TC4427VOA713G [MICROCHIP]
IC,DUAL MOSFET DRIVER,CMOS,SOP,8PIN,PLASTIC;
| 型号： | TC4427VOA713G |
| 厂家： | 
MICROCHIP |
| 描述： | IC,DUAL MOSFET DRIVER,CMOS,SOP,8PIN,PLASTIC 驱动 |
| 文件： | 总20页 (文件大小：333K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TC4426/TC4427/TC4428
1.5A Dual High-Speed Power MOSFET Drivers
General Description
Features
• High Peak Output Current – 1.5A
• Wide Input Supply Voltage Operating Range:
- 4.5V to 18V
The TC4426/TC4427/TC4428 are improved versions
of the earlier TC426/TC427/TC428 family of MOSFET
drivers. The TC4426/TC4427/TC4428 devices have
matched rise and fall times when charging and
discharging the gate of a MOSFET.
• High Capacitive Load Drive Capability – 1000 pF
in 25 ns (typ.)
These devices are highly latch-up resistant under any
conditions within their power and voltage ratings. They
are not subject to damage when up to 5V of noise spik-
ing (of either polarity) occurs on the ground pin. They
can accept, without damage or logic upset, up to
500 mA of reverse current (of either polarity) being
forced back into their outputs. All terminals are fully
protected against Electrostatic Discharge (ESD) up to
4 kV.
• Short Delay Times – 40 ns (typ.)
• Matched Rise and Fall Times
• Low Supply Current:
- With Logic ‘1’ Input – 4 mA
- With Logic ‘0’ Input – 400 µA
• Low Output Impedance – 7Ω
• Latch-Up Protected: Will Withstand 0.5A Reverse
Current
The TC4426/TC4427/TC4428 MOSFET drivers can
easily charge/discharge 1000 pF gate capacitances in
under 30 ns. These device provide low enough
impedances in both the on and off states to ensure the
MOSFET's intended state will not be affected, even by
large transients.
• Input Will Withstand Negative Inputs Up to 5V
• ESD Protected – 4 kV
• Pin-compatible with the TC426/TC427/TC428
• Space-saving 8-Pin MSOP and 8-Pin 6x5 DFN
Packages
Other compatible drivers are the TC4426A/TC4427A/
TC4428A family of devices. The TC4426A/TC4427A/
TC4428A devices have matched leading and falling
edge input-to-output delay times, in addition to the
matched rise and fall times of the TC4426/TC4427/
TC4428 devices.
Applications
• Switch Mode Power Supplies
• Line Drivers
• Pulse Transformer Drive
Package Types
8-Pin MSOP/
PDIP/SOIC TC4426 TC4427 TC4428
8-Pin DFN(1) TC4426 TC4427 TC4428
NC
NC 1
IN A 2
GND 3
IN B 4
8
7
6
5
NC
NC
1
2
3
4
8
7
6
5
NC
IN A
GND
IN B
NC
NC
NC
TC4426
TC4427
TC4428
OUT A
OUT A
OUT A
TC4426
TC4427
TC4428
OUT A
OUT A
OUT A
V
V
V
DD
DD
DD
V
OUT B
V
V
OUT B
OUT B
DD
DD
DD
OUT B
OUT B
OUT B
Note 1: Exposed pad of the DFN package is electrically isolated.
2004 Microchip Technology Inc.
DS21422C-page 1
TC4426/TC4427/TC4428
Functional Block Diagram
VDD
Inverting
1.5 mA
300 mV
Output
Non-Inverting
Input
Effective
Input C = 12 pF
(Each Input)
4.7V
TC4426/TC4427/TC4428
GND
Note 1: TC4426 has two inverting drivers, while the TC4427 has two non-inverting
drivers. The TC4428 has one inverting and one non-inverting driver.
2: Ground any unused driver input.
