AS5SS128K36DQCR-7.5L/XT [MICROSS]

Standard SRAM;
AS5SS128K36DQCR-7.5L/XT
型号: AS5SS128K36DQCR-7.5L/XT
厂家: MICROSS COMPONENTS    MICROSS COMPONENTS
描述:

Standard SRAM

静态存储器 内存集成电路
文件: 总20页 (文件大小:344K)
中文:  中文翻译
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SSRAM  
AS5SS128K36  
128K x 36 4Mb FLOW THROUGH ‘NO WAIT’  
STATE BUS SYNCHRONOUS SRAM  
FEATURES  
• Available in Mil-Temp*, Enhanced* & Industrial Ranges  
• 100 percent bus utilization  
• No wait cycles between Read and Write1  
• Internal self-timed write cycle  
• Individual Byte Write Control  
GENERAL DESCRIPTION  
TheAS5SS128K36 is a high-speed, low-power synchronous  
static RAM designed to provide a burstable, high-performance,  
“no wait” state device for networking and communication ap-  
plications. It is organized as 128K words by 36 bits fabricated  
with Micross’ advanced CMOS technology.  
• Single Read / Write control pin  
• Clock controlled, registered address, data and  
control  
• Interleaved or linear burst sequence control using  
MODE input  
Incorporating a ‘no waitstate feature, wait cycles are eliminated  
when the bus switches from read to write, or write to read.  
This device integrates a 2-bit burst counter, high-speed SRAM  
core, and high-drive capability outputs into a single monolithic  
circuit.  
• Three chip enables for simple depth expansion  
and address pipelining  
• Power down mode  
• Common data inputs and data outputs  
• CKE\ pin to enable clock and suspend operation  
• Power Supply: VDD 3.3V ± 5%, VDDQ 3.3V/2.5V ± 5%  
• JEDEC 100-Pin TQFP  
• TQFP in copper lead frame for superior thermal  
performance  
All synchronous inputs pass through registers are controlled by  
a positive-edge-triggered single clock input. Operations may  
be suspended and all synchronous inputs ignored when Clock  
Enable, CKE\ is HIGH. In this state the internal device will hold  
their previous values.  
All Read, Write and Deselect cycles are initiated by the ADV  
input. When the ADV is HIGH the internal burst counter is  
incremented. New external addresses can be loaded when  
ADV is LOW.  
• RoHs compliant options available  
Write cycles are internally self-timed and are initiated by the  
rising edge of the clock inputs and when WE\ is LOW. Separate  
byte enables allow individual bytes to be written. A burst mode  
pin (MODE) denes the order of the burst sequence. When tied  
HIGH, the interleaved burst sequence is selected. When tied  
LOW, the linear burst sequence is selected.  
*Consult factory for /XT and /ET products.  
FAST ACCESS TIME  
Symbol  
Parameter  
ClockAccessTime  
CycleTime  
Ͳ7.5  
7.5  
Ͳ8.5  
8.0  
10  
Units  
ns  
tKQ  
tKC  
8.5  
ns  
fMAX  
Frequency  
117  
100  
MHz  
NOTE 1: Otherwise known as (ZBL) Zero Bus Latency.  
For more products and information  
please visit our web site at  
www.micross.com  
Micross Components reserves the right to change products or specications without notice.  
AS5SS128K36  
Rev. 2.8 09/11  
1
SSRAM  
AS5SS128K36  
BLOCK DIAGRAM  
Micross Components reserves the right to change products or specications without notice.  
