JANTX1N5811URS [MICROSEMI]
Rectifier Diode, 1 Phase, 1 Element, 3A, 150V V(RRM), Silicon, HERMETIC SEALED, GLASS, MELF-2;
| 型号： | JANTX1N5811URS |
| 厂家： | 
Microsemi |
| 描述： | Rectifier Diode, 1 Phase, 1 Element, 3A, 150V V(RRM), Silicon, HERMETIC SEALED, GLASS, MELF-2 |
| 文件： | 总7页 (文件大小：126K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TECHNICAL DATA SHEET
6 Lake Street, Lawrence, MA 01841
1-800-446-1158 / (978) 620-2600 / Fax: (978) 689-0803
Website: http://www.microsemi.com
Gort Road Business Park, Ennis, Co. Clare, Ireland.
Tel: +353 (0) 65 6840044 Fax: +353 (0) 65 6822298
VOIDLESS - HERMETICALLY- SEALED
ULTRAFAST RECOVERY GLASS RECTIFIERS
Qualified per MIL-PRF-19500/477
DEVICES
LEVELS
JAN
Leaded
1N5807
1N5809
1N5811
JANTX
JANTXV
JANS
Surface Mount 1N5807US
1N5807URS
1N5809US
1N5809URS
1N5811US
1N5811URS
DESCRIPTION
This “Ultrafast Recovery” rectifier diode series is military qualified to MIL-PRF-19500/477 and
is ideal for high-reliability applications where a failure cannot be tolerated. These industry-
recognized 6.0 Amp rated rectifiers for working peak reverse voltages from 50 to 150 volts are
hermetically sealed with voidless-glass construction using an internal “Category I” metallurgical
bond. These devices are available in both leaded and surface mount MELF package
configurations. Microsemi also offers numerous other rectifier products to meet higher and
lower current ratings with various recovery time speed requirements including standard, fast and
ultrafast device types in both through-hole and surface mount packages.
B-Body
Leaded Package
IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com
FEATURES
Popular JEDEC registered 1N5807, 1N5809, 1N5811
Voidless hermetically sealed glass package
Extremely robust construction
Internal “Category I” Metallurgical bonds
JAN, JANTX, JANTXV, and JANS available per MIL-PRF-19500/477
Surface mount versions available in a square end-cap MELF configuration with “US”
suffix
B-Body
Surface Mount
MELF PACKAGE
T4-LDS-0168 Rev. 2 (111089)
Page 1 of 7
TECHNICAL DATA SHEET
6 Lake Street, Lawrence, MA 01841
1-800-446-1158 / (978) 620-2600 / Fax: (978) 689-0803
Website: http://www.microsemi.com
Gort Road Bussiness Park, Ennis, Co. Clare, Ireland.
Tel: +353 (0) 65 6840044 Fax: +353 (0) 65 6822298
APPLICATIONS / BENEFITS
Ultrafast recovery 6 Amp rectifier series 50 to 150V
Military Space and other high-reliability applications
Switching power supplies or other applications requiring extremely fast switching & low forward loss
High forward surge current capability
Low thermal resistance
Controlled avalanche with peak reverse power capability
Inherently radiation hard as described in Microsemi MicroNote 050
MAXIMUM RATINGS
Junction Temperature: -65oC to +175oC
Storage Temperature: -65oC to +175oC
Average Rectified Forward Current (IO): 6 A @ TL = 75ºC at 3/8 inch lead length (see note 1)
Thermal Resistance: 22 ºC/W junction to lead (L=.375 in)
Thermal Impedance: 1.5 ºC/W @ 10 ms heating time
Forward Surge Current (8.3 ms half sine) 125 Amps
Capacitance: 60 pF at 10 volts, f = 1 MHz
Solder temperature: 260ºC for 10 s (maximum)
MECHANICAL AND PACKAGING
CASE: Hermetically sealed voidless hard glass with Tungsten slugs
TERMINATIONS: Axial-leads are Tin/Lead (Sn/Pb) over Ni plate over Copper.
MARKING: Body painted and part number, etc.
POLARITY: Cathode indicated by band
Tape & Reel option: Standard per EIA-296
Weight: 750 mg
See package dimensions on last page
T4-LDS-0168 Rev. 2 (111089)
Page 2 of 7
TECHNICAL DATA SHEET
6 Lake Street, Lawrence, MA 01841
1-800-446-1158 / (978) 620-2600 / Fax: (978) 689-0803
Website: http://www.microsemi.com
Gort Road Bussiness Park, Ennis, Co. Clare, Ireland.
