APT45GR65BSCD10 [MICROSEMI]

Insulated Gate Bipolar Transistor, 92A I(C), 650V V(BR)CES, N-Channel,;
APT45GR65BSCD10
型号: APT45GR65BSCD10
厂家: Microsemi    Microsemi
描述:

Insulated Gate Bipolar Transistor, 92A I(C), 650V V(BR)CES, N-Channel,

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APT45GR65BSCD10  
650V, 45A, VCE(on)= 1.9V Typical  
Ultra Fast NPT - IGBT®  
(B)  
The Ultra Fast 650V NPT-IGBT® family of products is the newest generation of IGBTs  
optimized for outstanding ruggedness and best trade-off between conduction and  
switching losses.  
D3PA K  
Features  
G
C
E
• Low Saturation Voltage  
• Low Tail Current  
• Short Circuit Withstand Rated  
• High Frequency Switching  
• Ultra Low Leakage Current  
• RoHS Compliant  
Combi (IGBT and Diode)  
Unless stated otherwise, Microsemi discrete IGBTs contain a single IGBT die. This device is recommended for  
applications such as induction heating (IH), motor control, general purpose inverters and uninterruptible power  
supplies (UPS).  
MAXIMUM RATINGS  
Symbol Parameter  
All Ratings: T = 25°C unless otherwise specified.  
C
Ratings  
650  
Unit  
VCES  
VGE  
Collector Emitter Voltage  
V
Gate-Emitter Voltage  
±30  
IC1  
Continuous Collector Current @ TC = 25°C  
Continuous Collector Current @ TC = 110°C  
92  
IC2  
42  
A
1
ICM  
Pulsed Collector Current  
168  
SCWT  
PD  
Short Circuit Withstand Time: VCE = 650V, VGE = 15V, TC=125°C  
Total Power Dissipation @ TC = 25°C  
10  
μs  
357  
W
TJ,TSTG  
TL  
Operating and Storage Junction Temperature Range  
Max. Lead Temp. for Soldering: 0.063" from Case for 10 Sec.  
-55 to 150  
300  
°C  
STATIC ELECTRICAL CHARACTERISTICS  
Symbol Parameter  
Min  
650  
3.5  
Typ  
Max  
Unit  
V(BR)CES  
VGE(TH)  
Collector-Emitter Breakdown Voltage (VGE = 0V, IC = 1.0mA)  
Gate Threshold Voltage (VCE = VGE, IC = 1.0mA, Tj = 25°C)  
5.0  
6.5  
2.4  
Volts  
Collector-Emitter On Voltage (VGE = 15V, IC = 45A, Tj = 25°C)  
Collector-Emitter On Voltage (VGE = 15V, IC = 45A, Tj = 125°C)  
Collector-Emitter On Voltage (VGE = 15V, IC = 90A, Tj = 25°C)  
1.9  
2.4  
2.5  
20  
VCE(ON)  
2
Collector Cut-off Current (VCE = 650V, VGE = 0V, Tj = 25°C)  
450  
ICES  
µA  
nA  
2
Collector Cut-off Current (VCE = 650V, VGE = 0V, Tj = 125°C)  
200  
IGES  
Gate-Emitter Leakage Current (VGE = ±20V)  
±250  
CAUTION: These Devices are Sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed.  