AS5SS128K36  
Rev. 2.8 09/11  
2
SSRAM  
AS5SS128K36  
PIN CONFIGURATIONS  
100-pin TQFP  
99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81  
100  
DQPc  
DQc  
DQc  
VDDQ  
Vss  
1
2
3
4
5
6
7
8
9
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
27  
28  
29  
30  
80  
79  
78  
77  
76  
75  
74  
73  
72  
71  
70  
69  
68  
67  
66  
65  
64  
63  
62  
61  
60  
59  
58  
57  
56  
55  
54  
53  
52  
51  
DQPb  
DQb  
DQb  
VDDQ  
Vss  
DQc  
DQc  
DQb  
DQb  
DQc  
DQc  
Vss  
DQb  
DQb  
Vss  
VDDQ  
DQc  
VDDQ  
DQb  
DQc  
NC  
DQb  
Vss  
NC  
VDD  
NC  
Vss  
VDD  
ZZ  
DQa  
DQa  
VDDQ  
Vss  
DQd  
DQd  
VDDQ  
Vss  
DQd  
DQa  
DQa  
DQd  
DQd  
DQd  
Vss  
DQa  
DQa  
Vss  
VDDQ  
VDDQ  
DQd  
DQd  
DQPd  
DQa  
DQa  
DQPa  
31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50  
SynchronousAddressInputs.These  
pinsmusttiedtothetwoLSBsofthe  
addressbus.  
SynchronousAddressInputs.ꢀꢀ  
SynchronousClock  
A0,A1  
CE\,CE2,CE2\ SynchronousChipEnable  
OE\ OutputEnable  
DQaꢀͲꢀDQd SynchronousDataInput/Output  
DQPaͲDQPd ParityDataI/O  
Aꢀ  
CLK  
ADV  
SynchronousBurstAddressAdvance  
BWa\,BWd\ SynchronousByteWriteEnable  
MODE  
VDD  
BurstSequenceModeSelection  
+3.3V/2.5VPowerSupply  
Ground  
WE\  
CKE\  
WriteEnable  
ClockEnable  
VSS  
VDDQ  
ZZ  
VSS  
NC  
Ground  
IsolatedOutputBufferSupply:3.3V/2.5V  
SnoozeEnable  
NotConnetcted  
Micross Components reserves the right to change products or specications without notice.  
AS5SS128K36  
Rev. 2.8 09/11  
3
SSRAM  
AS5SS128K36  
STATE DIAGRAM  
READ  
WRITE  
BEGIN  
BEGIN  
WRITE  
WRITE  
READ  
READ  
DS  
DS  
READ  
WRITE  
DESELECT  
READ  
BURST  
BURST  
WRITE  
BURST  
DS  
DS  
DS  
WRITE  
BURST  
BURST  
BURST  
WRITE  
BURST  
READ  
READ  
SYNCHRONOUS TRUTH TABLE 1  
Operation  
NotSelected  
NotSelected  
AddressUsed  
N/A  
OE\  
H
X
X
X
L
X
L
X
L
X
L
X
CE2  
X
H
X
X
H
X
H
X
H
X
H
X
X
CE2\  
X
X
H
X
L
X
L
X
L
ADV  
L
L
L
H
L
H
L
H
L
H
L
H
X
WE\  
X
X
X
X
H
X
H
X
L
X
BWx\  
OE\  
X
X
X
X
L
L
H
H
X
CKE\  
CLK  
ј
ј
ј
ј
ј
ј
ј
ј
ј
ј
ј
ј
ј
X
X
X
X
X
X
X
X
L
L
L
L
L
L
L
L
L
L
L
L
L
H
N/A  
N/A  
N/A  
NotSelected  
NotSelectedContinue  
BeginBurstRead  
ContinueBurstRead  
NOP/DummyRead  
DummyRead  
BeginBurstWrite  
ContinueBurstWrite  
NOP/WriteAbort  
WriteAbort  
ExternalAddress  
NextAddress  
ExternalAddress  
NextAddress  
ExternalAddress  
NextAddress  
N/A  
X
L
X
X
L
X
X
X
X
L
X
X
H
H
X
NextAddress  
CurrentAddress  
IgnoreClock  
X
Notes:  
1.Xmeans“Don’tCare.”ꢀ  
2.Therisingedgeofclockissymbolizedbyꢀј.  
3.Acontinuedeselectcyclecanonlybeenteredifadeselectedcycleisexcecutedfirst.  
4.WE\=Lmeanswriteoperationinwritetruthtable.ꢀꢀWE\=Hmeansreadoperationinwritetruthtable.  
