MF-2500FXE-M42ZB_技术文档

MITSUBISHI (OPTICAL DEVICES)

Mitsubishi Electric Corp.

Datasheet

MF-2500FXE Series

2.5Gbps SFP TRANSCEIVER MODULE

2.7Gbps Multi-Rate, L-16.1, L-16.2 / LR-1, LR-2 SFP Transceiver

with Digital Diagnostic Monitoring Interface

MF-2500FXE Series

1. Description

This transceiver is compliant with Small

Form-factor Pluggable (SFP) MSA, and

optimized for SDH L-16.1, L-16.2 / SONET

LR-1, LR-2 applications.

The optical subassembly consists of two parts,

the transmitter with an uncooled DFB laser in

a hermetic sealed coaxial module, the receiver

with an APD preamp in a hermetic sealed

coaxial module and integrated circuits for

reshaping received optical signals.

The built-in serial ID recognition is

incorporated, which allows users to interface

with two wire serial interface that displays

information on manufacturer, part number,

link, distance, and other parameters.

The Digital Diagnostic Monitoring interface is

incorporated, which monitors transceiver

parameters including Temperature, Supply

voltage, Laser bias current, Laser power and Received optical power.

2. Features

•

Small Form-factor Pluggable (SFP) MSA compliant transceiver with SONET/SDH system Quality

L-16.1/LR-1 (40km) / L-16.2/LR-2 (80km) application

155Mbps to 2.7Gbps Multi-Rate operation capability

LC duplex receptacle

Single +3.3V power supply

Differential data inputs and outputs

Operating case temperature range -5°C to +85°C / -40°C to +85°C

Comply with SFF-8472 MSA

Built-in Programmable receiver low pass filter as application select

Incorporating Digital Diagnostic Monitoring Interface with External calibration

(Internal calibration is optional)

•

Serial ID Functionality

APD receiver

Bail latch type

RoHS Compliant

UQ9-06-007 Ed:1.0 Date:10.Oct.2006

Page 1 of 16

MITSUBISHI (OPTICAL DEVICES)

MF-2500FXE Series

2.5Gbps SFP TRANSCEIVER MODULE

3. Block diagram

APD BIAS CIRCUIT

(DC/DC Converter)

Rx Received Po

Monitor Circuit

Signal Detect

Circuit

RX_LOS

APD

RD-

OPT_IN

Limiting Amp

&Low pass Fil.

RD+

TIA

ROSA

Temperature

Monitor Circuit

Control

Circuits

(DDM)

MOD_DEF [2]

MOD_DEF [1]

TX_FAULT

Supply Voltage

Monitor Circuit

LD Bias & Pout

Monitor Circuit

Memory

Fault Detector

TD-

Driver

LD

TD+

OPT_OUT

L

Bias

TX_DISABLE

Monitor

PD

circuit

TOSA

4. Absolute Maximum Ratings

Stress below listed absolute maximum rating may cause permanent damage to the module.

This is a stress only and functional operation of the module at these or any other conditions in excess of

those given in the operational sections of this data sheet.

Exposure to Absolute Maximum Rating for extended periods may affect module reliability.

Parameters

Symbol

Vcc

Tstg

Tc

Ratings

0 to +4.0

-40 to +85

-5 to +85

-40 to +85

5 to 85

Unit

V

Supply voltage

C

Storage temperature

°

C

Operating case temperature (M4*ZB)

Operating case temperature (M4*ZC)

Relative humidity (non condensation)

°

C

Tc

-

°

%

UQ9-06-007 Ed:1.0 Date:10.Oct.2006

Page 2 of 16

MITSUBISHI (OPTICAL DEVICES)

MF-2500FXE Series

2.5Gbps SFP TRANSCEIVER MODULE

5. Electrical characteristics

All parameters are specified over the operating case temperature.

Measurement conditions are at 2.48832Gbps +/-20ppm, NRZ PN2²³-1 and 50%duty cycle data signal.

The DATA input/output signal interface is AC-coupled internally.

TX_DISABLE input signal level is LVTTL compatible. (With internally pull-up 4.7k to 10kΩ)

TX_FAULT and LOS (Loss Of Signal) output are Open-Collector/drain, and the levels indicated assuming 4.7k

to 10k ohm pull up resistor to Host_Vcc is present.

