MASMCG78CAE3TR [MICROSEMI]

1500W, BIDIRECTIONAL, SILICON, TVS DIODE, DO-215AB, PLASTIC, SMCG, 2 PIN;


型号：	MASMCG78CAE3TR
厂家：	Microsemi
描述：	1500W, BIDIRECTIONAL, SILICON, TVS DIODE, DO-215AB, PLASTIC, SMCG, 2 PIN 局域网光电二极管电视
文件：	总4页 (文件大小：345K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

TECHNICAL DATA SHEET

Gort Road Business Park, Ennis, Co. Clare, Ireland.

Tel: +353 (0) 65 6840044, Fax: +353 (0) 65 6822298

6 Lake Street, Lawrence, MA 01841

Tel: 1-800-446-1158 / (978) 794-1666, Fax: (978) 6890803

Website: http://www.microsemi.com

- High Reliability controlled devices

SURFACE MOUNT 1500 Watt

Transient Voltage Suppressor

- Unidirectional (A) and Bidirectional (CA) construction

- Available in both J-bend and Gull-wing terminations

- Selections for 5.0 to 170 V standoff voltages (V_WM

)

LEVELS

M, MA, MX, MXL

DEVICES

MSMCJ5.0A thru MSMCJ170CA, e3

and MSMCG5.0A thru MSMCG170CA, e3

FEATURES

High reliability controlled devices with fabrication and assembly lot traceability

100 % surge tested devices

Optional upscreening available by replacing the M prefix with MA, MX or MXL prefixes.

These prefixes specify various screening and conformance inspection options based on

MIL-PRF-19500. Refer to MicroNote 129 for more details on the screening options.

Axial-lead equivalent packages for thru-hole mounting available as 1.5KE6.8A to

1.5KE200CA or 1N6267 thru 1N6303A and 1N5908 (consult factory for other surface mount

options).

Moisture classification is Level 1 with no dry pack required per IPC/JEDEC J-STD-020B

RoHS compliant devices available by adding an “e3” suffix

3σ lot norm screening performed on Standby Current I_D

APPLICATIONS / BENEFITS

Protection from switching transients and induced RF

Protection from ESD and EFT per IEC 61000-4-2 and IEC 61000-4-4

Secondary lightening protection per IEC 61000-4-5 with 42 Ohms source impedance:

Class 1: MSMC5.0A to MSMC170CA

Class 2: MSMC5.0A to MSMC150CA

Class 3: MSMC5.0A to MSMC75CA

Class 4: MSMC5.0A to MSMC36CA

Secondary lightening protection per IEC 61000-4-5 with 12 Ohms source impedance:

Class 1: MSMC5.0A to MSMC90CA

Class 2: MSMC5.0A to MSMC45CA

Class 3: MSMC5.0A to MSMC24CA

Class 4: MSMC5.0A to MSMC11CA

Secondary lightening protection per IEC 61000-4-5 with 2 Ohms source impedance:

Class 2: MSMC5.0A to MSMC22CA

Class 3: MSMC5.0A to MSMC10CA

MAXIMUM RATINGS

Peak Pulse Power dissipation at 25 ºC: 1500 watts at 10/1000 μs (also see Figures 1,2, and

3) with impulse repetition rate (duty factor) of 0.01 % or less

tclamping (0 volts to V_BRmin.): < 100 ps theoretical for unidirectional and <5 ns for bidirectional

Operating and Storage temperature: -65 ºC to +150 ºC

Thermal resistance: 20 ºC/W junction to lead, or 80 ºC/W junction to ambient when mounted

on FR4 PC board (1oz Cu) with recommended footprint (see page 2)

Steady-State Power dissipation: 6 watts at TL = 30 ºC, or 1.56 watts at TA = 25 ºC when

mounted on FR4 PC board with recommended footprint (see page 2)

Forward Surge: 200 Amps peak impulse of 8.3 ms half-sine wave at 25 ºC (unidirectional

only)

Solder temperatures: 260 ºC for 10 s (maximum)

RF01001 Rev A, June 2010

High Reliability Product Group

Page 1 of 4

TECHNICAL DATA SHEET

Gort Road Business Park, Ennis, Co. Clare, Ireland.

