TC1189TECT [MICROCHIP]

3.15 V FIXED POSITIVE LDO REGULATOR, 0.24 V DROPOUT, PDSO5, SOT-23A, 5 PIN;


型号：	TC1189TECT
厂家：	MICROCHIP
描述：	3.15 V FIXED POSITIVE LDO REGULATOR, 0.24 V DROPOUT, PDSO5, SOT-23A, 5 PIN 稳压器
文件：	总18页 (文件大小：299K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

TC1188/TC1189

MAX8863/64 Pin Compatible, Low Dropout,

120 mA Linear Regulators

Features

General Description

• Input Voltage Range: 2.7 V to 6.0 V

• 120 mA Output Current

The TC1188 and TC1189 are fixed output, low dropout

linear regulators that operate from a 2.7V to 6.0V input

voltage source. The output is capable of delivering up

to 120 mA while consuming only 50 µA of quiescent

current. The low dropout voltage, 120 mV, make the

TC1188 and TC1189 good choices for battery powered

applications. Integrated over-current and over-temper-

ature protection features provide for a fault tolerant

solution.

• Low Supply Current: 50 µA, (typical)

• Low Dropout Voltage: 110 mV, (typical at 100 mA)

• Fast Turn-On from Shutdown: 140 µsec (typical)

• Low Output Noise

• Over-Current and Over-Temperature Protection

• Low Power Shutdown Mode

The TC1189 includes an output voltage auto discharge

feature. When shutdown, the TC1189 will automatically

discharge the output voltage using an internal N-Chan-

nel MOSFET switch.

• Auto Discharge of Output Capacitor (TC1189)

Applications

• Battery Powered Systems

• Portable Computers

• Medical Instruments

• Cellular, Cordless Phones

• PDAs

Fixed output voltage options for the TC1188/TC1189

are: 1.80V, 2.80V, 2.84V and 3.15V. Both the TC1188

and TC1189 are available in SOT23-5 packages.

Typical Application Circuit

• Pagers

Output

Voltage

OUT

Package Type

TC1188

TC1189

5-Pin SOT-23A

1 µF

GND

V_OUT

OUT

SHDN

–

Battery

TC1188

TC1189

GND

V_IN

SHDN GND

NOTE: 5-Pin SOT-23A is equivalent to the EIAJ (SC-74A)

 2002-2012 Microchip Technology Inc.

DS21364C-page 1

TC1188/TC1189

*Notice: *Stresses above those listed under "Absolute

Maximum Ratings" may cause permanent damage to

the device. These are stress ratings only and functional

operation of the device at these or any other conditions

above those indicated in the operation sections of the

specifications is not implied. Exposure to Absolute

Maximum Rating conditions for extended periods may

affect device reliability.

1.0

ELECTRICAL

CHARACTERISTICS

Absolute Maximum Ratings*

Input Voltage .........................................................6.5V

Output Short-Circuit Duration.............................Infinite

Output Voltage...........................(-0.3V) to (V_IN+ 0.3V)

Maximum Voltage On Any Pin.... (-0.3V) to (V_IN+0.3V)

Continuous Power Dissipation (T_A= +70°C)

SOT-23-5 (derate 7.1 mW/°C above +70°C)

..................................................................571 mW

Operating Temperature Range...............-40°C to 85°C

Storage Temperature..........................-65°C to +160°C

Lead Temperature (Soldering, 10 Sec.) ...........+300°C

DC SPECIFICATIONS

Electrical Characteristics: V_IN= +3.6V, GND = 0V, T_A= T_MINto T_MAX, unless otherwise noted. Typical values are at T_A= +25°C.