Parameters

Supply voltage

Power consumption

Symbol

Vcc

Pc

V_IH

V_IL

Min.

3.13

-

2.0

Typ.

3.3

0.8

-

Max.

3.47

1.2

Vcc

0.8

Unit

V

W

V

TX_DISABLE Input voltage

0

-

V

V_OH

V_OL

V_OH

V_OL

V_OH

V_OL

V_IH

V_IL

V_T

R_T

V_O

R_O

2.0

0

2.0

0

-

Vcc

0.5

Vcc

0.5

Vcc

0.4

V

mV_P-P

Ω

mV_P-P

Ω

TX_FAULT Output voltage

RX_LOS Output voltage

Vcc × 0.8

MOD_DEF[2] Output voltage

MOD_DEF[1], [2] Input voltage

0

Vcc

Vcc × 0.3

2400

-

Vcc × 0.7

0

500

-

370

-

Input Amplitude, Differential

Input Impedance, Differential

Output Amplitude, Differential

Output Impedance, Differential

Data Output Rise/Fall Time

(20% to 80%)

Electrical Input Data Return Loss

100MHz < f < 1.2GHz(Differential)

Electrical Input Data Return Loss

1.2GHz < f < 2.7GHz(Differential)

100

-

100

1600

-

Tr/Tf

Rld1

Rld2

-

12

8

-

150

ps

dB

-

UQ9-06-007 Ed:1.0 Date:10.Oct.2006

Page 3 of 16

MITSUBISHI (OPTICAL DEVICES)

MF-2500FXE Series

2.5Gbps SFP TRANSCEIVER MODULE

6. Optical characteristics

All parameters are specified over the operating case temperature.

Measurement conditions are at 2.48832Gbps +/-20ppm, NRZ PN2²³-1 and 50%duty cycle data signal.

L-16.1 / LR-1

Transmitter

Parameter

Target Distance

Wavelength

Min.

-

1280

Max.

40

1335

Unit

Km

nm

Optical source

SLM

-

Optical power BOL (3.3V, 25degC)

Optical power EOL

Optical power when disable

Spectral width (-20dB)

SMSR

-1

-2

-

30

8.2

+3

-40

1.0

-

dBm

nm

dB

Extinction ratio

-

Optical waveform

SONET/SDH Mask compliant

-

Return Loss at S

24

-250

-

+250

1

dB

Ps/nm

dB

Chromatic Dispersion

Path penalty (note 1)

Jitter Generation (note 2)

-Bandwidth 12KHz to 20MHz

Jitter Generation (note 2)

-Bandwidth 12KHz to 20MHz

-

0.01

0.1

UIrms

UIpp

note 1: Support 40km of normal single-mode fiber.

note 2: ITU-T G.783 compliant

Optical Input Power

=Overload BOL

RxD+

Jitter Analyzer

SFP Rx

SFP Tx

Opt.

ATT

RxD-

TxD-

Opt.

ATT

TxD+

Receiver

Wavelength

Parameter

Min.

1280

Max.

1335

Unit

nm

Sensitivity BOL

-

-28

dBm

(3.3V, 25degC, BER=1E-10)

Sensitivity EOL (BER=1E-10)

Overload BOL (3.3V, 25degC)

Overload EOL

RX_LOS Assert Level

RX_LOS De-assert Level

RX_LOS Hysteresis

-

-7

-8

-38

-

-27

-

dBm

dB

-

-28

4.0

1.0

0.3

-

CID Penalty (note 1)

dB

Jitter Tolerance, Transfer

Maximum reflectance of receiver at R

ITU-T G.783 Compliant (with reference CDR)

-27

-

dB

-

note 1: Penalty between PRBS 2E23-1 and Consecutive Identical Digits according to ITU-T G957

UQ9-06-007 Ed:1.0 Date:10.Oct.2006

Page 4 of 16

MITSUBISHI (OPTICAL DEVICES)

MF-2500FXE Series

2.5Gbps SFP TRANSCEIVER MODULE

L-16.2 / LR-2

Transmitter

Parameter

Target Distance

Wavelength

Min.