5.Operationfinallydependsonstatusofasynchronouspins(ZZandOE\)  
Micross Components reserves the right to change products or specications without notice.  
AS5SS128K36  
Rev. 2.8 09/11  
4
SSRAM  
AS5SS128K36  
ASYNCHRONOUS TRUTH TABLE 1  
Function  
SleepMode  
ZZ  
H
L
OE\  
X
L
I/OStatus  
HighͲZ  
DQ  
HighͲZ  
Read  
L
H
Writeꢀꢀ  
Deselected  
Notes:  
L
L
X
X
Din,HighͲZ  
HighͲZ  
1.Xmeans“Don’tCare.”ꢀ  
2.Forwritecyclesfollowingreadcycles,theoutputbuffersmustbedisabledwithOE\,otherwisedatabuscontentionwilloccur.  
3.SleepModemeanspowerSleepModewherestandͲbycurrentdoesnotdependoncycletime.  
4.DeselectedmeanspowerSleepModewherestandͲbycurrenddependsoncycletime.  
WRITE TRUTH TABLE  
Operation  
WE\  
Bwa\  
BWb\  
BWc\  
BWd\  
Read  
H
L
L
L
L
L
L
X
L
H
H
H
L
X
H
L
H
H
L
X
H
H
L
H
L
X
H
H
H
L
WRITEBYTEa  
WRITEBYTEb  
WRITEBYTEc  
WRITEBYTEd  
WRITEALLBYTEs  
L
H
WRITEABORT/NOP  
Notes:  
H
H
H
1.Xmeans“Don’tCare.”ꢀ  
2.AllinputsinthistablemustbeetsetupandholdtimearoundtherisingedgeofCLK.  
INTERLEAVED BURST ADDRESS TABLE (MODE = VDD or NC)  
ExternalAddress 1stBurstAddress 2ndBurstAddress 3rdBurstAddress  
A1A0  
00  
A1A0  
01  
A1A0  
10  
A1A0  
11  
01  
00  
11  
10  
10  
11  
00  
01  
11  
10  
01  
00  
Micross Components reserves the right to change products or specications without notice.  
AS5SS128K36  
Rev. 2.8 09/11  
5
SSRAM  
AS5SS128K36  
LINEAR BURST ADDRESS TABLE (MODE = VSS)  
0,0  
A1', A0' = 1,1  
0,1  
1,0  
ABSOLUTE MAxIMUM RATINGS1  
Symbol  
TSTG  
Parameter  
StorageTemperature  
Value  
Unit  
oC  
ꢀͲ55to+150  
1.6  
PD  
PowerDissipation  
W
mA  
V
IOUT  
OutputCurrent(perI/O)  
100  
VIN,VOUT  
VIN  
–0.5toVDD+0.3  
ꢀͲ0.3to4.6  
VoltageRelativetoVssforI/OPins  
VoltageRelativetoVssforAddressandControlInputs  
V
Notes:  
1.StressgreaterthanthoselistedunderABSOLUTEMAXIMUMRATINGSmaycausepermanentdamagetothedevice.Thisisastressratingꢀ  
onlyandfunctionaloperationofthedeviceattheseoranyotherconditionsabovethoseindicatedintheoperationalsectionsofthisꢀ  
specificationisnotimplied.Exposuretoabsolutemaximumratingconditionsforextendedperiodsmayaffectreliability.  
2.Thisdevicecontainscircuitytoprotecttheinputsagainstdamageduetohighstaticvoltagesorelectricfields;however,precautionsmayꢀ  
betakentoavoidapplicationofanyvoltagehigherthanmaximumratedvoltagestothishighͲimpedancecircuit.  
3.ThisdevicecontainscircuitrythatwillensuretheoutputdevicesareinHighͲZatpowerup.  
