPR bank (default).  
If ‘a’ is ‘0’ and the extended instruction  
set is enabled, this instruction operates  
in Indexed Literal Offset Addressing  
mode whenever f 95 (5Fh). See  
Section 25.2.3 “Byte-Oriented and  
Bit-Oriented Instructions in Indexed  
Literal Offset Mode” for details.  
0000  
0000  
0000  
0111  
Description:  
DAW adjusts the eight-bit value in W  
resulting from the earlier addition of two  
variables (each in packed BCD format)  
and produces a correct packed BCD  
result.  
Words:  
Cycles:  
1
1
Q Cycle Activity:  
Q1  
Words:  
Cycles:  
1
1
Q2  
Q3  
Q4  
Decode  
Read  
register W  
Process  
Data  
Write  
W
Q Cycle Activity:  
Q1  
Q2  
Q3  
Q4  
Example 1:  
Decode  
Read  
register ‘f’  
Process  
Data  
Write to  
destination  
DAW  
Before Instruction  
W
C
DC  
=
=
=
A5h  
0
0
Example:  
DECF  
CNT,  
1, 0  
Before Instruction  
After Instruction  
CNT  
Z
After Instruction  
=
01h  
0
=
W
=
05h  
1
0
C
DC  
=
=
CNT  
Z
=
=
00h  
1
Example 2:  
Before Instruction  
W
=
CEh  
C
DC  
=
=
0
0
After Instruction  
W
=
34h  
C
DC  
=
=
1
0
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DECFSZ  
Decrement f, Skip if 0  
DCFSNZ  
Decrement f, Skip if Not 0  
Syntax:  
DECFSZ f {,d {,a}}  
Syntax:  
DCFSNZ f {,d {,a}}  
Operands:  
0 f 255  
d [0,1]  
a [0,1]  
Operands:  
0 f 255  
d [0,1]  
a [0,1]  
Operation:  
(f) – 1dest,  
skip if result = 0  
Operation:  
(f) – 1dest,  
skip if result 0  
Status Affected:  
Encoding:  
None  
Status Affected:  
Encoding:  
None  
0010  
11da  
ffff  
ffff  
0100  
11da  
ffff  
ffff  
Description:  
The contents of register ‘f’ are  
Description:  
The contents of register ‘f’ are  
decremented. If ‘d’ is ‘0’, the result is  
placed in W. If ‘d’ is ‘1’, the result is  
placed back in register ‘f’ (default).  
If the result is ‘0’, the next instruction,  
which is already fetched, is discarded  
and a NOPis executed instead, making  
it a two-cycle instruction.  
decremented. If ‘d’ is ‘0’, the result is  
placed in W. If ‘d’ is ‘1’, the result is  
placed back in register ‘f’ (default).  
If the result is not ‘0’, the next  
instruction, which is already fetched, is  
discarded and a NOPis executed  
instead, making it a two-cycle  
If ‘a’ is ‘0’, the Access Bank is selected.  
If ‘a’ is ‘1’, the BSR is used to select the  
GPR bank (default).  
If ‘a’ is ‘0’ and the extended instruction  
set is enabled, this instruction operates  
in Indexed Literal Offset Addressing  
mode whenever f 95 (5Fh). See  
Section 25.2.3 “Byte-Oriented and  
Bit-Oriented Instructions in Indexed  
Literal Offset Mode” for details.  
instruction.  
If ‘a’ is ‘0’, the Access Bank is selected.  
If ‘a’ is ‘1’, the BSR is used to select the  
GPR bank (default).  
If ‘a’ is ‘0’ and the extended instruction  
set is enabled, this instruction operates  
in Indexed Literal Offset Addressing  
mode whenever f 95 (5Fh). See  
Section 25.2.3 “Byte-Oriented and  
Bit-Oriented Instructions in Indexed  
Literal Offset Mode” for details.  
Words:  
Cycles:  
1
Words:  
Cycles:  
1
1(2)  
Note: 3 cycles if skip and followed  
by a 2-word instruction.  
1(2)  
Note: 3 cycles if skip and followed  
by a 2-word instruction.  
Q Cycle Activity:  
Q1  
Q Cycle Activity:  
Q1  
Q2  
Q3  
Q4  
Q2  
Q3  
Q4  
Decode  
Read  
register ‘f’  
Process  
Data  
Write to  
destination  
Decode  
Read  
Process  
Data  
Write to  
destination  
register ‘f’  
If skip:  
Q1  
If skip:  
Q1  
Q2  
Q3  
Q4  
Q2  
Q3  
Q4  
No  
No  
No  
No  
operation  
operation  
operation  
operation  
No  
No  
No  
No  
operation  
operation  
operation  
operation  
If skip and followed by 2-word instruction:  
If skip and followed by 2-word instruction:  
Q1  
Q2  
Q3  
Q4  
Q1  
Q2  
Q3  
Q4  
No  
No  
No  
No  
operation  
operation  
operation  
operation  
No  
No  
No  
No  
operation  
operation  
operation  
operation  
No  
No  
No  
No  
operation  
operation  
operation  
operation  
No  
No  
No  
No  
operation  
operation  
operation  
operation  
Example:  
HERE  
DECFSZ  
GOTO  
CNT, 1, 1  
LOOP  
Example:  
HERE  
ZERO  
NZERO  
DCFSNZ TEMP, 1, 0  
:
:
CONTINUE  
Before Instruction  
PC  
After Instruction  
Before Instruction  
TEMP  
After Instruction  
=
Address (HERE)  
=
?
CNT  
=
CNT – 1  
0;  
If CNT  
=
=
=
TEMP  
If TEMP  
PC  
If TEMP  
PC  
=
=
=
=
TEMP – 1  
0;  
Address (ZERO)  
0;  
Address (NZERO)  
PC  
Address (CONTINUE)  
0;  
If CNT  
PC  
Address (HERE + 2)  
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GOTO  
Unconditional Branch  
INCF  
Increment f  
Syntax:  
GOTO  
k
Syntax:  
INCF f {,d {,a}}  
Operands:  
Operation:  
Status Affected:  
0 k 1048575  
k PC<20:1>  
None  
Operands:  
0 f 255  
d [0,1]  
a [0,1]  
Operation:  
(f) + 1dest  
Encoding:  
1st word (k<7:0>)  
2nd word(k<19:8>)  
Status Affected:  
Encoding:  
C, DC, N, OV, Z  
1110  
1111  
1111  
kkk  
k kkk  
kkkk  
kkkk  
kkkk  
7
0
8
k
0010  
10da  
ffff  
ffff  
19  
Description:  
GOTOallows an unconditional branch  
anywhere within entire  
2-Mbyte memory range. The 20-bit  
value ‘k’ is loaded into PC<20:1>.  
GOTOis always a two-cycle  
instruction.  
Description:  
The contents of register ‘f’ are  
incremented. If ‘d’ is ‘0’, the result is  
placed in W. If ‘d’ is ‘1’, the result is  
placed back in register ‘f’ (default).  
If ‘a’ is ‘0’, the Access Bank is selected.  
If ‘a’ is ‘1’, the BSR is used to select the  
GPR bank (default).  
If ‘a’ is ‘0’ and the extended instruction  
set is enabled, this instruction operates  
in Indexed Literal Offset Addressing  
mode whenever f 95 (5Fh). See  
Section 25.2.3 “Byte-Oriented and  
Bit-Oriented Instructions in Indexed  
Literal Offset Mode” for details.  
Words:  
Cycles:  
2
2
Q Cycle Activity:  
Q1  
Q2  
Q3  
Q4  
Decode  
Read literal  
‘k’<7:0>,  
No  
operation  
Read literal  
‘k’<19:8>,  
Write to PC  
Words:  
Cycles:  
1
1
No  
operation  
No  
No  
No  
operation  
operation  
operation  
Q Cycle Activity:  
Q1  
Example:  
GOTO THERE  
Q2  
Q3  
Q4  
Decode  
Read  
register ‘f’  
Process  
Data  
Write to  
destination  
After Instruction  
PC  
=
Address (THERE)  
Example:  
INCF  
CNT, 1, 0  
Before Instruction  
CNT  
Z
=
FFh  
0
=
=
=
C
?
DC  
?
After Instruction  
CNT  
Z
=
00h  
1
=
=
=
C
1
DC  
1
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INFSNZ  
Increment f, Skip if Not 0  
INCFSZ  
Increment f, Skip if 0  
Syntax:  
INFSNZ f {,d {,a}}  
Syntax:  
INCFSZ f {,d {,a}}  
Operands:  
0 f 255  
d [0,1]  
a [0,1]  
Operands:  
0 f 255  
d [0,1]  
a [0,1]  
Operation:  
(f) + 1dest,  
skip if result 0  
Operation:  
(f) + 1dest,  
skip if result = 0  
Status Affected:  
Encoding:  
None  
Status Affected:  
Encoding:  
None  
0100  
10da  
ffff  
ffff  
0011  
11da  
ffff  
ffff  
Description:  
The contents of register ‘f’ are  
Description:  
The contents of register ‘f’ are  
incremented. If ‘d’ is ‘0’, the result is  
placed in W. If ‘d’ is ‘1’, the result is  
placed back in register ‘f’ (default).  
If the result is not ‘0’, the next  
instruction, which is already fetched, is  
discarded and a NOPis executed  
instead, making it a two-cycle  
incremented. If ‘d’ is ‘0’, the result is  
placed in W. If ‘d’ is ‘1’, the result is  
placed back in register ‘f’ (default).  
If the result is ‘0’, the next instruction,  
which is already fetched, is discarded  
and a NOPis executed instead, making  
it a two-cycle instruction.  
If ‘a’ is ‘0’, the Access Bank is selected.  
If ‘a’ is ‘1’, the BSR is used to select the  
GPR bank (default).  
instruction.  
If ‘a’ is ‘0’, the Access Bank is selected.  
If ‘a’ is ‘1’, the BSR is used to select the  
GPR bank (default).  
If ‘a’ is ‘0’ and the extended instruction  
set is enabled, this instruction operates  
in Indexed Literal Offset Addressing  
mode whenever f 95 (5Fh). See  
Section 25.2.3 “Byte-Oriented and  
Bit-Oriented Instructions in Indexed  
Literal Offset Mode” for details.  
If ‘a’ is ‘0’ and the extended instruction  
set is enabled, this instruction operates  
in Indexed Literal Offset Addressing  
mode whenever f 95 (5Fh). See  
Section 25.2.3 “Byte-Oriented and  
Bit-Oriented Instructions in Indexed  
Literal Offset Mode” for details.  
Words:  
Cycles:  
1
Words:  
Cycles:  
1
1(2)  
1(2)  
Note: 3 cycles if skip and followed  
by a 2-word instruction.  
Note: 3 cycles if skip and followed  
by a 2-word instruction.  
Q Cycle Activity:  
Q1  
Q Cycle Activity:  
Q1  
Q2  
Q3  
Q4  
Q2  
Q3  
Q4  
Decode  
Read  
register ‘f’  
Process  
Data  
Write to  
destination  
Decode  
Read  
register ‘f’  
Process  
Data  
Write to  
destination  
If skip:  
Q1  
If skip:  
Q1  
Q2  
Q3  
Q4  
Q2  
Q3  
Q4  
No  
No  
No  
No  
No  
No  
No  
No  
operation  
operation  
operation  
operation  
operation  
operation  
operation  
operation  
If skip and followed by 2-word instruction:  
If skip and followed by 2-word instruction:  
Q1  
Q2  
Q3  
Q4  
Q1  
Q2  
Q3  
Q4  
No  
No  
No  
No  
No  
No  
No  
No  
operation  
operation  
operation  
operation  
operation  
operation  
operation  
operation  
No  
No  
No  
No  
No  
No  
No  
No  
operation  
operation  
operation  
operation  
operation  
operation  
operation  
operation  
Example:  
HERE  
NZERO  
ZERO  
INCFSZ  
:
:
CNT, 1, 0  
Example:  
HERE  
ZERO  
NZERO  
INFSNZ REG, 1, 0  
Before Instruction  
PC  
After Instruction  
Before Instruction  
PC  
After Instruction  
=
Address (HERE)  
=
Address (HERE)  
REG  
If REG  
PC  
If REG  
PC  
=
REG + 1  
0;  
CNT  
If CNT  
PC  
If CNT  
PC  
=
CNT + 1  
=
=
=
=
=
=
0;  
Address (ZERO)  
0;  
Address (NZERO)  
Address (NZERO)  
0;  
Address (ZERO)  
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IORLW  
Inclusive OR Literal with W  
IORWF  
Inclusive OR W with f  
Syntax:  
IORLW  
k
Syntax:  
IORWF f {,d {,a}}  
Operands:  
Operation:  
Status Affected:  
Encoding:  
Description:  
0 k 255  
(W) .OR. k W  
N, Z  
Operands:  
0 f 255  
d [0,1]  
a [0,1]  
Operation:  
(W) .OR. (f) dest  
0000  
1001  
kkkk  
kkkk  
Status Affected:  
Encoding:  
N, Z  
The contents of W are ORed with the  
eight-bit literal ‘k’. The result is placed in  
W.  
0001  
00da  
ffff  
ffff  
Description:  
Inclusive OR W with register ‘f’. If ‘d’ is  
0’, the result is placed in W. If ‘d’ is ‘1’,  
the result is placed back in register ‘f’  
(default).  
Words:  
Cycles:  
1
1
If ‘a’ is ‘0’, the Access Bank is selected.  
If ‘a’ is ‘1’, the BSR is used to select the  
GPR bank (default).  
If ‘a’ is ‘0’ and the extended instruction  
set is enabled, this instruction operates  
in Indexed Literal Offset Addressing  
mode whenever f 95 (5Fh). See  
Section 25.2.3 “Byte-Oriented and  
Bit-Oriented Instructions in Indexed  
Literal Offset Mode” for details.  
Q Cycle Activity:  
Q1  
Q2  
Q3  
Q4  
Decode  
Read  
literal ‘k’  
Process  
Data  
Write to W  
Example:  
IORLW  
35h  
Before Instruction  
W
=
9Ah  
BFh  
After Instruction  
Words:  
Cycles:  
1
1
W
=
Q Cycle Activity:  
Q1  
Q2  
Q3  
Q4  
Decode  
Read  
register ‘f’  
Process  
Data  
Write to  
destination  
Example:  
IORWF RESULT, 0, 1  
Before Instruction  
RESULT =  
13h  
91h  
W
=
After Instruction  
RESULT =  
13h  
93h  
W
=
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LFSR  
Load FSR  
MOVF  
Move f  
Syntax:  
LFSR f, k  
Syntax:  
MOVF f {,d {,a}}  
Operands:  
0 f 2  
0 k 4095  
Operands:  
0 f 255  
d [0,1]  
a [0,1]  
Operation:  
k FSRf  
Operation:  
f dest  
Status Affected:  
Encoding:  
None  
Status Affected:  
Encoding:  
N, Z  
1110  
1111  
1110  
0000  
00ff  
k kkk  
k kkk  
11  
kkkk  
0101  
00da  
ffff  
ffff  
7
Description:  
The 12-bit literal ‘k’ is loaded into the  
File Select Register pointed to by ‘f’.  
Description:  
The contents of register ‘f’ are moved to  
a destination dependent upon the  
status of ‘d’. If ‘d’ is ‘0’, the result is  
placed in W. If ‘d’ is ‘1’, the result is  
placed back in register ‘f’ (default).  
Location ‘f’ can be anywhere in the  
256-byte bank.  
If ‘a’ is ‘0’, the Access Bank is selected.  
If ‘a’ is ‘1’, the BSR is used to select the  
GPR bank (default).  
If ‘a’ is ‘0’ and the extended instruction  
set is enabled, this instruction operates  
in Indexed Literal Offset Addressing  
mode whenever f 95 (5Fh). See  
Section 25.2.3 “Byte-Oriented and  
Bit-Oriented Instructions in Indexed  
Literal Offset Mode” for details.  
Words:  
Cycles:  
2
2
Q Cycle Activity:  
Q1  
Q2  
Q3  
Q4  
Decode  
Read literal  
‘k’ MSB  
Process  
Data  
Write  
literal ‘k’  
MSB to  
FSRfH  
Decode  
Read literal  
‘k’ LSB  
Process  
Data  
Write literal  
‘k’ to FSRfL  
Example:  
LFSR 2, 3ABh  
After Instruction  
Words:  
Cycles:  
1
1
FSR2H  
FSR2L  
=
=
03h  
ABh  
Q Cycle Activity:  
Q1  
Q2  
Q3  
Q4  
Decode  
Read  
register ‘f’  
Process  
Data  
Write W  
Example:  
MOVF  
REG, 0, 0  
Before Instruction  
REG  
W
=
=
22h  
FFh  
After Instruction  
REG  
W
=
=
22h  
22h  
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MOVFF  
Move f to f  
MOVLB  
Move Literal to Low Nibble in BSR  
Syntax:  
MOVFF f ,f  
Syntax:  
MOVLW k  
s
d
Operands:  
0 f 4095  
Operands:  
Operation:  
Status Affected:  
Encoding:  
Description:  
0 k 255  
k BSR  
None  
s
0 f 4095  
d
Operation:  
(f ) f  
s
d
Status Affected:  
None  
0000  
0001  
kkkk  
kkkk  
Encoding:  
1st word (source)  
2nd word (destin.)  
The eight-bit literal ‘k’ is loaded into the  
Bank Select Register (BSR). The value of  
BSR<7:4> always remains ‘0’, regardless  
1100  
1111  
ffff  
ffff  
ffff  
ffff  
ffffs  
ffffd  
Description:  
The contents of source register ‘f ’ are  
of the value of k :k .  
s
7 4  
moved to destination register ‘f ’.  
d
Words:  
Cycles:  
1
1
Location of source ‘f ’ can be anywhere  
s
in the 4096-byte data space (000h to  
FFFh) and location of destination ‘f ’  
can also be anywhere from 000h to  
FFFh.  
Either source or destination can be W  
(a useful special situation).  
d
Q Cycle Activity:  
Q1  
Q2  
Q3  
Q4  
Decode  
Read  
literal ‘k’  
Process  
Data  
Write literal  
‘k’ to BSR  
MOVFFis particularly useful for  
transferring a data memory location to a  
peripheral register (such as the transmit  
buffer or an I/O port).  
The MOVFFinstruction cannot use the  
PCL, TOSU, TOSH or TOSL as the  
destination register.  
Example:  
MOVLB  
5
Before Instruction  
BSR Register =  
After Instruction  
BSR Register =  
02h  
05h  
Words:  
Cycles:  
2
2 (3)  
Q Cycle Activity:  
Q1  
Q2  
Q3  
Q4  
Decode  
Read  
register ‘f’  
(src)  
Process  
Data  
No  
operation  
Decode  
No  
operation  
No  
operation  
Write  
register ‘f’  
(dest)  
No dummy  
read  
Example:  
MOVFF  
REG1, REG2  
Before Instruction  
REG1  
REG2  
=
=
33h  
11h  
After Instruction  
REG1  
REG2  
=
=
33h  
33h  
DS39689F-page 304  
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MOVLW  
Move Literal to W  
MOVWF  
Move W to f  
Syntax:  
MOVLW  
k
Syntax:  
MOVWF f {,a}  
Operands:  
Operation:  
Status Affected:  
Encoding:  
Description:  
Words:  
0 k 255  
k W  
None  
Operands:  
0 f 255  
a [0,1]  
Operation:  
(W) f  
Status Affected:  
Encoding:  
None  
0000  
1110  
kkkk  
kkkk  
0110  
111a  
ffff  
ffff  
The eight-bit literal ‘k’ is loaded into W.  
Description:  
Move data from W to register ‘f’.  
Location ‘f’ can be anywhere in the  
256-byte bank.  
1
1
Cycles:  
If ‘a’ is ‘0’, the Access Bank is selected.  
If ‘a’ is ‘1’, the BSR is used to select the  
GPR bank (default).  
If ‘a’ is ‘0’ and the extended instruction  
set is enabled, this instruction operates  
in Indexed Literal Offset Addressing  
mode whenever f 95 (5Fh). See  
Section 25.2.3 “Byte-Oriented and  
Bit-Oriented Instructions in Indexed  
Literal Offset Mode” for details.  
Q Cycle Activity:  
Q1  
Q2  
Q3  
Q4  
Decode  
Read  
literal ‘k’  
Process  
Data  
Write to W  
Example:  
MOVLW  
5Ah  
After Instruction  
W
=
5Ah  
Words:  
Cycles:  
1
1
Q Cycle Activity:  
Q1  
Q2  
Q3  
Q4  
Decode  
Read  
register ‘f’  
Process  
Data  
Write  
register ‘f’  
Example:  
MOVWF  
REG, 0  
Before Instruction  
W
REG  
=
=
4Fh  
FFh  
After Instruction  
W
REG  
=
=
4Fh  
4Fh  
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MULLW  
Multiply Literal with W  
MULWF  
Multiply W with f  
Syntax:  
MULLW  
k
Syntax:  
MULWF f {,a}  
Operands:  
Operation:  
Status Affected:  
Encoding:  
Description:  
0 k 255  
Operands:  
0 f 255  
a [0,1]  
(W) x k PRODH:PRODL  
Operation:  
(W) x (f) PRODH:PRODL  
None  
Status Affected:  
Encoding:  
None  
0000  
1101  
kkkk  
kkkk  
0000  
001a  
ffff  
ffff  
An unsigned multiplication is carried  
out between the contents of W and the  
8-bit literal ‘k’. The 16-bit result is  
placed in the PRODH:PRODL register  
pair. PRODH contains the high byte.  
W is unchanged.  
None of the Status flags are affected.  
Note that neither Overflow nor Carry is  
possible in this operation. A Zero result  
is possible but not detected.  
Description:  
An unsigned multiplication is carried  
out between the contents of W and the  
register file location ‘f’. The 16-bit  
result is stored in the PRODH:PRODL  
register pair. PRODH contains the  
high byte. Both W and ‘f’ are  
unchanged.  
None of the Status flags are affected.  
Note that neither Overflow nor Carry is  
possible in this operation. A Zero  
result is possible but not detected.  
If ‘a’ is ‘0’, the Access Bank is  
selected. If ‘a’ is ‘1’, the BSR is used  
to select the GPR bank (default).  
If ‘a’ is ‘0’ and the extended instruction  
set is enabled, this instruction  
operates in Indexed Literal Offset  
Addressing mode whenever  
Words:  
Cycles:  
1
1
Q Cycle Activity:  
Q1  
Q2  
Q3  
Q4  
Decode  
Read  
literal ‘k’  
Process  
Data  
Write  
registers  
PRODH:  
PRODL  
f 95 (5Fh). See Section 25.2.3  
“Byte-Oriented and Bit-Oriented  
Instructions in Indexed Literal Offset  
Mode” for details.  
Example:  
MULLW  
0C4h  
Before Instruction  
Words:  
Cycles:  
1
1
W
PRODH  
PRODL  
=
=
=
E2h  
?
?
Q Cycle Activity:  
Q1  
After Instruction  
W
Q2  
Q3  
Q4  
=
=
=
E2h  
ADh  
08h  
Decode  
Read  
register ‘f’  
Process  
Data  
Write  
PRODH  
PRODL  
registers  
PRODH:  
PRODL  
Example:  
MULWF  
REG, 1  
Before Instruction  
W
=
C4h  
REG  
PRODH  
PRODL  
=
=
=
B5h  
?
?
After Instruction  
W
=
C4h  
REG  
PRODH  
PRODL  
=
=
=
B5h  
8Ah  
94h  
DS39689F-page 306  
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NEGF  
Negate f  
NOP  
No Operation  
Syntax:  
NEGF f {,a}  
Syntax:  
NOP  
Operands:  
0 f 255  
a [0,1]  
Operands:  
Operation:  
Status Affected:  
Encoding:  
None  
No operation  
None  
Operation:  
(f) + 1f  
Status Affected:  
Encoding:  
N, OV, C, DC, Z  
0000  
1111  
0000  
xxxx  
0000  
xxxx  
0000  
xxxx  
0110  
110a  
ffff  
ffff  
Description:  
Location ‘f’ is negated using two’s  
complement. The result is placed in the  
data memory location ‘f’.  
If ‘a’ is ‘0’, the Access Bank is selected.  
If ‘a’ is ‘1’, the BSR is used to select the  
GPR bank (default).  
If ‘a’ is ‘0’ and the extended instruction  
set is enabled, this instruction operates  
in Indexed Literal Offset Addressing  
mode whenever f 95 (5Fh). See  
Section 25.2.3 “Byte-Oriented and  
Bit-Oriented Instructions in Indexed  
Literal Offset Mode” for details.  
Description:  
Words:  
No operation.  
1
1
Cycles:  
Q Cycle Activity:  
Q1  
Q2  
Q3  
No  
Q4  
Decode  
No  
operation  
No  
operation  
operation  
Example:  
None.  
Words:  
Cycles:  
1
1
Q Cycle Activity:  
Q1  
Q2  
Q3  
Q4  
Decode  
Read  
register ‘f’  
Process  
Data  
Write  
register ‘f’  
Example:  
NEGF  
REG, 1  
Before Instruction  
REG  
After Instruction  
REG  
=
0011 1010 [3Ah]  
1100 0110 [C6h]  
=
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POP  
Pop Top of Return Stack  
PUSH  
Push Top of Return Stack  
Syntax:  
POP  
Syntax:  
PUSH  
Operands:  
Operation:  
Status Affected:  
Encoding:  
Description:  
None  
Operands:  
Operation:  
Status Affected:  
Encoding:  
Description:  
None  
(TOS) bit bucket  
(PC + 2) TOS  
None  
None  
0000  
0000  
0000  
0110  
0000  
0000  
0000  
0101  
The TOS value is pulled off the return  
stack and is discarded. The TOS value  
then becomes the previous value that  
was pushed onto the return stack.  
This instruction is provided to enable  
the user to properly manage the return  
stack to incorporate a software stack.  
The PC + 2 is pushed onto the top of  
the return stack. The previous TOS  
value is pushed down on the stack.  
This instruction allows implementing a  
software stack by modifying TOS and  
then pushing it onto the return stack.  
Words:  
Cycles:  
1
1
Words:  
Cycles:  
1
1
Q Cycle Activity:  
Q1  
Q Cycle Activity:  
Q1  
Q2  
Q3  
Q4  
Q2  
Q3  
Q4  
Decode  
PUSH  
No  
No  
Decode  
No  
operation  
POP TOS  
value  
No  
operation  
PC + 2 onto  
return stack  
operation  
operation  
Example:  
POP  
Example:  
PUSH  
GOTO  
NEW  
Before Instruction  
Before Instruction  
TOS  
Stack (1 level down)  
TOS  
PC  
=
=
345Ah  
0124h  
=
=
0031A2h  
014332h  
After Instruction  
After Instruction  
PC  
=
=
=
0126h  
0126h  
345Ah  
TOS  
TOS  
PC  
=
=
014332h  
NEW  
Stack (1 level down)  
DS39689F-page 308  
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RCALL  
Relative Call  
RESET  
Reset  
Syntax:  
RCALL  
n
Syntax:  
RESET  
None  
Operands:  
Operation:  
-1024 n 1023  
Operands:  
Operation:  
(PC) + 2 TOS,  
(PC) + 2 + 2n PC  
Reset all registers and flags that are  
affected by a MCLR Reset.  
Status Affected:  
Encoding:  
None  
Status Affected:  
Encoding:  
All  
1101  
1nnn  
nnnn  
nnnn  
0000  
0000  
1111  
1111  
Description:  
Subroutine call with a jump up to 1K  
from the current location. First, return  
address (PC + 2) is pushed onto the  
stack. Then, add the 2’s complement  
number ‘2n’ to the PC. Since the PC will  
have incremented to fetch the next  
instruction, the new address will be  
PC + 2 + 2n. This instruction is a  
two-cycle instruction.  
Description:  
This instruction provides a way to  
execute a MCLR Reset in software.  
Words:  
Cycles:  
1
1
Q Cycle Activity:  
Q1  
Q2  
Q3  
Q4  
Decode  
Start  
No  
No  
Reset  
operation  
operation  
Words:  
Cycles:  
1
2
Example:  
RESET  
Q Cycle Activity:  
Q1  
After Instruction  
Registers =  
Q2  
Q3  
Q4  
Reset Value  
Reset Value  
Flags*  
=
Decode  
Read literal  
‘n’  
Process  
Data  
Write to  
PC  
PUSH PC  
to stack  
No  
No  
No  
No  
operation  
operation  
operation  
operation  
Example:  
HERE  
RCALL Jump  
Before Instruction  
PC  
After Instruction  
PC  
TOS =  
=
Address (HERE)  
=
Address (Jump)  
Address (HERE + 2)  
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RETFIE  
Return from Interrupt  
RETLW  
Return Literal to W  
Syntax:  
RETFIE {s}  
Syntax:  
RETLW k  
Operands:  
Operation:  
s [0,1]  
Operands:  
Operation:  
0 k 255  
(TOS) PC,  
k W,  
1GIE/GIEH or PEIE/GIEL;  
if s = 1,  
(TOS) PC,  
PCLATU, PCLATH are unchanged  
(WS) W,  
(STATUSS) STATUS,  
(BSRS) BSR,  
Status Affected:  
Encoding:  
None  
0000  
1100  
kkkk  
kkkk  
PCLATU, PCLATH are unchanged  
Description:  
W is loaded with the eight-bit literal ‘k’.  
The program counter is loaded from the  
top of the stack (the return address).  
The high address latch (PCLATH)  
remains unchanged.  
Status Affected:  
Encoding:  
GIE/GIEH, PEIE/GIEL  
0000  
0000  
0001  
000s  
Description:  
Return from interrupt. Stack is popped  
and Top-of-Stack (TOS) is loaded into  
the PC. Interrupts are enabled by  
setting either the high or low-priority  
global interrupt enable bit. If ‘s’ = 1, the  
contents of the shadow registers, WS,  
STATUSS and BSRS, are loaded into  
their corresponding registers, W,  
Words:  
Cycles:  
1
2
Q Cycle Activity:  
Q1  
Q2  
Q3  
Q4  
Decode  
Read  
literal ‘k’  
Process  
Data  
POP PC  
from stack,  
Write to W  
STATUS and BSR. If ‘s’ = 0, no update  
of these registers occurs (default).  
No  
operation  
No  
operation  
No  
operation  
No  
operation  
Words:  
Cycles:  
1
2
Q Cycle Activity:  
Q1  
Example:  
Q2  
Q3  
Q4  
CALL TABLE ; W contains table  
; offset value  
Decode  
No  
operation  
No  
operation  
POP PC  
from stack  
; W now has  
; table value  
Set GIEH or  
GIEL  
:
No  
operation  
No  
operation  
No  
operation  
No  
operation  
TABLE  
ADDWF PCL ; W = offset  
RETLW k0  
RETLW k1  
; Begin table  
;
Example:  
RETFIE  
1
:
:
After Interrupt  
PC  
W
=
=
=
=
=
TOS  
WS  
RETLW kn  
; End of table  
BSR  
STATUS  
GIE/GIEH, PEIE/GIEL  
BSRS  
STATUSS  
1
Before Instruction  
W
=
07h  
After Instruction  
W
=
value of kn  
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RETURN  
Return from Subroutine  
RLCF  
Rotate Left f through Carry  
Syntax:  
RETURN {s}  
Syntax:  
RLCF f {,d {,a}}  
Operands:  
Operation:  
s [0,1]  
Operands:  
0 f 255  
d [0,1]  
a [0,1]  
(TOS) PC;  
if s = 1,  
(WS) W,  
Operation:  
(f<n>) dest<n + 1>,  
(f<7>) C,  
(C) dest<0>  
(STATUSS) STATUS,  
(BSRS) BSR,  
PCLATU, PCLATH are unchanged  
Status Affected:  
Encoding:  
C, N, Z  
Status Affected:  
Encoding:  
None  
0011  
01da  
ffff  
ffff  
0000  
0000  
0001  
001s  
Description:  
The contents of register ‘f’ are rotated  
one bit to the left through the Carry  
flag. If ‘d’ is ‘0’, the result is placed in  
W. If ‘d’ is ‘1’, the result is stored back  
in register ‘f’ (default).  
If ‘a’ is ‘0’, the Access Bank is  
selected. If ‘a’ is ‘1’, the BSR is used to  
select the GPR bank (default).  
If ‘a’ is ‘0’ and the extended instruction  
set is enabled, this instruction  
operates in Indexed Literal Offset  
Addressing mode whenever  
Description:  
Return from subroutine. The stack is  
popped and the top of the stack (TOS)  
is loaded into the program counter. If  
‘s’= 1, the contents of the shadow  
registers, WS, STATUSS and BSRS,  
are loaded into their corresponding  
registers, W, STATUS and BSR. If  
‘s’ = 0, no update of these registers  
occurs (default).  
Words:  
Cycles:  
1
2
f 95 (5Fh). See Section 25.2.3  
“Byte-Oriented and Bit-Oriented  
Instructions in Indexed Literal Offset  
Mode” for details.  
Q Cycle Activity:  
Q1  
Q2  
Q3  
Q4  
Decode  
No  
operation  
Process  
Data  
POP PC  
from stack  
register f  
C
No  
No  
No  
No  
Words:  
Cycles:  
1
1
operation  
operation  
operation  
operation  
Q Cycle Activity:  
Q1  
Example:  
RETURN  
Q2  
Q3  
Q4  
After Instruction:  
PC = TOS  
Decode  
Read  
register ‘f’  
Process  
Data  
Write to  
destination  
Example:  
RLCF  
REG, 0, 0  
Before Instruction  
REG  
C
=
=
1110 0110  
0
After Instruction  
REG  
=
1110 0110  
W
C
=
=
1100 1100  
1
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RLNCF  
Rotate Left f (No Carry)  
RRCF  
Rotate Right f through Carry  
Syntax:  
RLNCF f {,d {,a}}  
Syntax:  
RRCF f {,d {,a}}  
Operands:  
0 f 255  
d [0,1]  
a [0,1]  
Operands:  
0 f 255  
d [0,1]  
a [0,1]  
Operation:  
(f<n>) dest<n + 1>,  
(f<7>) dest<0>  
Operation:  
(f<n>) dest<n – 1>,  
(f<0>) C,  
(C) dest<7>  
Status Affected:  
Encoding:  
N, Z  
Status Affected:  
Encoding:  
C, N, Z  
0100  
01da  
ffff  
ffff  
0011  
00da  
ffff  
ffff  
Description:  
The contents of register ‘f’ are rotated  
one bit to the left. If ‘d’ is ‘0’, the result  
is placed in W. If ‘d’ is ‘1’, the result is  
stored back in register ‘f’ (default).  
If ‘a’ is ‘0’, the Access Bank is selected.  
If ‘a’ is ‘1’, the BSR is used to select the  
GPR bank (default).  
If ‘a’ is ‘0’ and the extended instruction  
set is enabled, this instruction operates  
in Indexed Literal Offset Addressing  
mode whenever f 95 (5Fh). See  
Section 25.2.3 “Byte-Oriented and  
Bit-Oriented Instructions in Indexed  
Literal Offset Mode” for details.  
Description:  
The contents of register ‘f’ are rotated  
one bit to the right through the Carry  
flag. If ‘d’ is ‘0’, the result is placed in W.  
If ‘d’ is ‘1’, the result is placed back in  
register ‘f’ (default).  
If ‘a’ is ‘0’, the Access Bank is selected.  
If ‘a’ is ‘1’, the BSR is used to select the  
GPR bank (default).  