Microsemi Website - http://www.microsemi.com  
DYNAMIC CHARACTERISTICS  
APT45GR65BSCD10  
Symbol  
Cies  
Parameter  
Test Conditions  
Capacitance  
Min  
Typ  
2900  
548  
268  
7.5  
Max  
Unit  
Input Capacitance  
Coes  
Output Capacitance  
Reverse Transfer Capacitance  
Gate to Emitter Plateau Voltage  
Total Gate Charge  
VGE = 0V, VCE = 25V  
f = 1MHz  
pF  
Cres  
VGEP  
V
Gate Charge  
VGE = 15V  
VCE= 325V  
IC = 45A  
3
Qg  
150  
18  
203  
24  
Qge  
Qgc  
Gate-Emitter Charge  
nC  
74  
100  
Gate- Collector Charge  
td(on)  
tr  
td(off)  
tf  
Turn-On Delay Time  
Current Rise Time  
Inductive Switching (25°C)  
VCC = 433V  
15  
32  
ns  
µJ  
ns  
µJ  
Turn-Off Delay Time  
Current Fall Time  
100  
50  
VGE = 15V  
IC = 45A  
5
RG = 5Ω 4  
Eon  
Turn-On Switching Energy  
Turn-Off Switching Energy  
Turn-On Delay Time  
Current Rise Time  
830  
580  
15  
1245  
875  
6
Eoff  
TJ = +25°C  
td(on)  
tr  
td(off)  
tf  
Inductive Switching (125°C)  
VCC = 433V  
32  
Turn-Off Delay Time  
Current Fall Time  
123  
52  
VGE = 15V  
IC = 45A  
5
RG = 5Ω 4  
Eon  
Turn-On Switching Energy  
Turn-Off Switching Energy  
850  
800  
1275  
1160  
6
Eoff  
TJ = +125°C  
THERMAL AND MECHANICAL CHARACTERISTICS  
Symbol Characteristic  
Min  
Typ  
Max  
.35  
2.0  
40  
Unit  
Junction to Case Thermal Resistance (IGBT)  
RθJC  
°C/W  
Junction to Case Thermal Resistance (Diode)  
RθJA  
WT  
Junction to Ambient Thermal Resistance  
.22  
6.2  
oz  
g
Package Weight  
10  
in-lbf  
N∙m  
Torque  
Mounting Torque (TO-247 Package), 4-40 or M3 screw  
6.2  
1
2
3
4
5
Repetitive Rating: Pulse width and case temperature limited by maximum junction temperature.  
Pulse test: Pulse Width < 380µs, duty cycle < 2%.  
See Mil-Std-750 Method 3471.  
RG is external gate resistance, not including internal gate resistance or gate driver impedance. (MIC4452)  
Eon is the clamped inductive turn on energy that includes a commutating diode reverse transient current in the IGBT turn on energy loss. A combi device is used for the  
clamping diode.  
6
Eoff is the clamped inductive turn-off energy measured in accordance with JEDEC standard JESD24-1.  
Microsemi reserves the right to change, without notice, the specifications and information contained herein.  
0.40  
0.35  
D = 0.9  
0.30  
0.7  
0.25  
0.20  
0.5  
Note:  
t
0.15  
1
0.3  
t
2
0.10  
t
1
t
/
2
Duty Factor D =  
0.1  
0.05  
Peak T = P  
x Z  
+ T  
θJC C  
J
DM  
SINGLE PULSE  
0.05  
0
10-5  
10-4  
10-2  
10-3  
0.1  
1
RECTANGULAR PULSE DURATION (SECONDS)  
Figure 1, Maximum Effective Transient Thermal Impedance, Junction-To-Case vs Pulse Duration  
TYPICAL PERFORMANCE CURVES  
APT45GR65BSCD10  
250  
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
V
= 15V  
GE  
200  
150  
100  
50  
TJ= - 55°C  
TJ= 25°C  
TJ= 125°C  
TJ= 150°C  
0
0
10 20 30 40 50 60 70 80 90  
0
1
2
3
4
5
I (A)  
V
, COLLECTOR-TO-EMITTER VOLTAGE (V)  
C
CE  
FIGURE 2, Max Frequency vs Current (T  
= 75°C)  
FIGURE 3, Saturation Voltage Characteristics  
case  
150  
4
15V 13V  
I
= 90A  
C
125  
100  
75  
50  
25  
0
10V  
9.0V  
3
2
1
0
I
= 45A  
C
8.0V  
7.5V  
7V  
6.5V  
I
= 22.5A  
C
VGE = 15V.  
250µs PULSE TEST  
<0.5 % DUTY CYCLE  
-50 -25  
0
25  
50  
75  
100 125  
0
2
4
6
8
10 12 14 16 18 20  
, COLLECTOR-TO-EMITTER VOLTAGE (V)  
T , Junction Temperature (°C)  
V
J
CE  
FIGURE 5, On State Voltage vs Junction Temperature  
FIGURE 4, Output Characteristics (T = 25°C)  
J
4
200  
150  
100  
50  
TJ = 25°C.  
