FST16035D [MICROSEMI]

Rectifier Diode, Schottky, 1 Phase, 2 Element, 80A, 35V V(RRM), Silicon, TO-249, PACKAGE-3;
FST16035D
型号: FST16035D
厂家: Microsemi    Microsemi
描述:

Rectifier Diode, Schottky, 1 Phase, 2 Element, 80A, 35V V(RRM), Silicon, TO-249, PACKAGE-3

文件: 总3页 (文件大小:273K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Schottky Powermod  
FST16035 - FST16050  
N 4 Places  
Millimeters  
A
Dim. Inches  
Max. Min.  
Min.  
Max. Notes  
50.93  
8.26  
1 2 3  
Common Cathode  
50.67  
A 1.995  
B 0.300  
C 0.495  
D 0.182  
E 0.990  
F 2.390  
2.005  
0.325  
0.505  
0.192  
1.010  
2.410  
C
E
7.62  
1
2
3
12.83  
4.88  
12.57  
4.62  
B
Dia.  
25.15  
25.65  
60.71  
61.21  
K
Q
L
1 2 3  
A=Common Anode  
G
1.500  
1.525  
0.130  
0.400  
38.10  
3.05  
---  
38.70  
3.30  
R
D
H 0.120  
---  
J
K 0.240  
L
M 0.330  
N 0.175  
P 0.035  
Q
R
10.16  
6.60  
12.95  
6.90  
4.95  
F
G
P
6.10  
12.45  
8.38  
4.45  
to Lead C  
0.260  
0.510  
0.350  
0.195  
0.045  
0.455  
0.910  
L
H
0.490  
J
Dia.  
1 2 3  
D=Doubler  
M
0.89  
11.30  
22.61  
1.14  
11.56  
23.11  
0.445  
0.890  
Notes:  
Baseplate: Nickel plated copper;  
electrically isolated  
Pins: Nickel plated copper  
TO-249  
Schottky Barrier Rectifier  
Guard Ring for Reverse Protection  
Microsemi  
Catalog Number Reverse Voltage  
Working Peak  
Repetitive Peak  
Reverse Voltage  
V
RRM - 35 to 50 Volts  
High Surge Capacity  
35V  
40V  
45V  
50V  
FST16035*  
FST16040*  
FST16045*  
FST16050*  
35V  
40V  
45V  
50V  
Reverse Energy Tested  
ROHS Compliant  
*Add the Suffix A for Common Anode, D for Doubler  
Electrical Characteristics  
I
T
T
R
C = 115°C, Square wave, 0JC = 0.5°C/W  
160 Amps  
80 Amps  
F(AV)  
Average forward current per pkg  
Average forward current per leg  
Maximum surge current per leg  
Max repetitive peak reverse current per leg  
Max peak forward voltage per leg  
Max peak forward voltage per leg  
Max peak reverse current per leg  
Max peak reverse current per leg  
Typical junction capacitance per leg  
I
R
F(AV)  
C = 115°C, Square wave, 0JC = 1.0°C/W  
I
T
FSM  
1200 Amps  
2 Amps  
8.3 ms, half sine  
f = 1 KHz, 25°C, 1µsec Square wave  
J = 175°C  
I
R(OV)  
T
V
I
I
V
.58 Volts  
.74 Volts  
30 mA  
2 mA  
2300 pF  
FM = 80A: J = 175°C*  
FM = 80A: J = 25°C  
RRM, J = 125°C  
FM  
T
V
*
FM  
I
T
*
RM  
I
V
V
T
RM  
RRM, J = 25°C  
R = 5.0V, J = 25°C  
C
T
J
*Pulse test: Pulse width 300µsec, Duty cycle 2%  
Thermal and Mechanical Characteristics  
T
T
R
R
R
STG  
J
JC  
O
-55°C to 175°C  
-55°C to 175°C  
Storage temp range  
Operating junction temp range  
Maximum thermal resistance per leg  
Maximum thermal resistance per pkg.  
1.0°C/W  
0.5°C/W  
Junction to case  
Junction to case  
Case to sink  
JC  
CS  
O
O
0.1°C/W  
Typical thermal resistance (greased)  
Mounting torque  
15 - 20 inch pounds  
Weight  
2.5 ounces (71 grams) typical  
www.microsemi.com  
October, 2012 - Rev. 4  
FST16035 - FST16050  
Figure 1  
Figure 3  
Typical Forward Characteristics - Per Leg  
Typical Junction Capacitance - Per Leg  
1000  
800  
10000  
6000  
4000  
600  
175 C  
25 C  
2000  
400  
200  
1000  
600  
400  
100  
80  
200  
100  
60  
40  
0.1  
0.5 1.0  
5.0  
10  
50 100  
Reverse Voltage - Volts  
Figure 4  
Forward Current Derating - Per Leg  
20  
175  
165  
10  
8.0  
155  
145  
6.0  
4.0  
135  
125  
115  
2.0  
1.0  
90 120 180  
45 60 75 90 105 120 135 150  
Average Forward Current - Amperes  
DC  
60  
105  
15 30  
0
0
.2  
.4  
.6  
.8  
1.0  
1.2  
1.4  
Instantaneous Forward Voltage - Volts  
Figure 5  
Figure 2  
Typical Reverse Characteristics - Per Leg  
Maximum Forward Power Dissipation - Per Leg  
100  
70  
DC  
60  
175 C  
10  
180  
120  
50  
40  
90  
125 C  
1.0  
0.1  
60  
30  
20  
75 C  
25 C  
.01  
10  
0
.001  
15 30  
Average Forward Current - Amperes  
45 60 75 90 105 120 135 150  
0
0
10  
20  
30  
40  
50  
Reverse Voltage - Volts  
www.microsemi.com  
October, 2012 - Rev. 4  
DISCLAIMER  