If ‘a’ is ‘0’ and the extended instruction  
set is enabled, this instruction operates  
in Indexed Literal Offset Addressing  
mode whenever f 95 (5Fh). See  
Section 25.2.3 “Byte-Oriented and  
Bit-Oriented Instructions in Indexed  
Literal Offset Mode” for details.  
register f  
register f  
C
Words:  
Cycles:  
1
1
Words:  
Cycles:  
1
1
Q Cycle Activity:  
Q1  
Q2  
Q3  
Q4  
Q Cycle Activity:  
Q1  
Decode  
Read  
register ‘f’  
Process  
Data  
Write to  
destination  
Q2  
Q3  
Q4  
Decode  
Read  
register ‘f’  
Process  
Data  
Write to  
destination  
Example:  
RLNCF  
REG, 1, 0  
Before Instruction  
REG  
After Instruction  
Example:  
RRCF  
REG, 0, 0  
=
1010 1011  
0101 0111  
Before Instruction  
REG  
=
REG  
C
=
=
1110 0110  
0
After Instruction  
REG  
=
1110 0110  
W
C
=
=
0111 0011  
0
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RRNCF  
Rotate Right f (No Carry)  
SETF  
Set f  
Syntax:  
RRNCF f {,d {,a}}  
Syntax:  
SETF f {,a}  
Operands:  
0 f 255  
d [0,1]  
a [0,1]  
Operands:  
0 f 255  
a [0,1]  
Operation:  
FFh f  
Operation:  
(f<n>) dest<n – 1>,  
(f<0>) dest<7>  
Status Affected:  
Encoding:  
None  
0110  
100a  
ffff  
ffff  
Status Affected:  
Encoding:  
N, Z  
Description:  
The contents of the specified register  
are set to FFh.  
0100  
00da  
ffff  
ffff  
Description:  
The contents of register ‘f’ are rotated  
one bit to the right. If ‘d’ is ‘0’, the result  
is placed in W. If ‘d’ is ‘1’, the result is  
placed back in register ‘f’ (default).  
If ‘a’ is ‘0’, the Access Bank will be  
selected, overriding the BSR value. If ‘a’  
is ‘1’, then the bank will be selected as  
per the BSR value (default).  
If ‘a’ is ‘0’ and the extended instruction  
set is enabled, this instruction operates  
in Indexed Literal Offset Addressing  
mode whenever f 95 (5Fh). See  
Section 25.2.3 “Byte-Oriented and  
Bit-Oriented Instructions in Indexed  
Literal Offset Mode” for details.  
If ‘a’ is ‘0’, the Access Bank is selected.  
If ‘a’ is ‘1’, the BSR is used to select the  
GPR bank (default).  
If ‘a’ is ‘0’ and the extended instruction  
set is enabled, this instruction operates  
in Indexed Literal Offset Addressing  
mode whenever f 95 (5Fh). See  
Section 25.2.3 “Byte-Oriented and  
Bit-Oriented Instructions in Indexed  
Literal Offset Mode” for details.  
Words:  
Cycles:  
1
1
Q Cycle Activity:  
Q1  
Q2  
Q3  
Q4  
register f  
Decode  
Read  
register ‘f’  
Process  
Data  
Write  
register ‘f’  
Words:  
Cycles:  
1
1
Example:  
SETF  
REG, 1  
Q Cycle Activity:  
Q1  
Before Instruction  
REG  
After Instruction  
REG  
=
=
5Ah  
FFh  
Q2  
Q3  
Q4  
Decode  
Read  
register ‘f’  
Process  
Data  
Write to  
destination  
Example 1:  
RRNCF  
REG, 1, 0  
Before Instruction  
REG  
After Instruction  
REG  
=
1101 0111  
1110 1011  
RRNCF REG, 0, 0  
=
Example 2:  
Before Instruction  
W
REG  
=
=
?
1101 0111  
After Instruction  
W
REG  
=
=
1110 1011  
1101 0111  
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SLEEP  
Enter Sleep mode  
SUBFWB  
Subtract f from W with Borrow  
Syntax:  
SLEEP  
None  
Syntax:  
SUBFWB f {,d {,a}}  
Operands:  
Operation:  
Operands:  
0 f 255  
d [0,1]  
a [0,1]  
00h WDT,  
0WDT postscaler,  
1TO,  
Operation:  
(W) – (f) – (C) dest  
0PD  
Status Affected:  
Encoding:  
N, OV, C, DC, Z  
Status Affected:  
Encoding:  
TO, PD  
0101  
01da  
ffff  
ffff  
0000  
0000  
0000  
0011  
Description:  
Subtract register ‘f’ and Carry flag  
(borrow) from W (2’s complement  
method). If ‘d’ is ‘0’, the result is stored  
in W. If ‘d’ is ‘1’, the result is stored in  
register ‘f’ (default).  
Description:  
The Power-Down status bit (PD) is  
cleared. The Time-out status bit (TO)  
is set. Watchdog Timer and its  
postscaler are cleared.  
The processor is put into Sleep mode  
with the oscillator stopped.  
If ‘a’ is ‘0’, the Access Bank is selected.  
If ‘a’ is ‘1’, the BSR is used to select the  
GPR bank (default).  
If ‘a’ is ‘0’ and the extended instruction  
set is enabled, this instruction operates  
in Indexed Literal Offset Addressing  
mode whenever f 95 (5Fh). See  
Section 25.2.3 “Byte-Oriented and  
Bit-Oriented Instructions in Indexed  
Literal Offset Mode” for details.  
Words:  
Cycles:  
1
1
Q Cycle Activity:  
Q1  
Q2  
Q3  
Q4  
Decode  
No  
operation  
Process  
Data  
Go to  
Sleep  
Words:  
Cycles:  
1
1
Example:  
SLEEP  
Before Instruction  
Q Cycle Activity:  
Q1  
TO  
PD  
=
=
?
?
Q2  
Q3  
Q4  
Decode  
Read  
register ‘f’  
Process  
Data  
Write to  
destination  
After Instruction  
TO  
PD  
=
=
1†  
0
Example 1:  
SUBFWB  
REG, 1, 0  
Before Instruction  
If WDT causes wake-up, this bit is cleared.  
REG  
W
=
3
2
1
=
=
C
After Instruction  
REG  
W
C
=
FF  
2
=
=
=
=
0
Z
0
1
N
; result is negative  
Example 2:  
Before Instruction  
SUBFWB  
REG, 0, 0  
REG  
W
=
=
=
2
5
1
C
After Instruction  
REG  
W
C
=
2
3
1
0
=
=
=
=
Z
N
0
; result is positive  
Example 3:  
SUBFWB  
REG, 1, 0  
Before Instruction  
REG  
W
=
=
=
1
2
0
C
After Instruction  
REG  
W
C
=
0
2
1
1
0
=
=
=
=
Z
; result is zero  
N
DS39689F-page 314  
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SUBLW  
Subtract W from Literal  
SUBWF  
Subtract W from f  
Syntax:  
SUBLW  
k
Syntax:  
SUBWF f {,d {,a}}  
Operands:  
Operation:  
Status Affected:  
Encoding:  
Description  
0 k 255  
Operands:  
0 f 255  
d [0,1]  
a [0,1]  
k – (W) W  
N, OV, C, DC, Z  
Operation:  
(f) – (W) dest  
0000  
1000  
kkkk  
kkkk  
Status Affected:  
Encoding:  
N, OV, C, DC, Z  
W is subtracted from the eight-bit  
literal ‘k’. The result is placed in W.  
0101  
11da  
ffff  
ffff  
Description:  
Subtract W from register ‘f’ (2’s  
complement method). If ‘d’ is ‘0’, the  
result is stored in W. If ‘d’ is ‘1’, the  
result is stored back in register ‘f’  
(default).  
Words:  
1
1
Cycles:  
Q Cycle Activity:  
Q1  
Q2  
Q3  
Q4  
If ‘a’ is ‘0’, the Access Bank is  
selected. If ‘a’ is ‘1’, the BSR is used  
to select the GPR bank (default).  
If ‘a’ is ‘0’ and the extended instruction  
set is enabled, this instruction  
operates in Indexed Literal Offset  
Addressing mode whenever  
f 95 (5Fh). See Section 25.2.3  
“Byte-Oriented and Bit-Oriented  
Instructions in Indexed Literal Offset  
Mode” for details.  
Decode  
Read  
literal ‘k’  
Process  
Data  
Write to W  
Example 1:  
SUBLW 02h  
Before Instruction  
W
C
=
=
01h  
?
After Instruction  
W
C
Z
=
01h  
=
=
=
1
0
0
; result is positive  
N
Words:  
Cycles:  
1
1
Example 2:  
SUBLW 02h  
Before Instruction  
Q Cycle Activity:  
Q1  
W
C
=
=
02h  
?
Q2  
Q3  
Q4  
After Instruction  
Decode  
Read  
register ‘f’  
Process  
Data  
Write to  
destination  
W
C
Z
=
00h  
=
=
=
1
1
0
; result is zero  
N
Example 1:  
SUBWF  
REG, 1, 0  
Before Instruction  
Example 3:  
SUBLW 02h  
REG  
W
C
=
3
2
?
Before Instruction  
=
=
W
C
=
=
03h  
?
After Instruction  
After Instruction  
REG  
W
C
=
1
2
1
0
0
W
C
Z
=
FFh ; (2’s complement)  
=
=
=
=
=
=
=
0
0
1
; result is negative  
; result is positive  
Z
N
N
Example 2:  
Before Instruction  
SUBWF  
REG, 0, 0  
REG  
W
=
=
=
2
2
?
C
After Instruction  
REG  
W
C
=
2
0
1
1
0
=
=
=
=
; result is zero  
Z
N
Example 3:  
Before Instruction  
SUBWF  
REG, 1, 0  
REG  
W
=
=
=
1
2
?
C
After Instruction  
REG  
W
C
=
FFh ;(2’s complement)  
2
0
0
1
=
=
=
=
; result is negative  
Z
N
© 2009 Microchip Technology Inc.  
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SUBWFB  
Subtract W from f with Borrow  
SWAPF  
Swap f  
SUBWFB f {,d {,a}}  
Syntax:  
Syntax:  
SWAPF f {,d {,a}}  
Operands:  
0 f 255  
d [0,1]  
a [0,1]  
Operands:  
0 f 255  
d [0,1]  
a [0,1]  
Operation:  
(f) – (W) – (C) dest  
Operation:  
(f<3:0>) dest<7:4>,  
(f<7:4>) dest<3:0>  
Status Affected:  
Encoding:  
N, OV, C, DC, Z  
0101  
10da  
ffff  
ffff  
Status Affected:  
Encoding:  
None  
Description:  
Subtract W and the Carry flag (borrow)  
from register ‘f’ (2’s complement  
method). If ‘d’ is ‘0’, the result is stored  
in W. If ‘d’ is ‘1’, the result is stored back  
in register ‘f’ (default).  
If ‘a’ is ‘0’, the Access Bank is selected.  
If ‘a’ is ‘1’, the BSR is used to select the  
GPR bank (default).  
If ‘a’ is ‘0’ and the extended instruction  
set is enabled, this instruction operates  
in Indexed Literal Offset Addressing  
mode whenever f 95 (5Fh). See  
Section 25.2.3 “Byte-Oriented and  
Bit-Oriented Instructions in Indexed  
Literal Offset Mode” for details.  
0011  
10da  
ffff  
ffff  
Description:  
The upper and lower nibbles of register  
‘f’ are exchanged. If ‘d’ is ‘0’, the result  
is placed in W. If ‘d’ is ‘1’, the result is  
placed in register ‘f’ (default).  
If ‘a’ is ‘0’, the Access Bank is selected.  
If ‘a’ is ‘1’, the BSR is used to select the  
GPR bank (default).  
If ‘a’ is ‘0’ and the extended instruction  
set is enabled, this instruction operates  
in Indexed Literal Offset Addressing  
mode whenever f 95 (5Fh). See  
Section 25.2.3 “Byte-Oriented and  
Bit-Oriented Instructions in Indexed  
Literal Offset Mode” for details.  
Words:  
Cycles:  
1
1
Words:  
1
1
Cycles:  
Q Cycle Activity:  
Q1  
Q Cycle Activity:  
Q1  
Q2  
Q3  
Q4  
Q2  
Q3  
Q4  
Decode  
Read  
register ‘f’  
Process  
Data  
Write to  
destination  
Decode  
Read  
register ‘f’  
Process  
Data  
Write to  
destination  
Example 1:  
SUBWFB REG, 1, 0  
Before Instruction  
REG  
W
=
=
=
19h  
0Dh  
1
(0001 1001)  
(0000 1101)  
Example:  
SWAPF  
REG, 1, 0  
C
Before Instruction  
After Instruction  
REG  
=
53h  
35h  
REG  
W
C
=
0Ch  
0Dh  
1
(0000 1011)  
(0000 1101)  
After Instruction  
=
=
=
=
REG  
=
Z
0
N
0
; result is positive  
Example 2:  
Before Instruction  
SUBWFB REG, 0, 0  
REG  
W
=
=
=
1Bh  
1Ah  
0
(0001 1011)  
(0001 1010)  
C
After Instruction  
REG  
W
C
=
1Bh  
00h  
1
(0001 1011)  
=
=
=
=
Z
1
; result is zero  
N
0
Example 3:  
Before Instruction  
SUBWFB REG, 1, 0  
REG  
W
=
=
=
03h  
0Eh  
1
(0000 0011)  
(0000 1101)  
C
After Instruction  
REG  
=
F5h  
(1111 0100)  
; [2’s comp]  
W
C
Z
=
=
=
=
0Eh  
0
0
1
(0000 1101)  
N
; result is negative  
DS39689F-page 316  
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TBLRD  
Table Read  
TBLRD  
Table Read (Continued)  
Syntax:  
TBLRD ( *; *+; *-; +*)  
None  
Example 1:  
TBLRD *+ ;  
Operands:  
Operation:  
Before Instruction  
TABLAT  
TBLPTR  
MEMORY (00A356h)  
=
=
=
55h  
00A356h  
34h  
if TBLRD *,  
(Prog Mem (TBLPTR)) TABLAT,  
TBLPTR – No Change;  
if TBLRD *+,  
(Prog Mem (TBLPTR)) TABLAT,  
(TBLPTR) + 1TBLPTR;  
if TBLRD *-,  
(Prog Mem (TBLPTR)) TABLAT,  
(TBLPTR) – 1TBLPTR;  
if TBLRD +*,  
(TBLPTR) + 1TBLPTR,  
(Prog Mem (TBLPTR)) TABLAT  
After Instruction  
TABLAT  
TBLPTR  
=
=
34h  
00A357h  
Example 2:  
TBLRD +* ;  
Before Instruction  
TABLAT  
TBLPTR  
MEMORY (01A357h)  
MEMORY (01A358h)  
After Instruction  
=
=
=
=
AAh  
01A357h  
12h  
34h  
TABLAT  
TBLPTR  
=
=
34h  
01A358h  
Status Affected: None  
Encoding:  
0000  
0000  
0000  
10nn  
nn=0 *  
=1 *+  
=2 *-  
=3 +*  
Description:  
This instruction is used to read the contents  
of Program Memory (P.M.). To address the  
program memory, a pointer called Table  
Pointer (TBLPTR) is used.  
The TBLPTR (a 21-bit pointer) points to  
each byte in the program memory. TBLPTR  
has a 2-Mbyte address range.  
TBLPTR[0] = 0: Least Significant Byte of  
Program Memory Word  
TBLPTR[0] = 1: Most Significant Byte of  
Program Memory Word  
The TBLRDinstruction can modify the value  
of TBLPTR as follows:  
no change  
post-increment  
post-decrement  
pre-increment  
Words:  
Cycles:  
1
2
Q Cycle Activity:  
Q1  
Q2  
Q3  
Q4  
Decode  
No  
No  
No  
operation  
operation  
operation  
No  
No operation  
No  
No operation  
(Write  
TABLAT)  
operation (Read Program operation  
Memory)  
© 2009 Microchip Technology Inc.  
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TBLWT  
Table Write  
TBLWT  
Table Write (Continued)  
Syntax:  
TBLWT ( *; *+; *-; +*)  
None  
Example 1:  
TBLWT *+;  
Operands:  
Operation:  
Before Instruction  
if TBLWT*,  
TABLAT  
TBLPTR  
HOLDING REGISTER  
(00A356h)  
=
=
55h  
00A356h  
(TABLAT) Holding Register,  
TBLPTR – No Change;  
if TBLWT*+,  
(TABLAT) Holding Register,  
(TBLPTR) + 1TBLPTR;  
if TBLWT*-,  
(TABLAT) Holding Register,  
(TBLPTR) – 1TBLPTR;  
if TBLWT+*,  
(TBLPTR) + 1TBLPTR,  
(TABLAT) Holding Register  
=
FFh  
After Instructions (table write completion)  
TABLAT  
TBLPTR  
HOLDING REGISTER  
(00A356h)  
=
=
55h  
00A357h  
=
55h  
Example 2:  
TBLWT +*;  
Before Instruction  
TABLAT  
TBLPTR  
HOLDING REGISTER  
(01389Ah)  
HOLDING REGISTER  
(01389Bh)  
=
=
34h  
01389Ah  
Status Affected: None  
=
FFh  
Encoding:  
0000  
0000  
0000  
11nn  
nn=0 *  
=1 *+  
=2 *-  
=3 +*  
=
FFh  
After Instruction (table write completion)  
TABLAT  
TBLPTR  
HOLDING REGISTER  
(01389Ah)  
HOLDING REGISTER  
(01389Bh)  
=
=
34h  
01389Bh  
Description:  
This instruction uses the 3 LSBs of  
TBLPTR to determine which of the  
8 holding registers the TABLAT is written  
to. The holding registers are used to  
program the contents of Program  
Memory (P.M.). (Refer to Section 7.0  
“Flash Program Memory” for additional  
details on programming Flash memory.)  
The TBLPTR (a 21-bit pointer) points to  
each byte in the program memory.  
TBLPTR has a 2-Mbyte address range.  
The LSb of the TBLPTR selects which  
byte of the program memory location to  
access.  
=
=
FFh  
34h  
TBLPTR[0] = 0: Least Significant Byte  
of Program Memory  
Word  
TBLPTR[0] = 1: Most Significant Byte  
of Program Memory  
Word  
The TBLWT instruction can modify the  
value of TBLPTR as follows:  
no change  
post-increment  
post-decrement  
pre-increment  
Words:  
1
2
Cycles:  
Q Cycle Activity:  
Q1  
Q2  
No  
Q3  
No  
Q4  
No  
Decode  
operation operation operation  
No  
No No No  
operation operation operation operation  
(Read  
TABLAT)  
(Write to  
Holding  
Register )  
DS39689F-page 318  
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TSTFSZ  
Test f, Skip if 0  
XORLW  
Exclusive OR Literal with W  
Syntax:  
TSTFSZ f {,a}  
Syntax:  
XORLW k  
Operands:  
0f 255  
a [0,1]  
Operands:  
Operation:  
Status Affected:  
Encoding:  
Description:  
0 k 255  
(W) .XOR. k W  
N, Z  
Operation:  
skip if f = 0  
Status Affected:  
Encoding:  
None  
0000  
1010  
kkkk  
kkkk  
0110  
011a  
ffff  
ffff  
The contents of W are XORed with  
the 8-bit literal ‘k’. The result is placed  
in W.  
Description:  
If ‘f’ = 0, the next instruction fetched  
during the current instruction execution  
is discarded and a NOPis executed,  
making this a two-cycle instruction.  
If ‘a’ is ‘0’, the Access Bank is selected.  
If ‘a’ is ‘1’, the BSR is used to select the  
GPR bank (default).  
If ‘a’ is ‘0’ and the extended instruction  
set is enabled, this instruction operates  
in Indexed Literal Offset Addressing  
mode whenever f 95 (5Fh). See  
Section 25.2.3 “Byte-Oriented and  
Bit-Oriented Instructions in Indexed  
Literal Offset Mode” for details.  
Words:  
1
1
Cycles:  
Q Cycle Activity:  
Q1  
Q2  
Q3  
Q4  
Decode  
Read  
literal ‘k’  
Process  
Data  
Write to W  
Example:  
XORLW  
0AFh  
Before Instruction  
W
=
B5h  
1Ah  
Words:  
Cycles:  
1
After Instruction  
1(2)  
W
=
Note: 3 cycles if skip and followed  
by a 2-word instruction.  
Q Cycle Activity:  
Q1  
Q2  
Q3  
Q4  
Decode  
Read  
register ‘f’  
Process  
Data  
No  
operation  
If skip:  
Q1  
Q2  
Q3  
Q4  
No  
No  
No  
No  
operation  
operation  
operation  
operation  
If skip and followed by 2-word instruction:  
Q1  
Q2  
Q3  
Q4  
No  
No  
No  
No  
operation  
operation  
operation  
operation  
No  
No  
No  
No  
operation  
operation  
operation  
operation  
Example:  
HERE  
NZERO  
ZERO  
TSTFSZ CNT, 1  
:
:
Before Instruction  
PC  
=
Address (HERE)  
After Instruction  
If CNT  
PC  
If CNT  
PC  
=
=
=
00h,  
Address (ZERO)  
00h,  
Address (NZERO)  
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XORWF  
Exclusive OR W with f  
Syntax:  
XORWF f {,d {,a}}  
Operands:  
0 f 255  
d [0,1]  
a [0,1]  
Operation:  
(W) .XOR. (f) dest  
Status Affected:  
Encoding:  
N, Z  
0001  
10da  
ffff  
ffff  
Description:  
Exclusive OR the contents of W with  
register ‘f’. If ‘d’ is ‘0’, the result is stored  
in W. If ‘d’ is ‘1’, the result is stored back  
in the register ‘f’ (default).  
If ‘a’ is ‘0’, the Access Bank is selected.  
If ‘a’ is ‘1’, the BSR is used to select the  
GPR bank (default).  
If ‘a’ is ‘0’ and the extended instruction  
set is enabled, this instruction operates  
in Indexed Literal Offset Addressing  
mode whenever f 95 (5Fh). See  
Section 25.2.3 “Byte-Oriented and  
Bit-Oriented Instructions in Indexed  
Literal Offset Mode” for details.  
Words:  
1
1
Cycles:  
Q Cycle Activity:  
Q1  
Q2  
Q3  
Q4  
Decode  
Read  
register ‘f’  
Process  
Data  
Write to  
destination  
Example:  
XORWF  
REG, 1, 0  
Before Instruction  
REG  
W
=
=
AFh  
B5h  
After Instruction  
REG  
W
=
=
1Ah  
B5h  
DS39689F-page 320  
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A summary of the instructions in the extended instruction  
25.2 Extended Instruction Set  
set is provided in Table 25-3. Detailed descriptions are  
provided in Section 25.2.2 “Extended Instruction  
Set”. The opcode field descriptions in Table 25-1  
(page 280) apply to both the standard and extended  
PIC18 instruction sets.  
In addition to the standard 75 instructions of the PIC18  
instruction set, PIC18F2221/2321/4221/4321 family  
devices also provide an optional extension to the core  
CPU functionality. The added features include eight  
additional instructions that augment indirect and  
indexed addressing operations and the implementation  
of Indexed Literal Offset Addressing mode for many of  
the standard PIC18 instructions.  
Note:  
The instruction set extension and the  
Indexed Literal Offset Addressing mode  
were designed for optimizing applications  
written in C; the user may likely never use  
these instructions directly in the assembler.  
The syntax for these commands is  
provided as a reference for users who may  
be reviewing code that has been generated  
by a compiler.  
The additional features of the extended instruction set  
are disabled by default. To enable them, users must set  
the XINST Configuration bit.  
The instructions in the extended set (with the exception  
of CALLW, MOVSFand MOVSS) can all be classified as  
literal operations, which either manipulate the File  
Select Registers, or use them for indexed addressing.  
Two of the instructions, ADDFSR and SUBFSR, each  
have an additional special instantiation for using FSR2.  
These versions (ADDULNK and SUBULNK) allow for  
automatic return after execution.  
25.2.1  
EXTENDED INSTRUCTION SYNTAX  
Most of the extended instructions use indexed  
arguments, using one of the File Select Registers and  
some offset to specify a source or destination register.  
When an argument for an instruction serves as part of  
indexed addressing, it is enclosed in square brackets  
(“[ ]”). This is done to indicate that the argument is used  
as an index or offset. The MPASM™ Assembler will  
flag an error if it determines that an index or offset value  
is not bracketed.  
The extended instructions are specifically implemented  
to optimize re-entrant program code (that is, code that  
is recursive or that uses a software stack) written in  
high-level languages, particularly C. Among other  
things, they allow users working in high-level  
languages to perform certain operations on data  
structures more efficiently. These include:  
When the extended instruction set is enabled, brackets  
are also used to indicate index arguments in byte-  
oriented and bit-oriented instructions. This is in addition  
to other changes in their syntax. For more details, see  
Section 25.2.3.1 “Extended Instruction Syntax with  
Standard PIC18 Commands”.  
• Dynamic allocation and deallocation of software  
stack space when entering and leaving  
subroutines  
• Function Pointer invocation  
• Software Stack Pointer manipulation  
Note:  
In the past, square brackets have been  
used to denote optional arguments in the  
PIC18 and earlier instruction sets. In this  
text and going forward, optional  
arguments are denoted by braces (“{ }”).  
• Manipulation of variables located in a software  
stack  
TABLE 25-3: EXTENSIONS TO THE PIC18 INSTRUCTION SET  
16-Bit Instruction Word  
MSb LSb  
Mnemonic,  
Operands  
Status  
Affected  
Description  
Cycles  
ADDFSR  
ADDULNK  
CALLW  
f, k  
k
Add Literal to FSR  
Add Literal to FSR2 and Return  
Call Subroutine using WREG  
1
2
2
2
1110 1000 ffkk kkkk  
1110 1000 11kk kkkk  
0000 0000 0001 0100  
1110 1011 0zzz zzzz  
1111 ffff ffff ffff  
1110 1011 1zzz zzzz  
1111 xxxx xzzz zzzz  
1110 1010 kkkk kkkk  
None  
None  
None  
None  
MOVSF  
zs, fd Move zs (source) to 1st Word  
fd (destination) 2nd Word  
zs, zd Move zs (source) to 1st word  
zd (destination) 2nd Word  
MOVSS  
PUSHL  
2
1
None  
None  
k
Store Literal at FSR2,  
Decrement FSR2  
SUBFSR  
SUBULNK  
f, k  
k
Subtract Literal from FSR  
Subtract Literal from FSR2 and  
Return  
1
2
1110 1001 ffkk kkkk  
1110 1001 11kk kkkk  
None  
None  
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25.2.2  
EXTENDED INSTRUCTION SET  
ADDFSR  
Add Literal to FSR  
ADDULNK  
Add Literal to FSR2 and Return  
Syntax:  
ADDFSR f, k  
Syntax:  
ADDULNK k  
Operands:  
0 k 63  
f [ 0, 1, 2 ]  
Operands:  
Operation:  
0 k 63  
FSR2 + k FSR2,  
(TOS) PC  
Operation:  
FSR(f) + k FSR(f)  
Status Affected:  
Encoding:  
None  
Status Affected: None  
1110  
1000  
ffkk  
kkkk  
Encoding:  
1110 1000  
11kk  
kkkk  
Description:  
The 6-bit literal ‘k’ is added to the  
contents of the FSR specified by ‘f’.  
Description:  
The 6-bit literal ‘k’ is added to the  
contents of FSR2. A RETURNis then  
executed by loading the PC with the  
TOS.  
The instruction takes two cycles to  
execute; a NOPis performed during the  
second cycle.  
Words:  
1
1
Cycles:  
Q Cycle Activity:  
Q1  
Q2  
Q3  
Q4  
Decode  
Read  
literal ‘k’  
Process  
Data  
Write to  
FSR  
This may be thought of as a special  
case of the ADDFSRinstruction, where  
f = 3 (binary ‘11’); it operates only on  
FSR2.  
Example:  
ADDFSR 2, 23h  
Words:  
1
2
Before Instruction  
FSR2  
After Instruction  
FSR2  
=
03FFh  
0422h  
Cycles:  
Q Cycle Activity:  
Q1  
=
Q2  
Q3  
Q4  
Decode  
Read  
literal ‘k’  
Process  
Data  
Write to  
FSR  
No  
No  
No  
No  
Operation  
Operation  
Operation Operation  
Example:  
ADDULNK 23h  
Before Instruction  
FSR2  
PC  
=
=
03FFh  
0100h  
After Instruction  
FSR2  
PC  
=
=
0422h  
(TOS)  
Note:  
All PIC18 instructions may take an optional label argument preceding the instruction mnemonic for use in  
symbolic addressing. If a label is used, the instruction syntax then becomes: {label} instruction argument(s).  
DS39689F-page 322  
© 2009 Microchip Technology Inc.  
PIC18F2221/2321/4221/4321 FAMILY  
CALLW  
Subroutine Call Using WREG  
MOVSF  
Move Indexed to f  
Syntax:  
CALLW  
None  
Syntax:  
MOVSF [z ], f  
s
d
Operands:  
Operation:  
Operands:  
0 z 127  
s
0 f 4095  
d
(PC + 2) TOS,  
(W) PCL,  
Operation:  
((FSR2) + z ) f  
s
d
(PCLATH) PCH,  
(PCLATU) PCU  
Status Affected:  
None  
Encoding:  
1st word (source)  
2nd word (destin.)  
Status Affected:  
Encoding:  
None  
1110  
1111  
1011  
ffff  
0zzz  
ffff  
zzzz  
ffff  
s
d
0000  
0000  
0001  
0100  
Description  
First, the return address (PC + 2) is  
pushed onto the return stack. Next, the  
contents of W are written to PCL; the  
existing value is discarded. Then, the  
contents of PCLATH and PCLATU are  
latched into PCH and PCU,  
respectively. The second cycle is  
executed as a NOPinstruction while the  
new next instruction is fetched.  
Description:  
The contents of the source register are  
moved to destination register ‘f ’. The  
d
actual address of the source register is  
determined by adding the 7-bit literal  
offset ‘z ’ in the first word to the value of  
s
FSR2. The address of the destination  
register is specified by the 12-bit literal  
‘f ’ in the second word. Both addresses  
d
can be anywhere in the 4096-byte data  
space (000h to FFFh).  
The MOVSFinstruction cannot use the  
PCL, TOSU, TOSH or TOSL as the  
destination register.  
If the resultant source address points to  
an indirect addressing register, the  
value returned will be 00h.  
Unlike CALL, there is no option to  
update W, STATUS or BSR.  
Words:  
Cycles:  
1
2
Q Cycle Activity:  
Q1  
Q2  
Q3  
Q4  
Words:  
Cycles:  
2
2
Decode  
Read  
WREG  
PUSH PC to  
stack  
No  
operation  
No  
operation  
No  
operation  
No  
operation  
No  
operation  
Q Cycle Activity:  
Q1  
Q2  
Q3  
Q4  
Decode  
Determine  
Determine  
Read  
source addr source addr source reg  
Example:  
HERE  
CALLW  
Decode  
No  
operation  
No  
operation  
Write  
register ‘f’  
(dest)  
Before Instruction  
PC  
=
address (HERE)  
PCLATH =  
PCLATU =  
10h  
00h  
06h  
No dummy  
read  
W
=
After Instruction  
PC  
=
001006h  
Example:  
MOVSF  
[05h], REG2  
TOS  
=
address (HERE + 2)  
PCLATH =  
PCLATU =  
W
10h  
00h  
06h  
Before Instruction  
FSR2  
=
80h  
33h  
=
Contents  
of 85h  
REG2  
=
=
11h  
After Instruction  
FSR2  
=
80h  
Contents  
of 85h  
REG2  
=
=
33h  
33h  
© 2009 Microchip Technology Inc.  
DS39689F-page 323  
PIC18F2221/2321/4221/4321 FAMILY  
MOVSS  
Move Indexed to Indexed  
PUSHL  
Store Literal at FSR2, Decrement FSR2  
Syntax:  
MOVSS [z ], [z ]  
Syntax:  
PUSHL k  
s
d
Operands:  
0 z 127  
s
Operands:  
Operation:  
0 k 255  
0 z 127  
d
k (FSR2),  
FSR2 – 1 FSR2  
Operation:  
((FSR2) + z ) ((FSR2) + z )  
s d  
Status Affected:  
None  
Status Affected: None  
Encoding:  
1st word (source)  
2nd word (dest.)  
Encoding:  
1111  
1010  
kkkk  
kkkk  
1110  
1111  
1011  
xxxx  
1zzz  
xzzz  
zzzz  
zzzz  
s
d
Description:  
The 8-bit literal ‘k’ is written to the data  
memory address specified by FSR2. FSR2  
is decremented by 1 after the operation.  
This instruction allows users to push values  
onto a software stack.  
Description  
The contents of the source register are  
moved to the destination register. The  
addresses of the source and destination  
registers are determined by adding the  
7-bit literal offsets ‘z ’ or ‘z ’,  
Words:  
Cycles:  
1
1
s
d
respectively, to the value of FSR2. Both  
registers can be located anywhere in  
the 4096-byte data memory space  
(000h to FFFh).  
Q Cycle Activity:  
Q1  
Q2  
Q3  
Q4  
The MOVSSinstruction cannot use the  
PCL, TOSU, TOSH or TOSL as the  
destination register.  
Decode  
Read ‘k’  
Process  
data  
Write to  
destination  
If the resultant source address points to  
an indirect addressing register, the  
value returned will be 00h. If the  
resultant destination address points to  
an indirect addressing register, the  
instruction will execute as a NOP.  
Example:  
PUSHL 08h  
Before Instruction  
FSR2H:FSR2L  
Memory (01ECh)  
=
=
01ECh  
00h  
Words:  
2
2
After Instruction  
FSR2H:FSR2L  
Memory (01ECh)  
=
=
01EBh  
08h  
Cycles:  
Q Cycle Activity:  
Q1  
Q2  
Q3  
Q4  
Decode  
Determine  
Determine  
Read  
source addr source addr source reg  
Decode  
Determine  
dest addr  
Determine  
dest addr  
Write  
to dest reg  
Example:  
MOVSS [05h], [06h]  
Before Instruction  
FSR2  
=
=
=
80h  
33h  
11h  
Contents  
of 85h  
Contents  
of 86h  
After Instruction  
FSR2  
=
=
=
80h  
33h  
33h  
Contents  
of 85h  
Contents  
of 86h  
DS39689F-page 324  
© 2009 Microchip Technology Inc.  
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SUBFSR  
Subtract Literal from FSR  
SUBULNK  
Subtract Literal from FSR2 and Return  
Syntax:  
SUBFSR f, k  
0 k 63  
Syntax:  
SUBULNK k  
Operands:  
Operands:  
Operation:  
0 k 63  
f [ 0, 1, 2 ]  
FSR(f – k) FSR(f)  
None  
FSR2 – k FSR2,  
(TOS) PC  
None  
Operation:  
Status Affected:  
Encoding:  
Status  
Affected:  
1110  
1001  
ffkk  
kkkk  
Encoding:  
1110  
1001  
11kk  
kkkk  
Description:  
The 6-bit literal ‘k’ is subtracted from  
the contents of the FSR specified  
by ‘f’.  
Description:  
The 6-bit literal ‘k’ is subtracted from the  
contents of the FSR2. A RETURNis then  
executed by loading the PC with the TOS.  
The instruction takes two cycles to  
execute; a NOPis performed during the  
second cycle.  
This may be thought of as a special case of  
the SUBFSRinstruction, where f = 3 (binary  
11’); it operates only on FSR2.  
Words:  
1
1
Cycles:  
Q Cycle Activity:  
Q1  
Q2  
Q3  
Q4  
Decode  
Read  
register ‘f’  
Process  
Data  
Write to  
destination  
Words:  
1
2
Cycles:  
Example:  
SUBFSR 2, 23h  
03FFh  
Q Cycle Activity:  
Q1  
Before Instruction  
FSR2  
After Instruction  
FSR2  
Q2  
Q3  
Q4  
=
Decode  
Read  
register ‘f’  
Process  
Data  
Write to  
destination  
=
03DCh  
No  
No  
No  
No  
Operation  
Operation  
Operation  
Operation  
Example:  
SUBULNK 23h  
Before Instruction  
FSR2  
PC  
=
=
03FFh  
0100h  
After Instruction  
FSR2  
PC  
=
=
03DCh  
(TOS)  
© 2009 Microchip Technology Inc.  
