TC1264-1.8VDBRT [MICROCHIP]
1.8 V FIXED POSITIVE LDO REGULATOR, 1.4 V DROPOUT, PSSO3, SOT-223, 3 PIN;
| 型号： | TC1264-1.8VDBRT |
| 厂家： | 
MICROCHIP |
| 描述： | 1.8 V FIXED POSITIVE LDO REGULATOR, 1.4 V DROPOUT, PSSO3, SOT-223, 3 PIN 光电二极管 输出元件 调节器 |
| 文件： | 总8页 (文件大小：55K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TC1264
800mA Fixed Output CMOS LDO
FEATURES
GENERAL DESCRIPTION
■ Very Low Dropout Voltage
■ Guaranteed 800mA Output
■ High Output Voltage Accuracy
■ Standard or Custom Output Voltages
■ Over-Current and Over-Temperature Protection
The TC1264 is a fixed output, high accuracy (typically
±0.5%) CMOS low dropout regulator. Designed specifically
for battery-operated systems, the TC1264’s CMOS con-
struction eliminates wasted ground current, significantly
extending battery life. Total supply current is typically 80 µA
at full load (20 to 60 times lower than in bipolar regulators!).
TC1264 key features include ultra low noise, very low
dropout voltage (typically 450mV at full load), and fast
responsetostepchangesinload. TheTC1264incorporates
both over-temperature and over-current protection. The
TC1264 is stable with an output capacitor of only 1µF and
has a maximum output current of 800mA. It is available in 3-
Pin SOT-223, 3-Pin TO-220, and 3-Pin DDPAK packages.
APPLICATIONS
■ Battery-Operated Systems
■ Portable Computers
■ Medical Instruments
■ Instrumentation
■ Cellular / GSM / PHS Phones
■ Linear Post-Regulator for SMPS
■ Pagers
TYPICAL APPLICATION
ORDERING INFORMATION
Junction
Part
Number
Temperature
Range
VIN
VIN
VOUT
VOUT
Package
C1
TC1264-xxVDB
TC1264-xxVAB
TC1264-xxVEB
3-Pin SOT-223
3-Pin TO-220
3-Pin DDPAK
– 40°C to +125°C
– 40°C to +125°C
– 40°C to +125°C
1µF
TC1264
GND
Available Output Voltages:
1.8, 2.5, 3.0, 3.3
xx indicates ouput voltages
PIN CONFIGURATION
3-Pin TO-220
3-Pin DDPAK
Other output voltages are available. Please contact TelCom
Semiconductor for details.
FRONT VIEW
TAB IS GND
TAB IS GND
TC1264
TC1264
1
2
3
3
1
2
3-Pin SOT-223
FRONT VIEW
VOUT
GND
VIN
TC1264
TC1264-4 3/28/00
TelCom Semiconductor reserves the right to make changes in the circuitry and specifications of its devices.
800mA Fixed Output CMOS LDO
TC1264
ABSOLUTE MAXIMUM RATINGS*
Input Voltage ..............................................................6.5V
Output Voltage ........................... (VSS – 0.3) to (VIN + 0.3)
Power Dissipation ....................Internally Limited (Note 7)
Operating Temperature.................... – 40°C < TJ < 125°C
Storage Temperature ............................– 65°C to +150°C
Maximum Voltage on Any Pin ........... VIN + 0.3V to – 0.3V
Lead Temperature (Soldering, 10 Sec.)................ +260°C
*Absolute Maximum Ratings indicate device operation limits beyond dam-
age may occur. Device operation beyond the limits listed in Electrical
Characteristics is not recommended.
ELECTRICAL CHARACTERISTICS: VIN = VR + 1.5V (Note 1), IL = 100µA, CL = 3.3µF, TA = 25°C, unless otherwise
specified. BOLDFACE type specifications apply for junction temperatures of –
40°C to +125°C.