250µs PULSE  
TEST<0.5 % DUTY  
CYCLE  
250µs PULSE TEST  
<0.5 % DUTY CYCLE  
TJ= -55°C  
3
I
= 90A  
C
I
= 45A  
C
2
1
I
= 22.5A  
C
TJ= 150°C  
TJ= 125°C  
TJ= 25°C  
0
0
2
4
6
8
10  
12  
8
10  
12  
14  
16  
18  
V
, GATE-TO-EMITTER VOLTAGE (V)  
V
, GATE-TO-EMITTER VOLTAGE (V)  
GE  
GE  
FIGURE 7, On State Voltage vs Gate-to-Emitter Voltage  
FIGURE 6, Transfer Characteristics  
120  
1.15  
1.10  
100  
80  
60  
40  
20  
0
1.05  
1.00  
0.95  
0.90  
0.85  
0
25  
50  
75  
100  
125 150  
-50 -25  
0
25  
50  
75  
100 125  
T , Case Temperature (°C)  
T , JUNCTION TEMPERATURE  
C
J
FIGURE 9, DC Collector Current vs Case Temperature  
FIGURE 8, Breakdown Voltage vs Junction Temperature  
TYPICAL PERFORMANCE CURVES  
APT45GR65BSCD10  
1.0E−8  
18  
16  
14  
12  
10  
I
= 45A  
C
T
= 25°C  
Cies  
J
V
= 130V  
CE  
1.0E−9  
1.0E−10  
1.0E−11  
V
= 325V  
CE  
Coes  
8
V
= 520  
CE  
Cres  
6
4
2
0
0
20 40 60 80 100 120 140 160 180  
GATE CHARGE (nC)  
0
10  
20  
30  
40  
50  
V
, COLLECTOR-TO-EMITTER VOLTAGE (VOLTS)  
CE  
FIGURE 11, Gate charge  
FIGURE 10, Capacitance vs Collector-To-Emitter Voltage  
90  
1000  
VCE = 433V, VGE=15V, RG = 5Ω  
TJ = 25°C or 125°C  
80  
70  
60  
50  
40  
30  
20  
10  
0
T
T
d(off)  
r
100  
T
T
f
d(on)  
VCE = 433V, VGE=15V, RG = 5Ω  
TJ = 25°C  
TJ = 125°C  
10  
0
I
20  
40  
60  
80  
100  
0
20  
40  
60  
80  
100  
, COLLECTOR-TO-EMITTER CURRENT (A)  
I
, COLLECTOR-TO-EMITTER CURRENT (A)  
CE  
CE  
FIGURE 12, Turn-On Time vs Collector Current  
FIGURE 13, Turn-Off Time vs Collector Current  
900  
800  
700  
600  
500  
400  
300  
200  
100  
2500  
2000  
1500  
1000  
500  
0
E
off  
E
off  
E
on  
E
on  
VCE = 650V, VGE=15V, RG = 5Ω  
TJ = 25°C  
TJ = 125°C  
VCE = 650V, VGE=15V, IC = 45A  
TJ = 125°C  
0
10  
20  
30  
40  
50  
0
10  
20  
30  
40  
50  
R , GATE RESISTANCE (Ω)  
I
, COLLECTOR-TO-EMITTER CURRENT (A)  
G
CE  
FIGURE 15, Energy Loss vs Gate Resistance  
FIGURE 14, Energy Loss vs Collector Current  
1000  
800  
600  
400  
200  
1000  
100  
10  
E
on  
E
off  
.1ms  
1ms  
1
10ms  
VCE = 650V, VGE=15V, RG = 5Ω  
100ms  
IC = 45A  
0
0.1  
1
10  
100  
1000  
0
25  
50  
75  
100  
125  
V
, COLLECTOR-TO-EMITTER VOLTAGE  
CE  
T , JUNCTION TEMPERATURE (°C)  
J
FIGURE 17, Minimum Switching Safe Operating Area  
FIGURE 16, Energy Losses vs Junction Temperature  
TYPICAL PERFORMANCE CURVES  
APT45GR65BSCD10  
ZERO RECOVERY LOW LEAKAGE SIC ANTI-PARALLEL DIODE  
MAXIMUM RATINGS  
All Ratings: T = 25°C unless otherwise specified.  
