TC4455AVOA713 [MICROCHIP]
3A Dual High-Speed Power MOSFET Drivers; 3A双高速功率MOSFET驱动器
| 型号： | TC4455AVOA713 |
| 厂家： | 
MICROCHIP |
| 描述： | 3A Dual High-Speed Power MOSFET Drivers |
| 文件： | 总22页 (文件大小：756K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TC4423A/TC4424A/TC4425A
3A Dual High-Speed Power MOSFET Drivers
General Description
Features
• High Peak Output Current: 4.5A (typical)
• Wide Input Supply Voltage Operating Range:
- 4.5V to 18V
The TC4423A/TC4424A/TC4425A devices are a family
of dual-output 3A buffers/MOSFET drivers. These
devices are improved versions of the earlier TC4423/
TC4424/TC4425 dual-output 3A driver family. This
improved version features higher peak output current
drive capability, lower shoot-throught current, matched
rise/fall times and propagation delay times. The
TC4423A/TC4424A/TC4425A devices are pin-
compatible with the existing TC4423/TC4424/TC4425
family. An 8-pin SOIC package option has been added
to the family. The 8-pin DFN package option offers
increased power dissipation capability for driving
heavier capacitive or resistive loads.
• High Capacitive Load Drive Capability:
- 1800 pF in 12 ns
• Short Delay Times: 40 ns (typical)
• Matched Rise/Fall Times
• Low Supply Current:
- With Logic ‘1’ Input – 1.0 mA (maximum)
- With Logic ‘0’ Input – 150 µA (maximum)
• Low Output Impedance: 2.5Ω (typical)
• Latch-Up Protected: Will Withstand 1.5A Reverse
Current
The TC4423A/TC4424A/TC4425A MOSFET drivers
can easily charge and discharge 1800 pF gate
capacitance in under 20 ns, provide low enough
impedances in both the on and off states to ensure the
MOSFET’s intended state will not be affected, even by
large transients.
• Logic Input Will Withstand Negative Swing Up To
5V
• Pin compatible with the TC4423/TC4424/TC4425
and TC4426A/TC4427A/TC4428A devices
• Space-saving 8-Pin 150 mil body SOIC and 8-Pin
6x5 DFN Packages
The TC4423A/TC4424A/TC4425A inputs may be
driven directly from either TTL or CMOS (2.4V to 18V).
In addition, the 300 mV of built-in hysteresis provides
noise immunity and allows the device to be driven from
slow rising or falling waveforms.
Applications
• Switch Mode Power Supplies
• Pulse Transformer Drive
• Line Drivers
The TC4423A/TC4424A/TC4425A dual-output 3A
MOSFET driver family is offerd with a -40oC to +125oC
temperature rating, making it useful in any wide
temperature range application.
• Direct Drive of Small DC Motors
Package Types
8-Pin PDIP/SOIC TC4423A TC4424A TC4425A
TC4423A TC4424A TC4425A
16-Pin SOIC (Wide
)
1
2
3
4
5
6
7
8
16
15
14
13
NC
NC
IN A
NC
GND
GND
NC
NC
NC
NC
NC
8
7
6
5
NC
NC
1
OUT A
OUT A
VDD
OUT A
OUT A
VDD
OUT A
OUT A
VDD
TC4423A
TC4424A
TC4425A
IN A 2
GND 3
IN B 4
OUT A
VDD
OUT B
OUT A
VDD
OUT B
OUT A
VDD
OUT B
TC4423A
TC4424A
TC4425A
VDD
VDD
VDD
12
11
10
OUT B
OUT B
NC
OUT B
OUT B
NC
OUT B
OUT B
NC
8-Pin 6x5 DFN (1
)
TC4423A TC4424A TC4425A
IN B
NC
9
1
8
7
6
5
NC
NC
NC
NC
TC4423A
TC4424A
TC4425A
2
3
4
IN A
GND
IN B
OUT A
VDD
OUT A
VDD
OUT A
VDD
OUT B
OUT B
OUT B
Note 1: Exposed pad of the DFN package is electrically isolated.
2: Duplicate pins must both be connected for proper operation.
© 2007 Microchip Technology Inc.
