LX8610-00CDM 概述
1A BiCMOS Very Low Dropout Regulators 1A的BiCMOS非常低压差稳压器 线性稳压器IC
LX8610-00CDM 规格参数
是否Rohs认证: | 符合 | 生命周期: | Obsolete |
包装说明: | SOP, SOP8,.25 | Reach Compliance Code: | compliant |
ECCN代码: | EAR99 | HTS代码: | 8542.39.00.01 |
风险等级: | 5.68 | Is Samacsys: | N |
可调性: | ADJUSTABLE | 最大回动电压 1: | 0.45 V |
标称回动电压 1: | 0.25 V | JESD-30 代码: | R-PDSO-G8 |
JESD-609代码: | e3 | 长度: | 4.9 mm |
最大电网调整率 (%/V): | 0.075 | 最大负载调整率 (%): | 1.2% |
湿度敏感等级: | 1 | 功能数量: | 1 |
输出次数: | 1 | 端子数量: | 8 |
工作温度TJ-Max: | 125 °C | 工作温度TJ-Min: | |
最高工作温度: | 70 °C | 最低工作温度: | |
最大输出电流 1: | 1 A | 最大输出电压 1: | 5 V |
最小输出电压 1: | 1.25 V | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | SOP | 封装等效代码: | SOP8,.25 |
封装形状: | RECTANGULAR | 封装形式: | SMALL OUTLINE |
峰值回流温度(摄氏度): | 260 | 认证状态: | Not Qualified |
调节器类型: | ADJUSTABLE POSITIVE SINGLE OUTPUT LDO REGULATOR | 座面最大高度: | 2 mm |
子类别: | Other Regulators | 表面贴装: | YES |
技术: | BICMOS | 端子面层: | MATTE TIN |
端子形式: | GULL WING | 端子节距: | 1.27 mm |
端子位置: | DUAL | 处于峰值回流温度下的最长时间: | 40 |
宽度: | 3.9 mm | Base Number Matches: | 1 |
LX8610-00CDM 数据手册
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ꢀꢁꢂꢃꢁꢂꢁꢄꢅꢆ
1A BiCMOS Very Low Dropout Regulators
A
M I C R O S E M I
C O M P A N Y
PRELIMINARY DATASHEET
Dropout Voltage Typically
250mA At 1A And 50mV At
10mA
current, while the shutdown current is
very low dropout regulators. They are only 10µA.
The device will enter
designed to provide a power supply for shutdown mode when the ENABLE pin
very low headroom applications, such as is pulled low.
The LX8610 family are positive
Mcrosemi
Low Quiescent Current,
Under 400µA, Irrespective
Of Load
Shutdown Current 10µA
Adjustable Output Version In
8-pin SOIC Package
Fixed Outputs Of 2.5V, 3.3V
Available In 3-Pin SOT-223
Package
Low Reverse Leakage
Current
Short-Circuit And Thermal
Shutdown Protection
3.3V– 2.5V.
Thermal & Short-Circuit Current
BiCMOS technology allows an Limiting: the LX8610 limits the current
effective series pass element resistance, when the output is shorted, so protecting
.
RDS(ON) of 250m
sensitive load circuits. The device will
also turn off if the junction temperature
exceeds 155°C.
dropout voltage of 250mV at 1A.
Low Quiescent Current and Logic-
Controlled Shutdown help conserve
Available in small outline SOT-223
battery life and increase system and 8-pin SOIC: Adjustable versions
efficiency. Typical quiescent current is use the 8-pin SOIC and fixed output
under 400µA irrespective of load voltage devices are supplied in the 3-lead
SOT-223.
IMPORTANT:
For the most current data, consult MICROSEMI’s website: http://www.microsemi.com
3.3V & 2.5V Supplies For
Memory, Microprocessors,
Clock Circuits, Etc.