(Note 1)

Parameters

Input Voltage

Symbol

Min

Typ

Max

Units

Conditions

V_OUT+0.5V

2.7

—

6.0

V_OUT 2.5V

V_OUT= 1.8V (Note 2)

0 mA I_OUT50 mA

Output Voltage

V_OUT

3.05

2.75

2.70

1.745

120

—

3.15

2.84

2.80

1.80

—

3.25

2.93

2.88

1.85

—

Maximum Output Current

Current Limit

I_OUT

I_LIM

I_IN

µA

280

—

Note 3

Input Current

—

I_OUT= 0

Dropout Voltage

—

1.1

—

I_OUT= 1 mA

I_OUT= 50 mA

—

120

240

0.10

—

110

0.001

—

I_OUT= 100 mA (Note 4)

Line Regulation

V_LNR

V_LDR

-0.10

—

%/V V_IN= V_OUT0.5V to 6.0V

%/V I_OUT= 1 mA

Load Regulation

—

0.01

350

220

0.040

—

%/mA I_OUT= 0 mA to 50 mA

µV_RMS10 Hz to 1 MHz, C_OUT= 1 ΜF

µV_RMS10 Hz to 1 MHz C_OUT= 100 ΜF

Output Voltage Noise

—

Wake Up Time

t_WK

—

µsec V_IN= 3.6V

C_IN= 1 µF, C_OUT= 1 µF

I_L= 30 mA, (See Figure 3-1)

(from Shutdown Mode)

Setting Time

t_S

—

140

—

µsec V_IN= 3.6V

C_IN= 1 µF, C_OUT= 1 µF

I_L= 30 mA, (See Figure 3-1)

(from Shutdown Mode)

Note 1: Limits are 100% production tested at T_A= +25°C. Limits over the operating temperature range are ensured through cor-

relation using Statistical Quality Control (SQC) methods.

2: Validated by line regulation test.

3: Not tested. For design purposes, the current limit should be considered 150 mA minimum to 410 mA maximum.

4: The dropout voltage is defined as (V_IN– V_OUT) when V_OUTis 100 mV below the value of V_OUTfor

V_IN= V_OUT+2V.

DS21364C-page 2

 2002-2012 Microchip Technology Inc.

TC1188/TC1189

DC SPECIFICATIONS (CONTINUED)

Electrical Characteristics: V_IN= +3.6V, GND = 0V, T_A= T_MINto T_MAX, unless otherwise noted. Typical values are at T_A= +25°C.

(Note 1)

Parameters

Shutdown:

Symbol

Min

Typ

Max

Units

Conditions

SHDN Input Threshold

SHDN Input Bias Current

Shutdown Supply Current

V_IH

V_IL

2.0

—

0.4

100

—

0.1

A

V_SHDN= V_IN, T_A= +25°C, T_A= T_MAX

V_OUT= 0V, T_A= +25°C, T_A= T_MAX

shdn

0.002

0.02

qshdn

—

Shutdown to Output Discharge

Delay (TC1189)

—

msec C_OUT= 1 F, no load at 10% of V_OUT

Thermal Protection

Thermal Shutdown Temperature

Thermal Shutdown Hysteresis

T_SHDN

—

170

—

°C

T_SHDN

Note 1: Limits are 100% production tested at T_A= +25°C. Limits over the operating temperature range are ensured through cor-

relation using Statistical Quality Control (SQC) methods.

2: Validated by line regulation test.

3: Not tested. For design purposes, the current limit should be considered 150 mA minimum to 410 mA maximum.

4: The dropout voltage is defined as (V_IN– V_OUT) when V_OUTis 100 mV below the value of V_OUTfor

V_IN= V_OUT+2V.

 2002-2012 Microchip Technology Inc.

DS21364C-page 3

TC1188/TC1189

2.0

TYPICAL PERFORMANCE CURVES

Note: The graphs and tables provided following this note are a statistical summary based on a limited number of

samples and are provided for informational purposes only. The performance characteristics listed herein are

not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified

operating range (e.g., outside specified power supply range) and therefore outside the warranted range.

0.10

0.08

0.040

0.035

0.030

0.025

Line Reg. @ 3.50 V

to 5.50V(%)

0.06

0.04

0.02

0.00

0.020

0.015

Load Reg. 0 to 50mA (%)

Load Reg. 0 to 100mA (%)

–0.02

–0.04

–0.06

0.010

0.005

0.000

–0.08

–0.10

25°C

°C

85°C

–40

°C

0°C

–40

0°

25°

70°

85°C

TEMPERATURE (

°C)

FIGURE 2-1:

Line Regulation vs.

FIGURE 2-4:

Load Regulation vs.

