USB2660I-JZX [MICROCHIP]

FLASH MEMORY DRIVE CONTROLLER, QCC64, 9 X 9 MM, ROHS COMPLIANT, QFN-64;
USB2660I-JZX
型号: USB2660I-JZX
厂家: MICROCHIP    MICROCHIP
描述:

FLASH MEMORY DRIVE CONTROLLER, QCC64, 9 X 9 MM, ROHS COMPLIANT, QFN-64

外围集成电路
文件: 总60页 (文件大小:757K)
中文:  中文翻译
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USB2660/USB2660i  
Ultra Fast USB 2.0 Hub and Multi-Format Flash Media Controller  
with Dual SD Interfaces  
General Description  
Features  
The Microchip USB2660/USB2660i is a USB 2.0 com-  
pliant, Hi-Speed hub, card reader, and protocol con-  
verter combo solution. This fully integrated single chip  
solution provides USB expansion and flash card media  
reader/writer integration. The Microchip USB2660/  
USB2660i provides an ultra fast interface between a  
USB host and today’s popular flash media formats. The  
controller allows read/write capability to flash media  
from the following families:  
• Compliance with the following flash media card  
specifications SD 2.0 / MMC 4.2 / MS 1.43 / MS-  
Pro 1.02 / MS-Pro-HG 1.01 / MS-Duo 1.10 / xD  
1.2  
• Supports a single external 3.3 V supply source;  
internal regulators provide 1.8 V internal core volt-  
age for additional bill of materials and power sav-  
ings  
• The transaction translator (TT) in the hub sup-  
ports operation of Full-Speed and Low-Speed  
peripherals  
- Secure DigitalTM (SD)  
- MultiMediaCardTM (MMC)  
- Memory Stick® (MS)  
• 9 K RAM | 64 K on-chip ROM  
- xD-Picture CardTM (xD)1  
• Enhanced EMI rejection and ESD protection per-  
formance  
The USB2660/USB2660i offers a versatile, cost-effec-  
tive, and energy-efficient hub controller with 2 down-  
stream USB 2.0 ports. This combo solution leverages  
Microchip’s innovative technology that delivers indus-  
try-leading data throughput in mixed-speed USB envi-  
ronments. Average sustained transfer rates exceeding  
35 MB/s are possible2.  
• Hub and flash media reader/writer configuration  
from a single source: External I2C® ROM or exter-  
nal SPI ROM  
- Configures internal code using an external  
I2C EEPROM  
- Supports external code using an SPI Flash  
EEPROM  
- Customizable vendor ID, product ID, and lan-  
guage ID if using an external EEPROM  
Highlights  
• 2 exposed Hi-Speed USB 2.0 downstream ports  
for external peripheral expansion  
• Additional SD port for card reader  
• The dedicated flash media reader is internally  
attached to a 3rd downstream port of the hub as a  
USB Compound Device  
• The USB2660i supports the industrial tempera-  
ture range of -40°C to +85°C  
• 64-pin QFN RoHS compliant package (9 x 9 mm)  
- a single or multiplexed flash media reader  
interface  
- a non-multiplexed SD interface (slot) for SD  
card reader  
Applications  
• Desktop and mobile PCs  
• Printers  
PortMap - Flexible port mapping and port disable  
sequencing supports multiple platform designs  
• GPS navigation systems  
• Media players/viewers  
• Consumer A/V  
PortSwap - Programmable USB differential-pair  
pin locations eases PCB design by aligning USB  
signal traces directly to connectors  
• Set-top boxes  
PHYBoost - Programmable USB transceiver  
• Industrial products  
drive strength recovers signal integrity  
1.For xD-Picture CardTM support, please obtain a user  
license from the xD-Picture Card License Office.  
2.Host and media dependent.  
2010-2019 Microchip Technology Inc.  
DS00001931B-page 1  
USB2660/USB2660i  
TO OUR VALUED CUSTOMERS  
It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip  
products. To this end, we will continue to improve our publications to better suit your needs. Our publications will be refined and  
enhanced as new volumes and updates are introduced.  
If you have any questions or comments regarding this publication, please contact the Marketing Communications Department via  
E-mail at docerrors@microchip.com. We welcome your feedback.  
Most Current Data Sheet  
To obtain the most up-to-date version of this data sheet, please register at our Worldwide Web site at:  
http://www.microchip.com  
You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page.  
The last character of the literature number is the version number, (e.g., DS30000000A is version A of document DS30000000).  
Errata  
An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for cur-  
rent devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the  
revision of silicon and revision of document to which it applies.  
To determine if an errata sheet exists for a particular device, please check with one of the following:  
Microchip’s Worldwide Web site; http://www.microchip.com  
Your local Microchip sales office (see last page)  
When contacting a sales office, please specify which device, revision of silicon and data sheet (include -literature number) you are  
using.  
Customer Notification System  
Register on our web site at www.microchip.com to receive the most current information on all of our products.  
DS00001931B-page 2  
2010-2019 Microchip Technology Inc.  
USB2660/USB2660i  
Table of Contents  
1.0 Overview ......................................................................................................................................................................................... 4  
2.0 Block Diagram ................................................................................................................................................................................. 6  
3.0 Pin Configuration ............................................................................................................................................................................ 7  
4.0 Pin Descriptions .............................................................................................................................................................................. 9  
5.0 Pin Reset States ........................................................................................................................................................................... 19  
6.0 Configuration Options ................................................................................................................................................................... 22  
7.0 AC Specifications .......................................................................................................................................................................... 45  
8.0 DC Parameters ............................................................................................................................................................................. 47  
9.0 Package Specifications ................................................................................................................................................................. 52  
Appendix A: Acronyms ........................................................................................................................................................................ 55  
Appendix B: Data Sheet Revision History ........................................................................................................................................... 56  
Product Identification System ............................................................................................................................................................. 57  
The Microchip Web Site ...................................................................................................................................................................... 59  
Customer Change Notification Service ............................................................................................................................................... 59  
Customer Support ............................................................................................................................................................................... 59  
2010-2019 Microchip Technology Inc.  
DS00001931B-page 3  
USB2660/USB2660i  
1.0  
OVERVIEW  
The Microchip USB2660/USB2660i is an integrated USB 2.0 compliant, Hi-Speed hub, card reader, and protocol con-  
verter combo solution. This combo solution supports today’s popular multi-format flash media cards. This multi-format  
flash media controller and USB hub combo features two exposed downstream USB ports available for external periph-  
eral expansion. The dedicated flash media reader/writer is internally attached to a third downstream port of the hub as  
a USB Compound Device which supports the following two interfaces: One interface is multiplexed for xD-Picture Card,  
Memory Stick, Secure Digital/MultiMediaCard, and SD/Secure Digital Input/Output. The other interface is dedicated to  
a second SD card slot.  
The USB2660/USB2660i will attach to an upstream port as a Full-Speed hub or as a Full-/Hi-Speed hub. The hub sup-  
ports Low-Speed, Full-Speed, and Hi-Speed (if operating as a Hi-Speed hub) downstream devices on all of the enabled  
downstream ports.  
All required resistors on the USB ports are integrated into the hub. This includes all series termination resistors on D+  
and D– pins and all required pull-down and pull-up resistors. The over-current sense inputs for the downstream facing  
ports have internal pull-up resistors.  
The USB2660/USB2660i includes programmable features such as:  
PortMap which provides flexible port mapping and disable sequences. The downstream ports of a USB2660/USB2660i  
hub can be reordered or disabled in any sequence to support multiple platform designs with minimum effort. For any  
port that is disabled, the USB2660/USB2660i automatically reorders the remaining ports to match the USB host con-  
troller’s port numbering scheme.  
PortSwap which adds per-port programmability to USB differential-pair pin locations.  
PortSwap allows direct alignment of USB signals (D+/D-) to connectors avoiding  
uneven trace length or crossing of the USB differential signals on the PCB.  
PHYBoost which enables four programmable levels of USB signal drive strengths in  
downstream port transceivers. PHYBoost attempts to restore USB signal integrity. The  
diagram on the right shows an example of Hi-Speed USB eye diagrams before (PHY-  
Boost at 0%) and after (PHYBoost at 12%) signal integrity restoration in a compro-  
mised system environment.  
1.1  
Hardware Features  
• Single chip hub and flash media controller combo  
• USB2660 supports the commercial temperature range of 0°C to +70°C  
• USB2660i supports the industrial temperature range of -40°C to +85°C  
• Transaction translator (TT) in the hub supports operation of FS and LS peripherals  
• Full power management with individual or ganged power control of each downstream port  
• Optional support for external firmware access via SPI interface  
• Onboard 24 MHz crystal driver circuit  
• Optional external 24 MHz clock input which must be a 1.8 V signal  
• Code execution via SPI ROM which must meet  
- 30 MHz or 60 MHz operation support  
- Single bit or dual bit mode support  
- Mode 0 or mode 3 SPI support  
1.1.1  
COMPLIANCE WITH THE FOLLOWING FLASH MEDIA CARD SPECIFICATIONS:  
• Secure Digital 2.0 / MultiMediaCard 4.2  
- SD 2.0, SD-HS, SD-HC  
- TransFlash™ and reduced form factor media  
- 1/4/8 bit MMC 4.2  
• Memory Stick 1.43  
• Memory Stick Pro Format 1.02  
DS00001931B-page 4  
2010-2019 Microchip Technology Inc.  
USB2660/USB2660i  
• Memory Stick Pro-HG Duo Format 1.01  
- Memory Stick, MS Duo, MS-HS, MS Pro-HG, MS Pro  
• Memory Stick Duo 1.10  
• xD-Picture Card 1.2  
• 8051 8-bit microprocessor  
- 60 MHz - single cycle execution  
- 64 KB ROM | 9 KB RAM  
• Integrated regulator for 1.8 V core operation  
1.2  
Software Features  
• Hub and flash media reader/writer configuration from a single source:  
External I2C ROM or external SPI ROM  
• If the OEM is using an external EEPROM or an external SPI ROM, the following features are available:  
- Customizable vendor ID, product ID, and device ID  
- 12-hex digits maximum for the serial number string  
- 28-character manufacturer ID and product strings for the flash media reader/writer  
1.3  
OEM Selectable Hub Features  
A default configuration is available in the USB2660/USB2660i following a reset. The USB2660/USB2660i may also be  
configured by an external I2C EEPROM or via external SPI ROM flash.  
• Compound Device support on a port-by-port basis  
- a port is permanently hardwired to a downstream USB peripheral device  
• Select over-current sensing and port power control on an individual or ganged (all ports together) basis to match  
the OEM’s choice of circuit board component selection  
• Port power control and over-current detection/delay features  
• Configure the delay time for filtering the over-current sense inputs  
• Configure the delay time for turning on downstream port power  
• Bus- or self-powered selection  
• Hub port disable or non-removable configurations  
• Flexible port mapping and disable sequencing supports multiple platform designs  
• Programmable USB differential-pair pin location eases PCB layout by aligning USB signal lines directly to connec-  
tors  
• Programmable USB signal drive strength recovers USB signal integrity using 4 levels of signal drive strength  
• Indicate the maximum current that the 2-port hub consumes from the USB upstream port  
• Indicate the maximum current required for the hub controller  
2010-2019 Microchip Technology Inc.  
DS00001931B-page 5  
USB2660/USB2660i  
2.0  
BLOCK DIAGRAM  
FIGURE 2-1:  
USB2660/USB2660I BLOCK DIAGRAM  
DS00001931B-page 6  
2010-2019 Microchip Technology Inc.  
USB2660/USB2660i  
3.0  
PIN CONFIGURATION  
FIGURE 3-1:  
USB2660/USB2660I 64-PIN QFN  
SPI_CE_n  
SPI_CLK / SCL  
SD1_CMD / MS_D0 / xD_CLE  
SD1_D5 / MS_D1 / xD_ALE  
xD_nWE  
49  
50  
51  
52  
53  
54  
55  
56  
57  
58  
59  
60  
61  
62  
63  
64  
32  
31  
30  
29  
28  
27  
26  
25  
24  
23  
22  
21  
20  
19  
18  
17  
SPI_DO / SDA / SPI_SPD_SEL  
SPI_DI  
SD1_CLK / MS_BS / xD_nWP  
SD1_D6 / MS_D7 / xD_D0  
SD1_D7 / MS_D6 / xD_D1  
SD1_D0 / MS_D4 / xD_D2  
SD1_D1 / MS_D5 / xD_D3  
VDD33  
LED / TXD  
nRESET  
VBUS_DET  
TEST  
USB2660/USB2660i  
(Top View QFN-64)  
VDD33  
USBUP_DP  
USBUP_DM  
XTAL2  
CRFILT  
SD1_nCD  
SD1_WP / MS_SCLK / xD_D4  
SD2_D2  
XTAL1 (CLKIN)  
PLLFILT  
SD2_D3  
Ground Pad  
(must be connected to VSS)  
RBIAS  
SD2_D4  
VDD33  
SD2_CMD  
Indicates pins on the bottom of the device.  
2010-2019 Microchip Technology Inc.  
DS00001931B-page 7  
USB2660/USB2660i  
3.1  
64-Pin Table  
TABLE 3-1:  
USB2660/USB2660I 64-PIN TABLE  
SECURE DIGITAL / MEMORY STICK / xD INTERFACE (18 PINS)  
SD1_D7 /  
MS_D6 /  
xD_D1  
SD1_D6 /  
MS_D7 /  
xD_D0  
SD1_D5 /  
MS_D1 /  
xD_ALE  
SD1_D4 /  
MS_D2 /  
xD_D7  
SD1_D3 /  
MS_D3 /  
xD_D6  
SD1_D2 /  
xD_D5  
SD1_D1 /  
MS_D5 /  
xD_D3  
SD1_D0 /  
MS_D4 /  
xD_D2  
SD1_CLK /  
MS_BS /  
SD1_CMD /  
MS_D0 /  
SD1_nCD  
MS_INS  
xD_ nWP  
xD_CLE  
SD1_WP /  
MS_SCLK /  
xD_D4  
xD_nCD  
xD_nB/R  
xD_nRE  
xD_nCE  
xD_nWE  
SECOND SECURE DIGITAL INTERFACE (12 PINS)  
SD2_D7  
SD2_D3  
SD2_D6  
SD2_D2  
SD2_CLK  
SD2_D5  
SD2_D1  
SD2_D4  
SD2_D0  
SD2_W  
SD2_NCD  
SD2_CMD  
USB INTERFACE (5 PINS)  
USBUP_DP  
RBIAS  
USBUP_DM  
XTAL1 (CLKIN)  
XTAL2  
PRTCTL3  
SPI_DI  
2-PORT USB INTERFACE (7 PINS)  
USBDN_DP2  
USBDN_DP3  
USBDN_DM2  
USBDN_DM3  
PRTCTL2  
VBUS_DET  
SPI INTERFACE (4 PINS)  
SPI_CE_n  
SPI_CLK /  
SCL  
SPI_DO /  
SDA /  
SPI_SPD_SEL  
MISC (8 PINS)  
nRESET  
TEST  
LED  
CRD_PWR2  
CRD_PWR1  
(3) NC  
POWER (10 PINS)  
(8) VDD33  
CRFILT  
PLLFILT  
TOTAL 64  
DS00001931B-page 8  
2010-2019 Microchip Technology Inc.  
