XHF-1162-D+ [MINI]
High Pass Filter Die;
| 型号： | XHF-1162-D+ |
| 厂家： | 
MINI-CIRCUITS |
| 描述： | High Pass Filter Die |
| 文件： | 总6页 (文件大小：317K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MMIC
REFLECTIONLESS FILTER DICE
50Ω DC to 21 GHz
The Big Deal
• Patented design eliminates in band spurs
• Pass band cut-off up to 21 GHz
• Stop band up to 35 GHz
• Excellent repeatability through IPD* process
• Unpackaged Die Form
X-Series
Available in Low Pass, High
Pass and Band Pass designs
Product Overview
Mini-Circuits’ X-Series reflectionless filters employ a novel filter topology which absorbs and terminates
stop band signals internally rather than reflecting them back to the source. This new capability enables
unique applications for filter circuits beyond those suited to traditional approaches. Traditional filters are
reflective in the stop band, sending signals back to the source at 100% of the power level which interact
with neighboring components and often result in intermodulation and other interferences. Reflectionless
filters eliminate stop band reflections, allowing them to be paired with sensitive devices and used in
applications that otherwise require circuits such as isolators, isolation amplifiers or attenuators.
Key Features
Easy integration with sensitive reflective
components, e.g. mixers, multipliers
Advantages
Reflectionless filters absorb unwanted signals, preventing reflections back to the
source. This reduces generation of additional unwanted signals without the need
for extra components like attenuators, improving system dynamic range and sav-
ing board space.
Enables stable integration of wideband
amplifiers
Because reflectionless filters maintain good impedance in the stop band; they
can be integrated with high gain, wideband amplifiers without the risk of creating
instabilities in these out of band regions.
Cascadable
Reflectionless filters can be cascaded in multiple sections to provide sharper and
higher attenuation, while also preventing any standing waves that could affect
pass band signals.
Excellent power handling in a tiny surface
mount device
High power handling extends the usability of these filters to the transmit path for
inter-stage filtering.
Excellent repeatability of RF performance
Through semiconductor IPD process, X-series filters are inherently repeatable for
large volume production.
Excellent stability over temperature
With 0.ꢀ dB variation over temperature ideal for use in wide temperature range
applications without the need for additional temperature compensation.
Operating Temperature up to 105°C
Unpackaged Die form
Suitable for operation close to high power components
Enables direct integration into customer hybrids
*IPD – Integrated Passive Device, is a GaAs semiconductor process
®
Mini-Circuits
www.minicircuits.com P.O. Box 350166, Brooklyn, NY 11235-0003 (718) 934-4500 sales@minicircuits.com
Page 1 of 6
HReiflgechtionPleassss Filter Die
XHF-1162-D+
50Ω
11.6 to 40 GHz
Features
• Match to 50Ω in the stop band, eliminates
undesired reflections
• Cascadable
• Excellent Power handling
• Protected by US Patent No. 8,392,495
+RoHS Compliant
ꢀhe ꢁSuffix identifies ꢂoHS ꢃomplianceꢄ See our web site
for ꢂoHS ꢃompliance methodologies and ꢅualifications
Applications
• Wi-Fi
• WiMax
• Microwave Radio
• Military & Space
Ordering Information: Refer to Last Page
General Description
Mini-Circuits’ XHF-1162-D+ reflectionless filter die employs a novel filter topology which absorbs and ter-
minates stop band signals internally rather than reflecting them back to the source. This new capability en-
ables unique applications for filter circuits beyond those suited to traditional approaches. Traditional filters
are reflective in the stop band, sending signals back to the source at 100% of the power level. These re-
flections interact with neighboring components and often result in inter-modulation and other interferences.
Reflectionless filters eliminate stop band reflections, allowing them to be paired with sensitive devices and
used in applications that otherwise require circuits such as isolation amplifiers or attenuators.
