RA08N1317M-101 [MITSUBISHI]
RoHS Compliance , 135-175MHz 8W 9.6V, 2 Stage Amp. For PORTABLE RADIO; 符合RoHS标准， 135-175MHz 8W 9.6V ， 2级放大器。用于便携式无线电
| 型号： | RA08N1317M-101 |
| 厂家： | 
Mitsubishi Group |
| 描述： | RoHS Compliance , 135-175MHz 8W 9.6V, 2 Stage Amp. For PORTABLE RADIO |
| 文件： | 总8页 (文件大小：231K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MITSUBISHI RF MOSFET MODULE
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
RA08N1317M
RoHS Compliance , 135-175MHz 8W 9.6V, 2 Stage Amp. For PORTABLE RADIO
DESCRIPTION
BLOCK DIAGRAM
The RA08N1317M is a 8-watt RF MOSFET Amplifier Module
2
3
for 9.6-volt portable radios that operate in the 135- to 175-MHz
range.
The battery can be connected directly to the drain of the
enhancement-mode MOSFET transistors. Without the gate
voltage (VGG=0V), only a small leakage current flows into the
drain and the RF input signal attenuates up to 60 dB. The output
power and drain current increase as the gate voltage increases.
With a gate voltage around 2.5V (minimum), output power and
drain current increases substantially. The nominal output power
becomes available at 3V (typical) and 3.5V (maximum). At
VGG=3.5V, the typical gate current is 1 mA.
1
4
5
This module is designed for non-linear FM modulation, but may
also be used for linear modulation by setting the drain quiescent
current with the gate voltage and controlling the output power
with the input power.
1
RF Input (Pin)
2
3
4
5
Gate Voltage (VGG), Power Control
Drain Voltage (VDD), Battery
FEATURES
RF Output (Pout
)
• Enhancement-Mode MOSFET Transistors
(IDD≅0 @ VDD=9.6V, VGG=0V)
RF Ground (Case)
PACKAGE CODE: H46S
• Pout>8W @ VDD=9.6V, VGG=3.5V, Pin=20mW
• ηT>50% @ Pout=8W (VGG control), VDD=9.6V, Pin=20mW
• Broadband Frequency Range: 135-175MHz
• Low-Power Control Current IGG=1mA (typ) at VGG=3.5V
• Module Size: 30 x 10 x 5.4 mm
• Linear operation is possible by setting the quiescent drain
current with the gate voltage and controlling the output power
with the input power
RoHS COMPLIANCE
• RA08N1317M-101 is a RoHS compliant products.
• RoHS compliance is indicate by the letter “G” after the Lot Marking.
• This product include the lead in the Glass of electronic parts and the
lead in electronic Ceramic parts.
How ever ,it applicable to the following exceptions of RoHS Directions.
1.Lead in the Glass of a cathode-ray tube, electronic parts, and
fluorescent tubes.
2.Lead in electronic Ceramic parts.
ORDERING INFORMATION:
ORDER NUMBER
RA08N1317M-101
SUPPLY FORM
Antistatic tray,
25 modules/tray
RA08N1317M
24 Jan 2006
MITSUBISHI ELECTRIC
1/8
MITSUBISHI RF POWER MODULE
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
RoHS COMPLIANCE RA08N1317M
MAXIMUM RATINGS (Tcase=+25°C, unless otherwise specified)
SYMBOL PARAMETER
CONDITIONS
RATING
UNIT
VDD
VDD
VGG
Pin
Drain Voltage
Drain Voltage
Gate Voltage
Input Power
VGG=0V, Pin=0W
VGG<3.5V
16
V
V
13.2
VDD<9.6V, Pin<20mW
4
30
V
mW
W
f=135-175MHz,
ZG=ZL=50Ω
Pout
Output Power
10
Tcase(OP) Operation Case Temperature Range
Tstg Storage Temperature Range
The above parameters are independently guaranteed.