Portable Equipment
LX8610-xx Simplified Block Diagram
VOUT
VIN
Current
Limit
Reference
RA
Current
Charge
Pump
ADJ*
GND
RB
1.25V
ENABLE*
VIN/2
RB
-
RA
-
LX8610-00
LX8610-25
LX8610-33
Reverse
Voltage
Sense
25K
41K
25K
25K
Thermal
Shutdown
* Adjustable
8 lead version only
OUTPUT ST PLASTIC SOT-233
DM Plastic SOIC
8-PIN
TJ (°C)
VOLTAGE
3.3
3-PIN
LX8610-33CST
LX8610-25CST
–
LX8610-33CDM
LX8610-25CDM
LX8610-00CDM
0 to 125°C
2.5
ADJ (00)
Note: Available in Tape & Reel.
Append the letter “T” to the part number. (i.e. LX8610CDMT)
Copyright 2000
Rev. 0.6f,2000-09-15
Microsemi
Page 1
Linfinity Microelectronics Division
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
LX8610-xx
ꢀꢁꢂꢃꢁꢂꢁꢄꢅꢆ
1A BiCMOS Very Low Dropout Regulators
A
M I C R O S E M I
C O M P A N Y
PRELIMINARY DATASHEET
Input Voltage (VIN) ......................................................................................................6.5V
Enable Pin ..............................................................................................-0.3V to VIN+0.3V
Operating Junction Temperature Plastic (ST & DM) Packages .................................125°C
Storage Temperature ...................................................................................-65°C to 150°C
Lead Temperature (Soldering, 10 Seconds) ...............................................................300°C
TAB IS GND
Mcrosemi
VOUT
GND
VIN
3
2
1
Note: Exceeding these ratings could cause damage to the device. All voltages are with respect to
Ground. Currents are positive into, negative out of specified terminal.
.
ST PACKAGE
(Top View)
VOUT
GND/
1
2
3
4
8
7
6
5
ADJ
GND/
HEATSINK
GND/
HEATSINK
GND/
HEATSINK
HEATSINK
VIN
ENABLE
ST
PLASTIC SOT-223 PACKAGE
THERMAL RESISTANCE-JUNCTION TO TAB,
15 C/W*
°
θJT
DM PACKAGE
(Top View)
150 C/W
°
THERMAL RESISTANCE-JUNCTION TO AMBIENT,
θJA
DM
PLASTIC SOIC PACKAGE
30°C/W
90°C/W
THERMAL RESISTANCE-JUNCTION TO AMBIENT, θJLD
THERMAL RESISTANCE-JUNCTION TO AMBIENT, θJA
Junction Temperature Calculation: TJ = TA + (PD x θJA).
The θJA numbers are guidelines for the thermal performance of the device/pc-board
system. All of the above assume no ambient airflow.
θ
JA can be improved with package soldered copper area over backside ground plane or
internal power plane. θJA can vary from 45°C/W > 75°C/W depending on mounting
technique. See table below for thermal resistance guidelines:
Thermal
Resistance
Possible Heat Sink Approaches
using PCB Copper
Copper Area
(Topside)*
Copper Area
(Backside)*
Board Area
(
θJA)
ST (SOT-223)
2.0 sq” (1290mm2)
1.0 sq” (645 mm2)
0.5 sq” (323 mm2)
0.25 sq” (161 mm2)
1.0 sq” (645 mm2)
0.5 sq” (323 mm2)
0.1 sq” (65 mm2)
0.1 sq” (65 mm2)
2.0 sq” (1290mm2)
1.0 sq” (645 mm2)
0.5 sq” (323 mm2)
0.25 sq” (161 mm2)
45°C/W
50°C/W
60°C/W
70°C/W
1
2
3
4
8
7
6
5
DM (SOIC)
2.0 sq” (1290mm2)
1.0 sq” (645 mm2)
0.5 sq” (323 mm2)
0.25 sq” (161 mm2)
1.0 sq” (645 mm2)
0.5 sq” (323 mm2)
0.1 sq” (65 mm2)
0.1 sq” (65 mm2)
2.0 sq” (1290mm2)
1.0 sq” (645 mm2)
0.5 sq” (323 mm2)
0.25 sq” (161 mm2)
60°C/W
67°C/W
70°C/W
75°C/W
*Tab of device attached to topside copper, or leads 2,3,5,6 of SOIC package
Copyright 2000
Rev. 0.6f,2000-09-15
Microsemi
Page 2
Linfinity Microelectronics Division
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
LX8610-xx
ꢀꢁꢂꢃꢁꢂꢁꢄꢅꢆ
1A BiCMOS Very Low Dropout Regulators
A
M I C R O S E M I
C O M P A N Y
PRELIMINARY DATASHEET
Positive supply input for the regulator. Bypass to GND with at least 2.2µF of low ESR, ESL capacitance if
supply source is further than 1 inch from the device.
