AVSMBG43CAE3 [MICROSEMI]

Trans Voltage Suppressor Diode, 600W, 43V V(RWM), Bidirectional, 1 Element, Silicon, DO-215AA, ROHS COMPLIANT, PLASTIC PACKAGE-2;
AVSMBG43CAE3
型号: AVSMBG43CAE3
厂家: Microsemi    Microsemi
描述:

Trans Voltage Suppressor Diode, 600W, 43V V(RWM), Bidirectional, 1 Element, Silicon, DO-215AA, ROHS COMPLIANT, PLASTIC PACKAGE-2

文件: 总3页 (文件大小:116K)
中文:  中文翻译
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AVSMBJ5.0A thru AVSMBJ170A, CA e3 and  
AVSMBG5.0A thru AVSMBG170A, CA, e3  
SURFACE MOUNT 600 Watt  
Transient Voltage Suppressor  
S C O T T S D A L E D I V I S I O N  
DESCRIPTION  
PACKAGE  
This AVSMBJ5.0A-170A or AVSMBG5.0A-170A series of surface mount 600 W Transient  
Voltage Suppressors (TVSs) protects a variety of voltage-sensitive components from  
destruction or degradation. It is available in J-bend design (AVSMBJ) with the DO-214AA  
package for greater PC board mounting density or in a Gull-wing design (AVSMBG) in the  
DO-215AA for visible solder connections.  
It is available in both unidirectional and  
bidirectional configurations with an A or CA suffix part number as well as RoHS Compliant  
designated by an “e3”suffix. Their clamping response time is virtually instantaneous. As a  
result, they can be used for protection from ESD or EFT per IEC61000-4-2 and IEC61000-  
4-4, or for inductive switching environments and induced RF protection. They can also  
protect from secondary lightning effects per IEC61000-4-5 and class levels defined herein.  
Microsemi also offers numerous other TVS products to meet higher and lower power  
demands and special applications.  
IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com  
FEATURES  
APPLICATIONS / BENEFITS  
Compliant to IEC61000-4-2 and IEC61000-4-4 for ESD  
and EFT protection respectively  
Selections for 5.0 to 170 volts standoff voltages (VWM)  
100% screened as follows for avionics applications:  
1. Temperature Cycle (thermal shock) 20 Cycles -55°C to 125°C  
2. Solder Capability: Stress Tested at 260°C for 10 sec.  
3. Surge 1 pulse at 110% Ipp (Both Directions for Bidirectional)  
4. Surge 1 pulse at 100% Ipp (Both Directions for Bidirectional)  
5. Electrical Test  
Secondary lightning protection per IEC61000-4-5 with 42  
Ohms source impedance:  
Class 1: AVSMB 5.0 to AVSMB 120A or CA  
Class 2: AVSMB 5.0 to AVSMB 60A or CA  
Class 3: AVSMB 5.0 to AVSMB 30A or CA  
Class 4: AVSMB 5.0 to AVSMB 15A or CA  
6. Burn-in (HTRB) 48 hrs 125°C Polarity A for Bidirectional (96 hrs  
for Unidirectional)  
Secondary lightning protection per IEC61000-4-5 with 12  
Ohms source impedance:  
7. Electrical Test Delta ID and V(BR) Polarity A  
Class 1: AVSMB 5.0 to AVSMB 36A or CA  
Class 2: AVSMB 5.0 to AVSMB 18A or CA  
8. Burn-in (HTRB) 48 hrs 125°C Polarity B for bidirectional (not  
required for Unidirectional)  
Compliant to RTCA/DO-160E Waveform 4, Levels 1 & 2  
9. Electrical Test Delta ID and V(BR) Polarity B (Not required for  
Unidirectional)  
Compliant to RTCA/DO-160E Waveform 4, Level 3 for  
AVSMB5.0 to AVSMB20A or CA  
10. Electrical Test GO-NO-GO  
Compliant to RTCA/DO-160E Waveform 4, Level 4 for  
AVSMB5.0 to AVSMB7.5  
RoHS Compliant devices available and designated by  
adding an “e3” suffix  
Economical surface mount design in both J-bend or Gull-wing  
terminations.  