OPERATING RANGE  
VDD  
VDDQ  
Range  
Industrial  
Enhanced  
Military  
AmbientTemperature  
ꢀͲ40oCto+85oC  
3.3V±5% 3.3V/2.5V±5%  
3.3V±5% 3.3V/2.5V±5%  
3.3V±5% 3.3V/2.5V±5%  
ꢀͲ40oCto+105oC  
ꢀͲ55oCto+125oC  
Micross Components reserves the right to change products or specications without notice.  
AS5SS128K36  
Rev. 2.8 09/11  
6
SSRAM  
AS5SS128K36  
DC ELECTRICAL CHARACTERISTICS (Over Operating Range)  
Symbol  
VOH  
Parameter  
TestConditions  
IOH=–4.0mA  
Min  
2.4  
ꢀͲ  
Max  
ꢀͲ  
Unit  
V
OutputHIGHVoltage  
OutputLOWVoltage  
InputHIGHVoltage  
InputLOWVoltage  
VOL  
VIH  
VIL  
ILI  
IOL=8.0mA  
0.4  
V
VDD+0.3  
2.0  
Ͳ0.3  
V
0.8  
5
V
1
VSSꢀчꢀVINꢀчꢀVDD  
InputLeakageCurrent  
OutputLeakageCurrent  
Ͳ5  
Ͳ5  
μA  
μA  
ILO  
VSSꢀчꢀVOUTꢀчꢀVDDQ,OE\=VIH  
5
POWER SUPPLY CHARACTERISTICS1 (Over Operating Range)  
Symbol  
Parameter  
TestCondition  
Max  
Unit  
DeviceSelected,OE\=ꢀ  
VIH,ZZꢀчꢀVIL,AllInputsꢀчꢀ  
0.2VorꢀшꢀVDDͲ0.2V,Cycleꢀ  
TimeꢀшꢀtKCmin.  
ACOperatingSupplyꢀ  
ICC  
225  
mA  
Current  
DeviceDeselected,ꢀ  
VDD=Max,AllInputsꢀчꢀVILꢀ  
orꢀшꢀVIH,ZZꢀꢀчꢀVIL,f=Max  
StandbyCurrentꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀ  
TTLInputs  
ISB  
100  
mA  
DeviceDeselected,ꢀ  
VDD=Max,VINꢀꢀчꢀVSSorꢀшꢀ  
VDDꢀͲꢀ0.2Vf=0  
StandbyCurrentꢀꢀꢀꢀꢀꢀꢀꢀꢀ  
CMOSInput  
ISB1  
ISB2  
75  
60  
mA  
mA  
ZZ>VIH  
SleepMode  
Note:  
1.MODEpinhasaninternalpullupandshouldbetiedtoVddorVss.Itexhibits±100ꢀʅAmaximumleakagecurrentwhentiedtoꢀчꢀVss+ꢀ  
0.2VorꢀшꢀVdd0.2V.  
Micross Components reserves the right to change products or specications without notice.  
AS5SS128K36  
Rev. 2.8 09/11  
7
SSRAM  
AS5SS128K36  
CAPACITANCE1,2  
Symbol  
Parameter  
InputCapacitance  
Conditions  
VIN=0V  
Max  
6
8
Min  
pF  
CIN  
CI/O  
VOUT=0V  
Input/OutputCapacitance  
pF  
Notes:  
1.Testedinitiallyandafteranydesignorprocesschangesthatmayaffecttheseparameters.  
2.Testconditions:Ta=25°C,f=1MHz,Vdd=3.3V.  
THERMAL RESISTANCE  
100TQFPꢀ  
Package  
Parameter  
ȺꢀJA  
Description  
ThermalResistanceꢀ  
(JunctiontoAmbient)  
ThermalResistanceꢀ  
(JunctiontoCase)  
TestConditions  
Unit  
Testconditionsfollowstandardtestꢀ  
methodsandproceduresforꢀ  
measuringthermalimpedance,perꢀ  
EIA/JESD51  
oC/W  
35.25  
oC/W  
ȺꢀJC  
7.96  
3.3V I/O AC TEST CONDITIONS  
Parameter  
InputPulseLevel  
InputRiseandFallTimes  
Unit  
0Vto3V  
1.5ns  
InputandOutputTimingandꢀ  
1.5V  
ReferenceLevel(VREF  
OutputLoad  
)
SeeFigures1&2  
AC TEST LOADS  
317 Ω  
+3.3V  
Zo= 50Ω  
OUTPUT  
OUTPUT  
5 pF  
50Ω  
Including  
jig and  
scope  
351 Ω  
1.5V  
Figure 1  
Figure 2  
Micross Components reserves the right to change products or specications without notice.  
