PIC18LF25K22T-I/MV [MICROCHIP]
28/40/44-Pin, Low-Power, High-Performance Microcontrollers with nanoWatt XLP Technology; 28 /40/ 44引脚，低功耗，高性能的微控制器采用nanoWatt XLP技术
| 型号： | PIC18LF25K22T-I/MV |
| 厂家： | 
MICROCHIP |
| 描述： | 28/40/44-Pin, Low-Power, High-Performance Microcontrollers with nanoWatt XLP Technology |
| 文件： | 总494页 (文件大小：5012K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
PIC18(L)F2X/4XK22
Data Sheet
28/40/44-Pin, Low-Power,
High-Performance Microcontrollers
with nanoWatt XLP Technology
2010 Microchip Technology Inc.
Preliminary
DS41412A
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART,
rfPIC and UNI/O are registered trademarks of Microchip
Technology Incorporated in the U.S.A. and other countries.
FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,
MXDEV, MXLAB, SEEVAL and The Embedded Control
Solutions Company are registered trademarks of Microchip
Technology Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, CodeGuard,
dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial
Programming, ICSP, Mindi, MiWi, MPASM, MPLAB Certified
logo, MPLIB, MPLINK, mTouch, Octopus, Omniscient Code
Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit,
32
PICtail, PIC logo, REAL ICE, rfLAB, Select Mode, Total
Endurance, TSHARC, UniWinDriver, WiperLock and ZENA
are trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2010, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
ISBN: 987-1-60932-018-8
Microchip received ISO/TS-16949:2002 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
DS41412A-page 2
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
28/40/44-Pin, Low-Power, High-Performance
Microcontrollers with nanoWatt XLP Technology
High-Performance RISC CPU:
Extreme Low-Power Management
with nanoWatt XLP:
• C Compiler Optimized Architecture:
- Optional extended instruction set designed to
optimize re-entrant code
• Up to 1024 Bytes Data EEPROM
• Up to 64 Kbytes Linear Program Memory
Addressing
• Sleep mode: 100 nA, typical
• Watchdog Timer: 500 nA, typical
• Timer1 Oscillator: 500 nA @ 32 kHz
• Peripheral Module Disable
• Up to 3896 Bytes Linear Data Memory Address-
ing
• Up to 16 MIPS Operation
• 16-bit Wide Instructions, 8-bit Wide Data Path
• Priority Levels for Interrupts
Special Microcontroller Features:
• Full 5.5V Operation – PIC18FXXK22 devices
• 1.8V to 3.6V Operation – PIC18LFXXK22 devices
• Self-Programmable under Software Control
• 31-Level, Software Accessible Hardware Stack
• High/Low-Voltage Detection (HLVD) module:
• 8 x 8 Single-Cycle Hardware Multiplier
- Programmable 16-Level
- Interrupt on High/Low-Voltage Detection
• Programmable Brown-out Reset (BOR):
- With software enable option
- Configurable shutdown in Sleep
• Extended Watchdog Timer (WDT):
- Programmable period from 4 ms to 131s
Flexible Oscillator Structure:
• Precision 16 MHz Internal Oscillator Block:
- Factory calibrated to ± 1%
- Selectable frequencies, 31 kHz to 16 MHz
- 64 MHz performance available using PLL –
no external components required
• Four Crystal modes up to 64 MHz
• Two External Clock modes up to 64 MHz
• 4X Phase Lock Loop (PLL)
•
In-Circuit Serial Programming™ (ICSP™):
- Single-Supply 3V
• In-Circuit Debug (ICD)
• Secondary Oscillator using Timer1 @ 32 kHz
• Fail-Safe Clock Monitor:
- Allows for safe shutdown if peripheral clock
stops
Peripheral Highlights:
• Up to 35 I/O Pins plus 1 Input-Only Pin:
- High-Current Sink/Source 25 mA/25 mA
- Three programmable external interrupts
- Four programmable interrupt-on-change
- Nine programmable weak pull-ups
- Programmable slew rate
- Two-Speed Oscillator Start-up
Analog Features:
• SR Latch:
• Analog-to-Digital Converter (ADC) module:
- 10-bit resolution, up to 30 external channels
- Auto-acquisition capability
- Conversion available during Sleep
- Fixed Voltage Reference (FVR) channel
- Independent input multiplexing
- Multiple Set/Reset input options
• Two Capture/Compare/PWM (CCP) modules
• Three Enhanced CCP (ECCP) modules:
- One, two or four PWM outputs
- Selectable polarity
• Analog Comparator module:
- Programmable dead time
- Auto-Shutdown and Auto-Restart
- PWM steering
- Two rail-to-rail analog comparators
- Independent input multiplexing
• Two Master Synchronous Serial Port (MSSP)
modules:
- 3-wire SPI (supports all 4 modes)
- I2C™ Master and Slave modes with address
mask
• Digital-to-Analog Converter (DAC) module:
- Fixed Voltage Reference (FVR) with 1.024V,
2.048V and 4.096V output levels
- 5-bit rail-to-rail resistive DAC with positive
and negative reference selection
• Charge Time Measurement Unit (CTMU) module:
- Supports capacitive touch sensing for touch
screens and capacitive switches
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 3
PIC18(L)F2X/4XK22
• Two Enhanced Universal Synchronous
Asynchronous Receiver Transmitter (EUSART)
modules:
- Supports RS-485, RS-232 and LIN
- RS-232 operation using internal oscillator
- Auto-Wake-up on Break
- Auto-Baud Detect
Program
Data Memory
Memory
MSSP
Device
PIC18(L)F23K22 8K
PIC18(L)F24K22 16K
4096
8192
512
768
256 25
256 25
256 25
19
19
19
19
30
30
30
30
2
2
2
2
2
2
2
2
1
1
1
1
2
2
2
2
2
2
2
2
1
1
1
1
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
3
3
3
3
3
3
3
3
4
4
4
4
4
4
4
4
2
2
2
2
2
2
2
PIC18(L)F25K22 32K 16384 1536
PIC18(L)F26K22 64k
PIC18(L)F43K22 8K
PIC18(L)F44K22 16K
32768 3896 1024 25
4096
8192
512
768
256 36
256 36
256 36
PIC18(L)F45K22 32K 16384 1536
PIC18(L)F46K22 64k
Note 1: One pin is input only.
2: Channel count includes internal FVR and DAC channels.
32768 3896 1024 36
DS41412A-page 4
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
Pin Diagrams
28-pin PDIP, SOIC, SSOP
RB7
RB6
RB5
RB4
RB3
RB2
RB1
RB0
VDD
VSS
1
2
3
4
5
28
27
26
25
24
23
22
21
20
19
18
17
16
15
MCLR/VPP/RE3
RA0
RA1
RA2
RA3
RA4
RA5
VSS
RA7
RA6
RC0
RC1
RC2
RC3
6
7
8
9
10
11
RC7
RC6
RC5
RC4
12
13
14
28-pin QFN, UQFN(1)
28272625242322
RA2
1
2
3
4
5
6
7
21
20
19
18
17
16
15
RB3
RB2
RB1
RB0
VDD
VSS
RC7
RA3
RA4
RA5/
VSS
RA7
RA6
PIC18(L)F2XK22
8
9 10 1112 13 14
Note 1: The 28-pin UQFN package is available only for PIC18(L)F23K22 and PIC18(L)F24K22.
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 5
PIC18(L)F2X/4XK22
Pin Diagrams
40-pin PDIP
MCLR/VPP/RE3
RA0
1
2
3
4
5
6
7
8
RB7
RB6/
RB5
RB4
RB3
RB2
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
RA1
RA2/
RA3
RA4
RA5
RE0
RE1
RE2/
VDD
VSS
RA7
RA6
RC0
RC1
RC2
RB1
RB0
VDD
VSS
9
10
11
12
13
14
15
16
17
18
19
20
RD7
RD6
RD5
RD4
RC7
RC6
RC5
RC3
RD0
RC4
RD3
RD1
RD2
DS41412A-page 6
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
Pin Diagrams (Cont.’d)
44-pin TQFP
NC
1
2
3
4
5
6
7
8
9
10
11
33
32
31
30
29
28
27
26
25
24
23
RC7
RD4
RD5
RD6
RD7
VSS
VDD
RB0
RB1
RB2
RB3
RC0
RA6
RA7
VSS
VDD
RE2
RE1
RE0
RA5
RA4
PIC18(L)F4XK22
44-pin QFN
RC7
1
RA6
RA7
VSS
VSS
VDD
VDD
RE2
RE1
RE0
RA5
RA4
33
RD4
RD5
RD6
RD7
VSS
VDD
VDD
RB0
RB1
RB2
2
3
4
32
31
30
29
28
27
26
65 PIC18(L)F4XK22
7
8
9
10
11
25
24
23
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 7
PIC18(L)F2X/4XK22
TABLE 1:
PIC18(L)F2XK22 PIN SUMMARY
2
3
4
27
28
1
RA0
RA1
RA2
AN0
AN1
AN2
C12IN0-
C12IN1-
C2IN+
VREF-/
DACOUT
5
6
2
3
RA3
RA4
AN3
AN4
C1IN+
VREF+
C1OUT
SRQ
SRNQ HLVDIN
CCP5
T0CKI
7
4
7
RA5
RA6
C2OUT
SS1
SS2
10
OSC2/
CLKO
9
6
RA7
RB0
RB1
RB2
RB3
OSC1/
CLKI
21
22
23
24
18
19
20
21
AN12
AN10
AN8
SRI
CCP4
FLT0
INT0
INT1
INT2
Y
Y
Y
Y
C12IN3-
C12IN2-
P1C
SCK2/
SCL2
CTED1
CTED2
P1B
SDI2/
SDA
AN9
CCP2/
P2A(1)
SDO2
25
26
22
23
RB4
RB5
AN11
AN13
P1D
T5G
IOC
IOC
Y
Y
CCP3/
P3A(4)
P2B(3)
T1G
T3CKI(2)
27
28
11
24
25
8
RB6
RB7
RC0
TX2/CK2
RX2/DT2
IOC
IOC
Y
Y
PGC
PGD
P2B(3)
SOSCO/
T1CKI
T3CKI(2)
T3G
12
13
14
15
9
RC1
RC2
RC3
RC4
CCP2/
P2A(1)
SOSCI
10
11
12
AN14
AN15
AN16
CTPLS
CCP1/
P1A
T5CKI
SCK1/
SCL1
SDI1/
SDA1
16
17
13
14
RC5
RC6
AN17
AN18
SDO1
CCP3/
P3A(4)
TX1/CK1
RX1/DT1
18
1
15
26
RC7
RE3
AN19
P3B
MCLR/
VPP
8
5
VSS
VSS
VDD
19
20
16
17
Note 1: CCP2/P2A multiplexed in fuses.
2: T3CKI multiplexed in fuses.
3: P2B multiplexed in fuses.
4: CCP3/P3A multiplexed in fuses.
DS41412A-page 8
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
TABLE 2:
PIC18(L)F4XK22 PIN SUMMARY
2
3
4
19
20
21
19
20
21
RA0
RA1
RA2
AN0
AN1
AN2
C12IN0-
C12IN1-
C2IN+
VREF-
DACOUT
5
6
7
22
23
24
22
23
24
RA3
RA4
RA5
AN3
AN4
C1IN+
C1OUT
C2OUT
VREF+
SRQ
SRNQ HLVDIN
T0CKI
SS1
14
31
33
RA6
OSC2/
CLKO
13
30
32
RA7
OSC1/
CLKI
33
34
35
36
8
9
9
RB0
RB1
RB2
RB3
AN12
AN10
AN8
SRI
FLT0
INT0
INT1
INT2
Y
Y
Y
Y
10
11
12
C12IN3-
C12IN2-
10
11
CTED1
CTED2
AN9
CCP2/
P2A(1)
37
38
14
15
14
15
RB4
RB5
AN11
AN13
T5G
IOC
IOC
Y
Y
CCP3/
P3A(4)
T1G
T3CKI(2)
39
40
15
16
17
32
16
17
34
RB6
RB7
RC0
IOC
IOC
Y
Y
PGC
PGD
P2B(5)
SOSCO/
T1CKI
T3CKI(2)
T3G
16
17
18
23
35
36
37
42
35
36
37
42
RC1
RC2
RC3
RC4
CCP2(1)
P2A
SOSCI
AN14
AN15
AN16
CTPLS
CCP1/
P1A
T5CKI
SCK1/
SCL1
SDI1/
SDA1
24
25
43
44
43
44
RC5
RC6
AN17
AN18
SDO1
TX1/
CK1
26
19
20
1
1
RC7
RD0
RD1
AN19
AN20
AN21
RX1/
DT1
38
39
38
39
SCK2/
SCL2
CCP4
SDI2/
SDA2
21
22
27
28
29
40
41
2
40
41
2
RD2
RD3
RD4
RD5
RD6
AN22
AN23
AN24
AN25
AN26
P2B(5)
P2C
P2D
P1B
SS2
SD02
3
3
4
4
P1C
TX2
CK2
30
8
5
5
RD7
RE0
AN27
AN5
P1D
RX2/
DT2
25
25
CCP3/
P3A(4)
Note 1: CCP2 multiplexed in fuses.
2: T3CKI multiplexed in fuses.
3: Pins are enabled on -ICE derivative only, otherwise they are No Connects.
4: CCP3/P3A multiplexed in fuses.
5: P2B multiplexed in fuses.
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 9
PIC18(L)F2X/4XK22
TABLE 2:
PIC18(L)F4XK22 PIN SUMMARY (CONTINUED)
9
10
1
26
27
18
26
27
18
RE1
RE2
RE3
AN6
AN7
P3B
CCP5
Y
MCLR/
VPP
11
32
12
31
7
7,8
VDD
VDD
VSS
VSS
28 28, 29
6
6
29 30, 31
12(3)
—
—
—
13(3)
—
—
—
33(3)
34
—
13
NC
Note 1: CCP2 multiplexed in fuses.
2: T3CKI multiplexed in fuses.
3: Pins are enabled on -ICE derivative only, otherwise they are No Connects.
4: CCP3/P3A multiplexed in fuses.
5: P2B multiplexed in fuses.
DS41412A-page 10
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
Table of Contents
1.0 Device Overview ....................................................................................................................................................................... 13
2.0 Oscillator Module (With Fail-Safe Clock Monitor)...................................................................................................................... 27
3.0 Power-Managed Modes ............................................................................................................................................................ 47
4.0 Reset......................................................................................................................................................................................... 59
5.0 Memory Organization................................................................................................................................................................ 69
6.0 Flash Program Memory............................................................................................................................................................. 95
7.0 Data EEPROM Memory .......................................................................................................................................................... 105
8.0 8 x 8 Hardware Multiplier......................................................................................................................................................... 111
9.0 Interrupts ................................................................................................................................................................................. 113
10.0 I/O Ports .................................................................................................................................................................................. 133
11.0 Timer0 Module ........................................................................................................................................................................ 159
12.0 Timer1/3/5 Module with Gate Control...................................................................................................................................... 163
13.0 Timer2/4/6 Module .................................................................................................................................................................. 175
14.0 Capture/Compare/PWM Modules ........................................................................................................................................... 179
15.0 Master Synchronous Serial Port (MSSP1 and MSSP2) Module............................................................................................. 209
16.0 Enhanced Universal Synchronous Asynchronous Receiver Transmitter (EUSART).............................................................. 265
17.0 Analog-to-Digital Converter (ADC) Module ............................................................................................................................. 293
18.0 Comparator Module................................................................................................................................................................. 307
19.0 Charge Time Measurement Unit (CTMU) ............................................................................................................................... 319
20.0 SR Latch.................................................................................................................................................................................. 335
21.0 Fixed Voltage Reference (FVR) .............................................................................................................................................. 339
22.0 Digital-to-Analog Converter (DAC).......................................................................................................................................... 341
23.0 High/Low-Voltage Detect (HLVD)............................................................................................................................................ 345
24.0 Special Features of the CPU................................................................................................................................................... 351
25.0 Instruction Set Summary......................................................................................................................................................... 369
26.0 Development Support.............................................................................................................................................................. 419
27.0 Electrical Characteristics......................................................................................................................................................... 423
28.0 DC and AC Characteristics Graphs and Tables...................................................................................................................... 463
29.0 Packaging Information............................................................................................................................................................. 465
Appendix A: Revision History............................................................................................................................................................ 479
Appendix B: Device Differences ....................................................................................................................................................... 479
Index ................................................................................................................................................................................................. 481
The Microchip Web Site.................................................................................................................................................................... 491
Customer Change Notification Service ............................................................................................................................................. 485
Customer Support............................................................................................................................................................................. 485
Reader Response............................................................................................................................................................................. 492
Product Identification System ........................................................................................................................................................... 493
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 11
PIC18(L)F2X/4XK22
TO OUR VALUED CUSTOMERS
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DS41412A-page 12
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
1.1.2
MULTIPLE OSCILLATOR OPTIONS
AND FEATURES
1.0
DEVICE OVERVIEW
This document contains device specific information for
the following devices:
All of the devices in the PIC18(L)F2X/4XK22 family
offer ten different oscillator options, allowing users a
wide range of choices in developing application
hardware. These include:
• PIC18F23K22
• PIC18F24K22
• PIC18F25K22
• PIC18F26K22
• PIC18F43K22
• PIC18F44K22
• PIC18F45K22
• PIC18F46K22
• PIC18LF23K22
• PIC18LF24K22
• PIC18LF25K22
• PIC18LF26K22
• PIC18LF43K22
• PIC18LF44K22
• PIC18LF45K22
• PIC18LF46K22
• Four Crystal modes, using crystals or ceramic
resonators
• Two External Clock modes, offering the option of
using two pins (oscillator input and a divide-by-4
clock output) or one pin (oscillator input, with the
second pin reassigned as general I/O)
• Two External RC Oscillator modes with the same
pin options as the External Clock modes
This family offers the advantages of all PIC18
microcontrollers namely, high computational
• An internal oscillator block which contains a
16 MHz HFINTOSC oscillator and a 31 kHz
LFINTOSC oscillator, which together provide 8
user selectable clock frequencies, from 31 kHz to
16 MHz. This option frees the two oscillator pins
for use as additional general purpose I/O.
–
performance at an economical price – with the addition
of high-endurance, Flash program memory. On top of
these features, the PIC18(L)F2X/4XK22 family
introduces design enhancements that make these
microcontrollers a logical choice for many high-
performance, power sensitive applications.
• A Phase Lock Loop (PLL) frequency multiplier,
available to both external and internal oscillator
modes, which allows clock speeds of up to
64 MHz. Used with the internal oscillator, the PLL
gives users a complete selection of clock speeds,
from 31 kHz to 64 MHz – all without using an
external crystal or clock circuit.
1.1
New Core Features
1.1.1
nanoWatt TECHNOLOGY
All of the devices in the PIC18(L)F2X/4XK22 family
incorporate a range of features that can significantly
reduce power consumption during operation. Key
items include:
Besides its availability as a clock source, the internal
oscillator block provides a stable reference source that
gives the family additional features for robust
operation:
• Alternate Run Modes: By clocking the controller
from the Timer1 source or the internal oscillator
block, power consumption during code execution
can be reduced by as much as 90%.
• Fail-Safe Clock Monitor: This option constantly
monitors the main clock source against a
reference signal provided by the LFINTOSC. If a
clock failure occurs, the controller is switched to
the internal oscillator block, allowing for continued
operation or a safe application shutdown.
• Multiple Idle Modes: The controller can also run
with its CPU core disabled but the peripherals still
active. In these states, power consumption can be
reduced even further, to as little as 4% of normal
operation requirements.
• Two-Speed Start-up: This option allows the
internal oscillator to serve as the clock source
from Power-on Reset, or wake-up from Sleep
mode, until the primary clock source is available.
• On-the-fly Mode Switching: The power-
managed modes are invoked by user code during
operation, allowing the user to incorporate power-
saving ideas into their application’s software
design.
• Low Consumption in Key Modules: The
power requirements for both Timer1 and the
Watchdog Timer are minimized. See
Section 27.0 “Electrical Characteristics”
for values.
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 13
PIC18(L)F2X/4XK22
1.2
Other Special Features
1.3
Details on Individual Family
Members
• Memory Endurance: The Flash cells for both
program memory and data EEPROM are rated to
last for many thousands of erase/write cycles – up to
10K for program memory and 100K for EEPROM.
Data retention without refresh is conservatively
estimated to be greater than 40 years.
Devices in the PIC18(L)F2X/4XK22 family are avail-
able in 28-pin and 40/44-pin packages. The block dia-
gram for the device family is shown in Figure 1-1.
The devices have the following differences:
1. Flash program memory
2. Data Memory SRAM
• Self-programmability: These devices can write
to their own program memory spaces under inter-
nal software control. By using a bootloader routine
located in the protected Boot Block at the top of
program memory, it becomes possible to create
an application that can update itself in the field.
3. Data Memory EEPROM
4. A/D channels
5. I/O ports
6. ECCP modules (Full/Half Bridge)
7. Input Voltage Range/Power Consumption
• Extended Instruction Set: The PIC18(L)F2X/
4XK22 family introduces an optional extension to
the PIC18 instruction set, which adds 8 new
instructions and an Indexed Addressing mode.
This extension, enabled as a device configuration
option, has been specifically designed to optimize
re-entrant application code originally developed in
high-level languages, such as C.
All other features for devices in this family are identical.
These are summarized in Table 1-1.
The pinouts for all devices are listed in the pin summary
tables: Table 1 and Table 2, and I/O description tables:
Table 1-2 and Table 1-3.
• Enhanced CCP module: In PWM mode, this
module provides 1, 2 or 4 modulated outputs for
controlling half-bridge and full-bridge drivers.
Other features include:
-
Auto-Shutdown, for disabling PWM outputs
on interrupt or other select conditions
- Auto-Restart, to reactivate outputs once the
condition has cleared
- Output steering to selectively enable one or
more of 4 outputs to provide the PWM signal.
• Enhanced Addressable EUSART: This serial
communication module is capable of standard
RS-232 operation and provides support for the LIN
bus protocol. Other enhancements include
automatic baud rate detection and a 16-bit Baud
Rate Generator for improved resolution. When the
microcontroller is using the internal oscillator
block, the EUSART provides stable operation for
applications that talk to the outside world without
using an external crystal (or its accompanying
power requirement).
• 10-bit A/D Converter: This module incorporates
programmable acquisition time, allowing for a
channel to be selected and a conversion to be
initiated without waiting for a sampling period and
thus, reduce code overhead.
• Extended Watchdog Timer (WDT): This
enhanced version incorporates a 16-bit
postscaler, allowing an extended time-out range
that is stable across operating voltage and
temperature. See Section 27.0 “Electrical
Characteristics” for time-out periods.
• Charge Time Measurement Unit (CTMU)
• SR Latch Output:
DS41412A-page 14
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
TABLE 1-1:
DEVICE FEATURES
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 15
PIC18(L)F2X/4XK22
FIGURE 1-1:
PIC18(L)F2X/4XK22 FAMILY BLOCK DIAGRAM
Data Bus<8>
Table Pointer<21>
Data Latch
8
8
inc/dec logic
21
Data Memory
PCLATH
PCLATU
PORTA
Address Latch
20
PCU PCH PCL
Program Counter
RA0:RA7
12
Data Address<12>
31-Level Stack
STKPTR
4
BSR
12
FSR0
FSR1
FSR2
4
Address Latch
Access
Bank
Program Memory
(8/16/32/64 Kbytes)
PORTB
12
Data Latch
RB0:RB7
inc/dec
logic
8
Table Latch
Address
Decode
ROM Latch
IR
Instruction Bus <16>
PORTC
RC0:RC7
8
State machine
control signals
Instruction
Decode and
Control
PRODH PRODL
8 x 8 Multiply
PORTD
RD0:RD7
3
8
W
BITOP
8
8
8
Internal
Oscillator
Block
OSC1(2)
OSC2(2)
SOSCI
Power-up
Timer
8
8
PORTE
Oscillator
Start-up Timer
ALU<8>
8
RE0:RE2
LFINTOSC
Oscillator
RE3(1)
Power-on
Reset
16 MHz
Oscillator
Watchdog
Timer
SOSCO
MCLR(1)
Precision
Band Gap
Reference
FVR
Brown-out
Reset
Fail-Safe
Single-Supply
Programming
In-Circuit
Clock Monitor
Debugger
Timer1
Timer3
Timer5
Timer2
Timer4
Timer6
Data
EEPROM
BOR
DAC
Timer0
CTMU
HLVD
ECCP1
ECCP2
ECCP3
FVR
DAC
CCP4
CCP5
MSSP1
MSSP2
EUSART1
EUSART2
(3)
FVR
Comparators
C1/C2
ADC
10-bit
SR Latch
Note 1: RE3 is only available when MCLR functionality is disabled.
2: OSC1/CLKIN and OSC2/CLKOUT are only available in select oscillator modes and when these pins are not being used as digital I/O.
Refer to Section 2.0 “Oscillator Module (With Fail-Safe Clock Monitor)” for additional information.
3: Full-Bridge operation for PIC18(L)F4XK22, Half-Bridge operation for PIC18(L)F2XK22.
DS41412A-page 16
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
TABLE 1-2:
PIC18(L)F2XK22 PINOUT I/O DESCRIPTIONS
Pin Number
Pin
Type
Buffer
Type
Pin Name
Description
PDIP,
QFN
SOIC
2
3
4
27
28
1
RA0/C12IN0-/AN0
RA0
C12IN0-
AN0
I/O
TTL
Digital I/O.
I
I
Analog Comparators C1 and C2 inverting input.
Analog Analog input 0.
RA1/C12IN1-/AN1
RA1
I/O
TTL
Digital I/O.
C12IN1-
I
I
Analog Comparators C1 and C2 inverting input.
Analog Analog input 1.
AN1
RA2/C2IN+/AN2/DACOUT/VREF-
RA2
I/O
TTL
Digital I/O.
C2IN+
I
I
Analog Comparator C2 non-inverting input.
Analog Analog input 2.
AN2
DACOUT
O
I
Analog DAC Reference output.
VREF-
Analog A/D reference voltage (low) input.
5
6
2
3
RA3/C1IN+/AN3/VREF+
RA3
I/O
TTL
Digital I/O.
C1IN+
I
I
I
Analog Comparator C1 non-inverting input.
Analog Analog input 3.
AN3
VREF+
Analog A/D reference voltage (high) input.
RA4/CCP5/C1OUT/SRQ/T0CKI
RA4
I/O
I/O
O
TTL
ST
Digital I/O.
CCP5
Capture 5 input/Compare 5 output/PWM 5 output.
C1OUT
CMOS Comparator C1 output.
SRQ
O
TTL
ST
SR Latch Q output.
T0CKI
I
Timer0 external clock input.
7
4
RA5/C2OUT/SRNQ/SS1/HLVDIN/AN4
RA5
I/O
O
O
I
TTL
Digital I/O.
C2OUT
CMOS Comparator C2 output.
SRNQ
TTL
TTL
SR Latch Q output.
SS1
SPI slave select input (MSSP1).
HLVDIN
I
Analog High/Low-Voltage Detect input.
Analog Analog input 4.
AN4
RA6/CLKO/OSC2
RA6
I
10
7
I/O
O
TTL
Digital I/O.
CLKO
In RC mode, OSC2 pin outputs CLKOUT which has
1/4 the frequency of OSC1 and denotes the instruction
cycle rate.
OSC2
O
Oscillator crystal output. Connects to crystal or
resonator in Crystal Oscillator mode.
Legend:
TTL = TTL compatible input CMOS = CMOS compatible input or output; ST = Schmitt Trigger input with CMOS levels;
I = Input; O = Output; P = Power.
Note 1: Default pin assignment for P2B, T3CKI, CCP3 and CCP2 when Configuration bits PB2MX, T3CMX, CCP3MX and
CCP2MX are set.
2: Alternate pin assignment for P2B, T3CKI, CCP3 and CCP2 when Configuration bits PB2MX, T3CMX, CCP3MX and
CCP2MX are clear.
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 17
PIC18(L)F2X/4XK22
TABLE 1-2:
PIC18(L)F2XK22 PINOUT I/O DESCRIPTIONS (CONTINUED)
Pin Number
Pin
Type
Buffer
Type
Pin Name
Description
PDIP,
QFN
SOIC
9
6
RA7/CLKI/OSC1
RA7
I/O
I
TTL
Digital I/O.
CLKI
CMOS External clock source input. Always associated with
pin function OSC1.
OSC1
I
ST
Oscillator crystal input or external clock source input
ST buffer when configured in RC mode; CMOS
otherwise.
21
18
RB0/INT0/CCP4/FLT0/SRI/SS2/AN12
RB0
INT0
CCP4
FLT0
SRI
I/O
TTL
ST
Digital I/O.
I
External interrupt 0.
I/O
ST
Capture 4 input/Compare 4 output/PWM 4 output.
PWM Fault input for ECCP Auto-Shutdown.
SR Latch input.
I
I
I
I
ST
ST
SS2
TTL
SPI slave select input (MSSP2).
AN12
Analog Analog input 12.
22
19
RB1/INT1/P1C/SCK2/SCL2/C12IN3-/AN10
RB1
INT1
P1C
I/O
TTL
ST
Digital I/O.
I
External interrupt 1.
O
CMOS Enhanced CCP1 PWM output.
SCK2
I/O
ST
Synchronous serial clock input/output for SPI mode
(MSSP2).
2
SCL2
I/O
ST
Synchronous serial clock input/output for I C™ mode
(MSSP2).
C12IN3-
I
I
Analog Comparators C1 and C2 inverting input.
Analog Analog input 10.
AN10
23
20
RB2/INT2/CTED1/P1B/SDI2/SDA2/AN8
RB2
INT2
I/O
TTL
ST
Digital I/O.
I
I
External interrupt 2.
CTMU Edge 1 input.
CTED1
P1B
ST
O
I
CMOS Enhanced CCP1 PWM output.
SDI2
SDA2
AN8
ST
ST
SPI data in (MSSP2).
2
I/O
I
I C™ data I/O (MSSP2).
Analog Analog input 8.
24
21
RB3/CTED2/P2A/CCP2/SDO2/C12IN2-/AN9
RB3
CTED2
P2A
I/O
I
TTL
ST
Digital I/O.
CTMU Edge 2 input.
O
I/O
O
I
CMOS Enhanced CCP2 PWM output.
(2)
CCP2
ST
—
Capture 2 input/Compare 2 output/PWM 2 output.
SPI data out (MSSP2).
SDO2
C12IN2-
AN9
Analog Comparators C1 and C2 inverting input.
Analog Analog input 9.
I
Legend:
TTL = TTL compatible input CMOS = CMOS compatible input or output; ST = Schmitt Trigger input with CMOS levels;
I = Input; O = Output; P = Power.
Note 1: Default pin assignment for P2B, T3CKI, CCP3 and CCP2 when Configuration bits PB2MX, T3CMX, CCP3MX and
CCP2MX are set.
2: Alternate pin assignment for P2B, T3CKI, CCP3 and CCP2 when Configuration bits PB2MX, T3CMX, CCP3MX and
CCP2MX are clear.
DS41412A-page 18
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
TABLE 1-2:
PIC18(L)F2XK22 PINOUT I/O DESCRIPTIONS (CONTINUED)
Pin Number
Pin
Type
Buffer
Type
Pin Name
Description
PDIP,
QFN
SOIC
25
22
RB4/IOC0/P1D/T5G/AN11
RB4
IOC0
P1D
I/O
TTL
TTL
Digital I/O.
I
O
I
Interrupt-on-change pin.
CMOS Enhanced CCP1 PWM output.
ST Timer5 external clock gate input.
Analog Analog input 11.
T5G
AN11
I
26
23
RB5/IOC1/P2B/P3A/CCP3/T3CKI/T1G/AN13
RB5
I/O
TTL
TTL
Digital I/O.
IOC1
I
O
O
I/O
I
Interrupt-on-change pin.
(1)
P2B
P3A
CMOS Enhanced CCP2 PWM output.
CMOS Enhanced CCP3 PWM output.
(1)
(1)
(2)
CCP3
ST
ST
ST
Capture 3 input/Compare 3 output/PWM 3 output.
Timer3 clock input.
T3CKI
T1G
I
Timer1 external clock gate input.
AN13
I
Analog Analog input 13.
27
28
11
24
25
8
RB6/IOC2/TX2/CK2/PGC
RB6
IOC2
TX2
I/O
I
TTL
TTL
—
Digital I/O.
Interrupt-on-change pin.
O
EUSART 2 asynchronous transmit.
EUSART 2 synchronous clock (see related RXx/DTx).
CK2
PGC
I/O
I/O
ST
ST
In-Circuit Debugger and ICSP™ programming clock
pin.
RB7/IOC3/RX2/DT2/PGD
RB7
IOC3
RX2
DT2
I/O
I
TTL
TTL
ST
Digital I/O.
Interrupt-on-change pin.
I
EUSART 2 asynchronous receive.
EUSART 2 synchronous data (see related TXx/CKx).
I/O
I/O
ST
PGD
ST
In-Circuit Debugger and ICSP™ programming data
pin.
RC0/P2B/T3CKI/T3G/T1CKI/SOSCO
RC0
I/O
O
I
TTL
Digital I/O.
(2)
P2B
CMOS Enhanced CCP1 PWM output.
(1)
T3CKI
ST
ST
ST
—
Timer3 clock input.
T3G
I
Timer3 external clock gate input.
Timer1 clock input.
T1CKI
I
SOSCO
O
Secondary oscillator output.
12
9
RC1/P2A/CCP2/SOSCI
RC1
P2A
I/O
O
TTL
Digital I/O.
CMOS Enhanced CCP2 PWM output.
ST Capture 2 input/Compare 2 output/PWM 2 output.
Analog Secondary oscillator input.
(1)
CCP2
I/O
I
SOSCI
Legend:
TTL = TTL compatible input CMOS = CMOS compatible input or output; ST = Schmitt Trigger input with CMOS levels;
I = Input; O = Output; P = Power.
Note 1: Default pin assignment for P2B, T3CKI, CCP3 and CCP2 when Configuration bits PB2MX, T3CMX, CCP3MX and
CCP2MX are set.
2: Alternate pin assignment for P2B, T3CKI, CCP3 and CCP2 when Configuration bits PB2MX, T3CMX, CCP3MX and
CCP2MX are clear.
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 19
PIC18(L)F2X/4XK22
TABLE 1-2:
PIC18(L)F2XK22 PINOUT I/O DESCRIPTIONS (CONTINUED)
Pin Number
Pin
Type
Buffer
Type
Pin Name
Description
PDIP,
QFN
SOIC
13
10
RC2/CTPLS/P1A/CCP1/T5CKI/AN14
RC2
I/O
O
O
I/O
I
TTL
—
Digital I/O.
CTMU pulse generator output.
CTPLS
P1A
CMOS Enhanced CCP1 PWM output.
CCP1
ST
ST
Capture 1 input/Compare 1 output/PWM 1 output.
Timer5 clock input.
T5CKI
AN14
RC3/SCK1/SCL1/AN15
RC3
I
Analog Analog input 14.
14
11
I/O
I/O
TTL
ST
Digital I/O.
SCK1
Synchronous serial clock input/output for SPI mode
(MSSP2).
2
SCL1
I/O
I
ST
Synchronous serial clock input/output for I C™ mode
(MSSP2).
AN15
Analog Analog input 15.
15
12
RC4/SDI1/SDA1/AN16
RC4
I/O
TTL
ST
Digital I/O.
SDI1
I
I/O
I
SPI data in (MSSP1).
2
SDA1
ST
I C™ data I/O (MSSP1).
AN16
Analog Analog input 16.
16
17
13
14
RC5/SDO1/AN17
RC5
I/O
O
I
TTL
—
Digital I/O.
SDO1
SPI data out (MSSP1).
AN17
RC6/P3A/CCP3/TX1/CK1/AN18
RC6
Analog Analog input 17.
I/O
O
TTL
Digital I/O.
(2)
P3A
CMOS Enhanced CCP3 PWM output.
(2)
CCP3
I/O
O
ST
—
Capture 3 input/Compare 3 output/PWM 3 output.
EUSART 1 asynchronous transmit.
TX1
CK1
I/O
I
ST
EUSART 1 synchronous clock (see related RXx/DTx).
AN18
Analog Analog input 18.
18
15
26
RC7/P3B/RX1/DT1/AN19
RC7
I/O
O
I
TTL
Digital I/O.
P3B
CMOS Enhanced CCP3 PWM output.
RX1
ST
ST
EUSART 1 asynchronous receive.
DT1
I/O
I
EUSART 1 synchronous data (see related TXx/CKx).
AN19
Analog Analog input 19.
1
RE3/VPP/MCLR
RE3
I
P
I
ST
ST
Digital input.
VPP
Programming voltage input.
Active-Low Master Clear (device Reset) input.
MCLR
Legend:
TTL = TTL compatible input CMOS = CMOS compatible input or output; ST = Schmitt Trigger input with CMOS levels;
I = Input; O = Output; P = Power.
Note 1: Default pin assignment for P2B, T3CKI, CCP3 and CCP2 when Configuration bits PB2MX, T3CMX, CCP3MX and
CCP2MX are set.
2: Alternate pin assignment for P2B, T3CKI, CCP3 and CCP2 when Configuration bits PB2MX, T3CMX, CCP3MX and
CCP2MX are clear.
DS41412A-page 20
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
TABLE 1-2:
PIC18(L)F2XK22 PINOUT I/O DESCRIPTIONS (CONTINUED)
Pin Number
Pin
Type
Buffer
Type
Pin Name
Description
PDIP,
QFN
SOIC
20
17
VDD
VSS
P
P
—
—
Positive supply for logic and I/O pins.
Ground reference for logic and I/O pins.
8, 19
5, 16
Legend:
TTL = TTL compatible input CMOS = CMOS compatible input or output; ST = Schmitt Trigger input with CMOS levels;
I = Input; O = Output; P = Power.
Note 1: Default pin assignment for P2B, T3CKI, CCP3 and CCP2 when Configuration bits PB2MX, T3CMX, CCP3MX and
CCP2MX are set.
2: Alternate pin assignment for P2B, T3CKI, CCP3 and CCP2 when Configuration bits PB2MX, T3CMX, CCP3MX and
CCP2MX are clear.
TABLE 1-3:
PIC18(L)F4XK22 PINOUT I/O DESCRIPTIONS
Pin Number
Pin
Type
Buffer
Type
Pin Name
Description
PDIP TQFP
QFN
2
3
4
19
20
21
19
RA0/C12IN0-/AN0
RA0
C12IN0-
AN0
I/O
TTL
Digital I/O.
I
I
Analog Comparators C1 and C2 inverting input.
Analog Analog input 0.
20
21
RA1/C12IN1-/AN1
RA1
I/O
TTL
Digital I/O.
C12IN1-
I
I
Analog Comparators C1 and C2 inverting input.
Analog Analog input 1.
AN1
RA2/C2IN+/AN2/DACOUT/VREF-
RA2
I/O
TTL
Digital I/O.
C2IN+
I
I
Analog Comparator C2 non-inverting input.
Analog Analog input 2.
AN2
DACOUT
O
I
Analog DAC Reference output.
VREF-
Analog A/D reference voltage (low) input.
5
6
22
23
22
23
RA3/C1IN+/AN3/VREF+
RA3
I/O
TTL
Digital I/O.
C1IN+
I
I
I
Analog Comparator C1 non-inverting input.
Analog Analog input 3.
AN3
VREF+
Analog A/D reference voltage (high) input.
RA4/C1OUT/SRQ/T0CKI
RA4
C1OUT
SRQ
I/O
O
O
I
TTL
Digital I/O.
CMOS Comparator C1 output.
TTL
ST
SR Latch Q output.
T0CKI
Timer0 external clock input.
Legend:
Note
TTL = TTL compatible input CMOS = CMOS compatible input or output; ST = Schmitt Trigger input with CMOS levels;
I = Input; O = Output; P = Power.
1: Default pin assignment for P2B, T3CKI, CCP3/P3A and CCP2/P2A when Configuration bits PB2MX, T3CMX, CCP3MX
and CCP2MX are set.
2: Alternate pin assignment for P2B, T3CKI, CCP3/P3A and CCP2/P2A when Configuration bits PB2MX, T3CMX,
CCP3MX and CCP2MX are clear.
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 21
PIC18(L)F2X/4XK22
TABLE 1-3:
PIC18(L)F4XK22 PINOUT I/O DESCRIPTIONS (CONTINUED)
Pin Number
Pin
Type
Buffer
Type
Pin Name
Description
PDIP TQFP
QFN
7
24
24
RA5/C2OUT/SRNQ/SS1/HLVDIN/AN4
RA5
C2OUT
SRNQ
SS1
I/O
TTL
Digital I/O.
O
O
I
CMOS Comparator C2 output.
TTL
TTL
SR Latch Q output.
SPI slave select input (MSSP1).
HLVDIN
AN4
I
Analog High/Low-Voltage Detect input.
Analog Analog input 4.
I
14
13
33
31
30
8
33
32
9
RA6/CLKO/OSC2
RA6
I/O
O
TTL
—
Digital I/O.
CLKO
In RC mode, OSC2 pin outputs CLKOUT which
has 1/4 the frequency of OSC1 and denotes the
instruction cycle rate.
OSC2
O
—
Oscillator crystal output. Connects to crystal or
resonator in Crystal Oscillator mode.
RA7/CLKI/OSC1
RA7
I/O
I
TTL
Digital I/O.
CLKI
CMOS External clock source input. Always associated
with pin function OSC1.
OSC1
I
ST
Oscillator crystal input or external clock source
input ST buffer when configured in RC mode;
CMOS otherwise.
RB0/INT0/FLT0/SRI/AN12
RB0
I/O
TTL
ST
ST
ST
Digital I/O.
INT0
I
I
I
I
External interrupt 0.
FLT0
PWM Fault input for ECCP Auto-Shutdown.
SR Latch input.
SRI
AN12
Analog Analog input 12.
34
35
36
9
10
11
12
RB1/INT1/C12IN3-/AN10
RB1
I/O
TTL
ST
Digital I/O.
INT1
I
I
I
External interrupt 1.
C12IN3-
Analog Comparators C1 and C2 inverting input.
Analog Analog input 10.
AN10
10
11
RB2/INT2/CTED1/AN8
RB2
I/O
TTL
ST
Digital I/O.
INT2
I
I
I
External interrupt 2.
CTMU Edge 1 input.
CTED1
ST
AN8
Analog Analog input 8.
RB3/CTED2/P2A/CCP2/C12IN2-/AN9
RB3
I/O
TTL
ST
Digital I/O.
CTED2
I
O
I/O
I
CTMU Edge 2 input.
(2)
P2A
CMOS Enhanced CCP2 PWM output.
ST Capture 2 input/Compare 2 output/PWM 2 output.
(2)
CCP2
C12IN2-
AN9
Analog Comparators C1 and C2 inverting input.
Analog Analog input 9.
I
Legend:
Note
TTL = TTL compatible input CMOS = CMOS compatible input or output; ST = Schmitt Trigger input with CMOS levels;
I = Input; O = Output; P = Power.
1: Default pin assignment for P2B, T3CKI, CCP3/P3A and CCP2/P2A when Configuration bits PB2MX, T3CMX, CCP3MX
and CCP2MX are set.
2: Alternate pin assignment for P2B, T3CKI, CCP3/P3A and CCP2/P2A when Configuration bits PB2MX, T3CMX,
CCP3MX and CCP2MX are clear.
DS41412A-page 22
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
TABLE 1-3:
PIC18(L)F4XK22 PINOUT I/O DESCRIPTIONS (CONTINUED)
Pin Number
Pin
Type
Buffer
Type
Pin Name
Description
PDIP TQFP
QFN
37
14
14
RB4/IOC0/T5G/AN11
RB4
IOC0
T5G
I/O
TTL
TTL
ST
Digital I/O.
I
I
I
Interrupt-on-change pin.
Timer5 external clock gate input.
AN11
Analog Analog input 11.
38
15
15
RB5/IOC1/P3A/CCP3/T3CKI/T1G/AN13
RB5
I/O
TTL
TTL
Digital I/O.
IOC1
I
O
I/O
I
Interrupt-on-change pin.
(1)
P3A
CMOS Enhanced CCP3 PWM output.
(1)
(2)
CCP3
ST
ST
ST
Capture 3 input/Compare 3 output/PWM 3 output.
Timer3 clock input.
T3CKI
T1G
I
Timer1 external clock gate input.
AN13
I
Analog Analog input 13.
39
40
15
16
17
32
16
17
34
RB6/IOC2/PGC
RB6
IOC2
PGC
I/O
I
TTL
TTL
ST
Digital I/O.
Interrupt-on-change pin.
I/O
In-Circuit Debugger and ICSP™ programming
clock pin.
RB7/IOC3/PGD
RB7
IOC3
PGD
I/O
I
TTL
TTL
ST
Digital I/O.
Interrupt-on-change pin.
I/O
In-Circuit Debugger and ICSP™ programming
data pin.
RC0/P2B/T3CKI/T3G/T1CKI/SOSCO
RC0
I/O
O
I
TTL
Digital I/O.
(2)
P2B
CMOS Enhanced CCP1 PWM output.
(1)
T3CKI
ST
ST
ST
—
Timer3 clock input.
T3G
T1CKI
I
Timer3 external clock gate input.
Timer1 clock input.
I
SOSCO
O
Secondary oscillator output.
16
17
35
36
35
36
RC1/P2A/CCP2/SOSCI
RC1
I/O
O
TTL
Digital I/O.
(1)
P2A
CMOS Enhanced CCP2 PWM output.
ST Capture 2 input/Compare 2 output/PWM 2 output.
Analog Secondary oscillator input.
(1)
CCP2
I/O
I
SOSCI
RC2/CTPLS/P1A/CCP1/T5CKI/AN14
RC2
CTPLS
P1A
I/O
O
O
I/O
I
TTL
—
Digital I/O.
CTMU pulse generator output.
CMOS Enhanced CCP1 PWM output.
CCP1
T5CKI
AN14
ST
ST
Capture 1 input/Compare 1 output/PWM 1 output.
Timer5 clock input.
I
Analog Analog input 14.
Legend:
Note
TTL = TTL compatible input CMOS = CMOS compatible input or output; ST = Schmitt Trigger input with CMOS levels;
I = Input; O = Output; P = Power.
1: Default pin assignment for P2B, T3CKI, CCP3/P3A and CCP2/P2A when Configuration bits PB2MX, T3CMX, CCP3MX
and CCP2MX are set.
2: Alternate pin assignment for P2B, T3CKI, CCP3/P3A and CCP2/P2A when Configuration bits PB2MX, T3CMX,
CCP3MX and CCP2MX are clear.
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 23
PIC18(L)F2X/4XK22
TABLE 1-3:
PIC18(L)F4XK22 PINOUT I/O DESCRIPTIONS (CONTINUED)
Pin Number
Pin
Type
Buffer
Type
Pin Name
Description
PDIP TQFP
18 37
QFN
37
RC3/SCK1/SCL1/AN15
RC3
I/O
I/O
TTL
ST
Digital I/O.
SCK1
Synchronous serial clock input/output for SPI
mode (MSSP2).
2
SCL1
I/O
I
ST
Synchronous serial clock input/output for I C™
mode (MSSP2).
AN15
Analog Analog input 15.
23
42
42
RC4/SDI1/SDA1/AN16
RC4
I/O
TTL
ST
Digital I/O.
SDI1
I
I/O
I
SPI data in (MSSP1).
2
SDA1
ST
I C™ data I/O (MSSP1).
AN16
Analog Analog input 16.
24
25
43
44
43
44
RC5/SDO1/AN17
RC5
I/O
O
I
TTL
—
Digital I/O.
SDO1
SPI data out (MSSP1).
AN17
Analog Analog input 17.
RC6/TX1/CK1/AN18
RC6
TX1
CK1
I/O
O
TTL
—
Digital I/O.
EUSART 1 asynchronous transmit.
I/O
ST
EUSART 1 synchronous clock (see related RXx/
DTx).
AN18
I
Analog Analog input 18.
26
19
1
1
RC7/RX1/DT1/AN19
RC7
RX1
DT1
I/O
I
TTL
ST
Digital I/O.
EUSART 1 asynchronous receive.
I/O
ST
EUSART 1 synchronous data (see related TXx/
CKx).
AN19
RD0/SCK2/SCL2/AN20
RD0
I
Analog Analog input 19.
38
38
I/O
I/O
TTL
ST
Digital I/O.
SCK2
Synchronous serial clock input/output for SPI
mode (MSSP2).
2
SCL2
I/O
I
ST
Synchronous serial clock input/output for I C™
mode (MSSP2).
AN20
Analog Analog input 20.
20
39
39
RD1/CCP4/SDI2/SDA2/AN21
RD1
CCP4
SDI2
I/O
I/O
I
TTL
ST
ST
ST
Digital I/O.
Capture 4 input/Compare 4 output/PWM 4 output.
SPI data in (MSSP2).
2
SDA2
AN21
I/O
I
I C™ data I/O (MSSP2).
Analog Analog input 21.
Legend:
Note
TTL = TTL compatible input CMOS = CMOS compatible input or output; ST = Schmitt Trigger input with CMOS levels;
I = Input; O = Output; P = Power.
1: Default pin assignment for P2B, T3CKI, CCP3/P3A and CCP2/P2A when Configuration bits PB2MX, T3CMX, CCP3MX
and CCP2MX are set.
2: Alternate pin assignment for P2B, T3CKI, CCP3/P3A and CCP2/P2A when Configuration bits PB2MX, T3CMX,
CCP3MX and CCP2MX are clear.
DS41412A-page 24
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
TABLE 1-3:
PIC18(L)F4XK22 PINOUT I/O DESCRIPTIONS (CONTINUED)
Pin Number
Pin
Type
Buffer
Type
Pin Name
Description
PDIP TQFP
QFN
21
40
40
RD2/P2B/AN22
RD2
I/O
O
I
TTL
Digital I/O
(1)
P2B
CMOS Enhanced CCP2 PWM output.
Analog Analog input 22.
AN22
22
41
41
RD3/P2C/SS2/AN23
RD3
I/O
TTL
CMOS Enhanced CCP2 PWM output.
TTL SPI slave select input (MSSP2).
Analog Analog input 23.
Digital I/O.
P2C
O
I
SS2
AN23
I
27
2
2
RD4/P2D/SDO2/AN24
RD4
I/O
O
O
I
TTL
CMOS Enhanced CCP2 PWM output.
SPI data out (MSSP2).
Analog Analog input 24.
Digital I/O.
P2D
SDO2
—
AN24
28
29
3
4
3
4
RD5/P1B/AN25
RD5
I/O
O
I
TTL
Digital I/O.
P1B
CMOS Enhanced CCP1 PWM output.
Analog Analog input 25.
AN25
RD6/P1C/TX2/CK2/AN26
RD6
P1C
TX2
CK2
I/O
O
TTL
Digital I/O.
CMOS Enhanced CCP1 PWM output.
O
—
EUSART 2 asynchronous transmit.
I/O
ST
EUSART 2 synchronous clock (see related RXx/
DTx).
AN26
I
Analog Analog input 26.
30
5
5
RD7/P1D/RX2/DT2/AN27
RD7
P1D
RX2
DT2
I/O
O
TTL
Digital I/O.
CMOS Enhanced CCP1 PWM output.
I
ST
ST
EUSART 2 asynchronous receive.
I/O
EUSART 2 synchronous data (see related TXx/
CKx).
AN27
RE0/P3A/CCP3/AN5
RE0
I
Analog Analog input 27.
8
9
25
26
25
26
I/O
O
TTL
CMOS Enhanced CCP3 PWM output.
ST Capture 3 input/Compare 3 output/PWM 3 output.
Analog Analog input 5.
Digital I/O.
(2)
P3A
(2)
CCP3
I/O
I
AN5
RE1/P3B/AN6
RE1
I/O
O
I
TTL
Digital I/O.
P3B
CMOS Enhanced CCP3 PWM output.
Analog Analog input 6.
AN6
Legend:
Note
TTL = TTL compatible input CMOS = CMOS compatible input or output; ST = Schmitt Trigger input with CMOS levels;
I = Input; O = Output; P = Power.
1: Default pin assignment for P2B, T3CKI, CCP3/P3A and CCP2/P2A when Configuration bits PB2MX, T3CMX, CCP3MX
and CCP2MX are set.
2: Alternate pin assignment for P2B, T3CKI, CCP3/P3A and CCP2/P2A when Configuration bits PB2MX, T3CMX,
CCP3MX and CCP2MX are clear.
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 25
PIC18(L)F2X/4XK22
TABLE 1-3:
PIC18(L)F4XK22 PINOUT I/O DESCRIPTIONS (CONTINUED)
Pin Number
Pin
Type
Buffer
Type
Pin Name
Description
PDIP TQFP
QFN
10
1
27
18
27
RE2/CCP5/AN7
RE2
CCP5
AN7
I/O
I/O
I
TTL
ST
Digital I/O.
Capture 5 input/Compare 5 output/PWM 5 output
Analog Analog input 7.
18
RE3/VPP/MCLR
RE3
VPP
I
ST
Digital input.
P
I
Programming voltage input.
MCLR
VDD
ST
—
Active-low Master Clear (device Reset) input.
Positive supply for logic and I/O pins.
11,32 7,28
7,8,
P
28,29
12,31 6,29 6,30,31
VSS
NC
P
—
Ground reference for logic and I/O pins.
12,13,
33,34
13
Legend:
TTL = TTL compatible input CMOS = CMOS compatible input or output; ST = Schmitt Trigger input with CMOS levels;
I = Input; O = Output; P = Power.
Note
1: Default pin assignment for P2B, T3CKI, CCP3/P3A and CCP2/P2A when Configuration bits PB2MX, T3CMX, CCP3MX
and CCP2MX are set.
2: Alternate pin assignment for P2B, T3CKI, CCP3/P3A and CCP2/P2A when Configuration bits PB2MX, T3CMX,
CCP3MX and CCP2MX are clear.
DS41412A-page 26
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
The HFINTOSC, MFINTOSC and LFINTOSC are
factory calibrated high, medium and low-frequency
oscillators, respectively, which are used as the internal
clock sources.
2.0
2.1
OSCILLATOR MODULE (WITH
FAIL-SAFE CLOCK MONITOR)
Overview
The oscillator module has a wide variety of clock
sources and selection features that allow it to be used
in a wide range of applications while maximizing perfor-
mance and minimizing power consumption. Figure 2-1
illustrates a block diagram of the oscillator module.
Clock sources can be configured from external
oscillators, quartz crystal resonators, ceramic resonators
and Resistor-Capacitor (RC) circuits. In addition, the
system clock source can be configured from one of three
internal oscillators, with a choice of speeds selectable via
software. Additional clock features include:
• Selectable system clock source between external
or internal sources via software.
• Two-Speed Start-up mode, which minimizes
latency between external oscillator start-up and
code execution.
• Fail-Safe Clock Monitor (FSCM) designed to
detect a failure of the external clock source (LP,
XT, HS, EC or RC modes) and switch
automatically to the internal oscillator.
• Oscillator Start-up Timer (OST) ensures stability
of crystal oscillator sources.
The primary clock module can be configured to provide
one of six clock sources as the primary clock.
1. RC
2. LP
External Resistor/Capacitor
Low-Power Crystal
3. XT
Crystal/Resonator
4. INTOSC
5. HS
Internal Oscillator
High-Speed Crystal/Resonator
External Clock
6. EC
The HS and EC oscillator circuits can be optimized for
power consumption and oscillator speed using settings
in FOSC<3:0>. Additional FOSC<3:0> selections
enable RA6 to be used as I/O or CLKO (FOSC/4) for
RC, EC and INTOSC Oscillator modes.
Primary Clock modes are selectable by the
FOSC<3:0> bits of the CONFIG1H Configuration
register. The primary clock operation is further defined
by these Configuration and register bits:
1. PRICLKEN (CONFIG1H<5>)
2. PRISD (OSCCON2<2>)
3. PLLCFG (CONFIG1H<4>)
4. PLLEN (OSCTUNE<6>)
5. HFOFST (CONFIG3H<3>)
6. IRCF<2:0> (OSCCON<6:4>)
7. MFIOSEL (OSCCON2<4>)
8. INTSRC (OSCTUNE<7>)
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 27
PIC18(L)F2X/4XK22
FIGURE 2-1:
SIMPLIFIED OSCILLATOR SYSTEM BLOCK DIAGRAM
Secondary Oscillator(1)
Low-Power Mode
Event Switch
(SCS<1:0>)
SOSCO
SOSCI
Secondary
Oscillator
(SOSC)
SOSCOUT
2
Primary Clock Module
Secondary
Oscillator
01
00
1x
PRICLKEN
PRISD
PLL Select(3) (4)
FOSC<3:0>(5)
EN
OSC2
OSC1
Primary
Oscillator(2)
(OSC)
Primary Oscillator
Primary
Clock
0
0
1
4xPLL
INTOSC
1
INTOSC
Internal Oscillator
IRCF<2:0>
MFIOSEL
INTSRC
3
3
HF-16 MHZ
HFINTOSC
(16 MHz)
HF-8 MHZ
HF-4 MHZ
HF-2 MHZ
HF-1 MHZ
HF-500 kHZ
HF-250 kHZ
INTOSC
Divide
Circuit
INTOSC
HF-31.25 kHZ
MFINTOSC
(500 kHz)
MF-500 kHZ
MF-250 kHZ
MF-31.25 kHZ
LFINTOSC
(31.25 kHz)
LF-31.25 kHz
Note 1: Details in Figure 2-4.
2: Details in Figure 2-2.
3: Details in Figure 2-3.
4: Details in Table 2-1.
5: The Primary Oscillator MUX uses the INTOSC branch when FOSC<3:0> = 100x.
DS41412A-page 28
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
2.2.3
LOW FREQUENCY SELECTION
2.2
Oscillator Control
When a nominal output frequency of 31.25 kHz is
selected (IRCF<2:0> = 000), users may choose
which internal oscillator acts as the source. This is
done with the INTSRC bit of the OSCTUNE register
and MFIOSEL bit of the OSCCON2 register. See
Figure 2-2 and Register 2-1 for specific 31.25 kHz
selection. This option allows users to select a
31.25 kHz clock (MFINTOSC or HFINTOSC) that can
be tuned using the TUN<5:0> bits in OSCTUNE
register, while maintaining power savings with a very
low clock speed. LFINTOSC always remains the
clock source for features such as the Watchdog Timer
and the Fail-Safe Clock Monitor, regardless of the
setting of INTSRC and MFIOSEL bits
The OSCCON, OSCCON2 and OSCTUNE registers
(Register 2-1 to Register 2-3) control several aspects
of the device clock’s operation, both in full-power
operation and in power-managed modes.
• Main System Clock Selection (SCS)
• Primary Oscillator Circuit Shutdown (PRISD)
• Secondary Oscillator Enable (SOSCGO)
• Primary Clock Frequency 4x multiplier (PLLEN)
• Internal Frequency selection bits (IRCF, INTSRC)
• Clock Status bits (OSTS, HFIOFS, MFIOFS,
LFIOFS. SOSCRUN, PLLRDY)
• Power management selection (IDLEN)
This option allows users to select the tunable and more
2.2.1
MAIN SYSTEM CLOCK SELECTION
precise HFINTOSC as
a
clock source, while
The System Clock Select bits, SCS<1:0>, select the
main clock source. The available clock sources are
maintaining power savings with a very low clock speed.
2.2.4
POWER MANAGEMENT
• Primary clock defined by the FOSC<3:0> bits of
CONFIG1H. The primary clock can be the primary
oscillator, an external clock, or the internal
oscillator block.
The IDLEN bit of the OSCCON register determines
whether the device goes into Sleep mode or one of the
Idle modes when the SLEEPinstruction is executed.
• Secondary clock (secondary oscillator)
• Internal oscillator block (HFINTOSC, MFINTOSC
and LFINTOSC).
The clock source changes immediately after one or
more of the bits is written to, following a brief clock
transition interval. The SCS bits are cleared to select
the primary clock on all forms of Reset.
2.2.2
INTERNAL FREQUENCY
SELECTION
The Internal Oscillator Frequency Select bits
(IRCF<2:0>) select the frequency output of the internal
oscillator block. The choices are the LFINTOSC source
(31.25 kHz), the MFINTOSC source (31.25 kHz,
250 kHz or 500 kHz) and the HFINTOSC source
(16 MHz) or one of the frequencies derived from the
HFINTOSC postscaler (31.25 kHz to 8 MHz). If the
internal oscillator block is supplying the main clock,
changing the states of these bits will have an immedi-
ate change on the internal oscillator’s output. On
device Resets, the output frequency of the internal
oscillator is set to the default frequency of 1 MHz.
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 29
PIC18(L)F2X/4XK22
FIGURE 2-2:
INTERNAL OSCILLATOR
MUX BLOCK DIAGRAM
FIGURE 2-3:
PLL SELECT BLOCK
DIAGRAM
FOSC<3:0> = 100x
PLLCFG
IRCF<2:0>
MFIOSEL
INTSRC
PLL
3
PLLEN
Select
HF-16 MHZ
111
110
101
100
011
HF-8 MHZ
HF-4 MHZ
HF-2 MHZ
HF-1 MHZ
MF-500 KHZ
HF-500 KHZ
1
500 kHZ
010
INTOSC
0
1
MF-250 KHZ
HF-250 KHZ
250 kHZ
001
000
0
HF-31.25 KHZ
MF-31.25 KHZ
LF-31.25 KHZ
11
10
0X
31.25 kHZ
TABLE 2-1:
PLL SELECT TRUTH TABLE
Primary Clock MUX Source
FOSC<3:0>
PLLCFG
PLLEN
PLL Select
FOSC (any source)
0000-1111
0
1
0
x
x
0
x
1
0
1
0
1
1
0
1
OSC1/OSC2 (external source)
0000-0111
1010-1111
INTOSC (internal source)
INTOSC (internal source)
1000-1001
DS41412A-page 30
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
FIGURE 2-4:
SECONDARY OSCILLATOR AND EXTERNAL CLOCK INPUTS
SOSCGO
T1SOSCEN
T3SOSCEN
T5SOSCEN
SOSCEN
To Clock Switch Module
EN
SOSCI
SOSCOUT
Secondary
Oscillator
1
0
SOSCO
T1CKI
T3G
T1CLK_EXT_SRC
T1SOSCEN
SOSCEN
T1CKI
T3CKI
T3CKI
T1CKI
SOSCEN
T3G
SOSCEN
1
0
T3CLK_EXT_SRC
T3SOSCEN
0
1
T3CKI
T3CKI
T1G
T3CMX
1
0
T5CLK_EXT_SRC
T5SOSCEN
T1G
T5CKI
T5CKI
T5G
T5CKI
T5G
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 31
PIC18(L)F2X/4XK22
REGISTER 2-1:
OSCCON: OSCILLATOR CONTROL REGISTER
R/W-0
IDLEN
bit 7
R/W-0
R/W-1
R/W-1
R-q
OSTS(1)
R-0
R/W-0
R/W-0
IRCF<2:0>
HFIOFS
SCS<1:0>
bit 0
Legend:
R = Readable bit
-n = Value at POR
W = Writable bit
‘1’ = Bit is set
U = Unimplemented bit, read as ‘0’
‘0’ = Bit is cleared
q = depends on condition
x = Bit is unknown
bit 7
IDLEN: Idle Enable bit
1= Device enters Idle mode on SLEEPinstruction
0= Device enters Sleep mode on SLEEPinstruction
bit 6-4
IRCF<2:0>: Internal RC Oscillator Frequency Select bits(2)
111= HFINTOSC – (16 MHz)
110= HFINTOSC/2 – (8 MHz)
101= HFINTOSC/4 – (4 MHz)
100= HFINTOSC/8 – (2 MHz)
011= HFINTOSC/16 – (1 MHz)(3)
If INTSRC = 0and MFIOSEL = 0:
010= HFINTOSC/32 – (500 kHz)
001= HFINTOSC/64 – (250 kHz)
000= LFINTOSC – (31.25 kHz)
If INTSRC = 1and MFIOSEL = 0:
010= HFINTOSC/32 – (500 kHz)
001= HFINTOSC/64 – (250 kHz)
000= HFINTOSC/512 – (31.25 kHz)
If INTSRC = 0 and MFIOSEL = 1:
010= MFINTOSC – (500 kHz)
001= MFINTOSC/2 – (250 kHz)
000= LFINTOSC – (31.25 kHz)
If INTSRC = 1and MFIOSEL = 1:
010= MFINTOSC – (500 kHz)
001= MFINTOSC/2 – (250 kHz)
000= MFINTOSC/16 – (31.25 kHz)
bit 3
OSTS: Oscillator Start-up Time-out Status bit
1= Device is running from the clock defined by FOSC<3:0> of the CONFIG1H register
0= Device is running from the internal oscillator (HFINTOSC, MFINTOSC or LFINTOSC)
bit 2
HFIOFS: HFINTOSC Frequency Stable bit
1= HFINTOSC frequency is stable
0= HFINTOSC frequency is not stable
bit 1-0
SCS<1:0>: System Clock Select bit
1x= Internal oscillator block
01= Secondary (SOSC) oscillator
00= Primary clock (determined by FOSC<3:0> in CONFIG1H).
Note 1: Reset state depends on state of the IESO Configuration bit.
2: INTOSC source may be determined by the INTSRC bit in OSCTUNE and the MFIOSEL bit in OSCCON2.
3: Default output frequency of HFINTOSC on Reset.
DS41412A-page 32
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
REGISTER 2-2:
R-0/0
OSCCON2: OSCILLATOR CONTROL REGISTER 2
R-0/q
U-0
—
R/W-0/0
R/W-0/u
R/W-1/1
PRISD
R-x/u
R-0/0
PLLRDY
bit 7
SOSCRUN
MFIOSEL SOSCGO(1)
MFIOFS
LFIOFS
bit 0
Legend:
R = Readable bit
‘1’ = Bit is set
W = Writable bit
U = Unimplemented bit, read as ‘0’
x = Bit is unknown
q = depends on condition
‘0’ = Bit is cleared
-n/n = Value at POR and BOR/Value at all other Resets
bit 7
bit 6
PLLRDY: PLL Run Status bit
1= System clock comes from 4xPLL
0= System clock comes from an oscillator, other than 4xPLL
SOSCRUN: SOSC Run Status bit
1= System clock comes from secondary SOSC
0= System clock comes from an oscillator, other than SOSC
bit 5
bit 4
Unimplemented: Read as ‘0’.
MFIOSEL: MFINTOSC Select bit
1= MFINTOSC is used in place of HFINTOSC frequencies of 500 kHz, 250 kHz and 31.25 kHz
0= MFINTOSC is not used
bit 3
SOSCGO(1): Oscillator Start Control bit
1= Secondary oscillator is running even if no other sources are requesting it
0= Secondary oscillator is shut off if no other sources are requesting it. When the SOSC is selected
to run from a digital clock input, rather than an external crystal, this bit has no effect.
bit 2
bit 1
bit 0
PRISD: Primary Oscillator Drive Circuit Shutdown bit
1= Oscillator drive circuit on
0= Oscillator drive circuit off (zero power)
MFIOFS: MFINTOSC Frequency Stable bit
1= MFINTOSC is stable
0= MFINTOSC is not stable
LFIOFS: LFINTOSC Frequency Stable bit
1= LFINTOSC is stable
0= LFINTOSC is not stable
Note 1: The SOSCGO bit is only reset on a VDD Reset.
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 33
PIC18(L)F2X/4XK22
2.3
Clock Source Modes
2.4
External Clock Modes
Clock Source modes can be classified as external or
internal.
2.4.1 OSCILLATOR START-UP TIMER (OST)
When the oscillator module is configured for LP, XT or
HS modes, the Oscillator Start-up Timer (OST) counts
1024 oscillations from OSC1. This occurs following a
Power-on Reset (POR) and when the Power-up Timer
(PWRT) has expired (if configured), or a wake-up from
Sleep. During this time, the program counter does not
increment and program execution is suspended. The
OST ensures that the oscillator circuit, using a quartz
crystal resonator or ceramic resonator, has started and
is providing a stable system clock to the oscillator
module. When switching between clock sources, a
delay is required to allow the new clock to stabilize.
These oscillator delays are shown in Table 2-2.
• External Clock modes rely on external circuitry for
the clock source. Examples are: Clock modules
(EC mode), quartz crystal resonators or ceramic
resonators (LP, XT and HS modes) and Resistor-
Capacitor (RC mode) circuits.
• Internal clock sources are contained internally
within the Oscillator block. The Oscillator block
has three internal oscillators: the 16 MHz High-
Frequency Internal Oscillator (HFINTOSC),
500 kHz Medium-Frequency Internal Oscillator
(MFINTOSC) and the 31.25 kHz Low-Frequency
Internal Oscillator (LFINTOSC).
The system clock can be selected between external or
internal clock sources via the System Clock Select
(SCS<1:0>) bits of the OSCCON register. See
Section 2.9 “Clock Switching” for additional
information.
In order to minimize latency between external oscillator
start-up and code execution, the Two-Speed Clock
Start-up mode can be selected (see Section 2.10
“Two-Speed Clock Start-up Mode”).
TABLE 2-2:
OSCILLATOR DELAY EXAMPLES
Switch From
Switch To
Frequency
Oscillator Delay
LFINTOSC
MFINTOSC
HFINTOSC
31.25 kHz
31.25 kHz to 500 kHz
31.25 kHz to 16 MHz
Sleep/POR
Oscillator Warm-Up Delay (TWARM)
Sleep/POR
EC, RC
EC, RC
DC – 64 MHz
DC – 64 MHz
2 instruction cycles
LFINTOSC (31.25 kHz)
Sleep/POR
1 cycle of each
LP, XT, HS
4xPLL
32 kHz to 40 MHz
32 MHz to 64 MHz
31.25 kHz to 16 MHz
1024 Clock Cycles (OST)
1024 Clock Cycles (OST) + 2 ms
1 s (approx.)
Sleep/POR
LFINTOSC (31.25 kHz)
LFINTOSC
HFINTOSC
2.4.2
EC MODE
FIGURE 2-5:
EXTERNAL CLOCK (EC)
MODE OPERATION
The External Clock (EC) mode allows an externally
generated logic level as the system clock source. When
operating in this mode, an external clock source is
connected to the OSC1 input and the OSC2 is available
for general purpose I/O. Figure 2-5 shows the pin
connections for EC mode.
OSC1/CLKIN
Clock from
Ext. System
PIC® MCU
(1)
I/O
OSC2/CLKOUT
The External Clock (EC) mode offers a Medium Power
(MP) and a High Power (HP) option selectable by the
FOSC<3:0> bits. The MP selections are best suited for
external clock frequencies between 4 and 16 MHz. The
HP selection is best suited for clock frequencies above
16 MHz.
Note 1: Alternate pin functions are listed in
Section 1.0 “Device Overview”.
The Oscillator Start-up Timer (OST) is disabled when
EC mode is selected. Therefore, there is no delay in
operation after a Power-on Reset (POR) or wake-up
from Sleep. Because the PIC® MCU design is fully
static, stopping the external clock input will have the
effect of halting the device while leaving all data intact.
Upon restarting the external clock, the device will
resume operation as if no time had elapsed.
DS41412A-page 34
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
2.4.3
LP, XT, HS MODES
Note 1: Quartz crystal characteristics vary according
to type, package and manufacturer. The
user should consult the manufacturer data
sheets for specifications and recommended
application.
The LP, XT and HS modes support the use of quartz
crystal resonators or ceramic resonators connected to
OSC1 and OSC2 (Figure 2-6). The mode selects a low,
medium or high gain setting of the internal inverter-
amplifier to support various resonator types and speed.
2: Always verify oscillator performance over
the VDD and temperature range that is
expected for the application.
LP Oscillator mode selects the lowest gain setting of the
internal inverter-amplifier. LP mode current consumption
is the least of the three modes. This mode is best suited
to drive resonators with a low drive level specification, for
example, tuning fork type crystals.
3: For oscillator design assistance, refer to the
following Microchip Application Notes:
• AN826, “Crystal Oscillator Basics and
Crystal Selection for rfPIC® and PIC®
Devices” (DS00826)
• AN849, “Basic PIC® Oscillator Design”
(DS00849)
• AN943, “Practical PIC® Oscillator
XT Oscillator mode selects the intermediate gain
setting of the internal inverter-amplifier. XT mode
current consumption is the medium of the three modes.
This mode is best suited to drive resonators with a
medium drive level specification.
HS Oscillator mode offers a Medium Power (MP) and a
High Power (HP) option selectable by the FOSC<3:0>
bits. The MP selections are best suited for oscillator
frequencies between 4 and 16 MHz. The HP selection
has the highest gain setting of the internal inverter-
amplifier and is best suited for frequencies above
16 MHz. HS mode is best suited for resonators that
require a high drive setting.
Analysis and Design” (DS00943)
• AN949, “Making Your Oscillator Work”
(DS00949)
FIGURE 2-7:
CERAMIC RESONATOR
OPERATION
(XT OR HS MODE)
FIGURE 2-6:
QUARTZ CRYSTAL
OPERATION (LP, XT OR
HS MODE)
PIC® MCU
OSC1/CLKIN
C1
To Internal
Logic
PIC® MCU
(3)
(2)
RP
RF
Sleep
OSC1/CLKIN
C1
To Internal
Logic
OSC2/CLKOUT
(1)
C2
RS
Ceramic
Resonator
Quartz
Crystal
(2)
RF
Sleep
Note 1: A series resistor (RS) may be required for
ceramic resonators with low drive level.
OSC2/CLKOUT
(1)
C2
RS
2: The value of RF varies with the Oscillator mode
selected (typically between 2 M to 10 M.
Note 1: A series resistor (RS) may be required for
3: An additional parallel feedback resistor (RP)
may be required for proper ceramic resonator
operation.
quartz crystals with low drive level.
2: The value of RF varies with the Oscillator mode
selected (typically between 2 M to 10 M.
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 35
PIC18(L)F2X/4XK22
2.4.4
EXTERNAL RC MODES
2.5
Internal Clock Modes
The external Resistor-Capacitor (RC) modes support
the use of an external RC circuit. This allows the
designer maximum flexibility in frequency choice while
keeping costs to a minimum when clock accuracy is not
required. There are two modes: RC and RCIO.
The oscillator module has three independent, internal
oscillators that can be configured or selected as the
system clock source.
1. The HFINTOSC (High-Frequency Internal
Oscillator) is factory calibrated and operates at
16 MHz. The frequency of the HFINTOSC can
be user-adjusted via software using the
OSCTUNE register (Register 2-3).
2.4.4.1
RC Mode
In RC mode, the RC circuit connects to OSC1. OSC2/
CLKOUT outputs the RC oscillator frequency divided
by 4. This signal may be used to provide a clock for
external circuitry, synchronization, calibration, test or
other application requirements. Figure 2-8 shows the
external RC mode connections.
2. The MFINTOSC (Medium-Frequency Internal
Oscillator) is factory calibrated and operates
at 500 kHz. The frequency of the MFINTOSC
can be user-adjusted via software using the
OSCTUNE register (Register 2-3).
3. The LFINTOSC (Low-Frequency Internal
Oscillator) is factory calibrated and operates at
31.25 kHz. The LFINTOSC cannot be user-
adjusted, but is designed to be stable over
temperature and voltage.
FIGURE 2-8:
EXTERNAL RC MODES
VDD
PIC® MCU
REXT
The system clock speed can be selected via software
using the Internal Oscillator Frequency select bits
IRCF<2:0> of the OSCCON register.
OSC1/CLKIN
Internal
Clock
CEXT
VSS
The system clock can be selected between external or
internal clock sources via the System Clock Selection
(SCS<1:0>) bits of the OSCCON register. See
Section 2.9 “Clock Switching” for more information.
(1)
FOSC/4 or
I/O
OSC2/CLKOUT
(2)
2.5.1 INTOSC WITH I/O OR CLOCKOUT
Recommended values: 10 k REXT 100 k
Two of the clock modes selectable with the FOSC<3:0>
bits of the CONFIG1H Configuration register configure
the internal oscillator block as the primary oscillator.
Mode selection determines whether OSC2/CLKOUT/
RA7 will be configured as general purpose I/O (RA7) or
FOSC/4 (CLKOUT). In both modes, OSC1/CLKIN/RA7
is configured as general purpose I/O. See
Section 24.0 “Special Features of the CPU” for more
information.
CEXT > 20 pF
Note 1: Alternate pin functions are listed in
Section 1.0 “Device Overview”.
2: Output depends upon RC or RCIO clock mode.
2.4.4.2
RCIO Mode
In RCIO mode, the RC circuit is connected to OSC1.
OSC2 becomes a general purpose I/O pin.
The CLKOUT signal may be used to provide a clock for
external circuitry, synchronization, calibration, test or
other application requirements.
The RC oscillator frequency is a function of the supply
voltage, the resistor (REXT) and capacitor (CEXT) values
and the operating temperature. Other factors affecting
the oscillator frequency are:
• input threshold voltage variation
• component tolerances
• packaging variations in capacitance
The user also needs to take into account variation due
to tolerance of external RC components used.
DS41412A-page 36
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
as the Power-up Timer (PWRT), Watchdog Timer
(WDT), Fail-Safe Clock Monitor (FSCM) and
peripherals, are not affected by the change in frequency.
2.5.1.1
OSCTUNE Register
The HFINTOSC/MFINTOSC oscillator circuits are
factory calibrated but can be adjusted in software by
writing to the TUN<5:0> bits of the OSCTUNE register
(Register 2-3).
The OSCTUNE register also implements the INTSRC
and PLLEN bits, which control certain features of the
internal oscillator block.
The default value of the TUN<5:0> is ‘000000’. The
The INTSRC bit allows users to select which internal
oscillator provides the clock source when the
31.25 kHz frequency option is selected. This is covered
in greater detail in Section 2.2.3 “Low Frequency
Selection”.
value is a 6-bit two’s complement number.
When the OSCTUNE register is modified, the
HFINTOSC/MFINTOSC frequency will begin shifting to
the new frequency. Code execution continues during this
shift. There is no indication that the shift has occurred.
The PLLEN bit controls the operation of the frequency
multiplier, PLL, in internal oscillator modes. For more
details about the function of the PLLEN bit, see
Section 2.6.2 “PLL in HFINTOSC Modes”
The TUN<5:0> bits in OSCTUNE do not affect the
LFINTOSC frequency. Operation of features that
depend on the LFINTOSC clock source frequency, such
REGISTER 2-3:
OSCTUNE: OSCILLATOR TUNING REGISTER
R/W-0
INTSRC
bit 7
R/W-0
PLLEN(1)
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
TUN<5:0>
bit 0
Legend:
R = Readable bit
W = Writable bit
‘1’ = Bit is set
U = Unimplemented bit, read as ‘0’
‘0’ = Bit is cleared x = Bit is unknown
-n = Value at POR
bit 7
bit 6
INTSRC: Internal Oscillator Low-Frequency Source Select bit
1= 31.25 kHz device clock derived from the MFINTOSC or HFINTOSC source
0= 31.25 kHz device clock derived directly from LFINTOSC internal oscillator
PLLEN: Frequency Multiplier 4xPLL for HFINTOSC Enable bit(1)
1= PLL enabled for HFINTOSC (8 MHz and 16 MHz only)
0= PLL disabled
bit 5-0
TUN<5:0>: Frequency Tuning bits – use to adjust MFINTOSC and HFINTOSC frequencies
011111= Maximum frequency
011110=
• • •
000001=
000000= Oscillator module (HFINTOSC and MFINTOSC) are running at the factory calibrated
frequency.
111111=
• • •
100000= Minimum frequency
Note 1: The PLLEN bit is active only when the HFINTOSC is the primary clock source (FOSC<2:0> = 100X) and
the selected frequency is 8 MHz or 16 MHz (IRCF<2:0> = 11x). Otherwise, the PLLEN bit is unavailable
and always reads ‘0’.
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 37
PIC18(L)F2X/4XK22
2.5.2
LFINTOSC
2.5.4.1
Compensating with the EUSART
The Low-Frequency Internal Oscillator (LFINTOSC) is
a 31.25 kHz internal clock source. The LFINTOSC is
not tunable, but is designed to be stable across temper-
ature and voltage. See Section 27.0 “Electrical Char-
An adjustment may be required when the EUSART
begins to generate framing errors or receives data with
errors while in Asynchronous mode. Framing errors
indicate that the device clock frequency is too high; to
adjust for this, decrement the value in OSCTUNE to
reduce the clock frequency. On the other hand, errors
in data may suggest that the clock speed is too low; to
compensate, increment OSCTUNE to increase the
clock frequency.
acteristics”
for
the
LFINTOSC
accuracy
specifications.
The output of the LFINTOSC can be a clock source to
the primary clock or the INTOSC clock (see Figure 2-1).
The LFINTOSC is also the clock source for the Power-
up Timer (PWRT), Watchdog Timer (WDT) and Fail-Safe
Clock Monitor (FSCM).
2.5.4.2
Compensating with the Timers
This technique compares device clock speed to some
reference clock. Two timers may be used; one timer is
clocked by the peripheral clock, while the other is
clocked by a fixed reference source, such as the
Timer1 oscillator.
2.5.3
FREQUENCY SELECT BITS (IRCF)
The HFINTOSC (16 MHz) and MFINTOSC (500 MHz)
outputs connect to a divide circuit that provides
frequencies of 16 MHz to 31.25 kHz. These divide
circuit frequencies, along with the 31.25 kHz
LFINTOSC output, are multiplexed to provide a single
INTOSC clock output (see Figure 2-1). The IRCF<2:0>
bits of the OSCCON register, the MFIOSEL bit of the
OSCCON2 register and the INTSRC bit of the
OSCTUNE register, select the output frequency of the
internal oscillators. One of eight frequencies can be
selected via software:
Both timers are cleared, but the timer clocked by the
reference generates interrupts. When an interrupt
occurs, the internally clocked timer is read and both
timers are cleared. If the internally clocked timer value
is greater than expected, then the internal oscillator
block is running too fast. To adjust for this, decrement
the OSCTUNE register.
2.5.4.3
Compensating with the CCP Module
in Capture Mode
• 16 MHz
• 8 MHz
A CCP module can use free running Timer1, Timer3 or
Timer5 clocked by the internal oscillator block and an
external event with a known period (i.e., AC power
frequency). The time of the first event is captured in the
CCPRxH:CCPRxL registers and is recorded for use later.
When the second event causes a capture, the time of the
first event is subtracted from the time of the second
event. Since the period of the external event is known,
the time difference between events can be calculated.
• 4 MHz
• 2 MHz
• 1 MHz (Default after Reset)
• 500 kHz (MFINTOSC or HFINTOSC)
• 250 kHz (MFINTOSC or HFINTOSC)
• 31 kHz (LFINTOSC, MFINTOSC or HFINTOSC)
2.5.4
INTOSC FREQUENCY DRIFT
If the measured time is much greater than the calcu-
lated time, the internal oscillator block is running too
fast; to compensate, decrement the OSCTUNE register.
If the measured time is much less than the calculated
time, the internal oscillator block is running too slow; to
compensate, increment the OSCTUNE register.
The factory calibrates the internal oscillator block outputs
(HFINTOSC/MFINTOSC) for 16 MHz/500 kHz. However,
this frequency may drift as VDD or temperature changes.
It is possible to adjust the HFINTOSC/MFINTOSC fre-
quency by modifying the value of the TUN<5:0> bits in the
OSCTUNE register. This has no effect on the LFINTOSC
clock source frequency.
Tuning the HFINTOSC/MFINTOSC source requires
knowing when to make the adjustment, in which direc-
tion it should be made and, in some cases, how large a
change is needed. Three possible compensation tech-
niques are discussed in the following sections. However,
other techniques may be used.
DS41412A-page 38
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
2.6.2
PLL IN HFINTOSC MODES
2.6
PLL Frequency Multiplier
The 4x frequency multiplier can be used with the
internal oscillator block to produce faster device clock
speeds than are normally possible with the internal
oscillator. When enabled, the PLL multiplies the
HFINTOSC by 4 to produce clock rates up to 64 MHz.
A Phase Locked Loop (PLL) circuit is provided as an
option for users who wish to use a lower frequency
oscillator circuit or to clock the device up to its highest
rated frequency from the crystal oscillator. This may be
useful for customers who are concerned with EMI due
to high-frequency crystals or users who require higher
clock speeds from an internal oscillator.
Unlike external clock modes, the PLL can only be
controlled through software. The PLLEN control bit of
the OSCTUNE register is used to enable or disable the
PLL operation when the HFINTOSC is used.
2.6.1
PLL IN EXTERNAL OSCILLATOR
MODES
The PLL can be enabled for any of the external
oscillator modes using the OSC1/OSC2 pins by either
setting the PLLCFG bit (CONFIG1H<4>), or setting the
PLLEN bit (OSCTUNE<6>). The PLL is designed for
input frequencies of 4 MHz up to 16 MHz. The PLL then
multiplies the oscillator output frequency by 4 to
produce an internal clock frequency up to 64 MHz.
Oscillator frequencies below 4 MHz should not be used
with the PLL.
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 39
PIC18(L)F2X/4XK22
2.7
Effects of Power-Managed Modes
on the Various Clock Sources
2.8
Power-up Delays
Power-up delays are controlled by two timers, so that
no external Reset circuitry is required for most
applications. The delays ensure that the device is kept
in Reset until the device power supply is stable under
normal circumstances and the primary clock is
operating and stable. For additional information on
power-up delays, see Section 4.5 “Device Reset
Timers”.
For more information about the modes discussed in this
section see Section 3.0 “Power-Managed Modes”. A
quick reference list is also available in Table 3-1.
When PRI_IDLE mode is selected, the designated
primary oscillator continues to run without interruption.
For all other power-managed modes, the oscillator
using the OSC1 pin is disabled. The OSC1 pin (and
OSC2 pin, if used by the oscillator) will stop oscillating.
The first timer is the Power-up Timer (PWRT), which
provides a fixed delay on power-up. It is enabled by
clearing (= 0) the PWRTEN Configuration bit.
In secondary clock modes (SEC_RUN and
SEC_IDLE), the secondary oscillator (SOSC) is
operating and providing the device clock. The
secondary oscillator may also run in all power-
managed modes if required to clock Timer1, Timer3 or
Timer5.
The second timer is the Oscillator Start-up Timer
(OST), intended to keep the chip in Reset until the
crystal oscillator is stable (LP, XT and HS modes). The
OST does this by counting 1024 oscillator cycles
before allowing the oscillator to clock the device.
In internal oscillator modes (INTOSC_RUN and
INTOSC_IDLE), the internal oscillator block provides
the device clock source. The 31.25 kHz LFINTOSC
output can be used directly to provide the clock and
may be enabled to support various special features,
regardless of the power-managed mode (see
When the PLL is enabled with external oscillator
modes, the device is kept in Reset for an additional
2 ms, following the OST delay, so the PLL can lock to
the incoming clock frequency.
There is a delay of interval TCSD, following POR, while
the controller becomes ready to execute instructions.
This delay runs concurrently with any other delays.
This may be the only delay that occurs when any of the
EC, RC or INTIOSC modes are used as the primary
clock source.
Section 24.2
“Watchdog
Timer
(WDT)”,
Section 2.10 “Two-Speed Clock Start-up Mode” and
Section 2.11 “Fail-Safe Clock Monitor” for more
information on WDT, Fail-Safe Clock Monitor and Two-
Speed Start-up). The HFINTOSC and MFINTOSC
outputs may be used directly to clock the device or may
be divided down by the postscaler. The HFINTOSC
and MFINTOSC outputs are disabled when the clock is
provided directly from the LFINTOSC output.
When the HFINTOSC is selected as the primary clock,
the main system clock can be delayed until the
HFINTOSC is stable. This is user selectable by the
HFOFST bit of the CONFIG3H Configuration register.
When the HFOFST bit is cleared, the main system
clock is delayed until the HFINTOSC is stable. When
the HFOFST bit is set, the main system clock starts
immediately.
When the Sleep mode is selected, all clock sources are
stopped. Since all the transistor switching currents
have been stopped, Sleep mode achieves the lowest
current consumption of the device (only leakage
currents).
In either case, the HFIOFS bit of the OSCCON register
can be read to determine whether the HFINTOSC is
operating and stable.
Enabling any on-chip feature that will operate during
Sleep will increase the current consumed during Sleep.
The LFINTOSC is required to support WDT operation.
Other features may be operating that do not require a
device clock source (i.e., SSP slave, PSP, INTn pins
and others). Peripherals that may add significant
current consumption are listed in Section 27.8 “DC
Characteristics: Input/Output Characteristics,
PIC18(L)F2X/4XK22”.
DS41412A-page 40
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
TABLE 2-3:
OSC Mode
RC, INTOSC with CLKOUT Floating, external resistor should pull high
OSC1 AND OSC2 PIN STATES IN SLEEP MODE
OSC1 Pin
OSC2 Pin
At logic low (clock/4 output)
Configured as PORTA, bit 6
Configured as PORTA, bit 6
Configured as PORTA, bit 6
At logic low (clock/4 output)
RC with IO
Floating, external resistor should pull high
Configured as PORTA, bit 7
INTOSC with IO
EC with IO
Floating, pulled by external clock
Floating, pulled by external clock
EC with CLKOUT
LP, XT, HS
Feedback inverter disabled at quiescent
voltage level
Feedback inverter disabled at quiescent
voltage level
Note:
See Table 4-2 in Section 4.0 “Reset” for time-outs due to Sleep and MCLR Reset.
After a Reset, the SCS<1:0> bits of the OSCCON
register are always cleared.
2.9
Clock Switching
The system clock source can be switched between
external and internal clock sources via software using
the System Clock Select (SCS<1:0>) bits of the
OSCCON register.
Note: Any automatic clock switch, which may
occur from Two-Speed Start-up or Fail-Safe
Clock Monitor, does not update the
SCS<1:0> bits of the OSCCON register.
The user can monitor the SOSCRUN,
MFIOFS and LFIOFS bits of the
OSCCON2 register, and the HFIOFS and
OSTS bits of the OSCCON register to
determine the current system clock source.
PIC18(L)F2X/4XK22 devices contain circuitry to pre-
vent clock “glitches” when switching between clock
sources. A short pause in the device clock occurs dur-
ing the clock switch. The length of this pause is the sum
of two cycles of the old clock source and three to four
cycles of the new clock source. This formula assumes
that the new clock source is stable.
2.9.2
OSCILLATOR START-UP TIME-OUT
STATUS (OSTS) BIT
Clock transitions are discussed in greater detail in
Section 3.1.2 “Entering Power-Managed Modes”.
The Oscillator Start-up Time-out Status (OSTS) bit of
the OSCCON register indicates whether the system
clock is running from the external clock source, as
defined by the FOSC<3:0> bits in the CONFIG1H
Configuration register, or from the internal clock
source. In particular, when the primary oscillator is the
source of the primary clock, OSTS indicates that the
Oscillator Start-up Timer (OST) has timed out for LP,
XT or HS modes.
2.9.1
SYSTEM CLOCK SELECT
(SCS<1:0>) BITS
The System Clock Select (SCS<1:0>) bits of the
OSCCON register select the system clock source that
is used for the CPU and peripherals.
• When SCS<1:0> = 00, the system clock source is
determined by configuration of the FOSC<3:0>
bits in the CONFIG1H Configuration register.
• When SCS<1:0> = 10, the system clock source is
chosen by the internal oscillator frequency
selected by the INTSRC bit of the OSCTUNE
register, the MFIOSEL bit of the OSCCON2
register and the IRCF<2:0> bits of the OSCCON
register.
• When SCS<1:0> = 01, the system clock source is
the 32.768 kHz secondary oscillator shared with
Timer1, Timer3 and Timer5.
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 41
PIC18(L)F2X/4XK22
2.9.3
CLOCK SWITCH TIMING
2.10 Two-Speed Clock Start-up Mode
When switching between one oscillator and another,
the new oscillator may not be operating which saves
power (see Figure 2-9). If this is the case, there is a
delay after the SCS<1:0> bits of the OSCCON register
are modified before the frequency change takes place.
The OSTS and IOFS bits of the OSCCON register will
reflect the current active status of the external and
HFINTOSC oscillators. The timing of a frequency
selection is as follows:
Two-Speed Start-up mode provides additional power
savings by minimizing the latency between external
oscillator start-up and code execution. In applications
that make heavy use of the Sleep mode, Two-Speed
Start-up will remove the external oscillator start-up
time from the time spent awake and can reduce the
overall power consumption of the device.
This mode allows the application to wake-up from
Sleep, perform a few instructions using the HFINTOSC
as the clock source and go back to Sleep without
waiting for the primary oscillator to become stable.
1. SCS<1:0> bits of the OSCCON register are mod-
ified.
2. The old clock continues to operate until the new
clock is ready.
Note:
Executing a SLEEP instruction will abort
the oscillator start-up time and will cause
the OSTS bit of the OSCCON register to
remain clear.
3. Clock switch circuitry waits for two consecutive
rising edges of the old clock after the new clock
ready signal goes true.
When the oscillator module is configured for LP, XT or
HS modes, the Oscillator Start-up Timer (OST) is
enabled (see Section 2.4.1 “Oscillator Start-up Timer
(OST)”). The OST will suspend program execution until
1024 oscillations are counted. Two-Speed Start-up
mode minimizes the delay in code execution by
operating from the internal oscillator as the OST is
counting. When the OST count reaches 1024 and the
OSTS bit of the OSCCON register is set, program
execution switches to the external oscillator.
4. The system clock is held low starting at the next
falling edge of the old clock.
5. Clock switch circuitry waits for an additional two
rising edges of the new clock.
6. On the next falling edge of the new clock the low
hold on the system clock is released and new
clock is switched in as the system clock.
7. Clock switch is complete.
See Figure 2-1 for more details.
If the HFINTOSC is the source of both the old and new
frequency, there is no start-up delay before the new
frequency is active. This is because the old and new
frequencies are derived from the HFINTOSC via the
postscaler and multiplexer.
2.10.1
TWO-SPEED START-UP MODE
CONFIGURATION
Two-Speed Start-up mode is enabled when all of the
following settings are configured as noted:
• Two-Speed Start-up mode is enabled when the
IESO of the CONFIG1H Configuration register is
set.
Start-up delay specifications are located in
Section 27.0 “Electrical Characteristics”, under AC
Specifications (Oscillator Module).
• SCS<1:0> (of the OSCCON register) = 00.
• FOSC<2:0> bits of the CONFIG1H Configuration
register are configured for LP, XT or HS mode.
Two-Speed Start-up mode becomes active after:
• Power-on Reset (POR) and, if enabled, after
Power-up Timer (PWRT) has expired, or
• Wake-up from Sleep.
DS41412A-page 42
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
2.10.2
TWO-SPEED START-UP
SEQUENCE
2.10.3
CHECKING TWO-SPEED CLOCK
STATUS
1. Wake-up from Power-on Reset or Sleep.
Checking the state of the OSTS bit of the OSCCON
register will confirm if the microcontroller is running
from the external clock source, as defined by the
FOSC<2:0> bits in CONFIG1H Configuration register,
or the internal oscillator. OSTS = 0when the external
oscillator is not ready, which indicates that the system
is running from the internal oscillator.
2. Instructions begin executing by the internal
oscillator at the frequency set in the IRCF<2:0>
bits of the OSCCON register.
3. OST enabled to count 1024 external clock
cycles.
4. OST timed out. External clock is ready.
5. OSTS is set.
6. Clock switch finishes according to Figure 2-9
FIGURE 2-9:
High Speed
CLOCK SWITCH TIMING
Low Speed
Old Clock
(1)
Start-up Time
Clock Sync
Running
New Clock
New Clk Ready
IRCF <2:0>
Select Old
Select New
System Clock
Low Speed
High Speed
Old Clock
(1)
Start-up Time
Clock Sync
Running
New Clock
New Clk Ready
IRCF <2:0>
Select Old
Select New
System Clock
Note 1: Start-up time includes TOST (1024 TOSC) for external clocks, plus TPLL (approx. 2 ms) for HSPLL mode.
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 43
PIC18(L)F2X/4XK22
2.11.3
FAIL-SAFE CONDITION CLEARING
2.11 Fail-Safe Clock Monitor
The Fail-Safe condition is cleared by either one of the
following:
The Fail-Safe Clock Monitor (FSCM) allows the device
to continue operating should the external oscillator fail.
The FSCM can detect oscillator failure any time after
the Oscillator Start-up Timer (OST) has expired. The
FSCM is enabled by setting the FCMEN bit in the
CONFIG1H Configuration register. The FSCM is
applicable to all external oscillator modes (LP, XT, HS,
EC, RC and RCIO).
• Any Reset
• By toggling the SCS1 bit of the OSCCON register
Both of these conditions restart the OST. While the
OST is running, the device continues to operate from
the INTOSC selected in OSCCON. When the OST
times out, the Fail-Safe condition is cleared and the
device automatically switches over to the external clock
source. The Fail-Safe condition need not be cleared
before the OSCFIF flag is cleared.
FIGURE 2-10:
FSCM BLOCK DIAGRAM
Clock Monitor
Latch
External
Clock
2.11.4
RESET OR WAKE-UP FROM SLEEP
S
Q
The FSCM is designed to detect an oscillator failure
after the Oscillator Start-up Timer (OST) has expired.
The OST is used after waking up from Sleep and after
any type of Reset. The OST is not used with the EC or
RC Clock modes so that the FSCM will be active as
soon as the Reset or wake-up has completed. .
LFINTOSC
Oscillator
÷ 64
R
Q
31 kHz
(~32 s)
488 Hz
(~2 ms)
Note:
Due to the wide range of oscillator start-up
times, the Fail-Safe circuit is not active
during oscillator start-up (i.e., after exiting
Reset or Sleep). After an appropriate
amount of time, the user should check the
OSTS bit of the OSCCON register to verify
the oscillator start-up and that the system
Sample Clock
Clock
Failure
Detected
2.11.1
FAIL-SAFE DETECTION
clock
completed.
switchover
has
successfully
The FSCM module detects a failed oscillator by
comparing the external oscillator to the FSCM sample
clock. The sample clock is generated by dividing the
LFINTOSC by 64 (see Figure 2-10). Inside the fail
detector block is a latch. The external clock sets the
latch on each falling edge of the external clock. The
sample clock clears the latch on each rising edge of the
sample clock. A failure is detected when an entire half-
cycle of the sample clock elapses before the primary
clock goes low.
Note:
When the device is configured for Fail-
Safe clock monitoring in either HS, XT, or
LS oscillator modes then the IESO config-
uration bit should also be set so that the
clock will automatically switch from the
internal clock to the external oscillator
when the OST times out.
2.11.2
FAIL-SAFE OPERATION
When the external clock fails, the FSCM switches the
device clock to an internal clock source and sets the bit
flag OSCFIF of the PIR2 register. The OSCFIF flag will
generate an interrupt if the OSCFIE bit of the PIE2
register is also set. The device firmware can then take
steps to mitigate the problems that may arise from a
failed clock. The system clock will continue to be
sourced from the internal clock source until the device
firmware successfully restarts the external oscillator
and switches back to external operation. An automatic
transition back to the failed clock source will not occur.
The internal clock source chosen by the FSCM is
determined by the IRCF<2:0> bits of the OSCCON
register. This allows the internal oscillator to be
configured before a failure occurs.
DS41412A-page 44
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
FIGURE 2-11:
FSCM TIMING DIAGRAM
Sample Clock
Oscillator
Failure
System
Clock
Output
Clock Monitor Output
(Q)
Failure
Detected
OSCFIF
Test
Test
Test
Note:
The system clock is normally at a much higher frequency than the sample clock. The relative frequencies in
this example have been chosen for clarity.
TABLE 2-4:
Name
REGISTERS ASSOCIATED WITH CLOCK SOURCES
Register
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
on Page
INTCON
IPR2
GIE/GIEH PEIE/GIEL
TMR0IE
C2IP
INT0IE
EEIP
RBIE
BCL1IP
OSTS
TMR0IF INT0IF
RBIF
115
128
32
OSCFIP
IDLEN
C1IP
HLVDIP TMR3IP CCP2IP
HFIOFS SCS<1:0>
OSCCON
IRCF<2:0>
—
OSCCON2 PLLRDY SOSCRUN
MFIOSEL SOSCGO PRISD MFIOFS LFIOFS
TUN<5:0>
33
OSCTUNE INTSRC
PLLEN
C1IE
37
PIE2
PIR2
OSCFIE
OSCFIF
C2IE
C2IF
EEIE
EEIF
BCL1IE
BCL1IF
HLVDIE TMR3IE CCP2IE
HLVDIF TMR3IF CCP2IF
124
119
C1IF
Legend: — = unimplemented locations, read as ‘0’. Shaded bits are not used by Clock Sources.
TABLE 2-5:
Name
CONFIGURATION REGISTERS ASSOCIATED WITH CLOCK SOURCES
Register
on Page
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
CONFIG1H
CONFIG2L
CONFIG3H
IESO
—
FCMEN PRICLKEN PLLCFG
FOSC<3:0>
BOREN<1:0>
353
354
356
—
—
—
BORV<1:0>
PWRTEN
MCLRE
P2BMX
T3CMX HFOFST CCP3MX PBADEN CCP2MX
Legend: — = unimplemented locations, read as ‘0’. Shaded bits are not used for Clock Sources.
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 45
PIC18(L)F2X/4XK22
NOTES:
DS41412A-page 46
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
3.1.1
CLOCK SOURCES
3.0
POWER-MANAGED MODES
The SCS<1:0> bits allow the selection of one of three
clock sources for power-managed modes. They are:
PIC18(L)F2X/4XK22 devices offer a total of seven
operating modes for more efficient power manage-
ment. These modes provide a variety of options for
selective power conservation in applications where
resources may be limited (i.e., battery-powered
devices).
• the primary clock, as defined by the FOSC<3:0>
Configuration bits
• the secondary clock (the SOSC oscillator)
• the internal oscillator block
There are three categories of power-managed modes:
3.1.2
ENTERING POWER-MANAGED
MODES
• Run modes
• Idle modes
• Sleep mode
Switching from one power-managed mode to another
begins by loading the OSCCON register. The
SCS<1:0> bits select the clock source and determine
which Run or Idle mode is to be used. Changing these
bits causes an immediate switch to the new clock
source, assuming that it is running. The switch may
also be subject to clock transition delays. Refer to
Section 2.9 “Clock Switching” for more information.
These categories define which portions of the device
are clocked and sometimes, what speed. The Run and
Idle modes may use any of the three available clock
sources (primary, secondary or internal oscillator
block). The Sleep mode does not use a clock source.
The power-managed modes include several power-
saving features offered on previous PIC® microcontroller
devices. One of the clock switching features allows the
controller to use the secondary oscillator (SOSC) in
place of the primary oscillator. Also included is the Sleep
mode, offered by all PIC® microcontroller devices, where
all device clocks are stopped.
Entry to the power-managed Idle or Sleep modes is
triggered by the execution of a SLEEPinstruction. The
actual mode that results depends on the status of the
IDLEN bit.
Depending on the current mode and the mode being
switched to, a change to a power-managed mode does
not always require setting all of these bits. Many
transitions may be done by changing the oscillator select
bits, or changing the IDLEN bit, prior to issuing a SLEEP
instruction. If the IDLEN bit is already configured
correctly, it may only be necessary to perform a SLEEP
instruction to switch to the desired mode.
3.1
Selecting Power-Managed Modes
Selecting
decisions:
a power-managed mode requires two
• Whether or not the CPU is to be clocked
• The selection of a clock source
The IDLEN bit (OSCCON<7>) controls CPU clocking,
while the SCS<1:0> bits (OSCCON<1:0>) select the
clock source. The individual modes, bit settings, clock
sources and affected modules are summarized in
Table 3-1.
TABLE 3-1:
POWER-MANAGED MODES
OSCCON Bits
Module Clocking
Mode
Available Clock and Oscillator Source
IDLEN(1) SCS<1:0>
CPU
Peripherals
Sleep
0
N/A
Off
Off
None – All clocks are disabled
PRI_RUN
N/A
00
Clocked
Clocked
Primary – LP, XT, HS, RC, EC and Internal
Oscillator Block(2)
.
This is the normal full-power execution mode.
Secondary – SOSC Oscillator
Internal Oscillator Block(2)
SEC_RUN
RC_RUN
PRI_IDLE
SEC_IDLE
RC_IDLE
N/A
N/A
1
01
1x
00
01
1x
Clocked
Clocked
Off
Clocked
Clocked
Clocked
Clocked
Clocked
Primary – LP, XT, HS, HSPLL, RC, EC
Secondary – SOSC Oscillator
Internal Oscillator Block(2)
1
Off
1
Off
Note 1: IDLEN reflects its value when the SLEEPinstruction is executed.
2: Includes HFINTOSC and HFINTOSC postscaler, as well as the LFINTOSC source.
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 47
PIC18(L)F2X/4XK22
SOSCRUN bit is cleared, the OSTS bit is set and the
primary clock is providing the clock. The IDLEN and
SCS bits are not affected by the wake-up and the
SOSC oscillator continues to run.
3.1.3
MULTIPLE FUNCTIONS OF THE
SLEEP COMMAND
The power-managed mode that is invoked with the
SLEEP instruction is determined by the value of the
IDLEN bit at the time the instruction is executed. If
IDLEN = 0, when SLEEP is executed, the device enters
the sleep mode and all clocks stop and minimum power
is consumed. If IDLEN = 1, when SLEEPis executed,
the device enters the IDLE mode and the system clock
continues to supply a clock to the peripherals but is
disconnected from the CPU.
3.2.3
RC_RUN MODE
In RC_RUN mode, the CPU and peripherals are
clocked from the internal oscillator block using the
INTOSC multiplexer. In this mode, the primary clock is
shut down. When using the LFINTOSC source, this
mode provides the best power conservation of all the
Run modes, while still executing code. It works well for
user applications which are not highly timing-sensitive
or do not require high-speed clocks at all times. If the
primary clock source is the internal oscillator block –
either LFINTOSC or INTOSC (MFINTOSC or
HFINTOSC) – there are no distinguishable differences
between the PRI_RUN and RC_RUN modes during
execution. Entering or exiting RC_RUN mode,
however, causes a clock switch delay. Therefore, if the
primary clock source is the internal oscillator block,
using RC_RUN mode is not recommended.
3.2
Run Modes
In the Run modes, clocks to both the core and
peripherals are active. The difference between these
modes is the clock source.
3.2.1
PRI_RUN MODE
The PRI_RUN mode is the normal, full-power
execution mode of the microcontroller. This is also the
default mode upon a device Reset, unless Two-Speed
Start-up is enabled (see Section 2.10 “Two-Speed
Clock Start-up Mode” for details). In this mode, the
device is operated off the oscillator defined by the
FOSC<3:0> bits of the CONFIG1H Configuration
register.
This mode is entered by setting the SCS1 bit to ‘1’. To
maintain software compatibility with future devices, it is
recommended that the SCS0 bit also be cleared, even
though the bit is ignored. When the clock source is
switched to the INTOSC multiplexer (see Figure 3-1),
the primary oscillator is shut down and the OSTS bit is
cleared. The IRCF<2:0> bits (OSCCON<6:4>) may be
modified at any time to immediately change the clock
speed.
3.2.2
SEC_RUN MODE
In SEC_RUN mode, the CPU and peripherals are
clocked from the secondary external oscillator. This
gives users the option of lower power consumption
while still using a high accuracy clock source.
When the IRCF bits and the INTSRC bit are all clear,
the INTOSC output (HFINTOSC/MFINTOSC) is not
enabled and the HFIOFS and MFIOFS bits will remain
clear. There will be no indication of the current clock
source. The LFINTOSC source is providing the device
clocks.
SEC_RUN mode is entered by setting the SCS<1:0>
bits to ‘01’. When SEC_RUN mode is active, all of the
following are true:
• The device clock source is switched to the SOSC
oscillator (see Figure 3-1)
If the IRCF bits are changed from all clear (thus,
enabling the INTOSC output) or if INTSRC or MFIOSEL
is set, then the HFIOFS or MFIOFS bit is set after the
INTOSC output becomes stable. For details, see
Table 3-2.
• The primary oscillator is shut down
• The SOSCRUN bit (OSCCON2<6>) is set
• The OSTS bit (OSCCON2<3>) is cleared
Clocks to the device continue while the INTOSC source
stabilizes after an interval of TIOBST.
Note:
The secondary external oscillator should
already be running prior to entering
SEC_RUN mode. If the SOSCGO bit or
any of the TxSOSCEN bits are not set
when the SCS<1:0> bits are set to ‘01’,
entry to SEC_RUN mode will not occur
until SOSCGO bit is set and secondary
external oscillator is ready.
If the IRCF bits were previously at a non-zero value, or
if INTSRC was set before setting SCS1 and the
INTOSC source was already stable, then the HFIOFS
or MFIOFS bit will remain set.
On transitions from SEC_RUN mode to PRI_RUN
mode, the peripherals and CPU continue to be clocked
from the SOSC oscillator, while the primary clock is
started. When the primary clock becomes ready, a
clock switch back to the primary clock occurs (see
Figure 3-2). When the clock switch is complete, the
DS41412A-page 48
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
On transitions from RC_RUN mode to PRI_RUN mode,
the device continues to be clocked from the INTOSC
multiplexer while the primary clock is started. When the
primary clock becomes ready, a clock switch to the pri-
mary clock occurs (see Figure 3-3). When the clock
switch is complete, the HFIOFS or MFIOFS bit is
cleared, the OSTS bit is set and the primary clock is
providing the device clock. The IDLEN and SCS bits
are not affected by the switch. The LFINTOSC source
will continue to run if either the WDT or the Fail-Safe
Clock Monitor is enabled.
FIGURE 3-1:
TRANSITION TIMING FOR ENTRY TO SEC_RUN MODE
Q1 Q2 Q3 Q4 Q1
Q2
Q3
Q4
Q1
Q2
Q3
1
2
3
n-1
n
SOSCI
Clock Transition(1)
OSC1
CPU
Clock
Peripheral
Clock
Program
Counter
PC
PC + 2
PC + 4
Note 1: Clock transition typically occurs within 2-4 TOSC.
FIGURE 3-2:
TRANSITION TIMING FROM SEC_RUN MODE TO PRI_RUN MODE (HSPLL)
Q1
Q2
Q3
Q4
Q1
Q2 Q3 Q4 Q1 Q2 Q3
SOSC
OSC1
(1)
TOST
(1)
TPLL
1
2
n-1
n
PLL Clock
Output
Clock
Transition(2)
CPU Clock
Peripheral
Clock
Program
Counter
PC + 2
PC + 4
PC
OSTS bit Set
SCS<1:0> bits Changed
Note1: TOST = 1024 TOSC; TPLL = 2 ms (approx). These intervals are not shown to scale.
2: Clock transition typically occurs within 2-4 TOSC.
TABLE 3-2:
INTERNAL OSCILLATOR FREQUENCY STABILITY BITS
IRCF<2:0>
INTSRC
MFIOSEL
INTOSC Stability Indication
000
000
0
1
1
x
x
x
0
1
0
1
MFIOFS = 0, HFIOFS = 0LFINTOSC
MFIOFS = 0, HFIOFS = 1HFINTOSC
MFIOFS = 1, HFIOFS = 0MFINTOSC
MFIOFS = 0, HFIOFS = 1HFINTOSC
MFIOFS = 1, HFIOFS = 0MFINTOSC
000
010 or 001
010 or 001
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 49
PIC18(L)F2X/4XK22
FIGURE 3-3:
TRANSITION TIMING FROM RC_RUN MODE TO PRI_RUN MODE
Q3
Q4
Q1
Q2 Q3 Q4 Q1 Q2 Q3
Q1
Q2
INTOSC
Multiplexer
OSC1
(1)
TOST
(1)
TPLL
1
2
n-1
n
PLL Clock
Output
Clock
Transition(2)
CPU Clock
Peripheral
Clock
Program
Counter
PC + 2
PC + 4
PC
SCS<1:0> bits Changed
OSTS bit Set
Note1: TOST = 1024 TOSC; TPLL = 2 ms (approx). These intervals are not shown to scale.
2: Clock transition typically occurs within 2-4 TOSC.
DS41412A-page 50
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
3.3
Sleep Mode
3.4
Idle Modes
The Power-Managed Sleep mode in the PIC18(L)F2X/
4XK22 devices is identical to the legacy Sleep mode
offered in all other PIC® microcontroller devices. It is
entered by clearing the IDLEN bit of the OSCCON
register and executing the SLEEPinstruction. This shuts
down the selected oscillator (Figure 3-4) and all clock
source status bits are cleared.
The Idle modes allow the controller’s CPU to be
selectively shut down while the peripherals continue to
operate. Selecting a particular Idle mode allows users
to further manage power consumption.
If the IDLEN bit is set to a ‘1’ when a SLEEPinstruction is
executed, the peripherals will be clocked from the clock
source selected by the SCS<1:0> bits; however, the CPU
will not be clocked. The clock source status bits are not
affected. Setting IDLEN and executing a SLEEPinstruc-
tion provides a quick method of switching from a given
Run mode to its corresponding Idle mode.
Entering the Sleep mode from either Run or Idle mode
does not require a clock switch. This is because no
clocks are needed once the controller has entered
Sleep. If the WDT is selected, the LFINTOSC source
will continue to operate. If the SOSC oscillator is
enabled, it will also continue to run.
If the WDT is selected, the LFINTOSC source will con-
tinue to operate. If the SOSC oscillator is enabled, it will
also continue to run.
When a wake event occurs in Sleep mode (by interrupt,
Reset or WDT time-out), the device will not be clocked
until the clock source selected by the SCS<1:0> bits
becomes ready (see Figure 3-5), or it will be clocked
from the internal oscillator block if either the Two-Speed
Start-up or the Fail-Safe Clock Monitor are enabled
(see Section 24.0 “Special Features of the CPU”). In
either case, the OSTS bit is set when the primary clock
is providing the device clocks. The IDLEN and SCS bits
are not affected by the wake-up.
Since the CPU is not executing instructions, the only
exits from any of the Idle modes are by interrupt, WDT
time-out, or a Reset. When a wake event occurs, CPU
execution is delayed by an interval of TCSD while it
becomes ready to execute code. When the CPU
begins executing code, it resumes with the same clock
source for the current Idle mode. For example, when
waking from RC_IDLE mode, the internal oscillator
block will clock the CPU and peripherals (in other
words, RC_RUN mode). The IDLEN and SCS bits are
not affected by the wake-up.
While in any Idle mode or the Sleep mode, a WDT
time-out will result in a WDT wake-up to the Run mode
currently specified by the SCS<1:0> bits.
FIGURE 3-4:
TRANSITION TIMING FOR ENTRY TO SLEEP MODE
Q1 Q2 Q3 Q4 Q1
OSC1
CPU
Clock
Peripheral
Clock
Sleep
Program
Counter
PC
PC + 2
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 51
PIC18(L)F2X/4XK22
FIGURE 3-5:
TRANSITION TIMING FOR WAKE FROM SLEEP (HSPLL)
Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
Q2 Q3 Q4 Q1 Q2
Q1
OSC1
(1)
(1)
TOST
TPLL
PLL Clock
Output
CPU Clock
Peripheral
Clock
Program
Counter
PC
PC + 2
PC + 4
PC + 6
Wake Event
Note1: TOST = 1024 TOSC; TPLL = 2 ms (approx). These intervals are not shown to scale.
OSTS bit set
3.4.1
PRI_IDLE MODE
3.4.2
SEC_IDLE MODE
This mode is unique among the three low-power Idle
modes, in that it does not disable the primary device
clock. For timing sensitive applications, this allows for
the fastest resumption of device operation with its more
accurate primary clock source, since the clock source
does not have to “warm-up” or transition from another
oscillator.
In SEC_IDLE mode, the CPU is disabled but the
peripherals continue to be clocked from the SOSC
oscillator. This mode is entered from SEC_RUN by set-
ting the IDLEN bit and executing a SLEEPinstruction. If
the device is in another Run mode, set the IDLEN bit
first, then set the SCS<1:0> bits to ‘01’ and execute
SLEEP. When the clock source is switched to the SOSC
oscillator, the primary oscillator is shut down, the OSTS
bit is cleared and the SOSCRUN bit is set.
PRI_IDLE mode is entered from PRI_RUN mode by
setting the IDLEN bit and executing a SLEEP instruc-
tion. If the device is in another Run mode, set IDLEN
first, then clear the SCS bits and execute SLEEP.
Although the CPU is disabled, the peripherals continue
to be clocked from the primary clock source specified
by the FOSC<3:0> Configuration bits. The OSTS bit
remains set (see Figure 3-6).
When a wake event occurs, the peripherals continue to
be clocked from the SOSC oscillator. After an interval
of TCSD following the wake event, the CPU begins exe-
cuting code being clocked by the SOSC oscillator. The
IDLEN and SCS bits are not affected by the wake-up;
the SOSC oscillator continues to run (see Figure 3-7).
When a wake event occurs, the CPU is clocked from the
primary clock source. A delay of interval TCSD is
required between the wake event and when code
execution starts. This is required to allow the CPU to
become ready to execute instructions. After the wake-
up, the OSTS bit remains set. The IDLEN and SCS bits
are not affected by the wake-up (see Figure 3-7).
Note:
The SOSC oscillator should already be
running prior to entering SEC_IDLE mode.
At least one of the secondary oscillator
enable bits (SOSCGO, T1SOSCEN,
T3SOSCEN or T5SOSCEN) must be set
when the SLEEP instruction is executed.
Otherwise, the main system clock will con-
tinue to operate in the previously selected
mode and the corresponding IDLE mode
will be entered (i.e., PRI_IDLE or
RC_IDLE).
FIGURE 3-6:
TRANSITION TIMING FOR ENTRY TO IDLE MODE
Q3
Q4
Q1
Q1
Q2
OSC1
CPU Clock
Peripheral
Clock
Program
Counter
PC
PC + 2
DS41412A-page 52
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
FIGURE 3-7:
TRANSITION TIMING FOR WAKE FROM IDLE TO RUN MODE
Q1
Q3
Q4
Q2
OSC1
TCSD
CPU Clock
Peripheral
Clock
Program
Counter
PC
Wake Event
Clocks to the peripherals continue while the
HFINTOSC source stabilizes. The HFIOFS and
MFIOFS bits will remain set if the IRCF bits were
previously set at a non-zero value or if INTSRC was set
before the SLEEP instruction was executed and the
HFINTOSC source was already stable. If the IRCF bits
and INTSRC are all clear, the HFINTOSC output will
not be enabled, the HFIOFS and MFIOFS bits will
remain clear and there will be no indication of the
current clock source.
3.4.3
RC_IDLE MODE
In RC_IDLE mode, the CPU is disabled but the periph-
erals continue to be clocked from the internal oscillator
block from the HFINTOSC multiplexer output. This
mode allows for controllable power conservation during
Idle periods.
From RC_RUN, this mode is entered by setting the
IDLEN bit and executing a SLEEP instruction. If the
device is in another Run mode, first set IDLEN, then set
the SCS1 bit and execute SLEEP. It is recommended
that SCS0 also be cleared, although its value is
ignored, to maintain software compatibility with future
devices. The HFINTOSC multiplexer may be used to
select a higher clock frequency by modifying the IRCF
bits before executing the SLEEPinstruction. When the
clock source is switched to the HFINTOSC multiplexer,
the primary oscillator is shut down and the OSTS bit is
cleared.
When a wake event occurs, the peripherals continue to
be clocked from the HFINTOSC multiplexer output.
After a delay of TCSD following the wake event, the CPU
begins executing code being clocked by the
HFINTOSC multiplexer. The IDLEN and SCS bits are
not affected by the wake-up. The LFINTOSC source
will continue to run if either the WDT or the Fail-Safe
Clock Monitor is enabled.
If the IRCF bits are set to any non-zero value, or either
the INTSRC or MFIOSEL bits are set, the HFINTOSC
output is enabled. Either the HFIOFS or the MFIOFS
bits become set, after the HFINTOSC output stabilizes
after an interval of TIOBST. For information on the
HFIOFS and MFIOFS bits, see Table 3-2.
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 53
PIC18(L)F2X/4XK22
3.5.2
EXIT BY WDT TIME-OUT
3.5
Exiting Idle and Sleep Modes
A WDT time-out will cause different actions depending
on which power-managed mode the device is in when
the time-out occurs.
An exit from Sleep mode or any of the Idle modes is
triggered by any one of the following:
• an interrupt
If the device is not executing code (all Idle modes and
Sleep mode), the time-out will result in an exit from the
power-managed mode (see Section 3.2 “Run
Modes” and Section 3.3 “Sleep Mode”). If the device
is executing code (all Run modes), the time-out will
result in a WDT Reset (see Section 24.2 “Watchdog
Timer (WDT)”).
• a Reset
• a Watchdog Time-out
This section discusses the triggers that cause exits
from power-managed modes. The clocking subsystem
actions are discussed in each of the power-managed
modes (see Section 3.2 “Run Modes”, Section 3.3
“Sleep Mode” and Section 3.4 “Idle Modes”).
The WDT timer and postscaler are cleared by any one
of the following:
3.5.1
EXIT BY INTERRUPT
• executing a SLEEPinstruction
• executing a CLRWDTinstruction
Any of the available interrupt sources can cause the
device to exit from an Idle mode or the Sleep mode to
a Run mode. To enable this functionality, an interrupt
source must be enabled by setting its enable bit in one
of the INTCON or PIE registers. The exit sequence is
initiated when the corresponding interrupt flag bit is set.
• the loss of the currently selected clock source
when the Fail-Safe Clock Monitor is enabled
• modifying the IRCF bits in the OSCCON register
when the internal oscillator block is the device
clock source
The instruction immediately following the SLEEP
instruction is executed on all exits by interrupt from Idle
or Sleep modes. Code execution then branches to the
interrupt vector if the GIE/GIEH bit of the INTCON
register is set, otherwise code execution continues
without branching (see Section 9.0 “Interrupts”).
3.5.3
EXIT BY RESET
Exiting Sleep and Idle modes by Reset causes code
execution to restart at address 0. See Section 4.0
“Reset” for more details.
The exit delay time from Reset to the start of code
execution depends on both the clock sources before
and after the wake-up and the type of oscillator. Exit
delays are summarized in Table 3-3.
A fixed delay of interval TCSD following the wake event
is required when leaving Sleep and Idle modes. This
delay is required for the CPU to prepare for execution.
Instruction execution resumes on the first clock cycle
following this delay.
3.5.4
EXIT WITHOUT AN OSCILLATOR
START-UP DELAY
Certain exits from power-managed modes do not
invoke the OST at all. There are two cases:
• PRI_IDLE mode, where the primary clock source
is not stopped and
• the primary clock source is not any of the LP, XT,
HS or HSPLL modes.
In these instances, the primary clock source either
does not require an oscillator start-up delay since it is
already running (PRI_IDLE), or normally does not
require an oscillator start-up delay (RC, EC, INTOSC,
and INTOSCIO modes). However, a fixed delay of
interval TCSD following the wake event is still required
when leaving Sleep and Idle modes to allow the CPU
to prepare for execution. Instruction execution resumes
on the first clock cycle following this delay.
DS41412A-page 54
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
TABLE 3-3:
EXIT DELAY ON WAKE-UP BY RESET FROM SLEEP MODE OR ANY IDLE MODE
(BY CLOCK SOURCES)
Clock Source
before Wake-up
Clock Source
after Wake-up
Clock Ready Status
Bit (OSCCON)
Exit Delay
LP, XT, HS
HSPLL
OSTS
IOSF
OSTS
IOSF
OSTS
IOSF
OSTS
IOSF
Primary Device Clock
(PRI_IDLE mode)
(1)
TCSD
EC, RC
HFINTOSC(2)
LP, XT, HS
HSPLL
(3)
TOST
(3)
TOST + tPLL
T1OSC or LFINTOSC(1)
(1)
EC, RC
TCSD
HFINTOSC(1)
LP, XT, HS
HSPLL
TIOBST
(4)
(4)
TOST
(3)
(3)
TOST + tPLL
HFINTOSC(2)
(1)
EC, RC
TCSD
HFINTOSC(1)
LP, XT, HS
HSPLL
None
(3)
TOST
TOST + tPLL
None
(Sleep mode)
(1)
EC, RC
HFINTOSC(1)
TCSD
(4)
TIOBST
Note 1: TCSD is a required delay when waking from Sleep and all Idle modes and runs concurrently with any other
required delays (see Section 3.4 “Idle Modes”). On Reset, HFINTOSC defaults to 1 MHz.
2: Includes both the HFINTOSC 16 MHz source and postscaler derived frequencies.
3: TOST is the Oscillator Start-up Timer. tPLL is the PLL Lock-out Timer.
4: Execution continues during the HFINTOSC stabilization period, TIOBST.
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 55
PIC18(L)F2X/4XK22
Setting the PMD bit for a module disables all clock
sources to that module, reducing its power
consumption to an absolute minimum. In this state, the
control and STATUS registers associated with the
peripheral are also disabled, so writes to these
registers have no effect and read values are invalid.
3.6
Selective Peripheral Module
Control
Idle mode allows users to substantially reduce power
consumption by stopping the CPU clock. Even so,
peripheral modules still remain clocked, and thus, con-
sume power. There may be cases where the applica-
tion needs what IDLE mode does not provide: the
allocation of power resources to the CPU processing
with minimal power consumption from the peripherals.
PIC18(L)F2X/4XK22 family devices address this
requirement by allowing peripheral modules to be
selectively disabled, reducing or eliminating their
power consumption. This can be done with control bits
in the Peripheral Module Disable (PMD) registers.
These bits generically named XXXMD are located in
control registers PMD0, PMD1 or PMD2.
REGISTER 3-1:
R/W-0
PMD0: PERIPHERAL MODULE DISABLE REGISTER 0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
UART2MD
bit 7
UART1MD
TMR6MD
TMR5MD
TMR4MD
TMR3MD
TMR2MD
TMR1MD
bit 0
Legend:
R = Readable bit
W = Writable bit
‘1’ = Bit is set
U = Unimplemented bit, read as ‘0’
‘0’ = Bit is cleared x = Bit is unknown
-n = Value at POR
bit 7
bit 6
bit 5
bit 4
bit 3
bit 2
bit 1
bit 0
UART2MD: UART2 Peripheral Module Disable Control bit
1= Module is disabled, Clock Source is disconnected, module does not draw digital power
0= Module is enabled, Clock Source is connected, module draws digital power
UART1MD: UART1 Peripheral Module Disable Control bit
1= Module is disabled, Clock Source is disconnected, module does not draw digital power
0= Module is enabled, Clock Source is connected, module draws digital power
TMR6MD: Timer6 Peripheral Module Disable Control bit
1= Module is disabled, Clock Source is disconnected, module does not draw digital power
0= Module is enabled, Clock Source is connected, module draws digital power
TMR5MD: Timer5 Peripheral Module Disable Control bit
1= Module is disabled, Clock Source is disconnected, module does not draw digital power
0= Module is enabled, Clock Source is connected, module draws digital power
TMR4MD: Timer4 Peripheral Module Disable Control bit
1= Module is disabled, Clock Source is disconnected, module does not draw digital power
0= Module is enabled, Clock Source is connected, module draws digital power
TMR3MD: Timer3 Peripheral Module Disable Control bit
1= Module is disabled, Clock Source is disconnected, module does not draw digital power
0= Module is enabled, Clock Source is connected, module draws digital power
TMR2MD: Timer2 Peripheral Module Disable Control bit
1= Module is disabled, Clock Source is disconnected, module does not draw digital power
0= Module is enabled, Clock Source is connected, module draws digital power
TMR1MD: Timer1 Peripheral Module Disable Control bit
1= Module is disabled, Clock Source is disconnected, module does not draw digital power
0= Module is enabled, Clock Source is connected, module draws digital power
DS41412A-page 56
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
REGISTER 3-2:
R/W-0
PMD1: PERIPHERAL MODULE DISABLE REGISTER 1
R/W-0
U-0
—
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
MSSP2MD
bit 7
MSSP1MD
CCP5MD
CCP4MD
CCP3MD
CCP2MD
CCP1MD
bit 0
Legend:
R = Readable bit
W = Writable bit
‘1’ = Bit is set
U = Unimplemented bit, read as ‘0’
‘0’ = Bit is cleared x = Bit is unknown
-n = Value at POR
bit 7
bit 6
MSSP2MD: MSSP2 Peripheral Module Disable Control bit
1= Module is disabled, Clock Source is disconnected, module does not draw digital power
0= Module is enabled, Clock Source is connected, module draws digital power
MSSP1MD: MSSP1 Peripheral Module Disable Control bit
1= Module is disabled, Clock Source is disconnected, module does not draw digital power
0= Module is enabled, Clock Source is connected, module draws digital power
bit 5
bit 4
Unimplemented: Read as ‘0’
CCP5MD: CCP5 Peripheral Module Disable Control bit
1= Module is disabled, Clock Source is disconnected, module does not draw digital power
0= Module is enabled, Clock Source is connected, module draws digital power
bit 3
bit 2
bit 1
bit 0
CCP4MD: CCP4 Peripheral Module Disable Control bit
1= Module is disabled, Clock Source is disconnected, module does not draw digital power
0= Module is enabled, Clock Source is connected, module draws digital power
CCP3MD: CCP3 Peripheral Module Disable Control bit
1= Module is disabled, Clock Source is disconnected, module does not draw digital power
0= Module is enabled, Clock Source is connected, module draws digital power
CCP2MD: CCP2 Peripheral Module Disable Control bit
1= Module is disabled, Clock Source is disconnected, module does not draw digital power
0= Module is enabled, Clock Source is connected, module draws digital power
CCP1MD: CCP1 Peripheral Module Disable Control bit
1= Module is disabled, Clock Source is disconnected, module does not draw digital power
0= Module is enabled, Clock Source is connected, module draws digital power
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 57
PIC18(L)F2X/4XK22
REGISTER 3-3:
PMD2: PERIPHERAL MODULE DISABLE REGISTER 2
U-0
—
U-0
—
U-0
—
U-0
—
R/W-0
R/W-0
R/W-0
R/W-0
CTMUMD
CMP2MD
CMP1MD
ADCMD
bit 7
bit 0
Legend:
R = Readable bit
-n = Value at POR
W = Writable bit
‘1’ = Bit is set
U = Unimplemented bit, read as ‘0’
‘0’ = Bit is cleared x = Bit is unknown
bit 7-4
bit 3
Unimplemented: Read as ‘0’
CTMUMD: CTMU Peripheral Module Disable Control bit
1= Module is disabled, Clock Source is disconnected, module does not draw digital power
0= Module is enabled, Clock Source is connected, module draws digital power
bit 2
bit 1
bit 0
CMP2MD: Comparator C2 Peripheral Module Disable Control bit
1= Module is disabled, Clock Source is disconnected, module does not draw digital power
0= Module is enabled, Clock Source is connected, module draws digital power
CMP1MD: Comparator C1 Peripheral Module Disable Control bit
1= Module is disabled, Clock Source is disconnected, module does not draw digital power
0= Module is enabled, Clock Source is connected, module draws digital power
ADCMD: ADC Peripheral Module Disable Control bit
1= Module is disabled, Clock Source is disconnected, module does not draw digital power
0= Module is enabled, Clock Source is connected, module draws digital power
DS41412A-page 58
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
A simplified block diagram of the On-Chip Reset Circuit
is shown in Figure 4-1.
4.0
RESET
The PIC18(L)F2X/4XK22 devices differentiate between
various kinds of Reset:
4.1
RCON Register
a) Power-on Reset (POR)
Device Reset events are tracked through the RCON
register (Register 4-1). The lower five bits of the
register indicate that a specific Reset event has
occurred. In most cases, these bits can only be cleared
by the event and must be set by the application after
the event. The state of these flag bits, taken together,
can be read to indicate the type of Reset that just
occurred. This is described in more detail in
Section 4.6 “Reset State of Registers”.
b) MCLR Reset during normal operation
c) MCLR Reset during power-managed modes
d) Watchdog Timer (WDT) Reset (during
execution)
e) Programmable Brown-out Reset (BOR)
f) RESETInstruction
g) Stack Full Reset
h) Stack Underflow Reset
The RCON register also has control bits for setting
interrupt priority (IPEN) and software control of the
BOR (SBOREN). Interrupt priority is discussed in
Section 9.0 “Interrupts”. BOR is covered in
Section 4.4 “Brown-out Reset (BOR)”.
This section discusses Resets generated by MCLR,
POR and BOR and covers the operation of the various
start-up timers. Stack Reset events are covered in
Section 5.1.2.4 “Stack Full and Underflow Resets”.
WDT Resets are covered in Section 24.2 “Watchdog
Timer (WDT)”.
FIGURE 4-1:
SIMPLIFIED BLOCK DIAGRAM OF ON-CHIP RESET CIRCUIT
RESET
Instruction
Stack Full/Underflow Reset
Stack
Pointer
External Reset
MCLRE
MCLR
( )_IDLE
Sleep
WDT
Time-out
VDD
Detect
POR
VDD
Brown-out
Reset
S
BOREN
OST/PWRT
OST
(2)
1024 Cycles
Chip_Reset
10-bit Ripple Counter
R
Q
OSC1
32 s
(2)
65.5 ms
PWRT
LFINTOSC
11-bit Ripple Counter
Enable PWRT
(1)
Enable OST
Note 1: See Table for time-out situations.
2: PWRT and OST counters are reset by POR and BOR. See Sections 4.3 and 4.4.
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 59
PIC18(L)F2X/4XK22
REGISTER 4-1:
RCON: RESET CONTROL REGISTER
R/W-0/0
R/W-q/u
SBOREN(1)
U-0
—
R/W-1/q
RI
R-1/q
TO
R-1/q
PD
R/W-q/u
POR(2)
R/W-0/q
BOR
IPEN
bit 7
bit 0
Legend:
R = Readable bit
‘1’ = Bit is set
W = Writable bit
U = Unimplemented bit, read as ‘0’
‘0’ = Bit is cleared
u = unchanged
-n/n = Value at POR and BOR/Value at all other Resets
q = depends on condition
x = Bit is unknown
bit 7
bit 6
IPEN: Interrupt Priority Enable bit
1= Enable priority levels on interrupts
0= Disable priority levels on interrupts (PIC16CXXX Compatibility mode)
SBOREN: BOR Software Enable bit(1)
If BOREN<1:0> = 01:
1= BOR is enabled
0= BOR is disabled
If BOREN<1:0> = 00, 10 or 11:
Bit is disabled and read as ‘0’.
bit 5
bit 4
Unimplemented: Read as ‘0’
RI: RESETInstruction Flag bit
1= The RESETinstruction was not executed (set by firmware or Power-on Reset)
0= The RESET instruction was executed causing a device Reset (must be set in firmware after a
code-executed Reset occurs)
bit 3
bit 2
bit 1
bit 0
TO: Watchdog Time-out Flag bit
1= Set by power-up, CLRWDTinstruction or SLEEPinstruction
0= A WDT time-out occurred
PD: Power-down Detection Flag bit
1= Set by power-up or by the CLRWDTinstruction
0= Set by execution of the SLEEPinstruction
POR: Power-on Reset Status bit(2)
1= No Power-on Reset occurred
0= A Power-on Reset occurred (must be set in software after a Power-on Reset occurs)
BOR: Brown-out Reset Status bit(3)
1= A Brown-out Reset has not occurred (set by firmware only)
0= A Brown-out Reset occurred (must be set by firmware after a POR or Brown-out Reset occurs)
Note 1: When CONFIG2L[2:1] = 01, then the SBOREN Reset state is ‘1’; otherwise, it is ‘0’.
2: The actual Reset value of POR is determined by the type of device Reset. See the notes following this
register and Section 4.6 “Reset State of Registers” for additional information.
3: See Table .
Note 1: Brown-out Reset is indicated when BOR is ‘0’ and POR is ‘1’ (assuming that both POR and BOR were set
to ‘1’ by firmware immediately after POR).
2: It is recommended that the POR bit be set after a Power-on Reset has been detected so that subsequent
Power-on Resets may be detected.
DS41412A-page 60
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
FIGURE 4-2:
EXTERNAL POWER-ON
RESET CIRCUIT (FOR
SLOW VDD POWER-UP)
4.2
Master Clear (MCLR)
The MCLR pin provides a method for triggering an
external Reset of the device. A Reset is generated by
holding the pin low. These devices have a noise filter in
the MCLR Reset path which detects and ignores small
pulses. An internal weak pull-up is enabled when the
pin is configured as the MCLR input.
VDD
VDD
D
PIC® MCU
R
The MCLR pin is not driven low by any internal Resets,
including the WDT.
R1
MCLR
In PIC18(L)F2X/4XK22 devices, the MCLR input can
be disabled with the MCLRE Configuration bit. When
MCLR is disabled, the pin becomes a digital input. See
Section 10.6 “PORTE Registers” for more
information.
C
Note 1: External Power-on Reset circuit is required
only if the VDD power-up slope is too slow.
The diode D helps discharge the capacitor
quickly when VDD powers down.
4.3
Power-on Reset (POR)
2: 15 k < R < 40 k is recommended to make
sure that the voltage drop across R does not
violate the device’s electrical specification.
A
Power-on Reset pulse is generated on-chip
whenever VDD rises above a certain threshold. This
allows the device to start in the initialized state when
VDD is adequate for operation.
3: R1 1 k will limit any current flowing into
MCLR from external capacitor C, in the event
of MCLR/VPP pin breakdown, due to
Electrostatic Discharge (ESD) or Electrical
Overstress (EOS).
To take advantage of the POR circuitry either leave the
pin floating, or tie the MCLR pin through a resistor to
VDD. This will eliminate external RC components
usually needed to create a Power-on Reset delay. A
minimum rise rate for VDD is specified. For a slow rise
time, see Figure 4-2.
When the device starts normal operation (i.e., exits the
Reset condition), device operating parameters (volt-
age, frequency, temperature, etc.) must be met to
ensure proper operation. If these conditions are not
met, the device must be held in Reset until the operat-
ing conditions are met.
POR events are captured by the POR bit of the RCON
register. The state of the bit is set to ‘0’ whenever a
POR occurs; it does not change for any other Reset
event. POR is not reset to ‘1’ by any hardware event.
To capture multiple events, the user must manually set
the bit to ‘1’ by software following any POR.
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 61
PIC18(L)F2X/4XK22
4.4.2
SOFTWARE ENABLED BOR
4.4
Brown-out Reset (BOR)
When BOREN<1:0> = 01, the BOR can be enabled or
disabled by the user in software. This is done with the
SBOREN control bit of the RCON register. Setting
SBOREN enables the BOR to function as previously
described. Clearing SBOREN disables the BOR
entirely. The SBOREN bit operates only in this mode;
otherwise it is read as ‘0’.
PIC18(L)F2X/4XK22 devices implement a BOR circuit
that provides the user with a number of configuration and
power-saving options. The BOR is controlled by the
BORV<1:0> and BOREN<1:0> bits of the CONFIG2L
Configuration register. There are a total of four BOR
configurations which are summarized in Table 4-1.
The BOR threshold is set by the BORV<1:0> bits. If
BOR is enabled (any values of BOREN<1:0>, except
‘00’), any drop of VDD below VBOR for greater than
TBOR will reset the device. A Reset may or may not
occur if VDD falls below VBOR for less than TBOR. The
chip will remain in Brown-out Reset until VDD rises
above VBOR.
Placing the BOR under software control gives the user
the additional flexibility of tailoring the application to the
environment without having to reprogram the device to
change BOR configuration. It also allows the user to
tailor device power consumption in software by
eliminating the incremental current that the BOR
consumes. While the BOR current is typically very small,
it may have some impact in low-power applications.
If the Power-up Timer is enabled, it will be invoked after
VDD rises above VBOR; it then will keep the chip in
Reset for an additional time delay, TPWRT. If VDD drops
below VBOR while the Power-up Timer is running, the
chip will go back into a Brown-out Reset and the
Power-up Timer will be initialized. Once VDD rises
above VBOR, the Power-up Timer will execute the
additional time delay.
Note:
Even when BOR is under software control,
the BOR Reset voltage level is still set by
the BORV<1:0> Configuration bits. It
cannot be changed by software.
4.4.3
DISABLING BOR IN SLEEP MODE
When BOREN<1:0> = 10, the BOR remains under
hardware control and operates as previously
described. Whenever the device enters Sleep mode,
however, the BOR is automatically disabled. When the
device returns to any other operating mode, BOR is
automatically re-enabled.
BOR and the Power-on Timer (PWRT) are
independently configured. Enabling BOR Reset does
not automatically enable the PWRT.
The BOR circuit has an output that feeds into the POR
circuit and rearms the POR within the operating range
of the BOR. This early rearming of the POR ensures
that the device will remain in Reset in the event that VDD
falls below the operating range of the BOR circuitry.
This mode allows for applications to recover from
brown-out situations, while actively executing code,
when the device requires BOR protection the most. At
the same time, it saves additional power in Sleep mode
by eliminating the small incremental BOR current.
4.4.1
DETECTING BOR
When BOR is enabled, the BOR bit always resets to ‘0’
on any BOR or POR event. This makes it difficult to
determine if a BOR event has occurred just by reading
the state of BOR alone. A more reliable method is to
simultaneously check the state of both POR and BOR.
This assumes that the POR and BOR bits are reset to
‘1’ by software immediately after any POR event. If
BOR is ‘0’ while POR is ‘1’, it can be reliably assumed
that a BOR event has occurred.
4.4.4
MINIMUM BOR ENABLE TIME
Enabling the BOR also enables the Fixed Voltage
Reference (FVR) when no other peripheral requiring the
FVR is active. The BOR becomes active only after the
FVR stabilizes. Therefore, to ensure BOR protection,
the FVR settling time must be considered when
enabling the BOR in software or when the BOR is
automatically enabled after waking from Sleep. If the
BOR is disabled, in software or by reentering Sleep
before the FVR stabilizes, the BOR circuit will not sense
a BOR condition. The FVRST bit of the VREFCON0
register can be used to determine FVR stability.
DS41412A-page 62
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
TABLE 4-1:
BOR CONFIGURATIONS
BOR Configuration
Status of
SBOREN
BOR Operation
BOREN1 BOREN0
(RCON<6>)
0
0
1
0
1
0
Unavailable
Available
BOR disabled; must be enabled by reprogramming the Configuration bits.
BOR enabled by software; operation controlled by SBOREN.
Unavailable
BOR enabled by hardware in Run and Idle modes, disabled during
Sleep mode.
1
1
Unavailable
BOR enabled by hardware; must be disabled by reprogramming the Configuration bits.
4.5.3
PLL LOCK TIME-OUT
4.5
Device Reset Timers
With the PLL enabled, the time-out sequence following a
Power-on Reset is slightly different from other oscillator
modes. A separate timer is used to provide a fixed time-
out that is sufficient for the PLL to lock to the main
oscillator frequency. This PLL lock time-out (TPLL) is
typically 2 ms and follows the oscillator start-up time-out.
PIC18(L)F2X/4XK22 devices incorporate three
separate on-chip timers that help regulate the Power-
on Reset process. Their main function is to ensure that
the device clock is stable before code is executed.
These timers are:
• Power-up Timer (PWRT)
• Oscillator Start-up Timer (OST)
• PLL Lock Time-out
4.5.4
TIME-OUT SEQUENCE
On power-up, the time-out sequence is as follows:
1. After the POR pulse has cleared, PWRT time-out
is invoked (if enabled).
4.5.1
POWER-UP TIMER (PWRT)
The Power-up Timer (PWRT) of PIC18(L)F2X/4XK22
devices is an 11-bit counter which uses the
LFINTOSC source as the clock input. This yields an
approximate time interval of 2048 x 32 s = 65.6 ms.
