TN2106N3-G [MICROCHIP]

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TN2106N3-G
型号: TN2106N3-G
厂家: MICROCHIP    MICROCHIP
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Supertex inc.  
TN2106  
N-Channel Enhancement-Mode  
Vertical DMOS FET  
Features  
General Description  
Free from secondary breakdown  
This low threshold, enhancement-mode (normally-off)  
transistor utilizes a vertical DMOS structure and Supertex’s  
well-proven, silicon-gate manufacturing process. This  
combination produces a device with the power handling  
capabilities of bipolar transistors and the high input impedance  
and positive temperature coefficient inherent in MOS devices.  
Characteristic of all MOS structures, this device is free  
from thermal runaway and thermally-induced secondary  
breakdown.  
Low power drive requirement  
Ease of paralleling  
Low CISS and fast switching speeds  
Excellent thermal stability  
Integral source-drain diode  
High input impedance and high gain  
Applications  
Logic level interfaces - ideal for TTL and CMOS  
Solid state relays  
Battery operated systems  
Photo-voltaic drives  
Analog switches  
General purpose line drivers  
Telecom switches  
Supertex’s vertical DMOS FETs are ideally suited to a wide  
range of switching and amplifying applications where very  
low threshold voltage, high breakdown voltage, high input  
impedance, low input capacitance, and fast switching speeds  
are desired.  
Ordering Information  
Product Summary  
RDS(ON)  
Part Number  
Package Option  
Packing  
VGS(th)  
(max)  
BVDSS/BVDGS  
(max)  
TN2106K1-G  
TO-236AB (SOT-23) 3000/Reel  
60V  
2.5Ω  
2.0V  
TN2106N3-G  
TO-92  
1000/Bag  
2000/Reel  
TN2106N3-G P002  
TN2106N3-G P003  
Pin Configuration  
TN2106N3-G P005 TO-92  
TN2106N3-G P013  
DRAIN  
TN2106N3-G P014  
-G denotes a lead (Pb)-free / RoHS compliant package.  
Contact factory for Wafer / Die availablity.  
DRAIN  
GATE  
SOURCE  
GATE  
SOURCE  
Devices in Wafer / Die form are lead (Pb)-free / RoHS compliant.  
TO-236AB (SOT-23)  
TO-92  
Absolute Maximum Ratings  
Parameter  
Value  
BVDSS  
BVDGS  
±20V  
Product Marking  
Drain-to-source voltage  
Drain-to-gate voltage  
W = Code for week sealed  
= “Green” Packaging  
N1LW  
Gate-to-source voltage  
Package may or may not include the following marks: Si or  
-55OC to +150OC  
TO-236AB (SOT-23)  
Operating and storage temperature  
Absolute Maximum Ratings are those values beyond which damage to the device  
may occur. Functional operation under these conditions is not implied. Continuous  
operation of the device at the absolute rating level may affect device reliability. All  
voltages are referenced to device ground.  
SiTN  
2 1 0 6  
YYWW  
YY = Year Sealed  
WW = Week Sealed  
= “Green” Packaging  
Typical Thermal Resistance  
Package may or may not include the following marks: Si or  
TO-92  
Package  
θja  
TO-236AB (SOT-23)  
TO-92  
203OC/W  
132OC/W  
Doc.# DSFP-TN2106  
B080913  
Supertex inc.  
www.supertex.com  
TN2106  
Thermal Characteristics  
ID  
ID  
Power Dissipation  
Package  
IDR  
IDRM  
(continuous)†  
(pulsed)  
@TC = 25OC  
TO-236AB (SOT-23)  
TO-92  
280mA  
300mA  
0.8A  
1.0A  
0.36W  
0.74W  
280mA  
300mA  
0.8A  
1.0A  
Notes:  
ID (continuous) is limited by max rated Tj .  