-

1500

Max.

80

1580

Unit

Km

nm

Optical source

SLM

-

Optical power BOL (3.3V, 25degC)

Optical power EOL

Optical power when disable

Spectral width (-20dB)

SMSR

-1

-2

-

30

8.2

+3

-40

1.0

-

dBm

nm

dB

Extinction ratio

-

Optical waveform

SONET/SDH Mask compliant

-

Return Loss at S

24

-

+1600

2

dB

ps/nm

dB

Chromatic Dispersion

Path penalty (note 1)

Jitter Generation (note 2)

-Bandwidth 12KHz to 20MHz

Jitter Generation (note 2)

-Bandwidth 12KHz to 20MHz

-

0.01

0.1

UIrms

UIpp

note 1: Support 80km of normal single-mode fiber.

note 2: ITU-T G.783 compliant

Optical Input Power

=Overload BOL

RxD+

Jitter Analyzer

SFP Rx

SFP Tx

Opt.

ATT

RxD-

TxD-

Opt.

ATT

TxD+

Receiver

Wavelength

Parameter

Min.

1500

Max.

1580

Unit

nm

Sensitivity BOL

-

-29

dBm

(3.3V, 25degC, BER=1E-10)

Sensitivity EOL (BER=1E-10)

Overload BOL (3.3V, 25degC)

Overload EOL

RX_LOS Assert Level

RX_LOS De-assert Level

RX_LOS Hysteresis

-

-7

-8

-39

-

-28

-

dBm

dB

-

-29

4.0

1.0

0.3

-

CID Penalty (note 1)

dB

Jitter Tolerance, Transfer

Maximum reflectance of receiver at R

ITU-T G.783 Compliant (with reference CDR)

-27

-

dB

-

note 1: Penalty between PRBS 2E23-1 and Consecutive Identical Digits according to ITU-T G957

UQ9-06-007 Ed:1.0 Date:10.Oct.2006

Page 5 of 16

MITSUBISHI (OPTICAL DEVICES)

MF-2500FXE Series

2.5Gbps SFP TRANSCEIVER MODULE

7. Digital Diagnostic Monitoring Accuracy

The diagnostic monitoring features external calibration, and is calibrated over operating temperature and

voltage range. The monitor parameters are represented as defined in SFF-8472.

These parameters of the monitoring accuracy are guaranteed, as long as operating conditions of this SFP

transceiver do not exceed ranges defined below.

Digital Diagnostic Monitoring Accuracy

Parameter

Transceiver Temperature^*1

Supply Voltage

TX Bias Current

TX Optical Power

RX Optical Power

Min.

-3

Max.

+3

Unit

°C

%

dB

Range for Accurate Monitoring

-5 to 85°C(M4*ZB) / -40 to 85°C(M4*ZC)

3 to 3.6 V

-

-2 to 3 dBm

-29 to -7dBm

-10

+10

-3(-1.5*²) +3(+1.5*²)

-3(-2*²)

+3(+2*²)

*1: Transceiver Temperature is defined as an internal ambient temperature.

*2: These specs are optional.

8. Selective Bandwidth filtering function

Receiver bandwidth is selected by the Rate Select pins (7pin and 9pin).

Each bit rates for the selective bandwidth and adaptable protocols are as follows.

No. Rate Select 0 (7pin) Rate Select 1 (9pin)

Bandwidth

Full

1.25Gbps

622Mbps

155Mbps

Adaptable protocols

STM-16/OC-48, OTN-1

Gigabit Ethernet

STM-4/OC-12, ESCON

STM-1/OC-3, FDDI

1

2

3

4

Low

High

Low

High

Low

High

*Optional Bandwidth: 2.125Gbps and 1.062Gbps bandwidth can be selected by the internal setting.

9. Transceiver pin allocation

No.

1

Symbol

TX GND

TX_FAULT

Description

No.