While the PWRT is counting, the device is held in
Reset.
2. Then, the OST is activated.
The total time-out will vary based on oscillator
configuration and the status of the PWRT. Figure 4-3,
Figure 4-4, Figure 4-5, Figure 4-6 and Figure 4-7 all
depict time-out sequences on power-up, with the
Power-up Timer enabled and the device operating in
HS Oscillator mode. Figures 4-3 through 4-6 also
apply to devices operating in XT or LP modes. For
devices in RC mode and with the PWRT disabled, on
the other hand, there will be no time-out at all.
The power-up time delay depends on the LFINTOSC
clock and will vary from chip-to-chip due to temperature
and process variation.
The PWRT is enabled by clearing the PWRTEN
Configuration bit.
Since the time-outs occur from the POR pulse, if MCLR
is kept low long enough, all time-outs will expire, after
which, bringing MCLR high will allow program
execution to begin immediately (Figure 4-5). This is
useful for testing purposes or to synchronize more than
one PIC® MCU device operating in parallel.
4.5.2
OSCILLATOR START-UP TIMER
(OST)
The Oscillator Start-up Timer (OST) provides a 1024
oscillator cycle (from OSC1 input) delay after the
PWRT delay is over. This ensures that the crystal
oscillator or resonator has started and stabilized.
The OST time-out is invoked only for XT, LP and HS
modes and only on Power-on Reset, or on exit from all
power-managed modes that stop the external oscillator.
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 63
PIC18(L)F2X/4XK22
TABLE 4-2:
Oscillator
TIME-OUT IN VARIOUS SITUATIONS
Power-up(2) and Brown-out
Exit from
Configuration
Power-Managed Mode
PWRTEN = 0
PWRTEN = 1
HSPLL
66 ms(1) + 1024 TOSC + 2
ms(2)
1024 TOSC + 2 ms(2)
1024 TOSC + 2 ms(2)
HS, XT, LP
EC, ECIO
66 ms(1) + 1024 TOSC
66 ms(1)
1024 TOSC
1024 TOSC
—
—
—
—
—
—
RC, RCIO
66 ms(1)
66 ms(1)
INTIO1, INTIO2
Note 1: 66 ms (65.5 ms) is the nominal Power-up Timer (PWRT) delay.
2: 2 ms is the nominal time required for the PLL to lock.
FIGURE 4-3:
TIME-OUT SEQUENCE ON POWER-UP (MCLR TIED TO VDD, VDD RISE < TPWRT)
VDD
MCLR
INTERNAL POR
TPWRT
PWRT TIME-OUT
OST TIME-OUT
TOST
INTERNAL RESET
FIGURE 4-4:
TIME-OUT SEQUENCE ON POWER-UP (MCLR NOT TIED TO VDD): CASE 1
VDD
MCLR
INTERNAL POR
TPWRT
PWRT TIME-OUT
OST TIME-OUT
TOST
INTERNAL RESET
DS41412A-page 64
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
FIGURE 4-5:
TIME-OUT SEQUENCE ON POWER-UP (MCLR NOT TIED TO VDD): CASE 2
VDD
MCLR
INTERNAL POR
TPWRT
PWRT TIME-OUT
OST TIME-OUT
TOST
INTERNAL RESET
FIGURE 4-6:
SLOW RISE TIME (MCLR TIED TO VDD, VDD RISE > TPWRT)
5V
0V
VDD
MCLR
INTERNAL POR
TPWRT
PWRT TIME-OUT
TOST
OST TIME-OUT
INTERNAL RESET
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 65
PIC18(L)F2X/4XK22
FIGURE 4-7:
TIME-OUT SEQUENCE ON POR W/PLL ENABLED (MCLR TIED TO VDD)
VDD
MCLR
INTERNAL POR
TPWRT
PWRT TIME-OUT
OST TIME-OUT
TOST
TPLL
PLL TIME-OUT
INTERNAL RESET
Note:
TOST = 1024 clock cycles.
TPLL 2 ms max. First three stages of the PWRT timer.
DS41412A-page 66
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
Table 5-2 describes the Reset states for all of the
Special Function Registers. The table identifies
differences between Power-On Reset (POR)/Brown-
Out Reset (BOR) and all other Resets, (i.e., Master
Clear, WDT Resets, STKFUL, STKUNF, etc.).
Additionally, the table identifies register bits that are
changed when the device receives a wake-up from
WDT or other interrupts.
4.6
Reset State of Registers
Some registers are unaffected by a Reset. Their status
is unknown on POR and unchanged by all other
Resets. All other registers are forced to a “Reset state”
depending on the type of Reset that occurred.
Most registers are not affected by a WDT wake-up,
since this is viewed as the resumption of normal
operation. Status bits from the RCON register, RI, TO,
PD, POR and BOR, are set or cleared differently in
different Reset situations, as indicated in Table 4-3.
These bits are used by software to determine the
nature of the Reset.
TABLE 4-3:
STATUS BITS, THEIR SIGNIFICANCE AND THE INITIALIZATION CONDITION
FOR RCON REGISTER
RCON Register
STKPTR Register
Program
Counter
Condition
SBOREN
RI
TO
PD POR BOR STKFUL STKUNF
Power-on Reset
RESETInstruction
Brown-out Reset
0000h
0000h
0000h
0000h
1
1
0
1
u
1
u
1
1
1
u
1
u
0
u
u
u
0
u
0
u
0
u
u
u
0
u
u
u
u(2)
u(2)
u(2)
MCLR during Power-Managed
Run Modes
MCLR during Power-Managed
Idle Modes and Sleep Mode
0000h
0000h
0000h
u(2)
u(2)
u(2)
u
u
u
1
0
u
0
u
u
u
u
u
u
u
u
u
u
u
u
u
u
WDT Time-out during Full Power
or Power-Managed Run Mode
MCLR during Full Power
Execution
Stack Full Reset (STVREN = 1)
0000h
0000h
u(2)
u(2)
u
u
u
u
u
u
u
u
u
u
1
u
u
1
Stack Underflow Reset
(STVREN = 1)
Stack Underflow Error (not an
actual Reset, STVREN = 0)
0000h
u(2)
u(2)
u
u
u
0
u
0
u
u
u
u
u
u
1
u
WDT Time-out during
Power-Managed Idle or Sleep
Modes
PC + 2
Interrupt Exit from
PC + 2(1)
u(2)
u
u
0
u
u
u
u
Power-Managed Modes
Legend: u= unchanged
Note 1: When the wake-up is due to an interrupt and the GIEH or GIEL bits are set, the PC is loaded with the
interrupt vector (008h or 0018h).
2: Reset state is ‘1’ for SBOREN and unchanged for all other Resets when software BOR is enabled
(BOREN<1:0> Configuration bits = 01). Otherwise, the Reset state is ‘0’.
TABLE 4-4:
Name
REGISTERS ASSOCIATED WITH RESETS
Register
on Page
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
RCON
IPEN
SBOREN
STKUNF
—
—
RI
TO
PD
POR
BOR
60
72
STKPTR
STKFUL
STKPTR<4:0>
Legend: — = unimplemented locations, read as ‘0’. Shaded bits are not used for Resets.
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 67
PIC18(L)F2X/4XK22
TABLE 4-5:
Name
CONFIGURATION REGISTERS ASSOCIATED WITH RESETS
Register
on Page
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
CONFIG2L
CONFIG2H
—
—
—
—
—
BORV<1:0>
WDPS<3:0>
T3CMX HFOFST CCP3MX PBADEN CCP2MX
LVP STRVEN
BOREN<1:0>
PWRTEN
354
355
356
357
WDTEN<1:0>
CONFIG3H MCLRE
CONFIG4L DEBUG
—
P2BMX
—
XINST
—
—
—
Legend: — = unimplemented locations, read as ‘0’. Shaded bits are not used for Resets.
DS41412A-page 68
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
5.1
Program Memory Organization
5.0
MEMORY ORGANIZATION
PIC18 microcontrollers implement a 21-bit program
counter, which is capable of addressing a 2-Mbyte
program memory space. Accessing a location between
the upper boundary of the physically implemented
memory and the 2-Mbyte address will return all ‘0’s (a
NOPinstruction).
There are three types of memory in PIC18 Enhanced
microcontroller devices:
• Program Memory
• Data RAM
• Data EEPROM
As Harvard architecture devices, the data and program
memories use separate buses; this allows for
concurrent access of the two memory spaces. The data
EEPROM, for practical purposes, can be regarded as
a peripheral device, since it is addressed and accessed
through a set of control registers.
This family of devices contain the following:
• PIC18(L)F23K22, PIC18(L)F43K22: 8 Kbytes of
Flash Memory, up to 4,096 single-word instructions
• PIC18(L)F24K22, PIC18(L)F44K22: 16 Kbytes of
Flash Memory, up to 8,192 single-word instructions
• PIC18(L)F25K22, PIC18(L)F45K22: 32 Kbytes of
Flash Memory, up to 16,384 single-word instruc-
tions
Additional detailed information on the operation of the
Flash program memory is provided in Section 6.0
“Flash Program Memory”. Data EEPROM is
discussed separately in Section 7.0 “Data EEPROM
Memory”.
• PIC18(L)F26K22, PIC18(L)F46K22: 64 Kbytes of
Flash Memory, up to 37,768 single-word
instructions
PIC18 devices have two interrupt vectors. The Reset
vector address is at 0000h and the interrupt vector
addresses are at 0008h and 0018h.
The program memory map for PIC18(L)F2X/4XK22
devices is shown in Figure 5-1. Memory block details
are shown in Figure 20-2.
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 69
PIC18(L)F2X/4XK22
FIGURE 5-1:
PROGRAM MEMORY MAP AND STACK FOR PIC18(L)F2X/4XK22 DEVICES
PC<20:0>
21
CALL,RCALL,RETURN
RETFIE,RETLW
Stack Level 1
Stack Level 31
0000h
Reset Vector
High Priority Interrupt Vector
Low Priority Interrupt Vector
0008h
0018h
On-Chip
Program Memory
1FFFh
On-Chip
Program Memory
2000h
On-Chip
Program Memory
3FFFh
4000h
PIC18(L)F23K22
PIC18(L)F43K22
On-Chip
Program Memory
PIC18(L)F24K22
PIC18(L)F44K22
7FFFh
8000h
PIC18(L)F25K22
PIC18(L)F45K22
FFFFh
10000h
Read ‘0’
Read ‘0’
Read ‘0’
PIC18(L)F26K22
PIC18(L)F46K22
Read ‘0’
1FFFFFh
200000h
The CALL, RCALL, GOTO and program branch
instructions write to the program counter directly. For
these instructions, the contents of PCLATH and
PCLATU are not transferred to the program counter.
5.1.1
PROGRAM COUNTER
The Program Counter (PC) specifies the address of the
instruction to fetch for execution. The PC is 21 bits wide
and is contained in three separate 8-bit registers. The
low byte, known as the PCL register, is both readable
and writable. The high byte, or PCH register, contains
the PC<15:8> bits; it is not directly readable or writable.
Updates to the PCH register are performed through the
PCLATH register. The upper byte is called PCU. This
register contains the PC<20:16> bits; it is also not
directly readable or writable. Updates to the PCU
register are performed through the PCLATU register.
5.1.2
RETURN ADDRESS STACK
The return address stack allows any combination of up
to 31 program calls and interrupts to occur. The PC is
pushed onto the stack when a CALL or RCALL
instruction is executed or an interrupt is Acknowledged.
The PC value is pulled off the stack on a RETURN,
RETLWor a RETFIEinstruction. PCLATU and PCLATH
are not affected by any of the RETURN or CALL
instructions.
The contents of PCLATH and PCLATU are transferred
to the program counter by any operation that writes
PCL. Similarly, the upper two bytes of the program
counter are transferred to PCLATH and PCLATU by an
operation that reads PCL. This is useful for computed
offsets to the PC (see Section 5.1.4.1 “Computed
GOTO”).
The stack operates as a 31-word by 21-bit RAM and a
5-bit Stack Pointer, STKPTR. The stack space is not
part of either program or data space. The Stack Pointer
is readable and writable and the address on the top of
the stack is readable and writable through the Top-of-
Stack (TOS) Special File Registers. Data can also be
pushed to, or popped from the stack, using these
registers.
The PC addresses bytes in the program memory. To
prevent the PC from becoming misaligned with word
instructions, the Least Significant bit of PCL is fixed to
a value of ‘0’. The PC increments by 2 to address
sequential instructions in the program memory.
DS41412A-page 70
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
A CALLtype instruction causes a push onto the stack;
the Stack Pointer is first incremented and the location
pointed to by the Stack Pointer is written with the
contents of the PC (already pointing to the instruction
following the CALL). A RETURNtype instruction causes
a pop from the stack; the contents of the location
pointed to by the STKPTR are transferred to the PC
and then the Stack Pointer is decremented.
5.1.2.1
Top-of-Stack Access
Only the top of the return address stack (TOS) is readable
and writable. A set of three registers, TOSU:TOSH:TOSL,
hold the contents of the stack location pointed to by the
STKPTR register (Figure 5-2). This allows users to
implement a software stack if necessary. After a CALL,
RCALL or interrupt, the software can read the pushed
value by reading the TOSU:TOSH:TOSL registers. These
values can be placed on a user defined software stack. At
return time, the software can return these values to
TOSU:TOSH:TOSL and do a return.
The Stack Pointer is initialized to ‘00000’ after all
Resets. There is no RAM associated with the location
corresponding to a Stack Pointer value of ‘00000’; this
is only a Reset value. Status bits indicate if the stack is
full or has overflowed or has underflowed.
The user must disable the Global Interrupt Enable (GIE)
bits while accessing the stack to prevent inadvertent
stack corruption.
FIGURE 5-2:
RETURN ADDRESS STACK AND ASSOCIATED REGISTERS
Return Address Stack <20:0>
11111
11110
11101
Top-of-Stack Registers
Stack Pointer
STKPTR<4:0>
TOSU
00h
TOSH
1Ah
TOSL
34h
00010
00011
00010
00001
00000
001A34h
000D58h
Top-of-Stack
If STVREN is cleared, the STKFUL bit will be set on the
31st push and the Stack Pointer will increment to 31.
Any additional pushes will not overwrite the 31st push
and STKPTR will remain at 31.
5.1.2.2
Return Stack Pointer (STKPTR)
The STKPTR register (Register 5-1) contains the Stack
Pointer value, the STKFUL (stack full) Status bit and
the STKUNF (Stack Underflow) Status bits. The value
of the Stack Pointer can be 0 through 31. The Stack
Pointer increments before values are pushed onto the
stack and decrements after values are popped off the
stack. On Reset, the Stack Pointer value will be zero.
The user may read and write the Stack Pointer value.
This feature can be used by a Real-Time Operating
System (RTOS) for return stack maintenance.
When the stack has been popped enough times to
unload the stack, the next pop will return a value of zero
to the PC and sets the STKUNF bit, while the Stack
Pointer remains at zero. The STKUNF bit will remain
set until cleared by software or until a POR occurs.
Note:
Returning a value of zero to the PC on an
underflow has the effect of vectoring the
program to the Reset vector, where the
stack conditions can be verified and
appropriate actions can be taken. This is
not the same as a Reset, as the contents
of the SFRs are not affected.
After the PC is pushed onto the stack 31 times (without
popping any values off the stack), the STKFUL bit is
set. The STKFUL bit is cleared by software or by a
POR.
The action that takes place when the stack becomes
full depends on the state of the STVREN (Stack Over-
flow Reset Enable) Configuration bit. (Refer to
Section 24.1 “Configuration Bits” for a description of
the device Configuration bits.) If STVREN is set
(default), the 31st push will push the (PC + 2) value
onto the stack, set the STKFUL bit and reset the
device. The STKFUL bit will remain set and the Stack
Pointer will be set to zero.
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 71
PIC18(L)F2X/4XK22
The PUSHinstruction places the current PC value onto
the stack. This increments the Stack Pointer and loads
the current PC value onto the stack.
5.1.2.3
PUSHand POPInstructions
Since the Top-of-Stack is readable and writable, the
ability to push values onto the stack and pull values off
the stack without disturbing normal program execution
is a desirable feature. The PIC18 instruction set
includes two instructions, PUSH and POP, that permit
the TOS to be manipulated under software control.
TOSU, TOSH and TOSL can be modified to place data
or a return address on the stack.
The POPinstruction discards the current TOS by decre-
menting the Stack Pointer. The previous value pushed
onto the stack then becomes the TOS value.
REGISTER 5-1:
STKPTR: STACK POINTER REGISTER
R/C-0
STKFUL(1)
R/C-0
STKUNF(1)
U-0
—
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
bit 0
STKPTR<4:0>
bit 7
Legend:
R = Readable bit
W = Writable bit
‘1’ = Bit is set
U = Unimplemented
‘0’ = Bit is cleared
C = Clearable only bit
x = Bit is unknown
-n = Value at POR
bit 7
bit 6
STKFUL: Stack Full Flag bit(1)
1= Stack became full or overflowed
0= Stack has not become full or overflowed
STKUNF: Stack Underflow Flag bit(1)
1= Stack Underflow occurred
0= Stack Underflow did not occur
bit 5
Unimplemented: Read as ‘0’
bit 4-0
STKPTR<4:0>: Stack Pointer Location bits
Note 1: Bit 7 and bit 6 are cleared by user software or by a POR.
while servicing a low priority interrupt, the stack register
values stored by the low priority interrupt will be
overwritten. In these cases, users must save the key
registers by software during a low priority interrupt.
5.1.2.4
Stack Full and Underflow Resets
Device Resets on Stack Overflow and Stack Underflow
conditions are enabled by setting the STVREN bit in
Configuration Register 4L. When STVREN is set, a full
or underflow will set the appropriate STKFUL or
STKUNF bit and then cause a device Reset. When
STVREN is cleared, a full or underflow condition will set
the appropriate STKFUL or STKUNF bit but not cause
a device Reset. The STKFUL or STKUNF bits are
cleared by the user software or a Power-on Reset.
If interrupt priority is not used, all interrupts may use the
fast register stack for returns from interrupt. If no
interrupts are used, the fast register stack can be used
to restore the Status, WREG and BSR registers at the
end of a subroutine call. To use the fast register stack
for a subroutine call, a CALLlabel, FASTinstruction
must be executed to save the Status, WREG and BSR
registers to the fast register stack. A RETURN, FAST
instruction is then executed to restore these registers
from the fast register stack.
5.1.3
FAST REGISTER STACK
A fast register stack is provided for the Status, WREG
and BSR registers, to provide a “fast return” option for
interrupts. The stack for each register is only one level
deep and is neither readable nor writable. It is loaded
with the current value of the corresponding register
when the processor vectors for an interrupt. All inter-
rupt sources will push values into the stack registers.
The values in the registers are then loaded back into
their associated registers if the RETFIE, FAST
instruction is used to return from the interrupt.
Example 5-1 shows a source code example that uses
the fast register stack during a subroutine call and
return.
If both low and high priority interrupts are enabled, the
stack registers cannot be used reliably to return from
low priority interrupts. If a high priority interrupt occurs
DS41412A-page 72
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
EXAMPLE 5-1:
FAST REGISTER STACK
CODE EXAMPLE
;STATUS, WREG, BSR
;SAVED IN FAST REGISTER
;STACK
5.1.4.2
Table Reads and Table Writes
A better method of storing data in program memory
allows two bytes of data to be stored in each instruction
location.
CALL SUB1, FAST
Look-up table data may be stored two bytes per
program word by using table reads and writes. The
Table Pointer (TBLPTR) register specifies the byte
address and the Table Latch (TABLAT) register
contains the data that is read from or written to program
memory. Data is transferred to or from program
memory one byte at a time.
SUB1
RETURN, FAST
;RESTORE VALUES SAVED
;IN FAST REGISTER STACK
Table read and table write operations are discussed
further in Section 6.1 “Table Reads and Table
Writes”.
5.1.4
LOOK-UP TABLES IN PROGRAM
MEMORY
There may be programming situations that require the
creation of data structures, or look-up tables, in
program memory. For PIC18 devices, look-up tables
can be implemented in two ways:
• Computed GOTO
• Table Reads
5.1.4.1
Computed GOTO
A computed GOTOis accomplished by adding an offset
to the program counter. An example is shown in
Example 5-2.
A look-up table can be formed with an ADDWF PCL
instruction and a group of RETLW nninstructions. The
W register is loaded with an offset into the table before
executing a call to that table. The first instruction of the
called routine is the ADDWF PCLinstruction. The next
instruction executed will be one of the RETLW nn
instructions that returns the value ‘nn’ to the calling
function.
The offset value (in WREG) specifies the number of
bytes that the program counter should advance and
should be multiples of 2 (LSb = 0).
In this method, only one data byte may be stored in
each instruction location and room on the return
address stack is required.
EXAMPLE 5-2:
COMPUTED GOTO USING
AN OFFSET VALUE
MOVF
CALL
OFFSET, W
TABLE
ORG
TABLE
nn00h
ADDWF
RETLW
RETLW
RETLW
.
PCL
nnh
nnh
nnh
.
.
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 73
PIC18(L)F2X/4XK22
5.2.2
INSTRUCTION FLOW/PIPELINING
5.2
PIC18 Instruction Cycle
An “Instruction Cycle” consists of four Q cycles: Q1
through Q4. The instruction fetch and execute are
pipelined in such a manner that a fetch takes one
instruction cycle, while the decode and execute take
another instruction cycle. However, due to the
pipelining, each instruction effectively executes in one
cycle. If an instruction causes the program counter to
change (e.g., GOTO), then two cycles are required to
complete the instruction (Example 5-3).
5.2.1
CLOCKING SCHEME
The microcontroller clock input, whether from an
internal or external source, is internally divided by four
to generate four non-overlapping quadrature clocks
(Q1, Q2, Q3 and Q4). Internally, the program counter is
incremented on every Q1; the instruction is fetched
from the program memory and latched into the
instruction register during Q4. The instruction is
decoded and executed during the following Q1 through
Q4. The clocks and instruction execution flow are
shown in Figure 5-3.
A fetch cycle begins with the Program Counter (PC)
incrementing in Q1.
In the execution cycle, the fetched instruction is latched
into the Instruction Register (IR) in cycle Q1. This
instruction is then decoded and executed during the
Q2, Q3 and Q4 cycles. Data memory is read during Q2
(operand read) and written during Q4 (destination
write).
FIGURE 5-3:
CLOCK/INSTRUCTION CYCLE
Q2
Q3
Q4
Q2
Q3
Q4
Q2
Q3
Q4
Q1
Q1
Q1
OSC1
Q1
Q2
Q3
Q4
Internal
Phase
Clock
PC
PC
PC + 2
PC + 4
OSC2/CLKOUT
(RC mode)
Execute INST (PC – 2)
Fetch INST (PC)
Execute INST (PC)
Fetch INST (PC + 2)
Execute INST (PC + 2)
Fetch INST (PC + 4)
EXAMPLE 5-3:
INSTRUCTION PIPELINE FLOW
TCY0
TCY1
TCY2
TCY3
TCY4
TCY5
1. MOVLW 55h
2. MOVWF PORTB
3. BRA SUB_1
Fetch 1
Execute 1
Fetch 2
Execute 2
Fetch 3
Execute 3
Fetch 4
4. BSF
PORTA, BIT3 (Forced NOP)
Flush (NOP)
5. Instruction @ address SUB_1
Fetch SUB_1 Execute SUB_1
All instructions are single cycle, except for any program branches. These take two cycles since the fetch instruction
is “flushed” from the pipeline while the new instruction is being fetched and then executed.
DS41412A-page 74
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
The CALL and GOTO instructions have the absolute
program memory address embedded into the
instruction. Since instructions are always stored on word
boundaries, the data contained in the instruction is a
word address. The word address is written to PC<20:1>,
which accesses the desired byte address in program
memory. Instruction #2 in Figure 5-4 shows how the
instruction GOTO 0006h is encoded in the program
memory. Program branch instructions, which encode a
relative address offset, operate in the same manner. The
offset value stored in a branch instruction represents the
number of single-word instructions that the PC will be
offset by. Section 25.0 “Instruction Set Summary”
provides further details of the instruction set.
5.2.3
INSTRUCTIONS IN PROGRAM
MEMORY
The program memory is addressed in bytes.
Instructions are stored as either two bytes or four bytes
in program memory. The Least Significant Byte of an
instruction word is always stored in a program memory
location with an even address (LSb = 0). To maintain
alignment with instruction boundaries, the PC
increments in steps of 2 and the LSb will always read
‘0’ (see Section 5.1.1 “Program Counter”).
Figure 5-4 shows an example of how instruction words
are stored in the program memory.
FIGURE 5-4:
INSTRUCTIONS IN PROGRAM MEMORY
Word Address
LSB = 1
LSB = 0
Program Memory
Byte Locations
000000h
000002h
000004h
000006h
000008h
00000Ah
00000Ch
00000Eh
000010h
000012h
000014h
Instruction 1:
Instruction 2:
MOVLW
GOTO
055h
0006h
0Fh
EFh
F0h
C1h
F4h
55h
03h
00h
23h
56h
Instruction 3:
MOVFF
123h, 456h
and used by the instruction sequence. If the first word
is skipped for some reason and the second word is
executed by itself, a NOP is executed instead. This is
necessary for cases when the two-word instruction is
preceded by a conditional instruction that changes the
PC. Example 5-4 shows how this works.
5.2.4
TWO-WORD INSTRUCTIONS
The standard PIC18 instruction set has four two-word
instructions: CALL, MOVFF, GOTO and LSFR. In all
cases, the second word of the instruction always has
‘1111’ as its four Most Significant bits; the other 12 bits
are literal data, usually a data memory address.
Note:
See Section 5.6 “PIC18 Instruction
Execution and the Extended Instruc-
tion Set” for information on two-word
instructions in the extended instruction set.
The use of ‘1111’ in the 4 MSbs of an instruction
specifies a special form of NOP. If the instruction is
executed in proper sequence – immediately after the
first word – the data in the second word is accessed
EXAMPLE 5-4:
CASE 1:
TWO-WORD INSTRUCTIONS
Source Code
Object Code
0110 0110 0000 0000 TSTFSZ
REG1
REG1, REG2 ; No, skip this word
; Execute this word as a NOP
; continue code
; is RAM location 0?
1100 0001 0010 0011
1111 0100 0101 0110
0010 0100 0000 0000
CASE 2:
MOVFF
ADDWF
REG3
Object Code
Source Code
TSTFSZ
0110 0110 0000 0000
1100 0001 0010 0011
1111 0100 0101 0110
0010 0100 0000 0000
REG1
; is RAM location 0?
MOVFF
REG1, REG2 ; Yes, execute this word
; 2nd word of instruction
ADDWF
REG3
; continue code
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 75
PIC18(L)F2X/4XK22
5.3.1
BANK SELECT REGISTER (BSR)
5.3
Data Memory Organization
Large areas of data memory require an efficient
addressing scheme to make rapid access to any
address possible. Ideally, this means that an entire
address does not need to be provided for each read or
write operation. For PIC18 devices, this is accom-
plished with a RAM banking scheme. This divides the
memory space into 16 contiguous banks of 256 bytes.
Depending on the instruction, each location can be
addressed directly by its full 12-bit address, or an 8-bit
low-order address and a 4-bit Bank Pointer.
Note:
The operation of some aspects of data
memory are changed when the PIC18
extended instruction set is enabled. See
Section 5.5 “Data Memory and the
Extended Instruction Set” for more
information.
The data memory in PIC18 devices is implemented as
static RAM. Each register in the data memory has a
12-bit address, allowing up to 4096 bytes of data
memory. The memory space is divided into as many as
16 banks that contain 256 bytes each. Figures 5-5
through 5-7 show the data memory organization for the
PIC18(L)F2X/4XK22 devices.
Most instructions in the PIC18 instruction set make use
of the Bank Pointer, known as the Bank Select Register
(BSR). This SFR holds the 4 Most Significant bits of a
location’s address; the instruction itself includes the
8 Least Significant bits. Only the four lower bits of the
BSR are implemented (BSR<3:0>). The upper four bits
are unused; they will always read ‘0’ and cannot be
written to. The BSR can be loaded directly by using the
MOVLBinstruction.
The data memory contains Special Function Registers
(SFRs) and General Purpose Registers (GPRs). The
SFRs are used for control and status of the controller
and peripheral functions, while GPRs are used for data
storage and scratchpad operations in the user’s
application. Any read of an unimplemented location will
read as ‘0’s.
The value of the BSR indicates the bank in data
memory; the 8 bits in the instruction show the location
in the bank and can be thought of as an offset from the
bank’s lower boundary. The relationship between the
BSR’s value and the bank division in data memory is
shown in Figures 5-5 through 5-7.
The instruction set and architecture allow operations
across all banks. The entire data memory may be
accessed by Direct, Indirect or Indexed Addressing
modes. Addressing modes are discussed later in this
subsection.
Since up to 16 registers may share the same low-order
address, the user must always be careful to ensure that
the proper bank is selected before performing a data
read or write. For example, writing what should be
program data to an 8-bit address of F9h while the BSR
is 0Fh will end up resetting the program counter.
To ensure that commonly used registers (SFRs and
select GPRs) can be accessed in a single cycle, PIC18
devices implement an Access Bank. This is a 256-byte
memory space that provides fast access to SFRs and
the lower portion of GPR Bank 0 without using the Bank
Select Register (BSR). Section 5.3.2 “Access Bank”
provides a detailed description of the Access RAM.
While any bank can be selected, only those banks that
are actually implemented can be read or written to.
Writes to unimplemented banks are ignored, while
reads from unimplemented banks will return ‘0’s. Even
so, the STATUS register will still be affected as if the
operation was successful. The data memory maps in
Figures 5-5 through 5-7 indicate which banks are
implemented.
In the core PIC18 instruction set, only the MOVFF
instruction fully specifies the 12-bit address of the
source and target registers. This instruction ignores the
BSR completely when it executes. All other instructions
include only the low-order address as an operand and
must use either the BSR or the Access Bank to locate
their target registers.
DS41412A-page 76
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
FIGURE 5-5:
DATA MEMORY MAP FOR PIC18(L)F23K22 AND PIC18(L)F43K22 DEVICES
When ‘a’ = 0:
BSR<3:0>
Data Memory Map
The BSR is ignored and the
Access Bank is used.
000h
05Fh
060h
0FFh
100h
00h
Access RAM
GPR
= 0000
= 0001
= 0010
The first 96 bytes are
general purpose RAM
(from Bank 0).
Bank 0
FFh
00h
The second 160 bytes are
Special Function Registers
(from Bank 15).
GPR
Bank 1
Bank 2
1FFh
200h
FFh
00h
FFh
00h
2FFh
300h
When ‘a’ = 1:
= 0011
The BSR specifies the Bank
used by the instruction.
Bank 3
Bank 4
Bank 5
Bank 6
Bank 7
Bank 8
Bank 9
Bank 10
Bank 11
Bank 12
Bank 13
3FFh
400h
FFh
00h
= 0100
= 0101
4FFh
500h
FFh
00h
5FFh
600h
FFh
00h
= 0110
= 0111
Access Bank
FFh
00h
6FFh
700h
00h
Access RAM Low
5Fh
Access RAM High
60h
FFh
00h
7FFh
800h
(SFRs)
= 1000
= 1001
FFh
8FFh
900h
FFh
00h
Unused
Read 00h
9FFh
A00h
FFh
00h
= 1010
= 1011
= 1100
= 1101
AFFh
B00h
FFh
00h
BFFh
C00h
FFh
00h
CFFh
D00h
FFh
00h
DFFh
E00h
FFh
00h
= 1110
= 1111
Bank 14
Bank 15
EFFh
F00h
F37h
F38h
F5Fh
FFh
00h
Unused
SFR(1)
Note 1: Addresses F38h through F5Fh are
also used by SFRs, but are not
part of the Access RAM. Users
must always use the complete
address or load the proper BSR
value to access these registers.
F60h
SFR
FFh
FFFh
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 77
PIC18(L)F2X/4XK22
FIGURE 5-6:
DATA MEMORY MAP FOR PIC18(L)F24K22 AND PIC18(L)F44K22 DEVICES
When ‘a’ = 0:
The BSR is ignored and the
BSR<3:0>
Data Memory Map
Access Bank is used.
000h
05Fh
060h
0FFh
100h
00h
Access RAM
GPR
= 0000
= 0001
= 0010
The first 96 bytes are
general purpose RAM
(from Bank 0).
Bank 0
FFh
00h
The second 160 bytes are
Special Function Registers
(from Bank 15).
GPR
GPR
Bank 1
Bank 2
1FFh
200h
FFh
00h
FFh
00h
2FFh
300h
When ‘a’ = 1:
= 0011
The BSR specifies the Bank
used by the instruction.
Bank 3
Bank 4
Bank 5
Bank 6
Bank 7
Bank 8
Bank 9
Bank 10
Bank 11
Bank 12
Bank 13
3FFh
400h
FFh
00h
= 0100
= 0101
4FFh
500h
FFh
00h
5FFh
600h
FFh
00h
= 0110
= 0111
Access Bank
FFh
00h
6FFh
700h
00h
Access RAM Low
5Fh
Access RAM High
60h
FFh
00h
7FFh
800h
(SFRs)
= 1000
= 1001
FFh
8FFh
900h
FFh
00h
Unused
Read 00h
9FFh
A00h
FFh
00h
= 1010
= 1011
= 1100
= 1101
AFFh
B00h
FFh
00h
BFFh
C00h
FFh
00h
CFFh
D00h
FFh
00h
DFFh
E00h
FFh
00h
= 1110
= 1111
Bank 14
Bank 15
EFFh
F00h
F37h
F38h
F5Fh
FFh
00h
Unused
SFR(1)
Note 1: Addresses F38h through F5Fh are
also used by SFRs, but are not
part of the Access RAM. Users
must always use the complete
address or load the proper BSR
value to access these registers.
F60h
SFR
FFh
FFFh
DS41412A-page 78
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
FIGURE 5-7:
DATA MEMORY MAP FOR PIC18(L)F25K22 AND PIC18(L)F45K22 DEVICES
When ‘a’ = 0:
BSR<3:0>
Data Memory Map
The BSR is ignored and the
Access Bank is used.
000h
05Fh
060h
0FFh
100h
00h
Access RAM
GPR
= 0000
= 0001
= 0010
The first 96 bytes are
general purpose RAM
(from Bank 0).
Bank 0
FFh
00h
The second 160 bytes are
Special Function Registers
(from Bank 15).
GPR
GPR
GPR
GPR
GPR
Bank 1
Bank 2
1FFh
200h
FFh
00h
FFh
00h
2FFh
300h
When ‘a’ = 1:
= 0011
The BSR specifies the Bank
used by the instruction.
Bank 3
Bank 4
Bank 5
Bank 6
Bank 7
Bank 8
Bank 9
Bank 10
Bank 11
Bank 12
Bank 13
3FFh
400h
FFh
00h
= 0100
= 0101
4FFh
500h
FFh
00h
5FFh
600h
FFh
00h
= 0110
= 0111
Access Bank
FFh
00h
6FFh
700h
00h
Access RAM Low
5Fh
Access RAM High
60h
FFh
00h
7FFh
800h
(SFRs)
= 1000
= 1001
FFh
8FFh
900h
FFh
00h
9FFh
A00h
FFh
00h
Unused
Read 00h
= 1010
= 1011
= 1100
= 1101
AFFh
B00h
FFh
00h
BFFh
C00h
FFh
00h
CFFh
D00h
FFh
00h
DFFh
E00h
FFh
00h
= 1110
= 1111
Bank 14
Bank 15
EFFh
F00h
F37h
F38h
F5Fh
F60h
FFh
00h
Unused
SFR(1)
Note 1: Addresses F38h through F5Fh are
also used by SFRs, but are not
part of the Access RAM. Users
must always use the complete
address or load the proper BSR
value to access these registers.
SFR
FFFh
FFh
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 79
PIC18(L)F2X/4XK22
FIGURE 5-8:
DATA MEMORY MAP FOR PIC18(L)F26K22 AND PIC18(L)F46K22 DEVICES
When ‘a’ = 0:
The BSR is ignored and the
BSR<3:0>
Data Memory Map
Access Bank is used.
000h
05Fh
060h
0FFh
100h
00h
Access RAM
GPR
= 0000
= 0001
= 0010
The first 96 bytes are
general purpose RAM
(from Bank 0).
Bank 0
FFh
00h
The second 160 bytes are
Special Function Registers
(from Bank 15).
GPR
GPR
GPR
GPR
Bank 1
Bank 2
1FFh
200h
FFh
00h
FFh
00h
2FFh
300h
When ‘a’ = 1:
= 0011
The BSR specifies the Bank
used by the instruction.
Bank 3
Bank 4
Bank 5
Bank 6
Bank 7
Bank 8
Bank 9
Bank 10
Bank 11
Bank 12
Bank 13
3FFh
400h
FFh
00h
= 0100
= 0101
4FFh
500h
FFh
00h
GPR
GPR
GPR
GPR
GPR
5FFh
600h
FFh
00h
= 0110
= 0111
Access Bank
FFh
00h
6FFh
700h
00h
Access RAM Low
5Fh
Access RAM High
60h
FFh
00h
7FFh
800h
(SFRs)
= 1000
= 1001
FFh
8FFh
900h
FFh
00h
9FFh
A00h
FFh
00h
= 1010
= 1011
= 1100
= 1101
GPR
GPR
GPR
GPR
GPR
AFFh
B00h
FFh
00h
BFFh
C00h
FFh
00h
CFFh
D00h
FFh
00h
DFFh
E00h
FFh
00h
= 1110
= 1111
Bank 14
Bank 15
FFh
00h
F00h
F37h
F38h
F5Fh
F60h
GPR
SFR(1)
Note 1: Addresses F38h through F5Fh are
also used by SFRs, but are not
part of the Access RAM. Users
must always use the complete
address or load the proper BSR
value to access these registers.
SFR
FFFh
FFh
DS41412A-page 80
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
FIGURE 5-9:
USE OF THE BANK SELECT REGISTER (DIRECT ADDRESSING)
Memory
Data
(2)
(1)
From Opcode
BSR
000h
100h
7
0
7
0
00h
Bank 0
1
1
1
1
1
1
1
1
0
0
0
0
0
0
1
1
FFh
00h
Bank 1
Bank 2
(2)
Bank Select
FFh
00h
200h
300h
FFh
00h
Bank 3
through
Bank 13
FFh
00h
E00h
Bank 14
Bank 15
FFh
00h
F00h
FFFh
FFh
Note 1: The Access RAM bit of the instruction can be used to force an override of the selected bank (BSR<3:0>) to
the registers of the Access Bank.
2: The MOVFF instruction embeds the entire 12-bit address in the instruction.
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 81
PIC18(L)F2X/4XK22
5.3.2
ACCESS BANK
5.3.3
GENERAL PURPOSE REGISTER
FILE
While the use of the BSR with an embedded 8-bit
address allows users to address the entire range of
data memory, it also means that the user must always
ensure that the correct bank is selected. Otherwise,
data may be read from or written to the wrong location.
This can be disastrous if a GPR is the intended target
of an operation, but an SFR is written to instead.
Verifying and/or changing the BSR for each read or
write to data memory can become very inefficient.
PIC18 devices may have banked memory in the GPR
area. This is data RAM, which is available for use by all
instructions. GPRs start at the bottom of Bank 0
(address 000h) and grow upwards towards the bottom of
the SFR area. GPRs are not initialized by a Power-on
Reset and are unchanged on all other Resets.
5.3.4
SPECIAL FUNCTION REGISTERS
The Special Function Registers (SFRs) are registers
used by the CPU and peripheral modules for controlling
the desired operation of the device. These registers are
implemented as static RAM. SFRs start at the top of
data memory (FFFh) and extend downward to occupy
the top portion of Bank 15 (F38h to FFFh). A list of
these registers is given in Table 5-1 and Table 5-2.
To streamline access for the most commonly used data
memory locations, the data memory is configured with
an Access Bank, which allows users to access a
mapped block of memory without specifying a BSR.
The Access Bank consists of the first 96 bytes of mem-
ory (00h-5Fh) in Bank 0 and the last 160 bytes of mem-
ory (60h-FFh) in Block 15. The lower half is known as
the “Access RAM” and is composed of GPRs. This
upper half is also where the device’s SFRs are
mapped. These two areas are mapped contiguously in
the Access Bank and can be addressed in a linear
fashion by an 8-bit address (Figures 5-5 through 5-7).
The SFRs can be classified into two sets: those
associated with the “core” device functionality (ALU,
Resets and interrupts) and those related to the
peripheral functions. The Reset and interrupt registers
are described in their respective chapters, while the
ALU’s STATUS register is described later in this
section. Registers related to the operation of a
peripheral feature are described in the chapter for that
peripheral.
The Access Bank is used by core PIC18 instructions
that include the Access RAM bit (the ‘a’ parameter in
the instruction). When ‘a’ is equal to ‘1’, the instruction
uses the BSR and the 8-bit address included in the
opcode for the data memory address. When ‘a’ is ‘0’,
however, the instruction is forced to use the Access
Bank address map; the current value of the BSR is
ignored entirely.
The SFRs are typically distributed among the
peripherals whose functions they control. Unused SFR
locations are unimplemented and read as ‘0’s.
Using this “forced” addressing allows the instruction to
operate on a data address in a single cycle, without
updating the BSR first. For 8-bit addresses of 60h and
above, this means that users can evaluate and operate
on SFRs more efficiently. The Access RAM below 60h
is a good place for data values that the user might need
to access rapidly, such as immediate computational
results or common program variables. Access RAM
also allows for faster and more code efficient context
saving and switching of variables.
The mapping of the Access Bank is slightly different
when the extended instruction set is enabled (XINST
Configuration bit = 1). This is discussed in more detail
in Section 5.5.3 “Mapping the Access Bank in
Indexed Literal Offset Mode”.
DS41412A-page 82
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
TABLE 5-1:
SPECIAL FUNCTION REGISTER MAP FOR PIC18(L)F2X/4XK22 DEVICES
Address
Name
Address
Name
Address
Name
Address
Name
Address
Name
(2)
FFFh
FFEh
FFDh
TOSU
TOSH
TOSL
FD7h
FD6h
FD5h
FD4h
TMR0H
TMR0L
T0CON
FAFh
SPBRG1
F87h
F86h
F85h
F84h
F83h
F82h
F81h
F80h
F7Fh
F7Eh
F7Dh
F7Ch
F7Bh
F7Ah
F79h
F78h
F77h
F76h
F75h
F74h
F73h
F72h
F71h
—
F5Fh
F5Eh
F5Dh
CCPR3H
CCPR3L
(2)
FAEh RCREG1
—
(2)
FADh
FACh
FABh
TXREG1
TXSTA1
RCSTA1
—
CCP3CON
(2)
FFCh
FFBh
FFAh
FF9h
FF8h
FF7h
FF6h
FF5h
FF4h
FF3h
FF2h
FF1h
FF0h
FEFh
STKPTR
PCLATU
PCLATH
PCL
—
PORTE
F5Ch PWM3CON
F5Bh ECCP3AS
F5Ah PSTR3CON
(3)
FD3h OSCCON
FD2h OSCCON2
FD1h WDTCON
PORTD
PORTC
PORTB
PORTA
IPR5
(4)
FAAh EEADRH
FA9h
FA8h
EEADR
EEDATA
F59h
F58h
F57h
F56h
F55h
F54h
F53h
F52h
F51h
F50h
F4Fh
F4Eh
F4Dh
F4Ch
F4Bh
F4Ah
CCPR4H
CCPR4L
CCP4CON
CCPR5H
CCPR5L
CCP5CON
TMR4
TBLPTRU
TBLPTRH
TBLPTRL
TABLAT
PRODH
PRODL
FD0h
FCFh
FCEh
FCDh
RCON
TMR1H
TMR1L
T1CON
(1)
FA7h EECON2
FA6h
FA5h
FA4h
FA3h
FA2h
FA1h
FA0h
F9Fh
F9Eh
F9Dh
EECON1
PIR5
IPR3
PIR3
PIE3
IPR2
PIR2
PIE2
IPR1
PIR1
PIE1
PIE5
FCCh T1GCON
FCBh SSP1CON3
FCAh SSP1MSK
FC9h SSP1BUF
FC8h SSP1ADD
FC7h SSP1STAT
FC6h SSP1CON1
FC5h SSP1CON2
FC4h ADRESH
IPR4
PIR4
INTCON
INTCON2
INTCON3
PIE4
PR4
CM1CON0
CM2CON0
CM2CON1
SPBRGH2
SPBRG2
RCREG2
TXREG2
TXSTA2
RCSTA2
T4CON
TMR5H
TMR5L
T5CON
T5GCON
TMR6
(1)
INDF0
(1)
(1)
FEEh POSTINC0
FEDh POSTDEC0
(1)
FECh PREINC0
F9Ch HLVDCON
(1)
FEBh PLUSW0
FC3h
ADRESL
F9Bh OSCTUNE
PR6
(2)
FEAh
FE9h
FE8h
FE7h
FSR0H
FSR0L
WREG
FC2h ADCON0
FC1h ADCON1
FC0h ADCON2
F9Ah
F99h
F98h
F97h
F96h
F95h
F94h
F93h
F92h
F91h
F90h
F8Fh
F8Eh
F8Dh
F8Ch
F8Bh
F8Ah
F89h
F88h
—
—
—
—
T6CON
(2)
(2)
(2)
F49h CCPTMRS0
F48h CCPTMRS1
F70h BAUDCON2
(1)
INDF1
FBFh
FBEh
CCPR1H
CCPR1L
F6Fh
F6Eh
F6Dh
SSP2BUF
SSP2ADD
SSP2STAT
F47h
F46h
SRCON0
SRCON1
(1)
(1)
FE6h POSTINC1
TRISE
(3)
FE5h POSTDEC1
FBDh CCP1CON
TRISD
TRISC
TRISB
TRISA
F45h CTMUCONH
F44h CTMUCONL
F43h CTMUICON
F42h VREFCON0
F41h VREFCON1
F40h VREFCON2
(1)
FE4h PREINC1
FBCh
FBBh
FBAh
TMR2
PR2
F6Ch SSP2CON1
F6Bh SSP2CON2
(1)
FE3h PLUSW1
FE2h
FE1h
FE0h
FDFh
FSR1H
FSR1L
BSR
T2CON
F6Ah
SSP2MSK
(2)
FB9h PSTR1CON
FB8h BAUDCON1
FB7h PWM1CON
—
F69h SSP2CON3
(2)
—
F68h
F67h
F66h
CCPR2H
CCPR2L
(1)
(2)
INDF2
—
F3Fh
F3Eh
F3Dh
F3Ch
F3Bh
F3Ah
F39h
F38h
PMD0
PMD1
(1)
(1)
(2)
FDEh POSTINC2
FB6h ECCP1AS
—
CCP2CON
(2)
(3)
FDDh POSTDEC2
FB5h
—
LATE
F65h PWM2CON
F64h ECCP2AS
F63h PSTR2CON
PMD2
(1)
(3)
FDCh PREINC2
FB4h T3GCON
LATD
ANSELE
ANSELD
ANSELC
ANSELB
ANSELA
(1)
FDBh PLUSW2
FB3h
FB2h
FB1h
TMR3H
TMR3L
T3CON
LATC
LATB
LATA
FDAh
FD9h
FD8h
FSR2H
FSR2L
F62h
F61h
F60h
IOCB
WPUB
(2)
STATUS
FB0h SPBRGH1
—
SLRCON
Note 1: This is not a physical register.
2: Unimplemented registers are read as ‘0’.
3: PIC18(L)F4XK22 devices only.
4: PIC18(L)F26K22 and PIC18(L)F46K22 devices only.
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 83
PIC18(L)F2X/4XK22
TABLE 5-2:
REGISTER FILE SUMMARY FOR PIC18(L)F2X/4XK22 DEVICES
Value on
POR, BOR
Address
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
FFFh
FFEh
FFDh
FFCh
FFBh
FFAh
FF9h
FF8h
FF7h
FF6h
FF5h
FF4h
FF3h
FF2h
FF1h
FF0h
FEFh
FEEh
FEDh
FECh
FEBh
TOSU
—
—
—
Top-of-Stack, Upper Byte (TOS<20:16>)
---0 0000
0000 0000
0000 0000
00-0 0000
---0 0000
0000 0000
0000 0000
--00 0000
0000 0000
0000 0000
0000 0000
xxxx xxxx
xxxx xxxx
0000 000x
1111 -1-1
11-0 0-00
---- ----
TOSH
Top-of-Stack, High Byte (TOS<15:8>)
Top-of-Stack, Low Byte (TOS<7:0>)
TOSL
STKPTR
PCLATU
PCLATH
PCL
STKFUL
—
STKUNF
—
—
—
STKPTR<4:0>
Holding Register for PC<20:16>
Holding Register for PC<15:8>
Holding Register for PC<7:0>
TBLPTRU
TBLPTRH
TBLPTRL
TABLAT
PRODH
PRODL
—
—
Program Memory Table Pointer Upper Byte(TBLPTR<21:16>)
Program Memory Table Pointer High Byte(TBLPTR<15:8>)
Program Memory Table Pointer Low Byte(TBLPTR<7:0>)
Program Memory Table Latch
Product Register, High Byte
Product Register, Low Byte
INTCON
INTCON2
INTCON3
INDF0
GIE/GIEH
RBPU
PEIE/GIEL
INTEDG0
INT1IP
TMR0IE
INTEDG1
—
INT0IE
INTEDG2
INT2IE
RBIE
—
TMR0IF
TMR0IP
—
INT0IF
—
RBIF
RBIP
INT2IP
INT1IE
INT2IF
INT1IF
Uses contents of FSR0 to address data memory – value of FSR0 not changed (not a physical register)
POSTINC0
POSTDEC0
PREINC0
PLUSW0
Uses contents of FSR0 to address data memory – value of FSR0 post-incremented (not a physical register) ---- ----
Uses contents of FSR0 to address data memory – value of FSR0 post-decremented (not a physical register) ---- ----
Uses contents of FSR0 to address data memory – value of FSR0 pre-incremented (not a physical register)
---- ----
---- ----
Uses contents of FSR0 to address data memory – value of FSR0 pre-incremented (not a physical register) –
value of FSR0 offset by W
FEAh
FE9h
FE8h
FE7h
FE6h
FE5h
FE4h
FE3h
FSR0H
—
—
—
—
Indirect Data Memory Address Pointer 0, High Byte
---- 0000
xxxx xxxx
xxxx xxxx
---- ----
FSR0L
Indirect Data Memory Address Pointer 0, Low Byte
Working Register
WREG
INDF1
Uses contents of FSR1 to address data memory – value of FSR1 not changed (not a physical register)
POSTINC1
POSTDEC1
PREINC1
PLUSW1
Uses contents of FSR1 to address data memory – value of FSR1 post-incremented (not a physical register) ---- ----
Uses contents of FSR1 to address data memory – value of FSR1 post-decremented (not a physical register) ---- ----
Uses contents of FSR1 to address data memory – value of FSR1 pre-incremented (not a physical register) ---- ----
Uses contents of FSR1 to address data memory – value of FSR1 pre-incremented (not a physical register) –
value of FSR1 offset by W
---- ----
FE2h
FE1h
FE0h
FDFh
FDEh
FDDh
FDCh
FDBh
FSR1H
—
—
—
—
Indirect Data Memory Address Pointer 1, High Byte
Indirect Data Memory Address Pointer 1, Low Byte
Bank Select Register
---- 0000
xxxx xxxx
---- 0000
---- ----
FSR1L
BSR
—
—
—
—
INDF2
Uses contents of FSR2 to address data memory – value of FSR2 not changed (not a physical register)
POSTINC2
POSTDEC2
PREINC2
PLUSW2
Uses contents of FSR2 to address data memory – value of FSR2 post-incremented (not a physical register) ---- ----
Uses contents of FSR2 to address data memory – value of FSR2 post-decremented (not a physical register) ---- ----
Uses contents of FSR2 to address data memory – value of FSR2 pre-incremented (not a physical register) ---- ----
Uses contents of FSR2 to address data memory – value of FSR2 pre-incremented (not a physical register) –
value of FSR2 offset by W
---- ----
FDAh
FD9h
FD8h
FD7h
FD6h
FD5h
FD3h
FD2h
Legend:
FSR2H
—
—
—
—
Indirect Data Memory Address Pointer 2, High Byte
---- 0000
xxxx xxxx
---x xxxx
0000 0000
xxxx xxxx
1111 1111
0011 q000
00-0 01x0
FSR2L
Indirect Data Memory Address Pointer 2, Low Byte
STATUS
TMR0H
TMR0L
—
—
—
N
OV
Z
DC
C
Timer0 Register, High Byte
Timer0 Register, Low Byte
T0CON
OSCCON
OSCCON2
TMR0ON
IDLEN
T08BIT
T0CS
IRCF<2:0>
—
T0SE
PSA
OSTS
T0PS<2:0>
HFIOFS
PRISD
SCS<1:0>
PLLRDY
SOSCRUN
MFIOSEL
SOSCGO
MFIOFS
LFIOFS
x= unknown, u= unchanged, — = unimplemented, q= value depends on condition
Note 1: PIC18(L)F4XK22 devices only.
2: PIC18(L)F2XK22 devices only.
3: PIC18(L)F23/24K22 and PIC18(L)F43/44K22 devices only.
4: PIC18(L)F26K22 and PIC18(L)F46K22 devices only.
DS41412A-page 84
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
TABLE 5-2:
REGISTER FILE SUMMARY FOR PIC18(L)F2X/4XK22 DEVICES
Value on
POR, BOR
Address
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
FD1h
FD0h
FCFh
FCEh
FCDh
FCCh
WDTCON
RCON
—
—
—
—
—
RI
—
—
—
SWDTEN
BOR
---- ---0
01-1 1100
xxxx xxxx
xxxx xxxx
0000 0000
0000 xx00
IPEN
SBOREN
TO
PD
POR
TMR1H
TMR1L
Timer1 Register, High Byte
Timer1 Register, Low Byte
T1CON
T1GCON
TMR1CS<1:0>
T1CKPS<1:0>
T1SOSCEN
T1SYNC
T1GVAL
T1RD16
TMR1ON
DHEN
TMR1GE
T1GPOL
T1GTM
T1GSPM
T1GGO/
DONE
T1GSS<1:0>
FCBh
FCAh
FC9h
FC8h
FC7h
FC6h
FC5h
FC4h
FC3h
FC2h
FC1h
FC0h
FBFh
FBEh
FBDh
FBCh
FBBh
FBAh
FB9h
FB8h
FB7h
FB6h
FB4h
SSP1CON3
SSP1MSK
SSP1BUF
SSP1ADD
SSP1STAT
SSP1CON1
SSP1CON2
ADRESH
ADRESL
ACKTIM
PCIE
SCIE
BOEN
SDAHT
SBCDE
AHEN
0000 0000
1111 1111
xxxx xxxx
0000 0000
0000 0000
0000 0000
0000 0000
xxxx xxxx
xxxx xxxx
--00 0000
0--- 0000
0-00 0000
xxxx xxxx
xxxx xxxx
0000 0000
0000 0000
1111 1111
-000 0000
---0 0001
0100 0-00
0000 0000
0000 0000
0000 0x00
SSP1 MASK Register bits
SSP1 Receive Buffer/Transmit Register
SSP1 Address Register in I2C Slave Mode. SSP1 Baud Rate Reload Register in I2C Master Mode
SMP
WCOL
GCEN
CKE
D/A
P
S
R/W
SSPM<3:0>
UA
BF
SSPOV
ACKSTAT
SSPEN
ACKDT
CKP
ACKEN
RCEN
PEN
RSEN
SEN
A/D Result, High Byte
A/D Result, Low Byte
CHS<4:0>
ADCON0
ADCON1
ADCON2
CCPR1H
CCPR1L
—
GO/DONE
ADON
TRIGSEL
ADFM
—
—
—
—
PVCFG<1:0>
NVCFG<1:0>
ACQT<2:0>
ADCS<2:0>
Capture/Compare/PWM Register 1, High Byte
Capture/Compare/PWM Register 1, Low Byte
CCP1CON
TMR2
P1M<1:0>
DC1B<1:0>
Timer2 Register
Timer2 Period Register
T2OUTPS<3:0>
CCP1M<3:0>
PR2
T2CON
—
TMR2ON
STR1C
—
T2CKPS<1:0>
PSTR1CON
BAUDCON1
PWM1CON
ECCP1AS
T3GCON
—
—
—
STR1SYNC
CKTXP
STR1D
BRG16
STR1B
WUE
STR1A
ABDEN
ABDOVF
P1RSEN
CCP1ASE
TMR3GE
RCIDL
DTRXP
P1DC<6:0>
CCP1AS<2:0>
T3GTM
P1SSAC<1:0>
P1SSBD<1:0>
T3GSS
T3GPOL
T3GSPM
T3GGO/
DONE
T3GVAL
FB3h
FB2h
FB1h
FB0h
FAFh
FAEh
FADh
FACh
FABh
FAAh
FA9h
FA8h
FA7h
FA6h
FA5h
FA4h
FA3h
Legend:
TMR3H
TMR3L
Timer3 Register, High Byte
Timer3 Register, Low Byte
xxxx xxxx
xxxx xxxx
0000 0000
0000 0000
0000 0000
0000 0000
0000 0000
0000 0010
0000 000x
---- --00
0000 0000
0000 0000
---- --00
xx-0 x000
T3CON
SPBRGH1
SPBRG1
RCREG1
TXREG1
TXSTA1
RCSTA1
EEADRH(5)
EEADR
EEDATA
EECON2
EECON1
IPR3
TMR3CS<1:0>
T3CKPS<1:0>
T3SOSCEN
T3SYNC
T3RD16
TMR3ON
EUSART1 Baud Rate Generator, High Byte
EUSART1 Baud Rate Generator, Low Byte
EUSART1 Receive Register
EUSART1 Transmit Register
CSRC
SPEN
—
TX9
RX9
—
TXEN
SREN
—
SYNC
CREN
—
SENDB
ADDEN
—
BRGH
FERR
—
TRMT
OERR
TX9D
RX9D
EEADR<9:8>
EEADR<7:0>
EEPROM Data Register
EEPROM Control Register 2 (not a physical register)
EEPGD
SSP2IP
SSP2IF
SSP2IE
CFGS
BCL2IP
BCL2IF
BCL2IE
—
FREE
TX2IP
TX2IF
TX2IE
WRERR
CTMUIP
CTMUIF
CTMUIE
WREN
WR
RD
RC2IP
RC2IF
RC2IE
TMR5GIP
TMR5GIF
TMR5GIE
TMR3GIP
TMR3GIF
TMR3GIE
TMR1GIP 0000 0000
TMR1GIF 0000 0000
TMR1GIE 0000 0000
PIR3
PIE3
x= unknown, u= unchanged, — = unimplemented, q= value depends on condition
Note 1: PIC18(L)F4XK22 devices only.
2: PIC18(L)F2XK22 devices only.
3: PIC18(L)F23/24K22 and PIC18(L)F43/44K22 devices only.
4: PIC18(L)F26K22 and PIC18(L)F46K22 devices only.
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 85
PIC18(L)F2X/4XK22
TABLE 5-2:
REGISTER FILE SUMMARY FOR PIC18(L)F2X/4XK22 DEVICES
Value on
POR, BOR
Address
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
FA2h
FA1h
FA0h
F9Fh
F9Eh
F9Dh
F9Ch
F9Bh
F96h
F95h
F94h
F93h
F92h
F8Dh
F8Ch
F8Bh
F8Ah
F89h
IPR2
OSCFIP
OSCFIF
OSCFIE
—
C1IP
C1IF
C1IE
ADIP
ADIF
ADIE
BGVST
PLLEN
—
C2IP
C2IF
EEIP
EEIF
BCL1IP
BCL1IF
BCL1IE
SSP1IP
SSP1IF
SSP1IE
HLVDIP
HLVDIF
HLVDIE
CCP1IP
CCP1IF
CCP1IE
TMR3IP
TMR3IF
TMR3IE
TMR2IP
TMR2IF
TMR2IE
CCP2IP
CCP2IF
CCP2IE
TMR1IP
TMR1IF
TMR1IE
1111 1111
0000 0000
0000 0000
-111 1111
-000 0000
-000 0000
0000 0000
00xx xxxx
PIR2
PIE2
C2IE
EEIE
IPR1
RC1IP
RC1IF
RC1IE
IRVST
TX1IP
TX1IF
TX1IE
HLVDEN
PIR1
—
PIE1
—
HLVDCON
OSCTUNE
TRISE
VDIRMAG
INTSRC
WPUE3
TRISD7
TRISC7
TRISB7
TRISA7
—
HLVDL<3:0>
TUN<5:0>
—
TRISD5
TRISC5
TRISB5
TRISA5
—
—
TRISD4
TRISC4
TRISB4
TRISA4
—
—
TRISD3
TRISC3
TRISB3
TRISA3
—
TRISE2(1)
TRISD2
TRISC2
TRISB2
TRISA2
LATE2
LATD2
LATC2
LATB2
LATA2
—
TRISE1(1)
TRISD1
TRISC1
TRISB1
TRISA1
LATE1
LATD1
LATC1
LATB1
LATA1
—
TRISE0(1) 1--- -111
TRISD(1)
TRISD6
TRISC6
TRISB6
TRISA6
—
TRISD0
TRISC0
TRISB0
TRISA0
LATE0
LATD0
LATC0
LATB0
LATA0
—
1111 1111
1111 1111
1111 1111
1111 1111
---- -xxx
xxxx xxxx
xxxx xxxx
xxxx xxxx
xxxx xxxx
---- x---
---- x000
0000 0000
0000 00xx
xxx0 0000
xx0x 0000
---- -111
---- -111
---- -000
---- -000
---- -000
---- -000
0000 1000
0000 1000
0000 0000
0000 0000
0000 0000
0000 0000
0000 0000
0000 0010
0000 000x
01x0 0-00
xxxx xxxx
0000 0000
0000 0000
0000 0000
0000 0000
1111 1111
0000 0000
TRISC
TRISB
TRISA
LATE(1)
LATD(1)
LATC
LATD7
LATC7
LATB7
LATA7
—
LATD6
LATC6
LATB6
LATA6
—
LATD5
LATC5
LATB5
LATA5
—
LATD4
LATC4
LATB4
LATA4
—
LATD3
LATC3
LATB3
LATA3
RE3
LATB
LATA
PORTE(2)
PORTE(1)
PORTD(1)
PORTC
PORTB
PORTA
IPR5
F84h
—
—
—
—
RE3
RE2
RE1
RE0
F83h
F82h
F81h
F80h
F7Fh
F7Eh
F7Dh
F7Ch
F7Bh
F7Ah
F79h
F78h
F77h
F76h
F75h
F74h
F73h
F72h
F71h
F70h
F6Fh
F6Eh
F6Dh
F6Ch
F6Bh
F6Ah
F69h
Legend:
RD7
RD6
RD5
RC5
RB5
RD4
RD3
RD2
RD1
RD0
RC7
RC6
RC4
RC3
RC2
RC1
RC0
RB7
RB6
RB4
RB3
RB2
RB1
RB0
RA7
RA6
RA5
RA4
RA3
RA2
RA1
RA0
—
—
—
—
—
TMR6IP
TMR6IF
TMR6IE
CCP5IP
CCP5IF
CCP5IE
C1R
TMR5IP
TMR5IF
TMR5IE
CCP4IP
CCP4IF
CCP4IE
TMR4IP
TMR4IF
TMR4IE
CCP3IP
CCP3IF
CCP3IE
PIR5
—
—
—
—
—
PIE5
—
—
—
—
—
IPR4
—
—
—
—
—
PIR4
—
—
—
—
—
PIE4
—
—
—
—
—
CM1CON0
CM2CON0
CM2CON1
SPBRGH2
SPBRG2
RCREG2
TXREG2
TXSTA2
RCSTA2
BAUDCON2
SSP2BUF
SSP2ADD
SSP2STAT
SSP2CON1
SSP2CON2
SSP2MSK
SSP2CON3
C1ON
C2ON
MC1OUT
C1OUT
C2OUT
MC2OUT
C1OE
C2OE
C1RSEL
C1POL
C2POL
C2RSEL
C1SP
C2SP
C1HYS
C1CH<1:0>
C2CH<1:0>
C2R
C2HYS
C1SYNC
C2SYNC
EUSART2 Baud Rate Generator, High Byte
EUSART2 Baud Rate Generator, Low Byte
EUSART2 Receive Register
EUSART2 Transmit Register
CSRC
SPEN
TX9
RX9
TXEN
SREN
SYNC
CREN
CKTXP
SENDB
ADDEN
BRG16
BRGH
FERR
—
TRMT
OERR
WUE
TX9D
RX9D
ABDOVF
RCIDL
DTRXP
ABDEN
SSP2 Receive Buffer/Transmit Register
SSP2 Address Register in I2C Slave Mode. SSP2 Baud Rate Reload Register in I2C Master Mode
SMP
WCOL
GCEN
CKE
D/A
P
S
R/W
SSPM<3:0>
UA
BF
SSPOV
ACKSTAT
SSPEN
ACKDT
CKP
ACKEN
RCEN
PEN
RSEN
SEN
SSP1 MASK Register bits
BOEN SDAHT
ACKTIM
PCIE
SCIE
SBCDE
AHEN
DHEN
x= unknown, u= unchanged, — = unimplemented, q= value depends on condition
Note 1: PIC18(L)F4XK22 devices only.
2: PIC18(L)F2XK22 devices only.
3: PIC18(L)F23/24K22 and PIC18(L)F43/44K22 devices only.
4: PIC18(L)F26K22 and PIC18(L)F46K22 devices only.
DS41412A-page 86
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
TABLE 5-2:
REGISTER FILE SUMMARY FOR PIC18(L)F2X/4XK22 DEVICES
Value on
POR, BOR
Address
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
F68h
F67h
F66h
F65h
F64h
F63h
F62h
F61h
CCPR2H
CCPR2L
CCP2CON
PWM2CON
ECCP2AS
PSTR2CON
IOCB
Capture/Compare/PWM Register 2, High Byte
Capture/Compare/PWM Register 2, Low Byte
DC2B<1:0>
xxxx xxxx
xxxx xxxx
0000 0000
0000 0000
0000 0000
---0 0001
1111 ----
1111 1111
---- -111
---1 1111
xxxx xxxx
xxxx xxxx
0000 0000
0000 0000
0000 0000
---0 0001
xxxx xxxx
xxxx xxxx
--00 0000
xxxx xxxx
xxxx xxxx
--00 0000
0000 0000
1111 1111
-000 0000
0000 0000
0000 0000
0000 0000
0000 0x00
P2M<1:0>
CCP2M<3:0>
P2RSEN
CCP2ASE
—
P2DC<6:0>
CCP2AS<2:0>
P2SSAC<1:0>
P2SSBD<1:0>
—
IOCB6
WPUB6
—
—
IOCB5
WPUB5
—
STR2SYNC
IOCB4
WPUB4
—
STR2D
STR2C
—
STR2B
—
STR2A
—
IOCB7
WPUB7
—
—
WPUB3
—
WPUB
WPUB2
SLRC
SLRC
WPUB1
SLRB
SLRB
WPUB0
SLRA
SLRA
SLRCON(2)
SLRCON(1)
CCPR3H
CCPR3L
CCP3CON
PWM3CON
ECCP3AS
PSTR3CON
CCPR4H
CCPR4L
CCP4CON
CCPR5H
CCPR5L
CCP5CON
TMR4
F60h
—
—
—
SLRE
SLRD
F5Fh
F5Eh
F5Dh
F5Ch
F5Bh
F5Ah
F59h
F58h
F57h
F56h
F55h
F54h
F53h
F52h
F51h
F50h
F4Fh
F4Eh
F4Dh
Capture/Compare/PWM Register 3, High Byte
Capture/Compare/PWM Register 3, Low Byte
P3M<1:0>
DC3B<1:0>
CCP3M<3:0>
P3RSEN
CCP3ASE
—
P3DC<6:0>
P3SSAC<1:0>
STR3D STR3C
CCP3AS<2:0>
P3SSBD<1:0>
—
—
—
—
STR3SYNC
STR3B
STR3A
Capture/Compare/PWM Register 4, High Byte
Capture/Compare/PWM Register 4, Low Byte
—
—
—
DC4B<1:0>
CCP4M<3:0>
Capture/Compare/PWM Register 5, High Byte
Capture/Compare/PWM Register 5, Low Byte
DC5B<1:0>
CCP5M<3:0>
Timer4 Register
Timer4 Period Register
T4OUTPS<3:0>
PR4
T4CON
TMR4ON
T4CKPS<1:0>
TMR5H
Timer5 Register, High Byte
Timer5 Register, Low Byte
TMR5L
T5CON
TMR5CS<1:0>
TMR5GE T5GPOL
T5CKPS<1:0>
T5GTM T5GSPM
T5SOSCEN
T5SYNC
T5GVAL
T5RD16
TMR5ON
T5GCON
T5GGO/
DONE
T5GSS
F4Ch
F4Bh
F4Ah
TMR6
Timer6 Register
0000 0000
1111 1111
-000 0000
00-0 0-00
---- 0000
0000 0000
0000 0000
0000 0000
PR6
Timer6 Period Register
T6CON
—
C3TSEL<1:0>
T6OUTPS<3:0>
TMR6ON
—
T6CKPS<1:0>
C1TSEL<1:0>
C4TSEL<1:0>
CCPTMRS0
CCPTMRS1
SRCON0
SRCON1
CTMUCONH
CTMUCONL
CTMUICON
VREFCON0
VREFCON1
VREFCON2
PMD0
—
C2TSEL<1:0>
F49h
F48h
F47h
F46h
F45h
F44h
F43h
F42h
F41h
F40h
F3Fh
F3Eh
F3Dh
F3Ch
F3Bh
Legend:
—
—
—
—
C5TSEL<1:0>
SRLEN
SRCLK<2:0>
SRSC2E
CTMUSIDL
SRQEN
SRRPE
EDGEN
SRNQEN
SRRCKE
SRPS
SRRC2E
SRPR
SRRC1E
CTTRIG
SRSPE
SRSCKE
—
SRSC1E
TGEN
CTMUEN
EDG2POL
EDGSEQEN IDISSEN
EDG2SEL<1:0>
EDG1POL
EDG1SEL<1:0>
EDG2STAT EDG1STAT 0000 0000
ITRIM<5:0>
FVRS<1:0>
IRNG<1:0>
0000 0000
0001 ----
000- 00-0
---0 0000
0000 0000
00-0 0000
---- 0000
---- -111
1111 1111
FVREN
DACEN
—
FVRST
DACLPS
—
—
—
—
—
—
DACOE
—
DACPSS<1:0>
DACNSS
—
TMR6MD
—
DACR<4:0>
TMR3MD
CCP3MD
CMP2MD
ANSE2
UART2MD UART1MD
MSSP2MD MSSP1MD
TMR5MD
CCP5MD
—
TMR4MD
CCP4MD
CTMUMD
—
TMR2MD
CCP2MD
CMP1MD
ANSE1
TMR1MD
CCP1MD
ADCMD
ANSE0
PMD1
PMD2
—
—
—
—
—
ANSELE(1)
ANSELD(1)
—
—
ANSD7
ANSD6
ANSD5
ANSD4
ANSD3
ANSD2
ANSD1
ANSD0
x= unknown, u= unchanged, — = unimplemented, q= value depends on condition
Note 1: PIC18(L)F4XK22 devices only.
2: PIC18(L)F2XK22 devices only.
3: PIC18(L)F23/24K22 and PIC18(L)F43/44K22 devices only.
4: PIC18(L)F26K22 and PIC18(L)F46K22 devices only.
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 87
PIC18(L)F2X/4XK22
TABLE 5-2:
REGISTER FILE SUMMARY FOR PIC18(L)F2X/4XK22 DEVICES
Value on
POR, BOR
Address
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
F3Ah
ANSELC
ANSELB
ANSELA
ANSC7
—
ANSC6
—
ANSC5
ANSB5
ANSA5
ANSC4
ANSB4
—
ANSC3
ANSB3
ANSA3
ANSC2
ANSB2
ANSA2
—
—
1111 11--
--11 1111
--1- 1111
F39h
ANSB1
ANSA1
ANSB0
ANSA0
F38h
—
—
Legend:
x= unknown, u= unchanged, — = unimplemented, q= value depends on condition
Note 1: PIC18(L)F4XK22 devices only.
2: PIC18(L)F2XK22 devices only.
3: PIC18(L)F23/24K22 and PIC18(L)F43/44K22 devices only.
4: PIC18(L)F26K22 and PIC18(L)F46K22 devices only.
DS41412A-page 88
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
It is recommended that only BCF, BSF, SWAPF, MOVFF
and MOVWFinstructions are used to alter the STATUS
register, because these instructions do not affect the Z,
C, DC, OV or N bits in the STATUS register.
5.3.5
STATUS REGISTER
The STATUS register, shown in Register 5-2, contains
the arithmetic status of the ALU. As with any other SFR,
it can be the operand for any instruction.
For other instructions that do not affect Status bits, see
the instruction set summaries in Table 25.2 and
Table 25-3.
If the STATUS register is the destination for an instruc-
tion that affects the Z, DC, C, OV or N bits, the results
of the instruction are not written; instead, the STATUS
register is updated according to the instruction per-
formed. Therefore, the result of an instruction with the
STATUS register as its destination may be different
than intended. As an example, CLRF STATUSwill set
the Z bit and leave the remaining Status bits
unchanged (‘000u u1uu’).
Note:
The C and DC bits operate as the borrow
and digit borrow bits, respectively, in
subtraction.
REGISTER 5-2:
STATUS: STATUS REGISTER
U-0
—
U-0
—
U-0
—
R/W-x
N
R/W-x
OV
R/W-x
Z
R/W-x
DC(1)
R/W-x
C(1)
bit 7
bit 0
Legend:
R = Readable bit
-n = Value at POR
W = Writable bit
‘1’ = Bit is set
U = Unimplemented bit, read as ‘0’
‘0’ = Bit is cleared x = Bit is unknown
bit 7-5
bit 4
Unimplemented: Read as ‘0’
N: Negative bit
This bit is used for signed arithmetic (two’s complement). It indicates whether the result was negative
(ALU MSB = 1).
1= Result was negative
0= Result was positive
bit 3
bit 2
OV: Overflow bit
This bit is used for signed arithmetic (two’s complement). It indicates an overflow of the 7-bit magni-
tude which causes the sign bit (bit 7 of the result) to change state.
1= Overflow occurred for signed arithmetic (in this arithmetic operation)
0= No overflow occurred
Z: Zero bit
1= The result of an arithmetic or logic operation is zero
0= The result of an arithmetic or logic operation is not zero
bit 1
bit 0
DC: Digit Carry/Borrow bit (ADDWF, ADDLW,SUBLW,SUBWFinstructions)(1)
1= A carry-out from the 4th low-order bit of the result occurred
0= No carry-out from the 4th low-order bit of the result
C: Carry/Borrow bit (ADDWF, ADDLW, SUBLW, SUBWF instructions)(1)
1= A carry-out from the Most Significant bit of the result occurred
0= No carry-out from the Most Significant bit of the result occurred
Note 1: For Borrow, the polarity is reversed. A subtraction is executed by adding the two’s complement of the
second operand. For rotate (RRF, RLF) instructions, this bit is loaded with either the high-order or low-order
bit of the source register.
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 89
PIC18(L)F2X/4XK22
The Access RAM bit ‘a’ determines how the address is
interpreted. When ‘a’ is ‘1’, the contents of the BSR
(Section 5.3.1 “Bank Select Register (BSR)”) are
used with the address to determine the complete 12-bit
address of the register. When ‘a’ is ‘0’, the address is
interpreted as being a register in the Access Bank.
Addressing that uses the Access RAM is sometimes
also known as Direct Forced Addressing mode.
5.4
Data Addressing Modes
Note:
The execution of some instructions in the
core PIC18 instruction set are changed
when the PIC18 extended instruction set is
enabled. See Section 5.5 “Data Memory
and the Extended Instruction Set” for
more information.
A few instructions, such as MOVFF, include the entire
12-bit address (either source or destination) in their
opcodes. In these cases, the BSR is ignored entirely.
While the program memory can be addressed in only
one way – through the program counter – information
in the data memory space can be addressed in several
ways. For most instructions, the addressing mode is
fixed. Other instructions may use up to three modes,
depending on which operands are used and whether or
not the extended instruction set is enabled.
The destination of the operation’s results is determined
by the destination bit ‘d’. When ‘d’ is ‘1’, the results are
stored back in the source register, overwriting its origi-
nal contents. When ‘d’ is ‘0’, the results are stored in
the W register. Instructions without the ‘d’ argument
have a destination that is implicit in the instruction; their
destination is either the target register being operated
on or the W register.
The addressing modes are:
• Inherent
• Literal
• Direct
5.4.3
INDIRECT ADDRESSING
• Indirect
Indirect addressing allows the user to access a location
in data memory without giving a fixed address in the
instruction. This is done by using File Select Registers
(FSRs) as pointers to the locations which are to be read
or written. Since the FSRs are themselves located in
RAM as Special File Registers, they can also be
directly manipulated under program control. This
makes FSRs very useful in implementing data struc-
tures, such as tables and arrays in data memory.
An additional addressing mode, Indexed Literal Offset,
is available when the extended instruction set is
enabled (XINST Configuration bit = 1). Its operation is
discussed in greater detail in Section 5.5.1 “Indexed
Addressing with Literal Offset”.
5.4.1
INHERENT AND LITERAL
ADDRESSING
Many PIC18 control instructions do not need any argu-
ment at all; they either perform an operation that glob-
ally affects the device or they operate implicitly on one
register. This addressing mode is known as Inherent
Addressing. Examples include SLEEP, RESETand DAW.
The registers for indirect addressing are also
implemented with Indirect File Operands (INDFs) that
permit automatic manipulation of the pointer value with
auto-incrementing, auto-decrementing or offsetting
with another value. This allows for efficient code, using
loops, such as the example of clearing an entire RAM
bank in Example 5-5.
Other instructions work in a similar way but require an
additional explicit argument in the opcode. This is
known as Literal Addressing mode because they
require some literal value as an argument. Examples
include ADDLWand MOVLW, which respectively, add or
move a literal value to the W register. Other examples
include CALL and GOTO, which include a 20-bit
program memory address.
EXAMPLE 5-5:
HOW TO CLEAR RAM
(BANK 1) USING
INDIRECT ADDRESSING
LFSR
FSR0, 100h ;
NEXT
CLRF
POSTINC0
; Clear INDF
; register then
; inc pointer
; All done with
; Bank1?
; NO, clear next
; YES, continue
5.4.2
DIRECT ADDRESSING
Direct addressing specifies all or part of the source
and/or destination address of the operation within the
opcode itself. The options are specified by the
arguments accompanying the instruction.
BTFSS
BRA
FSR0H, 1
NEXT
CONTINUE
In the core PIC18 instruction set, bit-oriented and byte-
oriented instructions use some version of direct
addressing by default. All of these instructions include
some 8-bit literal address as their Least Significant
Byte. This address specifies either a register address in
one of the banks of data RAM (Section 5.3.3 “General
Purpose Register File”) or a location in the Access
Bank (Section 5.3.2 “Access Bank”) as the data
source for the instruction.
DS41412A-page 90
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
5.4.3.1
FSR Registers and the INDF
Operand
5.4.3.2
FSR Registers and POSTINC,
POSTDEC, PREINC and PLUSW
At the core of indirect addressing are three sets of reg-
isters: FSR0, FSR1 and FSR2. Each represents a pair
of 8-bit registers, FSRnH and FSRnL. Each FSR pair
holds a 12-bit value, therefore, the four upper bits of the
FSRnH register are not used. The 12-bit FSR value can
address the entire range of the data memory in a linear
fashion. The FSR register pairs, then, serve as pointers
to data memory locations.
In addition to the INDF operand, each FSR register pair
also has four additional indirect operands. Like INDF,
these are “virtual” registers which cannot be directly
read or written. Accessing these registers actually
accesses the location to which the associated FSR
register pair points, and also performs a specific action
on the FSR value. They are:
• POSTDEC: accesses the location to which the
FSR points, then automatically decrements the
FSR by 1 afterwards
Indirect addressing is accomplished with a set of
Indirect File Operands, INDF0 through INDF2. These
can be thought of as “virtual” registers: they are
mapped in the SFR space but are not physically
implemented. Reading or writing to a particular INDF
register actually accesses its corresponding FSR
register pair. A read from INDF1, for example, reads
the data at the address indicated by FSR1H:FSR1L.
Instructions that use the INDF registers as operands
actually use the contents of their corresponding FSR as
a pointer to the instruction’s target. The INDF operand
is just a convenient way of using the pointer.
• POSTINC: accesses the location to which the
FSR points, then automatically increments the
FSR by 1 afterwards
• PREINC: automatically increments the FSR by 1,
then uses the location to which the FSR points in
the operation
• PLUSW: adds the signed value of the W register
(range of -127 to 128) to that of the FSR and uses
the location to which the result points in the
operation.
Because indirect addressing uses a full 12-bit address,
data RAM banking is not necessary. Thus, the current
contents of the BSR and the Access RAM bit have no
effect on determining the target address.
In this context, accessing an INDF register uses the
value in the associated FSR register without changing
it. Similarly, accessing a PLUSW register gives the
FSR value an offset by that in the W register; however,
neither W nor the FSR is actually changed in the
operation. Accessing the other virtual registers
changes the value of the FSR register.
FIGURE 5-10:
INDIRECT ADDRESSING
000h
Using an instruction with one of the
indirect addressing registers as the
operand....
Bank 0
Bank 1
ADDWF, INDF1, 1
100h
200h
300h
Bank 2
FSR1H:FSR1L
...uses the 12-bit address stored in
the FSR pair associated with that
register....
7
0
7
0
Bank 3
through
Bank 13
x x x x 1 1 1 0
1 1 0 0 1 1 0 0
...to determine the data memory
location to be used in that operation.
E00h
In this case, the FSR1 pair contains
ECCh. This means the contents of
location ECCh will be added to that
of the W register and stored back in
ECCh.
Bank 14
Bank 15
F00h
FFFh
Data Memory
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 91
PIC18(L)F2X/4XK22
Operations on the FSRs with POSTDEC, POSTINC
and PREINC affect the entire register pair; that is, roll-
overs of the FSRnL register from FFh to 00h carry over
to the FSRnH register. On the other hand, results of
these operations do not change the value of any flags
in the STATUS register (e.g., Z, N, OV, etc.).
5.5.1
INDEXED ADDRESSING WITH
LITERAL OFFSET
Enabling the PIC18 extended instruction set changes
the behavior of indirect addressing using the FSR2
register pair within Access RAM. Under the proper
conditions, instructions that use the Access Bank – that
is, most bit-oriented and byte-oriented instructions –
can invoke a form of indexed addressing using an
offset specified in the instruction. This special
addressing mode is known as Indexed Addressing with
Literal Offset, or Indexed Literal Offset mode.
The PLUSW register can be used to implement a form
of indexed addressing in the data memory space. By
manipulating the value in the W register, users can
reach addresses that are fixed offsets from pointer
addresses. In some applications, this can be used to
implement some powerful program control structure,
such as software stacks, inside of data memory.
When using the extended instruction set, this
addressing mode requires the following:
5.4.3.3
Operations by FSRs on FSRs
• The use of the Access Bank is forced (‘a’ = 0) and
• The file address argument is less than or equal to
5Fh.
Indirect addressing operations that target other FSRs
or virtual registers represent special cases. For
example, using an FSR to point to one of the virtual
registers will not result in successful operations. As a
specific case, assume that FSR0H:FSR0L contains
FE7h, the address of INDF1. Attempts to read the
value of the INDF1 using INDF0 as an operand will
return 00h. Attempts to write to INDF1 using INDF0 as
the operand will result in a NOP.
Under these conditions, the file address of the
instruction is not interpreted as the lower byte of an
address (used with the BSR in direct addressing), or as
an 8-bit address in the Access Bank. Instead, the value
is interpreted as an offset value to an Address Pointer,
specified by FSR2. The offset and the contents of
FSR2 are added to obtain the target address of the
operation.
On the other hand, using the virtual registers to write to
an FSR pair may not occur as planned. In these cases,
the value will be written to the FSR pair but without any
incrementing or decrementing. Thus, writing to either
the INDF2 or POSTDEC2 register will write the same
value to the FSR2H:FSR2L.
5.5.2
INSTRUCTIONS AFFECTED BY
INDEXED LITERAL OFFSET MODE
Any of the core PIC18 instructions that can use direct
addressing are potentially affected by the Indexed
Literal Offset Addressing mode. This includes all
byte-oriented and bit-oriented instructions, or almost
one-half of the standard PIC18 instruction set.
Instructions that only use Inherent or Literal Addressing
modes are unaffected.
Since the FSRs are physical registers mapped in the
SFR space, they can be manipulated through all direct
operations. Users should proceed cautiously when
working on these registers, particularly if their code
uses indirect addressing.
Additionally, byte-oriented and bit-oriented instructions
are not affected if they do not use the Access Bank
(Access RAM bit is ‘1’), or include a file address of 60h
or above. Instructions meeting these criteria will
continue to execute as before. A comparison of the
different possible addressing modes when the
extended instruction set is enabled is shown in
Figure 5-11.
Similarly, operations by indirect addressing are generally
permitted on all other SFRs. Users should exercise the
appropriate caution that they do not inadvertently change
settings that might affect the operation of the device.
5.5
Data Memory and the Extended
Instruction Set
Enabling the PIC18 extended instruction set (XINST
Configuration bit = 1) significantly changes certain
aspects of data memory and its addressing. Specifi-
cally, the use of the Access Bank for many of the core
PIC18 instructions is different; this is due to the intro-
duction of a new addressing mode for the data memory
space.
Those who desire to use byte-oriented or bit-oriented
instructions in the Indexed Literal Offset mode should
note the changes to assembler syntax for this mode.
This is described in more detail in Section 25.2.1
“Extended Instruction Syntax”.
What does not change is just as important. The size of
the data memory space is unchanged, as well as its
linear addressing. The SFR map remains the same.
Core PIC18 instructions can still operate in both Direct
and Indirect Addressing mode; inherent and literal
instructions do not change at all. Indirect addressing
with FSR0 and FSR1 also remain unchanged.
DS41412A-page 92
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
FIGURE 5-11:
COMPARING ADDRESSING OPTIONS FOR BIT-ORIENTED AND
BYTE-ORIENTED INSTRUCTIONS (EXTENDED INSTRUCTION SET ENABLED)
EXAMPLE INSTRUCTION: ADDWF, f, d, a (Opcode: 0010 01da ffff ffff)
000h
When ‘a’ = 0 and f 60h:
060h
The instruction executes in
Bank 0
Direct Forced mode. ‘f’ is inter-
preted as a location in the
Access RAM between 060h
and 0FFh. This is the same as
locations F60h to FFFh
(Bank 15) of data memory.
100h
00h
60h
Bank 1
through
Bank 14
Valid range
for ‘f’
Locations below 60h are not
available in this addressing
mode.
FFh
Access RAM
F00h
Bank 15
SFRs
F60h
FFFh
Data Memory
When ‘a’ = 0 and f5Fh:
000h
060h
100h
The instruction executes in
Indexed Literal Offset mode. ‘f’
is interpreted as an offset to the
address value in FSR2. The
two are added together to
obtain the address of the target
register for the instruction. The
address can be anywhere in
the data memory space.
Bank 0
001001da ffffffff
Bank 1
through
Bank 14
FSR2H
FSR2L
F00h
F60h
Note that in this mode, the
correct syntax is now:
Bank 15
SFRs
ADDWF [k], d
where ‘k’ is the same as ‘f’.
FFFh
Data Memory
BSR
000h
060h
100h
00000000
When ‘a’ = 1 (all values of f):
The instruction executes in
Direct mode (also known as
Direct Long mode). ‘f’ is inter-
preted as a location in one of
the 16 banks of the data
memory space. The bank is
designated by the Bank Select
Register (BSR). The address
can be in any implemented
bank in the data memory
space.
Bank 0
001001da ffffffff
Bank 1
through
Bank 14
F00h
F60h
Bank 15
SFRs
FFFh
Data Memory
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 93
PIC18(L)F2X/4XK22
Remapping of the Access Bank applies only to opera-
tions using the Indexed Literal Offset mode. Operations
that use the BSR (Access RAM bit is ‘1’) will continue
to use direct addressing as before.
5.5.3
MAPPING THE ACCESS BANK IN
INDEXED LITERAL OFFSET MODE
The use of Indexed Literal Offset Addressing mode
effectively changes how the first 96 locations of Access
RAM (00h to 5Fh) are mapped. Rather than containing
just the contents of the bottom section of Bank 0, this
mode maps the contents from a user defined “window”
that can be located anywhere in the data memory
space. The value of FSR2 establishes the lower bound-
ary of the addresses mapped into the window, while the
upper boundary is defined by FSR2 plus 95 (5Fh).
Addresses in the Access RAM above 5Fh are mapped
as previously described (see Section 5.3.2 “Access
Bank”). An example of Access Bank remapping in this
addressing mode is shown in Figure 5-12.
5.6
PIC18 Instruction Execution and
the Extended Instruction Set
Enabling the extended instruction set adds eight
additional commands to the existing PIC18 instruction
set. These instructions are executed as described in
Section 25.2 “Extended Instruction Set”.
FIGURE 5-12:
REMAPPING THE ACCESS BANK WITH INDEXED LITERAL OFFSET
ADDRESSING
Example Situation:
000h
ADDWF f, d, a
FSR2H:FSR2L = 120h
Bank 0
Locations in the region
from the FSR2 pointer
(120h) to the pointer plus
05Fh (17Fh) are mapped
to the bottom of the
Access RAM (000h-05Fh).
100h
120h
17Fh
Bank 1
Window
00h
Bank 1
Bank 1 “Window”
200h
5Fh
60h
Special File Registers at
F60h through FFFh are
mapped to 60h through
FFh, as usual.
Bank 2
through
Bank 14
SFRs
Bank 0 addresses below
5Fh can still be addressed
by using the BSR.
FFh
Access Bank
F00h
Bank 15
SFRs
F60h
FFFh
Data Memory
DS41412A-page 94
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
6.1
Table Reads and Table Writes
6.0
FLASH PROGRAM MEMORY
In order to read and write program memory, there are
two operations that allow the processor to move bytes
between the program memory space and the data RAM:
The Flash program memory is readable, writable and
erasable during normal operation over the entire VDD
range.
• Table Read (TBLRD)
• Table Write (TBLWT)
A read from program memory is executed one byte at
a time. A write to program memory is executed on
blocks of 64 bytes at a time. Program memory is
erased in blocks of 64 bytes at a time. The difference
between the write and erase block sizes requires from
1 to 8 block writes to restore the contents of a single
block erase. A bulk erase operation can not be issued
from user code.
The program memory space is 16 bits wide, while the
data RAM space is 8 bits wide. Table reads and table
writes move data between these two memory spaces
through an 8-bit register (TABLAT).
The table read operation retrieves one byte of data
directly from program memory and places it into the
TABLAT register. Figure 6-1 shows the operation of a
table read.
Writing or erasing program memory will cease
instruction fetches until the operation is complete. The
program memory cannot be accessed during the write
or erase, therefore, code cannot execute. An internal
programming timer terminates program memory writes
and erases.
The table write operation stores one byte of data from the
TABLAT register into a write block holding register. The
procedure to write the contents of the holding registers
into program memory is detailed in Section 6.5 “Writing
to Flash Program Memory”. Figure 6-2 shows the
operation of a table write with program memory and data
RAM.
A value written to program memory does not need to be
a valid instruction. Executing a program memory
location that forms an invalid instruction results in a
NOP.
Table operations work with byte entities. Tables
containing data, rather than program instructions, are
not required to be word aligned. Therefore, a table can
start and end at any byte address. If a table write is being
used to write executable code into program memory,
program instructions will need to be word aligned.
FIGURE 6-1:
TABLE READ OPERATION
Instruction: TBLRD*
Program Memory
(1)
Table Pointer
Table Latch (8-bit)
TABLAT
TBLPTRU TBLPTRH TBLPTRL
Program Memory
(TBLPTR)
Note 1: Table Pointer register points to a byte in program memory.
2010 Microchip Technology Inc.
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FIGURE 6-2:
TABLE WRITE OPERATION
Instruction: TBLWT*
Program Memory
Holding Registers
(1)
Table Pointer
Table Latch (8-bit)
TABLAT
TBLPTRU TBLPTRH TBLPTRL
Program Memory
(TBLPTR<MSBs>)
Note 1: During table writes the Table Pointer does not point directly to Program Memory. The LSBs of TBLPRTL
actually point to an address within the write block holding registers. The MSBs of the Table Pointer deter-
mine where the write block will eventually be written. The process for writing the holding registers to the
program memory array is discussed in Section 6.5 “Writing to Flash Program Memory”.
The FREE bit allows the program memory erase
operation. When FREE is set, an erase operation is
initiated on the next WR command. When FREE is
clear, only writes are enabled.
6.2
Control Registers
Several control registers are used in conjunction with
the TBLRDand TBLWTinstructions. These include the:
• EECON1 register
• EECON2 register
• TABLAT register
• TBLPTR registers
The WREN bit, when set, will allow a write operation.
The WREN bit is clear on power-up.
The WRERR bit is set by hardware when the WR bit is
set and cleared when the internal programming timer
expires and the write operation is complete.
6.2.1
EECON1 AND EECON2 REGISTERS
Note:
During normal operation, the WRERR is
read as ‘1’. This can indicate that a write
operation was prematurely terminated by
The EECON1 register (Register 6-1) is the control
register for memory accesses. The EECON2 register is
not a physical register; it is used exclusively in the
memory write and erase sequences. Reading
EECON2 will read all ‘0’s.
a
Reset, or
a write operation was
attempted improperly.
The WR control bit initiates write operations. The WR
bit cannot be cleared, only set, by firmware. Then WR
bit is cleared by hardware at the completion of the write
operation.
The EEPGD control bit determines if the access will be
a program or data EEPROM memory access. When
EEPGD is clear, any subsequent operations will
operate on the data EEPROM memory. When EEPGD
is set, any subsequent operations will operate on the
program memory.
Note:
The EEIF interrupt flag bit of the PIR2
register is set when the write is complete.
The EEIF flag stays set until cleared by
firmware.
The CFGS control bit determines if the access will be
to the Configuration/Calibration registers or to program
memory/data EEPROM memory. When CFGS is set,
subsequent operations will operate on Configuration
registers regardless of EEPGD (see Section 24.0
“Special Features of the CPU”). When CFGS is clear,
memory selection access is determined by EEPGD.
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REGISTER 6-1:
EECON1: DATA EEPROM CONTROL 1 REGISTER
R/W-x
EEPGD
bit 7
R/W-x
CFGS
U-0
—
R/W-0
FREE
R/W-x
R/W-0
WREN
R/S-0
WR
R/S-0
RD
WRERR
bit 0
Legend:
R = Readable bit
W = Writable bit
S = Bit can be set by software, but not cleared
-n = Value at POR ‘1’ = Bit is set
U = Unimplemented bit, read as ‘0’
‘0’ = Bit is cleared x = Bit is unknown
bit 7
bit 6
EEPGD: Flash Program or Data EEPROM Memory Select bit
1= Access Flash program memory
0= Access data EEPROM memory
CFGS: Flash Program/Data EEPROM or Configuration Select bit
1= Access Configuration registers
0= Access Flash program or data EEPROM memory
bit 5
bit 4
Unimplemented: Read as ‘0’
FREE: Flash Row (Block) Erase Enable bit
1= Erase the program memory block addressed by TBLPTR on the next WR command
(cleared by completion of erase operation)
0= Perform write-only
bit 3
WRERR: Flash Program/Data EEPROM Error Flag bit(1)
1= A write operation is prematurely terminated (any Reset during self-timed programming in normal
operation, or an improper write attempt)
0= The write operation completed
bit 2
bit 1
WREN: Flash Program/Data EEPROM Write Enable bit
1= Allows write cycles to Flash program/data EEPROM
0= Inhibits write cycles to Flash program/data EEPROM
WR: Write Control bit
1= Initiates a data EEPROM erase/write cycle or a program memory erase cycle or write cycle.
(The operation is self-timed and the bit is cleared by hardware once write is complete.
The WR bit can only be set (not cleared) by software.)
0= Write cycle to the EEPROM is complete
bit 0
RD: Read Control bit
1= Initiates an EEPROM read (Read takes one cycle. RD is cleared by hardware. The RD bit can only
be set (not cleared) by software. RD bit cannot be set when EEPGD = 1or CFGS = 1.)
0= Does not initiate an EEPROM read
Note 1: When a WRERR occurs, the EEPGD and CFGS bits are not cleared. This allows tracing of the
error condition.
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When a TBLRDis executed, all 22 bits of the TBLPTR
determine which byte is read from program memory
directly into the TABLAT register.
6.2.2
TABLAT – TABLE LATCH REGISTER
The Table Latch (TABLAT) is an 8-bit register mapped
into the SFR space. The Table Latch register is used to
hold 8-bit data during data transfers between program
memory and data RAM.
When a TBLWT is executed the byte in the TABLAT
register is written, not to Flash memory but, to a holding
register in preparation for a program memory write. The
holding registers constitute a write block which varies
depending on the device (see Table ).The 3, 4, or 5
LSbs of the TBLPTRL register determine which specific
address within the holding register block is written to.
The MSBs of the Table Pointer have no effect during
TBLWToperations.
6.2.3
TBLPTR – TABLE POINTER
REGISTER
The Table Pointer (TBLPTR) register addresses a byte
within the program memory. The TBLPTR is comprised
of three SFR registers: Table Pointer Upper Byte, Table
Pointer High Byte and Table Pointer Low Byte
(TBLPTRU:TBLPTRH:TBLPTRL). These three regis-
ters join to form a 22-bit wide pointer. The low-order
21 bits allow the device to address up to 2 Mbytes of
program memory space. The 22nd bit allows access to
the device ID, the user ID and the Configuration bits.
When a program memory write is executed the entire
holding register block is written to the Flash memory at
the address determined by the MSbs of the TBLPTR.
The 3, 4, or 5 LSBs are ignored during Flash memory
writes. For more detail, see Section 6.5 “Writing to
Flash Program Memory”.
The Table Pointer register, TBLPTR, is used by the
TBLRDand TBLWTinstructions. These instructions can
update the TBLPTR in one of four ways based on the
table operation. These operations on the TBLPTR
affect only the low-order 21 bits.
When an erase of program memory is executed, the
16 MSbs of the Table Pointer register (TBLPTR<21:6>)
point to the 64-byte block that will be erased. The Least
Significant bits (TBLPTR<5:0>) are ignored.
Figure 6-3 describes the relevant boundaries of
TBLPTR based on Flash program memory operations.
6.2.4
TABLE POINTER BOUNDARIES
TBLPTR is used in reads, writes and erases of the
Flash program memory.
TABLE 6-1:
Example
TABLE POINTER OPERATIONS WITH TBLRD AND TBLWT INSTRUCTIONS
Operation on Table Pointer
TBLRD*
TBLWT*
TBLPTR is not modified
TBLRD*+
TBLWT*+
TBLPTR is incremented after the read/write
TBLPTR is decremented after the read/write
TBLPTR is incremented before the read/write
TBLRD*-
TBLWT*-
TBLRD+*
TBLWT+*
FIGURE 6-3:
TABLE POINTER BOUNDARIES BASED ON OPERATION
21
16 15
TBLPTRH
8
7
TBLPTRL
0
TBLPTRU
TABLE ERASE/WRITE
TBLPTR<21:n+1>
TABLE WRITE
TBLPTR<n:0>
(1)
(1)
TABLE READ – TBLPTR<21:0>
Note 1: n = 6 for block sizes of 64 bytes.
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The internal program memory is typically organized by
words. The Least Significant bit of the address selects
between the high and low bytes of the word. Figure 6-4
shows the interface between the internal program
memory and the TABLAT.
6.3
Reading the Flash Program
Memory
The TBLRD instruction retrieves data from program
memory and places it into data RAM. Table reads from
program memory are performed one byte at a time.
TBLPTR points to a byte address in program space.
Executing TBLRD places the byte pointed to into
TABLAT. In addition, TBLPTR can be modified
automatically for the next table read operation.
FIGURE 6-4:
READS FROM FLASH PROGRAM MEMORY
Program Memory
(Even Byte Address)
(Odd Byte Address)
TBLPTR = xxxxx1
TBLPTR = xxxxx0
Instruction Register
(IR)
TABLAT
Read Register
FETCH
TBLRD
EXAMPLE 6-1:
READING A FLASH PROGRAM MEMORY WORD
MOVLW
MOVWF
MOVLW
MOVWF
MOVLW
MOVWF
CODE_ADDR_UPPER
TBLPTRU
CODE_ADDR_HIGH
TBLPTRH
CODE_ADDR_LOW
TBLPTRL
; Load TBLPTR with the base
; address of the word
READ_WORD
TBLRD*+
MOVF
MOVWF
TBLRD*+
MOVFW
MOVF
; read into TABLAT and increment
; get data
TABLAT, W
WORD_EVEN
; read into TABLAT and increment
; get data
TABLAT, W
WORD_ODD
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PIC18(L)F2X/4XK22
6.4.1
FLASH PROGRAM MEMORY
ERASE SEQUENCE
6.4
Erasing Flash Program Memory
The minimum erase block is 32 words or 64 bytes. Only
through the use of an external programmer, or through
ICSP™ control, can larger blocks of program memory
be bulk erased. Word erase in the Flash array is not
supported.
The sequence of events for erasing a block of internal
program memory is:
1. Load Table Pointer register with address of
block being erased.
When initiating an erase sequence from the
microcontroller itself, a block of 64 bytes of program
memory is erased. The Most Significant 16 bits of the
TBLPTR<21:6> point to the block being erased. The
TBLPTR<5:0> bits are ignored.
2. Set the EECON1 register for the erase operation:
• set EEPGD bit to point to program memory;
• clear the CFGS bit to access program memory;
• set WREN bit to enable writes;
• set FREE bit to enable the erase.
3. Disable interrupts.
The EECON1 register commands the erase operation.
The EEPGD bit must be set to point to the Flash
program memory. The WREN bit must be set to enable
write operations. The FREE bit is set to select an erase
operation.
4. Write 55h to EECON2.
5. Write 0AAh to EECON2.
6. Set the WR bit. This will begin the block erase
cycle.
The write initiate sequence for EECON2, shown as
steps 4 through 6 in Section 6.4.1 “Flash Program
Memory Erase Sequence”, is used to guard against
accidental writes. This is sometimes referred to as a
long write.
7. The CPU will stall for duration of the erase
(about 2 ms using internal timer).
8. Re-enable interrupts.
A long write is necessary for erasing the internal Flash.
Instruction execution is halted during the long write
cycle. The long write is terminated by the internal
programming timer.
EXAMPLE 6-2:
ERASING A FLASH PROGRAM MEMORY BLOCK
MOVLW
MOVWF
MOVLW
MOVWF
MOVLW
MOVWF
CODE_ADDR_UPPER
TBLPTRU
CODE_ADDR_HIGH
TBLPTRH
CODE_ADDR_LOW
TBLPTRL
; load TBLPTR with the base
; address of the memory block
ERASE_BLOCK
BSF
BCF
BSF
BSF
EECON1, EEPGD
EECON1, CFGS
EECON1, WREN
EECON1, FREE
INTCON, GIE
55h
EECON2
0AAh
EECON2
EECON1, WR
INTCON, GIE
; point to Flash program memory
; access Flash program memory
; enable write to memory
; enable block Erase operation
; disable interrupts
BCF
Required
Sequence
MOVLW
MOVWF
MOVLW
MOVWF
BSF
; write 55h
; write 0AAh
; start erase (CPU stall)
; re-enable interrupts
BSF
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The long write is necessary for programming the
internal Flash. Instruction execution is halted during a
long write cycle. The long write will be terminated by
the internal programming timer.
6.5
Writing to Flash Program Memory
The programming block size is 64 bytes. Word or byte
programming is not supported.
Table writes are used internally to load the holding
registers needed to program the Flash memory. There
are only as many holding registers as there are bytes
in a write block (64 bytes).
The EEPROM on-chip timer controls the write time.
The write/erase voltages are generated by an on-chip
charge pump, rated to operate over the voltage range
of the device.
Since the Table Latch (TABLAT) is only a single byte,
the TBLWT instruction needs to be executed 64 times
for each programming operation. All of the table write
operations will essentially be short writes because only
the holding registers are written. After all the holding
registers have been written, the programming
operation of that block of memory is started by
configuring the EECON1 register for a program
memory write and performing the long write sequence.
Note:
The default value of the holding registers on
device Resets and after write operations is
FFh. A write of FFh to a holding register
does not modify that byte. This means that
individual bytes of program memory may be
modified, provided that the change does not
attempt to change any bit from a ‘0’ to a ‘1’.
When modifying individual bytes, it is not
necessary to load all holding registers
before executing a long write operation.
FIGURE 6-5:
TABLE WRITES TO FLASH PROGRAM MEMORY
TABLAT
Write Register
8
8
8
8
(1)
TBLPTR = xxxx00
TBLPTR = xxxx01
TBLPTR = xxxx02
TBLPTR = xxxxYY
Holding Register
Holding Register
Holding Register
Holding Register
Program Memory
Note 1: YY = 3F for 64 byte write blocks.
8. Disable interrupts.
6.5.1
FLASH PROGRAM MEMORY WRITE
SEQUENCE
9. Write 55h to EECON2.
10. Write 0AAh to EECON2.
The sequence of events for programming an internal
program memory location should be:
11. Set the WR bit. This will begin the write cycle.
12. The CPU will stall for duration of the write (about
2 ms using internal timer).
1. Read 64 bytes into RAM.
2. Update data values in RAM as necessary.
13. Re-enable interrupts.
3. Load Table Pointer register with address being
erased.
14. Verify the memory (table read).
This procedure will require about 6 ms to update each
write block of memory. An example of the required code
is given in Example 6-3.
4. Execute the block erase procedure.
5. Load Table Pointer register with address of first
byte being written.
6. Write the 64-byte block into the holding registers
with auto-increment.
Note:
Before setting the WR bit, the Table
Pointer address needs to be within the
intended address range of the bytes in the
holding registers.
7. Set the EECON1 register for the write operation:
• set EEPGD bit to point to program memory;
• clear the CFGS bit to access program memory;
• set WREN to enable byte writes.
2010 Microchip Technology Inc.
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PIC18(L)F2X/4XK22
EXAMPLE 6-3:
WRITING TO FLASH PROGRAM MEMORY
MOVLW
MOVWF
MOVLW
MOVWF
MOVLW
MOVWF
MOVLW
MOVWF
MOVLW
MOVWF
MOVLW
MOVWF
D'64’
COUNTER
BUFFER_ADDR_HIGH
FSR0H
BUFFER_ADDR_LOW
FSR0L
CODE_ADDR_UPPER
TBLPTRU
CODE_ADDR_HIGH
TBLPTRH
CODE_ADDR_LOW
TBLPTRL
; number of bytes in erase block
; point to buffer
; Load TBLPTR with the base
; address of the memory block
READ_BLOCK
TBLRD*+
MOVF
MOVWF
DECFSZ
BRA
; read into TABLAT, and inc
; get data
; store data
; done?
TABLAT, W
POSTINC0
COUNTER
READ_BLOCK
; repeat
MODIFY_WORD
MOVLW
MOVWF
MOVLW
MOVWF
MOVLW
MOVWF
MOVLW
MOVWF
BUFFER_ADDR_HIGH
FSR0H
BUFFER_ADDR_LOW
FSR0L
NEW_DATA_LOW
POSTINC0
NEW_DATA_HIGH
INDF0
; point to buffer
; update buffer word
ERASE_BLOCK
MOVLW
MOVWF
MOVLW
MOVWF
MOVLW
MOVWF
BSF
BCF
BSF
BSF
BCF
MOVLW
MOVWF
MOVLW
MOVWF
BSF
CODE_ADDR_UPPER
TBLPTRU
CODE_ADDR_HIGH
TBLPTRH
CODE_ADDR_LOW
TBLPTRL
EECON1, EEPGD
EECON1, CFGS
EECON1, WREN
EECON1, FREE
INTCON, GIE
55h
EECON2
0AAh
EECON2
EECON1, WR
INTCON, GIE
; load TBLPTR with the base
; address of the memory block
; point to Flash program memory
; access Flash program memory
; enable write to memory
; enable Erase operation
; disable interrupts
Required
Sequence
; write 55h
; write 0AAh
; start erase (CPU stall)
; re-enable interrupts
; dummy read decrement
; point to buffer
BSF
TBLRD*-
MOVLW
MOVWF
MOVLW
MOVWF
BUFFER_ADDR_HIGH
FSR0H
BUFFER_ADDR_LOW
FSR0L
WRITE_BUFFER_BACK
MOVLW
MOVWF
MOVLW
MOVWF
BlockSize
COUNTER
D’64’/BlockSize
COUNTER2
; number of bytes in holding register
; number of write blocks in 64 bytes
WRITE_BYTE_TO_HREGS
MOVF
MOVWF
TBLWT+*
POSTINC0, W
TABLAT
; get low byte of buffer data
; present data to table latch
; write data, perform a short write
; to internal TBLWT holding register.
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2010 Microchip Technology Inc.
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EXAMPLE 6-3:
WRITING TO FLASH PROGRAM MEMORY (CONTINUED)
DECFSZ COUNTER
; loop until holding registers are full
BRA
WRITE_WORD_TO_HREGS
PROGRAM_MEMORY
BSF
BCF
BSF
BCF
MOVLW
MOVWF
MOVLW
MOVWF
BSF
DCFSZ
BRA
BSF
EECON1, EEPGD
EECON1, CFGS
EECON1, WREN
INTCON, GIE
55h
EECON2
0AAh
EECON2
EECON1, WR
COUNTER2
; point to Flash program memory
; access Flash program memory
; enable write to memory
; disable interrupts
Required
Sequence
; write 55h
; write 0AAh
; start program (CPU stall)
; repeat for remaining write blocks
;
; re-enable interrupts
; disable write to memory
WRITE_BYTE_TO_HREGS
INTCON, GIE
EECON1, WREN
BCF
6.5.2
WRITE VERIFY
6.5.4
PROTECTION AGAINST
SPURIOUS WRITES
Depending on the application, good programming
practice may dictate that the value written to the
memory should be verified against the original value.
This should be used in applications where excessive
writes can stress bits near the specification limit.
To protect against spurious writes to Flash program
memory, the write initiate sequence must also be
followed. See Section 24.0 “Special Features of the
CPU” for more detail.
6.5.3
UNEXPECTED TERMINATION OF
WRITE OPERATION
6.6
Flash Program Operation During
Code Protection
If a write is terminated by an unplanned event, such as
loss of power or an unexpected Reset, the memory
location just programmed should be verified and
reprogrammed if needed. If the write operation is
interrupted by a MCLR Reset or a WDT Time-out Reset
during normal operation, the WRERR bit will be set
which the user can check to decide whether a rewrite
of the location(s) is needed.
See Section 24.3 “Program Verification and Code
Protection” for details on code protection of Flash
program memory.
TABLE 6-2:
REGISTERS ASSOCIATED WITH PROGRAM FLASH MEMORY
Reset
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Values on
page
TBLPTRU
TBPLTRH
TBLPTRL
TABLAT
INTCON
EECON2
EECON1
IPR2
—
—
Program Memory Table Pointer Upper Byte (TBLPTR<21:16>)
—
—
Program Memory Table Pointer High Byte (TBLPTR<15:8>)
Program Memory Table Pointer Low Byte (TBLPTR<7:0>)
Program Memory Table Latch
—
—
GIE/GIEH PEIE/GIEL TMR0IE
INT0IE
RBIE
TMR0IF
INT0IF
RBIF
115
—
EEPROM Control Register 2 (not a physical register)
EEPGD
OSCFIP
OSCFIF
OSCFIE
CFGS
C1IP
C1IF
C1IE
—
FREE
EEIP
EEIF
EEIE
WRERR
BCLIP
BCLIF
BCLIE
WREN
HLVDIP
HLVDIF
HLVDIE
WR
RD
97
C2IP
C2IF
C2IE
TMR3IP
TMR3IF
TMR3IE
CCP2IP
CCP2IF
CCP2IE
128
119
124
PIR2
PIE2
Legend:
— = unimplemented, read as ‘0’. Shaded bits are not used during Flash/EEPROM access.
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NOTES:
DS41412A-page 104
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2010 Microchip Technology Inc.
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The EECON1 register (Register 7-1) is the control
register for data and program memory access. Control
bit EEPGD determines if the access will be to program
or data EEPROM memory. When the EEPGD bit is
clear, operations will access the data EEPROM
memory. When the EEPGD bit is set, program memory
is accessed.
7.0
DATA EEPROM MEMORY
The data EEPROM is a nonvolatile memory array,
separate from the data RAM and program memory,
which is used for long-term storage of program data. It
is not directly mapped in either the register file or
program memory space but is indirectly addressed
through the Special Function Registers (SFRs). The
EEPROM is readable and writable during normal
operation over the entire VDD range.
Control bit, CFGS, determines if the access will be to
the Configuration registers or to program memory/data
EEPROM memory. When the CFGS bit is set,
subsequent operations access Configuration registers.
When the CFGS bit is clear, the EEPGD bit selects
either program Flash or data EEPROM memory.
Four SFRs are used to read and write to the data
EEPROM as well as the program memory. They are:
• EECON1
• EECON2
• EEDATA
• EEADR
The WREN bit, when set, will allow a write operation.
On power-up, the WREN bit is clear.
The WRERR bit is set by hardware when the WR bit is
set and cleared when the internal programming timer
expires and the write operation is complete.
• EEADRH
The data EEPROM allows byte read and write. When
interfacing to the data memory block, EEDATA holds
the 8-bit data for read/write and the EEADR:EEADRH
register pair hold the address of the EEPROM location
being accessed.
Note:
During normal operation, the WRERR
may read as ‘1’. This can indicate that a
write operation was prematurely termi-
nated by a Reset, or a write operation was
attempted improperly.
The EEPROM data memory is rated for high erase/write
cycle endurance. A byte write automatically erases the
location and writes the new data (erase-before-write).
The write time is controlled by an on-chip timer; it will
vary with voltage and temperature as well as from chip-
to-chip. Please refer to the Data EEPROM Memory
parameters in Section 27.0 “Electrical Characteris-
tics” for limits.
The WR control bit initiates write operations. The bit
can be set but not cleared by software. It is cleared only
by hardware at the completion of the write operation.
Note:
The EEIF interrupt flag bit of the PIR2
register is set when the write is complete.
It must be cleared by software.
Control bits, RD and WR, start read and erase/write
operations, respectively. These bits are set by firmware
and cleared by hardware at the completion of the
operation.
7.1
EEADR and EEADRH Registers
The EEADR register is used to address the data
EEPROM for read and write operations. The 8-bit
range of the register can address a memory range of
256 bytes (00h to FFh). The EEADRH register expands
the range to 1024 bytes by adding an additional two
address bits.
The RD bit cannot be set when accessing program
memory (EEPGD = 1). Program memory is read using
table read instructions. See Section 6.1 “Table Reads
and Table Writes” regarding table reads.
The EECON2 register is not a physical register. It is
used exclusively in the memory write and erase
sequences. Reading EECON2 will read all ‘0’s.
7.2
EECON1 and EECON2 Registers
Access to the data EEPROM is controlled by two
registers: EECON1 and EECON2. These are the same
registers which control access to the program memory
and are used in a similar manner for the data
EEPROM.
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 105
PIC18(L)F2X/4XK22
REGISTER 7-1:
EECON1: DATA EEPROM CONTROL 1 REGISTER
R/W-x
EEPGD
bit 7
R/W-x
CFGS
U-0
—
R/W-0
FREE
R/W-x
R/W-0
WREN
R/S-0
WR
R/S-0
RD
WRERR
bit 0
Legend:
R = Readable bit
W = Writable bit
S = Bit can be set by software, but not cleared
-n = Value at POR ‘1’ = Bit is set
U = Unimplemented bit, read as ‘0’
‘0’ = Bit is cleared x = Bit is unknown
bit 7
bit 6
EEPGD: Flash Program or Data EEPROM Memory Select bit
1= Access Flash program memory
0= Access data EEPROM memory
CFGS: Flash Program/Data EEPROM or Configuration Select bit
1= Access Configuration registers
0= Access Flash program or data EEPROM memory
bit 5
bit 4
Unimplemented: Read as ‘0’
FREE: Flash Row (Block) Erase Enable bit
1= Erase the program memory block addressed by TBLPTR on the next WR command
(cleared by completion of erase operation)
0= Perform write-only
bit 3
WRERR: Flash Program/Data EEPROM Error Flag bit(1)
1= A write operation is prematurely terminated (any Reset during self-timed programming in normal
operation, or an improper write attempt)
0= The write operation completed
bit 2
bit 1
WREN: Flash Program/Data EEPROM Write Enable bit
1= Allows write cycles to Flash program/data EEPROM
0= Inhibits write cycles to Flash program/data EEPROM
WR: Write Control bit
1= Initiates a data EEPROM erase/write cycle or a program memory erase cycle or write cycle.
(The operation is self-timed and the bit is cleared by hardware once write is complete.
The WR bit can only be set (not cleared) by software.)
0= Write cycle to the EEPROM is complete
bit 0
RD: Read Control bit
1= Initiates an EEPROM read (Read takes one cycle. RD is cleared by hardware. The RD bit can only
be set (not cleared) by software. RD bit cannot be set when EEPGD = 1or CFGS = 1.)
0= Does not initiate an EEPROM read
Note 1: When a WRERR occurs, the EEPGD and CFGS bits are not cleared. This allows tracing of the
error condition.
DS41412A-page 106
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
Additionally, the WREN bit in EECON1 must be set to
enable writes. This mechanism prevents accidental
writes to data EEPROM due to unexpected code
execution (i.e., runaway programs). The WREN bit
should be kept clear at all times, except when updating
the EEPROM. The WREN bit is not cleared by
hardware.
7.3
Reading the Data EEPROM
Memory
To read a data memory location, the user must write the
address to the EEADR register, clear the EEPGD con-
trol bit of the EECON1 register and then set control bit,
RD. The data is available on the very next instruction
cycle; therefore, the EEDATA register can be read by
the next instruction. EEDATA will hold this value until
another read operation, or until it is written to by the
user (during a write operation).
After a write sequence has been initiated, EECON1,
EEADR and EEDATA cannot be modified. The WR bit
will be inhibited from being set unless the WREN bit is
set. Both WR and WREN cannot be set with the same
instruction.
The basic process is shown in Example 7-1.
At the completion of the write cycle, the WR bit is
cleared by hardware and the EEPROM Interrupt Flag
bit, EEIF, is set. The user may either enable this
interrupt or poll this bit. EEIF must be cleared by
software.
7.4
Writing to the Data EEPROM
Memory
To write an EEPROM data location, the address must
first be written to the EEADR register and the data writ-
ten to the EEDATA register. The sequence in
Example 7-2 must be followed to initiate the write cycle.
7.5
Write Verify
Depending on the application, good programming
practice may dictate that the value written to the
memory should be verified against the original value.
This should be used in applications where excessive
writes can stress bits near the specification limit.
The write will not begin if this sequence is not exactly
followed (write 55h to EECON2, write 0AAh to
EECON2, then set WR bit) for each byte. It is strongly
recommended that interrupts be disabled during this
code segment.
EXAMPLE 7-1:
DATA EEPROM READ
MOVLW
MOVWF
BCF
DATA_EE_ADDR
EEADR
EECON1, EEPGD ; Point to DATA memory
;
; Data Memory Address to read
BCF
BSF
MOVF
EECON1, CFGS
EECON1, RD
EEDATA, W
; Access EEPROM
; EEPROM Read
; W = EEDATA
EXAMPLE 7-2:
DATA EEPROM WRITE
MOVLW
MOVWF
MOVLW
MOVWF
MOVLW
MOVWF
BCF
BCF
BSF
BCF
MOVLW
MOVWF
MOVLW
MOVWF
BSF
DATA_EE_ADDR_LOW
EEADR
DATA_EE_ADDR_HI
EEADRH
DATA_EE_DATA
EEDATA
EECON1, EEPGD
EECON1, CFGS
EECON1, WREN
INTCON, GIE
55h
EECON2
0AAh
EECON2
EECON1, WR
INTCON, GIE
;
; Data Memory Address to write
;
;
;
; Data Memory Value to write
; Point to DATA memory
; Access EEPROM
; Enable writes
; Disable Interrupts
;
; Write 55h
;
; Write 0AAh
; Set WR bit to begin write
; Enable Interrupts
Required
Sequence
BSF
; User code execution
BCF
EECON1, WREN
; Disable writes on write complete (EEIF set)
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 107
PIC18(L)F2X/4XK22
The write initiate sequence and the WREN bit together
help prevent an accidental write during brown-out,
power glitch or software malfunction.
7.6
Operation During Code-Protect
Data EEPROM memory has its own code-protect bits in
Configuration Words. External read and write
operations are disabled if code protection is enabled.
7.8
Using the Data EEPROM
The microcontroller itself can both read and write to the
internal data EEPROM, regardless of the state of the
code-protect Configuration bit. Refer to Section 24.0
“Special Features of the CPU” for additional
information.
The data EEPROM is
a high-endurance, byte
addressable array that has been optimized for the
storage of frequently changing information (e.g.,
program variables or other data that are updated often).
When variables in one section change frequently, while
variables in another section do not change, it is possible
to exceed the total number of write cycles to the
EEPROM without exceeding the total number of write
cycles to a single byte. Refer to the Data EEPROM
Memory parameters in Section 27.0 “Electrical
Characteristics” for write cycle limits. If this is the case,
then an array refresh must be performed. For this
reason, variables that change infrequently (such as
constants, IDs, calibration, etc.) should be stored in
Flash program memory.
7.7
Protection Against Spurious Write
There are conditions when the user may not want to
write to the data EEPROM memory. To protect against
spurious EEPROM writes, various mechanisms have
been implemented. On power-up, the WREN bit is
cleared. In addition, writes to the EEPROM are blocked
during the Power-up Timer period (TPWRT).
A simple data EEPROM refresh routine is shown in
Example 7-3.
Note:
If data EEPROM is only used to store
constants and/or data that changes rarely,
an array refresh is likely not required. See
specification.
EXAMPLE 7-3:
DATA EEPROM REFRESH ROUTINE
CLRF
BCF
BCF
BCF
BSF
EEADR
; Start at address 0
; Set for memory
; Set for Data EEPROM
; Disable interrupts
; Enable writes
; Loop to refresh array
; Read current address
;
; Write 55h
;
; Write 0AAh
; Set WR bit to begin write
; Wait for write to complete
EECON1, CFGS
EECON1, EEPGD
INTCON, GIE
EECON1, WREN
Loop
BSF
EECON1, RD
55h
EECON2
0AAh
EECON2
EECON1, WR
EECON1, WR
$-2
MOVLW
MOVWF
MOVLW
MOVWF
BSF
BTFSC
BRA
INCFSZ
BRA
EEADR, F
LOOP
; Increment address
; Not zero, do it again
BCF
BSF
EECON1, WREN
INTCON, GIE
; Disable writes
; Enable interrupts
DS41412A-page 108
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
TABLE 7-1:
Name
REGISTERS ASSOCIATED WITH DATA EEPROM MEMORY
Register
on Page
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
INTCON
EEADR
EEADRH(1)
EEDATA
EECON2
EECON1
IPR2
GIE/GIEH PEIE/GIEL TMR0IE
INT0IE
RBIE
TMR0IF
INT0IF
RBIF
115
—
EEADR7
—
EEADR6 EEADR5 EEADR4 EEADR3 EEADR2 EEADR1 EEADR0
—
—
—
—
—
EEADR9 EEADR8
—
EEPROM Data Register
EEPROM Control Register 2 (not a physical register)
—
—
EEPGD
OSCFIP
OSCFIF
OSCFIE
CFGS
C1IP
C1IF
C1IE
—
FREE
EEIP
EEIF
EEIE
WRERR
WREN
WR
RD
106
128
119
124
C2IP
C2IF
C2IE
BCL1IP HLVDIP TMR3IP CCP2IP
BCL1IF HLVDIF TMR3IF CCP2IF
BCL1IE HLVDIE TMR3IE CCP2IE
PIR2
PIE2
Legend: — = unimplemented, read as ‘0’. Shaded bits are not used during EEPROM access.
Note 1: PIC18(L)F26K22 and PIC18(L)F46K22 only.
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 109
PIC18(L)F2X/4XK22
NOTES:
DS41412A-page 110
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
EXAMPLE 8-1:
8 x 8 UNSIGNED
MULTIPLY ROUTINE
8.0
8.1
8 x 8 HARDWARE MULTIPLIER
Introduction
MOVF
MULWF
ARG1, W
ARG2
;
; ARG1 * ARG2 ->
; PRODH:PRODL
All PIC18 devices include an 8 x 8 hardware multiplier
as part of the ALU. The multiplier performs an unsigned
operation and yields a 16-bit result that is stored in the
product register pair, PRODH:PRODL. The multiplier’s
operation does not affect any flags in the STATUS
register.
EXAMPLE 8-2:
8 x 8 SIGNED MULTIPLY
ROUTINE
MOVF
MULWF
ARG1, W
ARG2
Making multiplication a hardware operation allows it to
be completed in a single instruction cycle. This has the
advantages of higher computational throughput and
reduced code size for multiplication algorithms and
allows the PIC18 devices to be used in many applica-
tions previously reserved for digital signal processors.
A comparison of various hardware and software
multiply operations, along with the savings in memory
and execution time, is shown in Table .
; ARG1 * ARG2 ->
; PRODH:PRODL
; Test Sign Bit
; PRODH = PRODH
BTFSC
SUBWF
ARG2, SB
PRODH, F
;
- ARG1
MOVF
BTFSC
SUBWF
ARG2, W
ARG1, SB
PRODH, F
; Test Sign Bit
; PRODH = PRODH
;
- ARG2
8.2
Operation
Example 8-1 shows the instruction sequence for an 8 x 8
unsigned multiplication. Only one instruction is required
when one of the arguments is already loaded in the
WREG register.
Example 8-2 shows the sequence to do an 8 x 8 signed
multiplication. To account for the sign bits of the
arguments, each argument’s Most Significant bit (MSb)
is tested and the appropriate subtractions are done.
TABLE 8-1:
Routine
PERFORMANCE COMPARISON FOR VARIOUS MULTIPLY OPERATIONS
Program
Memory
(Words)
Time
Cycles
(Max)
Multiply Method
@ 64 MHz @ 40 MHz @ 10 MHz @ 4 MHz
Without hardware multiply
Hardware multiply
13
1
69
1
4.3 s
62.5 ns
5.7 s
375 ns
15.1 s
1.8 s
15.9 s
2.5 s
6.9 s
100 ns
9.1 s
600 ns
24.2 s
2.8 s
25.4 s
4.0 s
27.6 s
400 ns
36.4 s
2.4 s
69 s
1 s
8 x 8 unsigned
8 x 8 signed
Without hardware multiply
Hardware multiply
33
6
91
6
91 s
6 s
Without hardware multiply
Hardware multiply
21
28
52
35
242
28
254
40
96.8 s
11.2 s
102.6 s
16.0 s
242 s
28 s
254 s
40 s
16 x 16 unsigned
16 x 16 signed
Without hardware multiply
Hardware multiply
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 111
PIC18(L)F2X/4XK22
Example 8-3 shows the sequence to do a 16 x 16
unsigned multiplication. Equation 8-1 shows the
algorithm that is used. The 32-bit result is stored in four
registers (RES<3:0>).
EQUATION 8-2:
16 x 16 SIGNED
MULTIPLICATION
ALGORITHM
RES3:RES0 = ARG1H:ARG1L ARG2H:ARG2L
16
= (ARG1H ARG2H 2 ) +
(ARG1H ARG2L 2 ) +
(ARG1L ARG2H 2 ) +
(ARG1L ARG2L) +
(-1 ARG2H<7> ARG1H:ARG1L 2 ) +
(-1 ARG1H<7> ARG2H:ARG2L 2
8
EQUATION 8-1:
16 x 16 UNSIGNED
MULTIPLICATION
ALGORITHM
8
16
RES3:RES0
=
=
ARG1H:ARG1L ARG2H:ARG2L
16
)
16
(ARG1H ARG2H 2 ) +
8
(ARG1H ARG2L 2 ) +
8
(ARG1L ARG2H 2 ) +
EXAMPLE 8-4:
16 x 16 SIGNED
MULTIPLY ROUTINE
(ARG1L ARG2L)
MOVF
MULWF
ARG1L, W
ARG2L
; ARG1L * ARG2L ->
; PRODH:PRODL
;
;
EXAMPLE 8-3:
16 x 16 UNSIGNED
MULTIPLY ROUTINE
MOVFF
MOVFF
PRODH, RES1
PRODL, RES0
MOVF
MULWF
ARG1L, W
ARG2L
; ARG1L * ARG2L->
; PRODH:PRODL
;
;
;
;
MOVF
MULWF
ARG1H, W
ARG2H
MOVFF
MOVFF
PRODH, RES1
PRODL, RES0
; ARG1H * ARG2H ->
; PRODH:PRODL
;
;
;
;
MOVFF
MOVFF
PRODH, RES3
PRODL, RES2
MOVF
MULWF
ARG1H, W
ARG2H
; ARG1H * ARG2H->
; PRODH:PRODL
;
;
MOVF
MULWF
ARG1L, W
ARG2H
MOVFF
MOVFF
PRODH, RES3
PRODL, RES2
; ARG1L * ARG2H ->
; PRODH:PRODL
;
; Add cross
; products
;
;
;
MOVF
ADDWF
MOVF
ADDWFC RES2, F
CLRF WREG
ADDWFC RES3, F
PRODL, W
RES1, F
PRODH, W
MOVF
MULWF
ARG1L, W
ARG2H
; ARG1L * ARG2H->
; PRODH:PRODL
;
; Add cross
; products
;
;
;
MOVF
ADDWF
MOVF
PRODL, W
RES1, F
PRODH, W
;
ADDWFC RES2, F
CLRF WREG
ADDWFC RES3, F
MOVF
MULWF
ARG1H, W
ARG2L
;
; ARG1H * ARG2L ->
; PRODH:PRODL
;
; Add cross
; products
;
;
;
;
MOVF
ADDWF
MOVF
ADDWFC RES2, F
CLRF WREG
ADDWFC RES3, F
PRODL, W
RES1, F
PRODH, W
MOVF
MULWF
ARG1H, W
ARG2L
;
; ARG1H * ARG2L->
; PRODH:PRODL
;
; Add cross
; products
;
;
;
MOVF
ADDWF
MOVF
PRODL, W
RES1, F
PRODH, W
;
;
ADDWFC RES2, F
CLRF WREG
ADDWFC RES3, F
BTFSS
BRA
MOVF
SUBWF
MOVF
ARG2H, 7
SIGN_ARG1
ARG1L, W
RES2
; ARG2H:ARG2L neg?
; no, check ARG1
;
;
;
Example 8-4 shows the sequence to do a 16 x 16
signed multiply. Equation 8-2 shows the algorithm
used. The 32-bit result is stored in four registers
(RES<3:0>). To account for the sign bits of the argu-
ments, the MSb for each argument pair is tested and
the appropriate subtractions are done.
ARG1H, W
SUBWFB RES3
SIGN_ARG1
BTFSS
BRA
ARG1H, 7
CONT_CODE
ARG2L, W
RES2
; ARG1H:ARG1L neg?
; no, done
;
;
;
MOVF
SUBWF
MOVF
ARG2H, W
SUBWFB RES3
;
CONT_CODE
:
DS41412A-page 112
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
9.2
Interrupt Priority
9.0
INTERRUPTS
The interrupt priority feature is enabled by setting the
IPEN bit of the RCON register. When interrupt priority
is enabled the GIE/GIEH and PEIE/GIEL global inter-
rupt enable bits of Compatibility mode are replaced by
the GIEH high priority, and GIEL low priority, global
interrupt enables. When set, the GIEH bit of the
INTCON register enables all interrupts that have their
associated IPRx register or INTCONx register priority
bit set (high priority). When clear, the GIEH bit disables
all interrupt sources including those selected as low pri-
ority. When clear, the GIEL bit of the INTCON register
disables only the interrupts that have their associated
priority bit cleared (low priority). When set, the GIEL bit
enables the low priority sources when the GIEH bit is
also set.
The PIC18(L)F2X/4XK22 devices have multiple
interrupt sources and an interrupt priority feature that
allows most interrupt sources to be assigned a high or
low priority level (INT0 does not have a priority bit, it is
always a high priority). The high priority interrupt vector
is at 0008h and the low priority interrupt vector is at
0018h. A high priority interrupt event will interrupt a low
priority interrupt that may be in progress.
There are 19 registers used to control interrupt
operation.
These registers are:
• INTCON, INTCON2, INTCON3
• PIR1, PIR2, PIR3, PIR4, PIR5
• PIE1, PIE2, PIE3, PIE4, PIE5
• IPR1, IPR2, IPR3, IPR4, IPR5
• RCON
When the interrupt flag, enable bit and appropriate
Global Interrupt Enable (GIE) bit are all set, the
interrupt will vector immediately to address 0008h for
high priority, or 0018h for low priority, depending on
level of the interrupting source’s priority bit. Individual
interrupts can be disabled through their corresponding
interrupt enable bits.
It is recommended that the Microchip header files sup-
plied with MPLAB® IDE be used for the symbolic bit
names in these registers. This allows the assembler/
compiler to automatically take care of the placement of
these bits within the specified register.
9.3
Interrupt Response
In general, interrupt sources have three bits to control
their operation. They are:
When an interrupt is responded to, the Global Interrupt
Enable bit is cleared to disable further interrupts. The
GIE/GIEH bit is the global interrupt enable when the
IPEN bit is cleared. When the IPEN bit is set, enabling
interrupt priority levels, the GIEH bit is the high priority
global interrupt enable and the GIEL bit is the low
priority global interrupt enable. High priority interrupt
sources can interrupt a low priority interrupt. Low
priority interrupts are not processed while high priority
interrupts are in progress.
• Flag bit to indicate that an interrupt event
occurred
• Enable bit that allows program execution to
branch to the interrupt vector address when the
flag bit is set
• Priority bit to select high priority or low priority
9.1
Mid-Range Compatibility
When the IPEN bit is cleared (default state), the interrupt
priority feature is disabled and interrupts are compatible
with PIC® microcontroller mid-range devices. In
Compatibility mode, the interrupt priority bits of the IPRx
registers have no effect. The PEIE/GIEL bit of the
INTCON register is the global interrupt enable for the
peripherals. The PEIE/GIEL bit disables only the
peripheral interrupt sources and enables the peripheral
interrupt sources when the GIE/GIEH bit is also set. The
GIE/GIEH bit of the INTCON register is the global
interrupt enable which enables all non-peripheral
interrupt sources and disables all interrupt sources,
including the peripherals. All interrupts branch to
address 0008h in Compatibility mode.
The return address is pushed onto the stack and the
PC is loaded with the interrupt vector address (0008h
or 0018h). Once in the Interrupt Service Routine, the
source(s) of the interrupt can be determined by polling
the interrupt flag bits in the INTCONx and PIRx
registers. The interrupt flag bits must be cleared by
software before re-enabling interrupts to avoid
repeating the same interrupt.
The “return from interrupt” instruction, RETFIE, exits
the interrupt routine and sets the GIE/GIEH bit (GIEH
or GIEL if priority levels are used), which re-enables
interrupts.
For external interrupt events, such as the INT pins or
the PORTB interrupt-on-change, the interrupt latency
will be three to four instruction cycles. The exact
latency is the same for one-cycle or two-cycle
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 113
PIC18(L)F2X/4XK22
instructions. Individual interrupt flag bits are set,
regardless of the status of their corresponding enable
bits or the Global Interrupt Enable bit.
Note:
Do not use the MOVFFinstruction to modify
any of the interrupt control registers while
any interrupt is enabled. Doing so may
cause erratic microcontroller behavior.
FIGURE 9-1:
PIC18 INTERRUPT LOGIC
Wake-up if in
Idle or Sleep modes
INT0IF
INT0IE
TMR0IF
TMR0IE
TMR0IP
RBIF
RBIE
RBIP
(1)
Interrupt to CPU
Vector to Location
0008h
INT1IF
INT1IE
INT1IP
INT2IF
INT2IE
INT2IP
PIR1<6:0>
PIE1<6:0>
IPR1<6:0>
PIR2<7:0>
PIE2<7:0>
IPR2<7:0>
GIEH/GIE
PIR3<7:0>
PIE3<7:0>
IPR3<7:0>
IPEN
PIR4<2:0>
PIE4<2:0>
IPR4<2:0>
IPEN
GIEL/PEIE
PIR5<2:0>
PIE5<2:0>
IPR5<2:0>
IPEN
High Priority Interrupt Generation
Low Priority Interrupt Generation
PIR1<6:0>
PIE1<6:0>
IPR1<6:0>
PIR2<7:0>
PIE2<7:0>
IPR2<7:0>
PIR3<7:0>
PIE3<7:0>
IPR3<7:0>
Interrupt to CPU
Vector to Location
0018h
TMR0IF
TMR0IE
TMR0IP
PIR4<2:0>
PIE4<2:0>
IPR4<2:0>
PIR5<2:0>
PIE5<2:0>
(1)
RBIF
RBIE
RBIP
GIEH/GIE
GIEL/PEIE
IPR5<2:0>
INT1IF
INT1IE
INT1IP
INT2IF
INT2IE
INT2IP
Note 1: The RBIF interrupt also requires the individual pin IOCB enables.
DS41412A-page 114
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
9.4
INTCON Registers
Note:
Interrupt flag bits are set when an interrupt
condition occurs, regardless of the state of
its corresponding enable bit or the global
enable bit. User software should ensure
the appropriate interrupt flag bits are clear
prior to enabling an interrupt. This feature
allows for software polling.
The INTCON registers are readable and writable
registers, which contain various enable, priority and
flag bits.
REGISTER 9-1:
INTCON: INTERRUPT CONTROL REGISTER
R/W-0
GIE/GIEH
bit 7
R/W-0
R/W-0
R/W-0
R/W-0
RBIE
R/W-0
R/W-0
INT0IF
R/W-x
RBIF
PEIE/GIEL
TMR0IE
INT0IE
TMR0IF
bit 0
Legend:
R = Readable bit
-n = Value at POR
W = Writable bit
‘1’ = Bit is set
U = Unimplemented bit, read as ‘0’
‘0’ = Bit is cleared
x = Bit is unknown
bit 7
GIE/GIEH: Global Interrupt Enable bit
When IPEN = 0:
1= Enables all unmasked interrupts
0= Disables all interrupts including peripherals
When IPEN = 1:
1= Enables all high priority interrupts
0= Disables all interrupts including low priority
bit 6
PEIE/GIEL: Peripheral Interrupt Enable bit
When IPEN = 0:
1= Enables all unmasked peripheral interrupts
0= Disables all peripheral interrupts
When IPEN = 1:
1= Enables all low priority interrupts
0= Disables all low priority interrupts
bit 5
bit 4
bit 3
bit 2
bit 1
bit 0
TMR0IE: TMR0 Overflow Interrupt Enable bit
1= Enables the TMR0 overflow interrupt
0= Disables the TMR0 overflow interrupt
INT0IE: INT0 External Interrupt Enable bit
1= Enables the INT0 external interrupt
0= Disables the INT0 external interrupt
(2)
RBIE: Port B Interrupt-On-Change (IOCx) Interrupt Enable bit
1= Enables the IOCx port change interrupt
0= Disables the IOCx port change interrupt
TMR0IF: TMR0 Overflow Interrupt Flag bit
1= TMR0 register has overflowed (must be cleared by software)
0= TMR0 register did not overflow
INT0IF: INT0 External Interrupt Flag bit
1= The INT0 external interrupt occurred (must be cleared by software)
0= The INT0 external interrupt did not occur
(1)
RBIF: Port B Interrupt-On-Change (IOCx) Interrupt Flag bit
1= At least one of the IOC<3:0> (RB<7:4>) pins changed state (must be cleared by software)
0= None of the IOC<3:0> (RB<7:4>) pins have changed state
Note 1: A mismatch condition will continue to set the RBIF bit. Reading PORTB will end the
mismatch condition and allow the bit to be cleared.
2: RB port change interrupts also require the individual pin IOCB enables.
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 115
PIC18(L)F2X/4XK22
REGISTER 9-2:
INTCON2: INTERRUPT CONTROL 2 REGISTER
R/W-1
RBPU
R/W-1
R/W-1
R/W-1
U-0
—
R/W-1
U-0
—
R/W-1
RBIP
INTEDG0
INTEDG1
INTEDG2
TMR0IP
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
‘1’ = Bit is set
U = Unimplemented bit, read as ‘0’
‘0’ = Bit is cleared x = Bit is unknown
-n = Value at POR
bit 7
RBPU: PORTB Pull-up Enable bit
1= All PORTB pull-ups are disabled
0= PORTB pull-ups are enabled provided that the pin is an input and the corresponding WPUB bit is
set.
bit 6
bit 5
bit 4
INTEDG0: External Interrupt 0 Edge Select bit
1= Interrupt on rising edge
0= Interrupt on falling edge
INTEDG1: External Interrupt 1 Edge Select bit
1= Interrupt on rising edge
0= Interrupt on falling edge
INTEDG2: External Interrupt 2 Edge Select bit
1= Interrupt on rising edge
0= Interrupt on falling edge
bit 3
bit 2
Unimplemented: Read as ‘0’
TMR0IP: TMR0 Overflow Interrupt Priority bit
1= High priority
0= Low priority
bit 1
bit 0
Unimplemented: Read as ‘0’
RBIP: RB Port Change Interrupt Priority bit
1= High priority
0= Low priority
Note:
Interrupt flag bits are set when an interrupt
condition occurs, regardless of the state of
its corresponding enable bit or the global
enable bit. User software should ensure
the appropriate interrupt flag bits are clear
prior to enabling an interrupt. This feature
allows for software polling.
DS41412A-page 116
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
REGISTER 9-3:
INTCON3: INTERRUPT CONTROL 3 REGISTER
R/W-1
INT2IP
bit 7
R/W-1
U-0
—
R/W-0
R/W-0
U-0
—
R/W-0
INT2IF
R/W-0
INT1IF
INT1IP
INT2IE
INT1IE
bit 0
Legend:
R = Readable bit
-n = Value at POR
W = Writable bit
‘1’ = Bit is set
U = Unimplemented bit, read as ‘0’
‘0’ = Bit is cleared x = Bit is unknown
bit 7
bit 6
INT2IP: INT2 External Interrupt Priority bit
1= High priority
0= Low priority
INT1IP: INT1 External Interrupt Priority bit
1= High priority
0= Low priority
bit 5
bit 4
Unimplemented: Read as ‘0’
INT2IE: INT2 External Interrupt Enable bit
1= Enables the INT2 external interrupt
0= Disables the INT2 external interrupt
bit 3
INT1IE: INT1 External Interrupt Enable bit
1= Enables the INT1 external interrupt
0= Disables the INT1 external interrupt
bit 2
bit 1
Unimplemented: Read as ‘0’
INT2IF: INT2 External Interrupt Flag bit
1= The INT2 external interrupt occurred (must be cleared by software)
0= The INT2 external interrupt did not occur
bit 0
INT1IF: INT1 External Interrupt Flag bit
1= The INT1 external interrupt occurred (must be cleared by software)
0= The INT1 external interrupt did not occur
Note:
Interrupt flag bits are set when an interrupt
condition occurs, regardless of the state of
its corresponding enable bit or the global
enable bit. User software should ensure
the appropriate interrupt flag bits are clear
prior to enabling an interrupt. This feature
allows for software polling.
