5961-01-187-1735 [MICROSEMI]
Zener Diode, 180V V(Z), 5%, 1.5W;
| 型号： | 5961-01-187-1735 |
| 厂家： | 
Microsemi |
| 描述： | Zener Diode, 180V V(Z), 5%, 1.5W |
| 文件： | 总22页 (文件大小：218K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
The documentation and process conversion
measures necessary to comply with this revision
shall be completed by 23 September 2006.
INCH-POUND
MIL-PRF-19500/406G
23 June 2006
SUPERSEDING
MIL-PRF-19500/406F
24 November 2004
PERFORMANCE SPECIFICATION SHEET
SEMICONDUCTOR DEVICES, DIODE, SILICON, VOLTAGE REGULATOR,
TYPES 1N4460, 1N4460C, 1N4460D THROUGH 1N4496, 1N4496C, 1N4496D, AND
1N6485, 1N6485C, 1N6485D THROUGH 1N6491, 1N6491C, 1N6491D,
1N4460US, 1N4460CUS, 1N4460DUS THROUGH 1N4496US, 1N4496CUS, 1N4496DUS, AND
1N6485US, 1N6485CUS, 1N6485DUS THROUGH 1N6491US, 1N6491CUS, 1N6491DUS,
PLUS C AND D TOLERANCE SUFFIX; JAN, JANTX, JANTXV, AND JANS
This specification is approved for use by all Departments
and Agencies of the Department of Defense.
The requirements for acquiring the product described herein shall consist of
this specification sheet and MIL-PRF-19500.
1. SCOPE
1.1 Scope. This specification covers the performance requirements for microminiature 1.5 watt silicon, low
leakage, voltage regulator diodes with tolerances of 5 percent, 2 percent, and 1 percent. Four levels of product
assurance are provided for each encapsulated device type as specified in MIL-PRF-19500.
1.2 Physical dimensions. See figure 1 (similar to DO-41), and figure 2 (surface mount).
* 1.3 Maximum ratings. TSTG = TJ(MAX) = -65C to +175C. Maximum ratings are as shown in maximum and primary
test ratings (see 3.11) herein and as follows:
PT at
TL =
+112°C
L = .375
inch
Barometric
pressure
reduced
(high
PT at
TEC
+145°C
PT(PCB1)
TA =+55°C
PT(PCB2)
TA
=+55°C
RθJL at
L =
0.375
inch
RθJEC
RθJA(PCB1) RθJA(PCB2)
=
altitude
(9.52
mm)
operation)
(9.53
mm)
1.5 W (1) 1.5 W (2)
0.6 W (3)
1.5 W (4)
8 mm Hg
42°C/W
20°C/W
200°C/W
80°C/W
(1) Derate: See figure 3 herein.
(2) Derate: See figure 4 herein.
(3) Derate: See figure 5 herein. For PCB ratings on all surface mount (US) devices, the pads = .067 inch (1.70
mm) x .105 inch (2.67 mm); For the axial-leaded devices, the pads (axial) = .092 inch (2.34 mm) diameter, strip
= .030 inch (7.62 mm) x 1 inch (25.4 mm) long, axial lead length L ≤ .187 inch (≤ 4.76 mm).
(4) Derate: See figure 6 herein. For PCB ratings on all surface mount (US) devices, the pads = .500 inch (12.70
mm) x .500 inch (12.7 mm) or the equivalent of .250 square inches in area each. For the axial-leaded devices,
the pads (axial) = .092 inch (2.34 mm) diameter, strip = .030 inch (7.62 mm) x 1 inch (25.4 mm) long, axial lead
length L ≤ .187 inch (≤ 4.76 mm). For the axial-leaded devices, the pads are also of the same equivalent area
as described for the surface mount US devices.
Comments, suggestions, or questions on this document should be addressed to Defense Supply Center,
Columbus, ATTN: DSCC-VAC, P.O. Box 3990, Columbus, OH 43218-3990, or emailed to
Semiconductor@dscc.dla.mil. Since contact information can change, you may want to verify the currency of this
address information using the ASSIST Online database at http://assist.daps.dla.mil.
AMSC N/A
FSC 5961
MIL-PRF-19500/406G
1.4 Primary electrical characteristics. Primary electrical characteristics are as shown in maximum and primary test
ratings (see 3.11) and as follows:
3.3 V dc ≤ VZ ≤ 200 V dc (nominal).
a. 1N4460D through 1N4496D and 1N6485D through 1N6491D are 1 percent voltage tolerance.
b. 1N4460C through 1N4496C and 1N6485C through 1N6491C are 2 percent voltage tolerance.
c. 1N4460 through 1N4496 and 1N6485 through 1N6491 are 5 percent voltage tolerance.
R
θJL = 42°C/W (max) at L = .375 inch (9.52 mm) (nonsurface mount).
θJEC = 20°C/W (max) (surface mount).