Symbol

Description

Receiver Ground

Transmitter Ground

11 RX GND

12 RD-

2

Transmitter Fault Indication

Receiver Data Output-Bar

Receiver Data Output

Receiver Ground

3

TX_DISABLE Transmitter Disable

13 RD+

4

MOD_DEF[2]

MOD_DEF[1]

MOD_DEF[0]

Rate Select 0

RX_LOS

Module Definition 2

Module Definition 1

Module Definition 0

Rate Select pin 0

Loss of Signal

14 RX GND

15 RX Vcc

16 TX Vcc

17 TX GND

18 TD+

5

Receiver Power Supply

Transmitter Power Supply

Transmitter Ground

6

7

8

Transmitter Data in

9

Rate Select 1

Rate Select pin 1

Receiver Ground

19 TD-

Transmitter Data in-Bar

Transmitter Ground

10 RX GND

20 TX GND

UQ9-06-007 Ed:1.0 Date:10.Oct.2006

Page 6 of 16

MITSUBISHI (OPTICAL DEVICES)

MF-2500FXE Series

2.5Gbps SFP TRANSCEIVER MODULE

10. Pin Descriptions

Pin No.

Function

I/O

Pin description

1,17,20 TX GND

I

These pins are the Transmitter ground connections.

They should be connected to a low impedance ground plane (0V).

10,

11,14

16

RX GND

TX Vcc *

I

These pins are the Receiver ground connections.

They should be connected to a low impedance ground plane (0V).

This is the power supply pin for the Transceiver part.

It should be connected to +3.3V.

Recommended power supply decoupling. (See Figure 8)

15

RX Vcc *

TD+ / TD-

I

This is the power supply pin for the Receiver part.

It should be connected to +3.3V.

Recommended power supply decoupling. (See Figure 8)

* Both TX Vcc and RX Vcc have been internally connected due to supply of

control circuit Vcc.

This data input pin modulates the laser diode. When the TD+ input is asserted, the

laser diode is turned on.

18,19

They are internally AC-coupled into an equivalent load of RI differential, as shown

in Figure 8.

3

TX_DISAB

LE

I

Active high TTL input, with internal 7.4k ohm pull-up resistor to Vcc.

Asserting the transmitter disable will deactivate the laser within the assert time.

Table 1 indicates the timing of TX_DISABLE.

12,13

RD+ / RD-

O

Received Data Out and Inverted Received Data Out are differential serial output

from the receiver.

These are AC-coupled 100 ohm differential lines which should be terminated with

a 100 ohm (differential) at the user SERDES, as shown in Figure 8. AC coupling is

done inside the module and is thus not required on the host board.

Active high open collector/drain output that indicates a loss-of-signal condition

(LOS). When the average optical power received by the module is below the

Assert Level, RX_LOS is indicated.

Table 1 indicates the timing of RX_LOS. RX_LOS requires a 4.7k to 10k ohm

pull-up resistor external to the module, i.e., in the host system Host_Vcc, as shown

in Figure 8.

The pull-up voltage is between 2.0 V and VccR (VccT) + 0.3 V.

Active high open collector/drain output that indicates a fault in the module. This

can be failure of the laser diode. Under this condition, TX_FAULT will activate

and be latched. And then the laser will be deactivated within the assert time.

TX_FAULT also requires a 4.7k to 10k ohm pull-up resistor externally, i.e. in the

host system Host_Vcc, as shown in Figure 8.

8

2

RX_LOS

O

TX_FAULT

The pull-up voltage is between 2.0 V and VccT (VccR) +0.3V.

Toggling TX_DISABLE high for at least t_reset can reset it.

See Figure 8 and Figure 5.

6,5,4

MOD_DEF

[0:2]

-

This module has a serial ID function, which provides information about the

transceiver’s capabilities, standard interfaces, manufacturer and other information.

This function is provided via a two wire serial EEPROM interface.

MOD_DEF[0] is connected to ground inside the module.(LOW)

MOD_DEF[1] is the serial clock signal input. (SCL)

MOD_DEF[2] is the data output/input. (SDA)

They should be pulled up with 4.7Kohm -10Kohm resistor on the host board.

The pull-up voltage shall be VccT or VccR.

The serial ID definitions are as given in the “SFP-MSA” standard. See Figure 9.