Compliant to RTCA/DO-160E Waveform 5A, Level 1  
Compliant to RTCA/DO-160E Waveform 5A, Level 2 for  
AVSMB5.0 to AVSMB6.0A or CA  
Protects sensitive components such as IC’s, CMOS, Bipolar,  
BiCMOS, ECL, DTL, T2L, etc.  
Protection from switching transients & induced RF  
MAXIMUM RATINGS  
MECHANICAL AND PACKAGING  
2-Stage: Robust, High Reliability Lead Frame  
Peak Pulse Power dissipation at 25ºC: 600 watts at 10/1000 μs  
(also see Fig 1,2, and 3)  
CASE: Void-free transfer molded thermosetting epoxy  
body meeting UL94V-0  
Impulse repetition rate (duty factor): 0.01%  
tclamping (0 volts to V(BR) min.): < 100 ps theoretical for  
unidirectional and < 5 ns for bidirectional  
TERMINALS: Gull-wing or C-bend (modified J-bend)  
leads Tin-Lead or RoHS compliant annealed matte-Tin  
plating solderable per MIL-STD-750, method 2026  
Operating and Storage temperature: -65ºC to +150ºC  
Thermal resistance: 25 ºC/W junction to lead or 90ºC/W junction  
to ambient when mounted on FR4 PC board (1oz Cu) with  
recommended footprint (see last page)  
Steady-State Power dissipation: 5 watts at TL = 25oC, or 1.38  
watts at TA = 25ºC when mounted on FR4 PC board with  
recommended footprint  
POLARITY: Cathode indicated by band. No band on bi-  
directional devices.  
MARKING: See Page 2 marking column.  
TAPE & REEL option: Standard per EIA-481-1-A with 12  
mm tape, 750 per 7 inch reel or 2500 per 13 inch reel.  
WEIGHT: 0.1 grams  
Forward Surge at 25ºC: 100 amps peak impulse of 8.3 ms half-  
sine wave (unidirectional only)  
See package dimension on last page  
Solder temperatures: 260 ºC for 10 s (maximum)  
Copyright 2008  
1-29-2008 REV D; AVSMB5-170  
Microsemi  
Page 1  
Scottsdale Division  
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503  
AVSMBJ5.0A thru AVSMBJ170A, CA e3 and  
AVSMBG5.0A thru AVSMBG170A, CA, e3  
SURFACE MOUNT 600 Watt  
Transient Voltage Suppressor  
S C O T T S D A L E D I V I S I O N  
ELECTRICAL CHARACTERISTICS @ 25oC UNLESS OTHER WISE SPECIFIED  
REVERSE  
STANDOFF  
VOLTAGE  
VWM  
BREAKDOWN  
VOLTAGE  
VBR @ I(BR)  
MAXIMUM  
CLAMPING  
VOLTAGE  
@ IPP  
PEAK PULSE MAXIMUM  
MICROSEMI PART NUMBER  
CURRENT  
(See Fig. 2)  
IPP  
STANDBY  
CURRENT  
ID @ VWM  
Volts  
Gull-Wing  
Lead  
Modified “J”  
Bend Lead  
Marking  
MIN.  