Symbol
Parameter
Test Conditions
Min
Typ
Max
Units
VIN
Input Operating Voltage
Maximum Output Current
Output Voltage
2.7
—
—
6.0
V
mA
V
(Note 2)
IOUT
800
—
MAX
VOUT
VR > 2.5V
VR = 1.8V
VR – 2.5% VR ± 0.5% VR + 2.5%
VR – 2% VR ± 0.5% VR + 3%
∆VOUT/∆T
VOUT Temperature Coefficient
Line Regulation
Note 3
—
—
40
—
0.35
0
ppm/°C
%
∆VOUT/∆VIN
∆VOUT/VOUT
(VR + 1V) < VIN < 6V
0.007
0.002
Load Regulation
IL = 0.1mA to IOUT
MAX (Note 4)
-0.01
%/mA
mV
VIN – VOUT
Dropout Voltage
VR > 2.5V, IL = 100µA
IL = 100mA
—
—
—
—
—
—
—
20
50
30
160
480
800
1300
1000
1400
IL = 300mA
IL = 500mA
IL = 800mA
150
260
450
700
890
VR = 1.8V, IL = 500mA
IL = 800mA
(Note 5)
IDD
Supply Current
IL = 0
—
—
—
—
—
80
64
130
—
µA
dB
PSRR
Power Supply Rejection Ratio
Output Short Circuit Current
Thermal Regulation
Output Noise
F ≤ 1kHz
VOUT = 0V
Note 6
IOUT
1200
0.04
260
—
mA
SC
∆VOUT/∆PD
—
V/W
nV/√Hz
eN
IL = IOUT
—
MAX, F = 10kHz
NOTES: 1. VR is the regulator output voltage setting.
2. The minimum VIN has to justify the conditions: VIN> VR + VDROPOUT and VIN > 2.7V for IL = 0.1mA to IOUTMAX
3. TC VOUT = (VOUT
.
MIN) x 10 6
V
OUT
–
MAX
∆T
VOUT
x
4. Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load
range from 0.1mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal
regulation specification.
5. Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value measured at a
1.5V differential.
6. Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load
or line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for T = 10msec.
7. The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature, and the
thermal resistance from junction-to-air (i.e. TA, TJ, θJA). Exceeding the maximum allowable power dissipation causes the device to
initiate thermal shutdown. Please see Thermal Considerations section of this data sheet for more details.
2
TC1264-4 3/28/00
800mA Fixed Output CMOS LDO
TC1264
DETAILED DESCRIPTION
PD ≈ (VINMAX – VOUT )ILOAD
MIN
MAX
The TC1264 is a precision, fixed output LDO. Unlike
bipolar regulators, the TC1264 supply current does not
increase with load current. In addition, VOUT remains stable
and within regulation at very low load currents (an important
consideration in RTC and CMOS RAM battery backup
applications). Figure 1 shows a typical application circuit.
Where:
PD = worst case actual power dissipation
= maximum voltage on VIN
VIN
VOUT
ILOAD
MAX
= minimum regulator output voltage
= maximum output (load) current
MIN
MAX
Equation 1.
The maximum allowable power dissipation (Equation 2)
is a function of the maximum ambient temperature (TAMAX),
the maximum allowable die temperature (125°C) and the
thermal resistance from junction-to-air (JA).
VIN
VOUT
VOUT
C1
1µF
C2
1µF
TC1264
Battery
GND
(TJMAX – TA
)
MAX
PD
=
MAX
JA
Where all terms are previously defined.
Figure 1: Typical Application Circuit
Equation 2.
Output Capacitor
Table 1 shows various values of for the TC1264
JA
A 1µF (min) capacitor from VOUT to ground is required.
The output capacitor should have an effective series resis-
tance of 5Ω or less. A 1µF capacitor should be connected
from VIN to GND if there is more than 10 inches of wire
between the regulator and the AC filter capacitor, or if a
battery is used as the power source. Aluminum electrolytic
or tantalum capacitor types can be used. (Since many
aluminum electrolytic capacitors freeze at approximately –
30°C, solid tantalums are recommended for applications
operating below –25°C.) When operating from sources
other than batteries, supply-noise rejection and transient
response can be improved by increasing the value of the
input and output capacitors and employing passive filtering
techniques.
mounted on a 1/16 inch, 2-layer PCB with 1 oz. copper foil.
Table 1. Thermal Resistance Guidelines for TC1264 in
3-Pin SOT-223 Package
Copper
Area
(Topside)*
Copper
Area
(Backside)
Thermal
Resistance
Board
Area
( )
JA
2500 sq mm 2500 sq mm 2500 sq mm
1000 sq mm 2500 sq mm 2500 sq mm
45°C/W
45°C/W
53°C/W
59°C/W
52°C/W
55°C/W
225 sq mm
100 sq mm
2500 sq mm 2500 sq mm
2500 sq mm 2500 sq mm
1000 sq mm 1000 sq mm 1000 sq mm
1000 sq mm 0 sq mm 1000 sq mm
NOTES: *Tab of device attached to topside copper
Thermal Considerations
Table 2. Thermal Resistance Guidelines for TC1264 in
3-Pin DDPAK/TO-220 Package
Thermal Shutdown
Integrated thermal protection circuitry shuts the regula-
tor off when die temperature exceeds 160°C. The regulator
remains off until the die temperature drops to approximately
150°C.