-30 to +90
-40 to +110
°C
°C
ELECTRICAL CHARACTERISTICS (Tcase=+25°C, ZG=ZL=50Ω, unless otherwise specified)
SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNIT
f
Frequency Range
Output Power
Total Efficiency
2nd Harmonic
Input VSWR
135
8
175
MHz
W
Pout
ηT
V
DD=9.6V,VGG=3.5V, Pin=20mW
out=8W (VGG control),
50
%
P
2fo
ρin
-25
4:1
dBc
—
VDD=9.6V,
Pin=20mW
IGG
Gate Current
1
mA
VDD=4.8-13.2V, Pin=10-30mW, Pout<8W (VGG control),
Load VSWR=4:1
—
—
Stability
No parasitic oscillation
—
—
VDD=13.2V, Pin=20mW, Pout=8W (VGG control),
Load VSWR Tolerance
No degradation or destroy
Load VSWR=20:1
All parameters, conditions, ratings, and limits are subject to change without notice.
RA08N1317M
24 Jan 2006
MITSUBISHI ELECTRIC
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MITSUBISHI RF POWER MODULE
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
RoHS COMPLIANCE RA08N1317M
TYPICAL PERFORMANCE (Tcase=+25°C, ZG=ZL=50Ω, unless otherwise specified)
OUTPUT POWER, TOTAL EFFICIENCY,
and INPUT VSWR versus FREQUENCY
2nd, 3rd HARMONICS versus FREQUENCY
14
1
1
100
80
-20
-30
-40
-50
-60
-70
VDD=9.6V
Pout @VGG=3.5V
12
10
8
Pin=20mW
2
nd @Pout=8W
ηT @Pout=8W
6
60
VDD=9.6V
4
40
Pin=20mW
3rd @Pout=8W
ρin @Pout=8W
2
20
0
0
130
140
150
160
170
180
130
140
150
160
170
180
FREQUENCY f(MHz)
FREQUENCY f(MHz)
OUTPUT POWER, POWER GAIN and
OUTPUT POWER, POWER GAIN and
DRAIN CURRENT versus INPUT POWER
DRAIN CURRENT versus INPUT POWER
50
40
30
20
10
0
5
50
5
4
3
2
1
0
Pout
Gp
Pout
Gp
4
3
2
1
0
40
30
20
10
0
f=135MHz,
VDD=9.6V,
IDD
IDD
f=160MHz,
VDD=9.6V,
V
GG=3.5V
VGG=3.5V
-15 -10 -5
0
5
10 15 20
-15 -10 -5
0
5
10 15 20
INPUT POWER Pin(dBm)
OUTPUT POWER, POWER GAIN and
DRAIN CURRENT versus INPUT POWER
INPUT POWER Pin(dBm)
50
40
30
20
10
0
5
4
3
2
1
0
Gp
Pout
IDD
f=175MHz,
DD=9.6V,
GG=3.5V
V
V
-15 -10 -5
0
5
10 15 20
INPUT POWER Pin(dBm)
OUTPUT POWER and DRAIN CURRENT
versus DRAIN VOLTAGE
OUTPUT POWER and DRAIN CURRENT
versus DRAIN VOLTAGE
25
5
4
3
2
1
0
25
5
4
3
2
1
0
f=160MHz,
f=135MHz,
GG=3.5V,
V
GG=3.5V,
V
20
15
10
5
20
15
10
5
Pin=20mW
Pin=20mW
Pout
Pout
IDD
IDD
0
0
2
4
6
8
10
12
2
4
6
8
10
12
DRAIN VOLTAGE VDD(V)
DRAIN VOLTAGE VDD(V)
RA08N1317M
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MITSUBISHI ELECTRIC
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MITSUBISHI RF POWER MODULE
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
RoHS COMPLIANCE RA08N1317M
TYPICAL PERFORMANCE (Tcase=+25°C, ZG=ZL=50Ω, unless otherwise specified)
OUTPUT POWER and DRAIN CURRENT
versus DRAIN VOLTAGE
25
20
15
10
5
5
4
3
2
1
0
f=175MHz,
VGG=3.5V,
P
in=20mW
Pout
IDD
0
2
4
6
8
10
12
DRAIN VOLTAGE VDD(V)
OUTPUT POWER and DRAIN CURRENT
versus GATE VOLTAGE
OUTPUT POWER and DRAIN CURRENT
versus GATE VOLTAGE
14
7
6
5
4
3
2
1
0
14
7
6
5
4
3
2
1
0
f=135MHz,
f=160MHz,
12
10
8
12
10
8
V
P
DD=9.6V,
in=20mW
V
P
DD=9.6V,
in=20mW
Pout
Pout
6
6
IDD
IDD
4
4
2
2
0
0
1
1.5
2
2.5
3
3.5
4
1
1.5
2
2.5
3
3.5
4
GATE VOLTAGE VGG(V)
GATE VOLTAGE VGG(V)
OUTPUT POWER and DRAIN CURRENT
versus GATE VOLTAGE
14
7
6
5
4
3
2
1
0
f=175MHz,
12
10
8
V
P
DD=9.6V,
in=20mW
Pout
6
IDD
4
2
0
1
1.5
2
2.5
3
3.5
4
GATE VOLTAGE VGG(V)
RA08N1317M
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MITSUBISHI ELECTRIC
