PMA3-63GLN-D [MINI]
Monolithic Amplifier Die;
| 型号： | PMA3-63GLN-D |
| 厂家： | 
MINI-CIRCUITS |
| 描述： | Monolithic Amplifier Die |
| 文件： | 总6页 (文件大小：251K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Low Noise, High Gain
PMA3-63GLN-D+
Monolithic Amplifier Die
50Ω
1.8 to 6.0 GHz
The Big Deal
• Flat gain over wideband
• Low noise figure, 0.6 dB typ.
• High Gain, up to 29.7 dB typ.
Product Overview
The PMA3-63GLN-D+ is a PHEMT based wideband, low noise MMIC amplifier die with a unique combina-
tion of low noise, high gain and IP3 over wideband making it ideal for sensitive, high-dynamic-range S-band
receiver applications. This design operates on a single 5V supply, is well matched for 50Ω.
Key Features
Feature
Advantages
Low noise, 0.6 dB at 2.5 GHz
Enables lower system noise figure performance.
Wide bandwidth with flat gain
Enables a single amplifier to be used in many wideband applications including defense,
instrumentation and more.
•
1.6 dB over 2.5 to 5 GHz
Enables signal amplification without the need for multiple gain stage. Thus minimize effect of
subsequent stages on noise figure.
High Gain, 29.7 dB at 2.5 GHz
High IP3
• +28.6 dBm at 2.5 GHz
• +14.8 dBm at 2.5 GHz
Combination of low noise and high IP3 makes this MMIC amplifier ideal for use in low noise
receiver front end (RFE) as it gives the user advantages of sensitivity and two-tone IM perfor-
mance at both ends of the dynamic range.
Unpackaged die
Enables user to integrate it directly into hybrids.
®
Mini-Circuits
www.minicircuits.com P.O. Box 350166, Brooklyn, NY 11235-0003 (718) 934-4500 sales@minicircuits.com
Page 1 of
Low Noise, High Gain
PMA3-63GLN-D+
Monolithic Amplifier Die
50Ω
1.8 to 6.0 GHz
Product Features
• Low Noise figure, 0.6 dB typ.
• High IP3, 28.6 dBm typ.
• Excellent Gain flatness, 1.6 dB over 2.5 to 5 GHz
• High Gain, 29.7 dB typ.
Typical Applications
• 5G
• WiFi
+RoHS Compliant
ꢀhe ꢁꢂuffiꢃ identifies RoHꢂ ꢄompliance. ꢂee our web site
for RoHꢂ ꢄompliance methodologies and qualifications
• WLAN
• UMTS
Ordering Information: Refer to Last Page
• LTE
• WiMAX
• S-band Radar
• C-band Satcom
General Description
The PMA3-63GLN-D+ is a PHEMT based wideband, low noise MMIC amplifier die with a unique combination
of low noise, high gain & IP3 over wideband making it ideal for sensitive, high-dynamic-range S-band
receiver applications. This design operates on a single 5V supply, is well matched for 50Ω.
Simplified Schematic and Pad description
Bonding Pad Position
RF-OUT
RF-IN
and DC-IN
GND
Pad#
Function
RF-IN
1
2
RF-OUT and DC-IN
GND
Bottom of Die
Dimensions in µm, Typical
L1
L2
L3
H1
H2
H3
81.5
1074
1150
187
315.5
750
Bond pad size
65.0 x 140.0
Thickness
100
Die size
1150.0 X 750.0
REV. OR
M171586
®
PMA3-63GLN-D+
WP/RS/CP
190222
Mini-Circuits
www.minicircuits.com P.O. Box 350166, Brooklyn, NY 11235-0003 (718) 934-4500 sales@minicircuits.com
Page 2 of
PMA3-63GLN-D+
Monolithic PHEMT MMIC Amplifier Die
Electrical Specifications1 at 25°C and 5V, unless noted otherwise
Parameter
Condition (GHz)
VDD=5.0V
Typ.
Units
Min.
