MGF0918A_04 [MITSUBISHI]

L & S BAND GaAs FET; L& S波段砷化镓场效应管
MGF0918A_04
型号: MGF0918A_04
厂家: Mitsubishi Group    Mitsubishi Group
描述:

L & S BAND GaAs FET
L& S波段砷化镓场效应管

文件: 总4页 (文件大小:47K)
中文:  中文翻译
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MITSUBISHI SEMICONDUCTOR<GaAs FET>  
MGF0918A  
L & S BAND GaAs FET [ SMD non matched ]  
DESCRIPTION  
The MGF0918A GaAs FET with an N-channel schottky  
Gate, is designed for use UHF band amplifiers.  
FEATURES  
· High output power  
Po=27dBm(TYP.) @f=1.9GHz,Pin=8dBm  
· High power gain  
Gp=20dB(TYP.) @f=1.9GHz  
· High power added efficiency  
hadd=45%(TYP.) @f=1.9GHz,Pin=8dBm  
· Hermetic Package  
APPLICATION  
· For UHF Band power amplifiers  
Fig.1  
QUALITY  
· GG  
RECOMMENDED BIAS CONDITIONS  
· Vds=10V · Ids=150mA · Rg=1kW  
Delivery  
-01:Tape & Reel(1K), -03:Trai(50pcs)  
Absolute maximum ratings (Ta=25°C)  
Symbol  
VGSO  
Parameter  
Ratings  
Unit  
V
Gate to source  
breakdown voltage  
-15  
-15  
VGDO Gate to drain breakdown voltage  
V
ID  
Drain current  
400  
mA  
mA  
mA  
W
IGR  
IGF  
PT  
Reverse gate current  
Forward gate current  
Total power dissipation  
Cannel temperature  
Storage temperature  
-1.2  
5.0  
3
Tch  
Tstg  
175  
°C  
°C  
-65 to +175  
Electrical characteristics  
(Ta=25°C)  
Symbol  
Parameter  
Test conditions  
Limits  
Typ.  
300  
-
Unit  
Min.  
Max.  
Saturated drain current  
Gate to source cut-off voltage  
Transconductance  
Output power  
VDS=3V,VGS=0V  
-
-1.0  
-
400  
mA  
V
IDSS  
VDS=3V,ID=1.0mA  
-5.0  
VGS(off)  
gm  
VDS=3V,ID=150mA  
VDS=10V,ID=150mA,f=1.9GHz  
Pin=8dBm  
130  
27  
-
-
mS  
dBm  
%
Po  
25  
-
hadd  
GLP  
NF  
Power added Efficiency  
Linear Power Gain  
Noise figure  
35  
-
VDS=10V,ID=150mA,f=1.9GHz  
18  
-
20  
-
dB  
1.0  
35  
-
dB  
Rth(ch-c) Thermal Resistance *1  
*1:Channel to case /  
DVf Method  
-
50  
°C/W  
Above parameters, ratings, limits are subject to change.  
Mitsubishi Electric  
June/2004  
MGF0918A TYPICAL CHARACTERISTICS  
Po,Gp,PAE vs.Pin  
35  
70  
60  
50  
40  
30  
20  
10  
0
Vds=10V  
Id(off)=150mA  
f=1.9GHz  
30  
Po  
25  
20  
15  
10  
5
PAE  
Gp  
0
-10  
-5  
0
5
10  
15  
Pin(dBm)  
Pi(SCL) vs. Po(SCL), IM3  
30  
30  
V D = 1 0 V  
25  
20  
15  
10  
5
20  
ID=150mA  
f 1 = 1 . 9 0 G H z  
f 2 = 1 . 9 1 G H z  
Po  
10  
0
-10  
-20  
-30  
-40  
-50  
-60  
-70  
I M 3  
0
-5  
-10  
-15  
-20  
-20  
-15  
-10  
-5  
0
5
10  
15  
Pin(SCL)(dBm)  
Mitsubishi Electric  
June/2004  
MGF0918A S PARAMETERS  
°
(Ta=25 C, VD=10V,ID=150mA, Reference Plane see Fig.1)  
freq.  
