APTGF300A120G [MICROSEMI]

APTGF300A120G NPT IGBT Power Module; APTGF300A120G NPT IGBT功率模块
APTGF300A120G
型号: APTGF300A120G
厂家: Microsemi    Microsemi
描述:

APTGF300A120G NPT IGBT Power Module
APTGF300A120G NPT IGBT功率模块

晶体 晶体管 电动机控制 双极性晶体管 栅 局域网
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APTGF300A120G  
VCES = 1200V  
Phase leg  
IC = 300A @ Tc = 80°C  
NPT IGBT Power Module  
Application  
Welding converters  
VBUS  
Switched Mode Power Supplies  
Uninterruptible Power Supplies  
Motor control  
Q1  
G1  
E1  
Features  
OUT  
Non Punch Through (NPT) FAST IGBT  
-
-
-
-
-
-
-
-
Low voltage drop  
Q2  
Low tail current  
G2  
Switching frequency up to 50 kHz  
Soft recovery parallel diodes  
Low diode VF  
E2  
Low leakage current  
0/VBUS  
Avalanche energy rated  
RBSOA and SCSOA rated  
Kelvin emitter for easy drive  
Very low stray inductance  
-
-
Symmetrical design  
M5 power connectors  
High level of integration  
Benefits  
Outstanding performance at high frequency  
operation  
G1  
VBUS  
0/VBUS  
OUT  
E1  
Stable temperature behavior  
Very rugged  
E2  
G2  
Direct mounting to heatsink (isolated package)  
Low junction to case thermal resistance  
Easy paralleling due to positive TC of VCEsat  
Low profile  
RoHS Compliant  
Absolute maximum ratings  
Symbol  
Parameter  
Max ratings  
Unit  
VCES  
Collector - Emitter Breakdown Voltage  
1200  
400  
V
Tc = 25°C  
Tc = 80°C  
Tc = 25°C  
IC  
Continuous Collector Current  
A
300  
ICM  
VGE  
PD  
Pulsed Collector Current  
Gate – Emitter Voltage  
Maximum Power Dissipation  
600  
±20  
1780  
V
W
Tc = 25°C  
RBSOA Reverse Bias Safe Operating Area  
Tj = 150°C 600A @ 1200V  
These Devices are sensitive to Electrostatic Discharge. Proper Handing Procedures Should Be Followed. See application note  
APT0502 on www.microsemi.com  
1 - 5  
www.microsemi.com  
APTGF300A120G  
All ratings @ Tj = 25°C unless otherwise specified  
Electrical Characteristics  
Symbol Characteristic  
Test Conditions  
Min Typ Max Unit  
Tj = 25°C  
Tj = 125°C  
Tj = 25°C  
Tj = 125°C  
500  
750  
3.9  
VGE = 0V  
ICES  
Zero Gate Voltage Collector Current  
µA  
VCE = 1200V  
3.3  
4
VGE =15V  
IC = 300A  
VGE = VCE, IC = 12mA  
VCE(sat) Collector Emitter saturation Voltage  
VGE(th) Gate Threshold Voltage  
IGES  
V
4.5  
6.5  
±1  
V
µA  
Gate – Emitter Leakage Current  
VGE = ±20V, VCE = 0V  
Dynamic Characteristics  
Symbol Characteristic  
Test Conditions  
Min Typ Max Unit  
Cies  
Coes  
Cres  
Input Capacitance  
21  
VGE = 0V  
VCE = 25V  
f = 1MHz  
nF  
Output Capacitance  
2.9  
1.52  
120  
Reverse Transfer Capacitance  
Td(on) Turn-on Delay Time  
Tr Rise Time  
Td(off) Turn-off Delay Time  
Tf Fall Time  
Td(on) Turn-on Delay Time  
Tr Rise Time  
Td(off) Turn-off Delay Time  
Inductive Switching (25°C)  
VGE = 15V  
50  
310  
VBus = 600V  
ns  
IC = 300A  
RG = 3  
30  
130  
60  
Inductive Switching (125°C)  
VGE = 15V  
ns  
VBus = 600V  
360  
IC = 300A  
Tf  
Fall Time  
40  
RG = 3Ω  
VGE = 15V  
Tj = 125°C  
VBus = 600V  
Eon  
Turn-on Switching Energy  
25  
15  
mJ  
IC = 300A  
Tj = 125°C  
RG = 3Ω  
Eoff  
Turn-off Switching Energy  
Reverse diode ratings and characteristics  
Symbol Characteristic  
Test Conditions  
Min Typ Max Unit  
VRRM  
Maximum Peak Repetitive Reverse Voltage  
1200  
V
Tj = 25°C  
VR=1200V  
250  
500  
IRM  
Maximum Reverse Leakage Current  
µA  
Tj = 125°C  
IF  
DC Forward Current  