USB2660/USB2660i  
4.0  
PIN DESCRIPTIONS  
This section provides a detailed description of each signal. The signals are arranged in functional groups according to  
their associated interface. The pin descriptions below are applied when using the internal default firmware and can be  
referenced in Section 6.0, "Configuration Options," on page 22. Please reference Section Appendix A:, "Acronyms," on  
page 55 for a list of the acronyms used.  
The “n” symbol in the signal name indicates that the active, or asserted, state occurs when the signal is at a low voltage  
level. When “n” is not present in the signal name, the signal is asserted at a high voltage level.  
The terms assertion and negation are used exclusively. This is done to avoid confusion when working with a mixture of  
“active low” and “active high” signals. The term assert, or assertion, indicates that a signal is active, independent of  
whether that level is represented by a high or low voltage. The term negate, or negation, indicates that a signal is inac-  
tive.  
4.1  
USB2660/USB2660i Pin Descriptions  
TABLE 4-1:  
Symbol  
USB2660/USB2660I PIN DESCRIPTIONS  
64-PIN Buffer Type  
Description  
QFN  
(Table 4-2)  
SECURE DIGITAL INTERFACE  
SD1_D[7:0]  
27  
28  
31  
38  
40  
41  
25  
26  
I/O8PU  
Secure Digital Data 7-0  
These are the bi-directional data signals SD_D0 - SD_D7 with weak  
pull-up resistors.  
SD1_CLK  
SD1_CMD  
29  
O8  
Secure Digital Clock  
This is an output clock signal to the SD/MMC device.  
Secure Digital Command  
32  
I/O8PU  
This is a bi-directional signal that connects to the CMD signal of the  
SD/MMC device. The bi-directional signal has a weak internal pull-up  
resistor.  
SD1_nCD  
SD1_WP  
22  
21  
I/O8PU  
I/O8  
Secure Digital Card Detect  
Designates as the Secure Digital card detection pin and has an internal  
pull-up.  
Secure Digital Write Protected  
Designates as the Secure Digital card mechanical write protect detect  
pin.  
SECOND SECURE DIGITAL INTERFACE  
SD2_D[7:0]  
11  
12  
16  
18  
19  
20  
9
I/O8PU  
SD2 Data 7-0  
These are the bi-directional data signals SD2_D0 - SD2_D7 and have  
weak pull-up resistors.  
10  
SD2_CLK  
13  
O8  
SD2 Clock  
This is an output clock signal designated for to the SD2/MMC device.  
2010-2019 Microchip Technology Inc.  
DS00001931B-page 9  
USB2660/USB2660i  
TABLE 4-1:  
Symbol  
USB2660/USB2660I PIN DESCRIPTIONS (CONTINUED)  
64-PIN Buffer Type  
Description  
QFN  
(Table 4-2)  
SD2_CMD  
17  
I/O8PU  
SD2 Command  
This is a bi-directional signal designated by for the CMD signal of the  
SD2/MMC device. The bi-directional signal has a weak internal pull-up  
resistor.  
SD2_nCD  
SD2_WP  
8
I/O8  
I/O8  
SD2 Card Detect  
Designates as the second Secure Digital card detection pin and has an  
internal pull-up.  
45  
SD2 Write Protected  
Designates as the second Secure Digital card interface mechanical  
write detect pin.  
MEMORY STICK INTERFACE  
MS_BS  
MS_INS  
29  
O8  
Memory Stick Bus State  
This pin is connected to the bus state pin of the MS device. It is used  
to control the Bus States 0, 1, 2, and 3 (BS0, BS1, and BS3) of the MS  
device.  
39  
21  
IPU  
Memory Stick Card Insertion  
Designates as the Memory Stick card detection pin and has a weak  
internal pull-up resistor.  
MS_SCLK  
MS_D[7:0]  
O8  
Memory Stick System Clock  
This pin is an output clock signal to the MS device.  
Memory Stick System Data In/Out  
28  
27  
25  
26  
40  
38  
31  
32  
I/O8PD  
These pins are the bi-directional data signals for the MS device. In serial  
mode, the most significant bit (MSB) of each byte is transmitted first by  
either MSC or MS device on MS_D0.  
MS_D0, MS_D2, and MS_D3 have weak pull-down resistors. MS_D1  
has a pull-down resistor if in parallel mode, otherwise it is disabled. In  
4- or 8-bit parallel modes, all MS_D7 - MS_D0 signals have weak pull-  
down resistors.  
xD-PICTURE CARD INTERFACE  
xD_D[7:0]  
38  
40  
41  
21  
25  
26  
27  
28  
I/O8PD  
xD-Picture Card Data 7-0  
These pins are the bi-directional data signals xD_D7 - xD_D0 and have  
weak internal pull-down resistors.  
xD_ALE  
31  
O8PD  
xD-Picture Card Address Strobe  
This pin is an active high Address Latch Enable (ALE) signal for the xD  
device. This pin has a weak pull-down resistor that is permanently  
enabled.  
DS00001931B-page 10  
2010-2019 Microchip Technology Inc.  
USB2660/USB2660i  
TABLE 4-1:  
Symbol  
USB2660/USB2660I PIN DESCRIPTIONS (CONTINUED)  
64-PIN Buffer Type  
Description  
QFN  
(Table 4-2)  
xD_nB/R  
36  
IPU  
xD-Picture Card Busy or Data Ready  
This pin is connected to the BSY/RDY pin of the xD-Picture Card  
device.  
When using the internal FET, this pin has an internal weak pull-up  
resistor that is tied to the output of the internal power FET.  
If an external FET is used (the internal FET is disabled), then the  
internal pull-up is not available (an external pull-up is required).  
xD_nCE  
34  
O8PU  
xD-Picture Card Chip Enable  
This pin is an active low chip enable signal for the xD-Picture Card  
device.  
When using the internal FET, this pin has an internal weak pull-up  
resistor that is tied to the output of the internal power FET.  
If an external FET is used (internal FET is disabled), then the internal  
pull-up is not available (an external pull-up is required).  
xD_CLE  
32  
O8PD  
xD-Picture Card Command Strobe  
This pin is an active high Command Latch Enable signal for the xD  
device. This pin has a weak pull-down resistor that is permanently  
enabled.  
xD_nCD  
xD_nRE  
37  
35  
I/O8  
xD-Picture Card Detection  
Designates as the xD-Picture Card detection pin.  
xD-Picture Card Read Enable  
O8PU  
This pin is an active low read strobe signal for the xD-Picture Card  
device.  
When using the internal FET, this pin has an internal weak pull-up  
resistor that is tied to the output of the internal power FET.  
If an external FET is used (internal FET is disabled), then the internal  
pull-up is not available (an external pull-up is required).  
xD_nWE  
30  
O8PU  
xD-Picture Card Write Enable  
This pin is an active low write strobe signal for the xD-Picture Card  
device.  
When using the internal FET, this pin has an internal weak pull-up  
resistor that is tied to the output of the internal power FET.  
If an external FET is used (internal FET is disabled), then the internal  
pull-up is not available (an external pull-up is required).  
xD_nWP  
29  
O8PD  
xD-Picture Card Write Protect  
This pin is an active low write protect signal for the xD-Picture Card  
device. This pin has a weak pull-down resistor that is permanently  
enabled.  
2010-2019 Microchip Technology Inc.  
DS00001931B-page 11  
USB2660/USB2660i  
TABLE 4-1:  
Symbol  
USB2660/USB2660I PIN DESCRIPTIONS (CONTINUED)  
64-PIN Buffer Type  
Description  
QFN  
(Table 4-2)  
USB INTERFACE  
USB Bus Data  
USBUP_DM  
USBUP_DP  
59  
58  
I/O-U  
These pins connect to the upstream USB bus data signals (host port or  
upstream hub). USBUP_DM and USBUP_DP can be swapped using  
the PortSwap feature (See Section 6.4.4.20, "F1h: Port Swap," on  
page 38).  
USBDN_DM  
[3:2]  
USBDN_DP  
3
1
4
2
I/O-U  
USB Bus Data  
These pins connect to the downstream USB bus data signals and can  
be swapped using the PortSwap feature (See Section 6.4.4.20, "F1h:  
Port Swap," on page 38).  
[3:2]  
PRTCTL[3:2]  
7
6
I/OD6  
PU  
USB Power Enable  
As an output, these pins enable power to downstream USB peripheral  
devices and have weak internal pull-up resistors. See Section 4.3, "Port  
Power Control" for diagram and usage instructions.  
As an input, when the power is enabled, these pins monitor the over-  
current condition. When an over-current condition is detected, the pins  
turn the power off.  
VBUS_DET  
55  
I
Detect Upstream VBUS Power  
Detects the state of upstream VBUS power. The hub monitors  
VBUS_DET to determine when to assert the internal D+ pull-up resistor  
(signaling a connect event).  
When designing a detachable hub, connect this pin to the VBUS power  
pin of the USB port that is upstream of the hub.  
For self-powered applications with a permanently attached host, this pin  
should be pulled up, typically to VDD33.  
VBUS is a 3.3 volt input. A resistor divider must be used if connecting  
to 5 volts of USB power.  
RBIAS  
XTAL1 (CLKIN)  
XTAL2  
63  
61  
60  
I-R  
USB Transceiver Bias  
A 12.0 k, 1.0% resistor is attached from VSS to this pin in order to  
set the transceiver's internal bias currents.  
ICLKx  
OCLKx  
24 MHz Crystal Input or External Clock Input  
This pin can be connected to one terminal of the crystal or it can be  
connected to an external 24 MHz clock when a crystal is not used.  
24 MHz Crystal Output  
This is the other terminal of the crystal, or it is left open when an  
external clock source is used to drive XTAL1(CLKIN).  
SPI INTERFACE  
SPI_CE_n  
49  
50  
O12  
SPI Chip Enable  
This is the active low chip enable output. If the SPI interface is enabled,  
this pin must be driven high in power down states.  
SPI_CLK  
SCL  
I/O12  
I/O6  
This is the SPI clock out to the serial ROM. See Section 4.4, "ROM  
BOOT Sequence" for diagram and usage instructions. During reset,  
drive this pin low.  
When configured, this is the I2C EEPROM clock pin.  
DS00001931B-page 12  
2010-2019 Microchip Technology Inc.  
USB2660/USB2660i  
TABLE 4-1:  
Symbol  
USB2660/USB2660I PIN DESCRIPTIONS (CONTINUED)  
64-PIN Buffer Type  
Description  
QFN  
(Table 4-2)  
SPI_DO /  
SDA /  
51  
I/O12  
This is the data out for the SPI port. See Section 4.4, "ROM BOOT  
Sequence" for diagram and usage instructions.  
This pin is the data pin when the device is connected to the optional I2C  
EEPROM.  
I/O6  
SPI_SPD_SEL  
I/O12  
This pin is used to select the speed of the SPI interface. During  
nRESET assertion, this pin will be tri-stated with the weak pull-down  
resistor enabled. When nRESET is negated, the value on the pin will be  
internally latched, and the pin will revert to SPI_DO functionality, the  
internal pull-down will be disabled.  
‘0’ = 30 MHz (No external resistor should be applied.)  
‘1’ = 60 MHz (A 10 K external pull-up resistor must be applied.)  
If the latched value is '1', then the pin is tri-stated when the chip is in  
the suspend state.  
If the latched value is '0', then the pin is driven low during a suspend  
state.  
SPI_DI  
LED  
52  
53  
I/O12PD  
This is the data in to the controller from the ROM. This pin has a weak  
internal pull-down applied at all times to prevent floating.  
MISC  
I/O6  
It can be used as an LED output.  
NC  
44  
15  
CRD_PWR2  
I/O200  
Card power drive: 3.3 V (100 mA or 200 mA)  
This pin specifically powers the second Secure Digital interface (slot).  
Please reference Section 6.4.5.9, "147h-14Bh: Device to LUN  
Mapping," on page 42.  
CRD_PWR1  
REG_EN  
43  
I/O200  
Card power drive: 3.3 V (100 mA or 200 mA)  
This pin powers the multiplexed flash media interface (slot) for xD, MS,  
and SD/MMC.  
Please reference Section 6.4.2.3, "A4h-A5h: Smart Media Device  
Power Configuration," on page 30.  
IPU  
REG_EN: This pin is internally pulled up to enable the internal 1.8 V  
regulators.  
In order to disable the regulators, this pin will need to be externally  
connected to ground.  
When the internal regulator is enabled, the  
1.8 V power pins must be left unconnected, except for the required  
bypass capacitors.  
nRESET  
TEST  
54  
56  
IS  
I
RESET Input  
The system uses this active low signal reset the chip. The active low  
pulse should be at least 1 s wide.  
TEST Input  
Tie this pin to ground for normal operation.  
2010-2019 Microchip Technology Inc.  
DS00001931B-page 13  
USB2660/USB2660i  
TABLE 4-1:  
Symbol  
USB2660/USB2660I PIN DESCRIPTIONS (CONTINUED)  
64-PIN Buffer Type  
Description  
QFN  
(Table 4-2)  
DIGITAL / POWER / GROUND  
CRFILT  
PLLFILT  
23  
VDD Core Regulator Filter Capacitor  
This pin requires a 1.0 F (or greater) 20% (ESR <0.1) capacitor to  
VSS.  
62  
Phase-locked Loop Regulator Filter Capacitor  
This pin requires 1.0 F (or greater) 20% (ESR <0.1) capacitor to  
VSS.  
VDD33  
5
3.3 V Power and Regulator Input  
14  
24  
33  
42  
47  
57  
64  
Please refer to Section 8.0, "DC Parameters," on page 47 for more  
information.  
Pins 24 and 64 require external bypass capacitors of 4.7 F minimum.  
VSS  
NC  
ePad  
The ground pad is the only VSS for the device and must be tied to  
ground with multiple vias.  
46  
48  
No Connect pins  
No trace or signal should be routed/attached to these pins.  
DS00001931B-page 14  
2010-2019 Microchip Technology Inc.  
USB2660/USB2660i  
4.2  
Buffer Type Descriptions  
TABLE 4-2:  
Buffer  
USB2660/USB2660I BUFFER TYPE DESCRIPTIONS  
Description  
I
Input.  
IPU  
Input with weak internal pull-up.  
Input with Schmitt trigger.  
IS  
I/O6  
I/OD6PU  
O8  
Input/output buffer with 6 mA sink and 6 mA source.  
Input/open drain output buffer with a 6 mA sink.  
Output buffer with an 8 mA sink and an 8 mA source.  
O8PD  
Output buffer with an 8 mA sink and an 8 mA source with a weak internal pull-  
down resistor.  
O8PU  
Output buffer with an 8 mA sink and an 8 mA source with a weak internal pull-up  
resistor.  
I/O8  
Input/output buffer with an 8 mA sink and an 8 mA source.  
I/O8PD  
Input/output buffer with an 8 mA sink and an 8 mA source with a weak internal  
pull-down resistor.  
I/O8PU  
Input/output buffer with an 8 mA sink and an 8 mA source with a weak internal  
pull-up resistor.  
O12  
Output buffer with a 12 mA sink and a 12 mA source.  
