APTLGF300A1208G [MICROSEMI]

Phase leg Intelligent Power Module; 相桥臂智能功率模块
APTLGF300A1208G
型号: APTLGF300A1208G
厂家: Microsemi    Microsemi
描述:

Phase leg Intelligent Power Module
相桥臂智能功率模块

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APTLGF300A1208G  
VCES = 1200V  
IC = 300A @ Tc = 80°C  
Phase leg  
Intelligent Power Module  
Application  
Motor control  
Uninterruptible Power Supplies  
Switched Mode Power Supplies  
Amplifier  
Features  
Non Punch Through (NPT) FAST IGBT  
-
-
-
-
-
-
Low voltage drop  
Low tail current  
Soft recovery parallel diodes  
Low diode VF  
Low leakage current  
RBSOA & SCSOA rated  
Integrated Fail Safe IGBT Protection (Driver)  
-
-
Top Bottom input signals Interlock  
Isolated DC/DC Converter  
Low stray inductance  
M5 power connectors  
High level of integration  
Benefits  
VBUS  
0/VBUS  
OUT  
Outstanding performance at high frequency operation  
Stable temperature behavior  
Very rugged  
Direct mounting to heatsink (isolated package)  
Low junction to case thermal resistance  
Very high noise immunity  
(common mode rejection > 25kV/µs)  
Galvanic Isolation: 3750V for the optocoupler  
2500V for the transformer  
5V logic level with Schmitt-trigger Input  
Single VDD=5V supply required  
Secondary auxiliary power supplies internally generated  
(15V, -6V)  
Optocoupler qualified to AEC-Q100 test quidelines  
RoHS compliant  
These Devices are sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed.  
See application note APT0502 on www.microsemi.com  
1 - 6  
www.microsemi.com  
APTLGF300A1208G  
All ratings @ Tj = 25°C unless otherwise specified  
1. Inverter Power Module  
Absolute maximum ratings  
Symbol  
Parameter  
Max ratings  
1200  
Unit  
V
VCES  
Collector - Emitter Breakdown Voltage  
TC = 25°C  
TC = 80°C  
TC = 25°C  
TC = 25°C  
400  
300  
600  
1780  
IC  
Continuous Collector Current  
A
ICM  
PD  
Pulsed Collector Current  
Maximum Power Dissipation  
W
RBSOA Reverse Bias Safe Operating Area  
Tj = 125°C  
600A @ 1200V  
Electrical Characteristics  
Symbol Characteristic  
Test Conditions  
Min Typ Max Unit  
Tj = 25°C  
Tj = 125°C  
Tj = 25°C  
500  
µA  
V
GE = 0V  
ICES  
Zero Gate Voltage Collector Current  
VCE = 1200V  
750  
3.2  
4
3.9  
VDD = VIN = 5V  
IC = 300A  
VCE(sat) Collector Emitter Saturation Voltage  
V
Tj = 125°C  
Dynamic Characteristics  
Symbol Characteristic  
Test Conditions  
Min Typ Max Unit  
Cies  
Coes  
Cres  
Input Capacitance  
Output Capacitance  
Reverse Transfer Capacitance  
21  
2.9  
1.52  
V
GE = 0V  
VCE = 25V  
nF  
ns  
f = 1MHz  
Inductive Switching (25°C)  
Tr  
Tf  
Rise Time  
Fall Time  
50  
30  
VDD = VIN = 5V  
VBus = 600V ; IC = 300A  
Inductive Switching (125°C)  
Tr  
Tf  
Rise Time  
60  
40  
25  
ns  
V
V
DD = VIN = 5V  
Bus = 600V  
Fall Time  
Eon  
Turn-on Switching Energy  
IC = 300A  
mJ  
Eoff  
Turn-off Switching Energy  
15  
V
DD = VIN = 5V; VBus =900V  
Isc  
Short Circuit data  
1800  
A
tp 10µs ; Tj = 125°C  
RthJC  
Junction to Case thermal resistance  
0.07 °C/W  
2 - 6  
www.microsemi.com  
APTLGF300A1208G  
Reverse diode ratings and characteristics  
Symbol Characteristic  
Test Conditions  
Min Typ Max Unit  
Maximum Peak Repetitive Reverse Voltage  
Maximum Reverse Leakage Current  
DC Forward Current  
VRRM  
IRM  
IF  
1200  
V
µA  
A
Tj = 25°C  
Tj = 125°C  
Tc = 80°C  
Tj = 25°C  
Tj = 125°C  
250  
500  
VR=1200V  
300  
2.1  
1.9  
120  
VF  
Diode Forward Voltage  
IF = 300A  
V
Tj = 25°C  
Tj = 125°C  
Tj = 25°C  
Tj = 125°C  
Tj = 25°C  
Tj = 125°C  
trr  
Reverse Recovery Time  
Reverse Recovery Charge  
ns  
µC  
mJ  
210  
22  
IF = 300A  
VR = 600V  