Max.
Frequency Range
Noise Figure
GHz
dB
1.8
6.0
1.8
0.8
2.5
3.5
5
0.6
0.7
0.9
6
1.1
Gain
dB
dB
1.8
2.5
3.5
5
31.7
29.7
27.9
26.5
24.9
7
6
Input Return Loss
Output Return Loss
Output Power at 1dB Compression
Output IP33
1.8
2.5
3.5
5
10
11
10
6
12
dB
1.8
2.5
3.5
5
10
10
10
16
6
22
dBm
dBm
1.8
2.5
3.5
5
15.2
14.8
14.1
11.5
10.7
28.8
28.6
26.6
23.4
22.3
5.0
6
1.8
2.5
3.5
5
6
Device Operating Voltage (VDD
)
V
Device Operating Current (IDD
)
—
69
80
mA
Device Current Variation vs. Temperature2
-26.9
0.006
57.3
µA/°C
mA/mV
°C/W
Device Current Variation vs. Voltage
Thermal Resistance, junction-to-ground lead
1. Measured on Mini-Circuits Characterization test board with tested board loss being deducted. Die is packaged in 3x3 mm, 12-lead MCL package and soldered
on TB-PMA3-63GLN+. See Characterization Test Circuit (Fig. 1)
2. (Current at 85°C - Current at -45°C)/130
3. Tested at Pout=0 dBm/tone
Absolute Maximum Ratings4
Parameter
Ratings
-40°C to 85°C
150°C
Operating Temperature (ground lead)
Junction Temperature
Total Power Dissipation
1.0W
+29 dBm (5 minutes max.)
+10 dBm (continuous)
Input Power (CW), Vd=5V
DC Voltage
8.5V
4. Permanent damage may occur if any of these limits are exceeded.
Electrical maximum ratings are not intended for continuous normal operation.
®
Mini-Circuits
www.minicircuits.com P.O. Box 350166, Brooklyn, NY 11235-0003 (718) 934-4500 sales@minicircuits.com
Page 3 of
Monolithic PHEMT MMIC Amplifier Die
PMA3-63GLN-D+
Characterization Test Circuit
Component Size
Value
22pF
22pF
100pF
22uF
10nH
P/N
Manufacturer
Murata
C1
C2
C3
C4
L1
0402
0402
0402
1206
0402
GRM1555C1H220JA01
GRM1555C1H220JA01
GRM1555C1H101JA01
GRM31CR61H106KA12
LQG15HSIONJD2
Murata
Murata
Murata
Murata
Fig 1. Application and Characterization Circuit
Note: This block diagram is used for characterization. (Die is packaged in 3x3mm, 12-lead MCLP package and soldered on Mini-Circuits
Characterization test board TB-PMA3-63GLN+) Gain, Return loss, Output power at 1dB compression (P1 dB), output IP3 (OIP3) and noise
figure measured using Agilent’s N5242A PNA-X microwave network analyzer.
Conditions:
1. Gain and Return loss: Pin= -35dBm
2. Output IP3 (OIP3): Two tones, spaced 1 MHz apart, 0 dBm/tone at output.
®
Mini-Circuits
www.minicircuits.com P.O. Box 350166, Brooklyn, NY 11235-0003 (718) 934-4500 sales@minicircuits.com
Page 4 of
PMA3-63GLN-D+
Monolithic PHEMT MMIC Amplifier Die
Assembly Diagram
Assembly and Handling Procedure
1. Storage
Dice should be stored in a dry nitrogen purged desiccators or equivalent.
2. ESD
MMIC PHEMT amplifier dice are susceptible to electrostatic and mechanical damage. Die are supplied in
antistatic protected material, which should be opened in clean room conditions at an appropriately grounded anti-static worksta
tion. Devices need careful handling using correctly designed collets, vacuum pickup tips or sharp antistatic tweezers to deter
ESD damage to dice.
