MFT62320A-JO [MICROSEMI]
Fiber Optic Emitter,;
| 型号： | MFT62320A-JO |
| 厂家： | 
Microsemi |
| 描述： | Fiber Optic Emitter, |
| 文件： | 总13页 (文件大小：109K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MFT62320A-J
Parallel Fiber Transmitter
Preliminary Information
DS5510
ISSUE 1.1
October 2001
Ordering Information
MFT62320A-JO
MFT62320A-JX
MPO/MTP Connector
MPX Connector
Applications
•
High-speed interconnects within and between
Switches, Routers and Transport equipment
•
•
Proprietary backplanes
Low cost OC-192 VSR (Very Short Reach)
connections
•
•
InfiniBand™ connections
Interconnects rack-to-rack, shelf-to-shelf,
board-to-board, board-to-optical backplane
Features
•
•
•
•
•
Data rate 155Mbps to 2.5Gbps per channel
4 parallel channels, total 10Gbps capacity
Description
Differential CML (Current-Mode Logic) interface
The MFT62320A-J and MFR62320A-J make a very
high speed transmitter and receiver pair for parallel
fiber applications. This pair, coupled through a
multimode parallel fiber ribbon cable, constitutes a
complete parallel fiber link. These links provides
high-speed interconnects for use within and between
large capacity switches, routers and data transport
equipment. The transmitter and receiver have a
differential CML interface and support MPO/MTP
and MPX fiber connectors.
.
Link length up to 300m (with 500MHz km fiber)
-12
Channel BER 10
MFR62320A-J
when used with
•
•
•
•
•
Designed for multimode fiber ribbon
MPO/MTP or MPX connector options
Surface-mount package
Pick-and-placeable; reflow solderable
Class 1 IEC 60825-1 Amd. 2 compliant with
50/125µm fiber
•
Matches the MFR62320A-J Receiver
16.0
46.9
16.7
Dimensions in mm
Figure 1 - MFT62320A-JO: MPO/MTP Connector Option
1
MFT62320A-J Preliminary Information
Absolute Maximum Ratings (note 1)
Parameter
Symbol
Min
Max
Unit
1
2
3
4
5
6
Supply voltage
VCC
-0.3
-0.3
20
3.6
VCC+0.3
85
V
V
Voltage on any pin
V
PIN
Operating and storage moisture
Storage temperature
M
%
°C
kV
V
OS
TSTG
-40
-2
+100
2
ESD resistance all I/O except CML (note 3)
ESD resistance CML I/O (note 3)
V
E
V
-500
500
EC
Recommended Operating Conditions (note 4)
Parameter
Symbol
Min
Max
Unit
1
2
3
4
5
6
7
8
Case temperature (note 5, fig. 7)
Supply voltage (note 2,6)
T
0
80
3.3+5%
800
°C
V
CASE
V
3.3-5%
200
CC
CML differential input voltage (Fig. 4,5)
Data rate per channel
V
mV
Gbps
ps
ICML
f
0.155
2.5
D
CML differential input rise/fall time (20-80%, Fig. 5)
CMOS input voltage low
t
, t
160
RC FC
V
0
30%V
V
LCMOS
HCMOS
CC
CC
CMOS input voltage high
V
70%V
V
V
CC
Power supply noise (1MHz to 2GHz)
V
100
mV
p-p
NPS
LASER RADIATION
DO NOT VIEW DIRECTLY WITH OPTICAL INSTRUMENTS
CLASS 1M LASER PRODUCT
Note 1:
Note 2:
Note 3:
Note 4:
Exceeding these values may cause permanent damage. Functional operation under these conditions is not implied.
Vcc turn-on slew rate minimum 0.6V/ms.
Human body model.
Data patterns are to have maximum run lengths and DC balance shifts no worse than those of a Pseudo
23
Random Bit Sequence of length 2 -1 (PRBS-23).
Note 5:
Note 6:
An air flow parallel to the PCB, and parallel with the module’s heatsink flanges, is recommended. See figure 7
for information about ambient temperature vs. air flow.