Input/output buffer with 12 mA sink and 12 mA source.  
I/O12  
I/O12PD  
Input/output buffer with 12 mA sink and 12 mA source with a weak internal pull-  
down resistor.  
I/O200  
Input/output buffer 12 mA with FET disabled, 100/200 mA source only when the  
FET is enabled.  
ICLKx  
OCLKx  
I/O-U  
I-R  
XTAL clock input.  
XTAL clock output.  
Analog input/output as defined in the USB 2.0 Specification.  
RBIAS.  
4.3  
Port Power Control  
Port Power control using a USB Power Switch  
The USB2660/USB2660i has a single port power control and over-current sense signal for each downstream port.  
When disabling port power, the driver will actively drive a '0'. To avoid unnecessary power dissipation, the internal pull-  
up resistor will be disabled at that time. When port power is enabled, the output driver is disabled, and the pull-up resistor  
is enabled creating an open drain output.  
If there is an over-current situation, the USB Power Switch will assert the open drain OCS signal. The Schmitt trigger  
input will detect this event as a low. The open drain output does not interfere. The internal over-current sense filter han-  
dles the transient conditions, such as low voltage, while the device is powering up.  
2010-2019 Microchip Technology Inc.  
DS00001931B-page 15  
USB2660/USB2660i  
FIGURE 4-1:  
PORT POWER CONTROL WITH USB POWER SWITCH  
5 V  
PRTCTL3  
OCS  
USB Power  
Switch  
EN  
USB  
Device  
USB2660/60i  
5 V  
PRTCTL2  
OCS  
USB Power  
Switch  
EN  
USB  
Device  
4.3.1  
PORT POWER CONTROL USING A POLY FUSE  
When using the USB2660/USB2660i with a poly fuse, an external diode must be used (See Figure 4-2). When disabling  
port power, the USB2660/USB2660i will drive a '0'. This procedure will have no effect since the external diode will isolate  
the pin from the load. When port power is enabled, the USB2660/USB2660i output driver is disabled, and the pull-up  
resistor is enabled which creates an open drain output. This open drain output condition means that the pull-up resistor  
is providing 3.3 volts to the anode of the diode. If there is an over-current situation, the poly fuse will open. This will  
cause the cathode of the diode to go to zero volts. The anode of the diode will be at 0.7 volts, and the Schmitt trigger  
input will register this as a low resulting in an over-current detection. The open drain output does not interfere.  
DS00001931B-page 16  
2010-2019 Microchip Technology Inc.  
USB2660/USB2660i  
FIGURE 4-2:  
PORT POWER CONTROL WITH A SINGLE POLY FUSE AND MULTIPLE LOADS  
5 V  
PRTCTL3  
USB  
Device  
USB2660/60i  
5V  
PRTCTL2  
USB  
Device  
When using a single poly fuse to power all devices, note that for the ganged situation, all power control pins must be  
tied together.  
FIGURE 4-3:  
PORT POWER WITH GANGED CONTROL WITH POLY FUSE  
5 V  
PRTCTL3  
Poly Fuse  
USB2660/60i  
USB  
Device  
USB  
Device  
PRTCTL2  
2010-2019 Microchip Technology Inc.  
DS00001931B-page 17  
USB2660/USB2660i  
4.4  
ROM BOOT Sequence  
After power-on reset, the internal firmware checks for an external SPI flash device that contains a valid signature of  
"2DFU" (device firmware upgrade) beginning at address 0xFFFA. If a valid signature is found, then the external ROM  
is enabled and code execution begins at address 0x0000 in the external SPI device. Otherwise, code execution contin-  
ues from the internal ROM.  
If there is no SPI ROM detected, the internal firmware then checks for the presence of an I2C ROM. The firmware looks  
for the signature ‘ATA2’ at the offset of FCh-FFh and ‘ecf1’ at the offset of 17Ch-17Fh in the I2C ROM. The firmware  
reads in the I2C ROM to configure the hardware and software internally. Please refer to Section 6.3.2, "EEPROM Data  
Descriptor," on page 23 for the details of the configuration options.  
The SPI ROM required for the USB2660/USB2660i is a recommended minimum of 1 Mbit and support either 30 MHz  
or 60 MHz. The frequency used is set using the SPI_SPD_SEL. For 30 MHz operation, this pin must be pulled to ground  
through a 100 kresistor. For 60 MHz operation, this pin must pulled up through a 100 kresistor.  
The SPI_SPD_SEL pin is used to choose the speed of the SPI interface. During nRESET assertion, this pin will be tri-  
stated with the weak pull-down resistor enabled. When nRESET is negated, the value on the pin will be internally  
latched, and the pin will revert to SPI_DO functionality. The internal pull-down will be disabled.  
The firmware can determine the speed of operation on the SPI port by checking the SPI_SPEED in the SPI_CTL register  
(0x2400 - RESET = 0x02). Both 1- and 2-bit SPI operation is supported. For optimum throughput, a 2-bit SPI ROM is  
recommended. Both mode 0 and mode 3 SPI ROMS are also supported.  
FIGURE 4-4:  
SPI ROM CONNECTION  
SPI_CE_n  
CE#  
CLK  
SPI_CLK / SCL  
SPI ROM  
USB2660/60i  
SPI_DO / SDA / SPI_SPD_SEL  
SPI_DI  
SI  
SO  
2
FIGURE 4-5:  
I C CONNECTION  
3. 3V  
10K  
SCL  
3. 3V  
10K  
I2C ROM  
USB2660/60i  
SDA  
DS00001931B-page 18  
2010-2019 Microchip Technology Inc.  
USB2660/USB2660i  
5.0  
PIN RESET STATES  
FIGURE 5-1:  
PIN RESET STATES  
Hardware  
Firmware  
Initialization  
Operational  
Voltage  
Signal  
RESET  
(v)  
RESET  
VDD33  
Time  
(t)  
VSS  
TABLE 5-1:  
Symbol  
LEGEND FOR PIN RESET STATES TABLE  
Description  
0
Output driven low  
1
Output driven high  
IP  
Input enabled  
PU  
PD  
none  
--  
Hardware enables pull-up  
Hardware enables pull-down  
Hardware disables pad  
Hardware disables function  
Z
Hardware disables pad. Both output driver and  
input buffers are disabled.  
5.1  
Pin Reset States  
TABLE 5-2:  
USB2660/USB2660I RESET STATES TABLE  
Reset State  
Input/  
Output  
Pin  
1
Pin Name  
USBDN_DM2  
USBDN_DP2  
USBDN_DM3  
USBDN_DP3  
PRTCTL2  
Function  
PU/PD  
PD  
PD  
PD  
PD  
--  
USBDN_DM2  
USBDN_DP2  
USBDN_DM3  
USBDN_DP3  
PRTCTL  
IP  
IP  
IP  
IP  
0
2
3
4
6
7
PRTCTL3  
PRTCTL  
0
--  
8
SD2_nCD  
none  
IP  
Z
PU  
--  
9
SD2_D1  
SD2_D1  
2010-2019 Microchip Technology Inc.  
DS00001931B-page 19  
USB2660/USB2660i  
TABLE 5-2:  
USB2660/USB2660I RESET STATES TABLE (CONTINUED)  
Reset State  
Input/  
Output  
Pin  
10  
11  
12  
13  
15  
16  
17  
18  
19  
20  
21  
22  
25  
26  
27  
28  
29  
30  
31  
32  
34  
35  
36  
37  
38  
39  
40  
Pin Name  
SD2_D0  
Function  
SD2_D0  
SD2_D7  
SD2_D6  
SD2_CLK  
none  
PU/PD  
--  
Z
Z
Z
Z
Z
Z
Z
Z
Z
Z
0
SD2_D7  
--  
SD2_D6  
--  
SD2_CLK  
--  
CRD_PWR2  
--  
SD2_D5  
SD2_D5  
SD2_CMD  
SD2_D4  
SD2_D3  
SD2_D2  
none  
--  
SD2_CMD  
--  
SD2_D4  
--  
SD2_D3  
--  
SD2_D2  
--  
SD1_WP / MS_SCLK / xD_D4  
SD1_nCD  
--  
none  
IP  
Z
Z
Z
Z
Z
Z
Z
Z
Z
Z
Z
IP  
Z
IP  
Z
PU  
--  
SD1_D1 / MS_D5 / xD_D3  
SD1_D0 / MS_D4 / xD_D2  
SD1_D7 / MS_D6 / xD_D1  
SD1_D6 / MS_D7 / xD_D0  
SD1_CLK / MS_BS / xD_nWP  
xD_nWE  
none  
none  
--  
none  
--  
none  
--  
none  
--  
xD_nWE  
none  
--  
SD1_D5 / MS_D1 / xD_ALE  
SD1_CMD / MS_D0 / xD_CLE  
xD_nCE  
--  
none  
--  
xD_nCE  
xD_nRE  
xD_nB/R  
none  
--  
xD_nRE  
--  
xD_nB/R  
--  
xD_nCD  
PU  
--  
SD1_D4 / MS_D2 / xD_D7  
MS_INS  
none  
none  
PU  
--  
SD1_D3 / MS_D3 / xD_D6  
none  
DS00001931B-page 20  
2010-2019 Microchip Technology Inc.  
USB2660/USB2660i  
TABLE 5-2:  
USB2660/USB2660I RESET STATES TABLE (CONTINUED)  
Reset State  
Input/  
Output  
Pin  
41  
43  
44  
45  
49  
50  
51  
52  
53  
54  
55  
56  
58  
59  
Pin Name  
SD1_D2 / xD_D5  
CRD_PWR1  
NC  
Function  
none  
PU/PD  
Z
Z
--  
--  
none  
none  
0
--  
SD2_WP  
none  
0
--  
SPI_CE_n  
SPI_CE_n  
none  
1
--  
SPI_CLK / SCL  
SPI_DO / SDA / SPI_SPD_SEL  
SPI_DI  
0
--  
none  
0
--  
SPI_DI  
none  
IP  
0
PD  
--  
LED / TXD  
nRESET  
nRESET  
VBUS_DET  
TEST  
IP  
IP  
IP  
Z
--  
VBUS_DET  
TEST  
--  
PD  
--  
USBUP_DP  
USBUP_DM  
USBUP_DP  
USBUP_DM  
Z
--  
2010-2019 Microchip Technology Inc.  
DS00001931B-page 21  
USB2660/USB2660i  
6.0  
6.1  
CONFIGURATION OPTIONS  
Hub  
Microchip’s USB 2.0 hub is fully compliant to the Universal Serial Bus Specification available from the USB Imple-  
menter’s Forum found at http://www.usb.org (Revision 2.0 April 27, 2000 and the 12/7/2000 and 5/28/2002 Errata).  
Please reference Chapter 11 (Hub Specification) for general details regarding hub operation and functionality.  
For performance reasons, the hub provides 1 transaction translator (TT) that is shared by both downstream ports  
defined as a single-TT configuration. The TT contains 4 non-periodic buffers.  
6.1.1  
HUB CONFIGURATION OPTIONS  
The Microchip hub supports a large number of features (some are mutually exclusive), and must be configured in order  
to correctly function when attached to a USB host controller. There are two principal ways to configure the hub:  
• via the internal default settings or  
• by settings stored in an external EEPROM or SPI Flash device.  
6.1.1.1  
Power Switching Polarity  
The hub will only support active high power controllers.  
6.1.2  
VBUS DETECT  
According to Section 7.2.1 of the USB 2.0 Specification, a device cannot provide power to its D+ or D- pull-up resistors  
unless the upstream port’s VBUS is in the asserted (powered) state. The VBUS_DET pin on the hub monitors the state  
of the upstream VBUS signal and will not pull-up the D+ resistor if VBUS is not active. If VBUS goes from an active to  
an inactive state (not powered), the hub will remove power from the D+ pull-up resistor within 10 seconds.  
6.2  
Card Reader  
The Microchip USB2660/USB2660i is fully compliant with the following flash media card reader specifications:  
• Secure Digital 2.0 / MultiMediaCard 4.2  
- SD 2.0, HS-SD, HC-SD  
- TransFlash™ and reduced form factor media  
- 1/4/8 bit MMC 4.2  
• Memory Stick 1.43  
• Memory Stick Pro Format 1.02  
• Memory Stick Pro-HG Duo Format 1.01  
- Memory Stick, MS Duo, HS-MS, MS Pro-HG, MS Pro  
• Memory Stick Duo 1.10  
• xD-Picture Card 1.2  
6.3  
System Configurations  
6.3.1  
EEPROM/SPI INTERFACE  
The USB2660/USB2660i can be configured via a 2-wire (I2C) EEPROM (512x8) or an external SPI flash device con-  
taining the firmware for the USB2660/USB2660i. If an external configuration device does not exist the internal default  
values will be used. If one of the external devices is used for configuration, the OEM can update the values through the  
USB interface. The hub will then “attach” to the upstream USB host.  
The USBDM tool set is available in the USB264x Hub Card reader combo software release package. To download the  
software package from Microchip's website, please visit:  
http://www.microchip.com/search/searchapp/searchhome.aspx?id=2&q=mkt/CW_SFT_PUB.nsf/Agree-  
ments/OBJ+Hub+Card+Reader  
to go to the OBJ Hub Card Reader Software Download Agreement. Review the license, and if you agree, check the "I  
agree" box and then select “Confirm”. You will then be able to download USB264x Hub Card reader combo release  
package zip file containing the USBDM tool set.  
DS00001931B-page 22  
2010-2019 Microchip Technology Inc.  
USB2660/USB2660i  
Please note that the following applies to the system values and descriptions when used:  
• N/A = Not applicable to this part  
• Reserved = For internal use  
6.3.2  
EEPROM DATA DESCRIPTOR  
INTERNAL FLASH MEDIA CONTROLLER CONFIGURATIONS  
TABLE 6-1:  
Address  
00h  
Register Name  
Description  
Internal Default Value  
USB_SER_LEN  
USB Serial String  
Descriptor Length  
1Ah  
01h  
USB_SER_TYP  
USB_SER_NUM  
USB Serial String  
Descriptor Type  
03h  
02h-19h  
USB Serial Number  
"000008264001"  
(See Note 6-1)  
1Ah-1Bh  
1Ch-1Dh  
1Eh  
USB_VID  
USB_PID  
USB Vendor Identifier  
USB Product Identifier  
0424  
4040  
04h  
USB_LANG_LEN  
USB Language String Descriptor  
Length  
1Fh  
20h  
USB_LANG_TYP  
USB_LANG_ID_LSB  
USB_LANG_ID_MSB  
USB_MFR_STR_LEN  
USB_MFR_STR_TYP  
USB_MFR_STR  
USB Language String Descriptor  
Type  
03h  
USB Language Identifier  
Least Significant Byte  
09h  
(See Note 6-3)  
21h  
USB Language Identifier  
Most Significant Byte  
04h  
(See Note 6-3)  
22h  
USB Manufacturer String  
Descriptor Length  
10h  
03h  
23h  
USB Manufacturer String  
Descriptor Type  
24h-31h  
USB Manufacturer String  
“Generic”  
(See Note 6-1)  
32h-5Dh  
5Eh  
Reserved  
-
00h  
30h  
USB_PRD_STR_LEN  
USB Product String  
Descriptor Length  
5Fh  
USB_PRD_STR_TYP  
USB_PRD_STR  
USB Product String  
Descriptor Type  
03h  
60h-99h  
USB Product String  
"Ultra Fast Media Reader"  
(See Note 6-1)  
9Ah  
9Bh  
9Ch  
9Dh  
9Eh  
9Fh  
A0h  
USB_BM_ATT  
USB_MAX_PWR  
ATT_LB  
USB BmAttribute  
USB Max Power  
Attribute Lo byte  
Attribute Hi Lo byte  
Attribute Lo Hi byte  
Attribute Hi byte  
80h  
30h (96 mA)  
40h (Reverse SD_WP only)  
ATT_HLB  
80h (Reverse SD2_WP only)  
ATT_LHB  
00h  
00h  
00h  
ATT_HB  
MS_PWR_LB  
Memory Stick Device  
Power Lo byte  
A1h  
MS_PWR_HB  
Memory Stick Device  
Power Hi byte  
0Ah  
A2h-A3h  
A4h  
Not Applicable  
SM_PWR_LB  
-
00h  
Smart Media Device  
Power Lo byte  
00h  
(See Note 6-2)  
A5h  
SM_PWR_HB  
Smart Media Device  
Power Hi byte  
0Ah  
(See Note 6-2)  
2010-2019 Microchip Technology Inc.  
