SG7905 [MICROSEMI]
Negative Fixed Voltage Regulator;
| 型号： | SG7905 |
| 厂家： | 
Microsemi |
| 描述： | Negative Fixed Voltage Regulator |
| 文件： | 总12页 (文件大小：1745K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SG79xxA/SG79xx
Negative Fixed Voltage Regulator
DESCRIPTION
FEATURES
.
Output Voltage Set Internally to
±1.5% on SG79xxA
The SG79xxA/SG79xx series of negative control have been designed into these units
regulators offer self-contained, fixed- and since these regulators require only a
voltage capability with up to 1.5A of load single output capacitor (SG79xx series) or a
current and input voltage up to -30V. With capacitor and 5mA minimum load (SG120
a variety of output voltages this regulator series) for satisfactory performance, ease of
series is an optimum complement to the application is assured.
.
.
.
.
.
.
Output Current up to 1.5A
Excellent Line and Load Regulation
Foldback Current Limiting
Thermal Overload Protection
Voltages Available: -5V, -12V, -15V
Contact Factory for Other Voltage
Options
SG7800A/SG7800 positive three terminal Although designed as fixed-voltage
regulators.
regulators, the output voltage can be
.
Available in Surface Mount Package
These units feature a unique band gap increased through the use of a simple
reference which allows the SG79xxA voltage divider. The low quiescent drain
series to be specified with an output current of the device insures good regulation
HIGH RELIABILITY FEATURES
voltage tolerance of ±1.5%.
The SG79xxA versions also offer much These devices are available in hermetically
improved line regulation characteristics.
sealed TO-257 (both case grounded ‘G’ and
All protective features of thermal isolated ‘IG’), TO-3, TO-39, and LCC
when this method is used.
. Available to MIL-STD - 883, ¶ 1.2.1
. MIL-M38510/11501BXA - SG7905T-JAN
. MIL-M38510/11505BYA - SG7905K-JAN
. MIL-M38510/11502BXA - SG7912T-JAN
. MIL-M38510/11506BYA - SG7912K-JAN
. MIL-M38510/11503BXA - SG7915T-JAN
. MIL-M38510/11507BYA - SG7915K-JAN
. MIL-M38510/11508BYA - SG7924K-JAN
. MSC-AMS level "S" Processing Available
. Available to DSCC
shutdown, current limiting, and safe-area
packages.
Standard Microcircuit Drawing (SMD)
SCHEMATIC DIAGRAM
January 2015 Rev1.7
www.microsemi.com
1
© 2015 Microsemi Corporation
ABSOLUTE MAXIMUM RATINGSte 1)
Units
Parameter
Value
Device Output Voltage
-5, -12, -15
V
V
Input Voltage
-35, -40 (VOUT ≤ -15V)
Input Voltage Differential (Output Shorted to Ground)
Operating Junction Temperature
Storage Temperature Range
Lead Temperature (Soldering 10 seconds)
35
150
V
°C
°C
°C
-65 to 150
300
Note: Exceeding these ratings could cause damage to the device. All voltages are with respect to Ground. Currents are positive into, negative out
of specified terminal.
THERMAL DATA
Units
Value
Parameter
K Package TO-3 3-Pin Metal Can
Thermal Resistance-Junction to Case, θJC
Thermal Resistance-Junction to Ambient, θJA
3
°C/W
°C/W
35
T Package TO-39 3-Pin Metal Can
Thermal Resistance-Junction to Case, θJC
Thermal Resistance-Junction to Ambient, θJA
15
°C/W
°C/W
120
G Package TO-257 3-Pin Hermetic
Thermal Resistance-Junction to Case, θJC
Thermal Resistance-Junction to Ambient, θJA
3.5
42
°C/W
°C/W
IG Package TO-257 3-Pin Hermetic (Isolated)
Thermal Resistance-Junction to Case, θJC
Thermal Resistance-Junction to Ambient, θJA
4
°C/W
°C/W
42
L Package Leadless Chip Carrier 20-Pin Ceramic
Thermal Resistance-Junction to Case, θJC
Thermal Resistance-Junction to Ambient, θJA
35
°C/W
°C/W
120
Notes:
1: Junction Temperature Calculation: TJ = TA + (PD x JA).
2: The JA numbers are guidelines for the thermal performance of the device/pc-board system. All of the above assume no ambient airflow.