(MHz)  
S11  
S21  
S12  
S22  
K
MAG/MSG  
(dB)  
(mag)  
(ang)  
(mag)  
(ang)  
(mag)  
(ang)  
(mag)  
(ang)  
600  
1000  
1400  
1800  
2200  
2600  
3000  
3400  
3800  
4200  
4600  
5000  
5400  
5800  
6200  
6600  
7000  
7400  
7800  
8200  
8600  
9000  
9400  
9800  
10200  
10600  
11000  
11400  
11800  
12200  
0.966  
0.939  
0.919  
0.905  
0.897  
0.892  
0.890  
0.889  
0.888  
0.886  
0.883  
0.877  
0.868  
0.856  
0.840  
0.820  
0.797  
0.771  
0.743  
0.713  
0.674  
0.618  
0.545  
0.485  
0.475  
0.535  
0.640  
0.730  
0.813  
0.876  
-47.70  
-72.11  
-90.91  
6.220  
5.269  
4.470  
3.805  
3.257  
2.811  
2.453  
2.168  
1.946  
1.775  
1.647  
1.553  
1.489  
1.448  
1.427  
1.423  
1.433  
1.457  
1.491  
1.536  
1.587  
1.643  
1.699  
1.748  
1.782  
1.788  
1.753  
1.656  
1.473  
1.176  
142.02  
120.98  
103.95  
89.91  
78.05  
67.78  
58.64  
50.31  
42.56  
35.21  
28.16  
21.31  
14.56  
7.83  
0.015  
0.021  
0.024  
0.026  
0.026  
0.025  
0.024  
0.024  
0.023  
0.023  
0.022  
0.023  
0.024  
0.025  
0.027  
0.029  
0.031  
0.035  
0.038  
0.042  
0.047  
0.053  
0.058  
0.064  
0.071  
0.077  
0.082  
0.086  
0.088  
0.087  
56.75  
41.10  
27.49  
15.71  
5.60  
0.302  
0.360  
0.426  
0.492  
0.553  
0.606  
0.651  
0.687  
0.716  
0.738  
0.754  
0.768  
0.779  
0.788  
0.797  
0.806  
0.814  
0.820  
0.824  
0.824  
0.818  
0.806  
0.786  
0.759  
0.723  
0.678  
0.636  
0.609  
0.607  
0.636  
-56.49  
-78.28  
-94.16  
0.21  
0.29  
0.36  
0.42  
0.49  
0.60  
0.70  
0.76  
0.86  
0.93  
1.07  
1.10  
1.15  
1.20  
1.20  
1.18  
1.21  
1.12  
1.12  
1.13  
1.19  
1.27  
1.40  
1.47  
1.45  
1.38  
1.22  
1.15  
1.14  
1.19  
26.18  
24.00  
22.70  
21.65  
20.98  
20.51  
20.09  
19.56  
19.27  
18.87  
17.15  
16.35  
15.58  
14.90  
14.51  
14.33  
13.88  
14.06  
13.86  
13.40  
12.62  
11.77  
10.90  
10.32  
10.00  
10.00  
10.44  
10.47  
9.96  
-105.49  
-116.96  
-126.16  
-133.71  
-140.07  
-145.57  
-150.45  
-154.92  
-159.19  
-163.52  
-168.29  
-173.99  
177.60  
172.89  
162.95  
154.14  
146.69  
137.66  
123.53  
102.00  
73.05  
-105.68  
-114.07  
-120.27  
-125.02  
-128.82  
-132.05  
-134.94  
-137.64  
-140.24  
-142.75  
-145.19  
-147.53  
-149.77  
-151.90  
-153.92  
-155.84  
-157.68  
-159.47  
-161.21  
-162.88  
-164.44  
-165.75  
-166.62  
-166.73  
-165.59  
-162.55  
-156.74  
-3.00  
-10.20  
-16.12  
-20.89  
-24.64  
-27.52  
-29.72  
-31.42  
-32.85  
-34.23  
-35.84  
-37.92  
-40.74  
-44.55  
-49.58  
-56.03  
-64.03  
-73.66  
-84.89  
-97.58  
1.01  
-6.02  
-13.41  
-21.33  
-29.97  
-39.52  
-50.18  
-62.15  
-75.56  
-90.54  
-107.10  
-125.18  
-144.56  
-164.88  
177.63  
160.67  
39.23  
5.13  
-23.88  
-43.68  
-54.21  
-63.08  
-111.47  
-126.11  
-140.87  
-154.90  
-167.09  
8.65  
2.0  
0.8  
Gate Mark  
Round corner  
0.80  
Gate Mark  
(1)  
(1)  
Reference Plane  
Reference Plane  
(3)  
(2)  
0.6  
(2)  
0.25  
4.00  
2.5  
BACK SIDE PATTERN  
(1) Gate  
(2) Drain  
(3) Source  
(Unit:mm)  
Fig.1 OUTLINE DRAWING  
Mitsubishi Electric  
June/2004  
MITSUBISHI SEMICONDUCTOR<GaAs FET>  
MGF0918A  
L & S BAND GaAs FET [ SMD non matched ]  
Requests Regarding Safety Designs  
Mitsubishi Electric constantly strives to raise the level of its quality and reliability. Despite these concerted efforts,  
however, there will be occasions when our semiconductor products suffer breakdowns, malfunctions or other  
problems. In view of this reality, it is requested that every feasible precaution be taken in the pursuit of redundancy  
design, malfunction prevention design and other safety-related designs, to prevent breakdowns or malfunctions in our  