DS21422C-page 2
2004 Microchip Technology Inc.
TC4426/TC4427/TC4428
1.0
ELECTRICAL
PIN FUNCTION TABLE
CHARACTERISTICS
Name
Function
No Connection
NC
Absolute Maximum Ratings †
IN A
GND
IN B
Input A
Supply Voltage .....................................................+22V
Ground
Input Voltage, IN A or IN B
Input B
..................................... (VDD + 0.3V) to (GND – 5V)
OUT B
VDD
Output B
Supply Input
Output A
No Connection
Package Power Dissipation (TA ≤ 70°C)
DFN.............................................................. Note 3
MSOP..........................................................340 mW
PDIP............................................................730 mW
SOIC............................................................470 mW
OUT A
NC
Storage Temperature Range..............-65°C to +150°C
Maximum Junction Temperature...................... +150°C
† Stresses above those listed under "Absolute Maximum
Ratings" may cause permanent damage to the device. These
are stress ratings only and functional operation of the device
at these or any other conditions above those indicated in the
operation sections of the specifications is not implied.
Exposure to Absolute Maximum Rating conditions for
extended periods may affect device reliability.
DC CHARACTERISTICS
Electrical Specifications: Unless otherwise noted, TA = +25ºC with 4.5V ≤ VDD ≤ 18V.
Parameters
Sym
Min
Typ
Max Units
Conditions
Input
Logic ‘1’, High Input Voltage
Logic ‘0’, Low Input Voltage
Input Current
VIH
VIL
IIN
2.4
—
—
—
—
—
0.8
V
V
Note 2
-1.0
+1.0
µA 0V ≤ VIN ≤ VDD
Output
High Output Voltage
Low Output Voltage
Output Resistance
Peak Output Current
VOH
VOL
RO
VDD – 0.025
—
—
—
0.025
10
V
V
Ω
A
A
DC Test
—
—
—
—
DC Test
7
IOUT = 10 mA, VDD = 18V
VDD = 18V
IPK
1.5
> 0.5
—
Latch-Up Protection
IREV
—
Duty cycle ≤ 2%, t ≤ 300 µs
Withstand Reverse Current
VDD = 18V
Switching Time (Note 1)
Rise Time
tR
tF
—
—
—
—
19
19
20
40
30
30
30
50
ns Figure 4-1
ns Figure 4-1
ns Figure 4-1
ns Figure 4-1
Fall Time
Delay Time
tD1
tD2
Delay Time
Power Supply
Power Supply Current
IS
—
—
—
—
4.5
0.4
mA VIN = 3V (Both inputs)
VIN = 0V (Both inputs)
Note 1: Switching times ensured by design.
2: For V temperature range devices, the VIH (Min) limit is 2.0V.
3: Package power dissipation is dependent on the copper pad area on the PCB.
2004 Microchip Technology Inc.
DS21422C-page 3
TC4426/TC4427/TC4428
DC CHARACTERISTICS (OVER OPERATING TEMPERATURE RANGE)
Electrical Specifications: Unless otherwise noted, over operating temperature range with 4.5V ≤ VDD ≤ 18V.
Parameters
Sym
Min
Typ
Max Units
Conditions
Input
Logic ‘1’, High Input Voltage
Logic ‘0’, Low Input Voltage
Input Current
VIH
VIL
IIN
2.4
—
—
—
—
—
0.8
+10
V
V
Note 2
-10
µA 0V ≤ VIN ≤ VDD
Output
High Output Voltage
Low Output Voltage
Output Resistance
Peak Output Current
VOH
VOL
RO
VDD – 0.025
—
—
—
0.025
12
V
V
Ω
A
A
DC Test
—
—
—
—
DC Test
9
IOUT = 10 mA, VDD = 18V
VDD = 18V
IPK
1.5
>0.5
—
Latch-Up Protection
IREV
—
Duty cycle ≤ 2%, t ≤ 300 µs
Withstand Reverse Current
VDD = 18V
Switching Time (Note 1)
Rise Time
tR
tF
—
—
—
—
—
—
—
—
40
40
40
60
ns
ns
ns
ns
Figure 4-1
Figure 4-1
Figure 4-1
Figure 4-1
Fall Time
Delay Time
tD1
tD2
Delay Time
Power Supply
Power Supply Current
IS
—
—
—
—
8.0
0.6
mA VIN = 3V (Both inputs)
IN = 0V (Both inputs)
V
Note 1: Switching times ensured by design.
2: For V temperature range devices, the VIH (Min) limit is 2.0V.
TEMPERATURE CHARACTERISTICS
Electrical Specifications: Unless otherwise noted, all parameters apply with 4.5V ≤ VDD ≤ 18V.
