MX6100A [MICROSEMI]

Rectifier Diode, 7 Element, 0.3A, Silicon, HERMETIC SEALED, CERAMIC PACKAGE-14;
MX6100A
型号: MX6100A
厂家: Microsemi    Microsemi
描述:

Rectifier Diode, 7 Element, 0.3A, Silicon, HERMETIC SEALED, CERAMIC PACKAGE-14

文件: 总2页 (文件大小:61K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
6100A  
Isolated Diode Array with  
HiRel MQ, MX, MV, and SP Screening Options  
S C O T T S D A L E D I V I S I O N  
DESCRIPTION  
APPEARANCE  
These low capacitance diode arrays are multiple, discrete, isolated junctions  
fabricated by a planar process and mounted in a 14-PIN package for use as steering  
diodes protecting up to seven I/O ports from ESD, EFT, or surge by directing them  
either to the positive side of the power supply line or to ground (see figure 1). An  
external TVS diode may be added between the positive supply line and ground to  
prevent overvoltage on the supply rail. They may also be used in fast switching core-  
driver applications. This includes computers and peripheral equipment such as  
magnetic cores, thin-film memories, plated-wire memories, etc., as well as decoding  
or encoding applications. These arrays offer many advantages of integrated circuits  
such as high-density packaging and improved reliability. This is a result of fewer  
pick and place operations, smaller footprint, smaller weight, and elimination of  
various discrete packages that may not be as user friendly in PC board mounting.  
IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com  
14-PIN Ceramic  
Flat Pack  
FEATURES  
APPLICATIONS / BENEFITS  
High Frequency Data Lines  
RS-232 & RS-422 Interface Networks  
Ethernet: 10 Base T  
Computer I/O Ports  
LAN  
Switching Core Drivers  
IEC 61000-4 Compatible (See Circuit in  
Figure 1)  
Hermetic Ceramic Package  
Isolated Diodes to Eliminate Cross-Talk Voltages  
High Breakdown Voltage VBR > 75 V at 5 μA  
Low Leakage IR< 100 nA at 40 V  
Low Capacitance C < 4.0 pF  
Switching Speeds less than 10 ns  
Options for screening in accordance with MIL-PRF-  
19500/474 for JAN, JANTX, JANTXV, and JANS are  
available by adding MQ, MX, MV, or SP prefixes  
respectively to part numbers. For example, designate  
MX6100A for a JANTX screen.  
61000-4-2 (ESD): Air 15 kV, contact – 8 kV  
61000-4-4 (EFT): 40 A – 5/50 ns  
61000-4-5 (surge): 12 A, 8/20 µs  
MAXIMUM RATINGS  
MECHANICAL AND PACKAGING  
14-PIN Ceramic Flat Pack  
Reverse Breakdown Voltage of 75 Vdc (Note 1 & 2)  
Continuous Forward Current of 300 mA dc (Note 1 & 3)  
Peak Surge Current (tp=1/120 s) of 500 mA dc (Note 1)  
400 mW Power Dissipation per Junction @ 25oC  
Weight 0.29 grams (approximate)  
Marking: Logo, part number, date code and  
dot identifying pin #1  
Carrier Tubes; 19 pcs (standard)  
500 mW Power Dissipation per Package @ 25oC (Note 4)  
Operating Junction Temperature range –65 to +150oC  
Storage Temperature range of –65 to +150oC  
NOTE 1: Each Diode  
NOTE 2: Pulsed: PW = 100 ms max; duty cycle <20%  
NOTE 3: Derate at 2.4 mA/oC above +25oC  
NOTE 4: Derate at 4.0 mW/oC above +25oC  
ELECTRICAL CHARACTERISTICS (Per Diode) @ 25oC unless otherwise specified  
MAXIMUM  
REVERSE  
RECOVERY TIME  
trr  
MAXIMUM  
FORWARD  
VOLTAGE  
MAXIMUM  
FORWARD  
RECOVERY  
TIME  
MAXIMUM  
FORWARD  
VOLTAGE  
MATCH  
MAXIMUM  
REVERSE  
CURRENT  
MAXIMUM  
REVERSE  
CURRENT  
MAXIMUM  
CAPACITANCE  
(PIN TO PIN)  
I = IR = 10 mAdc  
F
V
F1  
Ct  
t
fr  
i
= 1 mAdc  
V
F5  
rr  
I = 100 mA  
I
I
VR = 0 V  
F = 1 MHz  
pF  
F
R1  
R2  
I = 100 mA  
R = 100 ohms  
I = 10 mA  
PART  
NUMBER  
(Note 1)  
V
VR = 40 V  
µA  
VR = 20 V  
nA  
F
L
F
ns  
ns  
mV  
6100A  
1
0.1  
25  
4.0  
15  
10  
5
NOTE 1: Pulsed: PW = 300 µs +/- 50 µs, duty cycle <2%, 90 µs after leading edge.  
Copyright © 2007  
3-27-2007  
Microsemi  
Page 1  
Scottsdale Division  
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503  
6100A  
Isolated Diode Array with  
HiRel MQ, MX, MV, and SP Screening Options  
S C O T T S D A L E D I V I S I O N  
SYMBOLS & DEFINITIONS  
Symbol  
VBR  
DEFINITION  
Minimum Breakdown Voltage: The minimum voltage the device will exhibit at a specified current.  
Maximum Forward Voltage: The maximum forward voltage the device will exhibit at a specified current.  
VF  
Maximum Leakage Current: The maximum leakage current that will flow at the specified voltage and  
temperature.  
IR  
Capacitance: The capacitance of the TVS as defined @ 0 volts at a frequency of 1 MHz and stated in  
picofarads.  
Ct  
SCHEMATIC  
PACKAGE DIMENSIONS  
CIRCUIT  
Supply rail (+VCC)  
Symbol  
Inches  
Max  
Millimeters  
I/O Port  
Min  
Min  
Max  
9.91  
6.60  
2.41  
9.40  
BL  
BW  
CH  
LL  
.390  
.260  
.095  
.370  
.235  
.045  
.250  
.005  
.026  
5.97  
1.14  
6.35  
0.13  
0.66  
GND (or -VCC)  
LO  
LO  
.045  
1.14  
2
Steering Diode Application  
LS  
LT  
LU  
LW  
.050 BSC  
1.27 BSC  
FIGURE 1  
.003  
.006  
.280  
.019  
0.08  
0.15  
7.11  
0.48  
.010  
0.25  
Copyright © 2007  
3-27-2007  
Microsemi  
Page 2  
Scottsdale Division  
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503  

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