Tc = 80°C  
Tj = 25°C  
300  
2.1  
A
V
VF  
Diode Forward Voltage  
IF = 300A  
Tj = 125°C  
Tj = 25°C  
Tj = 125°C  
1.9  
120  
210  
22  
trr  
Qrr  
Er  
Reverse Recovery Time  
Reverse Recovery Charge  
Reverse Recovery Energy  
ns  
µC  
mJ  
IF = 300A  
Tj = 25°C  
VR = 600V  
Tj = 125°C  
Tj = 25°C  
Tj = 125°C  
43  
di/dt =4500A/µs  
7
15  
2 - 5  
www.microsemi.com  
APTGF300A120G  
Thermal and package characteristics  
Symbol Characteristic  
Min Typ Max Unit  
IGBT  
Diode  
0.07  
0.12  
RthJC  
Junction to Case Thermal Resistance  
°C/W  
V
VISOL  
TJ  
TSTG  
TC  
RMS Isolation Voltage, any terminal to case t =1 min, I isol<1mA, 50/60Hz  
Operating junction temperature range  
Storage Temperature Range  
2500  
-40  
-40  
-40  
3
150  
125  
100  
5
3.5  
280  
°C  
Operating Case Temperature  
To heatsink  
For terminals  
M6  
M5  
Torque Mounting torque  
N.m  
g
2
Wt  
Package Weight  
SP6 Package outline (dimensions in mm)  
See application note APT0601 - Mounting Instructions for SP6 Power Modules on www.microsemi.com  
3 - 5  
www.microsemi.com  
APTGF300A120G  
Typical Performance Curve  
Output Characteristics (VGE=15V)  
Output Characteristics  
600  
500  
400  
300  
200  
100  
0
600  
500  
400  
300  
200  
100  
0
TJ = 125°C  
VGE=15V  
VGE=20V  
TJ=25°C  
VGE=12V  
VGE=9V  
TJ=125°C  
0
1
2
3
4
5
6
0
1
2
3
4
5
6
VCE (V)  
VCE (V)  
Energy losses vs Collector Current  
Transfert Characteristics  
600  
500  
400  
300  
200  
100  
0
70  
60  
50  
40  
30  
20  
10  
0
VCE = 600V  
VGE = 15V  
RG = 3  
Eon  
TJ = 125°C  
Eoff  
TJ=125°C  
TJ=25°C  
Er  
Eoff  
200  
0
100  
300  
400  
500  
600  
5
6
7
8
9
10  
11  
12  
I
C (A)  
VGE (V)  
Switching Energy Losses vs Gate Resistance  
100  
Reverse Bias Safe Operating Area  
700  
VCE = 600V  
600  
500  
400  
300  
200  
100  
0
VGE =15V  
IC = 300A  
TJ = 125°C  
Eon  
Eoff  
80  
60  
40  
20  
0
VGE=15V  
TJ=125°C  
RG=3 Ω  
Er  
0
300  
600  
900  
CE (V)  
1200  
1500  
0
2
4
6
8
10 12 14 16 18 20  
Gate Resistance (ohms)  
V
maximum Effective Transient Thermal Impedance, Junction to Case vs Pulse Duration  
0.08  
0.07  
0.06  
0.05  
0.04  
0.03  
0.02  
0.01  
0
0.9  
IGBT  
0.7  
0.5  
0.3  
0.1  
Single Pulse  
0.05  
0.00001  
0.0001  
0.001  
0.01  
0.1  
1
10  
rectangular Pulse Duration (Seconds)  
4 - 5  
www.microsemi.com  
APTGF300A120G  
Operating Frequency vs Collector Current  
Forward Characteristic of diode  
100  
80  
60  
40  
20  
0
600  
500  
400  
300  
200  
100  
0
VCE=600V  
D=50%  
RG=3  
TJ=125°C  
TJ=125°C  
TC=75°C  
ZVS  
TJ=25°C  
hard  
switching  
ZCS  
0
0.5  
1
1.5  
F (V)  
2
2.5  
3
0
50 100 150 200 250 300 350  
V
IC (A)  
maximum Effective Transient Thermal Impedance, Junction to Case vs Pulse Duration  
0.14  
0.12  
0.1  
0.9  
0.7  
Diode  
0.08  
0.06  
0.04  
0.02  
0
0.5  
0.3  
0.1  
0.05  
Single Pulse  
0.01  
0.00001  
0.0001  
0.001  
0.1  
1
10  
rectangular Pulse Duration (Seconds)  
Microsemi reserves the right to change, without notice, the specifications and information contained herein  
Microsemi's products are covered by one or more of U.S patents 4,895,810 5,045,903 5,089,434 5,182,234 5,019,522  
5,262,336 6,503,786 5,256,583 4,748,103 5,283,202 5,231,474 5,434,095 5,528,058 and foreign patents. U.S and Foreign patents pending. All Rights Reserved.  
5 - 5  
www.microsemi.com  

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