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MITSUBISHI RF POWER MODULE
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
RoHS COMPLIANCE RA08N1317M
OUTLINE DRAWING (mm)
30.0 ±0.2
26.6 ±0.2
21.2 ±0.2
(1.7)
(4.4)
2-R1.5 ±0.1
5
1
2
3
4
Ø0.45 ±0.15
6.1 ±1
13.7 ±1
18.8 ±1
23.9 ±1
(19.2)
1 RF Input (Pin)
2 Gate Voltage (VGG
)
3 Drain Voltage (VDD)
4 RF Output (Pout)
5 RF Ground (Case)
RA08N1317M
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MITSUBISHI ELECTRIC
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MITSUBISHI RF POWER MODULE
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
RoHS COMPLIANCE RA08N1317M
TEST BLOCK DIAGRAM
Power
Meter
Spectrum
Analyzer
DUT
5
1
2
3
4
ZG=50Ω
ZL=50Ω
Power
Meter
Signal
Generator
Pre-
amplifier
Directional
Coupler
Directional
Coupler
Attenuator
Attenuator
Attenuator
C1
C2
-
+
+
-
DC Power
Supply VGG
DC Power
Supply VDD
C1, C2: 4700pF, 22uF in parallel
1 RF Input (Pin)
2 Gate Voltage (VGG
)
3 Drain Voltage (VDD)
4 RF Output (Pout)
5 RF Ground (Case)
EQUIVALENT CIRCUIT
3
2
1
4
5
RA08N1317M
24 Jan 2006
MITSUBISHI ELECTRIC
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MITSUBISHI RF POWER MODULE
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
RoHS COMPLIANCE RA08N1317M
PRECAUTIONS, RECOMMENDATIONS, and APPLICATION INFORMATION:
Construction:
This module consists of an alumina substrate soldered onto a copper flange. For mechanical protection, a plastic
cap is attached with silicone. The MOSFET transistor chips are die bonded onto metal, wire bonded to the
substrate, and coated with resin. Lines on the substrate (eventually inductors), chip capacitors, and resistors form
the bias and matching circuits. Wire leads soldered onto the alumina substrate provide the DC and RF connection.
Following conditions must be avoided:
a) Bending forces on the alumina substrate (for example, by driving screws or from fast thermal changes)
b) Mechanical stress on the wire leads (for example, by first soldering then driving screws or by thermal expansion)
c) Defluxing solvents reacting with the resin coating on the MOSFET chips (for example, Trichlorethylene)
d) Frequent on/off switching that causes thermal expansion of the resin
e) ESD, surge, overvoltage in combination with load VSWR, and oscillation
ESD:
This MOSFET module is sensitive to ESD voltages down to 1000V. Appropriate ESD precautions are required.
Mounting:
Heat sink flatness must be less than 50 µm (a heat sink that is not flat or particles between module and heat sink
may cause the ceramic substrate in the module to crack by bending forces, either immediately when driving screws
or later when thermal expansion forces are added).
A thermal compound between module and heat sink is recommended for low thermal contact resistance and to
reduce the bending stress on the ceramic substrate caused by the temperature difference to the heat sink.
The module must first be screwed to the heat sink, then the leads can be soldered to the printed circuit board.
M3 screws are recommended with a tightening torque of 0.4 to 0.6 Nm.
Soldering and Defluxing:
This module is designed for manual soldering.