DS21998B-page 1
TC4423A/TC4424A/TC4425A
Functional Block Diagram(1)
VDD
Inverting
750 µA
300 mV
Output
Non-inverting
Input
Effective
Input C = 20 pF
(Each Input)
4.7V
TC4423A Dual Inverting
TC4424A Dual Non-inverting
TC4425A Inverting / Non-inverting
GND
Note 1: Unused inputs should be grounded.
DS21998B-page 2
© 2007 Microchip Technology Inc.
TC4423A/TC4424A/TC4425A
† Notice: Stresses above those listed under "Maximum
Ratings" may cause permanent damage to the device. This is
a stress rating only and functional operation of the device at
those or any other conditions above those indicated in the
operational sections of this specification is not intended.
Exposure to maximum rating conditions for extended periods
1.0
ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings †
Supply Voltage ................................................................+20V
Input Voltage, IN A or IN B..........(VDD + 0.3V) to (GND – 5V)
Package Power Dissipation (TA=50°C)
may affect device reliability.
8L PDIP.......................................................................1.2W
8L SOIC.................................................................... 0.61W
16L SOIC.....................................................................1.1W
8L DFN.................................................................... Note 3
DC CHARACTERISTICS (NOTE 2)
Electrical Specifications: Unless otherwise indicated, TA = +25°C, with 4.5V ≤ VDD ≤ 18V.
Parameters
Sym
Min
Typ
Max
Units
Conditions
Input
Logic ‘1’, High Input Voltage
Logic ‘0’, Low Input Voltage
Input Current
VIH
VIL
IIN
2.4
—
–1
-5
1.5
1.3
—
—
0.8
V
V
1
µA 0V ≤ VIN ≤ VDD
Input Voltage
VIN
—
VDD+0.3
V
Output
High Output Voltage
Low Output Voltage
Output Resistance, High
Output Resistance, Low
Peak Output Current
VOH
VOL
ROH
ROL
IPK
VDD – 0.025
—
—
—
0.025
3.0
3.5
—
V
V
Ω
Ω
A
A
DC Test
—
—
—
—
—
DC Test
2.2
2.8
4.5
>1.5
IOUT = 10 mA, VDD = 18V
IOUT = 10 mA, VDD = 18V
10V≤ VDD ≤18V (Note 2)
Duty cycle ≤ 2%, t ≤ 300 µsec.
Latch-Up Protection With-
stand Reverse Current
IREV
—
Switching Time (Note 1)
Rise Time
tR
tF
tD1
tD2
—
—
—
—
12
12
40
41
21
21
48
48
ns
ns
ns
ns
Figure 4-1, Figure 4-2,
CL = 1800 pF
Fall Time
Figure 4-1, Figure 4-2,
CL = 1800 pF
Delay Time
Delay Time
Figure 4-1, Figure 4-2,
CL = 1800 pF
Figure 4-1, Figure 4-2,
CL = 1800 pF
Power Supply
Supply Voltage
VDD
IS
4.5
—
—
1.0
18
2.0
V
Power Supply Current
mA VIN = 3V (Both inputs)
mA VIN = 0V (Both inputs)
IS
—
0.15
0.25
Note 1: Switching times ensured by design.
2: Tested during characterization, not production tested.
3: Package power dissipation is dependent on the copper pad area on the PCB.
© 2007 Microchip Technology Inc.
DS21998B-page 3
TC4423A/TC4424A/TC4425A
DC CHARACTERISTICS (OVER OPERATING TEMPERATURE RANGE)
Electrical Specifications: Unless otherwise indicated, operating temperature range with 4.5V ≤ VDD ≤ 18V.