Tel: +353 (0) 65 6840044 Fax: +353 (0) 65 6822298
ELECTRICAL CHARACTERISTICS @ TA = 25°C
BREAKDOWN
VOLTAGE
(MIN.)
WORKING
PEAK
REVERSE
VOLTAGE
VRWM
AVERAGE AVERAGE
RECTIFIED RECTIFIED
CURRENT CURRENT
MAXIMUM
FORWARD
VOLTAGE
@ 4A
(8.3 ms pulse)
VF
REVERSE
CURRENT
(MAX)
@ VRWM
IR
SURGE
CURRENT RECOVERY
(MAX)
IFSM
(NOTE 3)
REVERSE
TIME (MAX)
(NOTE 4)
trr
TYPE
IO1
IO2
@ 100A
VBR
@TL=75ºC @TA=-65ºC
(Note 1)
AMPS
Note 2
VOLTS
VOLTS
VOLTS
AMPS
ns
A
25oC
125oC 25oC 125oC
1N5807, US, URS
1N5809, US, URS
1N5811, US, URS
50
60
6.0
6.0
6.0
3.0
3.0
3.0
0.875
0.800
0.800
0.800
5
5
5
525
525
525
125
125
125
30
30
30
100
150
110
160
0.875
0.875
NOTE 1: Leaded: Rated at TL = 75ºC at 3/8 inch lead length. Derate at 60 mA/ºC for TL above 75ºC.
Surface mount: Rated at TEC = 75°C. Derate at 60 mA/ºC for TEC above 75ºC.
NOTE 2: Derate linearly at 25 mA/ºC above TA = 55ºC. This rating is typical for PC boards where thermal resistance
from mounting point to ambient is sufficiently controlled where TJ(max) does not exceed 175ºC
NOTE 3: TA = 25oC @ IO = 3.0 A and VRWM for ten 8.3 ms surges at 1 minute intervals
NOTE 4: IF = 1.0 A, IRM = 1.0 A, IR(REC) = 0.10 A and di/dt = 100 A/µs min
SYMBOLS & DEFINITIONS
Symbol
Definition
VBR
Minimum Breakdown Voltage: The minimum voltage the device will exhibit at a specified current.
Working Peak Reverse Voltage: The maximum peak voltage that can be applied over the operating
temperature range.
VRWM
Maximum Forward Voltage: The maximum forward voltage the device will exhibit at a specified
current.
VF
Maximum Leakage Current: The maximum leakage current that will flow at the specified voltage and
temperature.
IR
C
Capacitance: The capacitance in pF at a frequency of 1 MHz and specified voltage
Reverse Recovery Time: The time interval between the instant the current passes through zero when
changing from the forward direction to the reverse direction and a specified recovery decay point after a
peak reverse current is reached.
trr
T4-LDS-0168 Rev. 2 (111089)
Page 3 of 7
TECHNICAL DATA SHEET
6 Lake Street, Lawrence, MA 01841
1-800-446-1158 / (978) 620-2600 / Fax: (978) 689-0803
Website: http://www.microsemi.com
Gort Road Bussiness Park, Ennis, Co. Clare, Ireland.
Tel: +353 (0) 65 6840044 Fax: +353 (0) 65 6822298
GRAPHS
FIGURE 1
FIGURE 2
TYPICAL FORWARD CURRENT vs. FORWARD VOLTAGE
TYPICAL REVERSE CURRENT vs. VOLTAGE
FIGURE 3
FIGURE 4
OUTPUT CURRENT vs LEAD TEMPERATURE
FORWARD PULSE CURRENT vs. DURATION
FIGURE 6
FIGURE 7
MAXIMUM LEAD TEMP. vs. PD
MULTIPLE SURGE CURRENT vs. DURATION
T4-LDS-0168 Rev. 2 (111089)
Page 4 of 7
TECHNICAL DATA SHEET
6 Lake Street, Lawrence, MA 01841
1-800-446-1158 / (978) 620-2600 / Fax: (978) 689-0803
Website: http://www.microsemi.com
Gort Road Bussiness Park, Ennis, Co. Clare, Ireland.