Parameters
Temperature Ranges
Sym
Min
Typ
Max
Units
Conditions
Specified Temperature Range (C)
Specified Temperature Range (E)
Specified Temperature Range (V)
Maximum Junction Temperature
Storage Temperature Range
TA
TA
TA
TJ
TA
0
—
—
—
—
—
+70
+85
°C
°C
°C
°C
°C
-40
-40
—
+125
+150
+150
-65
Package Thermal Resistances
Thermal Resistance, 8L-6x5 DFN
Thermal Resistance, 8L-MSOP
Thermal Resistance, 8L-PDIP
Thermal Resistance, 8L-SOIC
θJA
θJA
θJA
θJA
—
—
—
—
33.2
206
125
155
—
—
—
—
°C/W
°C/W
°C/W
°C/W
DS21422C-page 4
2004 Microchip Technology Inc.
TC4426/TC4427/TC4428
2.0
TYPICAL PERFORMANCE CURVES
Note:
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Note: Unless otherwise indicated, TA = +25ºC with 4.5V ≤ VDD ≤ 18V.
100
100
80
2200 pF
2200 pF
80
1500 pF
1500 pF
60
60
40
1000 pF
1000 pF
40
470 pF
470 pF
100 pF
20
20
0
100 pF
0
14
16
18
4
6
8
10
12
(V)
14
16
18
4
6
8
10
12
(V)
V
V
DD
DD
FIGURE 2-1:
Rise Time vs. Supply
FIGURE 2-4:
Fall Time vs. Supply
Voltage.
Voltage.
100
80
100
80
5V
5V
10V
15V
60
40
20
60
40
20
10V
15V
0
100
0
100
1000
10,000
1000
(pF)
10,000
C
(pF)
C
LOAD
LOAD
FIGURE 2-2:
Rise Time vs. Capacitive
FIGURE 2-5:
Fall Time vs. Capacitive
Load.
Load.
60
50
40
30
80
75
70
65
60
55
50
45
40
35
30
25
20
CLOAD = 1000 pF
VIN = 5V
C
V
= 1000 pF
LOAD
= 17.5V
DD
tD2
tD1
t
FALL
20
10
t
RISE
4
6
8
10
12
14
16
18
–55 –35 –15
5
25 45 65 85 105 125
VDD (V)
Temperature (˚C)
FIGURE 2-3:
Temperature.
Rise and Fall Times vs.
FIGURE 2-6:
Supply Voltage.
Propagation Delay Time vs.
2004 Microchip Technology Inc.
DS21422C-page 5
TC4426/TC4427/TC4428
Note: Unless otherwise indicated, TA = +25ºC with 4.5V ≤ VDD ≤ 18V.
60
45
CLOAD = 1000 pF
VDD = 12V
CLOAD = 1000 pF
55
50
45
40
35
30
25
20
15
10
VIN = 5V
40
35
30
25
20
15
10
VDD = 18V
tD2
tD2
tD1
tD1
-55 -35 -15
5
25 45 65 85 105 125
0
1
2
3
4
5
6
7
8
9
10 11 12
Input Amplitude (V)
Temperature (ºC)
FIGURE 2-7:
Input Amplitude.
Propagation Delay Time vs.
FIGURE 2-10:
Temperature.
Propagation Delay Time vs.
4.0
VDD = 18V
3.5
3.0
2.5
2.0
Both Inputs = 1
1
Both Inputs = 1
Both Inputs = 0
0.1
–55 –35 –15
5
25 45 65 85 105 125
A (˚C)
4
6
8
10
12
14
16
18
V
T
DD
FIGURE 2-8:
Supply Current vs. Supply
FIGURE 2-11:
Supply Current vs.
Voltage.
Temperature.
25
20
15
25
20
15
Worst Case @ TJ = +150˚C
Worst Case @ TJ = +150˚C
Typical @ TA = +25˚C
Typical @ T = +25˚C
A
10
10
5
4
5
4
14
16
18
14
16
18
6
8
10
12
6
8
10
12
VDD
VDD
FIGURE 2-9:
Output Resistance (ROH) vs.
FIGURE 2-12:
Output Resistance (ROL) vs.
Supply Voltage.
Supply Voltage.
DS21422C-page 6
2004 Microchip Technology Inc.
TC4426/TC4427/TC4428
Note: Unless otherwise indicated, TA = +25ºC with 4.5V ≤ VDD ≤ 18V.
