MI2015HH-156.250MHZTR [MMD]

Oscillator,;
MI2015HH-156.250MHZTR
型号: MI2015HH-156.250MHZTR
厂家: MMD COMPONENTS    MMD COMPONENTS
描述:

Oscillator,

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MIH Series  
5mm X 7mm Ceramic SMD  
• Ceramic SMD Package  
• 5.0, 3.3, 2.5, and 1.8 Volt  
• HCMOS/TTL Compatible Output  
• Stability to ±10ppm  
• Tape and Reel Packaging  
Electrical Specifications  
Frequency Range  
Frequency Stability (Inclusive of Temperature, Load, Voltage and Aging)  
Operating Temperature Range  
Storage Temperature Range  
Supply Voltage (Vdd)  
Supply Current  
1.500MHz to 156.250MHz(1.8V to 80MHz)  
±100ppm to ±10ppm  
0°C - 70°C to -40°C - 85°C  
-55°C - 125°C  
±5%  
5.0Vdc, 3.3Vdc, 2.5Vdc, or 1.8Vdc  
70mA max.  
Vdd = 5V  
Vdd = 3.3V  
Vdd = 2.5V  
Vdd = 1.8V  
Logic “0”  
40mA max.  
35mA max.  
15mA max.  
Output Voltage HCMOS  
10% Vdd max.  
Logic “1”  
50% of waveform  
90% Vdd min.  
Duty Cycle  
40%/60% max. or 45%/55% max.  
10 TTL Gates or 50pF Load max.  
4nSec max.  
Load Drive Capability  
Rise / Fall Time  
Start Up Time  
Jitter  
10mSec max.  
Peak to Peak  
RMS  
150pSec max.*  
25pSec max.*  
*Please contact your MMD representative for up-to-date typical jitter information  
Specifications subject to change without notice  
www.mmdcomp.com  
Toll Free 1-877-663-2667 / Fax: 949-753-5889  
OS11  
Revision: 09/18/02 G  
Part Numbering Guide  
H
MI  
T&R  
H
Frequency  
5X7 Ceramic SMD  
Packaging*  
Frequency Stability  
100 = ±100ppm  
050 = ±50ppm  
025 = ±25ppm  
020 = ±20ppm  
015 = ±15ppm  
010 = ±10ppm**  
Operating Temperature  
Blank = 0°C to 70°C  
27 = -20°C to 70°C**  
48 = -40°C to 85°C  
Pin 1 Connection  
Supply Voltage  
Blank = 5 Volt  
3 = 3.3 Volt  
Blank = Bulk  
H = Tri-state  
T&R = Tape and Reel  
2 = 2.5 Volt  
Symmetry  
1 = 1.8 Volt  
Output  
Blank = 40%/60%  
A = 45%/55%  
H = HCMOS  
*See page VA4 for Tape Specifications  
**Not available in 2.5V and 1.8V  
Mechanical Dimensions  
1.7 max  
.067 max  
5.08 ±0.15  
.200 ±.006  
7.0 ±0.2  
.278 ±.008  
4
3
2
4
1
3
2
Markings  
1
3.68 ±0.15  
.145 ±.006  
1.4 ±0.1  
.055 ±.004  
Pad Connections  
Suggested Solder Pad Layout  
Tri-state Operation  
Logic 1 or NC = Oscillation  
2.88  
.113  
Solder Pad  
(X4)  
Logic 0 or GND = High Impedance  
Pin 1: Tri-State  
Pin 2: Ground / Case  
Pin 3: Output  
Pin 4: Supply Voltage  
2.2  
.087  
Environmental / Mechanical  
Markings  
Shock: MIL-STD-883, Method 2002, Condition B  
Solderability: MIL-STD-883, Method 2003  
Solvent Resistance: MIL-STD-202, Method 215  
Vibration: MIL-STD-883, Method 2007, Condition A  
Gross Leak Test: MIL-STD-883, Method 1014, Condition C  
Fine Leak Test: MIL-STD-883, Method 1014, Condition A2  
Line 1: MMD “Date Code”  
Line 2: Frequency  
www.mmdcomp.com  
Toll Free 1-877-663-2667 / Fax: 949-753-5889  
Specifications subject to change without notice  
OS11  
Revision: 09/18/02 G  

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