I(BR)  
mA  
Volts  
5.0  
6.0  
7.5  
10  
Volts  
9.2  
Amps  
65.2  
58.3  
46.5  
35.3  
33.0  
30.2  
23.1  
21.7  
18.5  
8.6  
A  
100  
500  
100  
1
AVSMBG5.0A  
AVSMBJ5.0A  
AVSMBJ6.0A  
AVSMBJ7.5A  
AVSMBJ10A  
AVSMBJ11A  
AVSMBJ12A  
AVSMBJ16A  
AVSMBJ17A  
AVSMBJ20A  
AVSMBJ43A  
AVSMBJ45A  
AVSMBJ48A  
AVSMBJ170A  
AV5.0A  
AV6.0A  
AV7.5A  
AV10A  
AV11A  
AV12A  
AV16A  
AV17A  
AV20A  
AV43A  
AV45A  
AV48A  
AV170A  
6.40  
6.67  
8.33  
11.1  
12.2  
13.3  
17.8  
18.9  
22.2  
47.8  
50.0  
53.3  
189  
10  
AVSMBG6.0A  
AVSMBG7.5A  
AVSMBG10A  
AVSMBG11A  
AVSMBG12A  
AVSMBG16A  
AVSMBG17A  
AVSMBG20A  
AVSMBG43A  
AVSMBG45A  
AVSMBG48A  
AVSMBG170A  
10  
1
1
1
1
1
1
1
1
1
1
1
10.3  
12.9  
17.0  
18.2  
19.9  
26.0  
27.6  
32.4  
69.4  
72.7  
77.4  
275  
11  
.5  
12  
.5  
16  
.5  
17  
.5  
20  
.5  
43  
.5  
45  
8.3  
.5  
48  
7.7  
.5  
170  
2.2  
.5  
“FOR OTHER VOLTAGES CONTACT THE FACTORY”  
Bidirectional device types are indicated by a CA suffix after the part number. (e.g.: AVSMBG170CA).  
Bidirectional capacitance is half that shown in figure 4 at zero volts.  
Microsemi Corp’s AVSMB series (600 W) surface mountable packages are designed specifically for transient voltage suppression. The  
wide leads assure a large surface contact for good heat dissipation, and a low resistance path for surge current flow to ground. These  
high speed transient voltage suppressors can be used to effectively protect sensitive components such as integrated circuits and MOS  
devices.  
SYMBOLS & DEFINITIONS  
Symbol  
VWM  
PPP  
Definition  
Working Peak (Standoff) Voltage  
Peak Pulse Power  
Symbol  
Definition  
Peak Pulse Current  
Clamping Voltage  
IPP  
VC  
V(BR)  
ID  
Breakdown Voltage  
Standby Current  
I(BR)  
Breakdown Current for V(BR)  
Copyright 2008  
1-29-2008 REV D; AVSMB5-170  
Microsemi  
Page 2  
Scottsdale Division  
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503  
AVSMBJ5.0A thru AVSMBJ170A, CA e3 and  
AVSMBG5.0A thru AVSMBG170A, CA, e3  
SURFACE MOUNT 600 Watt  
Transient Voltage Suppressor  
S C O T T S D A L E D I V I S I O N  
GRAPHS  
50  
30  
TC = 25oC  
10  
5.0  
3.0  
2.0  
1.0  
0.5  
0.3  
0.2  
0.1  
0.1 0.2  
0.5 1.0 2.0  
5.0 10  
20  
50 100 200  
1000  
10,000  
Test waveform parameters: tr=10 s, tw=1000 s  
FIGURE 2  
tw – Pulse Width - s  
FIGURE 1  
Peak Pulse Power vs. Pulse Time  
Pulse Waveform for  
Exponential Surge  
PAD LAYOUT  
SMBJ  
INCHES  
.260  
.085  
mm  
6.60  
2.16  
2.79  
A
B
C
.110  
SMBG  
INCHES  
0.320  
0.085  
mm  
8.13  
2.16  
2.79  
TL Lead Temperature oC  
V(BR) - Breakdown Voltage – Volts  
FIGURE 4  
Typical Capacitance vs Breakdown Voltage  
A
B
C
FIGURE 3 - Derating Curve  
0.110  
PACKAGE DIMENSIONS  
A
B
C
D
E
F
K
L
MIN  
MAX  
.077 .160  
.083 .180  
.130 .205 .077  
.155 .220 .104  
.235  
.255  
.015  
.030  
.030  
.060  
DIMENSIONS IN MILLIMETERS  
MIN  
MAX  
1.96 4.06  
2.10 4.57  
3.30 5.21 1.95  
3.94 5.59 2.65  
5.97  
6.48  
.381  
.762  
.760  
1.520  
Copyright 2008  
1-29-2008 REV D; AVSMB5-170  
Microsemi  
Page 3  
Scottsdale Division  
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503  

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