2
CHARACTERISTIC CURVES
Figure 2 – Quiescent Current vs. Load
Figure 1 – Maximum Average Power Dissipation
Figure 3 – Temperature Coefficient
Figure 4 – Short-circuit Current vs. VIN
3
CHARACTERISTIC CURVES (continued)
Figure 5 – Quiescent Current vs. VIN
Figure 6 – Short-circuit Current vs. VIN
100k
1k
10k
-VIN - (V)
Figure 8 – Ripple Rejection vs. Frequency
Figure 7 – Dropout Characteristics
4
APPLICATION INFORMATION
Figure 10 – Circuit for Increasing Output Voltage
Figure 9 – Fixed Output Regulator
Note: C3 optional for improved transient response and
ripple rejection.
Note: 1. C1 is required only if regulator is separated from
rectifier filter.
2. Both C1 and C2 should be low E.S.R. types such
as solid tantalum. If aluminum electrolytic
capacitors are used, at least 10 times values
shown should be selected.
VOUT V
REGULATOR R R
1
2
R1
3. If large output capacities are used, the regulators
must be protected from momentary input shorts. A
high current diode is indicated from output to input.
V
REG
R2
15mA
RECOMMENDED OPERATING CONDITIONS
SG79xx / 79xxA
Parameter
Units
Min
-55
Typ
Max
150
Operating Junction Temperature Range (Note 2)
°C
Note 2: Range over which the device is functional.
5
ELECTRICAL CHARACTERISTICS
Unless otherwise specified, these specifications apply over the operating ambient temperatures for SG7905A / SG7905 with
-55°C < TA < 125°C, VIN = -10V, IO = 500mA for the K, G, and IG - Power Packages, IO = 100mA for the T and L packages, CIN = 2µF,
and COUT = 1µF. Low duty cycle pulse testing techniques are used which maintains junction and case temperatures equal to the ambient
temperature.
SG7905A
Typ
SG7905
Typ
Units
Parameter
Test Conditions
Min
Max
-5.05
25
Min
Max
-5.20
50
TJ = 25°C
Output Voltage
-4.95
-5.00
5
-4.80
-5.00
3
V
VIN = -7.5V to -25V, TJ = 25°C
mV
mV
mV
mV
mV
Line Regulation (Note 1)
VIN = -8V to -12V, TJ = 25°C
3
12
75
25
30
1
25
Power Pkgs: IO = 5mA to 1.5A, TJ = 25°C
IO = 250mA to 750mA, TJ = 25°C
T – Pkg: IO = 5mA to 500mA, TJ = 250°C
15
15
5
15
15
5
100
25
Load Regulation (Note 1)
100
VIN = -8V to -20V
Power Pkgs: IO = 5mA to 1.0A, P < 20W
-4.85
-4.85
-5.00
-5.00
-5.15
-5.15
-4.70
-4.70
-5.00
-5.00
-5.30
-5.30
V
V
Total Output Voltage
Tolerance
VIN = -8V to -20V
T – Pkg: IO = 5mA to 500mA, P < 20W
Over Temperature Range
TJ = 25°C
2.5
2.0
1.3
0.5
0.5
2.5
2.0
1.3
0.5
0.5
mA
mA
mA
mA
mA
Quiescent Current
With Line: VIN = -8V to -25V
With Load: IO = 5mA to 1.0A (Power Pkgs.)
Quiescent Current Change
IO = 5mA to 500mA (T)
∆VO = 100mV, TJ = 25°C
Power Pkgs: IO = 1.0A, T-Pkg: IO = 500mA
Dropout Voltage
1.1
2.3
3.3
1.1
2.3
3.3
V
A
Power Pkgs: TJ = 25°C
1.5
0.5
1.5
0.5
Peak Output Current
T – Pkg: TJ = 25°C
1.4
1.2
0.6
1.4
1.2
0.6
A
A
Power Pkgs: VIN = -35V, TJ = 25°C
T – Pkg: VIN = -35V, TJ = 25°C
∆VIN = 10V, f = 120Hz, TJ = 25°C
f = 10Hz to 100kHz (Note 2)
1000 hours @ TJ = 125°C
IO = 5mA
Short Circuit Current
A
Ripple Rejection
54
54
dB
µV/V
mV
Output Noise Voltage (rms)
Long Term Stability
Thermal Shutdown
25
20
80
25
20
80
175
175
°C
Notes 1: All regulation tests are made at constant junction temperature with low duty cycle testing.
2: This test is guaranteed but is not tested in production.