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25.2.3  
BYTE-ORIENTED AND  
BIT-ORIENTED INSTRUCTIONS IN  
INDEXED LITERAL OFFSET MODE  
25.2.3.1  
Extended Instruction Syntax with  
Standard PIC18 Commands  
When the extended instruction set is enabled, the file  
register argument, ‘f’, in the standard byte-oriented and  
bit-oriented commands is replaced with the literal offset  
value, ‘k’. As already noted, this occurs only when ‘f’ is  
less than or equal to 5Fh. When an offset value is used,  
it must be indicated by square brackets (“[ ]”). As with  
the extended instructions, the use of brackets indicates  
to the compiler that the value is to be interpreted as an  
index or an offset. Omitting the brackets, or using a  
value greater than 5Fh within brackets, will generate an  
error in the MPASM Assembler.  
Note: Enabling the PIC18 instruction set  
extension may cause legacy applications  
to behave erratically or fail entirely.  
In addition to eight new commands in the extended set,  
enabling the extended instruction set also enables  
Indexed Literal Offset Addressing mode (Section 6.5.1  
“Indexed Addressing with Literal Offset”). This has  
a significant impact on the way that many commands of  
the standard PIC18 instruction set are interpreted.  
When the extended set is disabled, addresses embed-  
ded in opcodes are treated as literal memory locations:  
either as a location in the Access Bank (‘a’ = 0) or in a  
GPR bank designated by the BSR (‘a’ = 1). When the  
extended instruction set is enabled and ‘a’ = 0,  
however, a file register argument of 5Fh or less is  
interpreted as an offset from the pointer value in FSR2  
and not as a literal address. For practical purposes, this  
means that all instructions that use the Access RAM bit  
as an argument – that is, all byte-oriented and bit-  
oriented instructions, or almost half of the core PIC18  
If the index argument is properly bracketed for Indexed  
Literal Offset Addressing mode, the Access RAM  
argument is never specified; it will automatically be  
assumed to be ‘0’. This is in contrast to standard  
operation (extended instruction set disabled) when ‘a’  
is set on the basis of the target address. Declaring the  
Access RAM bit in this mode will also generate an error  
in the MPASM Assembler.  
The destination argument, ‘d’, functions as before.  
In the latest versions of the MPASM Assembler,  
language support for the extended instruction set must  
be explicitly invoked. This is done with either the  
command line option, /y, or the PE directive in the  
source listing.  
instructions  
– may behave differently when the  
extended instruction set is enabled.  
When the content of FSR2 is 00h, the boundaries of the  
Access RAM are essentially remapped to their original  
values. This may be useful in creating backward  
compatible code. If this technique is used, it may be  
necessary to save the value of FSR2 and restore it  
when moving back and forth between C and assembly  
routines in order to preserve the Stack Pointer. Users  
must also keep in mind the syntax requirements of the  
extended instruction set (see Section 25.2.3.1  
“Extended Instruction Syntax with Standard PIC18  
Commands”).  
25.2.4  
CONSIDERATIONS WHEN  
ENABLING THE EXTENDED  
INSTRUCTION SET  
It is important to note that the extensions to the instruc-  
tion set may not be beneficial to all users. In particular,  
users who are not writing code that uses a software  
stack may not benefit from using the extensions to the  
instruction set.  
Although the Indexed Literal Offset Addressing mode  
can be very useful for dynamic stack and pointer  
manipulation, it can also be very annoying if a simple  
arithmetic operation is carried out on the wrong  
register. Users who are accustomed to the PIC18  
programming must keep in mind that, when the  
extended instruction set is enabled, register addresses  
of 5Fh or less are used for Indexed Literal Offset  
Addressing mode.  
Additionally, the Indexed Literal Offset Addressing  
mode may create issues with legacy applications  
written to the PIC18 assembler. This is because  
instructions in the legacy code may attempt to address  
registers in the Access Bank below 5Fh. Since these  
addresses are interpreted as literal offsets to FSR2  
when the instruction set extension is enabled, the  
application may read or write to the wrong data  
addresses.  
Representative examples of typical byte-oriented and  
bit-oriented instructions in the Indexed Literal Offset  
Addressing mode are provided on the following page to  
show how execution is affected. The operand  
conditions shown in the examples are applicable to all  
instructions of these types.  
When porting an application to the PIC18F2221/2321/  
4221/4321 family, it is very important to consider the  
type of code. A large, re-entrant application that is  
written in ‘C’ and would benefit from efficient  
compilation will do well when using the instruction set  
extensions. Legacy applications that heavily use the  
Access Bank will most likely not benefit from using the  
extended instruction set.  
DS39689F-page 326  
© 2009 Microchip Technology Inc.  
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ADD W to Indexed  
(Indexed Literal Offset mode)  
Bit Set Indexed  
(Indexed Literal Offset mode)  
ADDWF  
BSF  
Syntax:  
ADDWF  
[k] {,d}  
Syntax:  
BSF [k], b  
Operands:  
0 k 95  
d [0,1]  
Operands:  
0 f 95  
0 b 7  
Operation:  
(W) + ((FSR2) + k) dest  
Operation:  
1((FSR2) + k)<b>  
Status Affected:  
Encoding:  
N, OV, C, DC, Z  
Status Affected:  
Encoding:  
None  
0010  
01d0  
kkkk  
kkkk  
1000  
bbb0  
kkkk  
kkkk  
Description:  
The contents of W are added to the  
contents of the register indicated by  
FSR2, offset by the value ‘k’.  
If ‘d’ is ‘0’, the result is stored in W. If ‘d’  
is ‘1’, the result is stored back in  
register ‘f’ (default).  
Description:  
Bit ‘b’ of the register indicated by FSR2,  
offset by the value ‘k’, is set.  
Words:  
1
1
Cycles:  
Q Cycle Activity:  
Q1  
Words:  
Cycles:  
1
1
Q2  
Q3  
Q4  
Decode  
Read  
register ‘f’  
Process  
Data  
Write to  
destination  
Q Cycle Activity:  
Q1  
Q2  
Q3  
Q4  
Example:  
BSF  
[FLAG_OFST], 7  
Decode  
Read ‘k’  
Process  
Data  
Write to  
destination  
Before Instruction  
FLAG_OFST  
FSR2  
Contents  
of 0A0Ah  
=
=
0Ah  
0A00h  
Example:  
ADDWF  
[OFST], 0  
=
55h  
D5h  
Before Instruction  
After Instruction  
W
OFST  
FSR2  
=
=
=
17h  
2Ch  
0A00h  
Contents  
of 0A0Ah  
=
Contents  
of 0A2Ch  
=
20h  
After Instruction  
W
=
=
37h  
20h  
Set Indexed  
(Indexed Literal Offset mode)  
Contents  
of 0A2Ch  
SETF  
Syntax:  
SETF [k]  
Operands:  
Operation:  
Status Affected:  
Encoding:  
Description:  
0 k 95  
FFh ((FSR2) + k)  
None  
0110  
1000  
kkkk  
kkkk  
The contents of the register indicated  
by FSR2, offset by ‘k’, are set to FFh.  
Words:  
Cycles:  
1
1
Q Cycle Activity:  
Q1  
Q2  
Q3  
Q4  
Decode  
Read ‘k’  
Process  
Data  
Write  
register  
Example:  
SETF  
[OFST]  
2Ch  
Before Instruction  
OFST  
=
=
FSR2  
0A00h  
Contents  
of 0A2Ch  
=
00h  
After Instruction  
Contents  
of 0A2Ch  
=
FFh  
© 2009 Microchip Technology Inc.  
DS39689F-page 327  
PIC18F2221/2321/4221/4321 FAMILY  
To develop software for the extended instruction set,  
the user must enable support for the instructions and  
the Indexed Addressing mode in their language tool(s).  
Depending on the environment being used, this may be  
done in several ways:  
25.2.5  
SPECIAL CONSIDERATIONS WITH  
MICROCHIP MPLAB® IDE TOOLS  
The latest versions of Microchip’s software tools have  
been designed to fully support the extended instruction  
set of the PIC18F2221/2321/4221/4321 family family of  
devices. This includes the MPLAB C18 C Compiler,  
MPASM Assembly language and MPLAB Integrated  
Development Environment (IDE).  
• A menu option, or dialog box within the  
environment, that allows the user to configure the  
language tool and its settings for the project  
• A command line option  
When selecting  
a
target device for software  
• A directive in the source code  
development, MPLAB IDE will automatically set default  
Configuration bits for that device. The default setting for  
the XINST Configuration bit is ‘0’, disabling the  
extended instruction set and Indexed Literal Offset  
Addressing mode. For proper execution of applications  
developed to take advantage of the extended  
instruction set, XINST must be set during  
programming.  
These options vary between different compilers,  
assemblers and development environments. Users are  
encouraged to review the documentation accompany-  
ing their development systems for the appropriate  
information.  
DS39689F-page 328  
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26.1 MPLAB Integrated Development  
Environment Software  
26.0 DEVELOPMENT SUPPORT  
The PIC® microcontrollers and dsPIC® digital signal  
controllers are supported with a full range of software  
and hardware development tools:  
The MPLAB IDE software brings an ease of software  
development previously unseen in the 8/16/32-bit  
microcontroller market. The MPLAB IDE is a Windows®  
operating system-based application that contains:  
• Integrated Development Environment  
- MPLAB® IDE Software  
• A single graphical interface to all debugging tools  
- Simulator  
• Compilers/Assemblers/Linkers  
- MPLAB C Compiler for Various Device  
Families  
- Programmer (sold separately)  
- In-Circuit Emulator (sold separately)  
- In-Circuit Debugger (sold separately)  
• A full-featured editor with color-coded context  
• A multiple project manager  
- HI-TECH C for Various Device Families  
- MPASMTM Assembler  
- MPLINKTM Object Linker/  
MPLIBTM Object Librarian  
- MPLAB Assembler/Linker/Librarian for  
Various Device Families  
• Customizable data windows with direct edit of  
contents  
• Simulators  
• High-level source code debugging  
• Mouse over variable inspection  
- MPLAB SIM Software Simulator  
• Emulators  
• Drag and drop variables from source to watch  
windows  
- MPLAB REAL ICE™ In-Circuit Emulator  
• In-Circuit Debuggers  
• Extensive on-line help  
• Integration of select third party tools, such as  
IAR C Compilers  
- MPLAB ICD 3  
- PICkit™ 3 Debug Express  
• Device Programmers  
- PICkit™ 2 Programmer  
- MPLAB PM3 Device Programmer  
The MPLAB IDE allows you to:  
• Edit your source files (either C or assembly)  
• One-touch compile or assemble, and download to  
emulator and simulator tools (automatically  
updates all project information)  
• Low-Cost Demonstration/Development Boards,  
Evaluation Kits, and Starter Kits  
• Debug using:  
- Source files (C or assembly)  
- Mixed C and assembly  
- Machine code  
MPLAB IDE supports multiple debugging tools in a  
single development paradigm, from the cost-effective  
simulators, through low-cost in-circuit debuggers, to  
full-featured emulators. This eliminates the learning  
curve when upgrading to tools with increased flexibility  
and power.  
© 2009 Microchip Technology Inc.  
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26.2 MPLAB C Compilers for Various  
Device Families  
26.5 MPLINK Object Linker/  
MPLIB Object Librarian  
The MPLAB C Compiler code development systems  
are complete ANSI C compilers for Microchip’s PIC18,  
PIC24 and PIC32 families of microcontrollers and the  
dsPIC30 and dsPIC33 families of digital signal control-  
lers. These compilers provide powerful integration  
capabilities, superior code optimization and ease of  
use.  
The MPLINK Object Linker combines relocatable  
objects created by the MPASM Assembler and the  
MPLAB C18 C Compiler. It can link relocatable objects  
from precompiled libraries, using directives from a  
linker script.  
The MPLIB Object Librarian manages the creation and  
modification of library files of precompiled code. When  
a routine from a library is called from a source file, only  
the modules that contain that routine will be linked in  
with the application. This allows large libraries to be  
used efficiently in many different applications.  
For easy source level debugging, the compilers provide  
symbol information that is optimized to the MPLAB IDE  
debugger.  
26.3 HI-TECH C for Various Device  
Families  
The object linker/library features include:  
• Efficient linking of single libraries instead of many  
smaller files  
The HI-TECH C Compiler code development systems  
are complete ANSI C compilers for Microchip’s PIC  
family of microcontrollers and the dsPIC family of digital  
signal controllers. These compilers provide powerful  
integration capabilities, omniscient code generation  
and ease of use.  
• Enhanced code maintainability by grouping  
related modules together  
• Flexible creation of libraries with easy module  
listing, replacement, deletion and extraction  
26.6 MPLAB Assembler, Linker and  
Librarian for Various Device  
Families  
For easy source level debugging, the compilers provide  
symbol information that is optimized to the MPLAB IDE  
debugger.  
The compilers include a macro assembler, linker, pre-  
processor, and one-step driver, and can run on multiple  
platforms.  
MPLAB Assembler produces relocatable machine  
code from symbolic assembly language for PIC24,  
PIC32 and dsPIC devices. MPLAB C Compiler uses  
the assembler to produce its object file. The assembler  
generates relocatable object files that can then be  
archived or linked with other relocatable object files and  
archives to create an executable file. Notable features  
of the assembler include:  
26.4 MPASM Assembler  
The MPASM Assembler is a full-featured, universal  
macro assembler for PIC10/12/16/18 MCUs.  
The MPASM Assembler generates relocatable object  
files for the MPLINK Object Linker, Intel® standard HEX  
files, MAP files to detail memory usage and symbol  
reference, absolute LST files that contain source lines  
and generated machine code and COFF files for  
debugging.  
• Support for the entire device instruction set  
• Support for fixed-point and floating-point data  
• Command line interface  
• Rich directive set  
• Flexible macro language  
The MPASM Assembler features include:  
• Integration into MPLAB IDE projects  
• MPLAB IDE compatibility  
• User-defined macros to streamline  
assembly code  
• Conditional assembly for multi-purpose  
source files  
• Directives that allow complete control over the  
assembly process  
DS39689F-page 330  
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PIC18F2221/2321/4221/4321 FAMILY  
26.7 MPLAB SIM Software Simulator  
26.9 MPLAB ICD 3 In-Circuit Debugger  
System  
The MPLAB SIM Software Simulator allows code  
development in a PC-hosted environment by simulat-  
ing the PIC MCUs and dsPIC® DSCs on an instruction  
level. On any given instruction, the data areas can be  
examined or modified and stimuli can be applied from  
a comprehensive stimulus controller. Registers can be  
logged to files for further run-time analysis. The trace  
buffer and logic analyzer display extend the power of  
the simulator to record and track program execution,  
actions on I/O, most peripherals and internal registers.  
MPLAB ICD 3 In-Circuit Debugger System is Micro-  
chip's most cost effective high-speed hardware  
debugger/programmer for Microchip Flash Digital Sig-  
nal Controller (DSC) and microcontroller (MCU)  
devices. It debugs and programs PIC® Flash microcon-  
trollers and dsPIC® DSCs with the powerful, yet easy-  
to-use graphical user interface of MPLAB Integrated  
Development Environment (IDE).  
The MPLAB ICD 3 In-Circuit Debugger probe is con-  
nected to the design engineer's PC using a high-speed  
USB 2.0 interface and is connected to the target with a  
connector compatible with the MPLAB ICD 2 or MPLAB  
REAL ICE systems (RJ-11). MPLAB ICD 3 supports all  
MPLAB ICD 2 headers.  
The MPLAB SIM Software Simulator fully supports  
symbolic debugging using the MPLAB C Compilers,  
and the MPASM and MPLAB Assemblers. The soft-  
ware simulator offers the flexibility to develop and  
debug code outside of the hardware laboratory envi-  
ronment, making it an excellent, economical software  
development tool.  
26.10 PICkit 3 In-Circuit Debugger/  
Programmer and  
26.8 MPLAB REAL ICE In-Circuit  
Emulator System  
PICkit 3 Debug Express  
The MPLAB PICkit 3 allows debugging and program-  
ming of PIC® and dsPIC® Flash microcontrollers at a  
most affordable price point using the powerful graphical  
user interface of the MPLAB Integrated Development  
Environment (IDE). The MPLAB PICkit 3 is connected  
to the design engineer's PC using a full speed USB  
interface and can be connected to the target via an  
Microchip debug (RJ-11) connector (compatible with  
MPLAB ICD 3 and MPLAB REAL ICE). The connector  
uses two device I/O pins and the reset line to imple-  
ment in-circuit debugging and In-Circuit Serial Pro-  
gramming™.  
MPLAB REAL ICE In-Circuit Emulator System is  
Microchip’s next generation high-speed emulator for  
Microchip Flash DSC and MCU devices. It debugs and  
programs PIC® Flash MCUs and dsPIC® Flash DSCs  
with the easy-to-use, powerful graphical user interface of  
the MPLAB Integrated Development Environment (IDE),  
included with each kit.  
The emulator is connected to the design engineer’s PC  
using a high-speed USB 2.0 interface and is connected  
to the target with either a connector compatible with in-  
circuit debugger systems (RJ11) or with the new high-  
speed, noise tolerant, Low-Voltage Differential Signal  
(LVDS) interconnection (CAT5).  
The PICkit 3 Debug Express include the PICkit 3, demo  
board and microcontroller, hookup cables and CDROM  
with user’s guide, lessons, tutorial, compiler and  
MPLAB IDE software.  
The emulator is field upgradable through future firmware  
downloads in MPLAB IDE. In upcoming releases of  
MPLAB IDE, new devices will be supported, and new  
features will be added. MPLAB REAL ICE offers signifi-  
cant advantages over competitive emulators including  
low-cost, full-speed emulation, run-time variable  
watches, trace analysis, complex breakpoints, a rugge-  
dized probe interface and long (up to three meters) inter-  
connection cables.  
© 2009 Microchip Technology Inc.  
DS39689F-page 331  
PIC18F2221/2321/4221/4321 FAMILY  
26.11 PICkit 2 Development  
Programmer/Debugger and  
PICkit 2 Debug Express  
26.13 Demonstration/Development  
Boards, Evaluation Kits, and  
Starter Kits  
The PICkit™ 2 Development Programmer/Debugger is  
a low-cost development tool with an easy to use inter-  
face for programming and debugging Microchip’s Flash  
families of microcontrollers. The full featured  
Windows® programming interface supports baseline  
A wide variety of demonstration, development and  
evaluation boards for various PIC MCUs and dsPIC  
DSCs allows quick application development on fully func-  
tional systems. Most boards include prototyping areas for  
adding custom circuitry and provide application firmware  
and source code for examination and modification.  
(PIC10F,  
PIC12F5xx,  
PIC16F5xx),  
midrange  
(PIC12F6xx, PIC16F), PIC18F, PIC24, dsPIC30,  
dsPIC33, and PIC32 families of 8-bit, 16-bit, and 32-bit  
microcontrollers, and many Microchip Serial EEPROM  
products. With Microchip’s powerful MPLAB Integrated  
The boards support a variety of features, including LEDs,  
temperature sensors, switches, speakers, RS-232  
interfaces, LCD displays, potentiometers and additional  
EEPROM memory.  
Development Environment (IDE) the PICkit™  
2
enables in-circuit debugging on most PIC® microcon-  
trollers. In-Circuit-Debugging runs, halts and single  
steps the program while the PIC microcontroller is  
embedded in the application. When halted at a break-  
point, the file registers can be examined and modified.  
The demonstration and development boards can be  
used in teaching environments, for prototyping custom  
circuits and for learning about various microcontroller  
applications.  
In addition to the PICDEM™ and dsPICDEM™ demon-  
stration/development board series of circuits, Microchip  
has a line of evaluation kits and demonstration software  
The PICkit 2 Debug Express include the PICkit 2, demo  
board and microcontroller, hookup cables and CDROM  
with user’s guide, lessons, tutorial, compiler and  
MPLAB IDE software.  
®
for analog filter design, KEELOQ security ICs, CAN,  
IrDA®, PowerSmart battery management, SEEVAL®  
evaluation system, Sigma-Delta ADC, flow rate  
sensing, plus many more.  
26.12 MPLAB PM3 Device Programmer  
Also available are starter kits that contain everything  
needed to experience the specified device. This usually  
includes a single application and debug capability, all  
on one board.  
The MPLAB PM3 Device Programmer is a universal,  
CE compliant device programmer with programmable  
voltage verification at VDDMIN and VDDMAX for  
maximum reliability. It features a large LCD display  
(128 x 64) for menus and error messages and a modu-  
lar, detachable socket assembly to support various  
package types. The ICSP™ cable assembly is included  
as a standard item. In Stand-Alone mode, the MPLAB  
PM3 Device Programmer can read, verify and program  
PIC devices without a PC connection. It can also set  
code protection in this mode. The MPLAB PM3  
connects to the host PC via an RS-232 or USB cable.  
The MPLAB PM3 has high-speed communications and  
optimized algorithms for quick programming of large  
memory devices and incorporates an MMC card for file  
storage and data applications.  
Check the Microchip web page (www.microchip.com)  
for the complete list of demonstration, development  
and evaluation kits.  
DS39689F-page 332  
© 2009 Microchip Technology Inc.  
PIC18F2221/2321/4221/4321 FAMILY  
27.0 ELECTRICAL CHARACTERISTICS  
(†)  
Absolute Maximum Ratings  
Ambient temperature under bias.............................................................................................................-40°C to +125°C  
Storage temperature .............................................................................................................................. -65°C to +150°C  
Voltage on any pin with respect to VSS (except VDD and MCLR) ................................................... -0.3V to (VDD + 0.3V)  
Voltage on VDD with respect to VSS ......................................................................................................... -0.3V to +7.5V  
Voltage on MCLR with respect to VSS (Note 2) ......................................................................................... 0V to +13.25V  
Total power dissipation (Note 1) ...............................................................................................................................1.0W  
Maximum current out of VSS pin ...........................................................................................................................300 mA  
Maximum current into VDD pin ..............................................................................................................................250 mA  
Input clamp current, IIK (VI < 0 or VI > VDD)...................................................................................................................... ±20 mA  
Output clamp current, IOK (VO < 0 or VO > VDD) .............................................................................................................. ±20 mA  
Maximum output current sunk by any I/O pin..........................................................................................................25 mA  
Maximum output current sourced by any I/O pin ....................................................................................................25 mA  
Maximum current sunk by all ports .......................................................................................................................200 mA  
Maximum current sourced by all ports ..................................................................................................................200 mA  
Note 1: Power dissipation is calculated as follows:  
Pdis = VDD x {IDD IOH} + {(VDD – VOH) x IOH} + (VOL x IOL)  
2: Voltage spikes below VSS at the MCLR/VPP/RE3 pin, inducing currents greater than 80 mA, may cause  
latch-up. Thus, a series resistor of 50-100Ω should be used when applying a “low” level to the MCLR/VPP/  
RE3 pin, rather than pulling this pin directly to VSS.  
NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the  
device. This is a stress rating only and functional operation of the device at those or any other conditions above those  
indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for  
extended periods may affect device reliability.  
© 2009 Microchip Technology Inc.  
DS39689F-page 333  
PIC18F2221/2321/4221/4321 FAMILY  
FIGURE 27-1:  
PIC18F2221/2321/4221/4321 VOLTAGE-FREQUENCY GRAPH (INDUSTRIAL)  
6.0V  
5.5V  
5.0V  
4.5V  
4.0V  
4.2V  
3.5V  
3.0V  
2.5V  
2.0V  
40 MHz  
Frequency  
FIGURE 27-2:  
PIC18F2221/2321/4221/4321 VOLTAGE-FREQUENCY GRAPH (EXTENDED)  
6.0V  
5.5V  
5.0V  
4.5V  
4.0V  
4.2V  
3.5V  
3.0V  
2.5V  
2.0V  
25 MHz  
Frequency  
DS39689F-page 334  
© 2009 Microchip Technology Inc.  
PIC18F2221/2321/4221/4321 FAMILY  
FIGURE 27-3:  
PIC18LF2221/2321/4221/4321 VOLTAGE-FREQUENCY GRAPH (INDUSTRIAL)  
6.0V  
5.5V  
5.0V  
4.5V  
4.0V  
4.2V  
3.5V  
3.0V  
2.5V  
2.0V  
4 MHz  
25 MHz  
40 MHz  
Frequency  
FMAX = (9.54 MHz/V) (VDDAPPMIN – 2.0V) + 4 MHz  
Note: VDDAPPMIN is the minimum voltage of the PIC® device in the application.  
© 2009 Microchip Technology Inc.  
DS39689F-page 335  
PIC18F2221/2321/4221/4321 FAMILY  
27.1 DC Characteristics: Supply Voltage  
PIC18F2221/2321/4221/4321 (Industrial)  
PIC18LF2221/2321/4221/4321 (Industrial)  
PIC18LF2221/2321/4221/4321  
Standard Operating Conditions (unless otherwise stated)  
Operating temperature -40°C TA +85°C for industrial  
(Industrial)  
Standard Operating Conditions (unless otherwise stated)  
PIC18F2221/2321/4221/4321  
Operating temperature  
-40°C TA +85°C for industrial  
-40°C TA +125°C for extended  
(Industrial, Extended)  
Param  
No.  
Symbol  
Characteristic  
Min  
Typ  
Max  
Units  
Conditions  
D001  
VDD  
Supply Voltage  
PIC18LF2X21/4X21  
PIC18F2X21/4X21  
2.0  
4.2  
5.5  
5.5  
V
V
V
V
V
D001C AVDD  
D001D AVSS  
Analog Supply Voltage VDD – 0.3V  
Analog Ground Voltage VSS – 0.3V  
VDD + 0.3V  
VSS + 0.3V  
D002  
VDR  
RAM Data Retention  
Voltage  
1.5  
(1)  
D003  
VPOR  
VDD Start Voltage  
to Ensure Internal  
Power-on Reset Signal  
0.7  
V
See section on Power-on Reset for  
details  
D004  
SVDD  
VBOR  
VDD Rise Rate  
to Ensure Internal  
Power-on Reset Signal  
0.05  
V/ms See section on Power-on Reset for  
details  
Brown-out Reset Voltage  
PIC18LF2X21/4X21  
BORV<1:0> = 11  
BORV<1:0> = 10  
All devices  
D005  
D005  
2.00  
2.65  
2.11  
2.79  
2.22  
2.93  
V
V
(2)  
BORV<1:0> = 01  
4.11  
4.36  
4.33  
4.59  
4.55  
4.82  
V
V
BORV<1:0> = 00  
Legend: Shading of rows is to assist in readability of the table.  
Note 1: This is the limit to which VDD can be lowered in Sleep mode, or during a device Reset, without losing RAM data.  
2: With BOR enabled, full-speed operation (FOSC = 40 MHz) is supported until a BOR occurs. This is valid although  
VDD may be below the minimum voltage for this frequency.  
DS39689F-page 336  
© 2009 Microchip Technology Inc.  
PIC18F2221/2321/4221/4321 FAMILY  
27.2 DC Characteristics: Power-Down and Supply Current  
PIC18F2221/2321/4221/4321 (Industrial)  
PIC18LF2221/2321/4221/4321 (Industrial)  
PIC18LF2221/2321/4221/4321  
Standard Operating Conditions (unless otherwise stated)  
(Industrial)  
Operating temperature  
-40°C TA +85°C for industrial  
Standard Operating Conditions (unless otherwise stated)  
PIC18F2221/2321/4221/4321  
Operating temperature  
-40°C TA +85°C for industrial  
-40°C TA +125°C for extended  
(Industrial, Extended)  
Param  
Device  
No.  
Typ  
Max Units  
Conditions  
(1)  
Power-Down Current (IPD)  
PIC18LF2X21/4X21 0.5  
0.7  
0.7  
1.7  
0.9  
0.9  
1.9  
2.0  
2.0  
6.5  
70  
μA  
μA  
μA  
μA  
μA  
μA  
μA  
μA  
μA  
μA  
-40°C  
+25°C  
+85°C  
-40°C  
VDD = 2.0V  
(Sleep mode)  
0.5  
0.5  
PIC18LF2X21/4X21 0.6  
VDD = 3.0V  
(Sleep mode)  
0.6  
+25°C  
+85°C  
-40°C  
0.6  
All Devices 0.9  
0.9  
0.9  
+25°C  
+85°C  
+125°C  
VDD = 5.0V  
(Sleep mode)  
Extended Devices Only 7.5  
Legend: Shading of rows is to assist in readability of the table.  
Note 1: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured  
with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD or VSS, and all features that  
add delta current disabled (such as WDT, Timer1 Oscillator, BOR, etc.).  
2: The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin  
loading and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have  
an impact on the current consumption.  
The test conditions for all IDD measurements in active operation mode are:  
OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD or VSS;  
MCLR = VDD; WDT enabled/disabled as specified.  
3: Low-power, Timer1 oscillator is selected unless otherwise indicated, where LPT1OSC (CONFIG3H<2>) = 1.  
4: BOR and HLVD enable internal band gap reference. With both modules enabled, current consumption will be less  
than the sum of both specifications.  
5: When operation below -10°C is expected, use T1OSC High-Power mode, where LPT1OSC (CONFIG3H<2>) = 0.  
© 2009 Microchip Technology Inc.  
DS39689F-page 337  
PIC18F2221/2321/4221/4321 FAMILY  
27.2 DC Characteristics: Power-Down and Supply Current  
PIC18F2221/2321/4221/4321 (Industrial)  
PIC18LF2221/2321/4221/4321 (Industrial) (Continued)  
PIC18LF2221/2321/4221/4321  
Standard Operating Conditions (unless otherwise stated)  
Operating temperature -40°C TA +85°C for industrial  
(Industrial)  
Standard Operating Conditions (unless otherwise stated)  
PIC18F2221/2321/4221/4321  
Operating temperature  
-40°C TA +85°C for industrial  
-40°C TA +125°C for extended  
(Industrial, Extended)  
Param  
Device  
No.  
Typ  
Max Units  
Conditions  
(2)  
Supply Current (IDD)  
PIC18LF2X21/4X21 13  
19  
19  
μA  
μA  
-40°C  
13  
+25°C  
+85°C  
-40°C  
VDD = 2.0V  
VDD = 3.0V  
13  
17  
μA  
PIC18LF2X21/4X21 41  
45  
μA  
FOSC = 31 kHz  
(RC_RUN mode,  
INTRC source)  
34  
38  
μA  
+25°C  
+85°C  
-40°C  
27  
30  
μA  
All Devices 104  
115  
95  
μA  
86  
67  
μA  
+25°C  
+85°C  
+125°C  
-40°C  
VDD = 5.0V  
75  
μA  
Extended Devices Only 68  
100  
μA  
PIC18LF2X21/4X21 0.31 0.35  
0.31 0.35  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
+25°C  
+85°C  
-40°C  
VDD = 2.0V  
VDD = 3.0V  
0.31 0.35  
PIC18LF2X21/4X21 0.55 0.60  
0.51 0.60  
FOSC = 1 MHz  
(RC_RUN mode,  
INTOSC source)  
+25°C  
+85°C  
-40°C  
0.47 0.60  
All Devices 1.0  
1.3  
1.3  
1.2  
1.2  
0.94  
0.88  
+25°C  
+85°C  
+125°C  
VDD = 5.0V  
Extended Devices Only 0.88  
Legend: Shading of rows is to assist in readability of the table.  
Note 1: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured  
with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD or VSS, and all features that  
add delta current disabled (such as WDT, Timer1 Oscillator, BOR, etc.).  
2: The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin  
loading and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have  
an impact on the current consumption.  
The test conditions for all IDD measurements in active operation mode are:  
OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD or VSS;  
MCLR = VDD; WDT enabled/disabled as specified.  
3: Low-power, Timer1 oscillator is selected unless otherwise indicated, where LPT1OSC (CONFIG3H<2>) = 1.  
4: BOR and HLVD enable internal band gap reference. With both modules enabled, current consumption will be less  
than the sum of both specifications.  
5: When operation below -10°C is expected, use T1OSC High-Power mode, where LPT1OSC (CONFIG3H<2>) = 0.  
DS39689F-page 338  
© 2009 Microchip Technology Inc.  
PIC18F2221/2321/4221/4321 FAMILY  
27.2 DC Characteristics: Power-Down and Supply Current  
PIC18F2221/2321/4221/4321 (Industrial)  
PIC18LF2221/2321/4221/4321 (Industrial) (Continued)  
PIC18LF2221/2321/4221/4321  
Standard Operating Conditions (unless otherwise stated)  
(Industrial)  
Operating temperature  
-40°C TA +85°C for industrial  
Standard Operating Conditions (unless otherwise stated)  
PIC18F2221/2321/4221/4321  
Operating temperature  
-40°C TA +85°C for industrial  
-40°C TA +125°C for extended  
(Industrial, Extended)  
Param  
Device  
No.  
Typ  
Max Units  
Conditions  
(2)  
Supply Current (IDD)  
PIC18LF2X21/4X21 0.69  
0.9  
0.9  
0.9  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
μA  
-40°C  
0.70  
0.71  
+25°C  
+85°C  
-40°C  
VDD = 2.0V  
VDD = 3.0V  
PIC18LF2X21/4X21 1.17 1.45  
1.15 1.45  
FOSC = 4 MHz  
(RC_RUN mode,  
INTOSC source)  
+25°C  
+85°C  
-40°C  
1.14 1.45  
All Devices 2.24  
2.9  
2.9  
2.8  
2.8  
5
2.20  
2.16  
+25°C  
+85°C  
+125°C  
-40°C  
VDD = 5.0V  
Extended Devices Only 2.18  
PIC18LF2X21/4X21  
3
3
3
4
5
5
5
μA  
+25°C  
+85°C  
-40°C  
VDD = 2.0V  
VDD = 3.0V  
5.6  
7
μA  
PIC18LF2X21/4X21  
μA  
FOSC = 31 kHz  
(RC_IDLE mode,  
INTRC source)  
7
μA  
+25°C  
+85°C  
-40°C  
10  
12  
12  
16  
50  
μA  
All Devices 10  
μA  
10  
10  
μA  
+25°C  
+85°C  
+125°C  
VDD = 5.0V  
μA  
Extended Devices Only 17  
μA  
Legend: Shading of rows is to assist in readability of the table.  
Note 1: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured  
with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD or VSS, and all features that  
add delta current disabled (such as WDT, Timer1 Oscillator, BOR, etc.).  
2: The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin  
loading and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have  
an impact on the current consumption.  
The test conditions for all IDD measurements in active operation mode are:  
OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD or VSS;  
MCLR = VDD; WDT enabled/disabled as specified.  
3: Low-power, Timer1 oscillator is selected unless otherwise indicated, where LPT1OSC (CONFIG3H<2>) = 1.  
4: BOR and HLVD enable internal band gap reference. With both modules enabled, current consumption will be less  
than the sum of both specifications.  
5: When operation below -10°C is expected, use T1OSC High-Power mode, where LPT1OSC (CONFIG3H<2>) = 0.  
© 2009 Microchip Technology Inc.  
DS39689F-page 339  
PIC18F2221/2321/4221/4321 FAMILY  
27.2 DC Characteristics: Power-Down and Supply Current  
PIC18F2221/2321/4221/4321 (Industrial)  
PIC18LF2221/2321/4221/4321 (Industrial) (Continued)  
PIC18LF2221/2321/4221/4321  
Standard Operating Conditions (unless otherwise stated)  
Operating temperature -40°C TA +85°C for industrial  
(Industrial)  
Standard Operating Conditions (unless otherwise stated)  
PIC18F2221/2321/4221/4321  
Operating temperature  
-40°C TA +85°C for industrial  
-40°C TA +125°C for extended  
(Industrial, Extended)  
Param  
Device  
No.  