DS00001931B-page 23  
USB2660/USB2660i  
TABLE 6-1:  
Address  
A6h  
INTERNAL FLASH MEDIA CONTROLLER CONFIGURATIONS (CONTINUED)  
Register Name  
Description  
Internal Default Value  
SD_PWR_LB  
Secure Digital Device  
Power Lo byte  
00h  
A7h  
SD_PWR_HB  
Secure Digital Device  
Power Hi byte  
0Ah  
A8h  
LED_BLK_INT  
LED_BLK_DUR  
DEV0_ID_STR  
DEV1_ID_STR  
DEV2_ID_STR  
LED Blink Interval  
02h  
28h  
A9h  
LED Blink After Access  
Device 0 Identifier String  
Device 1 Identifier String  
Device 2 Identifier String  
AAh - B0h  
B1h - B7h  
B8h - BEh  
N/A  
“MS”  
“SM”  
(See Note 6-2)  
BFh - C5h  
C6h - CDh  
CEh - D2h  
D3h  
DEV3_ID_STR  
INQ_VEN_STR  
INQ_PRD_STR  
DYN_NUM_LUN  
DEV_LUN_MAP  
Reserved  
Device 3 Identifier String  
Inquiry Vendor String  
Inquiry Product String  
Dynamic Number of LUNs  
Device to LUN Mapping  
-
“SD/MMC”  
“Generic”  
82660  
01h  
D4h - D7h  
D8h - DAh  
DBh - DDh  
FFh, 00h, 00h, 00h  
00h, 06h, 0Dh  
59h, 56h, 97h  
Reserved  
-
TABLE 6-2:  
Address  
HUB CONTROLLER CONFIGURATIONS  
Register Name  
Description  
Internal Default Value  
DEh  
DFh  
E0h  
E1h  
E2h  
E3h  
E4h  
E5h  
E6h  
E7h  
E8h  
E9h  
EAh  
EBh  
ECh  
EDh  
EEh  
EFh  
F0h  
F1h  
F2h  
F3h  
VID_LSB  
VID_MSB  
Vendor ID Least Significant Byte  
Vendor ID Most Significant Byte  
Product ID Least Significant Byte  
Product ID Most Significant Byte  
Device ID Least Significant Byte  
Device ID Most Significant Byte  
Configuration Data Byte 1  
Configuration Data Byte 2  
Configuration Data Byte 3  
Non-Removable Devices  
Port Disable (Self)  
24h  
04h  
60h  
26h  
A1h  
08h  
8Bh  
28h  
00h  
02h  
00h  
00h  
01h  
32h  
01h  
32h  
32h  
00h  
00h  
00h  
00h  
00h  
PID_LSB  
PID_MSB  
DID_LSB  
DID_MSB  
CFG_DAT_BYT1  
CFG_DAT_BYT2  
CFG_DAT_BYT3  
NR_DEVICE  
PORT_DIS_SP  
PORT_DIS_BP  
MAX_PWR_SP  
MAX_PWR_BP  
HC_MAX_C_SP  
HC_MAX_C_BP  
PWR_ON_TIME  
BOOST_UP  
BOOST_3:0  
PRT_SWP  
Port Disable (Bus)  
Max Power (Self)  
Max Power (Bus)  
Hub Controller Max Current (Self)  
Hub Controller Max Current (Bus)  
Power-on Time  
Boost_Up  
Boost_3:0  
Port Swap  
PRTM12  
Port Map 12  
PRTM3  
Port Map 3  
DS00001931B-page 24  
2010-2019 Microchip Technology Inc.  
USB2660/USB2660i  
TABLE 6-3:  
Address  
OTHER INTERNAL CONFIGURATIONS  
Register Name  
Description  
Internal Default Value  
F4h  
F5h  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
-
00h  
66h  
F6h  
Reserved  
00h  
F7h  
Reserved  
00h  
F8h-FAh  
FBh  
Reserved  
59h, 56h, 97h  
00h  
Not Applicable  
NVSTORE_SIG  
FCh-FFh  
Non-Volatile Storage Signature  
“ATA2”  
6.4  
Set bit 7 of bmAttribute to enable the registers in Table 6-4.  
TABLE 6-4:  
Address  
INTERNAL FLASH MEDIA CONTROLLER EXTENDED CONFIGURATIONS  
Register Name  
Description  
Internal Default Value  
100h - 106h  
107h - 10Dh  
10Eh - 114h  
115h - 11Bh  
11Ch - 122h  
123h - 129h  
12Ah-145h  
CLUN0_ID_STR  
CLUN1_ID_STR  
CLUN2_ID_STR  
CLUN3_ID_STR  
CLUN4_ID_STR  
DEV4_ID_STR  
Not applicable  
Combo LUN 0 Identifier String  
Combo LUN 1 Identifier String  
Combo LUN 2 Identifier String  
Combo LUN 3 Identifier String  
Combo LUN 4 Identifier String  
Device 4 Identifier String  
-
“COMBO”  
“COMBO”  
“COMBO”  
“COMBO”  
“COMBO”  
"SD/MMC2"  
00h  
12Ah - 130h  
131h - 137h  
138h - 13Eh  
13Fh - 145h  
00h  
00h  
00h  
00h  
DYN_NUM_  
EXT_LUN  
146h  
Dynamic Number of Extended LUNs  
Device to LUN Mapping  
01h  
147h - 14Bh  
14Ch  
DEV_LUN_MAP  
SD2_PWR_LB  
01h, FFh, FFh, FFh, FFh  
0Ah  
Second Secure Digital  
Power Lo byte-  
14Dh  
SD2_PWR_HB  
Second Secure Digital  
Power Hi byte  
00h  
14Eh-17Bh  
Not Applicable  
-
00h  
17Ch-17Fh  
NVSTORE_SIG2  
Non-Volatile Storage Signature  
“ecf1”  
Note 6-1  
This value is a UNICODE UTF-16LE encoded string value that meets the USB 2.0 specification  
(Revision 2.0, 2000). Values in double quotations without this note are ASCII values.  
Note 6-2  
Note 6-3  
A value of “SM” will be overridden with “xD” once an xD-Picture Card has been identified.  
For a list of the most current 16-bit language ID’s defined by the USB-IF, please visit  
http://www.unicode.org or consult The Unicode Standard, Worldwide Character Encoding, (Version  
4.0), The Unicode Consortium, Addison-Wesley Publishing Company, Reading, Massachusetts.  
2010-2019 Microchip Technology Inc.  
DS00001931B-page 25  
USB2660/USB2660i  
6.4.1  
EEPROM DATA DESCRIPTOR REGISTER DESCRIPTIONS  
00h: USB Serial String Descriptor Length  
6.4.1.1  
Byte  
Name  
Description  
0
USB_SER_LEN  
USB serial string descriptor length as defined by Section 9.6.7 “String” of the  
USB 2.0 Specification (Revision 2.0, 2000). This field is the “bLength” which  
describes the size of the string descriptor (in bytes).  
6.4.1.2  
01h: USB Serial String Descriptor Type  
Byte  
Name  
Description  
1
USB_SER_TYP  
USB serial string descriptor type as defined by Section 9.6.7 “String” of the  
USB 2.0 Specification (Revision 2.0, 2000). This field is the “bDescriptorType”  
which is a constant value associated with a string descriptor type.  
6.4.1.3  
02h-19h: USB Serial Number Option  
Byte  
25:2  
Name  
Description  
Maximum string length is 12 hex digits. Must be unique to each device.  
USB_SER_NUM  
6.4.1.4  
1Ah-1Bh: USB Vendor ID Option  
Byte  
Name  
Description  
1:0  
USB_VID  
This ID is unique for every vendor. The vendor ID is assigned by the USB  
Implementer’s Forum.  
6.4.1.5  
1Ch-1Dh: USB Product ID Option  
Byte  
Name  
Description  
This ID is unique for every product. The product ID is assigned by the vendor.  
1:0  
USB_PID  
6.4.1.6  
1Eh: USB Language Identifier Descriptor Length  
Byte  
Name  
Description  
0
USB_LANG_LEN USB language ID string descriptor length as defined by Section 9.6.7 “String”  
of the USB 2.0 Specification (Revision 2.0, 2000). This field is the “bLength”  
which describes the size of the string descriptor (in bytes).  
6.4.1.7  
1Fh: USB Language Identifier Descriptor Type  
Byte  
Name  
Description  
1
USB_LANG_TYP USB language ID string descriptor type as defined by Section 9.6.7 “String” of  
the USB 2.0 Specification (Revision 2.0, 2000). This field is the  
“bDescriptorType” which is a constant value associated with a string descriptor  
type.  
6.4.1.8  
20h: USB Language Identifier Least Significant Byte  
Byte  
Name  
Description  
2
USB_LANG_ID  
_LSB  
English language code = ‘0409’. See Note 6-3 to reference additional language  
ID’s defined by the USB-IF.  
DS00001931B-page 26  
2010-2019 Microchip Technology Inc.  
USB2660/USB2660i  
6.4.1.9  
Byte  
21h: USB Language Identifier Most Significant Byte  
Name  
Description  
3
USB_LANG_ID  
_MSB  
English language code = ‘0409’. See Note 6-3 to reference additional language  
ID’s defined by the USB-IF.  
6.4.1.10  
22h: USB Manufacturer String Descriptor Length  
Byte  
Name  
Description  
0
USB_MFR_STR  
_LEN  
USB manufacturer string descriptor length as defined by Section 9.6.7 “String”  
of the USB 2.0 Specification (Revision 2.0, 2000). This field is the “bLength”  
which describes the size of the string descriptor (in bytes).  
6.4.1.11  
23h: USB Manufacturer String Descriptor Type  
Byte  
Name  
Description  
1
USB_MFR_STR  
_TYP  
USB manufacturer string descriptor type as defined by Section 9.6.7 “String” of  
the USB 2.0 Specification (Revision 2.0, 2000). This field is the  
“bDescriptorType” which is a constant value associated with a string descriptor  
type.  
6.4.1.12  
24h-31h: USB Manufacturer String Option  
Byte  
Name  
Description  
15:2  
USB_MFR_STR  
The maximum string length is 28 characters.  
6.4.1.13  
32h-5Dh: Reserved  
Byte  
Name  
Description  
59:16  
Reserved  
Reserved.  
6.4.1.14  
5Eh: USB Product String Descriptor Length  
Byte  
Name  
Description  
0
USB_PRD_STR  
_LEN  
USB product string descriptor length as defined by Section 9.6.7 “String” of the  
USB 2.0 Specification (Revision 2.0, 2000). This field is the “bLength” which  
describes the size of the string descriptor (in bytes).  
6.4.1.15  
5Fh: USB Product String Descriptor Type  
Byte  
Name  
Description  
1
USB_PRD_STR  
_TYP  
USB product string descriptor type as defined by Section 9.6.7 “String” of the  
USB 2.0 Specification (Revision 2.0, 2000). This field is the “bDescriptorType”  
which is a constant value associated with a string descriptor type.  
6.4.1.16  
60h-99h: USB Product String Option  
Byte  
Name  
Description  
59:2  
USB_PRD_STR  
This string will be used during the USB enumeration process in the Windows®  
operating system. Maximum string length is 28 characters.  
2010-2019 Microchip Technology Inc.  
DS00001931B-page 27  
USB2660/USB2660i  
6.4.1.17  
9Ah: USB BmAttribute (1 byte)  
Bit  
Name  
Description  
7:0  
USB_BM_ATT  
Self- or Bus-Power: Selects between self- and bus-powered operation.  
The hub is either self-powered (draws less than 2 mA of upstream bus power)  
or bus-powered (limited to a 100 mA maximum of upstream power prior to  
being configured by the host controller).  
When configured as a bus-powered device, the Microchip hub consumes less  
than 100 mA of current prior to being configured. After configuration, the bus-  
powered Microchip hub (along with all associated hub circuitry, any embedded  
devices if part of a compound device, and 100 mA per externally available  
downstream port) must consume no more than 500 mA of upstream VBUS  
current. The current consumption is system dependent, and the OEM must  
ensure that the USB 2.0 Specification is not violated.  
When configured as a self-powered device, <1 mA of upstream VBUS current  
is consumed and all ports are available, with each port being capable of  
sourcing 500 mA of current.  
80 = Bus-powered operation (default)  
C0 = Self-powered operation  
A0 = Bus-powered operation with remote wake-up  
E0 = Self-powered operation with remote wake-up  
6.4.1.18  
9Bh: USB MaxPower (1 byte)  
Bit  
Name  
Description  
7:0  
USB_MAX_PWR  
USB Max Power per the USB 2.0 Specification. Do NOT set this value greater  
than 100 mA.  
DS00001931B-page 28  
2010-2019 Microchip Technology Inc.  
USB2660/USB2660i  
6.4.1.19  
9Ch-9Fh: Attribute Byte Descriptions  
Byte  
Byte Name  
Bit  
Description  
0
ATT_LB  
3:0  
4
Always reads ‘0’.  
Inquire Manufacturer and Product ID Strings  
‘1’ - Use the Inquiry Manufacturer and Product ID Strings.  
‘0’ (default) - Use the USB Descriptor Manufacturer and Product ID Strings.  
Always reads ‘0’.  
5
6
Reverse SD Card Write Protect Sense  
‘1’ (default) - SD cards will be write protected when SW_nWP is high, and  
writable when SW_nWP is low.  
‘0’ - SD cards will be write protected when SW_nWP is low, and writable  
when SW_nWP is high.  
7
Extended Configuration Enable  
'1' - This bit must be set to '1' to enable editing, updating, and reading from  
registers 100h-17Fh.  
'0' - The internal configuration is loaded. When this bit is not set (and it  
equals '0'). It will not read from registers 100h-17Fh.  
1
ATT_HLB  
3:0  
4
Always reads ‘0’.  
Activity LED True Polarity  
‘1’ - Activity LED to Low True.  
‘0’ (default) - Activity LED polarity to High True.  
