USB2660I-JZX [MICROCHIP]
FLASH MEMORY DRIVE CONTROLLER, QCC64, 9 X 9 MM, ROHS COMPLIANT, QFN-64;![USB2660I-JZX](http://pdffile.icpdf.com/pdf2/p00296/img/icpdf/USB2660I-JZX_1793533_icpdf.jpg)
型号: | USB2660I-JZX |
厂家: | ![]() |
描述: | FLASH MEMORY DRIVE CONTROLLER, QCC64, 9 X 9 MM, ROHS COMPLIANT, QFN-64 外围集成电路 |
文件: | 总60页 (文件大小:757K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
USB2660/USB2660i
Ultra Fast USB 2.0 Hub and Multi-Format Flash Media Controller
with Dual SD Interfaces
General Description
Features
The Microchip USB2660/USB2660i is a USB 2.0 com-
pliant, Hi-Speed hub, card reader, and protocol con-
verter combo solution. This fully integrated single chip
solution provides USB expansion and flash card media
reader/writer integration. The Microchip USB2660/
USB2660i provides an ultra fast interface between a
USB host and today’s popular flash media formats. The
controller allows read/write capability to flash media
from the following families:
• Compliance with the following flash media card
specifications SD 2.0 / MMC 4.2 / MS 1.43 / MS-
Pro 1.02 / MS-Pro-HG 1.01 / MS-Duo 1.10 / xD
1.2
• Supports a single external 3.3 V supply source;
internal regulators provide 1.8 V internal core volt-
age for additional bill of materials and power sav-
ings
• The transaction translator (TT) in the hub sup-
ports operation of Full-Speed and Low-Speed
peripherals
- Secure DigitalTM (SD)
- MultiMediaCardTM (MMC)
- Memory Stick® (MS)
• 9 K RAM | 64 K on-chip ROM
- xD-Picture CardTM (xD)1
• Enhanced EMI rejection and ESD protection per-
formance
The USB2660/USB2660i offers a versatile, cost-effec-
tive, and energy-efficient hub controller with 2 down-
stream USB 2.0 ports. This combo solution leverages
Microchip’s innovative technology that delivers indus-
try-leading data throughput in mixed-speed USB envi-
ronments. Average sustained transfer rates exceeding
35 MB/s are possible2.
• Hub and flash media reader/writer configuration
from a single source: External I2C® ROM or exter-
nal SPI ROM
- Configures internal code using an external
I2C EEPROM
- Supports external code using an SPI Flash
EEPROM
- Customizable vendor ID, product ID, and lan-
guage ID if using an external EEPROM
Highlights
• 2 exposed Hi-Speed USB 2.0 downstream ports
for external peripheral expansion
• Additional SD port for card reader
• The dedicated flash media reader is internally
attached to a 3rd downstream port of the hub as a
USB Compound Device
• The USB2660i supports the industrial tempera-
ture range of -40°C to +85°C
• 64-pin QFN RoHS compliant package (9 x 9 mm)
- a single or multiplexed flash media reader
interface
- a non-multiplexed SD interface (slot) for SD
card reader
Applications
• Desktop and mobile PCs
• Printers
• PortMap - Flexible port mapping and port disable
sequencing supports multiple platform designs
• GPS navigation systems
• Media players/viewers
• Consumer A/V
• PortSwap - Programmable USB differential-pair
pin locations eases PCB design by aligning USB
signal traces directly to connectors
• Set-top boxes
• PHYBoost - Programmable USB transceiver
• Industrial products
drive strength recovers signal integrity
1.For xD-Picture CardTM support, please obtain a user
license from the xD-Picture Card License Office.
2.Host and media dependent.
2010-2019 Microchip Technology Inc.
DS00001931B-page 1
USB2660/USB2660i
TO OUR VALUED CUSTOMERS
It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip
products. To this end, we will continue to improve our publications to better suit your needs. Our publications will be refined and
enhanced as new volumes and updates are introduced.
If you have any questions or comments regarding this publication, please contact the Marketing Communications Department via
E-mail at docerrors@microchip.com. We welcome your feedback.
Most Current Data Sheet
To obtain the most up-to-date version of this data sheet, please register at our Worldwide Web site at:
http://www.microchip.com
You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page.
The last character of the literature number is the version number, (e.g., DS30000000A is version A of document DS30000000).
Errata
An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for cur-
rent devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the
revision of silicon and revision of document to which it applies.
To determine if an errata sheet exists for a particular device, please check with one of the following:
•
•
Microchip’s Worldwide Web site; http://www.microchip.com
Your local Microchip sales office (see last page)
When contacting a sales office, please specify which device, revision of silicon and data sheet (include -literature number) you are
using.
Customer Notification System
Register on our web site at www.microchip.com to receive the most current information on all of our products.
DS00001931B-page 2
2010-2019 Microchip Technology Inc.
USB2660/USB2660i
Table of Contents
1.0 Overview ......................................................................................................................................................................................... 4
2.0 Block Diagram ................................................................................................................................................................................. 6
3.0 Pin Configuration ............................................................................................................................................................................ 7
4.0 Pin Descriptions .............................................................................................................................................................................. 9
5.0 Pin Reset States ........................................................................................................................................................................... 19
6.0 Configuration Options ................................................................................................................................................................... 22
7.0 AC Specifications .......................................................................................................................................................................... 45
8.0 DC Parameters ............................................................................................................................................................................. 47
9.0 Package Specifications ................................................................................................................................................................. 52
Appendix A: Acronyms ........................................................................................................................................................................ 55
Appendix B: Data Sheet Revision History ........................................................................................................................................... 56
Product Identification System ............................................................................................................................................................. 57
The Microchip Web Site ...................................................................................................................................................................... 59
Customer Change Notification Service ............................................................................................................................................... 59
Customer Support ............................................................................................................................................................................... 59
2010-2019 Microchip Technology Inc.
DS00001931B-page 3
USB2660/USB2660i
1.0
OVERVIEW
The Microchip USB2660/USB2660i is an integrated USB 2.0 compliant, Hi-Speed hub, card reader, and protocol con-
verter combo solution. This combo solution supports today’s popular multi-format flash media cards. This multi-format
flash media controller and USB hub combo features two exposed downstream USB ports available for external periph-
eral expansion. The dedicated flash media reader/writer is internally attached to a third downstream port of the hub as
a USB Compound Device which supports the following two interfaces: One interface is multiplexed for xD-Picture Card,
Memory Stick, Secure Digital/MultiMediaCard, and SD/Secure Digital Input/Output. The other interface is dedicated to
a second SD card slot.
The USB2660/USB2660i will attach to an upstream port as a Full-Speed hub or as a Full-/Hi-Speed hub. The hub sup-
ports Low-Speed, Full-Speed, and Hi-Speed (if operating as a Hi-Speed hub) downstream devices on all of the enabled
downstream ports.
All required resistors on the USB ports are integrated into the hub. This includes all series termination resistors on D+
and D– pins and all required pull-down and pull-up resistors. The over-current sense inputs for the downstream facing
ports have internal pull-up resistors.
The USB2660/USB2660i includes programmable features such as:
PortMap which provides flexible port mapping and disable sequences. The downstream ports of a USB2660/USB2660i
hub can be reordered or disabled in any sequence to support multiple platform designs with minimum effort. For any
port that is disabled, the USB2660/USB2660i automatically reorders the remaining ports to match the USB host con-
troller’s port numbering scheme.
PortSwap which adds per-port programmability to USB differential-pair pin locations.
PortSwap allows direct alignment of USB signals (D+/D-) to connectors avoiding
uneven trace length or crossing of the USB differential signals on the PCB.
PHYBoost which enables four programmable levels of USB signal drive strengths in
downstream port transceivers. PHYBoost attempts to restore USB signal integrity. The
diagram on the right shows an example of Hi-Speed USB eye diagrams before (PHY-
Boost at 0%) and after (PHYBoost at 12%) signal integrity restoration in a compro-
mised system environment.
1.1
Hardware Features
• Single chip hub and flash media controller combo
• USB2660 supports the commercial temperature range of 0°C to +70°C
• USB2660i supports the industrial temperature range of -40°C to +85°C
• Transaction translator (TT) in the hub supports operation of FS and LS peripherals
• Full power management with individual or ganged power control of each downstream port
• Optional support for external firmware access via SPI interface
• Onboard 24 MHz crystal driver circuit
• Optional external 24 MHz clock input which must be a 1.8 V signal
• Code execution via SPI ROM which must meet
- 30 MHz or 60 MHz operation support
- Single bit or dual bit mode support
- Mode 0 or mode 3 SPI support
1.1.1
COMPLIANCE WITH THE FOLLOWING FLASH MEDIA CARD SPECIFICATIONS:
• Secure Digital 2.0 / MultiMediaCard 4.2
- SD 2.0, SD-HS, SD-HC
- TransFlash™ and reduced form factor media
- 1/4/8 bit MMC 4.2
• Memory Stick 1.43
• Memory Stick Pro Format 1.02
DS00001931B-page 4
2010-2019 Microchip Technology Inc.
USB2660/USB2660i
• Memory Stick Pro-HG Duo Format 1.01
- Memory Stick, MS Duo, MS-HS, MS Pro-HG, MS Pro
• Memory Stick Duo 1.10
• xD-Picture Card 1.2
• 8051 8-bit microprocessor
- 60 MHz - single cycle execution
- 64 KB ROM | 9 KB RAM
• Integrated regulator for 1.8 V core operation
1.2
Software Features
• Hub and flash media reader/writer configuration from a single source:
External I2C ROM or external SPI ROM
• If the OEM is using an external EEPROM or an external SPI ROM, the following features are available:
- Customizable vendor ID, product ID, and device ID
- 12-hex digits maximum for the serial number string
- 28-character manufacturer ID and product strings for the flash media reader/writer
1.3
OEM Selectable Hub Features
A default configuration is available in the USB2660/USB2660i following a reset. The USB2660/USB2660i may also be
configured by an external I2C EEPROM or via external SPI ROM flash.
• Compound Device support on a port-by-port basis
- a port is permanently hardwired to a downstream USB peripheral device
• Select over-current sensing and port power control on an individual or ganged (all ports together) basis to match
the OEM’s choice of circuit board component selection
• Port power control and over-current detection/delay features
• Configure the delay time for filtering the over-current sense inputs
• Configure the delay time for turning on downstream port power
• Bus- or self-powered selection
• Hub port disable or non-removable configurations
• Flexible port mapping and disable sequencing supports multiple platform designs
• Programmable USB differential-pair pin location eases PCB layout by aligning USB signal lines directly to connec-
tors
• Programmable USB signal drive strength recovers USB signal integrity using 4 levels of signal drive strength
• Indicate the maximum current that the 2-port hub consumes from the USB upstream port
• Indicate the maximum current required for the hub controller
2010-2019 Microchip Technology Inc.
DS00001931B-page 5
USB2660/USB2660i
2.0
BLOCK DIAGRAM
FIGURE 2-1:
USB2660/USB2660I BLOCK DIAGRAM
DS00001931B-page 6
2010-2019 Microchip Technology Inc.
USB2660/USB2660i
3.0
PIN CONFIGURATION
FIGURE 3-1:
USB2660/USB2660I 64-PIN QFN
SPI_CE_n
SPI_CLK / SCL
SD1_CMD / MS_D0 / xD_CLE
SD1_D5 / MS_D1 / xD_ALE
xD_nWE
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
SPI_DO / SDA / SPI_SPD_SEL
SPI_DI
SD1_CLK / MS_BS / xD_nWP
SD1_D6 / MS_D7 / xD_D0
SD1_D7 / MS_D6 / xD_D1
SD1_D0 / MS_D4 / xD_D2
SD1_D1 / MS_D5 / xD_D3
VDD33
LED / TXD
nRESET
VBUS_DET
TEST
USB2660/USB2660i
(Top View QFN-64)
VDD33
USBUP_DP
USBUP_DM
XTAL2
CRFILT
SD1_nCD
SD1_WP / MS_SCLK / xD_D4
SD2_D2
XTAL1 (CLKIN)
PLLFILT
SD2_D3
Ground Pad
(must be connected to VSS)
RBIAS
SD2_D4
VDD33
SD2_CMD
Indicates pins on the bottom of the device.
2010-2019 Microchip Technology Inc.
DS00001931B-page 7
USB2660/USB2660i
3.1
64-Pin Table
TABLE 3-1:
USB2660/USB2660I 64-PIN TABLE
SECURE DIGITAL / MEMORY STICK / xD INTERFACE (18 PINS)
SD1_D7 /
MS_D6 /
xD_D1
SD1_D6 /
MS_D7 /
xD_D0
SD1_D5 /
MS_D1 /
xD_ALE
SD1_D4 /
MS_D2 /
xD_D7
SD1_D3 /
MS_D3 /
xD_D6
SD1_D2 /
xD_D5
SD1_D1 /
MS_D5 /
xD_D3
SD1_D0 /
MS_D4 /
xD_D2
SD1_CLK /
MS_BS /
SD1_CMD /
MS_D0 /
SD1_nCD
MS_INS
xD_ nWP
xD_CLE
SD1_WP /
MS_SCLK /
xD_D4
xD_nCD
xD_nB/R
xD_nRE
xD_nCE
xD_nWE
SECOND SECURE DIGITAL INTERFACE (12 PINS)
SD2_D7
SD2_D3
SD2_D6
SD2_D2
SD2_CLK
SD2_D5
SD2_D1
SD2_D4
SD2_D0
SD2_W
SD2_NCD
SD2_CMD
USB INTERFACE (5 PINS)
USBUP_DP
RBIAS
USBUP_DM
XTAL1 (CLKIN)
XTAL2
PRTCTL3
SPI_DI
2-PORT USB INTERFACE (7 PINS)
USBDN_DP2
USBDN_DP3
USBDN_DM2
USBDN_DM3
PRTCTL2
VBUS_DET
SPI INTERFACE (4 PINS)
SPI_CE_n
SPI_CLK /
SCL
SPI_DO /
SDA /
SPI_SPD_SEL
MISC (8 PINS)
nRESET
TEST
LED
CRD_PWR2
CRD_PWR1
(3) NC
POWER (10 PINS)
(8) VDD33
CRFILT
PLLFILT
TOTAL 64
DS00001931B-page 8
2010-2019 Microchip Technology Inc.