Electrical Characteristics(TA = 25OC unless otherwise specified)  
Sym  
BVDSS  
VGS(th)  
Parameter  
Min  
60  
0.6  
-
Typ  
Max Units Conditions  
Drain-to-source breakdown voltage  
Gate threshold voltage  
-
-
-
V
V
VGS = 0V, ID = 1.0mA  
VGS = VDS, ID = 1.0mA  
2.0  
ΔVGS(th) Change in VGS(th) with temperature  
-3.8  
0.1  
-
-5.5 mV/OC VGS = VDS, ID = 1.0mA  
IGSS  
Gate body leakage  
-
100  
1.0  
nA  
VGS = ± 20V, VDS = 0V  
-
VGS = 0V, VDS = Max Rating  
IDSS  
Zero gate voltage drain current  
On-state drain current  
µA  
V
DS = 0.8Max Rating,  
-
-
100  
VGS = 0V, TA = 125OC  
VGS = 10V, VDS = 25V  
ID(ON)  
0.6  
-
-
A
-
-
5.0  
2.5  
1.0  
-
V
GS = 4.5V, ID = 200mA  
RDS(ON) Static drain-to-source on-state resistance  
Ω
-
-
VGS = 10V, ID = 500mA  
ΔRDS(ON) Change in RDS(ON) with temperature  
-
0.70  
400  
35  
%/OC VGS = 10V, ID = 500mA  
mmho VDS = 25V, ID = 500mA  
GFS  
CISS  
COSS  
CRSS  
td(ON)  
tr  
Forward transductance  
Input capacitance  
150  
-
-
-
-
-
-
-
-
-
50  
25  
8.0  
5.0  
8.0  
9.0  
8.0  
1.8  
-
VGS = 0V,  
VDS = 25V,  
f = 1.0MHz  
Common source output capacitance  
Reverse transfer capacitance  
Turn-on delay time  
17  
pF  
7.0  
3.0  
5.0  
6.0  
5.0  
1.2  
400  
VDD = 25V,  
ID = 0.5A,  
RGEN = 25Ω  
Rise time  
ns  
td(OFF)  
tf  
Turn-off delay time  
Fall time  
VSD  
trr  
Diode forward voltage drop  
Reverse recovery time  
V
VGS = 0V, ISD = 500mA  
VGS = 0V, ISD = 500mA  
ns  
Notes:  
1. All D.C. parameters 100% tested at 25OC unless otherwise stated. (Pulse test: 300µs pulse, 2% duty cycle.)  
2. All A.C. parameters sample tested.  
Switching Waveforms and Test Circuit  
10V  
VDD  
90%  
INPUT  
0V  
Pulse  
RL  
10%  
Generator  
OUTPUT  
t(ON)  
td(ON)  
t(OFF)  
td(OFF)  
RGEN  
tf  
tr  
VDD  
OUTPUT  
0V  
INPUT  
D.U.T.  
10%  
10%  
90%  
90%  
Doc.# DSFP-TN2106  
B080913  
Supertex inc.  
www.supertex.com  
2
TN2106  
Typical Performance Curves  
Output Characteristics  
Saturation Characteristics  
2.5  
2.5  
2.0  
1.5  
1.0  
0.5  
0
VGS = 10V  
VGS = 10V  
2.0  
1.5  
1.0  
0.5  
0
8V  
6V  
8V  
6V  
4V  
4V  
3V  
3V  
10  
0
10  
20  
30  
40  
50  
0
2.0  
4.0  
6.0  
8.0  
VDS (volts)  
VDS (volts)  
Transconductance vs. Drain Current  
Power Dissipation vs. Temperature  
0.5  
0.4  
0.3  
0.2  
0.1  
0
1.0  
0.8  
0.6  
0.4  
0.2  
0
VDS = 25V  
TO-92  
TA = -55OC  
25OC  
125OC  
SOT-23  
0
0.2  
0.4  
0.6  
0.8  
1.0  
0
25  
50  
75  
100  
125  
150  
ID (amperes)  
TA (OC)  
Maximum Rated Safe Operating Area  
Thermal Response Characteristics  
1.0  
0.8  
0.6  
0.4  
0.2  
0
1.0  
SOT-23 (pulsed)  
SOT-23 (DC)  
0.1  
0.01  
TO-236AB  
PD = 0.36W  
TA = 25OC  
TO-92  
PD = 1.0W  
TC = 25OC  
TA = 25OC  
0.001  
0.1100  
1
10  
0.001  
0.01  
0.1  
1.0  
10  
VDS (volts)  
tP (seconds)  
Doc.# DSFP-TN2106  
B080913  
Supertex inc.  
www.supertex.com  
3
TN2106  
Typical Performance Curves (cont.)  
