APTGF50TL60T3G [MICROSEMI]

Three level inverter NPT IGBT Power Module; 三电平逆变器NPT IGBT功率模块
APTGF50TL60T3G
型号: APTGF50TL60T3G
厂家: Microsemi    Microsemi
描述:

Three level inverter NPT IGBT Power Module
三电平逆变器NPT IGBT功率模块

晶体 晶体管 功率控制 双极性晶体管 栅 局域网
文件: 总8页 (文件大小:239K)
中文:  中文翻译
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APTGF50TL60T3G  
VCES = 600V  
IC = 50A @ Tc = 80°C  
Three level inverter  
NPT IGBT Power Module  
Application  
Solar converter  
Uninterruptible Power Supplies  
Features  
Non Punch Through (NPT) Fast IGBT  
-
-
-
-
-
-
-
Low voltage drop  
Low tail current  
Switching frequency up to 100 kHz  
Soft recovery parallel diodes  
Low diode VF  
Low leakage current  
RBSOA and SCSOA rated  
Kelvin emitter for easy drive  
Very low stray inductance  
High level of integration  
Internal thermistor for temperature monitoring  
Benefits  
28 27 26 25  
23 22  
20 19 18  
Stable temperature behavior  
Very rugged  
Direct mounting to heatsink (isolated package)  
Low junction to case thermal resistance  
Easy paralleling due to positive TC of VCEsat  
Low profile  
29  
30  
16  
15  
31  
32  
14  
13  
RoHS Compliant  
2
3
4
7
8
10 11  
12  
All multiple inputs and outputs must be shorted together  
Example: 10/11/12 ; 7/8 …  
Q1 to Q4 Absolute maximum ratings  
Symbol  
Parameter  
Max ratings  
Unit  
VCES  
Collector - Emitter Breakdown Voltage  
600  
65  
50  
230  
±20  
250  
V
TC = 25°C  
TC = 80°C  
TC = 25°C  
IC  
Continuous Collector Current  
A
ICM  
VGE  
PD  
Pulsed Collector Current  
Gate – Emitter Voltage  
Maximum Power Dissipation  
V
W
TC = 25°C  
Tj = 125°C  
RBSOA Reverse Bias Safe Operating Area  
100A @ 500V  
These Devices are sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed.  
See application note APT0502 on www.microsemi.com  
1 - 8  
www.microsemi.com  
APTGF50TL60T3G  
All ratings @ Tj = 25°C unless otherwise specified  
Q1 to Q4 Electrical Characteristics  
Symbol Characteristic  
Test Conditions  
Min Typ Max Unit  
Tj = 25°C  
Tj = 125°C  
Tj = 25°C  
Tj = 125°C  
250  
µA  
V
V
GE = 0V  
CE = 600V  
ICES  
Zero Gate Voltage Collector Current  
500  
1.7  
4
2.0  
2.2  
2.45  
V
GE =15V  
VCE(sat) Collector Emitter Saturation Voltage  
VGE(th) Gate Threshold Voltage  
V
IC = 50A  
VGE = VCE , IC = 1mA  
VGE = 20V, VCE = 0V  
6
V
IGES  
Gate – Emitter Leakage Current  
400  
nA  
Q1 to Q4 Dynamic Characteristics  
Symbol Characteristic  
Test Conditions  
Min Typ Max Unit  
Cies  
Coes  
Cres  
Qg  
Input Capacitance  
Output Capacitance  
Reverse Transfer Capacitance  
Total gate Charge  
2200  
V
GE = 0V  
VCE = 25V  
f = 1MHz  
pF  
323  
200  
166  
20  
V
V
GE = 15V  
Bus = 300V  
nC  
Qge  
Gate – Emitter Charge  
Gate – Collector Charge  
Turn-on Delay Time  
IC = 50A  
Qgc  
100  
40  
Inductive Switching (25°C)  
Td(on)  
V
GE = 15V  
Tr  
Rise Time  
9
VBus = 400V  
IC = 50A  
ns  
Td(off) Turn-off Delay Time  
120  
RG = 2.7Ω  
Tf  
Td(on)  
Tr  
Fall Time  
12  
42  