USB2660/USB2660i
4.0
PIN DESCRIPTIONS
This section provides a detailed description of each signal. The signals are arranged in functional groups according to
their associated interface. The pin descriptions below are applied when using the internal default firmware and can be
referenced in Section 6.0, "Configuration Options," on page 22. Please reference Section Appendix A:, "Acronyms," on
page 55 for a list of the acronyms used.
The “n” symbol in the signal name indicates that the active, or asserted, state occurs when the signal is at a low voltage
level. When “n” is not present in the signal name, the signal is asserted at a high voltage level.
The terms assertion and negation are used exclusively. This is done to avoid confusion when working with a mixture of
“active low” and “active high” signals. The term assert, or assertion, indicates that a signal is active, independent of
whether that level is represented by a high or low voltage. The term negate, or negation, indicates that a signal is inac-
tive.
4.1
USB2660/USB2660i Pin Descriptions
TABLE 4-1:
Symbol
USB2660/USB2660I PIN DESCRIPTIONS
64-PIN Buffer Type
Description
QFN
(Table 4-2)
SECURE DIGITAL INTERFACE
SD1_D[7:0]
27
28
31
38
40
41
25
26
I/O8PU
Secure Digital Data 7-0
These are the bi-directional data signals SD_D0 - SD_D7 with weak
pull-up resistors.
SD1_CLK
SD1_CMD
29
O8
Secure Digital Clock
This is an output clock signal to the SD/MMC device.
Secure Digital Command
32
I/O8PU
This is a bi-directional signal that connects to the CMD signal of the
SD/MMC device. The bi-directional signal has a weak internal pull-up
resistor.
SD1_nCD
SD1_WP
22
21
I/O8PU
I/O8
Secure Digital Card Detect
Designates as the Secure Digital card detection pin and has an internal
pull-up.
Secure Digital Write Protected
Designates as the Secure Digital card mechanical write protect detect
pin.
SECOND SECURE DIGITAL INTERFACE
SD2_D[7:0]
11
12
16
18
19
20
9
I/O8PU
SD2 Data 7-0
These are the bi-directional data signals SD2_D0 - SD2_D7 and have
weak pull-up resistors.
10
SD2_CLK
13
O8
SD2 Clock
This is an output clock signal designated for to the SD2/MMC device.
2010-2019 Microchip Technology Inc.
DS00001931B-page 9
USB2660/USB2660i
TABLE 4-1:
Symbol
USB2660/USB2660I PIN DESCRIPTIONS (CONTINUED)
64-PIN Buffer Type
Description
QFN
(Table 4-2)
SD2_CMD
17
I/O8PU
SD2 Command
This is a bi-directional signal designated by for the CMD signal of the
SD2/MMC device. The bi-directional signal has a weak internal pull-up
resistor.
SD2_nCD
SD2_WP
8
I/O8
I/O8
SD2 Card Detect
Designates as the second Secure Digital card detection pin and has an
internal pull-up.
45
SD2 Write Protected
Designates as the second Secure Digital card interface mechanical
write detect pin.
MEMORY STICK INTERFACE
MS_BS
MS_INS
29
O8
Memory Stick Bus State
This pin is connected to the bus state pin of the MS device. It is used
to control the Bus States 0, 1, 2, and 3 (BS0, BS1, and BS3) of the MS
device.
39
21
IPU
Memory Stick Card Insertion
Designates as the Memory Stick card detection pin and has a weak
internal pull-up resistor.
MS_SCLK
MS_D[7:0]
O8
Memory Stick System Clock
This pin is an output clock signal to the MS device.
Memory Stick System Data In/Out
28
27
25
26
40
38
31
32
I/O8PD
These pins are the bi-directional data signals for the MS device. In serial
mode, the most significant bit (MSB) of each byte is transmitted first by
either MSC or MS device on MS_D0.
MS_D0, MS_D2, and MS_D3 have weak pull-down resistors. MS_D1
has a pull-down resistor if in parallel mode, otherwise it is disabled. In
4- or 8-bit parallel modes, all MS_D7 - MS_D0 signals have weak pull-
down resistors.
xD-PICTURE CARD INTERFACE
xD_D[7:0]
38
40
41
21
25
26
27
28
I/O8PD
xD-Picture Card Data 7-0
These pins are the bi-directional data signals xD_D7 - xD_D0 and have
weak internal pull-down resistors.
xD_ALE
31
O8PD
xD-Picture Card Address Strobe
This pin is an active high Address Latch Enable (ALE) signal for the xD
device. This pin has a weak pull-down resistor that is permanently
enabled.
DS00001931B-page 10
2010-2019 Microchip Technology Inc.
USB2660/USB2660i
TABLE 4-1:
Symbol
USB2660/USB2660I PIN DESCRIPTIONS (CONTINUED)
64-PIN Buffer Type
Description
QFN
(Table 4-2)
xD_nB/R
36
IPU
xD-Picture Card Busy or Data Ready
This pin is connected to the BSY/RDY pin of the xD-Picture Card
device.
When using the internal FET, this pin has an internal weak pull-up
resistor that is tied to the output of the internal power FET.
If an external FET is used (the internal FET is disabled), then the
internal pull-up is not available (an external pull-up is required).
xD_nCE
34
O8PU
xD-Picture Card Chip Enable
This pin is an active low chip enable signal for the xD-Picture Card
device.
When using the internal FET, this pin has an internal weak pull-up
resistor that is tied to the output of the internal power FET.
If an external FET is used (internal FET is disabled), then the internal
pull-up is not available (an external pull-up is required).
xD_CLE
32
O8PD
xD-Picture Card Command Strobe
This pin is an active high Command Latch Enable signal for the xD
device. This pin has a weak pull-down resistor that is permanently
enabled.
xD_nCD
xD_nRE
37
35
I/O8
xD-Picture Card Detection
Designates as the xD-Picture Card detection pin.
xD-Picture Card Read Enable
O8PU
This pin is an active low read strobe signal for the xD-Picture Card
device.
When using the internal FET, this pin has an internal weak pull-up
resistor that is tied to the output of the internal power FET.
If an external FET is used (internal FET is disabled), then the internal
pull-up is not available (an external pull-up is required).
xD_nWE
30
O8PU
xD-Picture Card Write Enable
This pin is an active low write strobe signal for the xD-Picture Card
device.
When using the internal FET, this pin has an internal weak pull-up
resistor that is tied to the output of the internal power FET.
If an external FET is used (internal FET is disabled), then the internal
pull-up is not available (an external pull-up is required).
xD_nWP
29
O8PD
xD-Picture Card Write Protect
This pin is an active low write protect signal for the xD-Picture Card
device. This pin has a weak pull-down resistor that is permanently
enabled.
2010-2019 Microchip Technology Inc.
DS00001931B-page 11
USB2660/USB2660i
TABLE 4-1:
Symbol
USB2660/USB2660I PIN DESCRIPTIONS (CONTINUED)
64-PIN Buffer Type
Description
QFN
(Table 4-2)
USB INTERFACE
USB Bus Data
USBUP_DM
USBUP_DP
59
58
I/O-U
These pins connect to the upstream USB bus data signals (host port or
upstream hub). USBUP_DM and USBUP_DP can be swapped using
the PortSwap feature (See Section 6.4.4.20, "F1h: Port Swap," on
page 38).
USBDN_DM
[3:2]
USBDN_DP
3
1
4
2
I/O-U
USB Bus Data
These pins connect to the downstream USB bus data signals and can
be swapped using the PortSwap feature (See Section 6.4.4.20, "F1h:
Port Swap," on page 38).
[3:2]
PRTCTL[3:2]
7
6
I/OD6
PU
USB Power Enable
As an output, these pins enable power to downstream USB peripheral
devices and have weak internal pull-up resistors. See Section 4.3, "Port
Power Control" for diagram and usage instructions.
As an input, when the power is enabled, these pins monitor the over-
current condition. When an over-current condition is detected, the pins
turn the power off.
VBUS_DET
55
I
Detect Upstream VBUS Power
Detects the state of upstream VBUS power. The hub monitors
VBUS_DET to determine when to assert the internal D+ pull-up resistor
(signaling a connect event).
When designing a detachable hub, connect this pin to the VBUS power
pin of the USB port that is upstream of the hub.
For self-powered applications with a permanently attached host, this pin
should be pulled up, typically to VDD33.
VBUS is a 3.3 volt input. A resistor divider must be used if connecting
to 5 volts of USB power.
RBIAS
XTAL1 (CLKIN)
XTAL2
63
61
60
I-R
USB Transceiver Bias
A 12.0 k, 1.0% resistor is attached from VSS to this pin in order to
set the transceiver's internal bias currents.
ICLKx
OCLKx
24 MHz Crystal Input or External Clock Input
This pin can be connected to one terminal of the crystal or it can be
connected to an external 24 MHz clock when a crystal is not used.
24 MHz Crystal Output
This is the other terminal of the crystal, or it is left open when an
external clock source is used to drive XTAL1(CLKIN).
SPI INTERFACE
SPI_CE_n
49
50
O12
SPI Chip Enable
This is the active low chip enable output. If the SPI interface is enabled,
this pin must be driven high in power down states.
SPI_CLK
SCL
I/O12
I/O6
This is the SPI clock out to the serial ROM. See Section 4.4, "ROM
BOOT Sequence" for diagram and usage instructions. During reset,
drive this pin low.
When configured, this is the I2C EEPROM clock pin.
DS00001931B-page 12
2010-2019 Microchip Technology Inc.
USB2660/USB2660i
TABLE 4-1:
Symbol
USB2660/USB2660I PIN DESCRIPTIONS (CONTINUED)
64-PIN Buffer Type
Description
QFN
(Table 4-2)
SPI_DO /
SDA /
51
I/O12
This is the data out for the SPI port. See Section 4.4, "ROM BOOT
Sequence" for diagram and usage instructions.
This pin is the data pin when the device is connected to the optional I2C
EEPROM.
I/O6
SPI_SPD_SEL
I/O12
This pin is used to select the speed of the SPI interface. During
nRESET assertion, this pin will be tri-stated with the weak pull-down
resistor enabled. When nRESET is negated, the value on the pin will be
internally latched, and the pin will revert to SPI_DO functionality, the
internal pull-down will be disabled.
‘0’ = 30 MHz (No external resistor should be applied.)
‘1’ = 60 MHz (A 10 K external pull-up resistor must be applied.)
If the latched value is '1', then the pin is tri-stated when the chip is in
the suspend state.
If the latched value is '0', then the pin is driven low during a suspend
state.
SPI_DI
LED
52
53
I/O12PD
This is the data in to the controller from the ROM. This pin has a weak
internal pull-down applied at all times to prevent floating.
MISC
I/O6
It can be used as an LED output.
NC
44
15
CRD_PWR2
I/O200
Card power drive: 3.3 V (100 mA or 200 mA)
This pin specifically powers the second Secure Digital interface (slot).
Please reference Section 6.4.5.9, "147h-14Bh: Device to LUN
Mapping," on page 42.
CRD_PWR1
REG_EN
43
I/O200
Card power drive: 3.3 V (100 mA or 200 mA)
This pin powers the multiplexed flash media interface (slot) for xD, MS,
and SD/MMC.
Please reference Section 6.4.2.3, "A4h-A5h: Smart Media Device
Power Configuration," on page 30.
IPU
REG_EN: This pin is internally pulled up to enable the internal 1.8 V
regulators.
In order to disable the regulators, this pin will need to be externally
connected to ground.
When the internal regulator is enabled, the
1.8 V power pins must be left unconnected, except for the required
bypass capacitors.
nRESET
TEST
54
56
IS
I
RESET Input
The system uses this active low signal reset the chip. The active low
pulse should be at least 1 s wide.
TEST Input
Tie this pin to ground for normal operation.
2010-2019 Microchip Technology Inc.
DS00001931B-page 13
USB2660/USB2660i
TABLE 4-1:
Symbol
USB2660/USB2660I PIN DESCRIPTIONS (CONTINUED)
64-PIN Buffer Type
Description
QFN
(Table 4-2)
DIGITAL / POWER / GROUND
CRFILT
PLLFILT
23
VDD Core Regulator Filter Capacitor
This pin requires a 1.0 F (or greater) 20% (ESR <0.1) capacitor to
VSS.
62
Phase-locked Loop Regulator Filter Capacitor
This pin requires 1.0 F (or greater) 20% (ESR <0.1) capacitor to
VSS.
VDD33
5
3.3 V Power and Regulator Input
14
24
33
42
47
57
64
Please refer to Section 8.0, "DC Parameters," on page 47 for more
information.
Pins 24 and 64 require external bypass capacitors of 4.7 F minimum.
VSS
NC
ePad
The ground pad is the only VSS for the device and must be tied to
ground with multiple vias.
46
48
No Connect pins
No trace or signal should be routed/attached to these pins.
DS00001931B-page 14
2010-2019 Microchip Technology Inc.
USB2660/USB2660i
4.2
Buffer Type Descriptions
TABLE 4-2:
Buffer
USB2660/USB2660I BUFFER TYPE DESCRIPTIONS
Description
I
Input.
IPU
Input with weak internal pull-up.
Input with Schmitt trigger.
IS
I/O6
I/OD6PU
O8
Input/output buffer with 6 mA sink and 6 mA source.
Input/open drain output buffer with a 6 mA sink.
Output buffer with an 8 mA sink and an 8 mA source.
O8PD
Output buffer with an 8 mA sink and an 8 mA source with a weak internal pull-
down resistor.
O8PU
Output buffer with an 8 mA sink and an 8 mA source with a weak internal pull-up
resistor.
I/O8
Input/output buffer with an 8 mA sink and an 8 mA source.
I/O8PD
Input/output buffer with an 8 mA sink and an 8 mA source with a weak internal
pull-down resistor.
I/O8PU
Input/output buffer with an 8 mA sink and an 8 mA source with a weak internal
pull-up resistor.
O12
Output buffer with a 12 mA sink and a 12 mA source.
