FU-68SDF-V802M63B [MITSUBISHI]

Optoelectronic Device;
FU-68SDF-V802M63B
型号: FU-68SDF-V802M63B
厂家: Mitsubishi Group    Mitsubishi Group
描述:

Optoelectronic Device

光电
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中文:  中文翻译
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WZ700001B (1/6)  
MITSUBISHI (OPTICAL DEVICES)  
FU-68SDF-x8xxMxxB  
1.55 µm DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL  
DESCRIPTION  
Module type FU-68SDF-x802MxxB/-x810MxxB is a  
1.55µm DFB-LD module with polarization maintaining  
optical fiber.  
This module is suitable to a directly modulated light  
source for use in 2.5Gb/s digital optical communication  
systems.  
This module is prepared in accordance with ITU-T  
recommendation wavelength channel plan for Dense-  
WDM transmission..  
FEATURES  
O Input impedance is 25Ω  
O Multi quantum wells (MQW) DFB Laser Diode  
module  
O Emission wavelength is in full C and L band  
O Single mode optical fiber pig-tail  
O Built-in optical isolator  
PIN INFORMATION  
O Built-in thermal electric cooler  
O Butterfly package  
O With photodiode for optical output monitor  
APPLICATION  
High speed transmission systems (~2.5Gb/s)  
Dense-WDM systems  
PIN  
1
FUNCTION  
Thermistor  
2
Thermistor  
3
4
LD DC Bias (Cathode)  
PD Anode  
5
6
7
8
PD Cathode  
Cooler Anode  
Cooler Cathode  
GND  
9
GND  
10  
11  
12  
13  
14  
NC  
LD Anode, GND  
LD RF Input (Cathode)  
LD Anode, GND  
NC  
Mitsubishi Electric Corporation reserves the right to make changes to the products or information contained herein  
without notice. No liability is assumed as a result of their use or application.  
WZ700001B (2/6)  
MITSUBISHI (OPTICAL DEVICES)  
FU-68SDF-x8xxMxxB  
1.55 µm DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL  
ABSOLUTE MAXIMUM RATINGS (Tld=Tset)  
Parameter  
Symbol  
Pf  
Conditions  
CW x802MxxB  
Rating  
6
Unit  
mW  
Laser diode  
Optical output  
power  
x810MxxB  
15  
Forward current  
Reverse voltage  
Reverse voltage  
Forward current  
Cooler current  
Cooler voltage  
If  
Vrl  
Vrd  
Ifd  
Ipe  
Vpe  
CW  
150  
2
20  
2
1.3  
3.1  
mA  
V
V
mA  
A
V
-
-
-
-
-
Photodiode  
Thermo-  
electric cooler  
(Note)  
Operating case temperature  
Storage temperature  
Tc  
Tstg  
-
-
-20 ~ 70  
-40 ~ 85  
°C  
°C  
Note) Even if the thermo-electric cooler (TEC) is operated within the rated conditions, uncontrolled current loading or  
operation without heatsink may easily damage the module by exceeding the storage temperature range.  
Thermistor resistance should be properly monitored by the feedback circuit during TEC operation to avoid the  
catastrophic damage.  
ELECTRICAL/OPTICAL CHARACTERISTICS (Tld=Tset, Tc=25°C unless otherwise noted)  
Parameter  
Symbol  
Test Conditions  
Limits  
Typ.  
2
Unit  
mW  
Min.  
Max.  
Optical output  
P0  
CW,If=Iop  
-x802MxxB  
-x810MxxB  
10  
Threshold current  
Optical output power  
at threshold current  
Ith  
Pth  
CW  
CW, If=Ith  
-
-
10  
-
25  
100  
mA  
µW  
-x802MxxB  
-x810MxxB  
-x802MxxB  
-x810MxxB  
-
-
-
-
-
-
150  
65  
95  
1.8  
-
Operating current  
Iop  
CW, Pf=P0  
40  
50  
1.3  
25  
mA  
Operating voltage  
Input impedance  
Light-emission central  
wavelength  
Vop  
Zin  
λc  
CW, Pf=P0  
Pf= P0  
(Note 1)  
V
nm  
See Ordering Information  
and Table 1  
Central wavelength drift with  
case temp.  