R
2. APPLICABLE DOCUMENTS
2.1 General. The documents listed in this section are specified in sections 3, 4, or 5 of this specification. This
section does not include documents cited in other sections of this specification or recommended for additional
information or as examples. While every effort has been made to ensure the completeness of this list, document
users are cautioned that they must meet all specified requirements of documents cited in sections 3, 4, or 5 of this
specification, whether or not they are listed.
2.2 Government documents.
2.2.1 Specifications, standards, and handbooks. The following specifications, standards, and handbooks form a
part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are
those cited in the solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATIONS
MIL-PRF-19500
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-750 Test Methods for Semiconductor Devices.
-
Semiconductor Devices, General Specification for.
-
* (Copies of these documents are available online at http://assist.daps.dla.mil/quicksearch/ or
http://assist.daps.dla.mil. or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D,
Philadelphia, PA 19111-5094.)
2.3 Order of precedence. In the event of a conflict between the text of this document and the references cited
herein, the text of this document takes precedence. Nothing in this document, however, supersedes applicable laws
and regulations unless a specific exemption has been obtained.
3. REQUIREMENTS
3.1 General. The individual item requirements shall be as specified in MIL-PRF-19500 and as modified herein.
3.2 Qualification. Devices furnished under this specification shall be products that are authorized by the qualifying
activity for listing on the applicable qualified manufacturer's list (QML) before contract award (see 4.2 and 6.3).
2
MIL-PRF-19500/406G
Ltr
Dimensions
Millimeters
Max
4.06
Notes
Inches
Max
Min
Min
2.69
BL
BD
LL
LD
LU
.106
.060
.800
.028
.160
3
3
.085
1.300
.032
1.52
20.32
0.71
2.16
33.02
0.81
.050
1.27
4
NOTES:
1. Dimensions are in inches.
2. Millimeters are given for general information only.
*
3. Package contour optional with BD and length BL. Heat slugs, if any, shall be included within this cylinder
length but shall not be subject to minimum limit of BD.
4. The specified lead diameters apply in the zone between .050 inch (1.27 mm) from the diode body and the
end of the lead.
5. In accordance with ASME Y14.5M, diameters are equivalent to φx symbology.
*
FIGURE 1. Physical dimensions of nonsurface mount device (similar to DO-41).
3
MIL-PRF-19500/406G
Ltr
Dimensions
Millimeters
Inches
Min
.168
.019
.003
.091
Max
.200
.028
Min
4.28
0.48
0.08
2.31
Max
5.08
0.71
BL
ECT
S
BD
.103
2.62
NOTES:
1. Dimensions are in inches.
2. Millimeters are given for general information only.
3. In accordance with ASME Y14.5M, diameters are equivalent to φx symbology.
4. Dimensions are pre-solder dip.
*
* FIGURE 2. Physical dimensions of surface mount device, US(D5A).
4
MIL-PRF-19500/406G
3.3 Abbreviations, symbols, and definitions. The abbreviations, symbols, and definitions used herein shall be as
specified in MIL-PRF-19500, and as follows:
EC .............. End-cap.
US ............. Surface mount case outline, square end-cap.
3.4 Interface and physical dimensions. Interface and physical dimensions shall be as specified in
MIL-PRF-19500, and on figures 1 and 2 herein.
3.4.1 Diode construction. These devices shall be constructed utilizing the requirements of MIL-PRF-19500 and as
follows.
3.4.1.1 Metallurgical bond for diodes with VZ greater than 6.8 V dc. Category I metallurgical bonds for diodes with
VZ greater than 6.8 V dc as defined in MIL-PRF-19500 shall be utilized.
3.4.1.2 Metallurgical bond for diodes with VZ less than or equal to 6.8 V dc. Category I or category III metallurgical
bonds as defined in MIL-PRF-19500.
3.5 Marking. Marking shall be in accordance with MIL-PRF-19500.
3.5.1 Marking of US version devices. For US version devices only, all marking may be omitted from the device
except for the cathode marking. All marking which is omitted from the body of the device shall appear on the label of
the initial container.
3.6 Lead finish. Lead finish shall be solderable in accordance with MIL-PRF-19500, MIL-STD-750, and herein.
When solder alloy is used for lead finish the maximum lead temperature shall be 175°C max. Where a choice of lead
finish is desired, it shall be specified in the acquisition document (see 6.2).
3.7 Polarity. The polarity of all types shall be indicated with a contrasting color band to denote the cathode end.
Alternatively, for US suffix devices, a minimum of three contrasting color dots spaced around the periphery on the
cathode end may be used.
3.8 Selection of tighter tolerance devices. The C and D suffix devices shall be selected from JAN, JANTX, JANTXV,
or JANS devices, which have successfully completed all applicable screening, and groups A, B, and C testing as ±5
percent tolerance devices. All sublots of C and D suffix devices shall pass table I, subgroup 2, at tightened tolerances.
Tighter tolerances for mounting clip temperature shall be maintained for reference purposes to establish correlation.