Temperature. (TC1188)

2.930

2.910

0.120

0.100

50mA, Dropout V (V)

- SET/1.0mA

OUT

@ 3.5V (V)

2.890

2.870

2.850

2.830

2.810

2.790

2.770

2.750

0.080

0.060

0.040

0.020

0.000

85°C

70°C

°C

–40

°C

0°C

–40°C

°C

25°C

TEMPERATURE (

TEMPERATURE ( C)

FIGURE 2-2:

Output Voltage vs.

FIGURE 2-5:

Dropout Voltage vs.

Temperature. (TC1188)

0.040

10.0

= 50μΩ

LOAD

= 1

Load Reg. 0 to 50mA (%)

0.035

0.030

0.025

OUT

1.0

0.020

0.015

0.1

0.0

0.010

0.005

0.000

85°C

–40°

0°C

25°C

0.01

100

1000

TEMPERATURE ( C)

FREQUENCY (kHz)

FIGURE 2-3:

Load Regulation vs.

FIGURE 2-6:

Output Noise vs. Frequency.

Temperature. (TC1188)

(TC1188)

DS21364C-page 4

 2002-2012 Microchip Technology Inc.

TC1188/TC1189

-10

-20

= C_OUT= 1μF, R = 470Ω, XSHDN = 3.5V

= 2.84V

= 50Ω

OUT

LOAD

100mV p-p

= 4.5V

-30

= 3.5V

CH1

CH2

-40

-50

CH1 GND

CH2 GND

-60

-70

_AC20μV/DIV

OUT

= 1μF

OUT

-80

-90

-100

1M 10M

100 1K 10K 100K

FREQUENCY (kHz)

100μsec/Div

FIGURE 2-7:

Power Supply Rejection

FIGURE 2-10:

TC1189 Line Response.

Ratio vs. Frequency. (TC1188)

SHDN

T = 25

= 1μF

2.8V

=1μF

= ∞

= 0.5V/DIV

OUT

= 3.6V

= 30mA

LOAD

SHDN

= 1μF

LOAD

SHDN = 0V

= 1μF

CH1 GND

CH2 GND

OUT

TIME (100μs/Div)

200μsec/Div

FIGURE 2-11:

Wake-Up Response Time.

FIGURE 2-8:

TC1189 Shutdown Transient

Response.

= 1μF

XSHDN = 3V

=1μF

OUT

Turn On

Time = 150μS

= 100

= 3.5V

= 2.7V

OUT

CH2

CH1

No Overshoot

XSHDN = 0V

CH1 GND

CH2 GND

= 0V

OUT

200μsec/Div

FIGURE 2-9:

TC1189 Shutdown Transient

Response.

 2002-2012 Microchip Technology Inc.

DS21364C-page 5

TC1188/TC1189

3.0

PIN DESCRIPTIONS

The descriptions of the pins are listed in Table 3-1.

TABLE 3-1:

Symbol

PIN FUNCTION TABLE

Description

SHDN

Active Low Shutdown Input. When the SHDN input is low (< 0.2V), the quiscent current for the

TC1188/TC1189 is reduced to 0.1 nA. When the input voltage to the SHDN pin is high (> 2.0V) the

output of the TC1188/TC1189 is enabled. For the TC1189 only, the output capacitor is discharged by

an internal switch when the SHDN is low.

GND

V_IN

Ground. Connect to ground.

Unregulated Input Voltage. The input voltage can range from 2.7V to 6.0V.

Regulator Output. Sources up to 120 mA. Bypass with a 1 µF, <1 typical ESR capacitor to GND.

Connect to GND.

V_OUT

GND

released from shutdown. The settling time of the output

voltage is dependent on load conditions and output

capacitance on V_OUT(RC response).

3.1

Detailed Description

The TC1188/TC1189 devices are fixed output, low

dropout linear regulators. Utilizing CMOS construction,

the internal quiescent current consumed by the regula-

tor is minimized when compared to older bipolar low

dropout regulators.

V_IH

V_IL

t_S

SHDN

V_OUT

The LDO output voltage is sensed at the non-inverting

pin of the internal error amplifier. The internal voltage

reference is sensed at the inverting pin of the internal

error amplifier. The error amplifier adjusts the gate

source voltage of the internal P-channel pass device

until the divided down output voltage matches the inter-

nal reference voltage. When it does, the LDO output

voltage is in regulation.