Tel: +353 (0) 65 6840044, Fax: +353 (0) 65 6822298

6 Lake Street, Lawrence, MA 01841

Tel: 1-800-446-1158 / (978) 794-1666, Fax: (978) 6890803

Website: http://www.microsemi.com

___________________________________________________________________________________________________________________________________

MECHANICAL AND PACKAGING

Void-free transfer molded thermosetting epoxy body meeting UL94V-0

Gull-wing or J-bend tin-lead (90 % Sn, 10 % Pb) or RoHS (100 % Sn) compliant annealed matte-tin plating

solderable per MIL-STD-750, method 2026

Cathode indicated by band. No cathode band on bi-directional devices.

Part number marked on package

Available in bulk or custom tape-and-reel packaging

TAPE-AND-REEL option available with up to 750 devices on 7 inch reel or up to 2500 devices on 13 inch reel per

EIA-481-1-A with 12 mm tape. Add “TR” suffix to part number.

Weight: 0.25 grams (approximately)

PACKAGE DIMENSIONS

SMCJ

SMCG

DIMENSIONS IN INCHES

MIN .115 .260 .220 .305 .077 .380

MAX .121 .280 .245 .320 .104 .400

DIMENSIONS IN MILLIMETERS

.025

.040

.030

.060

MIN 2.92 6.60 5.59 7.75 1.95 9.65

0.635 .760

MAX 3.07 7.11 6.22 8.13 2.65 10.16 1.016 1.520

Typical Standoff Height: 0.004” – 0.008” (0.1mm – 0.2mm)

(DO-214AB)

(DO-215AB)

PAD LAYOUT

SMCJ (DO-214AB)

SMCG (DO-215AB)

INCHES

0.390

0.110

0.150

9.90

2.79

3.81

INCHES

0.510

0.110

0.150

12.95

2.79

3.81

SYMBOLS & DEFINITIONS

Symbol

V_WM

P_PP

Definition

Working Peak (Standoff) Voltage

Peak Pulse Power

Symbol

Definition

Peak Pulse Current

Clamping Voltage

I_PP

V_C

V_BR

Breakdown Voltage

I_BR

Breakdown Current for V_BR

Standby Current

I_D

RF01001 Rev A, June 2010

High Reliability Product Group

Page 2 of 4

TECHNICAL DATA SHEET

Gort Road Business Park, Ennis, Co. Clare, Ireland.

Tel: +353 (0) 65 6840044, Fax: +353 (0) 65 6822298

6 Lake Street, Lawrence, MA 01841

Tel: 1-800-446-1158 / (978) 794-1666, Fax: (978) 6890803

Website: http://www.microsemi.com

___________________________________________________________________________________________________________________________________

ELECTRICAL CHARACTERISTICS @ 25^oC

REVERSE

STAND-OFF

VOLTAGE

V_WM

BREAKDOWN

VOLTAGE

V_BR@ I_BR

MAXIMUM

CLAMPING

VOLTAGE

V_C@ I_PP

PEAK PULSE

CURRENT

(see Fig. 2)

