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UPFS120P SURFACE MOUNT P - CHANNEL MOSKEY
Prototype PCB
Part No.:   UPFS120P
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Description:   SURFACE MOUNT P - CHANNEL MOSKEY
File Size :   236 K    
Page : 3 Pages
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Maker   MICROSEMI [ MICROSEMI CORPORATION ]http://www.microsemi.com
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  UPFS120P Datasheet PDF page 2 UPFS120P Datasheet PDF page 3  
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580 Pleasant Street
Watertown, MA 02472
Phone:(617) 926-0404
F A X : (617) 924-1235
UPFS120P
Features
POWERMITE 3 Surface Mount Package
MOSFET with Schottky Rectifier for reverse voltage blocking
Single 3 leaded device replaces 2 individual components
Integral Heat Sink / Locking Tabs
Supplied in 16mm Tape and Reel – 6000 units/reel
Superior Low Thermal and Electrical capability
SURFACE MOUNT
P – CHANNEL
MOSKEY
Mechanical Characteristics
Footprint Area of 16.51 mm
2
Case: Molded Epoxy
Meets UL94VO at 1/8 inch
Weight: 72 milligrams
Lead and Mounting Temperatures: 260°C max for 10 seconds
Description
The MOSKEY combines a MOSFET with a Schottky Recti-
fier to provide reverse blocking capability in a single three
leaded package. This device is well suited for applications
such as battery chargers and switching where the intrinsic
source-drain diode is an undesirable feature.
Absolute Maximum Ratings at 25°C
RATING
Cathode-to-Source Voltage
Gate-to-Source Voltage
Cathode Current:
Continuous @ TA=25°C
Single Pulsed
Total Power Dissipation
Storage Temperature
Operating Temperature
SYMBOL
VKSS
VGS
IK
IKM
PD (1)
T stg
T op
VALUE
+/- 20
+/- 10
1.0
6.0
1.9
-55 to 150°C
-55 to 150°C
UNIT
Vdc
Vdc
Adc
Apk
Watts
°C
°C
Thermal Characteristics
Thermal Resistance:
Junction to Tab
(1)Junction-to-ambient
(2)Junction-to-ambient
Rjtab
Rja (1)
Rja (2)
20
65
150
°C/Watt
°C/Watt
°C/Watt
(1) Mounted on 2” square by 0.06’ thick FR4 board with a 1” x1” square 2 ounce copper pattern.
(2) Mounted on 0.06 thick FR4 board, using recommended footprint.
MSC 10-1-00
PRELIMINARY
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