-1  
-
0
∆λc/Tc Tc=-20~70°C  
pm/°C  
Laser operating temperature  
Spectral width  
Side mode suppression ratio  
Dispersion penalty  
Tset  
∆λ  
Sr  
-
20  
-
33  
-
-
0.2  
40  
-
35  
0.4  
-
°C  
nm  
dB  
dB  
(Note 1), -20dB  
(Note 1)  
Pp  
(Note 1), at 10-10 BER,  
+1800ps/nm  
2
Cutoff frequency  
(-1.5dB optical)  
Rise and fall time  
(10~90%)  
fc  
Pf= P0  
3.5  
-
-
-
-
GHz  
psec  
tr, tf  
(Note 2)  
150  
Relative intensity noise  
Tracking error  
Nr  
Er  
CW, Pf= P0, f =0.5~3GHz  
Tc=-20~70°C, APC, ATC  
-
-
-155  
-
-145  
0.5  
dB/Hz  
dB  
(Note 2)  
Differential efficiency  
CW  
Pf= P0  
-x802MxxB  
-x810MxxB  
0.057  
0.07  
0.15  
mW/  
mA  
η
0.15  
-20  
0.25  
-
0.35  
20  
Linearity  
CW, Pf= P0 x0.1~ P0x1.2  
(Note 3)  
CW, Pf= P0,  
Vrd=5V  
Tc=25°C  
Tc=-20~70°C  
%
mA  
dB  
∆η  
Monitor current  
Optical isolation  
Imon  
-x802MxxB  
-x810MxxB  
0.1  
0.2  
35  
23  
-
-
-
-
-
-
-
2
3
-
Iso  
-
Dark current (PD)  
Capacitance (PD)  
Id  
Ct  
0.1  
10  
Vrd=5V, Tc=-20~70°C  
Vrd=5V, f=1MHz  
µA  
pF  
-
Mitsubishi Electric Corporation reserves the right to make changes to the products or information contained herein  
without notice. No liability is assumed as a result of their use or application.  
WZ700001B (3/6)  
MITSUBISHI (OPTICAL DEVICES)  
FU-68SDF-x8xxMxxB  
1.55 µm DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL  
THERMAL CHARACTERISTICS (Tld=Tset, Tc=-20~70°C)  
Parameter  
Symbol  
Test Conditions  
Limits  
Typ.  
10  
3950  
-
Unit  
Min.  
9.5  
-
50  
-
Max.  
10.5  
-
-
1
2
Thermistor resistance  
B constant of Rth  
Cooling capacity  
Cooler current  
Rth  
B
T  
Ipe  
Vpe  
Tld=25°C  
kΩ  
K
°C  
A
-
Pf=Po, Tc=70°C  
Pf=Po, Tc=70°C, Tld=Tset  
Pf=Po, Tc=70°C, Tld=Tset  
0.6  
1.2  
Cooler voltage  
-
V
FIBER PIGTAIL SPECIFICATIONS  
Parameter  
Type  
Limits  
SM  
Unit  
-
Mode field diameter  
Cladding diameter  
Secondary coating outer diameter  
Connector  
9.5+/-1  
125+/-2  
0.9+/-0.1  
(Note 4)  
40 (min)  
µm  
µm  
mm  
-
Optical return loss of connector  
dB  
Note 1) 2.48832Gb/s NRZ, 223-1, Pf_ave= P0 x 0.5, Extinction ratio 10dB, optical return loss of the connectors should  
be greater than 40dB in order to ensure the specified performance.  
Note 2) Er=max|10×log(Pf / Pf@25°C)|  
Note 3) Variation of the differential efficiency from the straight line between P0 x0.1~ P0x1.2  
Note 4) SC/PC and FC/PC are available. Other connectors are also available for large quantities.  
ORDERING INFORMATION  
FU-68SDF- W 8 02 M 59 B  
λ Code (See Table 1)  
Output Power Code  
Connector Code  
Output power  
2mW  
02  
10  
10mW  
Connector Code  
Connector Code  
Connector type  
SC/PC  
W
V
Standard  
Optional  
FC/PC  
Mitsubishi Electric Corporation reserves the right to make changes to the products or information contained herein  
without notice. No liability is assumed as a result of their use or application.  