AS5SS128K36  
Rev. 2.8 09/11  
8
SSRAM  
AS5SS128K36  
2.5V I/O AC TEST CONDITIONS  
Parameter  
InputPulseLevel  
InputRiseandFallTimes  
InputandOutputTimingꢀ  
andReferenceLevelꢀ  
OutputLoad  
Unit  
0Vto2.5V  
1.5ns  
1.25V  
SeeFigures3&4  
2.5V I/O OUTPUT LOAD EQUIVALENT  
1,667 Ω  
+2.5V  
ZO = 50Ω  
OUTPUT  
OUTPUT  
50Ω  
5 pF  
Including  
jig and  
scope  
1,538 Ω  
1.25V  
Figure 3  
Figure 4  
Micross Components reserves the right to change products or specications without notice.  
AS5SS128K36  
Rev. 2.8 09/11  
9
SSRAM  
AS5SS128K36  
READ/WRITE CYCLE SWITCHING CHARACTERISTICS1 (OverOperating Range)  
Ͳ7.5 Ͳ8  
Symbol  
Parameter  
Min  
Max  
Min  
Max  
Unit  
fMAX  
ClockFrequency  
ꢀͲ  
117  
ꢀͲ  
100  
ꢀͲ  
MHz  
tKC  
tKH  
tKL  
CycleTime  
ClockHighTime  
8.5  
2.5  
2.5  
ꢀͲ  
ꢀͲ  
ꢀͲ  
10  
4.0  
4.0  
ꢀͲ  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
cyc  
cyc  
ꢀͲ  
ClockLowTime  
ꢀͲ  
ꢀͲ  
tKQ  
ClockAccessTime  
7.5  
ꢀͲ  
8.0  
ꢀͲ  
2
tKQX  
ClockHightoOutputInvalid  
ClockHightoOutputLowͲZ  
ClockHightoOutputHighͲZ  
OutputEnabletoOutputValid  
OutputEnabletoOutputLowͲZ  
OutputEnabletoOutputHighͲZ  
AddressSetupTime  
2
2.5  
2.5  
ꢀͲ  
2,3  
tKQLZ  
2
ꢀͲ  
ꢀͲ  
2,3  
tKQHZ  
ꢀͲ  
4.0  
3.4  
ꢀͲ  
4.2  
3.6  
ꢀͲ  
tOEQ  
ꢀͲ  
ꢀͲ  
2,3  
tOELZ  
0
0
2,3  
tOEHZ  
ꢀͲ  
3.5  
ꢀͲ  
ꢀͲ  
3.5  
ꢀͲ  
tAS  
tWS  
tCES  
tSE  
1.5  
1.5  
1.5  
1.5  
1.5  
1.5  
0.5  
0.5  
0.5  
0.5  
0.5  
0.5  
ꢀͲ  
2.0  
2.0  
2.0  
2.0  
2.0  
2.0  
0.5  
0.5  
0.5  
0.5  
0.5  
0.5  
ꢀͲ  
Read/WriteSetupTime  
ChipEnableSetupTime  
ClockEnableSetupTime  
AddressAdvanceSetupTime  
DataSetupTime  
ꢀͲ  
ꢀͲ  
ꢀͲ  
ꢀͲ  
ꢀͲ  
ꢀͲ  
tADVS  
tDS  
ꢀͲ  
ꢀͲ  
ꢀͲ  
ꢀͲ  
tAH  
AddressHoldTime  
ꢀͲ  
ꢀͲ  
tHE  
ClockEnableHoldTime  
WriteHoldTime  
ꢀͲ  
ꢀͲ  
tWH  
tCEH  
tADVH  
tDH  
ꢀͲ  
ꢀͲ  
ChipEnableHoldTime  
AddressAdvanceHoldTime  
DataHoldTime  
ꢀͲ  
ꢀͲ  
ꢀͲ  
ꢀͲ  
ꢀͲ  
ꢀͲ  
tPDS  
ZZHightoPowerDown  
ZZLowtoPowerDown  
2
2
tPUS  
ꢀͲ  
2
ꢀͲ  
2
Notes:  
1.ConfigurationsignalMODEisstaticandmustnotchangeduringnormaloperation.  