Copper
Area
Copper
Area
Thermal
Resistance
Board
Area
(Topside)*
(Backside)
( )
JA
2500 sq mm 2500 sq mm 2500 sq mm
1000 sq mm 2500 sq mm 2500 sq mm
25°C/W
27°C/W
35°C/W
Power Dissipation
The amount of power the regulator dissipates is prima-
rilyafunctionofinputandoutputvoltage,andoutputcurrent.
Thefollowingequationisusedtocalculateworstcaseactual
power dissipation:
125 sq mm
2500 sq mm 2500 sq mm
NOTES: *Tab of device attached to topside copper
3
TC1264-4 3/28/00
800mA Fixed Output CMOS LDO
TC1264
Equation 1 can be used in conjunction with Equation 2
to ensure regulator thermal operation is within limits. For
example:
GIVEN: VIN
= 3.3V ± 10%
= 2.7V ± 0.5%
MAX
VOUT
MIN
ILOADMAX = 275mA
TJ
MAX
= 125°C
TA
= 95°C
MAX
= 59°C/W (SOT-223)
JA
FIND: 1. Actual power dissipation
2. Maximum allowable dissipation
Actual power dissipation:
PD ≈ (VINMAX – VOUT )ILOAD
MIN
MAX
= [(3.3 x 1.1) – (2.7 x .995)]275 x 10-3
= 260mW
Maximum allowable power dissipation:
(TJMAX – TA
)
MAX
PD
=
=
=
MAX
JA
(125 – 95)
59
508mW
In this example, the TC1264 dissipates a maximum of
only 260mW; far below the allowable limit of 508mW. In a
similar manner, Equation 1 and Equation 2 can be used to
calculate maximum current and/or input voltage limits. For
example, the maximum allowable VIN is found by substitut-
ing the maximum allowable power dissipation of 508mW
into Equation 1, from which VINMAX = 4.6V.
4
TC1264-4 3/28/00
800mA Fixed Output CMOS LDO
TC1264
TYPICAL CHARACTERISTICS
Line Regulation vs. Temperature
Load Regulation vs. Temperature
Output Noise vs. Frequency
0.0100
0.0090
0.0080
0.0070
0.0060
0.0050
0.0040
0.0030
0.020
0.018
0.016
10.0
1.0
R
C
= 50µΩ
= 1µF
LOAD
OUT
0.014
0.012
0.010
0.008
0.006
0.004
V
3V
1mA to 800mA
OUT =
0.1
0.0
0.0020
0.0010
0.0100
0.002
0.000
0.01
10
0.01
1
100
1000
–40°C 0°C
25°C 70°C 85°C 125°C
TEMPERATURE (°C)
–40°C
0°C
25°C 70°C
85°C 125°C
TEMPERATURE (°C)
FREQUENCY (KHz)
I
vs. Temperature
3.0V V
Temperature
3.0V Dropout Voltage vs. I
DD
OUT VS.