60
60
2 MHz
1000 pF
2200 pF
V
= 18V
V
= 18V
= 12V
= 6V
DD
DD
50
40
30
20
50
40
30
20
900 kHz
600 kHz
100 pF
200 kHz
20 kHz
10
0
10
0
100
1000
(pF)
10,000
10
100
FREQUENCY (kHz)
1000
C
LOAD
FIGURE 2-13:
Capacitive Load.
Supply Current vs.
FIGURE 2-16:
Frequency.
Supply Current vs.
60
60
2200 pF
V
= 12V
2 MHz
V
DD
DD
50
40
30
20
50
40
30
20
1000 pF
900 kHz
600 kHz
100 pF
10
0
10
0
200 kHz
20 kHz
100
1000
(pF)
10,000
10
100
1000
C
LOAD
FREQUENCY (kHz)
FIGURE 2-14:
Capacitive Load.
Supply Current vs.
FIGURE 2-17:
Frequency.
Supply Current vs.
60
60
V
= 6V
V
DD
DD
50
40
30
20
50
40
30
20
2200 pF
2 MHz
1000 pF
900 kHz
600 kHz
200 kHz
20 kHz
10
10
0
100 pF
0
100
1000
(pF)
10,000
10
100
FREQUENCY (kHz)
1000
C
LOAD
FIGURE 2-15:
Supply Current vs.
FIGURE 2-18:
Supply Current vs.
Capacitive Load.
Frequency.
2004 Microchip Technology Inc.
DS21422C-page 7
TC4426/TC4427/TC4428
Note: Unless otherwise indicated, TA = +25ºC with 4.5V ≤ VDD ≤ 18V.
–8
10
9
8
7
6
5
4
3
2
–9
10
4
6
8
10
V
12
14
16
18
DD
Note:
The values on this graph represent the loss
seen by both drivers in a package during one
complete cycle. For a single driver, divide the
stated values by 2. For a single transition of a
single driver, divide the stated value by 4.
FIGURE 2-19:
Crossover Energy vs.
Supply Voltage.
DS21422C-page 8
2004 Microchip Technology Inc.
TC4426/TC4427/TC4428
3.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
PIN FUNCTION TABLE (1)
8-Pin PDIP/
MSOP/SOIC
8-Pin
Symbol
DFN
Description
1
2
1
2
NC
IN A
GND
IN B
OUT B
VDD
No connection
Input A
3
3
Ground
4
4
Input B
5
5
Output B
6
6
Supply input
Output A
7
7
OUT A
NC
8
8
No connection
Exposed Metal Pad
—
PAD
NC
Note 1: Duplicate pins must be connected for proper operation.
3.1
Inputs A and B
3.4
Supply Input (V
)
DD
MOSFET driver inputs A and B are high-impedance,
TTL/CMOS compatible inputs. These inputs also have
300 mV of hysteresis between the high and low
thresholds that prevents output glitching even when the
rise and fall time of the input signal is very slow.
The VDD input is the bias supply for the MOSFET driver
and is rated for 4.5V to 18V with respect to the ground
pin. The VDD input should be bypassed with local
ceramic capacitors. The value of these capacitors
should be chosen based on the capacitive load that is
being driven. A value of 1.0 µF is suggested.
3.2
Ground (GND)
3.5
Exposed Metal Pad
Ground is the device return pin. The ground pin(s)
should have a low-impedance connection to the bias
supply source return. High peak currents will flow out
the ground pin(s) when the capacitive load is being
discharged.
The exposed metal pad of the 6x5 DFN package is not
internally connected to any potential. Therefore, this
pad can be connected to a ground plane or other cop-
per plane on a printed circuit board, to aid in heat
removal from the package.
3.3
Output A and B
MOSFET driver outputs A and B are low-impedance,
CMOS push-pull style outputs. The pull-down and pull-
up devices are of equal strength, making the rise and
fall times equivalent.