Input/output buffer with 12 mA sink and 12 mA source.
I/O12
I/O12PD
Input/output buffer with 12 mA sink and 12 mA source with a weak internal pull-
down resistor.
I/O200
Input/output buffer 12 mA with FET disabled, 100/200 mA source only when the
FET is enabled.
ICLKx
OCLKx
I/O-U
I-R
XTAL clock input.
XTAL clock output.
Analog input/output as defined in the USB 2.0 Specification.
RBIAS.
4.3
Port Power Control
Port Power control using a USB Power Switch
The USB2660/USB2660i has a single port power control and over-current sense signal for each downstream port.
When disabling port power, the driver will actively drive a '0'. To avoid unnecessary power dissipation, the internal pull-
up resistor will be disabled at that time. When port power is enabled, the output driver is disabled, and the pull-up resistor
is enabled creating an open drain output.
If there is an over-current situation, the USB Power Switch will assert the open drain OCS signal. The Schmitt trigger
input will detect this event as a low. The open drain output does not interfere. The internal over-current sense filter han-
dles the transient conditions, such as low voltage, while the device is powering up.
2010-2019 Microchip Technology Inc.
DS00001931B-page 15
USB2660/USB2660i
FIGURE 4-1:
PORT POWER CONTROL WITH USB POWER SWITCH
5 V
PRTCTL3
OCS
USB Power
Switch
EN
USB
Device
USB2660/60i
5 V
PRTCTL2
OCS
USB Power
Switch
EN
USB
Device
4.3.1
PORT POWER CONTROL USING A POLY FUSE
When using the USB2660/USB2660i with a poly fuse, an external diode must be used (See Figure 4-2). When disabling
port power, the USB2660/USB2660i will drive a '0'. This procedure will have no effect since the external diode will isolate
the pin from the load. When port power is enabled, the USB2660/USB2660i output driver is disabled, and the pull-up
resistor is enabled which creates an open drain output. This open drain output condition means that the pull-up resistor
is providing 3.3 volts to the anode of the diode. If there is an over-current situation, the poly fuse will open. This will
cause the cathode of the diode to go to zero volts. The anode of the diode will be at 0.7 volts, and the Schmitt trigger
input will register this as a low resulting in an over-current detection. The open drain output does not interfere.
DS00001931B-page 16
2010-2019 Microchip Technology Inc.
USB2660/USB2660i
FIGURE 4-2:
PORT POWER CONTROL WITH A SINGLE POLY FUSE AND MULTIPLE LOADS
5 V
PRTCTL3
USB
Device
USB2660/60i
5V
PRTCTL2
USB
Device
When using a single poly fuse to power all devices, note that for the ganged situation, all power control pins must be
tied together.
FIGURE 4-3:
PORT POWER WITH GANGED CONTROL WITH POLY FUSE
5 V
PRTCTL3
Poly Fuse
USB2660/60i
USB
Device
USB
Device
PRTCTL2
2010-2019 Microchip Technology Inc.
DS00001931B-page 17
USB2660/USB2660i
4.4
ROM BOOT Sequence
After power-on reset, the internal firmware checks for an external SPI flash device that contains a valid signature of
"2DFU" (device firmware upgrade) beginning at address 0xFFFA. If a valid signature is found, then the external ROM
is enabled and code execution begins at address 0x0000 in the external SPI device. Otherwise, code execution contin-
ues from the internal ROM.
If there is no SPI ROM detected, the internal firmware then checks for the presence of an I2C ROM. The firmware looks
for the signature ‘ATA2’ at the offset of FCh-FFh and ‘ecf1’ at the offset of 17Ch-17Fh in the I2C ROM. The firmware
reads in the I2C ROM to configure the hardware and software internally. Please refer to Section 6.3.2, "EEPROM Data
Descriptor," on page 23 for the details of the configuration options.
The SPI ROM required for the USB2660/USB2660i is a recommended minimum of 1 Mbit and support either 30 MHz
or 60 MHz. The frequency used is set using the SPI_SPD_SEL. For 30 MHz operation, this pin must be pulled to ground
through a 100 k resistor. For 60 MHz operation, this pin must pulled up through a 100 k resistor.
The SPI_SPD_SEL pin is used to choose the speed of the SPI interface. During nRESET assertion, this pin will be tri-
stated with the weak pull-down resistor enabled. When nRESET is negated, the value on the pin will be internally
latched, and the pin will revert to SPI_DO functionality. The internal pull-down will be disabled.
The firmware can determine the speed of operation on the SPI port by checking the SPI_SPEED in the SPI_CTL register
(0x2400 - RESET = 0x02). Both 1- and 2-bit SPI operation is supported. For optimum throughput, a 2-bit SPI ROM is
recommended. Both mode 0 and mode 3 SPI ROMS are also supported.
FIGURE 4-4:
SPI ROM CONNECTION
SPI_CE_n
CE#
CLK
SPI_CLK / SCL
SPI ROM
USB2660/60i
SPI_DO / SDA / SPI_SPD_SEL
SPI_DI
SI
SO
2
FIGURE 4-5:
I C CONNECTION
3. 3V
10K
SCL
3. 3V
10K
I2C ROM
USB2660/60i
SDA
DS00001931B-page 18
2010-2019 Microchip Technology Inc.
USB2660/USB2660i
5.0
PIN RESET STATES
FIGURE 5-1:
PIN RESET STATES
Hardware
Firmware
Initialization
Operational
Voltage
Signal
RESET
(v)
RESET
VDD33
Time
(t)
VSS
TABLE 5-1:
Symbol
LEGEND FOR PIN RESET STATES TABLE
Description
0
Output driven low
1
Output driven high
IP
Input enabled
PU
PD
none
--
Hardware enables pull-up
Hardware enables pull-down
Hardware disables pad
Hardware disables function
Z
Hardware disables pad. Both output driver and
input buffers are disabled.
5.1
Pin Reset States
TABLE 5-2:
USB2660/USB2660I RESET STATES TABLE
Reset State
Input/
Output
Pin
1
Pin Name
USBDN_DM2
USBDN_DP2
USBDN_DM3
USBDN_DP3
PRTCTL2
Function
PU/PD
PD
PD
PD
PD
--
USBDN_DM2
USBDN_DP2
USBDN_DM3
USBDN_DP3
PRTCTL
IP
IP
IP
IP
0
2
3
4
6
7
PRTCTL3
PRTCTL
0
--
8
SD2_nCD
none
IP
Z
PU
--
9
SD2_D1
SD2_D1
2010-2019 Microchip Technology Inc.
DS00001931B-page 19
USB2660/USB2660i
TABLE 5-2:
USB2660/USB2660I RESET STATES TABLE (CONTINUED)
Reset State
Input/
Output
Pin
10
11
12
13
15
16
17
18
19
20
21
22
25
26
27
28
29
30
31
32
34
35
36
37
38
39
40
Pin Name
SD2_D0
Function
SD2_D0
SD2_D7
SD2_D6
SD2_CLK
none
PU/PD
--
Z
Z
Z
Z
Z
Z
Z
Z
Z
Z
0
SD2_D7
--
SD2_D6
--
SD2_CLK
--
CRD_PWR2
--
SD2_D5
SD2_D5
SD2_CMD
SD2_D4
SD2_D3
SD2_D2
none
--
SD2_CMD
--
SD2_D4
--
SD2_D3
--
SD2_D2
--
SD1_WP / MS_SCLK / xD_D4
SD1_nCD
--
none
IP
Z
Z
Z
Z
Z
Z
Z
Z
Z
Z
Z
IP
Z
IP
Z
PU
--
SD1_D1 / MS_D5 / xD_D3
SD1_D0 / MS_D4 / xD_D2
SD1_D7 / MS_D6 / xD_D1
SD1_D6 / MS_D7 / xD_D0
SD1_CLK / MS_BS / xD_nWP
xD_nWE
none
none
--
none
--
none
--
none
--
xD_nWE
none
--
SD1_D5 / MS_D1 / xD_ALE
SD1_CMD / MS_D0 / xD_CLE
xD_nCE
--
none
--
xD_nCE
xD_nRE
xD_nB/R
none
--
xD_nRE
--
xD_nB/R
--
xD_nCD
PU
--
SD1_D4 / MS_D2 / xD_D7
MS_INS
none
none
PU
--
SD1_D3 / MS_D3 / xD_D6
none
DS00001931B-page 20
2010-2019 Microchip Technology Inc.
USB2660/USB2660i
TABLE 5-2:
USB2660/USB2660I RESET STATES TABLE (CONTINUED)
Reset State
Input/
Output
Pin
41
43
44
45
49
50
51
52
53
54
55
56
58
59
Pin Name
SD1_D2 / xD_D5
CRD_PWR1
NC
Function
none
PU/PD
Z
Z
--
--
none
none
0
--
SD2_WP
none
0
--
SPI_CE_n
SPI_CE_n
none
1
--
SPI_CLK / SCL
SPI_DO / SDA / SPI_SPD_SEL
SPI_DI
0
--
none
0
--
SPI_DI
none
IP
0
PD
--
LED / TXD
nRESET
nRESET
VBUS_DET
TEST
IP
IP
IP
Z
--
VBUS_DET
TEST
--
PD
--
USBUP_DP
USBUP_DM
USBUP_DP
USBUP_DM
Z
--
2010-2019 Microchip Technology Inc.
DS00001931B-page 21
USB2660/USB2660i
6.0
6.1
CONFIGURATION OPTIONS
Hub
Microchip’s USB 2.0 hub is fully compliant to the Universal Serial Bus Specification available from the USB Imple-
menter’s Forum found at http://www.usb.org (Revision 2.0 April 27, 2000 and the 12/7/2000 and 5/28/2002 Errata).
Please reference Chapter 11 (Hub Specification) for general details regarding hub operation and functionality.
For performance reasons, the hub provides 1 transaction translator (TT) that is shared by both downstream ports
defined as a single-TT configuration. The TT contains 4 non-periodic buffers.
6.1.1
HUB CONFIGURATION OPTIONS
The Microchip hub supports a large number of features (some are mutually exclusive), and must be configured in order
to correctly function when attached to a USB host controller. There are two principal ways to configure the hub:
• via the internal default settings or
• by settings stored in an external EEPROM or SPI Flash device.
6.1.1.1
Power Switching Polarity
The hub will only support active high power controllers.
6.1.2
VBUS DETECT
According to Section 7.2.1 of the USB 2.0 Specification, a device cannot provide power to its D+ or D- pull-up resistors
unless the upstream port’s VBUS is in the asserted (powered) state. The VBUS_DET pin on the hub monitors the state
of the upstream VBUS signal and will not pull-up the D+ resistor if VBUS is not active. If VBUS goes from an active to
an inactive state (not powered), the hub will remove power from the D+ pull-up resistor within 10 seconds.
6.2
Card Reader
The Microchip USB2660/USB2660i is fully compliant with the following flash media card reader specifications:
• Secure Digital 2.0 / MultiMediaCard 4.2
- SD 2.0, HS-SD, HC-SD
- TransFlash™ and reduced form factor media
- 1/4/8 bit MMC 4.2
• Memory Stick 1.43
• Memory Stick Pro Format 1.02
• Memory Stick Pro-HG Duo Format 1.01
- Memory Stick, MS Duo, HS-MS, MS Pro-HG, MS Pro
• Memory Stick Duo 1.10
• xD-Picture Card 1.2
6.3
System Configurations
6.3.1
EEPROM/SPI INTERFACE
The USB2660/USB2660i can be configured via a 2-wire (I2C) EEPROM (512x8) or an external SPI flash device con-
taining the firmware for the USB2660/USB2660i. If an external configuration device does not exist the internal default
values will be used. If one of the external devices is used for configuration, the OEM can update the values through the
USB interface. The hub will then “attach” to the upstream USB host.
The USBDM tool set is available in the USB264x Hub Card reader combo software release package. To download the
software package from Microchip's website, please visit:
http://www.microchip.com/search/searchapp/searchhome.aspx?id=2&q=mkt/CW_SFT_PUB.nsf/Agree-
ments/OBJ+Hub+Card+Reader
to go to the OBJ Hub Card Reader Software Download Agreement. Review the license, and if you agree, check the "I
agree" box and then select “Confirm”. You will then be able to download USB264x Hub Card reader combo release
package zip file containing the USBDM tool set.
DS00001931B-page 22
2010-2019 Microchip Technology Inc.
USB2660/USB2660i
Please note that the following applies to the system values and descriptions when used:
• N/A = Not applicable to this part
• Reserved = For internal use
6.3.2
EEPROM DATA DESCRIPTOR
INTERNAL FLASH MEDIA CONTROLLER CONFIGURATIONS
TABLE 6-1:
Address
00h
Register Name
Description
Internal Default Value
USB_SER_LEN
USB Serial String
Descriptor Length
1Ah
01h
USB_SER_TYP
USB_SER_NUM
USB Serial String
Descriptor Type
03h
02h-19h
USB Serial Number
"000008264001"
(See Note 6-1)
1Ah-1Bh
1Ch-1Dh
1Eh
USB_VID
USB_PID
USB Vendor Identifier
USB Product Identifier
0424
4040
04h
USB_LANG_LEN
USB Language String Descriptor
Length
1Fh
20h
USB_LANG_TYP
USB_LANG_ID_LSB
USB_LANG_ID_MSB
USB_MFR_STR_LEN
USB_MFR_STR_TYP
USB_MFR_STR
USB Language String Descriptor
Type
03h
USB Language Identifier
Least Significant Byte
09h
(See Note 6-3)
21h
USB Language Identifier
Most Significant Byte
04h
(See Note 6-3)
22h
USB Manufacturer String
Descriptor Length
10h
03h
23h
USB Manufacturer String
Descriptor Type
24h-31h
USB Manufacturer String
“Generic”
(See Note 6-1)
32h-5Dh
5Eh
Reserved
-
00h
30h
USB_PRD_STR_LEN
USB Product String
Descriptor Length
5Fh
USB_PRD_STR_TYP
USB_PRD_STR
USB Product String
Descriptor Type
03h
60h-99h
USB Product String
"Ultra Fast Media Reader"
(See Note 6-1)
9Ah
9Bh
9Ch
9Dh
9Eh
9Fh
A0h
USB_BM_ATT
USB_MAX_PWR
ATT_LB
USB BmAttribute
USB Max Power
Attribute Lo byte
Attribute Hi Lo byte
Attribute Lo Hi byte
Attribute Hi byte
80h
30h (96 mA)
40h (Reverse SD_WP only)
ATT_HLB
80h (Reverse SD2_WP only)
ATT_LHB
00h
00h
00h
ATT_HB
MS_PWR_LB
Memory Stick Device
Power Lo byte
A1h
MS_PWR_HB
Memory Stick Device
Power Hi byte
0Ah
A2h-A3h
A4h
Not Applicable
SM_PWR_LB
-
00h
Smart Media Device
Power Lo byte
00h
(See Note 6-2)
A5h
SM_PWR_HB
Smart Media Device
Power Hi byte
0Ah
(See Note 6-2)
2010-2019 Microchip Technology Inc.