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 117
PIC18(L)F2X/4XK22
9.5
PIR Registers
Note 1: Interrupt flag bits are set when an interrupt
condition occurs, regardless of the state
of its corresponding enable bit or the
Global Interrupt Enable bit, GIE/GIEH of
the INTCON register.
The PIR registers contain the individual flag bits for the
peripheral interrupts. Due to the number of peripheral
interrupt sources, there are five Peripheral Interrupt
Request Flag registers (PIR1, PIR2, PIR3, PIR4 and
PIR5).
2: User software should ensure the appropri-
ate interrupt flag bits are cleared prior to
enabling an interrupt and after servicing
that interrupt.
REGISTER 9-4:
PIR1: PERIPHERAL INTERRUPT REQUEST (FLAG) REGISTER 1
U-0
—
R/W-0
ADIF
R-0
R-0
R/W-0
R/W-0
R/W-0
R/W-0
RC1IF
TX1IF
SSP1IF
CCP1IF
TMR2IF
TMR1IF
bit 7
bit 0
Legend:
R = Readable bit
-n = Value at POR
W = Writable bit
‘1’ = Bit is set
U = Unimplemented bit, read as ‘0’
‘0’ = Bit is cleared x = Bit is unknown
bit 7
bit 6
Unimplemented: Read as ‘0’.
ADIF: A/D Converter Interrupt Flag bit
1= An A/D conversion completed (must be cleared by software)
0= The A/D conversion is not complete or has not been started
bit 5
bit 4
bit 3
bit 2
RC1IF: EUSART1 Receive Interrupt Flag bit
1= The EUSART1 receive buffer, RCREG1, is full (cleared when RCREG1 is read)
0= The EUSART1 receive buffer is empty
TX1IF: EUSART1 Transmit Interrupt Flag bit
1= The EUSART1 transmit buffer, TXREG1, is empty (cleared when TXREG1 is written)
0= The EUSART1 transmit buffer is full
SSP1IF: Master Synchronous Serial Port 1 Interrupt Flag bit
1= The transmission/reception is complete (must be cleared by software)
0= Waiting to transmit/receive
CCP1IF: CCP1 Interrupt Flag bit
Capture mode:
1= A TMR1 register capture occurred (must be cleared by software)
0= No TMR1 register capture occurred
Compare mode:
1= A TMR1 register compare match occurred (must be cleared by software)
0= No TMR1 register compare match occurred
PWM mode:
Unused in this mode
bit 1
bit 0
TMR2IF: TMR2 to PR2 Match Interrupt Flag bit
1= TMR2 to PR2 match occurred (must be cleared by software)
0= No TMR2 to PR2 match occurred
TMR1IF: TMR1 Overflow Interrupt Flag bit
1= TMR1 register overflowed (must be cleared by software)
0= TMR1 register did not overflow
DS41412A-page 118
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
REGISTER 9-5:
PIR2: PERIPHERAL INTERRUPT REQUEST (FLAG) REGISTER 2
R/W-0
OSCFIF
bit 7
R/W-0
C1IF
R/W-0
C2IF
R/W-0
EEIF
R/W-0
R/W-0
R/W-0
R/W-0
BCL1IF
HLVDIF
TMR3IF
CCP2IF
bit 0
Legend:
R = Readable bit
-n = Value at POR
W = Writable bit
‘1’ = Bit is set
U = Unimplemented bit, read as ‘0’
‘0’ = Bit is cleared x = Bit is unknown
bit 7
bit 6
bit 5
bit 4
bit 3
bit 2
OSCFIF: Oscillator Fail Interrupt Flag bit
1= Device oscillator failed, clock input has changed to HFINTOSC (must be cleared by software)
0= Device clock operating
C1IF: Comparator C1 Interrupt Flag bit
1= Comparator C1 output has changed (must be cleared by software)
0= Comparator C1 output has not changed
C2IF: Comparator C2 Interrupt Flag bit
1= Comparator C2 output has changed (must be cleared by software)
0= Comparator C2 output has not changed
EEIF: Data EEPROM/Flash Write Operation Interrupt Flag bit
1= The write operation is complete (must be cleared by software)
0= The write operation is not complete or has not been started
BCL1IF: MSSP1 Bus Collision Interrupt Flag bit
1= A bus collision occurred (must be cleared by software)
0= No bus collision occurred
HLVDIF: Low-Voltage Detect Interrupt Flag bit
1= A low-voltage condition occurred (direction determined by the VDIRMAG bit of the
HLVDCON register)
0= A low-voltage condition has not occurred
bit 1
bit 0
TMR3IF: TMR3 Overflow Interrupt Flag bit
1= TMR3 register overflowed (must be cleared by software)
0= TMR3 register did not overflow
CCP2IF: CCP2 Interrupt Flag bit
Capture mode:
1= A TMR1 register capture occurred (must be cleared by software)
0= No TMR1 register capture occurred
Compare mode:
1= A TMR1 register compare match occurred (must be cleared by software)
0= No TMR1 register compare match occurred
PWM mode:
Unused in this mode.
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 119
PIC18(L)F2X/4XK22
REGISTER 9-6:
R/W-0
PIR3: PERIPHERAL INTERRUPT (FLAG) REGISTER 3
R/W-0
R/W-0
RC2IF
R/W-0
TX2IF
R/W-0
R/W-0
R/W-0
R/W-0
SSP2IF
BCL2IF
CTMUIF
TMR5GIF
TMR3GIF
TMR1GIF
bit 7
bit 0
Legend:
R = Readable bit
-n = Value at POR
W = Writable bit
‘1’ = Bit is set
U = Unimplemented bit, read as ‘0’
‘0’ = Bit is cleared x = Bit is unknown
bit 7
bit 6
SSP2IF: Synchronous Serial Port Interrupt Flag bit
1= The transmission/reception is complete (must be cleared in software)
0= Waiting to transmit/receive
BCL2IF: MSSP2 Bus Collision Interrupt Flag bit
1= A bus collision has occurred while the SSP2 module configured in I2C master was transmitting
(must be cleared in software)
0= No bus collision occurred
bit 5
bit 4
bit 3
bit 2
bit 1
bit 0
RC2IF: EUSART2 Receive Interrupt Flag bit
1= The EUSART2 receive buffer, RCREG2, is full (cleared by reading RCREG2)
0= The EUSART2 receive buffer is empty
TX2IF: EUSART2 Transmit Interrupt Flag bit
1= The EUSART2 transmit buffer, TXREG2, is empty (cleared by writing TXREG2)
0= The EUSART2 transmit buffer is full
CTMUIF: CTMU Interrupt Flag bit
1= CTMU interrupt occurred (must be cleared in software)
0= No CTMU interrupt occurred
TMR5GIF: TMR5 Gate Interrupt Flag bits
1= TMR gate interrupt occurred (must be cleared in software)
0= No TMR gate occurred
TMR3GIF: TMR3 Gate Interrupt Flag bits
1= TMR gate interrupt occurred (must be cleared in software)
0= No TMR gate occurred
TMR1GIF: TMR1 Gate Interrupt Flag bits
1= TMR gate interrupt occurred (must be cleared in software)
0= No TMR gate occurred
DS41412A-page 120
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
REGISTER 9-7:
PIR4: PERIPHERAL INTERRUPT (FLAG) REGISTER 4
U-0
—
U-0
—
U-0
—
U-0
—
U-0
—
R/W-0
R/W-0
R/W-0
CCP5IF
CCP4IF
CCP3IF
bit 7
bit 0
Legend:
R = Readable bit
-n = Value at POR
W = Writable bit
‘1’ = Bit is set
U = Unimplemented bit, read as ‘0’
‘0’ = Bit is cleared x = Bit is unknown
bit 7-3
bit 2
Unimplemented: Read as ‘0’
CCP5IF: CCP5 Interrupt Flag bits
Capture mode:
1= A TMR register capture occurred (must be cleared in software)
0= No TMR register capture occurred
Compare mode:
1= A TMR register compare match occurred (must be cleared in software)
0= No TMR register compare match occurred
PWM mode:
Unused in PWM mode.
bit 1
CCP4IF: CCP4 Interrupt Flag bits
Capture mode:
1= A TMR register capture occurred (must be cleared in software)
0= No TMR register capture occurred
Compare mode:
1= A TMR register compare match occurred (must be cleared in software)
0= No TMR register compare match occurred
PWM mode:
Unused in PWM mode.
bit 0
CCP3IF: ECCP3 Interrupt Flag bits
Capture mode:
1= A TMR register capture occurred (must be cleared in software)
0= No TMR register capture occurred
Compare mode:
1= A TMR register compare match occurred (must be cleared in software)
0= No TMR register compare match occurred
PWM mode:
Unused in PWM mode.
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 121
PIC18(L)F2X/4XK22
REGISTER 9-8:
PIR5: PERIPHERAL INTERRUPT (FLAG) REGISTER 5
U-0
—
U-0
—
U-0
—
U-0
—
U-0
—
R/W-0
R/W-0
R/W-0
TMR6IF
TMR5IF
TMR4IF
bit 7
bit 0
Legend:
R = Readable bit
-n = Value at POR
W = Writable bit
‘1’ = Bit is set
U = Unimplemented bit, read as ‘0’
‘0’ = Bit is cleared x = Bit is unknown
bit 7-3
bit 2
Unimplemented: Read as ‘0’
TMR6IF: TMR6 to PR6 Match Interrupt Flag bit
1= TMR6 to PR6 match occurred (must be cleared in software)
0= No TMR6 to PR6 match occurred
bit 1
bit 0
TMR5IF: TMR5 Overflow Interrupt Flag bit
1= TMR5 register overflowed (must be cleared in software)
0= TMR5 register did not overflow
TMR4IF: TMR4 to PR4 Match Interrupt Flag bit
1= TMR4 to PR4 match occurred (must be cleared in software)
0= No TMR4 to PR4 match occurred
DS41412A-page 122
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
9.6
PIE Registers
The PIE registers contain the individual enable bits for
the peripheral interrupts. Due to the number of
peripheral interrupt sources, there are five Peripheral
Interrupt Enable registers (PIE1, PIE2, PIE3, PIE4 and
PIE5). When IPEN = 0, the PEIE/GIEL bit must be set to
enable any of these peripheral interrupts.
REGISTER 9-9:
PIE1: PERIPHERAL INTERRUPT ENABLE (FLAG) REGISTER 1
U-0
—
R/W-0
ADIE
R/W-0
RC1IE
R/W-0
TX1IE
R/W-0
R/W-0
R/W-0
R/W-0
SSP1IE
CCP1IE
TMR2IE
TMR1IE
bit 7
bit 0
Legend:
R = Readable bit
-n = Value at POR
W = Writable bit
‘1’ = Bit is set
U = Unimplemented bit, read as ‘0’
‘0’ = Bit is cleared x = Bit is unknown
bit 7
bit 6
Unimplemented: Read as ‘0’.
ADIE: A/D Converter Interrupt Enable bit
1= Enables the A/D interrupt
0= Disables the A/D interrupt
bit 5
bit 4
bit 3
bit 2
bit 1
bit 0
RC1IE: EUSART1 Receive Interrupt Enable bit
1= Enables the EUSART1 receive interrupt
0= Disables the EUSART1 receive interrupt
TX1IE: EUSART1 Transmit Interrupt Enable bit
1= Enables the EUSART1 transmit interrupt
0= Disables the EUSART1 transmit interrupt
SSP1IE: Master Synchronous Serial Port 1 Interrupt Enable bit
1= Enables the MSSP1 interrupt
0= Disables the MSSP1 interrupt
CCP1IE: CCP1 Interrupt Enable bit
1= Enables the CCP1 interrupt
0= Disables the CCP1 interrupt
TMR2IE: TMR2 to PR2 Match Interrupt Enable bit
1= Enables the TMR2 to PR2 match interrupt
0= Disables the TMR2 to PR2 match interrupt
TMR1IE: TMR1 Overflow Interrupt Enable bit
1= Enables the TMR1 overflow interrupt
0= Disables the TMR1 overflow interrupt
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 123
PIC18(L)F2X/4XK22
REGISTER 9-10: PIE2: PERIPHERAL INTERRUPT ENABLE (FLAG) REGISTER 2
R/W-0
R/W-0
C1IE
R/W-0
C2IE
R/W-0
EEIE
R/W-0
R/W-0
R/W-0
R/W-0
OSCFIE
BCL1IE
HLVDIE
TMR3IE
CCP2IE
bit 7
bit 0
Legend:
R = Readable bit
-n = Value at POR
W = Writable bit
‘1’ = Bit is set
U = Unimplemented bit, read as ‘0’
‘0’ = Bit is cleared x = Bit is unknown
bit 7
bit 6
bit 5
bit 4
bit 3
bit 2
bit 1
bit 0
OSCFIE: Oscillator Fail Interrupt Enable bit
1= Enabled
0= Disabled
C1IE: Comparator C1 Interrupt Enable bit
1= Enabled
0= Disabled
C2IE: Comparator C2 Interrupt Enable bit
1= Enabled
0= Disabled
EEIE: Data EEPROM/Flash Write Operation Interrupt Enable bit
1= Enabled
0= Disabled
BCL1IE: MSSP1 Bus Collision Interrupt Enable bit
1= Enabled
0= Disabled
HLVDIE: Low-Voltage Detect Interrupt Enable bit
1= Enabled
0= Disabled
TMR3IE: TMR3 Overflow Interrupt Enable bit
1= Enabled
0= Disabled
CCP2IE: CCP2 Interrupt Enable bit
1= Enabled
0= Disabled
DS41412A-page 124
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
REGISTER 9-11: PIE3: PERIPHERAL INTERRUPT ENABLE (FLAG) REGISTER 3
R/W-0
R/W-0
R/W-0
RC2IE
R/W-0
TX2IE
R/W-0
R/W-0
R/W-0
R/W-0
SSP2IE
BCL2IE
CTMUIE
TMR5GIE
TMR3GIE
TMR1GIE
bit 7
bit 0
Legend:
R = Readable bit
-n = Value at POR
W = Writable bit
‘1’ = Bit is set
U = Unimplemented bit, read as ‘0’
‘0’ = Bit is cleared x = Bit is unknown
bit 7
bit 6
bit 5
bit 4
bit 3
bit 2
bit 1
bit 0
SSP2IE: TMR5 Gate Interrupt Enable bit
1= Enabled
0= Disabled
BCL2IE: Bus Collision Interrupt Enable bit
1= Enabled
0= Disabled
RC2IE: EUSART2 Receive Interrupt Enable bit
1= Enabled
0= Disabled
TX2IE: EUSART2 Transmit Interrupt Enable bit
1= Enabled
0= Disabled
CTMUIE: CTMU Interrupt Enable bit
1= Enabled
0= Disabled
TMR5GIE: TMR5 Gate Interrupt Enable bit
1= Enabled
0= Disabled
TMR3GIE: TMR3 Gate Interrupt Enable bit
1= Enabled
0= Disabled
TMR1GIE: TMR1 Gate Interrupt Enable bit
1= Enabled
0= Disabled
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 125
PIC18(L)F2X/4XK22
REGISTER 9-12: PIE4: PERIPHERAL INTERRUPT ENABLE (FLAG) REGISTER 4
U-0
—
U-0
—
U-0
—
U-0
—
U-0
—
R/W-0
R/W-0
R/W-0
CCP5IE
CCP4IE
CCP3IE
bit 7
bit 0
Legend:
R = Readable bit
-n = Value at POR
W = Writable bit
‘1’ = Bit is set
U = Unimplemented bit, read as ‘0’
‘0’ = Bit is cleared x = Bit is unknown
bit 7-3
bit 2
Unimplemented: Read as ‘0’
CCP5IE: CCP5 Interrupt Enable bit
1= Enabled
0= Disabled
bit 1
bit 0
CCP4IE: CCP4 Interrupt Enable bit
1= Enabled
0= Disabled
CCP3IE: CCP3 Interrupt Enable bit
1= Enabled
0= Disabled
REGISTER 9-13: PIE5: PERIPHERAL INTERRUPT ENABLE (FLAG) REGISTER 5
U-0
—
U-0
—
U-0
—
U-0
—
U-0
—
R/W-0
R/W-0
R/W-0
TMR6IE
TMR5IE
TMR4IE
bit 7
bit 0
Legend:
R = Readable bit
-n = Value at POR
W = Writable bit
‘1’ = Bit is set
U = Unimplemented bit, read as ‘0’
‘0’ = Bit is cleared x = Bit is unknown
bit 7-3
bit 2
Unimplemented: Read as ‘0’
TMR6IE: TMR6 to PR6 Match Interrupt Enable bit
1= Enables the TMR6 to PR6 match interrupt
0= Disables the TMR6 to PR6 match interrupt
bit 1
bit 0
TMR5IE: TMR5 Overflow Interrupt Enable bit
1= Enables the TMR5 overflow interrupt
0= Disables the TMR5 overflow interrupt
TMR4IE: TMR4 to PR4 Match Interrupt Enable bit
1= Enables the TMR4 to PR4 match interrupt
0= Disables the TMR4 to PR4 match interrupt
DS41412A-page 126
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
9.7
IPR Registers
The IPR registers contain the individual priority bits for the
peripheral interrupts. Due to the number of peripheral
interrupt sources, there are five Peripheral Interrupt
Priority registers (IPR1, IPR2, IPR3, IPR4 and IPR5).
Using the priority bits requires that the Interrupt Priority
Enable (IPEN) bit be set.
REGISTER 9-14: IPR1: PERIPHERAL INTERRUPT PRIORITY REGISTER 1
U-0
—
R/W-1
ADIP
R/W-1
RC1IP
R/W-1
TX1IP
R/W-1
R/W-1
R/W-1
R/W-1
SSP1IP
CCP1IP
TMR2IP
TMR1IP
bit 7
bit 0
Legend:
R = Readable bit
-n = Value at POR
W = Writable bit
‘1’ = Bit is set
U = Unimplemented bit, read as ‘0’
‘0’ = Bit is cleared x = Bit is unknown
bit 7
bit 6
Unimplemented: Read as ‘0’
ADIP: A/D Converter Interrupt Priority bit
1= High priority
0= Low priority
bit 5
bit 4
RC1IP: EUSART1 Receive Interrupt Priority bit
1= High priority
0= Low priority
TX1IP: EUSART1 Transmit Interrupt Priority bit
1= High priority
0= Low priority
bit 3
bit 2
bit 1
bit 0
SSP1IP: Master Synchronous Serial Port 1 Interrupt Priority bit
1= High priority
0= Low priority
CCP1IP: CCP1 Interrupt Priority bit
1= High priority
0= Low priority
TMR2IP: TMR2 to PR2 Match Interrupt Priority bit
1= High priority
0= Low priority
TMR1IP: TMR1 Overflow Interrupt Priority bit
1= High priority
0= Low priority
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 127
PIC18(L)F2X/4XK22
REGISTER 9-15: IPR2: PERIPHERAL INTERRUPT PRIORITY REGISTER 2
R/W-1
R/W-1
C1IP
R/W-1
C2IP
R/W-1
EEIP
R/W-1
R/W-1
R/W-1
R/W-1
OSCFIP
BCL1IP
HLVDIP
TMR3IP
CCP2IP
bit 7
bit 0
Legend:
R = Readable bit
-n = Value at POR
W = Writable bit
‘1’ = Bit is set
U = Unimplemented bit, read as ‘0’
‘0’ = Bit is cleared x = Bit is unknown
bit 7
bit 6
bit 5
bit 4
bit 3
bit 2
bit 1
bit 0
OSCFIP: Oscillator Fail Interrupt Priority bit
1= High priority
0= Low priority
C1IP: Comparator C1 Interrupt Priority bit
1= High priority
0= Low priority
C2IP: Comparator C2 Interrupt Priority bit
1= High priority
0= Low priority
EEIP: Data EEPROM/Flash Write Operation Interrupt Priority bit
1= High priority
0= Low priority
BCL1IP: MSSP1 Bus Collision Interrupt Priority bit
1= High priority
0= Low priority
HLVDIP: Low-Voltage Detect Interrupt Priority bit
1= High priority
0= Low priority
TMR3IP: TMR3 Overflow Interrupt Priority bit
1= High priority
0= Low priority
CCP2IP: CCP2 Interrupt Priority bit
1= High priority
0= Low priority
DS41412A-page 128
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
REGISTER 9-16: IPR3: PERIPHERAL INTERRUPT PRIORITY REGISTER 3
R/W-0
R/W-0
R/W-0
RC2IP
R/W-0
TX2IP
R/W-0
R/W-0
R/W-0
R/W-0
SSP2IP
BCL2IP
CTMUIP
TMR5GIP
TMR3GIP
TMR1GIP
bit 7
bit 0
Legend:
R = Readable bit
-n = Value at POR
W = Writable bit
‘1’ = Bit is set
U = Unimplemented bit, read as ‘0’
‘0’ = Bit is cleared x = Bit is unknown
bit 7
bit 6
bit 5
bit 4
bit 3
bit 2
bit 1
bit 0
SSP2IP: Synchronous Serial Port 2 Interrupt Priority bit
1= High priority
0= Low priority
BCL2IP: Bus Collision 2 Interrupt Priority bit
1= High priority
0= Low priority
RC2IP: EUSART2 Receive Interrupt Priority bit
1= High priority
0= Low priority
TX2IP: EUSART2 Transmit Interrupt Priority bit
1= High priority
0= Low priority
CTMUIP: CTMU Interrupt Priority bit
1= High priority
0= Low priority
TMR5GIP: TMR5 Gate Interrupt Priority bit
1= High priority
0= Low priority
TMR3GIP: TMR3 Gate Interrupt Priority bit
1= High priority
0= Low priority
TMR1GIP: TMR1 Gate Interrupt Priority bit
1= High priority
0= Low priority
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 129
PIC18(L)F2X/4XK22
REGISTER 9-17: IPR4: PERIPHERAL INTERRUPT PRIORITY REGISTER 4
U-0
—
U-0
—
U-0
—
U-0
—
U-0
—
R/W-0
R/W-0
R/W-0
CCP5IP
CCP4IP
CCP3IP
bit 7
bit 0
Legend:
R = Readable bit
-n = Value at POR
W = Writable bit
‘1’ = Bit is set
U = Unimplemented bit, read as ‘0’
‘0’ = Bit is cleared x = Bit is unknown
bit 7-3
bit 2
Unimplemented: Read as ‘0’
CCP5IP: CCP5 Interrupt Priority bit
1= High priority
0= Low priority
bit 1
bit 0
CCP4IP: CCP4 Interrupt Priority bit
1= High priority
0= Low priority
CCP3IP: CCP3 Interrupt Priority bit
1= High priority
0= Low priority
REGISTER 9-18: IPR5: PERIPHERAL INTERRUPT PRIORITY REGISTER 5
U-0
—
U-0
—
U-0
—
U-0
—
U-0
—
R/W-0
R/W-0
R/W-0
TMR6IP
TMR5IP
TMR4IP
bit 7
bit 0
Legend:
R = Readable bit
-n = Value at POR
W = Writable bit
‘1’ = Bit is set
U = Unimplemented bit, read as ‘0’
‘0’ = Bit is cleared x = Bit is unknown
bit 7-3
bit 2
Unimplemented: Read as ‘0’
TMR6IP: TMR6 to PR6 Match Interrupt Priority bit
1= High priority
0= Low priority
bit 1
bit 0
TMR5IP: TMR5 Overflow Interrupt Priority bit
1= High priority
0= Low priority
TMR4IP: TMR4 to PR4 Match Interrupt Priority bit
1= High priority
0= Low priority
DS41412A-page 130
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
9.8
INTn Pin Interrupts
9.9
TMR0 Interrupt
External interrupts on the RB0/INT0, RB1/INT1 and
RB2/INT2 pins are edge-triggered. If the corresponding
INTEDGx bit in the INTCON2 register is set (= 1), the
interrupt is triggered by a rising edge; if the bit is clear,
the trigger is on the falling edge. When a valid edge
appears on the RBx/INTx pin, the corresponding flag
bit, INTxF, is set. This interrupt can be disabled by
clearing the corresponding enable bit, INTxE. Flag bit,
INTxF, must be cleared by software in the Interrupt
Service Routine before re-enabling the interrupt.
In 8-bit mode (which is the default), an overflow in the
TMR0 register (FFh 00h) will set flag bit, TMR0IF. In
16-bit mode, an overflow in the TMR0H:TMR0L regis-
ter pair (FFFFh 0000h) will set TMR0IF. The interrupt
can be enabled/disabled by setting/clearing enable bit,
TMR0IE of the INTCON register. Interrupt priority for
Timer0 is determined by the value contained in the
interrupt priority bit, TMR0IP of the INTCON2 register.
See Section 11.0 “Timer0 Module” for further details
on the Timer0 module.
All external interrupts (INT0, INT1 and INT2) can wake-
up the processor from Idle or Sleep modes if bit INTxE
was set prior to going into those modes. If the Global
Interrupt Enable bit, GIE/GIEH, is set, the processor
will branch to the interrupt vector following wake-up.
9.10 PORTB Interrupt-on-Change
An input change on PORTB<7:4> sets flag bit, RBIF of
the INTCON register. The interrupt can be enabled/
disabled by setting/clearing enable bit, RBIE of the
INTCON register. Pins must also be individually
enabled with the IOCB register. Interrupt priority for
PORTB interrupt-on-change is determined by the value
contained in the interrupt priority bit, RBIP of the
INTCON2 register.
Interrupt priority for INT1 and INT2 is determined by
the value contained in the interrupt priority bits, INT1IP
and INT2IP of the INTCON3 register. There is no prior-
ity bit associated with INT0. It is always a high priority
interrupt source.
9.11 Context Saving During Interrupts
During interrupts, the return PC address is saved on
the stack. Additionally, the WREG, STATUS and BSR
registers are saved on the fast return stack. If a fast
return from interrupt is not used (see Section 5.1.3
“Fast Register Stack”), the user may need to save the
WREG, STATUS and BSR registers on entry to the
Interrupt Service Routine. Depending on the user’s
application, other registers may also need to be saved.
Example 9-1 saves and restores the WREG, STATUS
and BSR registers during an Interrupt Service Routine.
EXAMPLE 9-1:
SAVING STATUS, WREG AND BSR REGISTERS IN RAM
MOVWF
MOVFF
MOVFF
;
W_TEMP
STATUS, STATUS_TEMP
BSR, BSR_TEMP
; W_TEMP is in virtual bank
; STATUS_TEMP located anywhere
; BSR_TMEP located anywhere
; USER ISR CODE
;
MOVFF
MOVF
MOVFF
BSR_TEMP, BSR
W_TEMP, W
STATUS_TEMP, STATUS
; Restore BSR
; Restore WREG
; Restore STATUS
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 131
PIC18(L)F2X/4XK22
TABLE 9-1:
Name
REGISTERS ASSOCIATED WITH INTERRUPTS
Register
on Page
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
ANSELB
INTCON
INTCON2
INTCON3
IOCB
IPR1
—
—
ANSB5
ANSB4 ANSB3
ANSB2
TMR0IF
TMR0IP
—
ANSB1
INT0IF
—
ANSB0
RBIF
154
115
116
117
157
127
128
129
130
130
123
124
125
126
126
118
119
120
121
122
152
60
GIE/GIEH PEIE/GIEL TMR0IE
INT0IE
RBIE
—
RBPU
INT2IP
IOCB7
—
INTEDG0 INTEDG1 INTEDG2
RBIP
INT1IP
IOCB6
ADIP
C1IP
BCL2IP
—
—
IOCB5
RC1IP
C2IP
RC2IP
—
INT2IE
IOCB4
TX1IP
EEIP
INT1IE
—
INT2IF
—
INT1IF
—
—
SSP1IP CCP1IP
BCL1IP HLVDIP
TMR2IP
TMR3IP
TMR1IP
CCP2IP
IPR2
OSCFIP
SSP2IP
—
IPR3
TX2IP CTMUIP TMR5GIP TMR3GIP TMR1GIP
IPR4
—
—
—
—
CCP5IP
TMR6IP
CCP4IP
TMR5IP
TMR2IE
TMR3IE
CCP3IP
TMR4IP
TMR1IE
CCP2IE
IPR5
—
—
—
PIE1
—
ADIE
C1IE
BCL2IE
—
RC1IE
C2IE
RC2IE
—
TX1IE
EEIE
SSP1IE CCP1IE
BCL1IE HLVDIE
PIE2
OSCFIE
SSP2IE
—
PIE3
TX2IE CTMUIE TMR5GIE TMR3GIE TMR1GIE
PIE4
—
—
—
—
CCP5IE
TMR6IE
CCP4IE
TMR5IE
TMR2IF
TMR3IF
CCP3IE
TMR4IE
TMR1IF
CCP2IF
PIE5
—
—
—
PIR1
—
ADIF
C1IF
BCL2IF
—
RC1IF
C2IF
RC2IF
—
TX1IF
EEIF
SSP1IF CCP1IF
BCL1IF HLVDIF
PIR2
OSCFIF
SSP2IF
—
PIR3
TX2IF CTMUIF TMR5GIF TMR3GIF TMR1GIF
PIR4
—
—
—
—
CCP5IF
TMR6IF
RB2
CCP4IF
TMR5IF
RB1
CCP3IF
TMR4IF
RB0
PIR5
—
—
—
PORTB
RCON
RB7
RB6
RB5
—
RB4
RI
RB3
TO
IPEN
SBOREN
PD
POR
BOR
Legend: — = unimplemented locations, read as ‘0’. Shaded bits are not used for Interrupts.
TABLE 9-2:
Name
CONFIGURATION REGISTERS ASSOCIATED WITH INTERRUPTS
Register
on Page
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
CONFIG3H MCLRE
CONFIG4L DEBUG
—
P2BMX
—
T3CMX HFOFST CCP3MX PBADEN CCP2MX
LVP STRVEN
356
357
XINST
—
—
—
Legend: — = unimplemented locations, read as ‘0’. Shaded bits are not used for Interrupts.
DS41412A-page 132
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
Reading the PORTA register reads the status of the
pins, whereas writing to it, will write to the PORT latch.
10.0 I/O PORTS
Depending on the device selected and features
enabled, there are up to five ports available. All pins of
the I/O ports are multiplexed with one or more alternate
functions from the peripheral features on the device. In
general, when a peripheral is enabled, that pin may not
be used as a general purpose I/O pin.
The Data Latch (LATA) register is also memory mapped.
Read-modify-write operations on the LATA register read
and write the latched output value for PORTA.
The RA4 pin is multiplexed with the Timer0 module
clock input and one of the comparator outputs to
become the RA4/T0CKI/C1OUT pin. Pins RA6 and
RA7 are multiplexed with the main oscillator pins; they
are enabled as oscillator or I/O pins by the selection of
the main oscillator in the Configuration register (see
Section 24.1 “Configuration Bits” for details). When
they are not used as port pins, RA6 and RA7 and their
associated TRIS and LAT bits are read as ‘0’.
Each port has five registers for its operation. These
registers are:
• TRIS register (data direction register)
• PORT register (reads the levels on the pins of the
device)
• LAT register (output latch)
• ANSEL register (analog input control)
• SLRCON register (port slew rate control)
The other PORTA pins are multiplexed with analog
inputs, the analog VREF+ and VREF- inputs, and the
comparator voltage reference output. The operation of
pins RA<3:0> and RA5 as analog is selected by setting
the ANSELA<5, 3:0> bits in the ANSELA register which
is the default setting after a Power-on Reset.
The Data Latch (LAT register) is useful for read-modify-
write operations on the value that the I/O pins are
driving.
A simplified model of a generic I/O port, without the
interfaces to other peripherals, is shown in Figure 10-1.
Pins RA0 through RA5 may also be used as comparator
inputs or outputs by setting the appropriate bits in the
CM1CON0 and CM2CON0 registers.
FIGURE 10-1:
GENERIC I/O PORT
OPERATION
Note:
On a Power-on Reset, RA5 and RA<3:0>
are configured as analog inputs and read
as ‘0’. RA4 is configured as a digital input.
TRISx
RD LAT
The RA4/T0CKI/C1OUT pin is a Schmitt Trigger input.
All other PORTA pins have TTL input levels and full
CMOS output drivers.
Data
Bus
D
Q
I/O pin(1)
WR LAT
or
The TRISA register controls the drivers of the PORTA
pins, even when they are being used as analog inputs.
The user should ensure the bits in the TRISA register
are maintained set when using them as analog inputs.
Port
CK
Data Latch
D
Q
ANSELx
WR TRIS
RD TRIS
EXAMPLE 10-1:
INITIALIZING PORTA
CK
TRIS Latch
CLRF
PORTA
LATA
E0h
; Initialize PORTA by
; clearing output
; data latches
; Alternate method
; to clear output
; data latches
Input
Buffer
CLRF
Q
D
MOVLW
MOVWF
MOVLW
; Configure I/O
ANSELA ; for digital inputs
EN
0CFh
; Value used to
RD Port
; initialize data
; direction
MOVWF
TRISA
; Set RA<3:0> as inputs
; RA<5:4> as outputs
Note 1: I/O pins have diode protection to VDD and VSS.
10.1 PORTA Registers
PORTA is an 8-bit wide, bidirectional port. The
corresponding data direction register is TRISA. Setting
a TRISA bit (= 1) will make the corresponding PORTA
pin an input (i.e., disable the output driver). Clearing a
TRISA bit (= 0) will make the corresponding PORTA pin
an output (i.e., enable the output driver and put the
contents of the output latch on the selected pin).
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 133
PIC18(L)F2X/4XK22
TABLE 10-1: PORTA I/O SUMMARY
TRIS ANSEL
Setting Setting Type
Pin
Buffer
Type
Pin Name
Function
Description
RA0/C12IN0-/AN0
RA0
0
1
1
0
O
I
DIG LATA<0> data output; not affected by analog input.
TTL PORTA<0> data input; disabled when analog input
enabled.
C12IN0-
AN0
1
1
0
1
1
1
1
0
I
I
AN
AN
Comparators C1 and C2 inverting input.
Analog input 0.
RA1/C12IN1-/AN1
RA1
O
I
DIG LATA<1> data output; not affected by analog input.
TTL PORTA<1> data input; disabled when analog input
enabled.
C12IN1-
AN1
1
1
0
1
1
1
I
I
AN
AN
Comparators C1 and C2 inverting input.
Analog input 1.
RA2/C2IN+/AN2/
DACOUT/VREF-
RA2
O
DIG LATA<2> data output; not affected by analog input; disabled
when DACOUT enabled.
1
0
I
TTL PORTA<2> data input; disabled when analog input
enabled; disabled when DACOUT enabled.
C2IN+
AN2
1
1
x
1
0
1
1
1
1
0
1
0
1
1
1
1
1
0
1
1
1
1
0
1
I
I
AN
AN
AN
AN
Comparator C2 non-inverting input.
Analog output 2.
DACOUT
VREF-
O
I
DAC Reference output.
A/D reference voltage (low) input.
RA3/C1IN+/AN3/
VREF+
RA3
O
I
DIG LATA<3> data output; not affected by analog input.
TTL PORTA<3> data input; disabled when analog input enabled.
C1IN+
AN3
I
AN
AN
AN
Comparator C1 non-inverting input.
Analog input 3.
I
VREF+
RA4
I
A/D reference voltage (high) input.
RA4/CCP5/
C1OUT/SRQ/
T0CKI
O
I
DIG LATA<4> data output.
TTL PORTA<4> data input; default configuration on POR.
CCP5
O
DIG CCP5 Compare output/PWM output, takes priority over
RA4 output.
1
0
0
1
0
1
0
0
1
1
0
1
0
1
1
0
1
1
I
O
O
I
ST
Capture 5 input/Compare 5 output/ PWM 5 output.
C1OUT
SRQ
DIG Comparator C1 output.
DIG SR Latch Q output; take priority over CCP 5 output.
T0CKI
RA5
ST
Timer0 external clock input.
RA5/C2OUT/
SRNQ/SS1/
HLVDIN/AN4
O
I
DIG LATA<5> data output; not affected by analog input.
TTL PORTA<5> data input; disabled when analog input enabled.
DIG Comparator C2 output.
C2OUT
SRNQ
SS1
O
O
I
DIG SR Latch Q output.
1
1
1
TTL SPI slave select input (MSSP1).
HLVDIN
AN4
I
AN
AN
High/Low-Voltage Detect input.
A/D input 4.
I
Legend:
AN = Analog input or output; TTL = TTL compatible input; HV = High Voltage; OD = Open Drain; XTAL = Crystal; CMOS
2
= CMOS compatible input or output; ST = Schmitt Trigger input with CMOS levels; I CTM = Schmitt Trigger input with
2
I C.
DS41412A-page 134
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
TABLE 10-1: PORTA I/O SUMMARY (CONTINUED)
TRIS ANSEL
Setting Setting Type
Pin
Buffer
Type
Pin Name
Function
Description
RA6/CLKO/OSC2
RA6
0
1
x
x
1
0
1
x
O
I
DIG LATA<6> data output; enabled in INTOSC modes when
CLKO is not enabled.
TTL PORTA<6> data input; enabled in INTOSC modes when
CLKO is not enabled.
CLKO
OSC2
RA7
O
O
DIG In RC mode, OSC2 pin outputs CLKOUT which has 1/4 the
frequency of OSC1 and denotes the instruction cycle rate.
XTAL Oscillator crystal output; connects to crystal or resonator in
Crystal Oscillator mode.
RA7/CLKI/OSC1
0
1
1
0
O
I
DIG LATA<7> data output; disabled in external oscillator modes.
TTL PORTA<7> data input; disabled in external oscillator
modes.
CLKI
x
x
1
x
I
I
AN
External clock source input; always associated with pin
function OSC1.
OSC1
XTAL Oscillator crystal input or external clock source input ST
buffer when configured in RC mode; CMOS otherwise.
Legend:
AN = Analog input or output; TTL = TTL compatible input; HV = High Voltage; OD = Open Drain; XTAL = Crystal; CMOS
2
= CMOS compatible input or output; ST = Schmitt Trigger input with CMOS levels; I CTM = Schmitt Trigger input with
2
I C.
TABLE 10-2:
Name
REGISTERS ASSOCIATED WITH PORTA
Register
on Page
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
ANSELA
—
C1ON
C2ON
DACEN
—
—
ANSA5
C1OE
C2OE
—
ANSA3
C1SP
C2SP
ANSA2
C1R
ANSA1
ANSA0
153
312
313
343
344
345
152
157
337
258
159
155
CM1CON0
CM2CON0
VREFCON1
VREFCON2
HLVDCON
PORTA
C1OUT
C2OUT
C1POL
C2POL
—
C1CH<1:0>
C2CH<1:0>
C2R
DACLPS DACOE
DACPSS<1:0>
DACR<4:0>
HLVDL<3:0>
—
DACNSS
—
—
VDIRMAG BGVST
IRVST HLVDEN
RA7
—
RA6
—
RA5
—
RA4
RA3
RA2
SLRC
RA1
SLRB
SRPS
RA0
SLRA
SRPR
SLRCON
SRCON0
SSP1CON1
T0CON
SLRE
SLRD
SRLEN
WCOL
TMR0ON
TRISA7
SRCLK<2:0>
SRQEN SRNQEN
SSPOV SSPEN
T08BIT T0CS
CKP
SSPM<3:0>
T0SE
PSA
T0PS<2:0>
TRISA2 TRISA1 TRISA0
TRISA
TRISA6 TRISA5 TRISA4 TRISA3
Legend: — = unimplemented locations, read as ‘0’. Shaded bits are not used for PORTA.
TABLE 10-3: CONFIGURATION REGISTERS ASSOCIATED WITH PORTA
Register
on Page
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
CONFIG1H
IESO
FCMEN PRICLKEN PLLCFG
FOSC<3:0>
353
Legend: — = unimplemented locations, read as ‘0’. Shaded bits are not used for PORTA.
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 135
PIC18(L)F2X/4XK22
10.1.1
PORTA OUTPUT PRIORITY
Each PORTA pin is multiplexed with other functions.
The pins, their combined functions and their output
priorities are briefly described here. For additional
information, refer to the appropriate section in this data
sheet.
When multiple outputs are enabled, the actual pin
control goes to the peripheral with the higher priority.
Table 10-4 lists the PORTA pin functions from the
highest to the lowest priority.
Analog input functions, such as ADC and comparator,
are not shown in the priority lists.
These inputs are active when the I/O pin is set for
Analog mode using the ANSELx registers. Digital
output functions may control the pin when it is in Analog
mode with the priority shown below.
TABLE 10-4: PORT PIN FUNCTION PRIORITY
Port Function Priority by Port Pin
Port bit
PORTA
PORTB
PORTC
PORTD(2)
PORTE(2)
0
RA0
CCP4(1)
RB0
SOSCO
P2B(6)
RC0
SCL2
SCK2
RD0
CCP3(8)
P3A(8)
RE0
1
2
3
4
RA1
RA2
RA3
SCL2(1)
SCK2(1)
P1C(1)
RB1
SDA2(1)
P1B(1)
RB2
SOSCI
CCP2(3)
P2A(3)
RC1
SDA2
CCP4
RD1
P3B
RE1
CCP1
P1A
P2B
RD2(4)
CCP5
RE2
CTPLS
RC2
SDO2(1)
CCP2(6)
P2A(6)
RB3
SCL1
SCK1
RC3
P2C
RD3
MCLR
VPP
RE3
SRQ
C1OUT
CCP5(1)
RA4
P1D(1)
SDA1
RC4
SDO2
P2D
RB4
RD4
Note 1: PIC18(L)F2XK22 devices.
2: PIC18(L)F4XK22 devices.
3: Function default pin.
4: Function default pin (28-pin devices).
5: Function default pin (40/44-pin devices).
6: Function alternate pin.
7: Function alternate pin (28-pin devices).
8: Function alternate pin (40/44-pin devices)
DS41412A-page 136
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
TABLE 10-4: PORT PIN FUNCTION PRIORITY (CONTINUED)
Port Function Priority by Port Pin
Port bit
PORTA
PORTB
PORTC
PORTD(2)
PORTE(2)
5
SRNQ
C2OUT
RA5
CCP3(3)
P3A(3)
P2B(1)(4)
RB5
SDO1
RC5
P1B
RD5
6
7
OSC2
CLKO
RA6
PGC
TX2/CK2(1)
TX1/CK1
CCP3(1)(7)
P3A(1)(7)
RC6
TX2/CK2
P1C
RB6
RD6
ICDCK
RA7
OSC1
RA7
PGD
RX2/DT2(1)
RB7
RX1/DT1
P3B(1)
RC7
RX2/DT2
P1D
RD7
ICDDT
Note 1: PIC18(L)F2XK22 devices.
2: PIC18(L)F4XK22 devices.
3: Function default pin.
4: Function default pin (28-pin devices).
5: Function default pin (40/44-pin devices).
6: Function alternate pin.
7: Function alternate pin (28-pin devices).
8: Function alternate pin (40/44-pin devices)
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 137
PIC18(L)F2X/4XK22
10.2 PORTB Registers
10.3 Additional PORTB Pin Functions
PORTB is an 8-bit wide, bidirectional port. The
corresponding data direction register is TRISB. Setting
a TRISB bit (= 1) will make the corresponding PORTB
pin an input (i.e., disable the output driver). Clearing a
TRISB bit (= 0) will make the corresponding PORTB
pin an output (i.e., enable the output driver and put the
contents of the output latch on the selected pin).
PORTB pins RB<7:4> have an interrupt-on-change
option. All PORTB pins have a weak pull-up option.
10.3.1
WEAK PULL-UPS
Each of the PORTB pins has an individually controlled
weak internal pull-up. When set, each bit of the WPUB
register enables the corresponding pin pull-up. When
cleared, the RBPU bit of the INTCON2 register enables
pull-ups on all pins which also have their corresponding
WPUB bit set. When set, the RBPU bit disables all
weak pull-ups. The weak pull-up is automatically turned
off when the port pin is configured as an output. The
pull-ups are disabled on a Power-on Reset.
The Data Latch register (LATB) is also memory
mapped. Read-modify-write operations on the LATB
register read and write the latched output value for
PORTB.
EXAMPLE 10-2:
INITIALIZING PORTB
CLRF
PORTB
LATB
0F0h
; Initialize PORTB by
; clearing output
; data latches
; Alternate method
; to clear output
; data latches
Note:
On a Power-on Reset, RB<5:0> are
configured as analog inputs by default and
read as ‘0’; RB<7:6> are configured as
digital inputs.
CLRF
When the PBADEN Configuration bit is set
to ‘1’, RB<5:0> will alternatively be
configured as digital inputs on POR.
MOVLW
MOVWF
; Value for init
ANSELB ; Enable RB<3:0> for
; digital input pins
; (not required if config bit
; PBADEN is clear)
; Value used to
; initialize data
; direction
; Set RB<3:0> as inputs
; RB<5:4> as outputs
; RB<7:6> as inputs
10.3.2
INTERRUPT-ON-CHANGE
Four of the PORTB pins (RB<7:4>) are individually
configurable as interrupt-on-change pins. Control bits
in the IOCB register enable (when set) or disable (when
clear) the interrupt function for each pin.
MOVLW
MOVWF
0CFh
TRISB
When set, the RBIE bit of the INTCON register enables
interrupts on all pins which also have their
corresponding IOCB bit set. When clear, the RBIE bit
disables all interrupt-on-changes.
10.2.1
PORTB OUTPUT PRIORITY
Each PORTB pin is multiplexed with other functions.
The pins, their combined functions and their output
priorities are briefly described here. For additional
information, refer to the appropriate section in this data
sheet.
Only pins configured as inputs can cause this interrupt
to occur (i.e., any RB<7:4> pin configured as an output
is excluded from the interrupt-on-change comparison).
For enabled interrupt-on-change pins, the values are
compared with the old value latched on the last read of
PORTB. The ‘mismatch’ outputs of the last read are
OR’d together to set the PORTB Change Interrupt flag
bit (RBIF) in the INTCON register.
When multiple outputs are enabled, the actual pin
control goes to the peripheral with the higher priority.
Table 10-4 lists the PORTB pin functions from the
highest to the lowest priority.
This interrupt can wake the device from the Sleep
mode, or any of the Idle modes. The user, in the
Interrupt Service Routine, can clear the interrupt in the
following manner:
Analog input functions, such as ADC, comparator and
SR Latch inputs, are not shown in the priority lists.
These inputs are active when the I/O pin is set for
Analog mode using the ANSELx registers. Digital
output functions may control the pin when it is in Analog
mode with the priority shown below.
a) Any read or write of PORTB to clear the mis-
match condition (except when PORTB is the
source or destination of a MOVFF instruction).
b) Clear the flag bit, RBIF.
DS41412A-page 138
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
A mismatch condition will continue to set the RBIF flag bit.
Reading or writing PORTB will end the mismatch
condition and allow the RBIF bit to be cleared. The latch
holding the last read value is not affected by a MCLR nor
Brown-out Reset. After either one of these Resets, the
RBIF flag will continue to be set if a mismatch is present.
10.3.3
ALTERNATE FUNCTIONS
PORTB is multiplexed with several peripheral functions
(Table 10-5). The pins have TTL input buffers. Some of
these pin functions can be relocated to alternate pins
using the Control fuse bits in CONFIG3H. RB5 is the
default pin for P2B (28-pin devices). Clearing the
P2BMX bit moves the pin function to RC0. RB5 is also
the default pin for the CCP3/P3A peripheral pin. Clear-
ing the CCP3MX bit moves the pin function to the RC6
pin (28-pin devices) or RE0 (40/44-pin devices).
Note:
If a change on the I/O pin should occur
when the read operation is being executed
(start of the Q2 cycle), then the RBIF
interrupt flag may not get set. Furthermore,
since a read or write on a port affects all bits
of that port, care must be taken when using
multiple pins in Interrupt-on-change mode.
Changes on one pin may not be seen while
servicing changes on another pin.
Two other pin functions, T3CKI and CCP2/P2A, can be
relocated from their default pins to PORTB pins by
clearing the control fuses in CONFIG3H. Clearing
T3CMX and CCP2MX moves the pin functions to RB5
and RB3, respectively.
The interrupt-on-change feature is recommended for
wake-up on key depression operation and operations
where PORTB is only used for the interrupt-on-change
feature. Polling of PORTB is not recommended while
using the interrupt-on-change feature.
TABLE 10-5: PORTB I/O SUMMARY
TRIS ANSEL
Setting Setting Type
Pin
Buffer
Type
Pin
Function
Description
RB0/INT0/CCP4/
FLT0/SRI/SS2/
AN12
RB0
0
1
1
0
O
I
DIG LATB<0> data output; not affected by analog input.
TTL PORTB<0> data input; disabled when analog input
enabled.
INT0
1
0
1
1
1
1
1
0
1
0
I
O
I
ST
External interrupt 0.
(3)
CCP4
1
0
0
0
0
1
1
0
DIG Compare 4 output/PWM 4 output.
ST
ST
ST
Capture 4 input.
FLT0
SRI
I
PWM Fault input for ECCP auto-shutdown.
SR Latch input.
I
(3)
SS2
I
TTL SPI slave select input (MSSP2).
AN Analog input 12.
DIG LATB<1> data output; not affected by analog input.
AN12
RB1
I
RB1/INT1/P1C/
SCK2/SCL2/
C12IN3-/AN10
O
I
ST
PORTB<1> data input; disabled when analog input
enabled.
INT1
1
0
0
1
0
1
1
1
0
1
1
0
1
0
1
1
I
O
O
I
ST
External Interrupt 1.
(3)
P1C
DIG Enhanced CCP1 PWM output 3.
DIG MSSP2 SPI Clock output.
(3)
SCK2
ST
MSSP2 SPI Clock input.
(3)
2
SCL2
O
I
DIG MSSP2 I CTM Clock output.
2
2
I C
MSSP2 I CTM Clock input.
C12IN3-
AN10
I
AN
AN
Comparators C1 and C2 inverting input.
Analog input 10.
I
Legend:
AN = Analog input or output; TTL = TTL compatible input; HV = High Voltage; OD = Open Drain; XTAL = Crystal; CMOS =
2
2
CMOS compatible input or output; ST = Schmitt Trigger input with CMOS levels; I CTM = Schmitt Trigger input with I C.
Note 1: Default pin assignment for P2B, T3CKI, CCP3 and CCP2 when Configuration bits PB2MX, T3CMX, CCP3MX and
CCP2MX are set.
2: Alternate pin assignment for P2B, T3CKI, CCP3 and CCP2 when Configuration bits PB2MX, T3CMX, CCP3MX and
CCP2MX are clear.
3: Function on PORTD and PORTE for PIC18(L)F4XK22 devices.
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 139
PIC18(L)F2X/4XK22
TABLE 10-5: PORTB I/O SUMMARY (CONTINUED)
TRIS ANSEL
Setting Setting Type
Pin
Buffer
Type
Pin
Function
Description
RB2/INT2/CTED1/
P1B/SDI2/SDA2/
AN8
RB2
0
1
1
0
O
I
DIG LATB<2> data output; not affected by analog input.
ST
PORTB<2> data input; disabled when analog input
enabled.
INT2
1
1
0
1
0
1
1
0
1
0
0
1
0
0
0
1
1
0
I
I
ST
ST
External interrupt 2.
CTMU Edge 1 input.
CTED1
(3)
P1B
O
I
DIG Enhanced CCP1 PWM output 2.
(3)
SDI2
ST
MSSP2 SPI data input.
(3)
2
SDA2
O
I
DIG MSSP2 I CTM data output.
2
2
I C
MSSP2 I CTM data input.
AN8
RB3
I
AN
Analog input 8.
RB3/CTED2/P2A/
CCP2/SDO2/
C12IN2-/AN9
O
I
DIG LATB<3> data output; not affected by analog input.
ST
PORTB<3> data input; disabled when analog input
enabled.
CTED2
P2A
1
0
0
1
0
1
1
0
1
0
1
1
0
1
1
1
1
0
ST
CTMU Edge 2 input.
I
O
O
I
DIG Enhanced CCP1 PWM output 1.
DIG Compare 2 output/PWM 2 output.
(2)
CCP2
ST
Capture 2 input.
(2)
SDO2
O
I
DIG MSSP2 SPI data output.
C12IN2-
AN9
AN
AN
Comparators C1 and C2 inverting input.
Analog input 9.
I
RB4/IOC0/P1D/
T5G/AN11
RB4
O
I
DIG LATB<4> data output; not affected by analog input.
ST
PORTB<4> data input; disabled when analog input
enabled.
IOC0
P1D
T5G
AN11
RB5
1
0
1
1
0
1
0
1
0
1
1
0
I
O
I
TTL Interrupt-on-change pin.
DIG Enhanced CCP1 PWM output 4.
ST
AN
Timer5 external clock gate input.
Analog input 11.
I
RB5/IOC1/P2B/
P3A/CCP3/T3CKI/
T1G/AN13
O
I
DIG LATB<5> data output; not affected by analog input.
ST
PORTB<5> data input; disabled when analog input
enabled.
IOC1
1
0
0
0
1
1
1
1
0
1
1
1
0
0
0
1
I
O
O
O
I
TTL Interrupt-on-change pin 1.
(1)(3)
P2B
DIG Enhanced CCP2 PWM output 2.
DIG Enhanced CCP3 PWM output 1.
DIG Compare 3 output/PWM 3 output.
(1)
P3A
(1)
CCP3
ST
ST
ST
AN
Capture 3 input.
(2)
T3CKI
I
Timer3 clock input.
T1G
I
Timer1 external clock gate input.
Analog input 13.
AN13
I
Legend:
AN = Analog input or output; TTL = TTL compatible input; HV = High Voltage; OD = Open Drain; XTAL = Crystal; CMOS =
2
2
CMOS compatible input or output; ST = Schmitt Trigger input with CMOS levels; I CTM = Schmitt Trigger input with I C.
Note 1: Default pin assignment for P2B, T3CKI, CCP3 and CCP2 when Configuration bits PB2MX, T3CMX, CCP3MX and
CCP2MX are set.
2: Alternate pin assignment for P2B, T3CKI, CCP3 and CCP2 when Configuration bits PB2MX, T3CMX, CCP3MX and
CCP2MX are clear.
3: Function on PORTD and PORTE for PIC18(L)F4XK22 devices.
DS41412A-page 140
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
TABLE 10-5: PORTB I/O SUMMARY (CONTINUED)
TRIS ANSEL
Setting Setting Type
Pin
Buffer
Type
Pin
Function
Description
RB6/KBI2/PGC
RB6
0
1
1
0
O
I
DIG LATB<6> data output; not affected by analog input.
ST
PORTB<6> data input; disabled when analog input
enabled.
IOC2
1
0
0
1
x
0
1
0
1
1
0
x
1
0
I
O
O
I
TTL Interrupt-on-change pin.
(3)
TX2
DIG EUSART 2 asynchronous transmit data output.
DIG EUSART 2 synchronous serial clock output.
(3)
CK2
ST
ST
EUSART 2 synchronous serial clock input.
In-Circuit Debugger and ICSPTM programming clock input.
PGC
RB7
I
RB7/KBI3/PGD
O
I
DIG LATB<7> data output; not affected by analog input.
ST
PORTB<7> data input; disabled when analog input
enabled.
IOC3
1
1
0
1
x
x
0
0
1
0
x
x
I
I
TTL Interrupt-on-change pin.
ST EUSART 2 asynchronous receive data input.
DIG EUSART 2 synchronous serial data output.
ST EUSART 2 synchronous serial data input.
DIG In-Circuit Debugger and ICSPTM programming data output.
ST
In-Circuit Debugger and ICSPTM programming data input.
(2), (3)
RX2
(2), (3)
DT2
O
I
PGD
O
I
Legend:
AN = Analog input or output; TTL = TTL compatible input; HV = High Voltage; OD = Open Drain; XTAL = Crystal; CMOS =
2
2
CMOS compatible input or output; ST = Schmitt Trigger input with CMOS levels; I CTM = Schmitt Trigger input with I C.
Note 1: Default pin assignment for P2B, T3CKI, CCP3 and CCP2 when Configuration bits PB2MX, T3CMX, CCP3MX and
CCP2MX are set.
2: Alternate pin assignment for P2B, T3CKI, CCP3 and CCP2 when Configuration bits PB2MX, T3CMX, CCP3MX and
CCP2MX are clear.
3: Function on PORTD and PORTE for PIC18(L)F4XK22 devices.
TABLE 10-6: REGISTERS ASSOCIATED WITH PORTB
Register
on Page
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
ANSELB
ECCP2AS
CCP2CON
ECCP3AS
CCP3CON
INTCON
INTCON2
INTCON3
IOCB
—
—
ANSB5
ANSB4
ANSB3
ANSB2
ANSB1
ANSB0
154
207
203
207
203
115
116
117
157
156
152
157
173
172
173
155
156
CCP2ASE
CCP2AS<2:0>
P2SSAC<1:0>
CCP2M<3:0>
P3SSAC<1:0>
P2SSBD<1:0>
P2M<1:0>
CCP3ASE
P3M<1:0>
GIE/GIEH PEIE/GIEL
DC2B<1:0>
CCP3AS<2:0>
P3SSBD<1:0>
DC3B<1:0>
CCP3M<3:0>
TMR0IF
TMR0IE
INTEDG1
—
INT0IE
INTEDG2
INT2IE
IOCB4
LATB4
RB4
RBIE
—
INT0IF
RBIF
RBIP
INT1IF
—
RBPU
INT2IP
IOCB7
LATB7
RB7
INTEDG0
INT1IP
IOCB6
LATB6
RB6
TMR0IP
—
INT1IE
—
—
—
INT2IF
—
IOCB5
LATB5
RB5
LATB
LATB3
RB3
LATB2
RB2
LATB1
RB1
LATB0
RB0
PORTB
(1)
(1)
SLRCON
T1GCON
T3CON
—
—
—
SLRE
SLRD
SLRC
T1GVAL
SLRB
SLRA
TMR1GE
T1GPOL
T1GTM
T1GSPM
T1GGO/DONE
T3SOSCEN
T5GGO_DONE
TRISB3
T1GSS<1:0>
TMR3CS<1:0>
T3CKPS<1:0>
T3SYNC T3RD16 TMR3ON
T5GCON
TRISB
TMR5GE
TRISB7
WPUB7
T5GPOL
TRISB6
WPUB6
T5GTM
TRISB5
WPUB5
T5GSPM
TRISB4
WPUB4
T5GVAL
TRISB2
WPUB2
T5GSS
TRISB1
WPUB1
TRISB0
WPUB0
WPUB
WPUB3
Legend:
— = unimplemented locations, read as ‘0’. Shaded bits are not used for PORTB.
Note 1: Available on PIC18(L)F4XK22 devices.
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 141
PIC18(L)F2X/4XK22
TABLE 10-7: CONFIGURATION REGISTERS ASSOCIATED WITH PORTB
Register
on Page
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
CONFIG3H
CONFIG4L
Legend:
MCLRE
DEBUG
—
P2BMX
—
T3CMX
—
HFOFST
—
CCP3MX PBADEN
CCP2MX
STRVEN
356
357
(1)
XINST
LVP
—
— = unimplemented locations, read as ‘0’. Shaded bits are not used for PORTB.
Note 1: Can only be changed when in high voltage programming mode.
EXAMPLE 10-3:
INITIALIZING PORTC
10.4 PORTC Registers
CLRF
PORTC
LATC
0CFh
TRISC
30h
; Initialize PORTC by
; clearing output
; data latches
; Alternate method
; to clear output
; data latches
; Value used to
; initialize data
; direction
; Set RC<3:0> as inputs
; RC<5:4> as outputs
; RC<7:6> as inputs
; Value used to
PORTC is an 8-bit wide, bidirectional port. The
corresponding data direction register is TRISC. Setting
a TRISC bit (= 1) will make the corresponding PORTC
pin an input (i.e., disable the output driver). Clearing a
TRISC bit (= 0) will make the corresponding PORTC
pin an output (i.e., enable the output driver and put the
contents of the output latch on the selected pin).
CLRF
MOVLW
MOVWF
The Data Latch register (LATC) is also memory
mapped. Read-modify-write operations on the LATC
register read and write the latched output value for
PORTC.
MOVLW
MOVWF
; enable digital inputs
PORTC is multiplexed with several peripheral functions
(Table 10-8). The pins have Schmitt Trigger input buf-
fers.
ANSELC ; RC<3:2> dig input enable
; No ANSEL bits for RC<1:0>
; RC<7:6> dig input enable
Some of these pin functions can be relocated to alter-
nate pins using the Control fuse bits in CONFIG3H.
RC0 is the default pin for T3CKI. Clearing the T3CMX
bit moves the pin function to RB5. RC1 is the default pin
for the CCP2 peripheral pin. Clearing the CCP2MX bit
moves the pin function to the RB3 pin.
10.4.1
PORTC OUTPUT PRIORITY
Each PORTC pin is multiplexed with other functions.
The pins, their combined functions and their output
priorities are briefly described here. For additional
information, refer to the appropriate section in this data
sheet.
Two other pin functions, P2B and CCP3, can be relo-
cated from their default pins to PORTC pins by clearing
the control fuses in CONFIG3H. Clearing P2BMX and
When multiple outputs are enabled, the actual pin
control goes to the peripheral with the higher priority.
Table 10-4 lists the PORTC pin functions from the
highest to the lowest priority.
CCP3MX moves the pin functions to RC0 and RC6(1)
RE0(2), respectively.
/
When enabling peripheral functions, care should be
taken in defining TRIS bits for each PORTC pin. The
EUSART and MSSP peripherals override the TRIS bit
to make a pin an output or an input, depending on the
peripheral configuration. Refer to the corresponding
peripheral section for additional information.
Analog input functions, such as ADC, comparator and
SR Latch inputs, are not shown in the priority lists.
These inputs are active when the I/O pin is set for
Analog mode using the ANSELx registers. Digital
output functions may control the pin when it is in Analog
mode with the priority shown below.
Note:
On a Power-on Reset, these pins are con-
figured as analog inputs.
The contents of the TRISC register are affected by
peripheral overrides. Reading TRISC always returns
the current contents, even though a peripheral device
may be overriding one or more of the pins.
DS41412A-page 142
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
TABLE 10-8: PORTC I/O SUMMARY
TRIS
Setting
ANSEL
setting
Pin
Type
Buffer
Type
Pin Name
Function
Description
RC0/P2B/T3CKI/T3G/
T1CKI/SOSCO
RC0
0
1
1
0
O
I
DIG
ST
LATC<0> data output; not affected by analog input.
PORTC<0> data input; disabled when analog input
enabled.
(2)
P2B
0
1
1
1
x
0
1
1
0
0
0
—
1
0
O
I
DIG
ST
ST
ST
Enhanced CCP2 PWM output 2.
Timer3 clock input.
(1)
T3CKI
T3G
T1CKI
SOSCO
RC1
I
Timer3 external clock gate input.
Timer1 clock input.
I
O
O
I
XTAL Secondary oscillator output.
RC1/P2A/CCP2/SOSCI
DIG
ST
LATC<1> data output; not affected by analog input.
PORTC<1> data input; disabled when analog input
enabled.
P2A
0
0
1
x
0
1
1
1
0
—
1
0
O
O
I
DIG
DIG
ST
Enhanced CCP2 PWM output 1.
Compare 2 output/PWM 2 output.
Capture 2 input.
(1)
CCP2
SOSCI
RC2
I
XTAL Secondary oscillator input.
RC2/CTPLS/P1A/
CCP1/T5CKI/AN14
O
I
DIG
ST
LATC<2> data output; not affected by analog input.
PORTC<2> data input; disabled when analog input
enabled.
CTPLS
P1A
0
0
0
1
1
1
0
1
1
1
1
0
0
1
1
0
O
O
O
I
DIG
DIG
DIG
ST
CTMU pulse generator output.
Enhanced CCP1 PWM output 1.
Compare 1 output/PWM 1 output.
Capture 1 input.
CCP1
T5CKI
AN14
RC3
I
ST
Timer5 clock input.
I
AN
Analog input 14.
RC3/SCK1/SCL1/AN15
O
I
DIG
ST
LATC<3> data output; not affected by analog input.
PORTC<3> data input; disabled when analog input
enabled.
SCK1
SCL1
0
1
0
1
1
0
1
1
0
1
0
1
1
0
O
I
DIG
ST
MSSP1 SPI Clock output.
MSSP1 SPI Clock input.
2
O
I
DIG
I2C
AN
MSSP1 I C™ Clock output.
2
MSSP1 I C™ Clock input.
AN15
RC4
I
Analog input 15.
RC4/SDI1/SDA1/AN16
O
I
DIG
ST
LATC<4> data output; not affected by analog input.
PORTC<4> data input; disabled when analog input
enabled.
SDI1
1
0
1
1
0
0
0
1
I
O
I
ST
DIG
I2C
AN
MSSP1 SPI data input.
2
SDA1
MSSP1 I C™ data output.
2
MSSP1 I C™ data input.
AN16
I
Analog input 16.
Legend:
AN = Analog input or output; TTL = TTL compatible input; HV = High Voltage; OD = Open Drain; XTAL = Crystal; CMOS =
2
2
CMOS compatible input or output; ST = Schmitt Trigger input with CMOS levels; I CTM = Schmitt Trigger input with I C.
Note 1: Default pin assignment for P2B, T3CKI, CCP3 and CCP2 when Configuration bits PB2MX, T3CMX, CCP3MX and
CCP2MX are set.
2: Alternate pin assignment for P2B, T3CKI, CCP3 and CCP2 when Configuration bits PB2MX, T3CMX, CCP3MX and
CCP2MX are clear.
3: Function on PORTD and PORTE for PIC18(L)F4XK22 devices.
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 143
PIC18(L)F2X/4XK22
TABLE 10-8: PORTC I/O SUMMARY (CONTINUED)
TRIS
Setting
ANSEL
setting
Pin
Type
Buffer
Type
Pin Name
Function
Description
RC5/SDO1/AN17
RC5
0
1
1
0
O
I
DIG
ST
LATC<5> data output; not affected by analog input.
PORTC<5> data input; disabled when analog input
enabled.
SDO1
AN17
RC6
0
1
O
I
DIG
AN
MSSP1 SPI data output.
Analog input 17.
RC6/P3A/CCP3/TX1/
CK1/AN18
0
1
1
0
O
I
DIG
ST
LATC<6> data output; not affected by analog input.
PORTC<6> data input; disabled when analog input
enabled.
(2), (3)
P3A
0
0
1
0
0
1
1
0
1
1
1
0
1
1
0
1
1
0
O
O
I
CMOS Enhanced CCP3 PWM output 1.
(2), (3)
CCP3
DIG
ST
Compare 3 output/PWM 3 output.
Capture 3 input.
TX1
CK1
O
O
I
DIG
DIG
ST
EUSART 1 asynchronous transmit data output.
EUSART 1 synchronous serial clock output.
EUSART 1 synchronous serial clock input.
Analog input 18.
AN18
RC7
I
AN
RC7/P3B/RX1/DT1/
AN19
O
I
DIG
ST
LATC<7> data output; not affected by analog input.
PORTC<7> data input; disabled when analog input
enabled.
P3B
RX1
DT1
0
1
0
1
1
1
0
1
0
1
O
I
CMOS Enhanced CCP3 PWM output 2.
ST
DIG
ST
EUSART 1 asynchronous receive data in.
EUSART 1 synchronous serial data output.
EUSART 1 synchronous serial data input.
Analog input 19.
O
I
AN19
I
AN
Legend:
AN = Analog input or output; TTL = TTL compatible input; HV = High Voltage; OD = Open Drain; XTAL = Crystal; CMOS =
2
2
CMOS compatible input or output; ST = Schmitt Trigger input with CMOS levels; I CTM = Schmitt Trigger input with I C.
Note 1: Default pin assignment for P2B, T3CKI, CCP3 and CCP2 when Configuration bits PB2MX, T3CMX, CCP3MX and
CCP2MX are set.
2: Alternate pin assignment for P2B, T3CKI, CCP3 and CCP2 when Configuration bits PB2MX, T3CMX, CCP3MX and
CCP2MX are clear.
3: Function on PORTD and PORTE for PIC18(L)F4XK22 devices.
DS41412A-page 144
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
TABLE 10-9: REGISTERS ASSOCIATED WITH PORTC
Register
on Page
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
ANSELC
ANSC7
ANSC6
ANSC5
ANSC4
ANSC3
ANSC2
—
—
154
207
203
207
203
331
156
152
275
157
258
172
172
173
172
155
274
ECCP1AS
CCP1CON
ECCP2AS
CCP2CON
CCP1ASE
CCP1AS<2:0>
P1SSAC<1:0>
CCP1M<3:0>
P2SSAC<1:0>
CCP2M<3:0>
EDGSEQEN IDISSEN CTTRIG
P1SSBD<1:0>
P1M<1:0>
CCP2ASE
P2M<1:0>
DC1B<1:0>
CCP2AS<2:0>
P2SSBD<1:0>
DC2B<1:0>
CTMUCONH CTMUEN
—
LATC6
RC6
CTMUSIDL
LATC5
RC5
TGEN
LATC4
RC4
EDGEN
LATC3
RC3
LATC
LATC7
RC7
LATC2
RC2
LATC1
RC1
LATC0
RC0
PORTC
RCSTA1
SLRCON
SSP1CON1
T1CON
T3CON
T3GCON
T5CON
TRISC
SPEN
—
RX9
SREN
—
CREN
ADDEN
FERR
OERR
SLRB
RX9D
SLRA
(1)
(1)
—
SLRE
CKP
SLRD
SLRC
WCOL
SSPOV
SSPEN
SSPM<3:0>
T1SYNC
T3SYNC
T3GVAL
T5SYNC
TRISC2
BRGH
TMR1CS<1:0>
TMR3CS<1:0>
T1CKPS<1:0>
T3CKPS<1:0>
T1SOSCEN
T3SOSCEN
T1RD16 TMR1ON
T3RD16 TMR3ON
T3GSS
TMR3GE T3GPOL
TMR5CS<1:0>
T3GTM
T3GSPM T3GGO/DONE
T5CKPS<1:0>
T5OSCEN
TRISC3
T5RD16 TMR5ON
TRISC1 TRISC0
TRISC7
CSRC
TRISC6
TX9
TRISC5
TXEN
TRISC4
SYNC
TXSTA1
Legend:
SENDB
TRMT
TX9D
— = unimplemented locations, read as ‘0’. Shaded bits are not used for PORTC.
Note 1: Available on PIC18(L)F4XK22 devices.
TABLE 10-10: CONFIGURATION REGISTERS ASSOCIATED WITH PORTC
Register
on Page
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
CCP2MX
CONFIG3H
MCLRE
—
P2BMX
T3CMX
HFOFST
CCP3MX PBADEN
356
Legend:
— = unimplemented locations, read as ‘0’. Shaded bits are not used for PORTC.
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 145
PIC18(L)F2X/4XK22
10.5.1
PORTD OUTPUT PRIORITY
10.5 PORTD Registers
Each PORTD pin is multiplexed with other functions.
The pins, their combined functions and their output
priorities are briefly described here. For additional
information, refer to the appropriate section in this data
sheet.
Note:
PORTD is only available on 40-pin and 44-
pin devices.
PORTD is an 8-bit wide, bidirectional port. The
corresponding data direction register is TRISD. Setting
a TRISD bit (= 1) will make the corresponding PORTD
pin an input (i.e., disable the output driver). Clearing a
TRISD bit (= 0) will make the corresponding PORTD
pin an output (i.e., enable the output driver and put the
contents of the output latch on the selected pin).
When multiple outputs are enabled, the actual pin
control goes to the peripheral with the higher priority.
Table 10-4 lists the PORTD pin functions from the
highest to the lowest priority.
Analog input functions, such as ADC, comparator and
SR Latch inputs, are not shown in the priority lists.
The Data Latch register (LATD) is also memory
mapped. Read-modify-write operations on the LATD
register read and write the latched output value for
PORTD.
These inputs are active when the I/O pin is set for
Analog mode using the ANSELx registers. Digital
output functions may control the pin when it is in Analog
mode with the priority shown below.
All pins on PORTD are implemented with Schmitt
Trigger input buffers. Each pin is individually
configurable as an input or output.
All of the PORTD pins are multiplexed with analog and
digital peripheral modules. See Table .
Note:
On a Power-on Reset, these pins are
configured as analog inputs.
EXAMPLE 10-4:
INITIALIZING PORTD
CLRF
PORTD
LATD
0CFh
TRISD
30h
; Initialize PORTD by
; clearing output
; data latches
; Alternate method
; to clear output
; data latches
; Value used to
; initialize data
; direction
; Set RD<3:0> as inputs
; RD<5:4> as outputs
; RD<7:6> as inputs
; Value used to
CLRF
MOVLW
MOVWF
MOVLW
MOVWF
; enable digital inputs
ANSELD ; RD<3:0> dig input enable
; RC<7:6> dig input enable
DS41412A-page 146
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
TABLE 10-11: PORTD I/O SUMMARY
TRIS ANSEL Pin Buffer
Setting setting Type Type
Pin Name
Function
Description
RD0/SCK2/SCL2/AN20
RD0
0
1
1
0
O
I
DIG
ST
LATD<0> data output; not affected by analog input.
PORTD<0> data input; disabled when analog input
enabled.
SCK2
SCL2
0
1
0
1
1
0
1
1
0
1
0
1
1
0
O
I
DIG
ST
MSSP2 SPI Clock output.
MSSP2 SPI Clock input.
2
O
I
DIG
MSSP2 I C™ Clock output.
2
2
I C
MSSP2 I C™ Clock input.
AN20
RD1
I
AN
DIG
ST
Analog input 20.
RD1/CCP4/SDI2/SDA2/
AN21
O
I
LATD<1> data output; not affected by analog input.
PORTD<1> data input; disabled when analog input
enabled.
CCP4
0
1
1
0
1
1
0
1
1
0
0
0
0
1
1
0
O
I
DIG
ST
Compare 4 output/PWM 4 output.
Capture 4 input.
SDI2
I
ST
MSSP2 SPI data input.
2
SDA2
O
I
DIG
I2C
AN
DIG
ST
MSSP2 I C™ data output.
2
MSSP2 I C™ data input.
AN21
RD2
I
Analog input 21.
RD2/P2B/AN22
O
I
LATD<2> data output; not affected by analog input.
PORTD<2> data input; disabled when analog input
enabled.
(1)
P2B
0
1
0
1
1
1
1
0
O
I
DIG
AN
Enhanced CCP2 PWM output 2.
Analog input 22.
AN22
RD3
RD3/P2C/SS2/AN23
O
I
DIG
ST
LATD<3> data output; not affected by analog input.
PORTD<3> data input; disabled when analog input
enabled.
P2C
SS2
0
1
1
0
1
1
0
1
1
0
O
I
DIG
TTL
AN
Enhanced CCP2 PWM output 4.
MSSP2 SPI slave select input.
Analog input 23.
AN23
RD4
I
RD4/P2D/SDO2/AN24
O
I
DIG
ST
LATD<4> data output; not affected by analog input.
PORTD<4> data input; disabled when analog input
enabled.
P2D
SDO2
AN24
RD5
0
0
1
0
1
1
1
1
1
0
O
O
I
DIG
DIG
AN
Enhanced CCP2 PWM output 3.
MSSP2 SPI data output.
Analog input 24.
RD5/P1B/AN25
O
I
DIG
ST
LATD<5> data output; not affected by analog input.
PORTD<5> data input; disabled when analog input
enabled.
P1B
0
1
O
I
DIG
AN
Enhanced CCP1 PWM output 2.
Analog input 25.
AN25
Legend:
AN = Analog input or output; TTL = TTL compatible input; HV = High Voltage; OD = Open Drain; XTAL = Crystal; CMOS
2
2
= CMOS compatible input or output; ST = Schmitt Trigger input with CMOS levels; I CTM = Schmitt Trigger input with I C.
Note 1: Default pin assignment for P2B, T3CKI, CCP3 and CCP2 when Configuration bits PB2MX, T3CMX, CCP3MX and
CCP2MX are set.
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 147
PIC18(L)F2X/4XK22
TABLE 10-11: PORTD I/O SUMMARY
TRIS ANSEL Pin Buffer
Setting setting Type Type
Pin Name
Function
Description
RD6/P1C/TX2/CK2/
AN26
RD6
0
1
1
0
O
I
DIG
ST
LATD<6> data output; not affected by analog input.
PORTD<6> data input; disabled when analog input
enabled.
P1C
TX2
CK2
0
0
0
1
1
0
1
1
1
1
0
1
1
0
O
O
O
I
DIG
DIG
DIG
ST
Enhanced CCP1 PWM output 3.
EUSART 2 asynchronous transmit data output.
EUSART 2 synchronous serial clock output.
EUSART 2 synchronous serial clock input.
Analog input 26.
AN26
RD7
I
AN
RD7/P1D/RX2/DT2/
AN27
O
I
DIG
ST
LATD<7> data output; not affected by analog input.
PORTD<7> data input; disabled when analog input
enabled.
P1D
RX2
DT2
0
1
0
1
1
1
0
1
0
1
O
I
DIG
ST
Enhanced CCP1 PWM output 4.
EUSART 2 asynchronous receive data in.
EUSART 2 synchronous serial data output.
EUSART 2 synchronous serial data input.
Analog input 27.
O
I
DIG
ST
AN27
I
AN
Legend:
AN = Analog input or output; TTL = TTL compatible input; HV = High Voltage; OD = Open Drain; XTAL = Crystal; CMOS
2
2
= CMOS compatible input or output; ST = Schmitt Trigger input with CMOS levels; I CTM = Schmitt Trigger input with I C.
Note 1: Default pin assignment for P2B, T3CKI, CCP3 and CCP2 when Configuration bits PB2MX, T3CMX, CCP3MX and
CCP2MX are set.
TABLE 10-12: REGISTERS ASSOCIATED WITH PORTD
Registeron
Page
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
ANSELD(1)
BAUDCON2
CCP1CON
CCP2CON
CCP4CON
LATD(1)
ANSD7 ANSD6 ANSD5 ANSD4
ABDOVF RCIDL DTRXP CKTXP
ANSD3
BRG16
ANSD2
—
ANSD1 ANSD0
154
276
203
203
203
156
152
275
157
258
155
WUE
ABDEN
P1M<1:0>
P2M<1:0>
DC1B<1:0>
DC2B<1:0>
DC4B<1:0>
CCP1M<3:0>
CCP2M<3:0>
CCP4M<3:0>
—
—
LATD7
RD7
SPEN
—
LATD6 LATD5
LATD4
RD4
LATD3
RD3
LATD2
RD2
LATD1
LATD0
RD0
PORTD(1)
RD6
RX9
—
RD5
SREN
—
RD1
OERR
SLRB
RCSTA2
CREN
SLRE
CKP
ADDEN
SLRD
FERR
SLRC
RX9D
SLRA
SLRCON(1)
SSP2CON1
TRISD(1)
WCOL SSPOV SSPEN
SSPM<3:0>
TRISD7 TRISD6 TRISD5 TRISD4 TRISD3 TRISD2 TRISD1 TRISD0
Legend: — = unimplemented locations, read as ‘0’. Shaded bits are not used for PORTD.
Note 1: Available on PIC18(L)F4XK22 devices.
TABLE 10-13: CONFIGURATION REGISTERS ASSOCIATED WITH PORTD
Register
on Page
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
CONFIG3H MCLRE
—
P2BMX
T3CMX
HFOFST CCP3MX PBADEN CCP2MX
356
Legend: — = unimplemented locations, read as ‘0’. Shaded bits are not used for PORTD.
DS41412A-page 148
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
10.6.2
PORTE ON 28-PIN DEVICES
10.6 PORTE Registers
For PIC18F2XK22 devices, PORTE is only available
when Master Clear functionality is disabled
(MCLR = 0). In these cases, PORTE is a single bit,
input only port comprised of RE3 only. The pin operates
as previously described.
Depending on the particular PIC18(L)F2X/4XK22
device selected, PORTE is implemented in two
different ways.
10.6.1
PORTE ON 40/44-PIN DEVICES
For PIC18(L)F2X/4XK22 devices, PORTE is a 4-bit
wide port. Three pins (RE0/P3A/CCP3/AN5, RE1/P3B/
AN6 and RE2/CCP5/AN7) are individually configurable
as inputs or outputs. These pins have Schmitt Trigger
input buffers. When selected as an analog input, these
pins will read as ‘0’s.
10.6.3
RE3 WEAK PULL-UP
The port RE3 pin has an individually controlled weak
internal pull-up. When set, the WPUE3 (TRISE<7>) bit
enables the RE3 pin pull-up. The RBPU bit of the
INTCON2 register controls pull-ups on both PORTB
and PORTE. When RBPU = 0, the weak pull-ups
become active on all pins which have the WPUE3 or
WPUBx bits set. When set, the RBPU bit disables all
weak pull-ups. The pull-ups are disabled on a Power-
on Reset. When the RE3 port pin is configured as
The corresponding data direction register is TRISE.
Setting a TRISE bit (= 1) will make the corresponding
PORTE pin an input (i.e., disable the output driver).
Clearing a TRISE bit (= 0) will make the corresponding
PORTE pin an output (i.e., enable the output driver and
put the contents of the output latch on the selected pin).
MCLR,
(CONFIG3H<7>,
MCLRE=1
and
CONFIG4L<2>, LVP=0), or configured for Low Voltage
Programming, (MCLRE=x and LVP=1), the pull-up is
always enabled and the WPUE3 bit has no effect.
TRISE controls the direction of the REx pins, even
when they are being used as analog inputs. The user
must make sure to keep the pins configured as inputs
when using them as analog inputs.
10.6.4
PORTE OUTPUT PRIORITY
Each PORTE pin is multiplexed with other functions.
The pins, their combined functions and their output
priorities are briefly described here. For additional
information, refer to the appropriate section in this data
sheet.
The Data Latch register (LATE) is also memory
mapped. Read-modify-write operations on the LATE
register read and write the latched output value for
PORTE.
Note:
On a Power-on Reset, RE<2:0> are
configured as analog inputs.
When multiple outputs are enabled, the actual pin
control goes to the peripheral with the higher priority.
Table 10-4 lists the PORTE pin functions from the
highest to the lowest priority.
The fourth pin of PORTE (MCLR/VPP/RE3) is an input
only pin. Its operation is controlled by the MCLRE
Configuration bit. When selected as
a port pin
Analog input functions, such as ADC, comparator and
SR Latch inputs, are not shown in the priority lists.
(MCLRE = 0), it functions as a digital input only pin; as
such, it does not have TRIS or LAT bits associated with its
operation. Otherwise, it functions as the device’s Master
Clear input. In either configuration, RE3 also functions as
the programming voltage input during programming.
These inputs are active when the I/O pin is set for
Analog mode using the ANSELx registers. Digital
output functions may control the pin when it is in Analog
mode with the priority shown below.
Note:
On a Power-on Reset, RE3 is enabled as
digital input only if Master Clear
functionality is disabled.
a
EXAMPLE 10-5:
INITIALIZING PORTE
CLRF
PORTE
; Initialize PORTE by
; clearing output
; data latches
CLRF
LATE
; Alternate method
; to clear output
; data latches
CLRF
ANSELE ; Configure analog pins
; for digital only
MOVLW
05h
; Value used to
; initialize data
; direction
MOVWF
TRISE
; Set RE<0> as input
; RE<1> as output
; RE<2> as input
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 149
PIC18(L)F2X/4XK22
TABLE 10-14: PORTE I/O SUMMARY
TRIS ANSEL Pin
Setting Setting Type
Buffer
Type
Pin
Function
Description
RE0/P3A/CCP3/AN5
RE0
0
1
1
0
O
I
DIG
ST
LATE<0> data output; not affected by analog input.
PORTE<0> data input; disabled when analog input
enabled.
(1)
P3A
0
0
1
1
0
1
1
1
0
1
1
0
O
O
I
DIG
DIG
ST
Enhanced CCP3 PWM output.
Compare 3 output/PWM 3 output.
Capture 3 input.
(1)
CCP3
AN5
RE1
I
AN
Analog input 5.
RE1/P3B/AN6
O
I
DIG
ST
LATE<1> data output; not affected by analog input.
PORTE<1> data input; disabled when analog input
enabled.
P3B
AN6
RE2
0
1
0
1
x
1
1
0
O
I
DIG
AN
Enhanced CCP3 PWM output.
Analog input 6.
RE2/CCP5/AN7
O
I
DIG
ST
LATE<2> data output; not affected by analog input.
PORTE<2> data input; disabled when analog input
enabled.
CCP5
0
1
1
0
O
I
DIG
ST
Compare 5 output/PWM 5 output.
Capture 5 input.
AN7
RE3
1
1
I
AN
ST
Analog input 7.
—
—
I
PORTE<3> data input; enabled when Configuration bit
RE3/VPP/MCLR
MCLRE = 0.
VPP
—
—
—
—
P
I
AN
ST
Programming voltage input; always available
MCLR
Active-low Master Clear (device Reset) input; enabled
when configuration bit MCLRE = 1.
Legend:
AN = Analog input or output; TTL = TTL compatible input; HV = High Voltage; OD = Open Drain; XTAL = Crystal; CMOS
2
2
= CMOS compatible input or output; ST = Schmitt Trigger input with CMOS levels; I CTM = Schmitt Trigger input with I C.
Note 1: Alternate pin assignment for P3A/CCP3 when Configuration bit CCP3MX is clear..
TABLE 10-15: REGISTERS ASSOCIATED WITH PORTE
Reset
Values
on page
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
ANSELE(1)
INTCON2
LATE(1)
—
RBPU
—
—
—
—
—
—
ANSE2
TMR0IP
LATE2
RE2(1)
SLRC
ANSE1
—
ANSE0
RBIP
155
116
156
153
157
155
INTEDG0 INTEDG1 INTEDG2
—
—
—
—
—
—
—
—
—
—
LATE1
RE1(1)
SLRB
LATE0
RE0(1)
SLRA
PORTE
—
—
RE3
SLRD(1)
—
SLRCON
TRISE
—
SLRE(1)
—
WPUE3
TRISE2(1) TRISE1(1) TRISE0(1)
Legend: — = unimplemented locations, read as ‘0’. Shaded bits are not used for PORTE.
Note 1: Available on PIC18(L)F4XK22 devices.
DS41412A-page 150
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
TABLE 10-16: CONFIGURATION REGISTERS ASSOCIATED WITH PORTE
Reset
Values
on page
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
CONFIG3H
CONFIG4L
—
P2BMX
—
T3CMX
—
HFOFST CCP3MX PBADEN CCP2MX
LVP(1)
STRVEN
356
357
MCLRE
DEBUG
XINST
—
—
Legend: — = unimplemented locations, read as ‘0’. Shaded bits are not used for Interrupts.
Note 1: Can only be changed when in high voltage programming mode.
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 151
PIC18(L)F2X/4XK22
10.7 Port Analog Control
10.8 Port Slew Rate Control
Most port pins are multiplexed with analog functions
such as the Analog-to-Digital Converter and
comparators. When these I/O pins are to be used as
analog inputs it is necessary to disable the digital input
buffer to avoid excessive current caused by improper
biasing of the digital input. Individual control of the
digital input buffers on pins which share analog
functions is provided by the ANSELA, ANSELB,
ANSELC, ANSELD and ANSELE registers. Setting an
ANSx bit high will disable the associated digital input
buffer and cause all reads of that pin to return ‘0’ while
allowing analog functions of that pin to operate
correctly.
The output slew rate of each port is programmable to
select either the standard transition rate or a reduced
transition rate of approximately 0.1 times the standard
to minimize EMI. The reduced transition time is the
default slew rate for all ports.
The state of the ANSx bits has no affect on digital
output functions. A pin with the associated TRISx bit
clear and ANSx bit set will still operate as a digital
output but the input mode will be analog. This can
cause unexpected behavior when performing read-
modify-write operations on the affected port.
All ANSEL register bits default to ‘1’ upon POR and
BOR, disabling digital inputs for their associated port
pins. All TRIS register bits default to ‘1’ upon POR or
BOR, disabling digital outputs for their associated port
pins. As a result, all port pins that have an ANSEL
register will default to analog inputs upon POR or BOR.
REGISTER 10-1: PORTX(1): PORTx REGISTER
R/W-u/x
Rx7
R/W-u/x
Rx6
R/W-u/x
Rx5
R/W-u/x
Rx4
R/W-u/x
Rx3
R/W-u/x
Rx2
R/W-u/x
Rx1
R/W-u/x
Rx0
bit 7
bit 0
Legend:
R = Readable bit
‘1’ = Bit is set
W = Writable bit
U = Unimplemented bit, read as ‘0’
x = Bit is unknown
‘0’ = Bit is cleared
-n/n = Value at POR and BOR/Value at all other Resets
bit 7-0
Rx<7:0>: PORTx I/O bit values(2)
Note 1: Register Description for PORTA, PORTB, PORTC and PORTD.
2: Writes to PORTx are written to corresponding LATx register. Reads from PORTx register is return of I/O
pin values.
DS41412A-page 152
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
REGISTER 10-2: PORTE: PORTE REGISTER
U-0
—
U-0
—
U-0
—
U-0
—
R/W-u/x
RE3(1)
R/W-u/x
RE2(2), (3)
R/W-u/x
RE1(2), (3)
R/W-u/x
RE0(2), (3)
bit 7
bit 0
Legend:
R = Readable bit
‘1’ = Bit is set
W = Writable bit
U = Unimplemented bit, read as ‘0’
x = Bit is unknown
‘0’ = Bit is cleared
-n/n = Value at POR and BOR/Value at all other Resets
bit 7-4
bit 3
Unimplemented: Read as ‘0’
RE3: PORTE Input bit value(1)
RE<2:0>: PORTE I/O bit values(2), (3)
bit 2-0
Note 1: Port is available as input only when MCLRE = 0.
2: Writes to PORTx are written to corresponding LATx register. Reads from PORTx register is return of I/O
pin values.
3: Available on PIC18(L)F4XK22 devices.
REGISTER 10-3: ANSELA – PORTA ANALOG SELECT REGISTER
U-0
—
U-0
—
R/W-1
U-0
—
R/W-1
R/W-1
R/W-1
R/W-1
ANSA5
ANSA3
ANSA2
ANSA1
ANSA0
bit 7
bit 0
Legend:
R = Readable bit
-n = Value at POR
W = Writable bit
‘1’ = Bit is set
U = Unimplemented bit, read as ‘0’
‘0’ = Bit is cleared x = Bit is unknown
bit 7-6
bit 5
Unimplemented: Read as ‘0’
ANSA5: RA5 Analog Select bit
1= Digital input buffer disabled
0= Digital input buffer enabled
bit 4
Unimplemented: Read as ‘0’
bit 3-0
ANSA<3:0>: RA<3:0> Analog Select bit
1= Digital input buffer disabled
0= Digital input buffer enabled
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 153
PIC18(L)F2X/4XK22
REGISTER 10-4: ANSELB – PORTB ANALOG SELECT REGISTER
U-0
—
U-0
—
R/W-1
U-0
R/W-1
R/W-1
R/W-1
R/W-1
ANSB5
ANSB4
ANSB3
ANSB2
ANSB1
ANSB0
bit 7
bit 0
Legend:
R = Readable bit
-n = Value at POR
W = Writable bit
‘1’ = Bit is set
U = Unimplemented bit, read as ‘0’
‘0’ = Bit is cleared x = Bit is unknown
bit 7-6
bit 5-0
Unimplemented: Read as ‘0’
ANSB<5:0>: RB<5:0> Analog Select bit
1= Digital input buffer disabled
0= Digital input buffer enabled
REGISTER 10-5: ANSELC – PORTC ANALOG SELECT REGISTER
R/W-1
R/W-1
R/W-1
U-0
R/W-1
R/W-1
U-0
—
U-0
—
ANSC7
ANSC6
ANSC5
ANSC4
ANSC3
ANSC2
bit 7
bit 0
Legend:
R = Readable bit
-n = Value at POR
W = Writable bit
‘1’ = Bit is set
U = Unimplemented bit, read as ‘0’
‘0’ = Bit is cleared x = Bit is unknown
bit 7-2
bit 1-0
ANSC<7:2>: RC<7:2> Analog Select bit
1= Digital input buffer disabled
0= Digital input buffer enabled
Unimplemented: Read as ‘0’
REGISTER 10-6: ANSELD – PORTD ANALOG SELECT REGISTER
R/W-1
R/W-1
R/W-1
R/W-1
R/W-1
R/W-1
R/W-1
R/W-1
ANSD7
ANSD6
ANSD5
ANSD4
ANSD3
ANSD2
ANSD1
ANSD0
bit 7
bit 0
Legend:
R = Readable bit
-n = Value at POR
W = Writable bit
‘1’ = Bit is set
U = Unimplemented bit, read as ‘0’
‘0’ = Bit is cleared x = Bit is unknown
bit 7-0
ANSD<7:0>: RD<7:0> Analog Select bit
1= Digital input buffer disabled
0= Digital input buffer enabled
DS41412A-page 154
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
REGISTER 10-7: ANSELE – PORTE ANALOG SELECT REGISTER
U-0
—
U-0
—
U-0
—
U-0
—
U-0
—
R/W-1
ANSE2(1)
R/W-1
ANSE1(1)
U-0
ANSE0(1)
bit 7
bit 0
Legend:
R = Readable bit
-n = Value at POR
W = Writable bit
‘1’ = Bit is set
U = Unimplemented bit, read as ‘0’
‘0’ = Bit is cleared x = Bit is unknown
bit 7-3
bit 2-0
Unimplemented: Read as ‘0’
ANSE<2:0>: RE<2:0> Analog Select bit(1)
1= Digital input buffer disabled
0= Digital input buffer enabled
Note 1: Available on PIC18(L)F4XK22 devices only.
REGISTER 10-8: TRISx: PORTx TRI-STATE REGISTER(1)
R/W-1
R/W-1
R/W-1
R/W-1
R/W-1
R/W-1
R/W-1
R/W-1
TRISx7
TRISx6
TRISx5
TRISx4
TRISx3
TRISx2
TRISx1
TRISx0
bit 7
bit 0
Legend:
R = Readable bit
-n = Value at POR
W = Writable bit
‘1’ = Bit is set
U = Unimplemented bit, read as ‘0’
‘0’ = Bit is cleared x = Bit is unknown
bit 7-0
TRISx<7:0>: PORTx Tri-State Control bit
1= PORTx pin configured as an input (tri-stated)
0= PORTx pin configured as an output
Note 1: Register description for TRISA, TRISB, TRISC and TRISD.
REGISTER 10-9: TRISE: PORTE TRI-STATE REGISTER
R/W-1
U-0
—
U-0
—
U-0
—
U-0
—
R/W-1
TRISE2(1)
R/W-1
TRISE1(1)
R/W-1
TRISE0(1)
WPUE3
bit 7
bit 0
Legend:
R = Readable bit
-n = Value at POR
W = Writable bit
‘1’ = Bit is set
U = Unimplemented bit, read as ‘0’
‘0’ = Bit is cleared x = Bit is unknown
bit 7
WPUE3: Weak Pull-up Register bits
1= Pull-up enabled on PORT pin
1= Pull-up disabled on PORT pin
bit 6-3
bit 2-0
Unimplemented: Read as ‘0’
TRISE<7:0>: PORTE Tri-State Control bit(1)
1= PORTE pin configured as an input (tri-stated)
0= PORTE pin configured as an output
Note 1: Available on PIC18(L)F4XK22 devices only.
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 155
PIC18(L)F2X/4XK22
REGISTER 10-10: LATx: PORTx OUTPUT LATCH REGISTER(1)
R/W-x/u
LATx7
R/W-x/u
LATx6
R/W-x/u
LATx5
R/W-x/u
LATx4
R/W-x/u
LATx3
R/W-x/u
LATx2
R/W-x/u
LATx1
R/W-x/u
LATx0
bit 7
bit 0
Legend:
R = Readable bit
-n = Value at POR
W = Writable bit
‘1’ = Bit is set
U = Unimplemented bit, read as ‘0’
‘0’ = Bit is cleared x = Bit is unknown
bit 7-0
LATx<7:0>: PORTx Output Latch bit value(2)
Note 1: Register Description for LATA, LATB, LATC and LATD.
2: Writes to PORTA are written to corresponding LATA register. Reads from PORTA register is return of I/O
pin values.
REGISTER 10-11: LATE: PORTE OUTPUT LATCH REGISTER(1)
U-0
—
U-0
—
U-0
—
U-0
—
U-0
—
R/W-x/u
LATE2
R/W-x/u
LATE1
R/W-x/u
LATE0
bit 7
bit 0
Legend:
R = Readable bit
-n = Value at POR
W = Writable bit
‘1’ = Bit is set
U = Unimplemented bit, read as ‘0’
‘0’ = Bit is cleared x = Bit is unknown
bit 7-3
bit 2-0
Unimplemented: Read as ‘0’
LATE<2:0>: PORTE Output Latch bit value(2)
Note 1: Available on PIC18(L)F4XK22 devices only.
2: Writes to PORTA are written to corresponding LATA register. Reads from PORTA register is return of I/O
pin values.
REGISTER 10-12: WPUB: WEAK PULL-UP PORTB REGISTER
R/W-1
R/W-1
R/W-1
R/W-1
R/W-1
R/W-1
R/W-1
R/W-1
WPUB7
WPUB6
WPUB5
WPUB4
WPUB3
WPUB2
WPUB1
WPUB0
bit 7
bit 0
Legend:
R = Readable bit
-n = Value at POR
W = Writable bit
‘1’ = Bit is set
U = Unimplemented bit, read as ‘0’
‘0’ = Bit is cleared x = Bit is unknown
bit 7-0
WPUB<7:0>: Weak Pull-up Register bits
1= Pull-up enabled on PORT pin
1= Pull-up disabled on PORT pin
DS41412A-page 156
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
REGISTER 10-13: IOCB: INTERRUPT-ON-CHANGE PORTB CONTROL REGISTER
R/W-1
IOCB7
R/W-1
IOCB6
R/W-1
IOCB5
R/W-1
IOCB4
U-0
—
U-0
—
U-0
—
U-0
—
bit 7
bit 0
Legend:
R = Readable bit
-n = Value at POR
W = Writable bit
‘1’ = Bit is set
U = Unimplemented bit, read as ‘0’
‘0’ = Bit is cleared x = Bit is unknown
bit 7-4
IOCB<7:4>: Interrupt-on-Change PORTB control bits
1= Interrupt-on-change enabled(1)
0= Interrupt-on-change disabled
Note 1: Interrupt-on-change requires that the RBIE bit (INTCON<3>) is set.
REGISTER 10-14: SLRCON: SLEW RATE CONTROL REGISTER
U-0
—
U-0
—
U-0
—
R/W-1
SLRE(1)
R/W-1
SLRD(1)
R/W-1
SLRC
R/W-1
SLRB
R/W-1
SLRA
bit 7
bit 0
Legend:
R = Readable bit
-n = Value at POR
W = Writable bit
‘1’ = Bit is set
U = Unimplemented bit, read as ‘0’
‘0’ = Bit is cleared x = Bit is unknown
bit 7-5
bit 4
Unimplemented: Read as ‘0’
SLRE: PORTE Slew Rate Control bit(1)
1= All outputs on PORTE slew at a limited rate
0= All outputs on PORTE slew at the standard rate
bit 3
bit 2
bit 1
bit 0
SLRD: PORTD Slew Rate Control bit(1)
1= All outputs on PORTD slew at a limited rate
0= All outputs on PORTD slew at the standard rate
SLRC: PORTC Slew Rate Control bit
1= All outputs on PORTC slew at a limited rate
0= All outputs on PORTC slew at the standard rate
SLRB: PORTB Slew Rate Control bit
1= All outputs on PORTB slew at a limited rate
0= All outputs on PORTB slew at the standard rate
SLRA: PORTA Slew Rate Control bit
1= All outputs on PORTA slew at a limited rate(2)
0= All outputs on PORTA slew at the standard rate
Note 1: These bits are available on PIC18(L)F4XK22 devices.
2: The slew rate of RA6 defaults to standard rate when the pin is used as CLKOUT.
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 157
PIC18(L)F2X/4XK22
NOTES:
DS41412A-page 158
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
The T0CON register (Register 11-1) controls all
aspects of the module’s operation, including the
prescale selection. It is both readable and writable.
11.0 TIMER0 MODULE
The Timer0 module incorporates the following features:
• Software selectable operation as a timer or
counter in both 8-bit or 16-bit modes
A simplified block diagram of the Timer0 module in 8-bit
mode is shown in Figure 11-1. Figure 11-2 shows a
simplified block diagram of the Timer0 module in 16-bit
mode.
• Readable and writable registers
• Dedicated 8-bit, software programmable
prescaler
• Selectable clock source (internal or external)
• Edge select for external clock
• Interrupt-on-overflow
REGISTER 11-1: T0CON: TIMER0 CONTROL REGISTER
R/W-1
R/W-1
R/W-1
T0CS
R/W-1
T0SE
R/W-1
PSA
R/W-1
R/W-1
R/W-1
bit 0
TMR0ON
T08BIT
TOPS<2:0>
bit 7
Legend:
R = Readable bit
-n = Value at POR
W = Writable bit
‘1’ = Bit is set
U = Unimplemented bit, read as ‘0’
‘0’ = Bit is cleared x = Bit is unknown
bit 7
bit 6
bit 5
bit 4
bit 3
bit 2-0
TMR0ON: Timer0 On/Off Control bit
1= Enables Timer0
0= Stops Timer0
T08BIT: Timer0 8-bit/16-bit Control bit
1= Timer0 is configured as an 8-bit timer/counter
0= Timer0 is configured as a 16-bit timer/counter
T0CS: Timer0 Clock Source Select bit
1= Transition on T0CKI pin
0= Internal instruction cycle clock (CLKOUT)
T0SE: Timer0 Source Edge Select bit
1= Increment on high-to-low transition on T0CKI pin
0= Increment on low-to-high transition on T0CKI pin
PSA: Timer0 Prescaler Assignment bit
1= TImer0 prescaler is NOT assigned. Timer0 clock input bypasses prescaler.
0= Timer0 prescaler is assigned. Timer0 clock input comes from prescaler output.
T0PS<2:0>: Timer0 Prescaler Select bits
111= 1:256 prescale value
110= 1:128 prescale value
101= 1:64 prescale value
100= 1:32 prescale value
011= 1:16 prescale value
010= 1:8 prescale value
001= 1:4 prescale value
000= 1:2 prescale value
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 159
PIC18(L)F2X/4XK22
11.1 Timer0 Operation
11.2 Timer0 Reads and Writes in
16-Bit Mode
Timer0 can operate as either a timer or a counter; the
mode is selected with the T0CS bit of the T0CON
register. In Timer mode (T0CS = 0), the module
increments on every clock by default unless a different
prescaler value is selected (see Section 11.3
“Prescaler”). Timer0 incrementing is inhibited for two
instruction cycles following a TMR0 register write. The
user can work around this by adjusting the value written
to the TMR0 register to compensate for the anticipated
missing increments.
TMR0H is not the actual high byte of Timer0 in 16-bit
mode; it is actually a buffered version of the real high
byte of Timer0 which is neither directly readable nor
writable (refer to Figure 11-2). TMR0H is updated with
the contents of the high byte of Timer0 during a read of
TMR0L. This provides the ability to read all 16 bits of
Timer0 without the need to verify that the read of the
high and low byte were valid. Invalid reads could
otherwise occur due to a rollover between successive
reads of the high and low byte.
The Counter mode is selected by setting the T0CS bit
(= 1). In this mode, Timer0 increments either on every
rising or falling edge of pin RA4/T0CKI. The increment-
ing edge is determined by the Timer0 Source Edge
Select bit, T0SE of the T0CON register; clearing this bit
selects the rising edge. Restrictions on the external
clock input are discussed below.
Similarly, a write to the high byte of Timer0 must also
take place through the TMR0H Buffer register. Writing
to TMR0H does not directly affect Timer0. Instead, the
high byte of Timer0 is updated with the contents of
TMR0H when a write occurs to TMR0L. This allows all
16 bits of Timer0 to be updated at once.
An external clock source can be used to drive Timer0;
however, it must meet certain requirements (see
Table 27-11) to ensure that the external clock can be
synchronized with the internal phase clock (TOSC).
There is a delay between synchronization and the
onset of incrementing the timer/counter.
FIGURE 11-1:
TIMER0 BLOCK DIAGRAM (8-BIT MODE)
FOSC/4
0
1
1
0
Set
TMR0IF
on Overflow
Sync with
Internal
Clocks
TMR0L
8
Programmable
Prescaler
T0CKI pin
(2 TCY Delay)
T0SE
T0CS
3
T0PS<2:0>
PSA
8
Internal Data Bus
Note: Upon Reset, Timer0 is enabled in 8-bit mode with clock input from T0CKI max. prescale.
DS41412A-page 160
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
FIGURE 11-2:
TIMER0 BLOCK DIAGRAM (16-BIT MODE)
FOSC/4
0
1
1
0
Sync with
Internal
Clocks
Set
TMR0IF
on Overflow
TMR0
High Byte
TMR0L
Programmable
Prescaler
T0CKI pin
8
(2 TCY Delay)
T0SE
T0CS
3
Read TMR0L
Write TMR0L
T0PS<2:0>
PSA
8
8
TMR0H
8
8
Internal Data Bus
Note: Upon Reset, Timer0 is enabled in 8-bit mode with clock input from T0CKI max. prescale.
11.3.1
SWITCHING PRESCALER
ASSIGNMENT
11.3 Prescaler
An 8-bit counter is available as a prescaler for the Timer0
module. The prescaler is not directly readable or writable;
its value is set by the PSA and T0PS<2:0> bits of the
T0CON register which determine the prescaler
assignment and prescale ratio.
The prescaler assignment is fully under software
control and can be changed “on-the-fly” during program
execution.
11.4 Timer0 Interrupt
Clearing the PSA bit assigns the prescaler to the
Timer0 module. When the prescaler is assigned,
prescale values from 1:2 through 1:256 in integer
power-of-2 increments are selectable.
The TMR0 interrupt is generated when the TMR0 reg-
ister overflows from FFh to 00h in 8-bit mode, or from
FFFFh to 0000h in 16-bit mode. This overflow sets the
TMR0IF flag bit. The interrupt can be masked by clear-
ing the TMR0IE bit of the INTCON register. Before
re-enabling the interrupt, the TMR0IF bit must be
cleared by software in the Interrupt Service Routine.
When assigned to the Timer0 module, all instructions
writing to the TMR0 register (e.g., CLRF TMR0, MOVWF
TMR0, BSF TMR0, etc.) clear the prescaler count.
Note:
Writing to TMR0 when the prescaler is
assigned to Timer0 will clear the prescaler
count but will not change the prescaler
assignment.
Since Timer0 is shut down in Sleep mode, the TMR0
interrupt cannot awaken the processor from Sleep.
TABLE 11-1: REGISTERS ASSOCIATED WITH TIMER0
Reset
Values
on page
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
INTCON
INTCON2
T0CON
TMR0H
TMR0L
TRISA
GIE/GIEH PEIE/GIEL TMR0IE
INT0IE
RBIE
TMR0IF
TMR0IP
INT0IF
RBIF
RBIP
115
116
159
—
—
—
RBPU
INTEDG0 INTEDG1 INTEDG2
TMR0ON
T08BIT
T0CS
T0SE
PSA
T0PS<2:0>
Timer0 Register, High Byte
Timer0 Register, Low Byte
—
TRISA7
TRISA6
TRISA5
TRISA4
TRISA3
TRISA2
TRISA1
TRISA0
155
Legend: — = unimplemented locations, read as ‘0’. Shaded bits are not used by Timer0.
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 161
PIC18(L)F2X/4XK22
NOTES:
DS41412A-page 162
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
• Special Event Trigger (with CCP/ECCP)
• Selectable Gate Source Polarity
• Gate Toggle Mode
12.0 TIMER1/3/5 MODULE WITH
GATE CONTROL
The Timer1/3/5 module is a 16-bit timer/counter with
the following features:
• Gate Single-pulse Mode
• Gate Value Status
• 16-bit timer/counter register pair (TMRxH:TMRxL)
• Programmable internal or external clock source
• 2-bit prescaler
• Gate Event Interrupt
Figure 12-1 is a block diagram of the Timer1/3/5
module.
• Dedicated Secondary 32 kHz oscillator circuit
• Optionally synchronized comparator out
• Multiple Timer1/3/5 gate (count enable) sources
• Interrupt on overflow
• Wake-up on overflow (external clock,
Asynchronous mode only)
• 16-Bit Read/Write Operation
• Time base for the Capture/Compare function
FIGURE 12-1:
TIMER1/3/5 BLOCK DIAGRAM
TxGSS<1:0>
TxGSPM
00
TxG
Timer2/4/6 Match
PR2/4/6
0
01
10
11
TxG_IN
D
Data Bus
TxGVAL
0
1
D
Q
Comparator 1
SYNCC1OUT
Single Pulse
Acq. Control
RD
1
TXGCON
Q1 EN
Q
Q
Comparator 2
SYNCC2OUT
Interrupt
Set
TxGGO/DONE
CK
R
TMRxON
TxGTM
TMRxGIF
det
TxGPOL
TMRxGE
Set flag bit
TMRxIF on
Overflow
TMRxON
To Comparator Module
TMRx(2,4)
EN
D
Synchronized
clock input
0
TxCLK
TMRxH
TMRxL
Q
1
TMRxCS<1:0>
Reserved
Secondary
Oscillator
Module
TxSYNC
SOSCOUT
11
10
Synchronize(3)
det
See Figure 2-4
Prescaler
1, 2, 4, 8
1
0
TxCLK
External
Clock
(5)(6)
2
TxCKI
TxCKPS<1:0>
FOSC
Internal
Clock
01
00
FOSC/2
Internal
Clock
TxSOSCEN
Sleep input
FOSC/4
Internal
Clock
Note 1: ST Buffer is high speed type when using TxCKI.
2: Timer1/3/5 register increments on rising edge.
3: Synchronize does not operate while in Sleep.
4: See Figure 12-2 for 16-Bit Read/Write Mode Block Diagram.
5: T1CKI is not available when the secondary oscillator is enabled. (SOSCGO = 1or TXSOSCEN = 1)
6: T3CKI is not available when the secondary oscillator is enabled, unless T3CMX = 1.
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 163
PIC18(L)F2X/4XK22
12.2.1
INTERNAL CLOCK SOURCE
12.1 Timer1/3/5 Operation
When the internal clock source is selected the
TMRxH:TMRxL register pair will increment on multiples
of FOSC as determined by the Timer1/3/5 prescaler.
The Timer1/3/5 module is a 16-bit incrementing
counter which is accessed through the TMRxH:TMRxL
register pair. Writes to TMRxH or TMRxL directly
update the counter.
When the FOSC internal clock source is selected, the
Timer1/3/5 register value will increment by four counts
every instruction clock cycle. Due to this condition, a
2 LSB error in resolution will occur when reading the
Timer1/3/5 value. To utilize the full resolution of
Timer1/3/5, an asynchronous input signal must be used
to gate the Timer1/3/5 clock input.
When used with an internal clock source, the module is
a timer and increments on every instruction cycle.
When used with an external clock source, the module
can be used as either a timer or counter and
increments on every selected edge of the external
source.
The following asynchronous sources may be used:
Timer1/3/5 is enabled by configuring the TMRxON and
TMRxGE bits in the TxCON and TxGCON registers,
respectively. Table 12-1 displays the Timer1/3/5 enable
selections.
• Asynchronous event on the TxG pin to Timer1/3/5
Gate
• C1 or C2 comparator input to Timer1/3/5 Gate
12.2.2
EXTERNAL CLOCK SOURCE
TABLE 12-1: TIMER1/3/5 ENABLE
SELECTIONS
When the external clock source is selected, the
Timer1/3/5 module may work as a timer or a counter.
Timer1/3/5
Operation
TMRxON
TMRxGE
When enabled to count, Timer1/3/5 is incremented on
the rising edge of the external clock input of the TxCKI
pin. This external clock source can be synchronized to
the microcontroller system clock or it can run
asynchronously.
0
0
1
1
0
1
0
1
Off
Off
Always On
When used as a timer with a clock oscillator, an
external 32.768 kHz crystal can be used in conjunction
with the dedicated secondary internal oscillator circuit.
Count Enabled
12.2 Clock Source Selection
Note:
In Counter mode, a falling edge must be
registered by the counter prior to the first
incrementing rising edge after any one or
more of the following conditions:
The TMRxCS<1:0> and TxSOSCEN bits of the TxCON
register are used to select the clock source for
Timer1/3/5. The dedicated Secondary Oscillator circuit
can be used as the clock source for Timer1, Timer3 and
Timer5, simultaneously. Any of the TxSOSCEN bits will
enable the Secondary Oscillator circuit and select it as
the clock source for that particular timer. Table 12-2
displays the clock source selections.
• Timer1/3/5 enabled after POR
• Write to TMRxH or TMRxL
• Timer1/3/5 is disabled
• Timer1/3/5 is disabled (TMRxON = 0)
when TxCKI is high then Timer1/3/5
is enabled (TMRxON=1) when TxCKI
is low.
TABLE 12-2: CLOCK SOURCE SELECTIONS
TMRxCS1
TMRxCS0
TxSOSCEN
Clock Source
0
0
1
1
1
0
0
0
x
x
0
1
System Clock (FOSC)
Instruction Clock (FOSC/4)
External Clocking on TxCKI Pin
Osc.Circuit On SOSCI/SOSCO Pins
DS41412A-page 164
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
12.5.1
READING AND WRITING
TIMER1/3/5 IN ASYNCHRONOUS
COUNTER MODE
12.3 Timer1/3/5 Prescaler
Timer1/3/5 has four prescaler options allowing 1, 2, 4 or
8 divisions of the clock input. The TxCKPS bits of the
TxCON register control the prescale counter. The
prescale counter is not directly readable or writable;
however, the prescaler counter is cleared upon a write to
TMRxH or TMRxL.
Reading TMRxH or TMRxL while the timer is running
from an external asynchronous clock will ensure a valid
read (taken care of in hardware). However, the user
should keep in mind that reading the 16-bit timer in two
8-bit values itself, poses certain problems, since the
timer may overflow between the reads. For writes, it is
recommended that the user simply stop the timer and
write the desired values. A write contention may occur
by writing to the timer registers, while the register is
incrementing. This may produce an unpredictable
value in the TMRxH:TMRxL register pair.
12.4 Secondary Oscillator
A
dedicated secondary low-power 32.768 kHz
oscillator circuit is built-in between pins SOSCI (input)
and SOSCO (amplifier output). This internal circuit is to
be used in conjunction with an external 32.768 kHz
crystal.
12.6 Timer1/3/5 16-Bit Read/Write Mode
The oscillator circuit is enabled by setting the
TxSOSCEN bit of the TxCON register, the SOSCGO bit
of the OSCCON2 register or by selecting the
secondary oscillator as the system clock by setting
SCS<1:0> = 01in the OSCCON register. The oscillator
will continue to run during Sleep.
Timer1/3/5 can be configured to read and write all 16
bits of data, to and from, the 8-bit TMRxL and TMRxH
registers, simultaneously. The 16-bit read and write
operations are enabled by setting the RD16 bit of the
TxCON register.
Note:
The oscillator requires a start-up and
stabilization time before use. Thus,
TxSOSCEN should be set and a suitable
delay observed prior to enabling
Timer1/3/5.
To accomplish this function, the TMRxH register value
is mapped to a buffer register called the TMRxH buffer
register. While in 16-Bit mode, the TMRxH register is
not directly readable or writable and all read and write
operations take place through the use of this TMRxH
buffer register.
12.5 Timer1/3/5 Operation in
Asynchronous Counter Mode
When a read from the TMRxL register is requested, the
value of the TMRxH register is simultaneously loaded
into the TMRxH buffer register. When a read from the
TMRxH register is requested, the value is provided
from the TMRxH buffer register instead. This provides
the user with the ability to accurately read all 16 bits of
the Timer1/3/5 value from a single instance in time.
If control bit TxSYNC of the TxCON register is set, the
external clock input is not synchronized. The timer
increments asynchronously to the internal phase
clocks. If external clock source is selected then the
timer will continue to run during Sleep and can
generate an interrupt on overflow, which will wake-up
the processor. However, special precautions in
software are needed to read/write the timer (see
Section 12.5.1 “Reading and Writing Timer1/3/5 in
Asynchronous Counter Mode”).
In contrast, when not in 16-Bit mode, the user must
read each register separately and determine if the
values have become invalid due to a rollover that may
have occurred between the read operations.
When a write request of the TMRxL register is
requested, the TMRxH buffer register is simultaneously
updated with the contents of the TMRxH register. The
value of TMRxH must be preloaded into the TMRxH
buffer register prior to the write request for the TMRxL
register. This provides the user with the ability to write
all 16 bits to the TMRxL:TMRxH register pair at the
same time.
Note:
When switching from synchronous to
asynchronous operation, it is possible to
skip an increment. When switching from
asynchronous to synchronous operation,
it is possible to produce an additional
increment.
Any requests to write to the TMRxH directly does not
clear the Timer1/3/5 prescaler value. The prescaler
value is only cleared through write requests to the
TMRxL register.
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 165
PIC18(L)F2X/4XK22
FIGURE 12-2:
TIMER1/3/5 16-BIT
READ/WRITE MODE
BLOCK DIAGRAM
12.7.2
TIMER1/3/5 GATE SOURCE
SELECTION
The Timer1/3/5 Gate source can be selected from one
of four different sources. Source selection is controlled
by the TxGSS bits of the TxGCON register. The polarity
for each available source is also selectable. Polarity
selection is controlled by the TxGPOL bit of the
TxGCON register.
From
Timer1/3/5
Circuitry
Set
TMR1
High Byte
TMR1L
TMR1IF
on Overflow
8
TABLE 12-4: TIMER1/3/5 GATE SOURCES
Read TMR1L
Write TMR1L
TxGSS
Timer1/3/5 Gate Source
Timer1/3/5 Gate Pin
8
8
00
01
TMR1H
Timer2/4/6 Match to PR2/4/6
(TMR2/4/6 increments to match PR2/4/6)
8
10
11
Comparator 1 Output SYNCC1OUT
(optionally Timer1/3/5 synchronized out-
put)
8
Internal Data Bus
Comparator 2 Output SYNCC2OUT
(optionally Timer1/3/5 synchronized out-
put)
12.7 Timer1/3/5 Gate
Timer1/3/5 can be configured to count freely or the
count can be enabled and disabled using Timer1/3/5
Gate circuitry. This is also referred to as Timer1/3/5
Gate Enable.
The Gate resource, Timer2 Match to PR2, changes
between Timer2, Timer4 and Timer6 depending on
which of the three 16-bit Timers, Timer1, Timer3 or
Timer5, is selected. See Table 12-5 to determine which
Timer2/4/6 Match to PR2/4/6 combination is available
for the 16-bit timer being used.
Timer1/3/5 Gate can also be driven by multiple
selectable sources.
12.7.1
TIMER1/3/5 GATE ENABLE
TABLE 12-5: GATE RESOURCES FOR
TIMER2/4/6 MATCH TO
PR2/4/6
The Timer1/3/5 Gate Enable mode is enabled by
setting the TMRxGE bit of the TxGCON register. The
polarity of the Timer1/3/5 Gate Enable mode is
configured using the TxGPOL bit of the TxGCON
register.
Timer1/3/5 Gate Match
Timer1/3/5 Resource
Selection
When Timer1/3/5 Gate Enable mode is enabled,
Timer1/3/5 will increment on the rising edge of the
Timer1/3/5 clock source. When Timer1/3/5 Gate
Enable mode is disabled, no incrementing will occur
and Timer1/3/5 will hold the current count. See
Figure 12-4 for timing details.
Timer1
Timer3
Timer5
TMR2 Match to PR2
TMR4 Match to PR4
TMR6 Match to PR6
12.7.2.1
TxG Pin Gate Operation
The TxG pin is one source for Timer1/3/5 Gate Control.
It can be used to supply an external source to the
Timer1/3/5 Gate circuitry.
TABLE 12-3: TIMER1/3/5 GATE ENABLE
SELECTIONS
12.7.2.2
Timer2/4/6 Match Gate Operation
Timer1/3/5
Operation
TxCLK TxGPOL
TxG
The TMR2/4/6 register will increment until it matches
the value in the PR2/4/6 register. On the very next
increment cycle, TMR2/4/6 will be reset to 00h. When
this Reset occurs, a low-to-high pulse will automatically
be generated and internally supplied to the Timer1/3/5
Gate circuitry. See Section 12.7.2 “Timer1/3/5 Gate
Source Selection” for more information.
0
0
1
1
0
1
0
1
Counts
Holds Count
Holds Count
Counts
DS41412A-page 166
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
12.7.2.3
Comparator C1 Gate Operation
12.7.4
TIMER1/3/5 GATE SINGLE-PULSE
MODE
The output resulting from a Comparator 1 operation can
be selected as a source for Timer1/3/5 Gate Control.
The Comparator 1 output (SYNCC1OUT) can be
synchronized to the Timer1/3/5 clock or left
asynchronous. For more information see Section 18.8.4
“Synchronizing Comparator Output to Timer1”.
When Timer1/3/5 Gate Single-Pulse mode is enabled,
it is possible to capture a single-pulse gate event.
Timer1/3/5 Gate Single-Pulse mode is first enabled by
setting the TxGSPM bit in the TxGCON register. Next,
the TxGGO/DONE bit in the TxGCON register must be
set. The Timer1/3/5 will be fully enabled on the next
incrementing edge. On the next trailing edge of the
pulse, the TxGGO/DONE bit will automatically be
cleared. No other gate events will be allowed to
increment Timer1/3/5 until the TxGGO/DONE bit is
once again set in software.
12.7.2.4
Comparator C2 Gate Operation
The output resulting from a Comparator 2 operation
can be selected as a source for Timer1/3/5 Gate
Control. The Comparator 2 output (SYNCC2OUT) can
be synchronized to the Timer1/3/5 clock or left
asynchronous.
Section 18.8.4 “Synchronizing Comparator Output
to Timer1”.
For
more
information
see
Clearing the TxGSPM bit of the TxGCON register will
also clear the TxGGO/DONE bit. See Figure 12-6 for
timing details.
Enabling the Toggle mode and the Single-Pulse mode
simultaneously will permit both sections to work
together. This allows the cycle times on the Timer1/3/5
Gate source to be measured. See Figure 12-7 for
timing details.
12.7.3
When Timer1/3/5 Gate Toggle mode is enabled, it is
possible to measure the full-cycle length of
Timer1/3/5 gate signal, as opposed to the duration of a
single level pulse.
TIMER1/3/5 GATE TOGGLE MODE
a
12.7.5
TIMER1/3/5 GATE VALUE STATUS
The Timer1/3/5 Gate source is routed through a flip-flop
that changes state on every incrementing edge of the
signal. See Figure 12-5 for timing details.
When Timer1/3/5 Gate Value Status is utilized, it is
possible to read the most current level of the gate
control value. The value is stored in the TxGVAL bit in
the TxGCON register. The TxGVAL bit is valid even
when the Timer1/3/5 Gate is not enabled (TMRxGE bit
is cleared).
Timer1/3/5 Gate Toggle mode is enabled by setting the
TxGTM bit of the TxGCON register. When the TxGTM
bit is cleared, the flip-flop is cleared and held clear. This
is necessary in order to control which edge is
measured.
12.7.6
TIMER1/3/5 GATE EVENT
INTERRUPT
Note:
Enabling Toggle mode at the same time as
changing the gate polarity may result in
indeterminate operation.
When Timer1/3/5 Gate Event Interrupt is enabled, it is
possible to generate an interrupt upon the completion
of a gate event. When the falling edge of TxGVAL
occurs, the TMRxGIF flag bit in the PIR3 register will be
set. If the TMRxGIE bit in the PIE3 register is set, then
an interrupt will be recognized.
The TMRxGIF flag bit operates even when the
Timer1/3/5 Gate is not enabled (TMRxGE bit is
cleared).
For more information on selecting high or low priority
status for the Timer1/3/5 Gate Event Interrupt see
Section 9.0 “Interrupts”.
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 167
PIC18(L)F2X/4XK22
12.8 Timer1/3/5 Interrupt
12.10 ECCP/CCP Capture/Compare Time
Base
The Timer1/3/5 register pair (TMRxH:TMRxL)
increments to FFFFh and rolls over to 0000h. When
Timer1/3/5 rolls over, the Timer1/3/5 interrupt flag bit of
the PIR1/2/5 register is set. To enable the interrupt on
rollover, you must set these bits:
The CCP modules use the TMRxH:TMRxL register pair
as the time base when operating in Capture or
Compare mode.
In Capture mode, the value in the TMRxH:TMRxL
register pair is copied into the CCPRxH:CCPRxL
register pair on a configured event.
• TMRxON bit of the TxCON register
• TMRxIE bits of the PIE1, PIE2 or PIE5 registers
• PEIE/GIEL bit of the INTCON register
• GIE/GIEH bit of the INTCON register
In Compare mode, an event is triggered when the value
CCPRxH:CCPRxL register pair matches the value in
the TMRxH:TMRxL register pair. This event can be a
Special Event Trigger.
The interrupt is cleared by clearing the TMRxIF bit in
the Interrupt Service Routine.
For
more
information,
see
Section 14.0
For more information on selecting high or low priority
status for the Timer1/3/5 Overflow Interrupt, see
Section 9.0 “Interrupts”.
“Capture/Compare/PWM Modules”.
12.11 ECCP/CCP Special Event Trigger
Note:
The TMRxH:TMRxL register pair and the
TMRxIF bit should be cleared before
enabling interrupts.
When any of the CCP’s are configured to trigger a
special event, the trigger will clear the TMRxH:TMRxL
register pair. This special event does not cause a
Timer1/3/5 interrupt. The CCP module may still be
configured to generate a CCP interrupt.
12.9 Timer1/3/5 Operation During Sleep
Timer1/3/5 can only operate during Sleep when setup
in Asynchronous Counter mode. In this mode, an
external crystal or clock source can be used to
increment the counter. To set up the timer to wake the
device:
In this mode of operation, the CCPRxH:CCPRxL
register pair becomes the period register for
Timer1/3/5.
Timer1/3/5 should be synchronized and FOSC/4 should
be selected as the clock source in order to utilize the
Special Event Trigger. Asynchronous operation of
Timer1/3/5 can cause a Special Event Trigger to be
missed.
• TMRxON bit of the TxCON register must be set
• TMRxIE bit of the PIE1/2/5 register must be set
• PEIE/GIEL bit of the INTCON register must be set
• TxSYNC bit of the TxCON register must be set
In the event that a write to TMRxH or TMRxL coincides
with a Special Event Trigger from the CCP, the write will
take precedence.
• TMRxCS bits of the TxCON register must be
configured
• TxSOSCEN bit of the TxCON register must be
configured
For more information, see Section 17.2.8 “Special
Event Trigger”.
The device will wake-up on an overflow and execute
the next instruction. If the GIE/GIEH bit of the INTCON
register is set, the device will call the Interrupt Service
Routine.
The secondary oscillator will continue to operate in
Sleep regardless of the TxSYNC bit setting.
DS41412A-page 168
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
FIGURE 12-3:
TIMER1/3/5 INCREMENTING EDGE
TXCKI = 1
when TMRx
Enabled
TXCKI = 0
when TMRX
Enabled
Note 1: Arrows indicate counter increments.
2: In Counter mode, a falling edge must be registered by the counter prior to the first incrementing rising edge of the clock.
FIGURE 12-4:
TIMER1/3/5 GATE ENABLE MODE
TMRxGE
TxGPOL
TxG_IN
TxCKI
TxGVAL
Timer1/3/5
N
N + 1
N + 2
N + 3
N + 4
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 169
PIC18(L)F2X/4XK22
FIGURE 12-5:
TIMER1/3/5 GATE TOGGLE MODE
TMRxGE
TxGPOL
TxGTM
TxTxG_IN
TxCKI
TxGVAL
TIMER1/3/5
N
N + 1 N + 2 N + 3 N + 4
N + 5 N + 6 N + 7 N + 8
FIGURE 12-6:
TIMER1/3/5 GATE SINGLE-PULSE MODE
TMRxGE
TxGPOL
TxGSPM
Cleared by hardware on
falling edge of TxGVAL
TxGGO/
DONE
Set by software
Counting enabled on
rising edge of TxG
TxG_IN
TxCKI
TxGVAL
TIMER1/3/5
TMRxGIF
N
N + 1
N + 2
Cleared by
software
Set by hardware on
falling edge of TxGVAL
Cleared by software
DS41412A-page 170
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
FIGURE 12-7:
TMRxGE
TxGPOL
TIMER1/3/5 GATE SINGLE-PULSE AND TOGGLE COMBINED MODE
TxGSPM
TxGTM
Cleared by hardware on
falling edge of TxGVAL
TxGGO/
DONE
Set by software
Counting enabled on
rising edge of TxG
TxG_IN
TxCKI
TxGVAL
TIMER1/3/5
TMRxGIF
N + 4
N + 2 N + 3
N
N + 1
Set by hardware on
falling edge of TxGVAL
Cleared by
software
Cleared by software
12.12 Peripheral Module Disable
When a peripheral module is not used or inactive, the
module can be disabled by setting the Module Disable
bit in the PMD registers. This will reduce power con-
sumption to an absolute minimum. Setting the PMD
bits holds the module in Reset and disconnects the
module’s clock source. The Module Disable bits for
Timer1 (TMR1MD), Timer3 (TMR3MD) and Timer5
(TMR5MD) are in the PMD0 Register. See Section 3.0
“Power-Managed Modes” for more information.
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 171
PIC18(L)F2X/4XK22
12.13 Timer1/3/5 Control Register
The Timer1/3/5 Control register (TxCON), shown in
Register 12-1, is used to control Timer1/3/5 and select
the various features of the Timer1/3/5 module.
REGISTER 12-1: TXCON: TIMER1/3/5 CONTROL REGISTER
R/W-0/u
R/W-0/u
R/W-0/u
R/W-0/u
R/W-0/u
R/W-0/u
TxSYNC
R/W-0/0
TxRD16
R/W-0/u
TMRxCS<1:0>
TxCKPS<1:0>
TxSOSCEN
TMRxON
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n/n = Value at POR and BOR/Value at all other Resets
u = Bit is unchanged
‘1’ = Bit is set
x = Bit is unknown
‘0’ = Bit is cleared
bit 7-6
TMRxCS<1:0>: Timer1/3/5 Clock Source Select bits
11=Reserved. Do not use.
10=Timer1/3/5 clock source is pin or oscillator:
If TxSOSCEN = 0:
External clock from TxCKI pin (on the rising edge)
If TxSOSCEN = 1:
Crystal oscillator on SOSCI/SOSCO pins
01=Timer1/3/5 clock source is system clock (FOSC)
00=Timer1/3/5 clock source is instruction clock (FOSC/4)
bit 5-4
TxCKPS<1:0>: Timer1/3/5 Input Clock Prescale Select bits
11= 1:8 Prescale value
10= 1:4 Prescale value
01= 1:2 Prescale value
00= 1:1 Prescale value
bit 3
bit 2
TxSOSCEN: Secondary Oscillator Enable Control bit
1= Dedicated Secondary oscillator circuit enabled
0= Dedicated Secondary oscillator circuit disabled
TxSYNC: Timer1/3/5 External Clock Input Synchronization Control bit
TMRxCS<1:0> = 1X
1= Do not synchronize external clock input
0= Synchronize external clock input with system clock (FOSC)
TMRxCS<1:0> = 0X
This bit is ignored. Timer1/3/5 uses the internal clock when TMRxCS<1:0> = 1X.
bit 1
bit 0
TxRD16: 16-Bit Read/Write Mode Enable bit
1= Enables register read/write of Timer1/3/5 in one 16-bit operation
0= Enables register read/write of Timer1/3/5 in two 8-bit operation
TMRxON: Timer1/3/5 On bit
1= Enables Timer1/3/5
0= Stops Timer1/3/5
Clears Timer1/3/5 Gate flip-flop
DS41412A-page 172
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
12.14 Timer1/3/5 Gate Control Register
The Timer1/3/5 Gate Control register (TxGCON),
shown in Register 12-2, is used to control Timer1/3/5
Gate.
REGISTER 12-2: TXGCON: TIMER1/3/5 GATE CONTROL REGISTER
R/W-0/u
R/W-0/u
TxGPOL
R/W-0/u
TxGTM
R/W-0/u
R/W/HC-0/u
R-x/x
R/W-0/u
R/W-0/u
TMRxGE
TxGSPM
TxGGO/DONE
TxGVAL
TxGSS<1:0>
bit 7
bit 0
Legend:
R = Readable bit
u = Bit is unchanged
‘1’ = Bit is set
W = Writable bit
x = Bit is unknown
‘0’ = Bit is cleared
U = Unimplemented bit, read as ‘0’
-n/n = Value at POR and BOR/Value at all other Resets
HC = Bit is cleared by hardware
bit 7
TMRxGE: Timer1/3/5 Gate Enable bit
If TMRxON = 0:
This bit is ignored
If TMRxON = 1:
1= Timer1/3/5 counting is controlled by the Timer1/3/5 gate function
0= Timer1/3/5 counts regardless of Timer1/3/5 gate function
bit 6
bit 5
TxGPOL: Timer1/3/5 Gate Polarity bit
1= Timer1/3/5 gate is active-high (Timer1/3/5 counts when gate is high)
0= Timer1/3/5 gate is active-low (Timer1/3/5 counts when gate is low)
TxGTM: Timer1/3/5 Gate Toggle Mode bit
1= Timer1/3/5 Gate Toggle mode is enabled
0= Timer1/3/5 Gate Toggle mode is disabled and toggle flip-flop is cleared
Timer1/3/5 gate flip-flop toggles on every rising edge.
bit 4
bit 3
TxGSPM: Timer1/3/5 Gate Single-Pulse Mode bit
1= Timer1/3/5 gate Single-Pulse mode is enabled and is controlling Timer1/3/5 gate
0= Timer1/3/5 gate Single-Pulse mode is disabled
TxGGO/DONE: Timer1/3/5 Gate Single-Pulse Acquisition Status bit
1= Timer1/3/5 gate single-pulse acquisition is ready, waiting for an edge
0= Timer1/3/5 gate single-pulse acquisition has completed or has not been started
This bit is automatically cleared when TxGSPM is cleared.
bit 2
TxGVAL: Timer1/3/5 Gate Current State bit
Indicates the current state of the Timer1/3/5 gate that could be provided to TMRxH:TMRxL.
Unaffected by Timer1/3/5 Gate Enable (TMRxGE).
bit 1-0
TxGSS<1:0>: Timer1/3/5 Gate Source Select bits
00= Timer1/3/5 Gate pin
01= Timer2/4/6 Match PR2/4/6 output (See Table 12-6 for proper timer match selection)
10= Comparator 1 optionally synchronized output (SYNCC1OUT)
11= Comparator 2 optionally synchronized output (SYNCC2OUT)
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 173
PIC18(L)F2X/4XK22
TABLE 12-6: REGISTERS ASSOCIATED WITH TIMER1/3/5 AS A TIMER/COUNTER
Reset
Values on
Page
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
ANSELB
ANSELC
INTCON
IPR1
—
—
ANSB5
ANSC5
ANSB4
ANSC4
INT0IE
TX1IP
EEIP
TX2IP
—
ANSB3
ANSC3
ANSB2
ANSC2
ANSB1
—
ANSB0
—
154
154
115
127
128
129
130
123
124
125
126
118
119
120
122
56
ANSC7
ANSC6
GIE/GIEH PEIE/GIEL TMR0IE
RBIE
TMR0IF
CCP1IP
HLVDIP
TMR5GIP
TMR6IP
CCP1IE
HLVDIE
TMR5GIE
TMR6IE
CCP1IF
HLVDIF
TMR5GIF
TMR6IF
TMR3MD
T1SYNC
T1GVAL
T3SYNC
T3GVAL
T5SYNC
T5GVAL
INT0IF
RBIF
—
OSCFIP
SSP2IP
—
ADIP
C1IP
BCL2IP
—
RC1IP
C2IP
RC2IP
—
SSP1IP
TMR2IP
TMR3IP
TMR3GIP
TMR5IP
TMR2IE
TMR3IE
TMR3GIE
TMR5IE
TMR2IF
TMR3IF
TMR3GIF
TMR5IF
TMR2MD
T1RD16
TMR1IP
CCP2IP
TMR1GIP
TMR4IP
TMR1IE
CCP2IE
TMR1GIE
TMR4IE
TMR1IF
CCP2IF
TMR1GIF
TMR4IF
TMR1MD
TMR1ON
IPR2
BCL1IP
IPR3
CTMUIP
—
IPR5
PIE1
—
ADIE
C1IE
BCL2IE
—
RC1IE
C2IE
RC2IE
—
TX1IE
EEIE
TX2IE
—
SSP1IE
PIE2
OSCFIE
SSP2IE
—
BCL1IE
PIE3
CTMUIE
—
PIE5
PIR1
—
ADIF
C1IF
BCL2IF
—
RC1IF
C2IF
RC2IF
—
TX1IF
EEIF
TX2IF
—
SSP1IF
PIR2
OSCFIF
SSP2IF
—
BCL1IF
PIR3
CTMUIF
—
PIR5
PMD0
T1CON
T1GCON
T3CON
T3GCON
T5CON
T5GCON
TMRxH
TMRxL
TRISB
TRISC
UART2MD UART1MD TMR6MD TMR5MD
TMR1CS<1:0> T1CKPS<1:0>
TMR1GE T1GPOL T1GTM T1GSPM
TMR3CS<1:0> T3CKPS<1:0>
TMR3GE T3GPOL T3GTM T3GSPM
TMR5CS<1:0> T5CKPS<1:0>
TMR4MD
T1SOSCEN
T1GGO/DONE
T3SOSCEN
T3GGO/DONE
T5SOSCEN
T5GGO/DONE
172
173
172
173
172
173
—
T1GSS<1:0>
T3RD16
TMR3ON
T3GSS
T5RD16
TMR5ON
TMR5GE
T5GPOL
T5GTM
T5GSPM
T5GSS
Timer1/3/5 Register, High Byte
Timer1/3/5 Register, Low Byte
—
TRISB7
TRISC7
TRISB6
TRISC6
TRISB5
TRISC5
TRISB4
TRISC4
TRISB3
TRISC3
TRISB2
TRISC2
TRISB1
TRISC1
TRISB0
TRISC0
155
155
TABLE 12-7: CONFIGURATION REGISTERS ASSOCIATED WITH TIMER1/3/5
Reset
Values
on Page
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
CONFIG3H
MCLRE
—
P2BMX
T3CMX HFOFST CCP3MX PBADEN CCP2MX
356
DS41412A-page 174
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
13.0 TIMER2/4/6 MODULE
There are three identical 8-bit Timer2-type modules
available. To maintain pre-existing naming conventions,
the Timers are called Timer2, Timer4 and Timer6 (also
Timer2/4/6).
Note:
The ‘x’ variable used in this section is used
to designate Timer2, Timer4, or Timer6.
For example, TxCON references T2CON,
T4CON, or T6CON. PRx references PR2,
PR4, or PR6.
The Timer2/4/6 module incorporates the following
features:
• 8-bit Timer and Period registers (TMRx and PRx,
respectively)
• Readable and writable (both registers)
• Software programmable prescaler (1:1, 1:4, 1:16)
• Software programmable postscaler (1:1 to 1:16)
• Interrupt on TMRx match with PRx, respectively
• Optional use as the shift clock for the MSSPx
modules (Timer2 only)
See Figure 13-1 for a block diagram of Timer2/4/6.
FIGURE 13-1:
TIMER2/4/6 BLOCK DIAGRAM
Sets Flag
bit TMRxIF
Output
TMRx
Prescaler
TMRx
Reset
FOSC/4
1:1, 1:4, 1:16, 1:64
Postscaler
1:1 to 1:16
2
Comparator
EQ
TxCKPS<1:0>
PRx
4
TxOUTPS<3:0>
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 175
PIC18(L)F2X/4XK22
13.1 Timer2/4/6 Operation
13.2 Timer2/4/6 Interrupt
The clock input to the Timer2/4/6 module is the system
instruction clock (FOSC/4).
Timer2/4/6 can also generate an optional device
interrupt. The Timer2/4/6 output signal (TMRx-to-PRx
match)
provides
the
input
for
the
4-bit
TMRx increments from 00h on each clock edge.
counter/postscaler. This counter generates the TMRx
match interrupt flag which is latched in TMRxIF of the
PIR1/PIR5 registers. The interrupt is enabled by setting
the TMRx Match Interrupt Enable bit, TMRxIE of the
PIE1/PIE5 registers. Interrupt Priority is selected with
the TMRxIP bit in the IPR1/IPR5 registers.
A 4-bit counter/prescaler on the clock input allows direct
input, divide-by-4 and divide-by-16 prescale options.
These options are selected by the prescaler control bits,
TxCKPS<1:0> of the TxCON register. The value of
TMRx is compared to that of the Period register, PRx, on
each clock cycle. When the two values match, the
comparator generates a match signal as the timer
output. This signal also resets the value of TMRx to 00h
on the next cycle and drives the output
counter/postscaler (see Section 13.2 “Timer2/4/6
Interrupt”).
A range of 16 postscale options (from 1:1 through 1:16
inclusive) can be selected with the postscaler control
bits, TxOUTPS<3:0>, of the TxCON register.
13.3 Timer2/4/6 Output
The TMRx and PRx registers are both directly readable
and writable. The TMRx register is cleared on any
device Reset, whereas the PRx register initializes to
FFh. Both the prescaler and postscaler counters are
cleared on the following events:
The unscaled output of TMRx is available primarily to
the CCP modules, where it is used as a time base for
operations in PWM mode. The timer to be used with a
specific CCP module is selected using the
CxTSEL<1:0> bits in the CCPTMRS0 and CCPTMRS1
registers.
• a write to the TMRx register
• a write to the TxCON register
• Power-on Reset (POR)
• Brown-out Reset (BOR)
• MCLR Reset
Timer2 can be optionally used as the shift clock source
for the MSSPx modules operating in SPI mode by
setting SSPM<3:0> = 0011in the SSPxCON1 register.
Additional information is provided in Section 15.0
“Master Synchronous Serial Port (MSSP1 and
MSSP2) Module”.
• Watchdog Timer (WDT) Reset
• Stack Overflow Reset
• Stack Underflow Reset
• RESETInstruction
13.4 Timer2/4/6 Operation During Sleep
The Timer2/4/6 timers cannot be operated while the
processor is in Sleep mode. The contents of the TMRx
and PRx registers will remain unchanged while the
processor is in Sleep mode.
Note:
TMRx is not cleared when TxCON is written.
13.5 Peripheral Module Disable
When a peripheral module is not used or inactive, the
module can be disabled by setting the Module Disable
bit in the PMD registers. This will reduce power con-
sumption to an absolute minimum. Setting the PMD
bits holds the module in Reset and disconnects the
module’s clock source. The Module Disable bits for
Timer2 (TMR2MD), Timer4 (TMR4MD) and Timer6
(TMR6MD) are in the PMD0 Register. See Section 3.0
“Power-Managed Modes” for more information.