2004 Microchip Technology Inc.
DS21422C-page 9
TC4426/TC4427/TC4428
4.0
APPLICATIONS INFORMATION
+5V
90%
Input
10%
VDD = 18V
0V
VDD
tD1
tD2
t
tR
F
90%
90%
0.1 µF
4.7 µF
Output
0V
6
10%
10%
2
4
7
5
Input
Output
Inverting Driver
CL = 1000 pF
+5V
90%
Input
10%
0V
3
VDD
90%
90%
tD1
tD2
Input: 100 kHz,
square wave,
tRISE = tFALL ≤ 10 ns
tF
tR
Output
0V
10%
10%
Non-Inverting Driver
FIGURE 4-1:
Switching Time Test Circuit.
DS21422C-page 10
2004 Microchip Technology Inc.
TC4426/TC4427/TC4428
5.0
5.1
PACKAGING INFORMATION
Package Marking Information
8-Lead DFN
Example:
XXXXXXX
XXXXXXX
XXYYWW
NNN
TC4426
EMF
0420
256
Example:
8-Lead MSOP
4426C
XXXXX
420256
YWWNNN
8-Lead PDIP (300 mil)
Example:
XXXXXXXX
XXXXXNNN
TC4427
CPA256
YYWW
0420
8-Lead SOIC (150 mil)
Example:
XXXXXXXX
XXXXYYWW
TC4428
COA0420
NNN
256
Legend: XX...X Customer specific information*
Y
YY
WW
NNN
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line thus limiting the number of available characters
for customer specific information.
*
Standard device marking consists of Microchip part number, year code, week code, and traceability
code.
2004 Microchip Technology Inc.
DS21422C-page 11
TC4426/TC4427/TC4428
8-Lead Plastic Dual Flat No Lead Package (MF) 6x5 mm Body (DFN-S) – Saw Singulated
DS21422C-page 12
2004 Microchip Technology Inc.
TC4426/TC4427/TC4428
8-Lead Plastic Micro Small Outline Package (MS) (MSOP)
E
E1
p
D
2
1
B
n
α
A2
A
c
φ
A1
(F)
L
β
Units
Dimension Limits
INCHES
NOM
8
MILLIMETERS*
MIN
MAX
MIN
NOM
8
MAX
n
p
Number of Pins
Pitch
.026 BSC
0.65 BSC
Overall Height
A
A2
A1
E
-
-
.043
-
-
1.10
Molded Package Thickness
Standoff
.030
.000
.033
.037
.006
0.75
0.85
0.95
0.15
-
0.00
-
Overall Width
.193 TYP.
4.90 BSC
Molded Package Width
Overall Length
E1
D
.118 BSC
3.00 BSC
.118 BSC
3.00 BSC
Foot Length
L
.016
.024
.031
0.40
0.60
0.80
Footprint (Reference)
Foot Angle
F
.037 REF
0.95 REF
φ
c
0°
.003
.009
5°
-
.006
.012
-
8°
.009
.016
15°
0°
0.08
0.22
5°
-
-
-
-
-
8°
0.23
0.40
15°
Lead Thickness
Lead Width
B
α
β
Mold Draft Angle Top
Mold Draft Angle Bottom
*Controlling Parameter
Notes:
5°
-
15°
5°
15°
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed .010" (0.254mm) per side.
JEDEC Equivalent: MO-187
Drawing No. C04-111
2004 Microchip Technology Inc.
DS21422C-page 13
TC4426/TC4427/TC4428
8-Lead Plastic Dual In-line (P) – 300 mil (PDIP)