DS00001931B-page 23
USB2660/USB2660i
TABLE 6-1:
Address
A6h
INTERNAL FLASH MEDIA CONTROLLER CONFIGURATIONS (CONTINUED)
Register Name
Description
Internal Default Value
SD_PWR_LB
Secure Digital Device
Power Lo byte
00h
A7h
SD_PWR_HB
Secure Digital Device
Power Hi byte
0Ah
A8h
LED_BLK_INT
LED_BLK_DUR
DEV0_ID_STR
DEV1_ID_STR
DEV2_ID_STR
LED Blink Interval
02h
28h
A9h
LED Blink After Access
Device 0 Identifier String
Device 1 Identifier String
Device 2 Identifier String
AAh - B0h
B1h - B7h
B8h - BEh
N/A
“MS”
“SM”
(See Note 6-2)
BFh - C5h
C6h - CDh
CEh - D2h
D3h
DEV3_ID_STR
INQ_VEN_STR
INQ_PRD_STR
DYN_NUM_LUN
DEV_LUN_MAP
Reserved
Device 3 Identifier String
Inquiry Vendor String
Inquiry Product String
Dynamic Number of LUNs
Device to LUN Mapping
-
“SD/MMC”
“Generic”
82660
01h
D4h - D7h
D8h - DAh
DBh - DDh
FFh, 00h, 00h, 00h
00h, 06h, 0Dh
59h, 56h, 97h
Reserved
-
TABLE 6-2:
Address
HUB CONTROLLER CONFIGURATIONS
Register Name
Description
Internal Default Value
DEh
DFh
E0h
E1h
E2h
E3h
E4h
E5h
E6h
E7h
E8h
E9h
EAh
EBh
ECh
EDh
EEh
EFh
F0h
F1h
F2h
F3h
VID_LSB
VID_MSB
Vendor ID Least Significant Byte
Vendor ID Most Significant Byte
Product ID Least Significant Byte
Product ID Most Significant Byte
Device ID Least Significant Byte
Device ID Most Significant Byte
Configuration Data Byte 1
Configuration Data Byte 2
Configuration Data Byte 3
Non-Removable Devices
Port Disable (Self)
24h
04h
60h
26h
A1h
08h
8Bh
28h
00h
02h
00h
00h
01h
32h
01h
32h
32h
00h
00h
00h
00h
00h
PID_LSB
PID_MSB
DID_LSB
DID_MSB
CFG_DAT_BYT1
CFG_DAT_BYT2
CFG_DAT_BYT3
NR_DEVICE
PORT_DIS_SP
PORT_DIS_BP
MAX_PWR_SP
MAX_PWR_BP
HC_MAX_C_SP
HC_MAX_C_BP
PWR_ON_TIME
BOOST_UP
BOOST_3:0
PRT_SWP
Port Disable (Bus)
Max Power (Self)
Max Power (Bus)
Hub Controller Max Current (Self)
Hub Controller Max Current (Bus)
Power-on Time
Boost_Up
Boost_3:0
Port Swap
PRTM12
Port Map 12
PRTM3
Port Map 3
DS00001931B-page 24
2010-2019 Microchip Technology Inc.
USB2660/USB2660i
TABLE 6-3:
Address
OTHER INTERNAL CONFIGURATIONS
Register Name
Description
Internal Default Value
F4h
F5h
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
-
00h
66h
F6h
Reserved
00h
F7h
Reserved
00h
F8h-FAh
FBh
Reserved
59h, 56h, 97h
00h
Not Applicable
NVSTORE_SIG
FCh-FFh
Non-Volatile Storage Signature
“ATA2”
6.4
Set bit 7 of bmAttribute to enable the registers in Table 6-4.
TABLE 6-4:
Address
INTERNAL FLASH MEDIA CONTROLLER EXTENDED CONFIGURATIONS
Register Name
Description
Internal Default Value
100h - 106h
107h - 10Dh
10Eh - 114h
115h - 11Bh
11Ch - 122h
123h - 129h
12Ah-145h
CLUN0_ID_STR
CLUN1_ID_STR
CLUN2_ID_STR
CLUN3_ID_STR
CLUN4_ID_STR
DEV4_ID_STR
Not applicable
Combo LUN 0 Identifier String
Combo LUN 1 Identifier String
Combo LUN 2 Identifier String
Combo LUN 3 Identifier String
Combo LUN 4 Identifier String
Device 4 Identifier String
-
“COMBO”
“COMBO”
“COMBO”
“COMBO”
“COMBO”
"SD/MMC2"
00h
12Ah - 130h
131h - 137h
138h - 13Eh
13Fh - 145h
00h
00h
00h
00h
DYN_NUM_
EXT_LUN
146h
Dynamic Number of Extended LUNs
Device to LUN Mapping
01h
147h - 14Bh
14Ch
DEV_LUN_MAP
SD2_PWR_LB
01h, FFh, FFh, FFh, FFh
0Ah
Second Secure Digital
Power Lo byte-
14Dh
SD2_PWR_HB
Second Secure Digital
Power Hi byte
00h
14Eh-17Bh
Not Applicable
-
00h
17Ch-17Fh
NVSTORE_SIG2
Non-Volatile Storage Signature
“ecf1”
Note 6-1
This value is a UNICODE UTF-16LE encoded string value that meets the USB 2.0 specification
(Revision 2.0, 2000). Values in double quotations without this note are ASCII values.
Note 6-2
Note 6-3
A value of “SM” will be overridden with “xD” once an xD-Picture Card has been identified.
For a list of the most current 16-bit language ID’s defined by the USB-IF, please visit
http://www.unicode.org or consult The Unicode Standard, Worldwide Character Encoding, (Version
4.0), The Unicode Consortium, Addison-Wesley Publishing Company, Reading, Massachusetts.
2010-2019 Microchip Technology Inc.
DS00001931B-page 25
USB2660/USB2660i
6.4.1
EEPROM DATA DESCRIPTOR REGISTER DESCRIPTIONS
00h: USB Serial String Descriptor Length
6.4.1.1
Byte
Name
Description
0
USB_SER_LEN
USB serial string descriptor length as defined by Section 9.6.7 “String” of the
USB 2.0 Specification (Revision 2.0, 2000). This field is the “bLength” which
describes the size of the string descriptor (in bytes).
6.4.1.2
01h: USB Serial String Descriptor Type
Byte
Name
Description
1
USB_SER_TYP
USB serial string descriptor type as defined by Section 9.6.7 “String” of the
USB 2.0 Specification (Revision 2.0, 2000). This field is the “bDescriptorType”
which is a constant value associated with a string descriptor type.
6.4.1.3
02h-19h: USB Serial Number Option
Byte
25:2
Name
Description
Maximum string length is 12 hex digits. Must be unique to each device.
USB_SER_NUM
6.4.1.4
1Ah-1Bh: USB Vendor ID Option
Byte
Name
Description
1:0
USB_VID
This ID is unique for every vendor. The vendor ID is assigned by the USB
Implementer’s Forum.
6.4.1.5
1Ch-1Dh: USB Product ID Option
Byte
Name
Description
This ID is unique for every product. The product ID is assigned by the vendor.
1:0
USB_PID
6.4.1.6
1Eh: USB Language Identifier Descriptor Length
Byte
Name
Description
0
USB_LANG_LEN USB language ID string descriptor length as defined by Section 9.6.7 “String”
of the USB 2.0 Specification (Revision 2.0, 2000). This field is the “bLength”
which describes the size of the string descriptor (in bytes).
6.4.1.7
1Fh: USB Language Identifier Descriptor Type
Byte
Name
Description
1
USB_LANG_TYP USB language ID string descriptor type as defined by Section 9.6.7 “String” of
the USB 2.0 Specification (Revision 2.0, 2000). This field is the
“bDescriptorType” which is a constant value associated with a string descriptor
type.
6.4.1.8
20h: USB Language Identifier Least Significant Byte
Byte
Name
Description
2
USB_LANG_ID
_LSB
English language code = ‘0409’. See Note 6-3 to reference additional language
ID’s defined by the USB-IF.
DS00001931B-page 26
2010-2019 Microchip Technology Inc.
USB2660/USB2660i
6.4.1.9
Byte
21h: USB Language Identifier Most Significant Byte
Name
Description
3
USB_LANG_ID
_MSB
English language code = ‘0409’. See Note 6-3 to reference additional language
ID’s defined by the USB-IF.
6.4.1.10
22h: USB Manufacturer String Descriptor Length
Byte
Name
Description
0
USB_MFR_STR
_LEN
USB manufacturer string descriptor length as defined by Section 9.6.7 “String”
of the USB 2.0 Specification (Revision 2.0, 2000). This field is the “bLength”
which describes the size of the string descriptor (in bytes).
6.4.1.11
23h: USB Manufacturer String Descriptor Type
Byte
Name
Description
1
USB_MFR_STR
_TYP
USB manufacturer string descriptor type as defined by Section 9.6.7 “String” of
the USB 2.0 Specification (Revision 2.0, 2000). This field is the
“bDescriptorType” which is a constant value associated with a string descriptor
type.
6.4.1.12
24h-31h: USB Manufacturer String Option
Byte
Name
Description
15:2
USB_MFR_STR
The maximum string length is 28 characters.
6.4.1.13
32h-5Dh: Reserved
Byte
Name
Description
59:16
Reserved
Reserved.
6.4.1.14
5Eh: USB Product String Descriptor Length
Byte
Name
Description
0
USB_PRD_STR
_LEN
USB product string descriptor length as defined by Section 9.6.7 “String” of the
USB 2.0 Specification (Revision 2.0, 2000). This field is the “bLength” which
describes the size of the string descriptor (in bytes).
6.4.1.15
5Fh: USB Product String Descriptor Type
Byte
Name
Description
1
USB_PRD_STR
_TYP
USB product string descriptor type as defined by Section 9.6.7 “String” of the
USB 2.0 Specification (Revision 2.0, 2000). This field is the “bDescriptorType”
which is a constant value associated with a string descriptor type.
6.4.1.16
60h-99h: USB Product String Option
Byte
Name
Description
59:2
USB_PRD_STR
This string will be used during the USB enumeration process in the Windows®
operating system. Maximum string length is 28 characters.
2010-2019 Microchip Technology Inc.
DS00001931B-page 27
USB2660/USB2660i
6.4.1.17
9Ah: USB BmAttribute (1 byte)
Bit
Name
Description
7:0
USB_BM_ATT
Self- or Bus-Power: Selects between self- and bus-powered operation.
The hub is either self-powered (draws less than 2 mA of upstream bus power)
or bus-powered (limited to a 100 mA maximum of upstream power prior to
being configured by the host controller).
When configured as a bus-powered device, the Microchip hub consumes less
than 100 mA of current prior to being configured. After configuration, the bus-
powered Microchip hub (along with all associated hub circuitry, any embedded
devices if part of a compound device, and 100 mA per externally available
downstream port) must consume no more than 500 mA of upstream VBUS
current. The current consumption is system dependent, and the OEM must
ensure that the USB 2.0 Specification is not violated.
When configured as a self-powered device, <1 mA of upstream VBUS current
is consumed and all ports are available, with each port being capable of
sourcing 500 mA of current.
80 = Bus-powered operation (default)
C0 = Self-powered operation
A0 = Bus-powered operation with remote wake-up
E0 = Self-powered operation with remote wake-up
6.4.1.18
9Bh: USB MaxPower (1 byte)
Bit
Name
Description
7:0
USB_MAX_PWR
USB Max Power per the USB 2.0 Specification. Do NOT set this value greater
than 100 mA.
DS00001931B-page 28
2010-2019 Microchip Technology Inc.
USB2660/USB2660i
6.4.1.19
9Ch-9Fh: Attribute Byte Descriptions
Byte
Byte Name
Bit
Description
0
ATT_LB
3:0
4
Always reads ‘0’.
Inquire Manufacturer and Product ID Strings
‘1’ - Use the Inquiry Manufacturer and Product ID Strings.
‘0’ (default) - Use the USB Descriptor Manufacturer and Product ID Strings.
Always reads ‘0’.
5
6
Reverse SD Card Write Protect Sense
‘1’ (default) - SD cards will be write protected when SW_nWP is high, and
writable when SW_nWP is low.
‘0’ - SD cards will be write protected when SW_nWP is low, and writable
when SW_nWP is high.
7
Extended Configuration Enable
'1' - This bit must be set to '1' to enable editing, updating, and reading from
registers 100h-17Fh.
'0' - The internal configuration is loaded. When this bit is not set (and it
equals '0'). It will not read from registers 100h-17Fh.
1
ATT_HLB
3:0
4
Always reads ‘0’.
Activity LED True Polarity
‘1’ - Activity LED to Low True.
‘0’ (default) - Activity LED polarity to High True.
Common Media Insert / Media Activity LED
5
‘1’ - The activity LED will function as a common media inserted/media access
LED.
‘0’ (default) - The activity LED will remain in its idle state until media is
accessed.
6
7
Always reads ‘0’.
Reverse SD2 Card Write Protect Sense
‘1’ (default) - SD cards in LUN 1 will be write protected when SW_nWP is
high, and writable when SW_nWP is low.