LOAD
3.030
3.020
3.010
3.000
2.990
2.980
150
135
0.600
0.550
0.500
0.450
0.400
125°C
85°C
70°C
I
= 0.1mA
LOAD
120
105
90
25°C
I
= 300mA
= 500mA
LOAD
0.350
0.300
0.250
0.200
0.150
0.100
0.050
0.000
V
3V
OUT =
I
LOAD
75
2.970
2.960
2.950
2.940
2.930
2.920
0°C
60
–40°C
45
I
= 800mA
LOAD
30
15
0
400 500 600 700 800
(mA)
0
100
–40°C 0°C
25°C 70°C 85°C 125°C
TEMPERATURE (°C)
200 300
I
–40°C 0°C
25°C 70°C 85°C 125°C
TEMPERATURE (°C)
LOAD
Power Supply Rejection Ratio
= 3V
–30dB
–35dB
V
R
V
OUT
= 50Ω
LOAD
= 50mV
IN
AC
p-p
–40dB
–45dB
–50dB
–55dB
C
= 1µF
OUT
–60dB
–65dB
–70dB
–75dB
–80dB
1K
FREQUENCY (Hz)
100K
1M
10
100
10K
5
TC1264-4 3/28/00
800mA Fixed Output CMOS LDO
TC1264
TAPING FORMS
Component Taping Orientation for 3-Pin SOT-223 Devices
PIN 1
User Direction of Feed
User Direction of Feed
Device
Marking
Device
Marking
W
PIN 1
P
Standard Reel Component Orientation
for TR Suffix Device
(Mark Right Side Up)
Reverse Reel Component Orientation
for RT Suffix Device
(Mark Upside Down)
Carrier Tape, Number of Components Per Reel and Reel Size
Package
Carrier Width (W)
Pitch (P)
Part Per Full Reel
Reel Size
3-Pin SOT-223
12 mm
8 mm
4000
13 in
Component Taping Orientation for 3-Pin DDPAK Devices
PIN 1
User Direction of Feed
User Direction of Feed
M a r k i n g
D e v i c e
Device
Marking
W
PIN 1
P
Standard Reel Component Orientation
for TR Suffix Device
(Mark Right Side Up)
Reverse Reel Component Orientation
for RT Suffix Device
(Mark Upside Down)
Carrier Tape, Number of Components Per Reel and Reel Size
Package
Carrier Width (W)
Pitch (P)
Part Per Full Reel
750
Reel Size
3-Pin DDPAK
24 mm
16 mm
13 in
6
TC1264-4 3/28/00
800mA Fixed Output CMOS LDO
TC1264
PACKAGE DIMENSIONS
3-Pin DDPAK
.183 (4.65)
.170 (4.32)
.410 (10.41)
.385 (9.78)
.067 (1.70)
.045 (1.14)
.055 (1.40)
.045 (1.14)
3° - 7°
(5x)
.370 (9.40)
.329 (8.38)
.010 (0.25)
.000 (0.00)
.605 (15.37)
.549 (13.95)
0.26 (0.66)
0.14 (0.36)
.051 (1.30)
.049 (1.24)
.110 (2.79)
.068 (1.72)
.037 (0.94)
.026 (0.66)
0° - 8°
.100 (2.54) TYP.
3-Pin TO-220
.185 (4.70)
.165 (4.19)
.410 (10.41)
.357 (9.06)
.113 (2.87)
.103 (2.62)
.055 (1.40)
.045 (1.14)
.156 (3.96)
.146 (3.71)
DIA.
.258 (6.55)
.230 (5.84)
3° - 7.5°
5 PLCS.
.594 (15.09)
.569 (14.45)
.244 (6.20)
.234 (5.94)
.560 (14.22)
.518 (13.16)
.055 (1.40)
.045 (1.14)
.020 (0.51)
.012 (0.30)
.037 (0.94)
.027 (0.69)
.105 (2.67)
.095 (2.41)
PIN 1
.115 (2.92)
.095 (2.41)
.205 (5.21)
.195 (4.95)
Dimensions: inches (mm)
7
TC1264-4 3/28/00
800mA Fixed Output CMOS LDO
TC1264
PACKAGE DIMENSIONS
3-Pin SOT-223
.264 (6.70)
.248 (6.30)
.122 (3.10)
.114 (2.90)
.287 (7.30) .146 (3.70)
.264 (6.70) .130 (3.30)
.041 (1.04)
.033 (0.84)
PIN 1
.091 (2.30) TYP.
.033 (0.84)
.024 (0.60)
.071
(1.80)
MAX.
.013 (0.33)
.009 (0.24)
10¡ MAX.
.036 (0.91) MIN.
.004 (0.10)
.001 (0.02)
.181 (4.60) TYP.
Dimensions: inches (mm)
Sales Offices
TelCom Semiconductor, Inc.
1300 Terra Bella Avenue
P.O. Box 7267
Mountain View, CA 94039-7267
TEL: 650-968-9241
TelCom Semiconductor, GmbH
TelCom Semiconductor H.K. Ltd.
10 Sam Chuk Street, Ground Floor
San Po Kong, Kowloon
Hong Kong
TEL: (011) 852-2350-7380
FAX: (011) 852-2354-9957
Lochhamer Strasse 13
D-82152 Martinsried
Germany
TEL: (011) 49 89 895 6500
FAX: (011) 49 89 895 6502 2
FAX: 650-967-1590
E-Mail: liter@telcom-semi.com
8
TC1264-4 3/28/00
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