Common Media Insert / Media Activity LED  
5
‘1’ - The activity LED will function as a common media inserted/media access  
LED.  
‘0’ (default) - The activity LED will remain in its idle state until media is  
accessed.  
6
7
Always reads ‘0’.  
Reverse SD2 Card Write Protect Sense  
‘1’ (default) - SD cards in LUN 1 will be write protected when SW_nWP is  
high, and writable when SW_nWP is low.  
‘0’ - SD cards in LUN 1 will be write protected when SW_nWP is low, and  
writable when SW_nWP is high.  
2
ATT_LHB  
0
Attach on Card Insert / Detach on Card Removal  
‘1’ - Attach on Insert is enabled.  
‘0’ (default) - Attach on Insert is disabled.  
Always reads ‘0’.  
1
2
Enable Device Power Configuration  
‘1’ - Custom Device Power Configuration stored in the NVSTORE is used.  
‘0’ (default) - Default Device Power Configuration is used.  
7:3  
6:0  
7
Always reads ‘0’.  
Always reads ‘0’.  
xD Player Mode  
3
ATT_HB  
2010-2019 Microchip Technology Inc.  
DS00001931B-page 29  
USB2660/USB2660i  
6.4.2  
A0H-A7H: DEVICE POWER CONFIGURATION  
The USB2660/USB2660i has two internal FETs which can be utilized for card power. For information about the other  
internal FET, please see Section 6.4.5.10, "14Ch-14Dh: Second Secure Digital Device Power Configuration," on  
page 42. This section describes the default internal configuration. The settings are stored in NVSTORE and provide the  
following features:  
1. A card can be powered by an external FET or by an internal FET.  
2. The power limit can be set to 100 mA or 200 mA (Default) for the internal FET.  
Each media uses two bytes to store its device power configuration. Bit 3 selects between internal or external card power  
FET options. For internal FET card power control, bits 0 through 2 are used to set the power limit. The “Device Power  
Configuration” bits are ignored unless the “Enable Device Power Configuration” bit is set. See Section 6.4.1.19, "9Ch-  
9Fh: Attribute Byte Descriptions," on page 29.  
6.4.2.1  
A0h-A1h: Memory Stick Device Power Configuration  
FET  
Type  
Bits  
Bit Type  
Low Nibble  
Description  
0
1
2
FET Lo Byte  
MS_PWR_LB  
3:0  
7:4  
3:0  
0000b Disabled  
0000b Disabled  
High Nibble  
FET Hi Byte  
MS_PWR_HB  
Low Nibble  
0001b External FET enabled  
1000b Internal FET with 100 mA power limit  
1010b Internal FET with 200 mA power limit  
3
7:4  
High Nibble  
0000b Disabled  
6.4.2.2  
A2h-A3h: Not Applicable  
Byte  
1:0  
Name  
Description  
Not Applicable  
Not applicable.  
6.4.2.3  
A4h-A5h: Smart Media Device Power Configuration  
FET  
Type  
Bits  
Bit Type  
Low Nibble  
Description  
0
1
2
FET Lo Byte  
SM_PWR_LB  
3:0  
7:4  
3:0  
0000b Disabled  
0000b Disabled  
High Nibble  
FET Hi Byte  
SM_PWR_HB  
Low Nibble  
0001b External FET enabled  
1000b Internal FET with 100 mA power limit  
1010b Internal FET with 200 mA power limit  
3
7:4  
High Nibble  
0000b Disabled  
6.4.2.4  
A6h-A7h: Secure Digital Device Power Configuration  
FET  
Type  
Bits  
Bit Type  
Low Nibble  
Description  
0
1
2
FET Lo Byte  
SD_PWR_LB  
3:0  
7:4  
3:0  
0000b Disabled  
0000b Disabled  
High Nibble  
FET Hi Byte  
SD_PWR_HB  
Low Nibble  
0001b External FET enabled  
1000b Internal FET with 100 mA power limit  
1010b Internal FET with 200 mA power limit  
3
7:4  
High Nibble  
0000b Disabled  
DS00001931B-page 30  
2010-2019 Microchip Technology Inc.  
USB2660/USB2660i  
6.4.2.5  
Byte  
A8h: LED Blink Interval  
Name  
Description  
0
LED_BLK_INT  
The blink rate is programmable in 50 ms intervals. The high bit (7) indicates  
an idle state:  
‘0’ - Off  
‘1’ - On  
The remaining bits (6:0) are used to determine the blink interval up to a max  
of 128 x 50 ms.  
6.4.2.6  
A9h: LED Blink Duration  
Byte  
Name  
Description  
1
LED_BLK_DUR  
LED Blink After Access. This byte is used to designate the number of seconds  
that the LED will continue to blink after a drive access. Setting this byte to "05"  
will cause the LED to blink for 5 seconds after a drive access.  
6.4.3  
DEVICE ID STRINGS  
These bytes are used to specify the LUN descriptor returned by the device. These bytes are used in combination with  
the device to LUN mapping bytes in applications where the OEM wishes to reorder and rename the LUNs. If multiple  
devices are mapped to the same LUN (a COMBO LUN), then the CLUN#_ID_STR will be used to name the COMBO  
LUN instead of the individual device strings. When applicable, the "SM" value will be overridden with xD once an xD-  
Picture Card has been identified.  
6.4.3.1  
AAh-B0h: Device 0 Identifier String  
Byte  
6:0  
Name  
Description  
Description  
DEV0_ID_STR  
Not applicable.  
6.4.3.2  
B1h-B7h: Device 1 Identifier String  
Byte  
Name  
6:0  
DEV1_ID_STR  
This ID string is associated with the Memory Stick device.  
6.4.3.3  
B8h-BEh: Device 2 Identifier String  
Byte  
Name  
Description  
This ID string is associated with the Smart Media (Note 6-2) device.  
6:0  
DEV2_ID_STR  
6.4.3.4  
BFh-C5h: Device 3 Identifier String  
Byte  
Name  
Description  
This ID string is associated with the Secure Digital / MultiMediaCard device.  
6:0  
DEV3_ID_STR  
6.4.3.5  
C6h-CDh: Inquiry Vendor String  
Byte  
Name  
Description  
7:0  
INQ_VEN_STR  
If bit 4 of the 1st attribute byte is set, the device will use these strings in  
response to a USB inquiry command, instead of the USB descriptor  
manufacturer and product ID strings.  
2010-2019 Microchip Technology Inc.  
DS00001931B-page 31  
USB2660/USB2660i  
6.4.3.6  
CEh-D2h: Inquiry Product String  
Byte  
4:0  
Name  
Description  
INQ_PRD_STR  
If bit 4 of the 1st attribute byte is set, the device will use these strings in  
response to a USB inquiry command, instead of the USB descriptor  
manufacturer and product ID strings.  
6.4.3.7  
D3h: Dynamic Number of LUNs  
Byte  
Name  
Description  
7:0  
DYN_NUM_LUN  
These bytes are used to specify the number of LUNs the device exposes to  
the host. These bytes are also used for icon sharing by assigning more than  
one LUN to a single icon. This is used in applications where the device utilizes  
a combo socket and the OEM wishes to have only a single icon displayed for  
one or more interfaces.  
If this field is set to "FF", the program assumes that you are using the default  
value and icons will be configured per the default configuration.  
6.4.3.8  
D4h-D7h: Device to LUN Mapping  
Byte  
Name  
Description  
3:0  
DEV_LUN_MAP  
These registers map a device controller (SD/MMC, SM (Note 6-2), and MS)  
to a Logical Unit Number (LUN). The device reports the mapped LUNs to the  
USB host in the USB descriptor during enumeration. The icon installer  
associates custom icons with the LUNs specified in these fields.  
Setting a register to "FF" indicates that the device is not mapped. Setting all  
of the DEV_LUN_MAP registers for all devices to "FF" forces the use of the  
default mapping configuration. Not all configurations are valid. Valid  
configurations depend on the hardware, packaging, and OEM board layout.  
The number of unique LUNs mapped must match the value in the Section  
6.4.3.7, "D3h: Dynamic Number of LUNs," on page 32.  
6.4.3.9  
D8h-DDh: Reserved  
Byte  
Name  
Description  
2:0  
Reserved  
Reserved.  
6.4.4  
6.4.4.1  
HUB CONTROLLER CONFIGURATIONS  
DEh: Vendor ID (LSB)  
Bit  
7:0  
Byte Name  
Description  
VID_LSB  
Least Significant Byte of the Vendor ID. This is a 16-bit value that uniquely  
identifies the vendor of the user device (assigned by USB Implementer’s  
Forum).  
6.4.4.2  
DFh: Vendor ID (MSB)  
Bit  
Byte Name  
Description  
7:0  
VID_MSB  
Most Significant Byte of the Vendor ID. This is a 16-bit value that uniquely  
identifies the vendor of the user device (assigned by USB Implementer’s  
Forum).  
DS00001931B-page 32  
2010-2019 Microchip Technology Inc.  
USB2660/USB2660i  
6.4.4.3  
E0h: Product ID (LSB)  
Bit  
Name  
Description  
7:0  
PID_LSB  
Least Significant Byte of the Product ID. This is a 16-bit value that the vendor  
can assign that uniquely identifies this particular product.  
6.4.4.4  
E1h: Product ID (MSB)  
Bit  
Name  
Description  
7:0  
PID_MSB  
Most Significant Byte of the Product ID. This is a 16-bit value that the vendor  
can assign that uniquely identifies this particular product.  
6.4.4.5  
E2h: Device ID (LSB)  
Bit  
Name  
Description  
7:0  
DID_LSB  
Least Significant Byte of the Device ID. This is a 16-bit device release number  
in BCD (binary coded decimal) format.  
6.4.4.6  
E3h: Device ID (MSB)  
Bit  
Name  
Description  
7:0  
DID_MSB  
Most Significant Byte of the Device ID. This is a 16-bit device release number  
in BCD format.  
6.4.4.7  
E4h: Configuration Data Byte 1 (CFG_DAT_BYT1)  
Bit  
Name  
Description  
7
SELF_BUS_PWR  
Self- or Bus-Power: Selects between self- and bus-powered operation.  
The hub is either self-powered (draws less than 2 mA of upstream bus power)  
or bus-powered (limited to a 100 mA maximum of upstream power prior to  
being configured by the host controller).  
When configured as a bus-powered device, the Microchip hub consumes less  
than 100 mA of current prior to being configured. After configuration, the bus-  
powered Microchip hub (along with all associated hub circuitry, any embedded  
devices if part of a compound device, and 100 mA per externally available  
downstream port) must consume no more than 500 mA of upstream VBUS  
current. The current consumption is system dependent, and the OEM must  
ensure that the USB 2.0 specifications are not violated.  
When configured as a self-powered device, <1 mA of upstream VBUS current  
is consumed and all ports are available, with each port being capable of  
sourcing 500 mA of current.  
‘0’ = Bus-powered operation  
‘1’ = Self-powered operation  
6
5
Reserved  
Reserved  
HS_DISABLE  
Hi-Speed Disable: Disables the capability to attach as either a Hi-/Full-Speed  
device, and forces attachment as Full-Speed only (i.e. no Hi-Speed support).  
‘0’ = Hi-/Full-Speed  
‘1’ = Full-Speed-Only (Hi-Speed disabled!)  
4
Reserved  
Reserved  
2010-2019 Microchip Technology Inc.  
DS00001931B-page 33  
USB2660/USB2660i  
Bit  
Name  
Description  
3
EOP_DISABLE  
EOP Disable: Disables EOP generation of EOF1 when in Full-Speed mode.  
During FS operation only, this permits the hub to send EOP if no downstream  
traffic is detected at EOF1. See Section 11.3.1 of the USB 2.0 Specification  
for additional details.  
‘0’ = An EOP is generated at the EOF1 point if no traffic is detected.  
‘1’ = EOP generation at EOF1 is disabled (normal USB operation).  
Note:  
Generation of an EOP at the EOF1 point may prevent a host  
controller (operating in FS mode) from placing the USB bus in  
suspend.  
2:1  
CURRENT_SNS  
Over-Current Sense: Selects current sensing on a port-by-port basis, all ports  
ganged, or none (only for bus-powered hubs). The ability to support current  
sensing on a per port or ganged basis is dependent upon the hardware  
implementation.  
‘00’ = Ganged sensing (all ports together)  
‘01’ = Individual (port-by-port)  
‘1x’ = Over-current sensing not supported (must only be used with bus-  
powered configurations!)  
0
PORT_PWR  
Port Power Switching: Enables power switching on all ports simultaneously  
(ganged), or port power is individually switched on and off on a port-by-port  
basis (individual). The ability to support power enabling on a port or ganged  
basis is dependent upon the hardware implementation.  
‘0’ = Ganged switching (all ports together)  
‘1’ = Individual port-by-port switching  
6.4.4.8  
E5h: Configuration Data Byte 2 (CFG_DAT_BYT2)  
Bit  
Name  
Description  
7:6  
5:4  
Reserved  
Reserved  
OC_TIMER  
OverCurrent Timer: Over-current timer delay.  
‘00’ = 50 ns  
‘01’ = 100 ns  
‘10’ = 200 ns  
‘11’ = 400 ns  
3
COMPOUND  
Compound Device: Allows OEM to indicate that the hub is part of a compound  
device (per the USB 2.0 Specification). The applicable port(s) must also be  
defined as having a “non-removable device”.  
Note:  
When configured via strapping options, declaring a port as non-  
removable automatically causes the hub controller to report that it is  
part of a compound device.  
‘0’ = No  
‘1’ = Yes, the hub is part of a compound device  
2:0  
Reserved  
Reserved  
DS00001931B-page 34  
2010-2019 Microchip Technology Inc.  
USB2660/USB2660i  
6.4.4.9  
Bit  
E6h: Configuration Data Byte 3 (CFG_DAT_BYT3)  
Name  
Description  
7:4  
3
Reserved  
Reserved  
PRTMAP_EN  
Port Mapping Enable: Selects the method used by the hub to assign port  
numbers and disable ports.  
‘0’ = Standard Mode. Strap options or the following registers are used to define  
which ports are enabled, and the ports are mapped as port ‘n’ on the hub is  
reported as port ‘n’ to the host, unless one of the ports is disabled, then the  
higher numbered ports are remapped in order to report contiguous port  
numbers to the host.  
Register 300Ah: Port disable for self-powered operation (Reset = 0x00).  
Register 300Bh: Port disable for bus-powered operation (Reset = 0x00).  
‘1’ = Port Map mode. The mode enables remapping via the registers defined  
below.  
Register 30FBh: Port Map 12 (Reset = 0x00)  
Register 30FCh: Port Map 3 (Reset = 0x00)  
2:0  
Reserved  
Reserved  
6.4.4.10  
E7h: Non-Removable Device  
Bit  
Byte Name  
Description  
7:0  
NR_DEVICE  
Indicates which port(s) include non-removable devices.  
‘0’ = Port is removable  
‘1’ = Port is non-removable  
Informs the host if one of the active ports has a permanent device that is  
undetachable from the hub. The device must provide its own descriptor data.  
When using the internal default option, the NON_REM[1:0] pins will designate  
the appropriate ports as being non-removable.  
