TC3400VPA [MICROCHIP]
!.8V, Low Power, 16-Bit Sigma-Delta A/D Converter; ！ .8V ，低功耗， 16位Σ-Δ型A / D转换器
| 型号： | TC3400VPA |
| 厂家： | 
MICROCHIP |
| 描述： | !.8V, Low Power, 16-Bit Sigma-Delta A/D Converter |
| 文件： | 总16页 (文件大小：438K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TC3400
+1.8V, Low Power, 16-Bit Sigma-Delta A/D Converter
Features
Package Type
• 16-bit Resolution at Eight Conversions Per
Second, Adjustable Down to 10-bit Resolution at
512 Conversions Per Second
8-Pin SOIC
TC3400
V
IN+
IN-
1
2
3
4
8
7
6
5
DD
• 1.8V – 5.5V Operation, Low Power Operating
260µA; Sleep: 0.75µA
• microPort™ Serial Bus Requires only two
Interface Lines
SCLK
SDAT
REF
IN
REF
GND
• Uses Internal or External Reference
OUT
• Automatically Enters Sleep Mode when not in use
8-Pin PDIP
TC3400
Applications
• Consumer Electronics, Thermostats, CO
Monitors, Humidity Meters, Security Sensors
V
IN+
IN-
1
2
3
4
8
7
6
5
DD
• Embedded Systems, Data Loggers, Portable
Equipment
SCLK
SDAT
REF
IN
• Medical Instruments
Device Selection Table
Temperature
REF
GND
OUT
Part Number
Package
General Description
Range
TC3400VPA 8-Pin PDIP (Narrow) 0°C to +85°C
TC3400VOA 8-Pin SOIC (Narrow) 0°C to +85°C
The TC3400 is a low cost, low power analog-to-digital
converter based on Microchip’s Sigma-Delta technol-
ogy. It will perform 16-bit conversions (15-bit plus sign)
at up to eight per second. The TC3400 is optimized for
use as a microcontroller peripheral in low cost, battery
operated systems. A voltage reference is included, or
an external reference can be used.
The TC3400’s 2-wire microPort™ digital interface is
used for starting conversions and for reading out the
data. Driving the SCLK line low starts a conversion.
After the conversion starts, each additional falling edge
(up to six) detected on SCLK for t seconds reduces
4
the A/D resolution by one bit and cuts conversion time
in half. After a conversion is completed, clocking the
SCLK line puts the MSB through LSB of the resulting
data word onto the SDAT line, much like a shift register.
The part automatically sleeps when not performing a
data conversion.
The TC3400 is available in a 8-Pin PDIP and a 8-Pin
SOIC package.
2002 Microchip Technology Inc.
DS21409B-page 1
TC3400
Typical Application
V
BATT
V
DD
V
+
CC
IN1+
IN1-
I/01
I/02
SDAT
SCLK
µ
TC3400
Controller
REF
IN
REF
OUT
R3
390
C1
0.1µF
Functional Block Diagram
V
DD
REF
OUT
1.193V
TC3400
x2
REF
IN
Data
Shift
Reg.
S – D
Modulator
+
–
IN+
IN-
SDAT
Clock Generator
and Control
Circuitry
SCLK
GND
DS21409B-page 2
2002 Microchip Technology Inc.
TC3400
*Stresses above those listed under "Absolute Maximum
Ratings" may cause permanent damage to the device. These
are stress ratings only and functional operation of the device
at these or any other conditions above those indicated in the
operation sections of the specifications is not implied.
Exposure to Absolute Maximum Rating conditions for
extended periods may affect device reliability.
1.0
ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings*
Supply Voltage .....................................................6.0V
Input Voltage (All Other Pins):
............................... (GND – 0.3V) to (V + 0.3V)
DD
Operating Temperature Range ................. 0°C to 85°C
Storage Temperature ........................ -65°C to +150°C
TC3400 DC ELECTRICAL SPECIFICATIONS
Electrical Characteristics: TA = 25°C and VDD = 2.7V, unless otherwise specified. Boldface type specifications apply for
temperatures of 0°C to 85°C. VREF = 1.25V, Internal Clock Frequency = 520kHz.
