TC11075.0VUATR [MICROCHIP]
Fixed Positive LDO Regulator, 5V, 0.48V Dropout, CMOS, PDSO8, MSOP-8;
| 型号： | TC11075.0VUATR |
| 厂家： | 
MICROCHIP |
| 描述： | Fixed Positive LDO Regulator, 5V, 0.48V Dropout, CMOS, PDSO8, MSOP-8 光电二极管 输出元件 调节器 |
| 文件： | 总7页 (文件大小：71K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
EVALUATION
KIT
AVAILABLE
TC1107
300mA CMOS LDO WITH SHUTDOWN AND VREF BYPASS
FEATURES
GENERAL DESCRIPTION
■ Zero Ground Current for Longer Battery Life!
■ Very Low Dropout Voltage
■ Guaranteed 300mA Output
■ High Output Voltage Accuracy
■ Standard or Custom Output Voltages
■ Power-Saving Shutdown Mode
■ Bypass Input for Ultra-Quiet Operation
■ Over-Current and Over-Temperature Protection
■ Space-Saving MSOP Package Option
The TC1107 is a fixed output, high accuracy (typically
±0.5%) CMOS upgrade for older (bipolar) low dropout
regulators. Total supply current is typically 50µA at full load
(20 to 60 times lower than in bipolar regulators!).
TC1107 key features include ultra low noise operation
(plus optional Bypass input); very low dropout voltage
(typically 240mV at full load), and fast response to step
changes in load. Supply current is reduced to 0.05µA
(typical) and VOUT falls to zero when the shutdown input is
low.
The TC1107 incorporates both over-temperature and
over-currentprotection. TheTC1107isstablewithanoutput
capacitor of only 1µF and has a maximum output current of
300mA.
APPLICATIONS
■ Battery-Operated Systems
■ Portable Computers
■ Medical Instruments
■ Instrumentation
ORDERING INFORMATION
■ Cellular / GSM / PHS Phones
■ Linear Post-Regulator for SMPS
■ Pagers
Part
Number
Junction
Temp. Range
Package
TC1107-xxVOA
TC1107-xxVUA
8-Pin SOIC
8-Pin MSOP
– 40°C to +125°C
– 40°C to +125°C
TYPICAL APPLICATION
TC1015EV
Evaluation Kit for CMOS LDO Family
Available Output Voltages:
2.5, 2.8, 3.0, 3.3, 5.0
1
2
xx indicates output voltages
8
7
VOUT
VOUT
GND
VIN
NC
VIN
C1
1µF
Other output voltages are available. Please contact TelCom
Semiconductor for details.
PIN CONFIGURATIONS
TC1107
6
5
8-Pin MSOP
3
4
8-Pin SOIC
NC
NC
1
2
3
4
8
7
6
5
VOUT
GND
VIN
1
2
3
4
8
7
6
5
VOUT
GND
VIN
NC
NC
NC
NC
TC1107-
VUA
Bypass SHDN
NC
NC
Bypass
SHDN
TC1107-
VOA
Bypass
SHDN
CBYPASS
470pF
(Optional)
Shutdown Control
(from Power Control Logic)
TC1107-1 9/14/99 TelCom Semiconductor reserves the right to make changes in the circuitry and specifications of its devices.
300mA CMOS LDO
WITH SHUTDOWN AND VREF BYPASS
TC1107
Maximum Voltage on Any Pin ........... VIN + 0.3V to – 0.3V
Lead Temperature (Soldering, 10 Sec.)................ +300°C
ABSOLUTE MAXIMUM RATINGS*
Input Voltage .................................................................7V
Output Voltage ........................... (VSS – 0.3) to (VIN + 0.3)
Power Dissipation ....................Internally Limited (Note 6)
Operating Temperature .................... – 40°C < TJ < 125°C
Storage Temperature ............................ – 65°C to +150°C
*Absolute Maximum Ratings indicate device operation limits beyond
damage may occur. Device operation beyond the limits listed in
Electrical Characteristics is not recommended.
ELECTRICAL CHARACTERISTICS: VIN = VOUT + 1V, IL = 0.1µA, CL = 3.3µF, SHDN > VIH, TA = 25°C, Unless Other-
wise Noted. Boldface type specifications apply for junction temperatures
of – 40°C to +125°C.