For C and D tolerance levels, TL = 25°C +1°C, -3°C at .375 inch (9.53 mm) from body or equivalent.
3.9 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance
characteristics are as specified in 1.3, 1.4, table I, and table II herein.
3.10 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table I herein.
3.11 Maximum and primary test ratings. Maximum and primary test ratings for voltage regulator diodes are specified
in table III herein.
3.12 Workmanship. Semiconductor devices shall be processed in such a manner as to be uniform in quality and
shall be free from other defects that will affect life, serviceability, or appearance.
5
MIL-PRF-19500/406G
4. VERIFICATION
4.1 Classification of inspections. The inspection requirements specified herein are classified as follows:
a. Qualification inspection (see 4.2).
b. Screening (see 4.3).
c. Conformance inspection (see 4.4).
4.1.1 Lot accumulation. Lot accumulation period shall be 3 months in lieu of 6 weeks.
4.2 Qualification inspection. Qualification inspection shall be in accordance with MIL-PRF-19500, and as specified
herein. Supplier imposed requirements shall be documented in the QM plan and must be submitted to the qualifying
activity for approval. Radiation characterization may be submitted in the QM plan at the option of the manufacturer.
*
4.2.1 Group E qualification. Group E inspection shall be performed for qualification or re-qualification only. In
case qualification was awarded to a prior revision of the specification sheet that did not request the performance of
table II tests, the tests specified in table II herein that were not performed in the prior revision shall be performed on
the first inspection lot of this revision to maintain qualification.
6
MIL-PRF-19500/406G
4.3 Screening (JANS, JANTXV and JANTX levels only). Screening shall be in accordance with appendix E, table
IV of MIL-PRF-19500, and as specified herein. Specified electrical measurements shall be made in accordance with
table I herein. Devices that exceed the limits of table I herein shall not be acceptable.
Screen (see
Measurements
table IV of
MIL-PRF-19500)
JANS level
JANTX and JANTXV levels
Not required
1a
Required
1b
Required
Required (JANTXV only)
2
3a
Not required
Required
Not required
Required
3b
(1) 3c
Not applicable
Thermal impedance, see 4.3.2
Not applicable
Not applicable
Not applicable
Optional
Required
Not applicable
Thermal impedance, see 4.3.2
Not applicable
Not applicable
Not applicable
Optional
Not required
Not applicable
Not applicable.
IR1 and VZ
4
5
6
7
8
9
IR1 and VZ (1N4466 thru 1N4496 only)
Required for device > 10 V dc.
10
11
I
R1 and VZ ∆IR1 ≤ ±100 percent of initial
reading or 50 nA dc, whichever is greater.
∆VZ ≤ ±2 percent of initial reading. (2)
Required see 4.3.3
12
Required see 4.3.3
Required
(2) (3) 13
Required
Scope display see 4.5.7.
Subgroup 2 of table I herein;
Subgroups 2 and 3 of table I herein; ∆IR1
∆IR1 (max) ≤ ±100 percent of initial reading
or 50 nA, whichever is greater; ∆VZ ≤ ±2
percent of initial reading.
Not applicable
Required
(max) ≤ ±100 percent of initial reading or 50
nA, whichever is greater; ∆VZ ≤ ±2 percent
of initial reading.
Not applicable
Required
14a
(4) 14b
15
Required
Required
Not required
Not required
16
(1) This test shall be performed anytime after screen 3.
(2) Delta limits applicable to 1N4466 thru 1N4496 only.
(3) Thermal impedance not applicable, if already performed 100 percent.
(4) For clear glass diodes, the hermetic seal (gross leak) may be performed at any time after temperature cycling.
7
MIL-PRF-19500/406G
* 4.3.2 Thermal impedance. The thermal impedance measurements shall be performed in accordance with method
3101 or 4081 as applicable of MIL-STD-750 using the guidelines in that method for determining I , I , t , t
(V
C
M
H
H
SW
and V where appropriate). See table II, group E, subgroup 4 herein. (For mounting conditions, see figure 7.)
H
* 4.3.3 Free air power burn-in conditions. Power burn-in conditions are as follows (see 4.5.6): T = 75°C maximum.
A
Test conditions in accordance with method 1038 of MIL-STD-750, condition B. Adjust I or T to achieve the
Z
A
required T and I
shall be ≥ 50 percent of column 8 of table III. T = 135°C minimum. With approval of the
J
J
Z(min)
qualifying activity and preparing activity, alternate burn-in criteria (hours, bias conditions, TJ, mounting conditions)
may be used for JANTX and JANTXV quality levels. A justification demonstrating equivalence is required. In
addition, the manufacturing site’s burn-in data and performance history will be essential criteria for burn-in
modification approval.
4.4 Conformance inspection. Conformance inspection shall be in accordance with MIL-PRF-19500 and as
specified herein.
* 4.4.1 Group A inspection. Group A inspection shall be in accordance with MIL-PRF-19500 and table I herein.