These pins defined the bandwidth filters. 7pin/9pin setting=[*/*]:

[0/0]: Full bandwidth, [1/0]: 1.25Gbps, [0/1]: 622Mbps, [1/1]: 155Mbps

These input pins are internally pulled down to GND with 33Kohm resistor.

If this function is not used, both pins should be left open or connected to GND.

7,9

Rate Select

0, 1

I

UQ9-06-007 Ed:1.0 Date:10.Oct.2006

Page 7 of 16

MITSUBISHI (OPTICAL DEVICES)

MF-2500FXE Series

2.5Gbps SFP TRANSCEIVER MODULE

Table 1

Timing of control and status I/O

The timing of the control and status line are listed in below and Figure 1 to 7.

Parameter

TX_DISABLE Assert

Time

Symbol

Min

Max

Unit

Condition

Time from rising edge of TX_DISABLE to

when the optical output falls below 10% of

nominal

t_off

-

10

μs

TX_DISABLE Negate

Time

Time from falling edge of TX_DISABLE to

when the modulated optical output rises

above 90% of nominal

t_on

-

1

ms

Time to Initialize,

Including Reset of

TX_FAULT

TX_FAULT Assert

Time

From power on or negation of TX_FAULT

using TX_DISABLE

t_init

-

300

100

ms

Time from fault to TX_FAULT on

T_fault

μs

TX_DISABLE to Reset

Time TX_DISABLE must be held high to

reset TX_FAULT

Time from LOS state to RX_LOS Assert

Time from non-LOS state to RX_LOS

T_reset

t_losson

t_lossoff

f_clock

10

-

μs

RX_LOS Assert Time

RX_LOS Negate Time

100

-

μs

de-assert

Serial ID Clock Rate

-

kHz

-

Figure 1

Power on initialization of SFP transceiver, TX_DISABLE negated

Figure 2

Power on initialization of SFP transceiver, TX_DISABLE asserted

Figure 3

SFP TX_DISABLE timing during normal operation

UQ9-06-007 Ed:1.0 Date:10.Oct.2006

Page 8 of 16

MITSUBISHI (OPTICAL DEVICES)

MF-2500FXE Series

2.5Gbps SFP TRANSCEIVER MODULE

Figure 4

Detection of transmitter fault condition

Figure 5

Successful recovery from transient fault condition

Figure 6

Unsuccessful recovery from fault condition

Figure 7

Timing of RX_LOS detection

UQ9-06-007 Ed:1.0 Date:10.Oct.2006

Page 9 of 16

MITSUBISHI (OPTICAL DEVICES)

MF-2500FXE Series

2.5Gbps SFP TRANSCEIVER MODULE

Figure 8

SFP Module

Host Board

Protocol Vcc

TD+

LASER

DRIVER

100 ohm

TD-

4.7k to 10k

ohm

TX_FAULT

TX_DISABLE

TX GND

TX Vcc

7.4k ohm

1 uH

0.1 uF

10 uF

1 uH

+3.3V

RX Vcc

PROTOCOL

IC

0.1 uF 10 uF

SERDES

IC

0.1 uF 10 uF

RX GND

RD+

PREAMP

&

POSTAMP

100 ohm

RD-

RX_LOS

Rate Select 0

Rate Select 1

4.7k to 10k

ohm

+3.3V

33k ohm

4.7k to 10k

ohm

4.7k to 10k

ohm

MOD_DEF[0]

MOD_DEF[1]

MOD_DEF[2]

PLD/PAL

SERIAL ID

4.7k to 10k

ohm

Example of SFP Host Board Schematic

UQ9-06-007 Ed:1.0 Date:10.Oct.2006

Page 10 of 16

MITSUBISHI (OPTICAL DEVICES)

MF-2500FXE Series

2.5Gbps SFP TRANSCEIVER MODULE

Figure 9-1

Serial ID Table [L16.1]

Data

Address

0

Data

[HEX]

03

Data

Address

64

Data

[HEX]