Inductive Switching (125°C)  
VGE = 15V  
VBus = 400V  
IC = 50A  
RG = 2.7Ω  
Turn-on Delay Time  
Rise Time  
10  
ns  
Td(off) Turn-off Delay Time  
130  
21  
Tf  
Fall Time  
VGE = 15V  
Tj = 125°C  
VBus = 400V  
Eon  
Turn-on Switching Energy  
0.5  
1
mJ  
IC = 50A  
Eoff  
Turn-off Switching Energy  
Tj = 125°C  
RG = 2.7Ω  
V
GE 15V ; VBus = 360V  
Isc  
Short Circuit data  
225  
A
tp 10µs ; Tj = 125°C  
°C/W  
RthJC  
Junction to Case Thermal Resistance  
0.5  
2 - 8  
www.microsemi.com  
APTGF50TL60T3G  
CR1 to CR6 diode ratings and characteristics  
Symbol Characteristic  
Test Conditions  
Min Typ Max Unit  
Maximum Peak Repetitive Reverse Voltage  
VRRM  
IRM  
IF  
600  
V
µA  
A
Tj = 25°C  
Tj = 150°C  
Tc = 80°C  
25  
500  
Maximum Reverse Leakage Current  
DC Forward Current  
VR=600V  
30  
1.8  
2.2  
1.5  
IF = 30A  
IF = 60A  
IF = 30A  
2.2  
VF  
trr  
Diode Forward Voltage  
Reverse Recovery Time  
V
Tj = 125°C  
Tj = 25°C  
Tj = 125°C  
Tj = 25°C  
Tj = 125°C  
25  
160  
35  
ns  
IF = 30A  
VR = 400V  
di/dt =200A/µs  
Qrr  
Reverse Recovery Charge  
nC  
mJ  
480  
IF = 30A  
VR = 400V  
di/dt =1000A/µs  
Err  
Reverse Recovery Energy  
Tj = 125°C  
0.6  
RthJC  
Junction to Case Thermal Resistance  
1.2 °C/W  
Temperature sensor NTC (see application note APT0406 on www.microsemi.com for more information).  
Symbol  
R25  
R25/R25  
B25/85  
Characteristic  
Resistance @ 25°C  
Min Typ Max Unit  
50  
5
3952  
4
kΩ  
%
K
T25 = 298.15 K  
%
B/B  
TC=100°C  
R25  
T: Thermistor temperature  
RT: Thermistor value at T  
RT  
=
1
1
exp B  
25/ 85  
T25  
T
Thermal and package characteristics  
Symbol Characteristic  
Min Typ Max Unit  
RMS Isolation Voltage, any terminal to case t =1 min, I isol<1mA, 50/60Hz  
Operating junction temperature range  
Storage Temperature Range  
VISOL  
TJ  
TSTG  
TC  
2500  
-40  
-40  
-40  
2.5  
V
150  
125  
100  
4.7  
°C  
Operating Case Temperature  
Torque Mounting torque  
To heatsink  
M4  
N.m  
g
Wt Package Weight  
110  
3 - 8  
www.microsemi.com  
APTGF50TL60T3G  
SP3 Package outline (dimensions in mm)  
2 8  
1 7  
1
12  
See application note 1901 - Mounting Instructions for SP3 Power Modules on www.microsemi.com  
4 - 8  
www.microsemi.com  
APTGF50TL60T3G  
Q1 to Q4 Typical performance curve  
Output characteristics (VGE=15V)  
Output Characteristics (VGE=10V)  
100  
100  
75  
50  
25  
0
250µs Pulse Test  
< 0.5% Duty cycle  
250µs Pulse Test  
< 0.5% Duty cycle  
75  
TJ=25°C  
TJ=25°C  
50  
TJ=125°C  
TJ=125°C  
25  
0
0
1
2
3
4
0
1
2
3
4
VCE, Collector to Emitter Voltage (V)  
VCE, Collector to Emitter Voltage (V)  
Transfer Characteristics  
Gate Charge  
100  
75  
50  
25  
0
18  
16  
14  
12  
10  
8
250µs Pulse Test  
< 0.5% Duty cycle  
VCE=120V  
VCE=300V  
IC = 50A  
TJ = 25°C  
VCE=480V  
TJ=125°C  
6
4
TJ=25°C  
2
0
0
25  
50  
75 100 125 150 175 200  
0
1
2
3
4
5
6
7
8
9
10  
VGE, Gate to Emitter Voltage (V)  
Gate Charge (nC)  
Breakdown Voltage vs Junction Temp.  