4.4.2 Group B inspection. Group B inspection shall be conducted in accordance with the conditions specified for
subgroup testing in appendix E table VIa (JANS) and VIb (JAN, JANTX, and JANTXV) of MIL-PRF-19500. Electrical
measurements (end-points) shall be in accordance with the applicable inspections of table I, subgroup 2 herein. Z
is an end-point for these subgroups: B2 and B3 (JAN, JANTX and JANTXV product levels only).
θJX
4.4.2.1 Group B inspection, table VIa (JANS) of MIL-PRF-19500.
Subgroup
Method
1056
Condition
B3
B3
B4
0°C to +100°C, 25 cycles, n = 22, c = 0.
-55°C to +175°C, 100 cycles, n = 22, c = 0.
1051
1037
IZ = column 8 of table III at TA = room ambient as defined in the general
requirements of 4.5 of MIL-STD-750; for 2,000 cycles.
B5
1027
IZ = 50 percent of column 8 of table III minimum; adjust TA and or IZ to achieve
TJ minimum. Temporary leads may be added for surface mount devices.
Option 1: TA = +100°C max; TJ = +275°C minimum; t = 96 hours. n = 22,
c = 0.
or
Option 2: TA = +30°C max; TJ = +175°C minimum; t = 1,000 hours, n = 45, c = 0.
8
MIL-PRF-19500/406G
4.4.2.2 Group B inspection, table VIb (JAN, JANTX and JANTXV of MIL-PRF-19500).
Subgroup
Method
1056
Condition
B2
B2
B2
0°C to +100°C, 10 cycles, n = 22, c = 0.
-55°C to +175°C, 25, cycles, n = 22, c = 0.
1051
1071
Test condition E only.
NOTE: For non-transparent devices, hermetic seal may be performed after
electrical measurements.
B3
1027
IZ(min) = 50 percent of column 8 of table III minimum. Adjust IZ or TA to
achieve TJ = 150°C min (see 4.5.6).
4.4.3 Group C inspection. Group C inspection shall be conducted in accordance with the conditions specified for
subgroup testing in appendix E table VII of MIL-PRF-19500 and herein. Electrical measurements (end-points) shall
be in accordance with the applicable inspections of table I, subgroup 2 herein. ZθJX is an end-point for these
subgroups: C2 and C6 (JAN, JANTX and JANTXV product levels only).
* 4.4.3.1 Group C inspection, table VII of MIL-PRF-19500.
Subgroup
C2
Method
1056
Condition
0°C to +100°C, 15 cycles, n = 22, c = 0.
-55°C to +175°C, 25 cycles, n = 22, c = 0.
C2
1051
C2
2036
Tension - test condition A; 10 lbs; t = 15 s ±3 s. Lead fatigue - Test condition
E.
NOTE: Not applicable to US versions.
C2
1071
Test condition E only.
NOTE: For non-transparent devices, hermetic seal may be performed after
electrical measurements.
C5
C6
4081
1027
RθJL and RθJEC see 1.3 and 4.3.2 herein.
IZ(min) = 50 percent of column 8 of table III minimum. Adjust IZ or T to achieve
A
TJ = 150°C min (see 4.5.6).
C7
C8
Not applicable.
4071
Temperature coefficient for JAN, JANTX, and JANTXV only; IZ = column 5 of
table III; TA1 = +25°C ±5°C; TA2 = +125°C ±5°C; limit = column 13 of table III
(see 4.5.3).
4.4.4 Group E inspection. Group E inspection shall be conducted in accordance with the conditions specified for
subgroup testing in table IX of MIL-PRF-19500 and as specified in table II herein. Electrical measurements (end-
points) shall be in accordance with table I, subgroup 2 herein.
9
MIL-PRF-19500/406G
4.5 Methods of inspection. Methods of inspection shall be as specified in the appropriate tables and as follows.
4.5.1 Surge current (IZSM). The peak currents specified in column 10 of table III shall be applied in the reverse
direction and shall be superimposed on the current (IZ = column 5 of table III) a total of five surges at 1 minute
intervals. Each individual surge shall be at one-half square wave pulse of 8.3 millisecond duration or an equivalent
sine wave with the same effective (rms) current.
4.5.2 Voltage regulation (VZ(reg)). A current of 10 percent of IZ (column 8 of table III) shall be maintained until thermal
equilibrium is attained and the VZ shall be noted. The current shall then be increased to a level of 50 percent of IZ (column
8 of table III) and maintained at this level until thermal equilibrium is attained at which time the voltage change shall not
exceed column 9 of table III. For this test, the diode shall be suspended by its leads (nonsurface mount) with mounting
clips whose inside edge is located at .375 ± .010 inch (9.53 ±0.25 mm) from the body and the lead temperature at inside
edge of the mounting clips shall be maintained at a temperature between +23°C and +33°C. For surface mount
packages, the diode shall be suspended by the end-caps with the temperature of the end-caps being maintained between
+23°C and +33°C. This measurement may be performed after a shorter time interval following application of the test
current than that which provides thermal equilibrium if correlation can be established to the satisfaction of the qualifying
activity.