WZ700001B (4/6)  
MITSUBISHI (OPTICAL DEVICES)  
FU-68SDF-x8xxMxxB  
1.55 µm DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL  
Table 1.  
f [THz]  
f [THz]  
f [THz]  
λc [nm] λ code  
λc [nm] λ code  
λc [nm] λ code  
196.30 1527.22  
196.20 1527.99  
196.10 1528.77  
196.00 1529.55  
3
5
7
9
192.80 1554.94 73  
192.70 1555.75 75  
192.60 1556.55 77  
192.50 1557.36 79  
192.40 1558.17 81  
192.30 1558.98 83  
192.20 1559.79 85  
192.10 1560.61 87  
192.00 1561.42 89  
191.90 1562.23 91  
191.80 1563.05 93  
191.70 1563.86 95  
191.60 1564.68 97  
191.50 1565.50 99  
191.40 1566.31 101  
191.30 1567.13 103  
191.20 1567.95 105  
191.10 1568.77 107  
191.00 1569.59 109  
190.90 1570.42 111  
190.80 1571.24 113  
190.70 1572.06 115  
190.60 1572.89 117  
190.50 1573.71 119  
190.40 1574.54 121  
190.30 1575.37 123  
190.20 1576.20 125  
190.10 1577.03 127  
190.00 1577.86 129  
189.90 1578.69 131  
189.80 1579.52 133  
189.70 1580.35 135  
189.60 1581.18 137  
189.50 1582.02 139  
189.40 1582.85 141  
189.30 1583.69 143  
189.20 1584.53 145  
189.10 1585.36 147  
189.00 1586.20 149  
188.90 1587.04 151  
188.80 1587.88 153  
188.70 1588.73 155  
188.60 1589.57 157  
188.50 1590.41 159  
188.40 1591.26 161  
188.30 1592.10 163  
188.20 1592.95 165  
188.10 1593.79 167  
188.00 1594.64 169  
187.90 1595.49 171  
187.80 1596.34 173  
187.70 1597.19 175  
187.60 1598.04 177  
187.50 1598.89 179  
187.40 1599.75 181  
187.30 1600.60 183  
187.20 1601.46 185  
187.10 1602.31 187  
187.00 1603.17 189  
186.90 1604.03 191  
186.80 1604.88 193  
186.70 1605.74 195  
186.60 1606.60 197  
186.50 1607.47 199  
186.40 1608.33 201  
186.30 1609.19 203  
186.20 1610.06 205  
186.10 1610.92 207  
186.00 1611.79 209  
195.90 1530.33 11  
195.80 1531.12 13  
195.70 1531.90 15  
195.60 1532.68 17  
195.50 1533.47 19  
195.40 1534.25 21  
195.30 1535.04 23  
195.20 1535.82 25  
195.10 1536.61 27  
195.00 1537.40 29  
194.90 1538.19 31  
194.80 1538.98 33  
194.70 1539.77 35  
194.60 1540.56 37  
194.50 1541.35 39  
194.40 1542.14 41  
194.30 1542.94 43  
194.20 1543.73 45  
194.10 1544.53 47  
194.00 1545.32 49  
193.90 1546.12 51  
193.80 1546.92 53  
193.70 1547.72 55  
193.60 1548.51 57  
193.50 1549.32 59  
193.40 1550.12 61  
193.30 1550.92 63  
193.20 1551.72 65  
193.10 1552.52 67  
193.00 1553.33 69  
192.90 1554.13 71  
All wavelengths are referred to vacuum. Tolerance is λc+/-0.05nm.  
Mitsubishi Electric Corporation reserves the right to make changes to the products or information contained herein  
without notice. No liability is assumed as a result of their use or application.  
WZ700001B (5/6)  
MITSUBISHI (OPTICAL DEVICES)  
FU-68SDF-x8xxMxxB  
1.55 µm DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL  
OUTLINE DIAGRAM  
Unit : mm  
Tolerances unless noted ±0.5  
Identified type number  
FU-68SDF-W8xxMxxB  
FU-68SDF-V8xxMxxB  
Connector type  
SC/PC  
L
35REF  
28REF  
FC/PC  
Mitsubishi Electric Corporation reserves the right to make changes to the products or information contained herein  
without notice. No liability is assumed as a result of their use or application.  
WZ700001B (6/6)  
MITSUBISHI (OPTICAL DEVICES)  
FU-68SDF-x8xxMxxB  
1.55 µm DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL  
Safety Cautions for Use of Optoelectronic Devices  
General:  
Although the manufacturer is always striving to improve the reliability of its product, problems and errors may occur with  
semiconductor products. Therefore, the user's products are required to be designed with full safety regard to prevent any accidents  
that results in injury, death, fire or environmental damage even when semiconductor products happen to error. Especially it is  
recommended to take in consideration about redundancy, fire prevention, error prevention safeguards. And the following requirements  
must be strictly observed.  
Warning!  
1. Eye safety : Seminductor laser radiates laser light during operation. Laser light is very dangerous when shot directly into human  
eyes. Don't look at laser light directly, or through optics such as a lens. The laser light should be observed using the ITV camera, IR-  
viewer, or other appropriate instruments.  