DC Collector Current vs Case Temperature  
70  
60  
50  
40  
30  
20  
10  
0
1.20  
1.10  
1.00  
0.90  
0.80  
25  
50  
75  
100  
125  
25  
50  
75  
100  
125  
150  
TJ, Junction Temperature (°C)  
TC, Case Temperature (°C)  
5 - 8  
www.microsemi.com  
APTGF50TL60T3G  
Turn-On Delay Time vs Collector Current  
Turn-Off Delay Time vs Collector Current  
60  
50  
40  
30  
20  
175  
150  
125  
100  
75  
VGE = 15V  
VGE=15V,  
TJ=125°C  
Tj = 125°C  
VCE = 400V  
RG = 2.7  
VGE=15V,  
TJ=25°C  
VCE = 400V  
RG = 2.7Ω  
50  
0
25  
50  
75  
100  
125  
150  
0
25  
50  
75  
100  
125  
150  
ICE, Collector to Emitter Current (A)  
ICE, Collector to Emitter Current (A)  
Current Rise Time vs Collector Current  
Current Fall Time vs Collector Current  
60  
50  
40  
30  
20  
10  
0
60  
50  
40  
30  
20  
10  
0
VCE = 400V  
VCE = 400V, VGE = 15V, RG = 2.7Ω  
RG = 2.7Ω  
TJ = 125°C  
VGE=15V,  
TJ=125°C  
TJ = 25°C  
0
25  
50  
75  
100  
125  
150  
0
25  
50  
75  
100  
125  
150  
ICE, Collector to Emitter Current (A)  
I
CE, Collector to Emitter Current (A)  
Turn-Off Energy Loss vs Collector Current  
Turn-On Energy Loss vs Collector Current  
2.5  
2
2
VCE = 400V  
TJ=125°C,  
VCE = 400V  
VGE = 15V  
TJ = 125°C  
VGE=15V  
RG = 2.7Ω  
1.5  
1
RG = 2.7Ω  
1.5  
1
0.5  
0
0.5  
0
0
25  
50  
75  
100  
125  
150  
0
25  
50  
75  
100  
125  
150  
ICE, Collector to Emitter Current (A)  
I
CE, Collector to Emitter Current (A)  
Switching Energy Losses vs Gate Resistance  
Reverse Bias Safe Operating Area  
3
120  
100  
80  
60  
40  
20  
0
VCE = 400V  
VGE = 15V  
2.5  
TJ= 125°C  
Eon, 50A  
Eoff, 50A  
2
1.5  
1
0.5  
0
Eon, 50A  
0
200  
400  
600  
0
5
10  
15  
20  
25  
VCE, Collector to Emitter Voltage (V)  
Gate Resistance (Ohms)  
6 - 8  
www.microsemi.com  
APTGF50TL60T3G  
Capacitance vs Collector to Emitter Voltage  
10000  
Operating Frequency vs Collector Current  
240  
200  
160  
120  
80  
VCE = 400V  
D = 50%  
RG = 2.7  
Cies  
hard  
switching  
TJ = 125°C  
TC= 75°C  
1000  
100  
Coes  
40  
Cres  
0
0
10  
20  
30  
40  
50  
0
20  
40  
60  
80  
100  
V
CE, Collector to Emitter Voltage (V)  
IC, Collector Current (A)  
Maximum Effective Transient Thermal Impedance, Junction to Case vs Pulse Duration  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0
0.9  
0.7  
0.5  
0.3  
0.1  
0.05  
Single Pulse  
0.00001  
0.0001  
0.001  
0.01  
0.1  
1
10  
Rectangular Pulse Duration (Seconds)  
7 - 8  
www.microsemi.com  
APTGF50TL60T3G  
CR1 to CR6 Typical performance curve  
Forward Characteristic of diode  
80  
60  
TJ=125°C  
40  
TJ=25°C  
20  
0
0.0  
1
0.4  
0.8  
1.2  
1.6  
2.0  
2.4  
VF (V)  
Energy losses vs Collector Current  
Switching Energy Losses vs Gate Resistance  
1
0.75  
0.75  
0.5  
0.25  
0
0.5  
0.25  
0
VCE = 400V  
VGE = 15V  
VCE = 400V  
GE =15V  
V
R
G = 2.5  
IC = 30A  
TJ = 125°C  
TJ = 125°C  
0
20  
40  
60  
80  
0
2
4
6
8
10  
IC (A)  
Gate Resistance (ohms)  
Maximum Effective Transient Thermal Impedance, Junction to Case vs Pulse Duration  
1.4  
1.2  
1
0.9  
0.7  
0.8  
0.6  
0.4  
0.2  
0
0.5  
0.3  
0.1  
Single Pulse  
0.05  
0.00001  
0.0001  
0.001  
0.01  
0.1  
1
10  
Rectangular Pulse Duration (Seconds)  
Microsemi reserves the right to change, without notice, the specifications and information contained herein  
Microsemi's products are covered by one or more of U.S patents 4,895,810 5,045,903 5,089,434 5,182,234 5,019,522 5,262,336 6,503,786 5,256,583 4,748,103  
5,283,202 5,231,474 5,434,095 5,528,058 6,939,743 7,352,045 5,283,201 5,801,417 5,648,283 7,196,634 6,664,594 7,157,886 6,939,743 7,342,262  
and foreign patents. U.S and Foreign patents pending. All Rights Reserved.  
8 - 8  
www.microsemi.com  

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