2.Guaranteedbutnot100%tested.Thisparameterisperiodicallysampled  
3.TestedwithloadinFigure2.  
Micross Components reserves the right to change products or specications without notice.  
AS5SS128K36  
Rev. 2.8 09/11  
10  
SSRAM  
AS5SS128K36  
SLEEP MODE ELECTRICAL CHARACTERISTICS  
Symbol  
Parameter  
CurrentduringSNOOZEMODE  
ZZactivetoinputignored  
Conditions  
ZZшVih  
Min  
ꢀͲ  
Max Unit  
ISB2  
60  
2
mA  
cycle  
cycle  
cycle  
ns  
tPDS  
tPUS  
tZZI  
ꢀͲ  
ZZinactivetoinputsampled  
ZZactivetoSNOOZEcurrent  
ZZinactivetoexitSNOOZEcurrent  
2
ꢀͲ  
2
ꢀͲ  
tRZZI  
0
ꢀͲ  
SLEEP MODE TIMING  
CLK  
t
PDS  
t
ZZ setup cycle  
ZZ recovPeUryS cycle  
ZZ  
t
ZZI  
Isupply  
I
SB2  
t
RZZI  
All Inputs  
Deselect or Read Only  
Deselect or Read Only  
(except ZZ)  
Normal  
operation  
cycle  
Outputs  
(Q)  
High-Z  
Don't Care  
Micross Components reserves the right to change products or specications without notice.  
AS5SS128K36  
Rev. 2.8 09/11  
11  
SSRAM  
AS5SS128K36  
READ CYCLE TIMING  
tKH  
tKL  
CLK  
tKC  
tADVS tADVH  
ADV  
t
AS tAH  
Address  
A1  
A2  
A3  
tWS  
tWH  
WRITE  
CKE  
tSE tHE  
tCES  
tCEH  
CE  
OE  
t
DS  
KQ  
t
OEQ  
t
OEHZ  
t
t
KQHZ  
Q3-4  
t
OEHZ  
Data Out  
Q1-1  
Q2-1  
Q2-2  
Q2-3  
Q2-4  
Q3-1  
Q3-2  
Q3-3  
NOTES: WRITE = L means WE = L and BWx = L  
WE = L and BWX = L  
Don't Care  
Undefined  
CE = L means CE1 = L, CE2 = H and CE2 = L  
CE = H means CE1 = H, or CE1 = L and CE2 = H, or CE1 = L and CE2 = L  
Micross Components reserves the right to change products or specications without notice.  
AS5SS128K36  
Rev. 2.8 09/11  
12  
SSRAM  
AS5SS128K36  
WRITE CYCLE TIMING  
tKH  
t
KL  
CLK  
ADV  
tKC  
Address  
WRITE  
CKE  
A1  
A3  
A2  
tSE  
t
HE  
CE  
OE  
tDS  
tDH  
Data In  
Data Out  
D1-1  
D2-1  
D2-2  
D2-4  
D3-1  
D3-2  
D3-3  
D3-4  
D2-3  
t
OEHZ  
Q0-4  
NOTES: WRITE = L means WE = L and BWx = L  
WE = L and BWX = L  
Don't Care  
Undefined  
CE = L means CE1 = L, CE2 = H and CE2 = L  
CE = H means CE1 = H, or CE1 = L and CE2 = H, or CE1 = L and CE2 = L  
Micross Components reserves the right to change products or specications without notice.  