C
Symbol Characteristic / Test Conditions  
Ratings  
Unit  
TC = 25°C  
17  
9
IF  
Maximum D.C. Forward Current  
TC = 100°C  
Amps  
IFRM  
IFSM  
50  
Repetitive Peak Forward Surge Current (TJ = 45°C, tp = 10ms, Half Sine Wave)  
Non-Repetitive Forward Surge Current (TJ = 25°C, tp = 10ms, Half Sine)  
110  
STATIC ELECTRICAL CHARACTERISTICS  
Symbol Characteristic / Test Conditions  
Min  
Typ  
Max  
Unit  
IF = 10A TJ = 25°C  
IF = 10A, TJ = 150°C  
1.5  
2.0  
80  
VF  
Qc  
Forward Voltage  
Volts  
nC  
Total Capactive Charge VR = 300V, IF = 10A, di/dt = -500A/µs, TJ = 25°C  
Junction Capacitance VR = 1V, TJ = 25°C, f = 1MHz  
300  
72  
CT  
Junction Capacitance VR = 100V, TJ = 25°C, f = 1MHz  
Junction Capacitance VR = 300V, TJ = 25°C, f = 1MHz  
pF  
47  
2.5  
2.0  
1.5  
1.0  
Note:  
t
1
t
2
0.5  
0
t
1
t
/
2
Duty Factor D =  
Peak T = P x Z  
+ T  
C
J
DM  
θJC  
10-5  
10-4  
10-3  
10-2  
0.1  
1
RECTANGULAR PULSE DURATION (seconds)  
FIGURE 18. MAXIMUM EFFECTIVE TRANSIENT THERMAL IMPEDANCE, JUNCTION-TO-CASE vs. PULSE DURATION  
20  
18  
16  
14  
12  
10  
T
= -55°C  
J
T
= 25°C  
J
15  
10  
T
= 125°C  
J
T
= 150°C  
J
8
6
4
2
0
5
0
0
1
2
3
4
25  
50  
75  
Case Temperature (°C)  
FIGURE 20, Maximum Forward Current vs. Case Temperature  
100  
125  
150  
V , ANODE-TO-CATHODE VOLTAGE (V)  
F
FIGURE 19, Forward Current vs. Forward Voltage  
APT45GR65BSCD10  
TYPICAL PERFORMANCE CURVES  
70  
120  
100  
80  
60  
50  
40  
30  
20  
10  
0
60  
40  
20  
0
0
100  
200  
300  
400  
500 600  
25  
50  
75  
100  
125  
150  
CASE TEMPERATURE (°C)  
Figure 21. Maximum Power Dissipation vs. Case Temperature  
VR, REVERSE VOLTAGE (V)  
Figure 22. Reverse Recovery Charge vs. VR  
350  
300  
250  
200  
150  
100  
50  
0
0
100  
200  
300  
400  
V , REVERSE VOLTAGE (V)  
R
Figure 23. Junction Capacitance vs. Reverse Voltage  
TO-247 Package Outline  
4.69 (.185)  
5.31 (.209)  
15.49 (.610)  
16.26 (.640)  
1.49 (.059)  
2.49 (.098)  
5.38 (.212)  
6.20 (.244)  
6.15 (.242) BSC  
20.80 (.819)  
21.46 (.845)  
3.50 (.138)  
3.81 (.150)  
2.87 (.113)  
3.12 (.123)  
4.50 (.177) Max.  
1.65 (.065)  
2.13 (.084)  
0.40 (.016)  
0.79 (.031)  
19.81 (.780)  
20.32 (.800)  
1.01 (.040)  
1.40 (.055)  
Gate  
Collector  
Emitter  
2.21 (.087)  
2.59 (.102)  
5.45 (.215) BSC  
2-Plcs.  
Dimensions in Millimeters (Inches)  
APT45GR65BSCD10  
Disclaimer:  
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CONFIDENTIAL information of Microsemi and cannot be copied, published, uploaded, posted, transmitted, distributed or disclosed or used  
without the express duly signed written consent of Microsemi. If the recipient of this document has entered into a disclosure agreement with  
Microsemi, then the terms of such Agreement will also apply . This document and the information contained herein may not be modified, by  
any person other than authorized personnel of Microsemi. No license under any patent, copyright, trade secret or other intellectual property  
right is granted to or conferred upon you by disclosure or delivery of the information, either expressly, by implication, inducement, estoppels or  
otherwise. Any license under such intellectual property rights must be approved by Microsemi in writing signed by an officer of Microsemi.  
Microsemi reserves the right to change the configuration, functionality and performance of its products at anytime without any notice. This  
product has been subject to limited testing and should not be used in conjunction with life-support or other mission-critical equipment or  
applications. Microsemi assumes no liability whatsoever, and Microsemi disclaims any express or implied warranty, relating to sale and/or  
use of Microsemi products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any  
patent, copyright or other intellectual property right. Any performance specifications believed to be reliable but are not verified and customer or  
user must conduct and complete all performance and other testing of this product as well as any user or customers final application. User or  
customer shall not rely on any data and performance specifications or parameters provided by Microsemi. It is the customer’s and user’s re-  
sponsibility to independently determine suitability of any Microsemi product and to test and verify the same. The information contained herein  
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