98%

t_WK

FIGURE 3-1:

Wake-Up Response Time.

3.3

Internal P-Channel Pass

Transistor

The SHDN, when pulled low, is used to turn off the P-

Channel MOSFET and lower the internal quiescent

current to less than 1 µA maximum. For normal opera-

tion, the SHDN pin is pulled to a high level. (> 2.0V).

The Internal P-Channel MOSFET is operated in the lin-

ear region to regulate the LDO output voltage. The

RDSon of the P-Channel MOSFET is approximately

1.1  making the LDO able to regulate with little input

to output voltage differential, "Low Dropout". Another

benefit of using CMOS construction is that the P-Chan-

nel MOSFET is a voltage controlled device, so it

doesn't consume a fraction of the bias current required

of bipolar PNP LDOs.

The TC1189 incorporates an internal N-Channel MOS-

FET, which is used to discharge the output capacitor

when shutdown. The TC1188 does not have the inter-

nal N-Channel MOSFET, therefore, when the device is

shutdown, the output voltage will decrease at a rate

which is dependant on the load current.

3.2

Turn-On Response

The turn-on response is defined as two separate

response categories: Wake-Up Time (t_WK) and Settling

Time (t_S).

The TC1188/TC1189 have fast wake-up times (10 µsec

typical) when released from shutdown. See Figure 3-1

for the wake-up time, designated as t_WK. The wake-up

time is defined as the time it takes for the output to rise

to 2% of the V_OUTvalue after being released from shut-

down.

The total turn on response is defined as the Settling

Time (t_S) (Figure 3-1). Settling Time (inclusive with t_WK

)

is defined as the condition when the output is within 2%

of its fully enabled value (140 µsec typical) when

DS21364C-page 6

 2002-2012 Microchip Technology Inc.

TC1188/TC1189

–

PMOS Pass

Transistor

MOS Driver

ith LIMIT

Shutdown

Logic

SHDN

OUT

Error

Amplifier

(TC1189 Only)

Thermal

Sensor

Bandgap

GND

Reference

GND

FIGURE 3-2:

Functional Block Diagram.

3.4

Shutdown

3.7

Operating Region and Power

Dissipation

The SHDN input is used to turn off the LDO P-Channel

pass MOSFET and internal bias. When shutdown, the

typical quiescent current consumed by the LDO is

0.1 nA. A logic low (< 0.4V) at the SHDN input will

cause the device to operate in the shutdown mode. A

logic high (> 2.0V) at the SHDN input will cause the

device to operate in the normal mode.

The internal power dissipation to the LDO is primarily

determined by the input voltage, output voltage and

output current. The following equation is used to

approximate the worst case for power dissipation:

EQUATION

P_D= V_IN(MAX)- V_OUT(MIN)x I_LOAD(MAX)

3.5

Current Limit

The LDO output current is monitored internal to the

TC1188/TC1189. The internal current sense will limit

the LDO output current to a typical value of 280 mA.

The current limit can range from approximately 50 mA

to 410 mA from device to device. The internal current

limit protects the device from a continuous output short

circuit.

Where:

P_D= Worst case internal power dissipation.

_IN(MAX)= Maximum input voltage.

_OUT(MIN)= Minimum output voltage.

_LOAD(MAX)= Maximum output current.

The maximum power dissipation is a function of the

maximum ambient temperature, T_A(MAX), the maximum

junction temperature, T_J(MAX), and the package thermal

resistance from junction to air, _JA. The 5-Pin SOT23A

package has a _JAof approximately 220°C/Watt.

3.6

Thermal Overload Protection

Integrated thermal protection circuitry shuts the

TC1188/TC1189 off when the internal die temperature

exceeds approximately 170°C. The regulator output

remains off until the internal die temperature drops to

approximately 150°C.

EQUATION

P_D= (T_J(MAX)- T_A(MAX))/_JA

Where all terms are previously defined.

 2002-2012 Microchip Technology Inc.

DS21364C-page 7

TC1188/TC1189

EXAMPLE 3-1:

4.0

4.1

APPLICATIONS INFORMATION

Input Capacitor

The previously defined power dissipation equations

can be used to ensure that the regulator thermal

operation is within limits.