Symbol
Parameter
Min
Typ
Max
Unit
Test Conditions
Power Supply
VDD
Supply Voltage
1.8
—
—
5.5
—
V
IDD
Supply Current, During Data Conversion
Supply Current, Sleep Mode
260
0.75
1.2
µA
µA
µA
IDDSLEEP
—
1.5
3.0
TA = +25°C
—
Accuracy (Differential Inputs)
RES
INL
Resolution
—
—
—
—
—
—
—
16
.0038
—
—
—
Bits
Integral Non-Linearity
Offset Error
%FSR VDD = 2.7V
%FSR IN+, IN- = 0V
µVrms
dB
%FS
dB
VOS
±0.9
—
VNOISE
CMR
FSE
Referred to input
60
Common Mode Rejection
Full Scale Error
75
—
At DC
0.4%
75
—
PSRR
Power Supply Rejection Ratio
—
VDD = 2.5V to 3.5V
IN+, IN-
VIN
±
Differential Input Voltage
Absolute Voltage Range on IN+, IN-
Input Bias Current
—
—
—
—
—
—
—
1
2.5
VDD
100
—
V
V
Note 1
nA
pF
MΩ
CIN
RIN
Input Sampling Capacitance
Differential Input Resistance
2
2.0
—
Note 2
REFIN, REFOUT
VREF
REFIN Voltage Range
0
—
—
1
1.25
—
V
µA
V
IREF
REFIN Input Current
VREFOUT
REFSINK
REFSRC
REFOUT Voltage
—
1.193
10
—
REFOUT Current Sink Capability
REFOUT Current Source Capability
—
—
µA
µA
300
—
—
Note 1: Differential input voltage defined as (VIN+ – VIN-).
2: Resistance from INn+ to INn- or INn to GND.
3: @ VDD = 1.8V, ISOURCE ≤ 200µA.
2002 Microchip Technology Inc.
DS21409B-page 3
TC3400
TC3400 DC ELECTRICAL SPECIFICATIONS (CONTINUED)
Electrical Characteristics: TA = 25°C and VDD = 2.7V, unless otherwise specified. Boldface type specifications apply for
temperatures of 0°C to 85°C. VREF = 1.25V, Internal Clock Frequency = 520kHz.
Symbol
SCLK
Parameter
Min
Typ
Max
Unit
Test Conditions
VIL
Input Low Voltage
—
0.7 x VDD
—
—
—
1
0.3 x VDD
V
V
VIH
Input High Voltage
Leakage Current
—
—
ILEAK
µA
SDAT
VOL
VOH
Output Low Voltage
—
—
—
0.4
—
V
V
IOL = 1.5mA
ISOURCE = 400µA (Note 3)
Output High Voltage (SDAT)
0.9 x VDD
Note 1: Differential input voltage defined as (VIN+ – VIN-).
2: Resistance from INn+ to INn- or INn to GND.
3: @ VDD = 1.8V, ISOURCE ≤ 200µA.
TC3400 AC ELECTRICAL SPECIFICATIONS
Electrical Characteristics: TA = 25°C and VDD = 2.7V, unless otherwise specified. Boldface type specifications apply for
temperatures of 0°C to 85°C. VREF = 1.25V, Internal Clock Frequency = 520kHz.