DS41412A-page 176
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
REGISTER 13-1: TxCON: TIMER2/TIMER4/TIMER6 CONTROL REGISTER
U-0
—
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
TxOUTPS<3:0>
TMRxON
TxCKPS<1:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n/n = Value at POR and BOR/Value at all other Resets
u = Bit is unchanged
‘1’ = Bit is set
x = Bit is unknown
‘0’ = Bit is cleared
bit 7
Unimplemented: Read as ‘0’
bit 6-3
TxOUTPS<3:0>: TimerX Output Postscaler Select bits
0000= 1:1 Postscaler
0001= 1:2 Postscaler
0010= 1:3 Postscaler
0011= 1:4 Postscaler
0100= 1:5 Postscaler
0101= 1:6 Postscaler
0110= 1:7 Postscaler
0111= 1:8 Postscaler
1000= 1:9 Postscaler
1001= 1:10 Postscaler
1010= 1:11 Postscaler
1011= 1:12 Postscaler
1100= 1:13 Postscaler
1101= 1:14 Postscaler
1110= 1:15 Postscaler
1111= 1:16 Postscaler
bit 2
TMRxON: TimerX On bit
1= TimerX is on
0= TimerX is off
bit 1-0
TxCKPS<1:0>: Timer2-type Clock Prescale Select bits
00= Prescaler is 1
01= Prescaler is 4
1x= Prescaler is 16
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 177
PIC18(L)F2X/4XK22
TABLE 13-1: SUMMARY OF REGISTERS ASSOCIATED WITH TIMER2/4/6
Register
on Page
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
CCPTMRS0
CCPTMRS1
INTCON
IPR1
C3TSEL<1:0>
—
—
C2TSEL<1:0>
—
C1TSEL<1:0>
C4TSEL<1:0>
206
206
115
127
130
123
126
118
122
56
—
—
—
INT0IE
TX1IP
—
C5TSEL<1:0>
GIE/GIEH PEIE/GIEL TMR0IE
RBIE
TMR0IF
CCP1IP
TMR6IP
CCP1IE
TMR6IE
CCP1IF
TMR6IF
INT0IF
RBIF
—
—
—
—
—
—
ADIP
—
RC1IP
—
SSP1IP
—
TMR2IP
TMR5IP
TMR2IE
TMR5IE
TMR2IF
TMR5IF
TMR1IP
TMR4IP
TMR1IE
TMR4IE
TMR1IF
TMR4IF
IPR5
PIE1
ADIE
—
RC1IE
—
TX1IE
—
SSP1IE
—
PIE5
PIR1
ADIF
—
RC1IF
—
TX1IF
—
SSP1IF
—
PIR5
PMD0
PR2
UART2MD UART1MD TMR6MD TMR5MD TMR4MD TMR3MD TMR2MD TMR1MD
Timer2 Period Register
Timer4 Period Register
Timer6 Period Register
—
PR4
—
PR6
—
T2CON
T4CON
T6CON
TMR2
TMR4
TMR6
—
—
—
T2OUTPS<3:0>
T4OUTPS<3:0>
T6OUTPS<3:0>
TMR2ON
TMR4ON
TMR6ON
T2CKPS<1:0>
T4CKPS<1:0>
T6CKPS<1:0>
172
172
172
—
Timer2 Register
Timer4 Register
Timer6 Register
—
—
Legend: — = unimplemented locations, read as ‘0’. Shaded bits are not used by Timer2/4/6.
DS41412A-page 178
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
14.0 CAPTURE/COMPARE/PWM
MODULES
Note 1: In devices with more than one CCP
module, it is very important to pay close
attention to the register names used. A
number placed after the module acronym
is used to distinguish between separate
modules. For example, the CCP1CON
and CCP2CON control the same
operational aspects of two completely
different CCP modules.
The Capture/Compare/PWM module is a peripheral
which allows the user to time and control different
events, and to generate Pulse-Width Modulation
(PWM) signals. In Capture mode, the peripheral allows
the timing of the duration of an event. The Compare
mode allows the user to trigger an external event when
a predetermined amount of time has expired. The
PWM mode can generate Pulse-Width Modulated
signals of varying frequency and duty cycle.
2: Throughout
this
section,
generic
references to a CCP module in any of its
operating modes may be interpreted as
being equally applicable to ECCP1,
ECCP2, ECCP3, CCP4 and CCP5.
Register names, module signals, I/O pins,
and bit names may use the generic
designator ‘x’ to indicate the use of a
numeral to distinguish a particular module,
when required.
This family of devices contains three Enhanced
Capture/Compare/PWM modules (ECCP1, ECCP2,
and ECCP3) and two standard Capture/Compare/PWM
modules (CCP4 and CCP5).
The Capture and Compare functions are identical for all
CCP/ECCP modules. The difference between CCP
and ECCP modules are in the Pulse-Width Modulation
(PWM) function. In CCP modules, the standard PWM
function is identical. In ECCP modules, the Enhanced
PWM function has either Full-Bridge or Half-Bridge
PWM output. Full-Bridge ECCP modules have four
available I/O pins while Half-Bridge ECCP modules
only have two available I/O pins. ECCP PWM modules
are backward compatible with CCP PWM modules and
can be configured as standard PWM modules. See
Table 14-1 to determine the CCP/ECCP functionality
available on each device in this family.
TABLE 14-1: PWM RESOURCES
Device Name
ECCP1
ECCP2
ECCP3
CCP4
CCP5
PIC18(L)F23K22
PIC18(L)F24K22 EnhancedPWM Enhanced PWM EnhancedPWM
Standard PWM
(Special Event Trigger)
Standard PWM
PIC18(L)F25K22
PIC18(L)F26K22
Full-Bridge
Half-Bridge
Half-Bridge
PIC18(L)F43K22
PIC18(L)F44K22 EnhancedPWM Enhanced PWM EnhancedPWM
Standard PWM
(Special Event Trigger)
Standard PWM
PIC18(L)F45K22
PIC18(L)F46K22
Full-Bridge
Full-Bridge
Half-Bridge
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 179
PIC18(L)F2X/4XK22
Figure 14-1 shows a simplified diagram of the Capture
operation.
14.1 Capture Mode
The Capture mode function described in this section is
identical for all CCP and ECCP modules available on
this device family.
FIGURE 14-1:
CAPTURE MODE
OPERATION BLOCK
DIAGRAM
Capture mode makes use of the 16-bit Timer
resources, Timer1, Timer3 and Timer5. The timer
resources for each CCP capture function are
independent and are selected using the CCPTMRS0
and CCPTMRS1 registers. When an event occurs on
the CCPx pin, the 16-bit CCPRxH:CCPRxL register
pair captures and stores the 16-bit value of the
TMRxH:TMRxL register pair, respectively. An event is
defined as one of the following and is configured by the
CCPxM<3:0> bits of the CCPxCON register:
Set Flag bit CCPxIF
(PIR1/2/4 register)
Prescaler
1, 4, 16
CCPx
pin
CCPRxH
CCPRxL
Capture
Enable
and
Edge Detect
TMR1/3/5H TMR1/3/5L
CCPxM<3:0>
System Clock (FOSC)
• Every falling edge
• Every rising edge
• Every 4th rising edge
• Every 16th rising edge
14.1.1
CCP PIN CONFIGURATION
In Capture mode, the CCPx pin should be configured
as an input by setting the associated TRIS control bit.
When a capture is made, the corresponding Interrupt
Request Flag bit CCPxIF of the PIR1, PIR2 or PIR4
register is set. The interrupt flag must be cleared in
software. If another capture occurs before the value in
the CCPRxH:CCPRxL register pair is read, the old
captured value is overwritten by the new captured
value.
Some CCPx outputs are multiplexed on a couple of
pins. Table 14-2 shows the CCP output pin
multiplexing. Selection of the output pin is determined
by the CCPxMX bits in Configuration register 3H
(CONFIG3H). Refer to Register 24-4 for more details.
Note:
If the CCPx pin is configured as an output,
a write to the port can cause a capture
condition.
TABLE 14-2: CCP PIN MULTIPLEXING
CCP OUTPUT
CONFIG 3H Control Bit Bit Value
PIC18(L)F2XK22 I/O pin
PIC18(L)F4XK22 I/O pin
0
1(*)
0(*)
RB3
RC1
RC6
RB5
RB3
RC1
RE0
RB5
CCP2
CCP2MX
CCP3
CCP3MX
1
Legend: * = Default
14.1.2
TIMER1 MODE RESOURCE
14.1.3
SOFTWARE INTERRUPT MODE
The 16-bit Timer resource must be running in Timer
mode or Synchronized Counter mode for the CCP
module to use the capture feature. In Asynchronous
Counter mode, the capture operation may not work.
When the Capture mode is changed, a false capture
interrupt may be generated. The user should keep the
CCPxIE interrupt enable bit of the PIE1, PIE2 or PIE4
register clear to avoid false interrupts. Additionally, the
user should clear the CCPxIF interrupt flag bit of the
PIR1, PIR2 or PIR4 register following any change in
Operating mode.
See Section 12.0 “Timer1/3/5 Module with Gate
Control” for more information on configuring the 16-bit
Timers.
Note:
Clocking the 16-bit Timer resource from
the system clock (FOSC) should not be
used in Capture mode. In order for
Capture mode to recognize the trigger
event on the CCPx pin, the Timer resource
must be clocked from the instruction clock
(FOSC/4) or from an external clock source.
DS41412A-page 180
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
14.1.4
CCP PRESCALER
14.1.5
CAPTURE DURING SLEEP
There are four prescaler settings specified by the
CCPxM<3:0> bits of the CCPxCON register. Whenever
the CCP module is turned off, or the CCP module is not
in Capture mode, the prescaler counter is cleared. Any
Reset will clear the prescaler counter.
Capture mode requires a 16-bit TimerX module for use
as a time base. There are four options for driving the
16-bit TimerX module in Capture mode. It can be driven
by the system clock (FOSC), the instruction clock (FOSC/
4), or by the external clock sources, the Secondary
Oscillator (SOSC), or the TxCKI clock input. When the
16-bit TimerX resource is clocked by FOSC or FOSC/4,
TimerX will not increment during Sleep. When the
device wakes from Sleep, TimerX will continue from its
previous state. Capture mode will operate during Sleep
when the 16-bit TimerX resource is clocked by one of
the external clock sources (SOSC or the TxCKI pin).
Switching from one capture prescaler to another does
not clear the prescaler and may generate a false
interrupt. To avoid this unexpected operation, turn the
module off by clearing the CCPxCON register before
changing the prescaler. Example 14-1 demonstrates
the code to perform this function.
EXAMPLE 14-1:
CHANGING BETWEEN
CAPTURE PRESCALERS
#define NEW_CAPT_PS 0x06
//Capture
// Prescale 4th
// rising edge
// Turn the CCP
// Module Off
// Turn CCP module
// on with new
// prescale value
...
CCPxCON = 0;
CCPxCON = NEW_CAPT_PS;
TABLE 14-3: REGISTERS ASSOCIATED WITH CAPTURE
Register
on Page
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
CCP1CON
CCP2CON
CCP3CON
CCP4CON
CCP5CON
CCPR1H
CCPR1L
CCPR2H
CCPR2L
CCPR3H
CCPR3L
CCPR4H
CCPR4L
CCPR5H
CCPR5L
CCPTMRS0
CCPTMRS1
INTCON
IPR1
P1M<1:0>
DC1B<1:0>
CCP1M<3:0>
CCP2M<3:0>
CCP3M<3:0>
CCP4M<3:0>
CCP5M<3:0>
203
203
203
203
203
—
P2M<1:0>
P3M<1:0>
DC2B<1:0>
DC3B<1:0>
DC4B<1:0>
DC5B<1:0>
—
—
—
—
Capture/Compare/PWM Register 1 High Byte (MSB)
Capture/Compare/PWM Register 1 Low Byte (LSB)
Capture/Compare/PWM Register 2 High Byte (MSB)
Capture/Compare/PWM Register 2 Low Byte (LSB)
Capture/Compare/PWM Register 3 High Byte (MSB)
Capture/Compare/PWM Register 3 Low Byte (LSB)
Capture/Compare/PWM Register 4 High Byte (MSB)
Capture/Compare/PWM Register 4 Low Byte (LSB)
Capture/Compare/PWM Register 5 High Byte (MSB)
Capture/Compare/PWM Register 5 Low Byte (LSB)
—
—
—
—
—
—
—
—
—
C3TSEL<1:0>
—
—
C2TSEL<1:0>
— C5TSEL<1:0>
—
C1TSEL<1:0>
C4TSEL<1:0>
206
206
115
127
128
130
123
—
—
PEIE/GIEL
ADIP
GIE/GIEH
TMR0IE
RC1IP
C2IP
—
INT0IE
TX1IP
EEIP
—
RBIE
SSP1IP
BCL1IP
—
TMR0IF
CCP1IP
HLVDIP
CCP5IP
CCP1IE
INT0IF
RBIF
—
OSCFIP
—
TMR2IP
TMR3IP
CCP4IP
TMR2IE
TMR1IP
CCP2IP
CCP3IP
TMR1IE
IPR2
C1IP
IPR4
—
PIE1
—
ADIE
RC1IE
TX1IE
SSP1IE
Legend: — = Unimplemented location, read as ‘0’. Shaded bits are not used by Capture mode.
Note 1: These registers/bits are available on PIC18(L)F4XK22 devices.
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 181
PIC18(L)F2X/4XK22
TABLE 14-3: REGISTERS ASSOCIATED WITH CAPTURE (CONTINUED)
Register
on Page
Name
PIE2
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
OSCFIE
—
C1IE
—
C2IE
—
EEIE
—
BCL1IE
—
HLVDIE
CCP5IE
CCP1IF
HLVDIF
CCP5IF
TMR3MD
CCP3MD
T1SYNC
T1GVAL
T3SYNC
T3GVAL
T5SYNC
T5GVAL
TMR3IE
CCP4IE
TMR2IF
TMR3IF
CCP4IF
TMR2MD
CCP2MD
T1RD16
CCP2IE
CCP3IE
TMR1IF
CCP2IF
CCP3IF
TMR1MD
CCP1MD
TMR1ON
124
126
118
119
121
56
PIE4
PIR1
—
ADIF
C1IF
—
RC1IF
C2IF
—
TX1IF
EEIF
SSP1IF
PIR2
OSCFIF
—
BCL1IF
PIR4
—
—
PMD0
UART2MD UART1MD
MSSP2MD MSSP1MD
TMR1CS<1:0>
TMR6MD
—
TMR5MD
CCP5MD
TMR4MD
CCP4MD
T1SOSCEN
T1GGO/DONE
T3SOSCEN
T3GGO/DONE
T5SOSCEN
T5GGO/DONE
PMD1
57
T1CON
T1GCON
T3CON
T3GCON
T5CON
T5GCON
TMR1H
TMR1L
TMR3H
TMR3L
TMR5H
TMR5L
TRISA
TRISB
TRISC
T1CKPS<1:0>
172
173
172
173
172
173
—
TMR1GE
T1GPOL
T1GTM
T1GSPM
T1GSS
TMR3CS<1:0>
T3CKPS<1:0>
T3RD16
TMR3ON
TMR3GE
T3GPOL
T3GTM
T3GSPM
T3GSS
TMR5CS<1:0>
T5CKPS<1:0>
T5RD16
TMR5ON
TMR5GE
T5GPOL
T5GTM
T5GSPM
T5GSS
Holding Register for the Most Significant Byte of the 16-bit TMR1 Register
Holding Register for the Least Significant Byte of the 16-bit TMR1 Register
Holding Register for the Most Significant Byte of the 16-bit TMR3 Register
Holding Register for the Least Significant Byte of the 16-bit TMR3 Register
Holding Register for the Most Significant Byte of the 16-bit TMR5 Register
Holding Register for the Least Significant Byte of the 16-bit TMR5 Register
—
—
—
—
—
TRISA7
TRISB7
TRISC7
TRISD7
WPUE3
TRISA6
TRISB6
TRISC6
TRISD6
—
TRISA5
TRISB5
TRISC5
TRISD5
—
TRISA4
TRISB4
TRISC4
TRISD4
—
TRISA3
TRISB3
TRISC3
TRISD3
—
TRISA2
TRISB2
TRISC2
TRISD2
TRISA1
TRISB1
TRISC1
TRISD1
TRISA0
TRISB0
TRISC0
TRISD0
155
155
155
155
155
(1)
TRISD
(1)
(1)
(1)
TRISE
TRISE2
TRISE1
TRISE0
Legend: — = Unimplemented location, read as ‘0’. Shaded bits are not used by Capture mode.
Note 1: These registers/bits are available on PIC18(L)F4XK22 devices.
TABLE 14-4: CONFIGURATION REGISTERS ASSOCIATED WITH CAPTURE
Register
on Page
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
CONFIG3H
MCLRE
—
P2BMX
T3CMX
HFOFST
CCP3MX
PBADEN
CCP2MX
356
Legend: — = Unimplemented location, read as ‘0’. Shaded bits are not used by Capture mode.
DS41412A-page 182
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
14.2.1
CCP PIN CONFIGURATION
14.2 Compare Mode
The user must configure the CCPx pin as an output by
clearing the associated TRIS bit.
The Compare mode function described in this section
is identical for all CCP and ECCP modules available on
this device family.
Some CCPx outputs are multiplexed on a couple of
pins. Table 14-2 shows the CCP output pin
Multiplexing. Selection of the output pin is determined
by the CCPxMX bits in Configuration register 3H
(CONFIG3H). Refer to Register 24-4 for more details.
Compare mode makes use of the 16-bit TimerX
resources, Timer1, Timer3 and Timer5. The 16-bit
value of the CCPRxH:CCPRxL register pair is
constantly compared against the 16-bit value of the
TMRxH:TMRxL register pair. When a match occurs,
one of the following events can occur:
Note:
Clearing the CCPxCON register will force
the CCPx compare output latch to the
default low level. This is not the PORT I/O
data latch.
• Toggle the CCPx output
• Set the CCPx output
• Clear the CCPx output
14.2.2
TimerX MODE RESOURCE
• Generate a Special Event Trigger
• Generate a Software Interrupt
In Compare mode, 16-bit TimerX resource must be
running in either Timer mode or Synchronized Counter
mode. The compare operation may not work in
Asynchronous Counter mode.
The action on the pin is based on the value of the
CCPxM<3:0> control bits of the CCPxCON register. At
the same time, the interrupt flag CCPxIF bit is set.
See Section 12.0 “Timer1/3/5 Module with Gate
Control” for more information on configuring the 16-bit
TimerX resources.
All Compare modes can generate an interrupt.
Figure 14-2 shows
Compare operation.
a simplified diagram of the
Note:
Clocking TimerX from the system clock
(FOSC) should not be used in Compare
mode. In order for Compare mode to
recognize the trigger event on the CCPx
pin, TImerX must be clocked from the
instruction clock (FOSC/4) or from an
external clock source.
FIGURE 14-2:
COMPARE MODE
OPERATION BLOCK
DIAGRAM
CCPxM<3:0>
Mode Select
14.2.3
SOFTWARE INTERRUPT MODE
Set CCPxIF Interrupt Flag
(PIR1/2/4)
When Generate Software Interrupt mode is chosen
(CCPxM<3:0> = 1010), the CCPx module does not
assert control of the CCPx pin (see the CCPxCON
register).
4
CCPx
Pin
CCPRxH CCPRxL
Comparator
Q
S
R
Output
Logic
Match
TMRxH TMRxL
TRIS
Output Enable
Special Event Trigger
Special Event Trigger function on
ECCP1, ECCP2, ECCP3, CCP4 and CCP5 will:
•
-
-
Reset TimerX – TMRxH:TMRxL = 0x0000
TimerX Interrupt Flag, (TMRxIF) is not set
Additional Function on
CCP5 will
Set ADCON0<1>, GO/DONE bit to start an ADC
Conversion if ADCON<0>, ADON = 1.
•
-
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 183
PIC18(L)F2X/4XK22
14.2.4
When Special Event Trigger mode is selected
(CCPxM<3:0> = 1011), and match of the
TMRxH:TMRxL and the CCPRxH:CCPRxL registers
occurs, all CCPx and ECCPx modules will immediately:
SPECIAL EVENT TRIGGER
14.2.5
COMPARE DURING SLEEP
The Compare mode is dependent upon the system
clock (FOSC) for proper operation. Since FOSC is shut
down during Sleep mode, the Compare mode will not
function properly during Sleep.
a
• Set the CCP interrupt flag bit – CCPxIF
• CCP5 will start an ADC conversion, if the ADC is
enabled
On the next TimerX rising clock edge:
• A Reset of TimerX register pair occurs –
TMRxH:TMRxL = 0x0000,
This Special Event Trigger mode does not:
• Assert control over the CCPx or ECCPx pins.
• Set the TMRxIF interrupt bit when the
TMRxH:TMRxL register pair is reset. (TMRxIF
gets set on a TimerX overflow.)
If the value of the CCPRxH:CCPRxL registers are
modified when a match occurs, the user should be
aware that the automatic reset of TimerX occurs on the
next rising edge of the clock. Therefore, modifying the
CCPRxH:CCPRxL registers before this reset occurs
will allow the TimerX to continue without being reset,
inadvertently resulting in the next event being
advanced or delayed.
The Special Event Trigger mode allows the
CCPRxH:CCPRxL register pair to effectively provide a
16-bit programmable period register for TimerX.
TABLE 14-5: REGISTERS ASSOCIATED WITH COMPARE
Register
on Page
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
CCP1CON
CCP2CON
CCP3CON
CCP4CON
CCP5CON
CCPR1H
CCPR1L
P1M<1:0>
DC1B<1:0>
CCP1M<3:0>
CCP2M<3:0>
CCP3M<3:0>
CCP4M<3:0>
CCP5M<3:0>
203
203
203
203
203
—
P2M<1:0>
P3M<1:0>
DC2B<1:0>
DC3B<1:0>
DC4B<1:0>
DC5B<1:0>
—
—
—
—
Capture/Compare/PWM Register 1 High Byte (MSB)
Capture/Compare/PWM Register 1 Low Byte (LSB)
Capture/Compare/PWM Register 2 High Byte (MSB)
Capture/Compare/PWM Register 2 Low Byte (LSB)
Capture/Compare/PWM Register 3 High Byte (MSB)
Capture/Compare/PWM Register 3 Low Byte (LSB)
Capture/Compare/PWM Register 4 High Byte (MSB)
Capture/Compare/PWM Register 4 Low Byte (LSB)
Capture/Compare/PWM Register 5 High Byte (MSB)
Capture/Compare/PWM Register 5 Low Byte (LSB)
—
CCPR2H
CCPR2L
—
—
CCPR3H
CCPR3L
—
—
CCPR4H
CCPR4L
—
—
CCPR5H
CCPR5L
—
—
CCPTMRS0
CCPTMRS1
INTCON
C3TSEL<1:0>
—
—
C2TSEL<1:0>
C5TSEL<1:0>
INT0IE RBIE TMR0IF
—
C1TSEL<1:0>
C4TSEL<1:0>
INT0IF RBIF
206
206
115
—
—
—
GIE/GIEH
PEIE/GIEL
TMR0IE
Legend: — = Unimplemented location, read as ‘0’. Shaded bits are not used by Capture mode.
Note 1: These registers/bits are available on PIC18(L)F4XK22 devices.
DS41412A-page 184
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
TABLE 14-5: REGISTERS ASSOCIATED WITH COMPARE (CONTINUED)
Register
on Page
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
IPR1
—
OSCFIP
—
ADIP
C1IP
—
RC1IP
C2IP
—
TX1IP
EEIP
—
SSP1IP
BCL1IP
—
CCP1IP
HLVDIP
CCP5IP
CCP1IE
HLVDIE
CCP5IE
CCP1IF
HLVDIF
CCP5IF
TMR3MD
CCP3MD
T1SYNC
T1GVAL
T3SYNC
T3GVAL
T5SYNC
T5GVAL
TMR2IP
TMR3IP
CCP4IP
TMR2IE
TMR3IE
CCP4IE
TMR2IF
TMR3IF
CCP4IF
TMR2MD
CCP2MD
T1RD16
TMR1IP
CCP2IP
CCP3IP
TMR1IE
CCP2IE
CCP3IE
TMR1IF
CCP2IF
CCP3IF
TMR1MD
CCP1MD
TMR1ON
127
128
130
123
124
126
118
119
121
56
IPR2
IPR4
PIE1
—
ADIE
C1IE
—
RC1IE
C2IE
—
TX1IE
EEIE
—
SSP1IE
BCL1IE
—
PIE2
OSCFIE
—
PIE4
PIR1
—
ADIF
C1IF
—
RC1IF
C2IF
—
TX1IF
EEIF
SSP1IF
BCL1IF
—
PIR2
OSCFIF
—
PIR4
—
PMD0
PMD1
T1CON
T1GCON
T3CON
T3GCON
T5CON
T5GCON
TMR1H
TMR1L
TMR3H
TMR3L
TMR5H
TMR5L
TRISA
TRISB
TRISC
UART2MD UART1MD
MSSP2MD MSSP1MD
TMR1CS<1:0>
TMR6MD
—
TMR5MD
CCP5MD
TMR4MD
CCP4MD
T1SOSCEN
57
T1CKPS<1:0>
172
173
172
173
172
173
—
TMR1GE
T1GPOL
T1GTM
T3GTM
T5GTM
T1GSPM T1GGO/DONE
T1GSS
TMR3CS<1:0>
T3CKPS<1:0>
T3SOSCEN
T3RD16
T5RD16
TMR3ON
TMR3GE
TMR5GE
T3GPOL
T3GSPM T3GGO/DONE
T3GSS
TMR5CS<1:0>
T5CKPS<1:0>
T5SOSCEN
TMR5ON
T5GSS
T5GPOL
T5GSPM T5GGO/DONE
Holding Register for the Most Significant Byte of the 16-bit TMR1 Register
Holding Register for the Least Significant Byte of the 16-bit TMR1 Register
Holding Register for the Most Significant Byte of the 16-bit TMR3 Register
Holding Register for the Least Significant Byte of the 16-bit TMR3 Register
Holding Register for the Most Significant Byte of the 16-bit TMR5 Register
Holding Register for the Least Significant Byte of the 16-bit TMR5 Register
—
—
—
—
—
TRISA7
TRISB7
TRISC7
TRISD7
WPUE3
TRISA6
TRISB6
TRISC6
TRISD6
—
TRISA5
TRISB5
TRISC5
TRISD5
—
TRISA4
TRISB4
TRISC4
TRISD4
—
TRISA3
TRISB3
TRISC3
TRISD3
—
TRISA2
TRISB2
TRISC2
TRISD2
TRISA1
TRISB1
TRISC1
TRISD1
TRISA0
TRISB0
TRISC0
TRISD0
155
155
155
155
155
(1)
TRISD
(1)
(1)
(1)
TRISE
TRISE2
TRISE1
TRISE0
Legend: — = Unimplemented location, read as ‘0’. Shaded bits are not used by Capture mode.
Note 1: These registers/bits are available on PIC18(L)F4XK22 devices.
TABLE 14-6: CONFIGURATION REGISTERS ASSOCIATED WITH CAPTURE
Register
on Page
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
CONFIG3H
MCLRE
—
P2BMX
T3CMX
HFOFST
CCP3MX
PBADEN
CCP2MX
356
Legend: — = Unimplemented location, read as ‘0’. Shaded bits are not used by Capture mode.
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 185
PIC18(L)F2X/4XK22
FIGURE 14-3:
CCP PWM OUTPUT SIGNAL
14.3 PWM Overview
Pulse-Width Modulation (PWM) is a scheme that
provides power to a load by switching quickly between
fully on and fully off states. The PWM signal resembles
a square wave where the high portion of the signal is
considered the on state and the low portion of the signal
is considered the off state. The high portion, also known
as the pulse width, can vary in time and is defined in
steps. A larger number of steps applied, which
lengthens the pulse width, also supplies more power to
the load. Lowering the number of steps applied, which
shortens the pulse width, supplies less power. The
PWM period is defined as the duration of one complete
cycle or the total amount of on and off time combined.
Period
Pulse Width
TMRx = PRx
TMRx = CCPRxH:CCPxCON<5:4>
TMRx = 0
FIGURE 14-4:
SIMPLIFIED PWM BLOCK
DIAGRAM
CCPxCON<5:4>
Duty Cycle Registers
PWM resolution defines the maximum number of steps
that can be present in a single PWM period. A higher
resolution allows for more precise control of the pulse
width time and in turn the power that is applied to the
load.
CCPRxL
CCPRxH(2) (Slave)
Comparator
CCPx
The term duty cycle describes the proportion of the on
time to the off time and is expressed in percentages,
where 0% is fully off and 100% is fully on. A lower duty
cycle corresponds to less power applied and a higher
duty cycle corresponds to more power applied.
R
S
Q
(1)
TMRx
TRIS
Figure 14-3 shows a typical waveform of the PWM
signal.
Comparator
PRx
Clear Timer,
toggle CCPx pin and
latch duty cycle
14.3.1
STANDARD PWM OPERATION
The standard PWM function described in this section is
available and identical for CCP and ECCP modules.
Note 1: The 8-bit timer TMRx register is concatenated
with the 2-bit internal system clock (FOSC), or
2 bits of the prescaler, to create the 10-bit time
base.
The standard PWM mode generates a Pulse-Width
modulation (PWM) signal on the CCPx pin with up to 10
bits of resolution. The period, duty cycle, and resolution
are controlled by the following registers:
2: In PWM mode, CCPRxH is a read-only register.
• PRx registers
14.3.2
SETUP FOR PWM OPERATION
• TxCON registers
• CCPRxL registers
• CCPxCON registers
The following steps should be taken when configuring
the CCP module for standard PWM operation:
1. Disable the CCPx pin output driver by setting the
associated TRIS bit.
Figure 14-4 shows a simplified block diagram of PWM
operation.
2. Select the 8-bit TimerX resource, (Timer2,
Timer4 or Timer6) to be used for PWM genera-
tion by setting the CxTSEL<1:0> bits in the
CCPTMRSx register.(1)
Note 1: The corresponding TRIS bit must be
cleared to enable the PWM output on the
CCPx pin.
3. Load the PRx register for the selected TimerX
with the PWM period value.
2: Clearing the CCPxCON register will
4. Configure the CCP module for the PWM mode
by loading the CCPxCON register with the
appropriate values.
relinquish control of the CCPx pin.
5. Load the CCPRxL register and the DCxB<1:0>
bits of the CCPxCON register, with the PWM
duty cycle value.
DS41412A-page 186
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
6. Configure and start the 8-bit TimerX resource:
14.3.5
PWM DUTY CYCLE
• Clear the TMRxIF interrupt flag bit of the
PIR2 or PIR4 register. See Note 1 below.
The PWM duty cycle is specified by writing a 10-bit
value to multiple registers: CCPRxL register and
DCxB<1:0> bits of the CCPxCON register. The
CCPRxL contains the eight MSbs and the DCxB<1:0>
bits of the CCPxCON register contain the two LSbs.
CCPRxL and DCxB<1:0> bits of the CCPxCON
register can be written to at any time. The duty cycle
value is not latched into CCPRxH until after the period
completes (i.e., a match between PRx and TMRx
registers occurs). While using the PWM, the CCPRxH
register is read-only.
• Configure the TxCKPS bits of the TxCON
register with the Timer prescale value.
• Enable the Timer by setting the TMRxON
bit of the TxCON register.
7. Enable PWM output pin:
• Wait until the Timer overflows and the
TMRxIF bit of the PIR2 or PIR4 register is
set. See Note 1 below.
• Enable the CCPx pin output driver by
clearing the associated TRIS bit.
Equation 14-2 is used to calculate the PWM pulse
width.
Note 1: In order to send a complete duty cycle
and period on the first PWM output, the
above steps must be included in the
setup sequence. If it is not critical to start
with a complete PWM signal on the first
output, then step 6 may be ignored.
Equation 14-3 is used to calculate the PWM duty cycle
ratio.
EQUATION 14-2: PULSE WIDTH
Pulse Width = CCPRxL:CCPxCON<5:4>
TOSC (TMRx Prescale Value)
14.3.3
PWM TIMER RESOURCE
The PWM standard mode makes use of one of the 8-bit
Timer2/4/6 timer resources to specify the PWM period.
Configuring the CxTSEL<1:0> bits in the CCPTMRS0
or CCPTMRS1 register selects which Timer2/4/6 timer
is used.
EQUATION 14-3: DUTY CYCLE RATIO
CCPRxL:CCPxCON<5:4>
Duty Cycle Ratio = ----------------------------------------------------------------------
4PRx + 1
14.3.4
PWM PERIOD
The PWM period is specified by the PRx register of 8-bit
TimerX. The PWM period can be calculated using the
formula of Equation 14-1.
The CCPRxH register and a 2-bit internal latch are
used to double buffer the PWM duty cycle. This double
buffering is essential for glitchless PWM operation.
The 8-bit timer TMRx register is concatenated with either
the 2-bit internal system clock (FOSC), or 2 bits of the
prescaler, to create the 10-bit time base. The system
clock is used if the TimerX prescaler is set to 1:1.
EQUATION 14-1: PWM PERIOD
PWM Period = PRx + 1 4 TOSC
(TMRx Prescale Value)
When the 10-bit time base matches the CCPRxH and
2-bit latch, then the CCPx pin is cleared (see
Figure 14-4).
Note 1: TOSC = 1/FOSC
When TMRx is equal to PRx, the following three events
occur on the next increment cycle:
• TMRx is cleared
• The CCPx pin is set. (Exception: If the PWM duty
cycle = 0%, the pin will not be set.)
• The PWM duty cycle is latched from CCPRxL into
CCPRxH.
Note:
The Timer postscaler (see Section 13.0
“Timer2/4/6 Module”) is not used in the
determination of the PWM frequency.
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 187
PIC18(L)F2X/4XK22
14.3.6
PWM RESOLUTION
EQUATION 14-4: PWM RESOLUTION
The resolution determines the number of available duty
cycles for a given period. For example, a 10-bit resolution
will result in 1024 discrete duty cycles, whereas an 8-bit
resolution will result in 256 discrete duty cycles.
log4PRx + 1
Resolution = ----------------------------------------- bits
log2
The maximum PWM resolution is 10 bits when PRx is
255. The resolution is a function of the PRx register
value as shown by Equation 14-4.
Note:
If the pulse width value is greater than the
period the assigned PWM pin(s) will
remain unchanged.
TABLE 14-7: EXAMPLE PWM FREQUENCIES AND RESOLUTIONS (FOSC = 32 MHz)
PWM Frequency
1.95 kHz
7.81 kHz
31.25 kHz
125 kHz
250 kHz
333.3 kHz
Timer Prescale (1, 4, 16)
PRx Value
16
0xFF
10
4
1
1
0x3F
8
1
0x1F
7
1
0xFF
10
0xFF
10
0x17
6.6
Maximum Resolution (bits)
TABLE 14-8: EXAMPLE PWM FREQUENCIES AND RESOLUTIONS (FOSC = 20 MHz)
PWM Frequency
1.22 kHz
4.88 kHz
19.53 kHz
78.12 kHz
156.3 kHz
208.3 kHz
Timer Prescale (1, 4, 16)
PRx Value
16
0xFF
10
4
1
1
0x3F
8
1
0x1F
7
1
0xFF
10
0xFF
10
0x17
6.6
Maximum Resolution (bits)
TABLE 14-9: EXAMPLE PWM FREQUENCIES AND RESOLUTIONS (FOSC = 8 MHz)
PWM Frequency
1.22 kHz
4.90 kHz
19.61 kHz
76.92 kHz
153.85 kHz 200.0 kHz
Timer Prescale (1, 4, 16)
PRx Value
16
0x65
8
4
0x65
8
1
0x65
8
1
0x19
6
1
0x0C
5
1
0x09
5
Maximum Resolution (bits)
14.3.7
OPERATION IN SLEEP MODE
14.3.9
EFFECTS OF RESET
In Sleep mode, the TMRx register will not increment
and the state of the module will not change. If the CCPx
pin is driving a value, it will continue to drive that value.
When the device wakes up, TMRx will continue from its
previous state.
Any Reset will force all ports to Input mode and the
CCP registers to their Reset states.
14.3.8
CHANGES IN SYSTEM CLOCK
FREQUENCY
The PWM frequency is derived from the system clock
frequency. Any changes in the system clock frequency
will result in changes to the PWM frequency. See
Section 2.0 “Oscillator Module (With Fail-Safe
Clock Monitor)” for additional details.
DS41412A-page 188
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
TABLE 14-10: REGISTERS ASSOCIATED WITH STANDARD PWM
Register
on Page
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
CCP1CON
CCP2CON
CCP3CON
CCP4CON
CCP5CON
CCPTMRS0
CCPTMRS1
INTCON
IPR1
P1M<1:0>
DC1B<1:0>
CCP1M<3:0>
CCP2M<3:0>
CCP3M<3:0>
CCP4M<3:0>
CCP5M<3:0>
—
203
203
203
203
203
206
206
115
127
128
129
123
124
126
118
119
121
56
P2M<1:0>
P3M<1:0>
DC2B<1:0>
DC3B<1:0>
DC4B<1:0>
DC5B<1:0>
—
—
—
—
C3TSEL<1:0>
—
C2TSEL<1:0>
C5TSEL<1:0>
C1TSEL<1:0>
C4TSEL<1:0>
INT0IF RBIF
—
—
PEIE/GIEL
ADIP
C1IP
—
—
TMR0IE
RC1IP
C2IP
—
—
INT0IE
TX1IP
EEIP
—
GIE/GIEH
RBIE
SSP1IP
BCL1IP
—
TMR0IF
CCP1IP
HLVDIP
CCP5IP
CCP1IE
HLVDIE
CCP5IE
CCP1IF
HLVDIF
CCP5IF
TMR3MD
CCP3MD
—
OSCFIP
—
TMR2IP
TMR3IP
CCP4IP
TMR2IE
TMR3IE
CCP4IE
TMR2IF
TMR3IF
CCP4IF
TMR2MD
CCP2MD
TMR1IP
CCP2IP
CCP3IP
TMR1IE
CCP2IE
CCP3IE
TMR1IF
CCP2IF
CCP3IF
TMR1MD
CCP1MD
IPR2
IPR4
PIE1
—
ADIE
C1IE
—
RC1IE
C2IE
—
TX1IE
EEIE
—
SSP1IE
BCL1IE
—
PIE2
OSCFIE
—
PIE4
PIR1
—
ADIF
C1IF
—
RC1IF
C2IF
—
TX1IF
EEIF
SSP1IF
BCL1IF
—
PIR2
OSCFIF
—
PIR4
—
PMD0
UART2MD UART1MD
MSSP2MD MSSP1MD
TMR6MD
—
TMR5MD
CCP5MD
TMR4MD
CCP4MD
PMD1
57
PR2
Timer2 Period Register
Timer4 Period Register
Timer6 Period Register
—
PR4
—
PR6
—
T2CON
T4CON
T6CON
TMR2
—
—
—
T2OUTPS<3:0>
TMR2ON
TMR4ON
TMR6ON
T2CKPS<1:0>
172
172
172
—
T4OUTPS<3:0>
T6OUTPS<3:0>
T4CKPS<1:0>
T6CKPS<1:0>
Timer2 Period Register
TMR4
Timer4 Period Register
Timer6 Period Register
—
TMR6
—
TRISB
TRISC
TRISB7
TRISC7
TRISD7
WPUE3
TRISB6
TRISC6
TRISD6
—
TRISB5
TRISC5
TRISD5
—
TRISB4
TRISC4
TRISD4
—
TRISB3
TRISC3
TRISD3
—
TRISB2
TRISC2
TRISD2
TRISB1
TRISB0
TRISC0
TRISD0
155
155
155
155
TRISC1
(1)
TRISD
TRISD1
(1)
(1)
(1)
TRISE
TRISE2
TRISE1
TRISE0
Legend: — = Unimplemented location, read as ‘0’. Shaded bits are not used by Capture mode.
Note 1: These registers/bits are available on PIC18(L)F4XK22 devices.
TABLE 14-11: CONFIGURATION REGISTERS ASSOCIATED WITH CAPTURE
Register
on Page
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
CONFIG3H
MCLRE
—
P2BMX
T3CMX
HFOFST
CCP3MX
PBADEN
CCP2MX
356
Legend: — = Unimplemented location, read as ‘0’. Shaded bits are not used by Capture mode.
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 189
PIC18(L)F2X/4XK22
To select an Enhanced PWM Output mode, the
PxM<1:0> bits of the CCPxCON register must be
configured appropriately.
14.4 PWM (Enhanced Mode)
The enhanced PWM function described in this section is
available for CCP modules ECCP1, ECCP2 and
ECCP3, with any differences between modules noted.
The PWM outputs are multiplexed with I/O pins and are
designated PxA, PxB, PxC and PxD. The polarity of the
PWM pins is configurable and is selected by setting the
CCPxM bits in the CCPxCON register appropriately.
The enhanced PWM mode generates a Pulse-Width
Modulation (PWM) signal on up to four different output
pins with up to 10 bits of resolution. The period, duty
cycle, and resolution are controlled by the following
registers:
Figure 14-5 shows an example of a simplified block
diagram of the Enhanced PWM module.
Table 14-12 shows the pin assignments for various
Enhanced PWM modes.
• PRx registers
• TxCON registers
• CCPRxL registers
• CCPxCON registers
Note 1: The corresponding TRIS bit must be
cleared to enable the PWM output on the
CCPx pin.
The ECCP modules have the following additional PWM
registers which control Auto-shutdown, Auto-restart,
Dead-band Delay and PWM Steering modes:
2: Clearing the CCPxCON register will
relinquish control of the CCPx pin.
3: Any pin not used in the enhanced PWM
mode is available for alternate pin
functions, if applicable.
• ECCPxAS registers
• PSTRxCON registers
• PWMxCON registers
4: To prevent the generation of an
incomplete waveform when the PWM is
first enabled, the ECCP module waits
until the start of a new PWM period before
generating a PWM signal.
The enhanced PWM module can generate the following
five PWM Output modes:
• Single PWM
• Half-Bridge PWM
• Full-Bridge PWM, Forward Mode
• Full-Bridge PWM, Reverse Mode
• Single PWM with PWM Steering Mode
FIGURE 14-5:
EXAMPLE SIMPLIFIED BLOCK DIAGRAM OF THE ENHANCED PWM MODE
DCxB<1:0>
PxM<1:0>
CCPxM<3:0>
4
Duty Cycle Registers
2
CCPRxL
CCPx/PxA
CCPx/PxA
PxB
TRISx
TRISx
TRISx
TRISx
CCPRxH (Slave)
Comparator
PxB
Output
Controller
R
S
Q
PxC(2)
PxD(2)
PxC
(1)
TMRx
PxD
Comparator
PRx
Clear Timer,
toggle PWM pin and
latch duty cycle
PWMxCON
Note 1: The 8-bit timer TMRx register is concatenated with the 2-bit internal Q clock, or 2 bits of the prescaler to create the 10-bit time
base.
2: PxC and PxD are not available on Half-Bridge ECCP Modules.
DS41412A-page 190
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
TABLE 14-12: EXAMPLE PIN ASSIGNMENTS FOR VARIOUS PWM ENHANCED MODES
ECCP Mode
PxM<1:0>
CCPx/PxA
PxB
PxC
PxD
Single
00
10
01
11
Yes(1)
Yes
Yes(1)
Yes
Yes(1)
No
Yes(1)
No
Half-Bridge
Full-Bridge, Forward
Full-Bridge, Reverse
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Note 1: PWM Steering enables outputs in Single mode.
FIGURE 14-6:
EXAMPLE PWM (ENHANCED MODE) OUTPUT RELATIONSHIPS (ACTIVE-HIGH
STATE)
PRX+1
Pulse
Width
0
Signal
PxM<1:0>
Period
PxA Modulated
PxA Modulated
PxB Modulated
PxA Active
(Single Output)
00
10
Delay(1)
Delay(1)
(Half-Bridge)
PxB Inactive
PxC Inactive
PxD Modulated
PxA Inactive
PxB Modulated
PxC Active
(Full-Bridge,
Forward)
01
(Full-Bridge,
Reverse)
11
PxD Inactive
Relationships:
•
•
•
Period = 4 * TOSC * (PRx + 1) * (TMRx Prescale Value)
Pulse Width = TOSC * (CCPRxL<7:0>:CCPxCON<5:4>) * (TMRx Prescale Value)
Delay = 4 * TOSC * (PWMxCON<6:0>)
Note 1: Dead-band delay is programmed using the PWMxCON register (Section 14.4.5 “Programmable Dead-Band Delay
Mode”).
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 191
PIC18(L)F2X/4XK22
FIGURE 14-7:
EXAMPLE ENHANCED PWM OUTPUT RELATIONSHIPS (ACTIVE-LOW STATE)
PRx+1
Pulse
Width
0
Signal
PxM<1:0>
Period
PxA Modulated
PxA Modulated
PxB Modulated
PxA Active
(Single Output)
00
10
Delay(1)
Delay(1)
(Half-Bridge)
(Full-Bridge,
Forward)
PxB Inactive
PxC Inactive
PxD Modulated
PxA Inactive
PxB Modulated
PxC Active
01
(Full-Bridge,
Reverse)
11
PxD Inactive
Relationships:
•
•
•
Period = 4 * TOSC * (PRx + 1) * (TMRx Prescale Value)
Pulse Width = TOSC * (CCPRxL<7:0>:CCPxCON<5:4>) * (TMRx Prescale Value)
Delay = 4 * TOSC * (PWMxCON<6:0>)
Note 1: Dead-band delay is programmed using the PWMxCON register (Section 14.4.5 “Programmable Dead-Band Delay
Mode”).
DS41412A-page 192
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
Since the PxA and PxB outputs are multiplexed with the
PORT data latches, the associated TRIS bits must be
cleared to configure PxA and PxB as outputs.
14.4.1
HALF-BRIDGE MODE
In Half-Bridge mode, two pins are used as outputs to
drive push-pull loads. The PWM output signal is output
on the CCPx/PxA pin, while the complementary PWM
output signal is output on the PxB pin (see Figure 14-9).
This mode can be used for Half-Bridge applications, as
shown in Figure 14-9, or for Full-Bridge applications,
where four power switches are being modulated with
two PWM signals.
FIGURE 14-8:
EXAMPLE OF HALF-
BRIDGE PWM OUTPUT
Period
Period
Pulse Width
(2)
(2)
PxA
In Half-Bridge mode, the programmable dead-band delay
can be used to prevent shoot-through current in Half-
Bridge power devices. The value of the PDC<6:0> bits of
the PWMxCON register sets the number of instruction
cycles before the output is driven active. If the value is
greater than the duty cycle, the corresponding output
remains inactive during the entire cycle. See
Section 14.4.5 “Programmable Dead-Band Delay
Mode” for more details of the dead-band delay
operations.
td
td
PxB
(1)
(1)
(1)
td = Dead-Band Delay
Note 1: At this time, the TMRx register is equal to the
PRx register.
2: Output signals are shown as active-high.
FIGURE 14-9:
EXAMPLE OF HALF-BRIDGE APPLICATIONS
Standard Half-Bridge Circuit (“Push-Pull”)
FET
Driver
+
-
PxA
Load
FET
Driver
+
-
PxB
Half-Bridge Output Driving a Full-Bridge Circuit
V+
FET
Driver
FET
Driver
PxA
Load
FET
FET
Driver
Driver
PxB
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 193
PIC18(L)F2X/4XK22
14.4.2
FULL-BRIDGE MODE
In Full-Bridge mode, all four pins are used as outputs.
An example of Full-Bridge application is shown in
Figure 14-10.
In the Forward mode, pin CCPx/PxA is driven to its active
state, pin PxD is modulated, while PxB and PxC will be
driven to their inactive state as shown in Figure 14-11.
In the Reverse mode, PxC is driven to its active state, pin
PxB is modulated, while PxA and PxD will be driven to
their inactive state as shown Figure 14-11.
PxA, PxB, PxC and PxD outputs are multiplexed with
the PORT data latches. The associated TRIS bits must
be cleared to configure the PxA, PxB, PxC and PxD
pins as outputs.
FIGURE 14-10:
EXAMPLE OF FULL-BRIDGE APPLICATION
V+
QC
QA
FET
Driver
FET
Driver
PxA
PxB
Load
FET
Driver
FET
Driver
PxC
PxD
QD
QB
V-
DS41412A-page 194
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
FIGURE 14-11:
EXAMPLE OF FULL-BRIDGE PWM OUTPUT
Forward Mode
Period
(2)
PxA
Pulse Width
(2)
PxB
(2)
PxC
(2)
PxD
(1)
(1)
Reverse Mode
Period
Pulse Width
(2)
PxA
(2)
PxB
(2)
PxC
(2)
PxD
(1)
(1)
Note 1: At this time, the TMRx register is equal to the PRx register.
2: Output signal is shown as active-high.
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 195
PIC18(L)F2X/4XK22
The Full-Bridge mode does not provide dead-band
delay. As one output is modulated at a time, dead-band
delay is generally not required. There is a situation
where dead-band delay is required. This situation
occurs when both of the following conditions are true:
14.4.2.1
Direction Change in Full-Bridge
Mode
In the Full-Bridge mode, the PxM1 bit in the CCPxCON
register allows users to control the forward/reverse
direction. When the application firmware changes this
direction control bit, the module will change to the new
direction on the next PWM cycle.
1. The direction of the PWM output changes when
the duty cycle of the output is at or near 100%.
2. The turn off time of the power switch, including
the power device and driver circuit, is greater
than the turn on time.
A direction change is initiated in software by changing
the PxM1 bit of the CCPxCON register. The following
sequence occurs four Timer cycles prior to the end of
the current PWM period:
Figure 14-13 shows an example of the PWM direction
changing from forward to reverse, at a near 100% duty
cycle. In this example, at time t1, the output PxA and
PxD become inactive, while output PxC becomes
active. Since the turn off time of the power devices is
longer than the turn on time, a shoot-through current
will flow through power devices QC and QD (see
Figure 14-10) for the duration of ‘t’. The same
phenomenon will occur to power devices QA and QB
for PWM direction change from reverse to forward.
• The modulated outputs (PxB and PxD) are placed
in their inactive state.
• The associated unmodulated outputs (PxA and
PxC) are switched to drive in the opposite
direction.
• PWM modulation resumes at the beginning of the
next period.
See Figure 14-12 for an illustration of this sequence.
If changing PWM direction at high duty cycle is required
for an application, two possible solutions for eliminating
the shoot-through current are:
1. Reduce PWM duty cycle for one PWM period
before changing directions.
2. Use switch drivers that can drive the switches off
faster than they can drive them on.
Other options to prevent shoot-through current may
exist.
FIGURE 14-12:
EXAMPLE OF PWM DIRECTION CHANGE
(1)
Period
Period
Signal
PxA (Active-High)
PxB (Active-High)
Pulse Width
PxC (Active-High)
PxD (Active-High)
(2)
Pulse Width
Note 1: The direction bit PxM1 of the CCPxCON register is written any time during the PWM cycle.
2: When changing directions, the PxA and PxC signals switch before the end of the current PWM cycle. The
modulated PxB and PxD signals are inactive at this time. The length of this time is (TimerX Prescale)/FOSC,
where TimerX is Timer2, Timer4 or Timer6.
DS41412A-page 196
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
FIGURE 14-13:
EXAMPLE OF PWM DIRECTION CHANGE AT NEAR 100% DUTY CYCLE
Forward Period
Reverse Period
t1
PxA
PxB
PW
PxC
PxD
PW
TON
External Switch C
External Switch D
TOFF
Potential
T = TOFF – TON
Shoot-Through Current
Note 1: All signals are shown as active-high.
2: TON is the turn-on delay of power switch QC and its driver.
3: TOFF is the turn-off delay of power switch QD and its driver.
of each pin pair is determined by the PSSxAC<1:0> and
PSSxBD<1:0> bits of the ECCPxAS register. Each pin
pair may be placed into one of three states:
14.4.3
ENHANCED PWM AUTO-
SHUTDOWN MODE
The PWM mode supports an Auto-Shutdown mode that
will disable the PWM outputs when an external
shutdown event occurs. Auto-Shutdown mode places
the PWM output pins into a predetermined state. This
mode is used to help prevent the PWM from damaging
the application.
• Drive logic ‘1’
• Drive logic ‘0’
• Tri-state (high-impedance)
Note 1: The auto-shutdown condition is a level-
based signal, not an edge-based signal.
As long as the level is present, the auto-
shutdown will persist.
The auto-shutdown sources are selected using the
CCPxAS<2:0> bits of the ECCPxAS register.
shutdown event may be generated by:
A
• A logic ‘0’ on the INT pin
• Comparator Cx
2: Writing to the CCPxASE bit is disabled
while an auto-shutdown condition
persists.
• Setting the CCPxASE bit in firmware
A shutdown condition is indicated by the CCPxASE
(Auto-Shutdown Event Status) bit of the ECCPxAS
register. If the bit is a ‘0’, the PWM pins are operating
normally. If the bit is a ‘1’, the PWM outputs are in the
shutdown state.
3: Once the auto-shutdown condition has
been removed and the PWM restarted
(either through firmware or auto-restart),
the PWM signal will always restart at the
beginning of the next PWM period.
When a shutdown event occurs, two things happen:
The CCPxASE bit is set to ‘1’. The CCPxASE will
remain set until cleared in firmware or an auto-restart
occurs (see Section 14.4.4 “Auto-Restart Mode”).
The enabled PWM pins are asynchronously placed in
their shutdown states. The PWM output pins are
grouped into pairs [PxA/PxC] and [PxB/PxD]. The state
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 197
PIC18(L)F2X/4XK22
FIGURE 14-14:
PWM AUTO-SHUTDOWN WITH FIRMWARE RESTART (PXRSEN = 0)
Missing Pulse
(Auto-Shutdown)
Missing Pulse
(CCPxASE not clear)
Timer
Overflow
Timer
Overflow
Timer
Overflow
Timer
Overflow
Timer
Overflow
PWM Period
PWM Activity
Start of
PWM Period
Shutdown Event
CCPxASE bit
PWM
Resumes
Shutdown
Event Occurs
Shutdown
Event Clears
CCPxASE
Cleared by
Firmware
If auto-restart is enabled, the CCPxASE bit will remain
set as long as the auto-shutdown condition is active.
When the auto-shutdown condition is removed, the
CCPxASE bit will be cleared via hardware and normal
operation will resume.
14.4.4
AUTO-RESTART MODE
The Enhanced PWM can be configured to
automatically restart the PWM signal once the auto-
shutdown condition has been removed. Auto-restart is
enabled by setting the PxRSEN bit in the PWMxCON
register.
FIGURE 14-15:
PWM AUTO-SHUTDOWN WITH AUTO-RESTART (PXRSEN = 1)
Missing Pulse
(Auto-Shutdown)
Missing Pulse
(CCPxASE not clear)
Timer
Overflow
Timer
Overflow
Timer
Overflow
Timer
Overflow
Timer
Overflow
PWM Period
PWM Activity
Start of
PWM Period
Shutdown Event
CCPxASE bit
PWM
Resumes
Shutdown
Event Occurs
Shutdown
Event Clears
CCPxASE
Cleared by
Hardware
DS41412A-page 198
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
14.4.5
PROGRAMMABLE DEAD-BAND
DELAY MODE
FIGURE 14-16:
EXAMPLE OF HALF-
BRIDGE PWM OUTPUT
In Half-Bridge applications where all power switches
are modulated at the PWM frequency, the power
switches normally require more time to turn off than to
turn on. If both the upper and lower power switches are
switched at the same time (one turned on, and the
other turned off), both switches may be on for a short
period of time until one switch completely turns off.
During this brief interval, a very high current (shoot-
through current) will flow through both power switches,
shorting the bridge supply. To avoid this potentially
destructive shoot-through current from flowing during
switching, turning on either of the power switches is
normally delayed to allow the other switch to
completely turn off.
Period
Period
Pulse Width
(2)
(2)
PxA
td
td
PxB
(1)
(1)
(1)
td = Dead-Band Delay
Note 1: At this time, the TMRx register is equal to the
PRx register.
2: Output signals are shown as active-high.
In Half-Bridge mode, a digitally programmable dead-
band delay is available to avoid shoot-through current
from destroying the bridge power switches. The delay
occurs at the signal transition from the non-active state
to the active state. See Figure 14-16 for illustration.
The lower seven bits of the associated PWMxCON
register (Register 14-6) sets the delay period in terms
of microcontroller instruction cycles (TCY or 4 TOSC).
FIGURE 14-17:
EXAMPLE OF HALF-BRIDGE APPLICATIONS
V+
Standard Half-Bridge Circuit (“Push-Pull”)
FET
Driver
+
V
-
PxA
Load
FET
Driver
+
V
-
PxB
V-
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 199
PIC18(L)F2X/4XK22
14.4.6
PWM STEERING MODE
FIGURE 14-18:
SIMPLIFIED STEERING
BLOCK DIAGRAM
In Single Output mode, PWM steering allows any of the
PWM pins to be the modulated signal. Additionally, the
same PWM signal can be simultaneously available on
multiple pins.
STRxA
PxA Signal
CCPxM1
PxA pin
1
Once the Single Output mode is selected
(CCPxM<3:2> = 11 and PxM<1:0> = 00 of the
CCPxCON register), the user firmware can bring out
the same PWM signal to one, two, three or four output
pins by setting the appropriate Steering Enable bits
(STRxA, STRxB, STRxC and/or STRxD) of the
PSTRxCON register, as shown in Table 14-13.
PORT Data
STRxB
0
TRIS
PxB pin
CCPxM0
1
PORT Data
STRxC
0
TRIS
Note:
The associated TRIS bits must be set to
output (‘0’) to enable the pin output driver
in order to see the PWM signal on the pin.
PxC pin
1
CCPxM1
While the PWM Steering mode is active, CCPxM<1:0>
bits of the CCPxCON register select the PWM output
polarity for the PxD, PxC, PxB and PxA pins.
PORT Data
0
TRIS
STRxD
The PWM auto-shutdown operation also applies to
PWM Steering mode as described in Section 14.4.3
“Enhanced PWM Auto-shutdown Mode”. An auto-
shutdown event will only affect pins that have PWM
outputs enabled.
PxD pin
1
CCPxM0
PORT Data
0
TRIS
Note 1: Port outputs are configured as shown when
the CCPxCON register bits PxM<1:0> = 00
and CCPxM<3:2> = 11.
2: Single PWM output requires setting at least
one of the STRx bits.
14.4.6.1
Steering Synchronization
The STRxSYNC bit of the PSTRxCON register gives
the user two selections of when the steering event will
happen. When the STRxSYNC bit is ‘0’, the steering
event will happen at the end of the instruction that
writes to the PSTRxCON register. In this case, the
output signal at the PxA, PxB, PxC and PxD pins may
be an incomplete PWM waveform. This operation is
useful when the user firmware needs to immediately
remove a PWM signal from the pin.
When the STRxSYNC bit is ‘1’, the effective steering
update will happen at the beginning of the next PWM
period. In this case, steering on/off the PWM output will
always produce a complete PWM waveform.
Figures 14-19 and 14-20 illustrate the timing diagrams
of the PWM steering depending on the STRxSYNC
setting.
DS41412A-page 200
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
modes must be enabled in the proper Output mode and
complete a full PWM cycle before enabling the PWM
pin output drivers. The completion of a full PWM cycle
is indicated by the TMRxIF bit of the PIR1, PIR2 or
PIR5 register being set as the second PWM period
begins.
14.4.7
START-UP CONSIDERATIONS
When any PWM mode is used, the application
hardware must use the proper external pull-up and/or
pull-down resistors on the PWM output pins.
The CCPxM<1:0> bits of the CCPxCON register allow
the user to choose whether the PWM output signals are
active-high or active-low for each pair of PWM output
pins (PxA/PxC and PxB/PxD). The PWM output
polarities must be selected before the PWM pin output
drivers are enabled. Changing the polarity
configuration while the PWM pin output drivers are
enable is not recommended since it may result in
damage to the application circuits.
Note:
When the microcontroller is released from
Reset, all of the I/O pins are in the
high-impedance state. The external cir-
cuits must keep the power switch devices
in the Off state until the microcontroller
drives the I/O pins with the proper signal
levels or activates the PWM output(s).
The PxA, PxB, PxC and PxD output latches may not be
in the proper states when the PWM module is
initialized. Enabling the PWM pin output drivers at the
same time as the Enhanced PWM modes may cause
damage to the application circuit. The Enhanced PWM
FIGURE 14-19:
EXAMPLE OF STEERING EVENT AT END OF INSTRUCTION (STRxSYNC = 0)
PWM Period
PWM
STRx
P1<D:A>
PORT Data
PORT Data
P1n = PWM
FIGURE 14-20:
EXAMPLE OF STEERING EVENT AT BEGINNING OF INSTRUCTION
(STRxSYNC = 1)
PWM
STRx
P1<D:A>
PORT Data
PORT Data
P1n = PWM
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 201
PIC18(L)F2X/4XK22
TABLE 14-13: REGISTERS ASSOCIATED WITH ENHANCED PWM
Register
on Page
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
ECCP1AS
CCP1CON
ECCP2AS
CCP2CON
ECCP3AS
CCP3CON
CCPTMRS0
INTCON
IPR1
CCP1ASE
CCP1AS<2:0>
P1SSAC<1:0>
CCP1M<3:0>
P2SSAC<1:0>
CCP2M<3:0>
P3SSAC<1:0>
CCP3M<3:0>
P1SSBD<1:0>
207
203
207
203
207
203
206
115
127
128
130
123
124
126
118
119
121
56
P1M<1:0>
CCP2ASE
P2M<1:0>
CCP3ASE
P3M<1:0>
C3TSEL<1:0>
DC1B<1:0>
CCP2AS<2:0>
DC2B<1:0>
CCP3AS<2:0>
DC3B<1:0>
P2SSBD<1:0>
P3SSBD<1:0>
C1TSEL<1:0>
C2TSEL<1:0>
—
TMR0IE
RCxIP
C2IP
—
—
GIE/GIEH
—
PEIE/GIEL
INT0IE
TXxIP
EEIP
RBIE
SSPIP
BCL1IP
—
TMR0IF
CCP1IP
HLVDIP
CCP5IP
CCP1IE
HLVDIE
CCP5IE
CCP1IF
HLVDIF
CCP5IF
TMR3MD
CCP3MD
INT0IF
RBIF
ADIP
C1IP
—
TMR2IP
TMR3IP
CCP4IP
TMR2IE
TMR3IE
CCP4IE
TMR2IF
TMR3IF
CCP4IF
TMR2MD
CCP2MD
TMR1IP
CCP2IP
CCP3IP
TMR1IE
CCP2IE
CCP3IE
TMR1IF
CCP2IF
CCP3IF
TMR1MD
CCP1MD
IPR2
OSCFIP
—
IPR4
—
PIE1
ADIE
C1IE
—
RCxIE
C2IE
—
TXxIE
EEIE
SSPIE
BCLIE
—
—
PIE2
OSCFIE
—
PIE4
—
PIR1
ADIF
C1IF
—
RCxIF
C2IF
—
TXxIF
EEIF
SSPIF
BCLIF
—
—
PIR2
OSCFIF
—
PIR4
—
PMD0
UART2MD UART1MD
MSSP2MD MSSP1MD
TMR6MD
—
TMR5MD
CCP5MD
TMR4MD
CCP4MD
PMD1
57
PR2
Timer2 Period Register
Timer4 Period Register
Timer6 Period Register
—
PR4
—
PR6
—
PSTR1CON
PSTR2CON
PSTR3CON
PWM1CON
PWM2CON
PWM3CON
T2CON
T4CON
T6CON
TMR2
STR1SYNC
STR2SYNC
STR3SYNC
STR1D
STR2D
STR1C
STR2C
STR3C
STR1B
STR2B
STR3B
STR1A
STR2A
STR3A
208
208
208
208
208
208
172
172
172
—
—
—
—
—
—
—
—
—
STR3D
—
P1RSEN
P2RSEN
P3RSEN
—
P1DC<6:0>
P2DC<6:0>
P3DC<6:0>
T2OUTPS<3:0>
TMR2ON
TMR4ON
TMR6ON
T2CKPS<1:0>
T4OUTPS<3:0>
T6OUTPS<3:0>
T4CKPS<1:0>
T6CKPS<1:0>
—
—
Timer2 Module Register
Timer4 Module Register
Timer6 Module Register
TMR4
—
TMR6
—
TRISA
TRISA7
TRISB7
TRISC7
TRISD7
WPUE3
TRISA6
TRISB6
TRISC6
TRISD6
—
TRISA5
TRISB5
TRISC5
TRISD5
—
TRISA4
TRISB4
TRISC4
TRISD4
—
TRISA3
TRISB3
TRISC3
TRISD3
—
TRISA2
TRISB2
TRISC2
TRISD2
TRISA1
TRISA0
TRISB0
TRISC0
TRISD0
155
155
155
155
155
TRISB
TRISB1
TRISC1
TRISD1
TRISC
(1)
TRISD
(1)
(1)
(1)
TRISE
TRISE2
TRISE1
TRISE0
Legend: — = Unimplemented location, read as ‘0’. Shaded bits are not used by Capture mode.
Note 1: These registers/bits are available on PIC18(L)F4XK22 devices.
DS41412A-page 202
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
TABLE 14-14: CONFIGURATION REGISTERS ASSOCIATED WITH CAPTURE
Register
on Page
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
CONFIG3H
MCLRE
—
P2BMX
T3CMX
HFOFST
CCP3MX
PBADEN
CCP2MX
356
Legend: — = Unimplemented location, read as ‘0’. Shaded bits are not used by Capture mode.
REGISTER 14-1: CCPxCON: STANDARD CCPx CONTROL REGISTER
U-0
—
U-0
—
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
bit 0
DCxB<1:0>
CCPxM<3:0>
bit 7
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n/n = Value at POR and BOR/Value at all other Reset
u = Bit is unchanged
‘1’ = Bit is set
x = Bit is unknown
‘0’ = Bit is cleared
bit 7-6
bit 5-4
Unused
DCxB<1:0>: PWM Duty Cycle Least Significant bits
Capture mode:
Unused
Compare mode:
Unused
PWM mode:
These bits are the two LSbs of the PWM duty cycle. The eight MSbs are found in CCPRxL.
bit 3-0
CCPxM<3:0>: ECCPx Mode Select bits
0000= Capture/Compare/PWM off (resets the module)
0001= Reserved
0010= Compare mode: toggle output on match
0011= Reserved
0100= Capture mode: every falling edge
0101= Capture mode: every rising edge
0110= Capture mode: every 4th rising edge
0111= Capture mode: every 16th rising edge
1000= Compare mode: set output on compare match (CCPx pin is set, CCPxIF is set)
1001= Compare mode: clear output on compare match (CCPx pin is cleared, CCPxIF is set)
1010= Compare mode: generate software interrupt on compare match (CCPx pin is unaffected,
CCPxIF is set)
1011= Compare mode: Special Event Trigger (CCPx pin is unaffected, CCPxIF is set)
TimerX (selected by CxTSEL bits) is reset
ADON is set, starting A/D conversion if A/D module is enabled(1)
11xx=: PWM mode
Note 1: This feature is available on CCP5 only.
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 203
PIC18(L)F2X/4XK22
REGISTER 14-2: CCPxCON: ENHANCED CCPx CONTROL REGISTER
R/x-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
bit 0
PxM<1:0>
DCxB<1:0>
CCPxM<3:0>
bit 7
Legend:
R = Readable bit
W = Writable bit
x = Bit is unknown
‘0’ = Bit is cleared
U = Unimplemented bit, read as ‘0’
-n/n = Value at POR and BOR/Value at all other Reset
u = Bit is unchanged
‘1’ = Bit is set
bit 7-6
PxM<1:0>: Enhanced PWM Output Configuration bits
If CCPxM<3:2> = 00, 01, 10: (Capture/Compare modes)
xx = PxA assigned as Capture/Compare input; PxB, PxC, PxD assigned as port pins
Half-Bridge ECCP Modules(1)
:
If CCPxM<3:2> = 11: (PWM modes)
0x = Single output; PxA modulated; PxB assigned as port pin
1x = Half-Bridge output; PxA, PxB modulated with dead-band control
Full-Bridge ECCP Modules(1)
:
If CCPxM<3:2> = 11: (PWM modes)
00 = Single output; PxA modulated; PxB, PxC, PxD assigned as port pins
01 = Full-Bridge output forward; PxD modulated; PxA active; PxB, PxC inactive
10 = Half-Bridge output; PxA, PxB modulated with dead-band control; PxC, PxD assigned as port
pins
11 = Full-Bridge output reverse; PxB modulated; PxC active; PxA, PxD inactive
bit 5-4
DCxB<1:0>: PWM Duty Cycle Least Significant bits
Capture mode:
Unused
Compare mode:
Unused
PWM mode:
These bits are the two LSbs of the PWM duty cycle. The eight MSbs are found in CCPRxL.
Note 1: See Table 14-1 to determine Full-Bridge and Half-Bridge ECCPs for the device being used.
DS41412A-page 204
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
REGISTER 14-2: CCPxCON: ENHANCED CCPx CONTROL REGISTER (CONTINUED)
bit 3-0 CCPxM<3:0>: ECCPx Mode Select bits
0000= Capture/Compare/PWM off (resets the module)
0001= Reserved
0010= Compare mode: toggle output on match
0011= Reserved
0100= Capture mode: every falling edge
0101= Capture mode: every rising edge
0110= Capture mode: every 4th rising edge
0111= Capture mode: every 16th rising edge
1000= Compare mode: set output on compare match (CCPx pin is set, CCPxIF is set)
1001= Compare mode: clear output on compare match (CCPx pin is cleared, CCPxIF is set)
1010= Compare mode: generate software interrupt on compare match (CCPx pin is unaffected,
CCPxIF is set)
1011= Compare mode: Special Event Trigger (CCPx pin is unaffected, CCPxIF is set)
TimerX is reset
Half-Bridge ECCP Modules(1)
:
1100 = PWM mode: PxA active-high; PxB active-high
1101 = PWM mode: PxA active-high; PxB active-low
1110 = PWM mode: PxA active-low; PxB active-high
1111 = PWM mode: PxA active-low; PxB active-low
Full-Bridge ECCP Modules(1)
:
1100 = PWM mode: PxA, PxC active-high; PxB, PxD active-high
1101 = PWM mode: PxA, PxC active-high; PxB, PxD active-low
1110 = PWM mode: PxA, PxC active-low; PxB, PxD active-high
1111 = PWM mode: PxA, PxC active-low; PxB, PxD active-low
Note 1: See Table 14-1 to determine Full-Bridge and Half-Bridge ECCPs for the device being used.
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 205
PIC18(L)F2X/4XK22
REGISTER 14-3: CCPTMRS0: PWM TIMER SELECTION CONTROL REGISTER 0
R/W-0
R/W-0
U-0
—
R/W-0
R/W-0
U-0
—
R/W-0
R/W-0
C3TSEL<1:0>
C2TSEL<1:0>
C1TSEL<1:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n/n = Value at POR and BOR/Value at all other Resets
u = Bit is unchanged
‘1’ = Bit is set
x = Bit is unknown
‘0’ = Bit is cleared
bit 7-6
C3TSEL<1:0>: CCP3 Timer Selection bits
00= CCP3 - Capture/Compare modes use Timer1, PWM modes use Timer2
01= CCP3 - Capture/Compare modes use Timer3, PWM modes use Timer4
10= CCP3 - Capture/Compare modes use Timer5, PWM modes use Timer6
11= Reserved
bit 5
Unused
bit 4-3
C2TSEL<1:0>: CCP2 Timer Selection bits
00= CCP2 - Capture/Compare modes use Timer1, PWM modes use Timer2
01= CCP2 - Capture/Compare modes use Timer3, PWM modes use Timer4
10= CCP2 - Capture/Compare modes use Timer5, PWM modes use Timer6
11= Reserved
bit 2
Unused
bit 1-0
C1TSEL<1:0>: CCP1 Timer Selection bits
00= CCP1 - Capture/Compare modes use Timer1, PWM modes use Timer2
01= CCP1 - Capture/Compare modes use Timer3, PWM modes use Timer4
10= CCP1 - Capture/Compare modes use Timer5, PWM modes use Timer6
11= Reserved
REGISTER 14-4: CCPTMRS1: PWM TIMER SELECTION CONTROL REGISTER 1
U-0
—
U-0
—
U-0
—
U-0
—
R/W-0
R/W-0
R/W-0
R/W-0
C5TSEL<1:0>
C4TSEL<1:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
x = Bit is unknown
‘0’ = Bit is cleared
U = Unimplemented bit, read as ‘0’
-n/n = Value at POR and BOR/Value at all other Resets
u = Bit is unchanged
‘1’ = Bit is set
bit 7-4
bit 3-2
Unimplemented: Read as ‘0’
C5TSEL<1:0>: CCP5 Timer Selection bits
00= CCP5 - Capture/Compare modes use Timer1, PWM modes use Timer2
01= CCP5 - Capture/Compare modes use Timer3, PWM modes use Timer4
10= CCP5 - Capture/Compare modes use Timer5, PWM modes use Timer6
11= Reserved
bit 1-0
C4TSEL<1:0>: CCP4 Timer Selection bits
00= CCP4 - Capture/Compare modes use Timer1, PWM modes use Timer2
01= CCP4 - Capture/Compare modes use Timer3, PWM modes use Timer4
10= CCP4 - Capture/Compare modes use Timer5, PWM modes use Timer6
11= Reserved
DS41412A-page 206
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
REGISTER 14-5: ECCPxAS: CCPX AUTO-SHUTDOWN CONTROL REGISTER
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
CCPxASE
CCPxAS<2:0>
PSSxAC<1:0>
PSSxBD<1:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n/n = Value at POR and BOR/Value at all other Resets
u = Bit is unchanged
‘1’ = Bit is set
x = Bit is unknown
‘0’ = Bit is cleared
bit 7
CCPxASE: CCPx Auto-shutdown Event Status bit
if PxRSEN = 1;
1= An Auto-shutdown event occurred; CCPxASE bit will automatically clear when event goes away;
CCPx outputs in shutdown state
0= CCPx outputs are operating
if PxRSEN = 0;
1= An Auto-shutdown event occurred; bit must be cleared in software to restart PWM;
CCPx outputs in shutdown state
0= CCPx outputs are operating
bit 6-4
CCxPAS<2:0>: CCPx Auto-Shutdown Source Select bits (1)
000= Auto-shutdown is disabled
001= Comparator C1 - output high will cause shutdown event
010= Comparator C2 - output high will cause shutdown event
011=Either Comparator C1 or C2 - output high will cause shutdown event
100= FLT0 pin - low level will cause shutdown event
101= FLT0 pin or Comparator C1 - low level will cause shutdown event
110= FLT0 pin or Comparator C2 - low level will cause shutdown event
111= FLT0 pin or Comparators C1 or C2 - low level will cause shutdown event
bit 3-2
bit 1-0
PSSxAC<1:0>: Pins PxA and PxC Shutdown State Control bits
00= Drive pins PxA and PxC to ‘0’
01= Drive pins PxA and PxC to ‘1’
1x= Pins PxA and PxC tri-state
PSSxBD<1:0>: Pins PxB and PxD Shutdown State Control bits
00= Drive pins PxB and PxD to ‘0’
01= Drive pins PxB and PxD to ‘1’
1x= Pins PxB and PxD tri-state
Note 1: If C1SYNC or C2SYNC bits in the CM2CON1 register are enabled, the shutdown will be delayed by
Timer1.
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 207
PIC18(L)F2X/4XK22
REGISTER 14-6: PWMxCON: ENHANCED PWM CONTROL REGISTER
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
bit 0
PxRSEN
PxDC<6:0>
bit 7
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n/n = Value at POR and BOR/Value at all other Resets
u = Bit is unchanged
‘1’ = Bit is set
x = Bit is unknown
‘0’ = Bit is cleared
bit 7
PxRSEN: PWM Restart Enable bit
1= Upon auto-shutdown, the CCPxASE bit clears automatically once the shutdown event goes
away; the PWM restarts automatically
0= Upon auto-shutdown, CCPxASE must be cleared in software to restart the PWM
bit 6-0
PxDC<6:0>: PWM Delay Count bits
PxDCx = Number of FOSC/4 (4 * TOSC) cycles between the scheduled time when a PWM signal
should transition active and the actual time it transitions active
REGISTER 14-7: PSTRxCON: PWM STEERING CONTROL REGISTER(1)
U-0
—
U-0
—
U-0
—
R/W-0
R/W-0
R/W-0
R/W-0
R/W-1
STRxSYNC
STRxD
STRxC
STRxB
STRxA
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
x = Bit is unknown
‘0’ = Bit is cleared
U = Unimplemented bit, read as ‘0’
-n/n = Value at POR and BOR/Value at all other Resets
u = Bit is unchanged
‘1’ = Bit is set
bit 7-5
bit 4
Unimplemented: Read as ‘0’
STRxSYNC: Steering Sync bit
1= Output steering update occurs on next PWM period
0= Output steering update occurs at the beginning of the instruction cycle boundary
bit 3
bit 2
bit 1
bit 0
STRxD: Steering Enable bit D
1= PxD pin has the PWM waveform with polarity control from CCPxM<1:0>
0= PxD pin is assigned to port pin
STRxC: Steering Enable bit C
1= PxC pin has the PWM waveform with polarity control from CCPxM<1:0>
0= PxC pin is assigned to port pin
STRxB: Steering Enable bit B
1= PxB pin has the PWM waveform with polarity control from CCPxM<1:0>
0= PxB pin is assigned to port pin
STRxA: Steering Enable bit A
1= PxA pin has the PWM waveform with polarity control from CCPxM<1:0>
0= PxA pin is assigned to port pin
Note 1: The PWM Steering mode is available only when the CCPxCON register bits CCPxM<3:2> = 11and
PxM<1:0> = 00.
DS41412A-page 208
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
The SPI interface supports the following modes and
features:
15.0 MASTER SYNCHRONOUS
SERIAL PORT (MSSP1 AND
MSSP2) MODULE
• Master mode
• Slave mode
• Clock Parity
15.1 Master SSPx (MSSPx) Module
Overview
• Slave Select Synchronization (Slave mode only)
• Daisy chain connection of slave devices
The Master Synchronous Serial Port (MSSPx) module
is a serial interface useful for communicating with other
peripheral or microcontroller devices. These peripheral
devices may be Serial EEPROMs, shift registers,
display drivers, A/D converters, etc. The MSSPx
module can operate in one of two modes:
Figure 15-1 is a block diagram of the SPI interface
module.
• Serial Peripheral Interface (SPI)
• Inter-Integrated Circuit (I2C™)
FIGURE 15-1:
MSSPx BLOCK DIAGRAM (SPI MODE)
Data Bus
Write
Read
SSPxBUF Reg
SDIx
SSPxSR Reg
Shift
Clock
bit 0
SDOx
SSx
Control
Enable
SSx
2 (CKP, CKE)
Clock Select
Edge
Select
SSPxM<3:0>
4
TMR2 Output
(
)
2
SCKx
Edge
Select
TOSC
Prescaler
4, 16, 64
Baud Rate
Generator
(SSPxADD)
TRIS bit
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 209
PIC18(L)F2X/4XK22
The I2C interface supports the following modes and
features:
The PIC18(L)F2X/4XK22 has two MSSP modules,
MSSP1 and MSSP2, each module operating indepen-
dently from the other.
• Master mode
• Slave mode
• Byte NACKing (Slave mode)
• Limited Multi-master support
• 7-bit and 10-bit addressing
• Start and Stop interrupts
• Interrupt masking
Note 1: In devices with more than one MSSP
module, it is very important to pay close
attention to SSPxCONx register names.
SSP1CON1 and SSP1CON2 registers
control different operational aspects of the
same module, while SSP1CON1 and
SSP2CON1 control the same features for
two different modules.
• Clock stretching
• Bus collision detection
• General call address matching
• Address masking
2: Throughout
this
section,
generic
references to an MSSP module in any of
its operating modes may be interpreted as
being equally applicable to MSSP1 or
MSSP2. Register names, module I/O
signals, and bit names may use the
generic designator ‘x’ to indicate the use
of a numeral to distinguish a particular
module when required.
• Address Hold and Data Hold modes
• Selectable SDAx hold times
Figure 15-2 is a block diagram of the I2C interface
module in Master mode. Figure 15-3 is a diagram of the
I2C interface module in Slave mode.
FIGURE 15-2:
MSSPx BLOCK DIAGRAM (I2C™ MASTER MODE)
Internal
Data Bus
[SSPxM 3:0]
Read
Write
SSPxBUF
SSPxSR
Baud Rate
Generator
(SSPxADD)
SDAx
Shift
Clock
SDAx in
MSb
LSb
Start bit, Stop bit,
Acknowledge
Generate (SSPxCON2)
SCLx
Start bit Detect,
Stop bit Detect
SCLx in
Bus Collision
Write Collision Detect
Clock Arbitration
State Counter for
Set/Reset: S, P, SSPxSTAT, WCOL, SSPxOV
Reset SEN, PEN (SSPxCON2)
Set SSPxIF, BCLxIF
end of XMIT/RCV
Address Match Detect
DS41412A-page 210
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
FIGURE 15-3:
MSSPx BLOCK DIAGRAM (I2C™ SLAVE MODE)
Internal
Data Bus
Read
Write
SSPxBUF Reg
SSPxSR Reg
SCLx
SDAx
Shift
Clock
MSb
LSb
SSPxMSK Reg
Match Detect
SSPxADD Reg
Addr Match
Set, Reset
S, P bits
(SSPxSTAT Reg)
Start and
Stop bit Detect
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 211
PIC18(L)F2X/4XK22
During each SPI clock cycle, a full-duplex data
transmission occurs. This means that at the same time,
the slave device is sending out the MSb from its shift
register and the master device is reading this bit from
that same line and saving it as the LSb of its shift
register.
15.2 SPI Mode Overview
The Serial Peripheral Interface (SPI) bus is a
synchronous serial data communication bus that
operates in Full-Duplex mode. Devices communicate
in a master/slave environment where the master device
initiates the communication.
A slave device is
After 8 bits have been shifted out, the master and slave
have exchanged register values.
controlled through a chip select known as Slave Select.
The SPI bus specifies four signal connections:
If there is more data to exchange, the shift registers are
loaded with new data and the process repeats itself.
• Serial Clock (SCKx)
• Serial Data Out (SDOx)
• Serial Data In (SDIx)
• Slave Select (SSx)
Whether the data is meaningful or not (dummy data),
depends on the application software. This leads to
three scenarios for data transmission:
Figure 15-1 shows the block diagram of the MSSPx
module when operating in SPI Mode.
• Master sends useful data and slave sends dummy
data.
• Master sends useful data and slave sends useful
data.
The SPI bus operates with a single master device and
one or more slave devices. When multiple slave
devices are used, an independent Slave Select
connection is required from the master device to each
slave device.
• Master sends dummy data and slave sends useful
data.
Transmissions may involve any number of clock
cycles. When there is no more data to be transmitted,
the master stops sending the clock signal and it
deselects the slave.
Figure 15-4 shows a typical connection between a
master device and multiple slave devices.
The master selects only one slave at a time. Most slave
devices have tri-state outputs so their output signal
appears disconnected from the bus when they are not
selected.
Every slave device connected to the bus that has not
been selected through its slave select line must disre-
gard the clock and transmission signals and must not
transmit out any data of its own.
Transmissions involve two shift registers, eight bits in
size, one in the master and one in the slave. With either
the master or the slave device, data is always shifted
out one bit at a time, with the Most Significant bit (MSb)
shifted out first. At the same time, a new Least
Significant bit (LSb) is shifted into the same register.
Figure 15-5 shows a typical connection between two
processors configured as master and slave devices.
Data is shifted out of both shift registers on the
programmed clock edge and latched on the opposite
edge of the clock.
The master device transmits information out on its
SDOx output pin which is connected to, and received
by, the slave’s SDIx input pin. The slave device trans-
mits information out on its SDOx output pin, which is
connected to, and received by, the master’s SDIx input
pin.
To begin communication, the master device first sends
out the clock signal. Both the master and the slave
devices should be configured for the same clock
polarity.
The master device starts a transmission by sending out
the MSb from its shift register. The slave device reads
this bit from that same line and saves it into the LSb
position of its shift register.
DS41412A-page 212
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
FIGURE 15-4:
SPI MASTER AND MULTIPLE SLAVE CONNECTION
SCLK
SDOx
SCLK
SDIx
SDOx
SSx
SPI Master
SPI Slave
#1
SDIx
General I/O
General I/O
General I/O
SCLK
SDIx
SDOx
SSx
SPI Slave
#2
SCLK
SDIx
SDOx
SSx
SPI Slave
#3
15.2.1 SPI MODE REGISTERS
15.2.2 SPI MODE OPERATION
The MSSPx module has five registers for SPI mode
operation. These are:
When initializing the SPI, several options need to be
specified. This is done by programming the appropriate
control bits (SSPxCON1<5:0> and SSPxSTAT<7:6>).
These control bits allow the following to be specified:
• MSSPx STATUS register (SSPxSTAT)
• MSSPx Control register 1 (SSPxCON1)
• MSSPx Control register 3 (SSPxCON3)
• MSSPx Data Buffer register (SSPxBUF)
• MSSPx Address register (SSPxADD)
• Master mode (SCKx is the clock output)
• Slave mode (SCKx is the clock input)
• Clock Polarity (Idle state of SCKx)
• Data Input Sample Phase (middle or end of data
output time)
• MSSPx Shift register (SSPxSR)
(Not directly accessible)
• Clock Edge (output data on rising/falling edge of
SCKx)
SSPxCON1 and SSPxSTAT are the control and
STATUS registers in SPI mode operation. The
SSPxCON1 register is readable and writable. The
lower 6 bits of the SSPxSTAT are read-only. The upper
two bits of the SSPxSTAT are read/write.
• Clock Rate (Master mode only)
• Slave Select mode (Slave mode only)
To enable the serial port, SSPx Enable bit, SSPxEN of
the SSPxCON1 register, must be set. To reset or recon-
figure SPI mode, clear the SSPxEN bit, re-initialize the
SSPxCONx registers and then set the SSPxEN bit.
This configures the SDIx, SDOx, SCKx and SSx pins
as serial port pins. For the pins to behave as the serial
port function, some must have their data direction bits
(in the TRIS register) appropriately programmed as fol-
lows:
In one SPI Master mode, SSPxADD can be loaded
with a value used in the Baud Rate Generator. More
information on the Baud Rate Generator is available in
Section 15.7 “Baud Rate Generator”.
SSPxSR is the shift register used for shifting data in
and out. SSPxBUF provides indirect access to the
SSPxSR register. SSPxBUF is the buffer register to
which data bytes are written, and from which data
bytes are read.
• SDIx must have corresponding TRIS bit set
• SDOx must have corresponding TRIS bit cleared
In receive operations, SSPxSR and SSPxBUF
together create a buffered receiver. When SSPxSR
receives a complete byte, it is transferred to SSPxBUF
and the SSPxIF interrupt is set.
• SCKx (Master mode) must have corresponding
TRIS bit cleared
• SCKx (Slave mode) must have corresponding
TRIS bit set
During transmission, the SSPxBUF is not buffered. A
write to SSPxBUF will write to both SSPxBUF and
SSPxSR.
• SSx must have corresponding TRIS bit set
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 213
PIC18(L)F2X/4XK22
Any serial port function that is not desired may be
overridden by programming the corresponding data
direction (TRIS) register to the opposite value.
set. User software must clear the WCOL bit to allow the
following write(s) to the SSPxBUF register to complete
successfully.
The MSSPx consists of a transmit/receive shift register
(SSPxSR) and a buffer register (SSPxBUF). The
SSPxSR shifts the data in and out of the device, MSb
first. The SSPxBUF holds the data that was written to
the SSPxSR until the received data is ready. Once the
8 bits of data have been received, that byte is moved to
the SSPxBUF register. Then, the Buffer Full Detect bit,
BF of the SSPxSTAT register, and the interrupt flag bit,
SSPxIF, are set. This double-buffering of the received
data (SSPxBUF) allows the next byte to start reception
before reading the data that was just received. Any
write to the SSPxBUF register during transmission/
reception of data will be ignored and the write collision
detect bit, WCOL of the SSPxCON1 register, will be
When the application software is expecting to receive
valid data, the SSPxBUF should be read before the
next byte of data to transfer is written to the SSPxBUF.
The Buffer Full bit, BF of the SSPxSTAT register,
indicates when SSPxBUF has been loaded with the
received data (transmission is complete). When the
SSPxBUF is read, the BF bit is cleared. This data may
be irrelevant if the SPI is only a transmitter. Generally,
the MSSPx interrupt is used to determine when the
transmission/reception has completed. If the interrupt
method is not going to be used, then software polling
can be done to ensure that a write collision does not
occur.
FIGURE 15-5:
SPI MASTER/SLAVE CONNECTION
SPI Master SSPxM<3:0> = 00xx
= 1010
SPI Slave SSPxM<3:0> = 010x
SDOx
SDIx
Serial Input Buffer
Serial Input Buffer
(SSPxBUF)
(BUF)
SDIx
SDOx
Shift Register
(SSPxSR)
Shift Register
(SSPxSR)
LSb
MSb
MSb
LSb
Serial Clock
SCKx
SCKx
SSx
Slave Select
(optional)
General I/O
Processor 2
Processor 1
DS41412A-page 214
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
The clock polarity is selected by appropriately
programming the CKP bit of the SSPxCON1 register
and the CKE bit of the SSPxSTAT register. This then,
would give waveforms for SPI communication as
shown in Figure 15-6, Figure 15-8 and Figure 15-9,
where the MSB is transmitted first. In Master mode, the
SPI clock rate (bit rate) is user programmable to be one
of the following:
15.2.3
SPI MASTER MODE
The master can initiate the data transfer at any time
because it controls the SCKx line. The master
determines when the slave (Processor 2, Figure 15-5)
is to broadcast data by the software protocol.
In Master mode, the data is transmitted/received as
soon as the SSPxBUF register is written to. If the SPI
is only going to receive, the SDOx output could be dis-
abled (programmed as an input). The SSPxSR register
will continue to shift in the signal present on the SDIx
pin at the programmed clock rate. As each byte is
received, it will be loaded into the SSPxBUF register as
if a normal received byte (interrupts and Status bits
appropriately set).
• FOSC/4 (or TCY)
• FOSC/16 (or 4 * TCY)
• FOSC/64 (or 16 * TCY)
• Timer2 output/2
• FOSC/(4 * (SSPxADD + 1))
Figure 15-6 shows the waveforms for Master mode.
When the CKE bit is set, the SDOx data is valid before
there is a clock edge on SCKx. The change of the input
sample is shown based on the state of the SMP bit. The
time when the SSPxBUF is loaded with the received
data is shown.
FIGURE 15-6:
SPI MODE WAVEFORM (MASTER MODE)
Write to
SSPxBUF
SCKx
(CKP = 0
CKE = 0)
SCKx
(CKP = 1
CKE = 0)
4 Clock
Modes
SCKx
(CKP = 0
CKE = 1)
SCKx
(CKP = 1
CKE = 1)
bit 6
bit 6
bit 2
bit 2
bit 5
bit 5
bit 4
bit 4
bit 1
bit 1
bit 0
bit 0
SDOx
(CKE = 0)
bit 7
bit 7
bit 3
bit 3
SDOx
(CKE = 1)
SDIx
(SMP = 0)
bit 0
bit 7
Input
Sample
(SMP = 0)
SDIx
(SMP = 1)
bit 0
bit 7
Input
Sample
(SMP = 1)
SSPxIF
SSPxSR to
SSPxBUF
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 215
PIC18(L)F2X/4XK22
15.2.4
SPI SLAVE MODE
15.2.5
SLAVE SELECT
SYNCHRONIZATION
In Slave mode, the data is transmitted and received as
external clock pulses appear on SCKx. When the last
bit is latched, the SSPxIF interrupt flag bit is set.
The Slave Select can also be used to synchronize
communication. The Slave Select line is held high until
the master device is ready to communicate. When the
Slave Select line is pulled low, the slave knows that a
new transmission is starting.
Before enabling the module in SPI Slave mode, the clock
line must match the proper Idle state. The clock line can
be observed by reading the SCKx pin. The Idle state is
determined by the CKP bit of the SSPxCON1 register.
If the slave fails to receive the communication properly,
it will be reset at the end of the transmission, when the
Slave Select line returns to a high state. The slave is
then ready to receive a new transmission when the
Slave Select line is pulled low again. If the Slave Select
line is not used, there is a risk that the slave will even-
tually become out of sync with the master. If the slave
misses a bit, it will always be one bit off in future trans-
missions. Use of the Slave Select line allows the slave
and master to align themselves at the beginning of
each transmission.
While in Slave mode, the external clock is supplied by
the external clock source on the SCKx pin. This exter-
nal clock must meet the minimum high and low times
as specified in the electrical specifications.
While in Sleep mode, the slave can transmit/receive
data. The shift register is clocked from the SCKx pin
input and when a byte is received, the device will gen-
erate an interrupt. If enabled, the device will wake-up
from Sleep.
15.2.4.1 Daisy-Chain Configuration
The SSx pin allows a Synchronous Slave mode. The
SPI must be in Slave mode with SSx pin control
enabled (SSPxCON1<3:0> = 0100).
The SPI bus can sometimes be connected in a daisy-
chain configuration. The first slave output is connected
to the second slave input, the second slave output is
connected to the third slave input, and so on. The final
slave output is connected to the master input. Each
slave sends out, during a second group of clock
pulses, an exact copy of what was received during the
first group of clock pulses. The whole chain acts as
one large communication shift register. The daisy-
chain feature only requires a single Slave Select line
from the master device.
When the SSx pin is low, transmission and reception
are enabled and the SDOx pin is driven.
When the SSx pin goes high, the SDOx pin is no longer
driven, even if in the middle of a transmitted byte and
becomes a floating output. External pull-up/pull-down
resistors may be desirable depending on the applica-
tion.
Note 1: When the SPI is in Slave mode with SSx
pin control enabled (SSPxCON1<3:0> =
0100), the SPI module will reset if the SSx
pin is set to VDD.
Figure 15-7 shows the block diagram of a typical
daisy-chain connection when operating in SPI Mode.
In a daisy-chain configuration, only the most recent
byte on the bus is required by the slave. Setting the
BOEN bit of the SSPxCON3 register will enable writes
to the SSPxBUF register, even if the previous byte has
not been read. This allows the software to ignore data
that may not apply to it.
2: When the SPI is used in Slave mode with
CKE set; the user must enable SSx pin
control.
3: While operated in SPI Slave mode the
SMP bit of the SSPxSTAT register must
remain clear.
When the SPI module resets, the bit counter is forced
to ‘0’. This can be done by either forcing the SSx pin to
a high level or clearing the SSPxEN bit.
DS41412A-page 216
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
FIGURE 15-7:
SPI DAISY-CHAIN CONNECTION
SCLK
SCLK
SPI Master
SDOx
SDIx
SDIx
SDOx
SSx
SPI Slave
#1
General I/O
SCLK
SDIx
SDOx
SSx
SPI Slave
#2
SCLK
SDIx
SDOx
SSx
SPI Slave
#3
FIGURE 15-8:
SLAVE SELECT SYNCHRONOUS WAVEFORM
SSx
SCKx
(CKP = 0
CKE = 0)
SCKx
(CKP = 1
CKE = 0)
Write to
SSPxBUF
Shift register SSPxSR
and bit count are reset
SSPxBUF to
SSPxSR
bit 6
bit 6
bit 7
bit 7
bit 0
SDOx
SDIx
bit 7
bit 0
bit 7
Input
Sample
SSPxIF
Interrupt
Flag
SSPxSR to
SSPxBUF
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 217
PIC18(L)F2X/4XK22
FIGURE 15-9:
SPI MODE WAVEFORM (SLAVE MODE WITH CKE = 0)
SSx
Optional
SCKx
(CKP = 0
CKE = 0)
SCKx
(CKP = 1
CKE = 0)
Write to
SSPxBUF
Valid
bit 6
bit 2
bit 5
bit 4
bit 3
bit 1
bit 0
SDOx
bit 7
SDIx
bit 0
bit 7
Input
Sample
SSPxIF
Interrupt
Flag
SSPxSR to
SSPxBUF
Write Collision
detection active
FIGURE 15-10:
SPI MODE WAVEFORM (SLAVE MODE WITH CKE = 1)
SSx
Not Optional
SCKx
(CKP = 0
CKE = 1)
SCKx
(CKP = 1
CKE = 1)
Write to
SSPxBUF
Valid
bit 6
bit 3
bit 2
bit 5
bit 4
bit 1
bit 0
SDOx
bit 7
bit 7
SDIx
bit 0
Input
Sample
SSPxIF
Interrupt
Flag
SSPxSR to
SSPxBUF
Write Collision
detection active
DS41412A-page 218
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
15.2.6 SPI OPERATION IN SLEEP MODE
In SPI Master mode, when the Sleep mode is selected,
all module clocks are halted and the transmission/
reception will remain in that state until the device
wakes. After the device returns to Run mode, the
module will resume transmitting and receiving data.
In SPI Master mode, module clocks may be operating
at a different speed than when in Full-Power mode; in
the case of the Sleep mode, all clocks are halted.
Special care must be taken by the user when the
MSSPx clock is much faster than the system clock.
In SPI Slave mode, the SPI Transmit/Receive Shift
register operates asynchronously to the device. This
allows the device to be placed in Sleep mode and data
to be shifted into the SPI Transmit/Receive Shift
register. When all 8 bits have been received, the
MSSPx interrupt flag bit will be set and if enabled, will
wake the device.
In Slave mode, when MSSPx interrupts are enabled,
after the master completes sending data, an MSSPx
interrupt will wake the controller from Sleep.
If an exit from Sleep mode is not desired, MSSPx
interrupts should be disabled.
TABLE 15-1: REGISTERS ASSOCIATED WITH SPI OPERATION
Register
on Page
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
ANSELA
ANSELB
ANSELC
ANSELD
INTCON
IPR1
ANSA5
ANSB5
ANSC5
ANSA3
ANSA2
ANSA1
ANSA0
153
154
154
154
115
127
129
123
125
118
120
57
—
—
—
(1)
(1)
(1)
(1)
ANSB4
ANSB3
ANSB2
ANSC2
ANSD2
TMR0IF
CCP1IP
ANSB1
ANSB0
—
—
ANSC7
ANSD7
ANSC6
ANSD6
ANSC4
ANSC3
—
—
ANSD0
RBIF
(2)
(2)
(2)
(2)
ANSD5 ANSD4
INT0IE
ANSD3
RBIE
ANSD1
GIE/GIEH PEIE/GIEL TMR0IE
INT0IF
ADIP
BCL2IP
ADIE
RC1IP
RC2IP
RC1IE
RC2IE
RC1IF
RC2IF
—
TX1IP
TX2IP
TX1IE
TX2IE
TX1IF
TX2IF
SSP1IP
TMR2IP
TMR1IP
—
SSP2IP
—
IPR3
CTMUIP TMR5GIP TMR3GIP TMR1GIP
SSP1IE CCP1IE TMR2IE TMR1IE
CTMUIE TMR5GIE TMR3GIE TMR1GIE
SSP1IF CCP1IF TMR2IF TMR1IF
CTMUIF TMR5GIF TMR3GIF TMR1GIF
PIE1
PIE3
SSP2IE
—
BCL2IE
ADIF
PIR1
PIR3
SSP2IF
BCL2IF
PMD1
MSSP2MD MSSP1MD
CCP5MD CCP4MD CCP3MD CCP2MD CCP1MD
SSP1BUF
SSP1CON1
SSP1CON3
SSP1STAT
SSP2BUF
SSP2CON1
SSP2CON3
SSP2STAT
TRISA
SSP1 Receive Buffer/Transmit Register
—
WCOL
ACKTIM
SMP
SSPOV
PCIE
SSPEN
SCIE
D/A
CKP
BOEN
P
SSPM<3:0>
258
261
257
—
SDAHT
S
SBCDE
R/W
AHEN
UA
DHEN
BF
CKE
SSP2 Receive Buffer/Transmit Register
WCOL
ACKTIM
SMP
SSPOV
PCIE
SSPEN
SCIE
CKP
BOEN
P
SSPM<3:0>
258
261
257
155
155
155
155
SDAHT
S
SBCDE
R/W
AHEN
UA
DHEN
BF
CKE
D/A
TRISA7
TRISB7
TRISC7
TRISD7
TRISA6
TRISB6
TRISC6
TRISD6
TRISA5
TRISB5
TRISC5
TRISA4
TRISA3
TRISA2
TRISA1
TRISA0
(1)
(1)
(1)
(1)
TRISB
TRISB4 TRISB3
TRISC4 TRISC3
TRISB2
TRISC2
TRISD2
TRISB1
TRISC1
TRISB0
TRISC0
TRISC
(2)
(2)
(2)
(2)
TRISD
TRISD5 TRISD4
TRISD3
TRISD1
TRISD0
Legend: Shaded bits are not used by the MSSPx in SPI mode.
Note 1: PIC18(L)F2XK22 devices.
2: PIC18(L)F4XK22 devices.
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 219
PIC18(L)F2X/4XK22
FIGURE 15-11:
I2C™ MASTER/
SLAVE CONNECTION
15.3 I2C MODE OVERVIEW
The Inter-Integrated Circuit Bus (I2C) is a multi-master
serial data communication bus. Devices communicate
in a master/slave environment where the master
devices initiate the communication. A slave device is
controlled through addressing.
VDD
SCLK
SCLK
The I2C bus specifies two signal connections:
VDD
• Serial Clock (SCLx)
• Serial Data (SDAx)
Master
Slave
SDIx
SDOx
Figure 15-11 shows the block diagram of the MSSPx
module when operating in I2C mode.
Both the SCLx and SDAx connections are bidirectional
open-drain lines, each requiring pull-up resistors for the
supply voltage. Pulling the line to ground is considered
a logical zero and letting the line float is considered a
logical one.
The Acknowledge bit (ACK) is an active-low signal,
which holds the SDAx line low to indicate to the
transmitter that the slave device has received the
transmitted data and is ready to receive more.
Figure 15-11 shows a typical connection between two
processors configured as master and slave devices.
The I2C bus can operate with one or more master
devices and one or more slave devices.
The transition of data bits is always performed while the
SCLx line is held low. Transitions that occur while the
SCLx line is held high are used to indicate Start and
Stop bits.
If the master intends to write to the slave, then it
repeatedly sends out a byte of data, with the slave
responding after each byte with an ACK bit. In this
example, the master device is in Master Transmit mode
and the slave is in Slave Receive mode.
There are four potential modes of operation for a given
device:
• Master Transmit mode
(master is transmitting data to a slave)
• Master Receive mode
If the master intends to read from the slave, then it
repeatedly receives a byte of data from the slave, and
responds after each byte with an ACK bit. In this
example, the master device is in Master Receive mode
and the slave is Slave Transmit mode.
(master is receiving data from a slave)
• Slave Transmit mode
(slave is transmitting data to a master)
• Slave Receive mode
(slave is receiving data from the master)
On the last byte of data communicated, the master
device may end the transmission by sending a Stop bit.
If the master device is in Receive mode, it sends the
Stop bit in place of the last ACK bit. A Stop bit is
indicated by a low-to-high transition of the SDAx line
while the SCLx line is held high.
To begin communication, a master device starts out in
Master Transmit mode. The master device sends out a
Start bit followed by the address byte of the slave it
intends to communicate with. This is followed by a sin-
gle Read/Write bit, which determines whether the mas-
ter intends to transmit to or receive data from the slave
device.
In some cases, the master may want to maintain con-
trol of the bus and re-initiate another transmission. If
so, the master device may send another Start bit in
place of the Stop bit or last ACK bit when it is in receive
mode.
If the requested slave exists on the bus, it will respond
with an Acknowledge bit, otherwise known as an ACK.
The master then continues in either Transmit mode or
Receive mode and the slave continues in the comple-
ment, either in Receive mode or Transmit mode,
respectively.
The I2C bus specifies three message protocols;
• Single message where a master writes data to a
slave.
A Start bit is indicated by a high-to-low transition of the
SDAx line while the SCLx line is held high. Address and
data bytes are sent out, Most Significant bit (MSb) first.
The Read/Write bit is sent out as a logical one when the
master intends to read data from the slave, and is sent
out as a logical zero when it intends to write data to the
slave.
• Single message where a master reads data from
a slave.
• Combined message where a master initiates a
minimum of two writes, or two reads, or a
combination of writes and reads, to one or more
slaves.
DS41412A-page 220
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
When one device is transmitting a logical one, or letting
the line float, and a second device is transmitting a
logical zero, or holding the line low, the first device can
detect that the line is not a logical one. This detection,
when used on the SCLx line, is called clock stretching.
Clock stretching give slave devices a mechanism to
control the flow of data. When this detection is used on
the SDAx line, it is called arbitration. Arbitration
ensures that there is only one master device
communicating at any single time.
15.3.2
ARBITRATION
Each master device must monitor the bus for Start and
Stop bits. If the device detects that the bus is busy, it
cannot begin a new message until the bus returns to an
Idle state.
However, two master devices may try to initiate a
transmission on or about the same time. When this
occurs, the process of arbitration begins. Each
transmitter checks the level of the SDAx data line and
compares it to the level that it expects to find. The first
transmitter to observe that the two levels don’t match,
loses arbitration, and must stop transmitting on the
SDAx line.
15.3.1
CLOCK STRETCHING
When a slave device has not completed processing
data, it can delay the transfer of more data through the
process of clock stretching. An addressed slave device
may hold the SCLx clock line low after receiving or
sending a bit, indicating that it is not yet ready to
continue. The master that is communicating with the
slave will attempt to raise the SCLx line in order to
transfer the next bit, but will detect that the clock line
has not yet been released. Because the SCLx
connection is open-drain, the slave has the ability to
hold that line low until it is ready to continue
communicating.
For example, if one transmitter holds the SDAx line to
a logical one (lets it float) and a second transmitter
holds it to a logical zero (pulls it low), the result is that
the SDAx line will be low. The first transmitter then
observes that the level of the line is different than
expected and concludes that another transmitter is
communicating.
The first transmitter to notice this difference is the one
that loses arbitration and must stop driving the SDAx
line. If this transmitter is also a master device, it also
must stop driving the SCLx line. It then can monitor the
lines for a Stop condition before trying to reissue its
transmission. In the meantime, the other device that
has not noticed any difference between the expected
and actual levels on the SDAx line continues with its
original transmission. It can do so without any compli-
cations, because so far, the transmission appears
exactly as expected with no other transmitter disturbing
the message.
Clock stretching allows receivers that cannot keep up
with a transmitter to control the flow of incoming data.
Slave Transmit mode can also be arbitrated, when a
master addresses multiple slaves, but this is less
common.
If two master devices are sending a message to two
different slave devices at the address stage, the master
sending the lower slave address always wins
arbitration. When two master devices send messages
to the same slave address, and addresses can
sometimes refer to multiple slaves, the arbitration
process must continue into the data stage.
Arbitration usually occurs very rarely, but it is a
necessary process for proper multi-master support.
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 221
PIC18(L)F2X/4XK22
TABLE 15-2: I2C™ BUS TERMS
15.4 I2C MODE OPERATION
TERM
Description
All MSSPx I2C communication is byte oriented and
shifted out MSb first. Six SFR registers and 2 interrupt
flags interface the module with the PIC® microcon-
troller and user software. Two pins, SDAx and SCLx,
are exercised by the module to communicate with
other external I2C devices.
Transmitter
The device which shifts data out
onto the bus.
Receiver
Master
The device which shifts data in
from the bus.
The device that initiates a transfer,
generates clock signals and termi-
nates a transfer.
15.4.1 BYTE FORMAT
All communication in I2C is done in 9-bit segments. A
byte is sent from a master to a slave or vice-versa,
followed by an Acknowledge bit sent back. After the
8th falling edge of the SCLx line, the device outputting
data on the SDAx changes that pin to an input and
reads in an acknowledge value on the next clock
pulse.
Slave
The device addressed by the mas-
ter.
Multi-master
Arbitration
A bus with more than one device
that can initiate data transfers.
Procedure to ensure that only one
master at a time controls the bus.
Winning arbitration ensures that
the message is not corrupted.
The clock signal, SCLx, is provided by the master.
Data is valid to change while the SCLx signal is low,
and sampled on the rising edge of the clock. Changes
on the SDAx line while the SCLx line is high define
special conditions on the bus, explained below.
Synchronization Procedure to synchronize the
clocks of two or more devices on
the bus.
Idle
No master is controlling the bus,
and both SDAx and SCLx lines are
high.
15.4.2 DEFINITION OF I2C TERMINOLOGY
There is language and terminology in the description
of I2C communication that have definitions specific to
I2C. That word usage is defined below and may be
used in the rest of this document without explana-
tion. This table was adapted from the Phillips I2C
specification.
Active
Any time one or more master
devices are controlling the bus.
Addressed
Slave
Slave device that has received a
matching address and is actively
being clocked by a master.
Matching
Address
Address byte that is clocked into a
slave that matches the value
stored in SSPxADD.
15.4.3 SDAx AND SCLx PINS
Selection of any I2C mode with the SSPxEN bit set,
forces the SCLx and SDAx pins to be open-drain.
These pins should be set by the user to inputs by
setting the appropriate TRIS bits.
Write Request
Read Request
Slave receives a matching
address with R/W bit clear, and is
ready to clock in data.
Master sends an address byte with
the R/W bit set, indicating that it
wishes to clock data out of the
Slave. This data is the next and all
following bytes until a Restart or
Stop.
Note: Data is tied to output zero when an I2C mode
is enabled.
15.4.4 SDAx HOLD TIME
The hold time of the SDAx pin is selected by the
SDAHT bit of the SSPxCON3 register. Hold time is the
time SDAx is held valid after the falling edge of SCLx.
Setting the SDAHT bit selects a longer 300 ns mini-
mum hold time and may help on buses with large
capacitance.
Clock Stretching When a device on the bus holds
SCLx low to stall communication.
Bus Collision
Any time the SDAx line is sampled
low by the module while it is out-
putting and expected high state.
DS41412A-page 222
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
15.4.5 START CONDITION
15.4.7 RESTART CONDITION
The I2C specification defines a Start condition as a
transition of SDAx from a high-to -low state while SCLx
line is high. A Start condition is always generated by
the master and signifies the transition of the bus from
an Idle to an active state. Figure 15-10 shows wave
forms for Start and Stop conditions.
A Restart is valid any time that a Stop would be valid.
A master can issue a Restart if it wishes to hold the
bus after terminating the current transfer. A Restart
has the same effect on the slave that a Start would,
resetting all slave logic and preparing it to clock in an
address. The master may want to address the same or
another slave.
A bus collision can occur on a Start condition if the
module samples the SDAx line low before asserting it
low. This does not conform to the I2C specification that
states no bus collision can occur on a Start.
In 10-bit Addressing Slave mode a Restart is required
for the master to clock data out of the addressed slave.
Once a slave has been fully addressed, matching both
high and low address bytes, the master can issue a
Restart and the high address byte with the R/W bit set.
The slave logic will then hold the clock and prepare to
clock out data.
15.4.6 STOP CONDITION
A Stop condition is a transition of the SDAx line from a
low-to-high state while the SCLx line is high.
After a full match with R/W clear in 10-bit mode, a prior
match flag is set and maintained. Until a Stop
condition, a high address with R/W clear, or high
address match fails.
Note: At least one SCLx low time must appear
before a Stop is valid, therefore, if the SDAx
line goes low then high again while the SCLx
line stays high, only the Start condition is
detected.
15.4.8 START/STOP CONDITION INTERRUPT
MASKING
The SCIE and PCIE bits of the SSPxCON3 register
can enable the generation of an interrupt in Slave
modes that do not typically support this function. Slave
modes where interrupt on Start and Stop detect are
already enabled, these bits will have no effect.
FIGURE 15-12:
I2C™ START AND STOP CONDITIONS
SDAx
SCLx
S
P
Change of
Change of
Data Allowed
Data Allowed
Stop
Start
Condition
Condition
FIGURE 15-13:
I2C™ RESTART CONDITION
Sr
Change of
Change of
Data Allowed
Data Allowed
Restart
Condition
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 223
PIC18(L)F2X/4XK22
15.5 I2C SLAVE MODE OPERATION
15.4.9 ACKNOWLEDGE SEQUENCE
The 9th SCLx pulse for any transferred byte in I2C is
dedicated as an Acknowledge. It allows receiving
devices to respond back to the transmitter by pulling
the SDAx line low. The transmitter must release con-
trol of the line during this time to shift in the response.
The Acknowledge (ACK) is an active-low signal, pull-
ing the SDAx line low indicated to the transmitter that
the device has received the transmitted data and is
ready to receive more.
The MSSPx Slave mode operates in one of four
modes selected in the SSPxM bits of SSPxCON1
register. The modes can be divided into 7-bit and 10-bit
Addressing mode. 10-bit Addressing modes operate
the same as 7-bit with some additional overhead for
handling the larger addresses.
Modes with Start and Stop bit interrupts operated the
same as the other modes with SSPxIF additionally
getting set upon detection of a Start, Restart, or Stop
condition.
The result of an ACK is placed in the ACKSTAT bit of
the SSPxCON2 register.
15.5.1 SLAVE MODE ADDRESSES
Slave software, when the AHEN and DHEN bits are
set, allow the user to set the ACK value sent back to
the transmitter. The ACKDT bit of the SSPxCON2
register is set/cleared to determine the response.
The SSPxADD register (Register 15-6) contains the
Slave mode address. The first byte received after a
Start or Restart condition is compared against the
value stored in this register. If the byte matches, the
value is loaded into the SSPxBUF register and an
interrupt is generated. If the value does not match, the
module goes Idle and no indication is given to the
software that anything happened.
Slave hardware will generate an ACK response if the
AHEN and DHEN bits of the SSPxCON3 register are
clear.
There are certain conditions where an ACK will not be
sent by the slave. If the BF bit of the SSPxSTAT
register or the SSPxOV bit of the SSPxCON1 register
are set when a byte is received.
The SSPx Mask register (Register 15-5) affects the
address matching process. See Section 15.5.9
“SSPx Mask Register” for more information.
When the module is addressed, after the 8th falling
edge of SCLx on the bus, the ACKTIM bit of the
SSPxCON3 register is set. The ACKTIM bit indicates
the acknowledge time of the active bus.
15.5.1.1 I2C Slave 7-bit Addressing Mode
In 7-bit Addressing mode, the LSb of the received data
byte is ignored when determining if there is an address
match.
The ACKTIM Status bit is only active when the AHEN
bit or DHEN bit is enabled.
15.5.1.2 I2C Slave 10-bit Addressing Mode
In 10-bit Addressing mode, the first received byte is
compared to the binary value of ‘1 1 1 1 0 A9 A8 0’. A9
and A8 are the two MSb of the 10-bit address and
stored in bits 2 and 1 of the SSPxADD register.
After the acknowledge of the high byte the UA bit is set
and SCLx is held low until the user updates SSPxADD
with the low address. The low address byte is clocked
in and all 8 bits are compared to the low address value
in SSPxADD. Even if there is not an address match;
SSPxIF and UA are set, and SCLx is held low until
SSPxADD is updated to receive a high byte again.
When SSPxADD is updated the UA bit is cleared. This
ensures the module is ready to receive the high
address byte on the next communication.
A high and low address match as a write request is
required at the start of all 10-bit addressing
communication. A transmission can be initiated by
issuing a Restart once the slave is addressed, and
clocking in the high address with the R/W bit set. The
slave hardware will then acknowledge the read
request and prepare to clock out data. This is only
valid for a slave after it has received a complete high
and low address byte match.
DS41412A-page 224
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
15.5.2 SLAVE RECEPTION
15.5.2.2 7-bit Reception with AHEN and DHEN
When the R/W bit of a matching received address byte
is clear, the R/W bit of the SSPxSTAT register is
cleared. The received address is loaded into the
SSPxBUF register and acknowledged.
Slave device reception with AHEN and DHEN set
operate the same as without these options with extra
interrupts and clock stretching added after the 8th fall-
ing edge of SCLx. These additional interrupts allow the
slave software to decide whether it wants to ACK the
receive address or data byte, rather than the hard-
ware. This functionality adds support for PMBus™ that
was not present on previous versions of this module.
When the overflow condition exists for a received
address, then not Acknowledge is given. An overflow
condition is defined as either bit BF of the SSPxSTAT
register is set, or bit SSPxOV of the SSPxCON1 regis-
ter is set. The BOEN bit of the SSPxCON3 register
modifies this operation. For more information see
Register 15-4.
This list describes the steps that need to be taken by
slave software to use these options for I2C
communication. Figure 15-15 displays a module using
both address and data holding. Figure 15-16 includes
the operation with the SEN bit of the SSPxCON2
register set.
An MSSPx interrupt is generated for each transferred
data byte. Flag bit, SSPxIF, must be cleared by
software.
1. S bit of SSPxSTAT is set; SSPxIF is set if
interrupt on Start detect is enabled.
When the SEN bit of the SSPxCON2 register is set,
SCLx will be held low (clock stretch) following each
received byte. The clock must be released by setting
the CKP bit of the SSPxCON1 register, except
sometimes in 10-bit mode. See Section 15.2.3 “SPI
Master Mode” for more detail.
2. Matching address with R/W bit clear is clocked
in. SSPxIF is set and CKP cleared after the 8th
falling edge of SCLx.
3. Slave clears the SSPxIF.
4. Slave can look at the ACKTIM bit of the
SSPxCON3 register to determine if the SSPxIF
was after or before the ACK.
15.5.2.1 7-bit Addressing Reception
This section describes a standard sequence of events
for the MSSPx module configured as an I2C slave in
7-bit Addressing mode. All decisions made by hard-
ware or software and their effect on reception.
Figure 15-13 and Figure 15-14 is used as a visual
reference for this description.
5. Slave reads the address value from SSPxBUF,
clearing the BF flag.
6. Slave sets ACK value clocked out to the master
by setting ACKDT.
7. Slave releases the clock by setting CKP.
This is a step by step process of what typically must
be done to accomplish I2C communication.
8. SSPxIF is set after an ACK, not after a NACK.
9. If SEN = 1 the slave hardware will stretch the
1. Start bit detected.
clock after the ACK.
2. S bit of SSPxSTAT is set; SSPxIF is set if
interrupt on Start detect is enabled.
10. Slave clears SSPxIF.
Note: SSPxIF is still set after the 9th falling edge of
SCLx even if there is no clock stretching and
BF has been cleared. Only if NACK is sent to
master is SSPxIF not set.
3. Matching address with R/W bit clear is received.
4. The slave pulls SDAx low sending an ACK to the
master, and sets SSPxIF bit.
5. Software clears the SSPxIF bit.
11. SSPxIF set and CKP cleared after 8th falling
edge of SCLx for a received data byte.
6. Software reads received address from
SSPxBUF clearing the BF flag.
12. Slave looks at ACKTIM bit of SSPxCON3 to
determine the source of the interrupt.
7. If SEN = 1; Slave software sets CKP bit to
release the SCLx line.
13. Slave reads the received data from SSPxBUF
clearing BF.
8. The master clocks out a data byte.
9. Slave drives SDAx low sending an ACK to the
master, and sets SSPxIF bit.
14. Steps 7-14 are the same for each received data
byte.
10. Software clears SSPxIF.
15. Communication is ended by either the slave
sending an ACK = 1, or the master sending a
Stop condition. If a Stop is sent and Interrupt on
Stop detect is disabled, the slave will only know
by polling the P bit of the SSTSTAT register.
11. Software reads the received byte from
SSPxBUF clearing BF.
12. Steps 8-12 are repeated for all received bytes
from the master.
13. Master sends Stop condition, setting P bit of
SSPxSTAT, and the bus goes Idle.
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 225
PIC18(L)F2X/4XK22
FIGURE 15-14:
I2C SLAVE, 7-BIT ADDRESS, RECEPTION (SEN = 0, AHEN = 0, DHEN = 0)
DS41412A-page 226
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
FIGURE 15-15:
I2C SLAVE, 7-BIT ADDRESS, RECEPTION (SEN = 1, AHEN = 0, DHEN = 0)
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 227
PIC18(L)F2X/4XK22
FIGURE 15-16:
I2C SLAVE, 7-BIT ADDRESS, RECEPTION (SEN = 0, AHEN = 1, DHEN = 1)
DS41412A-page 228
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
FIGURE 15-17:
I2C SLAVE, 7-BIT ADDRESS, RECEPTION (SEN = 1, AHEN = 1, DHEN = 1)
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 229
PIC18(L)F2X/4XK22
15.5.3
SLAVE TRANSMISSION
15.5.3.2
7-bit Transmission
When the R/W bit of the incoming address byte is set
and an address match occurs, the R/W bit of the
SSPxSTAT register is set. The received address is
loaded into the SSPxBUF register, and an ACK pulse is
sent by the slave on the ninth bit.
A master device can transmit a read request to a
slave, and then clock data out of the slave. The list
below outlines what software for a slave will need to do
to accomplish a standard transmission. Figure 15-17
can be used as a reference to this list.
Following the ACK, slave hardware clears the CKP bit
and the SCLx pin is held low (see Section 15.5.6
“Clock Stretching” for more detail). By stretching the
clock, the master will be unable to assert another clock
pulse until the slave is done preparing the transmit
data.
1. Master sends a Start condition on SDAx and
SCLx.
2. S bit of SSPxSTAT is set; SSPxIF is set if inter-
rupt on Start detect is enabled.
3. Matching address with R/W bit set is received by
the slave setting SSPxIF bit.
The transmit data must be loaded into the SSPxBUF
register which also loads the SSPxSR register. Then
the SCLx pin should be released by setting the CKP bit
of the SSPxCON1 register. The eight data bits are
shifted out on the falling edge of the SCLx input. This
ensures that the SDAx signal is valid during the SCLx
high time.
4. Slave hardware generates an ACK and sets
SSPxIF.
5. SSPxIF bit is cleared by user.
6. Software reads the received address from
SSPxBUF, clearing BF.
7. R/W is set so CKP was automatically cleared
after the ACK.
The ACK pulse from the master-receiver is latched on
the rising edge of the ninth SCLx input pulse. This ACK
value is copied to the ACKSTAT bit of the SSPxCON2
register. If ACKSTAT is set (not ACK), then the data
transfer is complete. In this case, when the not ACK is
latched by the slave, the slave goes Idle and waits for
another occurrence of the Start bit. If the SDAx line was
low (ACK), the next transmit data must be loaded into
the SSPxBUF register. Again, the SCLx pin must be
released by setting bit CKP.
8. The slave software loads the transmit data into
SSPxBUF.
9. CKP bit is set releasing SCLx, allowing the mas-
ter to clock the data out of the slave.
10. SSPxIF is set after the ACK response from the
master is loaded into the ACKSTAT register.
11. SSPxIF bit is cleared.
12. The slave software checks the ACKSTAT bit to
see if the master wants to clock out more data.
An MSSPx interrupt is generated for each data transfer
byte. The SSPxIF bit must be cleared by software and
the SSPxSTAT register is used to determine the status
of the byte. The SSPxIF bit is set on the falling edge of
the ninth clock pulse.
Note 1: If the master ACKs the clock will be
stretched.
2: ACKSTAT is the only bit updated on the
rising edge of SCLx (9th) rather than the
falling.
15.5.3.1
Slave Mode Bus Collision
13. Steps 9-13 are repeated for each transmitted
byte.
A slave receives a Read request and begins shifting
data out on the SDAx line. If a bus collision is detected
and the SBCDE bit of the SSPxCON3 register is set,
the BCLxIF bit of the PIRx register is set. Once a bus
collision is detected, the slave goes Idle and waits to be
addressed again. User software can use the BCLxIF bit
to handle a slave bus collision.
14. If the master sends a not ACK; the clock is not
held, but SSPxIF is still set.
15. The master sends a Restart condition or a Stop.
16. The slave is no longer addressed.
DS41412A-page 230
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
FIGURE 15-18:
I2C SLAVE, 7-BIT ADDRESS, TRANSMISSION (AHEN = 0)
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 231
PIC18(L)F2X/4XK22
15.5.3.3
7-bit Transmission with Address
Hold Enabled
Setting the AHEN bit of the SSPxCON3 register
enables additional clock stretching and interrupt
generation after the 8th falling edge of a received
matching address. Once a matching address has
been clocked in, CKP is cleared and the SSPxIF
interrupt is set.
Figure 15-18 displays a standard waveform of a 7-bit
Address Slave Transmission with AHEN enabled.
1. Bus starts Idle.
2. Master sends Start condition; the S bit of
SSPxSTAT is set; SSPxIF is set if interrupt on
Start detect is enabled.
3. Master sends matching address with R/W bit
set. After the 8th falling edge of the SCLx line the
CKP bit is cleared and SSPxIF interrupt is
generated.
4. Slave software clears SSPxIF.
5. Slave software reads ACKTIM bit of SSPxCON3
register, and R/W and D/A of the SSPxSTAT
register to determine the source of the interrupt.
6. Slave reads the address value from the SSPxBUF
register clearing the BF bit.
7. Slave software decides from this information if it
wishes to ACK or not ACK and sets ACKDT bit
of the SSPxCON2 register accordingly.
8. Slave sets the CKP bit releasing SCLx.
9. Master clocks in the ACK value from the slave.
10. Slave hardware automatically clears the CKP bit
and sets SSPxIF after the ACK if the R/W bit is
set.
11. Slave software clears SSPxIF.
12. Slave loads value to transmit to the master into
SSPxBUF setting the BF bit.
Note: SSPxBUF cannot be loaded until after the
ACK.
13. Slave sets CKP bit releasing the clock.
14. Master clocks out the data from the slave and
sends an ACK value on the 9th SCLx pulse.
15. Slave hardware copies the ACK value into the
ACKSTAT bit of the SSPxCON2 register.
16. Steps 10-15 are repeated for each byte
transmitted to the master from the slave.
17. If the master sends a not ACK the slave
releases the bus allowing the master to send a
Stop and end the communication.
Note: Master must send a not ACK on the last byte
to ensure that the slave releases the SCLx
line to receive a Stop.
DS41412A-page 232
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
FIGURE 15-19:
I2C SLAVE, 7-BIT ADDRESS, TRANSMISSION (AHEN = 1)
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 233
PIC18(L)F2X/4XK22
15.5.4 SLAVE MODE 10-BIT ADDRESS
RECEPTION
15.5.5 10-BIT ADDRESSING WITH ADDRESS OR
DATA HOLD
This section describes a standard sequence of events
for the MSSPx module configured as an I2C slave in
10-bit Addressing mode.
Reception using 10-bit addressing with AHEN or
DHEN set is the same as with 7-bit modes. The only
difference is the need to update the SSPxADD register
using the UA bit. All functionality, specifically when the
CKP bit is cleared and SCLx line is held low are the
same. Figure 15-20 can be used as a reference of a
slave in 10-bit addressing with AHEN set.
Figure 15-19 and is used as a visual reference for this
description.
This is a step by step process of what must be done by
slave software to accomplish I2C communication.
Figure 15-21 shows a standard waveform for a slave
transmitter in 10-bit Addressing mode.
1. Bus starts Idle.
2. Master sends Start condition; S bit of SSPxSTAT
is set; SSPxIF is set if interrupt on Start detect is
enabled.
3. Master sends matching high address with R/W
bit clear; UA bit of the SSPxSTAT register is set.
4. Slave sends ACK and SSPxIF is set.
5. Software clears the SSPxIF bit.
6. Software reads received address from SSPxBUF
clearing the BF flag.
7. Slave loads low address into SSPxADD,
releasing SCLx.
8. Master sends matching low address byte to the
slave; UA bit is set.
Note: Updates to the SSPxADD register are not
allowed until after the ACK sequence.
9. Slave sends ACK and SSPxIF is set.
Note: If the low address does not match, SSPxIF
and UA are still set so that the slave software
can set SSPxADD back to the high address.
BF is not set because there is no match.
CKP is unaffected.
10. Slave clears SSPxIF.
11. Slave reads the received matching address
from SSPxBUF clearing BF.
12. Slave loads high address into SSPxADD.
13. Master clocks a data byte to the slave and clocks
out the slaves ACK on the 9th SCLx pulse;
SSPxIF is set.
14. If SEN bit of SSPxCON2 is set, CKP is cleared
by hardware and the clock is stretched.
15. Slave clears SSPxIF.
16. Slave reads the received byte from SSPxBUF
clearing BF.
17. If SEN is set the slave sets CKP to release the
SCLx.
18. Steps 13-17 repeat for each received byte.
19. Master sends Stop to end the transmission.
DS41412A-page 234
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
FIGURE 15-20:
I2C SLAVE, 10-BIT ADDRESS, RECEPTION (SEN = 1, AHEN = 0, DHEN = 0)
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 235
PIC18(L)F2X/4XK22
FIGURE 15-21:
I2C SLAVE, 10-BIT ADDRESS, RECEPTION (SEN = 0, AHEN = 1, DHEN = 0)
DS41412A-page 236
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
FIGURE 15-22:
I2C SLAVE, 10-BIT ADDRESS, TRANSMISSION (SEN = 0, AHEN = 0, DHEN = 0)
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 237
PIC18(L)F2X/4XK22
15.5.6 CLOCK STRETCHING
15.5.6.2 10-bit Addressing Mode
Clock stretching occurs when a device on the bus
holds the SCLx line low effectively pausing communi-
cation. The slave may stretch the clock to allow more
time to handle data or prepare a response for the mas-
ter device. A master device is not concerned with
stretching as anytime it is active on the bus and not
transferring data it is stretching. Any stretching done
by a slave is invisible to the master software and han-
dled by the hardware that generates SCLx.
In 10-bit Addressing mode, when the UA bit is set, the
clock is always stretched. This is the only time the
SCLx is stretched without CKP being cleared. SCLx is
released immediately after a write to SSPxADD.
Note: Previous versions of the module did not
stretch the clock if the second address byte
did not match.
15.5.6.3 Byte NACKing
The CKP bit of the SSPxCON1 register is used to
control stretching in software. Any time the CKP bit is
cleared, the module will wait for the SCLx line to go
low and then hold it. Setting CKP will release SCLx
and allow more communication.
When the AHEN bit of SSPxCON3 is set; CKP is
cleared by hardware after the 8th falling edge of SCLx
for a received matching address byte. When the
DHEN bit of SSPxCON3 is set; CKP is cleared after
the 8th falling edge of SCLx for received data.
15.5.6.1 Normal Clock Stretching
Stretching after the 8th falling edge of SCLx allows the
slave to look at the received address or data and
decide if it wants to ACK the received data.
Following an ACK if the R/W bit of SSPxSTAT is set, a
read request, the slave hardware will clear CKP. This
allows the slave time to update SSPxBUF with data to
transfer to the master. If the SEN bit of SSPxCON2 is
set, the slave hardware will always stretch the clock
after the ACK sequence. Once the slave is ready; CKP
is set by software and communication resumes.
15.5.7 CLOCK SYNCHRONIZATION AND
THE CKP BIT
Any time the CKP bit is cleared, the module will wait
for the SCLx line to go low and then hold it. However,
clearing the CKP bit will not assert the SCLx output
low until the SCLx output is already sampled low.
Therefore, the CKP bit will not assert the SCLx line
until an external I2C master device has already
asserted the SCLx line. The SCLx output will remain
low until the CKP bit is set and all other devices on the
I2C bus have released SCLx. This ensures that a write
to the CKP bit will not violate the minimum high time
requirement for SCLx (see Figure 15-22).
Note 1: The BF bit has no effect on whether the
clock will be stretched or not. This is
different than previous versions of the
module that would not stretch the clock,
clear CKP, if SSPxBUF was read before
the 9th falling edge of SCLx.
2: Previous versions of the module did not
stretch the clock for a transmission if
SSPxBUF was loaded before the 9th fall-
ing edge of SCLx. It is now always cleared
for read requests.
FIGURE 15-23:
CLOCK SYNCHRONIZATION TIMING
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
SDAx
SCLx
DX
DX ‚ – 1
Master device
asserts clock
CKP
Master device
releases clock
WR
SSPxCON1
DS41412A-page 238
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
15.5.8 GENERAL CALL ADDRESS SUPPORT
In 10-bit Address mode, the UA bit will not be set on
the reception of the general call address. The slave
will prepare to receive the second byte as data, just as
it would in 7-bit mode.
The addressing procedure for the I2C bus is such that
the first byte after the Start condition usually
determines which device will be the slave addressed
by the master device. The exception is the general call
address which can address all devices. When this
address is used, all devices should, in theory, respond
with an acknowledge.
If the AHEN bit of the SSPxCON3 register is set, just
as with any other address reception, the slave
hardware will stretch the clock after the 8th falling
edge of SCLx. The slave must then set its ACKDT
value and release the clock with communication
progressing as it would normally.
The general call address is a reserved address in the
I2C protocol, defined as address 0x00. When the
GCEN bit of the SSPxCON2 register is set, the slave
module will automatically ACK the reception of this
address regardless of the value stored in SSPxADD.
After the slave clocks in an address of all zeros with the
R/W bit clear, an interrupt is generated and slave soft-
ware can read SSPxBUF and respond. Figure 15-23
shows a general call reception sequence.
FIGURE 15-24:
SLAVE MODE GENERAL CALL ADDRESS SEQUENCE
Address is compared to General Call Address
after ACK, set interrupt
Receiving Data
D5 D4 D3 D2 D1
ACK
R/W = 0
ACK
General Call Address
SDAx
SCLx
D7 D6
D0
8
1
2
3
4
5
6
7
8
9
1
2
3
4
5
6
7
9
S
SSPxIF
BF (SSPxSTAT<0>)
Cleared by software
SSPxBUF is read
GCEN (SSPxCON2<7>)
’1’
15.5.9 SSPx MASK REGISTER
An SSPx Mask (SSPxMSK) register (Register 15-5) is
available in I2C Slave mode as a mask for the value
held in the SSPxSR register during an address
comparison operation. A zero (‘0’) bit in the SSPxMSK
register has the effect of making the corresponding bit
of the received address a “don’t care”.
This register is reset to all ‘1’s upon any Reset
condition and, therefore, has no effect on standard
SSPx operation until written with a mask value.
The SSPx Mask register is active during:
• 7-bit Address mode: address compare of A<7:1>.
• 10-bit Address mode: address compare of A<7:0>
only. The SSPx mask has no effect during the
reception of the first (high) byte of the address.
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 239
PIC18(L)F2X/4XK22
15.6.1 I2C MASTER MODE OPERATION
2
15.6 I C MASTER MODE
The master device generates all of the serial clock
pulses and the Start and Stop conditions. A transfer is
ended with a Stop condition or with a Repeated Start
condition. Since the Repeated Start condition is also
the beginning of the next serial transfer, the I2C bus will
not be released.
Master mode is enabled by setting and clearing the
appropriate SSPxM bits in the SSPxCON1 register and
by setting the SSPxEN bit. In Master mode, the SCLx
and SDAx lines are set as inputs and are manipulated
by the MSSPx hardware.
Master mode of operation is supported by interrupt
generation on the detection of the Start and Stop con-
ditions. The Stop (P) and Start (S) bits are cleared from
a Reset or when the MSSPx module is disabled. Con-
trol of the I2C bus may be taken when the P bit is set,
or the bus is Idle.
In Master Transmitter mode, serial data is output
through SDAx, while SCLx outputs the serial clock. The
first byte transmitted contains the slave address of the
receiving device (7 bits) and the Read/Write (R/W) bit.
In this case, the R/W bit will be logic ‘0’. Serial data is
transmitted 8 bits at a time. After each byte is transmit-
ted, an Acknowledge bit is received. Start and Stop
conditions are output to indicate the beginning and the
end of a serial transfer.
In Firmware Controlled Master mode, user code
conducts all I2C bus operations based on Start and
Stop bit condition detection. Start and Stop condition
detection is the only active circuitry in this mode. All
other communication is done by the user software
directly manipulating the SDAx and SCLx lines.
In Master Receive mode, the first byte transmitted con-
tains the slave address of the transmitting device
(7 bits) and the R/W bit. In this case, the R/W bit will be
logic ‘1’. Thus, the first byte transmitted is a 7-bit slave
address followed by a ‘1’ to indicate the receive bit.
Serial data is received via SDAx, while SCLx outputs
the serial clock. Serial data is received 8 bits at a time.
After each byte is received, an Acknowledge bit is
transmitted. Start and Stop conditions indicate the
beginning and end of transmission.
The following events will cause the SSPx Interrupt Flag
bit, SSPxIF, to be set (SSPx interrupt, if enabled):
• Start condition detected
• Stop condition detected
• Data transfer byte transmitted/received
• Acknowledge transmitted/received
• Repeated Start generated
A Baud Rate Generator is used to set the clock
frequency output on SCLx. See Section 15.7 “Baud
Rate Generator” for more detail.
Note 1: The MSSPx module, when configured in
I2C Master mode, does not allow queue-
ing of events. For instance, the user is not
allowed to initiate a Start condition and
immediately write the SSPxBUF register
to initiate transmission before the Start
condition is complete. In this case, the
SSPxBUF will not be written to and the
WCOL bit will be set, indicating that a write
to the SSPxBUF did not occur
2: When in Master mode, Start/Stop
detection is masked and an interrupt is
generated when the SEN/PEN bit is
cleared and the generation is complete.
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15.6.2 CLOCK ARBITRATION
Clock arbitration occurs when the master, during any
receive, transmit or Repeated Start/Stop condition,
releases the SCLx pin (SCLx allowed to float high).
When the SCLx pin is allowed to float high, the Baud
Rate Generator (BRG) is suspended from counting
until the SCLx pin is actually sampled high. When the
SCLx pin is sampled high, the Baud Rate Generator is
reloaded with the contents of SSPxADD<7:0> and
begins counting. This ensures that the SCLx high time
will always be at least one BRG rollover count in the
event that the clock is held low by an external device
(Figure 15-25).
FIGURE 15-25:
BAUD RATE GENERATOR TIMING WITH CLOCK ARBITRATION
SDAx
DX
DX ‚ – 1
SCLx deasserted but slave holds
SCLx low (clock arbitration)
SCLx allowed to transition high
SCLx
BRG decrements on
Q2 and Q4 cycles
BRG
Value
03h
02h
01h
00h (hold off)
03h
02h
SCLx is sampled high, reload takes
place and BRG starts its count
BRG
Reload
15.6.3 WCOL STATUS FLAG
If the user writes the SSPxBUF when a Start, Restart,
Stop, Receive or Transmit sequence is in progress, the
WCOL is set and the contents of the buffer are
unchanged (the write does not occur). Any time the
WCOL bit is set it indicates that an action on SSPxBUF
was attempted while the module was not Idle.
Note:
Because queueing of events is not
allowed, writing to the lower 5 bits of
SSPxCON2 is disabled until the Start
condition is complete.
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15.6.4 I C MASTER MODE START
by hardware; the Baud Rate Generator is suspended,
leaving the SDAx line held low and the Start condition
is complete.
CONDITION TIMING
To initiate a Start condition, the user sets the Start
Enable bit, SEN, of the SSPxCON2 register. If the
SDAx and SCLx pins are sampled high, the Baud Rate
Generator is reloaded with the contents of
SSPxADD<7:0> and starts its count. If SCLx and
SDAx are both sampled high when the Baud Rate
Generator times out (TBRG), the SDAx pin is driven
low. The action of the SDAx being driven low while
SCLx is high is the Start condition and causes the S bit
of the SSPxSTAT1 register to be set. Following this,
the Baud Rate Generator is reloaded with the contents
of SSPxADD<7:0> and resumes its count. When the
Baud Rate Generator times out (TBRG), the SEN bit of
the SSPxCON2 register will be automatically cleared
Note 1: If at the beginning of the Start condition,
the SDAx and SCLx pins are already sam-
pled low, or if during the Start condition,
the SCLx line is sampled low before the
SDAx line is driven low, a bus collision
occurs, the Bus Collision Interrupt Flag,
BCLxIF, is set, the Start condition is
aborted and the I2C module is reset into its
Idle state.
2: The Philips I2C Specification states that a
bus collision cannot occur on a Start.
FIGURE 15-26:
FIRST START BIT TIMING
Set S bit (SSPxSTAT<3>)
Write to SEN bit occurs here
At completion of Start bit,
hardware clears SEN bit
and sets SSPxIF bit
SDAx = 1,
SCLx = 1
TBRG
TBRG
Write to SSPxBUF occurs here
SDAx
2nd bit
1st bit
TBRG
SCLx
S
TBRG
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15.6.5 I C MASTER MODE REPEATED
SSPxCON2 register will be automatically cleared and
the Baud Rate Generator will not be reloaded, leaving
the SDAx pin held low. As soon as a Start condition is
detected on the SDAx and SCLx pins, the S bit of the
SSPxSTAT register will be set. The SSPxIF bit will not
be set until the Baud Rate Generator has timed out.
START CONDITION TIMING
A Repeated Start condition occurs when the RSEN bit
of the SSPxCON2 register is programmed high and the
master state machine is no longer active. When the
RSEN bit is set, the SCLx pin is asserted low. When the
SCLx pin is sampled low, the Baud Rate Generator is
loaded and begins counting. The SDAx pin is released
(brought high) for one Baud Rate Generator count
(TBRG). When the Baud Rate Generator times out, if
SDAx is sampled high, the SCLx pin will be deasserted
(brought high). When SCLx is sampled high, the Baud
Rate Generator is reloaded and begins counting. SDAx
and SCLx must be sampled high for one TBRG. This
action is then followed by assertion of the SDAx pin
(SDAx = 0) for one TBRG while SCLx is high. SCLx is
asserted low. Following this, the RSEN bit of the
Note 1: If RSEN is programmed while any other
event is in progress, it will not take effect.
2: A bus collision during the Repeated Start
condition occurs if:
• SDAx is sampled low when SCLx
goes from low-to-high.
• SCLx goes low before SDAx is
asserted low. This may indicate that
another master is attempting to
transmit a data ‘1’.
FIGURE 15-27:
REPEAT START CONDITION WAVEFORM
S bit set by hardware
Write to SSPxCON2
occurs here
SDAx = 1,
At completion of Start bit,
hardware clears RSEN bit
and sets SSPxIF
SDAx = 1,
SCLx = 1
SCLx (no change)
TBRG
TBRG
TBRG
1st bit
SDAx
SCLx
Write to SSPxBUF occurs here
TBRG
Sr
Repeated Start
TBRG
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15.6.6 I2C MASTER MODE TRANSMISSION
15.6.6.3
ACKSTAT Status Flag
In Transmit mode, the ACKSTAT bit of the SSPxCON2
register is cleared when the slave has sent an
Acknowledge (ACK = 0) and is set when the slave
does not Acknowledge (ACK = 1). A slave sends an
Acknowledge when it has recognized its address
(including a general call), or when the slave has
properly received its data.
Transmission of a data byte, a 7-bit address or the
other half of a 10-bit address is accomplished by simply
writing a value to the SSPxBUF register. This action will
set the Buffer Full flag bit, BF, and allow the Baud Rate
Generator to begin counting and start the next trans-
mission. Each bit of address/data will be shifted out
onto the SDAx pin after the falling edge of SCLx is
asserted. SCLx is held low for one Baud Rate Genera-
tor rollover count (TBRG). Data should be valid before
SCLx is released high. When the SCLx pin is released
high, it is held that way for TBRG. The data on the SDAx
pin must remain stable for that duration and some hold
time after the next falling edge of SCLx. After the eighth
bit is shifted out (the falling edge of the eighth clock),
the BF flag is cleared and the master releases SDAx.
This allows the slave device being addressed to
respond with an ACK bit during the ninth bit time if an
address match occurred, or if data was received prop-
erly. The status of ACK is written into the ACKSTAT bit
on the rising edge of the ninth clock. If the master
receives an Acknowledge, the Acknowledge Status bit,
ACKSTAT, is cleared. If not, the bit is set. After the ninth
clock, the SSPxIF bit is set and the master clock (Baud
Rate Generator) is suspended until the next data byte
is loaded into the SSPxBUF, leaving SCLx low and
SDAx unchanged (Figure 15-27).