AS5SS128K36  
Rev. 2.8 09/11  
13  
SSRAM  
AS5SS128K36  
SINGLE READ / WRITE CYCLE TIMING  
tKH  
tKL  
CLK  
t
SE tHE  
tKC  
CKE  
Address  
WRITE  
CE  
A1  
A2  
A3  
A4  
A5  
A6  
A7  
A8  
A9  
ADV  
OE  
tOEQ  
t
OELZ  
Data Out  
Data In  
Q1  
Q3  
Q4  
Q6  
Q7  
tDS tDH  
D2  
D5  
NOTES: WRITE = L means WE = L and BWx = L  
CE = L means CE1 = L, CE2 = H and CE2 = L  
Don't Care  
Undefined  
CE = H means CE1 = H, or CE1 = L and CE2 = H, or CE1 = L and CE2 = L  
Micross Components reserves the right to change products or specications without notice.  
AS5SS128K36  
Rev. 2.8 09/11  
14  
SSRAM  
AS5SS128K36  
CKE\ OPERATION TIMING  
t
KH  
tKL  
CLK  
t
SE tHE  
t
KC  
CKE  
Address  
WRITE  
CE  
A1  
A2  
A3  
A4  
A5  
A6  
ADV  
OE  
t
KQ  
t
KQHZ  
t
KQLZ  
Q4  
Data Out  
Data In  
Q1  
Q3  
t
DS  
t
DH  
D5  
D2  
NOTES: WRITE = L means WE = L and BWx = L  
CE = L means CE1 = L, CE2 = H and CE2 = L  
Don't Care  
Undefined  
CE = H means CE1 = H, or CE1 = L and CE2 = H, or CE1 = L and CE2 = L  
Micross Components reserves the right to change products or specications without notice.  
AS5SS128K36  
Rev. 2.8 09/11  
15  
SSRAM  
AS5SS128K36  
CE\ OPERATION TIMING  
t
KH  
tKL  
CLK  
t
SE tHE  
t
KC  
CKE  
A1  
A2  
A3  
A4  
A5  
Address  
WRITE  
CE  
ADV  
OE  
t
OEQ  
t
KQHZ  
t
KQ  
tOELZ  
tKQLZ  
Q1  
Q2  
Q4  
Data Out  
Data In  
t
DS  
tDH  
D3  
D5  
Don't Care  
Undefined  
NOTES: WRITE = L means WE = L and BWx = L  
CE = L means CE1 = L, CE2 = H and CE2 = L  
CE = H means CE1 = H, or CE1 = L and CE2 = H, or CE1 = L and CE2 = L  
Micross Components reserves the right to change products or specications without notice.  
AS5SS128K36  
Rev. 2.8 09/11  
16  
SSRAM  
AS5SS128K36  
MECHANICAL DEFINITION  
100-Pin TQFP (Package Designator DQ)  
16.00 0.20  
14.00 0.10  
1.40 0.05  
100  
81  
80  
1
0.30 0.08  
0.65  
TYP.  
12° 1°  
(8X)  
SEE DETAIL  
A
30  
51  
31  
50  
0.20 MAX.  
1.60 MAX.  
R 0.08 MIN.  
0.20 MAX.  
0° MIN.  
SEATING PLANE  
STAND-OFF  
0.05 MIN.  
0.15 MAX.  
NOTE:  
1. JEDEC STD REF MS-026  
0.25  
GAUGE PLANE  
2. BODY LENGTH DIMENSION DOES NOT INCLUDE MOLD PROTRUSION/END FLASH  
MOLD PROTRUSION/END FLASH SHALL NOT EXCEED 0.0098 in (0.25 mm) PER SIDE  
R 0.08 MIN.  
0.20 MAX.  
BODY LENGTH DIMENSIONS ARE MAX PLASTIC BODY SIZE INCLUDING MOLD MISMATCH  
3. DIMENSIONS IN MILLIMETERS  
0°-7°  
0.60 0.15  
1.00 REF.  
0.20 MIN.  
DETAIL  
A
Micross Components reserves the right to change products or specications without notice.  