00

Name of Field

ASCII

Name of Field

ASCII

Identifier

Ext. Identifier

Connector

Options

1

2

04

07

00

14

00

03

19

00

28

FF

00

4D

49

54

53

55

42

49

53

48

49

20

45

4C

45

43

20

00

08

00

70

4D

46

2D

32

35

30

46

58

45

2D

4D

34

31

5A

42 / 43

65

66

67

68

69

70

71

72

73

74

75

76

77

78

79

80

81

82

83

84

85

86

87

88

89

90

91

Options

1A

BR, max

00

3

Transceiver

Encoding

BR, min

00

4

Vendor SN

Date code

note 2

note 3

58

*

5

6

7

8

9

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

25

26

27

28

29

30

31

32

33

34

35

36

37

38

39

40

41

42

43

44

45

46

47

48

49

50

51

52

53

54

55

56

57

58

59

60

61

62

63

BR, Nominal

Reserved

Length(9um)-km

Length(9um)

Length(50um)

Length(62.5um)

Length(Copper)

Reserved

Vendor name

Reserved

M

I

T

S

U

B

I

S

H

92 Diagnostic Monitoring Type

93 Enhanced Options

94 SFF-8472 Compliance

I

F0

SPACE

01

E

95

96

CC_EXT

note 1

note 4

L

Vendor Specific

E

C

97

98

SPACE

99

100

101

102

103

104

105

106

107

108

109

110

111

112

113

114

115

116

117

118

119

120

121

122

123

124

125

126

127

Vendor OUI

Vendor PN

Vendor rev

Wavelength

Reserved

M

F

-

2

5

0

F

X

E

-

M

4

1

Z

B / C

05

1E

00

CC_BASE

note 1

note 1 : This code is check sum code.

note 2 : These address shows unique device serial number.

note 3 : These address shows date code.

note 4 : These address are vendor specific area. Read only.

UQ9-06-007 Ed:1.0 Date:10.Oct.2006

Page 11 of 16

MITSUBISHI (OPTICAL DEVICES)

MF-2500FXE Series

2.5Gbps SFP TRANSCEIVER MODULE

Figure9-2

Serial ID Table [L16.2]

Data

Address

0

Data

[HEX]

03

Data

Address

64

Data

[HEX]

00

Name of Field

ASCII

Name of Field

ASCII

Identifier

Ext. Identifier

Connector

Options

1

2

04

65

66

67

68

69

70

71

72

73

74

75

76

77

78

79

80

81

82

83

84

85

86

87

88

89

90

91

Options

1A

07

00

OC

00

03

19

00

50

FF

00

4D

49

54

53

55

42

49

53

48

49

20

45

4C

45

43

20

00

08

00

70

4D

46

2D

32

35

30

46

58

45

2D

4D

34

32

5A

42 / 43

BR, max

00

3

Transceiver

Encoding

BR, min

00

4

Vendor SN

Date code

note 2

note 3

58

*

5

6

7

8

9

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

25

26

27

28

29

30

31

32

33

34

35

36

37

38

39

40

41

42

43

44

45

46

47

48

49

50

51

52

53

54

55

56

57

58

59

60

61

62

63

BR, Nominal

Reserved

Length(9um)-km

Length(9um)

Length(50um)

Length(62.5um)

Length(Copper)

Reserved

Vendor name

Reserved

M

I

T

S

U

B

I

S

H

92 Diagnostic Monitoring Type

93 Enhanced Options

94 SFF-8472 Compliance

I

F0

SPACE

01

E

95

96

CC_EXT

note 1

note 4

L

Vendor Specific

E

C

97

98

SPACE

99

100

101

102

103

104

105

106

107

108

109

110

111

112

113

114

115

116

117

118

119

120

121

122

123

124

125

126

127

Vendor OUI

Vendor PN

Vendor rev

Wavelength

Reserved

M

F

-

2

5

0

F

X

E

-

M

4

2

Z

B / C

06

0E

00

CC_BASE

note 1

note 1 : This code is check sum code.

note 2 : These address shows unique device serial number.

note 3 : These address shows date code.

note 4 : These address are vendor specific area. Read only.