6
ELECTRICAL CHARACTERISTICS (continued)
Unless otherwise specified, these specifications apply over the operating ambient temperatures for SG7912A / SG7912 with
-55°C < TA < 125°C, VIN = -19V, IO = 500mA for the K, G, and IG - Power Packages, IO = 100mA for the T and L packages, CIN = 2µF,
and COUT = 1µF. Low duty cycle pulse testing techniques are used which maintains junction and case temperatures equal to the ambient
temperature.
SG7912A
Typ
SG7912
Typ
Units
Parameter
Output Voltage
Test Conditions
Min
Max
-12.2
60
Min
Max
-12.5
120
60
TJ = 25°C
-11.8
-12.0
4
-11.5
-12.0
10
3
V
VIN = -14.5V to -30V, TJ = 25°C
mV
mV
mV
mV
mV
Line Regulation (Note 1)
VIN = -16V to -22V, TJ = 25°C
3
30
Power Pkgs: IO = 5mA to 1.5A, TJ = 25°C
IO = 250mA to 750mA, TJ = 25°C
T – Pkg: IO = 5mA to 500mA, TJ = 25°C
20
10
10
90
12
10
10
120
60
40
Load Regulation (Note 1)
40
240
VIN = -14.5V to -27V
Power Pkgs: IO = 5mA to 1.0A, P < 20W
-11.7
-11.7
-12.0
-12.0
-12.3
-12.3
-11.4
-11.4
-12.0
-12.0
-12.6
-12.6
V
V
Total Output Voltage
Tolerance
VIN = -14.5V to -27V
T – Pkg: IO = 5mA to 500mA, P < 2W
Over Temperature Range
TJ = 25°C
4
3
4
3
mA
mA
mA
Quiescent Current
1.0
1.0
With Line: VIN = -14.5V to -30V
With Load: IO = 5mA to 1.0A (Power Pkgs.)
IO = 5mA to 500mA (T)
Quiescent Current Change
0.5
0.5
0.5
0.5
mA
mA
∆VO = 100mV, TJ = 25°C
Power Pkgs: IO = 1.0A, T – Pkg: IO = 500mA
Dropout Voltage
1.1
2.3
1.1
2.3
V
Power Pkgs: TJ = 25°C
1.5
0.5
3.3
1.4
1.2
0.6
1.5
0.5
3.3
1.4
0.2
0.6
A
A
Peak Output Current
T – Pkg: TJ = 25°C
Power Pkgs: VIN = -35V, TJ = 25°C
T – Pkg: VIN = -35V, TJ = 25°C
∆VIN = 10V, f = 120Hz, TJ = 25°C
A
Short Circuit Current
A
Ripple Rejection
54
54
dB
µV/V
mV
°C
Output Noise Voltage (rms)
Long Term Stability
Thermal Shutdown
f = 10Hz to 100kHz (note 2)
1000 hours @ TJ = 125°C
IO = 5mA
25
60
80
80
25
60
175
175
Notes 1: All regulation tests are made at constant junction temperature with low duty cycle testing.
2: This test is guaranteed but is not tested in production.
7
ELECTRICAL CHARACTERISTICS (continued)
Unless otherwise specified, these specifications apply over the operating ambient temperatures for SG7915A / SG7915 with
-55°C < TA < 125°C, VIN = -23V, IO = 500mA for the K, G, and IG - Power Packages, IO = 100mA for the T and L packages, CIN = 2µF,
and COUT = 1µF. Low duty cycle pulse testing techniques are used which maintains junction and case temperatures equal to the ambient
temperature.