‘0’ - SD cards in LUN 1 will be write protected when SW_nWP is low, and
writable when SW_nWP is high.
2
ATT_LHB
0
Attach on Card Insert / Detach on Card Removal
‘1’ - Attach on Insert is enabled.
‘0’ (default) - Attach on Insert is disabled.
Always reads ‘0’.
1
2
Enable Device Power Configuration
‘1’ - Custom Device Power Configuration stored in the NVSTORE is used.
‘0’ (default) - Default Device Power Configuration is used.
7:3
6:0
7
Always reads ‘0’.
Always reads ‘0’.
xD Player Mode
3
ATT_HB
2010-2019 Microchip Technology Inc.
DS00001931B-page 29
USB2660/USB2660i
6.4.2
A0H-A7H: DEVICE POWER CONFIGURATION
The USB2660/USB2660i has two internal FETs which can be utilized for card power. For information about the other
internal FET, please see Section 6.4.5.10, "14Ch-14Dh: Second Secure Digital Device Power Configuration," on
page 42. This section describes the default internal configuration. The settings are stored in NVSTORE and provide the
following features:
1. A card can be powered by an external FET or by an internal FET.
2. The power limit can be set to 100 mA or 200 mA (Default) for the internal FET.
Each media uses two bytes to store its device power configuration. Bit 3 selects between internal or external card power
FET options. For internal FET card power control, bits 0 through 2 are used to set the power limit. The “Device Power
Configuration” bits are ignored unless the “Enable Device Power Configuration” bit is set. See Section 6.4.1.19, "9Ch-
9Fh: Attribute Byte Descriptions," on page 29.
6.4.2.1
A0h-A1h: Memory Stick Device Power Configuration
FET
Type
Bits
Bit Type
Low Nibble
Description
0
1
2
FET Lo Byte
MS_PWR_LB
3:0
7:4
3:0
0000b Disabled
0000b Disabled
High Nibble
FET Hi Byte
MS_PWR_HB
Low Nibble
0001b External FET enabled
1000b Internal FET with 100 mA power limit
1010b Internal FET with 200 mA power limit
3
7:4
High Nibble
0000b Disabled
6.4.2.2
A2h-A3h: Not Applicable
Byte
1:0
Name
Description
Not Applicable
Not applicable.
6.4.2.3
A4h-A5h: Smart Media Device Power Configuration
FET
Type
Bits
Bit Type
Low Nibble
Description
0
1
2
FET Lo Byte
SM_PWR_LB
3:0
7:4
3:0
0000b Disabled
0000b Disabled
High Nibble
FET Hi Byte
SM_PWR_HB
Low Nibble
0001b External FET enabled
1000b Internal FET with 100 mA power limit
1010b Internal FET with 200 mA power limit
3
7:4
High Nibble
0000b Disabled
6.4.2.4
A6h-A7h: Secure Digital Device Power Configuration
FET
Type
Bits
Bit Type
Low Nibble
Description
0
1
2
FET Lo Byte
SD_PWR_LB
3:0
7:4
3:0
0000b Disabled
0000b Disabled
High Nibble
FET Hi Byte
SD_PWR_HB
Low Nibble
0001b External FET enabled
1000b Internal FET with 100 mA power limit
1010b Internal FET with 200 mA power limit
3
7:4
High Nibble
0000b Disabled
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2010-2019 Microchip Technology Inc.
USB2660/USB2660i
6.4.2.5
Byte
A8h: LED Blink Interval
Name
Description
0
LED_BLK_INT
The blink rate is programmable in 50 ms intervals. The high bit (7) indicates
an idle state:
‘0’ - Off
‘1’ - On
The remaining bits (6:0) are used to determine the blink interval up to a max
of 128 x 50 ms.
6.4.2.6
A9h: LED Blink Duration
Byte
Name
Description
1
LED_BLK_DUR
LED Blink After Access. This byte is used to designate the number of seconds
that the LED will continue to blink after a drive access. Setting this byte to "05"
will cause the LED to blink for 5 seconds after a drive access.
6.4.3
DEVICE ID STRINGS
These bytes are used to specify the LUN descriptor returned by the device. These bytes are used in combination with
the device to LUN mapping bytes in applications where the OEM wishes to reorder and rename the LUNs. If multiple
devices are mapped to the same LUN (a COMBO LUN), then the CLUN#_ID_STR will be used to name the COMBO
LUN instead of the individual device strings. When applicable, the "SM" value will be overridden with xD once an xD-
Picture Card has been identified.
6.4.3.1
AAh-B0h: Device 0 Identifier String
Byte
6:0
Name
Description
Description
DEV0_ID_STR
Not applicable.
6.4.3.2
B1h-B7h: Device 1 Identifier String
Byte
Name
6:0
DEV1_ID_STR
This ID string is associated with the Memory Stick device.
6.4.3.3
B8h-BEh: Device 2 Identifier String
Byte
Name
Description
This ID string is associated with the Smart Media (Note 6-2) device.
6:0
DEV2_ID_STR
6.4.3.4
BFh-C5h: Device 3 Identifier String
Byte
Name
Description
This ID string is associated with the Secure Digital / MultiMediaCard device.
6:0
DEV3_ID_STR
6.4.3.5
C6h-CDh: Inquiry Vendor String
Byte
Name
Description
7:0
INQ_VEN_STR
If bit 4 of the 1st attribute byte is set, the device will use these strings in
response to a USB inquiry command, instead of the USB descriptor
manufacturer and product ID strings.
2010-2019 Microchip Technology Inc.
DS00001931B-page 31
USB2660/USB2660i
6.4.3.6
CEh-D2h: Inquiry Product String
Byte
4:0
Name
Description
INQ_PRD_STR
If bit 4 of the 1st attribute byte is set, the device will use these strings in
response to a USB inquiry command, instead of the USB descriptor
manufacturer and product ID strings.
6.4.3.7
D3h: Dynamic Number of LUNs
Byte
Name
Description
7:0
DYN_NUM_LUN
These bytes are used to specify the number of LUNs the device exposes to
the host. These bytes are also used for icon sharing by assigning more than
one LUN to a single icon. This is used in applications where the device utilizes
a combo socket and the OEM wishes to have only a single icon displayed for
one or more interfaces.
If this field is set to "FF", the program assumes that you are using the default
value and icons will be configured per the default configuration.
6.4.3.8
D4h-D7h: Device to LUN Mapping
Byte
Name
Description
3:0
DEV_LUN_MAP
These registers map a device controller (SD/MMC, SM (Note 6-2), and MS)
to a Logical Unit Number (LUN). The device reports the mapped LUNs to the
USB host in the USB descriptor during enumeration. The icon installer
associates custom icons with the LUNs specified in these fields.
Setting a register to "FF" indicates that the device is not mapped. Setting all
of the DEV_LUN_MAP registers for all devices to "FF" forces the use of the
default mapping configuration. Not all configurations are valid. Valid
configurations depend on the hardware, packaging, and OEM board layout.
The number of unique LUNs mapped must match the value in the Section
6.4.3.7, "D3h: Dynamic Number of LUNs," on page 32.
6.4.3.9
D8h-DDh: Reserved
Byte
Name
Description
2:0
Reserved
Reserved.
6.4.4
6.4.4.1
HUB CONTROLLER CONFIGURATIONS
DEh: Vendor ID (LSB)
Bit
7:0
Byte Name
Description
VID_LSB
Least Significant Byte of the Vendor ID. This is a 16-bit value that uniquely
identifies the vendor of the user device (assigned by USB Implementer’s
Forum).
6.4.4.2
DFh: Vendor ID (MSB)
Bit
Byte Name
Description
7:0
VID_MSB
Most Significant Byte of the Vendor ID. This is a 16-bit value that uniquely
identifies the vendor of the user device (assigned by USB Implementer’s
Forum).
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USB2660/USB2660i
6.4.4.3
E0h: Product ID (LSB)
Bit
Name
Description
7:0
PID_LSB
Least Significant Byte of the Product ID. This is a 16-bit value that the vendor
can assign that uniquely identifies this particular product.
6.4.4.4
E1h: Product ID (MSB)
Bit
Name
Description
7:0
PID_MSB
Most Significant Byte of the Product ID. This is a 16-bit value that the vendor
can assign that uniquely identifies this particular product.
6.4.4.5
E2h: Device ID (LSB)
Bit
Name
Description
7:0
DID_LSB
Least Significant Byte of the Device ID. This is a 16-bit device release number
in BCD (binary coded decimal) format.
6.4.4.6
E3h: Device ID (MSB)
Bit
Name
Description
7:0
DID_MSB
Most Significant Byte of the Device ID. This is a 16-bit device release number
in BCD format.
6.4.4.7
E4h: Configuration Data Byte 1 (CFG_DAT_BYT1)
Bit
Name
Description
7
SELF_BUS_PWR
Self- or Bus-Power: Selects between self- and bus-powered operation.
The hub is either self-powered (draws less than 2 mA of upstream bus power)
or bus-powered (limited to a 100 mA maximum of upstream power prior to
being configured by the host controller).
When configured as a bus-powered device, the Microchip hub consumes less
than 100 mA of current prior to being configured. After configuration, the bus-
powered Microchip hub (along with all associated hub circuitry, any embedded
devices if part of a compound device, and 100 mA per externally available
downstream port) must consume no more than 500 mA of upstream VBUS
current. The current consumption is system dependent, and the OEM must
ensure that the USB 2.0 specifications are not violated.
When configured as a self-powered device, <1 mA of upstream VBUS current
is consumed and all ports are available, with each port being capable of
sourcing 500 mA of current.
‘0’ = Bus-powered operation
‘1’ = Self-powered operation
6
5
Reserved
Reserved
HS_DISABLE
Hi-Speed Disable: Disables the capability to attach as either a Hi-/Full-Speed
device, and forces attachment as Full-Speed only (i.e. no Hi-Speed support).
‘0’ = Hi-/Full-Speed
‘1’ = Full-Speed-Only (Hi-Speed disabled!)
4
Reserved
Reserved
2010-2019 Microchip Technology Inc.
DS00001931B-page 33
USB2660/USB2660i
Bit
Name
Description
3
EOP_DISABLE
EOP Disable: Disables EOP generation of EOF1 when in Full-Speed mode.
During FS operation only, this permits the hub to send EOP if no downstream
traffic is detected at EOF1. See Section 11.3.1 of the USB 2.0 Specification
for additional details.
‘0’ = An EOP is generated at the EOF1 point if no traffic is detected.
‘1’ = EOP generation at EOF1 is disabled (normal USB operation).
Note:
Generation of an EOP at the EOF1 point may prevent a host
controller (operating in FS mode) from placing the USB bus in
suspend.
2:1
CURRENT_SNS
Over-Current Sense: Selects current sensing on a port-by-port basis, all ports
ganged, or none (only for bus-powered hubs). The ability to support current
sensing on a per port or ganged basis is dependent upon the hardware
implementation.
‘00’ = Ganged sensing (all ports together)
‘01’ = Individual (port-by-port)
‘1x’ = Over-current sensing not supported (must only be used with bus-
powered configurations!)
0
PORT_PWR
Port Power Switching: Enables power switching on all ports simultaneously
(ganged), or port power is individually switched on and off on a port-by-port
basis (individual). The ability to support power enabling on a port or ganged
basis is dependent upon the hardware implementation.
‘0’ = Ganged switching (all ports together)
‘1’ = Individual port-by-port switching
6.4.4.8
E5h: Configuration Data Byte 2 (CFG_DAT_BYT2)
Bit
Name
Description
7:6
5:4
Reserved
Reserved
OC_TIMER
OverCurrent Timer: Over-current timer delay.
‘00’ = 50 ns
‘01’ = 100 ns
‘10’ = 200 ns
‘11’ = 400 ns
3
COMPOUND
Compound Device: Allows OEM to indicate that the hub is part of a compound
device (per the USB 2.0 Specification). The applicable port(s) must also be
defined as having a “non-removable device”.
Note:
When configured via strapping options, declaring a port as non-
removable automatically causes the hub controller to report that it is
part of a compound device.
‘0’ = No
‘1’ = Yes, the hub is part of a compound device
2:0
Reserved
Reserved
DS00001931B-page 34
2010-2019 Microchip Technology Inc.
USB2660/USB2660i
6.4.4.9
Bit
E6h: Configuration Data Byte 3 (CFG_DAT_BYT3)
Name
Description
7:4
3
Reserved
Reserved
PRTMAP_EN
Port Mapping Enable: Selects the method used by the hub to assign port
numbers and disable ports.
‘0’ = Standard Mode. Strap options or the following registers are used to define
which ports are enabled, and the ports are mapped as port ‘n’ on the hub is
reported as port ‘n’ to the host, unless one of the ports is disabled, then the
higher numbered ports are remapped in order to report contiguous port
numbers to the host.
Register 300Ah: Port disable for self-powered operation (Reset = 0x00).
Register 300Bh: Port disable for bus-powered operation (Reset = 0x00).
‘1’ = Port Map mode. The mode enables remapping via the registers defined
below.
Register 30FBh: Port Map 12 (Reset = 0x00)
Register 30FCh: Port Map 3 (Reset = 0x00)
2:0
Reserved
Reserved
6.4.4.10
E7h: Non-Removable Device
Bit
Byte Name
Description
7:0
NR_DEVICE
Indicates which port(s) include non-removable devices.
‘0’ = Port is removable
‘1’ = Port is non-removable
Informs the host if one of the active ports has a permanent device that is
undetachable from the hub. The device must provide its own descriptor data.
When using the internal default option, the NON_REM[1:0] pins will designate
the appropriate ports as being non-removable.
Bit 7= Reserved
Bit 6= Reserved
Bit 5= Reserved
Bit 4= Reserved
Bit 3= Controls physical port 3
Bit 2= Controls physical port 2
Bit 1= Controls physical port 1
Bit 0= Reserved
Note:
Bit 1 must be set to a ‘1’ by the firmware for proper identification of
the card reader as a non-removable device.
2010-2019 Microchip Technology Inc.
DS00001931B-page 35
USB2660/USB2660i
6.4.4.11
E8h: Port Disable For Self-Powered Operation
Bit
Byte Name
Description
7:0
PORT_DIS_SP
Disables 1 or more ports.