15.6.6.4 Typical Transmit Sequence:
1. The user generates a Start condition by setting
the SEN bit of the SSPxCON2 register.
2. SSPxIF is set by hardware on completion of the
Start.
3. SSPxIF is cleared by software.
4. The MSSPx module will wait the required start
time before any other operation takes place.
5. The user loads the SSPxBUF with the slave
address to transmit.
6. Address is shifted out the SDAx pin until all 8 bits
are transmitted. Transmission begins as soon
as SSPxBUF is written to.
7. The MSSPx module shifts in the ACK bit from
the slave device and writes its value into the
ACKSTAT bit of the SSPxCON2 register.
8. The MSSPx module generates an interrupt at
the end of the ninth clock cycle by setting the
SSPxIF bit.
After the write to the SSPxBUF, each bit of the address
will be shifted out on the falling edge of SCLx until all
seven address bits and the R/W bit are completed. On
the falling edge of the eighth clock, the master will
release the SDAx pin, allowing the slave to respond
with an Acknowledge. On the falling edge of the ninth
clock, the master will sample the SDAx pin to see if the
address was recognized by a slave. The status of the
ACK bit is loaded into the ACKSTAT Status bit of the
SSPxCON2 register. Following the falling edge of the
ninth clock transmission of the address, the SSPxIF is
set, the BF flag is cleared and the Baud Rate Generator
is turned off until another write to the SSPxBUF takes
place, holding SCLx low and allowing SDAx to float.
9. The user loads the SSPxBUF with eight bits of
data.
10. Data is shifted out the SDAx pin until all 8 bits
are transmitted.
11. The MSSPx module shifts in the ACK bit from
the slave device and writes its value into the
ACKSTAT bit of the SSPxCON2 register.
12. Steps 8-11 are repeated for all transmitted data
bytes.
13. The user generates a Stop or Restart condition
by setting the PEN or RSEN bits of the
SSPxCON2 register. Interrupt is generated once
the Stop/Restart condition is complete.
15.6.6.1
BF Status Flag
In Transmit mode, the BF bit of the SSPxSTAT register
is set when the CPU writes to SSPxBUF and is cleared
when all 8 bits are shifted out.
15.6.6.2
WCOL Status Flag
If the user writes the SSPxBUF when a transmit is
already in progress (i.e., SSPxSR is still shifting out a
data byte), the WCOL is set and the contents of the
buffer are unchanged (the write does not occur).
WCOL must be cleared by software before the next
transmission.
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FIGURE 15-28:
I C MASTER MODE WAVEFORM (TRANSMISSION, 7 OR 10-BIT ADDRESS)
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I2C MASTER MODE RECEPTION
15.6.7.4 Typical Receive Sequence:
15.6.7
Master mode reception is enabled by programming the
ReceiveEnablebit,RCEN,oftheSSPxCON2register.
1. The user generates a Start condition by setting
the SEN bit of the SSPxCON2 register.
2. SSPxIF is set by hardware on completion of the
Start.
Note:
The MSSPx module must be in an Idle
state before the RCEN bit is set or the
RCEN bit will be disregarded.
3. SSPxIF is cleared by software.
4. User writes SSPxBUF with the slave address to
transmit and the R/W bit set.
The Baud Rate Generator begins counting and on each
rollover, the state of the SCLx pin changes (high-to-low/
low-to-high) and data is shifted into the SSPxSR. After
the falling edge of the eighth clock, the receive enable
flag is automatically cleared, the contents of the
SSPxSR are loaded into the SSPxBUF, the BF flag bit
is set, the SSPxIF flag bit is set and the Baud Rate
Generator is suspended from counting, holding SCLx
low. The MSSPx is now in Idle state awaiting the next
command. When the buffer is read by the CPU, the BF
flag bit is automatically cleared. The user can then
send an Acknowledge bit at the end of reception by set-
ting the Acknowledge Sequence Enable bit, ACKEN, of
the SSPxCON2 register.
5. Address is shifted out the SDAx pin until all 8 bits
are transmitted. Transmission begins as soon
as SSPxBUF is written to.
6. The MSSPx module shifts in the ACK bit from
the slave device and writes its value into the
ACKSTAT bit of the SSPxCON2 register.
7. The MSSPx module generates an interrupt at
the end of the ninth clock cycle by setting the
SSPxIF bit.
8. User sets the RCEN bit of the SSPxCON2 regis-
ter and the Master clocks in a byte from the slave.
9. After the 8th falling edge of SCLx, SSPxIF and
BF are set.
15.6.7.1
BF Status Flag
10. Master clears SSPxIF and reads the received
byte from SSPxUF, clears BF.
In receive operation, the BF bit is set when an address
or data byte is loaded into SSPxBUF from SSPxSR. It
is cleared when the SSPxBUF register is read.
11. Master sets ACK value sent to slave in ACKDT
bit of the SSPxCON2 register and initiates the
ACK by setting the ACKEN bit.
15.6.7.2
SSPxOV Status Flag
12. Masters ACK is clocked out to the slave and
SSPxIF is set.
In receive operation, the SSPxOV bit is set when 8 bits
are received into the SSPxSR and the BF flag bit is
already set from a previous reception.
13. User clears SSPxIF.
14. Steps 8-13 are repeated for each received byte
from the slave.
15.6.7.3
WCOL Status Flag
If the user writes the SSPxBUF when a receive is
already in progress (i.e., SSPxSR is still shifting in a
data byte), the WCOL bit is set and the contents of the
buffer are unchanged (the write does not occur).
15. Master sends a not ACK or Stop to end
communication.
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FIGURE 15-29:
I C™ MASTER MODE WAVEFORM (RECEPTION, 7-BIT ADDRESS)
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15.6.8
ACKNOWLEDGE SEQUENCE
TIMING
15.6.9
STOP CONDITION TIMING
A Stop bit is asserted on the SDAx pin at the end of a
receive/transmit by setting the Stop Sequence Enable
bit, PEN, of the SSPxCON2 register. At the end of a
receive/transmit, the SCLx line is held low after the
falling edge of the ninth clock. When the PEN bit is set,
the master will assert the SDAx line low. When the
SDAx line is sampled low, the Baud Rate Generator is
reloaded and counts down to ‘0’. When the Baud Rate
Generator times out, the SCLx pin will be brought high
and one TBRG (Baud Rate Generator rollover count)
later, the SDAx pin will be deasserted. When the SDAx
pin is sampled high while SCLx is high, the P bit of the
SSPxSTAT register is set. A TBRG later, the PEN bit is
cleared and the SSPxIF bit is set (Figure 15-30).
An Acknowledge sequence is enabled by setting the
Acknowledge Sequence Enable bit, ACKEN, of the
SSPxCON2 register. When this bit is set, the SCLx pin is
pulled low and the contents of the Acknowledge data bit
are presented on the SDAx pin. If the user wishes to
generate an Acknowledge, then the ACKDT bit should
be cleared. If not, the user should set the ACKDT bit
before starting an Acknowledge sequence. The Baud
Rate Generator then counts for one rollover period
(TBRG) and the SCLx pin is deasserted (pulled high).
When the SCLx pin is sampled high (clock arbitration),
the Baud Rate Generator counts for TBRG. The SCLx pin
is then pulled low. Following this, the ACKEN bit is auto-
matically cleared, the Baud Rate Generator is turned off
and the MSSPx module then goes into Idle mode
(Figure 15-29).
15.6.9.1
WCOL Status Flag
If the user writes the SSPxBUF when a Stop sequence
is in progress, then the WCOL bit is set and the
contents of the buffer are unchanged (the write does
not occur).
15.6.8.1
WCOL Status Flag
If the user writes the SSPxBUF when an Acknowledge
sequence is in progress, then WCOL is set and the
contents of the buffer are unchanged (the write does
not occur).
FIGURE 15-30:
ACKNOWLEDGE SEQUENCE WAVEFORM
Acknowledge sequence starts here,
write to SSPxCON2
ACKEN automatically cleared
ACKEN = 1, ACKDT = 0
TBRG
ACK
TBRG
SDAx
SCLx
D0
8
9
SSPxIF
Cleared in
SSPxIF set at
the end of receive
software
Cleared in
software
SSPxIF set at the end
of Acknowledge sequence
Note: TBRG = one Baud Rate Generator period.
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FIGURE 15-31:
STOP CONDITION RECEIVE OR TRANSMIT MODE
SCLx = 1for TBRG, followed by SDAx = 1for TBRG
after SDAx sampled high. P bit (SSPxSTAT<4>) is set.
Write to SSPxCON2,
set PEN
PEN bit (SSPxCON2<2>) is cleared by
hardware and the SSPxIF bit is set
Falling edge of
9th clock
TBRG
SCLx
ACK
SDAx
P
TBRG
TBRG
TBRG
SCLx brought high after TBRG
SDAx asserted low before rising edge of clock
to setup Stop condition
Note: TBRG = one Baud Rate Generator period.
15.6.10 SLEEP OPERATION
15.6.12 MULTI-MASTER MODE
While in Sleep mode, the I2C slave module can receive
addresses or data and when an address match or
complete byte transfer occurs, wake the processor
from Sleep (if the MSSPx interrupt is enabled).
In Multi-Master mode, the interrupt generation on the
detection of the Start and Stop conditions allows the
determination of when the bus is free. The Stop (P) and
Start (S) bits are cleared from a Reset or when the
MSSPx module is disabled. Control of the I2C bus may
be taken when the P bit of the SSPxSTAT register is
set, or the bus is Idle, with both the S and P bits clear.
When the bus is busy, enabling the SSPx interrupt will
generate the interrupt when the Stop condition occurs.
15.6.11 EFFECTS OF A RESET
A Reset disables the MSSPx module and terminates
the current transfer.
In multi-master operation, the SDAx line must be
monitored for arbitration to see if the signal level is the
expected output level. This check is performed by
hardware with the result placed in the BCLxIF bit.
The states where arbitration can be lost are:
• Address Transfer
• Data Transfer
• A Start Condition
• A Repeated Start Condition
• An Acknowledge Condition
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If a Start, Repeated Start, Stop or Acknowledge
condition was in progress when the bus collision
occurred, the condition is aborted, the SDAx and SCLx
lines are deasserted and the respective control bits in
the SSPxCON2 register are cleared. When the user
services the bus collision Interrupt Service Routine and
if the I2C bus is free, the user can resume
communication by asserting a Start condition.
15.6.13 MULTI -MASTER COMMUNICATION,
BUS COLLISION AND BUS
ARBITRATION
Multi-Master mode support is achieved by bus
arbitration. When the master outputs address/data bits
onto the SDAx pin, arbitration takes place when the
master outputs a ‘1’ on SDAx, by letting SDAx float high
and another master asserts a ‘0’. When the SCLx pin
floats high, data should be stable. If the expected data
on SDAx is a ‘1’ and the data sampled on the SDAx pin
is ‘0’, then a bus collision has taken place. The master
will set the Bus Collision Interrupt Flag, BCLxIF, and
reset the I2C port to its Idle state (Figure 15-31).
The master will continue to monitor the SDAx and SCLx
pins. If a Stop condition occurs, the SSPxIF bit will be set.
A write to the SSPxBUF will start the transmission of
data at the first data bit, regardless of where the
transmitter left off when the bus collision occurred.
If a transmit was in progress when the bus collision
occurred, the transmission is halted, the BF flag is
cleared, the SDAx and SCLx lines are deasserted and
the SSPxBUF can be written to. When the user
services the bus collision Interrupt Service Routine and
if the I2C bus is free, the user can resume
communication by asserting a Start condition.
In Multi-Master mode, the interrupt generation on the
detection of Start and Stop conditions allows the
determination of when the bus is free. Control of the I2C
bus can be taken when the P bit is set in the SSPxSTAT
register, or the bus is Idle and the S and P bits are
cleared.
FIGURE 15-32:
BUS COLLISION TIMING FOR TRANSMIT AND ACKNOWLEDGE
Sample SDAx. While SCLx is high,
data does not match what is driven
by the master.
Data changes
while SCLx = 0
SDAx line pulled low
by another source
Bus collision has occurred.
SDAx released
by master
SDAx
SCLx
Set bus collision
interrupt (BCLxIF)
BCLxIF
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If the SDAx pin is sampled low during this count, the
BRG is reset and the SDAx line is asserted early
(Figure 15-34). If, however, a ‘1’ is sampled on the
SDAx pin, the SDAx pin is asserted low at the end of
the BRG count. The Baud Rate Generator is then
reloaded and counts down to zero; if the SCLx pin is
sampled as ‘0’ during this time, a bus collision does not
occur. At the end of the BRG count, the SCLx pin is
asserted low.
15.6.13.1 Bus Collision During a Start
Condition
During a Start condition, a bus collision occurs if:
a) SDAx or SCLx are sampled low at the beginning
of the Start condition (Figure 15-32).
b) SCLx is sampled low before SDAx is asserted
low (Figure 15-33).
During a Start condition, both the SDAx and the SCLx
pins are monitored.
Note:
The reason that bus collision is not a factor
during a Start condition is that no two bus
masters can assert a Start condition at the
exact same time. Therefore, one master
will always assert SDAx before the other.
This condition does not cause a bus colli-
sion because the two masters must be
allowed to arbitrate the first address fol-
lowing the Start condition. If the address is
the same, arbitration must be allowed to
continue into the data portion, Repeated
Start or Stop conditions.
If the SDAx pin is already low, or the SCLx pin is
already low, then all of the following occur:
• the Start condition is aborted,
• the BCLxIF flag is set and
•
the MSSPx module is reset to its Idle state
(Figure 15-32).
The Start condition begins with the SDAx and SCLx
pins deasserted. When the SDAx pin is sampled high,
the Baud Rate Generator is loaded and counts down. If
the SCLx pin is sampled low while SDAx is high, a bus
collision occurs because it is assumed that another
master is attempting to drive a data ‘1’ during the Start
condition.
FIGURE 15-33:
BUS COLLISION DURING START CONDITION (SDAx ONLY)
SDAx goes low before the SEN bit is set.
Set BCLxIF,
S bit and SSPxIF set because
SDAx = 0, SCLx = 1.
SDAx
SCLx
SEN
Set SEN, enable Start
condition if SDAx = 1, SCLx = 1
SEN cleared automatically because of bus collision.
SSPx module reset into Idle state.
SDAx sampled low before
Start condition. Set BCLxIF.
S bit and SSPxIF set because
SDAx = 0, SCLx = 1.
BCLxIF
SSPxIF and BCLxIF are
cleared by software
S
SSPxIF
SSPxIF and BCLxIF are
cleared by software
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FIGURE 15-34:
BUS COLLISION DURING START CONDITION (SCLx = 0)
SDAx = 0, SCLx = 1
TBRG
TBRG
SDAx
Set SEN, enable Start
sequence if SDAx = 1, SCLx = 1
SCLx
SEN
SCLx = 0before SDAx = 0,
bus collision occurs. Set BCLxIF.
SCLx = 0before BRG time-out,
bus collision occurs. Set BCLxIF.
BCLxIF
Interrupt cleared
by software
S
’0’
’0’
’0’
’0’
SSPxIF
FIGURE 15-35:
BRG RESET DUE TO SDA ARBITRATION DURING START CONDITION
SDAx = 0, SCLx = 1
Set S
Set SSPxIF
Less than TBRG
TBRG
SDAx pulled low by other master.
Reset BRG and assert SDAx.
SDAx
SCLx
S
SCLx pulled low after BRG
time-out
SEN
Set SEN, enable Start
sequence if SDAx = 1, SCLx = 1
’0’
BCLxIF
S
SSPxIF
Interrupts cleared
by software
SDAx = 0, SCLx = 1,
set SSPxIF
DS41412A-page 252
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
If SDAx is low, a bus collision has occurred (i.e., another
master is attempting to transmit a data ‘0’, Figure 15-35).
If SDAx is sampled high, the BRG is reloaded and
begins counting. If SDAx goes from high-to-low before
the BRG times out, no bus collision occurs because no
two masters can assert SDAx at exactly the same time.
15.6.13.2 Bus Collision During a Repeated
Start Condition
During a Repeated Start condition, a bus collision
occurs if:
a) A low level is sampled on SDAx when SCLx
goes from low level to high level.
If SCLx goes from high-to-low before the BRG times
out and SDAx has not already been asserted, a bus
collision occurs. In this case, another master is
attempting to transmit a data ‘1’ during the Repeated
Start condition, see Figure 15-36.
b) SCLx goes low before SDAx is asserted low,
indicating that another master is attempting to
transmit a data ‘1’.
When the user releases SDAx and the pin is allowed to
float high, the BRG is loaded with SSPxADD and
counts down to zero. The SCLx pin is then deasserted
and when sampled high, the SDAx pin is sampled.
If, at the end of the BRG time-out, both SCLx and SDAx
are still high, the SDAx pin is driven low and the BRG
is reloaded and begins counting. At the end of the
count, regardless of the status of the SCLx pin, the
SCLx pin is driven low and the Repeated Start
condition is complete.
FIGURE 15-36:
BUS COLLISION DURING A REPEATED START CONDITION (CASE 1)
SDAx
SCLx
Sample SDAx when SCLx goes high.
If SDAx = 0, set BCLxIF and release SDAx and SCLx.
RSEN
BCLxIF
Cleared by software
’0’
S
’0’
SSPxIF
FIGURE 15-37:
BUS COLLISION DURING REPEATED START CONDITION (CASE 2)
TBRG
TBRG
SDAx
SCLx
SCLx goes low before SDAx,
BCLxIF
RSEN
set BCLxIF. Release SDAx and SCLx.
Interrupt cleared
by software
’0’
S
SSPxIF
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 253
PIC18(L)F2X/4XK22
The Stop condition begins with SDAx asserted low.
When SDAx is sampled low, the SCLx pin is allowed to
float. When the pin is sampled high (clock arbitration),
the Baud Rate Generator is loaded with SSPxADD and
counts down to 0. After the BRG times out, SDAx is
sampled. If SDAx is sampled low, a bus collision has
occurred. This is due to another master attempting to
drive a data ‘0’ (Figure 15-37). If the SCLx pin is
sampled low before SDAx is allowed to float high, a bus
collision occurs. This is another case of another master
attempting to drive a data ‘0’ (Figure 15-38).
15.6.13.3 Bus Collision During a Stop
Condition
Bus collision occurs during a Stop condition if:
a) After the SDAx pin has been deasserted and
allowed to float high, SDAx is sampled low after
the BRG has timed out.
b) After the SCLx pin is deasserted, SCLx is
sampled low before SDAx goes high.
FIGURE 15-38:
BUS COLLISION DURING A STOP CONDITION (CASE 1)
SDAx sampled
low after TBRG,
set BCLxIF
TBRG
TBRG
TBRG
SDAx
SDAx asserted low
SCLx
PEN
BCLxIF
P
’0’
’0’
SSPxIF
FIGURE 15-39:
BUS COLLISION DURING A STOP CONDITION (CASE 2)
TBRG
TBRG
TBRG
SDAx
SCLx goes low before SDAx goes high,
set BCLxIF
Assert SDAx
SCLx
PEN
BCLxIF
P
’0’
’0’
SSPxIF
DS41412A-page 254
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
TABLE 15-3: REGISTERS ASSOCIATED WITH I2C™ OPERATION
Register
on Page
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
ANSELA
ANSELB
ANSELC
ANSELD
INTCON
IPR1
ANSA5
ANSB5
ANSC5
ANSD5
ANSA3
ANSB3
ANSC3
ANSD3
RBIE
ANSA2
ANSB2
ANSC2
ANSD2
TMR0IF
CCP1IP
HLVDIP
ANSA1
ANSA0
153
154
154
154
115
127
128
129
123
124
125
118
119
120
57
—
—
—
—
(1)
(1)
ANSB4
ANSC4
ANSD4
INT0IE
TX1IP
EEIP
ANSB1
ANSB0
—
ANSC7
ANSD7
GIE/GIEH
—
ANSC6
ANSD6
—
—
ANSD0
RBIF
(2)
(2)
ANSD1
PEIE/GIEL TMR0IE
INT0IF
TMR2IP
TMR3IP
ADIP
C1IP
RC1IP
C2IP
SSP1IP
BCL1IP
TMR1IP
CCP2IP
IPR2
OSCFIP
SSP2IP
—
IPR3
BCL2IP
ADIE
RC2IP
RC1IE
C2IE
TX2IP
TX1IE
EEIE
CTMUIP TMR5GIP TMR3GIP TMR1GIP
PIE1
SSP1IE
BCL1IE
CCP1IE
HLVDIE
TMR2IE
TMR3IE
TMR1IE
CCP2IE
PIE2
OSCFIE
SSP2IE
—
C1IE
PIE3
BCL2IE
ADIF
RC2IE
RC1IF
C2IF
TX2IE
TX1IF
EEIF
CTMUIE TMR5GIE TMR3GIE TMR1GIE
PIR1
SSP1IF
BCL1IF
CCP1IF
HLVDIF
TMR2IF
TMR3IF
TMR1IF
CCP2IF
PIR2
OSCFIF
SSP2IF
C1IF
PIR3
BCL2IF
RC2IF
—
TX2IF
CTMUIF TMR5GIF TMR3GIF TMR1GIF
PMD1
MSSP2MD MSSP1MD
CCP5MD CCP4MD CCP3MD CCP2MD CCP1MD
2
2
SSP1ADD SSP1 Address Register in I C Slave Mode. SSP1 Baud Rate Reload Register in I C Master Mode.
263
—
SSP1BUF
SSP1 Receive Buffer/Transmit Register
SSP1CON1
SSP1CON2
WCOL
GCEN
SSPOV
ACKSTAT
PCIE
SSPEN
ACKDT
SCIE
CKP
ACKEN
BOEN
SSPM<3:0>
258
260
261
262
257
263
—
RCEN
PEN
RSEN
AHEN
SEN
SSP1CON3 ACKTIM
SSP1MSK
SDAHT
SBCDE
DHEN
SSP1 MASK Register bits
SSP1STAT
SMP
CKE
D/A
P
S
R/W
UA
BF
2
2
SSP2ADD SSP2 Address Register in I C Slave Mode. SSP2 Baud Rate Reload Register in I C Master Mode.
SSP2BUF
SSP2 Receive Buffer/Transmit Register
SSP2CON1
SSP2CON2
WCOL
GCEN
SSPOV
ACKSTAT
PCIE
SSPEN
ACKDT
SCIE
CKP
ACKEN
BOEN
SSPM<3:0>
258
260
261
262
257
155
155
155
RCEN
PEN
RSEN
AHEN
SEN
SSP2CON3 ACKTIM
SSP2MSK
SDAHT
SBCDE
DHEN
SSP1 MASK Register bits
SSP2STAT
TRISB
SMP
CKE
D/A
P
S
R/W
UA
BF
(1)
(1)
TRISB7
TRISC7
TRISD7
TRISB6
TRISC6
TRISD6
TRISB5 TRISB4
TRISC5 TRISC4
TRISB3
TRISC3
TRISD3
TRISB2
TRISC2
TRISD2
TRISB1
TRISC1
TRISB0
TRISC0
TRISC
(2)
(2)
TRISD
TRISD5 TRISD4
TRISD1
TRISD0
2
Legend: Shaded bits are not used by the MSSPx in I C mode.
Note 1: PIC18(L)F2XK22 devices.
2: PIC18(L)F4XK22 devices.
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 255
PIC18(L)F2X/4XK22
module clock line. The logic dictating when the reload
signal is asserted depends on the mode the MSSPx is
being operated in.
15.7 BAUD RATE GENERATOR
The MSSPx module has a Baud Rate Generator avail-
able for clock generation in both I2C and SPI Master
modes. The Baud Rate Generator (BRG) reload value
is placed in the SSPxADD register (Register 15-6).
When a write occurs to SSPxBUF, the Baud Rate Gen-
erator will automatically begin counting down.
Table 15-4 demonstrates clock rates based on
instruction cycles and the BRG value loaded into
SSPxADD.
EQUATION 15-1:
Once the given operation is complete, the internal clock
will automatically stop counting and the clock pin will
remain in its last state.
FOSC
FCLOCK = -------------------------------------------------
SSPxADD + 14
An internal signal “Reload” in Figure 15-39 triggers the
value from SSPxADD to be loaded into the BRG
counter. This occurs twice for each oscillation of the
FIGURE 15-40:
BAUD RATE GENERATOR BLOCK DIAGRAM
SSPxM<3:0>
SSPxADD<7:0>
SSPxM<3:0>
SCLx
Reload
Control
Reload
BRG Down Counter
SSPxCLK
FOSC/2
Note: Values of 0x00, 0x01 and 0x02 are not valid
for SSPxADD when used as a Baud Rate
Generator for I2C. This is an implementation
limitation.
TABLE 15-4: MSSPx CLOCK RATE W/BRG
FCLOCK
(2 Rollovers of BRG)
FOSC
FCY
BRG Value
32 MHz
32 MHz
32 MHz
16 MHz
16 MHz
16 MHz
4 MHz
8 MHz
8 MHz
8 MHz
4 MHz
4 MHz
4 MHz
1 MHz
13h
19h
4Fh
09h
0Ch
27h
09h
400 kHz(1)
308 kHz
100 kHz
400 kHz(1)
308 kHz
100 kHz
100 kHz
Note 1: The I2C interface does not conform to the 400 kHz I2C specification (which applies to rates greater than
100 kHz) in all details, but may be used with care where higher rates are required by the application.
DS41412A-page 256
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
REGISTER 15-1: SSPxSTAT: SSPx STATUS REGISTER
R/W-0
SMP
R/W-0
CKE
R-0
D/A
R-0
P
R-0
S
R-0
R-0
UA
R-0
BF
R/W
bit 7
bit 0
Legend:
R = Readable bit
u = Bit is unchanged
‘1’ = Bit is set
W = Writable bit
x = Bit is unknown
‘0’ = Bit is cleared
U = Unimplemented bit, read as ‘0’
-n/n = Value at POR and BOR/Value at all other Resets
bit 7
SMP: SPI Data Input Sample bit
SPI Master mode:
1= Input data sampled at end of data output time
0= Input data sampled at middle of data output time
SPI Slave mode:
SMP must be cleared when SPI is used in Slave mode
2
In I C Master or Slave mode:
1 = Slew rate control disabled for standard speed mode (100 kHz and 1 MHz)
0 = Slew rate control enabled for high speed mode (400 kHz)
bit 6
CKE: SPI Clock Edge Select bit (SPI mode only)
In SPI Master or Slave mode:
1= Transmit occurs on transition from active to Idle clock state
0= Transmit occurs on transition from Idle to active clock state
2
In I C mode only:
1= Enable input logic so that thresholds are compliant with SMbus specification
0= Disable SMbus specific inputs
2
bit 5
bit 4
D/A: Data/Address bit (I C mode only)
1= Indicates that the last byte received or transmitted was data
0= Indicates that the last byte received or transmitted was address
P: Stop bit
2
(I C mode only. This bit is cleared when the MSSPx module is disabled, SSPxEN is cleared.)
1= Indicates that a Stop bit has been detected last (this bit is ‘0’ on Reset)
0= Stop bit was not detected last
bit 3
bit 2
S: Start bit
2
(I C mode only. This bit is cleared when the MSSPx module is disabled, SSPxEN is cleared.)
1= Indicates that a Start bit has been detected last (this bit is ‘0’ on Reset)
0= Start bit was not detected last
2
R/W: Read/Write bit information (I C mode only)
This bit holds the R/W bit information following the last address match. This bit is only valid from the address match
to the next Start bit, Stop bit, or not ACK bit.
2
In I C Slave mode:
1= Read
0= Write
2
In I C Master mode:
1= Transmit is in progress
0= Transmit is not in progress
OR-ing this bit with SEN, RSEN, PEN, RCEN or ACKEN will indicate if the MSSPx is in Idle mode.
2
bit 1
bit 0
UA: Update Address bit (10-bit I C mode only)
1= Indicates that the user needs to update the address in the SSPxADD register
0= Address does not need to be updated
BF: Buffer Full Status bit
2
Receive (SPI and I C modes):
1= Receive complete, SSPxBUF is full
0= Receive not complete, SSPxBUF is empty
2
Transmit (I C mode only):
1= Data transmit in progress (does not include the ACK and Stop bits), SSPxBUF is full
0= Data transmit complete (does not include the ACK and Stop bits), SSPxBUF is empty
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 257
PIC18(L)F2X/4XK22
REGISTER 15-2: SSPxCON1: SSPx CONTROL REGISTER 1
R/W-0
R/C/HS-0
WCOL
R/C/HS-0
SSPxOV
R/W-0
R/W-0
CKP
R/W-0
R/W-0
R/W-0
SSPxEN
SSPxM<3:0>
bit 0
bit 7
Legend:
R = Readable bit
u = Bit is unchanged
‘1’ = Bit is set
W = Writable bit
x = Bit is unknown
‘0’ = Bit is cleared
U = Unimplemented bit, read as ‘0’
-n/n = Value at POR and BOR/Value at all other Resets
HS = Bit is set by hardware
C = User cleared
bit 7
WCOL: Write Collision Detect bit
Master mode:
2
1= A write to the SSPxBUF register was attempted while the I C conditions were not valid for a transmission to
be started
0= No collision
Slave mode:
1= The SSPxBUF register is written while it is still transmitting the previous word (must be cleared in software)
0= No collision
(1)
bit 6
SSPxOV: Receive Overflow Indicator bit
In SPI mode:
1= A new byte is received while the SSPxBUF register is still holding the previous data. In case of overflow, the data
in SSPxSR is lost. Overflow can only occur in Slave mode. In Slave mode, the user must read the SSPxBUF, even
if only transmitting data, to avoid setting overflow. In Master mode, the overflow bit is not set since each new recep-
tion (and transmission) is initiated by writing to the SSPxBUF register (must be cleared in software).
0= No overflow
2
In I C mode:
1= A byte is received while the SSPxBUF register is still holding the previous byte. SSPxOV is a “don’t care” in
Transmit mode (must be cleared in software).
0= No overflow
bit 5
SSPxEN: Synchronous Serial Port Enable bit
In both modes, when enabled, these pins must be properly configured as input or output
In SPI mode:
1= Enables serial port and configures SCKx, SDOx, SDIx and SSx as the source of the serial port pins
(2)
0= Disables serial port and configures these pins as I/O port pins
2
In I C mode:
(3)
1= Enables the serial port and configures the SDAx and SCLx pins as the source of the serial port pins
0= Disables serial port and configures these pins as I/O port pins
bit 4
CKP: Clock Polarity Select bit
In SPI mode:
1= Idle state for clock is a high level
0= Idle state for clock is a low level
2
In I C Slave mode:
SCLx release control
1= Enable clock
0= Holds clock low (clock stretch). (Used to ensure data setup time.)
2
In I C Master mode:
Unused in this mode
DS41412A-page 258
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
REGISTER 15-2: SSPxCON1: SSPx CONTROL REGISTER 1 (CONTINUED)
bit 3-0
SSPxM<3:0>: Synchronous Serial Port Mode Select bits
0000= SPI Master mode, clock = FOSC/4
0001= SPI Master mode, clock = FOSC/16
0010= SPI Master mode, clock = FOSC/64
0011= SPI Master mode, clock = TMR2 output/2
0100= SPI Slave mode, clock = SCKx pin, SSx pin control enabled
0101= SPI Slave mode, clock = SCKx pin, SSx pin control disabled, SSx can be used as I/O pin
2
0110= I C Slave mode, 7-bit address
2
0111= I C Slave mode, 10-bit address
1000= I C Master mode, clock = FOSC / (4 * (SSPxADD+1))
2
(4)
1001= Reserved
1010= SPI Master mode, clock = FOSC/(4 * (SSPxADD+1))
2
1011= I C firmware controlled Master mode (slave idle)
1100= Reserved
1101= Reserved
2
1110= I C Slave mode, 7-bit address with Start and Stop bit interrupts enabled
2
1111= I C Slave mode, 10-bit address with Start and Stop bit interrupts enabled
Note 1: In Master mode, the overflow bit is not set since each new reception (and transmission) is initiated by writing to the
SSPxBUF register.
2: When enabled, these pins must be properly configured as input or output.
3: When enabled, the SDAx and SCLx pins must be configured as inputs.
2
4: SSPxADD values of 0, 1 or 2 are not supported for I C Mode.
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 259
PIC18(L)F2X/4XK22
REGISTER 15-3: SSPxCON2: SSPx CONTROL REGISTER 2
R/W-0
GCEN
R-0
R/W-0
R/S/HC-0
ACKEN(1)
R/S/HC-0
RCEN(1)
R/S/HC-0
PEN(1)
R/S/HC-0
RSEN(1)
R/W/HC-0
SEN(1)
ACKSTAT
ACKDT
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
‘1’ = Bit is set
x = Bit is unknown
‘0’ = Bit is cleared
-n/n = Value at POR and BOR/Value at all other Resets
HC = Cleared by hardware S = User set
bit 7
bit 6
bit 5
GCEN: General Call Enable bit (in I2C Slave mode only)
1= Enable interrupt when a general call address (0x00 or 00h) is received in the SSPxSR
0= General call address disabled
ACKSTAT: Acknowledge Status bit (in I2C mode only)
1= Acknowledge was not received
0= Acknowledge was received
ACKDT: Acknowledge Data bit (in I2C mode only)
In Receive mode:
Value transmitted when the user initiates an Acknowledge sequence at the end of a receive
1= Not Acknowledge
0= Acknowledge
bit 4
ACKEN(1): Acknowledge Sequence Enable bit (in I2C Master mode only)
In Master Receive mode:
1= Initiate Acknowledge sequence on SDAx and SCLx pins, and transmit ACKDT data bit.
Automatically cleared by hardware.
0= Acknowledge sequence idle
bit 3
bit 2
RCEN(1): Receive Enable bit (in I2C Master mode only)
1= Enables Receive mode for I2C
0= Receive idle
PEN(1): Stop Condition Enable bit (in I2C Master mode only)
SCKx Release Control:
1= Initiate Stop condition on SDAx and SCLx pins. Automatically cleared by hardware.
0= Stop condition Idle
bit 1
bit 0
RSEN(1): Repeated Start Condition Enabled bit (in I2C Master mode only)
1= Initiate Repeated Start condition on SDAx and SCLx pins. Automatically cleared by hardware.
0= Repeated Start condition Idle
SEN(1): Start Condition Enabled bit (in I2C Master mode only)
In Master mode:
1= Initiate Start condition on SDAx and SCLx pins. Automatically cleared by hardware.
0= Start condition Idle
In Slave mode:
1= Clock stretching is enabled for both slave transmit and slave receive (stretch enabled)
0= Clock stretching is disabled
Note 1: For bits ACKEN, RCEN, PEN, RSEN, SEN: If the I2C module is not in the Idle mode, this bit may not be
set (no spooling) and the SSPxBUF may not be written (or writes to the SSPxBUF are disabled).
DS41412A-page 260
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
REGISTER 15-4: SSPxCON3: SSPx CONTROL REGISTER 3
R-0
R/W-0
PCIE
R/W-0
SCIE
R/W-0
BOEN
R/W-0
R/W-0
R/W-0
AHEN
R/W-0
DHEN
ACKTIM
SDAHT
SBCDE
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
x = Bit is unknown
‘0’ = Bit is cleared
U = Unimplemented bit, read as ‘0’
-n/n = Value at POR and BOR/Value at all other Resets
u = Bit is unchanged
‘1’ = Bit is set
bit 7
bit 6
bit 5
bit 4
ACKTIM: Acknowledge Time Status bit (I2C mode only)(3)
1= Indicates the I2C bus is in an Acknowledge sequence, set on 8th falling edge of SCLx clock
0= Not an Acknowledge sequence, cleared on 9th rising edge of SCLx clock
PCIE: Stop Condition Interrupt Enable bit (I2C mode only)
1= Enable interrupt on detection of Stop condition
0= Stop detection interrupts are disabled(2)
SCIE: Start Condition Interrupt Enable bit (I2C mode only)
1= Enable interrupt on detection of Start or Restart conditions
0= Start detection interrupts are disabled(2)
BOEN: Buffer Overwrite Enable bit
In SPI Slave mode:(1)
1= SSPxBUF updates every time that a new data byte is shifted in ignoring the BF bit
0= If new byte is received with BF bit of the SSPxSTAT register already set, SSPxOV bit of the
SSPxCON1 register is set, and the buffer is not updated
In I2C Master mode:
This bit is ignored.
In I2C Slave mode:
1= SSPxBUF is updated and ACK is generated for a received address/data byte, ignoring the
state of the SSPxOV bit only if the BF bit = 0.
0= SSPxBUF is only updated when SSPxOV is clear
bit 3
bit 2
SDAHT: SDAx Hold Time Selection bit (I2C mode only)
1= Minimum of 300 ns hold time on SDAx after the falling edge of SCLx
0= Minimum of 100 ns hold time on SDAx after the falling edge of SCLx
SBCDE: Slave Mode Bus Collision Detect Enable bit (I2C Slave mode only)
If on the rising edge of SCLx, SDAx is sampled low when the module is outputting a high state, the
BCLxIF bit of the PIR2 register is set, and bus goes idle
1= Enable slave bus collision interrupts
0= Slave bus collision interrupts are disabled
bit 1
AHEN: Address Hold Enable bit (I2C Slave mode only)
1 = Following the 8th falling edge of SCLx for a matching received address byte; CKP bit of the
SSPxCON1 register will be cleared and the SCLx will be held low.
0= Address holding is disabled
Note 1: For daisy-chained SPI operation; allows the user to ignore all but the last received byte. SSPxOV is still
set when a new byte is received and BF = 1, but hardware continues to write the most recent byte to
SSPxBUF.
2: This bit has no effect in Slave modes for which Start and Stop condition detection is explicitly listed as
enabled.
3: The ACKTIM Status bit is active only when the AHEN bit or DHEN bit is set.
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 261
PIC18(L)F2X/4XK22
REGISTER 15-4: SSPxCON3: SSPx CONTROL REGISTER 3 (CONTINUED)
bit 0
DHEN: Data Hold Enable bit (I2C Slave mode only)
1= Following the 8th falling edge of SCLx for a received data byte; slave hardware clears the CKP bit
of the SSPxCON1 register and SCLx is held low.
0= Data holding is disabled
Note 1: For daisy-chained SPI operation; allows the user to ignore all but the last received byte. SSPxOV is still
set when a new byte is received and BF = 1, but hardware continues to write the most recent byte to
SSPxBUF.
2: This bit has no effect in Slave modes for which Start and Stop condition detection is explicitly listed as
enabled.
3: The ACKTIM Status bit is active only when the AHEN bit or DHEN bit is set.
REGISTER 15-5: SSPxMSK: SSPx MASK REGISTER
R/W-1
MSK7
R/W-1
MSK6
R/W-1
MSK5
R/W-1
MSK4
R/W-1
MSK3
R/W-1
MSK2
R/W-1
MSK1
R/W-1
MSK0
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n/n = Value at POR and BOR/Value at all other Resets
u = Bit is unchanged
‘1’ = Bit is set
x = Bit is unknown
‘0’ = Bit is cleared
bit 7-1
bit 0
MSK<7:1>: Mask bits
1= The received address bit n is compared to SSPxADD<n> to detect I2C address match
0= The received address bit n is not used to detect I2C address match
MSK<0>: Mask bit for I2C Slave mode, 10-bit Address
I2C Slave mode, 10-bit address (SSPxM<3:0> = 0111or 1111):
1= The received address bit 0 is compared to SSPxADD<0> to detect I2C address match
0= The received address bit 0 is not used to detect I2C address match
I2C Slave mode, 7-bit address, the bit is ignored
DS41412A-page 262
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
REGISTER 15-6: SSPXADD: MSSPx ADDRESS AND BAUD RATE REGISTER (I2C MODE)
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
ADD<7:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n/n = Value at POR and BOR/Value at all other Resets
u = Bit is unchanged
‘1’ = Bit is set
x = Bit is unknown
‘0’ = Bit is cleared
Master mode:
bit 7-0
ADD<7:0>: Baud Rate Clock Divider bits
SCLx pin clock period = ((ADD<7:0> + 1) *4)/FOSC
10-Bit Slave mode — Most Significant Address byte:
bit 7-3
Not used: Unused for Most Significant Address byte. Bit state of this register is a “don’t care”. Bit
pattern sent by master is fixed by I2C specification and must be equal to ‘11110’. However, those bits
are compared by hardware and are not affected by the value in this register.
bit 2-1
bit 0
ADD<2:1>: Two Most Significant bits of 10-bit address
Not used: Unused in this mode. Bit state is a “don’t care”.
10-Bit Slave mode — Least Significant Address byte:
bit 7-0
ADD<7:0>: Eight Least Significant bits of 10-bit address
7-Bit Slave mode:
bit 7-1
bit 0
ADD<7:1>: 7-bit address
Not used: Unused in this mode. Bit state is a “don’t care”.
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 263
PIC18(L)F2X/4XK22
NOTES:
DS41412A-page 264
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
The EUSART module includes the following capabilities:
16.0 ENHANCED UNIVERSAL
SYNCHRONOUS
• Full-duplex asynchronous transmit and receive
• Two-character input buffer
ASYNCHRONOUS RECEIVER
TRANSMITTER (EUSART)
• One-character output buffer
• Programmable 8-bit or 9-bit character length
• Address detection in 9-bit mode
The Enhanced Universal Synchronous Asynchronous
Receiver Transmitter (EUSART) module is a serial I/O
communications peripheral. It contains all the clock
generators, shift registers and data buffers necessary
to perform an input or output serial data transfer
independent of device program execution. The
EUSART, also known as a Serial Communications
Interface (SCI), can be configured as a full-duplex
asynchronous system or half-duplex synchronous
• Input buffer overrun error detection
• Received character framing error detection
• Half-duplex synchronous master
• Half-duplex synchronous slave
• Programmable clock and data polarity
The EUSART module implements the following
additional features, making it ideally suited for use in
Local Interconnect Network (LIN) bus systems:
system.
Full-Duplex
mode
is
useful
for
communications with peripheral systems, such as CRT
terminals and personal computers. Half-Duplex
Synchronous mode is intended for communications
with peripheral devices, such as A/D or D/A integrated
circuits, serial EEPROMs or other microcontrollers.
These devices typically do not have internal clocks for
baud rate generation and require the external clock
signal provided by a master synchronous device.
• Automatic detection and calibration of the baud rate
• Wake-up on Break reception
• 13-bit Break character transmit
Block diagrams of the EUSART transmitter and
receiver are shown in Figure 16-1 and Figure 16-2.
FIGURE 16-1:
EUSART TRANSMIT BLOCK DIAGRAM
Data Bus
TXxIE
Interrupt
TXxIF
TXREGx Register
8
TXx/CKx pin
MSb
(8)
LSb
0
Pin Buffer
and Control
• • •
Transmit Shift Register (TSR)
TXEN
TRMT
Baud Rate Generator
BRG16
FOSC
÷ n
TX9
n
+ 1
Multiplier x4
x16 x64
TX9D
SYNC
BRGH
BRG16
1
X
X
X
1
1
0
1
0
0
0
1
0
0
0
SPBRGHx SPBRGx
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 265
PIC18(L)F2X/4XK22
FIGURE 16-2:
EUSART RECEIVE BLOCK DIAGRAM
CREN
OERR
RCIDL
RXx/DTx pin
RSR Register
MSb
Stop (8)
LSb
0
START
Pin Buffer
and Control
Data
Recovery
7
1
• • •
Baud Rate Generator
FOSC
RX9
÷ n
BRG16
n
+ 1
Multiplier
x4
x16 x64
SYNC
BRGH
BRG16
1
X
1
1
0
1
0
0
0
1
0
0
0
FIFO
SPBRGHx SPBRGx
X
X
RX9D
FERR
RCREGx Register
8
Data Bus
RCxIF
RCxIE
Interrupt
The operation of the EUSART module is controlled
through three registers:
• Transmit Status and Control (TXSTAx)
• Receive Status and Control (RCSTAx)
• Baud Rate Control (BAUDCONx)
These registers are detailed in Register 16-1,
Register 16-2 and Register 16-3, respectively.
For all modes of EUSART operation, the TRIS control
bits corresponding to the RXx/DTx and TXx/CKx pins
should be set to ‘1’. The EUSART control will
automatically reconfigure the pin from input to output, as
needed.
When the receiver or transmitter section is not enabled
then the corresponding RXx/DTx or TXx/CKx pin may be
used for general purpose input and output.
DS41412A-page 266
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
16.1.1.2
Transmitting Data
16.1 EUSART Asynchronous Mode
A transmission is initiated by writing a character to the
TXREGx register. If this is the first character, or the
previous character has been completely flushed from
the TSR, the data in the TXREGx is immediately
transferred to the TSR register. If the TSR still contains
all or part of a previous character, the new character
data is held in the TXREGx until the Stop bit of the
previous character has been transmitted. The pending
character in the TXREGx is then transferred to the TSR
in one TCY immediately following the Stop bit
transmission. The transmission of the Start bit, data bits
and Stop bit sequence commences immediately
following the transfer of the data to the TSR from the
TXREGx.
The EUSART transmits and receives data using the
standard non-return-to-zero (NRZ) format. NRZ is
implemented with two levels: a VOH mark state which
represents a ‘1’ data bit, and a VOL space state which
represents a ‘0’ data bit. NRZ refers to the fact that
consecutively transmitted data bits of the same value
stay at the output level of that bit without returning to a
neutral level between each bit transmission. An NRZ
transmission port idles in the mark state. Each character
transmission consists of one Start bit followed by eight
or nine data bits and is always terminated by one or
more Stop bits. The Start bit is always a space and the
Stop bits are always marks. The most common data
format is 8 bits. Each transmitted bit persists for a period
of 1/(Baud Rate). An on-chip dedicated 8-bit/16-bit Baud
Rate Generator is used to derive standard baud rate
frequencies from the system oscillator. See Table 16-5
for examples of baud rate configurations.
16.1.1.3
Transmit Data Polarity
The polarity of the transmit data can be controlled with
the CKTXP bit of the BAUDCONx register. The default
state of this bit is ‘0’ which selects high true transmit
idle and data bits. Setting the CKTXP bit to ‘1’ will invert
the transmit data resulting in low true idle and data bits.
The CKTXP bit controls transmit data polarity only in
Asynchronous mode. In Synchronous mode the
CKTXP bit has a different function.
The EUSART transmits and receives the LSb first. The
EUSART’s transmitter and receiver are functionally
independent, but share the same data format and baud
rate. Parity is not supported by the hardware, but can
be implemented in software and stored as the ninth
data bit.
16.1.1.4
Transmit Interrupt Flag
16.1.1
EUSART ASYNCHRONOUS
TRANSMITTER
The TXxIF interrupt flag bit of the PIR1/PIR3 register is
set whenever the EUSART transmitter is enabled and
no character is being held for transmission in the
TXREGx. In other words, the TXxIF bit is only clear
when the TSR is busy with a character and a new
character has been queued for transmission in the
TXREGx. The TXxIF flag bit is not cleared immediately
upon writing TXREGx. TXxIF becomes valid in the
second instruction cycle following the write execution.
Polling TXxIF immediately following the TXREGx write
will return invalid results. The TXxIF bit is read-only, it
cannot be set or cleared by software.
The EUSART transmitter block diagram is shown in
Figure 16-1. The heart of the transmitter is the serial
Transmit Shift Register (TSR), which is not directly
accessible by software. The TSR obtains its data from
the transmit buffer, which is the TXREGx register.
16.1.1.1
Enabling the Transmitter
The EUSART transmitter is enabled for asynchronous
operations by configuring the following three control
bits:
• TXEN = 1
• SYNC = 0
• SPEN = 1
The TXxIF interrupt can be enabled by setting the
TXxIE interrupt enable bit of the PIE1/PIE3 register.
However, the TXxIF flag bit will be set whenever the
TXREGx is empty, regardless of the state of TXxIE
enable bit.
All other EUSART control bits are assumed to be in
their default state.
To use interrupts when transmitting data, set the TXxIE
bit only when there is more data to send. Clear the
TXxIE interrupt enable bit upon writing the last
character of the transmission to the TXREGx.
Setting the TXEN bit of the TXSTAx register enables the
transmitter circuitry of the EUSART. Clearing the SYNC
bit of the TXSTAx register configures the EUSART for
asynchronous operation. Setting the SPEN bit of the
RCSTAx register enables the EUSART and
automatically configures the TXx/CKx I/O pin as an
output. If the TXx/CKx pin is shared with an analog
peripheral the analog I/O function must be disabled by
clearing the corresponding ANSEL bit.
Note:
The TXxIF transmitter interrupt flag is set
when the TXEN enable bit is set.
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 267
PIC18(L)F2X/4XK22
16.1.1.5
TSR Status
16.1.1.7
Asynchronous Transmission Set-up:
The TRMT bit of the TXSTAx register indicates the
status of the TSR register. This is a read-only bit. The
TRMT bit is set when the TSR register is empty and is
cleared when a character is transferred to the TSR
register from the TXREGx. The TRMT bit remains clear
until all bits have been shifted out of the TSR register.
No interrupt logic is tied to this bit, so the user needs to
poll this bit to determine the TSR status.
1. Initialize the SPBRGHx:SPBRGx register pair
and the BRGH and BRG16 bits to achieve the
desired baud rate (see Section 16.3 “EUSART
Baud Rate Generator (BRG)”).
2. Set the RXx/DTx and TXx/CKx TRIS controls to
‘1’.
3. Enable the asynchronous serial port by clearing
the SYNC bit and setting the SPEN bit.
Note:
The TSR register is not mapped in data
memory, so it is not available to the user.
4. If 9-bit transmission is desired, set the TX9 con-
trol bit. A set ninth data bit will indicate that the 8
Least Significant data bits are an address when
the receiver is set for address detection.
16.1.1.6
Transmitting 9-Bit Characters
The EUSART supports 9-bit character transmissions.
When the TX9 bit of the TXSTAx register is set the
EUSART will shift 9 bits out for each character transmit-
ted. The TX9D bit of the TXSTAx register is the ninth,
and Most Significant, data bit. When transmitting 9-bit
data, the TX9D data bit must be written before writing
the 8 Least Significant bits into the TXREGx. All nine
bits of data will be transferred to the TSR shift register
immediately after the TXREGx is written.
5. Set the CKTXP control bit if inverted transmit
data polarity is desired.
6. Enable the transmission by setting the TXEN
control bit. This will cause the TXxIF interrupt bit
to be set.
7. If interrupts are desired, set the TXxIE interrupt
enable bit. An interrupt will occur immediately
provided that the GIE/GIEH and PEIE/GIEL bits
of the INTCON register are also set.
A special 9-bit Address mode is available for use with
multiple receivers. See Section 16.1.2.8 “Address
Detection” for more information on the Address mode.
8. If 9-bit transmission is selected, the ninth bit
should be loaded into the TX9D data bit.
9. Load 8-bit data into the TXREGx register. This
will start the transmission.
FIGURE 16-3:
ASYNCHRONOUS TRANSMISSION
Write to TXREGx
Word 1
BRG Output
(Shift Clock)
TXx/CKx pin
Start bit
bit 0
bit 1
Word 1
bit 7/8
Stop bit
TXxIF bit
(Transmit Buffer
Reg. Empty Flag)
1 TCY
Word 1
Transmit Shift Reg
TRMT bit
(Transmit Shift
Reg. Empty Flag)
DS41412A-page 268
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
FIGURE 16-4:
ASYNCHRONOUS TRANSMISSION (BACK-TO-BACK)
Write to TXREGx
Word 2
Start bit
Word 1
BRG Output
(Shift Clock)
TXx/CKx
pin
Start bit
bit 0
bit 1
bit 7/8
bit 0
Stop bit
Word 2
1 TCY
Word 2
Word 1
TXxIF bit
(Interrupt Reg. Flag)
1 TCY
TRMT bit
(Transmit Shift
Reg. Empty Flag)
Word 1
Transmit Shift Reg
Transmit Shift Reg
Note:
This timing diagram shows two consecutive transmissions.
TABLE 16-1: REGISTERS ASSOCIATED WITH ASYNCHRONOUS TRANSMISSION
Reset
Values
on
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Page
BAUDCON1
BAUDCON2
INTCON
IPR1
ABDOVF
ABDOVF
RCIDL
RCIDL
DTRXP
DTRXP
CKTXP
CKTXP
INT0IE
TX1IP
TX2IP
TX1IE
TX2IE
TX1IF
TX2IF
BRG16
BRG16
RBIE
—
WUE
WUE
ABDEN
ABDEN
RBIF
276
276
115
127
129
123
125
118
120
56
—
GIE/GIEH PEIE/GIEL TMR0IE
TMR0IF
CCP1IP
INT0IF
TMR2IP
—
SSP2IP
—
ADIP
BCL2IP
ADIE
RC1IP
RC2IP
RC1IE
RC2IE
RC1IF
RC2IF
SSP1IP
TMR1IP
IPR3
CTMUIP TMR5GIP TMR3GIP TMR1GIP
SSP1IE CCP1IE TMR2IE TMR1IE
CTMUIE TMR5GIE TMR3GIE TMR1GIE
SSP1IF CCP1IF TMR2IF TMR1IF
CTMUIF TMR5GIF TMR3GIF TMR1GIF
PIE1
PIE3
SSP2IE
—
BCL2IE
ADIF
PIR1
PIR3
SSP2IF
BCL2IF
PMD0
UART2MD UART1MD TMR6MD TMR5MD TMR4MD TMR3MD TMR2MD TMR1MD
RCSTA1
RCSTA2
SPBRG1
SPBRGH1
SPBRG2
SPBRGH2
TXREG1
TXSTA1
TXREG2
TXSTA2
SPEN
SPEN
RX9
RX9
SREN
SREN
CREN
CREN
ADDEN
ADDEN
FERR
FERR
OERR
OERR
RX9D
RX9D
275
275
—
EUSART1 Baud Rate Generator, Low Byte
EUSART1 Baud Rate Generator, High Byte
EUSART2 Baud Rate Generator, Low Byte
EUSART2 Baud Rate Generator, High Byte
EUSART1 Transmit Register
—
—
—
—
CSRC
CSRC
TX9
TX9
TXEN
SYNC
EUSART2 Transmit Register
SYNC SENDB
SENDB
BRGH
TRMT
TRMT
TX9D
TX9D
274
—
TXEN
BRGH
274
Legend: — = unimplemented locations, read as ‘0’. Shaded bits are not used for asynchronous transmission.
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 269
PIC18(L)F2X/4XK22
16.1.2
EUSART ASYNCHRONOUS
RECEIVER
16.1.2.2
Receiving Data
The receiver data recovery circuit initiates character
reception on the falling edge of the first bit. The first bit,
also known as the Start bit, is always a zero. The data
recovery circuit counts one-half bit time to the center of
the Start bit and verifies that the bit is still a zero. If it is
not a zero then the data recovery circuit aborts
character reception, without generating an error, and
resumes looking for the falling edge of the Start bit. If
the Start bit zero verification succeeds then the data
recovery circuit counts a full bit time to the center of the
next bit. The bit is then sampled by a majority detect
circuit and the resulting ‘0’ or ‘1’ is shifted into the RSR.
This repeats until all data bits have been sampled and
shifted into the RSR. One final bit time is measured and
the level sampled. This is the Stop bit, which is always
a ‘1’. If the data recovery circuit samples a ‘0’ in the
Stop bit position then a framing error is set for this
character, otherwise the framing error is cleared for this
character. See Section 16.1.2.5 “Receive Framing
Error” for more information on framing errors.
The Asynchronous mode would typically be used in
RS-232 systems. The receiver block diagram is shown
in Figure 16-2. The data is received on the RXx/DTx
pin and drives the data recovery block. The data
recovery block is actually
a high-speed shifter
operating at 16 times the baud rate, whereas the serial
Receive Shift Register (RSR) operates at the bit rate.
When all 8 or 9 bits of the character have been shifted
in, they are immediately transferred to a two character
First-In-First-Out (FIFO) memory. The FIFO buffering
allows reception of two complete characters and the
start of a third character before software must start
servicing the EUSART receiver. The FIFO and RSR
registers are not directly accessible by software.
Access to the received data is via the RCREGx
register.
16.1.2.1
Enabling the Receiver
The EUSART receiver is enabled for asynchronous
operation by configuring the following three control bits:
Immediately after all data bits and the Stop bit have
been received, the character in the RSR is transferred
to the EUSART receive FIFO and the RCxIF interrupt
flag bit of the PIR1/PIR3 register is set. The top charac-
ter in the FIFO is transferred out of the FIFO by reading
the RCREGx register.
• CREN = 1
• SYNC = 0
• SPEN = 1
All other EUSART control bits are assumed to be in
their default state.
Note:
If the receive FIFO is overrun, no additional
characters will be received until the overrun
condition is cleared. See Section 16.1.2.6
“Receive Overrun Error” for more
information on overrun errors.
Setting the CREN bit of the RCSTAx register enables
the receiver circuitry of the EUSART. Clearing the
SYNC bit of the TXSTAx register configures the
EUSART for asynchronous operation. Setting the
SPEN bit of the RCSTAx register enables the
EUSART. The RXx/DTx I/O pin must be configured as
an input by setting the corresponding TRIS control bit.
If the RXx/DTx pin is shared with an analog peripheral
the analog I/O function must be disabled by clearing
the corresponding ANSEL bit.
16.1.2.3
Receive Data Polarity
The polarity of the receive data can be controlled with
the DTRXP bit of the BAUDCONx register. The default
state of this bit is ‘0’ which selects high true receive idle
and data bits. Setting the DTRXP bit to ‘1’ will invert the
receive data resulting in low true idle and data bits. The
DTRXP bit controls receive data polarity only in Asyn-
chronous mode. In Synchronous mode the DTRXP bit
has a different function.
DS41412A-page 270
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
16.1.2.4
Receive Interrupts
16.1.2.7
Receiving 9-bit Characters
The RCxIF interrupt flag bit of the PIR1/PIR3 register is
set whenever the EUSART receiver is enabled and
there is an unread character in the receive FIFO. The
RCxIF interrupt flag bit is read-only, it cannot be set or
cleared by software.
The EUSART supports 9-bit character reception. When
the RX9 bit of the RCSTAx register is set, the EUSART
will shift 9 bits into the RSR for each character
received. The RX9D bit of the RCSTAx register is the
ninth and Most Significant data bit of the top unread
character in the receive FIFO. When reading 9-bit data
from the receive FIFO buffer, the RX9D data bit must
be read before reading the 8 Least Significant bits from
the RCREGx.
RCxIF interrupts are enabled by setting the following
bits:
• RCxIE interrupt enable bit of the PIE1/PIE3
register
16.1.2.8
Address Detection
• PEIE/GIEL peripheral interrupt enable bit of the
INTCON register
A special Address Detection mode is available for use
when multiple receivers share the same transmission
line, such as in RS-485 systems. Address detection is
enabled by setting the ADDEN bit of the RCSTAx
register.
• GIE/GIEH global interrupt enable bit of the
INTCON register
The RCxIF interrupt flag bit will be set when there is an
unread character in the FIFO, regardless of the state of
interrupt enable bits.
Address detection requires 9-bit character reception.
When address detection is enabled, only characters
with the ninth data bit set will be transferred to the
receive FIFO buffer, thereby setting the RCxIF interrupt
bit. All other characters will be ignored.
16.1.2.5
Receive Framing Error
Each character in the receive FIFO buffer has a
corresponding framing error Status bit. A framing error
indicates that a Stop bit was not seen at the expected
time. The framing error status is accessed via the
FERR bit of the RCSTAx register. The FERR bit
represents the status of the top unread character in the
receive FIFO. Therefore, the FERR bit must be read
before reading the RCREG.x
Upon receiving an address character, user software
determines if the address matches its own. Upon
address match, user software must disable address
detection by clearing the ADDEN bit before the next
Stop bit occurs. When user software detects the end of
the message, determined by the message protocol
used, software places the receiver back into the
Address Detection mode by setting the ADDEN bit.
The FERR bit is read-only and only applies to the top
unread character in the receive FIFO. A framing error
(FERR = 1) does not preclude reception of additional
characters. It is not necessary to clear the FERR bit.
Reading the next character from the FIFO buffer will
advance the FIFO to the next character and the next
corresponding framing error.
The FERR bit can be forced clear by clearing the SPEN
bit of the RCSTAx register which resets the EUSART.
Clearing the CREN bit of the RCSTAx register does not
affect the FERR bit. A framing error by itself does not
generate an interrupt.
Note:
If all receive characters in the receive
FIFO have framing errors, repeated reads
of the RCREGx will not clear the FERR bit.
16.1.2.6
Receive Overrun Error
The receive FIFO buffer can hold two characters. An
overrun error will be generated if a third character, in its
entirety, is received before the FIFO is accessed. When
this happens the OERR bit of the RCSTAx register is
set. The characters already in the FIFO buffer can be
read but no additional characters will be received until
the error is cleared. The error must be cleared by either
clearing the CREN bit of the RCSTAx register or by
resetting the EUSART by clearing the SPEN bit of the
RCSTAx register.
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 271
PIC18(L)F2X/4XK22
16.1.2.9
Asynchronous Reception Set-up:
16.1.2.10 9-bit Address Detection Mode Set-up
1. Initialize the SPBRGHx:SPBRGx register pair
and the BRGH and BRG16 bits to achieve the
desired baud rate (see Section 16.3 “EUSART
Baud Rate Generator (BRG)”).
This mode would typically be used in RS-485 systems.
To set up an Asynchronous Reception with Address
Detect Enable:
1. Initialize the SPBRGHx, SPBRGx register pair
and the BRGH and BRG16 bits to achieve the
desired baud rate (see Section 16.3 “EUSART
Baud Rate Generator (BRG)”).
2. Set the RXx/DTx and TXx/CKx TRIS controls to
‘1’.
3. Enable the serial port by setting the SPEN bit
and the RXx/DTx pin TRIS bit. The SYNC bit
must be clear for asynchronous operation.
2. Set the RXx/DTx and TXx/CKx TRIS controls to
‘1’.
4. If interrupts are desired, set the RCxIE interrupt
enable bit and set the GIE/GIEH and PEIE/GIEL
bits of the INTCON register.
3. Enable the serial port by setting the SPEN bit.
The SYNC bit must be clear for asynchronous
operation.
5. If 9-bit reception is desired, set the RX9 bit.
4. If interrupts are desired, set the RCxIE interrupt
enable bit and set the GIE/GIEH and PEIE/GIEL
bits of the INTCON register.
6. Set the DTRXP if inverted receive polarity is
desired.
7. Enable reception by setting the CREN bit.
5. Enable 9-bit reception by setting the RX9 bit.
8. The RCxIF interrupt flag bit will be set when a
character is transferred from the RSR to the
receive buffer. An interrupt will be generated if
the RCxIE interrupt enable bit was also set.
6. Enable address detection by setting the ADDEN
bit.
7. Set the DTRXP if inverted receive polarity is
desired.
9. Read the RCSTAx register to get the error flags
and, if 9-bit data reception is enabled, the ninth
data bit.
8. Enable reception by setting the CREN bit.
9. The RCxIF interrupt flag bit will be set when a
character with the ninth bit set is transferred
from the RSR to the receive buffer. An interrupt
will be generated if the RCxIE interrupt enable
bit was also set.
10. Get the received 8 Least Significant data bits
from the receive buffer by reading the RCREGx
register.
11. If an overrun occurred, clear the OERR flag by
clearing the CREN receiver enable bit.
10. Read the RCSTAx register to get the error flags.
The ninth data bit will always be set.
11. Get the received 8 Least Significant data bits
from the receive buffer by reading the RCREGx
register. Software determines if this is the
device’s address.
12. If an overrun occurred, clear the OERR flag by
clearing the CREN receiver enable bit.
13. If the device has been addressed, clear the
ADDEN bit to allow all received data into the
receive buffer and generate interrupts.
DS41412A-page 272
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
FIGURE 16-5:
ASYNCHRONOUS RECEPTION
Start
bit
Start
bit
Start
bit
RXx/DTx pin
bit 7/8
bit 7/8
bit 0 bit 1
Stop
bit
Stop
bit
Stop
bit
bit 0
bit 7/8
Rcv Shift
Reg
Rcv Buffer Reg
Word 2
RCREGx
Word 1
RCREGx
RCIDL
Read Rcv
Buffer Reg
RCREGx
RCxIF
(Interrupt Flag)
OERR bit
CREN
Note:
This timing diagram shows three words appearing on the RXx/DTx input. The RCREGx (receive buffer) is read after the third
word, causing the OERR (overrun) bit to be set.
TABLE 16-2: REGISTERS ASSOCIATED WITH ASYNCHRONOUS RECEPTION
Register
on Page
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
BAUDCON1
BAUDCON2
INTCON
IPR1
ABDOVF
ABDOVF
RCIDL
RCIDL
DTRXP
DTRXP
CKTXP
CKTXP
INT0IE
TX1IP
TX2IP
TX1IE
TX2IE
TX1IF
TX2IF
BRG16
BRG16
RBIE
—
WUE
WUE
ABDEN
ABDEN
RBIF
276
276
115
127
129
123
125
118
120
56
—
GIE/GIEH PEIE/GIEL TMR0IE
TMR0IF
CCP1IP
INT0IF
TMR2IP
—
SSP2IP
—
ADIP
BCL2IP
ADIE
RC1IP
RC2IP
RC1IE
RC2IE
RC1IF
RC2IF
SSP1IP
TMR1IP
IPR3
CTMUIP TMR5GIP TMR3GIP TMR1GIP
SSP1IE CCP1IE TMR2IE TMR1IE
CTMUIE TMR5GIE TMR3GIE TMR1GIE
SSP1IF CCP1IF TMR2IF TMR1IF
CTMUIF TMR5GIF TMR3GIF TMR1GIF
PIE1
PIE3
SSP2IE
—
BCL2IE
ADIF
PIR1
PIR3
SSP2IF
BCL2IF
PMD0
UART2MD UART1MD TMR6MD TMR5MD TMR4MD TMR3MD TMR2MD TMR1MD
EUSART1 Receive Register
RCREG1
RCSTA1
RCREG2
RCSTA2
SPBRG1
SPBRGH1
SPBRG2
SPBRGH2
—
SPEN
RX9
SREN
EUSART2 Receive Register
SREN CREN ADDEN
CREN
ADDEN
FERR
OERR
RX9D
275
—
SPEN
RX9
FERR
OERR
RX9D
275
—
EUSART1 Baud Rate Generator, Low Byte
EUSART1 Baud Rate Generator, High Byte
EUSART2 Baud Rate Generator, Low Byte
EUSART2 Baud Rate Generator, High Byte
—
—
—
(2)
TRISB
TRISB7
TRISC7
TRISD7
CSRC
TRISB6
TRISC6
TRISD6
TX9
TRISB5
TRISB4
TRISB3
TRISB2
TRISC2
TRISD2
BRGH
TRISB1
TRISC1
TRISD1
TRMT
TRISB0
TRISC0
TRISD0
TX9D
155
155
155
274
274
TRISC
TRISC5 TRISC4 TRISC3
TRISD5 TRISD4 TRISD3
(1)
TRISD
TXSTA1
TXSTA2
TXEN
TXEN
SYNC
SYNC
SENDB
SENDB
CSRC
TX9
BRGH
TRMT
TX9D
Legend: — = unimplemented locations, read as ‘0’. Shaded bits are not used for asynchronous reception.
Note 1: PIC18(L)F4XK22 devices.
2: PIC18(L)F2XK22 devices.
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 273
PIC18(L)F2X/4XK22
The first (preferred) method uses the OSCTUNE
register to adjust the HFINTOSC output. Adjusting the
value in the OSCTUNE register allows for fine resolution
changes to the system clock source. See Section 2.5
“Internal Clock Modes” for more information.
16.2 Clock Accuracy with
Asynchronous Operation
The factory calibrates the internal oscillator block
output (HFINTOSC). However, the HFINTOSC
frequency may drift as VDD or temperature changes,
and this directly affects the asynchronous baud rate.
Two methods may be used to adjust the baud rate
clock, but both require a reference clock source of
some kind.
The other method adjusts the value in the Baud Rate
Generator. This can be done automatically with the
Auto-Baud Detect feature (see Section 16.3.1 “Auto-
Baud Detect”). There may not be fine enough
resolution when adjusting the Baud Rate Generator to
compensate for a gradual change in the peripheral
clock frequency.
REGISTER 16-1: TXSTAX: TRANSMIT STATUS AND CONTROL REGISTER
R/W-0
CSRC
R/W-0
TX9
R/W-0
R/W-0
SYNC
R/W-0
R/W-0
BRGH
R-1
R/W-0
TX9D
(1)
TXEN
SENDB
TRMT
bit 7
bit 0
Legend:
R = Readable bit
-n = Value at POR
W = Writable bit
‘1’ = Bit is set
U = Unimplemented bit, read as ‘0’
‘0’ = Bit is cleared x = Bit is unknown
bit 7
CSRC: Clock Source Select bit
Asynchronous mode:
Don’t care
Synchronous mode:
1= Master mode (clock generated internally from BRG)
0= Slave mode (clock from external source)
bit 6
bit 5
bit 4
bit 3
TX9: 9-bit Transmit Enable bit
1= Selects 9-bit transmission
0= Selects 8-bit transmission
(1)
TXEN: Transmit Enable bit
1= Transmit enabled
0= Transmit disabled
SYNC: EUSART Mode Select bit
1= Synchronous mode
0= Asynchronous mode
SENDB: Send Break Character bit
Asynchronous mode:
1= Send Sync Break on next transmission (cleared by hardware upon completion)
0= Sync Break transmission completed
Synchronous mode:
Don’t care
bit 2
BRGH: High Baud Rate Select bit
Asynchronous mode:
1= High speed
0= Low speed
Synchronous mode:
Unused in this mode
bit 1
bit 0
TRMT: Transmit Shift Register Status bit
1= TSR empty
0= TSR full
TX9D: Ninth bit of Transmit Data
Can be address/data bit or a parity bit.
Note 1: SREN/CREN overrides TXEN in Sync mode.
DS41412A-page 274
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
REGISTER 16-2: RCSTAX: RECEIVE STATUS AND CONTROL REGISTER
R/W-0
SPEN
R/W-0
RX9
R/W-0
SREN
R/W-0
CREN
R/W-0
R-0
R-0
R-x
ADDEN
FERR
OERR
RX9D
bit 7
bit 0
Legend:
R = Readable bit
-n = Value at POR
W = Writable bit
‘1’ = Bit is set
U = Unimplemented bit, read as ‘0’
‘0’ = Bit is cleared x = Bit is unknown
bit 7
bit 6
bit 5
SPEN: Serial Port Enable bit
1= Serial port enabled (configures RXx/DTx and TXx/CKx pins as serial port pins)
0= Serial port disabled (held in Reset)
RX9: 9-bit Receive Enable bit
1= Selects 9-bit reception
0= Selects 8-bit reception
SREN: Single Receive Enable bit
Asynchronous mode:
Don’t care
Synchronous mode – Master:
1= Enables single receive
0= Disables single receive
This bit is cleared after reception is complete.
Synchronous mode – Slave
Don’t care
bit 4
CREN: Continuous Receive Enable bit
Asynchronous mode:
1= Enables receiver
0= Disables receiver
Synchronous mode:
1= Enables continuous receive until enable bit CREN is cleared (CREN overrides SREN)
0= Disables continuous receive
bit 3
ADDEN: Address Detect Enable bit
Asynchronous mode 9-bit (RX9 = 1):
1= Enables address detection, enable interrupt and load the receive buffer when RSR<8> is set
0= Disables address detection, all bytes are received and ninth bit can be used as parity bit
Asynchronous mode 8-bit (RX9 = 0):
Don’t care
bit 2
bit 1
bit 0
FERR: Framing Error bit
1= Framing error (can be updated by reading RCREGx register and receive next valid byte)
0= No framing error
OERR: Overrun Error bit
1= Overrun error (can be cleared by clearing bit CREN)
0= No overrun error
RX9D: Ninth bit of Received Data
This can be address/data bit or a parity bit and must be calculated by user firmware.
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 275
PIC18(L)F2X/4XK22
REGISTER 16-3: BAUDCONX: BAUD RATE CONTROL REGISTER
R/W-0
R-1
R/W-0
R/W-0
R/W-0
U-0
—
R/W-0
WUE
R/W-0
ABDOVF
RCIDL
DTRXP
CKTXP
BRG16
ABDEN
bit 7
bit 0
Legend:
R = Readable bit
-n = Value at POR
W = Writable bit
‘1’ = Bit is set
U = Unimplemented bit, read as ‘0’
‘0’ = Bit is cleared x = Bit is unknown
bit 7
bit 6
bit 5
ABDOVF: Auto-Baud Detect Overflow bit
Asynchronous mode:
1= Auto-baud timer overflowed
0= Auto-baud timer did not overflow
Synchronous mode:
Don’t care
RCIDL: Receive Idle Flag bit
Asynchronous mode:
1= Receiver is Idle
0= Start bit has been detected and the receiver is active
Synchronous mode:
Don’t care
DTRXP: Data/Receive Polarity Select bit
Asynchronous mode:
1= Receive data (RXx) is inverted (active-low)
0= Receive data (RXx) is not inverted (active-high)
Synchronous mode:
1= Data (DTx) is inverted (active-low)
0= Data (DTx) is not inverted (active-high)
bit 4
CKTXP: Clock/Transmit Polarity Select bit
Asynchronous mode:
1= Idle state for transmit (TXx) is low
0= Idle state for transmit (TXx) is high
Synchronous mode:
1= Data changes on the falling edge of the clock and is sampled on the rising edge of the clock
0= Data changes on the rising edge of the clock and is sampled on the falling edge of the clock
bit 3
BRG16: 16-bit Baud Rate Generator bit
1= 16-bit Baud Rate Generator is used (SPBRGHx:SPBRGx)
0= 8-bit Baud Rate Generator is used (SPBRGx)
bit 2
bit 1
Unimplemented: Read as ‘0’
WUE: Wake-up Enable bit
Asynchronous mode:
1= Receiver is waiting for a falling edge. No character will be received but RCxIF will be set on the falling
edge. WUE will automatically clear on the rising edge.
0= Receiver is operating normally
Synchronous mode:
Don’t care
bit 0
ABDEN: Auto-Baud Detect Enable bit
Asynchronous mode:
1= Auto-Baud Detect mode is enabled (clears when auto-baud is complete)
0= Auto-Baud Detect mode is disabled
Synchronous mode:
Don’t care
DS41412A-page 276
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
If the system clock is changed during an active receive
operation, a receive error or data loss may result. To
avoid this problem, check the status of the RCIDL bit to
make sure that the receive operation is Idle before
changing the system clock.
16.3 EUSART Baud Rate Generator
(BRG)
The Baud Rate Generator (BRG) is an 8-bit or 16-bit
timer that is dedicated to the support of both the
asynchronous and synchronous EUSART operation.
By default, the BRG operates in 8-bit mode. Setting the
BRG16 bit of the BAUDCONx register selects 16-bit
mode.
EXAMPLE 16-1:
CALCULATING BAUD
RATE ERROR
For a device with FOSC of 16 MHz, desired baud rate
of 9600, Asynchronous mode, 8-bit BRG:
The SPBRGHx:SPBRGx register pair determines the
period of the free running baud rate timer. In
Asynchronous mode the multiplier of the baud rate
period is determined by both the BRGH bit of the
TXSTAx register and the BRG16 bit of the BAUDCONx
register. In Synchronous mode, the BRGH bit is ignored.
FOSC
Desired Baud Rate = -------------------------------------------------------------------------
64[SPBRGHx:SPBRGx] + 1
Solving for SPBRGHx:SPBRGx:
FOSC
---------------------------------------------
Desired Baud Rate
X = --------------------------------------------- – 1
64
Table contains the formulas for determining the baud
rate. Example 16-1 provides a sample calculation for
determining the baud rate and baud rate error.
16000000
-----------------------
9600
Typical baud rates and error values for various
Asynchronous modes have been computed for your
convenience and are shown in Table 16-5. It may be
advantageous to use the high baud rate (BRGH = 1),
or the 16-bit BRG (BRG16 = 1) to reduce the baud rate
error. The 16-bit BRG mode is used to achieve slow
baud rates for fast oscillator frequencies.
= ----------------------- – 1
64
= 25.042 = 25
16000000
Calculated Baud Rate = --------------------------
6425 + 1
= 9615
Writing a new value to the SPBRGHx, SPBRGx
register pair causes the BRG timer to be reset (or
cleared). This ensures that the BRG does not wait for a
timer overflow before outputting the new baud rate.
Calc. Baud Rate – Desired Baud Rate
Error = --------------------------------------------------------------------------------------------
Desired Baud Rate
9615 – 9600
= ---------------------------------- = 0 . 1 6 %
9600
TABLE 16-3: BAUD RATE FORMULAS
Configuration Bits
Baud Rate Formula
BRG/EUSART Mode
SYNC
BRG16
BRGH
0
0
0
0
1
1
0
0
1
1
0
1
0
1
0
1
x
x
8-bit/Asynchronous
8-bit/Asynchronous
16-bit/Asynchronous
16-bit/Asynchronous
8-bit/Synchronous
16-bit/Synchronous
FOSC/[64 (n+1)]
FOSC/[16 (n+1)]
FOSC/[4 (n+1)]
Legend:
x= Don’t care, n = value of SPBRGHx, SPBRGx register pair.
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 277
PIC18(L)F2X/4XK22
TABLE 16-4: REGISTERS ASSOCIATED WITH BAUD RATE GENERATOR
Reset
Values
on Page
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
BAUDCON1 ABDOVF
BAUDCON2 ABDOVF
RCIDL
RCIDL
DTRXP
DTRXP
CKTXP
CKTXP
BRG16
BRG16
—
—
WUE
WUE
ABDEN
ABDEN
276
276
56
PMD0
UART2MD UART1MD TMR6MD TMR5MD TMR4MD TMR3MD TMR2MD TMR1MD
RCSTA1
RCSTA2
SPBRG1
SPBRGH1
SPBRG2
SPBRGH2
PIR1
SPEN
SPEN
RX9
RX9
SREN
SREN
CREN
CREN
ADDEN
ADDEN
FERR
FERR
OERR
OERR
RX9D
RX9D
275
275
—
EUSART1 Baud Rate Generator, Low Byte
EUSART1 Baud Rate Generator, High Byte
EUSART2 Baud Rate Generator, Low Byte
EUSART2 Baud Rate Generator, High Byte
—
—
—
—
ADIF
BCL2IF
TX9
RC1IF
RC2IF
TXEN
TXEN
TX1IF
TX2IF
SYNC
SYNC
SSP1IF
CCP1IF
TMR2IF
TMR1IF
118
120
274
274
PIR3
SSP2IF
CSRC
CSRC
CTMUIF TMR5GIF TMR3GIF TMR1GIF
TXSTA1
TXSTA2
SENDB
SENDB
BRGH
BRGH
TRMT
TRMT
TX9D
TX9D
TX9
Legend: — = unimplemented, read as ‘0’. Shaded bits are not used by the BRG.
TABLE 16-5: BAUD RATES FOR ASYNCHRONOUS MODES
SYNC = 0, BRGH = 0, BRG16 = 0
FOSC = 64.000 MHz
FOSC = 18.432 MHz
FOSC = 16.000 MHz
FOSC = 11.0592 MHz
BAUD
RATE
SPBRxG
SPBRGx
SPBRGx
SPBRGx
value
Actual
Rate
%
Actual
Rate
%
Actual
Rate
%
Actual
Rate
%
Error
value
(decimal)
value
(decimal)
value
(decimal)
Error
Error
Error
(decimal)
300
1200
—
—
—
—
—
—
—
—
—
239
119
29
27
14
7
—
1202
2404
9615
10417
19.23k
—
—
—
207
103
25
—
—
—
143
71
17
16
8
1200
2400
9600
10286
19.20k
57.60k
—
0.00
0.00
0.00
-1.26
0.00
0.00
—
0.16
0.16
0.16
0.00
0.16
—
1200
2400
9600
10165
19.20k
57.60k
—
0.00
0.00
0.00
-2.42
0.00
0.00
—
2400
—
—
—
9600
9615
10417
19.23k
58.82k
111.11k
0.16
0.00
0.16
2.12
-3.55
103
95
51
16
8
10417
19.2k
57.6k
115.2k
23
12
—
2
—
—
—
—
—
SYNC = 0, BRGH = 0, BRG16 = 0
FOSC = 4.000 MHz FOSC = 3.6864 MHz
FOSC = 8.000 MHz
FOSC = 1.000 MHz
BAUD
RATE
SPBRGx
SPBRGx
SPBRGx
value
SPBRGx
Actual
Rate
%
Actual
Rate
%
Actual
Rate
%
Actual
Rate
%
value
(decimal)
value
(decimal)
value
(decimal)
Error
Error
Error
Error
(decimal)
0.00
0.00
0.00
0.00
—
300
1200
—
1202
2404
9615
10417
—
—
0.16
0.16
0.16
0.00
—
—
103
51
12
11
300
1202
2404
—
0.16
0.16
0.16
—
207
51
25
—
5
300
1200
2400
9600
—
191
47
23
5
300
1202
—
0.16
0.16
—
51
12
—
—
—
—
—
—
2400
9600
—
—
10417
19.2k
57.6k
115.2k
10417
—
0.00
—
—
2
—
—
—
—
—
—
19.20k
57.60k
—
0.00
0.00
—
—
—
—
—
—
—
—
0
—
—
—
—
—
—
—
—
—
—
DS41412A-page 278
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
TABLE 16-5: BAUD RATES FOR ASYNCHRONOUS MODES (CONTINUED)
SYNC = 0, BRGH = 1, BRG16 = 0
FOSC = 18.432 MHz FOSC = 16.000 MHz
FOSC = 64.000 MHz
FOSC = 11.0592 MHz
BAUD
RATE
SPBRGx
SPBRGx
value
SPBRGx
value
SPBRGx
Actual
Rate
%
Actual
Rate
%
Error
Actual
Rate
%
Error
Actual
Rate
%
value
(decimal)
value
(decimal)
Error
Error
(decimal)
(decimal)
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
71
65
35
11
5
300
1200
—
—
—
—
2400
—
—
—
—
—
—
—
—
—
—
—
9600
—
—
—
9600
10378
19.20k
57.60k
115.2k
0.00
-0.37
0.00
0.00
0.00
119
110
59
19
9
9615
10417
19.23k
58.82k
111.1k
0.16
0.00
0.16
2.12
-3.55
103
95
51
16
8
9600
10473
19.20k
57.60k
115.2k
0.00
0.53
0.00
0.00
0.00
10417
19.2k
57.6k
115.2k
—
—
—
19.23k
57.97k
114.29k
0.16
0.64
-0.79
207
68
34
SYNC = 0, BRGH = 1, BRG16 = 0
FOSC = 4.000 MHz FOSC = 3.6864 MHz
FOSC = 8.000 MHz
FOSC = 1.000 MHz
BAUD
RATE
SPBRGx
SPBRGx
SxBRGx
value
SPBRGx
Actual
Rate
%
Actual
Rate
%
Actual
Rate
%
Actual
Rate
%
value
(decimal)
value
(decimal)
value
(decimal)
Error
Error
Error
Error
(decimal)
—
—
—
—
—
300
1200
—
1202
2404
9615
10417
19.23k
—
—
—
207
103
25
—
—
—
191
95
23
21
11
3
300
1202
2404
—
0.16
0.16
0.16
—
207
51
25
—
5
—
0.16
0.16
0.16
0.00
0.16
—
1200
0.00
0.00
0.00
0.53
0.00
0.00
0.00
2400
2404
9615
10417
19231
55556
—
0.16
0.16
0.00
0.16
-3.55
—
207
51
47
25
8
2400
9600
9600
10417
19.2k
57.6k
115.2k
23
10473
19.2k
57.60k
115.2k
10417
—
0.00
—
12
—
—
—
—
—
—
—
—
—
—
1
—
—
SYNC = 0, BRGH = 0, BRG16 = 1
FOSC = 18.432 MHz FOSC = 16.000 MHz
FOSC = 64.000 MHz
FOSC = 11.0592 MHz
BAUD
RATE
SPBRGHx:
SPBRGHx:
SPBRGHx
:SPBRGx
(decimal)
SPBRGHx:
Actual
Rate
%
Actual
Rate
%
Actual
Rate
%
Actual
Rate
%
SPBRGx
(decimal)
SPBRGx
(decimal)
SPBRGx
(decimal)
Error
Error
Error
Error
300
1200
300.0
1200.1
2399
0.00
0.01
-0.02
-0.08
0.00
0.16
0.64
-0.79
13332
3332
1666
416
383
207
68
300.0
1200
0.00
0.00
0.00
0.00
-0.37
0.00
0.00
0.00
3839
959
479
119
110
59
300.03
1200.5
2398
0.01
0.04
-0.08
0.16
0.00
0.16
2.12
-3.55
3332
832
416
103
95
300.0
1200
0.00
0.00
0.00
0.00
0.53
0.00
0.00
0.00
2303
575
287
71
2400
2400
2400
9600
9592
9600
9615
9600
10417
19.2k
57.6k
115.2k
10417
19.23k
57.97k
114.29k
10378
19.20k
57.60k
115.2k
10417
19.23k
58.82k
111.11k
10473
19.20k
57.60k
115.2k
65
51
35
19
16
11
34
9
8
5
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 279
PIC18(L)F2X/4XK22
TABLE 16-5: BAUD RATES FOR ASYNCHRONOUS MODES (CONTINUED)
SYNC = 0, BRGH = 0, BRG16 = 1
FOSC = 8.000 MHz
FOSC = 4.000 MHz
FOSC = 3.6864 MHz
FOSC = 1.000 MHz
BAUD
RATE
SPBRGHx:
SPBRGHx:
SPBRGHx
SPBRGHx:
Actual
Rate
%
Actual
Rate
%
Actual
Rate
%
Actual
Rate
%
SPBRGx
(decimal)
SPBRGx
(decimal)
:SPBRGx
(decimal)
SPBRGx
(decimal)
Error
Error
Error
Error
300
1200
299.9
1199
-0.02
-0.08
0.16
0.16
0.00
0.16
-3.55
—
1666
416
207
51
300.1
1202
2404
9615
10417
19.23k
—
0.04
0.16
0.16
0.16
0.00
0.16
—
832
207
103
25
300.0
1200
0.00
0.00
0.00
0.00
0.53
0.00
0.00
0.00
767
191
95
23
21
11
3
300.5
1202
2404
—
0.16
0.16
0.16
—
207
51
25
—
5
2400
2404
9615
10417
19.23k
55556
—
2400
9600
9600
10417
19.2k
57.6k
115.2k
47
23
10473
19.20k
57.60k
115.2k
10417
—
0.00
—
25
12
—
—
—
8
—
—
—
—
—
—
—
1
—
—
SYNC = 0, BRGH = 1, BRG16 = 1 or SYNC = 1, BRG16 = 1
FOSC = 18.432 MHz FOSC = 16.000 MHz
FOSC = 64.000 MHz
FOSC = 11.0592 MHz
BAUD
RATE
SPBRGHx:
SPBRGHx:
SPBRGHx
SPBRGHx:
Actual
Rate
%
Actual
Rate
%
Actual
Rate
%
Actual
Rate
%
SPBRGx
(decimal)
SPBRGx
(decimal)
:SPBRGx
(decimal)
SPBRGx
(decimal)
Error
Error
Error
Error
300
1200
300
1200
0.00
0.00
0.00
-0.02
0.00
0.04
-0.08
-0.08
53332
13332
6666
1666
1535
832
300.0
1200
0.00
0.00
0.00
0.00
0.08
0.00
0.00
0.00
15359
3839
1919
479
441
239
79
300.0
1200.1
2399.5
9592
0.00
0.01
-0.02
-0.08
0.00
0.16
0.64
-0.79
13332
3332
1666
416
383
207
68
300.0
1200
0.00
0.00
0.00
0.00
0.16
0.00
0.00
0.00
9215
2303
1151
287
264
143
47
2400
2400
2400
2400
9600
9598.1
10417
19.21k
57.55k
115.11k
9600
9600
10417
19.2k
57.6k
115.2k
10425
19.20k
57.60k
115.2k
10417
19.23k
57.97k
114.29k
10433
19.20k
57.60k
115.2k
277
138
39
34
23
SYNC = 0, BRGH = 1, BRG16 = 1 or SYNC = 1, BRG16 = 1
FOSC = 4.000 MHz FOSC = 3.6864 MHz
FOSC = 8.000 MHz
FOSC = 1.000 MHz
BAUD
RATE
SPBRGHx:
SPBRGHx:
SPBRGHx
SPBRGHx:
Actual
Rate
%
Actual
Rate
%
Actual
Rate
%
Actual
Rate
%
SPBRGx
(decimal)
SPBRGx
(decimal)
:SPBRGx
(decimal)
SPBRGx
(decimal)
Error
Error
Error
Error
300
1200
300.0
1200
0.00
-0.02
0.04
0.16
0.00
0.16
-0.79
2.12
6666
1666
832
207
191
103
34
300.0
1200
0.01
0.04
0.08
0.16
0.00
0.16
2.12
-3.55
3332
832
416
103
95
300.0
1200
0.00
0.00
0.00
0.00
0.53
0.00
0.00
0.00
3071
767
383
95
300.1
1202
2404
9615
10417
19.23k
—
0.04
0.16
0.16
0.16
0.00
0.16
—
832
207
103
25
2400
2401
2398
2400
9600
9615
9615
9600
10417
19.2k
57.6k
115.2k
10417
19.23k
57.14k
117.6k
10417
19.23k
58.82k
111.1k
10473
19.20k
57.60k
115.2k
87
23
51
47
12
16
15
—
16
8
7
—
—
—
DS41412A-page 280
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
and SPBRGx registers are clocked at 1/8th the BRG
base clock rate. The resulting byte measurement is the
average bit time when clocked at full speed.
16.3.1
AUTO-BAUD DETECT
The EUSART module supports automatic detection
and calibration of the baud rate.
Note 1: If the WUE bit is set with the ABDEN bit,
auto-baud detection will occur on the byte
following the Break character (see
In the Auto-Baud Detect (ABD) mode, the clock to the
BRG is reversed. Rather than the BRG clocking the
incoming RXx signal, the RXx signal is timing the BRG.
The Baud Rate Generator is used to time the period of
a received 55h (ASCII “U”) which is the Sync character
for the LIN bus. The unique feature of this character is
that it has five rising edges including the Stop bit edge.
Section 16.3.3
“Auto-Wake-up
on
Break”).
2: It is up to the user to determine that the
incoming character baud rate is within the
range of the selected BRG clock source.
Some combinations of oscillator frequency
and EUSART baud rates are not possible.
Setting the ABDEN bit of the BAUDCONx register
starts
the
auto-baud
calibration
sequence
(Figure 16.3.2). While the ABD sequence takes place,
the EUSART state machine is held in Idle. On the first
rising edge of the receive line, after the Start bit, the
SPBRGx begins counting up using the BRG counter
clock as shown in Table 16-6. The fifth rising edge will
occur on the RXx/DTx pin at the end of the eighth bit
period. At that time, an accumulated value totaling the
proper BRG period is left in the SPBRGHx:SPBRGx
register pair, the ABDEN bit is automatically cleared,
and the RCxIF interrupt flag is set. A read operation on
the RCREGx needs to be performed to clear the RCxIF
interrupt. RCREGx content should be discarded. When
calibrating for modes that do not use the SPBRGHx
register the user can verify that the SPBRGx register
did not overflow by checking for 00h in the SPBRGHx
register.
3: During the auto-baud process, the auto-
baud counter starts counting at 1. Upon
completion of the auto-baud sequence, to
achieve maximum accuracy, subtract 1
from the SPBRGHx:SPBRGx register pair.
TABLE 16-6: BRG COUNTER CLOCK
RATES
BRG Base
Clock
BRG ABD
Clock
BRG16 BRGH
0
0
0
1
FOSC/64
FOSC/16
FOSC/512
FOSC/128
1
1
0
1
FOSC/16
FOSC/4
FOSC/128
FOSC/32
The BRG auto-baud clock is determined by the BRG16
and BRGH bits as shown in Table 16-6. During ABD,
both the SPBRGHx and SPBRGx registers are used as
a 16-bit counter, independent of the BRG16 bit setting.
While calibrating the baud rate period, the SPBRGHx
Note:
During the ABD sequence, SPBRGx and
SPBRGHx registers are both used as a
16-bit counter, independent of BRG16
setting.
FIGURE 16-6:
AUTOMATIC BAUD RATE CALIBRATION
XXXXh
0000h
001Ch
BRG Value
Edge #1
bit 1
Edge #2
bit 3
Edge #3
bit 5
Edge #4
bit 7
bit 6
Edge #5
Stop bit
RXx/DTx pin
BRG Clock
Start
bit 0
bit 2
bit 4
Auto Cleared
Set by User
ABDEN bit
RCIDL
RCxIF bit
(Interrupt)
Read
RCREGx
XXh
XXh
1Ch
00h
SPBRGx
SPBRGHx
Note 1: The ABD sequence requires the EUSART module to be configured in Asynchronous mode.
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 281
PIC18(L)F2X/4XK22
16.3.2
AUTO-BAUD OVERFLOW
16.3.3.1
Special Considerations
During the course of automatic baud detection, the
ABDOVF bit of the BAUDCONx register will be set if the
baud rate counter overflows before the fifth rising edge
is detected on the RX pin. The ABDOVF bit indicates
that the counter has exceeded the maximum count that
can fit in the 16 bits of the SPBRGHx:SPBRGx register
pair. After the ABDOVF has been set, the counter con-
tinues to count until the fifth rising edge is detected on
the RXx/DTx pin. Upon detecting the fifth RXx/DTx
edge, the hardware will set the RCxIF interrupt flag and
clear the ABDEN bit of the BAUDCONx register. The
RCxIF flag can be subsequently cleared by reading the
RCREGx. The ABDOVF flag can be cleared by soft-
ware directly.
Break Character
To avoid character errors or character fragments during
a wake-up event, the wake-up character must be all
zeros.
When the wake-up is enabled the function works
independent of the low time on the data stream. If the
WUE bit is set and a valid non-zero character is
received, the low time from the Start bit to the first rising
edge will be interpreted as the wake-up event. The
remaining bits in the character will be received as a
fragmented character and subsequent characters can
result in framing or overrun errors.
Therefore, the initial character in the transmission must
be all ‘0’s. This must be 10 or more bit times, 13-bit
times recommended for LIN bus, or any number of bit
times for standard RS-232 devices.
To terminate the auto-baud process before the RCxIF
flag is set, clear the ABDEN bit then clear the ABDOVF
bit. The ABDOVF bit will remain set if the ABDEN bit is
not cleared first.
Oscillator Startup Time
Oscillator start-up time must be considered, especially
in applications using oscillators with longer start-up
intervals (i.e., LP, XT or HS/PLL mode). The Sync
Break (or wake-up signal) character must be of
sufficient length, and be followed by a sufficient
interval, to allow enough time for the selected oscillator
to start and provide proper initialization of the EUSART.
16.3.3
AUTO-WAKE-UP ON BREAK
During Sleep mode, all clocks to the EUSART are
suspended. Because of this, the Baud Rate Generator
is inactive and a proper character reception cannot be
performed. The Auto-Wake-up feature allows the
controller to wake-up due to activity on the RXx/DTx
line. This feature is available only in Asynchronous
mode.
WUE Bit
The wake-up event causes a receive interrupt by
setting the RCxIF bit. The WUE bit is cleared by
hardware by a rising edge on RXx/DTx. The interrupt
condition is then cleared by software by reading the
RCREGx register and discarding its contents.
The Auto-Wake-up feature is enabled by setting the
WUE bit of the BAUDCONx register. Once set, the
normal receive sequence on RXx/DTx is disabled, and
the EUSART remains in an Idle state, monitoring for a
wake-up event independent of the CPU mode. A wake-
up event consists of a high-to-low transition on the
RXx/DTx line. (This coincides with the start of a Sync
Break or a wake-up signal character for the LIN
protocol.)
To ensure that no actual data is lost, check the RCIDL
bit to verify that a receive operation is not in process
before setting the WUE bit. If a receive operation is not
occurring, the WUE bit may then be set just prior to
entering the Sleep mode.
The EUSART module generates an RCxIF interrupt
coincident with the wake-up event. The interrupt is
generated synchronously to the Q clocks in normal CPU
operating modes (Figure 16-7), and asynchronously if
the device is in Sleep mode (Figure 16-8). The interrupt
condition is cleared by reading the RCREGx register.
The WUE bit is automatically cleared by the low-to-high
transition on the RXx line at the end of the Break. This
signals to the user that the Break event is over. At this
point, the EUSART module is in Idle mode waiting to
receive the next character.
DS41412A-page 282
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
FIGURE 16-7:
AUTO-WAKE-UP BIT (WUE) TIMING DURING NORMAL OPERATION
Q1 Q2 Q3 Q4 Q1 Q2 Q3Q4 Q1Q2 Q3 Q4 Q1Q2 Q3 Q4 Q1Q2 Q3 Q4 Q1Q2 Q3 Q4 Q1Q2 Q3 Q4 Q1Q2 Q3Q4 Q1 Q2 Q3 Q4 Q1Q2 Q3Q4
OSC1
Auto Cleared
Bit set by user
WUE bit
RXx/DTx Line
RCxIF
Cleared due to User Read of RCREGx
Note 1: The EUSART remains in Idle while the WUE bit is set.
FIGURE 16-8:
AUTO-WAKE-UP BIT (WUE) TIMINGS DURING SLEEP
Q4
Q1Q2Q3 Q4 Q1Q2 Q3Q4 Q1Q2Q3
Q1
Q2 Q3Q4 Q1Q2Q3 Q4 Q1Q2Q3Q4 Q1Q2Q3 Q4 Q1Q2 Q3Q4
Auto Cleared
OSC1
Bit Set by User
WUE bit
RXx/DTx Line
RCxIF
Note 1
Cleared due to User Read of RCREGx
Sleep Command Executed
Sleep Ends
Note 1: If the wake-up event requires long oscillator warm-up time, the automatic clearing of the WUE bit can occur while the stposcsignal is
still active. This sequence should not depend on the presence of Q clocks.
2: The EUSART remains in Idle while the WUE bit is set.
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 283
PIC18(L)F2X/4XK22
When the TXREGx becomes empty, as indicated by
the TXxIF, the next data byte can be written to
TXREGx.
16.3.4
BREAK CHARACTER SEQUENCE
The EUSART module has the capability of sending the
special Break character sequences that are required by
the LIN bus standard. A Break character consists of a
Start bit, followed by 12 ‘0’ bits and a Stop bit.
16.3.5
RECEIVING A BREAK CHARACTER
The Enhanced EUSART module can receive a Break
character in two ways.
To send a Break character, set the SENDB and TXEN
bits of the TXSTAx register. The Break character trans-
mission is then initiated by a write to the TXREGx. The
value of data written to TXREGx will be ignored and all
‘0’s will be transmitted.
The first method to detect a Break character uses the
FERR bit of the RCSTAx register and the Received
data as indicated by RCREGx. The Baud Rate
Generator is assumed to have been initialized to the
expected baud rate.
The SENDB bit is automatically reset by hardware after
the corresponding Stop bit is sent. This allows the user
to preload the transmit FIFO with the next transmit byte
following the Break character (typically, the Sync
character in the LIN specification).
A Break character has been received when;
• RCxIF bit is set
• FERR bit is set
• RCREGx = 00h
The TRMT bit of the TXSTAx register indicates when the
transmit operation is active or Idle, just as it does during
normal transmission. See Figure 16-9 for the timing of
the Break character sequence.
The second method uses the Auto-Wake-up feature
described in Section 16.3.3 “Auto-Wake-up on
Break”. By enabling this feature, the EUSART will
sample the next two transitions on RXx/DTx, cause an
RCxIF interrupt, and receive the next data byte fol-
lowed by another interrupt.
16.3.4.1
Break and Sync Transmit Sequence
The following sequence will start a message frame
header made up of a Break, followed by an auto-baud
Sync byte. This sequence is typical of a LIN bus
master.
Note that following a Break character, the user will
typically want to enable the Auto-Baud Detect feature.
For both methods, the user can set the ABDEN bit of
the BAUDCONx register before placing the EUSART in
Sleep mode.
1. Configure the EUSART for the desired mode.
2. Set the TXEN and SENDB bits to enable the
Break sequence.
3. Load the TXREGx with a dummy character to
initiate transmission (the value is ignored).
4. Write ‘55h’ to TXREGx to load the Sync charac-
ter into the transmit FIFO buffer.
5. After the Break has been sent, the SENDB bit is
reset by hardware and the Sync character is
then transmitted.
FIGURE 16-9:
SEND BREAK CHARACTER SEQUENCE
Write to TXREGx
Dummy Write
BRG Output
(Shift Clock)
TXx/CKx (pin)
Start bit
bit 0
bit 1
Break
bit 11
Stop bit
TXxIF bit
(Transmit
interrupt Flag)
TRMT bit
(Transmit Shift
Reg. Empty Flag)
SENDB Sampled Here
Auto Cleared
SENDB
(send Break
control bit)
DS41412A-page 284
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
16.4.1.2
Clock Polarity
16.4 EUSART Synchronous Mode
A clock polarity option is provided for Microwire
compatibility. Clock polarity is selected with the CKTXP
bit of the BAUDCONx register. Setting the CKTXP bit
sets the clock Idle state as high. When the CKTXP bit
is set, the data changes on the falling edge of each
clock and is sampled on the rising edge of each clock.
Clearing the CKTXP bit sets the Idle state as low. When
the CKTXP bit is cleared, the data changes on the
rising edge of each clock and is sampled on the falling
edge of each clock.
Synchronous serial communications are typically used
in systems with a single master and one or more
slaves. The master device contains the necessary
circuitry for baud rate generation and supplies the clock
for all devices in the system. Slave devices can take
advantage of the master clock by eliminating the
internal clock generation circuitry.
There are two signal lines in Synchronous mode: a
bidirectional data line and a clock line. Slaves use the
external clock supplied by the master to shift the serial
data into and out of their respective receive and
transmit shift registers. Since the data line is
bidirectional, synchronous operation is half-duplex
only. Half-duplex refers to the fact that master and
slave devices can receive and transmit data but not
both simultaneously. The EUSART can operate as
either a master or slave device.
16.4.1.3
Synchronous Master Transmission
Data is transferred out of the device on the RXx/DTx
pin. The RXx/DTx and TXx/CKx pin output drivers are
automatically enabled when the EUSART is configured
for synchronous master transmit operation.
A transmission is initiated by writing a character to the
TXREGx register. If the TSR still contains all or part of
a previous character the new character data is held in
the TXREGx until the last bit of the previous character
has been transmitted. If this is the first character, or the
previous character has been completely flushed from
the TSR, the data in the TXREGx is immediately trans-
ferred to the TSR. The transmission of the character
commences immediately following the transfer of the
data to the TSR from the TXREGx.
Start and Stop bits are not used in synchronous
transmissions.
16.4.1
SYNCHRONOUS MASTER MODE
The following bits are used to configure the EUSART
for Synchronous Master operation:
• SYNC = 1
• CSRC = 1
Each data bit changes on the leading edge of the
master clock and remains valid until the subsequent
leading clock edge.
• SREN = 0(for transmit); SREN = 1(for receive)
• CREN = 0(for transmit); CREN = 1(for receive)
• SPEN = 1
Note:
The TSR register is not mapped in data
memory, so it is not available to the user.
Setting the SYNC bit of the TXSTAx register configures
the device for synchronous operation. Setting the CSRC
bit of the TXSTAx register configures the device as a
master. Clearing the SREN and CREN bits of the
RCSTAx register ensures that the device is in the
Transmit mode, otherwise the device will be configured
to receive. Setting the SPEN bit of the RCSTAx register
enables the EUSART. If the RXx/DTx or TXx/CKx pins
are shared with an analog peripheral the analog I/O
functions must be disabled by clearing the corresponding
ANSEL bits.
16.4.1.4
Data Polarity
The polarity of the transmit and receive data can be
controlled with the DTRXP bit of the BAUDCONx
register. The default state of this bit is ‘0’ which selects
high true transmit and receive data. Setting the DTRXP
bit to ‘1’ will invert the data resulting in low true transmit
and receive data.
The TRIS bits corresponding to the RXx/DTx and
TXx/CKx pins should be set.
16.4.1.1
Master Clock
Synchronous data transfers use a separate clock line,
which is synchronous with the data. A device configured
as a master transmits the clock on the TXx/CKx line. The
TXx/CKx pin output driver is automatically enabled when
the EUSART is configured for synchronous transmit or
receive operation. Serial data bits change on the leading
edge to ensure they are valid at the trailing edge of each
clock. One clock cycle is generated for each data bit.
Only as many clock cycles are generated as there are
data bits.
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 285
PIC18(L)F2X/4XK22
4. Disable Receive mode by clearing bits SREN
and CREN.
16.4.1.5
Synchronous Master Transmission
Set-up:
5. Enable Transmit mode by setting the TXEN bit.
6. If 9-bit transmission is desired, set the TX9 bit.
1. Initialize the SPBRGHx, SPBRGx register pair
and the BRGH and BRG16 bits to achieve the
desired baud rate (see Section 16.3 “EUSART
Baud Rate Generator (BRG)”).
7. If interrupts are desired, set the TXxIE, GIE/
GIEH and PEIE/GIEL interrupt enable bits.
2. Set the RXx/DTx and TXx/CKx TRIS controls to
8. If 9-bit transmission is selected, the ninth bit
should be loaded in the TX9D bit.
‘1’.
3. Enable the synchronous master serial port by
setting bits SYNC, SPEN and CSRC. Set the
TRIS bits corresponding to the RXx/DTx and
TXx/CKx I/O pins.
9. Start transmission by loading data to the
TXREGx register.
FIGURE 16-10:
SYNCHRONOUS TRANSMISSION
RXx/DTx
pin
bit 0
bit 1
bit 2
bit 7
bit 0
bit 1
Word 2
bit 7
Word 1
TXx/CKx pin
(SCKP = 0)
TXx/CKx pin
(SCKP = 1)
Write to
TXREGx Reg
Write Word 1
Write Word 2
TXxIF bit
(Interrupt Flag)
TRMT bit
‘1’
‘1’
TXEN bit
Note:
Sync Master mode, SPBRGx = 0, continuous transmission of two 8-bit words.
FIGURE 16-11:
SYNCHRONOUS TRANSMISSION (THROUGH TXEN)
RXx/DTx pin
bit 0
bit 2
bit 1
bit 6
bit 7
TXx/CKx pin
Write to
TXREGx reg
TXxIF bit
TRMT bit
TXEN bit
DS41412A-page 286
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
TABLE 16-7: REGISTERS ASSOCIATED WITH SYNCHRONOUS MASTER TRANSMISSION
Register
on Page
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
BAUDCON1 ABDOVF
BAUDCON2 ABDOVF
RCIDL
RCIDL
DTRXP
DTRXP
CKTXP
CKTXP
INT0IE
TX1IP
TX2IP
TX1IE
TX2IE
TX1IF
TX2IF
BRG16
BRG16
RBIE
—
WUE
WUE
ABDEN
ABDEN
RBIF
276
276
115
127
129
123
125
118
120
56
—
INTCON
IPR1
GIE/GIEH PEIE/GIEL TMR0IE
TMR0IF
CCP1IP
INT0IF
TMR2IP
—
SSP2IP
—
ADIP
BCL2IP
ADIE
RC1IP
RC2IP
RC1IE
RC2IE
RC1IF
RC2IF
SSP1IP
TMR1IP
IPR3
CTMUIP TMR5GIP TMR3GIP TMR1GIP
SSP1IE CCP1IE TMR2IE TMR1IE
CTMUIE TMR5GIE TMR3GIE TMR1GIE
SSP1IF CCP1IF TMR2IF TMR1IF
CTMUIF TMR5GIF TMR3GIF TMR1GIF
PIE1
PIE3
SSP2IE
—
BCL2IE
ADIF
PIR1
PIR3
SSP2IF
BCL2IF
PMD0
UART2MD UART1MD TMR6MD TMR5MD TMR4MD TMR3MD TMR2MD TMR1MD
RCSTA1
RCSTA2
SPBRG1
SPBRGH1
SPBRG2
SPBRGH2
SPEN
SPEN
RX9
RX9
SREN
SREN
CREN
CREN
ADDEN
ADDEN
FERR
FERR
OERR
OERR
RX9D
RX9D
275
275
—
EUSART1 Baud Rate Generator, Low Byte
EUSART1 Baud Rate Generator, High Byte
EUSART2 Baud Rate Generator, Low Byte
EUSART2 Baud Rate Generator, High Byte
—
—
—
(2)
TRISB
TRISB7
TRISC7
TRISD7
TRISB6
TRISC6
TRISD6
TRISB5
TRISC5
TRISD5
TRISB4
TRISC4
TRISD4
TRISB3
TRISC3
TRISD3
TRISB2
TRISC2
TRISD2
TRISB1
TRISC1
TRISD1
TRISB0
TRISC0
TRISD0
155
155
155
—
TRISC
(1)
TRISD
TXREG1
TXSTA1
TXREG2
TXSTA2
EUSART1 Transmit Register
TXEN SYNC SENDB
EUSART2 Transmit Register
TXEN SYNC SENDB
CSRC
CSRC
TX9
TX9
BRGH
BRGH
TRMT
TRMT
TX9D
TX9D
274
—
274
Legend: — = unimplemented locations, read as ‘0’. Shaded bits are not used for synchronous master transmission.
Note 1: PIC18(L)F4XK22 devices.
2: PIC18(L)F2XK22 devices.
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 287
PIC18(L)F2X/4XK22
If the overrun occurred when the CREN bit is set then
the error condition is cleared by either clearing the
CREN bit of the RCSTAx register or by clearing the
SPEN bit which resets the EUSART.
16.4.1.6
Synchronous Master Reception
Data is received at the RXx/DTx pin. The RXx/DTx pin
output driver must be disabled by setting the
corresponding TRIS bits when the EUSART is
configured for synchronous master receive operation.
16.4.1.9
Receiving 9-bit Characters
In Synchronous mode, reception is enabled by setting
either the Single Receive Enable bit (SREN of the
RCSTAx register) or the Continuous Receive Enable
bit (CREN of the RCSTAx register).
The EUSART supports 9-bit character reception. When
the RX9 bit of the RCSTAx register is set the EUSART
will shift 9-bits into the RSR for each character
received. The RX9D bit of the RCSTAx register is the
ninth, and Most Significant, data bit of the top unread
character in the receive FIFO. When reading 9-bit data
from the receive FIFO buffer, the RX9D data bit must
be read before reading the 8 Least Significant bits from
the RCREGx.
When SREN is set and CREN is clear, only as many
clock cycles are generated as there are data bits in a
single character. The SREN bit is automatically cleared
at the completion of one character. When CREN is set,
clocks are continuously generated until CREN is
cleared. If CREN is cleared in the middle of a character
the CK clock stops immediately and the partial charac-
ter is discarded. If SREN and CREN are both set, then
SREN is cleared at the completion of the first character
and CREN takes precedence.
16.4.1.10 Synchronous Master Reception Set-
up:
1. Initialize the SPBRGHx, SPBRGx register pair
for the appropriate baud rate. Set or clear the
BRGH and BRG16 bits, as required, to achieve
the desired baud rate.
To initiate reception, set either SREN or CREN. Data is
sampled at the RXx/DTx pin on the trailing edge of the
TXx/CKx clock pin and is shifted into the Receive Shift
Register (RSR). When a complete character is
received into the RSR, the RCxIF bit is set and the
character is automatically transferred to the two
character receive FIFO. The Least Significant eight bits
of the top character in the receive FIFO are available in
RCREGx. The RCxIF bit remains set as long as there
are un-read characters in the receive FIFO.
2. Set the RXx/DTx and TXx/CKx TRIS controls to
‘1’.
3. Enable the synchronous master serial port by
setting bits SYNC, SPEN and CSRC. Disable
RXx/DTx and TXx/CKx output drivers by setting
the corresponding TRIS bits.
4. Ensure bits CREN and SREN are clear.
5. If using interrupts, set the GIE/GIEH and PEIE/
GIEL bits of the INTCON register and set
RCxIE.
16.4.1.7
Slave Clock
Synchronous data transfers use a separate clock line,
which is synchronous with the data. A device configured
as a slave receives the clock on the TXx/CKx line. The
TXx/CKx pin output driver must be disabled by setting
the associated TRIS bit when the device is configured
for synchronous slave transmit or receive operation.
Serial data bits change on the leading edge to ensure
they are valid at the trailing edge of each clock. One data
bit is transferred for each clock cycle. Only as many
clock cycles should be received as there are data bits.
6. If 9-bit reception is desired, set bit RX9.
7. Start reception by setting the SREN bit or for
continuous reception, set the CREN bit.
8. Interrupt flag bit RCxIF will be set when recep-
tion of a character is complete. An interrupt will
be generated if the enable bit RCxIE was set.
9. Read the RCSTAx register to get the ninth bit (if
enabled) and determine if any error occurred
during reception.
10. Read the 8-bit received data by reading the
RCREGx register.
16.4.1.8
Receive Overrun Error
The receive FIFO buffer can hold two characters. An
overrun error will be generated if a third character, in its
entirety, is received before RCREGx is read to access
the FIFO. When this happens the OERR bit of the
RCSTAx register is set. Previous data in the FIFO will
not be overwritten. The two characters in the FIFO
buffer can be read, however, no additional characters
will be received until the error is cleared. The OERR bit
can only be cleared by clearing the overrun condition.
If the overrun error occurred when the SREN bit is set
and CREN is clear then the error is cleared by reading
RCREGx.
11. If an overrun error occurs, clear the error by
either clearing the CREN bit of the RCSTAx
register or by clearing the SPEN bit which resets
the EUSART.
DS41412A-page 288
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
FIGURE 16-12:
SYNCHRONOUS RECEPTION (MASTER MODE, SREN)
RXx/DTx
pin
bit 0
bit 1
bit 2
bit 3
bit 4
bit 5
bit 6
bit 7
TXx/CKx pin
(SCKP = 0)
TXx/CKx pin
(SCKP = 1)
Write to
bit SREN
SREN bit
‘0’
‘0’
CREN bit
RCxIF bit
(Interrupt)
Read
RCREGx
Note:
Timing diagram demonstrates Sync Master mode with bit SREN = 1and bit BRGH = 0.
TABLE 16-8: REGISTERS ASSOCIATED WITH SYNCHRONOUS MASTER RECEPTION
Register
on Page
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
BAUDCON1
BAUDCON2
INTCON
IPR1
ABDOVF
ABDOVF
RCIDL
RCIDL
DTRXP
DTRXP
CKTXP
CKTXP
INT0IE
TX1IP
TX2IP
TX1IE
TX2IE
TX1IF
TX2IF
BRG16
BRG16
RBIE
—
WUE
WUE
ABDEN
ABDEN
RBIF
276
276
115
127
129
123
125
118
120
56
—
GIE/GIEH PEIE/GIEL TMR0IE
TMR0IF
CCP1IP
INT0IF
TMR2IP
—
SSP2IP
—
ADIP
BCL2IP
ADIE
RC1IP
RC2IP
RC1IE
RC2IE
RC1IF
RC2IF
SSP1IP
TMR1IP
IPR3
CTMUIP TMR5GIP TMR3GIP TMR1GIP
SSP1IE CCP1IE TMR2IE TMR1IE
CTMUIE TMR5GIE TMR3GIE TMR1GIE
SSP1IF CCP1IF TMR2IF TMR1IF
CTMUIF TMR5GIF TMR3GIF TMR1GIF
PIE1
PIE3
SSP2IE
—
BCL2IE
ADIF
PIR1
PIR3
SSP2IF
BCL2IF
PMD0
UART2MD UART1MD TMR6MD TMR5MD TMR4MD TMR3MD TMR2MD TMR1MD
EUSART1 Receive Register
RCREG1
RCSTA1
RCREG2
RCSTA2
SPBRG1
SPBRGH1
SPBRG2
SPBRGH2
TXSTA1
TXSTA2
—
SPEN
RX9
SREN
CREN
EUSART2 Receive Register
CREN ADDEN
ADDEN
FERR
OERR
RX9D
275
—
SPEN
RX9
SREN
FERR
OERR
RX9D
275
—
EUSART1 Baud Rate Generator, Low Byte
EUSART1 Baud Rate Generator, High Byte
EUSART2 Baud Rate Generator, Low Byte
EUSART2 Baud Rate Generator, High Byte
—
—
—
CSRC
CSRC
TX9
TX9
TXEN
TXEN
SYNC
SYNC
SENDB
SENDB
BRGH
BRGH
TRMT
TRMT
TX9D
TX9D
274
274
Legend: — = unimplemented locations, read as ‘0’. Shaded bits are not used for synchronous master reception.
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 289
PIC18(L)F2X/4XK22
If two words are written to the TXREGx and then the
SLEEPinstruction is executed, the following will occur:
16.4.2
SYNCHRONOUS SLAVE MODE
The following bits are used to configure the EUSART
for Synchronous slave operation:
1. The first character will immediately transfer to
the TSR register and transmit.
• SYNC = 1
2. The second word will remain in TXREGx
register.
• CSRC = 0
• SREN = 0(for transmit); SREN = 1(for receive)
• CREN = 0(for transmit); CREN = 1(for receive)
• SPEN = 1
3. The TXxIF bit will not be set.
4. After the first character has been shifted out of
TSR, the TXREGx register will transfer the
second character to the TSR and the TXxIF bit
will now be set.
Setting the SYNC bit of the TXSTAx register configures
the device for synchronous operation. Clearing the
CSRC bit of the TXSTAx register configures the device as
a slave. Clearing the SREN and CREN bits of the
RCSTAx register ensures that the device is in the
Transmit mode, otherwise the device will be configured to
receive. Setting the SPEN bit of the RCSTAx register
enables the EUSART. If the RXx/DTx or TXx/CKx pins
are shared with an analog peripheral the analog I/O
functions must be disabled by clearing the corresponding
ANSEL bits.
5. If the PEIE/GIEL and TXxIE bits are set, the
interrupt will wake the device from Sleep and
execute the next instruction. If the GIE/GIEH bit
is also set, the program will call the Interrupt
Service Routine.
16.4.2.2
Synchronous Slave Transmission
Set-up:
1. Set the SYNC and SPEN bits and clear the
CSRC bit.
RXx/DTx and TXx/CKx pin output drivers must be
disabled by setting the corresponding TRIS bits.
2. Set the RXx/DTx and TXx/CKx TRIS controls to
‘1’.
16.4.2.1
EUSART Synchronous Slave
Transmit
3. Clear the CREN and SREN bits.
4. If using interrupts, ensure that the GIE/GIEH
and PEIE/GIEL bits of the INTCON register are
set and set the TXxIE bit.
The operation of the Synchronous Master and Slave
modes are identical (see Section 16.4.1.3
“Synchronous Master Transmission”), except in the
5. If 9-bit transmission is desired, set the TX9 bit.
6. Enable transmission by setting the TXEN bit.
case of the Sleep mode.
7. If 9-bit transmission is selected, insert the Most
Significant bit into the TX9D bit.
8. Start transmission by writing the Least
Significant 8 bits to the TXREGx register.
DS41412A-page 290
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
TABLE 16-9: REGISTERS ASSOCIATED WITH SYNCHRONOUS SLAVE TRANSMISSION
Register
on Page
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
BAUDCON1 ABDOVF
BAUDCON2 ABDOVF
RCIDL
RCIDL
DTRXP
DTRXP
CKTXP
CKTXP
INT0IE
TX1IP
TX2IP
TX1IE
TX2IE
TX1IF
TX2IF
BRG16
BRG16
RBIE
—
WUE
WUE
ABDEN
ABDEN
RBIF
276
276
115
127
129
123
125
118
120
56
—
INTCON
IPR1
GIE/GIEH PEIE/GIEL TMR0IE
TMR0IF
CCP1IP
INT0IF
TMR2IP
—
SSP2IP
—
ADIP
BCL2IP
ADIE
RC1IP
RC2IP
RC1IE
RC2IE
RC1IF
RC2IF
SSP1IP
TMR1IP
IPR3
CTMUIP TMR5GIP TMR3GIP TMR1GIP
SSP1IE CCP1IE TMR2IE TMR1IE
CTMUIE TMR5GIE TMR3GIE TMR1GIE
SSP1IF CCP1IF TMR2IF TMR1IF
CTMUIF TMR5GIF TMR3GIF TMR1GIF
PIE1
PIE3
SSP2IE
—
BCL2IE
ADIF
PIR1
PIR3
SSP2IF
BCL2IF
PMD0
UART2MD UART1MD TMR6MD TMR5MD TMR4MD TMR3MD TMR2MD TMR1MD
RCSTA1
RCSTA2
SPBRG1
SPBRGH1
SPBRG2
SPBRGH2
SPEN
SPEN
RX9
RX9
SREN
SREN
CREN
CREN
ADDEN
ADDEN
FERR
FERR
OERR
OERR
RX9D
RX9D
275
275
—
EUSART1 Baud Rate Generator, Low Byte
EUSART1 Baud Rate Generator, High Byte
EUSART2 Baud Rate Generator, Low Byte
EUSART2 Baud Rate Generator, High Byte
—
—
—
(2)
TRISB
TRISB7
TRISC7
TRISD7
TRISB6
TRISC6
TRISD6
TRISB5
TRISC5
TRISD5
TRISB4
TRISB3
TRISB2
TRISC2
TRISD2
TRISB1
TRISC1
TRISD1
TRISB0
TRISC0
TRISD0
155
155
155
—
TRISC
TRISC4 TRISC3
TRISD4 TRISD3
(1)
TRISD
TXREG1
TXSTA1
TXREG2
TXSTA2
EUSART1 Transmit Register
TXEN SYNC SENDB
EUSART2 Transmit Register
TXEN SYNC SENDB
CSRC
CSRC
TX9
TX9
BRGH
BRGH
TRMT
TRMT
TX9D
TX9D
274
—
274
Legend: — = unimplemented locations, read as ‘0’. Shaded bits are not used for synchronous slave transmission.
Note
1: PIC18(L)F4XK22 devices.
2: PIC18(L)F2XK22 devices.
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 291
PIC18(L)F2X/4XK22
16.4.2.3
EUSART Synchronous Slave
Reception
16.4.2.4
Synchronous Slave Reception Set-
up:
The operation of the Synchronous Master and Slave
modes is identical (Section 16.4.1.6 “Synchronous
Master Reception”), with the following exceptions:
1. Set the SYNC and SPEN bits and clear the
CSRC bit.
2. Set the RXx/DTx and TXx/CKx TRIS controls to
‘1’.
• Sleep
3. If using interrupts, ensure that the GIE/GIEH
and PEIE/GIEL bits of the INTCON register are
set and set the RCxIE bit.
• CREN bit is always set, therefore the receiver is
never Idle
• SREN bit, which is a “don't care” in Slave mode
4. If 9-bit reception is desired, set the RX9 bit.
5. Set the CREN bit to enable reception.
A character may be received while in Sleep mode by
setting the CREN bit prior to entering Sleep. Once the
word is received, the RSR register will transfer the data
to the RCREGx register. If the RCxIE enable bit is set,
the interrupt generated will wake the device from Sleep
and execute the next instruction. If the GIE/GIEH bit is
also set, the program will branch to the interrupt vector.
6. The RCxIF bit will be set when reception is
complete. An interrupt will be generated if the
RCxIE bit was set.
7. If 9-bit mode is enabled, retrieve the Most
Significant bit from the RX9D bit of the RCSTAx
register.
8. Retrieve the 8 Least Significant bits from the
receive FIFO by reading the RCREGx register.
9. If an overrun error occurs, clear the error by
either clearing the CREN bit of the RCSTAx
register or by clearing the SPEN bit which resets
the EUSART.
TABLE 16-10: REGISTERS ASSOCIATED WITH SYNCHRONOUS SLAVE RECEPTION
Register
on Page
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
BAUDCON1
BAUDCON2
INTCON
IPR1
ABDOVF
ABDOVF
RCIDL
RCIDL
DTRXP
DTRXP
CKTXP
CKTXP
INT0IE
TX1IP
TX2IP
TX1IE
TX2IE
TX1IF
TX2IF
BRG16
BRG16
RBIE
—
WUE
WUE
ABDEN
ABDEN
RBIF
276
276
115
127
129
123
125
118
120
56
—
GIE/GIEH PEIE/GIEL TMR0IE
TMR0IF
CCP1IP
INT0IF
TMR2IP
—
SSP2IP
—
ADIP
BCL2IP
ADIE
RC1IP
RC2IP
RC1IE
RC2IE
RC1IF
RC2IF
SSP1IP
TMR1IP
IPR3
CTMUIP TMR5GIP TMR3GIP TMR1GIP
SSP1IE CCP1IE TMR2IE TMR1IE
CTMUIE TMR5GIE TMR3GIE TMR1GIE
SSP1IF CCP1IF TMR2IF TMR1IF
CTMUIF TMR5GIF TMR3GIF TMR1GIF
PIE1
PIE3
SSP2IE
—
BCL2IE
ADIF
PIR1
PIR3
SSP2IF
BCL2IF
PMD0
UART2MD UART1MD TMR6MD TMR5MD TMR4MD TMR3MD TMR2MD TMR1MD
EUSART1 Receive Register
RCREG1
RCSTA1
RCREG2
RCSTA2
SPBRG1
SPBRGH1
SPBRG2
SPBRGH2
TXSTA1
TXSTA2
—
SPEN
RX9
SREN
CREN
EUSART2 Receive Register
CREN ADDEN
ADDEN
FERR
OERR
RX9D
275
—
SPEN
RX9
SREN
FERR
OERR
RX9D
275
—
EUSART1 Baud Rate Generator, Low Byte
EUSART1 Baud Rate Generator, High Byte
EUSART2 Baud Rate Generator, Low Byte
EUSART2 Baud Rate Generator, High Byte
—
—
—
CSRC
CSRC
TX9
TX9
TXEN
TXEN
SYNC
SYNC
SENDB
SENDB
BRGH
BRGH
TRMT
TRMT
TX9D
TX9D
274
274
Legend: — = unimplemented locations, read as ‘0’. Shaded bits are not used for synchronous slave reception.
DS41412A-page 292
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
The ADC voltage reference is software selectable to
either VDD or a voltage applied to the external reference
pins.
17.0 ANALOG-TO-DIGITAL
CONVERTER (ADC) MODULE
The Analog-to-Digital Converter (ADC) allows
conversion of an analog input signal to a 10-bit binary
representation of that signal. This device uses analog
inputs, which are multiplexed into a single sample and
hold circuit. The output of the sample and hold is
connected to the input of the converter. The converter
generates a 10-bit binary result via successive
approximation and stores the conversion result into the
ADC result registers (ADRESL and ADRESH).
The ADC can generate an interrupt upon completion of
a conversion. This interrupt can be used to wake-up the
device from Sleep.
Figure 17-1 shows the block diagram of the ADC.
FIGURE 17-1:
ADC BLOCK DIAGRAM
5
CHS<4:0>
11111
FVR BUF2
11110
11101
11100
11011
CTMU
Reserved
AN28(1)
AN27(1)
ADCMD
ADON
00101
00100
00011
00010
00001
00000
AN5(1)
AN4
10-Bit ADC
GO/DONE
10
AN3
AN2
AN1
AN0
0= Left Justify
1= Right Justify
ADFM
10
2
PVCFG<1:0>
ADRESH ADRESL
00
01
10
11
AVDD
VREF+/AN3
FVR BUF2
Reserved
2
NVCFG<1:0>
00
01
10
11
AVSS
VREF-/AN2
Reserved
Reserved
Note: Additional ADC channels AN5-AN7 and AN20-AN27 are only available on PIC18(L)F4XK22 devices.
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 293
PIC18(L)F2X/4XK22
17.1.3
ADC VOLTAGE REFERENCE
17.1 ADC Configuration
The PVCFG<1:0> and NVCFG<1:0> bits of the
ADCON1 register provide independent control of the
positive and negative voltage references.
When configuring and using the ADC the following
functions must be considered:
• Port configuration
The positive voltage reference can be:
• VDD
• Channel selection
• ADC voltage reference selection
• ADC conversion clock source
• Interrupt control
•
•
the fixed voltage reference (FVR BUF2)
an external voltage source (VREF+)
The negative voltage reference can be:
• Results formatting
• VSS
17.1.1
PORT CONFIGURATION
• an external voltage source (VREF-)
The ANSELx and TRISx registers configure the A/D
port pins. Any port pin needed as an analog input
should have its corresponding ANSx bit set to disable
the digital input buffer and TRISx bit set to disable the
digital output driver. If the TRISx bit is cleared, the
digital output level (VOH or VOL) will be converted.
17.1.4
SELECTING AND CONFIGURING
ACQUISITION TIME
The ADCON2 register allows the user to select an
acquisition time that occurs each time the GO/DONE
bit is set.
The A/D operation is independent of the state of the
ANSx bits and the TRIS bits.
Acquisition time is set with the ACQT<2:0> bits of the
ADCON2 register. Acquisition delays cover a range of
2 to 20 TAD. When the GO/DONE bit is set, the A/D
module continues to sample the input for the selected
Note 1: When reading the PORT register, all pins
with their corresponding ANSx bit set
read as cleared (a low level). However,
analog conversion of pins configured as
digital inputs (ANSx bit cleared and
TRISx bit set) will be accurately
converted.
acquisition time, then automatically begins
a
conversion. Since the acquisition time is programmed,
there is no need to wait for an acquisition time between
selecting a channel and setting the GO/DONE bit.
Manual
acquisition
is
selected
when
2: Analog levels on any pin with the corre-
sponding ANSx bit cleared may cause the
digital input buffer to consume current out
of the device’s specification limits.
ACQT<2:0> = 000. When the GO/DONE bit is set,
sampling is stopped and a conversion begins. The user
is responsible for ensuring the required acquisition time
has passed between selecting the desired input
channel and setting the GO/DONE bit. This option is
also the default Reset state of the ACQT<2:0> bits and
is compatible with devices that do not offer
programmable acquisition times.
3: The PBADEN bit in Configuration
Register 3H configures PORTB pins to
reset as analog or digital pins by
controlling how the bits in ANSELB are
reset.
In either case, when the conversion is completed, the
GO/DONE bit is cleared, the ADIF flag is set and the
A/D begins sampling the currently selected channel
again. When an acquisition time is programmed, there
is no indication of when the acquisition time ends and
the conversion begins.
17.1.2
CHANNEL SELECTION
The CHS bits of the ADCON0 register determine which
channel is connected to the sample and hold circuit.
When changing channels, a delay is required before
starting the next conversion. Refer to Section 17.2
“ADC Operation” for more information.
DS41412A-page 294
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
17.1.5
CONVERSION CLOCK
17.1.6
INTERRUPTS
The source of the conversion clock is software
selectable via the ADCS bits of the ADCON2 register.
There are seven possible clock options:
The ADC module allows for the ability to generate an
interrupt upon completion of an Analog-to-Digital
Conversion. The ADC interrupt enable is the ADIE bit
in the PIE1 register and the interrupt priority is the ADIP
bit in the IPR1 register. The ADC interrupt flag is the
ADIF bit in the PIR1 register. The ADIF bit must be
cleared by software.
• FOSC/2
• FOSC/4
• FOSC/8
• FOSC/16
Note:
The ADIF bit is set at the completion of
every conversion, regardless of whether
or not the ADC interrupt is enabled.
• FOSC/32
• FOSC/64
• FRC (dedicated internal oscillator)
This interrupt can be generated while the device is
operating or while in Sleep. If the device is in Sleep, the
interrupt will wake-up the device. Upon waking from
Sleep, the next instruction following the SLEEP
instruction is always executed. If the user is attempting
to wake-up from Sleep and resume in-line code
execution, the global interrupt must be disabled. If the
global interrupt is enabled, execution will switch to the
Interrupt Service Routine.
The time to complete one bit conversion is defined as
TAD. One full 10-bit conversion requires 11 TAD periods
as shown in Figure 17-3.
For correct conversion, the appropriate TAD specification
must be met. See A/D conversion requirements in
Table 27-24 for more information. Table gives examples
of appropriate ADC clock selections.
Note:
Unless using the FRC, any changes in the
system clock frequency will change the
ADC clock frequency, which may
adversely affect the ADC result.
TABLE 17-1: ADC CLOCK PERIOD (TAD) VS. DEVICE OPERATING FREQUENCIES
ADC Clock Period (TAD)
ADC Clock Source ADCS<2:0>
Device Frequency (FOSC)
64 MHz
16 MHz
4 MHz
1 MHz
FOSC/2
FOSC/4
FOSC/8
FOSC/16
FOSC/32
FOSC/64
FRC
000
100
001
101
010
110
x11
31.25 ns(2)
62.5 ns(2)
400 ns(2)
250 ns(2)
500 ns(2)
1.0 s
125 ns(2)
250 ns(2)
500 ns(2)
1.0 s
500 ns(2)
1.0 s
2.0 s
4.0 s(3)
8.0 s(3)
16.0 s(3)
32.0 s(3)
64.0 s(3)
1-4 s(1,4)
2.0 s
4.0 s(3)
8.0 s(3)
16.0 s(3)
1-4 s(1,4)
2.0 s
4.0 s(3)
1-4 s(1,4)
1-4 s(1,4)
Legend: Shaded cells are outside of recommended range.
Note 1: The FRC source has a typical TAD time of 1.7 s.
2: These values violate the minimum required TAD time.
3: For faster conversion times, the selection of another clock source is recommended.
4: When the device frequency is greater than 1 MHz, the FRC clock source is only recommended if the
conversion will be performed during Sleep.
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 295
PIC18(L)F2X/4XK22
17.1.7
RESULT FORMATTING
The 10-bit A/D conversion result can be supplied in two
formats, left justified or right justified. The ADFM bit of
the ADCON2 register controls the output format.
Figure 17-2 shows the two output formats.
FIGURE 17-2:
10-BIT A/D CONVERSION RESULT FORMAT
ADRESH
ADRESL
(ADFM = 0)
MSB
bit 7
LSB
bit 0
bit 0
bit 7
bit 7
bit 0
10-bit A/D Result
Unimplemented: Read as ‘0’
(ADFM = 1)
MSB
LSB
bit 0
bit 7
Unimplemented: Read as ‘0’
10-bit A/D Result
DS41412A-page 296
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
Figure 17-3 shows the operation of the A/D converter
after the GO bit has been set and the ACQT<2:0> bits
are cleared. A conversion is started after the following
instruction to allow entry into SLEEP mode before the
conversion begins.
17.2 ADC Operation
17.2.1
STARTING A CONVERSION
To enable the ADC module, the ADON bit of the
ADCON0 register must be set to a ‘1’. Setting the GO/
DONE bit of the ADCON0 register to a ‘1’ will, depend-
ing on the ACQT bits of the ADCON2 register, either
immediately start the Analog-to-Digital conversion or
start an acquisition delay followed by the Analog-to-
Digital conversion.
Figure 17-4 shows the operation of the A/D converter
after the GO bit has been set and the ACQT<2:0> bits
are set to ‘010’ which selects a 4 TAD acquisition time
before the conversion starts.
Note:
The GO/DONE bit should not be set in the
same instruction that turns on the ADC.
Refer to Section 17.2.10 “A/D Conver-
sion Procedure”.
FIGURE 17-3:
A/D CONVERSION TAD CYCLES (ACQT<2:0> = 000, TACQ = 0)
TCY - TAD
TAD8 TAD9 TAD10 TAD11
2 TAD
TAD1 TAD2 TAD3 TAD4 TAD5 TAD6 TAD7
b4
b1
b0
b9
b8
b7
b6
b5
b3
b2
Conversion starts
Discharge
Holding capacitor is disconnected from analog input (typically 100 ns)
Set GO bit
On the following cycle:
ADRESH:ADRESL is loaded, GO bit is cleared,
ADIF bit is set, holding capacitor is connected to analog input.
FIGURE 17-4:
A/D CONVERSION TAD CYCLES (ACQT<2:0> = 010, TACQ = 4 TAD)
TAD Cycles
TACQT Cycles
6
7
8
9
10
b1
11 2 TAD
b0
1
2
3
4
1
2
3
4
5
b7
b6
b3
b2
b8
b5
b4
b9
Automatic
Acquisition
Time
Discharge
Conversion starts
(Holding capacitor is disconnected from analog input)
Set GO bit
(Holding capacitor continues
acquiring input)
On the following cycle:
ADRESH:ADRESL is loaded, GO bit is cleared,
ADIF bit is set, holding capacitor is connected to analog input.
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 297
PIC18(L)F2X/4XK22
17.2.2
COMPLETION OF A CONVERSION
17.2.7
ADC OPERATION DURING SLEEP
When the conversion is complete, the ADC module will:
The ADC module can operate during Sleep. This
requires the ADC clock source to be set to the FRC
option. When the FRC clock source is selected, the
ADC waits one additional instruction before starting the
conversion. This allows the SLEEP instruction to be
executed, which can reduce system noise during the
conversion. If the ADC interrupt is enabled, the device
will wake-up from Sleep when the conversion
completes. If the ADC interrupt is disabled, the ADC
module is turned off after the conversion completes,
although the ADON bit remains set.
• Clear the GO/DONE bit
• Set the ADIF flag bit
• Update the ADRESH:ADRESL registers with new
conversion result
17.2.3
DISCHARGE
The discharge phase is used to initialize the value of
the capacitor array. The array is discharged after every
sample. This feature helps to optimize the unity-gain
amplifier, as the circuit always needs to charge the
capacitor array, rather than charge/discharge based on
previous measure values.
When the ADC clock source is something other than
FRC,
a SLEEP instruction causes the present
conversion to be aborted and the ADC module is
turned off, although the ADON bit remains set.
17.2.4
TERMINATING A CONVERSION
17.2.8
SPECIAL EVENT TRIGGER
If a conversion must be terminated before completion,
the GO/DONE bit can be cleared by software. The
ADRESH:ADRESL registers will not be updated with
the partially complete Analog-to-Digital conversion
sample. Instead, the ADRESH:ADRESL register pair
will retain the value of the previous conversion.
Two Special Event Triggers are available to start an A/D
conversion: CTMU and CCP5. The Special Event
Trigger source is selected using the TRIGSEL bit in
ADCON1.
When TRIGSEL = 0, the CCP5 module is selected as
the Special Event Trigger source. To enable the Special
Event Trigger in the CCP module, set CCP5M<3:0> =
1011, in the CCP5CON register.
Note:
A device Reset forces all registers to their
Reset state. Thus, the ADC module is
turned off and any pending conversion is
terminated.
When TRIGSEL = 1, the CTMU module is selected.
The CTMU module requires that the CTTRIG bit in
CTMUCONH is set to enable the Special Event Trigger.
17.2.5
DELAY BETWEEN CONVERSIONS
After the A/D conversion is completed or aborted, a
2 TAD wait is required before the next acquisition can
be started. After this wait, the currently selected
channel is reconnected to the charge holding capacitor
commencing the next acquisition.
In addition to TRIGSEL bit, the following steps are
required to start an A/D conversion:
• The A/D module must be enabled (ADON = 1)
• The appropriate analog input channel selected
• The minimum acquisition period set one of these
ways:
- Timing provided by the user
- Selection made of an appropriate TACQ time
17.2.6
ADC OPERATION IN POWER-
MANAGED MODES
The selection of the automatic acquisition time and A/D
conversion clock is determined in part by the clock
source and frequency while in a power-managed mode.
With these conditions met, the trigger sets the GO/DONE
bit and the A/D acquisition starts.
If the A/D module is not enabled (ADON = 0), the
If the A/D is expected to operate while the device is in
module ignores the Special Event Trigger.
a
power-managed mode, the ACQT<2:0> and
ADCS<2:0> bits in ADCON2 should be updated in
accordance with the clock source to be used in that
mode. After entering the mode, an A/D acquisition or
conversion may be started. Once started, the device
should continue to be clocked by the same clock
source until the conversion has been completed.
17.2.9
PERIPHERAL MODULE DISABLE
When a peripheral module is not used or inactive, the
module can be disabled by setting the Module Disable
bit in the PMD registers. This will reduce power
consumption to an absolute minimum. Setting the PMD
bits holds the module in Reset and disconnects the
module’s clock source. The Module Disable bit for the
ADC module is ADCMD in the PMD2 Register. See
Section 3.0 “Power-Managed Modes” for more
information.
If desired, the device may be placed into the
corresponding Idle mode during the conversion. If the
device clock frequency is less than 1 MHz, the A/D FRC
clock source should be selected.
DS41412A-page 298
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
17.2.10 A/D CONVERSION PROCEDURE
EXAMPLE 17-1:
A/D CONVERSION
;This code block configures the ADC
;for polling, Vdd and Vss as reference, Frc
clock and AN0 input.
;
This is an example procedure for using the ADC to
perform an Analog-to-Digital conversion:
1. Configure Port:
• Disable pin output driver (See TRIS register)
• Configure pin as analog
2. Configure the ADC module:
• Select ADC conversion clock
• Configure voltage reference
• Select ADC input channel
• Select result format
;Conversion start & polling for completion
; are included.
;
MOVLW
MOVWF
MOVLW
MOVWF
BSF
B’10101111’ ;right justify, Frc,
ADCON2 ; & 12 TAD ACQ time
B’00000000’ ;ADC ref = Vdd,Vss
ADCON1
;
TRISA,0
ANSEL,0
;Set RA0 to input
;Set RA0 to analog
BSF
MOVLW
MOVWF
BSF
ADCPoll:
BTFSC
BRA
B’00000001’ ;AN0, ADC on
• Select acquisition delay
ADCON0
;
• Turn on ADC module
ADCON0,GO
;Start conversion
3. Configure ADC interrupt (optional):
• Clear ADC interrupt flag
• Enable ADC interrupt
ADCON0,GO
ADCPoll
;Is conversion done?
;No, test again
; Result is complete - store 2 MSbits in
; RESULTHI and 8 LSbits in RESULTLO
MOVFF
MOVFF
• Enable peripheral interrupt
• Enable global interrupt(1)
4. Wait the required acquisition time(2)
ADRESH,RESULTHI
ADRESL,RESULTLO
.
5. Start conversion by setting the GO/DONE bit.
6. Wait for ADC conversion to complete by one of
the following:
• Polling the GO/DONE bit
• Waiting for the ADC interrupt (interrupts
enabled)
7. Read ADC Result
8. Clear the ADC interrupt flag (required if interrupt
is enabled).
Note 1: The global interrupt can be disabled if the
user is attempting to wake-up from Sleep
and resume in-line code execution.
2: Software delay required if ACQT bits are
set to zero delay. See Section 17.3 “A/D
Acquisition Requirements”.
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 299
PIC18(L)F2X/4XK22
17.2.11 ADC REGISTER DEFINITIONS
The following registers are used to control the
operation of the ADC.
Note:
Analog pin control is determined by the
ANSELx registers (see Register 10-2)
REGISTER 17-1: ADCON0: A/D CONTROL REGISTER 0
U-0
—
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
ADON
CHS<4:0>
GO/DONE
bit 7
bit 0
Legend:
R = Readable bit
-n = Value at POR
W = Writable bit
‘1’ = Bit is set
U = Unimplemented bit, read as ‘0’
‘0’ = Bit is cleared x = Bit is unknown
bit 7
Unimplemented: Read as ‘0’
bit 6-2
CHS<4:0>: Analog Channel Select bits
00000= AN0
00001= AN1
00010= AN2
00011= AN3
00100= AN4
00101= AN5(1)
00110= AN6(1)
00111= AN7(1)
01000= AN8
01001= AN9
01010= AN10
01011= AN11
01100= AN12
01101= AN13
01110= AN14
01111= AN15
10000= AN16
10001= AN17
10010= AN18
10011= AN19
10100= AN20(1)
10101= AN21(1)
10110= AN22(1)
10111= AN23(1)
11000= AN24(1)
11001= AN25(1)
11010= AN26(1)
11011= AN27(1)
11100= Reserved
11101= CTMU
11110= DAC
11111= FVR BUF2 (1.024V/2.048V/2.096V Volt Fixed Voltage Reference)(2)
GO/DONE: A/D Conversion Status bit
bit 1
1= A/D conversion cycle in progress. Setting this bit starts an A/D conversion cycle.