Tel: +353 (0) 65 6840044 Fax: +353 (0) 65 6822298
PACKAGE DIMENSIONS
Dimensions
Ltr
1N5807, 1N5809, 1N5811
Notes
Inches
Millimeters
Min
Max
Min
Max
BD
BL
LD
LL
.115
.130
.036
.900
.142 2.92
3.61
7.62
1.07
4
3
3
.300
.042
3.30
0.91
1.30 22.86 33.02
NOTE:
1. Dimensions are in inches.
2. Millimeters are given for general information only.
3. Dimension BL shall include the entire body including slugs and sections of the lead over which the diameter is
uncontrolled. This uncontrolled area is defined as the zone between the edge of the diode body and extending
.050 inch (1.27 mm) onto the leads.
4. Dimension BD shall be measured at the largest diameter.
5. In accordance with ASME Y14.5M, diameters are equivalent to x symbology.
Lead Tolerance = + .002 -.003 in
*Includes sections of the lead or fillet over which the lead diameter is uncontrolled.
FIGURE 1. Physical Dimensions
T4-LDS-0168 Rev. 2 (111089)
Page 5 of 7
TECHNICAL DATA SHEET
6 Lake Street, Lawrence, MA 01841
1-800-446-1158 / (978) 620-2600 / Fax: (978) 689-0803
Website: http://www.microsemi.com
Gort Road Bussiness Park, Ennis, Co. Clare, Ireland.
Tel: +353 (0) 65 6840044 Fax: +353 (0) 65 6822298
PACKAGE DIMENSIONS
PAD LAYOUT
Dimensions
1N5807US,
1N5809US, 1N5811US
INCHES
0.288
0.070
mm
7.32
1.78
3.94
A
B
C
Ltr
Notes
Inches
Millimeters
0.155
Min Max
Min
Max
Note: If mounting requires
adhesive separate from the
solder, an additional 0.080 inch
diameter contact may be placed
in the center between the pads as
an optional spot for cement.
BD .137 .148
BL .200 .225
ECT .019 .028
3.84
5.08
0.48
0.08
3.76
5.72
0.71
S
.003
NOTE 1:
1. Dimensions are in inches.
2. Millimeters are given for general information only.
3. Dimensions are pre-solder dip.
4. Minimum clearance of glass body to mounting surface on all orientations.
5. Cathode marking to be either in color band, three dots spaced equally, or a color dot on the face of the end tab.
6. Color dots will be .020 inch (0.51 mm) diameter minimum and those on the face of the end tab shall not lie
within .020 inch (0.51 mm) of the mounting surface.
7. In accordance with ASME Y14.5M, diameters are equivalent to x symbology.
NOTE 2: This Package Outline has also previously been identified as “D-5B”
FIGURE 2A. Physical dimensions of US surface mount family
T4-LDS-0168 Rev. 2 (111089)
Page 6 of 7
TECHNICAL DATA SHEET
6 Lake Street, Lawrence, MA 01841
1-800-446-1158 / (978) 620-2600 / Fax: (978) 689-0803
Website: http://www.microsemi.com
Gort Road Bussiness Park, Ennis, Co. Clare, Ireland.
Tel: +353 (0) 65 6840044 Fax: +353 (0) 65 6822298
PACKAGE DIMENSIONS
Dimensions
1N5802URS,
1N5804URS, 1N5806URS
Ltr
Notes
8
Inches
Millimeters
Min
Max
Min
Max
BD
BL
.091
.168
.103
.200
.028
2.31
4.27
0.48
0.08
2.62
5.08
0.71
ECT .019
.003
8
S
NOTES:
1. Dimensions are in inches.
2. Millimeters are given for general information only.
3. Dimensions are pre-solder dip.
4. Minimum clearance of glass body to mounting surface on all orientations.
5. 5. Cathode marking to be either in color band, three dots spaced equally, or a color dot on the face of the end
tab.
6. Color dots will be .020 inch (0.51 mm) diameter minimum and those on the face of the end tab shall not lie
within .020 inch (0.51 mm) of the mounting surface.
7. In accordance with ASME Y14.5M, diameters are equivalent to x symbology.
8. One endcap shall be square and the other endcap shall be round.
FIGURE 2B. Physical dimensions of URS surface mount family.
T4-LDS-0168 Rev. 2 (111089)
Page 7 of 7
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