Parameters
Sym
Min
Typ
Max
Units
Conditions
Input
Logic ‘1’, High Input Voltage VIH
2.4
—
—
—
—
—
0.8
+10
V
V
Logic ‘0’, Low Input Voltage
Input Current
VIL
IIN
–10
µA
0V ≤ VIN ≤ VDD
Output
High Output Voltage
Low Output Voltage
Output Resistance, High
Output Resistance, Low
Switching Time (Note 1)
Rise Time
VOH VDD – 0.025
—
—
—
0.025
6
V
V
Ω
Ω
VOL
ROH
ROL
—
—
—
3.1
3.7
IOUT = 10 mA, VDD = 18V
IOUT = 10 mA, VDD = 18V
7
tR
tF
tD1
tD2
—
—
—
—
20
22
50
50
31
31
66
66
ns
ns
ns
ns
Figure 4-1, Figure 4-2,
CL = 1800 pF
Fall Time
Figure 4-1, Figure 4-2,
CL = 1800 pF
Delay Time
Delay Time
Figure 4-1, Figure 4-2,
CL = 1800 pF
Figure 4-1, Figure 4-2,
CL = 1800 pF
Power Supply
Power Supply Current
IS
—
—
2.0
0.2
3.0
0.3
mA
VIN = 3V (Both inputs)
VIN = 0V (Both inputs)
Note 1: Switching times ensured by design.
TEMPERATURE CHARACTERISTICS
Electrical Specifications: Unless otherwise noted, all parameters apply with 4.5V ≤ VDD ≤ 18V.
Parameters
Sym
Min
Typ
Max
Units
Conditions
Temperature Ranges
Specified Temperature Range (V)
Maximum Junction Temperature
Storage Temperature Range
Package Thermal Resistances
Thermal Resistance, 8L-6x5 DFN
TA
TJ
TA
–40
—
—
—
—
+125
+150
+150
°C
°C
°C
–65
θJA
—
33.2
—
°C/W Typical four-layer board with
vias to ground plane
Thermal Resistance, 8L-PDIP
Thermal Resistance, 8L-SOIC
Thermal Resistance, 16L-SOIC
θJA
θJA
θJA
—
—
—
84.6
163
90
—
—
—
°C/W
°C/W
°C/W
DS21998B-page 4
© 2007 Microchip Technology Inc.
TC4423A/TC4424A/TC4425A
2.0
TYPICAL PERFORMANCE CURVES
Note: The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Note: Unless otherwise indicated, TA = +25°C with 4.5V <= VDD <= 18V.
80
70
60
50
40
30
20
10
0
80
70
60
50
40
30
20
10
0
4700 pF
4,700 pF
3300 pF
3,300 pF
1,800 pF
1800 pF
1,000 pF
470 pF
16
1000 pF
6
470 pF
6
4
8
10
12
14
16
18
4
8
10
12
14
18
Supply Voltage (V)
Supply Voltage (V)
FIGURE 2-1:
Rise Time vs. Supply
FIGURE 2-4:
Fall Time vs. Supply
Voltage.
Voltage.
60
50
40
30
20
10
70
60
50
40
30
20
10
5V
5V
10V
10V
15V
15V
0
0
100
1000
10000
100
1000
10000
Capacitive Load (pF)
Capacitive Load (pF)
FIGURE 2-2:
Rise Time vs. Capacitive
FIGURE 2-5:
Fall Time vs. Capacitive
Load.
Load.
24
145
125
CLOAD = 1800 pF
VDD = 12V
22
20
18
16
14
12
10
CLOAD = 1800 pF
tFALL
105
85
65
45
25
tD1
tRISE
tD2
-40 -25 -10
5
20 35 50 65 80 95 110 125
Temperature (oC)
2
3
4
5
6
7
8
9
10
Input Amplitude (V)
FIGURE 2-3:
Rise and Fall Times vs.
FIGURE 2-6:
Propagation Delay vs. Input
Temperature.
Amplitude.
© 2007 Microchip Technology Inc.
DS21998B-page 5
TC4423A/TC4424A/TC4425A
Typical Performance Curves (Continued)
Note: Unless otherwise indicated, TA = +25°C with 4.5V <= VDD <= 18V.
100
90
80
70
60
50
40
30
70
65
60
55
50
45
40
35
30
CLOAD = 1800 pF
VDD = 18V
VIN = 5V
CLOAD = 1800 pF
tD1
tD2
tD2
tD1
-40 -25 -10
5
20 35 50 65 80 95 110 125
Temperature (oC)
4
6
8
10
12
14
16
18
Supply Voltage (V)
FIGURE 2-7:
Propagation Delay Time vs.