Symbol
Parameter
Min
Typ
Max
Unit
Test Conditions
t1
t2
t3
Resolution Reduction Clock Width
Resolution Reduction Clock Width
Conversion Time (15-bit Plus Sign)
Conversion Time (14-bit Plus Sign)
Conversion Time (13-bit Plus Sign)
Conversion Time (12-bit Plus Sign)
Conversion Time (11-bit Plus Sign)
Conversion Time (10-bit Plus Sign)
Conversion Time (9-bit Plus Sign)
Resolution Reduction Window
SCLK to Data Valid
1
1
—
—
—
—
µsec Width of SCLK (Negative)
µsec Width of SCLK (Positive)
msec 16-bit Conversion, TA = 25°C (Note 1)
msec 15-bit Conversion
—
—
—
—
—
—
—
—
1000
—
125
—
t3/2.0
t3/4.0
t3/7.8
t3/15.1
t3/28.6
t3/51.4
t3/85.7
—
—
—
msec 14-bit Conversion
—
msec 13-bit Conversion
—
msec 12-bit Conversion
—
msec 11-bit Conversion
—
msec 10-bit Conversion
t4
t5
t8
—
msec Width of SCLK
—
nsec SCLK Falling Edge to SDAT Valid
nsec SCLK to SDAT Delay
Acknowledge Delay
—
1000
Note 1: Nominal temperature drift is -2830ppm/C° for temperature less than 25°C and -1340ppm/°C for temperatures
greater than 25°C.
DS21409B-page 4
2002 Microchip Technology Inc.
TC3400
2.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 2-1.
TABLE 2-1:
PIN FUNCTION TABLE
Pin No.
(8-Pin SOIC)
(8-Pin PDIP)
Symbol
Description
1
2
3
IN+
IN-
Analog Input. This is the positive terminal of a true differential input consisting of IN+ and IN-.
IN1 = (IN+ – IN-). See Section 1.0 Electrical Characteristics.
V
Analog Input. This is the negative terminal of a true differential input consisting of IN+ and IN-.
VIN = (IN+ – IN-) IN- can swing to, but not below, ground.
REFIN
Analog Input. The converter’s reference voltage is the differential between this pin and ground times
two. It may be tied directly to REFOUT or scaled using a resistor divider. Any user supplied reference
voltage less than 1.25V may be used in place of REFOUT
.
4
5
GND
Ground Terminal.
REFOUT Analog Output. The internal reference connects to this pin. It may be scaled externally, if desired, and
tied to the REFIN input to provide the converter’s reference voltage. Care must be taken in connecting
external circuitry to this pin.
6
7
8
SDAT
SCLK
VDD
Digital Output (push-pull). This is the microPort™ serial data output. SDAT is driven low while the
TC3400 is converting data, effectively providing a “busy” signal. After the conversion is complete,
every high to low transition on the SCLK pin puts a bit from the resulting data word on the SDAT pin
(from MSB to LSB).
Digital Input. This is the microPort™ serial clock input. The TC3400 comes out of sleep mode and a
conversion cycle begins when this pin is driven low. After the conversion starts, each additional falling
edge (up to six) detected on SCLK for t4 seconds reduces the A/D resolution by one bit. When the
conversion is complete, the data word can be shifted out on the SDAT pin by clocking the SCLK pin.
Power Supply Input.
2002 Microchip Technology Inc.
DS21409B-page 5
TC3400
TABLE 3-1:
DATA CONVERSION WORD
VS. VOLTAGE INPUT
3.0
DETAILED DESCRIPTION
The TC3400 is a 16-bit sigma-delta A/D converter with
one differential input. See the Typical Application circuit
and the Functional Block diagram. The key components
of the TC3400 are described below.
(REF = 1.193V)
IN
Data Word
INn+ – INn- (Volts)
0111 1111 1111 1111 2.38596 (Positive Full Scale)
0000 0000 0000 0001 72.8 E -6
Also refer to Figure 3-4, A/D Operational Flowchart and
the Timing Diagrams, Figure 3-1, Figure 3-2 and
Figure 3-3).