E1
D
2
n
1
α
E
A2
A
L
c
A1
β
B1
B
p
eB
Units
INCHES*
NOM
MILLIMETERS
Dimension Limits
MIN
MAX
MIN
NOM
8
MAX
n
p
Number of Pins
Pitch
8
.100
.155
.130
2.54
Top to Seating Plane
A
.140
.170
3.56
2.92
3.94
3.30
4.32
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
A2
A1
E
.115
.015
.300
.240
.360
.125
.008
.045
.014
.310
5
.145
3.68
0.38
7.62
6.10
9.14
3.18
0.20
1.14
0.36
7.87
5
.313
.250
.373
.130
.012
.058
.018
.370
10
.325
.260
.385
.135
.015
.070
.022
.430
15
7.94
6.35
9.46
3.30
0.29
1.46
0.46
9.40
10
8.26
6.60
9.78
3.43
0.38
1.78
0.56
10.92
15
E1
D
Tip to Seating Plane
Lead Thickness
L
c
Upper Lead Width
B1
B
Lower Lead Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
§
eB
α
β
5
10
15
5
10
15
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-001
Drawing No. C04-018
DS21422C-page 14
2004 Microchip Technology Inc.
TC4426/TC4427/TC4428
8-Lead Plastic Small Outline (SN) – Narrow, 150 mil (SOIC)
E
E1
p
D
2
1
B
n
h
α
45°
c
A2
A
φ
β
L
A1
Units
INCHES*
NOM
MILLIMETERS
Dimension Limits
MIN
MAX
MIN
NOM
8
MAX
n
p
Number of Pins
Pitch
8
.050
.061
.056
.007
.237
.154
.193
.015
.025
4
1.27
Overall Height
A
.053
.069
1.35
1.32
1.55
1.42
0.18
6.02
3.91
4.90
0.38
0.62
4
1.75
Molded Package Thickness
Standoff
A2
A1
E
.052
.004
.228
.146
.189
.010
.019
0
.061
.010
.244
.157
.197
.020
.030
8
1.55
0.25
6.20
3.99
5.00
0.51
0.76
8
§
0.10
5.79
3.71
4.80
0.25
0.48
0
Overall Width
Molded Package Width
Overall Length
E1
D
Chamfer Distance
Foot Length
h
L
φ
Foot Angle
c
Lead Thickness
Lead Width
.008
.013
0
.009
.017
12
.010
.020
15
0.20
0.33
0
0.23
0.42
12
0.25
0.51
15
B
α
Mold Draft Angle Top
Mold Draft Angle Bottom
β
0
12
15
0
12
15
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-012
Drawing No. C04-057
2004 Microchip Technology Inc.
DS21422C-page 15
TC4426/TC4427/TC4428
NOTES:
DS21422C-page 16
2004 Microchip Technology Inc.
TC4426/TC4427/TC4428
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
Examples:
PART NO.
Device
X
XX
XXX
X
a) TC4426COA:
1.5A Dual Inverting
MOSFET driver,
0°C to +70°C
Temperature Package Tape & Reel
Range
PB Free
SOIC package.
b) TC4426EUA:
c) TC4426EMF:
1.5A Dual Inverting
MOSFET driver,
-40°C to +85°C.
MSOP package.
Device:
TC4426: 1.5A Dual MOSFET Driver, Inverting
TC4427: 1.5A Dual MOSFET Driver, Non-Inverting
TC4428: 1.5A Dual MOSFET Driver, Complementary
1.5A Dual Inverting
MOSFET driver,
-40°C to +85°C,
DFN package.
Temperature Range:
Package:
C
E
V
=
=
=
0°C to +70°C (PDIP and SOIC only)
-40°C to +85°C
-40°C to +125°C
MF
=
Dual, Flat, No-Lead (6X5 mm Body), 8-lead
a) TC4427CPA:
b) TC4427EPA:
1.5A Dual Non-Inverting
MOSFET driver,
0°C to +70°C
MF713 = Dual, Flat, No-Lead (6X5 mm Body), 8-lead
(Tape and Reel)
OA
= Plastic SOIC, (150 mil Body), 8-lead
PDIP package.
OA713 = Plastic SOIC, (150 mil Body), 8-lead
(Tape and Reel)
1.5A Dual Non-Inverting
MOSFET driver,
-40°C to +85°C
PA
UA
=
=
Plastic DIP (300 mil Body), 8-lead
Plastic Micro Small Outline (MSOP), 8-lead
UA713 = Plastic Micro Small Outline (MSOP), 8-lead
(Tape and Reel)
PDIP package.
a) TC4428COA713:1.5A Dual Complementary
MOSFET driver,
PB Free:
G
=
=
Lead-Free device *
Blank
0°C to +70°C,
SOIC package,
Tape and Reel.
* Available on selected packages. Contact your local sales
representative for availability.
b) TC4428EMF:
1.5A Dual Complementary,
MOSFET driver,
-40°C to +85°C
DFN package.
Sales and Support
Data Sheets
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and
recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:
1. Your local Microchip sales office
2. The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277
3. The Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.
Customer Notification System
Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
2004 Microchip Technology Inc.
DS21422C-page 17
TC4426/TC4427/TC4428
NOTES:
DS21422C-page 18
2004 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is intended through suggestion only
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
No representation or warranty is given and no liability is
assumed by Microchip Technology Incorporated with respect
to the accuracy or use of such information, or infringement of
patents or other intellectual property rights arising from such
use or otherwise. Use of Microchip’s products as critical
components in life support systems is not authorized except
with express written approval by Microchip. No licenses are
conveyed, implicitly or otherwise, under any intellectual
property rights.