FIGURE 2-10:
Propagation Delay Time vs.
Supply Voltage.
Temperature.
0.5
0.5
VDD = 18V
VDD = 18V
0.4
0.4
Both Inputs = 1
0.3
0.2
0.1
0
0.3
0.2
0.1
0
Both Inputs = 1
Both Inputs = 0
Both Inputs = 0
-40 -25 -10
5
20 35 50 65 80 95 110 125
Temperature (oC)
4
6
8
10
12
14
16
18
Supply Voltage (V)
FIGURE 2-8:
Quiescent Current vs.
FIGURE 2-11:
Quiescent Current vs.
Supply Voltage.
Temperature.
7
8
VIN = 0V (TC4424A)
VIN = 5V (TC4424A)
VIN = 5V (TC4423A)
VIN = 0V (TC4423A)
TJ = 150oC
6
5
4
3
2
1
TJ = 150oC
7
6
5
4
3
2
TJ = 25oC
TJ = 25oC
4
6
8
10
12
14
16
18
4
6
8
10
12
14
16
18
Supply Voltage (V)
Supply Voltage (V)
FIGURE 2-9:
Output Resistance (Output
FIGURE 2-12:
Output Resistance (Output
Low) vs. Supply Voltage.
High) vs. Supply Voltage.
DS21998B-page 6
© 2007 Microchip Technology Inc.
TC4423A/TC4424A/TC4425A
Typical Performance Curves (Continued)
Note: Unless otherwise indicated, TA = +25°C with 4.5V <= VDD <= 18V.
120
100
80
60
40
20
0
100
90
80
70
60
50
40
30
20
10
0
VDD = 18V
VDD = 18V
650 kHz
50 kHz
100 kHz
10,000 pF
4,700 pF
470 pF
1,800 pF
100 pF
1,000 pF
400 kHz
200 kHz
100
1000
Capacitive Load (pF)
10000
10
100
Frequency (kHz)
1000
FIGURE 2-13:
Supply Current vs.
FIGURE 2-16:
Supply Current vs.
Capacitive Load.
Frequency.
140
140
VDD = 12V
VDD = 12V
2 MHz
4,700 pF
120
100
80
120
100
80
60
40
20
0
10,000 pF
100 kHz
200 kHz
1,800 pF
1,000 pF
470 pF
60
500 kHz
40
1 MHz
20
100 pF
0
100
1000
10000
10
100
1000
10000
Capacitive Load (pF)
Frequency (kHz)
FIGURE 2-14:
Supply Current vs.
FIGURE 2-17:
Supply Current vs.
Capacitive Load.
Frequency.
120
140
VDD = 6V
VDD = 6V
3.5 MHz
4,700 pF
120
100
80
100
80
2 MHz
100 kHz
200 kHz
1 MHz
1,800 pF
60
60
1,000 pF
40
20
0
500 kHz
40
10,000 pF
100
20
100 pF
10000
470 pF
0
100
1000
10000
10
1000
Frequency (kHz)
100000
Capacitive Load (pF)
FIGURE 2-15:
Supply Current vs.
FIGURE 2-18:
Supply Current vs.
Capacitive Load.
Frequency.
© 2007 Microchip Technology Inc.
DS21998B-page 7
TC4423A/TC4424A/TC4425A
Typical Performance Curves (Continued)
Note: Unless otherwise indicated, TA = +25°C with 4.5V <= VDD <= 18V.
10-6
-7
10
-8
10
-9
10
4
6
8
10
12
14
16
18
Supply Voltage (V)
Note:
The values on this graph
represents the loss seen by both
drivers in a package during one
complete cycle. For a single driver,
divide the stated values by 2. For a
single transition of a single driver,
divide the stated value by 4.
FIGURE 2-19:
Crossover Energy vs.
Supply Voltage.
DS21998B-page 8
© 2007 Microchip Technology Inc.