2. Product handling : The product contains GaAs (gallium arsenide). It is safe for regular use, but harmful to the human body if  
made into powder or steam. Be sure to avoid dangerous process like smashing, burning, chemical etching. Never put this product in  
one's mouth or swallow it.  
3. Product disposal : This product must be disposed of as special industrial waste. It is necessary to separate it from general  
industrial waste and general garbage.  
Handling Cautions for Optoelectronic Devices  
1. General:  
(1) The products described in this specification are designed and manufactured for use in general communication systems or  
electronic devices, unless their applications or reliability are otherwise specified. Therefore, they are not designed or manufactured for  
installation in devices or systems that may affect human life or that are used in social infrastructure requiring high reliability.  
(2) When the customer is considering to use the products in special applications, such as transportation systems (automobiles, trains,  
vessels), medical equipments, aerospace, nuclear power control, and submarine repeaters or systems, please contact Mitsubishi  
Electric or an authorized distributor.  
2. Shipping Conditions:  
(1) During shipment, place the packing boxes in the correct direction, and fix them firmly to keep them immovable. Placing the boxes  
upside down, tilting, or applying abnormal pressure onto them may cause deformation in the electrode terminals, breaking of optical  
fiber, or other problems.  
(2) Never throw or drop the packing boxes. Hard impact on the boxes may cause break of the devices.  
(3) Take strict precautions to keep the devices dry when shipping under rain or snow.  
3. Storage Conditions:  
When storing the products, it is recommended to store them following the conditions described below without opening the packing.  
Not taking enough care in storing may result in defects in electrical characteristics, soldering quality, visual appearance, and so on.  
The main points are described below (if special storage conditions are given to the product in the specification sheet, they have priority  
over the following general cautions):  
(1) Appropriate temperature and humidity conditions, i.e., temperature range between 5~30 C, and humidity between 40~60 percent  
RH, should be maintained in storage locations. Controlling the temperature and humidity within this range is particularly important in  
case of long-term storage for six months or more.  
(2) The atmosphere should be particularly free from toxic gases and dust.  
(3) Do not apply any load on the product.  
(4) Do not cut or bend the leads of the devices which are to be stored. This is to prevent corrosion in the cut or bent part of the lead  
causing soldering problems in the customer’s assembling process.  
(5) Sudden change in temperature may cause condensation in the product or packing, therefore, such locations should be avoided  
for storing. Temperature in storage locations should be stable.  
(6) When storing ceramic package products for extended periods of time, the leads may turn reddish due to reaction with sulfur in the  
atmosphere.  
(7) Storage conditions for bare chip and unsealed products shall be stated separately because bare chip and unsealed products  
require stricter controls than package sealed products.  
4. Design Conditions and Environment under Use:  
(1) Avoid use in locations where water or organic solvents adhere directly to the product, or where there is any possibility of the  
generation of corrosive gas, explosive gas, dust, salinity, or other troublesome conditions. Such environments will not only significantly  
lower the reliability, but also may lead to serious accidents.  
(2) Operation in excess of the absolute maximum ratings can cause permanent damage to the device. The customers are requested  
to design not to exceed those ratings even for a short time.  
5. ESD Safety Cautions:  
The optoelectronic devices are sensitive to static electricity (ESD, electro-static discharge). The product can be broken by ESD. When  
handling this product, please observe the following countermeasures:  
<Countermeasures against Static Electricity and Surge>  
To prevent break of devices by static electricity or surge, please adopt the following countermeasures in the assembly line:  
(1) Ground all equipments, machinery jigs, and tools in the process line with earth wires installed in them. Take particular care with  
hot plates, solder irons and other items for which the commercial power supplies are prone to leakage.  
(2) Workers should always use earth bands. Use of antistatic clothing, electric conductive shoes, and other safety equipment while at  
work is highly recommended.  
(3) Use conductive materials for this product’s container, etc.  
(4) It is recommended that grounding mats be placed on the surfaces of assembly line workbench and the surrounding floor in work  
area, etc.  
(5) When mounting this product in parts or materials which can be electrically charged (printed wiring boards, plastic products, etc.),  
pay close attention to the static electricity in those parts. ESD may damage the product.  
(6) Humidity in working environment should be controlled to be 40 percent RH or higher.  
These countermeasures are most general, and there is a need to carefully confirm the line before starting mass production using this  
product (in the trial production, etc.). It is extremely important to prevent surge, eliminate it rapidly, and prevent it from spreading.  
Mitsubishi Electric Corporation reserves the right to make changes to the products or information contained herein  
without notice. No liability is assumed as a result of their use or application.  

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