‘0’ = Port is available
‘1’ = Port is disabled
During self-powered operation this register selects the ports which will be
permanently disabled. The ports are unavailable to be enabled or enumerated
by a host controller. The ports can be disabled in any order since the internal
logic will automatically report the correct number of enabled ports to the USB
host and will reorder the active ports in order to ensure proper function.
Bit 7= Reserved
Bit 6= Reserved
Bit 5= Reserved
Bit 4= Reserved
Bit 3= Controls physical port 3
Bit 2= Controls physical port 2
Bit 1= Controls physical port 1
Bit 0= Reserved
6.4.4.12
E9h: Port Disable For Bus-Powered Operation
Bit
Byte Name
Description
7:0
PORT_DIS_BP
Disables 1 or more ports.
‘0’ = Port is available
‘1’ = Port is disabled
During self-powered operation, this register selects the ports which will be
permanently disabled. The ports are unavailable to be enabled or enumerated
by a host controller. The ports can be disabled in any order, the internal logic
will automatically report the correct number of enabled ports to the USB host
and will reorder the active ports in order to ensure proper function.
When using the internal default option, the PRT_DIS[1:0] pins will disable the
appropriate ports.
Bit 7= Reserved
Bit 6= Reserved
Bit 5= Reserved
Bit 4= Reserved
Bit 3= Controls physical port 3
Bit 2= Controls physical port 2
Bit 1= Controls physical port 1
Bit 0 is Reserved
6.4.4.13
EAh: Max Power For Self-Powered Operation
Bit
Byte Name
Description
7:0
MAX_PWR_SP
Value in 2 mA increments that the hub consumes from an upstream port
(VBUS) when operating as a self-powered hub. This value includes the hub
silicon along with the combined power consumption (from VBUS) of all
associated circuitry on the board. This value also includes the power
consumption of a permanently attached peripheral if the hub is configured as
a compound device, and the embedded peripheral reports 0 mA in its
descriptors.
Note:
The USB 2.0 Specification does not permit this value to exceed 100
mA.
DS00001931B-page 36
2010-2019 Microchip Technology Inc.
USB2660/USB2660i
6.4.4.14
EBh: Max Power For Bus-Powered Operation
Bit
Byte Name
Description
7:0
MAX_PWR_BP
Value in 2 mA increments that the hub consumes from an upstream port
(VBUS) when operating as a bus-powered hub. This value includes the hub
silicon along with the combined power consumption (from VBUS) of all
associated circuitry on the board. This value also includes the power
consumption of a permanently attached peripheral if the hub is configured as
a compound device, and the embedded peripheral reports 0 mA in its
descriptors.
6.4.4.15
ECh: Hub Controller Max Current For Self-Powered Operation
Bit
Byte Name
Description
7:0
HC_MAX_C_SP
Value in 2 mA increments that the hub consumes from an upstream port
(VBUS) when operating as a self-powered hub. This value includes the hub
silicon along with the combined power consumption (from VBUS) of all
associated circuitry on the board. This value does NOT include the power
consumption of a permanently attached peripheral if the hub is configured as
a compound device.
Note:
The USB 2.0 Specification does not permit this value to exceed 100
mA.
A value of 50 (decimal) indicates 100 mA, which is the default value.
EDh: Hub Controller Max Current For Bus-Powered Operation
6.4.4.16
Bit
Byte Name
Description
7:0
HC_MAX_C_BP
Value in 2 mA increments that the hub consumes from an upstream port
(VBUS) when operating as a bus-powered hub. This value will include the hub
silicon along with the combined power consumption (from VBUS) of all
associated circuitry on the board. This value will NOT include the power
consumption of a permanently attached peripheral if the hub is configured as
a compound device.
A value of 50 (decimal) would indicate 100 mA, which is the default value.
6.4.4.17
EEh: Power-On Time
Bit
Byte Name
Description
7:0
PWR_ON_TIME
The length of time that it takes (in 2 ms intervals) from the time the host
initiated power-on sequence begins on a port until power is adequate on that
port. If the host requests the power-on time, the system software uses this
value to determine how long to wait before accessing a powered-on port.
2010-2019 Microchip Technology Inc.
DS00001931B-page 37
USB2660/USB2660i
6.4.4.18
EFh: Boost_Up
Bit
Name
Description
7:2
1:0
Reserved
Reserved
BOOST_IOUT
USB electrical signaling drive strength boost bit for the upstream port ‘A’.
‘00’ = Normal electrical drive strength = No boost
‘01’ = Elevated electrical drive strength = Low (approximately 4% boost)
‘10’ = Elevated electrical drive strength = Medium (approximately 8% boost)
‘11’ = Elevated electrical drive strength = High (approximately 12% boost)
Note:
“Boost” could result in non-USB compliant parameters. OEM should
use a ‘00’ value unless specific implementation issues require
additional signal boosting to correct for degraded USB signaling
levels.
6.4.4.19
F0h: Boost_3:0
Bit
Name
Description
7:6
5:4
Reserved
Reserved
BOOST_IOUT_3
Upstream USB electrical signaling drive strength boost bit for downstream
port ‘3’.
‘00’ = Normal electrical drive strength = No boost
‘01’ = Elevated electrical drive strength = Low (approximately 4% boost)
‘10’ = Elevated electrical drive strength = Medium (approximately 8% boost)
‘11’ = Elevated electrical drive strength = High (approximately 12% boost)
3:2
BOOST_IOUT_2
Upstream USB electrical signaling drive strength boost bit for downstream
port ‘2’.
‘00’ = Normal electrical drive strength = No boost
‘01’ = Elevated electrical drive strength = Low (approximately 4% boost)
‘10’ = Elevated electrical drive strength = Medium (approximately 8% boost)
‘11’ = Elevated electrical drive strength = High (approximately 12% boost)
Note:
“Boost” could result in non-USB Compliant parameters. OEM should
use a ‘00’ value unless specific implementation issues require
additional signal boosting to correct for degraded USB signaling
levels.
1:0
Reserved
Always reads ‘0’.
6.4.4.20
F1h: Port Swap
Bit
Byte Name
Description
7:0
PRT_SWP
Swaps the upstream and downstream USB DP and DM pins for ease of board
routing to devices and connectors.
‘0’ = USB D+ functionality is associated with the DP pin and D- functionality
is associated with the DM pin.
‘1’ = USB D+ functionality is associated with the DM pin and D- functionality
is associated with the DP pin.
Bit 7= Reserved
Bit 6= Reserved
Bit 5= Reserved
Bit 4= Reserved
Bit 3= Controls physical port 3
Bit 2= Controls physical port 2
Bit 1= Reserved
Bit 0= Controls physical port 0
DS00001931B-page 38
2010-2019 Microchip Technology Inc.
USB2660/USB2660i
6.4.4.21
F2h: Port Map 12
Bit
Byte Name
Description
7:0
PRTM12
PortMap register for ports 1 & 2
When a hub is enumerated by a USB host controller, the hub is only permitted
to report how many ports it has; the hub is not permitted to select a numerical
range or assignment. The host controller will number the downstream ports of
the hub starting with the number '1', up to the number of ports that the hub
reported having.
The host's port number is referred to as “logical port number” and the physical
port on the hub is the “physical port number”. When remapping mode is
enabled (see PRTMAP_EN in Register 08h: Configuration Data Byte 3) the
hub's downstream port numbers can be remapped to different logical port
numbers (assigned by the host).
Note:
The OEM must ensure that contiguous logical port numbers are
used, starting from number ‘1’ up to the maximum number of
enabled ports; this ensures that the hub's ports are numbered in
accordance with the way a host will communicate with the ports.
TABLE 6-5:
PORT MAP REGISTER FOR PORTS 1 & 2
Bit [7:4]
‘0000’
‘0001’
‘0010’
‘0011’
Physical port 2 is disabled
Physical port 2 is mapped to Logical port 1
Physical port 2 is mapped to Logical port 2
Physical port 2 is mapped to Logical port 3
Illegal; Do not use
‘0100’
to
‘1111’
Bit [3:0]
‘0000’
‘0001’
‘0010’
‘0011’
Physical port 1 is disabled
Physical port 1 is mapped to Logical port 1
Physical port 1 is mapped to Logical port 2
Physical port 1 is mapped to Logical port 3
Illegal; Do not use
‘0100’
to
‘1111’
2010-2019 Microchip Technology Inc.
DS00001931B-page 39
USB2660/USB2660i
6.4.4.22
F3h: Port Map 3
Bit
Byte Name
Description
7:0
PRTM3
PortMap register for port 3.
When a hub is enumerated by a USB host controller, the hub is only permitted
to report how many ports it has; the hub is not permitted to select a numerical
range or assignment. The host controller will number the downstream ports of
the hub starting with the number '1', up to the number of ports that the hub
reported having.
The host's port number is referred to as “logical port number” and the physical
port on the hub is the “physical port number”. When remapping mode is
enabled (see PRTMAP_EN in Register 08h: Configuration Data Byte 3) the
hub's downstream port numbers can be remapped to different logical port
numbers (assigned by the host).
Note:
The OEM must ensure that contiguous logical port numbers are
used, starting from number ‘1’ up to the maximum number of
enabled ports; this ensures that the hub's ports are numbered in
accordance with the way a host will communicate with the ports.
TABLE 6-6:
PORT MAP REGISTER FOR PORT 3
Bit [7:4]
‘0000’
‘0001’
‘0010’
‘0011’
Reserved
Reserved
Reserved
Reserved
‘0100’
to
Illegal; Do not use
‘1111’
Bit [3:0]
‘0000’
‘0001’
‘0010’
‘0011’
Physical port 3 is disabled
Physical port 3 is mapped to Logical port 1
Physical port 3 is mapped to Logical port 2
Physical port 3 is mapped to Logical port 3
Illegal; Do not use
‘0100’
to
‘1111’
6.4.4.23
F4h-FAh: Reserved
Byte
Byte Name
Description
Description
6:0
Reserved
Reserved.
6.4.4.24
FBh: Not Applicable
Bit
Byte Name
7:0
Not Applicable
Not applicable.
DS00001931B-page 40
2010-2019 Microchip Technology Inc.
USB2660/USB2660i
6.4.4.25
FCh-FFh: Non-Volatile Storage Signature
Byte
Name
Description
3:0
NVSTORE_SIG
This signature is used to verify the validity of the data in the first 256 bytes of
the configuration area. The signature must be set to ‘ATA2’ for
USB2660/USB2660i.
6.4.5
INTERNAL FLASH MEDIA CONTROLLER EXTENDED CONFIGURATIONS
Enable Registers 100h - 17Fh by setting bit 7 of bmAttribute.
6.4.5.1
100h-106h: Combo LUN 0 Identifier String
Byte
6:0
Name
Description
CLUN0_ID_STR
If the device to LUN mapping bytes have configured this LUN to be a combo
LUN, then these strings will be used to identify the LUN rather than the device
identifier strings.
6.4.5.2
107h-10Dh: Combo LUN 1 Identifier String
BYTE
NAME
DESCRIPTION
6:0
CLUN1_ID_STR
If the device to LUN bytes have configured this LUN to be a combo LUN, then
these strings will be used to identify the LUN rather than the device identifier
strings.
6.4.5.3
10Eh-114h: Combo LUN 2 Identifier String
Byte
Name
Description
6:0
CLUN2_ID_STR
If the device to LUN mapping bytes have configured this LUN to be a combo
LUN, then these strings will be used to identify the LUN rather than the device
identifier strings.
6.4.5.4
115h-11Bh: Combo LUN 3 Identifier String
Byte
Name
Description
6:0
CLUN3_ID_STR
If the device to LUN mapping bytes have configured this LUN to be a combo
LUN, then these strings will be used to identify the LUN rather than the device
identifier strings.
6.4.5.5
11Ch-122h: Combo LUN 4 Identifier String
Byte
Name
Description
6:0
CLUN4_ID_STR
If the device to LUN mapping bytes have configured this LUN to be a combo
LUN, then these strings will be used to identify the LUN rather than the device
identifier strings.
6.4.5.6
123h-129h: Device 4 Identifier String
Byte
Name
Description
6:0
DEV4_ID_STR
This ID string is associated with the second Secure Digital / MultiMediaCard
“SD/MMC2” device.
2010-2019 Microchip Technology Inc.
DS00001931B-page 41
USB2660/USB2660i
6.4.5.7
130h-145h: Not Applicable
Byte
21:0
Name
Description
Description
Not Applicable
Not applicable.
6.4.5.8
146h: Dynamic Number of Extended LUNs
Bit
Name
7:0
DYN_NUM_
EXT_LUN
These bytes are used to specify the number of LUNs the device exposes to
the host. These bytes are also used for icon sharing by assigning more than
one LUN to a single icon. This is used in applications where the device utilizes
a combo socket and the OEM wishes to have only a single icon displayed for
one or more interfaces.
If this field is set to "FF", the program assumes that you are using the default
value and icons will be configured per the default configuration.
6.4.5.9
147h-14Bh: Device to LUN Mapping
Byte
Name
Description
4:0
DEV_LUN_MAP
These registers map a device controller (SD/MMC, SM (Note 6-2), and MS)
to a Logical Unit Number (LUN). The device reports the mapped LUNs to the
USB host in the USB descriptor during enumeration. The icon installer
associates custom icons with the LUNs specified in these fields.
Setting a register to "FF" indicates that the device is not mapped. Setting all
of the DEV_LUN_MAP registers for all devices to "FF" forces the use of the
default mapping configuration. Not all configurations are valid. Valid
configurations depend on the hardware, packaging, and OEM board layout.
The number of unique LUNs mapped must match the value in the Section
6.4.3.7, "D3h: Dynamic Number of LUNs," on page 32.
6.4.5.10
14Ch-14Dh: Second Secure Digital Device Power Configuration
The device has two internal FETs which can be utilized for card power. For information about the other internal FET,
please see Section 6.4.2.3, "A4h-A5h: Smart Media Device Power Configuration," on page 30. The settings are stored
in NVSTORE. This section describes the default internal configuration.