TC4423A/TC4424A/TC4425A
3.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
(1)
TABLE 3-1:
8-Pin PDIP
PIN FUNCTION TABLE
16-Pin
8-Pin
SOIC
(Wide)
Symbol
Description
DFN
1
2
1
2
1
2
NC
IN A
NC
No connection
Input A
—
3
—
3
3
No connection
Ground
4
GND
GND
NC
—
—
4
—
—
4
5
Ground
6
No connection
Input B
7
IN B
NC
—
—
5
—
—
5
8
No connection
No connection
Output B
9
NC
10
11
12
13
14
15
16
—
OUT B
OUT B
VDD
—
6
—
6
Output B
Supply input
Supply input
Output A
—
7
—
7
VDD
OUT A
OUT A
NC
—
8
—
8
Output A
No connection
Exposed Metal Pad
—
PAD
NC
Note 1: Duplicate pins must be connected for proper operation.
3.1
Inputs A and B
3.4
Ground (GND)
Inputs A and B are TTL/CMOS compatible inputs that
control outputs A and B, respectively. These inputs
have 300 mV of hysteresis between the high and low
input levels, allowing them to be driven from slow rising
and falling signals, and to provide noise immunity.
Ground is the device return pin. The ground pin should
have a low-impedance connection to the bias supply
source return. High peak currents will flow out the
ground pin when the capacitive load is being
discharged.
3.2
Outputs A and B
3.5
Exposed Metal Pad
Outputs A and B are CMOS push-pull outputs that are
capable of sourcing and sinking 3A peaks of current
(VDD = 18V). The low output impedance ensures the
gate of the external MOSFET will stay in the intended
state even during large transients. These outputs also
have a reverse current latch-up rating of 1.5A.
The exposed metal pad of the DFN package is not
internally connected to any potential. Therefore, this
pad can be connected to a ground plane or other
copper plane on a printed circuit board to aid in heat
removal from the package.
3.3
Supply Input (VDD)
VDD is the bias supply input for the MOSFET driver and
has a voltage range of 4.5V to 18V. This input must be
decoupled to ground with a local ceramic capacitor.
This bypass capacitor provides a localized low-
impedance path for the peak currents that are to be
provided to the load.
© 2007 Microchip Technology Inc.
DS21998B-page 9
TC4423A/TC4424A/TC4425A
4.0
APPLICATIONS INFORMATION
VDD = 18V
VDD = 18V
1 µF
WIMA
MKS-2
1 µF
WIMA
MKS-2
0.1 µF
Ceramic
0.1 µF
Ceramic
Input
Output
1
2
Input
Output
1
CL = 1800 pF
CL = 1800 pF
2
TC4423A
TC4424A
(1/2 TC4425A)
(1/2 TC4425A)
Input: 100 kHz,
square wave,
Input: 100 kHz,
square wave,
tRISE = tFALL ≤ 10 ns
t
RISE = tFALL ≤ 10 ns
+5V
+5V
90%
90%
Input
0V
Input
10%
10%
tD1
90%
10%
tD2
0V
tF
tR
18V
18V
90%
90%
90%
tD1
tD2
tF
tR
Output
Output
0V
10%
10%
10%
0V
FIGURE 4-1:
Inverting Driver Switching
FIGURE 4-2:
Non-inverting Driver
Time.
Switching Time.
DS21998B-page 10
© 2007 Microchip Technology Inc.
TC4423A/TC4424A/TC4425A
5.0
5.1
PACKAGING INFORMATION
Package Marking Information (Not to Scale)
8-Lead DFN (6x5)
Example:
XXXXXXX
XXXXXXX
XXYYWW
NNN
TC4423A
e
3
VMF^
0520
256
8-Lead PDIP (300 mil)
Example:
TC4423AV
XXXXXXXX
XXXXXNNN
e
3
PA^^256
0520
YYWW
8-Lead SOIC (150 mil)
Example:
TC4423AV
XXXXXXXX
XXXXYYWW
NNN
OA^
e
3
0520
256
16-Lead SOIC (300 mil)
Example:
XXXXXXXXXXX
XXXXXXXXXXX
XXXXXXXXXXX
YYWWNNN
TC4423A
VOE^
e
3
0420256
Legend: XX...X Customer-specific information
Y
YY
WW
NNN
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
e
3
Pb-free JEDEC designator for Matte Tin (Sn)
*
This package is Pb-free. The Pb-free JEDEC designator (
can be found on the outer packaging for this package.