UQ9-06-007 Ed:1.0 Date:10.Oct.2006

Page 12 of 16

MITSUBISHI (OPTICAL DEVICES)

MF-2500FXE Series

2.5Gbps SFP TRANSCEIVER MODULE

11. Type Number

a) Operating Case Temperature: –5 to +85°C(Extended Temperature) Version

L-16.1 : MF–2500FXE–M41ZB

L-16.2 : MF–2500FXE–M42ZB

b) Operating Case Temperature: –40 to +85°C(Industrial Temperature) Version

L-16.1 : MF–2500FXE–M41ZC

L-16.2 : MF–2500FXE–M42ZC

12. Implemented Digital Diagnostic Monitoring options

RATE SELECT (7 & 9 pin : refer to Section 8. Selective Bandwidth filtering function)

TX_DISABLE (3pin)

TX_FAULT (2pin)

Los Of Signal (8pin)

Alarm/warning flags

Soft TX_DISABLE control and monitoring

Soft TX_FAULT monitoring

Soft RX_LOS monitoring

13. Reliability reference

Telcordia GR-468-CORE

Radiated Emission:IEC61000-6-3

Immunity:IEC61000-4-2, IEC61000-4-3

Flammability:UL94V-0

ESD for PIN Interface: 500V by Human body model (with Rd=1500ohm and Cd=100pF)

14. Laser Safety Information

Class 1 Laser Product (IEC60825 and CDRH compliant)

UQ9-06-007 Ed:1.0 Date:10.Oct.2006

Page 13 of 16

MITSUBISHI (OPTICAL DEVICES)

MF-2500FXE Series

2.5Gbps SFP TRANSCEIVER MODULE

15. Data sheet

Data sheet which is attached the SFP includes the below parameters.

Condition:

T-ambient 25deg.

Nominal Voltage

Data rate 2.48832Gbps

Data pattern PRBS2E23-1

Parameters:

・ Optical Output Power

・ Wavelength

・ Spectral Width

・ Supply Current

・ Receiver Sensitivity

・ Receiver Overload

16. General Outline Drawing

[unit: mm]

UQ9-06-007 Ed:1.0 Date:10.Oct.2006

Page 14 of 16

MITSUBISHI (OPTICAL DEVICES)

MF-2500FXE Series

2.5Gbps SFP TRANSCEIVER MODULE

17. Packing

Ten SFPs are packed up in this packing box.

Presses Plate

SFP

Dust Cap

Packing box

- Capacity: 10pcs. / box

- Packing box and Presses Plate material:

Cardboard with ESD protection coat.

This product is sensitive to electrostatic discharge. Take precautions to prevent ESD; use wrist straps,

grounded work surfaces and recognized anti-static techniques when handling SFP module.

Mitsubishi reserves the right to change the circuitry and specifications without notice at any time.

No liability is assumed as a result of their use or application. No rights under any patent accompany

the sale of any such product(s) or information.

UQ9-06-007 Ed:1.0 Date:10.Oct.2006

Page 15 of 16

MITSUBISHI (OPTICAL DEVICES)

MF-2500FXE Series

2.5Gbps SFP TRANSCEIVER MODULE

Safety Cautions for Use of Optoelectronic Devices

General:

Although the manufacturer is always striving to improve the reliability of its product, problems and errors may occur with semiconductor products.

Therefore, the user's products are required to be designed with full safety regard to prevent any accidents that result in injury, death, fire or

environmental damage even when semiconductor products happen to error. Especially it is recommended to take in consideration about redundancy, fire

prevention, error prevention safeguards. And the following requirements must be strictly observed.

Warning!

1. Eye safety : Semiconductor laser radiates laser light during operation. Laser light is very dangerous when shot directly into human eyes. Don't look

at laser light directly, or through optics such as a lens. The laser light should be observed using the ITV camera, IR-viewer, or other appropriate

instruments.

2. Product handling : The product contains GaAs (gallium arsenide). It is safe for regular use, but harmful to the human body if made into powder

or steam. Be sure to avoid dangerous process like smashing, burning, chemical etching. Never put this product in one's mouth or swallow it.

3. Product disposal : This product must be disposed of as special industrial waste. It is necessary to separate it from general industrial waste and

general garbage.