Trademarks
The Microchip name and logo, the Microchip logo, Accuron,
dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro,
PICSTART, PRO MATE, PowerSmart, rfPIC, and
SmartShunt are registered trademarks of Microchip
Technology Incorporated in the U.S.A. and other countries.
AmpLab, FilterLab, MXDEV, MXLAB, PICMASTER, SEEVAL,
SmartSensor and The Embedded Control Solutions Company
are registered trademarks of Microchip Technology
Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, dsPICDEM,
dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR,
FanSense, FlexROM, fuzzyLAB, In-Circuit Serial
Programming, ICSP, ICEPIC, Migratable Memory, MPASM,
MPLIB, MPLINK, MPSIM, PICkit, PICDEM, PICDEM.net,
PICLAB, PICtail, PowerCal, PowerInfo, PowerMate,
PowerTool, rfLAB, rfPICDEM, Select Mode, Smart Serial,
SmartTel and Total Endurance are trademarks of Microchip
Technology Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2004, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received ISO/TS-16949:2002 quality system certification for
its worldwide headquarters, design and wafer fabrication facilities in
Chandler and Tempe, Arizona and Mountain View, California in
October 2003. The Company’s quality system processes and
procedures are for its PICmicro® 8-bit MCUs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
2004 Microchip Technology Inc.
DS21422C-page 19
WORLDWIDE SALES AND SERVICE
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
480-792-7627
Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
India - Bangalore
Tel: 91-80-2229-0061
Fax: 91-80-2229-0062
Austria - Weis
Tel: 43-7242-2244-399
Fax: 43-7242-2244-393
China - Beijing
Tel: 86-10-8528-2100
Fax: 86-10-8528-2104
Denmark - Ballerup
Tel: 45-4420-9895
Fax: 45-4420-9910
India - New Delhi
Tel: 91-11-5160-8632
Fax: 91-11-5160-8632
China - Chengdu
Tel: 86-28-8676-6200
Fax: 86-28-8676-6599
France - Massy
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
Japan - Kanagawa
Tel: 81-45-471- 6166
Fax: 81-45-471-6122
Web Address:
www.microchip.com
Atlanta
China - Fuzhou
Tel: 86-591-750-3506
Fax: 86-591-750-3521
Germany - Ismaning
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Korea - Seoul
Alpharetta, GA
Tel: 770-640-0034
Fax: 770-640-0307
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
China - Hong Kong SAR
Tel: 852-2401-1200
Fax: 852-2401-3431
Boston
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
Westford, MA
Tel: 978-692-3848
Fax: 978-692-3821
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
China - Shanghai
Tel: 86-21-6275-5700
Fax: 86-21-6275-5060
Taiwan - Kaohsiung
Tel: 886-7-536-4816
Fax: 886-7-536-4817
Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
England - Berkshire
Tel: 44-118-921-5869
Fax: 44-118-921-5820
China - Shenzhen
Tel: 86-755-8290-1380
Fax: 86-755-8295-1393
Taiwan - Taipei
Tel: 886-2-2500-6610
Fax: 886-2-2508-0102
Dallas
Addison, TX
China - Shunde
Tel: 972-818-7423
Fax: 972-818-2924
Tel: 86-757-2839-5507
Fax: 86-757-2839-5571
Taiwan - Hsinchu
Tel: 886-3-572-9526
Fax: 886-3-572-6459
Detroit
China - Qingdao
Farmington Hills, MI
Tel: 248-538-2250
Fax: 248-538-2260
Tel: 86-532-502-7355
Fax: 86-532-502-7205
Kokomo
Kokomo, IN
Tel: 765-864-8360
Fax: 765-864-8387
Los Angeles
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
San Jose
Mountain View, CA
Tel: 650-215-1444
Fax: 650-961-0286
Toronto
Mississauga, Ontario,
Canada
Tel: 905-673-0699
Fax: 905-673-6509
08/24/04
DS21422C-page 20
2004 Microchip Technology Inc.
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