Bit 7= Reserved  
Bit 6= Reserved  
Bit 5= Reserved  
Bit 4= Reserved  
Bit 3= Controls physical port 3  
Bit 2= Controls physical port 2  
Bit 1= Controls physical port 1  
Bit 0= Reserved  
Note:  
Bit 1 must be set to a ‘1’ by the firmware for proper identification of  
the card reader as a non-removable device.  
2010-2019 Microchip Technology Inc.  
DS00001931B-page 35  
USB2660/USB2660i  
6.4.4.11  
E8h: Port Disable For Self-Powered Operation  
Bit  
Byte Name  
Description  
7:0  
PORT_DIS_SP  
Disables 1 or more ports.  
‘0’ = Port is available  
‘1’ = Port is disabled  
During self-powered operation this register selects the ports which will be  
permanently disabled. The ports are unavailable to be enabled or enumerated  
by a host controller. The ports can be disabled in any order since the internal  
logic will automatically report the correct number of enabled ports to the USB  
host and will reorder the active ports in order to ensure proper function.  
Bit 7= Reserved  
Bit 6= Reserved  
Bit 5= Reserved  
Bit 4= Reserved  
Bit 3= Controls physical port 3  
Bit 2= Controls physical port 2  
Bit 1= Controls physical port 1  
Bit 0= Reserved  
6.4.4.12  
E9h: Port Disable For Bus-Powered Operation  
Bit  
Byte Name  
Description  
7:0  
PORT_DIS_BP  
Disables 1 or more ports.  
‘0’ = Port is available  
‘1’ = Port is disabled  
During self-powered operation, this register selects the ports which will be  
permanently disabled. The ports are unavailable to be enabled or enumerated  
by a host controller. The ports can be disabled in any order, the internal logic  
will automatically report the correct number of enabled ports to the USB host  
and will reorder the active ports in order to ensure proper function.  
When using the internal default option, the PRT_DIS[1:0] pins will disable the  
appropriate ports.  
Bit 7= Reserved  
Bit 6= Reserved  
Bit 5= Reserved  
Bit 4= Reserved  
Bit 3= Controls physical port 3  
Bit 2= Controls physical port 2  
Bit 1= Controls physical port 1  
Bit 0 is Reserved  
6.4.4.13  
EAh: Max Power For Self-Powered Operation  
Bit  
Byte Name  
Description  
7:0  
MAX_PWR_SP  
Value in 2 mA increments that the hub consumes from an upstream port  
(VBUS) when operating as a self-powered hub. This value includes the hub  
silicon along with the combined power consumption (from VBUS) of all  
associated circuitry on the board. This value also includes the power  
consumption of a permanently attached peripheral if the hub is configured as  
a compound device, and the embedded peripheral reports 0 mA in its  
descriptors.  
Note:  
The USB 2.0 Specification does not permit this value to exceed 100  
mA.  
DS00001931B-page 36  
2010-2019 Microchip Technology Inc.  
USB2660/USB2660i  
6.4.4.14  
EBh: Max Power For Bus-Powered Operation  
Bit  
Byte Name  
Description  
7:0  
MAX_PWR_BP  
Value in 2 mA increments that the hub consumes from an upstream port  
(VBUS) when operating as a bus-powered hub. This value includes the hub  
silicon along with the combined power consumption (from VBUS) of all  
associated circuitry on the board. This value also includes the power  
consumption of a permanently attached peripheral if the hub is configured as  
a compound device, and the embedded peripheral reports 0 mA in its  
descriptors.  
6.4.4.15  
ECh: Hub Controller Max Current For Self-Powered Operation  
Bit  
Byte Name  
Description  
7:0  
HC_MAX_C_SP  
Value in 2 mA increments that the hub consumes from an upstream port  
(VBUS) when operating as a self-powered hub. This value includes the hub  
silicon along with the combined power consumption (from VBUS) of all  
associated circuitry on the board. This value does NOT include the power  
consumption of a permanently attached peripheral if the hub is configured as  
a compound device.  
Note:  
The USB 2.0 Specification does not permit this value to exceed 100  
mA.  
A value of 50 (decimal) indicates 100 mA, which is the default value.  
EDh: Hub Controller Max Current For Bus-Powered Operation  
6.4.4.16  
Bit  
Byte Name  
Description  
7:0  
HC_MAX_C_BP  
Value in 2 mA increments that the hub consumes from an upstream port  
(VBUS) when operating as a bus-powered hub. This value will include the hub  
silicon along with the combined power consumption (from VBUS) of all  
associated circuitry on the board. This value will NOT include the power  
consumption of a permanently attached peripheral if the hub is configured as  
a compound device.  
A value of 50 (decimal) would indicate 100 mA, which is the default value.  
6.4.4.17  
EEh: Power-On Time  
Bit  
Byte Name  
Description  
7:0  
PWR_ON_TIME  
The length of time that it takes (in 2 ms intervals) from the time the host  
initiated power-on sequence begins on a port until power is adequate on that  
port. If the host requests the power-on time, the system software uses this  
value to determine how long to wait before accessing a powered-on port.  
2010-2019 Microchip Technology Inc.  
DS00001931B-page 37  
USB2660/USB2660i  
6.4.4.18  
EFh: Boost_Up  
Bit  
Name  
Description  
7:2  
1:0  
Reserved  
Reserved  
BOOST_IOUT  
USB electrical signaling drive strength boost bit for the upstream port ‘A’.  
‘00’ = Normal electrical drive strength = No boost  
‘01’ = Elevated electrical drive strength = Low (approximately 4% boost)  
‘10’ = Elevated electrical drive strength = Medium (approximately 8% boost)  
‘11’ = Elevated electrical drive strength = High (approximately 12% boost)  
Note:  
“Boost” could result in non-USB compliant parameters. OEM should  
use a ‘00’ value unless specific implementation issues require  
additional signal boosting to correct for degraded USB signaling  
levels.  
6.4.4.19  
F0h: Boost_3:0  
Bit  
Name  
Description  
7:6  
5:4  
Reserved  
Reserved  
BOOST_IOUT_3  
Upstream USB electrical signaling drive strength boost bit for downstream  
port ‘3’.  
‘00’ = Normal electrical drive strength = No boost  
‘01’ = Elevated electrical drive strength = Low (approximately 4% boost)  
‘10’ = Elevated electrical drive strength = Medium (approximately 8% boost)  
‘11’ = Elevated electrical drive strength = High (approximately 12% boost)  
3:2  
BOOST_IOUT_2  
Upstream USB electrical signaling drive strength boost bit for downstream  
port ‘2’.  
‘00’ = Normal electrical drive strength = No boost  
‘01’ = Elevated electrical drive strength = Low (approximately 4% boost)  
‘10’ = Elevated electrical drive strength = Medium (approximately 8% boost)  
‘11’ = Elevated electrical drive strength = High (approximately 12% boost)  
Note:  
“Boost” could result in non-USB Compliant parameters. OEM should  
use a ‘00’ value unless specific implementation issues require  
additional signal boosting to correct for degraded USB signaling  
levels.  
1:0  
Reserved  
Always reads ‘0’.  
6.4.4.20  
F1h: Port Swap  
Bit  
Byte Name  
Description  
7:0  
PRT_SWP  
Swaps the upstream and downstream USB DP and DM pins for ease of board  
routing to devices and connectors.  
‘0’ = USB D+ functionality is associated with the DP pin and D- functionality  
is associated with the DM pin.  
‘1’ = USB D+ functionality is associated with the DM pin and D- functionality  
is associated with the DP pin.  
Bit 7= Reserved  
Bit 6= Reserved  
Bit 5= Reserved  
Bit 4= Reserved  
Bit 3= Controls physical port 3  
Bit 2= Controls physical port 2  
Bit 1= Reserved  
Bit 0= Controls physical port 0  
DS00001931B-page 38  
2010-2019 Microchip Technology Inc.  
USB2660/USB2660i  
6.4.4.21  
F2h: Port Map 12  
Bit  
Byte Name  
Description  
7:0  
PRTM12  
PortMap register for ports 1 & 2  
When a hub is enumerated by a USB host controller, the hub is only permitted  
to report how many ports it has; the hub is not permitted to select a numerical  
range or assignment. The host controller will number the downstream ports of  
the hub starting with the number '1', up to the number of ports that the hub  
reported having.  
The host's port number is referred to as “logical port number” and the physical  
port on the hub is the “physical port number”. When remapping mode is  
enabled (see PRTMAP_EN in Register 08h: Configuration Data Byte 3) the  
hub's downstream port numbers can be remapped to different logical port  
numbers (assigned by the host).  
Note:  
The OEM must ensure that contiguous logical port numbers are  
used, starting from number ‘1’ up to the maximum number of  
enabled ports; this ensures that the hub's ports are numbered in  
accordance with the way a host will communicate with the ports.  
TABLE 6-5:  
PORT MAP REGISTER FOR PORTS 1 & 2  
Bit [7:4]  
‘0000’  
‘0001’  
‘0010’  
‘0011’  
Physical port 2 is disabled  
Physical port 2 is mapped to Logical port 1  
Physical port 2 is mapped to Logical port 2  
Physical port 2 is mapped to Logical port 3  
Illegal; Do not use  
‘0100’  
to  
‘1111’  
Bit [3:0]  
‘0000’  
‘0001’  
‘0010’  
‘0011’  
Physical port 1 is disabled  
Physical port 1 is mapped to Logical port 1  
Physical port 1 is mapped to Logical port 2  
Physical port 1 is mapped to Logical port 3  
Illegal; Do not use  
‘0100’  
to  
‘1111’  
2010-2019 Microchip Technology Inc.  
DS00001931B-page 39  
USB2660/USB2660i  
6.4.4.22  
F3h: Port Map 3  
Bit  
Byte Name  
Description  
7:0  
PRTM3  
PortMap register for port 3.  
When a hub is enumerated by a USB host controller, the hub is only permitted  
to report how many ports it has; the hub is not permitted to select a numerical  
range or assignment. The host controller will number the downstream ports of  
the hub starting with the number '1', up to the number of ports that the hub  
reported having.  
The host's port number is referred to as “logical port number” and the physical  
port on the hub is the “physical port number”. When remapping mode is  
enabled (see PRTMAP_EN in Register 08h: Configuration Data Byte 3) the  
hub's downstream port numbers can be remapped to different logical port  
numbers (assigned by the host).  
Note:  
The OEM must ensure that contiguous logical port numbers are  
used, starting from number ‘1’ up to the maximum number of  
enabled ports; this ensures that the hub's ports are numbered in  
accordance with the way a host will communicate with the ports.  
TABLE 6-6:  
PORT MAP REGISTER FOR PORT 3  
Bit [7:4]  
‘0000’  
‘0001’  
‘0010’  
‘0011’  
Reserved  
Reserved  
Reserved  
Reserved  
‘0100’  
to  
Illegal; Do not use  
‘1111’  
Bit [3:0]  
‘0000’  
‘0001’  
‘0010’  
‘0011’  
Physical port 3 is disabled  
Physical port 3 is mapped to Logical port 1  
Physical port 3 is mapped to Logical port 2  
Physical port 3 is mapped to Logical port 3  
Illegal; Do not use  
‘0100’  
to  
‘1111’  
6.4.4.23  
F4h-FAh: Reserved  
Byte  
Byte Name  
Description  
Description  
6:0  
Reserved  
Reserved.  
6.4.4.24  
FBh: Not Applicable  
Bit  
Byte Name  
7:0  
Not Applicable  
Not applicable.  
DS00001931B-page 40  
2010-2019 Microchip Technology Inc.  
USB2660/USB2660i  
6.4.4.25  
FCh-FFh: Non-Volatile Storage Signature  
Byte  
Name  
Description  
3:0  
NVSTORE_SIG  
This signature is used to verify the validity of the data in the first 256 bytes of  
the configuration area. The signature must be set to ‘ATA2’ for  
USB2660/USB2660i.  
6.4.5  
INTERNAL FLASH MEDIA CONTROLLER EXTENDED CONFIGURATIONS  
Enable Registers 100h - 17Fh by setting bit 7 of bmAttribute.  
6.4.5.1  
100h-106h: Combo LUN 0 Identifier String  
Byte  
6:0  
Name  
Description  
CLUN0_ID_STR  
If the device to LUN mapping bytes have configured this LUN to be a combo  
LUN, then these strings will be used to identify the LUN rather than the device  
identifier strings.  
6.4.5.2  
107h-10Dh: Combo LUN 1 Identifier String  
BYTE  
NAME  
DESCRIPTION  
6:0  
CLUN1_ID_STR  
If the device to LUN bytes have configured this LUN to be a combo LUN, then  
these strings will be used to identify the LUN rather than the device identifier  
strings.  
6.4.5.3  
10Eh-114h: Combo LUN 2 Identifier String  
Byte  
Name  
Description  
6:0  
CLUN2_ID_STR  
If the device to LUN mapping bytes have configured this LUN to be a combo  
LUN, then these strings will be used to identify the LUN rather than the device  
identifier strings.  
6.4.5.4  
115h-11Bh: Combo LUN 3 Identifier String  
Byte  
Name  
Description  
6:0  
CLUN3_ID_STR  
If the device to LUN mapping bytes have configured this LUN to be a combo  
LUN, then these strings will be used to identify the LUN rather than the device  
identifier strings.  
6.4.5.5  
11Ch-122h: Combo LUN 4 Identifier String  
Byte  
Name  
Description  
6:0  
CLUN4_ID_STR  
If the device to LUN mapping bytes have configured this LUN to be a combo  
LUN, then these strings will be used to identify the LUN rather than the device  
identifier strings.  
6.4.5.6  
123h-129h: Device 4 Identifier String  
Byte  
Name  
Description  
6:0  
DEV4_ID_STR  
This ID string is associated with the second Secure Digital / MultiMediaCard  
“SD/MMC2” device.  
2010-2019 Microchip Technology Inc.  
DS00001931B-page 41  
USB2660/USB2660i  
6.4.5.7  
130h-145h: Not Applicable  
Byte  
21:0  
Name  
Description  
Description  
Not Applicable  
Not applicable.  
6.4.5.8  
146h: Dynamic Number of Extended LUNs  
Bit  
Name  
7:0  
DYN_NUM_  
EXT_LUN  
These bytes are used to specify the number of LUNs the device exposes to  
the host. These bytes are also used for icon sharing by assigning more than  
one LUN to a single icon. This is used in applications where the device utilizes  
a combo socket and the OEM wishes to have only a single icon displayed for  
one or more interfaces.  
If this field is set to "FF", the program assumes that you are using the default  
value and icons will be configured per the default configuration.  
6.4.5.9  
147h-14Bh: Device to LUN Mapping  
Byte  
Name  
Description  
4:0  
DEV_LUN_MAP  
These registers map a device controller (SD/MMC, SM (Note 6-2), and MS)  
to a Logical Unit Number (LUN). The device reports the mapped LUNs to the  
USB host in the USB descriptor during enumeration. The icon installer  
associates custom icons with the LUNs specified in these fields.  
Setting a register to "FF" indicates that the device is not mapped. Setting all  
of the DEV_LUN_MAP registers for all devices to "FF" forces the use of the  
default mapping configuration. Not all configurations are valid. Valid  
configurations depend on the hardware, packaging, and OEM board layout.  