AS5SS128K36  
Rev. 2.8 09/11  
17  
SSRAM  
AS5SS128K36  
MECHANICAL DEFINITION  
100-Pin TQFP (Package Designator DQC & DQCR)  
D
D1  
E
E1  
N
L1  
L
C
1
e
SEATING  
PLANE  
A2  
A
b
A1  
ThinQuadFlatPack  
Millimeters  
Inches  
Notes:  
Symbol  
Ref.Std.  
Min  
Max  
Min  
Max  
1. All dimensioning and  
tolerancing conforms to  
ANSI Y14.5M-1982.  
No.Leads(N)100
2. Dimensions D1 and E1 do  
not include mold protrusions.  
Allowable protrusion is 0.25  
mm per side. D1 and E1 do  
include mold mismatch and  
are determined at datum  
plane -H-.  
A
ꢀͲ  
1.60  
0.15  
1.45  
ꢀͲ  
0.063  
0.006  
0.057  
0.015  
A10.05
0.002  
0.053  
0.009  
A2  
1.35
0.22
b
0.38  
3. Controlling dimension:  
millimeters.  
D
21.90  
22.10
0.852  
0.870  
D1  
19.9
0
2
0.
1
0
0.783  
0.791
E
15.90  
16.10  
14.10
0.626  
0.547  
0.634  
E1  
13.90  
0.555  
e
0.65BSC  
0.026BSC
L
0.45
0.750.018  
0.030  
L1  
1.00REF
0.039REF
C
0O
7O  
0O  
7O  
Micross Components reserves the right to change products or specications without notice.  
AS5SS128K36  
Rev. 2.8 09/11  
18  
SSRAM  
AS5SS128K36  
ORDERING INFORMATION  
TQFP  
Example:AS5SS128K36DQͲ7.5/IT  
Packageꢀ  
Speedꢀꢀꢀꢀ  
tKQ(ns)  
Type  
DeviceNumber  
Process  
AS5SS128K36  
AS5SS128K36  
DQ  
DQ  
Ͳ7.5  
Ͳ8  
/*  
/*  
TQFPͲCopperLeadFrameꢀͲꢀPb/SnLeadFinish  
Example:AS5SS128K36DQCͲ8/XT  
Packageꢀ  
DeviceNumber  
AS5SS128K36  
AS5SS128K36  
Type  
DQC  
DQC  
Speed(ns) Process  
Ͳ7.5  
Ͳ8  
/*  
/*  
TQFPͲCopperLeadFrameꢀͲꢀNiPdAuLeadFinish(RoHSCompliant)  
Example:AS5SS128K36DQCRͲ7.5/IT  
Packageꢀ  
DeviceNumber  
AS5SS512K18  
AS5SS128K36  
Type  
DQCR  
DQCR  
Speed(ns) Process  
Ͳ7.5  
Ͳ8  
/*  
/*  
*AVAILABLE PROCESSES  
IT = Industrial Temperature Range  
ET = Enhanced Temperature Range  
XT = Military Temperature Range  
-40oC to +85oC  
-40oC to +105oC (Consult Factory)  
-55oC to +125oC (Consult Factory)  
Micross Components reserves the right to change products or specications without notice.  
AS5SS128K36  
Rev. 2.8 09/11  
19  
SSRAM  
AS5SS128K36  
DOCUMENT TITLE  
Rev #  
History  
Release Date  
Status  
2.6  
Updated Micross Information  
October 2010  
Release  
2.7  
Added -7.5 & -8 speeds, deleted  
-11 & -12 speeds, added copper lead  
frame and RoHS compliant options,  
complete redo per ISSI source  
datasheet.  
May 2011  
Release  
Release  
2.8  
Added Thermal Resistance table,  
page 8.  
September 2011  
Micross Components reserves the right to change products or specications without notice.  
AS5SS128K36  
Rev. 2.8 09/11  
20  

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