MRT100KP110CATR [MICROSEMI]

100000W, BIDIRECTIONAL, SILICON, TVS DIODE, PLASTIC, CASE 5A, 2 PIN;
MRT100KP110CATR
型号: MRT100KP110CATR
厂家: Microsemi    Microsemi
描述:

100000W, BIDIRECTIONAL, SILICON, TVS DIODE, PLASTIC, CASE 5A, 2 PIN

二极管 电视 瞬态抑制器
文件: 总5页 (文件大小:260K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
TECHNICAL DATA SHEET  
Gort Road Business Park, Ennis, Co. Clare, Ireland.  
Tel: +353 (0) 65 6840044, Fax: +353 (0) 65 6822298  
6 Lake Street, Lawrence, MA 01841  
Tel: 1-800-446-1158 / (978) 794-1666, Fax: (978) 6890803  
Website: http://www.microsemi.com  
- High Reliability controlled devices  
Unidirectional and Bidirectional  
Transient Voltage Suppressor  
- Economical series for thru hole mounting  
- Unidirectional (A) and Bidirectional (CA) construction  
- Selections for 40 to 400 V standoff voltages (VWM)  
LEVELS  
M, MA, MX, MXL  
DEVICES  
MRT100KP40A thru MRT100KP400CA, e3  
FEATURES  
.
.
.
.
.
.
High reliability controlled devices with wafer fabrication and assembly lot traceability  
100 % surge tested devices  
Suppresses transients up to 100 kW @ 6.4/69 µs  
Fast response with less than 5ns turn-on time  
Preferred 100kW TVS for aircraft power bus protection  
Optional upscreening available by replacing the M prefix with MA, MX or MXL. These prefixes  
specify various screening and conformance inspection options based on MIL-PRF-19500.  
Refer to MicroNote 129 for more details on the screening options.  
.
.
.
Moisture classification is Level 1 with no dry pack required per IPC/JEDEC J-STD-020B  
RoHS Compliant devices available by adding “e3” suffix  
3σ lot norm screening performed on Standby Current ID  
CASE 5A  
APPLICATIONS / BENEFITS  
.
Protection from high power switching transients, induced RF, and lightning threats with  
comparatively small package size (0.25 inch diameter)  
.
.
Protection from ESD and EFT per IEC61000-4-2 and IEC61000-4-4  
Pin injection protection per RTCA/DO-160E up to Level 4 for Waveform 4 (6.4/69 µs) on all  
devices  
.
.
.
.
Pin injection protection per RTCA/DO-160E up to Level 5 for Waveform 4 (6.4/69 µs) on device  
types MRT100KP33A or CA up to MRT100KP260A or CA  
Pin injection protection per RTCA/DO-160E up to Level 3 for Waveform 5A (40/120 µs) on all  
devices  
Pin injection protection per RTCA/DO-160E up to Level 4 for Waveform 5A (40/120 µs) on  
device types MRT100KP33A or CA up to MRT100KP64A or CA  
Consult Factory for other voltages with similar Peak Pulse Power capabilities  
MAXIMUM RATINGS  
.
Peak Pulse Power dissipation at 25 ºC: 100 kW at @ 6.4/69 µs in Figure 8 (also see Figures 1  
and 2)  
impulse repetition rate (duty factor) of 0.005 %  
.
.
.
tclamping (0 volts to VBR min.): < 100 ps theoretical for unidirectional and < 5 ns for bidirectional  
Operating and Storage temperature: -65 ºC to +150 °C  
Thermal Resistance: 17.5 °C/W junction to lead, or 77.5 °C/W junction to ambient when  
mounted on FR4 PC board with 4 mm2 copper pads (1 oz ) and track width 1 mm, length 25  
mm  
.
Steady-state power dissipation: 7 Watts @ TL = 27.5 °C or 1.61 Watts at TA = 25 °C when  
mounted on FR4 PC Board described above for thermal resistance  
.
.
Forward surge: 250 Amps 8.3 ms half-sine wave for unidirectional devices only  
Solder temperatures: 260 °C for 10 s (maximum)  
RF01012 Rev A, August 2010  
High Reliability Product Group  
Page 1 of 5  
TECHNICAL DATA SHEET  
Gort Road Business Park, Ennis, Co. Clare, Ireland.  
Tel: +353 (0) 65 6840044, Fax: +353 (0) 65 6822298  
6 Lake Street, Lawrence, MA 01841  
Tel: 1-800-446-1158 / (978) 794-1666, Fax: (978) 6890803  
Website: http://www.microsemi.com  
___________________________________________________________________________________________________________________________________  
MECHANICAL AND PACKAGING  
.
.