A 1 µF (or larger) capacitor is recommended to bypass

the LDO input and lower input impedance for circuit

stability when operating from batteries or high imped-

ance sources. The input capacitor can be ceramic, tan-

talum or aluminum electrolytic. For applications that

require low noise and input power supply rejection, low

effective series resistance (ESR) ceramic capacitors

are recommended over higher ESR electrolytic capac-

itors. Larger value input capacitors can be used to

improve circuit performance.

Given:

V_IN(MAX)= 3.0V +10%

V_OUT(MAX)= 2.7V - 2.5%

I_LOAD(MAX)= 40 MA

T_J(MAX)= 125°C

T_A(MAX)= 55°C

Find:

4.2

Output Capacitor

1. Actual power dissipation.

A 1 µF (minimum) capacitor is required from V_OUTto

ground to ensure circuit stability. The output capacitor

should have an ESR greater than 0.1 ohms and less

than 2 ohm. Tantalum or aluminum electrolytic capaci-

tors are recommended. Since many aluminum electro-

lytic capacitors freeze at approximately -30°C, solid

tantalums are recommended for applications operating

below 25°C.

2. Maximum allowable dissipation.

Actual power dissipation:

P_D= V_IN(MAX)- V_OUT(MIN)x I_LOAD(MAX)

P_D= ((3.0 * 1.1) - (2.7 * 0.975)) * 40 mA

P_D= 26.7 mWatts

Maximum allowable power dissipation:

P_D= (T_J(MAX)- T_A(MAX))/_JA

P_D(MAX)= (125 - 55) / 220

P_D(MAX)= 318 mWatts.

In this example, the TC1188/TC1189 dissipates a max-

imum of 26.7 mW below the allowable limit of 318 mW.

In a similar manner, the power dissipation equation, as

a function of V_IN, V_OUTand I_LOAD,along with the power

dissipation equation, as a function of maximum junction

temperature, maximum ambient temperature and junc-

tion to air thermal resistance, can be used to calculate

maximum current and/or maximum input voltage limits.

DS21364C-page 8

 2002-2012 Microchip Technology Inc.

TC1188/TC1189

5.0

5.1

PACKAGING INFORMATION

Package Marking Information



Part Number

(V)

Code

TC1188-XECT

1.80

2.80

2.84

3.15

TC1189-XECT

1.80

2.80

2.84

3.15

Legend: XX...X Customer-specific information

Year code (last digit of calendar year)

Year code (last 2 digits of calendar year)

NNN

Week code (week of January 1 is week ‘01’)

Alphanumeric traceability code

Pb-free JEDEC designator for Matte Tin (Sn)

This package is Pb-free. The Pb-free JEDEC designator (

can be found on the outer packaging for this package.

)

Note: In the event the full Microchip part number cannot be marked on one line, it will

be carried over to the next line, thus limiting the number of available

characters for customer-specific information.

 2002-2012 Microchip Technology Inc.

DS21364C-page 9

TC1188/TC1189

5-Lead Plastic Small Outline Transistor (OT) (SOT23)

Note: For the most current package drawings, please see the Microchip Packaging Specification located

at http://www.microchip.com/packaging







Units

INCHES*

NOM

MILLIMETERS

Dimension Limits

MIN

MAX

MIN

NOM

MAX

Number of Pins

Pitch

.038

.075

.046

.043

.003

.110

.064

.116

.018

0.95

1.90

Outside lead pitch (basic)

Overall Height

.035

.000

.102

.059

.110

.014

.057

0.90

1.18

1.10

0.08

2.80

1.63

2.95

0.45

1.45

Molded Package Thickness

.051

.006

.118

.069

.122

.022

1.30

0.15

3.00

1.75

3.10

0.55

Standoff

0.00

2.60

1.50

2.80

0.35

Overall Width

Molded Package Width

Overall Length

Foot Length



Foot Angle

Lead Thickness

Lead Width

.004

.014

.006

.017

.008

.020

0.09

0.35

0.15

0.43

0.20

0.50





Mold Draft Angle Top

Mold Draft Angle Bottom

* Controlling Parameter

§ Significant Characteristic

Notes:

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed

.010” (0.254mm) per side.