The information contained in the document (unless it is publicly available on the Web without access restrictions) is  
PROPRIETARY AND CONFIDENTIAL information of Microsemi and cannot be copied, published, uploaded, posted,  
transmitted, distributed or disclosed or used without the express duly signed written consent of Microsemi. If the  
recipient of this document has entered into a disclosure agreement with Microsemi, then the terms of such Agreement  
will also apply. This document and the information contained herein may not be modified, by any person other than  
authorized personnel of Microsemi. No license under any patent, copyright, trade secret or other intellectual property  
right is granted to or conferred upon you by disclosure or delivery of the information, either expressly, by implication,  
inducement, estoppels or otherwise. Any license under such intellectual property rights must be approved by  
Microsemi in writing signed by an officer of Microsemi.  
Microsemi reserves the right to change the configuration, functionality and performance of its products at anytime  
without any notice. This product has been subject to limited testing and should not be used in conjunction with life-  
support or other mission-critical equipment or applications. Microsemi assumes no liability whatsoever, and Microsemi  
disclaims any express or implied warranty, relating to sale and/or use of Microsemi products including liability or  
warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other  
intellectual property right. Any performance specifications believed to be reliable but are not verified and customer or  
user must conduct and complete all performance and other testing of this product as well as any user or customers final  
application. User or customer shall not rely on any data and performance specifications or parameters provided by  
Microsemi. It is the customer’s and user’s responsibility to independently determine suitability of any Microsemi  
product and to test and verify the same. The information contained herein is provided “AS IS, WHERE IS” and with all  
faults, and the entire risk associated with such information is entirely with the User. Microsemi specifically disclaims  
any liability of any kind including for consequential, incidental and punitive damages as well as lost profit. The product  
is subject to other terms and conditions which can be located on the web at http://www.microsemi.com/legal/tnc.asp  
Life Support Application  
Seller's Products are not designed, intended, or authorized for use as components in systems intended for space,  
aviation, surgical implant into the body, in other applications intended to support or sustain life, or for any other  
application in which the failure of the Seller's Product could create a situation where personal injury, death or property  
damage or loss may occur (collectively "Life Support Applications").  
Buyer agrees not to use Products in any Life Support Applications and to the extent it does it shall conduct extensive  
testing of the Product in such applications and further agrees to indemnify and hold Seller, and its officers, employees,  
subsidiaries, affiliates, agents, sales representatives and distributors harmless against all claims, costs, damages and  
expenses, and attorneys' fees and costs arising, directly or directly, out of any claims of personal injury, death, damage  
or otherwise associated with the use of the goods in Life Support Applications, even if such claim includes allegations  
that Seller was negligent regarding the design or manufacture of the goods.  
Buyer must notify Seller in writing before using Seller’s Products in Life Support Applications. Seller will study with  
Buyer alternative solutions to meet Buyer application specification based on Sellers sales conditions applicable for the  
new proposed specific part.  
www.microsemi.com  
October, 2012  

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