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UPGA301AE3 Nanosecond SCR SWITCH
Prototype PCB
Part No.:   UPGA301AE3
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Description:   Nanosecond SCR SWITCH
File Size :   154 K    
Page : 4 Pages
Logo:   
Maker   MICROSEMI [ MICROSEMI CORPORATION ]http://www.microsemi.com
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  UPGA301AE3 Datasheet PDF page 2 UPGA301AE3 Datasheet PDF page 3 UPGA301AE3 Datasheet PDF page 4  
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UPGA301Ae3
Nanosecond SCR SWITCH
SCOTTSDALE DIVISION
DESCRIPTION
KEY FEATURES
WWW .
Microsemi
.C
OM
The UPGA301Ae3 is Designed for
high current narrow-pulse switching
applications where size and current
handling capability are critical.
These devices may be triggered on
using low power logic drivers from
(+0.8 V at 200
μA).
Epoxy packaged, oxide passivated planar
SCR chips with metallurgic bonds on both
sides to achieve high reliability. Internal
wire bond connection allows high current
surge capability for narrow pulse
applications.
Very low thermal resistance package
Efficient heat path with integral
locking bottom metal tab
Full metallic bottom eliminates flux
entrapment
RoHS Compliant with e3 suffix
High speed switching capability
Compatible with high-speed insertion
Low profile height of 1 mm
APPLICATIONS/BENEFITS
IMPORTANT:
For the most current data, consult
MICROSEMI’swebsite:http://www.microsemi.com
ABSOLUTE MAXIMUM RATINGS AT 25º C
(UNLESS OTHERWISE SPECIFIED)
Rating
Repetative peak Off-State Voltage
Peak On-State Current for 50 ns (max)
Peak Gate Current
Reverse Gate Voltage
Storage Temperature Range
Operating Temperature Range
Symbol
V
DRM
I
TSM
I
GM
V
GR
Ts
T
J
Value
100
100
250
5
-50 to 150
0 to 125
Unit
V
A
mA
V
ºC
ºC
Reference Microsemi MicroNote 601
and 602
THERMAL CHARACTERISTICS
(UNLESS OTHERWISE SPECIFIED)
Thermal Resistance
Junction-to-Case (Anode Bottom)
Junction-to-Ambient (1)
R
θJC
R
θJA
4.0
65
ºC/Watt
ºC/Watt
Nanosecond SCR switch for reliable
high current pulse generators,
modulators and photo-flash
quenching
Logic drive capability (0.8V, 200μA)
Ideal for Laser Range finder and
Camera Applications
Ideal for Automotive Collision
Avoidance Applications
MECHANICAL & PACKAGING
(1)When mounted on 0.06’ thick FR4 board with 2 oz copper FR4 board with recommended footprint
CASE: Void-free transfer molded
thermosetting epoxy compound
meeting UL94V-0
FINISH: Annealed matte-Tin plating
over copper and readily solderable per
MIL-STD-750 method 2026 (consult
factory for Tin-Lead plating)
POLARITY: See figure (left)
MARKING: 301A•
WEIGHT: 0.072 gram (approx.)
Package dimensions on last page
Tape & Reel option: 16 mm tape per
Standard EIA-481-B, 5000 on 13” reel
Small foot print
UPGA301A
UPGA301A
.
190 X .270 inches
1:1 Actual size
See mounting pad details on pg 3
Copyright
©
2005
7-17-05, Rev D
Microsemi
8700 E. Thomas Rd. PO Box 1390, Scottsdale Arizona 85252, 480-941-6300, Fax: 480-947-1503
Page 1
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