4.5.3 Temperature coefficient of regulator voltage (αVZ). The device shall be temperature stabilized with current
applied prior to reading regulator voltage at the specified ambient temperature.
4.5.4 Regulator voltage. The test current (column 5 of table III) shall be applied until thermal equilibrium is attained
prior to reading the regulator voltage. For this test, the diode shall be suspended by its leads (non-surface mount) with
mounting clips whose inside edge is located at .375 ± .010 inch (9.53 ±0.25 mm) from the body and the lead
temperature at inside edge of the mounting clips shall be maintained at a temperature of +23°C to +33°C. For surface
mount diodes, the diode shall be suspended by the end-caps with the temperature of the end-caps being maintained at
+23°C to +33°C. This measurement may be performed after a shorter time following application of the test current than
that which provides thermal equilibrium if correlation to stabilized readings can be established to the satisfaction of the
qualifying activity.
4.5.5 Pulse measurements. Conditions for pulse measurements shall be as specified in section 4 of
STD-750.
MIL-
* 4.5.6 Free air power burn-in and life tests. The use of a current limiting or ballast resistor is permitted provided that
each DUT still sees at least I described in 4.3.3 and that the minimum applied voltage, where applicable, is
Z(min)
maintained throughout the burn-in period. Use method 3100 of MIL-STD-750 to measure TJ.
4.5.7 Scope display evaluation. Scope display evaluation shall be sharp and stable in accordance with method
4023 of MIL-STD-750. Scope display may be performed on ATE (automatic test equipment) for screening only, with
the approval of the qualifying activity. Scope display in table I, subgroup 4 shall be performed on a scope. The
reverse current (IBR) over the knee shall be 500 µA peak.
4.5.7.1 Scope display option. At the suppliers option, 100-percent scope display evaluation may be discontinued
after three consecutive lots are 100-percent tested with zero failures. Any table I failure shall require 100-percent
scope display to be reinvoked.
10
MIL-PRF-19500/406G
TABLE I. Group A inspection.
Inspection 1/
Subgroup 1
MIL-STD-750
Symbol
Limits 2/
Unit
Method
2071
Conditions
Min
Max
Visual and mechanical
examination
Subgroup 2
Thermal impedance
3101
See 4.3.2
°C/W
Z
θJX
Forward voltage
Forward voltage
4011
4011
4016
1.0
1.5
V dc
V dc
IF = 200 mA dc
IF = 1 A dc
VF1
VF2
IR1
Reverse current
leakage
Column
12
µA dc
DC method; VR = column
11 of table III
Regulator voltage
4022
Column 3
-5, -2, -1
percent
Column 4
+5, +2, +1
percent
V dc
IZ = column 5 of table III
(see 4.5.4)
VZ
Subgroup 3
High temperature
operation
TA = +150°C
Reverse current
leakage
4016
4051
Column
15
µA dc
DC method; VR = column
11 of table III
IR2
Subgroup 4
Small-signal reverse
breakdown
impedance
Column 6
Column 7
ohms
ohms
IZ = column 5 of table III
Isig = 10 percent IZ
ZZ
Knee impedance
4051
4023
I
ZK = column 14 of table III
ZZK
Isig = 10 percent IZK
Scope display
evaluation
See 4.5.7
See footnotes at end of table.
11
MIL-PRF-19500/406G
TABLE I. Group A inspection - Continued.
Inspection 1/
Subgroup 5
MIL-STD-750
Symbol
Limits 2/
Unit
Method
Conditions
Min
Max
Not applicable
Subgroup 6
Surge current
4066
Column
10
I
ZSM = column 10 of table III
IZSM
at TA +25°C (see 4.5.1).
End-point electrical
measurements
See table I, subgroup 2
except Z
θJX
Subgroup 7
Voltage regulation
See 4.5.2
Column 9
V dc
VZ(reg)
Temperature
coefficient of
regulator
4071
JANS level only
IZ = column 5 of table III
Column
13
αVZ
%/°C
T
T
A1 = +25°C ±5°C,
A2 = 120°C ≤ T2 ≤ 130°C
voltage
1/ For sampling plan, see MIL-PRF-19500.
2/ Column references are to table III.
12
MIL-PRF-19500/406G
* TABLE II. Group E inspection (all quality levels).
MIL-STD-750
Inspection 1/
Subgroup 1
Sampling plan
Method
Conditions
22 devices c = 0
1056
1051
Thermal shock
20 cycles, condition D except low temperature shall
be achieved using liquid nitrogen (-195°C).
Do a visual for cracked glass.
-65°C to +175°C, 500 cycles.
Temp cycling
Electrical measurements
Subgroup 2
See table I, subgroup 2.
22 devices c = 0
Steady-state intermittent
operating life
1037
IZ = IZ2 (column 8 of table III) at TA = room ambient
for 10,000 cycles. No forced air cooling on the
device shall be permitted.