SG7915A
Typ
SG7915
Typ
Parameter
Output Voltage
Test Conditions
Units
Min
Max
-15.2
75
Min
Max
-15.6
150
TJ = 25°C
-14.8
-15.0
5
-14.4
-15.0
11
V
VIN = -17.5V to -30V, TJ = 25°C
mV
Line Regulation (Note 1)
Load Regulation (Note 1)
VIN = -20V to -25V, TJ = 25°C
3
30
4
40
100
50
3
12
4
75
mV
mV
mV
mV
Power Pkgs: IO = 5mA to 1.5A, TJ = 25°C
IO = 250mA to 750mA, TJ = 25°C
T – Pkg: IO = 5mA to 500mA, TJ = 25°C
150
75
10
50
10
240
VIN = -18.5V to -30V
Power Pkgs: IO = 5mA to 1.0A, P < 20W
VIN = -18.5V to -30V
T – Pkg: IO = 5mA to 500mA, P < 2W
-14.6
-14.6
-15.0
-15.0
-15.4 -14.25 -15.00 -15.75
-15.4 -14.25 -15.00 -15.75
V
V
Total Output Voltage
Tolerance
Over Temperature Range
TJ = 25°C
4
4
mA
mA
mA
mA
mA
Quiescent Current
3
3
With Line: VIN = -18.5V to -30V
With Load: IO = 5mA to 1.0A (Power Pkgs)
IO = 5mA to 500mA (T)
1.0
0.5
0.5
1.0
0.5
0.5
Quiescent Current Change
∆VO = 100mV, TJ = 25°C
Power Pkgs: IO = 1.0A, T – Pkg: IO = 500mA
Dropout Voltage
1.1
2.3
1.1
2.3
V
Power Pkgs: TJ = 25°C
1.5
0.5
3.3
1.4
1.2
0.6
1.5
0.5
3.3
1.4
1.2
0.6
A
A
A
A
Peak Output Current
T – Pkg: TJ = 25°C
Power Pkgs: VIN = -35V, TJ = 25°C
T – Pkg: VIN = -35V, TJ = 25°C
Short Circuit Current
∆VIN = 10V, f = 120Hz, TJ = 25°C
Ripple Rejection
54
54
dB
µV/V
mV
°C
Output Noise Voltage (rms)
Long Term Stability
Thermal Shutdown
f = 10Hz to 100kHz (note 2)
1000 hours @ TJ = 125°C
IO = 5mA
80
25
60
80
25
60
175
175
Notes 1: All regulation tests are made at constant junction temperature with low duty cycle testing.
2: This test is guaranteed but is not tested in production.
8
CONNECTION DIAGRAMS & ORDERING INFORMATION (See Notes Below)
Ambient
Package
Part No.
Connection Diagram
Temperature Range
-55°C to 125°C
-55°C to 125°C
-55°C to 125°C
-55°C to 125°C
-55°C to 125°C
-55°C to 125°C
-55°C to 125°C
-55°C to 125°C
-55°C to 125°C
-55°C to 125°C
-55°C to 125°C
-55°C to 125°C
-55°C to 125°C
-55°C to 125°C
-55°C to 125°C
-55°C to 125°C
-55°C to 125°C
-55°C to 125°C
-55°C to 125°C
-55°C to 125°C
-55°C to 125°C
-55°C to 125°C
-55°C to 125°C
-55°C to 125°C
-55°C to 125°C
-55°C to 125°C
-55°C to 125°C
-55°C to 125°C
-55°C to 125°C
-55°C to 125°C
-55°C to 125°C
-55°C to 125°C
SG79xxAK-883B
SG7905AK-DESC
SG7912AK-DESC
SG7915AK-DESC
SG79xxAK
SG79xxK-883B
SG7905K-JAN
SG7912K-JAN
SG7915K-JAN
SG79xxK
SG79xxAT-883B
SG7905AT-DESC
SG7912AT-DESC
SG7915AT-DESC
SG79xxAT
SG79xxT-883B
SG7905T-JAN
SG7912T-JAN
SG7915T-JAN
SG79xxT
SG79xxAIG-883B
SG7905AIG-DESC
SG7912AIG-DESC
SG7915AIG-DESC
SG79xxAIG
SG79xxIG-883B
SG79xxIG
SG79xxL-883B
SG79xxL
GND
1
2
3-Terminal TO-3 Metal Can
K – Package
VOUT
Case is VIN
VOUT
2
3-Pin TO-39 Metal Can
T – Package
VIN
1
3
GND
Case is VIN
VOUT
3-Pin Hermetic TO-257
IG – Package (Isolated)
VIN
GROUND
3
2
1
20
19
4
18
17
SG7905AL-DESC
SG7912AL-DESC
SG7912AL-DESC
VO
VO
N.C.
5
6
7
8
GROUND
N.C.
20-Pin Ceramic Leadless Chip
Carrier
L – Package
16
15
N.C.
VO SENSE
N.C.
GROUND
N.C.
14
9
10
11
12
13
See Notes 5 & 6
SG79xxAG-883B
SG7905AG-DESC
SG7912AG-DESC
SG7915AG-DESC
SG79xxAG
-55°C to 125°C
-55°C to 125°C
-55°C to 125°C
-55°C to 125°C
-55°C to 125°C
-55°C to 125°C
-55°C to 125°C
VOUT
VIN
3-Pin Hermetic TO-257
G – Package (Case is VIN)
GROUND
Case is VIN
SG79xxG-883B
SG79xxG
Notes
1: Contact factory for JAN and DESC product availability.
2: All parts are viewed from the top.
3: “xx” to be replaced by output voltage of specific fixed regulator.