Typ  
Max Units  
Conditions  
(2)  
Supply Current (IDD)  
μA  
μA  
μA  
μA  
μA  
μA  
μA  
μA  
μA  
μA  
μA  
μA  
μA  
μA  
μA  
μA  
-40°C  
PIC18LF2X21/4X21 160  
230  
230  
230  
330  
330  
330  
500  
500  
500  
500  
440  
440  
440  
750  
750  
750  
1.3  
+25°C  
+85°C  
-40°C  
+25°C  
+85°C  
-40°C  
+25°C  
+85°C  
170  
VDD = 2.0V  
VDD = 3.0V  
170  
PIC18LF2X21/4X21 220  
FOSC = 1 MHz  
(RC_IDLE mode,  
INTOSC source)  
240  
250  
All Devices 410  
420  
VDD = 5.0V  
430  
Extended Devices Only 450  
+125°C  
-40°C  
PIC18LF2X21/4X21 310  
+25°C  
+85°C  
-40°C  
+25°C  
+85°C  
-40°C  
+25°C  
+85°C  
330  
VDD = 2.0V  
VDD = 3.0V  
340  
PIC18LF2X21/4X21 480  
FOSC = 4 MHz  
(RC_IDLE mode,  
INTOSC source)  
500  
520  
All Devices 0.91  
mA  
mA  
mA  
mA  
0.93  
0.96  
1.3  
VDD = 5.0V  
1.3  
Extended Devices Only 0.98  
1.3  
+125°C  
Legend: Shading of rows is to assist in readability of the table.  
Note 1: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured  
with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD or VSS, and all features that  
add delta current disabled (such as WDT, Timer1 Oscillator, BOR, etc.).  
2: The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin  
loading and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have  
an impact on the current consumption.  
The test conditions for all IDD measurements in active operation mode are:  
OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD or VSS;  
MCLR = VDD; WDT enabled/disabled as specified.  
3: Low-power, Timer1 oscillator is selected unless otherwise indicated, where LPT1OSC (CONFIG3H<2>) = 1.  
4: BOR and HLVD enable internal band gap reference. With both modules enabled, current consumption will be less  
than the sum of both specifications.  
5: When operation below -10°C is expected, use T1OSC High-Power mode, where LPT1OSC (CONFIG3H<2>) = 0.  
DS39689F-page 340  
© 2009 Microchip Technology Inc.  
PIC18F2221/2321/4221/4321 FAMILY  
27.2 DC Characteristics: Power-Down and Supply Current  
PIC18F2221/2321/4221/4321 (Industrial)  
PIC18LF2221/2321/4221/4321 (Industrial) (Continued)  
PIC18LF2221/2321/4221/4321  
Standard Operating Conditions (unless otherwise stated)  
(Industrial)  
Operating temperature  
-40°C TA +85°C for industrial  
Standard Operating Conditions (unless otherwise stated)  
PIC18F2221/2321/4221/4321  
Operating temperature  
-40°C TA +85°C for industrial  
-40°C TA +125°C for extended  
(Industrial, Extended)  
Param  
Device  
No.  
Typ  
Max Units  
Conditions  
(2)  
Supply Current (IDD)  
PIC18LF2X21/4X21 0.22 0.35  
0.22 0.35  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
μA  
-40°C  
+25°C  
+85°C  
-40°C  
VDD = 2.0V  
VDD = 3.0V  
0.21  
0.3  
PIC18LF2X21/4X21 0.51 0.55  
0.45 0.50  
FOSC = 1 MHz  
(PRI_RUN mode,  
EC oscillator)  
+25°C  
+85°C  
-40°C  
0.39 0.45  
All Devices 1.14 1.15  
0.99  
1.1  
1.1  
+25°C  
+85°C  
+125°C  
-40°C  
VDD = 5.0V  
0.83  
Extended Devices Only 0.80  
1.1  
PIC18LF2X21/4X21 610  
870  
870  
870  
610  
610  
μA  
+25°C  
+85°C  
-40°C  
VDD = 2.0V  
VDD = 3.0V  
μA  
PIC18LF2X21/4X21 1.16 1.83  
1.10 1.83  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
FOSC = 4 MHz  
(PRI_RUN mode,  
EC oscillator)  
+25°C  
+85°C  
-40°C  
1.07 1.83  
All Devices 2.35 2.85  
2.24 2.85  
+25°C  
+85°C  
+125°C  
+125°C  
+125°C  
VDD = 5.0V  
2.14 2.85  
Extended Devices Only 2.14 2.85  
Extended Devices Only  
9
15  
20  
VDD = 4.2V  
VDD = 5.0V  
FOSC = 25 MHz  
(PRI_RUN mode,  
EC oscillator)  
12  
All Devices 16  
19  
19  
mA  
mA  
mA  
mA  
mA  
mA  
-40°C  
+25°C  
+85°C  
-40°C  
+25°C  
+85°C  
14  
VDD = 4.2V  
VDD = 5.0V  
FOSC = 40 MHz  
(PRI_RUN mode,  
EC oscillator)  
14  
19  
All Devices 17  
22.7  
22.7  
22.7  
17  
17  
Legend: Shading of rows is to assist in readability of the table.  
Note 1: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured  
with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD or VSS, and all features that  
add delta current disabled (such as WDT, Timer1 Oscillator, BOR, etc.).  
2: The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin  
loading and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have  
an impact on the current consumption.  
The test conditions for all IDD measurements in active operation mode are:  
OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD or VSS;  
MCLR = VDD; WDT enabled/disabled as specified.  
3: Low-power, Timer1 oscillator is selected unless otherwise indicated, where LPT1OSC (CONFIG3H<2>) = 1.  
4: BOR and HLVD enable internal band gap reference. With both modules enabled, current consumption will be less  
than the sum of both specifications.  
5: When operation below -10°C is expected, use T1OSC High-Power mode, where LPT1OSC (CONFIG3H<2>) = 0.  
© 2009 Microchip Technology Inc.  
DS39689F-page 341  
PIC18F2221/2321/4221/4321 FAMILY  
27.2 DC Characteristics: Power-Down and Supply Current  
PIC18F2221/2321/4221/4321 (Industrial)  
PIC18LF2221/2321/4221/4321 (Industrial) (Continued)  
PIC18LF2221/2321/4221/4321  
Standard Operating Conditions (unless otherwise stated)  
Operating temperature -40°C TA +85°C for industrial  
(Industrial)  
Standard Operating Conditions (unless otherwise stated)  
PIC18F2221/2321/4221/4321  
Operating temperature  
-40°C TA +85°C for industrial  
-40°C TA +125°C for extended  
(Industrial, Extended)  
Param  
Device  
No.  
Typ  
Max Units  
Conditions  
(2)  
Supply Current (IDD)  
All Devices  
7
6
6
6
10  
10  
10  
10  
12  
12  
12  
12  
19  
19  
19  
23  
23  
23  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
-40°C  
FOSC = 4 MHz,  
16 MHz internal  
(PRI_RUN HS+PLL)  
+25°C  
VDD = 4.2V  
+85°C  
Extended Devices Only  
+125°C  
-40°C  
All Devices 10  
FOSC = 4 MHz,  
16 MHz internal  
(PRI_RUN HS+PLL)  
9
9
+25°C  
+85°C  
+125°C  
-40°C  
VDD = 5.0V  
Extended Devices Only  
9
All Devices 17  
FOSC = 10 MHz,  
40 MHz internal  
(PRI_RUN HS+PLL)  
15  
+25°C  
+85°C  
-40°C  
VDD = 4.2V  
VDD = 5.0V  
15  
All Devices 18  
FOSC = 10 MHz,  
40 MHz internal  
(PRI_RUN HS+PLL)  
18  
18  
+25°C  
+85°C  
Legend: Shading of rows is to assist in readability of the table.  
Note 1: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured  
with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD or VSS, and all features that  
add delta current disabled (such as WDT, Timer1 Oscillator, BOR, etc.).  
2: The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin  
loading and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have  
an impact on the current consumption.  
The test conditions for all IDD measurements in active operation mode are:  
OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD or VSS;  
MCLR = VDD; WDT enabled/disabled as specified.  
3: Low-power, Timer1 oscillator is selected unless otherwise indicated, where LPT1OSC (CONFIG3H<2>) = 1.  
4: BOR and HLVD enable internal band gap reference. With both modules enabled, current consumption will be less  
than the sum of both specifications.  
5: When operation below -10°C is expected, use T1OSC High-Power mode, where LPT1OSC (CONFIG3H<2>) = 0.  
DS39689F-page 342  
© 2009 Microchip Technology Inc.  
PIC18F2221/2321/4221/4321 FAMILY  
27.2 DC Characteristics: Power-Down and Supply Current  
PIC18F2221/2321/4221/4321 (Industrial)  
PIC18LF2221/2321/4221/4321 (Industrial) (Continued)  
PIC18LF2221/2321/4221/4321  
Standard Operating Conditions (unless otherwise stated)  
(Industrial)  
Operating temperature  
-40°C TA +85°C for industrial  
Standard Operating Conditions (unless otherwise stated)  
PIC18F2221/2321/4221/4321  
Operating temperature  
-40°C TA +85°C for industrial  
-40°C TA +125°C for extended  
(Industrial, Extended)  
Param  
Device  
No.  
Typ  
Max Units  
Conditions  
(2)  
Supply Current (IDD)  
PIC18LF2X21/4X21 51  
75  
75  
μA  
μA  
μA  
μA  
μA  
μA  
μA  
μA  
μA  
μA  
μA  
μA  
μA  
μA  
μA  
μA  
mA  
mA  
mA  
mA  
mA  
mA  
-40°C  
54  
+25°C  
+85°C  
-40°C  
VDD = 2.0V  
VDD = 3.0V  
60  
75  
PIC18LF2X21/4X21 83  
123  
123  
123  
260  
260  
260  
260  
290  
290  
290  
480  
480  
480  
1
FOSC = 1 MHz  
(PRI_IDLE mode,  
EC oscillator)  
88  
+25°C  
+85°C  
-40°C  
93  
All Devices 180  
180  
+25°C  
+85°C  
+125°C  
-40°C  
VDD = 5.0V  
180  
Extended Devices Only 190  
PIC18LF2X21/4X21 210  
220  
+25°C  
+85°C  
-40°C  
VDD = 2.0V  
VDD = 3.0V  
230  
PIC18LF2X21/4X21 350  
FOSC = 4 MHz  
(PRI_IDLE mode,  
EC oscillator)  
360  
+25°C  
+85°C  
-40°C  
370  
All Devices 0.69  
0.70  
1
+25°C  
+85°C  
+125°C  
+125°C  
+125°C  
VDD = 5.0V  
0.72  
Extended Devices Only 0.74  
Extended Devices Only 3.7  
4.6  
1
1
4.0  
5.0  
VDD = 4.2V  
VDD = 5.0V  
FOSC = 25 MHz  
(PRI_IDLE mode,  
EC oscillator)  
All Devices 6.0  
7.3  
7.3  
7.3  
9.2  
9.2  
9.2  
mA  
mA  
mA  
mA  
mA  
mA  
-40°C  
+25°C  
+85°C  
-40°C  
+25°C  
+85°C  
6.2  
VDD = 4.2V  
VDD = 5.0V  
FOSC = 40 MHz  
(PRI_IDLE mode,  
EC oscillator)  
6.6  
All Devices 6.8  
7.0  
7.1  
Legend: Shading of rows is to assist in readability of the table.  
Note 1: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured  
with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD or VSS, and all features that  
add delta current disabled (such as WDT, Timer1 Oscillator, BOR, etc.).  
2: The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin  
loading and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have  
an impact on the current consumption.  
The test conditions for all IDD measurements in active operation mode are:  
OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD or VSS;  
MCLR = VDD; WDT enabled/disabled as specified.  
3: Low-power, Timer1 oscillator is selected unless otherwise indicated, where LPT1OSC (CONFIG3H<2>) = 1.  
4: BOR and HLVD enable internal band gap reference. With both modules enabled, current consumption will be less  
than the sum of both specifications.  
5: When operation below -10°C is expected, use T1OSC High-Power mode, where LPT1OSC (CONFIG3H<2>) = 0.  
© 2009 Microchip Technology Inc.  
DS39689F-page 343  
PIC18F2221/2321/4221/4321 FAMILY  
27.2 DC Characteristics: Power-Down and Supply Current  
PIC18F2221/2321/4221/4321 (Industrial)  
PIC18LF2221/2321/4221/4321 (Industrial) (Continued)  
PIC18LF2221/2321/4221/4321  
Standard Operating Conditions (unless otherwise stated)  
Operating temperature -40°C TA +85°C for industrial  
(Industrial)  
Standard Operating Conditions (unless otherwise stated)  
PIC18F2221/2321/4221/4321  
Operating temperature  
-40°C TA +85°C for industrial  
-40°C TA +125°C for extended  
(Industrial, Extended)  
Param  
Device  
No.  
Typ  
Max Units  
Conditions  
(2)  
Supply Current (IDD)  
(5)  
PIC18LF2X21/4X21 12  
19  
19  
19  
19  
45  
45  
45  
45  
115  
110  
110  
88  
5
μA  
μA  
μA  
μA  
μA  
μA  
μA  
μA  
μA  
μA  
μA  
μA  
μA  
μA  
μA  
μA  
μA  
μA  
μA  
μA  
μA  
μA  
μA  
μA  
-40°C  
-10°C  
+25°C  
+85°C  
VDD = 2.0V  
VDD = 3.0V  
VDD = 5.0V  
VDD = 2.0V  
VDD = 3.0V  
VDD = 5.0V  
13  
13  
(5)  
PIC18LF2X21/4X21 40  
-40°C  
-10°C  
+25°C  
+85°C  
FOSC = 32 kHz  
(SEC_RUN mode,  
33  
(3)  
Timer1 as clock)  
27  
(5)  
All Devices 101  
-40°C  
-10°C  
+25°C  
+85°C  
83  
65  
(5)  
PIC18LF2X21/4X21 2.5  
-40°C  
-10°C  
+25°C  
+85°C  
5
3.0  
5
3.5  
8
(5)  
PIC18LF2X21/4X21 3.9  
7
-40°C  
-10°C  
+25°C  
+85°C  
FOSC = 32 kHz  
7
(SEC_IDLE mode,  
4.5  
7
(3)  
Timer1 as clock)  
5.2  
10.7  
10  
10  
10  
15  
(5)  
All Devices 7.5  
-40°C  
-10°C  
+25°C  
+85°C  
8.0  
8.6  
Legend: Shading of rows is to assist in readability of the table.  
Note 1: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured  
with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD or VSS, and all features that  
add delta current disabled (such as WDT, Timer1 Oscillator, BOR, etc.).  
2: The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin  
loading and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have  
an impact on the current consumption.  
The test conditions for all IDD measurements in active operation mode are:  
OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD or VSS;  
MCLR = VDD; WDT enabled/disabled as specified.  
3: Low-power, Timer1 oscillator is selected unless otherwise indicated, where LPT1OSC (CONFIG3H<2>) = 1.  
4: BOR and HLVD enable internal band gap reference. With both modules enabled, current consumption will be less  
than the sum of both specifications.  
5: When operation below -10°C is expected, use T1OSC High-Power mode, where LPT1OSC (CONFIG3H<2>) = 0.  
DS39689F-page 344  
© 2009 Microchip Technology Inc.  
PIC18F2221/2321/4221/4321 FAMILY  
27.2 DC Characteristics: Power-Down and Supply Current  
PIC18F2221/2321/4221/4321 (Industrial)  
PIC18LF2221/2321/4221/4321 (Industrial) (Continued)  
PIC18LF2221/2321/4221/4321  
Standard Operating Conditions (unless otherwise stated)  
(Industrial)  
Operating temperature  
-40°C TA +85°C for industrial  
Standard Operating Conditions (unless otherwise stated)  
PIC18F2221/2321/4221/4321  
Operating temperature  
-40°C TA +85°C for industrial  
-40°C TA +125°C for extended  
(Industrial, Extended)  
Param  
Device  
No.  
Typ  
Max Units  
Conditions  
Module Differential Currents (ΔIWDT, ΔIBOR, ΔILVD, ΔIOSCB, ΔIAD)  
D022  
(ΔIWDT)  
Watchdog Timer 1.6  
2.5  
2.5  
2.5  
3.5  
3.5  
3
μA  
μA  
μA  
μA  
μA  
μA  
μA  
μA  
μA  
μA  
μA  
μA  
-40°C  
+25°C  
1.6  
1.5  
2.3  
2.2  
2.1  
3.4  
3.9  
4.4  
VDD = 2.0V  
VDD = 3.0V  
+85°C  
-40°C  
+25°C  
+85°C  
7.4  
7.4  
7.4  
7.4  
45  
-40°C  
+25°C  
VDD = 5.0V  
+85°C  
4.5  
+125°C  
-40°C to +85°C  
-40°C to +85°C  
(4)  
D022A  
(ΔIBOR)  
Brown-out Reset  
34  
40  
42  
0
VDD = 3.0V  
VDD = 5.0V  
62.6  
62.6  
2
μA -40°C to +125°C  
μA -40°C to +85°C  
μA -40°C to +125°C  
VDD = 3.0V  
VDD = 5.0V  
VDD = 2.0V  
VDD = 3.0V  
Sleep mode,  
BOREN<1:0> = 10  
0
5
D022B  
(ΔILVD)  
High/Low-Voltage 23  
35  
μA  
μA  
μA  
-40°C to +85°C  
-40°C to +85°C  
-40°C to +85°C  
(4)  
Detect  
23  
28  
30  
35  
35  
VDD = 5.0V  
40  
μA -40°C to +125°C  
Legend: Shading of rows is to assist in readability of the table.  
Note 1: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured  
with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD or VSS, and all features that  
add delta current disabled (such as WDT, Timer1 Oscillator, BOR, etc.).  
2: The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin  
loading and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have  
an impact on the current consumption.  
The test conditions for all IDD measurements in active operation mode are:  
OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD or VSS;  
MCLR = VDD; WDT enabled/disabled as specified.  
3: Low-power, Timer1 oscillator is selected unless otherwise indicated, where LPT1OSC (CONFIG3H<2>) = 1.  
4: BOR and HLVD enable internal band gap reference. With both modules enabled, current consumption will be less  
than the sum of both specifications.  
5: When operation below -10°C is expected, use T1OSC High-Power mode, where LPT1OSC (CONFIG3H<2>) = 0.  
© 2009 Microchip Technology Inc.  
DS39689F-page 345  
PIC18F2221/2321/4221/4321 FAMILY  
27.2 DC Characteristics: Power-Down and Supply Current  
PIC18F2221/2321/4221/4321 (Industrial)  
PIC18LF2221/2321/4221/4321 (Industrial) (Continued)  
PIC18LF2221/2321/4221/4321  
Standard Operating Conditions (unless otherwise stated)  
Operating temperature -40°C TA +85°C for industrial  
(Industrial)  
Standard Operating Conditions (unless otherwise stated)  
PIC18F2221/2321/4221/4321  
Operating temperature  
-40°C TA +85°C for industrial  
-40°C TA +125°C for extended  
(Industrial, Extended)  
Param  
Device  
No.  
Typ  
Max Units  
Conditions  
(5)  
D025  
(ΔIOSCB)  
Timer1 Oscillator 2.1  
4.5  
4.5  
4.5  
4.5  
6.0  
6
μA  
μA  
μA  
μA  
μA  
μA  
μA  
μA  
μA  
μA  
μA  
μA  
μA  
μA  
μA  
-40°C  
-10°C  
+25°C  
+85°C  
VDD = 2.0V  
VDD = 3.0V  
VDD = 5.0V  
1.8  
2.1  
(5)  
2.2  
-40°C  
-10°C  
+25°C  
+85°C  
32 kHz Tuning Fork,  
Crystal on Timer1  
2.6  
6.0  
6.0  
8.0  
8
(3)  
Oscillator  
2.9  
(5)  
3.0  
-40°C  
-10°C  
3.2  
8.0  
8.0  
2.0  
2.0  
2.0  
8.0  
+25°C  
3.4  
+85°C  
D026  
(ΔIAD)  
A/D Converter 1.0  
-40°C to +85°C  
-40°C to +85°C  
-40°C to +85°C  
VDD = 2.0V  
VDD = 3.0V  
1.0  
1.0  
2.0  
A/D on, Not Converting  
VDD = 5.0V  
μA -40°C to +125°C  
Legend: Shading of rows is to assist in readability of the table.  
Note 1: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured  
with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD or VSS, and all features that  
add delta current disabled (such as WDT, Timer1 Oscillator, BOR, etc.).  
2: The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin  
loading and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have  
an impact on the current consumption.  
The test conditions for all IDD measurements in active operation mode are:  
OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD or VSS;  
MCLR = VDD; WDT enabled/disabled as specified.  
3: Low-power, Timer1 oscillator is selected unless otherwise indicated, where LPT1OSC (CONFIG3H<2>) = 1.  
4: BOR and HLVD enable internal band gap reference. With both modules enabled, current consumption will be less  
than the sum of both specifications.  
5: When operation below -10°C is expected, use T1OSC High-Power mode, where LPT1OSC (CONFIG3H<2>) = 0.  
DS39689F-page 346  
© 2009 Microchip Technology Inc.  
PIC18F2221/2321/4221/4321 FAMILY  
27.3 DC Characteristics: PIC18F2221/2321/4221/4321 (Industrial)  
PIC18LF2221/2321/4221/4321 (Industrial)  
Standard Operating Conditions (unless otherwise stated)  
DC CHARACTERISTICS  
Operating temperature -40°C TA +85°C for industrial  
-40°C TA +125°C for extended  
Param  
Symbol  
No.  
Characteristic  
Min  
Max  
Units  
Conditions  
VIL  
Input Low Voltage  
I/O Ports:  
with TTL Buffer  
D030  
VSS  
0.15 VDD  
0.8  
V
V
V
V
V
V
V
VDD < 4.5V  
D030A  
D031  
4.5V VDD 5.5V  
with Schmitt Trigger Buffer  
RC3 and RC4  
VSS  
VSS  
VSS  
VSS  
VSS  
0.2 VDD  
0.3 VDD  
0.8  
D031A  
D031B  
D032  
I2C™ enabled  
SMBus enabled  
MCLR  
OSC1  
0.2 VDD  
0.3 VDD  
D033  
HS, HSPLL modes  
D033A  
D033B  
D034  
OSC1  
OSC1  
T13CKI  
VSS  
VSS  
VSS  
0.2 VDD  
0.3  
0.3  
V
V
V
RC, EC modes(1)  
XT, LP modes  
VIH  
Input High Voltage  
I/O Ports:  
D040  
with TTL Buffer  
0.25 VDD +  
0.8V  
VDD  
V
VDD < 4.5V  
D040A  
D041  
2.0  
VDD  
VDD  
VDD  
VDD  
V
V
V
V
4.5V VDD 5.5V  
with Schmitt Trigger Buffer  
RC3 and RC4  
0.8 VDD  
0.7 VDD  
2.1  
D041A  
D041B  
I2C™ enabled  
SMBus enabled,  
VSS 3V  
D042  
D043  
MCLR  
OSC1  
0.8 VDD  
0.7 VDD  
VDD  
VDD  
V
V
HS, HSPLL modes  
D043A  
D043B  
D043C  
D044  
OSC1  
OSC1  
OSC1  
T13CKI  
0.8 VDD  
0.9 VDD  
1.6  
VDD  
VDD  
VDD  
VDD  
V
V
V
V
EC mode  
RC mode(1)  
XT, LP modes  
1.6  
IIL  
Input Leakage Current(2,3)  
D060  
I/O Ports  
±200  
±50  
nA VDD < 5.5V,  
VSS VPIN VDD,  
Pin at High-Impedance  
nA VDD < 3V,  
VSS VPIN VDD,  
Pin at High-Impedance  
D061  
D063  
MCLR  
OSC1  
±1  
±1  
μA Vss VPIN VDD  
μA Vss VPIN VDD  
Note 1: In RC oscillator configuration, the OSC1/CLKI pin is a Schmitt Trigger input. It is not recommended that the  
PIC® device be driven with an external clock while in RC mode.  
2: The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified  
levels represent normal operating conditions. Higher leakage current may be measured at different input  
voltages.  
3: Negative current is defined as current sourced by the pin.  
© 2009 Microchip Technology Inc.  
DS39689F-page 347  
PIC18F2221/2321/4221/4321 FAMILY  
27.3 DC Characteristics: PIC18F2221/2321/4221/4321 (Industrial)  
PIC18LF2221/2321/4221/4321 (Industrial) (Continued)  
Standard Operating Conditions (unless otherwise stated)  
DC CHARACTERISTICS  
Operating temperature -40°C TA +85°C for industrial  
-40°C TA +125°C for extended  
Param  
Symbol  
No.  
Characteristic  
Min  
Max  
Units  
Conditions  
IPU  
Weak Pull-up Current  
PORTB Weak Pull-up Current  
Output Low Voltage  
I/O Ports  
D070  
IPURB  
VOL  
50  
400  
μA VDD = 5V, VPIN = VSS  
D080  
D083  
0.6  
0.6  
V
V
IOL = 8.5 mA, VDD = 4.5V,  
-40°C to +85°C  
OSC2/CLKO  
IOL = 1.6 mA, VDD = 4.5V,  
(RC, RCIO, EC, ECIO modes)  
-40°C to +85°C  
VOH  
Output High Voltage(3)  
D090  
D092  
I/O Ports  
VDD – 0.7  
VDD – 0.7  
V
V
IOH = -3.0 mA, VDD = 4.5V,  
-40°C to +85°C  
OSC2/CLKO  
IOH = -1.3 mA, VDD = 4.5V,  
(RC, RCIO, EC, ECIO modes)  
-40°C to +85°C  
Capacitive Loading Specs  
on Output Pins  
D100  
D101  
D102  
COSC2 OSC2 Pin  
15  
50  
pF In XT, HS and LP modes  
when external clock is used  
to drive OSC1  
CIO  
CB  
All I/O Pins and OSC2  
(in RC mode)  
pF Maximum that allows the  
AC Timing Specifications to  
be met  
SCL, SDA  
400  
pF Maximum bus capacitance  
permitted by I2C™  
Specification  
Note 1: In RC oscillator configuration, the OSC1/CLKI pin is a Schmitt Trigger input. It is not recommended that the  
PIC® device be driven with an external clock while in RC mode.  
2: The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified  
levels represent normal operating conditions. Higher leakage current may be measured at different input  
voltages.  
3: Negative current is defined as current sourced by the pin.  
DS39689F-page 348  
© 2009 Microchip Technology Inc.  
PIC18F2221/2321/4221/4321 FAMILY  
TABLE 27-1: MEMORY PROGRAMMING REQUIREMENTS  
Standard Operating Conditions (unless otherwise stated)  
Operating temperature -40°C TA +85°C for industrial  
-40°C TA +125°C for extended  
DC CHARACTERISTICS  
Param  
Sym  
No.  
Characteristic  
Min  
Typ†  
Max  
Units  
Conditions  
Data EEPROM Memory  
D120  
ED  
Byte Endurance  
1M  
10M  
E/W -40°C to +85°C  
D121 VDRW VDD for Read/Write  
VMIN  
5.5  
V
Using EECON to read/write,  
VMIN = Minimum operating  
voltage  
D122 TDEW Erase/Write Cycle Time  
D123 TRETD Characteristic Retention  
4
ms  
40  
Year Provided no other  
specifications are violated  
D124  
D125  
TREF  
IDDP  
Number of Total Erase/Write  
Cycles before Refresh(1)  
100K  
1M  
10  
E/W -40°C to +85°C  
Supply Current during  
Programming  
mA  
Program Flash Memory  
Cell Endurance  
D130  
D131  
EP  
10K  
100K  
E/W -40°C to +85°C  
VPR  
VDD for Read  
VMIN  
5.5  
V
VMIN = Minimum operating  
voltage  
D132  
VIE  
VDD for Block Erase  
3.0  
5.5  
5.5  
V
V
Using ICSP™ port, 25°C  
D132B VPEW VDD for Self-Timed Write  
VMIN  
VMIN = Minimum operating  
voltage  
D133A TIW  
Self-Timed Write Cycle Time  
2
ms  
D134 TRETD Characteristic Retention  
40  
100  
Year Provided no other  
specifications are violated  
D135  
IDDP  
Supply Current during  
Programming  
10  
mA  
Data in “Typ” column is at 5.0V, 25°C unless otherwise stated. These parameters are for design guidance  
only and are not tested.  
Note 1: Refer to Section 8.7 “Using the Data EEPROM” for a more detailed discussion on data EEPROM  
endurance.  
© 2009 Microchip Technology Inc.  
DS39689F-page 349  
PIC18F2221/2321/4221/4321 FAMILY  
TABLE 27-2: COMPARATOR SPECIFICATIONS  
Operating Conditions: 3.0V < VDD < 5.5V, -40°C < TA < +85°C for industrial (unless otherwise stated)  
-40°C < TA < +125°C for extended (unless otherwise stated)  
Param  
No.  
Sym  
Characteristics  
Input Offset Voltage  
Min  
Typ  
Max  
Units  
Comments  
D300  
VIOFF  
0
±5.0  
±10  
VDD – 1.5  
mV  
V
D301  
D302  
D303  
D303A  
VICM  
Input Common Mode Voltage  
Common Mode Rejection Ratio  
Response Time(1)  
CMRR  
TRESP  
55  
dB  
ns  
ns  
150  
150  
400  
PIC18FXXXX  
600  
PIC18LFXXXX,  
VDD = 2.0V  
D304  
TMC2OV Comparator Mode Change to  
Output Valid  
10  
μs  
Note 1: Response time measured with one comparator input at (VDD 1.5)/2, while the other input transitions  
from VSS to VDD.  
TABLE 27-3: VOLTAGE REFERENCE SPECIFICATIONS  
Operating Conditions: 3.0V < VDD < 5.5V, -40°C < TA < +85°C for industrial (unless otherwise stated)  
-40°C < TA < +125°C for extended (unless otherwise stated)  
Param  
No.  
Sym  
Characteristics  
Resolution  
Min  
Typ  
Max  
Units  
Comments  
D310  
VRES  
VDD/24  
2k  
VDD/32  
1/2  
LSb  
LSb  
Ω
D311  
D312  
D310  
VRAA  
VRUR  
TSET  
Absolute Accuracy  
Unit Resistor Value (R)  
Settling Time(1)  
10  
μs  
Note 1: Settling time measured while CVRR = 1and CVR<3:0> transitions from ‘0000’ to ‘1111’.  
DS39689F-page 350  
© 2009 Microchip Technology Inc.  
PIC18F2221/2321/4221/4321 FAMILY  
FIGURE 27-4:  
HIGH/LOW-VOLTAGE DETECT CHARACTERISTICS  
VDD  
(HLVDIF can be  
cleared in software)  
VLVD  
(HLVDIF set by hardware)  
HLVDIF(1)  
Note 1: VDIRMAG = 0.  
TABLE 27-4: HIGH/LOW-VOLTAGE DETECT CHARACTERISTICS  
Standard Operating Conditions (unless otherwise stated)  
Operating temperature -40°C TA +85°C for industrial  
-40°C TA +125°C for extended  
Param  
No.  
Symbol  
Characteristic  
Min  
Typ  
Max  
Units  
Conditions  
D420  
HLVD Voltage on VDD LVV = 0000 2.06  
2.17  
2.23  
2.36  
2.44  
2.60  
2.79  
2.89  
3.12  
3.39  
3.55  
3.71  
3.90  
4.11  
4.33  
4.59  
1.20  
2.28  
2.34  
2.48  
2.56  
2.73  
2.93  
3.04  
3.28  
3.56  
3.73  
3.90  
4.10  
4.32  
4.55  
4.82  
1.30  
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
Transition High-to-Low  
LVV = 0001 2.12  
LVV = 0010 2.24  
LVV = 0011 2.32  
LVV = 0100 2.47  
LVV = 0101 2.65  
LVV = 0110 2.74  
LVV = 0111 2.96  
LVV = 1000 3.22  
LVV = 1001 3.37  
LVV = 1010 3.52  
LVV = 1011 3.70  
LVV = 1100 3.90  
LVV = 1101 4.11  
LVV = 1110 4.36  
LVV = 1111 1.10  
HLVDIN Input/Internal  
Reference Voltage  
© 2009 Microchip Technology Inc.  
DS39689F-page 351  
PIC18F2221/2321/4221/4321 FAMILY  
27.4 AC (Timing) Characteristics  
27.4.1  
TIMING PARAMETER SYMBOLOGY  
The timing parameter symbols have been created  
using one of the following formats:  
1. TppS2ppS  
2. TppS  
T
3. TCC:ST  
4. Ts  
(I2C specifications only)  
(I2C specifications only)  
F
Frequency  
T
Time  
Lowercase letters (pp) and their meanings:  
pp  
cc  
ck  
cs  
di  
CCP1  
CLKO  
CS  
osc  
rd  
OSC1  
RD  
rw  
sc  
ss  
t0  
RD or WR  
SCK  
SDI  
do  
dt  
SDO  
SS  
Data in  
I/O port  
MCLR  
T0CKI  
T13CKI  
WR  
io  
t1  
mc  
wr  
Uppercase letters and their meanings:  
S
F
Fall  
P
R
V
Z
Period  
H
High  
Rise  
I
L
Invalid (High-impedance)  
Low  
Valid  
High-impedance  
I2C only  
AA  
output access  
Bus free  
High  
Low  
High  
Low  
BUF  
TCC:ST (I2C specifications only)  
CC  
HD  
Hold  
SU  
Setup  
ST  
DAT  
STA  
DATA input hold  
Start condition  
STO  
Stop condition  
DS39689F-page 352  
© 2009 Microchip Technology Inc.  
PIC18F2221/2321/4221/4321 FAMILY  
27.4.2  
TIMING CONDITIONS  
Note:  
Because of space limitations, the generic  
terms “PIC18FXXXX” and “PIC18LFXXXX”  
are used throughout this section to refer to  
the PIC18F2221/2321/4221/4321 and  
PIC18LF2221/2321/4221/4321 families of  
devices specifically and only those devices.  
The temperature and voltages specified in Table 27-5  
apply to all timing specifications unless otherwise  
noted. Figure 27-5 specifies the load conditions for the  
timing specifications.  
TABLE 27-5: TEMPERATURE AND VOLTAGE SPECIFICATIONS – AC  
Standard Operating Conditions (unless otherwise stated)  
Operating temperature  
-40°C TA +85°C for industrial  
-40°C TA +125°C for extended  
AC CHARACTERISTICS  
Operating voltage VDD range as described in DC spec Section 27.1 and  
Section 27.3.  
LF parts operate for industrial temperatures only.  
FIGURE 27-5:  
LOAD CONDITIONS FOR DEVICE TIMING SPECIFICATIONS  
Load Condition 1 Load Condition 2  
VDD/2  
CL  
RL  
Pin  
VSS  
CL  
Pin  
RL = 464Ω  
CL = 50 pF for all pins except OSC2/CLKO  
and including D and E outputs as ports  
VSS  
© 2009 Microchip Technology Inc.  
DS39689F-page 353  
PIC18F2221/2321/4221/4321 FAMILY  
27.4.3  
TIMING DIAGRAMS AND SPECIFICATIONS  
FIGURE 27-6:  
EXTERNAL CLOCK TIMING (ALL MODES EXCEPT PLL)  
Q4  
Q1  
1
Q2  
Q3  
Q4  
Q1  
OSC1  
CLKO  
3
4
3
4
2
TABLE 27-6: EXTERNAL CLOCK TIMING REQUIREMENTS  
Param.  
Symbol  
Characteristic  
Min  
Max  
Units  
Conditions  
No.  