1. A card can be powered by an external FET or by an internal FET.
2. The power limit can be set to 100 mA or 200 mA (Default) for the internal FET.
Each media uses two bytes to store its device power configuration. Bit 3 selects between internal or external card power
FET options. For internal FET card power control, bits 0 through 2 are used to set the power limit. The “Device Power
Configuration” bits are ignored unless the “Enable Device Power Configuration” bit is set. See Section 6.4.1.19, "9Ch-
9Fh: Attribute Byte Descriptions," on page 29.
FET
0
Type
Bits
3:0
Bit Type
Description
FET Lo Byte
SD2_PWR_LB
Low Nibble
0000b Disabled
0001b External FET enabled
1000b Internal FET with 100 mA power limit
1010b Internal FET with 200 mA power limit
1
2
3
7:4
3:0
7:4
High Nibble
Low Nibble
High Nibble
0000b Disabled
0000b Disabled
0000b Disabled
FET Hi Byte
SD2_PWR_HB
6.4.5.11
14Eh-17Bh: Not Applicable
Bit
Name
Description
47:0
Not Applicable
Not applicable.
DS00001931B-page 42
2010-2019 Microchip Technology Inc.
USB2660/USB2660i
6.4.5.12
17Ch -17Fh: Non-Volatile Storage Signature for Extended Configuration
Byte
Name Description
3:0
NVSTORE_SIG2 This signature is used to verify the validity of the data in the upper 256 bytes if
a 512 byte EEPROM is used, otherwise this bank is a read-only configuration
area. The signature must be set to 'ecf1'.
2
6.4.6
I C EEPROM
The I2C EEPROM interface implements a subset of the I2C Master Specification (Please refer to the Philips Semicon-
ductor Standard I2C-Bus Specification for details on I2C bus protocols). The device’s I2C EEPROM interface is designed
to attach to a single “dedicated” I2C EEPROM, and it conforms to the Standard-mode I2C Specification (100 kbps trans-
fer rate and 7-bit addressing) for protocol and electrical compatibility.
Note:
Extensions to the I2C Specification are not supported. The device acts as the master and generates the
serial clock SCL, controls the bus access (determines which device acts as the transmitter and which
device acts as the receiver), and generates the START and STOP conditions.
6.4.6.1
Implementation Characteristics
The device will only access an EEPROM using the sequential read protocol.
6.4.6.2 Pull-Up Resistor
The circuit board designer is required to place external pull-up resistors (10 k recommended) on the SPI_DO / SDA /
SPI_SPD_SEL and SPI_CLK / SCL lines (per SMBus 1.0 Specification and EEPROM manufacturer guidelines) to
VDD33 in order to assure proper operation.
6.4.7
IN-CIRCUIT EEPROM PROGRAMMING
The EEPROM can be programmed via automatic test equipment (ATE). Pulling nRESET low tri-states the device’s
EEPROM interface and allows an external source to program the EEPROM.
6.5
Default Configuration Option
The Microchip device can be configured via its internal default configuration. Please see Section 6.3.2, "EEPROM Data
Descriptor" for specific details on how to enable default configuration. Please refer to Table 6-1 for the internal default
values that are loaded when this option is selected.
6.5.1
EXTERNAL HARDWARE NRESET
A valid hardware reset is defined as assertion of nRESET for a minimum of 1 s after all power supplies are within oper-
ating range. While reset is asserted, the device (and its associated external circuitry) consumes less than 500 A of
current from the upstream USB power source.
Assertion of nRESET (external pin) causes the following:
1. All downstream ports are disabled and PRTCTL power to downstream devices is removed.
2. The PHYs are disabled and the differential pairs will be in a high-impedance state.
3. All transactions immediately terminate; no states are saved.
4. All internal registers return to the default state (in most cases, 00h).
5. The external crystal oscillator is halted.
6. The PLL is halted.
2010-2019 Microchip Technology Inc.
DS00001931B-page 43
USB2660/USB2660i
6.5.1.1
nRESET for EEPROM Configuration
TABLE 6-7:
NRESET TIMING FOR EEPROM MODE
Start
completion
request
Hardware
reset
asserted
Device
Recovery/
Stabilization
8051 Sets
Configuration
Registers
Attach
USB
Upstream
USB Reset
recovery
Idle
response
t4
t6
t7
t1
t5
t2
t3
nRESET
VSS
TABLE 6-8:
Name
NRESET TIMING FOR EEPROM MODE
Description
MIN
TYP
MAX
Units
t1
t2
t3
t4
t5
t6
t7
nRESET asserted
1
sec
sec
msec
msec
msec
msec
msec
Device recovery/stabilization
8051 programs device configuration
USB attach (See Note)
500
50
20
100
Host acknowledges attach and signals USB reset
USB idle
100
Undefined
Completion time for requests (with or without data
stage)
5
Note:
All power supplies must have reached the operating levels mandated in Section 8.0, "DC Parameters",
prior to (or coincident with) the assertion of nRESET.
6.5.2
USB BUS RESET
In response to the upstream port signaling a reset to the device, the device does the following:
Note:
The device does not propagate the upstream USB reset to downstream devices.
1. Sets default address to ‘0’.
2. Sets configuration to: Unconfigured.
3. Negates PRTCTL[3:2] to all downstream ports.
4. Clears all TT buffers.
5. Moves device from suspended to active (if suspended).
6. Complies with Section 11.10 of the USB 2.0 Specification for behavior after completion of the reset sequence.
The host then configures the device and the device’s downstream port devices in accordance with the USB 2.0 Speci-
fication.
DS00001931B-page 44
2010-2019 Microchip Technology Inc.
USB2660/USB2660i
7.0
7.1
AC SPECIFICATIONS
Oscillator/Crystal
Parallel Resonant, Fundamental Mode, 24 MHz 350 ppm.
FIGURE 7-1:
TYPICAL CRYSTAL CIRCUIT
TABLE 7-1:
Symbol
CRYSTAL CIRCUIT LEGEND
Description
In Accordance With
C0
Crystal shunt capacitance
Crystal manufacturer’s specification (See Note 7-1)
CL
Crystal load capacitance
Total board or trace capacitance
Stray capacitance
CB
OEM board design
MCHP IC and OEM board design
MCHP IC
CS
CXTAL
C1
XTAL pin input capacitance
Load capacitors installed on OEM
board
Calculated values based on Figure 7-2 (See Note 7-2)
C2
FIGURE 7-2:
CAPACITANCE FORMULAS
C1 = 2 x (CL – C0) – CS1
C2 = 2 x (CL – C0) – CS2
Note 7-1
Note 7-2
C0 is usually included (subtracted by the crystal manufacturer) in the specification for CL and should
be set to ‘0’ for use in the calculation of the capacitance formulas in Figure 7-2. However, the OEM
PCB itself may present a parasitic capacitance between XTAL1 and XTAL2. For an accurate
calculation of C1 and C2, take the parasitic capacitance between traces XTAL1 and XTAL2 into
account.
Each of these capacitance values is typically approximately 18 pF.
2010-2019 Microchip Technology Inc.
DS00001931B-page 45
USB2660/USB2660i
7.2
Ceramic Resonator
24 MHz 350 ppm
FIGURE 7-3:
CERAMIC RESONATOR USAGE WITH MCHP IC
7.3
External Clock
50% Duty cycle 10%, 24 MHz 350 ppm, Jitter < 100 ps rms.
The external clock is recommended to conform to the signaling level designated in the JESD76-2 specification on 1.8
V CMOS Logic. XTAL2 should be treated as a no connect.
2
7.3.1
I C EEPROM
Frequency is fixed at 58.6 kHz 20%
7.3.2 USB 2.0
The Microchip device conforms to all voltage, power, and timing characteristics and specifications as set forth in the
USB 2.0 Specification. Please refer to the USB 2.0 Specification for more information.
DS00001931B-page 46
2010-2019 Microchip Technology Inc.
USB2660/USB2660i
8.0
8.1
DC PARAMETERS
Maximum Ratings
Parameter
Symbol
TSTOR
MIN
MAX
Units
°C
Comments
Storage
Temperature
-55
150
4.0
Lead
Temperature
°C
V
Please refer to JEDEC
specification J-STD-020D.
3.3 V supply
voltage
VDD33
-0.5
-0.5
Voltage on
USB+ and
USB- pins
(3.3 V supply voltage + 2) 6
V
Voltage on
CRD_PWR1
and
-0.5
VDD33 + 0.3
V
When internal power FET
operation of these pins are
enabled, these pins may be
simultaneously shorted to
ground or any voltage up to
3.63 V indefinitely, without
damage to the device as
long as VDD33 is less than
3.63 V and TA is less than
70oC.
CRD_PWR2
Voltage on any
signal pin
-0.5
-0.5
-0.5
VDD33 + 0.3
V
V
V
Voltage on
XTAL1
3.6
2.0
Voltage on
XTAL2
Note:
Stresses above the specified parameters may cause permanent damage to the device. This is a stress rat-
ing only. Functional operation of the device at any condition above those indicated in the operation sections
of this specification is not implied. When powering this device from laboratory or system power supplies
the absolute maximum ratings must not be exceeded or device failure can result. Some power supplies
exhibit voltage spikes on their outputs when the AC power is switched on or off. In addition, voltage tran-
sients on the AC power line may appear on the DC output. When this possibility exists, a clamp circuit
should be used.
FIGURE 8-1:
SUPPLY RISE TIME MODEL
Voltage
VDD33
tRT
3.3 V
100%
90%
10%
VSS
t90%
Time
t10%
2010-2019 Microchip Technology Inc.
DS00001931B-page 47
USB2660/USB2660i
8.2
Operating Conditions
Parameter
Symbol
TA
MIN
MAX
Units
°C
Comments
Commercial
0
70
85
3.6
Ambient temperature in still air.
USB2660
Operating Temperature
Industrial
USB2660
Operating Temperature
TA
-40
3.0
°C
V
Ambient temperature in still air.
3.3 V supply voltage
VDD33
A 3.3 V regulator with an output
tolerance of 1% must be used if
the output of the internal power
FET’s must support a 5%
tolerance.
3.3 V supply rise time tRT
0
400
5.5
s
(Figure 8-1)
Voltage on
USB+ and USB- pins
-0.3
V
If any 3.3 V supply voltage drops
below 3.0 V, then the MAX
becomes:
(3.3 V supply voltage) + 0.5 5.5
Voltage on any signal
pin
-0.3
VDD33
V
Voltage on XTAL1
Voltage on XTAL2
-0.3
-0.3
2.0
2.0
V
V
8.3
DC Electrical Characteristics
Parameter
Symbol
MIN
TYP
MAX
Units
Comments
I, IPU, IPD Type Input Buffer
Low Input Level
VILI
VIHI
PD
PU
0.8
V
V
TTL Levels
High Input Level
2.0
Pull Down
72
58
A
A
Pull Up
IS Type Input Buffer
Low Input Level
High Input Level
VILI
VIHI
0.8
V
V
TTL Levels
2.0
Hysteresis
VHYSI
420
mV
ICLK Input Buffer
Low Input Level
High Input Level
Input Leakage
VILCK
VIHCK
IIL
0.5
V
V
1.4
-10
+10
A
VIN = 0 to VDD33
Input Leakage
(All I and IS buffers)
Low Input Leakage
High Input Leakage
IIL
-10
-10
+10
+10
A
A
VIN = 0
IIH
VIN = VDD33
DS00001931B-page 48
2010-2019 Microchip Technology Inc.
USB2660/USB2660i
Parameter
Symbol
MIN
TYP
MAX
Units
Comments
I/O6, I/OD6PU Type Buffers
Low Output Level
High Output Level
Output Leakage
VOL
VOH
IOL
0.4
V
V
IOL = 6 mA @
VDD33 = 3.3 V
VDD33
- 0.4
IOH = -6 mA @
VDD33 = 3.3 V
-10
+10
µA
VIN = 0 to VDD33
(Note 8-1)
Pull Down
Pull Up
PD
PU
72
58
A
A
O8, O8PD, 08PU, I/O8, I/O8PD, and
I/O8PU Type Buffers
Low Output Level
High Output Level
Output Leakage
VOL
VOH
IOL
0.4
V
V
IOL = 8 mA @
VDD33 = 3.3 V
VDD33
- 0.4
IOH = -8 mA @
VDD33 = 3.3 V
-10
+10
µA
VIN = 0 to VDD33
(Note 8-1)
Pull Down
Pull Up
PD
PU
72
58
A
A
O12, I/O12, and I/O12PD
Type Buffers
Low Output Level
High Output Level
Output Leakage
VOL
VOH
IOL
0.4
V
V
IOL = 12 mA @
VDD33 = 3.3 V
VDD33
- 0.4
IOH = -12 mA @
VDD33 = 3.3 V
-10
+10
µA
VIN = 0 to VDD33
(Note 8-1)
Pull Down
Pull Up
PD
PU
72
58
A
A
IO-U
I-R
Note 8-2
Note 8-3
2010-2019 Microchip Technology Inc.
DS00001931B-page 49
USB2660/USB2660i
Parameter
Symbol
MIN
TYP
MAX
Units
Comments
I/O200 Integrated Power FET for
CRD_PWR1 and CRD_PWR2
High Output Current
IOUT
IOUT
200
100
mA
mA
VdropFET = 0.46 V
VdropFET = 0.23 V
Low Output Current
(Note 8-4)
On Resistance
(Note 8-4)
RDSON
tDSON
2.1
IFET = 70 mA
Output Voltage Rise Time
800
s
CLOAD = 10 F
Integrated Power FET Set to 100 mA
Output Current (Note 8-4)
Short Circuit Current Limit
On Resistance (Note 8-4)
IOUT
ISC
RDSON
tDSON
100
mA
mA
VdropFET = 0.22 V
VoutFET = 0 V
IFET = 70 mA
140
2.1
Output Voltage Rise Time
800
s
CLOAD = 10 F
Integrated Power FET Set to 200 mA
Output Current (Note 8-4)
Short Circuit Current Limit
On Resistance (Note 8-4)
Output Voltage Rise Time
IOUT
ISC
RDSON
tDSON
200
mA
mA
VdropFET = 0.46 V
VoutFET = 0 V
IFET = 70 mA
181
2.1
800
s
CLOAD = 10 F
Supply Current Unconfigured
Hi-Speed Host
Note 8-5
USB2660
USB2660i
ICCINTHS
ICCINTHS
70
70
80
80
mA
mA
Full Speed Host
USB2660
USB2660i
ICCINITFS
ICCINITFS
65
65
75
75
mA
mA
Supply Current Configured
Hi-Speed Host, 1 downstream port
(Note 8-5)
USB2660
USB2660i
IHCH1
IHCH1
260
260
270
275
mA
mA
Supply Current Configured
Hi-Speed Host, each additional
downstream port
USB2660
USB2660i
25
25
30
35
mA
mA
Supply Current Configured
Full-Speed Host, 1 downstream port
USB2660
USB2660i
IFCC1
IFCC1
200
200
210
215
mA
mA
Supply Current Configured
Full-Speed Host, each additional
downstream port
USB2660
USB2660i
20
20
25
25
mA
mA
DS00001931B-page 50
2010-2019 Microchip Technology Inc.