0000 0000 0000 0000
0
1111 1111 1111 1111 -72.8 E -6
3.1
A/D Converter Operation
1000 0000 0000 0001 -2.38596 (Negative Full Scale)
1000 0000 0000 0000 Reserved Code
When the TC3400 is not converting, it is in sleep mode
with both the SCLK and SDAT lines high. An A/D
conversion is initiated by a high to low transition on the
SCLK line at which time the internal clock of the
TC3400 is started. Each additional high to low
transition of SCLK (following the initial SCLK falling
The SCLK input has a filter which rejects any positive
or negative pulse of width less than 50nsec to reduce
noise. The rejection width of this pulse can vary
between 50nsec and 750nsec depending on process-
ing parameters and supply voltage.
edge) during the time interval t , will decrement the
4
Figure 3-1 and Table 3-2 show information for deter-
mining the mode of operation for the TC3400 part by
recording the value of SDAT for SCLK in a high, then
low, then high state. For example, if SCLK goes
through a 1-0-1 transition and the corresponding val-
ues of SDAT are 1-1-0, then the SCLK falling edge
started a new data conversion. A 0-1-0 for SDAT would
have indicated a resolution reduction had occurred.
This is useful if the microcontroller has a watchdog
reset or otherwise loses track of where the TC3400 is
in the conversion and data readout sequence. The
microcontroller can simply transition SCLK until it
“finds” a Start Conversion condition.
conversion resolution by one bit and reduce the
conversion time by one half. The time interval t is
4
referred to as the resolution reduction window. The
minimum conversion resolution is 10-bits so any more
than 6 SCLK transitions during t will be ignored.
4
After each high to low transition of SCLK, in the t
4
interval, the SDAT output is driven high by the TC3400
to acknowledge that the conversion has been decre-
mented. When the SCLK returns high or the t interval
4
ends, the SDAT line returns low (see Figure 3-2). When
the conversion is complete SDAT is driven high. The
TC3400 now enters sleep mode and the conversion
value can be read as a serial data word on the SDAT
line.
FIGURE 3-1:
SCLK, SDAT LOGIC
STATE DIAGRAM
3.2
Reading the Data Word
SCLK
After the conversion is complete and SDAT goes high,
the conversion value can be clocked serially onto the
SDAT line by high to low transitions of the SCLK. The
data word is in two’s compliment format with the sign bit
clocked onto the SDAT line, first followed by the MSB
and ending in the LSB. For a 16-bit conversion the data
word would consist of a sign bit followed by 15 magni-
tude bits, Table 3-1 shows the data word versus input
voltage for a 16-bit conversion. Note that the full scale
SDAT
A
B
C
TABLE 3-2:
SCLK, SDAT LOGIC STATE
input voltage range is ±(2 REF – 1LSB). When
IN
REF
is fed back directly to REF , an LSB is 73µV
OUT
IN
A
B
C
Status
Start Conversion
for a 16-bit conversion, as REF
is typically 1.193V.
OUT
Figure 3-3 shows typical SCLK and SDAT waveforms
for 16, 12 and 10-bit conversions. Note that any
complete convert and read cycle requires 17 negative
edge clock pulses. The first is the convert command.
Then, up to six of these can occur in the resolution
1
0
x
x
1
1
1
0
0
0
1
0
Resolution Reduction
Data Transfer
Data Transfer or Busy*
reduction window, t , to decrement resolution. The
remaining pulses clock out the conversion data word.
4
*Note: The code X00 has a dual meaning: Data Transfer or
Busy converting. To avoid confusion, the user should
send only the required number of pulses for the
desired resolution, then wait for SDAT to rise to 1,
indicating conversion is complete before clocking
SCLK again to read out data bits.
DS21409B-page 6
2002 Microchip Technology Inc.
TC3400
FIGURE 3-2:
CONVERSION AND DATA OUTPUT TIMING
t
2
t
1
SCLK
SDAT
t
8
t
Sleep
Mode
t
4
5
t
8
D
(MSB)
D
0
(LSB)
N
D
D
N-1
N-2
t
3
Data Conversion
Complete
Start Conversion and Resolution Control Timing
Data Output Timing
FIGURE 3-3:
SCLK AND SDAT WAVEFORMS FOR 16, 12 AND 10-BIT CONVERSIONS
16-bit Data Conversion,
Data Word A5A5h
SCLK
t a
3
SDAT
Data Conversion
Complete
16-bit Data Conversion, Long Start Pulse,
Data Word 5A5Ah
SCLK
SDAT
> t a
3
Data Conversion
Complete
12-bit Conversion,
Data Word = AB3h
SCLK
SDAT
< t
4
t e
3
Data Conversion
Complete
10-bit Conversion with "Extra"
Data Reduction Clocks, Data Word = 3A4h
SCLK
SDAT
< t
4
t g
3
Data Conversion
Complete
2002 Microchip Technology Inc.
DS21409B-page 7
TC3400
FIGURE 3-4:
A/D OPERATIONAL FLOWCHART
SDAT = Low
POR
CONVCLK = 2m?