JEDEC Equivalent: MO-178

Drawing No. C04-091

DS21364C-page 10

 2002-2012 Microchip Technology Inc.

TC1188/TC1189

REVISION HISTORY

Revision C (November 2012)

Added a note to the package outline drawing.

 2002-2012 Microchip Technology Inc.

DS21364C-page 11

TC1188/TC1189

NOTES:

DS21364C-page 12

 2002-2012 Microchip Technology Inc.

TC1188/TC1189

THE MICROCHIP WEB SITE

CUSTOMER SUPPORT

Microchip provides online support via our WWW site at

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to make files and information easily available to

customers. Accessible by using your favorite Internet

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Users of Microchip products can receive assistance

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• Technical Support

• Product Support – Data sheets and errata,

application notes and sample programs, design

resources, user’s guides and hardware support

documents, latest software releases and archived

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Customers

should

contact

their

distributor,

representative or field application engineer (FAE) for

support. Local sales offices are also available to help

customers. A listing of sales offices and locations is

included in the back of this document.

• General Technical Support – Frequently Asked

Questions (FAQ), technical support requests,

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Technical support is available through the web site

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• Business of Microchip – Product selector and

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To register, access the Microchip web site at

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registration instructions.

 2002-2012 Microchip Technology Inc.

DS21364C-page 13

TC1188/TC1189

READER RESPONSE

It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip

product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our

documentation can better serve you, please FAX your comments to the Technical Publications Manager at

(480) 792-4150.

Please list the following information, and use this outline to provide us with your comments about this document.

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RE:

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Reader Response

Total Pages Sent ________

From:

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Address

City / State / ZIP / Country

Telephone: (_______) _________ - _________

FAX: (______) _________ - _________

Literature Number: DS21364C

Application (optional):

Would you like a reply?

Device: TC1188/TC1189

Questions:

1. What are the best features of this document?

2. How does this document meet your hardware and software development needs?

3. Do you find the organization of this document easy to follow? If not, why?

4. What additions to the document do you think would enhance the structure and subject?

5. What deletions from the document could be made without affecting the overall usefulness?

6. Is there any incorrect or misleading information (what and where)?

7. How would you improve this document?

DS21364C-page 14

 2002-2012 Microchip Technology Inc.

TC1188/TC1189

PRODUCT IDENTIFICATION SYSTEM

To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.

Examples:

PART NO.

Device

/XX

TC1188QECTTR: 1.80V, 100 mA,

MAX8863/64 Pin Compatible LDO

Voltage

Output

Package

TC1188RECTTR: 2.80V, 100 mA,

MAX8863/64 Pin Compatible LDO

TC1188SECTTR: 2.84V, 100 mA,

MAX8863/64 Pin Compatible LDO

Device:

TC1188: 100 mA, MAX8863/64 Pin Compatible LDO

TC1189: 100 mA, MAX8863/64 Pin Compatible LDO

TC1188TECTTR: 3.15V, 100 mA,

MAX8863/64 Pin Compatible LDO

Voltage Output

Options:

1.80V

2.80V

2.84V

3.15V

TC1189QECTTR: 1.80V, 100 mA,

MAX8863/64 Pin Compatible LDO

TC1189RECTTR: 2.80V, 100 mA,

MAX8863/64 Pin Compatible LDO

Package:

ECTTR

SOT-23A, 5-Pin (Tape and Reel)

TC1189SECTTR: 2.84V, 100 mA,

MAX8863/64 Pin Compatible LDO

TC1189TECTTR: 3.15V, 100 mA,

MAX8863/64 Pin Compatible LDO

Sales and Support

Data Sheets

Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recom-

mended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:

1. Your local Microchip sales office

2. The Microchip Worldwide Site (www.microchip.com)

Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.

New Customer Notification System

 2002-2012 Microchip Technology Inc.

DS21364C-page15

TC1188/TC1189

NOTES:

DS21364C-page 16

 2002-2012 Microchip Technology Inc.

Note the following details of the code protection feature on Microchip devices:

•

Microchip products meet the specification contained in their particular Microchip Data Sheet.

•

Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the

intended manner and under normal conditions.

•

There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our

knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data

Sheets. Most likely, the person doing so is engaged in theft of intellectual property.