This bit is automatically cleared by hardware when the A/D conversion has completed.
0= A/D conversion completed/not in progress
DS41412A-page 300
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
REGISTER 17-1: ADCON0: A/D CONTROL REGISTER 0 (CONTINUED)
bit 0
ADON: ADC Enable bit
1= ADC is enabled
0= ADC is disabled and consumes no operating current
Note 1: Available on PIC18(L)F4XK22 devices only.
2: Allow greater than 15 s acquisition time when measuring the Fixed Voltage Reference.
REGISTER 17-2: ADCON1: A/D CONTROL REGISTER 1
R/W-0
U-0
—
U-0
—
U-0
—
R/W-0
R/W-0
R/W-0
R/W-0
TRIGSEL
PVCFG<1:0>
NVCFG<1:0>
bit 7
bit 0
Legend:
R = Readable bit
-n = Value at POR
W = Writable bit
‘1’ = Bit is set
U = Unimplemented bit, read as ‘0’
‘0’ = Bit is cleared x = Bit is unknown
bit 7
TRIGSEL: Special Trigger Select bit
1= Selects the special trigger from CTMU
0= Selects the special trigger from CCP5
bit 6-4
bit 3-2
Unimplemented: Read as ‘0’
PVCFG<1:0>: Positive Voltage Reference Configuration bits
00= A/D VREF+ connected to internal signal, AVDD
01= A/D VREF+ connected to external pin, VREF+
10= A/D VREF+ connected to internal signal, FVR BUF2
11= Reserved (by default, A/D VREF+ connected to internal signal, AVDD)
NVCFG0<1:0>: Negative Voltage Reference Configuration bits
bit 1-0
00= A/D VREF+ connected to internal signal, AVSS
01= A/D VREF+ connected to external pin, VREF-
10= Reserved (by default, A/D VREF+ connected to internal signal, AVSS)
11= Reserved (by default, A/D VREF+ connected to internal signal, AVSS)
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 301
PIC18(L)F2X/4XK22
REGISTER 17-3: ADCON2: A/D CONTROL REGISTER 2
R/W-0
ADFM
U-0
—
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
bit 0
ACQT<2:0>
ADCS<2:0>
bit 7
Legend:
R = Readable bit
-n = Value at POR
W = Writable bit
‘1’ = Bit is set
U = Unimplemented bit, read as ‘0’
‘0’ = Bit is cleared x = Bit is unknown
bit 7
ADFM: A/D Conversion Result Format Select bit
1= Right justified
0= Left justified
bit 6
Unimplemented: Read as ‘0’
bit 5-3
ACQT<2:0>: A/D Acquisition time select bits. Acquisition time is the duration that the A/D charge hold-
ing capacitor remains connected to A/D channel from the instant the GO/DONE bit is set until conver-
sions begins.
000= 0(1)
001= 2 TAD
010= 4 TAD
011= 6 TAD
100= 8 TAD
101= 12 TAD
110= 16 TAD
111= 20 TAD
bit 2-0
ADCS<2:0>: A/D Conversion Clock Select bits
000= FOSC/2
001= FOSC/8
010= FOSC/32
011= FRC(1) (clock derived from a dedicated internal oscillator = 600 kHz nominal)
100= FOSC/4
101= FOSC/16
110= FOSC/64
111= FRC(1) (clock derived from a dedicated internal oscillator = 600 kHz nominal)
Note 1: When the A/D clock source is selected as FRC then the start of conversion is delayed by one instruction
cycle after the GO/DONE bit is set to allow the SLEEPinstruction to be executed.
DS41412A-page 302
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
REGISTER 17-4: ADRESH: ADC RESULT REGISTER HIGH (ADRESH) ADFM = 0
R/W-x
R/W-x
R/W-x
R/W-x
R/W-x
R/W-x
R/W-x
R/W-x
ADRES<9:2>
bit 7
bit 0
Legend:
R = Readable bit
-n = Value at POR
W = Writable bit
‘1’ = Bit is set
U = Unimplemented bit, read as ‘0’
‘0’ = Bit is cleared x = Bit is unknown
bit 7-0
ADRES<9:2>: ADC Result Register bits
Upper 8 bits of 10-bit conversion result
REGISTER 17-5: ADRESL: ADC RESULT REGISTER LOW (ADRESL) ADFM = 0
R/W-x
R/W-x
R/W-x
—
R/W-x
—
R/W-x
—
R/W-x
—
R/W-x
—
R/W-x
—
ADRES<1:0>
bit 7
bit 0
Legend:
R = Readable bit
-n = Value at POR
W = Writable bit
‘1’ = Bit is set
U = Unimplemented bit, read as ‘0’
‘0’ = Bit is cleared x = Bit is unknown
bit 7-6
bit 5-0
ADRES<1:0>: ADC Result Register bits
Lower 2 bits of 10-bit conversion result
Reserved: Do not use.
REGISTER 17-6: ADRESH: ADC RESULT REGISTER HIGH (ADRESH) ADFM = 1
R/W-x
—
R/W-x
—
R/W-x
—
R/W-x
—
R/W-x
—
R/W-x
—
R/W-x
R/W-x
ADRES<9:2>
bit 7
bit 0
Legend:
R = Readable bit
-n = Value at POR
W = Writable bit
‘1’ = Bit is set
U = Unimplemented bit, read as ‘0’
‘0’ = Bit is cleared x = Bit is unknown
bit 7-2
bit 1-0
Reserved: Do not use.
ADRES<9:8>: ADC Result Register bits
Upper 2 bits of 10-bit conversion result
REGISTER 17-7: ADRESL: ADC RESULT REGISTER LOW (ADRESL) ADFM = 1
R/W-x
R/W-x
R/W-x
R/W-x
R/W-x
R/W-x
R/W-x
R/W-x
ADRES<7:0>
bit 7
bit 0
Legend:
R = Readable bit
-n = Value at POR
W = Writable bit
‘1’ = Bit is set
U = Unimplemented bit, read as ‘0’
‘0’ = Bit is cleared x = Bit is unknown
bit 7-0
ADRES<7:0>: ADC Result Register bits
Lower 8 bits of 10-bit conversion result
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 303
PIC18(L)F2X/4XK22
an A/D acquisition must be done before the conversion
can be started. To calculate the minimum acquisition
time, Equation 17-1 may be used. This equation
assumes that 1/2 LSb error is used (1024 steps for the
ADC). The 1/2 LSb error is the maximum error allowed
for the ADC to meet its specified resolution.
17.3 A/D Acquisition Requirements
For the ADC to meet its specified accuracy, the charge
holding capacitor (CHOLD) must be allowed to fully
charge to the input channel voltage level. The Analog
Input model is shown in Figure 17-5. The source
impedance (RS) and the internal sampling switch (RSS)
impedance directly affect the time required to charge the
capacitor CHOLD. The sampling switch (RSS) impedance
varies over the device voltage (VDD), see Figure 17-5.
The maximum recommended impedance for analog
sources is 10 k. As the source impedance is
decreased, the acquisition time may be decreased.
After the analog input channel is selected (or changed),
EQUATION 17-1: ACQUISITION TIME EXAMPLE
Temperature = 50°C and external impedance of 10k 3.0V VDD
Assumptions:
TACQ = Amplifier Settling Time + Hold Capacitor Charging Time + Temperature Coefficient
= TAMP + TC + TCOFF
= 5µs + TC + Temperature - 25°C0.05µs/°C
The value for TC can be approximated with the following equations:
1
2047
;[1] VCHOLD charged to within 1/2 lsb
VAPPLIED1 – ----------- = VCHOLD
–TC
---------
RC
;[2] VCHOLD charge response to VAPPLIED
VAPPLIED 1 – e
= VCHOLD
–Tc
--------
RC
1
;combining [1] and [2]
= VAPPLIED1 – -----------
2047
VAPPLIED 1 – e
Solving for TC:
TC = –CHOLDRIC + RSS + RS ln(1/2047)
= –13.5pF1k + 700 + 10k ln(0.0004885)
= 1.20µs
Therefore:
TACQ = 5µs + 1.20µs + 50°C- 25°C0.05s/°C
= 7.45µs
Note 1: The reference voltage (VREF) has no effect on the equation, since it cancels itself out.
2: The charge holding capacitor (CHOLD) is discharged after each conversion.
3: The maximum recommended impedance for analog sources is 10 k. This is required to meet the pin
leakage specification.
DS41412A-page 304
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
FIGURE 17-5:
ANALOG INPUT MODEL
VDD
Sampling
Switch
ANx
Rs
SS
RIC 1k
Rss
CHOLD = 13.5 pF
VSS/VREF-
(1)
CPIN
5 pF
VA
I LEAKAGE
Discharge
Switch
3.5V
3.0V
2.5V
2.0V
1.5V
Legend: CPIN
= Input Capacitance
I LEAKAGE = Leakage current at the pin due to
various junctions
RIC
SS
= Interconnect Resistance
= Sampling Switch
CHOLD
= Sample/Hold Capacitance
100
.1
1
10
Rss (k)
Note 1: See Section 27.0 “Electrical Characteristics”.
FIGURE 17-6:
ADC TRANSFER FUNCTION
Full-Scale Range
3FFh
3FEh
3FDh
3FCh
3FBh
1/2 LSB ideal
Full-Scale
Transition
004h
003h
002h
001h
000h
Analog Input Voltage
1/2 LSB ideal
Zero-Scale
Transition
VDD/VREF+
VSS/VREF-
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 305
PIC18(L)F2X/4XK22
TABLE 17-2: REGISTERS ASSOCIATED WITH A/D OPERATION
Register
on Page
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
ADCON0
ADCON1
ADCON2
ADRESH
ADRESL
ANSELA
ANSELB
ANSELC
—
CHS<4:0>
—
GO/DONE
ADON
300
301
302
303
303
153
154
154
154
155
203
331
115
127
129
130
123
125
126
118
120
121
57
TRIGSEL
ADFM
—
—
—
PVCFG<1:0>
NVCFG<1:0>
ACQT<2:0>
ADCS<2:0>
A/D Result, High Byte
A/D Result, Low Byte
—
—
—
—
ANSA5
ANSB5
ANSC5
ANSD5
—
—
ANSA3
ANSB3
ANSC3
ANSD3
—
ANSA2
ANSB2
ANSC2
ANSD2
ANSE2
ANSA1
ANSB1
—
ANSA0
ANSB0
—
ANSB4
ANSC4
ANSD4
—
ANSC7
ANSD7
—
ANSC6
ANSD6
—
(1)
ANSELD
ANSD1
ANSE1
ANSD0
ANSE0
(1)
ANSELE
CCP5CON
CTMUCONH
INTCON
IPR1
—
—
DC5B<1:0>
CCP5M<3:0>
CTMUEN
—
CTMUSIDL
TMR0IE
RC1IP
RC2IP
—
TGEN
INT0IE
TX1IP
TX2IP
—
EDGEN
RBIE
EDGSEQEN
TMR0IF
CCP1IP
TMR5GIP
CCP5IP
CCP1IE
TMR5GIE
CCP5IE
CCP1IF
IDISSEN
INT0IF
CTTRIG
RBIF
GIE/GIEH PEIE/GIEL
—
SSP2IP
—
ADIP
BCL2IP
—
SSP1IP
CTMUIP
—
TMR2IP
TMR3GIP
CCP4IP
TMR2IE
TMR3GIE
CCP4IE
TMR2IF
TMR3GIF
CCP4IF
CCP2MD
CMP1MD
TRISA1
TRISB1
TRISC1
TRISD1
TMR1IP
TMR1GIP
CCP3IP
TMR1IE
TMR1GIE
CCP3IE
TMR1IF
TMR1GIF
CCP3IF
CCP1MD
ADCMD
TRISA0
TRISB0
TRISC0
TRISD0
IPR3
IPR4
PIE1
—
ADIE
BCL2IE
—
RC1IE
RC2IE
—
TX1IE
TX2IE
—
SSP1IE
CTMUIE
—
PIE3
SSP2IE
—
PIE4
PIR1
—
ADIF
BCL2IF
—
RC1IF
RC2IF
—
TX1IF
TX2IF
—
SSP1IF
CTMUIF
—
PIR3
SSP2IF
—
TMR5GIF
CCP5IF
PIR4
PMD1
PMD2
TRISA
TRISB
TRISC
MSSP2MD MSSP1MD
—
CCP5MD
—
CCP4MD
CTMUMD
TRISA3
TRISB3
TRISC3
TRISD3
—
CCP3MD
CMP2MD
TRISA2
—
—
—
58
TRISA7
TRISB7
TRISC7
TRISD7
WPUE3
TRISA6
TRISB6
TRISC6
TRISD6
—
TRISA5
TRISB5
TRISC5
TRISD5
—
TRISA4
TRISB4
TRISC4
TRISD4
—
155
155
155
155
155
TRISB2
TRISC2
(1)
TRISD
TRISD2
(1)
(1)
(1)
TRISE
TRISE2
TRISE1
TRISE0
Legend:
Note 1:
— = unimplemented locations, read as ‘0’. Shaded bits are not used by this module.
Available on PIC18(L)F4XK22 devices.
TABLE 17-3: CONFIGURATION REGISTERS ASSOCIATED WITH THE ADC MODULE
Register
on Page
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
CONFIG3H
MCLRE
—
P2BMX
T3CMX
HFOFST
PBADEN
356
CCP3MX
CCP2MX
Legend:
— = unimplemented locations, read as ‘0’. Shaded bits are not used by the ADC module.
DS41412A-page 306
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
FIGURE 18-1:
SINGLE COMPARATOR
18.0 COMPARATOR MODULE
Comparators are used to interface analog circuits to a
digital circuit by comparing two analog voltages and
providing a digital indication of their relative magnitudes.
The comparators are very useful mixed signal building
blocks because they provide analog functionality
independent of the program execution. The analog
comparator module includes the following features:
VIN+
VIN-
+
Output
–
VIN-
VIN+
• Independent comparator control
• Programmable input selection
• Comparator output is available internally/externally
• Programmable output polarity
• Interrupt-on-change
Output
• Wake-up from Sleep
• Programmable Speed/Power optimization
• PWM shutdown
Note:
The black areas of the output of the
comparator represents the uncertainty
due to input offsets and response time.
• Programmable and fixed voltage reference
• Selectable Hysteresis
18.1
Comparator Overview
A single comparator is shown in Figure 18-1 along with
the relationship between the analog input levels and
the digital output. When the analog voltage at VIN+ is
less than the analog voltage at VIN-, the output of the
comparator is a digital low level. When the analog
voltage at VIN+ is greater than the analog voltage at
VIN-, the output of the comparator is a digital high level.
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 307
PIC18(L)F2X/4XK22
FIGURE 18-2:
COMPARATOR C1/C2 SIMPLIFIED BLOCK DIAGRAM
CxCH<1:0>
(1)
2
CxON
CxSP
To CMxCON0 (CxOUT)
CM2CON1 (MCxOUT)
C12IN0-
C12IN1-
C12IN2-
C12IN3-
0
1
2
3
D
Q
Q
(2),(3)
Q1
EN
CxVIN-
CxVIN+
-
Cx
+
D
To Interrupts
(CxIF)
(2)
Q3
EN
CxR
CL
Read or Write
of CMxCON0
CxIN+
Reset
0
Cx Output
DAC
1
CxPOL
to PWM Logic
TRIS bit
0
1
CxSYNC
CxOE
FVR BUF1
CXVREF
0
1
CXRSEL
D
Q
CxOUT
Timer1 Clock
SYNCCxOUT
- to SR Latch
- to TxG MUX
Note 1: When C1ON = 0, the C1 comparator will produce a ‘0’ output to the XOR Gate.
2: Q1 and Q3 are phases of the four-phase system clock (FOSC).
3: Q1 is held high during Sleep mode.
DS41412A-page 308
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
18.2 Comparator Control
Note 1: The CxOE bit overrides the PORT data
latch. Setting the CxON has no impact on
the port override.
Each comparator has
Configuration register: CM1CON0 for Comparator C1
and CM2CON0 for Comparator C2. In addition,
a
separate control and
Comparator C2 has
CM2CON1, for controlling the interaction with Timer1 and
simultaneous reading of both comparator outputs.
a
second control register,
2: The internal output of the comparator is
latched with each instruction cycle.
Unless otherwise specified, external
outputs are not latched.
The CM1CON0 and CM2CON0 registers (see Registers
18-1 and 18-2, respectively) contain the control and
status bits for the following:
18.2.5
COMPARATOR OUTPUT POLARITY
Inverting the output of the comparator is functionally
equivalent to swapping the comparator inputs. The
polarity of the comparator output can be inverted by
setting the CxPOL bit of the CMxCON0 register.
Clearing the CxPOL bit results in a non-inverted output.
• Enable
• Input selection
• Reference selection
• Output selection
• Output polarity
• Speed selection
Table 18-1 shows the output state versus input
conditions, including polarity control.
TABLE 18-1: COMPARATOR OUTPUT
STATE VS. INPUT
18.2.1
COMPARATOR ENABLE
Setting the CxON bit of the CMxCON0 register enables
the comparator for operation. Clearing the CxON bit
disables the comparator resulting in minimum current
consumption.
CONDITIONS
Input Condition
CxPOL
CxOUT
CxVIN- > CxVIN+
CxVIN- < CxVIN+
CxVIN- > CxVIN+
CxVIN- < CxVIN+
0
0
1
1
0
1
1
0
18.2.2
COMPARATOR INPUT SELECTION
The CxCH<1:0> bits of the CMxCON0 register direct
one of four analog input pins to the comparator
inverting input.
18.2.6
COMPARATOR SPEED SELECTION
Note:
To use CxIN+ and C12INx- pins as analog
inputs, the appropriate bits must be set in
the ANSEL register and the corresponding
TRIS bits must also be set to disable the
output drivers.
The trade-off between speed or power can be
optimized during program execution with the CxSP
control bit. The default state for this bit is ‘1’ which
selects the normal speed mode. Device power
consumption can be optimized at the cost of slower
comparator propagation delay by clearing the CxSP bit
to ‘0’.
18.2.3
COMPARATOR REFERENCE
SELECTION
Setting the CxR bit of the CMxCON0 register directs an
internal voltage reference or an analog input pin to the
non-inverting input of the comparator. See
Section 21.0 “Fixed Voltage Reference (FVR)” for
more information on the Internal Voltage Reference
module.
18.3 Comparator Response Time
The comparator output is indeterminate for a period of
time after the change of an input source or the selection
of a new reference voltage. This period is referred to as
the response time. The response time of the
comparator differs from the settling time of the voltage
reference. Therefore, both of these times must be
considered when determining the total response time
to a comparator input change. See the Comparator and
Voltage Reference Specifications in Section 27.0
“Electrical Characteristics” for more details.
18.2.4
COMPARATOR OUTPUT
SELECTION
The output of the comparator can be monitored by
reading either the CxOUT bit of the CMxCON0 register
or the MCxOUT bit of the CM2CON1 register. In order
to make the output available for an external connection,
the following conditions must be true:
• CxOE bit of the CMxCON0 register must be set
• Corresponding TRIS bit must be cleared
• CxON bit of the CMxCON0 register must be set
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 309
PIC18(L)F2X/4XK22
18.4.1
PRESETTING THE MISMATCH
LATCHES
18.4 Comparator Interrupt Operation
The comparator interrupt flag will be set whenever
there is a change in the output value of the comparator.
Changes are recognized by means of a mismatch
circuit which consists of two latches and an exclusive-
or gate (see Figure 18-2). The first latch is updated with
the comparator output value, when the CMxCON0
register is read or written. The value is latched on the
third cycle of the system clock, also known as Q3. This
first latch retains the comparator value until another
read or write of the CMxCON0 register occurs or a
Reset takes place. The second latch is updated with
the comparator output value on every first cycle of the
system clock, also known as Q1. When the output
value of the comparator changes, the second latch is
updated and the output values of both latches no
longer match one another, resulting in a mismatch
condition. The latch outputs are fed directly into the
inputs of an exclusive-or gate. This mismatch condition
is detected by the exclusive-or gate and sent to the
interrupt circuitry. The mismatch condition will persist
until the first latch value is updated by performing a
read of the CMxCON0 register or the comparator
output returns to the previous state.
The comparator mismatch latches can be preset to the
desired state before the comparators are enabled.
When the comparator is off the CxPOL bit controls the
CxOUT level. Set the CxPOL bit to the desired CxOUT
non-interrupt level while the CxON bit is cleared. Then,
configure the desired CxPOL level in the same instruc-
tion that the CxON bit is set. Since all register writes are
performed as a read-modify-write, the mismatch
latches will be cleared during the instruction read
phase and the actual configuration of the CxON and
CxPOL bits will be occur in the final write phase.
FIGURE 18-3:
COMPARATOR
INTERRUPT TIMING W/O
CMxCON0 READ
Q1
Q3
CxIN+
TRT
CxIN
Set CxIF (edge)
CxIF
Note 1: A write operation to the CMxCON0
register will also clear the mismatch
condition because all writes include a read
operation at the beginning of the write
cycle.
Reset by Software
FIGURE 18-4:
COMPARATOR
INTERRUPT TIMING WITH
CMxCON0 READ
2: Comparator interrupts will operate correctly
regardless of the state of CxOE.
Q1
When the mismatch condition occurs, the comparator
interrupt flag is set. The interrupt flag is triggered by the
edge of the changing value coming from the exclusive-
or gate. This means that the interrupt flag can be reset
once it is triggered without the additional step of read-
ing or writing the CMxCON0 register to clear the mis-
match latches. When the mismatch registers are
cleared, an interrupt will occur upon the comparator’s
return to the previous state, otherwise no interrupt will
be generated.
Q3
CxIN+
TRT
CxOUT
Set CxIF (edge)
CxIF
Cleared by CMxCON0 Read
Reset by Software
Note 1: If a change in the CMxCON0 register
(CxOUT) should occur when a read oper-
ation is being executed (start of the Q2
cycle), then the CxIF interrupt flag of the
PIR2 register may not get set.
Software will need to maintain information about the
status of the comparator output, as read from the
CMxCON0 register, or CM2CON1 register, to determine
the actual change that has occurred. See Figures 18-3
and 18-4.
2: When either comparator is first enabled,
bias circuitry in the comparator module
may cause an invalid output from the
comparator until the bias circuitry is stable.
Allow about 1 s for bias settling then clear
the mismatch condition and interrupt flags
before enabling comparator interrupts.
The CxIF bit of the PIR2 register is the comparator
interrupt flag. This bit must be reset by software by
clearing it to ‘0’. Since it is also possible to write a ‘1’ to
this register, an interrupt can be generated.
In mid-range Compatibility mode the CxIE bit of the
PIE2 register and the PEIE/GIEL and GIE/GIEH bits of
the INTCON register must all be set to enable compar-
ator interrupts. If any of these bits are cleared, the inter-
rupt is not enabled, although the CxIF bit of the PIR2
register will still be set if an interrupt condition occurs.
DS41412A-page 310
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
18.5 Operation During Sleep
18.6 Effects of a Reset
The comparator, if enabled before entering Sleep mode,
remains active during Sleep. The additional current
consumed by the comparator is shown separately in
Section 27.0 “Electrical Characteristics”. If the
comparator is not used to wake the device, power
consumption can be minimized while in Sleep mode by
turning off the comparator. Each comparator is turned off
by clearing the CxON bit of the CMxCON0 register.
A device Reset forces the CMxCON0 and CM2CON1
registers to their Reset states. This forces both
comparators and the voltage references to their Off
states.
A change to the comparator output can wake-up the
device from Sleep. To enable the comparator to wake
the device from Sleep, the CxIE bit of the PIE2 register
and the PEIE/GIEL bit of the INTCON register must be
set. The instruction following the SLEEP instruction
always executes following a wake from Sleep. If the
GIE/GIEH bit of the INTCON register is also set, the
device will then execute the Interrupt Service Routine.
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 311
PIC18(L)F2X/4XK22
REGISTER 18-1: CM1CON0: COMPARATOR 1 CONTROL REGISTER
R/W-0
C1ON
R-0
R/W-0
C1OE
R/W-0
R/W-1
C1SP
R/W-0
C1R
R/W-0
R/W-0
C1OUT
C1POL
C1CH<1:0>
bit 7
bit 0
Legend:
R = Readable bit
-n = Value at POR
W = Writable bit
‘1’ = Bit is set
U = Unimplemented bit, read as ‘0’
‘0’ = Bit is cleared x = Bit is unknown
bit 7
bit 6
C1ON: Comparator C1 Enable bit
1= Comparator C1 is enabled
0= Comparator C1 is disabled
C1OUT: Comparator C1 Output bit
If C1POL = 1 (inverted polarity):
C1OUT = 0when C1VIN+ > C1VIN-
C1OUT = 1when C1VIN+ < C1VIN-
If C1POL = 0 (non-inverted polarity):
C1OUT = 1when C1VIN+ > C1VIN-
C1OUT = 0when C1VIN+ < C1VIN-
bit 5
bit 4
bit 3
bit 2
bit 1-0
C1OE: Comparator C1 Output Enable bit
1= C1OUT is present on the C1OUT pin(1)
0= C1OUT is internal only
C1POL: Comparator C1 Output Polarity Select bit
1= C1OUT logic is inverted
0= C1OUT logic is not inverted
C1SP: Comparator C1 Speed/Power Select bit
1= C1 operates in normal power, higher speed mode
0= C1 operates in low-power, low-speed mode
C1R: Comparator C1 Reference Select bit (non-inverting input)
1= C1VIN+ connects to C1VREF output
0= C1VIN+ connects to C12IN+ pin
C1CH<1:0>: Comparator C1 Channel Select bit
00= C12IN0- pin of C1 connects to C1VIN-
01= C12IN1- pin of C1 connects to C1VIN-
10= C12IN2- pin of C1 connects to C1VIN-
11= C12IN3- pin of C1 connects to C1VIN-
Note 1: Comparator output requires the following three conditions: C1OE = 1, C1ON = 1and corresponding port
TRIS bit = 0.
DS41412A-page 312
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
REGISTER 18-2: CM2CON: COMPARATOR 2 CONTROL REGISTER
R/W-0
C2ON
R-0
R/W-0
C2OE
R/W-0
R/W-1
C2SP
R/W-0
C2R
R/W-0
R/W-0
C2OUT
C2POL
C2CH<1:0>
bit 7
bit 0
Legend:
R = Readable bit
-n = Value at POR
W = Writable bit
‘1’ = Bit is set
U = Unimplemented bit, read as ‘0’
‘0’ = Bit is cleared x = Bit is unknown
bit 7
bit 6
C2ON: Comparator C2 Enable bit
1= Comparator C2 is enabled
0= Comparator C2 is disabled
C2OUT: Comparator C2 Output bit
If C2POL = 1 (inverted polarity):
C2OUT = 0when C2VIN+ > C2VIN-
C2OUT = 1when C2VIN+ < C2VIN-
If C2POL = 0 (non-inverted polarity):
C2OUT = 1when C2VIN+ > C2VIN-
C2OUT = 0when C2VIN+ < C2VIN-
bit 5
bit 4
bit 3
bit 2
bit 1-0
C2OE: Comparator C2 Output Enable bit
1= C2OUT is present on C2OUT pin(1)
0= C2OUT is internal only
C2POL: Comparator C2 Output Polarity Select bit
1= C2OUT logic is inverted
0= C2OUT logic is not inverted
C2SP: Comparator C2 Speed/Power Select bit
1= C2 operates in normal power, higher speed mode
0= C2 operates in low-power, low-speed mode
C2R: Comparator C2 Reference Select bits (non-inverting input)
1= C2VIN+ connects to C2VREF
0= C2VIN+ connects to C2IN+ pin
C2CH<1:0>: Comparator C2 Channel Select bits
00= C12IN0- pin of C2 connects to C2VIN-
01= C12IN1- pin of C2 connects to C2VIN-
10= C12IN2- pin of C2 connects to C2VIN-
11= C12IN3- pin of C2 connects to C2VIN-
Note 1: Comparator output requires the following three conditions: C2OE = 1, C2ON = 1and corresponding port
TRIS bit = 0.
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 313
PIC18(L)F2X/4XK22
18.7 Analog Input Connection
Considerations
Note 1: When reading a PORT register, all pins
configured as analog inputs will read as a
‘0’. Pins configured as digital inputs will
convert as an analog input, according to
the input specification.
A simplified circuit for an analog input is shown in
Figure 18-5. Since the analog input pins share their
connection with a digital input, they have reverse
biased ESD protection diodes to VDD and VSS. The
analog input, therefore, must be between VSS and VDD.
If the input voltage deviates from this range by more
than 0.6V in either direction, one of the diodes is
forward biased and a latch-up may occur.
2: Analog levels on any pin defined as a
digital input, may cause the input buffer to
consume more current than is specified.
A maximum source impedance of 10 k is recommended
for the analog sources. Also, any external component
connected to an analog input pin, such as a capacitor or
a Zener diode, should have very little leakage current to
minimize inaccuracies introduced.
FIGURE 18-5:
ANALOG INPUT MODEL
VDD
VT 0.6V
RIC
Rs < 10K
To Comparator
AIN
(1)
ILEAKAGE
CPIN
5 pF
VA
VT 0.6V
Vss
Legend: CPIN
= Input Capacitance
ILEAKAGE = Leakage Current at the pin due to various junctions
RIC
RS
VA
= Interconnect Resistance
= Source Impedance
= Analog Voltage
VT
= Threshold Voltage
Note 1: See Section 27.0 “Electrical Characteristics”.
DS41412A-page 314
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
18.8.3
COMPARATOR HYSTERESIS
18.8 Additional Comparator Features
Each Comparator has a selectable hysteresis feature.
The hysteresis can be enabled by setting the CxHYS
bit of the CM2CON1 register. See Section 27.0 “Elec-
trical Characteristics” for more details.
There are four additional comparator features:
• Simultaneous read of comparator outputs
• Internal reference selection
• Hysteresis selection
18.8.4
SYNCHRONIZING COMPARATOR
OUTPUT TO TIMER1
• Output Synchronization
18.8.1
SIMULTANEOUS COMPARATOR
OUTPUT READ
The Comparator Cx output can be synchronized with
Timer1 by setting the CxSYNC bit of the CM2CON1
register. When enabled, the Cx output is latched on
the falling edge of the Timer1 source clock. If a
prescaler is used with Timer1, the comparator output
is latched after the prescaling function. To prevent a
race condition between the Timer1 clock and Timer1
gate, Timer1 increments on the rising edge of its clock
source, and the falling edge latches the comparator
output. See the Comparator Block Diagram
(Figure 18-2) and the Timer1 Block Diagram
(Figure 12-1) for more information.
The MC1OUT and MC2OUT bits of the CM2CON1
register are mirror copies of both comparator outputs.
The ability to read both outputs simultaneously from a
single register eliminates the timing skew of reading
separate registers.
Note 1: Obtaining the status of C1OUT or C2OUT
by reading CM2CON1 does not affect the
comparator interrupt mismatch registers.
18.8.2
INTERNAL REFERENCE
SELECTION
There are two internal voltage references available to
the non-inverting input of each comparator. One of
these is the Fixed Voltage Reference (FVR) and the
other is the variable Digital-to-Analog Converter (DAC).
The CxRSEL bit of the CM2CON1 register determines
which of these references is routed to the Comparator
Voltage reference output (CXVREF). Further routing to
the comparator is accomplished by the CxR bit of the
CMxCON0 register. See Section 21.0 “Fixed Voltage
Reference (FVR)” and Figure 18-2 for more detail.
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 315
PIC18(L)F2X/4XK22
REGISTER 18-3: CM2CON1: COMPARATOR 1 AND 2 CONTROL REGISTER
R-0
R-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
MC1OUT
MC2OUT
C1RSEL
C2RSEL
C1HYS
C2HYS
C1SYNC
C2SYNC
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
‘1’ = Bit is set
U = Unimplemented bit, read as ‘0’
‘0’ = Bit is cleared x = Bit is unknown
-n = Value at POR
bit 7
bit 6
bit 5
MC1OUT: Mirror Copy of C1OUT bit
MC2OUT: Mirror Copy of C2OUT bit
C1RSEL: Comparator C1 Reference Select bit
1= FVR BUF1 routed to C1VREF input
0= DAC routed to C1VREF input
bit 4
C2RSEL: Comparator C2 Reference Select bit
1= FVR BUF1 routed to C2VREF input
0= DAC routed to C2VREF input
bit 3
bit 2
bit 1
bit 0
C1HYS: Comparator C1 Hysteresis Enable bit
1= Comparator C1 hysteresis enabled
0= Comparator C1 hysteresis disabled
C2HYS: Comparator C2 Hysteresis Enable bit
1= Comparator C2 hysteresis enabled
0= Comparator C2 hysteresis disabled
C1SYNC: C1 Output Synchronous Mode bit
1= C1 output is synchronized to rising edge of TMR1 clock (T1CLK)
0= C1 output is asynchronous
C2SYNC: C2 Output Synchronous Mode bit
1= C2 output is synchronized to rising edge of TMR1 clock (T1CLK)
0= C2 output is asynchronous
DS41412A-page 316
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
TABLE 18-2: REGISTERS ASSOCIATED WITH COMPARATOR MODULE
Register
on Page
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
ANSELA
—
—
—
—
ANSA5
—
ANSA3
ANSB3
ANSA2
ANSB2
ANSA1
ANSB1
ANSA0
ANSB0
153
154
316
312
313
343
344
340
115
128
124
119
58
ANSELB
ANSB5 ANSB4
CM2CON1
CM1CON0
CM2CON0
MC1OUT MC2OUT C1RSEL C2RSEL C1HYS
C2HYS C1SYNC C2SYNC
C1ON
C2ON
C1OUT
C2OUT
C1OE
C2OE
C1POL
C2POL
—
C1SP
C2SP
C1R
C2R
C1CH<1:0>
C2CH<1:0>
VREFCON1 DACEN
VREFCON2
VREFCON0 FVREN
DACLPS DACOE
DACPSS<1:0>
DACR<4:0>
—
DACNSS
—
—
—
FVRST
FVRS<1:0>
—
—
—
—
INTCON
IPR2
GIE/GIEH PEIE/GIEL TMR0IE INT0IE
RBIE
TMR0IF
HLVDIP
HLVDIE
HLVDIF
INT0IF
RBIF
OSCFIP
OSCFIE
OSCFIF
—
C1IP
C1IE
C2IP
C2IE
C2IF
—
EEIP
EEIE
EEIF
—
BCL1IP
BCL1IE
BCL1IF
TMR3IP CCP2IP
TMR3IE CCP2IE
TMR3IF CCP2IF
PIE2
PIR2
C1IF
PMD2
TRISA
TRISB
—
CTMUMD CMP2MD CMP1MD ADCMD
TRISA7
TRISB7
TRISA6
TRISB6
TRISA5 TRISA4
TRISB5 TRISB4
TRISA3
TRISB3
TRISA2
TRISB2
TRISA1
TRISB1
TRISA0
TRISB0
155
155
Legend: — = unimplemented locations, read as ‘0’. Shaded bits are not used by the Comparator Module.
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 317
PIC18(L)F2X/4XK22
NOTES:
DS41412A-page 318
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
• Time measurement resolution of 1 nanosecond
• High precision time measurement
19.0 CHARGE TIME
MEASUREMENT UNIT (CTMU)
• Time delay of external or internal signal
asynchronous to system clock
The Charge Time Measurement Unit (CTMU) is a
flexible analog module that provides accurate
differential time measurement between pulse sources,
as well as asynchronous pulse generation. By working
with other on-chip analog modules, the CTMU can be
used to precisely measure time, measure capacitance,
measure relative changes in capacitance or generate
output pulses with a specific time delay. The CTMU is
ideal for interfacing with capacitive-based sensors.
• Accurate current source suitable for capacitive
measurement
The CTMU works in conjunction with the A/D Converter
to provide up to 28(1) channels for time or charge
measurement, depending on the specific device and
the number of A/D channels available. When config-
ured for time delay, the CTMU is connected to the
C12IN1- input of Comparator 2. The level-sensitive
input edge sources can be selected from four sources:
two external input pins (CTED1/CTED2) or the ECCP1/
(E)CCP2 Special Event Triggers.
The module includes the following key features:
• Up to 28(1) channels available for capacitive or
time measurement input
• On-chip precision current source
• Four-edge input trigger sources
• Polarity control for each edge source
• Control of edge sequence
Figure 19-1 provides a block diagram of the CTMU.
Note 1: PIC18(L)F2XK22 devices have up to 17
channels available.
• Control of response to edges
FIGURE 19-1:
CTMU BLOCK DIAGRAM
CTMUCONH/CTMUCONL
CTMUICON
ITRIM<5:0>
EDGEN
EDGSEQEN
EDG1SELx
EDG1POL
EDG2SELx
EDG2POL
TGEN
IDISSEN
CTTRIG
IRNG<1:0>
EDG1STAT
EDG2STAT
Current Source
Edge
Control
Logic
CTED1
CTMU
Control
Logic
CTED2
Current
Control
ECCP2
ECCP1
Pulse
Generator
CTPLS
A/D Converter
Comparator 2
Input
Comparator 2 Output
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 319
PIC18(L)F2X/4XK22
19.1.2
CURRENT SOURCE
19.1 CTMU Operation
At the heart of the CTMU is a precision current source,
designed to provide a constant reference for measure-
ments. The level of current is user-selectable across
three ranges or a total of two orders of magnitude, with
the ability to trim the output in ±2% increments
(nominal). The current range is selected by the
IRNG<1:0> bits (CTMUICON<1:0>), with a value of
‘00’ representing the lowest range.
The CTMU works by using a fixed current source to
charge a circuit. The type of circuit depends on the type
of measurement being made. In the case of charge
measurement, the current is fixed, and the amount of
time the current is applied to the circuit is fixed. The
amount of voltage read by the A/D is then a measure-
ment of the capacitance of the circuit. In the case of
time measurement, the current, as well as the capaci-
tance of the circuit, is fixed. In this case, the voltage
read by the A/D is then representative of the amount of
time elapsed from the time the current source starts
and stops charging the circuit.
Current trim is provided by the ITRIM<5:0> bits
(CTMUICON<7:2>). These six bits allow trimming of
the current source in steps of approximately 2% per
step. Note that half of the range adjusts the current
source positively and the other half reduces the current
source. A value of ‘000000’ is the neutral position (no
change). A value of ‘100000’ is the maximum negative
adjustment (approximately -62%) and ‘011111’ is the
maximum positive adjustment (approximately +62%).
If the CTMU is being used as a time delay, both
capacitance and current source are fixed, as well as the
voltage supplied to the comparator circuit. The delay of
a signal is determined by the amount of time it takes the
voltage to charge to the comparator threshold voltage.
19.1.3
EDGE SELECTION AND CONTROL
19.1.1
THEORY OF OPERATION
CTMU measurements are controlled by edge events
occurring on the module’s two input channels. Each
channel, referred to as Edge 1 and Edge 2, can be con-
figured to receive input pulses from one of the edge
input pins (CTED1 and CTED2) or ECCPx Special
Event Triggers. The input channels are level-sensitive,
responding to the instantaneous level on the channel
rather than a transition between levels. The inputs are
selected using the EDG1SEL and EDG2SEL bit pairs
(CTMUCONL<3:2 and 6:5>).
The operation of the CTMU is based on the equation
for charge:
dV
C = I ------
dT
More simply, the amount of charge measured in
coulombs in a circuit is defined as current in amperes
(I) multiplied by the amount of time in seconds that the
current flows (t). Charge is also defined as the
capacitance in farads (C) multiplied by the voltage of
the circuit (V). It follows that:
In addition to source, each channel can be configured for
event polarity using the EDGE2POL and EDGE1POL
bits (CTMUCONL<7,4>). The input channels can also
be filtered for an edge event sequence (Edge 1 occur-
ring before Edge 2) by setting the EDGSEQEN bit
(CTMUCONH<2>).
I t = C V.
The CTMU module provides a constant, known current
source. The A/D Converter is used to measure (V) in
the equation, leaving two unknowns: capacitance (C)
and time (t). The above equation can be used to calcu-
late capacitance or time, by either the relationship
using the known fixed capacitance of the circuit:
19.1.4
EDGE STATUS
The CTMUCONL register also contains two Status bits:
EDG2STAT and EDG1STAT (CTMUCONL<1:0>).
Their primary function is to show if an edge response
has occurred on the corresponding channel. The
CTMU automatically sets a particular bit when an edge
response is detected on its channel. The level-sensitive
nature of the input channels also means that the Status
bits become set immediately if the channel’s configura-
tion is changed and is the same as the channel’s
current state.
t = C V I
or by:
C = I t V
using a fixed time that the current source is applied to
the circuit.
DS41412A-page 320
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
The module uses the edge Status bits to control the
current source output to external analog modules (such
as the A/D Converter). Current is only supplied to
external modules when only one (but not both) of the
Status bits is set, and shuts current off when both bits
are either set or cleared. This allows the CTMU to
measure current only during the interval between
edges. After both Status bits are set, it is necessary to
clear them before another measurement is taken. Both
bits should be cleared simultaneously, if possible, to
avoid re-enabling the CTMU current source.
19.2 CTMU Module Initialization
The following sequence is a general guideline used to
initialize the CTMU module:
1. Select the current source range using the IRNG
bits (CTMUICON<1:0>).
2. Adjust the current source trim using the ITRIM
bits (CTMUICON<7:2>).
3. Configure the edge input sources for Edge 1 and
Edge 2 by setting the EDG1SEL and EDG2SEL
bits (CTMUCONL<3:2 and 6:5>).
In addition to being set by the CTMU hardware, the
edge Status bits can also be set by software. This is
also the user’s application to manually enable or
disable the current source. Setting either one (but not
both) of the bits enables the current source. Setting or
clearing both bits at once disables the source.
4. Configure the input polarities for the edge inputs
using the EDG1POL and EDG2POL bits
(CTMUCONL<4,7>). The default configuration
is for negative edge polarity (high-to-low
transitions).
5. Enable edge sequencing using the EDGSEQEN
bit (CTMUCONH<2>). By default, edge
sequencing is disabled.
19.1.5
INTERRUPTS
The CTMU sets its interrupt flag (PIR3<2>) whenever
the current source is enabled, then disabled. An
interrupt is generated only if the corresponding
interrupt enable bit (PIE3<2>) is also set. If edge
sequencing is not enabled (i.e., Edge 1 must occur
before Edge 2), it is necessary to monitor the edge
Status bits and determine which edge occurred last and
caused the interrupt.
6. Select the operating mode (Measurement or
Time Delay) with the TGEN bit. The default
mode is Time/Capacitance Measurement.
7. Discharge the connected circuit by setting the
IDISSEN bit (CTMUCONH<1>); after waiting a
sufficient time for the circuit to discharge, clear
IDISSEN.
8. Disable the module by clearing the CTMUEN bit
(CTMUCONH<7>).
9. Enable the module by setting the CTMUEN bit.
10. Clear the Edge Status bits: EDG2STAT and
EDG1STAT (CTMUCONL<1:0>).
11. Enable both edge inputs by setting the EDGEN
bit (CTMUCONH<3>).
Depending on the type of measurement or pulse
generation being performed, one or more additional
modules may also need to be initialized and configured
with the CTMU module:
• Edge Source Generation: In addition to the
external edge input pins, both Timer1 and the
Output Compare/PWM1 module can be used as
edge sources for the CTMU.
• Capacitance or Time Measurement: The CTMU
module uses the A/D Converter to measure the
voltage across a capacitor that is connected to one
of the analog input channels.
• Pulse Generation: When generating system clock
independent output pulses, the CTMU module
uses Comparator 2 and the associated
comparator voltage reference.
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 321
PIC18(L)F2X/4XK22
FIGURE 19-2:
CTMU CURRENT SOURCE
CALIBRATION CIRCUIT
19.3 Calibrating the CTMU Module
The CTMU requires calibration for precise
measurements of capacitance and time, as well as for
accurate time delay. If the application only requires
measurement of a relative change in capacitance or
time, calibration is usually not necessary. An example of
this type of application would include a capacitive touch
switch, in which the touch circuit has a baseline
capacitance, and the added capacitance of the human
body changes the overall capacitance of a circuit.
PIC18(L)FXXK22 Device
CTMU
Current Source
A/D Converter
If actual capacitance or time measurement is required,
two hardware calibrations must take place: the current
source needs calibration to set it to a precise current,
and the circuit being measured needs calibration to
measure and/or nullify all other capacitance other than
that to be measured.
ANx
A/D
RCAL
MUX
19.3.1
CURRENT SOURCE CALIBRATION
A value of 70% of full-scale voltage is chosen to make
sure that the A/D Converter was in a range that is well
above the noise floor. Keep in mind that if an exact cur-
rent is chosen, that is to incorporate the trimming bits
from CTMUICON, the resistor value of RCAL may need
to be adjusted accordingly. RCAL may also be adjusted
to allow for available resistor values. RCAL should be of
the highest precision available, keeping in mind the
amount of precision needed for the circuit that the
CTMU will be used to measure. A recommended
minimum would be 0.1% tolerance.
The current source on board the CTMU module has a
range of ±60% nominal for each of three current
ranges. Therefore, for precise measurements, it is
possible to measure and adjust this current source by
placing a high precision resistor, RCAL, onto an unused
analog channel. An example circuit is shown in
Figure 19-2. The current source measurement is
performed using the following steps:
1. Initialize the A/D Converter.
2. Initialize the CTMU.
3. Enable the current source by setting EDG1STAT
(CTMUCONL<0>).
The following examples show one typical method for
performing a CTMU current calibration. Example 19-1
demonstrates how to initialize the A/D Converter and
the CTMU; this routine is typical for applications using
both modules. Example 19-2 demonstrates one
method for the actual calibration routine.
4. Issue settling time delay.
5. Perform A/D conversion.
6. Calculate the current source current using
I = V/RCAL, where RCAL is a high precision
resistance and V is measured by performing an
A/D conversion.
The CTMU current source may be trimmed with the
trim bits in CTMUICON using an iterative process to get
an exact desired current. Alternatively, the nominal
value without adjustment may be used; it may be
stored by the software for use in all subsequent
capacitive or time measurements.
To calculate the value for RCAL, the nominal current
must be chosen, and then the resistance can be
calculated. For example, if the A/D Converter reference
voltage is 3.3V, use 70% of full scale, or 2.31V as the
desired approximate voltage to be read by the A/D
Converter. If the range of the CTMU current source is
selected to be 0.55 A, the resistor value needed is cal-
culated as RCAL = 2.31V/0.55 A, for a value of 4.2 MΩ.
Similarly, if the current source is chosen to be 5.5 A,
RCAL would be 420,000Ω, and 42,000Ω if the current
source is set to 55 A.
DS41412A-page 322
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
EXAMPLE 19-1:
SETUP FOR CTMU CALIBRATION ROUTINES
#include "p18cxxx.h"
/**************************************************************************/
/*Setup CTMU *****************************************************************/
/**************************************************************************/
void setup(void)
{ //CTMUCONH/1 - CTMU Control registers
CTMUCONH = 0x00;
CTMUCONL = 0x90;
//make sure CTMU is disabled
//CTMU continues to run when emulator is stopped,CTMU continues
//to run in idle mode,Time Generation mode disabled, Edges are blocked
//No edge sequence order, Analog current source not grounded, trigger
//output disabled, Edge2 polarity = positive level, Edge2 source =
//source 0, Edge1 polarity = positive level, Edge1 source = source 0,
//CTMUICON - CTMU Current Control Register
CTMUICON = 0x01;
//0.55uA, Nominal - No Adjustment
/**************************************************************************/
//Setup AD converter;
/**************************************************************************/
TRISA=0x04;
//set channel 2 as an input
// Configure AN2 as an analog channel
ANSELAbits.ANSA2=1;
TRISAbits.TRISA2=1;
// ADCON2
ADCON2bits.ADFM=1;
ADCON2bits.ACQT=1;
ADCON2bits.ADCS=2;
// Results format 1= Right justified
// Acquition time 7 = 20TAD 2 = 4TAD 1=2TAD
// Clock conversion bits 6= FOSC/64 2=FOSC/32
// ADCON1
ADCON1bits.PVCFG0 =0;
ADCON1bits.NVCFG1 =0;
// ADCON0
// Vref+ = AVdd
// Vref- = AVss
ADCON0bits.CHS=2;
// Select ADC channel
// Turn on ADC
ADCON0bits.ADON=1;
}
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 323
PIC18(L)F2X/4XK22
EXAMPLE 19-2:
CURRENT CALIBRATION ROUTINE
#include "p18cxxx.h"
#define COUNT 500
//@ 8MHz = 125uS.
#define DELAY for(i=0;i<COUNT;i++)
#define RCAL .027
//R value is 4200000 (4.2M)
//scaled so that result is in
//1/100th of uA
#define ADSCALE 1023
#define ADREF 3.3
//for unsigned conversion 10 sig bits
//Vdd connected to A/D Vr+
int main(void)
{
int i;
int j = 0;
//index for loop
unsigned int Vread = 0;
double VTot = 0;
float Vavg=0, Vcal=0, CTMUISrc = 0;
//float values stored for calcs
//assume CTMU and A/D have been setup correctly
//see Example 25-1 for CTMU & A/D setup
setup();
CTMUCONHbits.CTMUEN = 1;
CTMUCONLbits.EDG1STAT = 0;
CTMUCONLbits.EDG2STAT = 0;
for(j=0;j<10;j++)
//Enable the CTMU
// Set Edge status bits to zero
{
CTMUCONHbits.IDISSEN = 1;
DELAY;
//drain charge on the circuit
//wait 125us
CTMUCONHbits.IDISSEN = 0;
//end drain of circuit
CTMUCONLbits.EDG1STAT = 1;
//Begin charging the circuit
//using CTMU current source
//wait for 125us
DELAY;
CTMUCONLbits.EDG1STAT = 0;
//Stop charging circuit
PIR1bits.ADIF = 0;
ADCON0bits.GO=1;
//make sure A/D Int not set
//and begin A/D conv.
while(!PIR1bits.ADIF);
//Wait for A/D convert complete
Vread = ADRES;
PIR1bits.ADIF = 0;
VTot += Vread;
//Get the value from the A/D
//Clear A/D Interrupt Flag
//Add the reading to the total
}
Vavg = (float)(VTot/10.000);
Vcal = (float)(Vavg/ADSCALE*ADREF);
CTMUISrc = Vcal/RCAL;
//Average of 10 readings
//CTMUISrc is in 1/100ths of uA
}
DS41412A-page 324
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
19.3.2
CAPACITANCE CALIBRATION
There is a small amount of capacitance from the
internal A/D Converter sample capacitor as well as
stray capacitance from the circuit board traces and
pads that affect the precision of capacitance
measurements.
A
measurement of the stray
capacitance can be taken by making sure the desired
capacitance to be measured has been removed. The
measurement is then performed using the following
steps:
1. Initialize the A/D Converter and the CTMU.
2. Set EDG1STAT (= 1).
3. Wait for a fixed delay of time t.
4. Clear EDG1STAT.
5. Perform an A/D conversion.
6. Calculate the stray and A/D sample capacitances:
COFFSET = CSTRAY + CAD = I t V
where I is known from the current source measurement
step, t is a fixed delay and V is measured by performing
an A/D conversion.
This measured value is then stored and used for
calculations of time measurement or subtracted for
capacitance measurement. For calibration, it is
expected that the capacitance of CSTRAY + CAD is
approximately known. CAD is approximately 4 pF.
An iterative process may need to be used to adjust the
time, t, that the circuit is charged to obtain a reasonable
voltage reading from the A/D Converter. The value of t
may be determined by setting COFFSET to a theoretical
value, then solving for t. For example, if CSTRAY is
theoretically calculated to be 11 pF, and V is expected
to be 70% of VDD, or 2.31V, then t would be:
(4 pF + 11 pF) • 2.31V/0.55 A
or 63 s.
See Example 19-3 for a typical routine for CTMU
capacitance calibration.
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 325
PIC18(L)F2X/4XK22
EXAMPLE 19-3:
CAPACITANCE CALIBRATION ROUTINE
#include "p18cxxx.h"
#define COUNT 25
//@ 8MHz INTFRC = 62.5 us.
//time in uS
#define ETIME COUNT*2.5
#define DELAY for(i=0;i<COUNT;i++)
#define ADSCALE 1023
bits
//for unsigned conversion 10 sig
#define ADREF 3.3
#define RCAL .027
//Vdd connected to A/D Vr+
//R value is 4200000 (4.2M)
//scaled so that result is in
//1/100th of uA
int main(void)
{
int i;
int j = 0;
//index for loop
unsigned int Vread = 0;
float CTMUISrc, CTMUCap, Vavg, VTot, Vcal;
//assume CTMU and A/D have been setup correctly
//see Example 25-1 for CTMU & A/D setup
setup();
CTMUCONHbits.CTMUEN = 1;
CTMUCONLbits.EDG1STAT = 0;
CTMUCONLbits.EDG2STAT = 0;
for(j=0;j<10;j++)
//Enable the CTMU
// Set Edge status bits to zero
{
CTMUCONHbits.IDISSEN = 1;
DELAY;
//drain charge on the circuit
//wait 125us
CTMUCONHbits.IDISSEN = 0;
//end drain of circuit
CTMUCONLbits.EDG1STAT = 1;
//Begin charging the circuit
//using CTMU current source
//wait for 125us
DELAY;
CTMUCONLbits.EDG1STAT = 0;
//Stop charging circuit
PIR1bits.ADIF = 0;
ADCON0bits.GO=1;
//make sure A/D Int not set
//and begin A/D conv.
while(!PIR1bits.ADIF);
//Wait for A/D convert complete
Vread = ADRES;
PIR1bits.ADIF = 0;
VTot += Vread;
//Get the value from the A/D
//Clear A/D Interrupt Flag
//Add the reading to the total
}
Vavg = (float)(VTot/10.000);
Vcal = (float)(Vavg/ADSCALE*ADREF);
CTMUISrc = Vcal/RCAL;
//Average of 10 readings
//CTMUISrc is in 1/100ths of uA
CTMUCap = (CTMUISrc*ETIME/Vcal)/100;
}
DS41412A-page 326
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
19.4.2
RELATIVE CHARGE
MEASUREMENT
19.4 Measuring Capacitance with the
CTMU
An application may not require precise capacitance
measurements. For example, when detecting a valid
press of a capacitance-based switch, detecting a rela-
tive change of capacitance is of interest. In this type of
application, when the switch is open (or not touched),
the total capacitance is the capacitance of the combina-
tion of the board traces, the A/D Converter, etc. A larger
voltage will be measured by the A/D Converter. When
the switch is closed (or is touched), the total
capacitance is larger due to the addition of the
capacitance of the human body to the above listed
capacitances, and a smaller voltage will be measured
by the A/D Converter.
There are two separate methods of measuring
capacitance with the CTMU. The first is the absolute
method, in which the actual capacitance value is
desired. The second is the relative method, in which
the actual capacitance is not needed, rather an
indication of a change in capacitance is required.
19.4.1
ABSOLUTE CAPACITANCE
MEASUREMENT
For absolute capacitance measurements, both the
current and capacitance calibration steps found in
Section 19.3 “Calibrating the CTMU Module”
should be followed. Capacitance measurements are
then performed using the following steps:
Detecting capacitance changes is easily accomplished
with the CTMU using these steps:
1. Initialize the A/D Converter.
2. Initialize the CTMU.
3. Set EDG1STAT.
1. Initialize the A/D Converter and the CTMU.
2. Set EDG1STAT.
3. Wait for a fixed delay.
4. Wait for a fixed delay, T.
5. Clear EDG1STAT.
4. Clear EDG1STAT.
5. Perform an A/D conversion.
6. Perform an A/D conversion.
The voltage measured by performing the A/D
conversion is an indication of the relative capacitance.
Note that in this case, no calibration of the current
source or circuit capacitance measurement is needed.
See Example 19-4 for a sample software routine for a
capacitive touch switch.
7. Calculate the total capacitance, CTOTAL = (I * T)/V,
where I is known from the current source
measurement step (see Section 19.3.1 “Current
Source Calibration”), T is a fixed delay and V is
measured by performing an A/D conversion.
8. Subtract the stray and A/D capacitance
(COFFSET from Section 19.3.2 “Capacitance
Calibration”) from CTOTAL to determine the
measured capacitance.
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 327
PIC18(L)F2X/4XK22
EXAMPLE 19-4:
ROUTINE FOR CAPACITIVE TOUCH SWITCH
#include "p18cxxx.h"
#define COUNT 500
//@ 8MHz = 125uS.
#define DELAY for(i=0;i<COUNT;i++)
#define OPENSW 1000
#define TRIP 300
//Un-pressed switch value
//Difference between pressed
//and un-pressed switch
//amount to change
#define HYST 65
//from pressed to un-pressed
#define PRESSED 1
#define UNPRESSED 0
int main(void)
{
unsigned int Vread;
unsigned int switchState;
int i;
//storage for reading
//assume CTMU and A/D have been setup correctly
//see Example 25-1 for CTMU & A/D setup
setup();
CTMUCONHbits.CTMUEN = 1;
CTMUCONLbits.EDG1STAT = 0;
CTMUCONLbits.EDG2STAT = 0;
CTMUCONHbits.IDISSEN = 1;
DELAY;
// Enable the CTMU
// Set Edge status bits to zero
//drain charge on the circuit
//wait 125us
CTMUCONHbits.IDISSEN = 0;
//end drain of circuit
CTMUCONLbits.EDG1STAT = 1;
//Begin charging the circuit
//using CTMU current source
//wait for 125us
DELAY;
CTMUCONLbits.EDG1STAT = 0;
//Stop charging circuit
PIR1bits.ADIF = 0;
ADCON0bits.GO=1;
//make sure A/D Int not set
//and begin A/D conv.
while(!PIR1bits.ADIF);
//Wait for A/D convert complete
Vread = ADRES;
//Get the value from the A/D
if(Vread < OPENSW - TRIP)
{
switchState = PRESSED;
}
else if(Vread > OPENSW - TRIP + HYST)
{
switchState = UNPRESSED;
}
}
DS41412A-page 328
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
It is assumed that the time measured is small enough
that the capacitance, COFFSET, provides a valid voltage
to the A/D Converter. For the smallest time measure-
ment, always set the A/D Channel Select register
(AD1CHS) to an unused A/D channel; the correspond-
ing pin for which is not connected to any circuit board
trace. This minimizes added stray capacitance, keep-
ing the total circuit capacitance close to that of the A/D
Converter itself (4-5 pF). To measure longer time
intervals, an external capacitor may be connected to an
A/D channel and this channel selected when making a
time measurement.
19.5 Measuring Time with the CTMU
Module
Time can be precisely measured after the ratio (C/I) is
measured from the current and capacitance calibration
step by following these steps:
1. Initialize the A/D Converter and the CTMU.
2. Set EDG1STAT.
3. Set EDG2STAT.
4. Perform an A/D conversion.
5. Calculate the time between edges as T = (C/I) * V,
where I is calculated in the current calibration step
(Section 19.3.1 “Current Source Calibration”),
C is calculated in the capacitance calibration step
(Section 19.3.2 “Capacitance Calibration”) and
V is measured by performing the A/D conversion.
FIGURE 19-3:
TYPICAL CONNECTIONS AND INTERNAL CONFIGURATION FOR TIME
MEASUREMENT
PIC18(L)FXXK22 Device
CTMU
CTED1
CTED2
EDG1
EDG2
Current Source
Output
Pulse
A/D Converter
ANX
RPR
CAD
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 329
PIC18(L)F2X/4XK22
An example use of this feature is for interfacing with
variable capacitive-based sensors, such as a humidity
sensor. As the humidity varies, the pulse width output
on CTPLS will vary. The CTPLS output pin can be con-
nected to an input capture pin and the varying pulse
width is measured to determine the humidity in the
application.
19.6 Creating a Delay with the CTMU
Module
A unique feature on board the CTMU module is its
ability to generate system clock independent output
pulses based on an external capacitor value. This is
accomplished using the internal comparator voltage
reference module, Comparator 2 input pin and an
external capacitor. The pulse is output onto the CTPLS
pin. To enable this mode, set the TGEN bit.
Follow these steps to use this feature:
1. Initialize Comparator 2.
2. Initialize the comparator voltage reference.
See Figure 19-4 for an example circuit. CPULSE is
chosen by the user to determine the output pulse width
on CTPLS. The pulse width is calculated by
T = (CPULSE/I)*V, where I is known from the current
source measurement step (Section 19.3.1 “Current
Source Calibration”) and V is the internal reference
voltage (CVREF).
3. Initialize the CTMU and enable time delay
generation by setting the TGEN bit.
4. Set EDG1STAT.
5. When CPULSE charges to the value of the voltage
reference trip point, an output pulse is generated
on CTPLS.
FIGURE 19-4:
TYPICAL CONNECTIONS AND INTERNAL CONFIGURATION FOR PULSE
DELAY GENERATION
PIC18(L)FXXK22 Device
CTMU
CTED1
EDG1
CTPLS
Current Source
Comparator
C2
C12IN1-
CPULSE
CVREF
module is performing an operation when Idle mode is
invoked, in this case, the results will be similar to those
with Sleep mode.
19.7 Operation During Sleep/Idle
Modes
19.7.1
SLEEP MODE AND DEEP SLEEP
MODES
19.8 CTMU Peripheral Module Disable
(PMD)
When the device enters any Sleep mode, the CTMU
module current source is always disabled. If the CTMU
is performing an operation that depends on the current
source when Sleep mode is invoked, the operation may
not terminate correctly. Capacitance and time
measurements may return erroneous values.
When this peripheral is not used, the Peripheral
Module Disable bit can be set to disconnect all clock
sources to the module, reducing power consumption to
an absolute minimum. See Section 3.6 “Selective
Peripheral Module Control”.
19.7.2
IDLE MODE
The behavior of the CTMU in Idle mode is determined
by the CTMUSIDL bit (CTMUCONH<5>). If CTMUSIDL
is cleared, the module will continue to operate in Idle
mode. If CTMUSIDL is set, the module’s current source
is disabled when the device enters Idle mode. If the
DS41412A-page 330
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
19.9 Effects of a Reset on CTMU
19.10 Registers
Upon Reset, all registers of the CTMU are cleared. This
leaves the CTMU module disabled, its current source is
turned off and all configuration options return to their
default settings. The module needs to be re-initialized
following any Reset.
There are three control registers for the CTMU:
• CTMUCONH
• CTMUCONL
• CTMUICON
The CTMUCONH and CTMUCONL registers
(Register 19-1 and Register 19-2) contain control bits
for configuring the CTMU module edge source selec-
tion, edge source polarity selection, edge sequencing,
A/D trigger, analog circuit capacitor discharge and
enables. The CTMUICON register (Register 19-3) has
bits for selecting the current source range and current
source trim.
If the CTMU is in the process of taking a measurement at
the time of Reset, the measurement will be lost. A partial
charge may exist on the circuit that was being measured,
and should be properly discharged before the CTMU
makes subsequent attempts to make a measurement.
The circuit is discharged by setting and then clearing the
IDISSEN bit (CTMUCONH<1>) while the A/D Converter
is connected to the appropriate channel.
REGISTER 19-1: CTMUCONH: CTMU CONTROL REGISTER 0
R/W-0
U-0
—
R/W-0
R/W-0
TGEN
R/W-0
R/W-0
R/W-0
U-0
CTMUEN
CTMUSIDL
EDGEN
EDGSEQEN
IDISSEN
CTTRIG
bit 7
bit 0
Legend:
R = Readable bit
-n = Value at POR
W = Writable bit
‘1’ = Bit is set
U = Unimplemented bit, read as ‘0’
‘0’ = Bit is cleared x = Bit is unknown
bit 7
CTMUEN: CTMU Enable bit
1= Module is enabled
0= Module is disabled
bit 6
bit 5
Unimplemented: Read as ‘0’
CTMUSIDL: Stop in Idle Mode bit
1= Discontinue module operation when device enters Idle mode
0= Continue module operation in Idle mode
bit 4
bit 3
bit 2
bit 1
bit 0
TGEN: Time Generation Enable bit
1= Enables edge delay generation
0= Disables edge delay generation
EDGEN: Edge Enable bit
1= Edges are not blocked
0= Edges are blocked
EDGSEQEN: Edge Sequence Enable bit
1= Edge 1 event must occur before Edge 2 event can occur
0= No edge sequence is needed
IDISSEN: Analog Current Source Control bit
1= Analog current source output is grounded
0= Analog current source output is not grounded
CTTRIG: CTMU Special Event Trigger Control Bit
1= CTMU Special Event Trigger is enabled
0= CTMU Special Event Trigger is disabled
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 331
PIC18(L)F2X/4XK22
REGISTER 19-2: CTMUCONL: CTMU CONTROL REGISTER 1
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
EDG2POL
EDG2SEL<1:0>
EDG1POL
EDG1SEL1 EDG1SEL0 EDG2STAT EDG1STAT
bit 0
bit 7
Legend:
R = Readable bit
-n = Value at POR
W = Writable bit
‘1’ = Bit is set
U = Unimplemented bit, read as ‘0’
‘0’ = Bit is cleared
x = Bit is unknown
bit 7
EDG2POL: Edge 2 Polarity Select bit
1= Edge 2 programmed for a positive edge response
0= Edge 2 programmed for a negative edge response
bit 6-5
EDG2SEL<1:0>: Edge 2 Source Select bits
11= CTED1 pin
10= CTED2 pin
01= ECCP1 Special Event Trigger
00= ECCP2 Special Event Trigger
bit 4
EDG1POL: Edge 1 Polarity Select bit
1= Edge 1 programmed for a positive edge response
0= Edge 1 programmed for a negative edge response
bit 3-2
EDG1SEL<1:0>: Edge 1 Source Select bits
11= CTED1 pin
10= CTED2 pin
01= ECCP1 Special Event Trigger
00= ECCP2 Special Event Trigger
bit 1
bit 0
EDG2STAT: Edge 2 Status bit
1= Edge 2 event has occurred
0= Edge 2 event has not occurred
EDG1STAT: Edge 1 Status bit
1= Edge 1 event has occurred
0= Edge 1 event has not occurred
DS41412A-page 332
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
REGISTER 19-3: CTMUICON: CTMU CURRENT CONTROL REGISTER
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
ITRIM<5:0>
R/W-0
R/W-0
IRNG<1:0>
bit 7
bit 0
Legend:
R = Readable bit
-n = Value at POR
W = Writable bit
‘1’ = Bit is set
U = Unimplemented bit, read as ‘0’
‘0’ = Bit is cleared x = Bit is unknown
bit 7-2
ITRIM<5:0>: Current Source Trim bits
011111= Maximum positive change from nominal current
011110
.
.
.
000001= Minimum positive change from nominal current
000000= Nominal current output specified by IRNG<1:0>
111111= Minimum negative change from nominal current
.
.
.
100010
100001= Maximum negative change from nominal current
bit 1-0
IRNG<1:0>: Current Source Range Select bits
11= 100 Base current
10= 10 Base current
01= Base current level (0.55 A nominal)
00= Current source disabled
TABLE 19-1: REGISTERS ASSOCIATED WITH CTMU MODULE
Reset
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Values
on Page
CTMUCONH CTMUEN
CTMUCONL EDG2POL
CTMUICON
—
CTMUSIDL
TGEN
EDGEN
EDGSEQEN
IDISSEN
CTTRIG
331
332
333
129
125
120
58
EDG2SEL<1:0>
EDG1POL
EDG1SEL<1:0>
EDG2STAT EDG1STAT
IRNG<1:0>
ITRIM<5:0>
IPR3
SSP2IP
SSP2IE
SSP2IF
—
BCL2IP
RC2IP
RC2IE
RC2IF
—
TX2IP
TX2IE
TX2IF
—
CTMUIP
CTMUIE
CTMUIF
CTMUMD
TMR5GIP
TMR5GIE
TMR5GIF
CMP2MD
TMR3GIP
TMR3GIE
TMR3GIF
CMP1MD
TMR1GIP
TMR1GIE
TMR1GIF
ADCMD
PIE3
BCL2IE
BCL2IF
—
PIR3
PMD2
Legend:
— = unimplemented, read as ‘0’. Shaded bits are not used during CTMU operation.
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 333
PIC18(L)F2X/4XK22
NOTES:
DS41412A-page 334
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
20.2 Latch Output
20.0 SR LATCH
The SRQEN and SRNQEN bits of the SRCON0 register
control the Q and Q latch outputs. Both of the SR Latch
outputs may be directly output to I/O pins at the same
time. Control is determined by the state of bits SRQEN
and SRNQEN in the SRCON0 register.
The module consists of a single SR Latch with multiple
Set and Reset inputs as well as separate latch outputs.
The SR Latch module includes the following features:
• Programmable input selection
• SR Latch output is available internally/externally
• Selectable Q and Q output
The applicable TRIS bit of the corresponding port must
be cleared to enable the port pin output driver.
• Firmware Set and Reset
The SR Latch can be used in a variety of analog
applications, including oscillator circuits, one-shot
circuit, hysteretic controllers, and analog timing
applications.
20.3 DIVSRCLK Clock Generation
The DIVSRCLK clock signal is generated from the
peripheral clock which is pre-scaled by a value
determined by the SRCLK<2:0> bits. See Figure 20-2
and Table for additional detail.
20.1 Latch Operation
The latch is a Set-Reset Latch that does not depend on
a clock source. Each of the Set and Reset inputs are
active-high. The latch can be set or reset by:
20.4 Effects of a Reset
Upon any device Reset, the SR Latch is not initialized,
and the SRQ and SRNQ outputs are unknown. The
user’s firmware is responsible to initialize the latch
output before enabling it to the output pins.
• Software control (SRPS and SRPR bits)
• Comparator C1 output (SYNCC1OUT)
• Comparator C2 output (SYNCC2OUT)
• SRI Pin
• Programmable clock (DIVSRCLK)
The SRPS and the SRPR bits of the SRCON0 register
may be used to set or reset the SR Latch, respectively.
The latch is Reset-dominant. Therefore, if both Set and
Reset inputs are high, the latch will go to the Reset
state. Both the SRPS and SRPR bits are self resetting
which means that a single write to either of the bits is all
that is necessary to complete a latch Set or Reset
operation.
The output from Comparator C1 or C2 can be used as
the Set or Reset inputs of the SR Latch. The output of
either Comparator can be synchronized to the Timer1
clock source. See Section 18.0 “Comparator
Module” and Section 12.0 “Timer1/3/5 Module with
Gate Control” for more information.
An external source on the SRI pin can be used as the
Set or Reset inputs of the SR Latch.
An internal clock source, DIVSRCLK, is available and it
can periodically set or reset the SR Latch. The
SRCLK<2:0> bits in the SRCON0 register are used to
select the clock source period. The SRSCKE and
SRRCKE bits of the SRCON1 register enable the clock
source to set or reset the SR Latch, respectively.
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 335
PIC18(L)F2X/4XK22
FIGURE 20-1:
DIVSRCLK BLOCK DIAGRAM
3
SRCLK<2:0>
Programmable
SRCLK divider
1:4 to 1:512
Peripheral
Clock
DIVSRCLK
4-512
cycl
es
...
t0
t0+4
t0+8
t0+12
Tosc
SRCLK<2:0> = "001"
1:8
FIGURE 20-2:
SR LATCH SIMPLIFIED BLOCK DIAGRAM
SRLEN
SRQEN
SRPS
Pulse
(2)
Gen
SRI
S
Q
SRSPE
DIVSRCLK
SRQ
SRSCKE
(3)
SYNCC2OUT
SRSC2E
(3)
SYNCC1OUT
SRSC1E
SR
(1)
Latch
SRPR
Pulse
(2)
Gen
SRI
SRRPE
R
Q
DIVSRCLK
SRNQ
SRRCKE
SRLEN
SRNQEN
(3)
SYNCC2OUT
SRRC2E
(3)
SYNCC1OUT
SRRC1E
Note 1: If R = 1and S = 1simultaneously, Q = 0, Q = 1
2: Pulse generator causes a pulse width of 2 TOSC clock cycles.
3: Name denotes the connection point at the comparator output.
DS41412A-page 336
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
TABLE 20-1: DIVSRCLK FREQUENCY TABLE
SRCLK<2:0>
Divider
FOSC = 20 MHz
FOSC = 16 MHz FOSC = 8 MHz FOSC = 4 MHz FOSC = 1 MHz
111
110
101
100
011
010
001
000
512
256
128
64
32
16
8
25.6 s
12.8 s
6.4 s
3.2 s
1.6 s
0.8 s
0.4 s
0.2 s
32 s
16 s
8 s
64 s
32 s
16 s
8 s
128 s
64 s
32 s
16 s
8 s
512 s
256 s
128 s
64 s
32 s
16 s
8 s
4 s
2 s
4 s
1 s
2 s
4 s
0.5 s
0.25 s
1 s
2 s
4
0.5 s
1 s
4 s
REGISTER 20-1: SRCON0: SR LATCH CONTROL REGISTER
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
SRPS
R/W-0
SRPR
SRLEN
SRCLK<2:0>
SRQEN
SRNQEN
bit 7
bit 0
Legend:
R = Readable bit
-n = Value at POR
W = Writable bit
‘1’ = Bit is set
U = Unimplemented
‘0’ = Bit is cleared
C = Clearable only bit
x = Bit is unknown
bit 7
SRLEN: SR Latch Enable bit(1)
1= SR latch is enabled
0= SR latch is disabled
bit 6-4
SRCLK<2:0>: SR Latch Clock Divider Bits
000 = Generates a 2 TOSC wide pulse on DIVSRCLK every 4 peripheral clock cycles
001 = Generates a 2 TOSC wide pulse on DIVSRCLK every 8 peripheral clock cycles
010 = Generates a 2 TOSC wide pulse on DIVSRCLK every 16 peripheral clock cycles
011 = Generates a 2 TOSC wide pulse on DIVSRCLK every 32 peripheral clock cycles
100 = Generates a 2 TOSC wide pulse on DIVSRCLK every 64 peripheral clock cycles
101 = Generates a 2 TOSC wide pulse on DIVSRCLK every 128 peripheral clock cycles
110 = Generates a 2 TOSC wide pulse on DIVSRCLK every 256 peripheral clock cycles
111 = Generates a 2 TOSC wide pulse on DIVSRCLK every 512 peripheral clock cycles
bit 3
bit 2
bit 1
bit 0
SRQEN: SR Latch Q Output Enable bit
1= Q is present on the SRQ pin
0= Q is internal only
SRNQEN: SR Latch Q Output Enable bit
1= Q is present on the SRNQ pin
0= Q is internal only
SRPS: Pulse Set Input of the SR Latch bit(2)
1= Pulse set input for 2 TOSC clock cycles
0= No effect on set input
SRPR: Pulse Reset Input of the SR Latch bit(2)
1= Pulse reset input for 2 TOSC clock cycles
0= No effect on Reset input
Note 1: Changing the SRCLK bits while the SR latch is enabled may cause false triggers to the set and Reset
inputs of the latch.
2: Set only, always reads back ‘0’.
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 337
PIC18(L)F2X/4XK22
REGISTER 20-2: SRCON1: SR LATCH CONTROL REGISTER 1
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
SRSPE
SRSCKE
SRSC2E
SRSC1E
SRRPE
SRRCKE
SRRC2E
SRRC1E
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
‘1’ = Bit is set
U = Unimplemented
‘0’ = Bit is cleared
C = Clearable only bit
x = Bit is unknown
-n = Value at POR
bit 7
bit 6
bit 5
bit 4
bit 3
bit 2
bit 1
bit 0
SRSPE: SR Latch Peripheral Set Enable bit
1= SRI pin status sets SR Latch
0= SRI pin status has no effect on SR Latch
SRSCKE: SR Latch Set Clock Enable bit
1= Set input of SR latch is pulsed with DIVSRCLK
0= Set input of SR latch is not pulsed with DIVSRCLK
SRSC2E: SR Latch C2 Set Enable bit
1= C2 Comparator output sets SR Latch
0= C2 Comparator output has no effect on SR Latch
SRSC1E: SR Latch C1 Set Enable bit
1= C1 Comparator output sets SR Latch
0= C1 Comparator output has no effect on SR Latch
SRRPE: SR Latch Peripheral Reset Enable bit
1= SRI pin resets SR Latch
0= SRI pin has no effect on SR Latch
SRRCKE: SR Latch Reset Clock Enable bit
1= Reset input of SR latch is pulsed with DIVSRCLK
0= Reset input of SR latch is not pulsed with DIVSRCLK
SRRC2E: SR Latch C2 Reset Enable bit
1= C2 Comparator output resets SR Latch
0= C2 Comparator output has no effect on SR Latch
SRRC1E: SR Latch C1 Reset Enable bit
1= C1 Comparator output resets SR Latch
0= C1 Comparator output has no effect on SR Latch
TABLE 20-2: REGISTERS ASSOCIATED WITH THE SR LATCH
Reset
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Values
on page
SRCON0
SRCON1
TRISA
SRLEN
SRCLK<2:0>
SRQEN SRNQEN
SRPS
SRPR
337
338
155
SRSPE SRSCKE SRSC2E SRSC1E SRRPE SRRCKE SRRC2E SRRC1E
TRISA7
TRISB7
WPUB7
TRISA6
TRISB6
WPUB6
TRISA5 TRISA4 TRISA3
TRISB5 TRISB4 TRISB3
WPUB5 WPUB4 WPUB3
TRISA2
TRISB2
WPUB2
TRISA1
TRISB1
WPUB1
TRISA0
TRISB0
WPUB0
TRISB
WPUB
155
156
Legend: Shaded bits are not used with this module.
DS41412A-page 338
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
21.1 Independent Gain Amplifiers
21.0 FIXED VOLTAGE REFERENCE
(FVR)
The output of the FVR supplied to the ADC,
Comparators and DAC is routed through an
independent programmable gain amplifier. The
amplifier can be configured to amplify the 1.024V
reference voltage by 1x, 2x or 4x, to produce the three
possible voltage levels.
The Fixed Voltage Reference, or FVR, is a stable
voltage reference, independent of VDD, with 1.024V,
2.048V or 4.096V selectable output levels. The output
of the FVR can be configured to supply a reference
voltage to the following:
The FVRS<1:0> bits of the VREFCON0 register are
used to enable and configure the gain amplifier settings
for the reference supplied to the DAC and Comparator
modules. When the ADC module is configured to use
the FVR output, (FVR BUF2) the reference is buffered
through an additional unity gain amplifier. This buffer is
disabled if the ADC is not configured to use the FVR.
• ADC input channel
• ADC positive reference
• Comparator positive input
• Digital-to-Analog Converter (DAC)
The FVR can be enabled by setting the FVREN bit of
the VREFCON0 register.
For specific use of the FVR, refer to the specific module
sections: Section 17.0 “Analog-to-Digital Converter
(ADC) Module”, Section 22.0 “Digital-to-Analog
Converter (DAC) Module” and Section 18.0 “Com-
parator Module”.
21.2 FVR Stabilization Period
When the Fixed Voltage Reference module is enabled, it
requires time for the reference and amplifier circuits to
stabilize. Once the circuits stabilize and are ready for use,
the FVRST bit of the VREFCON0 register will be set. See
Section 27.0 “Electrical Characteristics” for the
minimum delay requirement.
FIGURE 21-1:
VOLTAGE REFERENCE BLOCK DIAGRAM
X1
FVR BUF2
(To ADC Module)
FVRS<1:0>
2
X1
X2
X4
FVR BUF1
(To Comparators, DAC)
+
_
FVREN
FVRST
1.024V Fixed
Reference
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 339
PIC18(L)F2X/4XK22
REGISTER 21-1: VREFCON0: FIXED VOLTAGE REFERENCE CONTROL REGISTER
R/W-0
R/W-0
R/W-0
R/W-1
U-0
U-0
U-0
U-0
FVREN
FVRST
FVRS<1:0>
—
—
—
—
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n/n = Value at POR and BOR/Value at all other Resets
u = Bit is unchanged
‘1’ = Bit is set
x = Bit is unknown
‘0’ = Bit is cleared
bit 7
FVREN: Fixed Voltage Reference Enable bit
0= Fixed Voltage Reference is disabled
1= Fixed Voltage Reference is enabled
bit 6
FVRST: Fixed Voltage Reference Ready Flag bit
0= Fixed Voltage Reference output is not ready or not enabled
1= Fixed Voltage Reference output is ready for use
bit 5-4
FVRS<1:0>: Fixed Voltage Reference Selection bits
00= Fixed Voltage Reference Peripheral output is off
01= Fixed Voltage Reference Peripheral output is 1x (1.024V)
10= Fixed Voltage Reference Peripheral output is 2x (2.048V)(1)
11= Fixed Voltage Reference Peripheral output is 4x (4.096V)(1)
bit 3-2
bit 1-0
Reserved: Read as ‘0’. Maintain these bits clear.
Unimplemented: Read as ‘0’.
Note 1: Fixed Voltage Reference output cannot exceed VDD.
TABLE 21-1: SUMMARY OF REGISTERS ASSOCIATED WITH FIXED VOLTAGE REFERENCE
Register
on Page
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
VREFCON0
FVREN
FVRST
FVRS<1:0>
—
—
—
—
340
Legend:
— = unimplemented locations, read as ‘0’. Shaded bits are not used by the FVR module.
DS41412A-page 340
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
The negative voltage source is disabled by setting the
DACLPS bit in the VREFCON1 register. Clearing the
DACLPS bit in the VREFCON1 register disables the
positive voltage source.
22.0 DIGITAL-TO-ANALOG
CONVERTER (DAC) MODULE
The Digital-to-Analog Converter supplies a variable
voltage reference, ratiometric with the input source,
with 32 selectable output levels.
22.4 Output Clamped to Positive
Voltage Source
The input of the DAC can be connected to:
• External VREF pins
The DAC output voltage can be set to VSRC+ with the
least amount of power consumption by performing the
following:
• VDD supply voltage
• FVR (Fixed Voltage Reference)
• Clearing the DACEN bit in the VREFCON1
register.
The output of the DAC can be configured to supply a
reference voltage to the following:
• Setting the DACLPS bit in the VREFCON1
register.
• Comparator positive input
• ADC input channel
• DACOUT pin
• Configuring the DACPSS bits to the proper
positive source.
The Digital-to-Analog Converter (DAC) can be enabled
by setting the DACEN bit of the VREFCON1 register.
• Configuring the DACRx bits to ‘11111’ in the
VREFCON2 register.
This is also the method used to output the voltage level
from the FVR to an output pin. See Section 22.6 “DAC
Voltage Reference Output” for more information.
22.1 Output Voltage Selection
The DAC has 32 voltage level ranges. The 32 levels
are set with the DACR<4:0> bits of the VREFCON2
register.
22.5 Output Clamped to Negative
Voltage Source
The DAC output voltage is determined by the following
equations:
The DAC output voltage can be set to VSRC- with the
least amount of power consumption by performing the
following:
EQUATION 22-1: DAC OUTPUT VOLTAGE
DACR<4:0>
• Clearing the DACEN bit in the VREFCON1
register.
+ VSRC-
VOUT = VSRC+ – VSRC- ------------------------------
5
2
• Clearing the DACLPS bit in the VREFCON1
register.
VSRC+ = VDD, VREF+ or FVR1
VSRC- = VSS or VREF-
• Configuring the DACPSS bits to the proper
negative source.
• Configuring the DACRx bits to ‘00000’ in the
VREFCON2 register.
This allows the comparator to detect a zero-crossing
while not consuming additional current through the DAC
module.
22.2 Ratiometric Output Level
The DAC output value is derived using a resistor ladder
with each end of the ladder tied to a positive and
negative voltage reference input source. If the voltage
of either input source fluctuates, a similar fluctuation will
result in the DAC output value.
22.6 DAC Voltage Reference Output
The DAC can be output to the DACOUT pin by setting
the DACOE bit of the VREFCON1 register to ‘1’.
Selecting the DAC reference voltage for output on the
DACOUT pin automatically overrides the digital output
buffer and digital input threshold detector functions of
that pin. Reading the DACOUT pin when it has been
configured for DAC reference voltage output will always
return a ‘0’.
The value of the individual resistors within the ladder
can be found in Section 27.0 “Electrical
Characteristics”.
22.3 Low-Power Voltage State
In order for the DAC module to consume the least
amount of power, one of the two voltage reference input
sources to the resistor ladder must be disconnected.
Either the positive voltage source, (VSRC+), or the
negative voltage source, (VSRC-) can be disabled.
Due to the limited current drive capability, a buffer must
be used on the DAC voltage reference output for
external connections to DACOUT. Figure 22-2 shows
an example buffering technique.
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 341
PIC18(L)F2X/4XK22
FIGURE 22-1:
DIGITAL-TO-ANALOG CONVERTER BLOCK DIAGRAM
Digital-to-Analog Converter (DAC)
Reserved
FVR BUF1
VREF+
11
10
VSRC+
DACR<4:0>
01
00
5
VDD
R
2
11111
R
DACPSS<1:0>
11110
R
DACEN
DACLPS
R
R
32
Steps
DAC
(To Comparator, CSM and
ADC Modules)
R
R
00001
DACOUT
DACOE
R
00000
DACNSS
1
VREF-
VSS
VSRC-
0
FIGURE 22-2:
VOLTAGE REFERENCE OUTPUT BUFFER EXAMPLE
PIC® MCU
DAC
Module
R
+
–
Buffered DAC Output
DACOUT
Voltage
Reference
Output
Impedance
DS41412A-page 342
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
22.7 Operation During Sleep
22.8 Effects of a Reset
When the device wakes up from Sleep through an
interrupt or a Watchdog Timer time-out, the contents of
the VREFCON1 register are not affected. To minimize
current consumption in Sleep mode, the voltage
reference should be disabled.
A device Reset affects the following:
• DAC is disabled
• DAC output voltage is removed from the
DACOUT pin
• The DAC1R<4:0> range select bits are cleared
REGISTER 22-1: VREFCON1: VOLTAGE REFERENCE CONTROL REGISTER 0
R/W-0
R/W-0
R/W-0
U-0
R/W-0
R/W-0
U-0
R/W-0
DACEN
DACLPS
DACOE
—
DACPSS<1:0>
—
DACNSS
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
x = Bit is unknown
‘0’ = Bit is cleared
U = Unimplemented bit, read as ‘0’
-n/n = Value at POR and BOR/Value at all other Resets
u = Bit is unchanged
‘1’ = Bit is set
bit 7
bit 6
DACEN: DAC Enable bit
1= DAC is enabled
0= DAC is disabled
DACLPS: DAC Low-Power Voltage Source Select bit
1= DAC Positive reference source selected
0= DAC Negative reference source selected
bit 5
DACOE: DAC Voltage Output Enable bit
1= DAC voltage level is also an output on the DACOUT pin
0= DAC voltage level is disconnected from the DACOUT pin
bit 4
Unimplemented: Read as ‘0’
bit 3-2
DACPSS<1:0>: DAC Positive Source Select bits
00= VDD
01= VREF+
10= FVR BUF1 output
11= Reserved, do not use
bit 1
bit 0
Unimplemented: Read as ‘0’
DACNSS: DAC Negative Source Select bits
1= VREF-
0= VSS
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 343
PIC18(L)F2X/4XK22
REGISTER 22-2: VREFCON2: VOLTAGE REFERENCE CONTROL REGISTER 1
U-0
U-0
U-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
bit 0
—
—
—
DACR<4:0>
bit 7
Legend:
R = Readable bit
u = Bit is unchanged
‘1’ = Bit is set
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n/n = Value at POR and BOR/Value at all other Resets
x = Bit is unknown
‘0’ = Bit is cleared
bit 7-5
bit 4-0
Unimplemented: Read as ‘0’
DACR<4:0>: DAC Voltage Output Select bits
VOUT = ((VSRC+) - (VSRC-))*(DACR<4:0>/(25)) + VSRC-
TABLE 22-1: REGISTERS ASSOCIATED WITH DAC MODULE
Register
on Page
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
VREFCON0
VREFCON1
VREFCON2
Legend:
FVREN
DACEN
—
FVRST
DACLPS
—
FVRS<1:0>
—
—
—
—
—
340
343
344
DACOE
—
—
DACPSS<1:0>
DACR<4:0>
DACNSS
— = Unimplemented locations, read as ‘0’. Shaded bits are not used by the DAC module.
DS41412A-page 344
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
The High/Low-Voltage Detect Control register
(Register 23-1) completely controls the operation of the
HLVD module. This allows the circuitry to be “turned
off” by the user under software control, which
minimizes the current consumption for the device.
23.0 HIGH/LOW-VOLTAGE DETECT
(HLVD)
The PIC18(L)F2X/4XK22 devices have a High/Low-Volt-
age Detect module (HLVD). This is a programmable cir-
cuit that sets both a device voltage trip point and the
direction of change from that point. If the device experi-
ences an excursion past the trip point in that direction, an
interrupt flag is set. If the interrupt is enabled, the pro-
gram execution branches to the interrupt vector address
and the software responds to the interrupt.
The module’s block diagram is shown in Figure 23-1.
REGISTER 23-1: HLVDCON: HIGH/LOW-VOLTAGE DETECT CONTROL REGISTER
R/W-0
R-0
R-0
R/W-0
R/W-0
R/W-1
R/W-0
R/W-1
bit 0
VDIRMAG
BGVST
IRVST
HLVDEN
HLVDL<3:0>
bit 7
Legend:
R = Readable bit
-n = Value at POR
W = Writable bit
‘1’ = Bit is set
U = Unimplemented bit, read as ‘0’
‘0’ = Bit is cleared x = Bit is unknown
bit 7
bit 6
bit 5
VDIRMAG: Voltage Direction Magnitude Select bit
1= Event occurs when voltage equals or exceeds trip point (HLVDL<3:0>)
0= Event occurs when voltage equals or falls below trip point (HLVDL<3:0>)
BGVST: Band Gap Reference Voltages Stable Status Flag bit
1= Internal band gap voltage references are stable
0= Internal band gap voltage reference is not stable
IRVST: Internal Reference Voltage Stable Flag bit
1= Indicates that the voltage detect logic will generate the interrupt flag at the specified voltage range
0= Indicates that the voltage detect logic will not generate the interrupt flag at the specified voltage
range and the HLVD interrupt should not be enabled
bit 4
HLVDEN: High/Low-Voltage Detect Power Enable bit
1= HLVD enabled
0= HLVD disabled
bit 3-0
HLVDL<3:0>: Voltage Detection Level bits(1)
1111= External analog input is used (input comes from the HLVDIN pin)
1110= Maximum setting
.
.
.
0000= Minimum setting
Note 1: See Table 27-4 for specifications.
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 345
PIC18(L)F2X/4XK22
The module is enabled by setting the HLVDEN bit
(HLVDCON<4>). Each time the HLVD module is
enabled, the circuitry requires some time to stabilize.
The IRVST bit (HLVDCON<5>) is a read-only bit used
to indicate when the circuit is stable. The module can
only generate an interrupt after the circuit is stable and
IRVST is set.
trip point voltage. The “trip point” voltage is the voltage
level at which the device detects a high or low-voltage
event, depending on the configuration of the module.
When the supply voltage is equal to the trip point, the
voltage tapped off of the resistor array is equal to the
internal reference voltage generated by the voltage
reference module. The comparator then generates an
interrupt signal by setting the HLVDIF bit.
The VDIRMAG bit (HLVDCON<7>) determines the
overall operation of the module. When VDIRMAG is
cleared, the module monitors for drops in VDD below a
predetermined set point. When the bit is set, the
module monitors for rises in VDD above the set point.
The trip point voltage is software programmable to any of
16 values. The trip point is selected by programming the
HLVDL<3:0> bits (HLVDCON<3:0>).
The HLVD module has an additional feature that allows
the user to supply the trip voltage to the module from an
external source. This mode is enabled when bits,
HLVDL<3:0>, are set to ‘1111’. In this state, the
comparator input is multiplexed from the external input
pin, HLVDIN. This gives users the flexibility of configur-
ing the High/Low-Voltage Detect interrupt to occur at
any voltage in the valid operating range.
23.1 Operation
When the HLVD module is enabled, a comparator uses
an internally generated reference voltage as the set
point. The set point is compared with the trip point,
where each node in the resistor divider represents a
FIGURE 23-1:
HLVD MODULE BLOCK DIAGRAM (WITH EXTERNAL INPUT)
Externally Generated
Trip Point
VDD
VDD
HLVDL<3:0>
HLVDCON
Register
VDIRMAG
HLVDEN
HLVDIN
Set
HLVDIF
HLVDEN
BOREN
Internal Voltage
Reference
1.024V Typical
DS41412A-page 346
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
23.2 HLVD Setup
23.3 Current Consumption
To set up the HLVD module:
When the module is enabled, the HLVD comparator
and voltage divider are enabled and consume static
current. The total current consumption, when enabled,
is specified in Section 27.0 “Electrical Characteris-
tics”. Depending on the application, the HLVD module
does not need to operate constantly. To reduce current
requirements, the HLVD circuitry may only need to be
enabled for short periods where the voltage is checked.
After such a check, the module could be disabled.
1. Select the desired HLVD trip point by writing the
value to the HLVDL<3:0> bits.
2. Set the VDIRMAG bit to detect high voltage
(VDIRMAG = 1) or low voltage (VDIRMAG = 0).
3. Enable the HLVD module by setting the
HLVDEN bit.
4. Clear the HLVD interrupt flag (PIR2<2>), which
may have been set from a previous interrupt.
5. If interrupts are desired, enable the HLVD
interrupt by setting the HLVDIE and GIE/GIEH
bits (PIE2<2> and INTCON<7>, respectively).
23.4 HLVD Start-up Time
The internal reference voltage of the HLVD module,
specified
in
Section 27.0
“Electrical
An interrupt will not be generated until the
IRVST bit is set.
Characteristics”, may be used by other internal
circuitry, such as the programmable Brown-out Reset.
If the HLVD or other circuits using the voltage reference
are disabled to lower the device’s current consumption,
the reference voltage circuit will require time to become
stable before a low or high-voltage condition can be
reliably detected. This start-up time, TIRVST, is an
interval that is independent of device clock speed.
Note:
Before changing any module settings
(VDIRMAG, HLVDL<3:0>), first disable the
module (HLVDEN = 0), make the changes
and re-enable the module. This prevents
the generation of false HLVD events.
The HLVD interrupt flag is not enabled until TIRVST has
expired and a stable reference voltage is reached. For
this reason, brief excursions beyond the set point may
not be detected during this interval (see Figure 23-2 or
Figure 23-3).
FIGURE 23-2:
LOW-VOLTAGE DETECT OPERATION (VDIRMAG = 0)
CASE 1:
HLVDIF may not be set
VDD
VHLVD
HLVDIF
Enable HLVD
IRVST
TIRVST
HLVDIF cleared in software
Internal Reference is stable
CASE 2:
VDD
VHLVD
HLVDIF
Enable HLVD
TIRVST
IRVST
HLVDIF cleared in software
HLVDIF cleared in software,
Internal Reference is stable
HLVDIF remains set since HLVD condition still exists
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 347
PIC18(L)F2X/4XK22
FIGURE 23-3:
HIGH-VOLTAGE DETECT OPERATION (VDIRMAG = 1)
CASE 1:
HLVDIF may not be set
VHLVD
VDD
HLVDIF
Enable HLVD
IRVST
TIRVST
HLVDIF cleared in software
Internal Reference is stable
CASE 2:
VHLVD
VDD
HLVDIF
Enable HLVD
TIRVST
IRVST
Internal Reference is stable
HLVDIF cleared in software
HLVDIF cleared in software,
HLVDIF remains set since HLVD condition still exists
FIGURE 23-4:
TYPICAL LOW-VOLTAGE
DETECT APPLICATION
23.5 Applications
In many applications, it is desirable to detect a drop
below, or rise above, a particular voltage threshold. For
example, the HLVD module could be periodically
enabled to detect Universal Serial Bus (USB) attach or
detach. This assumes the device is powered by a lower
voltage source than the USB when detached. An attach
would indicate a high-voltage detect from, for example,
3.3V to 5V (the voltage on USB) and vice versa for a
detach. This feature could save a design a few extra
components and an attach signal (input pin).
VA
VB
For general battery applications, Figure 23-4 shows a
possible voltage curve. Over time, the device voltage
decreases. When the device voltage reaches voltage
VA, the HLVD logic generates an interrupt at time, TA.
The interrupt could cause the execution of an ISR,
which would allow the application to perform “house-
keeping tasks” and a controlled shutdown before the
device voltage exits the valid operating range at TB.
This would give the application a time window,
represented by the difference between TA and TB, to
safely exit.
TB
VA = HLVD trip point
TA
Time
Legend:
VB = Minimum valid device
operating voltage
DS41412A-page 348
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
23.6 Operation During Sleep
23.7 Effects of a Reset
When enabled, the HLVD circuitry continues to operate
during Sleep. If the device voltage crosses the trip
point, the HLVDIF bit will be set and the device will
wake-up from Sleep. Device execution will continue
from the interrupt vector address if interrupts have
been globally enabled.
A device Reset forces all registers to their Reset state.
This forces the HLVD module to be turned off.
TABLE 23-1: REGISTERS ASSOCIATED WITH HIGH/LOW-VOLTAGE DETECT MODULE
Reset
Values
on page
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
HLVDCON VDIRMAG BGVST
IRVST
HLVDEN
INT0IE
EEIP
HLVDL<3:0>
345
115
128
124
119
155
INTCON
IPR2
GIE/GIEH PEIE/GIEL TMR0IE
RBIE
TMR0IF
INT0IF
RBIF
OSCFIP
OSCFIE
OSCFIF
TRISA7
C1IP
C1IE
C2IP
C2IE
BCL1IP
BCL1IE
BCL1IF
TRISA3
HLVDIP TMR3IP CCP2IP
HLVDIE TMR3IE CCP2IE
PIE2
EEIE
PIR2
C1IF
C2IF
EEIF
HLVDIF
TRISA2
TMR3IF CCP2IF
TRISA1 TRISA0
TRISA
TRISA6
TRISA5
TRISA4
Legend: — = unimplemented locations, read as ‘0’. Shaded bits are unused by the HLVD module.
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 349
PIC18(L)F2X/4XK22
NOTES:
DS41412A-page 350
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
24.1 Configuration Bits
24.0 SPECIAL FEATURES OF
THE CPU
The Configuration bits can be programmed (read as
‘0’) or left unprogrammed (read as ‘1’) to select various
device configurations. These bits are mapped starting
at program memory location 300000h.
PIC18(L)F2X/4XK22 devices include several features
intended to maximize reliability and minimize cost through
elimination of external components. These are:
The user will note that address 300000h is beyond the
user program memory space. In fact, it belongs to the
configuration memory space (300000h-3FFFFFh), which
can only be accessed using table reads and table writes.
• Oscillator Selection
• Resets:
- Power-on Reset (POR)
- Power-up Timer (PWRT)
- Oscillator Start-up Timer (OST)
- Brown-out Reset (BOR)
• Interrupts
Programming the Configuration registers is done in a
manner similar to programming the Flash memory. The
WR bit in the EECON1 register starts a self-timed write
to the Configuration register. In normal operation mode,
a TBLWT instruction with the TBLPTR pointing to the
Configuration register sets up the address and the data
for the Configuration register write. Setting the WR bit
starts a long write to the Configuration register. The
Configuration registers are written a byte at a time. To
write or erase a configuration cell, a TBLWTinstruction
can write a ‘1’ or a ‘0’ into the cell. For additional details
on Flash programming, refer to Section 6.5 “Writing
to Flash Program Memory”.
• Watchdog Timer (WDT)
• Code Protection
• ID Locations
• In-Circuit Serial Programming™
The oscillator can be configured for the application
depending on frequency, power, accuracy and cost. All
of the options are discussed in detail in Section 2.0
“Oscillator Module (With Fail-Safe Clock Monitor)”.
A complete discussion of device Resets and interrupts
is available in previous sections of this data sheet.
In addition to their Power-up and Oscillator Start-up
Timers provided for Resets, PIC18(L)F2X/4XK22
devices have a Watchdog Timer, which is either
permanently enabled via the Configuration bits or
software controlled (if configured as disabled).
The inclusion of an internal RC oscillator also provides
the additional benefits of a Fail-Safe Clock Monitor
(FSCM) and Two-Speed Start-up. FSCM provides for
background monitoring of the peripheral clock and
automatic switchover in the event of its failure. Two-
Speed Start-up enables code to be executed almost
immediately on start-up, while the primary clock source
completes its start-up delays.
All of these features are enabled and configured by
setting the appropriate Configuration register bits.
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 351
PIC18(L)F2X/4XK22
TABLE 24-1: CONFIGURATION BITS AND DEVICE IDs
Default/
Unprogrammed
Value
Address
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
300000h CONFIG1L
300001h CONFIG1H
300002h CONFIG2L
300003h CONFIG2H
300004h CONFIG3L
—
IESO
—
—
FCMEN
—
—
—
—
—
—
—
0000 0000
0010 0101
0001 1111
0011 1111
0000 0000
1011 1111
1000 0101
1111 1111
0000 1111
1100 0000
0000 1111
1110 0000
0000 1111
0100 0000
qqqq qqqq
0101 qqqq
PRICLKEN PLLCFG
FOSC<3:0>
BOREN<1:0>
—
BORV<1:0>
WDPS<3:0>
PWRTEN
—
—
WDTEN<1:0>
—
—
—
P2BMX
—
—
T3CMX
—
—
—
—
—
300005h CONFIG3H MCLRE
300006h CONFIG4L DEBUG
—
HFOFST CCP3MX PBADEN CCP2MX
(1)
XINST
—
—
—
LVP
—
—
—
STRVEN
—
300007h CONFIG4H
300008h CONFIG5L
300009h CONFIG5H
30000Ah CONFIG6L
30000Bh CONFIG6H
30000Ch CONFIG7L
—
—
—
—
(2)
(2)
—
—
—
CP3
—
CP2
—
CP1
—
CP0
—
CPD
—
CPB
—
—
—
(2)
(2)
(2)
(2)
—
—
WRT3
—
WRT2
—
WRT1
—
WRT0
—
(3)
WRTD
—
WRTB
—
WRTC
—
—
—
EBTR3
—
EBTR2
—
EBTR1
—
EBTR0
—
30000Dh CONFIG7H
—
EBTRB
DEV<2:0>
—
—
(4)
3FFFFEh
3FFFFFh
Legend:
DEVID1
DEVID2
REV<4:0>
(4)
DEV<10:3>
– = unimplemented, q = value depends on condition. Shaded bits are unimplemented, read as '0'.
Note 1: Can only be changed when in high voltage programming mode.
2: Available on PIC18(L)FX5K22 and PIC18(L)FX6K22 devices only.
3: In user mode, this bit is read-only and cannot be self-programmed.
4: See Register 24-12 and Register 24-13 for DEVID values. DEVID registers are read-only and cannot be programmed by the
user.
DS41412A-page 352
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
REGISTER 24-1: CONFIG1H: CONFIGURATION REGISTER 1 HIGH
R/P-0
IESO
R/P-0
R/P-1
R/P-0
R/P-0
R/P-1
R/P-0
R/P-1
bit 0
FCMEN
PRICLKEN
PLLCFG
FOSC<3:0>
bit 7
Legend:
R = Readable bit
P = Programmable bit
U = Unimplemented bit, read as ‘0’
x = Bit is unknown
-n = Value when device is unprogrammed
bit 7
bit 6
bit 5
bit 4
bit 3-0
IESO(1): Internal/External Oscillator Switchover bit
1= Oscillator Switchover mode enabled
0= Oscillator Switchover mode disabled
FCMEN(1): Fail-Safe Clock Monitor Enable bit
1= Fail-Safe Clock Monitor enabled
0= Fail-Safe Clock Monitor disabled
PRICLKEN: Primary Clock Enable bit
1= Primary Clock is always enabled
0= Primary Clock can be disabled by software
PLLCFG: 4 x PLL Enable bit
1= 4 x PLL always enabled, Oscillator multiplied by 4
0= 4 x PLL is under software control, PLLEN (OSCTUNE<6>)
FOSC<3:0>: Oscillator Selection bits
1111= External RC oscillator, CLKOUT function on RA6
1110= External RC oscillator, CLKOUT function on RA6
1101= EC oscillator (low power)
1100= EC oscillator, CLKOUT function on OSC2 (low power)
1011= EC oscillator (medium power, 4 MHz-16 MHz)
1010= EC oscillator, CLKOUT function on OSC2 (medium power, 4 MHz-16 MHz)
1001= Internal oscillator block, CLKOUT function on OSC2
1000= Internal oscillator block
0111= External RC oscillator
0110= External RC oscillator, CLKOUT function on OSC2
0101= EC oscillator (high power, >16 MHz)
0100= EC oscillator, CLKOUT function on OSC2 (high power, >16 MHz)
0011= HS oscillator (medium power, 4 MHz - 16 MHz)
0010= HS oscillator (high power, >16 MHz)
0001= XT oscillator
0000= LP oscillator
Note 1: When FOSC<3:0> is configured for HS, XT, or LS oscillator and FCMEN bit is set, then the IESO bit
should also be set to prevent a false failed clock indication and to enable automatic clock switch over from
the internal oscillator block to the external oscillator when the OST times out.
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 353
PIC18(L)F2X/4XK22
REGISTER 24-2: CONFIG2L: CONFIGURATION REGISTER 2 LOW
U-0
—
U-0
—
U-0
—
R/P-1
R/P-1
R/P-1
R/P-1
R/P-1
BORV<1:0>(1)
BOREN<1:0>(2)
PWRTEN(2)
bit 7
bit 0
Legend:
R = Readable bit
P = Programmable bit
U = Unimplemented bit, read as ‘0’
x = Bit is unknown
-n = Value when device is unprogrammed
bit 7-5
bit 4-3
Unimplemented: Read as ‘0’
BORV<1:0>: Brown-out Reset Voltage bits(1)
11= VBOR set to 1.9V nominal
10= VBOR set to 2.2V nominal
01= VBOR set to 2.5V nominal
00= VBOR set to 2.85V nominal
bit 2-1
BOREN<1:0>: Brown-out Reset Enable bits(2)
11= Brown-out Reset enabled in hardware only (SBOREN is disabled)
10= Brown-out Reset enabled in hardware only and disabled in Sleep mode
(SBOREN is disabled)
01= Brown-out Reset enabled and controlled by software (SBOREN is enabled)
00= Brown-out Reset disabled in hardware and software
bit 0
PWRTEN: Power-up Timer Enable bit(2)
1= PWRT disabled
0= PWRT enabled
Note 1: See Section 27.1 “DC Characteristics: Supply Voltage, PIC18(L)F2X/4XK22” for specifications.
2: The Power-up Timer is decoupled from Brown-out Reset, allowing these features to be independently controlled.
DS41412A-page 354
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
REGISTER 24-3: CONFIG2H: CONFIGURATION REGISTER 2 HIGH
U-0
—
U-0
—
R/P-1
R/P-1
R/P-1
R/P-1
R/P-1
R/P-1
WDTPS<3:0>
WDTEN<1:0>
bit 7
bit 0
Legend:
R = Readable bit
P = Programmable bit
U = Unimplemented bit, read as ‘0’
x = Bit is unknown
-n = Value when device is unprogrammed
bit 7-6
bit 5-2
Unimplemented: Read as ‘0’
WDTPS<3:0>: Watchdog Timer Postscale Select bits
1111= 1:32,768
1110= 1:16,384
1101= 1:8,192
1100= 1:4,096
1011= 1:2,048
1010= 1:1,024
1001= 1:512
1000= 1:256
0111= 1:128
0110= 1:64
0101= 1:32
0100= 1:16
0011= 1:8
0010= 1:4
0001= 1:2
0000= 1:1
bit 1-0
WDTEN<1:0>: Watchdog Timer Enable bits
11= WDT enabled in hardware; SWDTEN bit disabled
10= WDT controlled by the SWDTEN bit
01= WDT enabled when device is active, disabled when device is in Sleep; SWDTEN bit disabled
00= WDT disabled in hardware; SWDTEN bit disabled
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 355
PIC18(L)F2X/4XK22
REGISTER 24-4: CONFIG3H: CONFIGURATION REGISTER 3 HIGH
R/P-1
U-0
—
R/P-1
R/P-1
R/P-1
R/P-1
R/P-1
R/P-1
MCLRE
P2BMX
T3CMX
HFOFST
CCP3MX
PBADEN
CCP2MX
bit 7
bit 0
Legend:
R = Readable bit
P = Programmable bit
U = Unimplemented bit, read as ‘0’
x = Bit is unknown
-n = Value when device is unprogrammed
bit 7
MCLRE: MCLR Pin Enable bit
1= MCLR pin enabled; RE3 input pin disabled
0= RE3 input pin enabled; MCLR disabled
bit 6
bit 5
Unimplemented: Read as ‘0’
P2BMX: P2B Input MUX bit
1= P2B is on RB5(1)
P2B is on RD2(2)
0= P2B is on RC0
bit 4
bit 3
bit 2
T3CMX: Timer3 Clock Input MUX bit
1= T3CKI is on RC0
0= T3CKI is on RB5
HFOFST: HFINTOSC Fast Start-up bit
1= HFINTOSC starts clocking the CPU without waiting for the oscillator to stabilize
0= The system clock is held off until the HFINTOSC is stable
CCP3MX: CCP3 MUX bit
1= CCP3 input/output is multiplexed with RB5
0= CCP3 input/output is multiplexed with RC6(1)
CCP3 input/output is multiplexed with RE0(2)
bit 1
bit 0
PBADEN: PORTB A/D Enable bit
1= ANSELB<5:0> resets to 1, PORTB<5:0> pins are configured as analog inputs on Reset
0= ANSELB<5:0> resets to 0, PORTB<4:0> pins are configured as digital I/O on Reset
CCP2MX: CCP2 MUX bit
1= CCP2 input/output is multiplexed with RC1
0= CCP2 input/output is multiplexed with RB3
Note 1: PIC18(L)F2XK22 devices only.
2: PIC18(L)F4XK22 devices only.
DS41412A-page 356
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
REGISTER 24-5: CONFIG4L: CONFIGURATION REGISTER 4 LOW
R/P-1
R/P-0
U-0
—
U-0
—
U-0
—
R/P-1
U-0
—
R/P-1
(1)
DEBUG
XINST
LVP
STVREN
bit 7
bit 0
Legend:
R = Readable bit
P = Programmable bit
U = Unimplemented bit, read as ‘0’
x = Bit is unknown
-n = Value when device is unprogrammed
bit 7
bit 6
DEBUG: Background Debugger Enable bit
1= Background debugger disabled, RB6 and RB7 configured as general purpose I/O pins
0= Background debugger enabled, RB6 and RB7 are dedicated to In-Circuit Debug
XINST: Extended Instruction Set Enable bit
1= Instruction set extension and Indexed Addressing mode enabled
0= Instruction set extension and Indexed Addressing mode disabled (Legacy mode)
bit 5-3
bit 2
Unimplemented: Read as ‘0’
LVP: Single-Supply ICSP Enable bit
1= Single-Supply ICSP enabled
0= Single-Supply ICSP disabled
bit 1
bit 0
Unimplemented: Read as ‘0’
STVREN: Stack Full/Underflow Reset Enable bit
1= Stack full/underflow will cause Reset
0= Stack full/underflow will not cause Reset
Note 1: Can only be changed by a programmer in high-voltage programming mode.
REGISTER 24-6: CONFIG5L: CONFIGURATION REGISTER 5 LOW
R/C-1
CP0
U-0
—
U-0
—
U-0
—
U-0
—
R/C-1
CP3(1)
R/C-1
CP2(1)
R/C-1
CP1
bit 0
bit 7
Legend:
R = Readable bit
U = Unimplemented bit, read as ‘0’
C = Clearable only bit
-n = Value when device is unprogrammed
bit 7-4
bit 3
Unimplemented: Read as ‘0’
CP3: Code Protection bit(1)
1= Block 3 not code-protected
0= Block 3 code-protected
bit 2
bit 1
bit 0
CP2: Code Protection bit(1)
1= Block 2 not code-protected
0= Block 2 code-protected
CP1: Code Protection bit
1= Block 1 not code-protected
0= Block 1 code-protected
CP0: Code Protection bit
1= Block 0 not code-protected
0= Block 0 code-protected
Note 1: Available on PIC18(L)FX5K22 and PIC18(L)FX6K22 devices.
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 357
PIC18(L)F2X/4XK22
REGISTER 24-7: CONFIG5H: CONFIGURATION REGISTER 5 HIGH
U-0
—
R/C-1
CPD
R/C-1
CPB
U-0
—
U-0
—
U-0
—
U-0
—
U-0
—
bit 0
bit 7
Legend:
R = Readable bit
U = Unimplemented bit, read as ‘0’
C = Clearable only bit
-n = Value when device is unprogrammed
bit 7
CPD: Data EEPROM Code Protection bit
1= Data EEPROM not code-protected
0= Data EEPROM code-protected
bit 6
CPB: Boot Block Code Protection bit
1= Boot Block not code-protected
0= Boot Block code-protected
bit 5-0
Unimplemented: Read as ‘0’
REGISTER 24-8: CONFIG6L: CONFIGURATION REGISTER 6 LOW
R/C-1
WRT0
U-0
—
U-0
—
U-0
—
U-0
—
R/C-1
WRT3(1)
R/C-1
WRT2(1)
R/C-1
WRT1
bit 0
bit 7
Legend:
R = Readable bit
U = Unimplemented bit, read as ‘0’
C = Clearable only bit
-n = Value when device is unprogrammed
bit 7-4
bit 3
Unimplemented: Read as ‘0’
WRT3: Write Protection bit(1)
1= Block 3 not write-protected
0= Block 3 write-protected
bit 2
bit 1
bit 0
WRT2: Write Protection bit(1)
1= Block 2 not write-protected
0= Block 2 write-protected
WRT1: Write Protection bit
1= Block 1 not write-protected
0= Block 1 write-protected
WRT0: Write Protection bit
1= Block 0 not write-protected
0= Block 0 write-protected
Note 1: Available on PIC18(L)FX5K22 and PIC18(L)FX6K22 devices.
DS41412A-page 358
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
REGISTER 24-9: CONFIG6H: CONFIGURATION REGISTER 6 HIGH
R/C-1
R/C-1
R-1
WRTC(1)
U-0
—
U-0
—
U-0
—
U-0
—
U-0
—
WRTD
WRTB
bit 7
bit 0
Legend:
R = Readable bit
U = Unimplemented bit, read as ‘0’
C = Clearable only bit
-n = Value when device is unprogrammed
bit 7
bit 6
bit 5
WRTD: Data EEPROM Write Protection bit
1= Data EEPROM not write-protected
0= Data EEPROM write-protected
WRTB: Boot Block Write Protection bit
1= Boot Block not write-protected
0= Boot Block write-protected
WRTC: Configuration Register Write Protection bit(1)
1= Configuration registers not write-protected
0= Configuration registers write-protected
bit 4-0
Unimplemented: Read as ‘0’
Note 1: This bit is read-only in normal execution mode; it can be written only in Program mode.
REGISTER 24-10: CONFIG7L: CONFIGURATION REGISTER 7 LOW
U-0
—
U-0
—
U-0
—
U-0
—
R/C-1
EBTR3(1)
R/C-1
EBTR2(1)
R/C-1
R/C-1
EBTR1
EBTR0
bit 7
bit 0
Legend:
R = Readable bit
U = Unimplemented bit, read as ‘0’
C = Clearable only bit
-n = Value when device is unprogrammed
bit 7-4
bit 3
Unimplemented: Read as ‘0’
EBTR3: Table Read Protection bit(1)
1= Block 3 not protected from table reads executed in other blocks
0= Block 3 protected from table reads executed in other blocks
bit 2
bit 1
bit 0
EBTR2: Table Read Protection bit(1)
1= Block 2 not protected from table reads executed in other blocks
0= Block 2 protected from table reads executed in other blocks
EBTR1: Table Read Protection bit
1= Block 1 not protected from table reads executed in other blocks
0= Block 1 protected from table reads executed in other blocks
EBTR0: Table Read Protection bit
1= Block 0 not protected from table reads executed in other blocks
0= Block 0 protected from table reads executed in other blocks
Note 1: Available on PIC18(L)FX5K22 and PIC18(L)FX6K22 devices.
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 359
PIC18(L)F2X/4XK22
REGISTER 24-11: CONFIG7H: CONFIGURATION REGISTER 7 HIGH
U-0
—
R/C-1
U-0
—
U-0
—
U-0
—
U-0
—
U-0
—
U-0
—
EBTRB
bit 7
bit 0
Legend:
R = Readable bit
U = Unimplemented bit, read as ‘0’
C = Clearable only bit
-n = Value when device is unprogrammed
bit 7
bit 6
Unimplemented: Read as ‘0’
EBTRB: Boot Block Table Read Protection bit
1= Boot Block not protected from table reads executed in other blocks
0= Boot Block protected from table reads executed in other blocks
bit 5-0
Unimplemented: Read as ‘0’
REGISTER 24-12: DEVID1: DEVICE ID REGISTER 1
R
R
R
R
R
R
R
R
DEV2
DEV1
DEV0
REV4
REV3
REV2
REV1
REV0
bit 0
bit 7
Legend:
R = Readable bit
U = Unimplemented bit, read as ‘0’
C = Clearable only bit
-n = Value when device is unprogrammed
bit 7-5
bit 4-0
DEV<2:0>: Device ID bits
These bits, together with DEV<10:3> in DEVID2, determine the device ID.
See Table 24-2 for complete Device ID list.
REV<4:0>: Revision ID bits
These bits indicate the device revision.
REGISTER 24-13: DEVID2: DEVICE ID REGISTER 2
R
R
R
R
R
R
R
R
DEV10
DEV9
DEV8
DEV7
DEV6
DEV5
DEV4
DEV3
bit 7
bit 0
Legend:
R = Readable bit
U = Unimplemented bit, read as ‘0’
C = Clearable only bit
-n = Value when device is unprogrammed
bit 7-0
DEV<10:3>: Device ID bits
These bits, together with DEV<2:0> in DEVID1, determine the device ID.
See Table 24-2 for complete Device ID list.
DS41412A-page 360
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
TABLE 24-2: DEVICE ID TABLE FOR THE PIC18(L)F2X/4XK22 FAMILY
DEV<10:3>
DEV<2:0>
Part Number
000
001
010
011
000
001
010
011
000
001
010
011
000
001
010
011
PIC18F46K22
PIC18LF46K22
PIC18F26K22
PIC18LF26K22
PIC18F45K22
PIC18LF45K22
PIC18F25K22
PIC18LF25K22
PIC18F44K22
PIC18LF44K22
PIC18F24K22
PIC18LF24K22
PIC18F43K22
PIC18LF43K22
PIC18F23K22
PIC18LF23K22
0101 0100
0101 0101
0101 0110
0101 0111
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 361
PIC18(L)F2X/4XK22
24.2 Watchdog Timer (WDT)
For PIC18(L)F2X/4XK22 devices, the WDT is driven by
the LFINTOSC source. When the WDT is enabled, the
clock source is also enabled. The nominal WDT period
is 4 ms and has the same stability as the LFINTOSC
oscillator.
The 4 ms period of the WDT is multiplied by a 16-bit
postscaler. Any output of the WDT postscaler is
selected by a multiplexer, controlled by bits in Configu-
ration Register 2H. Available periods range from 4 ms
to 131.072 seconds (2.18 minutes). The WDT and
postscaler are cleared when any of the following events
occur: a SLEEPor CLRWDTinstruction is executed, the
IRCF bits of the OSCCON register are changed or a
clock failure has occurred.
Note 1: The CLRWDT and SLEEP instructions
clear the WDT and postscaler counts
when executed.
2: Changing the setting of the IRCF bits of
the OSCCON register clears the WDT
and postscaler counts.
3: When a CLRWDTinstruction is executed,
the postscaler count will be cleared.
FIGURE 24-1:
WDT BLOCK DIAGRAM
Enable WDT
SWDTEN
WDTEN
WDT Counter
Wake-up
from Power
Managed Modes
128
LFINTOSC Source
Change on IRCF bits
CLRWDT
WDT
Reset
Reset
Programmable Postscaler
1:1 to 1:32,768
All Device Resets
4
WDTPS<3:0>
Sleep
DS41412A-page 362
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
24.2.1
CONTROL REGISTER
Register 24-14 shows the WDTCON register. This is a
readable and writable register which contains a control
bit that allows software to override the WDT enable
Configuration bit, but only if the Configuration bit has
disabled the WDT.
REGISTER 24-14: WDTCON: WATCHDOG TIMER CONTROL REGISTER
U-0
—
U-0
—
U-0
—
U-0
—
U-0
—
U-0
—
U-0
—
R/W-0
SWDTEN(1)
bit 0
bit 7
Legend:
R = Readable bit
-n = Value at POR
W = Writable bit
‘1’ = Bit is set
U = Unimplemented bit, read as ‘0’
‘0’ = Bit is cleared x = Bit is unknown
bit 7-1
bit 0
Unimplemented: Read as ‘0’
SWDTEN: Software Enable or Disable the Watchdog Timer bit(1)
1= WDT is turned on
0= WDT is turned off (Reset value)
Note 1: This bit has no effect if the Configuration bit, WDTEN, is enabled.
TABLE 24-3: REGISTERS ASSOCIATED WITH WATCHDOG TIMER
Reset
Values
on Page
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
RCON
WDTCON
IPEN
—
SBOREN
—
—
—
RI
—
TO
—
PD
—
POR
—
BOR
60
SWDTEN
363
Legend: — = unimplemented, read as ‘0’. Shaded bits are not used by the Watchdog Timer.
TABLE 24-4: CONFIGURATION REGISTERS ASSOCIATED WITH WATCHDOG TIMER
Reset
Values
on Page
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
CONFIG2H
—
—
WDPS<3:0>
WDTEN<1:0>
355
Legend: — = unimplemented, read as ‘0’. Shaded bits are not used by the Watchdog Timer.
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 363
PIC18(L)F2X/4XK22
Each of the blocks has three code protection bits asso-
ciated with them. They are:
24.3 Program Verification and
Code Protection
• Code-Protect bit (CPn)
The overall structure of the code protection on the
PIC18 Flash devices differs significantly from other
PIC® microcontroller devices.
• Write-Protect bit (WRTn)
• External Block Table Read bit (EBTRn)
Figure 24-2 shows the program memory organization
for 8, 16 and 32-Kbyte devices and the specific code
protection bit associated with each block. The actual
locations of the bits are summarized in Table .
The user program memory is divided into three or five
blocks, depending on the device. One of these is a
Boot Block of 0.5K or 2K bytes, depending on the
device. The remainder of the memory is divided into
individual blocks on binary boundaries.
FIGURE 24-2:
CODE-PROTECTED PROGRAM MEMORY FOR PIC18(L)F2X/4XK22
MEMORY SIZE/DEVICE
Block Code Protection
8 Kbytes
16 Kbytes
32 Kbytes
64 Kbytes
Controlled By:
(PIC18(L)FX3K22) (PIC18(L)FX4K22) (PIC18(L)FX5K22) (PIC18(L)FX6K22)
Boot Block
(000h-1FFh)
Boot Block
(000h-7FFh)
Boot Block
(000h-7FFh)
Boot Block
(000h-7FFh)
CPB, WRTB, EBTRB
CP0, WRT0, EBTR0
CP1, WRT1, EBTR1
CP2, WRT2, EBTR2
CP3, WRT3, EBTR3
Block 0
(200h-FFFh)
Block 0
(800h-1FFFh)
Block 0
(800h-1FFFh)
Block 0
(800h-3FFFh)
Block 1
(1000h-1FFFh)
Block 1
(2000h-3FFFh)
Block 1
(2000h-3FFFh)
Block 1
(4000h-7FFFh)
Block 2
(4000h-5FFFh)
Block 2
(8000h-BFFFh)
Block 3
(6000h-7FFFh)
Block 3
(C000h-FFFFh)
Unimplemented
Unimplemented
Read ‘0’s
Read ‘0’s
(2000h-1FFFFFh) (4000h-1FFFFFh)
Unimplemented
Unimplemented
(Unimplemented
Memory Space)
Read ‘0’s
Read ‘0’s
(8000h-1FFFFFh) (10000h-1FFFFFh)
TABLE 24-5: CONFIGURATION REGISTERS ASSOCIATED WITH CODE PROTECTION
File Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
300008h CONFIG5L
300009h CONFIG5H
30000Ah CONFIG6L
—
CPD
—
—
CPB
—
—
—
—
—
—
—
—
—
CP3(1)
—
WRT3(1)
CP2(1)
—
WRT2(1)
CP1
—
CP0
—
—
WRTC(2)
WRT1
WRT0
—
30000Bh CONFIG6H WRTD
WRTB
—
—
—
—
30000Ch CONFIG7L
30000Dh CONFIG7H
—
—
—
EBTR3(1) EBTR2(1) EBTR1
EBTR0
—
EBTRB
—
—
—
—
Legend: Shaded bits are unimplemented.
Note 1: Available on PIC18(L)FX5K22 and PIC18(L)FX6K22 devices only.
2: In user mode, this bit is read-only and cannot be self-programmed.
DS41412A-page 364
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
instruction that executes from a location outside of that
block is not allowed to read and will result in reading ‘0’s.
Figures 24-3 through 24-5 illustrate table write and table
read protection.
24.3.1
PROGRAM MEMORY
CODE PROTECTION
The program memory may be read to or written from
any location using the table read and table write
instructions. The device ID may be read with table
reads. The Configuration registers may be read and
written with the table read and table write instructions.
Note:
Code protection bits may only be written to
a ‘0’ from a ‘1’ state. It is not possible to
write a ‘1’ to a bit in the ‘0’ state. Code pro-
tection bits are only set to ‘1’ by a full chip
erase or block erase function. The full chip
erase and block erase functions can only
be initiated via ICSP™ or an external
programmer.
In normal execution mode, the CPn bits have no direct
effect. CPn bits inhibit external reads and writes. A block
of user memory may be protected from table writes if the
WRTn Configuration bit is ‘0’. The EBTRn bits control
table reads. For a block of user memory with the EBTRn
bit cleared to ‘0’, a table READinstruction that executes
from within that block is allowed to read. A table read
FIGURE 24-3:
TABLE WRITE (WRTn) DISALLOWED
Register Values
Program Memory
Configuration Bit Settings
000000h
0007FFh
WRTB, EBTRB = 11
000800h
TBLPTR = 0008FFh
PC = 001FFEh
WRT0, EBTR0 = 01
TBLWT*
TBLWT*
001FFFh
002000h
WRT1, EBTR1 = 11
WRT2, EBTR2 = 11
WRT3, EBTR3 = 11
003FFFh
004000h
PC = 005FFEh
005FFFh
006000h
007FFFh
Results: All table writes disabled to Blockn whenever WRTn = 0.
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 365
PIC18(L)F2X/4XK22
FIGURE 24-4:
EXTERNAL BLOCK TABLE READ (EBTRn) DISALLOWED
Register Values
Program Memory
Configuration Bit Settings
000000h
WRTB, EBTRB = 11
0007FFh
000800h
TBLPTR = 0008FFh
PC = 003FFEh
WRT0, EBTR0 = 10
001FFFh
002000h
TBLRD*
WRT1, EBTR1 = 11
WRT2, EBTR2 = 11
003FFFh
004000h
005FFFh
006000h
WRT3, EBTR3 = 11
007FFFh
Results: All table reads from external blocks to Blockn are disabled whenever EBTRn = 0.
TABLAT register returns a value of ‘0’.
FIGURE 24-5:
EXTERNAL BLOCK TABLE READ (EBTRn) ALLOWED
Register Values
Program Memory
Configuration Bit Settings
000000h
WRTB, EBTRB = 11
WRT0, EBTR0 = 10
0007FFh
000800h
TBLPTR = 0008FFh
PC = 001FFEh
TBLRD*
001FFFh
002000h
WRT1, EBTR1 = 11
WRT2, EBTR2 = 11
WRT3, EBTR3 = 11
003FFFh
004000h
005FFFh
006000h
007FFFh
Results: Table reads permitted within Blockn, even when EBTRBn = 0.
TABLAT register returns the value of the data at the location TBLPTR.
DS41412A-page 366
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
To use the In-Circuit Debugger function of the
microcontroller, the design must implement In-Circuit
Serial Programming connections to the following pins:
24.3.2
DATA EEPROM
CODE PROTECTION
The entire data EEPROM is protected from external
reads and writes by two bits: CPD and WRTD. CPD
inhibits external reads and writes of data EEPROM.
WRTD inhibits internal and external writes to data
EEPROM. The CPU can always read data EEPROM
under normal operation, regardless of the protection bit
settings.
• MCLR/VPP/RE3
• VDD
• VSS
• RB7
• RB6
This will interface to the In-Circuit Debugger module
available from Microchip or one of the third party
development tool companies.
24.3.3
CONFIGURATION REGISTER
PROTECTION
The Configuration registers can be write-protected.
The WRTC bit controls protection of the Configuration
registers. In normal execution mode, the WRTC bit is
readable only. WRTC can only be written via ICSP or
an external programmer.
24.7 Single-Supply ICSP Programming
The LVP Configuration bit enables Single-Supply ICSP
Programming (formerly known as Low-Voltage ICSP
Programming or LVP). When Single-Supply Program-
ming is enabled, the microcontroller can be programmed
without requiring high voltage being applied to the
MCLR/VPP/RE3 pin. See “PIC18(L)F2XK22/4XK22
Flash Memory Programming” (DS41398) for more
details about low voltage programming.
24.4 ID Locations
Eight memory locations (200000h-200007h) are
designated as ID locations, where the user can store
checksum or other code identification numbers. These
locations are both readable and writable during normal
execution through the TBLRD and TBLWT instructions
or during program/verify. The ID locations can be read
when the device is code-protected.
Note 1: High-voltage programming is always
available, regardless of the state of the
LVP bit, by applying VIHH to the MCLR
pin.
2: By default, Single-Supply ICSP is
enabled in unprogrammed devices (as
supplied from Microchip) and erased
devices.
24.5
In-Circuit Serial Programming
PIC18(L)F2X/4XK22 devices can be serially
programmed while in the end application circuit. This is
simply done with two lines for clock and data and three
other lines for power, ground and the programming
voltage. This allows customers to manufacture boards
with unprogrammed devices and then program the
microcontroller just before shipping the product. This
also allows the most recent firmware or a custom
firmware to be programmed.
3: While in Low-Voltage ICSP mode, MCLR
is always enabled, regardless of the
MCLRE bit, and the RE3 pin can no
longer be used as a general purpose
input.
The LVP bit may be set or cleared only when using
standard high-voltage programming (VIHH applied to
the MCLR/VPP/RE3 pin). Once LVP has been disabled,
only the standard high-voltage programming is
available and must be used to program the device.
24.6 In-Circuit Debugger
When the DEBUG Configuration bit is programmed to
a ‘0’, the In-Circuit Debugger functionality is enabled.
This function allows simple debugging functions when
used with MPLAB® IDE. When the microcontroller has
this feature enabled, some resources are not available
for general use. Table 24-6 shows which resources are
required by the background debugger.
Memory that is not code-protected can be erased using
either a block erase, or erased row by row, then written
at any specified VDD. If code-protected memory is to be
erased, a block erase is required.
TABLE 24-6: DEBUGGER RESOURCES
I/O pins:
RB6, RB7
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 367
PIC18(L)F2X/4XK22
NOTES:
DS41412A-page 368
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
The literal instructions may use some of the following
operands:
25.0 INSTRUCTION SET SUMMARY
PIC18(L)F2X/4XK22 devices incorporate the standard
set of 75 PIC18 core instructions, as well as an extended
set of 8 new instructions, for the optimization of code that
is recursive or that utilizes a software stack. The
extended set is discussed later in this section.
• A literal value to be loaded into a file register
(specified by ‘k’)
• The desired FSR register to load the literal value
into (specified by ‘f’)
• No operand required
(specified by ‘—’)
25.1 Standard Instruction Set
The control instructions may use some of the following
operands:
The standard PIC18 instruction set adds many
enhancements to the previous PIC® MCU instruction
sets, while maintaining an easy migration from these
PIC® MCU instruction sets. Most instructions are a
single program memory word (16 bits), but there are
four instructions that require two program memory
locations.
• A program memory address (specified by ‘n’)
• The mode of the CALLor RETURNinstructions
(specified by ‘s’)
• The mode of the table read and table write
instructions (specified by ‘m’)
Each single-word instruction is a 16-bit word divided
into an opcode, which specifies the instruction type and
one or more operands, which further specify the
operation of the instruction.
• No operand required
(specified by ‘—’)
All instructions are a single word, except for four
double-word instructions. These instructions were
made double-word to contain the required information
in 32 bits. In the second word, the 4 MSbs are ‘1’s. If
this second word is executed as an instruction (by
itself), it will execute as a NOP.
The instruction set is highly orthogonal and is grouped
into four basic categories:
• Byte-oriented operations
• Bit-oriented operations
• Literal operations
All single-word instructions are executed in a single
instruction cycle, unless a conditional test is true or the
program counter is changed as a result of the instruc-
tion. In these cases, the execution takes two instruction
cycles, with the additional instruction cycle(s) executed
as a NOP.
• Control operations
The PIC18 instruction set summary in Table 25-2 lists
byte-oriented, bit-oriented, literal and control
operations. Table 25-1 shows the opcode field
descriptions.
The double-word instructions execute in two instruction
cycles.
Most byte-oriented instructions have three operands:
1. The file register (specified by ‘f’)
One instruction cycle consists of four oscillator periods.
Thus, for an oscillator frequency of 4 MHz, the normal
instruction execution time is 1 s. If a conditional test is
true, or the program counter is changed as a result of
an instruction, the instruction execution time is 2 s.
Two-word branch instructions (if true) would take 3 s.
2. The destination of the result (specified by ‘d’)
3. The accessed memory (specified by ‘a’)
The file register designator ‘f’ specifies which file
register is to be used by the instruction. The destination
designator ‘d’ specifies where the result of the opera-
tion is to be placed. If ‘d’ is zero, the result is placed in
the WREG register. If ‘d’ is one, the result is placed in
the file register specified in the instruction.
Figure 25-1 shows the general formats that the instruc-
tions can have. All examples use the convention ‘nnh’
to represent a hexadecimal number.
The Instruction Set Summary, shown in Table 25-2,
lists the standard instructions recognized by the
Microchip Assembler (MPASMTM).
All bit-oriented instructions have three operands:
1. The file register (specified by ‘f’)
2. The bit in the file register (specified by ‘b’)
3. The accessed memory (specified by ‘a’)
Section 25.1.1 “Standard Instruction Set” provides
a description of each instruction.
The bit field designator ‘b’ selects the number of the bit
affected by the operation, while the file register
designator ‘f’ represents the number of the file in which
the bit is located.
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 369
PIC18(L)F2X/4XK22
TABLE 25-1: OPCODE FIELD DESCRIPTIONS
Field
Description
a
RAM access bit
a = 0: RAM location in Access RAM (BSR register is ignored)
a = 1: RAM bank is specified by BSR register
bbb
Bit address within an 8-bit file register (0 to 7).
BSR
Bank Select Register. Used to select the current RAM bank.
ALU Status bits: Carry, Digit Carry, Zero, Overflow, Negative.
C, DC, Z, OV, N
d
Destination select bit
d = 0: store result in WREG
d = 1: store result in file register f
dest
f
Destination: either the WREG register or the specified register file location.
8-bit Register file address (00h to FFh) or 2-bit FSR designator (0h to 3h).
12-bit Register file address (000h to FFFh). This is the source address.
12-bit Register file address (000h to FFFh). This is the destination address.
Global Interrupt Enable bit.
f
f
s
d
GIE
k
Literal field, constant data or label (may be either an 8-bit, 12-bit or a 20-bit value).
Label name.
label
mm
The mode of the TBLPTR register for the table read and table write instructions.
Only used with table read and table write instructions:
*
No change to register (such as TBLPTR with table reads and writes)
Post-Increment register (such as TBLPTR with table reads and writes)
Post-Decrement register (such as TBLPTR with table reads and writes)
Pre-Increment register (such as TBLPTR with table reads and writes)
*+
*-
+*
n
The relative address (2’s complement number) for relative branch instructions or the direct address for
CALL/BRANCHand RETURNinstructions.
PC
Program Counter.
PCL
Program Counter Low Byte.
Program Counter High Byte.
Program Counter High Byte Latch.
Program Counter Upper Byte Latch.
Power-down bit.
PCH
PCLATH
PCLATU
PD
PRODH
PRODL
s
Product of Multiply High Byte.
Product of Multiply Low Byte.
Fast Call/Return mode select bit
s = 0: do not update into/from shadow registers
s = 1: certain registers loaded into/from shadow registers (Fast mode)
TBLPTR
TABLAT
TO
21-bit Table Pointer (points to a Program Memory location).
8-bit Table Latch.
Time-out bit.
TOS
u
Top-of-Stack.
Unused or unchanged.
Watchdog Timer.
WDT
WREG
x
Working register (accumulator).
Don’t care (‘0’ or ‘1’). The assembler will generate code with x = 0. It is the recommended form of use for
compatibility with all Microchip software tools.
z
z
{
7-bit offset value for indirect addressing of register files (source).
7-bit offset value for indirect addressing of register files (destination).
Optional argument.
s
d
}
[text]
(text)
[expr]<n>
Indicates an indexed address.
The contents of text.
Specifies bit nof the register indicated by the pointer expr.
Assigned to.
< >
Register bit field.
In the set of.
italics
User defined term (font is Courier).
DS41412A-page 370
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
FIGURE 25-1:
GENERAL FORMAT FOR INSTRUCTIONS
Byte-oriented file register operations
15 10
OPCODE f (FILE #)
Example Instruction
9
8
7
0
ADDWF MYREG, W, B
d
a
d = 0for result destination to be WREG register
d = 1for result destination to be file register (f)
a = 0to force Access Bank
a = 1for BSR to select bank
f = 8-bit file register address
Byte to Byte move operations (2-word)
15
12 11
0
0
OPCODE
f (Source FILE #)
MOVFF MYREG1, MYREG2
15
12 11
1111
f (Destination FILE #)
f = 12-bit file register address
Bit-oriented file register operations
15 12 11 9 8
OPCODE b (BIT #)
7
0
BSF MYREG, bit, B
a
f (FILE #)
b = 3-bit position of bit in file register (f)
a = 0to force Access Bank
a = 1for BSR to select bank
f = 8-bit file register address
Literal operations
15
8
7
0
MOVLW 7Fh
OPCODE
k (literal)
k = 8-bit immediate value
Control operations
CALL, GOTO and Branch operations
15
8 7
0
GOTO Label
OPCODE
12 11
n<7:0> (literal)
15
0
1111
n<19:8> (literal)
n = 20-bit immediate value
15
15
8
7
0
CALL MYFUNC
OPCODE
12 11
n<7:0> (literal)
S
0
1111
n<19:8> (literal)
S = Fast bit
15
11 10
0
0
BRA MYFUNC
BC MYFUNC
OPCODE
n<10:0> (literal)
15
OPCODE
8 7
n<7:0> (literal)
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 371
PIC18(L)F2X/4XK22
TABLE 25-2: PIC18(L)F2X/4XK22 INSTRUCTION SET
16-Bit Instruction Word
Mnemonic,
Operands
Status
Affected
Description
Cycles
Notes
MSb LSb
BYTE-ORIENTED OPERATIONS
ADDWF f, d, a Add WREG and f
ADDWFC f, d, a Add WREG and CARRY bit to f
1
0010 01da
ffff
ffff
ffff
ffff
ffff
ffff
ffff
ffff
ffff
ffff
ffff
ffff
ffff
ffff
ffff
ffff
ffff
ffff
ffff
ffff
ffff
ffff
ffff
ffff
ffff
ffff
ffff
ffff C, DC, Z, OV, N
ffff C, DC, Z, OV, N
ffff Z, N
1, 2
1, 2
1,2
2
1, 2
4
4
1, 2
1, 2, 3, 4
1, 2, 3, 4
1, 2
1, 2, 3, 4
4
1, 2
1, 2
1
1
1
1
1
0010 00da
0001 01da
0110 101a
0001 11da
ANDWF
CLRF
COMF
f, d, a AND WREG with f
f, a Clear f
f, d, a Complement f
ffff
Z
ffff Z, N
ffff None
ffff None
ffff None
ffff C, DC, Z, OV, N
ffff None
ffff None
ffff C, DC, Z, OV, N
ffff None
ffff None
ffff Z, N
ffff Z, N
ffff None
ffff
ffff None
ffff None
CPFSEQ
CPFSGT
CPFSLT
DECF
f, a
f, a
f, a
Compare f with WREG, skip =
Compare f with WREG, skip >
Compare f with WREG, skip <
1 (2 or 3) 0110 001a
1 (2 or 3) 0110 010a
1 (2 or 3) 0110 000a
f, d, a Decrement f
1
0000 01da
DECFSZ
DCFSNZ
INCF
f, d, a Decrement f, Skip if 0
f, d, a Decrement f, Skip if Not 0
f, d, a Increment f
1 (2 or 3) 0010 11da
1 (2 or 3) 0100 11da
1
1 (2 or 3) 0011 11da
1 (2 or 3) 0100 10da
1
1
2
0010 10da
INCFSZ
INFSNZ
IORWF
MOVF
f, d, a Increment f, Skip if 0
f, d, a Increment f, Skip if Not 0
f, d, a Inclusive OR WREG with f
f, d, a Move f
0001 00da
0101 00da
1100 ffff
1111 ffff
0110 111a
0000 001a
0110 110a
0011 01da
0100 01da
0011 00da
0100 00da
0110 100a
0101 01da
MOVFF
f , f
Move f (source) to 1st word
s
d
s
f (destination) 2nd word
d
MOVWF
MULWF
NEGF
f, a
f, a
f, a
Move WREG to f
Multiply WREG with f
Negate f
1
1
1
1
1
1
1
1
1
1, 2
1, 2
ffff C, DC, Z, OV, N
ffff C, Z, N
ffff Z, N
ffff C, Z, N
ffff Z, N
RLCF
RLNCF
RRCF
RRNCF
SETF
f, d, a Rotate Left f through Carry
f, d, a Rotate Left f (No Carry)
f, d, a Rotate Right f through Carry
f, d, a Rotate Right f (No Carry)
f, a
Set f
ffff None
ffff C, DC, Z, OV, N
1, 2
1, 2
SUBFWB f, d, a Subtract f from WREG with
borrow
SUBWF
f, d, a Subtract WREG from f
1
1
0101 11da
0101 10da
ffff
ffff
ffff C, DC, Z, OV, N
ffff C, DC, Z, OV, N
SUBWFB f, d, a Subtract WREG from f with
borrow
SWAPF
TSTFSZ
XORWF
f, d, a Swap nibbles in f
f, a Test f, skip if 0
f, d, a Exclusive OR WREG with f
1
0011 10da
ffff
ffff
ffff
ffff None
ffff None
ffff Z, N
4
1, 2
1 (2 or 3) 0110 011a
0001 10da
1
Note 1: When a PORT register is modified as a function of itself (e.g., MOVF PORTB, 1, 0), the value used will be that value
present on the pins themselves. For example, if the data latch is ‘1’ for a pin configured as input and is driven low by an
external device, the data will be written back with a ‘0’.