1A  
FOSC  
External CLKI Frequency(1)  
DC  
DC  
DC  
4
1
25  
40  
10  
50  
4
MHz XT, RC Oscillator mode  
MHz HS Oscillator mode  
MHz EC Oscillator mode  
MHz HS+PLL Oscillator mode  
kHz LP Oscillator mode  
MHz RC Oscillator mode  
MHz XT Oscillator mode  
MHz HS Oscillator mode  
kHz LP Oscillator mode  
DC  
DC  
0.1  
4
Oscillator Frequency(1)  
External CLKI Period(1)  
4
25  
200  
250  
1
5
1
TOSC  
1000  
40  
ns  
ns  
ns  
ns  
μs  
ns  
μs  
ns  
μs  
ns  
ns  
ns  
μs  
ns  
ns  
ns  
ns  
XT, RC Oscillator mode  
HS Oscillator mode  
EC Oscillator mode  
HS+PLL Oscillator mode  
LP Oscillator mode  
RC Oscillator mode  
XT Oscillator mode  
HS Oscillator mode  
LP Oscillator mode  
TCY = 4/FOSC, Industrial  
TCY = 4/FOSC, Extended  
XT Oscillator mode  
LP Oscillator mode  
HS Oscillator mode  
XT Oscillator mode  
LP Oscillator mode  
HS Oscillator mode  
25  
100  
32  
Oscillator Period(1)  
250  
250  
40  
250  
209  
20  
50  
7.5  
5
2
3
TCY  
Instruction Cycle Time(1)  
100  
160  
30  
TOSL,  
TOSH  
External Clock in (OSC1)  
High or Low Time  
2.5  
10  
4
TOSR,  
TOSF  
External Clock in (OSC1)  
Rise or Fall Time  
Note 1: Instruction cycle period (TCY) equals four times the input oscillator time base period for all configurations  
except PLL. All specified values are based on characterization data for that particular oscillator type under  
standard operating conditions with the device executing code. Exceeding these specified limits may result  
in an unstable oscillator operation and/or higher than expected current consumption. All devices are tested  
to operate at “min.” values with an external clock applied to the OSC1/CLKI pin. When an external clock  
input is used, the “max.” cycle time limit is “DC” (no clock) for all devices.  
DS39689F-page 354  
© 2009 Microchip Technology Inc.  
PIC18F2221/2321/4221/4321 FAMILY  
TABLE 27-7: PLL CLOCK TIMING SPECIFICATIONS (VDD = 4.2V TO 5.5V)  
Param  
No.  
Sym  
Characteristic  
Min  
Typ†  
Max  
Units Conditions  
F10  
F11  
F12  
F13  
FOSC Oscillator Frequency Range  
4
10  
40  
2
MHz HS mode only  
FSYS On-Chip VCO System Frequency  
16  
-2  
MHz HS mode only  
trc  
PLL Start-up Time (Lock Time)  
ms  
%
ΔCLK CLKO Stability (Jitter)  
+2  
Data in “Typ” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance  
only and are not tested.  
TABLE 27-8: AC CHARACTERISTICS: INTERNAL RC ACCURACY  
Standard Operating Conditions (unless otherwise stated)  
Operating temperature  
-40°C TA +85°C for industrial  
-40°C TA +125°C for extended  
Param  
No.  
Device  
Min  
Typ  
Max  
Units  
Conditions  
(1)  
INTOSC Accuracy @ Freq = 8 MHz, 4 MHz, 2 MHz, 1 MHz, 500 kHz, 250 kHz, 125 kHz, 31 kHz  
PIC18LF2221/2321/4221/4321  
-2  
-5  
+/-1  
2
5
%
%
%
%
%
%
+25°C  
VDD = 2.0-5.5V  
VDD = 2.0-5.5V  
VDD = 2.0-5.5V  
VDD = 4.2-5.5V  
VDD = 4.2-5.5V  
VDD = 4.2-5.5V  
-10°C to +85°C  
-40°C to +85°C  
+25°C  
-10  
-2  
+/-1  
+/-1  
10  
2
PIC18F2221/2321/4221/4321  
-5  
5
-10°C to +85°C  
-40°C to +85°C  
-10  
+/-1  
10  
INTRC Accuracy @ Freq = 31 kHz  
PIC18LF2221/2321/4221/4321 26.562  
PIC18F2221/2321/4221/4321 26.562  
35.938  
35.938  
kHz  
kHz  
-40°C to +85°C  
-40°C to +85°C  
VDD = 2.0-5.5V  
VDD = 4.2-5.5V  
Note 1: Frequency calibrated at 25°C. OSCTUNE register can be used to compensate for temperature drift.  
© 2009 Microchip Technology Inc.  
DS39689F-page 355  
PIC18F2221/2321/4221/4321 FAMILY  
FIGURE 27-7:  
CLKO AND I/O TIMING  
Q1  
Q2  
Q3  
Q4  
OSC1  
11  
10  
CLKO  
13  
14  
12  
19  
18  
16  
I/O pin  
(Input)  
15  
17  
I/O pin  
(Output)  
New Value  
Old Value  
20, 21  
Refer to Figure 27-5 for load conditions.  
Note:  
TABLE 27-9: CLKO AND I/O TIMING REQUIREMENTS  
Param  
Symbol  
Characteristic  
Min  
Typ  
Max  
Units Conditions  
No.  
10  
TosH2ckL OSC1 to CLKO ↓  
TosH2ckH OSC1 to CLKO ↑  
75  
75  
35  
35  
50  
200  
200  
100  
100  
ns  
ns  
ns  
ns  
(Note 1)  
(Note 1)  
(Note 1)  
(Note 1)  
(Note 1)  
(Note 1)  
(Note 1)  
11  
12  
13  
14  
15  
16  
17  
18  
18A  
TckR  
TckF  
CLKO Rise Time  
CLKO Fall Time  
TckL2ioV CLKO to Port Out Valid  
TioV2ckH Port In Valid before CLKO ↑  
TckH2ioI Port In Hold after CLKO ↑  
TosH2ioV OSC1 (Q1 cycle) to Port Out Valid  
0.5 TCY + 20 ns  
0.25 TCY + 25  
ns  
ns  
ns  
ns  
0
150  
TosH2ioI OSC1 (Q2 cycle) to  
Port Input Invalid  
PIC18FXXXX  
100  
200  
PIC18LFXXXX  
ns VDD = 2.0V  
(I/O in hold time)  
19  
TioV2osH Port Input Valid to OSC1 (I/O in setup time)  
0
10  
10  
25  
60  
25  
60  
ns  
20  
TioR  
Port Output Rise Time  
Port Output Fall Time  
PIC18FXXXX  
PIC18LFXXXX  
PIC18FXXXX  
PIC18LFXXXX  
ns  
20A  
21  
ns VDD = 2.0V  
TioF  
ns  
21A  
22†  
23†  
ns VDD = 2.0V  
TINP  
INTx Pin High or Low Time  
TCY  
TCY  
ns  
ns  
TRBP  
RB<7:4> Change INTx High or Low Time  
These parameters are asynchronous events not related to any internal clock edges.  
Note 1: Measurements are taken in RC mode, where CLKO output is 4 x TOSC.  
DS39689F-page 356  
© 2009 Microchip Technology Inc.  
PIC18F2221/2321/4221/4321 FAMILY  
FIGURE 27-8:  
RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER AND  
POWER-UP TIMER TIMING  
VDD  
MCLR  
30  
Internal  
POR  
33  
PWRT  
Time-out  
32  
OSC  
Time-out  
Internal  
Reset  
Watchdog  
Timer  
Reset  
31  
34  
34  
I/O pins  
FIGURE 27-9:  
BROWN-OUT RESET TIMING  
BVDD  
VDD  
35  
VIRVST  
Enable Internal  
Reference Voltage  
Internal Reference  
Voltage Stable  
36  
TABLE 27-10: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER, POWER-UP TIMER  
AND BROWN-OUT RESET REQUIREMENTS  
Param.  
No.  
Symbol  
Characteristic  
Min  
Typ  
Max  
Units  
Conditions  
30  
TmcL  
TWDT  
MCLR Pulse Width (low)  
2
μs  
31  
Watchdog Timer Time-out Period  
(no postscaler)  
3.56  
4.19  
4.82  
ms  
32  
33  
34  
TOST  
Oscillation Start-up Timer Period  
1024 TOSC  
67  
2
1024 TOSC  
ms  
μs  
TOSC = OSC1 period  
TPWRT Power-up Timer Period  
57  
77  
TIOZ  
I/O High-Impedance from MCLR  
Low or Watchdog Timer Reset  
35  
36  
TBOR  
Brown-out Reset Pulse Width  
200  
μs VDD BVDD (see D005)  
μs  
TIRVST Time for Internal Reference  
Voltage to become Stable  
20  
50  
37  
38  
39  
TLVD  
TCSD  
High/Low-Voltage Detect Pulse Width  
CPU Start-up Time  
200  
10  
1
μs  
μs  
μs  
VDD VLVD  
TIOBST Time for INTOSC to Stabilize  
© 2009 Microchip Technology Inc.  
DS39689F-page 357  
PIC18F2221/2321/4221/4321 FAMILY  
FIGURE 27-10:  
TIMER0 AND TIMER1 EXTERNAL CLOCK TIMINGS  
T0CKI  
41  
40  
42  
T1OSO/T13CKI  
46  
45  
47  
48  
TMR0 or  
TMR1  
TABLE 27-11: TIMER0 AND TIMER1 EXTERNAL CLOCK REQUIREMENTS  
Param  
Symbol  
Characteristic  
Min  
Max Units Conditions  
No.  
40  
Tt0H  
T0CKI High Pulse Width  
No prescaler  
With prescaler  
No prescaler  
With prescaler  
No prescaler  
With prescaler  
0.5 TCY + 20  
10  
ns  
ns  
ns  
ns  
ns  
41  
42  
Tt0L  
Tt0P  
T0CKI Low Pulse Width  
T0CKI Period  
0.5 TCY + 20  
10  
TCY + 10  
Greater of:  
20 ns or  
ns N = prescale  
value  
(TCY + 40)/N  
(1, 2, 4,..., 256)  
45  
46  
Tt1H  
Tt1L  
T13CKI  
High Time  
Synchronous, no prescaler  
0.5 TCY + 20  
ns  
Synchronous,  
with prescaler  
PIC18FXXXX  
10  
ns  
PIC18LFXXXX  
25  
ns VDD = 2.0V  
Asynchronous PIC18FXXXX  
PIC18LFXXXX  
30  
ns  
50  
ns VDD = 2.0V  
T13CKI  
Low Time  
Synchronous, no prescaler  
0.5 TCY + 5  
ns  
Synchronous,  
with prescaler  
PIC18FXXXX  
10  
25  
30  
50  
ns  
PIC18LFXXXX  
ns VDD = 2.0V  
ns  
Asynchronous PIC18FXXXX  
PIC18LFXXXX  
ns VDD = 2.0V  
47  
48  
Tt1P  
Ft1  
T13CKI  
Input  
Period  
Synchronous  
Greater of:  
20 ns or  
(TCY + 40)/N  
ns N = prescale  
value (1, 2, 4, 8)  
Asynchronous  
60  
DC  
50  
ns  
kHz  
T13CKI Oscillator Input Frequency Range  
Tcke2tmrI Delay from External T13CKI Clock Edge to  
Timer Increment  
2 TOSC  
7 TOSC  
DS39689F-page 358  
© 2009 Microchip Technology Inc.  
PIC18F2221/2321/4221/4321 FAMILY  
FIGURE 27-11:  
CAPTURE/COMPARE/PWM TIMINGS (ALL CCP MODULES)  
CCPx  
(Capture Mode)  
50  
51  
52  
54  
CCPx  
(Compare or PWM Mode)  
53  
TABLE 27-12: CAPTURE/COMPARE/PWM REQUIREMENTS (ALL CCP MODULES)  
Param  
Symbol  
Characteristic  
Min  
Max  
Units  
Conditions  
No.  
50  
TccL  
CCPx Input Low No prescaler  
0.5 TCY + 20  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
Time  
With  
PIC18FXXXX  
10  
prescaler  
PIC18LFXXXX  
20  
VDD = 2.0V  
VDD = 2.0V  
51  
TccH  
CCPx Input  
High Time  
No prescaler  
0.5 TCY + 20  
With  
PIC18FXXXX  
10  
20  
prescaler  
PIC18LFXXXX  
52  
53  
TccP  
TccR  
CCPx Input Period  
3 TCY + 40  
N
N = prescale  
value (1, 4 or 16)  
CCPx Output Fall Time  
PIC18FXXXX  
PIC18LFXXXX  
PIC18FXXXX  
PIC18LFXXXX  
25  
45  
25  
45  
ns  
ns  
ns  
ns  
VDD = 2.0V  
VDD = 2.0V  
54  
TccF  
CCPx Output Fall Time  
© 2009 Microchip Technology Inc.  
DS39689F-page 359  
PIC18F2221/2321/4221/4321 FAMILY  
FIGURE 27-12:  
PARALLEL SLAVE PORT TIMING (PIC18F4221/4321)  
RE2/CS  
RE0/RD  
RE1/WR  
65  
RD<7:0>  
62  
64  
63  
Note:  
Refer to Figure 27-5 for load conditions.  
TABLE 27-13: PARALLEL SLAVE PORT REQUIREMENTS (PIC18F4221/4321)  
Param.  
Symbol  
Characteristic  
Min  
Max Units  
Conditions  
No.  
62  
TdtV2wrH  
TwrH2dtI  
Data In Valid before WR or CS (setup time)  
20  
20  
ns  
ns  
63  
WR or CS to Data–In  
PIC18FXXXX  
Invalid (hold time)  
PIC18LFXXXX 35  
ns VDD = 2.0V  
64  
65  
66  
TrdL2dtV  
TrdH2dtI  
TibfINH  
RD and CS to Data–Out Valid  
RD or CS to Data–Out Invalid  
10  
80  
ns  
ns  
30  
Inhibit of the IBF Flag bit being Cleared from  
3 TCY  
WR or CS ↑  
DS39689F-page 360  
© 2009 Microchip Technology Inc.  
PIC18F2221/2321/4221/4321 FAMILY  
FIGURE 27-13:  
EXAMPLE SPI MASTER MODE TIMING (CKE = 0)  
SS  
SCK  
(CKP = 0)  
78  
79  
79  
SCK  
(CKP = 1)  
78  
80  
MSb  
bit 6 - - - - - -1  
LSb  
SDO  
SDI  
75, 76  
MSb In  
74  
bit 6 - - - -1  
LSb In  
73  
TABLE 27-14: EXAMPLE SPI MODE REQUIREMENTS (MASTER MODE, CKE = 0)  
Param  
No.  
Symbol  
Characteristic  
Min  
Max Units Conditions  
73  
TdiV2scH, Setup Time of SDI Data Input to SCK Edge  
TdiV2scL  
20  
ns  
ns  
ns  
73A  
74  
Tb2b  
Last Clock Edge of Byte 1 to the 1st Clock Edge 1.5 TCY + 40  
of Byte 2  
TscH2diL, Hold Time of SDI Data Input to SCK Edge  
TscL2diL  
40  
75  
TdoR  
SDO Data Output Rise Time PIC18FXXXX  
PIC18LFXXXX  
25  
45  
25  
25  
45  
25  
50  
100  
ns  
ns VDD = 2.0V  
76  
78  
TdoF  
TscR  
SDO Data Output Fall Time  
ns  
SCK Output Rise Time  
PIC18FXXXX  
PIC18LFXXXX  
ns  
ns VDD = 2.0V  
79  
80  
TscF  
SCK Output Fall Time  
ns  
TscH2doV, SDO Data Output Valid after PIC18FXXXX  
TscL2doV SCK Edge  
ns  
PIC18LFXXXX  
ns VDD = 2.0V  
© 2009 Microchip Technology Inc.  
DS39689F-page 361  
PIC18F2221/2321/4221/4321 FAMILY  
FIGURE 27-14:  
EXAMPLE SPI MASTER MODE TIMING (CKE = 1)  
SS  
81  
SCK  
(CKP = 0)  
79  
73  
SCK  
(CKP = 1)  
80  
78  
LSb  
MSb  
bit 6 - - - - - -1  
SDO  
SDI  
75, 76  
MSb In  
74  
bit 6 - - - -1  
LSb In  
TABLE 27-15: EXAMPLE SPI MODE REQUIREMENTS (MASTER MODE, CKE = 1)  
Param.  
No.  
Symbol  
Characteristic  
Min  
Max Units Conditions  
73  
TdiV2scH, Setup Time of SDI Data Input to SCK Edge  
TdiV2scL  
20  
ns  
ns  
ns  
73A  
74  
Tb2b  
Last Clock Edge of Byte 1 to the 1st Clock Edge  
of Byte 2  
1.5 TCY + 40  
TscH2diL,  
TscL2diL  
Hold Time of SDI Data Input to SCK Edge  
40  
75  
TdoR  
SDO Data Output Rise Time PIC18FXXXX  
PIC18LFXXXX  
25  
45  
25  
25  
45  
25  
50  
100  
ns  
ns VDD = 2.0V  
76  
78  
TdoF  
TscR  
SDO Data Output Fall Time  
ns  
SCK Output Rise Time  
PIC18FXXXX  
ns  
PIC18LFXXXX  
ns VDD = 2.0V  
79  
80  
TscF  
SCK Output Fall Time  
ns  
TscH2doV, SDO Data Output Valid after PIC18FXXXX  
TscL2doV SCK Edge  
ns  
PIC18LFXXXX  
ns VDD = 2.0V  
ns  
81  
TdoV2scH, SDO Data Output Setup to SCK Edge  
TdoV2scL  
TCY  
DS39689F-page 362  
© 2009 Microchip Technology Inc.  
PIC18F2221/2321/4221/4321 FAMILY  
FIGURE 27-15:  
EXAMPLE SPI SLAVE MODE TIMING (CKE = 0)  
SS  
70  
SCK  
(CKP = 0)  
83  
71  
72  
SCK  
(CKP = 1)  
80  
MSb  
bit 6 - - - - - -1  
bit 6 - - - -1  
LSb  
SDO  
SDI  
77  
75, 76  
MSb In  
74  
LSb In  
73  
TABLE 27-16: EXAMPLE SPI MODE REQUIREMENTS (SLAVE MODE TIMING, CKE = 0)  
Param  
No.  
Symbol  
Characteristic  
Min  
Max Units Conditions  
70  
TssL2scH, SS to SCK or SCK Input  
3 TCY  
ns  
TssL2scL  
71  
TscH  
TscL  
SCK Input High Time  
SCK Input Low Time  
Continuous  
Single Byte  
Continuous  
Single Byte  
1.25 TCY + 30  
ns  
71A  
72  
40  
ns (Note 1)  
1.25 TCY + 30  
ns  
72A  
73  
40  
20  
ns (Note 1)  
TdiV2scH, Setup Time of SDI Data Input to SCK Edge  
TdiV2scL  
ns  
73A  
74  
Tb2b  
Last Clock Edge of Byte 1 to the First Clock Edge of Byte 2 1.5 TCY + 40  
ns (Note 2)  
TscH2diL, Hold Time of SDI Data Input to SCK Edge  
TscL2diL  
40  
ns  
75  
TdoR  
SDO Data Output Rise Time  
PIC18FXXXX  
25  
45  
25  
50  
50  
100  
ns  
PIC18LFXXXX  
ns VDD = 2.0V  
76  
77  
80  
TdoF  
SDO Data Output Fall Time  
10  
ns  
TssH2doZ SS to SDO Output High-Impedance  
ns  
TscH2doV, SDO Data Output Valid after SCK Edge PIC18FXXXX  
TscL2doV  
ns  
PIC18LFXXXX  
ns VDD = 2.0V  
ns  
83  
TscH2ssH, SS after SCK edge  
1.5 TCY + 40  
TscL2ssH  
Note 1: Requires the use of Parameter #73A.  
2: Only if Parameter #71A and #72A are used.  
© 2009 Microchip Technology Inc.  
DS39689F-page 363  
PIC18F2221/2321/4221/4321 FAMILY  
FIGURE 27-16:  
EXAMPLE SPI SLAVE MODE TIMING (CKE = 1)  
82  
SS  
70  
SCK  
83  
(CKP = 0)  
71  
72  
SCK  
(CKP = 1)  
80  
MSb  
bit 6 - - - - - -1  
bit 6 - - - -1  
LSb  
SDO  
SDI  
75, 76  
77  
MSb In  
74  
LSb In  
TABLE 27-17: EXAMPLE SPI SLAVE MODE REQUIREMENTS (CKE = 1)  
Param  
No.  
Symbol  
Characteristic  
Min  
Max Units Conditions  
70  
TssL2scH, SS to SCK or SCK Input  
3 TCY  
ns  
TssL2scL  
71  
TscH  
TscL  
Tb2b  
SCK Input High Time  
SCK Input Low Time  
Continuous  
Single Byte  
Continuous  
Single Byte  
1.25 TCY + 30  
ns  
71A  
72  
40  
1.25 TCY + 30  
40  
ns (Note 1)  
ns  
72A  
73A  
74  
ns (Note 1)  
ns (Note 2)  
ns  
Last Clock Edge of Byte 1 to the First Clock Edge of Byte 2 1.5 TCY + 40  
TscH2diL, Hold Time of SDI Data Input to SCK Edge  
TscL2diL  
40  
75  
TdoR  
SDO Data Output Rise Time  
PIC18FXXXX  
25  
45  
ns  
PIC18LFXXXX  
ns VDD = 2.0V  
76  
77  
80  
TdoF  
SDO Data Output Fall Time  
25  
ns  
TssH2doZ SS to SDO Output High-Impedance  
10  
50  
ns  
TscH2doV, SDO Data Output Valid after SCK PIC18FXXXX  
50  
ns  
TscL2doV Edge  
PIC18LFXXXX  
100  
50  
ns VDD = 2.0V  
82  
83  
TssL2doV SDO Data Output Valid after SS PIC18FXXXX  
ns  
Edge  
PIC18LFXXXX  
100  
ns VDD = 2.0V  
ns  
TscH2ssH, SS after SCK Edge  
1.5 TCY + 40  
TscL2ssH  
Note 1: Requires the use of Parameter #73A.  
2: Only if Parameter #71A and #72A are used.  
DS39689F-page 364  
© 2009 Microchip Technology Inc.  
PIC18F2221/2321/4221/4321 FAMILY  
FIGURE 27-17:  
I2C™ BUS START/STOP BITS TIMING  
SCL  
91  
93  
90  
92  
SDA  
Stop  
Condition  
Start  
Condition  
TABLE 27-18: I2C™ BUS START/STOP BITS REQUIREMENTS (SLAVE MODE)  
Param.  
Symbol  
Characteristic  
Min  
Max  
Units  
Conditions  
No.  
90  
TSU:STA Start Condition  
Setup Time  
100 kHz mode  
400 kHz mode  
100 kHz mode  
400 kHz mode  
100 kHz mode  
400 kHz mode  
100 kHz mode  
400 kHz mode  
4700  
600  
ns  
Only relevant for Repeated  
Start condition  
91  
92  
93  
THD:STA Start Condition  
Hold Time  
4000  
600  
ns  
ns  
ns  
After this period, the first  
clock pulse is generated  
TSU:STO Stop Condition  
Setup Time  
4700  
600  
THD:STO Stop Condition  
Hold Time  
4000  
600  
FIGURE 27-18:  
I2C™ BUS DATA TIMING  
103  
102  
100  
101  
SCL  
90  
106  
107  
91  
92  
SDA  
In  
110  
109  
109  
SDA  
Out  
© 2009 Microchip Technology Inc.  
DS39689F-page 365  
PIC18F2221/2321/4221/4321 FAMILY  
TABLE 27-19: I2C™ BUS DATA REQUIREMENTS (SLAVE MODE)  
Param.  
Symbol  
Characteristic  
Min  
Max Units  
Conditions  
No.  
100  
THIGH  
Clock High Time  
100 kHz mode  
4.0  
0.6  
μs  
μs  
400 kHz mode  
MSSP Module  
100 kHz mode  
400 kHz mode  
MSSP Module  
1.5 TCY  
4.7  
101  
TLOW  
Clock Low Time  
μs  
μs  
1.3  
1.5 TCY  
102  
103  
TR  
TF  
SDA and SCL Rise 100 kHz mode  
Time  
1000  
ns  
ns  
400 kHz mode  
20 + 0.1 CB 300  
CB is specified to be from  
10 to 400 pF  
SDA and SCL Fall 100 kHz mode  
Time  
300  
ns  
ns  
400 kHz mode  
20 + 0.1 CB 300  
CB is specified to be from  
10 to 400 pF  
90  
TSU:STA Start Condition  
Setup Time  
100 kHz mode  
400 kHz mode  
100 kHz mode  
400 kHz mode  
100 kHz mode  
400 kHz mode  
100 kHz mode  
400 kHz mode  
100 kHz mode  
400 kHz mode  
100 kHz mode  
400 kHz mode  
100 kHz mode  
400 kHz mode  
4.7  
0.6  
4.0  
0.6  
0
μs  
μs  
μs  
μs  
ns  
μs  
ns  
ns  
μs  
μs  
ns  
ns  
μs  
μs  
Only relevant for Repeated  
Start condition  
91  
THD:STA Start Condition  
Hold Time  
After this period, the first  
clock pulse is generated  
106  
107  
92  
THD:DAT Data Input Hold  
Time  
0
0.9  
TSU:DAT Data Input Setup  
Time  
250  
100  
4.7  
0.6  
(Note 2)  
TSU:STO Stop Condition  
Setup Time  
109  
110  
TAA  
Output Valid from  
Clock  
3500  
(Note 1)  
TBUF  
Bus Free Time  
4.7  
1.3  
Time the bus must be free  
before a new transmission  
can start  
D102  
CB  
Bus Capacitive Loading  
400  
pF  
Note 1: As a transmitter, the device must provide this internal minimum delay time to bridge the undefined region  
(min. 300 ns) of the falling edge of SCL to avoid unintended generation of Start or Stop conditions.  
2: A Fast mode I2C bus device can be used in a Standard mode I2C bus system, but the requirement  
TSU:DAT 250 ns must then be met. This will automatically be the case if the device does not stretch the  
LOW period of the SCL signal. If such a device does stretch the LOW period of the SCL signal, it must  
output the next data bit to the SDA line, TR max. + TSU:DAT = 1000 + 250 = 1250 ns (according to the  
Standard mode I2C bus specification), before the SCL line is released.  
DS39689F-page 366  
© 2009 Microchip Technology Inc.  
PIC18F2221/2321/4221/4321 FAMILY  
FIGURE 27-19:  
MASTER SSP I2C™ BUS START/STOP BITS TIMING WAVEFORMS  
SCL  
SDA  
93  
91  
90  
92  
Stop  
Condition  
Start  
Condition  
TABLE 27-20: MASTER SSP I2C™ BUS START/STOP BITS REQUIREMENTS  
Param.  
Symbol  
Characteristic  
Min  
Max Units  
Conditions  
No.  
90  
TSU:STA Start Condition  
Setup Time  
100 kHz mode  
400 kHz mode  
1 MHz mode(1) 2(TOSC)(BRG + 1)  
2(TOSC)(BRG + 1)  
2(TOSC)(BRG + 1)  
ns Only relevant for  
Repeated Start  
condition  
91  
92  
93  
THD:STA Start Condition  
Hold Time  
100 kHz mode  
400 kHz mode  
1 MHz mode(1) 2(TOSC)(BRG + 1)  
2(TOSC)(BRG + 1)  
ns After this period, the  
first clock pulse is  
generated  
2(TOSC)(BRG + 1)  
TSU:STO Stop Condition  
Setup Time  
100 kHz mode  
400 kHz mode  
1 MHz mode(1) 2(TOSC)(BRG + 1)  
2(TOSC)(BRG + 1)  
ns  
2(TOSC)(BRG + 1)  
THD:STO Stop Condition  
Hold Time  
100 kHz mode  
400 kHz mode  
2(TOSC)(BRG + 1)  
ns  
2(TOSC)(BRG + 1)  
1 MHz mode(1) 2(TOSC)(BRG + 1)  
Note 1: Maximum pin capacitance = 10 pF for all I2C pins.  
FIGURE 27-20:  
MASTER SSP I2C™ BUS DATA TIMING  
103  
102  
100  
101  
109  
SCL  
90  
106  
91  
92  
107  
SDA  
In  
110  
109  
SDA  
Out  
© 2009 Microchip Technology Inc.  
DS39689F-page 367  
PIC18F2221/2321/4221/4321 FAMILY  
TABLE 27-21: MASTER SSP I2C™ BUS DATA REQUIREMENTS  
Param.  
Symbol  
Characteristic  
Min  
Max Units  
Conditions  
No.  
100  
THIGH  
Clock High Time 100 kHz mode  
400 kHz mode  
2(TOSC)(BRG + 1)  
2(TOSC)(BRG + 1)  
ms  
ms  
ms  
ms  
ms  
ms  
ns  
1 MHz mode(1) 2(TOSC)(BRG + 1)  
101  
102  
103  
90  
TLOW  
TR  
Clock Low Time 100 kHz mode  
400 kHz mode  
2(TOSC)(BRG + 1)  
2(TOSC)(BRG + 1)  
1 MHz mode(1) 2(TOSC)(BRG + 1)  
SDA and SCL  
Rise Time  
100 kHz mode  
400 kHz mode  
1 MHz mode(1)  
100 kHz mode  
400 kHz mode  
1 MHz mode(1)  
1000  
300  
300  
300  
300  
100  
CB is specified to be from  
10 to 400 pF  
20 + 0.1 CB  
ns  
ns  
TF  
SDA and SCL  
Fall Time  
ns  
CB is specified to be from  
10 to 400 pF  
20 + 0.1 CB  
ns  
ns  
TSU:STA Start Condition 100 kHz mode  
2(TOSC)(BRG + 1)  
ms Only relevant for  
Setup Time  
Repeated Start  
condition  
ms  
400 kHz mode  
1 MHz mode(1) 2(TOSC)(BRG + 1)  
2(TOSC)(BRG + 1)  
ms  
91  
THD:STA Start Condition 100 kHz mode  
2(TOSC)(BRG + 1)  
ms After this period, the first  
Hold Time  
clock pulse is generated  
400 kHz mode  
2(TOSC)(BRG + 1)  
ms  
1 MHz mode(1) 2(TOSC)(BRG + 1)  
ms  
ns  
106  
107  
92  
THD:DAT Data Input  
Hold Time  
100 kHz mode  
400 kHz mode  
100 kHz mode  
400 kHz mode  
100 kHz mode  
400 kHz mode  
0
0
0.9  
ms  
TSU:DAT Data Input  
Setup Time  
250  
ns  
ns  
(Note 2)  
100  
TSU:STO Stop Condition  
Setup Time  
2(TOSC)(BRG + 1)  
2(TOSC)(BRG + 1)  
ms  
ms  
ms  
ns  
1 MHz mode(1) 2(TOSC)(BRG + 1)  
109  
TAA  
Output Valid  
from Clock  
100 kHz mode  
400 kHz mode  
1 MHz mode(1)  
100 kHz mode  
400 kHz mode  
3500  
1000  
ns  
ns  
110  
TBUF  
CB  
Bus Free Time  
4.7  
1.3  
ms Time the bus must be free  
before a new transmission  
ms  
can start  
pF  
D102  
Bus Capacitive Loading  
400  
Note 1: Maximum pin capacitance = 10 pF for all I2C pins.  
2: A Fast mode I2C bus device can be used in a Standard mode I2C bus system, but parameter 107 250 ns  
must then be met. This will automatically be the case if the device does not stretch the LOW period of the  
SCL signal. If such a device does stretch the LOW period of the SCL signal, it must output the next data bit  
to the SDA line, parameter 102 + parameter 107 = 1000 + 250 = 1250 ns (for 100 kHz mode), before the  
SCL line is released.  
DS39689F-page 368  
© 2009 Microchip Technology Inc.  
PIC18F2221/2321/4221/4321 FAMILY  
FIGURE 27-21:  
EUSART SYNCHRONOUS TRANSMISSION (MASTER/SLAVE) TIMING  
RC6/TX/CK  
pin  
121  
121  
RC7/RX/DT  
pin  
120  
122  
TABLE 27-22: EUSART SYNCHRONOUS TRANSMISSION REQUIREMENTS  
Param  
Symbol  
Characteristic  
Min  
Max  
Units Conditions  
No.  
120  
TckH2dtV SYNC XMIT (MASTER & SLAVE)  
Clock High to Data Out Valid  
PIC18FXXXX  
40  
100  
20  
ns  
PIC18LFXXXX  
ns VDD = 2.0V  
ns  
121  
122  
Tckrf  
Tdtrf  
Clock Out Rise Time and Fall Time PIC18FXXXX  
(Master mode)  
PIC18LFXXXX  
50  
ns VDD = 2.0V  
ns  
Data Out Rise Time and Fall Time  
PIC18FXXXX  
20  
PIC18LFXXXX  
50  
ns VDD = 2.0V  
FIGURE 27-22:  
EUSART SYNCHRONOUS RECEIVE (MASTER/SLAVE) TIMING  
RC6/TX/CK  
pin  
125  
RC7/RX/DT  
pin  
126  
TABLE 27-23: EUSART SYNCHRONOUS RECEIVE REQUIREMENTS  
Param.  
Symbol  
Characteristic  
Min  
Max  
Units  
Conditions  
No.  
125  
TdtV2ckl SYNC RCV (MASTER & SLAVE)  
Data Hold before CK (DT hold time)  
10  
15  
ns  
ns  
126  
TckL2dtl  
Data Hold after CK (DT hold time)  
© 2009 Microchip Technology Inc.  
DS39689F-page 369  
PIC18F2221/2321/4221/4321 FAMILY  
TABLE 27-24: A/D CONVERTER CHARACTERISTICS  
Param  
Symbol  
Characteristic  
Min  
Typ  
Max  
Units  
Conditions  
No.  
A01  
NR  
Resolution  
10  
bit ΔVREF 3.0V  
A03  
A04  
A06  
A07  
A10  
A20  
EIL  
Integral Linearity Error  
Differential Linearity Error  
Offset Error  
<±1  
<±1  
<±2  
<±1  
LSb ΔVREF 3.0V  
LSb ΔVREF 3.0V  
LSb ΔVREF 3.0V  
LSb ΔVREF 3.0V  
EDL  
EOFF  
EGN  
Gain Error  
Monotonicity  
Guaranteed(1)  
VSS VAIN VREF  
ΔVREF Reference Voltage Range  
1.8  
3
V
V
VDD < 3.0V  
VDD 3.0V  
(VREFH – VREFL)  
A21  
A22  
A25  
A30  
VREFH Reference Voltage High  
VSS – 0.3V  
VREFL  
VDD + 3.0V  
V
V
VREFL  
VAIN  
Reference Voltage Low  
Analog Input Voltage  
VREFH  
2.5  
V
ZAIN  
Recommended Impedance of  
Analog Voltage Source  
kΩ  
A50  
IREF  
VREF Input Current(2)  
5
150  
μA During VAIN acquisition.  
μA During A/D conversion  
cycle.  
Note 1: The A/D conversion result never decreases with an increase in the input voltage and has no missing codes.  
2: VREFH current is from RA3/AN3/VREF+ pin or VDD, whichever is selected as the VREFH source.  
VREFL current is from RA2/AN2/VREF-/CVREF pin or VSS, whichever is selected as the VREFL source.  
DS39689F-page 370  
© 2009 Microchip Technology Inc.  
PIC18F2221/2321/4221/4321 FAMILY  
FIGURE 27-23:  
A/D CONVERSION TIMING  
BSF ADCON0, GO  
(Note 2)  
131  
130  
Q4  
A/D CLK(1)  
132  
. . .  
. . .  
9
8
7
2
1
0
A/D DATA  
ADRES  
NEW_DATA  
TCY  
OLD_DATA  
ADIF  
GO  
DONE  
SAMPLING STOPPED  
SAMPLE  
Note 1: If the A/D clock source is selected as RC, a time of TCY is added before the A/D clock starts.  
This allows the SLEEPinstruction to be executed.  
2: This is a minimal RC delay (typically 100 ns), which also disconnects the holding capacitor from the analog input.  
TABLE 27-25: A/D CONVERSION REQUIREMENTS  
Param  
Symbol  
Characteristic  
Min  
Max  
Units  
Conditions  
No.  