USB2660/USB2660i
Parameter
Symbol
MIN
TYP
MAX
Units
Comments
(Note 8-5)
Supply Current Suspend
USB2660
USB2660i
ICSBY
ICSBY
500
500
950
1200
µA
µA
Supply Current Reset
USB2660
USB2660i
IRST
IRST
230
230
700
900
µA
µA
Note 8-1
Note 8-2
Note 8-3
Note 8-4
Output leakage is measured with the current pins in high impedance.
See the USB 2.0 Specification, Chapter 7, for USB DC electrical characteristics
RBIAS is a 3.3 V tolerant analog pin.
Output current range is controlled by program software. The software disables the FET during short
circuit condition.
Note 8-5
Typical and maximum values were characterized using the following temperature ranges: The
USB2660 supports the commercial temperature range of 0°C to +70°C
The USB2660i supports the industrial temperature range of -40°C to +85°C
8.4
Capacitance
TA = 25°C; fc = 1 MHz; VDD33= 3.3 V
TABLE 8-1: PIN CAPACITANCE
Parameter
Limits
TYP
Symbol
Units
Test Condition
MIN
MAX
Clock Input Capacitance
CXTAL
2
pF
All pins (except USB pins and
pins under test) are tied to AC
ground.
Input Capacitance
Output Capacitance
CIN
10
20
pF
pF
COUT
2010-2019 Microchip Technology Inc.
DS00001931B-page 51
USB2660/USB2660i
9.0
PACKAGE SPECIFICATIONS
FIGURE 9-1:
USB2660/USB2660I 64-PIN QFN
DS00001931B-page 52
2010-2019 Microchip Technology Inc.
USB2660/USB2660i
FIGURE 9-1:
USB2660/USB2660I 64-PIN QFN (CONTINUED)
2010-2019 Microchip Technology Inc.
DS00001931B-page 53
USB2660/USB2660i
FIGURE 9-2:
64-PIN PACKAGE TAPE SPECIFICATIONS
0.30
T1
4.00
2.00
A
Ø1.50
1.75
7.50
16.00 0.3
B0
W1
A0
12.00
Ø1.50
A
COVER TAPE
K0
10 mm
SECTION A — A
DIRECTION OF UNREELING
MIN
NOM MAX
A0 9.20 9.30 9.40
B0 9.20 9.30 9.40
K0 1.00 1.10 1.20
-
-
T1
1.00
W1 13.20 13.30 13.40
DS00001931B-page 54
2010-2019 Microchip Technology Inc.
USB2660/USB2660i
APPENDIX A: ACRONYMS
ACK:
EOP:
EOF:
FM:
Handshake packet (positive acknowledgement)
End of Packet
End of (micro) Frame
Flash Media
FMC:
FS:
Flash Media Controller
Full-Speed Device
LS:
Low-Speed Device
HS:
Hi-Speed Device
I2C:
MMC:
MS:
Inter-Integrated Circuit1
MultiMediaCard
Memory Stick
MSC:
OCS:
PHY:
PLL:
RXD:
SD:
Memory Stick Controller
Over-current Sense
Physical Layer
Phase-Locked Loop
Received eXchange Data
Secure Digital
SDC:
TXD:
UART:
Secure Digital Controller
Transmit eXchange Data
Universal Asynchronous Receiver-Transmitter
UCHAR: Unsigned Character
UINT: Unsigned Integer
1. I2C is a registered trademark of Philips Corporation.
2010-2019 Microchip Technology Inc.
DS00001931B-page 55
USB2660/USB2660i
APPENDIX B: DATA SHEET REVISION HISTORY
TABLE B-1:
REVISION HISTORY
Revision
Section/Figure/Entry
Correction
DS00001931B (09-05-19)
DS00001931A (05-11-15)
Features section on cover,
Product Identification Sys-
tem on page 57
Mention of commercial version removed, not
offered.
Figure 2-1, "USB2660/
USB2660i Block Diagram"
Diagram modified removing SDIO reference.
Throughout document
GPIOs and SDIO support removed; Package Out-
line diagrams updated.
REV A replaces previous SMSC version Rev. 1.1 (11-05-10)
DS00001931B-page 56
2010-2019 Microchip Technology Inc.
USB2660/USB2660i
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.
Device
[X]
XXX
[X](1)
Examples:
-
-
a)
USB2660i-JZX-03
Temperature
Range
Package
Tape and Reel
Option
64-pin QFN, 9 x 9mm
RoHS Compliant Package, Tray
b)
USB2660i-JZX-03-TR
64-pin QFN, 9 x 9mm
RoHS Compliant Package, Tape & Reel
Device:
USB2660, USB2660i
Temperature
Range:
i
=
-40C to +85C (Industrial)
Package:
JZX
=
64-pin QFN
Tape and Reel
Option:
Blank = Standard packaging (tray)
Note 1:
Tape and Reel identifier only appears in the
catalog part number description. This identifier
is used for ordering purposes and is not printed
on the device package. Check with your
Microchip Sales Office for package availability
with the Tape & Reel option.
(1)
TR
= Tape and Reel
Reel size is 3,000.
2010-2019 Microchip Technology Inc.
DS00001931B-page 57
USB2660/USB2660i
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device applications and the like is provided only for your convenience and may be
superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO
REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE,
MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Micro-
chip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold
harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or
otherwise, under any Microchip intellectual property rights unless otherwise stated.
Trademarks
The Microchip name and logo, the Microchip logo, Adaptec, AnyRate, AVR, AVR logo, AVR Freaks, BesTime, BitCloud, chipKIT, chipKIT logo,
CryptoMemory, CryptoRF, dsPIC, FlashFlex, flexPWR, HELDO, IGLOO, JukeBlox, KeeLoq, Kleer, LANCheck, LinkMD, maXStylus, maXTouch,
MediaLB, megaAVR, Microsemi, Microsemi logo, MOST, MOST logo, MPLAB, OptoLyzer, PackeTime, PIC, picoPower, PICSTART, PIC32 logo,
PolarFire, Prochip Designer, QTouch, SAM-BA, SenGenuity, SpyNIC, SST, SST Logo, SuperFlash, Symmetricom, SyncServer, Tachyon,
TempTrackr, TimeSource, tinyAVR, UNI/O, Vectron, and XMEGA are registered trademarks of Microchip Technology Incorporated in the U.S.A. and
other countries.
APT, ClockWorks, The Embedded Control Solutions Company, EtherSynch, FlashTec, Hyper Speed Control, HyperLight Load, IntelliMOS, Libero,
motorBench, mTouch, Powermite 3, Precision Edge, ProASIC, ProASIC Plus, ProASIC Plus logo, Quiet-Wire, SmartFusion, SyncWorld, Temux,
TimeCesium, TimeHub, TimePictra, TimeProvider, Vite, WinPath, and ZL are registered trademarks of Microchip Technology Incorporated in the
U.S.A.
Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut, BlueSky, BodyCom, CodeGuard,
CryptoAuthentication, CryptoAutomotive, CryptoCompanion, CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average Matching, DAM,
ECAN, EtherGREEN, In-Circuit Serial Programming, ICSP, INICnet, Inter-Chip Connectivity, JitterBlocker, KleerNet, KleerNet logo, memBrain,
Mindi, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net,
PICkit, PICtail, PowerSmart, PureSilicon, QMatrix, REAL ICE, Ripple Blocker, SAM-ICE, Serial Quad I/O, SMART-I.S., SQI, SuperSwitcher,
SuperSwitcher II, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated in the U.S.A.
The Adaptec logo, Frequency on Demand, Silicon Storage Technology, and Symmcom are registered trademarks of Microchip Technology Inc. in
other countries.
GestIC is a registered trademark of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other
countries.
All other trademarks mentioned herein are property of their respective companies.
© 2010-2019, Microchip Technology Incorporated, All Rights Reserved.
ISBN: 9781522450016
For information regarding Microchip’s Quality Management Systems,
please visit www.microchip.com/quality.
DS00001931B-page 58
2010-2019 Microchip Technology Inc.
USB2660/USB2660i
THE MICROCHIP WEB SITE
Microchip provides online support via our WWW site at www.microchip.com. This web site is used as a means to make
files and information easily available to customers. Accessible by using your favorite Internet browser, the web site con-
tains the following information:
• Product Support – Data sheets and errata, application notes and sample programs, design resources, user’s
guides and hardware support documents, latest software releases and archived software
• General Technical Support – Frequently Asked Questions (FAQ), technical support requests, online discussion
groups, Microchip consultant program member listing
• Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of semi-
nars and events, listings of Microchip sales offices, distributors and factory representatives
CUSTOMER CHANGE NOTIFICATION SERVICE
Microchip’s customer notification service helps keep customers current on Microchip products. Subscribers will receive
e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or
development tool of interest.
To register, access the Microchip web site at www.microchip.com. Under “Support”, click on “Customer Change Notifi-
cation” and follow the registration instructions.
CUSTOMER SUPPORT
Users of Microchip products can receive assistance through several channels:
• Distributor or Representative
• Local Sales Office
• Field Application Engineer (FAE)
• Technical Support
Customers should contact their distributor, representative or field application engineer (FAE) for support. Local sales
offices are also available to help customers. A listing of sales offices and locations is included in the back of this docu-
ment.
Technical support is available through the web site at: http://www.microchip.com/support
2010-2019 Microchip Technology Inc.
DS00001931B-page 59
Worldwide Sales and Service
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://www.microchip.com/
support
Australia - Sydney
Tel: 61-2-9868-6733
India - Bangalore
Tel: 91-80-3090-4444
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
China - Beijing
Tel: 86-10-8569-7000
India - New Delhi
Tel: 91-11-4160-8631
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
China - Chengdu
Tel: 86-28-8665-5511
India - Pune
Tel: 91-20-4121-0141
Finland - Espoo
Tel: 358-9-4520-820
China - Chongqing
Tel: 86-23-8980-9588
Japan - Osaka
Tel: 81-6-6152-7160
Web Address:
www.microchip.com
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
China - Dongguan
Tel: 86-769-8702-9880
Japan - Tokyo
Tel: 81-3-6880- 3770
Atlanta
Duluth, GA
Tel: 678-957-9614
Fax: 678-957-1455
China - Guangzhou
Tel: 86-20-8755-8029
Korea - Daegu
Tel: 82-53-744-4301
Germany - Garching
Tel: 49-8931-9700
China - Hangzhou
Tel: 86-571-8792-8115
Korea - Seoul
Tel: 82-2-554-7200
Germany - Haan
Tel: 49-2129-3766400
Austin, TX
Tel: 512-257-3370
China - Hong Kong SAR
Tel: 852-2943-5100
Malaysia - Kuala Lumpur
Tel: 60-3-7651-7906
Germany - Heilbronn
Tel: 49-7131-72400
Boston
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
China - Nanjing
Tel: 86-25-8473-2460
Malaysia - Penang
Tel: 60-4-227-8870
Germany - Karlsruhe
Tel: 49-721-625370
China - Qingdao
Philippines - Manila
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Tel: 86-532-8502-7355
Tel: 63-2-634-9065
Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
China - Shanghai
Tel: 86-21-3326-8000
Singapore
Tel: 65-6334-8870
Germany - Rosenheim
Tel: 49-8031-354-560
China - Shenyang
Tel: 86-24-2334-2829
Taiwan - Hsin Chu
Tel: 886-3-577-8366
Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
Israel - Ra’anana
Tel: 972-9-744-7705
China - Shenzhen
Tel: 86-755-8864-2200
Taiwan - Kaohsiung
Tel: 886-7-213-7830
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
China - Suzhou
Tel: 86-186-6233-1526
Taiwan - Taipei
Tel: 886-2-2508-8600
Detroit
Novi, MI
Tel: 248-848-4000
China - Wuhan
Tel: 86-27-5980-5300
Thailand - Bangkok
Tel: 66-2-694-1351
Italy - Padova
Tel: 39-049-7625286
Houston, TX
Tel: 281-894-5983
China - Xian
Tel: 86-29-8833-7252
Vietnam - Ho Chi Minh
Tel: 84-28-5448-2100
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Indianapolis
Noblesville, IN
Tel: 317-773-8323
Fax: 317-773-5453
Tel: 317-536-2380
China - Xiamen
Tel: 86-592-2388138
Norway - Trondheim
Tel: 47-7288-4388
China - Zhuhai
Tel: 86-756-3210040
Poland - Warsaw
Tel: 48-22-3325737
Los Angeles
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
Tel: 951-273-7800
Romania - Bucharest
Tel: 40-21-407-87-50
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
Raleigh, NC
Tel: 919-844-7510
Sweden - Gothenberg
Tel: 46-31-704-60-40
New York, NY
Tel: 631-435-6000
Sweden - Stockholm
Tel: 46-8-5090-4654
San Jose, CA
Tel: 408-735-9110
Tel: 408-436-4270
UK - Wokingham
Tel: 44-118-921-5800
Fax: 44-118-921-5820
Canada - Toronto
Tel: 905-695-1980
Fax: 905-695-2078
2010-2019 Microchip Technology Inc.
DS00001931B-page 60
05/14/19
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