0015800203_17 [MOLEX1]

2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical,;
0015800203_17
元器件型号: 0015800203_17
生产厂家: Molex Electronics Ltd.    Molex Electronics Ltd.
描述和应用:

2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical,

PDF文件: 总2页 (文件大小:33K)
下载文档:  下载PDF数据表文档文件
型号参数:0015800203_17参数

0015800205

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

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8 MOLEX

0015800205_17

2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical,

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0 MOLEX1

0015800207

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, Tin (Sn) Plating

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14 MOLEX

0015800207_17

2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical,

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0 MOLEX1

0015800209

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating

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11 MOLEX

0015800209_17

2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical,

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0 MOLEX1

0015800221

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 22 Circuits, Tin (Sn) Plating

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10 MOLEX

0015800221_17

2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row

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-
0 MOLEX1

0015800223

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 22 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating,

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19 MOLEX

0015800225

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 22 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

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20 MOLEX

0015800225_17

2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical

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-
0 MOLEX1

0015800229

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 22 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating

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-
10 MOLEX

0015800229_17

2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical,

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-
0 MOLEX1

0015800241

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 24 Circuits, Tin (Sn) Plating

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13 MOLEX

0015800241_17

2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical

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0 MOLEX1