The heat sink of the module is at Gnd potential.
2
Preliminary Information MFT62320A-J
Characteristics (note 1)
Parameter
Symbol Min
Typ
Max
Unit
1
2
3
4
5
Power consumption (2.5 Gbps, Fig. 6)
Power supply current
P
0.87
277
120
130
-3
W
mA
Ω
D
I
CC
CML differential input impedance (Fig. 3,4)
Optical rise/fall time (20-80%)
Z
80
-7
100
IN
t
t
ps
RO, FO
Average fiber output power per channel
50/125µm fiber, NA=0.2 (note 2)
P
dBm
F
6
7
8
9
Jitter
Total (note 3)
TJ
DJ
λ
120
48
ps
ps
p-p
Contribution
Optical wavelength
Spectral width
Deterministic (note 4)
p-p
830
6
840
860
0.85
-118
nm
∆λ
nm
dB/Hz
dB
ps
10 Relative Intensity Noise
11 Extinction ratio (note 5)
12 Channel skew (note 6)
RIN
ER
t
175
0.4
SK
13
Low (I
High
= 3mA)
V
V
sink
LNMOS
HNMOS
NMOS output voltage
14
V
2.4
V
15
Assert time
T
10
10
µs
AE
Transmitter Enable
(TX_EN) (fig. 8)
16
De-assert time
T
µs
DE
17 Transmitter Ready (TX_R) assert time (fig. 9)
T
100
100
ms
µs
AR
18 Laser Safety
Shutdown
Laser de-assert time
Laser assert time
T
1
DL
(note 7, Fig. 10)
19
T
20
µs
AL
Note 1:
Note 2:
Operating conditions are as per Recommended Operating Conditions. Test pattern PRBS-23 at 2.5Gbps with
50/125µm fiber unless otherwise specified.
The optical output power, measured at the output of a 2 meter 50/125µm fiber test cable, is compliant with
IEC60825-1 Amendment 2, Class 1 Accessible Emission Limits (AEL). With a larger fiber attached, or with no fiber
attached, the output optical power is compliant with IEC60825-1 Amendment 2, Class 1M AEL.
Note 3:
Note 4:
Total Jitter, TJ, equals TP1 to TP2 as defined in IEEE 802.3z Gigabit Ethernet Specification 38.5. Total jitter is
-12
-12
specified at a BER of 10 (TJ=DJ+RJ
x 2Q, where Q=7 for BER 10 and RJ=Random Jitter).
rms
Deterministic jitter includes duty cycle distortion and is measured with zero skew between the differential data
inputs.
Note 5:
Note 6:
Note 7:
Extinction ratio is measured with a PRBS-23 pattern at 622Mbps.
Optical channel skew is measured with the input signals having equal amplitude and no input electrical channel skew.
An activity detector monitors the data input on each of the electrical input channels of the transmitter. If there are no
data transitions on a channel within a certain time (T ), the channel’s laser will be automatically turned off.
DL
This prevents potential non eye-safe conditions caused by the laser being stuck in the “on” state. The channel will
resume normal operation automatically once activity is again detected.
3
MFT62320A-J Preliminary Information
channel within a certain time, the channel’s laser will
be automatically turned off. This prevents potential
non eye-safe conditions caused by the laser being
stuck in the “on” state. The channel will resume
normal operation automatically once activity is again
detected.
Cleaning the Optical Interface
A protective connector plug is supplied with each
module. This plug should remain in place prior to
use, and be re-attached whenever a fiber cable is not
inserted. This will keep the optical interface free
from dust or other contaminants, which may
potentially degrade the optical signal. Before re-
attaching the connector plug to the module, visually
inspect the plug and remove any contamination. If
the optical interface becomes contaminated, it can
be cleaned with high-pressure nitrogen. Liquids or
physical contact with the optical interface are not
advised due to potential damage.