Simplified Schematic
Pad
RF-IN
Description
RF Input Pad
RF-OUT
Ground
RF Output Pad
Ground Bonding Pad
REV. OR
M156687
®
XHF-1162-D+
RS/CP/AM
180129
Mini-Circuits
www.minicircuits.com P.O. Box 350166, Brooklyn, NY 11235-0003 (718) 934-4500 sales@minicircuits.com
Page 2 of 6
MMIC Reflectionless High Pass Filter Die
XHF-1162-D+
Electrical Specifications1 at 25°C
Parameter
F#
Frequency (MHz)
Min.
Typ.
Max.
Unit
DC - F1
F1 - F1
DC - 2500
—
—
11.0
21.3
—
—
Rejection
dB
dB
:1
2500 - 9100
Frequency Cut-off
VSWR
F2
10500
—
3.0
—
Stop Band
Pass Band
DC - F1
F1 - F1
DC - 2500
—
—
2.3
1.4
—
—
2500 - 9100
F3 - F4
F4 - F5
11600 - 30000
30000 - 40000
—
—
1.3
1.8
—
—
Insertion Loss
VSWR
dB
:1
:1
F3 - F4
F4 - F5
11600 - 30000
30000 - 40000
—
—
1.3
1.8
—
—
1 Electrical Specifications are typical measured characteristics of die.
Absolute Maximum Ratings4
Parameter
Ratings
Operating Temperature
-55°C to +105°C
RF Power Input, Passband (F3-F5)2
RF Power Input, Stopband (DC-F3)3
1.26W at 25°C
0.25W at 25°C
2 Passband rating derates linearly to 0.63W at 105°C ambient
3 Stopband rating derates linearly to 0.12W at 105°C ambient
4 Permanent damage may occur if any of these limits are exceeded.
Typical Performance Data at 25°C
Frequency
(MHz)
Insertion Loss
VSWR
(:1)
(dB)
10
50
100
6.66
6.67
6.69
7.45
9.71
13.31
17.91
21.08
18.37
24.67
3.02
1.06
0.62
0.68
0.93
1.01
0.55
2.55
2.55
2.55
2.48
2.31
2.11
1.95
1.81
1.50
1.65
1.33
1.18
1.08
1.44
1.70
1.77
1.74
500
1000
1500
2000
2500
4000
8000
10500
12000
15000
20000
26000
30000
40000
XHF-1162-D+
INSERTION LOSS
XHF-1162-D+
VSWR
40
30
20
10
0
3.0
2.5
2.0
1.5
1.0
0
10000
20000
30000
40000
0
10000
20000
30000
40000
FREQUENCY (MHz)
FREQUENCY (MHz)
®
Mini-Circuits
www.minicircuits.com P.O. Box 350166, Brooklyn, NY 11235-0003 (718) 934-4500 sales@minicircuits.com
Page 3 of 6
MMIC Reflectionless High Pass Filter Die
XHF-1162-D+
Characterization Test Circuit
Figure 1: Block Diagram of Test Circuit used for characterization of S-parameters
Conditions:
1. Input Power= -25dBm
Die Layout
Bonding Pad Position
(Dimensions in µm, Typical)
Fig 2. Die Layout
Fig 3. Bonding Pad Positions
Critical Dimensions
Parameter
Values
100
Die Thickness, µm
Die Width, µm
800
Die Length, µm
760
Bond Pad Size (Ground pad), µm
75 x 75
®
Mini-Circuits
www.minicircuits.com P.O. Box 350166, Brooklyn, NY 11235-0003 (718) 934-4500 sales@minicircuits.com
Page 4 of 6
MMIC Reflectionless High Pass Filter Die
XHF-1162-D+
Assembly and Handling Procedure
1. Storage
Dice should be stored in a dry nitrogen purged desiccators or equivalent.
2. ESD
MMIC Gallium Arsenide (GaAs) filter dice are susceptible to electrostatic and mechanical damage. Die are supplied in
antistatic protected material, which should be opened in clean room conditions at an appropriately grounded anti-static worksta
tion. Devices need careful handling using correctly designed collets, vacuum pickup tips or sharp antistatic tweezers to deter
ESD damage to dice.
