PL610-01-XXXGI [MICROCHIP]
1.8V to 3.3V, 1 MHz to 130 MHz XO IC;
| 型号： | PL610-01-XXXGI |
| 厂家： | 
MICROCHIP |
| 描述： | 1.8V to 3.3V, 1 MHz to 130 MHz XO IC 时钟 光电二极管 外围集成电路 石英晶振 |
| 文件： | 总20页 (文件大小：316K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
PL610-01
1.8V to 3.3V, 1 MHz to 130 MHz XO IC
Features
General Description
• Wide Frequency Coverage, Programmable,
Advanced Oscillator Design
The PL610 is a high performance general purpose
oscillator IC for outputs up to 130 MHz. Designed to fit
in a small 2 mm x 1.3 mm TDFN or 3 mm x 3 mm
SOT-23 package, the PL610 offers the best phase
noise and jitter performance as well as the lowest
power consumption of any comparable IC.
• Programmable “Odd/Even” Divider up to ÷63
• Direct Oscillation Operation with Optional
Programmable Features:
- Output Drive Strength (4 mA, 8 mA, or
16 mA)
In addition, there is a ‘6’ bit optional programmable
Odd/Even divider (default = ÷1), and ‘3’ programmable
output drive strengths (4 mA, 8 mA [default], 16 mA) to
choose from. The full feature set of the PL610 makes it
the most versatile XO for any application.
- 6-bit Odd/Even Output Divider
• Input Frequency:
- Fundamental Crystal: 5 MHz to 130 MHz
- Reference Clock: 1 MHz to 130 MHz
• Supports CMOS or Sine Wave Input Clock
• Output Frequency: 20 kHz to 130 MHz
• Very Low Jitter and Phase Noise
• Low Current Consumption
• Single 1.8V ~ 3.3V ±10% Power Supply
• Operating Temperature Range from –40°C to
+85°C
• Available in 6-pin TDFN or SOT-23
GREEN/RoHS-Compliant Packaging
Block Diagram
PL610-01
FIN
P-Counter
(6-bit)
FREF
XTAL
OSC
CLK0
XOUT
(PDB)
Programmable
CLOAD
OE, PDB, CLK1
/1,ꢀꢁ2
Programmable Function
2016 Microchip Technology Inc.
DS20005615A-page 1
PL610-01
1.0
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings †
Supply Voltage (VDD) ................................................................................................................................ –0.5V to +4.6V
Input Voltage (VIN).............................................................................................................................–0.5V to VDD + 0.5V
Output Voltage (VOUT).......................................................................................................................–0.5V to VDD + 0.5V
† Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device.
This is a stress rating only and functional operation of the device at those or any other conditions above those indicated
in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended
periods may affect device reliability. Parts are tested to commercial grade only.
DS20005615A-page 2
2016 Microchip Technology Inc.
PL610-01
TABLE 1-1:
AC ELECTRICAL CHARACTERISTICS
Parameters
Sym.
Min.
Typ.
Max.
Units
Conditions
Crystal Input Frequency
FIN Input Frequency
—
5
—
130
MHz
Fundamental Crystal
@ VDD = 3.3V
—
—
1
—
—
—
130
VDD
VDD
MHz
@ VDD = 2.5V
@ VDD = 1.8V
Internally AC-coupled
(High Frequency)
0.9
0.1
Internally AC-coupled
(Low Frequency)
3.3V <50 MHz, 2.5V <40 MHz,
1.8V <15 MHz
FIN Input Signal Amplitude
VPP
Output Frequency
VDD Sensitivity
—
—
0.02
–2
—
—
130
2
MHz
ppm
@ VDD = 1.8V-3.3V
Frequency vs. VDD ±10%
15 pF Load, 10/90% VDD
High Drive, 3.3V
,
Output Rise Time (see Figure 5-1)
—
—
1
1.2
ns
15 pF Load, 10/90% VDD
High Drive, 3.3V
,
Output Fall Time (see Figure 5-1)
Duty Cycle (Note 1, see Figure 5-1)
—
—
—
1
1.2
55
ns
%
45
50
—
Note 1: For 1.8V operation, the 50% ±5% duty cycle is guaranteed for frequencies ≤40 MHz.