130  
TAD  
A/D Clock Period  
PIC18FXXXX  
0.7  
1.4  
25.0(1)  
25.0(1)  
μs TOSC based, VREF 3.0V  
PIC18LFXXXX  
μs VDD = 2.0V;  
TOSC based, VREF full range  
PIC18FXXXX  
11  
1
3
μs A/D RC mode  
μs VDD = 2.0V; A/D RC mode  
TAD  
PIC18LFXXXX  
131  
TCNV  
Conversion Time  
12  
(not including acquisition time)(2)  
Acquisition Time(3)  
132  
135  
137  
TACQ  
TSWC  
TDIS  
1.4  
(Note 4)  
μs -40°C to +85°C  
Switching Time from Convert Sample  
Discharge Time  
0.2  
μs  
Note 1: The time of the A/D clock period is dependent on the device frequency and the TAD clock divider.  
2: ADRES register may be read on the following TCY cycle.  
3: The time for the holding capacitor to acquire the “New” input voltage when the voltage changes full scale  
after the conversion (VDD to VSS or VSS to VDD). The source impedance (RS) on the input channels is 50Ω.  
4: On the following cycle of the device clock.  
© 2009 Microchip Technology Inc.  
DS39689F-page 371  
PIC18F2221/2321/4221/4321 FAMILY  
NOTES:  
DS39689F-page 372  
© 2009 Microchip Technology Inc.  
PIC18F2221/2321/4221/4321 FAMILY  
28.0 PACKAGING INFORMATION  
28.1 Package Marking Information  
28-Lead SPDIP  
Example  
e
3
PIC18F2321-I/SP  
0910017  
XXXXXXXXXXXXXXXXX  
XXXXXXXXXXXXXXXXX  
YYWWNNN  
28-Lead SOIC  
Example  
e
3
XXXXXXXXXXXXXXXXXXXX  
XXXXXXXXXXXXXXXXXXXX  
XXXXXXXXXXXXXXXXXXXX  
PIC18F2321-E/SO  
0910017  
YYWWNNN  
28-Lead QFN  
Example  
XXXXXXXX  
XXXXXXXX  
YYWWNNN  
18F2321  
/ML  
0910017  
e
3
28-Lead SSOP  
Example  
XXXXXXXXXXXX  
XXXXXXXXXXXX  
PIC18F2321  
-I/SS  
e
3
YYWWNNN  
0910017  
Legend: XX...X Customer-specific information  
Y
YY  
Year code (last digit of calendar year)  
Year code (last 2 digits of calendar year)  
WW  
NNN  
Week code (week of January 1 is week ‘01’)  
Alphanumeric traceability code  
e
3
Pb-free JEDEC designator for Matte Tin (Sn)  
*
This package is Pb-free. The Pb-free JEDEC designator (  
can be found on the outer packaging for this package.  
)
e3  
Note: In the event the full Microchip part number cannot be marked on one line, it will  
be carried over to the next line, thus limiting the number of available  
characters for customer-specific information.  
© 2009 Microchip Technology Inc.  
DS39689F-page 373  
PIC18F2221/2321/4221/4321 FAMILY  
28.1 Package Marking Information (Continued)  
40-Lead PDIP  
Example  
XXXXXXXXXXXXXXXXXX  
e
3
PIC18F4321-I/P  
0910017  
XXXXXXXXXXXXXXXXXX  
XXXXXXXXXXXXXXXXXX  
YYWWNNN  
44-Lead QFN  
Example  
-I/ML  
XXXXXXXXXX  
XXXXXXXXXX  
XXXXXXXXXX  
YYWWNNN  
PIC18F4321  
e
3
0910017  
44-Lead TQFP  
Example  
XXXXXXXXXX  
XXXXXXXXXX  
XXXXXXXXXX  
YYWWNNN  
PIC18F4321  
-I/PT  
0910017  
e
3
DS39689F-page 374  
© 2009 Microchip Technology Inc.  
PIC18F2221/2321/4221/4321 FAMILY  
ꢀꢁꢂꢃꢄꢅꢆꢇꢈꢉꢊꢋꢋꢌꢇꢍꢎꢅꢏꢐꢊꢑꢇꢒꢓꢅꢎꢇꢔꢋꢂꢃꢊꢋꢄꢇꢕꢈꢍꢖꢇMꢇꢗꢘꢘꢇꢙꢊꢎꢇꢚꢛꢆꢌꢇꢜꢈꢍꢒꢔꢍ  
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ꢔꢃꢌꢉꢋꢌꢍꢃꢓ ꢌꢍꢄꢋꢇꢋꢑꢊ ꢒꢉꢆ*ꢃꢄꢑ ,ꢕꢖꢞꢕꢜꢕ1  
© 2009 Microchip Technology Inc.  
DS39689F-page 375  
PIC18F2221/2321/4221/4321 FAMILY  
ꢀꢁꢂꢃꢄꢅꢆꢇꢍꢎꢅꢏꢐꢊꢑꢇꢈꢙꢅꢎꢎꢇ#ꢓꢐꢎꢊꢋꢄꢇꢕꢈ#ꢖꢇMꢇ$ꢊꢆꢄ%ꢇ&'(ꢘꢇꢙꢙꢇꢚꢛꢆꢌꢇꢜꢈ#ꢔ)  
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ꢀꢁ ꢂꢃꢄꢅꢀꢅ ꢃ!"ꢆꢇꢅꢃꢄ#ꢈ$ꢅ%ꢈꢆ&"ꢉꢈꢅ'ꢆꢊꢅ ꢆꢉꢊ(ꢅ)"&ꢅ'"!&ꢅ)ꢈꢅꢇꢋꢌꢆ&ꢈ#ꢅ*ꢃ&ꢍꢃꢄꢅ&ꢍꢈꢅꢍꢆ&ꢌꢍꢈ#ꢅꢆꢉꢈꢆꢁ  
ꢎꢁ ꢏꢅꢐꢃꢑꢄꢃ%ꢃꢌꢆꢄ&ꢅ,ꢍꢆꢉꢆꢌ&ꢈꢉꢃ!&ꢃꢌꢁ  
-ꢁ ꢒꢃ'ꢈꢄ!ꢃꢋꢄ!ꢅꢒꢅꢆꢄ#ꢅ.ꢀꢅ#ꢋꢅꢄꢋ&ꢅꢃꢄꢌꢇ"#ꢈꢅ'ꢋꢇ#ꢅ%ꢇꢆ!ꢍꢅꢋꢉꢅꢓꢉꢋ&ꢉ"!ꢃꢋꢄ!ꢁꢅꢔꢋꢇ#ꢅ%ꢇꢆ!ꢍꢅꢋꢉꢅꢓꢉꢋ&ꢉ"!ꢃꢋꢄ!ꢅ!ꢍꢆꢇꢇꢅꢄꢋ&ꢅꢈ$ꢌꢈꢈ#ꢅꢕꢁꢀꢘꢅ''ꢅꢓꢈꢉꢅ!ꢃ#ꢈꢁ  
ꢖꢁ ꢒꢃ'ꢈꢄ!ꢃꢋꢄꢃꢄꢑꢅꢆꢄ#ꢅ&ꢋꢇꢈꢉꢆꢄꢌꢃꢄꢑꢅꢓꢈꢉꢅꢗꢐꢔ.ꢅ0ꢀꢖꢁꢘꢔꢁ  
1ꢐ,2 1ꢆ!ꢃꢌꢅꢒꢃ'ꢈꢄ!ꢃꢋꢄꢁꢅꢙꢍꢈꢋꢉꢈ&ꢃꢌꢆꢇꢇꢊꢅꢈ$ꢆꢌ&ꢅ ꢆꢇ"ꢈꢅ!ꢍꢋ*ꢄꢅ*ꢃ&ꢍꢋ"&ꢅ&ꢋꢇꢈꢉꢆꢄꢌꢈ!ꢁ  
ꢝ.32 ꢝꢈ%ꢈꢉꢈꢄꢌꢈꢅꢒꢃ'ꢈꢄ!ꢃꢋꢄ(ꢅ"!"ꢆꢇꢇꢊꢅ*ꢃ&ꢍꢋ"&ꢅ&ꢋꢇꢈꢉꢆꢄꢌꢈ(ꢅ%ꢋꢉꢅꢃꢄ%ꢋꢉ'ꢆ&ꢃꢋꢄꢅꢓ"ꢉꢓꢋ!ꢈ!ꢅꢋꢄꢇꢊꢁ  
ꢔꢃꢌꢉꢋꢌꢍꢃꢓ ꢌꢍꢄꢋꢇꢋꢑꢊ ꢒꢉꢆ*ꢃꢄꢑ ,ꢕꢖꢞꢕꢘꢎ1  
DS39689F-page 376  
© 2009 Microchip Technology Inc.  
PIC18F2221/2321/4221/4321 FAMILY  
ꢀꢁꢂꢃꢄꢅꢆꢇꢍꢎꢅꢏꢐꢊꢑꢇ*ꢓꢅꢆꢇ+ꢎꢅꢐ%ꢇ!ꢛꢇꢃꢄꢅꢆꢇꢍꢅꢑꢉꢅ,ꢄꢇꢕ-ꢃꢖꢇMꢇ./.ꢇꢙꢙꢇꢚꢛꢆꢌꢇꢜ*+!  
0ꢊꢐ1ꢇꢘ'((ꢇꢙꢙꢇ)ꢛꢋꢐꢅꢑꢐꢇꢃꢄꢋ,ꢐ1  
!ꢛꢐꢄ" 3ꢋꢉꢅ&ꢍꢈꢅ'ꢋ!&ꢅꢌ"ꢉꢉꢈꢄ&ꢅꢓꢆꢌ4ꢆꢑꢈꢅ#ꢉꢆ*ꢃꢄꢑ!(ꢅꢓꢇꢈꢆ!ꢈꢅ!ꢈꢈꢅ&ꢍꢈꢅꢔꢃꢌꢉꢋꢌꢍꢃꢓꢅꢂꢆꢌ4ꢆꢑꢃꢄꢑꢅꢐꢓꢈꢌꢃ%ꢃꢌꢆ&ꢃꢋꢄꢅꢇꢋꢌꢆ&ꢈ#ꢅꢆ&ꢅ  
ꢍ&&ꢓ255***ꢁ'ꢃꢌꢉꢋꢌꢍꢃꢓꢁꢌꢋ'5ꢓꢆꢌ4ꢆꢑꢃꢄꢑ  
D
D2  
EXPOSED  
PAD  
e
E
b
E2  
2
1
2
1
K
N
N
NOTE 1  
L
BOTTOM VIEW  
TOP VIEW  
A
A3  
A1  
6ꢄꢃ&!  
ꢒꢃ'ꢈꢄ!ꢃꢋꢄꢅ9ꢃ'ꢃ&!  
ꢔꢚ99ꢚꢔ.ꢙ.ꢝꢐ  
7:ꢔ  
ꢔꢚ7  
ꢔꢗ;  
7"')ꢈꢉꢅꢋ%ꢅꢂꢃꢄ!  
ꢂꢃ&ꢌꢍ  
: ꢈꢉꢆꢇꢇꢅ8ꢈꢃꢑꢍ&  
ꢐ&ꢆꢄ#ꢋ%%ꢅ  
,ꢋꢄ&ꢆꢌ&ꢅꢙꢍꢃꢌ4ꢄꢈ!!  
: ꢈꢉꢆꢇꢇꢅ>ꢃ#&ꢍ  
.$ꢓꢋ!ꢈ#ꢅꢂꢆ#ꢅ>ꢃ#&ꢍ  
: ꢈꢉꢆꢇꢇꢅ9ꢈꢄꢑ&ꢍ  
.$ꢓꢋ!ꢈ#ꢅꢂꢆ#ꢅ9ꢈꢄꢑ&ꢍ  
,ꢋꢄ&ꢆꢌ&ꢅ>ꢃ#&ꢍ  
,ꢋꢄ&ꢆꢌ&ꢅ9ꢈꢄꢑ&ꢍ  
,ꢋꢄ&ꢆꢌ&ꢞ&ꢋꢞ.$ꢓꢋ!ꢈ#ꢅꢂꢆ#  
7
ꢗꢀ  
ꢗ-  
.
.ꢎ  
ꢎ<  
ꢕꢁ?ꢘꢅ1ꢐ,  
ꢕꢁꢛꢕ  
ꢕꢁ<ꢕ  
ꢕꢁꢕꢕ  
ꢀꢁꢕꢕ  
ꢕꢁꢕꢘ  
ꢕꢁꢕꢎ  
ꢕꢁꢎꢕꢅꢝ.3  
?ꢁꢕꢕꢅ1ꢐ,  
-ꢁꢜꢕ  
?ꢁꢕꢕꢅ1ꢐ,  
-ꢁꢜꢕ  
ꢕꢁ-ꢕ  
ꢕꢁꢘꢘ  
M
-ꢁ?ꢘ  
ꢖꢁꢎꢕ  
ꢒꢎ  
)
9
-ꢁ?ꢘ  
ꢕꢁꢎ-  
ꢕꢁꢘꢕ  
ꢕꢁꢎꢕ  
ꢖꢁꢎꢕ  
ꢕꢁ-ꢘ  
ꢕꢁꢜꢕ  
M
C
!ꢛꢐꢄꢏ"  
ꢀꢁ ꢂꢃꢄꢅꢀꢅ ꢃ!"ꢆꢇꢅꢃꢄ#ꢈ$ꢅ%ꢈꢆ&"ꢉꢈꢅ'ꢆꢊꢅ ꢆꢉꢊ(ꢅ)"&ꢅ'"!&ꢅ)ꢈꢅꢇꢋꢌꢆ&ꢈ#ꢅ*ꢃ&ꢍꢃꢄꢅ&ꢍꢈꢅꢍꢆ&ꢌꢍꢈ#ꢅꢆꢉꢈꢆꢁ  
ꢎꢁ ꢂꢆꢌ4ꢆꢑꢈꢅꢃ!ꢅ!ꢆ*ꢅ!ꢃꢄꢑ"ꢇꢆ&ꢈ#ꢁ  
-ꢁ ꢒꢃ'ꢈꢄ!ꢃꢋꢄꢃꢄꢑꢅꢆꢄ#ꢅ&ꢋꢇꢈꢉꢆꢄꢌꢃꢄꢑꢅꢓꢈꢉꢅꢗꢐꢔ.ꢅ0ꢀꢖꢁꢘꢔꢁ  
1ꢐ,2 1ꢆ!ꢃꢌꢅꢒꢃ'ꢈꢄ!ꢃꢋꢄꢁꢅꢙꢍꢈꢋꢉꢈ&ꢃꢌꢆꢇꢇꢊꢅꢈ$ꢆꢌ&ꢅ ꢆꢇ"ꢈꢅ!ꢍꢋ*ꢄꢅ*ꢃ&ꢍꢋ"&ꢅ&ꢋꢇꢈꢉꢆꢄꢌꢈ!ꢁ  
ꢝ.32 ꢝꢈ%ꢈꢉꢈꢄꢌꢈꢅꢒꢃ'ꢈꢄ!ꢃꢋꢄ(ꢅ"!"ꢆꢇꢇꢊꢅ*ꢃ&ꢍꢋ"&ꢅ&ꢋꢇꢈꢉꢆꢄꢌꢈ(ꢅ%ꢋꢉꢅꢃꢄ%ꢋꢉ'ꢆ&ꢃꢋꢄꢅꢓ"ꢉꢓꢋ!ꢈ!ꢅꢋꢄꢇꢊꢁ  
ꢔꢃꢌꢉꢋꢌꢍꢃꢓ ꢌꢍꢄꢋꢇꢋꢑꢊ ꢒꢉꢆ*ꢃꢄꢑ ,ꢕꢖꢞꢀꢕꢘ1  
© 2009 Microchip Technology Inc.  
DS39689F-page 377  
PIC18F2221/2321/4221/4321 FAMILY  
ꢀꢁꢂꢃꢄꢅꢆꢇꢍꢎꢅꢏꢐꢊꢑꢇ*ꢓꢅꢆꢇ+ꢎꢅꢐ%ꢇ!ꢛꢇꢃꢄꢅꢆꢇꢍꢅꢑꢉꢅ,ꢄꢇꢕ-ꢃꢖꢇMꢇ./.ꢇꢙꢙꢇꢚꢛꢆꢌꢇꢜ*+!  
0ꢊꢐ1ꢇꢘ'((ꢇꢙꢙꢇ)ꢛꢋꢐꢅꢑꢐꢇꢃꢄꢋ,ꢐ1  
!ꢛꢐꢄ" 3ꢋꢉꢅ&ꢍꢈꢅ'ꢋ!&ꢅꢌ"ꢉꢉꢈꢄ&ꢅꢓꢆꢌ4ꢆꢑꢈꢅ#ꢉꢆ*ꢃꢄꢑ!(ꢅꢓꢇꢈꢆ!ꢈꢅ!ꢈꢈꢅ&ꢍꢈꢅꢔꢃꢌꢉꢋꢌꢍꢃꢓꢅꢂꢆꢌ4ꢆꢑꢃꢄꢑꢅꢐꢓꢈꢌꢃ%ꢃꢌꢆ&ꢃꢋꢄꢅꢇꢋꢌꢆ&ꢈ#ꢅꢆ&ꢅ  
ꢍ&&ꢓ255***ꢁ'ꢃꢌꢉꢋꢌꢍꢃꢓꢁꢌꢋ'5ꢓꢆꢌ4ꢆꢑꢃꢄꢑ  
DS39689F-page 378  
© 2009 Microchip Technology Inc.  
PIC18F2221/2321/4221/4321 FAMILY  
ꢀꢁꢂꢃꢄꢅꢆꢇꢍꢎꢅꢏꢐꢊꢑꢇꢈ12ꢊꢋꢉꢇꢈꢙꢅꢎꢎꢇ#ꢓꢐꢎꢊꢋꢄꢇꢕꢈꢈꢖꢇMꢇ('ꢗꢘꢇꢙꢙꢇꢚꢛꢆꢌꢇꢜꢈꢈ#ꢍ  
!ꢛꢐꢄ" 3ꢋꢉꢅ&ꢍꢈꢅ'ꢋ!&ꢅꢌ"ꢉꢉꢈꢄ&ꢅꢓꢆꢌ4ꢆꢑꢈꢅ#ꢉꢆ*ꢃꢄꢑ!(ꢅꢓꢇꢈꢆ!ꢈꢅ!ꢈꢈꢅ&ꢍꢈꢅꢔꢃꢌꢉꢋꢌꢍꢃꢓꢅꢂꢆꢌ4ꢆꢑꢃꢄꢑꢅꢐꢓꢈꢌꢃ%ꢃꢌꢆ&ꢃꢋꢄꢅꢇꢋꢌꢆ&ꢈ#ꢅꢆ&ꢅ  
ꢍ&&ꢓ255***ꢁ'ꢃꢌꢉꢋꢌꢍꢃꢓꢁꢌꢋ'5ꢓꢆꢌ4ꢆꢑꢃꢄꢑ  
D
N
E
E1  
1
2
b
NOTE 1  
e
c
A2  
A
φ
A1  
L
L1  
6ꢄꢃ&!  
ꢔꢚ99ꢚꢔ.ꢙ.ꢝꢐ  
ꢒꢃ'ꢈꢄ!ꢃꢋꢄꢅ9ꢃ'ꢃ&!  
ꢔꢚ7  
7:ꢔ  
ꢔꢗ;  
7"')ꢈꢉꢅꢋ%ꢅꢂꢃꢄ!  
ꢂꢃ&ꢌꢍ  
7
ꢎ<  
ꢕꢁ?ꢘꢅ1ꢐ,  
: ꢈꢉꢆꢇꢇꢅ8ꢈꢃꢑꢍ&  
ꢔꢋꢇ#ꢈ#ꢅꢂꢆꢌ4ꢆꢑꢈꢅꢙꢍꢃꢌ4ꢄꢈ!!  
ꢐ&ꢆꢄ#ꢋ%%ꢅ  
: ꢈꢉꢆꢇꢇꢅ>ꢃ#&ꢍ  
ꢔꢋꢇ#ꢈ#ꢅꢂꢆꢌ4ꢆꢑꢈꢅ>ꢃ#&ꢍ  
: ꢈꢉꢆꢇꢇꢅ9ꢈꢄꢑ&ꢍ  
3ꢋꢋ&ꢅ9ꢈꢄꢑ&ꢍ  
3ꢋꢋ&ꢓꢉꢃꢄ&  
9ꢈꢆ#ꢅꢙꢍꢃꢌ4ꢄꢈ!!  
3ꢋꢋ&ꢅꢗꢄꢑꢇꢈ  
M
M
ꢀꢁꢜꢘ  
M
ꢜꢁ<ꢕ  
ꢘꢁ-ꢕ  
ꢀꢕꢁꢎꢕ  
ꢕꢁꢜꢘ  
ꢀꢁꢎꢘꢅꢝ.3  
M
ꢎꢁꢕꢕ  
ꢀꢁ<ꢘ  
M
<ꢁꢎꢕ  
ꢘꢁ?ꢕ  
ꢀꢕꢁꢘꢕ  
ꢕꢁꢛꢘ  
ꢗꢎ  
ꢗꢀ  
.
.ꢀ  
9
9ꢀ  
ꢀꢁ?ꢘ  
ꢕꢁꢕꢘ  
ꢜꢁꢖꢕ  
ꢘꢁꢕꢕ  
ꢛꢁꢛꢕ  
ꢕꢁꢘꢘ  
ꢕꢁꢕꢛ  
ꢕꢟ  
ꢕꢁꢎꢘ  
<ꢟ  
ꢖꢟ  
9ꢈꢆ#ꢅ>ꢃ#&ꢍ  
)
ꢕꢁꢎꢎ  
M
ꢕꢁ-<  
!ꢛꢐꢄꢏ"  
ꢀꢁ ꢂꢃꢄꢅꢀꢅ ꢃ!"ꢆꢇꢅꢃꢄ#ꢈ$ꢅ%ꢈꢆ&"ꢉꢈꢅ'ꢆꢊꢅ ꢆꢉꢊ(ꢅ)"&ꢅ'"!&ꢅ)ꢈꢅꢇꢋꢌꢆ&ꢈ#ꢅ*ꢃ&ꢍꢃꢄꢅ&ꢍꢈꢅꢍꢆ&ꢌꢍꢈ#ꢅꢆꢉꢈꢆꢁ  
ꢎꢁ ꢒꢃ'ꢈꢄ!ꢃꢋꢄ!ꢅꢒꢅꢆꢄ#ꢅ.ꢀꢅ#ꢋꢅꢄꢋ&ꢅꢃꢄꢌꢇ"#ꢈꢅ'ꢋꢇ#ꢅ%ꢇꢆ!ꢍꢅꢋꢉꢅꢓꢉꢋ&ꢉ"!ꢃꢋꢄ!ꢁꢅꢔꢋꢇ#ꢅ%ꢇꢆ!ꢍꢅꢋꢉꢅꢓꢉꢋ&ꢉ"!ꢃꢋꢄ!ꢅ!ꢍꢆꢇꢇꢅꢄꢋ&ꢅꢈ$ꢌꢈꢈ#ꢅꢕꢁꢎꢕꢅ''ꢅꢓꢈꢉꢅ!ꢃ#ꢈꢁ  
-ꢁ ꢒꢃ'ꢈꢄ!ꢃꢋꢄꢃꢄꢑꢅꢆꢄ#ꢅ&ꢋꢇꢈꢉꢆꢄꢌꢃꢄꢑꢅꢓꢈꢉꢅꢗꢐꢔ.ꢅ0ꢀꢖꢁꢘꢔꢁ  
1ꢐ,2 1ꢆ!ꢃꢌꢅꢒꢃ'ꢈꢄ!ꢃꢋꢄꢁꢅꢙꢍꢈꢋꢉꢈ&ꢃꢌꢆꢇꢇꢊꢅꢈ$ꢆꢌ&ꢅ ꢆꢇ"ꢈꢅ!ꢍꢋ*ꢄꢅ*ꢃ&ꢍꢋ"&ꢅ&ꢋꢇꢈꢉꢆꢄꢌꢈ!ꢁ  
ꢝ.32 ꢝꢈ%ꢈꢉꢈꢄꢌꢈꢅꢒꢃ'ꢈꢄ!ꢃꢋꢄ(ꢅ"!"ꢆꢇꢇꢊꢅ*ꢃ&ꢍꢋ"&ꢅ&ꢋꢇꢈꢉꢆꢄꢌꢈ(ꢅ%ꢋꢉꢅꢃꢄ%ꢋꢉ'ꢆ&ꢃꢋꢄꢅꢓ"ꢉꢓꢋ!ꢈ!ꢅꢋꢄꢇꢊꢁ  
ꢔꢃꢌꢉꢋꢌꢍꢃꢓ ꢌꢍꢄꢋꢇꢋꢑꢊ ꢒꢉꢆ*ꢃꢄꢑ ,ꢕꢖꢞꢕꢜ-1  
© 2009 Microchip Technology Inc.  
DS39689F-page 379  
PIC18F2221/2321/4221/4321 FAMILY  
3ꢘꢂꢃꢄꢅꢆꢇꢍꢎꢅꢏꢐꢊꢑꢇꢒꢓꢅꢎꢇꢔꢋꢂꢃꢊꢋꢄꢇꢕꢍꢖꢇMꢇ.ꢘꢘꢇꢙꢊꢎꢇꢚꢛꢆꢌꢇꢜꢍꢒꢔꢍ  
!ꢛꢐꢄ" 3ꢋꢉꢅ&ꢍꢈꢅ'ꢋ!&ꢅꢌ"ꢉꢉꢈꢄ&ꢅꢓꢆꢌ4ꢆꢑꢈꢅ#ꢉꢆ*ꢃꢄꢑ!(ꢅꢓꢇꢈꢆ!ꢈꢅ!ꢈꢈꢅ&ꢍꢈꢅꢔꢃꢌꢉꢋꢌꢍꢃꢓꢅꢂꢆꢌ4ꢆꢑꢃꢄꢑꢅꢐꢓꢈꢌꢃ%ꢃꢌꢆ&ꢃꢋꢄꢅꢇꢋꢌꢆ&ꢈ#ꢅꢆ&ꢅ  
ꢍ&&ꢓ255***ꢁ'ꢃꢌꢉꢋꢌꢍꢃꢓꢁꢌꢋ'5ꢓꢆꢌ4ꢆꢑꢃꢄꢑ  
N
NOTE 1  
E1  
1 2 3  
D
E
A2  
A
L
c
b1  
b
A1  
e
eB  
6ꢄꢃ&!  
ꢚ7,8.ꢐ  
ꢒꢃ'ꢈꢄ!ꢃꢋꢄꢅ9ꢃ'ꢃ&!  
ꢔꢚ7  
7:ꢔ  
ꢔꢗ;  
7"')ꢈꢉꢅꢋ%ꢅꢂꢃꢄ!  
ꢂꢃ&ꢌꢍ  
7
ꢖꢕ  
ꢁꢀꢕꢕꢅ1ꢐ,  
ꢓꢅ&ꢋꢅꢐꢈꢆ&ꢃꢄꢑꢅꢂꢇꢆꢄꢈ  
ꢔꢋꢇ#ꢈ#ꢅꢂꢆꢌ4ꢆꢑꢈꢅꢙꢍꢃꢌ4ꢄꢈ!!  
1ꢆ!ꢈꢅ&ꢋꢅꢐꢈꢆ&ꢃꢄꢑꢅꢂꢇꢆꢄꢈ  
ꢐꢍꢋ"ꢇ#ꢈꢉꢅ&ꢋꢅꢐꢍꢋ"ꢇ#ꢈꢉꢅ>ꢃ#&ꢍ  
ꢔꢋꢇ#ꢈ#ꢅꢂꢆꢌ4ꢆꢑꢈꢅ>ꢃ#&ꢍ  
: ꢈꢉꢆꢇꢇꢅ9ꢈꢄꢑ&ꢍ  
ꢙꢃꢓꢅ&ꢋꢅꢐꢈꢆ&ꢃꢄꢑꢅꢂꢇꢆꢄꢈ  
9ꢈꢆ#ꢅꢙꢍꢃꢌ4ꢄꢈ!!  
6ꢓꢓꢈꢉꢅ9ꢈꢆ#ꢅ>ꢃ#&ꢍ  
M
M
M
M
M
M
M
M
M
M
M
M
ꢁꢎꢘꢕ  
ꢁꢀꢛꢘ  
M
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ꢗꢀ  
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.ꢀ  
9
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ꢈ1  
ꢁꢀꢎꢘ  
ꢁꢕꢀꢘ  
ꢁꢘꢛꢕ  
ꢁꢖ<ꢘ  
ꢀꢁꢛ<ꢕ  
ꢁꢀꢀꢘ  
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ꢁꢕꢀꢖ  
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ꢁ?ꢎꢘ  
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ꢎꢁꢕꢛꢘ  
ꢁꢎꢕꢕ  
ꢁꢕꢀꢘ  
ꢁꢕꢜꢕ  
ꢁꢕꢎ-  
ꢁꢜꢕꢕ  
9ꢋ*ꢈꢉꢅ9ꢈꢆ#ꢅ>ꢃ#&ꢍ  
: ꢈꢉꢆꢇꢇꢅꢝꢋ*ꢅꢐꢓꢆꢌꢃꢄꢑꢅꢅꢏ  
!ꢛꢐꢄꢏ"  
ꢀꢁ ꢂꢃꢄꢅꢀꢅ ꢃ!"ꢆꢇꢅꢃꢄ#ꢈ$ꢅ%ꢈꢆ&"ꢉꢈꢅ'ꢆꢊꢅ ꢆꢉꢊ(ꢅ)"&ꢅ'"!&ꢅ)ꢈꢅꢇꢋꢌꢆ&ꢈ#ꢅ*ꢃ&ꢍꢃꢄꢅ&ꢍꢈꢅꢍꢆ&ꢌꢍꢈ#ꢅꢆꢉꢈꢆꢁ  
ꢎꢁ ꢏꢅꢐꢃꢑꢄꢃ%ꢃꢌꢆꢄ&ꢅ,ꢍꢆꢉꢆꢌ&ꢈꢉꢃ!&ꢃꢌꢁ  
-ꢁ ꢒꢃ'ꢈꢄ!ꢃꢋꢄ!ꢅꢒꢅꢆꢄ#ꢅ.ꢀꢅ#ꢋꢅꢄꢋ&ꢅꢃꢄꢌꢇ"#ꢈꢅ'ꢋꢇ#ꢅ%ꢇꢆ!ꢍꢅꢋꢉꢅꢓꢉꢋ&ꢉ"!ꢃꢋꢄ!ꢁꢅꢔꢋꢇ#ꢅ%ꢇꢆ!ꢍꢅꢋꢉꢅꢓꢉꢋ&ꢉ"!ꢃꢋꢄ!ꢅ!ꢍꢆꢇꢇꢅꢄꢋ&ꢅꢈ$ꢌꢈꢈ#ꢅꢁꢕꢀꢕ/ꢅꢓꢈꢉꢅ!ꢃ#ꢈꢁ  
ꢖꢁ ꢒꢃ'ꢈꢄ!ꢃꢋꢄꢃꢄꢑꢅꢆꢄ#ꢅ&ꢋꢇꢈꢉꢆꢄꢌꢃꢄꢑꢅꢓꢈꢉꢅꢗꢐꢔ.ꢅ0ꢀꢖꢁꢘꢔꢁ  
1ꢐ,2 1ꢆ!ꢃꢌꢅꢒꢃ'ꢈꢄ!ꢃꢋꢄꢁꢅꢙꢍꢈꢋꢉꢈ&ꢃꢌꢆꢇꢇꢊꢅꢈ$ꢆꢌ&ꢅ ꢆꢇ"ꢈꢅ!ꢍꢋ*ꢄꢅ*ꢃ&ꢍꢋ"&ꢅ&ꢋꢇꢈꢉꢆꢄꢌꢈ!ꢁ  
ꢔꢃꢌꢉꢋꢌꢍꢃꢓ ꢌꢍꢄꢋꢇꢋꢑꢊ ꢒꢉꢆ*ꢃꢄꢑ ,ꢕꢖꢞꢕꢀ?1  
DS39689F-page 380  
© 2009 Microchip Technology Inc.  
PIC18F2221/2321/4221/4321 FAMILY  
33ꢂꢃꢄꢅꢆꢇꢍꢎꢅꢏꢐꢊꢑꢇ*ꢓꢅꢆꢇ+ꢎꢅꢐ%ꢇ!ꢛꢇꢃꢄꢅꢆꢇꢍꢅꢑꢉꢅ,ꢄꢇꢕ-ꢃꢖꢇMꢇꢁ/ꢁꢇꢙꢙꢇꢚꢛꢆꢌꢇꢜ*+!  
!ꢛꢐꢄ" 3ꢋꢉꢅ&ꢍꢈꢅ'ꢋ!&ꢅꢌ"ꢉꢉꢈꢄ&ꢅꢓꢆꢌ4ꢆꢑꢈꢅ#ꢉꢆ*ꢃꢄꢑ!(ꢅꢓꢇꢈꢆ!ꢈꢅ!ꢈꢈꢅ&ꢍꢈꢅꢔꢃꢌꢉꢋꢌꢍꢃꢓꢅꢂꢆꢌ4ꢆꢑꢃꢄꢑꢅꢐꢓꢈꢌꢃ%ꢃꢌꢆ&ꢃꢋꢄꢅꢇꢋꢌꢆ&ꢈ#ꢅꢆ&ꢅ  
ꢍ&&ꢓ255***ꢁ'ꢃꢌꢉꢋꢌꢍꢃꢓꢁꢌꢋ'5ꢓꢆꢌ4ꢆꢑꢃꢄꢑ  
D2  
D
EXPOSED  
PAD  
e
b
K
E
E2  
2
1
2
1
N
N
NOTE 1  
L
TOP VIEW  
BOTTOM VIEW  
A
A3  
A1  
6ꢄꢃ&!  
ꢔꢚ99ꢚꢔ.ꢙ.ꢝꢐ  
ꢒꢃ'ꢈꢄ!ꢃꢋꢄꢅ9ꢃ'ꢃ&!  
ꢔꢚ7  
7:ꢔ  
ꢖꢖ  
ꢕꢁ?ꢘꢅ1ꢐ,  
ꢕꢁꢛꢕ  
ꢔꢗ;  
7"')ꢈꢉꢅꢋ%ꢅꢂꢃꢄ!  
ꢂꢃ&ꢌꢍ  
: ꢈꢉꢆꢇꢇꢅ8ꢈꢃꢑꢍ&  
ꢐ&ꢆꢄ#ꢋ%%ꢅ  
,ꢋꢄ&ꢆꢌ&ꢅꢙꢍꢃꢌ4ꢄꢈ!!  