Void-free transfer molded thermosetting epoxy body meeting UL94V-0 requirements  
Tin-Lead (90 % Sn, 10 % Pb) or RoHS (100% Sn) Compliant annealed matte-Tin plating readily solderable per  
MIL-STD-750, method 2026  
.
.
.
.
.
Body marked with part number  
Cathode indicated by band. No cathode band on bi-directional devices.  
Weight: 1.7 grams (approximate)  
Available in bulk or custom tape-and-reel packaging  
TAPE-AND-REEL standard per EIA-296 (add “TR” suffix to part number)  
PACKAGE DIMENSIONS  
NOTE: Cathode indicated by band  
All dimensions in inches  
millimeters  
SYMBOLS & DEFINITIONS  
Symbol  
Definition  
Symbol  
Definition  
VWM  
PPP  
VBR  
ID  
Working Peak (Standoff) Voltage  
Peak Pulse Power  
Breakdown Voltage  
Standby Current  
IPP  
VC  
Peak Pulse Current  
Clamping Voltage  
Breakdown Current for VBR  
IBR  
RF01012 Rev A, August 2010  
High Reliability Product Group  
Page 2 of 5  
TECHNICAL DATA SHEET  
Gort Road Business Park, Ennis, Co. Clare, Ireland.  
Tel: +353 (0) 65 6840044, Fax: +353 (0) 65 6822298  
6 Lake Street, Lawrence, MA 01841  
Tel: 1-800-446-1158 / (978) 794-1666, Fax: (978) 6890803  
Website: http://www.microsemi.com  
___________________________________________________________________________________________________________________________________  
ELECTRICAL CHARACTERISTICS @ 25oC  
Maximum  
V(BR)  
Maximum  
Clamping  
@ IPP (2)  
Maximum  
Reverse  
Leakage  
@ VWM  
ID  
Maximum  
Peak Pulse  
Current (3)  
@6.4/69 µs  
IPP  
Rated  
Stand-off  
Voltage  
VWM  
Breakdown Voltage  
V(BR) Volts  
Part  
Number  
(1) (4)  
temperature  
Coefficient  
V(BR)  
@ I(BR)  
V(BR)  
VOLTS  
I(BR)  
mA  
VC  
VOLTS  
VOLTS  
Amps  
mV/oC  
Amps  
RT100KP40A  
RT100KP43A  
RT100KP45A  
RT100KP48A  
RT100KP51A  
RT100KP54A  
RT100KP58A  
RT100KP60A  
RT100KP64A  
RT100KP70A  
RT100KP75A  
RT100KP78A  
RT100KP85A  
RT100KP90A  
RT100KP100A  
RT100KP110A  
RT100KP120A  
RT100KP130A  
RT100KP150A  
RT100KP160A  
RT100KP170A  
RT100KP180A  
RT100KP200A  
RT100KP220A  
RT100KP250A  
RT100KP260A  
RT100KP280A  
RT100KP300A  
RT100KP350A  
RT100KP400A  
40  
43  
45  
48  
51  
54  
58  
60  
64  
70  
75  
78  
85  
44.4-49.1  
47.8-52.8  
50.0-55.3  
53.3-58.9  
56.7-62.7  
60.0-66.3  
64.4-71.2  
66.7-73.7  
71.1-78.6  
77.8-86.0  
83.3-92.1  
86.7-95.8  
94.4-104  
100-111  
111-123  
122-135  
133-147  
144-159  
167-185  
178-197  
189-209  
200-221  
222-245  
245-271  
278-308  
289-320  
311-345  
333-369  
389-431  
444-492  
20  
10  
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
78.6  
84.5  
88.5  
94.3  
101  
106  
114  
118  
126  
138  
147  
153  
166  
178  
197  
216  
235  
254  
296  
315  
334  
354  
392  
434  
493  
512  
552  
590  
690  
787  
1500  
500  
150  
150  
50  
25  
15  
15  
10  
10  
10  
10  
10  
10  
10  
10  
10  
10  
10  
10  
10  
10  
10  
10  
10  
10  
10  
10  
10  
10  
1273 *  
1184 *  
1130 *  
1061 *  
990 *  
943 *  
878  
848  
795  
725  
680  
655  
602  
563  
508  
463  
426  
394  
338  
318  
300  
283  
256  
231  
203  
196  
181  
46  
50  
52  
56  
60  
63  
68  
71  
76  
83  
89  
93  
102  
109  
121  
133  
145  
157  
183  
195  
207  
219  
243  
269  
306  
318  
344  
368  
430  
490  
90  
100  
110  
120  
130  
150  
160  
170  
180  
200  
220  
250  
260  
280  
300  
350  
400  
170  
145  
127  
NOTE 1:  
NOTE 2:  
For bidirectional construction, indicate a CA suffix (instead of A) after the part number  
Clamping voltage does not include any variable parasitic lead inductance effects observed during the 6.4 µs rise time  
due to lead length  
NOTE 3:  
NOTE 4:  
The Maximum Peak Pulse Current (IPP) shown represents the performance capabilities by design.  