Electrical measurements
Subgroup 4
See table I, subgroup 2.
Sample size
N/A
Thermal impedance
curves
See MIL-PRF-19500.
Subgroups 5 and 6
Not applicable
Subgroup 8
Resistance to glass
cracking
1057
n = 45
Condition B. Step stress to destruction by
increased cycles or up to a maximum of 25 cycles.
1/ A separate sample may be pulled for each test.
13
MIL-PRF-19500/406G
* TABLE III. Electrical characteristics and test conditions (all case outlines).
Col 1
Col 2 Col 3 Col 4 Col 5 Col 6 Col 7 Col 8 Col 9 Col 10 Col 11 Col 12 Col 13 Col 14 Col 15
Device
VZ
VZ
VZ
IZ test ZZ
ZK
IZ(max) VZ(reg) IZSM
VR
IR
IZK
IR
αVZ
type
Nom
Min
1/ 2/
Max current Imped- Knee dc
voltage
Reverse Reverse Temper- Test Reverse
ance
imped- current regula- TA = voltage current ature current current dc
1/ 2/
TA
=
ance
TA
=
tion
4/
dc
IR1
coeffi-
cient
6/
TA =
+150°C
+25°C
5/
+25°C
+25°C
3/
IR2
V
V
V
mA
mA
V
A
V
mA
Ω
Ω
µA
%/°C
µA
1N6485
1N6486
1N6487
1N6488
1N6489
3.3
3.6
3.9
4.3
4.7
3.14
3.42
3.71
4.09
4.47
3.46
3.78
4.09
4.51
4.93
76
69
64
58
53
10
10
9
9
8
400
400
400
400
500
433
397
366
332
304
0.9
0.8
.75
.70
.60
4.2
3.9
3.6
3.3
3.0
1.0
50.00 -.075
50.00 -.070
35.00 -.060
1.00 500
1.00 200
1.00 100
1.00 100
1.00 100
1.0
1.0
1.0
1.0
5.00
4.00
-.050
±.025
1N6490
1N6491
1N4460
1N4461
1N4462
5.1
5.6
6.2
6.8
7.5
4.85
5.32
5.89
6.46
7.13
5.35
5.88
6.51
7.14
7.87
49
45
40
37
34
7
5
4
2.5
2.5
500
600
200
200
400
280
255
230
210
191
.5
2.7
2.5
2.3
2.1
1.9
1.0
2.0
3.72
4.08
4.50
1.00
0.50
10.00 +.050
5.00
1.00
1.00 100
1.00 100
±.030
±.040
.40
.35
.30
.35
1.00
1.00
0.50
50
20
10
+.057
+.061
1N4463
1N4464
1N4465
1N4466
1N4467
8.2
9.1
10
11
12
7.79
8.65
9.50
10.45 11.55
11.40 12.60
8.61
9.55
10.50
31
28
25
23
21
3.0
4.0
5.0
6.0
7.0
400
500
500
550
550
174
157
143
130
119
.40
.45
.50
.55
.60
1.7
1.6
1.4
1.3
1.2
4.92
5.46
8.0
8.8
9.6
0.50
0.30
0.30
0.30
0.20
+.065
+.068
+.071
+.073
+.076
0.50
0.50
0.25
0.25
0.25
5
3
3
2
2
1N4468
1N4469
1N4470
1N4471
1N4472
13
15
16
18
20
12.35 13.65
14.25 15.75
15.20 16.80
17.10 18.90
19.00 21.00
19
17
15.5
14
12.5
8.0
9.0
10.0
11.0
12.0
550
600
600
650
650
110
95
90
79
71
.65
.75
.80
.83
.95
1.1
.95
.90
.79
.71
10.4
12.0
12.8
14.4
16.0
0.05
0.05
0.05
0.05
0.05
+.079
+.082
+.083
+.085
+.086
0.25
0.25
0.25
0.25
0.25
2
2
2
2
2
1N4473
1N4474
1N4475
1N4476
1N4477
22
24
27
30
33
20.90 23.10
22.80 25.20
25.70 28.30
28.50 31.50
31.40 34.60
11.5
10.5
9.5
8.5
7.5
14
16
18
20
25
650
700
700
750
800
65
60
53
48
43
1.0
1.1
1.3
1.4
1.5
.65
.60
.53
.48
.43
17.6
19.2
21.6
24.0
26.4
0.05
0.05
0.05
0.05
0.05
+.087
+.088
+.090
+.091
+.092
0.25
0.25
0.25
0.25
0.25
2
2
2
2
2
See footnotes at end of table.
14
MIL-PRF-19500/406G
* TABLE III. Electrical characteristics and test conditions (all case outlines) - Continued.