•

Microchip is willing to work with the customer who is concerned about the integrity of their code.

Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not

mean that we are guaranteeing the product as “unbreakable.”

Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our

products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts

allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Information contained in this publication regarding device

applications and the like is provided only for your convenience

and may be superseded by updates. It is your responsibility to

ensure that your application meets with your specifications.

MICROCHIP MAKES NO REPRESENTATIONS OR

WARRANTIES OF ANY KIND WHETHER EXPRESS OR

IMPLIED, WRITTEN OR ORAL, STATUTORY OR

OTHERWISE, RELATED TO THE INFORMATION,

INCLUDING BUT NOT LIMITED TO ITS CONDITION,

QUALITY, PERFORMANCE, MERCHANTABILITY OR

FITNESS FOR PURPOSE. Microchip disclaims all liability

arising from this information and its use. Use of Microchip

devices in life support and/or safety applications is entirely at

the buyer’s risk, and the buyer agrees to defend, indemnify and

hold harmless Microchip from any and all damages, claims,

suits, or expenses resulting from such use. No licenses are

conveyed, implicitly or otherwise, under any Microchip

intellectual property rights.

Trademarks

The Microchip name and logo, the Microchip logo, dsPIC,

FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro,

PICSTART, PIC logo, rfPIC, SST, SST Logo, SuperFlash

and UNI/O are registered trademarks of Microchip Technology

Incorporated in the U.S.A. and other countries.

FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,

MTP, SEEVAL and The Embedded Control Solutions

Company are registered trademarks of Microchip Technology

Incorporated in the U.S.A.

Silicon Storage Technology is a registered trademark of

Microchip Technology Inc. in other countries.

Analog-for-the-Digital Age, Application Maestro, BodyCom,

chipKIT, chipKIT logo, CodeGuard, dsPICDEM,

dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,

ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial

Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB

Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code

Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit,

PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O,

Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA

and Z-Scale are trademarks of Microchip Technology

Incorporated in the U.S.A. and other countries.

SQTP is a service mark of Microchip Technology Incorporated

in the U.S.A.

GestIC and ULPP are registered trademarks of Microchip

Technology Germany II GmbH & Co. & KG, a subsidiary of

Microchip Technology Inc., in other countries.

All other trademarks mentioned herein are property of their

respective companies.

Printed on recycled paper.

ISBN: 9781620767450

QUALITY MANAGEMENT SYSTEM

CERTIFIED BY DNV

Microchip received ISO/TS-16949:2009 certification for its worldwide

headquarters, design and wafer fabrication facilities in Chandler and

Tempe, Arizona; Gresham, Oregon and design centers in California

and India. The Company’s quality system processes and procedures

are for its PIC^®MCUs and dsPIC^®DSCs, KEELOQ^®code hopping

devices, Serial EEPROMs, microperipherals, nonvolatile memory and

analog products. In addition, Microchip’s quality system for the design

and manufacture of development systems is ISO 9001:2000 certified.

== ISO/TS 16949 ==

 2002-2012 Microchip Technology Inc.

DS21364C-page 17

Worldwide Sales and Service

AMERICAS

ASIA/PACIFIC

EUROPE

Corporate Office

2355 West Chandler Blvd.

Chandler, AZ 85224-6199

Tel: 480-792-7200

Fax: 480-792-7277

Technical Support:

http://www.microchip.com/

support

Asia Pacific Office

Suites 3707-14, 37th Floor

Tower 6, The Gateway

Harbour City, Kowloon

Hong Kong

Tel: 852-2401-1200

Fax: 852-2401-3431

India - Bangalore

Tel: 91-80-3090-4444

Fax: 91-80-3090-4123

Austria - Wels

Tel: 43-7242-2244-39

Fax: 43-7242-2244-393

Denmark - Copenhagen

Tel: 45-4450-2828

Fax: 45-4485-2829

India - New Delhi

Tel: 91-11-4160-8631

Fax: 91-11-4160-8632

France - Paris

Tel: 33-1-69-53-63-20

Fax: 33-1-69-30-90-79

India - Pune

Tel: 91-20-2566-1512

Fax: 91-20-2566-1513

Australia - Sydney

Tel: 61-2-9868-6733

Fax: 61-2-9868-6755

Web Address:

www.microchip.com

Germany - Munich

Tel: 49-89-627-144-0

Fax: 49-89-627-144-44

Japan - Osaka

Tel: 81-66-152-7160

Fax: 81-66-152-9310

Atlanta

Duluth, GA

Tel: 678-957-9614

Fax: 678-957-1455

China - Beijing

Tel: 86-10-8569-7000

Fax: 86-10-8528-2104

Italy - Milan

Tel: 39-0331-742611

Fax: 39-0331-466781

Japan - Yokohama

Tel: 81-45-471- 6166

Fax: 81-45-471-6122

China - Chengdu

Tel: 86-28-8665-5511

Fax: 86-28-8665-7889

Boston

Westborough, MA

Tel: 774-760-0087

Fax: 774-760-0088

Netherlands - Drunen

Tel: 31-416-690399

Fax: 31-416-690340

Korea - Daegu

Tel: 82-53-744-4301

Fax: 82-53-744-4302

China - Chongqing

Tel: 86-23-8980-9588

Fax: 86-23-8980-9500

Chicago

Itasca, IL

Tel: 630-285-0071

Fax: 630-285-0075

Spain - Madrid

Tel: 34-91-708-08-90

Fax: 34-91-708-08-91

Korea - Seoul

China - Hangzhou

Tel: 86-571-2819-3187

Fax: 86-571-2819-3189

Tel: 82-2-554-7200

Fax: 82-2-558-5932 or

82-2-558-5934

UK - Wokingham

Tel: 44-118-921-5869

Fax: 44-118-921-5820

Cleveland

Independence, OH

Tel: 216-447-0464

Fax: 216-447-0643

China - Hong Kong SAR

Tel: 852-2401-1200

Fax: 852-2401-3431

Malaysia - Kuala Lumpur

Tel: 60-3-6201-9857

Fax: 60-3-6201-9859

Dallas

Addison, TX

Tel: 972-818-7423

Fax: 972-818-2924

China - Nanjing

Tel: 86-25-8473-2460

Fax: 86-25-8473-2470

Malaysia - Penang

Tel: 60-4-227-8870

Fax: 60-4-227-4068

China - Qingdao

Tel: 86-532-8502-7355

Fax: 86-532-8502-7205

Philippines - Manila

Tel: 63-2-634-9065

Fax: 63-2-634-9069

Detroit

Farmington Hills, MI

Tel: 248-538-2250

Fax: 248-538-2260

China - Shanghai

Tel: 86-21-5407-5533

Fax: 86-21-5407-5066

Singapore

Tel: 65-6334-8870

Fax: 65-6334-8850

Indianapolis

Noblesville, IN

Tel: 317-773-8323

Fax: 317-773-5453

China - Shenyang

Tel: 86-24-2334-2829

Fax: 86-24-2334-2393

Taiwan - Hsin Chu

Tel: 886-3-5778-366

Fax: 886-3-5770-955

Los Angeles

China - Shenzhen

Tel: 86-755-8203-2660

Fax: 86-755-8203-1760

Taiwan - Kaohsiung

Tel: 886-7-213-7828

Fax: 886-7-330-9305

Mission Viejo, CA

Tel: 949-462-9523

Fax: 949-462-9608

China - Wuhan

Tel: 86-27-5980-5300

Fax: 86-27-5980-5118

Taiwan - Taipei

Tel: 886-2-2508-8600

Fax: 886-2-2508-0102

Santa Clara

Santa Clara, CA

Tel: 408-961-6444

Fax: 408-961-6445

China - Xian

Tel: 86-29-8833-7252

Fax: 86-29-8833-7256

Thailand - Bangkok

Tel: 66-2-694-1351

Fax: 66-2-694-1350

Toronto

Mississauga, Ontario,

Canada

China - Xiamen

Tel: 905-673-0699

Fax: 905-673-6509

Tel: 86-592-2388138

Fax: 86-592-2388130

China - Zhuhai

Tel: 86-756-3210040

Fax: 86-756-3210049

10/26/12

DS21364C-page 18

 2002-2012 Microchip Technology Inc.

TC1189TECT [MICROCHIP]

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