TABLE 1-2:
DC ELECTRICAL CHARACTERISTICS
Parameters
Sym.
Min.
Typ.
Max.
Units
Conditions
VDD = 3.3V, 25 MHz,
Load = 15 pF
—
3.4
—
VDD = 2.5V, 25 MHz,
Load = 10 pF
—
—
—
2.1
0.9
—
—
—
Supply Current, Dynamic, with
Loaded CMOS Output
IDD
mA
VDD = 1.8V, 25 MHz,
Load = 5 pF
VDD = 1.8V, 2.0 MHz,
Load = 5 pF
0.65
Operating Voltage
Output Low Voltage
VDD
VOL
1.62
—
—
—
3.63
0.1
V
V
—
IOL = +4 mA Standard Drive
VDD
0.4
–
Output High Voltage
VOH
IOLD
IOSD
IOHD
—
—
—
—
—
—
—
—
V
IOH = –4 mA Standard Drive
Output Current, Low Drive
(See Figure 5-2)
4
8
mA
mA
mA
VOL = 0.4V, VOH = 2.4V
VOL = 0.4V, VOH = 2.4V
VOL = 0.4V, VOH = 2.4V
Output Current, Standard Drive
(See Figure 5-2)
Output Current, High Drive
(See Figure 5-2)
16
2016 Microchip Technology Inc.
DS20005615A-page 3
PL610-01
TABLE 1-3:
CRYSTAL SPECIFICATIONS (5 MHZ TO 60 MHZ)
Parameters
Sym.
Min.
Typ.
Max.
Units
Conditions
Fundamental Crystal Resonator
Frequency
FXIN
5
—
60
MHz
—
Crystal Loading Rating
(The IC can be programmed for any CL(XTAL)
value in this range.)
8
—
12
pF
—
—
—
—
Maximum Sustainable Drive Level
Operating Drive Level
—
—
—
25
—
100
—
3
µW
µW
pF
—
—
—
Crystal Shunt Capacitance
C0
Effective Series Resistance,
Fundamental, (See Figure 5-4)
ESR
—
—
50
Ω
—
TABLE 1-4:
CRYSTAL SPECIFICATIONS (60 MHZ TO 130 MHZ)
Parameters
Sym.
Min.
Typ.
Max.
Units
Conditions
Fundamental Crystal Resonator
Frequency
FXIN
60
—
130
MHz
—
Crystal Loading Rating
(The IC can be programmed for any CL(XTAL)
value in this range.)
5
—
8
pF
—
—
—
—
Maximum Sustainable Drive Level
Operating Drive Level
—
—
—
25
—
100
—
µW
µW
pF
—
—
—
Crystal Shunt Capacitance
C0
2.5
Effective Series Resistance,
Fundamental, (See Figure 5-4)
ESR
—
—
30
Ω
—
TABLE 1-5:
KEY PROGRAMMING PARAMETERS (OPTIONAL)
CLK[0:1]
Output Frequency
Output Drive Strength
Programmable Input/Output
FOUT = FREF ÷ P*
(*: P is an Odd/Even Divider)
Where P = 6 bit
Three optional drive strengths to
choose from:
One output pin can be configured
as:
• Low: 4 mA
• OE - input
• Std: 8 mA (default)
• High: 16 mA
• PDB - input
• CLK1 – output
CLK0 = FREF, FREF/2 or FREF/P
CLK1 = FREF, FREF/2 or CLK0
DS20005615A-page 4
2016 Microchip Technology Inc.
PL610-01
TEMPERATURE SPECIFICATIONS (Note 1)
Parameters
Temperature Ranges
Sym.
Min.
Typ.
Max.
Units
Conditions
Storage Temperature Range
TS
TA
–65
–40
—
—
+150
+85
°C
°C
—
Ambient Operating Temperature
—
Note 1: Exposure of the device under conditions beyond the limits specified by the maximum ratings for extended
periods may cause permanent damage to the device and affect product reliability. These conditions
represent a stress rating only, and functional operations of the device at these or any other conditions
above the operational limits noted in this specification is not implied. Operating temperature is guaranteed
by design. Parts are tested to commercial grade only.
2016 Microchip Technology Inc.
DS20005615A-page 5
PL610-01
2.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 2-1.