4: Some products will be available in hermetic flat pack (F). Consult factory for price and availability.
5: Both inputs and outputs must be externally connected together at the device terminals.
6: For normal operation, the VO SENSE pin must be externally connected to the load.
9
PACKAGE OUTLINE DIMENSIONS
Controlling dimensions are in inches, metric equivalents are shown for general information.
MILLIMETERS
INCHES
D
Dim
MIN
6.86
MAX
7.62
MIN
MAX
0.300
1.197
0.043
0.775
0.675
0.440
0.225
0.080
0.161
0.480
0.188
0.525
A
L
A
q
0.270
1.177
0.038
0.765
0.655
0.420
0.205
0.060
0.151
0.425
0.131
0.495
29.90
0.97
30.40
1.09
F
b
b
D
S
19.43
16.64
10.67
5.21
19.68
17.14
11.18
5.72
e
q
e1
F
S
1.52
2.03
R
3.84
4.09
fp
L
fp
R1
2
1
10.79
3.33
12.19
4.78
e
R1
R
e1
12.57
13.34
Note: Dimensions do not include protrusions; these shall not
exceed 0.155 mm (0.006″) on any side. Lead dimension shall
not include solder coverage.
Figure 11 · K 3-Pin Metal Can TO-3
MILLIMETERS
INCHES
MIN
Dim
MIN
4.19
0.41
0.41
8.89
8.13
MAX
4.70
0.48
0.53
9.40
8.51
MAX
0.185
0.019
0.021
0.370
0.335
0.165
0.016
0.016
0.350
0.320
A
b
b1
D
D1
e
e1
F
k
k1
L
L1
Q
α
D
D1
Q
e
A
F
5.08 BSC
2.54 Typ
0.200 BSC
0.100 Typ
b
2
-
1.02
0.86
1.14
14.48
1.27
-
0.040
0.034
0.045
0.570
0.050
L1
e1
0.71
0.74
12.70
-
0.028
0.029
0.500
-
1
3
L
k
α
90° Typ
45° Typ
90° Typ
45° Typ
k1
* Lead Coplanarity
b1
Note: Dimensions do not include protrusions; these shall
not exceed 0.155 mm (0.006″) on any side. Lead dimension
shall not include solder coverage.
Figure 12 · T 3-Pin Metal Can TO-39
10
PACKAGE OUTLINE DIMENSIONS (continued)
MILLIMETERS
INCHES
Dim
MIN
4.70
0.89
2.92
0.71
16.38
10.41
MAX
5.21
MIN
MAX
0.205
0.045
0.125
0.032
0.660
0.430
A
A1
A2
b
0.185
0.035
0.115
0.027
0.645
0.410
E
1.14
A
3.18
V
0.081
16.76
10.92
P
Z
D
A1
D1*
e
0.100 BSC
2.54 BSC
D
O
E*
H
10.41
10.67
0.50
0.410
0.420
0.020
D1
L
12.70
13.39
3.56
0.500
0.527
0.140
J
O
P
13.64
3.81
0.10
5.38
0.537
0.150
0.004
0.212
H
L
J
b
V
5.13
0.202
0.055 Typ
Z
1.40 Typ
VIN GND VOUT
A2
*Excludes Weld Fillet Around Lid.
e
Note: Dimensions do not include protrusions; these shall not
exceed 0.155 mm (0.006″) on any side. Lead dimension shall
not include solder coverage.
Figure 13 · G/IG 3-Pin Hermetic TO-257
E3
D
MILLIMETERS
MIN MAX
9.14
8.128
INCHES
Dim
MIN
MAX
0.360
0.320
D, E
E3
e
8.64
-
0.340
-
E
1.270 BSC
0.635 Typ
0.050 BSC
0.025 Typ
B1
L
1.02
1.52
0.040
0.060
0.090
A
1.626
2.286
0.064
A
L2
L
h
1.016 Typ
0.040 Typ
8
A1
A1
A2
L2
B3
1.372
-
1.68
1.168
2.41
0.054
-
0.066
0.046
0.95
3
1
1.91
0.075
0.203R
0.008R
Note: All exposed metalized area shall be gold plated
60 µ-inch minimum thickness over nickel plated unless
specified in purchase order. Lead dimension shall not include
13
h
solder coverage.
18
A2
B3
e
B1
Figure 14 · L 20-Pin Ceramic Leadless Chip Carrier
11
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Microsemi makes no warranty, representation, or guarantee regarding the information contained herein or
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SG79xxA/SG79xx-1.7/01.15
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