: ꢈꢉꢆꢇꢇꢅ>ꢃ#&ꢍ  
7
ꢗꢀ  
ꢗ-  
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.ꢎ  
ꢕꢁ<ꢕ  
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.$ꢓꢋ!ꢈ#ꢅꢂꢆ#ꢅ>ꢃ#&ꢍ  
: ꢈꢉꢆꢇꢇꢅ9ꢈꢄꢑ&ꢍ  
.$ꢓꢋ!ꢈ#ꢅꢂꢆ#ꢅ9ꢈꢄꢑ&ꢍ  
,ꢋꢄ&ꢆꢌ&ꢅ>ꢃ#&ꢍ  
,ꢋꢄ&ꢆꢌ&ꢅ9ꢈꢄꢑ&ꢍ  
,ꢋꢄ&ꢆꢌ&ꢞ&ꢋꢞ.$ꢓꢋ!ꢈ#ꢅꢂꢆ#  
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9
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ꢕꢁꢎꢘ  
ꢕꢁ-ꢕ  
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?ꢁ<ꢕ  
ꢕꢁ-<  
ꢕꢁꢘꢕ  
M
C
!ꢛꢐꢄꢏ"  
ꢀꢁ ꢂꢃꢄꢅꢀꢅ ꢃ!"ꢆꢇꢅꢃꢄ#ꢈ$ꢅ%ꢈꢆ&"ꢉꢈꢅ'ꢆꢊꢅ ꢆꢉꢊ(ꢅ)"&ꢅ'"!&ꢅ)ꢈꢅꢇꢋꢌꢆ&ꢈ#ꢅ*ꢃ&ꢍꢃꢄꢅ&ꢍꢈꢅꢍꢆ&ꢌꢍꢈ#ꢅꢆꢉꢈꢆꢁ  
ꢎꢁ ꢂꢆꢌ4ꢆꢑꢈꢅꢃ!ꢅ!ꢆ*ꢅ!ꢃꢄꢑ"ꢇꢆ&ꢈ#ꢁ  
-ꢁ ꢒꢃ'ꢈꢄ!ꢃꢋꢄꢃꢄꢑꢅꢆꢄ#ꢅ&ꢋꢇꢈꢉꢆꢄꢌꢃꢄꢑꢅꢓꢈꢉꢅꢗꢐꢔ.ꢅ0ꢀꢖꢁꢘꢔꢁ  
1ꢐ,2 1ꢆ!ꢃꢌꢅꢒꢃ'ꢈꢄ!ꢃꢋꢄꢁꢅꢙꢍꢈꢋꢉꢈ&ꢃꢌꢆꢇꢇꢊꢅꢈ$ꢆꢌ&ꢅ ꢆꢇ"ꢈꢅ!ꢍꢋ*ꢄꢅ*ꢃ&ꢍꢋ"&ꢅ&ꢋꢇꢈꢉꢆꢄꢌꢈ!ꢁ  
ꢝ.32 ꢝꢈ%ꢈꢉꢈꢄꢌꢈꢅꢒꢃ'ꢈꢄ!ꢃꢋꢄ(ꢅ"!"ꢆꢇꢇꢊꢅ*ꢃ&ꢍꢋ"&ꢅ&ꢋꢇꢈꢉꢆꢄꢌꢈ(ꢅ%ꢋꢉꢅꢃꢄ%ꢋꢉ'ꢆ&ꢃꢋꢄꢅꢓ"ꢉꢓꢋ!ꢈ!ꢅꢋꢄꢇꢊꢁ  
ꢔꢃꢌꢉꢋꢌꢍꢃꢓ ꢌꢍꢄꢋꢇꢋꢑꢊ ꢒꢉꢆ*ꢃꢄꢑ ,ꢕꢖꢞꢀꢕ-1  
© 2009 Microchip Technology Inc.  
DS39689F-page 381  
PIC18F2221/2321/4221/4321 FAMILY  
33ꢂꢃꢄꢅꢆꢇꢍꢎꢅꢏꢐꢊꢑꢇ*ꢓꢅꢆꢇ+ꢎꢅꢐ%ꢇ!ꢛꢇꢃꢄꢅꢆꢇꢍꢅꢑꢉꢅ,ꢄꢇꢕ-ꢃꢖꢇMꢇꢁ/ꢁꢇꢙꢙꢇꢚꢛꢆꢌꢇꢜ*+!  
!ꢛꢐꢄ" 3ꢋꢉꢅ&ꢍꢈꢅ'ꢋ!&ꢅꢌ"ꢉꢉꢈꢄ&ꢅꢓꢆꢌ4ꢆꢑꢈꢅ#ꢉꢆ*ꢃꢄꢑ!(ꢅꢓꢇꢈꢆ!ꢈꢅ!ꢈꢈꢅ&ꢍꢈꢅꢔꢃꢌꢉꢋꢌꢍꢃꢓꢅꢂꢆꢌ4ꢆꢑꢃꢄꢑꢅꢐꢓꢈꢌꢃ%ꢃꢌꢆ&ꢃꢋꢄꢅꢇꢋꢌꢆ&ꢈ#ꢅꢆ&ꢅ  
ꢍ&&ꢓ255***ꢁ'ꢃꢌꢉꢋꢌꢍꢃꢓꢁꢌꢋ'5ꢓꢆꢌ4ꢆꢑꢃꢄꢑ  
DS39689F-page 382  
© 2009 Microchip Technology Inc.  
PIC18F2221/2321/4221/4321 FAMILY  
33ꢂꢃꢄꢅꢆꢇꢍꢎꢅꢏꢐꢊꢑꢇ41ꢊꢋꢇ*ꢓꢅꢆꢇ+ꢎꢅꢐ5ꢅꢑꢉꢇꢕꢍ4ꢖꢇMꢇ6ꢘ/6ꢘ/6ꢇꢙꢙꢇꢚꢛꢆꢌ%ꢇꢀ'ꢘꢘꢇꢙꢙꢇꢜ4*+ꢍ  
!ꢛꢐꢄ" 3ꢋꢉꢅ&ꢍꢈꢅ'ꢋ!&ꢅꢌ"ꢉꢉꢈꢄ&ꢅꢓꢆꢌ4ꢆꢑꢈꢅ#ꢉꢆ*ꢃꢄꢑ!(ꢅꢓꢇꢈꢆ!ꢈꢅ!ꢈꢈꢅ&ꢍꢈꢅꢔꢃꢌꢉꢋꢌꢍꢃꢓꢅꢂꢆꢌ4ꢆꢑꢃꢄꢑꢅꢐꢓꢈꢌꢃ%ꢃꢌꢆ&ꢃꢋꢄꢅꢇꢋꢌꢆ&ꢈ#ꢅꢆ&ꢅ  
ꢍ&&ꢓ255***ꢁ'ꢃꢌꢉꢋꢌꢍꢃꢓꢁꢌꢋ'5ꢓꢆꢌ4ꢆꢑꢃꢄꢑ  
D
D1  
E
e
E1  
N
b
NOTE 1  
1 2 3  
NOTE 2  
α
A
c
φ
A2  
β
A1  
L
L1  
6ꢄꢃ&!  
ꢔꢚ99ꢚꢔ.ꢙ.ꢝꢐ  
ꢒꢃ'ꢈꢄ!ꢃꢋꢄꢅ9ꢃ'ꢃ&!  
ꢔꢚ7  
7:ꢔ  
ꢖꢖ  
ꢕꢁ<ꢕꢅ1ꢐ,  
M
ꢀꢁꢕꢕ  
M
ꢔꢗ;  
7"')ꢈꢉꢅꢋ%ꢅ9ꢈꢆ#!  
9ꢈꢆ#ꢅꢂꢃ&ꢌꢍ  
: ꢈꢉꢆꢇꢇꢅ8ꢈꢃꢑꢍ&  
ꢔꢋꢇ#ꢈ#ꢅꢂꢆꢌ4ꢆꢑꢈꢅꢙꢍꢃꢌ4ꢄꢈ!!  
ꢐ&ꢆꢄ#ꢋ%%ꢅꢅ  
3ꢋꢋ&ꢅ9ꢈꢄꢑ&ꢍ  
7
ꢗꢎ  
ꢗꢀ  
9
M
ꢀꢁꢎꢕ  
ꢀꢁꢕꢘ  
ꢕꢁꢀꢘ  
ꢕꢁꢜꢘ  
ꢕꢁꢛꢘ  
ꢕꢁꢕꢘ  
ꢕꢁꢖꢘ  
ꢕꢁ?ꢕ  
3ꢋꢋ&ꢓꢉꢃꢄ&  
3ꢋꢋ&ꢅꢗꢄꢑꢇꢈ  
9ꢀ  
ꢀꢁꢕꢕꢅꢝ.3  
-ꢁꢘꢟ  
ꢕꢟ  
ꢜꢟ  
: ꢈꢉꢆꢇꢇꢅ>ꢃ#&ꢍ  
: ꢈꢉꢆꢇꢇꢅ9ꢈꢄꢑ&ꢍ  
.
.ꢀ  
ꢒꢀ  
ꢀꢎꢁꢕꢕꢅ1ꢐ,  
ꢀꢎꢁꢕꢕꢅ1ꢐ,  
ꢀꢕꢁꢕꢕꢅ1ꢐ,  
ꢀꢕꢁꢕꢕꢅ1ꢐ,  
M
ꢔꢋꢇ#ꢈ#ꢅꢂꢆꢌ4ꢆꢑꢈꢅ>ꢃ#&ꢍ  
ꢔꢋꢇ#ꢈ#ꢅꢂꢆꢌ4ꢆꢑꢈꢅ9ꢈꢄꢑ&ꢍ  
9ꢈꢆ#ꢅꢙꢍꢃꢌ4ꢄꢈ!!  
9ꢈꢆ#ꢅ>ꢃ#&ꢍ  
ꢔꢋꢇ#ꢅꢒꢉꢆ%&ꢅꢗꢄꢑꢇꢈꢅ  
ꢔꢋꢇ#ꢅꢒꢉꢆ%&ꢅꢗꢄꢑꢇꢈꢅ1ꢋ&&ꢋ'  
ꢕꢁꢕꢛ  
ꢕꢁ-ꢕ  
ꢀꢀꢟ  
ꢕꢁꢎꢕ  
ꢕꢁꢖꢘ  
ꢀ-ꢟ  
)
ꢕꢁ-ꢜ  
ꢀꢎꢟ  
ꢀꢎꢟ  
ꢀꢀꢟ  
ꢀ-ꢟ  
!ꢛꢐꢄꢏ"  
ꢀꢁ ꢂꢃꢄꢅꢀꢅ ꢃ!"ꢆꢇꢅꢃꢄ#ꢈ$ꢅ%ꢈꢆ&"ꢉꢈꢅ'ꢆꢊꢅ ꢆꢉꢊ(ꢅ)"&ꢅ'"!&ꢅ)ꢈꢅꢇꢋꢌꢆ&ꢈ#ꢅ*ꢃ&ꢍꢃꢄꢅ&ꢍꢈꢅꢍꢆ&ꢌꢍꢈ#ꢅꢆꢉꢈꢆꢁ  
ꢎꢁ ,ꢍꢆ'%ꢈꢉ!ꢅꢆ&ꢅꢌꢋꢉꢄꢈꢉ!ꢅꢆꢉꢈꢅꢋꢓ&ꢃꢋꢄꢆꢇDꢅ!ꢃEꢈꢅ'ꢆꢊꢅ ꢆꢉꢊꢁ  
-ꢁ ꢒꢃ'ꢈꢄ!ꢃꢋꢄ!ꢅꢒꢀꢅꢆꢄ#ꢅ.ꢀꢅ#ꢋꢅꢄꢋ&ꢅꢃꢄꢌꢇ"#ꢈꢅ'ꢋꢇ#ꢅ%ꢇꢆ!ꢍꢅꢋꢉꢅꢓꢉꢋ&ꢉ"!ꢃꢋꢄ!ꢁꢅꢔꢋꢇ#ꢅ%ꢇꢆ!ꢍꢅꢋꢉꢅꢓꢉꢋ&ꢉ"!ꢃꢋꢄ!ꢅ!ꢍꢆꢇꢇꢅꢄꢋ&ꢅꢈ$ꢌꢈꢈ#ꢅꢕꢁꢎꢘꢅ''ꢅꢓꢈꢉꢅ!ꢃ#ꢈꢁ  
ꢖꢁ ꢒꢃ'ꢈꢄ!ꢃꢋꢄꢃꢄꢑꢅꢆꢄ#ꢅ&ꢋꢇꢈꢉꢆꢄꢌꢃꢄꢑꢅꢓꢈꢉꢅꢗꢐꢔ.ꢅ0ꢀꢖꢁꢘꢔꢁ  
1ꢐ,2 1ꢆ!ꢃꢌꢅꢒꢃ'ꢈꢄ!ꢃꢋꢄꢁꢅꢙꢍꢈꢋꢉꢈ&ꢃꢌꢆꢇꢇꢊꢅꢈ$ꢆꢌ&ꢅ ꢆꢇ"ꢈꢅ!ꢍꢋ*ꢄꢅ*ꢃ&ꢍꢋ"&ꢅ&ꢋꢇꢈꢉꢆꢄꢌꢈ!ꢁ  
ꢝ.32 ꢝꢈ%ꢈꢉꢈꢄꢌꢈꢅꢒꢃ'ꢈꢄ!ꢃꢋꢄ(ꢅ"!"ꢆꢇꢇꢊꢅ*ꢃ&ꢍꢋ"&ꢅ&ꢋꢇꢈꢉꢆꢄꢌꢈ(ꢅ%ꢋꢉꢅꢃꢄ%ꢋꢉ'ꢆ&ꢃꢋꢄꢅꢓ"ꢉꢓꢋ!ꢈ!ꢅꢋꢄꢇꢊꢁ  
ꢔꢃꢌꢉꢋꢌꢍꢃꢓ ꢌꢍꢄꢋꢇꢋꢑꢊ ꢒꢉꢆ*ꢃꢄꢑ ,ꢕꢖꢞꢕꢜ?1  
© 2009 Microchip Technology Inc.  
DS39689F-page 383  
PIC18F2221/2321/4221/4321 FAMILY  
33ꢂꢃꢄꢅꢆꢇꢍꢎꢅꢏꢐꢊꢑꢇ41ꢊꢋꢇ*ꢓꢅꢆꢇ+ꢎꢅꢐ5ꢅꢑꢉꢇꢕꢍ4ꢖꢇMꢇ6ꢘ/6ꢘ/6ꢇꢙꢙꢇꢚꢛꢆꢌ%ꢇꢀ'ꢘꢘꢇꢙꢙꢇꢜ4*+ꢍ  
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ꢍ&&ꢓ255***ꢁ'ꢃꢌꢉꢋꢌꢍꢃꢓꢁꢌꢋ'5ꢓꢆꢌ4ꢆꢑꢃꢄꢑ  
DS39689F-page 384  
© 2009 Microchip Technology Inc.  
PIC18F2221/2321/4221/4321 FAMILY  
APPENDIX A: REVISION HISTORY  
Revision A (July 2005)  
Original data sheet for PIC18F2221/2321/4221/4321  
devices.  
Revision B (August 2006)  
Updated Section 26.0 “Electrical Characteristic”.  
Revision C (October 2006)  
This revision includes updates to the packaging  
diagrams.  
Revision D (January 2007)  
This revision includes updates to the packaging  
diagrams.  
Revision E (February 2007)  
This revision includes updates to the packaging  
diagrams.  
Revision F (September 2009)  
This revision includes a new chapter, Section 2.0  
“Guidelines for Getting Started with PIC18F  
Microcontrollers”. There are also updates to  
Section 27.0  
“Electrical  
Characteristics”,  
Section 28.0 “Packaging Information” and minor  
text edits throughout document.  
© 2009 Microchip Technology Inc.  
DS39689F-page 385  
PIC18F2221/2321/4221/4321 FAMILY  
APPENDIX B: DEVICE  
DIFFERENCES  
The differences between the devices listed in this data  
sheet are shown in Table B-1.  
TABLE B-1:  
DEVICE DIFFERENCES  
Features  
PIC18F2221  
PIC18F2321  
PIC18F4221  
PIC18F4321  
Program Memory (Bytes)  
Program Memory (Instructions)  
Interrupt Sources  
4096  
8192  
4096  
19  
4096  
2048  
20  
8192  
4096  
20  
2048  
19  
I/O Ports  
Ports A, B, C, (E)  
Ports A, B, C, (E) Ports A, B, C, D, E Ports A, B, C, D, E  
Capture/Compare/PWM Modules  
2
0
2
0
1
1
1
1
Enhanced Capture/Compare/  
PWM Modules  
Parallel Communications (PSP)  
10-Bit Analog-to-Digital Module  
Packages  
No  
No  
Yes  
Yes  
10 input channels 10 input channels 13 input channels 13 input channels  
28-pin SPDIP  
28-pin SOIC  
28-pin SSOP  
28-pin QFN  
28-pin SPDIP  
28-pin SOIC  
28-pin SSOP  
28-pin QFN  
40-pin PDIP  
44-pin TQFP  
44-pin QFN  
40-pin PDIP  
44-pin TQFP  
44-pin QFN  
DS39689F-page 386  
© 2009 Microchip Technology Inc.  
PIC18F2221/2321/4221/4321 FAMILY  
APPENDIX C: CONVERSION  
APPENDIX D: MIGRATION FROM  
BASELINE TO  
CONSIDERATIONS  
ENHANCED DEVICES  
This appendix discusses the considerations for  
converting from previous versions of a device to the  
ones listed in this data sheet. Typically, these changes  
are due to the differences in the process technology  
used. An example of this type of conversion is from a  
PIC16C74A to a PIC16C74B.  
This section discusses how to migrate from a Baseline  
device (i.e., PIC16C5X) to an Enhanced MCU device  
(i.e., PIC18FXXX).  
The following are the list of modifications over the  
PIC16C5X microcontroller family:  
The PIC18F2221/2321/4221/4321 family of devices is  
functionally the same as the PIC18F4320 family. Code  
written for a PIC18F4320 will generally work on a  
PIC18F4321 with few or no changes.  
Not Currently Available  
The following is a list of changes the user should be  
aware of when migrating an application from the  
PIC18F4320 to the PIC18F4321. Code written for the  
PIC18F4321 may not run as expected due to these  
differences.  
1. Entry to power-managed modes has changed.  
Modifyingthe SCS1:SCS0 bits (OSCCON<1:0>)  
immediately changes the current clock source. It  
is not necessary to execute a SLEEPinstruction  
to change clock sources. Refer to Section 4.1.2  
“Entering Power-Managed Modes” for details.  
2. Exit from power-managed modes has changed.  
A WDT wake or interrupt does not cause an  
automatic return to PRI_RUN mode. The  
controller will execute code while continuing to  
use the current clock source. If the controller  
was operating in RC_IDLE or RC_RUN mode,  
an interrupt will cause entry to RC_RUN mode  
until code selects another power-managed  
mode. Refer to Section 4.4 “Idle Modes” for  
details.  
3. The extended instruction set can be con-  
figured as enabled using the XINST bit  
(CONFIG4L<6>). The access memory map is  
also modified when the extended instruction set  
is enabled. Refer to Section 6.5 “Data Memory  
and the Extended Instruction Set” and  
Section 24.2 “Extended Instruction Set” for  
details.  
4. There may also be changes to the electrical spec-  
ifications. Refer to Section 27.0 “Electrical  
Characteristics” for details.  
© 2009 Microchip Technology Inc.  
DS39689F-page 387  
PIC18F2221/2321/4221/4321 FAMILY  
APPENDIX E: MIGRATION FROM  
MID-RANGE TO  
APPENDIX F: MIGRATION FROM  
HIGH-END TO  
ENHANCED DEVICES  
ENHANCED DEVICES  
A detailed discussion of the differences between the  
mid-range MCU devices (i.e., PIC16CXXX) and the  
Enhanced devices (i.e., PIC18FXXX) is provided in  
AN716, “Migrating Designs from PIC16C74A/74B to  
PIC18C442”. The changes discussed, while device  
specific, are generally applicable to all mid-range to  
Enhanced device migrations.  
A detailed discussion of the migration pathway and  
differences between the high-end MCU devices (i.e.,  
PIC17CXXX) and the Enhanced devices (i.e.,  
PIC18FXXX) is provided in AN726, “PIC17CXXX to  
PIC18CXXX Migration”.  
This Application Note is available as Literature Number  
DS00726.  
This Application Note is available as Literature Number  
DS00716.  
DS39689F-page 388  
© 2009 Microchip Technology Inc.  
PIC18F2221/2321/4221/4321 FAMILY  
INDEX  
Block Diagrams  
A
A/D ........................................................................... 236  
A/D ................................................................................... 233  
Acquisition Requirements ........................................ 238  
ADCON0 Register .................................................... 233  
ADCON1 Register .................................................... 233  
ADCON2 Register .................................................... 233  
ADRESH Register ............................................ 233, 236  
ADRESL Register .................................................... 233  
Analog Port Pins, Configuring .................................. 240  
Associated Registers ............................................... 242  
Configuring the Module ............................................ 237  
Conversion Clock (TAD) ........................................... 239  
Conversion Requirements ....................................... 371  
Conversion Status (GO/DONE Bit) .......................... 236  
Conversions ............................................................. 241  
Converter Characteristics ........................................ 370  
Converter Interrupt, Configuring .............................. 237  
Discharge ................................................................. 241  
Operation in Power-Managed Modes ...................... 240  
Selecting and Configuring Acquisition Time ............ 239  
Special Event Trigger (CCP) .................................... 242  
Special Event Trigger (ECCP) ................................. 154  
Use of the CCP2 Trigger .......................................... 242  
Absolute Maximum Ratings ............................................. 333  
AC (Timing) Characteristics ............................................. 352  
Load Conditions for Device Timing  
Analog Input Model .................................................. 237  
Baud Rate Generator .............................................. 197  
Capture Mode Operation ......................................... 147  
Comparator Analog Input Model .............................. 247  
Comparator I/O Operating Modes ........................... 244  
Comparator Output .................................................. 246  
Comparator Voltage Reference ............................... 250  
Comparator Voltage Reference Output  
Buffer Example ................................................ 251  
Compare Mode Operation ....................................... 148  
Device Clock .............................................................. 35  
Enhanced PWM ....................................................... 155  
EUSART Receive .................................................... 225  
EUSART Transmit ................................................... 222  
External Power-on Reset Circuit  
(Slow VDD Power-up) ........................................ 49  
Fail-Safe Clock Monitor ........................................... 272  
Generic I/O Port ....................................................... 111  
High/Low-Voltage Detect with External Input .......... 254  
HSPLL ....................................................................... 31  
Interrupt Logic ............................................................ 98  
INTOSC and PLL ....................................................... 32  
2
MSSP (I C Master Mode) ........................................ 195  
2
MSSP (I C Mode) .................................................... 176  
MSSP (SPI Mode) ................................................... 167  
On-Chip Reset Circuit ................................................ 47  
PIC18F2221/2321 ..................................................... 12  
PIC18F4221/4321 ..................................................... 13  
PORTD and PORTE (Parallel Slave Port) ............... 126  
PWM Operation (Simplified) .................................... 150  
Reads from Flash Program Memory ......................... 83  
Single Comparator ................................................... 245  
Table Read Operation ............................................... 79  
Table Write Operation ............................................... 80  
Table Writes to Flash Program Memory .................... 85  
Timer0 in 16-Bit Mode ............................................. 130  
Timer0 in 8-Bit Mode ............................................... 130  
Timer1 ..................................................................... 134  
Timer1 (16-Bit Read/Write Mode) ............................ 134  
Timer2 ..................................................................... 140  
Timer3 ..................................................................... 142  
Timer3 (16-Bit Read/Write Mode) ............................ 142  
Watchdog Timer ...................................................... 269  
BN .................................................................................... 288  
BNC ................................................................................. 289  
BNN ................................................................................. 289  
BNOV .............................................................................. 290  
BNZ ................................................................................. 290  
BOR. See Brown-out Reset.  
Specifications ................................................... 353  
Parameter Symbology ............................................. 352  
Temperature and Voltage Specifications ................. 353  
Timing Conditions .................................................... 353  
AC Characteristics  
Internal RC Accuracy ............................................... 355  
Access Bank  
Mapping with Indexed Literal Offset  
Addressing Mode ............................................... 77  
ACKSTAT ........................................................................ 201  
ACKSTAT Status Flag ..................................................... 201  
ADCON0 Register ............................................................ 233  
GO/DONE Bit ........................................................... 236  
ADCON1 Register ............................................................ 233  
ADCON2 Register ............................................................ 233  
ADDFSR .......................................................................... 322  
ADDLW ............................................................................ 285  
ADDULNK ........................................................................ 322  
ADDWF ............................................................................ 285  
ADDWFC ......................................................................... 286  
ADRESH Register ............................................................ 233  
ADRESL Register .................................................... 233, 236  
Analog-to-Digital Converter. See A/D.  
ANDLW ............................................................................ 286  
ANDWF ............................................................................ 287  
Assembler  
MPASM Assembler .................................................. 330  
Auto-Wake-up on Sync Break Character ......................... 226  
BOV ................................................................................. 293  
BRA ................................................................................. 291  
Break Character (12-Bit) Transmit and Receive .............. 227  
BRG. See Baud Rate Generator.  
Brown-out Reset (BOR) ..................................................... 50  
Detecting ................................................................... 50  
Disabling in Sleep Mode ............................................ 50  
Software Enabled ...................................................... 50  
BSF .................................................................................. 291  
BTFSC ............................................................................. 292  
BTFSS ............................................................................. 292  
BTG ................................................................................. 293  
BZ .................................................................................... 294  
B
Bank Select Register (BSR) ............................................... 65  
Baud Rate Generator ....................................................... 197  
BC .................................................................................... 287  
BCF .................................................................................. 288  
BF .................................................................................... 201  
BF Status Flag ................................................................. 201  
© 2009 Microchip Technology Inc.  
DS39689F-page 389  
PIC18F2221/2321/4221/4321 FAMILY  
Effects of a Reset .................................................... 246  
C
Interrupts ................................................................. 246  
Operation ................................................................. 245  
Operation During Sleep ........................................... 246  
Outputs .................................................................... 245  
Reference ................................................................ 245  
External Signal ................................................ 245  
C Compilers  
MPLAB C18 .............................................................330  
MPLAB C30 .............................................................330  
CALL ................................................................................294  
CALLW .............................................................................323  
Capture (CCP Module) .....................................................147  
Associated Registers ...............................................149  
CCP Pin Configuration .............................................147  
CCPRxH:CCPRxL Registers ...................................147  
Prescaler ..................................................................147  
Software Interrupt ....................................................147  
Timer1/Timer3 Mode Selection ................................147  
Capture (ECCP Module) ..................................................154  
Capture/Compare/PWM (CCP) ........................................145  
Capture Mode. See Capture.  
Internal Signal .................................................. 245  
Response Time ........................................................ 245  
Comparator Specifications ............................................... 350  
Comparator Voltage Reference ....................................... 249  
Accuracy and Error .................................................. 250  
Associated Registers ............................................... 251  
Configuring .............................................................. 249  
Connection Considerations ...................................... 250  
Effects of a Reset .................................................... 250  
Operation During Sleep ........................................... 250  
Compare (CCP Module) .................................................. 148  
CCPRx Register ...................................................... 148  
Pin Configuration ..................................................... 148  
Software Interrupt .................................................... 148  
Special Event Trigger .............................. 143, 148, 242  
Timer1/Timer3 Mode Selection ................................ 148  
Compare (ECCP Module) ................................................ 154  
Special Event Trigger .............................................. 154  
Computed GOTO ............................................................... 62  
Configuration Bits ............................................................ 259  
Context Saving During Interrupts ..................................... 109  
Conversion Considerations .............................................. 387  
CPFSEQ .......................................................................... 296  
CPFSGT .......................................................................... 297  
CPFSLT ........................................................................... 297  
Crystal Oscillator/Ceramic Resonator ................................ 29  
Customer Change Notification Service ............................ 399  
Customer Notification Service ......................................... 399  
Customer Support ............................................................ 399  
CCPRxH Register ....................................................146  
CCPRxL Register .....................................................146  
Compare Mode. See Compare.  
Interaction of Two CCP Modules .............................146  
Module Configuration ...............................................146  
Pin Assignment ........................................................146  
Timer Resources ......................................................146  
Clock Sources ....................................................................35  
Selecting the 31 kHz Source ......................................36  
Selection Using OSCCON Register ...........................36  
CLRF ................................................................................295  
CLRWDT ..........................................................................295  
Code Examples  
16 x 16 Signed Multiply Routine ................................96  
16 x 16 Unsigned Multiply Routine ............................96  
8 x 8 Signed Multiply Routine ....................................95  
8 x 8 Unsigned Multiply Routine ................................95  
Address Masking .....................................................182  
Changing Between Capture Prescalers ...................147  
Computed GOTO Using an Offset Value ...................62  
Data EEPROM Read .................................................91  
Data EEPROM Refresh Routine ................................92  
Data EEPROM Write .................................................91  
Erasing a Flash Program Memory Row .....................84  
Fast Register Stack ....................................................62  
How to Clear RAM (Bank 1) Using Indirect  
D
Data Addressing Modes .................................................... 73  
Comparing Options with the Extended  
Instruction Set Enabled ..................................... 76  
Direct ......................................................................... 73  
Indexed Literal Offset ................................................ 75  
Instructions Affected .......................................... 75  
Indirect ....................................................................... 73  
Inherent and Literal .................................................... 73  
Data EEPROM Memory ..................................................... 89  
Associated Registers ................................................. 93  
EEADR Register ........................................................ 89  
EECON1 Register ...................................................... 89  
EECON2 Register ...................................................... 89  
EEDATA Register ...................................................... 89  
Operation During Code-Protect ................................. 92  
Protection Against Spurious Write ............................. 92  
Reading ..................................................................... 91  
Using ......................................................................... 92  
Write Verify ................................................................ 91  
Writing ....................................................................... 91  
Data Memory ..................................................................... 65  
Access Bank .............................................................. 67  
and the Extended Instruction Set .............................. 75  
Bank Select Register (BSR) ...................................... 65  
General Purpose Registers ....................................... 67  
Map for PIC18F2221/2321/4221/4321 Family ........... 66  
Special Function Registers ........................................ 68  
Addressing .........................................................73  
Implementing a Real-Time Clock Using a  
Timer1 Interrupt Service ..................................137  
Initializing PORTA ....................................................111  
Initializing PORTB ....................................................114  
Initializing PORTC ....................................................117  
Initializing PORTD ....................................................120  
Initializing PORTE ....................................................123  
Loading the SSPBUF (SSPSR) Register .................170  
Reading a Flash Program Memory Word ..................83  
Saving STATUS, WREG and BSR  
Registers in RAM .............................................109  
Writing to Flash Program Memory ....................... 86–87  
Code Protection ....................................................... 259, 274  
Associated Registers ...............................................275  
Configuration Register Protection ............................277  
Data EEPROM .........................................................277  
Program Memory .....................................................275  
COMF ...............................................................................296  
Comparator ......................................................................243  
Analog Input Connection Considerations .................247  
Associated Registers ...............................................247  
Configuration ............................................................244  
DS39689F-page 390  
© 2009 Microchip Technology Inc.  
PIC18F2221/2321/4221/4321 FAMILY  
DAW ................................................................................. 298  
Synchronous Master Mode ...................................... 228  
Associated Registers, Receive ........................ 230  
Associated Registers, Transmit ....................... 229  
Reception ........................................................ 230  
Transmission ................................................... 228  
Synchronous Slave Mode ........................................ 231  
Associated Registers, Receive ........................ 232  
Associated Registers, Transmit ....................... 231  
Reception ........................................................ 232  
Transmission ................................................... 231  
Extended Instruction Set  
ADDFSR .................................................................. 322  
ADDULNK ............................................................... 322  
and Using MPLAB Tools ......................................... 328  
CALLW .................................................................... 323  
Considerations for Use ............................................ 326  
MOVSF .................................................................... 323  
MOVSS .................................................................... 324  
PUSHL ..................................................................... 324  
SUBFSR .................................................................. 325  
SUBULNK ................................................................ 325  
Syntax ...................................................................... 321  
External Clock Input ........................................................... 30  
DC Characteristics ........................................................... 347  
Power-Down and Supply Current ............................ 337  
Supply Voltage ......................................................... 336  
DCFSNZ .......................................................................... 299  
DECF ............................................................................... 298  
DECFSZ ........................................................................... 299  
Development Support ...................................................... 329  
Device Differences ........................................................... 386  
Device Overview .................................................................. 9  
Details on Individual Family Members ....................... 10  
Features (table) .......................................................... 11  
New Core Features ...................................................... 9  
Other Special Features .............................................. 10  
Device Reset Timers .......................................................... 51  
Oscillator Start-up Timer (OST) ................................. 51  
PLL Lock Time-out ..................................................... 51  
Power-up Timer (PWRT) ........................................... 51  
Time-out Sequence .................................................... 51  
Direct Addressing ............................................................... 74  
E
Effect on Standard PIC MCU Instructions ........................ 326  
Effects of Power-Managed Modes on Various  
Clock Sources ............................................................ 38  
Electrical Characteristics .................................................. 333  
Enhanced Capture/Compare/PWM (ECCP) .................... 153  
Associated Registers ............................................... 166  
Capture and Compare Modes .................................. 154  
Capture Mode. See Capture (ECCP Module).  
Outputs and Configuration ....................................... 154  
Pin Configurations for ECCP1 ................................. 154  
PWM Mode. See PWM (ECCP Module).  
Standard PWM Mode ............................................... 154  
Timer Resources ...................................................... 154  
Enhanced PWM Mode. See PWM (ECCP Module). ........ 155  
Enhanced Universal Synchronous Asynchronous Receiver  
Transmitter (EUSART). See EUSART.  
F
Fail-Safe Clock Monitor ........................................... 259, 272  
Exiting Operation ..................................................... 272  
Interrupts in Power-Managed Modes ...................... 273  
POR or Wake From Sleep ....................................... 273  
WDT During Oscillator Failure ................................. 272  
Fast Register Stack ........................................................... 62  
Firmware Instructions ...................................................... 279  
Flash Program Memory ..................................................... 79  
Associated Registers ................................................. 87  
Control Registers ....................................................... 80  
EECON1 and EECON2 ..................................... 80  
TABLAT (Table Latch) Register ........................ 82  
TBLPTR (Table Pointer) Register ...................... 82  
Erase Sequence ........................................................ 84  
Erasing ...................................................................... 84  
Operation During Code-Protect ................................. 87  
Reading ..................................................................... 83  
Table Pointer  
Boundaries ........................................................ 82  
Boundaries Based on Operation ....................... 82  
Operations with TBLRD and TBLWT (table) ..... 82  
Table Reads and Table Writes .................................. 79  
Write Sequence ......................................................... 85  
Writing ....................................................................... 85  
Protection Against Spurious Writes ................... 87  
Unexpected Termination ................................... 87  
Write Verify ........................................................ 87  
FSCM. See Fail-Safe Clock Monitor.  
Equations  
A/D Acquisition Time ................................................ 238  
A/D Minimum Charging Time ................................... 238  
Calculating the Minimum Required  
Acquisition Time .............................................. 238  
Errata ................................................................................... 8  
EUSART  
Asynchronous Mode ................................................ 221  
12-Bit Break Transmit and Receive ................. 227  
Associated Registers, Receive ........................ 225  
Associated Registers, Transmit ....................... 223  
Auto-Wake-up on Sync Break ......................... 226  
Receiver ........................................................... 224  
Setting up 9-Bit Mode with Address Detect ..... 224  
Transmitter ....................................................... 221  
Baud Rate Generator  
Operation in Power-Managed Mode ................ 215  
Baud Rate Generator (BRG) .................................... 215  
Associated Registers ....................................... 216  
Auto-Baud Rate Detect .................................... 219  
Baud Rate Error, Calculating ........................... 216  
Baud Rates, Asynchronous Modes ................. 217  
High Baud Rate Select (BRGH Bit) ................. 215  
Sampling .......................................................... 215  
G
GOTO .............................................................................. 300  
H
Hardware Multiplier ............................................................ 95  
Introduction ................................................................ 95  
Operation ................................................................... 95  
Performance Comparison .......................................... 95  
© 2009 Microchip Technology Inc.  