Pin Configurations
PL610-01
PL610-01
6-Pin TDFN
6-Pin SOT-23
OE^, PDB^, CLK1
CLK0
VDD
XIN, FIN
OE^, PDB^, CLK1
GND
XOUT
VDD
1
2
3
6
5
4
1
2
3
6
5
4
GND
CLK0
XIN, FIN
XOUT
TABLE 2-1:
PIN FUNCTION TABLE
6-Pin TDFN
Pin Number
6-Pin SOT-23
Name
Type
Description
Pin Number
1
3
XIN, FIN
I
Crystal or Reference Clock input pin
This programmable I/O pin can be configured as an
Output Enable (OE) input, Power Down input (PDB)
input or CLK1 clock output. This pin has an internal
60 kꢀ pull-up resistor for OE and 10 Mꢀ pull up
resistor for PDB.
OE, PDB,
CLK1
2
1
I/O
State
OE
PDB
Power Down
Mode
0
Tri-State CLK
Normal Mode
1 (default)
Normal Mode
3
4
5
2
6
5
GND
CLK0
VDD
P
O
P
GND connection
Programmable Clock Output
VDD connection
Crystal Output pin. Do Not Connect (DNC) when FIN is
present.
6
4
XOUT
O
DS20005615A-page 6
2016 Microchip Technology Inc.
PL610-01
3.0
FUNCTIONAL DESCRIPTION
PL610-01 is a highly featured, very flexible, advanced
XO design for high performance, low-power, small
form-factor applications. The PL610-01 accepts a
fundamental input crystal of 5 MHz to 130 MHz or a
reference clock input of 1 MHz to 130 MHz and is
capable of producing two outputs up to 130 MHz. This
flexible design allows the PL610-01 to deliver any
frequency, FREF (Crystal or Ref Clk) frequency, FREF/2
or FREF/P to CLK0 and/or CLK1. Some of the design
features of the PL610-01 are mentioned below.
3.1
Clock Output (CLK0)
CLK0 is the main clock output. The output from CLK0
can be FREF (Crystal or Ref Clk), FREF/2 or FREF/P
output. The output drive level can be programmed to
Low Drive (4 mA), Standard Drive (8 mA), or High Drive
(16 mA).
3.2
Programmable I/O (OE/PDB/CLK1)
The PL610-01 provides one programmable I/O pin
which can be configured as one of the following
functions:
3.2.1
OUTPUT ENABLE (OE)
The Output Enable feature allows the user to enable
and disable the clock output(s) by toggling the OE pin.
The OE pin incorporates a 60 kꢀ pull-up resistor giving
a default condition of logic “1”.
3.2.2
POWER DOWN CONTROL (PDB)
The Power Down (PDB) feature allows the user to put
the PL610-01 into “Sleep Mode.” When activated (logic
‘0’), PDB disables the PLL, the oscillator circuitry,
counters, and all other active circuitry. In Power Down
mode the IC consumes <10 µA of power. The PDB pin
incorporates a 10 Mꢀ pull-up resistor giving a default
condition of logic “1”.
3.2.3
CLOCK OUTPUT (CLK1)
The CLK1 feature allows the PL610-01 to have an
additional clock output programmed to one of the
following:
• FREF - Reference (Crystal or Ref Clk) Frequency
• FREF/2
• CLK0
2016 Microchip Technology Inc.
DS20005615A-page 7
PL610-01
4.0
LAYOUT RECOMMENDATIONS
The following guidelines are to assist you with a
performance-optimized PCB design.
4.2
Decoupling and Power Supply
Considerations
4.1
Signal Integrity and Termination
Considerations
• Place decoupling capacitors as close as possible
to the VDD pin(s) to limit noise from the power
supply.
• Keep traces short.
• Trace = Inductor. With a capacitive load this
creates ringing.
• Multiple VDD pins should be decoupled separately
for best performance.
• Long trace = Transmission Line. Without proper
termination this will cause reflections (looks like
ringing).
• Addition of a ferrite bead in series with VDD can
help prevent noise from other board sources.
• Design long traces as “striplines” or “microstrips”
with defined impedance.