The number of unique LUNs mapped must match the value in the Section  
6.4.3.7, "D3h: Dynamic Number of LUNs," on page 32.  
6.4.5.10  
14Ch-14Dh: Second Secure Digital Device Power Configuration  
The device has two internal FETs which can be utilized for card power. For information about the other internal FET,  
please see Section 6.4.2.3, "A4h-A5h: Smart Media Device Power Configuration," on page 30. The settings are stored  
in NVSTORE. This section describes the default internal configuration.  
1. A card can be powered by an external FET or by an internal FET.  
2. The power limit can be set to 100 mA or 200 mA (Default) for the internal FET.  
Each media uses two bytes to store its device power configuration. Bit 3 selects between internal or external card power  
FET options. For internal FET card power control, bits 0 through 2 are used to set the power limit. The “Device Power  
Configuration” bits are ignored unless the “Enable Device Power Configuration” bit is set. See Section 6.4.1.19, "9Ch-  
9Fh: Attribute Byte Descriptions," on page 29.  
FET  
0
Type  
Bits  
3:0  
Bit Type  
Description  
FET Lo Byte  
SD2_PWR_LB  
Low Nibble  
0000b Disabled  
0001b External FET enabled  
1000b Internal FET with 100 mA power limit  
1010b Internal FET with 200 mA power limit  
1
2
3
7:4  
3:0  
7:4  
High Nibble  
Low Nibble  
High Nibble  
0000b Disabled  
0000b Disabled  
0000b Disabled  
FET Hi Byte  
SD2_PWR_HB  
6.4.5.11  
14Eh-17Bh: Not Applicable  
Bit  
Name  
Description  
47:0  
Not Applicable  
Not applicable.  
DS00001931B-page 42  
2010-2019 Microchip Technology Inc.  
USB2660/USB2660i  
6.4.5.12  
17Ch -17Fh: Non-Volatile Storage Signature for Extended Configuration  
Byte  
Name Description  
3:0  
NVSTORE_SIG2 This signature is used to verify the validity of the data in the upper 256 bytes if  
a 512 byte EEPROM is used, otherwise this bank is a read-only configuration  
area. The signature must be set to 'ecf1'.  
2
6.4.6  
I C EEPROM  
The I2C EEPROM interface implements a subset of the I2C Master Specification (Please refer to the Philips Semicon-  
ductor Standard I2C-Bus Specification for details on I2C bus protocols). The device’s I2C EEPROM interface is designed  
to attach to a single “dedicated” I2C EEPROM, and it conforms to the Standard-mode I2C Specification (100 kbps trans-  
fer rate and 7-bit addressing) for protocol and electrical compatibility.  
Note:  
Extensions to the I2C Specification are not supported. The device acts as the master and generates the  
serial clock SCL, controls the bus access (determines which device acts as the transmitter and which  
device acts as the receiver), and generates the START and STOP conditions.  
6.4.6.1  
Implementation Characteristics  
The device will only access an EEPROM using the sequential read protocol.  
6.4.6.2 Pull-Up Resistor  
The circuit board designer is required to place external pull-up resistors (10 krecommended) on the SPI_DO / SDA /  
SPI_SPD_SEL and SPI_CLK / SCL lines (per SMBus 1.0 Specification and EEPROM manufacturer guidelines) to  
VDD33 in order to assure proper operation.  
6.4.7  
IN-CIRCUIT EEPROM PROGRAMMING  
The EEPROM can be programmed via automatic test equipment (ATE). Pulling nRESET low tri-states the device’s  
EEPROM interface and allows an external source to program the EEPROM.  
6.5  
Default Configuration Option  
The Microchip device can be configured via its internal default configuration. Please see Section 6.3.2, "EEPROM Data  
Descriptor" for specific details on how to enable default configuration. Please refer to Table 6-1 for the internal default  
values that are loaded when this option is selected.  
6.5.1  
EXTERNAL HARDWARE NRESET  
A valid hardware reset is defined as assertion of nRESET for a minimum of 1 s after all power supplies are within oper-  
ating range. While reset is asserted, the device (and its associated external circuitry) consumes less than 500 A of  
current from the upstream USB power source.  
Assertion of nRESET (external pin) causes the following:  
1. All downstream ports are disabled and PRTCTL power to downstream devices is removed.  
2. The PHYs are disabled and the differential pairs will be in a high-impedance state.  
3. All transactions immediately terminate; no states are saved.  
4. All internal registers return to the default state (in most cases, 00h).  
5. The external crystal oscillator is halted.  
6. The PLL is halted.  
2010-2019 Microchip Technology Inc.  
DS00001931B-page 43  
USB2660/USB2660i  
6.5.1.1  
nRESET for EEPROM Configuration  
TABLE 6-7:  
NRESET TIMING FOR EEPROM MODE  
Start  
completion  
request  
Hardware  
reset  
asserted  
Device  
Recovery/  
Stabilization  
8051 Sets  
Configuration  
Registers  
Attach  
USB  
Upstream  
USB Reset  
recovery  
Idle  
response  
t4  
t6  
t7  
t1  
t5  
t2  
t3  
nRESET  
VSS  
TABLE 6-8:  
Name  
NRESET TIMING FOR EEPROM MODE  
Description  
MIN  
TYP  
MAX  
Units  
t1  
t2  
t3  
t4  
t5  
t6  
t7  
nRESET asserted  
1
sec  
sec  
msec  
msec  
msec  
msec  
msec  
Device recovery/stabilization  
8051 programs device configuration  
USB attach (See Note)  
500  
50  
20  
100  
Host acknowledges attach and signals USB reset  
USB idle  
100  
Undefined  
Completion time for requests (with or without data  
stage)  
5
Note:  
All power supplies must have reached the operating levels mandated in Section 8.0, "DC Parameters",  
prior to (or coincident with) the assertion of nRESET.  
6.5.2  
USB BUS RESET  
In response to the upstream port signaling a reset to the device, the device does the following:  
Note:  
The device does not propagate the upstream USB reset to downstream devices.  
1. Sets default address to ‘0’.  
2. Sets configuration to: Unconfigured.  
3. Negates PRTCTL[3:2] to all downstream ports.  
4. Clears all TT buffers.  
5. Moves device from suspended to active (if suspended).  
6. Complies with Section 11.10 of the USB 2.0 Specification for behavior after completion of the reset sequence.  
The host then configures the device and the device’s downstream port devices in accordance with the USB 2.0 Speci-  
fication.  
DS00001931B-page 44  
2010-2019 Microchip Technology Inc.  
USB2660/USB2660i  
7.0  
7.1  
AC SPECIFICATIONS  
Oscillator/Crystal  
Parallel Resonant, Fundamental Mode, 24 MHz 350 ppm.  
FIGURE 7-1:  
TYPICAL CRYSTAL CIRCUIT  
TABLE 7-1:  
Symbol  
CRYSTAL CIRCUIT LEGEND  
Description  
In Accordance With  
C0  
Crystal shunt capacitance  
Crystal manufacturer’s specification (See Note 7-1)  
CL  
Crystal load capacitance  
Total board or trace capacitance  
Stray capacitance  
CB  
OEM board design  
MCHP IC and OEM board design  
MCHP IC  
CS  
CXTAL  
C1  
XTAL pin input capacitance  
Load capacitors installed on OEM  
board  
Calculated values based on Figure 7-2 (See Note 7-2)  
C2  
FIGURE 7-2:  
CAPACITANCE FORMULAS  
C1 = 2 x (CL – C0) – CS1  
C2 = 2 x (CL – C0) – CS2  
Note 7-1  
Note 7-2  
C0 is usually included (subtracted by the crystal manufacturer) in the specification for CL and should  
be set to ‘0’ for use in the calculation of the capacitance formulas in Figure 7-2. However, the OEM  
PCB itself may present a parasitic capacitance between XTAL1 and XTAL2. For an accurate  
calculation of C1 and C2, take the parasitic capacitance between traces XTAL1 and XTAL2 into  
account.  
Each of these capacitance values is typically approximately 18 pF.  
2010-2019 Microchip Technology Inc.  
DS00001931B-page 45  
USB2660/USB2660i  
7.2  
Ceramic Resonator  
24 MHz 350 ppm  
FIGURE 7-3:  
CERAMIC RESONATOR USAGE WITH MCHP IC  
7.3  
External Clock  
50% Duty cycle 10%, 24 MHz 350 ppm, Jitter < 100 ps rms.  
The external clock is recommended to conform to the signaling level designated in the JESD76-2 specification on 1.8  
V CMOS Logic. XTAL2 should be treated as a no connect.  
2
7.3.1  
I C EEPROM  
Frequency is fixed at 58.6 kHz 20%  
7.3.2 USB 2.0  
The Microchip device conforms to all voltage, power, and timing characteristics and specifications as set forth in the  
USB 2.0 Specification. Please refer to the USB 2.0 Specification for more information.  
DS00001931B-page 46  
2010-2019 Microchip Technology Inc.  
USB2660/USB2660i  
8.0  
8.1  
DC PARAMETERS  
Maximum Ratings  
Parameter  
Symbol  
TSTOR  
MIN  
MAX  
Units  
°C  
Comments  
Storage  
Temperature  
-55  
150  
4.0  
Lead  
Temperature  
°C  
V
Please refer to JEDEC  
specification J-STD-020D.  
3.3 V supply  
voltage  
VDD33  
-0.5  
-0.5  
Voltage on  
USB+ and  
USB- pins  
(3.3 V supply voltage + 2) 6  
V
Voltage on  
CRD_PWR1  
and  
-0.5  
VDD33 + 0.3  
V
When internal power FET  
operation of these pins are  
enabled, these pins may be  
simultaneously shorted to  
ground or any voltage up to  
3.63 V indefinitely, without  
damage to the device as  
long as VDD33 is less than  
3.63 V and TA is less than  
70oC.  
CRD_PWR2  
Voltage on any  
signal pin  
-0.5  
-0.5  
-0.5  
VDD33 + 0.3  
V
V
V
Voltage on  
XTAL1  
3.6  
2.0  
Voltage on  
XTAL2  
Note:  
Stresses above the specified parameters may cause permanent damage to the device. This is a stress rat-  
ing only. Functional operation of the device at any condition above those indicated in the operation sections  
of this specification is not implied. When powering this device from laboratory or system power supplies  
the absolute maximum ratings must not be exceeded or device failure can result. Some power supplies  
exhibit voltage spikes on their outputs when the AC power is switched on or off. In addition, voltage tran-  
sients on the AC power line may appear on the DC output. When this possibility exists, a clamp circuit  
should be used.  
FIGURE 8-1:  
SUPPLY RISE TIME MODEL  
Voltage  
VDD33  
tRT  
3.3 V  
100%  
90%  
10%  
VSS  
t90%  
Time  
t10%  
2010-2019 Microchip Technology Inc.  
DS00001931B-page 47  
USB2660/USB2660i  
8.2  
Operating Conditions  
Parameter  
Symbol  
TA  
MIN  
MAX  
Units  
°C  
Comments  
Commercial  
0
70  
85  
3.6  
Ambient temperature in still air.  
USB2660  
Operating Temperature  
Industrial  
USB2660  
Operating Temperature  
TA  
-40  
3.0  
°C  
V
Ambient temperature in still air.  
3.3 V supply voltage  
VDD33  
A 3.3 V regulator with an output  
tolerance of 1% must be used if  
the output of the internal power  
FET’s must support a 5%  
tolerance.  
3.3 V supply rise time tRT  
0
400  
5.5  
s  
(Figure 8-1)  
Voltage on  
USB+ and USB- pins  
-0.3  
V
If any 3.3 V supply voltage drops  
below 3.0 V, then the MAX  
becomes:  
(3.3 V supply voltage) + 0.5 5.5  
Voltage on any signal  
pin  
-0.3  
VDD33  
V
Voltage on XTAL1  
Voltage on XTAL2  
-0.3  
-0.3  
2.0  
2.0  
V
V
8.3  
DC Electrical Characteristics  
Parameter  
Symbol  
MIN  
TYP  
MAX  
Units  
Comments  
I, IPU, IPD Type Input Buffer  
Low Input Level  
VILI  
VIHI  
PD  
PU  
0.8  
V
V
TTL Levels  
High Input Level  
2.0  
Pull Down  
72  
58  
A  
A  
Pull Up  
IS Type Input Buffer  
Low Input Level  
High Input Level  
VILI  
VIHI  
0.8  
V
V
TTL Levels  
2.0  
Hysteresis  
VHYSI  
420  
mV  
ICLK Input Buffer  
Low Input Level  
High Input Level  
Input Leakage  
VILCK  
VIHCK  
IIL  
0.5  
V
V
1.4  
-10  
+10  
A  
VIN = 0 to VDD33  
Input Leakage  
(All I and IS buffers)  
Low Input Leakage  
High Input Leakage  
IIL  
-10  
-10  
+10  
+10  
A  
A  
VIN = 0  
IIH  
VIN = VDD33  
DS00001931B-page 48  
2010-2019 Microchip Technology Inc.  
USB2660/USB2660i  
Parameter  
Symbol  
MIN  
TYP  
MAX  
Units  
Comments  
I/O6, I/OD6PU Type Buffers  
Low Output Level  
High Output Level  
Output Leakage  
VOL  
VOH  
IOL  
0.4  
V
V
IOL = 6 mA @  
VDD33 = 3.3 V  
VDD33  
- 0.4  
IOH = -6 mA @  
VDD33 = 3.3 V  
-10  
+10  
µA  
VIN = 0 to VDD33  
(Note 8-1)  
Pull Down  
Pull Up  
PD  
PU  
72  
58  
A  
A  
O8, O8PD, 08PU, I/O8, I/O8PD, and  
I/O8PU Type Buffers  
Low Output Level  
High Output Level  
Output Leakage  
VOL  
VOH  
IOL  
0.4  
V
V
IOL = 8 mA @  
VDD33 = 3.3 V  
VDD33  
- 0.4  
IOH = -8 mA @  
VDD33 = 3.3 V  
-10  
+10  
µA  
VIN = 0 to VDD33  
(Note 8-1)  
Pull Down  
Pull Up  
PD  
PU  
72  
58  
A  
A  
O12, I/O12, and I/O12PD  
Type Buffers  
Low Output Level  
High Output Level  
Output Leakage  
VOL  
VOH  
IOL  
0.4  
V
V
IOL = 12 mA @  
VDD33 = 3.3 V  
VDD33  
- 0.4  
IOH = -12 mA @  
VDD33 = 3.3 V  
-10  
+10  
µA  
VIN = 0 to VDD33  
(Note 8-1)  
Pull Down  
Pull Up  
PD  
PU  
72  
58  
A  
A  
IO-U  
I-R  
Note 8-2  
Note 8-3  
2010-2019 Microchip Technology Inc.  