products from resulting in accidents involving people, fires, social losses or other problems, thereby upholding the  
highest levels of safety in the products when in use by customers.  
Matters of Importance when Using these Materials  
1. These materials are designed as reference materials to ensure that all customers purchase Mitsubishi Electric  
semiconductors best suited to their specific use applications. Please be aware, however, that the technical  
information contained in these materials does not comprise consent for the execution or use of intellectual property  
rights or other rights owned by Mitsubishi Electric Corporation.  
2. Mitsubishi Electric does not assume responsibility for damages resulting from the use of product data, graphs,  
charts, programs, algorithms or other applied circuit examples described in these materials, or for the infringement  
of the rights of third-party owners resulting from such use.  
3. The data, graphs, charts, programs, algorithms and all other information described in these materials were current  
at the issue of these materials, with Mitsubishi Electric reserving the right to make any necessary updates or  
changes in the products or specifications in these materials without prior notice. Before purchasing Mitsubishi  
Electric semiconductor products, therefore, please obtain the latest available information from Mitsubishi Electric  
directly or an authorized dealer.  
4. Every possible effort has been made to ensure that the information described in these materials is fully accurate.  
However, Mitsubishi Electric assumes no responsibility for damages resulting from inaccuracies occurring within  
these materials.  
5. When using the product data, technical contents indicated on the graphs, charts, programs or algorithms described  
in these materials, assessments should not be limited to only the technical contents, programs and algorithm units.  
Rather, it is requested that ample evaluations be made of each individual system as a whole, with the customer  
assuming full responsibility for decisions on the propriety of application. Mitsubishi Electric does not accept  
responsibility for the propriety of application.  
6. The products described in these materials, with the exception of special mention concerning use and reliability, have  
been designed and manufactured with the purpose of use in general electronic machinery. Accordingly these  
products have not been designed and manufactured with the purpose of application in machinery or systems that will  
be used under conditions that can affect human life, or in machinery or systems used in social infrastructure that  
demand a particularly high degree of reliability. When considering the use of the products described in these  
materials in transportation machinery (automobiles, trains, vessels), for objectives related to medical treatment,  
aerospace, nuclear power control, submarine repeaters or systems or other specialized applications, please consult  
with Mitsubishi Electric directly or an authorized dealer.  
7. When considering use of products for purposes other than the specific applications described in these materials,  
please inquire at Mitsubishi Electric or an authorized dealer.  
8. The prior consent of Mitsubishi Electric in writing is required for any reprinting or reproduction of these materials.  
9. Please direct any inquiries regarding further details of these materials, or any other comments or matters of attention,  
to Mitsubishi Electric or an authorized dealer.  
Mitsubishi Electric  
June/2004  

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