• Value of decoupling capacitor is frequency
dependent. Typical values to use are 0.1 µF for
designs using crystals <50 MHz and 0.01 µF for
designs using crystals >50 MHz.
• Match trace at one side to avoid reflections
bouncing back and forth.
4.3
Typical CMOS Termination
Place series resistor as close as possible to the CMOS output.
CMOS Output Buffer
To CMOS Input
(Typical buffer impedance 20:ꢀ
50: line
Series Resistor
Use value to match output
buffer impedance to 50:
trace. Typical value 30:
FIGURE 4-1:
Typical CMOS Termination.
4.4
Crystal Tuning Circuit
Series and parallel capacitors are used to fine tune the crystal load to the circuit load.
Cst
XIN
XOUT
Cpt
Cpt
CST: Series capacitor, used to lower circuit load to match crystal load. Raises frequency offset. This can be eliminated
by using a crystal with a CLOAD of equal or greater value than the oscillator.
CPT: Parallel capacitors, used to raise the circuit load to match the crystal load. Lowers frequency offset.
DS20005615A-page 8
2016 Microchip Technology Inc.
PL610-01
5.0
MEASUREMENT TEST
CIRCUITS (MTC)
A
0.1μF
0.1μF
VDD
CLK
VDD
XIN
0.1μF
R
XIN
FET
Probe
XOUT
CLK
XOUT
OE^ GND
OE^ GND
CL
FIGURE 5-3:
MTC-3: Jitter and Phase
Noise.
FIGURE 5-1:
MTC-1: Rise Time, Fall
Time, Duty Cycle, V , V , I , Power Down
OL
OH DD
Current, Output Enable/Disable.
VDD
XIN
XOUT
Network
Analyzer
0.1μF
CLK
0.1μF
OE^ GND
VDD
XIN
FIGURE 5-4:
Resistance.
MTC-4 Negative
FET
Probe
CLK
XOUT
OE^ GND
V
0.1μF
FIGURE 5-2:
MTC-2: Output Drive
Current and Output Impedance.
2016 Microchip Technology Inc.
DS20005615A-page 9
PL610-01
6.0
WAVEFORM SWITCHING
CHARACTERISTICS
VDD
90%VDD
VOH
VOL
GND
10%VDD
tr
tf
FIGURE 6-2:
V
, V
.
OL
OH
FIGURE 6-1:
Rise and Fall Times.
Tw
T
50%VDD
Duty Cycle = 100% ×
Tw
T
FIGURE 6-3:
Duty Cycle.
DS20005615A-page 10
2016 Microchip Technology Inc.
PL610-01
7.0
PACKAGING INFORMATION
6-Pin TDFN 2.0 mm x 1.3 mm Package Outline and Recommended Land Pattern
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging.
2016 Microchip Technology Inc.
DS20005615A-page 11
PL610-01
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging.
DS20005615A-page 12
2016 Microchip Technology Inc.
PL610-01
6-Pin SOT-23 Package Outline and Recommended Land Pattern
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging.
2016 Microchip Technology Inc.
DS20005615A-page 13
PL610-01
NOTES:
DS20005615A-page 14
2016 Microchip Technology Inc.
PL610-01
APPENDIX A: REVISION HISTORY
Revision A (August 2016)
• Converted Micrel document PL610-01 to Micro-
chip data sheet DS20005615A.
• Minor text changes throughout.
2016 Microchip Technology Inc.
DS20005615A-page 15
PL610-01
NOTES:
DS20005615A-page 16
2016 Microchip Technology Inc.
PL610-01
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office.
Examples:
X
XX
X
X
PART NO.