)
e3
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
© 2007 Microchip Technology Inc.
DS21998B-page 11
TC4423A/TC4424A/TC4425A
8-Lead Plastic Dual Flat, No Lead Package (MF) – 6x5 mm Body [DFN-S]
PUNCH SINGULATED
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
e
L
D1
b
N
N
K
E
E2
E1
EXPOSED
PAD
NOTE 1
1
2
2
1
NOTE 1
D2
TOP VIEW
BOTTOM VIEW
φ
A2
A
A3
A1
NOTE 2
Units
MILLIMETERS
NOM
Dimension Limits
MIN
MAX
Number of Pins
Pitch
N
e
8
1.27 BSC
0.85
Overall Height
A
–
–
1.00
0.80
0.05
Molded Package Thickness
Standoff
A2
A1
A3
D
0.65
0.00
0.01
Base Thickness
0.20 REF
4.92 BSC
4.67 BSC
4.00
Overall Length
Molded Package Length
Exposed Pad Length
Overall Width
D1
D2
E
3.85
4.15
5.99 BSC
5.74 BSC
2.31
Molded Package Width
Exposed Pad Width
Contact Width
E1
E2
b
2.16
0.35
0.50
0.20
–
2.46
0.47
0.75
–
0.40
Contact Length
L
0.60
Contact-to-Exposed Pad
Model Draft Angle Top
K
–
φ
–
12°
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package may have one or more exposed tie bars at ends.
3. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-113B
DS21998B-page 12
© 2007 Microchip Technology Inc.
TC4423A/TC4424A/TC4425A
8-Lead Plastic Dual In-Line (PA) – 300 mil Body [PDIP]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
N
NOTE 1
E1
3
1
2
D
E
A2
A
L
A1
c
e
eB
b1
b
Units
INCHES
Dimension Limits
MIN
NOM
8
MAX
Number of Pins
Pitch
N
e
.100 BSC
–
Top to Seating Plane
A
–
.210
.195
–
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
A2
A1
E
.115
.015
.290
.240
.348
.115
.008
.040
.014
–
.130
–
.310
.250
.365
.130
.010
.060
.018
–
.325
.280
.400
.150
.015
.070
.022
.430
E1
D
Tip to Seating Plane
Lead Thickness
L
c
Upper Lead Width
b1
b
Lower Lead Width
Overall Row Spacing §
eB
Notes:
1. Pin 1 visual index feature may vary, but must be located with the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing C04-018B
© 2007 Microchip Technology Inc.
DS21998B-page 13
TC4423A/TC4424A/TC4425A
8-Lead Plastic Small Outline (OA) – Narrow, 3.90 mm Body [SOIC]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
e
N
E
E1
NOTE 1
1
2
3
α
h
b
h
c
φ
A2
A
L
A1
L1
β
Units
MILLIMETERS
Dimension Limits
MIN
NOM
MAX
Number of Pins
Pitch
N
e
8
1.27 BSC
Overall Height
A
–
–
1.75
–
Molded Package Thickness
Standoff
A2
A1
E
1.25
0.10
–
§
–
0.25
Overall Width
6.00 BSC
Molded Package Width
Overall Length
Chamfer (optional)
Foot Length
E1
D
h
3.90 BSC
4.90 BSC
0.25
0.40
–
0.50
1.27
L
–
Footprint
L1
φ
1.04 REF
Foot Angle
0°
0.17
0.31
5°
–
–
–
–
–
8°
Lead Thickness
Lead Width
c
0.25
0.51
15°
b
Mold Draft Angle Top
Mold Draft Angle Bottom
α
β
5°
15°
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-057B
DS21998B-page 14
© 2007 Microchip Technology Inc.