Col 1
Col 2 Col 3 Col 4 Col 5 Col 6 Col 7 Col 8
Col 9 Col 10 Col 11 Col 12 Col 13 Col 14 Col 15
Device
VZ
VZ
VZ
IZ test ZZ
ZK
IZ(max)
VZ(reg) IZSM
VR
IR
IZK
IR
αVZ
type
Nom
Min
1/ 2/
Max current Imped- Knee dc
voltage
ReverseReverse Temper- Test
Reverse
ance
imped- current regula- TA = voltage current ature current current dc
1/ 2/
V
TA
+25°C
=
ance
TA
+25°C
3/
=
tion
4/
dc
IR1
coeffi-
cient
6/
TA =
+150°C
IR2
+25°C
5/
V
V
mA
mA
V
A
V
mA
Ω
Ω
µA
%/°C
µA
1N4478
1N4479
1N4480
1N4481
1N4482
36
39
43
47
51
34.2
37.1
40.9
44.7
48.5
37.8
40.9
45.1
49.3
53.5
7.0
6.5
6.0
5.5
5.0
27
30
40
50
60
850
900
950
1000
1100
40
37
33
30
28
1.7
1.8
1.9
2.1
2.3
.40
.37
.33
.30
.28
28.8
.05
.05
.05
.05
.05
+.093 0.25
+.094 0.25
+.095 0.25
+.095 0.25
+.096 0.25
2
2
2
2
2
31.2
34.4
37.6
40.8
1N4483
1N4484
1N4485
1N4486
1N4487
56
62
68
75
82
53.2
58.9
64.6
71.3
77.9
58.8
65.1
71.4
78.7
86.1
4.5
4.0
3.7
3.3
3.0
70
80
100
130
160
1300
1500
1700
2000
2500
26
23
21
19
17
2.5
2.7
3.0
3.3
3.6
.26
.23
.21
.19
.17
44.8
49.6
54.4
60.0
65.6
.25
.25
.25
.25
.25
+.096 0.25
+.097 0.25
+.097 0.25
+.098 0.25
+.098 0.25
10
10
10
10
10
1N4488
1N4489
1N4490
1N4491
1N4492
91
86.5
95.0
104.5 115.5
114.0 126.0
123.5
95.5
105.0
2.8
2.5
2.3
2.0
1.9
200
250
300
400
500
3000
3100
4000
4500
5000
16
14
13
12
11
4.0
4.4
5.0
5.5
6.0
.16
.14
.13
.12
.11
72.8
80.0
88.0
96.0
104
.25
.25
.25
.25
.25
+.099 0.25
+.100 0.25
+.100 0.25
+.100 0.25
+.100 0.25
10
10
10
10
10
100
110
120
130
1N4493
1N4494
1N4495
1N4496
150
160
180
200
142.5 157.5
1.7
1.6
1.4
1.2
700
6000
6500
7000
8000
9.5
8.9
7.9
7.2
7.0
8.0
10.0
12.0
.095
.089
.079
.072
120
128
144
160
.25
.25
.25
.25
+.100 0.25
+.100 0.25
+.100 0.25
+.100 0.25
10
10
10
10
152
171
190
168
189
210
1000
1300
1500
1/ See 4.5.5. Voltages shown are for 5 percent tolerance devices. Voltages for 2 and 1 percent tolerances devices shall be
calculated accordingly.
2/ 1N4460D through 1N4496D and 1N6485D through 1N6491D are 1 percent voltage tolerance.
1N4460C through 1N4496C and 1N6485C through 1N6491C are 2 percent voltage tolerance.
1N4460 through 1N4496 and 1N6485 through 1N6491 are 5 percent voltage tolerance.
3/ See 1.3 for PT temperature conditions for Lead or End Cap where IZM is applicable.
4/ See 4.5.2.
5/ See 4.5.1.
6/ See 4.5.3.
15
MIL-PRF-19500/406G
Temperature-Power Derating Curve
Axial Leads Similar to DO-41
1.6
1.4
1.2
1
0.8
0.6
0.4
0.2
0
25
DC Operation
Thermal Resistance Junction to Leads 3/8" = 42.0ºC/W
50
75
100
125
150
175
200
Tl (ºC) (Leads 3/8")
NOTES:
1. All devices are capable of operating at ≤ T specified on this curve. Any parallel line to this curve will intersect
J
the appropriate power for the desired maximum T allowed.
J
2. Derate design curve constrained by the maximum junction temperature (T ≤ 175°C) and power rating specified.
J
(See 1.3 herein.)
3. Derate design curve chosen at T ≤ 150°C, where the maximum temperature of electrical test is performed.
J
4. Derate design curves chosen at T ≤, 125°C, and 110°C to show power rating where most users want to limit T
J
J
in their application.
FIGURE 3. Temperature/power derating curve.
16
MIL-PRF-19500/406G
Temperature-Power Derating Curve
Surface Mount US
1.6
1.4
1.2
1
0.8
0.6
0.4
0.2
0
25
DC Operation
Thermal Resistance Junction to End Cap = 20.0ºC/W
50
75
100
125
150
175
200
Tec (ºC) (End Cap)
NOTES:
1. All devices are capable of operating at ≤ T specified on this curve. Any parallel line to this curve will intersect
J
the appropriate power for the desired maximum T allowed.