DS00001931B-page 49  
USB2660/USB2660i  
Parameter  
Symbol  
MIN  
TYP  
MAX  
Units  
Comments  
I/O200 Integrated Power FET for  
CRD_PWR1 and CRD_PWR2  
High Output Current  
IOUT  
IOUT  
200  
100  
mA  
mA  
VdropFET = 0.46 V  
VdropFET = 0.23 V  
Low Output Current  
(Note 8-4)  
On Resistance  
(Note 8-4)  
RDSON  
tDSON  
2.1  
IFET = 70 mA  
Output Voltage Rise Time  
800  
s  
CLOAD = 10 F  
Integrated Power FET Set to 100 mA  
Output Current (Note 8-4)  
Short Circuit Current Limit  
On Resistance (Note 8-4)  
IOUT  
ISC  
RDSON  
tDSON  
100  
mA  
mA  
VdropFET = 0.22 V  
VoutFET = 0 V  
IFET = 70 mA  
140  
2.1  
Output Voltage Rise Time  
800  
s  
CLOAD = 10 F  
Integrated Power FET Set to 200 mA  
Output Current (Note 8-4)  
Short Circuit Current Limit  
On Resistance (Note 8-4)  
Output Voltage Rise Time  
IOUT  
ISC  
RDSON  
tDSON  
200  
mA  
mA  
VdropFET = 0.46 V  
VoutFET = 0 V  
IFET = 70 mA  
181  
2.1  
800  
s  
CLOAD = 10 F  
Supply Current Unconfigured  
Hi-Speed Host  
Note 8-5  
USB2660  
USB2660i  
ICCINTHS  
ICCINTHS  
70  
70  
80  
80  
mA  
mA  
Full Speed Host  
USB2660  
USB2660i  
ICCINITFS  
ICCINITFS  
65  
65  
75  
75  
mA  
mA  
Supply Current Configured  
Hi-Speed Host, 1 downstream port  
(Note 8-5)  
USB2660  
USB2660i  
IHCH1  
IHCH1  
260  
260  
270  
275  
mA  
mA  
Supply Current Configured  
Hi-Speed Host, each additional  
downstream port  
USB2660  
USB2660i  
25  
25  
30  
35  
mA  
mA  
Supply Current Configured  
Full-Speed Host, 1 downstream port  
USB2660  
USB2660i  
IFCC1  
IFCC1  
200  
200  
210  
215  
mA  
mA  
Supply Current Configured  
Full-Speed Host, each additional  
downstream port  
USB2660  
USB2660i  
20  
20  
25  
25  
mA  
mA  
DS00001931B-page 50  
2010-2019 Microchip Technology Inc.  
USB2660/USB2660i  
Parameter  
Symbol  
MIN  
TYP  
MAX  
Units  
Comments  
(Note 8-5)  
Supply Current Suspend  
USB2660  
USB2660i  
ICSBY  
ICSBY  
500  
500  
950  
1200  
µA  
µA  
Supply Current Reset  
USB2660  
USB2660i  
IRST  
IRST  
230  
230  
700  
900  
µA  
µA  
Note 8-1  
Note 8-2  
Note 8-3  
Note 8-4  
Output leakage is measured with the current pins in high impedance.  
See the USB 2.0 Specification, Chapter 7, for USB DC electrical characteristics  
RBIAS is a 3.3 V tolerant analog pin.  
Output current range is controlled by program software. The software disables the FET during short  
circuit condition.  
Note 8-5  
Typical and maximum values were characterized using the following temperature ranges: The  
USB2660 supports the commercial temperature range of 0°C to +70°C  
The USB2660i supports the industrial temperature range of -40°C to +85°C  
8.4  
Capacitance  
TA = 25°C; fc = 1 MHz; VDD33= 3.3 V  
TABLE 8-1: PIN CAPACITANCE  
Parameter  
Limits  
TYP  
Symbol  
Units  
Test Condition  
MIN  
MAX  
Clock Input Capacitance  
CXTAL  
2
pF  
All pins (except USB pins and  
pins under test) are tied to AC  
ground.  
Input Capacitance  
Output Capacitance  
CIN  
10  
20  
pF  
pF  
COUT  
2010-2019 Microchip Technology Inc.  
DS00001931B-page 51  
USB2660/USB2660i  
9.0  
PACKAGE SPECIFICATIONS  
FIGURE 9-1:  
USB2660/USB2660I 64-PIN QFN  
DS00001931B-page 52  
2010-2019 Microchip Technology Inc.  
USB2660/USB2660i  
FIGURE 9-1:  
USB2660/USB2660I 64-PIN QFN (CONTINUED)  
2010-2019 Microchip Technology Inc.  
DS00001931B-page 53  
USB2660/USB2660i  
FIGURE 9-2:  
64-PIN PACKAGE TAPE SPECIFICATIONS  
0.30  
T1  
4.00  
2.00  
A
Ø1.50  
1.75  
7.50  
16.00 0.3  
B0  
W1  
A0  
12.00  
Ø1.50  
A
COVER TAPE  
K0  
10 mm  
SECTION A — A  
DIRECTION OF UNREELING  
MIN  
NOM MAX  
A0 9.20 9.30 9.40  
B0 9.20 9.30 9.40  
K0 1.00 1.10 1.20  
-
-
T1  
1.00  
W1 13.20 13.30 13.40  
DS00001931B-page 54  
2010-2019 Microchip Technology Inc.  
USB2660/USB2660i  
APPENDIX A: ACRONYMS  
ACK:  
EOP:  
EOF:  
FM:  
Handshake packet (positive acknowledgement)  
End of Packet  
End of (micro) Frame  
Flash Media  
FMC:  
FS:  
Flash Media Controller  
Full-Speed Device  
LS:  
Low-Speed Device  
HS:  
Hi-Speed Device  
I2C:  
MMC:  
MS:  
Inter-Integrated Circuit1  
MultiMediaCard  
Memory Stick  
MSC:  
OCS:  
PHY:  
PLL:  
RXD:  
SD:  
Memory Stick Controller  
Over-current Sense  
Physical Layer  
Phase-Locked Loop  
Received eXchange Data  
Secure Digital  
SDC:  
TXD:  
UART:  
Secure Digital Controller  
Transmit eXchange Data  
Universal Asynchronous Receiver-Transmitter  
UCHAR: Unsigned Character  
UINT: Unsigned Integer  
1. I2C is a registered trademark of Philips Corporation.  
2010-2019 Microchip Technology Inc.  
DS00001931B-page 55  
USB2660/USB2660i  
APPENDIX B: DATA SHEET REVISION HISTORY  
TABLE B-1:  
REVISION HISTORY  
Revision  
Section/Figure/Entry  
Correction  
DS00001931B (09-05-19)  
DS00001931A (05-11-15)  
Features section on cover,  
Product Identification Sys-  
tem on page 57  
Mention of commercial version removed, not  
offered.  
Figure 2-1, "USB2660/  
USB2660i Block Diagram"  
Diagram modified removing SDIO reference.  
Throughout document  
GPIOs and SDIO support removed; Package Out-  
line diagrams updated.  
REV A replaces previous SMSC version Rev. 1.1 (11-05-10)  
DS00001931B-page 56  
2010-2019 Microchip Technology Inc.  
USB2660/USB2660i  
PRODUCT IDENTIFICATION SYSTEM  
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.  
PART NO.  
Device  
[X]  
XXX  
[X](1)  
Examples:  
-
-
a)  
USB2660i-JZX-03  
Temperature  
Range  
Package  
Tape and Reel  
Option  
64-pin QFN, 9 x 9mm  
RoHS Compliant Package, Tray  
b)  
USB2660i-JZX-03-TR  
64-pin QFN, 9 x 9mm  
RoHS Compliant Package, Tape & Reel  
Device:  
USB2660, USB2660i  
Temperature  
Range:  
i
=
-40C to +85C (Industrial)  
Package:  
JZX  
=
64-pin QFN  
Tape and Reel  
Option:  
Blank = Standard packaging (tray)  
Note 1:  
Tape and Reel identifier only appears in the  
catalog part number description. This identifier  
is used for ordering purposes and is not printed  
on the device package. Check with your  
Microchip Sales Office for package availability  
with the Tape & Reel option.  
(1)  
TR  
= Tape and Reel  
Reel size is 3,000.  
2010-2019 Microchip Technology Inc.  
DS00001931B-page 57  
USB2660/USB2660i  
Note the following details of the code protection feature on Microchip devices:  
Microchip products meet the specification contained in their particular Microchip Data Sheet.  
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the  
intended manner and under normal conditions.  
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our  
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data  
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.  
Microchip is willing to work with the customer who is concerned about the integrity of their code.  
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not  
mean that we are guaranteeing the product as “unbreakable.”  
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our  
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts  
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.  
Information contained in this publication regarding device applications and the like is provided only for your convenience and may be  
superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO  
REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR  
OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE,  
MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Micro-  
chip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold  
harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or  
otherwise, under any Microchip intellectual property rights unless otherwise stated.  
Trademarks  
The Microchip name and logo, the Microchip logo, Adaptec, AnyRate, AVR, AVR logo, AVR Freaks, BesTime, BitCloud, chipKIT, chipKIT logo,  
CryptoMemory, CryptoRF, dsPIC, FlashFlex, flexPWR, HELDO, IGLOO, JukeBlox, KeeLoq, Kleer, LANCheck, LinkMD, maXStylus, maXTouch,  
MediaLB, megaAVR, Microsemi, Microsemi logo, MOST, MOST logo, MPLAB, OptoLyzer, PackeTime, PIC, picoPower, PICSTART, PIC32 logo,  
PolarFire, Prochip Designer, QTouch, SAM-BA, SenGenuity, SpyNIC, SST, SST Logo, SuperFlash, Symmetricom, SyncServer, Tachyon,  
TempTrackr, TimeSource, tinyAVR, UNI/O, Vectron, and XMEGA are registered trademarks of Microchip Technology Incorporated in the U.S.A. and  
other countries.  
APT, ClockWorks, The Embedded Control Solutions Company, EtherSynch, FlashTec, Hyper Speed Control, HyperLight Load, IntelliMOS, Libero,  
motorBench, mTouch, Powermite 3, Precision Edge, ProASIC, ProASIC Plus, ProASIC Plus logo, Quiet-Wire, SmartFusion, SyncWorld, Temux,  
TimeCesium, TimeHub, TimePictra, TimeProvider, Vite, WinPath, and ZL are registered trademarks of Microchip Technology Incorporated in the  
U.S.A.  
Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut, BlueSky, BodyCom, CodeGuard,  
CryptoAuthentication, CryptoAutomotive, CryptoCompanion, CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average Matching, DAM,  
ECAN, EtherGREEN, In-Circuit Serial Programming, ICSP, INICnet, Inter-Chip Connectivity, JitterBlocker, KleerNet, KleerNet logo, memBrain,  
Mindi, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net,  
PICkit, PICtail, PowerSmart, PureSilicon, QMatrix, REAL ICE, Ripple Blocker, SAM-ICE, Serial Quad I/O, SMART-I.S., SQI, SuperSwitcher,  
SuperSwitcher II, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are trademarks of  
Microchip Technology Incorporated in the U.S.A. and other countries.  
SQTP is a service mark of Microchip Technology Incorporated in the U.S.A.  
The Adaptec logo, Frequency on Demand, Silicon Storage Technology, and Symmcom are registered trademarks of Microchip Technology Inc. in  
other countries.  
GestIC is a registered trademark of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other  
countries.  
All other trademarks mentioned herein are property of their respective companies.  
© 2010-2019, Microchip Technology Incorporated, All Rights Reserved.  
ISBN: 9781522450016  
For information regarding Microchip’s Quality Management Systems,  
please visit www.microchip.com/quality.  
DS00001931B-page 58  
2010-2019 Microchip Technology Inc.  
USB2660/USB2660i  
THE MICROCHIP WEB SITE  
Microchip provides online support via our WWW site at www.microchip.com. This web site is used as a means to make  
files and information easily available to customers. Accessible by using your favorite Internet browser, the web site con-  
tains the following information:  
Product Support – Data sheets and errata, application notes and sample programs, design resources, user’s  
guides and hardware support documents, latest software releases and archived software  
General Technical Support – Frequently Asked Questions (FAQ), technical support requests, online discussion  
groups, Microchip consultant program member listing  
Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of semi-  
nars and events, listings of Microchip sales offices, distributors and factory representatives  
CUSTOMER CHANGE NOTIFICATION SERVICE  
Microchip’s customer notification service helps keep customers current on Microchip products. Subscribers will receive  
e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or  
development tool of interest.  
To register, access the Microchip web site at www.microchip.com. Under “Support”, click on “Customer Change Notifi-  
cation” and follow the registration instructions.  
CUSTOMER SUPPORT  
Users of Microchip products can receive assistance through several channels:  
• Distributor or Representative  
• Local Sales Office  
• Field Application Engineer (FAE)  
Technical Support  
Customers should contact their distributor, representative or field application engineer (FAE) for support. Local sales  
offices are also available to help customers. A listing of sales offices and locations is included in the back of this docu-  
ment.  
Technical support is available through the web site at: http://www.microchip.com/support  
2010-2019 Microchip Technology Inc.  
DS00001931B-page 59  
Worldwide Sales and Service  
AMERICAS  
ASIA/PACIFIC  
ASIA/PACIFIC  
EUROPE  
Corporate Office  
2355 West Chandler Blvd.  
Chandler, AZ 85224-6199  
Tel: 480-792-7200  
Fax: 480-792-7277  
Technical Support:  
http://www.microchip.com/  
support  
Australia - Sydney  
Tel: 61-2-9868-6733  
India - Bangalore  
Tel: 91-80-3090-4444  
Austria - Wels  
Tel: 43-7242-2244-39  
Fax: 43-7242-2244-393  
China - Beijing  
Tel: 86-10-8569-7000  
India - New Delhi  
Tel: 91-11-4160-8631  
Denmark - Copenhagen  
Tel: 45-4450-2828  
Fax: 45-4485-2829  
China - Chengdu  
Tel: 86-28-8665-5511  
India - Pune  
Tel: 91-20-4121-0141  
Finland - Espoo  
Tel: 358-9-4520-820  
China - Chongqing  
Tel: 86-23-8980-9588  
Japan - Osaka  
Tel: 81-6-6152-7160  
Web Address:  
www.microchip.com  
France - Paris  
Tel: 33-1-69-53-63-20  
Fax: 33-1-69-30-90-79  
China - Dongguan  
Tel: 86-769-8702-9880  
Japan - Tokyo  
Tel: 81-3-6880- 3770  
Atlanta  
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Tel: 678-957-9614  
Fax: 678-957-1455  
China - Guangzhou  
Tel: 86-20-8755-8029  
Korea - Daegu  
Tel: 82-53-744-4301  
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Tel: 49-8931-9700  
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Tel: 86-571-8792-8115  
Korea - Seoul  
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Boston  
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Tel: 774-760-0087  
Fax: 774-760-0088  
China - Nanjing  
Tel: 86-25-8473-2460  
Malaysia - Penang  
Tel: 60-4-227-8870  
Germany - Karlsruhe  
Tel: 49-721-625370  
China - Qingdao  
Philippines - Manila  
Germany - Munich  
Tel: 49-89-627-144-0  
Fax: 49-89-627-144-44  
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Fax: 972-818-2924  
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Fax: 39-0331-466781  
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Houston, TX  
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Vietnam - Ho Chi Minh  
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Netherlands - Drunen  
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Fax: 31-416-690340  
Indianapolis  
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Tel: 317-773-8323  
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2010-2019 Microchip Technology Inc.  
DS00001931B-page 60  
05/14/19  

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