BVDSS Variation with Temperature  
On-Resistance vs. Drain Current  
10  
8.0  
6.0  
4.0  
2.0  
0
1.1  
1.0  
0.9  
VGS = 4.5V  
VGS = 10V  
-50  
0
50  
100  
150  
0
0.5  
1.0  
1.5  
2.0  
2.5  
ID (amperes)  
Tj (OC)  
VGS(th) and RDS(ON) Variation with Temperature  
Transfer Characteristics  
2.0  
1.0  
VDS = 25V  
1.2  
RDS(ON) @ 10V, 0.5A  
1.6  
0.8  
0.6  
0.4  
0.2  
0
TA = -55OC  
1.0  
1.2  
0.8  
25OC  
0.8  
125OC  
VGS(th) @ 1.0mA  
0.6  
0.4  
0.4  
0
150  
-50  
0
50  
100  
0
2.0  
4.0  
6.0  
8.0  
10  
Tj (OC)  
VGS (volts)  
Capacitance vs. Drain-to-Source Voltage  
Gate Drive Dynamic Characteristics  
100  
10  
f = 1.0MHz  
8.0  
6.0  
4.0  
2.0  
0
75  
VDS = 10V  
50  
VDS = 20V  
CISS  
25  
92 pF  
COSS  
CRSS  
38 pF  
0.2  
0
0
10  
20  
30  
40  
0
0.4  
0.6  
0.8  
1.0  
QG (nanocoulombs)  
VDS (volts)  
Doc.# DSFP-TN2106  
B080913  
Supertex inc.  
www.supertex.com  
4
TN2106  
3-Lead TO-236AB (SOT-23) Package Outline (K1)  
2.90x1.30mm body, 1.12mm height (max), 1.90mm pitch  
D
3
E
E1  
Gauge  
Plane  
0.25  
Seating  
Plane  
L
L1  
1
2
e
b
e1  
View B  
Top View  
View B  
A
A2  
A
Seating  
Plane  
A1  
View A - A  
Side View  
A
Symbol  
A
A1  
0.01  
-
A2  
b
D
E
2.10  
-
E1  
e
e1  
L
L1  
θ
0O  
-
MIN  
NOM  
MAX  
0.89  
-
0.88  
0.95  
1.02  
0.30  
-
2.80  
2.90  
3.04  
1.20  
1.30  
1.40  
0.20†  
0.50  
0.60  
Dimension  
(mm)  
0.95  
BSC  
1.90  
BSC  
0.54  
REF  
1.12  
0.10  
0.50  
2.64  
8O  
JEDEC Registration TO-236, Variation AB, Issue H, Jan. 1999.  
† This dimension differs from the JEDEC drawing.  
Drawings not to scale.  
Supertex Doc.#: DSPD-3TO236ABK1, Version C041309.  
Doc.# DSFP-TN2106  
B080913  
Supertex inc.  
www.supertex.com  
5
TN2106  
3-Lead TO-92 Package Outline (N3)  
D
A
Seating  
Plane  
1
2
3
L
c
b
e1  
e
Side View  
Front View  
E
E1  
1
3
2
Bottom View  
Symbol  
A
.170  
-
b
.014†  
-
c
D
.175  
-
E
.125  
-
E1  
.080  
-
e
e1  
.045  
-
L
.500  
-
MIN  
NOM  
MAX  
.014†  
-
.095  
-
Dimensions  
(inches)  
.210  
.022†  
.022†  
.205  
.165  
.105  
.105  
.055  
.610*  
JEDEC Registration TO-92.  
* This dimension is not specified in the JEDEC drawing.  
† This dimension differs from the JEDEC drawing.  
Drawings not to scale.  
Supertex Doc.#: DSPD-3TO92N3, Version E041009.  
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline  
information go to http://www.supertex.com/packaging.html.)  
Supertex inc. does not recommend the use of its products in life support applications, and will not knowingly sell them for use in such applications unless it receives  
an adequate “product liability indemnification insurance agreement.” Supertex inc. does not assume responsibility for use of devices described, and limits its liability  
to the replacement of the devices determined defective due to workmanship. No responsibility is assumed for possible omissions and inaccuracies. Circuitry and  
specifications are subject to change without notice. For the latest product specifications refer to the Supertex inc. (website: http//www.supertex.com)  
©2013 Supertex inc.All rights reserved. Unauthorized use or reproduction is prohibited.  
Supertex inc.  
1235 Bordeaux Drive, Sunnyvale, CA 94089  
Tel: 408-222-8888  
www.supertex.com  
Doc.# DSFP-TN2106  
B080913  
6

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