VIN
Mcrosemi
Output for the regulator. It is recommended to bypass to GND with at least 10µF although this is not required
for regulation, rather it is needed for transient response. Size your output capacitor to meet the transient
loading requirement. If you have a very dynamic load, a larger capacitor will improve the response to these
load steps.
VOUT
Reference ground. The input and output bypass capacitors should be connected to this pin. In addition the tab
on the SOT-223 package and pins 2,3,6, and 7 on the SOIC package are also used for heat sinking the device.
.
GND
ADJ
Feedback pin for the regulator. For the LX8610-00, the output voltage can be set by two external resistors with
the following relationship: VOUT = 1.25V * (1 + RA / RB) where RA is the resistor connected between VOUT and
ADJ, and RB is the resistor connected between ADJ and GND.
Enable input. This pin has a threshold of about VIN / 2, it should be actively pulled high to enable the regulator.
This can be accomplished with a resistive pull-up. When low, it turns off the regulator and puts the device in a
low current shutdown state.
ENALBE
VIN
IN
OUT
ADJ
VOUT
5
1
RA
RB
LX8610-00
CIN
8
COUT
ENABLE
GND
4
2,3
6,7
VREF
R
A
=
+
VOUT VREF
1
RB
Figure 1
– Typical Application
Copyright 2000
Rev. 0.6f,2000-09-15
Microsemi
Page 3
Linfinity Microelectronics Division
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
LX8610-xx
ꢀꢁꢂꢃꢁꢂꢁꢄꢅꢆ
1A BiCMOS Very Low Dropout Regulators
A
M I C R O S E M I
C O M P A N Y
PRELIMINARY DATASHEET
LX8610
Parameter
Symbol
Units
Min
Typ
Max
Mcrosemi
Input Voltage
VIN
3
5.5
V
Load Current (with adequate heatsinking)
Input Capacitor (VIN to GND)
Output Capacitor (VOUT to GND)
10
2.2
10
1000
mA
µF
µF
10
22*
* Size your output capacitor to meet the transient loading requirement. If you have a very dynamic load, a larger capacitor will improve the response to
these load steps.
.
ꢀ
Unless otherwise specified, the following specifications apply over the operating ambient temperature 0°C ≤ TA ≤ 125°C except where
otherwise noted. Test conditions: VIN = VOUT + 1.5V; IOUT = 10mA; CIN = 10µF; COUT = 22µF; TJ = TA.