TC4423A/TC4424A/TC4425A
16-Lead Plastic Small Outline (OE) – Wide, 7.50 mm Body [SOIC]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
N
E
E1
NOTE 1
1
2 3
e
b
h
α
h
c
φ
A
A2
L
β
A1
L1
Units
MILLIMETERS
Dimension Limits
MIN
NOM
MAX
Number of Pins
Pitch
N
e
16
1.27 BSC
Overall Height
A
–
–
2.65
–
Molded Package Thickness
Standoff §
A2
A1
E
2.05
0.10
–
–
0.30
Overall Width
10.30 BSC
Molded Package Width
Overall Length
E1
D
h
7.50 BSC
10.30 BSC
Chamfer (optional)
Foot Length
0.25
0.40
–
0.75
1.27
L
–
Footprint
L1
φ
1.40 REF
Foot Angle
0°
0.20
0.31
5°
–
–
–
–
–
8°
Lead Thickness
Lead Width
c
0.33
0.51
15°
b
Mold Draft Angle Top
Mold Draft Angle Bottom
α
β
5°
15°
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-102B
© 2007 Microchip Technology Inc.
DS21998B-page 15
TC4423A/TC4424A/TC4425A
NOTES:
DS21998B-page 16
© 2007 Microchip Technology Inc.
TC4423A/TC4424A/TC4425A
APPENDIX A: REVISION HISTORY
Revision B (April 2007)
• Correct numerous errors throughout document.
• Page 3: Added Package Power Dissipation
information about DC Characteristic Table.
• Page 3: Added Note 3 to DC Characteristic Table.
• Page 4: Changed Thermal Resistance for
8L-PDIP device from 125 to 84.6.
Changed Thermal Resistance for 8L-SOIC from
155 to 163.
• Page 12: Updated Package Outline Drawing.
• Page 13: Updated Package Outline Drawing.
• Page 14: Updated Package Outline Drawing.
• Page 15: Added 16-Lead SOIC Package Outline
Drawing
• Page 17: Updated Revision History.
Revision A (June 2006)
• Original Release of this Document.
© 2007 Microchip Technology Inc.
DS21998B-page 17
TC4423A/TC4424A/TC4425A
NOTES:
DS21998B-page 18
© 2007 Microchip Technology Inc.
TC4423A/TC4424A/TC4425A
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.
Device
X
XX
XXX
Examples:
a) TC4423AVOA:
3A Dual Inverting
MOSFET Driver,
8LD SOIC package.
Temperature Package Tape & Reel
Range
b) TC4423AVPA:
c) TC4423AVMF:
d) TC4423AVOE:
3A Dual Inverting
MOSFET Driver,
8LD PDIP package.
Device:
TC4423A: 3A Dual MOSFET Driver, Inverting
TC4424A: 3A Dual MOSFET Driver, Non-Inverting
TC4425A: 3A Dual MOSFET Driver, Complementary
3A Dual Inverting
MOSFET Driver,
8LD DFN package.
Temperature Range:
Package: *
V
=
-40°C to +125°C
3A Dual Inverting
MOSFET Driver,
16LD SOIC package.
MF
=
Dual, Flat, No-Lead (6x5 mm Body), 8-lead
MF713 = Dual, Flat, No-Lead (6x5 mm Body), 8-lead
(Tape and Reel)
a) TC4424AVOA713: 3A Dual Non-Inverting,
MOSFET Driver,
OA
= Plastic SOIC (150 mil Body), 8-Lead
OA713 = Plastic SOIC (150 mil Body), 8-Lead
(Tape and Reel)
OE
OE713 = Plastic SOIC (Wide Body), 16-lead
(Tape and Reel)
PA
8LD SOIC package,
Tape and Reel.
= Plastic SOIC (Wide Body), 16-lead
b) TC4424AVPA:
3A Dual Non-Inverting,
MOSFET Driver,
= Plastic DIP, (300 mil body), 8-lead
8LD PDIP package.
* All package offerings are Pb Free (Lead Free)
a) TC4425AVOA:
b) TC4425AVPA:
3A Dual Complementary,
MOSFET Driver,
8LD SOIC package.
3A Dual Complementary,
MOSFET Driver,
8LD PDIP package.
c) TC4425AVOE713: 3A Dual Complementary,
MOSFET Driver,
16LD SOIC package,
Tape and Reel.
© 2007 Microchip Technology Inc.