2: If this instruction is executed on the TMR0 register (and where applicable, ‘d’ = 1), the prescaler will be cleared if
assigned.
3: If Program Counter (PC) is modified or a conditional test is true, the instruction requires two cycles. The second cycle is
executed as a NOP.
4: Some instructions are two-word instructions. The second word of these instructions will be executed as a NOPunless the
first word of the instruction retrieves the information embedded in these 16 bits. This ensures that all program memory
locations have a valid instruction.
DS41412A-page 372
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
TABLE 25-2: PIC18(L)F2X/4XK22 INSTRUCTION SET (CONTINUED)
16-Bit Instruction Word
Mnemonic,
Operands
Status
Affected
Description
Cycles
Notes
MSb LSb
BIT-ORIENTED OPERATIONS
BCF
BSF
BTFSC
BTFSS
BTG
f, b, a Bit Clear f
f, b, a Bit Set f
f, b, a Bit Test f, Skip if Clear
f, b, a Bit Test f, Skip if Set
f, d, a Bit Toggle f
1
1
1001 bbba
1000 bbba
ffff
ffff
ffff
ffff
ffff
ffff None
ffff None
ffff None
ffff None
ffff None
1, 2
1, 2
3, 4
3, 4
1, 2
1 (2 or 3) 1011 bbba
1 (2 or 3) 1010 bbba
1
0111 bbba
CONTROL OPERATIONS
BC
BN
n
n
n
n
n
n
n
n
Branch if Carry
1 (2)
1 (2)
1 (2)
1 (2)
1 (2)
1 (2)
1 (2)
2
1110 0010
1110 0110
1110 0011
1110 0111
1110 0101
1110 0001
1110 0100
1101 0nnn
1110 0000
1110 110s
1111 kkkk
0000 0000
0000 0000
1110 1111
1111 kkkk
0000 0000
1111 xxxx
0000 0000
0000 0000
1101 1nnn
0000 0000
0000 0000
nnnn
nnnn
nnnn
nnnn
nnnn
nnnn
nnnn
nnnn
nnnn
kkkk
kkkk
0000
0000
kkkk
kkkk
0000
xxxx
0000
0000
nnnn
1111
0001
nnnn None
nnnn None
nnnn None
nnnn None
nnnn None
nnnn None
nnnn None
nnnn None
nnnn None
kkkk None
kkkk
Branch if Negative
Branch if Not Carry
Branch if Not Negative
Branch if Not Overflow
Branch if Not Zero
Branch if Overflow
Branch Unconditionally
Branch if Zero
Call subroutine 1st word
2nd word
Clear Watchdog Timer
Decimal Adjust WREG
Go to address 1st word
2nd word
BNC
BNN
BNOV
BNZ
BOV
BRA
BZ
n
n, s
1 (2)
2
CALL
CLRWDT
DAW
GOTO
—
—
n
1
1
2
0100 TO, PD
0111
C
kkkk None
kkkk
NOP
NOP
POP
PUSH
RCALL
RESET
RETFIE
—
—
—
—
n
No Operation
No Operation
1
1
1
1
2
1
2
0000 None
xxxx None
0110 None
0101 None
nnnn None
1111 All
4
Pop top of return stack (TOS)
Push top of return stack (TOS)
Relative Call
Software device Reset
Return from interrupt enable
s
000s GIE/GIEH,
PEIE/GIEL
RETLW
RETURN
SLEEP
k
s
—
Return with literal in WREG
Return from Subroutine
Go into Standby mode
2
2
1
0000 1100
0000 0000
0000 0000
kkkk
0001
0000
kkkk None
001s None
0011 TO, PD
Note 1: When a PORT register is modified as a function of itself (e.g., MOVF PORTB, 1, 0), the value used will be that value
present on the pins themselves. For example, if the data latch is ‘1’ for a pin configured as input and is driven low by an
external device, the data will be written back with a ‘0’.
2: If this instruction is executed on the TMR0 register (and where applicable, ‘d’ = 1), the prescaler will be cleared if
assigned.
3: If Program Counter (PC) is modified or a conditional test is true, the instruction requires two cycles. The second cycle is
executed as a NOP.
4: Some instructions are two-word instructions. The second word of these instructions will be executed as a NOPunless the
first word of the instruction retrieves the information embedded in these 16 bits. This ensures that all program memory
locations have a valid instruction.
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 373
PIC18(L)F2X/4XK22
TABLE 25-2: PIC18(L)F2X/4XK22 INSTRUCTION SET (CONTINUED)
16-Bit Instruction Word
Mnemonic,
Operands
Status
Affected
Description
Cycles
Notes
MSb
LSb
LITERAL OPERATIONS
ADDLW
ANDLW
IORLW
LFSR
k
k
k
f, k
Add literal and WREG
AND literal with WREG
Inclusive OR literal with WREG
Move literal (12-bit) 2nd word
1
0000 1111 kkkk
0000 1011 kkkk
0000 1001 kkkk
1110 1110 00ff
1111 0000 kkkk
0000 0001 0000
0000 1110 kkkk
0000 1101 kkkk
0000 1100 kkkk
0000 1000 kkkk
0000 1010 kkkk
kkkk C, DC, Z, OV, N
kkkk Z, N
kkkk Z, N
kkkk None
kkkk
kkkk None
kkkk None
kkkk None
kkkk None
kkkk C, DC, Z, OV, N
kkkk Z, N
1
1
2
to FSR(f)
1st word
MOVLB
MOVLW
MULLW
RETLW
SUBLW
XORLW
k
k
k
k
k
k
Move literal to BSR<3:0>
Move literal to WREG
Multiply literal with WREG
Return with literal in WREG
Subtract WREG from literal
Exclusive OR literal with WREG
1
1
1
2
1
1
DATA MEMORY PROGRAM MEMORY OPERATIONS
TBLRD*
Table Read
2
0000 0000 0000
0000 0000 0000
0000 0000 0000
0000 0000 0000
0000 0000 0000
0000 0000 0000
0000 0000 0000
0000 0000 0000
1000 None
1001 None
1010 None
1011 None
1100 None
1101 None
1110 None
1111 None
TBLRD*+
TBLRD*-
TBLRD+*
TBLWT*
TBLWT*+
TBLWT*-
TBLWT+*
Table Read with post-increment
Table Read with post-decrement
Table Read with pre-increment
Table Write
Table Write with post-increment
Table Write with post-decrement
Table Write with pre-increment
2
Note 1: When a PORT register is modified as a function of itself (e.g., MOVF PORTB, 1, 0), the value used will be that value
present on the pins themselves. For example, if the data latch is ‘1’ for a pin configured as input and is driven low by an
external device, the data will be written back with a ‘0’.
2: If this instruction is executed on the TMR0 register (and where applicable, ‘d’ = 1), the prescaler will be cleared if
assigned.
3: If Program Counter (PC) is modified or a conditional test is true, the instruction requires two cycles. The second cycle is
executed as a NOP.
4: Some instructions are two-word instructions. The second word of these instructions will be executed as a NOPunless the
first word of the instruction retrieves the information embedded in these 16 bits. This ensures that all program memory
locations have a valid instruction.
DS41412A-page 374
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
25.1.1
STANDARD INSTRUCTION SET
ADDLW
ADD literal to W
ADDWF
ADD W to f
Syntax:
ADDLW
k
Syntax:
ADDWF
f {,d {,a}}
Operands:
Operation:
Status Affected:
Encoding:
Description:
0 k 255
Operands:
0 f 255
d [0,1]
a [0,1]
(W) + k W
N, OV, C, DC, Z
Operation:
(W) + (f) dest
0000
1111
kkkk
kkkk
Status Affected:
Encoding:
N, OV, C, DC, Z
The contents of W are added to the
8-bit literal ‘k’ and the result is placed in
W.
0010
01da
ffff
ffff
Description:
Add W to register ‘f’. If ‘d’ is ‘0’, the
result is stored in W. If ‘d’ is ‘1’, the
result is stored back in register ‘f’
(default).
Words:
Cycles:
1
1
If ‘a’ is ‘0’, the Access Bank is selected.
If ‘a’ is ‘1’, the BSR is used to select the
GPR bank.
If ‘a’ is ‘0’ and the extended instruction
set is enabled, this instruction operates
in Indexed Literal Offset Addressing
mode whenever f 95 (5Fh). See
Section 25.2.3 “Byte-Oriented and
Bit-Oriented Instructions in Indexed
Literal Offset Mode” for details.
Q Cycle Activity:
Q1
Q2
Q3
Q4
Decode
Read
literal ‘k’
Process
Data
Write to W
Example:
ADDLW
15h
Before Instruction
10h
After Instruction
25h
W
=
Words:
Cycles:
1
1
W
=
Q Cycle Activity:
Q1
Q2
Q3
Q4
Decode
Read
register ‘f’
Process
Data
Write to
destination
Example:
ADDWF
REG, 0, 0
Before Instruction
W
=
17h
REG
=
0C2h
After Instruction
W
REG
=
=
0D9h
0C2h
Note:
All PIC18 instructions may take an optional label argument preceding the instruction mnemonic for use in
symbolic addressing. If a label is used, the instruction format then becomes: {label} instruction argument(s).
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 375
PIC18(L)F2X/4XK22
ADDWFC
ADD W and CARRY bit to f
ANDLW
AND literal with W
Syntax:
ADDWFC
f {,d {,a}}
Syntax:
ANDLW
k
Operands:
0 f 255
d [0,1]
a [0,1]
Operands:
Operation:
Status Affected:
Encoding:
Description:
0 k 255
(W) .AND. k W
N, Z
Operation:
(W) + (f) + (C) dest
0000
1011
kkkk
kkkk
Status Affected:
Encoding:
N,OV, C, DC, Z
The contents of W are AND’ed with the
8-bit literal ‘k’. The result is placed in W.
0010
00da
ffff
ffff
Description:
Add W, the CARRY flag and data mem-
ory location ‘f’. If ‘d’ is ‘0’, the result is
placed in W. If ‘d’ is ‘1’, the result is
placed in data memory location ‘f’.
If ‘a’ is ‘0’, the Access Bank is selected.
If ‘a’ is ‘1’, the BSR is used to select the
GPR bank.
If ‘a’ is ‘0’ and the extended instruction
set is enabled, this instruction operates
in Indexed Literal Offset Addressing
mode whenever f 95 (5Fh). See
Section 25.2.3 “Byte-Oriented and
Bit-Oriented Instructions in Indexed
Literal Offset Mode” for details.
Words:
1
1
Cycles:
Q Cycle Activity:
Q1
Q2
Q3
Q4
Decode
Read literal
‘k’
Process
Data
Write to W
Example:
ANDLW
05Fh
Before Instruction
W
=
A3h
03h
After Instruction
W
=
Words:
Cycles:
1
1
Q Cycle Activity:
Q1
Q2
Q3
Q4
Decode
Read
register ‘f’
Process
Data
Write to
destination
Example:
ADDWFC
REG, 0, 1
Before Instruction
CARRY bit =
1
02h
4Dh
REG
W
=
=
After Instruction
CARRY bit =
0
02h
50h
REG
W
=
=
DS41412A-page 376
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
ANDWF
AND W with f
BC
Branch if Carry
Syntax:
ANDWF
f {,d {,a}}
Syntax:
BC
n
Operands:
0 f 255
d [0,1]
a [0,1]
Operands:
Operation:
-128 n 127
if CARRY bit is ‘1’
(PC) + 2 + 2n PC
Operation:
(W) .AND. (f) dest
Status Affected:
Encoding:
None
Status Affected:
Encoding:
N, Z
1110
0010
nnnn
nnnn
0001
01da
ffff
ffff
Description:
If the CARRY bit is ‘1’, then the program
will branch.
Description:
The contents of W are AND’ed with
register ‘f’. If ‘d’ is ‘0’, the result is stored
in W. If ‘d’ is ‘1’, the result is stored back
in register ‘f’ (default).
If ‘a’ is ‘0’, the Access Bank is selected.
If ‘a’ is ‘1’, the BSR is used to select the
GPR bank.
The 2’s complement number ‘2n’ is
added to the PC. Since the PC will have
incremented to fetch the next
instruction, the new address will be
PC + 2 + 2n. This instruction is then a
two-cycle instruction.
If ‘a’ is ‘0’ and the extended instruction
set is enabled, this instruction operates
in Indexed Literal Offset Addressing
mode whenever f 95 (5Fh). See
Section 25.2.3 “Byte-Oriented and
Bit-Oriented Instructions in Indexed
Literal Offset Mode” for details.
Words:
Cycles:
1
1(2)
Q Cycle Activity:
If Jump:
Q1
Q2
Q3
Q4
Decode
Read literal
‘n’
Process
Data
Write to PC
Words:
1
1
Cycles:
No
No
No
No
operation
operation
operation
operation
Q Cycle Activity:
Q1
If No Jump:
Q1
Q2
Q3
Q4
Q2
Q3
Q4
Decode
Read
register ‘f’
Process
Data
Write to
destination
Decode
Read literal
‘n’
Process
Data
No
operation
Example:
ANDWF
REG, 0, 0
Example:
HERE
BC
5
Before Instruction
Before Instruction
W
REG
=
=
17h
C2h
PC
=
address (HERE)
After Instruction
After Instruction
If CARRY
PC
If CARRY
PC
=
=
=
=
1;
address (HERE + 12)
0;
address (HERE + 2)
W
REG
=
=
02h
C2h
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 377
PIC18(L)F2X/4XK22
BCF
Bit Clear f
BN
Branch if Negative
Syntax:
BCF f, b {,a}
Syntax:
BN
n
Operands:
0 f 255
0 b 7
a [0,1]
Operands:
Operation:
-128 n 127
if NEGATIVE bit is ‘1’
(PC) + 2 + 2n PC
Operation:
0 f<b>
Status Affected:
Encoding:
None
Status Affected:
Encoding:
None
1110
0110
nnnn
nnnn
1001
bbba
ffff
ffff
Description:
If the NEGATIVE bit is ‘1’, then the
program will branch.
Description:
Bit ‘b’ in register ‘f’ is cleared.
If ‘a’ is ‘0’, the Access Bank is selected.
If ‘a’ is ‘1’, the BSR is used to select the
GPR bank.
If ‘a’ is ‘0’ and the extended instruction
set is enabled, this instruction operates
in Indexed Literal Offset Addressing
mode whenever f 95 (5Fh). See
Section 25.2.3 “Byte-Oriented and
Bit-Oriented Instructions in Indexed
Literal Offset Mode” for details.
The 2’s complement number ‘2n’ is
added to the PC. Since the PC will have
incremented to fetch the next
instruction, the new address will be
PC + 2 + 2n. This instruction is then a
two-cycle instruction.
Words:
Cycles:
1
1(2)
Q Cycle Activity:
If Jump:
Words:
Cycles:
1
1
Q1
Q2
Q3
Q4
Decode
Read literal
‘n’
Process
Data
Write to PC
Q Cycle Activity:
Q1
Q2
Q3
Q4
No
No
No
No
Decode
Read
register ‘f’
Process
Data
Write
register ‘f’
operation
operation
operation
operation
If No Jump:
Q1
Q2
Q3
Q4
Example:
BCF
FLAG_REG, 7, 0
C7h
47h
Decode
Read literal
‘n’
Process
Data
No
operation
Before Instruction
FLAG_REG =
After Instruction
FLAG_REG =
Example:
HERE
BN Jump
Before Instruction
PC
=
address (HERE)
After Instruction
If NEGATIVE
PC
If NEGATIVE
PC
=
=
=
=
1;
address (Jump)
0;
address (HERE + 2)
DS41412A-page 378
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
BNC
Branch if Not Carry
BNN
Branch if Not Negative
Syntax:
BNC
n
Syntax:
BNN
n
Operands:
Operation:
-128 n 127
Operands:
Operation:
-128 n 127
if CARRY bit is ‘0’
(PC) + 2 + 2n PC
if NEGATIVE bit is ‘0’
(PC) + 2 + 2n PC
Status Affected:
Encoding:
None
Status Affected:
Encoding:
None
1110
0011
nnnn
nnnn
1110
0111
nnnn
nnnn
Description:
If the CARRY bit is ‘0’, then the program
will branch.
Description:
If the NEGATIVE bit is ‘0’, then the
program will branch.
The 2’s complement number ‘2n’ is
added to the PC. Since the PC will have
incremented to fetch the next
instruction, the new address will be
PC + 2 + 2n. This instruction is then a
two-cycle instruction.
The 2’s complement number ‘2n’ is
added to the PC. Since the PC will have
incremented to fetch the next
instruction, the new address will be
PC + 2 + 2n. This instruction is then a
two-cycle instruction.
Words:
Cycles:
1
Words:
Cycles:
1
1(2)
1(2)
Q Cycle Activity:
If Jump:
Q Cycle Activity:
If Jump:
Q1
Q2
Q3
Q4
Q1
Q2
Q3
Q4
Decode
Read literal
‘n’
Process
Data
Write to PC
Decode
Read literal
‘n’
Process
Data
Write to PC
No
No
No
No
No
No
No
No
operation
operation
operation
operation
operation
operation
operation
operation
If No Jump:
Q1
If No Jump:
Q1
Q2
Q3
Q4
Q2
Q3
Q4
Decode
Read literal
‘n’
Process
Data
No
operation
Decode
Read literal
‘n’
Process
Data
No
operation
Example:
HERE
BNC Jump
Example:
HERE
BNN Jump
Before Instruction
Before Instruction
PC
=
address (HERE)
PC
=
address (HERE)
After Instruction
After Instruction
If CARRY
PC
If CARRY
PC
=
=
=
=
0;
If NEGATIVE
PC
If NEGATIVE
PC
=
=
=
=
0;
address (Jump)
address (Jump)
1;
1;
address (HERE + 2)
address (HERE + 2)
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 379
PIC18(L)F2X/4XK22
BNOV
Branch if Not Overflow
BNZ
Branch if Not Zero
Syntax:
BNOV
n
Syntax:
BNZ
n
Operands:
Operation:
-128 n 127
Operands:
Operation:
-128 n 127
if OVERFLOW bit is ‘0’
(PC) + 2 + 2n PC
if ZERO bit is ‘0’
(PC) + 2 + 2n PC
Status Affected:
Encoding:
None
Status Affected:
Encoding:
None
1110
0101
nnnn
nnnn
1110
0001
nnnn
nnnn
Description:
If the OVERFLOW bit is ‘0’, then the
program will branch.
Description:
If the ZERO bit is ‘0’, then the program
will branch.
The 2’s complement number ‘2n’ is
added to the PC. Since the PC will have
incremented to fetch the next
instruction, the new address will be
PC + 2 + 2n. This instruction is then a
two-cycle instruction.
The 2’s complement number ‘2n’ is
added to the PC. Since the PC will have
incremented to fetch the next
instruction, the new address will be
PC + 2 + 2n. This instruction is then a
two-cycle instruction.
Words:
Cycles:
1
Words:
Cycles:
1
1(2)
1(2)
Q Cycle Activity:
If Jump:
Q Cycle Activity:
If Jump:
Q1
Q2
Q3
Q4
Q1
Q2
Q3
Q4
Decode
Read literal
‘n’
Process
Data
Write to PC
Decode
Read literal
‘n’
Process
Data
Write to PC
No
No
No
No
No
No
No
No
operation
operation
operation
operation
operation
operation
operation
operation
If No Jump:
Q1
If No Jump:
Q1
Q2
Q3
Q4
Q2
Q3
Q4
Decode
Read literal
‘n’
Process
Data
No
operation
Decode
Read literal
‘n’
Process
Data
No
operation
Example:
HERE
BNOV Jump
Example:
HERE
BNZ Jump
Before Instruction
Before Instruction
PC
=
address (HERE)
PC
=
address (HERE)
After Instruction
After Instruction
If OVERFLOW =
PC
0;
If ZERO
PC
If ZERO
PC
=
=
=
=
0;
=
address (Jump)
address (Jump)
If OVERFLOW =
1;
1;
PC
=
address (HERE + 2)
address (HERE + 2)
DS41412A-page 380
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
BRA
Unconditional Branch
BSF
Bit Set f
Syntax:
BRA
n
Syntax:
BSF f, b {,a}
Operands:
Operation:
-1024 n 1023
Operands:
0 f 255
0 b 7
a [0,1]
(PC) + 2 + 2n PC
Status Affected: None
Operation:
1 f<b>
Encoding:
1101
0nnn
nnnn
nnnn
Status Affected:
Encoding:
None
Description:
Add the 2’s complement number ‘2n’ to
the PC. Since the PC will have incre-
mented to fetch the next instruction, the
new address will be PC + 2 + 2n. This
instruction is a two-cycle instruction.
1000
bbba
ffff
ffff
Description:
Bit ‘b’ in register ‘f’ is set.
If ‘a’ is ‘0’, the Access Bank is selected.
If ‘a’ is ‘1’, the BSR is used to select the
GPR bank.
If ‘a’ is ‘0’ and the extended instruction
set is enabled, this instruction operates
in Indexed Literal Offset Addressing
mode whenever f 95 (5Fh). See
Section 25.2.3 “Byte-Oriented and
Bit-Oriented Instructions in Indexed
Literal Offset Mode” for details.
Words:
Cycles:
1
2
Q Cycle Activity:
Q1
Q2
Q3
Q4
Decode
Read literal
‘n’
Process
Data
Write to PC
No
operation
No
operation
No
operation
No
operation
Words:
Cycles:
1
1
Q Cycle Activity:
Q1
Example:
HERE
BRA Jump
Q2
Q3
Q4
Before Instruction
Decode
Read
register ‘f’
Process
Data
Write
register ‘f’
PC
=
=
address (HERE)
address (Jump)
After Instruction
PC
Example:
BSF
FLAG_REG, 7, 1
0Ah
8Ah
Before Instruction
FLAG_REG
After Instruction
FLAG_REG
=
=
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 381
PIC18(L)F2X/4XK22
BTFSC
Bit Test File, Skip if Clear
BTFSS
Bit Test File, Skip if Set
Syntax:
BTFSC f, b {,a}
Syntax:
BTFSS f, b {,a}
Operands:
0 f 255
0 b 7
a [0,1]
Operands:
0 f 255
0 b < 7
a [0,1]
Operation:
skip if (f<b>) = 0
Operation:
skip if (f<b>) = 1
Status Affected:
Encoding:
None
Status Affected:
Encoding:
None
1011
bbba
ffff
ffff
1010
bbba
ffff
ffff
Description:
If bit ‘b’ in register ‘f’ is ‘0’, then the next
instruction is skipped. If bit ‘b’ is ‘0’, then
the next instruction fetched during the
current instruction execution is discarded
and a NOPis executed instead, making
this a two-cycle instruction.
Description:
If bit ‘b’ in register ‘f’ is ‘1’, then the next
instruction is skipped. If bit ‘b’ is ‘1’, then
the next instruction fetched during the
current instruction execution is discarded
and a NOPis executed instead, making
this a two-cycle instruction.
If ‘a’ is ‘0’, the Access Bank is selected. If
‘a’ is ‘1’, the BSR is used to select the
GPR bank.
If ‘a’ is ‘0’, the Access Bank is selected. If
‘a’ is ‘1’, the BSR is used to select the
GPR bank.
If ‘a’ is ‘0’ and the extended instruction
set is enabled, this instruction operates in
Indexed Literal Offset Addressing
mode whenever f 95 (5Fh).
If ‘a’ is ‘0’ and the extended instruction
set is enabled, this instruction operates
in Indexed Literal Offset Addressing
mode whenever f 95 (5Fh).
See Section 25.2.3 “Byte-Oriented and
Bit-Oriented Instructions in Indexed
Literal Offset Mode” for details.
See Section 25.2.3 “Byte-Oriented and
Bit-Oriented Instructions in Indexed
Literal Offset Mode” for details.
Words:
Cycles:
1
Words:
Cycles:
1
1(2)
1(2)
Note: 3 cycles if skip and followed
by a 2-word instruction.
Note: 3 cycles if skip and followed
by a 2-word instruction.
Q Cycle Activity:
Q1
Q Cycle Activity:
Q1
Q2
Q3
Q4
Q2
Q3
Q4
Decode
Read
register ‘f’
Process
Data
No
operation
Decode
Read
register ‘f’
Process
Data
No
operation
If skip:
Q1
If skip:
Q1
Q2
Q3
Q4
Q2
Q3
Q4
No
No
No
No
No
No
No
No
operation
operation
operation
operation
operation
operation
operation
operation
If skip and followed by 2-word instruction:
If skip and followed by 2-word instruction:
Q1
Q2
Q3
Q4
Q1
Q2
Q3
Q4
No
No
No
No
No
No
No
No
operation
operation
operation
operation
operation
operation
operation
operation
No
No
No
No
No
No
No
No
operation
operation
operation
operation
operation
operation
operation
operation
Example:
HERE
FALSE
TRUE
BTFSC
:
:
FLAG, 1, 0
Example:
HERE
FALSE
TRUE
BTFSS
:
:
FLAG, 1, 0
Before Instruction
PC
Before Instruction
PC
=
address (HERE)
=
address (HERE)
After Instruction
After Instruction
If FLAG<1>
PC
If FLAG<1>
PC
=
=
=
=
0;
If FLAG<1>
PC
If FLAG<1>
PC
=
=
=
=
0;
address (TRUE)
1;
address (FALSE)
1;
address (FALSE)
address (TRUE)
DS41412A-page 382
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
BTG
Bit Toggle f
BOV
Branch if Overflow
Syntax:
BTG f, b {,a}
Syntax:
BOV
n
Operands:
0 f 255
0 b < 7
a [0,1]
Operands:
Operation:
-128 n 127
if OVERFLOW bit is ‘1’
(PC) + 2 + 2n PC
Operation:
(f<b>) f<b>
Status Affected:
Encoding:
None
Status Affected:
Encoding:
None
1110
0100
nnnn
nnnn
0111
bbba
ffff
ffff
Description:
If the OVERFLOW bit is ‘1’, then the
program will branch.
Description:
Bit ‘b’ in data memory location ‘f’ is
inverted.
If ‘a’ is ‘0’, the Access Bank is selected.
If ‘a’ is ‘1’, the BSR is used to select the
GPR bank.
If ‘a’ is ‘0’ and the extended instruction
set is enabled, this instruction operates
in Indexed Literal Offset Addressing
mode whenever f 95 (5Fh). See
Section 25.2.3 “Byte-Oriented and
Bit-Oriented Instructions in Indexed
Literal Offset Mode” for details.
The 2’s complement number ‘2n’ is
added to the PC. Since the PC will have
incremented to fetch the next
instruction, the new address will be
PC + 2 + 2n. This instruction is then a
two-cycle instruction.
Words:
Cycles:
1
1(2)
Q Cycle Activity:
If Jump:
Words:
Cycles:
1
1
Q1
Q2
Q3
Q4
Decode
Read literal
‘n’
Process
Data
Write to PC
Q Cycle Activity:
Q1
No
operation
No
operation
No
operation
No
operation
Q2
Q3
Q4
Decode
Read
register ‘f’
Process
Data
Write
register ‘f’
If No Jump:
Q1
Q2
Q3
Q4
Decode
Read literal
‘n’
Process
Data
No
operation
Example:
BTG
PORTC, 4, 0
Before Instruction:
PORTC
After Instruction:
PORTC
=
0111 0101 [75h]
0110 0101 [65h]
Example:
HERE
BOV Jump
Before Instruction
=
PC
=
address (HERE)
After Instruction
If OVERFLOW =
PC
If OVERFLOW =
PC
1;
=
address (Jump)
0;
=
address (HERE + 2)
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 383
PIC18(L)F2X/4XK22
BZ
Branch if Zero
CALL
Subroutine Call
Syntax:
BZ
n
Syntax:
CALL k {,s}
Operands:
Operation:
-128 n 127
Operands:
0 k 1048575
s [0,1]
if ZERO bit is ‘1’
(PC) + 2 + 2n PC
Operation:
(PC) + 4 TOS,
k PC<20:1>,
if s = 1
Status Affected:
Encoding:
None
1110
0000
nnnn
nnnn
(W) WS,
(Status) STATUSS,
(BSR) BSRS
Description:
If the ZERO bit is ‘1’, then the program
will branch.
The 2’s complement number ‘2n’ is
added to the PC. Since the PC will
have incremented to fetch the next
instruction, the new address will be
PC + 2 + 2n. This instruction is then a
two-cycle instruction.
Status Affected:
None
Encoding:
1st word (k<7:0>)
2nd word(k<19:8>)
1110
1111
110s
k kkk
kkkk
kkkk
7
0
8
k
kkk kkkk
19
Description:
Subroutine call of entire 2-Mbyte
memory range. First, return address
(PC + 4) is pushed onto the return
stack. If ‘s’ = 1, the W, Status and BSR
registers are also pushed into their
respective shadow registers, WS,
STATUSS and BSRS. If ‘s’ = 0, no
update occurs (default). Then, the
20-bit value ‘k’ is loaded into PC<20:1>.
CALLis a two-cycle instruction.
Words:
Cycles:
1
1(2)
Q Cycle Activity:
If Jump:
Q1
Q2
Q3
Q4
Decode
Read literal
‘n’
Process
Data
Write to PC
No
operation
No
No
No
Words:
Cycles:
2
2
operation
operation
operation
If No Jump:
Q1
Q2
Q3
Q4
Q Cycle Activity:
Q1
Decode
Read literal
‘n’
Process
Data
No
operation
Q2
Q3
Q4
Decode
Read literal PUSH PC to Read literal
‘k’<7:0>,
stack
‘k’<19:8>,
Write to PC
Example:
HERE
BZ Jump
No
operation
No
operation
No
operation
No
operation
Before Instruction
PC
=
address (HERE)
After Instruction
If ZERO
PC
If ZERO
PC
=
=
=
=
1;
Example:
HERE
CALL THERE, 1
address (Jump)
Before Instruction
PC
After Instruction
0;
address (HERE + 2)
=
address (HERE)
PC
=
address (THERE)
TOS
WS
=
=
=
address (HERE + 4)
W
BSR
Status
BSRS
STATUSS=
DS41412A-page 384
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
CLRF
Clear f
CLRWDT
Clear Watchdog Timer
Syntax:
CLRF f {,a}
Syntax:
CLRWDT
None
Operands:
0 f 255
a [0,1]
Operands:
Operation:
000h WDT,
000h WDT postscaler,
1 TO,
Operation:
000h f
1 Z
1 PD
Status Affected:
Encoding:
Z
Status Affected:
Encoding:
TO, PD
0110
101a
ffff
ffff
0000
0000
0000
0100
Description:
Clears the contents of the specified
register.
Description:
CLRWDTinstruction resets the
If ‘a’ is ‘0’, the Access Bank is selected.
If ‘a’ is ‘1’, the BSR is used to select the
GPR bank.
Watchdog Timer. It also resets the
postscaler of the WDT. Status bits, TO
and PD, are set.
If ‘a’ is ‘0’ and the extended instruction
set is enabled, this instruction operates
in Indexed Literal Offset Addressing
mode whenever f 95 (5Fh). See
Section 25.2.3 “Byte-Oriented and
Bit-Oriented Instructions in Indexed
Literal Offset Mode” for details.
Words:
Cycles:
1
1
Q Cycle Activity:
Q1
Q2
Q3
Q4
Decode
No
Process
Data
No
operation
operation
Words:
Cycles:
1
1
Example:
CLRWDT
Q Cycle Activity:
Q1
Before Instruction
Q2
Q3
Q4
WDT Counter
After Instruction
WDT Counter
WDT Postscaler
TO
=
?
Decode
Read
register ‘f’
Process
Data
Write
register ‘f’
=
=
=
=
00h
0
1
Example:
CLRF
FLAG_REG, 1
PD
1
Before Instruction
FLAG_REG
After Instruction
FLAG_REG
=
=
5Ah
00h
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 385
PIC18(L)F2X/4XK22
CPFSEQ
Compare f with W, skip if f = W
COMF
Complement f
Syntax:
CPFSEQ f {,a}
Syntax:
COMF f {,d {,a}}
Operands:
0 f 255
a [0,1]
Operands:
0 f 255
d [0,1]
a [0,1]
Operation:
(f) – (W),
skip if (f) = (W)
(unsigned comparison)
Operation:
(f) dest
Status Affected:
Encoding:
N, Z
Status Affected:
Encoding:
None
0001
11da
ffff
ffff
0110
001a
ffff
ffff
Description:
The contents of register ‘f’ are
Description:
Compares the contents of data memory
location ‘f’ to the contents of W by
performing an unsigned subtraction.
If ‘f’ = W, then the fetched instruction is
discarded and a NOPis executed
instead, making this a two-cycle
instruction.
complemented. If ‘d’ is ‘0’, the result is
stored in W. If ‘d’ is ‘1’, the result is
stored back in register ‘f’ (default).
If ‘a’ is ‘0’, the Access Bank is selected.
If ‘a’ is ‘1’, the BSR is used to select the
GPR bank.
If ‘a’ is ‘0’ and the extended instruction
set is enabled, this instruction operates
in Indexed Literal Offset Addressing
mode whenever f 95 (5Fh). See
Section 25.2.3 “Byte-Oriented and
Bit-Oriented Instructions in Indexed
Literal Offset Mode” for details.
If ‘a’ is ‘0’, the Access Bank is selected.
If ‘a’ is ‘1’, the BSR is used to select the
GPR bank.
If ‘a’ is ‘0’ and the extended instruction
set is enabled, this instruction operates
in Indexed Literal Offset Addressing
mode whenever f 95 (5Fh). See
Section 25.2.3 “Byte-Oriented and
Bit-Oriented Instructions in Indexed
Literal Offset Mode” for details.
Words:
Cycles:
1
1
Q Cycle Activity:
Q1
Words:
Cycles:
1
Q2
Q3
Q4
1(2)
Decode
Read
register ‘f’
Process
Data
Write to
destination
Note: 3 cycles if skip and followed
by a 2-word instruction.
Q Cycle Activity:
Q1
Example:
COMF
REG, 0, 0
Q2
Q3
Q4
Before Instruction
Decode
Read
register ‘f’
Process
Data
No
operation
REG
=
13h
After Instruction
If skip:
REG
W
=
=
13h
ECh
Q1
No
Q2
No
Q3
No
Q4
No
operation
operation
operation
operation
If skip and followed by 2-word instruction:
Q1
No
Q2
No
Q3
No
Q4
No
operation
No
operation
No
operation
No
operation
No
operation
operation
operation
operation
Example:
HERE
CPFSEQ REG, 0
NEQUAL
EQUAL
:
:
Before Instruction
PC Address
=
HERE
W
REG
=
=
?
?
After Instruction
If REG
PC
=
=
W;
Address (EQUAL)
If REG
PC
=
W;
Address (NEQUAL)
DS41412A-page 386
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
CPFSGT
Compare f with W, skip if f > W
CPFSLT
Compare f with W, skip if f < W
Syntax:
CPFSGT f {,a}
Syntax:
CPFSLT f {,a}
Operands:
0 f 255
a [0,1]
Operands:
0 f 255
a [0,1]
Operation:
(f) –W),
skip if (f) > (W)
(unsigned comparison)
Operation:
(f) –W),
skip if (f) < (W)
(unsigned comparison)
Status Affected:
Encoding:
None
Status Affected:
Encoding:
None
0110
010a
ffff
ffff
0110
000a
ffff
ffff
Description:
Compares the contents of data memory
location ‘f’ to the contents of the W by
performing an unsigned subtraction.
If the contents of ‘f’ are greater than the
contents of WREG, then the fetched
instruction is discarded and a NOPis
executed instead, making this a
two-cycle instruction.
If ‘a’ is ‘0’, the Access Bank is selected.
If ‘a’ is ‘1’, the BSR is used to select the
GPR bank.
If ‘a’ is ‘0’ and the extended instruction
set is enabled, this instruction operates
in Indexed Literal Offset Addressing
mode whenever f 95 (5Fh). See
Section 25.2.3 “Byte-Oriented and
Bit-Oriented Instructions in Indexed
Literal Offset Mode” for details.
Description:
Compares the contents of data memory
location ‘f’ to the contents of W by
performing an unsigned subtraction.
If the contents of ‘f’ are less than the
contents of W, then the fetched
instruction is discarded and a NOPis
executed instead, making this a
two-cycle instruction.
If ‘a’ is ‘0’, the Access Bank is selected.
If ‘a’ is ‘1’, the BSR is used to select the
GPR bank.
Words:
Cycles:
1
1(2)
Note: 3 cycles if skip and followed
by a 2-word instruction.
Q Cycle Activity:
Q1
Q2
Q3
Q4
Words:
Cycles:
1
Decode
Read
register ‘f’
Process
Data
No
operation
1(2)
Note: 3 cycles if skip and followed
by a 2-word instruction.
If skip:
Q1
Q2
Q3
Q4
Q Cycle Activity:
Q1
No
operation
No
operation
No
operation
No
operation
Q2
Q3
Q4
No
operation
Decode
Read
register ‘f’
Process
Data
If skip and followed by 2-word instruction:
If skip:
Q1
Q2
Q3
Q4
Q1
No
Q2
No
Q3
No
Q4
No
No
operation
No
operation
No
operation
No
operation
operation
operation
operation
operation
No
No
No
No
If skip and followed by 2-word instruction:
operation
operation
operation
operation
Q1
No
operation
No
Q2
No
operation
No
Q3
No
operation
No
Q4
No
operation
No
Example:
HERE
NLESS
LESS
CPFSLT REG, 1
:
:
operation
operation
operation
operation
Before Instruction
PC
W
=
=
Address (HERE)
Example:
HERE
NGREATER
GREATER
CPFSGT REG, 0
:
:
?
After Instruction
If REG
PC
If REG
PC
<
=
W;
Before Instruction
Address (LESS)
W;
Address (NLESS)
PC
W
=
=
Address (HERE)
?
=
After Instruction
If REG
PC
=
W;
Address (GREATER)
If REG
PC
=
W;
Address (NGREATER)
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 387
PIC18(L)F2X/4XK22
DAW
Decimal Adjust W Register
DECF
Decrement f
Syntax:
DAW
None
Syntax:
DECF f {,d {,a}}
Operands:
Operation:
Operands:
0 f 255
d [0,1]
a [0,1]
If [W<3:0> > 9] or [DC = 1] then
(W<3:0>) + 6 W<3:0>;
else
Operation:
(f) – 1 dest
(W<3:0>) W<3:0>;
Status Affected:
Encoding:
C, DC, N, OV, Z
0000
01da
ffff
ffff
If [W<7:4> + DC > 9] or [C = 1] then
(W<7:4>) + 6 + DC W<7:4>;
else
Description:
Decrement register ‘f’. If ‘d’ is ‘0’, the
result is stored in W. If ‘d’ is ‘1’, the
result is stored back in register ‘f’
(default).
(W<7:4>) + DC W<7:4>
Status Affected:
Encoding:
C
If ‘a’ is ‘0’, the Access Bank is selected.
If ‘a’ is ‘1’, the BSR is used to select the
GPR bank.
If ‘a’ is ‘0’ and the extended instruction
set is enabled, this instruction operates
in Indexed Literal Offset Addressing
mode whenever f 95 (5Fh). See
Section 25.2.3 “Byte-Oriented and
Bit-Oriented Instructions in Indexed
Literal Offset Mode” for details.
0000
0000
0000
0111
Description:
DAW adjusts the eight-bit value in W,
resulting from the earlier addition of two
variables (each in packed BCD format)
and produces a correct packed BCD
result.
Words:
Cycles:
1
1
Q Cycle Activity:
Q1
Words:
Cycles:
1
1
Q2
Q3
Q4
Decode
Read
register W
Process
Data
Write
W
Q Cycle Activity:
Q1
Q2
Q3
Q4
Example1:
Decode
Read
register ‘f’
Process
Data
Write to
destination
DAW
Before Instruction
W
C
DC
=
=
=
A5h
0
0
Example:
DECF
CNT,
1, 0
Before Instruction
After Instruction
CNT
Z
After Instruction
=
01h
0
=
W
=
05h
1
0
C
DC
=
=
CNT
Z
=
=
00h
1
Example 2:
Before Instruction
W
=
CEh
C
DC
=
=
0
0
After Instruction
W
=
34h
C
DC
=
=
1
0
DS41412A-page 388
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
DECFSZ
Decrement f, skip if 0
DCFSNZ
Decrement f, skip if not 0
Syntax:
DECFSZ f {,d {,a}}
Syntax:
DCFSNZ f {,d {,a}}
Operands:
0 f 255
d [0,1]
a [0,1]
Operands:
0 f 255
d [0,1]
a [0,1]
Operation:
(f) – 1 dest,
Operation:
(f) – 1 dest,
skip if result = 0
skip if result 0
Status Affected:
Encoding:
None
Status Affected:
Encoding:
None
0010
11da
ffff
ffff
0100
11da
ffff
ffff
Description:
The contents of register ‘f’ are
Description:
The contents of register ‘f’ are
decremented. If ‘d’ is ‘0’, the result is
placed in W. If ‘d’ is ‘1’, the result is
placed back in register ‘f’ (default).
If the result is ‘0’, the next instruction,
which is already fetched, is discarded
and a NOPis executed instead, making
it a two-cycle instruction.
decremented. If ‘d’ is ‘0’, the result is
placed in W. If ‘d’ is ‘1’, the result is
placed back in register ‘f’ (default).
If the result is not ‘0’, the next
instruction, which is already fetched, is
discarded and a NOPis executed
instead, making it a two-cycle
If ‘a’ is ‘0’, the Access Bank is selected.
If ‘a’ is ‘1’, the BSR is used to select the
GPR bank.
If ‘a’ is ‘0’ and the extended instruction
set is enabled, this instruction operates
in Indexed Literal Offset Addressing
mode whenever f 95 (5Fh). See
Section 25.2.3 “Byte-Oriented and
Bit-Oriented Instructions in Indexed
Literal Offset Mode” for details.
instruction.
If ‘a’ is ‘0’, the Access Bank is selected.
If ‘a’ is ‘1’, the BSR is used to select the
GPR bank.
If ‘a’ is ‘0’ and the extended instruction
set is enabled, this instruction operates
in Indexed Literal Offset Addressing
mode whenever f 95 (5Fh). See
Section 25.2.3 “Byte-Oriented and
Bit-Oriented Instructions in Indexed
Literal Offset Mode” for details.
Words:
Cycles:
1
Words:
Cycles:
1
1(2)
Note: 3 cycles if skip and followed
by a 2-word instruction.
1(2)
Note: 3 cycles if skip and followed
by a 2-word instruction.
Q Cycle Activity:
Q1
Q Cycle Activity:
Q1
Q2
Q3
Q4
Q2
Q3
Q4
Decode
Read
register ‘f’
Process
Data
Write to
destination
Decode
Read
Process
Data
Write to
destination
register ‘f’
If skip:
Q1
If skip:
Q1
Q2
Q3
Q4
Q2
Q3
Q4
No
No
No
No
operation
operation
operation
operation
No
No
No
No
operation
operation
operation
operation
If skip and followed by 2-word instruction:
If skip and followed by 2-word instruction:
Q1
Q2
Q3
Q4
Q1
Q2
Q3
Q4
No
No
No
No
operation
operation
operation
operation
No
No
No
No
operation
operation
operation
operation
No
No
No
No
operation
operation
operation
operation
No
No
No
No
operation
operation
operation
operation
Example:
HERE
DECFSZ
GOTO
CNT, 1, 1
LOOP
Example:
HERE
ZERO
NZERO
DCFSNZ TEMP, 1, 0
:
:
CONTINUE
Before Instruction
PC
After Instruction
Before Instruction
TEMP
After Instruction
=
Address (HERE)
=
?
CNT
=
CNT - 1
0;
If CNT
=
=
=
TEMP
If TEMP
PC
If TEMP
PC
=
=
=
=
TEMP – 1,
0;
Address (ZERO)
0;
Address (NZERO)
PC
Address (CONTINUE)
0;
If CNT
PC
Address (HERE + 2)
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 389
PIC18(L)F2X/4XK22
GOTO
Unconditional Branch
INCF
Increment f
Syntax:
GOTO
k
Syntax:
INCF f {,d {,a}}
Operands:
Operation:
Status Affected:
0 k 1048575
k PC<20:1>
None
Operands:
0 f 255
d [0,1]
a [0,1]
Operation:
(f) + 1 dest
Encoding:
1st word (k<7:0>)
2nd word(k<19:8>)
Status Affected:
Encoding:
C, DC, N, OV, Z
1110
1111
1111
kkk
k kkk
kkkk
kkkk
kkkk
7
0
8
k
0010
10da
ffff
ffff
19
Description:
GOTOallows an unconditional branch
anywhere within entire
2-Mbyte memory range. The 20-bit
value ‘k’ is loaded into PC<20:1>.
GOTOis always a two-cycle
instruction.
Description:
The contents of register ‘f’ are
incremented. If ‘d’ is ‘0’, the result is
placed in W. If ‘d’ is ‘1’, the result is
placed back in register ‘f’ (default).
If ‘a’ is ‘0’, the Access Bank is selected.
If ‘a’ is ‘1’, the BSR is used to select the
GPR bank.
If ‘a’ is ‘0’ and the extended instruction
set is enabled, this instruction operates
in Indexed Literal Offset Addressing
mode whenever f 95 (5Fh). See
Section 25.2.3 “Byte-Oriented and
Bit-Oriented Instructions in Indexed
Literal Offset Mode” for details.
Words:
Cycles:
2
2
Q Cycle Activity:
Q1
Q2
Q3
Q4
Decode
Read literal
‘k’<7:0>,
No
operation
Read literal
‘k’<19:8>,
Write to PC
Words:
Cycles:
1
1
No
operation
No
No
No
operation
operation
operation
Q Cycle Activity:
Q1
Example:
GOTO THERE
Q2
Q3
Q4
Decode
Read
register ‘f’
Process
Data
Write to
destination
After Instruction
PC
=
Address (THERE)
Example:
INCF
CNT, 1, 0
Before Instruction
CNT
Z
=
FFh
0
=
=
=
C
?
DC
?
After Instruction
CNT
Z
=
00h
1
=
=
=
C
1
DC
1
DS41412A-page 390
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
INFSNZ
Increment f, skip if not 0
INCFSZ
Increment f, skip if 0
Syntax:
INFSNZ f {,d {,a}}
Syntax:
INCFSZ f {,d {,a}}
Operands:
0 f 255
d [0,1]
a [0,1]
Operands:
0 f 255
d [0,1]
a [0,1]
Operation:
(f) + 1 dest,
skip if result 0
Operation:
(f) + 1 dest,
skip if result = 0
Status Affected:
Encoding:
None
Status Affected:
Encoding:
None
0100
10da
ffff
ffff
0011
11da
ffff
ffff
Description:
The contents of register ‘f’ are
Description:
The contents of register ‘f’ are
incremented. If ‘d’ is ‘0’, the result is
placed in W. If ‘d’ is ‘1’, the result is
placed back in register ‘f’ (default).
If the result is not ‘0’, the next
instruction, which is already fetched, is
discarded and a NOPis executed
instead, making it a two-cycle
incremented. If ‘d’ is ‘0’, the result is
placed in W. If ‘d’ is ‘1’, the result is
placed back in register ‘f’ (default).
If the result is ‘0’, the next instruction,
which is already fetched, is discarded
and a NOPis executed instead, making
it a two-cycle instruction.
If ‘a’ is ‘0’, the Access Bank is selected.
If ‘a’ is ‘1’, the BSR is used to select the
GPR bank.
instruction.
If ‘a’ is ‘0’, the Access Bank is selected.
If ‘a’ is ‘1’, the BSR is used to select the
GPR bank.
If ‘a’ is ‘0’ and the extended instruction
set is enabled, this instruction operates
in Indexed Literal Offset Addressing
mode whenever f 95 (5Fh). See
Section 25.2.3 “Byte-Oriented and
Bit-Oriented Instructions in Indexed
Literal Offset Mode” for details.
If ‘a’ is ‘0’ and the extended instruction
set is enabled, this instruction operates
in Indexed Literal Offset Addressing
mode whenever f 95 (5Fh). See
Section 25.2.3 “Byte-Oriented and
Bit-Oriented Instructions in Indexed
Literal Offset Mode” for details.
Words:
Cycles:
1
Words:
Cycles:
1
1(2)
1(2)
Note: 3 cycles if skip and followed
by a 2-word instruction.
Note: 3 cycles if skip and followed
by a 2-word instruction.
Q Cycle Activity:
Q1
Q Cycle Activity:
Q1
Q2
Q3
Q4
Q2
Q3
Q4
Decode
Read
register ‘f’
Process
Data
Write to
destination
Decode
Read
register ‘f’
Process
Data
Write to
destination
If skip:
Q1
If skip:
Q1
Q2
Q3
Q4
Q2
Q3
Q4
No
No
No
No
No
No
No
No
operation
operation
operation
operation
operation
operation
operation
operation
If skip and followed by 2-word instruction:
If skip and followed by 2-word instruction:
Q1
Q2
Q3
Q4
Q1
Q2
Q3
Q4
No
No
No
No
No
No
No
No
operation
operation
operation
operation
operation
operation
operation
operation
No
No
No
No
No
No
No
No
operation
operation
operation
operation
operation
operation
operation
operation
Example:
HERE
NZERO
ZERO
INCFSZ
:
:
CNT, 1, 0
Example:
HERE
ZERO
NZERO
INFSNZ REG, 1, 0
Before Instruction
PC
After Instruction
Before Instruction
PC
After Instruction
=
Address (HERE)
=
Address (HERE)
REG
If REG
PC
If REG
PC
=
REG + 1
0;
CNT
If CNT
PC
If CNT
PC
=
CNT + 1
=
=
=
=
=
=
0;
Address (ZERO)
0;
Address (NZERO)
Address (NZERO)
0;
Address (ZERO)
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 391
PIC18(L)F2X/4XK22
IORLW
Inclusive OR literal with W
IORWF
Inclusive OR W with f
Syntax:
IORLW
k
Syntax:
IORWF f {,d {,a}}
Operands:
Operation:
Status Affected:
Encoding:
Description:
0 k 255
(W) .OR. k W
N, Z
Operands:
0 f 255
d [0,1]
a [0,1]
Operation:
(W) .OR. (f) dest
0000
1001
kkkk
kkkk
Status Affected:
Encoding:
N, Z
The contents of W are ORed with the
eight-bit literal ‘k’. The result is placed in
W.
0001
00da
ffff
ffff
Description:
Inclusive OR W with register ‘f’. If ‘d’ is
‘0’, the result is placed in W. If ‘d’ is ‘1’,
the result is placed back in register ‘f’
(default).
Words:
Cycles:
1
1
If ‘a’ is ‘0’, the Access Bank is selected.
If ‘a’ is ‘1’, the BSR is used to select the
GPR bank.
If ‘a’ is ‘0’ and the extended instruction
set is enabled, this instruction operates
in Indexed Literal Offset Addressing
mode whenever f 95 (5Fh). See
Section 25.2.3 “Byte-Oriented and
Bit-Oriented Instructions in Indexed
Literal Offset Mode” for details.
Q Cycle Activity:
Q1
Q2
Q3
Q4
Decode
Read
literal ‘k’
Process
Data
Write to W
Example:
IORLW
35h
Before Instruction
W
=
9Ah
BFh
After Instruction
Words:
Cycles:
1
1
W
=
Q Cycle Activity:
Q1
Q2
Q3
Q4
Decode
Read
register ‘f’
Process
Data
Write to
destination
Example:
IORWF RESULT, 0, 1
Before Instruction
RESULT =
13h
91h
W
=
After Instruction
RESULT =
13h
93h
W
=
DS41412A-page 392
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
LFSR
Load FSR
MOVF
Move f
Syntax:
LFSR f, k
Syntax:
MOVF f {,d {,a}}
Operands:
0 f 2
0 k 4095
Operands:
0 f 255
d [0,1]
a [0,1]
Operation:
k FSRf
Operation:
f dest
Status Affected:
Encoding:
None
Status Affected:
Encoding:
N, Z
1110
1111
1110
0000
00ff
k kkk
k kkk
11
kkkk
0101
00da
ffff
ffff
7
Description:
The 12-bit literal ‘k’ is loaded into the
File Select Register pointed to by ‘f’.
Description:
The contents of register ‘f’ are moved to
a destination dependent upon the
status of ‘d’. If ‘d’ is ‘0’, the result is
placed in W. If ‘d’ is ‘1’, the result is
placed back in register ‘f’ (default).
Location ‘f’ can be anywhere in the
256-byte bank.
If ‘a’ is ‘0’, the Access Bank is selected.
If ‘a’ is ‘1’, the BSR is used to select the
GPR bank.
If ‘a’ is ‘0’ and the extended instruction
set is enabled, this instruction operates
in Indexed Literal Offset Addressing
mode whenever f 95 (5Fh). See
Section 25.2.3 “Byte-Oriented and
Bit-Oriented Instructions in Indexed
Literal Offset Mode” for details.
Words:
Cycles:
2
2
Q Cycle Activity:
Q1
Q2
Q3
Q4
Decode
Read literal
‘k’ MSB
Process
Data
Write
literal ‘k’
MSB to
FSRfH
Decode
Read literal
‘k’ LSB
Process
Data
Write literal
‘k’ to FSRfL
Example:
LFSR 2, 3ABh
After Instruction
Words:
Cycles:
1
1
FSR2H
FSR2L
=
=
03h
ABh
Q Cycle Activity:
Q1
Q2
Q3
Q4
Decode
Read
register ‘f’
Process
Data
Write W
Example:
MOVF
REG, 0, 0
Before Instruction
REG
W
=
=
22h
FFh
After Instruction
REG
W
=
=
22h
22h
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 393
PIC18(L)F2X/4XK22
MOVFF
Move f to f
MOVLB
Move literal to low nibble in BSR
Syntax:
MOVFF f ,f
Syntax:
MOVLW k
s
d
Operands:
0 f 4095
Operands:
Operation:
Status Affected:
Encoding:
Description:
0 k 255
k BSR
None
s
0 f 4095
d
Operation:
(f ) f
s
d
Status Affected:
None
0000
0001
kkkk
kkkk
Encoding:
1st word (source)
2nd word (destin.)
The eight-bit literal ‘k’ is loaded into the
Bank Select Register (BSR). The value
of BSR<7:4> always remains ‘0’,
1100
1111
ffff
ffff
ffff
ffff
ffffs
ffffd
Description:
The contents of source register ‘f ’ are
regardless of the value of k :k .
s
7 4
moved to destination register ‘f ’.
d
Words:
Cycles:
1
1
Location of source ‘f ’ can be anywhere
s
in the 4096-byte data space (000h to
FFFh) and location of destination ‘f ’
can also be anywhere from 000h to
FFFh.
Either source or destination can be W
(a useful special situation).
d
Q Cycle Activity:
Q1
Q2
Q3
Q4
Decode
Read
literal ‘k’
Process
Data
Write literal
‘k’ to BSR
MOVFFis particularly useful for
transferring a data memory location to a
peripheral register (such as the transmit
buffer or an I/O port).
The MOVFFinstruction cannot use the
PCL, TOSU, TOSH or TOSL as the
destination register.
Example:
MOVLB
5
Before Instruction
BSR Register =
After Instruction
BSR Register =
02h
05h
Words:
Cycles:
2
2 (3)
Q Cycle Activity:
Q1
Q2
Q3
Q4
Decode
Read
register ‘f’
(src)
Process
Data
No
operation
Decode
No
operation
No
operation
Write
register ‘f’
(dest)
No dummy
read
Example:
MOVFF
REG1, REG2
Before Instruction
REG1
REG2
=
=
33h
11h
After Instruction
REG1
REG2
=
=
33h
33h
DS41412A-page 394
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
MOVLW
Move literal to W
MOVWF
Move W to f
Syntax:
MOVLW
k
Syntax:
MOVWF f {,a}
Operands:
Operation:
Status Affected:
Encoding:
Description:
Words:
0 k 255
k W
None
Operands:
0 f 255
a [0,1]
Operation:
(W) f
Status Affected:
Encoding:
None
0000
1110
kkkk
kkkk
0110
111a
ffff
ffff
The eight-bit literal ‘k’ is loaded into W.
Description:
Move data from W to register ‘f’.
Location ‘f’ can be anywhere in the
256-byte bank.
1
1
Cycles:
If ‘a’ is ‘0’, the Access Bank is selected.
If ‘a’ is ‘1’, the BSR is used to select the
GPR bank.
If ‘a’ is ‘0’ and the extended instruction
set is enabled, this instruction operates
in Indexed Literal Offset Addressing
mode whenever f 95 (5Fh). See
Section 25.2.3 “Byte-Oriented and
Bit-Oriented Instructions in Indexed
Literal Offset Mode” for details.
Q Cycle Activity:
Q1
Q2
Q3
Q4
Decode
Read
literal ‘k’
Process
Data
Write to W
Example:
MOVLW
5Ah
After Instruction
W
=
5Ah
Words:
Cycles:
1
1
Q Cycle Activity:
Q1
Q2
Q3
Q4
Decode
Read
register ‘f’
Process
Data
Write
register ‘f’
Example:
MOVWF
REG, 0
Before Instruction
W
REG
=
=
4Fh
FFh
After Instruction
W
REG
=
=
4Fh
4Fh
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 395
PIC18(L)F2X/4XK22
MULLW
Multiply literal with W
MULWF
Multiply W with f
Syntax:
MULLW
k
Syntax:
MULWF f {,a}
Operands:
Operation:
Status Affected:
Encoding:
Description:
0 k 255
Operands:
0 f 255
a [0,1]
(W) x k PRODH:PRODL
Operation:
(W) x (f) PRODH:PRODL
None
Status Affected:
Encoding:
None
0000
1101
kkkk
kkkk
0000
001a
ffff
ffff
An unsigned multiplication is carried
out between the contents of W and the
8-bit literal ‘k’. The 16-bit result is
placed in the PRODH:PRODL register
pair. PRODH contains the high byte.
W is unchanged.
None of the Status flags are affected.
Note that neither overflow nor carry is
possible in this operation. A zero result
is possible but not detected.
Description:
An unsigned multiplication is carried
out between the contents of W and the
register file location ‘f’. The 16-bit
result is stored in the PRODH:PRODL
register pair. PRODH contains the
high byte. Both W and ‘f’ are
unchanged.
None of the Status flags are affected.
Note that neither overflow nor carry is
possible in this operation. A zero
result is possible but not detected.
If ‘a’ is ‘0’, the Access Bank is
selected. If ‘a’ is ‘1’, the BSR is used
to select the GPR bank.
If ‘a’ is ‘0’ and the extended instruction
set is enabled, this instruction
operates in Indexed Literal Offset
Addressing mode whenever
Words:
Cycles:
1
1
Q Cycle Activity:
Q1
Q2
Q3
Q4
Decode
Read
literal ‘k’
Process
Data
Write
registers
PRODH:
PRODL
f 95 (5Fh). See Section 25.2.3
“Byte-Oriented and Bit-Oriented
Instructions in Indexed Literal Offset
Mode” for details.
Example:
MULLW
0C4h
Before Instruction
Words:
Cycles:
1
1
W
PRODH
PRODL
=
=
=
E2h
?
?
Q Cycle Activity:
Q1
After Instruction
W
Q2
Q3
Q4
=
=
=
E2h
ADh
08h
Decode
Read
register ‘f’
Process
Data
Write
PRODH
PRODL
registers
PRODH:
PRODL
Example:
MULWF
REG, 1
Before Instruction
W
=
C4h
REG
PRODH
PRODL
=
=
=
B5h
?
?
After Instruction
W
=
C4h
REG
PRODH
PRODL
=
=
=
B5h
8Ah
94h
DS41412A-page 396
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
NEGF
Negate f
NOP
No Operation
Syntax:
NEGF f {,a}
Syntax:
NOP
Operands:
0 f 255
a [0,1]
Operands:
Operation:
Status Affected:
Encoding:
None
No operation
None
Operation:
( f ) + 1 f
Status Affected:
Encoding:
N, OV, C, DC, Z
0000
1111
0000
xxxx
0000
xxxx
0000
xxxx
0110
110a
ffff
ffff
Description:
Location ‘f’ is negated using two’s
complement. The result is placed in the
data memory location ‘f’.
If ‘a’ is ‘0’, the Access Bank is selected.
If ‘a’ is ‘1’, the BSR is used to select the
GPR bank.
If ‘a’ is ‘0’ and the extended instruction
set is enabled, this instruction operates
in Indexed Literal Offset Addressing
mode whenever f 95 (5Fh). See
Section 25.2.3 “Byte-Oriented and
Bit-Oriented Instructions in Indexed
Literal Offset Mode” for details.
Description:
Words:
No operation.
1
1
Cycles:
Q Cycle Activity:
Q1
Q2
Q3
No
Q4
Decode
No
operation
No
operation
operation
Example:
None.
Words:
Cycles:
1
1
Q Cycle Activity:
Q1
Q2
Q3
Q4
Decode
Read
register ‘f’
Process
Data
Write
register ‘f’
Example:
NEGF
REG, 1
Before Instruction
REG
After Instruction
REG
=
0011 1010 [3Ah]
1100 0110 [C6h]
=
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 397
PIC18(L)F2X/4XK22
POP
Pop Top of Return Stack
PUSH
Push Top of Return Stack
Syntax:
POP
Syntax:
PUSH
Operands:
Operation:
Status Affected:
Encoding:
Description:
None
Operands:
Operation:
Status Affected:
Encoding:
Description:
None
(TOS) bit bucket
(PC + 2) TOS
None
None
0000
0000
0000
0110
0000
0000
0000
0101
The TOS value is pulled off the return
stack and is discarded. The TOS value
then becomes the previous value that
was pushed onto the return stack.
This instruction is provided to enable
the user to properly manage the return
stack to incorporate a software stack.
The PC + 2 is pushed onto the top of
the return stack. The previous TOS
value is pushed down on the stack.
This instruction allows implementing a
software stack by modifying TOS and
then pushing it onto the return stack.
Words:
Cycles:
1
1
Words:
Cycles:
1
1
Q Cycle Activity:
Q1
Q Cycle Activity:
Q1
Q2
Q3
Q4
Q2
Q3
Q4
Decode
PUSH
No
No
Decode
No
operation
POP TOS
value
No
operation
PC + 2 onto
return stack
operation
operation
Example:
POP
Example:
PUSH
GOTO
NEW
Before Instruction
Before Instruction
TOS
Stack (1 level down)
TOS
PC
=
=
345Ah
0124h
=
=
0031A2h
014332h
After Instruction
After Instruction
PC
=
=
=
0126h
0126h
345Ah
TOS
TOS
PC
=
=
014332h
NEW
Stack (1 level down)
DS41412A-page 398
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
RCALL
Relative Call
RESET
Reset
Syntax:
RCALL
n
Syntax:
RESET
None
Operands:
Operation:
-1024 n 1023
Operands:
Operation:
(PC) + 2 TOS,
(PC) + 2 + 2n PC
Reset all registers and flags that are
affected by a MCLR Reset.
Status Affected:
Encoding:
None
Status Affected:
Encoding:
All
1101
1nnn
nnnn
nnnn
0000
0000
1111
1111
Description:
Subroutine call with a jump up to 1K
from the current location. First, return
address (PC + 2) is pushed onto the
stack. Then, add the 2’s complement
number ‘2n’ to the PC. Since the PC will
have incremented to fetch the next
instruction, the new address will be
PC + 2 + 2n. This instruction is a
two-cycle instruction.
Description:
This instruction provides a way to
execute a MCLR Reset by software.
Words:
Cycles:
1
1
Q Cycle Activity:
Q1
Q2
Q3
Q4
Decode
Start
No
No
Reset
operation
operation
Words:
Cycles:
1
2
Example:
RESET
Q Cycle Activity:
Q1
After Instruction
Registers =
Q2
Q3
Q4
Reset Value
Reset Value
Flags*
=
Decode
Read literal
‘n’
Process
Data
Write to PC
PUSH PCto
stack
No
No
No
No
operation
operation
operation
operation
Example:
HERE
RCALL Jump
Before Instruction
PC
After Instruction
PC
TOS =
=
Address (HERE)
=
Address (Jump)
Address (HERE + 2)
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 399
PIC18(L)F2X/4XK22
RETFIE
Return from Interrupt
RETLW
Return literal to W
Syntax:
RETFIE {s}
Syntax:
RETLW k
Operands:
Operation:
s [0,1]
Operands:
Operation:
0 k 255
(TOS) PC,
k W,
1 GIE/GIEH or PEIE/GIEL,
if s = 1
(TOS) PC,
PCLATU, PCLATH are unchanged
(WS) W,
(STATUSS) Status,
(BSRS) BSR,
Status Affected:
Encoding:
None
0000
1100
kkkk
kkkk
PCLATU, PCLATH are unchanged.
Description:
W is loaded with the eight-bit literal ‘k’.
The program counter is loaded from the
top of the stack (the return address).
The high address latch (PCLATH)
remains unchanged.
Status Affected:
Encoding:
GIE/GIEH, PEIE/GIEL.
0000
0000
0001
000s
Description:
Return from interrupt. Stack is popped
and Top-of-Stack (TOS) is loaded into
the PC. Interrupts are enabled by
setting either the high or low priority
global interrupt enable bit. If ‘s’ = 1, the
contents of the shadow registers, WS,
STATUSS and BSRS, are loaded into
their corresponding registers, W,
Words:
Cycles:
1
2
Q Cycle Activity:
Q1
Q2
Q3
Q4
Decode
Read
literal ‘k’
Process
Data
POP PC
from stack,
Write to W
Status and BSR. If ‘s’ = 0, no update of
these registers occurs (default).
No
operation
No
operation
No
operation
No
operation
Words:
Cycles:
1
2
Q Cycle Activity:
Q1
Example:
Q2
Q3
Q4
CALL TABLE ; W contains table
; offset value
Decode
No
operation
No
operation
POP PC
from stack
; W now has
; table value
Set GIEH or
GIEL
:
No
operation
No
operation
No
operation
No
operation
TABLE
ADDWF PCL ; W = offset
RETLW k0
RETLW k1
; Begin table
;
Example:
RETFIE
1
:
:
After Interrupt
PC
W
=
=
=
=
=
TOS
WS
RETLW kn
; End of table
BSR
Status
GIE/GIEH, PEIE/GIEL
BSRS
STATUSS
1
Before Instruction
W
=
07h
After Instruction
W
=
value of kn
DS41412A-page 400
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
RETURN
Return from Subroutine
RLCF
Rotate Left f through Carry
Syntax:
RETURN {s}
Syntax:
RLCF f {,d {,a}}
Operands:
Operation:
s [0,1]
Operands:
0 f 255
d [0,1]
a [0,1]
(TOS) PC,
if s = 1
(WS) W,
Operation:
(f<n>) dest<n + 1>,
(f<7>) C,
(C) dest<0>
(STATUSS) Status,
(BSRS) BSR,
PCLATU, PCLATH are unchanged
Status Affected:
Encoding:
C, N, Z
Status Affected:
Encoding:
None
0011
01da
ffff
ffff
0000
0000
0001
001s
Description:
The contents of register ‘f’ are rotated
one bit to the left through the CARRY
flag. If ‘d’ is ‘0’, the result is placed in
W. If ‘d’ is ‘1’, the result is stored back
in register ‘f’ (default).
If ‘a’ is ‘0’, the Access Bank is
selected. If ‘a’ is ‘1’, the BSR is used to
select the GPR bank.
If ‘a’ is ‘0’ and the extended instruction
set is enabled, this instruction
operates in Indexed Literal Offset
Addressing mode whenever
f 95 (5Fh). See Section 25.2.3
“Byte-Oriented and Bit-Oriented
Instructions in Indexed Literal Offset
Mode” for details.
Description:
Return from subroutine. The stack is
popped and the top of the stack (TOS)
is loaded into the program counter. If
‘s’= 1, the contents of the shadow
registers, WS, STATUSS and BSRS,
are loaded into their corresponding
registers, W, Status and BSR. If
‘s’ = 0, no update of these registers
occurs (default).
Words:
Cycles:
1
2
Q Cycle Activity:
Q1
Q2
Q3
Q4
Decode
No
operation
Process
Data
POP PC
from stack
register f
C
No
No
No
No
Words:
Cycles:
1
1
operation
operation
operation
operation
Q Cycle Activity:
Q1
Example:
RETURN
Q2
Q3
Q4
After Instruction:
PC = TOS
Decode
Read
register ‘f’
Process
Data
Write to
destination
Example:
RLCF
REG, 0, 0
Before Instruction
REG
C
=
=
1110 0110
0
After Instruction
REG
=
1110 0110
W
C
=
=
1100 1100
1
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 401
PIC18(L)F2X/4XK22
RLNCF
Rotate Left f (No Carry)
RRCF
Rotate Right f through Carry
Syntax:
RLNCF f {,d {,a}}
Syntax:
RRCF f {,d {,a}}
Operands:
0 f 255
d [0,1]
a [0,1]
Operands:
0 f 255
d [0,1]
a [0,1]
Operation:
(f<n>) dest<n + 1>,
(f<7>) dest<0>
Operation:
(f<n>) dest<n – 1>,
(f<0>) C,
(C) dest<7>
Status Affected:
Encoding:
N, Z
Status Affected:
Encoding:
C, N, Z
0100
01da
ffff
ffff
0011
00da
ffff
ffff
Description:
The contents of register ‘f’ are rotated
one bit to the left. If ‘d’ is ‘0’, the result
is placed in W. If ‘d’ is ‘1’, the result is
stored back in register ‘f’ (default).
If ‘a’ is ‘0’, the Access Bank is selected.
If ‘a’ is ‘1’, the BSR is used to select the
GPR bank.
If ‘a’ is ‘0’ and the extended instruction
set is enabled, this instruction operates
in Indexed Literal Offset Addressing
mode whenever f 95 (5Fh). See
Section 25.2.3 “Byte-Oriented and
Bit-Oriented Instructions in Indexed
Literal Offset Mode” for details.
Description:
The contents of register ‘f’ are rotated
one bit to the right through the CARRY
flag. If ‘d’ is ‘0’, the result is placed in W.
If ‘d’ is ‘1’, the result is placed back in
register ‘f’ (default).
If ‘a’ is ‘0’, the Access Bank is selected.
If ‘a’ is ‘1’, the BSR is used to select the
GPR bank.
If ‘a’ is ‘0’ and the extended instruction
set is enabled, this instruction operates
in Indexed Literal Offset Addressing
mode whenever f 95 (5Fh). See
Section 25.2.3 “Byte-Oriented and
Bit-Oriented Instructions in Indexed
Literal Offset Mode” for details.
register f
register f
C
Words:
Cycles:
1
1
Words:
Cycles:
1
1
Q Cycle Activity:
Q1
Q2
Q3
Q4
Q Cycle Activity:
Q1
Decode
Read
register ‘f’
Process
Data
Write to
destination
Q2
Q3
Q4
Decode
Read
register ‘f’
Process
Data
Write to
destination
Example:
RLNCF
REG, 1, 0
Before Instruction
REG
After Instruction
Example:
RRCF
REG, 0, 0
=
1010 1011
0101 0111
Before Instruction
REG
=
REG
C
=
=
1110 0110
0
After Instruction
REG
=
1110 0110
W
C
=
=
0111 0011
0
DS41412A-page 402
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
RRNCF
Rotate Right f (No Carry)
SETF
Set f
Syntax:
RRNCF f {,d {,a}}
Syntax:
SETF f {,a}
Operands:
0 f 255
d [0,1]
a [0,1]
Operands:
0 f 255
a [0,1]
Operation:
FFh f
Operation:
(f<n>) dest<n – 1>,
(f<0>) dest<7>
Status Affected:
Encoding:
None
0110
100a
ffff
ffff
Status Affected:
Encoding:
N, Z
Description:
The contents of the specified register
are set to FFh.
0100
00da
ffff
ffff
Description:
The contents of register ‘f’ are rotated
one bit to the right. If ‘d’ is ‘0’, the result
is placed in W. If ‘d’ is ‘1’, the result is
placed back in register ‘f’ (default).
If ‘a’ is ‘0’, the Access Bank will be
selected (default), overriding the BSR
value. If ‘a’ is ‘1’, then the bank will be
selected as per the BSR value.
If ‘a’ is ‘0’ and the extended instruction
set is enabled, this instruction operates
in Indexed Literal Offset Addressing
mode whenever f 95 (5Fh). See
Section 25.2.3 “Byte-Oriented and
Bit-Oriented Instructions in Indexed
Literal Offset Mode” for details.
If ‘a’ is ‘0’, the Access Bank is selected.
If ‘a’ is ‘1’, the BSR is used to select the
GPR bank.
If ‘a’ is ‘0’ and the extended instruction
set is enabled, this instruction operates
in Indexed Literal Offset Addressing
mode whenever f 95 (5Fh). See
Section 25.2.3 “Byte-Oriented and
Bit-Oriented Instructions in Indexed
Literal Offset Mode” for details.
Words:
Cycles:
1
1
Q Cycle Activity:
Q1
Q2
Q3
Q4
register f
Decode
Read
register ‘f’
Process
Data
Write
register ‘f’
Words:
Cycles:
1
1
Example:
SETF
REG, 1
Q Cycle Activity:
Q1
Before Instruction
REG
After Instruction
REG
=
=
5Ah
FFh
Q2
Q3
Q4
Decode
Read
register ‘f’
Process
Data
Write to
destination
Example 1:
RRNCF
REG, 1, 0
Before Instruction
REG
After Instruction
REG
=
1101 0111
1110 1011
RRNCF REG, 0, 0
=
Example 2:
Before Instruction
W
REG
=
=
?
1101 0111
After Instruction
W
REG
=
=
1110 1011
1101 0111
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 403
PIC18(L)F2X/4XK22
SLEEP
Enter Sleep mode
SUBFWB
Subtract f from W with borrow
Syntax:
SLEEP
None
Syntax:
SUBFWB f {,d {,a}}
Operands:
Operation:
Operands:
0 f 255
d [0,1]
a [0,1]
00h WDT,
0 WDT postscaler,
1 TO,
Operation:
(W) – (f) – (C) dest
0 PD
Status Affected:
Encoding:
N, OV, C, DC, Z
Status Affected:
Encoding:
TO, PD
0101
01da
ffff
ffff
0000
0000
0000
0011
Description:
Subtract register ‘f’ and CARRY flag
(borrow) from W (2’s complement
method). If ‘d’ is ‘0’, the result is stored
in W. If ‘d’ is ‘1’, the result is stored in
register ‘f’ (default).
Description:
The Power-down Status bit (PD) is
cleared. The Time-out Status bit (TO)
is set. Watchdog Timer and its
postscaler are cleared.
The processor is put into Sleep mode
with the oscillator stopped.
If ‘a’ is ‘0’, the Access Bank is
selected. If ‘a’ is ‘1’, the BSR is used
to select the GPR bank.
If ‘a’ is ‘0’ and the extended instruction
set is enabled, this instruction
operates in Indexed Literal Offset
Addressing mode whenever
f 95 (5Fh). See Section 25.2.3
“Byte-Oriented and Bit-Oriented
Instructions in Indexed Literal Offset
Mode” for details.
Words:
Cycles:
1
1
Q Cycle Activity:
Q1
Q2
Q3
Q4
Decode
No
operation
Process
Data
Go to
Sleep
Example:
SLEEP
Words:
Cycles:
1
1
Before Instruction
TO
PD
=
=
?
?
Q Cycle Activity:
Q1
Q2
Q3
Q4
After Instruction
Decode
Read
register ‘f’
Process
Data
Write to
destination
TO
PD
=
=
1 †
0
Example 1:
SUBFWB
REG, 1, 0
†
If WDT causes wake-up, this bit is cleared.
Before Instruction
REG
W
C
=
=
=
3
2
1
After Instruction
REG
W
C
=
FF
2
=
=
=
=
0
Z
0
1
N
; result is negative
Example 2:
Before Instruction
SUBFWB
REG, 0, 0
REG
W
=
=
=
2
5
1
C
After Instruction
REG
W
C
=
2
3
1
0
=
=
=
=
Z
N
0
; result is positive
Example 3:
SUBFWB
REG, 1, 0
Before Instruction
REG
W
=
=
=
1
2
0
C
After Instruction
REG
W
C
=
0
2
1
1
0
=
=
=
=
Z
; result is zero
N
DS41412A-page 404
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
SUBLW
Subtract W from literal
SUBWF
Subtract W from f
Syntax:
SUBLW
k
Syntax:
SUBWF f {,d {,a}}
Operands:
Operation:
Status Affected:
Encoding:
Description
0 k 255
Operands:
0 f 255
d [0,1]
a [0,1]
k – (W) W
N, OV, C, DC, Z
Operation:
(f) – (W) dest
0000
1000
kkkk
kkkk
Status Affected:
Encoding:
N, OV, C, DC, Z
W is subtracted from the eight-bit
literal ‘k’. The result is placed in W.
0101
11da
ffff
ffff
Description:
Subtract W from register ‘f’ (2’s
complement method). If ‘d’ is ‘0’, the
result is stored in W. If ‘d’ is ‘1’, the
result is stored back in register ‘f’
(default).
If ‘a’ is ‘0’, the Access Bank is
selected. If ‘a’ is ‘1’, the BSR is used
to select the GPR bank.
Words:
1
1
Cycles:
Q Cycle Activity:
Q1
Q2
Q3
Q4
Decode
Read
literal ‘k’
Process
Data
Write to W
If ‘a’ is ‘0’ and the extended instruction
set is enabled, this instruction
operates in Indexed Literal Offset
Addressing mode whenever
f 95 (5Fh). See Section 25.2.3
“Byte-Oriented and Bit-Oriented
Instructions in Indexed Literal Offset
Mode” for details.
Example 1:
SUBLW 02h
Before Instruction
W
C
=
=
01h
?
After Instruction
W
C
Z
=
01h
=
=
=
1
0
0
; result is positive
N
Words:
Cycles:
1
1
Example 2:
SUBLW 02h
Before Instruction
Q Cycle Activity:
Q1
W
C
=
=
02h
?
Q2
Q3
Q4
After Instruction
Decode
Read
register ‘f’
Process
Data
Write to
destination
W
C
Z
=
00h
=
=
=
1
1
0
; result is zero
N
Example 1:
SUBWF
REG, 1, 0
Before Instruction
Example 3:
SUBLW 02h
REG
W
C
=
3
2
?
Before Instruction
=
=
W
C
=
=
03h
?
After Instruction
After Instruction
REG
W
C
=
1
2
1
0
0
W
C
Z
=
FFh ; (2’s complement)
=
=
=
=
=
=
=
0
0
1
; result is negative
; result is positive
Z
N
N
Example 2:
SUBWF
REG, 0, 0
Before Instruction
REG
W
=
=
=
2
2
?
C
After Instruction
REG
W
C
=
2
0
1
1
0
=
=
=
=
; result is zero
Z
N
Example 3:
Before Instruction
SUBWF
REG, 1, 0
REG
W
=
=
=
1
2
?
C
After Instruction
REG
W
C
=
FFh ;(2’s complement)
2
0
0
1
=
=
=
=
; result is negative
Z
N
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 405
PIC18(L)F2X/4XK22
SUBWFB
Subtract W from f with Borrow
SWAPF
Swap f
SUBWFB f {,d {,a}}
Syntax:
Syntax:
SWAPF f {,d {,a}}
Operands:
0 f 255
d [0,1]
a [0,1]
Operands:
0 f 255
d [0,1]
a [0,1]
Operation:
(f) – (W) – (C) dest
Operation:
(f<3:0>) dest<7:4>,
(f<7:4>) dest<3:0>
Status Affected:
Encoding:
N, OV, C, DC, Z
0101
10da
ffff
ffff
Status Affected:
Encoding:
None
Description:
Subtract W and the CARRY flag
0011
10da
ffff
ffff
(borrow) from register ‘f’ (2’s comple-
ment method). If ‘d’ is ‘0’, the result is
stored in W. If ‘d’ is ‘1’, the result is
stored back in register ‘f’ (default).
If ‘a’ is ‘0’, the Access Bank is selected.
If ‘a’ is ‘1’, the BSR is used to select the
GPR bank.
If ‘a’ is ‘0’ and the extended instruction
set is enabled, this instruction operates
in Indexed Literal Offset Addressing
mode whenever f 95 (5Fh). See
Section 25.2.3 “Byte-Oriented and
Bit-Oriented Instructions in Indexed
Literal Offset Mode” for details.
Description:
The upper and lower nibbles of register
‘f’ are exchanged. If ‘d’ is ‘0’, the result
is placed in W. If ‘d’ is ‘1’, the result is
placed in register ‘f’ (default).
If ‘a’ is ‘0’, the Access Bank is selected.
If ‘a’ is ‘1’, the BSR is used to select the
GPR bank.
If ‘a’ is ‘0’ and the extended instruction
set is enabled, this instruction operates
in Indexed Literal Offset Addressing
mode whenever f 95 (5Fh). See
Section 25.2.3 “Byte-Oriented and
Bit-Oriented Instructions in Indexed
Literal Offset Mode” for details.
Words:
Cycles:
1
1
Words:
1
1
Cycles:
Q Cycle Activity:
Q1
Q Cycle Activity:
Q1
Q2
Q3
Q4
Q2
Q3
Q4
Decode
Read
register ‘f’
Process
Data
Write to
destination
Decode
Read
register ‘f’
Process
Data
Write to
destination
Example 1:
SUBWFB REG, 1, 0
Before Instruction
REG
W
=
=
=
19h
0Dh
1
(0001 1001)
(0000 1101)
Example:
SWAPF
REG, 1, 0
C
Before Instruction
After Instruction
REG
=
53h
35h
REG
W
=
0Ch
0Dh
1
(0000 1100)
(0000 1101)
After Instruction
=
=
=
=
REG
=
C
Z
0
N
0
; result is positive
Example 2:
SUBWFB REG, 0, 0
Before Instruction
REG
W
=
=
=
1Bh
1Ah
0
(0001 1011)
(0001 1010)
C
After Instruction
REG
W
C
=
1Bh
00h
1
(0001 1011)
=
=
=
=
Z
1
; result is zero
N
0
Example 3:
Before Instruction
SUBWFB REG, 1, 0
REG
W
=
=
=
03h
0Eh
1
(0000 0011)
(0000 1110)
C
After Instruction
REG
=
F5h
(1111 0101)
; [2’s comp]
W
=
=
=
=
0Eh
0
0
1
(0000 1110)
C
Z
N
; result is negative
DS41412A-page 406
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
TBLRD
Table Read
TBLRD
Table Read (Continued)
Syntax:
TBLRD ( *; *+; *-; +*)
None
Example1:
TBLRD *+ ;
Operands:
Operation:
Before Instruction
TABLAT
TBLPTR
MEMORY (00A356h)
=
=
=
55h
00A356h
34h
if TBLRD *,
(Prog Mem (TBLPTR)) TABLAT;
TBLPTR – No Change;
if TBLRD *+,
(Prog Mem (TBLPTR)) TABLAT;
(TBLPTR) + 1 TBLPTR;
if TBLRD *-,
(Prog Mem (TBLPTR)) TABLAT;
(TBLPTR) – 1 TBLPTR;
if TBLRD +*,
(TBLPTR) + 1 TBLPTR;
(Prog Mem (TBLPTR)) TABLAT;
After Instruction
TABLAT
TBLPTR
=
=
34h
00A357h
Example2:
TBLRD +* ;
Before Instruction
TABLAT
TBLPTR
MEMORY (01A357h)
MEMORY (01A358h)
After Instruction
=
=
=
=
AAh
01A357h
12h
34h
TABLAT
TBLPTR
=
=
34h
01A358h
Status Affected: None
Encoding:
0000
0000
0000
10nn
nn=0 *
=1 *+
=2 *-
=3 +*
Description:
This instruction is used to read the contents
of Program Memory (P.M.). To address the
program memory, a pointer called Table
Pointer (TBLPTR) is used.
The TBLPTR (a 21-bit pointer) points to
each byte in the program memory. TBLPTR
has a 2-Mbyte address range.
TBLPTR[0] = 0: LeastSignificantByte
of Program Memory
Word
TBLPTR[0] = 1: Most Significant Byte
of Program Memory
Word
The TBLRDinstruction can modify the value
of TBLPTR as follows:
•
•
•
•
no change
post-increment
post-decrement
pre-increment
Words:
Cycles:
1
2
Q Cycle Activity:
Q1
Q2
Q3
Q4
Decode
No
No
No
operation
operation
operation
No
No operation
No
No operation
operation (Read Program operation (Write TABLAT)
Memory)
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 407
PIC18(L)F2X/4XK22
TBLWT
Table Write
TBLWT
Table Write (Continued)
Syntax:
TBLWT ( *; *+; *-; +*)
None
Example1:
TBLWT *+;
Operands:
Operation:
Before Instruction
if TBLWT*,
TABLAT
TBLPTR
HOLDING REGISTER
(00A356h)
=
=
55h
00A356h
(TABLAT) Holding Register;
TBLPTR – No Change;
if TBLWT*+,
(TABLAT) Holding Register;
(TBLPTR) + 1 TBLPTR;
if TBLWT*-,
(TABLAT) Holding Register;
(TBLPTR) – 1 TBLPTR;
if TBLWT+*,
(TBLPTR) + 1 TBLPTR;
(TABLAT) Holding Register;
=
FFh
After Instructions (table write completion)
TABLAT
TBLPTR
HOLDING REGISTER
(00A356h)
=
=
55h
00A357h
=
55h
Example 2:
TBLWT +*;
Before Instruction
TABLAT
TBLPTR
HOLDING REGISTER
(01389Ah)
HOLDING REGISTER
(01389Bh)
=
=
34h
01389Ah
Status Affected: None
=
FFh
Encoding:
0000
0000
0000
11nn
nn=0 *
=1 *+
=2 *-
=3 +*
=
FFh
After Instruction (table write completion)
TABLAT
TBLPTR
HOLDING REGISTER
(01389Ah)
HOLDING REGISTER
(01389Bh)
=
=
34h
01389Bh
Description:
This instruction uses the 3 LSBs of
TBLPTR to determine which of the
8 holding registers the TABLAT is written
to. The holding registers are used to
program the contents of Program
Memory (P.M.). (Refer to Section 6.0
“Flash Program Memory” for additional
details on programming Flash memory.)
The TBLPTR (a 21-bit pointer) points to
each byte in the program memory.
TBLPTR has a 2-MByte address range.
The LSb of the TBLPTR selects which
byte of the program memory location to
access.
=
=
FFh
34h
TBLPTR[0] = 0: Least Significant
Byte of Program
Memory Word
TBLPTR[0] = 1: Most Significant
Byte of Program
Memory Word
The TBLWT instruction can modify the
value of TBLPTR as follows:
•
•
•
•
no change
post-increment
post-decrement
pre-increment
Words:
1
2
Cycles:
Q Cycle Activity:
Q1
Q2
No
Q3
No
Q4
No
Decode
operation operation operation
No
No No No
operation operation operation operation
(Read
TABLAT)
(Write to
Holding
Register )
DS41412A-page 408
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
TSTFSZ
Test f, skip if 0
XORLW
Exclusive OR literal with W
Syntax:
TSTFSZ f {,a}
Syntax:
XORLW k
Operands:
0 f 255
a [0,1]
Operands:
Operation:
Status Affected:
Encoding:
Description:
0 k 255
(W) .XOR. k W
N, Z
Operation:
skip if f = 0
Status Affected:
Encoding:
None
0000
1010
kkkk
kkkk
0110
011a
ffff
ffff
The contents of W are XORed with
the 8-bit literal ‘k’. The result is placed
in W.
Description:
If ‘f’ = 0, the next instruction fetched
during the current instruction execution
is discarded and a NOPis executed,
making this a two-cycle instruction.
If ‘a’ is ‘0’, the Access Bank is selected.
If ‘a’ is ‘1’, the BSR is used to select the
GPR bank.
If ‘a’ is ‘0’ and the extended instruction
set is enabled, this instruction operates
in Indexed Literal Offset Addressing
mode whenever f 95 (5Fh). See
Section 25.2.3 “Byte-Oriented and
Bit-Oriented Instructions in Indexed
Literal Offset Mode” for details.
Words:
1
1
Cycles:
Q Cycle Activity:
Q1
Q2
Q3
Q4
Decode
Read
literal ‘k’
Process
Data
Write to W
Example:
XORLW
0AFh
Before Instruction
W
=
B5h
1Ah
Words:
Cycles:
1
After Instruction
1(2)
W
=
Note: 3 cycles if skip and followed
by a 2-word instruction.
Q Cycle Activity:
Q1
Q2
Q3
Q4
Decode
Read
register ‘f’
Process
Data
No
operation
If skip:
Q1
Q2
Q3
Q4
No
No
No
No
operation
operation
operation
operation
If skip and followed by 2-word instruction:
Q1
Q2
Q3
Q4
No
No
No
No
operation
operation
operation
operation
No
No
No
No
operation
operation
operation
operation
Example:
HERE
NZERO
ZERO
TSTFSZ CNT, 1
:
:
Before Instruction
PC
=
Address (HERE)
After Instruction
If CNT
PC
If CNT
PC
=
=
=
00h,
Address (ZERO)
00h,
Address (NZERO)
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 409
PIC18(L)F2X/4XK22
XORWF
Exclusive OR W with f
Syntax:
XORWF f {,d {,a}}
Operands:
0 f 255
d [0,1]
a [0,1]
Operation:
(W) .XOR. (f) dest
Status Affected:
Encoding:
N, Z
0001
10da
ffff
ffff
Description:
Exclusive OR the contents of W with
register ‘f’. If ‘d’ is ‘0’, the result is stored
in W. If ‘d’ is ‘1’, the result is stored back
in the register ‘f’ (default).
If ‘a’ is ‘0’, the Access Bank is selected.
If ‘a’ is ‘1’, the BSR is used to select the
GPR bank.
If ‘a’ is ‘0’ and the extended instruction
set is enabled, this instruction operates
in Indexed Literal Offset Addressing
mode whenever f 95 (5Fh). See
Section 25.2.3 “Byte-Oriented and
Bit-Oriented Instructions in Indexed
Literal Offset Mode” for details.
Words:
1
1
Cycles:
Q Cycle Activity:
Q1
Q2
Q3
Q4
Decode
Read
register ‘f’
Process
Data
Write to
destination
Example:
XORWF
REG, 1, 0
Before Instruction
REG
W
=
=
AFh
B5h
After Instruction
REG
W
=
=
1Ah
B5h
DS41412A-page 410
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
A summary of the instructions in the extended instruc-
tion set is provided in Table 25-3. Detailed descriptions
are provided in Section 25.2.2 “Extended Instruction
Set”. The opcode field descriptions in Table 25-1 apply
to both the standard and extended PIC18 instruction
sets.
25.2 Extended Instruction Set
In addition to the standard 75 instructions of the PIC18
instruction set, PIC18(L)F2X/4XK22 devices also
provide an optional extension to the core CPU
functionality. The added features include eight
additional instructions that augment indirect and
indexed addressing operations and the implementation
of Indexed Literal Offset Addressing mode for many of
the standard PIC18 instructions.
Note:
The instruction set extension and the
Indexed Literal Offset Addressing mode
were designed for optimizing applications
written in C; the user may likely never use
these instructions directly in assembler.
The syntax for these commands is pro-
vided as a reference for users who may be
reviewing code that has been generated
by a compiler.
The additional features of the extended instruction set
are disabled by default. To enable them, users must set
the XINST Configuration bit.
The instructions in the extended set can all be
classified as literal operations, which either manipulate
the File Select Registers, or use them for indexed
addressing. Two of the instructions, ADDFSR and
SUBFSR, each have an additional special instantiation
for using FSR2. These versions (ADDULNK and
SUBULNK) allow for automatic return after execution.
25.2.1
EXTENDED INSTRUCTION SYNTAX
Most of the extended instructions use indexed
arguments, using one of the File Select Registers and
some offset to specify a source or destination register.
When an argument for an instruction serves as part of
indexed addressing, it is enclosed in square brackets
(“[ ]”). This is done to indicate that the argument is used
as an index or offset. MPASM™ Assembler will flag an
error if it determines that an index or offset value is not
bracketed.
The extended instructions are specifically implemented
to optimize re-entrant program code (that is, code that
is recursive or that uses a software stack) written in
high-level languages, particularly C. Among other
things, they allow users working in high-level
languages to perform certain operations on data
structures more efficiently. These include:
When the extended instruction set is enabled, brackets
are also used to indicate index arguments in byte-
oriented and bit-oriented instructions. This is in addition
to other changes in their syntax. For more details, see
Section 25.2.3.1 “Extended Instruction Syntax with
Standard PIC18 Commands”.
• dynamic allocation and deallocation of software
stack space when entering and leaving
subroutines
• function pointer invocation
• software Stack Pointer manipulation
• manipulation of variables located in a software
stack
Note:
In the past, square brackets have been
used to denote optional arguments in the
PIC18 and earlier instruction sets. In this
text and going forward, optional
arguments are denoted by braces (“{ }”).
TABLE 25-3: EXTENSIONS TO THE PIC18 INSTRUCTION SET
16-Bit Instruction Word
MSb LSb
Mnemonic,
Operands
Status
Affected
Description
Cycles
ADDFSR
ADDULNK
CALLW
f, k
k
Add literal to FSR
Add literal to FSR2 and return
Call subroutine using WREG
1
2
2
2
1110 1000 ffkk kkkk
1110 1000 11kk kkkk
0000 0000 0001 0100
1110 1011 0zzz zzzz
1111 ffff ffff ffff
1110 1011 1zzz zzzz
1111 xxxx xzzz zzzz
1110 1010 kkkk kkkk
None
None
None
None
MOVSF
zs, fd Move zs (source) to 1st word
fd (destination) 2nd word
zs, zd Move zs (source) to 1st word
MOVSS
PUSHL
2
1
None
None
zd (destination)
Store literal at FSR2,
decrement FSR2
2nd word
k
SUBFSR
SUBULNK
f, k
k
Subtract literal from FSR
Subtract literal from FSR2 and
return
1
2
1110 1001 ffkk kkkk
1110 1001 11kk kkkk
None
None
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 411
PIC18(L)F2X/4XK22
25.2.2
EXTENDED INSTRUCTION SET
ADDFSR
Add Literal to FSR
ADDULNK
Add Literal to FSR2 and Return
Syntax:
ADDFSR f, k
Syntax:
ADDULNK k
Operands:
0 k 63
f [ 0, 1, 2 ]
Operands:
Operation:
0 k 63
FSR2 + k FSR2,
(TOS) PC
None
Operation:
FSR(f) + k FSR(f)
Status Affected:
Encoding:
None
Status Affected:
Encoding:
1110
1000
ffkk
kkkk
1110
1000
11kk
kkkk
Description:
The 6-bit literal ‘k’ is added to the
contents of the FSR specified by ‘f’.
Description:
The 6-bit literal ‘k’ is added to the
contents of FSR2. A RETURNis then
executed by loading the PC with the
TOS.
Words:
1
1
Cycles:
The instruction takes two cycles to
execute; a NOPis performed during
the second cycle.
This may be thought of as a special
case of the ADDFSRinstruction,
where f = 3 (binary ‘11’); it operates
only on FSR2.
Q Cycle Activity:
Q1
Q2
Q3
Q4
Decode
Read
literal ‘k’
Process
Data
Write to
FSR
ADDFSR 2, 23h
Example:
Words:
Cycles:
1
2
Before Instruction
FSR2
After Instruction
FSR2
=
03FFh
0422h
Q Cycle Activity:
Q1
=
Q2
Q3
Q4
Decode
Read
literal ‘k’
Process
Data
Write to
FSR
No
No
No
No
Operation
Operation
Operation
Operation
ADDULNK 23h
Example:
Before Instruction
FSR2
PC
=
=
03FFh
0100h
After Instruction
FSR2
PC
=
=
0422h
(TOS)
Note:
All PIC18 instructions may take an optional label argument preceding the instruction mnemonic for use in
symbolic addressing. If a label is used, the instruction syntax then becomes: {label} instruction argument(s).
DS41412A-page 412
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
CALLW
Subroutine Call Using WREG
MOVSF
Move Indexed to f
Syntax:
CALLW
None
Syntax:
MOVSF [z ], f
s
d
Operands:
Operation:
Operands:
0 z 127
s
0 f 4095
d
(PC + 2) TOS,
(W) PCL,
Operation:
((FSR2) + z ) f
s
d
(PCLATH) PCH,
(PCLATU) PCU
Status Affected:
None
Encoding:
1st word (source)
2nd word (destin.)
Status Affected:
Encoding:
None
1110
1111
1011
ffff
0zzz
ffff
zzzz
ffff
s
0000
0000
0001
0100
d
Description
First, the return address (PC + 2) is
pushed onto the return stack. Next, the
contents of W are written to PCL; the
existing value is discarded. Then, the
contents of PCLATH and PCLATU are
latched into PCH and PCU,
respectively. The second cycle is
executed as a NOPinstruction while the
new next instruction is fetched.
Description:
The contents of the source register are
moved to destination register ‘f ’. The
d
actual address of the source register is
determined by adding the 7-bit literal
offset ‘z ’ in the first word to the value of
s
FSR2. The address of the destination
register is specified by the 12-bit literal
‘f ’ in the second word. Both addresses
d
can be anywhere in the 4096-byte data
space (000h to FFFh).
The MOVSFinstruction cannot use the
PCL, TOSU, TOSH or TOSL as the
destination register.
If the resultant source address points to
an indirect addressing register, the
value returned will be 00h.
Unlike CALL, there is no option to
update W, Status or BSR.
Words:
Cycles:
1
2
Q Cycle Activity:
Q1
Q2
Q3
Q4
Words:
Cycles:
2
2
Decode
Read
WREG
PUSH PC to
stack
No
operation
No
operation
No
operation
No
operation
No
operation
Q Cycle Activity:
Q1
Q2
Q3
Q4
Decode
Determine
Determine
Read
source addr source addr source reg
Example:
HERE
CALLW
Decode
No
operation
No
operation
Write
register ‘f’
(dest)
Before Instruction
PC
=
address (HERE)
PCLATH =
PCLATU =
10h
00h
06h
No dummy
read
W
=
After Instruction
PC
=
001006h
Example:
MOVSF
[05h], REG2
TOS
=
address (HERE + 2)
PCLATH =
PCLATU =
W
10h
00h
06h
Before Instruction
FSR2
=
80h
33h
=
Contents
of 85h
REG2
=
=
11h
After Instruction
FSR2
=
80h
Contents
of 85h
REG2
=
=
33h
33h
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 413
PIC18(L)F2X/4XK22
MOVSS
Move Indexed to Indexed
PUSHL
Store Literal at FSR2, Decrement FSR2
Syntax:
MOVSS [z ], [z ]
Syntax:
PUSHL k
s
d
Operands:
0 z 127
s
Operands:
Operation:
0k 255
0 z 127
d
k (FSR2),
FSR2 – 1 FSR2
Operation:
((FSR2) + z ) ((FSR2) + z )
s d
Status Affected:
None
Status Affected: None
Encoding:
1st word (source)
2nd word (dest.)
Encoding:
1111
1010
kkkk
kkkk
1110
1111
1011
xxxx
1zzz
xzzz
zzzz
zzzz
s
d
Description:
The 8-bit literal ‘k’ is written to the data
memory address specified by FSR2. FSR2
is decremented by 1 after the operation.
This instruction allows users to push values
onto a software stack.
Description
The contents of the source register are
moved to the destination register. The
addresses of the source and destination
registers are determined by adding the
7-bit literal offsets ‘z ’ or ‘z ’,
Words:
Cycles:
1
1
s
d
respectively, to the value of FSR2. Both
registers can be located anywhere in
the 4096-byte data memory space
(000h to FFFh).
Q Cycle Activity:
Q1
Q2
Q3
Q4
The MOVSSinstruction cannot use the
PCL, TOSU, TOSH or TOSL as the
destination register.
Decode
Read ‘k’
Process
data
Write to
destination
If the resultant source address points to
an indirect addressing register, the
value returned will be 00h. If the
resultant destination address points to
an indirect addressing register, the
instruction will execute as a NOP.
Example:
PUSHL 08h
Before Instruction
FSR2H:FSR2L
Memory (01ECh)
=
=
01ECh
00h
Words:
2
2
After Instruction
FSR2H:FSR2L
Memory (01ECh)
=
=
01EBh
08h
Cycles:
Q Cycle Activity:
Q1
Q2
Q3
Q4
Decode
Determine
Determine
Read
source addr source addr source reg
Decode
Determine
dest addr
Determine
dest addr
Write
to dest reg
Example:
MOVSS [05h], [06h]
Before Instruction
FSR2
=
=
=
80h
33h
11h
Contents
of 85h
Contents
of 86h
After Instruction
FSR2
=
=
=
80h
33h
33h
Contents
of 85h
Contents
of 86h
DS41412A-page 414
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
SUBFSR
Subtract Literal from FSR
SUBULNK
Subtract Literal from FSR2 and Return
Syntax:
SUBFSR f, k
0 k 63
Syntax:
SUBULNK k
Operands:
Operands:
Operation:
0 k 63
f [ 0, 1, 2 ]
FSR(f) – k FSRf
None
FSR2 – k FSR2
(TOS) PC
Operation:
Status Affected:
Encoding:
Status Affected: None
1110
1001
ffkk
kkkk
Encoding:
1110
1001
11kk
kkkk
Description:
The 6-bit literal ‘k’ is subtracted from
the contents of the FSR specified by
‘f’.
Description:
The 6-bit literal ‘k’ is subtracted from the
contents of the FSR2. A RETURNis then
executed by loading the PC with the TOS.
The instruction takes two cycles to
execute; a NOPis performed during the
second cycle.
This may be thought of as a special case of
the SUBFSRinstruction, where f = 3 (binary
‘11’); it operates only on FSR2.
Words:
1
1
Cycles:
Q Cycle Activity:
Q1
Q2
Q3
Q4
Decode
Read
register ‘f’
Process
Data
Write to
destination
Words:
1
2
Cycles:
Q Cycle Activity:
Q1
Example:
SUBFSR 2, 23h
03FFh
Q2
Q3
Q4
Before Instruction
FSR2
After Instruction
FSR2
Decode
Read
register ‘f’
Process
Data
Write to
destination
=
No
Operation
No
Operation
No
Operation
No
Operation
=
03DCh
Example:
SUBULNK 23h
Before Instruction
FSR2
PC
=
=
03FFh
0100h
After Instruction
FSR2
PC
=
=
03DCh
(TOS)
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 415
PIC18(L)F2X/4XK22
25.2.3
BYTE-ORIENTED AND
BIT-ORIENTED INSTRUCTIONS IN
INDEXED LITERAL OFFSET MODE
25.2.3.1
Extended Instruction Syntax with
Standard PIC18 Commands
When the extended instruction set is enabled, the file
register argument, ‘f’, in the standard byte-oriented and
bit-oriented commands is replaced with the literal offset
value, ‘k’. As already noted, this occurs only when ‘f’ is
less than or equal to 5Fh. When an offset value is used,
it must be indicated by square brackets (“[ ]”). As with
the extended instructions, the use of brackets indicates
to the compiler that the value is to be interpreted as an
index or an offset. Omitting the brackets, or using a
value greater than 5Fh within brackets, will generate an
error in the MPASM assembler.
Note: Enabling the PIC18 instruction set
extension may cause legacy applications
to behave erratically or fail entirely.
In addition to eight new commands in the extended set,
enabling the extended instruction set also enables
Indexed Literal Offset Addressing mode (Section 5.5.1
“Indexed Addressing with Literal Offset”). This has
a significant impact on the way that many commands of
the standard PIC18 instruction set are interpreted.
When the extended set is disabled, addresses
embedded in opcodes are treated as literal memory
locations: either as a location in the Access Bank (‘a’ =
0), or in a GPR bank designated by the BSR (‘a’ = 1).
When the extended instruction set is enabled and ‘a’ =
0, however, a file register argument of 5Fh or less is
interpreted as an offset from the pointer value in FSR2
and not as a literal address. For practical purposes, this
means that all instructions that use the Access RAM bit
as an argument – that is, all byte-oriented and bit-
oriented instructions, or almost half of the core PIC18
instructions – may behave differently when the
extended instruction set is enabled.
If the index argument is properly bracketed for Indexed
Literal Offset Addressing, the Access RAM argument is
never specified; it will automatically be assumed to be
‘0’. This is in contrast to standard operation (extended
instruction set disabled) when ‘a’ is set on the basis of
the target address. Declaring the Access RAM bit in
this mode will also generate an error in the MPASM
assembler.
The destination argument, ‘d’, functions as before.
In the latest versions of the MPASM™ assembler,
language support for the extended instruction set must
be explicitly invoked. This is done with either the
command line option, /y, or the PE directive in the
source listing.
When the content of FSR2 is 00h, the boundaries of the
Access RAM are essentially remapped to their original
values. This may be useful in creating backward
compatible code. If this technique is used, it may be
necessary to save the value of FSR2 and restore it
when moving back and forth between C and assembly
routines in order to preserve the Stack Pointer. Users
must also keep in mind the syntax requirements of the
extended instruction set (see Section 25.2.3.1
“Extended Instruction Syntax with Standard PIC18
Commands”).
25.2.4
CONSIDERATIONS WHEN
ENABLING THE EXTENDED
INSTRUCTION SET
It is important to note that the extensions to the instruc-
tion set may not be beneficial to all users. In particular,
users who are not writing code that uses a software
stack may not benefit from using the extensions to the
instruction set.
Although the Indexed Literal Offset Addressing mode
can be very useful for dynamic stack and pointer
manipulation, it can also be very annoying if a simple
arithmetic operation is carried out on the wrong
register. Users who are accustomed to the PIC18
programming must keep in mind that, when the
extended instruction set is enabled, register addresses
of 5Fh or less are used for Indexed Literal Offset
Addressing.
Additionally, the Indexed Literal Offset Addressing
mode may create issues with legacy applications
written to the PIC18 assembler. This is because
instructions in the legacy code may attempt to address
registers in the Access Bank below 5Fh. Since these
addresses are interpreted as literal offsets to FSR2
when the instruction set extension is enabled, the
application may read or write to the wrong data
addresses.
Representative examples of typical byte-oriented and
bit-oriented instructions in the Indexed Literal Offset
Addressing mode are provided on the following page to
show how execution is affected. The operand condi-
tions shown in the examples are applicable to all
instructions of these types.
When porting an application to the PIC18(L)F2X/
4XK22, it is very important to consider the type of code.
A large, re-entrant application that is written in ‘C’ and
would benefit from efficient compilation will do well
when using the instruction set extensions. Legacy
applications that heavily use the Access Bank will most
likely not benefit from using the extended instruction
set.
DS41412A-page 416
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
ADD W to Indexed
(Indexed Literal Offset mode)
Bit Set Indexed
(Indexed Literal Offset mode)
ADDWF
BSF
Syntax:
ADDWF
[k] {,d}
Syntax:
BSF [k], b
Operands:
0 k 95
d [0,1]
Operands:
0 f 95
0 b 7
Operation:
(W) + ((FSR2) + k) dest
Operation:
1 ((FSR2) + k)<b>
Status Affected:
Encoding:
N, OV, C, DC, Z
Status Affected:
Encoding:
None
0010
01d0
kkkk
kkkk
1000
bbb0
kkkk
kkkk
Description:
The contents of W are added to the
contents of the register indicated by
FSR2, offset by the value ‘k’.
If ‘d’ is ‘0’, the result is stored in W. If ‘d’
is ‘1’, the result is stored back in
register ‘f’ (default).
Description:
Bit ‘b’ of the register indicated by FSR2,
offset by the value ‘k’, is set.
Words:
1
1
Cycles:
Q Cycle Activity:
Q1
Words:
Cycles:
1
1
Q2
Q3
Q4
Decode
Read
register ‘f’
Process
Data
Write to
destination
Q Cycle Activity:
Q1
Q2
Q3
Q4
Example:
BSF
[FLAG_OFST], 7
Decode
Read ‘k’
Process
Data
Write to
destination
Before Instruction
FLAG_OFST
FSR2
Contents
of 0A0Ah
=
=
0Ah
0A00h
Example:
ADDWF
[OFST], 0
=
55h
D5h
Before Instruction
After Instruction
W
OFST
FSR2
=
=
=
17h
2Ch
0A00h
Contents
of 0A0Ah
=
Contents
of 0A2Ch
=
20h
After Instruction
W
=
=
37h
20h
Set Indexed
(Indexed Literal Offset mode)
Contents
of 0A2Ch
SETF
Syntax:
SETF [k]
Operands:
Operation:
Status Affected:
Encoding:
Description:
0 k 95
FFh ((FSR2) + k)
None
0110
1000
kkkk
kkkk
The contents of the register indicated by
FSR2, offset by ‘k’, are set to FFh.
Words:
Cycles:
1
1
Q Cycle Activity:
Q1
Q2
Q3
Q4
Decode
Read ‘k’
Process
Data
Write
register
Example:
SETF
[OFST]
2Ch
Before Instruction
OFST
=
=
FSR2
0A00h
Contents
of 0A2Ch
=
00h
After Instruction
Contents
of 0A2Ch
=
FFh
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 417
PIC18(L)F2X/4XK22
25.2.5
SPECIAL CONSIDERATIONS WITH
MICROCHIP MPLAB® IDE TOOLS
The latest versions of Microchip’s software tools have
been designed to fully support the extended instruction
set of the PIC18(L)F2X/4XK22 family of devices. This
includes the MPLAB C18
assembly language and
Development Environment (IDE).
C
compiler, MPASM
MPLAB Integrated
When selecting target device for software
a
development, MPLAB IDE will automatically set default
Configuration bits for that device. The default setting for
the XINST Configuration bit is ‘0’, disabling the
extended instruction set and Indexed Literal Offset
Addressing mode. For proper execution of applications
developed to take advantage of the extended
instruction set, XINST must be set during
programming.
To develop software for the extended instruction set,
the user must enable support for the instructions and
the Indexed Addressing mode in their language tool(s).
Depending on the environment being used, this may be
done in several ways:
• A menu option, or dialog box within the
environment, that allows the user to configure the
language tool and its settings for the project
• A command line option
• A directive in the source code
These options vary between different compilers,
assemblers and development environments. Users are
encouraged to review the documentation accompanying
their development systems for the appropriate
information.
DS41412A-page 418
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
26.1 MPLAB Integrated Development
Environment Software
26.0 DEVELOPMENT SUPPORT
The PIC® microcontrollers and dsPIC® digital signal
controllers are supported with a full range of software
and hardware development tools:
The MPLAB IDE software brings an ease of software
development previously unseen in the 8/16/32-bit
microcontroller market. The MPLAB IDE is a Windows®
operating system-based application that contains:
• Integrated Development Environment
- MPLAB® IDE Software
• A single graphical interface to all debugging tools
- Simulator
• Compilers/Assemblers/Linkers
- MPLAB C Compiler for Various Device
Families
- Programmer (sold separately)
- In-Circuit Emulator (sold separately)
- In-Circuit Debugger (sold separately)
• A full-featured editor with color-coded context
• A multiple project manager
- HI-TECH C for Various Device Families
- MPASMTM Assembler
- MPLINKTM Object Linker/
MPLIBTM Object Librarian
- MPLAB Assembler/Linker/Librarian for
Various Device Families
• Customizable data windows with direct edit of
contents
• Simulators
• High-level source code debugging
• Mouse over variable inspection
- MPLAB SIM Software Simulator
• Emulators
• Drag and drop variables from source to watch
windows
- MPLAB REAL ICE™ In-Circuit Emulator
• In-Circuit Debuggers
• Extensive on-line help
• Integration of select third party tools, such as
IAR C Compilers
- MPLAB ICD 3
- PICkit™ 3 Debug Express
• Device Programmers
- PICkit™ 2 Programmer
- MPLAB PM3 Device Programmer
The MPLAB IDE allows you to:
• Edit your source files (either C or assembly)
• One-touch compile or assemble, and download to
emulator and simulator tools (automatically
updates all project information)
• Low-Cost Demonstration/Development Boards,
Evaluation Kits, and Starter Kits
• Debug using:
- Source files (C or assembly)
- Mixed C and assembly
- Machine code
MPLAB IDE supports multiple debugging tools in a
single development paradigm, from the cost-effective
simulators, through low-cost in-circuit debuggers, to
full-featured emulators. This eliminates the learning
curve when upgrading to tools with increased flexibility
and power.
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 419
PIC18(L)F2X/4XK22
26.2 MPLAB C Compilers for Various
Device Families
26.5 MPLINK Object Linker/
MPLIB Object Librarian
The MPLAB C Compiler code development systems
are complete ANSI C compilers for Microchip’s PIC18,
PIC24 and PIC32 families of microcontrollers and the
dsPIC30 and dsPIC33 families of digital signal control-
lers. These compilers provide powerful integration
capabilities, superior code optimization and ease of
use.
The MPLINK Object Linker combines relocatable
objects created by the MPASM Assembler and the
MPLAB C18 C Compiler. It can link relocatable objects
from precompiled libraries, using directives from a
linker script.
The MPLIB Object Librarian manages the creation and
modification of library files of precompiled code. When
a routine from a library is called from a source file, only
the modules that contain that routine will be linked in
with the application. This allows large libraries to be
used efficiently in many different applications.
For easy source level debugging, the compilers provide
symbol information that is optimized to the MPLAB IDE
debugger.
26.3 HI-TECH C for Various Device
Families
The object linker/library features include:
• Efficient linking of single libraries instead of many
smaller files
The HI-TECH C Compiler code development systems
are complete ANSI C compilers for Microchip’s PIC
family of microcontrollers and the dsPIC family of digital
signal controllers. These compilers provide powerful
integration capabilities, omniscient code generation
and ease of use.
• Enhanced code maintainability by grouping
related modules together
• Flexible creation of libraries with easy module
listing, replacement, deletion and extraction
26.6 MPLAB Assembler, Linker and
Librarian for Various Device
Families
For easy source level debugging, the compilers provide
symbol information that is optimized to the MPLAB IDE
debugger.
The compilers include a macro assembler, linker, pre-
processor, and one-step driver, and can run on multiple
platforms.
MPLAB Assembler produces relocatable machine
code from symbolic assembly language for PIC24,
PIC32 and dsPIC devices. MPLAB C Compiler uses
the assembler to produce its object file. The assembler
generates relocatable object files that can then be
archived or linked with other relocatable object files and
archives to create an executable file. Notable features
of the assembler include:
26.4 MPASM Assembler
The MPASM Assembler is a full-featured, universal
macro assembler for PIC10/12/16/18 MCUs.
The MPASM Assembler generates relocatable object
files for the MPLINK Object Linker, Intel® standard HEX
files, MAP files to detail memory usage and symbol
reference, absolute LST files that contain source lines
and generated machine code and COFF files for
debugging.
• Support for the entire device instruction set
• Support for fixed-point and floating-point data
• Command line interface
• Rich directive set
• Flexible macro language
The MPASM Assembler features include:
• Integration into MPLAB IDE projects
• MPLAB IDE compatibility
• User-defined macros to streamline
assembly code
• Conditional assembly for multi-purpose
source files
• Directives that allow complete control over the
assembly process
DS41412A-page 420
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
26.7 MPLAB SIM Software Simulator
26.9 MPLAB ICD 3 In-Circuit Debugger
System
The MPLAB SIM Software Simulator allows code
development in a PC-hosted environment by simulat-
ing the PIC MCUs and dsPIC® DSCs on an instruction
level. On any given instruction, the data areas can be
examined or modified and stimuli can be applied from
a comprehensive stimulus controller. Registers can be
logged to files for further run-time analysis. The trace
buffer and logic analyzer display extend the power of
the simulator to record and track program execution,
actions on I/O, most peripherals and internal registers.
MPLAB ICD 3 In-Circuit Debugger System is Micro-
chip's most cost effective high-speed hardware
debugger/programmer for Microchip Flash Digital Sig-
nal Controller (DSC) and microcontroller (MCU)
devices. It debugs and programs PIC® Flash microcon-
trollers and dsPIC® DSCs with the powerful, yet easy-
to-use graphical user interface of MPLAB Integrated
Development Environment (IDE).
The MPLAB ICD 3 In-Circuit Debugger probe is con-
nected to the design engineer's PC using a high-speed
USB 2.0 interface and is connected to the target with a
connector compatible with the MPLAB ICD 2 or MPLAB
REAL ICE systems (RJ-11). MPLAB ICD 3 supports all
MPLAB ICD 2 headers.
The MPLAB SIM Software Simulator fully supports
symbolic debugging using the MPLAB C Compilers,
and the MPASM and MPLAB Assemblers. The soft-
ware simulator offers the flexibility to develop and
debug code outside of the hardware laboratory envi-
ronment, making it an excellent, economical software
development tool.
26.10 PICkit 3 In-Circuit Debugger/
Programmer and
26.8 MPLAB REAL ICE In-Circuit
Emulator System
PICkit 3 Debug Express
The MPLAB PICkit 3 allows debugging and program-
ming of PIC® and dsPIC® Flash microcontrollers at a
most affordable price point using the powerful graphical
user interface of the MPLAB Integrated Development
Environment (IDE). The MPLAB PICkit 3 is connected
to the design engineer's PC using a full speed USB
interface and can be connected to the target via an
Microchip debug (RJ-11) connector (compatible with
MPLAB ICD 3 and MPLAB REAL ICE). The connector
uses two device I/O pins and the reset line to imple-
ment in-circuit debugging and In-Circuit Serial Pro-
gramming™.
MPLAB REAL ICE In-Circuit Emulator System is
Microchip’s next generation high-speed emulator for
Microchip Flash DSC and MCU devices. It debugs and
programs PIC® Flash MCUs and dsPIC® Flash DSCs
with the easy-to-use, powerful graphical user interface of
the MPLAB Integrated Development Environment (IDE),
included with each kit.
The emulator is connected to the design engineer’s PC
using a high-speed USB 2.0 interface and is connected
to the target with either a connector compatible with in-
circuit debugger systems (RJ11) or with the new high-
speed, noise tolerant, Low-Voltage Differential Signal
(LVDS) interconnection (CAT5).
The PICkit 3 Debug Express include the PICkit 3, demo
board and microcontroller, hookup cables and CDROM
with user’s guide, lessons, tutorial, compiler and
MPLAB IDE software.
The emulator is field upgradable through future firmware
downloads in MPLAB IDE. In upcoming releases of
MPLAB IDE, new devices will be supported, and new
features will be added. MPLAB REAL ICE offers signifi-
cant advantages over competitive emulators including
low-cost, full-speed emulation, run-time variable
watches, trace analysis, complex breakpoints, a rugge-
dized probe interface and long (up to three meters) inter-
connection cables.
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 421
PIC18(L)F2X/4XK22
26.11 PICkit 2 Development
Programmer/Debugger and
PICkit 2 Debug Express
26.13 Demonstration/Development
Boards, Evaluation Kits, and
Starter Kits
The PICkit™ 2 Development Programmer/Debugger is
a low-cost development tool with an easy to use inter-
face for programming and debugging Microchip’s Flash
families of microcontrollers. The full featured
Windows® programming interface supports baseline
A wide variety of demonstration, development and
evaluation boards for various PIC MCUs and dsPIC
DSCs allows quick application development on fully func-
tional systems. Most boards include prototyping areas for
adding custom circuitry and provide application firmware
and source code for examination and modification.
(PIC10F,
PIC12F5xx,
PIC16F5xx),
midrange
(PIC12F6xx, PIC16F), PIC18F, PIC24, dsPIC30,
dsPIC33, and PIC32 families of 8-bit, 16-bit, and 32-bit
microcontrollers, and many Microchip Serial EEPROM
products. With Microchip’s powerful MPLAB Integrated
The boards support a variety of features, including LEDs,
temperature sensors, switches, speakers, RS-232
interfaces, LCD displays, potentiometers and additional
EEPROM memory.
Development Environment (IDE) the PICkit™
2
enables in-circuit debugging on most PIC® microcon-
trollers. In-Circuit-Debugging runs, halts and single
steps the program while the PIC microcontroller is
embedded in the application. When halted at a break-
point, the file registers can be examined and modified.
The demonstration and development boards can be
used in teaching environments, for prototyping custom
circuits and for learning about various microcontroller
applications.
In addition to the PICDEM™ and dsPICDEM™ demon-
stration/development board series of circuits, Microchip
has a line of evaluation kits and demonstration software
The PICkit 2 Debug Express include the PICkit 2, demo
board and microcontroller, hookup cables and CDROM
with user’s guide, lessons, tutorial, compiler and
MPLAB IDE software.
®
for analog filter design, KEELOQ security ICs, CAN,
IrDA®, PowerSmart battery management, SEEVAL®
evaluation system, Sigma-Delta ADC, flow rate
sensing, plus many more.
26.12 MPLAB PM3 Device Programmer
Also available are starter kits that contain everything
needed to experience the specified device. This usually
includes a single application and debug capability, all
on one board.
The MPLAB PM3 Device Programmer is a universal,
CE compliant device programmer with programmable
voltage verification at VDDMIN and VDDMAX for
maximum reliability. It features a large LCD display
(128 x 64) for menus and error messages and a modu-
lar, detachable socket assembly to support various
package types. The ICSP™ cable assembly is included
as a standard item. In Stand-Alone mode, the MPLAB
PM3 Device Programmer can read, verify and program
PIC devices without a PC connection. It can also set
code protection in this mode. The MPLAB PM3
connects to the host PC via an RS-232 or USB cable.
The MPLAB PM3 has high-speed communications and
optimized algorithms for quick programming of large
memory devices and incorporates an MMC card for file
storage and data applications.
Check the Microchip web page (www.microchip.com)
for the complete list of demonstration, development
and evaluation kits.
DS41412A-page 422
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
27.0 ELECTRICAL CHARACTERISTICS
(†)
Absolute Maximum Ratings
Ambient temperature under bias.............................................................................................................-40°C to +125°C
Storage temperature .............................................................................................................................. -65°C to +150°C
Voltage on any pin with respect to VSS (except VDD, and MCLR) .................................................. -0.3V to (VDD + 0.3V)
Voltage on VDD with respect to VSS
PIC18LF46K22 ......................................................................................................... -0.3V to +4.5V
PIC18F46K22........................................................................................................... -0.3V to +6.5V
Voltage on MCLR with respect to VSS (Note 2) ............................................................................................0V to +11.0V
Total power dissipation (Note 1) ...............................................................................................................................1.0W
Maximum current out of VSS pin (-40°C to +85°C) .............................................................................................. 300 mA
Maximum current out of VSS pin (+85°C to +125°C)............................................................................................ 125 mA
Maximum current into VDD pin (-40°C to +85°C) ................................................................................................ 200 mA
Maximum current into VDD pin (+85°C to +125°C) ................................................................................................85 mA
Input clamp current, IIK (VI < 0 or VI > VDD)20 mA
Output clamp current, IOK (VO < 0 or VO > VDD) 20 mA
Maximum output current sunk by any I/O pin..........................................................................................................25 mA
Maximum output current sourced by any I/O pin ....................................................................................................25 mA
Maximum current sunk byall ports (-40°C to +85°C)........................................................................................... 200 mA
Maximum current sunk byall ports (+85°C to +125°C)......................................................................................... 110 mA
Maximum current sourced by all ports (-40°C to +85°C) ......................................................................................185 mA
Maximum current sourced by all ports (+85°C to +125°C) .....................................................................................70 mA
Note 1: Power dissipation is calculated as follows:
Pdis = VDD x {IDD – IOH} + {(VDD – VOH) x IOH} + (VOL x IOL)
2: Voltage spikes below VSS at the MCLR/VPP/RE3 pin, inducing currents greater than 80 mA, may cause
latch-up. Thus, a series resistor of 50-100 should be used when applying a “low” level to the MCLR/VPP/
RE3 pin, rather than pulling this pin directly to VSS.
† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for
extended periods may affect device reliability.
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 423
PIC18(L)F2X/4XK22
FIGURE 27-1:
PIC18(L)F46K22 FAMILY VOLTAGE-FREQUENCY GRAPH
5.5V
3.6V
3.5V
3.0V
2.7V
2.2V
1.8V
10
20
30 32
40
50
60 64
Frequency (MHz)
Note 1: Maximum Frequency 20 MHz, 1.8V to 3.0V, -40°C to +125°C (PIC18(L)F2X/4XK22).
2: Maximum Frequency 64 MHz, 3.0V to 3.6V, -40°C to +125°C (PIC18LF2X/4XK22).
3: Maximum Frequency 64 MHz, 3.0V to 5.5V, -40°C to +125°C (PIC18F2X/4XK22).
DS41412A-page 424
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
27.1 DC Characteristics: Supply Voltage, PIC18(L)F2X/4XK22
Standard Operating Conditions (unless otherwise
stated)
PIC18(L)F2X/4XK22
Operating temperature
-40°C TA +125°C
Param
Symbol
No.
Characteristic
Min Typ Max Units
Conditions
D001 VDD
Supply Voltage
PIC18LF2X/4XK22
PIC18F2X/4XK22
RAM Data Retention Voltage(1)
1.8
1.8
1.5
—
—
—
—
—
3.6
5.5
—
V
V
V
V
D002 VDR
D003 VPOR
VDD Start Voltage to ensure internal
0.7
See section on Power-on Reset
for details
Power-on Reset signal
D004 SVDD
D005 VBOR
VDD Rise Rate to ensure internal
Power-on Reset signal
0.05
—
—
V/ms See section on Power-on Reset
for details
Brown-out Reset Voltage
BORV<1:0> = 11(2)
BORV<1:0> = 10
—
—
—
—
1.9
2.2
—
—
—
—
V
V
V
V
BORV<1:0> = 01
BORV<1:0> = 00(3)
2.5
2.85
Note 1: This is the limit to which VDD can be lowered in Sleep mode, or during a device Reset, without losing RAM
data.
2: With BOR enabled, operation is supported until a BOR occurs. This is valid although VDD may be below
the minimum rated supply voltage.
3: With BOR enabled, full-speed operation (FOSC = 64 MHz) is supported until a BOR occurs. This is valid
although VDD may be below the minimum voltage for this frequency.
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 425
PIC18(L)F2X/4XK22
27.2 DC Characteristics: Power-Down Current, PIC18(L)F2X/4XK22
Standard Operating Conditions (unless otherwise stated)
PIC18LF2X/4XK22
Operating temperature
-40°C TA +125°C
Standard Operating Conditions (unless otherwise stated)
PIC18F2X/4XK22
Param
Operating temperature
-40°C TA +125°C
Conditions
Notes
Typ Typ Max
+25°C +60°C +85°C +125°C
Max
Device Characteristics
Units
No.
VDD
Power-down Base Current (IPD)(1)
D006 Sleep mode
0.05
0.10
A
A
1.8V
3.0V
WDT, BOR, FVR, Voltage
Regulator and SOSC dis-
abled, all Peripherals inac-
tive
4.0
A
1.8V
3.0V
5.0V
4.6
5.1
A
A
Power-down Module Differential Current (delta IPD)
D007 Watchdog Timer
0.70
1.10
A
A
A
1.8V
3.0V
1.8V
3.0V
5.0V
2.0V
2.3V
2.7V
3.0V
2.0V
2.3V
2.7V
3.0V
5.0V
5.0
A
A
A
A
A
A
A
A
A
A
A
A
5.5
(2)
D008
Brown-out Reset
21.0
21.9
23.2
24.1
21.0
21.9
23.2
24.1
30.2
0.00
(2)
D009
Brown-out Reset
1.8V- Sleep mode,
3.6V BOREN<1:0> = 10
0.00
A
1.8V-
5.5V
Note 1: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is
measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD or VSS
and all features that add delta current disabled (such as WDT, Timer1 Oscillator, BOR, etc.).
2: BOR and HLVD enable inernal band gap reference. With both modules enabled, current consumption will
be less than the sum of both specifications
3: Low-Power mode on T1 osc: Low-Power mode is limited to 85°C.
4: High-Power mode is SOSC.
5: A/D converter differential currents apply only in Run mode. In Sleep or Idle mode both the ADC and the
FRC turn off as soon as conversion (if any) is complete.
DS41412A-page 426
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
27.2 DC Characteristics: Power-Down Current, PIC18(L)F2X/4XK22 (Continued)
Standard Operating Conditions (unless otherwise stated)
PIC18LF2X/4XK22
Operating temperature
-40°C TA +125°C
Standard Operating Conditions (unless otherwise stated)
PIC18F2X/4XK22
Param
Operating temperature
-40°C TA +125°C
Conditions
Notes
Typ Typ Max
+25°C +60°C +85°C +125°C
Max
Device Characteristics
Units
No.
VDD
(2)
D010
High/Low Voltage Detect
13.00
13.00
13.00
13.00
13.00
0.50
0.70
0.50
0.70
0.70
11
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
1.8V
3.0V
1.8V
3.0V
5.0V
1.8V
3.0V
1.8V
3.0V
5.0V
1.8V
3.0V
1.8V
3.0V
5.0V
1.8V
3.0V
1.8V
3.0V
5.0V
1.8V
3.0V
1.8V
3.0V
5.0V
(3)
D011
D012
D013
D014
Secondary Oscillator
32 kHz on SOSC
Low-Power mode
(4)
Secondary Oscillator
17
32 kHz on SOSC
High-Power mode
11
17
17
(5)
A/D Converter
200
260
200
260
260
A/D on, not converting
Adder for FRC
(5)
A/D Converter
A/D Conversion in
progress
Note 1: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is
measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD or VSS
and all features that add delta current disabled (such as WDT, Timer1 Oscillator, BOR, etc.).
2: BOR and HLVD enable inernal band gap reference. With both modules enabled, current consumption will
be less than the sum of both specifications
3: Low-Power mode on T1 osc: Low-Power mode is limited to 85°C.
4: High-Power mode is SOSC.
5: A/D converter differential currents apply only in Run mode. In Sleep or Idle mode both the ADC and the
FRC turn off as soon as conversion (if any) is complete.
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 427
PIC18(L)F2X/4XK22
27.2 DC Characteristics: Power-Down Current, PIC18(L)F2X/4XK22 (Continued)
Standard Operating Conditions (unless otherwise stated)
PIC18LF2X/4XK22
Operating temperature
-40°C TA +125°C
Standard Operating Conditions (unless otherwise stated)
PIC18F2X/4XK22
Param
Operating temperature
-40°C TA +125°C
Conditions
Notes
Typ Typ Max
+25°C +60°C +85°C +125°C
Max
Device Characteristics
Units
No.
VDD
D015
Comparators
Comparators
DAC
5
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
1.8V
3.0V
1.8V
3.0V
5.0V
1.8V
3.0V
1.8V
3.0V
5.0V
1.8V
3.0V
1.8V
3.0V
5.0V
1.8V
3.0V
1.8V
3.0V
5.0V
5
LP mode
5
5
5
D16
40
40
40
40
40
18
32
18
32
32
HP mode
D017
D018
FVR
Note 1: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is
measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD or VSS
and all features that add delta current disabled (such as WDT, Timer1 Oscillator, BOR, etc.).
2: BOR and HLVD enable inernal band gap reference. With both modules enabled, current consumption will
be less than the sum of both specifications
3: Low-Power mode on T1 osc: Low-Power mode is limited to 85°C.
4: High-Power mode is SOSC.
5: A/D converter differential currents apply only in Run mode. In Sleep or Idle mode both the ADC and the
FRC turn off as soon as conversion (if any) is complete.
DS41412A-page 428
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
27.3 DC Characteristics: RC Run Supply Current, PIC18(L)F2X/4XK22
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C TA +125°C
PIC18LF2X/4XK22
Standard Operating Conditions (unless otherwise stated)
PIC18F2X/4XK22
Param
Operating temperature
-40°C TA +125°C
Device Characteristics
Typ
Max Units
Conditions
No.
(1) (2)
D020
5.50
6.00
A
A
-40°C
+25°C
Supply Current (IDD)
—
—
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
mA
+60°C
+85°C
VDD = 1.8V
VDD = 3.0V
6.50
9.00
FOSC = 31 kHz
(RC_RUN mode,
LFINTOSC source)
125°C
D021
10.00
10.50
-40°C
+25°C
+60°C
11.00
14.00
+85°C
+125°C
-40°C
D022
D023
+25°C
VDD = 1.8V
VDD = 3.0V
VDD = 5.0V
+85°C
+125°C
-40°C
FOSC = 31 kHz
(RC_RUN mode,
LFINTOSC source)
133.00
152.00
+25°C
+85°C
+125°C
-40°C
+25°C
D024
+85°C
+125°C
-40°C to +125°C
D025
D026
0.40
0.60
VDD = 1.8V
VDD = 3.0V
FOSC = 500 KHz
(RC_RUN mode,
MFINTOSC source)
mA
-40°C to +125°C
D027
D028
D029
D030
-40°C to +125°C
-40°C to +125°C
-40°C to +125°C
-40°C to +125°C
VDD = 1.8V
VDD = 3.0V
VDD = 5.0V
VDD = 1.8V
mA
mA
mA
mA
FOSC = 500 KHz
(RC_RUN mode,
MFINTOSC source)
0.45
0.45
FOSC = 1 MHz
(RC_RUN mode,
HFINTOSC source)
D031
-40°C to +125°C
VDD = 3.0V
mA
D032
D033
D034
D035
-40°C to +125°C
-40°C to +125°C
-40°C to +125°C
-40°C to +125°C
VDD = 1.8V
VDD = 3.0V
VDD = 5.0V
VDD = 1.8V
mA
mA
mA
mA
FOSC = 1 MHz
(RC_RUN mode,
HFINTOSC source)
2.20
3.80
FOSC = 16 MHz
(RC_RUN mode,
HFINTOSC source)
D036
-40°C to +125°C
VDD = 3.0V
mA
Note 1: The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin load-
ing and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have an impact
on the current consumption.
The test conditions for all IDD measurements in active operation mode are:
OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD;
MCLR = VDD; WDT enabled/disabled as specified.
2: For RC oscillator configurations, current through REXT is not included. The current through the resistor can be
estimated by the formula Ir = VDD/2REXT (mA) with REXT in k.
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 429
PIC18(L)F2X/4XK22
27.3 DC Characteristics: RC Run Supply Current, PIC18(L)F2X/4XK22 (Continued)
Standard Operating Conditions (unless otherwise stated)
PIC18LF2X/4XK22
Operating temperature
-40°C TA +125°C
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C TA +125°C
PIC18F2X/4XK22
Param
Device Characteristics
Typ
Max Units
Conditions
No.
D037
-40°C to +125°C
-40°C to +125°C
-40°C to +125°C
-40°C to +125°C
VDD = 1.8V
VDD = 3.0V
VDD = 5.0V
VDD = 1.8V
mA
mA
mA
mA
FOSC = 16 MHz
(RC_RUN mode,
HFINTOSC source)
2.48
2.50
D038
D039
D040
FOSC = 64 MHz
(RC_RUN mode,
HFINTOSC source)
D041
-40°C to +125°C
VDD = 3.0V
mA
D042
D043
D044
-40°C to +125°C
-40°C to +125°C
-40°C to +125°C
VDD = 1.8V
VDD = 3.0V
VDD = 5.0V
mA
mA
mA
FOSC = 64 MHz
(RC_RUN mode,
HFINTOSC source)
Note 1: The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin load-
ing and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have an impact
on the current consumption.
The test conditions for all IDD measurements in active operation mode are:
OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD;
MCLR = VDD; WDT enabled/disabled as specified.
2: For RC oscillator configurations, current through REXT is not included. The current through the resistor can be
estimated by the formula Ir = VDD/2REXT (mA) with REXT in k.
DS41412A-page 430
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
27.4 DC Characteristics: RC Idle Supply Current, PIC18(L)F2X/4XK22
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C TA +125°C
PIC18LF2X/4XK22
Standard Operating Conditions (unless otherwise stated)
PIC18F2X/4XK22
Param
Operating temperature
-40°C TA +125°C
Device Characteristics
Typ Max Units
Conditions
No.
Supply Current (IDD)(1) (2)
D045
2.0
2.0
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
mA
-40°C
+25°C
—
—
+60°C
VDD = 1.8V
VDD = 3.0V
2.5
5.0
3.5
3.5
+85°C
FOSC = 31 kHz
(RC_IDLE mode,
LFINTOSC source)
+125°C
-40°C
D046
+25°C
+60°C
4.0
7.0
+85°C
+125°C
-40°C
D047
D048
D049
+25°C
VDD = 1.8V
VDD = 3.0V
VDD = 5.0V
+85°C
+125°C
-40°C
FOSC = 31 kHz
(RC_IDLE mode,
LFINTOSC source)
+25°C
+85°C
+125°C
-40°C
+25°C
+85°C
+125°C
-40°C to +125°C
D050
D051
VDD = 1.8V
VDD = 3.0V
FOSC = 500 KHz
(RC_IDLE mode,
MFINTOSC source)
-40°C to +125°C
mA
D052
D053
D054
D055
-40°C to +125°C
-40°C to +125°C
-40°C to +125°C
-40°C to +125°C
VDD = 1.8V
VDD = 3.0V
VDD = 5.0V
VDD = 1.8V
mA
mA
mA
mA
FOSC = 500 KHz
(RC_IDLE mode,
MFINTOSC source)
0.3
0.4
FOSC = 1 MHz
(RC_IDLE mode,
HFINTOSC source)
D056
-40°C to +125°C
VDD = 3.0V
mA
Note 1: The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as
I/O pin loading and switching rate, oscillator type and circuit, internal code execution pattern and temper-
ature, also have an impact on the current consumption.
The test conditions for all IDD measurements in active operation mode are:
OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD;
MCLR = VDD; WDT enabled/disabled as specified.
2: For RC oscillator configurations, current through REXT is not included. The current through the resistor can
be estimated by the formula Ir = VDD/2REXT (mA) with REXT in k.
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 431
PIC18(L)F2X/4XK22
27.4 DC Characteristics: RC Idle Supply Current, PIC18(L)F2X/4XK22 (Continued)
Standard Operating Conditions (unless otherwise stated)
PIC18LF2X/4XK22
Operating temperature
-40°C TA +125°C
Standard Operating Conditions (unless otherwise stated)
PIC18F2X/4XK22
Param
Operating temperature
-40°C TA +125°C
Device Characteristics
Typ Max Units
Conditions
No.
D057
D058
D059
D060
-40°C to +125°C
VDD = 1.8V
VDD = 3.0V
VDD = 5.0V
VDD = 1.8V
mA
mA
mA
mA
FOSC = 1 MHz
(RC_IDLE mode,
HFINTOSC source)
-40°C to +125°C
-40°C to +125°C
-40°C to +125°C
1.0
1.6
FOSC = 16 MHz
(RC_IDLE mode,
HFINTOSC source)
D061
-40°C to +125°C
VDD = 3.0V
mA
D062
D063
D064
D065
-40°C to +125°C
-40°C to +125°C
-40°C to +125°C
-40°C to +125°C
VDD = 1.8V
VDD = 3.0V
VDD = 5.0V
VDD = 1.8V
mA
mA
mA
mA
FOSC = 16 MHz
(RC_IDLE mode,
HFINTOSC source)
FOSC = 64 MHz
(RC_IDLE mode,
HFINTOSC source)
D066
-40°C to +125°C
VDD = 3.0V
mA
D067
D068
D069
-40°C to +125°C
-40°C to +125°C
-40°C to +125°C
VDD = 1.8V
VDD = 3.0V
VDD = 5.0V
mA
mA
mA
FOSC = 64 MHz
(RC_IDLE mode,
HFINTOSC source)
Note 1: The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as
I/O pin loading and switching rate, oscillator type and circuit, internal code execution pattern and temper-
ature, also have an impact on the current consumption.
The test conditions for all IDD measurements in active operation mode are:
OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD;
MCLR = VDD; WDT enabled/disabled as specified.
2: For RC oscillator configurations, current through REXT is not included. The current through the resistor can
be estimated by the formula Ir = VDD/2REXT (mA) with REXT in k.
DS41412A-page 432
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
27.5 DC Characteristics: Primary Run Supply Current, PIC18(L)F2X/4XK22
PIC18LF2X/4XK22
PIC18F2X/4XK22
Param
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C TA +125°C
Standard Operating Conditions (unless otherwise stated)
Operating temperature
-40°C TA +125°C
Device Characteristics
Supply Current (IDD)(1) (2)
Typ Max Units
Conditions
No.
D070
D071
0.25
0.50
mA -40°C to +125°C
VDD = 1.8V
VDD = 3.0V
FOSC = 1 MHz
(PRI_RUN,
EC oscillator)
mA -40°C to +125°C
D072
D073
D074
mA -40°C to +125°C
mA -40°C to +125°C
mA -40°C to +125°C
mA -40°C to +125°C
VDD = 1.8V
VDD = 3.0V
VDD = 5.0V
VDD = 1.8V
FOSC = 1 MHz
(PRI_RUN,
EC oscillator)
0.30
0.30
2.70
D075
D076
FOSC = 20 MHz
(PRI_RUN,
EC oscillator)
4.30
mA -40°C to +125°C
VDD = 3.0V
D077
D078
D079
D080
mA -40°C to +125°C
mA -40°C to +125°C
mA -40°C to +125°C
VDD = 1.8V
VDD = 3.0V
VDD = 5.0V
FOSC = 20 MHz
(PRI_RUN,
EC oscillator)
3.36
3.44
FOSC = 64 MHz
(PRI_RUN,
12.20
mA -40°C to +125°C
VDD = 3.0V
EC oscillator)
D081
D082
8.63
10.22
2.10
mA -40°C to +125°C
mA -40°C to +125°C
mA -40°C to +125°C
VDD = 3.0V
VDD = 5.0V
VDD = 1.8V
FOSC = 64 MHz
(PRI_RUN,
EC oscillator)
D083
D084
FOSC = 4 MHz
16 MHz Internal
(PRI_RUN + PLL,
HFINTOSC)
4.20
mA -40°C to +125°C
VDD = 3.0V
D085
D086
D087
mA -40°C to +125°C
mA -40°C to +125°C
VDD = 1.8V
VDD = 3.0V
FOSC = 4 MHz
16 MHz Internal
(PRI_RUN + PLL,
HFINTOSC)
mA -40°C to +125°C
VDD = 5.0V
D088
FOSC = 16 MHz
64 MHz Internal
(PRI_RUN + PLL,
HFINTOSC)
12.20
mA -40°C to +125°C
VDD = 3.0V
Note 1: The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as
I/O pin loading and switching rate, oscillator type and circuit, internal code execution pattern and temper-
ature, also have an impact on the current consumption.
The test conditions for all IDD measurements in active operation mode are:
OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD;
MCLR = VDD; WDT enabled/disabled as specified.
2: The test conditions for all IDD measurements in active operation mode are:
All I/O pins set as outputs driven to VSS;
MCLR = VDD;
OSC1 = external square wave, from rail-to-rail (PRI_RUN and PRI-IDLE only).
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 433
PIC18(L)F2X/4XK22
27.5 DC Characteristics: Primary Run Supply Current, PIC18(L)F2X/4XK22 (Continued)
PIC18LF2X/4XK22
PIC18F2X/4XK22
Param
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C TA +125°C
Standard Operating Conditions (unless otherwise stated)
Operating temperature
-40°C TA +125°C
Device Characteristics
Typ Max Units
Conditions
No.
D089
D090
mA -40°C to +125°C
mA -40°C to +125°C
VDD = 3.0V
VDD = 5.0V
FOSC = 16 MHz
64 MHz Internal
(PRI_RUN + PLL,
HFINTOSC)
Note 1: The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as
I/O pin loading and switching rate, oscillator type and circuit, internal code execution pattern and temper-
ature, also have an impact on the current consumption.