LX8610-xx
Parameter
Symbol
Test Conditions
Units
Min
Typ
Max
ꢀ
LX8610-33 FIXED 3.3V, 1A
3.25
3.22
3.3
3.35
3.38
8
TJ = 25°C
Output Voltage
VOUT
V
Over Temperature
VIN = 3.45V to 5.5V
IOUT = 10mA to 1A
Line Regulation
Load Regulation
VREG
IREG
4
5
mV
mV
10
I
I
OUT = 1A, VOUT
OUT = 0.5A, VOUT
OUT –1%
OUT – 1%
OUT – 1%
0.25
0.15
0.05
1.25
400
400
0
0.4
Dropout Voltage (VDO = VIN–VOUT
)
VDO
V
0.25
0.15
1.7
600
650
IOUT = 10mA, VOUT
VOUT = 0V
IOUT = 10mA to 1A
0V < VIN < VOUT, VOUT <3.4V (at VOUT
OV < VIN < VOUT, VOUT <3.4V (at VIN)
Short Circuit Current
Quiescent Current
ISC
IQ
A
µA
µA
mA
V
)
Reverse Leakage Current
IREV
-50
0.8
Shutdown Threshold *
Shutdown Current *
VSD
ISD
VIN / 2
10
ENABLE < 0.8V
25
µA
ꢀ
LX8610-25 FIXED 2.5V, 1A
2.46
2.44
2.5
2.5
3
2.54
2.56
6
TJ = 25°C
Output Voltage
VOUT
V
Over Temperature
VIN = 3.1V to 5.5V, IOUT = -10mA
IOUT = 10mA to 1A
Line Regulation
Load Regulation
VREG
IREG
mV
mV
5
10
IOUT = 1A, VOUT
IOUT = 0.5A, VOUT
IOUT = 10mA, VOUT
VOUT = 0V
IOUT = 10mA to 1A
0V < VIN < VOUT, VOUT < 2.6V (at VOUT
0V < VIN < VOUT, VOUT <2.6V (at VIN)
OUT –1%
OUT – 1%
OUT – 1%
0.25
0.15
0.05
1.25
300
400
0
0.4
.025
0.1
1.7
600
650
Dropout Voltage (VDO = VIN–VOUT
)
VDO
V
Short Circuit Current
Quiescent Current
ISC
IQ
A
µA
µA
mA
V
)
Reverse Leakage Current
IREV
-50
0.8
Shutdown Threshold
Shutdown Current
VSD
ISD
VIN / 2
10
ENABLE < 0.8V
25
µA
Copyright 2000
Rev. 0.6f,2000-09-15
Microsemi
Page 4
Linfinity Microelectronics Division
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
LX8610-xx
ꢀꢁꢂꢃꢁꢂꢁꢄꢅꢆ
1A BiCMOS Very Low Dropout Regulators
A
M I C R O S E M I
C O M P A N Y
PRELIMINARY DATASHEET
LX8610-xx
Parameter
Symbol
Test Conditions
Units
Min
Typ
Max
LX8610-00 ADJUSTABLE OUTPUT,
1A
Mcrosemi
ꢀ
Reference Voltage
VREF
1.23
1.22
1.22
1.25
2
1.27
1.28
4
15
1.7
V
TJ = 25°C
Over Temperature
VIN = VOUT + 150mV to 5.5V, IOUT = 10mA
IOUT = 10mA to 1A
VOUT = 0V
IOUT = 1A, VIN > 4V
IOUT = 0.5A, VIN > 3V
Line Regulation
Load Regulation
Short Circuit Current
VREG
IREG
ISC
mV
mV
A
7
1.25
0.25
0.15
0.05
400
.
0.4
Dropout Voltage (VDO = VIN–VOUT
)
VDO
V
0.25
0.15
600
I
OUT = 10mA, VIN > 3V
Quiescent Current
IQ
IOUT = 10mA to 1A, VIN = 5.5V
µA
µA
mA
nA
V
0V < VIN < VOUT, VOUT < 5.5V (at VOUT
0V < VIN < VOUT, VOUT <5.5V (at VIN)
)
400
0
650
Reverse Leakage Current
IREV
-50
Bias Current at ADJ Pin
Shutdown Threshold
Shutdown Current
IBIAS
VSD
ISD
100
0.8 (VIN / 2)
10
ENABLE < 0.8V
25
µA
* Note: Enable threshold and Shutdown Current apply only to 8-Pin SOIC package outline versions
L X 8 6 1 0 D ro p o u t vs L o a d v s T e m p
350
300
250
200
150
100
50
0
25
75
100
125
0
0
0.25
0.5
0.75
1
FIGURE 2
– Dropout Voltage Vs. Output Current (Typical – LX8610-25CST)
Copyright 2000
Rev. 0.6f,2000-09-15
Microsemi
Page 5
Linfinity Microelectronics Division
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
LX8610-xx
ꢀꢁꢂꢃꢁꢂꢁꢄꢅꢆ
1A BiCMOS Very Low Dropout Regulators
A
M I C R O S E M I
C O M P A N Y
PRELIMINARY DATASHEET
3-Pin Plastic SOT-223
ST
Mcrosemi
MILLIMETERS
INCHES
D
Dim
MIN
1.55
0.65
2.95
0.25
6.30
3.30
MAX
1.80
0.85
3.15
0.35
6.70
3.70
MIN
MAX
0.071
0.033
0.124
0.014
0.264
0.146
B1
A
B
B1
C
D
E
F
G
H
I
0.061
0.026
0.116
0.010
0.248
0.130
.