DS21998B-page 19
TC4423A/TC4424A/TC4425A
NOTES:
DS21998B-page 20
© 2007 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, Accuron,
dsPIC, KEELOQ, KEELOQ logo, microID, MPLAB, PIC,
PICmicro, PICSTART, PRO MATE, PowerSmart, rfPIC, and
SmartShunt are registered trademarks of Microchip
Technology Incorporated in the U.S.A. and other countries.
AmpLab, FilterLab, Linear Active Thermistor, Migratable
Memory, MXDEV, MXLAB, PS logo, SEEVAL, SmartSensor
and The Embedded Control Solutions Company are
registered trademarks of Microchip Technology Incorporated
in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, CodeGuard,
dsPICDEM, dsPICDEM.net, dsPICworks, ECAN,
ECONOMONITOR, FanSense, FlexROM, fuzzyLAB,
In-Circuit Serial Programming, ICSP, ICEPIC, Mindi, MiWi,
MPASM, MPLAB Certified logo, MPLIB, MPLINK, PICkit,
PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal,
PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB,
rfPICDEM, Select Mode, Smart Serial, SmartTel, Total
Endurance, UNI/O, WiperLock and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2007, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received ISO/TS-16949:2002 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona, Gresham, Oregon and Mountain View, California. The
Company’s quality system processes and procedures are for its PIC®
MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial
EEPROMs, microperipherals, nonvolatile memory and analog
products. In addition, Microchip’s quality system for the design and
manufacture of development systems is ISO 9001:2000 certified.
© 2007 Microchip Technology Inc.
DS21998B-page 21
WORLDWIDE SALES AND SERVICE
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
Asia Pacific Office
Suites 3707-14, 37th Floor
Tower 6, The Gateway
Habour City, Kowloon
Hong Kong
Tel: 852-2401-1200
Fax: 852-2401-3431
India - Bangalore
Tel: 91-80-4182-8400
Fax: 91-80-4182-8422
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://support.microchip.com
Web Address:
www.microchip.com
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
India - New Delhi
Tel: 91-11-4160-8631
Fax: 91-11-4160-8632
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
India - Pune
Tel: 91-20-2566-1512
Fax: 91-20-2566-1513
Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
Atlanta
Duluth, GA
Tel: 678-957-9614
Fax: 678-957-1455
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Japan - Yokohama
Tel: 81-45-471- 6166
Fax: 81-45-471-6122
China - Beijing
Tel: 86-10-8528-2100
Fax: 86-10-8528-2104
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Korea - Gumi
Tel: 82-54-473-4301
Fax: 82-54-473-4302
Boston
China - Chengdu
Tel: 86-28-8665-5511
Fax: 86-28-8665-7889
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Korea - Seoul
China - Fuzhou
Tel: 86-591-8750-3506
Fax: 86-591-8750-3521
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
China - Hong Kong SAR
Tel: 852-2401-1200
Fax: 852-2401-3431
Malaysia - Penang
Tel: 60-4-646-8870
Fax: 60-4-646-5086
Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
UK - Wokingham
Tel: 44-118-921-5869
Fax: 44-118-921-5820
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
Detroit
Farmington Hills, MI
Tel: 248-538-2250
Fax: 248-538-2260
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
Kokomo
Kokomo, IN
Tel: 765-864-8360
Fax: 765-864-8387
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
Taiwan - Hsin Chu
Tel: 886-3-572-9526
Fax: 886-3-572-6459
China - Shenzhen
Tel: 86-755-8203-2660
Fax: 86-755-8203-1760
Taiwan - Kaohsiung
Tel: 886-7-536-4818
Fax: 886-7-536-4803
Los Angeles
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
China - Shunde
Tel: 86-757-2839-5507
Fax: 86-757-2839-5571
Taiwan - Taipei
Tel: 886-2-2500-6610
Fax: 886-2-2508-0102
Santa Clara
Santa Clara, CA
Tel: 408-961-6444
Fax: 408-961-6445
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
Toronto
Mississauga, Ontario,
Canada
Tel: 905-673-0699
Fax: 905-673-6509
China - Xian
Tel: 86-29-8833-7250
Fax: 86-29-8833-7256
12/08/06
DS21998B-page 22
© 2007 Microchip Technology Inc.
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