Symbol
Parameter
Test Conditions
Min
Typ
Max
Units
VIN
Input Operating Voltage
Maximum Output Current
Output Voltage
—
—
—
6.5
V
mA
V
IOUT
300
—
MAX
VOUT
Note 1
—
V
R ± 0.5%
—
VR – 2.5%
—
VR + 2.5%
∆VOUT/∆T
VOUT Temperature Coefficient
Line Regulation
Note 2
—
—
—
40
0.05
0.5
—
0.35
2.0
ppm/°C
%
∆VOUT/∆VIN
∆VOUT/VOUT
VIN – VOUT
(VR + 1V) < VIN < 6V
Load Regulation
IL = 0.1mA to IOUT
%
MAX
Dropout Voltage
IL = 0.1mA
IL = 100mA
IL = 300mA
(Note 4)
—
—
—
20
80
240
30
160
480
mV
ISS1
Supply Current
SHDN = VIH
SHDN = 0V
—
—
—
—
—
—
50
0.05
60
90
0.5
—
µA
µA
ISS2
Shutdown Supply Current
Power Supply Rejection Ratio
Output Short Circuit Current
Thermal Regulation
PSRR
F
RE ≤ 1kHz
dB
IOUT
VOUT = 0V
Note 5
550
0.04
260
650
—
mA
SC
∆VOUT/∆PD
%/W
nV/√Hz
eN
Output Noise
F = 1Khz, COUT = 1µF,
RLOAD = 50Ω
—
SHDN Input
VIH
VIL
SHDN Input High Threshold
SHDN Input Low Threshold
45
—
—
—
%VIN
%VIN
—
15
NOTES: 1. VR is the regulator output voltage setting.
MIN) x 10 6
2. TC VOUT = (VOUT
V
OUT
–
MAX
∆T
VOUT
x
3. Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load
range from 0.1mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal
regulation specification.
4. Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value measured at a
1V differential.
5. Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load
or line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for T = 10msec.
6. The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature, and the
thermal resistance from junction-to-air (i.e. TA, TJ, θJA). Exceeding the maximum allowable power dissipation causes the device to
initiate thermal shutdown. Please see Thermal Considerations section of this data sheet for more details.
TC1107-1 9/14/99
2
300mA CMOS LDO
WITH SHUTDOWN AND VREF BYPASS
TC1107
DETAILED DESCRIPTION
Bypass Input
The TC1107 is a precision regulator available in fixed
voltages. Unlike the bipolar regulators, the TC1107 supply
currentdoesnotincreasewithloadcurrent.Inaddition,VOUT
remains stable and within regulation at very low load cur-
rents (an important consideration in RTC and CMOS RAM
battery backup applications). TC1107 pin functions are
detailed below:
A 470pF capacitor connected from the Bypass input to
ground reduces noise present on the internal reference,
which in turn significantly reduces output noise. If output
noise is not a concern, this input may be left unconnected.
Larger capacitor values may be used, but results in a longer
time period to rated output voltage when power is initially
applied.
PIN DESCRIPTION
Output Capacitor
A 1µF (min) capacitor from VOUT to ground is recom-
mended. The output capacitor should have an effective
series resistance of 5Ω or less, and a resonant frequency
above1MHz.A1µFcapacitorshouldbeconnected fromVIN
to GND if there is more than 10 inches of wire between the
regulator and the AC filter capacitor, or if a battery is used as
thepowersource. Aluminumelectrolyticortantalumcapaci-
tor types can be used. (Since many aluminum electrolytic
capacitors freeze at approximately – 30°C, solid tantalums
are recommended for applications operating below – 25°C.)
When operating from sources other than batteries, supply-
noise rejection and transient response can be improved by
increasing the value of the input and output capacitors and
employing passive filtering techniques.
Pin
No.
Symbol Description
1
2
3
4
VOUT
GND
NC
Regulated voltage output
Ground terminal
No connect
Bypass
Reference bypass input. Connecting a
470pF to this input further reduces output
noise.
5
SHDN
Shutdown control input. The regulator is
fully enabled when a logic high is applied
to this input. The regulator enters shut-
down when a logic low is applied to this
input. During shutdown, output voltage falls
to zero and supply current is reduced to
under 1 microamp (typical).