The lead (terminal) must be soldered after the module is screwed onto the heat sink.
The temperature of the lead (terminal) soldering should be lower than 350°C and shorter than 3 second.
Ethyl Alcohol is recommend for removing flux. Trichloroethylene solvents must not be used (they may cause
bubbles in the coating of the transistor chips which can lift off the bond wires).
Thermal Design of the Heat Sink:
At Pout=8W, VDD=9.6V and Pin=20mW each stage transistor operating conditions are:
Pin
(W)
Pout
(W)
Rth(ch-case)
(°C/W)
IDD @ ηT=50%
VDD
(V)
Stage
(A)
1st
2nd
0.02
1.5
1.5
8.0
4.0
2.4
0.28
1.38
9.6
The channel temperatures of each stage transistor Tch = Tcase + (VDD x IDD - Pout + Pin) x Rth(ch-case) are:
Tch1 = Tcase + (9.6V x 0.28A – 1.5W + 0.02W) x 4.0°C/W
Tch2 = Tcase + (9.6V x 1.38A – 8.0W + 1.5W) x 2.4°C/W
= Tcase + 4.8 °C
= Tcase + 16.2 °C
For long-term reliability, it is best to keep the module case temperature (Tcase) below 90°C. For an ambient
temperature Tair=60°C and Pout=8W, the required thermal resistance Rth (case-air) = ( Tcase - Tair) / ( (Pout / ηT ) - Pout
+ Pin ) of the heat sink, including the contact resistance, is:
Rth(case-air) = (90°C - 60°C) / (8W/50% – 8W + 0.02W) = 3.74 °C/W
When mounting the module with the thermal resistance of 3.74 °C/W, the channel temperature of each stage
transistor is:
Tch1 = Tair + 34.8 °C
Tch2 = Tair + 46.2 °C
The 175°C maximum rating for the channel temperature ensures application under derated conditions.
RA08N1317M
24 Jan 2006
MITSUBISHI ELECTRIC
7/8
MITSUBISHI RF POWER MODULE
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
RoHS COMPLIANCE RA08N1317M
Output Power Control:
Depending on linearity, the following two methods are recommended to control the output power:
a) Non-linear FM modulation:
By the gate voltage (VGG).
When the gate voltage is close to zero, the RF input signal is attenuated up to 60 dB and only a small leakage
current flows from the battery into the drain.
Around VGG=2.5V, the output power and drain current increases substantially.
Around VGG=3V (typical) to VGG=3.5V (maximum), the nominal output power becomes available.
b) Linear AM modulation:
By RF input power Pin.
The gate voltage is used to set the drain’s quiescent current for the required linearity.
Oscillation:
To test RF characteristics, this module is put on a fixture with two bias decoupling capacitors each on gate and
drain, a 4.700 pF chip capacitor, located close to the module, and a 22 µF (or more) electrolytic capacitor.
When an amplifier circuit around this module shows oscillation, the following may be checked:
a) Do the bias decoupling capacitors have a low inductance pass to the case of the module?
b) Is the load impedance ZL=50Ω?
c) Is the source impedance ZG=50Ω?
Frequent on/off switching:
In base stations, frequent on/off switching can cause thermal expansion of the resin that coats the transistor chips
and can result in reduced or no output power. The bond wires in the resin will break after long-term thermally
induced mechanical stress.
Quality:
Mitsubishi Electric is not liable for failures resulting from base station operation time or operating conditions
exceeding those of mobile radios.
This module technology results from more than 20 years of experience, field proven in tens of millions of mobile
radios. Currently, most returned modules show failures such as ESD, substrate crack, and transistor burnout,
which are caused by improper handling or exceeding recommended operating conditions. Few degradation failures
are found.
Keep safety first in your circuit designs!
Mitsubishi Electric Corporation puts the maximum effort into making semiconductor products better and more reliable, but there
is always the possibility that trouble may occur. Trouble with semiconductors may lead to personal injury, fire or property
damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as
(i) placement of substitutive, auxiliary circuits, (ii) use of non-flammable material, or (iii) prevention against any malfunction or
mishap.
RA08N1317M
24 Jan 2006
MITSUBISHI ELECTRIC
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