di/dt =6000A/µs  
Qrr  
56  
7.2  
18  
Err  
Reverse Recovery Energy  
RthJC  
Junction to Case Thermal Resistance  
0.12 °C/W  
2. Driver  
Absolute maximum ratings  
Symbol  
Parameter  
Max ratings  
Unit  
VDD  
VINi  
Supply Voltage  
Input signal voltage i=L, H  
5.5  
5.5  
0.35  
2
V
VINi = 0V, i =L & H  
VDD=5V, VINH = /VINL ; Fout = 50kHz  
IVDDmax  
fmax  
Maximum Supply current  
A
kHz  
Maximum Switching Frequency  
50  
Driver Electrical Characteristics  
Symbol Characteristic  
Test Conditions  
Min  
4.5  
Typ  
5
Max  
5.5  
5.5  
Unit  
V
VDD  
Operating Supply Voltage  
Maximum Input Voltage  
Positive Going Threshold Voltage  
VINi(max)  
VINi (th+)  
-0.5  
5
V
3.2  
i = L, H  
VINi(th-) Negative Going Threshold Voltage  
1
1
RINi  
Td(on)  
DT  
Input Resistance *  
Turn On delay time  
Built in dead time  
kΩ  
Driver + IGBT  
Driver + IGBT  
1100n  
600  
750  
ns  
Td(off)  
PWD  
Turn Off delay time  
Pulse Width Distortion  
Propagation Delay Difference  
between any two driver  
Primary to Secondary Isolation  
300  
350  
ns  
PDD  
VISOL  
Td(on) - Td(off)  
-350  
2500  
VRMS  
* Low impedance guarantees good noise immunity.  
n Including built in dead time.  
3 - 6  
www.microsemi.com  
APTLGF300A1208G  
3. Package characteristics  
Symbol Characteristic  
Min Typ Max Unit  
RMS Isolation Voltage, any terminal to case t =1 min, I isol<1mA, 50/60Hz  
VISOL  
TJ  
TOP  
TSTG  
TC  
2500  
-40  
-40  
-40  
-40  
2
V
Operating junction temperature range  
Operating Ambient Temperature  
Storage Temperature Range  
150  
85  
100  
100  
4.7  
4
°C  
Operating Case Temperature  
To heatsink  
For terminals  
M5  
M5  
Torque Mounting torque  
Wt Package Weight  
N.m  
g
2
550  
4. LP8 Package outline (dimensions in mm)  
4 - 6  
www.microsemi.com  
APTLGF300A1208G  
Typical IGBT Performance Curve  
Output Characteristics  
Reverse Bias Safe Operating Area  
700  
600  
600  
500  
400  
300  
200  
VDD = 5V  
500  
TJ=25°C  
V
IN =5V  
400  
300  
200  
100  
0
TJ=125°C  
TJ=125°C  
100  
0
0
200 400 600 800 1000 1200  
CE (V)  
0
1
2
3
4
5
6
V
VCE (V)  
Energy losses vs Collector Current  
Operating Frequency vs Collector Current  
60  
70  
60  
50  
40  
30  
20  
10  
0
VCE = 600V  
VCE=600V  
D=50%  
V
V
DD = 5V  
IN = 5V  
50  
40  
30  
20  
10  
0
hard  
switching  
Eon  
V
DD=5V  
IN=5V  
TJ = 125°C  
V
TJ=125°C  
TC=75°C  
Limited by  
internal gate  
drive power  
dissipation  
Eoff  
0
100  
200  
300  
400  
500  
600  
0
50 100 150 200 250 300 350  
IC (A)  
IC (A)  
maximum Effective Transient Thermal Impedance, Junction to Case vs Pulse Duration  
0.08  
0.07  
0.06  
0.05  
0.04  
0.03  
0.02  
0.01  
0
D = 0.9  
0.7  
0.5  
0.3  
0.1  
Single Pulse  
0.05  
0.00001  
0.0001  
0.001  
0.01  
0.1  
1
10  
rectangular Pulse Duration (Seconds)  
5 - 6  
www.microsemi.com  
APTLGF300A1208G  
Typical diode Performance Curve  
Forward Characteristic of diode  
Energy losses vs Collector Current  
24  
600  
20  
16  
12  
500  
400  
300  
TJ=125°C  
200  
100  
0
TJ=25°C  
8
VR= 600V  
TJ = 125°C  
4
0
0
0.5  
1
1.5  
2
2.5  
3
0
100  
200  
300  
400  
500  
600  
VF, Anode to Cathode Voltage (V)  
IF (A)  
maximum Effective Transient Thermal Impedance, Junction to Case vs Pulse Duration  
0.14  
0.12  
0.1  
0.9  
0.7  
0.5  
0.3  
0.1  
0.08  
0.06  
0.04  
0.02  
0
Single Pulse  
0.05  
0.00001  
0.0001  
0.001  
0.01  
0.1  
1
10  
Rectangular Pulse Duration in Seconds  
Microsemi reserves the right to change, without notice, the specifications and information contained herein  
6 - 6  
www.microsemi.com  

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