Device
XX
a) PL610-01-XXXTC: 1.8V to 3.3V, 1 MHz to 130 MHz
XO IC, ID Code, 6-Pin SOT-23,
Commercial Temperature Range,
Bag
ID Code Package
Temperature Media Type
Device:
PL610-01:
XXX =
1.8V to 3.3V, 1 MHz to 130 MHz XO IC
b) PL610-01-XXXTC-TR:1.8V to 3.3V, 1 MHz to 130 MHz
XO IC, ID Code, 6-Pin SOT-23,
Commercial Temperature Range,
Tape & Reel
ID Code:
3 Digit ID Code will be assigned at time of
programming
c) PL610-01-XXXTI:
1.8V to 3.3V, 1 MHz to 130 MHz
XO IC, ID Code, 6-Pin SOT-23,
Industrial Temperature Range,
Bag
Package:
T
G
=
=
6-Pin SOT-23
6-Pin TDFN
d) PL610-01-XXXTI-TR:1.8V to 3.3V, 1 MHz to 130 MHz
XO IC, ID Code, 6-Pin SOT-23,
Industrial Temperature Range,
Tape & Reel
Temperature:
Media Type:
C
I
=
=
0°C to +70°C (Commercial)
–40°C to +85°C (Industrial)
none =
TR
Bag
Tape & Reel
e) PL610-01-XXXGC: 1.8V to 3.3V, 1 MHz to 130 MHz
XO IC, ID Code, 6-Pin TDFN,
Commercial Temperature Range,
Bag
=
Part Marking (Note 1)
f) PL610-01-XXXGC-TR:1.8V to 3.3V, 1 MHz to 130 MHz
XO IC, ID Code, 6-Pin TDFN,
TDFN Marking
SOT-23 Marking
Commercial Temperature Range,
Tape & Reel
XXX
LLL
E1XXX
LLL
g) PL610-01-XXXGI:
1.8V to 3.3V, 1 MHz to 130 MHz
XO IC, ID Code, 6-Pin TDFN,
Industrial Temperature Range,
Bag
Note 1:
“XXX” designates a marking identifier that could be indepen-
dent of the part number.
h) PL610-01-XXXGI-TR:1.8V to 3.3V, 1 MHz to 130 MHz
XO IC, ID Code, 6-Pin TDFN,
Industrial Temperature Range,
Tape & Reel
2016 Microchip Technology Inc.
DS20005615A-page 17
PL610-01
NOTES:
DS20005615A-page 18
2016 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
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OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
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QUALITYꢀMANAGEMENTꢀꢀSYSTEMꢀ
CERTIFIEDꢀBYꢀDNVꢀ
© 2016, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
ISBN: 978-1-5224-0868-0
== ISO/TSꢀ16949ꢀ==ꢀ
2016 Microchip Technology Inc.
DS20005615A-page 19
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Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
Japan - Tokyo
Tel: 81-3-6880- 3770
Fax: 81-3-6880-3771
China - Dongguan
Tel: 86-769-8702-9880
Italy - Venice
Tel: 39-049-7625286
Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
Korea - Daegu
Tel: 82-53-744-4301
Fax: 82-53-744-4302
China - Guangzhou
Tel: 86-20-8755-8029
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
China - Hangzhou
Tel: 86-571-8792-8115
Fax: 86-571-8792-8116
Korea - Seoul
Cleveland
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
Poland - Warsaw
Tel: 48-22-3325737
Independence, OH
Tel: 216-447-0464
Fax: 216-447-0643
China - Hong Kong SAR
Tel: 852-2943-5100
Fax: 852-2401-3431
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
Fax: 60-3-6201-9859
Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
China - Nanjing
Tel: 86-25-8473-2460
Fax: 86-25-8473-2470
Sweden - Stockholm
Tel: 46-8-5090-4654
Malaysia - Penang
Tel: 60-4-227-8870
Fax: 60-4-227-4068
Detroit
Novi, MI
Tel: 248-848-4000
UK - Wokingham
Tel: 44-118-921-5800
Fax: 44-118-921-5820
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
Houston, TX
Tel: 281-894-5983
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
Indianapolis
Noblesville, IN
Tel: 317-773-8323
Fax: 317-773-5453
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
Taiwan - Hsin Chu
Tel: 886-3-5778-366
Fax: 886-3-5770-955
Los Angeles
China - Shenzhen
Tel: 86-755-8864-2200
Fax: 86-755-8203-1760
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
Taiwan - Kaohsiung
Tel: 886-7-213-7828
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
Taiwan - Taipei
Tel: 886-2-2508-8600
Fax: 886-2-2508-0102
New York, NY
Tel: 631-435-6000
San Jose, CA
Tel: 408-735-9110
China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
Canada - Toronto
Tel: 905-695-1980
Fax: 905-695-2078
06/23/16
DS20005615A-page 20
2016 Microchip Technology Inc.
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