Handling Cautions for Optoelectronic Devices

1. General:

(1) The products described in this specification are designed and manufactured for use in general communication systems or electronic devices, unless

their applications or reliability are otherwise specified. Therefore, they are not designed or manufactured for installation in devices or systems that

may affect human life or that are used in social infrastructure requiring high reliability.

(2) When the customer is considering to use the products in special applications, such as transportation systems (automobiles, trains, vessels), medical

equipments, aerospace, nuclear power control, and submarine repeaters or systems, please contact Mitsubishi Electric or an authorized distributor.

2. Shipping Conditions:

(1) During shipment, place the packing boxes in the correct direction, and fix them firmly to keep them immovable. Placing the boxes upside down,

tilting, or applying abnormal pressure onto them may cause deformation in the electrode terminals, breaking of optical fiber, or other problems.

(2) Never throw or drop the packing boxes. Hard impact on the boxes may cause break of the devices.

(3) Take strict precautions to keep the devices dry when shipping under rain or snow.

3. Storage Conditions:

When storing the products, it is recommended to store them following the conditions described below without opening the packing. Not taking

enough care in storing may result in defects in electrical characteristics, soldering quality, visual appearance, and so on. The main points are described

below (if special storage conditions are given to the product in the specification sheet, they have priority over the following general cautions):

(1) Appropriate temperature and humidity conditions, i.e., temperature range between 5~30°C, and humidity between 40~60 percent RH, should be

maintained in storage locations. Controlling the temperature and humidity within this range is particularly important in case of long-term storage for

six months or more.

(2) The atmosphere should be particularly free from toxic gases and dust.

(3) Do not apply any load on the product.

(4) Do not cut or bend the leads of the devices which are to be stored. This is to prevent corrosion in the cut or bent part of the lead causing soldering

problems in the customer’s assembling process.

(5) Sudden change in temperature may cause condensation in the product or packing, therefore, such locations should be avoided for storing.

Temperature in storage locations should be stable.

(6) When storing ceramic package products for extended periods of time, the leads may turn reddish due to reaction with sulfur in the atmosphere.

(7) Storage conditions for bare chip and unsealed products shall be stated separately because bare chip and unsealed products require stricter controls

than package sealed products.

4. Design Conditions and Environment under Use:

(1) Avoid use in locations where water or organic solvents adhere directly to the product, or where there is any possibility of the generation of corrosive

gas, explosive gas, dust, salinity, or other troublesome conditions. Such environments will not only significantly lower the reliability, but also may

lead to serious accidents.

(2) Operation in excess of the absolute maximum ratings can cause permanent damage to the device. The customers are requested to design not to exceed

those ratings even for a short time.

5. ESD Safety Cautions:

The optoelectronic devices are sensitive to static electricity (ESD, electro-static discharge). The product can be broken by ESD. When handling this

product, please observe the following countermeasures:

To prevent break of devices by static electricity or surge, please adopt the following countermeasures in the assembly line:

(1) Ground all equipments, machinery jigs, and tools in the process line with earth wires installed in them. Take particular care with hot plates, solder

irons and other items for which the commercial power supplies are prone to leakage.

(2) Workers should always use earth bands. Use of antistatic clothing, electric conductive shoes, and other safety equipment while at work is highly

recommended.

(3) Use conductive materials for this product’s container, etc.

(4) It is recommended that grounding mats be placed on the surfaces of assembly line workbench and the surrounding floor in work area, etc.

(5) When mounting this product in parts or materials which can be electrically charged (printed wiring boards, plastic products, etc.), pay close attention

to the static electricity in those parts. ESD may damage the product.

(6) Humidity in working environment should be controlled to be 40 percent RH or higher. These countermeasures are most general, and there is a need to

carefully confirm the line before starting mass production using this product (in the trial production, etc.). It is extremely important to prevent surge,

eliminate it rapidly, and prevent it from spreading.

The end of document

UQ9-06-007 Ed:1.0 Date:10.Oct.2006

Page 16 of 16


型号：	MF-2500FXE-M42ZB
厂家：	Mitsubishi Group
描述：	2.5Gbps SFP TRANSCEIVER MODULE 2.5Gbps的SFP收发器模块
文件：	总16页 (文件大小：308K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

MF-2500FXE-M42ZB [MITSUBISHI]

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