No
(Conversion Done?)
Sleep
SDAT = High
Yes
SCLK
Hgh to Low?
No
Power Down Analog,
Conversion Complete,
SDAT = High
Yes
Power Up Analog,
Start CONVCLK (= 0),
Start Conversion,
Resolution = 2m
(m = 16), Latch Input
Channel Address (if applicable).
SCLK
High to Low?
No
Yes
SCLK
Low to High
transition?
No
SDAT = Dm;
m = m – 1
Yes
SDAT = Low
Yes
m ≥ 0?
No
No
CONVCLK
9
< 2 ?
Yes
SDAT = High
Internal Reset
SCLK
High to Low?
No
No
Sleep
Yes
A/D
Resolution
10
> 2
?
Yes
Reduce A/D
Resolution by 1-bit
(m = m – 1);
SDAT = High
DS21409B-page 8
2002 Microchip Technology Inc.
TC3400
4.0
4.1
PACKAGING INFORMATION
Package Marking Information
Package marking data not available at this time.
4.2
Taping Forms
Component Taping Orientation for 8-Pin SOIC (Narrow) Devices
User Direction of Feed
PIN 1
W
P
Standard Reel Component Orientation
for TR Suffix Device
Carrier Tape, Number of Components Per Reel and Reel Size
Package
Carrier Width (W)
Pitch (P)
Part Per Full Reel
Reel Size
8-Pin SOIC (N)
12 mm
8 mm
2500
13 in
2002 Microchip Technology Inc.
DS21409B-page 9
TC3400
4.3
Package Dimensions
8-Pin Plastic DIP
PIN 1
.260 (6.60)
.240 (6.10)
.045 (1.14)
.030 (0.76)
.070 (1.78)
.040 (1.02)
.310 (7.87)
.290 (7.37)
.400 (10.16)
.348 (8.84)
.200 (5.08)
.140 (3.56)
.040 (1.02)
.020 (0.51)
.015 (0.38)
.008 (0.20)
3° MIN.
.150 (3.81)
.115 (2.92)
.400 (10.16)
.310 (7.87)
.110 (2.79)
.090 (2.29)
.022 (0.56)
.015 (0.38)
Dimensions: inches (mm)
8-Pin SOIC
PIN 1
.157 (3.99)
.150 (3.81)
.244 (6.20)
.228 (5.79)
.050 (1.27) TYP.
.197 (5.00)
.189 (4.80)
.069 (1.75)
.053 (1.35)
.010 (0.25)
.007 (0.18)
8° MAX.
.020 (0.51)
.013 (0.33)
.010 (0.25)
.004 (0.10)
.050 (1.27)
.016 (0.40)
Dimensions: inches (mm)
DS21409B-page 10
2002 Microchip Technology Inc.
TC3400
NOTES:
2002 Microchip Technology Inc.
DS21409B-page 11
TC3400
NOTES:
DS21409B-page 12
2002 Microchip Technology Inc.
TC3400
SALES AND SUPPORT
Data Sheets
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recom-
mended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:
1. Your local Microchip sales office
2. The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277
3. The Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.
New Customer Notification System
Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
© 2002 Microchip Technology Inc.
DS21409B-page 13
TC3400
NOTES:
DS21409B-page 14
© 2002 Microchip Technology Inc.