* Surge test screening is only performed up to 900 Amps (test equipment limitations)  
Part numbers in bold italics are preferred devices  
RF01012 Rev A, August 2010  
High Reliability Product Group  
Page 3 of 5  
TECHNICAL DATA SHEET  
Gort Road Business Park, Ennis, Co. Clare, Ireland.  
Tel: +353 (0) 65 6840044, Fax: +353 (0) 65 6822298  
6 Lake Street, Lawrence, MA 01841  
Tel: 1-800-446-1158 / (978) 794-1666, Fax: (978) 6890803  
Website: http://www.microsemi.com  
___________________________________________________________________________________________________________________________________  
GRAPHS  
tp Pulse Time sec.  
TL Lead Temperature oC  
FIGURE 1  
Peak Pulse Power vs. Pulse Time  
To 50% of Exponentially Decaying Pulse  
FIGURE 2  
POWER DERATING  
NOTE: This PPP versus time graph allows the designer to use these parts over a broad  
power spectrum using the guidelines illustrated in MicroNote 104 on  
www.microsemi.com. Aircraft transients are described with exponential decaying  
waveforms. For suppression of square-wave impulses, derate power and current to  
66% of that for exponential decay shown in Figure 1.  
INSTALLATION  
Correct  
Incorrect  
TVS devices used across power lines are  
subject to relatively high magnitude surge  
currents and are more prone to adverse  
parasitic inductance effects in the  
mounting leads. Minimizing the shunt  
path of the lead inductance and their  
V = -Ldi/dt effects will optimize the TVS  
effectiveness.  
Examples of optimum  
installation and poor installation are  
illustrated in Figures 3 to 6. Figure 3  
illustrates minimal parasitic inductance  
with attachment at end of device.  
Inductive voltage drop is across input  
leads. Virtually no “overshoot” voltage  
results as illustrated with Figure 4. The  
loss of effectiveness in protection caused  
by excessive parasitic inductance is  
illustrated in Figures 5 and 6. Also see  
MicroNote 111 for further information on  
“Parasitic Lead Inductance in TVS”.  
FIGURE 3  
FIGURE 5  
FIGURE 4  
FIGURE 6  
RF01012 Rev A, August 2010  
High Reliability Product Group  
Page 4 of 5  
TECHNICAL DATA SHEET  
Gort Road Business Park, Ennis, Co. Clare, Ireland.  
Tel: +353 (0) 65 6840044, Fax: +353 (0) 65 6822298  
6 Lake Street, Lawrence, MA 01841  
Tel: 1-800-446-1158 / (978) 794-1666, Fax: (978) 6890803  
Website: http://www.microsemi.com  
___________________________________________________________________________________________________________________________________  
GRAPHS Cond.  
t
t time  
t time  
t - Time  
Note: frequency is 1MHz  
FIGURE 7 Waveform 3  
FIGURE 8 Waveform 4  
FIGURE 9 Waveform 5A  
NOTE: The 1MHz damped oscillatory waveform (3) has an effective pulse width of 4 s. Equivalent peak pulse power at each of  
the pulse widths represented in RTCA/DO-160E for waveforms 3, 4 and 5A (above) have been determined referencing Figure 1  
herein as well as MicroNotes 104 and 120 (found on www.microsemi.com) and are listed below.  
WAVEFORM  
NUMBER  
PULSE  
WIDTH  
PEAK PULSE  
POWER  
Peak Pulse Current Conversion Factor  
* from Rated IPP at 6.4/69 µs  
kW  
340  
100  
70  
s  
4
6.4/69  
40/120  
3
4
5A  
3.40x  
1.00x  
0.70x  
* Multiply by the conversion factor shown with reference to the maximum rated IPP in the Electrical Characteristics Table on page 2.  
NOTE 1:  
NOTE 2:  
High current fast rise-time transients of 250 ns or less can more than triple the VC from parasitic inductance effects  
(V= -Ldi/dt) compared to the clamping voltage shown in the initial Electrical Characteristics as also described in  
Figures 5 and 6 herein  
Also see MicroNotes 127, 130, and 132 on www.microsemi.com for further information on Transient Voltage  
Suppressors with reference to aircraft industry specification RTCA/DO-160E.  
RF01012 Rev A, August 2010  
High Reliability Product Group  
Page 5 of 5  

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