3. Die Attach
The die mounting surface must be clean and flat. Using conductive silver filled epoxy, recommended epoxies are DieMat
DM6030HK-PT/H579 or Ablestik 84-1LMISR4. Apply sufficient epoxy to meet required epoxy bond line thickness, epoxy fillet
height and epoxy coverage around total die periphery. Parts shall be cured in a nitrogen filled atmosphere per manufacturer’s
cure condition. It is recommended to use antistatic die pick up tools only.
4. Wire Bonding
Bond pad openings in the surface passivation above the bond pads are provided to allow wire bonding to the dice gold bond
pads. Thermosonic bonding is used with minimized ultrasonic content. Bond force, time, ultrasonic power and temperature are
all critical parameters. Suggested wire is pure gold, 1 mil diameter. Bonds must be made from the bond pads on the die to
the package or substrate. All bond wires should be kept as short as low as reasonable to minimize performance degradation due
to undesirable series inductance.
®
Mini-Circuits
www.minicircuits.com P.O. Box 350166, Brooklyn, NY 11235-0003 (718) 934-4500 sales@minicircuits.com
Page 5 of
Monolithic PHEMT MMIC Amplifier Die
PMA3-63GLN-D+
Additional Detailed Technical Information
additional information is available on our dash board.
Data Table
Performance Data
Case Style
Swept Graphs
S-Parameter (S2P Files) Data Set with and without port extension(.zip file)
Die
Quantity, Package
Model No.
Small, Gel - Pak: 5,10,50,100 KGD* PMA3-63GLN-DG+
Medium†, Partial wafer: KGD*<1575 PMA3-63GLN-DP+
PMA3-63GLN-DF+
†Available upon request contact sales representative
Die Ordering and packaging
information
Large†, Full Wafer
Refer to AN-60-067
Environmental Ratings
ENV80
*Known Good Dice (“KGD”) means that the dice in question have been subjected to Mini-Circuits DC test performance criteria and measurement
instructions and that the parametric data of such dice fall within a predefined range. While DC testing is not definitive, it does help to provide a higher
degree of confidence that dice are capable of meeting typical RF electrical parameters specified by Mini-Circuits.
ESD Rating**
Human Body Model (HBM): Class 1C (pass <2000V) in accordance with ANSI/ESD STM 5.1 - 2001
** Tested in industry standard MCLP 3 x 3 mm, 12-lead package.
Additional Notes
A. Performance and quality attributes and conditions not expressly stated in this specification document are intended
to be excluded and do not form a part of this specification document.
B. Electrical specifications and performance data contained in this specification document are based on Mini-Circuit’s
applicable established test performance criteria and measurement instructions.
C. The parts covered by this specification document are subject to Mini-Circuits standard limited warranty and terms
and conditions (collectively, “Standard Terms”); Purchasers of this part are entitled to the rights and benefits
contained therein. For a full statement of the Standard Terms and the exclusive rights and remedies thereunder,
please visit Mini-Circuits’ website at www.minicircuits.com/MCLStore/terms.jsp
D. Mini-Circuits does not warrant the accuracy or completeness of the information, text, graphics and other items
contained within this document and same are provided as an accommodation and on an “As is” basis, with all faults.
E. Purchasers of this part are solely responsible for proper storing, handling, assembly and processing of Known
Good Dice (including, without limitation, proper ESD preventative measures, die preparation, die attach, wire bond
ing and related assembly and test activities), and Mini-Circuits assumes no responsibility therefor or for environmental
effects on Known Good Dice.
F. Mini-Circuits and the Mini-Circuits logo are registered trademarks of Scientific Components Corporation d/b/a Mini-
Circuits. All other third-party trademarks are the property of their respective owners. A reference to any third-party
trademark does not constitute or imply any endorsement, affiliation, sponsorship, or recommendation by any such
third-party of Mini-Circuits or its products.
®
Mini-Circuits
www.minicircuits.com P.O. Box 350166, Brooklyn, NY 11235-0003 (718) 934-4500 sales@minicircuits.com
Page 6 of
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