The maximum optical output power is specified in
accordance with IEC60825-1, Amendment 2, which
was accepted by IEC and CENELEC early 2001. In
addition, the U.S. FDA Center for Devices and
Radiological Health (CDRH) is expected to revise its
laser safety regulation, CFR 21 1040, to agree with
the IEC and CENELEC standards, while exempting
LEDs. CDRH has indicated it will accept compliance
with the technical portions of the IEC and CENELEC
standards under a waiver process in the interim once
the IEC and CENELEC standards are published.
Assembly on Printed Circuit Board
The module can be soldered by hand or by a reflow
process.
•
•
For hand soldering, a soldering iron with its tip
connected to ground should be used. Solder
extractors, including replacement parts, should
be of the non-static generating type.
Electrostatic Discharge (ESD)
The module is classified as Class 1 according to
MIL-STD-883, test method 3015. When handling the
modules, precautions for ESD sensitive devices
should be taken. These precautions include use of
ESD protected work areas with wrist straps,
controlled work benches, floors etc. The
recommendations advised by Zarlink in the technical
note "MFTN6005A Manufacturing Guidelines" should
be followed.
For reflow soldering, the recommendations
advised by Zarlink in the technical note
“MFTN6005A Manufacturing Guidelines” should
be followed. This document provides guidelines
about choice of solder, reflow temperature and
time profile etc.
Use of solder with no-clean flux, i.e. solder that does
not require washing after assembly, is
recommended. Washing the module with any kind of
liquid is not advised due to potential damage.
Electromagnetic Interference (EMI)
•
Emission: The electromagnetic emission is
tested in front of the module (module fitted with
EMI shield “-JOS option”), with the module
mounted in a front-panel cutout as shown in fig.
13. The specification is to FCC Class B with
6dB margin.
Eye Safety
This module includes Vertical Cavity Surface-
Emitting Lasers (VCSELs) and is designed for
inherent eye safety without the need for loopback
control. An activity detector monitors the data input
on each of the electrical input channels of the
transmitter. If there are no data transitions on a
•
Immunity: The electromagnetic immunity is
tested without a front panel or enclosure. The
module specification is maintained with an
applied field of 10V/m for frequencies between
80MHz and 1GHz.
4
Preliminary Information MFT62320A-J
TX_EN
Di1
Di4
Di1c
Di4c
1
:
:
:
:
Optical
Outputs
VCSEL
Driver
VCSEL
Array
2
3
4
VCSEL Driver Controller
TX_R
VCC Gnd
Figure 2 - Block Diagram
100 nF
Vcc
DiN
50Ω
50Ω
8.4KΩ
8.4KΩ
Gnd
DiNc
100 nF
Figure 3 - Data Input Equivalent Circuit
5
MFT62320A-J Preliminary Information
Recommended CML Output
MFT62320A-J CML Input
+3.3V
100nF
Z
=100Ω
Z =100Ω
IN
Differential
IN
Z =100Ω Differential
O
Differential
100nF
AC coupling capacitors are included
in the module
Figure 4 - Differential CML Interface
Data
80%
20%
VICML
Data Inv
tRC
tFC
Figure 5 - CML Differential Signals
100%
80%
60%
40%
20%
0.5
1.0
1.5
2.0
2.5
0
Data Rate (Gbps)
Figure 6 - Relative Power Consumption vs. Data Rate
6
Preliminary Information MFT62320A-J
80
70
60
50
40
30
20
10
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
Air Flow [m/s]
Figure 7 - Max Air Temperature vs. Air Flow for Case Temperature Max 80˚C
0.7Vcc
TX_EN
0.3Vcc
TAE
TDE
Optical
Input
Transmitter Disabled
Transmitter Enabled*
Transmitter Disabled
* Activity on the Data Input pins is required for Optical Output
Figure 8 - Transmitter Enable Timing Diagram
0.8VCC
VCC
TAR
2.4V
0.4V
TX_R
Optical
Output
Transmitter Not Ready
Transmitter Ready
Figure 9 - Power-Up Timing Diagram
7
MFT62320A-J Preliminary Information
Last Data Transition
New Data Transition
TDL
TAL
Laser Enabled
Laser Disabled
Laser Enabled
Figure 10 - Laser Safety Shutdown Timing Diagram
25
1
MFT62320A-J
50
1
FIBER RIBBON
12
26
Figure 11 - Pin Locations (Top View)
8
Preliminary Information MFT62320A-J
Pin Description
No
1
Name
Logic
Description
No
50
49
48
47
Name
Logic
Description
Gnd
Ground
Gnd
Ground
2
V
V
Positive power supply
Positive power supply
Not Connected
V
V
Positive power supply
Positive power supply
CC
CC
CC
CC
3
4
TX_R
NMOS
Transmitter Ready after
power-up.