TC3400
Information contained in this publication regarding device
applications and the like is intended through suggestion only
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
No representation or warranty is given and no liability is
assumed by Microchip Technology Incorporated with respect
to the accuracy or use of such information, or infringement of
patents or other intellectual property rights arising from such
use or otherwise. Use of Microchip’s products as critical com-
ponents in life support systems is not authorized except with
express written approval by Microchip. No licenses are con-
veyed, implicitly or otherwise, under any intellectual property
rights.
Trademarks
The Microchip name and logo, the Microchip logo, FilterLab,
KEELOQ, microID, MPLAB, PIC, PICmicro, PICMASTER,
PICSTART, PRO MATE, SEEVAL and The Embedded Control
Solutions Company are registered trademarks of Microchip Tech-
nology Incorporated in the U.S.A. and other countries.
dsPIC, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB,
In-Circuit Serial Programming, ICSP, ICEPIC, microPort,
Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM,
MXDEV, PICC, PICDEM, PICDEM.net, rfPIC, Select Mode
and Total Endurance are trademarks of Microchip Technology
Incorporated in the U.S.A.
Serialized Quick Turn Programming (SQTP) is a service mark
of Microchip Technology Incorporated in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2002, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received QS-9000 quality system
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and Mountain View, California in March 2002.
The Company’s quality system processes and
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devices, Serial EEPROMs, microperipherals,
non-volatile memory and analog products. In
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design and manufacture of development
systems is ISO 9001 certified.
2002 Microchip Technology Inc.
DS21409B-page 15
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No. 317 Xian Xia Road
Shanghai, 200051
Tel: 86-21-6275-5700 Fax: 86-21-6275-5060
Kokomo
France
2767 S. Albright Road
Kokomo, Indiana 46902
Tel: 765-864-8360 Fax: 765-864-8387
Los Angeles
Microchip Technology SARL
Parc d’Activite du Moulin de Massy
43 Rue du Saule Trapu
Batiment A - ler Etage
91300 Massy, France
Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79
Germany
Microchip Technology GmbH
Gustav-Heinemann Ring 125
D-81739 Munich, Germany
Tel: 49-89-627-144 0 Fax: 49-89-627-144-44
18201 Von Karman, Suite 1090
Irvine, CA 92612
Tel: 949-263-1888 Fax: 949-263-1338
China - Shenzhen
Microchip Technology Consulting (Shanghai)
Co., Ltd., Shenzhen Liaison Office
Rm. 1315, 13/F, Shenzhen Kerry Centre,
Renminnan Lu
Shenzhen 518001, China
Tel: 86-755-2350361 Fax: 86-755-2366086
New York
150 Motor Parkway, Suite 202
Hauppauge, NY 11788
Tel: 631-273-5305 Fax: 631-273-5335
San Jose
Microchip Technology Inc.
2107 North First Street, Suite 590
San Jose, CA 95131
Tel: 408-436-7950 Fax: 408-436-7955
Toronto
China - Hong Kong SAR
Italy
Microchip Technology Hongkong Ltd.
Unit 901-6, Tower 2, Metroplaza
223 Hing Fong Road
Kwai Fong, N.T., Hong Kong
Tel: 852-2401-1200 Fax: 852-2401-3431
Microchip Technology SRL
Centro Direzionale Colleoni
Palazzo Taurus 1 V. Le Colleoni 1
20041 Agrate Brianza
Milan, Italy
6285 Northam Drive, Suite 108
Mississauga, Ontario L4V 1X5, Canada
Tel: 905-673-0699 Fax: 905-673-6509
India
Tel: 39-039-65791-1 Fax: 39-039-6899883
Microchip Technology Inc.
India Liaison Office
United Kingdom
Microchip Ltd.
505 Eskdale Road
Winnersh Triangle
Wokingham
Berkshire, England RG41 5TU
Tel: 44 118 921 5869 Fax: 44-118 921-5820
Divyasree Chambers
1 Floor, Wing A (A3/A4)
No. 11, O’Shaugnessey Road
Bangalore, 560 025, India
Tel: 91-80-2290061 Fax: 91-80-2290062
05/01/02
DS21409B-page 16
2002 Microchip Technology Inc.
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