J
2. Derate design curve constrained by the maximum junction temperature (T ≤ 175°C) and power rating specified.
J
(See 1.3 herein.)
3. Derate design curve chosen at T ≤ 150°C, where the maximum temperature of electrical test is performed.
J
4. Derate design curves chosen at T ≤, 125°C, and 110°C to show power rating where most users want to limit T
J
J
in their application.
FIGURE 4. Temperature/power derating curve.
17
MIL-PRF-19500/406G
Temperature-Power Derating Curve
PCB1
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
25
DC Operation
Thermal Resistance Junction to Ambient = 200ºC/W
50
75
100
125
150
175
200
Tpcb (ºC) (Ambient)
* NOTES:
1. All devices are capable of operating at ≤ T specified on this curve. Any parallel line to this curve will intersect
J
the appropriate power for the desired maximum T allowed.
J
2. Derate design curve constrained by the maximum junction temperature (T ≤ 175°C) and power rating specified.
J
(See 1.3 herein.)
3. Derate design curve chosen at T ≤ 150°C, where the maximum temperature of electrical test is performed.
J
4. Derate design curves chosen at T ≤, 125°C, and 110°C to show power rating where most users want to limit T
J
J
in their application.
*
FIGURE 5. Temperature/power derating curve.
18
MIL-PRF-19500/406G
Temperature-Power Derating Curve
PCB2
1.6
1.4
1.2
1
0.8
0.6
0.4
0.2
0
25
DC Operation
Thermal Resistance Junction to Ambient = 80.0ºC/W
50
75
100
125
150
175
200
Tpcb (ºC) (Ambient)
* NOTES:
1. All devices are capable of operating at ≤ T specified on this curve. Any parallel line to this curve will intersect
J
the appropriate power for the desired maximum T allowed.
J
2. Derate design curve constrained by the maximum junction temperature (T ≤ 175°C) and power rating specified.
J
(See 1.3 herein.)
3. Derate design curve chosen at T ≤ 150°C, where the maximum temperature of electrical test is performed.
J
4. Derate design curves chosen at T ≤, 125°C, and 110°C to show power rating where most users want to limit T
J
J
in their application.
*
FIGURE 6. Temperature/power derating curve.
19
MIL-PRF-19500/406G
FIGURE 7. Mounting arrangement for thermal resistance measurements.
20
MIL-PRF-19500/406G
5. PACKAGING
5.1 Packaging. For acquisition purposes, the packaging requirements shall be as specified in the contract or order
(see 6.2). When packaging of materiel is to be performed by DoD or in-house contractor personnel, these personnel
need to contact the responsible packaging activity to ascertain packaging requirements. Packaging requirements are
maintained by the Inventory Control Point's packaging activities within the Military Service or Defense Agency, or
within the Military Service’s system commands. Packaging data retrieval is available from the managing Military
Department's or Defense Agency's automated packaging files, CD-ROM products, or by contacting the responsible
packaging activity.
6. NOTES
(This section contains information of a general or explanatory nature that may be helpful, but is not mandatory.)
6.1 Intended use. The notes specified in MIL-PRF-19500 are applicable to this specification.
6.2 Acquisition requirements. Acquisition documents should specify the following:
a. Title, number, and date of this specification.
b. Packaging requirements (see 5.1).
c. Lead finish (see 3.6).
d. Product assurance level and type designator.
6.3 Qualification. With respect to products requiring qualification, awards will be made only for products which are,
at the time of award of contract, qualified for inclusion in Qualified Manufacturers List (QML 19500) whether or not
such products have actually been so listed by that date. The attention of the contractors is called to these
requirements, and manufacturers are urged to arrange to have the products that they propose to offer to the Federal
Government tested for qualification in order that they may be eligible to be awarded contracts or orders for the
products covered by this specification. Information pertaining to qualification of products may be obtained from
Defense Supply Center, Columbus, ATTN: DSCC/VQE, P.O. Box 3990, Columbus, OH 43218-3990 or e-mail
vqe.chief@dla.mil.
6.4 Changes from previous issue. The margins of this specification are marked with asterisks to indicate where
changes from the previous issue were made. This was done as a convenience only and the Government assumes no
liability whatsoever for any inaccuracies in these notations. Bidders and contractors are cautioned to evaluate the
requirements of this document based on the entire content irrespective of the marginal notations and relationship to
the last previous issue.
21
MIL-PRF-19500/406G
Custodians:
Army - CR
Navy - EC
Air Force - 11
NASA - NA
DLA - CC
Preparing activity:
DLA - CC
(Project 5961-2005-043)
Review activities:
Army - AR, MI, SM
Navy - AS, MC
Air Force - 19
NOTE: The activities listed above were interested in this document as of the date of this document. Since
organizations and responsibilities can change, you should verify the currency of the information above using the
ASSIST Online database at http://assist.daps.dla.mil.
22
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