Low = Transmitter not
ready.
High = Transmitter ready.
Open drain with internal
pull-up resistor 10kΩ.
5
TX_EN
CMOS
Transmitter Enable
channels 1 to 4
High = Transmitter
channels active.
Low = Transmitter
channels turned off.
Internal pull-down resistor
50kΩ.
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
Not Connected
Not Connected
Ground
6
Not Connected
Gnd
Gnd
Gnd
Gnd
Not Connected
Not Connected
Ground
7
Gnd
Gnd
Gnd
Gnd
Ground
Not Connected
Not Connected
Ground
8
Not Connected
Not Connected
Ground
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
Not Connected
Not Connected
Ground
Not Connected
Not Connected
Ground
Not Connected
Not Connected
Ground
Not Connected
Not Connected
Ground
Gnd
Di4
CML
CML
Data input No 4.
Data input No 4, inv.
Ground
Not Connected
Not Connected
Ground
Di4c
Gnd
Di3
Gnd
Di1c
Di1
CML
CML
Data input No 3.
Data input No 3, inv.
Ground
CML
CML
Data input No 1, inv.
Data input No 1.
Ground
Di3c
Gnd
Gnd
Di2c
Di2
CML
CML
Data input No 2, inv
Data input No 2.
Ground
Gnd
9
MFT62320A-J Preliminary Information
Mechanical Drawings
16
46.9
14.4
Ø3
8.5
0.76
1.27
0.5
3.5
7.19
16.7
Dimensions in mm
Figure 12 - MFT62320A-JO: MPO/MTP Connector Option
46.5
1.27
0.5
18.1
1.9
0.76
6
22.75
Dimensions in mm
Figure 13 - MFT62320A-JX: MPX Connector Option
10
Preliminary Information MFT62320A-J
PCB Footprints
3.5
Guide pin key
Ø3.2
1
50
25
26
12.7
17.78
Dashed lines indicate module outline
Solid lines indicate board layout
Dimensions in mm
Rear of Module
Figure 14 - MFT62320A-JO: MPO/MTP Connector Option (Top View)
9.05
9.05
Guide pin keys
1
50
25
26
12.7
17.78
Dashed lines indicate module outline
Solid lines indicate board layout
Dimensions in mm
Rear of Module
Figure 15 - MFT62320A-JX: MPX Connector Option (Top View)
11
MFT62320A-J Preliminary Information
Electrical Connections
TX_R
Di4c
Vcc(3.3V)
Zo=100 Ohm Differential
ZL=100 Ohm
Di4
C1
R1
100pF
5.1Ohm
.
.
.
.
.
.
.
.
.
.
C2
100nF
C4
100pF
Di01
C3
100nF
R2
5.1Ohm
Zo=100 Ohm Differential
ZL=100 Ohm
Di01c
Notes:
TX_EN
*
C1-C4 and R1-R2 should be placed as close
to the Vcc pins as possible.
*
*
Use a ground plane under the module.
Use vias to connect Gnd pins to ground plane
Figure 16 - Recommended Electrical Connections
12
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2
2
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Purchase of Zarlink’s I C components conveys a licence under the Philips I C Patent rights to use these components in an I C System, provided that the system conforms
2
to the I C Standard Specification as defined by Philips
Zarlink and the Zarlink Semiconductor logo are trademarks of Zarlink Semiconductor Inc.
Copyright 2001, Zarlink Semiconductor Inc. All rights reserved.
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