3. Die Attach
The die mounting surface must be clean and flat. Using conductive silver filled epoxy, recommended epoxies are DieMat
DM6030Hk-PT/H579/H579 or Ablestik 84-1LMISR4. Apply sufficient epoxy to meet required epoxy bond line thickness, epoxy
fillet height and epoxy coverage around total die periphery. Parts shall be cured in a nitrogen filled atmosphere per manufac
turer’s cure condition. It is recommended to use antistatic die pick up tools only.
4. Wire Bonding
Bond pad openings in the surface passivation above the bond pads are provided to allow wire bonding to the dice gold bond
pads. Thermosonic bonding is used with minimized ultrasonic content. Bond force, time, ultrasonic power and temperature are
all critical parameters. Suggested wire is pure gold, 1 mil diameter. Bonds must be made from the bond pads on the die to
the package or substrate. All bond wires should be kept as short as low as reasonable to minimize performance degradation due
to undesirable series inductance.
Assembly Diagram
Recommended Wire Length, Typical
Wire
Wire Length (mm)
Wire Loop Height (mm)
0.15
All wires
1.0
RF Reference Plane
®
Mini-Circuits
www.minicircuits.com P.O. Box 350166, Brooklyn, NY 11235-0003 (718) 934-4500 sales@minicircuits.com
Page 5 of 6
MMIC Reflectionless High Pass Filter Die
XHF-1162-D+
Additional Detailed Technical Information
additional information is available on our dash board.
Data Table
Performance Data
Case Style
Swept Graphs
S-Parameter (S2P Files) Data Set with and without port extension(.zip file)
Die
Quantity, Package
Model No.
Small, Gel - Pak: 10,50,100 KGD*
Medium†, Partial wafer: KGD*<5K
Large†, Full wafer
XHF-1162-DG+
XHF-1162-DP+
XHF-1162-DF+
Die Ordering and packaging
information
†Available upon request contact sales representative
Refer to AN-60-067
Environmental Ratings
ENV-80
*Known Good Dice (“KGD”) means that the dice are taken from PCM good wafer and visually inspected according to Mini-Circuits inspection criteria.
While this is not definitive, it does help to provide a higher degree of confidence that dice are capable of meeting typical RF electrical parameters
specified by Mini-Circuits.
ESD Rating**
Human Body Model (HBM): Class 1A (250V) in accordance with ANSI/ESD STM 5.1 - 2001
** Tested in industry standard MCLP 3x3mm 12 lead package.
Additional Notes
A. Performance and quality attributes and conditions not expressly stated in this specification document are intended
to be excluded and do not form a part of this specification document.
B. Electrical specifications and performance data contained in this specification document are based on Mini-Circuit’s
applicable established test performance criteria and measurement instructions.
C. The parts covered by this specification document are subject to Mini-Circuits standard limited warranty and terms
and conditions (collectively, “Standard Terms”); Purchasers of this part are entitled to the rights and benefits
contained therein. For a full statement of the Standard Terms and the exclusive rights and remedies thereunder,
please visit Mini-Circuits’ website at www.minicircuits.com/MCLStore/terms.jsp
D. Mini-Circuits does not warrant the accuracy or completeness of the information, text, graphics and other items
contained within this document and same are provided as an accommodation and on an “As is” basis, with all faults.
E. Purchasers of this part are solely responsible for proper storing, handling, assembly and processing of Known
Good Dice (including, without limitation, proper ESD preventative measures, die preparation, die attach, wire bond
ing and related assembly and test activities), and Mini-Circuits assumes no responsibility therefor or for environmental
effects on Known Good Dice.
F. Mini-Circuits and the Mini-Circuits logo are registered trademarks of Scientific Components Corporation d/b/a Mini-
Circuits. All other third-party trademarks are the property of their respective owners. A reference to any third-party
trademark does not constitute or imply any endorsement, affiliation, sponsorship, or recommendation by any such
third-party of Mini-Circuits or its products.
®
Mini-Circuits
www.minicircuits.com P.O. Box 350166, Brooklyn, NY 11235-0003 (718) 934-4500 sales@minicircuits.com
Page 6 of 6
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