Thermal Considerations
6
7
8
NC
NC
VIN
No connect
Thermal Shutdown
No connect
Integrated thermal protection circuitry shuts the regula-
tor off when die temperature exceeds 150°C. The regulator
remains off until the die temperature drops to approximately
140°C.
Unregulated supply input
Figure 1 shows a typical application circuit. The regula-
tor is enabled any time the shutdown input (SHDN) is at or
above VIH, and shutdown (disabled) when SHDN is at or
below VIL. SHDN may be controlled by a CMOS logic gate,
or I/O port of a microcontroller. If the SHDN input is not
required, it should be connected directly to the input supply.
While in shutdown, supply current decreases to 0.05µA
(typical), VOUT falls to zero.
Power Dissipation
The amount of power the regulator dissipates is prima-
rilyafunctionofinputandoutputvoltage,andoutputcurrent.
Thefollowingequationisusedtocalculateworstcaseactual
power dissipation:
8
7
6
5
1
VOUT
VOUT
VIN
NC
NC
PD ≈ (VINMAX – VOUT )ILOAD
MIN
MAX
C2
1µF
C1
1µF
Where:
PD = worst case actual power dissipation
= maximum voltage on VIN
2
GND
VIN
VOUT
ILOAD
MAX
Battery
= minimum regulator output voltage
= maximum output (load) current
MIN
TC1107
3
4
NC
MAX
Bypass SHDN
Equation 1.
CBYPASS
470pF
(Optional)
The maximum allowablepower dissipation (Equation 2)
is a function of the maximum ambient temperature (TAMAX),
the maximum allowable die temperature (125°C), and the
thermal resistance from junction-to-air (JA). The SOIC-8
Shutdown Control
(from Power Control Logic)
Figure 1. Typical Application Circuit
TC1107-1 9/14/99
3
300mA CMOS LDO
WITH SHUTDOWN AND VREF BYPASS
TC1107
In this example, the TC1107 dissipates a maximum of
only 167mW; far below the allowable limit of 350mW. In a
similar manner, Equation 1 and Equation 2 can be used to
calculate maximum current and/or input voltage limits.
package has a JA of approximately 160°C/Watt, while the
MSOP-8 package has a JA of approximately 200°C/Watt;
both when mounted on a single layer FR4 dielectric copper
clad PC board.
Layout Considerations
(TJMAX - TA
)
MAX
PD
=
MAX
The primary path of heat conduction out of the package
isviathepackageleads. Therefore, layoutshavingaground
plane, wide traces at the pads, and wide power supply bus
JA
Where all terms are previously defined.
lines combine to lower and, therefore, increase the
JA
Equation 2.
maximum allowable power dissipation limit.
Equation 1 can be used in conjunction with Equation 2
to ensure regulator thermal operation is within limits. For
example:
GIVEN: VIN
= 3.0V ± 10%
MAX
VOUT
= 2.7V –2.5%
MIN
ILOAD = 250mA
TA = 55°C
MAX
MSOP-8 Package
FIND: 1. Actual power dissipation
2. Maximum allowable dissipation.
Actual power dissipation:
PD ≈ (VINMAX – VOUT )ILOAD
MIN
MAX
= [(3.0 x 1.1) – (2.7 x .975)]250 x 10-3
= 167mW
Maximum allowable power dissipation:
(TJMAX – TA
)
MAX
PD
=
=
=
MAX
JA
(125 – 55)
200
350mW
TC1107-1 9/14/99
4
300mA CMOS LDO
WITH SHUTDOWN AND VREF BYPASS
TC1107
TYPICAL CHARACTERISTICS
Load Regulation
Line Regulation
Output Noise
2.00
1.80
0.012
0.010
10.0
1.0
R
C
= 50Ω
= 1µF
LOAD
OUT
1.60
1.40
1.20
1 to 300mA
1 to 100mA
0.008
0.006
1.00
0.80
0.60
0.40
0.004
0.002
0.000
0.1
0.0
1 to 50mA
–0.002
0.20
0.00
–0.004
0.01
10
–40 –20
0
20 40 60 80 100 120
–40 –20
0.01
1
100
1000
0
20 40 60 80 100 120
FREQUENCY (KHz)
TEMPERATURE (°C)
TEMPERATURE (°C)
Supply Current
Dropout Voltage vs. Load Current
V
vs. Temperature
OUT
100.0
90.0
80.0
3.075
3.025
0.40
0.35
125°C
85°C
V
= 4V
= 100µA
IN
I
LOAD
C
= 3.3µF
LOAD
0.30
0.25
0.20
0.15
0.10
0.05
0.00
70°C
25°C
70.0
60.0
50.0
40.0
0°C
2.975
–40°C
2.925
–40 –20
0
–40 –20
0
20 40 60 80 100 120
50
0
20 40 60 80 100 120
TEMPERATURE (°C)
150 200 250 300
100
TEMPERATURE (°C)
LOAD CURRENT (mA)
Power Supply Rejection Ratio
= 5V
–30dB
–35dB
–40dB
V
R
V
OUT
= 50Ω
= 50mV p-p
LOAD
INAC
–45dB
–50dB
–55dB
–60dB
–65dB
–70dB
–75dB
C
= 1µF
OUT
–80dB
1K
100K
1M
10
100
10K
FREQUENCY (KHz)
TC1107-1 9/14/99
5
300mA CMOS LDO
WITH SHUTDOWN AND VREF BYPASS
TC1107
PACKAGE DIMENSIONS
8-Pin MSOP
PIN 1
.197 (5.00)
.187 (4.80)
.122 (3.10)
.114 (2.90)
.026 (0.65) TYP.
.122 (3.10)
.114 (2.90)
.043 (1.10)
MAX.
.008 (0.20)
.005 (0.13)
6°MAX.
.016 (0.40)
.010 (0.25)
.006 (0.15)
.002 (0.05)
.028 (0.70)
.016 (0.40)
8-Pin SOIC
PIN 1 indicated by dot and / or beveled edge
.157 (3.99)
.150 (3.81)
.244 (6.20)
.228 (5.79)
.050 (1.27) TYP.
.197 (5.00)
.189 (4.80)
.069 (1.75)
.053 (1.35)
.010 (0.25)
.007 (0.18)
8°MAX.
.018 (0.46)
.014 (0.36)
.010 (0.25)
.004 (0.10)
.050 (1.27)
.016 (0.40)
Dimensions: inches (mm)
TC1107-1 9/14/99
6
300mA CMOS LDO
WITH SHUTDOWN AND VREF BYPASS
TC1107
TAPE AND REEL DIAGRAMS
Component Taping Orientation for MSOP Devices
User Direction of Feed
User Direction of Feed
PIN 1
W = Width
of Carrier
Tape
PIN 1
P = Pitch
Standard Reel Component Orientation
for 713 or TR Suffix Device
Reverse Reel Component Orientation
for 723 or RT Suffix Device
Carrier Tape, Reel Size, and Number of Components Per Reel
Package
Carrier Width (W)
Pitch (P)
Part Per Full Reel
Reel Size
8-Pin MSOP
12 mm
8 mm
2500
13 in
Component Taping Orientation for SOIC Devices
User Direction of Feed
User Direction of Feed
PIN 1
W = Width
of Carrier
Tape
PIN 1
P = Pitch
Standard Reel Component Orientation
for 713 or TR Suffix Device
Reverse Reel Component Orientation
for 723 or RT Suffix Device
Carrier Tape, Reel Size, and Number of Components Per Reel
Package
Carrier Width (W)
Pitch (P)
Part Per Full Reel
Reel Size
8-Pin SOIC (N)
12 mm
8 mm
2500
13 in
Sales Offices
TelCom Semiconductor, Inc.
1300 Terra Bella Avenue
P.O. Box 7267
Mountain View, CA 94039-7267
TEL: 650-968-9241
TelCom Semiconductor, GmbH
Lochhamer Strasse 13
D-82152 Martinsried
Germany
TEL: (011) 49 89 895 6500
FAX: (011) 49 89 895 6502 2
TelCom Semiconductor H.K. Ltd.
10 Sam Chuk Street, Ground Floor
San Po Kong, Kowloon
Hong Kong
TEL: (011) 852-2350-7380
FAX: (011) 852-2354-9957
FAX: 650-967-1590
E-Mail: liter@telcom-semi.com
TC1107-1 9/14/99
7
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