The test conditions for all IDD measurements in active operation mode are:
OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD;
MCLR = VDD; WDT enabled/disabled as specified.
2: The test conditions for all IDD measurements in active operation mode are:
All I/O pins set as outputs driven to VSS;
MCLR = VDD;
OSC1 = external square wave, from rail-to-rail (PRI_RUN and PRI-IDLE only).
DS41412A-page 434
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
27.6 DC Characteristics: Primary Idle Supply Current, PIC18(L)F2X/4XK22
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C TA +125°C
PIC18LF2X/4XK22
Standard Operating Conditions (unless otherwise stated)
PIC18F2X/4XK22
Param
Operating temperature
-40°C TA +125°C
Device Characteristics
Typ Max Units
Conditions
No.
D100
D101
Supply Current (IDD)(1) (2)
0.05
0.09
mA
mA
FOSC = 1 MHz
(PRI_IDLE mode,
EC oscillator)
-40°C to +125°C
-40°C to +125°C
VDD = 1.8V
VDD = 3.0V
D102
D103
D104
D105
D106
-40°C to +125°C
-40°C to +125°C
-40°C to +125°C
-40°C to +125°C
VDD = 1.8V
VDD = 3.0V
VDD = 5.0V
VDD = 1.8V
mA
mA
mA
mA
FOSC = 1 MHz
(PRI_IDLE mode,
EC oscillator)
1.20
1.80
FOSC = 20 MHz
(PRI_IDLEmode,
EC oscillator)
-40°C to +125°C
VDD = 3.0V
mA
D107
D108
D109
D110
-40°C to +125°C
-40°C to +125°C
-40°C to +125°C
VDD = 1.8V
VDD = 3.0V
VDD = 5.0V
mA
mA
mA
FOSC = 20 MHz
(PRI_IDLEmode,
EC oscillator)
FOSC = 64 MHz
(PRI_IDLEmode,
EC oscillator)
-40°C to +125°C
VDD = 3.0V
5.60
mA
D111
D112
-40°C to +125°C
-40°C to +125°C
-40°C to +125°C
VDD = 3.0V
VDD = 5.0V
VDD = 1.8V
mA
mA
mA
FOSC = 64 MHz
(PRI_IDLEmode,
EC oscillator)
D113
D114
FOSC = 4 MHz
16 MHz Internal
(PRI_IDLE + PLL,
HFINTOSC)
-40°C to +125°C
VDD = 3.0V
mA
D115
D116
D117
-40°C to +125°C
-40°C to +125°C
VDD = 1.8V
VDD = 3.0V
mA
mA
FOSC = 4 MHz
16 MHz Internal
(PRI_IDLE + PLL,
HFINTOSC)
-40°C to +125°C
VDD = 5.0V
mA
D118
FOSC = 16 MHz
64 MHz Internal
(PRI_IDLE + PLL,
HFINTOSC)
-40°C to +125°C
VDD = 3.0V
mA
D119
D120
-40°C to +125°C
-40°C to +125°C
VDD = 3.0V
VDD = 5.0V
mA
mA
FOSC = 16 MHz
64 MHz Internal
(PRI_IDLE + PLL,
HFINTOSC)
Note 1: The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as
I/O pin loading and switching rate, oscillator type and circuit, internal code execution pattern and temper-
ature, also have an impact on the current consumption.
2: The test conditions for all IDD measurements in active operation mode are:
All I/O pins set as outputs driven to VSS;
MCLR = VDD;
OSC1 = external square wave, from rail-to-rail (PRI_RUN and PRI-IDLE only).
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 435
PIC18(L)F2X/4XK22
27.7 DC Characteristics: Secondary Oscillator Supply Current, PIC18(L)F2X/4XK22
Standard Operating Conditions (unless otherwise stated)
PIC18LF2X/4XK22
Operating temperature
-40°C TA +125°C
Standard Operating Conditions (unless otherwise stated)
PIC18F2X/4XK22
Param
Operating temperature
-40°C TA +125°C
Device Characteristics
Typ Max Units
Conditions
No.
Supply Current (IDD)(1) (2)
D130
5.5
5.5
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
-40°C
+25°C
+60°C
+85°C
+125°C
-40°C
—
VDD = 1.8V
VDD = 3.0V
6.5
FOSC = 32 kHz
(SEC_RUN mode,
SOSC source)
D131
10.0
10.0
+25°C
+60°C
+85°C
+125°C
-40°C
11.0
D132
D133
D134
+25°C
+85°C
+125°C
-40°C
VDD = 1.8V
VDD = 3.0V
VDD = 5.0V
FOSC = 32 kHz
(SEC_RUN mode,
SOSC source)
130.0
140.0
+25°C
+85°C
+125°C
-40°C
+25°C
+85°C
+125°C
Note 1: The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as
I/O pin loading and switching rate, oscillator type and circuit, internal code execution pattern and temper-
ature, also have an impact on the current consumption.
2: The test conditions for all IDD measurements in active operation mode are:
All I/O pins set as outputs driven to VSS;
MCLR = VDD;
OSC1 = external square wave, from rail-to-rail (PRI_RUN and PRI-IDLE only).
3: Low-Power mode on T1 osc. Low-Power mode is limited to 85°C.
DS41412A-page 436
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
27.7 DC Characteristics: Secondary Oscillator Supply Current, PIC18(L)F2X/4XK22
Standard Operating Conditions (unless otherwise stated)
PIC18LF2X/4XK22
Operating temperature
-40°C TA +125°C
Standard Operating Conditions (unless otherwise stated)
PIC18F2X/4XK22
Param
Operating temperature
-40°C TA +125°C
Device Characteristics
Typ Max Units
Conditions
No.
D135
2.0
2.0
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
-40°C
+25°C
+60°C
+85°C
+125°C
-40°C
VDD = 1.8V
VDD = 3.0V
2.5
FOSC = 32 kHz
(SEC_IDLE mode,
SOSC source)
D136
3.5
3.5
+25°C
+60°C
+85°C
+125°C
-40°C
4.0
D137
D138
D139
+25°C
+85°C
+125°C
-40°C
VDD = 1.8V
VDD = 3.0V
VDD = 5.0V
FOSC = 32 kHz
(SEC_IDLE mode,
SOSC source)
+25°C
+85°C
+125°C
-40°C
+25°C
+85°C
+125°C
Note 1: The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as
I/O pin loading and switching rate, oscillator type and circuit, internal code execution pattern and temper-
ature, also have an impact on the current consumption.
2: The test conditions for all IDD measurements in active operation mode are:
All I/O pins set as outputs driven to VSS;
MCLR = VDD;
OSC1 = external square wave, from rail-to-rail (PRI_RUN and PRI-IDLE only).
3: Low-Power mode on T1 osc. Low-Power mode is limited to 85°C.
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 437
PIC18(L)F2X/4XK22
27.8 DC Characteristics:Input/Output Characteristics, PIC18(L)F2X/4XK22
Standard Operating Conditions (unless otherwise stated)
DC CHARACTERISTICS
Operating temperature -40°C TA +125°C
Param
No.
Symbol
Characteristic
Min
Typ†
Max
Units
Conditions
VIL
Input Low Voltage
I/O ports:
D140
D141
D142
D143
with TTL buffer
with Schmitt Trigger
MCLR
—
—
—
—
V
V
V
V
OSC1
HS, HSPLL modes
D144
D145
D146
OSC1
OSC1
TXCKI
—
—
—
V
V
V
RC, EC modes(1)
XT, LP modes
VIH
Input High Voltage
I/O ports:
D147
D148
with TTL buffer
with Schmitt Trigger:
—
V
VIH
VIH
—
—
V
V
2.4V < VDD < 3.6V
VDD < 2.4V
—
—
V
V
2.4V < VDD < 3.6V
VDD < 2.4V
D149
D150
MCLR
OSC1
—
V
HS, HSPLL modes
D151
D152
D153
D154
OSC1
OSC1
OSC1
TXCKI
—
—
—
—
V
V
V
V
EC mode
RC mode(1)
XT, LP modes
IIL
Input Leakage I/O and
MCLR(2,3)
VSS VPIN VDD,
Pin at high-
impedance
D155
D156
D157
I/O ports
5
10
30
100
nA +25°C
nA +60°C
nA +85°C
nA +125°C
Input Leakage RA2
IIL
IIL
10
35
200
400
nA +25°C
nA +60°C
nA +85°C
nA +125°C
Input Leakage RA3
10
25
70
nA +25°C
nA +60°C
nA +85°C
nA +125°C
300
Note 1: In RC oscillator configuration, the OSC1/CLKIN pin is a Schmitt Trigger input. It is not recommended that
the PIC® device be driven with an external clock while in RC mode.
2: The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified
levels represent normal operating conditions. Higher leakage current may be measured at different input
voltages.
3: Negative current is defined as current sourced by the pin.
4: Parameter is characterized but not tested.
DS41412A-page 438
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
27.8 DC Characteristics:Input/Output Characteristics, PIC18(L)F2X/4XK22 (Continued)
Standard Operating Conditions (unless otherwise stated)
DC CHARACTERISTICS
Operating temperature -40°C TA +125°C
Param
No.
Symbol
Characteristic
Min
Typ†
Max
Units
Conditions
IPU
Weak Pull-up Current
D158
IPURB
PORTB weak pull-up
current
90
A VDD = 3.0V, VPIN =
VSS
VOL
Output Low Voltage
D159
D160
I/O ports
—
—
V
V
IOL = 8.5 mA, VDD
= 3.0V,
-40C to +85C
OSC2/CLKOUT
(RC, RCIO, EC, ECIO
modes)
IOL = 1.6 mA, VDD
= 3.0V,
-40C to +85C
VOH
Output High Voltage(3)
D161
D162
I/O ports
—
—
V
V
IOH = -3.0 mA, VDD
= 3.0V,
-40C to +85C
OSC2/CLKOUT
(RC, RCIO, EC, ECIO
modes)
IOH = -1.3 mA, VDD
= 3.0V,
-40C to +85C
Capacitive Loading
Specs
on Output Pins
D163(4)
COSC2
OSC2 pin
—
pF In XT, HS and LP
modes when
external clock is
used to drive
OSC1
D164
D165
CIO
CB
All I/O pins and OSC2
(in RC mode)
—
—
pF To meet the AC
Timing
Specifications
pF I2C™ Specifica-
SCL, SDA
tion
Note 1: In RC oscillator configuration, the OSC1/CLKIN pin is a Schmitt Trigger input. It is not recommended that
the PIC® device be driven with an external clock while in RC mode.
2: The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified
levels represent normal operating conditions. Higher leakage current may be measured at different input
voltages.
3: Negative current is defined as current sourced by the pin.
4: Parameter is characterized but not tested.
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 439
PIC18(L)F2X/4XK22
27.9 Memory Programming Requirements
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C TA +125°C
DC CHARACTERISTICS
Param
Sym
No.
Characteristic
Min
Typ†
Max
Units
Conditions
Internal Program Memory
Programming Specifications
(1)
D170
D171
VPP
Voltage on MCLR/VPP/RE3 pin
VDD + 4.5
—
—
—
9
V
(Note 3), (Note 4)
IDDP
Supply Current during
Programming
10
mA
Data EEPROM Memory
D172
D173
ED
Byte Endurance
100K
1.8
—
—
—
E/W -40C to +85C
VDRW VDD for Read/Write (PIC16LF)
3.6
V
Using EECON to
read/write
D174
D175
D176
VDRW VDD for Read/Write (PIC16F)
TDEW Erase/Write Cycle Time
TRETD Characteristic Retention
1.8
—
—
4
5.5
—
V
ms
40
—
—
Year Provided no other
specifications are violated
D177
TREF
Number of Total Erase/Write
Cycles before Refresh
1M
10M
—
E/W -40°C to +85°C
(2)
Program Flash Memory
Cell Endurance
D178
D179
D180
D181
EP
10K
1.8
1.8
2.2
—
—
—
—
—
E/W -40C to +85C (Note 5)
VPR
VPR
VIW
VDD for Read (PIC16LF)
VDD for Read (PIC16F)
3.6
5.5
3.6
V
V
V
VDD for Row Erase or Write
(PIC16LF)
D182
VIW
TIW
VDD for Row Erase or Write
(PIC16F)
2.2
—
5.5
V
D183
D184
Self-timed Write Cycle Time
—
2
—
—
ms
TRETD Characteristic Retention
40
—
Year Provided no other
specifications are violated
†
Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance
only and are not tested.
Note 1: These specifications are for programming the on-chip program memory through the use of table write instruc-
tions.
2: Refer to Section 7.8 “Using the Data EEPROM” for a more detailed discussion on data EEPROM
endurance.
3: Required only if single-supply programming is disabled.
4: The MPLAB ICD 2 does not support variable VPP output. Circuitry to limit the ICD 2 VPP voltage must be
placed between the ICD 2 and target system when programming or debugging with the ICD 2.
5: Self-write and Block Erase.
DS41412A-page 440
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
27.10 Analog Characteristics
TABLE 27-1: COMPARATOR SPECIFICATIONS
Operating Conditions: 1.8V < VDD < 5.5V, -40°C < TA < +125°C (unless otherwise stated)
Param
No.
Sym
Characteristics
Input Offset Voltage
Min
Typ
Max
Units
Comments
CM01
VIOFF
—
—
12
18
mV
mV
V
High-Power mode
Low-Power mode
CM02
CM03
CM04
VICM
Input Common-mode Voltage
Common-mode Rejection Ratio
Response Time
—
VDD
—
CMRR
TRESP
—
dB
ns
ns
s
(1)
—
—
—
200
300
—
High-Power mode
Low-Power mode
CM05
TMC2OV
Comparator Mode Change to
Output Valid*
*
These parameters are characterized but not tested.
Note 1: Response time measured with one comparator input at VDD/2, while the other input transitions from VSS to VDD.
TABLE 27-2: DIGITAL-TO-ANALOG CONVERTER (DAC) SPECIFICATIONS
Operating Conditions: 1.8V < VDD < 5.5V, -40°C < TA < +125°C (unless otherwise stated)
Param
No.
Sym
Characteristics
Step Size(2)
Min
Typ
Max
Units
Comments
CV01*
CLSB
—
—
VDD/24
VDD/32
—
—
V
V
CV02*
CV03*
CV04*
CACC
CR
Absolute Accuracy
Unit Resistor Value (R)
Settling Time(1)
—
—
—
—
3k
—
1/2
—
LSb
CST
10
s
*
These parameters are characterized but not tested.
Note 1: Settling time measured while CVRR = 1and CVR3:CVR0 transitions from ‘0000’ to ‘1111’.
2: See Section 22.0 “Digital-to-Analog Converter (DAC) Module” for more information.
TABLE 27-3:
FIXED VOLTAGE REFERENCE (FVR) SPECIFICATIONS
Operating Conditions: 1.8V < VDD < 3.6V, -40°C < TA < +125°C (unless otherwise stated)
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C TA +125°C
VR Voltage Reference Specifications
Param
No.
Sym
Characteristics
Min
Typ
Max
Units
Comments
VR01
VROUT
VR voltage output
1.15
1.10
—
1.024
1.024
<50
1.25
1.30
—
V
V
-40°C to +85°C
+85°C to +125°C
VR02*
VR03*
VR04*
TCVOUT Voltage drift temperature
coefficient
ppm/C -40°C to +40°C
VROUT/ Voltage drift with respect to
—
—
<2000
25
—
V/V
s
25°C, 2.0 to 3.3V
0 to 125°C
VDD
VDD regulation
TSTABLE Settling Time
100
*
These parameters are characterized but not tested.
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 441
PIC18(L)F2X/4XK22
FIGURE 27-2:
HIGH/LOW-VOLTAGE DETECT CHARACTERISTICS
VDD
(HLVDIF can be
cleared by software)
VHLVD
(HLVDIF set by hardware)
HLVDIF
TABLE 27-4: HIGH/LOW-VOLTAGE DETECT CHARACTERISTICS
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C TA +125°C
Param
No.
Symbol
Characteristic
HLVDL<3:0>
Min
Typ† Max
Units
Conditions
HLVD Voltage on VDD
Transition High-to-
Low
0000
0001
0010
0011
0100
0101
0110
0111
1000
1001
1010
1011
1100
1101
1110
1111
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
v
V(HLVDIN pin)
Production tested at TAMB = 25°C. Specifications over temperature limits ensured by characterization.
†
DS41412A-page 442
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
27.11 AC (Timing) Characteristics
27.11.1 TIMING PARAMETER SYMBOLOGY
The timing parameter symbols have been created
using one of the following formats:
1. TppS2ppS
2. TppS
T
3. TCC:ST
4. Ts
(I2C™ specifications only)
(I2C specifications only)
F
Frequency
T
Time
Lowercase letters (pp) and their meanings:
pp
cc
ck
cs
di
CCP1
CLKOUT
CS
osc
rd
OSC1
RD
rw
sc
ss
t0
RD or WR
SCK
SDI
do
dt
SDO
SS
Data in
I/O port
MCLR
T0CKI
T13CKI
WR
io
t1
mc
wr
Uppercase letters and their meanings:
S
F
Fall
P
R
V
Z
Period
H
High
Rise
I
L
Invalid (High-impedance)
Low
Valid
High-impedance
I2C only
AA
output access
Bus free
High
Low
High
Low
BUF
TCC:ST (I2C specifications only)
CC
HD
Hold
SU
Setup
ST
DAT
STA
DATA input hold
Start condition
STO
Stop condition
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 443
PIC18(L)F2X/4XK22
27.11.2 TIMING CONDITIONS
The temperature and voltages specified in Table 27-5
apply to all timing specifications unless otherwise
noted. Figure 27-3 specifies the load conditions for the
timing specifications.
TABLE 27-5: TEMPERATURE AND VOLTAGE SPECIFICATIONS – AC
Standard Operating Conditions (unless otherwise stated)
Operating temperature
Operating voltage VDD range as described in DC spec Section 27.1 and
-40°C TA +125°C
AC CHARACTERISTICS
Section 27.9.
FIGURE 27-3:
LOAD CONDITIONS FOR DEVICE TIMING SPECIFICATIONS
Load Condition 1 Load Condition 2
VDD/2
CL
RL
Pin
VSS
Legend:
CL
Pin
RL = 464
CL = 50 pF for all pins except OSC2/CLKOUT
and including D and E outputs as ports
VSS
DS41412A-page 444
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
27.11.3 TIMING DIAGRAMS AND SPECIFICATIONS
FIGURE 27-4:
EXTERNAL CLOCK TIMING (ALL MODES EXCEPT PLL)
Q4
Q1
1
Q2
Q3
Q4
Q1
OSC1
3
4
3
4
2
CLKOUT
TABLE 27-6: EXTERNAL CLOCK TIMING REQUIREMENTS
Param.
Symbol
Characteristic
Min
Max
Units
Conditions
No.
1A
FOSC
External CLKIN
DC
64
MHz EC, ECIO Oscillator mode
Frequency(1)
Oscillator Frequency(1)
DC
0.1
4
4
4
MHz RC Oscillator mode
MHz XT Oscillator mode
MHz HS Oscillator mode
MHz HS + PLL Oscillator mode
kHz LP Oscillator mode
25
4
16
5
200
—
1
TOSC
External CLKIN Period(1)
Oscillator Period(1)
15.6
250
250
ns
ns
ns
EC, ECIO Oscillator mode
RC Oscillator mode
—
10,000
XT Oscillator mode
40
62.5
250
250
ns
ns
HS Oscillator mode
HS + PLL Oscillator mode,
5
62.5
30
2.5
10
—
200
—
s
ns
ns
s
ns
ns
ns
ns
LP Oscillator mode
TCY = 4/FOSC
2
3
TCY
Instruction Cycle Time(1)
TOSL,
TOSH
External Clock in (OSC1)
High or Low Time
—
XT Oscillator mode
LP Oscillator mode
HS Oscillator mode
XT Oscillator mode
LP Oscillator mode
HS Oscillator mode
—
—
4
TOSR,
TOSF
External Clock in (OSC1)
Rise or Fall Time
20
50
7.5
—
—
Note 1: Instruction cycle period (TCY) equals four times the input oscillator time base period for all configurations
except PLL. All specified values are based on characterization data for that particular oscillator type under
standard operating conditions with the device executing code. Exceeding these specified limits may result
in an unstable oscillator operation and/or higher than expected current consumption. All devices are tested
to operate at “min.” values with an external clock applied to the OSC1/CLKIN pin. When an external clock
input is used, the “max.” cycle time limit is “DC” (no clock) for all devices.
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 445
PIC18(L)F2X/4XK22
TABLE 27-7: PLL CLOCK TIMING SPECIFICATIONS (VDD = 1.8V TO 5.5V)
Param
Sym
Characteristic
Min
Typ†
Max Units
Conditions
No.
F10
FOSC Oscillator Frequency Range
4
4
—
—
5
MHz VDD = 1.8-3.0V
MHz VDD = 3.0-3.6V,
16
-40°C to +125°C
PIC16LF2X/4XK22
4
—
16
MHz VDD = 3.0-5.5V,
-40°C to +125°C
PIC16F2X/4XK22
F11
FSYS On-Chip VCO System Frequency
16
16
—
—
20
64
MHz VDD = 1.8-3.0V
MHz VDD = 3.0-3.6V,
-40°C to +125°C
PIC16LF2X/4XK22
16
—
64
MHz VDD = 3.0-5.5V,
-40°C to +125°C
PIC16F2X/4XK22
F12
F13
trc
PLL Start-up Time (Lock Time)
—
-2
—
—
2
ms
%
CLK CLKOUT Stability (Jitter)
+2
†
Data in “Typ” column is at 3V, 25C unless otherwise stated. These parameters are for design guidance
only and are not tested.
TABLE 27-8: AC CHARACTERISTICS:INTERNAL OSCILLATORS ACCURACY PIC18(L)F46K22
Standard Operating Conditions (unless otherwise stated)
PIC18(L)F46K22
Operating temperature
-40°C TA +125°C
Param
No.
Min
Typ
Max
Units
Conditions
OA1
HFINTOSC Accuracy @ Freq = 16 MHz, 8 MHz, 4 MHz, 2 MHz, 1 MHz, 500 kHz, 250 kHz(1)
-2
-3
-5
0
+2
+2
+5
%
%
%
+0°C to +70°C
+70°C to +85°C
—
—
-40°C to 0°C and
+85°C to 125°C
OA2
LFINTOSC Accuracy @ Freq = 31 kHz
26.562
—
35.938 kHz -40°C to +125°C
Legend: Shading of rows is to assist in readability of the table.
Note 1: Frequency calibrated at 25°C. OSCTUNE register can be used to compensate for temperature drift.
DS41412A-page 446
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
FIGURE 27-5:
CLKOUT AND I/O TIMING
Q1
Q2
Q3
Q4
OSC1
11
10
CLKOUT
13
12
19
18
14
16
I/O pin
(Input)
15
17
I/O pin
(Output)
New Value
Old Value
20, 21
Note:
Refer to Figure 27-3 for load conditions.
TABLE 27-9: CLKOUT AND I/O TIMING REQUIREMENTS
Param
No.
Symbol
Characteristic
Min
Typ
Max
Units Conditions
10
TosH2ckL OSC1 to CLKOUT
TosH2ckH OSC1 to CLKOUT
—
—
—
—
—
75
75
35
35
—
—
—
50
—
200
ns
ns
ns
ns
ns
ns
ns
ns
ns
(Note 1)
(Note 1)
(Note 1)
(Note 1)
(Note 1)
(Note 1)
(Note 1)
11
12
13
14
15
16
17
18
200
TckR
CLKOUT Rise Time
100
TckF
CLKOUT Fall Time
100
TckL2ioV
CLKOUT to Port Out Valid
0.5 TCY + 20
TioV2ckH Port In Valid before CLKOUT
0.25 TCY + 25
—
—
TckH2ioI
TosH2ioV
TosH2ioI
Port In Hold after CLKOUT
0
OSC1 (Q1 cycle) to Port Out Valid
—
150
—
OSC1 (Q2 cycle) to Port Input Invalid
100
(I/O in hold time)
19
TioV2osH Port Input Valid to OSC1 (I/O in setup time)
0
—
—
10
10
—
—
—
25
25
—
—
ns
ns
ns
ns
ns
20
TioR
TioF
TINP
TRBP
Port Output Rise Time
21
Port Output Fall Time
—
22†
23†
INTx pin High or Low Time
RB<7:4> Change KBIx High or Low Time
20
TCY
†
These parameters are asynchronous events not related to any internal clock edges.
Note 1: Measurements are taken in RC mode, where CLKOUT output is 4 x TOSC.
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 447
PIC18(L)F2X/4XK22
FIGURE 27-6:
RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER AND
POWER-UP TIMER TIMING
VDD
MCLR
30
Internal
POR
33
PWRT
Time-out
32
OSC
Time-out
Internal
Reset
Watchdog
Timer
Reset
31
34
34
I/O pins
Note:
Refer to Figure 27-3 for load conditions.
FIGURE 27-7:
BROWN-OUT RESET TIMING
BVDD
VDD
35
VBGAP = 1.2V
VIVRST
Enable Internal
Reference Voltage
Internal Reference
Voltage Stable
36
TABLE 27-10: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER, POWER-UP TIMER
AND BROWN-OUT RESET REQUIREMENTS
Param.
No.
Symbol
Characteristic
Min
Typ
Max
Units
Conditions
30
TmcL
TWDT
MCLR Pulse Width (low)
2
—
—
s
31
32
Watchdog Timer Time-out Period
(no postscaler)
3.5
4.1
4.7
ms 1:1 prescaler
TOST
Oscillation Start-up Timer Period
1024
TOSC
—
1024 TOSC
—
TOSC = OSC1 period
33
34
TPWRT Power-up Timer Period
54.8
—
64.4
2
74.1
—
ms
TIOZ
I/O High-Impedance from MCLR
s
Low or Watchdog Timer Reset
35
TBOR
Brown-out Reset Pulse Width
200
—
—
s
VDD BVDD (see
D005)
36
37
TIVRST
THLVD
Internal Reference Voltage Stable
—
25
—
35
—
s
s
High/Low-Voltage Detect Pulse
Width
200
VDD VHLVD
DS41412A-page 448
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
TABLE 27-10: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER, POWER-UP TIMER
AND BROWN-OUT RESET REQUIREMENTS
Param.
No.
Symbol
Characteristic
Min
Typ
Max
Units
Conditions
38
TCSD
CPU Start-up Time
5
—
10
1
s
39
TIOBST Time for HF-INTOSC to Stabilize
—
0.25
ms
FIGURE 27-8:
TIMER0 AND TIMER1 EXTERNAL CLOCK TIMINGS
T0CKI
41
40
42
T1OSO/T13CKI
46
45
47
48
TMR0 or
TMR1
Note:
Refer to Figure 27-3 for load conditions.
TABLE 27-11: TIMER0 AND TIMER1/3/5 EXTERNAL CLOCK REQUIREMENTS
Param
No.
Symbol
Tt0H
Characteristic
T0CKI High Pulse Width
Min
Max
Units Conditions
40
No prescaler
With prescaler
No prescaler
With prescaler
No prescaler
With prescaler
0.5 TCY + 20
10
—
—
—
—
—
—
ns
ns
ns
ns
ns
41
42
Tt0L
Tt0P
T0CKI Low Pulse Width
T0CKI Period
0.5 TCY + 20
10
TCY + 10
Greater of:
20 ns or
ns
N = prescale
value
(TCY + 40)/N
(1, 2, 4,..., 256)
45
46
47
Tt1H
Tt1L
TxCKI High
Time
Synchronous, no prescaler
0.5 TCY + 20
10
—
—
ns
ns
Synchronous,
with prescaler
Asynchronous
30
0.5 TCY + 5
10
—
—
—
ns
ns
ns
TxCKI Low
Time
Synchronous, no prescaler
Synchronous,
with prescaler
Asynchronous
Synchronous
30
—
—
ns
ns
Tt1P
Ft1
TxCKI Input
Period
Greater of:
20 ns or
(TCY + 40)/N
N = prescale
value (1, 2, 4, 8)
Asynchronous
60
—
ns
TxCKI Clock Input Frequency Range
DC
50
kHz
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 449
PIC18(L)F2X/4XK22
TABLE 27-11: TIMER0 AND TIMER1/3/5 EXTERNAL CLOCK REQUIREMENTS
Param
No.
Symbol
Characteristic
Min
Max
Units Conditions
48
Tcke2tmrI Delay from External TxCKI Clock Edge to Timer
Increment
2 TOSC
7 TOSC
—
FIGURE 27-9:
CAPTURE/COMPARE/PWM TIMINGS (ALL CCP MODULES)
CCPx
(Capture Mode)
50
51
52
54
CCPx
(Compare or PWM Mode)
53
Note:
Refer to Figure 27-3 for load conditions.
DS41412A-page 450
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
TABLE 27-12: CAPTURE/COMPARE/PWM REQUIREMENTS (ALL CCP MODULES)
Param
No.
Symbol
Characteristic
Min
Max
Units
Conditions
50
51
52
TccL
CCPx Input Low No prescaler
0.5 TCY + 20
10
—
—
ns
ns
Time
With
prescaler
TccH
TccP
CCPx Input
High Time
No prescaler
0.5 TCY + 20
10
—
—
ns
ns
With
prescaler
CCPx Input Period
3 TCY + 40
N
—
ns
N = prescale
value (1, 4 or
16)
53
54
TccR
TccF
CCPx Output Fall Time
CCPx Output Fall Time
—
—
25
25
ns
ns
FIGURE 27-10:
EXAMPLE SPI MASTER MODE TIMING (CKE = 0)
SS
70
SCK
(CKP = 0)
71
72
78
79
79
SCK
(CKP = 1)
78
80
bit 6 - - - - - -1
MSb
LSb
SDO
SDI
75, 76
MSb In
74
bit 6 - - - -1
LSb In
73
Note: Refer to Figure 27-3 for load conditions.
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 451
PIC18(L)F2X/4XK22
TABLE 27-13: EXAMPLE SPI MODE REQUIREMENTS (MASTER MODE, CKE = 0)
Param
No.
Symbol
Characteristic
Min
Max Units Conditions
70
TssL2scH, SS to SCK or SCK Input
TCY
—
ns
TssL2scL
71
TscH
TscL
SCK Input High Time
(Slave mode)
Continuous
Single Byte
Continuous
Single Byte
1.25 TCY + 30
—
—
—
—
—
ns
71A
72
40
1.25 TCY + 30
40
ns (Note 1)
SCK Input Low Time
(Slave mode)
ns
72A
73
ns (Note 1)
TdiV2scH, Setup Time of SDI Data Input to SCK Edge
TdiV2scL
100
ns
73A
74
Tb2b
Last Clock Edge of Byte 1 to the 1st Clock Edge
of Byte 2
1.5 TCY + 40
100
—
—
ns (Note 2)
TscH2diL, Hold Time of SDI Data Input to SCK Edge
TscL2diL
ns
75
76
78
TdoR
TdoF
TscR
SDO Data Output Rise Time
SDO Data Output Fall Time
—
—
—
25
25
25
ns
ns
ns
SCK Output Rise Time
(Master mode)
79
80
TscF
SCK Output Fall Time (Master mode)
—
—
25
50
ns
ns
TscH2doV, SDO Data Output Valid after SCK Edge
TscL2doV
Note 1: Requires the use of Parameter #73A.
2: Only if Parameter #71A and #72A are used.
FIGURE 27-11:
EXAMPLE SPI MASTER MODE TIMING (CKE = 1)
SS
81
SCK
(CKP = 0)
71
72
79
78
73
SCK
(CKP = 1)
80
LSb
MSb
bit 6 - - - - - -1
SDO
SDI
75, 76
MSb In
74
bit 6 - - - -1
LSb In
Note: Refer to Figure 27-3 for load conditions.
DS41412A-page 452
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
TABLE 27-14: EXAMPLE SPI MODE REQUIREMENTS (MASTER MODE, CKE = 1)
Param.
No.
Symbol
TscH
TscL
Characteristic
Min
Max Units Conditions
71
SCK Input High Time
Continuous
Single Byte
Continuous
Single Byte
1.25 TCY + 30
—
—
—
—
—
ns
(Slave mode)
71A
72
40
1.25 TCY + 30
40
ns (Note 1)
SCK Input Low Time
(Slave mode)
ns
72A
73
ns (Note 1)
TdiV2scH, Setup Time of SDI Data Input to SCK Edge
TdiV2scL
100
ns
73A
74
Tb2b
Last Clock Edge of Byte 1 to the 1st Clock Edge
of Byte 2
1.5 TCY + 40
100
—
—
ns (Note 2)
TscH2diL,
TscL2diL
Hold Time of SDI Data Input to SCK Edge
ns
75
76
78
TdoR
TdoF
TscR
SDO Data Output Rise Time
SDO Data Output Fall Time
—
—
—
25
25
25
ns
ns
ns
SCK Output Rise Time
(Master mode)
79
80
TscF
SCK Output Fall Time (Master mode)
—
—
25
50
ns
ns
TscH2doV, SDO Data Output Valid after SCK Edge
TscL2doV
81
TdoV2scH, SDO Data Output Setup to SCK Edge
TdoV2scL
TCY
—
ns
Note 1: Requires the use of Parameter #73A.
2: Only if Parameter #71A and #72A are used.
FIGURE 27-12:
EXAMPLE SPI SLAVE MODE TIMING (CKE = 0)
SS
70
SCK
(CKP = 0)
83
71
72
78
79
79
SCK
(CKP = 1)
78
80
MSb
bit 6 - - - - - -1
LSb
SDO
SDI
77
75, 76
MSb In
74
bit 6 - - - -1
LSb In
73
Note:
Refer to Figure 27-3 for load conditions.
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 453
PIC18(L)F2X/4XK22
TABLE 27-15: EXAMPLE SPI MODE REQUIREMENTS (SLAVE MODE TIMING, CKE = 0)
Param
No.
Symbol
Characteristic
Min
Max Units Conditions
70
TssL2scH, SS to SCK or SCK Input
TCY
—
ns
TssL2scL
71
TscH
TscL
SCK Input High Time
(Slave mode)
Continuous
Single Byte
Continuous
Single Byte
1.25 TCY + 30
—
—
—
—
—
ns
ns
ns
ns
ns
71A
72
40
1.25 TCY + 30
40
(Note 1)
(Note 1)
SCK Input Low Time
(Slave mode)
72A
73
TdiV2scH, Setup Time of SDI Data Input to SCK Edge
TdiV2scL
100
73A
74
Tb2b
Last Clock Edge of Byte 1 to the First Clock Edge of Byte 2
Hold Time of SDI Data Input to SCK Edge
1.5 TCY + 40
100
—
—
ns
ns
(Note 2)
TscH2diL,
TscL2diL
75
76
77
78
79
80
TdoR
TdoF
SDO Data Output Rise Time
SDO Data Output Fall Time
—
—
10
—
—
—
25
25
50
25
25
50
ns
ns
ns
ns
ns
ns
TssH2doZ SS to SDO Output High-Impedance
TscR
TscF
SCK Output Rise Time (Master mode)
SCK Output Fall Time (Master mode)
TscH2doV, SDO Data Output Valid after SCK Edge
TscL2doV
83
TscH2ssH, SS after SCK edge
1.5 TCY + 40
—
ns
TscL2ssH
Note 1: Requires the use of Parameter #73A.
2: Only if Parameter #71A and #72A are used.
FIGURE 27-13:
EXAMPLE SPI SLAVE MODE TIMING (CKE = 1)
82
SS
70
SCK
83
(CKP = 0)
71
72
SCK
(CKP = 1)
80
MSb
bit 6 - - - - - -1
LSb
SDO
SDI
75, 76
77
MSb In
74
bit 6 - - - -1
LSb In
Note: Refer to Figure 27-3 for load conditions.
DS41412A-page 454
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
TABLE 27-16: EXAMPLE SPI SLAVE MODE REQUIREMENTS (CKE = 1)
Param
No.
Symbol
Characteristic
Min
Max Units Conditions
70
TssL2scH, SS to SCK or SCK Input
TCY
—
ns
TssL2scL
71
TscH
TscL
Tb2b
SCK Input High Time
(Slave mode)
Continuous
Single Byte
Continuous
Single Byte
1.25 TCY + 30
40
—
—
—
—
—
—
ns
ns
ns
ns
ns
ns
71A
72
(Note 1)
SCK Input Low Time
(Slave mode)
1.25 TCY + 30
40
72A
73A
74
(Note 1)
(Note 2)
Last Clock Edge of Byte 1 to the First Clock Edge of Byte 2
Hold Time of SDI Data Input to SCK Edge
1.5 TCY + 40
100
TscH2diL,
TscL2diL
75
76
77
78
TdoR
TdoF
SDO Data Output Rise Time
SDO Data Output Fall Time
—
—
10
—
25
25
50
25
ns
ns
ns
ns
TssH2doZ SS to SDO Output High-Impedance
TscR
SCK Output Rise Time
(Master mode)
79
80
TscF
SCK Output Fall Time (Master mode)
—
—
25
50
ns
ns
TscH2doV, SDO Data Output Valid after SCK Edge
TscL2doV
82
83
TssL2doV
SDO Data Output Valid after SS Edge
—
50
—
ns
ns
TscH2ssH, SS after SCK Edge
1.5 TCY + 40
TscL2ssH
Note 1: Requires the use of Parameter #73A.
2: Only if Parameter #71A and #72A are used.
FIGURE 27-14:
I2C™ BUS START/STOP BITS TIMING
SCL
SDA
91
93
90
92
Stop
Condition
Start
Condition
Note: Refer to Figure 27-3 for load conditions.
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 455
PIC18(L)F2X/4XK22
TABLE 27-17: I2C™ BUS START/STOP BITS REQUIREMENTS (SLAVE MODE)
Param.
Symbol
Characteristic
Min
Max
Units
Conditions
No.
90
TSU:STA Start Condition
Setup Time
100 kHz mode
400 kHz mode
100 kHz mode
400 kHz mode
100 kHz mode
400 kHz mode
100 kHz mode
400 kHz mode
4700
600
—
—
—
—
—
—
—
—
ns
Only relevant for Repeated
Start condition
91
92
93
THD:STA Start Condition
Hold Time
4000
600
ns
ns
ns
After this period, the first
clock pulse is generated
TSU:STO Stop Condition
Setup Time
4700
600
THD:STO Stop Condition
Hold Time
4000
600
FIGURE 27-15:
I2C™ BUS DATA TIMING
103
102
100
101
SCL
90
106
107
91
92
SDA
In
110
109
109
SDA
Out
Note: Refer to Figure 27-3 for load conditions.
DS41412A-page 456
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
TABLE 27-18: I2C™ BUS DATA REQUIREMENTS (SLAVE MODE)
Param. Symbo
Characteristic
100 kHz mode
Min
Max Units
Conditions
No.
l
100
THIGH
Clock High Time
4.0
—
—
s
s
Must operate at a minimum
of 1.5 MHz
400 kHz mode
0.6
Must operate at a minimum
of 10 MHz
SSP Module
1.5 TCY
4.7
—
—
101
TLOW
Clock Low Time
100 kHz mode
s
s
Must operate at a minimum
of 1.5 MHz
400 kHz mode
1.3
—
Must operate at a minimum
of 10 MHz
SSP Module
1.5 TCY
—
—
102
103
TR
TF
SDA and SCL Rise 100 kHz mode
1000
ns
ns
Time
400 kHz mode
20 + 0.1 CB 300
CB is specified to be from
10 to 400 pF
SDA and SCL Fall 100 kHz mode
Time
—
300
ns
ns
400 kHz mode
20 + 0.1 CB 300
CB is specified to be from
10 to 400 pF
90
TSU:ST Start Condition
Setup Time
100 kHz mode
400 kHz mode
100 kHz mode
400 kHz mode
100 kHz mode
400 kHz mode
100 kHz mode
400 kHz mode
100 kHz mode
400 kHz mode
100 kHz mode
400 kHz mode
100 kHz mode
400 kHz mode
4.7
0.6
4.0
0.6
0
—
—
s
s
s
s
ns
s
ns
ns
s
s
ns
ns
s
s
Only relevant for Repeated
Start condition
A
91
THD:ST Start Condition
Hold Time
—
After this period, the first
clock pulse is generated
A
—
106
107
92
THD:DA Data Input Hold
Time
—
T
0
0.9
—
TSU:DA Data Input Setup
Time
250
100
4.7
0.6
—
(Note 2)
T
—
TSU:ST Stop Condition
—
O
Setup Time
—
109
110
TAA
Output Valid from
Clock
3500
—
(Note 1)
—
TBUF
CB
Bus Free Time
4.7
1.3
—
Time the bus must be free
before a new transmission
can start
—
D102
Bus Capacitive Loading
—
400
pF
Note 1: As a transmitter, the device must provide this internal minimum delay time to bridge the undefined region
(min. 300 ns) of the falling edge of SCL to avoid unintended generation of Start or Stop conditions.
2: A fast mode I2C bus device can be used in a standard mode I2C bus system but the requirement,
TSU:DAT 250 ns, must then be met. This will automatically be the case if the device does not stretch the
LOW period of the SCL signal. If such a device does stretch the LOW period of the SCL signal, it must
output the next data bit to the SDA line, TR max. + TSU:DAT = 1000 + 250 = 1250 ns (according to the
standard mode I2C bus specification), before the SCL line is released.
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 457
PIC18(L)F2X/4XK22
FIGURE 27-16:
MASTER SSP I2C™ BUS START/STOP BITS TIMING WAVEFORMS
SCL
SDA
93
91
90
92
Stop
Condition
Start
Condition
Note: Refer to Figure 27-3 for load conditions.
TABLE 27-19: MASTER SSP I2C™ BUS START/STOP BITS REQUIREMENTS
Param
Unit
s
.
Symbol
Characteristic
Min
Max
Conditions
No.
90
TSU:STA Start Condition
Setup Time
100 kHz mode 2(TOSC)(BRG + 1)
400 kHz mode 2(TOSC)(BRG + 1)
1 MHz mode(1) 2(TOSC)(BRG + 1)
100 kHz mode 2(TOSC)(BRG + 1)
400 kHz mode 2(TOSC)(BRG + 1)
1 MHz mode(1) 2(TOSC)(BRG + 1)
100 kHz mode 2(TOSC)(BRG + 1)
400 kHz mode 2(TOSC)(BRG + 1)
1 MHz mode(1) 2(TOSC)(BRG + 1)
—
—
—
—
—
—
—
—
—
—
—
—
ns Only relevant for
Repeated Start
condition
91
92
93
THD:STA Start Condition
Hold Time
ns After this period, the
first clock pulse is
generated
TSU:STO Stop Condition
Setup Time
ns
THD:STO Stop Condition
Hold Time
100 kHz mode
2(TOSC)(BRG + 1)
ns
400 kHz mode 2(TOSC)(BRG + 1)
1 MHz mode(1) 2(TOSC)(BRG + 1)
Note 1: Maximum pin capacitance = 10 pF for all I2C pins.
FIGURE 27-17:
MASTER SSP I2C™ BUS DATA TIMING
103
102
100
101
SCL
90
106
91
92
107
SDA
In
110
109
109
SDA
Out
Note: Refer to Figure 27-3 for load conditions.
DS41412A-page 458
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
TABLE 27-20: MASTER SSP I2C™ BUS DATA REQUIREMENTS
Param.
No.
Symbol
Characteristic
Min
Max Units
Conditions
100
101
102
103
90
THIGH
Clock High Time 100 kHz mode 2(TOSC)(BRG + 1)
400 kHz mode 2(TOSC)(BRG + 1)
—
—
ms
ms
ms
ms
ms
ms
ns
1 MHz mode(1) 2(TOSC)(BRG + 1)
—
TLOW
TR
Clock Low Time 100 kHz mode 2(TOSC)(BRG + 1)
400 kHz mode 2(TOSC)(BRG + 1)
—
—
1 MHz mode(1) 2(TOSC)(BRG + 1)
—
SDA and SCL
Rise Time
100 kHz mode
400 kHz mode
1 MHz mode(1)
100 kHz mode
400 kHz mode
1 MHz mode(1)
—
1000
300
300
300
300
100
—
CB is specified to be
from
10 to 400 pF
20 + 0.1 CB
ns
—
ns
TF
SDA and SCL
Fall Time
—
20 + 0.1 CB
—
ns
CB is specified to be
from
10 to 400 pF
ns
ns
TSU:STA Start Condition 100 kHz mode 2(TOSC)(BRG + 1)
ms
ms
ms
ms
ms
ms
ns
Only relevant for
Repeated Start
condition
Setup Time
400 kHz mode 2(TOSC)(BRG + 1)
—
1 MHz mode(1) 2(TOSC)(BRG + 1)
—
91
THD:STA Start Condition 100 kHz mode 2(TOSC)(BRG + 1)
—
After this period, the first
clock pulse is generated
Hold Time
400 kHz mode 2(TOSC)(BRG + 1)
—
1 MHz mode(1) 2(TOSC)(BRG + 1)
—
106
107
92
THD:DAT Data Input
Hold Time
100 kHz mode
400 kHz mode
100 kHz mode
400 kHz mode
0
—
0
0.9
—
ms
ns
TSU:DAT Data Input
Setup Time
250
100
(Note 2)
—
ns
TSU:STO Stop Condition
Setup Time
100 kHz mode 2(TOSC)(BRG + 1)
400 kHz mode 2(TOSC)(BRG + 1)
1 MHz mode(1) 2(TOSC)(BRG + 1)
—
ms
ms
ms
ns
—
—
109
TAA
Output Valid
from Clock
100 kHz mode
400 kHz mode
1 MHz mode(1)
100 kHz mode
400 kHz mode
—
—
3500
1000
—
ns
—
ns
110
TBUF
CB
Bus Free Time
4.7
1.3
—
ms
ms
Time the bus must be
free before a new trans-
mission can start
—
D102
Bus Capacitive Loading
—
400
pF
Note 1: Maximum pin capacitance = 10 pF for all I2C pins.
2: A fast mode I2C bus device can be used in a standard mode I2C bus system, but parameter 107 250 ns
must then be met. This will automatically be the case if the device does not stretch the LOW period of the
SCL signal. If such a device does stretch the LOW period of the SCL signal, it must output the next data bit
to the SDA line, parameter 102 + parameter 107 = 1000 + 250 = 1250 ns (for 100 kHz mode), before the
SCL line is released.
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 459
PIC18(L)F2X/4XK22
FIGURE 27-18:
EUSART SYNCHRONOUS TRANSMISSION (MASTER/SLAVE) TIMING
TXx/CKx
pin
121
121
RXx/DTx
pin
120
Note: Refer to Figure 27-3 for load conditions.
122
TABLE 27-21: EUSART SYNCHRONOUS TRANSMISSION REQUIREMENTS
Param
Symbol
Characteristic
Min
Max
Units Conditions
No.
120
TckH2dtV SYNC XMIT (MASTER & SLAVE)
Clock High to Data Out Valid
—
—
40
20
ns
ns
121
122
Tckrf
Clock Out Rise Time and Fall Time
(Master mode)
Tdtrf
Data Out Rise Time and Fall Time
—
20
ns
FIGURE 27-19:
EUSART SYNCHRONOUS RECEIVE (MASTER/SLAVE) TIMING
TXx/CKx
pin
125
RXx/DTx
pin
126
Note: Refer to Figure 27-3 for load conditions.
TABLE 27-22: EUSART SYNCHRONOUS RECEIVE REQUIREMENTS
Param.
Symbol
Characteristic
Min
Max
Units
Conditions
No.
125
TdtV2ckl SYNC RCV (MASTER & SLAVE)
Data Setup before CK (DT setup time)
10
15
—
—
ns
ns
126
TckL2dtl
Data Hold after CK (DT hold time)
DS41412A-page 460
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
TABLE 27-23: A/D CONVERTER CHARACTERISTICS:PIC18(L)F2X/4XK22
Param
No.
Symbol
Characteristic
Resolution
Min
Typ
Max
Units
Conditions
A01
A03
A04
A06
A07
A08
A20
NR
—
—
10
bits -40°C to +85°C,
VREF 2.0V
EIL
Integral Linearity Error
Differential Linearity Error
Offset Error
—
—
—
—
—
±0.5
±0.4
0.4
0.3
1
—
—
—
—
—
LSb -40°C to +85°C,
VREF 2.0V
EDL
LSb -40°C to +85°C,
VREF 2.0V
EOFF
EGN
LSb -40°C to +85°C,
VREF 2.0V
Gain Error
LSb -40°C to +85°C,
VREF 2.0V
ETOTL
VREF
Total Error
LSb -40°C to +85°C,
VREF 2.0V
Reference Voltage Range
(VREFH – VREFL)
1.8
2.0
—
—
—
—
V
V
ABsolute Minimum
Minimum for 1LSb
Accuracy
A21
A22
A25
A30
VREFH
VREFL
VAIN
Reference Voltage High
Reference Voltage Low
Analog Input Voltage
VDD/2
VSS – 0.3V
VREFL
—
—
—
—
VDD + 0.3
VDD/2
VREFH
3
V
V
V
ZAIN
Recommended Impedance of
Analog Voltage Source
—
k -40°C to +85°C
Note 1: The A/D conversion result never decreases with an increase in the input voltage and has no missing
codes.
2: VREFH current is from RA3/AN3/VREF+ pin or VDD, whichever is selected as the VREFH source.
VREFL current is from RA2/AN2/VREF-/CVREF pin or VSS, whichever is selected as the VREFL source.
FIGURE 27-20:
A/D CONVERSION TIMING
BSF ADCON0, GO
(Note 2)
131
130
Q4
132
A/D CLK
. . .
.. .
9
8
7
2
1
0
A/D DATA
ADRES
NEW_DATA
TCY
OLD_DATA
ADIF
GO
DONE
SAMPLING STOPPED
SAMPLE
Note 1: If the A/D clock source is selected as RC, a time of TCY is added before the A/D clock starts.
This allows the SLEEPinstruction to be executed.
2: This is a minimal RC delay (typically 100 ns), which also disconnects the holding capacitor from the analog input.
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 461
PIC18(L)F2X/4XK22
TABLE 27-24: A/D CONVERSION REQUIREMENTS
Param
Symbol
Characteristic
Min
Max
Units
Conditions
No.
130
TAD
A/D Clock Period
0.7
25.0(1)
s TOSC based,
-40C to +85C
0.7
4.0(1)
s TOSC based,
+85C to +125C
1.0
12
4.0
12
s FRC mode, VDD2.0V
131
TCNV
Conversion Time
TAD
(not including acquisition time) (Note 2)
132
135
136
TACQ
TSWC
TDIS
Acquisition Time (Note 3)
Switching Time from Convert Sample
Discharge Time
1.4
—
2
—
(Note 4)
2
s VDD = 3V, Rs = 50
TAD
Legend: TBD = To Be Determined
Note 1: The time of the A/D clock period is dependent on the device frequency and the TAD clock divider.
2: ADRES register may be read on the following TCY cycle.
3: The time for the holding capacitor to acquire the “New” input voltage when the voltage changes full scale
after the conversion (VDD to VSS or VSS to VDD). The source impedance (RS) on the input channels is 50 .
4: On the following cycle of the device clock.
DS41412A-page 462
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
28.0 DC AND AC
CHARACTERISTICS GRAPHS
AND TABLES
Graphs and tables are not available at this time.
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 463
PIC18(L)F2X/4XK22
NOTES:
DS41412A-page 464
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
29.0 PACKAGING INFORMATION
29.1 Package Marking Information
28-Lead PDIP
Example
PIC18F25K22-E/SP
XXXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXXX
e
3
YYWWNNN
0810017
28-Lead SOIC (7.50 mm)
Example
XXXXXXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXXXXXX
PIC18F25K22-E/SO
0810017
e
3
YYWWNNN
28-Lead SSOP
Example
PIC18F25K22-E/SS
XXXXXXXXXXXXXXX
XXXXXXXXXXXXXXX
XXXXXXXXXXXXXXX
e
3
0810017
YYWWNNN
Legend: XX...X Customer-specific information
Y
YY
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
WW
NNN
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
e
3
Pb-free JEDEC designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator (
can be found on the outer packaging for this package.
*
)
e
3
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 465
PIC18(L)F2X/4XK22
Package Marking Information (Continued)
28-Lead QFN
Example
XXXXXXXX
XXXXXXXX
YYWWNNN
18F24K22
-E/ML
0810017
e
3
28-Lead UQFN
Example
XXXXX
XXXXXX
XXXXXX
YWWNNN
PIC18
F23K22
-E/MV
810017
e3
40-Lead PDIP
Example
XXXXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXXXX
PIC18F45K22-E/P
0810017
e
3
YYWWNNN
44-Lead QFN
Example
XXXXXXXXXX
XXXXXXXXXX
XXXXXXXXXX
YYWWNNN
PIC18F45K22
-E/ML
0810017
e
3
44-Lead TQFP
Example
XXXXXXXXXX
XXXXXXXXXX
XXXXXXXXXX
YYWWNNN
PIC18F44K22
-E/PT
e
3
0810017
DS41412A-page 466
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
29.2 Package Details
The following sections give the technical details of the packages.
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ꢔꢃꢌꢉꢋꢌꢍꢃꢓ ꢙꢈꢌꢍꢄꢋꢇꢋꢑꢊ ꢒꢉꢆ*ꢃꢄꢑ ,ꢕꢖꢞꢕꢜꢕ1
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 467
PIC18(L)F2X/4XK22
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E1
NOTE 1
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2
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b
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α
h
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ꢝ.32 ꢝꢈ%ꢈꢉꢈꢄꢌꢈꢅꢒꢃ'ꢈꢄ!ꢃꢋꢄ(ꢅ"!"ꢆꢇꢇꢊꢅ*ꢃ&ꢍꢋ"&ꢅ&ꢋꢇꢈꢉꢆꢄꢌꢈ(ꢅ%ꢋꢉꢅꢃꢄ%ꢋꢉ'ꢆ&ꢃꢋꢄꢅꢓ"ꢉꢓꢋ!ꢈ!ꢅꢋꢄꢇꢊꢁ
ꢔꢃꢌꢉꢋꢌꢍꢃꢓ ꢙꢈꢌꢍꢄꢋꢇꢋꢑꢊ ꢒꢉꢆ*ꢃꢄꢑ ,ꢕꢖꢞꢕꢘꢎ1
DS41412A-page 468
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
ꢀꢁꢂꢃꢄꢅꢆꢇꢍꢎꢅꢏꢐꢊꢑꢇꢈ*+ꢊꢋꢉꢇꢈꢙꢅꢎꢎꢇ#ꢓꢐꢎꢊꢋꢄꢇꢕꢈꢈꢖꢇMꢇ('ꢗꢘꢇꢙꢙꢇꢚꢛꢆꢌꢇꢜꢈꢈ#ꢍ
!ꢛꢐꢄ" 3ꢋꢉꢅ&ꢍꢈꢅ'ꢋ!&ꢅꢌ"ꢉꢉꢈꢄ&ꢅꢓꢆꢌ4ꢆꢑꢈꢅ#ꢉꢆ*ꢃꢄꢑ!(ꢅꢓꢇꢈꢆ!ꢈꢅ!ꢈꢈꢅ&ꢍꢈꢅꢔꢃꢌꢉꢋꢌꢍꢃꢓꢅꢂꢆꢌ4ꢆꢑꢃꢄꢑꢅꢐꢓꢈꢌꢃ%ꢃꢌꢆ&ꢃꢋꢄꢅꢇꢋꢌꢆ&ꢈ#ꢅꢆ&ꢅ
ꢍ&&ꢓ255***ꢁ'ꢃꢌꢉꢋꢌꢍꢃꢓꢁꢌꢋ'5ꢓꢆꢌ4ꢆꢑꢃꢄꢑ
D
N
E
E1
1
2
b
NOTE 1
e
c
A2
A
φ
A1
L
L1
6ꢄꢃ&!
ꢔꢚ99ꢚꢔ.ꢙ.ꢝꢐ
ꢒꢃ'ꢈꢄ!ꢃꢋꢄꢅ9ꢃ'ꢃ&!
ꢔꢚ7
7:ꢔ
ꢔꢗ;
7"')ꢈꢉꢅꢋ%ꢅꢂꢃꢄ!
ꢂꢃ&ꢌꢍ
7
ꢈ
ꢎ<
ꢕꢁ?ꢘꢅ1ꢐ,
: ꢈꢉꢆꢇꢇꢅ8ꢈꢃꢑꢍ&
ꢔꢋꢇ#ꢈ#ꢅꢂꢆꢌ4ꢆꢑꢈꢅꢙꢍꢃꢌ4ꢄꢈ!!
ꢐ&ꢆꢄ#ꢋ%%ꢅ
: ꢈꢉꢆꢇꢇꢅ>ꢃ#&ꢍ
ꢔꢋꢇ#ꢈ#ꢅꢂꢆꢌ4ꢆꢑꢈꢅ>ꢃ#&ꢍ
: ꢈꢉꢆꢇꢇꢅ9ꢈꢄꢑ&ꢍ
3ꢋꢋ&ꢅ9ꢈꢄꢑ&ꢍ
3ꢋꢋ&ꢓꢉꢃꢄ&
9ꢈꢆ#ꢅꢙꢍꢃꢌ4ꢄꢈ!!
3ꢋꢋ&ꢅꢗꢄꢑꢇꢈ
ꢗ
M
M
ꢀꢁꢜꢘ
M
ꢜꢁ<ꢕ
ꢘꢁ-ꢕ
ꢀꢕꢁꢎꢕ
ꢕꢁꢜꢘ
ꢀꢁꢎꢘꢅꢝ.3
M
ꢎꢁꢕꢕ
ꢀꢁ<ꢘ
M
<ꢁꢎꢕ
ꢘꢁ?ꢕ
ꢀꢕꢁꢘꢕ
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9
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ꢘꢁꢕꢕ
ꢛꢁꢛꢕ
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ꢕꢟ
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M
ꢕꢁ-<
!ꢛꢐꢄꢏ"
ꢀꢁ ꢂꢃꢄꢅꢀꢅ ꢃ!"ꢆꢇꢅꢃꢄ#ꢈ$ꢅ%ꢈꢆ&"ꢉꢈꢅ'ꢆꢊꢅ ꢆꢉꢊ(ꢅ)"&ꢅ'"!&ꢅ)ꢈꢅꢇꢋꢌꢆ&ꢈ#ꢅ*ꢃ&ꢍꢃꢄꢅ&ꢍꢈꢅꢍꢆ&ꢌꢍꢈ#ꢅꢆꢉꢈꢆꢁ
ꢎꢁ ꢒꢃ'ꢈꢄ!ꢃꢋꢄ!ꢅꢒꢅꢆꢄ#ꢅ.ꢀꢅ#ꢋꢅꢄꢋ&ꢅꢃꢄꢌꢇ"#ꢈꢅ'ꢋꢇ#ꢅ%ꢇꢆ!ꢍꢅꢋꢉꢅꢓꢉꢋ&ꢉ"!ꢃꢋꢄ!ꢁꢅꢔꢋꢇ#ꢅ%ꢇꢆ!ꢍꢅꢋꢉꢅꢓꢉꢋ&ꢉ"!ꢃꢋꢄ!ꢅ!ꢍꢆꢇꢇꢅꢄꢋ&ꢅꢈ$ꢌꢈꢈ#ꢅꢕꢁꢎꢕꢅ''ꢅꢓꢈꢉꢅ!ꢃ#ꢈꢁ
-ꢁ ꢒꢃ'ꢈꢄ!ꢃꢋꢄꢃꢄꢑꢅꢆꢄ#ꢅ&ꢋꢇꢈꢉꢆꢄꢌꢃꢄꢑꢅꢓꢈꢉꢅꢗꢐꢔ.ꢅ0ꢀꢖꢁꢘꢔꢁ
1ꢐ,2 1ꢆ!ꢃꢌꢅꢒꢃ'ꢈꢄ!ꢃꢋꢄꢁꢅꢙꢍꢈꢋꢉꢈ&ꢃꢌꢆꢇꢇꢊꢅꢈ$ꢆꢌ&ꢅ ꢆꢇ"ꢈꢅ!ꢍꢋ*ꢄꢅ*ꢃ&ꢍꢋ"&ꢅ&ꢋꢇꢈꢉꢆꢄꢌꢈ!ꢁ
ꢝ.32 ꢝꢈ%ꢈꢉꢈꢄꢌꢈꢅꢒꢃ'ꢈꢄ!ꢃꢋꢄ(ꢅ"!"ꢆꢇꢇꢊꢅ*ꢃ&ꢍꢋ"&ꢅ&ꢋꢇꢈꢉꢆꢄꢌꢈ(ꢅ%ꢋꢉꢅꢃꢄ%ꢋꢉ'ꢆ&ꢃꢋꢄꢅꢓ"ꢉꢓꢋ!ꢈ!ꢅꢋꢄꢇꢊꢁ
ꢔꢃꢌꢉꢋꢌꢍꢃꢓ ꢙꢈꢌꢍꢄꢋꢇꢋꢑꢊ ꢒꢉꢆ*ꢃꢄꢑ ,ꢕꢖꢞꢕꢜ-1
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 469
PIC18(L)F2X/4XK22
ꢀꢁꢂꢃꢄꢅꢆꢇꢍꢎꢅꢏꢐꢊꢑꢇ,ꢓꢅꢆꢇ-ꢎꢅꢐ%ꢇ!ꢛꢇꢃꢄꢅꢆꢇꢍꢅꢑꢉꢅ.ꢄꢇꢕ/ꢃꢖꢇMꢇ010ꢇꢙꢙꢇꢚꢛꢆꢌꢇꢜ,-!
2ꢊꢐ*ꢇꢘ'((ꢇꢙꢙꢇ)ꢛꢋꢐꢅꢑꢐꢇꢃꢄꢋ.ꢐ*
!ꢛꢐꢄ" 3ꢋꢉꢅ&ꢍꢈꢅ'ꢋ!&ꢅꢌ"ꢉꢉꢈꢄ&ꢅꢓꢆꢌ4ꢆꢑꢈꢅ#ꢉꢆ*ꢃꢄꢑ!(ꢅꢓꢇꢈꢆ!ꢈꢅ!ꢈꢈꢅ&ꢍꢈꢅꢔꢃꢌꢉꢋꢌꢍꢃꢓꢅꢂꢆꢌ4ꢆꢑꢃꢄꢑꢅꢐꢓꢈꢌꢃ%ꢃꢌꢆ&ꢃꢋꢄꢅꢇꢋꢌꢆ&ꢈ#ꢅꢆ&ꢅ
ꢍ&&ꢓ255***ꢁ'ꢃꢌꢉꢋꢌꢍꢃꢓꢁꢌꢋ'5ꢓꢆꢌ4ꢆꢑꢃꢄꢑ
D
D2
EXPOSED
PAD
e
E
b
E2
2
1
2
1
K
N
N
NOTE 1
L
BOTTOM VIEW
TOP VIEW
A
A3
A1
6ꢄꢃ&!
ꢒꢃ'ꢈꢄ!ꢃꢋꢄꢅ9ꢃ'ꢃ&!
ꢔꢚ99ꢚꢔ.ꢙ.ꢝꢐ
7:ꢔ
ꢔꢚ7
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ꢂꢃ&ꢌꢍ
: ꢈꢉꢆꢇꢇꢅ8ꢈꢃꢑꢍ&
ꢐ&ꢆꢄ#ꢋ%%ꢅ
,ꢋꢄ&ꢆꢌ&ꢅꢙꢍꢃꢌ4ꢄꢈ!!
: ꢈꢉꢆꢇꢇꢅ>ꢃ#&ꢍ
.$ꢓꢋ!ꢈ#ꢅꢂꢆ#ꢅ>ꢃ#&ꢍ
: ꢈꢉꢆꢇꢇꢅ9ꢈꢄꢑ&ꢍ
.$ꢓꢋ!ꢈ#ꢅꢂꢆ#ꢅ9ꢈꢄꢑ&ꢍ
,ꢋꢄ&ꢆꢌ&ꢅ>ꢃ#&ꢍ
,ꢋꢄ&ꢆꢌ&ꢅ9ꢈꢄꢑ&ꢍ
,ꢋꢄ&ꢆꢌ&ꢞ&ꢋꢞ.$ꢓꢋ!ꢈ#ꢅꢂꢆ#
7
ꢈ
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ꢕꢁꢕꢘ
ꢕꢁꢕꢎ
ꢕꢁꢎꢕꢅꢝ.3
?ꢁꢕꢕꢅ1ꢐ,
-ꢁꢜꢕ
?ꢁꢕꢕꢅ1ꢐ,
-ꢁꢜꢕ
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M
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9
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ꢕꢁꢎ-
ꢕꢁꢘꢕ
ꢕꢁꢎꢕ
ꢖꢁꢎꢕ
ꢕꢁ-ꢘ
ꢕꢁꢜꢕ
M
C
!ꢛꢐꢄꢏ"
ꢀꢁ ꢂꢃꢄꢅꢀꢅ ꢃ!"ꢆꢇꢅꢃꢄ#ꢈ$ꢅ%ꢈꢆ&"ꢉꢈꢅ'ꢆꢊꢅ ꢆꢉꢊ(ꢅ)"&ꢅ'"!&ꢅ)ꢈꢅꢇꢋꢌꢆ&ꢈ#ꢅ*ꢃ&ꢍꢃꢄꢅ&ꢍꢈꢅꢍꢆ&ꢌꢍꢈ#ꢅꢆꢉꢈꢆꢁ
ꢎꢁ ꢂꢆꢌ4ꢆꢑꢈꢅꢃ!ꢅ!ꢆ*ꢅ!ꢃꢄꢑ"ꢇꢆ&ꢈ#ꢁ
-ꢁ ꢒꢃ'ꢈꢄ!ꢃꢋꢄꢃꢄꢑꢅꢆꢄ#ꢅ&ꢋꢇꢈꢉꢆꢄꢌꢃꢄꢑꢅꢓꢈꢉꢅꢗꢐꢔ.ꢅ0ꢀꢖꢁꢘꢔꢁ
1ꢐ,2 1ꢆ!ꢃꢌꢅꢒꢃ'ꢈꢄ!ꢃꢋꢄꢁꢅꢙꢍꢈꢋꢉꢈ&ꢃꢌꢆꢇꢇꢊꢅꢈ$ꢆꢌ&ꢅ ꢆꢇ"ꢈꢅ!ꢍꢋ*ꢄꢅ*ꢃ&ꢍꢋ"&ꢅ&ꢋꢇꢈꢉꢆꢄꢌꢈ!ꢁ
ꢝ.32 ꢝꢈ%ꢈꢉꢈꢄꢌꢈꢅꢒꢃ'ꢈꢄ!ꢃꢋꢄ(ꢅ"!"ꢆꢇꢇꢊꢅ*ꢃ&ꢍꢋ"&ꢅ&ꢋꢇꢈꢉꢆꢄꢌꢈ(ꢅ%ꢋꢉꢅꢃꢄ%ꢋꢉ'ꢆ&ꢃꢋꢄꢅꢓ"ꢉꢓꢋ!ꢈ!ꢅꢋꢄꢇꢊꢁ
ꢔꢃꢌꢉꢋꢌꢍꢃꢓ ꢙꢈꢌꢍꢄꢋꢇꢋꢑꢊ ꢒꢉꢆ*ꢃꢄꢑ ,ꢕꢖꢞꢀꢕꢘ1
DS41412A-page 470
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
ꢀꢁꢂꢃꢄꢅꢆꢇꢍꢎꢅꢏꢐꢊꢑꢇ,ꢓꢅꢆꢇ-ꢎꢅꢐ%ꢇ!ꢛꢇꢃꢄꢅꢆꢇꢍꢅꢑꢉꢅ.ꢄꢇꢕ/ꢃꢖꢇMꢇ010ꢇꢙꢙꢇꢚꢛꢆꢌꢇꢜ,-!
2ꢊꢐ*ꢇꢘ'((ꢇꢙꢙꢇ)ꢛꢋꢐꢅꢑꢐꢇꢃꢄꢋ.ꢐ*
!ꢛꢐꢄ" 3ꢋꢉꢅ&ꢍꢈꢅ'ꢋ!&ꢅꢌ"ꢉꢉꢈꢄ&ꢅꢓꢆꢌ4ꢆꢑꢈꢅ#ꢉꢆ*ꢃꢄꢑ!(ꢅꢓꢇꢈꢆ!ꢈꢅ!ꢈꢈꢅ&ꢍꢈꢅꢔꢃꢌꢉꢋꢌꢍꢃꢓꢅꢂꢆꢌ4ꢆꢑꢃꢄꢑꢅꢐꢓꢈꢌꢃ%ꢃꢌꢆ&ꢃꢋꢄꢅꢇꢋꢌꢆ&ꢈ#ꢅꢆ&ꢅ
ꢍ&&ꢓ255***ꢁ'ꢃꢌꢉꢋꢌꢍꢃꢓꢁꢌꢋ'5ꢓꢆꢌ4ꢆꢑꢃꢄꢑ
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 471
PIC18(L)F2X/4XK22
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS41412A-page 472
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 473
PIC18(L)F2X/4XK22
3ꢘꢂꢃꢄꢅꢆꢇꢍꢎꢅꢏꢐꢊꢑꢇꢒꢓꢅꢎꢇꢔꢋꢂꢃꢊꢋꢄꢇꢕꢍꢖꢇMꢇ0ꢘꢘꢇꢙꢊꢎꢇꢚꢛꢆꢌꢇꢜꢍꢒꢔꢍ
!ꢛꢐꢄ" 3ꢋꢉꢅ&ꢍꢈꢅ'ꢋ!&ꢅꢌ"ꢉꢉꢈꢄ&ꢅꢓꢆꢌ4ꢆꢑꢈꢅ#ꢉꢆ*ꢃꢄꢑ!(ꢅꢓꢇꢈꢆ!ꢈꢅ!ꢈꢈꢅ&ꢍꢈꢅꢔꢃꢌꢉꢋꢌꢍꢃꢓꢅꢂꢆꢌ4ꢆꢑꢃꢄꢑꢅꢐꢓꢈꢌꢃ%ꢃꢌꢆ&ꢃꢋꢄꢅꢇꢋꢌꢆ&ꢈ#ꢅꢆ&ꢅ
ꢍ&&ꢓ255***ꢁ'ꢃꢌꢉꢋꢌꢍꢃꢓꢁꢌꢋ'5ꢓꢆꢌ4ꢆꢑꢃꢄꢑ
N
NOTE 1
E1
1 2 3
D
E
A2
A
L
c
b1
b
A1
e
eB
6ꢄꢃ&!
ꢚ7,8.ꢐ
ꢒꢃ'ꢈꢄ!ꢃꢋꢄꢅ9ꢃ'ꢃ&!
ꢔꢚ7
7:ꢔ
ꢔꢗ;
7"')ꢈꢉꢅꢋ%ꢅꢂꢃꢄ!
ꢂꢃ&ꢌꢍ
7
ꢈ
ꢖꢕ
ꢁꢀꢕꢕꢅ1ꢐ,
ꢙꢋꢓꢅ&ꢋꢅꢐꢈꢆ&ꢃꢄꢑꢅꢂꢇꢆꢄꢈ
ꢔꢋꢇ#ꢈ#ꢅꢂꢆꢌ4ꢆꢑꢈꢅꢙꢍꢃꢌ4ꢄꢈ!!
1ꢆ!ꢈꢅ&ꢋꢅꢐꢈꢆ&ꢃꢄꢑꢅꢂꢇꢆꢄꢈ
ꢐꢍꢋ"ꢇ#ꢈꢉꢅ&ꢋꢅꢐꢍꢋ"ꢇ#ꢈꢉꢅ>ꢃ#&ꢍ
ꢔꢋꢇ#ꢈ#ꢅꢂꢆꢌ4ꢆꢑꢈꢅ>ꢃ#&ꢍ
: ꢈꢉꢆꢇꢇꢅ9ꢈꢄꢑ&ꢍ
ꢙꢃꢓꢅ&ꢋꢅꢐꢈꢆ&ꢃꢄꢑꢅꢂꢇꢆꢄꢈ
9ꢈꢆ#ꢅꢙꢍꢃꢌ4ꢄꢈ!!
6ꢓꢓꢈꢉꢅ9ꢈꢆ#ꢅ>ꢃ#&ꢍ
ꢗ
M
M
M
M
M
M
M
M
M
M
M
M
ꢁꢎꢘꢕ
ꢁꢀꢛꢘ
M
ꢗꢎ
ꢗꢀ
.
.ꢀ
ꢒ
9
ꢌ
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)
ꢈ1
ꢁꢀꢎꢘ
ꢁꢕꢀꢘ
ꢁꢘꢛꢕ
ꢁꢖ<ꢘ
ꢀꢁꢛ<ꢕ
ꢁꢀꢀꢘ
ꢁꢕꢕ<
ꢁꢕ-ꢕ
ꢁꢕꢀꢖ
M
ꢁ?ꢎꢘ
ꢁꢘ<ꢕ
ꢎꢁꢕꢛꢘ
ꢁꢎꢕꢕ
ꢁꢕꢀꢘ
ꢁꢕꢜꢕ
ꢁꢕꢎ-
ꢁꢜꢕꢕ
9ꢋ*ꢈꢉꢅ9ꢈꢆ#ꢅ>ꢃ#&ꢍ
: ꢈꢉꢆꢇꢇꢅꢝꢋ*ꢅꢐꢓꢆꢌꢃꢄꢑꢅꢅꢏ
!ꢛꢐꢄꢏ"
ꢀꢁ ꢂꢃꢄꢅꢀꢅ ꢃ!"ꢆꢇꢅꢃꢄ#ꢈ$ꢅ%ꢈꢆ&"ꢉꢈꢅ'ꢆꢊꢅ ꢆꢉꢊ(ꢅ)"&ꢅ'"!&ꢅ)ꢈꢅꢇꢋꢌꢆ&ꢈ#ꢅ*ꢃ&ꢍꢃꢄꢅ&ꢍꢈꢅꢍꢆ&ꢌꢍꢈ#ꢅꢆꢉꢈꢆꢁ
ꢎꢁ ꢏꢅꢐꢃꢑꢄꢃ%ꢃꢌꢆꢄ&ꢅ,ꢍꢆꢉꢆꢌ&ꢈꢉꢃ!&ꢃꢌꢁ
-ꢁ ꢒꢃ'ꢈꢄ!ꢃꢋꢄ!ꢅꢒꢅꢆꢄ#ꢅ.ꢀꢅ#ꢋꢅꢄꢋ&ꢅꢃꢄꢌꢇ"#ꢈꢅ'ꢋꢇ#ꢅ%ꢇꢆ!ꢍꢅꢋꢉꢅꢓꢉꢋ&ꢉ"!ꢃꢋꢄ!ꢁꢅꢔꢋꢇ#ꢅ%ꢇꢆ!ꢍꢅꢋꢉꢅꢓꢉꢋ&ꢉ"!ꢃꢋꢄ!ꢅ!ꢍꢆꢇꢇꢅꢄꢋ&ꢅꢈ$ꢌꢈꢈ#ꢅꢁꢕꢀꢕ/ꢅꢓꢈꢉꢅ!ꢃ#ꢈꢁ
ꢖꢁ ꢒꢃ'ꢈꢄ!ꢃꢋꢄꢃꢄꢑꢅꢆꢄ#ꢅ&ꢋꢇꢈꢉꢆꢄꢌꢃꢄꢑꢅꢓꢈꢉꢅꢗꢐꢔ.ꢅ0ꢀꢖꢁꢘꢔꢁ
1ꢐ,2 1ꢆ!ꢃꢌꢅꢒꢃ'ꢈꢄ!ꢃꢋꢄꢁꢅꢙꢍꢈꢋꢉꢈ&ꢃꢌꢆꢇꢇꢊꢅꢈ$ꢆꢌ&ꢅ ꢆꢇ"ꢈꢅ!ꢍꢋ*ꢄꢅ*ꢃ&ꢍꢋ"&ꢅ&ꢋꢇꢈꢉꢆꢄꢌꢈ!ꢁ
ꢔꢃꢌꢉꢋꢌꢍꢃꢓ ꢙꢈꢌꢍꢄꢋꢇꢋꢑꢊ ꢒꢉꢆ*ꢃꢄꢑ ,ꢕꢖꢞꢕꢀ?1
DS41412A-page 474
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
33ꢂꢃꢄꢅꢆꢇꢍꢎꢅꢏꢐꢊꢑꢇ,ꢓꢅꢆꢇ-ꢎꢅꢐ%ꢇ!ꢛꢇꢃꢄꢅꢆꢇꢍꢅꢑꢉꢅ.ꢄꢇꢕ/ꢃꢖꢇMꢇꢁ1ꢁꢇꢙꢙꢇꢚꢛꢆꢌꢇꢜ,-!
!ꢛꢐꢄ" 3ꢋꢉꢅ&ꢍꢈꢅ'ꢋ!&ꢅꢌ"ꢉꢉꢈꢄ&ꢅꢓꢆꢌ4ꢆꢑꢈꢅ#ꢉꢆ*ꢃꢄꢑ!(ꢅꢓꢇꢈꢆ!ꢈꢅ!ꢈꢈꢅ&ꢍꢈꢅꢔꢃꢌꢉꢋꢌꢍꢃꢓꢅꢂꢆꢌ4ꢆꢑꢃꢄꢑꢅꢐꢓꢈꢌꢃ%ꢃꢌꢆ&ꢃꢋꢄꢅꢇꢋꢌꢆ&ꢈ#ꢅꢆ&ꢅ
ꢍ&&ꢓ255***ꢁ'ꢃꢌꢉꢋꢌꢍꢃꢓꢁꢌꢋ'5ꢓꢆꢌ4ꢆꢑꢃꢄꢑ
D2
D
EXPOSED
PAD
e
b
K
E
E2
2
1
2
1
N
N
NOTE 1
L
TOP VIEW
BOTTOM VIEW
A
A3
A1
6ꢄꢃ&!
ꢔꢚ99ꢚꢔ.ꢙ.ꢝꢐ
ꢒꢃ'ꢈꢄ!ꢃꢋꢄꢅ9ꢃ'ꢃ&!
ꢔꢚ7
7:ꢔ
ꢖꢖ
ꢕꢁ?ꢘꢅ1ꢐ,
ꢕꢁꢛꢕ
ꢔꢗ;
7"')ꢈꢉꢅꢋ%ꢅꢂꢃꢄ!
ꢂꢃ&ꢌꢍ
: ꢈꢉꢆꢇꢇꢅ8ꢈꢃꢑꢍ&
ꢐ&ꢆꢄ#ꢋ%%ꢅ
,ꢋꢄ&ꢆꢌ&ꢅꢙꢍꢃꢌ4ꢄꢈ!!
: ꢈꢉꢆꢇꢇꢅ>ꢃ#&ꢍ
7
ꢈ
ꢗ
ꢗꢀ
ꢗ-
.
.ꢎ
ꢒ
ꢕꢁ<ꢕ
ꢕꢁꢕꢕ
ꢀꢁꢕꢕ
ꢕꢁꢕꢘ
ꢕꢁꢕꢎ
ꢕꢁꢎꢕꢅꢝ.3
<ꢁꢕꢕꢅ1ꢐ,
?ꢁꢖꢘ
<ꢁꢕꢕꢅ1ꢐ,
?ꢁꢖꢘ
ꢕꢁ-ꢕ
ꢕꢁꢖꢕ
M
.$ꢓꢋ!ꢈ#ꢅꢂꢆ#ꢅ>ꢃ#&ꢍ
: ꢈꢉꢆꢇꢇꢅ9ꢈꢄꢑ&ꢍ
.$ꢓꢋ!ꢈ#ꢅꢂꢆ#ꢅ9ꢈꢄꢑ&ꢍ
,ꢋꢄ&ꢆꢌ&ꢅ>ꢃ#&ꢍ
,ꢋꢄ&ꢆꢌ&ꢅ9ꢈꢄꢑ&ꢍ
,ꢋꢄ&ꢆꢌ&ꢞ&ꢋꢞ.$ꢓꢋ!ꢈ#ꢅꢂꢆ#
?ꢁ-ꢕ
?ꢁ<ꢕ
ꢒꢎ
)
9
?ꢁ-ꢕ
ꢕꢁꢎꢘ
ꢕꢁ-ꢕ
ꢕꢁꢎꢕ
?ꢁ<ꢕ
ꢕꢁ-<
ꢕꢁꢘꢕ
M
C
!ꢛꢐꢄꢏ"
ꢀꢁ ꢂꢃꢄꢅꢀꢅ ꢃ!"ꢆꢇꢅꢃꢄ#ꢈ$ꢅ%ꢈꢆ&"ꢉꢈꢅ'ꢆꢊꢅ ꢆꢉꢊ(ꢅ)"&ꢅ'"!&ꢅ)ꢈꢅꢇꢋꢌꢆ&ꢈ#ꢅ*ꢃ&ꢍꢃꢄꢅ&ꢍꢈꢅꢍꢆ&ꢌꢍꢈ#ꢅꢆꢉꢈꢆꢁ
ꢎꢁ ꢂꢆꢌ4ꢆꢑꢈꢅꢃ!ꢅ!ꢆ*ꢅ!ꢃꢄꢑ"ꢇꢆ&ꢈ#ꢁ
-ꢁ ꢒꢃ'ꢈꢄ!ꢃꢋꢄꢃꢄꢑꢅꢆꢄ#ꢅ&ꢋꢇꢈꢉꢆꢄꢌꢃꢄꢑꢅꢓꢈꢉꢅꢗꢐꢔ.ꢅ0ꢀꢖꢁꢘꢔꢁ
1ꢐ,2 1ꢆ!ꢃꢌꢅꢒꢃ'ꢈꢄ!ꢃꢋꢄꢁꢅꢙꢍꢈꢋꢉꢈ&ꢃꢌꢆꢇꢇꢊꢅꢈ$ꢆꢌ&ꢅ ꢆꢇ"ꢈꢅ!ꢍꢋ*ꢄꢅ*ꢃ&ꢍꢋ"&ꢅ&ꢋꢇꢈꢉꢆꢄꢌꢈ!ꢁ
ꢝ.32 ꢝꢈ%ꢈꢉꢈꢄꢌꢈꢅꢒꢃ'ꢈꢄ!ꢃꢋꢄ(ꢅ"!"ꢆꢇꢇꢊꢅ*ꢃ&ꢍꢋ"&ꢅ&ꢋꢇꢈꢉꢆꢄꢌꢈ(ꢅ%ꢋꢉꢅꢃꢄ%ꢋꢉ'ꢆ&ꢃꢋꢄꢅꢓ"ꢉꢓꢋ!ꢈ!ꢅꢋꢄꢇꢊꢁ
ꢔꢃꢌꢉꢋꢌꢍꢃꢓ ꢙꢈꢌꢍꢄꢋꢇꢋꢑꢊ ꢒꢉꢆ*ꢃꢄꢑ ,ꢕꢖꢞꢀꢕ-1
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 475
PIC18(L)F2X/4XK22
33ꢂꢃꢄꢅꢆꢇꢍꢎꢅꢏꢐꢊꢑꢇ,ꢓꢅꢆꢇ-ꢎꢅꢐ%ꢇ!ꢛꢇꢃꢄꢅꢆꢇꢍꢅꢑꢉꢅ.ꢄꢇꢕ/ꢃꢖꢇMꢇꢁ1ꢁꢇꢙꢙꢇꢚꢛꢆꢌꢇꢜ,-!
!ꢛꢐꢄ" 3ꢋꢉꢅ&ꢍꢈꢅ'ꢋ!&ꢅꢌ"ꢉꢉꢈꢄ&ꢅꢓꢆꢌ4ꢆꢑꢈꢅ#ꢉꢆ*ꢃꢄꢑ!(ꢅꢓꢇꢈꢆ!ꢈꢅ!ꢈꢈꢅ&ꢍꢈꢅꢔꢃꢌꢉꢋꢌꢍꢃꢓꢅꢂꢆꢌ4ꢆꢑꢃꢄꢑꢅꢐꢓꢈꢌꢃ%ꢃꢌꢆ&ꢃꢋꢄꢅꢇꢋꢌꢆ&ꢈ#ꢅꢆ&ꢅ
ꢍ&&ꢓ255***ꢁ'ꢃꢌꢉꢋꢌꢍꢃꢓꢁꢌꢋ'5ꢓꢆꢌ4ꢆꢑꢃꢄꢑ
DS41412A-page 476
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
33ꢂꢃꢄꢅꢆꢇꢍꢎꢅꢏꢐꢊꢑꢇ4*ꢊꢋꢇ,ꢓꢅꢆꢇ-ꢎꢅꢐ5ꢅꢑꢉꢇꢕꢍ4ꢖꢇMꢇ6ꢘ16ꢘ16ꢇꢙꢙꢇꢚꢛꢆꢌ%ꢇꢀ'ꢘꢘꢇꢙꢙꢇꢜ4,-ꢍ
!ꢛꢐꢄ" 3ꢋꢉꢅ&ꢍꢈꢅ'ꢋ!&ꢅꢌ"ꢉꢉꢈꢄ&ꢅꢓꢆꢌ4ꢆꢑꢈꢅ#ꢉꢆ*ꢃꢄꢑ!(ꢅꢓꢇꢈꢆ!ꢈꢅ!ꢈꢈꢅ&ꢍꢈꢅꢔꢃꢌꢉꢋꢌꢍꢃꢓꢅꢂꢆꢌ4ꢆꢑꢃꢄꢑꢅꢐꢓꢈꢌꢃ%ꢃꢌꢆ&ꢃꢋꢄꢅꢇꢋꢌꢆ&ꢈ#ꢅꢆ&ꢅ
ꢍ&&ꢓ255***ꢁ'ꢃꢌꢉꢋꢌꢍꢃꢓꢁꢌꢋ'5ꢓꢆꢌ4ꢆꢑꢃꢄꢑ
D
D1
E
e
E1
N
b
NOTE 1
1 2 3
NOTE 2
α
A
c
φ
A2
β
A1
L
L1
6ꢄꢃ&!
ꢔꢚ99ꢚꢔ.ꢙ.ꢝꢐ
ꢒꢃ'ꢈꢄ!ꢃꢋꢄꢅ9ꢃ'ꢃ&!
ꢔꢚ7
7:ꢔ
ꢖꢖ
ꢕꢁ<ꢕꢅ1ꢐ,
M
ꢀꢁꢕꢕ
M
ꢔꢗ;
7"')ꢈꢉꢅꢋ%ꢅ9ꢈꢆ#!
9ꢈꢆ#ꢅꢂꢃ&ꢌꢍ
: ꢈꢉꢆꢇꢇꢅ8ꢈꢃꢑꢍ&
ꢔꢋꢇ#ꢈ#ꢅꢂꢆꢌ4ꢆꢑꢈꢅꢙꢍꢃꢌ4ꢄꢈ!!
ꢐ&ꢆꢄ#ꢋ%%ꢅꢅ
3ꢋꢋ&ꢅ9ꢈꢄꢑ&ꢍ
7
ꢈ
ꢗ
ꢗꢎ
ꢗꢀ
9
M
ꢀꢁꢎꢕ
ꢀꢁꢕꢘ
ꢕꢁꢀꢘ
ꢕꢁꢜꢘ
ꢕꢁꢛꢘ
ꢕꢁꢕꢘ
ꢕꢁꢖꢘ
ꢕꢁ?ꢕ
3ꢋꢋ&ꢓꢉꢃꢄ&
3ꢋꢋ&ꢅꢗꢄꢑꢇꢈ
9ꢀ
ꢀ
ꢀꢁꢕꢕꢅꢝ.3
-ꢁꢘꢟ
ꢕꢟ
ꢜꢟ
: ꢈꢉꢆꢇꢇꢅ>ꢃ#&ꢍ
: ꢈꢉꢆꢇꢇꢅ9ꢈꢄꢑ&ꢍ
.
ꢒ
.ꢀ
ꢒꢀ
ꢌ
ꢀꢎꢁꢕꢕꢅ1ꢐ,
ꢀꢎꢁꢕꢕꢅ1ꢐ,
ꢀꢕꢁꢕꢕꢅ1ꢐ,
ꢀꢕꢁꢕꢕꢅ1ꢐ,
M
ꢔꢋꢇ#ꢈ#ꢅꢂꢆꢌ4ꢆꢑꢈꢅ>ꢃ#&ꢍ
ꢔꢋꢇ#ꢈ#ꢅꢂꢆꢌ4ꢆꢑꢈꢅ9ꢈꢄꢑ&ꢍ
9ꢈꢆ#ꢅꢙꢍꢃꢌ4ꢄꢈ!!
9ꢈꢆ#ꢅ>ꢃ#&ꢍ
ꢔꢋꢇ#ꢅꢒꢉꢆ%&ꢅꢗꢄꢑꢇꢈꢅꢙꢋꢓ
ꢔꢋꢇ#ꢅꢒꢉꢆ%&ꢅꢗꢄꢑꢇꢈꢅ1ꢋ&&ꢋ'
ꢕꢁꢕꢛ
ꢕꢁ-ꢕ
ꢀꢀꢟ
ꢕꢁꢎꢕ
ꢕꢁꢖꢘ
ꢀ-ꢟ
)
ꢁ
ꢕꢁ-ꢜ
ꢀꢎꢟ
ꢀꢎꢟ
ꢂ
ꢀꢀꢟ
ꢀ-ꢟ
!ꢛꢐꢄꢏ"
ꢀꢁ ꢂꢃꢄꢅꢀꢅ ꢃ!"ꢆꢇꢅꢃꢄ#ꢈ$ꢅ%ꢈꢆ&"ꢉꢈꢅ'ꢆꢊꢅ ꢆꢉꢊ(ꢅ)"&ꢅ'"!&ꢅ)ꢈꢅꢇꢋꢌꢆ&ꢈ#ꢅ*ꢃ&ꢍꢃꢄꢅ&ꢍꢈꢅꢍꢆ&ꢌꢍꢈ#ꢅꢆꢉꢈꢆꢁ
ꢎꢁ ,ꢍꢆ'%ꢈꢉ!ꢅꢆ&ꢅꢌꢋꢉꢄꢈꢉ!ꢅꢆꢉꢈꢅꢋꢓ&ꢃꢋꢄꢆꢇDꢅ!ꢃEꢈꢅ'ꢆꢊꢅ ꢆꢉꢊꢁ
-ꢁ ꢒꢃ'ꢈꢄ!ꢃꢋꢄ!ꢅꢒꢀꢅꢆꢄ#ꢅ.ꢀꢅ#ꢋꢅꢄꢋ&ꢅꢃꢄꢌꢇ"#ꢈꢅ'ꢋꢇ#ꢅ%ꢇꢆ!ꢍꢅꢋꢉꢅꢓꢉꢋ&ꢉ"!ꢃꢋꢄ!ꢁꢅꢔꢋꢇ#ꢅ%ꢇꢆ!ꢍꢅꢋꢉꢅꢓꢉꢋ&ꢉ"!ꢃꢋꢄ!ꢅ!ꢍꢆꢇꢇꢅꢄꢋ&ꢅꢈ$ꢌꢈꢈ#ꢅꢕꢁꢎꢘꢅ''ꢅꢓꢈꢉꢅ!ꢃ#ꢈꢁ
ꢖꢁ ꢒꢃ'ꢈꢄ!ꢃꢋꢄꢃꢄꢑꢅꢆꢄ#ꢅ&ꢋꢇꢈꢉꢆꢄꢌꢃꢄꢑꢅꢓꢈꢉꢅꢗꢐꢔ.ꢅ0ꢀꢖꢁꢘꢔꢁ
1ꢐ,2 1ꢆ!ꢃꢌꢅꢒꢃ'ꢈꢄ!ꢃꢋꢄꢁꢅꢙꢍꢈꢋꢉꢈ&ꢃꢌꢆꢇꢇꢊꢅꢈ$ꢆꢌ&ꢅ ꢆꢇ"ꢈꢅ!ꢍꢋ*ꢄꢅ*ꢃ&ꢍꢋ"&ꢅ&ꢋꢇꢈꢉꢆꢄꢌꢈ!ꢁ
ꢝ.32 ꢝꢈ%ꢈꢉꢈꢄꢌꢈꢅꢒꢃ'ꢈꢄ!ꢃꢋꢄ(ꢅ"!"ꢆꢇꢇꢊꢅ*ꢃ&ꢍꢋ"&ꢅ&ꢋꢇꢈꢉꢆꢄꢌꢈ(ꢅ%ꢋꢉꢅꢃꢄ%ꢋꢉ'ꢆ&ꢃꢋꢄꢅꢓ"ꢉꢓꢋ!ꢈ!ꢅꢋꢄꢇꢊꢁ
ꢔꢃꢌꢉꢋꢌꢍꢃꢓ ꢙꢈꢌꢍꢄꢋꢇꢋꢑꢊ ꢒꢉꢆ*ꢃꢄꢑ ,ꢕꢖꢞꢕꢜ?1
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 477
PIC18(L)F2X/4XK22
33ꢂꢃꢄꢅꢆꢇꢍꢎꢅꢏꢐꢊꢑꢇ4*ꢊꢋꢇ,ꢓꢅꢆꢇ-ꢎꢅꢐ5ꢅꢑꢉꢇꢕꢍ4ꢖꢇMꢇ6ꢘ16ꢘ16ꢇꢙꢙꢇꢚꢛꢆꢌ%ꢇꢀ'ꢘꢘꢇꢙꢙꢇꢜ4,-ꢍ
!ꢛꢐꢄ" 3ꢋꢉꢅ&ꢍꢈꢅ'ꢋ!&ꢅꢌ"ꢉꢉꢈꢄ&ꢅꢓꢆꢌ4ꢆꢑꢈꢅ#ꢉꢆ*ꢃꢄꢑ!(ꢅꢓꢇꢈꢆ!ꢈꢅ!ꢈꢈꢅ&ꢍꢈꢅꢔꢃꢌꢉꢋꢌꢍꢃꢓꢅꢂꢆꢌ4ꢆꢑꢃꢄꢑꢅꢐꢓꢈꢌꢃ%ꢃꢌꢆ&ꢃꢋꢄꢅꢇꢋꢌꢆ&ꢈ#ꢅꢆ&ꢅ
ꢍ&&ꢓ255***ꢁ'ꢃꢌꢉꢋꢌꢍꢃꢓꢁꢌꢋ'5ꢓꢆꢌ4ꢆꢑꢃꢄꢑ
DS41412A-page 478
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
APPENDIX A: REVISION HISTORY
Revision A (February 2010)
Initial release of this document.
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 479
PIC18(L)F2X/4XK22
APPENDIX B: DEVICE
DIFFERENCES
The differences between the devices listed in this data
sheet are shown in Table B-1.
TABLE B-1:
DEVICE DIFFERENCES
PIC18F23K22 PIC18F24K22
PIC18LF23K22 PIC18LF24K22 PIC18LF25K22 PIC18LF26K22 PIC18LF43K22 PIC18LF44K22 PIC18LF45K22
PIC18F25K22
PIC18F26K22
PIC18F43K22
PIC18F44K22
PIC18F45K22
PIC18F46K22
PIC18LF46K22
Features(1)
8192
16384
32768
65536
8192
16384
32768
65536
Program Memory
(Bytes)
SRAM (Bytes)
EEPROM (Bytes)
Interrupt Sources
I/O Ports
512
256
26
768
256
26
1536
256
33
3896
1024
33
512
256
26
768
256
26
1536
256
33
3896
1024
33
Ports A, B, C, Ports A, B, C, Ports A, B, C, Ports A, B, C, Ports A, B, C, Ports A, B, C, Ports A, B, C, Ports A, B, C,
(E)
(E)
(E)
(E)
D, E
D, E
D, E
D, E
Capture/Compare/PWM
Modules (CCP)
2
2
2
2
2
2
2
2
Enhanced CCP Modules
(ECCP) Full Bridge
1
2
1
2
1
2
1
2
2
1
2
1
2
1
2
1
ECCP Module
Half Bridge
10-bit Analog-to-Digital
Module
17 input
channels
17 input
channels
17 input
channels
17 input
channels
28 input
channels
28 input
channels
28 input
channels
28 input
channels
Packages
28-pin PDIP 28-pin PDIP 28-pin PDIP
28-pin SOIC 28-pin SOIC 28-pin SOIC
28-pin SSOP 28-pin SSOP 28-pin SSOP 28-pin SSOP 44-pin QFN
28-pin PDIP
40-pin PDIP 40-pin PDIP
40-pin PDIP
40-pin PDIP
44-pin TQFP
44-pin QFN
28-pin SOIC 44-pin TQFP 44-pin TQFP 44-pin TQFP
44-pin QFN 44-pin QFN
28-pin QFN 28-pin QFN
28-pin UQFN 28-pin UQFN
28-pin QFN
28-pin QFN
Note 1: PIC18FXXK22: operating voltage, 1.8V-5.5V.
PIC18LFXXK22: operating voltage, 1.8V-3.6V.
DS41412A-page 480
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
BF ............................................................................ 244, 246
BF Status Flag ......................................................... 244, 246
Block Diagrams
INDEX
A
(CCP) Capture Mode Operation .............................. 180
ADC ......................................................................... 293
ADC Transfer Function ............................................ 305
Analog Input Model .......................................... 305, 314
CCP PWM ............................................................... 186
Comparator 1 ........................................................... 308
Compare .................................................................. 183
Crystal Operation ....................................................... 35
CTMU ...................................................................... 319
CTMU Current Source Calibration Circuit ............... 322
CTMU Typical Connections and Internal
A/D
Analog Port Pins, Configuring .................................. 306
Associated Registers ............................................... 306
Conversions ............................................................. 297
Converter Characteristics ........................................ 461
Discharge ................................................................. 298
Selecting and Configuring Acquisition Time ............ 294
Absolute Maximum Ratings ............................................. 423
AC (Timing) Characteristics ............................................. 443
Load Conditions for Device Timing Specifications ... 444
Parameter Symbology ............................................. 443
Temperature and Voltage Specifications ................. 444
Timing Conditions .................................................... 444
AC Characteristics
Configuration for Pulse Delay Generation ....... 330
CTMU Typical Connections and Internal
Configuration for Time Measurement .............. 329
Digital-to-Analog Converter (DAC) .......................... 342
EUSART Receive .................................................... 266
EUSART Transmit ................................................... 265
External POR Circuit (Slow VDD Power-up) .............. 61
External RC Mode ..................................................... 36
Fail-Safe Clock Monitor (FSCM) ................................ 44
Generic I/O Port ....................................................... 133
High/Low-Voltage Detect with External Input .......... 346
Interrupt Logic .......................................................... 114
On-Chip Reset Circuit ................................................ 59
PIC18F46K22 ............................................................ 16
PWM (Enhanced) .................................................... 190
Reads from Flash Program Memory ......................... 99
Resonator Operation ................................................. 35
Table Read Operation ............................................... 95
Table Write Operation ............................................... 96
Table Writes to Flash Program Memory .................. 101
Timer0 in 16-Bit Mode ............................................. 161
Timer0 in 8-Bit Mode ............................................... 160
Timer1 ..................................................................... 163
Timer1 Gate ............................................. 169, 170, 171
Timer2/4/6 ............................................................... 175
Voltage Reference ................................................... 339
Voltage Reference Output Buffer Example ............. 342
Watchdog Timer ...................................................... 362
BN .................................................................................... 378
BNC ................................................................................. 379
BNN ................................................................................. 379
BNOV .............................................................................. 380
BNZ ................................................................................. 380
BOR. See Brown-out Reset.
BOV ................................................................................. 383
BRA ................................................................................. 381
Break Character (12-bit) Transmit and Receive .............. 284
Brown-out Reset (BOR) ..................................................... 62
Detecting ................................................................... 62
Disabling in Sleep Mode ............................................ 62
Minimum Enable Time ............................................... 62
Software Enabled ...................................................... 62
BSF .................................................................................. 381
BTFSC ............................................................................. 382
BTFSS ............................................................................. 382
BTG ................................................................................. 383
BZ .................................................................................... 384
Internal RC Accuracy ............................................... 446
Access Bank
Mapping with Indexed Literal Offset Mode ................. 94
ACKSTAT ........................................................................ 244
ACKSTAT Status Flag ..................................................... 244
ADC ................................................................................. 293
Acquisition Requirements ........................................ 304
Block Diagram .......................................................... 293
Calculating Acquisition Time .................................... 304
Channel Selection .................................................... 294
Configuration ............................................................ 294
Conversion Clock ..................................................... 295
Conversion Procedure ............................................. 299
Internal Sampling Switch (RSS) IMPEDANCE ............. 304
Interrupts .................................................................. 295
Operation ................................................................. 297
Operation During Sleep ........................................... 298
Port Configuration .................................................... 294
Power Management ................................................. 298
Reference Voltage (VREF) ........................................ 294
Result Formatting ..................................................... 296
Source Impedance ................................................... 304
Special Event Trigger ............................................... 298
Starting an A/D Conversion ..................................... 296
ADCON0 Register ............................................................ 300
ADCON1 Register ............................................................ 301
ADCON2 Register ............................................................ 302
ADDFSR .......................................................................... 412
ADDLW ............................................................................ 375
ADDULNK ........................................................................ 412
ADDWF ............................................................................ 375
ADDWFC ......................................................................... 376
ADRESH Register (ADFM = 0) ........................................ 303
ADRESH Register (ADFM = 1) ........................................ 303
ADRESL Register (ADFM = 0) ......................................... 303
ADRESL Register (ADFM = 1) ......................................... 303
Analog Input Connection Considerations ......................... 314
Analog-to-Digital Converter. See ADC
ANDLW ............................................................................ 376
ANDWF ............................................................................ 377
Assembler
MPASM Assembler .................................................. 420
B
Bank Select Register (BSR) ............................................... 76
BAUDCON Register ......................................................... 276
BC .................................................................................... 377
BCF .................................................................................. 378
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 481
PIC18(L)F2X/4XK22
8 x 8 Signed Multiply Routine .................................. 111
8 x 8 Unsigned Multiply Routine .............................. 111
A/D Conversion ........................................................ 299
Capacitance Calibration Routine ............................. 326
Capacitive Touch Switch Routine ............................ 328
Changing Between Capture Prescalers ................... 181
Clearing RAM Using Indirect Addressing .................. 90
Computed GOTO Using an Offset Value ................... 73
Current Calibration Routine ..................................... 324
Data EEPROM Read ............................................... 107
Data EEPROM Refresh Routine .............................. 108
Data EEPROM Write ............................................... 107
Erasing a Flash Program Memory Row ................... 100
Fast Register Stack ................................................... 73
Initializing PORTA .................................................... 133
Initializing PORTB .................................................... 138
Initializing PORTC ................................................... 142
Initializing PORTD ................................................... 146
Initializing PORTE .................................................... 149
Reading a Flash Program Memory Word .................. 99
Saving Status, WREG and BSR Registers in RAM . 131
Setup for CTMU Calibration Routines ..................... 323
Writing to Flash Program Memory ................... 102–103
Code Protection ............................................................... 351
COMF .............................................................................. 386
Comparator
Associated Registers ............................................... 317
Operation ................................................................. 307
Operation During Sleep ........................................... 311
Response Time ........................................................ 309
Comparator Module
C1 Output State Versus Input Conditions ................ 309
Comparator Specifications ............................................... 441
Comparator Voltage Reference (CVREF)
Effects of a Reset .................................................... 311
Comparator Voltage Reference (CVREF)
Response Time ........................................................ 309
Comparators
C
C Compilers
MPLAB C18 .............................................................420
CALL ................................................................................384
CALLW .............................................................................413
Capture Module. See Enhanced Capture/Compare/
PWM(ECCP)
Capture/Compare/PWM ...................................................179
Capture/Compare/PWM (CCP)
Associated Registers w/
Capture ............................181, 182, 185, 189, 203
Associated Registers w/ Compare ...........................184
Associated Registers w/ PWM ......................... 189, 202
Capture Mode ..........................................................180
CCPx Pin Configuration ...........................................180
Compare Mode ........................................................183
CCPx Pin Configuration ...................................183
Software Interrupt Mode .......................... 180, 183
Special Event Trigger .......................................184
Timer1 Mode Resource ........................... 180, 183
Prescaler ..................................................................181
PWM Mode
Duty Cycle ........................................................187
Effects of Reset ................................................188
Example PWM Frequencies and
Resolutions, 20 MHZ ...............................188
Example PWM Frequencies and
Resolutions, 32 MHZ ...............................188
Example PWM Frequencies and
Resolutions, 8 MHz ..................................188
Operation in Sleep Mode .................................188
Resolution ........................................................188
System Clock Frequency Changes ..................188
PWM Operation .......................................................186
PWM Overview ........................................................186
PWM Period .............................................................187
PWM Setup ..............................................................186
CCPTMRS0 Register .......................................................206
CCPTMRS1 Register .......................................................206
CCPxCON (ECCPx) Register ..........................................203
Clock Accuracy with Asynchronous Operation ................274
Clock Sources
C2OUT as T1 Gate .................................................. 166
Effects of a Reset .................................................... 311
Compare Module. See Enhanced Capture/
Compare/PWM (ECCP)
Computed GOTO ............................................................... 73
CONFIG1H Register ........................................................ 353
CONFIG2H Register ........................................................ 355
CONFIG2L Register ........................................................ 354
CONFIG3H Register ........................................................ 356
CONFIG4L Register ........................................................ 357
CONFIG5H Register ........................................................ 358
CONFIG5L Register ........................................................ 357
CONFIG6H Register ........................................................ 359
CONFIG6L Register ........................................................ 358
CONFIG7H Register ........................................................ 360
CONFIG7L Register ........................................................ 359
Configuration Bits ............................................................ 351
Configuration Register Protection .................................... 367
Context Saving During Interrupts ..................................... 131
CPFSEQ .......................................................................... 386
CPFSGT .......................................................................... 387
CPFSLT ........................................................................... 387
CTMU
External Modes ..........................................................34
EC ......................................................................34
HS ......................................................................35
LP .......................................................................35
OST ....................................................................34
RC ......................................................................36
XT ......................................................................35
Internal Modes ...........................................................36
Frequency Selection ..........................................38
INTOSC .............................................................36
INTOSCIO ..........................................................36
LFINTOSC .........................................................38
Selecting the 31 kHz Source ......................................29
Selection Using OSCCON Register ...........................29
Clock Switching ..................................................................41
CLRF ................................................................................385
CLRWDT ..........................................................................385
CM1CON0 Register .........................................................312
CM2CON0 Register .........................................................313
CM2CON1 Register .........................................................316
Code Examples
Associated Registers ............................................... 333
Calibrating ............................................................... 322
Creating a Delay with ............................................... 330
Effects of a Reset .................................................... 331
16 x 16 Signed Multiply Routine ..............................112
16 x 16 Unsigned Multiply Routine ..........................112
DS41412A-page 482
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
Initialization .............................................................. 321
Measuring Capacitance with .................................... 327
Measuring Time with ................................................ 329
Operation ................................................................. 320
Operation During Idle Mode ..................................... 330
Operation During Sleep Mode ................................. 330
Customer Change Notification Service ............................ 491
Customer Notification Service .......................................... 491
Customer Support ............................................................ 491
CVREF Voltage Reference Specifications ........................ 441
Power-up Timer (PWRT) ........................................... 63
Time-out Sequence ................................................... 63
DEVID1 Register ............................................................. 360
DEVID2 Register ............................................................. 360
Digital-to-Analog Converter (DAC) .................................. 341
Associated Registers ............................................... 344
Effects of a Reset .................................................... 342
Direct Addressing .............................................................. 91
E
ECCP/CCP. See Enhanced Capture/Compare/PWM
ECCPxAS Register .......................................................... 207
EECON1 Register ...................................................... 97, 106
Effect on Standard PIC Instructions ................................. 416
Effects of Power Managed Modes on Various
Clock Sources ........................................................... 40
Effects of Reset
PWM mode .............................................................. 188
Electrical Characteristics ................................................. 423
Enhanced Capture/Compare/PWM (ECCP) .................... 179
Enhanced PWM Mode ............................................. 190
Auto-Restart .................................................... 198
Auto-shutdown ................................................ 197
Direction Change in Full-Bridge Output Mode . 196
Full-Bridge Application ..................................... 194
Full-Bridge Mode ............................................. 194
Half-Bridge Application .................................... 193
Half-Bridge Application Examples ................... 199
Half-Bridge Mode ............................................. 193
Output Relationships (Active-High and
Active-Low) .............................................. 191
Output Relationships Diagram ......................... 192
Programmable Dead Band Delay .................... 199
Shoot-through Current ..................................... 199
Start-up Considerations ................................... 201
Enhanced Universal Synchronous Asynchronous
Receiver Transmitter (EUSART) ............................. 265
Errata ................................................................................. 12
EUSART .......................................................................... 265
Asynchronous Mode ................................................ 267
12-bit Break Transmit and Receive ................. 284
Associated Registers, Receive ........................ 273
Associated Registers, Transmit ....................... 269
Auto-Wake-up on Break .................................. 282
Baud Rate Generator (BRG) ........................... 277
Clock Accuracy ................................................ 274
Receiver .......................................................... 270
Setting up 9-bit Mode with Address Detect ..... 272
Transmitter ...................................................... 267
Baud Rate Generator (BRG)
D
Data Addressing Modes ..................................................... 90
Comparing Addressing Modes with the
Extended Instruction Set Enabled ..................... 93
Direct .......................................................................... 90
Indexed Literal Offset ................................................. 92
Instructions Affected .......................................... 92
Indirect ....................................................................... 90
Inherent and Literal .................................................... 90
Data EEPROM
Code Protection ....................................................... 367
Data EEPROM Memory
Associated Registers ............................................... 109
EEADR and EEADRH Registers ............................. 105
EECON1 and EECON2 Registers ........................... 105
Operation During Code-Protect ............................... 108
Protection Against Spurious Write ........................... 108
Reading .................................................................... 107
Using ........................................................................ 108
Write Verify .............................................................. 107
Writing ...................................................................... 107
Data Memory ..................................................................... 76
Access Bank .............................................................. 82
and the Extended Instruction Set ............................... 92
Bank Select Register (BSR) ....................................... 76
General Purpose Registers ........................................ 82
Map for PIC18F/LF23K22 and PIC18F/LF43K22
Devices .............................................................. 77
Map for PIC18F/LF24K22 and PIC18F/LF44K22
Devices .............................................................. 78
Special Function Registers ........................................ 82
DAW ................................................................................. 388
DC and AC Characteristics
Graphs and Tables .................................................. 463
DC Characteristics
Input/Output ............................................................. 438
Power-Down Current ............................................... 426
Primary Idle Supply Current ..................................... 435
Primary Run Supply Current .................................... 433
RC Idle Supply Current ............................................ 431
RC Run Supply Current ........................................... 429
Secondary Oscillator Supply Current ....................... 436
Supply Voltage ......................................................... 425
DCFSNZ .......................................................................... 389
DECF ............................................................................... 388
DECFSZ ........................................................................... 389
Development Support ...................................................... 419
Device Differences ........................................................... 480
Device Overview
Details on Individual Family Members ....................... 14
Features (table) .......................................................... 15
New Core Features .................................................... 13
Other Special Features .............................................. 14
Device Reset Timers .......................................................... 63
PLL Lock Time-out ..................................................... 63
Associated Registers ....................................... 278
Auto Baud Rate Detect .................................... 281
Baud Rate Error, Calculating ........................... 277
Baud Rates, Asynchronous Modes ................. 278
Formulas .......................................................... 277
High Baud Rate Select (BRGH Bit) ................. 277
Clock polarity
Synchronous Mode .......................................... 285
Data polarity
Asynchronous Receive .................................... 270
Asynchronous Transmit ................................... 267
Synchronous Mode .......................................... 285
Interrupts
Asychronous Receive ...................................... 271
Asynchronous Receive .................................... 271
Asynchronous Transmit ................................... 267
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 483
PIC18(L)F2X/4XK22
Synchronous Master Mode .............................. 285, 290
Associated Registers, Receive ........................289
Associated Registers, Transmit ............... 286, 291
Reception .........................................................288
Transmission ....................................................285
Synchronous Slave Mode
During Sleep .................................................... 349
Setup ....................................................................... 347
Start-up Time ........................................................... 347
Typical Low-Voltage Detect Application .................. 348
HLVD. See High/Low-Voltage Detect. ............................. 345
I
Associated Registers, Receive ........................292
Reception .........................................................292
Transmission ....................................................290
Extended Instruction Set
2
I C Mode (MSSPx)
Acknowledge Sequence Timing .............................. 248
Bus Collision
During a Repeated Start Condition .................. 253
During a Stop Condition .................................. 254
Effects of a Reset .................................................... 249
I C Clock Rate w/BRG ............................................. 256
Master Mode
Operation ......................................................... 240
Reception ........................................................ 246
Start Condition Timing ............................. 242, 243
Transmission ................................................... 244
Multi-Master Communication, Bus Collision and
Arbitration ........................................................ 250
Multi-Master Mode ................................................... 249
Read/Write Bit Information (R/W Bit) ....................... 225
Slave Mode
ADDFSR ..................................................................412
ADDULNK ................................................................412
and Using MPLAB Tools ..........................................418
CALLW .....................................................................413
Considerations for Use ............................................416
MOVSF ....................................................................413
MOVSS ....................................................................414
PUSHL .....................................................................414
SUBFSR ..................................................................415
SUBULNK ................................................................415
Syntax ......................................................................411
2
F
Fail-Safe Clock Monitor .............................................. 44, 351
Fail-Safe Condition Clearing ......................................44
Fail-Safe Detection ....................................................44
Fail-Safe Operation ....................................................44
Reset or Wake-up from Sleep ....................................44
Fast Register Stack ............................................................72
Fixed Voltage Reference (FVR)
Associated Registers ...............................................340
Flash Program Memory ......................................................95
Associated Registers ...............................................103
Control Registers .......................................................96
EECON1 and EECON2 .....................................96
TABLAT (Table Latch) Register .........................98
TBLPTR (Table Pointer) Register ......................98
Erase Sequence ......................................................100
Erasing .....................................................................100
Operation During Code-Protect ...............................103
Reading ......................................................................99
Table Pointer
Transmission ................................................... 230
Sleep Operation ....................................................... 249
Stop Condition Timing ............................................. 248
ID Locations ............................................................. 351, 367
INCF ................................................................................ 390
INCFSZ ............................................................................ 391
In-Circuit Debugger .......................................................... 367
In-Circuit Serial Programming (ICSP) ...................... 351, 367
Indexed Literal Offset Addressing
and Standard PIC18 Instructions ............................. 416
Indexed Literal Offset Mode ............................................. 416
Indirect Addressing ............................................................ 91
INFSNZ ............................................................................ 391
Instruction Cycle ................................................................ 74
Clocking Scheme ....................................................... 74
Instruction Flow/Pipelining ................................................. 74
Instruction Set .................................................................. 369
ADDLW .................................................................... 375
ADDWF .................................................................... 375
ADDWF (Indexed Literal Offset Mode) .................... 417
ADDWFC ................................................................. 376
ANDLW .................................................................... 376
ANDWF .................................................................... 377
BC ............................................................................ 377
BCF ......................................................................... 378
BN ............................................................................ 378
BNC ......................................................................... 379
BNN ......................................................................... 379
BNOV ...................................................................... 380
BNZ ......................................................................... 380
BOV ......................................................................... 383
BRA ......................................................................... 381
BSF .......................................................................... 381
BSF (Indexed Literal Offset Mode) .......................... 417
BTFSC ..................................................................... 382
BTFSS ..................................................................... 382
BTG ......................................................................... 383
BZ ............................................................................ 384
CALL ........................................................................ 384
CLRF ....................................................................... 385
CLRWDT ................................................................. 385
COMF ...................................................................... 386
Boundaries Based on Operation ........................98
Table Pointer Boundaries ..........................................98
Table Reads and Table Writes ..................................95
Write Sequence .......................................................101
Writing To .................................................................101
Protection Against Spurious Writes .................103
Unexpected Termination ..................................103
Write Verify ......................................................103
G
GOTO ...............................................................................390
H
Hardware Multiplier ..........................................................111
Introduction ..............................................................111
Operation .................................................................111
Performance Comparison ........................................111
High/Low-Voltage Detect .................................................345
Applications ..............................................................348
Associated Registers ...............................................349
Characteristics .........................................................442
Current Consumption ...............................................347
Effects of a Reset .....................................................349
Operation .................................................................346
DS41412A-page 484
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
CPFSEQ .................................................................. 386
CPFSGT .................................................................. 387
CPFSLT ................................................................... 387
DAW ......................................................................... 388
DCFSNZ .................................................................. 389
DECF ....................................................................... 388
DECFSZ ................................................................... 389
Extended Instruction Set .......................................... 411
General Format ........................................................ 371
GOTO ...................................................................... 390
INCF ......................................................................... 390
INCFSZ .................................................................... 391
INFSNZ .................................................................... 391
IORLW ..................................................................... 392
IORWF ..................................................................... 392
LFSR ........................................................................ 393
MOVF ....................................................................... 393
MOVFF .................................................................... 394
MOVLB .................................................................... 394
MOVLW ................................................................... 395
MOVWF ................................................................... 395
MULLW .................................................................... 396
MULWF .................................................................... 396
NEGF ....................................................................... 397
NOP ......................................................................... 397
Opcode Field Descriptions ....................................... 370
POP ......................................................................... 398
PUSH ....................................................................... 398
RCALL ..................................................................... 399
RESET ..................................................................... 399
RETFIE .................................................................... 400
RETLW .................................................................... 400
RETURN .................................................................. 401
RLCF ........................................................................ 401
RLNCF ..................................................................... 402
RRCF ....................................................................... 402
RRNCF .................................................................... 403
SETF ........................................................................ 403
SETF (Indexed Literal Offset Mode) ........................ 417
SLEEP ..................................................................... 404
SUBFWB .................................................................. 404
SUBLW .................................................................... 405
SUBWF .................................................................... 405
SUBWFB .................................................................. 406
SWAPF .................................................................... 406
TBLRD ..................................................................... 407
TBLWT ..................................................................... 408
TSTFSZ ................................................................... 409
XORLW .................................................................... 409
XORWF .................................................................... 410
INTCON Register ............................................................. 115
INTCON Registers ................................................... 115–117
INTCON2 Register ........................................................... 116
INTCON3 Register ........................................................... 117
Internal Oscillator Block
TMR0 ....................................................................... 131
TMR0 Overflow ........................................................ 161
Interrupts
TMR1 ....................................................................... 168
IORLW ............................................................................. 392
IORWF ............................................................................. 392
IPR Registers ................................................................... 127
IPR1 Register .................................................................. 127
IPR2 Register .................................................................. 128
IPR3 Register .................................................................. 129
IPR4 Register .................................................................. 130
IPR5 Register .................................................................. 130
L
LFSR ............................................................................... 393
Low-Voltage ICSP Programming. See Single-Supply
ICSP Programming
M
Map .............................................................................. 79, 80
Master Clear (MCLR) ......................................................... 61
Master Synchronous Serial Port. See MSSPx
Memory Organization
Data Memory ............................................................. 76
Program Memory ....................................................... 69
Microchip Internet Web Site ............................................. 491
MOVF .............................................................................. 393
MOVFF ............................................................................ 394
MOVLB ............................................................................ 394
MOVLW ........................................................................... 395
MOVSF ............................................................................ 413
MOVSS ............................................................................ 414
MOVWF ........................................................................... 395
MPLAB ASM30 Assembler, Linker, Librarian .................. 420
MPLAB Integrated Development Environment Software . 419
MPLAB PM3 Device Programmer ................................... 422
MPLAB REAL ICE In-Circuit Emulator System ............... 421
MPLINK Object Linker/MPLIB Object Librarian ............... 420
MSSPx ............................................................................. 209
SPI Mode ................................................................. 212
SSPxBUF Register .................................................. 215
SSPxSR Register .................................................... 215
MULLW ............................................................................ 396
MULWF ............................................................................ 396
N
NEGF ............................................................................... 397
NOP ................................................................................. 397
O
OSCCON Register ....................................................... 32, 33
Oscillator Configuration
EC .............................................................................. 27
ECIO .......................................................................... 27
HS .............................................................................. 27
HSPLL ....................................................................... 27
LP .............................................................................. 27
RC ............................................................................. 27
XT .............................................................................. 27
Oscillator Selection .......................................................... 351
Oscillator Start-up Timer (OST) ................................... 40, 63
Oscillator Switching
HFINTOSC Frequency Drift ....................................... 38
PLL in HFINTOSC Modes .......................................... 39
Internal RC Oscillator
Use with WDT .......................................................... 362
Internal Sampling Switch (RSS) IMPEDANCE ..................... 304
Internet Address ............................................................... 491
Interrupt Sources ............................................................. 351
ADC ......................................................................... 295
Interrupt-on-Change (RB7:RB4) .............................. 138
INTn Pin ................................................................... 131
PORTB, Interrupt-on-Change .................................. 131
Fail-Safe Clock Monitor ............................................. 44
Two-Speed Clock Start-up ........................................ 42
OSCTUNE Register ........................................................... 37
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 485
PIC18(L)F2X/4XK22
Program Memory
and Extended Instruction Set .................................... 94
P
P1A/P1B/P1C/P1D.See Enhanced Capture/Compare/
PWM (ECCP) ...........................................................190
Packaging Information .....................................................465
Marking ....................................................................465
PIE Registers ...................................................................123
PIE1 Register ...................................................................123
PIE2 Register ...................................................................124
PIE3 Register3 .................................................................125
PIE4 Register ...................................................................126
PIE5 Register ...................................................................126
PIR Registers ...................................................................118
PIR1 Register ...................................................................118
PIR2 Register ...................................................................119
PLL Frequency Multiplier ...................................................39
POP ..................................................................................398
POR. See Power-on Reset.
Code Protection ....................................................... 365
Instructions ................................................................ 75
Two-Word .......................................................... 75
Interrupt Vector .......................................................... 69
Look-up Tables .......................................................... 73
Map and Stack (diagram) .......................................... 70
Reset Vector .............................................................. 69
Program Verification and Code Protection ...................... 364
Associated Registers ............................................... 364
PSTRxCON Register ....................................................... 208
PUSH ............................................................................... 398
PUSH and POP Instructions .............................................. 72
PUSHL ............................................................................. 414
PWM (ECCP Module)
PWM Steering .......................................................... 200
Steering Synchronization ......................................... 200
PWM Mode. See Enhanced Capture/Compare/PWM ..... 190
PWM Steering .................................................................. 200
PWMxCON Register ........................................................ 208
PORTA
Associated Registers ...............................................135
PORTA Register ......................................................133
TRISA Register ........................................................133
PORTB
Associated Registers ...............................................141
PORTB Register ......................................................138
PORTC
Associated Registers ...............................................145
PORTC Register ......................................................142
PORTD
Associated Registers ...............................................149
PORTD Register ......................................................146
TRISD Register ........................................................146
PORTE
R
RAM. See Data Memory.
RC_IDLE Mode .................................................................. 53
RC_RUN ............................................................................ 48
RCALL ............................................................................. 399
RCON Register .................................................................. 60
Bit Status During Initialization .................................... 67
RCREG ............................................................................ 272
RCSTA Register .............................................................. 275
Reader Response ............................................................ 492
Register
Associated Registers ...............................................150
PORTE Register ......................................................149
Power Managed Modes .....................................................47
and A/D Operation ...................................................298
Effects on Clock Sources ...........................................40
Entering ......................................................................47
Exiting Idle and Sleep Modes ....................................54
by Interrupt .........................................................54
by Reset .............................................................54
by WDT Time-out ...............................................54
Without a Start-up Delay ....................................54
Idle Modes .................................................................51
PRI_IDLE ...........................................................52
RC_IDLE ............................................................53
SEC_IDLE ..........................................................52
Multiple Sleep Functions ............................................48
Run Modes .................................................................48
PRI_RUN ...........................................................48
SEC_RUN ..........................................................48
Selecting ....................................................................47
Sleep Mode ................................................................51
Summary (table) ........................................................47
Power-on Reset (POR) ......................................................61
Power-up Timer (PWRT) ...........................................63
Time-out Sequence ....................................................63
Power-up Delays ................................................................40
Power-up Timer (PWRT) ....................................................40
Prescaler, Timer0 .............................................................161
PRI_IDLE Mode .................................................................52
PRI_RUN Mode .................................................................48
Program Counter ................................................................70
PCL, PCH and PCU Registers ...................................70
PCLATH and PCLATU Registers ..............................70
RCREG Register ..................................................... 281
Register File ....................................................................... 82
Registers
ADCON0 (ADC Control 0) ....................................... 300
ADCON1 (ADC Control 1) ....................................... 301
ADCON2 (ADC Control 2) ....................................... 302
ADRESH (ADC Result High) with ADFM = 0) ......... 303
ADRESH (ADC Result High) with ADFM = 1) ......... 303
ADRESL (ADC Result Low) with ADFM = 0) ........... 303
ADRESL (ADC Result Low) with ADFM = 1) ........... 303
BAUDCON (Baud Rate Control) .............................. 276
BAUDCON (EUSART Baud Rate Control) .............. 276
CCPTMRS0 (PWM Timer Selection Control 0) ....... 206
CCPTMRS1 (PWM Timer Selection Control 1) ....... 206
CCPxCON (ECCPx Control) .................................... 203
CM1CON0 (C1 Control) ........................................... 312
CM2CON0 (C2 Control) ........................................... 313
CM2CON1 (C2 Control) ........................................... 316
CONFIG1H (Configuration 1 High) .......................... 353
CONFIG2H (Configuration 2 High) .......................... 355
CONFIG2L (Configuration 2 Low) ........................... 354
CONFIG3H (Configuration 3 High) .......................... 356
CONFIG4L (Configuration 4 Low) ........................... 357
CONFIG5H (Configuration 5 High) .......................... 358
CONFIG5L (Configuration 5 Low) ........................... 357
CONFIG6H (Configuration 6 High) .......................... 359
CONFIG6L (Configuration 6 Low) ........................... 358
CONFIG7H (Configuration 7 High) .......................... 360
CONFIG7L (Configuration 7 Low) ........................... 359
CTMUCONH (CTMU Control High) ......................... 331
CTMUCONL (CTMU Control Low) .......................... 332
CTMUICON (CTMU Current Control) ...................... 333
DEVID1 (Device ID 1) .............................................. 360
DS41412A-page 486
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
DEVID2 (Device ID 2) .............................................. 360
ECCPxAS (CCPx Auto-Shutdown Control) ............. 207
EECON1 (Data EEPROM Control 1) ................. 97, 106
HLVDCON (High/Low-Voltage Detect Control) ........ 345
INTCON (Interrupt Control) ...................................... 115
INTCON2 (Interrupt Control 2) ................................. 116
INTCON3 (Interrupt Control 3) ................................. 117
IPR1 (Peripheral Interrupt Priority 1) ........................ 127
IPR2 (Peripheral Interrupt Priority 2) ........................ 128
IPR3 (Peripheral Interrupt Priority) ........................... 129
IPR4 (Peripheral Interrupt Priority) ........................... 130
IPR5 (Peripheral Interrupt Priority) ........................... 130
OSCCON (Oscillator Control) .............................. 32, 33
OSCTUNE (Oscillator Tuning) ................................... 37
PIE1 (Peripheral Interrupt Enable 1) ........................ 123
PIE2 (Peripheral Interrupt Enable 2) ........................ 124
PIE3 (Peripheral Interrupt Enable] ........................... 125
PIE4 (Peripheral Interrupt Enable) ........................... 126
PIE5 (Peripheral Interrupt Enable) ........................... 126
PIR1 (Peripheral Interrupt Request 1) ..................... 118
PIR2 (Peripheral Interrupt Request 2) ..................... 119
PSTRxCON (PWM Steering Control) ...................... 208
PWMxCON (Enhanced PWM Control) .................... 208
RCON (Reset Control) ....................................... 60, 130
RCSTA (Receive Status and Control) ...................... 275
SLRCON (PORT Slew Rate Control) ....................... 157
SRCON0 (SR Latch Control 0) ................................ 337
SRCON1 (SR Latch Control 1) ................................ 338
SSPxADD (MSSPx Address and Baud Rate,
SETF ............................................................................... 403
Shoot-through Current ..................................................... 199
Single-Supply ICSP Programming.
SLEEP ............................................................................. 404
Sleep
OSC1 and OSC2 Pin States ...................................... 41
Sleep Mode ....................................................................... 51
Slew Rate ........................................................................ 152
SLRCON Register ........................................................... 157
Software Simulator (MPLAB SIM) ................................... 421
SPBRG ............................................................................ 277
SPBRGH ......................................................................... 277
Special Event Trigger ...................................................... 298
Special Function Registers ................................................ 82
Map ............................................................................ 83
SPI Mode (MSSPx)
Associated Registers ............................................... 219
SPI Clock ................................................................. 215
SR Latch
Associated Registers ............................................... 338
Effects of a Reset .................................................... 335
SRCON0 Register ........................................................... 337
SRCON1 Register ........................................................... 338
SSPxADD Register .......................................................... 263
SSPxCON1 Register ....................................................... 258
SSPxCON2 Register ....................................................... 260
SSPxMSK Register .......................................................... 262
SSPxOV .......................................................................... 246
SSPxOV Status Flag ....................................................... 246
SSPxSTAT Register ........................................................ 257
R/W Bit .................................................................... 225
Stack Full/Underflow Resets .............................................. 72
Standard Instructions ....................................................... 369
STATUS Register .............................................................. 89
STKPTR Register .............................................................. 72
SUBFSR .......................................................................... 415
SUBFWB ......................................................................... 404
SUBLW ............................................................................ 405
SUBULNK ........................................................................ 415
SUBWF ............................................................................ 405
SUBWFB ......................................................................... 406
SWAPF ............................................................................ 406
2
I C Mode) ........................................................ 263
SSPxCON1 (MSSPx Control 1) ............................... 258
SSPxCON2 (SSPx Control 2) .................................. 260
SSPxMSK (SSPx Mask) .......................................... 262
SSPxSTAT (SSPx Status) ....................................... 257
STATUS ..................................................................... 89
STKPTR (Stack Pointer) ............................................ 72
T0CON (Timer0 Control) .......................................... 159
T1CON (Timer1 Control) .......................................... 172
T1GCON (Timer1 Gate Control) .............................. 173
TXCON .................................................................... 177
TXSTA (Transmit Status and Control) ..................... 274
VREFCON0 ............................................................. 340
VREFCON1 ............................................................. 343
VREFCON2 ............................................................. 344
WDTCON (Watchdog Timer Control) ...................... 363
RESET ............................................................................. 399
Reset State of Registers .................................................... 67
Resets .............................................................................. 351
Brown-out Reset (BOR) ........................................... 351
Oscillator Start-up Timer (OST) ............................... 351
Power-on Reset (POR) ............................................ 351
Power-up Timer (PWRT) ......................................... 351
RETFIE ............................................................................ 400
RETLW ............................................................................ 400
RETURN .......................................................................... 401
Return Address Stack ........................................................ 70
Return Stack Pointer (STKPTR) ........................................ 71
Revision History ............................................................... 479
RLCF ................................................................................ 401
RLNCF ............................................................................. 402
RRCF ............................................................................... 402
RRNCF ............................................................................ 403
T
T0CON Register .............................................................. 159
T1CON Register .............................................................. 172
T1GCON Register ........................................................... 173
Table Pointer Operations (table) ........................................ 98
Table Reads/Table Writes ................................................. 73
TBLRD ............................................................................. 407
TBLWT ............................................................................ 408
Time-out in Various Situations (table) ................................ 64
Timer0 ............................................................................. 159
Associated Registers ............................................... 161
Operation ................................................................. 160
Overflow Interrupt .................................................... 161
Prescaler ................................................................. 161
Prescaler Assignment (PSA Bit) .............................. 161
Prescaler Select (T0PS2:T0PS0 Bits) ..................... 161
Prescaler. See Prescaler, Timer0.
Reads and Writes in 16-Bit Mode ............................ 160
Source Edge Select (T0SE Bit) ............................... 160
Source Select (T0CS Bit) ........................................ 160
Switching Prescaler Assignment ............................. 161
Timer1 ............................................................................. 163
Associated registers ................................................ 174
S
SEC_IDLE Mode ................................................................ 52
SEC_RUN Mode ................................................................ 48
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 487
PIC18(L)F2X/4XK22
2
Asynchronous Counter Mode ..................................165
Reading and Writing ........................................165
Clock Source Selection ............................................164
Interrupt ....................................................................168
Operation .................................................................164
Operation During Sleep ...........................................168
Oscillator ..................................................................165
Prescaler ..................................................................165
Timer1 Gate
I C Bus Start/Stop Bits ............................................ 455
I C Master Mode (7 or 10-Bit Transmission) ........... 245
I C Master Mode (7-Bit Reception) .......................... 247
I C Stop Condition Receive or Transmit Mode ........ 249
2
2
2
Internal Oscillator Switch Timing ............................... 43
Low-Voltage Detect Operation (VDIRMAG = 0) ...... 347
2
Master SSP I C Bus Data ........................................ 458
2
Master SSP I C Bus Start/Stop Bits ........................ 458
PWM Auto-shutdown ............................................... 198
Firmware Restart ............................................. 198
PWM Direction Change ........................................... 196
PWM Direction Change at Near 100% Duty Cycle .. 197
PWM Output (Active-High) ...................................... 191
PWM Output (Active-Low) ....................................... 192
Repeat Start Condition ............................................ 243
Reset, Watchdog Timer (WDT), Oscillator Start-up
Timer (OST), Power-up Timer (PWRT) .......... 448
Send Break Character Sequence ............................ 284
Slow Rise Time (MCLR Tied to VDD,
VDD Rise > TPWRT) ............................................ 65
SPI Mode (Master Mode) ......................................... 215
Synchronous Reception (Master Mode, SREN) ...... 289
Synchronous Transmission ..................................... 286
Synchronous Transmission (Through TXEN) .......... 286
Time-out Sequence on POR w/PLL Enabled
(MCLR Tied to VDD) .......................................... 66
Time-out Sequence on Power-up (MCLR
Not Tied to VDD, Case 1) ................................... 64
Time-out Sequence on Power-up (MCLR
Not Tied to VDD, Case 2) ................................... 65
Time-out Sequence on Power-up (MCLR
Tied to VDD, VDD Rise < TPWRT) ....................... 64
Timer0 and Timer1 External Clock .......................... 449
Timer1 Incrementing Edge ...................................... 169
Transition for Entry to SEC_RUN Mode .................... 49
Transition for Entry to Sleep Mode ............................ 51
Transition for Wake from Sleep (HSPLL) .................. 52
Transition from RC_RUN Mode to PRI_RUN Mode .. 50
Transition from SEC_RUN Mode to
Selecting Source ..............................................166
TMR1H Register ......................................................163
TMR1L Register .......................................................163
Timer2
Associated registers .................................................178
Timer2/4/6 ........................................................................175
Associated registers .................................................178
Timers
Timer1
T1CON .............................................................172
T1GCON ..........................................................173
Timer2/4/6
TXCON ............................................................177
Timing Diagrams
A/D Conversion ........................................................461
Acknowledge Sequence ..........................................248
Asynchronous Reception .........................................273
Asynchronous Transmission ....................................268
Asynchronous Transmission (Back to Back) ...........269
Auto Wake-up Bit (WUE) During Normal Operation 283
Auto Wake-up Bit (WUE) During Sleep ...................283
Automatic Baud Rate Calculator ..............................282
Baud Rate Generator with Clock Arbitration ............241
BRG Reset Due to SDA Arbitration During Start
Condition ..........................................................252
Brown-out Reset (BOR) ...........................................448
Bus Collision During a Repeated Start Condition
(Case 1) ...........................................................253
Bus Collision During a Repeated Start Condition
(Case 2) ...........................................................253
Bus Collision During a Start Condition (SCL = 0) ....252
Bus Collision During a Stop Condition (Case 1) ......254
Bus Collision During a Stop Condition (Case 2) ......254
Bus Collision During Start Condition (SDA only) .....251
Bus Collision for Transmit and Acknowledge ...........250
Capture/Compare/PWM (CCP) ................................450
CLKO and I/O ..........................................................447
Clock Synchronization .............................................238
Clock/Instruction Cycle ..............................................74
Comparator Output ..................................................307
EUSART Synchronous Receive (Master/Slave) ......460
EUSART Synchronous Transmission
PRI_RUN Mode (HSPLL) .................................. 49
Transition Timing for Entry to Idle Mode .................... 52
Transition Timing for Wake from Idle to Run Mode ... 53
Timing Diagrams and Specifications ............................... 445
A/D Conversion Requirements ................................ 462
Capture/Compare/PWM Requirements ................... 451
CLKO and I/O Requirements ................................... 447
EUSART Synchronous Receive Requirements ....... 460
EUSART Synchronous Transmission
Requirements .................................................. 460
Example SPI Mode Requirements
(Master Mode, CKE = 0) .................................. 452
(Master Mode, CKE = 1) .................................. 453
(Slave Mode, CKE = 0) .................................... 454
(Slave Mode, CKE = 1) .................................... 455
External Clock Requirements .................................. 445
(Master/Slave) ..................................................460
Example SPI Master Mode (CKE = 0) .....................451
Example SPI Master Mode (CKE = 1) .....................452
Example SPI Master Mode Timing ..........................451
Example SPI Slave Mode (CKE = 0) .......................453
Example SPI Slave Mode (CKE = 1) .......................454
External Clock (All Modes except PLL) ....................445
Fail-Safe Clock Monitor (FSCM) ................................45
First Start Bit Timing ................................................242
Full-Bridge PWM Output ..........................................195
Half-Bridge PWM Output ................................. 193, 199
High/Low-Voltage Detect Characteristics ................442
High-Voltage Detect Operation (VDIRMAG = 1) ......348
2
I C Bus Data Requirements (Slave Mode) .............. 457
2
I C Bus Start/Stop Bits Requirements
(Slave Mode) ................................................... 456
2
Master SSP I C Bus Data Requirements ................ 459
2
Master SSP I C Bus Start/Stop Bits Requirements . 458
PLL Clock ................................................................ 446
Reset, Watchdog Timer, Oscillator Start-up Timer,
Power-up Timer and Brown-out Reset
Requirements .................................................. 448
Timer0 and Timer1 External Clock Requirements ... 449
2
I C Bus Data ............................................................456
DS41412A-page 488
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
Top-of-Stack Access .......................................................... 71
TSTFSZ ........................................................................... 409
Two-Speed Clock Start-up Mode ....................................... 42
Two-Speed Start-up ......................................................... 351
Two-Word Instructions
Example Cases .......................................................... 75
TXCON (Timer2/4/6) Register ......................................... 177
TXREG ............................................................................. 267
TXSTA Register ............................................................... 274
BRGH Bit ................................................................. 277
V
Voltage Reference (VR)
Specifications ........................................................... 441
VREF. SEE ADC Reference Voltage
VREFCON0 Register ....................................................... 340
VREFCON1 (Digital-to-Analog Converter Control 0)
Register .................................................................... 343
VREFCON2 (Digital-to-Analog Converter Control 1)
Register .................................................................... 344
W
Wake-up on Break ........................................................... 282
Watchdog Timer (WDT) ........................................... 351, 362
Associated Registers ............................................... 363
Control Register ....................................................... 363
Programming Considerations .................................. 362
WCOL ...................................................... 241, 244, 246, 248
WCOL Status Flag ................................... 241, 244, 246, 248
WDTCON Register .......................................................... 363
WWW Address ................................................................. 491
WWW, On-Line Support .................................................... 12
X
XORLW ............................................................................ 409
XORWF ............................................................................ 410
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 489
PIC18(L)F2X/4XK22
NOTES:
DS41412A-page 490
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
THE MICROCHIP WEB SITE
CUSTOMER SUPPORT
Microchip provides online support via our WWW site at
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To register, access the Microchip web site at
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2010 Microchip Technology Inc.
Preliminary
DS41412A-page 491
PIC18(L)F2X/4XK22
READER RESPONSE
It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip prod-
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PIC18(L)F2X/4XK22
DS41412A
Literature Number:
Device:
Questions:
1. What are the best features of this document?
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3. Do you find the organization of this document easy to follow? If not, why?
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DS41412A-page 492
Preliminary
2010 Microchip Technology Inc.
PIC18(L)F2X/4XK22
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
X
/XX
XXX
PART NO.
Device
X
-
Examples:
Temperature
Range
Package
Pattern
Packaging
Option
a)
b)
PIC18F46K22-E/P 301 = Extended temp.,
PDIP package, QTP pattern #301.
PIC18F46K22-I/SO = Industrial temp., SOIC
package.
c)
d)
PIC18F46K22-E/P = Extended temp., PDIP
package.
Device:
PIC18F46K22, PIC18LF46K22
PIC18F45K22, PIC18LF45K22
PIC18F44K22, PIC18LF44K22
PIC18F43K22, PIC18LF43K22
PIC18F26K22, PIC18LF26K22
PIC18F25K22, PIC18LF25K22
PIC18F24K22, PIC18LF24K22
PIC18F23K22, PIC18LF23K22
PIC18F46K22T-I/ML
=
Tape and reel,
Industrial temp., QFN package.
Packaging
Option:
blank = standard packaging (tube or tray)
T = Tape and Reel(1)
Note 1:
Tape and Reel option is available for ML,
MV, PT, SO and SS packages with industrial
Temperature Range only.
Temperature
Range:
E
I
=
=
-40C to +125C (Extended)
-40C to +85C
(Industrial)
Package:
ML
MV
P
PT
SO
SP
SS
=
QFN
=
=
=
=
=
=
UQFN
PDIP
TQFP (Thin Quad Flatpack)
SOIC
Skinny Plastic DIP
SSOP
Pattern:
QTP, SQTP, Code or Special Requirements
(blank otherwise)
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 493
WORLDWIDE SALES AND SERVICE
AMERICAS
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Corporate Office
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Fax: 91-80-3090-4123
Austria - Wels
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China - Shanghai
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Fax: 65-6334-8850
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Fax: 248-538-2260
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Fax: 86-24-2334-2393
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Fax: 886-3-6578-370
Kokomo
Kokomo, IN
Tel: 765-864-8360
Fax: 765-864-8387
China - Shenzhen
Tel: 86-755-8203-2660
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Tel: 886-7-536-4818
Fax: 886-7-536-4803
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Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
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Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
Taiwan - Taipei
Tel: 886-2-2500-6610
Fax: 886-2-2508-0102
Santa Clara
China - Xian
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Fax: 86-29-8833-7256
Thailand - Bangkok
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Fax: 66-2-694-1350
Santa Clara, CA
Tel: 408-961-6444
Fax: 408-961-6445
China - Xiamen
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Fax: 86-592-2388130
Toronto
Mississauga, Ontario,
Canada
Tel: 905-673-0699
Fax: 905-673-6509
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
01/05/10
DS41412A-page 494
Preliminary
2010 Microchip Technology Inc.
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SMBus Multi-Output Power-Supply ControllerWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
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SI9135LG-T1-E3
SMBus Multi-Output Power-Supply ControllerWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
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SI9135_11
SMBus Multi-Output Power-Supply ControllerWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
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SI9136_11
Multi-Output Power-Supply ControllerWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
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SI9130CG-T1-E3
Pin-Programmable Dual Controller - Portable PCsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
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SI9130LG-T1-E3
Pin-Programmable Dual Controller - Portable PCsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
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SI9130_11
Pin-Programmable Dual Controller - Portable PCsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
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SI9137
Multi-Output, Sequence Selectable Power-Supply Controller for Mobile ApplicationsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
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SI9137DB
Multi-Output, Sequence Selectable Power-Supply Controller for Mobile ApplicationsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
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SI9137LG
Multi-Output, Sequence Selectable Power-Supply Controller for Mobile ApplicationsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
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VISHAY
SI9122E
500-kHz Half-Bridge DC/DC Controller with Integrated Secondary Synchronous Rectification DriversWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
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