DS39689F-page 391  
PIC18F2221/2321/4221/4321 FAMILY  
High/Low-Voltage Detect .................................................253  
Applications ..............................................................256  
Associated Registers ...............................................257  
Characteristics .........................................................351  
Current Consumption ...............................................255  
Effects of a Reset .....................................................257  
Operation .................................................................254  
During Sleep ....................................................257  
Setup ........................................................................255  
Start-up Time ...........................................................255  
Typical Application ...................................................256  
HLVD. See High/Low-Voltage Detect. .............................253  
Instruction Cycle ................................................................ 63  
Clocking Scheme ....................................................... 63  
Instruction Flow/Pipelining ................................................. 63  
Instruction Set .................................................................. 279  
ADDLW .................................................................... 285  
ADDWF .................................................................... 285  
ADDWF (Indexed Literal Offset Mode) .................... 327  
ADDWFC ................................................................. 286  
ANDLW .................................................................... 286  
ANDWF .................................................................... 287  
BC ............................................................................ 287  
BCF ......................................................................... 288  
BN ............................................................................ 288  
BNC ......................................................................... 289  
BNN ......................................................................... 289  
BNOV ...................................................................... 290  
BNZ ......................................................................... 290  
BOV ......................................................................... 293  
BRA ......................................................................... 291  
BSF .......................................................................... 291  
BSF (Indexed Literal Offset Mode) .......................... 327  
BTFSC ..................................................................... 292  
BTFSS ..................................................................... 292  
BTG ......................................................................... 293  
BZ ............................................................................ 294  
CALL ........................................................................ 294  
CLRF ....................................................................... 295  
CLRWDT ................................................................. 295  
COMF ...................................................................... 296  
CPFSEQ .................................................................. 296  
CPFSGT .................................................................. 297  
CPFSLT ................................................................... 297  
DAW ........................................................................ 298  
DCFSNZ .................................................................. 299  
DECF ....................................................................... 298  
DECFSZ .................................................................. 299  
Extended Instruction Set ......................................... 321  
General Format ........................................................ 281  
GOTO ...................................................................... 300  
INCF ........................................................................ 300  
INCFSZ .................................................................... 301  
INFSNZ .................................................................... 301  
IORLW ..................................................................... 302  
IORWF ..................................................................... 302  
LFSR ....................................................................... 303  
MOVF ...................................................................... 303  
MOVFF .................................................................... 304  
MOVLB .................................................................... 304  
MOVLW ................................................................... 305  
MOVWF ................................................................... 305  
MULLW .................................................................... 306  
MULWF .................................................................... 306  
NEGF ....................................................................... 307  
NOP ......................................................................... 307  
Opcode Field Descriptions ....................................... 280  
POP ......................................................................... 308  
PUSH ....................................................................... 308  
RCALL ..................................................................... 309  
RESET ..................................................................... 309  
RETFIE .................................................................... 310  
RETLW .................................................................... 310  
RETURN .................................................................. 311  
RLCF ....................................................................... 311  
RLNCF ..................................................................... 312  
RRCF ....................................................................... 312  
I
I/O Ports ...........................................................................111  
2
I C Mode (MSSP)  
Acknowledge Sequence Timing ...............................204  
Associated Registers ...............................................210  
Baud Rate Generator ...............................................197  
Bus Collision  
During a Repeated Start Condition ..................208  
During a Start Condition ...................................206  
During a Stop Condition ...................................209  
Clock Arbitration .......................................................198  
Clock Stretching .......................................................190  
10-Bit Slave Receive Mode (SEN = 1) .............190  
10-Bit Slave Transmit Mode .............................190  
7-Bit Slave Receive Mode (SEN = 1) ...............190  
7-Bit Slave Transmit Mode ...............................190  
Clock Synchronization and the CKP Bit ...................191  
Effects of a Reset .....................................................205  
General Call Address Support .................................194  
2
I C Clock Rate w/BRG .............................................197  
Master Mode ............................................................195  
Operation .........................................................196  
Reception .........................................................201  
Repeated Start Condition Timing .....................200  
Start Condition Timing .....................................199  
Transmission ....................................................201  
Multi-Master Communication, Bus Collision  
and Arbitration ..................................................205  
Multi-Master Mode ...................................................205  
Operation .................................................................181  
Read/Write Bit Information (R/W Bit) .......................181  
Read/Write Bit Information (R/W Bit) .......................183  
Registers ..................................................................176  
Serial Clock (RC3/SCK/SCL) ...................................183  
Slave Mode ..............................................................181  
Address Masking .............................................182  
Addressing .......................................................181  
Reception .........................................................183  
Transmission ....................................................183  
Sleep Operation .......................................................205  
Stop Condition Timing ..............................................204  
ID Locations ............................................................. 259, 277  
INCF .................................................................................300  
INCFSZ ............................................................................301  
In-Circuit Debugger ..........................................................277  
In-Circuit Serial Programming (ICSP) ......................259, 277  
Single-Supply ...........................................................277  
Indexed Literal Offset Addressing  
and Standard PIC18 Instructions .............................326  
Indexed Literal Offset Mode .............................................326  
Indirect Addressing ............................................................74  
INFSNZ ............................................................................301  
Initialization Conditions for all Registers ......................55–58  
DS39689F-page 392  
© 2009 Microchip Technology Inc.  
PIC18F2221/2321/4221/4321 FAMILY  
RRNCF .................................................................... 313  
MOVSS ............................................................................ 324  
MOVWF ........................................................................... 305  
MPLAB ASM30 Assembler, Linker, Librarian .................. 330  
MPLAB ICD 2 In-Circuit Debugger .................................. 331  
MPLAB ICE 2000 High-Performance Universal  
SETF ........................................................................ 313  
SETF (Indexed Literal Offset Mode) ........................ 327  
SLEEP ..................................................................... 314  
Standard Instructions ............................................... 279  
SUBFWB .................................................................. 314  
SUBLW .................................................................... 315  
SUBWF .................................................................... 315  
SUBWFB .................................................................. 316  
SWAPF .................................................................... 316  
TBLRD ..................................................................... 317  
TBLWT ..................................................................... 318  
TSTFSZ ................................................................... 319  
XORLW .................................................................... 319  
XORWF .................................................................... 320  
INTCON Registers ..................................................... 99–101  
In-Circuit Emulator ................................................... 331  
MPLAB Integrated Development Environment  
Software .................................................................. 329  
MPLAB PM3 Device Programmer ................................... 331  
MPLAB REAL ICE In-Circuit Emulator System ............... 331  
MPLINK Object Linker/MPLIB Object Librarian ............... 330  
MSSP  
ACK Pulse ....................................................... 181, 183  
Control Registers (general) ..................................... 167  
2
2
I C Mode. See I C Mode.  
Module Overview ..................................................... 167  
SPI Master/Slave Connection .................................. 171  
SPI Mode. See SPI Mode.  
2
Inter-Integrated Circuit. See I C.  
Internal Oscillator Block ..................................................... 32  
Adjustment ................................................................. 32  
INTIO Modes .............................................................. 32  
INTOSC Frequency Drift ............................................ 33  
INTOSC Output Frequency ........................................ 32  
OSCTUNE Register ................................................... 32  
PLL in INTOSC Modes .............................................. 33  
Internal RC Oscillator  
SSPBUF Register .................................................... 172  
SSPSR Register ...................................................... 172  
MULLW ............................................................................ 306  
MULWF ............................................................................ 306  
N
NEGF ............................................................................... 307  
NOP ................................................................................. 307  
Use with WDT .......................................................... 269  
Internet Address ............................................................... 399  
Interrupt Sources ............................................................. 259  
A/D Conversion Complete ....................................... 237  
Capture Complete (CCP) ......................................... 147  
Compare Complete (CCP) ....................................... 148  
Interrupt-on-Change (RB7:RB4) .............................. 114  
INTx Pin ................................................................... 109  
PORTB, Interrupt-on-Change .................................. 109  
TMR0 ....................................................................... 109  
TMR0 Overflow ........................................................ 131  
TMR1 Overflow ........................................................ 133  
TMR2 to PR2 Match (PWM) ............................ 150, 155  
TMR3 Overflow ................................................ 141, 143  
Interrupts ............................................................................ 97  
INTOSC, INTRC. See Internal Oscillator Block.  
O
Oscillator Configuration ..................................................... 29  
EC .............................................................................. 29  
ECIO .......................................................................... 29  
HS .............................................................................. 29  
HSPLL ....................................................................... 29  
Internal Oscillator Block ............................................. 32  
INTIO1 ....................................................................... 29  
INTIO2 ....................................................................... 29  
LP .............................................................................. 29  
RC ............................................................................. 29  
RCIO .......................................................................... 29  
XT .............................................................................. 29  
Oscillator Selection .......................................................... 259  
Oscillator Start-up Timer (OST) ................................... 38, 51  
Oscillator Switching ........................................................... 35  
Oscillator Transitions ......................................................... 36  
Oscillator, Timer1 ..................................................... 133, 143  
Oscillator, Timer3 ............................................................. 141  
IORLW ............................................................................. 302  
IORWF ............................................................................. 302  
IPR Registers ................................................................... 106  
L
LFSR ................................................................................ 303  
Low-Voltage ICSP Programming. See Single-Supply ICSP  
Programming  
P
Packaging Information ..................................................... 373  
Marking .................................................................... 373  
Parallel Slave Port (PSP) ......................................... 120, 126  
Associated Registers ............................................... 127  
CS (Chip Select) ...................................................... 126  
PORTD .................................................................... 126  
RD (Read Input) ...................................................... 126  
Select (PSPMODE Bit) .................................... 120, 126  
WR (Write Input) ...................................................... 126  
PICSTART Plus Development Programmer .................... 332  
PIE Registers ................................................................... 104  
Pin Functions  
M
Master Clear (MCLR) ......................................................... 49  
Master Synchronous Serial Port (MSSP). See MSSP.  
Memory Organization ......................................................... 59  
Data Memory ............................................................. 65  
Program Memory ....................................................... 59  
Memory Programming Requirements .............................. 349  
Microchip Internet Web Site ............................................. 399  
Migration from Baseline to Enhanced Devices ................ 387  
Migration from High-End to Enhanced Devices ............... 388  
Migration from Mid-Range to Enhanced Devices ............ 388  
MOVF ............................................................................... 303  
MOVFF ............................................................................ 304  
MOVLB ............................................................................ 304  
MOVLW ........................................................................... 305  
MOVSF ............................................................................ 323  
MCLR/VPP/RE3 ................................................... 14, 18  
OSC1/CLKI/RA7 .................................................. 14, 18  
OSC2/CLKO/RA6 ................................................ 14, 18  
RA0/AN0 .............................................................. 15, 19  
RA1/AN1 .............................................................. 15, 19  
© 2009 Microchip Technology Inc.  
DS39689F-page 393  
PIC18F2221/2321/4221/4321 FAMILY  
RA2/AN2/VREF-/CVREF ........................................ 15, 19  
RA3/AN3/VREF+ ................................................... 15, 19  
RA4/T0CKI/C1OUT .............................................. 15, 19  
RA5/AN4/SS/HLVDIN/C2OUT ............................. 15, 19  
RB0/INT0/FLT0/AN12 .......................................... 16, 20  
RB1/INT1/AN10 ................................................... 16, 20  
RB2/INT2/AN8 ..................................................... 16, 20  
RB3/AN9/CCP2 ................................................... 16, 20  
RB4/KBI0/AN11 ................................................... 16, 20  
RB5/KBI1/PGM .................................................... 16, 20  
RB6/KBI2/PGC .................................................... 16, 20  
RB7/KBI3/PGD .................................................... 16, 20  
RC0/T1OSO/T13CKI ...........................................17, 21  
RC1/T1OSI/CCP2 ................................................ 17, 21  
RC2/CCP1 .................................................................17  
RC2/CCP1/P1A .........................................................21  
RC3/SCK/SCL ..................................................... 17, 21  
RC4/SDI/SDA ...................................................... 17, 21  
RC5/SDO ............................................................. 17, 21  
RC6/TX/CK .......................................................... 17, 21  
RC7/RX/DT .......................................................... 17, 21  
RD0/PSP0 ..................................................................22  
RD1/PSP1 ..................................................................22  
RD2/PSP2 ..................................................................22  
RD3/PSP3 ..................................................................22  
RD4/PSP4 ..................................................................22  
RD5/PSP5/P1B ..........................................................22  
RD6/PSP6/P1C ..........................................................22  
RD7/PSP7/P1D ..........................................................22  
RE0/RD/AN5 ..............................................................23  
RE1/WR/AN6 .............................................................23  
RE2/CS/AN7 ..............................................................23  
VDD ....................................................................... 17, 23  
VSS ....................................................................... 17, 23  
Pinout I/O Descriptions  
PORTE  
Associated Registers ............................................... 125  
LATE Register ......................................................... 123  
PORTE Register ...................................................... 123  
PSP Mode Select (PSPMODE Bit) .......................... 120  
TRISE Register ........................................................ 123  
Power-Managed Modes ..................................................... 39  
and A/D Operation ................................................... 240  
and EUSART Operation .......................................... 215  
and PWM Operation ................................................ 165  
and SPI Operation ................................................... 175  
Clock Sources ............................................................ 39  
Clock Transitions and Status Indicators .................... 40  
Effects on Clock Sources ........................................... 38  
Entering ..................................................................... 39  
Exiting Idle and Sleep Modes .................................... 45  
By Interrupt ........................................................ 45  
By Reset ............................................................ 45  
By WDT Time-out .............................................. 45  
Without an Oscillator Start-up Delay ................. 46  
Idle Modes ................................................................. 43  
PRI_IDLE ........................................................... 44  
RC_IDLE ........................................................... 45  
SEC_IDLE ......................................................... 44  
Multiple Sleep Commands ......................................... 40  
Run Modes ................................................................ 40  
PRI_RUN ........................................................... 40  
RC_RUN ............................................................ 41  
SEC_RUN ......................................................... 40  
Sleep Mode ............................................................... 43  
Summary (table) ........................................................ 39  
Power-on Reset (POR) ...................................................... 49  
Power-up Timer (PWRT) ........................................... 51  
Time-out Sequence ................................................... 51  
Power-up Delays ............................................................... 38  
Power-up Timer (PWRT) ................................................... 38  
Prescaler  
Timer2 ..................................................................... 156  
Prescaler, Timer0 ............................................................ 131  
Prescaler, Timer2 ............................................................ 151  
PRI_IDLE Mode ................................................................. 44  
PRI_RUN Mode ................................................................. 40  
Program Counter ............................................................... 60  
PCL, PCH and PCU Registers .................................. 60  
PCLATH and PCLATU Registers .............................. 60  
Program Memory  
and Extended Instruction Set .................................... 77  
Instructions ................................................................ 64  
Two-Word .......................................................... 64  
Interrupt Vector .......................................................... 59  
Look-up Tables .......................................................... 62  
Map and Stack (diagram) .......................................... 59  
Reset Vector .............................................................. 59  
Program Verification ........................................................ 274  
Programming, Device Instructions ................................... 279  
PSP. See Parallel Slave Port.  
PIC18F2221/2321 ......................................................14  
PIC18F4221/4321 ......................................................18  
PIR Registers ...................................................................102  
PLL Frequency Multiplier ...................................................31  
HSPLL Oscillator Mode ..............................................31  
Use with INTOSC .......................................................31  
POP ..................................................................................308  
POR. See Power-on Reset.  
PORTA  
Associated Registers ...............................................113  
LATA Register ..........................................................111  
PORTA Register ......................................................111  
TRISA Register ........................................................111  
PORTB  
Associated Registers ...............................................116  
LATB Register ..........................................................114  
PORTB Register ......................................................114  
TRISB Register ........................................................114  
PORTC  
Associated Registers ...............................................119  
LATC Register .........................................................117  
PORTC Register ......................................................117  
RC3/SCK/SCL Pin ...................................................183  
TRISC Register ........................................................117  
PORTD  
Pulse-Width Modulation. See PWM (CCP Module) and  
PWM (ECCP Module).  
PUSH ............................................................................... 308  
PUSH and POP Instructions .............................................. 61  
PUSHL ............................................................................. 324  
PWM (CCP Module)  
Associated Registers ...............................................122  
LATD Register .........................................................120  
Parallel Slave Port (PSP) Function ..........................120  
PORTD Register ......................................................120  
TRISD Register ........................................................120  
Associated Registers ............................................... 152  
Auto-Shutdown (CCP1 Only) ................................... 151  
Duty Cycle ............................................................... 150  
DS39689F-page 394  
© 2009 Microchip Technology Inc.  
PIC18F2221/2321/4221/4321 FAMILY  
Example Frequencies/Resolutions .......................... 151  
ECCP1DEL (PWM Dead-Band Delay) .................... 162  
EECON1 (Data EEPROM Control 1) ................... 81, 90  
HLVDCON (High/Low-Voltage Detect Control) ....... 253  
INTCON (Interrupt Control) ....................................... 99  
INTCON2 (Interrupt Control 2) ................................ 100  
INTCON3 (Interrupt Control 3) ................................ 101  
IPR1 (Peripheral Interrupt Priority 1) ....................... 106  
IPR2 (Peripheral Interrupt Priority 2) ....................... 107  
OSCCON (Oscillator Control) .................................... 37  
OSCTUNE (Oscillator Tuning) ................................... 33  
PIE1 (Peripheral Interrupt Enable 1) ....................... 104  
PIE2 (Peripheral Interrupt Enable 2) ....................... 105  
PIR1 (Peripheral Interrupt Request (Flag) 1) ........... 102  
PIR2 (Peripheral Interrupt Request (Flag) 2) ........... 103  
RCON (Reset Control) ....................................... 48, 108  
RCSTA (Receive Status and Control) ..................... 213  
SSPADD(MSSP Address) ....................................... 180  
Operation Setup ....................................................... 151  
Period ....................................................................... 150  
TMR2 to PR2 Match ........................................ 150, 155  
PWM (ECCP Module) ...................................................... 155  
CCPR1H:CCPR1L Registers ................................... 155  
Duty Cycle ................................................................ 156  
Effects of a Reset ..................................................... 165  
Enhanced PWM Auto-Shutdown ............................. 162  
Example Frequencies/Resolutions .......................... 156  
Full-Bridge Application Example .............................. 160  
Full-Bridge Mode ...................................................... 159  
Direction Change ............................................. 160  
Half-Bridge Mode ..................................................... 158  
Half-Bridge Output Mode Applications  
Example ........................................................... 158  
Operation in Power-Managed Modes ...................... 165  
Operation with Fail-Safe Clock Monitor ................... 165  
Output Configurations .............................................. 156  
Output Relationships (Active-High) .......................... 157  
Output Relationships (Active-Low) ........................... 157  
Period ....................................................................... 155  
Programmable Dead-Band Delay ............................ 162  
Setup for PWM Operation ........................................ 165  
Start-up Considerations ........................................... 164  
2
SSPCON1 (MSSP Control 1, I C Mode) ................. 178  
SSPCON1 (MSSP Control 1, SPI Mode) ................ 169  
2
SSPCON2 (MSSP Control 2, I C Mode) ................. 179  
2
SSPSTAT (MSSP Status, I C Mode) ...................... 177  
SSPSTAT (MSSP Status, SPI Mode) ...................... 168  
STATUS .................................................................... 72  
STKPTR (Stack Pointer) ............................................ 61  
T0CON (Timer0 Control) ......................................... 129  
T1CON (Timer1 Control) ......................................... 133  
T2CON (Timer2 Control) ......................................... 139  
T3CON (Timer3 Control) ......................................... 141  
TRISE (PORTE/PSP Control) ................................. 124  
TXSTA (Transmit Status and Control) ..................... 212  
WDTCON (Watchdog Timer Control) ...................... 270  
RESET ............................................................................. 309  
Reset State of Registers .................................................... 54  
Resets ....................................................................... 47, 259  
Brown-out Reset (BOR) ........................................... 259  
Oscillator Start-up Timer (OST) ............................... 259  
Power-on Reset (POR) ............................................ 259  
Power-up Timer (PWRT) ......................................... 259  
RETFIE ............................................................................ 310  
RETLW ............................................................................ 310  
RETURN .......................................................................... 311  
Return Address Stack ........................................................ 60  
Associated Registers ................................................. 60  
Return Stack Pointer (STKPTR) ........................................ 61  
Revision History ............................................................... 385  
RLCF ............................................................................... 311  
RLNCF ............................................................................. 312  
RRCF ............................................................................... 312  
RRNCF ............................................................................ 313  
Q
Q Clock .................................................................... 151, 156  
R
RAM. See Data Memory.  
RC Oscillator  
RCIO Oscillator Mode ................................................ 31  
RC_IDLE Mode .................................................................. 45  
RC_RUN Mode .................................................................. 41  
RCALL ............................................................................. 309  
RCON Register  
Bit Status During Initialization .................................... 54  
Reader Response ............................................................ 400  
Register File ....................................................................... 67  
Register File Summary ................................................ 69–71  
Registers  
ADCON0 (A/D Control 0) ......................................... 233  
ADCON1 (A/D Control 1) ......................................... 234  
ADCON2 (A/D Control 2) ......................................... 235  
BAUDCON (Baud Rate Control) .............................. 214  
CCP1CON (Enhanced Capture/Compare/PWM  
Control 1) ......................................................... 153  
CCPxCON (CCPx Control) ...................................... 145  
CMCON (Comparator Control) ................................ 243  
CONFIG1H (Configuration 1 High) .......................... 260  
CONFIG2H (Configuration 2 High) .......................... 262  
CONFIG2L (Configuration 2 Low) ............................ 261  
CONFIG3H (Configuration 3 High) .......................... 263  
CONFIG4L (Configuration 4 Low) ............................ 264  
CONFIG5H (Configuration 5 High) .......................... 265  
CONFIG5L (Configuration 5 Low) ............................ 265  
CONFIG6H (Configuration 6 High) .......................... 266  
CONFIG6L (Configuration 6 Low) ............................ 266  
CONFIG7H (Configuration 7 High) .......................... 267  
CONFIG7L (Configuration 7 Low) ............................ 267  
CVRCON (Comparator Voltage  
S
SCK ................................................................................. 167  
SDI ................................................................................... 167  
SDO ................................................................................. 167  
SEC_IDLE Mode ............................................................... 44  
SEC_RUN Mode ................................................................ 40  
Serial Clock, SCK ............................................................ 167  
Serial Data In (SDI) .......................................................... 167  
Serial Data Out (SDO) ..................................................... 167  
Serial Peripheral Interface. See SPI Mode.  
SETF ............................................................................... 313  
Single-Supply ICSP Programming.  
Reference Control) .......................................... 249  
DEVID1 (Device ID 1) .............................................. 268  
DEVID2 (Device ID 2) .............................................. 268  
ECCP1AS (ECCP Auto-Shutdown Control) ............. 163  
Slave Select (SS) ............................................................. 167  
SLEEP ............................................................................. 314  
Sleep  
OSC1 and OSC2 Pin States ...................................... 38  
© 2009 Microchip Technology Inc.  
DS39689F-page 395  
PIC18F2221/2321/4221/4321 FAMILY  
Software Simulator (MPLAB SIM) ....................................330  
Special Event Trigger. See Compare (CCP Mode).  
TMR1L Register ....................................................... 133  
Use as a Real-Time Clock ....................................... 136  
Timer2 .............................................................................. 139  
Associated Registers ............................................... 140  
Interrupt ................................................................... 140  
Operation ................................................................. 139  
Output ...................................................................... 140  
PR2 Register ................................................... 150, 155  
TMR2 to PR2 Match Interrupt .................................. 155  
TMR2-to-PR2 Match Interrupt ................................. 150  
Timer3 .............................................................................. 141  
16-Bit Read/Write Mode .......................................... 143  
Associated Registers ............................................... 143  
Operation ................................................................. 142  
Oscillator .......................................................... 141, 143  
Overflow Interrupt ............................................ 141, 143  
Special Event Trigger (CCP) ................................... 143  
TMR3H Register ...................................................... 141  
TMR3L Register ....................................................... 141  
Timing Diagrams  
Special Event Trigger. See Compare (ECCP Module).  
Special Features of the CPU ............................................259  
Special Function Registers ................................................68  
Map ............................................................................68  
SPI Mode (MSSP)  
Associated Registers ...............................................175  
Bus Mode Compatibility ...........................................175  
Effects of a Reset .....................................................175  
Enabling SPI I/O ......................................................171  
Master Mode ............................................................172  
Master/Slave Connection .........................................171  
Operation .................................................................170  
Operation in Power-Managed Modes ......................175  
Serial Clock ..............................................................167  
Serial Data In ...........................................................167  
Serial Data Out ........................................................167  
Slave Mode ..............................................................173  
Slave Select .............................................................167  
Slave Select Synchronization ..................................173  
SPI Clock .................................................................172  
Typical Connection ..................................................171  
SS ....................................................................................167  
SSPOV .............................................................................201  
SSPOV Status Flag ..........................................................201  
SSPSTAT Register  
A/D Conversion ........................................................ 371  
Acknowledge Sequence .......................................... 204  
Asynchronous Reception ......................................... 225  
Asynchronous Transmission .................................... 222  
Asynchronous Transmission (Back to Back) ........... 222  
Automatic Baud Rate Calculation ............................ 220  
Auto-Wake-up Bit (WUE) During  
R/W Bit ............................................................. 181, 183  
Stack Full/Underflow Resets ..............................................62  
SUBFSR ...........................................................................325  
SUBFWB ..........................................................................314  
SUBLW ............................................................................315  
SUBULNK ........................................................................325  
SUBWF ............................................................................315  
SUBWFB ..........................................................................316  
SWAPF ............................................................................316  
Normal Operation ............................................ 226  
Auto-Wake-up Bit (WUE) During Sleep ................... 226  
Baud Rate Generator with Clock Arbitration ............ 198  
BRG Overflow Sequence ......................................... 220  
BRG Reset Due to SDA Arbitration During  
Start Condition ................................................. 207  
Brown-out Reset (BOR) ........................................... 357  
Bus Collision During a Repeated Start  
Condition (Case 1) ........................................... 208  
Bus Collision During a Repeated Start  
Condition (Case 2) ........................................... 208  
Bus Collision During a Start Condition  
(SCL = 0) ......................................................... 207  
Bus Collision During a Stop Condition (Case 1) ...... 209  
Bus Collision During a Stop Condition (Case 2) ...... 209  
Bus Collision During Start Condition  
(SDA Only) ...................................................... 206  
Bus Collision for Transmit and Acknowledge .......... 205  
Capture/Compare/PWM (All CCP Modules) ............ 359  
CLKO and I/O .......................................................... 356  
Clock Synchronization ............................................. 191  
Clock/Instruction Cycle .............................................. 63  
EUSART Synchronous Receive (Master/Slave) ...... 369  
EUSART Synchronous Transmission  
T
Table Reads/Table Writes ..................................................62  
TBLRD .............................................................................317  
TBLWT .............................................................................318  
Time-out in Various Situations (table) ................................51  
Timer0 ..............................................................................129  
Associated Registers ...............................................131  
Operation .................................................................130  
Overflow Interrupt ....................................................131  
Prescaler ..................................................................131  
Prescaler Assignment (PSA Bit) ..............................131  
Prescaler Select (T0PS2:T0PS0 Bits) .....................131  
Prescaler. See Prescaler, Timer0.  
Reads and Writes in 16-Bit Mode ............................130  
Source Edge Select (T0SE Bit) ................................130  
Source Select (T0CS Bit) .........................................130  
Switching Prescaler Assignment ..............................131  
Timer1 ..............................................................................133  
16-Bit Read/Write Mode ...........................................135  
Associated Registers ...............................................137  
Interrupt ....................................................................136  
Operation .................................................................134  
Oscillator .......................................................... 133, 135  
Layout Considerations .....................................136  
Low-Power Option ...........................................135  
Overflow Interrupt ....................................................133  
Resetting, Using the CCP Special Event Trigger .....136  
Special Event Trigger (ECCP) .................................154  
TMR1H Register ......................................................133  
(Master/Slave) ................................................. 369  
Example SPI Master Mode (CKE = 0) ..................... 361  
Example SPI Master Mode (CKE = 1) ..................... 362  
Example SPI Slave Mode (CKE = 0) ....................... 363  
Example SPI Slave Mode (CKE = 1) ....................... 364  
External Clock (All Modes Except PLL) ................... 354  
Fail-Safe Clock Monitor ........................................... 273  
First Start Bit Timing ................................................ 199  
Full-Bridge PWM Output .......................................... 159  
Half-Bridge PWM Output ......................................... 158  
High/Low-Voltage Detect Characteristics ................ 351  
High-Voltage Detect Operation (VDIRMAG = 1) ..... 256  
2
I C Bus Data ............................................................ 365  
2
I C Bus Start/Stop Bits ............................................ 365  
DS39689F-page 396  
© 2009 Microchip Technology Inc.  
PIC18F2221/2321/4221/4321 FAMILY  
2
I C Master Mode (7 or 10-Bit Transmission) ........... 202  
Timing Diagrams and Specifications ............................... 354  
Capture/Compare/PWM Requirements  
2
I C Master Mode (7-Bit Reception) .......................... 203  
2
I C Slave Mode (10-Bit Reception, SEN = 0,  
(All CCP Modules) ........................................... 359  
CLKO and I/O Requirements ................................... 356  
EUSART Synchronous Receive Requirements ....... 369  
EUSART Synchronous Transmission Requirements ....  
369  
ADMSK = 01001) ............................................. 187  
2
I C Slave Mode (10-Bit Reception, SEN = 0) .......... 188  
2
I C Slave Mode (10-Bit Reception, SEN = 1) .......... 193  
2
I C Slave Mode (10-Bit Transmission) ..................... 189  
2
I C Slave Mode (7-Bit Reception, SEN = 0,  
Example SPI Mode Requirements  
ADMSK = 01011) ............................................. 185  
I C Slave Mode (7-Bit Reception, SEN = 0) ............ 184  
I C Slave Mode (7-Bit Reception, SEN = 1) ............ 192  
I C Slave Mode (7-Bit Transmission) ....................... 186  
I C Slave Mode General Call Address  
Sequence (7 or 10-Bit Addressing Mode) ........ 194  
I C Stop Condition Receive or Transmit Mode ........ 204  
(Master Mode, CKE = 0) .................................. 361  
Example SPI Mode Requirements  
(Master Mode, CKE = 1) .................................. 362  
Example SPI Mode Requirements  
(Slave Mode, CKE = 0) .................................... 363  
Example SPI Mode Requirements  
2
2
2
2
2
(Slave Mode, CKE = 1) .................................... 364  
External Clock Requirements .................................. 354  
Low-Voltage Detect Operation (VDIRMAG = 0) ...... 255  
2
2
Master SSP I C Bus Data ........................................ 367  
I C Bus Data Requirements (Slave Mode) .............. 366  
2
2
Master SSP I C Bus Start/Stop Bits ........................ 367  
I C Bus Start/Stop Requirements (Slave Mode) ..... 365  
2
Parallel Slave Port (PIC18F4221/4321) ................... 360  
Parallel Slave Port (PSP) Read ............................... 127  
Parallel Slave Port (PSP) Write ............................... 127  
PWM Auto-Shutdown (PRSEN = 0,  
Master SSP I C Bus Data Requirements ................ 368  
2
Master SSP I C Bus Start/Stop Bits  
Requirements .................................................. 367  
Parallel Slave Port Requirements  
Auto-Restart Disabled) .................................... 164  
PWM Auto-Shutdown (PRSEN = 1,  
Auto-Restart Enabled) ..................................... 164  
PWM Direction Change ........................................... 161  
PWM Direction Change at Near  
100% Duty Cycle ............................................. 161  
PWM Output ............................................................ 150  
Repeated Start Condition ......................................... 200  
Reset, Watchdog Timer (WDT), Oscillator Start-up  
Timer (OST), Power-up Timer (PWRT) ........... 357  
Send Break Character Sequence ............................ 227  
Slave Synchronization ............................................. 173  
Slow Rise Time (MCLR Tied to VDD,  
(PIC18F4221/4321) ......................................... 360  
PLL Clock ................................................................ 355  
Reset, Watchdog Timer, Oscillator Start-up  
Timer, Power-up Timer and  
Brown-out Reset Requirements ...................... 357  
Timer0 and Timer1 External Clock  
Requirements .................................................. 358  
Top-of-Stack Access .......................................................... 60  
TRISE Register  
PSPMODE Bit ......................................................... 120  
TSTFSZ ........................................................................... 319  
Two-Speed Start-up ................................................. 259, 271  
Two-Word Instructions  
VDD Rise > TPWRT) ............................................ 53  
SPI Mode (Master Mode) ......................................... 172  
SPI Mode (Slave Mode, CKE = 0) ........................... 174  
SPI Mode (Slave Mode, CKE = 1) ........................... 174  
Synchronous Reception (Master Mode, SREN) ...... 230  
Synchronous Transmission ...................................... 228  
Synchronous Transmission (Through TXEN) .......... 229  
Time-out Sequence on POR w/PLL Enabled  
(MCLR Tied to VDD) ........................................... 53  
Time-out Sequence on Power-up  
(MCLR Not Tied to VDD, Case 1) ....................... 52  
Time-out Sequence on Power-up  
Example Cases ......................................................... 64  
TXSTA Register  
BRGH Bit ................................................................. 215  
V
Voltage Reference Specifications .................................... 350  
W
Watchdog Timer (WDT) ........................................... 259, 269  
Associated Registers ............................................... 270  
Control Register ....................................................... 269  
During Oscillator Failure .......................................... 272  
Programming Considerations .................................. 269  
WCOL ...................................................... 199, 200, 201, 204  
WCOL Status Flag ................................... 199, 200, 201, 204  
WWW Address ................................................................ 399  
WWW, On-Line Support ...................................................... 8  
(MCLR Not Tied to VDD, Case 2) ....................... 52  
Time-out Sequence on Power-up  
(MCLR Tied to VDD, VDD Rise < TPWRT) ........... 52  
Timer0 and Timer1 External Clock .......................... 358  
Transition for Entry to Idle Mode ................................ 44  
Transition for Entry to SEC_RUN Mode .................... 41  
Transition for Entry to Sleep Mode ............................ 43  
Transition for Two-Speed Start-up  
(INTOSC to HSPLL) ........................................ 271  
Transition for Wake from Idle to Run Mode ............... 44  
Transition for Wake from Sleep (HSPLL) ................... 43  
Transition from RC_RUN Mode to PRI_RUN Mode .. 42  
Transition from SEC_RUN Mode to  
X
XORLW ........................................................................... 319  
XORWF ........................................................................... 320  
PRI_RUN Mode (HSPLL) .................................. 41  
Transition to RC_RUN Mode ..................................... 42  
© 2009 Microchip Technology Inc.  
DS39689F-page 397  
PIC18F2221/2321/4221/4321 FAMILY  
NOTES:  
DS39689F-page 398  
© 2009 Microchip Technology Inc.  
PIC18F2221/2321/4221/4321 FAMILY  
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© 2009 Microchip Technology Inc.  
DS39689F-page 399  
PIC18F2221/2321/4221/4321 FAMILY  
READER RESPONSE  
It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip prod-  
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PIC18F2221/2321/4221/4321 Family  
DS39689F  
Literature Number:  
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Questions:  
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2. How does this document meet your hardware and software development needs?  
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DS39689F-page 400  
© 2009 Microchip Technology Inc.  
PIC18F2221/2321/4221/4321 FAMILY  
PIC18F2221/2321/4221/4321 PRODUCT IDENTIFICATION SYSTEM  
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.  
PART NO.  
Device  
X
/XX  
XXX  
Examples:  
Temperature  
Range  
Package  
Pattern  
a)  
PIC18F4321-I/P 301 = Industrial temp., PDIP  
package, Extended VDD limits, QTP pattern  
#301.  
b)  
c)  
PIC18LF2321-I/SO = Industrial temp., SOIC  
package, Extended VDD limits.  
Device  
PIC18F2221/2321(1), PIC18F4221/4321(1)  
,
PIC18LF4321-I/P = Industrial temp., PDIP  
package, normal VDD limits.  
PIC18F2221/2321T(2), PIC18F4221/4321T(2)  
VDD range 4.2V to 5.5V  
;
PIC18LF2221/2321(1), PIC18LF4221/4321(1)  
,
PIC18LF2221/2321T(2), PIC18LF4221/4321T(2)  
VDD range 2.0V to 5.5V  
;
Temperature Range  
Package  
I
E
=
=
-40°C to +85°C (Industrial)  
-40°C to +125°C (Extended)  
PT  
SO  
SS  
SP  
P
=
=
=
=
=
=
TQFP (Thin Quad Flatpack)  
Note 1:  
2:  
F
LF  
T
=
=
=
Standard Voltage Range  
Wide Voltage Range  
in tape and reel  
SOIC  
SSOP  
Skinny Plastic DIP  
PDIP  
ML  
QFN  
Pattern  
QTP, SQTP, Code or Special Requirements  
(blank otherwise)  
© 2009 Microchip Technology Inc.  
DS39689F-page 401  
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03/26/09  
DS39689F-page 402  
© 2009 Microchip Technology Inc.  

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