I_PP

MAXIMUM

STANDBY

CURRENT

I_D@ V_WM

MICROSEMI PART NUMBER

GULL-WING

MSMCG5.0A

MSMCG6.0A

MSMCG6.5A

MSMCG7.0A

MSMCG7.5A

MSMCG8.0A

MSMCG8.5A

MSMCG9.0A

MSMCG10A

MSMCG11A

MSMCG12A

MSMCG13A

MSMCG14A

MSMCG15A

MSMCG16A

MSMCG17A

MSMCG18A

MSMCG20A

MSMCG22A

MSMCG24A

MSMCG26A

MSMCG28A

MSMCG30A

MSMCG33A

MSMCG36A

MSMCG40A

MSMCG43A

MSMCG45A

MSMCG48A

MSMCG51A

MSMCG54A

MSMCG58A

MSMCG60A

MSMCG64A

MSMCG70A

MSMCG75A

MSMCG78A

MSMCG85A

MSMCG90A

MSMCG100A

MSMCG110A

MSMCG120A

MSMCG130A

MSMCG150A

MSMCG160A

MSMCG170A

J- BEND

MSMCJ5.0A

MSMCJ6.0A

MSMCJ6.5A

MSMCJ7.0A

MSMCJ7.5A

MSMCJ8.0A

MSMCJ8.5A

MSMCJ9.0A

MSMCJ10A

MSMCJ11A

MSMCJ12A

MSMCJ13A

MSMCJ14A

MSMCJ15A

MSMCJ16A

MSMCJ17A

MSMCJ18A

MSMCJ20A

MSMCJ22A

MSMCJ24A

MSMCJ26A

MSMCJ28A

MSMCJ30A

MSMCJ33A

MSMCJ36A

MSMCJ40A

MSMCJ43A

MSMCJ45A

MSMCJ48A

MSMCJ51A

MSMCJ54A

MSMCJ58A

MSMCJ60A

MSMCJ64A

MSMCJ70A

MSMCJ75A

MSMCJ78A

MSMCJ85A

MSMCJ90A

MSMCJ100A

MSMCJ110A

MSMCJ120A

MSMCJ130A

MSMCJ150A

MSMCJ160A

MSMCJ170A

5.0

6.0

6.5

7.0

7.5

8.0

8.5

9.0

9.2

A

1000

500

200

100

6.40 – 7.00

6.67 – 7.37

7.22 – 7.98

7.78 – 8.60

8.33 – 9.21

8.89 – 9.83

9.44 – 10.4

10.0 – 11.1

11.1 – 12.3

12.2 – 13.5

13.3 – 14.7

14.4 – 15.9

15.6 – 17.2

16.7 – 18.5

17.8 – 19.7

18.9 – 20.9

20.0 – 22.1

22.2 – 24.5

24.4 – 26.9

26.7 – 29.5

28.9 – 31.9

31.1 – 34.4

33.3 – 36.8

36.7 – 40.6

40.0 – 44.2

44.4 – 49.1

47.8 – 52.8

50.0 – 55.3

53.3 – 58.9

56.7 – 62.7

60.0 – 66.3

64.4 – 71.2

66.7 – 73.7

71.1 – 78.6

77.8 – 86.0

83.3 – 92.1

86.7 – 95.8

94.4 – 104.0

100 – 111

111 – 123

122 – 135

133 – 147

144 – 159

167 – 185

178 – 197

189 – 209

163.0

145.6

133.9

125.0

116.3

110.3

104.2

97.4

88.2

82.4

75.3

69.7

64.7

61.5

57.7

53.3

51.4

46.3

42.2

38.6

35.6

33.0

31.0

28.1

25.8

23.2

21.6

20.6

19.4

18.2

17.2

16.0

15.5

14.6

13.3

12.4

11.4

10.4

10.3

9.3

10.3

11.2

12.0

12.9

13.6

14.4

15.4

17.0

18.2

19.9

21.5

23.2

24.4

26.0

27.6

29.2

32.4

35.5

38.9

42.1

45.4

48.4

53.3

58.1

64.5

69.4

72.7

77.4

82.4

87.1

93.6

96.8

103.0

113

100

110

120

130

150

160

170

121

126

137

146

162

177

193

209

8.4

7.8

7.2

6.2

5.8

5.5

243

259

275

NOTE 1: For Bidirectional device types indicate CA suffix after the part number. (i.e. MSMCJ170CA). Bidirectional

capacitance is half that shown in Figure 4 at zero volts.

NOTE 2: Microsemi Corp’s MSMC series (1500 W) surface mountable packages are designed specifically for transient voltage

suppression. The wide leads assure a large surface contact for good heat dissipation, and a low resistance path for

surge current flow to ground. These high speed transient voltage suppressors can be used to effectively protect

sensitive components such as integrated circuits and MOS device.

RF01001 Rev A, June 2010

High Reliability Product Group

Page 3 of 4

TECHNICAL DATA SHEET

Gort Road Business Park, Ennis, Co. Clare, Ireland.

Tel: +353 (0) 65 6840044, Fax: +353 (0) 65 6822298

6 Lake Street, Lawrence, MA 01841

Tel: 1-800-446-1158 / (978) 794-1666, Fax: (978) 6890803

Website: http://www.microsemi.com

___________________________________________________________________________________________________________________________________

GRAPHS

100

(Waveform – See Figure 2)

Non-repetitive

1.0

1µs

10µs

100µs

1ms

10 ms

Test waveform parameters

tr = 10µs, tp = 1000µs

tp – Pulse Time – sec

FIGURE 2 – Pulse Waveform

FIGURE 1 – Peak Pulse Power vs. Pulse Time

T_LLead Temperature ^oC

Breakdown Voltage in Volts

FIGURE 4 – Typical Capacitance vs. Breakdown

FIGURE 3 – Derating Curve

RF01001 Rev A, June 2010

High Reliability Product Group

Page 4 of 4

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