E
H
2
1
3
2.30 BSC
4.60 BSC
0.0905 BSC
0.181 BSC
B
F
6.71
–
0.02
7.29
0.91
0.10
0.264
0.287
0.036
.004
G
–
L
J
K
L
.0008
K
10° MAX
10° MAX
A
.084
1.04
0.033
0.041
I
J
C
8-Pin Plastic SOIC
DM
MILLIMETERS
INCHES
Dim
A
MIN
4.83
3.81
1.35
0.33
–
MAX
5.00
3.94
1.75
0.51
0.77
MIN
0.190
0.150
0.053
0.013
–
MAX
0.197
0.155
0.069
0.020
0.030
A
B
C
D
F
G
J
K
L
M
P
1.27 BSC
0.050 BSC
0.19
0.13
4.80
–
0.25
0.25
5.21
8°
0.007
0.005
0.189
–
0.010
0.010
0.205
8°
B
G
L
M
C
P
5.79
–
6.20
0.10
0.228
–
0.244
0.004
*LC
*Lead Coplanarity
D
J
K
F
Note:
1. Dimensions do not include mold flash or protrusions; these shall
not exceed 0.155mm(.006”) on any side. Lead dimension shall not
include solder coverage.
Preliminary Data – Information contained in this document is pre-production data and is proprietary to LinFinity. It
may not be modified in any way without the express written consent of LinFinity. Product referred to herein is offered
in sample form only and LinFinity reserves the right to change or discontinue this proposed product at any time.
Copyright 2000
Rev. 0.6f,2000-09-15
Microsemi
Page 6
Linfinity Microelectronics Division
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
LX8610-00CDM 相关器件
型号 | 制造商 | 描述 | 价格 | 文档 |
LX8610-00CST | ETC | Low Drop Out Regulator - Positive Adjustable | 获取价格 | |
LX8610-00CSTT | MICROSEMI | Adjustable Positive LDO Regulator, 0.45V Dropout, BICMOS, PDSO4, PLASTIC, SOT-223, 3 PIN | 获取价格 | |
LX8610-25 | ETC | Positive Adjustable Voltage Regulator | 获取价格 | |
LX8610-25CDM | MICROSEMI | 1A BiCMOS Very Low Dropout Regulators | 获取价格 | |
LX8610-25CST | MICROSEMI | 1A BiCMOS Very Low Dropout Regulators | 获取价格 | |
LX8610-33 | ETC | Positive Adjustable Voltage Regulator | 获取价格 | |
LX8610-33CDM | MICROSEMI | 1A BiCMOS Very Low Dropout Regulators | 获取价格 | |
LX8610-33CST | MICROSEMI | 1A BiCMOS Very Low Dropout Regulators | 获取价格 | |
LX8610-33CSTT | MICROSEMI | Fixed Positive LDO Regulator, 3.3V, 0.45V Dropout, BICMOS, PDSO4, PLASTIC, SOT-233, 3 PIN | 获取价格 | |
LX8610-XX | MICROSEMI | 1A BiCMOS Very Low Dropout Regulators | 获取价格 |
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