UPGA301Ae3

Nanosecond SCR SWITCH

SCOTTSDALE DIVISION

DESCRIPTION

KEY FEATURES

WWW .

Microsemi

.C

OM

The UPGA301Ae3 is Designed for

high current narrow-pulse switching

applications where size and current

handling capability are critical.

These devices may be triggered on

using low power logic drivers from

(+0.8 V at 200

μA).

Epoxy packaged, oxide passivated planar

SCR chips with metallurgic bonds on both

sides to achieve high reliability. Internal

wire bond connection allows high current

surge capability for narrow pulse

applications.

Very low thermal resistance package

Efficient heat path with integral

locking bottom metal tab

Full metallic bottom eliminates flux

entrapment

RoHS Compliant with e3 suffix

High speed switching capability

Compatible with high-speed insertion

Low profile height of 1 mm

APPLICATIONS/BENEFITS

IMPORTANT:

For the most current data, consult

MICROSEMI’swebsite:http://www.microsemi.com

ABSOLUTE MAXIMUM RATINGS AT 25º C

(UNLESS OTHERWISE SPECIFIED)

Rating

Repetative peak Off-State Voltage

Peak On-State Current for 50 ns (max)

Peak Gate Current

Reverse Gate Voltage

Storage Temperature Range

Operating Temperature Range

Symbol

V

DRM

I

TSM

I

GM

V

GR

Ts

T

J

Value

100

100

250

5

-50 to 150

0 to 125

Unit

V

A

mA

V

ºC

ºC

Reference Microsemi MicroNote 601

and 602

THERMAL CHARACTERISTICS

(UNLESS OTHERWISE SPECIFIED)

Thermal Resistance

Junction-to-Case (Anode Bottom)

Junction-to-Ambient (1)

R

θJC

R

θJA

4.0

65

ºC/Watt

ºC/Watt

Nanosecond SCR switch for reliable

high current pulse generators,

modulators and photo-flash

quenching

Logic drive capability (0.8V, 200μA)

Ideal for Laser Range finder and

Camera Applications

Ideal for Automotive Collision

Avoidance Applications

MECHANICAL & PACKAGING

(1)When mounted on 0.06’ thick FR4 board with 2 oz copper FR4 board with recommended footprint

•

CASE: Void-free transfer molded

thermosetting epoxy compound

meeting UL94V-0

•

FINISH: Annealed matte-Tin plating

over copper and readily solderable per

MIL-STD-750 method 2026 (consult

factory for Tin-Lead plating)

•

POLARITY: See figure (left)

•

MARKING: 301A•

•

WEIGHT: 0.072 gram (approx.)

•

Package dimensions on last page

•

Tape & Reel option: 16 mm tape per

Standard EIA-481-B, 5000 on 13” reel

Small foot print

UPGA301A

UPGA301A

.

190 X .270 inches

1:1 Actual size

See mounting pad details on pg 3

Copyright

©

2005

7-17-05, Rev D

Microsemi

8700 E. Thomas Rd. PO Box 1390, Scottsdale Arizona 85252, 480-941-6300, Fax: 480-947-1503

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